REJ09B0327-0400
The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text.
16
H8S/2148 Group, H8S/2144 Group, H8S/2148F-ZTAT™, H8S/2147N F-ZTAT™, H8S/2144F-ZTAT™, H8S/2142F-ZTAT™
Hardware Manual Renesas 16-Bit Single-Chip Microcomputer H8S Family/H8S/2100 Series
H8S/2148 HD6432148S HD6432148SW HD64F2148 HD64F2148V HD64F2148A HD64F2148AV HD6432147S HD6432147SW HD64F2147A HD64F2147AV H8S/2147N HD64F2147N HD64F2147NV H8S/2144 HD6432144S HD64F2144 HD64F2144V HD64F2144A HD64F2144AV H8S/2143 HD6432143S H8S/2142 HD6432142 HD64F2142R HD64F2142RV
H8S/2147
Rev. 4.00 Revision Date: Sep 27, 2006
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Rev. 4.00 Sep 27, 2006 page ii of xliv
General Precautions on Handling of Product
1. Treatment of NC Pins Note: Do not connect anything to the NC pins. The NC (not connected) pins are either not connected to any of the internal circuitry or are used as test pins or to reduce noise. If something is connected to the NC pins, the operation of the LSI is not guaranteed. 2. Treatment of Unused Input Pins Note: Fix all unused input pins to high or low level. Generally, the input pins of CMOS products are high-impedance input pins. If unused pins are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur. 3. Processing before Initialization Note: When power is first supplied, the product’s state is undefined. The states of internal circuits are undefined until full power is supplied throughout the chip and a low level is input on the reset pin. During the period where the states are undefined, the register settings and the output state of each pin are also undefined. Design your system so that it does not malfunction because of processing while it is in this undefined state. For those products which have a reset function, reset the LSI immediately after the power supply has been turned on. 4. Prohibition of Access to Undefined or Reserved Addresses Note: Access to undefined or reserved addresses is prohibited. The undefined or reserved addresses may be used to expand functions, or test registers may have been be allocated to these addresses. Do not access these registers; the system’s operation is not guaranteed if they are accessed.
Rev. 4.00 Sep 27, 2006 page iii of xliv
Rev. 4.00 Sep 27, 2006 page iv of xliv
Preface
The H8S/2148 Group, H8S/2144 Group, and H8S/2147N comprise high-performance microcomputers with a 32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system configuration. The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen internal 16-bit general registers with a 32-bit configuration, and a concise and optimized instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes). Programs based on the high-level language C can also be run efficiently. Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently changing specifications. On-chip peripheral functions include a 16-bit free-running timer (FRT), 8-bit timer (TMR), watchdog timer (WDT), two PWM timers (PWM and PWMX), a serial communication interface (SCI, IrDA), PS/2-compatible keyboard buffer controller, host interface (HIF), D/A converter 2 (DAC), A/D converter (ADC), and I/O ports. An I C bus interface (IIC) can also be incorporated as an option. An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer without CPU intervention. The H8S/2148 Group has all the above on-chip supporting functions, and can also be provided with an IIC module as an option. The H8S/2144 Group comprises reduced-function versions, with fewer TMR channels, and no PWM, keyboard buffer controller, HIF, IIC, or DTC modules, and the H8S/2147N with fewer TMR channels, no DTC and some other functions. Use of the H8S/2148 Group, H8S/2144 Group, H8S/2147N enables compact, high-performance systems to be implemented easily. The comprehensive PC-related interface functions and 16 × 8 matrix key-scan functions are ideal for applications such as notebook PC keyboard control and intelligent battery and power supply control, while the various timer functions and their 2 interconnectability (timer connection), plus the interlinked operation of the I C bus interface and data transfer controller (DTC), in particular, make these devices ideal for use in PC monitors. In addition, the combination of F-ZTAT™* and reduced-function versions is ideal for applications such as CD-ROM drive units in which on-chip program memory is essential to meet performance requirements, product start-up times are short, and program modifications may be necessary after end-product assembly.
Rev. 4.00 Sep 27, 2006 page v of xliv
This manual describes the hardware of the H8S/2148 Group, H8S/2144 Group, and H8S/2147N. Refer to the H8S/2600 Series and H8S/2000 Series Software Manual for a detailed description of the instruction set. Note: * F-ZTAT (Flexible-ZTAT) is a trademark of Renesas Technology Corp. On-Chip Supporting Modules
Group Product names H8S/2148 Group H8S/2148, H8S/2147 H8S/2147N H8S/2147N H8S/2144 Group H8S/2144, H8S/2143, H8S/2142 — — ×2 ×1 ×3 — ×2 ×3 — — — ×2 ×8 ×16
Bus controller (BSC) Data transfer controller (DTC) 8-bit PWM timer (PWM) 14-bit PWM timer (PWMX) 16-bit free-running timer (FRT) 8-bit timer (TMR) Timer connection Watchdog timer (WDT) Serial communication interface (SCI) I C bus interface (IIC) Keyboard buffer controller (PS/2 compatible) Host interface (HIF) D/A converter A/D converter Analog inputs
2
Available (16 bits) Available (16 bits) Available (16 bits) Available ×16 ×2 ×1 ×4 Available ×2 ×3 ×2 (option) ×3 ×4 ×2 ×8 — ×16 ×2 ×1 ×3 — ×2 ×3 ×2 (option) ×3 ×4 ×2 ×8 ×16
Expansion A/D inputs ×16
Rev. 4.00 Sep 27, 2006 page vi of xliv
Main Revisions for This Edition
Item All Page — Revision (See Manual for Details) • Notification of change in company name amended (Before) Hitachi, Ltd. → (After) Renesas Technology Corp. • Product naming convention amended (Before) H8S/2148 Series → (After) H8S/2148 Group (Before) H8S/2144 Series → (After) H8S/2144 Group 1.1 Overview Table 1.1 Overview 6 4 Host interface specification in table 1.1 amended • 8-bit host interface (ISA) port Product lineup specification in table 1.1 amended
Product Code*2 Group H8S/2148 Mask ROM Versions HD6432148S HD6432148SW*1 HD6432147S HD6432147SW*1 H8S/2147N H8S/2144 — HD6432144S F-ZTAT Versions HD64F2148 HD64F2148V*2 HD64F2148A HD64F2148AV*2 HD64F2147A HD64F2147AV*2 HD64F2147N HD64F2147NV*2 HD64F2144 HD64F2144V*2 HD64F2144A HD64F2144AV*2 HD6432143S HD6432142
2
ROM/RAM (Bytes) 128 k/4 k
Packages FP-100B, TFP-100B
64 k/2 k
64 k/2 k 128 k/4 k
— HD64F2142R HD64F2142RV*2
96 k/4 k 64 k/2 k
Notes: 1. W indicates the I C bus option. 2. V indicates the 3-V version. Please refer to appendix F, Product Code Lineup.
1.2 Internal Block Diagram Figure 1.1 (a) Internal Block Diagram of H8S/2148 Group Figure 1.1 (b) Internal Block Diagram of H8S/2147N
7
Figure 1.1 (a) amended (Before) STBY → (After) STBY
8
Figure 1.1 (b) amended (Before) IIC × 2ch → (After) IIC × 2ch (option)
Rev. 4.00 Sep 27, 2006 page vii of xliv
Item 1.3.2 Pin Functions in Each Operating Mode Table 1.2 (a) Pin Functions in Each Operating Mode Table 1.2 (b) H8S/2147N Pin Functions in Each Operating Mode 1.3.3 Pin Functions Table 1.3 Pin Functions
Page 14
Revision (See Manual for Details) Mode 1 description of pin 35 amended (Before) P67/TMOX/CIN/KIN7/IRQ7 → (After) P67/TMOX/CIN7/KIN7/IRQ7
17 19 21 30
Modes 2 and 3 in single chip modes of pin 95 amended (Before) P82 → (After) P82/HIFSD Mode 1 description of pin 35 amended (Before) P67/CIN/KIN7/IRQ7 → (After) P67/CIN7/KIN7/IRQ7 Modes 2 and 3 in single chip modes of pin 95 amended (Before) P82 → (After) P82/HIFSD Table 1.3 amended
Pin No. Type Host interface (HIF) Symbol HIRQ11 HIRQ1 HIRQ12 HIRQ3 HIRQ4 FP-100B TFP-100B 52 53 54 91 90 Pin No. Type I/O ports Symbol PA7 to PA0 FP-100B TFP-100B 10, 11, 20, 21, 30, 31, 47, 48 I/O Input/ output Name and Function Port A: Eight input/output pins. The data direction of each pin can be selected in the port A data direction register (PADDR). These pins have built-in MOS input pull-ups. These are the VCCB drive pins. [H8S/2148 Group and H8S/2147N only] I/O Name and Function
Output Host interrupt 11, 1, 12, 3, and 4: Output pins for interrupt requests to the host.
33
2.6.1 Overview Table 2.1 Instruction Classification
52
Instruction in arithmetic operations amended (Before) EG → (After) NEG Bit 3 bit table amended
Bit 3 FLSHE 0 1 Description Addresses H'(FF)FF80 to H'(FF)FF87 are used for power-down mode control register and supporting module control register access (Initial value) Addresses H'(FF)FF80 to H'(FF)FF87 are used for flash memory control register access (F-ZTAT version only)
3.2.4 Serial Timer 89 Control Register (STCR)
4.5 Stack Status after Exception Handling Figure 4.5 (2) Stack Status after Exception Handling (Advanced Mode)
111
Note * deleted from figure 4.5 (2)
Rev. 4.00 Sep 27, 2006 page viii of xliv
Item 5.2.8 Address Break Control Register (ABRKCR) 5.5.3 Interrupt control Mode 1 Figure 5.9 Example of State Transitions in Interrupt control Mode 1 8.1 Overview Table 8.1 H8S/2148 Group Port Functions
Page 124
Revision (See Manual for Details) Read/Write description amended Bit 7 (Before) R/W → (After) R
140
Figure 5.9 amended (Before) Only NMI interrupts enabled and address break → (After) Only NMI interrupts and address break enabled
213
Table 8.1 amended
Expanded Modes Port Port A Description Pins Mode 1 I/O port also functioning as key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC) Mode 2, Mode 3 (EXPE = 1) I/O port also functioning as address output (A23 to A16), key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/ output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC) Single-Chip Mode Mode 2, Mode 3 (EXPE = 0) I/O port also functioning as key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC)
• 8-bit I/O port PA7/A23/KIN15/ CIN15/PS2CD PA6/A22/KIN14/ CIN14/PS2CC PA5/A21/KIN13/ CIN13/PS2BD PA4/A20/KIN12/ CIN12/PS2BC PA3/A19/KIN11/ CIN11/PS2AD PA2/A18/KIN10/ CIN10/PS2AC PA1/A17/KIN9/ CIN9 PA0/A16/KIN8/ CIN8
Table 8.2 H8S/2147N Port Functions
216
Table 8.2 amended
Expanded Modes Port Port A Description Pins Mode 1 I/O port also functioning as key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC) Mode 2, Mode 3 (EXPE = 1) I/O port also functioning as address output (A23 to A16), key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/ output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC) Single-Chip Mode Mode 2, Mode 3 (EXPE = 0) I/O port also functioning as key-sense interrupt input (KIN15 to KIN8), expansion A/D converter input (CIN15 to CIN8), and keyboard buffer controller input/output (PS2CD, PS2CC, PS2BD, PS2BC, PS2AD, PS2AC)
• 8-bit I/O port PA7/A23/KIN15/ CIN15/PS2CD PA6/A22/KIN14/ CIN14/PS2CC PA5/A21/KIN13/ CIN13/PS2BD PA4/A20/KIN12/ CIN12/PS2BC PA3/A19/KIN11/ CIN11/PS2AD PA2/A18/KIN10/ CIN10/PS2AC PA1/A17/KIN9/ CIN9 PA0/A16/KIN8/ CIN8
Rev. 4.00 Sep 27, 2006 page ix of xliv
Item 8.1 Overview Table 8.3 H8S/2144 Port Functions
Page 220
Revision (See Manual for Details) Table 8.3 amended
Expanded Modes Port Port A Description Pins Mode 1 I/O port also functioning as key-sense interrupt input (KIN15 to KIN8), and expansion A/D converter input (CIN15 to CIN8) Mode 2, Mode 3 (EXPE = 1) I/O port also functioning as address output (A23 to A16), key-sense interrupt input (KIN15 to KIN8), and expansion A/D converter input (CIN15 to CIN8) Single-Chip Mode Mode 2, Mode 3 (EXPE = 0) I/O port also functioning as key-sense interrupt input (KIN15 to KIN8) and expansion A/D converter input (CIN15 to CIN8)
• 8-bit I/O port PA7 to PA0/ A23 to A16/ KIN15 to KIN8/ CIN15 to CIN8
8.7.2 Register Configuration Table 8.14 Port 6 Registers 8.9.3 Pin Functions Table 8.19 Port 8 Pin Functions
247
Table 8.14 amended (Before) System control register → (After) System control register 2
258
P81/GA20/CS2 selection method and pin function description amended
Pin P81/GA20/CS2 Selection Method and Pin Functions The pin function is switched as shown below according to the combination of operating mode, bit CS2E in SYSCR, bit FGA20E in HICR of the HIF, and bit P81DDR. Operating mode FGA20E CS2E P81DDR Pin function 0 P81 input pin Not slave mode — — 1 P81 output pin 0 P81 input pin 0 1 P81 output pin 0 1 — CS2 input pin 0 P81 input pin Slave mode 1 — 1 GA20 output pin
This pin should be used as the GA20 output pin or CS2 input pin only in mode 2 or 3 (EXPE = 0).
Rev. 4.00 Sep 27, 2006 page x of xliv
Item 8.11.3 Pin Functions Table 8.23 Port A Pin Functions
Page 270
Revision (See Manual for Details) Table 8.23 amended
Pin PA1/A17/KIN9/ CIN9 Selection Method and Pin Functions The pin function is switched as shown below according to the combination of operating mode, the IOSE bit in SYSCR, and bit PA1DDR. Operating mode PA1DDR IOSE Pin function Modes 1, 2 (EXPE = 0), 3 0 — PA1 input pin 1 — PA1 output pin 0 — PA1 input pin 0 A17 output pin Mode 2 (EXPE = 1) 1 1 PA1 output pin
KIN9 input pin, CIN9 input pin This pin can always be used as the KIN9 or CIN9 input pin. PA0/A16/KIN8/ CIN8 The pin function is switched as shown below according to the combination of operating mode, the IOSE bit in SYSCR, and bit PA0DDR. Operating mode PA0DDR IOSE Pin function Modes 1, 2 (EXPE = 0), 3 0 — PA0 input pin 1 — PA0 output pin 0 — PA0 input pin 0 A16 output pin Mode 2 (EXPE = 1) 1 1 PA0 output pin
KIN8 input pin, CIN8 input pin This pin can always be used as the KIN8 or CIN8 input pin.
9.3.1 Correspondence between PWM Data Register Contents and Output Waveform Table 9.4 Duty Cycle of Basic Pulse 10.3 Bus Master Interface
289
Description of upper 6 bits changed to of upper 4 bits
299
Description amended ... Example 2: Read DADRA MOV.W @DADRA, R0 ; Transfer contents of DADRA to R0
10.4 Operation Table 10.4 Settings and Operation (Examples when φ = 10 MHz)
303
Table 10.4 amended
Resolution T CKS (µs) 0 0.1 CFS 0 Base Conversion Cycle Cycle (µs) (µs) 6.4 1638.4 Fixed DADR Bits TL (if OS = 0) TH (if OS = 1) 1. Always low (or high) level output (DADR = H'0001 to H'03FD) 1. Always low (or high) level output (DADR = H'0003 to H'00FF) 1. Always low (or high) level output (DADR = H'0001 to H'03FD) 1. Always low (or high) level output (DADR = H'0003 to H'00FF) Precision Bit Data (Bits) 3210 14 Conversion Cycle* (µs) 1638.4
1
25.6
1638.4
14
1638.4
1
0.2
0
12.8
3276.8
14
3276.8
1
51.2
3276.8
14
3276.8
Rev. 4.00 Sep 27, 2006 page xi of xliv
Item 16.1.1 Features
Page 492
Revision (See Manual for Details) • Automatic switching from formatless mode to I C bus format (channel 0 only)
2
Description added 16.4 Usage Notes Figure 16.19 Flowchart and Timing of Start Condition Instruction Issuance for Retransmission 548 Figure 16.19 amended
SCL 9
SDA
ACK
IRIC [3] Start condition instruction issuance [1] IRIC determination [2] Determination of SCL = low
550 to 557
Description added • Notes on WAIT Function • Notes on ICDR Reads and ICCR Access in Slave Transmit Mode • Notes on TRS Bit Setting in Slave Mode • Notes on Arbitration Lost in Master Mode • Notes on Interrupt Occurrence after ACKB Reception • Notes on TRS Bit Setting and ICDR Register Access
20.4.3 Input Sampling 628 and A/D Conversion Time Figure 20.5 A/D Conversion Time
Figure 20.5 amended
(1) φ Address (2)
Write signal
Rev. 4.00 Sep 27, 2006 page xii of xliv
Item 22.4.2 Block Diagram Figure 22.2 Block Diagram of Flash Memory
Page 643
Revision (See Manual for Details) Figure 22.2 amended
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 * FLMCR2 * EBR1 EBR2 * *
Bus interface/controller
Operating mode
Mode pins
Flash memory (128 kbytes/64 kbytes)
22.5.3 Erase Block Registers 1 and 2 (EBR1, EBR2) 22.10.1 Programmer Mode Setting
653
Bit figure amended Read/Write description of bits 7 to 2 (Before) * → (After)
2
671
Note amended In programmer mode, ... Renesas Technology microcomputer 13 23 device types with 128-kbyte* * or 64-kbyte* * on-chip flash memory. ... Note: 3. Use products other than the A-mask version of the H8S/2148, H8S/2147N, H8S/2144, and H8S/2142 ...
22.10.4 Memory Read Mode Figure 22.17 Timing Waveforms when Entering Another Mode from Memory Read Mode
675
Figure 22.17 amended
Memory read mode FA17 to FA0 Address stable Other mode command write
CE OE WE FO7 to FO0 tnxtc tces tf
twep
tceh
tr H'XX tdh tds
Data
Rev. 4.00 Sep 27, 2006 page xiii of xliv
Item 22.10.4 Memory Read Mode Figure 22.19 Timing Waveforms for CE/OE Clocked Read
Page 676
Revision (See Manual for Details) Figure 22.19 amended
FA17 to FA0 Address stable Address stable tacc CE OE WE tacc FO7 to FO0 Data toh tdf Data toh tdf tce toe tce toe VIH
22.10.7 Status Read Mode Figure 22.22 Status Read Mode Timing Waveforms
681
Figure 22.22 amended
CE tce OE WE twep tces tf tceh tr tnxtc tces tf twep tceh tr tnxtc toe tnxtc
tdf
23.5.3 Erase Block Registers 1 and 2 (EBR1, EBR2)
699
Bit figure amended Read/Write description of bits 7 to 2 (Before) * → (After)
2
Bit EBR1 Initial value Read/Write
1 0 2 2 EB9/—* EB8/—* 0 0 12 12 R/W* * R/W* *
Note 2 amended Note: 2. Bits EB8 and EB9 are not present in the 64-kbyte versions; they must not be set to1. Table 23.5 Flash Memory Erase Blocks 700 64-kbyte description added to table 23.5
Block (Size) 128-kbyte Version EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbytes) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) 64-kbyte Version EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbytes) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) — — Address H'(00)0000 to H'(00)03FF H'(00)0400 to H'(00)07FF H'(00)0800 to H'(00)0BFF H'(00)0C00 to H'(00)0FFF H'(00)1000 to H'(00)7FFF H'(00)8000 to H'(00)BFFF H'(00)C000 to H'(00)DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF
Rev. 4.00 Sep 27, 2006 page xiv of xliv
Item 23.6.1 Boot Mode 23.7.2 Program-Verify Mode Figure 23.12 Program/Program-Verify Flowcharts
Page 705 710
Revision (See Manual for Details) Description amended H'(FF)E088 and above Note *6 added to figure 23.12
Write pulse application subroutine Sub-routine write pulse Enable WDT Set PSU bit in FLMCR1 Wait (y) µs Set P bit in FLMCR1 Wait (z1) µs, (z2) µs or (z3) µs Clear P bit in FLMCR1 Wait (α) µs Clear PSU bit in FLMCR2 Wait (β) µs Disable WDT End sub *6 *6 *5 *6 Start of programming Start Set SWE bit in FLMCR1 Wait (x) µs Store 128-byte program data in program data area and reprogram data area n=1 m=0 Write 128-byte data in RAM reprogram data *1 area consecutively to flash memory Sub-routine-call Write pulse See Note 7 for pulse width (z1) µs or (z2) µs *6 Set PV bit in FLMCR1 Wait (γ) µs H'FF dummy write to verify address Increment address Wait (ε) µs Read verify data Note 7: Write Pulse Width Number of Writes n Write Time (z*6) µsec 1 z1 2 z1 3 z1 4 z1 5 z1 6 z1 7 z2 8 z2 9 z2 10 z2 11 z2 12 z2 13 z2 . . . . . . 998 z2 999 z2 1000 z2 Note: Use a (z3) µs write pulse for additional programming. Program data = verify data? OK 6 ≥ n? OK Additional program data computation Transfer additional program data to additional program data area Reprogram data computation *4 *3 NG NG m=1 *6 *2 n←n+1 *6 *6 *4
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
Transfer reprogram data to reprogram data area *4 End of 128-byte data verification? OK Clear PV bit in FLMCR1 Wait (η) µs *6 NG
NG
RAM Program data storage area (128 bytes) Reprogram data storage area (128 bytes) Additional program data storage area (128 kbytes)
6 ≥ n?
OK Write 128-byte data in additional program data area in RAM consecutively to flash memory Additional write pulse (z3) µs NG
*1 *6 n ≥ 1000? OK Clear SWE bit in FLMCR1 *6 Wait (θ) µs Programming failure *6 NG
m = 0? OK Clear SWE bit in FLMCR1 Wait (θ) µs End of programming
23.10.4 Memory Read Mode Figure 23.17 Timing Waveforms when Entering Another Mode from Memory Read Mode
721
Figure 23.17 amended
Memory read mode FA17 to FA0 Address stable Other mode command write
CE OE WE FO7 to FO0 tnxtc tces tf
twep
tceh
tr H'XX tdh tds
Data
Rev. 4.00 Sep 27, 2006 page xv of xliv
Item 23.10.4 Memory Read Mode Figure 23.19 Timing Waveforms for CE/OE Clocked Read
Page 722
Revision (See Manual for Details) Figure 23.19 amended
FA17 to FA0 Address stable Address stable tacc CE OE WE tacc FO7 to FO0 Data toh tdf Data toh tdf tce toe tce toe VIH
23.10.5 Auto-Program Mode Figure 23.20 AutoProgram Mode Timing Waveforms
724
Figure 23.20 amended
FA17 to FA0 CE OE twep WE tces tf tds tdh FO6 FO7 to FO0
H'40 Data Data
Programming normal end identification signal
Address stable
tceh tnxtc
tas
tah
tnxtc
Data transfer 1 byte to 128 bytes
twsts
tspa
twrite (1 to 3000 ms)
Programming operation end identification signal
FO7
tr
Programming wait
FO0 to FO5 = 0
23.10.6 Auto-Erase Mode Figure 23.21 AutoErase Mode Timing Waveforms
725
Figure 23.21 amended
FA17 to FA0 tces CE OE WE FO7 FO6 CLin FO7 to FO0 H'20 DLin H'20 FO0 to FO5 = 0 tf tds tdh tspa twep tr tnxtc tests terase (100 to 40000 ms)
Erase end identification signal Erase normal end confirmation signal
tceh
tnxtc
Rev. 4.00 Sep 27, 2006 page xvi of xliv
Item 23.10.7 Status Read Mode Figure 23.22 Status Read Mode Timing Waveforms
Page 727
Revision (See Manual for Details) Figure 23.22 amended
CE tce OE WE twep tces tf tds tdh tceh tr tnxtc tces tf tds tdh twep tceh tr tnxtc toe tnxtc
tdf
24.7 Subclock Input Circuit 25.12 Usage Notes 26.2.6 Flash Memory Characteristics Table 26.15 Flash Memory Characteristics (Programming/erasing operating range)
740 764 799
Note on Subclock Usage Description added Section 25.12 added Table 26.15 amended
Item Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Symbol NWEC tDRP x Min 100*8 10 10 Typ — — Max 10000*9 — — — Unit Times Years µs Test Condition
800
Notes 8 to 10 added Notes: 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.3.3 AC Characteristics Table 26.20 Clock Timing
819
Table 26.20 amended
Condition A 20 MHz Item Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) Symbol tOSC1 Min 10 Max — Condition B 16 MHz Min 10 Max — Condition C 10 MHz Min 20 Max — Unit ms Test Conditions Figure 26.6
tOSC2
8
—
8
—
8
—
ms
Figure 26.7
Table 26.25 I C Bus Timing
2
829
Table 26.25 amended
Ratings Item SCL, SDA input fall time Symbol tSf Min — Typ — Max 300 250 1 Unit ns ns tcyc Test Conditions Notes Figure 26.28
SCL, SDA output tof fall time SCL, SDA input spike pulse elimination time tSP
20 + 0.1 Cb — — —
Rev. 4.00 Sep 27, 2006 page xvii of xliv
Item 26.3.4 A/D Conversion Characteristics Table 26.27 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266State Conversion) 26.3.6 Flash Memory Characteristics Table 26.29 Flash Memory Characteristics (Programming/erasing operating range)
Page 831
Revision (See Manual for Details) Note *4 added to table condition
4 4 Condition C: VCC = 3.0 V to 3.6V* , AVCC = 3.0 V to 3.6 V* , *4, V B = 3.0 V to 5.5 V*4, ... AVref = 3.0 V to AVCC CC
Note 4 amended Note: 4. When using CIN, the applicable range is VCC = 3.0 V to 3.6 V, ... 833 Table 26.29 amended Item amended (Before) Wait time after dummy write → (After) Wait time after H'FF dummy write Symbol of wait time after SWE-bit clear (Before) Θ → (After) θ
Item Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Symbol NWEC tDRP x Min 100*8 10 1 Typ 10000* — —
9
Max — — —
Unit Times Years µs
Test Condition
834
Notes 8 to 10 added Notes: 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.4.3 AC Characteristics Table 26.35 Control Signal Timing Table 26.37 Timing of On-Chip Supporting Modules (1)
849
Unit of tNMIH amended (Before) → (After) ns
854, 855
Units of tPRS, tPRH, tFTIS, tFTCS, tTMRS, tTMCS amended (Before) → (After) ns Units of tFTCWL, tTMCWL, synchronous tScyc amended (Before) → (After) tcyc Unit of tSCKf amended (Before) 1.5 → (After) tcyc
26.4.4 A/D Conversion Characteristics Table 26.41 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266State Conversion)
860
Table condition amended Table condition A (Before) ..., Ta = −20 to +75°C (regular specifications), Ta = −40 to +85°C (wide-range specifications) → (After) ... Ta = −20 to +75°C
Rev. 4.00 Sep 27, 2006 page xviii of xliv
Item 26.4.6 Flash Memory Characteristics Table 26.43 Flash Memory Characteristics (Programming/erasing operating range)
Page 862
Revision (See Manual for Details) Table 26.43 amended
Item Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*
1
Symbol NWEC tDRP x
Min 100*8 10 10
Typ
Max 10000*9 — — — —
Unit Times Years µs
Test Condition
—
863
Notes 8 to 10 added Notes: 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.5.3 AC Characteristics Table 26.49 Control Signal Timing 26.5.6 Flash Memory Characteristics Table 26.55 Flash Memory Characteristics (Programming/erasing operating range)
877
Unit of tNMIH amended (Before) (blank) → (After) ns
885
Table 26.55 amended
Item Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Symbol NWEC tDRP x Min 100*8 10 10 Typ Max 10000*9 — — — — — Unit Times Years µs Condition
886
Notes 8 to 10 added Notes: 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.6.3 AC Characteristics Table 26.61 Control Signal Timing
900
Unit of tNMIH amended (Before) (blank) → (After) ns
Rev. 4.00 Sep 27, 2006 page xix of xliv
Item 26.6.6 Flash Memory Characteristics Table 26.67 Flash Memory Characteristics (Programming/erasing operating range)
Page 908
Revision (See Manual for Details) Table 26.67 amended Symbol of wait time after SWE-bit clear (Before) Θ → (After) θ
Item Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Symbol NWEC tDRP x Min 100*8 10 1 Typ Max 10000*9 — — — — — Unit Times Years µs Test Condition
909
Notes 8 to 10 added Notes: 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.7.2 Clock Timing Figure 26.6 Oscillation Settling Timing
912
Figure 26.6 amended
EXTAL tDEXT VCC tDEXT
STBY
tOSC1 RES
tOSC1
φ
26.7.5 Timing of On924 Chip Supporting Modules Figure 26.28 I C Bus Interface Input/Output Timing (Option)
2
Figure 26.28 amended
SDA0, SDA1 tBUF
VIH VIL tSTAH tSCLH
SCL0, SCL1
P*
S* tSf tof tSCLL tSCL tSr tSDAH
Rev. 4.00 Sep 27, 2006 page xx of xliv
Item A.1 Instruction Table A.1 Instruction Set
Page 930
Revision (See Manual for Details) Table A.1 amended 2. Arithmetic Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
EXTU
EXTU.W Rd EXTU.L ERd
W L B
2 2 4
0 → ( of Rd16) 0 → ( of ERd32) @ERd-0 → CCR set, (1) → ( of @ERd)
—— 0 —— 0 ——
0— 0— 0—
Normal
@@aa
I
—
HNZ
VC
1 1 4
TAS
TAS @ERd*3
933
Table A.1 amended 4. Shift Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
SHLR
SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd
B B W W L L
2 2 2 2 2 2 0 MSB LSB C
—— 0 —— 0 —— 0 —— 0 —— 0 —— 0
Normal
@@aa
I
—
HNZ
VC
0 0 0 0 0 0
1 1 1 1 1 1
939
Table A.1 amended 6. Branch Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
JMP
JMP @ERn JMP @aa:24 JMP @@aa:8
— — — — — — — — —
2 4 2 2 4 2 4 2
PC←ERn PC←aa:24 PC←@aa:8 PC→@-SP,PC←PC+d:8 PC→@-SP,PC←PC+d:16 PC→@-SP,PC←ERn PC→@-SP,PC←aa:24 PC→@-SP,PC←@aa:8 2 PC←@SP+
Normal
@@aa
I
—
HNZ
VC
—————— —————— —————— —————— —————— —————— —————— —————— —————— 4 3 4 3 4 4 4
2 3 5 4 5 4 5 6 5
BSR
BSR d:8 BSR d:16
JSR
JSR @ERn JSR @aa:24 JSR @@aa:8
RTS
RTS
A.2 Instruction Codes Table A.2 Instruction Codes
949
Table A.2 amended
Instruction LDC Mnemonic LDC @aa:16,CCR LDC @aa:16,EXR Instruction Format Size W W 1st Byte 0 0 1 1 2nd Byte 4 4 0 1 3rd Byte 6 6 B B 4th Byte 0 0 0 0 5th Byte abs abs 6th Byte
Rev. 4.00 Sep 27, 2006 page xxi of xliv
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Item B.3 Functions
Page 1013 1016
Revision (See Manual for Details) Subheading amended KBCOMPH'FEE4 IrDA/Expansion A/D ISRH'FEEB Interrupt Controller Figure amended
IRQ7 to IRQ0 flags 0 [Clearing conditions] • Cleared by reading IRQnF when set to 1, then writing 0 in IRQnF • When interrupt exception handling is executed while low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high* • When IRQn interrupt exception handling is executed while falling, rising, or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1)*
Note: * When a product, in which a DTC is incorporated, is used in the following settings, the corresponding flag bit is not automatically cleared even when exception handling, which is a clear condition, is executed and the bit is held at 1. (1) When DTCEA3 is set to 1 (ADI is set to an interrupt source), IRQ4F flag is not automatically cleared. (2) When DTCEA2 is set to 1 (ICIA is set to an interrupt source), IRQ5F flag is not automatically cleared. (3) When DTCEA1 is set to 1 (ICIB is set to an interrupt source), IRQ6F flag is not automatically cleared. (4) When DTCEA0 is set to 1 (OCIA is set to an interrupt source), IRQ7F flag is not automatically cleared. When activation interrupt sources of DTC and IRQ interrupts are used with the above combinations, clear the interrupt flag by software in the interrupt handling routine of the corresponding IRQ. 1019 ABRKCRH'FEF4 Interrupt Controller Read/Write description amended Bit 7 (Before) R/W → (After) R 1021 FLMCR1H'FF80 Flash Memory Initial value description amended Bit 7 (Before) → (After) 1
Rev. 4.00 Sep 27, 2006 page xxii of xliv
Item B.3 Functions
Page 1025
Revision (See Manual for Details) EBR1H'FF82 Flash Memory EBR2H'FF83 Flash Memory Figure amended Read/Write description of bits 7 to 2 (Before) * → (After)
2
Bit EBR1 Initial value Read/Write
7 — 0 —
6 — 0 —
5 — 0 —
4 — 0 —
3 — 0 —
2 — 0 —
1
0
EB9/—*2 EB8/—*2 0 0 R/W*1*2 R/W*1*2
Bit EBR2 Initial value Read/Write
7 EB7 0 R/W*1
6 EB6 0 R/W
5 EB5 0 R/W
4 EB4 0 R/W
3 EB3 0 R/W
2 EB2 0 R/W
1 EB1 0 R/W
0 EB0 0 R/W
1030
ICCR1H'FF88 IIC1 ICCR0H'FFD8 IIC0 Figure amended
I2C bus interface enable 0 I2C bus interface module disabled, with SCL and SDA signal pins set to port function SAR and SARX can be accessed I2C bus interface module enabled for transfer operations (pins SCL and SDA are driving the bus) ICMR and ICDR can be accessed
1
1059
SYSCRH'FFC4 System Figure amended
IOS enable 0 1 The AS/IOS pin functions as the address strobe pin (Low output when accessing an external area) The AS/IOS pin functions as the I/O strobe pin (Low output when accessing a specified address from H'(FF)F000 to H'(FF)FE4F)*
Note: * In the H8S/2148 F-ZTAT A-mask version and H8S/2147 F-ZTAT A-mask version, the address range is from H'(FF)F000 to H'(FF)F7FF.
Rev. 4.00 Sep 27, 2006 page xxiii of xliv
Item B.3 Functions
Page 1077
Revision (See Manual for Details) TICRRH'FFF2 TMRX TICRFH'FFF3 TMRX Figure amended (Before) Stores TCNT value at fall of external trigger input → (After) Stores TCNT value at fall of external reset input
1080
STR1H'FFF6 HIF STR2H'FFFE HIF Slave R/W description amended Bit 0 (Before) R → (After) R/(W)
C.2 Port 2 Block Diagrams Figure C.4 Port 2 Block Diagram (Pin P27)
1089
Figure C.4 amended
Hardware standby
Mode 1
P27
Appendix F Product Code Lineup Table F.1 H8S/2148 Group and H8S/2144 Group Product Code Lineup Appendix G Package Dimensions Figure G.1 Package Dimensions (FP-100B) Figure G.2 Package Dimensions (TFP-100B)
1128
Package code in table F.1 amended HD64F2144ATE20 (Before) FP-100B → (After) TFP-100B HD64F2144AVFA10 (Before) TFP-100B → (After) FP-100B
1129
Figure G.1 replaced
1130
Figure G.2 replaced
Rev. 4.00 Sep 27, 2006 page xxiv of xliv
Contents
Section 1 Overview .............................................................................................................
1.1 1.2 1.3 Overview........................................................................................................................... Internal Block Diagram..................................................................................................... Pin Arrangement and Functions........................................................................................ 1.3.1 Pin Arrangement .................................................................................................. 1.3.2 Pin Functions in Each Operating Mode ............................................................... 1.3.3 Pin Functions ....................................................................................................... 1 1 7 10 10 13 26
Section 2 CPU ...................................................................................................................... 35
2.1 Overview........................................................................................................................... 2.1.1 Features................................................................................................................ 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU .................................. 2.1.3 Differences from H8/300 CPU ............................................................................ 2.1.4 Differences from H8/300H CPU.......................................................................... CPU Operating Modes ...................................................................................................... Address Space................................................................................................................... Register Configuration...................................................................................................... 2.4.1 Overview.............................................................................................................. 2.4.2 General Registers ................................................................................................. 2.4.3 Control Registers ................................................................................................. 2.4.4 Initial Register Values.......................................................................................... Data Formats..................................................................................................................... 2.5.1 General Register Data Formats ............................................................................ 2.5.2 Memory Data Formats ......................................................................................... Instruction Set ................................................................................................................... 2.6.1 Overview.............................................................................................................. 2.6.2 Instructions and Addressing Modes ..................................................................... 2.6.3 Table of Instructions Classified by Function ....................................................... 2.6.4 Basic Instruction Formats .................................................................................... 2.6.5 Notes on Use of Bit-Manipulation Instructions ................................................... Addressing Modes and Effective Address Calculation ..................................................... 2.7.1 Addressing Mode................................................................................................. 2.7.2 Effective Address Calculation ............................................................................. Processing States............................................................................................................... 2.8.1 Overview.............................................................................................................. 2.8.2 Reset State............................................................................................................ 2.8.3 Exception-Handling State .................................................................................... 2.8.4 Program Execution State...................................................................................... 35 35 36 37 37 38 43 44 44 45 46 48 49 49 51 52 52 53 55 64 65 65 65 69 73 73 74 75 76
2.2 2.3 2.4
2.5
2.6
2.7
2.8
Rev. 4.00 Sep 27, 2006 page xxv of xliv
2.8.5 Bus-Released State............................................................................................... 2.8.6 Power-Down State ............................................................................................... 2.9 Basic Timing ..................................................................................................................... 2.9.1 Overview.............................................................................................................. 2.9.2 On-Chip Memory (ROM, RAM) ......................................................................... 2.9.3 On-Chip Supporting Module Access Timing ...................................................... 2.9.4 External Address Space Access Timing .............................................................. 2.10 Usage Note........................................................................................................................ 2.10.1 TAS Instruction.................................................................................................... 2.10.2 STM/LDM Instruction .........................................................................................
76 77 78 78 78 80 81 82 82 82
Section 3 MCU Operating Modes .................................................................................. 83
3.1 Overview........................................................................................................................... 3.1.1 Operating Mode Selection ................................................................................... 3.1.2 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 3.2.1 Mode Control Register (MDCR) ......................................................................... 3.2.2 System Control Register (SYSCR) ...................................................................... 3.2.3 Bus Control Register (BCR) ................................................................................ 3.2.4 Serial Timer Control Register (STCR) ................................................................ Operating Mode Descriptions ........................................................................................... 3.3.1 Mode 1 ................................................................................................................. 3.3.2 Mode 2 ................................................................................................................. 3.3.3 Mode 3 ................................................................................................................. Pin Functions in Each Operating Mode ............................................................................ Memory Map in Each Operating Mode ............................................................................ 83 83 84 84 84 85 87 88 89 89 89 90 90 91
3.2
3.3
3.4 3.5
Section 4 Exception Handling ......................................................................................... 103
4.1 Overview........................................................................................................................... 4.1.1 Exception Handling Types and Priority............................................................... 4.1.2 Exception Handling Operation............................................................................. 4.1.3 Exception Sources and Vector Table ................................................................... Reset.................................................................................................................................. 4.2.1 Overview.............................................................................................................. 4.2.2 Reset Sequence .................................................................................................... 4.2.3 Interrupts after Reset............................................................................................ Interrupts ........................................................................................................................... Trap Instruction................................................................................................................. Stack Status after Exception Handling.............................................................................. Notes on Use of the Stack ................................................................................................. 103 103 104 104 106 106 106 108 109 110 111 112
4.2
4.3 4.4 4.5 4.6
Rev. 4.00 Sep 27, 2006 page xxvi of xliv
Section 5 Interrupt Controller .......................................................................................... 113
5.1 Overview........................................................................................................................... 5.1.1 Features................................................................................................................ 5.1.2 Block Diagram ..................................................................................................... 5.1.3 Pin Configuration................................................................................................. 5.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 5.2.1 System Control Register (SYSCR) ...................................................................... 5.2.2 Interrupt Control Registers A to C (ICRA to ICRC)............................................ 5.2.3 IRQ Enable Register (IER) .................................................................................. 5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL)..................................... 5.2.5 IRQ Status Register (ISR).................................................................................... 5.2.6 Keyboard Matrix Interrupt Mask Register (KMIMR) ......................................... 5.2.7 Keyboard Matrix Interrupt Mask Register (KMIMRA)....................................... 5.2.8 Address Break Control Register (ABRKCR)....................................................... 5.2.9 Break Address Registers A, B, C (BARA, BARB, BARC)................................. Interrupt Sources............................................................................................................... 5.3.1 External Interrupts ............................................................................................... 5.3.2 Internal Interrupts................................................................................................. 5.3.3 Interrupt Exception Vector Table ........................................................................ Address Breaks ................................................................................................................. 5.4.1 Features................................................................................................................ 5.4.2 Block Diagram ..................................................................................................... 5.4.3 Operation ............................................................................................................. 5.4.4 Usage Notes ......................................................................................................... Interrupt Operation............................................................................................................ 5.5.1 Interrupt Control Modes and Interrupt Operation ................................................ 5.5.2 Interrupt Control Mode 0 ..................................................................................... 5.5.3 Interrupt Control Mode 1 ..................................................................................... 5.5.4 Interrupt Exception Handling Sequence .............................................................. 5.5.5 Interrupt Response Times .................................................................................... Usage Notes ...................................................................................................................... 5.6.1 Contention between Interrupt Generation and Disabling..................................... 5.6.2 Instructions That Disable Interrupts..................................................................... 5.6.3 Interrupts during Execution of EEPMOV Instruction.......................................... DTC Activation by Interrupt............................................................................................. 5.7.1 Overview.............................................................................................................. 5.7.2 Block Diagram ..................................................................................................... 5.7.3 Operation ............................................................................................................. 113 113 114 115 116 117 117 118 119 119 120 122 122 124 125 126 126 128 128 132 132 132 133 133 135 135 138 140 143 145 146 146 147 147 148 148 148 149
5.2
5.3
5.4
5.5
5.6
5.7
Rev. 4.00 Sep 27, 2006 page xxvii of xliv
Section 6 Bus Controller ................................................................................................... 151
6.1 Overview........................................................................................................................... 6.1.1 Features................................................................................................................ 6.1.2 Block Diagram ..................................................................................................... 6.1.3 Pin Configuration................................................................................................. 6.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 6.2.1 Bus Control Register (BCR) ................................................................................ 6.2.2 Wait State Control Register (WSCR) .................................................................. Overview of Bus Control .................................................................................................. 6.3.1 Bus Specifications................................................................................................ 6.3.2 Advanced Mode................................................................................................... 6.3.3 Normal Mode....................................................................................................... 6.3.4 I/O Select Signal .................................................................................................. Basic Bus Interface ........................................................................................................... 6.4.1 Overview.............................................................................................................. 6.4.2 Data Size and Data Alignment............................................................................. 6.4.3 Valid Strobes........................................................................................................ 6.4.4 Basic Timing........................................................................................................ 6.4.5 Wait Control ........................................................................................................ Burst ROM Interface......................................................................................................... 6.5.1 Overview.............................................................................................................. 6.5.2 Basic Timing........................................................................................................ 6.5.3 Wait Control ........................................................................................................ Idle Cycle .......................................................................................................................... 6.6.1 Operation ............................................................................................................. 6.6.2 Pin States in Idle Cycle ........................................................................................ Bus Arbitration.................................................................................................................. 6.7.1 Overview.............................................................................................................. 6.7.2 Operation ............................................................................................................. 6.7.3 Bus Transfer Timing ............................................................................................ 151 151 152 153 153 154 154 155 157 157 158 158 159 160 160 160 162 163 171 173 173 173 175 175 175 176 177 177 177 178
6.2
6.3
6.4
6.5
6.6
6.7
Section 7 Data Transfer Controller (DTC) ................................................................... 179
7.1 Overview........................................................................................................................... 7.1.1 Features................................................................................................................ 7.1.2 Block Diagram ..................................................................................................... 7.1.3 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 7.2.1 DTC Mode Register A (MRA) ............................................................................ 7.2.2 DTC Mode Register B (MRB)............................................................................. 7.2.3 DTC Source Address Register (SAR).................................................................. 179 179 180 181 182 182 184 185
7.2
Rev. 4.00 Sep 27, 2006 page xxviii of xliv
7.3
7.4 7.5
7.2.4 DTC Destination Address Register (DAR).......................................................... 7.2.5 DTC Transfer Count Register A (CRA) .............................................................. 7.2.6 DTC Transfer Count Register B (CRB)............................................................... 7.2.7 DTC Enable Registers (DTCER) ......................................................................... 7.2.8 DTC Vector Register (DTVECR)........................................................................ 7.2.9 Module Stop Control Register (MSTPCR) .......................................................... Operation .......................................................................................................................... 7.3.1 Overview.............................................................................................................. 7.3.2 Activation Sources ............................................................................................... 7.3.3 DTC Vector Table................................................................................................ 7.3.4 Location of Register Information in Address Space ............................................ 7.3.5 Normal Mode....................................................................................................... 7.3.6 Repeat Mode ........................................................................................................ 7.3.7 Block Transfer Mode ........................................................................................... 7.3.8 Chain Transfer ..................................................................................................... 7.3.9 Operation Timing................................................................................................. 7.3.10 Number of DTC Execution States........................................................................ 7.3.11 Procedures for Using the DTC............................................................................. 7.3.12 Examples of Use of the DTC ............................................................................... Interrupts ........................................................................................................................... Usage Notes ......................................................................................................................
185 186 186 187 188 189 189 189 191 193 195 196 197 198 200 201 202 204 205 207 207
Section 8 I/O Ports .............................................................................................................. 209
8.1 8.2 Overview........................................................................................................................... Port 1................................................................................................................................. 8.2.1 Overview.............................................................................................................. 8.2.2 Register Configuration......................................................................................... 8.2.3 Pin Functions in Each Mode ................................................................................ 8.2.4 MOS Input Pull-Up Function............................................................................... Port 2................................................................................................................................. 8.3.1 Overview.............................................................................................................. 8.3.2 Register Configuration......................................................................................... 8.3.3 Pin Functions in Each Mode ................................................................................ 8.3.4 MOS Input Pull-Up Function............................................................................... Port 3................................................................................................................................. 8.4.1 Overview.............................................................................................................. 8.4.2 Register Configuration......................................................................................... 8.4.3 Pin Functions in Each Mode ................................................................................ 8.4.4 MOS Input Pull-Up Function............................................................................... Port 4................................................................................................................................. 8.5.1 Overview.............................................................................................................. 209 221 221 222 224 226 226 226 228 230 232 233 233 234 236 237 238 238
8.3
8.4
8.5
Rev. 4.00 Sep 27, 2006 page xxix of xliv
8.5.2 Register Configuration......................................................................................... 8.5.3 Pin Functions ....................................................................................................... 8.6 Port 5................................................................................................................................. 8.6.1 Overview.............................................................................................................. 8.6.2 Register Configuration......................................................................................... 8.6.3 Pin Functions ....................................................................................................... 8.7 Port 6................................................................................................................................. 8.7.1 Overview.............................................................................................................. 8.7.2 Register Configuration......................................................................................... 8.7.3 Pin Functions ....................................................................................................... 8.7.4 MOS Input Pull-Up Function............................................................................... 8.8 Port 7................................................................................................................................. 8.8.1 Overview.............................................................................................................. 8.8.2 Register Configuration......................................................................................... 8.8.3 Pin Functions ....................................................................................................... 8.9 Port 8................................................................................................................................. 8.9.1 Overview.............................................................................................................. 8.9.2 Register Configuration......................................................................................... 8.9.3 Pin Functions ....................................................................................................... 8.10 Port 9................................................................................................................................. 8.10.1 Overview.............................................................................................................. 8.10.2 Register Configuration......................................................................................... 8.10.3 Pin Functions ....................................................................................................... 8.11 Port A................................................................................................................................ 8.11.1 Overview.............................................................................................................. 8.11.2 Register Configuration......................................................................................... 8.11.3 Pin Functions ....................................................................................................... 8.11.4 MOS Input Pull-Up Function............................................................................... 8.12 Port B ................................................................................................................................ 8.12.1 Overview.............................................................................................................. 8.12.2 Register Configuration......................................................................................... 8.12.3 Pin Functions ....................................................................................................... 8.12.4 MOS Input Pull-Up Function...............................................................................
238 239 243 243 243 245 246 246 247 250 252 253 253 253 254 255 255 255 256 259 259 260 261 265 265 266 267 271 272 272 273 275 278
Section 9 8-Bit PWM Timers........................................................................................... 279
9.1 Overview........................................................................................................................... 9.1.1 Features................................................................................................................ 9.1.2 Block Diagram ..................................................................................................... 9.1.3 Pin Configuration................................................................................................. 9.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 279 279 280 281 281 282
9.2
Rev. 4.00 Sep 27, 2006 page xxx of xliv
9.3
9.2.1 PWM Register Select (PWSL)............................................................................. 9.2.2 PWM Data Registers (PWDR0 to PWDR15) ...................................................... 9.2.3 PWM Data Polarity Registers A and B (PWDPRA and PWDPRB).................... 9.2.4 PWM Output Enable Registers A and B (PWOERA and PWOERB) ................. 9.2.5 Peripheral Clock Select Register (PCSR) ............................................................ 9.2.6 Port 1 Data Direction Register (P1DDR)............................................................. 9.2.7 Port 2 Data Direction Register (P2DDR)............................................................. 9.2.8 Port 1 Data Register (P1DR)................................................................................ 9.2.9 Port 2 Data Register (P2DR)................................................................................ 9.2.10 Module Stop Control Register (MSTPCR) .......................................................... Operation .......................................................................................................................... 9.3.1 Correspondence between PWM Data Register Contents and Output Waveform..........................................................................................
282 284 284 285 286 286 287 287 287 288 289 289
Section 10 14-Bit PWM Timer (PWMX)..................................................................... 291
10.1 Overview........................................................................................................................... 10.1.1 Features................................................................................................................ 10.1.2 Block Diagram ..................................................................................................... 10.1.3 Pin Configuration................................................................................................. 10.1.4 Register Configuration......................................................................................... 10.2 Register Descriptions ........................................................................................................ 10.2.1 PWM (D/A) Counter (DACNT) .......................................................................... 10.2.2 D/A Data Registers A and B (DADRA and DADRB)......................................... 10.2.3 PWM D/A Control Register (DACR) .................................................................. 10.2.4 Module Stop Control Register (MSTPCR) .......................................................... 10.3 Bus Master Interface ......................................................................................................... 10.4 Operation .......................................................................................................................... 291 291 292 293 293 294 294 295 296 298 299 302 307 307 307 308 309 310 311 311 311 312 313 314 314
Section 11 16-Bit Free-Running Timer......................................................................... 11.1 Overview........................................................................................................................... 11.1.1 Features................................................................................................................ 11.1.2 Block Diagram ..................................................................................................... 11.1.3 Input and Output Pins .......................................................................................... 11.1.4 Register Configuration......................................................................................... 11.2 Register Descriptions ........................................................................................................ 11.2.1 Free-Running Counter (FRC) .............................................................................. 11.2.2 Output Compare Registers A and B (OCRA, OCRB) ......................................... 11.2.3 Input Capture Registers A to D (ICRA to ICRD) ................................................ 11.2.4 Output Compare Registers AR and AF (OCRAR, OCRAF) ............................... 11.2.5 Output Compare Register DM (OCRDM) ........................................................... 11.2.6 Timer Interrupt Enable Register (TIER) ..............................................................
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11.3
11.4 11.5 11.6
11.2.7 Timer Control/Status Register (TCSR) ................................................................ 11.2.8 Timer Control Register (TCR) ............................................................................. 11.2.9 Timer Output Compare Control Register (TOCR) .............................................. 11.2.10 Module Stop Control Register (MSTPCR) .......................................................... Operation .......................................................................................................................... 11.3.1 FRC Increment Timing ........................................................................................ 11.3.2 Output Compare Output Timing .......................................................................... 11.3.3 FRC Clear Timing................................................................................................ 11.3.4 Input Capture Input Timing ................................................................................. 11.3.5 Timing of Input Capture Flag (ICF) Setting ........................................................ 11.3.6 Setting of Output Compare Flags A and B (OCFA, OCFB)................................ 11.3.7 Setting of FRC Overflow Flag (OVF) ................................................................. 11.3.8 Automatic Addition of OCRA and OCRAR/OCRAF ......................................... 11.3.9 ICRD and OCRDM Mask Signal Generation ...................................................... Interrupts ........................................................................................................................... Sample Application........................................................................................................... Usage Notes ......................................................................................................................
316 319 321 324 325 325 326 327 327 329 330 331 331 332 333 334 335 341 341 341 342 343 344 345 345 346 347 348 352 356 357 357 358 359 359 360 361 362 362
Section 12 8-Bit Timers ..................................................................................................... 12.1 Overview........................................................................................................................... 12.1.1 Features................................................................................................................ 12.1.2 Block Diagram ..................................................................................................... 12.1.3 Pin Configuration................................................................................................. 12.1.4 Register Configuration......................................................................................... 12.2 Register Descriptions ........................................................................................................ 12.2.1 Timer Counter (TCNT)........................................................................................ 12.2.2 Time Constant Register A (TCORA)................................................................... 12.2.3 Time Constant Register B (TCORB) ................................................................... 12.2.4 Timer Control Register (TCR) ............................................................................. 12.2.5 Timer Control/Status Register (TCSR) ................................................................ 12.2.6 Serial/Timer Control Register (STCR) ................................................................ 12.2.7 System Control Register (SYSCR) ...................................................................... 12.2.8 Timer Connection Register S (TCONRS)............................................................ 12.2.9 Input Capture Register (TICR) [TMRX Additional Function] ............................ 12.2.10 Time Constant Register C (TCORC) [TMRX Additional Function]................... 12.2.11 Input Capture Registers R and F (TICRR, TICRF) [TMRX Additional Functions]............................................................................. 12.2.12 Timer Input Select Register (TISR) [TMRY Additional Function]..................... 12.2.13 Module Stop Control Register (MSTPCR) .......................................................... 12.3 Operation .......................................................................................................................... 12.3.1 TCNT Incrementation Timing .............................................................................
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12.3.2 Compare-Match Timing....................................................................................... 12.3.3 TCNT External Reset Timing .............................................................................. 12.3.4 Timing of Overflow Flag (OVF) Setting ............................................................. 12.3.5 Operation with Cascaded Connection.................................................................. 12.3.6 Input Capture Operation ...................................................................................... 12.4 Interrupt Sources............................................................................................................... 12.5 8-Bit Timer Application Example..................................................................................... 12.6 Usage Notes ...................................................................................................................... 12.6.1 Contention between TCNT Write and Clear........................................................ 12.6.2 Contention between TCNT Write and Increment ................................................ 12.6.3 Contention between TCOR Write and Compare-Match ...................................... 12.6.4 Contention between Compare-Matches A and B................................................. 12.6.5 Switching of Internal Clocks and TCNT Operation.............................................
363 364 365 365 367 369 370 371 371 372 373 374 374 377 377 377 377 379 380 380 380 383 385 387 390 391 391 393 394 396 398 400 403 404 405
Section 13 Timer Connection........................................................................................... 13.1 Overview........................................................................................................................... 13.1.1 Features................................................................................................................ 13.1.2 Block Diagram ..................................................................................................... 13.1.3 Input and Output Pins .......................................................................................... 13.1.4 Register Configuration......................................................................................... 13.2 Register Descriptions ........................................................................................................ 13.2.1 Timer Connection Register I (TCONRI) ............................................................. 13.2.2 Timer Connection Register O (TCONRO) .......................................................... 13.2.3 Timer Connection Register S (TCONRS)............................................................ 13.2.4 Edge Sense Register (SEDGR) ............................................................................ 13.2.5 Module Stop Control Register (MSTPCR) .......................................................... 13.3 Operation .......................................................................................................................... 13.3.1 PWM Decoding (PDC Signal Generation) .......................................................... 13.3.2 Clamp Waveform Generation (CL1/CL2/CL3 Signal Generation) ..................... 13.3.3 Measurement of 8-Bit Timer Divided Waveform Period .................................... 13.3.4 IHI Signal and 2fH Modification ......................................................................... 13.3.5 IVI Signal Fall Modification and IHI Synchronization ....................................... 13.3.6 Internal Synchronization Signal Generation (IHG/IVG/CL4 Signal Generation) ..................................................................... 13.3.7 HSYNCO Output ................................................................................................. 13.3.8 VSYNCO Output ................................................................................................. 13.3.9 CBLANK Output .................................................................................................
Section 14 Watchdog Timer (WDT) .............................................................................. 407
14.1 Overview........................................................................................................................... 407 14.1.1 Features................................................................................................................ 407
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14.2
14.3
14.4 14.5
14.1.2 Block Diagram ..................................................................................................... 14.1.3 Pin Configuration................................................................................................. 14.1.4 Register Configuration......................................................................................... Register Descriptions ........................................................................................................ 14.2.1 Timer Counter (TCNT)........................................................................................ 14.2.2 Timer Control/Status Register (TCSR) ................................................................ 14.2.3 System Control Register (SYSCR) ...................................................................... 14.2.4 Notes on Register Access..................................................................................... Operation .......................................................................................................................... 14.3.1 Watchdog Timer Operation ................................................................................. 14.3.2 Interval Timer Operation ..................................................................................... 14.3.3 Timing of Setting of Overflow Flag (OVF) ......................................................... 14.3.4 RESO Signal Output Timing ............................................................................... Interrupts ........................................................................................................................... Usage Notes ...................................................................................................................... 14.5.1 Contention between Timer Counter (TCNT) Write and Increment ..................... 14.5.2 Changing Value of CKS2 to CKS0...................................................................... 14.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode................ 14.5.4 System Reset by RESO Signal............................................................................. 14.5.5 Counter Value in Transitions between High-Speed Mode, Subactive Mode, and Watch Mode.................................................................................................. 14.5.6 OVF Flag Clear Condition...................................................................................
408 409 410 410 410 411 414 415 416 416 417 418 419 419 420 420 420 421 421 421 422 423 423 423 425 426 426 428 428 428 429 429 430 433 436 441 449 450 452
Section 15 Serial Communication Interface (SCI, IrDA) ........................................ 15.1 Overview........................................................................................................................... 15.1.1 Features................................................................................................................ 15.1.2 Block Diagram ..................................................................................................... 15.1.3 Pin Configuration................................................................................................. 15.1.4 Register Configuration......................................................................................... 15.2 Register Descriptions ........................................................................................................ 15.2.1 Receive Shift Register (RSR) .............................................................................. 15.2.2 Receive Data Register (RDR) .............................................................................. 15.2.3 Transmit Shift Register (TSR) ............................................................................. 15.2.4 Transmit Data Register (TDR)............................................................................. 15.2.5 Serial Mode Register (SMR)................................................................................ 15.2.6 Serial Control Register (SCR).............................................................................. 15.2.7 Serial Status Register (SSR) ................................................................................ 15.2.8 Bit Rate Register (BRR) ...................................................................................... 15.2.9 Serial Interface Mode Register (SCMR).............................................................. 15.2.10 Module Stop Control Register (MSTPCR) .......................................................... 15.2.11 Keyboard Comparator Control Register (KBCOMP) ..........................................
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15.3 Operation .......................................................................................................................... 15.3.1 Overview.............................................................................................................. 15.3.2 Operation in Asynchronous Mode ....................................................................... 15.3.3 Multiprocessor Communication Function............................................................ 15.3.4 Operation in Synchronous Mode ......................................................................... 15.3.5 IrDA Operation .................................................................................................... 15.4 SCI Interrupts.................................................................................................................... 15.5 Usage Notes ......................................................................................................................
453 453 455 466 474 483 486 487
Section 16 I2C Bus Interface [Option] ........................................................................... 491
16.1 Overview........................................................................................................................... 16.1.1 Features................................................................................................................ 16.1.2 Block Diagram ..................................................................................................... 16.1.3 Input/Output Pins ................................................................................................. 16.1.4 Register Configuration......................................................................................... 16.2 Register Descriptions ........................................................................................................ 2 16.2.1 I C Bus Data Register (ICDR) ............................................................................. 16.2.2 Slave Address Register (SAR) ............................................................................. 16.2.3 Second Slave Address Register (SARX) ............................................................. 2 16.2.4 I C Bus Mode Register (ICMR) ........................................................................... 2 16.2.5 I C Bus Control Register (ICCR) ......................................................................... 2 16.2.6 I C Bus Status Register (ICSR)............................................................................ 16.2.7 Serial/Timer Control Register (STCR) ................................................................ 16.2.8 DDC Switch Register (DDCSWR) ...................................................................... 16.2.9 Module Stop Control Register (MSTPCR) .......................................................... 16.3 Operation .......................................................................................................................... 2 16.3.1 I C Bus Data Format ............................................................................................ 16.3.2 Master Transmit Operation .................................................................................. 16.3.3 Master Receive Operation.................................................................................... 16.3.4 Slave Receive Operation...................................................................................... 16.3.5 Slave Transmit Operation .................................................................................... 16.3.6 IRIC Setting Timing and SCL Control ................................................................ 2 16.3.7 Automatic Switching from Formatless Mode to I C Bus Format ........................ 16.3.8 Operation Using the DTC .................................................................................... 16.3.9 Noise Canceler ..................................................................................................... 16.3.10 Sample Flowcharts............................................................................................... 16.3.11 Initialization of Internal State .............................................................................. 16.4 Usage Notes ...................................................................................................................... 491 491 492 494 495 496 496 499 500 501 504 511 516 518 520 521 521 523 525 528 531 533 534 535 536 536 541 542
Section 17 Keyboard Buffer Controller ........................................................................ 559
17.1 Overview........................................................................................................................... 559
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17.1.1 Features................................................................................................................ 17.1.2 Block Diagram ..................................................................................................... 17.1.3 Input/Output Pins ................................................................................................. 17.1.4 Register Configuration......................................................................................... 17.2 Register Descriptions ........................................................................................................ 17.2.1 Keyboard Control Register H (KBCRH) ............................................................. 17.2.2 Keyboard Control Register L (KBCRL) .............................................................. 17.2.3 Keyboard Data Buffer Register (KBBR) ............................................................. 17.2.4 Module Stop Control Register (MSTPCR) .......................................................... 17.3 Operation .......................................................................................................................... 17.3.1 Receive Operation................................................................................................ 17.3.2 Transmit Operation .............................................................................................. 17.3.3 Receive Abort ...................................................................................................... 17.3.4 KCLKI and KDI Read Timing............................................................................. 17.3.5 KCLKO and KDO Write Timing......................................................................... 17.3.6 KBF Setting Timing and KCLK Control ............................................................. 17.3.7 Receive Timing.................................................................................................... 17.3.8 KCLK Fall Interrupt Operation............................................................................ 17.3.9 Usage Note...........................................................................................................
559 561 562 562 563 563 565 567 567 568 568 570 573 576 577 578 579 580 581 583 583 583 584 585 586 587 587 588 590 592 592 593 595 595 595 597 597 599 601 601
Section 18 Host Interface .................................................................................................. 18.1 Overview........................................................................................................................... 18.1.1 Features................................................................................................................ 18.1.2 Block Diagram ..................................................................................................... 18.1.3 Input and Output Pins .......................................................................................... 18.1.4 Register Configuration......................................................................................... 18.2 Register Descriptions ........................................................................................................ 18.2.1 System Control Register (SYSCR) ...................................................................... 18.2.2 System Control Register 2 (SYSCR2) ................................................................. 18.2.3 Host Interface Control Register (HICR) .............................................................. 18.2.4 Input Data Register 1 (IDR1)............................................................................... 18.2.5 Output Data Register 1 (ODR)............................................................................. 18.2.6 Status Register (STR) .......................................................................................... 18.2.7 Module Stop Control Register (MSTPCR) .......................................................... 18.3 Operation .......................................................................................................................... 18.3.1 Host Interface Activation ..................................................................................... 18.3.2 Control States....................................................................................................... 18.3.3 A20 Gate .............................................................................................................. 18.3.4 Host Interface Pin Shutdown Function ................................................................ 18.4 Interrupts ........................................................................................................................... 18.4.1 IBF1, IBF2, IBF3, IBF4.......................................................................................
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18.4.2 HIRQ11, HIRQ1, HIRQ12, HIRQ3, and HIRQ4 ................................................ 601 18.5 Usage Note........................................................................................................................ 603
Section 19 D/A Converter ................................................................................................. 605
19.1 Overview........................................................................................................................... 19.1.1 Features................................................................................................................ 19.1.2 Block Diagram ..................................................................................................... 19.1.3 Input and Output Pins .......................................................................................... 19.1.4 Register Configuration......................................................................................... 19.2 Register Descriptions ........................................................................................................ 19.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) ................................................. 19.2.2 D/A Control Register (DACR) ............................................................................ 19.2.3 Module Stop Control Register (MSTPCR) .......................................................... 19.3 Operation .......................................................................................................................... 605 605 606 607 607 608 608 608 610 611
Section 20 A/D Converter ................................................................................................. 613
20.1 Overview........................................................................................................................... 20.1.1 Features................................................................................................................ 20.1.2 Block Diagram ..................................................................................................... 20.1.3 Pin Configuration................................................................................................. 20.1.4 Register Configuration......................................................................................... 20.2 Register Descriptions ........................................................................................................ 20.2.1 A/D Data Registers A to D (ADDRA to ADDRD).............................................. 20.2.2 A/D Control/Status Register (ADCSR) ............................................................... 20.2.3 A/D Control Register (ADCR) ............................................................................ 20.2.4 Keyboard Comparator Control Register (KBCOMP) .......................................... 20.2.5 Module Stop Control Register (MSTPCR) .......................................................... 20.3 Interface to Bus Master ..................................................................................................... 20.4 Operation .......................................................................................................................... 20.4.1 Single Mode (SCAN = 0) .................................................................................... 20.4.2 Scan Mode (SCAN = 1)....................................................................................... 20.4.3 Input Sampling and A/D Conversion Time ......................................................... 20.4.4 External Trigger Input Timing............................................................................. 20.5 Interrupts ........................................................................................................................... 20.6 Usage Notes ...................................................................................................................... 613 613 614 615 616 616 616 617 620 621 622 623 624 624 626 628 629 629 630 635 635 635 636 636
Section 21 RAM .................................................................................................................. 21.1 Overview........................................................................................................................... 21.1.1 Block Diagram ..................................................................................................... 21.1.2 Register Configuration......................................................................................... 21.2 System Control Register (SYSCR) ...................................................................................
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21.3 Operation .......................................................................................................................... 637 21.3.1 Expanded Mode (Modes 1, 2, 3 (EXPE = 1)) ...................................................... 637 21.3.2 Single-Chip Mode (Modes 2 and 3 (EXPE = 0)) ................................................. 637
Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT) ............................................................................... 639
22.1 Overview........................................................................................................................... 22.1.1 Block Diagram ..................................................................................................... 22.1.2 Register Configuration......................................................................................... 22.2 Register Descriptions ........................................................................................................ 22.2.1 Mode Control Register (MDCR) ......................................................................... 22.3 Operation .......................................................................................................................... 22.4 Overview of Flash Memory .............................................................................................. 22.4.1 Features................................................................................................................ 22.4.2 Block Diagram ..................................................................................................... 22.4.3 Flash Memory Operating Modes ......................................................................... 22.4.4 Pin Configuration................................................................................................. 22.4.5 Register Configuration......................................................................................... 22.5 Register Descriptions ........................................................................................................ 22.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 22.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 22.5.3 Erase Block Registers 1 and 2 (EBR1, EBR2)..................................................... 22.5.4 Serial/Timer Control Register (STCR) ................................................................ 22.6 On-Board Programming Modes........................................................................................ 22.6.1 Boot Mode ........................................................................................................... 22.6.2 User Program Mode............................................................................................. 22.7 Programming/Erasing Flash Memory ............................................................................... 22.7.1 Program Mode ..................................................................................................... 22.7.2 Program-Verify Mode.......................................................................................... 22.7.3 Erase Mode .......................................................................................................... 22.7.4 Erase-Verify Mode .............................................................................................. 22.8 Flash Memory Protection.................................................................................................. 22.8.1 Hardware Protection ............................................................................................ 22.8.2 Software Protection.............................................................................................. 22.8.3 Error Protection.................................................................................................... 22.9 Interrupt Handling when Programming/Erasing Flash Memory....................................... 22.10 Flash Memory Programmer Mode .................................................................................... 22.10.1 Programmer Mode Setting ................................................................................... 22.10.2 Socket Adapters and Memory Map ..................................................................... 22.10.3 Programmer Mode Operation ..............................................................................
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639 639 640 640 640 641 642 642 643 644 648 648 649 649 651 653 654 655 656 661 662 662 663 665 665 667 667 667 668 670 671 671 672 672
22.10.4 Memory Read Mode ............................................................................................ 22.10.5 Auto-Program Mode ............................................................................................ 22.10.6 Auto-Erase Mode................................................................................................. 22.10.7 Status Read Mode ................................................................................................ 22.10.8 Status Polling ....................................................................................................... 22.10.9 Programmer Mode Transition Time .................................................................... 22.10.10 Notes on Memory Programming...................................................................... 22.11 Flash Memory Programming and Erasing Precautions..................................................... 22.12 Note on Switching from F-ZTAT Version to Mask ROM Version ..................................
673 677 679 680 681 682 683 683 684
Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version) ...................................................... 685
23.1 Overview........................................................................................................................... 23.1.1 Block Diagram ..................................................................................................... 23.1.2 Register Configuration......................................................................................... 23.2 Register Descriptions ........................................................................................................ 23.2.1 Mode Control Register (MDCR) ......................................................................... 23.3 Operation .......................................................................................................................... 23.4 Overview of Flash Memory .............................................................................................. 23.4.1 Features................................................................................................................ 23.4.2 Block Diagram ..................................................................................................... 23.4.3 Flash Memory Operating Modes ......................................................................... 23.4.4 Pin Configuration................................................................................................. 23.4.5 Register Configuration......................................................................................... 23.5 Register Descriptions ........................................................................................................ 23.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 23.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 23.5.3 Erase Block Registers 1 and 2 (EBR1, EBR2)..................................................... 23.5.4 Serial/Timer Control Register (STCR) ................................................................ 23.6 On-Board Programming Modes........................................................................................ 23.6.1 Boot Mode ........................................................................................................... 23.6.2 User Program Mode............................................................................................. 23.7 Programming/Erasing Flash Memory ............................................................................... 23.7.1 Program Mode ..................................................................................................... 23.7.2 Program-Verify Mode.......................................................................................... 23.7.3 Erase Mode .......................................................................................................... 23.7.4 Erase-Verify Mode .............................................................................................. 23.8 Flash Memory Protection.................................................................................................. 23.8.1 Hardware Protection ............................................................................................ 23.8.2 Software Protection.............................................................................................. 685 685 686 686 686 687 688 688 689 690 694 694 695 695 697 699 700 701 702 707 708 708 709 711 711 713 713 713
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23.8.3 Error Protection.................................................................................................... 23.9 Interrupt Handling when Programming/Erasing Flash Memory....................................... 23.10 Flash Memory Programmer Mode .................................................................................... 23.10.1 Programmer Mode Setting ................................................................................... 23.10.2 Socket Adapters and Memory Map ..................................................................... 23.10.3 Programmer Mode Operation .............................................................................. 23.10.4 Memory Read Mode ............................................................................................ 23.10.5 Auto-Program Mode ............................................................................................ 23.10.6 Auto-Erase Mode................................................................................................. 23.10.7 Status Read Mode ................................................................................................ 23.10.8 Status Polling ....................................................................................................... 23.10.9 Programmer Mode Transition Time .................................................................... 23.10.10 Notes on Memory Programming...................................................................... 23.11 Flash Memory Programming and Erasing Precautions..................................................... 23.12 Note on Switching from F-ZTAT Version to Mask ROM Version ..................................
714 716 717 717 718 718 719 723 725 726 727 728 729 729 730 731 731 731 732 732 732 733 734 734 736 739 739 739 739 740 741
Section 24 Clock Pulse Generator .................................................................................. 24.1 Overview........................................................................................................................... 24.1.1 Block Diagram ..................................................................................................... 24.1.2 Register Configuration......................................................................................... 24.2 Register Descriptions ........................................................................................................ 24.2.1 Standby Control Register (SBYCR) .................................................................... 24.2.2 Low-Power Control Register (LPWRCR) ........................................................... 24.3 Oscillator........................................................................................................................... 24.3.1 Connecting a Crystal Resonator........................................................................... 24.3.2 External Clock Input ............................................................................................ 24.4 Duty Adjustment Circuit................................................................................................... 24.5 Medium-Speed Clock Divider .......................................................................................... 24.6 Bus Master Clock Selection Circuit .................................................................................. 24.7 Subclock Input Circuit ...................................................................................................... 24.8 Subclock Waveform Shaping Circuit................................................................................ 24.9 Clock Selection Circuit .....................................................................................................
Section 25 Power-Down State ......................................................................................... 743
25.1 Overview........................................................................................................................... 25.1.1 Register Configuration......................................................................................... 25.2 Register Descriptions ........................................................................................................ 25.2.1 Standby Control Register (SBYCR) .................................................................... 25.2.2 Low-Power Control Register (LPWRCR) ........................................................... 25.2.3 Timer Control/Status Register (TCSR) ................................................................ 25.2.4 Module Stop Control Register (MSTPCR) ..........................................................
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743 747 747 747 749 751 752
25.3 Medium-Speed Mode........................................................................................................ 25.4 Sleep Mode ....................................................................................................................... 25.4.1 Sleep Mode .......................................................................................................... 25.4.2 Clearing Sleep Mode............................................................................................ 25.5 Module Stop Mode ........................................................................................................... 25.5.1 Module Stop Mode .............................................................................................. 25.5.2 Usage Note........................................................................................................... 25.6 Software Standby Mode.................................................................................................... 25.6.1 Software Standby Mode....................................................................................... 25.6.2 Clearing Software Standby Mode ........................................................................ 25.6.3 Setting Oscillation Settling Time after Clearing Software Standby Mode .......... 25.6.4 Software Standby Mode Application Example.................................................... 25.6.5 Usage Note........................................................................................................... 25.7 Hardware Standby Mode .................................................................................................. 25.7.1 Hardware Standby Mode ..................................................................................... 25.7.2 Hardware Standby Mode Timing......................................................................... 25.8 Watch Mode...................................................................................................................... 25.8.1 Watch Mode......................................................................................................... 25.8.2 Clearing Watch Mode .......................................................................................... 25.9 Subsleep Mode.................................................................................................................. 25.9.1 Subsleep Mode..................................................................................................... 25.9.2 Clearing Subsleep Mode ...................................................................................... 25.10 Subactive Mode ................................................................................................................ 25.10.1 Subactive Mode ................................................................................................... 25.10.2 Clearing Subactive Mode..................................................................................... 25.11 Direct Transition ............................................................................................................... 25.11.1 Overview of Direct Transition ............................................................................. 25.12 Usage Notes ......................................................................................................................
753 754 754 754 755 755 756 757 757 757 757 758 759 759 759 760 761 761 761 762 762 762 763 763 763 764 764 764
Section 26 Electrical Characteristics.............................................................................. 765
26.1 Voltage of Power Supply and Operating Range ............................................................... 26.2 Electrical Characteristics of H8S/2148 F-ZTAT............................................................... 26.2.1 Absolute Maximum Ratings ................................................................................ 26.2.2 DC Characteristics ............................................................................................... 26.2.3 AC Characteristics ............................................................................................... 26.2.4 A/D Conversion Characteristics........................................................................... 26.2.5 D/A Conversion Characteristics........................................................................... 26.2.6 Flash Memory Characteristics ............................................................................. 26.2.7 Usage Note........................................................................................................... 765 768 768 769 784 796 798 799 800
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26.3 Electrical Characteristics of H8S/2148 F-ZTAT (A-mask version), H8S/2147 F-ZTAT (A-mask version), and Mask ROM Versions of H8S/2148 and H8S/2147.................................................................................................................... 26.3.1 Absolute Maximum Ratings ................................................................................ 26.3.2 DC Characteristics ............................................................................................... 26.3.3 AC Characteristics ............................................................................................... 26.3.4 A/D Conversion Characteristics........................................................................... 26.3.5 D/A Conversion Characteristics........................................................................... 26.3.6 Flash Memory Characteristics ............................................................................. 26.3.7 Usage Note........................................................................................................... 26.4 Electrical Characteristics of H8S/2147N F-ZTAT............................................................ 26.4.1 Absolute Maximum Ratings ................................................................................ 26.4.2 DC Characteristics ............................................................................................... 26.4.3 AC Characteristics ............................................................................................... 26.4.4 A/D Conversion Characteristics........................................................................... 26.4.5 D/A Conversion Characteristics........................................................................... 26.4.6 Flash Memory Characteristics ............................................................................. 26.4.7 Usage Note........................................................................................................... 26.5 Electrical Characteristics of H8S/2144 F-ZTAT, H8S/2142 F-ZTAT, and Mask ROM Version of H8S/2142.............................................................................. 26.5.1 Absolute Maximum Ratings ................................................................................ 26.5.2 DC Characteristics ............................................................................................... 26.5.3 AC Characteristics ............................................................................................... 26.5.4 A/D Conversion Characteristics........................................................................... 26.5.5 D/A Conversion Characteristics........................................................................... 26.5.6 Flash Memory Characteristics ............................................................................. 26.5.7 Usage Note........................................................................................................... 26.6 Electrical Characteristics of H8S/2144 F-ZTAT (A-mask version) and Mask ROM Versions of H8S/2144 and H8S/2143 .................................................... 26.6.1 Absolute Maximum Ratings ................................................................................ 26.6.2 DC Characteristics ............................................................................................... 26.6.3 AC Characteristics ............................................................................................... 26.6.4 A/D Conversion Characteristics........................................................................... 26.6.5 D/A Conversion Characteristics........................................................................... 26.6.6 Flash Memory Characteristics ............................................................................. 26.6.7 Usage Note........................................................................................................... 26.7 Operational Timing ........................................................................................................... 26.7.1 Test Conditions for the AC Characteristics.......................................................... 26.7.2 Clock Timing ....................................................................................................... 26.7.3 Control Signal Timing ......................................................................................... 26.7.4 Bus Timing ..........................................................................................................
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26.7.5 Timing of On-Chip Supporting Modules............................................................. 919
Appendix A Instruction Set .............................................................................................. 925
A.1 A.2 A.3 A.4 A.5 Instruction ......................................................................................................................... Instruction Codes .............................................................................................................. Operation Code Map......................................................................................................... Number of States Required for Execution ........................................................................ Bus States during Instruction Execution ........................................................................... 925 943 957 961 974
Appendix B Internal I/O Registers ................................................................................. 990
B.1 B.2 B.3 Addresses .......................................................................................................................... 990 Register Selection Conditions ........................................................................................... 997 Functions......................................................................................................................... 1004
Appendix C I/O Port Block Diagrams......................................................................... 1086
C.1 C.2 C.3 C.4 C.5 C.6 C.7 C.8 C.9 C.10 C.11 Port 1 Block Diagram ..................................................................................................... Port 2 Block Diagrams.................................................................................................... Port 3 Block Diagram ..................................................................................................... Port 4 Block Diagrams.................................................................................................... Port 5 Block Diagrams.................................................................................................... Port 6 Block Diagrams.................................................................................................... Port 7 Block Diagrams.................................................................................................... Port 8 Block Diagrams.................................................................................................... Port 9 Block Diagrams.................................................................................................... Port A Block Diagrams ................................................................................................... Port B Block Diagram..................................................................................................... 1086 1087 1090 1091 1098 1101 1106 1107 1113 1118 1121
Appendix D Pin States ..................................................................................................... 1124
D.1 Port States in Each Processing State ............................................................................... 1124
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode ............................................................................................ 1126
E.1 E.2 Timing of Transition to Hardware Standby Mode .......................................................... 1126 Timing of Recovery from Hardware Standby Mode....................................................... 1126
Appendix F Product Code Lineup ................................................................................ 1127 Appendix G Package Dimensions ................................................................................ 1129
Rev. 4.00 Sep 27, 2006 page xliii of xliv
Rev. 4.00 Sep 27, 2006 page xliv of xliv
Section 1 Overview
Section 1 Overview
1.1 Overview
This LSI comprise microcomputers (MCUs) built around the H8S/2000 CPU, employing Renesas Technology proprietary architecture, and equipped with supporting modules on-chip. The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series. On-chip supporting modules required for system configuration include a data transfer controller (DTC) bus master, ROM and RAM, a 16-bit free-running timer module (FRT), 8-bit timer module (TMR), watchdog timer module (WDT), two PWM timers (PWM and PWMX), serial communication interface (SCI), PS/2-compatible keyboard buffer controller, host interface (HIF), 2 D/A converter (DAC), A/D converter (ADC), and I/O ports. An I C bus interface (IIC) can also be incorporated as an option. The on-chip ROM is either flash memory (F-ZTAT™*) or mask ROM, with a capacity of 128, 96, or 64 kbytes. ROM is connected to the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching has been speeded up, and processing speed increased. Three operating modes, modes 1 to 3, are provided, and there is a choice of address space and single-chip mode or externally expanded modes. The features of this LSI are shown in table 1.1. Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Rev. 4.00 Sep 27, 2006 page 1 of 1130 REJ09B0327-0400
Section 1 Overview
Table 1.1
Item CPU
Overview
Specifications • General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) • High-speed operation suitable for real-time control Maximum operating frequency: 20 MHz/5 V, 10 MHz/3 V High-speed arithmetic operations 8/16/32-bit register-register add/subtract: 50 ns (20-MHz operation) 16 × 16-bit register-register multiply: 1000 ns (20-MHz operation) 32 ÷ 16-bit register-register divide: 1000 ns (20-MHz operation) • Instruction set suitable for high-speed operation Sixty-five basic instructions 8/16/32-bit transfer/arithmetic and logic instructions Unsigned/signed multiply and divide instructions Powerful bit-manipulation instructions • Two CPU operating modes Normal mode: 64-kbyte address space Advanced mode: 16-Mbyte address space
Operating modes
• Three MCU operating modes
External Data Bus Mode 1 CPU Operating Mode Normal Description Expanded mode with on-chip ROM disabled Single-chip mode Expanded mode with on-chip ROM enabled 3 Normal Single-chip mode Expanded mode with on-chip ROM enabled On-Chip ROM Disabled Initial Value 8 bits Maximum Value 16 bits
2
Advanced
Enabled Enabled
None 8 bits
None 16 bits
Enabled Enabled
None 8 bits
None 16 bits
Rev. 4.00 Sep 27, 2006 page 2 of 1130 REJ09B0327-0400
Section 1 Overview Item Bus controller Specifications • • Data transfer controller (DTC) (H8S/2148 Group) • • • • 16-bit free-running timer module (FRT: 1 channel) • • • 8-bit timer module (2 channels: TMR0, TMR1) • • • 2-state or 3-state access space can be designated for external expansion areas Number of program wait states can be set for external expansion areas Can be activated by internal interrupt or software Multiple transfers or multiple types of transfer possible for one activation source Transfer possible in repeat mode, block transfer mode, etc. Request can be sent to CPU for interrupt that activated DTC One 16-bit free-running counter (also usable for external event counting) Two output compare outputs Four input capture inputs (with buffer operation capability) One 8-bit up-counter (also usable for external event counting) Two timer constant registers The two channels can be connected
Each channel has:
Timer connection and Input/output and FRT, TMR1, TMRX, TMRY can be interconnected 8-bit timer module • Measurement of input signal or frequency-divided waveform pulse (TMR) (2 channels: width and cycle (FRT, TMR1) TMRX, TMRY) (Timer connection and • Output of waveform obtained by modification of input signal edge (FRT, TMRX provided in TMR1) H8S/2148 Group) • Determination of input signal duty cycle (TMRX) • • Watchdog timer module (WDT: 2 channels) • • Output of waveform synchronized with input signal (FRT, TMRX, TMRY) Automatic generation of cyclical waveform (FRT, TMRY) Watchdog timer or interval timer function selectable Subclock operation capability (channel 1 only) Up to 16 outputs Pulse duty cycle settable from 0 to 100% Resolution: 1/256 1.25 MHz maximum carrier frequency (20-MHz operation)
8-bit PWM timer • (PWM) • (H8S/2148 Group and • H8S/2147N) •
Rev. 4.00 Sep 27, 2006 page 3 of 1130 REJ09B0327-0400
Section 1 Overview Item 14-bit PWM timer (PWMX) Specifications • • • Serial communication • interface • (SCI: 2 channels, SCI0 and SCI1) SCI with IrDA: 1 channel (SCI2) • • • • Keyboard buffer controller (PS2: 3 channels) (H8S/2148 Group, H8S/2147N) Host interface (HIF) (H8S/2148 Group, H8S/2147N) • • • • • • • • Keyboard controller A/D converter • • • Up to 2 outputs Resolution: 1/16384 312.5 kHz maximum carrier frequency (20-MHz operation) Asynchronous mode or synchronous mode selectable Multiprocessor communication function
Asynchronous mode or synchronous mode selectable Multiprocessor communication function Compatible with IrDA specification version 1.0 TxD and RxD encoding/decoding in IrDA format Compatible with PS/2 interface Direct manipulation of transmission output by software Receive data input to 8-bit shift register Data receive completed interrupt, parity error detection, stop bit monitoring 8-bit host interface (ISA) port Five host interrupt requests (HIRQ11, HIRQ1, HIRQ12, HIRQ3, HIRQ4) Normal and fast A20 gate output Four register sets (each comprising two data registers and two status registers) Matrix keyboard control using keyboard scan with wakeup interrupt and sense port configuration Resolution: 10 bits Input: 8 channels (dedicated analog pins) 16 channels (same pins as keyboard sense port)
• • • •
High-speed conversion: 6.7 µs minimum conversion time (20-MHz operation) Single or scan mode selectable Sample-and-hold function A/D conversion can be activated by external trigger or timer trigger
Rev. 4.00 Sep 27, 2006 page 4 of 1130 REJ09B0327-0400
Section 1 Overview Item D/A converter I/O ports Specifications • • • • • Memory • • Resolution: 8 bits Output: 2 channels 74 input/output pins (including 24 with LED drive capability) 8 input-only pins VCCB (separate power supply) drive pins among I/O pins (H8S/2148 Group and H8S/2147N) Flash memory or mask ROM High-speed static RAM
ROM 128 kbytes 96 kbytes 64 kbytes RAM 4 kbytes 4 kbytes 2 kbytes
Product Name H8S/2144, H8S/2148 H8S/2143 H8S/2142, H8S/2147, H8S/2147N
Interrupt controller
• • •
Nine external interrupt pins (NMI, IRQ0 to IRQ7) 44 internal interrupt sources Three priority levels settable Medium-speed mode Sleep mode Module stop mode Software standby mode Hardware standby mode Subclock operation Built-in duty correction circuit 100-pin plastic QFP (FP-100B) 100-pin plastic TQFP (TFP-100B) Conforms to Philips I C bus interface standard Single master mode/slave mode Arbitration lost condition can be identified Supports two slave addresses
2
Power-down state
• • • • • •
Clock pulse generator • Packages I C bus interface (IIC: 2 channels) (option in H8S/2148 Group and H8S/2147N)
2
• • • • • •
Rev. 4.00 Sep 27, 2006 page 5 of 1130 REJ09B0327-0400
Section 1 Overview Item Product lineup (preliminary)
Group H8S/2148
Specifications
Product Code*2 Mask ROM Versions HD6432148S HD6432148SW*1 HD6432147S HD6432147SW*1 H8S/2147N H8S/2144 — HD6432144S F-ZTAT Versions HD64F2148 HD64F2148V*2 HD64F2148A HD64F2148AV*2 HD64F2147A HD64F2147AV*2 HD64F2147N HD64F2147NV*2 HD64F2144 HD64F2144V*2 HD64F2144A HD64F2144AV*2 HD6432143S HD6432142
2
ROM/RAM (Bytes) 128 k/4 k
Packages FP-100B, TFP-100B
64 k/2 k
64 k/2 k 128 k/4 k
— HD64F2142R HD64F2142RV*2
96 k/4 k 64 k/2 k
Notes: 1. W indicates the I C bus option. 2. V indicates the 3-V version. Please refer to appendix F, Product Code Lineup.
Rev. 4.00 Sep 27, 2006 page 6 of 1130 REJ09B0327-0400
Section 1 Overview
1.2
Internal Block Diagram
An internal block diagram of the H8S/2148 Group is shown in figure 1.1 (a), an internal block diagram of the H8S/2147N is shown in figure 1.1 (b), and an internal block diagram of the H8S/2144 Group in figure 1.1 (c).
VCC1 VCC2 (VCL) VSS VSS VSS VSS VSS
Internal address bus
Internal data bus
H8S/2000 CPU
Bus controller
EXTAL VCCB MD1 MD0 NMI STBY RESO P97/WAIT/SDA0 P96/φ/EXCL P95/AS/IOS/CS1 P94/HWR/IOW P93/RD/IOR P92/IRQ0 P91/IRQ1 P90/LWR/IRQ2/ADTRG/ECS2 P67/TMOX/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4/CLAMPO P63/FTIB/CIN3/KIN3/VFBACKI P62/FTIA/CIN2/KIN2/VSYNCI/TMIY P61/FTOA/CIN1/KIN1/VSYNCO P60/FTCI/CIN0/KIN0/HFBACKI/TMIX P47/PWX1 P46/PWX0 P45/TMRI1/HIRQ12/CSYNCI P44/TMO1/HIRQ1/HSYNCO P43/TMCI1/HIRQ11/HSYNCI P42/TMRI0/SCK2/SDA1 P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD
Port 4
Clock pulse generator
RES XTAL
PA7/A23/KIN15/CIN15/PS2CD PA6/A22/KIN14/CIN14/PS2CC PA5/A21/KIN13/CIN13/PS2BD PA4/A20/KIN12/CIN12/PS2BC PA3/A19/KIN11/CIN11/PS2AD PA2/A18/KIN10/CIN10/PS2AC PA1/A17/KIN9/CIN9 PA0/A16/KIN8/CIN8 P27/A15/PW15/CBLANK P26/A14/PW14 P25/A13/PW13 P24/A12/PW12 P23/A11/PW11 P22/A10/PW10 P21/A9/PW9 P20/A8/PW8 P17/A7/PW7 P16/A6/PW6 P15/A5/PW5 P14/A4/PW4 P13/A3/PW3 P12/A2/PW2 P11/A1/PW1 P10/A0/PW0 P37/D15/HDB7 P36/D14/HDB6 P35/D13/HDB5 P34/D12/HDB4 P33/D11/HDB3 P32/D10/HDB2 P31/D9/HDB1 P30/D8/HDB0 PB7/D7 PB6/D6 PB5/D5 PB4/D4 PB3/D3/CS4 PB2/D2/CS3 PB1/D1/HIRQ4 PB0/D0/HIRQ3
Port B P71/AN1 P70/AN0 Port A Port 3 Port 1 Port 2
Interrupt controller
Port 9
DTC
ROM WDT0, WDT1
RAM
Keyboard buffer controller × 3ch
Port 6
16-bit FRT
8-bit PWM
14-bit PWM 8-bit timer × 4ch (TMR0, TMR1, TMRX, TMRY) Timer connection
Host interface
10-bit A/D
SCI × 3ch (IrDA × 1ch)
Port 5
8-bit D/A
P52/SCK0/SCL0 P51/RxD0 P50/TxD0
IIC × 2ch (option)
Port 8
Port 7
P86/IRQ5/SCK1/SCL1 P85/IRQ4/RxD1
P77/AN7/DA1 P76/AN6/DA0
AVref AVCC
AVSS
P84/IRQ3/TxD1 P83 P82/HIFSD
Figure 1.1 (a) Internal Block Diagram of H8S/2148 Group
Rev. 4.00 Sep 27, 2006 page 7 of 1130 REJ09B0327-0400
P81/CS2/GA20 P80/HA0
P75/AN5 P74/AN4 P73/AN3 P72/AN2
Section 1 Overview
VCC1 VCC2
VSS VSS
VSS VSS VSS
Internal address bus
RES XTAL EXTAL VCCB MD1 MD0 NMI STBY RESO P97/WAIT/SDA0 P96/φ/EXCL P95/AS/IOS/CS1 P94/HWR/IOW P93/RD/IOR P92/IRQ0 P91/IRQ1 P90/LWR/IRQ2/ADTRG/ECS2 P67/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4 P63/FTIB/CIN3/KIN3 P62/FTIA/CIN2/KIN2/TMIY P61/FTOA/CIN1/KIN1 P60/FTCI/CIN0/KIN0 P47/PWX1 P46/PWX0 P45/TMRI1/HIRQ12 P44/TMO1/HIRQ1 P43/TMCI1/HIRQ11 P42/TMRI0/SCK2/SDA1 P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD
Clock pulse generator
Internal data bus
H8S/2000 CPU
Bus controller
PA7/A23/KIN15/CIN15/PS2CD PA6/A22/KIN14/CIN14/PS2CC PA5/A21/KIN13/CIN13/PS2BD PA4/A20/KIN12/CIN12/PS2BC PA3/A19/KIN11/CIN11/PS2AD PA2/A18/KIN10/CIN10/PS2AC PA1/A17/KIN9/CIN9 PA0/A16/KIN8/CIN8 P27/A15/PW15 P26/A14/PW14 P25/A13/PW13 P24/A12/PW12 P23/A11/PW11 P22/A10/PW10 P21/A9/PW9 P20/A8/PW8
Port 9
ROM WDT0, WDT1
Port 2
Interrupt controller
Port A
P17/A7/PW7 P16/A6/PW6 P15/A5/PW5 P14/A4/PW4 P13/A3/PW3 P12/A2/PW2 P11/A1/PW1 P10/A0/PW0 P37/D15/HDB7
RAM
Keyboard buffer controller × 3ch
Port 6
16-bit FRT
8-bit PWM
Port 1
14-bit PWM
Port 4
8-bit timer × 3ch (TMR0, TMR1, TMRY)
Host interface
P36/D14/HDB6 P35/D13/HDB5 P34/D12/HDB4 P33/D11/HDB3 P32/D10/HDB2 P31/D9/HDB1 P30/D8/HDB0 PB7/D7 PB6/D6 PB5/D5 PB4/D4 PB3/D3/CS4 PB2/D2/CS3 PB1/D1/HIRQ4 PB0/D0/HIRQ3
10-bit A/D
8-bit D/A
P51/RxD0 P50/TxD0
Port 5
P52/SCK0/SCL0
IIC × 2ch (option)
Port 8
Port 7
P86/IRQ5/SCK1/SCL1 P85/IRQ4/RxD1 P84/IRQ3/TxD1 P83
P77/AN7/DA1 P76/AN6/DA0 P75/AN5
AVref AVCC AVSS
P74/AN4 P73/AN3 P72/AN2
Figure 1.1 (b) Internal Block Diagram of H8S/2147N
Rev. 4.00 Sep 27, 2006 page 8 of 1130 REJ09B0327-0400
P82/HIFSD P81/CS2/GA20 P80/HA0
P71/AN1 P70/AN0
Port B
SCI × 3ch (IrDA × 1ch)
Port 3
Section 1 Overview
VCC1 VCC2 (VCL) VSS VSS VSS VSS VSS
Clock pulse generator
Internal address bus
Internal data bus
Bus controller
RES XTAL EXTAL MD1 MD0 NMI STBY RESO P97/WAIT P96/φ/EXCL P95/AS/IOS P94/HWR P93/RD P92/IRQ0 P91/IRQ1 P90/LWR/IRQ2/ADTRG P67/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4 P63/FTIB/CIN3/KIN3 P62/FTIA/CIN2/KIN2/TMIY P61/FTOA/CIN1/KIN1 P60/FTCI/CIN0/KIN0 P47/PWX1 P46/PWX0 P45/TMRI1 P44/TMO1 P43/TMCI1 P42/TMRI0/SCK2 P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD
PA7/A23/KIN15/CIN15 PA6/A22/KIN14/CIN14 PA5/A21/KIN13/CIN13 PA4/A20/KIN12/CIN12 PA3/A19/KIN11/CIN11 PA2/A18/KIN10/CIN10 PA1/A17/KIN9/CIN9 PA0/A16/KIN8/CIN8 P27/A15 P26/A14 P25/A13 P24/A12 P23/A11 P22/A10 P21/A9 P20/A8
H8S/2000 CPU
Interrupt controller
Port 9
ROM WDT0, WDT1
Port 2
Port A
Port 1
P17/A7 P16/A6 P15/A5 P14/A4 P13/A3 P12/A2 P11/A1 P10/A0 P37/D15 P36/D14 P35/D13 P34/D12 P33/D11 P32/D10 P31/D9 P30/D8 PB7/D7 PB6/D6 PB5/D5 PB4/D4 PB3/D3 PB2/D2 PB1/D1 PB0/D0
RAM
Port 6
16-bit FRT
14-bit PWM
Port 4
8-bit timer × 3ch (TMR0, TMR1, TMRY)
10-bit A/D
8-bit D/A
P52/SCK0 P51/RxD0 P50/TxD0
Port 5
Port 8
Port 7
AVref AVCC
P86/IRQ5/SCK1 P85/IRQ4/RxD1
AVSS
P84/IRQ3/TxD1 P83
P77/AN7/DA1 P76/AN6/DA0
P75/AN5 P74/AN4
P73/AN3 P72/AN2 P71/AN1
Figure 1.1 (c) Internal Block Diagram of H8S/2144 Group
P82 P81 P80
Rev. 4.00 Sep 27, 2006 page 9 of 1130 REJ09B0327-0400
P70/AN0
Port B
SCI × 3ch (IrDA × 1ch)
Port 3
Section 1 Overview
1.3
1.3.1
Pin Arrangement and Functions
Pin Arrangement
The pin arrangement of the H8S/2148 Group is shown in figure 1.2 (a), the pin arrangement of the H8S/2147N is shown in figure 1.2 (b), and the pin arrangement of the H8S/2144 Group in figure 1.2 (c).
P45/TMRI1/HIRQ12/CSYNCI P43/TMCI1/HIRQ11/HSYNCI P44/TMO1/HIRQ1/HSYNCO
P27/A15/PW15/CBLANK
PW3/A3/P13 PW2/A2/P12 PW1/A1/P11 PW0/A0/P10 CS4/D3/PB3 CS3/D2/PB2 HDB0/D8/P30 HDB1/D9/P31 HDB2/D10/P32 HDB3/D11/P33 HDB4/D12/P34 HDB5/D13/P35 HDB6/D14/P36 HDB7/D15/P37 HIRQ4/D1/PB1 HIRQ3/D0/PB0 VSS HA0/P80 GA20/CS2/P81 HIFSD/P82 P83 TxD1/IRQ3/P84 RxD1/IRQ4/P85 SCL1/SCK1/IRQ5/P86 RESO
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 50 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 1 2 3 4 5 6 7 8 49 48 47 46 45 44 43 42 41 40
P42/TMRI0/SCK2/SDA1
P22/A10/PW10
P23/A11/PW11
P24/A12/PW12
P25/A13/PW13
P26/A14/PW14
P14/A4/PW4
P15/A5/PW5
P16/A6/PW6
P17/A7/PW7
P20/A8/PW8
P21/A9/PW9
P47/PWX1
P46/PWX0
PB4/D4
PB5/D5
PB6/D6
PB7/D7
VCC1
VSS
VSS
P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD PA0/A16/CIN8/KIN8 PA1/A17/CIN9/KIN9 AVSS P77/AN7/DA1 P76/AN6/DA0 P75/AN5 P74/AN4 P73/AN3 P72/AN2 P71/AN1 P70/AN0 AVCC AVref P67/TMOX/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4/CLAMPO PA2/A18/CIN10/KIN10/PS2AC PA3/A19/CIN11/KIN11/PS2AD P63/FTIB/CIN3/KIN3/VFBACKI P62/FTIA/CIN2/KIN2/VSYNCI/TMIY P61/FTOA/CIN1/KIN1/VSYNCO P60/FTCI/CIN0/KIN0/HFBACKI/TMIX
FP-100B TFP-100B (Top View)
39 38 37 36 35 34 33 32 31 30 29 28 27
26 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
STBY
VCC2 (VCL)
MD1
MD0
NMI
SCL0/SCK0/P52
RxD0/P51
SDA0/WAIT/P97
PS2CD/KIN15/CIN15/A23/PA7
PS2CC/KIN14/CIN14/A22/PA6
EXCL/φ/P96
XTAL
EXTAL
TxD0/P50
CS1/ IOS/ AS/P95
IOW/ HWR/P94
IOR/ RD/P93
IRQ0/P92
IRQ1/P91
PS2BD/KIN13/CIN13/A21/PA5
Figure 1.2 (a) Pin Arrangement of H8S/2148 Group (FP-100B, TFP-100B: Top View)
Rev. 4.00 Sep 27, 2006 page 10 of 1130 REJ09B0327-0400
PS2BC/KIN12/CIN12/A20/PA4
ADTRG/IRQ2/ECS2/LWR/P90
RES
VCCB
VSS
Section 1 Overview
PW3/A3/P13 PW2/A2/P12 PW1/A1/P11 PW0/A0/P10 CS4/D3/PB3 CS3/D2/PB2 HDB0/D8/P30 HDB1/D9/P31 HDB2/D10/P32 HDB3/D11/P33 HDB4/D12/P34 HDB5/D13/P35 HDB6/D14/P36 HDB7/D15/P37 HIRQ4/D1/PB1 HIRQ3/D0/PB0 VSS HA0/P80 GA20/CS2/P81 HIFSD/P82 P83 TxD1/IRQ3/P84 RxD1/IRQ4/P85 SCL1/SCK1/IRQ5/P86 RESO
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 50 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 1 2 3 4 5 6 7 8 49 48 47 46 45 44 43 42 41 40
P42/TMRI0/SCK2/SDA1
P45/TMRI1/HIRQ12
P43/TMCI1/HIRQ11
P44/TMO1/HIRQ1
P22/A10/PW10
P23/A11/PW11
P24/A12/PW12
P25/A13/PW13
P26/A14/PW14
P27/A15/PW15
P14/A4/PW4
P15/A5/PW5
P16/A6/PW6
P17/A7/PW7
P20/A8/PW8
P21/A9/PW9
P47/PWX1
P46/PWX0
PB4/D4
PB5/D5
PB6/D6
PB7/D7
VCC1
VSS
VSS
P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD PA0/A16/CIN8/KIN8 PA1/A17/CIN9/KIN9 AVSS P77/AN7/DA1 P76/AN6/DA0 P75/AN5 P74/AN4 P73/AN3 P72/AN2 P71/AN1 P70/AN0 AVCC AVref P67/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4 PA2/A18/CIN10/KIN10/PS2AC PA3/A19/CIN11/KIN11/PS2AD P63/FTIB/CIN3/KIN3 P62/FTIA/CIN2/KIN2/TMIY P61/FTOA/CIN1/KIN1 P60/FTCI/CIN0/KIN0
FP-100B TFP-100B (Top View)
39 38 37 36 35 34 33 32 31 30 29 28 27
26 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
RES
XTAL
VCCB
VCC2
EXTAL
PS2CD/KIN15/CIN15/A23/PA7
PS2CC/KIN14/CIN14/A22/PA6
TxD0/P50
MD1
MD0
STBY
VSS
NMI
SDA0/WAIT/P97
SCL0/SCK0/P52
EXCL/φ/P96
RxD0/P51
CS1/ IOS/ AS/P95
PS2BD/KIN13/CIN13/A21/PA5
PS2BC/KIN12/CIN12/A20/PA4
IOW/ HWR/P94
IOR/ RD/P93
IRQ0/P92
IRQ1/P91
Figure 1.2 (b) Pin Arrangement of H8S/2147N (FP-100B, TFP-100B: Top View)
Rev. 4.00 Sep 27, 2006 page 11 of 1130 REJ09B0327-0400
ADTRG/IRQ2/ECS2/LWR/P90
Section 1 Overview
A3/P13 A2/P12 A1/P11 A0/P10 D3/PB3 D2/PB2 D8/P30 D9/P31 D10/P32 D11/P33 D12/P34 D13/P35 D14/P36 D15/P37 D1/PB1 D0/PB0 VSS P80 P81 P82 P83 TxD1/IRQ3/P84 RxD1/IRQ4/P85 SCK1/IRQ5/P86 RESO
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 1 2 3 4 5 6 7 8 49 48 47 46 45 44 43 42 41 40
P42/TMRI0/SCK2
P45/TMRI1
P43/TMCI1
P47/PWX1
P46/PWX0
P44/TMO1
P22/A10
P23/A11
P24/A12
P25/A13
P26/A14
P27/A15
PB4/D4
PB5/D5
PB6/D6
PB7/D7
P14/A4
P15/A5
P16/A6
P17/A7
P20/A8
P21/A9
VCC1
VSS
VSS
P41/TMO0/RxD2/IrRxD P40/TMCI0/TxD2/IrTxD PA0/A16/CIN8/KIN8 PA1/A17/CIN9/KIN9 AVSS P77/AN7/DA1 P76/AN6/DA0 P75/AN5 P74/AN4 P73/AN3 P72/AN2 P71/AN1 P70/AN0 AVCC AVref P67/CIN7/KIN7/IRQ7 P66/FTOB/CIN6/KIN6/IRQ6 P65/FTID/CIN5/KIN5 P64/FTIC/CIN4/KIN4 PA2/A18/CIN10/KIN10 PA3/A19/CIN11/KIN11 P63/FTIB/CIN3/KIN3 P62/FTIA/CIN2/KIN2/TMIY P61/FTOA/CIN1/KIN1 P60/FTCI/CIN0/KIN0
FP-100B TFP-100B (Top View)
39 38 37 36 35 34 33 32 31 30 29 28 27
26 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
KIN15/CIN15/A23/PA7
KIN14/CIN14/A22/PA6
KIN13/CIN13/A21/PA5
KIN12/CIN12/A20/PA4
VCC2 (VCL)
SCK0/P52
RxD0/P51
TxD0/P50
EXTAL
RES
XTAL
VCC1
STBY
WAIT/P97
EXCL/φ/P96
IOS/ AS/P95
HWR/P94
RD/P93
IRQ0/P92
IRQ1/P91
Figure 1.2 (c) Pin Arrangement of H8S/2144 Group (FP-100B, TFP-100B: Top View)
Rev. 4.00 Sep 27, 2006 page 12 of 1130 REJ09B0327-0400
ADTRG/IRQ2/LWR/P90
MD1
MD0
NMI
VSS
Section 1 Overview
1.3.2
Pin Functions in Each Operating Mode
Tables 1.2 (a), (b) and (c) show the pin functions of the H8S/2148 Group, H8S/2147N, and H8S/2144 Group in each of the operating modes. Table 1.2 (a) H8S/2148 Group Pin Functions in Each Operating Mode
Pin Name Pin No. FP-100B TFP-100B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Mode 1 RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 (VCL) PA7/CIN15/ KIN15/PS2CD PA6/CIN14/ KIN14/PS2CC P51/RxD0 P50/TxD0 VSS P96/φ/EXCL AS/IOS HWR PA5/CIN13/ KIN13/PS2BD PA4/CIN12/ KIN12/PS2BC Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 (VCL) A23/PA7/CIN15/ KIN15/PS2CD A22/PA6/CIN14/ KIN14/PS2CC P51/RxD0 P50/TxD0 VSS P96/φ/EXCL AS/IOS HWR A21/PA5/CIN13/ KIN13/PS2BD A20/PA4/CIN12/ KIN12/PS2BC Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 (VCL) PA7/CIN15/ KIN15/PS2CD PA6/CIN14/ KIN14/PS2CC P52/SCK0/SCL0 P51/RxD0 P50/TxD0 VSS P97/SDA0 P96/φ/EXCL P95/CS1 P94/IOW PA5/CIN13/ KIN13/PS2BD PA4/CIN12/ KIN12/PS2BC Flash Memory Writer Mode RES XTAL EXTAL VCC VSS VSS FA9 VCC VCC NC NC NC FA17 NC VSS VCC NC FA16 FA15 NC NC
P52/SCK0/SCL0 P52/SCK0/SCL0
P97/WAIT/SDA0 P97/WAIT/SDA0
Rev. 4.00 Sep 27, 2006 page 13 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 22 23 24 25 26 Mode 1 RD P92/IRQ0 P91/IRQ1 LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0/TMIX/ HFBACKI Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) RD P92/IRQ0 P91/IRQ1 LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0/TMIX/ HFBACKI Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P93/IOR P92/IRQ0 P91/IRQ1 P90/IRQ2/ADTRG/ ECS2 P60/FTCI/CIN0/ KIN0/TMIX/ HFBACKI P61/FTOA/CIN1/ KIN1/VSYNCO P62/FTIA/CIN2/ KIN2/TMIY/ VSYNCI P63/FTIB/CIN3/ KIN3/VFBACKI PA3/CIN11/ KIN11/PS2AD PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4/CLAMPO P65/FTID/CIN5/ KIN5 P66/FTOB/CIN6/ KIN6/IRQ6 P67/TMOX/CIN7/ KIN7/IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 Flash Memory Writer Mode WE VSS VCC VCC NC
27 28
P61/FTOA/CIN1/ P61/FTOA/CIN1/ KIN1/VSYNCO KIN1/VSYNCO P62/FTIA/CIN2/ KIN2/TMIY/ VSYNCI P63/FTIB/CIN3/ KIN3/VFBACKI PA3/CIN11/ KIN11/PS2AD PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4/CLAMPO P65/FTID/CIN5/ KIN5 P62/FTIA/CIN2/ KIN2/TMIY/ VSYNCI P63/FTIB/CIN3/ KIN3/VFBACKI A19/PA3/CIN11/ KIN11/PS2AD A18/PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4/CLAMPO P65/FTID/CIN5/ KIN5
NC NC
29 30 31 32 33 34 35 36 37 38 39 40 41
NC NC NC NC NC NC VSS VCC VCC NC NC NC NC
P66/FTOB/CIN6/ P66/FTOB/CIN6/ KIN6/IRQ6 KIN6/IRQ6 P67/TMOX/CIN7/ P67/TMOX/CIN7/ KIN7/IRQ7 KIN7/IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3
Rev. 4.00 Sep 27, 2006 page 14 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Mode 1 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1/ HSYNCI P44/TMO1/ HSYNCO P45/TMRI1/ CSYNCI P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15 A14 A13 A12 A11 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS A17/PA1/CIN9/ KIN9 A16/PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1/ HSYNCI P44/TMO1/ HSYNCO P45/TMRI1/ CSYNCI P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15/P27/PW15/ CBLANK A14/P26/PW14 A13/P25/PW13 A12/P24/PW12 A11/P23/PW11 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1/HIRQ11/ HSYNCI P44/TMO1/HIRQ1/ HSYNCO P45/TMRI1/HIRQ12/ CSYNCI P46/PWX0 P47/PWX1 PB7 PB6 VCC1 P27/PW15/ CBLANK P26/PW14 P25/PW13 P24/PW12 P23/PW11 Flash Memory Writer Mode NC NC NC NC VSS NC NC NC NC NC NC NC NC NC NC NC NC VCC CE FA14 FA13 FA12 FA11
Rev. 4.00 Sep 27, 2006 page 15 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 Mode 1 A10 A9 A8 PB5/D5 PB4/D4 VSS VSS A7 A6 A5 A4 A3 A2 A1 A0 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) A10/P22/PW10 A9/P21/PW9 A8/P20/PW8 PB5/D5 PB4/D4 VSS VSS A7/P17/PW7 A6/P16/PW6 A5/P15/PW5 A4/P14/PW4 A3/P13/PW3 A2/P12/PW2 A1/P11/PW1 A0/P10/PW0 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P22/PW10 P21/PW9 P20/PW8 PB5 PB4 VSS VSS P17/PW7 P16/PW6 P15/PW5 P14/PW4 P13/PW3 P12/PW2 P11/PW1 P10/PW0 PB3/CS4 PB2/CS3 P30/HDB0 P31/HDB1 P32/HDB2 P33/HDB3 P34/HDB4 P35/HDB5 P36/HDB6 P37/HDB7 PB1/HIRQ4 PB0/HIRQ3 VSS P80/HA0 Flash Memory Writer Mode FA10 OE FA8 NC NC VSS VSS FA7 FA6 FA5 FA4 FA3 FA2 FA1 FA0 NC NC FO0 FO1 FO2 FO3 FO4 FO5 FO6 FO7 NC NC VSS NC
Rev. 4.00 Sep 27, 2006 page 16 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 94 95 96 97 98 99 100 Mode 1 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P81/CS2/GA20 P82/HIFSD P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 P86/IRQ5/SCK1/ SCL1 RESO Flash Memory Writer Mode NC NC NC NC NC NC NC
P86/IRQ5/SCK1/ P86/IRQ5/SCK1/ SCL1 SCL1 RESO RESO
Rev. 4.00 Sep 27, 2006 page 17 of 1130 REJ09B0327-0400
Section 1 Overview
Table 1.2 (b) H8S/2147N Pin Functions in Each Operating Mode
Pin Name Pin No. FP-100B TFP-100B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Mode 1 RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 PA7/CIN15/ KIN15/PS2CD PA6/CIN14/ KIN14/PS2CC P51/RxD0 P50/TxD0 VSS φ/P96/EXCL AS/IOS HWR PA5/CIN13/ KIN13/PS2BD PA4/CIN12/ KIN12/PS2BC RD P92/IRQ0 P91/IRQ1 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 A23/PA7/CIN15/ KIN15/PS2CD A22/PA6/CIN14/ KIN14/PS2CC P51/RxD0 P50/TxD0 VSS φ/P96/EXCL AS/IOS HWR A21/PA5/CIN13/ KIN13/PS2BD A20/PA4/CIN12/ KIN12/PS2BC RD P92/IRQ0 P91/IRQ1 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) RES XTAL EXTAL VCCB MD1 MD0 NMI STBY VCC2 PA7/CIN15/ KIN15/PS2CD PA6/CIN14/ KIN14/PS2CC P52/SCK0/SCL0 P51/RxD0 P50/TxD0 VSS P97/SDA0 P96/φ/EXCL P95/CS1 P94/IOW PA5/CIN13/ KIN13/PS2BD PA4/CIN12/ KIN12/PS2BC P93/IOR P92/IRQ0 P91/IRQ1 Flash Memory Writer Mode RES XTAL EXTAL VCC VSS VSS FA9 VCC VCC NC NC NC FA17 NC VSS VCC NC FA16 FA15 NC NC WE VSS VCC
P52/SCK0/SCL0 P52/SCK0/SCL0
P97/WAIT/SDA0 P97/WAIT/SDA0
Rev. 4.00 Sep 27, 2006 page 18 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 Mode 1 LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P90/IRQ2/ADTRG/ ECS2 P60/FTCI/CIN0/ KIN0 P61/FTOA/CIN1/ KIN1 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 PA3/CIN11/ KIN11/PS2AD PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5 P66/FTOB/CIN6/ KIN6/IRQ6 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 Flash Memory Writer Mode VCC NC NC NC NC NC NC NC NC NC VSS VCC VCC NC NC NC NC NC NC NC NC
P61/FTOA/CIN1/ P61/FTOA/CIN1/ KIN1 KIN1 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 PA3/CIN11/ KIN11/PS2AD PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 A19/PA3/CIN11/ KIN11/PS2AD A18/PA2/CIN10/ KIN10/PS2AC P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5
P66/FTOB/CIN6/ P66/FTOB/CIN6/ KIN6/IRQ6 KIN6/IRQ6 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1
Rev. 4.00 Sep 27, 2006 page 19 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 Mode 1 AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1 P44/TMO1 P45/TMRI1 P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15 A14 A13 A12 A11 A10 A9 A8 PB5/D5 PB4/D4 VSS VSS Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) AVSS A17/PA1/CIN9/ KIN9 A16/PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1 P44/TMO1 P45/TMRI1 P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15/P27/PW15 A14/P26/PW14 A13/P25/PW13 A12/P24/PW12 A11/P23/PW11 A10/P22/PW10 A9/P21/PW9 A8/P20/PW8 PB5/D5 PB4/D4 VSS VSS Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2/SDA1 P43/TMCI1/HIRQ11 P44/TMO1/HIRQ1 P45/TMRI1/HIRQ12 P46/PWX0 P47/PWX1 PB7 PB6 VCC1 P27/PW15 P26/PW14 P25/PW13 P24/PW12 P23/PW11 P22/PW10 P21/PW9 P20/PW8 PB5 PB4 VSS VSS Flash Memory Writer Mode VSS NC NC NC NC NC NC NC NC NC NC NC NC VCC CE FA14 FA13 FA12 FA11 FA10 OE FA8 NC NC VSS VSS
Rev. 4.00 Sep 27, 2006 page 20 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 Mode 1 A7 A6 A5 A4 A3 A2 A1 A0 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) A7/P17/PW7 A6/P16/PW6 A5/P15/PW5 A4/P14/PW4 A3/P13/PW3 A2/P12/PW2 A1/P11/PW1 A0/P10/PW0 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P17/PW7 P16/PW6 P15/PW5 P14/PW4 P13/PW3 P12/PW2 P11/PW1 P10/PW0 PB3/CS4 PB2/CS3 P30/HDB0 P31/HDB1 P32/HDB2 P33/HDB3 P34/HDB4 P35/HDB5 P36/HDB6 P37/HDB7 PB1/HIRQ4 PB0/HIRQ3 VSS P80/HA0 P81/CS2/GA20 P82/HIFSD P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 P86/IRQ5/SCK1/ SCL1 RESO Flash Memory Writer Mode FA7 FA6 FA5 FA4 FA3 FA2 FA1 FA0 NC NC FO0 FO1 FO2 FO3 FO4 FO5 FO6 FO7 NC NC VSS NC NC NC NC NC NC NC NC
P86/IRQ5/SCK1/ P86/IRQ5/SCK1/ SCL1 SCL1 RESO RESO
Rev. 4.00 Sep 27, 2006 page 21 of 1130 REJ09B0327-0400
Section 1 Overview
Table 1.2 (c) H8S/2144 Group Pin Functions in Each Operating Mode
Pin Name Pin No. FP-100B TFP-100B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Mode 1 RES XTAL EXTAL VCC1 MD1 MD0 NMI STBY VCC2 (VCL) PA7/CIN15/ KIN15 PA6/CIN14/ KIN14 P52/SCK0 P51/RxD0 P50/TxD0 VSS P97/WAIT φ/P96/EXCL AS/IOS HWR PA5/CIN13/ KIN13 PA4/CIN12/ KIN12 RD P92/IRQ0 P91/IRQ1 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) RES XTAL EXTAL VCC1 MD1 MD0 NMI STBY VCC2 (VCL) A23/PA7/CIN15/ KIN15 A22/PA6/CIN14/ KIN14 P52/SCK0 P51/RxD0 P50/TxD0 VSS P97/WAIT φ/P96/EXCL AS/IOS HWR A21/PA5/CIN13/ KIN13 A20/PA4/CIN12/ KIN12 RD P92/IRQ0 P91/IRQ1 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) RES XTAL EXTAL VCC1 MD1 MD0 NMI STBY VCC2 (VCL) PA7/CIN15/ KIN15 PA6/CIN14/ KIN14 P52/SCK0 P51/RxD0 P50/TxD0 VSS P97 P96/φ/EXCL P95 P94 PA5/CIN13/ KIN13 PA4/CIN12/KIN12 P93 P92/IRQ0 P91/IRQ1 Flash Memory Writer Mode RES XTAL EXTAL VCC VSS VSS FA9 VCC VCC NC NC NC FA17 NC VSS VCC NC FA16 FA15 NC NC WE VSS VCC
Rev. 4.00 Sep 27, 2006 page 22 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 Mode 1 LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0 P61/FTOA/ CIN1/KIN1 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 PA3/CIN11/ KIN11 PA2/CIN10/ KIN10 P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5 Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) LWR/P90/IRQ2/ ADTRG P60/FTCI/CIN0/ KIN0 P61/FTOA/CIN1/ KIN1 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 A19/PA3/CIN11/ KIN11 A18/PA2/CIN10/ KIN10 P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5 Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P90/IRQ2/ADTRG P60/FTCI/CIN0/ KIN0 P61/FTOA/CIN1/ KIN1 P62/FTIA/CIN2/ KIN2/TMIY P63/FTIB/CIN3/ KIN3 PA3/CIN11/ KIN11 PA2/CIN10/ KIN10 P64/FTIC/CIN4/ KIN4 P65/FTID/CIN5/ KIN5 P66/FTOB/CIN6/ KIN6/IRQ6 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 Flash Memory Writer Mode VCC NC NC NC NC NC NC NC NC NC VSS VCC VCC NC NC NC NC NC NC NC NC
P66/FTOB/CIN6/ P66/FTOB/CIN6/ KIN6/IRQ6 KIN6/IRQ6 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 P67/CIN7/KIN7/ IRQ7 AVref AVCC P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1
Rev. 4.00 Sep 27, 2006 page 23 of 1130 REJ09B0327-0400
Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 Mode 1 AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2 P43/TMCI1 P44/TMO1 P45/TMRI1 P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15 A14 A13 A12 A11 A10 A9 A8 PB5/D5 PB4/D4 VSS VSS Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) AVSS A17/PA1/CIN9/KIN9 A16/PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2 P43/TMCI1 P44/TMO1 P45/TMRI1 P46/PWX0 P47/PWX1 PB7/D7 PB6/D6 VCC1 A15/P27 A14/P26 A13/P25 A12/P24 A11/P23 A10/P22 A9/P21 A8/P20 PB5/D5 PB4/D4 VSS VSS Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) AVSS PA1/CIN9/KIN9 PA0/CIN8/KIN8 P40/TMCI0/ TxD2/IrTxD P41/TMO0/ RxD2/IrRxD P42/TMRI0/ SCK2 P43/TMCI1 P44/TMO1 P45/TMRI1 P46/PWX0 P47/PWX1 PB7 PB6 VCC1 P27 P26 P25 P24 P23 P22 P21 P20 PB5 PB4 VSS VSS Flash Memory Writer Mode VSS NC NC NC NC NC NC NC NC NC NC NC NC VCC CE FA14 FA13 FA12 FA11 FA10 OE FA8 NC NC VSS VSS
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Section 1 Overview Pin Name Pin No. FP-100B TFP-100B 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 Mode 1 A7 A6 A5 A4 A3 A2 A1 A0 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 P86/IRQ5/SCK1 RESO Expanded Modes Mode 2 (EXPE = 1) Mode 3 (EXPE = 1) A7/P17 A6/P16 A5/P15 A4/P14 A3/P13 A2/P12 A1/P11 A0/P10 PB3/D3 PB2/D2 D8 D9 D10 D11 D12 D13 D14 D15 PB1/D1 PB0/D0 VSS P80 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 P86/IRQ5/SCK1 RESO Single-Chip Modes Mode 2 (EXPE = 0) Mode 3 (EXPE = 0) P17 P16 P15 P14 P13 P12 P11 P10 PB3 PB2 P30 P31 P32 P33 P34 P35 P36 P37 PB1 PB0 VSS P80 P81 P82 P83 P84/IRQ3/TxD1 P85/IRQ4/RxD1 P86/IRQ5/SCK1 RESO Flash Memory Writer Mode FA7 FA6 FA5 FA4 FA3 FA2 FA1 FA0 NC NC FO0 FO1 FO2 FO3 FO4 FO5 FO6 FO7 NC NC VSS NC NC NC NC NC NC NC NC
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Section 1 Overview
1.3.3
Pin Functions
Table 1.3 summarizes the pin functions of this LSI. Table 1.3 Pin Functions
Pin No. Type Power supply Symbol VCC1 FP-100B TFP-100B I/O Name and Function Power supply: For connection to the power supply. All VCC1 and VCC2* pins should be connected to the system power supply. Internal step-down voltage pin: A power supply pin for the product, applicable to product lines that have an internal step-down voltage. In the 5-V and 4-V versions, connect external capacitors to stabilize the internal step-down voltage between this pin and the VSS pin. Do not connect it to Vcc. In the 3-V version, connect this pin and the VCC1 pin to the power supply for the system. For details, See section 26, Electrical Characteristics. Input/output buffer power supply: Power supply pin for the port A input/output buffer.
VCC2 VCL
4 [H8S/2144 Input Group only], 59 9* 9* Input
VCCB
4 [H8S/2148 Input Group and H8S/2147N only] 15, 70 71, 92 2 Input Input
VSS Clock XTAL
Ground: All VSS pins should be connected to the system power supply (0 V). Connected to a crystal oscillator. See section 24, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator and external clock input. Connected to a crystal oscillator. The EXTAL pin can also input an external clock. See section 24, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator and external clock input.
EXTAL
3
Input
φ EXCL
17 17
Output System clock: Supplies the system clock to external devices. Input External subclock input: Input a 32.768 kHz external subclock.
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Section 1 Overview Pin No. Type Operating mode control Symbol MD1 MD0 FP-100B TFP-100B 5 6 I/O Input Name and Function Mode pins: These pins set the operating mode. The relation between the settings of pins MD1 and MD0 and the operating mode is shown below. These pins should not be changed while the MCU is operating.
MD1 0 MD0 1 Operating Mode Mode 1 Description Normal Expanded mode with on-chip ROM disabled 1 0 Mode 2 Advanced Expanded mode with on-chip ROM enabled or single-chip mode 1 1 Mode 3 Normal Expanded mode with on-chip ROM enabled or single-chip mode
System control
RES RESO STBY
1 100 8 10, 11, 20, 21, 30, 31, 47, 48 60 to 67, 72 to 79 89 to 82 57, 58, 68, 69, 80, 81, 90, 91
Input
Reset input: When this pin is driven low, the chip is reset.
Output Reset output: Outputs reset signal to external device. Input Standby: When this pin is driven low, a transition is made to hardware standby mode.
Address bus
A23 to A16 A15 to A0
Output Address bus (advanced): Outputs address when 16-Mbyte space is used. Output Address bus: These pins output an address. Input/ output Input/ output Data bus (upper): Bidirectional data bus. Used for 8-bit data and upper byte of 16-bit data. Data bus (lower): Bidirectional data bus. Used for lower byte of 16-bit data.
Data bus
D15 to D8 D7 to D0
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Section 1 Overview Pin No. Type Bus control Symbol WAIT FP-100B TFP-100B 16 I/O Input Name and Function Wait: Requests insertion of a wait state in the bus cycle when accessing external 3-state address space.
RD HWR
22 19
Output Read: When this pin is low, it indicates that the external address space is being read. Output High write: When this pin is low, it indicates that the external address space is being written to. The upper half of the data bus is valid. Output Low write: When this pin is low, it indicates that the external address space is being written to. The lower half of the data bus is valid. Output Address strobe: When this pin is low, it indicates that address output on the address bus is valid. Input Input Nonmaskable interrupt: Requests a nonmaskable interrupt. Interrupt request 0 to 7: These pins request a maskable interrupt. FRT counter clock input: Input pin for an external clock signal for the free-running counter (FRC).
LWR
25
AS/IOS Interrupt signals NMI IRQ0 to IRQ7 16-bit free- FTCI running timer (FRT) FTOA FTOB FTIA FTIB FTIC FTID
18 7 23 to 25, 97 to 99, 34, 35 26 27 34 28 29 32 33
Input
Output FRT output compare A output: The output compare A output pin. Output FRT output compare B output: The output compare B output pin. Input Input Input Input FRT input capture A input: The input capture A input pin. FRT input capture B input: The input capture B input pin. FRT input capture C input: The input capture C input pin. FRT input capture D input: The input capture D input pin.
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Section 1 Overview Pin No. Type 8-bit timer (TMR0, TMR1, TMRX, TMRY) Symbol TMO0 TMO1 TMOX TMCI0 TMCI1 TMRI0 TMRI1 TMIX TMIY PWM timer (PWM) PW15 to PW0 FP-100B TFP-100B 50 53 35 49 52 51 54 26 28 60 to 67, 72 to 79 55 56 14 97 49 13 98 50 12 99 51 49 50 31 21 11 30 20 10 I/O Name and Function
Output Compare-match output: TMR0, TMR1, and TMRX compare-match output pins. Input Counter external clock input: Input pins for the external clock input to the TMR0 and TMR1 counters. Counter external reset input: TMR0 and TMR1 counter reset input pins. Counter external clock input and reset input: Dual function as TMRX and TMRY counter clock input pin and reset input pin.
Input Input
Output PWM timer output: PWM timer pulse output pins. Output PWMX timer output: PWM D/A pulse output pins.
14-bit PWM PWX0 timer PWX1 (PWMX) Serial communication interface (SCI0, SCI1, SCI2) TxD0 TxD1 TxD2 RxD0 RxD1 RxD2 SCK0 SCK1 SCK2 SCI with IrTxD IrDA (SCI2) IrRxD Keyboard Buffer controller (PS2) PS2AC PS2BC PS2CC PS2AD PS2BD PS2CD
Output Transmit data: Data output pins.
Input
Receive data: Data input pins.
Input/ output
Serial clock: Clock input/output pins. The SCK0 output type is NMOS push-pull in the H8S/2148 Group and H8S/2147N, and is CMOS output in the H8S/2144 Group.
Output IrDA transmit data/receive data: Input and output Input pins for data encoded for IrDA use. Input/ output Input/ output PS2 clock: Keyboard buffer controller synchronization clock input/output pins. PS2 data: Keyboard buffer controller data input/output pins.
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Section 1 Overview Pin No. Type Host interface (HIF) Symbol HDB7 to HDB0 CS1, CS2, ECS2 CS3, CS4 IOR IOW HA0 GA20 HIRQ11 HIRQ1 HIRQ12 HIRQ3 HIRQ4 HIFSD FP-100B TFP-100B 89 to 82 18, 94, 25 81, 80 I/O Input/ output Input Name and Function Host interface data bus: Bidirectional 8-bit bus for accessing the host interface. Chip select 1, 2, 3, and 4: Input pins for selecting host interface channel 1 to 4.
22 19 93 94 52 53 54 91 90 95
Input Input Input
I/O read: Input pin that enables reading from the host interface. I/O write: Input pin that enables writing to the host interface. Command/data: Input pin that indicates whether an access is a data access or command access.
Output GATE A20: A20 gate control signal output pin. Output Host interrupt 11, 1, 12, 3, and 4: Output pins for interrupt requests to the host.
Input
Host interface shutdown: Control input pin used to place host interface input/output pins in the highimpedance/cutoff state. Keyboard input: Matrix keyboard input pins. Normally, P10 to P17 and P20 to P27 are used as key-scan outputs. This enables a maximum 16output × 16-input, 256-key matrix to be configured. Analog input: A/D converter analog input pins. Expansion A/D inputs: Expansion A/D input pins can be connected to the A/D converter, but since they are also used as digital input/output pins, precision will fall. A/D conversion external trigger input: Pin for input of an external trigger to start A/D conversion.
Keyboard control
KIN0 to KIN15
26 to 29, Input 32 to 35, 48, 47, 31, 30, 21, 20, 11, 10 45 to 38 26 to 29, 32 to 35, 48, 47, 31, 30, 21, 20, 11, 10 25 Input Input
A/D converter (ADC)
AN7 to AN0 CIN0 to CIN15
ADTRG
Input
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Section 1 Overview Pin No. Type D/A converter (DAC) A/D converter D/A converter AVref 36 Input Symbol DA0 DA1 AVCC FP-100B TFP-100B 44 45 37 I/O Name and Function
Output Analog output: D/A converter analog output pins.
Input
Analog reference voltage: The analog power supply pin for the A/D converter and D/A converter. When the A/D and D/A converters are not used, this pin should be connected to the system power supply (+5 V or +3 V). Analog reference voltage: The reference power supply pin for the A/D converter and D/A converter. When the A/D and D/A converters are not used, this pin should be connected to the system power supply (+5 V or +3 V).
AVSS
46
Input
Analog ground: The ground pin for the A/D converter and D/A converter. This pin should be connected to the system power supply (0 V). Timer connection input: Timer connection synchronous signal input pins.
Timer connection
VSYNCI, HSYNCI, CSYNCI, VFBACKI, HFBACKI VSYNCO, HSYNCO, CLAMPO, CBLANK
28 52 54 29 26 27 53 32 60 12 99
Input
Output Timer connection output: Timer connection synchronous signal output pins.
I C bus interface (IIC) (option)
2
SCL0 SCL1
Input/ output
I C clock input/output (channels 0 and 1): I C clock I/O pins. These pins have a bus drive function. The SCL0 output form is NMOS open-drain I C data input/output (channels 0 and 1): I C data I/O pins. These pins have a bus drive function. The SDA0 output form is NMOS open-drain.
2 2
2
2
SDA0 SDA1
16 51
Input/ output
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Section 1 Overview Pin No. Type I/O ports Symbol P17 to P10 FP-100B TFP-100B 72 to 79 I/O Input/ output Name and Function Port 1: Eight input/output pins. The data direction of each pin can be selected in the port 1 data direction register (P1DDR). These pins have built-in MOS input pull-ups, and also have LED drive capability. Port 2: Eight input/output pins. The data direction of each pin can be selected in the port 2 data direction register (P2DDR). These pins have built-in MOS input pull-ups, and also have LED drive capability. Port 3: Eight input/output pins. The data direction of each pin can be selected in the port 3 data direction register (P3DDR). These pins have built-in MOS input pull-ups, and also have LED drive capability. Port 4: Eight input/output pins. The data direction of each pin can be selected in the port 4 data direction register (P4DDR). Port 5: Three input/output pins. The data direction of each pin can be selected in the port 5 data direction register (P5DDR). P52 is an NMOS pushpull output in the H8S/2148 Group and H8S/2147N, and is a CMOS output in the H8S/2144 Group. Port 6: Eight input/output pins. The data direction of each pin can be selected in the port 6 data direction register (P6DDR). These pins have built-in MOS input pull-ups. Port 7: Eight input pins. Port 8: Seven input/output pins. The data direction of each pin can be selected in the port 8 data direction register (P8DDR). Port 9: Eight input/output pins. The data direction of each pin (except P96) can be selected in the port 9 data direction register (P9DDR). P97 is an NMOS push-pull output in the H8S/2148 Group and H8S/2147N, and is a CMOS output in the H8S/2144 Group.
P27 to P20
60 to 67
Input/ output
P37 to P30
89 to 82
Input/ output
P47 to P40 P52 to P50
56 to 49
Input/ output Input/ output
12 to 14
P67 to P60
35 to 32 29 to 26
Input/ output
P77 to P70 P86 to P80 P97 to P90
45 to 38 99 to 93
Input Input/ output Input/ output
16 to 19 22 to 25
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Section 1 Overview Pin No. Type I/O ports Symbol PA7 to PA0 FP-100B TFP-100B 10, 11, 20, 21, 30, 31, 47, 48 I/O Input/ output Name and Function Port A: Eight input/output pins. The data direction of each pin can be selected in the port A data direction register (PADDR). These pins have built-in MOS input pull-ups. These are the VCCB drive pins. [H8S/2148 Group and H8S/2147N only] Port B: Eight input/output pins. The data direction of each pin can be selected in the port B data direction register (PBDDR). These pins have built-in MOS input pull-ups.
PB7 to PB0
57, 58, 68, 69, 80, 81, 90, 91
Input/ output
Note:
*
In F-ZTAT and mask ROM versions of HD64F2148A, HD64F2147A, HD64F2144A, HD6432148S, HD6432148SW, HD6432147S, HD6432147SW, HD6432144S, HD6432143S pin NO.9 is VCL pin and is not VCC pin.
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Section 1 Overview
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Section 2 CPU
Section 2 CPU
2.1 Overview
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit general registers, can address a 16-Mbyte (architecturally 4-Gbyte) linear address space, and is ideal for realtime control. 2.1.1 Features
The H8S/2000 CPU has the following features. • Upward-compatible with H8/300 and H8/300H CPUs Can execute H8/300 and H8/300H object programs • General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) • Sixty-five basic instructions 8/16/32-bit arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions • Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn] Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8,PC) or @(d:16,PC)] Memory indirect [@@aa:8] • 16-Mbyte address space Program: 16 Mbytes Data: 16 Mbytes (4 Gbytes architecturally)
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Section 2 CPU
• High-speed operation All frequently-used instructions execute in one or two states Maximum clock rate: 8 × 8-bit register-register multiply: 16 ÷ 8-bit register-register divide: 16 × 16-bit register-register multiply: 32 ÷ 16-bit register-register divide: • Two CPU operating modes Normal mode Advanced mode • Power-down state Transition to power-down state by SLEEP instruction CPU clock speed selection 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU 20 MHz 600 ns 600 ns 1000 ns 1000 ns 8/16/32-bit register-register add/subtract: 50 ns
The differences between the H8S/2600 CPU and the H8S/2000 CPU are shown below. • Register configuration The MAC register is supported only by the H8S/2600 CPU. • Basic instructions The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the H8S/2600 CPU. • Number of execution states The number of execution states of the MULXU and MULXS instructions differ as follows.
Number of Execution States Instruction MULXU MULXS Mnemonic MULXU.B Rs, Rd MULXU.W Rs, ERd MULXS.B Rs, Rd MULXS.W Rs, ERd H8S/2600 3 4 4 5 H8S/2000 12 20 13 21
There are also differences in the address space, EXR register functions, power-down state, etc., depending on the product.
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Section 2 CPU
2.1.3
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements. • More general registers and control registers Eight 16-bit extended registers, and one 8-bit control register, have been added. • Expanded address space Normal mode supports the same 64-kbyte address space as the H8/300 CPU. Advanced mode supports a maximum 16-Mbyte address space. • Enhanced addressing The addressing modes have been enhanced to make effective use of the 16-Mbyte address space. • Enhanced instructions Addressing modes of bit-manipulation instructions have been enhanced. Signed multiply and divide instructions have been added. Two-bit shift instructions have been added. Instructions for saving and restoring multiple registers have been added. A test and set instruction has been added. • Higher speed Basic instructions execute twice as fast. 2.1.4 Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements. • Additional control register One 8-bit control register has been added. • Enhanced instructions Addressing modes of bit-manipulation instructions have been enhanced. Two-bit shift instructions have been added. Instructions for saving and restoring multiple registers have been added. A test and set instruction has been added. • Higher speed Basic instructions execute twice as fast.
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Section 2 CPU
2.2
CPU Operating Modes
The H8S/2000 CPU has two operating modes: normal and advanced. Normal mode supports a maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte total address space (architecturally the maximum total address space is 4 Gbytes, with a maximum of 16 Mbytes for the program area and a maximum of 4 Gbytes for the data area). The mode is selected by the mode pins of the microcontroller.
Maximum 64 kbytes for program and data areas combined
Normal mode
CPU operating modes
Advanced mode
Maximum 16 Mbytes for program and data areas combined
Figure 2.1 CPU Operating Modes (1) Normal Mode The exception vector table and stack have the same structure as in the H8/300 CPU. Address Space: A maximum address space of 64 kbytes can be accessed. Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit segments of 32-bit registers. When En is used as a 16-bit register it can contain any value, even when the corresponding general register (Rn) is used as an address register. If the general register is referenced in the register indirect addressing mode with pre-decrement (@–Rn) or post-increment (@Rn+) and a carry or borrow occurs, however, the value in the corresponding extended register (En) will be affected. Instruction Set: All instructions and addressing modes can be used. Only the lower 16 bits of effective addresses (EA) are valid.
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Section 2 CPU
Exception Vector Table and Memory Indirect Branch Addresses: In normal mode the top area starting at H'0000 is allocated to the exception vector table. One branch address is stored per 16 bits. The configuration of the exception vector table in normal mode is shown in figure 2.2. For details of the exception vector table, see section 4, Exception Handling.
H'0000 H'0001 H'0002 H'0003 H'0004 H'0005 H'0006 H'0007 H'0008 H'0009 H'000A H'000B
Reset exception vector
(Reserved for system use)
Exception vector table
Exception vector 1 Exception vector 2
Figure 2.2 Exception Vector Table (Normal Mode) The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute address included in the instruction code to specify a memory operand that contains a branch address. In normal mode the operand is a 16-bit word operand, providing a 16bit branch address. Branch addresses can be stored in the top area from H'0000 to H'00FF. Note that this area is also used for the exception vector table.
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Section 2 CPU
Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call, and the PC and condition-code register (CCR) are pushed onto the stack in exception handling, they are stored as shown in figure 2.3. The extended control register (EXR) is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
PC (16 bits)
SP
CCR CCR* PC (16 bits)
(a) Subroutine Branch Note: * Ignored when returning.
(b) Exception Handling
Figure 2.3 Stack Structure in Normal Mode (2) Advanced Mode Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4 Gbytes for program and data areas combined). Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit segments of 32-bit registers or address registers. Instruction Set: All instructions and addressing modes can be used.
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Section 2 CPU
Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top area starting at H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a branch address is stored in the lower 24 bits (figure 2.4). For details of the exception vector table, see section 4, Exception Handling.
H'00000000
Reserved Reset exception vector
H'00000003 H'00000004 Reserved
H'00000007 H'00000008 Exception vector table
H'0000000B H'0000000C
(Reserved for system use)
H'00000010
Reserved Exception vector 1
Figure 2.4 Exception Vector Table (Advanced Mode) The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute address included in the instruction code to specify a memory operand that contains a branch address. In advanced mode the operand is a 32-bit longword operand, providing a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note that the first part of this range is also the exception vector table.
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Section 2 CPU
Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine call, and the PC and condition-code register (CCR) are pushed onto the stack in exception handling, they are stored as shown in figure 2.5. The extended control register (EXR) is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
Reserved PC (24 bits)
SP
CCR PC (24 bits)
(a) Subroutine Branch
(b) Exception Handling
Figure 2.5 Stack Structure in Advanced Mode
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Section 2 CPU
2.3
Address Space
Figure 2.6 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte (architecturally 4-Gbyte) address space in advanced mode.
H'0000 H'00000000
H'FFFF
Program area
H'00FFFFFF
Data area
Cannot be used by this LSI
H'FFFFFFFF (a) Normal Mode (b) Advanced Mode
Figure 2.6 Memory Map
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Section 2 CPU
2.4
2.4.1
Register Configuration
Overview
The CPU has the internal registers shown in figure 2.7. There are two types of registers: general registers and control registers.
General Registers (Rn) and Extended Registers (En) 15 ER0 ER1 ER2 ER3 ER4 ER5 ER6 ER7 (SP) E0 E1 E2 E3 E4 E5 E6 E7 07 R0H R1H R2H R3H R4H R5H R6H R7H 07 R0L R1L R2L R3L R4L R5L R6L R7L 0
Control Registers (CR) 23 PC 76543210 EXR* T — — — — I2 I1 I0 76543210 CCR I UI H U N Z V C Legend: SP: PC: EXR: T: I2 to I0: CCR: I: UI: Stack pointer Program counter Extended control register Trace bit Interrupt mask bits Condition-code register Interrupt mask bit User bit or interrupt mask bit H: U: N: Z: V: C: Half-carry flag User bit Negative flag Zero flag Overflow flag Carry flag 0
Note: * Does not affect operation in this LSI.
Figure 2.7 CPU Registers
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Section 2 CPU
2.4.2
General Registers
The CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8bit registers. Figure 2.8 illustrates the usage of the general registers. The usage of each register can be selected independently.
• Address registers • 32-bit registers
• 16-bit registers E registers (extended registers) (E0 to E7)
• 8-bit registers
ER registers (ER0 to ER7) R registers (R0 to R7)
RH registers (R0H to R7H)
RL registers (R0L to R7L)
Figure 2.8 Usage of General Registers General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.9 shows the stack.
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Section 2 CPU
Free area
SP (ER7)
Stack area
Figure 2.9 Stack 2.4.3 Control Registers
The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR), and 8-bit condition-code register (CCR). (1) Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an instruction is fetched, the least significant PC bit is regarded as 0.) (2) Extended Control Register (EXR) An 8-bit register. In this LSI, this register does not affect operation. Bit 7—Trace Bit (T): This bit is reserved. In this LSI, this bit does not affect operation. Bits 6 to 3—Reserved: These bits are reserved. They are always read as 1. Bits 2 to 0—Interrupt Mask Bits (I2 to I0): These bits are reserved. In this LSI, these bits do not affect operation.
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Section 2 CPU
(3) Condition-Code Register (CCR) This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. (NMI is accepted regardless of the I bit setting.) The I bit is set to 1 by hardware at the start of an exceptionhandling sequence. For details, refer to section 5, Interrupt Controller. Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask bit. For details, refer to section 5, Interrupt Controller. Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. Bit 3—Negative Flag (N): Stores the value of the most significant bit (sign bit) of data. Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 otherwise. Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: • Add instructions, to indicate a carry • Subtract instructions, to indicate a borrow • Shift and rotate instructions, to store the carry The carry flag is also used as a bit accumulator by bit-manipulation instructions.
Some instructions leave some or all of the flag bits unchanged. For the action of each instruction on the flag bits, refer to appendix A.1, Instruction. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions.
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Section 2 CPU
2.4.4
Initial Register Values
Reset exception handling loads the CPU’s program counter (PC) from the vector table, clears the trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized. The stack pointer should therefore be initialized by an MOV.L instruction executed immediately after a reset.
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Section 2 CPU
2.5
Data Formats
The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats
Figure 2.10 shows the data formats in general registers.
Data Type General Register Data Format
1-bit data
RnH
7 0 76543210
Don’t care
1-bit data
RnL
Don’t care
7 0 76543210
4-bit BCD data
RnH
43 7 0 Upper digit Lower digit
Don’t care
4-bit BCD data
RnL
Don’t care
43 7 0 Upper digit Lower digit
Byte data
RnH
7 MSB
0 Don’t care LSB 7
Don’t care
Byte data
RnL
0 LSB
MSB
Figure 2.10 General Register Data Formats
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Section 2 CPU
Data Type
General Register
Data Format
Word data
Rn
15 MSB
0 LSB
Word data 15 MSB Longword data 31 MSB
En 0 LSB ERn 16 15 En Rn 0 LSB
Legend: ERn: General register ER En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit
Figure 2.10 General Register Data Formats (cont)
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Section 2 CPU
2.5.2
Memory Data Formats
Figure 2.11 shows the data formats in memory. The CPU can access word data and longword data in memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches.
Data Type Address Data Format
7 1-bit data Address L 7 6 5 4 3 2 1
0 0
Byte data
Address L MSB
LSB
Word data
Address 2M MSB Address 2M + 1 LSB
Longword data
Address 2N MSB Address 2N + 1 Address 2N + 2 Address 2N + 3 LSB
Figure 2.11 Memory Data Formats When ER7 (SP) is used as an address register to access the stack, the operand size should be word size or longword size.
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Section 2 CPU
2.6
2.6.1
Instruction Set
Overview
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in table 2.1. Table 2.1
Function Data transfer
Instruction Classification
Instructions MOV 1 1 POP* , PUSH*
5 5 LDM* , STM* 3 3 MOVFPE* , MOVTPE*
Size BWL WL L B BWL B BWL L BW WL B BWL B — —
Types 5
Arithmetic operations
ADD, SUB, CMP, NEG ADDX, SUBX, DAA, DAS INC, DEC ADDS, SUBS MULXU, DIVXU, MULXS, DIVXS EXTU, EXTS 4 TAS*
19
Logic operations Shift Bit-manipulation Branch System control
AND, OR, XOR, NOT BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR 2 Bcc* , JMP, BSR, JSR, RTS
4 8 14 5 9 1
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP —
Block data transfer EEPMOV Legend: B: Byte W: Word L: Longword
Total: 65 types
Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn, @-SP. 2. Bcc is the general name for conditional branch instructions. 3. Cannot be used in this LSI. 4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 5. Only registers ER0 to ER6 should be used when using the STM/LDM instruction. Rev. 4.00 Sep 27, 2006 page 52 of 1130 REJ09B0327-0400
Section 2 CPU
2.6.2
Instructions and Addressing Modes
Table 2.2 indicates the combinations of instructions and addressing modes that the H8S/2000 CPU can use. Table 2.2 Combinations of Instructions and Addressing Modes
Addressing Modes @–ERn/@ERn+ @(d:32, ERn) @(d:16,ERn)
@(d:8, PC)
Function
Instruction @ERn
@(d:16, PC)
@@aa:8 — — — — — — — — — — — — — — — — — — — —
@aa:16
@aa:24
@aa:32
@aa:8
#xx
Rn
Data transfer
MOV POP, PUSH LDM*3, STM*3 MOVFPE* , MOVTPE*1
1
BWL BWL BWL BWL BWL BWL — — — — — — — — — — — — — — — — — — — B — — — B — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — —
B — — — — — — — — — — — — — — — — — B — — —
BWL — — B — — — — — — — — — — — — — — B — — —
— — — — — — — — — — — — — — — — — — — —
BWL — — — — — — — — — — — — — — — — — B — —
— — — — — — — — — — — — — — — — — — —
— — — — — — — — — — — — — — — — — — —
WL L — — — — — — — — — — — — — — — — — —
Arithmetic operations
ADD, CMP SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, DIVXU MULXS, DIVXS NEG EXTU, EXTS TAS*
2
BWL BWL WL B — — — — — — — — BWL B L BWL B BW BW BWL WL —
Logic operations
AND, OR, XOR NOT
BWL BWL — — — — — — BWL BWL B — — —
Shift Bit-manipulation Branch Bcc, BSR JMP, JSR RTS
— —
— — —
—
—
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— —
Section 2 CPU
Addressing Modes @–ERn/@ERn+ @(d:32, ERn) @(d:16,ERn)
@(d:8, PC)
Function
Instruction @ERn
@(d:16, PC)
@@aa:8 — — — — — — — —
@aa:16
@aa:24
@aa:32
@aa:8
#xx
Rn
System control
TRAPA RTE SLEEP LDC STC ANDC, ORC, XORC NOP
— — — B — B — —
— — — B B — — —
— — — W W — — —
— — — W W — — —
— — — W W — — —
— — — W W — — —
— — — — — — — —
— — — W W — — —
— — — — — — — —
— — — W W — — —
— — — — — — — —
— — — — — — — —
Block data transfer
BW
Legend: B: Byte W: Word L: Longword Notes: 1. Cannot be used in this LSI. 2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
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— — — —
Section 2 CPU
2.6.3
Table of Instructions Classified by Function
Table 2.3 summarizes the instructions in each functional category. The notation used in table 2.3 is defined below.
Operation Notation Rd Rs Rn ERn (EAd) (EAs) EXR CCR N Z V C PC SP #IMM disp + – × ÷ ∧ ∨ ⊕ → ¬ :8/:16/:24/:32 Note: * General register (destination)* General register (source)* General register* General register (32-bit register) Destination operand Source operand Extended control register Condition-code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Program counter Stack pointer Immediate data Displacement Addition Subtraction Multiplication Division Logical AND Logical OR Logical exclusive OR Move NOT (logical complement) 8-, 16-, 24-, or 32-bit length General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Section 2 CPU
Table 2.3
Type Data transfer
Instructions Classified by Function
Instruction MOV Size*
1
Function (EAs) → Rd, Rs → (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. Cannot be used in this LSI. Cannot be used in this LSI. @SP+ → Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
B/W/L
MOVFPE MOVTPE POP
B B W/L
PUSH
W/L
Rn → @–SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
LDM*
3
L L
@SP+ → Rn (register list) Pops two or more general registers from the stack. Rn (register list) → @–SP Pushes two or more general registers onto the stack.
3 STM*
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Section 2 CPU Type Arithmetic operations Instruction ADD SUB Size*
1
Function Rd ± Rs → Rd, Rd ± #IMM → Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register. (Immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction.) Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd Performs addition or subtraction with carry on byte data in two general registers, or on immediate data and data in a general register. Rd ± 1 → Rd, Rd ± 2 → Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. Rd decimal adjust → Rd Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data. Rd × Rs → Rd Performs unsigned multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. Rd × Rs → Rd Performs signed multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. Rd ÷ Rs → Rd Performs unsigned division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
B/W/L
ADDX SUBX
B
INC DEC
B/W/L
ADDS SUBS DAA DAS
L
B
MULXU
B/W
MULXS
B/W
DIVXU
B/W
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Section 2 CPU Type Arithmetic operations Instruction DIVXS Size* B/W
1
Function Rd ÷ Rs → Rd Performs signed division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder. Rd – Rs, Rd – #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result. 0 – Rd → Rd Takes the two’s complement (arithmetic complement) of data in a general register. Rd (zero extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left. Rd (sign extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit. 2 @ERd – 0, 1 → ( of @ERd)* Tests memory contents, and sets the most significant bit (bit 7) to 1.
CMP
B/W/L
NEG
B/W/L
EXTU
W/L
EXTS
W/L
TAS
B
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Section 2 CPU Type Logic operations Instruction AND Size*
1
Function Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd Performs a logical AND operation on a general register and another general register or immediate data. Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd Performs a logical OR operation on a general register and another general register or immediate data. Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. ¬ (Rd) → (Rd) Takes the one’s complement (logical complement) of general register contents. Rd (shift) → Rd Performs an arithmetic shift on general register contents. A 1-bit or 2-bit shift is possible. Rd (shift) → Rd Performs a logical shift on general register contents. A 1-bit or 2-bit shift is possible. Rd (rotate) → Rd Rotates general register contents. 1-bit or 2-bit rotation is possible. Rd (rotate) → Rd Rotates general register contents through the carry flag. 1-bit or 2-bit rotation is possible.
B/W/L
OR
B/W/L
XOR
B/W/L
NOT
B/W/L
Shift operations
SHAL SHAR SHLL SHLR ROTL ROTR ROTXL ROTXR
B/W/L
B/W/L
B/W/L
B/W/L
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Section 2 CPU Type Bitmanipulation instructions Instruction BSET Size* B
1
Function 1 → ( of ) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. 0 → ( of ) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. ¬ ( of ) → ( of ) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. ¬ ( of ) → Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. C ∧ ( of ) → C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ∧ ¬ ( of ) → C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. C ∨ ( of ) → C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ∨ ¬ ( of ) → C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
BCLR
B
BNOT
B
BTST
B
BAND
B
BIAND
B
BOR
B
BIOR
B
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Section 2 CPU Type Bitmanipulation instructions Instruction BXOR Size* B
1
Function C ⊕ ( of ) → C Exclusive-ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ⊕ ¬ ( of ) → C Exclusive-ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. ( of ) → C Transfers a specified bit in a general register or memory operand to the carry flag. ¬ ( of ) → C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. C → ( of ) Transfers the carry flag value to a specified bit in a general register or memory operand. ¬ C → ( of ) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data.
BIXOR
B
BLD
B
BILD
B
BST
B
BIST
B
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Section 2 CPU Type Branch instructions Instruction Bcc Size* —
1
Function Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic BRA(BT) BRN(BF) BHI BLS BCC(BHS) BCS(BLO) BNE BEQ BVC BVS BPL BMI BGE BLT BGT BLE Description Always (true) Never (false) High Low or same Carry clear (high or same) Carry set (low) Not equal Equal Overflow clear Overflow set Plus Minus Greater or equal Less than Greater than Less or equal Condition Always Never C∨Z=0 C∨Z=1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 N⊕V=0 N⊕V=1 Z∨(N ⊕ V) = 0 Z∨(N ⊕ V) = 1
JMP BSR JSR RTS
— — — —
Branches unconditionally to a specified address. Branches to a subroutine at a specified address. Branches to a subroutine at a specified address. Returns from a subroutine
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Section 2 CPU Type System control instructions Instruction TRAPA RTE SLEEP LDC Size* — — — B/W
1
Function Starts trap-instruction exception handling. Returns from an exception-handling routine. Causes a transition to a power-down state. (EAs) → CCR, (EAs) → EXR Moves contents of a general register or memory or immediate data to CCR or EXR. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. CCR → (EAd), EXR → (EAd) Transfers CCR or EXR contents to a general register or memory. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR Logically ANDs the CCR or EXR contents with immediate data. CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR Logically ORs the CCR or EXR contents with immediate data. CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR Logically exclusive-ORs the CCR or EXR contents with immediate data. PC + 2 → PC Only increments the program counter.
STC
B/W
ANDC
B
ORC
B
XORC
B
NOP
—
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Section 2 CPU Type Block data transfer instructions Instruction EEPMOV.B Size* —
1
Function if R4L ≠ 0 then Repeat @ER5+ → @ER6+ R4L–1 → R4L Until R4L = 0 else next; if R4 ≠ 0 then Repeat @ER5+ → @ER6+ R4–1 → R4 Until R4 = 0 else next; Block transfer instruction. Transfers the number of data bytes specified by R4L or R4 from locations starting at the address indicated by ER5 to locations starting at the address indicated by ER6. After the transfer, the next instruction is executed.
EEPMOV.W
—
Notes: 1. Size refers to the operand size. B: Byte W: Word L: Longword 2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
2.6.4
Basic Instruction Formats
The CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op field), a register field (r field), an effective address extension (EA field), and a condition field (cc). Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields. Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. Condition Field: Specifies the branching condition of Bcc instructions. Figure 2.12 shows examples of instruction formats.
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Section 2 CPU
(1) Operation field only op NOP, RTS, etc.
(2) Operation field and register fields op rn rm ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension op EA (disp) (4) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:16, etc rn rm MOV.B @(d:16, Rn), Rm, etc.
Figure 2.12 Instruction Formats (Examples) 2.6.5 Notes on Use of Bit-Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, carry out bitmanipulation, then write back the byte of data. Caution is therefore required when using these instructions on a register containing write-only bits, or a port. The BCLR instruction can be used to clear internal I/O register flags to 0. In this case, the relevant flag need not be read beforehand if it is clear that it has been set to 1 in an interrupt handling routine, etc.
2.7
2.7.1
Addressing Modes and Effective Address Calculation
Addressing Mode
The CPU supports the eight addressing modes listed in table 2.4. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit-manipulation instructions use register direct, register indirect, or
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Section 2 CPU
absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2.4
No. 1 2 3 4 5 6 7 8
Addressing Modes
Addressing Mode Register direct Register indirect Register indirect with displacement Register indirect with post-increment Register indirect with pre-decrement Absolute address Immediate Program-counter relative Memory indirect Symbol Rn @ERn @(d:16,ERn)/@(d:32,ERn) @ERn+ @–ERn @aa:8/@aa:16/@aa:24/@aa:32 #xx:8/#xx:16/#xx:32 @(d:8,PC)/@(d:16,PC) @@aa:8
Register Direct—Rn The register field of the instruction code specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. Register Indirect—@ERn The register field of the instruction code specifies an address register (ERn) which contains the address of the operand in memory. If the address is a program instruction address, the lower 24 bits are valid and the upper 8 bits are all assumed to be 0 (H'00). Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn) A 16-bit or 32-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the sum gives the address of a memory operand. A 16-bit displacement is sign-extended when added.
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Section 2 CPU
Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn • Register indirect with post-increment—@ERn+ The register field of the instruction code specifies an address register (ERn) which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the register value should be even. • Register indirect with pre-decrement—@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the result becomes the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the register value should be even. Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32 The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long (@aa:32). To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits (@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can access the entire address space. A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8 bits are all assumed to be 0 (H'00). Table 2.5 indicates the accessible absolute address ranges. Table 2.5 Absolute Address Access Ranges
Normal Mode 8 bits (@aa:8) 16 bits (@aa:16) 32 bits (@aa:32) Program instruction address 24 bits (@aa:24) H'FF00 to H'FFFF H'0000 to H'FFFF Advanced Mode H'FFFF00 to H'FFFFFF H'000000 to H'007FFF, H'FF8000 to H'FFFFFF H'000000 to H'FFFFFF
Absolute Address Data address
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Section 2 CPU
Immediate—#xx:8, #xx:16, or #xx:32 The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bitmanipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a vector address. Program-Counter Relative—@(d:8, PC) or @(d:16, PC) This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an even number. Memory Indirect—@@aa:8 This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF in normal mode, H'000000 to H'0000FF in advanced mode). In normal mode the memory operand is a word operand and the branch address is 16 bits long. In advanced mode the memory operand is a longword operand, the first byte of which is assumed to be all 0 (H'00). Note that the first part of the address range is also the exception vector area. For further details, refer to section 4, Exception Handling.
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Section 2 CPU
Specified by @aa:8
Branch address
Specified by @aa:8
Reserved Branch address
(a) Normal Mode
(b) Advanced Mode
Figure 2.13 Branch Address Specification in Memory Indirect Mode If an odd address is specified in word or longword memory access, or as a branch address, the least significant bit is regarded as 0, causing data to be accessed or an instruction code to be fetched at the address preceding the specified address. (For further information, see section 2.5.2, Memory Data Formats.) 2.7.2 Effective Address Calculation
Table 2.6 indicates how effective addresses are calculated in each addressing mode. In normal mode the upper 8 bits of the effective address are ignored in order to generate a 16-bit address.
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Section 2 CPU
Table 2.6
No. 1
Effective Address Calculation
Effective Address Calculation Effective Address (EA) Operand is general register contents.
Addressing Mode and Instruction Format Register direct (Rn)
op rm rn
2
Register indirect (@ERn)
31 General register contents op r 0 31 24 23 0 Don’t care
3
Register indirect with displacement @(d:16, ERn) or @(d:32, ERn)
31 General register contents 31 op r disp 31 Sign extension disp 0 24 23 0 Don’t care 0
4
Register indirect with post-increment or pre-decrement • Register indirect with post-increment @ERn+
31 General register contents 0 31 24 23 0 Don’t care
op
r 1, 2, or 4
•
Register indirect with pre-decrement @–ERn
31 General register contents 31 op r Operand Size Byte Word Longword Value Added 1 2 4 1, 2, or 4 24 23 0 Don’t care 0
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Section 2 CPU Addressing Mode and Instruction Format Absolute address
@aa:8 op abs 31 24 23 H'FFFF 87 0 Don’t care
No. 5
Effective Address Calculation
Effective Address (EA)
@aa:16 op abs
31
Don’t care
24 23 16 15 Sign extension
0
@aa:24 op abs
31
24 23
0
Don’t care
@aa:32 op abs
31
24 23
0
Don’t care
6
Immediate #xx:8/#xx:16/#xx:32
op IMM
Operand is immediate data.
7
Program-counter relative @(d:8, PC)/@(d:16, PC)
23 PC contents 0
op
disp
23 Sign extension
0 disp 31 24 23 0
Don’t care
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Section 2 CPU Addressing Mode and Instruction Format Memory indirect @@aa:8 • Normal mode
op abs
No. 8
Effective Address Calculation
Effective Address (EA)
31 H'000000
87 abs
0 31 24 23 16 15 0
Don’t care 15 Memory contents 0
H'00
•
Advanced mode
op abs
31 H'000000
87 abs
0
31 Memory contents
0
31
24 23
0
Don’t care
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Section 2 CPU
2.8
2.8.1
Processing States
Overview
The CPU has five main processing states: the reset state, exception-handling state, program execution state, bus-released state, and power-down state. Figure 2.14 shows a diagram of the processing states. Figure 2.15 indicates the state transitions.
Reset state The CPU and all on-chip supporting modules have been initialized and are stopped. Exception-handling state A transient state in which the CPU changes the normal processing flow in response to a reset, interrupt, or trap instruction. Processing states Program execution state The CPU executes program instructions in sequence. Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU. Sleep mode
Power-down state CPU operation is stopped to conserve power.*
Software standby mode Hardware standby mode
Note: * The power-down state also includes a medium-speed mode, module stop mode, sub-active mode, sub-sleep mode, and watch mode.
Figure 2.14 Processing States
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Section 2 CPU
End of bus request
Bus request
Program execution state
End of bus request
Bus request
Bus-released state
End of exception handling
SLEEP instruction with LSON = 0, PSS = 0, SSBY = 1
SLEEP instruction with LSON = 0, SSBY = 0
Request for exception handling
Sleep mode
Interrupt request
Exception-handling state External interrupt RES = high Software standby mode
Reset state*1
STBY = high, RES = low
Hardware standby mode*2 Power-down state*3
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. A transition can also be made to the reset state when the watchdog timer overflows. 2. From any state, a transition to hardware standby mode occurs when STBY goes low. 3. The power-down state also includes a watch mode, subactive mode, subsleep mode, etc. For details, refer to section 25, Power-Down State.
Figure 2.15 State Transitions 2.8.2 Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. All interrupts are disabled in the reset state. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details, refer to section 14, Watchdog Timer (WDT).
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Section 2 CPU
2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal processing flow due to a reset, interrupt, or trap instruction. The CPU fetches a start address (vector) from the exception vector table and branches to that address. Types of Exception Handling and Their Priority Exception handling is performed for resets, interrupts, and trap instructions. Table 2.7 indicates the types of exception handling and their priority. Trap instruction exception handling is always accepted in the program execution state. Exception handling and the stack structure depend on the interrupt control mode set in SYSCR. Table 2.7
Priority High
Exception Handling Types and Priority
Type of Exception Reset Detection Timing Synchronized with clock Start of Exception Handling Exception handling starts immediately after a low-to-high transition at the RES pin, or when the watchdog timer overflows. When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence. Exception handling starts when a trap (TRAPA) instruction is 2 executed.*
Interrupt
End of instruction execution or end of exception-handling 1 sequence* When TRAPA instruction is executed
Trap instruction Low
Notes: 1. Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling. 2. Trap instruction exception handling is always accepted in the program execution state.
Reset Exception Handling After the RES pin has gone low and the reset state has been entered, when RES goes high again, reset exception handling starts. When reset exception handling starts the CPU fetches a start address (vector) from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during reset exception handling and after it ends.
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Section 2 CPU
Interrupt Exception Handling and Trap Instruction Exception Handling When interrupt or trap-instruction exception handling begins, the CPU references the stack pointer (ER7) and pushes the program counter and other control registers onto the stack. Next, the CPU alters the settings of the interrupt mask bits in the control registers. Then the CPU fetches a start address (vector) from the exception vector table and program execution starts from that start address. Figure 2.16 shows the stack after exception handling ends.
Normal mode Advanced mode
SP
CCR CCR* PC (16 bits)
SP
CCR PC (24 bits)
Note: * Ignored when returning.
Figure 2.16 Stack Structure after Exception Handling (Examples) 2.8.4 Program Execution State
In this state the CPU executes program instructions in sequence. 2.8.5 Bus-Released State
This is a state in which the bus has been released in response to a bus request from a bus master other than the CPU. While the bus is released, all CPU internal operations are halted. There is one other bus master in addition to the CPU: the data transfer controller (DTC). For further details, refer to section 6, Bus Controller.
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Section 2 CPU
2.8.6
Power-Down State
The power-down state includes both modes in which the CPU stops operating and modes in which the CPU does not stop. There are five modes in which the CPU stops operating: sleep mode, software standby mode, hardware standby mode, subsleep mode, and watch mode. There are also three other power-down modes: medium-speed mode, module stop mode, and subactive mode. In medium-speed mode, the CPU and other bus masters operate on a medium-speed clock. Module stop mode permits halting of the operation of individual modules, other than the CPU. Subactive mode, subsleep mode, and watch mode are power-down modes that use subclock input. For details, refer to section 25, Power-Down State. Sleep Mode A transition to sleep mode is made if the SLEEP instruction is executed while the software standby bit (SSBY) in the standby control register (SBYCR) and the LSON bit in the low-power control register (LPWRCR) are both cleared to 0. In sleep mode, CPU operations stop immediately after execution of the SLEEP instruction. The contents of CPU registers are retained. Software Standby Mode A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1 and the LSON bit in LPWRCR and the PSS bit in the WDT1 timer control/status register (TCSR) are both cleared to 0. In software standby mode, the CPU and clock halt and all MCU operations stop. As long as a specified voltage is supplied, the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. Hardware Standby Mode A transition to hardware standby mode is made when the STBY pin goes low. In hardware standby mode, the CPU and clock halt and all MCU operations stop. The on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained.
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Section 2 CPU
2.9
2.9.1
Basic Timing
Overview
The CPU is driven by a system clock, denoted by the symbol φ. The period from one rising edge of φ to the next is referred to as a “state.” The memory cycle or bus cycle consists of one, two, or three states. Different methods are used to access on-chip memory, on-chip supporting modules, and the external address space. 2.9.2 On-Chip Memory (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and word transfer instruction. Figure 2.17 shows the on-chip memory access cycle. Figure 2.18 shows the pin states.
Bus cycle T1 φ Internal address bus Internal read signal Internal data bus Internal write signal Write access Internal data bus Write data Read data Address
Read access
Figure 2.17 On-Chip Memory Access Cycle
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Section 2 CPU
Bus cycle T1 φ
Address bus AS RD HWR, LWR Data bus
Unchanged High High High High impedance
Figure 2.18 Pin States during On-Chip Memory Access
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Section 2 CPU
2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits wide, depending on the particular internal I/O register being accessed. Figure 2.19 shows the access timing for the on-chip supporting modules. Figure 2.20 shows the pin states.
Bus cycle T1 T2
φ
Internal address bus
Address
Internal read signal Read access Internal data bus Internal write signal Write access Internal data bus Write data
Read data
Figure 2.19 On-Chip Supporting Module Access Cycle
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Section 2 CPU
Bus cycle T1 T2
φ Unchanged
Address bus
AS RD HWR, LWR
High
High
High
Data bus
High impedance
Figure 2.20 Pin States during On-Chip Supporting Module Access 2.9.4 External Address Space Access Timing
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to section 6, Bus Controller.
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Section 2 CPU
2.10
2.10.1
Usage Note
TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS instruction is not generated by the Renesas H8S and H8/300 series C/C++ compilers. If the TAS instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or ER5 is used. 2.10.2 STM/LDM Instruction
ER7 is not used as the register that can be saved (STM)/restored (LDM) when using STM/LDM instruction, because ER7 is the stack pointer. Two, three, or four registers can be saved/restored by one STM/LDM instruction. The following ranges can be specified in the register list. Two registers: ER0—ER1, ER2—ER3, or ER4—ER5 Three registers: ER0—ER2, or ER4—ER6 Four registers: ER0—ER3 The STM/LDM instruction including ER7 is not generated by the Renesas H8S and H8/300 series C/C++compilers.
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
3.1.1
Overview
Operating Mode Selection
This LSI has three operating modes (modes 1 to 3). These modes enable selection of the CPU operating mode and enabling/disabling of on-chip ROM, by setting the mode pins (MD1 and MD0). Table 3.1 lists the MCU operating modes. Table 3.1
MCU Operating Mode 0 1 2 3 1
MCU Operating Mode Selection
CPU Operating Mode — Normal Advanced Normal On-Chip ROM — Disabled Enabled
MD1 0
MD0 0 1 0 1
Description — Expanded mode with on-chip ROM disabled Expanded mode with on-chip ROM enabled Single-chip mode Expanded mode with on-chip ROM enabled Single-chip mode
The CPU’s architecture allows for 4 Gbytes of address space, but this LSI actually access a maximum of 16 Mbytes. Mode 1 is an externally expanded mode that allows access to external memory and peripheral devices. With modes 2 and 3, operation begins in single-chip mode after reset release, but a transition can be made to external expansion mode by setting the EXPE bit in MDCR. This LSI can only be used in modes 1 to 3. These means that the mode pins must select one of these modes. Do not changes the inputs at the mode pins during operation.
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Section 3 MCU Operating Modes
3.1.2
Register Configuration
This LSI have a mode control register (MDCR) that indicates the inputs at the mode pins (MD1 and MD0), a system control register (SYSCR) and bus control register (BCR) that control the operation of the MCU, and a serial/timer control register (STCR) that controls the operation of the supporting modules. Table 3.2 summarizes these registers. Table 3.2
Name Mode control register System control register Bus control register Serial/timer control register Note: *
MCU Registers
Abbreviation MDCR SYSCR BCR STCR R/W R/W R/W R/W R/W Initial Value Undetermined H'09 H'D7 H'00 Address* H'FFC5 H'FFC4 H'FFC6 H'FFC3
Lower 16 bits of the address.
3.2
3.2.1
Bit
Register Descriptions
Mode Control Register (MDCR)
7 EXPE —* R/W* 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 MDS1 —* R 0 MDS0 —* R
Initial value Read/Write
Note: * Determined by pins MD1 and MD0.
MDCR is an 8-bit read-only register that indicates the operating mode setting and the current operating mode of the MCU. The EXPE bit is initialized in coordination with the mode pin states by a reset and in hardware standby mode.
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Section 3 MCU Operating Modes
Bit 7—Expanded Mode Enable (EXPE): Sets expanded mode. In mode 1, this bit is fixed at 1 and cannot be modified. In modes 2 and 3, this bit has an initial value of 0, and can be read and written.
Bit 7 EXPE 0 1 Description Single chip mode is selected Expanded mode is selected
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0. Bits 1 and 0—Mode Select 1 and 0 (MDS1, MDS0): These bits indicate the input levels at pins MD1 and MD0 (the current operating mode). Bits MDS1 and MDS0 correspond to MD1 and MD0. MDS1 and MDS0 are read-only bits—they cannot be written to. The mode pin (MD1 and MD0) input levels are latched into these bits when MDCR is read. 3.2.2
Bit Initial value Read/Write
System Control Register (SYSCR)
7 CS2E 0 R/W 6 IOSE 0 R/W 5 INTM1 0 R 4 INTM0 0 R/W 3 XRST 1 R 2 NMIEG 0 R/W 1 HIE 0 R/W 0 RAME 1 R/W
SYSCR is an 8-bit readable/writable register that performs selection of system pin functions, reset source monitoring, interrupt control mode selection, NMI detected edge selection, supporting module pin location selection, supporting module register access control, and RAM address space control. Only bits 7, 6, 3, 1, and 0 are described here. For a detailed description of these bits, refer also to the description of the relevant modules (host interface, bus controller, watchdog timer, RAM, etc.). For information on bits 5, 4, and 2, see section 5.2.1, System Control Register (SYSCR). SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Chip Select 2 Enable (CS2E): Specifies the location of the host interface control pin (CS2). For details, see section 18, Host Interface. The H8S/2144 Group does not incorporate a host interface, so do not set this bit to 1 in the H8S/2144 Group.
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Section 3 MCU Operating Modes
Bit 6—IOS Enable (IOSE): Controls the function of the AS/IOS pin in expanded mode.
Bit 6 IOSE 0 1 Note: * Description The AS/IOS pin functions as the address strobe pin (AS) (Low output when accessing an external area) (Initial value)
The AS/IOS pin functions as the I/O strobe pin (IOS) (Low output when accessing a specified address from H'(FF)F000 to H'(FF)FE4F)* In the H8S/2148 F-ZTAT A-mask version and H8S/2147 F-ZTAT A-mask version, the address range is from H'(FF)F000 to H'(FF)F7FF.
Bit 3—External Reset (XRST): Indicates the reset source. When the watchdog timer is used, a reset can be generated by watchdog timer overflow as well as by external reset input. XRST is a read-only bit. It is set to 1 by an external reset and cleared to 0 by watchdog timer overflow.
Bit 3 XRST 0 1 Description A reset is generated by watchdog timer overflow A reset is generated by an external reset (Initial value)
Bit 1—Host Interface Enable (HIE): This bit controls CPU access to the host interface data registers and control registers (HICR, IDR1, ODR1, STR1, IDR2, ODR2, and STR2), the keyboard controller and MOS input pull-up control registers (KMIMR, KMPCR, and KMIMRA), the 8-bit timer (channel X and Y) data registers and control registers (TCRX/TCRY, TCSRX/TCSRY, TICRR/TCORAY, TICRF/TCORBY, TCNTX/TCNTY, TCORC/TISR, TCORAX, and TCORBX), and the timer connection control registers (TCONRI, TCONRO, TCONRS, and SEDGR).
Bit 1 HIE 0 Description In areas H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF, CPU access to 8-bit timer (channel X and Y) data registers and control registers, and timer connection control registers, is permitted In areas H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF, CPU access to host interface data registers and control registers, and keyboard controller and MOS input pull-up control registers, is permitted (Initial value)
1
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Section 3 MCU Operating Modes
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode.
Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
3.2.3
Bit
Bus Control Register (BCR)
7 ICIS1 1 R/W 6 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 — 1 R/W 1 IOS1 1 R/W 0 IOS0 1 R/W
ICIS0 BRSTRM BRSTS1 BRSTS0
Initial value Read/Write
BCR is an 8-bit readable/writable register that specifies the external memory space access mode, and the I/O area range when the AS pin is designated for use as the I/O strobe. For details on bits 7 to 2, see section 6.2.1, Bus Control Register (BCR). BCR is initialized to H'D7 by a reset and in hardware standby mode. Bits 1 and 0—IOS Select 1 and 0 (IOS1, IOS0): These bits specify the addresses for which the AS/IOS pin output goes low when IOSE = 1.
BCR Bit 1 IOS1 0 Bit 0 IOS0 0 1 1 0 1 Note: * Description The AS/IOS pin output goes low in accesses to addresses H'(FF)F000 to H'(FF)F03F The AS/IOS pin output goes low in accesses to addresses H'(FF)F000 to H'(FF)F0FF The AS/IOS pin output goes low in accesses to addresses H'(FF)F000 to H'(FF)F3FF The AS/IOS pin output goes low in accesses to addresses H'(FF)F000 to H'(FF)FE4F* (Initial value)
In the H8S/2148 F-ZTAT A-mask version and H8S/2147 F-ZTAT A-mask version, the address range is from H'(FF)F000 to H'(FF)F7FF.
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Section 3 MCU Operating Modes
3.2.4
Bit
Serial Timer Control Register (STCR)
7 IICS 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W 3 FLSHE 0 R/W 2 — 0 R/W 1 ICKS1 0 R/W 0 ICKS0 0 R/W
Initial value Read/Write
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode (when the on-chip IIC option is included), an on-chip flash memory control (in F-ZTAT versions), and also selects the TCNT input clock. For details of functions other than register access control, see the descriptions of the relevant modules. If a module controlled by STCR is not used, do not write 1 to the corresponding bit. STCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 5—I C Control (IICS, IICX1, IICX0): These bits control the bus buffer function of the 2 port A and the operation of the I C bus interface when the on-chip IIC option is included. For details, see section 16.2.7, Serial/Timer Control Register (STCR). Bit 4—I C Master Enable (IICE): Controls CPU access to the I C bus interface data registers and control registers (ICCR, ICSR, ICDR/SARX, and ICMR/SAR), the PWMX data registers and control registers (DADRAH/DACR, DADRAL, DADRBH/DACNTH, and DADRBL/DACNTL), and the SCI control registers (SMR, BRR, and SCMR).
Bit 4 IICE 0 Description Addresses H'(FF)FF88 and H'(FF)FF89, and H'(FF)FF8E and H'(FF)FF8F, are used for SCI1 control register access (Initial value) Addresses H'(FF)FFA0 and H'(FF)FFA1, and H'(FF)FFA6 and H'(FF)FFA7, are used for SCI2 control register access Addresses H'(FF)FFD8 and H'(FF)FFD9, and H'(FF)FFDE and H'(FF)FFDF, are used for SCI0 control register access 1 Addresses H'(FF)FF88 and H'(FF)FF89, and H'(FF)FF8E and H'(FF)FF8F, are used for IIC1 data register and control register access Addresses H'(FF)FFA0 and H'(FF)FFA1, and H'(FF)FFA6 and H'(FF)FFA7, are used for PWMX data register and control register access Addresses H'(FF)FFD8 and H'(FF)FFD9, and H'(FF)FFDE and H'(FF)FFDF, are used for IIC0 data register and control register access
2 2 2
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Section 3 MCU Operating Modes
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2), the power-down mode control registers (SBYCR, LPWRCR, MSTPCRH, and MSTPCRL), and the supporting module control register (PCSR and SYSCR2).
Bit 3 FLSHE 0 1 Description Addresses H'(FF)FF80 to H'(FF)FF87 are used for power-down mode control register and supporting module control register access (Initial value) Addresses H'(FF)FF80 to H'(FF)FF87 are used for flash memory control register access (F-ZTAT version only)
Bit 2—Reserved: Do not write 1 to this bit. Bits 1 and 0—Internal Clock Select 1 and 0 (ICKS1, ICKS0): These bits, together with bits CKS2 to CKS0 in TCR, select the clock to be input to TCNT. For details, see section 12.2.4, Timer Control Register (TCR).
3.3
3.3.1
Operating Mode Descriptions
Mode 1
The CPU can access a 64-kbyte address space in normal mode. The on-chip ROM is disabled. Ports 1 and 2 function as an address bus, port 3 functions as a data bus, and part of port 9 carries bus control signals. Clearing the ABW bit to 0 in the WSCR register makes port B a data bus. 3.3.2 Mode 2
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled. After a reset, single-chip mode is set, and the EXPE bit in MDCR must be set to 1 in order to use external addresses. When the EXPE bit in MDCR is set to 1, ports 1, 2 and A function as input ports after a reset. They can be set to output addresses by setting the corresponding bits in the data direction register (DDR) to 1. Port 3 functions as a data bus, and part of port 9 carries bus control signals. Clearing the ABW bit to 0 in the WSCR register makes port B a data bus.
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Section 3 MCU Operating Modes
3.3.3
Mode 3
The CPU can access a 64-kbyte address space in normal mode. The on-chip ROM is enabled. After a reset, single-chip mode is set, and the EXPE bit in MDCR must be set to 1 in order to use external addresses. When the EXPE bit in MDCR is set to 1, ports 1 and 2 function as input ports after a reset. They can be set to output addresses by setting the corresponding bits in the data direction register (DDR) to 1. Port 3 functions as a data bus, and part of port 9 carries bus control signals. Clearing the ABW bit to 0 in the WSCR register makes port B a data bus. In this operating mode, the available amount of on-chip ROM in products with 64 kbytes or more of ROM is limited to 56 kbytes.
3.4
Pin Functions in Each Operating Mode
The pin functions of ports 1 to 3, 9, A, and B vary depending on the operating mode. Table 3.3 shows their functions in each operating mode. Table 3.3
Port Port 1 Port 2 Port A Port 3 Port B Port 9 P97 P96 P95 to P93 P92 to P91 P90 Legend: P: I/O port A: Address bus output D: Data bus I/O C: Control signals, clock I/O *: After reset
Pin Functions in Each Mode
Mode 1 A A P D P*/D P*/C C*/P C P P*/C Mode 2 P*/A P*/A P*/A P*/D P*/D P*/C P*/C P*/C P P*/C Mode 3 P*/A P*/A P P*/D P*/D P*/C P*/C P*/C P P*/C
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Section 3 MCU Operating Modes
3.5
Memory Map in Each Operating Mode
Figures 3.1 to 3.5 show memory maps for each of the operating modes. The address space is 64 kbytes in modes 1 and 3 (normal modes), and 16 Mbytes in mode 2 (advanced mode). The on-chip ROM capacity is 64 kbytes (H8S/2142, H8S/2147, and H8S/2147N), 96 kbytes (H8S/2143), or 128 kbytes (H8S/2144 and H8S/2148), but only 56 kbytes are available in mode 3 (normal mode). Do not access the reserved area and addresses of modules not supported by the product. Note that normal operation is not guaranteed when these regions are accessed. For details, see section 6, Bus Controller.
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Section 3 MCU Operating Modes
Mode 1 (normal expanded mode with on-chip ROM disabled)
Mode 3/EXPE = 1 (normal expanded mode with on-chip ROM enabled)
Mode 3/EXPE = 0 (normal single-chip mode)
H'0000
H'0000
H'0000
External address space
On-chip ROM
On-chip ROM
H'DFFF External address space H'E080 On-chip RAM* H'EFFF
External address space
H'DFFF
H'E080 On-chip RAM* H'EFFF
External address space
H'E080 On-chip RAM H'EFFF H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes) H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.1 H8S/2148 (Except for F-ZTAT A-Mask Version) and H8S/2144 Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
Mode 2/EXPE = 1 (advanced expanded mode with on-chip ROM enabled) H'000000
Mode 2/EXPE = 0 (advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'01FFFF H'020000 H'FFE080
H'01FFFF External address space H'FFE080 On-chip RAM* On-chip RAM H'FFEFFF
External address space
H'FFEFFF H'FFFE50 H'FFFEFF Internal I/O registers 2 On-chip RAM H'FFFF00 (128 bytes)* H'FFFF7F H'FFFF80 Internal I/O registers 1 H'FFFFFF
H'FFFE50 H'FFFEFF H'FFFF00 H'FFFF7F H'FFFF80 H'FFFFFF
Internal I/O registers 2
On-chip RAM (128 bytes)
Internal I/O registers 1
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.1 H8S/2148 (Except for F-ZTAT A-Mask Version) and H8S/2144 Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
Mode 1 (normal expanded mode with on-chip ROM disabled)
Mode 3/EXPE = 1 (normal expanded mode with on-chip ROM enabled)
Mode 3/EXPE = 0 (normal single-chip mode)
H'0000
H'0000
H'0000
External address space
On-chip ROM
On-chip ROM
H'DFFF External address space H'E080 On-chip RAM* H'EFFF
External address space
H'DFFF
H'E080 On-chip RAM* H'EFFF
External address space
H'E080 On-chip RAM H'EFFF
H'F800 Reserved area H'FE4F H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'F800 Reserved area H'FE4F H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes) H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.2 H8S/2148 F-ZTAT A-Mask Version Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
Mode 2/EXPE = 1 (advanced expanded mode with on-chip ROM enabled) H'000000
Mode 2/EXPE = 0 (advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'01FFFF H'020000 H'FFE080
H'01FFFF External address space H'FFE080 On-chip RAM* On-chip RAM H'FFEFFF
H'FFEFFF
External address space
H'FFF800 Reserved area H'FFFE4F H'FFFE50 H'FFFEFF Internal I/O registers 2 On-chip RAM H'FFFF00 (128 bytes)* H'FFFF7F H'FFFF80 Internal I/O registers 1 H'FFFFFF
H'FFFE50 H'FFFEFF H'FFFF00 H'FFFF7F H'FFFF80 H'FFFFFF
Internal I/O registers 2
On-chip RAM (128 bytes)
Internal I/O registers 1
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.2 H8S/2148 F-ZTAT A-Mask Version Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
Mode 1 (normal expanded mode with on-chip ROM disabled)
Mode 3/EXPE = 1 (normal expanded mode with on-chip ROM enabled)
Mode 3/EXPE = 0 (normal single-chip mode)
H'0000
H'0000
H'0000
External address space
On-chip ROM
On-chip ROM
H'DFFF External address space H'E080 On-chip RAM* H'EFFF
External address space
H'DFFF
H'E080 On-chip RAM* H'EFFF
External address space
H'E080 On-chip RAM H'EFFF H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes) H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.3 H8S/2143 Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
Mode 2/EXPE = 1 (advanced expanded mode with on-chip ROM enabled) H'000000
Mode 2/EXPE = 0 (advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'017FFF
H'017FFF
Reserved area H'01FFFF H'020000 H'FFE080 On-chip RAM* H'FFEFFF
External address space
Reserved area H'01FFFF
External address space H'FFE080 On-chip RAM H'FFEFFF H'FFFE50 H'FFFEFF H'FFFF00 H'FFFF7F H'FFFF80 H'FFFFFF Internal I/O registers 2
On-chip RAM (128 bytes)
H'FFFE50 H'FFFEFF Internal I/O registers 2 On-chip RAM H'FFFF00 (128 bytes)* H'FFFF7F H'FFFF80 Internal I/O registers 1 H'FFFFFF
Internal I/O registers 1
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.3 H8S/2143 Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
Mode 1 (normal expanded mode with on-chip ROM disabled)
Mode 3/EXPE = 1 (normal expanded mode with on-chip ROM enabled)
Mode 3/EXPE = 0 (normal single-chip mode)
H'0000
H'0000
H'0000
External address space
On-chip ROM
On-chip ROM
H'DFFF External address space H'E080 Reserved area* H'E880 H'EFFF On-chip RAM*
External address space
H'DFFF
H'E080 Reserved area* H'E880 H'EFFF On-chip RAM*
External address space
H'E080 Reserved area H'E880 H'EFFF On-chip RAM
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes) H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.4 H8S/2147 (Except for F-ZTAT A-Mask Version), H8S/2147N, and H8S/2142 Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
Mode 2/EXPE = 1 (advanced expanded mode with on-chip ROM enabled) H'000000
Mode 2/EXPE = 0 (advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'00FFFF
H'00FFFF
Reserved area
Reserved area
H'01FFFF H'020000 H'FFE080
H'01FFFF External address space H'FFE080 Reserved area* Reserved area H'FFE880 H'FFEFFF H'FFFE50 H'FFFEFF H'FFFF00 H'FFFF7F H'FFFF80 H'FFFFFF On-chip RAM
H'FFE880 H'FFEFFF
On-chip RAM*
External address space
H'FFFE50 H'FFFEFF Internal I/O registers 2 On-chip RAM H'FFFF00 (128 bytes)* H'FFFF7F H'FFFF80 Internal I/O registers 1 H'FFFFFF
Internal I/O registers 2
On-chip RAM (128 bytes)
Internal I/O registers 1
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.4 H8S/2147 (Except for F-ZTAT A-Mask Version), H8S/2147N, and H8S/2142 Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
Mode 1 (normal expanded mode with on-chip ROM disabled)
Mode 3/EXPE = 1 (normal expanded mode with on-chip ROM enabled)
Mode 3/EXPE = 0 (normal single-chip mode)
H'0000
H'0000
H'0000
External address space
On-chip ROM
On-chip ROM
H'DFFF External address space H'E080 H'E880 H'EFFF Reserved area* On-chip RAM*
External address space
H'DFFF
H'E080 H'E880 H'EFFF
Reserved area* On-chip RAM*
External address space
H'E080 Reserved area H'E880 H'EFFF On-chip RAM
H'F800 Reserved area H'FE4F H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'F800 Reserved area H'FE4F H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes)* H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
H'FE50 H'FEFF Internal I/O registers 2 On-chip RAM H'FF00 (128 bytes) H'FF7F H'FF80 Internal I/O registers 1 H'FFFF
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.5 H8S/2147 F-ZTAT A-Mask Version Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
Mode 2/EXPE = 1 (advanced expanded mode with on-chip ROM enabled) H'000000
Mode 2/EXPE = 0 (advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'00FFFF
H'00FFFF
Reserved area
Reserved area
H'01FFFF H'020000 H'FFE080
H'01FFFF External address space Reserved area* H'FFE080 Reserved area H'FFE880 H'FFEFFF On-chip RAM
H'FFE880 H'FFEFFF
On-chip RAM*
External address space
H'FFF800 Reserved area H'FFFE4F H'FFFE50 H'FFFEFF Internal I/O registers 2 On-chip RAM H'FFFF00 (128 bytes)* H'FFFF7F H'FFFF80 Internal I/O registers 1 H'FFFFFF
H'FFFE50 H'FFFEFF H'FFFF00 H'FFFF7F H'FFFF80 H'FFFFFF
Internal I/O registers 2
On-chip RAM (128 bytes)
Internal I/O registers 1
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.5 H8S/2147 F-ZTAT A-Mask Version Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
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Section 4 Exception Handling
Section 4 Exception Handling
4.1
4.1.1
Overview
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur simultaneously, they are accepted and processed in order of priority. Trap instruction exceptions are accepted at all times in the program execution state. Exception handling sources, the stack structure, and the operation of the CPU vary depending on the interrupt control mode set by the INTM0 and INTM1 bits in SYSCR. Table 4.1
Priority High
Exception Types and Priority
Exception Type Reset
1 Trace*
Start of Exception Handling Starts immediately after a low-to-high transition at the RES pin, or when the watchdog timer overflows. Starts when execution of the current instruction or exception handling ends, if the trace (T) bit is set to 1. Starts when execution of the current instruction or exception handling ends, if an interrupt request has been 2 issued.* Started by a direct transition resulting from execution of a SLEEP instruction. Started by execution of a trap instruction (TRAPA).
Interrupt
Direct transition Low
3 Trap instruction (TRAPA)*
Notes: 1. Traces are enabled only in interrupt control modes 2 and 3. (They cannot be used in this LSI.) Trace exception handling is not executed after execution of an RTE instruction. 2. Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC instruction execution, or on completion of reset exception handling. 3. Trap instruction exception handling requests are accepted at all times in the program execution state.
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Section 4 Exception Handling
4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows: 1. The program counter (PC) and condition-code register (CCR) are pushed onto the stack. 2. The interrupt mask bits are updated. The T bit is cleared to 0. 3. A vector address corresponding to the exception source is generated, and program execution starts from that address. For a reset exception, steps 2 and 3 above are carried out. 4.1.3 Exception Sources and Vector Table
The exception sources are classified as shown in figure 4.1. Different vector addresses are assigned to different exception sources. Table 4.2 lists the exception sources and their vector addresses.
Reset
Trace Exception sources
(Cannot be used in this LSI) External interrupts: NMI, IRQ7 to IRQ0
Interrupts
Internal interrupts: interrupt sources in on-chip supporting modules
Direct transition
Trap instruction
Figure 4.1 Exception Sources
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Section 4 Exception Handling
Table 4.2
Exception Vector Table
Vector Address*
1
Exception Source Reset Reserved for system use
Vector Number 0 1 2 3 4 5
Normal Mode H'0000 to H'0001 H'0002 to H'0003 H'0004 to H'0005 H'0006 to H'0007 H'0008 to H'0009 H'000A to H'000B H'000C to H'000D H'000E to H'000F H'0010 to H'0011 H'0012 to H'0013 H'0014 to H'0015 H'0016 to H'0017 H'0018 to H'0019 H'001A to H'001B H'001C to H'001D H'001E to H'001F H'0020 to H'0021 H'0022 to H'0023 H'0024 to H'0025 H'0026 to H'0027 H'0028 to H'0029 H'002A to H'002B H'002C to H'002D H'002E to H'002F H'0030 to H'0031 H'00CE to H'00CF
Advanced Mode H'0000 to H'0003 H'0004 to H'0007 H'0008 to H'000B H'000C to H'000F H'0010 to H'0013 H'0014 to H'0017 H'0018 to H'001B H'001C to H'001F H'0020 to H'0023 H'0024 to H'0027 H'0028 to H'002B H'002C to H'002F H'0030 to H'0033 H'0034 to H'0037 H'0038 to H'003B H'003C to H'003F H'0040 to H'0043 H'0044 to H'0047 H'0048 to H'004B H'004C to H'004F H'0050 to H'0053 H'0054 to H'0057 H'0058 to H'005B H'005C to H'005F H'0060 to H'0063 H'019C to H'019F
Direct transition External interrupt NMI Trap instruction (4 sources)
6 7 8 9 10 11
Reserved for system use
12 13 14 15
External interrupt
IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 IRQ6 IRQ7
16 17 18 19 20 21 22 23 24 103
2 Internal interrupt*
Notes: 1. Lower 16 bits of the address. 2. For details on internal interrupt vectors, see section 5.3.3, Interrupt Exception Vector Table.
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Section 4 Exception Handling
4.2
4.2.1
Reset
Overview
A reset has the highest exception priority. When the RES pin goes low, all processing halts and the MCU enters the reset state. A reset initializes the internal state of the CPU and the registers of on-chip supporting modules. Immediately after a reset, interrupt control mode 0 is set. Reset exception handling begins when the RES pin changes from low to high. The MCUs can also be reset by overflow of the watchdog timer. For details, see section 14, Watchdog Timer (WDT). 4.2.2 Reset Sequence
The MCU enters the reset state when the RES pin goes low. To ensure that the chip is reset, hold the RES pin low for at least 20 ms when powering on. To reset the chip during operation, hold the RES pin low for at least 20 states. For pin states in a reset, see appendix D.1, Port States in Each Processing State. When the RES pin goes high after being held low for the necessary time, the chip starts reset exception handling as follows: [1] The internal state of the CPU and the registers of the on-chip supporting modules are initialized, and the I bit is set to 1 in CCR. [2] The reset exception vector address is read and transferred to the PC, and program execution starts from the address indicated by the PC. Figures 4.2 and 4.3 show examples of the reset sequence.
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Section 4 Exception Handling
Fetch of Vector Internal first program fetch processing instruction
φ RES Internal address bus Internal read signal Internal write signal Internal data bus (1) (2) (3) (4) (2)
High
(1)
(3)
(4)
Reset exception vector address ((1) = H'0000) Start address (contents of reset exception vector address) Start address ((3) = (2)) First program instruction
Figure 4.2 Reset Sequence (Mode 3)
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Section 4 Exception Handling
Vector fetch
Internal processing *
Fetch of first program instruction *
φ RES Address bus RD HWR, LWR D15 to D8
*
(1)
(3)
(5)
High (2) (4) (6)
(1) (3) (2) (4) (5) (6)
Reset exception vector address ((1) = H'0000, (3) = H'0001) Start address (contents of reset exception vector address) Start address ((5) = (2) (4)) First program instruction
Note: * 3 program wait states are inserted.
Figure 4.3 Reset Sequence (Mode 1) 4.2.3 Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that this instruction initializes the stack pointer (example: MOV.L #xx:32, SP).
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Section 4 Exception Handling
4.3
Interrupts
Interrupt exception handling can be requested by nine external sources (NMI and IRQ7 to IRQ0) from 23 input pins (NMI, IRQ7 to IRQ0, and KIN15 to KIN0), and internal sources in the on-chip supporting modules. Figure 4.4 shows the interrupt sources and the number of interrupts of each type. The on-chip supporting modules that can request interrupts include the watchdog timer (WDT), 16-bit free-running timer (FRT), 8-bit timer (TMR), serial communication interface (SCI), data transfer controller (DTC), A/D converter (ADC), host interface (HIF), keyboard buffer controller 2 (PS2), and I C bus interface (option). Each interrupt source has a separate vector address. NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The interrupt controller has two interrupt control modes and can assign interrupts other than NMI and address break to either three priority/mask levels to enable multiplexed interrupt control. For details on interrupts, see section 5, Interrupt Controller.
External interrupts Interrupts
NMI (1) IRQ7 to IRQ0 (8) WDT* (2) FRT (7) TMR (10) SCI (12) DTC (1) ADC (1) HIF (4) PS2 (3) IIC (3) (option) Other (1)
Internal interrupts
Notes: Numbers in parentheses are the numbers of interrupt sources. * When the watchdog timer is used as an interval timer, it generates an interrupt request at each counter overflow.
Figure 4.4 Interrupt Sources and Number of Interrupts
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Section 4 Exception Handling
4.4
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction exception handling can be executed at all times in the program execution state. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, as specified in the instruction code. Table 4.3 shows the status of CCR and EXR after execution of trap instruction exception handling. Table 4.3 Status of CCR and EXR after Trap Instruction Exception Handling
CCR Interrupt Control Mode 0 1 I 1 1 UI — 1 I2 to I0 — — EXR T — —
Legend: 1: Set to 1 0: Cleared to 0 —: Retains value prior to execution.
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Section 4 Exception Handling
4.5
Stack Status after Exception Handling
Figure 4.5 shows the stack after completion of trap instruction exception handling and interrupt exception handling.
SP
CCR CCR* PC (16 bits)
Interrupt control modes 0 and 1 Note: * Ignored on return.
Figure 4.5 (1) Stack Status after Exception Handling (Normal Mode)
SP
CCR PC (24 bits)
Interrupt control modes 0 and 1
Figure 4.5 (2) Stack Status after Exception Handling (Advanced Mode)
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Section 4 Exception Handling
4.6
Notes on Use of the Stack
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The stack should always be accessed by word transfer instruction or longword transfer instruction, and the value of the stack pointer (SP: ER7) should always be kept even. Use the following instructions to save registers:
PUSH.W PUSH.L Rn ERn (or MOV.W Rn, @-SP) (or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W POP.L Rn ERn (or MOV.W @SP+, Rn) (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.6 shows an example of what happens when the SP value is odd.
CCR SP PC
SP
R1L PC
H'FFEFFA H'FFEFFB H'FFEFFC H'FFEFFD H'FFEFFF
SP
TRAP instruction executed MOV.B R1L, @–ER7
SP set to H'FFEFFF Legend: CCR: Condition-code register PC: Program counter R1L: General register R1L SP: Stack pointer
Data saved above SP
Contents of CCR lost
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode.
Figure 4.6 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
5.1.1
Overview
Features
This LSI control interrupts by means of an interrupt controller. The interrupt controller has the following features: • Two interrupt control modes Either of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in the system control register (SYSCR). • Priorities settable with ICR An interrupt control register (ICR) is provided for setting interrupt priorities. Three priority levels can be set for each module for all interrupts except NMI and address break. • Independent vector addresses All interrupt sources are assigned independent vector addresses, making it unnecessary for the source to be identified in the interrupt handling routine. • Twenty-three external interrupt pins (nine external sources) NMI is the highest-priority interrupt, and is accepted at all times. A rising or falling edge at the NMI pin can be selected for the NMI interrupt. Falling edge, rising edge, or both edge detection, or level sensing, at pins IRQ7 to IRQ0 can be selected for interrupts IRQ7 to IRQ0. The IRQ6 interrupt is shared by the interrupt from the IRQ6 pin and eight external interrupt inputs (KIN7 to KIN0), and the IRQ7 interrupt is shared by the interrupt from the IRQ7 pin and eight external interrupt inputs (KIN15 to KIN8). KIN15 to KIN0 can be masked individually by the user program. • DTC control DTC activation is controlled by means of interrupts.
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Section 5 Interrupt Controller
5.1.2
Block Diagram
A block diagram of the interrupt controller is shown in figure 5.1.
INTM1 INTM0 SYSCR NMIEG NMI input IRQ input NMI input unit IRQ input unit ISR ISCR IER Priority determination I, UI Interrupt request Vector number
CPU
Internal interrupt requests SWDTEND to PS2IC
CCR
ICR Interrupt controller
Legend: ISCR: IER: ISR: ICR: SYSCR:
IRQ sense control register IRQ enable register IRQ status register Interrupt control register System control register
Figure 5.1 Block Diagram of Interrupt Controller
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Section 5 Interrupt Controller
5.1.3
Pin Configuration
Table 5.1 summarizes the pins of the interrupt controller. Table 5.1
Name Nonmaskable interrupt External interrupt requests 7 to 0 Key input interrupt requests 15 to 0
Interrupt Controller Pins
Symbol NMI I/O Input Function Nonmaskable external interrupt; rising or falling edge can be selected Maskable external interrupts; rising, falling, or both edges, or level sensing, can be selected. Maskable external interrupts: falling edge or level sensing can be selected.
IRQ7 to IRQ0 Input KIN15 to KIN0 Input
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Section 5 Interrupt Controller
5.1.4
Register Configuration
Table 5.2 summarizes the registers of the interrupt controller. Table 5.2
Name System control register IRQ sense control register H IRQ sense control register L IRQ enable register IRQ status register
Interrupt Controller Registers
Abbreviation SYSCR ISCRH ISCRL IER ISR R/W R/W R/W R/W R/W
2 R/(W)*
Initial Value H'09 H'00 H'00 H'00 H'00 H'BF H'FF H'00 H'00 H'00 H'00 H'00 H'00 H'00
1 Address*
H'FFC4 H'FEEC H'FEED H'FFC2 H'FEEB 3 H'FFF1* H'FFF3* H'FEE8 H'FEE9 H'FEEA H'FEF4 H'FEF5 H'FEF6 H'FEF7
3
Keyboard matrix interrupt mask KMIMR register Keyboard matrix interrupt mask KMIMRA register A Interrupt control register A Interrupt control register B Interrupt control register C Address break control register Break address register A Break address register B Break address register C ICRA ICRB ICRC ABRKCR BARA BARB BARC
R/W R/W R/W R/W R/W R/W R/W R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written, for flag clearing. 3. When setting KMIMR and KMIMRA, the HIE bit in SYSCR must be set to 1, and also MSTP2 bit in MSTPCRL must be set to 0.
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Section 5 Interrupt Controller
5.2
5.2.1
Bit
Register Descriptions
System Control Register (SYSCR)
7 CS2E 0 R/W 6 IOSE 0 R/W 5 INTM1 0 R 4 INTM0 0 R/W 3 XRST 1 R 2 NMIEG 0 R/W 1 HIE 0 R/W 0 RAME 1 R/W
Initial value Read/Write
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, and the detected edge for NMI, among other functions. Only bits 5, 4, and 2 are described here; for details on the other bits, see section 3.2.2, System Control Register (SYSCR). SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select one of four interrupt control modes for the interrupt controller. The INTM1 bit must not be set to 1.
Bit 5 INTM1 0 1 Bit 4 INTM0 0 1 0 1 Interrupt Control Mode 0 1 2 3
Description Interrupts are controlled by I bit Cannot be used in this LSI Cannot be used in this LSI (Initial value)
Interrupts are controlled by I and UI bits and ICR
Bit 2—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
Bit 2 NMIEG 0 1 Description Interrupt request generated at falling edge of NMI input Interrupt request generated at rising edge of NMI input (Initial value)
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Section 5 Interrupt Controller
5.2.2
Bit
Interrupt Control Registers A to C (ICRA to ICRC)
7 ICR7 0 R/W 6 ICR6 0 R/W 5 ICR5 0 R/W 4 ICR4 0 R/W 3 ICR3 0 R/W 2 ICR2 0 R/W 1 ICR1 0 R/W 0 ICR0 0 R/W
Initial value Read/Write
The ICR registers are three 8-bit readable/writable registers that set the interrupt control level for interrupts other than NMI and address break. The correspondence between ICR settings and interrupt sources is shown in table 5.3. The ICR registers are initialized to H'00 by a reset and in hardware standby mode. Bit n—Interrupt Control Level (ICRn): Sets the control level for the corresponding interrupt source.
Bit n ICRn 0 1 Description Corresponding interrupt source is control level 0 (non-priority) Corresponding interrupt source is control level 1 (priority) (Initial value)
Note: n = 7 to 0
Table 5.3
Correspondence between Interrupt Sources and ICR Settings
Bits
Register 7 ICRA ICRB IRQ0
6 IRQ1
5 IRQ2 IRQ3 —
4 IRQ4 IRQ5 —
3 IRQ6 IRQ7
2 DTC
1
0
Watchdog Watchdog timer 0 timer 1 HIF, Keyboard buffer controller —
A/D Freeconverter running timer
8-bit 8-bit 8-bit timer timer timer channel 0 channel 1 channels X, Y —
ICRC
SCI SCI SCI IIC IIC — channel 0 channel 1 channel 2 channel 0 channel 1 (option) (option)
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Section 5 Interrupt Controller
5.2.3
Bit
IRQ Enable Register (IER)
7 IRQ7E 0 R/W 6 IRQ6E 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W 2 IRQ2E 0 R/W 1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
Initial value Read/Write
IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests IRQ7 to IRQ0. IER is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 0—IRQ7 to IRQ0 Enable (IRQ7E to IRQ0E): These bits select whether IRQ7 to IRQ0 are enabled or disabled.
Bit n IRQnE 0 1 Description IRQn interrupt disabled IRQn interrupt enabled (Initial value)
Note: n = 7 to 0
5.2.4
IRQ Sense Control Registers H and L (ISCRH, ISCRL)
• ISCRH
Bit Initial value Read/Write 15 0 R/W 14 0 R/W 13 0 R/W 12 0 R/W 11 0 R/W 10 0 R/W 9 0 R/W 8 0 R/W IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
• ISCRL
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
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Section 5 Interrupt Controller
ISCRH and ISCRL are 8-bit readable/writable registers that select rising edge, falling edge, or both edge detection, or level sensing, for the input at pins IRQ7 to IRQ0. Each of the ISCR registers is initialized to H'00 by a reset and in hardware standby mode. ISCRH Bits 7 to 0, ISCRL Bits 7 to 0: IRQ7 Sense Control A and B (IRQ7SCA, IRQ7SCB) to IRQ0 Sense Control A and B (IRQ0SCA, IRQ0SCB)
ISCRH Bits 7 to 0 ISCRL Bits 7 to 0 IRQ7SCB to IRQ0SCB 0 IRQ7SCA to IRQ0SCA 0 1 1 0 1 Description Interrupt request generated at IRQ7 to IRQ0 input low level (Initial value) Interrupt request generated at falling edge of IRQ7 to IRQ0 input Interrupt request generated at rising edge of IRQ7 to IRQ0 input Interrupt request generated at both falling and rising edges of IRQ7 to IRQ0 input
5.2.5
Bit
IRQ Status Register (ISR)
7 IRQ7F 0 R/(W)* 6 IRQ6F 0 R/(W)* 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)* 1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
Initial value Read/Write
Note: * Only 0 can be written, to clear the flag.
ISR is an 8-bit readable/writable register that indicates the status of IRQ7 to IRQ0 interrupt requests. ISR is initialized to H'00 by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bits 7 to 0—IRQ7 to IRQ0 Flags (IRQ7F to IRQ0F): These bits indicate the status of IRQ7 to IRQ0 interrupt requests.
Bit n IRQnF 0 Description [Clearing conditions] • • • 1 Cleared by reading IRQnF when set to 1, then writing 0 in IRQnF When interrupt exception handling is executed while low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high* When IRQn interrupt exception handling is executed while falling, rising, or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1)* When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA = 0) When a falling edge occurs in IRQn input while falling edge detection is set (IRQnSCB = 0, IRQnSCA = 1) When a rising edge occurs in IRQn input while rising edge detection is set (IRQnSCB = 1, IRQnSCA = 0) When a falling or rising edge occurs in IRQn input while both-edge detection is set (IRQnSCB = IRQnSCA = 1) (Initial value)
[Setting conditions] • • • •
Notes: n = 7 to 0 * When a product, in which a DTC is incorporated, is used in the following settings, the corresponding flag bit is not automatically cleared even when exception handling, which is a clear condition, is executed and the bit is held at 1. (1) When DTCEA3 is set to 1 (ADI is set to an interrupt source), IRQ4F flag is not automatically cleared. (2) When DTCEA2 is set to 1 (ICIA is set to an interrupt source), IRQ5F flag is not automatically cleared. (3) When DTCEA1 is set to 1 (ICIB is set to an interrupt source), IRQ6F flag is not automatically cleared. (4) When DTCEA0 is set to 1 (OCIA is set to an interrupt source), IRQ7F flag is not automatically cleared. When activation interrupt sources of DTC and IRQ interrupts are used with the above combinations, clear the interrupt flag by software in the interrupt handling routine of the corresponding IRQ.
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Section 5 Interrupt Controller
5.2.6
Bit
Keyboard Matrix Interrupt Mask Register (KMIMR)
7 1 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
KMIMR7 KMIMR6 KMIMR5 KMIMR4 KMIMR3 KMIMR2 KMIMR1 KMIMR0 Initial value Read/Write
KMIMR is an 8-bit readable/writable register that performs mask control for the keyboard matrix interrupt inputs (pins KIN7 to KIN0). To enable key-sense input interrupts from multiple pin inputs in keyboard matrix scanning/sensing, clear the corresponding mask bits to 0. KMIMR is initialized to H'BF by a reset and in hardware standby mode and only IRQ6 (KIN6) input is enabled. Bits 7 to 0—Keyboard Matrix Interrupt Mask (KMIMR7 to KMIMR0): These bits control key-sense input interrupt requests (KIN7 to KIN0).
Bits 7 to 0 KMIMR7 to KMIMR0 Description 0 1 Note: * Key-sense input interrupt requests enabled Key-sense input interrupt requests disabled (Initial value)* However, the initial value of KMIMR6 is 0 because the KMIMR6 bit controls both IRQ6 interrupt request masking and key-sense input enabling.
5.2.7
Bit
Keyboard Matrix Interrupt Mask Register (KMIMRA)
7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
KMIMR15 KMIMR14 KMIMR13 KMIMR12 KMIMR11 KMIMR10 KMIMR9 KMIMR8 Initial value Read/Write
KMIMRA is an 8-bit readable/writable register that performs mask control for the keyboard matrix interrupt inputs (pins KIN15 to KIN8). To enable key-sense input interrupts from multiple pin inputs in keyboard matrix scanning/sensing, clear the corresponding mask bits to 0. KMIMRA is initialized to H'FF by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bits 7 to 0—Keyboard Matrix Interrupt Mask (KMIMR15 to KMIMR8): These bits control key-sense input interrupt requests (KIN15 to KIN8).
Bits 7 to 0 KMIMR15 to KMIMR8 Description 0 1 Key-sense input interrupt requests enabled Key-sense input interrupt requests disabled (Initial value)
Figure 5.2 shows the relationship between interrupts IRQ7 and IRQ6, interrupts KIN15 to KIN0, and registers KMIMR and KMIMRA.
KMIMR0 (initial value 1) P60/KIN0
KMIMR5 (initial value 1) P65/KIN5 KMIMR6 (initial value 0) P66/KIN6/IRQ6 KMIMR7 (initial value 1) P67/KIN7/IRQ7
IRQ6 internal signal Edge/level selection enable/disable circuit IRQ6 interrupt
IRQ6E IRQ6SC
KMIMR8 (initial value 1) PA0/KIN8 KMIMR9 (initial value 1) PA1/KIN9 KMIMR15 (initial value 1) PA7/KIN15
IRQ7 internal signal Edge/level selection enable/disable circuit IRQ7 interrupt
IRQ7E IRQ7SC
Figure 5.2 Relationship between Interrupts IRQ7 and IRQ6, Interrupts KIN15 to KIN0, and Registers KMIMR and KMIMRA
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Section 5 Interrupt Controller
If any of bits KMIMR15 to KMIMR8 is cleared to 0, interrupt input from the IRQ7 pin will be ignored. When pins KIN7 to KIN0 or KIN15 to KIN8 are used as key-sense interrupt input pins, either low-level sensing or falling-edge sensing must be designated as the interrupt sense condition for the corresponding interrupt source (IRQ6 or IRQ7). 5.2.8
Bit Initial value Read/Write
Address Break Control Register (ABRKCR)
7 CMF 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 — 0 — 0 BIE 0 R/W
ABRKCR is an 8-bit readable/writable register that performs address break control. ABRKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Condition Match Flag (CMF): This is the address break source flag, used to indicate that the address set by BAR has been prefetched. When the CMF flag and BIE flag are both set to 1, an address break is requested.
Bit 7 CMF 0 1 Description [Clearing condition] When address break interrupt exception handling is executed [Setting condition] When address set by BARA to BARC is prefetched while BIE = 1 (Initial value)
Bits 6 to 1—Reserved: These bits cannot be modified and are always read as 0. Bit 0—Break Interrupt Enable (BIE): Selects address break enabling or disabling.
Bit 0 BIE 0 1 Description Address break disabled Address break enabled (Initial value)
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Section 5 Interrupt Controller
5.2.9
Bit BARA
Break Address Registers A, B, C (BARA, BARB, BARC)
7 A23 0 R/W 7 A15 0 R/W 7 A7 0 R/W 6 A22 0 R/W 6 A14 0 R/W 6 A6 0 R/W 5 A21 0 R/W 5 A13 0 R/W 5 A5 0 R/W 4 A20 0 R/W 4 A12 0 R/W 4 A4 0 R/W 3 A19 0 R/W 3 A11 0 R/W 3 A3 0 R/W 2 A18 0 R/W 2 A10 0 R/W 2 A2 0 R/W 1 A17 0 R/W 1 A9 0 R/W 1 A1 0 R/W 0 A16 0 R/W 0 A8 0 R/W 0 — 0 —
Initial value Read/Write Bit BARB Initial value Read/Write Bit BARC Initial value Read/Write
BAR consists of three 8-bit readable/writable registers (BARA, BARB, and BARC), and is used to specify the address at which an address break is to be executed. Each of the BAR registers is initialized to H'00 by a reset and in hardware standby mode. They are not initialized in software standby mode. BARA Bits 7 to 0—Address 23 to 16 (A23 to A16) BARB Bits 7 to 0—Address 15 to 8 (A15 to A8) BARC Bits 7 to 1—Address 7 to 1 (A7 to A1) These bits specify the address at which an address break is to be executed. BAR bits A23 to A1 are compared with internal address bus lines A23 to A1, respectively. The address at which the first instruction byte is located should be specified as the break address. Occurrence of the address break condition may not be recognized for other addresses. In normal mode, no comparison is made with address lines A23 to A16. BARC Bit 0—Reserved: This bit cannot be modified and is always read as 0.
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Section 5 Interrupt Controller
5.3
Interrupt Sources
Interrupt sources comprise external interrupts (NMI and IRQ7 to IRQ0) and internal interrupts. 5.3.1 External Interrupts
There are nine external interrupt sources from 25 input pins (23 actual pins): NMI, IRQ7 to IRQ0, and KIN15 to KIN0. KIN15 to KIN8 share the IRQ7 interrupt source, and KIN7 to KIN0 share the IRQ6 interrupt source. Of these, NMI, IRQ7, IRQ6, and IRQ2 to IRQ0 can be used to restore the H8S/2148 Group or H8S/2144 Group chip from software standby mode. NMI Interrupt NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the interrupt control mode and the status of the CPU interrupt mask bits. The NMIEG bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a falling edge on the NMI pin. The vector number for NMI interrupt exception handling is 7. IRQ7 to IRQ0 Interrupts Interrupts IRQ7 to IRQ0 are requested by an input signal at pins IRQ7 to IRQ0. Interrupts IRQ7 to IRQ0 have the following features: • Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling edge, rising edge, or both edges, at pins IRQ7 to IRQ0. • Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER. • The interrupt control level can be set with ICR. • The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0 by software. A block diagram of interrupts IRQ7 to IRQ0 is shown in figure 5.3.
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Section 5 Interrupt Controller
IRQnE IRQnSCA, IRQnSCB IRQnF Edge/level detection circuit IRQn input Clear signal Note: n: 7 to 0 S R Q IRQn interrupt request
Figure 5.3 Block Diagram of Interrupts IRQ7 to IRQ0 Figure 5.4 shows the timing of IRQnF setting.
φ
IRQn input pin
IRQnF
Figure 5.4 Timing of IRQnF Setting The vector numbers for IRQ7 to IRQ0 interrupt exception handling are 23 to 16. Detection of IRQ7 to IRQ0 interrupts does not depend on whether the relevant pin has been set for input or output. Therefore, when a pin is used as an external interrupt input pin, clear the corresponding DDR bit to 0 and do not use the pin as an I/O pin for another function. When the IRQ6 pin is assigned as the IRQ6 interrupt input pin, then set the KMIMR6 bit to 0. When the IRQ7 pin is used as the IRQ7 interrupt input pin, bits KMIMR15 to KMIMR8 must all be set to 1. If any of these bits is cleared to 0, interrupt input from the IRQ7 pin will be ignored. As interrupt request flags IRQ7F to IRQ0F are set when the setting condition is met, regardless of the IER setting, only the necessary flags should be referenced.
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Section 5 Interrupt Controller
Interrupts KIN15 to KIN0 Interrupts KIN15 to KIN0 are requested by input signals at pins KIN15 to KIN 0. When any of pins KIN15 to KIN0 are used as key-sense inputs, the corresponding KMIMR bits should be cleared to 0 to enable those key-sense input interrupts. The remaining unused key-sense input KMIMR bits should be set to 1 to disable those interrupts. Interrupts KIN15 to KIN8 correspond to the IRQ7 interrupt, and interrupts KIN7 to KIN0 correspond to the IRQ6 interrupt. Interrupt request generation pin conditions, interrupt request enabling, interrupt control level setting, and interrupt request status indications, are all in accordance with the IRQ7 and IRQ6 interrupt settings. When pins KIN7 to KIN0 or KIN15 to KIN8 are used as key-sense interrupt input pins, either low-level sensing or falling-edge sensing must be designated as the interrupt sense condition for the corresponding interrupt source (IRQ6 or IRQ7). 5.3.2 Internal Interrupts
There are 43 sources for internal interrupts from on-chip supporting modules, plus one software interrupt source (address break). • For each on-chip supporting module there are flags that indicate the interrupt request status, and enable bits that select enabling or disabling of these interrupts. If any one of these is set to 1, an interrupt request is issued to the interrupt controller. • The interrupt control level can be set by means of ICR. • The DTC can be activated by an FRT, TMR, SCI, or other interrupt request. When the DTC is activated by an interrupt, the interrupt control mode and interrupt mask bits have no effect. 5.3.3 Interrupt Exception Vector Table
Table 5.4 shows interrupt exception handling sources, vector addresses, and interrupt priorities. For default priorities, the lower the vector number, the higher the priority. Priorities among modules can be set by means of ICR. The situation when two or more modules are set to the same priority, and priorities within a module, are fixed as shown in table 5.4.
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Section 5 Interrupt Controller
Table 5.4
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Origin of Interrupt Source External pin Vector Address Vector Normal Number Mode 7 16 17 18 19 20 21 22 23 DTC Watchdog timer 0 Watchdog timer 1 — A/D — 24 25 26 27 28 29 to 47 H'000E H'0020 H'0022 H'0024 H'0026 H'0028 H'002A H'002C H'002E H'0030 H'0032 H'0034 H'0036 H'0038 H'003A to H'005E H'0060 H'0062 H'0064 H'0066 H'0068 H'006A H'006C H'006E H'0070 to H'007E Advanced Mode H'00001C H'000040 H'000044 H'000048 H'00004C H'000050 H'000054 H'000058 H'00005C H'000060 H'000064 H'000068 H'00006C H'000070 H'000074 to H'0000BC H'0000C0 H'0000C4 H'0000C8 H'0000CC H'0000D0 H'0000D4 H'0000D8 H'0000DC H'0000E0 to H'0000FC ICRB6 ICRB7 ICRA2 ICRA1 ICRA0 ICRA3 ICRA4 ICRA7 ICRA6 ICRA5 ICR Priority High
Interrupt Source NMI IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 IRQ6, KIN7 to KIN0 IRQ7, KIN15 to KIN8 SWDTEND (software activation interrupt end) WOVI0 (interval timer) WOVI1 (interval timer) Address break (PC break) ADI (A/D conversion end) Reserved
ICIA (input capture A) ICIB (input capture B) ICIC (input capture C) ICID (input capture D) OCIA (output compare A) OCIB (output compare B) FOVI (overflow) Reserved Reserved
Free-running 48 timer 49 50 51 52 53 54 55 — 56 to 63
Low
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Section 5 Interrupt Controller Origin of Interrupt Source 8-bit timer channel 0 Vector Address Vector Normal Number Mode 64 65 66 67 8-bit timer channel 1 68 69 70 71 8-bit timer channels Y, X 72 73 74 75 76 77 78 79 SCI channel 0 80 81 82 83 SCI channel 1 84 85 86 87 SCI channel 2 88 89 90 91 IIC channel 0 92 (option) 93 H'0080 H'0082 H'0084 H'0086 H'0088 H'008A H'008C H'008E H'0090 H'0092 H'0094 H'0096 H'0098 H'009A H'009C H'009E H'00A0 H'00A2 H'00A4 H'00A6 H'00A8 H'00AA H'00AC H'00AE H'00B0 H'00B2 H'00B4 H'00B6 H'00B8 H'00BA Advanced Mode H'000100 H'000104 H'000108 H'00010C H'000110 H'000114 H'000118 H'00011C H'000120 H'000124 H'000128 H'00012C H'000130 H'000134 H'000138 H'00013C H'000140 H'000144 H'000148 H'00014C H'000150 H'000154 H'000158 H'00015C H'000160 H'000164 H'000168 H'00016C H'000170 H'000174 ICRC4 Low ICRC5 ICRC6 ICRC7 ICRB0 ICRB1 ICRB2 ICR Priority
Interrupt Source CMIA0 (compare-match A) CMIB0 (compare-match B) OVI0 (overflow) Reserved CMIA1 (compare-match A) CMIB1 (compare-match B) OVI1 (overflow) Reserved CMIAY (compare-match A) CMIBY (compare-match B) OVIY (overflow) ICIX (input capture X)
ICRB3 High
IBF1 (IDR1 reception completed) Host IBF2 (IDR2 reception completed) interface IBF3 (IDR3 reception completed) IBF4 (IDR4 reception completed) ERI0 (receive error 0) RXI0 (reception completed 0) TXI0 (transmit data empty 0) TEI0 (transmission end 0) ERI1 (receive error 1) RXI1 (reception completed 1) TXI1 (transmit data empty 1) TEI1 (transmission end 1) ERI2 (receive error 2) RXI2 (reception completed 2) TXI2 (transmit data empty 2) TEI2 (transmission end 2) IICI0 (1-byte transmission/ reception completed) DDCSWI (format switch)
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Section 5 Interrupt Controller Origin of Interrupt Source Vector Address Vector Normal Number Mode H'00BC H'00BE H'00C0 H'00C2 H'00C4 H'00C6 H'00C8 to H'00CE Advanced Mode H'000178 H'00017C H'000180 H'000184 H'000188 H'00018C H'000190 to H'00019C ICRB0 ICR Priority
Interrupt Source IICI1 (1-byte transmission/ reception completed) Reserved PS2IA (reception completed A) PS2IB (reception completed B) PS2IC (reception completed C) Reserved Reserved
IIC channel 1 94 (option) 95 Keyboard buffer controller (PS2) — 96 97 98 99 100 to 103
ICRC3 High
Low
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Section 5 Interrupt Controller
5.4
5.4.1
Address Breaks
Features
With this LSI, it is possible to identify the prefetch of a specific address by the CPU and generate an address break interrupt, using the ABRKCR and BAR registers. When an address break interrupt is generated, address break interrupt exception handling is executed. This function can be used to detect the beginning of execution of a bug location in the program, and branch to a correction routine. 5.4.2 Block Diagram
A block diagram of the address break function is shown in figure 5.5.
BAR
ABRKCR
Comparator
Match signal
Control logic
Address break interrupt request
Internal address Prefetch signal (internal signal)
Figure 5.5 Block Diagram of Address Break Function
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Section 5 Interrupt Controller
5.4.3
Operation
ABRKCR and BAR settings can be made so that an address break interrupt is generated when the CPU prefetches the address set in BAR. This address break function issues an interrupt request to the interrupt controller when the address is prefetched, and the interrupt controller determines the interrupt priority. When the interrupt is accepted, interrupt exception handling is started on completion of the currently executing instruction. With an address break interrupt, interrupt mask control by the I and UI bits in the CPU’s CCR is ineffective. The register settings when the address break function is used are as follows. 1. Set the break address in bits A23 to A1 in BAR. 2. Set the BIE bit in ABRKCR to 1 to enable address breaks. An address break will not be requested if the BIE bit is cleared to 0. When the setting condition occurs, the CMF flag in ABRKCR is set to 1 and an interrupt is requested. If necessary, the source should be identified in the interrupt handling routine. 5.4.4 Usage Notes
• With the address break function, the address at which the first instruction byte is located should be specified as the break address. Occurrence of the address break condition may not be recognized for other addresses. • In normal mode, no comparison is made with address lines A23 to A16. • If a branch instruction (Bcc, BSR), jump instruction (JMP, JSR), RTS instruction, or RTE instruction is located immediately before the address set in BAR, execution of this instruction will output a prefetch signal for that address, and an address break may be requested. This can be prevented by not making a break address setting for an address immediately following one of these instructions, or by determining within the interrupt handling routine whether interrupt handling was initiated by a genuine condition occurrence. • As an address break interrupt is generated by a combination of the internal prefetch signal and address, the timing of the start of interrupt exception handling depends on the content and execution cycle of the instruction at the set address and the preceding instruction. Figure 5.6 shows some address timing examples.
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Section 5 Interrupt Controller
• Program area in on-chip memory, 1-state execution instruction at specified break address
Instruction Instruction Instruction Instruction Instruction Internal fetch fetch fetch fetch fetch operation φ Stack save Vector fetch Internal Instruction operation fetch
Address bus
H'0310
H'0312
H'0314
H'0316
H'0318
SP-2
SP-4
H'0036
NOP NOP NOP execution execution execution
Break request signal H'0310 H'0312 H'0314 H'0316 NOP NOP NOP NOP
Interrupt exception handling
Breakpoint
NOP instruction is executed at breakpoint address H'0312 and next address, H'0314; fetch from address H'0316 starts after end of exception handling.
• Program area in on-chip memory, 2-state execution instruction at specified break address
Instruction Instruction Instruction Instruction Instruction Internal fetch fetch fetch fetch fetch operation φ Stack save Vector fetch Internal Instruction operation fetch
Address bus
H'0310
H'0312
H'0314
H'0316
H'0318
SP-2
SP-4
H'0036
NOP execution
Break request signal H'0310 H'0312 H'0316 H'0318 NOP MOV.W #xx:16,Rd NOP NOP
MOV.W execution
Interrupt exception handling
Breakpoint
MOV instruction is executed at breakpoint address H'0312, NOP instruction at next address, H'0316, is not executed; fetch from address H'0316 starts after end of exception handling.
• Program area in external memory (2-state access, 16-bit-bus access), 1-state execution instruction at specified break address
Instruction fetch Instruction fetch
Instruction fetch
Internal operation
Stack save
Vector fetch
Internal operation
φ
Address bus
H'0310
H'0312
H'0314
SP-2
SP-4
H'0036
NOP execution Break request signal H'0310 H'0312 H'0314 H'0316 NOP NOP NOP NOP
Interrupt exception handling
Breakpoint
NOP instruction at breakpoint address H'0312 is not executed; fetch from address H'0312 starts after end of exception handling.
Figure 5.6 Examples of Address Break Timing
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Section 5 Interrupt Controller
5.5
5.5.1
Interrupt Operation
Interrupt Control Modes and Interrupt Operation
Interrupt operations in this LSI differ depending on the interrupt control mode. NMI and address break interrupts are accepted at all times except in the reset state and the hardware standby state. In the case of IRQ interrupts and on-chip supporting module interrupts, an enable bit is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt controller. Table 5.5 shows the interrupt control modes. The interrupt controller performs interrupt control according to the interrupt control mode set by the INTM1 and INTM0 bits in SYSCR, the priorities set in ICR, and the masking state indicated by the I and UI bits in the CPU’s CCR. Table 5.5 Interrupt Control Modes
Interrupt Mask Bits Description I Interrupt mask control is performed by the I bit Priority can be set with ICR 1 1 ICR I, UI 3-level interrupt mask control is performed by the I and UI bits Priority can be set with ICR
SYSCR Interrupt Priority Setting Control Mode INTM1 INTM0 Register 0 0 0 ICR
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Section 5 Interrupt Controller
Figure 5.7 shows a block diagram of the priority decision circuit.
I ICR UI
Interrupt source
Interrupt acceptance control and 3-level mask control
Default priority determination
Vector number
Interrupt control modes 0 and 1
Figure 5.7 Block Diagram of Interrupt Control Operation Interrupt Acceptance Control and 3-Level Control In interrupt control modes 0 and 1, interrupt acceptance control and 3-level mask control is performed by means of the I and UI bits in CCR, and ICR (control level). Table 5.6 shows the interrupts selected in each interrupt control mode.
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Section 5 Interrupt Controller
Table 5.6
Interrupts Selected in Each Interrupt Control Mode
Interrupt Mask Bits
Interrupt Control Mode 0 1
I 0 1 0 1
UI * * * 0 1
Selected Interrupts All interrupts (control level 1 has priority) NMI and address break interrupts All interrupts (control level 1 has priority) NMI, address break and control level 1 interrupts NMI, and address break interrupts
Legend: *: Don’t care
Default Priority Determination The priority is determined for the selected interrupt, and a vector number is generated. If the same value is set for ICR, acceptance of multiple interrupts is enabled, and so only the interrupt source with the highest priority according to the preset default priorities is selected and has a vector number generated. Interrupt sources with a lower priority than the accepted interrupt source are held pending. Table 5.7 shows operations and control signal functions in each interrupt control mode. Table 5.7 Operations and Control Signal Functions in Each Interrupt Control Mode
Setting INTM1 INTM0 Interrupt Acceptance Control 3-Level Control I UI ICR Default Priority Determination T (Trace)
Interrupt Control Mode
0 1
0 0
0 1
O O
IM IM
— IM
PR PR
O O
— —
Legend: O: Interrupt operation control performed IM: Used as interrupt mask bit PR: Sets priority —: Not used
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Section 5 Interrupt Controller
5.5.2
Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by means of the I bit in the CPU’s CCR, and ICR. Interrupts are enabled when the I bit is cleared to 0, and disabled when set to 1. Control level 1 interrupt sources have higher priority. Figure 5.8 shows a flowchart of the interrupt acceptance operation in this case. 1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. 2. When interrupt requests are sent to the interrupt controller, a control level 1 interrupt, according to the control level set in ICR, has priority for selection, and other interrupt requests are held pending. If a number of interrupt requests with the same control level setting are generated at the same time, the interrupt request with the highest priority according to the priority system shown in table 5.4 is selected. 3. The I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I bit is set to 1, only NMI and address break interrupt are accepted, and other interrupt requests are held pending. 4. When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. 5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. 6. Next, the I bit in CCR is set to 1. This disables all interrupts except NMI and address break. 7. A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address.
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Section 5 Interrupt Controller
Program execution state
Interrupt generated? Yes Yes
No
NMI? No
Control level 1 interrupt? Yes No
IRQ0?
No
Hold pending
No
IRQ0?
Yes
No
IRQ1?
Yes
IRQ1?
No
Yes
Yes
PS2IC?
Yes
PS2IC?
Yes
I = 0? Yes
No
Save PC and CCR I←1 Read vector address
Branch to interrupt handling routine
Figure 5.8 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 0
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Section 5 Interrupt Controller
5.5.3
Interrupt Control Mode 1
Three-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts by means of the I and UI bits in the CPU’s CCR, and ICR. • Control level 0 interrupt requests are enabled when the I bit is cleared to 0, and disabled when set to 1. • Control level 1 interrupt requests are enabled when the I bit or UI bit is cleared to 0, and disabled when both the I bit and the UI bit are set to 1. For example, if the interrupt enable bit for an interrupt request is set to 1, and H'20, H'00, and H'00 are set in ICRA, ICRB, and ICRC, respectively, (i.e. IRQ2 and IRQ3 interrupts are set to control level 1 and other interrupts to control level 0), the situation is as follows: • When I = 0, all interrupts are enabled (Priority order: NMI > IRQ2 > IRQ3 > address break > IRQ0 > IRQ1 ...) • When I = 1 and UI = 0, only NMI, IRQ2, IRQ3 and address break interrupts are enabled • When I = 1 and UI = 1, only NMI and address break interrupts are enabled Figure 5.9 shows the state transitions in these cases.
I←0 All interrupts enabled I ← 1, UI ← 0
Only NMI, IRQ2, IRQ3, and address break interrupts enabled
I←0 Exception handling execution or I ← 1, UI ← 1
UI ← 0 Exception handling execution or UI ← 1
Only NMI interrupts and address break enabled
Figure 5.9 Example of State Transitions in Interrupt Control Mode 1
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Section 5 Interrupt Controller
Figure 5.10 shows a flowchart of the interrupt acceptance operation in this case. 1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. 2. When interrupt requests are sent to the interrupt controller, a control level 1 interrupt, according to the control level set in ICR, has priority for selection, and other interrupt requests are held pending. If a number of interrupt requests with the same control level setting are generated at the same time, the interrupt request with the highest priority according to the priority system shown in table 5.4 is selected. 3. The I bit is then referenced. If the I bit is cleared to 0, the UI bit has no effect. An interrupt request set to interrupt control level 0 is accepted when the I bit is cleared to 0. If the I bit is set to 1, only an NMI and address break interrupts are accepted, and other interrupt requests are held pending. An interrupt request set to interrupt control level 1 has priority over an interrupt request set to interrupt control level 0, and is accepted if the I bit is cleared to 0, or if the I bit is set to 1 and the UI bit is cleared to 0. When both the I bit and the UI bit are set to 1, only an NMI and address break interrupts are accepted, and other interrupt requests are held pending. 4. When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. 5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. 6. Next, the I and UI bits in CCR are set to 1. This disables all interrupts except NMI and address break. 7. A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address.
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Section 5 Interrupt Controller
Program execution state No
Interrupt generated? Yes Yes
NMI? No
Control level 1 interrupt? Yes No No IRQ1? Yes PS2IC? Yes
No
Hold pending
No IRQ0? Yes IRQ1? Yes PS2IC? Yes No
IRQ0? Yes
I = 0? Yes
No
I=0 No Yes
No
UI = 0? Yes
Save PC and CCR I ← 1, UI ← 1 Read vector address
Branch to interrupt handling routine
Figure 5.10 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 1
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Section 5 Interrupt Controller
5.5.4
Interrupt Exception Handling Sequence
Figure 5.11 shows the interrupt exception handling sequence. The example shown is for the case where interrupt control mode 0 is set in advanced mode, and the program area and stack area are in on-chip memory.
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Interrupt acceptance Interrupt level determination Wait for end of instruction Instruction prefetch Stack Vector fetch Internal operation Internal operation
Interrupt handling routine instruction prefetch
Section 5 Interrupt Controller
φ
Interrupt request signal
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Internal address bus (1) (3)
(7)
(5)
(9)
(11)
(13)
Internal read signal Internal write signal Internal data bus (2) (4) (6)
(8) (10) (12) (14)
Figure 5.11 Interrupt Exception Handling
(1) Instruction prefetch address (Not executed. This is the contents of the saved PC, the return address.) (2) (4) Instruction code (Not executed.) (3) Instruction prefetch address (Not executed.) (5) SP-2 (7) SP-4
(6) (8) Saved PC and saved CCR (9) (11) Vector address (10) (12) Interrupt handling routine start address (vector address contents) (13) Interrupt handling routine start address ((13) = (10) (12)) (14) First instruction of interrupt handling routine
Section 5 Interrupt Controller
5.5.5
Interrupt Response Times
This LSI are capable of fast word access to on-chip memory, and high-speed processing can be achieved by providing the program area in on-chip ROM and the stack area in on-chip RAM. Table 5.8 shows interrupt response times—the interval between generation of an interrupt request and execution of the first instruction in the interrupt handling routine. The symbols used in table 5.8 are explained in table 5.9. Table 5.8 Interrupt Response Times
Number of States No. 1 2 3 4 5 6 Item
1 Interrupt priority determination*
Normal Mode 3 1 to 19+2·SI 2·SK SI 2·SI
4
Advanced Mode 3 1 to 19+2·SI 2·SK 2·SI 2·SI 2 12 to 32
Number of wait states until executing 2 instruction ends* PC, CCR stack save Vector fetch
3 Instruction fetch*
Internal processing*
2 11 to 31
Total (using on-chip memory) Notes: 1. 2. 3. 4.
Two states in case of internal interrupt. Refers to MULXS and DIVXS instructions. Prefetch after interrupt acceptance and interrupt handling routine prefetch. Internal processing after interrupt acceptance and internal processing after vector fetch.
Table 5.9
Number of States in Interrupt Handling Routine Execution
Object of Access External Device 8-Bit Bus Symbol Internal Memory 1 2-State Access 4 3-State Access 6+2m 16-Bit Bus 2-State Access 2 3-State Access 3+m
Instruction fetch Branch address read Stack manipulation
SI SJ SK
Legend: m: Number of wait states in an external device access
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Section 5 Interrupt Controller
5.6
5.6.1
Usage Notes
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective after execution of the instruction. In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an interrupt is generated during execution of the instruction, the interrupt concerned will still be enabled on completion of the instruction, and so interrupt exception handling for that interrupt will be executed on completion of the instruction. However, if there is an interrupt request of higher priority than that interrupt, interrupt exception handling will be executed for the higher-priority interrupt, and the lower-priority interrupt will be ignored. The same also applies when an interrupt source flag is cleared to 0. Figure 5.12 shows an example in which the CMIEA bit in 8-bit timer register TCR is cleared to 0.
TCR write cycle by CPU CMIA exception handling
φ
Internal address bus
TCR address
Internal write signal
CMIEA
CMFA
CMIA interrupt signal
Figure 5.12 Contention between Interrupt Generation and Disabling
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Section 5 Interrupt Controller
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while the interrupt is masked. 5.6.2 Instructions That Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these instructions is executed, all interrupts except NMI are disabled and the next instruction is always executed. When the I bit or UI bit is set by one of these instructions, the new value becomes valid two states after execution of the instruction ends. 5.6.3 Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction. With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer is not accepted until the move is completed. With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this case is the address of the next instruction. Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the following coding should be used.
L1: EEPMOV.W MOV.W BNE R4,R4 L1
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Section 5 Interrupt Controller
5.7
5.7.1
DTC Activation by Interrupt
Overview
The DTC can be activated by an interrupt. In this case, the following options are available: • Interrupt request to CPU • Activation request to DTC • Both of the above For details of interrupt requests that can be used to activate the DTC, see section 7, Data Transfer Controller (DTC). 5.7.2 Block Diagram
Figure 5.13 shows a block diagram of the DTC and interrupt controller.
Interrupt request IRQ interrupt Interrupt source clear signal
Selection circuit Select signal Clear signal DTCER
DTC activation request vector number
Control logic Clear signal
DTC
On-chip supporting module
DTVECR SWDTE clear signal Determination of priority CPU interrupt request vector number CPU I, UI
Interrupt controller
Figure 5.13 Interrupt Control for DTC
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Section 5 Interrupt Controller
5.7.3
Operation
The interrupt controller has three main functions in DTC control. Selection of Interrupt Source: It is possible to select DTC activation request or CPU interrupt request with the DTCE bit of DTCERA to DTCERE in the DTC. After a DTC data transfer, the DTCE bit can be cleared to 0 and an interrupt request sent to the CPU in accordance with the specification of the DISEL bit of MRB in the DTC. When the DTC performs the specified number of data transfers and the transfer counter reaches 0, following the DTC data transfer the DTCE bit is cleared to 0 and an interrupt request is sent to the CPU. Determination of Priority: The DTC activation source is selected in accordance with the default priority order, and is not affected by mask or priority levels. See section 7.3.3, DTC Vector Table, for the respective priorities. Operation Order: If the same interrupt is selected as a DTC activation source and a CPU interrupt source, the DTC data transfer is performed first, followed by CPU interrupt exception handling.
Table 5.10 summarizes interrupt source selection and interrupt source clearance control according to the settings of the DTCE bit of DTCERA to DTCERE in the DTC and the DISEL bit of MRB in the DTC. Table 5.10 Interrupt Source Selection and Clearing Control
Settings DTC DTCE 0 1 DISEL * 0 1 × ∆ Interrupt Source Selection/Clearing Control DTC CPU ∆ × ∆
Legend: ∆: The relevant interrupt is used. Interrupt source clearing is performed. (The CPU should clear the source flag in the interrupt handling routine.) : The relevant interrupt is used. The interrupt source is not cleared. ×: The relevant bit cannot be used. *: Don’t care
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Section 5 Interrupt Controller
Usage Note SCI, IIC, and A/D converter interrupt sources are cleared when the DTC reads or writes to the prescribed register, and are not dependent upon the DISEL bit.
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Section 6 Bus Controller
Section 6 Bus Controller
6.1 Overview
This LSI have a built-in bus controller (BSC) that allows external address space bus specifications, such as bus width and number of access states, to be set. The bus controller also has a bus arbitration function, and controls the operation of the internal bus masters: the CPU and data transfer controller (DTC). 6.1.1 Features
The features of the bus controller are listed below. • Basic bus interface 2-state access or 3-state access can be selected Program wait states can be inserted • Burst ROM interface External space can be designated as ROM interface space 1-state or 2-state burst access can be selected • Idle cycle insertion An idle cycle can be inserted when an external write cycle immediately follows an external read cycle • Bus arbitration function Includes a bus arbiter that arbitrates bus mastership between the CPU and DTC
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Section 6 Bus Controller
6.1.2
Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
External bus control signals Bus controller
Internal control signals
Bus mode signal WSCR BCR WAIT Internal data bus Wait controller
CPU bus request signal DTC bus request signal Bus arbiter CPU bus acknowledge signal DTC bus acknowledge signal
Figure 6.1 Block Diagram of Bus Controller
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Section 6 Bus Controller
6.1.3
Pin Configuration
Table 6.1 summarizes the pins of the bus controller. Table 6.1
Name Address strobe I/O select Read High write
Bus Controller Pins
Symbol AS IOS RD HWR I/O Output Output Output Output Function Strobe signal indicating that address output on address bus is enabled (when IOSE bit is 0) I/O select signal (when IOSE bit is 1) Strobe signal indicating that external space is being read Strobe signal indicating that external space is being written to, and that the upper data bus (D15 to D8) is enabled Strobe signal indicating that external space is being written to, and that the lower data bus (D7 to D0) is enabled Wait request signal when external 3-state access space is accessed
Low write
LWR
Output
Wait
WAIT
Input
6.1.4
Register Configuration
Table 6.2 summarizes the registers of the bus controller. Table 6.2
Name Bus control register Wait state control register Note: *
Bus Controller Registers
Abbreviation BCR WSCR R/W R/W R/W Initial Value H'D7 H'33 Address* H'FFC6 H'FFC7
Lower 16 bits of the address.
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Section 6 Bus Controller
6.2
6.2.1
Bit
Register Descriptions
Bus Control Register (BCR)
7 ICIS1 1 R/W 6 ICIS0 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 — 1 R/W 1 IOS1 1 R/W 0 IOS0 1 R/W
BRSTRM BRSTS1 BRSTS0
Initial value Read/Write
BCR is an 8-bit readable/writable register that specifies the external memory space access mode, and the extent of the I/O area when the I/O strobe function has been selected for the AS pin. BCR is initialized to H'D7 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Idle Cycle Insert 1 (ICIS1): Reserved. Do not write 0 to this bit. Bit 6—Idle Cycle Insert 0 (ICIS0): Selects whether or not a one-state idle cycle is to be inserted between bus cycles when successive external read and external write cycles are performed.
Bit 6 ICIS0 0 1 Description Idle cycle not inserted in case of successive external read and external write cycles Idle cycle inserted in case of successive external read and external write cycles (Initial value)
Bit 5—Burst ROM Enable (BRSTRM): Selects whether external space is designated as a burst ROM interface space. The selection applies to the entire external space.
Bit 5 BRSTRM 0 1 Description Basic bus interface Burst ROM interface (Initial value)
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Section 6 Bus Controller
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM interface.
Bit 4 BRSTS1 0 1 Description Burst cycle comprises 1 state Burst cycle comprises 2 states (Initial value)
Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a burst ROM interface burst access.
Bit 3 BRSTS0 0 1 Description Max. 4 words in burst access Max. 8 words in burst access (Initial value)
Bit 2—Reserved: Do not write 0 to this bit. Bits 1 and 0—IOS Select 1 and 0 (IOS1, IOS0): See table 6.4. 6.2.2
Bit Initial value Read/Write
Wait State Control Register (WSCR)
7 RAMS 0 R/W 6 RAM0 0 R/W 5 ABW 1 R/W 4 AST 1 R/W 3 WMS1 0 R/W 2 WMS0 0 R/W 1 WC1 1 R/W 0 WC0 1 R/W
WSCR is an 8-bit readable/writable register that specifies the data bus width, number of access states, wait mode, and number of wait states for external memory space. The on-chip memory and internal I/O register bus width and number of access states are fixed, irrespective of the WSCR settings. WSCR is initialized to H'33 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Section 6 Bus Controller
Bit 7—RAM Select (RAMS)/Bit 6—RAM Area Setting (RAM0): Reserved bits. Always write 0 when writing to these bits in the A-mask version. Bit 5—Bus Width Control (ABW): Specifies whether the external memory space is 8-bit access space or 16-bit access space.
Bit 5 ABW 0 1 Description External memory space is designated as 16-bit access space External memory space is designated as 8-bit access space (Initial value)
Bit 4—Access State Control (AST): Specifies whether the external memory space is 2-state access space or 3-state access space, and simultaneously enables or disables wait state insertion.
Bit 4 AST 0 1 Description External memory space is designated as 2-state access space Wait state insertion in external memory space accesses is disabled External memory space is designated as 3-state access space Wait state insertion in external memory space accesses is enabled (Initial value)
Bits 3 and 2—Wait Mode Select 1 and 0 (WMS1, WMS0): These bits select the wait mode when external memory space is accessed while the AST bit is set to 1.
Bit 3 WMS1 0 1 Bit 2 WMS0 0 1 0 1 Description Program wait mode Wait-disabled mode Pin wait mode Pin auto-wait mode (Initial value)
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Section 6 Bus Controller
Bits 1 and 0—Wait Count 1 and 0 (WC1, WC0): These bits select the number of program wait states when external memory space is accessed while the AST bit is set to 1.
Bit 1 WC1 0 1 Bit 0 WC0 0 1 0 1 Description No program wait states are inserted 1 program wait state is inserted in external memory space accesses 2 program wait states are inserted in external memory space accesses 3 program wait states are inserted in external memory space accesses (Initial value)
6.3
6.3.1
Overview of Bus Control
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access states, and wait mode and number of program wait states. The bus width and number of access states for on-chip memory and internal I/O registers are fixed, and are not affected by the bus controller. Bus Width: A bus width of 8 or 16 bits can be selected with the ABW bit. Number of Access States: Two or three access states can be selected with the AST bit. When 2-state access space is designated, wait insertion is disabled. The number of access states on the burst ROM interface is determined without regard to the AST bit setting. Wait Mode and Number of Program Wait States: When 3-state access space is designated by the AST bit, the wait mode and the number of program wait states to be inserted automatically is selected with WMS1, WMS0, WC1, and WC0. From 0 to 3 program wait states can be selected.
Table 6.3 shows the bus specifications for each basic bus interface area.
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Section 6 Bus Controller
Table 6.3
Bus Specifications for Each Area (Basic Bus Interface)
Bus Specifications (Basic Bus Interface)
ABW 0
AST 0 1
WMS1 WMS0 WC1 — 0 —* — 1 —* — — 0 1
WC0 — — 0 1 0 1 — — 0 1 0 1
Bus Width 16 16
Access States 2 3 3
Program Wait States 0 0 0 1 2 3
1
0 1
— 0 —*
— 1 —*
— — 0 1
8 8
2 3 3
0 0 0 1 2 3
Note:
*
Except when WMS1 = 0 and WMS0 = 1
6.3.2
Advanced Mode
The initial state of the external space is basic bus interface, three-state access space. In ROMenabled expanded mode, the space excluding the on-chip ROM, on-chip RAM, and internal I/O registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes external space. 6.3.3 Normal Mode
The initial state of the external memory space is basic bus interface, three-state access space. In ROM-disabled expanded mode, the space excluding the on-chip RAM and internal I/O registers is external space. In ROM-enabled expanded mode, the space excluding the on-chip ROM, on-chip RAM, and internal I/O registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the onchip RAM is disabled and the corresponding space becomes external space.
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Section 6 Bus Controller
6.3.4
I/O Select Signal
In this LSI, an I/O select signal (IOS) can be output, with the signal output going low when the designated external space is accessed. Figure 6.2 shows an example of IOS signal output timing.
Bus cycle T1 φ T2 T3
Address bus
External address in IOS set range
IOS
Figure 6.2 IOS Signal Output Timing IOS Enabling or disabling of IOS signal output is controlled by the setting of the IOSE bit in SYSCR. In expanded mode, this pin operates as the AS output pin after a reset, and therefore the IOSE bit in SYSCR must be set to 1 in order to use this pin as the IOS signal output. See section 8, I/O Ports, for details. The range of addresses for which the IOS signal is output can be set with bits IOS1 and IOS0 in BCR. The IOS signal address ranges are shown in table 6.4. Table 6.4
IOS1 0 1 Note: *
IOS Signal Output Range Settings
IOS0 0 1 0 1 IOS Signal Output Range H'(FF)F000 to H'(FF)F03F H'(FF)F000 to H'(FF)F0FF H'(FF)F000 to H'(FF)F3FF H'(FF)F000 to H'(FF)FE4F* (Initial value)
In the H8S/2148 and H8S/2147 F-ZTAT A-mask version, the address range is from H'(FF)F000 to H'(FF)F7FF.
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Section 6 Bus Controller
6.4
6.4.1
Basic Bus Interface
Overview
The basic bus interface enables direct connection of ROM, SRAM, and so on. The bus specifications can be selected with the ABW bit, the AST bit, and the WMS1, WMS0, WC1, and WC0 bits (see table 6.3). 6.4.2 Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications for the area being accessed (8-bit access space or 16-bit access space) and the data size. 8-Bit Access Space Figure 6.3 illustrates data alignment control for the 8-bit access space. With the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte: a word access is performed as two byte accesses, and a longword access, as four byte accesses.
Upper data bus Lower data bus D15 D8 D7 D0 Byte size 1st bus cycle 2nd bus cycle 1st bus cycle Longword size 2nd bus cycle 3rd bus cycle 4th bus cycle
Word size
Figure 6.3 Access Sizes and Data Alignment Control (8-Bit Access Space)
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Section 6 Bus Controller
16-Bit Access Space Figure 6.4 illustrates data alignment control for the 16-bit access space. With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be accessed at one time is one byte or one word, and a longword access is executed as two word accesses. In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd address.
Lower data bus Upper data bus D15 D8 D7 D0 Byte size Byte size Word size Longword size 1st bus cycle 2nd bus cycle • Even address • Odd address
Figure 6.4 Access Sizes and Data Alignment Control (16-Bit Access Space)
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Section 6 Bus Controller
6.4.3
Valid Strobes
Table 6.5 shows the data buses used and valid strobes for the access spaces. In a read, the RD signal is valid without discrimination between the upper and lower halves of the data bus. In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half. Table 6.5
Area 8-bit access space
Data Buses Used and Valid Strobes
Access Read/ Size Write Byte Read Write Read Write Word Read Write Address — — Even Odd Even Odd — — HWR LWR RD Valid Strobe RD HWR RD Valid Invalid Valid Undefined Valid Upper Data Bus (D15 to D8) Valid Lower Data Bus (D7 to D0) Port, etc. Port, etc. Invalid Valid Undefined Valid Valid Valid
16-bit access Byte space
HWR, LWR Valid
Legend: Undefined: Undefined data is output. Invalid: Input state; input value is ignored. Port, etc.: Pins are used as port or on-chip supporting module input/output pins, and not as data bus pins.
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Section 6 Bus Controller
6.4.4
Basic Timing
8-Bit 2-State Access Space Figure 6.5 shows the bus timing for an 8-bit 2-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. Wait states cannot be inserted.
Bus cycle T1 φ T2
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR Write D15 to D8 Valid
Figure 6.5 Bus Timing for 8-Bit 2-State Access Space
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Section 6 Bus Controller
8-Bit 3-State Access Space Figure 6.6 shows the bus timing for an 8-bit 3-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. Wait states can be inserted.
Bus cycle T1 φ T2 T3
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR Write D15 to D8 Valid
Figure 6.6 Bus Timing for 8-Bit 3-State Access Space
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Section 6 Bus Controller
16-Bit, 2-State Access Space Figures 6.7 to 6.9 show the bus timing for 16-bit, 2-state access space. When 16-bit access space is accessed, the upper data bus (D15 to D8) is used for even addresses and the lower data bus (D7 to D0) for odd addresses. Wait states cannot be inserted.
Bus cycle T1 φ T2
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR Write D15 to D8
High
Valid
D7 to D0
Undefined
Figure 6.7 16-Bit, 2-State Access Space Bus Timing (1) (Even Address Byte Access)
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Section 6 Bus Controller
Bus cycle T1 φ T2
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
HIgh
LWR Write D15 to D8 Undefined
D7 to D0
Valid
Figure 6.8 16-Bit, 2-State Access Space Bus Timing (2) (Odd Address Byte Access)
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Section 6 Bus Controller
Bus cycle T1 φ T2
Address bus
AS/IOS (IOSE = 1)
AS/IOS (IOSE = 0)
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR Write D15 to D8 Valid
D7 to D0
Valid
Figure 6.9 16-Bit, 2-State Access Space Bus Timing (3) (Word Access)
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Section 6 Bus Controller
16-Bit, 3-State Access Space Figures 6.10 to 6.12 show the bus timing for 16-bit, 3-state access space. When 16-bit access space is accessed, the upper data bus (D15 to D8) is used for even addresses and the lower data bus (D7 to D0) for odd addresses. Wait states can be inserted.
Bus cycle T1 φ T2 T3
Address bus
AS/IOS (IOSE = 1) AS/IOS (IOSE = 0) RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR LWR Write D15 to D8 Valid High
D7 to D0
Undefined
Figure 6.10 16-Bit, 3-State Access Space Bus Timing (1) (Even Address Byte Access)
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Section 6 Bus Controller
Bus cycle T1 φ T2 T3
Address bus
AS/IOS (IOSE = 1) AS/IOS (IOSE = 0) RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR LWR Write D15 to D8
High
Undefined
D7 to D0
Valid
Figure 6.11 16-Bit, 3-State Access Space Bus Timing (2) (Odd Address Byte Access)
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Section 6 Bus Controller
Bus cycle T1 φ T2 T3
Address bus
AS/IOS (IOSE = 1) AS/IOS (IOSE = 0) RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR LWR Write D15 to D8 Valid
D7 to D0
Valid
Figure 6.12 16-Bit, 3-State Access Space Bus Timing (3) (Word Access)
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Section 6 Bus Controller
6.4.5
Wait Control
When accessing external space, the MCU can extend the bus cycle by inserting one or more wait states (TW). There are three ways of inserting wait states: program wait insertion, pin wait insertion using the WAIT pin, and a combination of the two. Program Wait Mode: In program wait mode, the number of TW states specified by bits WC1 and WC0 are always inserted between the T2 and T3 states when external space is accessed. Pin Wait Mode: In pin wait mode, the number of TW states specified by bits WC1 and WC0 are always inserted between the T2 and T3 states when external space is accessed. If the WAIT pin is low at the fall of φ in the last T2 or TW state, another TW state is inserted. If the WAIT pin is held low, TW states are inserted until it goes high. Pin wait mode is useful for inserting four or more wait states, or for changing the number of TW states for different external devices. Pin Auto-Wait Mode: In pin auto-wait mode, if the WAIT pin is low at the fall of φ in the T2 state, the number of TW states specified by bits WC1 and WC0 are inserted when external space is accessed. No additional TW states are inserted even if the WAIT pin remains low. Pin auto-wait mode can be used for an easy interface to low-speed memory, simply by routing the chip select signal to the WAIT pin.
Figure 6.13 shows an example of wait state insertion timing.
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Section 6 Bus Controller
By program wait T1 φ T2 Tw
By WAIT pin Tw Tw T3
WAIT
Address bus
AS/IOS (IOSE = 0)
RD Read Data bus Read data
HWR, LWR Write Data bus Write data
Note:
indicates the timing of WAIT pin sampling using the φ clock.
Figure 6.13 Example of Wait State Insertion Timing The settings after a reset are: 3-state access, insertion of 3 program wait states, and WAIT input disabled.
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Section 6 Bus Controller
6.5
6.5.1
Burst ROM Interface
Overview
With this LSI, external space area 0 can be designated as burst ROM space, and burst ROM interfacing can be performed. External space can be designated as burst ROM space by means of the BRSTRM bit in BCR. Consecutive burst accesses of a maximum of 4 words or 8 words can be performed for CPU instruction fetches only. One or two states can be selected for burst access. 6.5.2 Basic Timing
The number of states in the initial cycle (full access) of the burst ROM interface is in accordance with the setting of the AST bit. Also, when the AST bit is set to 1, wait state insertion is possible. One or two states can be selected for the burst cycle, according to the setting of the BRSTS1 bit in BCR. Wait states cannot be inserted. When the BRSTS0 bit in BCR is cleared to 0, burst access of up to 4 words is performed; when the BRSTS0 bit is set to 1, burst access of up to 8 words is performed. The basic access timing for burst ROM space is shown in figures 6.14 (a) and (b). The timing shown in figure 6.14 (a) is for the case where the AST and BRSTS1 bits are both set to 1, and that in figure 6.14 (b) is for the case where both these bits are cleared to 0.
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Section 6 Bus Controller
Full access T1 φ T2 T3 T1
Burst access T2 T1 T2
Address bus
Only lower address changed
AS/IOS (IOSE = 0)
RD
Data bus
Read data
Read data
Read data
Figure 6.14 (a) Example of Burst ROM Access Timing (when AST = BRSTS1 = 1)
Full access T1 φ T2 Burst access T1 T1
Address bus
Only lower address changed
AS/IOS (IOSE = 0)
RD
Data bus
Read data
Read data Read data
Figure 6.14 (b) Example of Burst ROM Access Timing (when AST = BRSTS1 = 0)
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Section 6 Bus Controller
6.5.3
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait Control. Wait states cannot be inserted in a burst cycle.
6.6
6.6.1
Idle Cycle
Operation
When this LSI chip accesses external space, it can insert a 1-state idle cycle (TI) between bus cycles when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, with a long output floating time, and high-speed memory, I/O interfaces, and so on. If an external write occurs after an external read while the ICIS0 bit in BCR is set to 1, an idle cycle is inserted at the start of the write cycle. This is enabled in advanced mode and normal mode. Figure 6.15 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
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Section 6 Bus Controller
Bus cycle A T1 φ Address bus T2 T3
Bus cycle B T1 T2 φ Address bus
Bus cycle A T1 T2 T3
Bus cycle B TI T1 T2
RD HWR, LWR Data bus
RD HWR, LWR Data bus Data collision
Long output floating time
(a) Idle cycle not inserted
(b) Idle cycle inserted
Figure 6.15 Example of Idle Cycle Operation 6.6.2 Pin States in Idle Cycle
Table 6.6 shows pin states in an idle cycle. Table 6.6
Pins A23 to A0, IOS D15 to D0 AS RD HWR, LWR
Pin States in Idle Cycle
Pin State Contents of next bus cycle High impedance High High High
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Section 6 Bus Controller
6.7
6.7.1
Bus Arbitration
Overview
This LSI have a bus arbiter that arbitrates bus master operations. There are two bus masters, the CPU and the DTC, which perform read/write operations when they have possession of the bus. Each bus master requests the bus by means of a bus request signal. The bus arbiter determines priorities at the prescribed timing, and permits use of the bus by means of a bus request acknowledge signal. The selected bus master then takes possession of the bus and begins its operation. 6.7.2 Operation
The bus arbiter detects the bus masters’ bus request signals, and if the bus is requested, sends a bus request acknowledge signal to the bus master making the request. If there are bus requests from both bus masters, the bus request acknowledge signal is sent to the one with the higher priority. When a bus master receives the bus request acknowledge signal, it takes possession of the bus until that signal is canceled. The order of priority of the bus masters is as follows: (High) DTC > CPU (Low)
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Section 6 Bus Controller
6.7.3
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus master that has acquired the bus and is currently operating, the bus is not necessarily transferred immediately. There are specific times at which each bus master can relinquish the bus. CPU The CPU is the lowest-priority bus master, and if a bus request is received from the DTC, the bus arbiter transfers the bus to the DTC. The timing for transfer of the bus is as follows: • The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in discrete operations, as in the case of a longword-size access, the bus is not transferred between the operations. See appendix A.5, Bus States during Instruction Execution, for timings at which the bus is not transferred. • If the CPU is in sleep mode, it transfers the bus immediately. DTC The DTC sends the bus arbiter a request for the bus when an activation request is generated. The DTC does not release the bus until it has completed a series of processing operations.
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Section 7 Data Transfer Controller (DTC)
Section 7 Data Transfer Controller (DTC)
Provided in the H8S/2148 Group; not provided in the H8S/2144 Group and H8S/2147N.
7.1
Overview
The H8S/2148 Group includes a data transfer controller (DTC). The DTC can be activated by an interrupt or software, to transfer data. 7.1.1 Features
• Transfer possible over any number of channels Transfer information is stored in memory One activation source can trigger a number of data transfers (chain transfer) • Wide range of transfer modes Normal, repeat, and block transfer modes available Incrementing, decrementing, and fixing of transfer source and destination addresses can be selected • Direct specification of 16-Mbyte address space possible 24-bit transfer source and destination addresses can be specified • Transfer can be set in byte or word units • A CPU interrupt can be requested for the interrupt that activated the DTC An interrupt request can be issued to the CPU after one data transfer ends An interrupt request can be issued to the CPU after all specified data transfers have ended • Activation by software is possible • Module stop mode can be set The initial setting enables DTC registers to be accessed. DTC operation is halted by setting module stop mode
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Section 7 Data Transfer Controller (DTC)
7.1.2
Block Diagram
Figure 7.1 shows a block diagram of the DTC. The DTC’s register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to the on-chip RAM (1 kbyte), enabling 32-bit/1-state reading and writing of the DTC register information. Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1.
Internal address bus Interrupt controller DTC On-chip RAM
CPU interrupt request Legend: MRA, MRB: DTC mode registers A and B CRA, CRB: DTC transfer count registers A and B SAR: DTC source address register DAR: DTC destination address register DTCERA to DTCERE: DTC enable registers A to E DTVECR: DTC vector register
DTC activation request
Figure 7.1 Block Diagram of DTC
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MRA MRB CRA CRB DAR SAR
Interrupt request
Internal data bus
Register information
Control logic
DTVECR
DTCERA to DTCERE
Section 7 Data Transfer Controller (DTC)
7.1.3
Register Configuration
Table 7.1 summarizes the DTC registers. Table 7.1
Name DTC mode register A DTC mode register B DTC source address register DTC destination address register DTC transfer count register A DTC transfer count register B DTC enable registers DTC vector register Module stop control register
DTC Registers
Abbreviation MRA MRB SAR DAR CRA CRB DTCER*
4 4 DTVECR*
R/W —* 2 —*
2 2 —* 2 —* 2 —*
Initial Value Undefined Undefined Undefined Undefined Undefined Undefined H'00 H'00 H'3F H'FF
1 Address* 3 —* 3 —* 3 —* 3 —* 3 —* 3 —*
—*
2
R/W R/W R/W R/W
H'FEEE to H'FEF2 H'FEF3 H'FF86 H'FF87
MSTPCRH MSTPCRL
Notes: 1. Lower 16 bits of the address. 2. Registers within the DTC cannot be read or written to directly. 3. Allocated to on-chip RAM addresses H'EC00 to H'EFFF as register information. They cannot be located in external memory space. When the DTC is used, do not clear the RAME bit in SYSCR to 0. 4. The H8S/2144 Group and H8S/2147N do not include an on-chip DTC, and therefore the DTCER and DTVECR register addresses should not be accessed by the CPU.
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Section 7 Data Transfer Controller (DTC)
7.2
7.2.1
Bit
Register Descriptions
DTC Mode Register A (MRA)
7 SM1 Undefined — 6 SM0 Undefined — 5 DM1 Undefined — 4 DM0 Undefined — 3 MD1 Undefined — 2 MD0 Undefined — 1 DTS Undefined — 0 Sz Undefined —
Initial value Read/Write
MRA is an 8-bit register that controls the DTC operating mode. Bits 7 and 6—Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is to be incremented, decremented, or left fixed after a data transfer.
Bit 7 SM1 0 1 Bit 6 SM0 — 0 1 Description SAR is fixed SAR is incremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) SAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1)
Bits 5 and 4—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether DAR is to be incremented, decremented, or left fixed after a data transfer.
Bit 5 DM1 0 1 Bit 4 DM0 — 0 1 Description DAR is fixed DAR is incremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) DAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1)
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Section 7 Data Transfer Controller (DTC)
Bits 3 and 2—DTC Mode (MD1, MD0): These bits specify the DTC transfer mode.
Bit 3 MD1 0 1 Bit 2 MD0 0 1 0 1 Description Normal mode Repeat mode Block transfer mode —
Bit 1—DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination side is set to be a repeat area or block area, in repeat mode or block transfer mode.
Bit 1 DTS 0 1 Description Destination side is repeat area or block area Source side is repeat area or block area
Bit 0—DTC Data Transfer Size (Sz): Specifies the size of data to be transferred.
Bit 0 Sz 0 1 Description Byte-size transfer Word-size transfer
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Section 7 Data Transfer Controller (DTC)
7.2.2
Bit
DTC Mode Register B (MRB)
7 CHNE Undefined — 6 DISEL Undefined — 5 — Undefined — 4 — Undefined — 3 — Undefined — 2 — Undefined — 1 — Undefined — 0 — Undefined —
Initial value Read/Write
MRB is an 8-bit register that controls the DTC operating mode. Bit 7—DTC Chain Transfer Enable (CHNE): Specifies chain transfer. In chain transfer, multiple data transfers can be performed consecutively in response to a single transfer request. With data transfer for which CHNE is set to 1, there is no determination of the end of the specified number of transfers, clearing of the interrupt source flag, or clearing of DTCER.
Bit 7 CHNE 0 1 Description End of DTC data transfer (activation waiting state is entered) DTC chain transfer (new register information is read, then data is transferred)
Bit 6—DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are disabled or enabled after a data transfer.
Bit 6 DISEL 0 1 Description After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 (the DTC clears the interrupt source flag of the activating interrupt to 0) After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the interrupt source flag of the activating interrupt to 0)
Bits 5 to 0—Reserved: In the H8S/2148 Group these bits have no effect on DTC operation, and should always be written with 0.
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Section 7 Data Transfer Controller (DTC)
7.2.3
Bit
DTC Source Address Register (SAR)
23 22 21 20 19 4 3 2 1 0
Initial value Read/write
Unde- Unde- Unde- Unde- Undefined fined fined fined fined —————
Unde- Unde- Unde- Unde- Undefined fined fined fined fined —————
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC. For word-size transfer, specify an even source address. 7.2.4
Bit Initial value Read/write
DTC Destination Address Register (DAR)
23 22 21 20 19 4 3 2 1 0
Unde- Unde- Unde- Unde- Undefined fined fined fined fined —————
Unde- Unde- Unde- Unde- Undefined fined fined fined fined —————
DAR is a 24-bit register that designates the destination address of data to be transferred by the DTC. For word-size transfer, specify an even destination address.
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Section 7 Data Transfer Controller (DTC)
7.2.5
Bit
DTC Transfer Count Register A (CRA)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value Read/Write
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined ———————————————— CRAH CRAL
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC. In normal mode, the entire CRA register functions as a 16-bit transfer counter (1 to 65,536). It is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000. In repeat mode or block transfer mode, CRA is divided into two parts: the upper 8 bits (CRAH) and the lower 8 bits (CRAL). CRAH holds the number of transfers while CRAL functions as an 8-bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is transferred, and the contents of CRAH are transferred when the count reaches H'00. This operation is repeated. 7.2.6
Bit Initial value Read/Write
DTC Transfer Count Register B (CRB)
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined ————————————————
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000.
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Section 7 Data Transfer Controller (DTC)
7.2.7
Bit
DTC Enable Registers (DTCER)
7 DTCE7 0 R/W 6 DTCE6 0 R/W 5 DTCE5 0 R/W 4 DTCE4 0 R/W 3 DTCE3 0 R/W 2 DTCE2 0 R/W 1 DTCE1 0 R/W 0 DTCE0 0 R/W
Initial value Read/Write
The DTC enable registers comprise five 8-bit readable/writable registers, DTCERA to DTCERE, with bits corresponding to the interrupt sources that can activate the DTC. These bits enable or disable DTC service for the corresponding interrupt sources. The DTC enable registers are initialized to H'00 by a reset and in hardware standby mode. Bit n—DTC Activation Enable (DTCEn)
Bit n DTCEn 0 Description DTC activation by interrupt is disabled [Clearing conditions] • • 1 When data transfer ends with the DISEL bit set to 1 When the specified number of transfers end (Initial value)
DTC activation by interrupt is enabled [Holding condition] When the DISEL bit is 0 and the specified number of transfers have not ended
Note: n = 7 to 0
A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence between interrupt sources and DTCE bits is shown in table 7.4, together with the vector number generated by the interrupt controller in each case. For DTCE bit setting, read/write operations must be performed using bit-manipulation instructions such as BSET and BCLR. For the initial setting only, however, when multiple activation sources are set at one time, it is possible to disable interrupts and write after executing a dummy read on the relevant register.
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Section 7 Data Transfer Controller (DTC)
7.2.8
Bit
DTC Vector Register (DTVECR)
7 0 R/(W)* 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 Initial value Read/Write
Note: * A value of 1 can always be written to the SWDTE bit, but 0 can only be written after 1 is read.
DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by software, and sets a vector number for the software activation interrupt. DTVECR is initialized to H'00 by a reset and in hardware standby mode. Bit 7—DTC Software Activation Enable (SWDTE): Specifies enabling or disabling of DTC software activation. To clear the SWDTE bit by software, read SWDTE when set to 1, then write 0 in the bit.
Bit 7 SWDTE 0 Description DTC software activation is disabled [Clearing condition] When the DISEL bit is 0 and the specified number of transfers have not ended 1 DTC software activation is enabled [Holding conditions] • • • When data transfer ends with the DISEL bit set to 1 When the specified number of transfers end During software-activated data transfer (Initial value)
Bits 6 to 0—DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits specify a vector number for DTC software activation. The vector address is H'0400 + (vector number) 4 states.
Figure 15.24 Example of Synchronous Transmission by DTC
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Section 16 I C Bus Interface [Option]
2
Section 16 I C Bus Interface [Option]
A two-channel I C bus interface is available as an option in the H8S/2148 Group and H8S/2147N. 2 The I C bus interface is not available for the H8S/2144 Group. Observe the following notes when using this option. 1. For mask-ROM versions, a W is added to the part number in products in which this optional function is used. Examples: HD6432147SWFA 2. The product number is identical for F-ZTAT versions. However, be sure to inform your Renesas sales representative if you will be using this option.
2
2
16.1
Overview
2
A two-channel I C bus interface is available for the H8S/2148 Group and H8S/2147N as an 2 2 option. The I C bus interface conforms to and provides a subset of the Philips I C bus (inter-IC 2 bus) interface functions. The register configuration that controls the I C bus differs partly from the Philips configuration, however. Each I C bus interface channel uses only one data line (SDA) and one clock line (SCL) to transfer data, saving board and connector space. 16.1.1 Features
2
• Selection of addressing format or non-addressing format I C bus format: addressing format with acknowledge bit, for master/slave operation
2
Serial format: non-addressing format without acknowledge bit, for master operation only • Conforms to Philips I C bus interface (I C bus format)
2 2
• Two ways of setting slave address (I C bus format)
2
• Start and stop conditions generated automatically in master mode (I C bus format)
2
• Selection of acknowledge output levels when receiving (I C bus format)
2
• Automatic loading of acknowledge bit when transmitting (I C bus format)
2
• Wait function in master mode (I C bus format)
2
A wait can be inserted by driving the SCL pin low after data transfer, excluding acknowledgement. The wait can be cleared by clearing the interrupt flag.
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Section 16 I C Bus Interface [Option]
2
• Wait function in slave mode (I C bus format)
2
A wait request can be generated by driving the SCL pin low after data transfer, excluding acknowledgement. The wait request is cleared when the next transfer becomes possible. • Three interrupt sources Data transfer end (including transmission mode transition with I C bus format and address reception after loss of master arbitration)
2
Address match: when any slave address matches or the general call address is received in 2 slave receive mode (I C bus format) Stop condition detection • Selection of 16 internal clocks (in master mode) • Direct bus drive (with SCL and SDA pins) Two pins—P52/SCL0 and P97/SDA0—(normally NMOS push-pull outputs) function as NMOS open-drain outputs when the bus drive function is selected. Two pins—P86/SCL1 and P42/SDA1—(normally CMOS pins) function as NMOS-only outputs when the bus drive function is selected. • Automatic switching from formatless mode to I C bus format (channel 0 only)
2
Formatless operation (no start/stop conditions, non-addressing mode) in slave mode Operation using a common data pin (SDA) and independent clock pins (VSYNCI, SCL) Automatic switching from formatless mode to I C bus format on the fall of the SCL pin
2
16.1.2
Block Diagram
2
Figure 16.1 shows a block diagram of the I C bus interface. Figure 16.2 shows an example of I/O pin connections to external circuits. Channel 0 I/O pins and channel 1 I/O pins differ in structure, and have different specifications for permissible applied voltages. For details, see section 26, Electrical Characteristics.
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Section 16 I C Bus Interface [Option]
2
Formatless dedicated clock (channel 0 only) φ SCL Noise canceler Bus state decision circuit Arbitration decision circuit SDA Output data control circuit PS ICCR Clock control ICMR
ICSR
ICDRT
ICDRS
ICDRR Noise canceler Address comparator
SAR, SARX
Legend: ICCR: I2C bus control register ICMR: I2C bus mode register ICSR: I2C bus status register ICDR: I2C bus data register SAR: Slave address register SARX: Second slave address register X PS: Prescaler
2
Interrupt generator
Interrupt request
Figure 16.1 Block Diagram of I C Bus Interface
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Internal data bus
Section 16 I C Bus Interface [Option]
2
Vcc
VCC
SCL SCL in SCL out SDA
SCL
SDA
SDA in SDA out (Master)
SCL SDA
SCL in SCL out
SCL in SCL out
H8S/2148 Group and H8S/2147N chip
SDA in SDA out (Slave 1)
2
SDA in SDA out (Slave 2)
Figure 16.2 I C Bus Interface Connections (Example: H8S/2148 Group and H8S/2147N Chip as Master) 16.1.3 Input/Output Pins
2
Table 16.1 summarizes the input/output pins used by the I C bus interface. Table 16.1 I C Bus Interface Pins
Channel 0 Name Serial clock Serial data Formatless serial clock 1 Note: * Serial clock Serial data Abbreviation* SCL0 SDA0 VSYNCI SCL1 SDA1 I/O I/O I/O Input I/O I/O Function IIC0 serial clock input/output IIC0 serial data input/output IIC0 formatless serial clock input IIC1 serial clock input/output IIC1 serial data input/output
2
In the text, the channel subscript is omitted, and only SCL and SDA are used.
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SCL SDA
Section 16 I C Bus Interface [Option]
2
16.1.4
Register Configuration
2
Table 16.2 summarizes the registers of the I C bus interface. Table 16.2 Register Configuration
Channel 0 Name I C bus control register I C bus status register I C bus data register I C bus mode register Slave address register Second slave address register 1 I C bus control register I C bus status register I C bus data register I C bus mode register Slave address register Second slave address register Common Serial/timer control register DDC switch register Module stop control register
2 2 2 2 2 2 2 2
Abbreviation ICCR0 ICSR0 ICDR0 ICMR0 SAR0 SARX0 ICCR1 ICSR1 ICDR1 ICMR1 SAR1 SARX1 STCR DDCSWR MSTPCRH MSTPCRL
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value H'01 H'00 — H'00 H'00 H'01 H'01 H'00 — H'00 H'00 H'01 H'00 H'0F H'3F H'FF
Address* H'FFD8 H'FFD9
2 H'FFDE* 2 H'FFDF*
1
H'FFDF* 2 H'FFDE*
2
H'FF88 H'FF89
2 H'FF8E* 2 H'FF8F*
H'FF8F* 2 H'FF8E*
2
H'FFC3 H'FEE6 H'FF86 H'FF87
Notes: 1. Lower 16 bits of the address. 2 2. The register that can be written or read depends on the ICE bit in the I C bus control 2 register. The slave address register can be accessed when ICE = 0, and the I C bus mode register can be accessed when ICE = 1. 2 The I C bus interface registers are assigned to the same addresses as other registers. Register selection is performed by means of the IICE bit in the serial/timer control register (STCR).
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Section 16 I C Bus Interface [Option]
2
16.2
16.2.1
Bit
Register Descriptions
I C Bus Data Register (ICDR)
7 ICDR7 — R/W 6 ICDR6 — R/W 5 ICDR5 — R/W 4 ICDR4 — R/W 3 ICDR3 — R/W 2 ICDR2 — R/W 1 ICDR1 — R/W 0 ICDR0 — R/W
2
Initial value Read/Write
• ICDRR
Bit Initial value Read/Write 7 — R 6 — R 5 — R 4 — R 3 — R 2 — R 1 — R 0 — R
ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
• ICDRS
Bit Initial value Read/Write 7 — — 6 — — 5 — — 4 — — 3 — — 2 — — 1 — — 0 — —
ICDRS7 ICDRS6 ICDRR5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0
• ICDRT
Bit Initial value Read/Write 7 — W 6 — W 5 — W 4 — W 3 — W 2 — W 1 — W 0 — W
ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
• TDRE, RDRF (internal flags)
Bit Initial value Read/Write — TDRE 0 — — RDRF 0 —
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Section 16 I C Bus Interface [Option]
2
ICDR is an 8-bit readable/writable register that is used as a transmit data register when transmitting and a receive data register when receiving. ICDR is divided internally into a shift register (ICDRS), receive buffer (ICDRR), and transmit buffer (ICDRT). ICDRS cannot be read or written by the CPU, ICDRR is read-only, and ICDRT is write-only. Data transfers among the three registers are performed automatically in coordination with changes in the bus state, and affect the status of internal flags such as TDRE and RDRF. If IIC is in transmit mode and the next data is in ICDRT (the TDRE flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred automatically from ICDRT to ICDRS. If IIC is in receive mode and no previous data remains in ICDRR (the RDRF flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred automatically from ICDRS to ICDRR. If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and receive data are stored differently. Transmit data should be written justified toward the MSB side when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1. ICDR is assigned to the same address as SARX, and can be written and read only when the ICE bit is set to 1 in ICCR. The value of ICDR is undefined after a reset. The TDRE and RDRF flags are set and cleared under the conditions shown below. Setting the TDRE and RDRF flags affects the status of the interrupt flags.
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Section 16 I C Bus Interface [Option] TDRE 0 Description The next transmit data is in ICDR (ICDRT), or transmission cannot be started [Clearing conditions] • • • • When transmit data is written in ICDR (ICDRT) in transmit mode (TRS = 1) When a stop condition is detected in the bus line state after a stop condition is 2 issued with the I C bus format or serial format selected When a stop condition is detected with the I C bus format selected In receive mode (TRS = 0) (A 0 write to TRS during transfer is valid after reception of a frame containing an acknowledge bit) 1 The next transmit data can be written in ICDR (ICDRT) [Setting conditions] • In transmit mode (TRS = 1), when a start condition is detected in the bus line state 2 after a start condition is issued in master mode with the I C bus format or serial format selected At the first transmit mode setting (TRS = 1) (first transmit mode setting only) after 2 the mode is switched from I C bus mode to formatless mode When data is transferred from ICDRT to ICDRS (Data transfer from ICDRT to ICDRS when TRS = 1 and TDRE = 0, and ICDRS is empty) • When detecting a start condition and then switching from slave receive mode (TRS = 0) state to transmit mode (TRS = 1) (first transmit mode switching only).
2
2
(Initial value)
• •
RDRF 0
Description The data in ICDR (ICDRR) is invalid [Clearing condition] When ICDR (ICDRR) receive data is read in receive mode (Initial value)
1
The ICDR (ICDRR) receive data can be read [Setting condition] When data is transferred from ICDRS to ICDRR (Data transfer from ICDRS to ICDRR in case of normal termination with TRS = 0 and RDRF = 0)
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Section 16 I C Bus Interface [Option]
2
16.2.2
Bit
Slave Address Register (SAR)
7 SVA6 0 R/W 6 SVA5 0 R/W 5 SVA4 0 R/W 4 SVA3 0 R/W 3 SVA2 0 R/W 2 SVA1 0 R/W 1 SVA0 0 R/W 0 FS 0 R/W
Initial value Read/Write
SAR is an 8-bit readable/writable register that stores the slave address and selects the communication format. When the chip is in slave mode (and the addressing format is selected), if the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device specified by the master device. SAR is assigned to the same address as ICMR, and can be written and read only when the ICE bit is cleared to 0 in ICCR. SAR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 1—Slave Address (SVA6 to SVA0): Set a unique address in bits SVA6 to SVA0, 2 differing from the addresses of other slave devices connected to the I C bus. Bit 0—Format Select (FS): Used together with the FSX bit in SARX and the SW bit in DDCSWR to select the communication format. • I C bus format: addressing format with acknowledge bit
2
• Synchronous serial format: non-addressing format without acknowledge bit, for master mode only • Formatless mode (channel 0 only): non-addressing format with or without acknowledge bit, slave mode only, start/stop conditions not detected The FS bit also specifies whether or not SAR slave address recognition is performed in slave mode.
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Section 16 I C Bus Interface [Option] DDCSWR Bit 6 SW 0 SAR Bit 0 FS 0 SARX Bit 0 FSX 0 1 Operating Mode I C bus format •
2 2
2
SAR and SARX slave addresses recognized (Initial value) SAR slave address recognized SARX slave address ignored SAR slave address ignored SARX slave address recognized SAR and SARX slave addresses ignored Acknowledge bit used
I C bus format • •
1
0
I C bus format • •
2
1 1 0 0 1 1 Note: * 0 1 0 1
Synchronous serial format • • Formatless mode (start/stop conditions not detected)
Formatless mode* (start/stop conditions not detected) • No acknowledge bit
2
Do not set this mode when automatic switching to the I C bus format is performed by means of the DDCSWR setting.
16.2.3
Bit
Second Slave Address Register (SARX)
7 SVAX6 0 R/W 6 SVAX5 0 R/W 5 SVAX4 0 R/W 4 SVAX3 0 R/W 3 SVAX2 0 R/W 2 SVAX1 0 R/W 1 SVAX0 0 R/W 0 FSX 1 R/W
Initial value Read/Write
SARX is an 8-bit readable/writable register that stores the second slave address and selects the communication format. When the chip is in slave mode (and the addressing format is selected), if the upper 7 bits of SARX match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device specified by the master device. SARX is assigned to the same address as ICDR, and can be written and read only when the ICE bit is cleared to 0 in ICCR. SARX is initialized to H'01 by a reset and in hardware standby mode.
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Section 16 I C Bus Interface [Option]
2
Bits 7 to 1—Second Slave Address (SVAX6 to SVAX0): Set a unique address in bits SVAX6 to 2 SVAX0, differing from the addresses of other slave devices connected to the I C bus. Bit 0—Format Select X (FSX): Used together with the FS bit in SAR and the SW bit in DDCSWR to select the communication format. • I C bus format: addressing format with acknowledge bit
2
• Synchronous serial format: non-addressing format without acknowledge bit, for master mode only • Formatless mode: non-addressing format with or without acknowledge bit, slave mode only, start/stop conditions not detected The FSX bit also specifies whether or not SARX slave address recognition is performed in slave mode. For details, see the description of the FS bit in SAR. 16.2.4
Bit Initial value Read/Write
I C Bus Mode Register (ICMR)
7 MLS 0 R/W 6 WAIT 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W 3 CKS0 0 R/W 2 BC2 0 R/W 1 BC1 0 R/W 0 BC0 0 R/W
2
ICMR is an 8-bit readable/writable register that selects whether the MSB or LSB is transferred first, performs master mode wait control, and selects the master mode transfer clock frequency and the transfer bit count. ICMR is assigned to the same address as SAR. ICMR can be written and read only when the ICE bit is set to 1 in ICCR. ICMR is initialized to H'00 by a reset and in hardware standby mode. Bit 7—MSB-First/LSB-First Select (MLS): Selects whether data is transferred MSB-first or LSB-first. If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and receive data are stored differently. Transmit data should be written justified toward the MSB side when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1. Do not set this bit to 1 when the I C bus format is used.
2
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Section 16 I C Bus Interface [Option] Bit 7 MLS 0 1 Description MSB-first LSB-first (Initial value)
2
Bit 6—Wait Insertion Bit (WAIT): Selects whether to insert a wait between the transfer of data 2 and the acknowledge bit, in master mode with the I C bus format. When WAIT is set to 1, after the fall of the clock for the final data bit, the IRIC flag is set to 1 in ICCR, and a wait state begins (with SCL at the low level). When the IRIC flag is cleared to 0 in ICCR, the wait ends and the acknowledge bit is transferred. If WAIT is cleared to 0, data and acknowledge bits are transferred consecutively with no wait inserted. The IRIC flag in ICCR is set to 1 on completion of the acknowledge bit transfer, regardless of the WAIT setting. The setting of this bit is invalid in slave mode.
Bit 6 WAIT 0 1 Description Data and acknowledge bits transferred consecutively Wait inserted between data and acknowledge bits (Initial value)
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Section 16 I C Bus Interface [Option]
2
Bits 5 to 3—Serial Clock Select (CKS2 to CKS0): These bits, together with the IICX1 (channel 1) or IICX0 (channel 0) bit in the STCR register, select the serial clock frequency in master mode. They should be set according to the required transfer rate.
STCR Bit 5 or 6 Bit 5 Bit 4 Bit 3 IICX 0 CKS2 CKS1 CKS0 Clock 0 0 1 1 0 1 1 0 0 1 1 0 1 Note: *
2
Transfer Rate φ= 5 MHz 179 kHz 125 kHz 104 kHz 78.1 kHz 62.5 kHz 50.0 kHz 44.6 kHz 39.1 kHz 89.3 kHz 62.5 kHz 52.1 kHz 39.1 kHz 31.3 kHz 25.0 kHz 22.3 kHz 19.5 kHz φ= 8 MHz 286 kHz 200 kHz 167 kHz 125 kHz 100 kHz 80.0 kHz 71.4 kHz 62.5 kHz 143 kHz 100 kHz 83.3 kHz 62.5 kHz 50.0 kHz 40.0 kHz 35.7 kHz 31.3 kHz φ= 10 MHz 357 kHz 250 kHz 208 kHz 156 kHz 125 kHz 100 kHz 89.3 kHz 78.1 kHz 179 kHz 125 kHz 104 kHz 78.1 kHz 62.5 kHz 50.0 kHz 44.6 kHz 39.1 kHz φ= 16 MHz 571 kHz* 400 kHz 333 kHz 250 kHz 200 kHz 160 kHz 143 kHz 125 kHz 286 kHz 200 kHz 167 kHz 125 kHz 100 kHz 80.0 kHz 71.4 kHz 62.5 kHz φ= 20 MHz 714 kHz* 500 kHz* 417 kHz* 313 kHz 250 kHz 200 kHz 179 kHz 156 kHz 357 kHz 250 kHz 208 kHz 156 kHz 125 kHz 100 kHz 89.3 kHz 78.1 kHz
0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
φ/28 φ/40 φ/48 φ/64 φ/80 φ/100 φ/112 φ/128 φ/56 φ/80 φ/96 φ/128 φ/160 φ/200 φ/224 φ/256
Outside the I C bus interface specification range (normal mode: max. 100 kHz; highspeed mode: max. 400 kHz).
Bits 2 to 0—Bit Counter (BC2 to BC0): Bits BC2 to BC0 specify the number of bits to be 2 transferred next. With the I C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the data is transferred with one addition acknowledge bit. Bit BC2 to BC0 settings should be made during an interval between transfer frames. If bits BC2 to BC0 are set to a value other than 000, the setting should be made while the SCL line is low. The bit counter is initialized to 000 by a reset and when a start condition is detected. The value returns to 000 at the end of a data transfer, including the acknowledge bit.
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Section 16 I C Bus Interface [Option] Bit 2 BC2 0 Bit 1 BC1 0 1 1 0 1 Bit 0 BC0 0 1 0 1 0 1 0 1 Bits/Frame Synchronous Serial Format 8 1 2 3 4 5 6 7 I C Bus Format 9 2 3 4 5 6 7 8 (Initial value)
2
2
16.2.5
Bit
I C Bus Control Register (ICCR)
7 ICE 0 R/W 6 IEIC 0 R/W 5 MST 0 R/W 4 TRS 0 R/W 3 ACKE 0 R/W 2 BBSY 0 R/W 1 IRIC 0 R/(W)* 0 SCP 1 W
2
Initial value Read/Write
Note: * Only 0 can be written, to clear the flag.
ICCR is an 8-bit readable/writable register that enables or disables the I C bus interface, enables or disables interrupts, selects master or slave mode and transmission or reception, enables or disables 2 acknowledgement, confirms the I C bus interface bus status, issues start/stop conditions, and performs interrupt flag confirmation. ICCR is initialized to H'01 by a reset and in hardware standby mode. Bit 7—I C Bus Interface Enable (ICE): Selects whether or not the I C bus interface is to be used. When ICE is set to 1, port pins function as SCL and SDA input/output pins and transfer 2 operations are enabled. When ICE is cleared to 0, the I C bus interface module is halted and its internal states are cleared. The SAR and SARX registers can be accessed when ICE is 0. The ICMR and ICDR registers can be accessed when ICE is 1.
2 2
2
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Section 16 I C Bus Interface [Option] Bit 7 ICE 0 Description I C bus interface module disabled, with SCL and SDA signal pins set to port function (Initial value) I C bus interface module internal states initialized SAR and SARX can be accessed 1 I C bus interface module enabled for transfer operations (pins SCL and SCA are driving the bus) ICMR and ICDR can be accessed
2 2
2 2 2
2
Bit 6—I C Bus Interface Interrupt Enable (IEIC): Enables or disables interrupts from the I C bus interface to the CPU.
Bit 6 IEIC 0 1 Description Interrupts disabled Interrupts enabled (Initial value)
Bit 5—Master/Slave Select (MST) Bit 4—Transmit/Receive Select (TRS) MST selects whether the I C bus interface operates in master mode or slave mode. TRS selects whether the I C bus interface operates in transmit mode or receive mode. In master mode with the I C bus format, when arbitration is lost, MST and TRS are both reset by hardware, causing a transition to slave receive mode. In slave receive mode with the addressing format (FS = 0 or FSX = 0), hardware automatically selects transmit or receive mode according to the R/W bit in the first frame after a start condition. Modification of the TRS bit during transfer is deferred until transfer of the frame containing the acknowledge bit is completed, and the changeover is made after completion of the transfer. MST and TRS select the operating mode as follows.
2 2 2
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Section 16 I C Bus Interface [Option] Bit 5 MST 0 1 Bit 4 TRS 0 1 0 1 Operating Mode Slave receive mode Slave transmit mode Master receive mode Master transmit mode (Initial value)
2
Bit 5 MST 0 Description Slave mode [Clearing conditions] 1. When 0 is written by software 2. When bus arbitration is lost after transmission is started in I C bus format master mode 1 Master mode [Setting conditions] 1. When 1 is written by software (in cases other than clearing condition 2) 2. When 1 is written in MST after reading MST = 0 (in case of clearing condition 2) Bit 4 TRS 0 Description Receive mode [Clearing conditions] 1. When 0 is written by software (in cases other than setting condition 3) 2. When 0 is written in TRS after reading TRS = 1 (in case of clearing condition 3) 3. When bus arbitration is lost after transmission is started in I C bus format master mode 4. When the SW bit in DDCSWR changes from 1 to 0 1 Transmit mode [Setting conditions] 1. When 1 is written by software (in cases other than clearing conditions 3 and 4) 2. When 1 is written in TRS after reading TRS = 0 (in case of clearing conditions 3 and 4) 3. When a 1 is received as the R/W bit of the first frame in I C bus format slave mode
2 2 2
(Initial value)
(Initial value)
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Section 16 I C Bus Interface [Option]
2
Bit 3—Acknowledge Bit Judgement Selection (ACKE): Specifies whether the value of the 2 acknowledge bit returned from the receiving device when using the I C bus format is to be ignored and continuous transfer is performed, or transfer is to be aborted and error handling, etc., performed if the acknowledge bit is 1. When the ACKE bit is 0, the value of the received acknowledge bit is not indicated by the ACKB bit, which is always 0. In the H8S/2148 Group and H8S/2147N, the DTC can be used to perform continuous transfer. The DTC is activated when the IRTR interrupt flag is set to 1 (IRTR is one of two interrupt flags, the other being IRIC). When the ACKE bit is 0, the TDRE, IRIC, and IRTR flags are set on completion of data transmission, regardless of the value of the acknowledge bit. When the ACKE bit is 1, the TDRE, IRIC, and IRTR flags are set on completion of data transmission when the acknowledge bit is 0, and the IRIC flag alone is set on completion of data transmission when the acknowledge bit is 1. When the DTC is activated, the TDRE, IRIC, and IRTR flags are cleared to 0 after the specified number of data transfers have been executed. Consequently, interrupts are not generated during continuous data transfer, but if data transmission is completed with a 1 acknowledge bit when the ACKE bit is set to 1, the DTC is not activated and an interrupt is generated, if enabled. Depending on the receiving device, the acknowledge bit may be significant, in indicating completion of processing of the received data, for instance, or may be fixed at 1 and have no significance.
Bit 3 ACKE 0 1 Description The value of the acknowledge bit is ignored, and continuous transfer is performed If the acknowledge bit is 1, continuous transfer is interrupted
2
(Initial value)
Bit 2—Bus Busy (BBSY): The BBSY flag can be read to check whether the I C bus (SCL, SDA) is busy or free. In master mode, this bit is also used to issue start and stop conditions. A high-to-low transition of SDA while SCL is high is recognized as a start condition, setting BBSY to 1. A low-to-high transition of SDA while SCL is high is recognized as a stop condition, clearing BBSY to 0. To issue a start condition, use a MOV instruction to write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, use a MOV instruction to 2 write 0 in BBSY and 0 in SCP. It is not possible to write to BBSY in slave mode; the I C bus interface must be set to master transmit mode before issuing a start condition. MST and TRS should both be set to 1 before writing 1 in BBSY and 0 in SCP.
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Section 16 I C Bus Interface [Option] Bit 2 BBSY 0 Description Bus is free [Clearing condition] When a stop condition is detected 1 Bus is busy [Setting condition] When a start condition is detected
2 2
2
(Initial value)
Bit 1—I C Bus Interface Interrupt Request Flag (IRIC): Indicates that the I C bus interface has issued an interrupt request to the CPU. IRIC is set to 1 at the end of a data transfer, when a slave address or general call address is detected in slave receive mode, when bus arbitration is lost in master transmit mode, and when a stop condition is detected. IRIC is set at different times depending on the FS bit in SAR and the WAIT bit in ICMR. See section 16.3.6, IRIC Setting Timing and SCL Control. The conditions under which IRIC is set also differ depending on the setting of the ACKE bit in ICCR. IRIC is cleared by reading IRIC after it has been set to 1, then writing 0 in IRIC. When the DTC is used, IRIC is cleared automatically and transfer can be performed continuously without CPU intervention.
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Section 16 I C Bus Interface [Option]
Bit 1 IRIC 0 Description Waiting for transfer, or transfer in progress [Clearing conditions] 1. When 0 is written in IRIC after reading IRIC = 1 2. When ICDR is written or read by the DTC (When the TDRE or RDRF flag is cleared to 0) (This is not always a clearing condition; see the description of DTC operation for details) 1 Interrupt requested [Setting conditions] • I2C bus format master mode 1. When a start condition is detected in the bus line state after a start condition is issued (when the TDRE flag is set to 1 because of first frame transmission) 2. When a wait is inserted between the data and acknowledge bit when WAIT = 1 3. At the end of data transfer (at the rise of the 9th transmit/receive clock pulse when no wait is inserted, (WAIT=0) and, when a wait is inserted (WAIT=1), at the fall of the 8th transmit/receive clock pulse) 4. When a slave address is received after bus arbitration is lost (when the AL flag is set to 1) 5. When 1 is received as the acknowledge bit when the ACKE bit is 1 (when the ACKB bit is set to 1) • I2C bus format slave mode 1. When the slave address (SVA, SVAX) matches (when the AAS and AASX flags are set to 1) and at the end of data transfer up to the subsequent retransmission start condition or stop condition detection (when the TDRE or RDRF flag is set to 1) 2. When the general call address is detected (when FS = 0 and the ADZ flag is set to 1) and at the end of data transfer up to the subsequent retransmission start condition or stop condition detection (when the TDRE or RDRF flag is set to 1) 3. When 1 is received as the acknowledge bit when the ACKE bit is 1 (when the ACKB bit is set to 1) 4. When a stop condition is detected (when the STOP or ESTP flag is set to 1) • Synchronous serial format, and formatless mode 1. At the end of data transfer (when the TDRE or RDRF flag is set to 1) 2. When a start condition is detected with serial format selected 3. When the SW bit is set to 1 in DDCSWR Except the above, when the conditions to set the TDRE or RDRF internal flag to 1 is generated (Initial value)
2
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When, with the I C bus format selected, IRIC is set to 1 and an interrupt is generated, other flags must be checked in order to identify the source that set IRIC to 1. Although each source has a corresponding flag, caution is needed at the end of a transfer. When the TDRE or RDRF internal flag is set, the readable IRTR flag may or may not be set. The IRTR flag (the DTC start request flag) is not set at the end of a data transfer up to detection of a retransmission start condition or stop condition after a slave address (SVA) or general call address 2 match in I C bus format slave mode. Even when the IRIC flag and IRTR flag are set, the TDRE or RDRF internal flag may not be set. The IRIC and IRTR flags are not cleared at the end of the specified number of transfers in continuous transfer using the DTC. The TDRE or RDRF flag is cleared, however, since the specified number of ICDR reads or writes have been completed. Table 16.3 shows the relationship between the flags and the transfer states. Table 16.3 Flags and Transfer States
MST TRS 1/0 1 1 1 1 0 0 0 0 0 1/0 1 1 1/0 1/0 0 0 0 0 1/0 BBSY ESTP STOP IRTR 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 AASX AL 0 0 0 0 0 1/0 0 0 1 0 0 0 0 0 0 1 0 0 0 0 AAS 0 0 0 0 0 1/0 1 1 0 0 ADZ 0 0 0 0 0 1/0 0 1 0 0 ACKB State 0 0 0 0/1 0/1 0 0 0 0 0/1 Idle state (flag clearing required) Start condition issuance Start condition established Master mode wait Master mode transmit/ receive end Arbitration lost SAR match by first frame in slave mode General call address match SARX match Slave mode transmit/receive end (except after SARX match) Slave mode transmit/receive end (after SARX match) Stop condition detected
2
0 0 0
1/0 1 1/0
1 1 0
0 0 1/0
0 0 1/0
1 0 0
1 1 0
0 0 0
0 0 0
0 0 0
0 1 0/1
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Bit 0—Start Condition/Stop Condition Prohibit (SCP): Controls the issuing of start and stop conditions in master mode. To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, write 0 in BBSY and 0 in SCP. This bit is always read as 1. If 1 is written, the data is not stored.
Bit 0 SCP 0 1 Description Writing 0 issues a start or stop condition, in combination with the BBSY flag Reading always returns a value of 1 Writing is ignored (Initial value)
16.2.6
Bit
I C Bus Status Register (ICSR)
7 ESTP 0 R/(W)* 6 STOP 0 R/(W)* 5 IRTR 0 R/(W)* 4 AASX 0 R/(W)* 3 AL 0 R/(W)* 2 AAS 0 R/(W)* 1 ADZ 0 R/(W)* 0 ACKB 0 R/W
2
Initial value Read/Write
Note: * Only 0 can be written, to clear the flags.
ICSR is an 8-bit readable/writable register that performs flag confirmation and acknowledge confirmation and control. ICSR is initialized to H'00 by a reset and in hardware standby mode.
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Bit 7—Error Stop Condition Detection Flag (ESTP): Indicates that a stop condition has been 2 detected during frame transfer in I C bus format slave mode.
Bit 7 ESTP 0 Description No error stop condition [Clearing conditions] 1. When 0 is written in ESTP after reading ESTP = 1 2. When the IRIC flag is cleared to 0 1 • In I C bus format slave mode Error stop condition detected [Setting condition] When a stop condition is detected during frame transfer • In other modes No meaning
2
(Initial value)
Bit 6—Normal Stop Condition Detection Flag (STOP): Indicates that a stop condition has been 2 detected after completion of frame transfer in I C bus format slave mode.
Bit 6 STOP 0 Description No normal stop condition [Clearing conditions] 1. When 0 is written in STOP after reading STOP = 1 2. When the IRIC flag is cleared to 0 1 • In I C bus format slave mode Normal stop condition detected [Setting condition] When a stop condition is detected after completion of frame transfer • In other modes No meaning
2
(Initial value)
Bit 5—I C Bus Interface Continuous Transmission/Reception Interrupt Request Flag 2 (IRTR): Indicates that the I C bus interface has issued an interrupt request to the CPU, and the source is completion of reception/transmission of one frame in continuous transmission/reception for which DTC activation is possible. When the IRTR flag is set to 1, the IRIC flag is also set to 1 at the same time.
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Section 16 I C Bus Interface [Option]
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IRTR flag setting is performed when the TDRE or RDRF flag is set to 1. IRTR is cleared by reading IRTR after it has been set to 1, then writing 0 in IRTR. IRTR is also cleared automatically when the IRIC flag is cleared to 0.
Bit 5 IRTR 0 Description Waiting for transfer, or transfer in progress [Clearing conditions] 1. When 0 is written in IRTR after reading IRTR = 1 2. When the IRIC flag is cleared to 0 1 Continuous transfer state [Setting conditions] • • In I C bus interface slave mode When the TDRE or RDRF flag is set to 1 when AASX = 1 In other modes When the TDRE or RDRF flag is set to 1
2
(Initial value)
Bit 4—Second Slave Address Recognition Flag (AASX): In I C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVAX6 to SVAX0 in SARX. AASX is cleared by reading AASX after it has been set to 1, then writing 0 in AASX. AASX is also cleared automatically when a start condition is detected.
Bit 4 AASX 0 Description Second slave address not recognized [Clearing conditions] 1. When 0 is written in AASX after reading AASX = 1 2. When a start condition is detected 3. In master mode 1 Second slave address recognized [Setting condition] When the second slave address is detected in slave receive mode while FSX = 0 (Initial value)
2
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Bit 3—Arbitration Lost (AL): This flag indicates that arbitration was lost in master mode. The 2 I C bus interface monitors the bus. When two or more master devices attempt to seize the bus at 2 nearly the same time, if the I C bus interface detects data differing from the data it sent, it sets AL to 1 to indicate that the bus has been taken by another master. AL is cleared by reading AL after it has been set to 1, then writing 0 in AL. In addition, AL is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
Bit 3 AL 0 Description Bus arbitration won [Clearing conditions] 1. When ICDR data is written (transmit mode) or read (receive mode) 2. When 0 is written in AL after reading AL = 1 1 Arbitration lost [Setting conditions] 1. If the internal SDA and SDA pin disagree at the rise of SCL in master transmit mode 2. If the internal SCL line is high at the fall of SCL in master transmit mode
2
(Initial value)
Bit 2—Slave Address Recognition Flag (AAS): In I C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVA6 to SVA0 in SAR, or if the general call address (H'00) is detected. AAS is cleared by reading AAS after it has been set to 1, then writing 0 in AAS. In addition, AAS is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
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Section 16 I C Bus Interface [Option] Bit 2 AAS 0 Description Slave address or general call address not recognized [Clearing conditions] 1. When ICDR data is written (transmit mode) or read (receive mode) 2. When 0 is written in AAS after reading AAS = 1 3. In master mode 1 Slave address or general call address recognized [Setting condition] When the slave address or general call address is detected in slave receive mode while FS = 0
2
2
(Initial value)
Bit 1—General Call Address Recognition Flag (ADZ): In I C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition is the general call address (H'00). ADZ is cleared by reading ADZ after it has been set to 1, then writing 0 in ADZ. In addition, ADZ is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
Bit 1 ADZ 0 Description General call address not recognized [Clearing conditions] 1. When ICDR data is written (transmit mode) or read (receive mode) 2. When 0 is written in ADZ after reading ADZ = 1 3. In master mode 1 General call address recognized [Setting condition] When the general call address is detected in slave receive mode while FSX = 0 or FS = 0 (Initial value)
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Bit 0—Acknowledge Bit (ACKB): Stores acknowledge data. In transmit mode, after the receiving device receives data, it returns acknowledge data, and this data is loaded into ACKB. In receive mode, after data has been received, the acknowledge data set in this bit is sent to the transmitting device. When this bit is read, in transmission (when TRS = 1), the value loaded from the bus line (returned by the receiving device) is read. In reception (when TRS = 0), the value set by internal software is read. When this bit is written to, the acknowledge data transmitted at the receipt is rewritten regardless of the TRS value. The data loaded fom the receiving device is retained, therefore take care of using bit-manipulation instructions.
Bit 0 ACKB 0 Description Receive mode: 0 is output at acknowledge output timing (Initial value) Transmit mode: Indicates that the receiving device has acknowledged the data (signal is 0) 1 Receive mode: 1 is output at acknowledge output timing Transmit mode: Indicates that the receiving device has not acknowledged the data (signal is 1)
16.2.7
Bit
Serial/Timer Control Register (STCR)
7 IICS 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W 3 FLSHE 0 R/W 2 — 0 R/W
2
1 ICKS1 0 R/W
0 ICKS0 0 R/W
Initial value Read/Write
STCR is an 8-bit readable/writable register that controls register access, the I C interface operating mode (when the on-chip IIC option is included), and on-chip flash memory (F-ZTAT versions), 2 and selects the TCNT input clock source. For details of functions not related to the I C bus interface, see section 3.2.4, Serial Timer Control Register (STCR), and the descriptions of the relevant modules. If a module controlled by STCR is not used, do not write 1 to the corresponding bit. STCR is initialized to H'00 by a reset and in hardware standby mode.
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Bit 7—I C Extra Buffer Select (IICS): Designates bits 7 to 4 of port A as the same kind of 2 output buffer as SCL and SDA. This bit is used when implementing the I C interface by software only.
Bit 7 IICS 0 1 Description PA7 to PA4 are normal I/O pins PA7 to PA4 are I/O pins with bus driving capability
2
2
(Initial value)
Bits 6 and 5—I C Transfer Select 1 and 0 (IICX1 and 0): This bit, together with bits CKS2 to 2 CKS0 in ICMR, selects the transfer rate in master mode. For details, see section 16.2.4, I C Bus Mode Register (ICMR). Bit 4—I C Master Enable (IICE): Controls CPU access to the I C bus interface data and control registers (ICCR, ICSR, ICDR/SARX, ICMR/SAR).
Bit 4 IICE 0 1 Description CPU access to I C bus interface data and control registers is disabled CPU access to I C bus interface data and control registers is enabled
2 2
2
2
(Initial value)
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash memory control registers, the power-down mode control registers, and the supporting module control registers. See section 3.2.4, Serial Timer Control Register (STCR), for details. Bit 2—Reserved: Do not write 1 to this bit. Bits 1 and 0—Internal Clock Source Select 1 and 0 (ICKS1, ICSK0): These bits, together with bits CKS2 to CKS0 in TCR, select the clock input to the timer counters (TCNT). For details, see section 12.2.4, Timer Control Register (TCR).
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16.2.8
Bit
DDC Switch Register (DDCSWR)
7 SWE 0 R/W 6 SW 0 R/W 5 IE 0 R/W 4 IF 0 R/(W)*1 3 CLR3 1 W*2 2 CLR2 1 W*2 1 CLR1 1 W*2 0 CLR0 1 W*2
Initial value Read/Write
Notes: 1. Only 0 can be written, to clear the flag. 2. Always read as 1.
DDCSWR is an 8-bit readable/writable register that is used to initialize IIC and controls IIC internal latch clearance. DDCSWR is initialized to H'0F by a reset and in hardware standby mode. Bit 7—DDC Mode Switch Enable (SWE): Selects the function for automatically switching IIC 2 channel 0 from formatless mode to the I C bus format.
Bit 7 SWE 0 1 Description Automatic switching of IIC channel 0 from formatless mode to I C bus format is disabled (Initial value) Automatic switching of IIC channel 0 from formatless mode to I C bus format is enabled
2
2 2
Bit 6—DDC Mode Switch (SW): Selects either formatless mode or the I C bus format for IIC channel 0.
Bit 6 SW 0 Description IIC channel 0 is used with the I C bus format [Clearing conditions] 1. When 0 is written by software 2. When a falling edge is detected on the SCL pin when SWE = 1 1 IIC channel 0 is used in formatless mode [Setting condition] When 1 is written in SW after reading SW = 0
2
(Initial value)
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Bit 5—DDC Mode Switch Interrupt Enable Bit (IE): Enables or disables an interrupt request to the CPU when automatic format switching is executed for IIC channel 0.
Bit 5 IE 0 1 Description Interrupt when automatic format switching is executed is disabled Interrupt when automatic format switching is executed is enabled (Initial value)
Bit 4—DDC Mode Switch Interrupt Flag (IF): Flag that indicates an interrupt request to the CPU when automatic format switching is executed for IIC channel 0.
Bit 4 IF 0 Description No interrupt is requested when automatic format switching is executed [Clearing condition] When 0 is written in IF after reading IF = 1 1 An interrupt is requested when automatic format switching is executed [setting condition] When a falling edge is detected on the SCL pin when SWE = 1 (Initial value)
Bits 3 to 0—IIC Clear 3 to 0 (CLR3 to CLR0): These bits control initialization of the internal state of IIC0 and IIC1. These bits can only be written to; if read they will always return a value of 1. When a write operation is performed on these bits, a clear signal is generated for the internal latch circuit of the corresponding module(s), and the internal state of the IIC module(s) is initialized. The write data for these bits is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written to simultaneously using an MOV instruction. Do not use a bit-manipulation instruction such as BCLR. When clearing is required again, all the bits must be written to in accordance with the setting.
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Section 16 I C Bus Interface [Option] Bit 3 CLR3 0 Bit 2 CLR2 0 1 Bit 1 CLR1 — 0 1 1 — — Bit 0 CLR0 — 0 1 0 1 — Description Setting prohibited Setting prohibited IIC0 internal latch cleared IIC1 internal latch cleared IIC0 and IIC1 internal latches cleared Invalid setting
2
16.2.9
Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
2 1 0 7 6 5 4 3 2 1 0
Bit Initial value Read/Write
7
6
5
4
3
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers, and is used to perform module stop mode control. When the MSTP4 or MSTP3 bit is set to 1, operation of the corresponding IIC channel is halted at the end of the bus cycle, and a transition is made to module stop mode. For details, see section 25.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTPCRL Bit 4—Module Stop (MSTP4): Specifies IIC channel 0 module stop mode.
MSTPCRL Bit 4 MSTP4 0 1 Description IIC channel 0 module stop mode is cleared IIC channel 0 module stop mode is set (Initial value)
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MSTPCRL Bit 3—Module Stop (MSTP3): Specifies IIC channel 1 module stop mode.
MSTPCRL Bit 3 MSTP3 0 1 Description IIC channel 1 module stop mode is cleared IIC channel 1 module stop mode is set (Initial value)
16.3
16.3.1
2
Operation
I C Bus Data Format
2 2
The I C bus interface has serial and I C bus formats. The I C bus formats are addressing formats with an acknowledge bit. These are shown in figures 16.3 (a) and (b). The first frame following a start condition always consists of 8 bits. IIC channel 0 only is capable of formatless operation, as shown in figure 16.4. The serial format is a non-addressing format with no acknowledge bit. Although start and stop conditions must be issued, this format can be used as a synchronous serial format. This is shown in figure 16.5. Figure 16.6 shows the I C bus timing. The symbols used in figures 16.3 to 16.6 are explained in table 16.4.
2 2
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(a) I2C bus format (FS = 0 or FSX = 0) S 1 SLA 7 1 R/W 1 A 1 DATA n A 1 m A/A 1 P 1 Legend: n: transfer bit count (n = 1 to 8) m: transfer frame count (m ≥ 1)
(b) I2C bus format (start condition retransmission, FS = 0 or FSX = 0) S 1 SLA 7 1 R/W 1 A 1 DATA n1 m1 A/A 1 S 1 SLA 7 1 R/W 1 A 1 DATA n2 m2 A/A 1 P 1
Legend: n1 and n2: transfer bit count (n1 and n2 = 1 to 8) m1 and m2: transfer frame count (m1 and m2 ≥ 1)
Figure 16.3 I C Bus Data Formats (I C Bus Formats)
IIC0 only, FS = 0 or FSX = 0 DATA 8 1 A 1 DATA n A 1 m A/A 1 Legend: n: transfer bit count (n = 1 to 8) m: transfer frame count (m ≥ 1)
2
2
Figure 16.4 Formatless
FS = 1 and FSX = 1
S 1
DATA 8 1
DATA n m
P 1 Legend: n: transfer bit count (n = 1 to 8) m: transfer frame count (m ≥ 1)
Figure 16.5 I C Bus Data Format (Serial Format)
2
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SDA
SCL S
1-7 SLA
8 R/W
9 A
1-7 DATA
2
8
9 A
1-7 DATA
8
9 A/A P
Figure 16.6 I C Bus Timing Table 16.4 I C Bus Data Format Symbols
Legend S SLA R/W A DATA P Start condition. The master device drives SDA from high to low while SCL is high Slave address, by which the master device selects a slave device Indicates the direction of data transfer: from the slave device to the master device when R/W is 1, or from the master device to the slave device when R/W is 0 Acknowledge. The receiving device (the slave in master transmit mode, or the master in master receive mode) drives SDA low to acknowledge a transfer Transferred data. The bit length is set by bits BC2 to BC0 in ICMR. The MSB-first or LSB-first format is selected by bit MLS in ICMR Stop condition. The master device drives SDA from low to high while SCL is high
2
16.3.2
2
Master Transmit Operation
In I C bus format master transmit mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. The transmission procedure and operations by which data is sequentially transmitted in synchronization with ICDR write operations, are described below. (1) Set the ICE bit in ICCR to l. Set bits MLS, WAIT, and CKS2 to CKS0 in ICMR, and bit IICX in STCR, according to the operation mode. (2) Read the BBSY flag to confirm that the bus is free. (3) Set the MST and TRS bits to 1 in ICCR to select master transmit mode. (4) Write 1 to BBSY and 0 to SCP. This switches SDA from high to low when SCL is high, and generates the start condition. (5) When the start condition is generated, the IRIC and IRTR flags are set to 1. If the IEIC bit in ICCR has been set to l, an interrupt request is sent to the CPU.
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(6) Write data to ICDR (slave address + R/W) With the I C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the first frame data following the start condition indicates the 7-bit slave address and transmit/receive direction. Then clear the IRIC flag to indicate the end of transfer. Writing to ICDR and clearing of the IRIC flag must be executed continuously, so that no interrupt is inserted. If a period of time that is equal to transfer one byte has elapsed by the time the IRlC flag is cleared, the end of transfer cannot be identified. The master device sequentially sends the transmit clock and the data written to ICDR with the timing shown in figure 16.7. The selected slave device (i.e., the slave device with the matching slave address) drives SDA low at the 9th transmit clock pulse and returns an acknowledge signal. (7) When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in synchronization with the internal clock until the next transmit data is written. (8) Read the ACKB bit to confirm that ACKB is 0. When the slave device has not returned an acknowledge signal and ACKB remains 1, execute the transmit end processing described in step (12) and perform transmit operation again. (9) Write the next data to be transmitted in ICDR. To indicate the end of data transfer, clear the IRIC flag to 0. As described in step (6) above, writing to ICDR and clearing of the IRIC flag must be executed continuously so that no interrupt is inserted. The next frame is transmitted in synchronization with the internal clock. (10) When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in synchronization with the internal clock until the next transmit data is written. (11) Read the ACKB bit of ICSR. Confirm that the slave device has returned an acknowledge signal and ACKB is 0. When more data is to be transmitted, return to step (9) to execute next transmit operation. If the slave device has not returned an acknowledge signal and ACKB is 1, execute the transmit end processing described in step (12). (12) Clear the IRIC flag to 0. Write BBSY and SCP of ICCR to 0. By doing so, SDA is changed from low to high while SCL is high and the transmit stop condition is generated.
2
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Start condition generation SCL (master output) SDA (master output) SDA (slave output) IRIC IRTR ICDR Note: Data write timing in ICDR ICDR Writing prohibited address + R/W [5] 1 bit 7 2 bit 6 3 bit 5 4 bit 4 5 bit 3 6 bit 2 7 bit 1 8 bit 0 R/W [7] A 9 1 bit 7 2 bit 6
Slave address
Data 1
Data 1
ICDR Writing enable
User processing [4] Write BBSY = 1 and SCP = 0 (start condition issuance)
[6] ICDR write
[6] IRIC clear
[9] ICDR write [9] IRIC clear
Figure 16.7 Example of Master Transmit Mode Operation Timing (MLS = WAIT = 0) 16.3.3 Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data, and returns an acknowledge signal. The slave device transmits data. The receive procedure and operations by which data is sequentially received in synchronization with ICDR read operations, are described below. (1) Clear the TRS bit of ICCR to 0 and switch from transmit mode to receive mode. Set the WAIT bit to 1 and clear the ACKB bit of ICSR to 0 (acknowledge data setting). (2) When ICDR is read (dummy data read), reception is started and the receive clock is output, and data is received, in synchronization with the internal clock. To indicate the wait, clear the IRIC flag to 0. Reading from ICDR and clearing of the IRIC f1ag must be executed continuously so that no interrupt is inserted. If a period of time that is equal to transfer one byte has elapsed by the time the IRIC flag is cleared, the end of transfer cannot be identified.
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(3) The IRIC flag is set to 1 at the fall of the 8th clock of a one-frame reception clock. At this point, if the IEIC bit of ICCR is set to 1, an interrupt request is generated to the CPU. SCL is automatically fixed low in synchronization with the internal clock until the IRIC flag is cleared. If the first frame is the final reception frame, execute the end processing as described in (l0). (4) Clear the IRIC flag to 0 to release from the wait state. The master device outputs the 9th receive clock pulse, sets SDA to low, and returns an acknowledge signal. (5) When one frame of data has been transmitted, the IRIC and IRTR flags are set to 1 at the rise of the 9th transmit clock pulse. The master device continues to output the receive clock for the next receive data. (6) Read the ICDR receive data. (7) Clear the IRIC flag to indicate the next wait. From clearing of the IRIC flag to completion of data transmission as described in steps (5), (6), and (7), must be performed within the time taken to transfer one byte, because releasing of the wait state as described in step (4) (or (9)). (8) The IRIC flag is set to 1 at the fall of the 8th one-frame reception clock pulse. SCL is automatically fixed low in synchronization with the internal clock until the IRIC flag is cleared. If this frame is the final reception frame, execute the end processing as described in (l0). (9) Clear the IRIC flag to 0 to release from the wait state. The master device outputs the 9th reception clock pulse, sets SDA to low, and returns an acknowledge signal. By repeating steps (5) to (9) above, more data can be received. (l0) Set the ACKB bit of ICSR to 1 and set the acknowledge data for the final reception. Set the TRS bit of ICCR to 1 to change receive mode to transmit mode. (11) Clear the IRIC flag to release from the wait state. (12) When one frame of data has been received, the IRIC flag is set to 1 at the rise of the 9th reception clock pulse. (13) Clear the WAIT bit of ICMR to 0 to cancel wait mode. Read the ICDR receive data and clear the IRIC flag to 0. Clear the IRIC flag only when WAIT = 0. (If the stop-condition generation command is executed after clearing the IRIC flag to 0 and then clearing the WAIT bit to 0, the SDA line is fixed low and the stop condition cannot be generated.) (14) Write 0 to BBSY and SCP. This changes SDA from low to high when SCL is high, and generates the stop condition.
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Master transmit mode
Master receive mode
SCL (master output) SDA (slave output)
9 A
1 Bit7
2 Bit6
3 Bit5
4 Bit4
5 Bit3
6 Bit2
7 Bit1
8 Bit0 [3] A
9
1 Bit7
2 Bit6
3 Bit5
4 Bit4
5 Bit3
Data 1 SDA (master output) IRIC IRTR ICDR
[5]
Data 2
Data 1
User processing
[2] IRIC clear [1] TRS cleared to 0 [2] ICDR read (dummy read) WAIT set to 1 ACKB cleared to 0
[4] IRIC clear
[6] ICDR read (Data 1)
[7] IRIC clear
Figure 16.8 (a) Example of Master Receive Mode Operation Timing (MLS = ACKB = 0, WAIT = 1)
SCL (master output) SDA (slave output) Data 2 SDA (master output) IRIC IRTR ICDR Data 1 Data 2 Data 3
8 Bit0 [8] A
9
1 Bit7
2 Bit6
3 Bit5
4 Bit4
5 Bit3
6 Bit2
7 Bit1
8 Bit0 [8] A
9
1 Bit7
2 Bit6 Data 4
[5]
Data 3
[5]
User processing
[9] IRIC clear
[6] ICDR read (Data 2)
[7] IRIC clear
[9] IRIC Clear
[6] ICDR read (Data 3)
[7] IRIC clear
Figure 16.8 (b) Example of Master Receive Mode Operation Timing (MLS = ACKB = 0, WAIT = 1)
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16.3.4
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. The reception procedure and operations in slave receive mode are described below. [1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR according to the operating mode. [2] When the start condition output by the master device is detected, the BBSY flag in ICCR is set to 1. [3] When the slave address matches in the first frame following the start condition, the device operates as the slave device specified by the master device. If the 8th data bit (R/W) is 0, the TRS bit in ICCR remains cleared to 0, and slave receive operation is performed. [4] At the 9th clock pulse of the receive frame, the slave device drives SDA low and returns an acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in ICCR has been set to 1, an interrupt request is sent to the CPU. If the RDRF internal flag has been cleared to 0, it is set to 1, and the receive operation continues. If the RDRF internal flag has been set to 1, the slave device drives SCL low from the fall of the receive clock until data is read into ICDR. [5] Read ICDR and clear the IRIC flag in ICCR to 0. The RDRF flag is cleared to 0. Receive operations can be performed continuously by repeating steps [4] and [5]. When SDA is changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in ICCR is cleared to 0.
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Start condition generation SCL (master output) SCL (slave output) SDA (master output) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R/W [4] A Bit 7 Bit 6 Data 1 1 2 3 4 5 6 7 8 9 1 2
Slave address SDA (slave output) RDRF
IRIC
Interrupt request generation
ICDRS
Address + R/W
ICDRR
Address + R/W
User processing
[5] ICDR read
[5] IRIC clear
Figure 16.9 Example of Slave Receive Mode Operation Timing (1) (MLS = ACKB = 0)
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SCL (master output) SCL (slave output) SDA (master output)
7
8
9
1
2
3
4
5
6
7
8
9
Bit 1 Data 1
Bit 0 [4]
Bit 7
Bit 6
Bit 5
Bit 4 Data 2
Bit 3
Bit 2
Bit 1
Bit 0 [4]
SDA (slave output)
A
A
RDRF
IRIC
Interrupt request generation Data 1
Interrupt request generation Data 2
ICDRS
ICDRR
Data 1
Data 2
User processing
[5] ICDR read
[5] IRIC clear
Figure 16.10 Example of Slave Receive Mode Operation Timing (2) (MLS = ACKB = 0)
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16.3.5
Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs the receive clock and returns an acknowledge signal. The transmission procedure and operations in slave transmit mode are described below. [1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR according to the operating mode. [2] When the slave address matches in the first frame following detection of the start condition, the slave device drives SDA low at the 9th clock pulse and returns an acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in ICCR has been set to 1, an interrupt request is sent to the CPU. If the 8th data bit (R/W) is 1, the TRS bit in ICCR is set to 1, and the mode changes to slave transmit mode automatically. The TDRE internal flag is set to 1. The slave device drives SCL low from the fall of the transmit clock until ICDR data is written. [3] After clearing the IRIC flag to 0, write data to ICDR. The TDRE internal flag is cleared to 0. The written data is transferred to ICDRS, and the TDRE internal flag and the IRIC and IRTR flags are set to 1 again. After clearing the IRIC flag to 0, write the next data to ICDR. The slave device sequentially sends the data written into ICDR in accordance with the clock output by the master device at the timing shown in figure 16.11. [4] When one frame of data has been transmitted, the IRIC flag in ICCR is set to 1 at the rise of the 9th transmit clock pulse. If the TDRE internal flag has been set to 1, this slave device drives SCL low from the fall of the transmit clock until data is written to ICDR. The master device drives SDA low at the 9th clock pulse, and returns an acknowledge signal. As this acknowledge signal is stored in the ACKB bit in ICSR, this bit can be used to determine whether the transfer operation was performed normally. When the TDRE internal flag is 0, the data written into ICDR is transferred to ICDRS, transmission is started, and the TDRE internal flag and the IRIC and IRTR flags are set to 1 again. [5] To continue transmission, clear the IRIC flag to 0, then write the next data to be transmitted into ICDR. The TDRE internal flag is cleared to 0. Transmit operations can be performed continuously by repeating steps [4] and [5]. To end transmission, write H'FF to ICDR to release SDA on the slave side. When SDA is changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in ICCR is cleared to 0.
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Slave receive mode SCL (master output) SCL (slave output) SDA (slave output) SDA (master output) R/W TDRE
Slave transmit mode
8
9
1
2
3
4
5
6
7
8
9
1
2
A [2]
Bit 7
Bit 6
Bit 5
Bit 4 Data 1
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6
Data 2 A
IRIC
Interrupt request generation
Interrupt request generation Data 1 Data 2
[3] Interrupt request generation
ICDRT
ICDRS
Data 1
Data 2
User processing
[3] IRIC clear
[3] ICDR write
[3] ICDR write
[5] IRIC clear
[5] ICDR write
Figure 16.11 Example of Slave Transmit Mode Operation Timing (MLS = 0)
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16.3.6
IRIC Setting Timing and SCL Control
The interrupt request flag (IRIC) is set at different times depending on the WAIT bit in ICMR, the FS bit in SAR, and the FSX bit in SARX. If the TDRE or RDRF internal flag is set to 1, SCL is automatically held low after one frame has been transferred; this timing is synchronized with the internal clock. Figure 16.12 shows the IRIC set timing and SCL control.
(a) When WAIT = 0, and FS = 0 or FSX = 0 (I2C bus format, no wait) SCL 7 8 9 1
SDA IRIC
7
8
A
1
User processing
Clear IRIC
Write to ICDR (transmit) or read ICDR (receive)
(b) When WAIT = 1, and FS = 0 or FSX = 0 (I2C bus format, wait inserted) SCL 8 9 1
SDA IRIC
8
A
1
User processing
Clear IRIC
Clear Write to ICDR (transmit) IRIC or read ICDR (receive)
(c) When FS = 1 and FSX = 1 (synchronous serial format) SCL 7 8 1
SDA IRIC
7
8
1
User processing
Clear IRIC
Write to ICDR (transmit) or read ICDR (receive)
Figure 16.12 IRIC Setting Timing and SCL Control
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16.3.7
Automatic Switching from Formatless Mode to I C Bus Format
2
Setting the SW bit to 1 in DDCSWR enables formatless mode to be selected as the IIC0 operating 2 mode. Switching from formatless mode to the I C bus format (slave mode) is performed automatically when a falling edge is detected on the SCL pin. The following four preconditions are necessary for this operation: • A common data pin (SDA) for formatless and I C bus format operation
2
• Separate clock pins for formatless operation (VSYNCI) and I C bus format operation (SCL)
2
• A fixed 1 level for the SCL pin during formatless operation (the SCL pin does not output a low level) • Settings of bits other than TRS in ICCR that allow I C bus format operation
2
Automatic switching is performed from formatless mode to the I C bus format when the SW bit in DDCSWR is automatically cleared to 0 on detection of a falling edge on the SCL pin. Switching 2 from the I C bus format to formatless mode is achieved by having software set the SW bit in DDCSWR to 1. In formatless mode, bits (such as MSL and TRS) that control the I C bus interface operating mode 2 must not be modified. When switching from the I C bus format to formatless mode, set the TRS bit to 1 or clear it to 0 according to the transmit data (transmission or reception) in formatless 2 mode, then set the SW bit to 1. After automatic switching from formatless mode to the I C bus format (slave mode), in order to wait for slave address reception, the TRS bit is automatically cleared to 0. If a falling edge is detected on the SCL pin during formatless operation, the I C bus interface 2 operating mode is switched to the I C bus format without waiting for a stop condition to be detected.
2 2
2
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16.3.8
2
Operation Using the DTC
The I C bus format provides for selection of the slave device and transfer direction by means of the slave address and the R/W bit, confirmation of reception with the acknowledge bit, indication of the last frame, and so on. Therefore, continuous data transfer using the DTC must be carried out in conjunction with CPU processing by means of interrupts. Table 16.5 shows some examples of processing using the DTC. These examples assume that the number of transfer data bytes is known in slave mode. Table 16.5 Examples of Operation Using the DTC
Item Master Transmit Mode Master Receive Mode Transmission by CPU (ICDR write) Slave Transmit Mode Reception by CPU (ICDR read) Slave Receive Mode Reception by CPU (ICDR read)
Slave address + Transmission by R/W bit DTC (ICDR write) transmission/ reception Dummy data read Actual data transmission/ reception Dummy data (H'FF) write Last frame processing Transfer request processing after last frame processing Setting of number of DTC transfer data frames — Transmission by DTC (ICDR write) — Not necessary 1st time: Clearing by CPU 2nd time: End condition issuance by CPU
Processing by CPU (ICDR read) Reception by DTC (ICDR read) — Reception by CPU (ICDR read) Not necessary
— Transmission by DTC (ICDR write) Processing by DTC (ICDR write) Not necessary
— Reception by DTC (ICDR read) — Reception by CPU (ICDR read)
Automatic clearing Not necessary on detection of end condition during transmission of dummy data (H'FF) Transmission: Reception: Actual Actual data count data count + 1 (+1 equivalent to dummy data (H'FF))
Transmission: Reception: Actual Actual data count data count + 1 (+1 equivalent to slave address + R/W bits)
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16.3.9
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched internally. Figure 16.13 shows a block diagram of the noise canceler circuit. The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA) input signal is sampled on the system clock, but is not passed forward to the next circuit unless the outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C SCL or SDA input signal D Latch Q D
C Q Latch Match detector Internal SCL or SDA signal
System clock period Sampling clock
Figure 16.13 Block Diagram of Noise Canceler 16.3.10 Sample Flowcharts Figures 16.14 to 16.17 show sample flowcharts for using the I C bus interface in each mode.
2
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Start Initialize Read BBSY in ICCR No BBSY = 0? Yes Set MST = 1 and TRS = 1 in ICCR Write BBSY = 1 and SCP = 0 in ICCR [3] Select master transmit mode. [1] Initialize
[2] Test the status of the SCL and SDA lines.
[4] Start condition issuance
Read IRIC in ICCR No IRIC = 1? Yes Write transmit data in ICDR Clear IRIC in ICCR Read IRIC in ICCR No IRIC = 1? Yes Read ACKB in ICSR ACKB = 0? Yes Transmit mode? Yes Write transmit data in ICDR Clear IRIC in ICCR Read IRIC in ICCR No No No
[5] Wait for a start condition generation
[6] Set transmit data for the first byte (slave address + R/W). (After writing ICDR, clear IRIC immediately)
[7] Wait for 1 byte to be transmitted.
[8] Test the acknowledge bit, transferred from slave device.
Master receive mode
[9] Set transmit data for the second and subsequent bytes. (After writing ICDR, clear IRIC immediately)
[10] Wait for 1 byte to be transmitted. IRIC = 1? Yes Read ACKB in ICSR [11] Test for end of transfer
No
End of transmission or ACKB = 1? Yes Clear IRIC in ICCR Write BBSY = 0 and SCP = 0 in ICCR End [12] Stop condition issuance
Figure 16.14 Flowchart for Master Transmit Mode (Example)
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Master receive operation Set TRS = 0 in ICCR Set WAIT = 1 in ICMR Set ACKB = 0 in ICSR Read ICDR Clear IRIC in ICCR Read IRIC in ICCR No IRIC = 1? Yes Last receive ? No Clear IRIC in ICCR [4] Clear IRIC to trigger the 9th clock. (to end the wait insertion) [5] Wait for 1 byte to be received. (9th clock risig edge) Yes [2] Start receiving. The first read is a dummy read. After reading ICDR, please clear IRIC immediately. [1] Select receive mode
[3] Wait for 1 byte to be received. (8th clock falling edge)
Read IRIC in ICCR No IRIC = 1? Yes Read ICDR Clear IRIC in ICCR
[6] Read the receive data. [7] Clear IRIC
Read IRIC in ICCR No IRIC = 1? Yes Yes Last receive ? No Clear IRIC in ICCR
[8] Wait for the next data to be received. (8th clock falling edge)
[9] Clear IRIC to trigger the 9th clock. (to end the wait insertion)
Set ACKB = 1 in ICSR Set TRS = 1 in ICCR Clear IRIC in ICCR Read IRIC in ICCR No
[10] Set ACKB = 1 so as to return no acknowledge, or set TRS = 1 so as not to issue extra clock. [11] Clear IRIC to trigger the 9th clock. (to end the wait insertion)
[12] Wait for 1 byte to be received. IRIC = 1? Yes Set WAIT = 0 in ICMR Read ICDR Clear IRIC in ICCR Write BBSY = 0 and SCP = 0 in ICCR End [14] Stop condition issuance. [13] Set WAIT = 0. Read ICDR. Clear IRIC. (Note: After setting WAIT = 0, IRIC should be cleared to 0.)
Figure 16.15 Flowchart for Master Receive Mode (Example)
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Start Initialize Set MST = 0 and TRS = 0 in ICCR Set ACKB = 0 in ICSR Read IRIC in ICCR [2] No IRIC = 1? Yes Read AAS and ADZ in ICSR AAS = 1 and ADZ = 0? Yes Read TRS in ICCR TRS = 0? Yes Last receive? No Read ICDR Clear IRIC in ICCR Read IRIC in ICCR No [4] IRIC = 1? Yes Set ACKB = 0 in ICSR Read ICDR Clear IRIC in ICCR Read IRIC in ICCR No IRIC = 1? Yes Read ICDR Clear IRIC in ICCR End [8] [5] [6] Yes [1] Select slave receive mode. [2] Wait for the first byte to be received (slave address). [3] Start receiving. The first read is a dummy read. [4] Wait for the transfer to end. [5] Set acknowledge data for the last receive. [6] Start the last receive. [7] Wait for the transfer to end. [8] Read the last receive data. No Slave transmit mode No General call address processing * Description omitted [1]
[3]
[7]
Figure 16.16 Flowchart for Slave Receive Mode (Example)
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Slave transmit mode Clear IRIC in ICCR [1] Set transmit data for the second and subsequent bytes. [2] Wait for 1 byte to be transmitted. [3] Test for end of transfer. Read IRIC in ICCR No [2] IRIC = 1? Yes Read ACKB in ICSR End of transmission (ACKB = 1)? Yes Set TRS = 0 in ICCR Read ICDR Clear IRIC in ICCR End [4] [3] [4] Select slave receive mode. [5] Dummy read (to release the SCL line).
Write transmit data in ICDR Clear IRIC in ICCR
[1]
No
[5]
Figure 16.17 Flowchart for Slave Transmit Mode (Example)
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16.3.11 Initialization of Internal State The IIC has a function for forcible initialization of its internal state if a deadlock occurs during communication. Initialization is executed by (1) setting bits CLR3 to CLR0 in the DDCSWR register or (2) clearing the ICE bit. For details of settings for bits CLR3 to CLR0, see section 16.2.8, DDC Switch Register (DDCSWR). Scope of Initialization: The initialization executed by this function covers the following items: • TDRE and RDRF internal flags • Transmit/receive sequencer and internal operating clock counter • Internal latches for retaining the output state of the SCL and SDA pins (wait, clock, data output, etc.) The following items are not initialized: • Actual register values (ICDR, SAR, SARX, ICMR, ICCR, ICSR, DDCSWR, STCR) • Internal latches used to retain register read information for setting/clearing flags in the ICMR, ICCR, ICSR, and DDCSWR registers • The value of the ICMR register bit counter (BC2 to BC0) • Generated interrupt sources (interrupt sources transferred to the interrupt controller) Notes on Initialization: • Interrupt flags and interrupt sources are not cleared, and so flag clearing measures must be taken as necessary. • Basically, other register flags are not cleared either, and so flag clearing measures must be taken as necessary. • When initialization is performed by means of the DDCSWR register, the write data for bits CLR3 to CLR0 is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written to simultaneously using an MOV instruction. Do not use a bit-manipulation instruction such as BCLR. Similarly, when clearing is required again, all the bits must be written to simultaneously in accordance with the setting. • If a flag clearing setting is made during transmission/reception, the IIC module will stop transmitting/receiving at that point and the SCL and SDA pins will be released. When transmission/reception is started again, register initialization, etc., must be carried out as necessary to enable correct communication as a system.
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The value of the BBSY bit cannot be modified directly by this module clear function, but since the stop condition pin waveform is generated according to the state and release timing of the SCL and SDA pins, the BBSY bit may be cleared as a result. Similarly, state switching of other bits and flags may also have an effect. To prevent problems caused by these factors, the following procedure should be used when initializing the IIC state. 1. Execute initialization of the internal state by setting of bit CLR3 to CLR0 or by clearing ICE bit. 2. Execute a stop condition issuance instruction (write 0 to BBSY and SCP) to clear the BBSY bit to 0, and wait for two transfer rate clock cycles. 3. Re-execute initialization of the internal state by setting of bit CLR3 to CLR0 or by clearing ICE bit. 4. Initialize (re-set) the IIC registers.
16.4
Usage Notes
• In master mode, if an instruction to generate a start condition is immediately followed by an instruction to generate a stop condition, neither condition will be output correctly. To output consecutive start and stop conditions, after issuing the instruction that generates the start condition, read the relevant ports, check that SCL and SDA are both low, then issue the instruction that generates the stop condition. Note that SCL may not yet have gone low when BBSY is cleared to 0. • Either of the following two conditions will start the next transfer. Pay attention to these conditions when reading or writing to ICDR. Write access to ICDR when ICE = 1 and TRS = 1 (including automatic transfer from ICDRT to ICDRS) Read access to ICDR when ICE = 1 and TRS = 0 (including automatic transfer from ICDRS to ICDRR) • Table 16.6 shows the timing of SCL and SDA output in synchronization with the internal clock. Timings on the bus are determined by the rise and fall times of signals affected by the bus load capacitance, series resistance, and parallel resistance.
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Table 16.6 I C Bus Timing (SCL and SDA Output)
Item SCL output cycle time SCL output high pulse width SCL output low pulse width SDA output bus free time Start condition output hold time Retransmission start condition output setup time Stop condition output setup time Data output setup time (master) Data output setup time (slave) Data output hold time Note: * tSDAHO 6tcyc when IICX is 0, 12tcyc when 1. Symbol tSCLO tSCLHO tSCLLO tBUFO tSTAHO tSTASO tSTOSO tSDASO Output Timing 28tcyc to 256tcyc 0.5tSCLO 0.5tSCLO 0.5tSCLO –1tcyc 0.5tSCLO –1tcyc 1tSCLO 0.5tSCLO +2tcyc Unit ns ns ns ns ns ns ns Notes Figure 26.28 (reference)
2
1tSCLLO –3tcyc ns 1tSCLL –(6tcyc or 12tcyc*) 3tcyc ns
• SCL and SDA input is sampled in synchronization with the internal clock. The AC timing 2 therefore depends on the system clock cycle tcyc, as shown in I C Bus Timing in section 26, 2 Electrical Characteristics, and as shown in table 26.10. Note that the I C bus interface AC timing specifications will not be met with a system clock frequency of less than 5 MHz. • The I C bus interface specification for the SCL rise time tsr is under 1000 ns (300 ns for high2 speed mode). In master mode, the I C bus interface monitors the SCL line and synchronizes one bit at a time during communication. If tsr (the time for SCL to go from low to VIH) exceeds 2 the time determined by the input clock of the I C bus interface, the high period of SCL is extended. The SCL rise time is determined by the pull-up resistance and load capacitance of the SCL line. To insure proper operation at the set transfer rate, adjust the pull-up resistance and load capacitance so that the SCL rise time does not exceed the values given in the table below.
2
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Table 16.7 Permissible SCL Rise Time (tSr) Values
Time Indication tcyc IICX Indication 0 7.5tcyc Standard mode High-speed mode 1 17.5tcyc Standard mode High-speed mode
2
2
I C Bus Specification φ = (Max.) 5 MHz 1000 ns 300 ns 1000 ns 300 ns
φ= 8 MHz
φ= φ= φ= 10 MHz 16 MHz 20 MHz 750 ns 300 ns 468 ns 300 ns 375 ns 300 ns
1000 ns 937 ns 300 ns 300 ns
1000 ns 1000 ns 300 ns 300 ns
1000 ns 1000 ns 875 ns 300 ns 300 ns 300 ns
• The I C bus interface specifications for the SCL and SDA rise and fall times are under 1000 ns 2 and 300 ns. The I C bus interface SCL and SDA output timing is prescribed by tcyc, as shown in 2 table 16.6. However, because of the rise and fall times, the I C bus interface specifications may not be satisfied at the maximum transfer rate. Table 16.8 shows output timing calculations for different operating frequencies, including the worst-case influence of rise and fall times. tBUFO fails to meet the I C bus interface specifications at any frequency. The solution is either (a) to provide coding to secure the necessary interval (approximately 1 µs) between issuance of a stop condition and issuance of a start condition, or (b) to select devices whose input timing 2 permits this output timing for use as slave devices connected to the I C bus. tSCLLO in high-speed mode and tSTASO in standard mode fail to satisfy the I C bus interface specifications for worst-case calculations of tSr/tSf. Possible solutions that should be investigated include (a) adjusting the rise and fall times by means of a pull-up resistor and capacitive load, (b) reducing the transfer rate to meet the specifications, or (c) selecting devices whose input 2 timing permits this output timing for use as slave devices connected to the I C bus.
2 2
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Table 16.8 I C Bus Timing (with Maximum Influence of tSr/tSf)
Time Indication (at Maximum Transfer Rate) [ns] I C Bus SpecifitSr/tSf Influence cation φ = (Max.) (Min.) 5 MHz Standard mode –1000 4000 600 4700 1300 4700 1300 4000 600 4700 600 4000 600 250 100 250 100 4000 950 4750
2
2
Item tSCLHO
tcyc Indication 0.5tSCLO (–tSr)
φ= 8 MHz 4000 950 4750
φ= φ= φ= 10 MHz 16 MHz 20 MHz 4000 950 4750 4000 950 4750 4000 950 4750
High-speed –300 mode tSCLLO 0.5tSCLO (–tSf ) Standard mode –250
High-speed –250 mode tBUFO 0.5tSCLO Standard –1tcyc (–tSr ) mode –1000
1 1 1 1 1 1000* 1000* 1000* 1000* 1000*
1 1 1 1 1 3800* 3875* 3900* 3938* 3950*
High-speed –300 mode tSTAHO 0.5tSCLO Standard –1tcyc (–tSf ) mode –250
750*
1
825*
1
850*
1
888*
1
900*
1
4550 800 9000 2200 4400 1350 3100 400 1300
4625 875 9000 2200 4250 1200 3325 625 2200
4650 900 9000 2200 4200 1150 3400 700 2500
4688 938 9000 2200 4125 1075 3513 813 2950
4700 950 9000 2200 4100 1050 3550 850 3100 400
High-speed –250 mode tSTASO 1tSCLO (–tSr ) Standard mode –1000
High-speed –300 mode tSTOSO 0.5tSCLO Standard +2tcyc (–tSr ) mode –1000
High-speed –300 mode Standard tSDASO 1tSCLLO* (master) –3tcyc (–tSr ) mode
3
–1000
High-speed –300 mode tSDASO (slave) 1tSCLL* 2 –12tcyc* (–tSr )
3
Standard mode
–1000
High-speed –300 mode
1 1 1 –1400* –500* –200* 250
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Section 16 I C Bus Interface [Option] Time Indication (at Maximum Transfer Rate) [ns] I C Bus SpecifitSr/tSf Influence cation φ = (Max.) (Min.) 5 MHz Standard mode 0 0 0 600 600
2
2
Item tSDAHO
tcyc Indication 3tcyc
φ= 8 MHz 375 375
φ= φ= φ= 10 MHz 16 MHz 20 MHz 300 300 188 188 150 150
High-speed 0 mode
2
Notes: 1. Does not meet the I C bus interface specification. Remedial action such as the following is necessary: (a) secure a start/stop condition issuance interval; (b) adjust the rise and fall times by means of a pull-up resistor and capacitive load; (c) reduce the transfer rate; (d) select slave devices whose input timing permits this output timing. The values in the above table will vary depending on the settings of the IICX bit and bits CKS0 to CKS2. Depending on the frequency it may not be possible to achieve the 2 maximum transfer rate; therefore whether or not the I C bus interface specifications are met must be determined in accordance with the actual setting conditions. 2. Value when the IICX bit is set to 1. When the IICX bit is cleared to 0, the value is (tSCLL −6tcyc). 2 3. Calculated using the I C bus specification values (standard mode: 4700 ns min.; highspeed mode: 1300 ns min.).
• Note on ICDR Read at End of Master Reception To halt reception at the end of a receive operation in master receive mode, set the TRS bit to 1 and write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high, and generates the stop condition. After this, receive data can be read by means of an ICDR read, but if data remains in the buffer the ICDRS receive data will not be transferred to ICDR, and so it will not be possible to read the second byte of data. If it is necessary to read the second byte of data, issue the stop condition in master receive mode (i.e. with the TRS bit cleared to 0). When reading the receive data, first confirm that the BBSY bit in the ICCR register is cleared to 0, the stop condition has been generated, and the bus has been released, then read the ICDR register with TRS cleared to 0. Note that if the receive data (ICDR data) is read in the interval between execution of the instruction for issuance of the stop condition (writing of 0 to BBSY and SCP in ICCR) and the actual generation of the stop condition, the clock may not be output correctly in subsequent master transmission.
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Section 16 I C Bus Interface [Option]
2
Clearing of the MST bit after completion of master transmission/reception, or other modifications of IIC control bits to change the transmit/receive operating mode or settings, must be carried out during interval (a) in figure 16.18 (after confirming that the BBSY bit has been cleared to 0 in the ICCR register).
Stop condition (a) SDA SCL Internal clock BBSY bit Master receive mode ICDR reading prohibited Bit 0 8 A 9 Start condition
Execution of stop condition issuance instruction (0 written to BBSY and SCP)
Confirmation of stop condition generation (0 read from BBSY)
Start condition issuance
Figure 16.18 Points for Attention Concerning Reading of Master Receive Data • Notes on Start Condition Issuance for Retransmission Figure 16.19 shows the timing of start condition issuance for retransmission, and the timing for subsequently writing data to ICDR, together with the corresponding flowchart. After start condition issuance is done and determined the start condition, write the transmit data to ICDR, as shown below.
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Section 16 I C Bus Interface [Option]
2
[1] Wait for end of 1-byte transfer IRIC = 1 ? Yes Clear IRIC in ICSR Start condition issuance? Yes Read SCL pin SCL = Low ? Yes Write BBSY = 1, SCP = 0 (ICSR) [3] No [2] No Other processing [5] Set transmit data (slave address + R/W) Note: Program so that processing from [3] to [5] is executed continuously. No [1] [2] Determine whether SCL is low [3] Issue restart condition instruction for retransmission [4] Determine whether start condition is generated or not
IRIC = 1 ? Yes
No
[4]
Write transmit data to ICDR
[5]
Start condition (retransmission) SCL 9
SDA
ACK
bit 7
IRIC [3] Start condition instruction issuance [1] IRIC determination [2] Determination of SCL = low
[4] IRIC determination [5] ICDR write (next transmit data)
Figure 16.19 Flowchart and Timing of Start Condition Instruction Issuance for Retransmission
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Section 16 I C Bus Interface [Option]
2
• Notes on I C Bus Interface Stop Condition Instruction Issuance
2
If the rise time of the 9th SCL clock exceeds the specification because the bus load capacitance is large, or if there is a slave device of the type that drives SCL low to effect a wait, after rising of the 9th SCL clock, issue the stop condition instruction after reading SCL and determining it to be low, as shown below.
9th clock VIH High period secured
SCL
As waveform rise is late, SCL is detected as low SDA Stop condition IRIC [1] Determination of SCL = low [2] Stop condition instruction issuance
Figure 16.20 Timing of Stop Condition Issuance
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Section 16 I C Bus Interface [Option]
2
• Notes on WAIT Function Conditions to cause this phenomenon When both of the following conditions are satisfied, the clock pulse of the 9th clock could be outputted continuously in master mode using the WAIT function due to the failure of the WAIT insertion after the 8th clock fall. (1) Setting the WAIT bit of the ICMR register to 1 and operating WAIT, in master mode (2) If the IRIC bit of interrupt flag is cleared from 1 to 0 between the fall of the 7th clock and the fall of the 8th clock. Error phenomenon Normally, WAIT State will be cancelled by clearing the IRIC flag bit from 1 to 0 after the fall of the 8th clock in WAIT State. In this case, if the IRIC flag bit is cleared between the 7th clock fall and the 8th clock fall, the IRIC flag clear- data will be retained internally. Therefore, the WAIT State will be cancelled right after WAIT insertion on 8th clock fall. Restrictions Please clear the IRIC flag before the rise of the 7th clock (the counter value of BC2 through BC0 should be 2 or greater), after the IRIC flag is set to 1 on the rise of the 9th clock. If the IRIC flag-clear is delayed due to the interrupt or other processes and the value of BC counter is turned to 1 or 0, please confirm the SCL pins are in L’ state after the counter value of BC2 through BC0 is turned to 0, and clear the IRIC flag. (See figure 16.21.)
Transmit/receive data 9 1 7 2 6 3 5 When BC2-0 ≥ 2 IRIC clear
ASD SCL BC2–BC0 IRIC (operation example)
A 9 0 1 7 2 6
Transmit/receive data
A 7 2 1 8 SCL = ‘L’ confirm 0 IRIC clear
3 5
4 4
5 3
6
IRIC flag clear available
IRIC flag clear available
IRIC flag clear unavailable
Figure 16.21 IRIC Flag Clear Timing on WAIT Operation
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Section 16 I C Bus Interface [Option]
2
• Notes on ICDR Reads and ICCR Access in Slave Transmit Mode In a transmit operation in the slave mode of the I C bus interface, do not read the ICDR register or read or write to the ICCR register during the period indicated by the shaded portion in figure 16.22. Normally, when interrupt processing is triggered in synchronization with the rising edge of the 9th clock cycle, the period in question has already elapsed when the transition to interrupt processing takes place, so there is no problem with reading the ICDR register or reading or writing to the ICCR register. To ensure that the interrupt processing is performed properly, one of the following two conditions should be applied. (1) Make sure that reading received data from the ICDR register, or reading or writing to the ICCR register, is completed before the next slave address receive operation starts. (2) Monitor the BC2 to BC0 counter in the ICMR register and, when the value of BC2 to BC0 is 000 (8th or 9th clock cycle), allow a waiting time of at least 2 transfer clock cycles in order to involve the problem period in question before reading from the ICDR register, or reading or writing to the ICCR register.
Waveforms if problem occurs SDA SCL TRS R/W 8 Address received Period when ICDR reads and ICCR reads and writes are prohibited (6 system clock cycles) A 9 Data transmission ICDR write Bit 7
2
Detection of 9th clock cycle rising edge
Figure 16.22 ICDR Read and ICCR Access Timing in Slave Transmit Mode
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Section 16 I C Bus Interface [Option]
2
• Notes on TRS Bit Setting in Slave Mode From the detection of the rising edge of the 9th clock cycle or of a stop condition to when the rising edge of the next SCL pin signal is detected (the period indicated as (a) in figure 16.23) 2 in the slave mode of the I C bus interface, the value set in the TRS bit in the ICCR register is effective immediately. However, at other times (indicated as (b) in figure 16.23) the value set in the TRS bit is put on hold until the next rising edge of the 9th clock cycle or stop condition is detected, rather than taking effect immediately. This results in the actual internal value of the TRS bit remaining 1 (transmit mode) and no acknowledge bit being sent at the 9th clock cycle address receive completion in the case of an address receive operation following a restart condition input with no stop condition intervening. When receiving an address in the slave mode, clear the TRS bit to 0 during the period indicated as (a) in figure 16.23. To cancel the holding of the SCL bit low by the wait function in the slave mode, clear the TRS bit to 0 and then perform a dummy read of the ICDR register.
Resumption condition
(a) SDA SCL (a) TRS bit (b) TRS bit 8 9
(b) A
1
2
3
4
5
6
7
8
9
Data transmission
Address reception
Period in which TRS bit setting is retained TRS bit effective value Detection of rise of 9th transmit/receive clock TRS bit setting value Detection of rise of 9th transmit/receive clock
Figure 16.23 TRS Bit Setting Timing in Slave Mode
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Section 16 I C Bus Interface [Option]
2
• Notes on Arbitration Lost in Master Mode The I C bus interface recognizes the data in transmit/receive frame as an address when arbitration is lost in master mode and a transition to slave receive mode is automatically carried out. When arbitration is lost not in the first frame but in the second frame or subsequent frame, transmit/receive data that is not an address is compared with the value set in the SAR or SARX register as an address. If the receive data matches with the address in the SAR or SARX 2 register, the I C bus interface erroneously recognizes that the address call has occurred. (See figure 16.24.) In multi-master mode, a bus conflict could happen. When The I C bus interface is operated in master mode, check the state of the AL bit in the ICSR register every time after one frame of data has been transmitted or received. When arbitration is lost during transmitting the second frame or subsequent frame, take avoidance measures.
• Arbitration is lost • The AL flag in ICSR is set to 1 I2 C bus interface (Master transmit mode) S SLA R/W A DATA1 Transmit data does not match DATA2 A DATA3 A
2 2
Transmit data match Transmit timing match Other device (Master transmit mode) S SLA R/W A
Data contention I2C bus interface (Slave receive mode) S SLA R/W A SLA R/W A DATA4 A
• Receive address is ignored
• Automatically transferred to slave receive mode • Receive data is recognized as an address • When the receive data matches to the address set in the SAR or SARX register, the I2C bus interface operates as a slave device
Figure 16.24 Diagram of Erroneous Operation when Arbitration is Lost Though it is prohibited in the normal I C protocol, the same problem may occur when the MST bit is erroneously set to 1 and a transition to master mode is occurred during data transmission or reception in slave mode. In multi-master mode, pay attention to the setting of the MST bit when a bus conflict may occur. In this case, the MST bit in the ICCR register should be set to 1 according to the order below. (a) Make sure that the BBSY flag in the ICCR register is 0 and the bus is free before setting the MST bit. (b) Set the MST bit to 1.
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2
Section 16 I C Bus Interface [Option]
2
(c) To confirm that the bus was not entered to the busy state while the MST bit is being set, check that the BBSY flag in the ICCR register is 0 immediately after the MST bit has been set. • Notes on Interrupt Occurrence after ACKB Reception Conditions to cause this failure The IRIC flag is set to 1 when both of the following conditions are satisfied. • 1 is received as the acknowledge bit for transmit data and the ACKB bit in ICSR is set to 1 • Rising edge of the 9th transmit/receive clock is input to the SCL pin When the above two conditions are satisfied in slave receive mode, an unnecessary interrupt occurs. Figure 16.25 shows the note on interrupt occurrence in slave mode after receiving 1 as the acknowledge bit (ACKB = 1). (1) For the last transmit data in master transmit mode or slave transmit mode, 1 is received as the acknowledge bit. If the ACKE bit in ICCR is set to 1 at this time, the ACKB bit in ICSR is set to 1. (2) After switching to slave receive mode, the start condition is input, and address reception is performed next. (3) Even if the received address does not match the address set in SAR or SARX, the IRIC flag is set to 1 at the rise of the 9th transmit/receive clock, thus causing an interrupt to occur. Note that if the slave address matches, an interrupt is to be generated at the rise of the 9th transmit/receive clock as normal operation, so this is not erroneous operation. Restriction In a transmit operation of the I C bus interface module, carry out the following countermeasures. (1) After 1 is received as the acknowledge bit for transmit data, clear the ACKE bit in ICCR to 0 to clear the ACKB bit to 0. (2) To enable acknowledge bit reception afterwards, set the ACKE bit to 1 again.
2
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Section 16 I C Bus Interface [Option]
2
Master transmit mode or slave transmit mode
Stop condition
Start condition
Slave reception mode
(2) Address that does not match is received. SDA N Address A Data
SCL
8
9
1
2
3
4
5
6
7
8
9
1
2
ACKB bit IRIC flag Countermeasure: Clear the ACKE bit to 0 to clear the ACKB bit. (3) Unnecessary interrupt occurs (received address is invalid).
Stop condition detection (1) Acknowledge bit is received and the ACKB bit is set to 1.
Figure 16.25 Note on Interrupt Occurrence in Slave Mode after ACKB = 1 Reception
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Section 16 I C Bus Interface [Option]
2
• Notes on TRS Bit Setting and ICDR Register Access Conditions to cause this failure Low-fixation of the SCL pins is cancelled incorrectly when the following conditions are satisfied. Master mode Figure 16.26 shows the notes on ICDR reading (TRS = 1) in master mode. (1) When previously received 2-bytes data remains in ICDR unread (ICDRS are full). (2) Reads ICDR register after switching to transmit mode (TRS = 1). (RDRF = 0 state) (3) Sets to receive mode (TRS = 0), after transmitting Rev.1 frame of issued start condition by master mode. Slave mode Figure 16.27 shows the notes on ICDR writing (TRS = 0) in slave mode. (1) Writes ICDR register in receive mode (TRS = 0), after entering the start condition by slave mode (TDRE = 0 state). Address match with Rev.1 frame, receive 1 by R/W bit, and switches to transmit mode (TRS = 1). When these conditions are satisfied, the low fixation of the SCL pins is cancelled without ICDR register access after Rev.1 frame is transferred. Restriction Please carry out the following countermeasures when transmitting/receiving via the IIC bus interface module. (1) Please read the ICDR registers in receive mode, and write them in transmit mode. (2) In receiving operation with master mode, please issue the start condition after clearing the internal flag of the IIC bus interface module, using CLR3 to CLR0 bit of the DDCSWR register on bus-free state (BBSY = 0).
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Section 16 I C Bus Interface [Option]
2
Along with ICDRS: ICDRR transfer Stop condition Start condition Cancel condition of SCL = Low fixation is set.
SDA SCL TRS bit RDRF bit ICDRS data full
A 8 9 1 2 3
Address 4 5 6 7 8
A 9
Data 1 2 3
(3) TRS = 0 (2) RDRF = 0
(1) ICDRS data full
ICDR read Detection of 9th clock rise (TRS = 1)
TRS = 0 setting
Figure 16.26 Notes on ICDR Reading with TRS = 1 Setting in Master Mode
Along with ICDRS: ICDRR transfer Stop condition Start condition Cancel condition of SCL = Low fixation
SDA SCL TRS bit TDRE bit 8
A 9 1 2 3
Address 4 5 6 7 8
A 9 1 2
Data 3 4
(2) TRS = 1
(1) TDRE = 0 ICDR write TRS = 0 setting Automatic TRS = 1 setting by receiving R/W = 1
Figure 16.27 Notes on ICDR Writing with TRS = 0 Setting in Slave Mode
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Section 16 I C Bus Interface [Option]
2
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Section 17 Keyboard Buffer Controller
Section 17 Keyboard Buffer Controller
Provided in the H8S/2148 Group and H8S/2147N; not provided in the H8S/2144 Group.
17.1
Overview
The H8S/2148 Group and H8S/2147N have three on-chip keyboard buffer controller channels, designated 0, 1, and 2. The keyboard buffer controller is provided with functions conforming to the PS/2 interface specifications. Data transfer using the keyboard buffer controller employs a data line (KD) and a clock line, providing economical use of connectors, board surface area, etc. Figure 17.1 shows how the keyboard buffer controller is connected. 17.1.1 Features
• Conforms to PS/2 interface specifications • Direct bus drive (via the KCLK and KD pins) • Interrupt sources: on completion of data reception and on detection of clock edge • Error detection: parity error and stop bit monitoring
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Section 17 Keyboard Buffer Controller
Vcc
Vcc
System side KCLK in Clock KCLK out
Keyboard side KCLK in KCLK out
KD in KD out
Data
KD in KD out
Keyboard buffer controller (H8S/2148 Group and H8S/2147N chip)
I/F
Figure 17.1 Keyboard Buffer Controller Connection
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Section 17 Keyboard Buffer Controller
17.1.2
Block Diagram
Figure 17.2 shows a block diagram of the keyboard buffer controller.
Internal data bus KBBR
KDI Control logic KCLKI Parity KDO KCLKO KBCRL KBCRH
KCLK (PS2AC, PS2BC, PS2CC)
Register counter value KB interrupt Legend: KD: KCLK: KBBR: KBCRH: KBCRL:
KBC data I/O pin KBC clock I/O pin Keyboard data buffer register Keyboard control register H Keyboard control register L
Figure 17.2 Block Diagram of Keyboard Buffer Controller
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Module data bus
Bus interface
KD (PS2AD, PS2BD, PS2CD)
Section 17 Keyboard Buffer Controller
17.1.3
Input/Output Pins
Table 17.1 lists the input/output pins used by the keyboard buffer controller. Table 17.1 Keyboard Buffer Controller Input/Output Pins
Channel 0 1 2 Note: * Name KBC clock I/O pin (KCLK0) KBC data I/O pin (KD0) KBC clock I/O pin (KCLK1) KBC data I/O pin (KD1) KBC clock I/O pin (KCLK2) KBC data I/O pin (KD2) Abbreviation* PS2AC PS2AD PS2BC PS2BD PS2CC PS2CD I/O I/O I/O I/O I/O I/O I/O Function KBC clock input/output KBC data input/output KBC clock input/output KBC data input/output KBC clock input/output KBC data input/output
These are the external I/O pin names. In the text, clock I/O pins are referred to as KCLK and data I/O pins as KD, omitting the channel designations.
17.1.4
Register Configuration
Table 17.2 lists the registers of the keyboard buffer controller. Table 17.2 Keyboard Buffer Controller Registers
Channel 0 Name Keyboard control register H Keyboard control register L Keyboard data buffer register 1 Keyboard control register H Keyboard control register L Keyboard data buffer register 2 Keyboard control register H Keyboard control register L Keyboard data buffer register Common Module stop control register Abbreviation KBCRH0 KBCRL0 KBBR0 KBCRH1 KBCRL1 KBBR1 KBCRH2 KBCRL2 KBBR2 MSTPCRH MSTPCRL R/W
2 R/(W)*
Initial Value H'70 H'70 H'00
2
Address* H'FED8 H'FED9 H'FEDA H'FEDC H'FEDD H'FEDE H'FEE0 H'FEE1 H'FEE2 H'FF86 H'FF87
1
R/W R R/(W)* R/W R
2 R/(W)*
H'70 H'70 H'00 H'70 H'70 H'00 H'3F H'FF
R/W R R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written in bits 2 and 1, to clear the flags.
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Section 17 Keyboard Buffer Controller
17.2
17.2.1
Bit
Register Descriptions
Keyboard Control Register H (KBCRH)
7 KBIOE 0 R/W 6 KCLKI 1 R 5 KDI 1 R 4 KBFSEL 1 R/W 3 KBIE 0 R/W 2 KBF 0 R/(W)* 1 PER 0 R/(W)* 0 KBS 0 R
Initial value Read/Write Note: *
Only 0 can be written, to clear the flags.
KBCRH is an 8-bit readable/writable register that indicates the operating status of the keyboard buffer controller. KBCRH is initialized to H'70 by a reset, and in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode. Bits 6, 5, and 2 to 0 are also initialized when KBIOE is cleared to 0. Bit 7—Keyboard In/Out Enable (KBIOE): Selects whether or not the keyboard buffer controller is used. When KBIOE is set to 1, the keyboard buffer controller is enabled for transmission and reception and the port pins function as KCLK and KD I/O pins. When KBIOE is cleared to 0, the keyboard buffer controller stops functioning and the port pins go to the highimpedance state.
Bit 7 KBIOE 0 1 Description The keyboard buffer controller is non-operational (KCLK and KD signal pins have port functions) (Initial value) The keyboard buffer controller is enabled for transmission and reception (KCLK and KD signal pins are in the bus drive state)
Bit 6—Keyboard Clock In (KCLKI): Monitors the KCLK I/O pin. This bit cannot be modified.
Bit 6 KCLKI 0 1 Description KCLK I/O pin is low KCLK I/O pin is high (Initial value)
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Section 17 Keyboard Buffer Controller
Bit 5—Keyboard Data In (KDI): Monitors the KDI I/O pin. This bit cannot be modified.
Bit 5 KDI 0 1 Description KD I/O pin is low KD I/O pin is high (Initial value)
Bit 4—Keyboard Buffer Register Full Select (KBFSEL): Selects whether the KBF bit is used as the keyboard buffer register full flag or as the KCLK fall interrupt flag, When KBFSEL is cleared to 0, the KBE bit in the KBCRL register should be cleared to 0 to disable reception.
Bit 4 KBFSEL 0 1 Description KBF bit is used as KCLK fall interrupt flag KBF bit is used as keyboard buffer register full flag (Initial value)
Bit 3—Keyboard Interrupt Enable (KBIE): Enables or disables interrupts from the keyboard buffer controller to the CPU.
Bit 3 KBIE 0 1 Description Interrupt requests are disabled Interrupt requests are enabled (Initial value)
Bit 2—Keyboard Buffer Register Full (KBF): Indicates that data reception has been completed and the received data is in the keyboard data buffer register (KBBR).
Bit 2 KBF 0 1 Description [Clearing condition] Read KBF when KBF =1, then write 0 in KBF [Setting conditions] • • When data has been received normally and has been transferred to KBBR (keyboard buffer register full flag) When a KCLK falling edge is detected (while KBFSEL = 0) (KCLK interrupt flag) (Initial value)
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Section 17 Keyboard Buffer Controller
Bit 1—Parity Error (PER): Indicates that an odd parity error has occurred.
Bit 1 PER 0 1 Description [Clearing condition] Read PER when PER =1, then write 0 in PER [Setting condition] When an odd parity error occurs (Initial value)
Bit 0—Keyboard Stop (KBS): Indicates the receive data stop bit. Valid only when KBF = 1.
Bit 0 KBS 0 1 Description 0 stop bit received 1 stop bit received (Initial value)
17.2.2
Bit
Keyboard Control Register L (KBCRL)
7 KBE 0 R/W 6 KCLKO 1 R/W 5 KDO 1 R/W 4 — 1 — 3 RXCR3 0 R 2 RXCR2 0 R 1 RXCR1 0 R 0 RXCR0 0 R
Initial value Read/Write
KBCRL is an 8-bit readable/writable register that enables the receive counter count and controls the keyboard buffer controller pin output. KBCRL is initialized to H'70 by a reset, and in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode. Bit 7—Keyboard Enable (KBE): Enables or disables loading of receive data into the keyboard data buffer register (KBBR).
Bit 7 KBE 0 1 Description Loading of receive data into KBBR is disabled Loading of receive data into KBBR is enabled (Initial value)
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Section 17 Keyboard Buffer Controller
Bit 6—Keyboard Clock Out (KCLKO): Controls KBC clock I/O pin output.
Bit 6 KCLKO 0 1 Description Keyboard buffer controller clock I/O pin is low Keyboard buffer controller clock I/O pin is high (Initial value)
Bit 5—Keyboard Data Out (KDO): Controls KBC data I/O pin output.
Bit 5 KDO 0 1 Description Keyboard buffer controller data I/O pin is low Keyboard buffer controller data I/O pin is high (Initial value)
Bit 4—Reserved: This bit cannot be modified and is always read as 1. Bits 3 to 0—Receive Counter (RXCR3 to RXCR0): These bits indicate the received data bit. Their value is incremented on the fall of KCLK. These bits cannot be modified. The receive counter is initialized to 0000 by a reset and when 0 is written in KBE. Its value returns to 0000 after a stop bit is received.
Bit 3 RXCR3 0 Bit 2 RXCR2 0 Bit 1 RXCR1 0 1 1 0 1 1 0 0 1 1 — Bit 0 RXCR0 0 1 0 1 0 1 0 1 0 1 0 1 — Receive Data Contents — Start bit KB0 KB1 KB2 KB3 KB4 KB5 KB6 KB7 Parity bit — — (Initial value)
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Section 17 Keyboard Buffer Controller
17.2.3
Bit
Keyboard Data Buffer Register (KBBR)
7 KB7 0 R 6 KB6 0 R 5 KB5 0 R 4 KB4 0 R 3 KB3 0 R 2 KB2 0 R 1 KB1 0 R 0 KB0 0 R
Initial value Read/Write
KBBR is a read-only register that stores receive data. Its value is valid only when KBF = 1. KBBR is initialized to H'00 by a reset, in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode, and when KBIOE is cleared to 0. 17.2.4 Module Stop Control Register (MSTPCR)
MSTPCRH Bit Initial value Read/Write
7 6 5 4 3 2 1 0 7 6 5
MSTPCRL
4 3 2 1 0
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable register, performs module stop mode control. When the MSTP2 bit is set to 1, the keyboard buffer controller halts and enters module stop mode. See section 25.5, Module Stop Mode, for details. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTPCRL Bit 2—Module Stop (MSTP2): Specifies keyboard buffer controller module stop mode.
MSTPCRL Bit 2 MSTP2 0 1 Description Keyboard buffer controller module stop mode is cleared Keyboard buffer controller module stop mode is set (Initial value)
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Section 17 Keyboard Buffer Controller
17.3
17.3.1
Operation
Receive Operation
In a receive operation, both KCLK (clock) and KD (data) are outputs on the keyboard side and inputs on the H8S/2148 Group chip (system) side. KD receives a start bit, 8 data bits (LSB-first), an odd parity bit, and a stop bit, in that order. The KD value is valid when KCLK is low. A sample receive processing flowchart is shown in figure 17.3, and the receive timing in figure 17.4.
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Section 17 Keyboard Buffer Controller
Start Set KBIOE bit Read KBCRH KCLKI and KDI bits both 1? Yes Set KBE bit Receive enabled state [4] When a stop bit is received, the keyboard buffer controller drives KCLK low to disable keyboard transmission (automatic I/O inhibit). If the KBIE bit is set to 1 in KBCRH, an interrupt request is sent to the CPU at the same time. [5] Perform receive data processing. Error handling [5] [6] Clear the KBF flag to 0 in KBCRL. At the same time, the system automatically drives KCLK high, setting the receive enabled state. The receive operation can be continued by repeating steps [3] to [6]. [3] [1] [2] No [1] Set the KBIOE bit to 1 in KBCRL. [2] Read KBCRH, and if the KCLKI and KDI bits are both 1, set the KBE bit (receive enabled state). Keyboard side in data transmission state. Execute receive abort processing. [3] Detect the start bit output on the keyboard side and receive data in synchronization with the fall of KCLK.
KBF = 1? Yes PER = 0? Yes KBS = 1? Yes Read KBBR Receive data processing
No [4]
No
No
Clear KBF flag (receive enabled state)
[6]
Figure 17.3 Sample Receive Processing Flowchart
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Section 17 Keyboard Buffer Controller
Receive processing/ error handling
KCLK (pin state) KD (pin state) KCLK (input) KCLK (output) KB7 to KB0 Previous data PER KBS KBF
Flag cleared
1
2 0
3 1
9 7
10
11
Start bit
Parity bit Stop bit
Automatic I/O inhibit
KB0 KB1
Receive data
[1] [2] [3]
[4] [5]
[6]
Figure 17.4 Receive Timing 17.3.2 Transmit Operation
In a transmit operation, KCLK (clock) is an output on the keyboard side, and KD (data) is an output on the H8S/2148 Group and H8S/2147N chip (system) side. KD outputs a start bit, 8 data bits (LSB-first), an odd parity bit, and a stop bit, in that order. The KD value is valid when KCLK is high. A sample transmit processing flowchart is shown in figure 17.5, and the transmit timing in figure 17.6.
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Section 17 Keyboard Buffer Controller
Start Set KBIOE bit Read KBCRH KCLKI and KDI bits both 1? Yes Set I/O inhibit (KCLKO = 0) KBE = 0 (KBBR reception disabled) Wait Set start bit (KDO = 0) Set I/O inhibit (KCLKO = 1) i=0 [6] No [4] KCLKO remains at 0 [5] KDO remains at 0 [1] [2] No [1] Set the KBE bit to 1 in KBCRH, and the KBIOE bit to 1 in KBCRL. [2] Read KBCRH, and if the KCLKI and KDI bits are both 1, write 0 in the KCLKO bit (set I/O inhibit). [3] Write 0 in the KBE bit (disable KBBR receive operation). [4] Write 0 in the KDO bit (set start bit). [3] [5] Write 1 in the KCLKO bit (clear I/O inhibit). [6] Read KBCRH, and when KCLKI = 0, set the transmit data in the KDO bit (LSB-first). Next, set the parity bit and stop bit in the KDO bit. [7] After transmitting the stop bit, read KBCRL and confirm that KDI = 0 (receive completed notification from the keyboard). [8] Read KBCRH. Confirm that the KCLKI and KDI bits are both 1. The transmit operation can be continued by repeating steps [2] to [8].
2 KDO remains at 1
Read KBCRH KCLKI = 0? Yes Set transmit data (KDO = D(i))
Read KBCRH KCLKI = 1? Yes i=i+1 i > 9? Yes Read KBCRH KCLKI = 1? Yes 1 No Notes: i = 0 to 7: Transmit data i = 8: Parity bit i = 9: Stop bit No No
Figure 17.5 Sample Transmit Processing Flowchart
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Section 17 Keyboard Buffer Controller
1 Read KBCRH KCLKI = 0? Yes KDI = 0? * Yes [8] Read KBCRH KCLK = 1? Yes Transmit end state (KCLK = high, KD = high) No Error handling No [7] Keyboard side in data transmission state. Execute receive abort processing. No 2
To receive operation or transmit operation Note: * To switch to reception after transmission, set KBE to 1 (KBBR receive enable) while KCLKI is low.
Figure 17.5 Sample Transmit Processing Flowchart (cont)
KCLK (pin state) KD (pin state) KCLK (output) KD (output) KCLK (input) KD (input)
Receive completed notification
1
2
8
9
10
11
Start bit
0
1
7
Parity bit Stop bit
I/O inhibit
Start bit
0
1
7
Parity bit Stop bit
[1] [2] [3]
[4] [5]
[6]
[7]
[8]
Figure 17.6 Transmit Timing
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Section 17 Keyboard Buffer Controller
17.3.3
Receive Abort
The H8S/2148 Group and H8S/2147N device (system side) can forcibly abort transmission from the device connected to it (keyboard side) in the event of a protocol error, etc. In this case, the system holds the clock low. During reception, the keyboard also outputs a clock for synchronization, and the clock is monitored when the keyboard output clock is high. If the clock is low at this time, the keyboard judges that there is an abort request from the system, and data transmission from the keyboard is aborted. Thus the system can abort reception by holding the clock low for a certain period. A sample receive abort processing flowchart is shown in figure 17.7, and the receive abort timing in figure 17.8.
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Section 17 Keyboard Buffer Controller
Start
[1] Read KBCRL, and if KBF = 1, perform processing 1. [2] Read KBCRH, and if the value of bits RXCR3 to RXCR0 is less than B'1001, write 0 in KCLKO to abort reception. If the value of bits RXCR3 to RXCR0 is B'1001 or greater, wait until stop bit reception is completed, then perform receive data processing, and proceed to the next operation. [3] If the value of bits RXCR3 to RXCR0 is B'1001 or greater, the parity bit is being received. With the PS2 interface, a receive abort request following parity bit reception is disabled. Wait until stop bit reception is completed, perform receive data processing and clear the KBF flag, then proceed to the next operation. No
Receive state Read KBCRL No
KBF = 0? Yes Read KBCRH
[1]
Processing 1
RXCR3 to RXCR0 ≥ B'1001? Yes Disable receive abort requests [3]
No
[2] KCLKO = 0 (receive abort request)
Retransmit command transmission (data)? Yes KBE = 0 (disable KBBR reception and clear receive counter) Set start bit (KDO = 0) Clear I/O inhibit (KCLKO = 1) Transmit data
KBE = 0 (disable KBBR reception and clear receive counter) KBE = 1 (enable KB operation) Clear I/O inhibit (KCLKO = 1)
To transmit operation
To receive operation
Figure 17.7 Sample Receive Abort Processing Flowchart
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Section 17 Keyboard Buffer Controller
Processing 1
Receive operation ends normally
[1]
[1] On the system side, drive the KCLK pin low, setting the I/O inhibit state.
Receive data processing
Clear KBF flag (KCLK = H)
Transmit enabled state. If there is transmit data, the data is transmitted.
Figure 17.7 Sample Receive Abort Processing Flowchart (cont)
Keyboard side monitors clock during receive operation (transmit operation as seen from keyboard), and aborts receive operation during this period. Reception in progress KCLK (pin state) KD (pin state) KCLK (input) KCLK (output) KD (input) KD (output) Receive abort request Start bit
Transmit operation
Figure 17.8 Receive Abort and Transmit Start (Transmission/Reception Switchover) Timing
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Section 17 Keyboard Buffer Controller
17.3.4
KCLKI and KDI Read Timing
Figure 17.9 shows the KCLKI and KDI read timing.
T1 T2
φ*
Internal read signal KCLK, KD (pin state) KCLKI, KDI (register) Internal data bus (read data) Note: * The φ clock shown here is scaled by 1/N in medium-speed mode when the operating mode is active mode.
Figure 17.9 KCLKI and KDI Read Timing
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Section 17 Keyboard Buffer Controller
17.3.5
KCLKO and KDO Write Timing
Figure 17.10 shows the KLCKO and KDO write timing and the KCLK and KD pin states.
T1 φ* Internal write signal KCLKO, KDO (register) KCLK, KD (pin state) Note: * The φ clock shown here is scaled by 1/N in medium-speed mode when the operating mode is active mode. T2
Figure 17.10 KCLKO and KDO Write Timing
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Section 17 Keyboard Buffer Controller
17.3.6
KBF Setting Timing and KCLK Control
Figure 17.11 shows the KBF setting timing and the KCLK pin states.
φ*
KCLK (pin) Internal KCLK Falling edge signal RXCR3 to RXCR0 KBF KCLK (output)
11th fall
H'010
H'000
Automatic I/O inhibit
Note: * The φ clock shown here is scaled by 1/N in medium-speed mode when the operating mode is active mode.
Figure 17.11 KBF Setting and KCLK Automatic I/O Inhibit Generation Timing
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Section 17 Keyboard Buffer Controller
17.3.7
Receive Timing
Figure 17.12 shows the receive timing.
φ*
KCLK (pin)
KD (pin)
Internal KCLK (KCLKI) Falling edge signal RXCR3 to RXCR0 Internal KD (KDI) KBBR7 to KBBR0 N N+1 N+2
Note: * The φ clock shown here is scaled by 1/N in medium-speed mode when the operating mode is active mode.
Figure 17.12 Receive Counter and KBBR Data Load Timing
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Section 17 Keyboard Buffer Controller
17.3.8
KCLK Fall Interrupt Operation
In this device, clearing the KBFSEL bit to 0 in KBCRH enables the KBF bit in KBCRL to be used as a flag for the interrupt generated by the fall of KCLK input. Figure 17.13 shows the setting method and an example of operation.
Start Set KBIOE KBE = 0 (KBBR reception disabled) KBFSEL = 0 KBIE = 1 (KCLK falling edge interrupts enabled)
KCLK (pin state)
KBF bit KCLK pin fall detected? Yes KBF = 1 (interrupt generated) Interrupt handling Clear KBF No
Interrupt generated
Cleared by software
Interrupt generated
Note: The KBF setting timing is the same as the timing of KBF setting and KCLK automatic I/O inhibit bit generation in figure 17.11. When the KBF bit is used as the KCLK input fall interrupt flag, the automatic I/O inhibit function does not operate.
Figure 17.13 Example of KCLK Input Fall Interrupt Operation
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Section 17 Keyboard Buffer Controller
17.3.9
Usage Note
When KBIOE is 0, the internal KCLK and internal KD settings are fixed at 1. Therefore, if the KCLK pin is low when the KBIOE bit is set to 1, the edge detection circuit operates and the KCLK falling edge is detected. If the KBFSEL bit and KBE bit are both 0 at this time, the KBF bit is set. Figure 17.14 shows the timing of KBIOE setting and KCLK falling edge detection.
T1 φ T2
KCLK (pin) Internal KCLK (KCLKI)
KBIOE
Falling edge signal
KBFSEL KBE
KBF
Figure 17.14 KBIOE Setting and KCLK Falling Edge Detection Timing
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Section 17 Keyboard Buffer Controller
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Section 18 Host Interface
Section 18 Host Interface
Provided in the H8S/2148 Group and H8S/2147N; not provided in the H8S/2144 Group.
18.1
Overview
The H8S/2148 Group and H8S/2147N have an on-chip host interface (HIF) that enables connection to an ISA bus, widely used as the internal bus in personal computers. The host interface provides a four-channel parallel interface between the on-chip CPU and a host processor. The host interface is available only when the HI12E bit is set to 1 in SYSCR2. This mode is called slave mode, because it is designed for a master-slave communication system in which the H8S/2148 Group and H8S/2147N chip is slaved to a host processor. 18.1.1 Features
The features of the host interface are summarized below. The host interface consists of 8-byte data registers, 4-byte status registers, a 2-byte control register, fast A20 gate logic, and a host interrupt request circuit. Communication is carried out via seven control signals from the host processor (CS1, CS2 or ECS2, CS3, CS4, HA0, IOR, and IOW), six output signals to the host processor (GA20, HIRQ1, HIRQ11, HIRQ12, HIRQ3, and HIRQ4), and an 8-bit bidirectional command/data bus (HDB7 to HDB0). The CS1, CS2 (or ECS2), CS3, and CS4 signals select one of the four interface channels.
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Section 18 Host Interface
18.1.2
Block Diagram
Figure 18.1 shows a block diagram of the host interface.
Internal interrupt signals IBF4 IBF3 IBF2 IBF1 HDB7 to HDB0 IDR1 ODR1 Control logic STR1 IDR2 ODR2 STR2
Host data bus
CS1 CS2/ECS2 CS3 CS4 IOR IOW HA0
Host interrupt request
Fast A20 gate control
HICR IDR3 ODR3 STR3
HIRQ1 HIRQ11 HIRQ12 HIRQ3 HIRQ4 GA20 HIFSD
IDR4 Port 4, port 8, port B ODR4 STR4 HICR2
Internal data bus Legend: IDR1: Input data register 1 IDR2: Input data register 2 ODR1: Output data register 1 ODR2: Output data register 2 STR1: Status register 1 STR2: Status register 2 HICR: Host interface control register 1
Bus interface
IDR3: IDR4: ODR3: ODR4: STR3: STR4: HICR2:
Input data register 3 Input data register 4 Output data register 3 Output data register 4 Status register 3 Status register 4 Host interface control register 2
Figure 18.1 Block Diagram of Host Interface
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Module data bus
Section 18 Host Interface
18.1.3
Input and Output Pins
Table 18.1 lists the input and output pins of the host interface module. Table 18.1
Name I/O read I/O write Chip select 1 Chip select 2* Chip select 3 Chip select 4 Command/data
Host Interface Input/Output Pins
Abbreviation IOR IOW CS1 CS2 ECS2 CS3 CS4 HA0 Port P93 P94 P95 P81 P90 PB2 PB3 P80 Input Input Input I/O Input Input Input Input Function Host interface read signal Host interface write signal Host interface chip select signal for IDR1, ODR1, STR1 Host interface chip select signal for IDR2, ODR2, STR2 Host interface chip select signal for IDR3, ODR3, STR3 Host interface chip select signal for IDR4, ODR4, STR4 Host interface address select signal. In host read access, this signal selects the status registers (STR1 to STR4) or data registers (ODR1 to ODR4). In host write access to the data registers (IDR1 to IDR3, and IDTR4), this signal indicates whether the host is writing a command or data.
Data bus Host interrupt 1 Host interrupt 11 Host interrupt 12 Host interrupt 3 Host interrupt 4 Gate A20 HIF shutdown Note: *
HDB7 to HDB0 P37 to I/O P30 HIRQ1 HIRQ11 HIRQ12 HIRQ3 HIRQ4 GA20 HIFSD P44 P43 P45 PB0 PB1 P81 P82 Output Output Output Output Output Output Input
Host interface data bus Interrupt output 1 to host Interrupt output 11 to host Interrupt output 12 to host Interrupt output 3 to host Interrupt output 4 to host A20 gate control signal output Host interface shutdown control signal
Selection of CS2 or ECS2 is by means of the CS2E bit in STCR and the FGA20E bit in HICR. Host interface channel 2 and the CS2 pin can be used when CS2E = 1. When CS2E = 1, CS2 is used when FGA20E =0, and ECS2 is used when FGA20E = 1. In this manual, both are referred to as CS2.
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Section 18 Host Interface
18.1.4
Register Configuration
Table 18.2 lists the host interface registers. Host interface registers HICR, IDR1, IDR2, ODR1, ODR2, STR1, and STR2 can only be accessed when the HIE bit is set to 1 in SYSCR. Table 18.2 Host Interface Registers
Abbreviation SYSCR R/W Slave R/W* R/W R/W R/W R R/W
1
Name System control register
Host — — — — W R
Initial Slave Value Address*3 CS1 H'09 H'00 H'F8 H'F8 — — H'00 — — H'00 — — H'00 — — H'00 H'3F H'FF H'FFC4 H'FF83 H'FFF0 H'FE80 H'FFF4 H'FFF5 H'FFF6 H'FFFC — — — — 0 0 0 1 1 1 1 1 1 1 1 1 — —
Master Address*4 CS2 — — — — 1 1 1 0 0 0 1 1 1 1 1 1 — — CS3 CS4 HA0 — — — — 0/1*5 0 1 0/1*5 0 1 0/1*5 0 1 0/1*5 0 1 — —
— — — — 1
1 1 1 1 1 0 0 0 1 1 1 — —
— — — — 1
1 1 1 1 1 1 1 1 0 0 0 — —
System control register 2 SYSCR2 Host interface control register 1 Host interface control register 2 Input data register 1 Output data register 1 Status register 1 Input data register 2 Output data register 2 Status register 2 Input data register 3 Output data register 3 Status register 3 Input data register 4 Output data register 4 Status register 4 Module stop control register HICR HICR2 IDR1 ODR1 STR1 IDR2 ODR2 STR2 IDR3 ODR3 STR3 IDR4 ODR4 STR4 MSTPCRH MSTPCRL
R/(W)*2 R R R/W R/(W)* R R/W
2
W R R W R
H'FFFD H'FFFE H'FE84 H'FE85 H'FE86 H'FE8C H'FE8D H'FE8E H'FF86
H'FF87
R/(W)*2 R R R/W R/(W)* R/W R/W
2
W R R — —
Notes: 1. Bits 5 and 3 are read-only bits. 2. The user-defined bits (bits 7 to 4 and 2) are read/write accessible from the slave processor. 3. Address when accessed from the slave processor. The lower 16 bits of the address are shown. 4. Pin inputs used in access from the host processor. 5. The HA0 input discriminates between writing of commands and data.
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Section 18 Host Interface
18.2
18.2.1
Bit
Register Descriptions
System Control Register (SYSCR)
7 CS2E 0 R/W 6 IOSE 0 R/W 5 INTM1 0 R 4 INTM0 0 R/W 3 XRST 1 R 2 NMIEG 0 R/W 1 HIE 0 R/W 0 RAME 1 R/W
Initial value Read/Write
SYSCR is an 8-bit readable/writable register which controls H8S/2148 Group chip operations. Of the host interface registers, HICR, IDR1, ODR1, STR1, IDR2, ODR2, and STR2 can only be accessed when the HIE bit is set to 1. HICR2, IDR3, ODR3, STR3, IDR4, ODR4, and STR4 can be accessed regardless of the setting of the HIE bit. The host interface CS2 and ECS2 pins are controlled by the CS2E bit in SYSCR and the FGA20E bit in HICR. See section 3.2.2, System Control Register (SYSCR), and section 5.2.1, System Control Register (SYSCR), for information on other SYSCR bits. SYSCR is initialized to H'09 by a reset and in hardware standby mode. Bit 7—CS2 Enable Bit (CS2E): Used together with the FGA20E bit in HICR to select the pin that performs the CS2 function.
SYSCR Bit 7 CS2E 0 1 HICR Bit 0 FGA20E 0 1 0 1 CS2 pin function selected for P81/CS2 pin CS2 pin function selected for P90/ECS2 pin Description CS2 pin function halted (CS2 fixed high internally) (Initial value)
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Section 18 Host Interface
Bit 1—Host Interface Enable (HIE): Enables or disables CPU access to the host interface registers. When enabled, the host interface registers (HICR, IDR1, ODR1, STR1, IDR2, ODR2, and STR2) can be accessed.
Bit 1 HIE 0 1 Description Host interface register (HICR, IDR1, ODR1, STR1, IDR2, ODR2, STR2), CPU access is disabled (Initial value) Host interface register (HICR, IDR1, ODR1, STR1, IDR2, ODR2, STR2), CPU access is enabled
18.2.2
Bit
System Control Register 2 (SYSCR2)
7 KWUL1 0 R/W 6 KWUL0 0 R/W 5 P6PUE 0 R/W 4 — 0 — 3 SDE 0 R/W 2 CS4E 0 R/W 1 CS3E 0 R/W 0 HI12E 0 R/W
Initial value Read/Write
SYSCR2 is an 8-bit readable/writable register which controls chip operations. Host interface functions are enabled or disabled by the HI12E bit in SYSCR2. The number of channels that can be used can be extended to a maximum of four by means of the CS3E bit and CS4E bit. SYSCR2 is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6—Key Wakeup Level 1 and 0 (KWUL1, KWUL0): The port 6 input level can be set and changed by software. For details see section 8, I/O Ports. Bit 5—Port 6 Input Pull-Up Extra (P6PUE): Controls and selects the current specification for the port 6 MOS input pull-up function connected by means of KMPCR settings. For details see section 8, I/O Ports. Bit 4—Reserved: Do not write 1 to this bit.
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Section 18 Host Interface
Bit 3—Shutdown Enable (SDE): Enables or disables the host interface pin shutdown function. When this function is enabled, host interface pin functions can be halted, and the pins placed in the high-impedance state, according to the state of the HIFSD pin.
Bit 3 SDE 0 1 Description Host interface pin shutdown function disabled Host interface pin shutdown function enabled (Initial value)
Bit 2—CS4 Enable (CS4E): Enables or disables host interface channel 4 functions in slave mode. When these functions are enabled, channel 4 pins are enabled and processing can be performed for data transfer between the slave and the host.
Bit 2 CS4E 0 1 Description Host interface pin channel 4 functions disabled Host interface pin channel 4 functions enabled (Initial value)
Bit 1—CS3 Enable (CS3E): Enables or disables host interface channel 3 functions in slave mode. When these functions are enabled, channel 3 pins are enabled and processing can be performed for data transfer between the slave and the host.
Bit 1 CS3E 0 1 Description Host interface pin channel 3 functions disabled Host interface pin channel 3 functions enabled (Initial value)
Bit 0—Host Interface Enable Bit (HI12E): Enables or disables host interface functions in single-chip mode. When the host interface functions are enabled, slave mode is entered and processing is performed for data transfer between the slave and host.
Bit 0 HI12E 0 1 Description Host interface functions are disabled Host interface functions are enabled (Initial value)
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Section 18 Host Interface
18.2.3 • HICR
Bit
Host Interface Control Register (HICR)
7 — 1 — —
6 — 1 — —
5 — 1 — —
4 — 1 — —
3 — 1 — —
2 IBFIE2 0 R/W —
1 0 R/W —
0 0 R/W —
IBFIE1 FGA20E
Initial value Slave Read/Write Host Read/Write
• HICR2
Bit Initial value Slave Read/Write Host Read/Write 7 — 1 — — 6 — 1 — — 5 — 1 — — 4 — 1 — — 3 — 1 — — 2 IBFIE4 0 R/W — 1 IBFIE3 0 R/W — 0 — 0 — —
HICR is an 8-bit readable/writable register which controls host interface channel 1 and 2 interrupts and the fast A20 gate function. HICR2 is an 8-bit readable/writable register which controls host interface channel 3 and 4 interrupts. HICR and HICR2 are initialized to H'F8 by a reset and in hardware standby mode. Bits 7 to 3—Reserved: These bits cannot be modified and are always read as 1. HICR Bits 2 and 1—Input Data Register Full Interrupt Enable 2 and 1 (IBFIE2, IBFIE1) HICR2 Bits 2 and 1—Input Data Register Full Interrupt Enable 4 and 3 (IBFIE4, IBFIE3) These bits enable or disable the IBF1, IBF2, IBF3, and IBF4 interrupts to the internal CPU.
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Section 18 Host Interface HICR2 Bit 2 IBFIE4 — — — — — — 0 1 HICR2 Bit 1 IBFIE3 — — — — 0 1 — — HICR Bit 2 IBFIE2 — — 0 1 — — — — HICR Bit 1 IBFIE1 0 1 — — — — — — Description Input data register (IDR1) reception completed interrupt request disabled (Initial value) Input data register (IDR1) reception completed interrupt request enabled Input data register (IDR2) reception completed interrupt request disabled (Initial value) Input data register (IDR2) reception completed interrupt request enabled Input data register (IDR3) reception completed interrupt request disabled (Initial value) Input data register (IDR3) reception completed interrupt request enabled Input data register (IDR4) reception completed interrupt request disabled (Initial value) Input data register (IDR4) reception completed interrupt request enabled
HICR Bit 0—Fast A20 Gate Function Enable (FGA20E): Enables or disables the fast A20 gate function. When the fast A20 gate is disabled, the normal A20 gate can be implemented byte firmware operation of the P81 output.
HICR Bit 0 FGA20E 0 1 Description Fast A20 gate function disabled Fast A20 gate function enabled (Initial value)
HICR2 Bit 0—Reserved: Do not set this bit to 1.
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Section 18 Host Interface
18.2.4
Bit
Input Data Register 1 (IDR1)
7 IDR7 — R W 6 IDR6 — R W 5 IDR5 — R W 4 IDR4 — R W 3 IDR3 — R W 2 IDR2 — R W 1 IDR1 — R W 0 IDR0 — R W
Initial value Slave Read/Write Host Read/Write
IDR1 is an 8-bit read-only register to the slave processor, and an 8-bit write-only register to the host processor. When CSn (n = 1 to 4) is low, information on the host data bus is written into IDRn at the rising edge of IOW. The HA0 state is also latched into the C/D bit in STRn to indicate whether the written information is a command or data. The initial values of IDR1 after a reset and in standby mode are undetermined. 18.2.5
Bit Initial value Slave Read/Write Host Read/Write
Output Data Register 1 (ODR)
7 ODR7 — R/W R 6 ODR6 — R/W R 5 ODR5 — R/W R 4 ODR4 — R/W R 3 ODR3 — R/W R 2 ODR2 — R/W R 1 ODR1 — R/W R 0 ODR0 — R/W R
ODR1 is an 8-bit readable/writable register to the slave processor, and an 8-bit read-only register to the host processor. The ODRn contents are output on the host data bus when HA0 is low, CSn (n = 1 to 4) is low, and IOR is low. The initial values of ODR1 after a reset and in standby mode are undetermined.
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Section 18 Host Interface
18.2.6
Bit
Status Register (STR)
7 DBU 0 R/W R 6 DBU 0 R/W R 5 DBU 0 R/W R 4 DBU 0 R/W R 3 C/D 0 R R 2 DBU 0 R/W R 1 IBF 0 R R 0 OBF 0 R/(W)* R
Initial value Slave Read/Write Host Read/Write
Note: * Only 0 can be written, to clear the flag.
STRn (n = 1 to 4) is an 8-bit register that indicates status information during host interface processing. Bits 3, 1, and 0 are read-only bits to both the host and slave processors. STR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 4 and Bit 2—Defined by User (DBU): The user can use these bits as necessary. Bit 3—Command/Data (C/D): Receives the HA0 input when the host processor writes to IDR1, and indicates whether IDR1 contains data or a command.
Bit 3 C/D 0 1 Description Contents of input data register (IDR1) are data Contents of input data register (IDR1) are a command (Initial value)
Bit 1—Input Buffer Full (IBF): Set to 1 when the host processor writes to IDR1. This bit is an internal interrupt source to the slave processor. IBF is cleared to 0 when the slave processor reads IDR1. The IBF flag setting and clearing conditions are different when the fast A20 gate is used. For details see table 18.7.
Bit 1 IBF 0 1 Description [Clearing condition] When the slave processor reads IDR [Setting condition] When the host processor writes to IDR (Initial value)
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Section 18 Host Interface
Bit 0—Output Buffer Full (OBF): Set to 1 when the slave processor writes to ODR1. Cleared to 0 when the host processor reads ODR.
Bit 0 OBF 0 1 Description [Clearing condition] When the host processor reads ODR or the slave writes 0 in the OBF bit (Initial value) [Setting condition] When the slave processor writes to ODR
Table 18.3 shows the conditions for setting and clearing the STR flags. Table 18.3 Set/Clear Timing for STR Flags
Flag C/D IBF* OBF Note: * Setting Condition Rising edge of host’s write signal (IOW) when HA0 is high Rising edge of host’s write signal (IOW) when writing to IDR1 Clearing Condition Rising edge of host’s write signal (IOW) when HA0 is low Falling edge of slave’s internal read signal (RD) when reading IDR1
Falling edge of slave’s internal write Rising edge of host’s read signal (IOR) when signal (WR) when writing to ODR1 reading ODR1 The IBF flag setting and clearing conditions are different when the fast A20 gate is used. For details see table 18.7.
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Section 18 Host Interface
18.2.7
Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
2 1 0 7 6 5 4 3 2 1 0
Bit Initial value Read/Write
7
6
5
4
3
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control. When the MSTP2 bit is set to 1, the host interface halts and enters module stop mode. See section 25.5, Module Stop Mode, for details. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTPCRL Bit 2—Module Stop (MSTP2): Specifies host interface module stop mode.
MSTPCRL Bit 2 MSTP2 0 1 Description Host interface module stop mode is cleared Host interface module stop mode is set (Initial value)
18.3
18.3.1
Operation
Host Interface Activation
The HIF (slave mode) is activated by setting the HI12E bit (bit 0) in SYSCR2 to 1 in single-chip mode. When the HIF (slave mode) is activated, all related I/O ports (data port 3, control ports 8 and 9, and host interrupt request port 4) become dedicated host interface ports. Setting the CS3E bit and CS4E bit to 1 enables the number of HIF channels to be extended to a four, and makes the channel 3 and 4 related I/O port (part of port B for control and host interrupt requests) a dedicated host interface port. Table 18.4 shows HIF host interface channel selection and pin operation.
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Section 18 Host Interface
Table 18.4 Host Interface Channel Selection and Pin Operation
HI12E 0 1 CS2E — 0 CS3E — 0 CS4E — 0 Operation Host interface functions halted Host interface channel 1 only operating Operation of channels 2 to 4 halted (No operation as CS2 or ECS2, CS3, and CS4 inputs. Pins P43, P81, P90, and PB0 to PB3 operate as I/O ports.) 1 Host interface channel 1 and 4 functions operating Operation of channels 2 and 3 halted (No operation as CS2 or ECS2 and CS3 inputs. Pins P43, P81, P90, PB0, and PB2 operate as I/O ports.) 1 0 Host interface channel 1 and 3 functions operating Operation of channels 2 and 4 halted (No operation as CS2 or ECS2 and CS4 inputs. Pins P43, P81, P90, PB1, and PB3 operate as I/O ports.) 1 Host interface channel 1, 3, and 4 functions operating Operation of channel 2 halted (No operation as CS2 or ECS2 input. Pins P43, P81, and P90 operate as I/O ports.) 1 0 0 Host interface channel 1 and 2 functions operating Operation of channels 3 and 4 halted (No operation as CS3 and CS4 inputs. Pins PB0 to PB3 operate as I/O ports.) 1 Host interface channel 1, 2, and 4 functions operating Operation of channel 3 halted (No operation as CS3 input. Pins PB0 and PB2 operate as I/O ports.) 1 0 Host interface channel 1 to 3 functions operating Operation of channel 4 halted (No operation as CS4 input. Pins PB1 and PB3 operate as I/O ports.) 1 Host interface channel 1 to 4 functions operating
For host read/write timing, see section 26.7.5, Timing of On-Chip Supporting Modules.
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Section 18 Host Interface
18.3.2
Control States
Table 18.5 shows host interface operations from the HIF host, and slave operation. Table 18.5 Host Interface Operations from HIF Host, and Slave Operation
Other than CSn 1 CSn 0 IOR 0 IOW 0 1 1 0 1 Note: n = 1 to 4 HA0 0 1 0 1 0 1 0 1 Operation Setting prohibited Setting prohibited Data read from output data register n (ODRn) Status read from status register n (STRn) Data written to input data register n (IDRn) Command written to input data register n (IDRn) Idle state Idle state
18.3.3
A20 Gate
The A20 gate signal can mask address A20 to emulate an addressing mode used by personal computers with an 8086*-family CPU. In slave mode, a regular-speed A20 gate signal can be output under firmware control. Fast A20 gate output is enabled by setting the FGA20E bit (bit 0) to 1 in HICR (H'FFF0). Note: * Intel microprocessor. Regular A20 Gate Operation Output of the A20 gate signal can be controlled by an H'D1 command followed by data. When the slave processor receives data, it normally uses an interrupt routine activated by the IBF1 interrupt to read IDR1. If the data follows an H'D1 command, software copies bit 1 of the data and outputs it at the gate A20 pin. Fast A20 Gate Operation When the FGA20E bit is set to 1, P81/GA20 is used for output of a fast A20 gate signal. Bit P81DDR must be set to 1 to assign this pin for output. The initial output from this pin will be a logic 1, which is the initial value. Afterward, the host processor can manipulate the output from
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Section 18 Host Interface
this pin by sending commands and data. This function is available only when register IDR1 is accessed using CS1. Slave logic decodes the commands input from the host processor. When an H'D1 host command is detected, bit 1 of the data following the host command is output from the GA20 output pin. This operation does not depend on firmware or interrupts, and is faster than the regular processing using interrupts. Table 18.6 lists the conditions that set and clear GA20 (P81). Figure 18.2 shows the GA20 output in flowchart form. Table 18.7 indicates the GA20 output signal values. Table 18.6 GA20 (P81) Set/Clear Timing
Pin Name GA20 (P81) Setting Condition Rising edge of the host’s write signal (IOW) when bit 1 of the written data is 1 and the data follows an H'D1 host command Clearing Condition Rising edge of the host’s write signal (IOW) when bit 1 of the written data is 0 and the data follows an H'D1 host command Also, when bit FGA20E in HICR is cleared to 0
Start
Host write No H'D1 command received? Yes Wait for next byte Host write No
Data byte? Yes Write bit 1 of data byte to DR bit of P81/GA20
Figure 18.2 GA20 Output
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Section 18 Host Interface
Table 18.7 Fast A20 Gate Output Signal
HA0 1 0 1 1 0 1 1 0 1/0 1 0 1/0 1 1 1 1 1 0 1 Data/Command H'D1 command 1 1 data* H'FF command H'D1 command 2 0 data* H'FF command H'D1 command 1 1 data* Command other than H'FF and H'D1 H'D1 command 2 0 data* Command other than H'FF and H'D1 H'D1 command Command other than H'D1 H'D1 command H'D1 command H'D1 command Any data H'D1 command Internal CPU Interrupt Flag 0 0 0 0 0 0 0 0 1 0 0 1 0 1 0 0 0 0 0 GA20 (P81) Q 1 Q (1) Q 0 Q (0) Q 1 Q (1) Q 0 Q (0) Q Q Q Q Q 1/0 Q(1/0) Remarks Turn-on sequence
Turn-off sequence
Turn-on sequence (abbreviated form)
Turn-off sequence (abbreviated form)
Cancelled sequence Retriggered sequence Consecutively executed sequences
Notes: 1. Arbitrary data with bit 1 set to 1. 2. Arbitrary data with bit 1 cleared to 0.
18.3.4
Host Interface Pin Shutdown Function
Host interface output can be placed in the high-impedance state according to the state of the HIFSD pin. Setting the SDE bit to 1 in the SYSCR2 register enables the HIFSD pin is slave mode. The HIF constantly monitors the HIFSD pin, and when this pin goes low, places the host interface output pins (HIRQ1, HIRQ11, HIRQ12, HIRQ3, HIRQ4, and GA20) in the high-impedance state. At the same time, the host interface input pins (CS1, CS2 or ECS2, CS3, CS4, IOW, IOR, and HA0) are disabled (fixed at the high input state internally) regardless of the pin states, and the signals of the multiplexed functions of these pins (input block) are similarly fixed internally. As a result, the host interface I/O pins (HDB7 to HDB0) also go to the high-impedance state. This state is maintained while the HIFSD pin is low, and when the HIFSD pin returns to the highlevel state, the pins are restored to their normal operation as host interface pins.
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Section 18 Host Interface
Table 18.8 shows the scope of HIF pin shutdown in slave mode. Table 18.8 Scope of HIF Pin Shutdown in Slave Mode
Scope of Shutdown in Slave Mode I/O O O O ∆ ∆ ∆ ∆ O O ∆ ∆ ∆ ∆ ∆ ∆ — Input Input Input Input Input Input Input Input I/O Output Output Output Output Output Output Input
Abbreviation IOR IOW CS1 CS2 ECS2 CS3 CS4 HA0 HDB7 to HDB0 HIRQ11 HIRQ1 HIRQ12 HIRQ3 HIRQ4 GA20 HIFSD
Port P93 P94 P95 P81 P90 PB2 PB3 P80 P37 to P30 P43 P44 P45 PB0 PB1 P81 P82
Selection Conditions Slave mode Slave mode Slave mode Slave mode and CS2E = 1 and FGA20E = 0 Slave mode and CS2E = 1 and FGA20E = 1 Slave mode and CS3E = 1 Slave mode and CS4E = 1 Slave mode Slave mode Slave mode and CS2E = 1 and P43DDR = 1 Slave mode and P44DDR = 1 Slave mode and P45DDR = 1 Slave mode and CS3E = 1 and PB0DDR = 1 Slave mode and CS4E = 1 and PB1DDR = 1 Slave mode and FGA20E = 1 Slave mode and SDE = 1
Legend: O: Pins shut down by shutdown function The IRQ2/ADTRG input signal is also fixed in the case of P90 shutdown, the TMCI1/HSYNCI signal in the case of P43 shutdown, and the TMRI/CSYNCI in the case of P45 shutdown. ∆: Pins shut down only when the HIF function is selected by means of a register setting —: Pin not shut down Note: Slave mode: Single-chip mode and HI12E = 1
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Section 18 Host Interface
18.4
18.4.1
Interrupts
IBF1, IBF2, IBF3, IBF4
The host interface can issue two interrupt requests to the slave CPU: IBF1, IBF2, IBF3, and IBF4. They are input buffer full interrupts for input data registers IDR1, IDR2, IDR3, and IDR4 respectively. Each interrupt is enabled when the corresponding enable bit is set. Table 18.9 Input Buffer Full Interrupts
Interrupt IBF1 IBF2 IBF3 IBF4 Description Requested when IBFIE1 is set to 1 and IDR1 is full Requested when IBFIE2 is set to 1 and IDR2 is full Requested when IBFIE3 is set to 1 and IDR3 is full Requested when IBFIE4 is set to 1 and IDR4 is full
18.4.2
HIRQ11, HIRQ1, HIRQ12, HIRQ3, and HIRQ4
In slave mode (single-chip mode, with HI12E = 1 in SYSCR2), bits P45DR to P43DR in the port 4 data register (P4DR) and bits PB1ODR and PB0ODR in the port B data register (PBODR) can be used as host interrupt request latches The corresponding bits in P4DR are cleared to 0 by the host processor’s read signal (IOR). If CS1 and HA0 are low, when IOR goes low and the host reads ODR1, HIRQ1 and HIRQ12 are cleared to 0. If CS2 and HA0 are low, when IOR goes low and the host reads ODR2, HIRQ11 is cleared to 0. The corresponding bit in PBODR is cleared to 0 by the host’s read signal (IOR). If CS3 and HA0 are low, when IOR goes low and the host reads ODR3, HIRQ3 is cleared to 0. If CS4 and HA0 are low, when IOR goes low and the host reads ODR4, HIRQ4 is cleared to 0. To generate a host interrupt request, normally on-chip firmware writes 1 in the corresponding bit. In processing the interrupt, the host’s interrupt handling routine reads the output data register (ODR1, ODR2, ODR3, or ODR4) and this clears the host interrupt latch to 0. Table 18.10 indicates how these bits are set and cleared. Figure 18.3 shows the processing in flowchart form.
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Section 18 Host Interface
Table 18.10 HIRQ Setting/Clearing Conditions
Host Interrupt Signal HIRQ11 (P43) HIRQ1 (P44) HIRQ12 (P45) HIRQ3 (PB0) HIRQ4 (PB1) Setting Condition Internal CPU reads 0 from bit P43DR, then writes 1 Internal CPU reads 0 from bit P44DR, then writes 1 Internal CPU reads 0 from bit P45DR, then writes 1 Internal CPU reads 0 from bit PB0ODR, then writes 1 Internal CPU reads 0 from bit PB1ODR, then writes 1 Clearing Condition Internal CPU writes 0 in bit P43DR, or host reads output data register 2 Internal CPU writes 0 in bit P44DR, or host reads output data register 1 Internal CPU writes 0 in bit P45DR, or host reads output data register 1 Internal CPU writes 0 in bit PB0ODR, or host reads output data register 3 Internal CPU writes 0 in bit PB1ODR, or host reads output data register 4
Slave CPU
Master CPU
Write to ODR Write 1 to P4DR HIRQ output high HIRQ output low P4DR = 0? Yes All bytes transferred? Yes Interrupt initiation ODR read
No
No
Hardware operations Software operations
Figure 18.3 HIRQ Output Flowchart (Example of Channels 1 and 2)
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Section 18 Host Interface
HIRQ Setting/Clearing Contention If there is contention between a P4DR or PBODR read/write by the CPU and P4DR (HIRQ11, HIRQ1, HIRQ12) or PBODR (HIRQ3, HIRQ4) clearing by the host, clearing by the host is held pending during the P4DR or PBODR read/write by the CPU. P4DR or PBODR clearing is executed after completion of the read/write.
18.5
Usage Note
The following points require attention when using the host interface. (1) Host and slave transmission/reception procedures The host interface provides buffering of asynchronous data from the host and slave processors, but an interface protocol must be followed to implement necessary functions and avoid data contention. For example, if the host and slave processors try to access the same input or output data register simultaneously, the data will be corrupted. Interrupts can be used to design a simple and effective protocol. (2) Preventing data contention on the HDB When the HIF function is used (HI12E = 1 in SYSCR2) and channel 3 or channel 4 has been set as deselected (CS3E = 0 or CS4E = 0 in SYSCR2), apply either of the following usage conditions. 1. Ensure that the CS pin for the deselected channel is fixed high. 2. Do not perform port B reads. (3) Preventing through-current in pins CS1 to CS4 Also, if two or more of pins CS1 to CS4 are driven low simultaneously in attempting IDR or ODR access, signal contention will occur within the chip, and a through-current may result. This usage must therefore be avoided.
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Section 18 Host Interface
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Section 19 D/A Converter
Section 19 D/A Converter
19.1 Overview
This LSI have an on-chip D/A converter module with two channels. 19.1.1 Features
Features of the D/A converter module are listed below. • Eight-bit resolution • Two-channel output • Maximum conversion time: 10 µs (with 20-pF load capacitance) • Output voltage: 0 V to AVref • D/A output retention in software standby mode
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Section 19 D/A Converter
19.1.2
Block Diagram
Figure 19.1 shows a block diagram of the D/A converter.
Module data bus
Bus interface
Internal data bus
AVref AVCC
DADR0
DADR1
DA0 DA1 AVSS
8-bit D/A
Control circuit Legend: DACR: D/A control register DADR0: D/A data register 0 DADR1: D/A data register 1
Figure 19.1 Block Diagram of D/A Converter
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DACR
Section 19 D/A Converter
19.1.3
Input and Output Pins
Table 19.1 lists the input and output pins used by the D/A converter module. Table 19.1 Input and Output Pins of D/A Converter Module
Name Analog supply voltage Analog ground Analog output 0 Analog output 1 Reference voltage pin Abbreviation AVCC AVSS DA0 DA1 AVref I/O Input Input Output Output Input Function Power supply for analog circuits Ground and reference voltage for analog circuits Analog output channel 0 Analog output channel 1 Reference voltage for analog circuits
19.1.4
Register Configuration
Table 19.2 lists the registers of the D/A converter module. Table 19.2 D/A Converter Registers
Name D/A data register 0 D/A data register 1 D/A control register Module stop control register Note: * Abbreviation DADR0 DADR1 DACR MSTPCRH MSTPCRL R/W R/W R/W R/W R/W R/W Initial Value H'00 H'00 H'1F H'3F H'FF Address* H'FFF8 H'FFF9 H'FFFA H'FF86 H'FF87
Lower 16 bits of the address.
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Section 19 D/A Converter
19.2
19.2.1
Bit
Register Descriptions
D/A Data Registers 0 and 1 (DADR0, DADR1)
7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Initial value Read/Write
D/A data registers 0 and 1 (DADR0 and DADR1) are 8-bit readable/writable registers that store data to be converted. When analog output is enabled, the value in the D/A data register is converted and output continuously at the analog output pin. The D/A data registers are initialized to H'00 by a reset and in hardware standby mode. 19.2.2
Bit Initial value Read/Write
D/A Control Register (DACR)
7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 — 1 — 3 — 1 — 2 — 1 — 1 — 1 — 0 — 1 —
DACR is an 8-bit readable/writable register that controls the operation of the D/A converter module. DACR is initialized to H'1F by a reset and in hardware standby mode. Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7 DAOE1 0 1 Description Analog output DA1 is disabled D/A conversion is enabled on channel 1. Analog output DA1 is enabled (Initial value)
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Section 19 D/A Converter
Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6 DAOE0 0 1 Description Analog output DA0 is disabled D/A conversion is enabled on channel 0. Analog output DA0 is enabled (Initial value)
Bit 5—D/A Enable (DAE): Controls D/A conversion, in combination with bits DAOE0 and DAOE1. D/A conversion is controlled independently on channels 0 and 1 when DAE = 0. Channels 0 and 1 are controlled together when DAE = 1. Output of the converted results is always controlled independently by DAOE0 and DAOE1.
Bit 7 DAOE1 0 Bit 6 DAOE0 0 1 Bit 5 DAE * 0 1 1 0 0 1 1 Legend: *: Don’t care * D/A conversion Disabled on channels 0 and 1 Enabled on channel 0 Disabled on channel 1 Enabled on channels 0 and 1 Disabled on channel 0 Enabled on channel 1 Enabled on channels 0 and 1 Enabled on channels 0 and 1
If the chip enters software standby mode while D/A conversion is enabled, the D/A output is retained and the analog power supply current is the same as during D/A conversion. If it is necessary to reduce the analog power supply current in software standby mode, disable D/A output by clearing the DAOE0, DAOE1, and DAE bits to 0. Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
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Section 19 D/A Converter
19.2.3
Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
2 1 0 7 6 5 4 3 2 1 0
Bit Initial value Read/Write
7
6
5
4
3
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control. When the MSTP10 bit is set to 1, the D/A converter halts and enters module stop mode at the end of the bus cycle. See section 25.5, Module Stop Mode, for details. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTPCRH Bit 2—Module Stop (MSTP10): Specifies D/A converter module stop mode.
MSTPCRH Bit 2 MSTP10 0 1 Description D/A converter module stop mode is cleared D/A converter module stop mode is set (Initial value)
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Section 19 D/A Converter
19.3
Operation
The D/A converter module has two built-in D/A converter circuits that can operate independently. D/A conversion is performed continuously whenever enabled by the D/A control register (DACR). When a new value is written in DADR0 or DADR1, conversion of the new value begins immediately. The converted result is output by setting the DAOE0 or DAOE1 bit to 1. An example of conversion on channel 0 is given next. Figure 19.2 shows the timing. • Software writes the data to be converted in DADR0. • D/A conversion begins when the DAOE0 bit in DACR is set to 1. After the elapse of the conversion time, analog output appears at the DA0 pin. The output value is AVref × (DADR value)/256. This output continues until a new value is written in DADR0 or the DAOE0 bit is cleared to 0. • If a new value is written in DADR0, conversion begins immediately. Output of the converted result begins after the conversion time. • When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle
φ
Address
DADR0
Conversion data (1)
Conversion data (2)
DAOE0
DA0 High-impedance state t DCONV
Conversion result (1)
Conversion result (2) t DCONV
Legend: t DCONV: D/A conversion time
Figure 19.2 D/A Conversion (Example)
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Section 19 D/A Converter
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Section 20 A/D Converter
Section 20 A/D Converter
20.1 Overview
This LSI incorporate a 10-bit successive-approximations A/D converter that allows up to eight analog input channels to be selected. In addition to the eight analog input channels, up to 16 channels of digital input can be selected for A/D conversion. Since the conversion precision falls when digital input is selected, digital input is ideal for use by a comparator identifying multi-valued inputs, for example. 20.1.1 Features
A/D converter features are listed below. • 10-bit resolution • Eight (analog) or 16 (digital) input channels • Settable analog conversion voltage range The analog conversion voltage range is set using the reference power supply voltage pin (AVref) as the analog reference voltage • High-speed conversion Minimum conversion time: 6.7 µs per channel (at 20-MHz operation) • Choice of single mode or scan mode Single mode: Single-channel A/D conversion Scan mode: • Four data registers Conversion results are held in a 16-bit data register for each channel • Sample and hold function • Three kinds of conversion start Choice of software or timer conversion start trigger (8-bit timer), or ADTRG pin • A/D conversion end interrupt generation An A/D conversion end interrupt (ADI) request can be generated at the end of A/D conversion Continuous A/D conversion on 1 to 4 channels
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Section 20 A/D Converter
20.1.2
Block Diagram
Figure 20.1 shows a block diagram of the A/D converter.
Module data bus Bus interface ADDRC ADDRD ADDRA ADDRB ADCSR + Multiplexer – Comparator Sample-andhold circuit Control circuit ADCR
Internal data bus
AVCC AVref AVSS 10-bit D/A
AN0 AN1 AN2 AN3 AN4 AN5 AN6/CIN0 to CIN7 AN7/CIN8 to CIN15
Successive approximations register
φ/8
φ/16
ADI interrupt signal ADTRG Conversion start trigger from 8-bit timer A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D
Legend: ADCR: ADCSR: ADDRA: ADDRB: ADDRC: ADDRD:
Figure 20.1 Block Diagram of A/D Converter
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Section 20 A/D Converter
20.1.3
Pin Configuration
Table 20.1 summarizes the input pins used by the A/D converter. The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. Table 20.1 A/D Converter Pins
Pin Name Analog power supply pin Analog ground pin Reference power supply pin Analog input pin 0 Analog input pin 1 Analog input pin 2 Analog input pin 3 Analog input pin 4 Analog input pin 5 Analog input pin 6 Analog input pin 7 A/D external trigger input pin Expansion A/D input pins 0 to 15 Symbol AVCC AVSS AVref AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 ADTRG CIN0 to CIN15 I/O Input Input Input Input Input Input Input Input Input Input Input Input Input Function Analog block power supply Analog block ground and A/D conversion reference voltage A/D conversion reference voltage Analog input channel 0 Analog input channel 1 Analog input channel 2 Analog input channel 3 Analog input channel 4 Analog input channel 5 Analog input channel 6 Analog input channel 7 External trigger input for starting A/D conversion Expansion A/D conversion input (digital input pin) channels 0 to 15
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Section 20 A/D Converter
20.1.4
Register Configuration
Table 20.2 summarizes the registers of the A/D converter. Table 20.2 A/D Converter Registers
Name A/D data register AH A/D data register AL A/D data register BH A/D data register BL A/D data register CH A/D data register CL A/D data register DH A/D data register DL A/D control/status register A/D control register Module stop control register Keyboard comparator control register Abbreviation ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR MSTPCRH MSTPCRL KBCOMP R/W R R R R R R R R
2 R/(W)*
Initial Value H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'3F H'3F H'FF H'00
1 Address*
H'FFE0 H'FFE1 H'FFE2 H'FFE3 H'FFE4 H'FFE5 H'FFE6 H'FFE7 H'FFE8 H'FFE9 H'FF86 H'FF87 H'FEE4
R/W R/W R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Only 0 can be written in bit 7, to clear the flag.
20.2
20.2.1
Bit
Register Descriptions
A/D Data Registers A to D (ADDRA to ADDRD)
15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R 5 0 R 4 — 0 R 3 — 0 R 2 — 0 R 1 — 0 R 0 — 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 — Initial value Read/Write
There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of A/D conversion.
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Section 20 A/D Converter
The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected channel and stored there. The upper 8 bits of the converted data are transferred to the upper byte (bits 15 to 8) of ADDR, and the lower 2 bits are transferred to the lower byte (bits 7 and 6) and stored. Bits 5 to 0 are always read as 0. The correspondence between the analog input channels and ADDR registers is shown in table 20.3. The ADDR registers can always be read by the CPU. The upper byte can be read directly, but for the lower byte, data transfer is performed via a temporary register (TEMP). For details, see section 20.3, Interface to Bus Master. The ADDR registers are initialized to H'0000 by a reset, and in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode. Table 20.3 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel Group 0 AN0 AN1 AN2 AN3 Group 1 AN4 AN5 AN6 or CIN0 to CIN7 AN7 or CIN8 to CIN15 A/D Data Register ADDRA ADDRB ADDRC ADDRD
20.2.2
Bit
A/D Control/Status Register (ADCSR)
7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CKS 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W
Initial value Read/Write
Note: * Only 0 can be written in bit 7, to clear the flag.
ADCSR is an 8-bit readable/writable register that controls A/D conversion operations. ADCSR is initialized to H'00 by a reset, and in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode.
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Section 20 A/D Converter
Bit 7—A/D End Flag (ADF): Status flag that indicates the end of A/D conversion.
Bit 7 ADF 0 Description [Clearing conditions] • • 1 • • When 0 is written in the ADF flag after reading ADF = 1 When the DTC is activated by an ADI interrupt and ADDR is read Single mode: When A/D conversion ends Scan mode: When A/D conversion ends on all specified channels (Initial value)
[Setting conditions]
Bit 6—A/D Interrupt Enable (ADIE): Selects enabling or disabling of interrupt (ADI) requests at the end of A/D conversion.
Bit 6 ADIE 0 1 Description A/D conversion end interrupt (ADI) request is disabled A/D conversion end interrupt (ADI) request is enabled (Initial value)
Bit 5—A/D Start (ADST): Selects starting or stopping of A/D conversion. Holds a value of 1 during A/D conversion. The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external trigger input pin (ADTRG).
Bit 5 ADST 0 1 Description A/D conversion stopped (Initial value)
Single mode: A/D conversion is started. Cleared to 0 automatically when conversion on the specified channel ends Scan mode: A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or a transition to standby mode or module stop mode
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating mode. See section 20.4, Operation, for single mode and scan mode operation. Only set the SCAN bit while conversion is stopped.
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Section 20 A/D Converter Bit 4 SCAN 0 1 Description Single mode Scan mode (Initial value)
Bit 3—Clock Select (CKS): Sets the A/D conversion time. Only change the conversion time while ADST = 0.
Bit 3 CKS 0 1 Description Conversion time = 266 states (max.) Conversion time = 134 states (max.) (Initial value)
Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): Together with the SCAN bit, these bits select the analog input channel(s). One analog input channel can be switched to digital input. Only set the input channel while conversion is stopped.
Group Selection CH2 0 CH1 0 1 1 0 1 Channel Selection CH0 0 1 0 1 0 1 0 1 Single Mode AN0 AN1 AN2 AN3 AN4 AN5 AN6 or CIN0 to CIN7 AN7 or CIN8 to CIN15 (Initial value) Description Scan Mode AN0 AN0, AN1 AN0 to AN2 AN0 to AN3 AN4 AN4, AN5 AN4, AN5, AN6 or CIN0 to CIN7 AN4, AN5, AN6 or CIN0 to CIN7 AN7 or CIN8 to CIN15
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Section 20 A/D Converter
20.2.3
Bit
A/D Control Register (ADCR)
7 TRGS1 0 R/W 6 TRGS0 0 R/W 5 — 1 — 4 — 1 — 3 — 1 — 2 — 1 — 1 — 1 — 0 — 1 —
Initial value Read/Write
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D conversion operations. ADCR is initialized to H'3F by a reset, and in standby mode, watch mode, subactive mode, subsleep mode, and module stop mode. Bits 7 and 6—Timer Trigger Select 1 and 0 (TRGS1, TRGS0): These bits select enabling or disabling of the start of A/D conversion by a trigger signal. Only set bits TRGS1 and TRGS0 while conversion is stopped.
Bit 7 TRGS1 0 1 Bit 6 TRGS0 0 1 0 1 Description Start of A/D conversion by external trigger is disabled Start of A/D conversion by external trigger is disabled Start of A/D conversion by external trigger (8-bit timer) is enabled Start of A/D conversion by external trigger pin is enabled (Initial value)
Bits 5 to 0—Reserved: Should always be written with 1. Note: Some of these bits are readable/writable in products other than the HD64F2148, HD64F2147N, HD64F2144, HD64F2142R and HD6432142, however, when writing, be sure to write 1 here for software compatibility.
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Section 20 A/D Converter
20.2.4
Bit
Keyboard Comparator Control Register (KBCOMP)
7 IrE 0 R/W 6 IrCKS2 0 R/W 5 IrCKS1 0 R/W 4 IrCKS0 0 R/W 3 KBADE 0 R/W 2 KBCH2 0 R/W 1 KBCH1 0 R/W 0 KBCH0 0 R/W
Initial value Read/Write
KBCOMP is an 8-bit readable/writable register that controls the SCI2 IrDA function and selects the CIN input channels for A/D conversion. KBCOMP is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 4—IrDA Control: See the description in section 15.2.11, Keyboard Comparator Control Register (KBCOMP). Bit 3—Keyboard A/D Enable (KBADE): Selects either analog input pins (AN6, AN7) or digital input pins (CIN0 to CIN7, CIN8 to CIN15) for A/D converter channel 6 and channel 7 input. Bits 2 to 0—Keyboard A/D Channel Select 2 to 0 (KBCH2 to KBCH0): These bits select the channels for A/D conversion from among the digital input pins. Only set the input channel while A/D conversion is stopped.
Bit 3 KBADE 0 1 Bit 2 KBCH2 — 0 Bit 1 KBCH1 — 0 1 1 0 1 Bit 0 KBCH0 — 0 1 0 1 0 1 0 1 A/D Converter Channel 6 Input AN6 CIN0 CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 A/D Converter Channel 7 Input AN7 CIN8 CIN9 CIN10 CIN11 CIN12 CIN13 CIN14 CIN15
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Section 20 A/D Converter
20.2.5
Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
2 1 0 7 6 5 4 3 2 1 0
Bit Initial value Read/Write
7
6
5
4
3
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR, comprising two 8-bit readable/writable registers, performs module stop mode control. When the MSTP9 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 25.5, Module Stop Mode. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTPCRH Bit 1—Module Stop (MSTP9): Specifies the A/D converter module stop mode.
MSTPCRH Bit 1 MSTP9 0 1 Description A/D converter module stop mode is cleared A/D converter module stop mode is set (Initial value)
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Section 20 A/D Converter
20.3
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers, but the data bus to the bus master is only 8 bits wide. Therefore, in accesses by the bus master, the upper byte is accessed directly, but the lower byte is accessed via a temporary register (TEMP). A data read from ADDR is performed as follows. When the upper byte is read, the upper byte value is transferred to the CPU and the lower byte value is transferred to TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading ADDR, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 20.2 shows the data flow for ADDR access.
Upper byte read
Bus master (H'AA)
Bus interface
Module data bus
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40)
(n = A to D)
Lower byte read
Bus master (H'40)
Module data bus Bus interface
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40)
(n = A to D)
Figure 20.2 ADDR Access Operation (Reading H'AA40)
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Section 20 A/D Converter
20.4
Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two operating modes: single mode and scan mode. 20.4.1 Single Mode (SCAN = 0)
Single mode is selected when A/D conversion is to be performed on a single channel only. A/D conversion is started when the ADST bit is set to 1 by software, or by external trigger input. The ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when conversion ends. On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt request is generated. The ADF flag is cleared by writing 0 after reading ADCSR. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 20.3 shows a timing diagram for this example. 1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). 2. When A/D conversion is completed, the result is transferred to ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. 3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The routine reads ADCSR, then writes 0 to the ADF flag. 6. The routine reads and processes the conversion result (ADDRB). 7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps 2 to 7 are repeated.
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Section 20 A/D Converter
Set* ADIE ADST ADF State of channel 0 (AN0) State of channel 1 (AN1) State of channel 2 (AN2) State of channel 3 (AN3) Idle Idle Idle Idle
A/D conversion 1
A/D conversion starts
Set* Clear*
Set* Clear*
Idle
A/D conversion 2
Idle
ADDRA ADDRB ADDRC ADDRD Read conversion result A/D conversion result 1 Read conversion result A/D conversion result 2
Note: * Vertical arrows ( ) indicate instructions executed by software.
Figure 20.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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Section 20 A/D Converter
20.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by software, or by timer or external trigger input, A/D conversion starts on the first channel in the group (AN0 when CH2 = 0; AN4 when CH2 = 1). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1 or AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the ADDR registers corresponding to the channels. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when three channels (AN0 to AN2) are selected in scan mode are described next. Figure 20.4 shows a timing diagram for this example. 1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1) 2. When A/D conversion of the first channel (AN0) is completed, the result is transferred to ADDRA. Next, conversion of the second channel (AN1) starts automatically. 3. Conversion proceeds in the same way through the third channel (AN2). 4. When conversion of all the selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D conversion ends. 5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0).
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Section 20 A/D Converter
Continuous A/D conversion execution
Set*1 ADST ADF A/D conversion time State of channel 0 (AN0) State of channel 1 (AN1) State of channel 2 (AN2) State of channel 3 (AN3) Transfer ADDRA ADDRB ADDRC ADDRD A/D conversion result 1 A/D conversion result 4 A/D conversion result 2 A/D conversion result 3 Idle Idle Idle
A/D conversion 1
Clear*1 Clear*1
Idle
A/D conversion 2
A/D conversion 4
Idle
A/D conversion 5 *2
Idle
A/D conversion 3
Idle Idle
Idle
Notes: 1. Vertical arrows ( ) indicate instructions executed by software. 2. Data currently being converted is ignored.
Figure 20.4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected)
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Section 20 A/D Converter
20.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 20.5 shows the A/D conversion timing. Table 20.4 indicates the A/D conversion time. As indicated in figure 20.5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 20.4. In scan mode, the values given in table 20.4 apply to the first conversion time. In the second and subsequent conversions the conversion time is fixed at 256 states when CKS = 0 or 128 states when CKS = 1.
(1) φ Address (2)
Write signal Input sampling timing
ADF tD tSPL tCONV Legend: (1) : ADCSR write cycle (2) : ADCSR address : A/D conversion start delay time tD tSPL : Input sampling time tCONV : A/D conversion time
Figure 20.5 A/D Conversion Timing
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Section 20 A/D Converter
Table 20.4 A/D Conversion Time (Single Mode)
CKS = 0 Item A/D conversion start delay Input sampling time A/D conversion time Symbol tD tSPL tCONV Min 10 — 259 Typ — 63 — Max 17 — 266 Min 6 — 131 CKS = 1 Typ — 31 — Max 9 — 134
Note: Values in the table are the number of states.
20.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to 11 in ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as when the ADST bit is set to 1 by software. Figure 20.6 shows the timing.
φ
ADTRG
Internal trigger signal
ADST A/D conversion
Figure 20.6 External Trigger Input Timing
20.5
Interrupts
The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt request can be enabled or disabled by the ADIE bit in ADCSR.
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Section 20 A/D Converter
20.6
Usage Notes
The following points should be noted when using the A/D converter. Setting Range of Analog Power Supply and Other Pins 1. Analog input voltage range The voltage applied to the ANn analog input pins during A/D conversion should be in the range AVSS ≤ ANn ≤ AVref (n = 0 to 7). 2. Digital input voltage range The voltage applied to the CINn digital input pins should be in the range AVSS ≤ CINn ≤ AVref and VSS ≤ CINn ≤ VCC (n = 0 to 15). 3. Relation between AVCC, AVSS and VCC, VSS As the relationship between AVCC, AVSS and VCC, VSS, set AVSS = VSS. If the A/D converter is not used, the AVCC and AVSS pins must on no account be left open. 4. Setting Range of AVref Pin: The reference voltage supplied via the AVref pin should be in the range AVref ≤ AVCC. If conditions 1 to 4 above are not met, the reliability of the device may be adversely affected. Notes on Board Design In board design, digital circuitry and analog circuitry should be as mutually isolated as possible, and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close proximity should be avoided as far as possible. Failure to do so may result in incorrect operation of the analog circuitry due to inductance, adversely affecting A/D conversion values. Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7), analog reference power supply (AVref), and analog power supply (AVCC) by the analog ground (AVSS). Also, the analog ground (AVSS) should be connected at one point to a stable digital ground (VSS) on the board. Notes on Noise Countermeasures A protection circuit connected to prevent damage due to an abnormal voltage such as an excessive surge at the analog input pins (AN0 to AN7) or analog reference power supply pin (AVref) should be connected between AVCC and AVSS as shown in figure 20.7.
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Section 20 A/D Converter
Also, the bypass capacitors connected to AVCC, AVref and the filter capacitor connected to AN0 to AN7 must be connected to AVSS. If a filter capacitor is connected as shown in figure 20.7, the input currents at the analog input pins (AN0 to AN7) are averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in scan mode, if the current charged and discharged by the capacitance of the sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance (Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore required when deciding the circuit constants.
AVCC
AVref Rin*2 *1 *1 0.1 µF AVSS 100 Ω AN0 to AN7
Notes:
Figures are reference values. 1. 10 µF 0.01 µF
2. Rin: Input impedance
Figure 20.7 Example of Analog Input Protection Circuit Table 20.5 Analog Pin Ratings
Item Analog input capacitance Permissible signal source impedance Note: * Min — — Max 20 10* Unit pF kΩ
When VCC = 4.0 to 5.5 V and φ ≤ 12 MHz.
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Section 20 A/D Converter
10 kΩ AN0 to AN7 To A/D converter 20 pF Note: Numeric values are reference values.
Figure 20.8 Analog Input Pin Equivalent Circuit A/D Conversion Precision Definitions The A/D conversion precision in this LSI is defined as follows. • Resolution The number of A/D converter digital output codes • Offset error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from the minimum voltage value B'0000000000 (H'000) to B'0000000001 (H'001) (see figure 20.10). • Full-scale error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from B'1111111110 (H'3FE) to B'111111111 (H'3FF) (see figure 20.11). • Quantization error The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 20.9). • Nonlinearity error The error with respect to the ideal A/D conversion characteristic between the zero voltage and the full-scale voltage. Does not include the offset error, full-scale error, or quantization error. • Absolute precision The deviation between the digital value and the analog input value. Includes the offset error, full-scale error, quantization error, and nonlinearity error.
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Section 20 A/D Converter
Digital output
H'3FF H'3FE H'3FD H'004 H'003 H'002 H'001 H'000
Ideal A/D conversion characteristic
Quantization error
1 2 1024 1024
1022 1023 FS 1024 1024 Analog input voltage
Figure 20.9 A/D Conversion Precision Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion characteristic
Nonlinearity error
Actual A/D conversion characteristic FS Offset error Analog input voltage
Figure 20.10 A/D Conversion Precision Definitions (2)
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Section 20 A/D Converter
Permissible Signal Source Impedance Analog input in this LSI is designed so that conversion precision is guaranteed for an input signal for which the signal source impedance is 10 kΩ (AVcc = 4.0 to 5.5 V, when φ ≤ 12 MHz) or less. This specification is provided to enable the A/D converter’s sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor output impedance exceeds 10 kΩ (AVcc = 4.0 to 5.5 V, when φ ≤ 12 MHz), charging may be insufficient and it may not be possible to guarantee the A/D conversion precision. However, if a large capacitance is provided externally, the input load will essentially comprise only the internal input resistance of 10 kΩ, and the signal source impedance is ignored. But since a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a large differential coefficient (e.g., 5 mV/µsec or greater). When converting a high-speed analog signal, a low-impedance buffer should be inserted. Influences on Absolute Precision Adding capacitance results in coupling with GND, and therefore noise in GND may adversely affect absolute precision. Be sure to make the connection to an electrically stable GND such as AVSS. Care is also required to insure that filter circuits do not communicate with digital signals on the mounting board, so acting as antennas.
This LSI Sensor output impedance, up to 10 kΩ Sensor input Low-pass filter C to 0.1 µF Cin = 15 pF 20 pF A/D converter equivalent circuit 10 kΩ
Note: Values are reference values.
Figure 20.11 Example of Analog Input Circuit
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Section 21 RAM
Section 21 RAM
21.1 Overview
The H8S/2148, H8S/2144, and H8S/2143 have 4 kbytes of on-chip high-speed static RAM, and the H8S/2147, H8S/2147N, and H8S/2142 have 2 kbytes. The on-chip RAM is connected to the CPU by a 16-bit data bus, enabling both byte data and word data to be accessed in one state. This makes it possible to perform fast word data transfer. The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the system control register (SYSCR). 21.1.1 Block Diagram
Figure 21.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFE080 H'FFE082 H'FFE084
H'FFE081 H'FFE083 H'FFE085
H'FFEFFE H'FFFF00
H'FFEFFF H'FFFF01
H'FFFF7E
H'FFFF7F
Figure 21.1 Block Diagram of RAM (H8S/2148, H8S/2144, H8S/2143)
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Section 21 RAM
21.1.2
Register Configuration
The on-chip RAM is controlled by SYSCR. Table 21.1 shows the register configuration. Table 21.1 Register Configuration
Name System control register Note: * Abbreviation SYSCR Lower 16 bits of the address. R/W R/W Initial Value H'09 Address* H'FFC4
21.2
Bit
System Control Register (SYSCR)
7 CS2E 0 R/W 6 IOSE 0 R/W 5 INTM1 0 R 4 INTM0 0 R/W 3 XRST 1 R 2 NMIEG 0 R/W 1 HIE 0 R/W 0 RAME 1 R/W
Initial value Read/Write
The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in SYSCR, see section 3.2.2, System Control Register (SYSCR). Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode.
Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
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Section 21 RAM
21.3
21.3.1
Operation
Expanded Mode (Modes 1, 2, 3 (EXPE = 1))
When the RAME bit is set to 1, accesses to H8S/2148, H8S/2144, and H8S/2143 addresses H'(FF)E080 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, and H8S/2147, H8S/2147N, and H8S/2142 addresses H'(FF)E880 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, are directed to the on-chip RAM. When the RAME bit is cleared to 0, accesses to addresses H'(FF)E080 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, are directed to the off-chip address space. Since the on-chip RAM is connected to the bus master by a 16-bit data bus, it can be written to and read in byte or word units. Each type of access is performed in one state. Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start at an even address. 21.3.2 Single-Chip Mode (Modes 2 and 3 (EXPE = 0))
When the RAME bit is set to 1, accesses to H8S/2148, H8S/2144, and H8S/2143 addresses H'(FF)E080 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, and H8S/2147, H8S/2147N, and H8S/2142 addresses H'(FF)E880 to H'(FF)EFFF and H'(FF)FF00 to H'(FF)FF7F, are directed to the on-chip RAM. When the RAME bit is cleared to 0, the on-chip RAM is not accessed. Undefined values are read from these bits, and writing is invalid. Since the on-chip RAM is connected to the bus master by a 16-bit data bus, it can be written to and read in byte or word units. Each type of access is performed in one state. Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start at an even address.
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Section 21 RAM
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.1 Overview
The H8S/2148 and H8S/2144 have 128 kbytes of on-chip ROM (flash memory or mask ROM), the H8S/2143 has 96 kbytes, the H8S/2147, H8S/2147N, and H8S/2142 have 64 kbytes. The ROM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte and word data in one state, enabling faster instruction fetches and higher processing speed. The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the on-chip ROM. The flash memory versions of the H8S/2148, H8S/2147N, H8S/2144, and H8S/2142 can be erased and programmed on-board as well as with a general-purpose PROM programmer. 22.1.1 Block Diagram
Figure 22.1 shows a block diagram of the ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000 H'000002
H'000001 H'000003
H'01FFFE
H'01FFFF
Figure 22.1 ROM Block Diagram (H8S/2148, H8S/2144)
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.1.2
Register Configuration
This group on-chip ROM is controlled by the operating mode and register MDCR. The register configuration is shown in table 22.1. Table 22.1 ROM Register
Register Name Mode control register Note: * Abbreviation MDCR R/W R/W Initial Value Undefined Depends on the operating mode Address* H'FFC5
Lower 16 bits of the address.
22.2
22.2.1
Bit
Register Descriptions
Mode Control Register (MDCR)
7 EXPE —* R/W* 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 MDS1 —* R 0 MDS0 —* R
Initial value Read/Write
Note: * Determined by the MD1 and MD0 pins.
MDCR is an 8-bit register used to set this group operating mode and monitor the current operating mode. The EXPE bit is initialized in accordance with the mode pin states by a reset and in hardware standby mode. Bit 7—Expanded Mode Enable (EXPE): Sets expanded mode. In mode 1, EXPE is fixed at 1 and cannot be modified. In modes 2 and 3, EXPE has an initial value of 0 and can be read or written.
Bit 7 EXPE 0 1 Description Single-chip mode selected Expanded mode selected
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0. Bits 1 and 0—Mode Select 1 and 0 (MDS1, MDS0): These bits indicate values that reflects the input levels of mode pins MD1 and MD0 (the current operating mode). Bits MDS1 and MDS0 correspond to pins MD1 and MD0, respectively. These are read-only bits, and cannot be modified. When MDCR is read, the input levels of mode pins MD1 and MD0 are latched in these bits.
22.3
Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data is accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address. The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the on-chip ROM, as shown in table 22.2. In normal mode, the maximum amount of ROM that can be used is 56 kbytes. Table 22.2 Operating Modes and ROM
Operating Mode MCU Operating Mode Mode 1 Mode 2 CPU Operating Mode Normal Advanced Advanced Mode 3 Normal Normal Note: * Mode Pins Description Expanded mode with on-chip ROM disabled Single-chip mode Expanded mode with on-chip ROM enabled Single-chip mode Expanded mode with on-chip ROM enabled 1 MD1 0 1 MD0 1 0 MDCR EXPE 1 0 1 0 1 Enabled (max. 56 kbytes) On-Chip ROM Disabled Enabled*
128 kbytes in the H8S/2148 and H8S/2144, 96 kbytes in the H8S/2143, 64 kbytes in the H8S/2147, H8S/2147N, and H8S/2142.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.4
22.4.1
Overview of Flash Memory
Features
The features of the flash memory are summarized below. • Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode • Programming/erase methods The flash memory is programmed 32 bytes at a time. Erasing is performed by block erase (in single-block units). When erasing multiple blocks, the individual blocks must be erased sequentially. Block erasing can be performed as required on 1-kbyte, 8-kbyte, 16-kbyte, 28kbyte, and 32-kbyte blocks. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 32-byte programming, equivalent to 300 µs (typ.) per byte, and the erase time is 100 ms (typ.) per block. • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode • Automatic bit rate adjustment With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of the host. • Protect modes There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for flash memory program/erase/verify operations. • Programmer mode Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board programming mode.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.4.2
Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 * FLMCR2 * EBR1 EBR2 * *
Bus interface/controller
Operating mode
Mode pins
Flash memory (128 kbytes/64 kbytes)
Legend: FLMCR1: FLMCR2: EBR1: EBR2:
Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2
Note: * These registers are used only in the flash memory version. In the mask ROM version, a read at any of these addresses will return an undefined value, and writes are invalid.
Figure 22.2 Block Diagram of Flash Memory
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.4.3
Flash Memory Operating Modes
Mode Transitions When the mode pins are set in the reset state and a reset-start is executed, the MCU enters one of the operating modes shown in figure 22.3. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and programmer mode.
MD1 = 1 User mode with on-chip ROM enabled RES = 0
Reset state
RES = 0 *1 RES = 0 *2 RES = 0 Programmer mode
SWE = 1
SWE = 0
User program mode
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. MD0 = MD1 = 0, P92 = 0, P91 = P90 = 1 2. MD0 = MD1 = 0, P92 = P91 = P90 = 1
Figure 22.3 Flash Memory Mode Transitions
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
On-Board Programming Modes • Boot mode
1. Initial state The flash memory is in the erased state when the device is shipped. The description here applies to the case where the old program version or data is being rewritten. The user should prepare the programming control program and new application program beforehand in the host.
Host Programming control program New application program The chip Boot program Flash memory RAM SCI The chip Boot program Flash memory RAM Boot program area Application program (old version) Application program (old version) SCI
2. SCI communication check When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started, an SCI communication check is carried out, and the boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host Programming control program New application program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks.
Host Programming control program New application program The chip Boot program Flash memory RAM Boot program area Flash memory erase SCI
4. Writing new application program The programming control program transferred from the host to RAM by SCI communication is executed, and the new application program in the host is written into the flash memory.
Host
The chip Boot program Flash memory RAM Programming control program New application program SCI
Program execution state
Figure 22.4 Boot Mode
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• User program mode
1. Initial state (1) The program that will transfer the programming/ erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (2) The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program The chip Boot program Flash memory Transfer program RAM SCI The chip Boot program Flash memory Transfer program
Programming/ erase control program
2. Programming/erase control program transfer Executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM.
Host
New application program
SCI RAM
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program The chip Boot program Flash memory Transfer program
Programming/ erase control program
The chip SCI RAM Boot program Flash memory
Transfer program Programming/ erase control program
SCI RAM
Flash memory erase
New application program
Program execution state
Figure 22.5 User Program Mode (Example)
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Differences between Boot Mode and User Program Mode
Boot Mode Entire memory erase Block erase Programming control program* Note: * Yes No Program/program-verify User Program Mode Yes Yes Program/program-verify Erase/erase-verify To be provided by the user, in accordance with the recommended algorithm.
Block Configuration The flash memory is divided into two 32-kbyte blocks (128-kbyte version only), two 8-kbyte blocks, one 16-kbyte block, one 28-kbyte block, and four 1-kbyte blocks.
Address H'00000 Address H'00000
1 kbyte 1 kbyte 1 kbyte 1 kbyte
1 kbyte 1 kbyte 1 kbyte 1 kbyte
28 kbytes
64 kbytes
28 kbytes
16 kbytes
128 kbytes
16 kbytes 8 kbytes 8 kbytes
8 kbytes 8 kbytes Address H'0FFFF
32 kbytes
32 kbytes
Address H'1FFFF (a) 128-kbyte version (b) 64-kbyte version
Figure 22.6 Flash Memory Block Configuration
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.4.4
Pin Configuration
The flash memory is controlled by means of the pins shown in table 22.3. Table 22.3 Flash Memory Pins
Pin Name Reset Mode 1 Mode 0 Port 92 Port 91 Port 90 Transmit data Receive data Abbreviation RES MD1 MD0 P92 P91 P90 TxD1 RxD1 I/O Input Input Input Input Input Input Output Input Function Reset Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode when MD1 = MD0 = 0 Sets MCU operating mode when MD1 = MD0 = 0 Sets MCU operating mode when MD1 = MD0 = 0 Serial transmit data output Serial receive data input
22.4.5
Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 22.4. In order for these registers to be accessed, the FLSHE bit must be set to 1 in STCR. Table 22.4 Flash Memory Registers
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 Serial/timer control register Abbreviation R/W FLMCR1* 5 FLMCR2*
5
Initial Value
3
Address* H'FF80* 2 H'FF81*
2
1
R/W* 3 R/W* R/W* 3 R/W*
3
H'80 4 H'00* H'00* 4 H'00*
4
EBR1* 5 EBR2*
5
H'FF82* 2 H'FF83*
2
STCR
R/W
H'00
H'FFC3
Notes: 1. Lower 16 bits of the address. 2. Flash memory registers share addresses with other registers. Register selection is performed by the FLSHE bit in the serial/timer control register (STCR). 3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. 4. The SWE bit in FLMCR1 is not set, these registers are initialized to H'00. 5. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the access requiring 2 states. These registers are used only in the flash memory version. In the mask ROM version, a read at any of these addresses will return an undefined value, and writes are invalid. Rev. 4.00 Sep 27, 2006 page 648 of 1130 REJ09B0327-0400
Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.5
22.5.1
Bit
Register Descriptions
Flash Memory Control Register 1 (FLMCR1)
7 FWE 1 R 6 SWE 0 R/W 5 — 0 — 4 — 0 — 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Initial value Read/Write
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is entered by setting SWE to 1. Program mode is entered by setting SWE to 1, then setting the PSU bit in FLMCR2, and finally setting the P bit. Erase mode is entered by setting SWE to 1, then setting the ESU bit in FLMCR2, and finally setting the E bit. FLMCR1 is initialized to H'80 by a reset, and in hardware standby mode, software standby mode, subactive mode, subsleep mode, and watch mode. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes to the EV and PV bits in FLMCR1 are enabled only when SWE=1; writes to the E bit only when SWE = 1, and ESU = 1; and writes to the P bit only when SWE = 1, and PSU = 1. Bit 7—Flash Write Enable (FWE): Controls programming and erasing of the on-chip flash memory. This bit cannot be modified and is always read as 1. Bit 6—Software Write Enable (SWE): Enables or disables flash memory programming. SWE should be set before setting bits ESU, PSU, EV, PV, E, P, and EB9 to EB0, and should not be cleared at the same time as these bits.
Bit 6 SWE 0 1 Description Writes disabled Writes enabled (Initial value)
Bits 5 and 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When SWE = 1 (Initial value)
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When SWE = 1 (Initial value)
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] When SWE = 1, and ESU = 1 (Initial value)
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Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] When SWE = 1, and PSU = 1 (Initial value)
22.5.2
Bit
Flash Memory Control Register 2 (FLMCR2)
7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 ESU 0 R/W 0 PSU 0 R/W
Initial value Read/Write
FLMCR2 is an 8-bit register that monitors the presence or absence of flash memory program/erase protection (error protection) and performs setup for flash memory program/erase mode. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode. The ESU and PSU bits are cleared to 0 in software standby mode, subactive mode, subsleep mode, and watch mode. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT) Bit 7 FLER 0 Description Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 22.8.3, Error Protection (Initial value)
Bits 6 to 2—Reserved: Always write 0 when writing to these bits. Bit 1—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 1 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When SWE = 1 (Initial value)
Bit 0—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 0 PSU 0 1 Description Program setup cleared Program setup [Setting condition] When SWE = 1 (Initial value)
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22.5.3
Bit EBR1
Erase Block Registers 1 and 2 (EBR1, EBR2)
7 — 0 — 7 EB7 0
1 R/W*
6 — 0 — 6 EB6 0 R/W
5 — 0 — 5 EB5 0 R/W
4 — 0 — 4 EB4 0 R/W
3 — 0 — 3 EB3 0 R/W
2 — 0 — 2 EB2 0 R/W
1
2
0
2
EB9/—* EB8/—*
Initial value Read/Write Bit EBR2 Initial value Read/Write
0 0 *1 *2 R/W*1 *2 R/W 1 EB1 0 R/W 0 EB0 0 R/W
Notes: 1. In normal mode, these bits cannot be modified and are always read as 0. 2. Bits EB8 and EB9 are not present in the 64-kbyte versions; they must not be set to 1.
EBR1 and EBR2 are registers that specify the flash memory erase area block by block; bits 1 and 2 in EBR1 (128 kB versions only) and bits 7 to 0 in EBR2 are readable/writable bits. EBR1 and EBR2 are each initialized to H'00 by a reset, in hardware standby mode, software standby mode, subactive mode, subsleep mode, and watch mode, and the SWE bit in FLMCR1 is not set. When a bit in EBR1 or EBR2 is set, the corresponding block can be erased. Other blocks are eraseprotected. Set only one bit in EBR1 or EBR2 (more than one bit cannot be set). When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 22.5.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.5 Flash Memory Erase Blocks
Block (Size) 128-kbyte Versions EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) 64-kbyte Versions EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbytes) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) — — Address H'(00)0000 to H'(00)03FF H'(00)0400 to H'(00)07FF H'(00)0800 to H'(00)0BFF H'(00)0C00 to H'(00)0FFF H'(00)1000 to H'(00)7FFF H'(00)8000 to H'(00)BFFF H'(00)C000 to H'(00)DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF
22.5.4
Bit
Serial/Timer Control Register (STCR)
7 IICS 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W 3 FLSHE 0 R/W 2 — 0 R/W 1 ICKS1 0 R/W 0 ICKS0 0 R/W
Initial value Read/Write
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode (when the on-chip IIC option is included), and on-chip flash memory control (in F-ZTAT versions), and also selects the TCNT input clock. For details on functions not related to on-chip flash memory, see section 3.2.4, Serial Timer Control Register (STCR), and descriptions of individual modules. If a module controlled by STCR is not used, do not write 1 to the corresponding bit. STCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 4—I C Control (IICS, IICX1, IICX0, IICE): When the on-chip IIC option is included, 2 2 these bits control the operation of the I C bus interface. For details, see section 16, I C Bus Interface.
2
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Bit 3—Flash Memory Control Register Enable (FLSHE): Setting the FLSHE bit to 1 enables read/write access to the flash memory control registers. If FLSHE is cleared to 0, the flash memory control registers are deselected. In this case, the flash memory control register contents are retained.
Bit 3 FLSHE 0 1 Description Flash memory control registers deselected Flash memory control registers selected (Initial value)
Bit 2—Reserved: Do not write 1 to this bit. Bits 1 and 0—Internal Clock Select 1 and 0 (ICKS1, ICKS0): These bits control 8-bit timer operation. See section 12, 8-Bit Timers, for details.
22.6
On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 22.6. For a diagram of the transitions to the various flash memory modes, see figure 22.3. Only advanced mode setting is possible for boot mode. In the case of user program mode, established in advanced mode or normal mode, depending on the setting of the MD0 pin. In normal mode, only programming of a 56-kbyte area of flash memory is possible. Table 22.6 Setting On-Board Programming Modes
Mode Mode Name Boot mode User program mode Note: * CPU Operating Mode Advanced mode Advanced mode Normal mode MD1 0 1 MD0 0 0 1 P92 1* — — P91 1* — — P90 1* — —
Can be used as I/O ports after boot mode is initiated.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.6.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The channel 1 SCI to be used is set to asynchronous mode. When a reset-start is executed after this group MCU’s pins have been set to boot mode, the boot program built into the MCU is started and the programming control program prepared in the host is serially transmitted to the MCU via the SCI. In the MCU, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 22.7, and the boot program mode execution procedure in figure 22.8.
This group chip
Flash memory
Host
Write data reception Verify data transmission
RxD1 SCI1 TxD1 On-chip RAM
Figure 22.7 System Configuration in Boot Mode
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Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate MCU measures low period of H'00 data transmitted by host MCU calculates bit rate and sets value in bit rate register After bit rate adjustment, transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, MCU transfers part of boot program to RAM Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, MCU transmits one H'AA data byte to host
Host transmits number of user program bytes (N), upper byte followed by lower byte MCU transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits user program sequentially in byte units MCU transmits received user program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM No Yes End of transmission Transmit one H'AA data byte to host, and execute programming control program transferred to on-chip RAM
n+1→n
n = N?
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted.
Figure 22.8 Boot Mode Execution Procedure
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Automatic SCI Bit Rate Adjustment
Start bit
D0
D1
D2
D3
D4
D5
D6
D7
Stop bit
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
Figure 22.9 RxD1 Input Signal when Using Automatic SCI Bit Rate Adjustment When boot mode is initiated, this group MCU measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The MCU calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the MCU. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the MCU’s system clock frequency, there will be a discrepancy between the bit rates of the host and the MCU. To ensure correct SCI operation, the host’s transfer bit rate should be set to (2400, 4800, or 9600) bps. Table 22.7 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the MCU’s bit rate is possible. The boot program should be executed within this system clock range. Table 22.7 System Clock Frequencies for which Automatic Adjustment of This Group Bit Rate Is Possible
Host Bit Rate 9600 bps 4800 bps 2400 bps System Clock Frequency for which Automatic Adjustment of This Group Bit Rate Is Possible 8 MHz to 20 MHz 4 MHz to 20 MHz 2 MHz to 18 MHz
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
On-Chip RAM Area Divisions in Boot Mode In boot mode, the 128-byte area from H'(FF)FF00 to H'(FF)FF7F is reserved for use by the boot program, as shown in figure 22.10. The area to which the programming control program is transferred is H'(FF)E080 to H'(FF)EFFF (3968 bytes) in the 128-kbyte versions, or H'(FF)E880 to H'(FF)EFFF (1920 bytes) in the 64-kbyte versions. The boot program area can be used when the programming control program transferred into RAM enters the execution state. A stack area should be set up as required.
H'(FF)E080
Programming control program area (3,968 bytes)
H'(FF)E880 Programming control program area (1,920 bytes) H'(FF)EFFF
H'(FF)EFFF H'(FF)FF00 Boot program area* (128 bytes) (a) 128-kbyte versions
H'(FF)FF00
H'(FF)FF7F
H'(FF)FF7F
Boot program area* (128 bytes) (b) 64-kbyte versions
Note: * The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note that the boot program remains stored in this area after a branch is made to the programming control program.
Figure 22.10 RAM Areas in Boot Mode Notes on Use of User Mode • When the chip comes out of reset in boot mode, it measures the low period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD1 input. • In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased.
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• Interrupts cannot be used while the flash memory is being programmed or erased. • The RxD1 and TxD1 pins should be pulled up on the board. • Before branching to the programming control program (RAM area H'(FF)E080 (128-kbyte versions) or H'(FF)E880 (64-kbyte versions)), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P84DDR = 1, P84DR = 1). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. The initial values of other on-chip registers are not changed. • Boot mode can be entered by making the pin settings shown in table 22.6 and executing a reset-start. 1 When the chip detects the boot mode setting at reset release* , P92, P91, and P90 can be used as I/O ports. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting 1 the mode pins, and executing reset release* . Boot mode can also be cleared by a WDT overflow reset. The mode pin input levels must not be changed in boot mode. • If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) 2 will change according to the change in the microcomputer’s operating mode* . Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: 1. Mode pin input must satisfy the mode programming setup time (tMDS = 4 states) with respect to the reset release timing. 2. Ports with multiplexed address functions will output a low level as the address signal if mode pin setting is for mode 1 is entered during a reset. In other modes, the port pins go to the high-impedance state. The bus control output signals will output a high level if mode pin setting is for mode 1 is entered during a reset. In other modes, the port pins go to the high-impedance state.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.6.2
User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip flash memory (mode 2 or 3). In this mode, on-chip supporting modules other than flash memory operate as they normally would in mode 2 and 3. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. Figure 22.11 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
Write the transfer program (and the program/ erase control program if necessary) beforehand MD1, MD0 = 10, 11 Reset-start
Transfer program/erase control program to RAM Branch to program/erase control program in RAM area Execute program/erase control program (flash memory rewriting) Branch to flash memory application program Note: The watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc.
Figure 22.11 User Program Mode Execution Procedure
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.7
Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes can be made by setting the PSU and ESU bits in FLMCR2, and the P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory programming/erasing (the programming control program) should be located and executed in on-chip RAM or external memory. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, EV, PV, E, and P bits in FLMCR1, and the ESU and PSU bits in FLMCR2, is executed by a program in flash memory. 2. Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. 22.7.1 Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 21.12 to write data or programs to flash memory. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 32 bytes at a time. For the wait times (x, y, z, α, β, γ, ε, η) after setting/clearing individual bits in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of writes (N), see section 26.2.6, Flash Memory Characteristics. Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control register 1 (FLMCR1), 32-byte program data is stored in the program data area and reprogram data area, and the 32-byte data in the reprogram data area written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00, H'20, H'40, H'60, H'80, H'A0, H'C0, or H'E0. Thirty-two consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 32-byte data transfer must be performed even if writing fewer than 32 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than (y + z + α + β) µs as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by setting the PSU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to program mode by setting the P bit in
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FLMCR1. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (z) µs. 22.7.2 Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of a given programming time, the programming mode is exited (the P bit in FLMCR1 is cleared, then the PSU bit in FLMCR2 is cleared at least (α) µs later). The watchdog timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to programverify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 22.12) and transferred to the reprogram data area. After 32 bytes of data have been verified, exit program-verify mode, wait for at least (η) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is not repeated more than (N) times on the same bits.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Start Set SWE bit in FLMCR1 Wait (x) µs Store 32-byte program data in program data area and reprogram data area n=1 m=0 Write 32-byte data in RAM reprogram data area consecutively to flash memory Enable WDT Set PSU bit in FLMCR2 Wait (y) µs Set P bit in FLMCR1 Wait (z) µs Clear P bit in FLMCR1 Wait (α) µs Clear PSU bit in FLMCR2 Wait (β) µs Disable WDT Set PV bit in FLMCR1 Wait (γ) µs H'FF dummy write to verify address Wait (ε) µs Read verify data Increment address Program data = verify data? OK Reprogram data computation Transfer reprogram data to reprogram data area NG End of 32-byte data verification? OK Clear PV bit in FLMCR1 Wait (η) µs m = 0? OK Clear SWE bit in FLMCR1 End of programming
*5 *5 *5 *5 *5 *1 *5
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
*4
n←n+1
Start of programming
*5
End of programming
*5
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00, H'20, H'40, H'60, H'80, H'A0, H'C0, or H'E0. A 32-byte data transfer must be performed even if writing fewer than 32 bytes; in this case, H'FF data must be written to the extra addresses. 2. Verify data is read in 16-bit (word) units. 3. If a bit for which programming has been completed in the 32-byte programming loop fails the following verify phase, additional programming is performed for that bit. 4. An area for storing program data (32 bytes) and reprogram data (32 bytes) must be provided in RAM. The contents of the latter are rewritten as programming progresses. 5. See section 26.2.6, Flash Memory Characteristics, for the values of x, y, z, α, β, γ, ε, η, and N. Program Data 0 Verify Data 0 Reprogram Data 1 Comments Reprogramming is not performed if program data and verify data match Programming incomplete; reprogram — Still in erased state; no action
*2
0 1 m=1 1
1 0 1
0 1 1
NG
*3
*4
RAM Program data storage area (32 bytes)
Reprogram data storage area (32 bytes) n ≥ N?
*5
NG
NG
OK Clear SWE bit in FLMCR1 Programming failure
Figure 22.12 Program/Program-Verify Flowchart
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.7.3
Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify flowchart (single-block erase) shown in figure 22.13. The wait times (x, y, z, α, β, γ, ε, η) after setting/clearing individual bits in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of erases (N), see section 26.2.6, Flash Memory Characteristics. To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or 2 (EBR1 or EBR2) at least (x) µs after setting the SWE bit to 1 in flash memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + α + β) ms as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, preprogramming (setting all data in the memory to be erased to 0) is not necessary before starting the erase procedure. 22.7.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared, then the ESU bit in FLMCR2 is cleared at least (α) µs later), the watchdog timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased, set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/eraseverify sequence is not repeated more than (N) times. When verification is completed, exit eraseverify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1. If there are any unerased blocks, make a 1 bit setting in EBR1 or EBR2 for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the same way.
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Start
*1
Set SWE bit in FLMCR1 Wait (x) µs n=1 Set EBR1, EBR2 Enable WDT Set ESU bit in FLMCR2 Wait (y) µs Set E bit in FLMCR1 Wait (z) ms Clear E bit in FLMCR1 Wait (α) µs Clear ESU bit in FLMCR2 Wait (β) µs Disable WDT Set EV bit in FLMCR1 Wait (γ) µs Set block start address to verify address *5 *5 *5 Start of erase *5 Halt erase *5 n←n+1 *3 *5
H'FF dummy write to verify address Wait (ε) µs Increment address Read verify data Verify data = all 1? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (η) µs NG *4 End of erasing of all erase blocks? OK *5 Clear EV bit in FLMCR1 Wait (η) µs *5 n ≥ N? OK Clear SWE bit in FLMCR1 Erase failure NG *5 *5 *2 NG
Clear SWE bit in FLMCR1 End of erasing Notes: 1. 2. 3. 4. 5.
Preprogramming (setting erase block data to all 0) is not necessary. Verify data is read in 16-bit (W) units. Set only one bit in EBR1or EBR2. More than one bit cannot be set. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially. See section 26.2.6, Flash Memory Characteristics, for the values of x, y, z, α, β, γ, ε, η, and N.
Figure 22.13 Erase/Erase-Verify Flowchart (Single-Block Erase)
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.8
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 22.8.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2). (See table 22.8.) Table 22.8 Hardware Protection
Functions Item Reset/standby protection Description • In a reset (including a WDT overflow reset), software standby mode, subactive mode, subsleep mode, and watch mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. Program Yes Erase Yes
•
22.8.2
Software Protection
Software protection can be implemented by setting the SWE bit in FLMCR1 and erase block registers 1 and 2 (EBR1, EBR2). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 22.9.)
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Table 22.9 Software Protection
Functions Item SWE bit protection Description • Clearing the SWE bit to 0 in FLMCR1 sets the program/erase-protected state for all blocks. (Execute in on-chip RAM or external memory.) Block specification protection • Erase protection can be set for individual blocks by settings in erase block registers 1 and 2 (EBR1, EBR2). Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. — Yes Program Yes Erase Yes
•
22.8.3
Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: • When flash memory is read during programming/erasing (including a vector read or instruction fetch) • Immediately after exception handling (excluding a reset) during programming/erasing • When a SLEEP instruction (transition to software standby, sleep, subactive, subsleep, or watch mode) is executed during programming/erasing • When the bus is released during programming/erasing Error protection is released only by a reset and in hardware standby mode. Figure 22.14 shows the flash memory state transition diagram.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Program mode Erase mode RD VF PR ER FLER = 0
RES = 0 or STBY = 0
Reset or hardware standby (hardware protection) RD VF PR ER FLER = 0
Error occurrence*2 Error occurrence*1
RES = 0 or STBY = 0 RES = 0 or STBY = 0
FLMCR1, FLMCR2, EBR1, EBR2 initialization state
Error protection mode
Software standby, sleep, subsleep, and watch mode
Error protection mode (software standby, sleep, subsleep, and watch ) RD VF PR ER FLER = 1 FLMCR1, FLMCR2 (except FLER bit), EBR1, EBR2 initialization state*3
RD VF*4 PR ER FLER = 1
Software standby, sleep, subsleep, and watch mode release
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible
Notes: 1. When an error occurs other than due to a SLEEP instruction, or when a SLEEP instruction is executed for a transition to subactive mode 2. When an error occurs due to a SLEEP instruction (except subactive mode) 3. Except sleep mode 4. VF in subactive mode
Figure 22.14 Flash Memory State Transitions
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.9
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input is disabled when flash memory is being programmed or erased 1 (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode* , to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would 2 not be read correctly* , possibly resulting in MCU runaway. 3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests, including NMI input, must therefore be disabled inside and outside the MCU when programming or erasing flash memory. Interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly.
•
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.10
Flash Memory Programmer Mode
22.10.1 Programmer Mode Setting Programs and data can be written and erased in programmer mode as well as in the on-board programming modes. In programmer mode, the on-chip ROM can be freely programmed using a PROM programmer that supports Renesas Technology microcomputer device types with 12813 23 kbyte* * or 64-kbyte* * on-chip flash memory. Flash memory read mode, auto-program mode, auto-erase mode, and status read mode are supported with these device types. In auto-program mode, auto-erase mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output after execution of an auto-program or auto-erase operation. Table 22.10 shows programmer mode pin settings. Notes: 1. Applies to the H8S/2148 and H8S/2144. 2. Applies to the H8/2147N and H8S/2142. 3. Use products other than the A-mask version of the H8S/2148, H8S/2147N, H8/2144, and H8S/2142 (in either 5-V or 3-V version) with the writing voltage for the PROM programmer set to 5.0 V. Do not use the A-mask version with a 5.0-V PROM programmer setting. Table 22.10 Programmer Mode Pin Settings
Pin Names Mode pins: MD1, MD0 STBY pin RES pin XTAL and EXTAL pins Other setting pins: P97, P92, P91, P90, P67 Setting/External Circuit Connection Low-level input to MD1, MD0 High-level input (Hardware standby mode not set) Power-on reset circuit Oscillation circuit Low-level input to P92, P67, high-level input to P97, P91, P90
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.10.2 Socket Adapters and Memory Map In programmer mode, a socket adapter is mounted on the writer programmer to match the package concerned. Socket adapters are available for each writer manufacturer supporting Renesas Technology microcomputer device types with 128-kbyte or 64-kbyte on-chip flash memory. Figure 22.15 shows the memory map in programmer mode. For pin names in programmer mode, see section 1.3.2, Pin Functions in Each Operating Mode.
H8S/2148 H8S/2144 Programmer mode H'00000 On-chip ROM area H'01FFFF H'1FFFF H8S/2147N H8S/2142 On-chip ROM area H'00FFFF Undefined value output H'1FFFF H'0FFFF Programmer mode H'00000
MCU mode H'000000
MCU mode H'000000
Figure 22.15 Memory Map in Programmer mode 22.10.3 Programmer Mode Operation Table 22.11 shows how the different operating modes are set when using programmer mode, and table 22.12 lists the commands used in programmer mode. Details of each mode are given below. • Memory Read Mode Memory read mode supports byte reads. • Auto-Program Mode Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of auto-programming. • Auto-Erase Mode Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of auto-erasing. • Status Read Mode Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the FO6 signal. In status read mode, error information is output if an error occurs.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.11 Settings for Each Operating Mode in Programmer Mode
Pin Names Mode Read Output disable Command write 1 Chip disable* CE L L L H OE L H H X WE H H L X FO0 to FO7 Data output Hi-Z Data input Hi-Z FA0 to FA17 Ain X Ain* X
2
Notes: 1. Chip disable is not a standby state; internally, it is an operation state. 2. Ain indicates that there is also address input in auto-program mode.
Table 22.12 Programmer Mode Commands
Number of Cycles 1+n 129 2 2 1st Cycle Mode Write Write Write Write Address Data X X X X H'00 H'40 H'20 H'71 Mode Read Write Write Write 2nd Cycle Address Data RA WA X X Dout Din H'20 H'71
Command Name Memory read mode Auto-program mode Auto-erase mode Status read mode
Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous 128-byte write. 2. In memory read mode, the number of cycles depends on the number of address write cycles (n).
22.10.4 Memory Read Mode • After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read memory contents, a transition must be made to memory read mode by means of a command write before the read is executed. • Command writes can be performed in memory read mode, just as in the command wait state. • Once memory read mode has been entered, consecutive reads can be performed. • After power-on, memory read mode is entered.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.13 AC Characteristics in Memory Read Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tr tf Min 20 0 0 50 50 70 — — Max — — — — — — 30 30 Unit µs ns ns ns ns ns ns ns
Command write FA17 to FA0
Memory read mode Address stable
CE OE WE FO7 to FO0
twep
tceh
tnxtc
tces tf tr Data tdh tds Data
Note: Data is latched on the rising edge of WE.
Figure 22.16 Memory Read Mode Timing Waveforms after Command Write
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.14 AC Characteristics when Entering Another Mode from Memory Read Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tr tf Min 20 0 0 50 50 70 — — Max — — — — — — 30 30 Unit µs ns ns ns ns ns ns ns
Memory read mode FA17 to FA0 Address stable
Other mode command write
CE OE WE FO7 to FO0 tnxtc tces tf
twep
tceh
tr H'XX tdh
Data
Note: Do not enable WE and OE at the same time.
tds
Figure 22.17 Timing Waveforms when Entering Another Mode from Memory Read Mode
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.15 AC Characteristics in Memory Read Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Access time CE output delay time OE output delay time Output disable delay time Data output hold time Symbol tacc tce toe tdf toh Min — — — — 5 Max 20 150 150 100 — Unit µs ns ns ns ns
FA17 to FA0 CE OE WE
Address stable
Address stable VIL tacc VIL VIH
tacc FO7 to FO0 Data
toh Data
toh
Figure 22.18 Timing Waveforms for CE/OE Enable State Read CE
FA17 to FA0
Address stable
Address stable tacc
CE OE WE tacc FO7 to FO0
tce toe
tce toe VIH
tdf Data toh Data
tdf
toh
Figure 22.19 Timing Waveforms for CE/OE Clocked Read CE
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.10.5 Auto-Program Mode AC Characteristics Table 22.16 AC Characteristics in Auto-Program Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width Status polling start time Status polling access time Address setup time Address hold time Memory write time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep twsts tspa tas tah twrite tr tf Min 20 0 0 50 50 70 1 — 0 60 1 — — Max — — — — — — — 150 — — 3000 30 30 Unit µs ns ns ns ns ns ms ns ns ns ms ns ns
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
FA17 to FA0 CE OE twep WE tces tf tds tdh FO6 FO7 to FO0
H'40
Address stable
tceh tnxtc
tas
tah
tnxtc
Data transfer 1 byte to 128 bytes
twsts tspa twrite (1 to 3000 ms)
Programming operation end identification signal
FO7
tr
Programming normal end identification signal
Programming wait
Data
Data
FO0 to FO5 = 0
Figure 22.20 Auto-Program Mode Timing Waveforms Notes on Use of Auto-Program Mode • In auto-program mode, 128 bytes are programmed simultaneously. This should be carried out by executing 128 consecutive byte transfers. • A 128-byte data transfer is necessary even when programming fewer than 128 bytes. In this case, H'FF data must be written to the extra addresses. • The lower 8 bits of the transfer address must be H'00 or H'80. If a value other than an effective address is input, processing will switch to a memory write operation but a write error will be flagged. • Memory address transfer is performed in the second cycle (figure 22.20). Do not perform transfer after the second cycle. • Do not perform a command write during a programming operation. • Perform one auto-programming operation for a 128-byte block for each address. Characteristics are not guaranteed for two or more programming operations. • Confirm normal end of auto-programming by checking FO6. Alternatively, status read mode can also be used for this purpose (FO7 status polling uses the auto-program operation end identification pin). • The status polling FO6 and FO7 pin information is retained until the next command write. Until the next command write is performed, reading is possible by enabling CE and OE.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.10.6 Auto-Erase Mode AC Characteristics Table 22.17 AC Characteristics in Auto-Erase Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width Status polling start time Status polling access time Memory erase time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tests tspa terase tr tf Min 20 0 0 50 50 70 1 — 100 — — Max — — — — — — — 150 40000 30 30 Unit µs ns ns ns ns ns ms ns ms ns ns
FA17 to FA0 tces CE OE WE FO7 FO6 CLin FO7 to FO0 H'20 DLin H'20 FO0 to FO5 = 0 tf tds tdh tspa twep tr tnxtc tests terase (100 to 40000 ms)
Erase end identification signal Erase normal end confirmation signal
tceh
tnxtc
Figure 22.21 Auto-Erase Mode Timing Waveforms
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Notes on Use of Erase-Program Mode • Auto-erase mode supports only entire memory erasing. • Do not perform a command write during auto-erasing. • Confirm normal end of auto-erasing by checking FO6. Alternatively, status read mode can also be used for this purpose (FO7 status polling uses the auto-erase operation end identification pin). • The status polling FO6 and FO7 pin information is retained until the next command write. Until the next command write is performed, reading is possible by enabling CE and OE. 22.10.7 Status Read Mode • Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end occurs in auto-program mode or auto-erase mode. • The return code is retained until a command write for other than status read mode is performed. Table 22.18 AC Characteristics in Status Read Mode Conditions: VCC = 5.0 V ±10%, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width OE output delay time Disable delay time CE output delay time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep toe tdf tce tr tf Min 20 0 0 50 50 70 — — — — — Max — — — — — — 150 100 150 30 30 Unit µs ns ns ns ns ns ns ns ns ns ns
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
FA17 to FA0
CE tce OE WE twep tces tf tds tdh FO7 to FO0 H'71 tceh tr tnxtc tces tf tds tdh H'71 Data twep tceh tr tnxtc toe tnxtc
tdf
Note: FO2 and FO3 are undefined.
Figure 22.22 Status Read Mode Timing Waveforms Table 22.19 Status Read Mode Return Commands
Pin Name Attribute FO7 FO6 FO5 Programming error FO4 Erase error FO3 — FO2 — FO1 Programming or erase count exceeded 0 FO0 Effective address error 0
Normal Command end error identification 0 Command error: 1
Initial value 0 Indications Normal end: 0 Abnormal end: 1
0
0
0
0 —
Erase — Programerror: 1 ming Otherwise: 0 Otherwise: 0 error: 1 Otherwise: 0
Count Effective exceeded: 1 address Otherwise: 0 error: 1 Otherwise: 0
Note: FO2 and FO3 are undefined.
22.10.8 Status Polling • The FO7 status polling flag indicates the operating status in auto-program or auto-erase mode. • The FO6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode.
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Table 22.20 Status Polling Output Truth Table
Pin Names FO7 FO6 FO0 to FO5 Internal Operation in Progress 0 0 0 Abnormal End 1 0 0 — 0 1 0 Normal End 1 1 0
22.10.9 Programmer Mode Transition Time Commands cannot be accepted during the oscillation stabilization period or the programmer mode setup period. After the programmer mode setup time, a transition is made to memory read mode. Table 22.21 Command Wait State Transition Time Specifications
Item Standby release (oscillation stabilization time) Programmer mode setup time VCC hold time Symbol tosc1 tbmv tdwn Min 20 10 0 Max — — — Unit ms ms ms
VCC RES
tosc1
tbmv
Memory read Auto-program mode mode Auto-erase mode Command wait state
tdwn
Command Don't care wait state Normal/ abnormal end identification
Command reception
Figure 22.23 Oscillation Stabilization Time, Programmer Mode Setup Time, and Power Supply Fall Sequence
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
22.10.10 Notes on Memory Programming • When programming addresses which have previously been programmed, carry out autoerasing before auto-programming. • When performing programming using programmer mode on a chip that has been programmed/erased in an on-board programming mode, auto-erasing is recommended before carrying out auto-programming. Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas. For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level. 2. Auto-programming should be performed once only on the same address block.
22.11
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode and programmer mode are summarized below. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. For a PROM programmer, use Renesas Technology microcomputer device types with 128-kbyte or 64-kbyte on-chip flash memory that support a 5.0-V programming voltage. Do not select the HN28F101 or use a programming voltage of 3.3 V for the PROM programmer, and only use the specified socket adapter. Incorrect use will result in damaging the device. Powering on and off When applying or disconnecting VCC, fix the RES pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Do not set or clear the SWE bit during program execution in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing).
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Section 22 ROM (Mask ROM Version, H8S/2148 F-ZTAT, H8S/2147N F-ZTAT, H8S/2144 F-ZTAT, and H8S/2142 F-ZTAT)
Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 32-byte programming unit block. In programmer mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer. Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors.
22.12
Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version does not have the internal registers for flash memory control that are provided in the F-ZTAT version. Table 22.22 lists the registers that are present in the F-ZTAT version but not in the mask ROM version. If a register listed in table 22.22 is read in the mask ROM version, an undefined value will be returned, Therefore, if application software developed on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure that the registers in table 22.22 have no effect. Table 22.22 Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Register Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 Address H'FF80 H'FF81 H'FF82 H'FF83
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.1 Overview
H8S/2148 F-ZTAT A-mask version and H8S/2144 F-ZTAT A-mask version have 128 kbytes, and H8S/2147 F-ZTAT A-mask version has 64 kbytes of on-chip flash memory. The flash memory is connected to the bus master by a 16-bit data bus. The bus master accesses both byte and word data in one state, enabling faster instruction fetches and higher processing speed. The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the on-chip ROM. The flash memory versions of this group can be erased and programmed on-board as well as with a general-purpose PROM programmer. 23.1.1 Block Diagram
Figure 23.1 shows a block diagram of the ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000 H'000002
H'000001 H'000003
H'01FFFE
H'01FFFF
Figure 23.1 ROM Block Diagram (A-mask versions of the H8S/2148 F-ZTAT and H8S/2144 F-ZTAT)
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.1.2
Register Configuration
This group on-chip ROM is controlled by the operating mode and register MDCR. The register configuration is shown in table 23.1. Table 23.1 ROM Register
Register Name Mode control register Note: * Abbreviation MDCR R/W R/W Initial Value Undefined Depends on the operating mode Address* H'FFC5
Lower 16 bits of the address.
23.2
23.2.1
Bit
Register Descriptions
Mode Control Register (MDCR)
7 EXPE —* R/W* 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 MDS1 —* R 0 MDS0 —* R
Initial value Read/Write
Note: * Determined by the MD1 and MD0 pins.
MDCR is an 8-bit read-only register used to set this group operating mode and monitor the current operating mode. The EXPE bit is initialized in accordance with the mode pin states by a reset and in hardware standby mode. Bit 7—Expanded Mode Enable (EXPE): Sets expanded mode. In mode 1, EXPE is fixed at 1 and cannot be modified. In modes 2 and 3, EXPE has an initial value of 0 and can be read or written.
Bit 7 EXPE 0 1 Description Single-chip mode selected Expanded mode selected
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Bits 6 to 2—Reserved: These bits cannot be modified and are always read as 0. Bits 1 and 0—Mode Select 1 and 0 (MDS1, MDS0): These bits indicate values that reflects the input levels of mode pins MD1 and MD0 (the current operating mode). Bits MDS1 and MDS0 correspond to pins MD1 and MD0, respectively. These are read-only bits, and cannot be modified. When MDCR is read, the input levels of mode pins MD1 and MD0 are latched in these bits.
23.3
Operation
The on-chip flash memory is connected to the CPU by a 16-bit data bus, and both byte and word data is accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address. The mode pins (MD1 and MD0) and the EXPE bit in MDCR can be set to enable or disable the on-chip ROM, as shown in table 23.2. In normal mode, the maximum amount of ROM that can be used is 56 kbytes. Table 23.2 Operating Modes and ROM
Operating Mode MCU Operating Mode Mode 1 Mode 2 CPU Operating Mode Normal Advanced Advanced Mode 3 Normal Normal Note: * Mode Pins Description Expanded mode with on-chip ROM disabled Single-chip mode Expanded mode with on-chip ROM enabled Single-chip mode Expanded mode with on-chip ROM enabled 1 MD1 0 1 MD0 1 0 MDCR EXPE 1 0 1 0 1 Enabled (56 kbytes) On-Chip ROM Disabled Enabled*
H8S/2148 F-ZTAT A-mask version and H8S/2144 F-ZTAT A-mask version have 128 kbytes, and H8S/2147 F-ZTAT A-mask version has 64 kbytes of on-chip ROM.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.4
23.4.1
Overview of Flash Memory
Features
The features of the flash memory are summarized below. • Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in single-block units). When erasing multiple blocks, the individual blocks must be erased sequentially. Block erasing can be performed as required on 1-kbyte, 28-kbyte, 16-kbyte, 8kbyte, and 32-kbyte blocks. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent to approximately 80 µs (typ.) per byte, and the erase time is 100 ms (typ.) per block. • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode • Automatic bit rate adjustment With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match the transfer bit rate of the host. • Protect modes There are three protect modes, hardware, software, and error protect, which allow protected status to be designated for flash memory program/erase/verify operations. • Programmer mode Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board programming mode.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.4.2
Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 * FLMCR2 * EBR1 EBR2 * *
Bus interface/controller
Operating mode
Mode pins
Flash memory (128 kbytes/64 kbytes)
Legend: FLMCR1: FLMCR2: EBR1: EBR2:
Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2
Note: * These registers are used only in the flash memory version. In the mask ROM version, a read at any of these addresses will return an undefined value, and writes are invalid.
Figure 23.2 Block Diagram of Flash Memory
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.4.3
Flash Memory Operating Modes
Mode Transitions When the mode pins are set in the reset state and a reset-start is executed, the MCU enters one of the operating modes shown in figure 23.3. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and programmer mode.
MD1 = 1 User mode with on-chip ROM enabled RES = 0
Reset state
RES = 0 *2 RES = 0 *1 RES = 0 Programmer mode
SWE = 1
SWE = 0
User program mode
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. MD0 = MD1 = 0, P92 = P91 = P90 = 1 2. MD0 = MD1 = 0, P92 = 0, P91 = P90 = 1
Figure 23.3 Flash Memory Mode Transitions
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
On-Board Programming Modes • Boot mode
1. Initial state The flash memory is in the erased state when the device is shipped. The description here applies to the case where the old program version or data is being rewritten. The user should prepare the programming control program and new application program beforehand in the host.
Host Programming control program New application program The chip Boot program Flash memory RAM SCI The chip Boot program Flash memory RAM Boot program area Application program (old version) Application program (old version) Programming control program SCI
2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started, an SCI communication check is carried out, and the boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host Programming control program New application program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks.
Host
4. Writing new application program The programming control program transferred from the host to RAM by SCI communication is executed, and the new application program in the host is written into the flash memory.
Host
New application program The chip Boot program Flash memory RAM Boot program area Flash memory erase Programming control program New application program SCI The chip Boot program Flash memory RAM Boot program area Programming control program SCI
Program execution state
Figure 23.4 Boot Mode
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
• User program mode
1. Initial state (1) the program that will transfer the programming/ erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (2) The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program The chip Boot program Flash memory Transfer program RAM SCI The chip Boot program Flash memory Transfer program
Programming/ erase control program
2. Programming/erase control program transfer The transfer program in the flash memory is executed, and the programming/erase control program is transferred to RAM.
Host
New application program
SCI RAM
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program The chip Boot program Flash memory Transfer program
Programming/ erase control program
The chip SCI RAM Boot program Flash memory
Transfer program Programming/ erase control program
SCI RAM
Flash memory erase
New application program
Program execution state
Figure 23.5 User Program Mode (Example)
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Differences between Boot Mode and User Program Mode
Boot Mode Entire memory erase Block erase Programming control program* Notes * Yes No Program/program-verify User Program Mode Yes Yes Program/program-verify Erase/erase-verify To be provided by the user, in accordance with the recommended algorithm.
Block Configuration The flash memory is divided into two 32-kbyte blocks (128-kbyte version only), two 8-kbyte blocks, one 16-kbyte block, one 28-kbyte block, and four 1-kbyte blocks.
Address H'00000 Address H'00000
1 kbyte 1 kbyte 1 kbyte 1 kbyte
1 kbyte 1 kbyte 1 kbyte 1 kbyte
28 kbytes
28 kbytes
16 kbytes 8 kbytes
64 kbytes
16 kbytes 8 kbytes 8 kbytes
128 kbytes
8 kbytes Address H'0FFFF
(b) 64-kbyte version 32 kbytes
32 kbytes
Address H'1FFFF (a) 128-kbyte version
Figure 23.6 Flash Memory Block Configuration
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.4.4
Pin Configuration
The flash memory is controlled by means of the pins shown in table 23.3. Table 23.3 Flash Memory Pins
Pin Name Reset Mode 1 Mode 0 Port 92 Port 91 Port 90 Transmit data Receive data Abbreviation RES MD1 MD0 P92 P91 P90 TxD1 RxD1 I/O Input Input Input Input Input Input Output Input Function Reset Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode when MD1 = MD0 = 0 Sets MCU operating mode when MD1 = MD0 = 0 Sets MCU operating mode when MD1 = MD0 = 0 Serial transmit data output Serial receive data input
23.4.5
Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 23.4. In order for these registers to be accessed, the FLSHE bit must be set to 1 in STCR. Table 23.4 Flash Memory Registers
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 Serial/timer control register Abbreviation FLMCR1* 5 FLMCR2*
5
R/W R/W* 3 R/W*
3
Initial Value H'80 4 H'00* H'00* 4 H'00*
4
Address* H'FF80* 2 H'FF81*
2
1
EBR1* 5 EBR2*
5
R/W* 3 R/W*
3
H'FF82* 2 H'FF83*
2
STCR
R/W
H'00
H'FFC3
Notes: 1. Lower 16 bits of the address. 2. Flash memory registers share addresses with other registers. Register selection is performed by the FLSHE bit in the serial/timer control register (STCR). 3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and writes are invalid. 4. When the SWE bit in FLMCR1 is not set, these registers are initialized to H'00. 5. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid for these registers, the access requiring 2 states.
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23.5
23.5.1
Bit
Register Descriptions
Flash Memory Control Register 1 (FLMCR1)
7 FWE 1 R 6 SWE 0 R/W 5 — 0 — 4 — 0 — 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Initial value Read/Write
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is entered by setting SWE to 1. Program mode is entered by setting SWE to 1, then setting the PSU bit in FLMCR2, and finally setting the P bit. Erase mode is entered by setting SWE to 1, then setting the ESU bit in FLMCR2, and finally setting the E bit. FLMCR1 is initialized to H'80 by a reset, and in hardware standby mode, software standby mode, subactive mode, subsleep mode, and watch mode. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes to the EV and PV bits in FLMCR1 are enabled only when SWE=1; writes to the E bit only when SWE = 1, and ESU = 1; and writes to the P bit only when SWE = 1, and PSU = 1. Bit 7—Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. This bit cannot be modified and is always read as 1. Bit 6—Software Write Enable (SWE): Enables or disables flash memory programming. SWE should be set before setting bits ESU, PSU, EV, PV, E, P, and EB9 to EB0, and should not be cleared at the same time as these bits.
Bit 6 SWE 0 1 Description Writes disabled Writes enabled (Initial value)
Bit 5 and 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When SWE = 1 (Initial value)
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When SWE = 1 (Initial value)
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] When SWE = 1, and ESU = 1 (Initial value)
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Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] When SWE = 1, and PSU = 1 (Initial value)
23.5.2
Bit
Flash Memory Control Register 2 (FLMCR2)
7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 ESU 0 R/W 0 PSU 0 R/W
Initial value Read/Write
FLMCR2 is an 8-bit register that monitors the presence or absence of flash memory program/erase protection (error protection) and performs setup for flash memory program/erase mode. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode. The ESU and PSU bits are cleared to 0 in software standby mode, subactive mode, subsleep mode, and watch mode. When on-chip flash memory is disabled, a read will return H'00 and writes are invalid. Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version) Bit 7 FLER 0 Description Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode 1 An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 23.8.3, Error Protection (Initial value)
Bits 6 to 2—Reserved: Always write 0 when writing to these bits. Bit 1—Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 1 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When SWE = 1 (Initial value)
Bit 0—Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 0 PSU 0 1 Description Program setup cleared Program setup [Setting condition] When SWE = 1 (Initial value)
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23.5.3
Bit EBR1
Erase Block Registers 1 and 2 (EBR1, EBR2)
7 — 0 — 7 EB7 0
1 R/W*
6 — 0 — 6 EB6 0 R/W
5 — 0 — 5 EB5 0 R/W
4 — 0 — 4 EB4 0 R/W
3 — 0 — 3 EB3 0 R/W
2 — 0 — 2 EB2 0 R/W
1
2
0
2
EB9/—* EB8/—*
Initial value Read/Write Bit EBR2 Initial value Read/Write
0 0 *1 *2 R/W*1 *2 R/W 1 EB1 0 R/W 0 EB0 0 R/W
Notes: 1. In normal mode, these bits cannot be modified and are always read as 0. 2. Bits EB8 and EB9 are not present in the 64-kbyte versions; they must not be set to 1.
EBR1 and EBR2 are registers that specify the flash memory erase area block by block; bits 1 and 0 in EBR1 and bits 7 to 0 in EBR2 are readable/writable bits. EBR1 and EBR2 are each initialized to H'00 by a reset, in hardware standby mode, software standby mode, subactive mode, subsleep mode, and watch mode, and when the SWE bit in FLMCR1 is not set. When a bit in EBR1 and EBR2 is set, the corresponding block can be erased. Other blocks are erase-protected. Set only one bit in EBR1 and EBR2 (more than one bit cannot be set). When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 23.5.
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Table 23.5 Flash Memory Erase Blocks
Block (Size) 128-kbyte Version EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbytes) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) 64-kbyte Version EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbytes) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) — — Address H'(00)0000 to H'(00)03FF H'(00)0400 to H'(00)07FF H'(00)0800 to H'(00)0BFF H'(00)0C00 to H'(00)0FFF H'(00)1000 to H'(00)7FFF H'(00)8000 to H'(00)BFFF H'(00)C000 to H'(00)DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF
23.5.4
Bit
Serial/Timer Control Register (STCR)
7 IICS 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W 3 FLSHE 0 R/W 2 — 0 R/W 1 ICKS1 0 R/W 0 ICKS0 0 R/W
Initial value Read/Write
STCR is an 8-bit readable/writable register that controls register access, the IIC operating mode (when the on-chip IIC option is included), and on-chip flash memory, and also selects the TCNT input clock. For details on functions not related to on-chip flash memory, see section 3.2.4, Serial/Timer Control Register (STCR), and descriptions of individual modules. If a module controlled by STCR is not used, do not write 1 to the corresponding bit. STCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 4—I C Control (IICS, IICX1, IICX0, IICE): These bits control the operation of the I C 2 2 bus interface for the I C on-chip option. For details, see section 16, I C Bus Interface.
2 2
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Bit 3—Flash Memory Control Register Enable (FLSHE): Setting the FLSHE bit to 1 enables read/write access to the flash memory control registers. If FLSHE is cleared to 0, the flash memory control registers are deselected. In this case, the flash memory control register contents are retained.
Bit 3 FLSHE 0 1 Description Flash memory control registers deselected Flash memory control registers selected (Initial value)
Bit 2—Reserved: Do not write 1 to this bit. Bits 1 and 0—Internal Clock Select 1 and 0 (ICKS1, ICKS0): These bits control 8-bit timer operation. See section 12, 8-Bit Timers, for details.
23.6
On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 23.6. For a diagram of the transitions to the various flash memory modes, see figure 23.3. Only advanced mode setting is possible for boot mode. In the case of user program mode, established in advanced mode or normal mode, depending on the setting of the MD0 pin. In normal mode, only programming of a 56-kbyte area of flash memory is possible. Table 23.6 Setting On-Board Programming Modes
Mode Mode Name Boot mode User program mode Note: * CPU Operating Mode Advanced mode Advanced mode Normal mode Can be used as I/O ports after boot mode is initiated. MD1 0 1 MD0 0 0 1 P92 1* — — P91 1* — — P90 1* — —
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23.6.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The channel 1 SCI to be used is set to asynchronous mode. When a reset-start is executed after the chip pins have been set to boot mode, the boot program built into the chip is started and the programming control program prepared in the host is serially transmitted to the chip via the SCI. In the chip, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 23.7, and the boot program mode execution procedure in figure 23.8.
The chip
Flash memory
Host
Write data reception Verify data transmission
RxD1 SCI1 TxD1 On-chip RAM
Figure 23.7 System Configuration in Boot Mode
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Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate The chip measures low period of H'00 data transmitted by host The chip calculates bit rate and sets value in bit rate register After bit rate adjustment, transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, trransmit one H'AA data byte to host Host transmits number of user program bytes (N), upper byte followed by lower byte The chip transmits received number of bytes to host as verify data (echo-back) n=1
Host transmits programming control program sequentially in byte units The chip transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks Check that all flash memory data has been erased Check the starting ID code of the area to which the programming control program is to be transferred No No n+1→n
ID code match? Yes The chip transmits one H'AA data byte to the host
Execute programming control program transffered to on-chip RAM
The chip transmits one H'FF data byte as an ID code error and stops the subsequent operations
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted.
Figure 23.8 Boot Mode Execution Procedure
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Automatic SCI Bit Rate Adjustment
Start bit Stop bit
D0
D1
D2
D3
D4
D5
D6
D7
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
Figure 23.9 Automatic SCI Bit Rate Adjustment When boot mode is initiated, the chip measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the chips system clock frequency, there will be a discrepancy between the bit rates of the host and the chip. To ensure correct SCI operation, the host’s transfer bit rate should be set to (4800, 9600, or 19200) bps. Table 23.7 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the chips bit rate is possible. The boot program should be executed within this system clock range. Table 23.7 System Clock Frequencies for Which Automatic Adjustment of the Chips Bit Rate Is Possible
Host Bit Rate 19200 bps 9600 bps 4800 bps System Clock Frequency for Which Automatic Adjustment of Bit Rate Is Possible 8 MHz to 20 MHz 4 MHz to 20 MHz 2 MHz to 18 MHz
On-Chip RAM Area Divisions in Boot Mode In boot mode, the 1920-byte area from H'(FF)E880 to H'(FF) EFFF and the 128-byte area from H'(FF)FF00 to H'(FF)FF7F is reserved for use by the boot program, as shown in figure 23.10. The area to which the programming control program is transferred is H'(FF)E080 to H'(FF)E87F (2048 bytes). In the 64-kbyte version, this is a reserved area that is used only during the boot mode. However, the 8-byte area from H'(FF)E080 to H'(FF)E087 is reserved for ID codes as shown in
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Figure 23.10. The boot program area can be used when the programming control program transferred into the RAM enters the execution state. A stack area should be set up as required.
H'(FF)E080 H'(FF)E088 Programming control program area*1 (2040 bytes) H'(FF)E880 Boot program area*2 (1920 bytes) H'(FF)EFFF H'(FF)FF00 Boot program area*2 (128 bytes)
ID code area*1
H'(FF)FF7F
Notes: 1. In the 64-kbyte version, this is a reserved area that is used only during the boot mode. Do not use this area for other purposes. 2. The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to the RAM. Note that the boot program remains stored in this area after a branch is made to the programming control program.
Figure 23.10 RAM Areas in Boot Mode In the boot mode of this chip, the content in the 8-byte ID code area shown below is confirmed so that whether or not there is a programming control program that corresponds to the chip can be checked.
H'(FF)E080 H'(FF)E088 and above 40 FE 64 66 32 31 34 39
↑ (product identification ID) Instruction code for write control program
When a new programming control program for use in boot mode is created, add the 8-byte ID code described above to the head of the program. Notes on Use of Boot Mode • When the chip comes out of reset in boot mode, it measures the low period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD1 input.
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• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. • Interrupts cannot be used while the flash memory is being programmed or erased. • The RxD1 and TxD1 pins should be pulled up on the board. • Before branching to the programming control program (RAM area H'(FF)E088), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P84DDR = 1, P84DR = 1). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. The initial values of other on-chip registers are not changed. • Boot mode can be entered by making the pin settings shown in table 23.6 and executing a reset-start. 1 When the chip detects the boot mode setting at reset release* , P92, P91, and P90 can be used as I/O ports. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting 1 the mode pins, and executing reset release* . Boot mode can also be cleared by a WDT overflow reset. The mode pin input levels must not be changed in boot mode. • If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) 2 will change according to the change in the microcomputer’s operating mode* . Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: 1. Mode pins input must satisfy the mode programming setup time (tMDS = 4 states) with respect to the reset release timing. 2. Ports with multiplexed address functions will output a low level as the address signal if mode pin setting is for mode 1 is entered during a reset. In other modes, the port pins go to the high-impedance state. The bus control output signals will output a high level if mode pin setting is for mode 1 is entered during a reset. In other modes, the port pins go to the high-impedance state.
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23.6.2
User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing an on-board means of supplying programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip flash memory (mode 2 or 3). In this mode, on-chip supporting modules other than flash memory operate as they normally would in mode 2 and 3. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. Figure 23.11 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
Write the transfer program (and the program/erase control program if necessary) beforehand MD1, MD0 = 10, 11 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area Execute program/erase control program (flash memory rewriting) Branch to flash memory application program Note: The watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc.
Figure 23.11 User Program Mode Execution Procedure
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23.7
Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by software, using the CPU. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes can be made by setting the PSU and ESU bits in FLMCR2, and the P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program that controls flash memory programming/erasing (the programming control program) should be located and executed in on-chip RAM or external memory. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, EV, PV, E, and P bits in FLMCR1, and the ESU and PSU bits in FLMCR2, is executed by a program in flash memory. 2. Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. 23.7.1 Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 23.12 to write data or programs to flash memory. Performing program operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times (x, y, z1, z2, z3, α, ß, γ, ε, η, θ) after setting/clearing individual bits in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of writes (N), see section 26.2.6, Flash Memory Characteristics. Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control register 1 (FLMCR1), 128-byte program data is stored in the program data area and reprogram data area, and the 128-byte data in the reprogram data area written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc. Set a value greater than (y + z2 + α + β) µs as the WDT overflow period. After this, preparation for program mode (program setup) is carried out by setting the PSU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to program mode by setting the P bit in FLMCR1. The time during which the P bit is set is the flash memory programming time. Make a
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program setting so that the time for one programming operation is within the range of (z1), (z2) or (z3) µs. 23.7.2 Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of a given programming time, the programming mode is exited (the P bit in FLMCR1 is cleared, then the PSU bit in FLMCR2 is cleared at least (α) µs later). The watchdog timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to programverify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 23.12) and transferred to the reprogram data area. After 128 bytes of data have been verified, exit program-verify mode, wait for at least (η) µs. If the programming count is less than 6, the 128-byte data in the additional program data area should be written consecutively to the write addresses, and additional programming performed. Next clear the SWE bit in FLMCR1, and wait at least (θ) µs. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. However, ensure that the program/program-verify sequence is not repeated more than (N) times on the same bits.
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Write pulse application subroutine Sub-routine write pulse Enable WDT Set PSU bit in FLMCR1 Wait (y) µs Set P bit in FLMCR1 Wait (z1) µs, (z2) µs or (z3) µs Clear P bit in FLMCR1 Wait (α) µs Clear PSU bit in FLMCR2 Wait (β) µs Disable WDT End sub *6 *6 *5 *6
Start of programming Start Set SWE bit in FLMCR1 Wait (x) µs Store 128-byte program data in program data area and reprogram data area n=1 m=0 *6 *4
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
Write 128-byte data in RAM reprogram data *1 area consecutively to flash memory Sub-routine-call Write pulse See Note 7 for pulse width (z1) µs or (z2) µs *6 Set PV bit in FLMCR1 Wait (γ) µs H'FF dummy write to verify address *6
Increment address
Wait (ε) µs Read verify data
*6 *2 NG m=1 NG n←n+1
Note 7: Write Pulse Width Number of Writes n Write Time (z*6) µsec 1 z1 2 z1 3 z1 4 z1 5 z1 6 z1 7 z2 8 z2 9 z2 10 z2 11 z2 12 z2 13 z2 . . . . . . 998 z2 999 z2 1000 z2 Note: Use a (z3) µs write pulse for additional programming.
Program data = verify data? OK 6 ≥ n? OK Additional program data computation Transfer additional program data to additional program data area Reprogram data computation
*4 *3
Transfer reprogram data to reprogram data area *4 End of 128-byte data verification? OK Clear PV bit in FLMCR1 Wait (η) µs *6 NG
NG
RAM Program data storage area (128 bytes) Reprogram data storage area (128 bytes) Additional program data storage area (128 kbytes)
6 ≥ n?
OK Write 128-byte data in additional program data area in RAM consecutively to flash memory Additional write pulse (z3) µs NG
*1 *6 n ≥ 1000? OK Clear SWE bit in FLMCR1 *6 Wait (θ) µs Programming failure *6 NG
m = 0? OK Clear SWE bit in FLMCR1 Wait (θ) µs End of programming
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. 2. Verify data is read in 16-bit (word) units. 3. Even bits for which programming has been completed in the 128-byte programming loop will be subjected to additional programming if they fail the subsequent verify operation. 4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional program data must be provided in RAM. The reprogram and additional program data contents are modified as programming proceeds. 5. The write pulse of (z1) µs or (z2) µs is applied according to the progress of the programming operation. See Note 7 for the pulse widths. When writing of additional program data is executed, a (z3) µs write pulse should be applied. Reprogram data X means reprogram data when the write pulse is applied. 6. See section 26.2.6, Flash Memory Characteristics, for the values of x, y, z1, z2, z3, α, β, γ, ε, η, θ, and N. Program Data Computation Chart Original Data (D) Verify Data (V) 0 0 1 1 0 1 Reprogram Data (X) 1 0 1 1 Comments Programming completed Programming incomplete; reprogram Still in erased state; no action
Additional Program Data Computation Chart Reprogram Data (X') Verify Data (V) Additional Program Data (Y) Comments Additional programming executed 0 0 0 Additional programming not executed 1 1 1 0 1 Additional programming not executed 1 1
Figure 23.12 Program/Program-Verify Flowchart
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.7.3
Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the erase/erase-verify flowchart (single-block erase) shown in figure 23.13. The wait times (x, y, z, α, β, γ, ε, η, θ) after setting/clearing individual bits in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and the maximum number of erase (N), see section 26.2.6, Flash Memory Characteristics. To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in erase block register 1 or 2 (EBR1 or EBR2) at least (x) µs after setting the SWE bit to 1 in flash memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in the event of program runaway, etc. Set a value greater than (y + z + α + β) ms as the WDT overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the ESU bit in FLMCR2, and after the elapse of (y) µs or more, the operating mode is switched to erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, preprogramming (setting all data in the memory to be erased to 0) is not necessary before starting the erase procedure. 23.7.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared, then the ESU bit in FLMCR2 is cleared at least (α) µs later), the watchdog timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data has not been erased, set erase mode again, and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/eraseverify sequence is not repeated more than (N) times. When verification is completed, exit eraseverify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and wait (θ) µs. If there are any unerased blocks, make a 1 bit setting in EBR1 or EBR2 for the flash memory area to be erased, and repeat the erase/erase-verify sequence in the same way.
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Start
*1
Set SWE bit in FLMCR1 Wait (x) µs n=1 Set EBR1, EBR2 Enable WDT Set ESU bit in FLMCR2 Wait (y) µs Set E bit in FLMCR1 Wait (z) ms Clear E bit in FLMCR1 Wait (α) µs Clear ESU bit in FLMCR2 Wait (β) µs Disable WDT Set EV bit in FLMCR1 Wait (γ) µs Set block start address to verify address *5 *5 *5 Start of erase *5 Halt erase *5 n←n+1 *3 *5
H'FF dummy write to verify address Wait (ε) µs Increment address Read verify data Verify data = all 1? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (η) µs *5 NG *4 End of erasing of all erase blocks? OK n ≥ N? OK Clear SWE bit in FLMCR1 Wait (θ) µs Erase failure Clear EV bit in FLMCR1 Wait (η) µs *5 *5 NG *5 *2 NG
Clear SWE bit in FLMCR1 Wait (θ) µs End of erasing Notes: 1. 2. 3. 4. 5.
Preprogramming (setting erase block data to all 0) is not necessary. Verify data is read in 16-bit (W) units. Set only one bit in EBR1or EBR2. More than one bit cannot be set. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially. See section 26.2.6, Flash Memory Characteristics, for the values of x, y, z, α, β, γ, ε, η, θ, and N.
Figure 23.13 Erase/Erase-Verify Flowchart (Single-Block Erase)
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.8
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 23.8.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR2) and erase block registers 1 and 2 (EBR1, EBR2). (See table 23.8.) Table 23.8 Hardware Protection
Functions Item Reset/standby protection Description • In a reset (including a WDT overflow reset) and in hardware standby mode, software standby mode, subactive mode, subsleep mode, and watch mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. Program Yes Erase Yes
•
23.8.2
Software Protection
Software protection can be implemented by setting the SWE bit in FLMCR1 and erase block registers 1 and 2 (EBR1, EBR2). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode. (See table 23.9.)
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.9 Software Protection
Functions Item SWE bit protection Description • Clearing the SWE bit to 0 in FLMCR1 sets the program/erase-protected state for all blocks. (Execute in on-chip RAM or external memory.) Block specification protection • Erase protection can be set for individual blocks by settings in erase block registers 1 and 2 (EBR1, EBR2). Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. — Yes Program Yes Erase Yes
•
23.8.3
Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: • When flash memory is read during programming/erasing (including a vector read or instruction fetch) • Immediately after exception handling (excluding a reset) during programming/erasing • When a SLEEP instruction (including software standby, sleep, subactive, subsleep and watch mode) is executed during programming/erasing • When the bus is released during programming/erasing Error protection is released only by a reset and in hardware standby mode. Figure 23.14 shows the flash memory state transition diagram.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Normal operation mode Program mode Erase mode RD VF PR ER FLER = 0
RES = 0 or STBY = 0
Reset or hardware standby (hardware protection) RD VF PR ER FLER = 0
Error occurrence*2 Error occurrence*1
RES = 0 or STBY = 0 RES = 0 or STBY = 0
FLMCR1, FLMCR2, EBR1, EBR2 initialization state
Error protection mode
Software standby, sleep, subsleep, and watch mode
Error protection mode (software standby, sleep, subsleep, and watch ) RD VF PR ER FLER = 1 FLMCR1, FLMCR2 (except FLER bit), EBR1, EBR2 initialization state*3
RD VF*4 PR ER FLER = 1
Software standby, sleep, subsleep, and watch mode release
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible
Notes: 1. When an error occurs other than due to a SLEEP instruction, or when a SLEEP instruction is executed for a transition to subactive mode 2. When an error occurs due to a SLEEP instruction (except subactive mode) 3. Except sleep mode 4. VF in subactive mode
Figure 23.14 Flash Memory State Transitions
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.9
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input is disabled when flash memory is being programmed or erased 1 (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode* , to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would 2 not be read correctly* , possibly resulting in MCU runaway. 3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests, including NMI input, must therefore be disabled inside and outside the MCU when programming or erasing flash memory. Interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly.
•
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.10
Flash Memory Programmer Mode
23.10.1 Programmer Mode Setting Programs and data can be written and erased in programmer mode as well as in the on-board programming modes. In programmer mode, the on-chip ROM can be freely programmed using a PROM programmer that supports Renesas Technology microcomputer device types with 128kbyte or 64-kbyte on-chip flash memory*. See section 23.10.10, Notes on Memory Programming and section 23.11, Flash Memory Programming and Erasing Precautions, for notes on programmer mode. Flash memory read mode, auto-program mode, auto-erase mode, and status read mode are supported with these device types. In auto-program mode, auto-erase mode, and status read mode, a status polling procedure is used, and in status read mode, detailed internal signals are output after execution of an auto-program or auto-erase operation. Table 23.10 shows programmer mode pin settings. Note: * Use products of the H8S/2148 A-mask version, H8S/2147 A-mask version, and H8S/2144 A-mask version (in either 5-V or 3-V version) with the writing voltage for PROM programmer set to 3.3 V. Do not use products other than the A-mask version with 3.3V PROM programmer setting. Table 23.10 Programmer Mode Pin Settings
Pin Names Mode pins: MD1, MD0 STBY pin RES pin XTAL and EXTAL pins Other setting pins: P97, P92, P91, P90, P67 Setting/External Circuit Connection Low-level input to MD1, MD0 High-level input (Hardware standby mode not set) Power-on reset circuit Oscillation circuit Low-level input to p92, p67, high-level input to P97, P91, P90
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.10.2 Socket Adapters and Memory Map In programmer mode, a socket adapter is mounted on the writer programmer to match the package concerned. Socket adapters are available for each writer manufacturer supporting Renesas Technology microcomputer device types with 128-kbyte or 64-kbyte on-chip flash memory (VPP = 3.3 V). Figure 23.15 shows the memory map in programmer mode. For pin names in programmer mode, see section 1.3.2, Pin Functions in Each Operating Mode.
H8S/2148 A-mask version H8S/2144 A-mask version MCU mode H'000000 On-chip ROM area H'01FFFF H'1FFFF Programmer mode H'00000 H8S/2147 A-mask version MCU mode H'000000 On-chip ROM area H'00FFFF Undefined value output H'1FFFF H'0FFFF Programmer mode H'00000
Figure 23.15 Memory Map in Programmer Mode 23.10.3 Programmer Mode Operation Table 23.11 shows how the different operating modes are set when using programmer mode, and table 23.12 lists the commands used in programmer mode. Details of each mode are given below. • Memory Read Mode Memory read mode supports byte reads. • Auto-Program Mode Auto-program mode supports programming of 128 bytes at a time. Status polling is used to confirm the end of auto-programming. • Auto-Erase Mode Auto-erase mode supports automatic erasing of the entire flash memory. Status polling is used to confirm the end of auto-erasing. • Status Read Mode Status polling is used for auto-programming and auto-erasing, and normal termination can be confirmed by reading the FO6 signal. In status read mode, error information is output if an error occurs.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.11 Settings for Each Operating Mode in Programmer Mode
Pin Names Mode Read Output disable Command write 1 Chip disable* CE L L L H OE L H H X WE H H L X FO0 to FO7 Data output Hi-Z Data input Hi-Z FA0 to FA17 Ain X Ain* X
2
Notes: 1. Chip disable is not a standby state; internally, it is an operation state. 2. Ain indicates that there is also address input in auto-program mode.
Table 23.12 Programmer Mode Commands
Number of Cycles 1+n 129 2 2 1st Cycle Mode Write Write Write Write Address Data X X X X H'00 H'40 H'20 H'71 Mode Read Write Write Write 2nd Cycle Address Data RA WA X X Dout Din H'20 H'71
Command Name Memory read mode Auto-program mode Auto-erase mode Status read mode
Notes: 1. In auto-program mode. 129 cycles are required for command writing by a simultaneous 128-byte write. 2. In memory read mode, the number of cycles depends on the number of address write cycles (n).
23.10.4 Memory Read Mode • After the end of an auto-program, auto-erase, or status read operation, the command wait state is entered. To read memory contents, a transition must be made to memory read mode by means of a command write before the read is executed. • Command writes can be performed in memory read mode, just as in the command wait state. • Once memory read mode has been entered, consecutive reads can be performed. • After power-on, memory read mode is entered.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.13 AC Characteristics in Memory Read Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tr tf Min 20 0 0 50 50 70 — — Max — — — — — — 30 30 Unit µs ns ns ns ns ns ns ns
Command write FA17 to FA0
Memory read mode Address stable
CE OE WE FO7 to FO0
twep
tceh
tnxtc
tces tf tr Data tdh tds Data
Note: Data is latched on the rising edge of WE.
Figure 23.16 Memory Read Mode Timing Waveforms after Command Write
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.14 AC Characteristics when Entering Another Mode from Memory Read Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tr tf Min 20 0 0 50 50 70 — — Max — — — — — — 30 30 Unit µs ns ns ns ns ns ns ns
Memory read mode FA17 to FA0 Address stable
Other mode command write
CE OE WE FO7 to FO0 tnxtc tces tf
twep
tceh
tr H'XX tdh
Data
Note: Do not enable WE and OE at the same time.
tds
Figure 23.17 Timing Waveforms when Entering Another Mode from Memory Read Mode
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.15 AC Characteristics in Memory Read Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Access time CE output delay time OE output delay time Output disable delay time Data output hold time Symbol tacc tce toe tdf toh Min — — — — 5 Max 20 150 150 100 — Unit µs ns ns ns ns
FA17 to FA0 CE OE WE
Address stable
Address stable VIL tacc VIL VIH
tacc FO7 to FO0 Data
toh Data
toh
Figure 23.18 Timing Waveforms for CE/OE Enable State Read CE
FA17 to FA0
Address stable
Address stable tacc
CE OE WE tacc FO7 to FO0
tce toe
tce toe VIH
tdf Data toh Data
tdf
toh
Figure 23.19 Timing Waveforms for CE/OE Clocked Read CE
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.10.5 Auto-Program Mode AC Characteristics Table 23.16 AC Characteristics in Auto-Program Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width Status polling start time Status polling access time Address setup time Address hold time Memory write time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep twsts tspa tas tah twrite tr tf Min 20 0 0 50 50 70 1 — 0 60 1 — — Max — — — — — — — 150 — — 3000 30 30 Unit µs ns ns ns ns ns ms ns ns ns ms ns ns
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
FA17 to FA0 CE OE twep WE tces tf tds tdh FO6 FO7 to FO0
H'40
Address stable
tceh tnxtc
tas
tah
tnxtc
Data transfer 1 byte to 128 bytes
twsts tspa twrite (1 to 3000 ms)
Programming operation end identification signal
FO7
tr
Programming normal end identification signal
Programming wait
Data
Data
FO0 to FO5 = 0
Figure 23.20 Auto-Program Mode Timing Waveforms Notes on Use of Auto-Program Mode • In auto-program mode, 128 bytes are programmed simultaneously. This should be carried out by executing 128 consecutive byte transfers. • A 128-byte data transfer is necessary even when programming fewer than 128 bytes. In this case, H'FF data must be written to the extra addresses. • The lower 8 bits of the transfer address must be H'00 or H'80. If a value other than an effective address is input, processing will switch to a memory write operation but a write error will be flagged. • Memory address transfer is performed in the second cycle (figure 23.20). Do not perform transfer after the second cycle. • Do not perform a command write during a programming operation. • Perform one auto-programming operation for a 128-byte block for each address. Characteristics are not guaranteed for two or more programming operations. • Confirm normal end of auto-programming by checking FO6. Alternatively, status read mode can also be used for this purpose (FO7 status polling uses the auto-program operation end identification pin). • The status polling FO6 and FO7 pin information is retained until the next command write. Until the next command write is performed, reading is possible by enabling CE and OE.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.10.6
Auto-Erase Mode
AC Characteristics Table 23.17 AC Characteristics in Auto-Erase Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width Status polling start time Status polling access time Memory erase time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep tests tspa terase tr tf Min 20 0 0 50 50 70 1 — 100 — — Max — — — — — — — 150 40000 30 30 Unit µs ns ns ns ns ns ms ns ms ns ns
FA17 to FA0 tces CE OE WE FO7 FO6 CLin FO7 to FO0 H'20 DLin H'20 FO0 to FO5 = 0 tf tds tdh tspa twep tr tnxtc tests terase (100 to 40000 ms)
Erase end identification signal Erase normal end confirmation signal
tceh
tnxtc
Figure 23.21 Auto-Erase Mode Timing Waveforms
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Notes on Use of Auto-Erase-Program Mode • Auto-erase mode supports only entire memory erasing. • Do not perform a command write during auto-erasing. • Confirm normal end of auto-erasing by checking FO6. Alternatively, status read mode can also be used for this purpose (FO7 status polling uses the auto-erase operation end identification pin). • The status polling FO6 and FO7 pin information is retained until the next command write. Until the next command write is performed, reading is possible by enabling CE and OE. 23.10.7 Status Read Mode • Status read mode is used to identify what type of abnormal end has occurred. Use this mode when an abnormal end occurs in auto-program mode or auto-erase mode. • The return code is retained until a command write for other than status read mode is performed. Table 23.18 AC Characteristics in Status Read Mode Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Command write cycle CE hold time CE setup time Data hold time Data setup time Write pulse width OE output delay time Disable delay time CE output delay time WE rise time WE fall time Symbol tnxtc tceh tces tdh tds twep toe tdf tce tr tf Min 20 0 0 50 50 70 — — — — — Max — — — — — — 150 100 150 30 30 Unit µs ns ns ns ns ns ns ns ns ns ns
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
FA17 to FA0
CE tce OE WE twep tces tf tds tdh FO7 to FO0 H'71 tceh tr tnxtc tces tf tds tdh H'71 Data twep tceh tr tnxtc toe tnxtc
tdf
Note: FO2 and FO3 are undefined.
Figure 23.22 Status Read Mode Timing Waveforms Table 23.19 Status Read Mode Return Commands
Pin Name Attribute FO7 FO6 FO5 Programming error FO4 Erase error FO3 — FO2 — FO1 Programming or erase count exceeded 0 FO0 Effective address error 0
Normal Command end error identification 0 Command error: 1
Initial value 0 Indications Normal end: 0 Abnormal end: 1
0
0
0
0 —
Erase — Programerror: 1 ming Otherwise: 0 Otherwise: 0 error: 1 Otherwise: 0
Count Effective exceeded: 1 address Otherwise: 0 error: 1 Otherwise: 0
Note: FO2 and FO3 are undefined.
23.10.8 Status Polling • The FO7 status polling flag indicates the operating status in auto-program or auto-erase mode. • The FO6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase mode.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Table 23.20 Status Polling Output Truth Table
Pin Names FO7 FO6 FO0 to FO5 Internal Operation in Progress 0 0 0 Abnormal End 1 0 0 — 0 1 0 Normal End 1 1 0
23.10.9 Programmer Mode Transition Time Commands cannot be accepted during the oscillation stabilization period or the programmer mode setup period. After the programmer mode setup time, a transition is made to memory read mode. Table 23.21 Command Wait State Transition Time Specifications
Item Standby release (oscillation stabilization time) Programmer mode setup time VCC hold time Symbol tosc1 tbmv tdwn Min 20 10 0 Max — — — Unit ms ms ms
VCC RES
tosc1
tbmv
Memory read Auto-program mode mode Auto-erase mode Command wait state
tdwn
Command Don't care wait state Normal/ abnormal end identification
Command acceptance
Figure 23.23 Oscillation Stabilization Time, Programmer Mode Setup Time, and Power Supply Fall Sequence
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
23.10.10 Notes on Memory Programming • When programming addresses which have previously been programmed, carry out autoerasing before auto-programming. • When performing programming using programmer mode on a chip that has been programmed/erased in an on-board programming mode, auto-erasing is recommended before carrying out auto-programming. Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas. For other chips for which the erasure history is unknown, it is recommended that autoerasing be executed to check and supplement the initialization (erase) level. 2. Auto-programming should be performed once only on the same address block.
23.11
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode and programmer mode are summarized below. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. For a PROM programmer, use Renesas Technology microcomputer device types with 128-kbyte or 64-kbyte on-chip flash memory that support a 3.3-V programming voltage. Do not select the HN28F101, or use a programming voltage of 5.0 V for the PROM programmer, and only use the specified socket adapter. Incorrect use will result in damaging the device. Powering on and off When applying or disconnecting VCC, fix the RES pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc.
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Section 23 ROM (H8S/2148 F-ZTAT A-Mask Version, H8S/2147 F-ZTAT A-Mask Version, H8S/2144 F-ZTAT A-Mask Version)
Do not set or clear the SWE bit during program execution in flash memory. Wait for at least 100 µs after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1 the flash memory can only be read in program-verify or erase-verify mode. Flash memory should only be accessed for verify operations (verification during programming/erasing). Do not clear the SWE bit during a program, erase, or verify operation. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled when programming and erasing flash memory to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. In programmer mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer. Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors.
23.12
Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version does not have the internal registers for flash memory control that are provided in the F-ZTAT version. Table 23.22 lists the registers that are present in the F-ZTAT version but not in the mask ROM version. If a register listed in table 23.22 is read in the mask ROM version, an undefined value will be returned. Therefore, if application software developed on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure that the registers in table 23.22 have no effect Table 23.22 Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Register Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 Address H'FF80 H'FF81 H'FF82 H'FF83
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Section 24 Clock Pulse Generator
Section 24 Clock Pulse Generator
24.1 Overview
This LSI have a built-in clock pulse generator (CPG) that generates the system clock (φ), the bus master clock, and internal clocks. The clock pulse generator consists of an oscillator circuit, a duty adjustment circuit, clock selection circuit, medium-speed clock divider, bus master clock selection circuit, subclock input circuit, and waveform shaping circuit. 24.1.1 Block Diagram
Figure 24.1 shows a block diagram of the clock pulse generator.
EXTAL Oscillator XTAL
Duty adjustment circuit
Medium-speed clock divider Clock selection circuit
φ/2 to φ/32
Bus master clock selection circuit
φSUB
φ
EXCL
Subclock input circuit
Waveform shaping circuit
System clock To φ pin
Internal clock To supporting modules
Bus master clock To CPU, DTC
WDT1 count clock
Figure 24.1 Block Diagram of Clock Pulse Generator
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Section 24 Clock Pulse Generator
24.1.2
Register Configuration
The clock pulse generator is controlled by the standby control register (SBYCR) and low-power control register (LPWRCR). Table 24.1 shows the register configuration. Table 24.1 CPG Registers
Name Standby control register Low-power control register Note: * Abbreviation SBYCR LPWRCR R/W R/W R/W Initial Value H'00 H'00 Address* H'FF84 H'FF85
Lower 16 bits of the address.
24.2
24.2.1
Bit
Register Descriptions
Standby Control Register (SBYCR)
7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 — 0 — 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
Initial value Read/Write
SBYCR is an 8-bit readable/writable register that performs power-down mode control. Only bits 0 to 2 are described here. For a description of the other bits, see section 25.2.1, Standby Control Register (SBYCR). SBYCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): These bits select the bus master clock for high-speed mode and medium-speed mode. When operating the device after a transition to subactive mode or watch mode bits SCK2 to SCK0 should all be cleared to 0.
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Section 24 Clock Pulse Generator Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master is in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
24.2.2
Bit
Low-Power Control Register (LPWRCR)
7 DTON 0 R/W 6 LSON 0 R/W 5 NESEL 0 R/W 4 EXCLE 0 R/W 3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
Initial value Read/Write
LPWRCR is an 8-bit readable/writable register that performs power-down mode control. Only bit 4 is described here. For a description of the other bits, see section 25.2.2, Low-Power Control Register (LPWRCR). LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 4—Subclock Input Enable (EXCLE): Controls subclock input from the EXCL pin.
Bit 4 EXCLE 0 1 Description Subclock input from EXCL pin is disabled Subclock input from EXCL pin is enabled (Initial value)
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Section 24 Clock Pulse Generator
24.3
Oscillator
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock. 24.3.1 Connecting a Crystal Resonator
Circuit Configuration A crystal resonator can be connected as shown in the example in figure 24.2. Select the damping resistance Rd according to table 24.2. An AT-cut parallel-resonance crystal should be used.
CL1 EXTAL XTAL Rd CL2 CL1 = CL2 = 10 to 22 pF
Figure 24.2 Connection of Crystal Resonator (Example) Table 24.2 Damping Resistance Value
Frequency (MHz) Rd (Ω ) 2 1k 4 500 8 200 10 0 12 0 16 0 20 0
Crystal resonator Figure 24.3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has the characteristics shown in table 24.3 and the same frequency as the system clock (φ).
CL L XTAL Rs EXTAL AT-cut parallel-resonance type
C0
Figure 24.3 Crystal Resonator Equivalent Circuit
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Section 24 Clock Pulse Generator
Table 24.3 Crystal Resonator Parameters
Frequency (MHz) RS max (Ω) C0 max (pF) 2 500 7 4 120 7 8 80 7 10 70 7 12 60 7 16 50 7 20 40 7
Note on Board Design When a crystal resonator is connected, the following points should be noted. Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 24.4. When designing the board, place the crystal resonator and its load capacitors as close as possible to the XTAL and EXTAL pins.
Avoid CL2 XTAL EXTAL CL1 Signal A Signal B This LSI
Figure 24.4 Example of Incorrect Board Design
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Section 24 Clock Pulse Generator
24.3.2
External Clock Input
Circuit Configuration An external clock signal can be input as shown in the examples in figure 24.5. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF. In example (b), make sure that the external clock is held high in standby mode, subactive mode, subsleep mode, and watch mode.
EXTAL XTAL Open
External clock input
(a) XTAL pin left open
EXTAL XTAL
External clock input
(b) Complementary clock input at XTAL pin
Figure 24.5 External Clock Input (Examples)
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Section 24 Clock Pulse Generator
External Clock The external clock signal should have the same frequency as the system clock (φ). Table 24.4 and figure 24.6 show the input conditions for the external clock. Table 24.4 External Clock Input Conditions
VCC = 2.7 to 5.5 V Item External clock input low pulse width Symbol Min tEXL 40 Max — VCC = 5.0 V ±10% Min 20 Max — Unit ns Test Conditions Figure 24.6
External clock tEXH input high pulse width External clock rise time External clock fall time Clock low pulse width Clock high pulse width tEXr tEXf tCL tCH
40
—
20
—
ns
— — 0.4 80 0.4 80
10 10 0.6 — 0.6 —
— — 0.4 80 0.4 80
5 5 0.6 — 0.6 —
ns ns tcyc ns tcyc ns φ ≥ 5 MHz Figure 26.5 φ < 5 MHz φ ≥ 5 MHz φ < 5 MHz
tEXH
tEXL
EXTAL
VCC × 0.5
tEXr
tEXf
Figure 24.6 External Clock Input Timing Table 24.5 shows the external clock output settling delay time, and figure 24.7 shows the external clock output settling delay timing. The oscillator and duty adjustment circuit have a function for adjusting the waveform of the external clock input at the EXTAL pin. When the prescribed clock signal is input at the EXTAL pin, internal clock signal output is fixed after the elapse of the
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Section 24 Clock Pulse Generator
external clock output settling delay time (tDEXT). As the clock signal output is not fixed during the tDEXT period, the reset signal should be driven low to maintain the reset state. Table 24.5 External Clock Output Settling Delay Time Conditions: VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0 V
Item External clock output settling delay time Note: * Symbol tDEXT * Min 500 Max — Unit µs Notes Figure 24.7
tDEXT includes RES pulse width (tRESW).
VCC
2.7V
STBY
VIH
EXTAL
φ (internal or external)
RES tDEXT*
Note: * tDEXT includes RES pulse width (tRESW).
Figure 24.7 External Clock Output Settling Delay Timing
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Section 24 Clock Pulse Generator
24.4
Duty Adjustment Circuit
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to generate the system clock (φ).
24.5
Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and φ/32 clocks.
24.6
Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the system clock (φ) or one of the medium-speed clocks (φ/2, φ/4, φ/8, φ/16, or φ/32) to be supplied to the bus master, according to the settings of bits SCK2 to SCK0 in SBYCR.
24.7
Subclock Input Circuit
The subclock input circuit controls the subclock input from the EXCL pin. Inputting the Subclock When a subclock is used, a 32.768 kHz external clock should be input from the EXCL pin. In this case, clear bit P96DDR to 0 in P9DDR and set bit EXCLE to 1 in LPWRCR. The subclock input conditions are shown in table 24.6 and figure 24.8. Table 24.6 Subclock Input Conditions
VCC = 2.7 to 5.5 V Item Subclock input low pulse width Subclock input high pulse width Subclock input rise time Subclock input fall time Symbol tEXCLL tEXCLH tEXCLr tEXCLf Min — — — — Typ 15.26 15.26 — — Max — — 10 10 Unit µs µs ns ns Test Conditions Figure 24.8
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Section 24 Clock Pulse Generator
tEXCLH
tEXCLL
EXCL
VCC × 0.5
tEXCLr
tEXCLf
Figure 24.8 Subclock Input Timing When Subclock Is Not Needed Do not enable subclock input when the subclock is not needed Note on Subclock Usage In transiting to power-down mode, if at least two cycles of the 32-kHz clock are not input after the 32-kHz clock input is enabled (EXCLE = 1) until the SLEEP instruction is executed (power-down mode transition), the subclock input circuit is not initialized and an error may occur in the microcomputer. Before power-down mode is entered with using the subclock, at least two cycle of the 32-kHz clock should be input after the 32-kHz clock input is enabled (EXCLE = 1). As described in the hardware manual (clock pulse generator/subclock input circuit), when the subclock is not used, the subclock input should not be enabled (EXCLE = 0).
24.8
Subclock Waveform Shaping Circuit
To eliminate noise in the subclock input from the EXCL pin, this circuit samples the clock using a clock obtained by dividing the φ clock. The sampling frequency is set with the NESEL bit in LPWRCR. For details, see sections 24.2.2 and 25.2.2, Low-Power Control Register (LPWRCR). The clock is not sampled in subactive mode, subsleep mode, or watch mode.
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Section 24 Clock Pulse Generator
24.9
Clock Selection Circuit
This circuit selects the system clock used in the MCU. The clock signal generated in the EXTAL/XTAL pin oscillator is selected as the system clock when MCU is returned from high-speed mode, medium-speed mode, sleep mode, reset state, or standby mode. In sub-active mode, sub-sleep mode, and watch mode, the sub-clock signal input from EXCL pin is selected as the system clock. In these modes, modules such as CPU, TMR0, TMR1, WDT0, WDT1, and I/O ports operate on the φ SUB clock. The count clock for each timer is a clock obtained by driving the φ SUB clock.
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Section 24 Clock Pulse Generator
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Section 25 Power-Down State
Section 25 Power-Down State
25.1 Overview
In addition to the normal program execution state, this LSI have a power-down state in which operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU, on-chip supporting modules, and so on. This LSI has the following operating modes: 1. High-speed mode 2. Medium-speed mode 3. Subactive mode 4. Sleep mode 5. Subsleep mode 6. Watch mode 7. Module stop mode 8. Software standby mode 9. Hardware standby mode Of these, 2 to 9 are power-down modes. Sleep mode and subsleep mode are CPU modes, mediumspeed mode is a CPU and bus master mode, subactive mode is a CPU, bus master, and on-chip supporting module mode, and module stop mode is an on-chip supporting module mode (including bus masters other than the CPU). Certain combinations of these modes can be set. After a reset, the MCU is in high-speed mode and module stop mode (excluding the DTC). Table 25.1 shows the internal chip states in each mode, and table 25.2 shows the conditions for transition to the various modes. Figure 25.1 shows a mode transition diagram.
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Section 25 Power-Down State
Table 25.1 Internal States in Each Mode
Function System clock oscillator Subclock input CPU operation Instructions HighSpeed Functioning Functioning Functioning MediumSpeed Functioning Functioning Mediumspeed Mediumspeed Functioning Sleep Functioning Functioning Halted Retained Functioning Module Stop Functioning Functioning Functioning Functioning Functioning Watch Halted Functioning Halted Retained Functioning Subactive Subsleep Halted Functioning Subclock operation Subclock operation Functioning Halted Functioning Halted Retained Functioning Software Hardware Standby Standby Halted Halted Halted Retained Functioning Halted Halted Halted Undefined Halted
Registers Functioning External interrupts NMI IRQ0 IRQ1 IRQ2 On-chip DTC supporting module operation WDT1 WDT0 Functioning Functioning Functioning Functioning
Mediumspeed Functioning Functioning Functioning Functioning
Functioning Functioning Functioning Functioning Functioning
Function- Halted Halted Halted Halted Halted ing/halted (retained) (retained) (retained) (retained) (reset) (retained) Functioning Functioning Subclock operation Subclock operation Subclock operation Subclock operation Subclock operation Halted Halted (retained) (reset) Halted Halted (retained) (reset) Halted Halted (retained) (reset)
Halted Subclock (retained) operation
TMR0, 1 Functioning FRT TMRX, Y Timer connection IIC0 IIC1 SCI0 SCI1 SCI2 PWM PWMX HIF, PS2 D/A A/D RAM I/O Functioning Functioning Functioning Functioning
Function- Halted Subclock ing/halted (retained) operation (retained)
Function- Halted Halted Halted Halted Halted ing/halted (retained) (retained) (retained) (retained) (reset) (retained)
Functioning
Functioning
Function- Halted ing/halted (reset) (reset)
Halted (reset)
Halted (reset)
Halted (reset)
Halted (reset)
Functioning Functioning
Function- Functioning (DTC) ing Functioning Functioning
Retained Retained
Functioning Functioning
Retained Retained
Retained Retained
Retained High impedance
Notes: “Halted (retained)” means that internal register values are retained. The internal state is “operation suspended.” “Halted (reset)” means that internal register values and internal states are initialized. In module stop mode, only modules for which a stop setting has been made are halted (reset or retained).
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Section 25 Power-Down State
Program-halted state STBY pin = low Reset state STBY pin = high RES pin = low Hardware standby mode
RES pin = high Program execution state SLEEP instruction Any interrupt*3 SLEEP instruction External interrupt*4 SLEEP instruction SSBY = 1 PSS = 1, DTON = 0 Watch mode (subclock) SSBY = 1 PSS = 0, LSON = 0 Software standby mode SSBY = 0, LSON = 0 Sleep mode (main clock)
High-speed mode (main clock)
SCK2 to SCK0 = 0
SCK2 to SCK0 ≠ 0
Medium-speed mode (main clock)
SLEEP instruction SSBY = 1, PSS = 1, DTON = 1, LSON = 0 Clock switching exception handling after oscillation setting time (STS2 to STS0)
Interrupt*1, SLEEP instruction LSON bit = 0 SSBY = 1, PSS = 1, DTON = 1, LSON = 1 Clock switching SLEEP exception handling instruction Interrupt*1, LSON bit = 1 SLEEP instruction Interrupt*2
SSBY = 0 PSS = 1, LSON = 1 Subsleep mode (subclock)
Subactive mode (subclock)
: Transition after exception handling
: Power-down mode
Notes: When a transition is made between modes by means of an interrupt, transition cannot be made on interrupt source generation alone. Ensure that interrupt handling is performed after accepting the interrupt request. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. From any state, a transition to hardware standby mode occurs when STBY goes low. When a transition is made to watch mode or subactive mode, high-speed mode must be set. 1. 2. 3. 4. NMI, IRQ0 to IRQ2, IRQ6, IRQ7, and WDT1 interrupts NMI, IRQ0 to IRQ7, and WDT0 interrupts, WDT1 interrupt, TMR0 interrupt, TMR1 interrupt All interrupts NMI, IRQ0 to IRQ2, IRQ6, IRQ7
Figure 25.1 Mode Transitions
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Section 25 Power-Down State
Table 25.2 Power-Down Mode Transition Conditions
Control Bit States at Time of Transition SSBY PSS * * 0 0 1 1 1 1 0 1 1 0 1 1 1 1 LSON 0 1 0 1 0 1 0 1 * 0 1 * 0 1 0 1 DTON * * * * 0 0 1 1 * * * * 0 0 1 1
State before Transition
State after Transition by SLEEP Instruction Sleep — Software standby — Watch Watch — Subactive — — Subsleep — Watch Watch High-speed —
State after Return by Interrupt High-speed/ medium-speed — High-speed/ medium-speed — High-speed Subactive — — — — Subactive — High-speed Subactive — —
High-speed/ 0 medium-speed 0 1 1 1 1 1 1 Subactive 0 0 0 1 1 1 1 1 Legend: *: Don’t care —: Do not set.
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Section 25 Power-Down State
25.1.1
Register Configuration
The power-down state is controlled by the SBYCR, LPWRCR, TCSR (WDT1), and MSTPCR registers. Table 25.3 summarizes these registers. Table 25.3 Power-Down State Registers
Name Standby control register Low-power control register Timer control/status register (WDT1) Module stop control register Abbreviation SBYCR LPWRCR TCSR MSTPCRH MSTPCRL R/W R/W R/W R/W R/W R/W Initial Value H'00 H'00 H'00 H'3F H'FF
1 Address*
H'FF84* 2 H'FF85*
2
H'FFEA H'FF86* 2 H'FF87*
2
Notes: 1. Lower 16 bits of the address. 2. Some power down state registers are assigned to the same address as other registers. In this case, register selection is performed by the FLSHE bit in the serial timer control register (STCR).
25.2
25.2.1
Bit
Register Descriptions
Standby Control Register (SBYCR)
7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 — 0 — 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
Initial value Read/Write
SBYCR is an 8-bit readable/writable register that performs power-down mode control. SBYCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Section 25 Power-Down State
Bit 7—Software Standby (SSBY): Determines the operating mode, in combination with other control bits, when a power-down mode transition is made by executing a SLEEP instruction. The SSBY setting is not changed by a mode transition due to an interrupt, etc.
Bit 7 SSBY 0 Description Transition to sleep mode after execution of SLEEP instruction in high-speed mode or medium-speed mode (Initial value) Transition to subsleep mode after execution of SLEEP instruction in subactive mode 1 Transition to software standby mode, subactive mode, or watch mode after execution of SLEEP instruction in high-speed mode or medium-speed mode Transition to watch mode or high-speed mode after execution of SLEEP instruction in subactive mode
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the time the MCU waits for the clock to stabilize when software standby mode, watch mode, or subactive mode is cleared and a transition is made to high-speed mode or medium-speed mode by means of a specific interrupt or instruction. With crystal oscillation, refer to table 25.4 and make a selection according to the operating frequency so that the standby time is at least 8 ms (the oscillation settling time). With an external clock, any selection can be made.
Bit 6 STS2 0 Bit 5 STS1 0 1 1 0 1 Note: * Bit 4 STS0 0 1 0 1 0 1 0 1 Description Standby time = 8192 states Standby time = 16384 states Standby time = 32768 states Standby time = 65536 states Standby time = 131072 states Standby time = 262144 states Reserved Standby time = 16 states* (Initial value)
This setting must not be used in the flash memory version.
Bit 3—Reserved: This bit cannot be modified and is always read as 0.
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Section 25 Power-Down State
Bits 2 to 0—System Clock Select (SCK2 to SCK0): These bits select the clock for the bus master in high-speed mode and medium-speed mode. When operating the device after a transition to subactive mode or watch mode, bits SCK2 to SCK0 should all be cleared to 0.
Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master is in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
25.2.2
Bit
Low-Power Control Register (LPWRCR)
7 DTON 0 R/W 6 LSON 0 R/W 5 NESEL 0 R/W 4 EXCLE 0 R/W 3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
Initial value Read/Write
LPWRCR is an 8-bit readable/writable register that performs power-down mode control. LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Direct-Transfer On Flag (DTON): Specifies whether a direct transition is made between high-speed mode, medium-speed mode, and subactive mode when making a power-down transition by executing a SLEEP instruction. The operating mode to which the transition is made after SLEEP instruction execution is determined by a combination of other control bits.
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Section 25 Power-Down State Bit 7 DTON 0 Description When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode, software standby mode, or watch mode* When a SLEEP instruction is executed in subactive mode, a transition is made to subsleep mode or watch mode (Initial value) 1 When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made directly to subactive mode*, or a transition is made to sleep mode or software standby mode When a SLEEP instruction is executed in subactive mode, a transition is made directly to high-speed mode, or a transition is made to subsleep mode Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be set.
Bit 6—Low-Speed On Flag (LSON): Determines the operating mode in combination with other control bits when making a power-down transition by executing a SLEEP instruction. Also controls whether a transition is made to high-speed mode or to subactive mode when watch mode is cleared.
Bit 6 LSON 0 Description When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode, software standby mode, or watch mode* When a SLEEP instruction is executed in subactive mode, a transition is made to watch mode, or directly to high-speed mode After watch mode is cleared, a transition is made to high-speed mode 1 (Initial value) When a SLEEP instruction is executed in high-speed mode a transition is made to watch mode or subactive mode* When a SLEEP instruction is executed in subactive mode, a transition is made to subsleep mode or watch mode After watch mode is cleared, a transition is made to subactive mode Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be set.
Bit 5—Noise Elimination Sampling Frequency Select (NESEL): Selects the frequency at which the subclock (φSUB) input from the EXCL pin is sampled with the clock (φ) generated by the system clock oscillator. When φ = 5 MHz or higher, clear this bit to 0.
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Section 25 Power-Down State Bit 5 NESEL 0 1 Description Sampling at φ divided by 32 Sampling at φ divided by 4 (Initial value)
Bit 4—Subclock Input Enable (EXCLE): Controls subclock input from the EXCL pin.
Bit 4 EXCLE 0 1 Description Subclock input from EXCL pin is disabled Subclock input from EXCL pin is enabled (Initial value)
Bits 3 to 0—Reserved: These bits cannot be modified and are always read as 0. 25.2.3 TCSR1
Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 PSS 0 R/W 3 RST/NMI 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Timer Control/Status Register (TCSR)
Note: * Only 0 can be written in bit 7, to clear the flag.
TCSR1 is an 8-bit readable/writable register that performs selection of the WDT1 TCNT input clock, mode, etc. Only bit 4 is described here. For details of the other bits, see section 14.2.2, Timer Control/Status Register (TCSR). TCSR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 4—Prescaler Select (PSS): Selects the WDT1 TCNT input clock. This bit also controls the operation in a power-down mode transition. The operating mode to which a transition is made after execution of a SLEEP instruction is determined in combination with other control bits.
Rev. 4.00 Sep 27, 2006 page 751 of 1130 REJ09B0327-0400
Section 25 Power-Down State
For details, see the description of Clock Select 2 to 0 in section 14.2.2, Timer Control/Status Register (TCSR).
Bit 4 PSS 0 Description TCNT counts φ-based prescaler (PSM) divided clock pulses When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode or software standby mode (Initial value) 1 TCNT counts φSUB-based prescaler (PSM) divided clock pulses When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode, watch mode*, or subactive mode* When a SLEEP instruction is executed in subactive mode, a transition is made to subsleep mode, watch mode, or high-speed mode Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be set.
25.2.4
Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
2 1 0 7 6 5 4 3 2 1 0
Bit Initial value Read/Write
7
6
5
4
3
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR comprises two 8-bit readable/writable registers that perform module stop mode control. MSTPCR is initialized to H'3FFF by a reset and in hardware standby mode. It is not initialized in software standby mode. MSTRCRH and MSTPCRL Bits 7 to 0—Module Stop (MSTP 15 to MSTP 0): These bits specify module stop mode. See table 25.4 for the method of selecting on-chip supporting modules.
MSTPCRH, MSTPCRL Bits 7 to 0 MSTP15 to MSTP0 0 1 Description Module stop mode is cleared Module stop mode is set (Initial value of MSTP15, MSTP14) (Initial value of MSTP13 to MSTP0)
Rev. 4.00 Sep 27, 2006 page 752 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.3
Medium-Speed Mode
When the SCK2 to SCK0 bits in SBYCR are set to 1 in high-speed mode, the operating mode changes to medium-speed mode at the end of the bus cycle. In medium-speed mode, the CPU operates on the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0 bits. The bus master other than the CPU (the DTC) also operates in medium-speed mode. On-chip supporting modules other than the bus masters always operate on the high-speed clock (φ). In medium-speed mode, a bus access is executed in the specified number of states with respect to the bus master operating clock. For example, if φ/4 is selected as the operating clock, on-chip memory is accessed in 4 states, and internal I/O registers in 8 states. Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to high-speed mode and medium-speed mode is cleared at the end of the current bus cycle. If a SLEEP instruction is executed when the SSBY bit in SBYCR and the LSON bit in LPWRCR are cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt, medium-speed mode is restored. If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, and the LSON bit in LPWRCR and the PSS bit in TCSR (WDT1) are both cleared to 0, a transition is made to software standby mode. When software standby mode is cleared by an external interrupt, medium-speed mode is restored. When the RES pin is driven low, a transition is made to the reset state, and medium-speed mode is cleared. The same applies in the case of a reset caused by overflow of the watchdog timer. When the STBY pin is driven low, a transition is made to hardware standby mode. Figure 25.2 shows the timing for transition to and clearance of medium-speed mode.
Rev. 4.00 Sep 27, 2006 page 753 of 1130 REJ09B0327-0400
Section 25 Power-Down State
Medium-speed mode φ, supporting module clock
Bus master clock
Internal address bus
SBYCR
SBYCR
Internal write signal
Figure 25.2 Medium-Speed Mode Transition and Clearance Timing
25.4
25.4.1
Sleep Mode
Sleep Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR and the LSON bit in LPWRCR are both cleared to 0, the CPU enters sleep mode. In sleep mode, CPU operation stops but the contents of the CPU’s internal registers are retained. Other supporting modules do not stop. 25.4.2 Clearing Sleep Mode
Sleep mode is cleared by any interrupt, or with the RES pin or STBY pin. Clearing with an Interrupt: When an interrupt request signal is input, sleep mode is cleared and interrupt exception handling is started. Sleep mode will not be cleared if interrupts are disabled, or if interrupts other than NMI have been masked by the CPU. Clearing with the RES Pin: When the RES pin is driven low, the reset state is entered. When the RES RES pin is driven high after the prescribed reset input period, the CPU begins reset exception handling. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware STBY standby mode.
Rev. 4.00 Sep 27, 2006 page 754 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.5
25.5.1
Module Stop Mode
Module Stop Mode
Module stop mode can be set for individual on-chip supporting modules. When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of the bus cycle and a transition is made to module stop mode. The CPU continues operating independently. Table 25.4 shows MSTP bits and the corresponding on-chip supporting modules. When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module starts operating again at the end of the bus cycle. In module stop mode, the internal states of modules other than the SCI, A/D converter, 8-bit PWM module, and 14-bit PWM module, are retained. After reset release, all modules other than the DTC are in module stop mode. When an on-chip supporting module is in module stop mode, read/write access to its registers is disabled.
Rev. 4.00 Sep 27, 2006 page 755 of 1130 REJ09B0327-0400
Section 25 Power-Down State
Table 25.4 MSTP Bits and Corresponding On-Chip Supporting Modules
Register MSTPCRH Bit MSTP15 MSTP14* MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTPCRL MSTP7 MSTP6 MSTP5 MSTP4* MSTP3* MSTP2 Module — Data transfer controller (DTC) 16-bit free-running timer (FRT) 8-bit timer (TMR0, TMR1) 8-bit PWM timer (PWM), 14-bit PWM timer (PWMX) D/A converter A/D converter 8-bit timers (TMRX, TMRY), timer connection Serial communication interface 0 (SCI0) Serial communication interface 1 (SCI1) Serial communication interface 2 (SCI2) I C bus interface (IIC) channel 0 (option) I C bus interface (IIC) channel 1 (option) Host interface (HIF), keyboard matrix interrupt mask register (KMIMR, KMIMRA), port 6 MOS pull-up control register (KMPCR), keyboard buffer controller (PS2) — —
2 2
MSTP1* MSTP0*
Notes: Do not set bit 15 to 1. Bits 1 and 0 can be read or written to, but do not affect operation. * Must be set to 1 in the H8S/2144 Group and H8S/2147N.
25.5.2
Usage Note
If there is conflict between DTC module stop mode setting and a DTC bus request, the bus request has priority and the MSTP bit will not be set to 1. Write 1 to the MSTP bit again after the DTC bus cycle. When using the H8S/2144 Group and H8S/2147N, the MSTP bits for nonexistent modules must be set to 1.
Rev. 4.00 Sep 27, 2006 page 756 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.6
25.6.1
Software Standby Mode
Software Standby Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, the LSON bit in LPWRCR is cleared to 0, and the PSS bit in TCSR (WDT1) is cleared to 0, software standby mode is entered. In this mode, the CPU, on-chip supporting modules, and oscillator all stop. However, the contents of the CPU’s internal registers, RAM data, and the states of on-chip supporting modules other than the SCI, PWM, and PWMX, and of the I/O ports, are retained. In this mode the oscillator stops, and therefore power dissipation is significantly reduced. 25.6.2 Clearing Software Standby Mode
Software standby mode is cleared by an external interrupt (NMI pin, or pin IRQ0, IRQ1, IRQ2, IRQ6, or IRQ7), or by means of the RES pin or STBY pin. Clearing with an Interrupt: When an NMI, IRQ0, IRQ1, IRQ2, IRQ6, or IRQ7 interrupt request signal is input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0 in SYSCR, stable clocks are supplied to the entire chip, software standby mode is cleared, and interrupt exception handling is started. Software standby mode cannot be cleared with an IRQ0, IRQ1, IRQ2, IRQ6, or IRQ7 interrupt if the corresponding enable bit has been cleared to 0 or has been masked by the CPU. Clearing with the RES Pin: When the RES pin is driven low, clock oscillation is started. At the RES same time as clock oscillation starts, clocks are supplied to the entire chip. Note that the RES pin must be held low until clock oscillation stabilizes. When the RES pin goes high, the CPU begins reset exception handling. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware STBY standby mode. 25.6.3 Setting Oscillation Settling Time after Clearing Software Standby Mode
Bits STS2 to STS0 in SBYCR should be set as described below.
Rev. 4.00 Sep 27, 2006 page 757 of 1130 REJ09B0327-0400
Section 25 Power-Down State
Using a Crystal Oscillator Set bits STS2 to STS0 so that the standby time is at least 8 ms (the oscillation settling time). Table 25.5 shows the standby times for different operating frequencies and settings of bits STS2 to STS0. Table 25.5 Oscillation Settling Time Settings
20 STS2 STS1 STS0 Standby Time MHz 0 0 0 1 1 0 1 1 0 1 0 1 0 1 8192 states 16384 states 32768 states 65536 states 0.41 0.82 1.6 3.3 16 MHz 0.51 1.0 2.0 4.1 8.2 — 1.0 12 MHz 0.65 1.3 2.7 5.5 10.9 21.8 — 1.3 10 MHz 0.8 1.6 3.3 6.6 8 MHz 1.0 2.0 4.1 8.2 6 MHz 1.3 2.7 5.5 4 MHz 2.0 4.1 8.2 2 MHz 4.1 8.2 16.4 32.8 65.5 131.2 — 8.0 µs Unit ms
10.9 16.4 21.8 43.6 — 2.7 32.8 65.6 — 4.0
131072 states 6.6 262144 states Reserved 16 states* — 0.8
13.1 16.4 26.2 — 1.6 32.8 — 2.0
13.1 16.4
: Recommended time setting Note: * This setting must not be used in the flash memory version.
Using an External Clock Any value can be set. Normally, use of the minimum time is recommended. 25.6.4 Software Standby Mode Application Example
Figure 25.3 shows an example in which a transition is made to software standby mode at the falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI pin. In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set to 1, and a SLEEP instruction is executed, causing a transition to software standby mode. Software standby mode is then cleared at the rising edge on the NMI pin.
Rev. 4.00 Sep 27, 2006 page 758 of 1130 REJ09B0327-0400
Section 25 Power-Down State
Oscillator
φ
NMI
NMIEG
SSBY
NMI exception handling NMIEG = 1 SSBY = 1
Software standby mode (power-down state)
Oscillation settling time tOSC2
NMI exception handling
SLEEP instruction
Figure 25.3 Software Standby Mode Application Example 25.6.5 Usage Note
In software standby mode, I/O port states are retained. Therefore, there is no reduction in current dissipation for the output current when a high-level signal is output. Current dissipation increases while waiting for oscillation to settle.
25.7
25.7.1
Hardware Standby Mode
Hardware Standby Mode
When the STBY pin is driven low, a transition is made to hardware standby mode from any mode. In hardware standby mode, all functions enter the reset state and stop operation, resulting in a significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip RAM data is retained. I/O ports are set to the high-impedance state.
Rev. 4.00 Sep 27, 2006 page 759 of 1130 REJ09B0327-0400
Section 25 Power-Down State
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before driving the STBY pin low. Do not change the state of the mode pins (MD1 and MD0) while the chip is in hardware standby mode. Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started. Ensure that the RES pin is held low until the clock oscillation settles (at least 8 ms—the oscillation settling time—when using a crystal oscillator). When the RES pin is subsequently driven high, a transition is made to the program execution state via the reset exception handling state. 25.7.2 Hardware Standby Mode Timing
Figure 25.4 shows an example of hardware standby mode timing. When the STBY pin is driven low after the RES pin has been driven low, a transition is made to hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high, waiting for the oscillation settling time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation settling time
Reset exception handling
Figure 25.4 Hardware Standby Mode Timing
Rev. 4.00 Sep 27, 2006 page 760 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.8
25.8.1
Watch Mode
Watch Mode
If a SLEEP instruction is executed in high-speed mode or subactive mode when the SSBY in SBYCR is set to 1, the DTON bit in LPWRCR is cleared to 0, and the PSS bit in TCSR (WDT1) is set to 1, the CPU makes a transition to watch mode. In this mode, the CPU and all on-chip supporting modules except WDT1 stop. As long as the prescribed voltage is supplied, the contents of some of the CPU’s internal registers and on-chip RAM are retained, and I/O ports retain their states prior to the transition. 25.8.2 Clearing Watch Mode
Watch mode is cleared by an interrupt (WOVI1 interrupt, NMI pin, or pin IRQ0, IRQ1, IRQ2, IRQ6, or IRQ7), or by means of the RES pin or STBY pin. Clearing with an Interrupt: When an interrupt request signal is input, watch mode is cleared and a transition is made to high-speed mode or medium-speed mode if the LSON bit in LPWRCR is cleared to 0, or to subactive mode if the LSON bit is set to 1. When making a transition to highspeed mode, after the elapse of the time set in bits STS2 to STS0 in SBYCR, stable clocks are supplied to the entire chip, and interrupt exception handling is started. Watch mode cannot be cleared with an IRQ0, IRQ1, IRQ2, IRQ6, or IRQ7 interrupt if the corresponding enable bit has been cleared to 0, or with an on-chip supporting module interrupt if acceptance of the relevant interrupt has been disabled by the interrupt enable register or masked by the CPU. See section 25.6.3, Setting Oscillation Settling Time after Clearing Software Standby Mode, for the oscillation settling time setting when making a transition from watch mode to high-speed mode. Clearing with the RES Pin: See “Clearing with the RES Pin” in section 25.6.2, Clearing RES Software Standby Mode. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware STBY standby mode.
Rev. 4.00 Sep 27, 2006 page 761 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.9
25.9.1
Subsleep Mode
Subsleep Mode
If a SLEEP instruction is executed in subactive mode when the SSBY in SBYCR is cleared to 0, the LSON bit in LPWRCR is set to 1, and the PSS bit in TCSR (WDT1) is set to 1, the CPU makes a transition to subsleep mode. In this mode, the CPU and all on-chip supporting modules except TMR0, TMR1, WDT0, and WDT1 stop. As long as the prescribed voltage is supplied, the contents of some of the CPU’s internal registers and on-chip RAM are retained, and I/O ports retain their states prior to the transition. 25.9.2 Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (on-chip supporting module interrupt, NMI pin, or pin IRQ0 to IRQ7), or by means of the RES pin or STBY pin. Clearing with an Interrupt: When an interrupt request signal is input, subsleep mode is cleared and interrupt exception handling is started. Subsleep mode cannot be cleared with an IRQ0 to IRQ7 interrupt if the corresponding enable bit has been cleared to 0, or with an on-chip supporting module interrupt if acceptance of the relevant interrupt has been disabled by the interrupt enable register or masked by the CPU. Clearing with the RES Pin: See “Clearing with the RES Pin” in section 25.6.2, Clearing RES Software Standby Mode. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware STBY standby mode
Rev. 4.00 Sep 27, 2006 page 762 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.10
Subactive Mode
25.10.1 Subactive Mode If a SLEEP instruction is executed in high-speed mode when the SSBY bit in SBYCR, the DTON bit in LPWRCR, and the PSS bit in TCSR (WDT1) are all set to 1, the CPU makes a transition to subactive mode. When an interrupt is generated in watch mode, if the LSON bit in LPWRCR is set to 1, a transition is made to subactive mode. When an interrupt is generated in subsleep mode, a transition is made to subactive mode. In subactive mode, the CPU performs sequential program execution at low speed on the subclock. In this mode, all on-chip supporting modules except TMR0, TMR1, WDT0, and WDT1 stop. When operating the device in subactive mode, bits SCK2 to SCK0 in SBYCR must all be cleared to 0. 25.10.2 Clearing Subactive Mode Subsleep mode is cleared by a SLEEP instruction, or by means of the RES pin or STBY pin. Clearing with a SLEEP Instruction: When a SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1, the DTON bit in LPWRCR is cleared to 0, and the PSS bit in TCSR (WDT1) is set to 1, subactive mode is cleared and a transition is made to watch mode. When a SLEEP instruction is executed while the SSBY bit in SBYCR is cleared to 0, the LSON bit in LPWRCR is set to 1, and the PSS bit in TCSR (WDT1) is set to 1, a transition is made to subsleep mode. When a SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1, the DTON bit is set to 1 and the LSON bit is cleared to 0 in LPWRCR, and the PSS bit in TCSR (WDT1) is set to 1, a transition is made directly to high-speed mode. Fort details of direct transition, see section 25.11, Direct Transition. Clearing with the RES Pin: See “Clearing with the RES Pin” in section 25.6.2, Clearing RES Software Standby Mode. Clearing with the STBY Pin: When the STBY pin is driven low, a transition is made to hardware STBY standby mode
Rev. 4.00 Sep 27, 2006 page 763 of 1130 REJ09B0327-0400
Section 25 Power-Down State
25.11
Direct Transition
25.11.1 Overview of Direct Transition There are three operating modes in which the CPU executes programs: high-speed mode, mediumspeed mode, and subactive mode. A transition between high-speed mode and subactive mode without halting the program is called a direct transition. A direct transition can be carried out by setting the DTON bit in LPWRCR to 1 and executing a SLEEP instruction. After the transition, direct transition interrupt exception handling is started. Direct Transition from High-Speed Mode to Subactive Mode: If a SLEEP instruction is executed in high-speed mode while the SSBY bit in SBYCR, the LSON bit and DTON bit in LPWRCR, and the PSS bit in TSCR (WDT1) are all set to 1, a transition is made to subactive mode. Direct Transition from Subactive Mode to High-Speed Mode: If a SLEEP instruction is executed in subactive mode while the SSBY bit in SBYCR is set to 1, the LSON bit is cleared to 0 and the DTON bit is set to 1 in LPWRCR, and the PSS bit in TSCR (WDT1) is set to 1, after the elapse of the time set in bits STS2 to STS0 in SBYCR, a transition is made to directly to highspeed mode.
25.12
Usage Notes
1. When making a transition to subactive mode or watch mode, set the DTC to enter module stop mode (write 1 to the relevant bits in MSTPCR), and then read the relevant bits to confirm that they are set to 1 before mode transition. Do not clear module stop mode (write 0 to the relevant bits in MSTPCR) until a transition from subactive mode to high-speed mode or medium-speed mode has been performed. If a DTC activation source occurs in sub-active mode, the DTC will be activated only after module stop mode has been cleared and high-speed mode or medium-speed mode has been entered. 2. The on-chip peripheral modules (DTC and TPU) which halt operation in subactive mode cannot clear an interrupt in subactive mode. Therefore, if a transition is made to sub-active mode while an interrupt is requested, the CPU interrupt source cannot be cleared. Disable the interrupts of each on-chip peripheral module before executing a SLEEP instruction to enter subactive mode or watch mode.
Rev. 4.00 Sep 27, 2006 page 764 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Section 26 Electrical Characteristics
26.1 Voltage of Power Supply and Operating Range
The power supply voltage and operating range (shaded part) for each product are shown in table 26.1. Table 26.1 Power Supply Voltage and Operating Range (1)
Product/ Power supply
HD64F2148 HD64F2144 HD64F2142R
VCC 5.5 V 4.5 V 4.0 V Flash Memory Programming Select 5.0 V ±0.5 V for programming condition in PROM programmer 2 MHz 16 MHz 20 MHz fop
(F-ZTAT Products)
3-V version
VCC Select 5.0 V ±0.5 V for programming condition in PROM programmer
5-V version
Product/ Power supply
HD64F2148V HD64F2144V HD64F2142RV
3.6 V 3.0 V 2 MHz 5.5 V
Flash Memory Programming 10 MHz fop
VCC1 pin VCC2 pin VCCB pin*
VCC = 5.0 V ±10% (fop = 2 to 20 MHz) VCC = 4.0 V to 5.5 V (fop = 2 to 16 MHz) VCCB = 5.0 V ±10% (fop = 2 to 20 MHz) VCCB = 4.0 V to 5.5 V (fop = 2 to 16 MHz)
VCC1 pin VCC2 pin VCCB pin*
VCC = 3.0 V to 5.5 V (fop = 2 to 10 MHz)
VCCB = 3.0 V to 5.5 V (fop = 2 to 10 MHz)
AVCC pin
AVCC = 5.0 V ±10% (fop = 2 to 20 MHz) AVCC = 4.0 V to 5.5 V (fop = 2 to 16 MHz)
AVCC pin
AVCC = 3.0 V to 5.5 V (fop = 2 to 10 MHz)
Note:
*
Available only in the H8S/2148 Group.
Rev. 4.00 Sep 27, 2006 page 765 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.1 Power Supply Voltage and Operating Range (2)
Product/ Power supply
HD64F2147N
VCC 5.5 V 4.5 V Flash Memory Programming
(F-ZTAT Products)
3-V version
VCC Select 5.0 V ±0.5 V for programming condition in PROM programmer
5-V version
Product/ Power supply
HD64F2147NV
5.5 V
3.6 V 3.0 V
2 MHz 16 MHz 20 MHz fop
Flash Memory Programming 2 MHz 10 MHz fop
VCC1 pin VCC2 pin VCCB pin AVCC pin
VCC = 5.0 V ±10% (fop = 2 to 20 MHz)
VCC1 pin VCC2 pin
VCC = 3.0 V to 5.5 V (fop = 2 to 10 MHz)
VCCB = 5.0 V ±10% (fop = 2 to 20 MHz) AVCC = 5.0 V ±10% (fop = 2 to 20 MHz)
VCCB pin AVCC pin
VCCB = 3.0 V to 5.5 V (fop = 2 to 10 MHz) AVCC = 3.0 V to 5.5 V (fop = 2 to 10 MHz)
Table 26.1 Power Supply Voltage and Operating Range (3)
Product/ Power supply
HD64F2148A HD64F2147A HD64F2144A
4.5 V 4.0 V VCC 5.5 V
(F-ZTAT A-Mask Products)
3-V version
VCC 5.5 V Select 3.3 V ±0.3 V for programming condition in PROM programmer
5-V version
Product/ Power supply
HD64F2148AV HD64F2147AV Flash Memory HD64F2144AV Programming
Select 3.3 V ±0.3 V for programming condition in PROM programmer 2 MHz 16 MHz 20 MHz fop
3.6 V 3.0 V 2.7 V 2 MHz 10 MHz fop
Flash Memory Programming
VCC1 pin
VCC = 5.0 V ±10% (fop = 2 to 20 MHz) VCC = 4.0 V to 5.5 V (fop = 2 to 16 MHz)
VCC1 pin
VCC = 2.7 V to 3.6 V (fop = 2 to 10 MHz) (CIN in use VCC = 3.0 V to 3.6 V)
VCL pin (VCC2) VCL = C connect VCCB pin* VCCB = 5.0 V ±10% (fop = 2 to 20 MHz) VCCB = 4.0 V to 5.5 V (fop = 2 to 16 MHz) AVCC pin AVCC = 5.0 V ±10% (fop = 2 to 20 MHz) AVCC = 4.0 V to 5.5 V (fop = 2 to 16 MHz)
VCL pin (VCC2) VCL = VCC connect VCCB pin* VCCB = 2.7 V to 5.5 V (fop = 2 to 10 MHz) (CIN in use VCCB = 3.0 V to 5.5 V) AVCC pin AVCC = 2.7 V to 3.6 V (fop = 2 to 10 MHz) (CIN in use AVCC = 3.0 V to 3.6 V)
Note:
*
Available only in the H8S/2148 Group.
Rev. 4.00 Sep 27, 2006 page 766 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.1 Power Supply Voltage and Operating Range (4)
Product/ Power supply
HD6432148S
VCC
(Mask ROM Products)
3-V version
VCC
5-V version
VCC 5.5 V
4-V version
HD6432148SW 5.5 V HD6432147S 4.5 V HD6432147SW HD6432144S HD6432143S
2 MHz fop 20 MHz
4.0 V
3.6 V 2.7 V 2 MHz fop 16 MHz 2 MHz 10 MHz fop
VCC1 pin
VCC = 5.0 V ±10%
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 3.6 V (CIN in use VCC = 3.0 V to 3.6 V)
VCL pin (VCC2) VCL = C connect VCCB pin* VCCB = 5.0 V ±10%
VCL = C connect VCCB = 4.0 V to 5.5 V
VCL = VCC connect VCCB = 2.7 V to 5.5 V (CIN in use VCCB = 3.0 V to 5.5 V)
AVCC pin
AVCC = 5.0 V ±10%
AVCC = 4.0 V to 5.5 V
AVCC = 2.7 V to 3.6 V (CIN in use AVCC = 3.0 V to 3.6 V)
Note:
*
Available only in the H8S/2148 Group.
Table 26.1 Power Supply Voltage and Operating Range (5)
Product/ Power supply
HD6432142
VCC 5.5 V 4.5 V
(Mask ROM Products)
3-V version
VCC 5.5 V
5-V version
VCC 5.5 V
4-V version
4.0 V 2.7 V
2 MHz fop 20 MHz
2 MHz fop
16 MHz
2 MHz 10 MHz fop
VCC1 pin VCC2 pin AVCC pin
VCC = 5.0 V ±10%
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 5.5 V
AVCC = 5.0 V ±10%
AVCC = 4.0 V to 5.5 V
AVCC = 2.7 V to 5.5 V
Rev. 4.00 Sep 27, 2006 page 767 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.2
26.2.1
Electrical Characteristics of H8S/2148 F-ZTAT
Absolute Maximum Ratings
Table 26.2 lists the absolute maximum ratings. Table 26.2 Absolute Maximum Ratings
Item Power supply voltage* Input/output buffer power supply (power supply for the port A) Input voltage (except ports 6, 7, and A) Input voltage (CIN input not selected for port 6) Input voltage (CIN input not selected for port A) Input voltage (CIN input selected for port 6) Input voltage (CIN input selected for port A) Input voltage (port 7) Reference supply voltage Analog power supply voltage Analog input voltage Operating temperature Operating temperature (flash memory programming/erasing) Storage temperature Symbol VCC VCCB Vin Vin Vin Vin Vin Vin AVref AVCC VAN Topr Topr Tstg Value –0.3 to +7.0 –0.3 to +7.0 –0.3 to VCC +0.3 –0.3 to VCC +0.3 –0.3 to VCCB +0.3 –0.3 V to lower of voltages VCC +0.3 and AVCC +0.3 –0.3 V to lower of voltages VCCB +0.3 and AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 Regular specifications: 0 to +75 Wide-range specifications: 0 to +85 –55 to +125 Unit V V V V V V V V V V V °C °C °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Note: * Power supply voltage for VCC1 and VCC2 pins.
Rev. 4.00 Sep 27, 2006 page 768 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.2.2
DC Characteristics
Table 26.3 lists the DC characteristics. Permitted output current values and bus drive characteristics are shown in tables 26.4 and 26.5, respectively. Table 26.3 DC Characteristics (1)
1 Conditions: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, AVCC* = 5.0 V ±10%, 1 1 11 AVref* = 4.5 V to AVCC, VSS = AVSS* = 0 V, Ta = –20 to +75°C* (regular 11 specifications), Ta = –40 to +85°C* (wide-range specifications)
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 switching)* P67 to P60 (KWUL = 10)
Symbol VT VT
–
Min 1.0 —
Typ — — — — — — —
Max — VCC × 0.7 VCCB × 0.7 — — VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3 VCCB +0.3 AVCC +0.3 VCC +0.3
Unit V
Test Conditions
+
VT – VT VT VT VT VT VT VT
– + + – + + – + +
+
–
0.4 VCC × 0.3 —
V
VT – VT
–
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
–
VCC × 0.03 — VCC × 0.45 — — — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
–
0.05 VCC –0.7 VCC × 0.7 2.0 2.0
VIH
V
VCCB × 0.7 —
Rev. 4.00 Sep 27, 2006 page 769 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, and 4 58 P52* )* *
4 P97, P52*
Symbol (3) VIL
Min –0.3 –0.3 –0.3
Typ — — —
Max 0.5 1.0 0.8
Unit V
VOH
VCC –0.5 VCCB –0.5 3.5 2.5
— — — — — — — — — —
— — — 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V V V µA µA µA µA
IOH = –200 µA IOH = –1 mA IOH = –1 mA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3 RESO
VOL
— — —
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Iin
— — —
Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V Vin = 0 V
Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state) Input pull-up MOS current Ports 1 to 3 8 Ports A* , B, Port 6 (P6PUE = 0) Port 6 (P6PUE = 1)
ITSI
—
–IP
50 60
— —
300 500
µA µA
15
—
150
µA
Rev. 4.00 Sep 27, 2006 page 770 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, f = 1 MHz, Ta = 25°C
Item Input RES capacitance NMI P52, P97, P42, P86 PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol Cin
Min — — —
Typ — — —
Max 80 50 20
Unit pF pF pF
— ICC — — — — AlCC — — — — — AVCC VRAM 4.5 2.0 2.0
— 85 70 0.01 — 1.2 0.01 0.5 2.0 0.01 — — —
15 120 100 5.0 20.0 2.0 5.0 1.0 5.0 5.0 5.5 5.5 —
pF mA mA µA µA mA µA mA mA µA V V V AVref= 2.0 V to AVCC Operating Idle/not used AVCC= 2.0 V to 5.5 V f = 20 MHz f = 20 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
1 Analog power supply voltage*
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately.
Rev. 4.00 Sep 27, 2006 page 771 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. Port A characteristics depends on VCCB (or on VCC when other pins are in output mode). 9. Current dissipation values are for VIH min = VCC –0.5 V, VCCB –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 4.5V, VIH min = VCC × 0.9, VCCB × 0.9, and VIL max = 0.3 V. 11. For flash memory program/erase operations, the applicable range is Ta = 0 to +75°C (regular specifications) or Ta = 0 to +85°C (wide-range specifications).
Rev. 4.00 Sep 27, 2006 page 772 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.3 DC Characteristics (2)
11 1 Conditions: VCC = 4.0 V to 5.5 V* , VCCB = 4.0 V to 5.5 V, AVCC* = 4.0 V to 5.5 V, 1 1 11 AVref* = 4.0 V to AVCC, VSS = AVSS* = 0 V, Ta = –20 to +75°C* (regular 11 specifications), Ta = –40 to +85°C* (wide-range specifications)
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3
Symbol Min VT VT
– +
Typ — — — — — — — — — —
Max —
Unit V
Test Conditions VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V VCC < 4.5 V, VCCB < 4.5 V
1.0 —
–
VCC × 0.7 V VCCB × 0.7 — — V V
VT – VT VT VT
– +
+
0.4 0.8 —
VCC × 0.7 V VCCB × 0.7 — — VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3 V V V V
VT – VT Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 switching)* P67 to P60 (KWUL = 10) VT VT VT VT VT VT
– + + – + + – + +
+
–
0.3 VCC × 0.3 —
VCC = 4.0 V to 5.5 V
VT – VT
–
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
–
VCC × 0.03 — VCC × 0.45 — — — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
–
0.05 VCC –0.7 VCC × 0.7 2.0 2.0
VIH
VCCB × 0.7 —
VCCB + 0.3 V AVCC +0.3 V VCC +0.3 V
Rev. 4.00 Sep 27, 2006 page 773 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
Symbol Min VIL –0.3 –0.3 –0.3 NMI, EXTAL, input pins except (1) and (3) above –0.3
Typ — — — —
Max 0.5 1.0 0.8 0.8
Unit V V V V
VCCB = 4.5 V to 5.5 V VCCB < 4.5 V
Output high All output pins voltage (except P97, 4 58 and P52* )* *
VOH
— VCC –0.5 VCCB –0.5 3.5 —
— —
V V
IOH = –200 µA IOH = –1 mA, VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V IOH = –1 mA, VCC < 4.5 V, VCCB < 4.5 V IOH = –1 mA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB −0.5 V
3.0
—
—
V
P97, P52* Output low voltage
4
2.0 VOL — — — Iin — — — ITSI —
— — — — — — — —
— 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V µA µA µA µA
All output pins 5 (except RESO)* Ports 1 to 3 RESO
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Three-state Ports 1 to 6 8 leakage Ports 8, 9, A* , B current (off state)
Rev. 4.00 Sep 27, 2006 page 774 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V
Item Input pull-up MOS current Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol Min –IP 50 60
Typ — —
Max 300 500
Unit µA µA
15 30 40
— — —
150 200 400 µA µA Vin = 0 V, VCC ≤ 4.5 V, VCCB ≤ 4.5 V
10 Cin — — — — ICC — — — — AlCC — — — — —
1
— — — — — 70 60 0.01 — 1.2 0.01 0.5 2.0 0.01 — — —
110 80 50 20 15 100 85 5.0 20.0 2.0 5.0 1.0 5.0 5.0 5.5 5.5 — mA µA mA mA µA V V V AVref = 2.0 V to AVCC Operating Idle/not used AVCC = 2.0 V to 5.5 V pF pF pF pF mA mA µA f = 16 MHz f = 16 MHz Ta ≤ 50°C 50°C < Ta Vin = 0 V, f = 1 MHz, Ta = 25°C
During A/D conversion Alref During A/D, D/A conversion Idle
Analog power supply voltage* RAM standby voltage
AVCC VRAM
4.0 2.0 2.0
Rev. 4.00 Sep 27, 2006 page 775 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately. 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. The port A characteristics depend on VCCB, and the other pins characteristics depend on VCC. 9. Current dissipation values are for VIH min = VCC –0.5 V, VCCB –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC × 0.9, VCCB × 0.9, and VIL max = 0.3 V. 11. For flash memory program/erase operations, the applicable ranges are VCC = 4.5 V to 5.5 V and Ta = 0 to +75°C (regular specifications) or Ta = 0 to +85°C (wide-range specifications).
Rev. 4.00 Sep 27, 2006 page 776 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.3 DC Characteristics (3)
11 1 Conditions: VCC = 3.0 V to 5.5 V* , VCCB = 3.0 V to 5.5 V, AVCC* = 3.0 V to 5.5 V, 1 11 AVref = 3.0 V to 5.5 V, VSS = AVSS* = 0 V, Ta = –20 to +75°C*
Item Schmitt (1) P67 to trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 swiching)* P67 to P60 (KWUL = 10)
Symbol VT VT
–
Min
Typ
Max —
Unit V
Test Conditions
VCC × 0.2 — VCCB × 0.2 —
–
+
—
VCC × 0.7 V VCCB × 0.7 — V
VT – VT
+
VCC × 0.05 — VCCB × 0.05 VCC × 0.3 — — — — —
VT VT VT VT VT VT
– + + – + + – + + – – –
— VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3
V
VT – VT
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
VCC × 0.03 — VCC × 0.45 — — 0.05 VCC × 0.9 VCC × 0.7 — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
VIH
V V
VCCB × 0.7 — VCC × 0.7 VCC × 0.7
VCCB +0.3 V AVCC +0.3 V VCC +0.3 V
Rev. 4.00 Sep 27, 2006 page 777 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
Symbol VIL
Min –0.3 –0.3
Typ — —
Max VCC × 0.1
Unit V
VCCB × 0.2 V 0.8 V V V
VCCB < 4.0 V VCCB = 4.0 V to 5.5 V VCC < 4.0 V VCC = 4.0 V to 5.5 V IOH = –200 µA IOH = –1 mA (VCC < 4.0 V, VCCB < 4.0 V) IOH = –1 mA IOL = 1.6 mA IOL = 5 mA (VCC < 4.0 V), IOL = 10 mA (4.0 V ≤ VCC ≤ 5.5 V) IOL = 1.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V
NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, 4 58 and P52* )* * VOH
–0.3
—
VCC × 0.2 0.8
— VCC –0.5 VCCB –0.5 — VCC –1.0 VCCB –1.0 1.0 — — —
— —
V V
4 P97, P52*
— 0.4 1.0
V V V
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3
VOL
— —
RESO Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state) ITSI Iin
— — — — —
— — — — —
0.4 10.0 1.0 1.0 1.0
V µA µA µA µA
Rev. 4.00 Sep 27, 2006 page 778 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, VCC = 3.0 V to 3.6 V, VCCB = 3.0 V to 3.6 V
Item Input pullup MOS current Ports 1 to 3 8 Ports A* , B, Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol –IP
Min 10 30
Typ — —
Max 150 250
Unit µA µA
3 Cin — — —
— — — —
70 80 50 20
µA pF pF pF
Vin = 0 V, f = 1 MHz, Ta = 25°C
— ICC — — — — AlCC — — — — —
— 50 40 0.01 — 1.2 0.01 0.5 2.0 0.01 — — —
15 70 60 5.0 20.0 2.0 5.0 1.0 5.0 5.0 5.5 5.5 —
pF mA mA µA µA mA µA mA mA µA V V V AVref = 2.0 V to AVCC Operating Idle/not used AVCC = 2.0 V to 5.5 V f = 10 MHz f = 10 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
Analog power supply voltage* RAM standby voltage
1
AVCC VRAM
3.0 2.0 2.0
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin.
Rev. 4.00 Sep 27, 2006 page 779 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately. 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. The port A characteristics depend on VCCB, and the other pins characteristics depend on VCC. 9. Current dissipation values are for VIH min = VCC –0.5 V, VCCB –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 3.0 V, VIH min = VCC × 0.9, VCCB × 0.9, and VIL max = 0.3 V. 11. For flash memory program/erase operations, the applicable ranges are VCC = 3.0 V to 3.6 V and Ta = 0 to +75°C.
Rev. 4.00 Sep 27, 2006 page 780 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.4 Permissible Output Currents Conditions: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 20 Unit mA
— — — — — — —
— — — — — — —
10 3 2 80 120 2 40
mA mA mA mA mA mA mA
Rev. 4.00 Sep 27, 2006 page 781 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 10 Unit mA
— — — — — — —
— — — — — — —
2 1 1 40 60 2 30
mA mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 26.4. 2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the output line, as show in figures 26.1 and 26.2.
Rev. 4.00 Sep 27, 2006 page 782 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
This chip
2 kΩ Port
Darlington pair
Figure 26.1 Darlington Pair Drive Circuit (Example)
This chip
600 Ω Ports 1 to 3 LED
Figure 26.2 LED Drive Circuit (Example)
Rev. 4.00 Sep 27, 2006 page 783 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.5 Bus Drive Characteristics Conditions: VCC = 3.0 V to 5.5 V, VSS = 0 V Applicable Pins: SCL1, SCL0, SDA1, SDA0 (bus drive function selected)
Item Schmitt trigger input voltage Symbol VT VT
– + + –
Min VCC × 0.3 — VCC × 0.05 VCC × 0.7 –0.5 — — —
Typ — — — — — — — — — —
Max — VCC × 0.7 — VCC +0.5 VCC × 0.3 0.8 0.5 0.4 20 1.0 250
Unit V
Test Conditions VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V
VT – VT Input high voltage Input low voltage Output low voltage VIH VIL VOL
V V
VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V IOL = 16 mA, VCC = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
Input capacitance
Cin
— —
pF µA ns
Vin = 0 V, f = 1 MHz, Ta = 25°C Vin = 0.5 to VCC –0.5 V VCC = 3.0 V to 5.5 V
Three-state leakage | ITSI | current (off state) SCL, SDA output fall time tOf
20 + 0.1 Cb —
Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V Applicable Pins: PS2AC, PS2AD, PS2BC, PS2BD, PS2CC, PS2CD, PA7 to PA4 (bus drive function selected)
Item Output low voltage Symbol VOL Min — — — Typ — — — Max 0.8 0.5 0.4 Unit V Test Conditions IOL = 16 mA, VCCB = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
26.2.3
AC Characteristics
Clock timing, control signal timing, bus timing, and timing of on-chip supporting modules list the following. Figure 26.4 shows the test conditions for the AC characteristics.
Rev. 4.00 Sep 27, 2006 page 784 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(1) Clock Timing Table 26.6 shows the clock timing. The clock timing specified here covers clock (φ) output and clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times. For details of external clock input (EXTAL pin and EXCL pin) timing, see section 24, Clock Pulse Generator. Table 26.6 Clock Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) External clock output stabilization delay time Symbol tcyc tCH tCL tCr tCf tOSC1 Min 50 17 17 — — 10 Max 500 — — 8 8 — Condition B 16 MHz Min 62.5 20 20 — — 10 Max 500 — — 10 10 — Condition C 10 MHz Min 100 30 30 — — 20 Max 500 — — 20 20 — Unit ns ns ns ns ns ms Figure 26.6 Figure 26.7 Test Conditions Figure 26.5 Figure 26.5
tOSC2
8
—
8
—
8
—
ms
tDEXT
500
—
500
—
500
—
µs
Rev. 4.00 Sep 27, 2006 page 785 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(2) Control Signal Timing Table 26.7 shows the control signal timing. The only external interrupts that can operate on the subclock (φ = 32.768 kHz) are NMI and IRQ0, 1, 2, 6, and 7. Table 26.7 Control Signal Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item RES setup time RES pulse width NMI setup time (NMI) NMI hold time (NMI) NMI pulse width (NMI) (exiting software standby mode) IRQ setup time (IRQ7 to IRQ0) IRQ hold time (IRQ7 to IRQ0) IRQ pulse width (IRQ7, IRQ6, IRQ2 to IRQ0) (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW Min 200 20 150 10 200 Max — — — — — Condition B 16 MHz Min 200 20 150 10 200 Max — — — — — Condition C 10 MHz Min 300 20 250 10 200 Max — — — — — Unit ns tcyc ns ns ns Figure 26.9 Test Conditions Figure 26.8
tIRQS tIRQH tIRQW
150 10 200
— — —
150 10 200
— — —
250 10 200
— — —
ns ns ns
Rev. 4.00 Sep 27, 2006 page 786 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(3) Bus Timing Table 26.8 shows the bus timing. Operation in external expansion mode is not guaranteed when operating on the subclock (φ = 32.768 kHz). Table 26.8 Bus Timing (1) (Nomal Mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 20 Min — Condition B 16 MHz Max 30 Min — Condition C 10 MHz Max 40 Test Unit Conditions ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
— 0.5 × tcyc –15 — 0.5 × tcyc –10 — — — — 15 0 20 30 30 30 — —
0.5 × — tcyc –20 0.5 × — tcyc –15 — — — — 20 0 30 45 45 45 — —
0.5 × — tcyc –30 0.5 × — tcyc –20 — — — — 35 0 40 60 60 60 — —
Read data tRDS setup time Read data tRDH hold time
Rev. 4.00 Sep 27, 2006 page 787 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 1.0 × tcyc –30 1.5 × tcyc –25 2.0 × tcyc –30 2.5 × tcyc –25 3.0 × tcyc –30 30 30 Min — Condition B 16 MHz Max 1.0 × tcyc –40 1.5 × tcyc –35 2.0 × tcyc –40 2.5 × tcyc –35 3.0 × tcyc –40 45 45 Min — Condition C 10 MHz Max 1.0 × tcyc –60 1.5 × tcyc –50 2.0 × tcyc –60 2.5 × tcyc –50 3.0 × tcyc –60 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC1 access time 1 Read data tACC2 access time 2 Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 1.5 × — tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 788 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.8 Bus Timing (2) (Advanced mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 30 Min — Condition B 16 MHz Max 45 Min — Condition C 10 MHz Max 60 Test Unit Conditions ns ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
0.5 × — tcyc –25 0.5 × — tcyc –10 — — — — 15 0 — 30 30 30 30 — — 1.0 × tcyc –40 1.5 × tcyc –25
0.5 × — tcyc –35 0.5 × — tcyc –15 — — — — 20 0 — 45 45 45 45 — — 1.0 × tcyc –55 1.5 × tcyc –35
0.5 × — tcyc –50 0.5 × — tcyc –20 — — — — 35 0 — 60 60 60 60 — — 1.0 × tcyc –80 1.5 × tcyc –50
Read data tRDS setup time Read data tRDH hold time Read data tACC1 access time 1 Read data tACC2 access time 2
—
—
—
ns
Rev. 4.00 Sep 27, 2006 page 789 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 2.0 × tcyc –40 2.5 × tcyc –25 3.0 × tcyc –40 30 30 Min — Condition B 16 MHz Max 2.0 × tcyc –55 2.5 × tcyc –35 3.0 × tcyc –55 45 45 Min — Condition C 10 MHz Max 2.0 × tcyc –80 2.5 × tcyc –50 3.0 × tcyc –80 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 — 1.5 × tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 790 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Tables 26.9 to 26.11 show the on-chip supporting module timing. The only on-chip supporting modules that can operate in subclock operation (φ = 32.768 kHz) are the I/O ports, external interrupts (NMI and IRQ0, 1, 2, 6, and 7), the watchdog timer, and the 8-bit timer (channels 0 and 1). Table 26.9 Timing of On-Chip Supporting Modules (1) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A Condition B Condition C 20 MHz Item I/O ports Symbol Min Output data delay tPWD time Input data setup time Input data hold time FRT tPRS tPRH — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 16 MHz Min — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 10 MHz Min — 50 50 — 50 50 1.5 2.5 Max 100 — — 100 — — — — tcyc Figure 26.17 ns Figure 26.16 Test Unit Conditions ns Figure 26.15
Timer output delay tFTOD time Timer input setup tFTIS time Timer clock input setup time Timer clock pulse width Single edge Both edges tFTCS tFTCWH tFTCWL
Rev. 4.00 Sep 27, 2006 page 791 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A Condition B Condition C 20 MHz Item TMR Timer output delay time Timer reset input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tTMOD tTMRS tTMCS tTMCWH tTMCWL tPWOD — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 16 MHz Min — 30 30 1.5 2.5 — 4 6 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 10 MHz Min — 50 50 1.5 2.5 — 4 6 0.4 — — — Max 100 — — — — 100 — — 0.6 1.5 1.5 100 ns Figure 26.23 tScyc tcyc ns tcyc Figure 26.21 Figure 26.22 tcyc Test Unit Conditions ns Figure 26.18 Figure 26.20 Figure 26.19
PWM, Pulse output PWMX delay time SCI Input clock cycle
Asynchro- tScyc nous Synchronous
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time (synchronous)
Receive data setup tRXS time (synchronous) Receive data hold tRXH time (synchronous) A/D Trigger input setup tTRGS conver- time ter WDT RESO output delay tRESD time RESO output pulse tRESOW width Note: *
50 50 30
— — —
50 50 30
— — —
100 100 50
— — —
ns ns ns Figure 26.24 Figure 26.25
— 132
100 —
— 132
120 —
— 132
200 —
ns tcyc
Only supporting modules that can be used in subclock operation
Rev. 4.00 Sep 27, 2006 page 792 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.9 Timing of On-Chip Supporting Modules (2) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item HIF read cycle CS/HA0 setup time IOR pulse width HDB delay time HDB hold time HIRQ delay time HIF write cycle CS/HA0 setup time IOW pulse width HDB setup time Symbol tHAR Min 10 10 120 — 0 — 10 10 60 30 Max — — — 100 25 120 — — — — Condition B 16 MHz Min 10 10 120 — 0 — 10 10 60 30 Max — — — 100 25 120 — — — — Condition C 10 MHz Min 10 10 220 — 0 — 10 10 100 50 Max — — — 200 40 200 — — — — Unit ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 26.26
CS/HA0 hold time tHRA tHRPW tHRD tHRF tHIRQ tHAW
CS/HA0 hold time tHWA tHWPW
Fast A20 tHDW gate not used Fast A20 gate used
45 tHWD tHGA 15 —
— — 90
55 15 —
— — 90
85 25 —
— — 180
ns ns ns
HDB hold time GA20 delay time
Rev. 4.00 Sep 27, 2006 page 793 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.10 Keyboard Buffer Controller Timing Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Ratings Item Symbol Min Typ Max 250 — — 450 400 Unit ns ns ns ns pF Test Conditions
Notes Figure 26.27
KCLK, KD output tKBF fall time KCLK, KD input data hold time KCLK, KD input data setup time tKBIH tKBIS
20 + 0.1 Cb — 150 150 — — — — — —
KCLK, KD output tKBOD delay time KCLK, KD capacitive load Cb
Rev. 4.00 Sep 27, 2006 page 794 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.11 I C Bus Timing Conditions: VCC = 3.0 V to 5.5 V, VSS = 0 V, φ = 5 MHz to maximum operating frequency
Ratings Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load Note: * Symbol tSCL tSCLH tSCLL tSr tSf tSP Min 12 3 5 — — — Typ — — — — — — Max — — — 7.5* 300 1 Unit tcyc tcyc tcyc tcyc ns tcyc Test Conditions Notes Figure 26.28
2
tBUF tSTAH tSTAS
5 3 3
— — —
— — —
tcyc tcyc tcyc
tSTOS tSDAS tSDAH Cb
3 0.5 0 —
— — — —
— — — 400
tcyc tcyc ns pF
2
17.5tcyc can be set according to the clock selected for use by the I C module. For details, see section 16.4, Usage Notes.
Rev. 4.00 Sep 27, 2006 page 795 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.2.4
A/D Conversion Characteristics
Tables 26.12 and 26.13 list the A/D conversion characteristics. Table 26.12 A/D Conversion Characteristics (AN7 to AN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
4 3
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
4 3
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 10*1 5* — — — — — — — — — —
2
Unit Bits
µs
pF kΩ
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
±7.0 ±7.5 ±7.5 ±0.5 ±8.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4. 5.
When 4.0 V ≤ AVCC ≤ 5.5 V When 3.0 V ≤ AVCC < 4.0 V When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 796 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.13 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
4 3
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
4 3
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 10*1 5* — — — — — — — — — —
2
Unit Bits
µs
pF kΩ
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±11.0 ±11.5 ±11.5 ±0.5 ±12.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4. 5.
When 4.0 V ≤ AVCC ≤ 5.5 V When 3.0 V ≤ AVCC < 4.0 V When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 797 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.2.5
D/A Conversion Characteristics
Table 26.14 lists the D/A conversion characteristics. Table 26.14 D/A Conversion Characteristics Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Min 8 Typ 8 — Max 8 10 Min 8 — Condition B 16 MHz Typ 8 — Max 8 10 Min 8 — Condition C 10 MHz Typ 8 — Max 8 10 Unit Bits µs
Conversion With 20-pF — time load capacitance Absolute accuracy With 2-MΩ load resistance With 4-MΩ load resistance —
±1.0
±1.5
—
±1.0
±1.5
—
±2.0
±3.0
LSB
—
—
±1.0
—
—
±1.0
—
—
±2.0
Rev. 4.00 Sep 27, 2006 page 798 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.2.6
Flash Memory Characteristics
Table 26.15 shows the flash memory characteristics. Table 26.15 Flash Memory Characteristics (Programming/erasing operating range) Conditions (5 V version): VCC = 5.0 V ±10%, VSS = 0 V, Ta = 0 to +75°C (regular specifications), Ta = 0 to +85°C (wide-range specifications) (3 V version): VCC = 3.0 V to 3.6V, VSS = 0 V, Ta = 0 to +75°C
Item Programming time*1 *2 *4 Erase time*1 *3 *6 Reprogramming count Data retention time*
10
Symbol Min tP tE NWEC tDRP x y z α β γ ε η N x y z α β γ ε η N — — 100*8 10 10 50 150 10 10 4 2 4 — 10 200 5 10 10 20 2 5 —
Typ 10 100
Max 200 1200
Unit ms/ 32 bytes ms/ block Times Years µs µs µs µs µs µs µs µs Times µs µs ms µs µs µs µs µs Times
Test Condition
10000*9 — — — — — — — — — — — — — — — — — — — — — — — 200 — — — — — 1000 — — 10 — — — — — 120
Programming Wait time after SWE-bit setting*1 Wait time after PSU-bit setting*1 Wait time after P-bit setting*1 *4 Wait time after P-bit clear*1 Wait time after PSU-bit clear*1 Wait time after PV-bit setting*1 Wait time after dummy write*1 Wait time after PV-bit clear*1 Maximum programming count*1 *4 *5 Erase Wait time after SWE-bit setting*1 Wait time after ESU-bit setting*1 Wait time after E-bit setting*1 *6 Wait time after E-bit clear*
1
z = 200 µs
Wait time after ESU-bit clear*1 Wait time after EV-bit setting*1 Wait time after dummy write*1 Wait time after EV-bit clear*1 Maximum erase count*1 *6 *7
z = 10 ms
Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 32 bytes (Shows the total period for which the P-bit in FLMCR1 is set. It does not include the programming verification time.) Rev. 4.00 Sep 27, 2006 page 799 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time.) 4. Maximum programming time (tP (max)) tP(max) = wait time after P-bit setting (z) × maximum programming count (N) 5. Number of times when the wait time after P-bit setting (z) = 200 µs. The number of writes should be set according to the actual set value of (z) to allow programming within the maximum programming time (tP(max)). 6. Maximum erase time (tE (max)) tE(max) = wait time after E-bit setting (z) × maximum erase count (N) 7. Number of times when the wait time after E-bit setting (z) = 10 ms. The number of erases should be set according to the actual set value of (z) to allow erasing within the maximum erase time (tE(max)). 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.2.7
Usage Note
(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values for electrical characteristics shown in this manual. However, actual performance figures, operating margins, noise margins, and other properties may vary due to differences in the manufacturing process, on-chip ROM, layout patterns, etc. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests should also be conducted for the mask ROM version when changing over to that version. (2) On-chip power supply step-down circuit The H8S/2148 F-ZTAT does not incorporate an internal power supply step-down circuit. When changing over to F-ZTAT versions or mask ROM versions incorporating an internal step-down circuit, the VCC2 pin has the same pin location as the VCL pin in a step-down circuit. Therefore, note that the circuit patterns differ between these two types of products.
Rev. 4.00 Sep 27, 2006 page 800 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
VCC power supply External capacitor for stabilizing power supply VCL 0.47 µF one or two connected in group Product incorporating internal step-down circuit By-pass capacitor 10 µF 0.01 µF VSS VCC2 Product not incorporating step-down circuit
VSS
For products incorporating an internal step-down circuit, do not connect the VCL pin to the VCC power supply. (The VCC1 pin must be connected to the VCC power supply as usual.) The power supply stabilization capacitor must be connected to the VCL pin. Use a monolithic ceramic capacitor of 0.47 µF(one or two connected in group) and locate it near the pins. In case the power supply voltage is lower than 3.6 V, connect the capacitor in the same way as the case with no step-down circuit incorporated. HD6432148S, HD6432148SW, HD6432147S, HD6432147SW HD6432144S, HD6432143S, HD64F2148A, HD64F2147A, HD64F2144A
The location of the VCC2 (VCC power supply) pin in the product not incorporating an internal step-down circuit, is the same as the VCL pin in a product incorporating an internal step-down circuit. It is recommended that the by-pass capacitors are connected to the power supply terminal (these are reference values). HD64F2148(V), HD64F2147N(V), HD64F2144(V), HD64F2142(V), HD6432142, HD6432148SV, HD6432148SVW, HD6432147SV, HD6432147SVW, HD6432144SV, HD6432143SV, HD64F2148AV, HD64F2147AV, HD64F2144AV
Figure 26.3 Connection of External Capacitor (Mask ROM Type Incorporating Step-Down Circuit and Product Not Incorporating Step-Down Circuit)
Rev. 4.00 Sep 27, 2006 page 801 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.3
Electrical Characteristics of H8S/2148 F-ZTAT (A-mask version), H8S/2147 F-ZTAT (A-mask version), and Mask ROM Versions of H8S/2148 and H8S/2147
Absolute Maximum Ratings
26.3.1
Table 26.16 lists the absolute maximum ratings. Table 26.16 Absolute Maximum Ratings
Item
1 Power supply voltage*
Symbol VCC VCCB VCC VCL Vin Vin Vin Vin Vin Vin AVref AVCC AVCC VAN Topr
Value –0.3 to +7.0 –0.3 to +7.0 –0.3 to +4.3 –0.3 to +4.3 –0.3 to VCC +0.3 –0.3 to VCC +0.3 –0.3 to VCCB +0.3 –0.3 V to lower of voltages VCC +0.3 and AVCC +0.3 –0.3 V to lower of voltages VCCB +0.3 and AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to +4.3 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85
Unit V V V V V V V V V V V V V V °C °C
Input/output buffer power supply (power supply for the port A) 1 Power supply voltage* (3 V version) 2 Power supply voltage* (VCL pin) Input voltage (except ports 6, 7, and A) Input voltage (CIN input not selected for port 6) Input voltage (CIN input not selected for port A) Input voltage (CIN input selected for port 6) Input voltage (CIN input selected for port A) Input voltage (port 7) Reference supply voltage Analog power supply voltage Analog power supply voltage (3 V version) Analog input voltage Operating temperature
Rev. 4.00 Sep 27, 2006 page 802 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Item Operating temperature (flash memory programming/erasing) Storage temperature Caution: Symbol Topr Tstg Value Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 –55 to +125 Unit °C °C °C
1. Permanent damage to the chip may result if absolute maximum ratings are exceeded. 2. Never apply more than 7.0 V to any of the pins of the 5- or 4-V version or 4.3 V to any of the pins (except port A) of the 3-V version Notes: 1. Power supply voltage for VCC1 pin Never exceed the maximum rating of VCL in the low-power version (3-V version) because both the VCC1 and VCL pins are connected to the VCC power supply. 2. It is an operating power supply voltage pin on the chip. Never apply power supply voltage to the VCL pin in the 5- or 4-V version. Always connect an external capacitor between the VCL pin and ground for internal voltage stabilization.
Rev. 4.00 Sep 27, 2006 page 803 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.3.2
DC Characteristics
Table 26.17 lists the DC characteristics. Permitted output current values and bus drive characteristics are shown in tables 26.18 and 26.19, respectively. Table 26.17 DC Characteristics (1)
1 Conditions: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, AVCC* = 5.0 V ±10%, 1 1 AVref* = 4.5 V to AVCC, VSS = AVSS* = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 switching)* P67 to P60 (KWUL = 10)
Symbol VT VT
–
Min 1.0 —
Typ — — — — — — —
Max — VCC × 0.7 VCCB × 0.7 — — VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3
Unit V
Test Conditions
+
VT – VT VT VT VT VT VT VT
– + + – + + – + +
+
–
0.4 VCC × 0.3 —
V
VT – VT
–
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
–
VCC × 0.03 — VCC × 0.45 — — — — —
VT – VT Input high voltage RES, STBY, NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
–
0.05 VCC –0.7
(2)
VIH
V
VCC × 0.7 2.0 2.0
— — —
VCC +0.3 VCCB +0.3 AVCC +0.3 VCC +0.3
VCCB × 0.7 —
Rev. 4.00 Sep 27, 2006 page 804 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, and 4 58 P52* )* *
4 P97, P52*
Symbol (3) VIL
Min –0.3 –0.3 –0.3
Typ — — —
Max 0.5 1.0 0.8
Unit V
VOH
— VCC –0.5 VCCB –0.5 3.5 2.0 — — — — — — — — —
— — — 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V V V µA µA µA µA
IOH = –200 µA IOH = –1 mA IOH = –200 µA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V Vin = 0 V
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3 RESO
VOL
— — —
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Iin
— — —
Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state) Input pull-up MOS current Ports 1 to 3 8 Ports A* , B, Port 6 (P6PUE = 0) Port 6 (P6PUE = 1)
ITSI
—
–IP
30 60
— —
300 600
µA µA
15
—
200
µA
Rev. 4.00 Sep 27, 2006 page 805 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, f = 1 MHz, Ta = 25°C
Item Input RES capacitance NMI P52, P97, P42, P86 PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol Cin
Min — — —
Typ — — —
Max 80 50 20
Unit pF pF pF
— ICC — — — — AlCC — — — —
— 55 36 1.0 — 1.2 0.01 0.5 2.0
15 70 55 5.0 20.0 2.0 5.0 1.0 5.0
pF mA mA µA µA mA µA mA mA AVCC= 2.0 V to 5.5 V f = 20 MHz f = 20 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
—
1
0.01 — — —
5.0 5.5 5.5 —
µA V V V
AVref= 2.0 V to AVCC Operating Idle/not used
Analog power supply voltage* RAM standby voltage
AVCC VRAM
4.5 2.0 2.0
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately.
Rev. 4.00 Sep 27, 2006 page 806 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. Port A characteristics depends on VCCB (or on VCC when other pins are in output mode). 9. Current dissipation values are for VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 4.5V, VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V.
Rev. 4.00 Sep 27, 2006 page 807 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.17 DC Characteristics (2)
1 Conditions: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, AVCC* = 4.0 V to 5.5 V, 1 1 AVref* = 4.0 V to AVCC, VSS = AVSS* = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3
Symbol Min VT VT
– +
Typ — — — — — — — — — —
Max — VCC × 0.7 VCCB × 0.7 — — VCC × 0.7 VCCB × 0.7 — — VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3
Unit V V V V V V V
Test Conditions VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V VCC = 4.0 V to 4.5 V, VCCB = 4.0 V to 4.5 V VCC = 4.0 V to 5.5 V
1.0 —
–
VT – VT VT VT
– +
+
0.4 0.8 —
VT – VT Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 switching)* P67 to P60 (KWUL = 10) VT VT VT VT VT VT
– + + – + + – + +
+
–
0.3 VCC × 0.3 —
VT – VT
–
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
–
VCC × 0.03 — VCC × 0.45 — — — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
–
0.05 VCC –0.7 VCC × 0.7 2.0 2.0
VIH
V V
VCCB × 0.7 —
VCCB + 0.3 V AVCC +0.3 V VCC +0.3 V
Rev. 4.00 Sep 27, 2006 page 808 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
Symbol Min VIL –0.3 –0.3 –0.3 NMI, EXTAL, input pins except (1) and (3) above –0.3
Typ — — — —
Max 0.5 1.0 0.8 0.8
Unit V V V V
VCCB = 4.5 V to 5.5 V VCCB = 4.0 V to 4.5 V
Output high All output pins voltage (except P97, 4 58 and P52* )* *
VOH
— VCC –0.5 VCCB –0.5 3.5 —
— —
V V
IOH = –200 µA IOH = –1 mA, VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V IOH = –1 mA, VCC = 4.0 V to 4.5 V, VCCB = 4.0 V o 4.5 V IOH = –200 µA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB −0.5 V
3.0
—
—
V
4 P97, P52*
1.5 VOL — — — Iin — — — ITSI —
— — — — — — — —
— 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V µA µA µA µA
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3 RESO
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state)
Rev. 4.00 Sep 27, 2006 page 809 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V
Item Input pull-up MOS current Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol Min –IP 30 60
Typ — —
Max 300 600
Unit µA µA
15 20 40
— — —
200 200 500 µA µA Vin = 0 V, VCC = 4.0 V to 4.5 V, VCCB = 4.0 V to 4.5 V
10 Cin — — — — ICC — — — — AlCC — — — — —
1
— — — — — 45 30 1.0 — 1.2 0.01 0.5 2.0 0.01 — — —
150 80 50 20 15 58 46 5.0 20.0 2.0 5.0 1.0 5.0 5.0 5.5 5.5 — mA µA mA mA µA V V V AVref = 2.0 V to AVCC Operating Idle/not used AVCC = 2.0 V to 5.5 V pF pF pF pF mA mA µA f = 16 MHz f = 16 MHz Ta ≤ 50°C 50°C < Ta Vin = 0 V, f = 1 MHz, Ta = 25°C
During A/D conversion Alref During A/D, D/A conversion Idle
Analog power supply voltage* RAM standby voltage
AVCC VRAM
4.0 2.0 2.0
Rev. 4.00 Sep 27, 2006 page 810 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately. 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. The port A characteristics depend on VCCB, and the other pins characteristics depend on VCC. 9. Current dissipation values are for VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V.
Rev. 4.00 Sep 27, 2006 page 811 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.17 DC Characteristics (3)
11 1 Conditions: VCC = 2.7 V to 3.6 V* , VCCB = 2.7 V to 5.5 V, AVCC* = 2.7 V to 3.6 V, 1 AVref = 2.7 V to 3.6 V, VSS = AVSS* = 0 V, Ta = –20 to +75°C
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 swiching)* P67 to P60 (KWUL = 10)
Symbol VT VT
–
Min
Typ
Max —
Unit V
Test Conditions
VCC × 0.2 — VCCB × 0.2 —
–
+
—
VCC × 0.7 V VCCB × 0.7 — V
VT – VT
+
VCC × 0.05 — VCCB × 0.05
VT VT VT VT VT VT
– + + – + + – + + – – –
VCC × 0.3 — VCC × 0.4 —
— — — —
— VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3
V
VT – VT
VCC × 0.05 —
VT – VT P67 to P60 (KWUL = 11)
VCC × 0.03 — VCC × 0.45 — — 0.05 VCC × 0.9 VCC × 0.7 — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
VIH
V V
VCCB × 0.7 — VCC × 0.7 VCC × 0.7
VCCB +0.3 V AVCC +0.3 V VCC +0.3 V
Rev. 4.00 Sep 27, 2006 page 812 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
Symbol VIL
Min –0.3 –0.3
Typ — —
Max VCC × 0.1
Unit V
VCCB × 0.2 V 0.8 V V
VCCB = 2.7 V to 4.0 V VCCB = 4.0 V to 5.5 V VCC = 2.7 V to 3.6 V
NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, 4 58 and P52* )* * VOH
–0.3
—
VCC × 0.2
— VCC –0.5 VCCB –0.5 VCC –1.0 — VCCB –1.0
— —
V V
IOH = –200 µA IOH = –1 mA (VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 4.0 V) IOH = –200 µA IOL = 1.6 mA IOL = 5 mA IOL = 1.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V
4 P97, P52*
0.5 VOL — — — Iin — — — ITSI —
— — — — — — — —
— 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V µA µA µA µA
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3 RESO
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state)
Rev. 4.00 Sep 27, 2006 page 813 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 3.6 V
Item Input pullup MOS current Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol –IP
Min 5 30
Typ — —
Max 150 300
Unit µA µA
3 Cin — — —
— — — —
100 80 50 20
µA pF pF pF
Vin = 0 V, f = 1 MHz, Ta = 25°C
— ICC — — — — AlCC — — — —
— 30 20 1.0 — 1.2 0.01 0.5 2.0
15 40 32 5.0 20.0 2.0 5.0 1.0 5.0
pF mA mA µA µA mA µA mA mA AVCC = 2.0 V to 3.6 V f = 10 MHz f = 10 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
— AVCC VRAM 2.7 2.0 2.0
0.01 — — —
5.0 3.6 3.6 —
µA V V V
AVref = 2.0 V to AVCC Operating Idle/not used
1 Analog power supply voltage*
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 3.6 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. Rev. 4.00 Sep 27, 2006 page 814 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 4. In the H8S/2148 Group, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2148 Group, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately. 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. The port A characteristics depend on VCCB, and the other pins characteristics depend on VCC. 9. Current dissipation values are for VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC –0.2 V, VCCB –0.2 V, and VIL max = 0.2 V. 11. For flash memory program/erase operations, the applicable ranges are VCC = 3.0 V to 3.6 V.
Rev. 4.00 Sep 27, 2006 page 815 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.18 Permissible Output Currents Conditions: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 20 Unit mA
— — — — — — —
— — — — — — —
10 3 2 80 120 2 40
mA mA mA mA mA mA mA
Rev. 4.00 Sep 27, 2006 page 816 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Conditions: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 10 Unit mA
— — — — — — —
— — — — — — —
2 1 1 40 60 2 30
mA mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 26.18. 2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the output line, as show in figures 26.1 and 26.2.
Rev. 4.00 Sep 27, 2006 page 817 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.19 Bus Drive Characteristics Conditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VSS = 0 V Applicable Pins: SCL1, SCL0, SDA1, SDA0 (bus drive function selected)
Item Schmitt trigger input voltage Symbol VT VT
– + + –
Min VCC × 0.3 — VCC × 0.05 VCC × 0.7 –0.5 — — —
Typ — — — — — — — — — —
Max — VCC × 0.7 — VCC +0.5 VCC × 0.3 0.8 0.5 0.4 20 1.0 250
Unit V
Test Conditions
VT – VT Input high voltage Input low voltage Output low voltage VIH VIL VOL
V V IOL = 16 mA, VCC = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA pF µA ns Vin = 0 V, f = 1 MHz, Ta = 25°C Vin = 0.5 to VCC –0.5 V
Input capacitance
Cin
— —
Three-state leakage | ITSI | current (off state) SCL, SDA output fall time tOf
20 + 0.1 Cb —
Conditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VCCB = 2.7 V to 5.5 V, VSS = 0 V Applicable Pins: PS2AC, PS2AD, PS2BC, PS2BD, PS2CC, PS2CD, PA7 to PA4 (bus drive function selected)
Item Output low voltage Symbol VOL Min — — — Typ — — — Max 0.8 0.5 0.4 Unit V Test Conditions IOL = 16 mA, VCCB = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
26.3.3
AC Characteristics
Clock timing, control signal timing, bus timing, and timing of on-chip supporting modules list the following. Figure 26.4 shows the test conditions for the AC characteristics.
Rev. 4.00 Sep 27, 2006 page 818 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(1) Clock Timing Table 26.20 shows the clock timing. The clock timing specified here covers clock (φ) output and clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times. For details of external clock input (EXTAL pin and EXCL pin) timing, see section 24, Clock Pulse Generator. Table 26.20 Clock Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) External clock output stabilization delay time Symbol tcyc tCH tCL tCr tCf tOSC1 Min 50 17 17 — — 10 Max 500 — — 8 8 — Condition B 16 MHz Min 62.5 20 20 — — 10 Max 500 — — 10 10 — Condition C 10 MHz Min 100 30 30 — — 20 Max 500 — — 20 20 — Unit ns ns ns ns ns ms Figure 26.6 Test Conditions Figure 26.5 Figure 26.5
tOSC2
8
—
8
—
8
—
ms
Figure 26.7
tDEXT
500
—
500
—
500
—
µs
Rev. 4.00 Sep 27, 2006 page 819 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(2) Control Signal Timing Table 26.21 shows the control signal timing. The only external interrupts that can operate on the subclock (φ = 32.768 kHz) are NMI and IRQ0, 1, 2, 6, and 7. Table 26.21 Control Signal Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item RES setup time RES pulse width NMI setup time (NMI) NMI hold time (NMI) NMI pulse width (exiting software standby mode) IRQ setup time (IRQ7 to IRQ0) IRQ hold time (IRQ7 to IRQ0) IRQ pulse width (IRQ7, IRQ6, IRQ2 to IRQ0) (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW Min 200 20 150 10 200 Max — — — — — Condition B 16 MHz Min 200 20 150 10 200 Max — — — — — Condition C 10 MHz Min 300 20 250 10 200 Max — — — — — ns Unit ns tcyc ns Figure 26.9 Test Conditions Figure 26.8
tIRQS tIRQH tIRQW
150 10 200
— — —
150 10 200
— — —
250 10 200
— — —
ns ns ns
Rev. 4.00 Sep 27, 2006 page 820 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(3) Bus Timing Table 26.22 shows the bus timing. Operation in external expansion mode is not guaranteed when operating on the subclock (φ = 32.768 kHz). Table 26.22 Bus Timing (1) (Nomal mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 20 Min — Condition B 16 MHz Max 30 Min — Condition C 10 MHz Max 40 Test Unit Conditions ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
— 0.5 × tcyc –15 — 0.5 × tcyc –10 — — — — 15 0 20 30 30 30 — —
0.5 × — tcyc –20 0.5 × — tcyc –15 — — — — 20 0 30 45 45 45 — —
0.5 × — tcyc –30 0.5 × — tcyc –20 — — — — 35 0 40 60 60 60 — —
Read data tRDS setup time Read data tRDH hold time
Rev. 4.00 Sep 27, 2006 page 821 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 1.0 × tcyc –30 1.5 × tcyc –25 2.0 × tcyc –30 2.5 × tcyc –25 3.0 × tcyc –30 30 30 Min — Condition B 16 MHz Max 1.0 × tcyc –40 1.5 × tcyc –35 2.0 × tcyc –40 2.5 × tcyc –35 3.0 × tcyc –40 45 45 Min — Condition C 10 MHz Max 1.0 × tcyc –60 1.5 × tcyc –50 2.0 × tcyc –60 2.5 × tcyc –50 3.0 × tcyc –60 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC1 access time 1 Read data tACC2 access time 2 Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 1.5 × — tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 822 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.22 Bus Timing (2) (Advanced mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 30 Min — Condition B 16 MHz Max 45 Min — Condition C 10 MHz Max 60 Test Unit Conditions ns ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
0.5 × — tcyc –25 0.5 × — tcyc –10 — — — — 15 0 — 30 30 30 30 — — 1.0 × tcyc –40 1.5 × tcyc –25
0.5 × — tcyc –35 0.5 × — tcyc –15 — — — — 20 0 — 45 45 45 45 — — 1.0 × tcyc –55 1.5 × tcyc –35
0.5 × — tcyc –50 0.5 × — tcyc –20 — — — — 35 0 — 60 60 60 60 — — 1.0 × tcyc –80 1.5 × tcyc –50
Read data tRDS setup time Read data tRDH hold time Read data tACC1 access time 1 Read data tACC2 access time 2
—
—
—
ns
Rev. 4.00 Sep 27, 2006 page 823 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 2.0 × tcyc –40 2.5 × tcyc –25 3.0 × tcyc –40 30 30 Min — Condition B 16 MHz Max 2.0 × tcyc –55 2.5 × tcyc –35 3.0 × tcyc –55 45 45 Min — Condition C 10 MHz Max 2.0 × tcyc –80 2.5 × tcyc –50 3.0 × tcyc –80 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 — 1.5 × tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 824 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Tables 26.23 to 26.25 show the on-chip supporting module timing. The only on-chip supporting modules that can operate in subclock operation (φ = 32.768 kHz) are the I/O ports, external interrupts (NMI and IRQ0, 1, 2, 6, and 7), the watchdog timer, and the 8-bit timer (channels 0 and 1). Table 26.23 Timing of On-Chip Supporting Modules (1) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A Condition B Condition C 20 MHz Item I/O ports Symbol Min Output data delay tPWD time Input data setup time Input data hold time FRT tPRS tPRH — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 16 MHz Min — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 10 MHz Min — 50 50 — 50 50 1.5 2.5 Max 100 — — 100 — — — — tcyc Figure 26.17 ns Figure 26.16 Test Unit Conditions ns Figure 26.15
Timer output delay tFTOD time Timer input setup tFTIS time Timer clock input setup time Timer clock pulse width Single edge Both edges tFTCS tFTCWH tFTCWL
Rev. 4.00 Sep 27, 2006 page 825 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A Condition B Condition C 20 MHz Item TMR Timer output delay time Timer reset input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tTMOD tTMRS tTMCS tTMCWH tTMCWL tPWOD — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 16 MHz Min — 30 30 1.5 2.5 — 4 6 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 10 MHz Min — 50 50 1.5 2.5 — 4 6 0.4 — — — Max 100 — — — — 100 — — 0.6 1.5 1.5 100 ns Figure 26.23 tScyc tcyc ns tcyc Figure 26.21 Figure 26.22 tcyc Test Unit Conditions ns Figure 26.18 Figure 26.20 Figure 26.19
PWM, Pulse output PWMX delay time SCI Input clock cycle
Asynchro- tScyc nous Synchronous
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time (synchronous)
Receive data setup tRXS time (synchronous) Receive data hold tRXH time (synchronous) A/D Trigger input setup tTRGS conver- time ter WDT RESO output delay tRESD time RESO output pulse tRESOW width Note: *
50 50 30
— — —
50 50 30
— — —
100 100 50
— — —
ns ns ns Figure 26.24 Figure 26.25
— 132
100 —
— 132
120 —
— 132
200 —
ns tcyc
Only supporting modules that can be used in subclock operation
Rev. 4.00 Sep 27, 2006 page 826 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.23 Timing of On-Chip Supporting Modules (2) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VCCB = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item HIF read cycle CS/HA0 setup time IOR pulse width HDB delay time HDB hold time HIRQ delay time HIF write cycle CS/HA0 setup time IOW pulse width HDB setup time Symbol tHAR Min 10 10 120 — 0 — 10 10 60 30 Max — — — 100 25 120 — — — — Condition B 16 MHz Min 10 10 120 — 0 — 10 10 60 30 Max — — — 100 25 120 — — — — Condition C 10 MHz Min 10 10 220 — 0 — 10 10 100 50 Max — — — 200 40 200 — — — — Unit ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 26.26
CS/HA0 hold time tHRA tHRPW tHRD tHRF tHIRQ tHAW
CS/HA0 hold time tHWA tHWPW
Fast A20 tHDW gate not used Fast A20 gate used
45 tHWD tHGA 15 —
— — 90
55 15 —
— — 90
85 25 —
— — 180
ns ns ns
HDB hold time GA20 delay time
Rev. 4.00 Sep 27, 2006 page 827 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.24 Keyboard Buffer Controller Timing Conditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VCCB = 2.7 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Ratings Item Symbol Min Typ Max 250 — — 450 400 Unit ns ns ns ns pF Test Conditions
Notes Figure 26.27
KCLK, KD output tKBF fall time KCLK, KD input data hold time KCLK, KD input data setup time tKBIH tKBIS
20 + 0.1 Cb — 150 150 — — — — — —
KCLK, KD output tKBOD delay time KCLK, KD capacitive load Cb
Rev. 4.00 Sep 27, 2006 page 828 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.25 I C Bus Timing Conditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VSS = 0 V, φ = 5 MHz to maximum operating frequency
Ratings Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time Symbol tSCL tSCLH tSCLL tSr tSf Min 12 3 5 — — Typ — — — — — Max — — — 7.5* 300 250 1 Unit tcyc tcyc tcyc tcyc ns ns tcyc Test Conditions Notes Figure 26.28
2
SCL, SDA output tof fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load Note: * tSP
20 + 0.1 Cb — — —
tBUF tSTAH tSTAS
5 3 3
— — —
— — —
tcyc tcyc tcyc
tSTOS tSDAS tSDAH Cb
3 0.5 0 —
— — — —
— — — 400
tcyc tcyc ns pF
2
17.5tcyc can be set according to the clock selected for use by the I C module. For details, see section 16.4, Usage Notes.
Rev. 4.00 Sep 27, 2006 page 829 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.3.4
A/D Conversion Characteristics
Tables 26.26 and 26.27 list the A/D conversion characteristics. Table 26.26 A/D Conversion Characteristics (AN7 to AN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*3 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
2 1
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
2 1
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 5 Unit Bits
µs
pF kΩ
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
— — — — —
— — — — —
±7.0 ±7.5 ±7.5 ±0.5 ±8.0
LSB LSB LSB LSB LSB
Notes: 1. When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) 2. When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) 3. In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 830 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.27 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
4 4 4 Condition C: VCC = 3.0 V to 3.6 V* , AVCC = 3.0 V to 3.6 V* , AVref = 3.0 V to AVCC* , 4 VCCB = 3.0 V to 5.5 V* , VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*3 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
2 1
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
2 1
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 5 Unit Bits
µs
pF kΩ
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
— — — — —
— — — — —
±11.0 ±11.5 ±11.5 ±0.5 ±12.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4.
When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency. When using CIN, the applicable range is VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, AVref = 3.0 V to 3.6 V, and VCCB = 3.0 V to 5.5 V.
Rev. 4.00 Sep 27, 2006 page 831 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.3.5
D/A Conversion Characteristics
Table 26.28 lists the D/A conversion characteristics. Table 26.28 D/A Conversion Characteristics Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Min 8 Typ 8 — Max 8 10 Min 8 — Condition B 16 MHz Typ 8 — Max 8 10 Min 8 — Condition C 10 MHz Typ 8 — Max 8 10 Unit Bits µs
Conversion With 20-pF — time load capacitance Absolute accuracy With 2-MΩ load resistance With 4-MΩ load resistance —
±1.0
±1.5
—
±1.0
±1.5
—
±2.0
±3.0
LSB
—
—
±1.0
—
—
±1.0
—
—
±2.0
26.3.6
Flash Memory Characteristics
Table 26.29 shows the flash memory characteristics.
Rev. 4.00 Sep 27, 2006 page 832 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.29 Flash Memory Characteristics (Programming/erasing operating range) Conditions (5 V version): VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) (3 V version): VCC = 3.0 V to 3.6V, VSS = 0 V, Ta = –20 to 75°C
Item Programming time*1 *2 *4 Erase time*1 *3 *6 Reprogramming count Data retention time*
10
Symbol Min tP tE NWEC tDRP x y z1 z2 z3 Wait time after P-bit clear*1 Wait time after PSU-bit clear*1 Wait time after PV-bit setting*1 Wait time after dummy write*1 Wait time after PV-bit clear*1 Wait time after SWE-bit clear*1 Maximum programming count*1 *4 *5 α β γ ε η θ N x y z α β γ ε η θ N — — 100*8 10 1 50 28 198 8 5 5 4 2 2 100 — 1 100 10 10 10 20 2 4 100 —
Typ 10 100
Max 200 1200
Unit ms/ 128 bytes ms/ block Times Years µs µs µs µs µs µs µs µs µs µs µs Times µs µs ms µs µs µs µs µs µs Times
Test Condition
10000*9 — — — — 30 200 10 — — — — — — — — — — — — — — — — — — — — 32 202 12 — — — — — — 1000 — — 100 — — — — — — 120
Programming Wait time after SWE-bit setting*1 Wait time after PSU-bit setting*1 Wait time after P-bit setting*1 *4
1≤n≤6 7 ≤ n ≤ 1000 Additional writing
Erase
Wait time after SWE-bit setting*1 Wait time after ESU-bit setting*1 Wait time after E-bit setting*1 *6 Wait time after E-bit clear*1 Wait time after ESU-bit clear*1 Wait time after EV-bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV-bit clear*1 Wait time after SWE-bit clear*1 Maximum erase count*1 *6 *7
Rev. 4.00 Sep 27, 2006 page 833 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in FLMCR1 is set. It does not include the programming verification time.) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time.) 4. Maximum programming time (tP (max)) tP(max) = (Wait time after P-bit setting (z1) + (z3)) × 6 + Wait time after P-bit setting (z2) × ((N) – 6) 5. Maximum programming count (N) should be set according to the actual set value of (z1, z2, z3) to allow programming within the maximum programming time (tP(max)). The wait time after P-bit setting (z1, z2, z3) must be changed with the value of the number of writing times (n) as follows. The number of times for writing n 1≤n≤6 z1 = 30 µs, z3 = 10 µs 7 ≤ n ≤ 1000 z2 = 200 µs 6. Maximum erase time (tE (max)) tE(max) = Waiting time after E-bit setting (z) × Maximum erase count (N) 7. Maximum erase count (N) should be set according to the actual setting (z) to allow erase within the maximum erase time (tE(max)). 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
Rev. 4.00 Sep 27, 2006 page 834 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.3.7
Usage Note
(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values for electrical characteristics shown in this manual. However, actual performance figures, operating margins, noise margins, and other properties may vary due to differences in the manufacturing process, on-chip ROM, layout patterns, etc. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests should also be conducted for the mask ROM version when changing over to that version. (2) On-chip power supply step-down circuit The following products incorporate an internal power supply step-down circuit, which automatically drops down the internal power supply voltage to the optimum internal voltage level: the F-ZTAT A-mask versions of the H8S/2148, H8S/2147, and H8S/2144 (HD64F2148A, HD64F2147A, and HD64F2144A) and the mask ROM versions of the H8S/2148, H8S/2147, H8S/2144, and H8S/2143 (HD6432148S, HD6432148SW, HD6432147S, HD6432147SW, HD6432144S, and HD6432143S). The voltage-stabilization capacitor (0.47 µF one or two connected in group) must be connected between the VCL (internal power supply step-down) and VSS pins. Figure 26.3 shows the connection of the external capacitors. For the 5- or 4-V version whose power supply (VCC) voltage exceeds 3.6 V, do not connect the VCL pin in a product incorporating an internal step-down circuit to the VCC power supply. (Connect the VCC1 pin to the VCC power supply as usual.) For the 3-V version whose power supply (VCC) voltage is 3.6 V or lower, connect both the VCL and VCC1 pins to the system power supply. When changing from the F-ZTAT versions not incorporating an internal step-down circuit to the F-ZTAT A-mask versions or mask ROM versions incorporating an internal step-down circuit, the VCL pin has the same pin location as the VCC2 pin. Therefore, note that the circuit patterns differ between these two types of products.
Rev. 4.00 Sep 27, 2006 page 835 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.4
26.4.1
Electrical Characteristics of H8S/2147N F-ZTAT
Absolute Maximum Ratings
Table 26.30 lists the absolute maximum ratings. Table 26.30 Absolute Maximum Ratings
Item Power supply voltage* Input/output buffer power supply (power supply for the port A) Input voltage (except ports 6, 7, and A) Input voltage (CIN input not selected for port 6) Input voltage (CIN input not selected for port A) Input voltage (CIN input selected for port 6) Input voltage (CIN input selected for port A) Input voltage (port 7) Reference supply voltage Analog power supply voltage Analog input voltage Operating temperature Operating temperature (flash memory programming/erasing) Storage temperature Symbol VCC VCCB Vin Vin Vin Vin Vin Vin AVref AVCC VAN Topr Topr Tstg Value –0.3 to +7.0 –0.3 to +7.0 –0.3 to VCC +0.3 –0.3 to VCC +0.3 –0.3 to VCCB +0.3 –0.3 V to lower of voltages VCC +0.3 and AVCC +0.3 –0.3 V to lower of voltages VCCB +0.3 and AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Regular specifications: 0 to +75 –55 to +125 Unit V V V V V V V V V V V °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Note: * Power supply voltage for VCC1 and VCC2 pins.
Rev. 4.00 Sep 27, 2006 page 836 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.4.2
DC Characteristics
Table 26.31 lists the DC characteristics. Permitted output current values and bus drive characteristics are shown in tables 26.32 and 26.33, respectively. Table 26.31 DC Characteristics (1)
1 Conditions: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, AVCC* = 5.0 V ±10%, 1 1 11 AVref* = 4.5 V to AVCC, VSS = AVSS* = 0 V, Ta = –20 to +75°C*
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 switching)* P67 to P60 (KWUL = 10)
Symbol VT VT
– +
Min 1.0 —
Typ — — —
Max — VCC × 0.7 VCCB × 0.7 —
Unit V
Test Conditions
VT – VT
+
–
0.4
VT VT VT VT VT VT
– + + – + + – + + – – –
VCC × 0.3 — VCC × 0.4 —
— — — —
— VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3 VCCB +0.3 AVCC +0.3 VCC +0.3
V
VT – VT
VCC × 0.05 —
VT – VT P67 to P60 (KWUL = 11)
VCC × 0.03 — VCC × 0.45 — — 0.05 VCC –0.7 VCC × 0.7 — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
VIH
V
VCCB × 0.7 — 2.0 2.0
Rev. 4.00 Sep 27, 2006 page 837 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, and 4 58 P52* )* *
4 P97, P52*
Symbol (3) VIL
Min –0.3 –0.3 –0.3
Typ — — —
Max 0.5 1.0 0.8
Unit V
VOH
VCC –0.5 VCCB –0.5 3.5 2.5
— — — — — — — — — —
— — — 0.4 1.0 0.4 10.0 1.0 1.0 1.0
V V V V V V µA µA µA µA
IOH = –200 µA IOH = –1 mA IOH = –1 mA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V Vin = 0 V
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3 RESO
VOL
— — —
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Iin
— — —
Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state) Input pull-up MOS current Ports 1 to 3 8 Ports A* , B, Port 6 (P6PUE = 0) Port 6 (P6PUE = 1)
ITSI
—
–IP
50 60
— —
300 500
µA µA
15
—
150
µA
Rev. 4.00 Sep 27, 2006 page 838 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, f = 1 MHz, Ta = 25°C
Item Input RES capacitance NMI P52, P97, P42, P86 PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol Cin
Min — — —
Typ — — —
Max 80 50 20
Unit pF pF pF
— ICC — — — — AlCC — — — —
— 75 60 0.01 — 1.2 0.01 0.5 2.0
15 100 85 5.0 20.0 2.0 5.0 1.0 5.0
pF mA mA µA µA mA µA mA mA AVCC= 2.0 V to 5.5 V f = 20 MHz f = 20 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
—
1
0.01 — — —
5.0 5.5 5.5 —
µA V V V
AVref= 2.0 V to AVCC Operating Idle/not used
Analog power supply voltage* RAM standby voltage
AVCC VRAM
4.5 2.0 2.0
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. In the H8S/2147N, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2147N, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately.
Rev. 4.00 Sep 27, 2006 page 839 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. Port A characteristics depends on VCCB (or on VCC when other pins are in output mode). 9. Current dissipation values are for VIH min = VCC –0.5 V, VCCB –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 4.5V, VIH min = VCC × 0.9, VCCB × 0.9, and VIL max = 0.3 V. 11. For flash memory program/erase operations, the applicable range is Ta = 0 to +75°C (regular specifications).
Rev. 4.00 Sep 27, 2006 page 840 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.31 DC Characteristics (2)
11 1 Conditions: VCC = 3.0 V to 5.5 V* , VCCB = 3.0 V to 5.5 V, AVCC* = 3.0 V to 5.5 V, 1 11 AVref = 3.0 V to 5.5 V, VSS = AVSS* = 0 V, Ta = –20 to +75°C*
Item Schmitt P67 to (1) trigger input P60(KWUL = 26 voltage 00)* * , KIN15 to 78 KIN8* * , 3 IRQ2 to IRQ0* , IRQ5 to IRQ3 Schmitt P67 to P60 trigger input (KWUL = 01) voltage (in level 6 swiching)* P67 to P60 (KWUL = 10)
Symbol VT VT
–
Min
Typ
Max —
Unit V
Test Conditions
VCC × 0.2 — VCCB × 0.2 —
–
+
—
VCC × 0.7 V VCCB × 0.7 — V
VT – VT
+
VCC × 0.05 — VCCB × 0.05 VCC × 0.3 — — — — —
VT VT VT VT VT VT
– + + – + + – + + – – –
— VCC × 0.7 — — VCC × 0.8 — — VCC × 0.9 — VCC +0.3 VCC +0.3
V
VT – VT
VCC × 0.05 — VCC × 0.4 —
VT – VT P67 to P60 (KWUL = 11)
VCC × 0.03 — VCC × 0.45 — — 0.05 VCC × 0.9 VCC × 0.7 — — — — — —
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL PA7 to PA0* Port 7 Input pins except (1) and (2) above
7
VIH
V V
VCCB × 0.7 — VCC × 0.7 VCC × 0.7
VCCB +0.3 V AVCC +0.3 V VCC +0.3 V
Rev. 4.00 Sep 27, 2006 page 841 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
Symbol VIL
Min –0.3 –0.3
Typ — —
Max VCC × 0.1
Unit V
VCCB × 0.2 V 0.8 V V V V V
VCCB = 3.0 V to 4.0 V VCCB = 4.0 V to 5.5 V VCC = 3.0 V to 4.0 V VCC = 4.0 V to 5.5 V IOH = –200 µA IOH = –1 mA (VCC = 3.0 V to 4.0 V, VCCB = 3.0 V to 4.0 V) IOH = –1 mA IOL = 1.6 mA IOL = 5 mA (VCC < 4.0 V), IOL = 10 mA (4.0 V ≤ VCC ≤ 5.5 V) IOL = 1.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V, Vin = 0.5 to VCCB –0.5 V
NMI, EXTAL, input pins except (1) and (3) above Output high All output pins voltage (except P97, 4 58 and P52* )* * VOH
–0.3
—
VCC × 0.2 0.8
— VCC –0.5 VCCB –0.5 — VCC –1.0 VCCB –1.0
— —
4 P97, P52*
1.0 VOL — —
— — —
— 0.4 1.0
V V V
Output low voltage
All output pins 5 (except RESO)* Ports 1 to 3
RESO Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, 8 leakage 9, A* , B current (off state) ITSI Iin
— — — — —
— — — — —
0.4 10.0 1.0 1.0 1.0
V µA µA µA µA
Rev. 4.00 Sep 27, 2006 page 842 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0 V, VCC = 3.0 V to 3.6 V, VCCB = 3.0 V to 3.6 V
Item Input pullup MOS current Ports 1 to 3 8 Ports A* , B Port 6 (P6PUE = 0) Port 6 (P6PUE = 1) Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 9 dissipation* Sleep mode 10 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle (4)
Symbol –IP
Min 10 30
Typ — —
Max 150 250
Unit µA µA
3 Cin — — —
— — — —
70 80 50 20
µA pF pF pF
Vin = 0 V, f = 1 MHz, Ta = 25°C
— ICC — — — — AlCC — — — —
— 45 35 0.01 — 1.2 0.01 0.5 2.0
15 60 50 5.0 20.0 2.0 5.0 1.0 5.0
pF mA mA µA µA mA µA mA mA AVCC = 2.0 V to 5.5 V f = 10 MHz f = 10 MHz Ta ≤ 50°C 50°C < Ta
During A/D conversion Alref During A/D, D/A conversion Idle
— AVCC VRAM 3.0 2.0 2.0
0.01 — — —
5.0 5.5 5.5 —
µA V V V
AVref = 2.0 V to AVCC Operating Idle/not used
1 Analog power supply voltage*
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. Rev. 4.00 Sep 27, 2006 page 843 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 4. In the H8S/2147N, P52/SCK0/SCL0 and P97/SDA0 are NMOS push-pull outputs. An external pull-up resistor is necessary to provide high-level output from SCL0 and SDA0 (ICE = 1). In the H8S/2147N, P52/SCK0 and P97 (ICE = 0) high levels are driven by NMOS. 5. When IICS = 0, ICE = 0, and KBIOE = 0. Low-level output when the bus drive function is selected is determined separately. 6. The upper limit of the port 6 applied voltage is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 7. The upper limit of the port A applied voltage is VCCB +0.3 V when CIN input is not selected, and the lower of VCCB +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 8. The port A characteristics depend on VCCB, and the other pins characteristics depend on VCC. 9. Current dissipation values are for VIH min = VCC –0.5 V, VCCB –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 10. The values are for VRAM ≤ VCC < 3.0 V, VIH min = VCC × 0.9, VCCB × 0.9, and VIL max = 0.3 V. 11. For flash memory program/erase operations, the applicable ranges are VCC = 3.0 V to 3.6 V and Ta = 0 to +75°C.
Rev. 4.00 Sep 27, 2006 page 844 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.32 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, VCCB = 4.5 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 20 Unit mA
— — — — — — —
— — — — — — —
10 3 2 80 120 2 40
mA mA mA mA mA mA mA
Rev. 4.00 Sep 27, 2006 page 845 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) SCL1, SCL0, SDA1, SDA0, PS2AC to PS2CC, PS2AD to PS2CD, PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — Typ — Max 10 Unit mA
— — — — — — —
— — — — — — —
2 1 1 40 60 2 30
mA mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 26.32. 2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the output line, as show in figures 26.1 and 26.2.
Rev. 4.00 Sep 27, 2006 page 846 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.33 Bus Drive Characteristics Conditions: VCC = 3.0 V to 5.5 V, VSS = 0 V Applicable Pins: SCL1, SCL0, SDA1, SDA0 (bus drive function selected)
Item Schmitt trigger input voltage Symbol VT VT
– + + –
Min VCC × 0.3 — VCC × 0.05 VCC × 0.7 –0.5 — — —
Typ — — — — — — — — — —
Max — VCC × 0.7 — VCC +0.5 VCC × 0.3 0.8 0.5 0.4 20 1.0 250
Unit V
Test Conditions VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V
VT – VT Input high voltage Input low voltage Output low voltage VIH VIL VOL
V V
VCC = 3.0 V to 5.5 V VCC = 3.0 V to 5.5 V IOL = 16 mA, VCC = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
Input capacitance
Cin
— —
pF µA ns
Vin = 0 V, f = 1 MHz, Ta = 25°C Vin = 0.5 to VCC –0.5 V VCC = 3.0 V to 5.5 V
Three-state leakage | ITSI | current (off state) SCL, SDA output fall time tOf
20 + 0.1 Cb —
Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V Applicable Pins: PS2AC, PS2AD, PS2BC, PS2BD, PS2CC, PS2CD, PA7 to PA4 (bus drive function selected)
Item Output low voltage Symbol VOL Min — — — Typ — — — Max 0.8 0.5 0.4 Unit V Test Conditions IOL = 16 mA, VCCB = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
26.4.3
AC Characteristics
Clock timing, control signal timing, bus timing, and timing of on-chip supporting modules list the following. Figure 26.4 shows the test conditions for the AC characteristics.
Rev. 4.00 Sep 27, 2006 page 847 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(1) Clock Timing Table 26.34 shows the clock timing. The clock timing specified here covers clock (φ) output and clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times. For details of external clock input (EXTAL pin and EXCL pin) timing, see section 24, Clock Pulse Generator. Table 26.34 Clock Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) External clock output stabilization delay time Symbol tcyc tCH tCL tCr tCf tOSC1 Min 50 17 17 — — 10 Max 500 — — 8 8 — Min 100 30 30 — — 20 Condition B 10 MHz Max 500 — — 20 20 — Unit ns ns ns ns ns ms Figure 26.6 Figure 26.7 Test Conditions Figure 26.5 Figure 26.5
tOSC2
8
—
8
—
ms
tDEXT
500
—
500
—
µs
Rev. 4.00 Sep 27, 2006 page 848 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(2) Control Signal Timing Table 26.35 shows the control signal timing. The only external interrupts that can operate on the subclock (φ = 32.768 kHz) are NMI and IRQ0, 1, 2, 6, and 7. Table 26.35 Control Signal Timing Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item RES setup time RES pulse width NMI setup time (NMI) NMI hold time (NMI) NMI pulse width (exiting software standby mode) IRQ setup time (IRQ7 to IRQ0) IRQ hold time (IRQ7 to IRQ0) IRQ pulse width (IRQ7, IRQ6, IRQ2 to IRQ0) (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW Min 200 20 150 10 200 Max — — — — — Min 300 20 250 10 200 Condition B 10 MHz Max — — — — — Unit ns tcyc ns ns ns Figure 26.9 Test Conditions Figure 26.8
tIRQS tIRQH tIRQW
150 10 200
— — —
250 10 200
— — —
ns ns ns
Rev. 4.00 Sep 27, 2006 page 849 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(3) Bus Timing Table 26.36 shows the bus timing. Operation in external expansion mode is not guaranteed when operating on the subclock (φ = 32.768 kHz). Table 26.36 Bus Timing (1) (Nomal mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — 0.5 × tcyc –15 0.5 × tcyc –10 — — — — 15 0 Max 20 — — 20 30 30 30 — — Min — 0.5 × tcyc –30 0.5 × tcyc –20 — — — — 35 0 Condition B 10 MHz Max 40 — — 40 60 60 60 — — Unit ns ns ns ns ns ns ns ns ns Test Conditions Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
Read data tRDS setup time Read data tRDH hold time
Rev. 4.00 Sep 27, 2006 page 850 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 1.0 × tcyc –30 1.5 × tcyc –25 2.0 × tcyc –30 2.5 × tcyc –25 3.0 × tcyc –30 30 30 — — 30 — — — — Min — Condition B 10 MHz Max 1.0 × tcyc –60 1.5 × tcyc –50 2.0 × tcyc –60 2.5 × tcyc –50 3.0 × tcyc –60 60 60 — — 60 — — — — Unit ns Test Conditions Figure 26.10 to figure 26.14
Read data tACC1 access time 1 Read data tACC2 access time 2 Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
ns
—
—
ns
—
—
ns
—
—
ns
— — 1.0 × tcyc –20 1.5 × tcyc –20 — 0 10 30 5
— — 1.0 × tcyc –40 1.5 × tcyc –40 — 0 20 60 10
ns ns ns ns ns ns ns ns ns
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 851 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.36 Bus Timing (2) (Advanced mode) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — 0.5 × tcyc –25 0.5 × tcyc –10 — — — — 15 0 — Max 30 — — 30 30 30 30 — — 1.0 × tcyc –40 1.5 × tcyc –25 Min — 0.5 × tcyc –50 0.5 × tcyc –20 — — — — 35 0 — Condition B 10 MHz Max 60 — — 60 60 60 60 — — 1.0 × tcyc –80 1.5 × tcyc –50 Unit ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
Read data tRDS setup time Read data tRDH hold time Read data tACC1 access time 1 Read data tACC2 access time 2
—
—
ns
Rev. 4.00 Sep 27, 2006 page 852 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 2.0 × tcyc –40 2.5 × tcyc –25 3.0 × tcyc –40 30 30 — — 30 — — — — Min — Condition B 10 MHz Max 2.0 × tcyc –80 2.5 × tcyc –50 3.0 × tcyc –80 60 60 — — 60 — — — — Unit ns Test Conditions Figure 26.10 to figure 26.14
Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
ns
—
—
ns
— — 1.0 × tcyc –20 1.5 × tcyc –20 — 0 10 30 5
— — 1.0 × tcyc –40 1.5 × tcyc –40 — 0 20 60 10
ns ns ns ns ns ns ns ns ns
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 853 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Tables 26.37 to 26.39 show the on-chip supporting module timing. The only on-chip supporting modules that can operate in subclock operation (φ = 32.768 kHz) are the I/O ports, external interrupts (NMI and IRQ0, 1, 2, 6, and 7), the watchdog timer, and the 8-bit timer (channels 0 and 1). Table 26.37 Timing of On-Chip Supporting Modules (1) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item I/O ports Symbol Min Output data delay tPWD time Input data setup time Input data hold time FRT tPRS tPRH — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — Min — 50 50 — 50 50 1.5 2.5 Condition B 10 MHz Max 100 — — 100 — — — — tcyc Figure 26.17 ns Figure 26.16 Unit ns Test Conditions Figure 26.15
Timer output delay tFTOD time Timer input setup tFTIS time Timer clock input setup time Timer clock pulse width Single edge Both edges tFTCS tFTCWH tFTCWL
Rev. 4.00 Sep 27, 2006 page 854 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item TMR Timer output delay time Timer reset input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tTMOD tTMRS tTMCS tTMCWH tTMCWL tPWOD — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 Min — 50 50 1.5 2.5 — 4 6 0.4 — — — Condition B 10 MHz Max 100 — — — — 100 — — 0.6 1.5 1.5 100 ns Figure 26.23 tScyc tcyc ns tcyc Figure 26.21 Figure 26.22 tcyc Unit ns Test Conditions Figure 26.18 Figure 26.20 Figure 26.19
PWM, Pulse output PWMX delay time SCI Input clock cycle
Asynchro- tScyc nous Synchronous
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time (synchronous)
Receive data setup tRXS time (synchronous) Receive data hold tRXH time (synchronous) A/D Trigger input setup tTRGS conver- time ter WDT RESO output delay tRESD time RESO output pulse tRESOW width Note: *
50 50 30
— — —
100 100 50
— — —
ns ns ns Figure 26.24 Figure 26.25
— 132
100 —
— 132
200 —
ns tcyc
Only supporting modules that can be used in subclock operation Rev. 4.00 Sep 27, 2006 page 855 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.37 Timing of On-Chip Supporting Modules (2) Condition A: VCC = 5.0 V ±10%, VCCB = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item HIF read cycle CS/HA0 setup time IOR pulse width HDB delay time HDB hold time HIRQ delay time HIF write cycle CS/HA0 setup time IOW pulse width HDB setup time Symbol tHAR Min 10 10 120 — 0 — 10 10 60 30 Max — — — 100 25 120 — — — — Min 10 10 220 — 0 — 10 10 100 50 Condition B 10 MHz Max — — — 200 40 200 — — — — Unit ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 26.26
CS/HA0 hold time tHRA tHRPW tHRD tHRF tHIRQ tHAW
CS/HA0 hold time tHWA tHWPW
Fast A20 tHDW gate not used Fast A20 gate used
45 tHWD tHGA 15 —
— — 90
85 25 —
— — 180
ns ns ns
HDB hold time GA20 delay time
Rev. 4.00 Sep 27, 2006 page 856 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.38 Keyboard Buffer Controller Timing Conditions: VCC = 3.0 V to 5.5 V, VCCB = 3.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Ratings Item Symbol Min Typ Max 250 — — 450 400 Unit ns ns ns ns pF Test Conditions
Notes Figure 26.27
KCLK, KD output tKBF fall time KCLK, KD input data hold time KCLK, KD input data setup time tKBIH tKBIS
20 + 0.1 Cb — 150 150 — — — — — —
KCLK, KD output tKBOD delay time KCLK, KD capacitive load Cb
Rev. 4.00 Sep 27, 2006 page 857 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.39 I C Bus Timing Conditions: VCC = 3.0 V to 5.5 V, VSS = 0 V, φ = 5 MHz to maximum operating frequency
Ratings Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load Note: * Symbol tSCL tSCLH tSCLL tSr tSf tSP Min 12 3 5 — — — Typ — — — — — — Max — — — 7.5* 300 1 Unit tcyc tcyc tcyc tcyc ns tcyc Test Conditions Notes Figure 26.28
2
tBUF tSTAH tSTAS
5 3 3
— — —
— — —
tcyc tcyc tcyc
tSTOS tSDAS tSDAH Cb
3 0.5 0 —
— — — —
— — — 400
tcyc tcyc ns pF
2
17.5tcyc can be set according to the clock selected for use by the I C module. For details, see section 16.4, Usage Notes.
Rev. 4.00 Sep 27, 2006 page 858 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.4.4
A/D Conversion Characteristics
Tables 26.40 and 26.41 list the A/D conversion characteristics. Table 26.40 A/D Conversion Characteristics (AN7 to AN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Condition B 10 MHz
Max
10 6.7 20 10*
4 5* 3
Min 10 — — —
Typ 10 — — —
Max 10 13.4 20 10*1
2 5*
Unit Bits
µs
pF kΩ
— — — — —
— — — — —
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
— — — — —
— — — — —
±7.0 ±7.5 ±7.5 ±0.5 ±8.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4. 5.
When 4.0 V ≤ AVCC ≤ 5.5 V When 3.0 V ≤ AVCC < 4.0 V When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 859 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.41 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition B: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Condition B 10 MHz
Max
10 6.7 20 10*
4 5* 3
Min 10 — — —
Typ 10 — — —
Max 10 13.4 20 10*1
2 5*
Unit Bits
µs
pF kΩ
— — — — —
— — — — —
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
— — — — —
— — — — —
±11.0 ±11.5 ±11.5 ±0.5 ±12.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4. 5.
When 4.0 V ≤ AVCC ≤ 5.5 V When 3.0 V ≤ AVCC < 4.0 V When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 860 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.4.5
D/A Conversion Characteristics
Table 26.42 lists the D/A conversion characteristics. Table 26.42 D/A Conversion Characteristics Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Min 8 Typ 8 — Max 8 10 Min 8 — Condition B 10 MHz Typ 8 — Max 8 10 Unit Bits µs
Conversion With 20-pF — time load capacitance Absolute accuracy With 2-MΩ load resistance With 4-MΩ load resistance —
±1.0
±1.5
—
±2.0
±3.0
LSB
—
—
±1.0
—
—
±2.0
Rev. 4.00 Sep 27, 2006 page 861 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.4.6
Flash Memory Characteristics
Table 26.43 shows the flash memory characteristics. Table 26.43 Flash Memory Characteristics (Programming/erasing operating range) Conditions (5 V version): VCC = 5.0 V ±10%, VSS = 0 V, Ta = 0 to +75°C (3 V version): VCC = 3.0 V to 3.6V, VSS = 0 V, Ta = 0 to +75°C
Item Programming time*1 *2 *4 Erase time*1 *3 *6 Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Wait time after PSU-bit setting*1 Wait time after P-bit setting*1 *4 Wait time after P-bit clear*1 Wait time after PSU-bit clear*1 Wait time after PV-bit setting*1 Wait time after dummy write*1 Wait time after PV-bit clear*1 Maximum programming count*1 *4 *5 Erase Wait time after SWE-bit setting*1 Wait time after ESU-bit setting*1 Wait time after E-bit setting*1 *6 Wait time after E-bit clear*1 Wait time after ESU-bit clear*1 Wait time after EV-bit setting*1 Wait time after dummy write*1 Wait time after EV-bit clear*
1
Symbol Min tP tE NWEC tDRP x y z α β γ ε η N x y z α β γ ε η N — — 100*8 10 10 50 150 10 10 4 2 4 — 10 200 5 10 10 20 2 5 —
Typ 10 100
Max 200 1200
Unit ms/ 32 bytes ms/ block Times Years µs µs µs µs µs µs µs µs Times µs µs ms µs µs µs µs µs Times
Test Condition
10000*9 — — — — — — — — — — — — — — — — — — — — — — — 200 — — — — — 1000 — — 10 — — — — — 120
z = 200 µs
Maximum erase count*1 *6 *7
z = 10 ms
Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 32 bytes (Shows the total period for which the P-bit in FLMCR1 is set. It does not include the programming verification time.)
Rev. 4.00 Sep 27, 2006 page 862 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time.) 4. Maximum programming time (tP (max)) tP(max) = wait time after P-bit setting (z) × maximum programming count (N) 5. Number of times when the wait time after P-bit setting (z) = 200 µs. The number of writes should be set according to the actual set value of (z) to allow programming within the maximum programming time (tP(max)). 6. Maximum erase time (tE (max)) tE(max) = wait time after E-bit setting (z) × maximum erase count (N) 7. Number of times when the wait time after E-bit setting (z) = 10 ms. The number of erases should be set according to the actual set value of (z) to allow erasing within the maximum erase time (tE(max)). 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.4.7
Usage Note
(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values for electrical characteristics shown in this manual. However, actual performance figures, operating margins, noise margins, and other properties may vary due to differences in the manufacturing process, on-chip ROM, layout patterns, etc. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests should also be conducted for the mask ROM version when changing over to that version. (2) On-chip power supply step-down circuit The H8S/2147N F-ZTAT does not incorporate an internal power supply step-down circuit. When changing over to F-ZTAT versions or mask ROM versions incorporating an internal step-down circuit, the VCC2 pin has the same pin location as the VCL pin in a step-down circuit (See figure 26.3). Therefore, note that the circuit patterns differ between these two types of products.
Rev. 4.00 Sep 27, 2006 page 863 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.5
Electrical Characteristics of H8S/2144 F-ZTAT, H8S/2142 F-ZTAT, and Mask ROM Version of H8S/2142
Absolute Maximum Ratings
26.5.1
Table 26.44 lists the absolute maximum ratings. Table 26.44 Absolute Maximum Ratings
Item Power supply voltage* Input voltage (except ports 6, 7, and A) Input voltage (CIN input not selected for port 6 and A) Input voltage (CIN input selected for port 6 and A) Input voltage (port 7) Reference supply voltage Analog power supply voltage Analog input voltage Operating temperature Operating temperature (flash memory programming/erasing) Storage temperature Symbol VCC Vin Vin Vin Vin AVref AVCC VAN Topr Topr Tstg Value –0.3 to +7.0 –0.3 to VCC +0.3 –0.3 to VCC +0.3 –0.3 V to lower of voltages VCC +0.3 and AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 Regular specifications: 0 to +75 Wide-range specifications: 0 to +85 –55 to +125 Unit V V V V V V V V °C °C °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Note: * Power supply voltage for VCC1 and VCC2 pins.
Rev. 4.00 Sep 27, 2006 page 864 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.5.2
DC Characteristics
Table 26.45 lists the DC characteristics. Permitted output current values and bus drive characteristics are shown in tables 26.46 and 26.47, respectively. Table 26.45 DC Characteristics (1)
1 1 Conditions: VCC = 5.0 V ±10%, AVCC* = 5.0 V ±10%, AVref* = 4.5 V to AVCC, 1 8 VSS = AVSS* = 0 V, Ta = –20 to +75°C* (regular specifications), 8 Ta = –40 to +85°C* (wide-range specifications)
Item
25 Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , *3, IRQ2 to IRQ0 voltage IRQ5 to IRQ3
Symbol VT VT
– +
Min 1.0 —
Typ — — — —
Max — VCC × 0.7 — VCC +0.3
Unit V V V V
Test Conditions
VT – VT VIH
+
–
0.4 VCC –0.7
Input high voltage
RES, STBY, NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above
(2)
VCC × 0.7 2.0 2.0
— — —
VCC +0.3
V
AVCC +0.3 V VCC +0.3 V
Input low voltage
RES, STBY, MD1, MD0 PA7 to PA0
(3)
VIL
–0.3 –0.3 –0.3
— — —
0.5 1.0 0.8
V V V
NMI, EXTAL, input pins except (1) and (3) above 4 Output high All output pins* voltage Output low voltage All output pins 4 (except RESO)* Ports 1 to 3 RESO
VOH VOL
VCC –0.5 3.5 — — —
— — — — —
— — 0.4 1.0 0.4
V V V V V
IOH = –200 µA IOH = –1 mA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA
Rev. 4.00 Sep 27, 2006 page 865 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0.5 to VCC –0.5 V
Item Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pull-up MOS current Ports 1 to 3 Ports 6, A, B
Symbol Iin
Min — — —
Typ — — — —
Max 10.0 1.0 1.0 1.0
Unit µA µA µA µA
Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V
ITSI
—
–IP
50 60
— —
300 500
µA µA
Vin = 0 V
Input RES capacitance NMI P52, P97, P42, P86 PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle
(4)
Cin
— — —
— — —
80 50 20
pF pF pF
Vin = 0 V, f = 1 MHz, Ta = 25°C
— ICC — — — — AlCC — — — — —
— 75 60 0.01 — 1.2 0.01 0.5 2.0 0.01
15 100 85 5.0 20.0 2.0 5.0 1.0 5.0 5.0
pF mA mA µA µA mA µA mA mA µA AVref= 2.0 V to AVCC AVCC= 2.0 V to 5.5 V Ta ≤ 50°C 50°C < Ta f = 20 MHz
During A/D conversion Alref During A/D, D/A conversion Idle
Rev. 4.00 Sep 27, 2006 page 866 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Operating Idle/not used
Item
1 Analog power supply voltage*
Symbol AVCC VRAM
Min 4.5 2.0 2.0
Typ — — —
Max 5.5 5.5 —
Unit V V V
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 4.5V, VIH min = VCC × 0.9, and VIL max = 0.3 V. 8. For flash memory program/erase operations, the applicable range is Ta = 0 to +75°C (regular specifications) or Ta = 0 to +85°C (wide-range specifications).
Rev. 4.00 Sep 27, 2006 page 867 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.45 DC Characteristics (2)
8 1 1 Conditions: VCC = 4.0 V to 5.5 V* , AVCC* = 4.0 V to 5.5 V, AVref* = 4.0 V to AVCC, 1 8 VSS = AVSS* = 0 V, Ta = –20 to +75°C* (regular specifications), 8 Ta = –40 to +85°C* (wide-range specifications)
Item
25 Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , *3, voltage IRQ2 to IRQ0 IRQ5 to IRQ3
Symbol Min VT VT VT VT
– + + – + + – –
Typ — — — — — — — — — —
Max — VCC × 0.7 — — VCC × 0.7 — VCC +0.3 VCC +0.3
Unit V V V V V V V V
Test Conditions VCC = 4.5 V to 5.5 V
1.0 — 0.4 0.8 — 0.3 VCC –0.7 VCC × 0.7 2.0 2.0
VT – VT
VCC= 4.0 V to 4.5 V
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3) VIL VIH
AVCC +0.3 V VCC +0.3 V
–0.3 –0.3 –0.3
— — — —
0.5 1.0 0.8 0.8
V V V V VCC = 4.5 V to 5.5 V VCC = 4.0 V to 4.5 V
NMI, EXTAL, input pins except (1) and (3) above 4 Output high All output pins* voltage
–0.3
VOH
VCC –0.5 3.5
— —
— —
V V
IOH = –200 µA IOH = –1 mA, VCC = 4.5 V to 5.5 V IOH = –1 mA, VCC = 4.0 V to 4.5 V
3.0
—
—
V
Rev. 4.00 Sep 27, 2006 page 868 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V
Item Output low voltage All output pins 4 (except RESO)* Ports 1 to 3 RESO Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pull-up MOS current Ports 1 to 3 Ports 6, A, B Ports 1 to 3 Ports 6, A, B (4)
Symbol Min VOL — — — Iin — — — ITSI —
Typ — — — — — — —
Max 0.4 1.0 0.4 10.0 1.0 1.0 1.0
Unit V V V µA µA µA µA
–IP
50 60 30 40
— — — — — — — — 65 50 0.01 — 1.2 0.01
300 500 200 400 80 50 20 15 85 70 5.0 20.0 2.0 5.0
µA µA µA µA pF pF pF pF mA mA µA µA mA µA
Vin = 0 V, VCC = 4.5 V to 5.5 V Vin = 0 V, VCC = 4.0 V to 4.5 V Vin = 0 V, f = 1 MHz, Ta = 25°C
Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current During A/D, D/A conversion Idle
Cin
— — — —
ICC
— — — —
f = 16 MHz f = 16 MHz Ta ≤ 50°C 50°C < Ta
AlCC
— —
AVCC = 2.0 V to 5.5 V
Rev. 4.00 Sep 27, 2006 page 869 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Reference power supply current
Symbol Min During A/D conversion Alref During A/D, D/A conversion Idle — —
Typ 0.5 2.0
Max 1.0 5.0
Unit mA mA
—
1
0.01 — — —
5.0 5.5 5.5 —
µA V V V
AVref = 2.0 V to AVCC Operating Idle/not used
Analog power supply voltage* RAM standby voltage
AVCC VRAM
4.0 2.0 2.0
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC × 0.9, and VIL max = 0.3 V. 8. For flash memory program/erase operations, the applicable ranges are VCC = 4.5 V to 5.5 V and Ta = 0 to +75°C (regular specifications) or Ta = 0 to +85°C (wide-range specifications).
Rev. 4.00 Sep 27, 2006 page 870 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.45 DC Characteristics (3)
1 1 Conditions (Mask ROM version): VCC = 2.7 V to 5.5 V, AVCC* = 2.7 V to 5.5 V, AVref* = 2.7 V 1 to 5.5 V, VSS = AVSS* = 0 V, Ta = –20 to +75°C 8 1 (Flash memory version): VCC = 3.0 V to 5.5 V* , AVCC* = 3.0 V to 5.5 V, AVref = 3.0 V 1 8 to 5.5 V, VSS = AVSS* = 0 V, Ta = –20 to +75°C*
Item Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , 3 IRQ2 to IRQ0* , voltage IRQ5 to IRQ3 Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3)
2 5
Symbol VT VT
– + + –
Min VCC × 0.2 — VCC × 0.9 VCC × 0.7 VCC × 0.7 VCC × 0.7
Typ — —
Max — VCC × 0.7 — VCC +0.3 VCC +0.3
Unit V V V V V
Test Conditions
VT – VT VIH
VCC × 0.05 — — — — —
AVCC +0.3 V VCC +0.3 V
VIL
–0.3 –0.3
— —
VCC × 0.1 VCC × 0.2 0.8
V V V V V VCC < 4.0 V VCC = 4.0 V to 5.5 V VCC < 4.0 V VCC = 4.0 V to 5.5 V IOH = –200 µA IOH = –1 mA (VCC < 4.0 V)
NMI, EXTAL, input pins except (1) and (3) above 4 Output high All output pins* voltage
–0.3
—
VCC × 0.2 0.8
VOH
VCC –0.5 VCC –1.0
— —
— —
V V
Rev. 4.00 Sep 27, 2006 page 871 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions IOL = 1.6 mA IOL = 5 mA (VCC < 4.0 V), IOL = 10 mA (4.0 V ≤ VCC ≤ 5.5 V) IOL = 1.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V
Item Output low voltage All output pins 4 (except RESO)* Ports 1 to 3
Symbol VOL
Min — —
Typ — —
Max 0.4 1.0
Unit V V
RESO Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pullup MOS current Ports 1 to 3 Ports 6, A, B (4) Cin ITSI Iin
— — — — —
— — — — —
0.4 10.0 1.0 1.0 1.0
V µA µA µA µA
–IP
10 30 — — —
— — — — —
150 250 80 50 20
µA µA pF pF pF
Vin = 0 V, 8 VCC = 2.7 V* to 3.6 V Vin = 0 V, f = 1 MHz, Ta = 25°C
Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current During A/D, D/A conversion Idle
— ICC — — — — AlCC — —
— 45 35 0.01 — 1.2 0.01
15 60 50 5.0 20.0 2.0 5.0
pF mA mA µA µA mA µA AVCC = 2.0 V o 5.5 V Ta ≤ 50°C 50°C < Ta f = 10 MHz
Rev. 4.00 Sep 27, 2006 page 872 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Reference power supply current
Symbol During A/D conversion Alref During A/D, D/A conversion Idle
Min — — —
Typ 0.5 2.0 0.01 —
Max 1.0 5.0 5.0 5.5
Unit mA mA µA V
AVref = 2.0 V to AVCC Operating (mask ROM version) Operating (F-ZTAT version) Idle/not used
1 Analog power supply voltage*
AVCC
2.7
3.0
—
5.5
V
2.0 RAM standby voltage VRAM 2.0
— —
5.5 —
V V
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.5 V, and VIL max = 0.5 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 2.7 V (mask ROM version), and VRAM ≤ VCC < 3.0 V (F-ZTAT version), VIH min = VCC × 0.9, and VIL max = 0.3 V. 8. For flash memory program/erase operations, the applicable ranges are VCC = 3.0 V to 3.6 V and Ta = 0 to +75°C. For the F-ZTAT versions, the test condition is VCC = 3.0 V or higher.
Rev. 4.00 Sep 27, 2006 page 873 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.46 Permissible Output Currents Conditions: VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Permissible output low current (per pin) PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — — — — — — — — Typ — — — — — — — — Max 20 10 3 2 80 120 2 40 Unit mA mA mA mA mA mA mA mA
Conditions: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version), VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — — — — — — — — Typ — — — — — — — — Max 10 2 1 1 40 60 2 30 Unit mA mA mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 26.46. 2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the output line, as show in figures 26.1 and 26.2.
Rev. 4.00 Sep 27, 2006 page 874 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.47 Bus Drive Characteristics Conditions: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version), VSS = 0 V Applicable Pins: PA7 to PA4 (bus drive function selected)
Item Output low voltage Symbol VOL Min — — — Typ — — — Max 0.8 0.5 0.4 Unit V Test Conditions IOL = 16 mA, VCC = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
26.5.3
AC Characteristics
Clock timing, control signal timing, bus timing, and timing of on-chip supporting modules list the following. Figure 26.4 shows the test conditions for the AC characteristics.
Rev. 4.00 Sep 27, 2006 page 875 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(1) Clock Timing Table 26.48 shows the clock timing. The clock timing specified here covers clock (φ) output and clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times. For details of external clock input (EXTAL pin and EXCL pin) timing, see section 24, Clock Pulse Generator. Table 26.48 Clock Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version) VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) External clock output stabilization delay time Symbol tcyc tCH tCL tCr tCf tOSC1 Min 50 17 17 — — 10 Max 500 — — 8 8 — Condition B 16 MHz Min 62.5 20 20 — — 10 Max 500 — — 10 10 — Condition C 10 MHz Min 100 30 30 — — 20 Max 500 — — 20 20 — Unit ns ns ns ns ns ms Figure 26.6 Figure 26.7 Test Conditions Figure 26.5 Figure 26.5
tOSC2
8
—
8
—
8
—
ms
tDEXT
500
—
500
—
500
—
µs
Rev. 4.00 Sep 27, 2006 page 876 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(2) Control Signal Timing Table 26.49 shows the control signal timing. The only external interrupts that can operate on the subclock (φ = 32.768 kHz) are NMI and IRQ0, 1, 2, 6, and 7. Table 26.49 Control Signal Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition C: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version), VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item RES setup time RES pulse width NMI setup time (NMI) NMI hold time (NMI) NMI pulse width (exiting software standby mode) IRQ setup time (IRQ7 to IRQ0) IRQ hold time (IRQ7 to IRQ0) IRQ pulse width (IRQ7, IRQ6, IRQ2 to IRQ0) (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW Min 200 20 150 10 200 Max — — — — — Condition B 16 MHz Min 200 20 150 10 200 Max — — — — — Condition C 10 MHz Min 300 20 250 10 200 Max — — — — — Unit ns tcyc ns ns ns Figure 26.9 Test Conditions Figure 26.8
tIRQS tIRQH tIRQW
150 10 200
— — —
150 10 200
— — —
250 10 200
— — —
ns ns ns
Rev. 4.00 Sep 27, 2006 page 877 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(3) Bus Timing Table 26.50 shows the bus timing. Operation in external expansion mode is not guaranteed when operating on the subclock (φ = 32.768 kHz). Table 26.50 Bus Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version), VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 20 Min — Condition B 16 MHz Max 30 Min — Condition C 10 MHz Max 40 Test Unit Conditions ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
0.5 × — tcyc –15 0.5 × — tcyc –10 — — — — 15 0 20 30 30 30 — —
0.5 × — tcyc –20 0.5 × — tcyc –15 — — — — 20 0 30 45 45 45 — —
0.5 × — tcyc –30 0.5 × — tcyc –20 — — — — 35 0 40 60 60 60 — —
Read data tRDS setup time Read data tRDH hold time
Rev. 4.00 Sep 27, 2006 page 878 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 1.0 × tcyc –30 1.5 × tcyc –25 2.0 × tcyc –30 2.5 × tcyc –25 3.0 × tcyc –30 30 30 Min — Condition B 16 MHz Max 1.0 × tcyc –40 1.5 × tcyc –35 2.0 × tcyc –40 2.5 × tcyc –35 3.0 × tcyc –40 45 45 Min — Condition C 10 MHz Max 1.0 × tcyc –60 1.5 × tcyc –50 2.0 × tcyc –60 2.5 × tcyc –50 3.0 × tcyc –60 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC1 access time 1 Read data tACC2 access time 2 Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 1.5 × — tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 879 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Tables 26.51 shows the on-chip supporting module timing. The only on-chip supporting modules that can operate in subclock operation (φ = 32.768 kHz) are the I/O ports, external interrupts (NMI and IRQ0, 1, 2, 6, and 7), the watchdog timer, and the 8-bit timer (channels 0 and 1). Table 26.51 Timing of On-Chip Supporting Modules Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition C: VCC = 2.7 V to 5.5 V (mask ROM version), VCC = 3.0 V to 5.5 V (F-ZTAT version), VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A Condition B Condition C 20 MHz Item I/O ports Output data delay time Input data setup time Input data hold time FRT Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tPWD tPRS tPRH tFTOD — 30 30 — Max 50 — — 50 16 MHz Min — 30 30 — Max 50 — — 50 10 MHz Min — 50 50 — Max 100 — — 100 ns Figure 26.16 Test Unit Conditions ns Figure 26.15
tFTIS tFTCS tFTCWH tFTCWL
30 30 1.5 2.5
— — — —
30 30 1.5 2.5
— — — —
50 50 1.5 2.5
— — — — tcyc Figure 26.17
Rev. 4.00 Sep 27, 2006 page 880 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A Condition B Condition C 20 MHz Item TMR Timer output delay time Timer reset input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tTMOD tTMRS tTMCS tTMCWH tTMCWL tPWOD — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 16 MHz Min — 30 30 1.5 2.5 — 4 6 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 10 MHz Min — 50 50 1.5 2.5 — 4 6 0.4 — — — Max 100 — — — — 100 — — 0.6 1.5 1.5 100 ns Figure 26.23 tScyc tcyc ns tcyc Figure 26.21 Figure 26.22 tcyc Test Unit Conditions ns Figure 26.18 Figure 26.20 Figure 26.19
PWMX Pulse output delay time SCI Input clock cycle
Asynchro- tScyc nous Synchronous
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time (synchronous)
Receive data setup tRXS time (synchronous) Receive data hold tRXH time (synchronous) A/D Trigger input setup tTRGS conver- time ter WDT RESO output delay tRESD time RESO output pulse tRESOW width Note: *
50 50 30
— — —
50 50 30
— — —
100 100 50
— — —
ns ns ns Figure 26.24 Figure 26.25
— 132
100 —
— 132
120 —
— 132
200 —
ns tcyc
Only supporting modules that can be used in subclock operation Rev. 4.00 Sep 27, 2006 page 881 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.5.4
A/D Conversion Characteristics
Tables 26.52 and 26.53 list the A/D conversion characteristics. Table 26.52 A/D Conversion Characteristics (AN7 to AN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C (mask ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition C (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10*
4 5* 3
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10*
4 5* 3
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 10*1
2 5*
Unit Bits
µs
pF kΩ
— — — — —
— — — — —
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
— — — — —
— — — — —
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
— — — — —
— — — — —
±7.0 ±7.5 ±7.5 ±0.5 ±8.0
LSB LSB LSB LSB LSB
Notes: 1. When 4.0 V ≤ AVCC ≤ 5.5 V 2. When 2.7 V ≤ AVCC < 4.0 V (mask ROM version) or when 3.0 V ≤ AVCC < 4.0 V (F-ZTAT version) 3. When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) 4. When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) 5. In single mode and φ = maximum operating frequency. Rev. 4.00 Sep 27, 2006 page 882 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.53 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C (mask ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition C (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*5 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
4 3
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
4 3
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 10*1 5* — — — — — — — — — —
2
Unit Bits
µs
pF kΩ
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±11.0 ±11.5 ±11.5 ±0.5 ±12.0
LSB LSB LSB LSB LSB
Notes: 1. When 4.0 V ≤ AVCC ≤ 5.5 V 2. When 2.7 V ≤ AVCC < 4.0 V (mask ROM version) or when 3.0 V ≤ AVCC < 4.0 V (F-ZTAT version) 3. When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) 4. When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) 5. In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 883 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.5.5
D/A Conversion Characteristics
Table 26.54 lists the D/A conversion characteristics. Table 26.54 D/A Conversion Characteristics Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C (mask ROM version): VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C Condition C (F-ZTAT version): VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, AVref = 3.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Min 8 Typ 8 — Max 8 10 Min 8 — Condition B 16 MHz Typ 8 — Max 8 10 Min 8 — Condition C 10 MHz Typ 8 — Max 8 10 Unit Bits µs
Conversion With 20 pF — time load capacitance Absolute accuracy With 2 MΩ load resistance With 4 MΩ load resistance —
±1.0
±1.5
—
±1.0
±1.5
—
±2.0
±3.0
LSB
—
—
±1.0
—
—
±1.0
—
—
±2.0
Rev. 4.00 Sep 27, 2006 page 884 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.5.6
Flash Memory Characteristics
Table 26.55 shows the flash memory characteristics. Table 26.55 Flash Memory Characteristics (Programming/erasing operating range) Conditions (5 V version): VCC = 5.0 V ±10%, VSS = 0 V, Ta = 0 to +75°C (regular specifications), Ta = 0 to +85°C (wide-range specifications) (3 V version): VCC = 3.0 V to 3.6V, VSS = 0 V, Ta = 0 to +75°C
Item Programming time*1 *2 *4 Erase time*1 *3 *6 Reprogramming count Data retention time*
10
Symbol Min tP tE NWEC tDRP x y z α
1
Typ 10 100
Max 200 1200
Unit ms/ 32 bytes ms/ block Times Years µs µs µs µs µs µs µs µs Times µs µs ms µs µs µs µs µs Times
Test Condition
— — 100*8 10 10 50 150 10 10 4 2 4 — 10 200 5 10 10 20 2 5 —
10000*9 — — — — — — — — — — — — — — — — — — — — — — — 200 — — — — — 1000 — — 10 — — — — — 120
Programming Wait time after SWE-bit setting*1 Wait time after PSU-bit setting*1 Wait time after P-bit setting*1 *4 Wait time after P-bit clear*1 Wait time after PSU-bit clear* Wait time after PV-bit setting*1 Wait time after dummy write*1 Wait time after PV-bit clear*1 Maximum programming count*1 *4 *5 Erase Wait time after SWE-bit setting*1 Wait time after ESU-bit setting*1 Wait time after E-bit setting*1 *6 Wait time after E-bit clear*1 Wait time after ESU-bit clear*1 Wait time after EV-bit setting*1 Wait time after dummy write*1 Wait time after EV-bit clear*1 Maximum erase count*1 *6 *7
β γ ε η N x y z α β γ ε η N
z = 200 µs
z = 10 ms
Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 32 bytes (Shows the total period for which the P-bit in FLMCR1 is set. It does not include the programming verification time.) Rev. 4.00 Sep 27, 2006 page 885 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time.) 4. Maximum programming time (tP (max)) tP (max) = wait time after P-bit setting (z) × maximum programming count (N) 5. Number of times when the wait time after P-bit setting (z) = 200 µs. The number of writes should be set according to the actual set value of (z) to allow programming within the maximum programming time (tP (max)). 6. Maximum erase time (tE (max)) tE (max) = wait time after E-bit setting (z) × maximum erase count (N)) 7. Number of times when the wait time after E-bit setting (z) = 10 ms. The number of erases should be set according to the actual set value of (z) to allow erasing within the maximum erase time (tE (max)). 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
26.5.7
Usage Note
(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values for electrical characteristics shown in this manual. However, actual performance figures, operating margins, noise margins, and other properties may vary due to differences in the manufacturing process, on-chip ROM, layout patterns, etc. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests should also be conducted for the mask ROM version when changing over to that version. (2) On-chip power supply step-down circuit The H8S/2144F-ZTAT, H8S/2142F-ZTAT, and mask ROM version of H8S/2142 do not incorporate an internal power supply step-down circuit. When changing over to F-ZTAT versions or mask ROM versions incorporating an internal step-down circuit, the VCC2 pin has the same pin location as the VCL pin in a step-down circuit (See figure 26.3). Therefore, note that the circuit patterns differ between these two types of products.
Rev. 4.00 Sep 27, 2006 page 886 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.6
Electrical Characteristics of H8S/2144 F-ZTAT (A-mask version) and Mask ROM Versions of H8S/2144 and H8S/2143
Absolute Maximum Ratings
26.6.1
Table 26.56 lists the absolute maximum ratings. Table 26.56 Absolute Maximum Ratings
Item
1 Power supply voltage* 1 Power supply voltage* (3-V version)
Symbol Value VCC VCC VCL Vin Vin Vin Vin AVref AVCC AVCC VAN Topr Topr –0.3 to +7.0 –0.3 to +4.3 –0.3 to +4.3 –0.3 to VCC +0.3 –0.3 to VCC +0.3 –0.3 V to lower of voltages VCC +0.3 and AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to +4.3 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85
Unit V V V V V V V V V V V °C °C °C °C
Power supply voltage* (VCL pin)
2
Input voltage (except ports 6, 7, and A) Input voltage (CIN input not selected for port 6 and A) Input voltage (CIN input selected for port 6 and A) Input voltage (port 7) Reference supply voltage Analog power supply voltage Analog power supply voltage (3 V version) Analog input voltage Operating temperature Operating temperature (flash memory programming/erasing)
Storage temperature Tstg –55 to +125 °C Caution: 1. Permanent damage to the chip may result if absolute maximum ratings are exceeded. 2. Never apply more than 7.0 V to any of the pins of the 5- or 4-V version or 4.3 V to any of the pins (except for port A) of the 3-V version. Notes: 1. Power supply voltage for VCC1 pin. Never exceed the maximum rating of VCL in the low-power version (3-V version) because both the VCC1 and VCL pins are connected to the VCL power supply. 2. It is an operating power supply voltage pin on the chip. Never apply power supply voltage to the VCL pin in the 5- or 4-V version. Always connect an external capacitor between the VCL pin and ground for internal voltage stabilization. Rev. 4.00 Sep 27, 2006 page 887 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.6.2
DC Characteristics
Table 26.57 lists the DC characteristics. Permitted output current values and bus drive characteristics are shown in tables 26.58 and 26.59, respectively. Table 26.57 DC Characteristics (1)
1 1 Conditions: VCC = 5.0 V ±10%, AVCC* = 5.0 V ±10%, AVref* = 4.5 V to AVCC, 1 VSS = AVSS* = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item
25 Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , *3, IRQ2 to IRQ0 voltage IRQ5 to IRQ3
Symbol VT VT
– + + –
Min 1.0 — 0.4 VCC –0.7
Typ — — — —
Max — VCC × 0.7 — VCC +0.3
Unit V V V V
Test Conditions
VT – VT VIH
Input high voltage
RES, STBY, NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above
(2)
VCC × 0.7 2.0 2.0
— — —
VCC +0.3
V
AVCC +0.3 V VCC +0.3 V
Input low voltage
RES, STBY, MD1, MD0 PA7 to PA0 NMI, EXTAL, input pins except (1) and (3) above
(3)
VIL
–0.3 –0.3 –0.3
— — —
0.5 1.0 0.8
V V V
Output high All output pins* voltage Output low voltage
4
VOH VOL
VCC –0.5 3.5 — — —
— — — — —
— — 0.4 1.0 0.4
V V V V V
IOH = –200 µA IOH = –1 mA IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA
All output pins 4 (except RESO)* Ports 1 to 3 RESO
Rev. 4.00 Sep 27, 2006 page 888 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V
Item Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pull-up MOS current Ports 1 to 3 Ports 6, A, B
Symbol Iin
Min — — —
Typ — — — —
Max 10.0 1.0 1.0 1.0
Unit µA µA µA µA
ITSI
—
–IP
30 60
— —
300 600
µA µA
Vin = 0 V
Input RES capacitance NMI P52, P97, P42, P86 PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle
(4)
Cin
— — —
— — —
80 50 20
pF pF pF
Vin = 0 V, f = 1 MHz, Ta = 25°C
— ICC — — — — AlCC — — — — —
— 55 36 1.0 — 1.2 0.01 0.5 2.0 0.01
15 70 55 5.0 20.0 2.0 5.0 1.0 5.0 5.0
pF mA mA µA µA mA µA mA mA µA AVref= 2.0 V to AVCC AVCC= 2.0 V to 5.5 V Ta ≤ 50°C 50°C < Ta f = 20 MHz
During A/D conversion Alref During A/D, D/A conversion Idle
Rev. 4.00 Sep 27, 2006 page 889 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Operating Idle/not used
Item
1 Analog power supply voltage*
Symbol AVCC VRAM
Min 4.5 2.0 2.0
Typ — — —
Max 5.5 5.5 —
Unit V V V
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 4.5V, VIH min = VCC –0.2 V, and VIL max = 0.2 V.
Rev. 4.00 Sep 27, 2006 page 890 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.57 DC Characteristics (2)
1 1 Conditions: VCC = 4.0 V to 5.5 V, AVCC* = 4.0 V to 5.5 V, AVref* = 4.0 V to AVCC, 1 VSS = AVSS* = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item
25 Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , *3, voltage IRQ2 to IRQ0 IRQ5 to IRQ3
Symbol Min VT VT VT VT
– + + – + + – –
Typ — — — — — — — — — —
Max — VCC × 0.7 — — VCC × 0.7 — VCC +0.3 VCC +0.3
Unit V V V V V V V V
Test Conditions VCC = 4.5 V to 5.5 V
1.0 — 0.4 0.8 — 0.3 VCC –0.7 VCC × 0.7 2.0 2.0
VT – VT
VCC < 4.5 V
VT – VT Input high voltage RES, STBY, (2) NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above Input low voltage RES, STBY, MD1, MD0 PA7 to PA0 (3) VIL VIH
AVCC +0.3 V VCC +0.3 V
–0.3 –0.3 –0.3
— — — —
0.5 1.0 0.8 0.8
V V V V VCC = 4.5 V to 5.5 V VCC < 4.5 V
NMI, EXTAL, input pins except (1) and (3) above 4 Output high All output pins* voltage
–0.3
VOH
VCC –0.5 3.5
— —
— —
V V
IOH = –200 µA IOH = –1 mA, VCC = 4.5 V to 5.5 V IOH = –1 mA, VCC < 4.5 V
3.0
—
—
V
Rev. 4.00 Sep 27, 2006 page 891 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions IOL = 1.6 mA IOL = 10 mA IOL = 2.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V Vin = 0.5 to VCC –0.5 V
Item Output low voltage All output pins 4 (except RESO)* Ports 1 to 3 RESO Input leakage current RES STBY, NMI, MD1, MD0 Port 7 Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pull-up MOS current Ports 1 to 3 Ports 6, A, B Ports 1 to 3 Ports 6, A, B (4)
Symbol Min VOL — — — Iin — — — ITSI —
Typ — — — — — — —
Max 0.4 1.0 0.4 10.0 1.0 1.0 1.0
Unit V V V µA µA µA µA
–IP
30 60 20 40
— — — — — — — — 45 30 1.0 — 1.2 0.01
300 600 200 500 80 50 20 15 58 46 5.0 20.0 2.0 5.0
µA µA µA µA pF pF pF pF mA mA µA µA mA µA
Vin = 0 V, VCC = 4.5 V to 5.5 V Vin = 0 V, VCC < 4.5 V Vin = 0 V, f = 1 MHz, Ta = 25°C
Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current During A/D, D/A conversion Idle
Cin
— — — —
ICC
— — — —
f = 16 MHz f = 16 MHz Ta ≤ 50°C 50°C < Ta
AlCC
— —
AVCC = 2.0 V to 5.5 V
Rev. 4.00 Sep 27, 2006 page 892 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions
Item Reference power supply current
Symbol Min During A/D conversion Alref During A/D, D/A conversion Idle — — — AVCC VRAM 4.0 2.0 2.0
Typ 0.5 2.0 0.01 — — —
Max 1.0 5.0 5.0 5.5 5.5 —
Unit mA mA µA V V V
AVref = 2.0 V to AVCC Operating Idle/not used
1 Analog power supply voltage*
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 5.5 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 4.0 V, VIH min = VCC –0.2 V, and VIL max = 0.2 V.
Rev. 4.00 Sep 27, 2006 page 893 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.57 DC Characteristics (3)
8 1 1 Conditions: VCC = 2.7 V to 3.6 V* , AVCC* = 2.7 V to 3.6 V, AVref* = 2.7 V to 3.6 V, 1 VSS = AVSS* = 0 V, Ta = –20 to +75°C
Item
25 Schmitt P67 to P60* * , (1) 5 trigger input KIN15 to KIN8* , 3 IRQ2 to IRQ0* , voltage IRQ5 to IRQ3
Symbol VT VT
– + + –
Min VCC × 0.2 — VCC × 0.9 VCC × 0.7 VCC × 0.7 VCC × 0.7
Typ — —
Max — VCC × 0.7 — VCC +0.3 VCC +0.3
Unit V V V V V
Test Conditions
VT – VT VIH
VCC × 0.05 — — — — —
Input high voltage
RES, STBY, (2) NMI, MD1, MD0 EXTAL, 5 PA7 to PA0* Port 7 Input pins except (1) and (2) above
AVCC +0.3 V VCC +0.3 V
Input low voltage
RES, STBY, MD1, MD0 PA7 to PA0
(3)
VIL
–0.3 –0.3 –0.3
— — —
VCC × 0.1 VCC × 0.2 VCC × 0.2
V V V
NMI, EXTAL, input pins except (1) and (3) above 4 Output high All output pins* voltage
VOH
VCC –0.5 VCC –1.0
— —
— —
V V
IOH = –200 µA IOH = –1 mA (VCC = 2.7 V to 3.6 V IOL = 1.6 mA IOL = 5 mA IOL = 1.6 mA Vin = 0.5 to VCC –0.5 V Vin = 0.5 to AVCC –0.5 V
Output low voltage
All output pins 4 (except RESO)* Ports 1 to 3 RESO
VOL
— — —
— — — — — —
0.4 1.0 0.4 10.0 1.0 1.0
V V V µA µA µA
Input leakage current
RES STBY, NMI, MD1, MD0 Port 7
Iin
— — —
Rev. 4.00 Sep 27, 2006 page 894 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Test Conditions Vin = 0.5 to VCC –0.5 V
Item Three-state Ports 1 to 6, 8, leakage 9, A, B current (off state) Input pullup MOS current Ports 1 to 3 Ports 6, A, B (4)
Symbol ITSI
Min —
Typ —
Max 1.0
Unit µA
–IP
5 30
— — — — —
150 300 80 50 20
µA µA pF pF pF
Vin = 0 V, VCC = 2.7 V to 3.6 V Vin = 0 V, f = 1 MHz, Ta = 25°C
Input RES capacitance NMI P52, P97, P42, P86, PA7 to PA2 Input pins except (4) above Current Normal operation 6 dissipation* Sleep mode 7 Standby mode* Analog power supply current Reference power supply current During A/D, D/A conversion Idle
Cin
— — —
— ICC — — — — AlCC — — — —
— 30 20 1.0 — 1.2 0.01 0.5 2.0
15 40 32 5.0 20.0 2.0 5.0 1.0 5.0
pF mA mA µA µA mA µA mA mA AVCC = 2.0 V to 3.6 V Ta ≤ 50°C 50°C < Ta f = 10 MHz
During A/D conversion Alref During A/D, D/A conversion Idle
— AVCC VRAM 2.7 2.0 2.0
0.01 — — —
5.0 3.6 3.6 —
µA V V V
AVref = 2.0 V to AVCC Operating Idle/not used
1 Analog power supply voltage*
RAM standby voltage
Notes: 1. Do not leave the AVCC, AVref, and AVSS pins open even if the A/D converter and D/A converter are not used. Even if the A/D converter and D/A converter are not used, apply a value in the range 2.0 V to 3.6 V to AVCC and AVref pins by connection to the power supply (VCC), or some other method. Ensure that AVref ≤ AVCC. 2. P67 to P60 include supporting module inputs multiplexed on those pins. 3. IRQ2 includes the ADTRG signal multiplexed on that pin. Rev. 4.00 Sep 27, 2006 page 895 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics 4. When IICS = 0. Low-level output when the bus drive function is selected is determined separately. 5. The upper limit of the applied voltage on Ports 6 and A is VCC +0.3 V when CIN input is not selected, and the lower of VCC +0.3 V and AVCC +0.3 V when CIN input is selected. When a pin is in output mode, the output voltage is equivalent to the applied voltage. 6. Current dissipation values are for VIH min = VCC –0.2 V, and VIL max = 0.2 V with all output pins unloaded and the on-chip pull-up MOSs in the off state. 7. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC –0.2 V, and VIL max = 0.2 V. 8. For flash memory program/erase operations, the applicable range is VCC = 3.0 V to 3.6 V.
Rev. 4.00 Sep 27, 2006 page 896 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.58 Permissible Output Currents Conditions: VCC = 4.0 V to 5.5 V, VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
Item Permissible output low current (per pin) PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — — — — — — — — Typ — — — — — — — — Max 20 10 3 2 80 120 2 40 Unit mA mA mA mA mA mA mA mA
Conditions: VCC = 2.7 V to 3.6 V, VSS = 0 V, Ta = –20 to +75°C
Item Permissible output low current (per pin) PA7 to PA4 (bus drive function selected) Ports 1, 2, 3 RESO Other output pins Permissible output low current (total) Permissible output high current (per pin) Permissible output high current (total) Total of ports 1, 2, and 3 Total of all output pins, including the above All output pins Total of all output pins –IOH ∑ –IOH ∑ IOL Symbol IOL Min — — — — — — — — Typ — — — — — — — — Max 10 2 1 1 40 60 2 30 Unit mA mA mA mA mA mA mA mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 26.58. 2. When driving a Darlington pair or LED, always insert a current-limiting resistor in the output line, as show in figures 26.1 and 26.2.
Rev. 4.00 Sep 27, 2006 page 897 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.59 Bus Drive Characteristics Conditions: VCC = 4.0 V to 5.5 V, VCC = 2.7 V to 3.6 V (3 V version), VSS = 0 V Applicable Pins: PA7 to PA4 (bus drive function selected)
Item Output low voltage Symbol VOL Min — — — Typ — — — Max 0.8 0.5 0.4 Unit V Test Conditions IOL = 16 mA, VCC = 4.5 V to 5.5 V IOL = 8 mA IOL = 3 mA
26.6.3
AC Characteristics
Clock timing, control signal timing, bus timing, and timing of on-chip supporting modules list the following. Figure 26.4 shows the test conditions for the AC characteristics.
Rev. 4.00 Sep 27, 2006 page 898 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(1) Clock Timing Table 26.60 shows the clock timing. The clock timing specified here covers clock (φ) output and clock pulse generator (crystal) and external clock input (EXTAL pin) oscillation settling times. For details of external clock input (EXTAL pin and EXCL pin) timing, see section 24, Clock Pulse Generator. Table 26.60 Clock Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Oscillation settling time at reset (crystal) Oscillation settling time in software standby (crystal) External clock output stabilization delay time Symbol tcyc tCH tCL tCr tCf tOSC1 Min 50 17 17 — — 10 Max 500 — — 8 8 — Condition B 16 MHz Min 62.5 20 20 — — 10 Max 500 — — 10 10 — Condition C 10 MHz Min 100 30 30 — — 20 Max 500 — — 20 20 — Unit ns ns ns ns ns ms Figure 26.6 Figure 26.7 Test Conditions Figure 26.5 Figure 26.5
tOSC2
8
—
8
—
8
—
ms
tDEXT
500
—
500
—
500
—
µs
Rev. 4.00 Sep 27, 2006 page 899 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(2) Control Signal Timing Table 26.61 shows the control signal timing. The only external interrupts that can operate on the subclock (φ = 32.768 kHz) are NMI and IRQ0, 1, 2, 6, and 7. Table 26.61 Control Signal Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition C: VCC = 2.7 V to 3.6 V, VSS = 0 V, φ = 32.768 kHz, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item RES setup time RES pulse width NMI setup time (NMI) NMI hold time (NMI) NMI pulse width (exiting software standby mode) IRQ setup time (IRQ7 to IRQ0) IRQ hold time (IRQ7 to IRQ0) IRQ pulse width (IRQ7, IRQ6, IRQ2 to IRQ0) (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW Min 200 20 150 10 200 Max — — — — — Condition B 16 MHz Min 200 20 150 10 200 Max — — — — — Condition C 10 MHz Min 300 20 250 10 200 Max — — — — — Unit ns tcyc ns ns ns Figure 26.9 Test Conditions Figure 26.8
tIRQS tIRQH tIRQW
150 10 200
— — —
150 10 200
— — —
250 10 200
— — —
ns ns ns
Rev. 4.00 Sep 27, 2006 page 900 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(3) Bus Timing Table 26.62 shows the bus timing. Operation in external expansion mode is not guaranteed when operating on the subclock (φ = 32.768 kHz). Table 26.62 Bus Timing Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, VSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Symbol Min — Max 20 Min — Condition B 16 MHz Max 30 Min — Condition C 10 MHz Max 40 Test Unit Conditions ns ns ns ns ns ns ns ns ns Figure 26.10 to figure 26.14
Address tAD delay time Address tAS setup time Address hold time CS delay time (IOS) AS delay time RD delay time 1 RD delay time 2 tAH tCSD tASD tRSD1 tRSD2
— 0.5 × tcyc –15 — 0.5 × tcyc –10 — — — — 15 0 20 30 30 30 — —
0.5 × — tcyc –20 0.5 × — tcyc –15 — — — — 20 0 30 45 45 45 — —
0.5 × — tcyc –30 0.5 × — tcyc –20 — — — — 35 0 40 60 60 60 — —
Read data tRDS setup time Read data tRDH hold time
Rev. 4.00 Sep 27, 2006 page 901 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A 20 MHz Item Symbol Min — Max 1.0 × tcyc –30 1.5 × tcyc –25 2.0 × tcyc –30 2.5 × tcyc –25 3.0 × tcyc –30 30 30 Min — Condition B 16 MHz Max 1.0 × tcyc –40 1.5 × tcyc –35 2.0 × tcyc –40 2.5 × tcyc –35 3.0 × tcyc –40 45 45 Min — Condition C 10 MHz Max 1.0 × tcyc –60 1.5 × tcyc –50 2.0 × tcyc –60 2.5 × tcyc –50 3.0 × tcyc –60 60 60 Test Unit Conditions ns Figure 26.10 to figure 26.14
Read data tACC1 access time 1 Read data tACC2 access time 2 Read data tACC3 access time 3 Read data tACC4 access time 4 Read data tACC5 access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 tWRD1 tWRD2 tWSW1 tWSW2
—
—
—
ns
—
—
—
ns
—
—
—
ns
—
—
—
ns
— —
— —
— —
ns ns ns ns ns ns ns ns ns
— 1.0 × tcyc –20 1.5 × — tcyc –20 — 0 10 30 5 30 — — — —
1.0 × — tcyc –30 1.5 × — tcyc –30 — 0 15 45 5 45 — — — —
1.0 × — tcyc –40 1.5 × — tcyc –40 — 0 20 60 10 60 — — — —
Write data tWDD delay time Write data tWDS setup time Write data tWDH hold time WAIT tWTS setup time WAIT hold tWTH time
Rev. 4.00 Sep 27, 2006 page 902 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Tables 26.63 shows the on-chip supporting module timing. The only on-chip supporting modules that can operate in subclock operation (φ = 32.768 kHz) are the I/O ports, external interrupts (NMI and IRQ0, 1, 2, 6, and 7), the watchdog timer, and the 8-bit timer (channels 0 and 1). Table 26.63 Timing of On-Chip Supporting Modules Condition A: VCC = 5.0 V ±10%, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition B: VCC = 4.0 V to 5.5 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (widerange specifications) Condition C: VCC = 2.7 V to 3.6 V, VSS = 0 V, φ = 32.768 kHz*, 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A Condition B Condition C 20 MHz Item I/O ports Output data delay time Input data setup time FRT Symbol Min tPWD tPRS — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 16 MHz Min — 30 30 — 30 30 1.5 2.5 Max 50 — — 50 — — — — 10 MHz Min — 50 50 — 50 50 1.5 2.5 Max 100 — — 100 — — — — tcyc Figure 26.17 ns Figure 26.16 Test Unit Conditions ns Figure 26.15
Input data hold time tPRH Timer output delay tFTOD time Timer input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges tFTIS tFTCS tFTCWH tFTCWL
Rev. 4.00 Sep 27, 2006 page 903 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Condition A Condition B Condition C 20 MHz Item TMR Timer output delay time Timer reset input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Symbol Min tTMOD tTMRS tTMCS tTMCWH tTMCWL tPWOD — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 16 MHz Min — 30 30 1.5 2.5 — 4 6 0.4 — — — Max 50 — — — — 50 — — 0.6 1.5 1.5 50 10 MHz Min — 50 50 1.5 2.5 — 4 6 0.4 — — — Max 100 — — — — 100 — — 0.6 1.5 1.5 100 ns Figure 26.23 tScyc tcyc ns tcyc Figure 26.21 Figure 26.22 tcyc Test Unit Conditions ns Figure 26.18 Figure 26.20 Figure 26.19
PWMX Pulse output delay time SCI Input clock cycle
Asynchro- tScyc nous Synchronous
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time (synchronous)
Receive data setup tRXS time (synchronous) Receive data hold tRXH time (synchronous) A/D Trigger input setup tTRGS conver- time ter WDT RESO output delay tRESD time RESO output pulse tRESOW width Note: *
50 50 30
— — —
50 50 30
— — —
100 100 50
— — —
ns ns ns Figure 26.24 Figure 26.25
— 132
100 —
— 132
120 —
— 132
200 —
ns tcyc
Only supporting modules that can be used in subclock operation
Rev. 4.00 Sep 27, 2006 page 904 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.6.4
A/D Conversion Characteristics
Tables 26.64 and 26.65 list the A/D conversion characteristics. Table 26.64 A/D Conversion Characteristics (AN7 to AN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*3 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
2 1
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
2 1
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 5 Unit Bits
µs
pF kΩ
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
±3.0 ±3.5 ±3.5 ±0.5 ±4.0
— — — — —
— — — — —
±7.0 ±7.5 ±7.5 ±0.5 ±8.0
LSB LSB LSB LSB LSB
Notes: 1. When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) 2. When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) 3. In single mode and φ = maximum operating frequency.
Rev. 4.00 Sep 27, 2006 page 905 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.65 A/D Conversion Characteristics (CIN15 to CIN0 Input: 134/266-State Conversion) Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications)
4 4 4 Condition C: VCC = 3.0 V to 3.6 V* , AVCC = 3.0 V to 3.6 V* , AVref = 3.0 V to AVCC* , VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Conversion time*3 Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 — — — Typ 10 — — — Max 10 6.7 20 10* 5* — — — — — — — — — —
2 1
Condition B 16 MHz Min 10 — — — Typ 10 — — — Max 10 8.4 20 10* 5* — — — — — — — — — —
2 1
Condition C 10 MHz Min 10 — — — Typ 10 — — — Max 10 13.4 20 5 Unit Bits
µs
pF kΩ
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
±5.0 ±5.5 ±5.5 ±0.5 ±6.0
— — — — —
— — — — —
±11.0 ±11.5 ±11.5 ±0.5 ±12.0
LSB LSB LSB LSB LSB
Notes: 1. 2. 3. 4.
When conversion time ≥ 11. 17 µs (CKS = 1 and φ ≤ 12 MHz, or CKS = 0) When conversion time < 11. 17 µs (CKS = 1 and φ > 12 MHz) In single mode and φ = maximum operating frequency. When using CIN, the applicable range is VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, and AVref = 3.0 V to 3.6 V.
Rev. 4.00 Sep 27, 2006 page 906 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.6.5
D/A Conversion Characteristics
Table 26.66 lists the D/A conversion characteristics. Table 26.66 D/A Conversion Characteristics Condition A: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, AVref = 4.5 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition B: VCC = 4.0 V to 5.5 V, AVCC = 4.0 V to 5.5 V, AVref = 4.0 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) Condition C: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, AVref = 2.7 V to AVCC, VSS = AVSS = 0 V, φ = 2 MHz to maximum operating frequency, Ta = –20 to +75°C
Condition A 20 MHz Item Resolution Min 8 Typ 8 — Max 8 10 Min 8 — Condition B 16 MHz Typ 8 — Max 8 10 Min 8 — Condition C 10 MHz Typ 8 — Max 8 10 Unit Bits µs
Conversion With 20-pF — time load capacitance Absolute accuracy With 2-MΩ load resistance With 4-MΩ load resistance —
±1.0
±1.5
—
±1.0
±1.5
—
±2.0
±3.0
LSB
—
—
±1.0
—
—
±1.0
—
—
±2.0
26.6.6
Flash Memory Characteristics
Table 26.67 shows the flash memory characteristics.
Rev. 4.00 Sep 27, 2006 page 907 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Table 26.67 Flash Memory Characteristics (Programming/erasing operating range) Conditions (5 V version): VCC = 4.0 V to 5.5 V,VSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C (wide-range specifications) (3 V version): VCC = 3.0 V to 3.6V, VSS = 0 V, Ta = –20 to 75°C
Item Programming time*1 *2 *4 Erase time*1 *3 *6 Reprogramming count Data retention time*10 Programming Wait time after SWE-bit setting*1 Wait time after PSU-bit setting*1 Wait time after P-bit setting*1 *4 Symbol Min tP tE NWEC tDRP x y z1 z2 z3 Wait time after P-bit clear*1 Wait time after PSU-bit clear*1 Wait time after PV-bit setting*1 Wait time after dummy write*1 Wait time after PV-bit clear*1 Wait time after SWE-bit clear*1 Maximum programming count*1 *4 *5 Erase Wait time after SWE-bit setting*1 Wait time after ESU-bit setting*1 Wait time after E-bit setting*1 *6 Wait time after E-bit clear*1 Wait time after ESU-bit clear*1 Wait time after EV-bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV-bit clear*1 Wait time after SWE-bit clear* Maximum erase count*1 *6 *7
1
Typ 10 100
Max 200 1200
Unit ms/ 128 bytes ms/ block Times Years µs µs µs µs µs µs µs µs µs µs µs Times µs µs ms µs µs µs µs µs µs Times
Test Condition
— — 100*8 10 1 50 28 198 8 10 10 4 2 4 100 — 1 100 10 10 10 20 2 4 100 —
10000*9 — — — — 30 200 10 — — — — — — — — — — — — — — — — — — — — 32 202 12 — — — — — — 1000 — — 100 — — — — — — 120
1≤n≤6 7 ≤ n ≤ 1000 Additional writing
α β γ ε η θ N x y z α β γ ε η θ N
Rev. 4.00 Sep 27, 2006 page 908 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics Notes: 1. Set the times according to the program/erase algorithms. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in FLMCR1 is set. It does not include the programming verification time.) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time.) 4. Maximum programming time (tP (max)) tP (max) = (Wait time after P-bit setting (z1) + (z3)) × 6 + Wait time after P-bit setting (z2) × ((N) – 6) 5. Maximum programming count (N) should be set according to the actual set value of (z1, z2, z3) to allow programming within the maximum programming time (tP (max)). The wait time after P-bit setting (z1, z2, z3) must be changed with the value of the number of writing times (n) as follows. The number of times for writing n 1≤n≤6 z1 = 30 µs, z3 = 10 µs 7 ≤ n ≤ 1000 z2 = 200 µs 6. Maximum erase time (tE (max)) tE (max) = Waiting time after E-bit setting (z) × Maximum erase count (N) 7. Maximum erase count (N) should be set according to the actual setting (z) to allow erase within the maximum erase time (tE (max)). 8. Minimum number of times for which all characteristics are guaranteed after rewriting (Guarantee range is 1 to minimum value). 9. Reference value for 25°C (as a guideline, rewriting should normally function up to this value). 10. Data retention characteristic when rewriting is performed within the specification range, including the minimum value.
Rev. 4.00 Sep 27, 2006 page 909 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.6.7
Usage Note
(1) The F-ZTAT and mask ROM versions have been confirmed as fully meeting the reference values for electrical characteristics shown in this manual. However, actual performance figures, operating margins, noise margins, and other properties may vary due to differences in the manufacturing process, on-chip ROM, layout patterns, etc. When system evaluation testing is carried out using the F-ZTAT version, the same evaluation tests should also be conducted for the mask ROM version when changing over to that version. (2) On-chip power supply step-down circuit The following products incorporate an internal power supply step-down circuit, which automatically drops down the internal power supply voltage to the optimum internal voltage level: the F-ZTAT A-mask versions of the H8S/2144 (HD64F2144A) and the mask ROM versions of the H8S/2144, and H8S/2143 (HD6432144S and HD6432143S). The voltage-stabilization capacitor (0.47 µF one or two connected in series) must be connected between the VCL (internal power supply step-down) and VSS pins. Figure 26.3 shows the connection of the external capacitors. For the 5- or 4-V version, do not connect the VCL pin in a product incorporating an internal step-down circuit to the VCC power supply. (Connect the VCC1 pin to the VCC power supply as usual.) For the 3-V version, connect both the VCL and VCC1 pins to the system power supply. When changing from the F-ZTAT versions not incorporating an internal step-down circuit to the mask ROM versions incorporating an internal step-down circuit, the VCL pin has the same pin location as the VCC2 pin. Therefore, note that the circuit patterns differ between these two types of products.
Rev. 4.00 Sep 27, 2006 page 910 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.7
26.7.1
Operational Timing
Test Conditions for the AC Characteristics
VCC RL Chip output pin C = 30 pF: All output ports RL = 2.4 kΩ RH = 12 kΩ I/O timing test levels • Low level: 0.8 V • High level: 2.0 V
C
RH
Figure 26.4 Output Load Circuit 26.7.2 Clock Timing
tcyc tCH φ tCL tCr tCf
Figure 26.5 System Clock Timing
Rev. 4.00 Sep 27, 2006 page 911 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
EXTAL tDEXT VCC tDEXT
STBY
tOSC1 RES
tOSC1
φ
Figure 26.6 Oscillation Settling Timing 26.7.3 Control Signal Timing
φ
NMI
IRQi (i = 0, 1, 2, 6, 7) tOSC2
Figure 26.7 Oscillation Setting Timing (Exiting Software Standby Mode)
Rev. 4.00 Sep 27, 2006 page 912 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
φ tRESS RES tRESW tRESS
Figure 26.8 Reset Input Timing
φ tNMIS NMI tNMIW tNMIH
IRQi (i = 7 to 0) tIRQS IRQ Edge input tIRQS IRQ Level input
tIRQW tIRQH
Figure 26.9 Interrupt Input Timing
Rev. 4.00 Sep 27, 2006 page 913 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.7.4
Bus Timing
T1 φ tAD A23 to A0, IOS* tCSD AS* tAS tAH tASD tASD T2
tRSD1 RD (read) tAS
tACC2
tRSD2
tACC3 D15 to D0 (read)
tRDS
tRDH
tWRD2 HWR, LWR (write) tAS tWDD D15 to D0 (write) tWSW1
tWRD2 tAH tWDH
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 26.10 Basic Bus Timing (Two-State Access)
Rev. 4.00 Sep 27, 2006 page 914 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
T1 φ
T2
T3
tAD A23 to A0, IOS* tCSD AS* tAS tASD tASD tAH
tRSD1 RD (read) tAS
tACC4
tRSD2
tACC5 D15 to D0 (read)
tRDS
tRDH
tWRD1 HWR, LWR (write) tWDD tWDS D15 to D0 (write) tWSW2
tWRD2 tAH tWDH
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 26.11 Basic Bus Timing (Three-State Access)
Rev. 4.00 Sep 27, 2006 page 915 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
T1 φ
T2
TW
T3
A23 to A0, IOS* AS* RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) tWTS tWTH WAIT tWTS tWTH
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 26.12 Basic Bus Timing (Three-State Access with One Wait State)
Rev. 4.00 Sep 27, 2006 page 916 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
T1 φ
T2 or T3
T1
T2
tAD A23 to A0, IOS* tAS AS* tRSD2 RD (read) tACC3 D15 to D0 (read) tRDS tRDH tASD tASD tAH
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 26.13 Burst ROM Access Timing (Two-State Access)
Rev. 4.00 Sep 27, 2006 page 917 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
T1 φ
T2 or T3
T1
tAD A23 to A0, IOS*
AS* tRSD2 RD (read) tACC1 D15 to D0 (read) tRDS tRDH
Note: * AS and IOS are the same pin. The function is selected by the IOSE bit in SYSCR.
Figure 26.14 Burst ROM Access Timing (One-State Access)
Rev. 4.00 Sep 27, 2006 page 918 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
26.7.5
Timing of On-Chip Supporting Modules
T1 φ T2
tPRS Ports 1 to 9, A, B (read)
tPRH
tPWD Ports 1 to 6, 8, 9, A, B (write)
Figure 26.15 I/O Port Input/Output Timing
φ tFTOD FTOA, FTOB tFTIS FTIA, FTIB, FTIC, FTID
Figure 26.16 FRT Input/Output Timing
φ tFTCS FTCI tFTCWL tFTCWH
Figure 26.17 FRT Clock Input Timing
Rev. 4.00 Sep 27, 2006 page 919 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
φ tTMOD TMO0, TMO1 TMOX
Figure 26.18 8-Bit Timer Output Timing
φ tTMCS TMCI0, TMCI1 TMIX, TMIY tTMCWL tTMCWH tTMCS
Figure 26.19 8-Bit Timer Clock Input Timing
φ
tTMRS TMRI0, TMRI1 TMIX, TMIY
Figure 26.20 8-Bit Timer Reset Input Timing
φ tPWOD PW15 to PW0, PWX1 to PWX0
Figure 26.21 PWM, PWMX Output Timing
Rev. 4.00 Sep 27, 2006 page 920 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
tSCKW SCK0 to SCK2
tSCKr
tSCKf
tScyc
Figure 26.22 SCK Clock Input Timing
SCK0 to SCK2 tTXD TxD0 to TxD2 (transmit data) tRXS RxD0 to RxD2 (receive data) tRXH
Figure 26.23 SCI Input/Output Timing (Synchronous Mode)
φ
tTRGS ADTRG
Figure 26.24 A/D Converter External Trigger Input Timing
φ tRESD RESO tRESOW tRESD
Figure 26.25 WDT Output Timing (RESO)
Rev. 4.00 Sep 27, 2006 page 921 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
Host interface read timing
CS/HA0 tHAR IOR tHRD HDB7 to HDB0 Valid data tHRF tHRPW tHRA
tHIRQ HIRQi* (i = 1, 3, 4, 11, 12)
Note: * The rising edge timing is the same as the port 4 and port B output timing. See figure 26.15. Host interface write timing
CS/HA0 tHAW IOW tHDW HDB7 to HDB0 tHWD tHWPW tHWA
tHGA GA20
Figure 26.26 Host Interface Timing
Rev. 4.00 Sep 27, 2006 page 922 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
1. Reception φ tKBIS KCLK/ KD* 2. Transmission (a) T1 φ tKBOD KCLK/ KD* T2 tKBIH
Transmission (b) KCLK/ KD* tKBF Note: φ shown here is the clock scaled by 1/N when the operating mode is active medium-speed mode. * KCLK: PS2AC to PS2CC KD: PS2AD to PS2CD
Figure 26.27 Keyboard Buffer Controller Timing
Rev. 4.00 Sep 27, 2006 page 923 of 1130 REJ09B0327-0400
Section 26 Electrical Characteristics
SDA0, SDA1 tBUF
VIH VIL tSTAH tSCLH tSP tSTOS
tSTAS
SCL0, SCL1
P*
S* tSf tof tSCLL tSCL tSr tSDAH
Sr* tSDAS
P*
Note: * S, P, and Sr indicate the following conditions. S: Start condition P: Stop condition Sr: Retransmission start condition
Figure 26.28 I C Bus Interface Input/Output Timing (Option)
2
Rev. 4.00 Sep 27, 2006 page 924 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Appendix A Instruction Set
A.1 Instruction
Operation Notation
Rd Rs Rn ERn MAC (EAd) (EAs) EXR CCR N Z V C PC SP #IMM disp + – × ÷ ∧ ∨ ⊕ → ¬ () :8/:16/:24/:32 General register (destination )* 1 General register (source)* General register*
1 1
General register (32-bit register) Multiply-and-accumulate register (32-bit register)* Destination operand Source operand Extend register Condition code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Program counter Stack pointer Immediate data Displacement Addition Subtraction Multiplication Division Logical AND Logical OR Exclusive logical OR Transfer from left-hand operand to right-hand operand, or transition from lefthand state to right-hand state NOT (logical complement) Operand contents 8-, 16-, 24-, or 32-bit length
2
Notes: 1. General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7). 2. MAC instructions cannot be used in this LSI. Rev. 4.00 Sep 27, 2006 page 925 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Condition Code Notation
Symbol Meaning Changes according operation result. * 0 1 — Indeterminate (value not guaranteed). Always cleared to 0. Always set to 1. Not affected by operation result.
Rev. 4.00 Sep 27, 2006 page 926 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Table A.1
Instruction Set
1. Data Transfer Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
MOV
MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32
B B B B B B B B B B B B B B B B W W W W W W W W W W W W W W
2 2 2 4 8 2 2 4 6 2 4 8 2 2 4 6 4 2 2 4 8 2 4 6 2 4 8 2 4 6
#xx:8→Rd8 Rs8→Rd8 @ERs→Rd8 @(d:16,ERs)→Rd8 @(d:32,ERs)→Rd8 @ERs→Rd8,ERs32+1→ERs32 @aa:8→Rd8 @aa:16→Rd8 @aa:32→Rd8 Rs8→@ERd Rs8→@(d:16,ERd) Rs8→@(d:32,ERd) ERd32-1→ERd32,Rs8→@ERd Rs8→@aa:8 Rs8→@aa:16 Rs8→@aa:32 #xx:16→Rd16 Rs16→Rd16 @ERs→Rd16 @(d:16,ERs)→Rd16 @(d:32,ERs)→Rd16 @ERs→Rd16,ERs32+2→ERs32 @aa:16→Rd16 @aa:32→Rd16 Rs16→@ERd Rs16→@(d:16,ERd) Rs16→@(d:32,ERd) ERd32-2→ERd32,Rs16→@ERd Rs16→@aa:16 Rs16→@aa:32
—— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— ——
0— 0— 0— 0— 0— 0— 0— 0— 0— 0 —— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0—
Normal
@@aa
I
—
HNZ
VC
1 1 2 3 5 3 2 3 4 2 3 5 3 2 3 4 2 1 2 3 5 3 3 4 2 3 5 3 3 4
Rev. 4.00 Sep 27, 2006 page 927 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
MOV
MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16,ERd MOV.L @aa:32,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd) MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32
L L L L L L L L L L L L L L W L W L L
6 2 4 6 10 4 6 8 4 6 10 4 6 8
#xx:32→ERd32 ERs32→ERd32 @ERs→ERd32 @(d:16,ERs)→ERd32 @(d:32,ERs)→ERd32 @ERs→ERd32,ERs32+4→ERs32 @aa:16→ERd32 @aa:32→ERd32 ERs32→@ERd ERs32→@(d:16,ERd) ERs32→@(d:32,ERd) ERd32-4→ERd32,ERs32→@ERd ERs32→@aa:16 ERs32→@aa:32 2 @SP→Rn16,SP+2→SP 4 @SP→ERn32,SP+4→SP 2 SP-2→SP,Rn16→@SP 4 SP-4→SP,ERn32→@SP 4 (@SP→ERn32,SP+4→SP) Repeated for each restored register. 4 (SP-4→SP,ERn32→@SP) Repeated for each saved register.
—— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— ——
0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0—
Normal
@@aa
I
—
HNZ
VC
3 1 4 5 7 5 5 6 4 5 7 5 5 6 3 5 3 5
POP
POP.W Rn POP.L ERn
PUSH
PUSH.W Rn PUSH.L ERn
LDM*4
LDM @SP+,(ERm-ERn)
— — — — — — 7/9/11 [1]
STM*4
STM (ERm-ERn),@-SP
L
— — — — — — 7/9/11 [1]
MOVFPE MOVFPE @aa:16,Rd MOVTPE MOVTPE Rs,@aa:16
Cannot be used with this LSI.
[2] [2]
Rev. 4.00 Sep 27, 2006 page 928 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
2. Arithmetic Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
ADD
ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd
B B W W L L B B L L L B W W L L B B W W L L B B L L L B W W L L
2 2 4 2 6 2 2 2 2 2 2 2 2 2 2 2 2 2 4 2 6 2 2 2 2 2 2 2 2 2 2 2
Rd8+#xx:8→Rd8 Rd8+Rs8→Rd8 Rd16+#xx:16→Rd16 Rd16+Rs16→Rd16 ERd32+#xx:32→ERd32 ERd32+ERs32→ERd32 Rd8+#xx:8+C→Rd8 Rd8+Rs8+C→Rd8 ERd32+1→ERd32 ERd32+2→ERd32 ERd32+4→ERd32 Rd8+1→Rd8 Rd16+1→Rd16 Rd16+2→Rd16 ERd32+1→ERd32 ERd32+2→ERd32 Rd8 decimal adjust →Rd8 Rd8-Rs8→Rd8 Rd16-#xx:16→Rd16 Rd16-Rs16→Rd16 ERd32-#xx:32→ERd32 ERd32-ERs32→ERd32 Rd8-#xx:8-C→Rd8 Rd8-Rs8-C→Rd8 ERd32-1→ERd32 ERd32-2→ERd32 ERd32-4→ERd32 Rd8-1→Rd8 Rd16-1→Rd16 Rd16-2→Rd16 ERd32-1→ERd32 ERd32-2→ERd32
— — — [3] — [3] — [4] — [4] — — [5] [5]
Normal
@@aa
I
—
HNZ
VC
1 1 2 1 3 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 3 1 [5] [5] 1 1 1 1 1 1 1 1 1 1
ADDX
ADDX #xx:8,Rd ADDX Rs,Rd
ADDS
ADDS #1,ERd ADDS #2,ERd ADDS #4,ERd
—————— —————— —————— —— —— —— —— —— —* — — [3] — [3] — [4] — [4] — — — — — — —
INC
INC.B Rd INC.W #1,Rd INC.W #2,Rd INC.L #1,ERd INC.L #2,ERd
DAA SUB
DAA Rd SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd
*
SUBX
SUBX #xx:8,Rd SUBX Rs,Rd
SUBS
SUBS #1,ERd SUBS #2,ERd SUBS #4,ERd
—————— —————— —————— —— —— —— —— —— — — — — —
DEC
DEC.B Rd DEC.W #1,Rd DEC.W #2,Rd DEC.L #1,ERd DEC.L #2,ERd
Rev. 4.00 Sep 27, 2006 page 929 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
DAS MULXU
DAS Rd MULXU.B Rs,Rd MULXU.W Rs,ERd
B B W B W B
2 2 2 4 4 2
Rd8 decimal adjust →Rd8 Rd8×Rs8→Rd16 (unsigned multiplication) Rd16×Rs16→ERd32 (unsigned multiplication) Rd8×Rs8→Rd16 (signed multiplication) Rd16×Rs16→ERd32 (signed multiplication) Rd16÷Rs8→Rd16 (RdH: remainder, RdL: quotient) (unsigned division) ERd32÷Rs16→ERd32 (Ed: remainder, Rd: quotient) (unsigned division) Rd16÷Rs8→Rd16 (RdH: remainder, RdL: quotient) (signed division) ERd32÷Rs16→ERd32 (Ed: remainder, Rd: quotient) (signed division) Rd8-#xx:8
—*
*—
Normal
@@aa
I
—
HNZ
VC
1 12 20 13 21 12
—————— —————— —— —— —— ——
MULXS
MULXS.B Rs,Rd MULXS.W Rs,ERd
DIVXU
DIVXU.B Rs,Rd
— — [6] [7] — —
DIVXU.W Rs,ERd
W
2
— — [6] [7] — —
20
DIVXS
DIVXS.B Rs,Rd
B
4
— — [8] [7] — —
13
DIVXS.W Rs,ERd
W
4
— — [8] [7] — —
21
CMP
CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd
B B W W L L B W L W L W L B
2 2 4 2 6 2 2 2 2 2 2 2 2 4
— — — [3] — [3] — [4] — [4] — — — —— 0 —— 0 —— —— —— 0— 0— 0— 0— 0—
1 1 2 1 3 1 1 1 1 1 1 1 1 4
Rd8-Rs8 Rd16-#xx:16 Rd16-Rs16 ERd32-#xx:32 ERd32-ERs32 0-Rd8→Rd8 0-Rd16→Rd16 0-ERd32→ERd32 0 → ( of Rd16) 0 → ( of ERd32) ( of Rd16) → ( of Rd16) ( of ERd32) → ( of ERd32) @ERd-0 → CCR set, (1) → ( of @ERd)
NEG
NEG.B Rd NEG.W Rd NEG.L ERd
EXTU
EXTU.W Rd EXTU.L ERd
EXTS
EXTS.W Rd EXTS.L ERd
TAS
TAS @ERd*3
Rev. 4.00 Sep 27, 2006 page 930 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
MAC
MAC @ERn+,@ERm+
Cannot be used with this LSI.
Normal
@@aa
I
—
HNZ
VC
[2]
CLRMAC CLRMAC LDMAC LDMAC ERs,MACH LDMAC ERs,MACL STMAC STMAC MACH,ERd STMAC MACL,ERd
Rev. 4.00 Sep 27, 2006 page 931 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
3. Logic Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
AND
AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd
B B W W L L B B W W L L B B W W L L B W L
2 2 4 2 6 4 2 2 4 2 6 4 2 2 4 2 6 4 2 2 2
Rd8∧#xx:8→Rd8 Rd8∧Rs8→Rd8 Rd16∧#xx:16→Rd16 Rd16∧Rs16→Rd16 ERd32∧#xx:32→ERd32 ERd32∧ERs32→ERd32 Rd8∨#xx:8→Rd8 Rd8∨Rs8→Rd8 Rd16∨#xx:16→Rd16 Rd16∨Rs16→Rd16 ERd32∨#xx:32→ERd32 ERd32∨ERs32→ERd32 Rd8⊕#xx:8→Rd8 Rd8⊕Rs8→Rd8 Rd16⊕#xx:16→Rd16 Rd16⊕Rs16→Rd16 ERd32⊕#xx:32→ERd32 ERd32⊕ERs32→ERd32 ¬ Rd8→Rd8 ¬ Rd16→Rd16 ¬ ERd32→ERd32
—— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— ——
Normal
@@aa
I
—
HNZ
VC
0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0— 0—
1 1 2 1 3 2 1 1 2 1 3 2 1 1 2 1 3 2 1 1 1
OR
OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd
XOR
XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd
NOT
NOT.B Rd NOT.W Rd NOT.L ERd
Rev. 4.00 Sep 27, 2006 page 932 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
4. Shift Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
SHAL
SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd
B B W W L L B B W W L L B B W W L L B B W W L L B B W W L L
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 C MSB LSB 0 MSB LSB C C MSB LSB MSB LSB C C MSB LSB
—— —— 0 —— —— —— —— —— —— —— —— —— —— —— —— 0 —— —— —— —— —— 0 —— 0 —— 0 —— 0 —— 0 —— 0 —— —— —— —— —— —— 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Normal
@@aa
I
—
HNZ
VC
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
SHAR
SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd
SHLL
SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd
SHLR
SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd
ROTXL
ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd
Rev. 4.00 Sep 27, 2006 page 933 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
ROTXR
ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd
B B W W L L B B W W L L B B W W L L
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 MSB LSB 2 2 C C MSB LSB MSB LSB C
—— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— —— ——
Normal
@@aa
I
—
HNZ
VC
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
ROTL
ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd
ROTR
ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd
Rev. 4.00 Sep 27, 2006 page 934 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
5. Bit-Manipulation Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
BSET
BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32
B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B
2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8
(#xx:3 of Rd8)←1 (#xx:3 of @ERd)←1 (#xx:3 of @aa:8)←1 (#xx:3 of @aa:16)←1 (#xx:3 of @aa:32)←1 (Rn8 of Rd8)←1 (Rn8 of @ERd)←1 (Rn8 of @aa:8)←1 (Rn8 of @aa:16)←1 (Rn8 of @aa:32)←1 (#xx:3 of Rd8)←0 (#xx:3 of @ERd)←0 (#xx:3 of @aa:8)←0 (#xx:3 of @aa:16)←0 (#xx:3 of @aa:32)←0 (Rn8 of Rd8)←0 (Rn8 of @ERd)←0 (Rn8 of @aa:8)←0 (Rn8 of @aa:16)←0 (Rn8 of @aa:32)←0 (#xx:3 of Rd8)← [¬ (#xx:3 of Rd8)] (#xx:3 of @ERd)← [¬ (#xx:3 of @ERd)] (#xx:3 of @aa:8)← [¬ (#xx:3 of @aa:8)] (#xx:3 of @aa:16)← [¬ (#xx:3 of @aa:16)] (#xx:3 of @aa:32)← [¬ (#xx:3 of @aa:32)] (Rn8 of Rd8)← [¬ (Rn8 of Rd8)]
Normal
@@aa
I
—
HNZ
VC
—————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— ——————
1 4 4 5 6 1 4 4 5 6 1 4 4 5 6 1 4 4 5 6 1 4 4 5 6 1 4 4 5 6
BCLR
BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32
BNOT
BNOT #xx:3,Rd BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32
(Rn8 of @ERd)← [¬ (Rn8 of @ERd)] — — — — — — (Rn8 of @aa:8)← [¬ (Rn8 of @aa:8)] — — — — — — (Rn8 of @aa:16)← [¬ (Rn8 of @aa:16)] (Rn8 of @aa:32)← [¬ (Rn8 of @aa:32)] —————— ——————
Rev. 4.00 Sep 27, 2006 page 935 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
BTST
BTST #xx:3,Rd BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32
B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B
2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8
¬ (#xx:3 of Rd8)→Z ¬ (#xx:3 of @ERd)→Z ¬ (#xx:3 of @aa:8)→Z ¬ (#xx:3 of @aa:16)→Z ¬ (#xx:3 of @aa:32)→Z ¬ (Rn8 of Rd8)→Z ¬ (Rn8 of @ERd)→Z ¬ (Rn8 of @aa:8)→Z ¬ (Rn8 of @aa:16)→Z ¬ (Rn8 of @aa:32)→Z (#xx:3 of Rd8)→C (#xx:3 of @ERd)→C (#xx:3 of @aa:8)→C (#xx:3 of @aa:16)→C (#xx:3 of @aa:32)→C ¬ (#xx:3 of Rd8)→C ¬ (#xx:3 of @ERd)→C ¬ (#xx:3 of @aa:8)→C ¬ (#xx:3 of @aa:16)→C ¬ (#xx:3 of @aa:32)→C C→(#xx:3 of Rd8) C→(#xx:3 of @ERd) C→(#xx:3 of @aa:8) C→(#xx:3 of @aa:16) C→(#xx:3 of @aa:32) ¬ C→(#xx:3 of Rd8) ¬ C→(#xx:3 of @ERd) ¬ C→(#xx:3 of @aa:8) ¬ C→(#xx:3 of @aa:16) ¬ C→(#xx:3 of @aa:32)
——— ——— ——— ——— ——— ——— ——— ——— ——— ———
—— —— —— —— —— —— —— —— —— ——
Normal
@@aa
I
—
HNZ
VC
1 3 3 4 5 1 3 3 4 5 1 3 3 4 5 1 3 3 4 5 1 4 4 5 6 1 4 4 5 6
BLD
BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32
————— ————— ————— ————— ————— ————— ————— ————— ————— ————— —————— —————— —————— —————— —————— —————— —————— —————— —————— ——————
BILD
BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32
BST
BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32
BIST
BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32
Rev. 4.00 Sep 27, 2006 page 936 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
BAND
BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32
B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B
2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 4 6 8
C∧ (#xx:3 of Rd8)→C C∧ (#xx:3 of @ERd)→C C∧ (#xx:3 of @aa:8)→C C∧ (#xx:3 of @aa:16)→C C∧ (#xx:3 of @aa:32)→C C∧ [¬ (#xx:3 of Rd8)]→C C∧ [¬ (#xx:3 of @ERd)]→C C∧ [¬ (#xx:3 of @aa:8)]→C C∧ [¬ (#xx:3 of @aa:16)]→C C∧ [¬ (#xx:3 of @aa:32)]→C C∨ (#xx:3 of Rd8)→C C∨ (#xx:3 of @ERd)→C C∨ (#xx:3 of @aa:8)→C C∨ (#xx:3 of @aa:16)→C C∨ (#xx:3 of @aa:32)→C C∨ [¬ (#xx:3 of Rd8)]→C C∨ [¬ (#xx:3 of @ERd)]→C C∨ [¬ (#xx:3 of @aa:8)]→C C∨ [¬ (#xx:3 of @aa:16)]→C C∨ [¬ (#xx:3 of @aa:32)]→C C⊕ (#xx:3 of Rd8)→C C⊕ (#xx:3 of @ERd)→C C⊕ (#xx:3 of @aa:8)→C C⊕ (#xx:3 of @aa:16)→C C⊕ (#xx:3 of @aa:32)→C C⊕ [¬ (#xx:3 of Rd8)]→C C⊕ [¬ (#xx:3 of @ERd)]→C C⊕ [¬ (#xx:3 of @aa:8)]→C C⊕ [¬ (#xx:3 of @aa:16)]→C C⊕ [¬ (#xx:3 of @aa:32)]→C
————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— ————— —————
Normal
@@aa
I
—
HNZ
VC
1 3 3 4 5 1 3 3 4 5 1 3 3 4 5 1 3 3 4 5 1 3 3 4 5 1 3 3 4 5
BIAND
BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32
BOR
BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32
BIOR
BIOR #xx:3,Rd BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32
BXOR
BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32
BIXOR
BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32
Rev. 4.00 Sep 27, 2006 page 937 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
6. Branch Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,ERn)
@(d,PC)
Bcc
BRA d:8(BT d:8) BRA d:16(BT d:16) BRN d:8(BF d:8) BRN d:16(BF d:16) BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:8(BHS d:8) BCC d:16(BHS d:16) BCS d:8(BLO d:8) BCS d:16(BLO d:16) BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 BLE d:8 BLE d:16
— — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — —
2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4
if condition is true then PC←PC+d else next;
Always
—————— ——————
Normal
@@aa
@ERn
Branch Condition
I
HNZ
VC
2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3
Never
—————— ——————
C∨Z=0
—————— ——————
C∨Z=1
—————— ——————
C=0
—————— ——————
C=1
—————— ——————
Z=0
—————— ——————
Z=1
—————— ——————
V=0
—————— ——————
V=1
—————— ——————
N=0
—————— ——————
N=1
—————— ——————
N⊕V=0
—————— ——————
N⊕V=1
—————— ——————
Z∨(N⊕V)=0 — — — — — — —————— Z∨(N⊕V)=1 — — — — — — ——————
Rev. 4.00 Sep 27, 2006 page 938 of 1130 REJ09B0327-0400
Advanced
Mnemonic
Operation
@aa
Size
#xx
Rn
—
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
JMP
JMP @ERn JMP @aa:24 JMP @@aa:8
— — — — — — — — —
2 4 2 2 4 2 4 2
PC←ERn PC←aa:24 PC←@aa:8 PC→@-SP,PC←PC+d:8 PC→@-SP,PC←PC+d:16 PC→@-SP,PC←ERn PC→@-SP,PC←aa:24 PC→@-SP,PC←@aa:8 2 PC←@SP+
Normal
@@aa
I
—
HNZ
VC
—————— —————— —————— —————— —————— —————— —————— —————— —————— 4 3 4 3 4 4 4
2 3 5 4 5 4 5 6 5
BSR
BSR d:8 BSR d:16
JSR
JSR @ERn JSR @aa:24 JSR @@aa:8
RTS
RTS
Rev. 4.00 Sep 27, 2006 page 939 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
7. System Control Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
TRAPA
TRAPA #xx:2
—
PC→@-SP,CCR→@-SP, EXR→@-SP,→PC EXR←@SP+,CCR←@SP+, PC←@SP+ Transition to power-down state 2 4 2 2 4 4 6 6 10 10 4 4 6 6 8 8 #xx:8→CCR #xx:8→EXR Rs8→CCR Rs8→EXR @ERs→CCR @ERs→EXR @(d:16,ERs)→CCR @(d:16,ERs)→EXR @(d:32,ERs)→CCR @(d:32,ERs)→EXR @ERs→CCR,ERs32+2→ERs32 @ERs→EXR,ERs32+2→ERs32 @aa:16→CCR @aa:16→EXR @aa:32→CCR @aa:32→EXR
1 — — — — — 7 [9] 8 [9]
RTE
RTE
—
SLEEP LDC
SLEEP LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR
— B B B B W W W W W W W W W W W W
——————
Normal
@@aa
I
—
HNZ
VC
5 [9]
2 1
——————
2 1
——————
1 3
——————
3 4
——————
4 6
——————
6 4
——————
4 4
——————
4 5
——————
5
Rev. 4.00 Sep 27, 2006 page 940 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
STC
STC CCR,Rd STC EXR,Rd STC CCR,@ERd STC EXR,@ERd STC CCR,@(d:16,ERd) STC EXR,@(d:16,ERd) STC CCR,@(d:32,ERd) STC EXR,@(d:32,ERd) STC CCR,@-ERd STC EXR,@-ERd STC CCR,@aa:16 STC EXR,@aa:16 STC CCR,@aa:32 STC EXR,@aa:32
B B W W W W W W W W W W W W B B B B B B — 2 4 2 4 2 4
2 2 4 4 6 6 10 10 4 4 6 6 8 8
CCR→Rd8 EXR→Rd8 CCR→@ERd EXR→@ERd CCR→@(d:16,ERd) EXR→@(d:16,ERd) CCR→@(d:32,ERd) EXR→@(d:32,ERd) ERd32-2→ERd32,CCR→@ERd ERd32-2→ERd32,EXR→@ERd CCR→@aa:16 EXR→@aa:16 CCR→@aa:32 EXR→@aa:32 CCR∧#xx:8→CCR EXR∧#xx:8→EXR CCR∨#xx:8→CCR EXR∨#xx:8→EXR CCR⊕#xx:8→CCR EXR⊕#xx:8→EXR 2 PC←PC+2
—————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— —————— ——————
Normal
@@aa
I
—
HNZ
VC
1 1 3 3 4 4 6 6 4 4 4 4 5 5 1
ANDC
ANDC #xx:8,CCR ANDC #xx:8,EXR
——————
2 1
ORC
ORC #xx:8,CCR ORC #xx:8,EXR
——————
2 1
XORC
XORC #xx:8,CCR XORC #xx:8,EXR
—————— ——————
2 1
NOP
NOP
Rev. 4.00 Sep 27, 2006 page 941 of 1130 REJ09B0327-0400
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
Appendix A Instruction Set
8. Block Transfer Instructions
Addressing Mode and Instruction Length (Bytes)
@-ERn/@ERn+
Condition Code
No. of States*1
@(d,PC)
EEPMOV EEPMOV.B
—
4 if R4L≠0 Repeat @ER5→@ER6 ER5+1→ER5 ER6+1→ER6 R4L-1→R4L Until R4L=0 else next; 4 if R4≠0 Repeat @ER5→@ER6 ER5+1→ER5 ER6+1→ER6 R4-1→R4 Until R4=0 else next;
——————
4+2n*2
EEPMOV.W
—
——————
4+2n*2
Notes: 1. The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. 2. n is the initial value set in R4L or R4. 3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 4. Only registers ER0 to ER6 should be used when using the STM/LDM instruction. [1] 7 states when the number of saved/restored registers is 2, 9 states when 3, and 11 states when 4. [2] Cannot be used with this LSI. [3] Set to 1 when there is a carry from or borrow to bit 11; otherwise cleared to 0. [4] Set to 1 when there is a carry from or borrow to bit 27; otherwise cleared to 0. [5] If the result is zero, the previous value of the flag is retained; otherwise the flag is cleared to 0. [6] Set to 1 if the divisor is negative; otherwise cleared to 0. [7] Set to 1 if the divisor is zero; otherwise cleared to 0. [8] Set to 1 if the quotient is negative; otherwise cleared to 0. [9] When EXR is valid, the number of states is increased by 1.
Rev. 4.00 Sep 27, 2006 page 942 of 1130 REJ09B0327-0400
Normal
@@aa
I
—
HNZ
VC
Advanced
@(d,ERn)
Mnemonic
@ERn
Operation
@aa
Size
#xx
Rn
A.2
Instruction Mnemonic Size 1st Byte 8 IMM rs 1 rs 1 1 ers 0 erd 0 8 9 IMM rs IMM rs 6 IMM rs 6 0 erd IMM 6 0 ers 0 erd 6 0 IMM 4 IMM 0 IMM 0 erd abs 1 abs abs 3 disp 0 disp 1 0 disp 0 disp 0 0 7 0 IMM 6 0 7 6 0 IMM 0 7 6 0 IMM 0 0 0 IMM 7 0 6 rd 1 0 6 F rd rd rd rd 0 erd 0 erd 0 erd 0 erd IMM rd rd IMM rd 0 7 0 7 0 0 0 0 9 0 E 1 7 6 7 0 0 0 7 7 7 6 6 4 5 4 5 8 1 8 0 A A E C 6 1 6 1 A 6 9 6 rd E rd B B B A A 9 9 8 rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte 10th Byte B B W W L L L L L B B B B W W L L B B B B B B B — — — — ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDS ADDS #2,ERd ADDS #4,ERd ADDX ADDX Rs,Rd AND AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd ANDC ANDC #xx:8,EXR BAND BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 Bcc BRA d:16 (BT d:16) BRN d:8 (BF d:8) BRN d:16 (BF d:16) BRA d:8 (BT d:8) BAND #xx:3,Rd ANDC #xx:8,CCR AND.B #xx:8,Rd ADDX #xx:8,Rd ADDS #1,ERd ADD
Table A.2
Instruction Format
Instruction Codes
Instruction Codes
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 943 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 4 5 0 disp 3 0 disp 4 0 disp 5 0 disp 6 0 disp 7 0 disp 8 0 disp 9 0 disp A 0 disp B 0 disp C 0 disp D 0 disp E disp F 0 disp 0 disp disp disp disp disp disp disp disp disp disp disp disp 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 8 F 8 E 8 D 8 C 8 B 8 A 8 9 8 8 8 7 8 6 8 5 8 4 8 3 8 disp 2 2 disp 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte — — — — — — — — — — — — — — — — — — — — — — — — — — — — BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:8 (BHS d:8) BCC d:16 (BHS d:16) BCS d:8 (BLO d:8) BCS d:16 (BLO d:16) BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 BLE d:8 BLE d:16 Bcc
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 944 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 7 7 0 IMM 0 IMM abs 0 IMM 7 2 0 IMM abs 7 2 0 0 0 7 abs 1 3 rn 0 erd abs 1 abs abs 3 1 IMM 0 erd 1 IMM 1 IMM abs abs 7 6 0 1 IMM 0 7 6 1 IMM 0 abs 1 3 1 IMM 0 erd 1 IMM 1 IMM abs abs 0 7 7 1 IMM 0 7 7 1 IMM 0 abs 1 3 1 IMM 0 erd abs 1 3 0 0 7 0 7 4 4 rd 1 IMM 1 IMM abs abs 0 0 7 4 1 IMM 0 7 4 1 IMM 0 0 0 7 7 0 7 7 0 rd 0 0 7 6 0 7 6 0 rd 8 8 6 2 rn 0 6 2 rn 0 6 2 rn 0 0 6 2 rn 0 rd 8 8 6 6 6 7 7 6 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 6 A A E C 4 A A E C 7 A A E C 6 A A F D 2 A A F 7 2 D 0 erd 0 7 2 0 2 0 IMM rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B B B B B B B B B B B B B B B B B B B B B B B B BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 BIOR #xx:3,Rd BILD #xx:3,Rd BIAND #xx:3,Rd BCLR
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 945 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 6 1 IMM 0 erd abs 1 abs abs 6 1 IMM 7 0 1 IMM 3 1 IMM 0 erd abs 1 abs abs 7 1 IMM 3 0 IMM 0 erd abs 1 abs abs 3 0 IMM 0 erd abs 1 abs abs 3 rn 0 erd abs 1 3 8 8 6 0 6 1 1 abs abs rd rn rn 0 0 6 1 rn 0 6 1 rn 0 8 8 7 0 IMM 1 0 7 1 0 IMM 0 7 1 0 IMM 0 0 0 IMM 7 1 0 rd 0 0 7 7 7 0 IMM 7 0 0 IMM 0 7 7 0 IMM 0 0 0 IMM 7 7 0 rd 0 0 7 5 0 5 1 IMM 0 7 1 IMM 5 0 0 1 IMM 7 5 0 rd 8 8 6 7 0 6 1 IMM 7 0 0 1 IMM 6 7 0 7 7 6 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 6 6 7 7 6 6 A A F D 1 A A F D 1 A A E C 7 A A E C 5 A A F D 7 rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B B B B B B B B B B B B B B B B B B B B B B B B BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 BNOT #xx:3,Rd BLD #xx:3,Rd BIXOR #xx:3,Rd BIST
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 946 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 7 7 7 6 abs abs 7 4 0 IMM 6 7 7 7 6 abs abs 6 6 7 0 erd abs 1 abs abs 3 disp 0 disp 0 IMM 0 erd abs 1 3 0 IMM 0 erd abs 1 3 rn 3 C 0 erd 0 0 rd 0 6 3 rn 0 0 rd 7 7 3 3 0 IMM 0 IMM abs abs 0 0 7 3 0 IMM 0 7 3 0 IMM 0 8 8 6 7 0 6 7 0 IMM 0 IMM abs abs rd 0 0 6 7 0 IMM 0 6 7 0 IMM 0 0 8 8 6 0 6 0 rn 0 rn 0 6 0 rn 0 7 6 6 5 5 6 7 7 6 6 7 7 7 6 6 6 7 A A E C 3 A A F D 7 C 5 A A F D 0 6 0 rn 0 0 rn rd A 3 8 A 0 IMM 1 8 7 0 0 7 0 0 IMM 0 F abs 0 IMM 7 0 0 D 0 erd 0 IMM 0 7 0 0 0 0 IMM rd A 3 0 A 0 IMM 1 0 7 4 0 0 E abs 0 IMM 7 4 0 C 0 erd 0 IMM 0 7 4 0 4 0 IMM rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B B B B B B B B B B B B B B — — B B B B B B B B B B B B BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BSR BSR d:16 BST BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 BTST BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST #xx:3,Rd BST #xx:3,Rd BSR d:8 BSET #xx:3,Rd BOR
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 947 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 7 abs 1 abs abs 6 3 rn 0 3 0 IMM 0 erd 0 IMM 0 IMM abs abs 7 5 7 0 IMM 5 0 0 IMM 0 0 abs 1 3 0 0 7 5 0 7 5 0 rd 0 0 6 3 rn 0 6 6 7 7 7 6 6 Cannot be used with this LSI. A IMM rs 2 IMM rs 2 0 erd IMM 1 ers 0 erd 0 0 0 5 D 7 0 erd 0 erd 0 0 rd 0 erd C 5 D 4 5 5 9 9 8 8 F F 5 5 1 3 rs rs rd 0 erd F D D rs rs rd rd rd rd rd rd rd rd 1 7 1 7 1 0 1 1 1 1 1 1 0 0 5 5 7 7 B B 3 1 1 1 B B B B A F F F A D 9 C rd A A E C 5 A A E 6 3 rn 0 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B B B B B B B — B B W W L L B B B W W L L B W B W — — BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 CLRMAC CLRMAC CMP CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA DAS DEC DEC.W #1,Rd DEC.W #2,Rd DEC.L #1,ERd DEC.L #2,ERd DIVXS DIVXS.W Rs,ERd DIVXU DIVXU.W Rs,ERd EEPMOV EEPMOV.B EEPMOV.W DIVXU.B Rs,Rd DIVXS.B Rs,Rd DEC.B Rd DAS Rd DAA Rd CMP.B #xx:8,Rd BTST
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 948 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 1 1 0 erd rd 0 erd rd rd rd 0 erd 0 erd 0 abs abs 0 ern abs abs IMM 4 IMM 0 1 4 4 4 4 4 4 4 4 4 1 1 4 1 0 1 0 1 0 1 6 7 7 6 6 6 6 0 6 F F 8 8 D D B B 1 6 9 0 6 9 rs 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 ers 0 0 0 0 0 0 0 0 0 0 0 0 abs abs 6 6 B B disp disp 2 2 0 0 disp disp rs 1 0 7 0 1 1 0 0 0 0 0 5 5 5 5 5 5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 3 3 1 7 F E D B A 9 0 ern B F B 7 B D B 5 A 0 7 7 7 5 7 F 7 D rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte W L W L B W W L L — — — — — — B B B B W W W W W W W W W W EXTS.W Rd EXTS.L ERd EXTU EXTU.L ERd INC INC.B Rd INC.W #1,Rd INC.W #2,Rd INC.L #1,ERd INC.L #2,ERd JMP JMP @aa:24 JMP @@aa:8 JSR JSR @aa:24 JSR @@aa:8 LDC LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC #xx:8,CCR JSR @ERn JMP @ERn EXTU.W Rd EXTS
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 949 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 0 0 0 0 ern+1 0 ern+2 0 ern+3 0 0 Cannot be used with this LSI. 1 3 0 6 D 7 1 2 0 6 D 7 1 1 0 6 D 7 1 0 abs 4 1 6 B 2 1 0 abs 4 0 6 B 2 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte W W L L L L L — B IMM rs 0 ers 0 ers 0 ers 0 ers abs 0 abs abs 2 1 erd 1 erd 0 erd 1 erd abs 8 A 0 rs 0 ers 0 ers 0 ers rd rd rd rd 0 8 6 B disp 2 rd disp rs IMM rs abs abs rs 0 6 A A rs disp rs disp rs rd rd rd 0 rd 6 A 2 rd disp disp rd rd B B B B B B B B B B B B B B B W W W W W 7 6 F 6 9 0 D 7 9 6 A 6 A 3 rs 6 C 7 8 6 E 6 8 6 A 6 A 2 rd 6 C 7 8 6 E 6 8 0 C F rd LDC @aa:32,CCR LDC @aa:32,EXR LDM*3 LDM.L @SP+, (ERn-ERn+1) LDM.L @SP+, (ERn-ERn+2) LDM.L @SP+, (ERn-ERn+3) LDMAC LDMAC ERs,MACL MAC MOV MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.B #xx:8,Rd MAC @ERn+,@ERm+ LDMAC ERs,MACH LDC
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 950 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 6 0 ers 0 abs abs 2 1 erd 1 erd disp 6 disp B A rs 0 erd 1 erd 8 abs abs IMM A 0 0 erd 1 ers 0 erd 0 0 ers 0 erd 0 ers 0 erd 0 ers 0 ers 0 erd 0 0 erd 0 erd 2 1 erd 0 ers 1 erd 0 ers 0 erd 0 1 erd 0 ers B B 6 8 A 0 ers 0 ers abs abs 6 B disp A 0 ers disp abs abs 0 6 B disp 2 0 erd disp 0 0 0 0 0 0 0 0 0 0 0 0 0 6 0 6 D 0 7 8 0 6 F 0 6 9 0 6 B 0 6 B 0 6 D 0 7 8 0 6 F 0 6 9 rs rs rs 0 rs rs rd rd 6 6 6 6 7 6 6 6 7 0 0 0 0 0 0 0 0 0 0 0 0 0 Cannot be used with this LSI. 1 1 1 1 1 1 1 1 1 1 1 1 F A B B D 8 F 9 B B D rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte W W W W W W W W W L L L L L L L L L L MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,Rd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16 ,ERd MOV.L @aa:32 ,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd)*1 L MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 MOVFPE MOVFPE @aa:16,Rd MOVTPE MOVTPE Rs,@aa:16 MULXS MULXS.W Rs,ERd MULXU MULXU.W Rs,ERd W 5 2 MULXU.B Rs,Rd B 5 0 W 0 1 C rs rs MULXS.B Rs,Rd B 0 1 C B 0 0 rd 0 erd 5 5 0 2 rs rs rd 0 erd B L L L MOV
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 951 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 1 1 1 0 erd 0 rd rd 0 erd IMM rs 4 IMM rs 4 0 erd 0 6 4 0 ers 0 erd IMM 4 0 4 IMM 7 0 6 D 7 0 ern F 0 6 D F 8 C 9 D B 0 erd 0 erd F rd rd rd rd 0 rn 0 ern 0 rn 1 IMM F rd rd rd 0 1 1 1 C 1 7 6 7 0 0 0 6 0 6 0 1 1 1 1 1 1 2 2 2 2 2 2 1 D 1 D 1 4 1 A 4 9 4 rd 7 3 7 1 7 0 0 0 7 B 7 9 rd 7 8 rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B W L — B W L B B W W L L B B W L W L B B W W L L NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT NOT.W Rd NOT.L ERd OR OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC ORC #xx:8,EXR POP POP.L ERn PUSH PUSH.L ERn ROTL ROTL.B #2, Rd ROTL.W Rd ROTL.W #2, Rd ROTL.L ERd ROTL.L #2, ERd ROTL.B Rd PUSH.W Rn POP.W Rn ORC #xx:8,CCR NOT.B Rd NOP NEG
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 952 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 1 1 1 1 1 0 erd 0 erd rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd 0 0 rd rd rd rd 0 erd 0 erd 1 1 1 1 1 1 1 1 1 1 1 1 1 5 5 1 1 1 1 1 1 0 F 0 B 0 D 0 9 0 C 0 8 4 7 6 7 3 7 3 3 3 5 3 1 3 4 3 0 2 7 2 3 2 5 2 1 2 4 2 0 3 F 3 B 3 D rd 3 9 rd 3 C rd 3 8 rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B W W L L B B W W L L B B W W L L — — B B W W L L ROTR.B Rd ROTR.B #2, Rd ROTR.W Rd ROTR.W #2, Rd ROTR.L ERd ROTR.L #2, ERd ROTXL ROTXL.B #2, Rd ROTXL.W Rd ROTXL.W #2, Rd ROTXL.L ERd ROTXL.L #2, ERd ROTXR ROTXR.B #2, Rd ROTXR.W Rd ROTXR.W #2, Rd ROTXR.L ERd ROTXR.L #2, ERd RTE RTE RTS SHAL.B Rd SHAL.B #2, Rd SHAL.W Rd SHAL.W #2, Rd SHAL.L ERd SHAL.L #2, ERd RTS SHAL ROTXR.B Rd ROTXL.B Rd ROTR
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 953 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 1 1 1 1 1 0 erd 0 erd rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd 0 rd rd 0 6 6 6 6 0 1 4 4 4 1 0 1 7 7 6 6 1 0 1 9 9 F F 8 8 D D 1 erd 1 erd 1 erd 1 erd 0 erd 0 erd 1 erd 1 erd 0 0 0 0 0 0 0 0 6 6 B B disp disp A A 0 0 disp disp 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 1 1 1 4 1 4 1 4 1 4 1 4 2 1 2 0 1 8 1 7 1 3 1 5 1 1 1 4 1 0 0 7 0 3 0 5 0 1 0 4 0 0 1 F 1 B 1 D rd 1 9 rd 1 C rd 1 8 rd 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte B B W W L L B B W W L L B B W W L L — B B W W SHAR.B Rd SHAR.B #2, Rd SHAR.W Rd SHAR.W #2, Rd SHAR.L ERd SHAR.L #2, ERd SHLL SHLL.B #2, Rd SHLL.W Rd SHLL.W #2, Rd SHLL.L ERd SHLL.L #2, ERd SHLR SHLR.B Rd SHLR.B #2, Rd SHLR.W Rd SHLR.W #2, Rd SHLR.L ERd SHLR.L #2, ERd SLEEP SLEEP STC.B CCR,Rd STC.B EXR,Rd STC.W CCR,@ERd STC.W EXR,@ERd STC.W CCR,@(d:16,ERd) W STC.W EXR,@(d:16,ERd) W STC.W CCR,@(d:32,ERd) W STC.W EXR,@(d:32,ERd) W STC.W CCR,@-ERd STC.W EXR,@-ERd W W STC SHLL.B Rd SHAR
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 954 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st Byte 0 0 0 0 0 0 0 Cannot be used with this LSI. 1 0 ern 3 0 6 D F 1 0 ern 2 0 6 D F 1 0 ern 1 0 6 D F 1 abs 4 1 6 B A 0 1 abs 4 0 6 B A 0 1 abs 4 1 6 B 8 0 1 abs 4 0 6 B 8 0 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte 8th Byte 9th Byte W W W W L L L L L B 1 7 IMM 1 7 IMM 1 1 1 1 B IMM rs E 00 IMM IMM rs 5 rs 5 F rd 0 erd 0 6 5 IMM 0 ers 0 erd rd rd IMM 0 0 7 B rd 0 erd C 1 0 5 D 1 7 6 7 0 1 A 5 9 5 rd 7 1 E rd B 0 erd 9 B 0 erd 8 B 0 erd 0 A 1 ers 0 erd A 0 erd 3 9 rs rd 9 3 rd W W L L L L L B B B — B B W W L L 8 rs rd STC.W CCR,@aa:16 STC.W EXR,@aa:16 STC.W CCR,@aa:32 STC.W EXR,@aa:32 STM*3 STM.L (ERn-ERn+1), @-SP STM.L (ERn-ERn+2), @-SP STM.L (ERn-ERn+3), @-SP STMAC STMAC MACL,ERd SUB SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd SUBS SUBS #2,ERd SUBS #4,ERd SUBX SUBX Rs,Rd TAS TRAPA TRAPA #x:2 XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd XOR TAS @ERd*2 SUBX #xx:8,Rd SUBS #1,ERd SUB.B Rs,Rd STMAC MACH,ERd STC
Instruction Format 10th Byte
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 955 of 1130 REJ09B0327-0400
Instruction Mnemonic Size 1st byte 0 0 1 4 1 0 5 IMM 5 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B XORC #xx:8,CCR XORC #xx:8,EXR XORC
Instruction Format 10th byte
Appendix A Instruction Set
Legend: IMM: abs: disp: rs, rd, rn: ers, erd, ern, erm: Notes: 1. Bit 7 of the 4th byte of the MOV.L ERs, @ (d:32, ERd) instruction can be either 0 or 1. 2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
Rev. 4.00 Sep 27, 2006 page 956 of 1130 REJ09B0327-0400
The correspondence between register fields and general registers is shown in the following table. Address Registers 32-Bit Registers 16-Bit Register Register Field 0000 0001 • • • 0111 1000 1001 • • • 1111 R0 R1 • • • R7 E0 E1 • • • E7 0000 0001 • • • 0111 1000 1001 • • • 1111 General Register Register Field Register Field 000 001 • • • 111 ER0 ER1 • • • ER7 General Register 8-Bit Register General Register R0H R1H • • • R7H R0L R1L • • • R7L
Immediate data (2, 3, 8, 16, or 32 bits) Absolute address (8, 16, 24, or 32 bits) Displacement (8, 16, or 32 bits) Register field (4 bits, indicating an 8-bit or 16-bit register. rs, rd, and rn correspond to operand formats Rs, Rd, and Rn, respectively.) Register field (3 bits, indicating an address register or 32-bit register. ers, erd, ern, and erm correspond to operand formats ERs, ERd, ERn, and ERm, respectively.)
A.3
Table A.3
Instruction when most significant bit of BH is 0. Instruction code: AH AL BH BL Instruction when most significant bit of BH is 1. 1st byte 2nd byte
AL AH 0 NOP Table A.3 (2) OR MOV.B 3 4 BRA MULXU OR MOV Table A.3 (2) XOR MOV AND BST BSET 7 8 ADD ADDX CMP SUBX OR XOR AND MOV 9 A B C D E F Note: * Cannot be used with this LSI. BNOT BCLR BTST DIVXU RTS TRAPA MULXU RTE DIVXU BSR Table A.3 (2) JMP BRN BCC BNE BEQ BVC BVS BPL BHI BLS BCS 5 6 BIST BOR BLD BXOR BAND BIOR BILD BIXOR BIAND BMI BGE BSR BLT XOR AND Table A.3 (2) SUB ORC XORC ANDC LDC ADD 1 2 MOV CMP 0 1 4 5 6 7 9 B C D A 8 2 3
E ADDX SUBX
F Table A.3 (2) Table A.3 (2)
Operation Code Map
Table A.3 shows the operation code map.
Operation Code Map (1)
LDC Table STC * * A.3 (2) STMAC LDMAC Table Table Table A.3 (2) A.3 (2) A.3 (2) Table A.3 (2) Table A.3 (2) Table A.3 (2) Table A.3 (2)
BGT JSR MOV Table A.3 (3)
BLE
Table A.3 (2) Table A.3 (2) EEPMOV
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 957 of 1130 REJ09B0327-0400
Table A.3
Instruction code: AH AL BH BL
1st byte
2nd byte
BH AH AL 01 MOV STM STC INC ADDS INC INC DAA SHLL SHLL SHLR ROTXL ROTXR EXTU EXTU ROTL ROTR NEG NEG SUB DEC DEC SUBS CMP BRN BHI BCS MOV CMP OR OR CMP SUB SUB Table A.3 (4) * MOVFPE XOR XOR AND AND BCC Table A.3 (4) ADD ADD BLS BNE BEQ BVC MOV BVS BPL MOV BMI BGE SHAR SHAL SHLR ROTXL ROTXR NOT DEC SUBS DAS BRA MOV MOV MOV NOT ROTXR ROTXL SHLR SHLL ADDS MOV SLEEP 0A 0B 0F 10 11 12 13 17 1A 1B 1F 58 6A 79 7A Note: * Cannot be used with this LSI. LDM LDC * MAC ADD * CLRMAC 0 5 7 6 B C 1 2 8 3 4 9 A
Appendix A Instruction Set
D Table A.3 (3)
E TAS
F Table A.3 (3)
Table A.3 (3)
Operation Code Map (2)
INC INC SHAL SHAL SHAR ROTL ROTR EXTS SHAR ROTL ROTR EXTS
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DEC DEC BLT * MOVTPE BGT BLE
Table A.3
Instruction code: AH AL BH BL CH CL DH DL
1st byte
2nd byte
3rd byte
4th byte
Instruction when most significant bit of DH is 0. Instruction when most significant bit of DH is 1.
CL
AH AL BH BL CH
0 MULXS DIVXS OR BTST BTST BSET BSET BTST BTST BSET BSET BNOT BCLR BNOT BCLR BNOT BCLR BNOT BCLR XOR AND DIVXS MULXS
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
01C05 01D05 01F06 7Cr06*1 7Cr07*1 7Dr06*1 7Dr07*1 7Eaa6*2 7Eaa7*2 7Faa6*2 7Faa7*2 Notes: 1. r is the register specification field. 2. aa is the absolute address specification. BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
Operation Code Map (3)
BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
Appendix A Instruction Set
Rev. 4.00 Sep 27, 2006 page 959 of 1130 REJ09B0327-0400
Table A.3
Instruction code: AH AL BH BL CH CL DH DL EH EL FH FL
1st byte
2nd byte
3rd byte
4th byte
5th byte
6th byte
Instruction when most significant bit of FH is 0. Instruction when most significant bit of FH is 1. EL
AHALBHBLCHCLDHDLEH
Appendix A Instruction Set
0 4 5 6 7 8 9 A B BTST
1
2
3
C
D
E
F
6A10aaaa6* 6A10aaaa7* 6A18aaaa6* BSET 6A18aaaa7* BNOT BCLR BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
Operation Code Map (4)
Rev. 4.00 Sep 27, 2006 page 960 of 1130 REJ09B0327-0400
Instruction code: AH AL BH BL CH CL DH DL EH EL 1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte FH FL 7th byte GH GL 8th byte HH HL Indicates case where MSB of HH is 0. Indicates case where MSB of HH is 1. GL
AHALBHBL ... FHFLGH
0 1 4 5 BTST 2 3
6
7
8
9
A
B
C
D
E
F
6A30aaaaaaaa6* 6A30aaaaaaaa7* 6A38aaaaaaaa6* BSET 6A38aaaaaaaa7* Note: * aa is the absolute address specification. BNOT BCLR BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
Appendix A Instruction Set
A.4
Number of States Required for Execution
The tables in this section can be used to calculate the number of states required for instruction execution by the H8S/2000 CPU. Table A.5 shows the number of instruction fetch, data read/write, and other cycles occurring in each instruction, and table A.4 shows the number of states required per cycle according to the bus size. The number of states required for execution of an instruction can be calculated from these two tables as follows:
Number of states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples of Calculation of Number of States Required for Execution Examples: Advanced mode, stack located in external address space, on-chip supporting modules accessed in two states with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. 1. BSET #0,@FFFFC7:8 From table A.5, I = L = 2 and J = K = M = N = 0 From table A.4, SI = 4 and SL = 2 Number of states = 2 × 4 + 2 × 2 = 12 2. JSR @@30 From table A.5, I = J = K = 2 and L = M = N = 0 From table A.4, SI = SJ= SK = 4 Number of states = 2 × 4 + 2 × 4 + 2 × 4 = 24
Rev. 4.00 Sep 27, 2006 page 961 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Table A.4
Number of States per Cycle
Access Conditions On-Chip Supporting Module External Device 8-Bit Bus 2-State 3-State Access Access 4 6 + 2m 16-Bit Bus 2-State 3-State Access Access 2 3+m
Cycle Instruction fetch Stack operation Byte data access Word data access Internal operation SI SK SL SM SN
On-Chip Memory 1
8-Bit Bus 4
16-Bit Bus 2
Branch address fetch SJ 2 4 1 1 1 2 4 1 3+m 6 + 2m 1 1 1
Legend: m: Number of wait states inserted into external device access
Rev. 4.00 Sep 27, 2006 page 962 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Table A.5
Number of Cycles per Instruction
Instruction Fetch I 1 1 2 1 3 1 1 1 1 1 1 2 1 3 2 1 2 1 2 2 3 4 2 2 2 2 (BHS d:8) (BLO d:8) 2 2 2 2 2 2 2 1 1 1 1 Branch Address Read J Stack Operation K Byte Data Access L Word Data Access M Internal Operation N
Instruction Mnemonic ADD ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDS ADDX ADDS #1/2/4,ERd ADDX #xx:8,Rd ADDX Rs,Rd AND AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd ANDC ANDC #xx:8,CCR ANDC #xx:8,EXR BAND BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 Bcc BRA d:8 BRN d:8 BHI d:8 BLS d:8 BCC d:8 BCS d:8 BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 (BT d:8) (BF d:8)
Rev. 4.00 Sep 27, 2006 page 963 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic Bcc BMI d:8 BGE d:8 BLT d:8 BGT d:8 BLE d:8 BRA d:16 BRN d:16 BHI d:16 BLS d:16 BCC d:16 BCS d:16 BNE d:16 BEQ d:16 BVC d:16 BVS d:16 BPL d:16 BMI d:16 BGE d:16 BLT d:16 BGT d:16 BLE d:16 BCLR BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 (BHS d:16) (BLO d:16) (BT d:16) (BF d:16)
Instruction Fetch I 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
2 2 2 2
2 2 2 2
1 1 1 1
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Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic BILD BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR BIOR #xx:8,Rd BIOR #xx:8,@ERd BIOR #xx:8,@aa:8 BIOR #xx:8,@aa:16 BIOR #xx:8,@aa:32 BIST BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT BNOT #xx:3,Rd BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32
Instruction Fetch I 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
1 1 1 1
1 1 1 1
2 2 2 2
1 1 1 1
1 1 1 1
2 2 2 2
2 2 2 2
Rev. 4.00 Sep 27, 2006 page 965 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic BOR BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BSR BSR d:8 Normal Advanced BSR d:16 Normal Advanced BST BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 BTST BTST #xx:3,Rd BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32
Instruction Fetch I 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 2 2 2 2 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
1 1 1 1
2 2 2 2
2 2 2 2 1 2 1 2 1 1
2 2 2 2
1 1 1 1
1 1 1 1
Rev. 4.00 Sep 27, 2006 page 966 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic BXOR BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 CLRMAC CMP CLRMAC CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA DAS DEC DAA Rd DAS Rd DEC.B Rd DEC.W #1/2,Rd DEC.L #1/2,ERd DIVXS DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU DIVXU.B Rs,Rd DIVXU.W Rs,ERd EEPMOV EEPMOV.B EEPMOV.W EXTS EXTS.W Rd EXTS.L ERd EXTU EXTU.W Rd EXTU.L ERd INC INC.B Rd INC.W #1/2,Rd INC.L #1/2,ERd JMP JMP @ERn JMP @aa:24 JMP @@aa:8 Normal Advanced
Instruction Fetch I 1 2 2 3 4
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
1 1 1 1
Cannot be used with this LSI. 1 1 2 1 3 1 1 1 1 1 1 2 2 1 1 2 2 1 1 1 1 1 1 1 2 2 2 2 1 2 1 1 1
2 2n+2*
11 19 11 19
2n+2*2
Rev. 4.00 Sep 27, 2006 page 967 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic JSR JSR @ERn Normal Advanced JSR @aa:24 Normal Advanced JSR @@aa:8 Normal Advanced LDC LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR
4 LDM*
Instruction Fetch I 2 2 2 2 2 2 1 2 1 1 2 2 3 3 5 5 2 2 3 3 4 4 2 2 2
Stack Operation K 1 2 1 2
Byte Data Access L
Word Data Access M
Internal Operation N
1 1
1 2
1 2
1 1 1 1 1 1 1 1 1 1 1 1 4 6 8 1 1 1 1 1
LDM.L @SP+, (ERn-ERn+1) LDM.L @SP+, (ERn-ERn+2) LDM.L @SP+, (ERn-ERn+3)
LDMAC
LDMAC ERs, MACH LDMAC ERs, MACL
Cannot be used with this LSI.
MAC MOV
MAC @ERn+, @ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd 1 1 1 2 4 1 1 2 1 1 1 1 1 1 1
Rev. 4.00 Sep 27, 2006 page 968 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic MOV MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16,ERd MOV.L @aa:32,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd) MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32
Instruction Fetch I 3 1 2 4 1 1 2 3 2 1 1 2 4 1 2 3 1 2 4 1 2 3 3 1 2 3 5 2 3 4 2 3 5 2 3 4
Stack Operation K
Byte Data Access L 1 1 1 1 1 1 1 1
Word Data Access M
Internal Operation N
1
1 1 1 1 1 1 1 1 1 1 1 1 1 1
2 2 2 2 2 2 2 2 2 2 2 2 1 1
Rev. 4.00 Sep 27, 2006 page 969 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic MOVFPE MOVTPE MULXS MOVFPE @:aa:16,Rd MOVTPE Rs,@:aa:16 MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU MULXU.B Rs,Rd MULXU.W Rs,ERd NEG NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT NOP NOT.B Rd NOT.W Rd NOT.L ERd OR OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC ORC #xx:8,CCR ORC #xx:8,EXR POP POP.W Rn POP.L ERn PUSH PUSH.W Rn PUSH.L ERn ROTL ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd
Instruction Fetch I
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
Cannot be used with this LSI.
2 2 1 1 1 1 1 1 1 1 1 1 1 2 1 3 2 1 2 1 2 1 2 1 1 1 1 1 1 1 2 1 2
11 19 11 19
1 1 1 1
Rev. 4.00 Sep 27, 2006 page 970 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic ROTR ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd ROTXL ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd ROTXR ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd RTE RTS RTE RTS Normal Advanced SHAL SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd
Instruction Fetch I 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
2/3*1 1 2
1 1 1
Rev. 4.00 Sep 27, 2006 page 971 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic SHLL SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd SHLR SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd SLEEP STC SLEEP STC.B CCR,Rd STC.B EXR,Rd STC.W CCR,@ERd STC.W EXR,@ERd STC.W CCR,@(d:16,ERd) STC.W EXR,@(d:16,ERd) STC.W CCR,@(d:32,ERd) STC.W EXR,@(d:32,ERd) STC.W CCR,@-ERd STC.W EXR,@-ERd STC.W CCR,@aa:16 STC.W EXR,@aa:16 STC.W CCR,@aa:32 STC.W EXR,@aa:32
4 STM*
Instruction Fetch I 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 3 3 5 5 2 2 3 3 4 4 2 2 2 1 2 1 3 1
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
1
1 1 1 1 1 1 1 1 1 1 1 1 4 6 8 1 1 1 1 1
STM.L (ERn-ERn+1),@-SP STM.L (ERn-ERn+2),@-SP STM.L (ERn-ERn+3),@-SP
SUB
SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd
Rev. 4.00 Sep 27, 2006 page 972 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Branch Address Read J
Instruction Mnemonic SUBS SUBX SUBS #1/2/4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS TRAPA
3 TAS @ERd*
Instruction Fetch I 1 1 1 2 Normal Advanced 2 2 1 1 2 1 3 2 1 2
Stack Operation K
Byte Data Access L
Word Data Access M
Internal Operation N
2 1 2
1 2/3* 1 2/3*
TRAPA #x:2
2 2
XOR
XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd
XORC
XORC #xx:8,CCR XORC #xx:8,EXR
Notes: 1. 2. 3. 4.
2 when EXR is invalid, 3 when valid. When n bytes of data are transferred. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
Rev. 4.00 Sep 27, 2006 page 973 of 1130 REJ09B0327-0400
Appendix A Instruction Set
A.5
Bus States during Instruction Execution
Table A.6 indicates the types of cycles that occur during instruction execution by the CPU. See table A.4 for the number of states per cycle. How to Read the Table:
Order of execution
Instruction JMP@aa:24 1 R:W 2nd 2 Internal operation, 2 state 3 R:W EA 4 5 6 7 8
End of instruction Read effective address (word-size read) No read or write Read 2nd word of current instruction (word-size read)
Legend:
R:B R:W W:B W:W :M 2nd 3rd 4th 5th NEXT EA VEC Byte-size read Word-size read Byte-size write Word-size write Transfer of the bus is not performed immediately after this cycle Address of 2nd word (3rd and 4th bytes) Address of 3rd word (5th and 6th bytes) Address of 4th word (7th and 8th bytes) Address of 5th word (9th and 10th bytes) Start address of instruction following executing instruction Effective address Vector address
Rev. 4.00 Sep 27, 2006 page 974 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Figure A.1 shows timing waveforms for the address bus and the RD, HWR, and LWR signals during execution of the above instruction with an 8-bit bus, using three-state access with no wait states.
φ Address bus RD HWR, LWR High level
R:W 2nd
Internal operation
R:W EA
Fetching 3rd byte of instruction
Fetching 4th byte of instruction
Fetching 1st byte Fetching 2nd byte of branch of branch instruction instruction
Figure A.1 Address Bus, RD, HWR, and LWR Timing RD HWR LWR (8-Bit Bus, Three-State Access, No Wait States)
Rev. 4.00 Sep 27, 2006 page 975 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Table A.6
Instruction ADD.B #xx:8,Rd ADD.B Rs,Rd
Instruction Execution Cycle
1 R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 3rd R:W NEXT R:W NEXT 2 3 4 5 6 7 8 9
ADD.W #xx:16,Rd ADD.W Rs,Rd
ADD.L #xx:32,ERd R:W 2nd ADD.L ERs,ERd ADDS #1/2/4,ERd ADDX #xx:8,Rd ADDX Rs,Rd AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT
R:W NEXT
AND.L #xx:32,ERd R:W 2nd AND.L ERs,ERd ANDC #xx:8,CCR ANDC #xx:8,EXR BAND #xx:3,Rd R:W 2nd R:W NEXT R:W 2nd R:W NEXT
R:W 3rd R:W NEXT
R:W NEXT
R:W NEXT
BAND #xx:3,@ERd R:W 2nd BAND #xx:3,@aa:8 R:W 2nd BAND #xx:3, @aa:16 BAND #xx:3, @aa:32 BRA d:8 BRN d:8 BHI d:8 BLS d:8 R:W 2nd R:W 2nd
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
(BT d:8) R:W NEXT R:W EA (BF d:8) R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA
BCC d:8 (BHS d:8) R:W NEXT R:W EA BCS d:8 (BLO d:8) R:W NEXT R:W EA BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA
Rev. 4.00 Sep 27, 2006 page 976 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction BMI d:8 BGE d:8 BLT d:8 BGT d:8 BLE d:8 1 2 3 4 5 6 7 8 9
R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT R:W EA Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state
BRA d:16 (BT d:16) R:W 2nd
BRN d:16 (BF d:16) R:W 2nd
BHI d:16
R:W 2nd
BLS d:16
R:W 2nd
BCC d:16 (BHS d:16) BCS d:16 (BLO d:16) BNE d:16
R:W 2nd
R:W 2nd
R:W 2nd
BEQ d:16
R:W 2nd
BVC d:16
R:W 2nd
BVS d:16
R:W 2nd
BPL d:16
R:W 2nd
BMI d:16
R:W 2nd
BGE d:16
R:W 2nd
Rev. 4.00 Sep 27, 2006 page 977 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction BLT d:16 1 R:W 2nd 2 3 4 5 6 7 8 9
Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state Internal R:W EA operation, 1 state
BGT d:16
R:W 2nd
BLE d:16
R:W 2nd
BCLR #xx:3,Rd
R:W NEXT R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd W:B EA W:B EA W:B EA W:B EA
BCLR #xx:3,@ERd R:W 2nd BCLR #xx:3,@aa:8 R:W 2nd BCLR#xx:3,@aa:16 R:W 2nd BCLR#xx:3,@aa:32 R:W 2nd BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND #xx:3,Rd BIAND #xx:3, @ERd BIAND #xx:3, @aa:8 BIAND #xx:3, @aa:16 BIAND #xx:3, @aa:32 BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
W:B EA W:B EA W:B EA W:B EA
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
R:B EA R:B EA R:W 3rd
R:W:M NEXT R:W:M NEXT R:B: EA R:W:M NEXT
BILD #xx:3,@aa:16 R:W 2nd
Rev. 4.00 Sep 27, 2006 page 978 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction 1 2 R:W 3rd 3 R:W 4th 4 R:B EA 5 R:W:M NEXT 6 7 8 9
BILD #xx:3,@aa:32 R:W 2nd BIOR #xx:3,Rd R:W NEXT
BIOR #xx:3,@ERd R:W 2nd BIOR #xx:3,@aa:8 R:W 2nd BIOR #xx:3,@aa:16 R:W 2nd BIOR #xx:3,@aa:32 R:W 2nd BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 R:W NEXT R:W 2nd R:W 2nd
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
W:B EA W:B EA W:B EA W:B EA
BIST #xx:3,@aa:16 R:W 2nd BIST #xx:3,@aa:32 R:W 2nd BIXOR #xx:3,Rd BIXOR #xx:3, @ERd BIXOR #xx:3, @aa:8 BIXOR #xx:3, @aa:16 BIXOR #xx:3, @aa:32 BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
BLD #xx:3,@aa:16 R:W 2nd BLD #xx:3,@aa:32 R:W 2nd BNOT #xx:3,Rd R:W NEXT
BNOT #xx:3,@ERd R:W 2nd
R:B:M EA R:W:M NEXT
W:B EA
Rev. 4.00 Sep 27, 2006 page 979 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction 1 2 3 4 W:B EA W:B EA W:B EA 5 6 7 8 9
BNOT #xx:3,@aa:8 R:W 2nd BNOT #xx:3, @aa:16 BNOT #xx:3, @aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd
R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
W:B EA W:B EA W:B EA W:B EA
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W NEXT
BOR #xx:3,@aa:16 R:W 2nd BOR #xx:3,@aa:32 R:W 2nd BSET #xx:3,Rd R:W NEXT
BSET #xx:3,@ERd R:W 2nd BSET #xx:3,@aa:8 R:W 2nd BSET #xx:3, @aa:16 BSET #xx:3, @aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd
R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
W:B EA W:B EA W:B EA W:B EA
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd
W:B EA W:B EA W:B EA W:B EA
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
Rev. 4.00 Sep 27, 2006 page 980 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction BSR d:8 BSR d:16 1 2 3 W:W:M Stack (H) 4 W:W Stack (L) W:W:M Stack (H) W:W Stack (L) 5 6 7 8 9
Advanced R:W NEXT R:W EA Advanced R:W 2nd
Internal R:W EA operation, 1 state
BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8
R:W NEXT R:W 2nd R:W 2nd R:B:M EA R:W:M NEXT R:B:M EA R:W:M NEXT R:W 3rd R:W 3rd W:B EA W:B EA W:B EA W:B EA
BST #xx:3,@aa:16 R:W 2nd BST #xx:3,@aa:32 R:W 2nd BTST #xx:3,Rd R:W NEXT
R:B:M EA R:W:M NEXT R:W 4th
R:B:M EA R:W:M NEXT
BTST #xx:3,@ERd R:W 2nd BTST #xx:3,@aa:8 R:W 2nd BTST #xx:3, @aa:16 BTST #xx:3, @aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR #xx:3,Rd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
BXOR #xx:3,@ERd R:W 2nd BXOR #xx:3,@aa:8 R:W 2nd BXOR #xx:3, @aa:16 BXOR #xx:3, @aa:32 CLRMAC R:W 2nd R:W 2nd
R:B EA R:B EA R:W 3rd R:W 3rd
R:W:M NEXT R:W:M NEXT R:B EA R:W 4th R:W:M NEXT R:B EA R:W:M NEXT
Cannot be used in this LSI
Rev. 4.00 Sep 27, 2006 page 981 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd 1 R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 3rd R:W NEXT R:W NEXT 2 3 4 5 6 7 8 9
CMP.L #xx:32,ERd R:W 2nd CMP.L ERs,ERd DAA Rd DAS Rd DEC.B Rd DEC.W #1/2,Rd DEC.L #1/2,ERd DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU.B Rs,Rd DIVXU.W Rs,ERd EEPMOV.B EEPMOV.W EXTS.W Rd EXTS.L ERd EXTU.W Rd EXTU.L ERd INC.B Rd INC.W #1/2,Rd INC.L #1/2,ERd JMP @ERn JMP @aa:24 R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd
R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states
R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W EA R:W 2nd Internal R:W EA operation, 1 state R:W aa:8 Internal R:W EA operation, 1 state W:W Stack (L) W:W:M Stack (H) W:W:M Stack (H) W:W Stack (L) W:W Stack (L) R:W EA R:B EAs*1 R:B EAd*1 R:B EAs*2 W:B EAd*2 R:W NEXT R:B EAs*1 R:B EAd*1 R:B EAs*2 W:B EAd*2 R:W NEXT
← Repeated n times*2 →
JMP Advanced R:W NEXT R:W:M @@aa:8 aa:8 JSR @ERn Advanced R:W NEXT R:W EA
W:W:M Stack (H)
JSR Advanced R:W 2nd @aa:24
Internal R:W EA operation, 1 state R:W aa:8
JSR Advanced R:W NEXT R:W:M @@aa:8 aa:8
Rev. 4.00 Sep 27, 2006 page 982 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC@(d:16,ERs), CCR LDC@(d:16,ERs), EXR LDC@(d:32,ERs), CCR LDC@(d:32,ERs), EXR LDC @ERs+,CCR 1 R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W EA R:W NEXT R:W EA R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W NEXT R:W EA R:W NEXT R:W EA R:W 4th R:W 4th R:W 5th R:W 5th R:W NEXT R:W EA R:W NEXT R:W EA R:W NEXT 2 3 4 5 6 7 8 9
R:W NEXT Internal R:W EA operation, 1 state R:W NEXT Internal R:W EA operation, 1 state R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W:M NEXT R:W:M NEXT R:W:M NEXT R:W NEXT R:W EA R:W NEXT R:W EA R:W 4th R:W 4th R:W NEXT R:W EA R:W NEXT R:W EA
LDC @ERs+,EXR
R:W 2nd
LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR LDM.L @SP+, (ERn-ERn+1)*9 LDM.L @SP+, (ERn-ERn+2)*9 LDM.L @SP+, (ERn-ERn+3)*9
R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd
Internal R:W:M R:W operation, Stack (H)*3 Stack (L)*3 1 state Internal R:W:M R:W operation, Stack (H)*3 Stack (L)*3 1 state Internal R:W:M R:W operation, Stack (H)*3 Stack (L)*3 1 state
R:W 2nd
R:W 2nd
LDMAC ERs,MACH Cannot be used in this LSI LDMAC ERs,MACL MAC @ERn+, @ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd R:W NEXT R:W NEXT R:W NEXT R:B EA R:W 2nd R:W NEXT R:B EA
Rev. 4.00 Sep 27, 2006 page 983 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction MOV.B @(d:32,ERs),Rd 1 R:W 2nd 2 R:W 3rd 3 R:W 4th 4 5 6 7 8 9
R:W NEXT R:B EA
MOV.B @ERs+,Rd R:W NEXT Internal R:B EA operation, 1 state MOV.B @aa:8,Rd R:W NEXT R:B EA R:W NEXT R:B EA R:W 3rd R:W NEXT R:B EA
MOV.B @aa:16,Rd R:W 2nd MOV.B @aa:32,Rd R:W 2nd MOV.B Rs,@ERd MOV.B Rs, @(d:16,ERd) MOV.B Rs, @(d:32,ERd) MOV.B Rs,@-ERd
R:W NEXT W:B EA R:W 2nd R:W 2nd R:W NEXT W:B EA R:W 3rd R:W 4th R:W NEXT W:B EA
R:W NEXT Internal W:B EA operation, 1 state R:W NEXT W:B EA R:W NEXT W:B EA R:W 3rd R:W NEXT R:W NEXT W:B EA
MOV.B Rs,@aa:8
MOV.B Rs,@aa:16 R:W 2nd MOV.B Rs,@aa:32 R:W 2nd MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd R:W 2nd R:W NEXT
R:W NEXT R:W EA R:W 2nd R:W 2nd R:W NEXT R:W EA R:W 3rd R:W 4th R:W NEXT R:W EA
MOV.W @ERs+,Rd R:W NEXT Internal R:W EA operation, 1 state MOV.W @aa:16,Rd R:W 2nd MOV.W @aa:32,Rd R:W 2nd MOV.W Rs,@ERd MOV.W Rs, @(d:16,ERd) MOV.W Rs, @(d:32,ERd) R:W NEXT R:W EA R:W 3rd R:W NEXT R:B EA
R:W NEXT W:W EA R:W 2nd R:W 2nd R:W NEXT W:W EA R:W 3rd R:W 4th R:W NEXT W:W EA
MOV.W Rs,@-ERd R:W NEXT Internal W:W EA operation, 1 state MOV.W Rs,@aa:16 R:W 2nd MOV.W Rs,@aa:32 R:W 2nd R:W NEXT W:W EA R:W 3rd R:W NEXT W:W EA
Rev. 4.00 Sep 27, 2006 page 984 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction 1 2 R:W 3rd 3 R:W NEXT 4 5 6 7 8 9
MOV.L #xx:32,ERd R:W 2nd MOV.L ERs,ERd R:W NEXT
MOV.L @ERs,ERd R:W 2nd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+, ERd MOV.L @aa:16, ERd MOV.L @aa:32, ERd R:W 2nd R:W 2nd R:W 2nd
R:W:M NEXT
R:W:M EA R:W EA+2
R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2 R:W:M 3rd R:W:M 4th R:W 5th R:W:M NEXT R:W NEXT R:W:M EA R:W EA+2
Internal R:W:M EA R:W EA+2 operation, 1 state
R:W 2nd R:W 2nd
R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2 R:W:M 3rd R:W 4th R:W:M NEXT R:W NEXT R:W:M EA R:W EA+2
MOV.L ERs,@ERd R:W 2nd MOV.L ERs, @(d:16,ERd) MOV.L ERs, @(d:32,ERd) R:W 2nd R:W 2nd
W:W:M EA W:W EA+2
R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2 R:W:M 3rd R:W:M 4th R:W 5th R:W:M NEXT R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,@-ERd R:W 2nd
Internal W:W:M EA W:W EA+2 operation, 1 state
MOV.L ERs, @aa:16 MOV.L ERs, @aa:32 MOVFPE @aa:16,Rd MOVTPE Rs,@aa:16 MULXS.B Rs,Rd
R:W 2nd R:W 2nd
R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2 R:W:M 3rd R:W 4th R:W NEXT W:W:M EA W:W EA+2
Cannot be used in this LSI
R:W 2nd
R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states
MULXS.W Rs,ERd R:W 2nd MULXU.B Rs,Rd
R:W NEXT Internal operation, 11 states
MULXU.W Rs,ERd R:W NEXT Internal operation, 19 states NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT.B Rd NOT.W Rd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT
Rev. 4.00 Sep 27, 2006 page 985 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction NOT.L ERd OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC #xx:8,CCR ORC #xx:8,EXR POP.W Rn 1 R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:W NEXT 2 3 4 5 6 7 8 9
R:W NEXT Internal R:W EA operation, 1 state R:W 2nd R:W:M NEXT Internal R:W:M EA R:W EA+2 operation, 1 state
POP.L ERn
PUSH.W Rn
R:W NEXT Internal W:W EA operation, 1 state R:W 2nd R:W:M NEXT Internal W:W:M EA W:W EA+2 operation, 1 state
PUSH.L ERn
ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd
R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT
Rev. 4.00 Sep 27, 2006 page 986 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction ROTXL.L #2,ERd ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd RTE 1 R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W Stack (EXR) Advanced R:W NEXT R:W:M Stack (H) R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W Stack (H) R:W Stack (L) R:W Stack (L) Internal R:W* operation, 1 state
4 4
2
3
4
5
6
7
8
9
RTS
Internal R:W* operation, 1 state
SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd
Rev. 4.00 Sep 27, 2006 page 987 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction SLEEP 1 2 3 4 5 6 7 8 9
R:W NEXT Internal operation :M R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT W:W EA R:W NEXT W:W EA R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W NEXT W:W EA R:W NEXT W:W EA R:W 4th R:W 4th R:W 5th R:W 5th R:W NEXT W:W EA R:W NEXT W:W EA
STC CCR,Rd STC EXR,Rd STC CCR,@ERd STC EXR,@ERd STC CCR, @(d:16,ERd) STC EXR, @(d:16,ERd) STC CCR, @(d:32,ERd) STC EXR, @(d:32,ERd) STC CCR,@-ERd
R:W NEXT Internal W:W EA operation, 1 state R:W NEXT Internal W:W EA operation, 1 state R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W:M NEXT R:W:M NEXT R:W:M NEXT R:W NEXT W:W EA R:W NEXT W:W EA R:W 4th R:W 4th R:W NEXT W:W EA R:W NEXT W:W EA W:W Stack (L) *3 W:W Stack (L) *3 W:W Stack (L) *3
STC EXR,@-ERd
R:W 2nd
STC CCR,@aa:16 STC EXR,@aa:16 STC CCR,@aa:32 STC EXR,@aa:32 STM.L (ERn-ERn+1), @-SP*9 STM.L (ERn-ERn+2), @-SP*9 STM.L (ERn-ERn+3), @-SP*9
R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd
Internal W:W:M operation, Stack (H) *3 1 state Internal W:W:M operation, Stack (H) *3 1 state Internal W:W:M operation, Stack (H) *3 1 state
R:W 2nd
R:W 2nd
STMAC MACH,ERd Cannot be used in this LSI STMAC MACL,ERd SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd R:W NEXT R:W 2nd R:W NEXT R:W 3rd R:W NEXT R:W NEXT
SUB.L #xx:32,ERd R:W 2nd SUB.L ERs,ERd R:W NEXT
Rev. 4.00 Sep 27, 2006 page 988 of 1130 REJ09B0327-0400
Appendix A Instruction Set
Instruction SUBS #1/2/4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS @ERd*8 1 R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:B:M EA W:B EA W:W Stack (H) W:W Stack (EXR) R:W:M VEC R:W VEC+2 Internal R:W* operation, 1 state
7
2
3
4
5
6
7
8
9
TRAPA Advanced R:W NEXT Internal W:W #x:2 operation, Stack (L) 1 state XOR.B #xx8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:W NEXT
XOR.L #xx:32,ERd R:W 2nd XOR.L ERs,ERd XORC #xx:8,CCR XORC #xx:8,EXR R:W 2nd R:W NEXT R:W 2nd
R:W NEXT R:W VEC+2 Internal R:W*5 operation, 1 state W:W Stack (H) W:W Stack (EXR) R:W:M VEC R:W VEC+2 Internal R:W*7 operation, 1 state
Reset Advanced R:W:M excepVEC tion handling Interrupt Advanced R:W*6 exception handling
Internal W:W operation, Stack (L) 1 state
Notes: 1. EAs is the contents of ER5. EAd is the contents of ER6. 2. EAs is the contents of ER5. EAd is the contents of ER6. Both registers are incremented by 1 after execution of the instruction. n is the initial value of R4L or R4. If n = 0, these bus cycles are not executed. 3. Repeated two times to save or restore two registers, three times for three registers, or four times for four registers. 4. Start address after return. 5. Start address of the program. 6. Prefetch address, equal to two plus the PC value pushed onto the stack. In recovery from sleep mode or software standby mode the read operation is replaced by an internal operation. 7. Start address of the interrupt-handling routine. 8. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 9. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
Rev. 4.00 Sep 27, 2006 page 989 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Appendix B Internal I/O Registers
B.1 Addresses
Bit 7 SM1 Bit 6 SM0 Bit 5 DM1 Bit 4 DM0 Bit 3 MD1 Bit 2 MD0 Bit 1 DTS Bit 0 Sz Module Name DTC Bus Width 16/32*
Register Address Name H'EC00 to H'EFFF MRA SAR
MRB DAR
CHNE
DISEL
—
—
—
—
—
—
CRA
CRB
H'FE80 H'FE84 H'FE85 H'FE86
HICR2 IDR3 ODR3 STR3
— IDR7 ODR7 DBU IDR7 ODR7 DBU KBIOE KBE KB7 KBIOE KBE KB7 KBIOE KBE KB7
— IDR6 ODR6 DBU IDR6 ODR6 DBU KCLKI KCLKO KB6 KCLKI KCLKO KB6 KCLKI KCLKO KB6 IrCKS2
— IDR5 ODR5 DBU IDR5 ODR5 DBU KDI KDO KB5 KDI KDO KB5 KDI KDO KB5 IrCKS1
— IDR4 ODR4 DBU IDR4 ODR4 DBU
— IDR3 ODR3 C/D IDR3 ODR3 C/D
IBFIE4 IDR2 ODR2 DBU IDR2 ODR2 DBU KBF RXCR2 KB2 KBF RXCR2 KB2 KBF RXCR2 KB2 KBCH2
IBFIE3 IDR1 ODR1 IBF IDR1 ODR1 IBF PER RXCR1 KB1 PER RXCR1 KB1 PER RXCR1 KB1 KBCH1
— IDR0 ODR0 OBF IDR0 ODR0 OBF KBS RXCR0 KB0 KBS RXCR0 KB0 KBS RXCR0 KB0 KBCH0
HIF
8
H'FE8C IDR4 H'FE8D ODR4 H'FE8E STR4
H'FED8 KBCRH0 H'FED9 KBCRL0 H'FEDA KBBR0 H'FEDC KBCRH1 H'FEDD KBCRL1 H'FEDE KBBR1 H'FEE0 H'FEE1 H'FEE2 H'FEE4 KBCRH2 KBCRL2 KBBR2
KBFSEL KBIE — KB4 RXCR3 KB3
Keyboard 8 buffer controller
KBFSEL KBIE — KB4 RXCR3 KB3
KBFSEL KBIE — KB4 IrCKS0 RXCR3 KB3 KBADE
KBCOMP IrE
IrDA/ 8 expansion A/D IIC0 8
H'FEE6
DDCSWR SWE
SW
IE
IF
CLR3
CLR2
CLR1
CLR0
Rev. 4.00 Sep 27, 2006 page 990 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FEE8 H'FEE9 ICRA ICRB Module Name Interrupt controller Bus Width 8
Bit 7 ICR7 ICR7 ICR7 IRQ7F
Bit 6 ICR6 ICR6 ICR6 IRQ6F
Bit 5 ICR5 ICR5 ICR5 IRQ5F
Bit 4 ICR4 ICR4 ICR4 IRQ4F
Bit 3 ICR3 ICR3 ICR3 IRQ3F
Bit 2 ICR2 ICR2 ICR2 IRQ2F
Bit 1 ICR1 ICR1 ICR1 IRQ1F
Bit 0 ICR0 ICR0 ICR0 IRQ0F
H'FEEA ICRC H'FEEB ISR H'FEEC ISCRH H'FEED ISCRL H'FEEE DTCERA H'FEEF DTCERB H'FEF0 H'FEF1 H'FEF2 H'FEF3 H'FEF4 H'FEF5 H'FEF6 H'FEF7 H'FF80 H'FF81 H'FF82 DTCERC DTCERD DTCERE DTVECR ABRKCR BARA BARB BARC FLMCR1 FLMCR2 PCSR EBR1 H'FF83 SYSCR2 EBR2 H'FF84 H'FF85 H'FF86 H'FF87 H'FF88 SBYCR
IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA DTCEA7 DTCEA6 DTCEA5 DTCEA4 DTCEA3 DTCEA2 DTCEA1 DTCEA0 DTCEB7 DTCEB6 DTCEB5 DTCEB4 DTCEB3 DTCEB2 DTCEB1 DTCEB0 DTCEC7 DTCEC6 DTCEC5 DTCEC4 DTCEC3 DTCEC2 DTCEC1 DTCEC0 DTCED7 DTCED6 DTCED5 DTCED4 DTCED3 DTCED2 DTCED1 DTCED0 DTCEE7 DTCEE6 DTCEE5 DTCEE4 DTCEE3 DTCEE2 DTCEE1 DTCEE0 SWDTE CMF A23 A15 A7 FWE FLER — — KWUL1 EB7 SSBY DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 — A22 A14 A6 SWE — — — KWUL0 EB6 STS2 LSON — A21 A13 A5 — — — — P6PUE EB5 STS1 NESEL — A20 A12 A4 — — — — — EB4 STS0 EXCLE — A19 A11 A3 EV — — — SDE EB3 — — — A18 A10 A2 PV — PWCKB — CS4E EB2 SCK2 — — A17 A9 A1 E ESU PWCKA EB9/— CS3E EB1 SCK1 — BIE A16 A8 — P PSU — EB8/— HI12E EB0 SCK0 — MSTP8 MSTP0 CKS0 SCP SCI1 IIC1 SCI1 ESTP TIE STOP RIE IRTR TE AASX RE AL MPIE AAS TEIE ADZ CKE1 ACKB CKE0 IIC1 SCI1 8 8 8 PWM FLASH HIF FLASH SYSTEM 8 8 8 8 8 FLASH 8 Interrupt controller 8 DTC 8
LPWRCR DTON
MSTPCRH MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTPCRL MSTP7 SMR1 ICCR1 C/A ICE MSTP6 CHR IEIC MSTP5 PE MST MSTP4 O/E TRS MSTP3 STOP ACKE MSTP2 MP BBSY MSTP1 CKS1 IRIC
H'FF89
BRR1 ICSR1
H'FF8A H'FF8B H'FF8C H'FF8D
SCR1 TDR1 SSR1 RDR1
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
Rev. 4.00 Sep 27, 2006 page 991 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FF8E SCMR1 ICDR1 SARX1 H'FF8F ICMR1 SAR1 H'FF90 H'FF91 H'FF92 H'FF93 H'FF94 TIER TCSR FRCH FRCL OCRAH OCRBH H'FF95 OCRAL OCRBL H'FF96 H'FF97 H'FF98 TCR TOCR ICRAH OCRARH H'FF99 ICRAL OCRARL H'FF9A ICRBH OCRAFH H'FF9B ICRBL OCRAFL H'FF9C ICRCH OCRDMH 0 H'FF9D ICRCL OCRDML H'FF9E H'FF9F H'FFA0 ICRDH ICRDL SMR2 DADRAH DACR H'FFA1 BRR2 DADRAL DA5 DA4 DA3 DA2 DA1 DA0 CFS — C/A DA13 TEST CHR DA12 PWME PE DA11 — O/E DA10 — STOP DA9 OEB MP DA8 OEA CKS1 DA7 OS CKS0 DA6 CKS SCI2 PWMX 8 SCI2 PWMX 8 0 0 0 0 0 0 0 IEDGA IEDGB IEDGC IEDGD OCRS BUFEA OEA BUFEB OEB CKS1 OLVLA CKS0 OLVLB Module Name SCI1 IIC1 Bus Width 8 8
Bit 7 — ICDR7 SVAX6 MLS SVA6 ICIAE ICFA
Bit 6 — ICDR6 SVAX5 WAIT SVA5 ICIBE ICFB
Bit 5 — ICDR5 SVAX4 CKS2 SVA4 ICICE ICFC
Bit 4 — ICDR4 SVAX3 CKS1 SVA3 ICIDE ICFD
Bit 3 SDIR ICDR3 SVAX2 CKS0 SVA2 OCIAE OCFA
Bit 2 SINV ICDR2 SVAX1 BC2 SVA1 OCIBE OCFB
Bit 1 — ICDR1 SVAX0 BC1 SVA0 OVIE OVF
Bit 0 SMIF ICDR0 FSX BC0 FS — CCLRA
FRT
16
ICRDMS OCRAMS ICRS
Rev. 4.00 Sep 27, 2006 page 992 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FFA2 H'FFA3 H'FFA4 H'FFA5 H'FFA6 SCR2 TDR2 SSR2 RDR2 SCMR2 DADRBH DACNTH H'FFA7 DADRBL DACNTL H'FFA8 TCSR0 TCNT0 (write) H'FFA9 TCNT0 (read) PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR PA7PIN PA6PIN PA5PIN PA4PIN PA3PIN PA2PIN PA1PIN PA0PIN Ports 8 OVF WT/IT TME RSTS RST/NMI CKS2 DA5 DA4 DA3 DA2 DA1 DA0 CFS — CKS1 REGS REGS CKS0 WDT0 16 — DA13 — DA12 — DA11 — DA10 SDIR DA9 SINV DA8 — DA7 SMIF DA6 PWMX 8 TDRE RDRF ORER FER PER TEND MPB MPBT Module Name SCI2 Bus Width 8
Bit 7 TIE
Bit 6 RIE
Bit 5 TE
Bit 4 RE
Bit 3 MPIE
Bit 2 TEIE
Bit 1 CKE1
Bit 0 CKE0
H'FFAA PAODR H'FFAB PAPIN (read) PADDR (write) H'FFAC P1PCR H'FFAD P2PCR H'FFAE P3PCR H'FFB0 H'FFB1 H'FFB2 H'FFB3 H'FFB4 H'FFB5 H'FFB6 H'FFB7 H'FFB8 H'FFB9 P1DDR P2DDR P1DR P2DR P3DDR P4DDR P3DR P4DR P5DDR P6DDR
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR P17PCR P16PCR P15PCR P14PCR P13PCR P12PCR P11PCR P10PCR P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR P37PCR P36PCR P35PCR P34PCR P33PCR P32PCR P31PCR P30PCR P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR P17DR P27DR P16DR P26DR P15DR P25DR P14DR P24DR P13DR P23DR P12DR P22DR P11DR P21DR P10DR P20DR
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR P37DR P47DR — P36DR P46DR — P35DR P45DR — P34DR P44DR — P33DR P43DR — P32DR P42DR P31DR P41DR P30DR P40DR
P52DDR P51DDR P50DDR
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR — P67DR — P66DR — P65DR — P64DR — P63DR P52DR P62DR P51DR P61DR P50DR P60DR
H'FFBA P5DR H'FFBB P6DR H'FFBC PBODR H'FFBD PBPIN (read) P8DDR (write)
PB7ODR PB6ODR PB5ODR PB4ODR PB3ODR PB2ODR PB1ODR PB0ODR PB7PIN — PB6PIN PB5PIN PB4PIN PB3PIN PB2PIN PB1PIN PB0PIN
P86DDR P85DDR P84DDR P83DDR P82DDR P81DDR P80DDR
Rev. 4.00 Sep 27, 2006 page 993 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FFBE P7PIN (read) PBDDR (write) H'FFBF H'FFC0 H'FFC1 H'FFC2 H'FFC3 H'FFC4 H'FFC5 H'FFC6 H'FFC7 H'FFC8 H'FFC9 P8DR P9DDR P9DR IER STCR SYSCR MDCR BCR WSCR TCR0 TCR1 Module Name Ports Bus Width 8
Bit 7 P77PIN
Bit 6 P76PIN
Bit 5 P75PIN
Bit 4 P74PIN
Bit 3 P73PIN
Bit 2 P72PIN
Bit 1 P71PIN
Bit 0 P70PIN
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR — P86DR P85DR P84DR P83DR P82DR P81DR P80DR
P97DDR P96DDR P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR P97DR IRQ7E IICS CS2E EXPE ICIS1 RAMS CMIEB CMIEB CMFB CMFB P96DR IRQ6E IICX1 IOSE — ICIS0 RAM0 CMIEA CMIEA CMFA CMFA P95DR IRQ5E IICX0 INTM1 — P94DR IRQ4E IICE INTM0 — P93DR IRQ3E FLSHE XRST — P92DR IRQ2E — NMIEG — P91DR IRQ1E ICKS1 HIE MDS1 IOS1 WC1 CKS1 CKS1 OS1 OS1 P90DR IRQ0E ICKS0 RAME MDS0 IOS0 WC0 CKS0 CKS0 OS0 OS0 Bus controller TMR0, TMR1 8 Interrupt controller System 8 8
BRSTRM BRSTS1 BRSTS0 — ABW OVIE OVIE OVF OVF AST CCLR1 CCLR1 ADTE — WMS1 CCLR0 CCLR0 OS3 OS3 WMS0 CKS2 CKS2 OS2 OS2
16
H'FFCA TCSR0 H'FFCB TCSR1 H'FFCC TCORA0 H'FFCD TCORA1 H'FFCE TCORB0 H'FFCF TCORB1 H'FFD0 H'FFD1 H'FFD2 H'FFD3 H'FFD4 H'FFD5 H'FFD6 H'FFD7 TCNT0 TCNT1
PWOERB OE15 PWOERA OE7 PWDPRB OS15 PWDPRA OS7 PWSL PWDR0 to PWDR15 SMR0 ICCR0 C/A ICE PWCKE
OE14 OE6 OS14 OS6 PWCKS
OE13 OE5 OS13 OS5 —
OE12 OE4 OS12 OS4 —
OE11 OE3 OS11 OS3 RS3
OE10 OE2 OS10 OS2 RS2
OE9 OE1 OS9 OS1 RS1
OE8 OE0 OS8 OS0 RS0
PWM
8
H'FFD8
CHR IEIC
PE MST
O/E TRS
STOP ACKE
MP BBSY
CKS1 IRIC
CKS0 SCP
SCI0 IIC0 SCI0
8
H'FFD9
BRR0 ICSR0 ESTP STOP IRTR AASX AL AAS ADZ ACKB
IIC0
Rev. 4.00 Sep 27, 2006 page 994 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FFDA SCR0 H'FFDB TDR0 H'FFDC SSR0 H'FFDD RDR0 H'FFDE SCMR0 ICDR0 SARX0 H'FFDF ICMR0 SAR0 H'FFE0 H'FFE1 H'FFE2 H'FFE3 H'FFE4 H'FFE5 H'FFE6 H'FFE7 H'FFE8 H'FFE9 ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR — ICDR7 SVAX6 MLS SVA6 AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGS1 OVF — ICDR6 SVAX5 WAIT SVA5 AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE TRGS0 WT/IT — ICDR5 SVAX4 CKS2 SVA4 AD7 — AD7 — AD7 — AD7 — ADST — TME — ICDR4 SVAX3 CKS1 SVA3 AD6 — AD6 — AD6 — AD6 — SCAN — PSS SDIR ICDR3 SVAX2 CKS0 SVA2 AD5 — AD5 — AD5 — AD5 — CKS — SINV ICDR2 SVAX1 BC2 SVA1 AD4 — AD4 — AD4 — AD4 — CH2 — — ICDR1 SVAX0 BC1 SVA0 AD3 — AD3 — AD3 — AD3 — CH1 — CKS1 SMIF ICDR0 FSX BC0 FS AD2 — AD2 — AD2 — AD2 — CH0 — CKS0 WDT1 16 A/D 8 IIC0 TDRE RDRF ORER FER PER TEND MPB MPBT Module Name SCI0 Bus Width 8
Bit 7 TIE
Bit 6 RIE
Bit 5 TE
Bit 4 RE
Bit 3 MPIE
Bit 2 TEIE
Bit 1 CKE1
Bit 0 CKE0
H'FFEA TCSR1 TCNT1 (write) H'FFEB TCNT1 (read) H'FFF0 HICR TCRX TCRY H'FFF1 KMIMR TCSRX TCSRY H'FFF2 KMPCR TICRR TCORAY H'FFF3 KMIMRA TICRF TCORBY
RST/NMI CKS2
— CMIEB CMIEB
— CMIEA CMIEA
— OVIE OVIE
— CCLR1 CCLR1
— CCLR0 CCLR0
IBFIE2 CKS2 CKS2
IBFIE1 CKS1 CKS1
FGA20E CKS0 CKS0
HIF TMRX TMRY Interrupt controller TMRX TMRY Ports TMRX TMRY
8
KMIMR7 KMIMR6 KMIMR5 KMIMR4 KMIMR3 KMIMR2 KMIMR1 KMIMR0 CMFB CMFB CMFA CMFA OVF OVF ICF ICIE OS3 OS3 OS2 OS2 OS1 OS1 OS0 OS0
8
KM7PCR KM6PCR KM5PCR KM4PCR KM3PCR KM2PCR KM1PCR KM0PCR
KMIMR15 KMIMR14 KMIMR13 KMIMR12 KMIMR11 KMIMR10 KMIMR9 KMIMR8
Interrupt controller TMRX TMRY
8
Rev. 4.00 Sep 27, 2006 page 995 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Register Address Name H'FFF4 IDR1 TCNTX TCNTY H'FFF5 ODR1 TCORC TISR H'FFF6 STR1 TCORAX H'FFF7 H'FFF8 H'FFF9 H'FFFA TCORBX DADR0 DADR1 DACR DAOE1 IDR7 DAOE0 IDR6 DAE IDR5 — IDR4 ICST ODR4 CBOE DBU — IDR3 HFINV ODR3 HOINV C/D — IDR2 VFINV ODR2 VOINV DBU — IDR1 HIINV ODR1 CLOINV IBF — IDR0 VIINV ODR0 CBOINV OBF HIF Timer connection HIF Timer connection HIF Timer connection D/A — DBU — DBU — DBU — DBU — C/D — DBU — IBF IS OBF ODR7 ODR6 ODR5 ODR4 ODR3 ODR2 ODR1 ODR0 Module Name HIF TMRX TMRY HIF TMRX TMRY HIF TMRX Bus Width 8
Bit 7 IDR7
Bit 6 IDR6
Bit 5 IDR5
Bit 4 IDR4
Bit 3 IDR3
Bit 2 IDR2
Bit 1 IDR1
Bit 0 IDR0
H'FFFC IDR2 TCONRI H'FFFD ODR2
SIMOD1 SIMOD0 SCONE ODR7 ODR6 VOE DBU ODR5 CLOE DBU
TCONRO HOE H'FFFE STR2 TCONRS H'FFFF SEDGR DBU
TMRX/Y ISGENE HOMOD1 HOMOD0 VOMOD1 VOMOD0 CLMOD1 CLMOD0 VEDG HEDG CEDG HFEDG VFEDG PREQF IHI IVI
Rev. 4.00 Sep 27, 2006 page 996 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
B.2
Lower Address H'EC00 to H'EFFF
Register Selection Conditions
Register Name MRA SAR MRB DAR CRA CRB H8S/2148 Group Register Selection Conditions RAME = 1 in SYSCR H8S/2147N Register Selection Conditions — — H8S/2144 Group Register Selection Conditions Module Name DTC
H'FE80 H'FE84 H'FE85 H'FE86 H'FE8C H'FE8D H'FE8E H'FED8 H'FED9 H'FEDA H'FEDC H'FEDD H'FEDE H'FEE0 H'FEE1 H'FEE2 H'FEE4
HICR2 IDR3 ODR3 STR3 IDR4 ODR4 STR4 KBCRH0 KBCRL0 KBBR0 KBCRH1 KBCRL1 KBBR1 KBCRH2 KBCRL2 KBBR2 KBCOMP
MSTP2 = 0
MSTP2 = 0
—
HIF
MSTP2 = 0
MSTP2 = 0
—
Keyboard buffer controller
No conditions
No conditions
No conditions
IrDA/ expansion A/D IIC0 Interrupt controller
H'FEE6 H'FEE8 H'FEE9 H'FEEA H'FEEB H'FEEC H'FEED H'FEEE H'FEEF H'FEF0 H'FEF1 H'FEF2
DDCSWR ICRA ICRB ICRC ISR ISCRH ISCRL DTCERA DTCERB DTCERC DTCERD DTCERE
MSTP4 = 0 No conditions
MSTP4 = 0 No conditions
— No conditions
No conditions
—
—
DTC
Rev. 4.00 Sep 27, 2006 page 997 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FEF3 H'FEF4 H'FEF5 H'FEF6 H'FEF7 H'FF80 H'FF81 H'FF82 Register Name DTVECR ABRKCR BARA BARB BARC FLMCR1 FLMCR2 PCSR EBR1 H'FF83 SYSCR2 EBR2 H'FF84 H'FF85 H'FF86 H'FF87 H'FF88 SBYCR LPWRCR MSTPCRH MSTPCRL SMR1 ICCR1 H'FF89 BRR1 ICSR1 H'FF8A H'FF8B H'FF8C H'FF8D H'FF8E SCR1 TDR1 SSR1 RDR1 SCMR1 ICDR1 SARX1 H'FF8F ICMR1 SAR1 H'FF90 H'FF91 H'FF92 H'FF93 TIER TCSR FRCH FRCL MSTP13 = 0 MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR ICE = 1 in ICCR1 ICE = 0 in ICCR1 ICE = 1 in ICCR1 ICE = 0 in ICCR1 MSTP13 = 0 MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR ICE = 1 in ICCR1 ICE = 0 in ICCR1 ICE = 1 in ICCR1 ICE = 0 in ICCR1 MSTP13 = 0 FRT MSTP6 = 0, IICE = 0 in STCR — IIC1 MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR MSTP6 = 0 MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR MSTP6 = 0, IICE = 0 in STCR MSTP3 = 0, IICE = 1 in STCR MSTP6 = 0 MSTP6 = 0, IICE = 0 in STCR — MSTP6 = 0, IICE = 0 in STCR — MSTP6 = 0 SCI1 IIC1 SCI1 IIC1 SCI1 FLSHE = 0 in STCR FLSHE = 1 in STCR FLSHE = 0 in STCR FLSHE = 1 in STCR FLSHE = 0 in STCR FLSHE = 0 in STCR FLSHE = 1 in STCR FLSHE = 0 in STCR FLSHE = 1 in STCR FLSHE = 0 in STCR — FLSHE = 1 in STCR — FLSHE = 1 in STCR FLSHE = 0 in STCR FLSHE = 1 in STCR FLSHE = 1 in STCR FLSHE = 1 in STCR Flash memory PWM Flash memory HIF Flash memory System H8S/2148 Group Register Selection Conditions No conditions No conditions H8S/2147N Register Selection Conditions — No conditions — No conditions H8S/2144 Group Register Selection Conditions Module Name DTC Interrupt controller
Rev. 4.00 Sep 27, 2006 page 998 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FF94 Register Name OCRAH OCRBH H'FF95 OCRAL OCRBL H'FF96 H'FF97 H'FF98 TCR TOCR ICRAH OCRARH H'FF99 ICRAL OCRARL H'FF9A ICRBH OCRAFH H'FF9B ICRBL OCRAFL H'FF9C ICRCH OCRDMH H'FF9D ICRCL OCRDML H'FF9E H'FF9F H'FFA0 ICRDH ICRDL SMR2 DADRAH MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB SCI2 PWMX ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR ICRS = 0 in TOCR ICRS = 1 in TOCR H8S/2148 Group Register Selection Conditions MSTP13 = 0 H8S/2147N Register Selection Conditions H8S/2144 Group Register Selection Conditions Module Name
OCRS = 0 in MSTP13 = 0 TOCR OCRS = 1 in TOCR OCRS = 0 in TOCR OCRS = 1 in TOCR
OCRS = 0 in MSTP13 = 0 TOCR OCRS = 1 in TOCR OCRS = 0 in TOCR OCRS = 1 in TOCR
OCRS = 0 in FRT TOCR OCRS = 1 in TOCR OCRS = 0 in TOCR OCRS = 1 in TOCR
DACR
Rev. 4.00 Sep 27, 2006 page 999 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FFA1 Register Name BRR2 DADRAL H8S/2148 Group Register Selection Conditions MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR MSTP5 = 0 REGS = 0 in DACNT/ DADRB H8S/2147N Register Selection Conditions MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR MSTP5 = 0 REGS = 0 in DACNT/ DADRB H8S/2144 Group Register Selection Conditions MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR MSTP5 = 0 REGS = 0 in DACNT/ DADRB Module Name SCI2 PWMX
H'FFA2 H'FFA3 H'FFA4 H'FFA5 H'FFA6
SCR2 TDR2 SSR2 RDR2 SCMR2 DADRBH
SCI2
MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB No conditions
MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB No conditions
MSTP5 = 0, IICE = 0 in STCR MSTP11 = 0, IICE = 1 in STCR REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB REGS = 0 in DACNT/ DADRB REGS = 1 in DACNT/ DADRB No conditions WDT0 PWMX PWMX
DACNTH
H'FFA7
DADRBL
DACNTL
H'FFA8
TCSR0 TCNT0 (write)
H'FFA9 H'FFAA H'FFAB
TCNT0 (read) PAODR0 PAPIN (read) PADDR (write) No conditions No conditions No conditions Ports
H'FFAC H'FFAD H'FFAE H'FFB0 H'FFB1 H'FFB2 H'FFB3 H'FFB4 H'FFB5 H'FFB6 H'FFB7
P1PCR P2PCR P3PCR P1DDR P2DDR P1DR P2DR P3DDR P4DDR P3DR P4DR
Rev. 4.00 Sep 27, 2006 page 1000 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FFB8 H'FFB9 H'FFBA H'FFBB H'FFBC H'FFBD Register Name P5DDR P6DDR P5DR P6DR PBODR P8DDR (write) PBPIN (read) H'FFBE P7PIN (read) PBDDR (write) H'FFBF H'FFC0 H'FFC1 H'FFC2 H'FFC3 H'FFC4 H'FFC5 H'FFC6 H'FFC7 H'FFC8 H'FFC9 H'FFCA H'FFCB H'FFCC H'FFCD H'FFCE H'FFCF H'FFD0 H'FFD1 H'FFD2 H'FFD3 H'FFD4 H'FFD5 P8DR P9DDR P9DR IER STCR SYSCR MDCR BCR WSCR TCR0 TCR1 TCSR0 TCSR1 TCORA0 TCORA1 TCORB0 TCORB1 TCNT0 TCNT1 PWOERB PWOERA PWDPRB PWDPRA No conditions No conditions — PWM MSTP12 = 0 MSTP12 = 0 MSTP12 = 0 Bus controller TMR0, TMR1 No conditions No conditions No conditions No conditions No conditions No conditions Interrupt controller System H8S/2148 Group Register Selection Conditions No conditions H8S/2147N Register Selection Conditions No conditions H8S/2144 Group Register Selection Conditions No conditions Module Name Ports
Rev. 4.00 Sep 27, 2006 page 1001 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FFD6 H'FFD7 H'FFD8 Register Name PWSL PWDR0 to PWDR15 SMR0 ICCR0 H'FFD9 BRR0 ICSR0 H'FFDA H'FFDB H'FFDC H'FFDD H'FFDE SCR0 TDR0 SSR0 RDR0 SCMR0 ICDR0 SARX0 H'FFDF ICMR0 SAR0 H'FFE0 H'FFE1 H'FFE2 H'FFE3 H'FFE4 H'FFE5 H'FFE6 H'FFE7 H'FFE8 H'FFE9 H'FFEA ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR TCSR1 TCNT1 (write) H'FFEB H'FFF0 TCNT1 (read) HICR TCRX TCRY MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR — — MSTP8 = 0, HIE = 0 in SYSCR HIF TMRX TMRY No conditions No conditions No conditions WDT1 MSTP9 = 0 MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR ICE = 1 in ICCR0 ICE = 0 in ICCR0 ICE = 1 in ICCR0 ICE = 0 in ICCR0 MSTP9 = 0 MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR ICE = 1 in ICCR0 ICE = 0 in ICCR0 ICE = 1 in ICCR0 ICE = 0 in ICCR0 MSTP9 = 0 A/D MSTP7 = 0, IICE = 0 in STCR — IIC0 MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR MSTP7 = 0 MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR MSTP7 = 0, IICE = 0 in STCR MSTP4 = 0, IICE = 1 in STCR MSTP7 = 0 MSTP7 = 0, IICE = 0 in STCR — MSTP7 = 0, IICE = 0 in STCR — MSTP7 = 0 SCI0 IIC0 SCI0 IIC0 SCI0 H8S/2148 Group Register Selection Conditions MSTP11 = 0 H8S/2147N Register Selection Conditions MSTP11 = 0 — H8S/2144 Group Register Selection Conditions Module Name PWM
Rev. 4.00 Sep 27, 2006 page 1002 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
Lower Address H'FFF1 Register Name KMIMR TCSRX TCSRY H'FFF2 KMPCR TICRR TCORAY H'FFF3 KMIMRA TICRF TCORBY H'FFF4 IDR1 TCNTX TCNTY H'FFF5 ODR1 TCORC TISR H'FFF6 STR1 TCORAX H'FFF7 H'FFF8 H'FFF9 H'FFFA H'FFFC TCORBX DADR0 DADR1 DACR IDR2 TCONRI H'FFFD ODR2 TCONRO H'FFFE STR2 TCONRS H'FFFF SEDGR MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP2 = 0, HIE = 1 in SYSCR — MSTP2 = 0, HIE = 1 in SYSCR — — HIF Timer connection HIF Timer connection HIF Timer connection H8S/2148 Group Register Selection Conditions MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR TMRX/Y = 0 in TCONRS TMRX/Y = 1 in TCONRS MSTP2 = 0, HIE = 1 in SYSCR MSTP8 = 0, HIE = 0 in SYSCR MSTP10 = 0 TMRX/Y = 0 in TCONRS H8S/2147N Register Selection Conditions MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR — H8S/2144 Group Register Selection Conditions MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR MSTP2 = 0, HIE = 1 in SYSCR — MSTP8 = 0, HIE = 0 in SYSCR — Module Name Interrupt controller TMRX TMRY Ports TMRX TMRY Interrupt controller TMRX TMRY HIF TMRX TMRY HIF TMRX TMRY HIF TMRX
MSTP10 = 0
MSTP10 = 0
D/A
Rev. 4.00 Sep 27, 2006 page 1003 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
B.3
Functions
Register name Address to which the register is mapped Name of on-chip supporting module
D/A Converter
Register acronym
DACR—D/A Control Register
H'FFFA
Bit numbers
Bit
7 DAOE1 0 R/W
6 DAOE0 0 R/W
5 DAE 0 R/W
4 — 1 —
3 — 1 —
2 — 1 —
1 — 1 —
0 — 1 —
Initial bit values
Initial value Read/Write
Names of the bits. Dashes (—) indicate reserved bits.
D/A enabled
DAOE1 DAOE0 DAE * 0 1 1 0 0 1 1 * Conversion result Channel 0 and 1 D/A conversion disabled Channel 0 D/A conversion enabled Channel 1 D/A conversion disabled Channel 0 and 1 D/A conversion enabled Channel 0 D/A conversion disabled Channel 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled
Possible types of access R W Read only Write only
0
0 1
Full name of bit
R/W Read and write
Descriptions of bit settings
D/A output enable 0 0 1 Analog output DA0 disabled Channel 0 D/A conversion enabled. Analog output DA0 enabled
D/A output enable 1 0 1 Analog output DA1 disabled Channel 1 D/A conversion enabled. Analog output DA1 enabled
Rev. 4.00 Sep 27, 2006 page 1004 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
MRA—DTC Mode Register A
Bit Initial value Read/Write 7 SM1 — 6 SM0 — 5 DM1 — 4 DM0 —
H'EC00–H'EFFF
3 MD1 — 2 MD0 — 1 DTS — 0 Sz —
DTC
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
DTC data transfer size 0 Byte-size transfer 1 Word-size transfer DTC transfer mode select 0 Destination side is repeat area or block area 1 Source side is repeat area or block area DTC mode 0 1 0 Normal mode 1 Repeat mode 0 Block transfer mode 1— Destination address mode 0 — DAR is fixed 1 0 DAR is incremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) 1 DAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) Source address mode 0 — SAR is fixed 1 0 SAR is incremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1) 1 SAR is decremented after a transfer (by 1 when Sz = 0; by 2 when Sz = 1)
Rev. 4.00 Sep 27, 2006 page 1005 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
MRB—DTC Mode Register B
Bit Initial value Read/Write 7 CHNE — 6 DISEL — 5 — — 4 — —
H'EC00–H'EFFF
3 — — 2 — — 1 — — 0 — —
DTC
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
DTC interrupt select 0 After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 1 After a data transfer ends, the CPU interrupt is enabled DTC chain transfer enable 0 End of DTC data transfer 1 DTC chain transfer
SAR—DTC Source Address Register
Bit Initial value Read/Write 23 22 21 20 19
H'EC00–H'EFFF
--------4 3 2 1
DTC
0
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
Specifies DTC transfer data source address
DAR—DTC Destination Address Register
Bit Initial value Read/Write 23 22 21 20 19
H'EC00–H'EFFF
--------4 3 2 1
DTC
0
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
Specifies DTC transfer data destination address
Rev. 4.00 Sep 27, 2006 page 1006 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
CRA—DTC Transfer Count Register A
Bit Initial value Read/Write 15 14 13 12 11 10 9 8
H'EC00–H'EFFF
7 6 5 4 3 2 1
DTC
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CRAH
CRAL
Specifies the number of DTC data transfers
CRB—DTC Transfer Count Register B
Bit Initial value Read/Write 15 14 13 12 11 10 9 8
H'EC00–H'EFFF
7 6 5 4 3 2 1
DTC
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Specifies the number of DTC block data transfers
HICR2—Host Interface Control Register 2
Bit Initial value Slave R/W Host R/W 7 — 1 — — 6 — 1 — — 5 — 1 — — 4 — 1 — —
H'FE80
3 — 1 — — 2 IBFIE4 0 R/W — 1 IBFIE3 0 R/W — 0 — 0 — —
HIF
Input data register full interrupt enable IBFIE4 IBFIE3 — — 0 1 0 1 — — Description Input data register (IDR3) receive complete interrupt is disabled Input data register (IDR3) receive complete interrupt is enabled Input data register (IDR4) receive complete interrupt is disabled Input data register (IDR4) receive complete interrupt is enabled
Rev. 4.00 Sep 27, 2006 page 1007 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
IDR3—Input Data Register 3 IDR4—Input Data Register 4
Bit Initial value Slave R/W Host R/W 7 IDR7 — R W 6 IDR6 — R W 5 IDR5 — R W 4 IDR4 — R W
H'FE84 H'FE8C
3 IDR3 — R W 2 IDR2 — R W 1 IDR1 — R W 0 IDR0 — R W
HIF HIF
Stores host data bus contents at rise of IOW when CS is low
ODR3—Output Data Register 3 ODR4—Output Data Register 4
Bit Initial value Slave R/W Host R/W 7 ODR7 — R/W R 6 ODR6 — R/W R 5 ODR5 — R/W R 4 ODR4 — R/W R
H'FE85 H'FE8D
3 ODR3 — R/W R 2 ODR2 — R/W R 1 ODR1 — R/W R 0
HIF HIF
ODR0 — R/W R
ODR contents are output to the host data bus when HA0 is low, CS is low, and IOR is low
Rev. 4.00 Sep 27, 2006 page 1008 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
STR3—Status Register 3 STR4—Status Register 4
Bit Initial value Slave R/W Host R/W 7 DBU 0 R/W R 6 DBU 0 R/W R 5 DBU 0 R/W R 4 DBU 0 R/W R
H'FE86 H'FE8E
3 C/D 0 R R 2 DBU 0 R/W R 1 IBF 0 R R 0 OBF 0 R/(W) R
HIF HIF
User-defined bits
Output buffer full 0 [Clearing condition] When the host processor reads ODR or the slave writes 0 in the OBF bit [Setting condition] When the slave processor writes to ODR
1
Input buffer full 0 1 [Clearing condition] When the slave processor reads IDR [Setting condition] When the host processor writes to IDR
Command/data 0 1 Contents of input data register (IDR) are data Contents of input data register (IDR) are a command
Rev. 4.00 Sep 27, 2006 page 1009 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KBCRH0—Keyboard Control Register H0 KBCRH1—Keyboard Control Register H1 KBCRH2—Keyboard Control Register H2
Bit Initial value Read/Write 7 KBIOE 0 R/W 6 KCLKI 1 R 5 KDI 1 R 4
H'FED8 H'FEDC H'FEE0
3 KBIE 0 R/W
Keyboard Buffer Controller Keyboard Buffer Controller Keyboard Buffer Controller
2 KBF 0 R/(W)* 1 PER 0 R/(W)* 0 KBS 0 R
KBFSEL 1 R/W
Keyboard stop 0 0 stop bit received 1 1 stop bit received Parity error 0 [Clearing condition] Read PER when PER =1, then write 0 in PER 1 [Setting condition] When an odd parity error occurs Keyboard buffer register full 0 [Clearing condition] Read KBF when KBF =1, then write 0 in KBF 1 [Setting conditions] • When data has been received normally while KBFSEL = 1, and has been transferred to KBBR (keyboard buffer register full flag) • When a KCLK falling edge has been detected while KBFSEL = 0 (KCLK interrupt flag) Keyboard interrupt enable 0 Interrupt requests are disabled 1 Interrupt requests are enabled Keyboard buffer register full select 0 KBF bit is used as KCLK fall interrupt flag 1 KBF bit is used as keyboard buffer full flag Keyboard data in 0 KD I/O pin is low 1 KD I/O pin is high Keyboard clock in 0 KCLK I/O pin is low 1 KCLK I/O pin is high Keyboard in/out enable 0 The keyboard buffer controller is non-operational (KCLK and KD signal pins have port functions) 1 The keyboard buffer controller is enabled for transmission and reception (KCLK and KD signal pins are in the bus drive state)
Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1010 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KBCRL0—Keyboard Control Register L0 KBCRL1—Keyboard Control Register L1 KBCRL2—Keyboard Control Register L2
Bit Initial value Read/Write 7 KBE 0 R/W 6 KCLKO 1 R/W 5 KDO 1 R/W 4 — 1 —
H'FED9 H'FEDD H'FEE1
3 RXCR3 0 R
Keyboard Buffer Controller Keyboard Buffer Controller Keyboard Buffer Controller
2 RXCR2 0 R 1 RXCR1 0 R 0 RXCR0 0 R
Receive counter RXCR3 RXCR2 RXCR1 RXCR0 Receive data contents 0 0 0 0 — 1 1 1 0 1 1 0 0 1 1 — 0 1 0 1 0 1 0 1 0 1 — Start bit KB0 KB1 KB2 KB3 KB4 KB5 KB6 KB7 Parity bit — —
Keyboard data out 0 Keyboard buffer controller data I/O pin is low 1 Keyboard buffer controller data I/O pin is high Keyboard clock out 0 Keyboard buffer controller clock I/O pin is low 1 Keyboard buffer controller clock I/O pin is high Keyboard enable 0 Loading of receive data into KBBR is disabled 1 Loading of receive data into KBBR is enabled
Rev. 4.00 Sep 27, 2006 page 1011 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KBBR0—Keyboard Data Buffer Register 0 KBBR1—Keyboard Data Buffer Register 1 KBBR2—Keyboard Data Buffer Register 2
Bit Initial value Read/Write 7 KB7 0 R 6 KB6 0 R 5 KB5 0 R 4
H'FEDA H'FEDE H'FEE2
3 KB3 0 R
Keyboard Buffer Controller Keyboard Buffer Controller Keyboard Buffer Controller
2 KB2 0 R 1 KB1 0 R 0 KB0 0 R
KB4 0 R
Stores receive data
Rev. 4.00 Sep 27, 2006 page 1012 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KBCOMP—Keyboard Comparator Control Register
Bit Initial value Read/Write 7 IrE 0 R/W 6 IrCKS2 0 R/W 5 IrCKS1 0 R/W 4 IrCKS0 0 R/W 3
H'FEE4
2 KBCH2 0 R/W
IrDA/Expansion A/D
1 KBCH1 0 R/W 0 KBCH0 0 R/W
KBADE 0 R/W
Keyboard comparator control Bit 3 Bit 2 Bit 1 Bit 0 A/D converter KBADE KBCH2 KBCH1 KBCH0 channel 6 input 0 1 — 0 — 0 1 1 0 1 — 0 1 0 1 0 1 0 1 IrDA Clock select 2 to 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 IrDA enable 0 The TxD2/IrTxD and RxD2/IrRxD pins function as TxD2 and RxD2 1 The TxD2/IrTxD and RxD2/IrRxD pins function as IrTxD and IrRxD B × 3/16 (3/16 of the bit rate) φ/2 φ/4 φ/8 φ/16 φ/32 φ/64 φ/128 AN6 CIN0 CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 A/D converter channel 7 input AN7 CIN8 CIN9 CIN10 CIN11 CIN12 CIN13 CIN14 CIN15
Rev. 4.00 Sep 27, 2006 page 1013 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DDCSWR—DDC Switch Register
Bit Initial value Read/Write 7 SWE 0 R/W 6 SW 0 R/W 5 IE 0 R/W 4 IF 0 R/(W)*1 3 CLR3 1 W*2
H'FEE6
2 CLR2 1 W*2 1 CLR1 1 W*2 0 CLR0 1 W*2
IIC0
IIC clear bits Bit 3 Bit 2 Bit 1 Bit 0 CLR3 CLR2 CLR1 CLR0 0 0 1 — 0 1 1 — — — 0 1 0 1 — Description Setting prohibited Setting prohibited IIC0 internal latch cleared IIC1 internal latch cleared IIC0 and IIC1 internal latches cleared Invalid setting
DDC mode switch interrupt flag 0 No interrupt is requested when automatic format switching is executed [Clearing condition] When 0 is written in IF after reading IF = 1 An interrupt is requested when automatic format switching is executed [Setting condition] When a falling edge is detected on the SCL pin when SWE = 1
1
DDC mode switch interrupt enable bit 0 1 Interrupt when automatic format switching is executed is disabled Interrupt when automatic format switching is executed is enabled
DDC mode switch 0 IIC channel 0 is used with the I2C bus format [Clearing conditions] • When 0 is written by software • When a falling edge is detected on the SCL pin when SWE = 1 IIC channel 0 is used in formatless mode [Setting condition] When 1 is written in SW after reading SW = 0
1
DDC mode switch enable 0 1 Automatic switching of IIC channel 0 from formatless mode to I2C bus format is disabled Automatic switching of IIC channel 0 from formatless mode to I2C bus format is enabled
Notes: 1. Only 0 can be written, to clear the flag. 2. Always read as 1.
Rev. 4.00 Sep 27, 2006 page 1014 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ICRA—Interrupt Control Register A ICRB—Interrupt Control Register B ICRC—Interrupt Control Register C
Bit Initial value Read/Write 7 ICR7 0 R/W 6 ICR6 0 R/W 5 ICR5 0 R/W 4
H'FEE8 H'FEE9 H'FEEA
3 ICR3 0 R/W 2 ICR2 0 R/W
Interrupt Controller Interrupt Controller Interrupt Controller
1 ICR1 0 R/W 0 ICR0 0 R/W
ICR4 0 R/W
Interrupt control level 0 1 Corresponding interrupt source is control level 0 (non-priority) Corresponding interrupt source is control level 1 (priority)
Correspondence between Interrupt Sources and ICR Settings
Register ICRA ICRB Bits 7 IRQ0 6 IRQ1 5 IRQ2 IRQ3 — 4 IRQ4 IRQ5 — 3 IRQ6 IRQ7 2 DTC 1 0 Watchdog Watchdog timer 0 timer 1
A/D Freeconverter running timer
8-bit timer 8-bit timer 8-bit timer HIF, channel 0 channel 1 channels keyboard X, Y buffer controller — —
ICRC
SCI SCI SCI IIC IIC — channel 0 channel 1 channel 2 channel 0 channel 1 (option) (option)
Rev. 4.00 Sep 27, 2006 page 1015 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ISR—IRQ Status Register
Bit Initial value Read/Write 7 IRQ7F 0 R/(W)* 6 IRQ6F 0 R/(W)* 5 IRQ5F 0 R/(W)* 4
H'FEEB
3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)*
Interrupt Controller
1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
IRQ4F 0 R/(W)*
IRQ7 to IRQ0 flags 0 [Clearing conditions] • Cleared by reading IRQnF when set to 1, then writing 0 in IRQnF • When interrupt exception handling is executed while low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high* • When IRQn interrupt exception handling is executed while falling, rising, or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1)* [Setting conditions] • When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA = 0) • When a falling edge occurs in IRQn input while falling edge detection is set (IRQnSCB = 0, IRQnSCA = 1) • When a rising edge occurs in IRQn input while rising edge detection is set (IRQnSCB = 1, IRQnSCA = 0) • When a falling or rising edge occurs in IRQn input while both-edge detection is set (IRQnSCB = IRQnSCA = 1)
1
Notes: n = 7 to 0 * When a product, in which a DTC is incorporated, is used in the following settings, the corresponding flag bit is not automatically cleared even when exception handling, which is a clear condition, is executed and the bit is held at 1. (1) When DTCEA3 is set to 1 (ADI is set to an interrupt source), IRQ4F flag is not automatically cleared. (2) When DTCEA2 is set to 1 (ICIA is set to an interrupt source), IRQ5F flag is not automatically cleared. (3) When DTCEA1 is set to 1 (ICIB is set to an interrupt source), IRQ6F flag is not automatically cleared. (4) When DTCEA0 is set to 1 (OCIA is set to an interrupt souce), IRQ7F flag is not automatically cleared. When activation interrupt sources of DTC and IRQ interrupts are used with the above combinations, clear the interrupt flag by software in the interrupt handling routine of the corresponding IRQ. Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1016 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ISCRH—IRQ Sense Control Register H ISCRL—IRQ Sense Control Register L
ISCRH
H'FEEC H'FEED
Interrupt Controller Interrupt Controller
Bit Initial value Read/Write
15 0 R/W
14 0 R/W
13 0 R/W
12 0 R/W
11 0 R/W
10 0 R/W
9 0 R/W
8 0 R/W
IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
IRQ7 to IRQ4 sense control A and B ISCRL
Bit Initial value Read/Write
7 0 R/W
6 0 R/W
5 0 R/W
4 0 R/W
3 0 R/W
2 0 R/W
1 0 R/W
0 0 R/W
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
IRQ3 to IRQ0 sense control A and B
ISCRH bits 7 to 0 ISCRL bits 7 to 0 IRQ7SCB to IRQ0SCB 0 IRQ7SCA to IRQ0SCA 0 1 1 0 1
Description
Interrupt request generated at IRQ7 to IRQ0 input at low level Interrupt request generated at falling edge of IRQ7 to IRQ0 input Interrupt request generated at rising edge of IRQ7 to IRQ0 input Interrupt request generated at both falling and rising edges of IRQ7 to IRQ0 input
Rev. 4.00 Sep 27, 2006 page 1017 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DTCER—DTC Enable Register
Bit Initial value Read/Write 7 DTCE7 0 R/W 6 DTCE6 0 R/W 5 DTCE5 0 R/W 4
H'FEEE to H'FEF2
3 DTCE3 0 R/W 2 DTCE2 0 R/W 1 DTCE1 0 R/W 0
DTC
DTCE4 0 R/W
DTCE0 0 R/W
DTC activation enable 0 DTC activation by interrupt is disabled [Clearing conditions] • When data transfer ends with the DISEL bit set to 1 • When the specified number of transfers end DTC activation by interrupt is enabled [Holding condition] When the DISEL bit is 0 and the specified number of transfers have not ended
1
DTVECR—DTC Vector Register
Bit Initial value Read/Write 7 0 R/(W)* 6 0 R/W 5 0 R/W 4 0
H'FEF3
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
DTC
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 R/W
Sets vector number for DTC software activation DTC software activation enable 0 DTC software activation is disabled [Clearing condition] When the DISEL bit is 0 and the specified number of transfers have not ended DTC software activation is enabled [Holding conditions] • When data transfer ends with the DISEL bit set to 1 • When the specified number of transfers end • During software-activated deta transfer
1
Note: * A value of 1 can always be written to the SWDTE bit, but 0 can only be written after 1 is read.
Rev. 4.00 Sep 27, 2006 page 1018 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ABRKCR—Address Break Control Register
Bit Initial value Read/Write 7 CMF 0 R 6 — 0 — 5 — 0 — 4 — 0 —
H'FEF4
3 — 0 — 2 — 0 —
Interrupt Controller
1 — 0 — 0 BIE 0 R/W
Break interrupt enable 0 1 Condition match flag 0 1 [Clearing condition] When address break interrupt exception handling is executed [Setting condition] When address set by BARA to BARC is prefetched while BIE = 1 Address break disabled Address break enabled
Rev. 4.00 Sep 27, 2006 page 1019 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
BARA—Break Address Register A BARB—Break Address Register B BARC—Break Address Register C
Bit BARA Initial value Read/Write 7 A23 0 R/W 6 A22 0 R/W 5 A21 0 R/W 4 A20 0 R/W
H'FEF5 H'FEF6 H'FEF7
3 A19 0 R/W 2 A18 0 R/W
Interrupt Controller Interrupt Controller Interrupt Controller
1 A17 0 R/W 0 A16 0 R/W
Specifies address (bits 23 to 16) at which address break is to be generated
Bit BARB Initial value Read/Write
7 A15 0 R/W
6 A14 0 R/W
5 A13 0 R/W
4 A12 0 R/W
3 A11 0 R/W
2 A10 0 R/W
1 A9 0 R/W
0 A8 0 R/W
Specifies address (bits 15 to 8) at which address break is to be generated
Bit BARC Initial value Read/Write
7 A7 0 R/W
6 A6 0 R/W
5 A5 0 R/W
4 A4 0 R/W
3 A3 0 R/W
2 A2 0 R/W
1 A1 0 R/W
0 — 0 —
Specifies address (bits 7 to 1) at which address break is to be generated
Rev. 4.00 Sep 27, 2006 page 1020 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
FLMCR1—Flash Memory Control Register 1
Bit Initial value Read/Write 7 FWE 1 R 6 SWE 0 R/W 5 — 0 — 4 — 0 —
H'FF80
3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W
Flash Memory
0 P 0 R/W
Program 0 1 Program mode cleared Transition to program mode [Setting condition] When SWE = 1, and PSU = 1
Erase 0 1 Erase mode cleared Transition to erase mode [Setting condition] When SWE = 1, and ESU = 1
Program-verify 0 1 Program-verify mode cleared Transition to program-verify mode [Setting condition] When SWE = 1
Erase-verify 0 1 Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When SWE = 1
Software write enable 0 1 Reserved bit Writes disabled Writes enabled
Rev. 4.00 Sep 27, 2006 page 1021 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
FLMCR2—Flash Memory Control Register 2
Bit Initial value Read/Write 7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 —
H'FF81
3 — 0 — 2 — 0 — 1 ESU 0 R/W
Flash Memory
0 PSU 0 R/W
Program setup 0 1 Program setup cleared Program setup [Setting condition] When SWE = 1
Erase setup 0 1 Erase setup cleared Erase setup [Setting condition] When SWE = 1
Flash memory error 0 Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset or hardware standby mode An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] See section 22.8.3 or 23.8.3, Error Protection
1
Rev. 4.00 Sep 27, 2006 page 1022 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
PCSR—Peripheral Clock Select Register
Bit Initial value Read/Write 7 — 0 — 6 — 0 — 5 — 0 — 4 — 0 —
H'FF82
3 — 0 — 2 0 R/W 1 0 R/W 0 — 0 —
PWM
PWCKB PWCKA
PWM clock select PWSL Bit 7 0 1 Bit 6 — 0 1 PCSR Bit 2 — — 0 1 Bit 1 — — 0 1 0 1 Description Clock input is disabled φ (system clock) is selected φ/2 is selected φ/4 is selected φ/8 is selected φ/16 is selected
PWCKE PWCKS PWCKB PWCKA
Rev. 4.00 Sep 27, 2006 page 1023 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SYSCR2—System Control Register 2
Bit Initial value Read/Write 7 KWUL1 0 R/W 6 KWUL0 0 R/W 5 P6PUE 0 R/W 4 — 0 —
H'FF83
3 SDE 0 R/W 2 CS4E 0 R/W 1 CS3E 0 R/W 0 HI12E 0 R/W
HIF
Host interface enable 0 1 Host interface functions are disabled Host interface functions are enabled
CS3 enable 0 1 Host interface pin channel 3 functions disabled Host interface pin channel 3 functions enabled
CS4 enable 0 1 Host interface pin channel 4 functions disabled Host interface pin channel 4 functions enabled
Shutdown enable 0 1 Host interface pin shutdown function disabled Host interface pin shutdown function enabled
Port 6 input pull-up extra 0 1 Standard current specification is selected for port 6 MOS input pull-up function Current-limit specification is selected for port 6 MOS input pull-up function
Key wakeup level 1 and 0 0 1 0 1 0 1 Standard input level is selected as port 6 input level Input level 1 is selected as port 6 input level Input level 2 is selected as port 6 input level Input level 3 is selected as port 6 input level
Rev. 4.00 Sep 27, 2006 page 1024 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
EBR1—Erase Block Register 1 EBR2—Erase Block Register 2
Bit EBR1 Initial value Read/Write 7 — 0 — 6 — 0 — 5 — 0 — 4 — 0 —
H'FF82 H'FF83
3 — 0 — 2 — 0 — 1
Flash Memory Flash Memory
0 *2 EB8/—*2 EB9/— 0 0 1*2 R/W*1*2 R/W*
Bit EBR2 Initial value Read/Write Notes:
7 EB7 0 R/W*1
6 EB6 0 R/W
5 EB5 0 R/W
4 EB4 0 R/W
3 EB3 0 R/W
2 EB2 0 R/W
1 EB1 0 R/W
0 EB0 0 R/W
1. In normal mode, these bits cannot be modified and are always read as 0. 2. Bits EB8 and EB9 are not present in the 64-kbyte versions; they must not be set to 1.
Erase Blocks Block (Size) 128-kbyte versions EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) 64-kbyte versions EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) — — Addresses H'(00)0000 to H'(00)03FF H'(00)0400 to H'(00)07FF H'(00)0800 to H'(00)0BFF H'(00)0C00 to H'(00)0FFF H'(00)1000 to H'(00)7FFF H'(00)8000 to H'(00)BFFF H'(00)C000 to H'(00)DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF
Rev. 4.00 Sep 27, 2006 page 1025 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SBYCR—Standby Control Register
Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W
H'FF84
3 — 0 — 2 SCK2 0 R/W 1 SCK1 0 R/W 0
System
SCK0 0 R/W
System clock select 2 to 0 0 0 0 Bus master is in high-speed mode 1 1 1 0 1 0 1 0 1 — Medium-speed clock = φ/2 Medium-speed clock = φ/4 Medium-speed clock = φ/8 Medium-speed clock = φ/16 Medium-speed clock = φ/32 —
Standby timer select 2 to 0 0 0 0 Standby time = 8192 states 1 1 1 0 1 0 1 0 1 0 1 Standby time = 16384 states Standby time = 32768 states Standby time = 65536 states Standby time = 131072 states Standby time = 262144 states Reserved Standby time = 16 states*
Note: * This setting must not be used in the flash memory version. Software standby 0 Transition to sleep mode after execution of SLEEP instruction in high-speed mode or medium-speed mode Transition to subsleep mode on execution of SLEEP instruction in subactive mode Transition to software standby mode, subactive mode, or watch mode after execution of SLEEP instruction in high-speed mode or medium-speed mode Transition to watch mode or high-speed mode after execution of SLEEP instruction in subactive mode
1
Rev. 4.00 Sep 27, 2006 page 1026 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
LPWRCR—Low-Power Control Register
Bit Initial value Read/Write 7 DTON 0 R/W 6 LSON 0 R/W 5 NESEL 0 R/W 4 EXCLE 0 R/W
H'FF85
3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
System
Subclock input enable 0 1 Subclock input from EXCL pin is disabled Subclock input from EXCL pin is enabled
Noise elimination sampling frequency select 0 1 Low-speed on flag 0 • When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode, software standby mode, or watch mode* • When a SLEEP instruction is executed in subactive mode, a transition is made to watch mode, or directly to high-speed mode • After watch mode is cleared, a transition is made to high-speed mode • When a SLEEP instruction is executed in high-speed mode a transition is made to watch mode or subactive mode* • When a SLEEP instruction is executed in subactive mode, a transition is made to subsleep mode or watch mode • After watch mode is cleared, a transition is made to subactive mode Sampling at φ divided by 32 Sampling at φ divided by 4
1
Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be set. Direct-transfer on flag 0 • When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made to sleep mode, software standby mode, or watch mode* • When a SLEEP instruction is executed in subactive mode, a transition is made to subsleep mode or watch mode • When a SLEEP instruction is executed in high-speed mode or medium-speed mode, a transition is made directly to subactive mode*, or a transition is made to sleep mode or software standby mode • When a SLEEP instruction is executed in subactive mode, a transition is made directly to high-speed mode, or a transition is made to subsleep mode
1
Note: * When a transition is made to watch mode or subactive mode, high-speed mode must be set.
Rev. 4.00 Sep 27, 2006 page 1027 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
MSTPCRH—Module Stop Control Register H MSTPCRL—Module Stop Control Register L
MSTPCRH Bit Initial value 7 0 6 0 5 1 4 1 3 1 2 1 1 1 0 1
H'FF86 H'FF87
MSTPCRL 7 1 6 1 5 1 4 1 3 1 2 1
System System
1 1
0 1
MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Module stop 0 1 Module stop mode is cleared Module stop mode is set
The correspondence between MSTPCR bits and on-chip supporting modules is shown below. Register MSTPCRH Bit MSTP15 MSTP14* MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 MSTPCRL MSTP7 MSTP6 MSTP5 MSTP4* MSTP3* MSTP2* MSTP1* MSTP0* — Data transfer controller (DTC) 16-bit free-running timer (FRT) 8-bit timers (TMR0, TMR1) 8-bit PWM timer (PWM), 14-bit PWM timer (PWMX) D/A converter A/D converter 8-bit timers (TMRX, TMRY), timer connection Serial communication interface 0 (SCI0) Serial communication interface 1 (SCI1) Serial communication interface 2 (SCI2) I2C bus interface (IIC) channel 0 (option) I2C bus interface (IIC) channel 1 (option) Host interface (HIF), keyboard buffer controller (PS2) — — Module
Notes: Do not set bit 15 to 1. Bits 1 and 0 can be read and written but do not affect operation. * Must be set to 1 in the H8S/2144 Group.
Rev. 4.00 Sep 27, 2006 page 1028 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SMR1—Serial Mode Register 1 SMR2—Serial Mode Register 2 SMR0—Serial Mode Register 0
Bit Initial value Read/Write 7 C/A 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W
H'FF88 H'FFA0 H'FFD8
3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
SCI1 SCI2 SCI0
Clock select 1 and 0 0 1 0 1 0 1 Multiprocessor mode 0 1 Multiprocessor function disabled Multiprocessor format selected φ clock φ/4 clock φ/16 clock φ/64 clock
Stop bit length 0 1 1 stop bit 2 stop bits
Parity mode 0 1 Parity enable 0 1 Parity bit addition and checking disabled Parity bit addition and checking enabled Even parity Odd parity
Character length 0 1 8-bit data 7-bit data*
Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Also, LSB-first/ MSB-first selection is not available. Communication mode 0 1 Asynchronous mode Synchronous mode
Rev. 4.00 Sep 27, 2006 page 1029 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ICCR1—I C Bus Control Register 1 2 ICCR0—I C Bus Control Register 0
Bit Initial value Read/Write 7 ICE 0 R/W 6 IEIC 0 R/W 5 MST 0 R/W 4 TRS 0 R/W
2
H'FF88 H'FFD8
3 ACKE 0 R/W 2 BBSY 0 R/W 1 IRIC 0 R/(W)* 0 SCP 1 W
IIC1 IIC0
Start condition/stop condition prohibit 0 Writing 0 issues a start or stop condition, in combination with the BBSY flag Reading always returns a value of 1; writing is ignored
1
I2C bus interface interrupt request flag 0 1 Waiting for transfer, or transfer in progress Interrupt requested
Note: For the clearing and setting conditions, see section 16.2.5, I2C Bus Control Register (ICCR). Bus busy 0 Bus is free [Clearing condition] When a stop condition is detected Bus is busy [Setting condition] When a start condition is detected
I2C bus interface interrupt enable 0 1 I2C bus interface enable 0 I2C bus interface module disabled, with SCL and SDA signal pins set to port function SAR and SARX can be accessed I2C bus interface module enabled for transfer operations (pins SCL and SDA are driving the bus) ICMR and ICDR can be accessed Interrupts disabled Interrupts enabled 0 1
1
Acknowledge bit judgement selection The value of the acknowledge bit is ignored, and continuous transfer is performed If the acknowledge bit is 1, continuous transfer is interrupted
Master/slave select (MST), transmit/receive select (TRS) 0 1 0 1 0 1 Slave receive mode Slave transmit mode Master receive mode Master transmit mode
1
Note: For details, see section 16.2.5, I2C Bus Control Register (ICCR). Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1030 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
BRR1—Bit Rate Register 1 BRR2—Bit Rate Register 2 BRR0—Bit Rate Register 0
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W
H'FF89 H'FFA1 H'FFD9
3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
SCI1 SCI2 SCI0
Sets the serial transmit/receive bit rate
Rev. 4.00 Sep 27, 2006 page 1031 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ICSR1—I C Bus Status Register 1 2 ICSR0—I C Bus Status Register 0
Bit Initial value Read/Write 7 ESTP 6 STOP 5 IRTR 4 AASX
2
H'FF89 H'FFD9
3 AL 2 AAS 1 ADZ 0 ACKB 0 R/W
IIC1 IIC0
0 0 0 0 0 0 0 R/(W)*1 R/(W)*1 R/(W)*1 R/(W)*1 R/(W)*1 R/(W)*1 R/(W)*1
Acknowledge bit 0 Receive mode: 0 is output at acknowledge output timing Transmit mode: indicates that the receiving device has acknowledged the data (signal is 0) Receive mode: 1 is output at acknowledge output timing Transmit mode: indicates that the receiving device has not acknowledged the data (signal is 1)
1
General call address recognition flag*2 0 1 General call address not recognized General call address recognized
Slave address recognition flag*2 0 1 Slave address or general call address not recognized Slave address or general call address recognized
Arbitration lost*2 0 1 Bus arbitration won Arbitration lost
Second slave address recognition flag*2 0 1 Second slave address not recognized Second slave address recognized
I2C bus interface continuous transmission/reception interrupt request flag*2 0 1 Waiting for transfer, or transfer in progress Continuous transfer state
Normal stop condition detection flag*2 0 1 No normal stop condition In I2C bus format slave mode: Normal stop condition detected In other modes: No meaning
Error stop condition detection flag*2 0 1 No error stop condition In I2C bus format slave mode: Error stop condition detected In other modes: No meaning
Notes: 1. Only 0 can be written, to clear the flag. 2. For the clearing and setting conditions, see section 16.2.6, I2C Bus Status Register (ICSR).
Rev. 4.00 Sep 27, 2006 page 1032 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SCR1—Serial Control Register 1 SCR2—Serial Control Register 2 SCR0—Serial Control Register 0
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W
H'FF8A H'FFA2 H'FFDA
3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W
SCI1 SCI2 SCI0
Clock enable 1 and 0 0 0 Asynchronous mode Synchronous mode 1 Asynchronous mode Synchronous mode 1 0 Asynchronous mode Synchronous mode 1 Asynchronous mode Synchronous mode Transmit end interrupt enable 0 1 Transmit-end interrupt (TEI) request disabled Transmit-end interrupt (TEI) request enabled Internal clock/SCK pin functions as I/O port Internal clock/SCK pin functions as serial clock output Internal clock/SCK pin functions as clock output Internal clock/SCK pin functions as serial clock output External clock/SCK pin functions as clock input External clock/SCK pin functions as serial clock input External clock/SCK pin functions as clock input External clock/SCK pin functions as serial clock input
Multiprocessor interrupt enable 0 Multiprocessor interrupts disabled (normal reception mode) [Clearing conditions] • When the MPIE bit is cleared to 0 • When data with MPB = 1 is received Multiprocessor interrupts enabled Receive interrupt (RXI) requests, receive-error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received
Transmit interrupt enable 0 1 Transmit-data-empty interrupt (TXI) request disabled Transmit-data-empty interrupt (TXI) request enabled 1
Receive interrupt enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled
Receive enable 0 1 Reception disabled Reception enabled
Transmit enable 0 1 Transmission disabled Transmission enabled
1
Rev. 4.00 Sep 27, 2006 page 1033 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
RDR1—Receive Data Register 1 RDR2—Receive Data Register 2 RDR0—Receive Data Register 0
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R
H'FF8D H'FFA5 H'FFDD
3 0 R 2 0 R 1 0 R 0 0 R
SCI1 SCI2 SCI0
Stores serial receive data
TDR1—Transmit Data Register 1 TDR2—Transmit Data Register 2 TDR0—Transmit Data Register 0
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W
H'FF8B H'FFA3 H'FFDB
3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
SCI1 SCI2 SCI0
Stores serial transmit data
Rev. 4.00 Sep 27, 2006 page 1034 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SSR1—Serial Status Register 1 SSR2—Serial Status Register 2 SSR0—Serial Status Register 0
Bit Initial value Read/Write
H'FF8C H'FFA4 H'FFDC
5 ORER 0 R/(W)* 4 FER 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R
0 1
SCI1 SCI2 SCI0
1 MPB 0 R 0 MPBT 0 R/W
7 TDRE 1 R/(W)*
6 RDRF 0 R/(W)*
Multiprocessor bit transfer Data with a 0 multi-processor bit is transmitted Data with a 1 multi-processor bit is transmitted
Multiprocessor bit 0 [Clearing condition] When data with a 0 multiprocessor bit is received [Setting condition] When data with a 1 multiprocessor bit is received
1
Transmit end 0 [Clearing conditions] • When 0 is written in TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and writes data to TDR [Setting conditions] • When the TE bit in SCR is 0 • When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character
1
Parity error 0 1 [Clearing condition] When 0 is written in PER after reading PER = 1 [Setting condition] When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR
Framing error 0 1 [Clearing condition] When 0 is written in FER after reading FER = 1 [Setting condition] When the SCI checks the stop bit at the end of the receive data when reception ends, and the stop bit is 0
Overrun error 0 1 [Clearing condition] When 0 is written in ORER after reading ORER = 1 [Setting condition] When the next serial reception is completed while RDRF = 1
Receive data register full 0 [Clearing conditions] • When 0 is written in RDRF after reading RDRF = 1 • When the DTC is activated by an RXI interrupt and reads data from RDR [Setting condition] When serial reception ends normally and receive data is transferred from RSR to RDR
1 Transmit data register empty 0
[Clearing conditions] • When 0 is written in TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and writes data to TDR [Setting conditions] • When the TE bit in SCR is 0 • When data is transferred from TDR to TSR and data can be written in TDR
1
Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1035 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SCMR1—Serial Interface Mode Register 1 SCMR2—Serial Interface Mode Register 2 SCMR0—Serial Interface Mode Register 0
Bit Initial value Read/Write 7 — 1 — 6 — 1 — 5 — 1 — 4 — 1 —
H'FF8E H'FFA6 H'FFDE
3 SDIR 0 R/W 2 SINV 0 R/W 1 — 1 — 0 SMIF 0 R/W
SCI1 SCI2 SCI0
Serial communication interface mode select 0 1 Data invert 0 1 TDR contents are transmitted without modification Receive data is stored in RDR without modification TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form Normal SCI mode Setting prohibited
Data transfer direction 0 1 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first
Rev. 4.00 Sep 27, 2006 page 1036 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ICDR1—I C Bus Data Register 1 2 ICDR0—I C Bus Data Register 0
Bit Initial value Read/Write 7 ICDR7 — R/W 6 ICDR6 — R/W 5 ICDR5 — R/W 4 ICDR4 — R/W
2
H'FF8E H'FFDE
3 ICDR3 — R/W 2 ICDR2 — R/W 1 ICDR1 — R/W 0 ICDR0 — R/W
IIC1 IIC0
ICDRR Bit Initial value Read/Write 7 — R 6 — R 5 — R 4 — R 3 — R 2 — R 1 — R 0 — R
ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0
ICDRS Bit Initial value Read/Write 7 — — 6 — — 5 — — 4 — — 3 — — 2 — — 1 — — 0 — —
ICDRS7 ICDRS6 ICDRS5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0
ICDRT Bit Initial value Read/Write 7 — W 6 — W 5 — W 4 — W 3 — W 2 — W 1 — W 0 — W
ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0
TDRE, RDRF (internal flags) Bit Initial value Read/Write Note: For details, see section 16.2.1, I2C Bus Data Register (ICDR). — TDRE 0 — — RDRF 0 —
Rev. 4.00 Sep 27, 2006 page 1037 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SARX1—Second Slave Address Register 1 SAR1—Slave Address Register 1 SARX0—Second Slave Address Register 0 SAR0—Slave Address Register 0
SAR Bit Initial value Read/Write 7 SVA6 0 R/W 6 SVA5 0 R/W 5 SVA4 0 R/W 4 SVA3 0 R/W
H'FF8E H'FF8F H'FFDE H'FFDF
IIC1 IIC1 IIC0 IIC0
3 SVA2 0 R/W
2 SVA1 0 R/W
1 SVA0 0 R/W
0 FS 0 R/W
Slave address SARX Bit Initial value Read/Write 7 SVAX6 0 R/W 6 SVAX5 0 R/W 5 SVAX4 0 R/W 4 SVAX3 0 R/W 3 SVAX2 0 R/W 2 SVAX1 0 R/W 1
Format select
0 FSX 1 R/W
SVAX0 0 R/W
Second slave address Format select
DDCSWR Bit 6 SW 0 SAR Bit 0 FS 0 SARX Bit 0 FSX 0 1 I2C bus format • SAR and SARX slave addresses recognized I2C bus format • SAR slave address recognized • SARX slave address ignored I2C bus format • SAR slave address ignored • SARX slave address recognized Synchronous serial format • SAR and SARX slave addresses ignored Formatless mode (start/stop conditions not detected) • Acknowledge bit used Formatless mode* (start/stop conditions not detected) • No acknowledge bit Operating Mode
1
0
1 1 0 1 0 1 0 1
Note: * Do not set this mode when automatic switching to the I2C bus format is performed by means of the DDCSWR setting.
Rev. 4.00 Sep 27, 2006 page 1038 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ICMR1—I C Bus Mode Register 1 2 ICMR0—I C Bus Mode Register 0
Bit Initial value Read/Write 7 MLS 0 R/W 6 WAIT 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W
Bit counter
2
H'FF8F H'FFDF
3 CKS0 0 R/W 2 BC2 0 R/W 1 BC1 0 R/W 0 BC0 0 R/W
IIC1 IIC0
BC2
0
BC1 0 1
BC0 0 1 0 1 0 1 0 1
1
0 1
Synchronous serial format 8 1 2 3 4 5 6 7
I2C bus format 9 2 3 4 5 6 7 8
Serial clock select IICX CKS2 0 0
CKS1 0 1
1
0 1
1
0
0 1
1
0 1
CKS0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
Clock φ/28 φ/40 φ/48 φ/64 φ/80 φ/100 φ/112 φ/128 φ/56 φ/80 φ/96 φ/128 φ/160 φ/200 φ/224 φ/256
Wait insertion bit 0 1 Data and acknowledge bits transferred consecutively Wait inserted between data and acknowledge bits
MSB-first/LSB-first select* 0 1 MSB-first LSB-first
Note: * Do not set this bit to 1 when the I2C bus format is used.
Rev. 4.00 Sep 27, 2006 page 1039 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TIER—Timer Interrupt Enable Register
Bit Initial value Read/Write 7 ICIAE 0 R/W 6 ICIBE 0 R/W 5 ICICE 0 R/W 4 ICIDE 0 R/W
H'FF90
3 OCIAE 0 R/W 2 OCIBE 0 R/W 1 OVIE 0 R/W 0 — 1 —
FRT
Timer overflow interrupt enable 0 1 Timer overflow interrupt request (FOVI) is disabled Timer overflow interrupt request (FOVI) is enabled
Output compare interrupt B enable 0 1 Output compare interrupt request B (OCIB) is disabled Output compare interrupt request B (OCIB) is enabled
Output compare interrupt A enable 0 1 Output compare interrupt request A (OCIA) is disabled Output compare interrupt request A (OCIA) is enabled
Input capture interrupt D enable 0 1 Input capture interrupt request D (ICID) is disabled Input capture interrupt request D (ICID) is enabled
Input capture interrupt C enable 0 1 Input capture interrupt request C (ICIC) is disabled Input capture interrupt request C (ICIC) is enabled
Input capture interrupt B enable 0 1 Input capture interrupt request B (ICIB) is disabled Input capture interrupt request B (ICIB) is enabled
Input capture interrupt A enable 0 1 Input capture interrupt request A (ICIA) is disabled Input capture interrupt request A (ICIA) is enabled
Rev. 4.00 Sep 27, 2006 page 1040 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSR—Timer Control/Status Register
Bit Initial value Read/Write 7 ICFA 0 R/(W)* 6 ICFB 0 R/(W)* 5 ICFC 0 R/(W)* 4 ICFD 0 R/(W)*
H'FF91
3 OCFA 0 R/(W)* 2 OCFB 0 R/(W)* 1 OVF 0 R/(W)* 0 CCLRA 0 R/W
FRT
Counter clear A 0 1 FRC clearing is disabled FRC is cleared at compare match A
Timer overflow flag 0 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] When FRC changes from H'FFFF to H'0000
1
Output compare flag B 0 1 [Clearing condition] Read OCFB when OCFB = 1, then write 0 in OCFB [Setting condition] When FRC = OCRB
Output compare flag A 0 1 [Clearing condition] Read OCFA when OCFA = 1, then write 0 in OCFA [Setting condition] When FRC = OCRA
Input capture flag D 0 1 [Clearing condition] Read ICFD when ICFD = 1, then write 0 in ICFD [Setting condition] When an input capture signal is received
Input capture flag C 0 1 Input capture flag B 0 1 Input capture flag A 0 1 [Clearing condition] Read ICFA when ICFA = 1, then write 0 in ICFA [Setting condition] When an input capture signal causes the FRC value to be transferred to ICRA [Clearing condition] Read ICFB when ICFB = 1, then write 0 in ICFB [Setting condition] When an input capture signal causes the FRC value to be transferred to ICRB [Clearing condition] Read ICFC when ICFC = 1, then write 0 in ICFC [Setting condition] When an input capture signal is received
Note: * Only 0 can be written in bits 7 to 1, to clear the flags.
Rev. 4.00 Sep 27, 2006 page 1041 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
FRC—Free-Running Counter
Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FF92
7 0 6 0 5 0 4 0 3 0 2 0 1 0
FRT
0 0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Count value
OCRA/OCRB—Output Compare Register A/B
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FF94
7 1 6 1 5 1 4 1 3 1 2 1 1 1
FRT
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Constantly compared with FRC value; OCF is set when OCR = FRC
Rev. 4.00 Sep 27, 2006 page 1042 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCR—Timer Control Register
Bit Initial value Read/Write 7 IEDGA 0 R/W 6 IEDGB 0 R/W 5 IEDGC 0 R/W 4 IEDGD 0 R/W
H'FF96
3 BUFEA 0 R/W 2 BUFEB 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
FRT
Clock select 0 1 0 φ/2 internal clock source 1 φ/8 internal clock source 0 φ/32 internal clock source 1 External clock source (rising edge) Buffer enable B 0 1 ICRD is not used as a buffer register for input capture B ICRD is used as a buffer register for input capture B
Buffer enable A 0 1 ICRC is not used as a buffer register for input capture A ICRC is used as a buffer register for input capture A
Input edge select D 0 1 Capture on the falling edge of FTID Capture on the rising edge of FTID
Input edge select C 0 1 Capture on the falling edge of FTIC Capture on the rising edge of FTIC
Input edge select B 0 1 Capture on the falling edge of FTIB Capture on the rising edge of FTIB
Input edge select A 0 1 Capture on the falling edge of FTIA Capture on the rising edge of FTIA
Rev. 4.00 Sep 27, 2006 page 1043 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TOCR—Timer Output Compare Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 ICRS 0 R/W 4 OCRS 0 R/W
H'FF97
3 OEA 0 R/W 2 OEB 0 R/W 1 OLVLA 0 R/W 0 OLVLB 0 R/W
FRT
ICRDMS OCRAMS
Output level B 0 1 0 output at comparematch B 1 output at comparematch B
Output level A 0 1 0 output at comparematch A 1 output at comparematch A
Output enable B 0 1 Output compare B output disabled Output compare B output enabled
Output enable A 0 1 Output compare A output disabled Output compare A output enabled
Output compare register select 0 1 OCRA register selected OCRB register selected
Input capture register select 0 1 ICRA, ICRB, and ICRC registers selected OCRAR, OCRAF, and OCRDM registers selected
Output compare A mode select 0 1 OCRA set to normal operating mode OCRA set to operating mode using OCRAR and OCRAF
Input capture D mode select 0 1 ICRD set to normal operating mode ICRD set to operating mode using OCRDM
Rev. 4.00 Sep 27, 2006 page 1044 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
OCRAR—Output Compare Register AR OCRAF—Output Compare Register AF
Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FF98 H'FF9A
7 1 6 1 5 1 4 1 3 1 2 1 1 1
FRT FRT
0 1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Used for OCRA operation when OCRAMS = 1 in TOCR (For details, see section 11.2.4, Output Compare Registers AR and AF (OCRAR, OCRAF).)
OCRDM—Output Compare Register DM
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0
H'FF9C
7 0 6 0 5 0 4 0 3 0 2 0 1 0
FRT
0 0
R R/W R/W R/W R/W R/W R/W R/W R/W
Used for ICRD operation when ICRDMS = 1 in TOCR (For details, see section 11.2.5, Output Compare Register DM (OCRDM).)
ICRA—Input Capture Register A ICRB—Input Capture Register B ICRC—Input Capture Register C ICRD—Input Capture Register D
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R
H'FF98 H'FF9A H'FF9C H'FF9E
7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R
FRT FRT FRT FRT
0 0 R
Stores FRC value when input capture signal is input (ICRC and ICRD can be used for buffer operation. For details, see section 11.2.3, Input Capture Registers A to D (ICRA to ICRD).)
Rev. 4.00 Sep 27, 2006 page 1045 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DADRAH—PWM (D/A) Data Register AH DADRAL—PWM (D/A) Data Register AL DADRBH—PWM (D/A) Data Register BH DADRBL—PWM (D/A) Data Register BL
DADRH Bit (CPU) Bit (data) DADRA Initial value
15 13 14 12 13 11 12 10 11 9 10 8 9 7 8 6 7 5
H'FFA0 H'FFA1 H'FFA6 H'FFA7
DADRL
6 4 5 3 4 2 3 1 2 0 1 —
PWMX PWMX PWMX PWMX
0 — — 1
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W — DADRB Initial value
DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 CFS REGS 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Register select (DADRB only) 0 1 DADRA and DADRB can be accessed DACR and DACNT can be accessed
Carrier frequency select 0 1 Base cycle = resolution (T) × 64 DADR range is H'0401 to H'FFFD Base cycle = resolution (T) × 256 DADR range is H'0103 to H'FFFF
D/A conversion data
Rev. 4.00 Sep 27, 2006 page 1046 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DACR—PWM (D/A) Control Register
Bit Initial value Read/Write 7 TEST 0 R/W 6 PWME 0 R/W 5 — 1 — 4 — 1 —
H'FFA0
3 OEB 0 R/W 2 OEA 0 R/W 1 OS 0 R/W 0
PWMX
CKS 0 R/W
Clock select 0 1 Operates at resolution (T) = system clock cycle time (tcyc) Operates at resolution (T) = system clock cycle time (tcyc) × 2
Output select 0 1 Direct PWM output Inverted PWM output
Output enable A 0 1 PWM (D/A) channel A output (PWX0 output pin) disabled PWM (D/A) channel A output (PWX0 output pin) enabled
Output enable B 0 1 PWM enable 0 1 Test mode 0 1 PWM (D/A) in user state: normal operation PWM (D/A) in test state: correct conversion results unobtainable DACNT operates as a 14-bit up-counter DACNT halts at H'0003 PWM (D/A) channel B output (PWX1 output pin) disabled PWM (D/A) channel B output (PWX1 output pin) enabled
Rev. 4.00 Sep 27, 2006 page 1047 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DACNTH—PWM (D/A) Counter H DACNTL—PWM (D/A) Counter L
DACNTH
Bit (CPU) Bit (counter) Initial value Read/Write
15 7 14 6 13 5 12 4 11 3 10 2 9 1 8 0
H'FFA6 H'FFA7
DACNTL
7 8 6 9 5 10 4 11 3 12 2 13 1 — —
PWMX PWMX
0 — REGS 1 R/W
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W —
Register select 0 1 Up-counter DADRA and DADRB can be accessed DACR and DACNT can be accessed
Rev. 4.00 Sep 27, 2006 page 1048 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSR0—Timer Control/Status Register 0
Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 0 R/W
H'FFA8
3 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W RSTS RST/NMI
WDT0
Clock select 2 to 0
CKS2 0 CKS1 0 1 1 0 1 CKS0 0 1 0 1 0 1 0 1 φ/2 φ/64 φ/128 φ/512 φ/2048 φ/8192 φ/32768 φ/131072 Clock
Reset or NMI 0 1 Reserved bit Timer enable 0 1 TCNT is initialized to H'00 and halted TCNT counts NMI interrupt requested Internal reset requested
Timer mode select 0 1 Overflow flag 0 [Clearing conditions] • Write 0 in the TME bit • Read TCSR when OVF = 1*, then write 0 in OVF [Setting condition] When TCNT overflows (changes from H'FF to H'00) (When internal reset request generation is selected in watchdog timer mode, OVF is cleared automatically by the internal reset.) Interval timer mode: Sends the CPU an interval timer interrupt request (WOVI) when TCNT overflows Watchdog timer mode: Generates a reset or NMI interrupt when TCNT overflows
1
Note: * When OVF is polled and the interval timer interrupt is disabled, OVF = 1 must be read at least twice. Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1049 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCNT0—Timer Counter 0 TCNT1—Timer Counter 1
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W
H'FFA8 (W), H'FFA9 (R) H'FFEA (W), H'FFEB (R)
4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0
WDT0 WDT1
R/W
Up-counter
PAODR—Port A Output Data Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFAA
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port A
PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR R/W
Output data for port A pins
PAPIN—Port A Input Data Register
Bit Initial value Read/Write 7 —* R 6 —* R 5 —* R 4 —* R
H'FFAB (R)
3 —* R 2 —* R 1 —* R
Port A
0 —* R
PA7PIN PA6PIN PA5PIN PA4PIN PA3PIN PA2PIN PA1PIN PA0PIN
Port A pin states Note: * Determined by state of pins PA7 to PA0.
PADDR—Port A Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFAB (W)
3 0 W 2 0 W 1 0 W
Port A
0 0 W
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR
Specification of input or output for port A pins
Rev. 4.00 Sep 27, 2006 page 1050 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P1PCR—Port 1 MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFAC
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port 1
P17PCR P16PCR P15PCR P14PCR P13PCR P12PCR P11PCR P10PCR R/W
Control of port 1 built-in MOS input pull-ups
P2PCR—Port 2 MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFAD
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port 2
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR R/W
Control of port 2 built-in MOS input pull-ups
P3PCR—Port 3 MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFAE
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port 3
P37PCR P36PCR P35PCR P34PCR P33PCR P32PCR P31PCR P30PCR R/W
Control of port 3 built-in MOS input pull-ups
P1DDR—Port 1 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFB0
3 0 W 2 0 W 1 0 W 0 0
Port 1
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR W
Specification of input or output for port 1 pins
Rev. 4.00 Sep 27, 2006 page 1051 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P2DDR—Port 2 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFB1
3 0 W 2 0 W 1 0 W 0 0
Port 2
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR W
Specification of input or output for port 2 pins
P1DR—Port 1 Data Register
Bit Initial value Read/Write 7 P17DR 0 R/W 6 P16DR 0 R/W 5 P15DR 0 R/W 4 P14DR 0 R/W
H'FFB2
3 P13DR 0 R/W 2 P12DR 0 R/W 1 P11DR 0 R/W 0
Port 1
P10DR 0 R/W
Output data for port 1 pins
P2DR—Port 2 Data Register
Bit Initial value Read/Write 7 P27DR 0 R/W 6 P26DR 0 R/W 5 P25DR 0 R/W 4 P24DR 0 R/W
H'FFB3
3 P23DR 0 R/W 2 P22DR 0 R/W 1 P21DR 0 R/W 0
Port 2
P20DR 0 R/W
Output data for port 2 pins
P3DDR—Port 3 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFB4
3 0 W 2 0 W 1 0 W 0 0
Port 3
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR W
Specification of input or output for port 3 pins
Rev. 4.00 Sep 27, 2006 page 1052 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P4DDR—Port 4 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFB5
3 0 W 2 0 W 1 0 W 0 0
Port 4
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR W
Specification of input or output for port 4 pins
P3DR—Port 3 Data Register
Bit Initial value Read/Write 7 P37DR 0 R/W 6 P36DR 0 R/W 5 P35DR 0 R/W 4 P34DR 0 R/W
H'FFB6
3 P33DR 0 R/W 2 P32DR 0 R/W 1 P31DR 0 R/W 0
Port 3
P30DR 0 R/W
Output data for port 3 pins
P4DR—Port 4 Data Register
Bit Initial value Read/Write 7 P47DR 0 R/W 6 P46DR 0 R/W 5 P45DR 0 R/W 4 P44DR 0 R/W
H'FFB7
3 P43DR 0 R/W 2 P42DR 0 R/W 1 P41DR 0 R/W 0
Port 4
P40DR 0 R/W
Output data for port 4 pins
P5DDR—Port 5 Data Direction Register
Bit Initial value Read/Write 7 — 1 — 6 — 1 — 5 — 1 — 4 — 1 —
H'FFB8
3 — 1 — 2 0 W 1 0 W 0 0
Port 5
P52DDR P51DDR P50DDR W
Specification of input or output for port 5 pins
Rev. 4.00 Sep 27, 2006 page 1053 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P6DDR—Port 6 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFB9
3 0 W 2 0 W 1 0 W 0 0
Port 6
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR W
Specification of input or output for port 6 pins
P5DR—Port 5 Data Register
Bit Initial value Read/Write 7 — 1 — 6 — 1 — 5 — 1 — 4 — 1 —
H'FFBA
3 — 1 — 2 P52DR 0 R/W 1 P51DR 0 R/W 0
Port 5
P50DR 0 R/W
Output data for port 5 pins
P6DR—Port 6 Data Register
Bit Initial value Read/Write 7 P67DR 0 R/W 6 P66DR 0 R/W 5 P65DR 0 R/W 4 P64DR 0 R/W
H'FFBB
3 P63DR 0 R/W 2 P62DR 0 R/W 1 P61DR 0 R/W 0
Port 6
P60DR 0 R/W
Output data for port 6 pins
PBODR—Port B Output Data Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFBC
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port B
PB7ODR PB6ODR PB5ODR PB4ODR PB3ODR PB2ODR PB1ODR PB0ODR R/W
Output data for port B pins
Rev. 4.00 Sep 27, 2006 page 1054 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P8DDR—Port 8 Data Direction Register
Bit Initial value Read/Write 7 — 1 — 6 0 W 5 0 W 4 0 W
H'FFBD (W)
3 0 W 2 0 W 1 0 W 0 0
Port 8
P86DDR P85DDR P84DDR P83DDR P82DDR P81DDR P80DDR W
Specification of input or output for port 8 pins
PBPIN—Port B Input Data Register
Bit Initial value Read/Write 7 —* R 6 —* R 5 —* R 4 —* R
H'FFBD (R)
3 —* R 2 —* R 1 —* R 0
Port B
PB7PIN PB6PIN PB5PIN PB4PIN PB3PIN PB2PIN PB1PIN PB0PIN —* R
Port B pin states Note: * Determined by state of pins PB7 to PB0.
PBDDR—Port B Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FFBE (W)
3 0 W 2 0 W 1 0 W
Port B
0 0 W
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
Specification of input or output for port B pins
P7PIN—Port 7 Input Data Register
Bit Initial value Read/Write 7 —* R 6 —* R 5 —* R 4 —* R
H'FFBE (R)
3 —* R 2 —* R 1 —* R 0
Port 7
P77PIN P76PIN P75PIN
P74PIN P73PIN P72PIN
P71PIN P70PIN —* R
Port 7 pin states Note: * Determined by state of pins P77 to P70.
Rev. 4.00 Sep 27, 2006 page 1055 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
P8DR—Port 8 Data Register
Bit Initial value Read/Write 7 — 1 — 6 P86DR 0 R/W 5 P85DR 0 R/W 4 P84DR 0 R/W
H'FFBF
3 P83DR 0 R/W 2 P82DR 0 R/W 1 P81DR 0 R/W 0
Port 8
P80DR 0 R/W
Output data for port 8 pins
P9DDR—Port 9 Data Direction Register
Bit Mode 1 Initial value Read/Write Modes 2 and 3 Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 1 W 0 W 0 W 7 6 5 4
H'FFC0
3 2 1
Port 9
0
P97DDR P96DDR P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W
Specification of input or output for port 9 pins
P9DR—Port 9 Data Register
Bit Initial value Read/Write 7 P97DR 0 R/W 6 P96DR —* R 5 P95DR 0 R/W 4 P94DR 0 R/W
H'FFC1
3 P93DR 0 R/W 2 P92DR 0 R/W 1 P91DR 0 R/W 0
Port 9
P90DR 0 R/W
Output data for port 9 pins Note: * Determined by state of pin P96.
Rev. 4.00 Sep 27, 2006 page 1056 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
IER—IRQ Enable Register
Bit Initial value Read/Write 7 IRQ7E 0 R/W 6 IRQ6E 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W
H'FFC2
3 IRQ3E 0 R/W 2 IRQ2E 0 R/W
Interrupt Controller
1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
IRQ7 to IRQ0 enable 0 1 IRQn interrupt disabled IRQn interrupt enabled (n = 7 to 0)
Rev. 4.00 Sep 27, 2006 page 1057 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
STCR—Serial Timer Control Register
Bit Initial value Read/Write 7 IICS 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W
H'FFC3
3 FLSHE 0 R/W 2 — 0 R/W 1 ICKS1 0 R/W 0
System
ICKS0 0 R/W
Internal Clock Source Select*1 Reserved bit Flash memory control register enable 0 1 Flash memory control register not selected Flash memory control register selected
I2C master enable 0 1 CPU access to SCI0, SCI1, and SCI2 control registers is enabled CPU access to I2C bus interface data, PWMX and control registers is enabled
I2C transfer select 1 and 0*2 I2C extra buffer select 0 1 PA7 to PA4 are normal I/O pins PA7 to PA4 are I/O pins with bus driving capability
Notes: 1. Used for 8-bit timer input clock selection. For details, see section 12.2.4, Timer Control Register (TCR). 2. Used for I2C bus interface transfer clock selection. For details, see section 16.2.4, I2C Bus Mode Register (ICMR).
Rev. 4.00 Sep 27, 2006 page 1058 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SYSCR—System Control Register
Bit Initial value Read/Write 7 CS2E 0 R/W 6 IOSE 0 R/W 5 INTM1 0 R 4 INTM0 0 R/W
H'FFC4
3 XRST 1 R 2 NMIEG 0 R/W 1 HIE 0 R/W 0
System
RAME 1 R/W
RAM Enable 0 1 On-chip RAM is disabled On-chip RAM is enabled
Host interface enable 0 Addresses H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF are used for access to 8-bit timer (channel X and Y) data registers and control registers, and timer connection control registers 1 NMI edge select 0 1 Falling edge Rising edge Addresses H'(FF)FFF0 to H'(FF)FFF7 and H'(FF)FFFC to H'(FF)FFFF are used for access to host interface data registers and control registers, and keyboard controller and MOS input pull-up control registers
External reset 0 1 Reset generated by watchdog timer overflow Reset generated by an external reset
Interrupt control mode select INTM1 INTM0 0 0 1 IOS enable 0 1 The AS/IOS pin functions as the address strobe pin (Low output when accessing an external area) The AS/IOS pin functions as the I/O strobe pin (Low output when accessing a specified address from H'(FF)F000 to H'(FF)FE4F)* Description Interrupt control mode 0 Interrupt control mode 1
Note: * In the H8S/2148 F-ZTAT A-mask version and H8S/2147 F-ZTAT A-mask version, the address range is from H'(FF)F000 to H'(FF)F7FF. CS2 enable SYSCR HICR Bit 7 Bit 0 Description CS2E FGA20E 0 0 1 1 0 1 CS2 pin function halted (CS2 fixed high internally) CS2 pin function selected for P81/CS2 pin CS2 pin function selected for P90/ECS2 pin
Rev. 4.00 Sep 27, 2006 page 1059 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
MDCR—Mode Control Register
Bit Initial value Read/Write 7 EXPE —* R/W* 6 — 0 — 5 — 0 — 4 — 0 —
H'FFC5
3 — 0 — 2 — 0 — 1 MDS1 —* R
System
0 MDS0 —* R
Mode select 1 and 0 Expanded mode enable 0 1 Single-chip mode selected Expanded mode selected
Note: * Determined by the MD1 and MD0 pins.
Rev. 4.00 Sep 27, 2006 page 1060 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
BCR—Bus Control Register
Bit Initial value Read/Write 7 ICIS1 1 R/W 6 ICIS0 1 R/W 5 0 R/W 4 1 R/W
H'FFC6
3 0 R/W 2 — 1 R/W 1 IOS1 1 R/W
Bus Controller
0 IOS0 1 R/W
BRSTRM BRSTS1 BRSTS0
IOS select Address for which AS/IOS pin IOS1 IOS0 output goes low when IOSE = 1 0 0 1 1 0 1 Low in access to address H'(FF)F000 to H'(FF)F03F Low in access to address H'(FF)F000 to H'(FF)F0FF Low in access to address H'(FF)F000 to H'(FF)F3FF Low in access to address H'(FF)F000 to H'(FF)FE4F
Burst cycle select 0 0 1 Max. 4 words in burst access Max. 8 words in burst access
Burst cycle select 1 0 1 Burst cycle comprises 1 state Burst cycle comprises 2 states
Burst ROM enable 0 Reserved bit 1 Basic bus interface Burst ROM interface
Idle cycle insert 0 0 1 Idle cycle not inserted in case of successive external read and external write cycles Idle cycle inserted in case of successive external read and external write cycles
Rev. 4.00 Sep 27, 2006 page 1061 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
WSCR—Wait State Control Register
Bit Initial value Read/Write 7 RAMS 0 R/W 6 RAM0 0 R/W 5 ABW 1 R/W 4 AST 1 R/W
H'FFC7
3 WMS1 0 R/W 2 WMS0 0 R/W 1 WC1 1 R/W
Bus Controller
0 WC0 1 R/W
Wait count 1 and 0 0 0 1 No program wait states are inserted 1 program wait state is inserted in external memory space accesses 2 program wait states are inserted in external memory space accesses 3 program wait states are inserted in external memory space accesses
1
0
1 Reserved bits
Wait mode select 1 and 0 0 1 0 1 0 1 Access state control 0 External memory space is designated as 2-state access space Wait state insertion in external memory space accesses is disabled External memory space is designated as 3-state access space Wait state insertion in external memory space accesses is enabled Program wait mode Wait disabled mode Pin wait mode Pin auto-wait mode
1
Bus width control 0 1 External memory space designated as 16-bit access space External memory space designated as 8-bit access space
Rev. 4.00 Sep 27, 2006 page 1062 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCR0—Timer Control Register 0 TCR1—Timer Control Register 1 TCRX—Timer Control Register X TCRY—Timer Control Register Y
Bit Initial value Read/Write 7 CMIEB 0 R/W 6 CMIEA 0 R/W 5 OVIE 0 R/W 4 CCLR1 0 R/W
H'FFC8 H'FFC9 H'FFF0 H'FFF0
3 CCLR0 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0
TMR0 TMR1 TMRX TMRY
CKS0 0 R/W
Clock select 2 to 0 Channel Counter clear 1 and 0 0 0 1 0 1 Clear is disabled Cleared on compare match A Cleared on compare match B Cleared on rising edge of external reset input 1 1 Timer overflow interrupt enable 0 1 OVF interrupt request (OVI) is disabled OVF interrupt request (OVI) is enabled 1 0 0 0 0 Bit 2 Bit 1 Bit 0 Description
CKS2 CKS1 CKS0 0 0 Clock input disabled 0 1*1 Internal clock: counting at falling edge of φ/8 Internal clock: counting at falling edge of φ/2 0*1 Internal clock: counting at falling edge of φ/64 Internal clock: counting at falling edge of φ/32 1*1 Internal clock: counting at falling edge of φ/1024 0 Internal clock: counting at falling edge of φ/256 Counting at TCNT1 overflow signal*2
1
1
Clock input disabled 0 1*1 Internal clock: counting at falling edge of φ/8 Internal clock: counting at falling edge of φ/2 0*1 Internal clock: counting at falling edge of φ/64 Internal clock: counting at falling edge of φ/128 1*1 Internal clock: counting at falling edge of φ/1024
Compare match interrupt enable A 0 1 CMFA interrupt request (CMIA) is disabled CMFA interrupt request (CMIA) is enabled X 1 0 0 0 1 1 Y 0 0 0 1 1 All 1 0 0 1 0 0 1 Compare Match Interrupt Enable B 0 1 CMFB interrupt request (CMIB) is disabled CMFB interrupt request (CMIB) is enabled 0 1 0 0 1 0 1 0 1 0 1
Internal clock: counting at falling edge of φ/2048 Count at TCNT0 compare match A*2 Clock input disabled Internal clock: counting on φ Internal clock: counting at falling edge of φ/2 Internal clock: counting at falling edge of φ/4 Clock input disabled Clock input disabled Internal clock: counting at falling edge of φ/4 Internal clock: counting at falling edge of φ/256 Internal clock: counting at falling edge of φ/2048 Clock input disabled External clock: counting at rising edge External clock: counting at falling edge External clock: counting at both rising and falling edges
Notes: 1. Selected by ICKS1 and ICKS0 in STCR. For details, see section 12.2.4, Timer Control Register (TCR). 2. If the clock input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting.
Rev. 4.00 Sep 27, 2006 page 1063 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSR0—Timer Control/Status Register 0
TCSR0 Bit Initial value Read/Write
H'FFCA
TMR0
7 CMFB 0 R/(W)*
6 CMFA 0 R/(W)*
5 OVF 0 R/(W)*
4 ADTE 0 R/W
3 OS3 0 R/W
2 OS2 0 R/W
1 OS1 0 R/W
0 OS0 0 R/W
Output select 1 and 0 0 1 0 1 0 1 Output select 3 and 2 0 1 0 1 0 1 A/D trigger enable 0 1 A/D converter start requests by compare match A are disabled A/D converter start requests by compare match A are enabled No change at compare match B 0 output at compare match B 1 output at compare match B Output inverted at compare match B (toggle output) No change at compare match A 0 output at compare match A 1 output at compare match A Output inverted at compare match A (toggle output)
Timer overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] When TCNT overflows from H'FF to H'00
Compare match flag A 0 [Clearing conditions] • Read CMFA when CMFA = 1, then write 0 in CMFA • When the DTC is activated by a CMIA interrupt [Setting condition] When TCNT = TCORA
1
Compare match flag B 0 [Clearing conditions] • Read CMFB when CMFB = 1, then write 0 in CMFB • When the DTC is activated by a CMIB interrupt [Setting condition] When TCNT = TCORB
1
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
Rev. 4.00 Sep 27, 2006 page 1064 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSR1—Timer Control/Status Register 1
TCSR1 Bit Initial value Read/Write
H'FFCB
TMR1
7 CMFB 0 R/(W)*
6 CMFA 0 R/(W)*
5 OVF 0 R/(W)*
4 — 1 —
3 OS3 0 R/W
2 OS2 0 R/W
1 OS1 0 R/W
0 OS0 0 R/W
Output select 1 and 0 0 1 0 1 0 1 No change at compare match A 0 output at compare match A 1 output at compare match A Output inverted at compare match A (toggle output)
Output select 3 and 2 0 1 0 1 0 1 No change at compare match B 0 output at compare match B 1 output at compare match B Output inverted at compare match B (toggle output)
Timer overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] When TCNT overflows from H'FF to H'00
Compare match flag A 0 [Clearing conditions] • Read CMFA when CMFA = 1, then write 0 in CMFA • When the DTC is activated by a CMIA interrupt [Setting condition] When TCNT = TCORA
1
Compare match flag B 0 [Clearing conditions] • Read CMFB when CMFB = 1, then write 0 in CMFB • When the DTC is activated by a CMIB interrupt [Setting condition] When TCNT = TCORB
1
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
Rev. 4.00 Sep 27, 2006 page 1065 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCORA0—Time Constant Register A0 TCORA1—Time Constant Register A1 TCORB0—Time Constant Register B0 TCORB1—Time Constant Register B1 TCORAY—Time Constant Register AY TCORBY—Time Constant Register BY TCORC—Time Constant Register C TCORAX—Time Constant Register AX TCORBX—Time Constant Register BX
TCORA0 TCORB0 Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FFCC H'FFCD H'FFCE H'FFCF H'FFF2 H'FFF3 H'FFF5 H'FFF6 H'FFF7
TCORA1 TCORB1 7 1 6 1 5 1 4 1 3 1 2 1 1 1
TMR0 TMR1 TMR0 TMR1 TMRY TMRY TMRX TMRX TMRX
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Compare match flag (CMF) is set when TCOR and TCNT values match TCORAX, TCORAY TCORBX, TCORBY Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
Compare match flag (CMF) is set when TCOR and TCNT values match TCORC Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
Compare match C signal is generated when sum of TCORC and TICR contents match TCNT value
Rev. 4.00 Sep 27, 2006 page 1066 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCNT0—Timer Counter 0 TCNT1—Timer Counter 1 TCNTX—Timer Counter X TCNTY—Timer Counter Y
TCNT0 Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FFD0 H'FFD1 H'FFF4 H'FFF4
TCNT1 7 0 6 0 5 0 4 0 3 0 2 0 1 0
TMR0 TMR1 TMRX TMRY
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up-counter TCNTX, TCNTY Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Up-counter
Rev. 4.00 Sep 27, 2006 page 1067 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
PWOERA—PWM Output Enable Register A PWOERB—PWM Output Enable Register B
Bit PWOERA Initial value Read/Write Bit PWOERB Initial value Read/Write 7 OE7 0 R/W 7 OE15 0 R/W 6 OE6 0 R/W 6 OE14 0 R/W 5 OE5 0 R/W 5 OE13 0 R/W 4 OE4 0 R/W 4 OE12 0 R/W
H'FFD3 H'FFD2
3 OE3 0 R/W 3 OE11 0 R/W 2 OE2 0 R/W 2 OE10 0 R/W 1 OE1 0 R/W 1 OE9 0 R/W 0
PWM PWM
OE0 0 R/W 0 OE8 0 R/W
Switching between PWM output and port output
DDR 0 1
OE 0 1 0 1 Port input Port input
Description
Port output or PWM 256/256 output PWM output (0 to 255/256 output)
PWDPRA—PWM Data Polarity Register A PWDPRB—PWM Data Polarity Register B
Bit PWDPRA Initial value Read/Write Bit PWDPRB Initial value Read/Write 7 OS7 0 R/W 7 OS15 0 R/W 6 OS6 0 R/W 6 OS14 0 R/W 5 OS5 0 R/W 5 OS13 0 R/W 4 OS4 0 R/W 4 OS12 0 R/W
H'FFD5 H'FFD4
3 OS3 0 R/W 3 OS11 0 R/W 2 OS2 0 R/W 2 OS10 0 R/W 1 OS1 0 R/W 1 OS9 0 R/W
PWM PWM
0 OS0 0 R/W 0 OS8 0 R/W
PWM output polarity control 0 PWM direct output (PWDR value corresponds to high width of output) 1 PWM inverted output (PWDR value corresponds to low width of output)
Rev. 4.00 Sep 27, 2006 page 1068 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
PWSL—PWM Register Select
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 — 1 — 4 — 0 —
H'FFD6
3 RS3 0 R/W 2 RS2 0 R/W 1 RS1 0 R/W 0
PWM
PWCKE PWCKS
RS0 0 R/W
Register Select 0 0 0 1 1 0 1 1 0 0 1 1 0 1 PWM clock enable, PWM clock select PWSL Bit 7 0 1 Bit 6 — 0 1 PCSR Bit 2 — — 0 1 Bit 1 — — 0 1 0 1 Description Clock input disabled φ (system clock) selected φ/2 selected φ/4 selected φ/8 selected φ/16 selected 0 PWDR0 selected 1 PWDR1 selected 0 PWDR2 selected 1 PWDR3 selected 0 PWDR4 selected 1 PWDR5 selected 0 PWDR6 selected 1 PWDR7 selected 0 PWDR8 selected 1 PWDR9 selected 0 PWDR10 selected 1 PWDR11 selected 0 PWDR12 selected 1 PWDR13 selected 0 PWDR14 selected 1 PWDR15 selected
PWCKE PWCKS PWCKB PWCKA
Rev. 4.00 Sep 27, 2006 page 1069 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
PWDR0 to PWDR15—PWM Data Registers
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFD7
3 0 R/W 2 0 R/W 1 0 R/W 0 0
PWM
R/W
Specifies duty factor of basic output pulse and number of additional pulses
ADDRAH—A/D Data Register AH ADDRAL—A/D Data Register AL ADDRBH—A/D Data Register BH ADDRBL—A/D Data Register BL ADDRCH—A/D Data Register CH ADDRCL—A/D Data Register CL ADDRDH—A/D Data Register DH ADDRDL—A/D Data Register DL
ADDRH Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R
H'FFE0 H'FFE1 H'FFE2 H'FFE3 H'FFE4 H'FFE5 H'FFE6 H'FFE7
ADDRL 7 0 R 6 0 R 5 0 R 4 — 0 R 3 — 0 R
A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter A/D Converter
2 — 0 R
1 — 0 R
0 — 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 —
Stores A/D data Correspondence between analog input channels and ADDR registers Analog Input Channel Group 0 AN0 AN1 AN2 AN3 Group 1 AN4 AN5 AN6 or CIN0 to CIN7 AN7 or CIN8 to CIN15 A/D Data Register ADDRA ADDRB ADDRC ADDRD
Rev. 4.00 Sep 27, 2006 page 1070 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ADCSR—A/D Control/Status Register
Bit Initial value Read/Write 7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W
H'FFE8
3 CKS 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W
A/D Converter
0 CH0 0 R/W
Channel select
Group selection CH2 0 Channel selection CH1 0 1 1 0 1 CH0 0 1 0 1 0 1 0 1 Single mode AN0 AN1 AN2 AN3 AN4 AN5 AN6 or CIN0 to 7 AN0 AN0, AN1 AN0, AN1, AN2 AN0, AN1, AN2, AN3 AN4 AN4, AN5 AN4, AN5, AN6 or CIN0 to 7 Description Scan mode
AN7 or CIN8 to 15 AN4, AN5, AN6 or CIN0 to 7, AN7 or CIN8 to 15
Clock select 0 1 Conversion time = 266 states (max.) Conversion time = 134 states (max.)
Scan mode 0 1 A/D start 0 1 A/D conversion stopped • Single mode: A/D conversion is started. Cleared to 0 automatically when conversion on the specified channel ends • Scan mode: A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or a transition to standby mode or module stop mode Single mode Scan mode
A/D interrupt enable 0 1 A/D end flag 0 [Clearing conditions] • When 0 is written in the to ADF flag after reading ADF = 1 • When the DTC is activated by an ADI interrupt, and ADDR is read [Setting conditions] • Single mode: When A/D conversion ends • Scan mode: When A/D conversion ends on all specified channels A/D conversion end interrupt (ADI) request disabled A/D conversion end interrupt (ADI) request enabled
1
Note: * Only 0 can be written, to clear the flag.
Rev. 4.00 Sep 27, 2006 page 1071 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
ADCR—A/D Control Register
Bit Initial value Read/Write 7 TRGS1 0 R/W 6 TRGS0 0 R/W 5 — 1 — 4 — 1 —
H'FFE9
3 — 1 — 2 — 1 — 1 — 1 —
A/D Converter
0 — 1 —
Timer trigger select 0 1 0 1 0 1 Start of A/D conversion by external trigger is disabled Start of A/D conversion by external trigger is disabled Start of A/D conversion by external trigger (8-bit timer) is enabled Start of A/D conversion by external trigger pin is enabled
Rev. 4.00 Sep 27, 2006 page 1072 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSR1—Timer Control/Status Register 1
Bit Initial value Read/Write 7 OVF 0 R/(W)*1 6 WT/IT 0 R/W 5 TME 0 R/W 4 PSS 0 R/W
H'FFEA
3 RST/NMI 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
WDT1
Clock select 2 to 0 PSS CKS2 CKS1 CKS0 0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 1 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Reset or NMI 0 1 Prescaler select* 0 1 Timer enable 0 1 Timer mode select 0 1 Interval timer mode: Interval timer interrupt request (WOVI) sent to CPU when TCNT overflows Watchdog timer mode: Reset or NMI interrupt request sent to CPU when TCNT overflows TCNT is initialized to H'00 and halted TCNT counts
2
Clock φ/2 φ/64 φ/128 φ/512 φ/2048 φ/8192 φ/32768 φ/131072 φSUB/2 φSUB/4 φSUB/8 φSUB/16 φSUB/32 φSUB/64 φSUB/128 φSUB/256
NMI interrupt requested Internal reset requested
TCNT counts on a ø-based prescaler (PSM) scaled clock TCNT counts on a øSUB-based prescaler (PSS) scaled clock
Overflow flag 0 [Clearing conditions] • Write 0 in the TME bit • Read TCSR when OVF = 1*, then write 0 in OVF [Setting condition] When TCNT overflows (changes from H'FF to H'00) (When internal reset request generation is selected in watchdog timer mode, OVF is cleared automatically by the internal reset.)
1
Note: * When OVF is polled and the interval timer interrupt is disabled, OVF = 1 must be read at least twice.
Notes: 1. Only 0 can be written, to clear the flag. 2. For operation control when a transition is made to power-down mode, see section 25.2.3, Timer Control/Status Register (TCSR).
Rev. 4.00 Sep 27, 2006 page 1073 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
HICR—Host Interface Control Register
Bit Initial value Slave R/W Host R/W 7 — 1 — — 6 — 1 — — 5 — 1 — — 4 — 1 — —
H'FFF0
3 — 1 — — 2 IBFIE2 0 R/W — 1 0 R/W — 0 0 R/W —
HIF
IBFIE1 FGA20E
Fast gate A20 enable 0 1 Fast gate A20 function disabled Fast gate A20 function enabled
Input data register full interrupt enable 1 0 Input data register (IDR1) receive complete interrupt is disabled Input data register (IDR1) receive complete interrupt is enabled
1
Input data register full interrupt enable 2 0 1 Input data register (IDR2) receive complete interrupt is disabled Input data register (IDR2) receive complete interrupt is enabled
Rev. 4.00 Sep 27, 2006 page 1074 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSRX—Timer Control/Status Register X
TCSRX Bit Initial value Read/Write
H'FFF1
TMRX
7 CMFB 0 R/(W)*
6 CMFA 0 R/(W)*
5 OVF 0 R/(W)*
4 ICF 0 R/(W)*
3 OS3 0 R/W
2 OS2 0 R/W
1 OS1 0 R/W
0 OS0 0 R/W
Output select 1 and 0 0 1 0 1 0 1 No change at compare match A 0 output at compare match A 1 output at compare match A Output inverted at compare match A (toggle output)
Output select 3 and 2 0 1 0 1 0 1 Input capture flag 0 [Clearing condition] When 0 is written in ICF after reading ICF = 1 No change at compare match B 0 output at compare match B 1 output at compare match B Output inverted at compare match B (toggle output)
1
[Setting condition] When a rising edge followed by a falling edge is detected in the external reset signal after the ICST bit in TCONRI has been set to 1
Timer overflow flag 0 1 [Clearing condition] When 0 is written in OVF after reading OVF = 1 [Setting condition] When TCNT overflows from H'FF to H'00
Compare match flag A 0 [Clearing conditions] • When 0 is written in CMFA after reading CMFA = 1 • When the DTC is activated by a CMIA interrupt [Setting condition] When TCNT = TCORA
1
Compare match flag B 0 [Clearing conditions] • When 0 is written in CMFB after reading CMFB = 1 • When the DTC is activated by a CMIB interrupt [Setting condition] When TCNT = TCORB
1
Note: * Only 0 can be written in bits 7 to 4, to clear the flags.
Rev. 4.00 Sep 27, 2006 page 1075 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCSRY—Timer Control/Status Register Y
TCSRY Bit Initial value Read/Write
H'FFF1
TMRY
7 CMFB 0 R/(W)*
6 CMFA 0 R/(W)*
5 OVF 0 R/(W)*
4 ICIE 0 R/W
3 OS3 0 R/W
2 OS2 0 R/W
1 OS1 0 R/W
0 OS0 0 R/W
Output select 1 and 0 0 1 0 1 0 1 No change at compare match A 0 output at compare match A 1 output at compare match A Output inverted at compare match A (toggle output)
Output select 3 and 2 0 1 0 1 0 1 No change at compare match B 0 output at compare match B 1 output at compare match B Output inverted at compare match B (toggle output)
Input capture interrupt enable 0 1
Interrupt request by ICF (ICIX) is disabled Interrupt request by ICF (ICIX) is enabled
Timer overflow flag 0 1 [Clearing condition] When 0 is written in OVF after reading OVF = 1 [Setting condition] When TCNT overflows from H'FF to H'00
Compare match flag A 0 [Clearing conditions] • When 0 is written in CMFA after reading CMFA = 1 • When the DTC is activated by a CMIA interrupt [Setting condition] When TCNT = TCORA
1
Compare match flag B 0 [Clearing conditions] • When 0 is written in CMFB after reading CMFB = 1 • When the DTC is activated by a CMIB interrupt [Setting condition] When TCNT = TCORB
1
Note: * Only 0 can be written in bits 7 to 5, to clear the flags.
Rev. 4.00 Sep 27, 2006 page 1076 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KMIMR—Keyboard Matrix Interrupt Mask Register KMIMRA—Keyboard Matrix Interrupt Mask Register A
KMIMR Bit Initial value Read/Write 7 1 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W
H'FFF1 H'FFF3
Interrupt Controller Interrupt Controller
2 1 R/W
1 1 R/W
0 1 R/W
KMIMR7 KMIMR6 KMIMR5 KMIMR4 KMIMR3 KMIMR2 KMIMR1 KMIMR0
Keyboard matrix interrupt mask 0 1 KMIMRA Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
KMIMR15 KMIMR14 KMIMR13 KMIMR12 KMIMR11 KMIMR10 KMIMR9 KMIMR8
Key-sense input interrupt requests enabled Key-sense input interrupt requests disabled
Keyboard matrix interrupt mask 0 1 Key-sense input interrupt requests enabled Key-sense input interrupt requests disabled
TICRR—Input Capture Register R TICRF—Input Capture Register F
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R
H'FFF2 H'FFF3
2 0 R 1 0 R
TMRX TMRX
0 0 R
Stores TCNT value at fall of external reset input
Rev. 4.00 Sep 27, 2006 page 1077 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
KMPCR—Port 6 MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFF2
3 0 R/W 2 0 R/W 1 0 R/W 0 0
Port 6
KM7PCR KM6PCR KM5PCR KM4PCR KM3PCR KM2PCR KM1PCR KM0PCR
R/W
Control of port 6 built-in MOS input pull-ups Note: KMPCR has the same address as TICRR/TCORAY of TMRX/TMRY. When selecting KMPCR, set the HIE bit to 1 in SYSCR.
IDR1—Input Data Register 1 IDR2—Input Data Register 2
Bit Initial value Slave R/W Host R/W 7 IDR7 — R W 6 IDR6 — R W 5 IDR5 — R W 4 IDR4 — R W
H'FFF4 H'FFFC
3 IDR3 — R W 2 IDR2 — R W 1 IDR1 — R W 0 IDR0 — R W
HIF HIF
Stores host data bus contents at rise of IOW when CS is low
ODR1—Output Data Register 1 ODR2—Output Data Register 2
Bit Initial value Slave R/W Host R/W 7 ODR7 — R/W R 6 ODR6 — R/W R 5 ODR5 — R/W R 4 ODR4 — R/W R
H'FFF5 H'FFFD
3 ODR3 — R/W R 2 ODR2 — R/W R 1 ODR1 — R/W R 0
HIF HIF
ODR0 — R/W R
ODR contents are output to the host data bus when HA0 is low, CS is low, and IOR is low
Rev. 4.00 Sep 27, 2006 page 1078 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TISR—Timer Input Select Register
Bit Initial value Read/Write 7 — 1 — 6 — 1 — 5 — 1 — 4 — 1 —
H'FFF5
3 — 1 — 2 — 1 — 1 — 1 — 0 IS 0
TMRY
R/W
Input select 0 IVG signal is selected (H8S/2148 Group) External clock/reset input is disabled (H8S/2144 Group, H8S/2147N) VSYNCI/TMIY (TMCIY/TMRIY) is selected
1
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Appendix B Internal I/O Registers
STR1—Status Register 1 STR2—Status Register 2
Bit Initial value Slave R/W Host R/W 7 DBU 0 R/W R 6 DBU 0 R/W R 5 DBU 0 R/W R 4 DBU 0 R/W R
H'FFF6 H'FFFE
3 C/D 0 R R 2 DBU 0 R/W R 1 IBF 0 R R 0 OBF 0 R/(W) R
HIF HIF
User-defined bits
Output buffer full 0 [Clearing condition] When the host processor reads ODR [Setting condition] When the slave processor writes to ODR
1
Input buffer full 0 1 [Clearing condition] When the slave processor reads IDR [Setting condition] When the host processor writes to IDR
Command/data 0 1 Contents of input data register (IDR) are data Contents of input data register (IDR) are a command
DADR0—D/A Data Register 0 DADR1—D/A Data Register 1
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFF8 H'FFF9
3 0 R/W 2 0 R/W 1 0
D/A Converter D/A Converter
0 0 R/W
R/W
Stores data for D/A conversion
Rev. 4.00 Sep 27, 2006 page 1080 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
DACR—D/A Control Register
Bit Initial value Read/Write 7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 — 1 —
H'FFFA
3 — 1 — 2 — 1 — 1 — 1 —
D/A Converter
0 — 1 —
D/A enabled
DAOE1 DAOE0 0 0 1 DAE * 0 1 1 0 0 1 1
Legend: *: Don’t care Conversion result Channel 0 and 1 D/A conversion disabled Channel 0 D/A conversion enabled Channel 1 D/A conversion disabled Channel 0 and 1 D/A conversion enabled Channel 0 D/A conversion disabled Channel 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled
*
D/A output enable 0 0 1 Analog output DA0 disabled D/A conversion is enabled on channel 0. Analog output DA0 is enabled
D/A output enable 1 0 1 Analog output DA1 disabled D/A conversion is enabled on channel 1. Analog output DA1 is enabled
Rev. 4.00 Sep 27, 2006 page 1081 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCONRI—Timer Connection Register I
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 ICST 0 R/W
H'FFFC
3 HFINV 0 R/W 2 VFINV 0 R/W 1
Timer Connection
0 VIINV 0 R/W
SIMOD1 SIMOD0 SCONE
HIINV 0 R/W
Input synchronization signal inversion 0 The VSYNCI pin state is used directly as the VSYNCI input The VSYNCI pin state is inverted before use as the VSYNCI input
1
Input synchronization signal inversion 0 1 The HSYNCI and CSYNCI pin states are used directly as the HSYNCI and CSYNCI inputs The HSYNCI and CSYNCI pin states are inverted before use as the HSYNCI and CSYNCI inputs
Input synchronization signal inversion 0 1 The VFBACKI pin state is used directly as the VFBACKI input The VFBACKI pin state is inverted before use as the VFBACKI input
Input synchronization signal inversion 0 1 The HFBACKI pin state is used directly as the HFBACKI input The HFBACKI pin state is inverted before use as the HFBACKI input
Input capture start bit 0 The TICRR and TICRF input capture functions are stopped [Clearing condition] When a rising edge followed by a falling edge is detected on TMRIX The TICRR and TICRF input capture functions are operating (Waiting for detection of a rising edge followed by a falling edge on TMRIX) [Setting condition] When 1 is written in ICST after reading ICST = 0
1
Synchronization signal connection enable SCONE 0 Mode Normal connection FTIA FTIA input FTIB FTIB input TMO1 signal FTIC FTIC input VFBACKI input FTID FTID input IHI signal TMCI1 TMCI1 input IHI signal TMRI1 TMRI1 input IVI inverse signal
1
Synchronization IVI signal connecsignal tion mode
Input synchronization mode select 1 and 0 SIMOD1 0 SIMOD0 0 1 1 0 1 Mode No signal S-on-G mode Composite mode Separate mode IHI signal HFBACKI input CSYNCI input HSYNCI input HSYNCI input IVI signal VFBACKI input PDC input PDC input VSYNCI input
Rev. 4.00 Sep 27, 2006 page 1082 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCONRO—Timer Connection Register O
Bit Initial value Read/Write 7 HOE 0 R/W 6 VOE 0 R/W 5 CLOE 0 R/W 4 CBOE 0 R/W
H'FFFD
3 HOINV 0 R/W 2 VOINV 0 R/W
Timer Connection
1 0 R/W 0 0 R/W
CLOINV CBOINV
Output synchronization signal inversion 0 The CBLANK signal is used directly as the CBLANK output The CBLANK signal is inverted before use as the CBLANK output
1
Output synchronization signal inversion 0 The CLO signal (CL1, CL2, CL3, or CL4 signal) is used directly as the CLAMPO output The CLO signal (CL1, CL2, CL3, or CL4 signal) is inverted before use as the CLAMPO output
1
Output synchronization signal inversion 0 1 The IVO signal is used directly as the VSYNCO output The IVO signal is inverted before use as the VSYNCO output
Output synchronization signal inversion 0 1 Output enable 0 1 The P27/A15/PW15/CBLANK pin functions as the P27/A15/PW15 pin In mode 1 (expanded mode with on-chip ROM disabled): The P27/A15/PW15/CBLANK pin functions as the A15 pin In modes 2 and 3 (expanded modes with on-chip ROM enabled): The P27/A15/PW15/CBLANK pin functions as the CBLANK pin The IHO signal is used directly as the HSYNCO output The IHO signal is inverted before use as the HSYNCO output
Output enable 0 1 Output enable 0 1 Output enable 0 1 The P44/TMO1/HIRQ1/HSYNCO pin functions as the P44/TMO1/HIRQ1 pin The P44/TMO1/HIRQ1/HSYNCO pin functions as the HSYNCO pin The P61/FTOA/KIN1/CIN1/VSYNCO pin functions as the P61/FTOA/KIN1/CIN1 pin The P61/FTOA/KIN1/CIN1/VSYNCO pin functions as the VSYNCO pin The P64/FTIC/KIN4/CIN4/CLAMPO pin functions as the P64/FTIC/KIN4/CIN4 pin The P64/FTIC/KIN4/CIN4/CLAMPO pin functions as the CLAMPO pin
Rev. 4.00 Sep 27, 2006 page 1083 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
TCONRS—Timer Connection Register S
Bit Initial value Read/Write 7 TMRX/Y 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFFE
3 0 R/W 2 0 R/W 1 0
Timer Connection
0 0 R/W
ISGENE HOMOD1 HOMOD0 VOMOD1 VOMOD0 CLMOD1 CLMOD0 R/W
Clamp waveform mode select 1 and 0 ISGENE CLMOD1 CLMOD0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Vertical synchronization output mode select 1 and 0 ISGENE VOMOD1 VOMOD0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Horizontal synchronization output mode select 1 and 0 ISGENE HOMOD1 HOMOD0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 Internal synchronization signal select TMRX/TMRY access select 0 1 The TMRX registers are accessed at addresses H'FFF0 to H'FFF5 The TMRY registers are accessed at addresses H'FFF0 to H'FFF5 The IHG signal is selected Description The IHI signal (without 2fH modification) is selected The IHI signal (with 2fH modification) is selected The CL1 signal is selected Description The IVI signal (without fall modification or IHI synchronization) is selected The IVI signal (without fall modification, with IHI synchronization) is selected The IVI signal (with fall modification, without IHI synchronization) is selected The IVI signal (with fall modification and IHI synchronization) is selected The IVG signal is selected The CL4 signal is selected Description The CL1 signal is selected The CL2 signal is selected The CL3 signal is selected
Rev. 4.00 Sep 27, 2006 page 1084 of 1130 REJ09B0327-0400
Appendix B Internal I/O Registers
SEDGR—Edge Sense Register
Bit Initial value Read/Write 7 VEDG 0 R/(W)*1 6 HEDG 0 R/(W)*1 5 CEDG 0 4
H'FFFF
3
Timer Connection
2 0 1 IHI —*2 R
IVI signal level 0 1 The IVI signal is low The IVI signal is high
0 IVI —*2
HFEDG VFEDG PREQF
0 0 R/(W)*1 R/(W)*1 R/(W)*1
R/(W)*1
R
IHI signal level 0 1 The IHI signal is low The IHI signal is high
Pre-equalization flag 0 [Clearing condition] When 0 is written in PREQF after reading PREQF = 1 [Setting condition] When an IHI signal 2fH modification condition is detected
1
VFBACKI edge 0 1 [Clearing condition] When 0 is written in VFEDG after reading VFEDG = 1 [Setting condition] When a rising edge is detected on the VFBACKI pin
HFBACKI edge 0 1 CSYNCI edge 0 1 HSYNCI edge 0 1 VSYNCI edge 0 1 [Clearing condition] When 0 is written in VEDG after reading VEDG = 1 [Setting condition] When a rising edge is detected on the VSYNCI pin [Clearing condition] When 0 is written in HEDG after reading HEDG = 1 [Setting condition] When a rising edge is detected on the HSYNCI pin [Clearing condition] When 0 is written in CEDG after reading CEDG = 1 [Setting condition] When a rising edge is detected on the CSYNCI pin [Clearing condition] When 0 is written in HFEDG after reading HFEDG = 1 [Setting condition] When a rising edge is detected on the HFBACKI pin
Notes: 1. Only 0 can be written, to clear the flags. 2. The initial value is undefined since it depends on the pin states.
Rev. 4.00 Sep 27, 2006 page 1085 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Appendix C I/O Port Block Diagrams
C.1 Port 1 Block Diagram
Mode 2, 3 EXPE Mode 1 Reset R Q D P1nPCR C RP1P Hardware standby Mode 1 WP1P Reset R D Q P1nDDR * C WP1D
Internal data bus
Internal address bus
8-bit PWM PWM output enable PWM output
P1n
Reset R Q D P1nDR C WP1
RP1
Legend: WP1P: Write to P1PCR WP1D: Write to P1DDR WP1: Write to port 1 RP1P: Read P1PCR RP1: Read port 1 Notes: n = 0 to 7 * Set priority
Figure C.1 Port 1 Block Diagram
Rev. 4.00 Sep 27, 2006 page 1086 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.2
Port 2 Block Diagrams
Mode 2, 3 EXPE Mode 1 Reset R Q D P2nPCR C RP2P Hardware standby Mode 1 WP2P Reset R D Q P2nDDR * C WP2D
Internal data bus
Internal address bus
8-bit PWM PWM output enable PWM output
P2n
Reset R Q D P2nDR C WP2
RP2
Legend: WP2P: Write to P2PCR WP2D: Write to P2DDR WP2: Write to port 2 RP2P: Read P2PCR RP2: Read port 2 Notes: n = 0 to 3 * Set priority
Figure C.2 Port 2 Block Diagram (Pins P20 to P23)
Rev. 4.00 Sep 27, 2006 page 1087 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Mode 2, 3 EXPE IOSE Mode 1 Reset R Q D P2nPCR C RP2P Hardware standby Mode 1 WP2P Reset R D Q P2nDDR * C WP2D
Internal address bus
8-bit PWM PWM output enable PWM output
P2n
Reset R Q D P2nDR C WP2
RP2
Legend: WP2P: Write to P2PCR WP2D: Write to P2DDR WP2: Write to port 2 RP2P: Read P2PCR RP2: Read port 2 Notes: n = 4 to 6 * Set priority
Figure C.3 Port 2 Block Diagram (Pins P24 to P26)
Rev. 4.00 Sep 27, 2006 page 1088 of 1130 REJ09B0327-0400
Internal data bus
Appendix C I/O Port Block Diagrams
Mode 2, 3 EXPE IOSE Mode 1 Reset R Q D P27PCR C RP2P Hardware standby Mode 1 WP2P Reset R D Q P27DDR * C WP2D
Internal address bus
Internal data bus
8-bit PWM PWM output enable PWM output
P27
Reset R Q D P27DR C Mode 2, 3 WP2
Timer connection CBLANK CBLANK output enable
RP2
Legend: WP2P: Write to P2PCR WP2D: Write to P2DDR WP2: Write to port 2 RP2P: Read P2PCR RP2: Read port 2 Note: * Set priority
Figure C.4 Port 2 Block Diagram (Pin P27)
Rev. 4.00 Sep 27, 2006 page 1089 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.3
Port 3 Block Diagram
Mode 2, 3 EXPE HI12E Mode 1 Reset R Q D P3nPCR C RP3P Hardware standby CS IOR External address write WP3P Reset R D Q P3nDDR C WP3D
P3n
Reset R Q D P3nDR C WP3
CS IOW
RP3 External address read
Legend: WP3P: Write to P3PCR WP3D: Write to P3DDR WP3: Write to port 3 RP3P: Read P3PCR RP3: Read port 3 Note: n = 0 to 7
Figure C.5 Port 3 Block Diagram
Rev. 4.00 Sep 27, 2006 page 1090 of 1130 REJ09B0327-0400
Host interface data bus
Internal data bus
Appendix C I/O Port Block Diagrams
C.4
Port 4 Block Diagrams
Hardware standby
Reset R D Q P40DDR C WP4D
Internal data bus
SCI2 TxD2/IrTxD Transmit enable
P40
Reset R Q D P40DR C WP4
RP4
8-bit timer 0 Counter clock input Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4
Figure C.6 Port 4 Block Diagram (Pin P40)
Rev. 4.00 Sep 27, 2006 page 1091 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P41DDR C WP4D
Internal data bus
8-bit timer 0 8-bit timer output Output enable
P41
Reset R Q D P41DR C WP4
RP4
SCI2 Receive enable
RxD2/IrRxD
Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4
Figure C.7 Port 4 Block Diagram (Pin P41)
Rev. 4.00 Sep 27, 2006 page 1092 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby Reset R D Q P42DDR C WP4D
*1
Reset P42
*2
Internal data bus
SCI2 Input enable Clock output Output enable Clock output
Q D P42DR C WP4
R
IIC1 SDA1 output Transmit enable
RP4
SDA1 input Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4 Notes: 1. Output enable signal 2. Open drain control signal 8-bit timer 0 Reset input
Figure C.8 Port 4 Block Diagram (Pin P42)
Rev. 4.00 Sep 27, 2006 page 1093 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P43DDR C WP4D Reset
Internal data bus
Host interface RESOBF2 (resets HIRQ11)
P43
Q D P43DR C WP4
R
RP4
8-bit timer 1 Counter clock input Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4 Timer connection HSYNCI input
Figure C.9 Port 4 Block Diagram (Pin P43)
Rev. 4.00 Sep 27, 2006 page 1094 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P44DR C WP4D
Internal data bus
Timer connection HSYNCO output Output enable Reset Host interface RESOBF1 (resets HIRQ1)
P44
Q D P44DR C WP4
R
8-bit timer 1 TMO1 output Output enable
RP4
Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4
Figure C.10 Port 4 Block Diagram (Pin P44)
Rev. 4.00 Sep 27, 2006 page 1095 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P45DDR C WP4D Reset
Internal data bus
Host interface RESOBF1 (resets HIRQ12)
P45
Q D P45DR C WP4
R
RP4
8-bit timer 1 Timer reset input Timer connection Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4 CSYNCI input
Figure C.11 Port 4 Block Diagram (Pin P45)
Rev. 4.00 Sep 27, 2006 page 1096 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P4nDDR C WP4D
Internal data bus
14-bit PWM PWX0, PWX1 output Output enable
P4n
Reset R Q D P4nDR C WP4
RP4
Legend: WP4D: Write to P4DDR WP4: Write to port 4 RP4: Read port 4 Note: n = 6 or 7
Figure C.12 Port 4 Block Diagram (Pins P46, P47)
Rev. 4.00 Sep 27, 2006 page 1097 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.5
Port 5 Block Diagrams
Hardware standby
Reset R D Q P50DDR C WP5D
Internal data bus
SCI0 Serial transmit data Output enable
P50
Reset R Q D P50DR C WP5
RP5
Legend: WP5D: Write to P5DDR WP5: Write to port 5 RP5: Read port 5
Figure C.13 Port 5 Block Diagram (Pin P50)
Rev. 4.00 Sep 27, 2006 page 1098 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby Reset R D Q P51DDR C WP5D
Internal data bus
SCI0 Input enable Reset P51 R Q D P51DR C WP5
RP5
Legend: WP5D: Write to P5DDR WP5: Write to port 5 RP5: Read port 5
Serial receive data
Figure C.14 Port 5 Block Diagram (Pin P51)
Rev. 4.00 Sep 27, 2006 page 1099 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby Reset R D Q P52DDR C WP5D
*1
Reset P52 R Q D P52DR C WP5
*2
Internal data bus
SCI0 Input enable Clock output Output enable Clock input
IIC0 SCL0 output Transmit enable
RP5
SCL0 input Legend: WP5D: Write to P5DDR WP5: Write to port 5 RP5: Read port 5 Notes: 1. Output enable signal 2. Open drain control signal
Figure C.15 Port 5 Block Diagram (Pin P52)
Rev. 4.00 Sep 27, 2006 page 1100 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.6
Port 6 Block Diagrams
Reset R Q D KMPCR C RP6P Hardware standby WP6P Reset R D Q P6nDDR C WP6D
Reset P6n R Q D P6nDR C WP6
Internal data bus
16-bit FRT FTCI input FTIA input FTIB input FTID input Timer connection 8-bit timers Y, X HFBACKI input, TMIX input, VSYNCI input, TMIY input, VFBACKI input Key-sense interrupt input KMIMR0, 2, 3, 5 A/D converter Analog input
RP6
Legend: WP6P: Write to P6PCR WP6D: Write to P6DDR WP6: Write to port 6 RP6P: Read P6PCR RP6: Read port 6 Note: n = 0, 2, 3, 5
Figure C.16 Port 6 Block Diagram (Pins P60, P62, P63, P65)
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Appendix C I/O Port Block Diagrams
Reset R Q D KMPCR C RP6P Hardware standby WP6P Reset R D Q P61DDR C WP6D 16-bit FRT FTOA output Output enable Reset P61 R Q D P61DR C WP6
Internal data bus
Timer connection VSYNCO output Output enable Key-sense interrupt input KMIMR1 A/D converter Analog input
RP6
Legend: WP6P: Write to P6PCR WP6D: Write to P6DDR WP6: Write to port 6 RP6P: Read P6PCR RP6: Read port 6
Figure C.17 Port 6 Block Diagram (Pin P61)
Rev. 4.00 Sep 27, 2006 page 1102 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Reset R Q D KMPCR C RP6P Hardware standby WP6P Reset R D Q P64DDR C WP6D
Internal data bus
Timer connection CLAMPO output Output enable 16-bit FRT FTIC input Key-sense interrupt input KMIMR4 A/D converter Analog input
Reset P64 R Q D P64DR C WP6
RP6
Legend: WP6P: Write to P6PCR WP6D: Write to P6DDR WP6: Write to port 6 RP6P: Read P6PCR RP6: Read port 6
Figure C.18 Port 6 Block Diagram (Pin P64)
Rev. 4.00 Sep 27, 2006 page 1103 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Reset R Q D KMPCR C RP6P Hardware standby WP6P Reset R D Q P66DDR C WP6D
Internal data bus
16-bit FRT FTOB output Output enable
Reset P66 R Q D P66DR C WP6
RP6
KMIMR6
Other key-sense interrupt inputs
IRQ6 input IRQ6 enable A/D converter Analog input
Legend: WP6P: Write to P6PCR WP6D: Write to P6DDR WP6: Write to port 6 RP6P: Read P6PCR RP6: Read port 6
Figure C.19 Port 6 Block Diagram (Pin P66)
Rev. 4.00 Sep 27, 2006 page 1104 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Reset R Q D KMPCR C RP6P Hardware standby WP6P Reset R D Q P67DDR C WP6D
Internal data bus
8-bit timer X TMOX output Output enable KMIMR7 IRQ7 input IRQ7 enable A/D converter Analog input
Reset P67 R Q D P67DR C WP6
RP6
Other key-sense interrupt inputs
Legend: WP6P: Write to P6PCR WP6D: Write to P6DDR WP6: Write to port 6 RP6P: Read P6PCR RP6: Read port 6
Figure C.20 Port 6 Block Diagram (Pin P67)
Rev. 4.00 Sep 27, 2006 page 1105 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.7
Port 7 Block Diagrams
RP7 P7n
Internal data bus
A/D converter Analog input
Legend: RP7: Read port 7
Note: n = 0 to 5
Figure C.21 Port 7 Block Diagram (Pins P70 to P75)
RP7 P7n
Internal data bus
A/D converter Analog input D/A converter Output enable Analog output
Legend: RP7: Read port 7
Note: n = 6 or 7
Figure C.22 Port 7 Block Diagram (Pins P76, P77)
Rev. 4.00 Sep 27, 2006 page 1106 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.8
Port 8 Block Diagrams
Hardware standby
Reset R D Q P80DDR C WP8D
Reset P80 R Q D P80DR C WP8
RP8 HIF HA0 input Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.23 Port 8 Block Diagram (Pin P80)
Rev. 4.00 Sep 27, 2006 page 1107 of 1130 REJ09B0327-0400
Internal data bus
HI12E EXPE Mode 2, 3
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P81DDR C WP8D
Mode 2, 3 EXPE CS2E HI12E
Internal data bus
HIF GA20 output Output enable
Reset P81 R Q D P81DR C WP8
RP8 HIF CS2 input Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.24 Port 8 Block Diagram (Pin P81)
Rev. 4.00 Sep 27, 2006 page 1108 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P8nDDR C WP8D
Reset P8n R Q D P8nDR C WP8
RP8
Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8 Note: n = 2, 3
Mode 2, 3 EXPE HI12E
Figure C.25 Port 8 Block Diagram (Pins P82, P83)
Rev. 4.00 Sep 27, 2006 page 1109 of 1130 REJ09B0327-0400
Internal data bus
HIF HIFSD input (P82 only)
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P84DDR C WP8D
Internal data bus
SCI1 TxD1 Transmit enable
P84
Reset R Q D P84DR C WP8
RP8
IRQ3 input IRQ3 enable Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.26 Port 8 Block Diagram (Pin P84)
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Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P85DDR C WP8D
Internal data bus
SCI1 Input enable Serial receive data IRQ4 input IRQ4 enable
Reset P85 R Q D P85DR C WP8
RP8
Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8
Figure C.27 Port 8 Block Diagram (Pin P85)
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Appendix C I/O Port Block Diagrams
Hardware standby Reset R D Q P86DDR C WP8D
*1
Reset P86
*2
Internal data bus
SCI1 Input enable Clock output Output enable Clock input
Q D P86DR C WP8
R
IIC1 SCL1 output Transmit enable
RP8
SCL1 input Legend: WP8D: Write to P8DDR WP8: Write to port 8 RP8: Read port 8 Notes: 1. Output enable signal 2. Open drain control signal IRQ5 input IRQ5 enable
Figure C.28 Port 8 Block Diagram (Pin P86)
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Appendix C I/O Port Block Diagrams
C.9
Port 9 Block Diagrams
Hardware standby
EXPE Mode 2, 3 GA20 HI12E CS2E EXPE ABW
Reset R D Q P90DDR C WP9D
Internal data bus
Bus controller
LWR output
Reset P90 R Q D P90DR C WP9
RP9
HIF ECS2 input
A/D converter External trigger input
Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9
IRQ2 input
IRQ2 enable
Figure C.29 Port 9 Block Diagram (Pin P90)
Rev. 4.00 Sep 27, 2006 page 1113 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P9nDDR C WP9D
Reset P9n R Q D P9nDR C WP9
RP9
Internal data bus
IRQ1 input IRQ0 input IRQ1 enable IRQ0 enable
Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9
Note: n = 1 or 2
Figure C.30 Port 9 Block Diagram (Pins P91, P92)
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Appendix C I/O Port Block Diagrams
Hardware standby
Mode 2, 3 EXPE HI12E EXPE
Reset R D Q P9nDDR C WP9D
Internal data bus
Bus controller RD output HWR output AS/IOS output
Reset P9n R Q D P9nDR C WP9
RP9
HIF Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9
Note: n = 3 to 5
Mode 2, 3 EXPE HI12E
IOR input IOW input CS1 input
Figure C.31 Port 9 Block Diagram (Pins P93 to P95)
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Appendix C I/O Port Block Diagrams
Reset Mode 1
Hardware standby SR D Q P96DDR C Subclock input enable P96 WP9D ø output
RP9
Internal data bus
Subclock input
Legend: WP9D: Write to P9DDR RP9: Read port 9
Figure C.32 Port 9 Block Diagram (Pin P96)
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Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q P97DDR C WP9D
Internal data bus
Bus controller
Input enable *1
EXPE Reset R Q D P97DR C
WAIT input
P97
*2
WP9
IIC0 SDA0 output Transmit enable
RP9
SDA0 input Legend: WP9D: Write to P9DDR WP9: Write to port 9 RP9: Read port 9 Notes: 1. Output enable signal 2. Open drain control signal
Figure C.33 Port 9 Block Diagram (Pin P97)
Rev. 4.00 Sep 27, 2006 page 1117 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
C.10
Port A Block Diagrams
Hardware standby
Reset R D Q PAnDDR C WPAD
Mode 2 EXPE IOSE
PAn Reset R Q D PAnODR C WPA RPAO
RPA
Internal address bus
Internal data bus
Key-sense interrupt input KMIMR n+8 A/D converter Analog input Legend: WPAD: WPA: RPAO: RPA:
Write to PADDR Write to PAODR Read PAODR Read port A
Note: n = 0 or 1
Figure C.34 Port A Block Diagram (Pins PA0, PA1)
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Appendix C I/O Port Block Diagrams
Internal data bus
Hardware standby
Reset Mode 2 EXPE IOSE R D Q PAnDDR C WPAD
Internal address bus
Keyboard buffer controller Output enable Output
*1
PAn
*2
Reset R Q D PAnODR C RPAO WPA
RPA
Input Key-sense interrupt input KMIMR n+8 A/D converter Analog input Legend: WPAD: WPA: RPAO: RPA: Write to PADDR Write to PAODR Read PAODR Read port A
Notes: n = 2 or 3 1. Output enable signal 2. Open-drain control signal
Figure C.35 Port A Block Diagram (Pins PA2, PA3)
Rev. 4.00 Sep 27, 2006 page 1119 of 1130 REJ09B0327-0400
Appendix C I/O Port Block Diagrams
Internal data bus
Hardware standby
IICS Mode 2 EXPE IOSE
Reset R D Q PAnDDR C WPAD
Internal address bus
Keyboard buffer controller Output enable Output
*1
PAn
*2
Reset R Q D PAnODR C RPAO WPA
RPA
Input Key-sense interrupt input KMIMR n+8 A/D converter Analog input
Legend: WPAD: WPA: RPAO: RPA:
Write to PADDR Write to PAODR Read PAODR Read port A
Notes: n = 4 to 7 1. Output enable signal 2. Open-drain control signal
Figure C.36 Port A Block Diagram (Pins PA4 to PA7)
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Appendix C I/O Port Block Diagrams
C.11
Port B Block Diagram
Reset
Hardware standby
External address write EXPE ABW PBn
R D Q PBnDDR C WPBD (D0, D1) Reset Host interface R Q D PBnODR C RESOBF3, 4 (Reset HIRQ3, HIRQ4)
RPBO
WPB
External address read (D0, D1) RPB
Legend: WPBD: WPB: RPBO: RPB:
Write to PBDDR Write to PBODR Read PBODR Read port B
Note: n = 0, 1
Figure C.37 Port B Block Diagram (Pins PB0 and PB1)
Rev. 4.00 Sep 27, 2006 page 1121 of 1130 REJ09B0327-0400
Internal data bus
Appendix C I/O Port Block Diagrams
Hardware standby
Reset R D Q PBnDDR C WPBD (D2, D3) Reset R Q D PBnODR C RPBO WPB
External address write EXPE ABW PBn
External address read (D2, D3) RPB
Internal data bus
Mode 2, 3 EXPE CS input enable HI12E
HIF Legend: WPBD: Write to PBDDR WPB: Write to PBODR RPBO: Read PBODR RPB: Read port B Note: n = 2, 3 CS3 input CS4 input
Figure C.38 Port B Block Diagram (Pins PB2 and PB3)
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Appendix C I/O Port Block Diagrams
Hardware standby External address write EXPE ABW PBn
Reset R D Q PBnDDR C WPBD (D7 to D4) Reset R Q D PBnODR C RPBO WPB
External address read (D7 to D4) RPB
Legend: WPBD: Write to PBDDR WPB: Write to PBODR RPBO: Read PBODR RPB: Read port B Note: n = 4 to 7
Figure C.39 Port B Block Diagram (Pins PB4 to PB7)
Rev. 4.00 Sep 27, 2006 page 1123 of 1130 REJ09B0327-0400
Internal data bus
Appendix D Pin States
Appendix D Pin States
D.1 Port States in Each Processing State
I/O Port States in Each Processing State
Hardware Software MCU Operating Standby Standby Mode Reset Mode Mode 1 2, 3 (EXPE = 1) L T T keep* Watch Mode keep* Sleep Mode keep* Subsleep Mode keep* Subactive Mode A7 to A0 Address output/ input port I/O port L T T keep* keep* keep* keep* A15 to A8 Address output/ input port I/O port T T T T T T D15 to D8 Program Execution State A7 to A0 Address output/ input port I/O port A15 to A8 Address output/ input port I/O port D15 to D8
Table D.1
Port Name Pin Name Port 1 A7 to A0
2, 3 (EXPE = 0) Port 2 A15 to A8 1 2, 3 (EXPE = 1)
2, 3 (EXPE = 0) Port 3 D15 to D8 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 4 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 5 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 6 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 7 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 8 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 97 WAIT 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) keep keep keep T T T/keep T/keep T/keep T T keep keep keep keep T T T T T T T T keep keep keep keep T T keep keep keep keep T T keep keep keep keep keep keep keep keep
I/O port I/O port
I/O port I/O port
I/O port
I/O port
I/O port
I/O port
Input port
Input port
I/O port
I/O port
T/keep WAIT/ I/O port keep I/O port
WAIT/ I/O port I/O port
Rev. 4.00 Sep 27, 2006 page 1124 of 1130 REJ09B0327-0400
Appendix D Pin States
Hardware Software MCU Operating Standby Standby Mode Reset Mode Mode 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 95 to 93 AS, HWR, RD Port 92 to 91 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port 90 LWR 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port A A23 to A16 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) Port B D7 to D0 1 2, 3 (EXPE = 1) 2, 3 (EXPE = 0) keep keep keep T T T/keep T/keep T/keep T T keep keep* keep keep* keep keep* T T H/keep H/keep H/keep H/keep LWR/ I/O port keep keep* I/O port I/O port A23 to A16/ I/O port I/O port T/keep D7 to D0/ I/O port keep I/O port LWR/ I/O port I/O port I/O port A23 to A16/ I/O port I/O port D7 to D0/ I/O port I/O port T T H T keep keep keep keep keep keep keep keep T Clock T output T [DDR = 1] H [DDR = 0] T H H Subsleep Mode EXCL input Program Execution State Clock output/ EXCL input/ input port
Port Name Pin Name Port 96 φ EXCL
Watch Mode EXCL input
Sleep Mode [DDR = 1] clock output [DDR = 0] T H
Subactive Mode EXCL input
H
AS, HWR, RD I/O port I/O port
AS, HWR, RD I/O port I/O port
Legend: H: High L: Low T: High-impedance state keep: Input ports are in the high-impedance state (when DDR = 0 and PCR = 1, MOS input pullups remain on). Output ports maintain their previous state. Depending on the pins, the on-chip supporting modules may be initialized and the I/O port function determined by DDR and DR used. DDR: Data direction register Note: * In the case of address output, the last address accessed is retained.
Rev. 4.00 Sep 27, 2006 page 1125 of 1130 REJ09B0327-0400
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
E.1 Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10 system clock cycles before the STBY signal goes low, as shown in figure E.1. RES must remain low until STBY signal goes low (minimum delay from STBY low to RES high: 0 ns).
STBY t1 ≥ 10 tcyc RES t2 ≥ 0 ns
Figure E.1 Timing of Transition to Hardware Standby Mode (2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do not need to be retained, RES does not have to be driven low as in (1).
E.2
Timing of Recovery from Hardware Standby Mode
Drive the RES signal low at least 100 ns before STBY goes high to execute a reset.
STBY t ≥ 100 ns RES tOSC1
Figure E.2 Timing of Recovery from Hardware Standby Mode
Rev. 4.00 Sep 27, 2006 page 1126 of 1130 REJ09B0327-0400
Appendix F Product Code Lineup
Appendix F Product Code Lineup
Table F.1 H8S/2148 Group and H8S/2144 Group Product Code Lineup
Package (Package Code) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B)
Product Type H8S/2148 Group H8S/2148 Mask-ROM version Standard product (5-V version, 4-V version, 3-V version)
Product Code HD6432148S
Mark Code HD6432148S(V)(***)FA HD6432148S(V)(***)TE
Notes
Version with on-chip I2C bus interface (5-V version, 4-V version, 3-V version) F-ZTAT version Standard product (5-V version/4-V version)
HD6432148SW
HD6432148S(V)W(***)FA HD6432148S(V)W(***)TE
HD64F2148
HD64F2148FA20 HD64F2148TE20
Low-voltage version (3-V version)
HD64F2148V
HD64F2148VFA10 HD64F2148VTE10
H8S/2147
Mask-ROM version
Standard product (5-V version, 4-V version, 3-V version)
HD6432147S
HD6432147S(V)(***)FA HD6432147S(V)(***)TE
Version with on-chip I2C bus interface (5-V version, 4-V version, 3-V version) H8S/2148 Group A-mask version H8S/2148A F-ZTAT version A-mask version Standard product (5-V version/4-V version)
HD6432147SW
HD6432147S(V)W(***)FA HD6432147S(V)W(***)TE
HD64F2148A
HD64F2148AFA20 HD64F2148ATE20
Low-voltage version (3-V version)
HD64F2148AV
HD64F2148AVFA10 HD64F2148AVTE10
H8S/2147A
F-ZTAT version A-mask version
Standard product (5-V version/4-V version)
HD64F2147A
HD64F2147AFA20 HD64F2147ATE20
Low-voltage version (3-V version)
HD64F2147AV
HD64F2147AVFA10 HD64F2147AVTE10
Rev. 4.00 Sep 27, 2006 page 1127 of 1130 REJ09B0327-0400
Appendix F Product Code Lineup
Package (Package Code) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B)
Product Type H8S/2147N H8S/2147N F-ZTAT version Standard product (5-V version)
Product Code HD64F2147N
Mark Code HD64F2147NFA20 HD64F2147NTE20
Notes
Low-voltage version (3-V version)
HD64F2147NV
HD64F2147NVFA10 HD64F2147NVTE10
H8S/2144 Group
H8S/2144
Mask-ROM version
Standard product (5-V version, 4-V version, 3-V version)
HD6432144S
HD6432144S(V)(***)FA HD6432144S(V)(***)TE
F-ZTAT version
Standard product (5-V version/4-V version)
HD64F2144
HD64F2144FA20 HD64F2144TE20
Low-voltage version (3-V version)
HD64F2144V
HD64F2144VFA10 HD64F2144VTE10
H8S/2143
Mask-ROM version
Standard product (5-V version, 4-V version, 3-V version)
HD6432143S
HD6432143S(V)(***)FA HD6432143S(V)(***)TE
H8S/2142
Mask-ROM version
Standard product (5-V version, 4-V version, 3-V version)
HD6432142
HD6432142(***)FA HD6432142(***)TE
F-ZTAT version
Standard product (5-V version/4-V version)
HD64F2142R
HD64F2142RFA20 HD64F2142RTE20
Low-voltage version (3-V version)
HD64F2142RV
HD64F2142RVFA10 HD64F2142RVTE10
H8S/2144 Group A-mask version
H8S/2144A
F-ZTAT version A-mask version
Standard product (5-V version/4-V version)
HD64F2144A
HD64F2144AFA20 HD64F2144ATE20
Low-voltage version (3-V version)
HD64F2144AV
HD64F2144AVFA10 HD64F2144AVTE10
Note:
(***) is the ROM code. The F-ZTAT version of the H8S/2148 has an on-chip I2C bus interface as standard. The F-ZTAT 5 V/4 V version supports the operating ranges of the 5 V version and the 4 V version. The operating range of the F-ZTAT low-voltage version will be decided later. The above table includes products under development. Information on the status of individual products can be obtained from Renesas sales offices.
Rev. 4.00 Sep 27, 2006 page 1128 of 1130 REJ09B0327-0400
Appendix G Package Dimensions
Appendix G Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has priority.
JEITA Package Code P-QFP100-14x14-0.50 RENESAS Code PRQP0100KA-A Previous Code FP-100B/FP-100BV MASS[Typ.] 1.2g
HD
*1
D
75
51
76
50 bp b1
c1
NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
*2
HE
E
c
Terminal cross section
ZE
Reference Dimension in Millimeters Symbol
100
26
1 ZD
25
F
θ
A1
L L1
Detail F
e
*3
y
bp
x
M
D E A2 HD HE A A1 bp b1 c c1 θ e x y ZD ZE L L1
Nom Max 14 14 2.70 15.7 16.0 16.3 15.7 16.0 16.3 3.05 0.00 0.12 0.25 0.17 0.22 0.27 0.20 0.12 0.17 0.22 0.15 0° 8° 0.5 0.08 0.10 1.0 1.0 0.3 0.5 0.7 1.0
Min
A
A2
Figure G.1 Package Dimensions (FP-100B)
Rev. 4.00 Sep 27, 2006 page 1129 of 1130 REJ09B0327-0400
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Appendix G Package Dimensions
JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g
HD
*1
D 51
75
76
50
NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp b1
c1
*2
HE
E
c
Terminal cross section
ZE
Reference Dimension in Millimeters Symbol
100
26
A2
1 ZD Index mark
25
A
θ
F
A1
L L1
Detail F
e
*3
y
bp
x
M
D E A2 HD HE A A1 bp b1 c c1 θ e x y ZD ZE L L1
Nom Max 14 14 1.00 15.8 16.0 16.2 15.8 16.0 16.2 1.20 0.00 0.10 0.20 0.17 0.22 0.27 0.20 0.12 0.17 0.22 0.15 0° 8° 0.5 0.08 0.10 1.00 1.00 0.4 0.5 0.6 1.0
Min
Figure G.2 Package Dimensions (TFP-100B)
Rev. 4.00 Sep 27, 2006 page 1130 of 1130 REJ09B0327-0400
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Renesas 16-Bit Single-Chip Microcomputer Hardware Manual H8S/2148 Group, H8S/2144 Group, H8S/2148FZTAT™, H8S/2147N F-ZTAT™, H8S/2144F-ZTAT™, H8S/2142F-ZTAT™
Publication Date: 1st Edition, November 1999 Rev.4.00, September 27, 2006 Published by: Sales Strategic Planning Div. Renesas Technology Corp. Edited by: Customer Support Department Global Strategic Communication Div. Renesas Solutions Corp.
©2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
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H8S/2148 Group, H8S/2144 Group, H8S/2148F-ZTAT™, H8S/2147N F-ZTAT™, H8S/2144F-ZTAT™, H8S/2142F-ZTAT™ Hardware Manual
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