EL5263IY

DATASHEET EL5162, EL5163, EL5262, EL5263, EL5362 FN7388 Rev 1.00 August 26, 2015 500MHz Low Power Current Feedback Amplifiers with Enable The EL5162, EL5163, EL5262, EL5263 and EL5362 are current feedback amplifiers with a bandwidth of 500MHz. This makes these amplifiers ideal for today’s high speed video and monitor applications. Features With a supply current of just 1.5mA per amplifier and the ability to run from a single supply voltage from 5V to 12V, these amplifiers are also ideal for handheld, portable or battery-powered equipment. • 1.5mA supply current per amplifier The EL5162, EL5262 and EL5362 also incorporate an enable and disable function to reduce the supply current to 14µA typical per amplifier. Allowing the CE pin to float or applying a low logic level enables the amplifier. The EL5162 is available in 6 Ld SOT-23 and 8 Ld SOIC packages, the EL5163 in 5 Ld SOT-23 and SC-70 packages, the EL5262 in the 10 Ld MSOP package, the EL5263 in 8 Ld MSOP and SOIC packages, and the EL5362 in 16 Ld SOIC (0.150”) and QSOP packages. All operate over the industrial temperature range of -40°C to +85°C. • 500MHz -3dB bandwidth • 4000V/µs slew rate (EL5162 and EL5163) • Single and dual supply operation, from 5V to 12V supply span • Fast enable/disable (EL5162, EL5262 and EL5362 only) • Available in SOT-23 packages • Pb-free (RoHS compliant) • High speed, 1.4GHz product available (EL5166 and EL5167) • High speed, 4mA, 600MHz product available (EL5164, EL5165 and EL5364) Applications • Battery-powered equipment • Handheld portable devices • Video amplifiers • Cable drivers • RGB amplifiers • Test equipment • Instrumentation • Current to voltage converters FN7388 Rev 1.00 August 26, 2015 Page 1 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Ordering Information PART NUMBER (Notes 2, 3) PART MARKING PACKAGE (RoHS Compliant) PKG. DWG. # EL5162ISZ 5162ISZ 8 Ld SOIC (150mil) M8.15E EL5162ISZ-T7 (Note 1) 5162ISZ 8 Ld SOIC (150mil) M8.15E EL5162ISZ-T13 (Note 1) 5162ISZ 8 Ld SOIC (150mil) M8.15E EL5162ISZ-T7A 5162ISZ 8 Ld SOIC (150mil) M8.15E EL5162IWZ-T7 (Note 1) (No longer available, recommended replacement: EL5163IWZ-T7) BAKA (Note 4) 6 Ld SOT-23 P6.064A EL5162IWZ-T7A (Note 1) (No longer available, recommended replacement: EL5163IWZ-T7A) BAKA (Note 4) 6 Ld SOT-23 P6.064A EL5163IWZ-T7 (Note 1) BALA (Note 4) 5 Ld SOT-23 P5.064A EL5163IWZ-T7A (Note 1) BALA (Note 4) 5 Ld SOT-23 P5.064A EL5163ICZ-T7 (Note 1) (No longer available, recommended replacement: EL5163IWZ-T7) BDA (Note 4) 5 Ld SC-70 (1.25mm) P5.049 EL5163ICZ-T7A (Note 1) (No longer available, recommended replacement: EL5163IWZ-T7) BDA (Note 4) 5 Ld SC-70 (1.25mm) P5.049 EL5262IYZ BBTAA 10 Ld MSOP (3.0mm) M10.118A EL5262IYZ-T7 (Note 1) BBTAA 10 Ld MSOP (3.0mm) M10.118A EL5262IYZ-T13 (Note 1) BBTAA 10 Ld MSOP (3.0mm) M10.118A EL5263ISZ 5263ISZ 8 Ld SOIC (150mil) M8.15E EL5263ISZ-T7 (Note 1) 5263ISZ 8 Ld SOIC (150mil) M8.15E EL5263ISZ-T13 (Note 1) 5263ISZ 8 Ld SOIC (150mil) M8.15E EL5263IYZ BBBJA 8 Ld MSOP (3.0mm) M8.118A EL5263IYZ-T7 (Note 1) BBBJA 8 Ld MSOP (3.0mm) M8.118A EL5263IYZ-T13 (Note 1) BBBJA 8 Ld MSOP (3.0mm) M8.118A EL5362ISZ EL5362ISZ 16 Ld SOIC (150mil) MDP0027 EL5362ISZ-T7 (Note 1) EL5362ISZ 16 Ld SOIC (150mil) MDP0027 EL5362ISZ-T13 (Note 1) EL5362ISZ 16 Ld SOIC (150mil) MDP0027 EL5362IUZ 5362IUZ 16 Ld QSOP MDP0040 EL5362IUZ-T7 (Note 1) 5362IUZ 16 Ld QSOP MDP0040 EL5362IUZ-T13 (Note 1) 5362IUZ 16 Ld QSOP MDP0040 NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see product information page for EL5162, EL5163, EL5262, EL5263, EL5362. For more information on MSL, please see tech brief TB363. 4. The part marking is located on the bottom of the part. FN7388 Rev 1.00 August 26, 2015 Page 2 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Pin Configurations NC 1 IN- 2 + IN+ 3 VS- 4 8 CE OUT 1 7 VS+ VS- 2 6 OUT IN+ 3 OUT 1 IN+ 3 + - 6 VS+ OUT 1 5 CE VS- 2 4 IN- IN+ 3 5 VS+ + - 4 IN- 5 NC EL5263 (8 LD SOIC, MSOP) TOP VIEW EL5262 (10 LD MSOP) TOP VIEW IN- 2 EL5163 (5 LD SOT-23, SC-70) TOP VIEW EL5162 (6 LD SOT-23) TOP VIEW EL5162 (8 LD SOIC) TOP VIEW 10 VS+ + VS- 4 CE 5 + OUT1 1 9 OUT IN- 2 8 IN- IN+ 3 7 IN+ 6 CE VS- 4 8 VS+ 7 OUT2 + + 6 IN5 IN+ EL5362 (16 LD SOIC, QSOP) TOP VIEW INA+ 1 CEA 2 16 INA+ VS- 3 CEB 4 14 VS+ + - INB+ 5 INC+ 8 FN7388 Rev 1.00 August 26, 2015 13 OUTB 12 INB- NC 6 CEC 7 15 OUTA 11 NC + - 10 OUTC 9 INC- Page 3 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Absolute Maximum Ratings (TA = +25°C) Thermal Information Supply Voltage between VS+ and VS-. . . . . . . . . . . . . . . . . . . . . . . . . . 13.2V Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Maximum Slew Rate of VS+ to VS- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/µs Maximum Voltage between IN+ and IN-, disabled . . . . . . . . . . . . . . . ±1.5V Current into IN+, IN-, CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5mA Pin Voltages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VS-) -0.5V to (VS+) +0.5V Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Ambient Operating Temperature Range . . . . . . . . . . . . . . -40°C to +85°C Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . . +125°C Maximum Power Dissipation . . . . . . . . . . . . . . . . . . See Curves on page 8 Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. Electrical Specifications VS+ = +5V, VS- = -5V, RF = 750Ω for AV = 1, RF = 400Ω for AV = 2, RL = 150Ω, CE = 0V, TA = +25°C unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +85°C. PARAMETER DESCRIPTION TEST CONDITIONS MIN (Note 6) TYP MAX (Note 6) UNIT AC PERFORMANCE BW -3dB Bandwidth BW1 0.1dB Bandwidth SR Slew Rate tS 0.1% Settling Time eN AV = +1, RL = 500ΩRF = 598Ω 500 MHz AV = +2, RL = 150ΩRF = 422Ω 233 MHz 30 MHz VO = -2.5V to +2.5V, AV = +2, RL = 100Ω (EL5262, EL5263, EL5362) 2000 2500 4000 V/µs VO = -2.5V to +2.5V, AV = +2, RL = 100Ω (EL5162, EL5163) 2800 4000 6000 V/µs VOUT = -2.5V to +2.5V, AV = +1 25 ns Input Voltage Noise 3 nV/Hz iN- IN- Input Current Noise 10 pA/Hz iN+ IN+ Input Current Noise 6.5 pA/Hz dG Differential Gain Error (Note 5) AV = +2 0.05 % dP Differential Phase Error (Note 5) AV = +2 0.15 ° DC PERFORMANCE VOS Offset Voltage TCVOS Input Offset Voltage Temperature Coefficient ROL Open Loop Transimpedance Gain -5 Measured from TMIN to TMAX 1.5 +5 mV 6 µV/°C 500 1000 kΩ V INPUT CHARACTERISTICS CMIR Common Mode Input Range Guaranteed by CMRR test ±3 ±3.3 CMRR Common Mode Rejection Ratio VIN = ±3V 50 62 -ICMR - Input Current Common Mode Rejection -1 +IIN + Input Current -8 -IIN - Input Current RIN Input Resistance CIN Input Capacitance FN7388 Rev 1.00 August 26, 2015 75 dB 0.22 +1 µA/V 0.5 +8 µA -10 2 +10 µA 0.8 1.6 3 MΩ 1 pF Page 4 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Electrical Specifications VS+ = +5V, VS- = -5V, RF = 750Ω for AV = 1, RF = 400Ω for AV = 2, RL = 150Ω, CE = 0V, TA = +25°C unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +85°C. (Continued) MIN (Note 6) TYP MAX (Note 6) UNIT RL = 150Ω to GND ±3.35 ±3.6 ±3.75 V RL = 1kΩ to GND ±3.75 ±3.9 ±4.15 V Output Current RL = 10Ω to GND 60 100 ISON Supply Current - Enabled, per Amplifier No load, VIN = 0V 1.3 1.5 2.0 mA ISOFF- Supply Current - Disabled, per Amplifier No load, VIN = 0V (EL5162, EL5262, EL5362 Only) -25 -14 0 µA 0 10 +25 µA PSRR Power Supply Rejection Ratio DC, VS = ±4.75V to ±5.25V 65 76 -IPSR - Input Current Power Supply Rejection DC, VS = ±4.75V to ±5.25V -0.5 0.1 PARAMETER DESCRIPTION TEST CONDITIONS OUTPUT CHARACTERISTICS VO IOUT Output Voltage Swing mA SUPPLY ISOFF+ dB +0.5 µA/V ENABLE (EL5162, EL5262, EL5362 ONLY) tEN Enable Time 380 ns tDIS Disable Time 800 ns IIHCE CE Pin Input High Current CE = VS+ 1 5 25 µA IILCE CE Pin Input Low Current CE = (VS+) -5V -1 0 +1 µA VIHCE CE Input High Voltage for Power-down VILCE CE Input Low Voltage for Power-up (VS+) - 1 V (VS+) - 3 V NOTES: 5. Standard NTSC test, AC signal amplitude = 286mVP-P, f = 3.58MHz. 6. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. FN7388 Rev 1.00 August 26, 2015 Page 5 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Typical Performance Curves NORMALIZED GAIN (dB) +3 +2 +1 +4 VS+ = +5V VS- = -5V RL = 500Ω RF = 598Ω +3 +2 NORMALIZED GAIN (dB) +4 0 -1 -2 -3 -4 VS+ = +5V VS-= -5V RF = 375Ω +1 0 -1 -2 -3 -4 -5 -5 -6 100k 1M 10M 100M -6 100k 1G 1M FREQUENCY (Hz) +2 +3 +1 +2 0 -1 -2 -3 -4 -5 -6 -7 VS+= +5V VS- = -5V AV = +10 RL = 150Ω RF = 375Ω -8 100k +1 0 -1 -2 -3 -4 -5 -6 1M 10M 100M VS+ = +5V VS- = -5V RL = 150Ω RF = 422Ω -7 100k 1G 1M FREQUENCY (Hz) +4 +1 +3 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) +5 +2 0 -1 -2 -3 -6 VS+ = +5V VS- = -5V RL = 150Ω RF = 422Ω -7 100k 1M 10M 1G AV = +1 RL = 150Ω RF = 698Ω +2 ±6V +1 0 -1 VS+, VS- = 100M FREQUENCY (Hz) 1G ±5V ±4V -2 ±3V ±2.5V -3 -4 FIGURE 5. FREQUENCY RESPONSE FOR AV = +4 FN7388 Rev 1.00 August 26, 2015 100M FIGURE 4. FREQUENCY RESPONSE FOR AV = +2 +3 -5 10M FREQUENCY (Hz) FIGURE 3. FREQUENCY RESPONSE FOR AV = +10 -4 1G FIGURE 2. FREQUENCY RESPONSE FOR AV = +4.6 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) FIGURE 1. FREQUENCY RESPONSE FOR AV = +1 10M 100M FREQUENCY (Hz) -5 100k 1M 10M 100M 500M FREQUENCY (Hz) FIGURE 6. FREQUENCY RESPONSE FOR VARIOUS ±VS Page 6 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Typical Performance Curves (Continued) OUTPUT IMPEDANCE (Ω) 100 VS+ = +5V VS- = -5V AV = +2 VS+= +5V VS- = -5V AV = +2 RL = 150Ω 10 1 1V/DIV INPUT RISE TIME 1.028ns OUTPUT RISE TIME 2.218ns 2V/DIV 0.1 10k 100k 1M 10M 100M 4ns/DIV FREQUENCY (Hz) FIGURE 7. CLOSED LOOP OUTPUT IMPEDANCE vs FREQUENCY 1V/DIV INPUT FALL TIME 1.036ns OUTPUT FALL TIME 2.21ns FIGURE 8. EL5262 OUTPUT RISE TIME VS+ = +5V VS- = -5V AV = +2 RL = 150Ω CE 2V/DIV VOUT CE = 5V / DIV VOUT = 200mV / DIV M = 100ns 4ns/DIV 100ns/DIV FIGURE 9. EL5262 OUTPUT FALL TIME FIGURE 10. TURN ON TIME (EL5162, EL5262, EL5362) CE CE = 5V / DIV VOUT = 200mV / DIV M = 100ns PSRR (dB) 0 VS+ = +5V -10 V = -5V S-20 AV = +2 RL = 150Ω -30 -40 -50 -60 -70 -80 VOUT -90 -100 100 100ns/DIV FIGURE 11. TURN OFF TIME (EL5162, EL5262, EL5362) FN7388 Rev 1.00 August 26, 2015 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) FIGURE 12. PSRR (VS+) vs FREQUENCY Page 7 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Typical Performance Curves (Continued) 0 1.4 POWER DISSIPATION (W) PSRR (dB) VS+ = +5V -10 VS- = -5V -20 AV = +2 RL = 150Ω -30 -40 -50 -60 -70 -80 -90 -100 100 1k 10k 100k 1M 10M 1.2 1.250W 0.8 909mW 0.6 SO8 JA = +110°C/W 0.4 0.2 0 25 FREQUENCY (Hz) 0.50 0.8 QSOP16 JA = +112°C/W 0.6 0.4 0.2 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.40 0.35 SOT23-5/6 JA = +230°C/W 0.30 0.25 0.20 0.15 0.10 0 25 75 85 100 50 125 0 150 0 25 1.0 0.9 870mW 125 150 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD POWER DISSIPATION (W) 0.9 0.8 MSOP8/10 JA = +115°C/W 0.6 75 85 100 FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.7 50 AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C) POWER DISSIPATION (W) 150 0.05 FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 0.5 0.4 0.3 0.2 909mW 0.8 SO16 (0.15 0”) JA = +110°C/W 0.7 0.6 625mW 0.5 0.4 SO8 JA = +160°C/W 0.3 0.2 0.1 0.1 0 125 0.45 435mW POWER DISSIPATION (W) POWER DISSIPATION (W) JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1.0 893mW 1.0 75 85 100 FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 1.2 0 50 AMBIENT TEMPERATURE (°C) FIGURE 13. PSRR (VS-) vs FREQUENCY 1.4 SO16 (0.150”) JA = +80°C/W 1.0 0 100M JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0 25 50 75 85 100 125 AMBIENT TEMPERATURE (°C) FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN7388 Rev 1.00 August 26, 2015 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Page 8 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Typical Performance Curves JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.45 1.0 POWER DISSIPATION (W) POWER DISSIPATION (W) 1.2 (Continued) 0.8 633mW QSOP16 JA = +158°C/W 0.6 0.4 0.2 0 0 25 50 75 85 100 391mW 0.40 0.35 0.30 SOT23-5/6 JA = +256°C/W 0.25 0.20 0.15 0.10 0.05 0 150 125 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0 25 AMBIENT TEMPERATURE (°C) FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 0.6 POWER DISSIPATION (W) 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 486mW 0.5 MSOP8/10 JA = +206°C/W 0.4 0.3 0.2 0.1 0 0 25 50 75 85 100 125 AMBIENT TEMPERATURE (°C) FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN7388 Rev 1.00 August 26, 2015 Page 9 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE August 26, 2015 FN7388.13 Updated the Ordering Information table on page 2. April 6, 2015 FN7388.12 Added Note 4 to the Ordering Information table on page 2. Added Revision History and About Intersil. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support © Copyright Intersil Americas LLC 2004-2015. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN7388 Rev 1.00 August 26, 2015 Page 10 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Package Outline Drawing M8.15E 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 0, 08/09 4 4.90 ± 0.10 A DETAIL "A" 0.22 ± 0.03 B 6.0 ± 0.20 3.90 ± 0.10 4 PIN NO.1 ID MARK 5 (0.35) x 45° 4° ± 4° 0.43 ± 0.076 1.27 0.25 M C A B SIDE VIEW “B” TOP VIEW 1.75 MAX 1.45 ± 0.1 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.175 ± 0.075 SIDE VIEW “A 0.63 ±0.23 DETAIL "A" (1.27) (0.60) NOTES: (1.50) (5.40) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 identifier may be either a mold or mark feature. 6. Reference to JEDEC MS-012. TYPICAL RECOMMENDED LAND PATTERN FN7388 Rev 1.00 August 26, 2015 Page 11 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Package Outline Drawing P6.064A 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 0, 2/10 1.90 0-3° 0.95 D 0.08-0.20 A 5 6 4 PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 1 (0.60) 3 2 0.20 C 2x 0.40 ±0.05 B 5 SEE DETAIL X 3 0.20 M C A-B D TOP VIEW 2.90 5 END VIEW 10° TYP (2 PLCS) 0.15 C A-B 2x H 1.14 ±0.15 C SIDE VIEW 0.10 C 0.05-0.15 1.45 MAX SEATING PLANE DETAIL "X" (0.25) GAUGE PLANE 0.45±0.1 4 (0.60) (1.20) NOTES: (2.40) (0.95) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. This dimension is measured at Datum “H”. 6. Package conforms to JEDEC MO-178AA. (1.90) TYPICAL RECOMMENDED LAND PATTERN FN7388 Rev 1.00 August 26, 2015 Page 12 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Package Outline Drawing P5.064A 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 0, 2/10 1.90 0-3° D A 0.08-0.20 5 4 PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 2 5 (0.60) 0.20 C 2x 0.95 SEE DETAIL X B 0.40 ±0.05 3 END VIEW 0.20 M C A-B D TOP VIEW 10° TYP (2 PLCS) 2.90 5 H 0.15 C A-B 2x C 1.45 MAX 1.14 ±0.15 0.10 C SIDE VIEW SEATING PLANE (0.25) GAUGE PLANE 0.45±0.1 0.05-0.15 4 DETAIL "X" (0.60) (1.20) NOTES: (2.40) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. This dimension is measured at Datum “H”. 6. Package conforms to JEDEC MO-178AA. (0.95) (1.90) TYPICAL RECOMMENDED LAND PATTERN FN7388 Rev 1.00 August 26, 2015 Page 13 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Package Outline Drawing M10.118A (JEDEC MO-187-BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP) Rev 0, 9/09 3.0 ± 0.1 A 0.25 10 DETAIL "X" CAB 0.18 ± 0.05 SIDE VIEW 2 4.9 ± 0.15 3.0 ± 0.1 1.10 Max B PIN# 1 ID 1 2 0.95 BSC 0.5 BSC TOP VIEW Gauge Plane 0.86 ± 0.09 H 0.25 C 3°±3° SEATING PLANE 0.10 ± 0.05 0.23 +0.07/ -0.08 0.08 C A B 0.55 ± 0.15 0.10 C DETAIL "X" SIDE VIEW 1 5.80 4.40 3.00 NOTES: 0.50 0.30 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. Plastic interlead protrusions of 0.25mm max per side are not included. 4. 1.40 5. Dimensions “D” and “E1” are measured at Datum Plane “H”. TYPICAL RECOMMENDED LAND PATTERN 6. This replaces existing drawing # MDP0043 MSOP10L. FN7388 Rev 1.00 August 26, 2015 Page 14 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Package Outline Drawing M8.118A 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP) Rev 0, 9/09 3.0±0.1 8 A 0.25 CAB 3.0±0.1 4.9±0.15 DETAIL "X" 1.10 Max PIN# 1 ID B SIDE VIEW 2 1 0.18 ± 0.05 2 0.65 BSC TOP VIEW 0.95 BSC 0.86±0.09 H GAUGE PLANE C 0.25 SEATING PLANE 0.33 +0.07/ -0.08 0.08 C A B 0.10 ± 0.05 3°±3° 0.10 C 0.55 ± 0.15 DETAIL "X" SIDE VIEW 1 5.80 NOTES: 4.40 3.00 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSE Y14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.25mm max per side are not included. 5. Dimensions “D” and “E1” are measured at Datum Plane “H”. 6. This replaces existing drawing # MDP0043 MSOP 8L. 0.65 0.40 1.40 TYPICAL RECOMMENDED LAND PATTERN FN7388 Rev 1.00 August 26, 2015 Page 15 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Small Outline Package Family (SO) A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) INCHES SYMBOL SO-8 SO-14 SO16 (0.150”) SO16 (0.300”) (SOL-16) SO20 (SOL-20) SO24 (SOL-24) SO28 (SOL-28) TOLERANCE NOTES A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX - A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 0.003 - A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 0.001 - D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 0.008 - E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic - L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 0.009 - L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference - 16 20 24 28 Reference - N 8 14 16 NOTES: Rev. M 2/07 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994 FN7388 Rev 1.00 August 26, 2015 Page 16 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Small Outline Transistor Plastic Packages (SC70-5) P5.049 D 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE VIEW C e1 INCHES 5 4 E CL 1 2 CL 3 e E1 b CL 0.20 (0.008) M C C CL A A2 SEATING PLANE A1 -C- 0.10 (0.004) C SYMBOL MIN MAX MIN MAX NOTES A 0.031 0.043 0.80 1.10 - A1 0.000 0.004 0.00 0.10 - A2 0.031 0.039 0.80 1.00 - b 0.006 0.012 0.15 0.30 b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 D 0.073 0.085 1.85 2.15 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 e e1 L WITH PLATING b1 0.0256 Ref 0.0512 Ref 0.010 c1 0.018 - 1.30 Ref 0.26 - 0.46 0.017 Ref. 0.420 Ref. L2 0.006 BSC 0.15 BSC 0o N c 0.65 Ref L1  b MILLIMETERS 8o 0o 5 4 - 8o - 5 5 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 Rev. 3 7/07 NOTES: BASE METAL 1. Dimensioning and tolerances per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO-203AA. 4X 1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1  L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 4X 1 VIEW C 0.4mm 0.75mm 2.1mm 0.65mm TYPICAL RECOMMENDED LAND PATTERN FN7388 Rev 1.00 August 26, 2015 Page 17 of 18 EL5162, EL5163, EL5262, EL5263, EL5362 Quarter Size Outline Plastic Packages Family (QSOP) MDP0040 A QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY D (N/2)+1 N E INCHES PIN #1 I.D. MARK E1 1 (N/2) B 0.010 C A B e H C SEATING PLANE 0.007 0.004 C b C A B SYMBOL QSOP16 QSOP24 QSOP28 TOLERANCE NOTES A 0.068 0.068 0.068 Max. - A1 0.006 0.006 0.006 ±0.002 - A2 0.056 0.056 0.056 ±0.004 - b 0.010 0.010 0.010 ±0.002 - c 0.008 0.008 0.008 ±0.001 - D 0.193 0.341 0.390 ±0.004 1, 3 E 0.236 0.236 0.236 ±0.008 - E1 0.154 0.154 0.154 ±0.004 2, 3 e 0.025 0.025 0.025 Basic - L 0.025 0.025 0.025 ±0.009 - L1 0.041 0.041 0.041 Basic - N 16 24 28 Reference Rev. F 2/07 NOTES: L1 A 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. c SEE DETAIL "X" 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 0.010 A2 GAUGE PLANE L A1 4°±4° DETAIL X FN7388 Rev 1.00 August 26, 2015 Page 18 of 18