The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text.
16
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Hardware Manual Renesas 16-Bit Single-Chip Microcomputer H8S Family/H8S/2600 Series
Rev.8.00 2010.05
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
2.
3. 4.
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"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
9.
10.
11. 12.
(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description in the body of the manual takes precedence. 1. Handling of Unused Pins Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual. ⎯ The input pins of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an associated shoot-through current flows internally, and malfunctions may occur due to the false recognition of the pin state as an input signal. Unused pins should be handled as described under Handling of Unused Pins in the manual. 2. Processing at Power-on The state of the product is undefined at the moment when power is supplied. ⎯ The states of internal circuits in the LSI are indeterminate and the states of register settings and pins are undefined at the moment when power is supplied. In a finished product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the moment when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function are not guaranteed from the moment when power is supplied until the power reaches the level at which resetting has been specified. 3. Prohibition of Access to Reserved Addresses Access to reserved addresses is prohibited. ⎯ The reserved addresses are provided for the possible future expansion of functions. Do not access these addresses; the correct operation of LSI is not guaranteed if they are accessed. 4. Clock Signals After applying a reset, only release the reset line after the operating clock signal has become stable. When switching the clock signal during program execution, wait until the target clock signal has stabilized. ⎯ When the clock signal is generated with an external resonator (or from an external oscillator) during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover, when switching to a clock signal produced with an external resonator (or by an external oscillator) while program execution is in progress, wait until the target clock signal is stable. 5. Differences between Products Before changing from one product to another, i.e. to one with a different type number, confirm that the change will not lead to problems. ⎯ The characteristics of MPU/MCU in the same group but having different type numbers may differ because of the differences in internal memory capacity and layout pattern. When changing to products of different type numbers, implement a system-evaluation test for each of the products.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Preface
This LSI has the internal 32-bit H8S/2600 CPU and includes a variety of peripheral functions necessary for a system configuration. It serves as a high-performance microcomputer. The on-chip peripheral devices include a 16-bit timer pulse unit (TPU), a programmable pulse generator (PPG), a watchdog timer unit (WDT), a serial communication interface (SCI), an A/D converter, a motor control PWM timer (PWM), a PC brake controller and I/O ports. It also has an internal data transfer controller (DTC), which performs high-speed data transfer without using the CPU, thus enabling the use of the LSI as an embedded microcomputer in various advanced control systems. Two types of internal ROM are available: flash memory (F-ZTAT™*) and mask ROM. The LSI can be used flexibly in a wide range of applications from applied equipment with varied specifications and early production models to full-scale mass-produced products. Notes: The H8S/2635 and H8S/2634 are not equipped with a PPG, a PC brake controller, a DTC, or a D/A converter. * F-ZTAT is a trademark of Renesas Electronics Corp. Target users: This manual was written for users who will be using the H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 in the design of application systems. Members of this audience are expected to understand the fundamentals of electrical circuits, logical circuits, and microcomputers. Objective: This manual was written to explain the hardware functions and electrical characteristics of the H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 to the above audience. Refer to the H8S/2600 Series, H8S/2000 Series Software Manual for a detailed description of the instruction set.
Notes on reading this manual: • In order to understand the overall functions of the chip Read the manual according to the contents. This manual can be roughly categorized into parts on the CPU, system control functions, peripheral functions and electrical characteristics. • In order to understand the details of the CPU's functions Read the H8S/2600 Series, H8S/2000 Series Software Manual. • In order to understand the details of a register when its name is known The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal I/O Registers. Example: Bit order: The MSB is on the left and the LSB is on the right.
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page v of l
Related manuals:
The latest versions of all related manuals are available from our web site. Please ensure you have the latest versions of all documents you require. http://www.renesas.com/
H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635 Group Manuals:
Document Title H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635 Hardware Manual H8S/2600 Series, H8S/2000 Series Software Manual Document No. This manual REJ09B0139
User’s Manuals for Development Tools:
Document Title H8S, H8/300 Series C/C++ Compiler, Assembler, Optimized Linkage Editor User's Manual H8S, H8/300 Series Simulator/Debugger User's Manual High-performance Embedded Workshop User's Manual Document No. REJ10J2039 REJ10B0211 REJ10J2037
Application Notes:
Document Title H8S Family Technical Q & A Document No. REJ05B0397
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Main Revisions in This Edition
Item Figure 1-3 Pin Arrangement of H8S/2638 Group and H8S/2630 Group (FP-128B: Top View) Page Revision (See Manual for Details) Figure amended
Notes: 1. Connect a 0.1 µF capacitor between VCL and VSS (close to the pins). 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 3. These pins are used for the I2C bus interface. The I2C bus interface is available as an option. The product equipped with the I2C bus interface is the W-mask version. 4. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
1.3.1 Pin Arrangement 10
(U-Mask Version) 64F2638F20 H8S/2638
INDEX INDEX
(W-Mask Version) 64F2638F20 H8S/2638 W
INDEX
64F2638F20 H8S/2638 U
(U-Mask Version) 64F2630F20 H8S/2630
INDEX INDEX
(W-Mask Version) 64F2630F20 H8S/2630 W
INDEX
64F2630F20 H8S/2630 U
1.4 Differences between H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 Table 1-4 Comparison of Product Specifications
23 to 24 Table amended
Part No.
Model ROM RAM
24
Note amended Note: * For details of the H8S/2639, H8S/2635, and H8S/2634 clock pulse generator, see section 22B, Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group).
2.4.3 Control Registers (3) Condition-Code Register (CCR) Bit 0—Carry Flag (C): 2.5.2 Memory Data Formats Figure 2-11 Memory Data Formats
38
Description amended Some instructions leave some or all of the flag bits unchanged. For the action of each instruction on the flag bits, refer to appendix A.1, Instruction List.
41
Figure replaced
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Item 2.6.3 Table of Instructions Classified by Function Table 2-3 Instructions Classified by Function
Page 50
Revision (See Manual for Details) Table amended
Type Bitmanipulation instructions Instruction BOR Size*1 B Function C ∨ ( of ) → C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ∨ [ ¬ ( of ) ] → C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
BIOR
B
2.8.1 Overview Figure 2-14 Processing States
63
Figure amended
Reset state The CPU and all on-chip supporting modules have been initialized and are stopped. Exception-handling state A transient state in which the CPU changes the normal processing flow in response to a reset, trace, interrupt, or trap instruction.
2.8.3 ExceptionHandling State
65
Description amended The exception-handling state is a transient state that occurs when the CPU alters the normal processing flow due to a reset, trace, interrupt, or trap instruction. The CPU fetches a start address (vector) from the exception vector table and branches to that address.
3.4 Pin Functions in Each Operating Mode Table 3-3 Pin Functions in Each Mode 4.1.1 Exception Handling Types and Priority
86
Table amended
Port Port F PF7 PF6 to PF4 PF3 Mode 4 P/C* C P/C* Mode 5 P/C* C P*/C Mode 6 P/C* C P*/C Mode 7 P*/C P
93
Description amended As table 4-1 indicates, exception handling may be caused by a reset, trace, direct transition*, trap instruction, or interrupt. Exception handling is prioritized as shown in table 4-1. Figure amended
Vector fetch
Prefetch of first program instruction
4.2.2 Reset Sequence 97 Figure 4-2 Reset Sequence (Modes 6 and 7)
φ
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 4.7 Notes on Use of the Stack Figure 4-6 Operation when SP Value Is Odd
Page 103
Revision (See Manual for Details) Figure amended
CCR SP PC
SP
R1L PC
SP
H'FFFEFA H'FFFEFB H'FFFEFC H'FFFEFD H'FFFEFE H'FFFEFF
TRAPA instruction executed
MOV.B R1L, @−ER7
5.4.3 Interrupt Control 127 Mode 2 Figure 5-6 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 2
Figure amended
Save PC, CCR, and EXR Hold pending
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
9.8.3 Pin Functions for 279 Each Mode Figure 9-12 Port C Pin Functions (Modes 4 and 5)
Figure amended
A7 (output) A6 (output) A5 (output) Port C A4 (output) A3 (output) A2 (output) A1 (output) A0 (output)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Item
Page
Revision (See Manual for Details) Figure amended
PCDDR = 1 A7 (output) A6 (output) A5 (output) Port C A4 (output) A3 (output) A2 (output) A1 (output) A0 (output) PCDDR = 0 PC7 (input) PC6 (input) PC5 (input) PC4 (input) PC3 (input) PC2 (input) PC1 (input) PC0 (input)
9.8.3 Pin Functions for 279 Each Mode Figure 9-13 Port C Pin Functions (Mode 6)
Figure 9-14 Port C Pin 280 Functions (Mode 7)
Figure amended
PC7 (I/O) PC6 (I/O) PC5 (I/O) Port C PC4 (I/O) PC3 (I/O) PC2 (I/O) PC1 (I/O) PC0 (I/O)
10.6.2 Interrupt Signal 387 Timing Status Flag Clearing Timing: 10.7 Usage Notes Interrupts and Module Stop Mode: 13.2.6 Serial Control Register (SCR) Bits 1 and 0 458 397
Note amended Note: * The DTC is not implemented in the H8S/2635 Group.
Note amended Note: * The DTC is not implemented in the H8S/2635 Group. Description amended For details of clock source selection, see table 13.9 .
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 13.5 Usage Notes Restrictions on Use of DTC* Operation in Case of Mode Transition • Transmission 14.1.1 Features 14.2.2 Serial Status Register (SSR)
Page 507
Revision (See Manual for Details) Note amended Note: * The DTC is not implemented in the H8S/2635 Group. Note amended Note: * The DTC is not implemented in the H8S/2635 Group.
513 520
Note amended Note: * The DTC is not implemented in the H8S/2635 Group. Table amended
Bit 2 TEND 0 Description Transmission is in progress [Clearing conditions] • • 1 When 0 is written to TDRE after reading TDRE = 1 When the DTC is activated by a TXI interrupt and write data to TDR (Initial value)
Transmission has ended [Setting conditions] • • • • • • Upon reset, and in standby mode or module stop mode When the TE bit in SCR is 0 and the ERS bit is also 0
When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1
14.3.6 Data Transfer Operations Serial Data Transmission (Except Block Transfer Mode):
533
Notes amended Notes: * The DTC is not implemented in the H8S/2635 Group.
Serial Data Reception 537 (Except Block Transfer Mode): Data Transfer Operation by DTC*: 14.4 Usage Notes Retransfer Operations (Except Block Transfer Mode): • Retransfer operation when SCI is in receive mode
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Notes amended Notes: * The DTC is not implemented in the H8S/2635 Group. Notes amended Notes: * The DTC is not implemented in the H8S/2635 Group. Note amended Note: * The DTC is not implemented in the H8S/2635 Group.
539 543
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Item 14.4 Usage Notes Retransfer Operations (Except Block Transfer Mode): • Retransfer operation when SCI is transmit mode 15.2.9 Module Stop Control Register B (MSTPCRB)
Page 544
Revision (See Manual for Details) Note amended Note: * The DTC is not implemented in the H8S/2635 Group.
575
Description amended MSTPCRB is initialized to H'FF by a power-on reset and in hardware standby mode. It is not initialized in software standby mode. Figure amended
ICDRS
Data 1 Data 2
15.3.6 Slave Transmit 594 Operation Figure 15-18 Example of Slave Transmit Mode Operation Timing (MLS = 0) 16.1.3 Pin Configuration Table 16-1 HCAN Pins 16.1.4 Register Configuration Table 16-2 HCAN Registers 16.2.4 Mailbox Configuration Register (MBCR) 624 618 614
User processing
[3] IRIC clearance
[3] ICDR write
[3] ICDR write
[5] IRIC clearance
[5] ICDR write
Note amended Note: * The HCAN1 is not supported by the H8S/2635 Group. Notes amended Notes: 2. The HCAN1 is not supported by the H8S/2635 Group. Table amended
Bit y: MBCRx 0 1 Description Corresponding mailbox is set for transmission Corresponding mailbox is set for reception (x = 15 to 1, y = 15 to 9 and 7 to 0) (Initial value)
16.2.5 Transmit Wait Register (TXPR)
625
Table amended
Bit y: TXPRx 0 Description Transmit message idle state in corresponding mailbox [Clearing condition] • 1 Message transmission completion and cancellation completion Transmit message transmit wait in corresponding mailbox (CAN bus arbitration) (x = 15 to 1, y = 15 to 9 and 7 to 0) (Initial value)
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 16.2.6 Transmit Wait Cancel Register (TXCR)
Page 626
Revision (See Manual for Details) Table amended
Bit y: TXCRx 0 Description Transmit message cancellation idle state in corresponding mailbox (Initial value) [Clearing condition] • 1 Completion of TXPR clearing (when transmit message is canceled normally) (x = 15 to 1, y = 15 to 9 and 7 to 0)
TXPR cleared for corresponding mailbox (transmit message cancellation)
16.2.7 Transmit Acknowledge Register (TXACK)
627
Table amended
Bit y: TXACKx 0 1 Description [Clearing condition] • Writing 1 (Initial value) Completion of message transmission for corresponding mailbox (x = 15 to 1, y = 15 to 9 and 7 to 0)
16.2.8 Abort Acknowledge Register (ABACK)
628
Table amended
Bit y: ABACKx 0 1 Description [Clearing condition] • Writing 1 (Initial value) Completion of transmit message cancellation for corresponding mailbox (x = 15 to 1, y = 15 to 9 and 7 to 0)
16.2.16 Unread Message Status Register (UMSR)
641
Table amended
Bit x: UMSRx 0 1 Description [Clearing condition] • Writing 1 (Initial value) Unread receive message is overwritten by a new message [Setting condition] • When a new message is received before RXPR is cleared (x = 15 to 0)
16.2.17 Local Acceptance Filter Masks (LAFML, LAFMH) LAFMH Bits 7 to 0 and 15 to 13 LAFMH Bits 9 and 8, LAFML Bits 15 to 0
643
Table amended
Bit x: LAFMHx 0 Description Stored in MC0 and MD0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Initial value) Stored in MC0 and MD0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (x = 15 to 5)
1
Table amended
Bit y: LAFMHx LAFMLy 0 1 Description Stored in MC0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Initial value) Stored in MC0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (x = 1 and 0, y = 15 to 0)
16.2.20 Module Stop Control Register C (MSTPCRC)
650
Note amended Note: * The MSTPC2 is not available and is reserved in the H8S/2635 Group.
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Item 16.2.20 Module Stop Control Register C (MSTPCRC) Bit 2—Module Stop (MSTPC2)*: 16.3.2 Initialization after Hardware Reset Table 16-3 BCR Register Value Setting Ranges
Page 650
Revision (See Manual for Details) Note amended Note: * The MSTPC2 is not available and is reserved in the H8S/2635 Group.
655
Table amended
Name Time segment 1 Time segment 2 Baud rate prescaler Sample point Synchronization jump width Abbreviation TSEG1 TSEG2 BRP SAM SJW Min. Value B'0011 B'001 B'000000 B'0 B'00 Max. Value B'1111 B'111 B'111111 B'1 B'11
Table 16-4 Setting Range for TSEG1 and TSEG2 in BCR
657
Note amended Notes: The time quanta value for TSEG1 and TSEG2 is the TSEG value + 1. * Only a value other than BRP[13:8] = B'000000 can be set.
16.3.8 DTC Interface* 675 17.6 Usage Notes Figure 17-7 Example of Analog Input Protection Circuit 700
Note amended Note: * The DTC is not implemented in the H8S/2635 Group. Figure amended
AVCC
Vref Rin* 2 *1 *1 0.1 μF 100Ω AN0 to AN11
AVSS
18.3 Operation Figure 18-2 D/A Conversion (Example)
711
Figure amended
DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle
φ
Address
DADR0
Conversion data (1)
Conversion data (2)
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Item 21A.4.3 Mode Transitions Figure 21A-3 Flash Memory State Transitions 21A.5 Pin Configuration Table 21A-5 Pin Configuration
Page 749
Revision (See Manual for Details) Notes amended Notes: 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
755
Table amended
Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Port F0 Port 16 Port 14 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 PF0 P16 P14 TxD1 RxD1 I/O Input Input Input Input Input Input Input Input Output Input Function Reset Flash program/erase protection by hardware Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Serial transmit data output Serial receive data input
21A.9.2 ProgramVerify Mode Figure 21A-12 Program/ProgramVerify Flowchart 21A.9.3 Erase Mode
777
Figure amended
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
778
Description amended The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.1.7, Flash Memory Characteristics. … Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period.
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Item 21A.9.4 Erase-Verify Mode Figure 21A-13 Erase/Erase-Verify Flowchart
Page 780
Revision (See Manual for Details) Figure amended
Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs NG
*4 *5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs End of erasing
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
21A.13 Mode
Programmer 787 801
Title amended and description replaced Notes amended Notes: 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
21B.4.3 Mode Transitions Figure 21B-3 Flash Memory State Transitions
21B.7.6 Flash Memory 816 Power Control Register (FLPWCR)
Note amended Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions.
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Item
Page
Revision (See Manual for Details) Description amended The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
21B.9.1 Program Mode 826
21B.9.2 ProgramVerify Mode Figure 21B-12 Program/ProgramVerify Flowchart 21B.9.3 Erase Mode
830
Figure amended
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
831
Description amended The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.2.7 and 24.3.7, Flash Memory Characteristics. … Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period.
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Page xvii of l
Item 21B.9.4 Erase-Verify Mode Figure 21B-13 Erase/Erase-Verify Flowchart
Page 832
Revision (See Manual for Details) Figure amended
Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs
NG
*4
*5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
Wait (tcswe) μs End of erasing
21B.13 Mode
Programmer 840
Title amended and description replaced Notes amended Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with other versions.
21B.14 Flash Memory 841 and Power-Down States Table 21B-14 Flash Memory Operating States
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 21C.4.3 Mode Transitions Figure 21C-3 Flash Memory State Transitions 21C.9.1 Program Mode
Page 855
Revision (See Manual for Details) Notes amended Notes: 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
880
Description amended The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
21C.9.2 ProgramVerify Mode Figure 21C-12 Program/ProgramVerify Flowchart 21C.9.3 Erase Mode
884
Figure amended
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
885
Description amended The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.2.7 and 24.3.7, Flash Memory Characteristics. … Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period.
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Page xix of l
Item 21C.9.4 Erase-Verify Mode Figure 21C-13 Erase/Erase-Verify Flowchart
Page 886
Revision (See Manual for Details) Figure amended
Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs
NG
*4
*5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
Wait (tcswe) μs End of erasing
21C.13 Mode
Programmer 894 925
Title amended and description replaced Notes amended Notes: 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group. These functions cannot be used with the other versions.
23A.1 Overview
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item Section 23B PowerDown Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F] 23B.1 Overview Table 23B-2 LSI Internal States in Each Mode (H8S/2639 Group, H8S/2635 Group) 23B.6.5 Usage Notes
Page 947
Revision (See Manual for Details) Note amended Note: The DTC, PBC, PPB, and D/A converter are not implemented in the H8S/2635 Group.
950
Notes amended Notes: 3. The DTC, PBC, PPG, DA0, and DA1 are not implemented in the H8S/2635 Group.
970
Description amended Write Data Buffer Function: The write data buffer function and software standby mode cannot be used at the same time. When the write data buffer function is used, the WDBE bit in BCRL should be cleared to 0 to cancel the write data buffer function before entering software standby mode. Also check that external writes have finished, by reading external addresses, etc., before executing a SLEEP instruction to enter software standby mode. See section 7.7, Write Data Buffer Function, for details of the write data buffer function.
24.1.3 DC Characteristics Table 24-2 DC Characteristics
981
Table amended
Item Schmitt trigger input voltage Symbol IRQ0 to IRQ5 VT– VT+ Min. 1.0 — Typ. — — — Max. — VCC × 0.7 — Unit V Test Conditions
VT+ – VT– 0.4
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Item 24.1.3 DC Characteristics Table 24-2 DC Characteristics
Page 982
Revision (See Manual for Details) Table amended
Item Input leakage current RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9 Symbol | Iin | Min. — — — — Typ. — — — — Max. 1.0 1.0 1.0 1.0 Vin = 0.5 V to AVCC – 0.5 V Unit μA Test Conditions Vin = 0.5 V to VCC – 0.5 V
24.1.4 AC Characteristics Figure 24-2 Output Load Circuit
985
Figure amended
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
24.2.3 DC Characteristics Table 24-12 DC Characteristics
996
Table amended
Item Schmitt trigger input voltage Symbol IRQ0 to IRQ5 VT– VT+ Min. 1.0 — Typ. — — — Max. — VCC × 0.7 — Unit V Test Conditions
VT+ – VT– 0.4
997
Table amended
Item Input leakage current RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9 Symbol | Iin | Min. — — — — Typ. — — — — Max. 1.0 1.0 1.0 1.0 Vin = 0.5 V to AVCC – 0.5 V Unit μA Test Conditions Vin = 0.5 V to VCC – 0.5 V
Page xxii of l
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 24.2.4 AC Characteristics Figure 24-4 Output Load Circuit
Page 1002
Revision (See Manual for Details) Figure amended
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
24.3.3 DC Characteristics Table 24-24 DC Characteristics
1014
Table amended
Item Schmitt trigger input voltage Symbol IRQ0 to IRQ5 VT– VT+ Min. 1.0 — Typ. — — — Max. — VCC × 0.7 — Unit V Test Conditions
VT+ – VT– 0.4
1015
Table amended
Item Input leakage current RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1*7, FWE Ports 4, 9 Symbol | Iin | Min. — — — Typ. — — — Max. 1.0 1.0 1.0 Unit μA Test Conditions Vin = 0.5 V to VCC – 0.5 V
—
—
1.0
Vin = 0.5 V to AVCC – 0.5 V
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page xxiii of l
Item 24.3.4 AC Characteristics Figure 24-6 Output Load Circuit
Page 1020
Revision (See Manual for Details) Figure amended
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
24.4.3 DC Characteristics Table 24-36 DC Characteristics
1032
Table amended
Item Schmitt trigger input voltage Symbol IRQ0 to IRQ5 VT– VT+ Min. 1.0 — Typ. — — — Max. — VCC × 0.7 — Unit V Test Conditions
VT+ – VT– 0.4
1033
Table amended
Item Input leakage current RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9 Symbol | Iin | Min. — — — — Typ. — — — — Max. 1.0 1.0 1.0 1.0 Vin = 0.5 V to AVCC – 0.5 V Unit μA Test Conditions Vin = 0.5 V to VCC – 0.5 V
Page xxiv of l
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item 24.4.4 AC Characteristics Figure 24-8 Output Load Circuit
Page 1038
Revision (See Manual for Details) Figure amended
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
24.5.4 On-Chip Supporting Module Timing Figure 24-27 HCAN Input/Output Timing
1055
Note amended Note: * The PPG output is not implemented in the H8S/2635 Group.
1057
Figure amended
CK
tHTXD HTxD0, HTxD1 (transmit data) tHRXS tHRXH HRxD0, HRxD1 (receive data)
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Page xxv of l
Item A.1 Instruction List Table A-1 Instruction Set (2) Arithmetic Instructions
Page 1065
Revision (See Manual for Details) Table amended
No. of States*1 Mnemonic MULXU MULXU.B Rs,Rd MULXU.W Rs,ERd Advanced 12 20
MULXS
MULXS.B Rs,Rd MULXS.W Rs,ERd
13 21
(6) Branch Instructions 1078
Table amended
Addressing Mode/ Instruction Length (Bytes)
Operand Size #xx Rn @ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
Operation
Branching Condition
Mnemonic Bcc BVS d:8 BVS d:16 BPL d:8 BPL d:16
⎯ ⎯ ⎯ ⎯
2 4 2 4
if condition is true then V=1 PC←PC+d else next; N=0
(7) System Control Instructions
1080
Table amended
No. of States*1 Mnemonic
TRAPA TRAPA #xx:2
Advanced
8 [9]
RTE
RTE
5 [9]
A.4 Number of States 1109 Required for Instruction Execution Table A-5 Number of Cycles in Instruction Execution
Table amended
Branch Instruction Address Read Fetch I JMP JMP @ERn JMP @aa:24 JMP @@aa:8 2 2 2 2 1 1 J Byte Data Stack Operation Access K L Word Data Access M Internal Operation N
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Item
Page
Revision (See Manual for Details) Table amended
Branch Instruction Address Read Fetch I MOV MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd 4 1 1 2 3 2 1 1 2 4 1 2 3 1 1 1 1 1 1 1 1 1 1 1 J Byte Data Stack Operation Access K L 1 1 1 1 1 Word Data Access M Internal Operation N 1
A.4 Number of States 1110 Required for Instruction Execution Table A-5 Number of Cycles in Instruction Execution
1111
Table amended
Branch Instruction Address Read Fetch I MOV MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 2 4 1 2 3 J Byte Data Stack Operation Access K L Word Data Access M 1 1 1 1 Internal Operation N
Appendix B Internal I/O Register B.2 Functions GSR0—General Status Register GSR1—General Status Register
1136 to 1421 1163
Note amended H8S/2635 and H8S/2634 → H8S/2635 Group Figure amended
Bit Initial value Read/Write 7 ⎯ 0 R 6 ⎯ 0 R 5 ⎯ 0 R 4 ⎯ 0 R 3 GSR3 1 R 2 GSR2 1 R 1 GSR1 0 R 0 GSR0 0 R
Bus Off Flag 0 [Reset condition] • Recovery from bus off state 1 When TEC ≥ 256 (bus off state) Transmit/Receive Warning Flag 0 [Reset condition] • When TEC < 96 and REC < 96 or TEC ≥ 256 1 When TEC ≥ 96 or REC ≥ 96
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Page xxvii of l
Item B.2 Functions PFCR—Pin Function Control Register
Page 1317
Revision (See Manual for Details) Figure amended
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 AE3 1/0 R/W 2 AE2 1/0 R/W 1 AE1 1 R/W 0 AE0 1/0 R/W
Address Output Enable 3 to 0 0 0 0 0 1 A8 to A23 address output disabled (Initial value*) A8 address output enabled; A9 to A23 address output disabled
DACR01— D/A Control 1414 Register 01 Appendix C I/O Port Block Diagrams C.1 Port 1 Block Diagrams Figure C-1 (a) Port 1 Block Diagram (Pins P10 and P11) D.1 Port States in Each Mode Table D-1 I/O Port States in Each Processing State 1454 1422 to 1451 1422
Note amended Note: * This register is not available in the H8S/2635 Group. Note amended H8S/2635 and H8S/2634 → H8S/2635 Group Notes amended Notes: 1. Priority order: Address output > output compare output/PWM output > pulse output > DR output
Table amended
MCU Port Name Operating Pin Name Mode PF3/LWR 4 5 to 6 Reset H T Hardware Standby Mode T Software Standby Mode [OPE = 0] T [OPE = 1] H Program Execution State Sleep Mode LWR [16 Bit bus mode] LWR [Otherwise] I/O port
Appendix F Product Code Lineup Table F-1 H8S/2636, H8S/2638, H8S/2639, and H8S/2630 Product Code Lineup Appendix G Package Dimensions
1456 to 1457
Table amended
Product Type Part No. Mark Code Functions Packages
1458
Description added The package dimension that is shown in the Renesas Semiconductor Package Data Book has Priority.
All trademarks and registered trademarks are the property of their respective owners.
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
Contents
Section 1 Overview ............................................................................................................. 1
1.1 1.2 1.3 Overview........................................................................................................................... 1 Internal Block Diagram..................................................................................................... 6 Pin Description.................................................................................................................. 9 1.3.1 Pin Arrangement .................................................................................................. 9 1.3.2 Pin Functions in Each Operating Mode ............................................................... 13 1.3.3 Pin Functions ....................................................................................................... 18 Differences between H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 .......................................................................................................................... 23
1.4
Section 2 CPU ...................................................................................................................... 25
2.1 Overview........................................................................................................................... 25 2.1.1 Features................................................................................................................ 25 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU .................................. 26 2.1.3 Differences from H8/300 CPU ............................................................................ 27 2.1.4 Differences from H8/300H CPU.......................................................................... 28 CPU Operating Modes ...................................................................................................... 28 Address Space................................................................................................................... 33 Register Configuration...................................................................................................... 34 2.4.1 Overview.............................................................................................................. 34 2.4.2 General Registers ................................................................................................. 35 2.4.3 Control Registers ................................................................................................. 36 2.4.4 Initial Register Values.......................................................................................... 38 Data Formats..................................................................................................................... 39 2.5.1 General Register Data Formats ............................................................................ 39 2.5.2 Memory Data Formats ......................................................................................... 41 Instruction Set ................................................................................................................... 42 2.6.1 Overview.............................................................................................................. 42 2.6.2 Instructions and Addressing Modes..................................................................... 43 2.6.3 Table of Instructions Classified by Function ....................................................... 45 2.6.4 Basic Instruction Formats .................................................................................... 54 Addressing Modes and Effective Address Calculation ..................................................... 56 2.7.1 Addressing Mode................................................................................................. 56 2.7.2 Effective Address Calculation ............................................................................. 59 Processing States............................................................................................................... 63 2.8.1 Overview.............................................................................................................. 63 2.8.2 Reset State ........................................................................................................... 64
2.2 2.3 2.4
2.5
2.6
2.7
2.8
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2.8.3 Exception-Handling State .................................................................................... 65 2.8.4 Program Execution State ..................................................................................... 68 2.8.5 Bus-Released State .............................................................................................. 68 2.8.6 Power-Down State ............................................................................................... 68 2.9 Basic Timing..................................................................................................................... 69 2.9.1 Overview ............................................................................................................. 69 2.9.2 On-Chip Memory (ROM, RAM) ......................................................................... 69 2.9.3 On-Chip Supporting Module Access Timing ...................................................... 71 2.9.4 On-Chip HCAN Module Access Timing............................................................. 73 2.9.5 Port H and J Register Access Timing .................................................................. 75 2.9.6 External Address Space Access Timing .............................................................. 76 2.10 Usage Note........................................................................................................................ 77 2.10.1 TAS Instruction ................................................................................................... 77 2.10.2 STM/LDM Instructions ....................................................................................... 77 2.10.3 Caution to Observe when Using Bit Manipulation Instructions .......................... 77
Section 3 MCU Operating Modes .................................................................................. 79
3.1 Overview........................................................................................................................... 79 3.1.1 Operating Mode Selection ................................................................................... 79 3.1.2 Register Configuration......................................................................................... 80 Register Descriptions ........................................................................................................ 80 3.2.1 Mode Control Register (MDCR) ......................................................................... 80 3.2.2 System Control Register (SYSCR) ...................................................................... 81 3.2.3 Pin Function Control Register (PFCR) ................................................................ 83 Operating Mode Descriptions ........................................................................................... 85 3.3.1 Mode 4................................................................................................................. 85 3.3.2 Mode 5................................................................................................................. 85 3.3.3 Mode 6................................................................................................................. 85 3.3.4 Mode 7................................................................................................................. 86 Pin Functions in Each Operating Mode ............................................................................ 86 Address Map in Each Operating Mode............................................................................. 87
3.2
3.3
3.4 3.5
Section 4 Exception Handling ......................................................................................... 93
4.1 Overview........................................................................................................................... 93 4.1.1 Exception Handling Types and Priority............................................................... 93 4.1.2 Exception Handling Operation ............................................................................ 94 4.1.3 Exception Vector Table ....................................................................................... 94 Reset ................................................................................................................................. 96 4.2.1 Overview ............................................................................................................. 96 4.2.2 Reset Sequence .................................................................................................... 96
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4.2
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4.3 4.4 4.5 4.6 4.7
4.2.3 Interrupts after Reset............................................................................................ 98 4.2.4 State of On-Chip Supporting Modules after Reset Release ................................. 99 Traces................................................................................................................................ 99 Interrupts ........................................................................................................................... 100 Trap Instruction................................................................................................................. 101 Stack Status after Exception Handling.............................................................................. 102 Notes on Use of the Stack ................................................................................................. 103
Section 5 Interrupt Controller .......................................................................................... 105
5.1 Overview........................................................................................................................... 105 5.1.1 Features................................................................................................................ 105 5.1.2 Block Diagram..................................................................................................... 106 5.1.3 Pin Configuration................................................................................................. 107 5.1.4 Register Configuration......................................................................................... 107 Register Descriptions ........................................................................................................ 108 5.2.1 System Control Register (SYSCR) ...................................................................... 108 5.2.2 Interrupt Priority Registers A to H, J to M (IPRA to IPRH, IPRJ to IPRM) ....... 109 5.2.3 IRQ Enable Register (IER) .................................................................................. 110 5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL)..................................... 111 5.2.5 IRQ Status Register (ISR).................................................................................... 112 Interrupt Sources ............................................................................................................... 114 5.3.1 External Interrupts ............................................................................................... 114 5.3.2 Internal Interrupts ................................................................................................ 116 5.3.3 Interrupt Exception Handling Vector Table......................................................... 116 Interrupt Operation............................................................................................................ 120 5.4.1 Interrupt Control Modes and Interrupt Operation ................................................ 120 5.4.2 Interrupt Control Mode 0 ..................................................................................... 124 5.4.3 Interrupt Control Mode 2 ..................................................................................... 126 5.4.4 Interrupt Exception Handling Sequence .............................................................. 128 5.4.5 Interrupt Response Times .................................................................................... 129 Usage Notes ...................................................................................................................... 130 5.5.1 Contention between Interrupt Generation and Disabling..................................... 130 5.5.2 Instructions that Disable Interrupts ...................................................................... 131 5.5.3 Times when Interrupts Are Disabled ................................................................... 131 5.5.4 Interrupts during Execution of EEPMOV Instruction.......................................... 132 5.5.5 IRQ Interrupts ...................................................................................................... 132 5.5.6 Notes on Use of NMI Interrupt ............................................................................ 132 DTC Activation by Interrupt............................................................................................. 133 5.6.1 Overview.............................................................................................................. 133 5.6.2 Block Diagram..................................................................................................... 133
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5.2
5.3
5.4
5.5
5.6
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5.6.3
Operation ............................................................................................................. 134
Section 6 PC Break Controller (PBC) ........................................................................... 137
6.1 Overview........................................................................................................................... 137 6.1.1 Features................................................................................................................ 137 6.1.2 Block Diagram..................................................................................................... 138 6.1.3 Register Configuration......................................................................................... 139 Register Descriptions ........................................................................................................ 139 6.2.1 Break Address Register A (BARA) ..................................................................... 139 6.2.2 Break Address Register B (BARB) ..................................................................... 140 6.2.3 Break Control Register A (BCRA) ...................................................................... 140 6.2.4 Break Control Register B (BCRB) ...................................................................... 142 6.2.5 Module Stop Control Register C (MSTPCRC).................................................... 142 Operation .......................................................................................................................... 143 6.3.1 PC Break Interrupt Due to Instruction Fetch ....................................................... 143 6.3.2 PC Break Interrupt Due to Data Access............................................................... 144 6.3.3 Notes on PC Break Interrupt Handling ................................................................ 144 6.3.4 Operation in Transitions to Power-Down Modes ................................................ 145 6.3.5 PC Break Operation in Continuous Data Transfer............................................... 146 6.3.6 When Instruction Execution Is Delayed by One State......................................... 147 6.3.7 Additional Notes .................................................................................................. 148
6.2
6.3
Section 7 Bus Controller ................................................................................................... 149
7.1 Overview........................................................................................................................... 149 7.1.1 Features................................................................................................................ 149 7.1.2 Block Diagram..................................................................................................... 150 7.1.3 Pin Configuration................................................................................................. 151 7.1.4 Register Configuration......................................................................................... 151 Register Descriptions ........................................................................................................ 152 7.2.1 Bus Width Control Register (ABWCR)............................................................... 152 7.2.2 Access State Control Register (ASTCR) ............................................................. 153 7.2.3 Wait Control Registers H and L (WCRH, WCRL).............................................. 154 7.2.4 Bus Control Register H (BCRH) ......................................................................... 158 7.2.5 Bus Control Register L (BCRL) .......................................................................... 160 7.2.6 Pin Function Control Register (PFCR) ................................................................ 161 Overview of Bus Control .................................................................................................. 163 7.3.1 Area Partitioning.................................................................................................. 163 7.3.2 Bus Specifications ............................................................................................... 164 7.3.3 Memory Interfaces............................................................................................... 165 7.3.4 Interface Specifications for Each Area ................................................................ 166
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7.2
7.3
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7.4
7.5
7.6
7.7 7.8
7.9
Basic Bus Interface ........................................................................................................... 167 7.4.1 Overview.............................................................................................................. 167 7.4.2 Data Size and Data Alignment............................................................................. 167 7.4.3 Valid Strobes........................................................................................................ 169 7.4.4 Basic Timing........................................................................................................ 170 7.4.5 Wait Control ........................................................................................................ 178 Burst ROM Interface......................................................................................................... 179 7.5.1 Overview.............................................................................................................. 179 7.5.2 Basic Timing........................................................................................................ 179 7.5.3 Wait Control ........................................................................................................ 181 Idle Cycle .......................................................................................................................... 181 7.6.1 Operation ............................................................................................................. 181 7.6.2 Pin States During Idle Cycles .............................................................................. 185 Write Data Buffer Function .............................................................................................. 186 Bus Arbitration.................................................................................................................. 187 7.8.1 Overview.............................................................................................................. 187 7.8.2 Operation ............................................................................................................. 187 7.8.3 Bus Transfer Timing ............................................................................................ 187 Resets and the Bus Controller ........................................................................................... 188
Section 8 Data Transfer Controller (DTC) ................................................................... 189
8.1 Overview........................................................................................................................... 189 8.1.1 Features................................................................................................................ 189 8.1.2 Block Diagram..................................................................................................... 190 8.1.3 Register Configuration......................................................................................... 191 Register Descriptions ........................................................................................................ 192 8.2.1 DTC Mode Register A (MRA) ............................................................................ 192 8.2.2 DTC Mode Register B (MRB)............................................................................. 194 8.2.3 DTC Source Address Register (SAR).................................................................. 195 8.2.4 DTC Destination Address Register (DAR).......................................................... 195 8.2.5 DTC Transfer Count Register A (CRA) .............................................................. 195 8.2.6 DTC Transfer Count Register B (CRB)............................................................... 196 8.2.7 DTC Enable Registers (DTCER) ......................................................................... 196 8.2.8 DTC Vector Register (DTVECR)........................................................................ 197 8.2.9 Module Stop Control Register A (MSTPCRA) ................................................... 199 Operation .......................................................................................................................... 200 8.3.1 Overview.............................................................................................................. 200 8.3.2 Activation Sources ............................................................................................... 202 8.3.3 DTC Vector Table ............................................................................................... 204 8.3.4 Location of Register Information in Address Space ............................................ 208
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8.2
8.3
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8.4 8.5
8.3.5 Normal Mode....................................................................................................... 209 8.3.6 Repeat Mode........................................................................................................ 210 8.3.7 Block Transfer Mode ........................................................................................... 211 8.3.8 Chain Transfer ..................................................................................................... 213 8.3.9 Operation Timing................................................................................................. 214 8.3.10 Number of DTC Execution States ....................................................................... 215 8.3.11 Procedures for Using DTC .................................................................................. 217 8.3.12 Examples of Use of the DTC ............................................................................... 218 Interrupts........................................................................................................................... 221 Usage Notes ...................................................................................................................... 221
Section 9 I/O Ports .............................................................................................................. 223
9.1 9.2 Overview........................................................................................................................... 223 Port 1................................................................................................................................. 227 9.2.1 Overview ............................................................................................................. 227 9.2.2 Register Configuration......................................................................................... 228 9.2.3 Pin Functions ....................................................................................................... 229 Port 3................................................................................................................................. 242 9.3.1 Overview ............................................................................................................. 242 9.3.2 Register Configuration......................................................................................... 243 9.3.3 Pin Functions ....................................................................................................... 245 Port 4................................................................................................................................. 248 9.4.1 Overview ............................................................................................................. 248 9.4.2 Register Configuration......................................................................................... 249 9.4.3 Pin Functions ....................................................................................................... 249 Port 9................................................................................................................................. 250 9.5.1 Overview ............................................................................................................. 250 9.5.2 Register Configuration......................................................................................... 251 9.5.3 Pin Functions ....................................................................................................... 251 Port A................................................................................................................................ 252 9.6.1 Overview ............................................................................................................. 252 9.6.2 Register Configuration......................................................................................... 253 9.6.3 Pin Functions ....................................................................................................... 256 9.6.4 Pin Functions ....................................................................................................... 258 9.6.5 MOS Input Pull-Up Function............................................................................... 259 Port B ................................................................................................................................ 260 9.7.1 Overview ............................................................................................................. 260 9.7.2 Register Configuration......................................................................................... 261 9.7.3 Pin Functions ....................................................................................................... 264 9.7.4 Pin Functions for Each Mode .............................................................................. 273
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9.6
9.7
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9.8
9.9
9.10
9.11
9.12
9.13
9.7.5 MOS Input Pull-Up Function............................................................................... 274 Port C ................................................................................................................................ 275 9.8.1 Overview.............................................................................................................. 275 9.8.2 Register Configuration......................................................................................... 276 9.8.3 Pin Functions for Each Mode............................................................................... 279 9.8.4 MOS Input Pull-Up Function............................................................................... 281 Port D................................................................................................................................ 282 9.9.1 Overview.............................................................................................................. 282 9.9.2 Register Configuration......................................................................................... 283 9.9.3 Pin Functions ....................................................................................................... 285 9.9.4 MOS Input Pull-Up Function............................................................................... 286 Port E ................................................................................................................................ 287 9.10.1 Overview.............................................................................................................. 287 9.10.2 Register Configuration......................................................................................... 288 9.10.3 Pin Functions ....................................................................................................... 290 9.10.4 MOS Input Pull-Up Function............................................................................... 292 Port F................................................................................................................................. 293 9.11.1 Overview.............................................................................................................. 293 9.11.2 Register Configuration......................................................................................... 294 9.11.3 Pin Functions ....................................................................................................... 296 Port H................................................................................................................................ 298 9.12.1 Overview.............................................................................................................. 298 9.12.2 Register Configuration......................................................................................... 299 9.12.3 Pin Functions ....................................................................................................... 300 Port J ................................................................................................................................. 301 9.13.1 Overview.............................................................................................................. 301 9.13.2 Register Configuration......................................................................................... 302 9.13.3 Pin Functions ....................................................................................................... 303
Section 10 16-Bit Timer Pulse Unit (TPU) .................................................................. 305
10.1 Overview........................................................................................................................... 305 10.1.1 Features................................................................................................................ 305 10.1.2 Block Diagram..................................................................................................... 309 10.1.3 Pin Configuration................................................................................................. 310 10.1.4 Register Configuration......................................................................................... 312 10.2 Register Descriptions ........................................................................................................ 314 10.2.1 Timer Control Register (TCR)............................................................................. 314 10.2.2 Timer Mode Register (TMDR) ............................................................................ 319 10.2.3 Timer I/O Control Register (TIOR) ..................................................................... 321 10.2.4 Timer Interrupt Enable Register (TIER) .............................................................. 335
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10.3
10.4
10.5
10.6
10.7
10.2.5 Timer Status Register (TSR)................................................................................ 338 10.2.6 Timer Counter (TCNT)........................................................................................ 342 10.2.7 Timer General Register (TGR) ............................................................................ 343 10.2.8 Timer Start Register (TSTR) ............................................................................... 344 10.2.9 Timer Synchro Register (TSYR) ......................................................................... 345 10.2.10 Module Stop Control Register A (MSTPCRA) ................................................... 346 Interface to Bus Master ..................................................................................................... 347 10.3.1 16-Bit Registers ................................................................................................... 347 10.3.2 8-Bit Registers ..................................................................................................... 347 Operation .......................................................................................................................... 349 10.4.1 Overview ............................................................................................................. 349 10.4.2 Basic Functions.................................................................................................... 350 10.4.3 Synchronous Operation........................................................................................ 356 10.4.4 Buffer Operation .................................................................................................. 358 10.4.5 Cascaded Operation ............................................................................................. 362 10.4.6 PWM Modes........................................................................................................ 364 10.4.7 Phase Counting Mode.......................................................................................... 370 Interrupts........................................................................................................................... 377 10.5.1 Interrupt Sources and Priorities ........................................................................... 377 10.5.2 DTC Activation ................................................................................................... 379 10.5.3 A/D Converter Activation.................................................................................... 379 Operation Timing.............................................................................................................. 380 10.6.1 Input/Output Timing ............................................................................................ 380 10.6.2 Interrupt Signal Timing ....................................................................................... 384 Usage Notes ...................................................................................................................... 388
Section 11 Programmable Pulse Generator (PPG) .................................................... 399
11.1 Overview........................................................................................................................... 399 11.1.1 Features................................................................................................................ 399 11.1.2 Block Diagram..................................................................................................... 400 11.1.3 Pin Configuration................................................................................................. 401 11.1.4 Registers .............................................................................................................. 402 11.2 Register Descriptions ........................................................................................................ 403 11.2.1 Next Data Enable Registers H and L (NDERH, NDERL)................................... 403 11.2.2 Output Data Registers H and L (PODRH, PODRL)............................................ 404 11.2.3 Next Data Registers H and L (NDRH, NDRL).................................................... 405 11.2.4 Notes on NDR Access ......................................................................................... 405 11.2.5 PPG Output Control Register (PCR) ................................................................... 407 11.2.6 PPG Output Mode Register (PMR) ..................................................................... 409 11.2.7 Port 1 Data Direction Register (P1DDR)............................................................. 412
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11.2.8 Module Stop Control Register A (MSTPCRA) ................................................... 412 11.3 Operation .......................................................................................................................... 413 11.3.1 Overview.............................................................................................................. 413 11.3.2 Output Timing...................................................................................................... 414 11.3.3 Normal Pulse Output............................................................................................ 415 11.3.4 Non-Overlapping Pulse Output............................................................................ 417 11.3.5 Inverted Pulse Output .......................................................................................... 420 11.3.6 Pulse Output Triggered by Input Capture ............................................................ 421 11.4 Usage Notes ...................................................................................................................... 422
Section 12 Watchdog Timer ............................................................................................. 425
12.1 Overview........................................................................................................................... 425 12.1.1 Features................................................................................................................ 425 12.1.2 Block Diagram..................................................................................................... 426 12.1.3 Pin Configuration................................................................................................. 428 12.1.4 Register Configuration......................................................................................... 428 12.2 Register Descriptions ........................................................................................................ 429 12.2.1 Timer Counter (TCNT)........................................................................................ 429 12.2.2 Timer Control/Status Register (TCSR)................................................................ 430 12.2.3 Reset Control/Status Register (RSTCSR) ............................................................ 436 12.2.4 Notes on Register Access..................................................................................... 437 12.3 Operation .......................................................................................................................... 439 12.3.1 Watchdog Timer Operation ................................................................................. 439 12.3.2 Interval Timer Operation ..................................................................................... 441 12.3.3 Timing of Setting Overflow Flag (OVF) ............................................................. 441 12.3.4 Timing of Setting of Watchdog Timer Overflow Flag (WOVF) ......................... 442 12.4 Interrupts ........................................................................................................................... 443 12.5 Usage Notes ...................................................................................................................... 443 12.5.1 Contention between Timer Counter (TCNT) Write and Increment ..................... 443 12.5.2 Changing Value of PSS* and CKS2 to CKS0 ..................................................... 444 12.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode................ 444 12.5.4 Internal Reset in Watchdog Timer Mode............................................................. 444 12.5.5 OVF Flag Clearing in Interval Timer Mode ........................................................ 444
Section 13 Serial Communication Interface (SCI) .................................................... 445
13.1 Overview........................................................................................................................... 445 13.1.1 Features................................................................................................................ 445 13.1.2 Block Diagram..................................................................................................... 447 13.1.3 Pin Configuration................................................................................................. 448 13.1.4 Register Configuration......................................................................................... 449
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13.2 Register Descriptions ........................................................................................................ 450 13.2.1 Receive Shift Register (RSR) .............................................................................. 450 13.2.2 Receive Data Register (RDR) .............................................................................. 450 13.2.3 Transmit Shift Register (TSR) ............................................................................. 451 13.2.4 Transmit Data Register (TDR)............................................................................. 451 13.2.5 Serial Mode Register (SMR) ............................................................................... 452 13.2.6 Serial Control Register (SCR) ............................................................................. 455 13.2.7 Serial Status Register (SSR) ................................................................................ 459 13.2.8 Bit Rate Register (BRR) ...................................................................................... 463 13.2.9 Smart Card Mode Register (SCMR).................................................................... 470 13.2.10 Module Stop Control Register B (MSTPCRB).................................................... 471 13.3 Operation .......................................................................................................................... 473 13.3.1 Overview ............................................................................................................. 473 13.3.2 Operation in Asynchronous Mode ....................................................................... 475 13.3.3 Multiprocessor Communication Function ........................................................... 486 13.3.4 Operation in Clocked Synchronous Mode ........................................................... 494 13.4 SCI Interrupts.................................................................................................................... 503 13.5 Usage Notes ...................................................................................................................... 504
Section 14 Smart Card Interface ..................................................................................... 513
14.1 Overview........................................................................................................................... 513 14.1.1 Features................................................................................................................ 513 14.1.2 Block Diagram..................................................................................................... 514 14.1.3 Pin Configuration................................................................................................. 515 14.1.4 Register Configuration......................................................................................... 516 14.2 Register Descriptions ........................................................................................................ 517 14.2.1 Smart Card Mode Register (SCMR).................................................................... 517 14.2.2 Serial Status Register (SSR) ................................................................................ 519 14.2.3 Serial Mode Register (SMR) ............................................................................... 521 14.2.4 Serial Control Register (SCR) ............................................................................. 523 14.3 Operation .......................................................................................................................... 524 14.3.1 Overview ............................................................................................................. 524 14.3.2 Pin Connections ................................................................................................... 524 14.3.3 Data Format ......................................................................................................... 526 14.3.4 Register Settings .................................................................................................. 528 14.3.5 Clock.................................................................................................................... 530 14.3.6 Data Transfer Operations..................................................................................... 532 14.3.7 Operation in GSM Mode ..................................................................................... 539 14.3.8 Operation in Block Transfer Mode ...................................................................... 540 14.4 Usage Notes ...................................................................................................................... 541
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Section 15 I2C Bus Interface [Option] (Only for the H8S/2638, H8S/2639, and H8S/2630) ........................... 545
15.1 Overview........................................................................................................................... 545 15.1.1 Features................................................................................................................ 545 15.1.2 Block Diagram..................................................................................................... 546 15.1.3 Input/Output Pins ................................................................................................. 548 15.1.4 Register Configuration......................................................................................... 549 15.2 Register Descriptions ........................................................................................................ 550 15.2.1 I2C Bus Data Register (ICDR) ............................................................................. 550 15.2.2 Slave Address Register (SAR) ............................................................................. 553 15.2.3 Second Slave Address Register (SARX) ............................................................. 554 15.2.4 I2C Bus Mode Register (ICMR)........................................................................... 555 15.2.5 I2C Bus Control Register (ICCR)......................................................................... 559 15.2.6 I2C Bus Status Register (ICSR) ........................................................................... 567 15.2.7 Serial Control Register X (SCRX)....................................................................... 573 15.2.8 DDC Switch Register (DDCSWR) ...................................................................... 574 15.2.9 Module Stop Control Register B (MSTPCRB).................................................... 575 15.3 Operation .......................................................................................................................... 576 15.3.1 I2C Bus Data Format............................................................................................ 576 15.3.2 Initial Setting........................................................................................................ 578 15.3.3 Master Transmit Operation .................................................................................. 578 15.3.4 Master Receive Operation.................................................................................... 582 15.3.5 Slave Receive Operation...................................................................................... 587 15.3.6 Slave Transmit Operation .................................................................................... 592 15.3.7 IRIC Setting Timing and SCL Control ................................................................ 595 15.3.8 Operation Using the DTC .................................................................................... 596 15.3.9 Noise Canceler ..................................................................................................... 597 15.3.10 Initialization of Internal State .............................................................................. 597 15.4 Usage Notes ...................................................................................................................... 599
Section 16 Controller Area Network (HCAN)............................................................ 611
16.1 Overview........................................................................................................................... 611 16.1.1 Features................................................................................................................ 611 16.1.2 Block Diagram..................................................................................................... 613 16.1.3 Pin Configuration................................................................................................. 614 16.1.4 Register Configuration......................................................................................... 615 16.2 Register Descriptions ........................................................................................................ 619 16.2.1 Master Control Register (MCR) .......................................................................... 619 16.2.2 General Status Register (GSR) ............................................................................ 620 16.2.3 Bit Configuration Register (BCR) ....................................................................... 622
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16.2.4 Mailbox Configuration Register (MBCR) ........................................................... 624 16.2.5 Transmit Wait Register (TXPR) .......................................................................... 625 16.2.6 Transmit Wait Cancel Register (TXCR).............................................................. 626 16.2.7 Transmit Acknowledge Register (TXACK) ........................................................ 627 16.2.8 Abort Acknowledge Register (ABACK) ............................................................. 628 16.2.9 Receive Complete Register (RXPR).................................................................... 629 16.2.10 Remote Request Register (RFPR) ....................................................................... 630 16.2.11 Interrupt Register (IRR)....................................................................................... 631 16.2.12 Mailbox Interrupt Mask Register (MBIMR) ....................................................... 636 16.2.13 Interrupt Mask Register (IMR) ............................................................................ 637 16.2.14 Receive Error Counter (REC) .............................................................................. 640 16.2.15 Transmit Error Counter (TEC)............................................................................. 640 16.2.16 Unread Message Status Register (UMSR)........................................................... 641 16.2.17 Local Acceptance Filter Masks (LAFML, LAFMH)........................................... 642 16.2.18 Message Control (MC0 to MC15) ....................................................................... 644 16.2.19 Message Data (MD0 to MD15) ........................................................................... 648 16.2.20 Module Stop Control Register C (MSTPCRC).................................................... 650 16.3 Operation .......................................................................................................................... 651 16.3.1 Hardware and Software Resets ............................................................................ 651 16.3.2 Initialization after Hardware Reset ...................................................................... 654 16.3.3 Transmit Mode..................................................................................................... 659 16.3.4 Receive Mode ...................................................................................................... 665 16.3.5 HCAN Sleep Mode.............................................................................................. 671 16.3.6 HCAN Halt Mode................................................................................................ 673 16.3.7 Interrupt Interface ................................................................................................ 673 16.3.8 DTC Interface ...................................................................................................... 675 16.4 CAN Bus Interface............................................................................................................ 676 16.5 Usage Notes ...................................................................................................................... 677
Section 17 A/D Converter ................................................................................................. 681
17.1 Overview........................................................................................................................... 681 17.1.1 Features................................................................................................................ 681 17.1.2 Block Diagram..................................................................................................... 682 17.1.3 Pin Configuration................................................................................................. 683 17.1.4 Register Configuration......................................................................................... 684 17.2 Register Descriptions ........................................................................................................ 685 17.2.1 A/D Data Registers A to D (ADDRA to ADDRD) ............................................. 685 17.2.2 A/D Control/Status Register (ADCSR) ............................................................... 686 17.2.3 A/D Control Register (ADCR) ............................................................................ 689 17.2.4 Module Stop Control Register A (MSTPCRA) ................................................... 690
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17.3 Interface to Bus Master ..................................................................................................... 691 17.4 Operation .......................................................................................................................... 692 17.4.1 Single Mode (SCAN = 0) .................................................................................... 692 17.4.2 Scan Mode (SCAN = 1)....................................................................................... 694 17.4.3 Input Sampling and A/D Conversion Time ......................................................... 696 17.4.4 External Trigger Input Timing............................................................................. 697 17.5 Interrupts ........................................................................................................................... 698 17.6 Usage Notes ...................................................................................................................... 699
Section 18 D/A Converter ................................................................................................. 705
18.1 Overview........................................................................................................................... 705 18.1.1 Features................................................................................................................ 705 18.1.2 Block Diagram..................................................................................................... 706 18.1.3 Input and Output Pins .......................................................................................... 707 18.1.4 Register Configuration......................................................................................... 707 18.2 Register Descriptions ........................................................................................................ 708 18.2.1 D/A Data Registers 0, 1 (DADR0, DADR1) ....................................................... 708 18.2.2 D/A Control Register 01 (DACR01) ................................................................... 708 18.2.3 Module Stop Control Register A (MSTPCRA) ................................................... 710 18.3 Operation .......................................................................................................................... 711
Section 19 Motor Control PWM Timer ........................................................................ 713
19.1 Overview........................................................................................................................... 713 19.1.1 Features................................................................................................................ 713 19.1.2 Block Diagram..................................................................................................... 714 19.1.3 Pin Configuration................................................................................................. 716 19.1.4 Register Configuration......................................................................................... 717 19.2 Register Descriptions ........................................................................................................ 718 19.2.1 PWM Control Registers 1 and 2 (PWCR1, PWCR2) .......................................... 718 19.2.2 PWM Output Control Registers 1 and 2 (PWOCR1, PWOCR2) ........................ 720 19.2.3 PWM Polarity Registers 1 and 2 (PWPR1, PWPR2)........................................... 721 19.2.4 PWM Counters 1 and 2 (PWCNT1, PWCNT2) .................................................. 722 19.2.5 PWM Cycle Registers 1 and 2 (PWCYR1, PWCYR2) ....................................... 723 19.2.6 PWM Duty Registers 1A, 1C, 1E, 1G (PWDTR1A, 1C, 1E, 1G) ....................... 724 19.2.7 PWM Buffer Registers 1A, 1C, 1E, 1G (PWBFR1A, 1C, 1E, 1G) ..................... 726 19.2.8 PWM Duty Registers 2A to 2H (PWDTR2A to PWDTR2H) ............................. 727 19.2.9 PWM Buffer Registers 2A to 2D (PWBFR2A to PWBFR2D)............................ 729 19.2.10 Module Stop Control Register D (MSTPCRD) ................................................... 730 19.3 Bus Master Interface ......................................................................................................... 731 19.3.1 16-Bit Data Registers........................................................................................... 731
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19.3.2 8-Bit Data Registers............................................................................................. 731 19.4 Operation .......................................................................................................................... 732 19.4.1 PWM Channel 1 Operation.................................................................................. 732 19.4.2 PWM Channel 2 Operation.................................................................................. 733 19.5 Usage Note........................................................................................................................ 735
Section 20 RAM .................................................................................................................. 737
20.1 Overview........................................................................................................................... 737 20.1.1 Block Diagram..................................................................................................... 737 20.1.2 Register Configuration......................................................................................... 739 20.2 Register Descriptions ........................................................................................................ 740 20.2.1 System Control Register (SYSCR) ...................................................................... 740 20.3 Operation .......................................................................................................................... 740 20.4 Usage Notes ...................................................................................................................... 741
Section 21A ROM (H8S/2636 Group) .......................................................................... 743
21A.1 Overview ....................................................................................................................... 743 21A.1.1 Block Diagram.............................................................................................. 743 21A.1.2 Register Configuration.................................................................................. 743 Register Descriptions .................................................................................................... 744 21A.2.1 Mode Control Register (MDCR) .................................................................. 744 Operation....................................................................................................................... 744 Flash Memory Overview............................................................................................... 747 21A.4.1 Features......................................................................................................... 747 21A.4.2 Block Diagram.............................................................................................. 748 21A.4.3 Mode Transitions .......................................................................................... 749 21A.4.4 On-Board Programming Modes.................................................................... 750 21A.4.5 Flash Memory Emulation in RAM ............................................................... 752 21A.4.6 Differences between Boot Mode and User Program Mode .......................... 753 21A.4.7 Block Configuration ..................................................................................... 754 Pin Configuration .......................................................................................................... 755 Register Configuration .................................................................................................. 756 Register Descriptions .................................................................................................... 757 21A.7.1 Flash Memory Control Register 1 (FLMCR1) ............................................. 757 21A.7.2 Flash Memory Control Register 2 (FLMCR2) ............................................. 760 21A.7.3 Erase Block Register 1 (EBR1) .................................................................... 761 21A.7.4 Erase Block Register 2 (EBR2) .................................................................... 761 21A.7.5 RAM Emulation Register (RAMER) ........................................................... 762 21A.7.6 Flash Memory Power Control Register (FLPWCR)..................................... 763 On-Board Programming Modes .................................................................................... 764
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21A.5 21A.6 21A.7
21A.8
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21A.9
21A.10
21A.11 21A.12 21A.13 21A.14 21A.15 21A.16
21A.8.1 Boot Mode .................................................................................................... 765 21A.8.2 User Program Mode...................................................................................... 769 Flash Memory Programming/Erasing ........................................................................... 771 21A.9.1 Program Mode .............................................................................................. 773 21A.9.2 Program-Verify Mode .................................................................................. 774 21A.9.3 Erase Mode ................................................................................................... 778 21A.9.4 Erase-Verify Mode ....................................................................................... 779 Protection ...................................................................................................................... 781 21A.10.1 Hardware Protection ..................................................................................... 781 21A.10.2 Software Protection ...................................................................................... 782 21A.10.3 Error Protection ............................................................................................ 782 Flash Memory Emulation in RAM................................................................................ 784 Interrupt Handling when Programming/Erasing Flash Memory ................................... 786 Programmer Mode......................................................................................................... 787 21A.13.1 Socket Adapter and Memory Map................................................................ 787 Flash Memory and Power-Down States ........................................................................ 788 21A.14.1 Notes on Power-Down States ....................................................................... 788 Flash Memory Programming and Erasing Precautions ................................................. 789 Note on Switching from F-ZTAT Version to Mask ROM Version............................... 794
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group) .... 795
21B.1 Overview ....................................................................................................................... 795 21B.1.1 Block Diagram.............................................................................................. 795 21B.1.2 Register Configuration.................................................................................. 796 Register Descriptions .................................................................................................... 796 21B.2.1 Mode Control Register (MDCR) .................................................................. 796 Operation....................................................................................................................... 796 Flash Memory Overview............................................................................................... 799 21B.4.1 Features......................................................................................................... 799 21B.4.2 Block Diagram.............................................................................................. 800 21B.4.3 Mode Transitions .......................................................................................... 801 21B.4.4 On-Board Programming Modes.................................................................... 802 21B.4.5 Flash Memory Emulation in RAM ............................................................... 804 21B.4.6 Differences between Boot Mode and User Program Mode .......................... 805 21B.4.7 Block Configuration ..................................................................................... 806 Pin Configuration .......................................................................................................... 807 Register Configuration .................................................................................................. 808 Register Descriptions .................................................................................................... 809 21B.7.1 Flash Memory Control Register 1 (FLMCR1) ............................................. 809 21B.7.2 Flash Memory Control Register 2 (FLMCR2) ............................................. 812
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21B.2 21B.3 21B.4
21B.5 21B.6 21B.7
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21B.8
21B.9
21B.10
21B.11 21B.12 21B.13 21B.14 21B.15 21B.16
21B.7.3 Erase Block Register 1 (EBR1) .................................................................... 813 21B.7.4 Erase Block Register 2 (EBR2) .................................................................... 813 21B.7.5 RAM Emulation Register (RAMER) ........................................................... 814 21B.7.6 Flash Memory Power Control Register (FLPWCR)..................................... 815 On-Board Programming Modes .................................................................................... 817 21B.8.1 Boot Mode .................................................................................................... 818 21B.8.2 User Program Mode...................................................................................... 822 Programming/Erasing Flash Memory ........................................................................... 824 21B.9.1 Program Mode .............................................................................................. 826 21B.9.2 Program-Verify Mode .................................................................................. 827 21B.9.3 Erase Mode................................................................................................... 831 21B.9.4 Erase-Verify Mode ....................................................................................... 831 Protection ...................................................................................................................... 833 21B.10.1 Hardware Protection ..................................................................................... 833 21B.10.2 Software Protection ...................................................................................... 834 21B.10.3 Error Protection ............................................................................................ 835 Flash Memory Emulation in RAM................................................................................ 837 Interrupt Handling when Programming/Erasing Flash Memory ................................... 839 Programmer Mode......................................................................................................... 840 21B.13.1 Socket Adapter and Memory Map................................................................ 840 Flash Memory and Power-Down States ........................................................................ 841 21B.14.1 Notes on Power-Down States ....................................................................... 842 Flash Memory Programming and Erasing Precautions ................................................. 842 Note on Switching from F-ZTAT Version to Mask ROM Version .............................. 848
Section 21C ROM (H8S/2635 Group) .......................................................................... 849
21C.1 Overview ....................................................................................................................... 849 21C.1.1 Block Diagram.............................................................................................. 849 21C.1.2 Register Configuration.................................................................................. 850 Register Descriptions .................................................................................................... 850 21C.2.1 Mode Control Register (MDCR) .................................................................. 850 Operation....................................................................................................................... 850 Flash Memory Overview............................................................................................... 853 21C.4.1 Features......................................................................................................... 853 21C.4.2 Block Diagram.............................................................................................. 854 21C.4.3 Mode Transitions .......................................................................................... 855 21C.4.4 On-Board Programming Modes.................................................................... 856 21C.4.5 Flash Memory Emulation in RAM ............................................................... 858 21C.4.6 Differences between Boot Mode and User Program Mode .......................... 859 21C.4.7 Block Configuration ..................................................................................... 860
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21C.5 21C.6 21C.7
21C.8
21C.9
21C.10
21C.11 21C.12 21C.13 21C.14 21C.15 21C.16
Pin Configuration .......................................................................................................... 861 Register Configuration .................................................................................................. 862 Register Descriptions .................................................................................................... 863 21C.7.1 Flash Memory Control Register 1 (FLMCR1) ............................................. 863 21C.7.2 Flash Memory Control Register 2 (FLMCR2) ............................................. 866 21C.7.3 Erase Block Register 1 (EBR1) .................................................................... 867 21C.7.4 Erase Block Register 2 (EBR2) .................................................................... 867 21C.7.5 RAM Emulation Register (RAMER)............................................................ 868 21C.7.6 Flash Memory Power Control Register (FLPWCR)..................................... 870 On-Board Programming Modes .................................................................................... 871 21C.8.1 Boot Mode .................................................................................................... 872 21C.8.2 User Program Mode...................................................................................... 876 Programming/Erasing Flash Memory ........................................................................... 878 21C.9.1 Program Mode .............................................................................................. 880 21C.9.2 Program-Verify Mode .................................................................................. 881 21C.9.3 Erase Mode ................................................................................................... 885 21C.9.4 Erase-Verify Mode ....................................................................................... 885 Protection ...................................................................................................................... 887 21C.10.1 Hardware Protection ..................................................................................... 887 21C.10.2 Software Protection ...................................................................................... 888 21C.10.3 Error Protection ............................................................................................ 889 Flash Memory Emulation in RAM................................................................................ 891 Interrupt Handling when Programming/Erasing Flash Memory ................................... 893 Programmer Mode......................................................................................................... 894 21C.13.1 Socket Adapter and Memory Map................................................................ 894 Flash Memory and Power-Down States ........................................................................ 895 21C.14.1 Notes on Power-Down States ....................................................................... 896 Flash Memory Programming and Erasing Precautions ................................................. 896 Note on Switching from F-ZTAT Version to Mask ROM Version............................... 902
Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group) ................ 903
22A.1 Overview ....................................................................................................................... 903 22A.1.1 Block Diagram.............................................................................................. 903 22A.1.2 Register Configuration.................................................................................. 904 Register Descriptions .................................................................................................... 904 22A.2.1 System Clock Control Register (SCKCR) .................................................... 904 22A.2.2 Low-Power Control Register (LPWRCR) .................................................... 905 Oscillator ....................................................................................................................... 906 22A.3.1 Connecting a Crystal Resonator.................................................................... 906
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22A.3
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22A.4 22A.5 22A.6 22A.7 22A.8 22A.9
22A.3.2 External Clock Input..................................................................................... 909 PLL Circuit.................................................................................................................... 911 Medium-Speed Clock Divider....................................................................................... 912 Bus Master Clock Selection Circuit .............................................................................. 912 Subclock Oscillator ....................................................................................................... 912 Subclock Waveform Generation Circuit ....................................................................... 913 Note on Crystal Resonator ............................................................................................ 913
Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group) ....... 915
22B.1 Overview ....................................................................................................................... 915 22B.1.1 Block Diagram.............................................................................................. 915 22B.1.2 Register Configuration.................................................................................. 916 Register Descriptions .................................................................................................... 916 22B.2.1 System Clock Control Register (SCKCR).................................................... 916 22B.2.2 Low-Power Control Register (LPWRCR) .................................................... 917 Oscillator ....................................................................................................................... 918 22B.3.1 Connecting a Crystal Resonator ................................................................... 918 22B.3.2 External Clock Input..................................................................................... 921 PLL Circuit.................................................................................................................... 923 Medium-Speed Clock Divider....................................................................................... 923 Bus Master Clock Selection Circuit .............................................................................. 923 Subclock Divider........................................................................................................... 924 Note on Resonator ......................................................................................................... 924
22B.2
22B.3
22B.4 22B.5 22B.6 22B.7 22B.8
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F] .............................................................................................. 925
23A.1 23A.2 Overview ....................................................................................................................... 925 23A.1.1 Register Configuration.................................................................................. 929 Register Descriptions .................................................................................................... 930 23A.2.1 Standby Control Register (SBYCR) ............................................................. 930 23A.2.2 System Clock Control Register (SCKCR).................................................... 931 23A.2.3 Low-Power Control Register (LPWRCR) .................................................... 933 23A.2.4 Timer Control/Status Register (TCSR)......................................................... 933 23A.2.5 Module Stop Control Register (MSTPCR)................................................... 934 Medium-Speed Mode.................................................................................................... 936 Sleep Mode.................................................................................................................... 937 23A.4.1 Sleep Mode................................................................................................... 937 23A.4.2 Exiting Sleep Mode ...................................................................................... 937
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23A.3 23A.4
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23A.5
23A.6
23A.7
23A.8
Module Stop Mode........................................................................................................ 938 23A.5.1 Module Stop Mode ....................................................................................... 938 23A.5.2 Usage Notes .................................................................................................. 939 Software Standby Mode ................................................................................................ 940 23A.6.1 Software Standby Mode................................................................................ 940 23A.6.2 Clearing Software Standby Mode................................................................. 940 23A.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode............................................................................................... 941 23A.6.4 Software Standby Mode Application Example............................................. 942 23A.6.5 Usage Notes .................................................................................................. 943 Hardware Standby Mode............................................................................................... 943 23A.7.1 Hardware Standby Mode .............................................................................. 943 23A.7.2 Hardware Standby Mode Timing.................................................................. 944 φ Clock Output Disabling Function............................................................................... 945
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F] ................................................................. 947
23B.1 23B.2 Overview ....................................................................................................................... 947 23B.1.1 Register Configuration.................................................................................. 953 Register Descriptions .................................................................................................... 953 23B.2.1 Standby Control Register (SBYCR) ............................................................. 953 23B.2.2 System Clock Control Register (SCKCR) .................................................... 955 23B.2.3 Low-Power Control Register (LPWRCR) .................................................... 957 23B.2.4 Timer Control/Status Register (TCSR)......................................................... 959 23B.2.5 Module Stop Control Register (MSTPCR)................................................... 961 Medium-Speed Mode .................................................................................................... 962 Sleep Mode.................................................................................................................... 963 23B.4.1 Sleep Mode ................................................................................................... 963 23B.4.2 Exiting Sleep Mode ...................................................................................... 963 Module Stop Mode........................................................................................................ 964 23B.5.1 Module Stop Mode ....................................................................................... 964 23B.5.2 Usage Notes .................................................................................................. 966 Software Standby Mode ................................................................................................ 966 23B.6.1 Software Standby Mode................................................................................ 966 23B.6.2 Clearing Software Standby Mode................................................................. 967
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23B.3 23B.4
23B.5
23B.6
REJ09B0103-0800 Rev. 8.00 May 28, 2010
23B.7
23B.8
23B.9
23B.10
23B.11 23B.12 23B.13
Setting Oscillation Stabilization Time after Clearing Software Standby Mode............................................................................................... 967 23B.6.4 Software Standby Mode Application Example............................................. 969 23B.6.5 Usage Notes.................................................................................................. 970 Hardware Standby Mode............................................................................................... 970 23B.7.1 Hardware Standby Mode .............................................................................. 970 23B.7.2 Hardware Standby Mode Timing ................................................................. 971 Watch Mode (U-Mask, W-Mask Version, H8S/2635 Group Only) .............................. 971 23B.8.1 Watch Mode ................................................................................................. 971 23B.8.2 Exiting Watch Mode..................................................................................... 972 23B.8.3 Notes............................................................................................................. 972 Subsleep Mode (U-Mask, W-Mask Version, H8S/2635 Group Only) .......................... 973 23B.9.1 Subsleep Mode ............................................................................................. 973 23B.9.2 Exiting Subsleep Mode................................................................................. 973 Subactive Mode (U-Mask, W-Mask Version, H8S/2635 Group Only)......................... 974 23B.10.1 Subactive Mode ............................................................................................ 974 23B.10.2 Exiting Subactive Mode ............................................................................... 974 Direct Transitions (U-Mask, W-Mask Version, H8S/2635 Group Only)...................... 975 23B.11.1 Overview of Direct Transitions .................................................................... 975 φ Clock Output Disabling Function............................................................................... 976 Usage Notes .................................................................................................................. 977
23B.6.3
Section 24 Electrical Characteristics ............................................................................. 979
24.1 H8S/2636 Group Electrical Characteristics................................................................... 979 24.1.1 Absolute Maximum Ratings ......................................................................... 979 24.1.2 Power Supply Voltage and Operating Frequency Range.............................. 980 24.1.3 DC Characteristics ........................................................................................ 981 24.1.4 AC Characteristics ........................................................................................ 985 24.1.5 A/D Conversion Characteristics ................................................................... 990 24.1.6 D/A Conversion Characteristics ................................................................... 991 24.1.7 Flash Memory Characteristics ...................................................................... 992 H8S/2638 Group Electrical Characteristics................................................................... 994 24.2.1 Absolute Maximum Ratings ......................................................................... 994 24.2.2 Power Supply Voltage and Operating Frequency Range.............................. 995 24.2.3 DC Characteristics ........................................................................................ 996 24.2.4 AC Characteristics ......................................................................................1002 24.2.5 A/D Conversion Characteristics .................................................................1008 24.2.6 D/A Conversion Characteristics .................................................................1009 24.2.7 Flash Memory Characteristics ....................................................................1010 H8S/2639 Group, H8S/2635 Group Electrical Characteristics ...................................1012
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24.2
24.3
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24.4
24.5
24.6
24.3.1 Absolute Maximum Ratings .......................................................................1012 24.3.2 Power Supply Voltage and Operating Frequency Range............................1013 24.3.3 DC Characteristics ......................................................................................1014 24.3.4 AC Characteristics ......................................................................................1020 24.3.5 A/D Conversion Characteristics .................................................................1026 24.3.6 D/A Conversion Characteristics* ...............................................................1027 24.3.7 Flash Memory Characteristics ....................................................................1028 H8S/2630 Group Electrical Characteristics.................................................................1030 24.4.1 Absolute Maximum Ratings .......................................................................1030 24.4.2 Power Supply Voltage and Operating Frequency Range............................1031 24.4.3 DC Characteristics ......................................................................................1032 24.4.4 AC Characteristics ......................................................................................1038 24.4.5 A/D Conversion Characteristics .................................................................1044 24.4.6 D/A Conversion Characteristics .................................................................1045 24.4.7 Flash Memory Characteristics ....................................................................1046 Operation Timing ........................................................................................................1048 24.5.1 Clock Timing ..............................................................................................1048 24.5.2 Control Signal Timing ................................................................................1049 24.5.3 Bus Timing .................................................................................................1050 24.5.4 On-Chip Supporting Module Timing..........................................................1054 Usage Note ..................................................................................................................1058
Appendix A Instruction Set ............................................................................................1059
A.1 A.2 A.3 A.4 A.5 A.6 Instruction List ................................................................................................................1059 Instruction Codes ............................................................................................................1083 Operation Code Map.......................................................................................................1098 Number of States Required for Instruction Execution ....................................................1102 Bus States during Instruction Execution .........................................................................1116 Condition Code Modification .........................................................................................1130
Appendix B Internal I/O Register .................................................................................1136
B.1 B.2 Address ...........................................................................................................................1136 Functions.........................................................................................................................1158
Appendix C I/O Port Block Diagrams.........................................................................1422
C.1 C.2 C.3 C.4 C.5 Port 1 Block Diagrams....................................................................................................1422 Port 3 Block Diagrams....................................................................................................1428 Port 4 Block Diagram .....................................................................................................1434 Port 9 Block Diagram .....................................................................................................1435 Port A Block Diagram.....................................................................................................1436
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
C.6 C.7 C.8 C.9 C.10 C.11 C.12
Port B Block Diagram.....................................................................................................1440 Port C Block Diagram.....................................................................................................1441 Port D Block Diagram ....................................................................................................1442 Port E Block Diagram.....................................................................................................1443 Port F Block Diagrams....................................................................................................1444 Port H Block Diagram ....................................................................................................1450 Port J Block Diagram......................................................................................................1451
Appendix D Pin States .....................................................................................................1452
D.1 Port States in Each Mode................................................................................................1452
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode ............................................................................................1455 Appendix F Product Code Lineup ...............................................................................1456 Appendix G Package Dimensions ................................................................................1458
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
Section 1 Overview
1.1 Overview
The H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 are microcomputers (MCUs: microcomputer units), built around the H8S/2600 CPU, employing Renesas Electronics's proprietary architecture, and equipped with peripheral functions on-chip. The H8S/2600 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series. On-chip peripheral functions required for system configuration include data transfer controller (DTC) bus masters, ROM and RAM memory, a16-bit timer-pulse unit (TPU), programmable pulse generator (PPG), motor control PWM timer (PWM) watchdog timer (WDT), serial communication interface (SCI), A/D converter, D/A converter, controller area network (HCAN) and I/O ports. An I2C bus interface (IIC) is available as an option in the H8S/2638, H8S/2639, and H8S/2630. On-chip ROM is available as 128-kbyte, 192-kbyte, 256-kbyte, and 384-kbyte flash memory (FZTAT™* version), and as 128-kbyte, 192-kbyte, 256-kbyte, and 384-kbyte mask ROM. ROM is connected to the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching has been speeded up, and processing speed increased. Four operating modes, modes 4 to 7, are provided, and there is a choice of single-chip mode or external expansion mode. Subclock (32 kHz oscillation) functions are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions. The features of the H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634 are shown in table 1-1. Notes: The H8S/2635 and H8S/2634 are not equipped with a DTC, a PPG, a PC brake controller, or a D/A converter. * F-ZTAT is a trademark of Renesas Electronics Corp.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 1-1
Item CPU
Overview
Specification • General-register machine ⎯ Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) • High-speed operation suitable for realtime control ⎯ Maximum clock rate: 20 MHz ⎯ High-speed arithmetic operations 8/16/32-bit register-register add/subtract 16 × 16-bit register-register multiply 16 × 16 + 42-bit multiply and accumulate 32 ÷ 16-bit register-register divide • ⎯ Sixty-nine basic instructions ⎯ 8/16/32-bit move/arithmetic and logic instructions ⎯ Unsigned/signed multiply and divide instructions ⎯ Multiply-and accumulate instruction ⎯ Powerful bit-manipulation instructions • CPU operating modes ⎯ Advanced mode: 16-Mbyte address space Address space divided into 8 areas, with bus specifications settable independently for each area Choice of 8-bit or 16-bit access space for each area 2-state or 3-state access space can be designated for each area Number of program wait states can be set for each area Direct connection to burst ROM supported Supports debugging functions by means of PC break interrupts Two break channels : 50 ns : 200 ns : 200 ns : 1000 ns
Instruction set suitable for high-speed operation
Bus controller
• • • • •
PC break controller • (This function is not • implemented in the H8S/2635 Group) Data transfer • controller (DTC) • (This function is not implemented in the • H8S/2635 Group) •
Can be activated by internal interrupt or software Multiple transfers or multiple types of transfer possible for one activation source Transfer possible in repeat mode, block transfer mode, etc. Request can be sent to CPU for interrupt that activated DTC
Page 2 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
Item 16-bit timer-pulse unit (TPU)
Specification • • • • • • • • • • • • • • 6-channel 16-bit timer on-chip Pulse I/O processing capability for up to 16 pins' Automatic 2-phase encoder count capability Maximum 8-bit pulse output possible with TPU as time base Output trigger selectable in 4-bit groups Non-overlap margin can be set Direct output or inverse output setting possible Watchdog timer or interval timer selectable Operation using sub-clock supported (WDT1 only)* Maximum of 16 10-bit PWM outputs Eight outputs with two channels each built in Duty settable between 0% and 100% Automatic transfer of buffer register data supported Settable to any one of 5 operating speeds Asynchronous mode or synchronous mode selectable Multiprocessor communication function Smart card interface function CAN: Ver. 2.0B compliant Buffer size: 15 transmit/receive messages, transmit only one message Filtering of receive messages
Programmable pulse generator (PPG) (This function is not implemented in the H8S/2635 Group) Watchdog timer (WDT) 2 channels Motor control PWM timer (PWM)
Serial communication interface (SCI) 3 channels (SCI0 to SCI2) Controller area network (HCAN) 2 channels (The H8S/2635 Group has one HCAN channel) A/D converter
• • • • • •
• • • • • •
Resolution: 10 bits Input: 12 channels High-speed conversion: 13.3 µs minimum conversion time (at 20-MHz operation) Single or scan mode selectable Sample and hold circuit A/D conversion can be activated by external trigger or timer trigger Resolution: 8 bits Output: 2 channels
D/A converter • (This function is not • implemented in the H8S/2635 Group)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 3 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Item I/O ports Memory
Specification • • • 72 I/O pins, 12 input-only pins Flash memory or mask ROM High-speed static RAM ROM 128 kbytes 256 kbytes 384 kbytes 192 kbytes 128 kbytes 6 kbytes RAM 4 kbytes 16 kbytes
Product Name H8S/2636 H8S/2638 H8S/2639 H8S/2630 H8S/2635 H8S/2634* • • • Power-down states • • • • • • Operating modes
Note: * The H8S/2634 is available in a mask ROM version only. Interrupt controller Seven external interrupt pins (NMI, IRQ0 to IRQ5) 49 internal interrupt sources (45 sources in H8S/2635) Eight priority levels settable Medium-speed mode Sleep mode Module-stop mode Software standby mode Hardware standby mode Sub-clock operation* (subactive mode, subsleep mode, watch mode)
External Data Bus Mode 4 5 6 7 CPU Operating Mode Advanced Description On-chip ROM disabled expansion mode On-chip ROM disabled expansion mode On-chip ROM enabled expansion mode Single-chip mode On-Chip ROM Disabled Disabled Enabled Enabled Initial Value 16 bits 8 bits 8 bits — Maximum Value 16 bits 16 bits 16 bits —
Four MCU operating modes
Page 4 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
Item Clock pulse generator
Specification • • On-chip PLL circuit (×1, ×2, ×4) Input clock frequency H8S/2636, H8S/2638, H8S/2630: 4 to 20 MHz H8S/2639, H8S/2635, H8S/2634: 4 to 5 MHz Conforms to the I C bus interface type advocated by Philips Single master mode/slave mode Possible to determine arbitration lost conditions Supports two slave addresses
2
I C bus interface (IIC) ×2 channel (Option) (Only for the H8S/2638, H8S/2639, and H8S/2630) Packages Product lineup
2
• • • •
•
128-pin plastic QFP (FP-128B)
Model Name I2C bus interface ⎯ ⎯ No No Yes No Yes No No Yes No No 192 k/ 6k 128 k/ 6k 384 k/ 16 k ROM/ RAM (Bytes) Packages 128 k/ 4k FP-128B
Mask ROM Version HD6432636F HD6432636UF (U-Mask Version) HD6432638F HD6432638UF (U-Mask Version) HD6432638WF (W-Mask Version) HD6432639UF (U-Mask Version) HD6432639WF (W-Mask Version) HD6432630F HD6432630UF (U-Mask Version) HD6432630WF (W-Mask Version) HD6432635F HD6432634F
F-ZTAT Version HD64F2636F HD64F2636UF (U-Mask Version) HD64F2638F HD64F2638UF (U-Mask Version) HD64F2638WF (W-Mask Version) HD64F2639UF (U-Mask Version) HD64F2639WF (W-Mask Version) HD64F2630F HD64F2630UF (U-Mask Version) HD64F2630WF (W-Mask Version) HD64F2635F —
Subclock Functions No Yes No Yes Yes Yes Yes No Yes Yes Yes Yes
256 k/ 16 k
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available only in the U-mask and W-mask versions, and H8S/2635 Group, but are not available in the other versions.
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 5 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
1.2
Internal Block Diagram
Figure 1-1 (a) shows an internal block diagram of the H8S/2636.
PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0
VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
Port D
Port E
Interrupt controller PC break controller
Port F
TPU
D/A converter A/D converter
PJ0/PWM2A PJ1/PWM2B PJ2/PWM2C PJ3/PWM2D PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H
Port J
PPG
HCAN × 2 channels
P93/AN11 P92/AN10 P91/AN9 P90/AN8
Port 1
Port 4
HRxD0 HTxD0 HRxD1 HTxD1 Vref AVCC AVSS P47 / AN7/ DA1 P46 / AN6/ DA0 P45 / AN5 P44 / AN4 P43 / AN3 P42 / AN2 P41 / AN1 P40 / AN0
P10 / PO8/ TIOCA0 /A20 P11 / PO9/ TIOCB0 /A21 P12 / PO10/ TIOCC0 / TCLKA/A22 P13 / PO11/ TIOCD0 / TCLKB/A23 P14 / PO12/ TIOCA1/IRQ0 P15/PO13/TIOCB1/TCLKC P16 / PO14/ TIOCA2/IRQ1 P17/PO15/TIOCB2/TCLKD
Notes: 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask version. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 2. The FWE pin only applies to the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
Figure 1-1 (a) Internal Block Diagram of H8S/2636
Page 6 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
PWMVCC PWMVCC PWMVSS PWMVSS PWMVSS
Port 9
Port 3
PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H
WDT × 2 channels
Port H
RAM SCI × 3 channels Motor control PWM timer
Port C
PF7/ φ PF6/ AS PF5/ RD PF4/ HWR PF3/ LWR/ADTRG/IRQ3 PF0/ IRQ2
Peripheral data bus
DTC
Peripheral address bus
VCL MD2 MD1 MD0 OSC2*1 OSC1*1 EXTAL XTAL PLLCAP STBY RES NMI FWE*2
H8S/2600 CPU
Internal data bus Internal address bus
Clock pulse generator
PA3/A19/SCK2 PA2/A18/RxD2 PA1/A17/TxD2 PA0/A16
Bus controller
Port A
PLL
PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3 / A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 PB0/A8/TIOCA3 PC7 / A7 PC6 / A6 PC5 / A5 PC4 / A4 PC3 / A3 PC2 / A2 PC1 / A1 PC0 / A0
ROM (mask ROM, flash memory)
Port B
P35/SCK1/IRQ5 P34/RxD1 P33/TxD1 P32/SCK0/IRQ4 P31/RxD0 P30/TxD0
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
Figure 1-1 (b) shows an internal block diagram of the H8S/2638, H8S/2639, and H8S/2630.
PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 PE7 / D7 PE6 / D6 PE5 / D5 PE4 / D4 PE3 / D3 PE2 / D2 PE1 / D1 PE0 / D0
VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
Port D
Port E
Clock pulse generator
Bus controller
TPU
D/A converter A/D converter
PJ0/PWM2A PJ1/PWM2B PJ2/PWM2C PJ3/PWM2D PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H
Port 3
PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H
WDT × 2 channels
Port H
RAM
I2C bus interface (option)
SCI × 3 channels Motor control PWM timer
Port C
PF7/ φ PF6/ AS PF5/ RD PF4/ HWR PF3/ LWR/ADTRG/IRQ3 PF0/IRQ2
PC break controller
Port F
Peripheral data bus
Interrupt controller
DTC
Peripheral address bus
EXTAL XTAL PLLCAP STBY RES NMI FWE*3
H8S/2600 CPU
Internal data bus Internal address bus
VCL MD2 MD1 MD0 OSC2*1 OSC1*1
PA3/A19/SCK2 PA2/A18/RxD2 PA1/A17/TxD2 PA0/A16
Port A
PLL
PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3 / A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 PB0/A8/TIOCA3 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0
ROM (mask ROM, flash memory)
Port B
P35 / SCK1/ SCL0*2/IRQ5 P34 / RxD1/SDA0*2 P33/TxD1/SCL1*2 P32 / SCK0/ SDA1*2/IRQ4 P31/RxD0 P30/TxD0
Port J
PPG
HCAN × 2 channels
P93/AN11 P92/AN10 P91/AN9 P90/AN8
Port 1
Port 4
HRxD0 HTxD0 HRxD1 HTxD1 Vref AVCC AVSS P47/AN7/DA1 P46/AN6/DA0 P45/AN5 P44/AN4 P43/AN3 P42/AN2 P41/AN1 P40/AN0
Notes: 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. The H8S/2639 has no OSC1 and OSC2 pins. 2. These pins are used for the I2C bus interface. The I2C bus interface is available as an option. The product equipped with the I2C bus interface is the W-mask version. 3. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
Figure 1-1 (b) Internal Block Diagram of H8S/2638, H8S/2639, and H8S/2630
REJ09B0103-0800 Rev. 8.00 May 28, 2010
P10/PO8/TIOCA0/A20 P11/PO9/TIOCB0/A21 P12/PO10/TIOCC0/TCLKA/A22 P13/PO11/TIOCD0/TCLKB/A23 P14/PO12/TIOCA1/IRQ0 P15/PO13/TIOCB1/TCLKC P16/PO14/TIOCA2/IRQ1 P17/PO15/TIOCB2/TCLKD
PWMVCC PWMVCC PWMVSS PWMVSS PWMVSS
Port 9
Page 7 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Figure 1-1 (c) shows an internal block diagram of the H8S/2635 Group.
PD7 / D15 PD6 / D14 PD5 / D13 PD4 / D12 PD3 / D11 PD2 / D10 PD1 / D9 PD0 / D8 PE7 / D7 PE6 / D6 PE5 / D5 PE4 / D4 PE3 / D3 PE2 / D2 PE1 / D1 PE0 / D0
VCC VCC VCC VCC VCC VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
Port D
VCL MD2 MD1 MD0 NC*2 EXTAL XTAL
Internal address bus
Port E
PA3/A19/SCK2 PA2/A18/RxD2 PA1/A17/TxD2 PA0/A16 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3 / A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 PB0/A8/TIOCA3 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 P35 / SCK1/ IRQ5 P34/RxD1 P33/TxD1 P32 / SCK0/ IRQ4 P31/RxD0 P30/TxD0
PLLCAP PLLVSS STBY RES NMI FWE*1
Clock pulse generator
PLL
Internal data bus
H8S/2600 CPU
Bus controller
HCAN × 1 channel SCI × 3 channels
Port J
PJ0/PWM2A PJ1/PWM2B PJ2/PWM2C PJ3/PWM2D PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H
TPU
Port 9
Port 3
PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H
Motor control PWM timer
Port H
RAM
WDT × 2 channels
Port C
PF7/ φ PF6/ AS PF5/ RD PF4/ HWR PF3/ LWR/ADTRG/IRQ3 PF0/IRQ2
ROM (mask ROM, flash memory)
Peripheral data bus
Interrupt controller
Port F
Peripheral address bus
Port B
Port A
A/D converter
P93/AN11 P92/AN10 P91/AN9 P90/AN8
Port 1
Port 4
P47/AN7 P46/AN6 P45/AN5 P44/AN4 P43/AN3 P42/AN2 P41/AN1 P40/AN0
P10/TIOCA0/A20 P11/TIOCB0/A21 P12/TIOCC0/TCLKA/A22 P13/TIOCD0/TCLKB/A23 P14/TIOCA1/IRQ0 P15/TIOCB1/TCLKC P16/TIOCA2/IRQ1 P17/TIOCB2/TCLKD
Notes: 1.
The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss. 2. The NC pin should be left open.
Figure 1-1 (c) Internal Block Diagram of H8S/2635 Group
Page 8 of 1458
PWMVCC PWMVCC PWMVSS PWMVSS PWMVSS HRxD HTxD Vref AVCC AVSS
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
1.3
1.3.1
Pin Description
Pin Arrangement
Figure 1-2 shows the pin arrangement of the H8S/2636, figure 1-3 shows the pin arrangement of the H8S/2638 and H8S/2630, figure 1-4 shows the pin arrangement of the H8S/2639, and figure 1-5 shows the pin arrangement of the H8S/2635 Group.
Vref AVCC NC VSS HRxD0 HTxD0 P17/PO15/TIOCB2/TCLKD P16/PO14/TIOCA2/IRQ1 P15/PO13/TIOCB1/TCLKC P14/PO12/TIOCA1/IRQ0 P13/PO11/TIOCD0/TCLKB/A23 P12/PO10/TIOCC0/TCLKA/A22 P11/PO9/TIOCB0/A21 P10/PO8/TIOCA0/A20 PF7/φ STBY 3 FWE* 0.1 µF *1
PLLVSS VSS PLLCAP NMI RES P35/SCK1/IRQ5 P34/RxD1 P33/TxD1 P32/SCK0/IRQ4 VSS
102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
VSS P31/RxD0 P30/TxD0
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
EXTAL VSS XTAL VCL VCC VCC 2 OSC1* 2 OSC2*
VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 PD7/D15 PD6/D14 PD5/D13 PD4/D12 PD3/D11 PD2/D10 PD1/D9 VCC PD0/D8 VSS PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0 P47/AN7/DA1 P90/AN8 P91/AN9 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3
103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
TOP VIEW (FP-128B)
PWMVSS PJ7/ P W M 2 H PJ6/ P W M 2 G PJ5/ P W M 2 F PJ4/ P W M 2 E PWMVCC PJ3/ P W M 2 D PJ2/ P W M 2 C PJ1/ P W M 2 B PJ0/ P W M 2 A PWMVSS PH7/ P W M 1 H PH6/ P W M 1 G PH5/ P W M 1 F PH4/ P W M 1 E PWMVCC PH3/ P W M 1 D PH2/ P W M 1 C PH1/ P W M 1 B PH0/ P W M 1 A PWMVSS VSS PF3/LWR/ADTRG/IRQ3 PF4/HWR PF5/RD PF6/AS
Notes: 1. Connect a 0.1 µF capacitor between VCL and VSS (close to the pins). 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask version. These functions cannot be used with the other versions. INDEX See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 3. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
64F2636F20 H8S/2636
(U-Mask Version) 64F2636F20 H8S/2636 U
INDEX
Figure 1-2 Pin Arrangement of H8S/2636 Group (FP-128B: Top View)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 9 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
Vref AVCC NC VSS HRxD0 HTxD0 P17/PO15/TIOCB2/TCLKD P16/PO14/TIOCA2/IRQ1 P15/PO13/TIOCB1/TCLKC P14/PO12/TIOCA1/IRQ0 P13/PO11/TIOCD0/TCLKB/A23 P12/PO10/TIOCC0/TCLKA/A22 P11/PO9/TIOCB0/A21 P10/PO8/TIOCA0/A20 PF7/φ STBY FWE*4 EXTAL *1 VSS 0.1 µF XTAL VCL VCC VCC OSC1*2 OSC2*2 PLLVSS VSS PLLCAP NMI RES P35/SCK1/SCL0*3/IRQ5 P34/RxD1/SDA0*3 P33/TxD1/SCL1*3 P32/SCK0/SDA1*3/IRQ4 VSS VSS P31/RxD0 P30/TxD0
Notes: 1. Connect a 0.1 µF capacitor between VCL and VSS (close to the pins). 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 3. These pins are used for the I2C bus interface. The I2C bus interface is available as an option. The product equipped with the I2C bus interface is the W-mask version. 4. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
INDEX
INDEX
Figure 1-3 Pin Arrangement of H8S/2638 Group and H8S/2630 Group (FP-128B: Top View)
Page 10 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 PD7/D15 PD6/D14 PD5/D13 PD4/D12 PD3/D11 PD2/D10 PD1/D9 VCC PD0/D8 VSS PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0 P47/AN7/DA1 P90/AN8 P91/AN9 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3
103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
TOP VIEW (FP-128B)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
PWMVSS PJ7/ PWM2 H PJ6/ PWM2G PJ5/ PWM2 F PJ4/ PWM2 E PWMVCC PJ3/ PWM2D PJ2/ PWM2C PJ1/ PWM2B PJ0/ PWM2A PWMVSS PH7/ PWM1 H PH6/ PWM1G PH5/ PWM1 F PH4/ PWM1 E PWMVCC PH3/ PWM1D PH2/ PWM1C PH1/ PWM1B PH0/ PWM1A PWMVSS VSS PF3/LWR/ADTRG/IRQ3 PF4/HWR PF5/RD PF6/AS
(U-Mask Version) 64F2638F20 H8S/2638
INDEX
(W-Mask Version) 64F2638F20 H8S/2638 W
INDEX
64F2638F20 H8S/2638 U
(U-Mask Version) 64F2630F20 H8S/2630
INDEX
(W-Mask Version) 64F2630F20 H8S/2630 W
INDEX
64F2630F20 H8S/2630 U
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
Vref AVCC NC VSS HRxD0 HTxD0 P17/PO15/TIOCB2/TCLKD P16/PO14/TIOCA2/IRQ1 P15/PO13/TIOCB1/TCLKC P14/PO12/TIOCA1/IRQ0 P13/PO11/TIOCD0/TCLKB/A23 P12/PO10/TIOCC0/TCLKA/A22 P11/PO9/TIOCB0/A21 P10/PO8/TIOCA0/A20 PF7/φ STBY FWE*3 EXTAL *1 VSS 0.1 µF XTAL VCL VCC VCC VSS NC PLLVSS VSS PLLCAP NMI RES P35/SCK1/SCL0*2/IRQ5 P34/RxD1/SDA0*2 P33/TxD1/SCL1*2 P32/SCK0/SDA1*2/IRQ4 VSS VSS P31/RxD0 P30/TxD0
Notes: 1. Connect a 0.1 µF capacitor between VCL and VSS (close to the pins). 2. These pins are used for the I2C bus interface. The I2C bus interface is available as an option. The product equipped with the I2C bus interface is the W-mask version. INDEX 3. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
Figure 1-4 Pin Arrangement of H8S/2639 Group (FP-128B: Top View)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 PD7/D15 PD6/D14 PD5/D13 PD4/D12 PD3/D11 PD2/D10 PD1/D9 VCC PD0/D8 VSS PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0 P47/AN7/DA1 P90/AN8 P91/AN9 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3
103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
TOP VIEW (FP-128B)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
PWMVSS PJ7/PWM2H PJ6/PWM2G PJ5/PWM2F PJ4/PWM2E PWMVCC PJ3/PWM2D PJ2/PWM2C PJ1/PWM2B PJ0/PWM2A PWMVSS PH7/PWM1H PH6/PWM1G PH5/PWM1F PH4/PWM1E PWMVCC PH3/PWM1D PH2/PWM1C PH1/PWM1B PH0/PWM1A PWMVSS VSS PF3/LWR/ADTRG/IRQ3 PF4/HWR PF5/RD PF6/AS
(U-Mask Version)
64F2639F20 H8S/2639 U
(W-Mask Version) 64F2639F20 H8S/2639 W
INDEX
Page 11 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
Vref AVCC NC VSS HRxD0 HTxD0 P17/TIOCB2/TCLKD P16/TIOCA2/IRQ1 P15/TIOCB1/TCLKC P14/TIOCA1/IRQ0 P13/TIOCD0/TCLKB/A23 P12/TIOCC0/TCLKA/A22 P11/PO9/TIOCB0/A21 P10/PO8/TIOCA0/A20 PF7/φ STBY FWE*2 EXTAL *1 VSS 0.1 µF XTAL VCL VCC VCC VSS NC PLLVSS VSS PLLCAP NMI RES P35/SCK1/IRQ5 P34/RxD1 P33/TxD1 P32/SCK0/IRQ4 VSS VSS P31/RxD0 P30/TxD0
Notes: The PPG and D/A converter pin functions not implemented. 1. Connect a 0.1 µF capacitor between VCL and VSS (close to the pins). 2. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss.
Figure 1-5 Pin Arrangement of H8S/2635 Group (FP-128B: Top View)
Page 12 of 1458
VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 PD7/D15 PD6/D14 PD5/D13 PD4/D12 PD3/D11 PD2/D10 PD1/D9 VCC PD0/D8 VSS PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS VSS VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6 P47/AN7 P90/AN8 P91/AN9 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3
103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128
TOP VIEW (FP-128B)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
PWMVSS PJ7/PWM2H PJ6/PWM2G PJ5/PWM2F PJ4/PWM2E PWMVCC PJ3/PWM2D PJ2/PWM2C PJ1/PWM2B PJ0/PWM2A PWMVSS PH7/ P W M 1 H PH6/ P W M 1 G PH5/ P W M 1 F PH4/ P W M 1 E PWMVCC PH3/ P W M 1 D PH2/ P W M 1 C PH1/ P W M 1 B PH0/ P W M 1 A PWMVSS VSS PF3/LWR/ADTRG/IRQ3 PF4/HWR PF5/RD PF6/AS
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
1.3.2
Pin Functions in Each Operating Mode
Table 1-2 shows the pin functions for each operating mode. Table 1-2
Pin No. FP-128B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Mode 4 VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 A7 A6 A5 A4 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 VCC D8 VSS Mode 5 VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 A7 A6 A5 A4 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 VCC D8 VSS
Pin Functions in Each Operating Mode
Pin Name Mode 6 VCC VCC NC NC PA0/A16 PA1/A17/TxD2 PA2/A18/RxD2 PA3/A19/SCK2 PC7/A7 PC6/A6 PC5/A5 PC4/A4 PC3/A3 PC2/A2 PC1/A1 PC0/A0 D15 D14 D13 D12 D11 D10 D9 VCC D8 VSS Mode 7 VCC VCC NC NC PA0 PA1/TxD2 PA2/RxD2 PA3/SCK2 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 VCC PD0 VSS
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 13 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Pin No. FP-128B 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 Mode 4 PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1 AS RD HWR LWR/ADTRG/ IRQ3 VSS PWMVSS PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PWMVCC PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H PWMVSS PJ0/PWM2A PJ1/PWM2B Mode 5 PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1 AS RD HWR PF3/LWR/ADTRG/ IRQ3 VSS PWMVSS PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PWMVCC PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H PWMVSS PJ0/PWM2A PJ1/PWM2B
Pin Name Mode 6 PE7/D7 PE6/D6 PE5/D5 PE4/D4 PE3/D3 PE2/D2 PE1/D1 PE0/D0 VSS VSS HRxD1 HTxD1 AS RD HWR PF3/LWR/ADTRG/ IRQ3 VSS PWMVSS PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PWMVCC PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H PWMVSS PJ0/PWM2A PJ1/PWM2B Mode 7 PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 VSS VSS HRxD1 HTxD1 PF6 PF5 PF4 PF3/ADTRG/ IRQ3 VSS PWMVSS PH0/PWM1A PH1/PWM1B PH2/PWM1C PH3/PWM1D PWMVCC PH4/PWM1E PH5/PWM1F PH6/PWM1G PH7/PWM1H PWMVSS PJ0/PWM2A PJ1/PWM2B
Page 14 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 1 Overview
Pin No. FP-128B 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 Mode 4 PJ2/PWM2C PJ3/PWM2D PWMVCC PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H PWMVSS P30/TxD0 P31/RxD0 VSS VSS P32/SCK0/SDA1 / IRQ4 P33/TxD1/SCL1*2 P34/RxD1/SDA0 *2 *2 Mode 5 PJ2/PWM2C PJ3/PWM2D PWMVCC PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H PWMVSS P30/TxD0 P31/RxD0 VSS VSS P32/SCK0/SDA1 / IRQ4 P33/TxD1/SCL1*2 P34/RxD1/SDA0 *2 *2
Pin Name Mode 6 PJ2/PWM2C PJ3/PWM2D PWMVCC PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H PWMVSS P30/TxD0 P31/RxD0 VSS VSS P32/SCK0/SDA1 / IRQ4 P33/TxD1/SCL1*2 P34/RxD1/SDA0 *2 *2 Mode 7 PJ2/PWM2C PJ3/PWM2D PWMVCC PJ4/PWM2E PJ5/PWM2F PJ6/PWM2G PJ7/PWM2H PWMVSS P30/TxD0 P31/RxD0 VSS VSS P32/SCK0/SDA1*2/ IRQ4 P33/TxD1/SCL1*2 P34/RxD1/SDA0*2 P35/SCK1/SCL0*2/ IRQ5 RES NMI PLLCAP VSS PLLVSS OSC2*1 OSC1*1 VCC VCC VCL XTAL VSS EXTAL FWE*3
P35/SCK1/SCL0*2/ IRQ5 RES NMI PLLCAP VSS PLLVSS OSC2*1 OSC1*1 VCC VCC VCL XTAL VSS EXTAL FWE*3
P35/SCK1/SCL0*2/ IRQ5 RES NMI PLLCAP VSS PLLVSS OSC2*1 OSC1*1 VCC VCC VCL XTAL VSS EXTAL FWE*3
P35/SCK1/SCL0*2/ IRQ5 RES NMI PLLCAP VSS PLLVSS OSC2*1 OSC1*1 VCC VCC VCL XTAL VSS EXTAL FWE*3
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 15 of 1458
Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Pin No. FP-128B 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 Mode 4 STBY PF7/φ Mode 5 STBY PF7/φ
Pin Name Mode 6 STBY PF7/φ Mode 7 STBY PF7/φ
P10/PO8*4/TIOCA0/A20 P10/PO8*4/TIOCA0/A20 P10/PO8*4/TIOCA0/A20 P10/PO8*4/TIOCA0 P11/PO9*4/TIOCB0/A21 P11/PO9*4/TIOCB0/A21 P11/PO9*4/TIOCB0/A21 P11/PO9*4/TIOCB0 P12/PO10*4/TIOCC0/ TCLKA/A22 P13/PO11*4/TIOCD0/ TCLKB/A23 P14/PO12*4/TIOCA1/ IRQ0 P15/PO13*4/TIOCB1/ TCLKC P16/PO14*4/TIOCA2/ IRQ1 P17/PO15*4/TIOCB2/ TCLKD HTxD0 HRxD0 VSS NC AVCC Vref P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0*4 P47/AN7/DA1*4 P90/AN8 P91/AN9 P12/PO10*4/TIOCC0/ TCLKA/A22 P13/PO11*4/TIOCD0/ TCLKB/A23 P14/PO12*4/TIOCA1/ IRQ0 P15/PO13*4/TIOCB1/ TCLKC P16/PO14*4/TIOCA2/ IRQ1 P17/PO15*4/TIOCB2/ TCLKD HTxD0 HRxD0 VSS NC AVCC Vref P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0*4 P47/AN7/DA1*4 P90/AN8 P91/AN9 P12/PO10*4/TIOCC0/ TCLKA/A22 P13/PO11*4/TIOCD0/ TCLKB/A23 P14/PO12*4/TIOCA1/ IRQ0 P15/PO13*4/TIOCB1/ TCLKC P16/PO14*4/TIOCA2/ IRQ1 P17/PO15*4/TIOCB2/ TCLKD HTxD0 HRxD0 VSS NC AVCC Vref P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0*4 P47/AN7/DA1*4 P90/AN8 P91/AN9 P12/PO10*4/TIOCC0/ TCLKA P13/PO11*4/TIOCD0/ TCLKB P14/PO12*4/TIOCA1/ IRQ0 P15/PO13*4/TIOCB1/ TCLKC P16/PO14*4/TIOCA2/ IRQ1 P17/PO15*4/TIOCB2/ TCLKD HTxD0 HRxD0 VSS NC AVCC Vref P40/AN0 P41/AN1 P42/AN2 P43/AN3 P44/AN4 P45/AN5 P46/AN6/DA0*4 P47/AN7/DA1*4 P90/AN8 P91/AN9
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Section 1 Overview
Pin No. FP-128B 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Mode 4 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3 Mode 5 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3
Pin Name Mode 6 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/A15/TIOCB5 PB6/A14/TIOCA5 PB5/A13/TIOCB4 PB4/A12/TIOCA4 PB3/A11/TIOCD3 PB2/A10/TIOCC3 PB1/A9/TIOCB3 VSS PB0/A8/TIOCA3 Mode 7 P92/AN10 P93/AN11 AVSS MD0 MD1 MD2 PF0/IRQ2 PB7/TIOCB5 PB6/TIOCA5 PB5/TIOCB4 PB4/TIOCA4 PB3/TIOCD3 PB2/TIOCC3 PB1/TIOCB3 VSS PB0/TIOCA3
Notes: NC pins should be connected to VSS or left open. 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. The H8S/2639 and H8S/2635 Groups have no OSC1 and OSC2 pins. 2 2. These pins are used for the I C bus interface. The I2C bus interface is available as an option (H8S/2638, H8S/2639, H8S/2630 only). The product equipped with the I2C bus interface is the W-mask version. 3. The FWE pin is for compatibility with the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss. 4. The PPG output, DA0, and DA1 are not supported in H8S/2635 Group.
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Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
1.3.3
Pin Functions
Table 1-3 outlines the pin functions of the H8S/2636. Table 1-3
Type Power
Pin Functions
Symbol VCC I/O Input Name and Function Power supply: For connection to the power supply. All VCC pins should be connected to the system power supply. Ground: For connection to ground (0 V). All VSS pins should be connected to the system power supply (0 V). On-chip step-down power supply pin: The VCL pin need not be connected to the power supply. Connect this pin to VSS via a 0.1 µF capacitor (placed close to the pins). PLL ground: Ground for on-chip PLL oscillator. PLL capacitance: External capacitance pin for on-chip PLL oscillator. Crystal: Connects to a crystal oscillator. See section 22A, 22B, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator. External clock: Connects to a crystal oscillator. See section 22A, 22B, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator. Subclock: Connects to a 32.768 kHz crystal oscillator. See section 22A, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator. Subclock: Connects to a 32.768 kHz crystal oscillator. See section 22A, Clock Pulse Generator, for typical connection diagrams for a crystal oscillator. System clock: Supplies the system clock to an external device. HCAN transmit data: Pin for CAN bus transmission. HCAN receive data: Pin for CAN bus reception.
VSS
Input
VCL
Output
Clock
PLLVSS PLLCAP XTAL
Input Input Input
EXTAL
Input
OSC1*
1
Input
OSC2*
1
Input
φ HCAN HTxD0, 3 HTxD1* HRxD0, 3 HRxD1*
Output Output Input
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Section 1 Overview
Type Operating mode control
Symbol MD2 to MD0
I/O Input
Name and Function Mode pins: These pins set the operating mode. The relation between the settings of pins MD2 to MD0 and the operating mode is shown below. These pins should not be changed while the H8S/2636 is operating. MD2 0 MD1 0 1 1 0 1 MD0 0 1 0 1 0 1 0 1 Operating Mode — — — — Mode 4 Mode 5 Mode 6 Mode 7
System control
RES STBY FWE*
2
Input Input Input Input
Reset input: When this pin is driven low, the chip is reset. Standby: When this pin is driven low, a transition is made to hardware standby mode. Flash write enable: Pin for flash memory use (in planning stage). Nonmaskable interrupt: Requests a nonmaskable interrupt. When this pin is not used, it should be fixed high. Interrupt request 5 to 0: These pins request a maskable interrupt. Address bus: These pins output an address. Data bus: These pins constitute a bidirectional data bus. Address strobe: When this pin is low, it indicates that address output on the address bus is enabled. Read: When this pin is low, it indicates that the external address space can be read. High write: A strobe signal that writes to external space and indicates that the upper half (D15 to D8) of the data bus is enabled.
Interrupts
NMI
IRQ5 to IRQ0 Input Address bus Data bus Bus control A23 to A0 D15 to D0 AS RD HWR Output I/O Output Output Output
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Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Type Bus control
Symbol LWR
I/O Output
Name and Function Low write: A strobe signal that writes to external space and indicates that the lower half (D7 to D0) of the data bus is enabled. Clock input D to A: These pins input an external clock. Input capture/output compare match A0 to D0: The TGR0A to TGR0D input capture input or output compare output, or PWM output pins. Input capture/output compare match A1 and B1: The TGR1A and TGR1B input capture input or output compare output, or PWM output pins. Input capture/output compare match A2 and B2: The TGR2A and TGR2B input capture input or output compare output, or PWM output pins. Input capture/output compare match A3 to D3: The TGR3A to TGR3D input capture input or output compare output, or PWM output pins. Input capture/output compare match A4 and B4: The TGR4A and TGR4B input capture input or output compare output, or PWM output pins. Input capture/output compare match A5 and B5: The TGR5A and TGR5B input capture input or output compare output, or PWM output pins. Pulse output 15 to 8: Pulse output pins.
16-bit timerpulse unit (TPU)
TCLKD to TCLKA TIOCA0, TIOCB0, TIOCC0, TIOCD0 TIOCA1, TIOCB1 TIOCA2, TIOCB2 TIOCA3, TIOCB3, TIOCC3, TIOCD3 TIOCA4, TIOCB4 TIOCA5, TIOCB5
Input I/O
I/O
I/O
I/O
I/O
I/O
Programmable pulse generator (PPG) Serial communication interface (SCI)/ Smart Card interface
PO15 to 4 PO8* TxD2, TxD1, TxD0 RxD2, RxD1, RxD0 SCK2, SCK1, SCK0
Output
Output
Transmit data (channel 0, 1, 2): Data output pins.
Input
Receive data (channel 0, 1, 2): Data input pins.
I/O
Serial clock (channel 0, 1, 2): Clock I/O pins.
A/D converter
AN11 to AN0 Input ADTRG Input
Analog 11 to 0: Analog input pins. A/D conversion external trigger input: Pin for input of an external trigger to start A/D conversion.
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Section 1 Overview
Type D/A converter A/D converter, D/A converter
Symbol
5 DA1, DA0*
I/O Output Input
Name and Function Analog output: Analog output pins for D/A converter. Analog power supply: A/D converter and D/A converter power supply pin. When the A/D converter and D/A converter are not used, this pin should be connected to the system power supply (+5 V).
AVCC
AVSS
Input
Analog ground: Ground pin for A/D converter and D/A converter. Connect to system power supply (0 V). Analog reference power supply: A/D converter and D/A converter reference voltage input pin. When the A/D converter and D/A converter are not used, this pin should be connected to the system power supply (+5 V).
Vref
Input
I/O ports
P17 to P10
I/O
Port 1: An 8-bit I/O port. Input or output can be designated for each bit by means of the port 1 data direction register (P1DDR). Port 3: A 6-bit I/O port. Input or output can be designated for each bit by means of the port 3 data direction register (P3DDR). Port 4: An 8-bit input port. Port 9: A 4-bit input port. Port A: A 4-bit I/O port. Input or output can be designated for each bit by means of the port A data direction register (PADDR). Port B: An 8-bit I/O port. Input or output can be designated for each bit by means of the port B data direction register (PBDDR). Port C: An 8-bit I/O port. Input or output can be designated for each bit by means of the port C data direction register (PCDDR). Port D: An 8-bit I/O port. Input or output can be designated for each bit by means of the port D data direction register (PDDDR). Port E: An 8-bit I/O port. Input or output can be designated for each bit by means of the port E data direction register (PEDDR).
P35 to P30
I/O
P47 to P40 P93 to P90 PA3 to PA0
Input Input I/O
PB7 to PB0
I/O
PC7 to PC0
I/O
PD7 to PD0
I/O
PE7 to PE0
I/O
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Type I/O ports
Symbol PF7 to PF3, PF0 PH7 to PH0
I/O I/O
Name and Function Port F: A 6-bit I/O port. Input or output can be designated for each bit by means of the port F data direction register (PFDDR). Port H: An 8-bit I/O port. Input or output can be designated for each bit by means of the port B data direction register (PHDDR). Port J: An 8-bit I/O port. Input or output can be designated for each bit by means of the port J data direction register (PJDDR). PWM output: Motor control PWM channel 1 output pins. PWM output: Motor control PWM channel 2 output pins. PWM Power Supply: Power supply pin for motorcontrol PWM. Connect to the system power supply (+5 V) when the motor-control function is not used. PWM Ground: Ground pin for motor-control PWM. Connect to the system power supply (0 V). I C clock input/output (Channel 0/1): I C clock input/output pins that have bus-driving capability. The output of SCL0 is an NMOS open-drain type. I C data input/output (Channel 0/1): I C data input/output pins that have bus-driving capability. The output of SDA0 is an NMOS open-drain type.
2 2 2 2
I/O
PJ7 to PJ0
I/O
Motor control PWM
PWM1A to PWM1H PWM2A to PWM2H PWMVCC
Output Output Input
PWMVSS
2
Input
I C bus interface SCL0, SCL1 I/O (IIC) (Optionk) (Only for the Wmask version of SDA0, SDA1 I/O the H8S/2638, H8S/2639, and H8S/2630)
Notes: 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. The H8S/2639 and H8S/2635 Groups have no OSC1 and OSC2 pins. 2. The FWE pin is functional only in the flash memory version. The FWE pin is a NC pin in the mask ROM versions. In the mask ROM version, the FWE pin must be left open or be connected to Vss. 3. The HTxD1 and HRxD1 pins are not supported in H8S/2635 Group. 4. The PO15 to PO8 output are not supported in H8S/2635 Group. 5. The DA1 and DA0 output are not supported in H8S/2635 Group.
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Section 1 Overview
1.4
Differences between H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634
There are four versions of the H8S/2636, including ROM and U-mask options; there are six versions of the H8S/2638, including ROM, U-mask, and W-mask options; and there are four versions of the H8S/2639, including ROM, U-mask, and W-mask options; and there are six versions of the H8S/2630, including ROM, U-mask, and W-mask options. The specifications of these products are compared in table 1-4 below. Table 1-4 Comparison of Product Specifications
Product Specifications Part No. Model ROM RAM Subclock I2C Bus Function Interface No No DTC, PBC, Power-Down PPG, Modes DAC See section 23A, PowerDown Modes See section 23B, PowerDown Modes No See section 23A, PowerDown Modes See section 23B, PowerDown Modes No See section 23A, PowerDown Modes See section 23B, PowerDown Modes See section 23A, PowerDown Modes See section 23B, PowerDown Modes
HCAN
H8S/2636
128-kbyte on-chip flash HD64F2636UF memory HD64F2636F
4-kbyte SRAM
2 Yes channels
Yes
HD6432636F
128-kbyte mask ROM
No
HD6432636UF
Yes
H8S/2638
HD64F2638F
256-kbyte on-chip flash HD64F2638UF memory HD64F2638WF HD6432638F 256-kbyte mask ROM
16-kbyte No SRAM Yes
Yes No No
HD6432638UF HD6432638WF
Yes Yes
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Section 1 Overview
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Product Specifications Part No. Model ROM RAM Subclock I2C Bus Function Interface No Yes DTC, PBC, Power-Down PPG, Modes DAC See section 23B, PowerDown Modes
HCAN
H8S/2639*
HD64F2639UF 256-kbyte HD64F2639WF on-chip flash memory HD6432639UF 256-kbyte HD6432639WF mask ROM
16-kbyte Yes SRAM
2 Yes channels
No Yes 16-kbyte No SRAM Yes Yes No See section 23A, PowerDown Modes See section 23B, PowerDown Modes See section 23A, PowerDown Modes See section 23B, PowerDown Modes 1 channel No
H8S/2630
HD64F2630F
384-kbyte on-chip flash HD64F2630UF memory HD64F2630WF HD6432630F 384-kbyte mask ROM
No
No
HD6432630UF HD6432630WF H8S/2635* HD64F2635F 192-kbyte on-chip flash memory 192-kbyte mask ROM 128-kbyte mask ROM 6-kbyte SRAM
Yes Yes Yes No
HD6432635F H8S/2634* HD6432634F
Note:
*
For details of the H8S/2639, H8S/2635, and H8S/2634 clock pulse generator, see section 22B, Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group).
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Section 2 CPU
Section 2 CPU
2.1 Overview
The H8S/2600 CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2600 CPU has sixteen 16-bit general registers, can address a 16-Mbyte (architecturally 4-Gbyte) linear address space, and is ideal for realtime control. 2.1.1 Features
The H8S/2600 CPU has the following features. • Upward-compatible with H8/300 and H8/300H CPUs ⎯ Can execute H8/300 and H8/300H object programs • General-register architecture ⎯ Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) • Sixty-nine basic instructions ⎯ 8/16/32-bit arithmetic and logic instructions ⎯ Multiply and divide instructions ⎯ Powerful bit-manipulation instructions ⎯ Multiply-and-accumulate instruction • Eight addressing modes ⎯ Register direct [Rn] ⎯ Register indirect [@ERn] ⎯ Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)] ⎯ Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn] ⎯ Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32] ⎯ Immediate [#xx:8, #xx:16, or #xx:32] ⎯ Program-counter relative [@(d:8,PC) or @(d:16,PC)] ⎯ Memory indirect [@@aa:8] • 16-Mbyte address space ⎯ Program: 16 Mbytes ⎯ Data: 16 Mbytes (4 Gbytes architecturally)
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Section 2 CPU
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• High-speed operation ⎯ All frequently-used instructions execute in one or two states ⎯ Maximum clock rate ⎯ 8 × 8-bit register-register multiply ⎯ 16 ÷ 8-bit register-register divide ⎯ 16 × 16-bit register-register multiply ⎯ 32 ÷ 16-bit register-register divide • Two CPU operating modes ⎯ Normal mode* ⎯ Advanced mode Note: * Not available in the chip. • Power-down state ⎯ Transition to power-down state by SLEEP instruction ⎯ CPU clock speed selection 2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU : 20 MHz : 150 ns : 600 ns : 200 ns : 1000 ns ⎯ 8/16/32-bit register-register add/subtract : 50 ns
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below. • Register configuration The MAC register is supported only by the H8S/2600 CPU. • Basic instructions The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the H8S/2600 CPU. • Number of execution states The number of execution states of the MULXU and MULXS instructions is different in each CPU.
Execution States Instruction MULXU MULXS Mnemonic MULXU.B Rs, Rd MULXU.W Rs, ERd MULXS.B Rs, Rd MULXS.W Rs, ERd H8S/2600 3 4 4 5 H8S/2000 12 20 13 21
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Section 2 CPU
In addition, there are differences in address space, CCR and EXR register functions, power-down modes, etc., depending on the model. 2.1.3 Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2600 CPU has the following enhancements. • More general registers and control registers ⎯ Eight 16-bit expanded registers, and one 8-bit and two 32-bit control registers, have been added • Expanded address space ⎯ Normal mode* supports the same 64-kbyte address space as the H8/300 CPU ⎯ Advanced mode supports a maximum 16-Mbyte address space Note: * Not available in the chip. • Enhanced addressing ⎯ The addressing modes have been enhanced to make effective use of the 16-Mbyte address space • Enhanced instructions ⎯ Addressing modes of bit-manipulation instructions have been enhanced ⎯ Signed multiply and divide instructions have been added ⎯ A multiply-and-accumulate instruction has been added ⎯ Two-bit shift instructions have been added ⎯ Instructions for saving and restoring multiple registers have been added ⎯ A test and set instruction has been added • Higher speed ⎯ Basic instructions execute twice as fast
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Section 2 CPU
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
2.1.4
Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2600 CPU has the following enhancements. • Additional control register ⎯ One 8-bit and two 32-bit control registers have been added • Enhanced instructions ⎯ Addressing modes of bit-manipulation instructions have been enhanced ⎯ A multiply-and-accumulate instruction has been added ⎯ Two-bit shift instructions have been added ⎯ Instructions for saving and restoring multiple registers have been added ⎯ A test and set instruction has been added • Higher speed ⎯ Basic instructions execute twice as fast
2.2
CPU Operating Modes
The H8S/2600 CPU has two operating modes: normal and advanced. Normal mode* supports a maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte total address space (architecturally a maximum 16-Mbyte program area and a maximum of 4 Gbytes for program and data areas combined). The mode is selected by the mode pins of the microcontroller. Note: * Not available in the chip.
Normal mode* Maximum 64 kbytes, program and data areas combined
CPU operating modes
Advanced mode Note: * Not available in the chip.
Maximum 16-Mbytes for program and data areas combined
Figure 2-1 CPU Operating Modes
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Section 2 CPU
(1) Normal Mode (Not Available in the Chip) The exception vector table and stack have the same structure as in the H8/300 CPU. Address Space: A maximum address space of 64 kbytes can be accessed. Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit segments of 32-bit registers. When En is used as a 16-bit register it can contain any value, even when the corresponding general register (Rn) is used as an address register. If the general register is referenced in the register indirect addressing mode with pre-decrement (@–Rn) or post-increment (@Rn+) and a carry or borrow occurs, however, the value in the corresponding extended register (En) will be affected. Instruction Set: All instructions and addressing modes can be used. Only the lower 16 bits of effective addresses (EA) are valid. Exception Vector Table and Memory Indirect Branch Addresses: In normal mode the top area starting at H'0000 is allocated to the exception vector table. One branch address is stored per 16 bits (figure 2-2). The exception vector table differs depending on the microcontroller. For details of the exception vector table, see section 4, Exception Handling.
H'0000 H'0001 H'0002 H'0003 H'0004 H'0005 H'0006 H'0007 H'0008 H'0009 H'000A H'000B
Reset exception vector
(Reserved for system use)
Exception vector table
Exception vector 1 Exception vector 2
Figure 2-2 Exception Vector Table (Normal Mode) The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute address included in the instruction code to specify a memory operand that contains a branch address. In normal mode the operand is a 16-bit word operand, providing a 16REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 29 of 1458
Section 2 CPU
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
bit branch address. Branch addresses can be stored in the top area from H'0000 to H'00FF. Note that this area is also used for the exception vector table. Stack Structure: When the program counter (PC) is pushed onto the stack in a subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto the stack in exception handling, they are stored as shown in figure 2-3. When EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
PC (16 bits)
SP
*2
(SP
)
EXR*1 Reserved*1 *3 CCR CCR*3 PC (16 bits)
(a) Subroutine Branch
(b) Exception Handling
Notes: 1. When EXR is not used it is not stored on the stack. 2. SP when EXR is not used. 3. Ignored when returning.
Figure 2-3 Stack Structure in Normal Mode (2) Advanced Mode Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4 Gbytes for program and data areas combined). Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit segments of 32-bit registers or address registers. Instruction Set: All instructions and addressing modes can be used.
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Section 2 CPU
Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top area starting at H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a branch address is stored in the lower 24 bits (figure 2-4). For details of the exception vector table, see section 4, Exception Handling.
H'00000000 Reserved Reset exception vector H'00000003 H'00000004 Reserved
H'00000007 H'00000008 Exception vector table
H'0000000B H'0000000C
(Reserved for system use)
H'00000010
Reserved Exception vector 1
Figure 2-4 Exception Vector Table (Advanced Mode) The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses an 8-bit absolute address included in the instruction code to specify a memory operand that contains a branch address. In advanced mode the operand is a 32-bit longword operand, providing a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note that the first part of this range is also the exception vector table.
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Section 2 CPU
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Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR) are pushed onto the stack in exception handling, they are stored as shown in figure 2-5. When EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
SP SP Reserved PC (24 bits) (SP
*2
)
EXR*1 Reserved*1 *3 CCR PC (24 bits)
(a) Subroutine Branch
(b) Exception Handling
Notes: 1. When EXR is not used it is not stored on the stack. 2. SP when EXR is not used. 3. Ignored when returning.
Figure 2-5 Stack Structure in Advanced Mode
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2.3
Address Space
Figure 2-6 shows a memory map of the H8S/2600 CPU. The H8S/2600 CPU provides linear access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte (architecturally 4-Gbyte) address space in advanced mode.
H'0000 H'00000000
H'FFFF
Program area
H'00FFFFFF
Data area
Cannot be used by the chip
H'FFFFFFFF (a) Normal Mode* Note: * Not available in the chip. (b) Advanced Mode
Figure 2-6 Memory Map
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2.4
2.4.1
Register Configuration
Overview
The CPU has the internal registers shown in figure 2-7. There are two types of registers: general registers and control registers.
General Registers (Rn) and Extended Registers (En) 15 ER0 ER1 ER2 ER3 ER4 ER5 ER6 ER7 (SP) Control Registers (CR) 23 PC 76543210 EXR T ⎯ ⎯ ⎯ ⎯ I2 I1 I0 76543210 CCR I UI H U N Z V C 63 MAC 31 Legend: SP: PC: EXR: T: I2 to I0: CCR: I: UI: Sign extension MACL 0 41 MACH 32 0 E0 E1 E2 E3 E4 E5 E6 E7 07 R0H R1H R2H R3H R4H R5H R6H R7H 07 R0L R1L R2L R3L R4L R5L R6L R7L 0
Stack pointer Program counter Extended control register Trace bit Interrupt mask bits Condition-code register Interrupt mask bit User bit or interrupt mask bit*
H: U: N: Z: V: C: MAC:
Half-carry flag User bit Negative flag Zero flag Overflow flag Carry flag Multiply-accumulate register
Note: * Cannot be used as an interrupt mask bit in the chip.
Figure 2-7 CPU Registers
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2.4.2
General Registers
The CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used as both address registers and data registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit registers. Figure 2-8 illustrates the usage of the general registers. The usage of each register can be selected independently.
• Address registers • 32-bit registers
• 16-bit registers E registers (extended registers) (E0 to E7)
• 8-bit registers
ER registers (ER0 to ER7) R registers (R0 to R7)
RH registers (R0H to R7H)
RL registers (R0L to R7L)
Figure 2-8 Usage of General Registers
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General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2-9 shows the stack.
Free area
SP (ER7)
Stack area
Figure 2-9 Stack 2.4.3 Control Registers
The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR), 8-bit condition-code register (CCR), and 64-bit multiply-accumulate register (MAC). (1) Program Counter (PC) This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored (When an instruction is fetched, the least significant PC bit is regarded as 0). (2) Extended Control Register (EXR) This 8-bit register contains the trace bit (T) and three interrupt mask bits (I2 to I0). Bit 7—Trace Bit (T): Selects trace mode. When this bit is cleared to 0, instructions are executed in sequence. When this bit is set to 1, a trace exception is generated each time an instruction is executed. Bits 6 to 3—Reserved: These bits are reserved. They are always read as 1.
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Section 2 CPU
Bits 2 to 0—Interrupt Mask Bits (I2 to I0): These bits designate the interrupt mask level (0 to 7). For details, refer to section 5, Interrupt Controller. Operations can be performed on the EXR bits by the LDC, STC, ANDC, ORC, and XORC instructions. All interrupts, including NMI, are disabled for three states after one of these instructions is executed, except for STC. (3) Condition-Code Register (CCR) This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1 (NMI is accepted regardless of the I bit setting). The I bit is set to 1 by hardware at the start of an exceptionhandling sequence. For details, refer to section 5, Interrupt Controller. Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask bit. For details, refer to section 5, Interrupt Controller. Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. Bit 3—Negative Flag (N): Stores the value of the most significant bit (sign bit) of data. Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by: • Add instructions, to indicate a carry • Subtract instructions, to indicate a borrow • Shift and rotate instructions, to store the value shifted out of the end bit
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The carry flag is also used as a bit accumulator by bit manipulation instructions. Some instructions leave some or all of the flag bits unchanged. For the action of each instruction on the flag bits, refer to appendix A.1, Instruction List. Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch (Bcc) instructions. (4) Multiply-Accumulate Register (MAC) This 64-bit register stores the results of multiply-and-accumulate operations. It consists of two 32bit registers denoted MACH and MACL. The lower 10 bits of MACH are valid; the upper bits are a sign extension. 2.4.4 Initial Register Values
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized. The stack pointer should therefore be initialized by an MOV.L instruction executed immediately after a reset.
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2.5
Data Formats
The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats
Figure 2-10 shows the data formats in general registers.
Data Type Register Number Data Format
1-bit data
RnH
7 0 76543210
Don’t care
1-bit data
RnL
Don’t care
7 0 76543210
4-bit BCD data
RnH
7 Upper
43 Lower
0 Don’t care
4-bit BCD data
RnL
Don’t care
7 Upper
43 Lower
0
Byte data
RnH
7 MSB
0 Don’t care LSB 7
Don’t care
Byte data
RnL
0 LSB
MSB
Figure 2-10 General Register Data Formats
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Data Type
Register Number
Data Format
Word data
Rn
15 MSB
0 LSB
Word data 15 MSB Longword data 31 MSB
En 0 LSB ERn 16 15 En Rn 0 LSB
Legend: ERn: General register ER En: General register E Rn: General register R RnH: General register RH RnL: General register RL MSB: Most significant bit LSB: Least significant bit
Figure 2-10 General Register Data Formats (cont)
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2.5.2
Memory Data Formats
Figure 2-11 shows the data formats in memory. The CPU can access word data and longword data in memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches.
Data Type Address Data Format
7 1-bit data Address L 7 6 5 4 3 2 1
0 0
Byte data
Address L
MSB
LSB
Word data
Address 2M Address 2M + 1
MSB LSB
Longword data
Address 2N Address 2N + 1 Address 2N + 2 Address 2N + 3
MSB
LSB
Figure 2-11 Memory Data Formats When ER7 is used as an address register to access the stack, the operand size should be word size or longword size.
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2.6
2.6.1
Instruction Set
Overview
The H8S/2600 CPU has 69 types of instructions. The instructions are classified by function in table 2-1. Table 2-1
Function Data transfer
Instruction Classification
Instructions MOV 1 1 POP* , PUSH* LDM* , STM* 3 3 MOVFPE* , MOVTPE*
5 5
Size BWL WL L B BWL B BWL L BW WL B — BWL B — —
Types 5
Arithmetic operations
ADD, SUB, CMP, NEG ADDX, SUBX, DAA, DAS INC, DEC ADDS, SUBS MULXU, DIVXU, MULXS, DIVXS EXTU, EXTS 4 TAS* MAC, LDMAC, STMAC, CLRMAC
23
Logic operations Shift Bit manipulation Branch System control
AND, OR, XOR, NOT BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR 2 Bcc* , JMP, BSR, JSR, RTS
4 8 14 5 9 1
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP —
Block data transfer EEPMOV
Total: 69 types Legend: B: Byte W: Word L: Longword Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn, @-SP. 2. Bcc is the general name for conditional branch instructions. 3. Not available in the chip. 4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 5. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
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2.6.2
Addressing Modes
Table 2-2
#xx
Rn
@ERn
@(d:16,ERn)
@(d:32,ERn)
@−ERn/@ERn+
@aa:8
@aa:16
@aa:24
@aa:32
@(d:8,PC)
@(d:16,PC)
@@aa:8
Data transfer MOV ⎯ WL L ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ BWL WL B ⎯ L BWL B BW BW BWL WL ⎯ B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ L ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B ⎯ ⎯ ⎯ ⎯ ⎯ BWL ⎯ ⎯ ⎯ ⎯ ⎯ BWL ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ POP, PUSH LDM*3, STM*3 MOVFPE*1, MOVTPE*1 ADD, CMP SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, DIVXU MULXS, DIVXS NEG EXTU, EXTS TAS*2 MAC CLRMAC LDMAC, STMAC ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ BWL BWL BWL BWL BWL BWL B BWL BWL
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Function
Instructions and Addressing Modes
Table 2-2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU can use.
Combinations of Instructions and Addressing Modes
Arithmetic operations
Section 2 CPU
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Addressing Modes
Section 2 CPU
#xx
Rn
@ERn
@(d:16,ERn)
@(d:32,ERn)
@−ERn/@ERn+
@aa:8
@aa:16
@aa:24
@aa:32
@(d:8,PC)
@(d:16,PC)
@@aa:8
Logic operations AND, OR, XOR NOT Shift Bit manipulation Branch JMP, JSR RTS System control RTE SLEEP LDC STC ANDC, ORC, XORC NOP Block data transfer Legend: B: Byte W: Word L: Longword
Notes: 1. Not available in the chip. 2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 3. Only registers ER0 to ER6 should be used when using the STM/LDM instruction.
BWL ⎯ BWL BWL B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ W W W W ⎯ W W W W ⎯ W W ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ W W ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B ⎯ B B B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B ⎯ B ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
BWL
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Bcc, BSR
TRAPA
⎯ ⎯ ⎯
BW
⎯
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Function Instruction
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Section 2 CPU
2.6.3
Table of Instructions Classified by Function
Table 2-3 summarizes the instructions in each functional category. The notation used in table 2-3 is defined below.
Operation Notation Rd Rs Rn ERn MAC (EAd) (EAs) EXR CCR N Z V C PC SP #IMM disp + – × ÷ ∧ ∨ ⊕ → ¬ :8/:16/:24/:32 General register (destination)* General register (source)* General register* General register (32-bit register) Multiply-accumulate register (32-bit register) Destination operand Source operand Extended control register Condition-code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Program counter Stack pointer Immediate data Displacement Addition Subtraction Multiplication Division Logical AND Logical OR Logical exclusive OR Move NOT (logical complement) 8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Table 2-3
Type Data transfer
Instructions Classified by Function
Instruction MOV Size*
1
Function (EAs) → Rd, Rs → (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. Cannot be used in this LSI. Cannot be used in this LSI. @SP+ → Rn Pops a register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn. Rn → @–SP Pushes a register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP. @SP+ → Rn (register list) Pops two or more general registers from the stack. Rn (register list) → @–SP Pushes two or more general registers onto the stack.
B/W/L
MOVFPE MOVTPE POP
B B W/L
PUSH
W/L
LDM* STM*
2
L L
2
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1
Section 2 CPU
Type Arithmetic operations
Instruction ADD SUB
Size*
Function Rd ± Rs → Rd, Rd ± #IMM → Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register (Immediate byte data cannot be subtracted from byte data in a general register. Use the SUBX or ADD instruction). Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd Performs addition or subtraction with carry or borrow on byte data in two general registers, or on immediate data and data in a general register. Rd ± 1 → Rd, Rd ± 2 → Rd Increments or decrements a general register by 1 or 2 (Byte operands can be incremented or decremented by 1 only). Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. Rd decimal adjust → Rd Decimal-adjusts an addition or subtraction result in a general register by referring to the CCR to produce 4-bit BCD data. Rd × Rs → Rd Performs unsigned multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. Rd × Rs → Rd Performs signed multiplication on data in two general registers: either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits. Rd ÷ Rs → Rd Performs unsigned division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder.
B/W/L
ADDX SUBX
B
INC DEC
B/W/L
ADDS SUBS DAA DAS
L
B
MULXU
B/W
MULXS
B/W
DIVXU
B/W
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1
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Type Arithmetic operations
Instruction DIVXS
Size* B/W
Function Rd ÷ Rs → Rd Performs signed division on data in two general registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16bit remainder. Rd – Rs, Rd – #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR bits according to the result. 0 – Rd → Rd Takes the two's complement (arithmetic complement) of data in a general register. Rd (zero extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by padding with zeros on the left. Rd (sign extension) → Rd Extends the lower 8 bits of a 16-bit register to word size, or the lower 16 bits of a 32-bit register to longword size, by extending the sign bit. 3 @ERd – 0, 1 → ( of @ERd)* Tests memory contents, and sets the most significant bit (bit 7) to 1. (EAs) × (EAd) + MAC → MAC Performs signed multiplication on memory contents and adds the result to the multiply-accumulate register. The following operations can be performed: 16 bits × 16 bits + 32 bits → 32 bits, saturating 16 bits × 16 bits + 42 bits → 42 bits, non-saturating 0 → MAC Clears the multiply-accumulate register to zero. Rs → MAC, MAC → Rd Transfers data between a general register and a multiply-accumulate register.
CMP
B/W/L
NEG
B/W/L
EXTU
W/L
EXTS
W/L
TAS
B
MAC
—
CLRMAC LDMAC STMAC
— L
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1
Section 2 CPU
Type Logic operations
Instruction AND
Size*
Function Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd Performs a logical AND operation on a general register and another general register or immediate data. Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd Performs a logical OR operation on a general register and another general register or immediate data. Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. ¬ (Rd) → (Rd) Takes the one's complement of general register contents. Rd (shift) → Rd Performs an arithmetic shift on general register contents. 1-bit or 2-bit shift is possible. Rd (shift) → Rd Performs a logical shift on general register contents. 1-bit or 2-bit shift is possible. Rd (rotate) → Rd Rotates general register contents. 1-bit or 2-bit rotation is possible. Rd (rotate) → Rd Rotates general register contents through the carry flag. 1-bit or 2-bit rotation is possible.
B/W/L
OR
B/W/L
XOR
B/W/L
NOT
B/W/L
Shift operations
SHAL SHAR SHLL SHLR ROTL ROTR ROTXL ROTXR
B/W/L
B/W/L
B/W/L
B/W/L
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Type Bitmanipulation instructions
Instruction BSET
Size* B
Function 1 → ( of ) Sets a specified bit in a general register or memory operand to 1. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. 0 → ( of ) Clears a specified bit in a general register or memory operand to 0. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. ¬ ( of ) → ( of ) Inverts a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. ¬ ( of ) → Z Tests a specified bit in a general register or memory operand and sets or clears the Z flag accordingly. The bit number is specified by 3-bit immediate data or the lower three bits of a general register. C ∧ ( of ) → C ANDs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ∧ [ ¬ ( of ) ] → C ANDs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. C ∨ ( of ) → C ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ∨ [ ¬ ( of ) ] → C ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data.
BCLR
B
BNOT
B
BTST
B
BAND
B
BIAND
B
BOR
B
BIOR
B
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Type Bitmanipulation instructions
Instruction BXOR
Size* B
Function C ⊕ ( of ) → C Exclusive-ORs the carry flag with a specified bit in a general register or memory operand and stores the result in the carry flag. C ⊕ ¬ [ ( of ) ] → C Exclusive-ORs the carry flag with the inverse of a specified bit in a general register or memory operand and stores the result in the carry flag. The bit number is specified by 3-bit immediate data. ( of ) → C Transfers a specified bit in a general register or memory operand to the carry flag. ¬ ( of ) → C Transfers the inverse of a specified bit in a general register or memory operand to the carry flag. The bit number is specified by 3-bit immediate data. C → ( of ) Transfers the carry flag value to a specified bit in a general register or memory operand. ¬ C → ( of ) Transfers the inverse of the carry flag value to a specified bit in a general register or memory operand. The bit number is specified by 3-bit immediate data.
BIXOR
B
BLD
B
BILD
B
BST
B
BIST
B
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Type Branch instructions
Instruction Bcc
Size* —
Function Branches to a specified address if a specified condition is true. The branching conditions are listed below. Mnemonic BRA(BT) BRN(BF) BHI BLS BCC(BHS) BCS(BLO) BNE BEQ BVC BVS BPL BMI BGE BLT BGT BLE Description Always (true) Never (false) High Low or same Carry clear (high or same) Carry set (low) Not equal Equal Overflow clear Overflow set Plus Minus Greater or equal Less than Greater than Less or equal Condition Always Never C∨Z=0 C∨Z=1 C=0 C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 N⊕V=0 N⊕V=1 Z∨(N ⊕ V) = 0 Z∨(N ⊕ V) = 1
JMP BSR JSR RTS
— — — —
Branches unconditionally to a specified address. Branches to a subroutine at a specified address. Branches to a subroutine at a specified address. Returns from a subroutine
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Type
Instruction
Size* — — — B/W
Function Starts trap-instruction exception handling. Returns from an exception-handling routine. Causes a transition to a power-down state. (EAs) → CCR, (EAs) → EXR Moves the source operand contents or immediate data to CCR or EXR. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. CCR → (EAd), EXR → (EAd) Transfers CCR or EXR contents to a general register or memory. Although CCR and EXR are 8-bit registers, word-size transfers are performed between them and memory. The upper 8 bits are valid. CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR Logically ANDs the CCR or EXR contents with immediate data. CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR Logically ORs the CCR or EXR contents with immediate data. CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR Logically exclusive-ORs the CCR or EXR contents with immediate data. PC + 2 → PC Only increments the program counter.
System control TRAPA instructions RTE SLEEP LDC
STC
B/W
ANDC
B
ORC
B
XORC
B
NOP
—
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Type Block data transfer instruction
Instruction EEPMOV.B
Size —
Function if R4L ≠ 0 then Repeat @ER5+ → @ER6+ R4L–1 → R4L Until R4L = 0 else next; if R4 ≠ 0 then Repeat @ER5+ → @ER6+ R4–1 → R4 Until R4 = 0 else next; Transfers a data block according to parameters set in general registers R4L or R4, ER5, and ER6. R4L or R4: size of block (bytes) ER5: starting source address ER6: starting destination address Execution of the next instruction begins as soon as the transfer is completed.
EEPMOV.W
—
Notes: 1. Size refers to the operand size. B: Byte W: Word L: Longword 2. Only registers ER0 to ER6 should be used when using the STM/LDM instruction. 3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
2.6.4
Basic Instruction Formats
The CPU instructions consist of 2-byte (1-word) units. An instruction consists of an operation field (op field), a register field (r field), an effective address extension (EA field), and a condition field (cc). (1) Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first four bits of the instruction. Some instructions have two operation fields. (2) Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. (3) Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute address, or a displacement.
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(4) Condition Field: Specifies the branching condition of Bcc instructions. Figure 2-12 shows examples of instruction formats.
(1) Operation field only op NOP, RTS, etc.
(2) Operation field and register fields op rn rm ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension op EA (disp) (4) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:16, etc rn rm MOV.B @(d:16, Rn), Rm, etc.
Figure 2-12 Instruction Formats (Examples)
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2.7
2.7.1
Addressing Modes and Effective Address Calculation
Addressing Mode
The CPU supports the eight addressing modes listed in table 2-4. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except program-counter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2-4
No. 1 2 3 4 5 6 7 8
Addressing Modes
Symbol Rn @ERn @(d:16,ERn)/@(d:32,ERn) @ERn+ @–ERn @aa:8/@aa:16/@aa:24/@aa:32 #xx:8/#xx:16/#xx:32 @(d:8,PC)/@(d:16,PC) @@aa:8
Addressing Mode Register direct Register indirect Register indirect with displacement Register indirect with post-increment Register indirect with pre-decrement Absolute address Immediate Program-counter relative Memory indirect
(1) Register Direct—Rn: The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. (2) Register Indirect—@ERn: The register field of the instruction code specifies an address register (ERn) which contains the address of the operand on memory. If the address is a program instruction address, the lower 24 bits are valid and the upper 8 bits are all assumed to be 0 (H'00). (3) Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn): A 16-bit or 32-bit displacement contained in the instruction is added to an address register (ERn) specified by the register field of the instruction, and the sum gives the address of a memory operand. A 16-bit displacement is sign-extended when added.
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(4) Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn: • Register indirect with post-increment—@ERn+ The register field of the instruction code specifies an address register (ERn) which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the address register. The value added is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or longword transfer instruction, the register value should be even. • Register indirect with pre-decrement—@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the result becomes the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or longword transfer instruction, the register value should be even. (5) Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32: The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long (@aa:32). To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits (@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can access the entire address space. A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8 bits are all assumed to be 0 (H'00). Table 2-5 indicates the accessible absolute address ranges. Table 2-5 Absolute Address Access Ranges
Normal Mode* 8 bits (@aa:8) 16 bits (@aa:16) 32 bits (@aa:32) Program instruction address 24 bits (@aa:24) H'FF00 to H'FFFF H'0000 to H'FFFF Advanced Mode H'FFFF00 to H'FFFFFF H'000000 to H'007FFF, H'FF8000 to H'FFFFFF H'000000 to H'FFFFFF
Absolute Address Data address
Note: * Not available in the chip.
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(6) Immediate—#xx:8, #xx:16, or #xx:32: The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a vector address. (7) Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an even number. (8) Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF in normal mode*, H'000000 to H'0000FF in advanced mode). In normal mode* the memory operand is a word operand and the branch address is 16 bits long. In advanced mode the memory operand is a longword operand, the first byte of which is assumed to be all 0 (H'00). Note that the first part of the address range is also the exception vector area. For further details, refer to section 4, Exception Handling. Note: * Not available in the chip.
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Specified by @aa:8
Branch address
Specified by @aa:8
Reserved Branch address
(a) Normal Mode* Note: * Not available in the chip.
(b) Advanced Mode
Figure 2-13 Branch Address Specification in Memory Indirect Mode If an odd address is specified in word or longword memory access, or as a branch address, the least significant bit is regarded as 0, causing data to be accessed or instruction code to be fetched at the address preceding the specified address (For further information, see section 2.5.2, Memory Data Formats). 2.7.2 Effective Address Calculation
Table 2-6 indicates how effective addresses are calculated in each addressing mode. In normal mode* the upper 8 bits of the effective address are ignored in order to generate a 16-bit address. Note: * Not available in the chip.
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No. Effective Address Calculation Register direct (Rn) op Register indirect (@ERn) 31 31 Don’t care 24 23 General register contents op r 0 rm rn Operand is general register contents.
Addressing Mode and Instruction Format
Effective Address (EA)
Table 2.6
Section 2 CPU
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0 Register indirect with displacement @(d:16, ERn) or @(d:32, ERn) 31 General register contents 31 op disp 31 Sign extension disp 0 r 24 23 0 Don’t care 0
1
2
Effective Address Calculation
3
4 31 General register contents op r
Register indirect with post-increment or pre-decrement • Register indirect with post-increment @ERn+
0
31
24 23 Don’t care
0
1, 2, or 4 • Register indirect with pre-decrement @−ERn 31 General register contents 31 op r Operand Size Value added Byte Word Longword 1 2 4 1, 2, or 4 24 23 Don’t care 0 0
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No. Effective Address Calculation 5 @aa:8 31 24 23 H'FFFF abs
Don’t care
Addressing Mode and Instruction Format Absolute address 87 0
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Don’t care extension
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16 15 24 23 Sign 0 @aa:24 31 abs op 24 23
Don’t care
0
@aa:32 op abs 31 24 23
Don’t care
0
6 op IMM
Immediate #xx:8/#xx:16/#xx:32 Operand is immediate data.
Section 2 CPU
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No. Effective Address Calculation 23 PC contents @(d:8, PC)/@(d:16, PC) 0 7 Program-counter relative
Section 2 CPU
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Addressing Mode and Instruction Format Effective Address (EA) op 23 Sign extension disp 31 24 23
Don’t care
disp 0
0
8 Memory indirect @@aa:8 • Normal mode* op 31 H'000000 87 abs 0 31 abs
24 23
Don’t care
16 15 H'00 0
0
15 Memory contents • Advanced mode op 31 H'000000 31 Memory contents abs 87 abs
0
0
31
24 23
Don’t care
0
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Note: * Not available in the chip.
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Section 2 CPU
2.8
2.8.1
Processing States
Overview
The CPU has five main processing states: the reset state, exception handling state, program execution state, bus-released state, and power-down state. Figure 2-14 shows a diagram of the processing states. Figure 2-15 indicates the state transitions.
Reset state The CPU and all on-chip supporting modules have been initialized and are stopped. Exception-handling state A transient state in which the CPU changes the normal processing flow in response to a reset, trace, interrupt, or trap instruction. Processing states Program execution state The CPU executes program instructions in sequence. Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU. Sleep mode
Power-down state CPU operation is stopped to conserve power.*
Software standby mode Hardware standby mode
Note: * The power-down state also includes a medium-speed mode, module stop mode, subactive mode, subsleep mode, and watch mode. See section 23A and 23B, Power-Down Modes, for details.
Figure 2-14 Processing States
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End of bus request Bus request Program execution state
SLEEP instruction with SSBY = 0
d o ha f ex nd ce lin pti g on Re qu es tf or ex ce
Bus-released state
pt ion
ha
s bu of t st d ues ue En req eq r s Bu
nd
lin
g
Sleep mode
t re qu est
SLEEP instruction with SSBY = 1
r Inte
rup
En
Exception handling state
External interrupt request
Software standby mode
RES = High STBY = High, RES = Low Reset state *1 Hardware standby mode*2 Power-down state*3
Reset state
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. A transition can also be made to the reset state when the watchdog timer overflows. 2. From any state, a transition to hardware standby mode occurs when STBY goes low. 3. Apart from these states, there are also the watch mode, subactive mode, and the subsleep mode. See section 23A, 23B, Power-Down Modes.
Figure 2-15 State Transitions 2.8.2 Reset State
When the RES goes low, all current processing stops and the CPU enters the reset state. In reset state all interrupts are disenabled. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details, refer to section 12, Watchdog Timer.
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2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal processing flow due to a reset, trace, interrupt, or trap instruction. The CPU fetches a start address (vector) from the exception vector table and branches to that address. (1) Types of Exception Handling and Their Priority Exception handling is performed for traces, resets, interrupts, and trap instructions. Table 2-7 indicates the types of exception handling and their priority. Trap instruction exception handling is always accepted, in the program execution state. Exception handling and the stack structure depend on the interrupt control mode set in SYSCR. Table 2-7
Priority High
Exception Handling Types and Priority
Type of Exception Reset Detection Timing Synchronized with clock Start of Exception Handling Exception handling starts immediately after a low-to-high transition at the RES pin, or when the watchdog timer overflows. When the trace (T) bit is set to 1, the trace starts at the end of the current instruction or current exception-handling sequence When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence Exception handling starts when a trap (TRAPA) instruction is 3 executed*
Trace
End of instruction execution or end of exception-handling 1 sequence* End of instruction execution or end of exception-handling 2 sequence* When TRAPA instruction is executed
Interrupt
Trap instruction Low
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception-handling is not executed at the end of the RTE instruction. 2. Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling. 3. Trap instruction exception handling is always accepted, in the program execution state.
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(2) Reset Exception Handling After the RES pin has gone low and the reset state has been entered, when RES goes high again, reset exception handling starts. The CPU enters the reset state when the RES is low. When reset exception handling starts the CPU fetches a start address (vector) from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during reset exception handling and after it ends. (3) Traces Traces are enabled only in interrupt control mode 2. Trace mode is entered when the T bit of EXR is set to 1. When trace mode is established, trace exception handling starts at the end of each instruction. At the end of a trace exception-handling sequence, the T bit of EXR is cleared to 0 and trace mode is cleared. Interrupt masks are not affected. The T bit saved on the stack retains its value of 1, and when the RTE instruction is executed to return from the trace exception-handling routine, trace mode is entered again. Trace exceptionhandling is not executed at the end of the RTE instruction. Trace mode is not entered in interrupt control mode 0, regardless of the state of the T bit. (4) Interrupt Exception Handling and Trap Instruction Exception Handling When interrupt or trap-instruction exception handling begins, the CPU references the stack pointer (ER7) and pushes the program counter and other control registers onto the stack. Next, the CPU alters the settings of the interrupt mask bits in the control registers. Then the CPU fetches a start address (vector) from the exception vector table and program execution starts from that start address. Figure 2-16 shows the stack after exception handling ends.
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Normal mode*2
SP SP CCR CCR*1 PC (16 bits)
EXR Reserved*1 CCR CCR*1 PC (16 bits)
(a) Interrupt control mode 0
(b) Interrupt control mode 2
Advanced mode
SP SP CCR PC (24 bits)
EXR Reserved*1 CCR PC (24 bits)
(c) Interrupt control mode 0 Notes: 1. Ignored when returning. 2. Not available in the chip.
(d) Interrupt control mode 2
Figure 2-16 Stack Structure after Exception Handling (Examples)
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2.8.4
Program Execution State
In this state the CPU executes program instructions in sequence. 2.8.5 Bus-Released State
This is a state in which the bus has been released in response to a bus request from a bus master other than the CPU. While the bus is released, the CPU halts operations. Bus masters other than the CPU is data transfer controller (DTC). For further details, refer to section 7, Bus Controller. 2.8.6 Power-Down State
The power-down state includes both modes in which the CPU stops operating and modes in which the CPU does not stop. There are five modes in which the CPU stops operating: sleep mode, software standby mode, hardware standby mode, subsleep mode, and watch mode. There are also three other power-down modes: medium-speed mode, module stop mode, and subactive mode. In medium-speed mode the CPU and other bus masters operate on a medium-speed clock. Module stop mode permits halting of the operation of individual modules, other than the CPU. Subactive mode, subsleep mode, and watch mode are power-down states using subclock input. For details, refer to section 23A, 23B, Power-Down Modes. (1) Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the software standby bit (SSBY) in the standby control register (SBYCR) is cleared to 0. In sleep mode, CPU operations stop immediately after execution of the SLEEP instruction. The contents of CPU registers are retained. (2) Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit in SBYCR is set to 1, the LSON bit in LPWRCR is set to 0, and the PSS bit in TCSR (WDT1) is set to 0. In software standby mode, the CPU and clock halt and all MCU operations stop. As long as a specified voltage is supplied, the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. (3) Hardware Standby Mode: A transition to hardware standby mode is made when the STBY pin goes low. In hardware standby mode, the CPU and clock halt and all MCU operations stop. The on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained.
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2.9
2.9.1
Basic Timing
Overview
The H8S/2600 CPU is driven by a system clock, denoted by the symbol φ. The period from one rising edge of φ to the next is referred to as a "state." The memory cycle or bus cycle consists of one, two, or three states. Different methods are used to access on-chip memory, on-chip supporting modules, and the external address space. 2.9.2 On-Chip Memory (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and word transfer instruction. Figure 2-17 shows the on-chip memory access cycle. Figure 2-18 shows the pin states.
Bus cycle T1 φ Internal address bus Internal read signal Internal data bus Internal write signal Write access Internal data bus Write data Read data Address
Read access
Figure 2-17 On-Chip Memory Access Cycle
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Bus cycle T1 φ Address bus AS RD HWR, LWR Data bus Unchanged High High High High-impedance state
Figure 2-18 Pin States during On-Chip Memory Access
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2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits wide, depending on the particular internal I/O register being accessed. Figure 2-19 shows the access timing for the on-chip supporting modules. Figure 2-20 shows the pin states.
Bus cycle T1 T2
φ
Internal address bus
Address
Internal read signal Read access Internal data bus Internal write signal Write access Internal data bus Write data
Read data
Figure 2-19 On-Chip Supporting Module Access Cycle
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Bus cycle T1 T2
φ Address bus Unchanged
AS RD HWR, LWR
High
High
High
Data bus
High-impedance state
Figure 2-20 Pin States during On-Chip Supporting Module Access
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2.9.4
On-Chip HCAN Module Access Timing
On-chip HCAN module access is performed in four states. The data bus width is 16 bits. Wait states can be inserted by means of a wait request from the HCAN. On-chip HCAN module access timing is shown in figures 2-21 and 2-22, and the pin states in figure 2-23.
Bus cycle T1 φ Internal address bus HCAN read signal Read Internal data bus HCAN write signal Write Internal data bus Write data Read data Address T2 T3 T4
Figure 2-21 On-Chip HCAN Module Access Cycle (No Wait State)
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Bus cycle T1 φ Internal address bus HCAN read signal Read Internal data bus HCAN write signal Write Internal data bus Write data Read data Address T2 T3 Tw Tw T4
Figure 2-22 On-Chip HCAN Module Access Cycle (Wait States Inserted)
Bus cycle T1 φ Address bus AS RD HWR, LWR Data bus Held High High High High-impedance state T2 T3 T4
Figure 2-23 Pin States in On-Chip HCAN Module Access
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2.9.5
Port H and J Register Access Timing
Accesses to port H and J registers and the on-chip motor control PWM timer module are performed in four states. The data bus width is 8 or 16 bits depending on the internal I/O register. Access timing for port H and J registers and the on-chip motor control PWM timer module is shown in figure 2-24, and the pin states are shown in figure 2-25.
Bus cycle T1 φ Internal address bus Read signal Read Internal data bus Write signal Write Internal data bus Write data Read data Address T2 T3 T4
Figure 2-24 Access Cycle for Ports H and J Registers and On-Chip Motor Control PWM Timer Module
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Bus cycle T1 φ Address bus AS RD HWR, LWR Data bus Held High High High T2 T3 T4
High impedance
Figure 2-25 Pin States in Access to Ports H and J Registers and On-Chip Motor Control PWM Timer Module 2.9.6 External Address Space Access Timing
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to section 7, Bus Controller.
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Section 2 CPU
2.10
2.10.1
Usage Note
TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS instruction is not generated by the Renesas Electronics H8S Family and H8/300 Series C/C++ compilers. If the TAS instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or ER5 is used. 2.10.2 STM/LDM Instructions
With STM and LDM instructions, register ER7 cannot be used as a register that can be saved (STM) or restored (LDM) since it is the stack pointer. The number of registers that can be saved (STM) or restored (LDM) by a single instruction is two, three, or four. The registers that can be used in these cases are as follows. Two registers: ER0–ER1, ER2–ER3, ER4–ER5 Three registers: ER0–ER2, ER4–ER6 Four registers: ER0–ER3 The Renesas Electronics H8S Family and H8/300 Series C/C++ compilers do not generate STM/LDM instructions that include ER7. 2.10.3 Caution to Observe when Using Bit Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read data in a unit of byte, then, after bit manipulation, they write data in a unit of byte. Therefore, caution must be exercised when executing any of these instructions for registers and ports that include write-only bits. The BCLR instruction can be used to clear the flag of an internal I/O register to 0. In that case, if it is clearly known that the pertinent flag is set to 1 in an interrupt processing routine or other processing, there is no need to read the flag in advance.
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
3.1.1
Overview
Operating Mode Selection
The chip has four operating modes (modes 4 to 7). These modes enable selection of the CPU operating mode, enabling/disabling of on-chip ROM, and the initial bus width setting, by setting the mode pins (MD2 to MD0). Table 3-1 lists the MCU operating modes. Table 3-1 MCU Operating Mode Selection
External Data Bus On-Chip Initial ROM Width — — Max. Width —
CPU MCU Operating Operating Description MD2 MD1 MD0 Mode Mode 0* 1* 2* 3* 4 5 6 1 1 0 0 0 1 0 1 0 1 0 1 0 Advanced On-chip ROM disabled, expanded mode On-chip ROM enabled, expanded mode Single-chip mode — — —
Disabled 16 bits 8 bits Enabled 8 bits
16 bits 16 bits 16 bits
7
1
—
—
Note: * Not available in the chip.
The CPU’s architecture allows for 4 Gbytes of address space, but the chip actually accesses a maximum of 16 Mbytes. Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral devices. The external expansion modes allow switching between 8-bit and 16-bit bus modes. After program execution starts, an 8-bit or 16-bit address space can be set for each area, depending on the bus controller setting. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-bit access is selected for all areas, 8-bit bus mode is set.
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Note that the functions of each pin depend on the operating mode. The chip can be used only in modes 4 to 7. This means that the mode pins must be set to select one of these modes. Do not change the inputs at the mode pins during operation. 3.1.2 Register Configuration
The chip has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR) that controls the operation of the chip. Table 3-2 summarizes these registers. Table 3-2
Name Mode control register System control register Pin function control register
MCU Registers
Abbreviation MDCR SYSCR PFCR R/W R R/W R/W Initial Value Undetermined H'01 H'0D/H'00 Address* H'FDE7 H'FDE5 H'FDEB
Note: * Lower 16 bits of the address.
3.2
3.2.1
Bit
Register Descriptions
Mode Control Register (MDCR)
: 7 ⎯ 1 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 ⎯ 0 ⎯ 2 MDS2 ⎯* R 1 MDS1 ⎯* R 0 MDS0 ⎯* R
Initial value : R/W :
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit register that indicates the current operating mode of the chip.
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Bit 7—Reserved: Only 1 should be written to these bits. Bits 6 to 3—Reserved: These bits are always read as 0 and cannot be modified. Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to MDS0 are read-only bits, and they cannot be written to. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are cancelled by a reset. 3.2.2
Bit
System Control Register (SYSCR)
: 7 MACS 0 R/W 6 ⎯ 0 ⎯ 5 INTM1 0 R/W 4 INTM0 0 R/W 3 NMIEG 0 R/W 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯ 0 RAME 1 R/W
Initial value : R/W :
SYSCR is an 8-bit readable-writable register that selects saturating or non-saturating calculation for the MAC instruction, selects the interrupt control mode, selects the detected edge for NMI, and enables or disenables on-chip RAM. SYSCR is initialized to H'01 by a reset and in hardware standby mode. SYSCR is not initialized in software standby mode. Bit 7—MAC Saturation (MACS): Selects either saturating or non-saturating calculation for the MAC instruction.
Bit 7 MACS 0 1 Description Non-saturating calculation for MAC instruction Saturating calculation for MAC instruction (Initial value)
Bit 6—Reserved: This bit is always read as 0 and cannot be modified.
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Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select the control mode of the interrupt controller. For details of the interrupt control modes, see section 5.4.1, Interrupt Control Modes and Interrupt Operation.
Bit 5 INTM1 0 1 Bit 4 INTM0 0 1 0 1 Interrupt Control Mode Description 0 — 2 — Control of interrupts by I bit Setting prohibited Control of interrupts by I2 to I0 bits and IPR Setting prohibited (Initial value)
Bit 3—NMI Edge Select (NMIEG): Selects the valid edge of the NMI interrupt input.
Bit 3 NMIEG 0 1 Description An interrupt is requested at the falling edge of NMI input An interrupt is requested at the rising edge of NMI input (Initial value)
Bit 2— Reserved: Only 0 should be written to this bit. Bit 1—Reserved: This bit is always read as 0 and cannot be modified. Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset status is released. It is not initialized in software standby mode.
Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
Note: When the DTC is used, the RAME bit must not be cleared to 0.
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3.2.3
Bit
Pin Function Control Register (PFCR)
: 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 ⎯ 0 R/W 4 ⎯ 0 R/W 3 AE3 1/0 R/W 2 AE2 1/0 R/W 1 AE1 0 R/W 0 AE0 1/0 R/W
Initial value : R/W :
PFCR is an 8-bit readable-writeable register that performs address output control in on-chip ROMenabled expansion mode. PFCR is initialized to H'0D/H'00 by a reset and in the hardware standby mode. Bits 7 to 4— Reserved: Only 0 should be written to these bits. Bits 3 to 0—Address Output Enable 3 to 0 (AE3 to AE0): These bits select enabling or disabling of address outputs A8 to A23 in on-chip ROM-disabled expansion mode and on-chip ROM-enabled expansion mode. When a pin is enabled for address output, the address is output regardless of the corresponding DDR setting. When a pin is disabled for address output, it becomes an output port when the corresponding DDR bit is set to 1.
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Bit 3 AE3 0
Bit 2 AE2 0
Bit 1 AE1 0 1
Bit 0 AE0 0 1 0 1 Description A8 to A23 address output disabled (Initial value*)
A8 address output enabled; A9 to A23 address output disabled A8, A9 address output enabled; A10 to A23 address output disabled A8 to A10 address output enabled; A11 to A23 address output disabled A8 to A11 address output enabled; A12 to A23 address output disabled A8 to A12 address output enabled; A13 to A23 address output disabled A8 to A13 address output enabled; A14 to A23 address output disabled A8 to A14 address output enabled; A15 to A23 address output disabled A8 to A15 address output enabled; A16 to A23 address output disabled A8 to A16 address output enabled; A17 to A23 address output disabled A8 to A17 address output enabled; A18 to A23 address output disabled A8 to A18 address output enabled; A19 to A23 address output disabled A8 to A19 address output enabled; A20 to A23 address output disabled A8 to A20 address output enabled; A21 to A23 address output disabled (Initial value*) A8 to A21 address output enabled; A22, A23 address output disabled A8 to A23 address output enabled
1
0
0 1
1
0 1
1
0
0
0 1
1
0 1
1
0
0 1
1
0 1
Note: * In on-chip ROM-enabled expansion mode, bits AE3 to AE0 are initialized to B'0000. In on-chip ROM-disabled expansion mode, bits AE3 to AE0 are initialized to B'1101. Address pins A0 to A7 are made address outputs by setting the corresponding DDR bits to 1.
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3.3
3.3.1
Operating Mode Descriptions
Mode 4
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled. Ports 1, A, B, and C function as an address bus, ports D and E function as a data bus, and part of port F carries bus control signals. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. However, note that if 8bit access is designated by the bus controller for all areas, the bus mode switches to 8 bits. 3.3.2 Mode 5
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled. Ports 1, A, B, and C function as an address bus, port D function as a data bus, and part of port F carries bus control signals. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if 16bit access is designated by the bus controller for any area, the bus mode switches to 16 bits and port E becomes a data bus. 3.3.3 Mode 6
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled. Ports 1, A, B, and C function as input port pins immediately after a reset. Address output can be performed by setting the corresponding DDR (data direction register) bits to 1. Port D functions as a data bus, and part of port F carries bus control signals. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if 16bit access is designated by the bus controller for any area, the bus mode switches to 16 bits and port E becomes a data bus.
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3.3.4
Mode 7
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled, but external addresses cannot be accessed. All I/O ports are available for use as input-output ports.
3.4
Pin Functions in Each Operating Mode
The pin functions of ports 1 and A to F vary depending on the operating mode. Table 3-3 shows their functions in each operating mode. Table 3-3
Port Port A Port B Port C Port D Port E Port F PF7 PF6 to PF4 PF3 Port 1 P11 to P13 P10 Legend: P: I/O port A: Address bus output D: Data bus I/O C: Control signals, clock I/O *: After reset
Pin Functions in Each Mode
Mode 4 P/A* P/A* A D P/D* P/C* C P/C* P*/A P/A* Mode 5 P/A* P/A* A D P*/D P/C* C P*/C P*/A P/A* Mode 6 P*/A P*/A P*/A D P*/D P/C* C P*/C P*/A P*/A Mode 7 P P P P P P*/C P P
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Section 3 MCU Operating Modes
3.5
Address Map in Each Operating Mode
An address map of the H8S/2636 is shown in figure 3-1. An address map of the H8S/2638 and H8S/2639 is shown in figure 3-2. An address map of the H8S/2630 is shown in figure 3-3. An address map of the H8S/2635 is shown in figure 3-4. An address map of the H8S/2634 is shown in figure 3-5. The address space is 16 Mbytes in modes 4 to 7 (advanced modes). The address space is divided into eight areas for modes 4 to 7. For details, see section 7, Bus Controller.
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Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000
Mode 6 (advanced expanded mode with on-chip ROM enabled)
Mode 7 (advanced single-chip mode)
H'000000
H'000000
External address space
On-chip ROM
On-chip ROM
H'01FFFF H'020000 H'FFAFFF H'FFB000 Reserved area H'FFDFFF H'FFE000 On-chip RAM* H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF H'FFDFFF H'FFE000 H'FFAFFF H'FFB000
H'01FFFF External address space Reserved area H'FFE000 On-chip RAM* On-chip RAM H'FFEFBF H'FFF800 Internal I/O registers H'FFFF3F H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM H'FFFFFF
H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF
Note: * External addresses can be accessed by clearing th RAME bit in SYSCR to 0.
Figure 3-1 Memory Map in Each Operating Mode in the H8S/2636
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Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000
Mode 6 (advanced expanded mode with on-chip ROM enabled)
Mode 7 (advanced single-chip mode)
H'000000
H'000000
External address space
On-chip ROM
On-chip ROM
H'03FFFF H'040000 H'FFAFFF H'FFB000 H'FFAFFF H'FFB000
H'03FFFF External address space H'FFB000
On-chip RAM*
On-chip RAM*
On-chip RAM
H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF
H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF
H'FFEFBF H'FFF800 Internal I/O registers H'FFFF3F H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM H'FFFFFF
Note: * External addresses can be accessed by clearing th RAME bit in SYSCR to 0.
Figure 3-2 Memory Map in Each Operating Mode in the H8S/2638 and H8S/2639
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Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000
Mode 6 (advanced expanded mode with on-chip ROM enabled)
Mode 7 (advanced single-chip mode)
H'000000
H'000000
External address space
On-chip ROM
On-chip ROM
H'05FFFF H'060000 H'FFAFFF H'FFB000 H'FFAFFF H'FFB000
H'05FFFF External address space H'FFB000
On-chip RAM*
On-chip RAM*
On-chip RAM
H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF
H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF
H'FFEFBF H'FFF800 Internal I/O registers H'FFFF3F H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM H'FFFFFF
Note: * External addresses can be accessed by clearing th RAME bit in SYSCR to 0.
Figure 3-3 Memory Map in Each Operating Mode in the H8S/2630
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Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000
Mode 6 (advanced expanded mode with on-chip ROM enabled)
Mode 7 (advanced single-chip mode)
H'000000
H'000000
On-chip ROM
On-chip ROM
External address space H'02FFFF H'030000 Reserved area H'03FFFF H'040000 H'FFAFFF H'FFB000 Reserved area H'FFD7FF H'FFD800 On-chip RAM* H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF H'FFD7FF H'FFD800 On-chip RAM* H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF H'FFFF3F H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM H'FFFFFF H'FFEFBF H'FFF800 Internal I/O registers H'FFAFFF H'FFB000 H'02FFFF
External address space
Reserved area H'FFD800 On-chip RAM
Note: * External addresses can be accessed by clearing th RAME bit in SYSCR to 0.
Figure 3-4 Memory Map in Each Operating Mode in the H8S/2635
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Modes 4 and 5 (advanced expanded modes with on-chip ROM disabled) H'000000
Mode 6 (advanced expanded mode with on-chip ROM enabled)
Mode 7 (advanced single-chip mode)
H'000000
H'000000
On-chip ROM
On-chip ROM
H'01FFFF H'020000 External address space Reserved area
H'01FFFF
H'03FFFF H'040000 H'FFAFFF H'FFB000 Reserved area H'FFD7FF H'FFD800 On-chip RAM* H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF H'FFD7FF H'FFD800 H'FFAFFF H'FFB000
External address space
Reserved area H'FFD800 On-chip RAM* H'FFEFBF H'FFEFC0 H'FFF7FF External address space H'FFF800 Internal I/O registers H'FFFF3F H'FFFF40 H'FFFF5F External address space H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM* H'FFFFFF H'FFFF3F H'FFFF60 H'FFFFBF Internal I/O registers H'FFFFC0 On-chip RAM H'FFFFFF H'FFEFBF H'FFF800 Internal I/O registers On-chip RAM
Note: * External addresses can be accessed by clearing th RAME bit in SYSCR to 0.
Figure 3-5 Memory Map in Each Operating Mode in the H8S/2634
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Section 4 Exception Handling
Section 4 Exception Handling
4.1
4.1.1
Overview
Exception Handling Types and Priority
As table 4-1 indicates, exception handling may be caused by a reset, trace, direct transition*, trap instruction, or interrupt. Exception handling is prioritized as shown in table 4-1. If two or more exceptions occur simultaneously, they are accepted and processed in order of priority. Trap instruction exceptions are accepted at all times, in the program execution state. Exception handling sources, the stack structure, and the operation of the CPU vary depending on the interrupt control mode set by the INTM0 and INTM1 bits of SYSCR. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Table 4-1
Priority High
Exception Types and Priority
Exception Type Reset Start of Exception Handling Starts immediately after a low-to-high transition at the RES pin, or when the watchdog overflows. The CPU enters the reset state when the RES pin is low.
1
Trace*
Starts when execution of the current instruction or exception handling ends, if the trace (T) bit is set to 1
4
Direct transition* Interrupt Low
Starts when a direct transition occurs due to execution of a SLEEP instruction. Starts when execution of the current instruction or exception 2 handling ends, if an interrupt request has been issued*
3
Trap instruction (TRAPA)* Started by execution of a trap instruction (TRAPA)
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception handling is not executed after execution of an RTE instruction. 2. Interrupt detection is not performed on completion of ANDC, ORC, XORC, or LDC instruction execution, or on completion of reset exception handling. 3. Trap instruction exception handling requests are accepted at all times in program execution state. 4. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Supported by the H8S/2635.
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4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows: 1. The program counter (PC), condition code register (CCR), and extended register (EXR) are pushed onto the stack. 2. The interrupt mask bits are updated. The T bit is cleared to 0. 3. A vector address corresponding to the exception source is generated, and program execution starts from that address. For a reset exception, steps 2 and 3 above are carried out. 4.1.3 Exception Vector Table
The exception sources are classified as shown in figure 4-1. Different vector addresses are assigned to different exception sources. Table 4-2 lists the exception sources and their vector addresses.
Reset
Trace Exception sources Interrupts External interrupts: NMI, IRQ5 to IRQ0 Internal interrupts: 49 (+3: Option) interrupt sources in on-chip supporting modules
Trap instruction
Figure 4-1 Exception Sources
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Table 4-2
Exception Vector Table
Vector Address*
1
Exception Source Reset Reserved for system use
Vector Number 0 1 2 3 4
Advanced Mode H'0000 to H'0003 H'0004 to H'0007 H'0008 to H'000B H'000C to H'000F H'0010 to H'0013 H'0014 to H'0017 H'0018 to H'001B H'001C to H'001F H'0020 to H'0023 H'0024 to H'0027 H'0028 to H'002B H'002C to H'002F H'0030 to H'0033 H'0034 to H'0037 H'0038 to H'003B H'003C to H'003F H'0040 to H'0043 H'0044 to H'0047 H'0048 to H'004B H'004C to H'004F H'0050 to H'0053 H'0054 to H'0057 H'0058 to H'005B H'005C to H'005F H'0060 to H'0063 ⎜ H'01FC to H'01FF
Trace Direct Transition* External interrupt
3
5 6 NMI 7 8 9 10 11
Trap instruction (4 sources)
Reserved for system use
12 13 14 15
External interrupt
IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5
16 17 18 19 20 21 22 23 24 ⎜ 127
Reserved for system use
2 Internal interrupt*
Notes: 1. Lower 16 bits of the address. 2. For details of internal interrupt vectors, see section 5.3.3, Interrupt Exception Handling Vector Table. 3. See section 23B.11, Direct Transition for details on direct transition. Subclock functions are available in the U-mask and W-mask versions, and H8S/2635 Group only.
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4.2
4.2.1
Reset
Overview
A reset has the highest exception priority. When the RES pin goes low, all current operations are stopped, and this LSI enters reset state. A reset initializes the internal state of the CPU and the registers of on-chip supporting modules. Immediately after a reset, interrupt control mode 0 is set. When the RES pin goes from low to high, reset exception handling starts. The H8S/2636 can also be reset by overflow of the watchdog timer. For details see section 12, Watchdog Timer. 4.2.2 Reset Sequence
This LSI enters reset state when the RES pin goes low. To ensure that this LSI is reset, hold the RES pin low for at least 20 ms at power-up. To reset during operation, hold the RES pin low for at least 20 states. When the RES pin goes high after being held low for the necessary time, this LSI starts reset exception handling as follows. 1. The internal state of the CPU and the registers of the on-chip supporting modules are initialized, the T bit is cleared to 0 in EXR, and the I bit is set to 1 in EXR and CCR. 2. The reset exception handling vector address is read and transferred to the PC, and program execution starts from the address indicated by the PC. Figures 4-2 and 4-3 show examples of the reset sequence.
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Vector fetch
Prefetch of first program instruction
φ
RES
Internal address bus
(1)
(3)
(5)
Internal read signal Internal write signal Internal data bus (2) High
(4)
(6)
(1) (3) Reset exception handling vector address (when power-on reset, (1) = H'000000, (3) = H'000002) (2) (4) Start address (contents of reset exception handling vector address) (5) Start address ((5) = (2) (4)) (6) First program instruction
Figure 4-2 Reset Sequence (Modes 6 and 7)
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Vector fetch
Internal processing
Prefetch of first program instruction
* φ
*
*
RES
Address bus
(1)
(3)
(5)
RD
HWR, LWR
High
D15 to D0
(2)
(4)
(6)
(1) (3) Reset exception handling vector address (when reset, (1) = H'000000, (3) = H'000002) (2) (4) Start address (contents of reset exception handling vector address) (5) Start address ((5) = (2) (4)) (6) First program instruction Note: * 3 program wait states are inserted.
Figure 4-3 Reset Sequence (Mode 4) 4.2.3 Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset. Since the first instruction of a program is always executed immediately after the reset state ends, make sure that this instruction initializes the stack pointer (example: MOV.L #xx: 32, SP).
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4.2.4
State of On-Chip Supporting Modules after Reset Release
After reset release, MSTPCRA to MSTPCRD are initialized to H'3F, H'FF, H'FF, and B'11*******1, respectively, and all modules except the DTC, enter module stop mode. Consequently, on-chip supporting module registers cannot be read or written to. Register reading and writing is enabled when module stop mode is exited. Note: 1. The value of bits 5 to 0 is undefined.
4.3
Traces
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control mode 0, irrespective of the state of the T bit. For details of interrupt control modes, see section 5, Interrupt Controller. If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on completion of each instruction. Trace mode is canceled by clearing the T bit in EXR to 0. It is not affected by interrupt masking. Table 4-3 shows the state of CCR and EXR after execution of trace exception handling. Interrupts are accepted even within the trace exception handling routine. The T bit saved on the stack retains its value of 1, and when control is returned from the trace exception handling routine by the RTE instruction, trace mode resumes. Trace exception handling is not carried out after execution of the RTE instruction. Table 4-3 Status of CCR and EXR after Trace Exception Handling
CCR I 1 UI — I2 to I0 — EXR T 0
Interrupt Control Mode 0 2 Legend: 1: Set to 1 0: Cleared to 0 —: Retains value prior to execution.
Trace exception handling cannot be used.
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4.4
Interrupts
Interrupt exception handling can be requested by seven external sources (NMI, IRQ5 to IRQ0) and 49 internal sources in the on-chip supporting modules. Figure 4-4 classifies the interrupt sources and the number of interrupts of each type. The on-chip supporting modules that can request interrupts include the watchdog timer (WDT), 16-bit timer-pulse unit (TPU), serial communication interface (SCI), data transfer controller (DTC), PC break controller (PBC), A/D converter, controller area network (HCAN), motor control PWM timer, and I2C bus interface (IIC). Each interrupt source has a separate vector address. NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The interrupt controller has two interrupt control modes and can assign interrupts other than NMI to eight priority/mask levels to enable multiplexed interrupt control. For details of interrupts, see section 5, Interrupt Controller. Notes: The DTC, PBC, and IIC are not implemented in the H8S/2635 Group.
External interrupts NMI (1) IRQ5 to IRQ0 (6) WDT*1 (2) TPU (26) SCI (12) DTC (1) PBC (1) A/D converter (1) Motor control PWM (2) HCAN (4)*3 IIC*2 (3) [Option]
Interrupts
Internal interrupts
Notes: Numbers in parentheses are the numbers of interrupt sources. 1. When the watchdog timer is used as an interval timer, it generates an interrupt request at each counter overflow. 2. I2C bus interface is available as an option in the H8S/2638, H8S/2639, and H8S/2630. 3. 2 sources in the H8S/2635 Group.
Figure 4-4 Interrupt Sources and Number of Interrupts
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4.5
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction exception handling can be executed at all times in the program execution state. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, as specified in the instruction code. Table 4-4 shows the status of CCR and EXR after execution of trap instruction exception handling. Table 4-4 Status of CCR and EXR after Trap Instruction Exception Handling
CCR I 1 1 UI — — I2 to I0 — — EXR T — 0
Interrupt Control Mode 0 2 Legend: 1: Set to 1 0: Cleared to 0 —: Retains value prior to execution.
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4.6
Stack Status after Exception Handling
Figure 4-5 shows the stack after completion of trap instruction exception handling and interrupt exception handling.
SP SP CCR CCR* PC (16 bits)
EXR Reserved* CCR CCR* PC (16 bits)
(a) Interrupt control mode 0 Note: * Ignored on return.
(b) Interrupt control mode 2
Figure 4-5 (1) Stack Status after Exception Handling (Normal Modes: Not Available in the Chip)
SP SP CCR PC (24 bits)
EXR Reserved* CCR PC (24 bits)
(a) Interrupt control mode 0 Note: * Ignored on return.
(b) Interrupt control mode 2
Figure 4-5 (2) Stack Status after Exception Handling (Advanced Modes)
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4.7
Notes on Use of the Stack
When accessing word data or longword data, the chip assumes that the lowest address bit is 0. The stack should always be accessed by word transfer instruction or longword transfer instruction, and the value of the stack pointer (SP, ER7) should always be kept even. Use the following instructions to save registers:
PUSH.W PUSH.L Rn ERn (or MOV.W Rn, @-SP) (or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W POP.L Rn ERn (or MOV.W @SP+, Rn) (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4-6 shows an example of what happens when the SP value is odd.
CCR SP PC
SP
R1L PC
SP
H'FFFEFA H'FFFEFB H'FFFEFC H'FFFEFD H'FFFEFE H'FFFEFF
TRAPA instruction executed
MOV.B R1L, @−ER7
SP set to H'FFFEFF
Data saved above SP
Contents of CCR lost
Legend: CCR: Condition code register PC: Program counter R1L: General register R1L SP: Stack pointer Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode.
Figure 4-6 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
5.1.1
Overview
Features
The chip controls interrupts by means of an interrupt controller. The interrupt controller has the following features: • Two interrupt control modes ⎯ Any of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in the system control register (SYSCR). • Priorities settable with IPR ⎯ An interrupt priority register (IPR) is provided for setting interrupt priorities. Eight priority levels can be set for each module for all interrupts except NMI. ⎯ NMI is assigned the highest priority level of 8, and can be accepted at all times. • Independent vector addresses ⎯ All interrupt sources are assigned independent vector addresses, making it unnecessary for the source to be identified in the interrupt handling routine. • Seven external interrupts ⎯ NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling edge can be selected for NMI. ⎯ Falling edge, rising edge, or both edge detection, or level sensing, can be selected for IRQ5 to IRQ0. • DTC control* ⎯ DTC activation is performed by means of interrupts. Note: * The H8S/2635 Group is not equipped with a DTC.
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5.1.2
Block Diagram
A block diagram of the interrupt controller is shown in figure 5-1.
INTM1, INTM0 SYSCR NMIEG NMI input IRQ input NMI input unit IRQ input unit ISR ISCR IER Priority determination I I2 to I0 Interrupt request Vector number CPU
Internal interrupt request SWDTEND to RM0 IPR Interrupt controller
CCR EXR
Legend: ISCR: IER: ISR: IPR: SYSCR:
IRQ sense control register IRQ enable register IRQ status register Interrupt priority register System control register
Figure 5-1 Block Diagram of Interrupt Controller
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5.1.3
Pin Configuration
Table 5-1 summarizes the pins of the interrupt controller. Table 5-1
Name Nonmaskable interrupt External interrupt requests 5 to 0
Interrupt Controller Pins
Symbol NMI I/O Input Function Nonmaskable external interrupt; rising or falling edge can be selected Maskable external interrupts; rising, falling, or both edges, or level sensing, can be selected
IRQ5 to IRQ0 Input
5.1.4
Register Configuration
Table 5-2 summarizes the registers of the interrupt controller. Table 5-2
Name System control register IRQ sense control register H IRQ sense control register L IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B Interrupt priority register C Interrupt priority register D Interrupt priority register E Interrupt priority register F Interrupt priority register G Interrupt priority register H Interrupt priority register J Interrupt priority register K Interrupt priority register L Interrupt priority register M
Interrupt Controller Registers
Abbreviation SYSCR ISCRH ISCRL IER ISR IPRA IPRB IPRC IPRD IPRE IPRF IPRG IPRH IPRJ IPRK IPRL IPRM R/W R/W R/W R/W R/W
2 R/(W)*
Initial Value H'01 H'00 H'00 H'00 H'00 H'77 H'77 H'77 H'77 H'77 H'77 H'77 H'77 H'77 H'77 H'77 H'77
Address* H'FDE5 H'FE12 H'FE13 H'FE14 H'FE15 H'FEC0 H'FEC1 H'FEC2 H'FEC3 H'FEC4 H'FEC5 H'FEC6 H'FEC7 H'FEC9 H'FECA H'FECB H'FECC
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Notes: 1. Lower 16 bits of the address. 2. Can only be written with 0 for flag clearing.
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5.2
Register Descriptions
Note: The H8S/2635 Group is not equipped with a DTC, a PC brake controller, or an HCAN1. 5.2.1
Bit
System Control Register (SYSCR)
: 7 MACS 0 R/W 6 ⎯ 0 ⎯ 5 INTM1 0 R/W 4 INTM0 0 R/W 3 NMIEG 0 R/W 2 ⎯ 0 R/W 1 ⎯ 0 ⎯ 0 RAME 1 R/W
Initial value : R/W :
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, and the detected edge for NMI. Only bits 5 to 3 are described here; for details of the other bits, see section 3.2.2, System Control Register (SYSCR). SYSCR is initialized to H'01 by a reset and in hardware standby mode. SYSCR is not initialized in software standby mode. Bits 5 and 4—Interrupt Control Mode 1 and 0 (INTM1, INTM0): These bits select one of two interrupt control modes for the interrupt controller.
Bit 5 INTM1 0 1 Bit 4 INTM0 0 1 0 1 Interrupt Control Mode 0 — 2 —
Description Interrupts are controlled by I bit Setting prohibited Interrupts are controlled by bits I2 to I0, and IPR Setting prohibited (Initial value)
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
Bit 3 NMIEG 0 1 Description Interrupt request generated at falling edge of NMI input Interrupt request generated at rising edge of NMI input (Initial value)
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5.2.2
Bit
Interrupt Priority Registers A to H, J to M (IPRA to IPRH, IPRJ to IPRM)
: 7 ⎯ 0 ⎯ 6 IPR6 1 R/W 5 IPR5 1 R/W 4 IPR4 1 R/W 3 ⎯ 0 ⎯ 2 IPR2 1 R/W 1 IPR1 1 R/W 0 IPR0 1 R/W
Initial value : R/W :
The IPR registers are twelve 8-bit readable/writable registers that set priorities (levels 7 to 0) for interrupts other than NMI. The correspondence between IPR settings and interrupt sources is shown in table 5-3. The IPR registers set a priority (level 7 to 0) for each interrupt source other than NMI. The IPR registers are initialized to H'77 by a reset and in hardware standby mode. Bits 7 and 3—Reserved: These bits are always read as 0 and cannot be modified. Table 5-3 Correspondence between Interrupt Sources and IPR Settings
Bits Register IPRA IPRB IPRC IPRD IPRE IPRF IPRG IPRH IPRJ IPRK IPRL IPRM 6 to 4 IRQ0 IRQ2 IRQ3 —*
1
2 to 0 IRQ1 IRQ4 IRQ5 3 DTC* —*
1
Watchdog timer 0 3 PC break* TPU channel 0 TPU channel 2 TPU channel 4 1 —* SCI channel 1 1 —* PWM channel 1, 2 3 HCAN channel 1*
A/D converter, watchdog timer 1 TPU channel 1 TPU channel 3 TPU channel 5 SCI channel 0 SCI channel 2 2 IIC (Option)* HCAN channel 0
Notes: 1. Reserved. These bits are always read as 1 and cannot be modified. 2 2. I C bus interface is available as an option in the H8S/2638, H8S/2639, and H8S/2630. The IIC bit becomes reserved bit when this optional feature is not used. 3. The PC break, DTC, and HCAN channel 1 are reserved in the H8S/2635 Group.
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As shown in table 5-3, multiple interrupts are assigned to one IPR. Setting a value in the range from H'0 to H'7 in the 3-bit groups of bits 6 to 4 and 2 to 0 sets the priority of the corresponding interrupt. The lowest priority level, level 0, is assigned by setting H'0, and the highest priority level, level 7, by setting H'7. When interrupt requests are generated, the highest-priority interrupt according to the priority levels set in the IPR registers is selected. This interrupt level is then compared with the interrupt mask level set by the interrupt mask bits (I2 to I0) in the extend register (EXR) in the CPU, and if the priority level of the interrupt is higher than the set mask level, an interrupt request is issued to the CPU. 5.2.3
Bit
IRQ Enable Register (IER)
: 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W 2 IRQ2E 0 R/W 1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
Initial value : R/W :
IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests IRQ5 to IRQ0. IER is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6—Reserved: These bits are always read as 0, and should only be written with 0. Bits 5 to 0—IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits select whether IRQ5 to IRQ0 are enabled or disabled.
Bit n IRQnE 0 1 Description IRQn interrupts disabled IRQn interrupts enabled (n = 5 to 0) (Initial value)
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5.2.4
ISCRH
Bit
IRQ Sense Control Registers H and L (ISCRH, ISCRL)
:
15 ⎯ 0 R/W
14 ⎯ 0 R/W
13 ⎯ 0 R/W
12 ⎯ 0 R/W
11 0 R/W
10 0 R/W
9 0 R/W
8 0 R/W
IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
Initial value : R/W :
ISCRL
Bit : 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA Initial value : R/W :
The ISCR registers are 16-bit readable/writable registers that select rising edge, falling edge, or both edge detection, or level sensing, for the input at pins IRQ5 to IRQ0. The ISCR registers are initialized to H'0000 by a reset and in hardware standby mode. Bits 15 to 12—Reserved: These bits are always read as 0, and should only be written with 0. Bits 11 to 0—IRQ5 Sense Control A and B (IRQ5SCA, IRQ5SCB) to IRQ0 Sense Control A and B (IRQ0SCA, IRQ0SCB)
Bits 11 to 0 IRQ5SCB to IRQ0SCB 0 IRQ5SCA to IRQ0SCA 0 1 1 0 1 Description Interrupt request generated at IRQ5 to IRQ0 input low level (initial value) Interrupt request generated at falling edge of IRQ5 to IRQ0 input Interrupt request generated at rising edge of IRQ5 to IRQ0 input Interrupt request generated at both falling and rising edges of IRQ5 to IRQ0 input
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5.2.5
Bit
IRQ Status Register (ISR)
: 7 ⎯ 0 R/(W)* 6 ⎯ 0 R/(W)* 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)* 1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
Initial value : R/W :
Note: * Only 0 can be written, to clear the flag.
ISR is an 8-bit readable/writable register that indicates the status of IRQ5 to IRQ0 interrupt requests. ISR is initialized to H'00 by a reset and in hardware standby mode. They are not initialized in software standby mode. Bits 7 and 6—Reserved: These bits are always read as 0. Bits 5 to 0—IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to IRQ0 interrupt requests.
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Bit n IRQnF 0 Description [Clearing conditions] • • • • 1 (Initial value)
Cleared by reading IRQnF flag when IRQnF = 1, then writing 0 to IRQnF flag When interrupt exception handling is executed when low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high When IRQn interrupt exception handling is executed when falling, rising, or bothedge detection is set (IRQnSCB = 1 or IRQnSCA = 1) When the DTC is activated by an IRQn interrupt, and the DISEL bit in MRB of the DTC is cleared to 0 When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA = 0) When a falling edge occurs in IRQn input when falling edge detection is set (IRQnSCB = 0, IRQnSCA = 1) When a rising edge occurs in IRQn input when rising edge detection is set (IRQnSCB = 1, IRQnSCA = 0) When a falling or rising edge occurs in IRQn input when both-edge detection is set (IRQnSCB = IRQnSCA = 1) (n = 5 to 0)
[Setting conditions] • • • •
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5.3
Interrupt Sources
Interrupt sources comprise external interrupts (NMI and IRQ5 to IRQ0) and internal interrupts (49 sources). Note: The H8S/2635 Group is not equipped with a DTC, a PC brake controller, or an HCAN1. The H8S/2635 Group has 45 sources of internal interrupt. 5.3.1 External Interrupts
There are seven external interrupts: NMI and IRQ5 to IRQ0. Of these, NMI and IRQ5 to IRQ0 can be used to restore the chip from software standby mode. NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the interrupt control mode or the status of the CPU interrupt mask bits. The NMIEG bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a falling edge on the NMI pin. The vector number for NMI interrupt exception handling is 7. IRQ5 to IRQ0 Interrupts: Interrupts IRQ5 to IRQ0 are requested by an input signal at pins IRQ5 to IRQ0. Interrupts IRQ5 to IRQ0 have the following features: • Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling edge, rising edge, or both edges, at pins IRQ5 to IRQ0. • Enabling or disabling of interrupt requests IRQ5 to IRQ0 can be selected with IER. • The interrupt priority level can be set with IPR. • The status of interrupt requests IRQ5 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0 by software.
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Section 5 Interrupt Controller
A block diagram of interrupts IRQ5 to IRQ0 is shown in figure 5-2.
IRQnE IRQnSCA, IRQnSCB IRQnF Edge/level detection circuit IRQn input Clear signal Note: n = 5 to 0 S R Q IRQn interrupt request
Figure 5-2 Block Diagram of Interrupts IRQ5 to IRQ0 Figure 5-3 shows the timing of setting IRQnF.
φ
IRQn input pin
IRQnF
Figure 5-3 Timing of Setting IRQnF The vector numbers for IRQ5 to IRQ0 interrupt exception handling are 21 to 16. Detection of IRQ5 to IRQ0 interrupts does not depend on whether the relevant pin has been set for input or output. However, when a pin is used as an external interrupt input pin, do not clear the corresponding DDR to 0 and use the pin as an I/O pin for another function.
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5.3.2
Internal Interrupts
There are 49 sources for internal interrupts from on-chip supporting modules. • For each on-chip supporting module there are flags that indicate the interrupt request status, and enable bits that select enabling or disabling of these interrupts. If both of these are set to 1 for a particular interrupt source, an interrupt request is issued to the interrupt controller. • The interrupt priority level can be set by means of IPR. • The DTC can be activated by a TPU, SCI, or other interrupt request. When the DTC is activated by an interrupt, the interrupt control mode and interrupt mask bits are not affected. 5.3.3 Interrupt Exception Handling Vector Table
Table 5-4 shows interrupt exception handling sources, vector addresses, and interrupt priorities. For default priorities, the lower the vector number, the higher the priority. Priorities among modules can be set by means of the IPR. The situation when two or more modules are set to the same priority, and priorities within a module, are fixed as shown in table 5-4.
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Table 5-4
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Vector 1 Address* Vector Number 7 16 17 18 19 20 21 — DTC*
3
Interrupt Source NMI IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 Reserved for system use SWDTEND (software activation interrupt end) WOVI0 (interval timer) Reserved for system use PC break ADI (A/D conversion end) WOVI1 (interval timer) Reserved for system use TGI0A (TGR0A input capture/compare match) TGI0B (TGR0B input capture/compare match) TGI0C (TGR0C input capture/compare match) TGI0D (TGR0D input capture/compare match) TCI0V (overflow 0) Reserved for system use
Origin of Interrupt Source External pin
Advanced Mode H'001C H'0040 H'0044 H'0048 H'004C H'0050 H'0054 H'0058 H'005C H'0060 H'0064 H'0068 H'006C H'0070 H'0074 H'0078 H'007C H'0080 H'0084 H'0088 H'008C H'0090 H'0094 to H'009C
IPR
Priority High
IPRA6 to 4 IPRA2 to 0 IPRB6 to 4 IPRB2 to 0 — IPRC2 to 0 IPRD6 to 4 — IPRE6 to 4 IPRE2 to 0
22 23 24 25 26
Watchdog timer 0 —
PC break 27 3 controller* A/D Watchdog timer 1 — TPU channel 0 28 29 30 31 32 33 34 35 36 — 37 to 39
— IPRF6 to 4
— Low
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Interrupt Source TGI1A (TGR1A input capture/compare match) TGI1B (TGR1B input capture/compare match) TCI1V (overflow 1) TCI1U (underflow 1) TGI2A (TGR2A input capture/compare match) TGI2B (TGR2B input capture/compare match) TCI2V (overflow 2) TCI2U (underflow 2) TGI3A (TGR3A input capture/compare match) TGI3B (TGR3B input capture/compare match) TGI3C (TGR3C input capture/compare match) TGI3D (TGR3D input capture/compare match) TCI3V (overflow 3) Reserved for system use
Origin of Interrupt Source TPU channel 1
Vector 1 Address* Vector Number 40 41 42 43 Advanced Mode H'00A0 H'00A4 H'00A8 H'00AC H'00B0 H'00B4 H'00B8 H'00BC H'00C0 H'00C4 H'00C8 H'00CC H'00D0 H'00D4 to H'00DC H'00E0 H'00E4 H'00E8 H'00EC Low — IPRG2 to 0 IPRG6 to 4 IPR IPRF2 to 0 Priority High
TPU channel 2
44 45 46 47
TPU channel 3
48 49 50 51 52
—
53 to 55 56 57 58 59
TGI4A (TGR4A input capture/compare match) TGI4B (TGR4B input capture/compare match) TCI4V (overflow 4) TCI4U (underflow 4)
TPU channel 4
IPRH6 to 4
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Interrupt Source TGI5A (TGR5A input capture/compare match) TGI5B (TGR5B input capture/compare match) TCI5V (overflow 5) TCI5U (underflow 5) Reserved for system use
Origin of Interrupt Source TPU channel 5
Vector 1 Address* Vector Number 60 61 62 63 Advanced Mode H'00F0 H'00F4 H'00F8 H'00FC H'0100 to H'013C H'0140 H'0144 H'0148 H'014C H'0150 H'0154 H'0158 H'015C H'0160 H'0164 H'0168 H'016C H'0170 to H'018C H'0190 H'0194 H'0198 H'019C Low — IPRK2 to 0 IPRK6 to 4 — IPR IPRH2 to 0 Priority High
—
64 to 79 80 81 82 83
ERI0 (receive error 0) RXI0 (reception completed 0) TXI0 (transmit data empty 0) TEI0 (transmission end 0) ERI1 (receive error 1) RXI1 (reception completed 1) TXI1 (transmit data empty 1) TEI1 (transmission end 1) ERI2 (receive error 2) RXI2 (reception completed 2) TXI2 (transmit data empty 2) TEI2 (transmission end 2) Reserved for system use
SCI channel 0
IPRJ2 to 0
SCI channel 1
84 85 86 87
SCI channel 2
88 89 90 91
—
92 to 99 100 101 102 103
I CI0 (1-byte transmission/ reception completed) DDCSW1 (format switch) I CI1 Reserved for system use
2
2
IC channel 0 2 (option)* IC channel 1 2 (option)*
2
2
IPRL2 to 0
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Interrupt Source PWM1 PWM2 ERS0, OVR0, RM1, SLE0, RM0 ERS0, OVR0, RM1, SLE0, RM0 Reserved for system use
Origin of Interrupt Source PWM channel 1 PWM channel 2 3 HCAN1* HCAN0 —
Vector 1 Address* Vector Number 104 105 106 107 108 109 110 111 Advanced Mode H'01A0 H'01A4 H'01A8 H'01AC H'01B0 H'01B4 H'01B8 H'01BC Low IPRM2 to 0 IPR IPRM6 to 4 Priority High
Notes: 1. Lower 16 bits of the start address. 2 2. I C is available as an option in the H8S/2638, H8S/2639, and H8S/2630 only. The 2 product equipped with the I C bus interface is the W-mask version. 3. The DTC, PC break, and HCAN1 interrupts are reserved in the H8S/2635 Group.
5.4
5.4.1
Interrupt Operation
Interrupt Control Modes and Interrupt Operation
Interrupt operations in the chip differ depending on the interrupt control mode. NMI interrupts are accepted at all times except in the reset state and the hardware standby state. In the case of IRQ interrupts and on-chip supporting module interrupts, an enable bit is provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt controller. Table 5-5 shows the interrupt control modes. The interrupt controller performs interrupt control according to the interrupt control mode set by the INTM1 and INTM0 bits in SYSCR, the priorities set in IPR, and the masking state indicated by the I bit in the CPU’s CCR, and bits I2 to I0 in EXR.
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Table 5-5
Interrupt Control Modes
Interrupt Mask Bits Description I — I2 to I0 Interrupt mask control is performed by the I bit. Setting prohibited 8-level interrupt mask control is performed by bits I2 to I0. 8 priority levels can be set with IPR. Setting prohibited
SYSCR Interrupt Priority Setting Control Mode INTM1 INTM0 Registers 0 — 2 1 0 0 1 0 — — IPR
—
1
—
—
Figure 5-4 shows a block diagram of the priority decision circuit.
Interrupt control mode 0
I
Interrupt acceptance control Interrupt source Default priority determination 8-level mask control Vector number
IPR
I2 to I0
Interrupt control mode 2
Figure 5-4 Block Diagram of Interrupt Control Operation
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(1) Interrupt Acceptance Control In interrupt control mode 0, interrupt acceptance is controlled by the I bit in CCR. Table 5-6 shows the interrupts selected in each interrupt control mode. Table 5-6 Interrupts Selected in Each Interrupt Control Mode (1)
Interrupt Mask Bits Interrupt Control Mode 0 2 Legend: *: Don't care I 0 1 * Selected Interrupts All interrupts NMI interrupts All interrupts
(2) 8-Level Control In interrupt control mode 2, 8-level mask level determination is performed for the selected interrupts in interrupt acceptance control according to the interrupt priority level (IPR). The interrupt source selected is the interrupt with the highest priority level, and whose priority level set in IPR is higher than the mask level. Table 5-7 Interrupts Selected in Each Interrupt Control Mode (2)
Selected Interrupts All interrupts Highest-priority-level (IPR) interrupt whose priority level is greater than the mask level (IPR > I2 to I0).
Interrupt Control Mode 0 2
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(3) Default Priority Determination When an interrupt is selected by 8-level control, its priority is determined and a vector number is generated. If the same value is set for IPR, acceptance of multiple interrupts is enabled, and so only the interrupt source with the highest priority according to the preset default priorities is selected and has a vector number generated. Interrupt sources with a lower priority than the accepted interrupt source are held pending. Table 5-8 shows operations and control signal functions in each interrupt control mode. Table 5-8
Interrupt Control Mode
Operations and Control Signal Functions in Each Interrupt Control Mode
Setting INTM1 INTM0 Interrupt Acceptance Control I 8-Level Control I2 to I0 IPR Default Priority Determination
2
T (Trace)
0 2
0 1
0 0 X
IM 1 —*
X
— IM
—*
— T
PR
Legend: : Interrupt operation control performed X: No operation (All interrupts enabled). IM: Used as interrupt mask bit PR: Sets priority. —: Not used. Notes: 1. Set to 1 when interrupt is accepted. 2. Keep the initial setting.
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5.4.2
Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by means of the I bit in the CPU’s CCR. Interrupts are enabled when the I bit is cleared to 0, and disabled when set to 1. Figure 5-5 shows a flowchart of the interrupt acceptance operation in this case. [1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. [2] The I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held pending. [3] Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to the priority system is accepted, and other interrupt requests are held pending. [4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. [5] The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. [6] Next, the I bit in CCR is set to 1. This masks all interrupts except NMI. [7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address.
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Program execution status
Interrupt generated? Yes Yes
No
NMI No No
I=0 Yes
Hold pending
No IRQ0 Yes No
IRQ1 Yes
HCAN Yes
Save PC and CCR I←1 Read vector address
Branch to interrupt handling routine
Figure 5-5 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 0
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5.4.3
Interrupt Control Mode 2
Eight-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts by comparing the interrupt mask level set by bits I2 to I0 of EXR in the CPU with IPR. Figure 5-6 shows a flowchart of the interrupt acceptance operation in this case. [1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. [2] When interrupt requests are sent to the interrupt controller, the interrupt with the highest priority according to the interrupt priority levels set in IPR is selected, and lower-priority interrupt requests are held pending. If a number of interrupt requests with the same priority are generated at the same time, the interrupt request with the highest priority according to the priority system shown in table 5-4 is selected. [3] Next, the priority of the selected interrupt request is compared with the interrupt mask level set in EXR. An interrupt request with a priority no higher than the mask level set at that time is held pending, and only an interrupt request with a priority higher than the interrupt mask level is accepted. [4] When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. [5] The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC saved on the stack shows the address of the first instruction to be executed after returning from the interrupt handling routine. [6] The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of the accepted interrupt. If the accepted interrupt is NMI, the interrupt mask level is set to H'7. [7] A vector address is generated for the accepted interrupt, and execution of the interrupt handling routine starts at the address indicated by the contents of that vector address.
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Program execution status
Interrupt generated? Yes Yes NMI No No
No
Level 7 interrupt? Yes Mask level 6 or below? Yes
Level 6 interrupt? No Yes Mask level 5 or below? Yes
No
Level 1 interrupt? No Yes
No
Mask level 0? Yes
No
Save PC, CCR, and EXR
Hold pending
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Figure 5-6 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control Mode 2
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Interrupt acceptance Interrupt level determination Wait for end of instruction Instruction prefetch Stack Vector fetch Internal operation Internal operation Interrupt service routine instruction prefetch φ Interrupt request signal Internal address bus (1)
(7) (9)
Section 5 Interrupt Controller
(3) (5)
(11)
(13)
Interrupt Exception Handling Sequence
Internal read signal Internal write signal Internal data us (2)
(8)
(4)
(6)
(10)
(12)
(14)
Figure 5-7 shows the interrupt exception handling sequence. The example shown is for the case where interrupt control mode 0 is set in advanced mode, and the program area and stack area are in on-chip memory.
Figure 5-7 Interrupt Exception Handling
(1) Instruction prefetch address (Not executed. This is the contents of the saved PC, the return address) (2) (4) Instruction code (Not executed) (3) Instruction prefetch address (Not executed) (5) SP-2 (7) SP-4
(6) (8) Saved PC and saved CCR (9) (11) Vector address (10) (12) Interrupt handling routine start address (vector address contents) (13) Interrupt handling routine start address ((13) = (10) (12)) (14) First instruction of interrupt handling routine
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Section 5 Interrupt Controller
5.4.5
Interrupt Response Times
The chip is capable of fast word transfer instruction to on-chip memory, and the program area is provided in on-chip ROM and the stack area in on-chip RAM, enabling high-speed processing. Table 5-9 shows interrupt response times - the interval between generation of an interrupt request and execution of the first instruction in the interrupt handling routine. The execution status symbols used in table 5-9 are explained in table 5-10. Table 5-9 Interrupt Response Times
Normal Mode* No. 1 2 3 4 5 6 Execution Status Interrupt priority determination *1 INTM1 = 0 3
5
Advanced Mode INTM1 = 0 3 INTM1 = 1 3
INTM1 = 1 3
Number of wait states until executing 1 to 1 to 2 instruction ends* (19 + 2 · SI) (19 + 2 · SI) PC, CCR, EXR stack save Vector fetch Instruction fetch *3
4 Internal processing*
1 to 1 to (19 + 2 · SI) (19 + 2 · SI) 2 · SK 2·SI 2 · SI 2 12 to 32 3 · SK 2·SI 2 · SI 2 13 to 33
2 · SK SI 2 · SI 2 11 to 31
3 · SK SI 2 · SI 2 12 to 32
Total (using on-chip memory) Notes: 1. 2. 3. 4. 5.
Two states in case of internal interrupt. Refers to MULXS and DIVXS instructions. Prefetch after interrupt acceptance and interrupt handling routine prefetch. Internal processing after interrupt acceptance and internal processing after vector fetch. Not implemented in the chip.
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Table 5-10 Number of States in Interrupt Handling Routine Execution Statuses
Object of Access External Device 8 Bit Bus Symbol Instruction fetch Branch address read Stack manipulation SI SJ SK Internal Memory 1 2-State Access 4 3-State Access 6 + 2m 16 Bit Bus 2-State Access 2 3-State Access 3+m
Legend: m: Number of wait states in an external device access.
5.5
5.5.1
Usage Notes
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective after execution of the instruction. In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an interrupt is generated during execution of the instruction, the interrupt concerned will still be enabled on completion of the instruction, and so interrupt exception handling for that interrupt will be executed on completion of the instruction. However, if there is an interrupt request of higher priority than that interrupt, interrupt exception handling will be executed for the higher-priority interrupt, and the lower-priority interrupt will be ignored. The same also applies when an interrupt source flag is cleared to 0. Figure 5-8 shows an example in which the TCIEV bit in the TPU’s TIER register is cleared to 0.
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Section 5 Interrupt Controller
TIER write cycle by CPU
TCFV exception handling
φ
Internal address bus
TIER address
Internal write signal
TCIEV
TCFV
TCFV interrupt signal
Figure 5-8 Contention between Interrupt Generation and Disabling The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while the interrupt is masked. 5.5.2 Instructions that Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these instructions is executed, all interrupts including NMI are disabled and the next instruction is always executed. When the I bit is set by one of these instructions, the new value becomes valid two states after execution of the instruction ends. 5.5.3 Times when Interrupts Are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller. The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has updated the mask level with an LDC, ANDC, ORC, or XORC instruction.
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5.5.4
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction. With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer is not accepted until the move is completed. With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this case is the address of the next instruction. Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the following coding should be used.
L1: EEPMOV.W MOV.W BNE R4,R4 L1
5.5.5
IRQ Interrupts
When operating by clock input, acceptance of input to an IRQ pin is synchronized with the clock. In software standby mode, the input is accepted asynchronously. For details on the input conditions, see section 24.5.2, Control Signal Timing. 5.5.6 Notes on Use of NMI Interrupt
When the system is operating normally under conditions conforming to the specified electrical properties, exception processing by the on-chip interrupt controller linked to the CPU is used to execute the NMI interrupt. When operation is not normal (runaway status) due to a software problem or abnormal input to one of the LSI’s pins, no operations can be guaranteed, including the NMI interrupt. In such cases it is possible to cause the LSI to return to normal program execution by applying an external reset.
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5.6
DTC Activation by Interrupt
Note: The DTC is not implemented in the H8S/2635 Group. 5.6.1 Overview
The DTC can be activated by an interrupt. In this case, the following options are available: • Interrupt request to CPU • Activation request to DTC • Selection of a number of the above For details of interrupt requests that can be used with to activate the DTC, see section 8, Data Transfer Controller (DTC). 5.6.2 Block Diagram
Figure 5-9 shows a block diagram of the DTC interrupt controller.
Interrupt request IRQ interrupt Interrupt source clear signal
Selection circuit Select signal Clear signal DTCER
DTC activation request vector number
Control logic Clear signal
DTC
On-chip supporting module
DTVECR SWDTE clear signal Determination of priority Interrupt controller CPU interrupt request vector number CPU I, I2 to I0
Figure 5-9 Interrupt Control for DTC
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5.6.3
Operation
The interrupt controller has three main functions in DTC control. (1) Selection of Interrupt Source: Interrupt factors are selected as DTC activation request or CPU interrupt request by the DTCE bit of DTCERA to DTCERG of DTC. By specifying the DISEL bit of the DTC’s MRB, it is possible to clear the DTCE bit to 0 after DTC data transfer, and request a CPU interrupt. If DTC carries out the designate number of data transfers and the transfer counter reads 0, after DTC data transfer, the DTCE bit is also cleared to 0, and a CPU interrupt requested. (2) Determination of Priority: The DTC activation source is selected in accordance with the default priority order, and is not affected by mask or priority levels. See section 8.3.3, DTC Vector Table for the respective priority. (3) Operation Order: If the same interrupt is selected as a DTC activation source and a CPU interrupt source, the DTC data transfer is performed first, followed by CPU interrupt exception handling. Table 5-11 shows the interrupt factor clear control and selection of interrupt factors by specification of the DTCE bit of DTCERA to DTCERG of DTC, and the DISEL bit of DTC’s MRB.
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Table 5-11 Interrupt Source Selection and Clearing Control
Settings DTC DTCE 0 1 DISEL * 0 1 Interrupt Source Selection/Clearing Control DTC X CPU
Δ
X
Δ
Δ
Legend: Δ : The relevant interrupt is used. Interrupt source clearing is performed. (The CPU should clear the source flag in the interrupt handling routine.) : The relevant interrupt is used. The interrupt source is not cleared. X : The relevant bit cannot be used. * : Don’t care
(4) Notes on Use: SCI and A/D converter interrupt sources are cleared when the DTC reads or writes to the prescribed register.
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Section 6 PC Break Controller (PBC)
Section 6 PC Break Controller (PBC)
Note: The H8S/2635 Group is not equipped with a PBC.
6.1
Overview
The PC break controller (PBC) provides functions that simplify program debugging. Using these functions, it is easy to create a self-monitoring debugger, enabling programs to be debugged with the chip alone, without using an in-circuit emulator. Four break conditions can be set in the PBC: instruction fetch, data read, data write, and data read/write. 6.1.1 Features
The PC break controller has the following features: • Two break channels (A and B) • The following can be set as break compare conditions: ⎯ 24 address bits Bit masking possible ⎯ Bus cycle Instruction fetch Data access: data read, data write, data read/write ⎯ Bus master Either CPU or CPU/DTC can be selected • The timing of PC break exception handling after the occurrence of a break condition is as follows: ⎯ Immediately before execution of the instruction fetched at the set address (instruction fetch) ⎯ Immediately after execution of the instruction that accesses data at the set address (data access) • Module stop mode can be set ⎯ The initial setting is for PBC operation to be halted. Register access is enabled by clearing module stop mode.
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Section 6 PC Break Controller (PBC)
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6.1.2
Block Diagram
Figure 6-1 shows a block diagram of the PC break controller.
BARA BCRA
Mask control Comparator Match signal Internal address Access status
Control logic
Output control
PC break interrupt Comparator Match signal Control logic
Mask control
BARB
BCRB
Figure 6-1 Block Diagram of PC Break Controller
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Output control
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Section 6 PC Break Controller (PBC)
6.1.3
Register Configuration
Table 6-1 shows the PC break controller registers. Table 6-1 PC Break Controller Registers
Initial Value Name Break address register A Break address register B Break control register A Break control register B Module stop control register C Abbreviation BARA BARB BCRA BCRB MSTPCRC R/W R/W R/W R/(W) R/(W) R/W *2 *2 Reset H'XX000000 H'XX000000 H'00 H'00 H'FF Address* H'FE00 H'FE04 H'FE08 H'FE09 H'FDEA
1
Notes: 1. Lower 16 bits of the address. 2. Only a 0 may be written to this bit to clear the flag.
6.2
6.2.1
Bit
Register Descriptions
Break Address Register A (BARA)
31 ⎯ ... ... 24 23 22 21 20 19 18 17 16 ... 7 6 5 4 3 2 1 0
BAA BAA BAA BAA BAA BAA BAA BAA . . . BAA BAA BAA BAA BAA BAA BAA BAA ⎯ 7 6 5 4 3 2 1 0 23 22 21 20 19 18 17 16
Initial value Unde- . . . Unde- 0 ... 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 fined fined . . . ⎯ R/W R/W R/W R/W R/W R/W R/W R/W . . . R/W R/W R/W R/W R/W R/W R/W R/W Read/Write ⎯
BARA is a 32-bit readable/writable register that specifies the channel A break address. BAA23 to BAA0 are initialized to H'000000 by a reset and in hardware standby mode. Bits 31 to 24—Reserved: These bits return an undefined value if read, and cannot be modified. Bits 23 to 0—Break Address A23 to A0 (BAA23 to BAA0): These bits hold the channel A PC break address.
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6.2.2
Break Address Register B (BARB)
BARB is the channel B break address register. The bit configuration is the same as for BARA. 6.2.3
Bit
Break Control Register A (BCRA)
7 CMFA 6 CDA 0 R/W 5 4 3 2 1 0 BIEA 0 R/W
BAMRA2 BAMRA1 BAMRA0 CSELA1 CSELA0 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W
Initial value Read/Write
0 R/(W)*
Note: * Only a 0 may be written to this bit to clear the flag.
BCRA is an 8-bit readable/writable register that controls channel A PC breaks. BCRA (1) selects the break condition bus master, (2) specifies bits subject to address comparison masking, and (3) specifies whether the break condition is applied to an instruction fetch or a data access. It also contains a condition match flag. BCRA is initialized to H'00 by a reset and in hardware standby mode. Bit 7—Condition Match Flag A (CMFA): Set to 1 when a break condition set for channel A is satisfied. This flag is not cleared to 0.
Bit 7 CMFA 0 1 Description [Clearing condition] • • When 0 is written to CMFA after reading CMFA = 1 When a condition set for channel A is satisfied (Initial value) [Setting condition]
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Bit 6—CPU Cycle/DTC Cycle Select A (CDA): Selects the channel A break condition bus master.
Bit 6 CDA 0 1 Description PC break is performed when CPU is bus master PC break is performed when CPU or DTC is bus master (Initial value)
Bits 5 to 3—Break Address Mask Register A2 to A0 (BAMRA2 to BAMRA0): These bits specify which bits of the break address (BAA23 to BAA0) set in BARA are to be masked.
Bit 5 Bit 4 Bit 3
BAMRA2 BAMRA1 BAMRA0 Description 0 0 0 1 1 0 1 1 0 0 1 1 0 1 All BARA bits are unmasked and included in break conditions (Initial value) BAA0 (lowest bit) is masked, and not included in break conditions BAA1, BAA0 (lower 2 bits) are masked, and not included in break conditions BAA2 to BAA0 (lower 3 bits) are masked, and not included in break conditions BAA3 to BAA0 (lower 4 bits) are masked, and not included in break conditions BAA7 to BAA0 (lower 8 bits) are masked, and not included in break conditions BAA11 to BAA0 (lower 12 bits) are masked, and not included in break conditions BAA15 to BAA0 (lower 16 bits) are masked, and not included in break conditions
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Bits 2 and 1—Break Condition Select A (CSELA1, CSELA0): These bits selection an instruction fetch, data read, data write, or data read/write cycle as the channel A break condition.
Bit 2 CSELA1 0 1 Bit 1 CSELA0 0 1 0 1 Description Instruction fetch is used as break condition Data read cycle is used as break condition Data write cycle is used as break condition Data read/write cycle is used as break condition (Initial value)
Bit 0—Break Interrupt Enable A (BIEA): Enables or disables channel A PC break interrupts.
Bit 0 BIEA 0 1 Description PC break interrupts are disabled PC break interrupts are enabled (Initial value)
6.2.4
Break Control Register B (BCRB)
BCRB is the channel B break control register. The bit configuration is the same as for BCRA. 6.2.5
Bit Initial value Read/Write
Module Stop Control Register C (MSTPCRC)
7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
MSTPC7 MSTPC6 MSTPC5 MSTPC4 MSTPC3 MSTPC2 MSTPC1 MSTPC0
MSTPCRC is an 8-bit readable/writable register that performs module stop mode control. When the MSTPC4 bit is set to 1, PC break controller operation is stopped at the end of the bus cycle, and module stop mode is entered. Register read/write accesses are not possible in module stop mode. For details, see section 23A.5, 23B.5, Module Stop Mode. MSTPCRC is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 4—Module Stop (MSTPC4): Specifies the PC break controller module stop mode.
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Section 6 PC Break Controller (PBC)
Bit 4 MSTPC4 0 1 Description PC break controller module stop mode is cleared PC break controller module stop mode is set (Initial value)
6.3
Operation
The operation flow from break condition setting to PC break interrupt exception handling is shown in section 6.3.1, PC Break Interrupt Due to Instruction Fetch, and 6.3.2, PC Break Interrupt Due to Data Access, taking the example of channel A. 6.3.1 PC Break Interrupt Due to Instruction Fetch
(1) Initial settings ⎯ Set the break address in BARA. For a PC break caused by an instruction fetch, set the address of the first instruction byte as the break address. ⎯ Set the break conditions in BCRA. BCRA bit 6 (CDA): With a PC break caused by an instruction fetch, the bus master must be the CPU. Set 0 to select the CPU. BCRA bits 5 to 3 (BAMA2 to BAMA0): Set the address bits to be masked. BCRA bits 2, 1 (CSELA1, CSELA0): Set 00 to specify an instruction fetch as the break condition. BCRA bit 0 (BIEA): Set to 1 to enable break interrupts. (2) Satisfaction of break condition ⎯ When the instruction at the set address is fetched, a PC break request is generated immediately before execution of the fetched instruction, and the condition match flag (CMFA) is set. (3) Interrupt handling ⎯ After priority determination by the interrupt controller, PC break interrupt exception handling is started.
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6.3.2
PC Break Interrupt Due to Data Access
(1) Initial settings ⎯ Set the break address in BARA. For a PC break caused by a data access, set the target ROM, RAM, I/O, or external address space address as the break address. Stack operations and branch address reads are included in data accesses. ⎯ Set the break conditions in BCRA. BCRA bit 6 (CDA): Select the bus master. BCRA bits 5 to 3 (BAMA2 to BAMA0): Set the address bits to be masked. BCRA bits 2, 1 (CSELA1, CSELA0): Set 01, 10, or 11 to specify data access as the break condition. BCRA bit 0 (BIEA): Set to 1 to enable break interrupts. (2) Satisfaction of break condition ⎯ After execution of the instruction that performs a data access on the set address, a PC break request is generated and the condition match flag (CMFA) is set. (3) Interrupt handling ⎯ After priority determination by the interrupt controller, PC break interrupt exception handling is started. 6.3.3 Notes on PC Break Interrupt Handling
(1) The PC break interrupt is shared by channels A and B. The channel from which the request was issued must be determined by the interrupt handler. (2) The CMFA and CMFB flags are not cleared to 0, so 0 must be written to CMFA or CMFB after first reading the flag while it is set to 1. If the flag is left set to 1, another interrupt will be requested after interrupt handling ends. (3) A PC break interrupt generated when the DTC is the bus master is accepted after the bus has been transferred to the CPU by the bus controller.
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Section 6 PC Break Controller (PBC)
6.3.4
Operation in Transitions to Power-Down Modes
The operation when a PC break interrupt is set for an instruction fetch at the address after a SLEEP instruction is shown below. (1) When the SLEEP instruction causes a transition from high-speed (medium-speed) mode to sleep mode, or from subactive mode* to subsleep mode*: After execution of the SLEEP instruction, a transition is not made to sleep mode or subsleep mode*, and PC break interrupt handling is executed. After execution of PC break interrupt handling, the instruction at the address after the SLEEP instruction is executed (figure 6-2 (A)). (2) When the SLEEP instruction causes a transition from high-speed (medium-speed) mode to subactive mode*: After execution of the SLEEP instruction, a transition is made to subactive mode* via direct transition exception handling. After the transition, PC break interrupt handling is executed, then the instruction at the address after the SLEEP instruction is executed (figure 6-2 (B)). (3) When the SLEEP instruction causes a transition from subactive mode* to high-speed (medium-speed) mode: After execution of the SLEEP instruction, and following the clock oscillation settling time, a transition is made to high-speed (medium-speed) mode via direct transition exception handling. After the transition, PC break interrupt handling is executed, then the instruction at the address after the SLEEP instruction is executed (figure 6-2 (C)). (4) When the SLEEP instruction causes a transition to software standby mode or watch mode*: After execution of the SLEEP instruction, a transition is made to the respective mode, and PC break interrupt handling is not executed. However, the CMFA or CMFB flag is set (figure 6-2 (D)). Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only.
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SLEEP instruction execution
SLEEP instruction execution
SLEEP instruction execution
SLEEP instruction execution
PC break exception handling
System clock → subclock*
Subclock* → system clock, oscillation settling time Direct transition* exception handling Subactive* mode PC break exception handling
Transition to respective mode (D)
Execution of instruction after sleep instruction (A)
Direct transition* exception handling
PC break exception handling
High-speed (medium-speed) mode
Execution of instruction after sleep instruction (B)
Execution of instruction after sleep instruction (C)
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only.
Figure 6-2 Operation in Power-Down Mode Transitions 6.3.5 PC Break Operation in Continuous Data Transfer
If a PC break interrupt is generated when the following operations are being performed, exception handling is executed on completion of the specified transfer. (1) When a PC break interrupt is generated at the transfer address of an EEPMOV.B instruction: PC break exception handling is executed after all data transfers have been completed and the EEPMOV.B instruction has ended. (2) When a PC break interrupt is generated at a DTC transfer address:31 PC break exception handling is executed after the DTC has completed the specified number of data transfers, or after data for which the DISEL bit is set to 1 has been transferred.
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Section 6 PC Break Controller (PBC)
6.3.6
When Instruction Execution Is Delayed by One State
Caution is required in the following cases, as instruction execution is one state later than usual. (1) When the PBC is enabled (i.e. when the break interrupt enable bit is set to 1), execution of a one-word branch instruction (Bcc d:8, BSR, JSR, JMP, TRAPA, RTE, or RTS) located in onchip ROM or RAM is always delayed by one state. (2) When break interruption by instruction fetch is set, the set address indicates on-chip ROM or RAM space, and that address is used for data access, the instruction that executes the data access is one state later than in normal operation. (3) When break interruption by instruction fetch is set and a break interrupt is generated, if the executing instruction immediately preceding the set instruction has one of the addressing modes shown below, and that address indicates on-chip ROM or RAM, and that address is used for data access, the instruction will be one state later than in normal operation. @ERn, @(d:16,ERn), @(d:32,ERn), @-ERn/ERn+, @aa:8, @aa:24, @aa:32, @(d:8,PC), @(d:16,PC), @@aa:8 (4) When break interruption by instruction fetch is set and a break interrupt is generated, if the executing instruction immediately preceding the set instruction is NOP or SLEEP, or has #xx,Rn as its addressing mode, and that instruction is located in on-chip ROM or RAM, the instruction will be one state later than in normal operation.
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6.3.7
Additional Notes
(1) When a PC break is set for an instruction fetch at the address following a BSR, JSR, JMP, TRAPA, RTE, or RTS instruction: Even if the instruction at the address following a BSR, JSR, JMP, TRAPA, RTE, or RTS instruction is fetched, it is not executed, and so a PC break interrupt is not generated by the instruction fetch at the next address. (2) When the I bit is set by an LDC, ANDC, ORC, or XORC instruction, a PC break interrupt becomes valid two states after the end of the executing instruction. If a PC break interrupt is set for the instruction following one of these instructions, since interrupts, including NMI, are disabled for a 3-state period in the case of LDC, ANDC, ORC, and XORC, the next instruction is always executed. For details, see section 5, Interrupt Controller. (3) When a PC break is set for an instruction fetch at the address following a Bcc instruction: A PC break interrupt is generated if the instruction at the next address is executed in accordance with the branch condition, but is not generated if the instruction at the next address is not executed. (4) When a PC break is set for an instruction fetch at the branch destination address of a Bcc instruction: A PC break interrupt is generated if the instruction at the branch destination is executed in accordance with the branch condition, but is not generated if the instruction at the branch destination is not executed.
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Section 7 Bus Controller
Section 7 Bus Controller
7.1 Overview
The chip has an on-chip bus controller (BSC) that manages the external address space divided into eight areas. The bus specifications, such as bus width and number of access states, can be set independently for each area, enabling multiple memories to be connected easily. The bus controller also has a bus arbitration function, and controls the operation of the internal bus masters: the CPU, and data transfer controller (DTC). Note: The DTC is not implemented in the H8S/2635 Group. 7.1.1 Features
The features of the bus controller are listed below. • Manages external address space in area units ⎯ Manages the external space as 8 areas of 2-Mbytes ⎯ Bus specifications can be set independently for each area ⎯ Burst ROM interface can be set • Basic bus interface ⎯ 8-bit access or 16-bit access can be selected for each area ⎯ 2-state access or 3-state access can be selected for each area ⎯ Program wait states can be inserted for each area • Burst ROM interface ⎯ Burst ROM interface can be set for area 0 ⎯ Choice of 1- or 2-state burst access • Idle cycle insertion ⎯ An idle cycle can be inserted in case of an external read cycle between different areas ⎯ An idle cycle can be inserted in case of an external write cycle immediately after an external read cycle • Write buffer functions ⎯ External write cycle and internal access can be executed in parallel • Bus arbitration function ⎯ Includes a bus arbiter that arbitrates bus mastership among the CPU and DTC • Other features ⎯ External bus release function
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7.1.2
Block Diagram
Figure 7-1 shows a block diagram of the bus controller.
Internal address bus
Area decoder
ABWCR External bus control signals ASTCR BCRH BCRL
Bus controller
Internal data bus
Internal control signals Bus mode signal
Wait controller
WCRH WCRL
CPU bus request signal DTC bus request signal Bus arbiter CPU bus acknowledge signal DTC bus acknowledge signal
Legend: ABWCR: ASTCR: BCRH: BCRL: WCRH: WCRL:
Bus width control register Access state control register Bus control register H Bus control register L Wait control register H Wait control register L
Figure 7-1 Block Diagram of Bus Controller
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Section 7 Bus Controller
7.1.3
Pin Configuration
Table 7-1 summarizes the pins of the bus controller. Table 7-1
Name Address strobe Read High write
Bus Controller Pins
Symbol AS RD HWR I/O Output Output Output Function Strobe signal indicating that address output on address bus is enabled. Strobe signal indicating that external space is being read. Strobe signal indicating that external space is to be written, and upper half (D15 to D8) of data bus is enabled. Strobe signal indicating that external space is to be written, and lower half (D7 to D0) of data bus is enabled.
Low write
LWR
Output
7.1.4
Register Configuration
Table 7-2 summarizes the registers of the bus controller. Table 7-2
Name Bus width control register Access state control register Wait control register H Wait control register L Bus control register H Bus control register L Pin function control register
Bus Controller Registers
Abbreviation ABWCR ASTCR WCRH WCRL BCRH BCRL PFCR R/W R/W R/W R/W R/W R/W R/W R/W Initial Value H'FF/H'00* H'FF H'FF H'FF H'D0 H'08 H'0D/H'00
2
Address* H'FED0 H'FED1 H'FED2 H'FED3 H'FED4 H'FED5 H'FDEB
1
Notes: 1. Lower 16 bits of the address. 2. Determined by the MCU operating mode.
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7.2
7.2.1
Bit
Register Descriptions
Bus Width Control Register (ABWCR)
: 7 ABW7 6 ABW6 1 R/W 0 R/W 5 ABW5 1 R/W 0 R/W 4 ABW4 1 R/W 0 R/W 3 ABW3 1 R/W 0 R/W 2 ABW2 1 R/W 0 R/W 1 ABW1 1 R/W 0 R/W 0 ABW0 1 R/W 0 R/W
Modes 5 to 7 Initial value : RW Mode 4 Initial value : RW : :
1 R/W 0 R/W
ABWCR is an 8-bit readable/writable register that designates each area for either 8-bit access or 16-bit access. ABWCR sets the data bus width for the external memory space. The bus width for on-chip memory and internal I/O registers is fixed regardless of the settings in ABWCR. After a reset and in hardware standby mode, ABWCR is initialized to H'FF in modes 5, 6, 7, and to H'00 in mode 4. It is not initialized in software standby mode. Bits 7 to 0—Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select whether the corresponding area is to be designated for 8-bit access or 16-bit access.
Bit n ABWn 0 1 Description Area n is designated for 16-bit access Area n is designated for 8-bit access (n = 7 to 0)
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7.2.2
Bit
Access State Control Register (ASTCR)
: 7 AST7 1 R/W 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W 3 AST3 1 R/W 2 AST2 1 R/W 1 AST1 1 R/W 0 AST0 1 R/W
Initial value : R/W :
ASTCR is an 8-bit readable/writable register that designates each area as either a 2-state access space or a 3-state access space. ASTCR sets the number of access states for the external memory space. The number of access states for on-chip memory and internal I/O registers is fixed regardless of the settings in ASTCR. ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0—Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is to be designated as a 2-state access space or a 3-state access space. Wait state insertion is enabled or disabled at the same time.
Bit n ASTn 0 1 Description Area n is designated for 2-state access Wait state insertion in area n external space is disabled Area n is designated for 3-state access Wait state insertion in area n external space is enabled (Initial value) (n = 7 to 0)
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7.2.3
Wait Control Registers H and L (WCRH, WCRL)
WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait states for each area. Program waits are not inserted in the case of on-chip memory or internal I/O registers. WCRH and WCRL are initialized to H'FF by a reset and in hardware standby mode. They are not initialized in software standby mode. WCRH
Bit : 7 W71 Initial value : R/W : 1 R/W 6 W70 1 R/W 5 W61 1 R/W 4 W60 1 R/W 3 W51 1 R/W 2 W50 1 R/W 1 W41 1 R/W 0 W40 1 R/W
Bits 7 and 6—Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set to 1.
Bit 7 W71 0 1 Bit 6 W70 0 1 0 1 Description Program wait not inserted when external space area 7 is accessed 1 program wait state inserted when external space area 7 is accessed 2 program wait states inserted when external space area 7 is accessed 3 program wait states inserted when external space area 7 is accessed (Initial value)
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Bits 5 and 4—Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set to 1.
Bit 5 W61 0 1 Bit 4 W60 0 1 0 1 Description Program wait not inserted when external space area 6 is accessed 1 program wait state inserted when external space area 6 is accessed 2 program wait states inserted when external space area 6 is accessed 3 program wait states inserted when external space area 6 is accessed (Initial value)
Bits 3 and 2—Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set to 1.
Bit 3 W51 0 1 Bit 2 W50 0 1 0 1 Description Program wait not inserted when external space area 5 is accessed 1 program wait state inserted when external space area 5 is accessed 2 program wait states inserted when external space area 5 is accessed 3 program wait states inserted when external space area 5 is accessed (Initial value)
Bits 1 and 0—Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set to 1.
Bit 1 W41 0 1 Bit 0 W40 0 1 0 1 Description Program wait not inserted when external space area 4 is accessed 1 program wait state inserted when external space area 4 is accessed 2 program wait states inserted when external space area 4 is accessed 3 program wait states inserted when external space area 4 is accessed (Initial value)
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WCRL
Bit : 7 W31 Initial value : R/W : 1 R/W 6 W30 1 R/W 5 W21 1 R/W 4 W20 1 R/W 3 W11 1 R/W 2 W10 1 R/W 1 W01 1 R/W 0 W00 1 R/W
Bits 7 and 6—Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set to 1.
Bit 7 W31 0 1 Bit 6 W30 0 1 0 1 Description Program wait not inserted when external space area 3 is accessed 1 program wait state inserted when external space area 3 is accessed 2 program wait states inserted when external space area 3 is accessed 3 program wait states inserted when external space area 3 is accessed (Initial value)
Bits 5 and 4—Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set to 1.
Bit 5 W21 0 1 Bit 4 W20 0 1 0 1 Description Program wait not inserted when external space area 2 is accessed 1 program wait state inserted when external space area 2 is accessed 2 program wait states inserted when external space area 2 is accessed 3 program wait states inserted when external space area 2 is accessed (Initial value)
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Bits 3 and 2—Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set to 1.
Bit 3 W11 0 1 Bit 2 W10 0 1 0 1 Description Program wait not inserted when external space area 1 is accessed 1 program wait state inserted when external space area 1 is accessed 2 program wait states inserted when external space area 1 is accessed 3 program wait states inserted when external space area 1 is accessed (Initial value)
Bits 1 and 0—Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set to 1.
Bit 1 W01 0 1 Bit 0 W00 0 1 0 1 Description Program wait not inserted when external space area 0 is accessed 1 program wait state inserted when external space area 0 is accessed 2 program wait states inserted when external space area 0 is accessed 3 program wait states inserted when external space area 0 is accessed (Initial value)
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7.2.4
Bit
Bus Control Register H (BCRH)
: 7 ICIS1 1 R/W 6 ICIS0 1 R/W 5 0 R/W 4 1 R/W 3 0 R/W 2 ⎯ 0 R/W 1 ⎯ 0 R/W 0 ⎯ 0 R/W
BRSTRM BRSTS1 BRSTS0
Initial value : R/W :
BCRH is an 8-bit readable/writable register that selects enabling or disabling of idle cycle insertion, and the memory interface for area 2 to 5, and 0. BCRH is initialized to H'D0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Idle Cycle Insert 1 (ICIS1): Selects whether or not one idle cycle state is to be inserted between bus cycles when successive external read cycles are performed in different areas.
Bit 7 ICIS1 0 1 Description Idle cycle not inserted in case of successive external read cycles in different areas Idle cycle inserted in case of successive external read cycles in different areas (Initial value)
Bit 6—Idle Cycle Insert 0 (ICIS0): Selects whether or not one idle cycle state is to be inserted between bus cycles when successive external read and external write cycles are performed .
Bit 6 ICIS0 0 1 Description Idle cycle not inserted in case of successive external read and external write cycles Idle cycle inserted in case of successive external read and external write cycles (Initial value)
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Bit 5—Burst ROM Enable (BRSTRM): Selects whether area 0 is used as a burst ROM interface.
Bit 5 BRSTRM 0 1 Description Area 0 is basic bus interface Area 0 is burst ROM interface (Initial value)
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM interface.
Bit 4 BRSTS1 0 1 Description Burst cycle comprises 1 state Burst cycle comprises 2 states (Initial value)
Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a burst ROM interface burst access.
Bit 3 BRSTS0 0 1 Description Max. 4 words in burst access Max. 8 words in burst access (Initial value)
Bits 2 to 0—Reserved: Only 0 should be written to these bits.
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7.2.5
Bit
Bus Control Register L (BCRL)
: 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 ⎯ 0 ⎯ 4 ⎯ 0 R/W 3 ⎯ 1 R/W 2 ⎯ 0 R/W 1 WDBE 0 R/W 0 ⎯ 0 R/W
Initial value : R/W :
BCRL is an 8-bit readable/writable register that performs selection of the external bus-released state protocol, enabling or disabling of the write data buffer function. BCRL is initialized to H'08 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 and 6—Reserved: Only 0 should be written to these bits. Bit 5—Reserved: It is always read as 0. Cannot be written to. Bit 4—Reserved: Only 0 should be written to this bit. Bit 3—Reserved: Only 1 should be written to this bit. Bit 2—Reserved: Only 0 should be written to this bit. Bit 1—Write Data Buffer Enable (WDBE): This bit selects whether or not to use the write buffer function in the external write cycle.
Bit 1 WDBE 0 1 Description Write data buffer function not used Write data buffer function used (Initial value)
Bit 0—Reserved: Only 0 should be written to these bits.
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7.2.6
Bit
Pin Function Control Register (PFCR)
: 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 ⎯ 0 R/W 4 ⎯ 0 R/W 3 AE3 1/0 R/W 2 AE2 1/0 R/W 1 AE1 0 R/W 0 AE0 1/0 R/W
Initial value : R/W :
PFCR is an 8-bit read/write register that controls the address output in on-chip ROM-enabled expansion mode. PFCR is initialized to H'0D/H'00 by a reset and in hardware standby mode. It retains its previous state in software standby mode. Bits 7 to 4—Reserved: Only 0 should be written to these bits. Bits 3 to 0—Address Output Enable 3 to 0 (AE3 to AE0): These bits select enabling or disabling of address outputs A8 to A23 in on-chip ROM-disabled expansion mode and on-chip ROM-enabled expansion mode. When a pin is enabled for address output, the address is output regardless of the corresponding DDR setting. When a pin is disabled for address output, it becomes an output port when the corresponding DDR bit is set to 1.
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Bit 3 AE3 0
Bit 2 AE2 0
Bit 1 AE1 0 1
Bit 0 AE0 0 1 0 1 Description A8 to A23 address output disabled (Initial value*)
A8 address output enabled; A9 to A23 address output disabled A8, A9 address output enabled; A10 to A23 address output disabled A8 to A10 address output enabled; A11 to A23 address output disabled A8 to A11 address output enabled; A12 to A23 address output disabled A8 to A12 address output enabled; A13 to A23 address output disabled A8 to A13 address output enabled; A14 to A23 address output disabled A8 to A14 address output enabled; A15 to A23 address output disabled A8 to A15 address output enabled; A16 to A23 address output disabled A8 to A16 address output enabled; A17 to A23 address output disabled A8 to A17 address output enabled; A18 to A23 address output disabled A8 to A18 address output enabled; A19 to A23 address output disabled A8 to A19 address output enabled; A20 to A23 address output disabled A8 to A20 address output enabled; A21 to A23 address output disabled (Initial value*) A8 to A21 address output enabled; A22, A23 address output disabled A8 to A23 address output enabled
1
0
0 1
1
0 1
1
0
0
0 1
1
0 1
1
0
0 1
1
0 1
Note: * In on-chip ROM-enabled expansion mode, bits AE3 to AE0 are initialized to B'0000. In on-chip ROM-disabled expansion mode, bits AE3 to AE0 are initialized to B'1101. Address pins A0 to A7 are made address outputs by setting the corresponding DDR bits to 1.
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7.3
7.3.1
Overview of Bus Control
Area Partitioning
In advanced mode, the bus controller partitions the 16 Mbytes address space into eight areas, 0 to 7, in 2-Mbyte units, and performs bus control for external space in area units. In normal mode*, it controls a 64-kbyte address space comprising part of area 0. Figure 7-2 shows an outline of the memory map. Note: * Not available in the chip.
H'000000 Area 0 (2 Mbytes) H'1FFFFF H'200000 Area 1 (2 Mbytes) H'3FFFFF H'400000 Area 2 (2 Mbytes) H'5FFFFF H'600000 Area 3 (2 Mbytes) H'7FFFFF H'800000 Area 4 (2 Mbytes) H'9FFFFF H'A00000 Area 5 (2 Mbytes) H'BFFFFF H'C00000 Area 6 (2 Mbytes) H'DFFFFF H'E00000 Area 7 (2 Mbytes) H'FFFFFF (1) Advanced mode
H'0000
H'FFFF
(2)
Normal mode*
Note: * Not available in the chip.
Figure 7-2 Overview of Area Partitioning
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7.3.2
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access states, and number of program wait states. The bus width and number of access states for on-chip memory and internal I/O registers are fixed, and are not affected by the bus controller. Bus Width: A bus width of 8 or 16 bits can be selected with ADWCR. An area for which an 8-bit bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected functions as a16-bit access space. If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-bit access, 16-bit bus mode is set. When the burst ROM interface is designated, 16-bit bus mode is always set. Number of Access States: Two or three access states can be selected with ASTCR. An area for which 2-state access is selected functions as a 2-state access space, and an area for which 3-state access is selected functions as a 3-state access space. With the burst ROM interface, the number of access states may be determined without regard to ASTCR. When 2-state access space is designated, wait insertion is disabled. Number of Program Wait States: When 3-state access space is designated by ASTCR, the number of program wait states to be inserted automatically is selected with WCRH and WCRL. From 0 to 3 program wait states can be selected. Table 7-3 shows the bus specifications for each basic bus interface area.
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Table 7-3
ABWCR ABWn 0
Bus Specifications for Each Area (Basic Bus Interface)
ASTCR ASTn 0 1 WCRH, WCRL Wn1 — 0 1 Wn0 — 0 1 0 1 — 0 1 1 0 1 8 2 3 Bus Specifications (Basic Bus Interface) Bus Width 16 Program Wait Access States States 2 3 0 0 1 2 3 0 0 1 2 3
1
0 1
— 0
7.3.3
Memory Interfaces
The chip's memory interfaces comprise a basic bus interface that allows direct connection or ROM, SRAM, and so on, and a burst ROM interface that allows direct connection of burst ROM. The memory interface can be selected independently for each area. An area for which the basic bus interface is designated functions as normal space, and an area for which the burst ROM interface is designated functions as burst ROM space.
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7.3.4
Interface Specifications for Each Area
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is selected according to the operating mode. The bus specifications described here cover basic items only, and the sections on each memory interface (7.4, Basic Bus Interface, and 7.5, Burst ROM Interface) should be referred to for further details. Area 0: Area 0 includes on-chip ROM, and in ROM-disabled expansion mode, all of area 0 is external space. In ROM-enabled expansion mode, the space excluding on-chip ROM is external space. Either basic bus interface or burst ROM interface can be selected for area 0. Areas 1 to 6: In external expansion mode, all of areas 1 to 6 is external space. Only the basic bus interface can be used for areas 1 to 6. Area 7: Area 7 includes the on-chip RAM and internal I/O registers. In external expansion mode, the space excluding the on-chip RAM and internal I/O registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes external space. Only the basic bus interface can be used for the area 7.
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7.4
7.4.1
Basic Bus Interface
Overview
The basic bus interface enables direct connection of ROM, SRAM, and so on. The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL (see table 7-3). 7.4.2 Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications for the area being accessed (8-bit access space or 16-bit access space) and the data size. 8-Bit Access Space: Figure 7-3 illustrates data alignment control for the 8-bit access space. With the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte: a word transfer instruction is performed as two byte accesses, and a longword transfer instruction, as four byte accesses.
Upper data bus Lower data bus D15 D8 D7 D0 Byte size 1st bus cycle 2nd bus cycle 1st bus cycle Longword size 2nd bus cycle 3rd bus cycle 4th bus cycle
Word size
Figure 7-3 Access Sizes and Data Alignment Control (8-Bit Access Space)
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16-Bit Access Space: Figure 7-4 illustrates data alignment control for the 16-bit access space. With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be accessed at one time is one byte or one word, and a longword transfer instruction is executed as two word transfer instructions. In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd address.
Lower data bus Upper data bus D15 D8 D7 D0 Byte size Byte size Word size Longword size 1st bus cycle 2nd bus cycle • Even address • Odd address
Figure 7-4 Access Sizes and Data Alignment Control (16-Bit Access Space)
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7.4.3
Valid Strobes
Table 7-4 shows the data buses used and valid strobes for the access spaces. In a read, the RD signal is valid without discrimination between the upper and lower halves of the data bus. In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half. Table 7-4
Area 8-bit access space
Data Buses Used and Valid Strobes
Access Read/ Size Write Byte Read Write Read Write Word Read Write Address — — Even Odd Even Odd — — HWR LWR RD Valid Strobe RD HWR RD Valid Invalid Valid Hi-Z Valid Upper Data Bus (D15 to D8) Valid Lower data bus (D7 to D0) Invalid Hi-Z Invalid Valid Hi-Z Valid Valid Valid
16-bit access Byte space
HWR, LWR Valid
Note: Hi-Z: High impedance. Invalid: Input state; input value is ignored.
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7.4.4
Basic Timing
8-Bit 2-State Access Space: Figure 7-5 shows the bus timing for an 8-bit 2-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The LWR pin is fixed high. Wait states cannot be inserted.
Bus cycle T1 φ T2
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR Write D15 to D8
High
Valid
D7 to D0
High impedance
Figure 7-5 Bus Timing for 8-Bit 2-State Access Space
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8-Bit 3-State Access Space: Figure 7-6 shows the bus timing for an 8-bit 3-state access space. When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used. The LWR pin is fixed high. Wait states can be inserted.
Bus cycle T1 φ T2 T3
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR High
LWR Write D15 to D8
Valid High impedance
D7 to D0
Figure 7-6 Bus Timing for 8-Bit 3-State Access Space
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16-Bit 2-State Access Space: Figures 7-7 to 7-9 show bus timings for a 16-bit 2-state access space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address. Wait states cannot be inserted.
Bus cycle T1 φ T2
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR Write
D15 to D8
High
Valid
D7 to D0
High impedance
Figure 7-7 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access)
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Bus cycle T1 φ T2
Address bus
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR Write D15 to D8 High impedance
D7 to D0
Valid
Figure 7-8 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access)
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Bus cycle T1 φ T2
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR Write D15 to D8 Valid
D7 to D0
Valid
Figure 7-9 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access)
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16-Bit 3-State Access Space: Figures 7-10 to 7-12 show bus timings for a 16-bit 3-state access space. When a 16-bit access space is accessed , the upper half (D15 to D8) of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address. Wait states can be inserted.
Bus cycle T1 φ T2 T3
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR High
LWR Write D15 to D8
Valid High impedance
D7 to D0
Figure 7-10 Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access)
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Bus cycle T1 φ T2 T3
Address bus
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR Write D15 to D8 High impedance
D7 to D0
Valid
Figure 7-11 Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access)
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Bus cycle T1 φ T2 T3
Address bus
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR Write D15 to D8 Valid
D7 to D0 Note: n = 0 to 7
Valid
Figure 7-12 Bus Timing for 16-Bit 3-State Access Space (3) (Word Access)
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7.4.5
Wait Control
When accessing external space, the chip can extend the bus cycle by inserting one or more wait states (Tw). There are two ways of inserting wait states: program wait insertion. Program Wait Insertion From 0 to 3 wait states can be inserted automatically between the T2 state and T3 state on an individual area basis in 3-state access space, according to the settings of WCRH and WCRL. Figure 7-13 shows an example of wait state insertion timing.
By program wait T1 φ T2 Tw Tw Tw T3
Address bus
AS
RD Read Data bus Read data
HWR, LWR Write Data bus Write data
Figure 7-13 Example of Wait State Insertion Timing The settings after a reset are: 3-state access, 3 program wait state insertion.
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7.5
7.5.1
Burst ROM Interface
Overview
In this LSI, the area 0 external space can be set as burst ROM space and burst ROM interfacing performed. Burst ROM space interfacing allows 16-bit ROM capable of burst access to be accessed at high-speed. The BRSTRM bit of BCRH sets area 0 as burst ROM space. CPU instruction fetches (only) can be performed using a maximum of 4-word or 8-word continuous burst access. 1 state or 2 states can be selected in the case of burst access. 7.5.2 Basic Timing
The AST0 bit of ASTCR sets the number of access states in the initial cycle (full access) of the burst ROM interface. Wait states can be inserted when the AST0 bit is set to 1. The burst cycle can be set for 1 state or 2 sttes by setting the BRSTS1 bit of BCRH. Wait states cannot be inserted. When area 0 is set as burst ROM space, area 0 is a 16-bit access space regardless of the ABW0 bit of ABWCR. When the BRSTS0 bit of BCRH is cleared to 0, 4-word max. burst access is performed. When the BRSTS0 bit is set to 1, 8-word max. burst access is performed. Figures 7-14 (a) and (b) show the basic access timing for the burst ROM space. Figure 7-14 (a) is an example when both the AST0 and BRSTS1 bits are set to 1. Figure 7-14 (b) is an example when both the AST0 and BRSTS1 bits are set to 0.
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Full access T1 φ T2 T3 T1
Burst access T2 T1 T2
Address bus
Low address only changes
AS
RD
Data bus
Read data
Read data
Read data
Figure 7-14 (a) Example Burst ROM Access Timing (AST0 = BRSTS1 = 1)
Full access T1 T2 Burst access T1 T1
φ
Address bus
Low address only changes
AS
RD
Data bus
Read data
Read data Read data
Figure 7-14 (b) Example Burst ROM Access Timing (AST0 = BRSTS1 = 0)
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7.5.3
Wait Control
As with the basic bus interface, program waits can be inserted in the burst ROM interface initial cycle (full access). See section 7.4.5, Wait Control. Wait states cannot be inserted in the burst cycle.
7.6
7.6.1
Idle Cycle
Operation
When the chip accesses external space, it can insert a 1-state idle cycle (TI) between bus cycles in the following two cases: (1) when read accesses between different areas occur consecutively, and (2) when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, with a long output floating time, and high-speed memory, I/O interfaces, and so on.
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(1) Consecutive Reads between Different Areas If consecutive reads between different areas occur while the ICIS1 bit in BCRH is set to 1, an idle cycle is inserted at the start of the second read cycle. Figure 7-15 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM, each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted, and a data collision is prevented.
Bus cycle A φ Address bus CS* (area A) CS* (area B) RD Data bus Data collision (b) Idle cycle inserted (Initial value ICIS1 = 1) T1 T2 T3 Bus cycle B T1 T2 φ Address bus CS* (area A) CS* (area B) RD Data bus Bus cycle A T1 T2 T3 Bus cycle B TI T1 T2
Long output floating time (a) Idle cycle not inserted (ICIS1 = 0)
Note: * The CS signal is generated externally rather than inside the LSI device.
Figure 7-15 Example of Idle Cycle Operation (1)
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(2) Write after Read If an external write occurs after an external read while the ICIS0 bit in BCRH is set to 1, an idle cycle is inserted at the start of the write cycle. Figure 7-16 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
Bus cycle A φ Address bus CS* (area A) CS* (area B) RD T1 T2 T3 Bus cycle B T1 T2 φ Address bus CS* (area A) CS* (area B) RD Bus cycle A T1 T2 T3 Bus cycle B TI T1 T2
Possibility of overlap between CS (area B) and RD (a) Idle cycle not inserted (ICIS1 = 0) (b) Idle cycle inserted (Initial value ICIS1 = 1)
Note: * The CS signal is generated externally rather than inside the LSI device.
Figure 7-16 Example of Idle Cycle Operation (2)
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(3) Relationship between Chip Select (CS*) Signal and Read (RD) Signal Depending on the system’s load conditions, the RD signal may lag behind the CS signal*. An example is shown in figure 7-17. In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap between the bus cycle A RD signal and the bus cycle B CS signal. Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS signals. In the initial state after reset release, idle cycle insertion (b) is set. Note: * The CS signal is generated externally rather than inside the LSI device.
Bus cycle A φ Address bus CS* (area A) CS* (area B) RD HWR Data bus Data collision (b) Idle cycle inserted (Initial value ICIS0 = 1) T1 T2 T3 Bus cycle B T1 T2 φ Address bus CS* (area A) CS* (area B) RD HWR Data bus Bus cycle A T1 T2 T3 Bus cycle B TI T1 T2
Long output floating time (a) Idle cycle not inserted (ICIS0 = 0)
Note: * The CS signal is generated externally rather than inside the LSI device.
Figure 7-17 Relationship between Chip Select (CS)* and Read (RD)
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7.6.2
Pin States During Idle Cycles
Table 7-5 shows the pin states during idle cycles. Table 7-5 Pin States During Idle Cycles
Pins A23 to A0 D15 to D0 AS RD HWR LWR Pin State Content identical to immediately following bus cycle High impedance High level High level High level High level
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7.7
Write Data Buffer Function
The chip has a write data buffer function in the external data bus. Using this function enables the write data buffer to be accessed in parallel. The write data buffer function is made available by setting the WDBE bit in BCRL to 1. Figure 7-18 shows an example of the timing when the write data buffer function is used. When this function is used, if an external write continues for 2 states or longer, and there is an internal access next, only an external write is executed in the first state, but from the next state onward an internal access (on-chip memory or internal I/O register read/write) is executed in parallel with the external write rather than waiting until it ends.
On-chip memory read Internal I/O register read
External write cycle T1 φ T2 TW TW T3
Internal address bus Internal memory Internal read signal Internal I/O register address
A23 to A0 External space write
External address
HWR, LWR
D15 to D0
Figure 7-18 Example of Timing when Write Data Buffer Function Is Used
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Section 7 Bus Controller
7.8
Bus Arbitration
Note: The H8S/2635 Group is not equipped with a DTC. 7.8.1 Overview
The chip has a bus arbiter that arbitrates bus master operations. There are two bus masters, the CPU and DTC which perform read/write operations when they have possession of the bus. Each bus master requests the bus by means of a bus request signal. The bus arbiter determines priorities at the prescribed timing, and permits use of the bus by means of a bus request acknowledge signal. The selected bus master then takes possession of the bus and begins its operation. 7.8.2 Operation
The bus arbiter detects the bus masters’ bus request signals, and if the bus is requested, sends a bus request acknowledge signal to the bus master making the request. If there are bus requests from more than one bus master, the bus request acknowledge signal is sent to the one with the highest priority. When a bus master receives the bus request acknowledge signal, it takes possession of the bus until that signal is canceled. The order of priority of the bus masters is as follows: (High) 7.8.3 DTC > CPU (Low)
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus master that has acquired the bus and is currently operating, the bus is not necessarily transferred immediately. There are specific times at which each bus master can relinquish the bus. CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC, the bus arbiter transfers the bus to the bus master that issued the request. The timing for transfer of the bus is as follows: • The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in discrete operations, as in the case of a longword-size access, the bus is not transferred between the operations. See appendix A.5, Bus States during Instruction Execution, for timings at which the bus is not transferred. • If the CPU is in sleep mode, it transfers the bus immediately.
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Section 7 Bus Controller
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated. The DTC can release the bus after a vector read, a register information read (3 states), a single data transfer, or a register information write (3 states). It does not release the bus during a register information read (3 states), a single data transfer, or a register information write (3 states).
7.9
Resets and the Bus Controller
In a reset, the chip, including the bus controller, enters the reset state at that point, and an executing bus cycle is discontinued.
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Section 8 Data Transfer Controller (DTC)
Section 8 Data Transfer Controller (DTC)
Note: The H8S/2635 Group is not equipped with a DTC.
8.1
Overview
The chip includes a data transfer controller (DTC). The DTC can be activated by an interrupt or software, to transfer data. 8.1.1 Features
• Transfer possible over any number of channels ⎯ Transfer information is stored in memory ⎯ One activation source can trigger a number of data transfers (chain transfer) • Wide range of transfer modes ⎯ Normal, repeat, and block transfer modes available ⎯ Incrementing, decrementing, and fixing of source and destination addresses can be selected • Direct specification of 16-Mbyte address space possible ⎯ 24-bit transfer source and destination addresses can be specified • Transfer can be set in byte or word units • A CPU interrupt can be requested for the interrupt that activated the DTC ⎯ An interrupt request can be issued to the CPU after one data transfer ends ⎯ An interrupt request can be issued to the CPU after the specified data transfers have completely ended • Activation by software is possible • Module stop mode can be set ⎯ The initial setting enables DTC registers to be accessed. DTC operation is halted by setting module stop mode.
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Section 8 Data Transfer Controller (DTC)
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8.1.2
Block Diagram
Figure 8-1 shows a block diagram of the DTC. The DTC’s register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to the on-chip RAM (1 kbyte), enabling 32-bit/1-state reading and writing of the DTC register information. Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1.
Internal address bus Interrupt controller DTC On-chip RAM
CPU interrupt request Legend: MRA, MRB: CRA, CRB: SAR: DAR: DTCERA to DTCERG: DTVECR:
DTC service request
DTC mode registers A and B DTC transfer count registers A and B DTC source address register DTC destination address register DTC enable registers A to G DTC vector register
Figure 8-1 Block Diagram of DTC
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MRA MRB CRA CRB DAR SAR
Interrupt request
Internal data bus
Register information
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DTCERA to DTCERG
Control logic
DTVECR
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Section 8 Data Transfer Controller (DTC)
8.1.3
Register Configuration
Table 8-1 summarizes the DTC registers. Table 8-1
Name DTC mode register A DTC mode register B DTC source address register DTC destination address register DTC transfer count register A DTC transfer count register B DTC enable registers DTC vector register Module stop control register A
DTC Registers
Abbreviation MRA MRB SAR DAR CRA CRB DTCER DTVECR MSTPCRA R/W —* 2 —* — *2
2 2
Initial Value Undefined Undefined Undefined Undefined Undefined Undefined H'00 H'00 H'3F
Address* —* 3 —* —* 3 —* —* 3 —*
3 3 3
1
—* 2 —* —*
2
R/W R/W R/W
H'FE16 to H'FE1C H'FE1F H'FDE8
Notes: 1. Lower 16 bits of the address. 2. Registers within the DTC cannot be read or written to directly. 3. Register information is located in on-chip RAM addresses H'EBC0 to H'EFBF. It cannot be located in external memory space. When the DTC is used, do not clear the RAME bit in SYSCR to 0.
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8.2
8.2.1
Bit
Register Descriptions
DTC Mode Register A (MRA)
: 7 SM1 * ⎯ 6 SM0 * ⎯ 5 DM1 * ⎯ 4 DM0 * ⎯ 3 MD1 * ⎯ 2 MD0 * ⎯ 1 DTS * ⎯ 0 Sz * ⎯ *: Undefined
Initial value : R/W :
MRA is an 8-bit register that controls the DTC operating mode. Bits 7 and 6—Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is to be incremented, decremented, or left fixed after a data transfer.
Bit 7 SM1 0 1 Bit 6 SM0 — 0 1 Description SAR is fixed SAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) SAR is decremented after a transfer (by –1 when Sz = 0; by –2 when Sz = 1)
Bits 5 and 4—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether DAR is to be incremented, decremented, or left fixed after a data transfer.
Bit 5 DM1 0 1 Bit 4 DM0 — 0 1 Description DAR is fixed DAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) DAR is decremented after a transfer (by –1 when Sz = 0; by –2 when Sz = 1)
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Section 8 Data Transfer Controller (DTC)
Bits 3 and 2—DTC Mode (MD1, MD0): These bits specify the DTC transfer mode.
Bit 3 MD1 0 1 Bit 2 MD0 0 1 0 1 Description Normal mode Repeat mode Block transfer mode —
Bit 1—DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination side is set to be a repeat area or block area, in repeat mode or block transfer mode.
Bit 1 DTS 0 1 Description Destination side is repeat area or block area Source side is repeat area or block area
Bit 0—DTC Data Transfer Size (Sz): Specifies the size of data to be transferred.
Bit 0 Sz 0 1 Description Byte-size transfer Word-size transfer
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8.2.2
Bit
DTC Mode Register B (MRB)
: 7 CHNE 6 DISEL * ⎯ 5 ⎯ * ⎯ 4 ⎯ * ⎯ 3 ⎯ * ⎯ 2 ⎯ * ⎯ 1 ⎯ * ⎯ 0 ⎯ * ⎯ *: Undefined
Initial value: R/W :
* ⎯
MRB is an 8-bit register that controls the DTC operating mode. Bit 7—DTC Chain Transfer Enable (CHNE): Specifies chain transfer. With chain transfer, a number of data transfers can be performed consecutively in response to a single transfer request. In data transfer with CHNE set to 1, determination of the end of the specified number of transfers, clearing of the interrupt source flag, and clearing of DTCER is not performed.
Bit 7 CHNE 0 1 Description End of DTC data transfer (activation waiting state is entered) DTC chain transfer (new register information is read, then data is transferred)
Bit 6—DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are disabled or enabled after a data transfer.
Bit 6 DISEL 0 1 Description After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 (the DTC clears the interrupt source flag of the activating interrupt to 0) After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the interrupt source flag of the activating interrupt to 0)
Bits 5 to 0—Reserved: These bits have no effect on DTC operation in the chip, and should always be written with 0.
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Section 8 Data Transfer Controller (DTC)
8.2.3
Bit
DTC Source Address Register (SAR)
: 23 * ⎯ 22 * ⎯ 21 * ⎯ 20 * ⎯ 19 * ⎯ 4 * ⎯ 3 * ⎯ 2 * ⎯ 1 * ⎯ 0 * ⎯
Initial value: R/W :
*: Undefined
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC. For word-size transfer, specify an even source address. 8.2.4
Bit
DTC Destination Address Register (DAR)
: 23 * ⎯ 22 * ⎯ 21 * ⎯ 20 * ⎯ 19 * ⎯ 4 * ⎯ 3 * ⎯ 2 * ⎯ 1 * ⎯ 0 * ⎯
Initial value : R/W :
*: Undefined
DAR is a 24-bit register that designates the destination address of data to be transferred by the DTC. For word-size transfer, specify an even destination address. 8.2.5
Bit
DTC Transfer Count Register A (CRA)
: 15 * ⎯ 14 * ⎯ 13 * ⎯ 12 * ⎯ 11 * ⎯ 10 * ⎯ 9 * ⎯ 8 * ⎯ 7 * ⎯ 6 * ⎯ 5 * ⎯ 4 * ⎯ 3 * ⎯ 2 * ⎯ 1 * ⎯ 0 * ⎯
Initial value: R/W :
CRAH
CRAL *: Undefined
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
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In normal mode, the entire CRA functions as a 16-bit transfer counter (1 to 65536). It is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000. In repeat mode or block transfer mode, the CRA is divided into two parts: the upper 8 bits (CRAH) and the lower 8 bits (CRAL). CRAH holds the number of transfers while CRAL functions as an 8-bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is transferred, and the contents of CRAH are sent when the count reaches H'00. This operation is repeated. 8.2.6
Bit
DTC Transfer Count Register B (CRB)
: 15 * ⎯ 14 * ⎯ 13 * ⎯ 12 * ⎯ 11 * ⎯ 10 * ⎯ 9 * ⎯ 8 * ⎯ 7 * ⎯ 6 * ⎯ 5 * ⎯ 4 * ⎯ 3 * ⎯ 2 * ⎯ 1 * ⎯ 0 * ⎯
Initial value: R/W :
*: Undefined
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000. 8.2.7
Bit
DTC Enable Registers (DTCER)
: 7 DTCE7 0 R/W 6 DTCE6 0 R/W 5 DTCE5 0 R/W 4 DTCE4 0 R/W 3 DTCE3 0 R/W 2 DTCE2 0 R/W 1 DTCE1 0 R/W 0 DTCE0 0 R/W
Initial value: R/W :
The DTC enable registers comprise seven 8-bit readable/writable registers, DTCERA to DTCERG with bits corresponding to the interrupt sources that can control enabling and disabling of DTC activation. These bits enable or disable DTC service for the corresponding interrupt sources. The DTC enable registers are initialized to H'00 by a reset and in hardware standby mode.
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Section 8 Data Transfer Controller (DTC)
Bit n—DTC Activation Enable (DTCEn)
Bit n DTCEn 0 Description DTC activation by this interrupt is disabled [Clearing conditions] • • 1 When the DISEL bit is 1 and the data transfer has ended When the specified number of transfers have ended (Initial value)
DTC activation by this interrupt is enabled [Holding condition] • When the DISEL bit is 0 and the specified number of transfers have not ended (n = 7 to 0)
A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence between interrupt sources and DTCE bits is shown in table 8-4, together with the vector number generated for each interrupt controller. For DTCE bit setting, use bit manipulation instructions such as BSET and BCLR for reading and writing. If all interrupts are masked, multiple activation sources can be set at one time by writing data after executing a dummy read on the relevant register. 8.2.8
Bit
DTC Vector Register (DTVECR)
: 7 0 R/(W)*1 6 0 R/W*2 5 0 R/W*2 4 0 R/W*2 3 0 R/W*2 2 0 R/W*2 1 0 R/W*2 0 0 R/W*2
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 Initial value: R/W :
Notes: 1. Only 1 can be written to the SWDTE bit. 2. Bits DTVEC6 to DTVEC0 can be written to when SWDTE = 0.
DTVECR is an 8-bit readable/writable register that enables or disables DTC activation by software, and sets a vector number for the software activation interrupt. DTVECR is initialized to H'00 by a reset and in hardware standby mode.
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Section 8 Data Transfer Controller (DTC)
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Bit 7—DTC Software Activation Enable (SWDTE): Enables or disables DTC activation by software.
Bit 7 SWDTE 0 Description DTC software activation is disabled [Clearing conditions] • • 1 When the DISEL bit is 0 and the specified number of transfers have not ended When 0 is written to the DISEL bit after a software-activated data transfer end interrupt (SWDTEND) request has been sent to the CPU (Initial value)
DTC software activation is enabled [Holding conditions] • • • When the DISEL bit is 1 and data transfer has ended When the specified number of transfers have ended During data transfer due to software activation
Bits 6 to 0—DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits specify a vector number for DTC software activation. The vector address is expressed as H'0400 + ((vector number) 4 clocks.
Figure 13-22 Example of Clocked Synchronous Transmission by DTC Operation in Case of Mode Transition • Transmission Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module stop mode, software standby mode, watch mode, subactive mode, or subsleep mode transition. TSR, TDR, and SSR are reset. The output pin states in module stop mode, software standby mode, watch mode, subactive mode, or subsleep mode depend on the port settings, and becomes high-level output after the relevant mode is cleared. If a transition is made during transmission, the data being transmitted will be undefined. When transmitting without changing the transmit mode after the relevant mode is cleared, transmission can be started by setting TE to 1 again, and performing the following sequence: SSR read -> TDR write -> TDRE clearance. To transmit with a different transmit mode after clearing the relevant mode, the procedure must be started again from initialization. Figure 13-23 shows a sample flowchart for mode transition during transmission. Port pin states are shown in figures 13-24 and 13-25. Operation should also be stopped (by clearing TE, TIE, and TEIE to 0) before making a transition from transmission by DTC* transfer to module stop mode, software standby mode, watch mode, subactive mode, or subsleep mode transition. To perform transmission with the DTC* after the relevant mode is cleared, setting TE and TIE to 1 will set the TXI flag and start DTC* transmission. Note: * The DTC is not implemented in the H8S/2635 Group.
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Section 13 Serial Communication Interface (SCI)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• Reception Receive operation should be stopped (by clearing RE to 0) before making a module stop mode, software standby mode, watch mode, subactive mode, or subsleep mode transition. RSR, RDR, and SSR are reset. If a transition is made without stopping operation, the data being received will be invalid. To continue receiving without changing the reception mode after the relevant mode is cleared, set RE to 1 before starting reception. To receive with a different receive mode, the procedure must be started again from initialization. Figure 13-26 shows a sample flowchart for mode transition during reception.
All data transmitted? Yes Read TEND flag in SSR
No
[1]
No TEND = 1 Yes TE = 0 [2]
[1] Data being transmitted is interrupted. After exiting software standby mode, etc., normal CPU transmission is possible by setting TE to 1, reading SSR, writing TDR, and clearing TDRE to 0, but note that if the DTC has been activated, the remaining data in DTCRAM will be transmitted when TE and TIE are set to 1. [2] If TIE and TEIE are set to 1, clear them to 0 in the same way.
Transition to software standby mode, etc. Exit from software standby mode, etc. Change operating mode? Yes Initialization
[3]
[3] Includes module stop mode, watch mode, subactive mode, and subsleep mode.
No
TE = 1
Figure 13-23 Sample Flowchart for Mode Transition during Transmission
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Section 13 Serial Communication Interface (SCI)
Start of transmission
End of transmission
Transition to software standby
Exit from software standby
TE bit
SCK output pin
Port input/output
TxD output pin
Port input/output Port
High output
Start SCI TxD output
Stop
Port input/output Port
High output SCI TxD output
Figure 13-24 Asynchronous Transmission Using Internal Clock
Transition to software standby Exit from software standby
Start of transmission
End of transmission
TE bit
SCK output pin
Port input/output
TxD output pin Port input/output Port
Marking output SCI TxD output
Last TxD bit held
Port input/output Port
High output* SCI TxD output
Note: * Initialized by software standby.
Figure 13-25 Synchronous Transmission Using Internal Clock
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Section 13 Serial Communication Interface (SCI)
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Read RDRF flag in SSR No [1] [1] Receive data being received becomes invalid.
RDRF = 1 Yes Read receive data in RDR
RE = 0
Transition to software standby mode, etc. Exit from software standby mode, etc. Change operating mode? Yes Initialization
[2]
[2] Includes module stop mode, watch mode, subactive mode, and subsleep mode.
No
RE = 1
Figure 13-26 Sample Flowchart for Mode Transition during Reception
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Section 13 Serial Communication Interface (SCI)
Switching from SCK Pin Function to Port Pin Function: • Problem in Operation: When switching the SCK pin function to the output port function (highlevel output) by making the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1 (synchronous mode), low-level output occurs for one half-cycle. 1. End of serial data transmission 2. TE bit = 0 3. C/A bit = 0 ... switchover to port output 4. Occurrence of low-level output (see figure 13-27)
Half-cycle low-level output SCK/port 1. End of transmission Data TE C/A CKE1 CKE0 Bit 6 Bit 7 2. TE = 0 4. Low-level output
3. C/A = 0
Figure 13-27 Operation when Switching from SCK Pin Function to Port Pin Function
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• Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an external circuit. With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings in the order shown. 1. End of serial data transmission 2. TE bit = 0 3. CKE1 bit = 1 4. C/A bit = 0 ... switchover to port output 5. CKE1 bit = 0
High-level output TE SCK/port 1. End of transmission Data TE C/A 3. CKE1 = 1 CKE1 CKE0 5. CKE1 = 0 Bit 6 Bit 7 2. TE = 0
4. C/A = 0
Figure 13-28 Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output)
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Section 14 Smart Card Interface
Section 14 Smart Card Interface
Note: The H8S/2635 Group is not equipped with a DTC.
14.1
Overview
SCI supports an IC card (Smart Card) interface conforming to ISO/IEC 7816-3 (Identification Card) as a serial communication interface extension function. Switching between the normal serial communication interface and the Smart Card interface is carried out by means of a register setting. 14.1.1 Features
Features of the Smart Card interface supported by the chip are as follows. • Asynchronous mode ⎯ Data length: 8 bits ⎯ Parity bit generation and checking ⎯ Transmission of error signal (parity error) in receive mode ⎯ Error signal detection and automatic data retransmission in transmit mode ⎯ Direct convention and inverse convention both supported • On-chip baud rate generator allows any bit rate to be selected • Three interrupt sources ⎯ Three interrupt sources (transmit data empty, receive data full, and transmit/receive error) that can issue requests independently ⎯ The transmit data empty interrupt and receive data full interrupt can activate the data transfer controller (DTC)* to execute data transfer Note: * The DTC is not implemented in the H8S/2635 Group.
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Section 14 Smart Card Interface
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14.1.2
Block Diagram
Figure 14-1 shows a block diagram of the Smart Card interface.
Bus interface
Module data bus
Internal data bus
RDR
TDR
RxD
RSR
TSR
SCMR SSR SCR SMR
Transmission/ reception control
BRR φ Baud rate generator φ/4 φ/16 φ/64 Clock
TxD
Parity generation Parity check
SCK TXI RXI ERI
Legend: SCMR: Smart Card mode register RSR: Receive shift register RDR: Receive data register TSR: Transmit shift register TDR: Transmit data register SMR: Serial mode register SCR: Serial control register SSR: Serial status register BRR: Bit rate register
Figure 14-1 Block Diagram of Smart Card Interface
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Section 14 Smart Card Interface
14.1.3
Pin Configuration
Table 14-1 shows the Smart Card interface pin configuration. Table 14-1 Smart Card Interface Pins
Channel 0 Pin Name Serial clock pin 0 Receive data pin 0 Transmit data pin 0 1 Serial clock pin 1 Receive data pin 1 Transmit data pin 1 2 Serial clock pin 2 Receive data pin 2 Transmit data pin 2 Symbol SCK0 RxD0 TxD0 SCK1 RxD1 TxD1 SCK2 RxD2 TxD2 I/O I/O Input Output I/O Input Output I/O Input Output Function SCI0 clock input/output SCI0 receive data input SCI0 transmit data output SCI1 clock input/output SCI1 receive data input SCI1 transmit data output SCI2 clock input/output SCI2 receive data input SCI2 transmit data output
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Section 14 Smart Card Interface
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14.1.4
Register Configuration
Table 14-2 shows the registers used by the Smart Card interface. Details of SMR, BRR, SCR, TDR, RDR, and MSTPCR are the same as for the normal SCI function: see the register descriptions in section 13, Serial Communication Interface (SCI). Table 14-2 Smart Card Interface Registers
Channel 0 Name Serial mode register 0 Bit rate register 0 Serial control register 0 Transmit data register 0 Serial status register 0 Receive data register 0 Smart card mode register 0 1 Serial mode register 1 Bit rate register 1 Serial control register 1 Transmit data register 1 Serial status register 1 Receive data register 1 Smart card mode register 1 2 Serial mode register 2 Bit rate register 2 Serial control register 2 Transmit data register 2 Serial status register 2 Receive data register 2 Smart card mode register 2 All Module stop control register B Abbreviation SMR0 BRR0 SCR0 TDR0 SSR0 RDR0 SCMR0 SMR1 BRR1 SCR1 TDR1 SSR1 RDR1 SCMR1 SMR2 BRR2 SCR2 TDR2 SSR2 RDR2 SCMR2 MSTPCRB R/W R/W R/W R/W R/W R/(W) R R/W R/W R/W R/W R/W R/(W) R R/W R/W R/W R/W R/W *2 *2 Initial Value H'00 H'FF H'00 H'FF H'84 H'00 H'F2 H'00 H'FF H'00 H'FF H'84 H'00 H'F2 H'00 H'FF H'00 Address* H'FF78 H'FF79 H'FF7A H'FF7B H'FF7C H'FF7D H'FF7E H'FF80 H'FF81 H'FF82 H'FF83 H'FF84 H'FF85 H'FF86 H'FF88 H'FF89 H'FF8A H'FF8B H'FF8C H'FF8D H'FF8E H'FDE9
1
H'FF *2 H'84 R/(W) R R/W R/W H'00 H'F2 H'FF
Notes: 1. Lower 16 bits of the address. 2. Can only be written with 0 for flag clearing.
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Section 14 Smart Card Interface
14.2
Register Descriptions
Registers added with the Smart Card interface and bits for which the function changes are described here. 14.2.1
Bit
Smart Card Mode Register (SCMR)
: 7 — 1 — 6 — 1 — 5 — 1 — 4 — 1 — 3 SDIR 0 R/W 2 SINV 0 R/W 1 — 1 — 0 SMIF 0 R/W
Initial value : R/W :
SCMR is an 8-bit readable/writable register that selects the Smart Card interface function. SCMR is initialized to H'F2 by a reset and in standby mode. Bits 7 to 4—Reserved: These bits are always read as 1 and cannot be modified. Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format.
Bit 3 SDIR 0 1 Description TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first (Initial value)
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Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This function is used together with the SDIR bit for communication with an inverse convention card. The SINV bit does not affect the logic level of the parity bit. For parity-related setting procedures, see section 14.3.4, Register Settings.
Bit 2 SINV 0 1 Description TDR contents are transmitted as they are Receive data is stored as it is in RDR TDR contents are inverted before being transmitted Receive data is stored in inverted form in RDR (Initial value)
Bit 1—Reserved: This bit is always read as 1 and cannot be modified. Bit 0—Smart Card Interface Mode Select (SMIF): Enables or disables the Smart Card interface function.
Bit 0 SMIF 0 1 Description Smart Card interface function is disabled Smart Card interface function is enabled (Initial value)
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14.2.2
Bit
Serial Status Register (SSR)
: 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W
Initial value : R/W :
Note: * Only 0 can be written, to clear these flags.
Bit 4 of SSR has a different function in Smart Card interface mode. Coupled with this, the setting conditions for bit 2, TEND, are also different. Bits 7 to 5—Operate in the same way as for the normal SCI. For details, see section 13.2.7, Serial Status Register (SSR). Bit 4—Error Signal Status (ERS): In Smart Card interface mode, bit 4 indicates the status of the error signal sent back from the receiving end in transmission. Framing errors are not detected in Smart Card interface mode.
Bit 4 ERS 0 Description Normal reception, with no error signal [Clearing conditions] • • 1 Upon reset, and in standby mode or module stop mode When 0 is written to ERS after reading ERS = 1 (Initial value)
Error signal sent from receiver indicating detection of parity error [Setting condition] • When the Low level of the error signal is sampled
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its previous state.
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Bits 3 to 0—Operate in the same way as for the normal SCI. For details, see section 13.2.7, Serial Status Register (SSR). However, the setting conditions for the TEND bit, are as shown below.
Bit 2 TEND 0 Description Transmission is in progress [Clearing conditions] • • 1 When 0 is written to TDRE after reading TDRE = 1 When the DTC is activated by a TXI interrupt and write data to TDR (Initial value)
Transmission has ended [Setting conditions] • • • • • • Upon reset, and in standby mode or module stop mode When the TE bit in SCR is 0 and the ERS bit is also 0
When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1
Note: etu: Elementary time unit (time for transfer of 1 bit)
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14.2.3
Bit
Serial Mode Register (SMR)
: 7 GM 0 R/W 6 BLK 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 BCP1 0 R/W 2 BCP0 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Initial value : R/W :
Note: When the smart card interface is used, be sure to make the 1 setting shown for bit 5.
The function of bits 7, 6, 3, and 2 of SMR changes in Smart Card interface mode. Bit 7—GSM Mode (GM): Sets the smart card interface function to GSM mode. This bit is cleared to 0 when the normal smart card interface is used. In GSM mode, this bit is set to 1, the timing of setting of the TEND flag that indicates transmission completion is advanced and clock output control mode addition is performed. The contents of the clock output control mode addition are specified by bits 1 and 0 of the serial control register (SCR).
Bit 7 GM 0 Description Normal smart card interface mode operation • • 1 • • (Initial value)
TEND flag generation 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit Clock output ON/OFF control only TEND flag generation 11.0 etu after beginning of start bit High/Low fixing control possible in addition to clock output ON/OFF control (set by SCR)
GSM mode smart card interface mode operation
Note: etu: Elementary time unit (time for transfer of 1 bit)
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Bit 6—Block Transfer Mode (BLK): Selects block transfer mode.
Bit 6 BLK 0 Description Normal Smart Card interface mode operation • • • 1 • • • Error signal transmission/detection and automatic data retransmission performed TXI interrupt generated by TEND flag TEND flag set 12.5 etu after start of transmission (11.0 etu in GSM mode) Error signal transmission/detection and automatic data retransmission not performed TXI interrupt generated by TDRE flag TEND flag set 11.5 etu after start of transmission (11.0 etu in GSM mode)
Block transfer mode operation
Note: etu: Elementary time unit (time for transfer of 1 bit)
Bits 3 and 2—Basic Clock Pulse 1 and 2 (BCP1, BCP0): These bits specify the number of basic clock periods in a 1-bit transfer interval on the Smart Card interface.
Bit 3 BCP1 0 1 Bit 2 BCP0 0 1 0 1 Description 32 clock periods 64 clock periods 372 clock periods 256 clock periods (Initial value)
Bits 5, 4, 1, and 0: Operate in the same way as for the normal SCI. For details, see section 13.2.5, Serial Mode Register (SMR).
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14.2.4
Bit
Serial Control Register (SCR)
: 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W
Initial value : R/W :
In smart card interface mode, the function of bits 1 and 0 of SCR changes when bit 7 of the serial mode register (SMR) is set to 1. Bits 7 to 2—Operate in the same way as for the normal SCI. For details, see section 13.2.6, Serial Control Register (SCR). Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock source and enable or disable clock output from the SCK pin. In smart card interface mode, in addition to the normal switching between clock output enabling and disabling, the clock output can be specified as to be fixed high or low.
SCMR SMIF 0 1 1 1 1 1 1 SMR C/A, GM See the SCI 0 0 1 1 1 1 0 0 0 0 1 1 0 1 0 1 0 1 Operates as port I/O pin Outputs clock as SCK output pin Operates as SCK output pin, with output fixed low Outputs clock as SCK output pin Operates as SCK output pin, with output fixed high Outputs clock as SCK output pin SCR Setting CKE1 CKE0 SCK Pin Function
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14.3
14.3.1
Operation
Overview
The main functions of the Smart Card interface are as follows. • One frame consists of 8-bit data plus a parity bit. • In transmission, a guard time of at least 2 etu (Elementary time unit: the time for transfer of 1 bit) is left between the end of the parity bit and the start of the next frame. • If a parity error is detected during reception, a low error signal level is output for one etu period, 10.5 etu after the start bit. • If the error signal is sampled during transmission, the same data is transmitted automatically after the elapse of 2 etu or longer (except in block transfer mode). • Only asynchronous communication is supported; there is no clocked synchronous communication function. Note: etu: Elementary time unit (time for transfer of 1 bit) 14.3.2 Pin Connections
Figure 14-2 shows a schematic diagram of Smart Card interface related pin connections. In communication with an IC card, since both transmission and reception are carried out on a single data transmission line, the TxD pin and RxD pin should be connected with the LSI pin. The data transmission line should be pulled up to the VCC power supply with a resistor. When the clock generated on the Smart Card interface is used by an IC card, the SCK pin output is input to the CLK pin of the IC card. No connection is needed if the IC card uses an internal clock. LSI port output is used as the reset signal. Other pins must normally be connected to the power supply or ground.
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VCC TxD I/O RxD SCK Rx (port) Chip Connected equipment Data line Clock line Reset line CLK RST IC card
Figure 14-2 Schematic Diagram of Smart Card Interface Pin Connections Note: If an IC card is not connected, and the TE and RE bits are both set to 1, closed transmission/reception is possible, enabling self-diagnosis to be carried out.
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14.3.3
Data Format
Normal Transfer Mode: Figure 14-3 shows the normal Smart Card interface data format. In reception in this mode, a parity check is carried out on each frame, and if an error is detected an error signal is sent back to the transmitting end, and retransmission of the data is requested. If an error signal is sampled during transmission, the same data is retransmitted.
When there is no parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Transmitting station output
When a parity error occurs Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Transmitting station output Receiving station output Start bit Data bits Parity bit Error signal
Legend: Ds: D0 to D7: Dp: DE:
Figure 14-3 Normal Smart Card Interface Data Format The operation sequence is as follows. [1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor. [2] The transmitting station starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). [3] With the Smart Card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor.
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[4] The receiving station carries out a parity check. If there is no parity error and the data is received normally, the receiving station waits for reception of the next data. If a parity error occurs, however, the receiving station outputs an error signal (DE, low-level) to request retransmission of the data. After outputting the error signal for the prescribed length of time, the receiving station places the signal line in the high-impedance state again. The signal line is pulled high again by a pull-up resistor. [5] If the transmitting station does not receive an error signal, it proceeds to transmit the next data frame. If it does receive an error signal, however, it returns to step [2] and retransmits the erroneous data. Block Transfer Mode: The operation sequence in block transfer mode is as follows. [1] When the data line in not in use it is in the high-impedance state, and is fixed high with a pullup resistor. [2] The transmitting station starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). [3] With the Smart Card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor. [4] After reception, a parity error check is carried out, but an error signal is not output even if an error has occurred. When an error occurs reception cannot be continued, so the error flag should be cleared to 0 before the parity bit of the next frame is received. [5] The transmitting station proceeds to transmit the next data frame.
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14.3.4
Register Settings
Table 14-3 shows a bit map of the registers used by the smart card interface. Bits indicated as 0 or 1 must be set to the value shown. The setting of other bits is described below. Table 14-3 Smart Card Interface Register Settings
Bit Register SMR BRR SCR TDR SSR RDR SCMR Bit 7 GM BRR7 TIE TDR7 TDRE RDR7 — Bit 6 BLK BRR6 RIE TDR6 RDRF RDR6 — Bit 5 1 BRR5 TE TDR5 ORER RDR5 — Bit 4 O/E BRR4 RE TDR4 ERS RDR4 — Bit 3 BCP1 BRR3 0 TDR3 PER RDR3 SDIR Bit 2 BCP0 BRR2 0 TDR2 TEND RDR2 SINV Bit 1 CKS1 BRR1 CKE1* TDR1 0 RDR1 — Bit 0 CKS0 BRR0 CKE0 TDR0 0 RDR0 SMIF
Notes: —: Unused bit. *: The CKE1 bit must be cleared to 0 when the GM bit in SMR is cleared to 0.
SMR Setting: The GM bit is cleared to 0 in normal smart card interface mode, and set to 1 in GSM mode. The O/E bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. Bits CKS1 and CKS0 select the clock source of the on-chip baud rate generator. Bits BCP1 and BCP0 select the number of basic clock periods in a 1-bit transfer interval. For details, see section 14.3.5, Clock. The BLK bit is cleared to 0 in normal smart card interface mode, and set to 1 in block transfer mode. BRR Setting: BRR is used to set the bit rate. See section 14.3.5, Clock, for the method of calculating the value to be set. SCR Setting: The function of the TIE, RIE, TE, and RE bits is the same as for the normal SCI. For details, see section 13, Serial Communication Interface (SCI). Bits CKE1 and CKE0 specify the clock output. When the GM bit in SMR is cleared to 0, set these bits to B'00 if a clock is not to be output, or to B'01 if a clock is to be output. When the GM bit in SMR is set to 1, clock output is performed. The clock output can also be fixed high or low.
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Smart Card Mode Register (SCMR) Setting: The SDIR bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. The SINV bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the inverse convention type. The SMIF bit is set to 1 in the case of the Smart Card interface. Examples of register settings and the waveform of the start character are shown below for the two types of IC card (direct convention and inverse convention). • Direct convention (SDIR = SINV = O/E = 0)
(Z) A Ds Z D0 Z D1 A D2 Z D3 Z D4 Z D5 A D6 A D7 Z Dp (Z) State
With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order. The start character data above is H'3B. The parity bit is 1 since even parity is stipulated for the Smart Card. • Inverse convention (SDIR = SINV = O/E = 1)
(Z) A Ds Z D7 Z D6 A D5 A D4 A D3 A D2 A D1 A D0 Z Dp (Z) State
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to state Z, and transfer is performed in MSB-first order. The start character data above is H'3F. The parity bit is 0, corresponding to state Z, since even parity is stipulated for the Smart Card. With the H8S/2636, H8S/2638, H8S/2639, and H8S/2630 inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit inversion, the O/E bit in SMR is set to odd parity mode (the same applies to both transmission and reception).
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14.3.5
Clock
Only an internal clock generated by the on-chip baud rate generator can be used as the transmit/receive clock for the smart card interface. The bit rate is set with BRR and the CKS1, CKS0, BCP1 and BCP0 bits in SMR. The formula for calculating the bit rate is as shown below. Table 14-5 shows some sample bit rates. If clock output is selected by setting CKE0 to 1, a clock is output from the SCK pin. The clock frequency is determined by the bit rate and the setting of bits BCP1 and BCP0. B= φ S×2
2n+1
× (N + 1)
× 10 6
Where: N = Value set in BRR (0 ≤ N ≤ 255) B = Bit rate (bit/s) φ = Operating frequency (MHz) n = See table 14-4 S = Number of internal clocks in 1-bit period, set by BCP1 and BCP0 Table 14-4 Correspondence between n and CKS1, CKS0
n 0 1 2 3 1 CKS1 0 CKS0 0 1 0 1
Table 14-5 Examples of Bit Rate B (bit/s) for Various BRR Settings (When n = 0 and S = 372)
φ (MHz) N 0 1 2 10.00 13441 6720 4480 10.714 14400 7200 4800 13.00 17473 8737 5824 14.285 19200 9600 6400 16.00 21505 10753 7168 18.00 24194 12097 8065 20.00 26882 13441 8961
Note: Bit rates are rounded to the nearest whole number.
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The method of calculating the value to be set in the bit rate register (BRR) from the operating frequency and bit rate, on the other hand, is shown below. N is an integer, 0 ≤ N ≤ 255, and the smaller error is specified. N= φ S×2
2n+1
×B
× 10 6 – 1
Table 14-6 Examples of BRR Settings for Bit Rate B (bit/s) (When n = 0 and S = 372)
φ (MHz) 7.1424 bit/s 9600 N 0 Error 0.00 N 1 10.00 Error 30 10.7136 N 1 Error 25 N 1 13.00 Error 8.99 14.2848 N 1 Error 0.00 N 1 16.00 Error 12.01 N 2 18.00 Error 15.99 N 2 20.00 Error 6.60
Note: A blank means no setting is available.
Table 14-7 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode) (when S = 372)
φ (MHz) 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 Maximum Bit Rate (bit/s) 9600 13441 14400 17473 19200 21505 24194 26882 N 0 0 0 0 0 0 0 0 n 0 0 0 0 0 0 0 0
The bit rate error is given by the following formula: Error (%) = ( φ S×2
2n+1
× B × (N + 1)
× 106 – 1) × 100
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14.3.6
Data Transfer Operations
Initialization: Before transmitting and receiving data, initialize the SCI as described below. Initialization is also necessary when switching from transmit mode to receive mode, or vice versa. [1] Clear the TE and RE bits in SCR to 0. [2] Clear the error flags ERS, PER, and ORER in SSR to 0. [3] Set the GM, BLK, O/E, BCP1, BCP0, CKS1, CKS0 bits in SMR. Set the PE bit to 1. [4] Set the SMIF, SDIR, and SINV bits in SCMR. When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins, and are placed in the high-impedance state. [5] Set the value corresponding to the bit rate in BRR. [6] Set the CKE0 and CKE1 bits in SCR. Clear the TIE, RIE, TE, RE, MPIE, and TEIE bits to 0. If the CKE0 bit is set to 1, the clock is output from the SCK pin. [7] Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE bit and RE bit at the same time, except for self-diagnosis.
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Serial Data Transmission (Except Block Transfer Mode): As data transmission in smart card mode involves error signal sampling and retransmission processing, the processing procedure is different from that for the normal SCI. Figure 14-4 shows a flowchart for transmitting, and figure 14-5 shows the relation between a transmit operation and the internal registers. [1] Perform Smart Card interface mode initialization as described above in initialization. [2] Check that the ERS error flag in SSR is cleared to 0. [3] Repeat steps [2] and [3] until it can be confirmed that the TEND flag in SSR is set to 1. [4] Write the transmit data to TDR, clear the TDRE flag to 0, and perform the transmit operation. The TEND flag is cleared to 0. [5] When transmitting data continuously, go back to step [2]. [6] To end transmission, clear the TE bit to 0. With the above processing, interrupt servicing or data transfer by the DTC is possible. If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt requests are enabled, a transmit data empty interrupt (TXI) request will be generated. If an error occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a transfer error interrupt (ERI) request will be generated. The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag set timing is shown in figure 14-6. If the DTC* is activated by a TXI request, the number of bytes set in the DTC* can be transmitted automatically, including automatic retransmission. For details, see Interrupt Operation and Data Transfer Operation by DTC below. Notes: For block transfer mode, see section 13.3.2, Operation in Asynchronous Mode. * The DTC is not implemented in the H8S/2635 Group.
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Start Initialization Start transmission
ERS = 0? Yes
No
Error processing No TEND = 1? Yes Write data to TDR, and clear TDRE flag in SSR to 0 No
All data transmitted? Yes No ERS = 0? Yes Error processing
No TEND = 1? Yes Clear TE bit to 0
End
Figure 14-4 Example of Transmission Processing Flow
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TDR (1) Data write (2) Transfer from TDR to TSR (3) Serial data output Data 1 Data 1 Data 1
TSR (shift register)
Data 1
; Data remains in TDR Data 1 I/O signal line output
In case of normal transmission: TEND flag is set In case of transmit error: ERS flag is set Steps (2) and (3) above are repeated until the TEND flag is set Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has been completed.
Figure 14-5 Relation Between Transmit Operation and Internal Registers
I/O data TXI (TEND interrupt) When GM = 0
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
DE Guard time
12.5 etu
When GM = 1
11.0 etu
Legend: Ds: D0 to D7: Dp: DE:
Start bit Data bits Parity bit Error signal
Note: etu: Elementary time unit (time for transfer of 1 bit)
Figure 14-6 TEND Flag Generation Timing in Transmission Operation
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Serial Data Reception (Except Block Transfer Mode): Data reception in Smart Card mode uses the same processing procedure as for the normal SCI. Figure 14-7 shows an example of the transmission processing flow. [1] Perform Smart Card interface mode initialization as described above in Initialization. [2] Check that the ORER flag and PER flag in SSR are cleared to 0. If either is set, perform the appropriate receive error processing, then clear both the ORER and the PER flag to 0. [3] Repeat steps [2] and [3] until it can be confirmed that the RDRF flag is set to 1. [4] Read the receive data from RDR. [5] When receiving data continuously, clear the RDRF flag to 0 and go back to step [2]. [6] To end reception, clear the RE bit to 0.
Start Initialization Start reception
ORER = 0 and PER = 0 Yes
No
Error processing No RDRF = 1? Yes Read RDR and clear RDRF flag in SSR to 0
No
All data received? Yes Clear RE bit to 0
Figure 14-7 Example of Reception Processing Flow
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With the above processing, interrupt servicing or data transfer by the DTC* is possible. If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a receive data full interrupt (RXI) request will be generated. If an error occurs in reception and either the ORER flag or the PER flag is set to 1, a transfer error interrupt (ERI) request will be generated. If the DTC* is activated by an RXI request, the receive data in which the error occurred is skipped, and only the number of bytes of receive data set in the DTC* are transferred. For details, see Interrupt Operation and Data Transfer Operation by DTC* followings. If a parity error occurs during reception and the PER is set to 1, the received data is still transferred to RDR, and therefore this data can be read. Notes: For block transfer mode, see section 13.3.2, Operation in Asynchronous Mode. * The DTC is not implemented in the H8S/2635 Group. Mode Switching Operation: When switching from receive mode to transmit mode, first confirm that the receive operation has been completed, then start from initialization, clearing RE bit to 0 and setting TE bit to 1. The RDRF flag or the PER and ORER flags can be used to check that the receive operation has been completed. When switching from transmit mode to receive mode, first confirm that the transmit operation has been completed, then start from initialization, clearing TE bit to 0 and setting RE bit to 1. The TEND flag can be used to check that the transmit operation has been completed. Fixing Clock Output Level: When the GM bit in SMR is set to 1, the clock output level can be fixed with bits CKE1 and CKE0 in SCR. At this time, the minimum clock pulse width can be made the specified width. Figure 14-8 shows the timing for fixing the clock output level. In this example, GSM is set to 1, CKE1 is cleared to 0, and the CKE0 bit is controlled.
Specified pulse width Specified pulse width
SCK
SCR write (CKE0 = 0)
SCR write (CKE0 = 1)
Figure 14-8 Timing for Fixing Clock Output Level
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Interrupt Operation (Except Block Transfer Mode): There are three interrupt sources in smart card interface mode: transmit data empty interrupt (TXI) requests, transfer error interrupt (ERI) requests, and receive data full interrupt (RXI) requests. The transmit end interrupt (TEI) request is not used in this mode. When the TEND flag in SSR is set to 1, a TXI interrupt request is generated. When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When any of flags ORER, PER, and ERS in SSR is set to 1, an ERI interrupt request is generated. The relationship between the operating states and interrupt sources is shown in table 14-8. Note: For block transfer mode, see section 13.4, SCI Interrupts. Table 14-8 Smart Card Mode Operating States and Interrupt Sources
Operating State Transmit Mode Normal operation Error Receive Mode Normal operation Error Flag TEND ERS RDRF PER, ORER Enable Bit TIE RIE RIE RIE Interrupt Source TXI ERI RXI ERI DTC Activation Possible Not possible Possible Not possible
Data Transfer Operation by DTC*: In smart card mode, as with the normal SCI, transfer can be carried out using the DTC. In a transmit operation, the TDRE flag is also set to 1 at the same time as the TEND flag in SSR, and a TXI interrupt is generated. If the TXI request is designated beforehand as a DTC activation source, the DTC will be activated by the TXI request, and transfer of the transmit data will be carried out. The TDRE and TEND flags are automatically cleared to 0 when data transfer is performed by the DTC. In the event of an error, the SCI retransmits the same data automatically. During this period, TEND remains cleared to 0 and the DTC is not activated. Therefore, the SCI and DTC will automatically transmit the specified number of bytes, including retransmission in the event of an error. However, the ERS flag is not cleared automatically when an error occurs, and so the RIE bit should be set to 1 beforehand so that an ERI request will be generated in the event of an error, and the ERS flag will be cleared. When performing transfer using the DTC, it is essential to set and enable the DTC before carrying out SCI setting. For details of the DTC setting procedures, see section 8, Data Transfer Controller (DTC).
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Section 14 Smart Card Interface
In a receive operation, an RXI interrupt request is generated when the RDRF flag in SSR is set to 1. If the RXI request is designated beforehand as a DTC activation source, the DTC will be activated by the RXI request, and transfer of the receive data will be carried out. The RDRF flag is cleared to 0 automatically when data transfer is performed by the DTC. If an error occurs, an error flag is set but the RDRF flag is not. Consequently, the DTC is not activated, but instead, an ERI interrupt request is sent to the CPU. Therefore, the error flag should be cleared. Notes: For block transfer mode, see section 13.4, SCI Interrupts. * The DTC is not implemented in the H8S/2635 Group. 14.3.7 Operation in GSM Mode
Switching the Mode: When switching between smart card interface mode and software standby mode, the following switching procedure should be followed in order to maintain the clock duty. • When changing from smart card interface mode to software standby mode [1] Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin to the value for the fixed output state in software standby mode. [2] Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt transmit/receive operation. At the same time, set the CKE1 bit to the value for the fixed output state in software standby mode. [3] Write 0 to the CKE0 bit in SCR to halt the clock. [4] Wait for one serial clock period. During this interval, clock output is fixed at the specified level, with the duty preserved. [5] Make the transition to the software standby state. • When returning to smart card interface mode from software standby mode [6] Exit the software standby state. [7] Write 1 to the CKE0 bit in SCR and output the clock. Signal generation is started with the normal duty.
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Normal operation
Software standby
Normal operation
[1] [2] [3]
[4] [5]
[6] [7]
Figure 14-9 Clock Halt and Restart Procedure Powering On: To secure the clock duty from power-on, the following switching procedure should be followed. [1] The initial state is port input and high impedance. Use a pull-up resistor or pull-down resistor to fix the potential. [2] Fix the SCK pin to the specified output level with the CKE1 bit in SCR. [3] Set SMR and SCMR, and switch to smart card mode operation. [4] Set the CKE0 bit in SCR to 1 to start clock output. 14.3.8 Operation in Block Transfer Mode
Operation in block transfer mode is the same as in SCI asynchronous mode, except for the following points. For details, see section 13.3.2, Operation in Asynchronous Mode. Data Format: The data format is 8 bits with parity. There is no stop bit, but there is a 2-bit (1-bit or more in reception) error guard time. Also, except during transmission (with start bit, data bits, and parity bit), the transmission pins go to the high-impedance state, so the signal lines must be fixed high with a pull-up resistor. Transmit/Receive Clock: Only an internal clock generated by the on-chip baud rate generator can be used as the transmit/receive clock. The number of basic clock periods in a 1-bit transfer interval can be set to 32, 64, 372, or 256 with bits BCP1 and BCP0. For details, see section 14.3.5, Clock. ERS (FER) Flag: As with the normal Smart Card interface, the ERS flag indicates the error signal status, but since error signal transmission and reception is not performed, this flag is always cleared to 0.
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Section 14 Smart Card Interface
14.4
Usage Notes
The following points should be noted when using the SCI as a Smart Card interface. Receive Data Sampling Timing and Reception Margin in Smart Card Interface Mode: In Smart Card interface mode, the SCI operates on a basic clock with a frequency of 32, 64, 372, or 256 times the transfer rate (as determined by bits BCP1 and BCP0). In reception, the SCI samples the falling edge of the start bit using the basic clock, and performs internal synchronization. Receive data is latched internally at the rising edge of the 16th, 32nd, 186th, or 128th pulse of the basic clock. Figure 14-10 shows the receive data sampling timing when using a clock of 372 times the transfer rate.
372 clocks 186 clocks 0 185 371 0 185 371 0
Internal basic clock
Receive data (RxD)
Start bit
D0
D1
Synchronization sampling timing
Data sampling timing
Figure 14-10 Receive Data Sampling Timing in Smart Card Mode (Using Clock of 372 Times the Transfer Rate)
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Thus the reception margin in asynchronous mode is given by the following formula. Formula for reception margin in smart card interface mode M =⎥ (0.5 – 1 2N ) – (L – 0.5) F – ⎥ D – 0.5⎥ N (1 + F)⎥ × 100%
Where M: Reception margin (%) N: Ratio of bit rate to clock (N = 32, 64, 372, and 256) D: Clock duty (D = 0 to 1.0) L: Frame length (L = 10) F: Absolute value of clock frequency deviation Assuming values of F = 0, D = 0.5 and N = 372 in the above formula, the reception margin formula is as follows. When D = 0.5 and F = 0, M = (0.5 – 1/2 × 372) × 100% = 49.866%
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Section 14 Smart Card Interface
Retransfer Operations (Except Block Transfer Mode): Retransfer operations are performed by the SCI in receive mode and transmit mode as described below. • Retransfer operation when SCI is in receive mode Figure 14-11 illustrates the retransfer operation when the SCI is in receive mode. [1] If an error is found when the received parity bit is checked, the PER bit in SSR is automatically set to 1. If the RIE bit in SCR is enabled at this time, an ERI interrupt request is generated. The PER bit in SSR should be kept cleared to 0 until the next parity bit is sampled. [2] The RDRF bit in SSR is not set for a frame in which an error has occurred. [3] If no error is found when the received parity bit is checked, the PER bit in SSR is not set to 1. [4] If no error is found when the received parity bit is checked, the receive operation is judged to have been completed normally, and the RDRF flag in SSR is automatically set to 1. If the RIE bit in SCR is enabled at this time, an RXI interrupt request is generated. If DTC* data transfer by an RXI source is enabled, the contents of RDR can be read automatically. When the RDR data is read by the DTC*, the RDRF flag is automatically cleared to 0. [5] When a normal frame is received, the pin retains the high-impedance state at the timing for error signal transmission. Note: * The DTC is not implemented in the H8S/2635 Group.
nth transfer frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE RDRF [2] PER [1] [3] [4] Retransferred frame Transfer frame n + 1
(DE) Ds D0 D1 D2 D3 D4 Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Figure 14-11 Retransfer Operation in SCI Receive Mode • Retransfer operation when SCI is in transmit mode Figure 14-12 illustrates the retransfer operation when the SCI is in transmit mode. [6] If an error signal is sent back from the receiving end after transmission of one frame is completed, the ERS bit in SSR is set to 1. If the RIE bit in SCR is enabled at this time, an ERI
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interrupt request is generated. The ERS bit in SSR should be kept cleared to 0 until the next parity bit is sampled. [7] The TEND bit in SSR is not set for a frame for which an error signal indicating an abnormality is received. [8] If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set. [9] If an error signal is not sent back from the receiving end, transmission of one frame, including a retransfer, is judged to have been completed, and the TEND bit in SSR is set to 1. If the TIE bit in SCR is enabled at this time, a TXI interrupt request is generated. If data transfer by the DTC* by means of the TXI source is enabled, the next data can be written to TDR automatically. When data is written to TDR by the DTC*, the TDRE bit is automatically cleared to 0. Note: * The DTC is not implemented in the H8S/2635 Group.
nth transfer frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE TDRE Transfer to TSR from TDR TEND [7] FER/ERS [6] [8] [9] Transfer to TSR from TDR Transfer to TSR from TDR Retransferred frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Transfer frame n + 1 Ds D0 D1 D2 D3 D4
Figure 14-12 Retransfer Operation in SCI Transmit Mode
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Section 15 I2C Bus Interface [Option] (Only for the H8S/2638, H8S/2639, and H8S/2630)
A two-channel I2C bus interface is available as an option in the H8S/2638, H8S/2639, and H8S/2630 (the product equipped with the I2C bus interface is the W-mask version). Observe the following notes when using this option. A “W” is added to the part number in products in which this optional function is used. Examples: HD64F2638WF* Note: * When the optional function is used in a U-mask version, “U” is replaced with “W”. Example: HD64F2638UF → HD64F2638WF
15.1
Overview
A two-channel I2C bus interface is available for the H8S/2638, H8S/2639, and H8S/2630 as an option. The I2C bus interface conforms to and provides a subset of the Philips I2C bus (inter-IC bus) interface functions. The register configuration that controls the I2C bus differs partly from the Philips configuration, however. Each I2C bus interface channel uses only one data line (SDA) and one clock line (SCL) to transfer data, saving board and connector space. 15.1.1 Features
• Selection of addressing format or non-addressing format ⎯ I2C bus format: addressing format with acknowledge bit, for master/slave operation ⎯ Serial format: non-addressing format without acknowledge bit, for master operation only • Conforms to Philips I2C bus interface (I2C bus format) • Two ways of setting slave address (I2C bus format) • Start and stop conditions generated automatically in master mode (I2C bus format) • Selection of acknowledge output levels when receiving (I2C bus format) • Automatic loading of acknowledge bit when transmitting (I2C bus format) • Wait function in master mode (I2C bus format) ⎯ A wait can be inserted by driving the SCL pin low after data transfer, excluding acknowledgement. The wait can be cleared by clearing the interrupt flag.
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• Wait function in slave mode (I2C bus format) ⎯ A wait request can be generated by driving the SCL pin low after data transfer, excluding acknowledgement. The wait request is cleared when the next transfer becomes possible. • Three interrupt sources ⎯ Data transfer end (including transmission mode transition with I2C bus format and address reception after loss of master arbitration) ⎯ Address match: when any slave address matches or the general call address is received in slave receive mode (I2C bus format) ⎯ Stop condition detection • Selection of 16 internal clocks (in master mode) • Direct bus drive (with SCL and SDA pins) ⎯ Two pins—P35/SCL0 and P34/SDA0—(normally NMOS push-pull outputs) function as NMOS open-drain outputs when the bus drive function is selected. ⎯ Two pins—P33/SCL1 and P32/SDA1—(normally CMOS pins) function as NMOS-only outputs when the bus drive function is selected. 15.1.2 Block Diagram
Figure 15-1 shows a block diagram of the I2C bus interface. Figure 15-2 shows an example of I/O pin connections to external circuits. Channel 0 I/O pins are NMOS open drains, and it is possible to apply voltages in excess of the power supply (VCC) voltage for this LSI. Set the upper limit of voltage applied to the power supply (VCC) power supply range + 0.3 V, i.e. 5.8 V. Channel 1 I/O pins are driven solely by NMOS, so in terms of appearance they carry out the same operations as an NMOS open drain. However, the voltage which can be applied to the I/O pins depends on the voltage of the power supply (VCC) of this LSI.
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φ SCL
PS ICCR Clock control Noise canceler Bus state decision circuit Arbitration decision circuit ICMR
ICSR
ICDRT
SDA
Output data control circuit
ICDRS
ICDRR Noise canceler Address comparator
SAR, SARX
Legend: ICCR: I2C bus control register ICMR: I2C bus mode register ICSR: I2C bus status register ICDR: I2C bus data register SAR: Slave address register SARX: Second slave address register X Prescaler PS:
Interrupt generator
Interrupt request
Figure 15-1 Block Diagram of I2C Bus Interface
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Internal data bus
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VCC
VCC
SCL SCLin SCLout SDA
SCL
SDA
SDAin SDAout (Master) Chip
SCL SDA
SCLin SCLout
SCLin SCLout
SDAin SDAout (Slave 1)
SDAin SDAout (Slave 2)
Figure 15-2 I2C Bus Interface Connections (Example: The Chip as Master) 15.1.3 Input/Output Pins
Table 15-1 summarizes the input/output pins used by the I2C bus interface. Table 15-1 I2C Bus Interface Pins
Channel 0 1 Name Serial clock Serial data Serial clock Serial data Abbreviation SCL0 SDA0 SCL1 SDA1 I/O I/O I/O I/O I/O Function IIC0 serial clock input/output IIC0 serial data input/output IIC1 serial clock input/output IIC1 serial data input/output
Note: In the text, the channel subscript is omitted, and only SCL and SDA are used.
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SCL SDA
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15.1.4
Register Configuration
Table 15-2 summarizes the registers of the I2C bus interface. Table 15-2 Register Configuration
Channel 0 Name I C bus control register I C bus status register I C bus data register I C bus mode register Slave address register Second slave address register 1 I C bus control register I C bus status register I C bus data register I C bus mode register Slave address register Second slave address register Common Serial control register X DDC switch register Module stop control register B
2 2 2 2 2 2 2 2
Abbreviation ICCR0 ICSR0 ICDR0 ICMR0 SAR0 SARX0 ICCR1 ICSR1 ICDR1 ICMR1 SAR1 SARX1 SCRX DDCSWR MSTPCRB
R/(W) R/(W)* R/(W)* R/W R/W R/W R/W R/(W)* R/(W)* R/W R/W R/W R/W R/W R/W R/W
4 4 4 4
Initial Value H'01 H'00 — H'00 H'00 H'01 H'01 H'00 — H'00 H'00 H'01 H'08 H'0F H'FF
Address* H'FF78* 3 H'FF79*
3
1
23 H'FF7E* * 23 H'FF7F* *
H'FF7F* * 23 H'FF7E* * H'FF80* 3 H'FF81*
23 H'FF86* * 23 H'FF87* * 23 H'FF87* * 23 H'FF86* * 3
23
H'FDB4 H'FDB5 H'FDE9
Notes: 1. Lower 16 bits of the address. 2 2. The register that can be written or read depends on the ICE bit in the I C bus control 2 register. The slave address register can be accessed when ICE = 0, and the I C bus mode register can be accessed when ICE = 1. 2 3. The I C bus interface registers are assigned to the same addresses as other registers. Register selection is performed by means of the IICE bit in the serial control register X (SCRX). 4. Only 0 can be written, to clear the flag.
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15.2
15.2.1
Bit
Register Descriptions
I2C Bus Data Register (ICDR)
: 7 ICDR7 ⎯ R/W 6 ICDR6 ⎯ R/W 5 ICDR5 ⎯ R/W 4 ICDR4 ⎯ R/W 3 ICDR3 ⎯ R/W 2 ICDR2 ⎯ R/W 1 ICDR1 ⎯ R/W 0 ICDR0 ⎯ R/W
Initial value : R/W :
• ICDRR
Bit : 7 ⎯ R 6 ⎯ R 5 ⎯ R 4 ⎯ R 3 ⎯ R 2 ⎯ R 1 ⎯ R 0 ⎯ R ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0 Initial value : R/W :
• ICDRS
Bit : 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯ 3 ⎯ ⎯ 2 ⎯ ⎯ 1 ⎯ ⎯ 0 ⎯ ⎯ ICDRS7 ICDRS6 ICDRR5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0 Initial value : R/W :
• ICDRT
Bit : 7 ⎯ W 6 ⎯ W 5 ⎯ W 4 ⎯ W 3 ⎯ W 2 ⎯ W 1 ⎯ W 0 ⎯ W ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0 Initial value : R/W :
• TDRE, RDRF (internal flags)
Bit Initial value R/W : : : ⎯ TDRE 0 ⎯ ⎯ RDRF 0 ⎯
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ICDR is an 8-bit readable/writable register that is used as a transmit data register when transmitting and a receive data register when receiving. ICDR is divided internally into a shift register (ICDRS), receive buffer (ICDRR), and transmit buffer (ICDRT). ICDRS cannot be read or written by the CPU, ICDRR is read-only, and ICDRT is write-only. Data transfers among the three registers are performed automatically in coordination with changes in the bus state, and affect the status of internal flags such as TDRE and RDRF. If IIC is in transmit mode and the next data is in ICDRT (the TDRE flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred automatically from ICDRT to ICDRS. If IIC is in receive mode and no previous data remains in ICDRR (the RDRF flag is 0) following transmission/reception of one frame of data using ICDRS, data is transferred automatically from ICDRS to ICDRR. If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and receive data are stored differently. Transmit data should be written justified toward the MSB side when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1. ICDR is assigned to the same address as SARX, and can be written and read only when the ICE bit is set to 1 in ICCR. The value of ICDR is undefined after a reset. The TDRE and RDRF flags are set and cleared under the conditions shown below. Setting the TDRE and RDRF flags affects the status of the interrupt flags.
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TDRE 0
Description The next transmit data is in ICDR (ICDRT), or transmission cannot be started [Clearing conditions] • • • • When transmit data is written in ICDR (ICDRT) in transmit mode (TRS = 1) When a stop condition is detected in the bus line state after a stop condition is 2 issued with the I C bus format or serial format selected When a stop condition is detected with the I C bus format selected In receive mode (TRS = 0) (A 0 write to TRS during transfer is valid after reception of a frame containing an acknowledge bit)
2
(Initial value)
1
The next transmit data can be written in ICDR (ICDRT) [Setting conditions] • In transmit mode (TRS = 1), when a start condition is detected in the bus line state 2 after a start condition is issued in master mode with the I C bus format or serial format selected When data is transferred from ICDRT to ICDRS (Data transfer from ICDRT to ICDRS when TRS = 1 and TDRE = 0, and ICDRS is empty) In receive mode (TRS = 0), when a switch is made from slave receive mode (TRS = 0) to transmit mode (TRS = 1) after detection of a start condition (first time only)
•
•
RDRF 0
Description The data in ICDR (ICDRR) is invalid [Clearing condition] • When ICDR (ICDRR) receive data is read in receive mode (Initial value)
1
The ICDR (ICDRR) receive data can be read [Setting condition] • When data is transferred from ICDRS to ICDRR (Data transfer from ICDRS to ICDRR in case of normal termination with TRS = 0 and RDRF = 0)
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15.2.2
Bit
Slave Address Register (SAR)
: 7 SVA6 0 R/W 6 SVA5 0 R/W 5 SVA4 0 R/W 4 SVA3 0 R/W 3 SVA2 0 R/W 2 SVA1 0 R/W 1 SVA0 0 R/W 0 FS 0 R/W
Initial value : R/W :
SAR is an 8-bit readable/writable register that stores the slave address and selects the communication format. When the chip is in slave mode (and the addressing format is selected), if the upper 7 bits of SAR match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device specified by the master device. SAR is assigned to the same address as ICMR, and can be written and read only when the ICE bit is cleared to 0 in ICCR. SAR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 to 1—Slave Address (SVA6 to SVA0): Set a unique address in bits SVA6 to SVA0, differing from the addresses of other slave devices connected to the I2C bus. Bit 0—Format Select (FS): Used together with the FSX bit in SARX to select the communication format. • I2C bus format: addressing format with acknowledge bit • Synchronous serial format: non-addressing format without acknowledge bit, for master mode only The FS bit also specifies whether or not SAR slave address recognition is performed in slave mode.
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SAR Bit 0 FS 0
SARX Bit 0 FSX 0 1 Operating Mode I C bus format •
2 2
SAR and SARX slave addresses recognized (Initial value) SAR slave address recognized SARX slave address ignored SAR slave address ignored SARX slave address recognized SAR and SARX slave addresses ignored
I C bus format • •
1
0
I C bus format • •
2
1
Synchronous serial format •
15.2.3
Bit
Second Slave Address Register (SARX)
: 7 SVAX6 0 R/W 6 SVAX5 0 R/W 5 SVAX4 0 R/W 4 SVAX3 0 R/W 3 SVAX2 0 R/W 2 SVAX1 0 R/W 1 SVAX0 0 R/W 0 FSX 1 R/W
Initial value : R/W :
SARX is an 8-bit readable/writable register that stores the second slave address and selects the communication format. When the chip is in slave mode (and the addressing format is selected), if the upper 7 bits of SARX match the upper 7 bits of the first frame received after a start condition, the chip operates as the slave device specified by the master device. SARX is assigned to the same address as ICDR, and can be written and read only when the ICE bit is cleared to 0 in ICCR. SARX is initialized to H'01 by a reset and in hardware standby mode. Bits 7 to 1—Second Slave Address (SVAX6 to SVAX0): Set a unique address in bits SVAX6 to SVAX0, differing from the addresses of other slave devices connected to the I2C bus.
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Bit 0—Format Select X (FSX): Used together with the FS bit in SAR to select the communication format. • I2C bus format: addressing format with acknowledge bit • Synchronous serial format: non-addressing format without acknowledge bit, for master mode only The FSX bit also specifies whether or not SARX slave address recognition is performed in slave mode. For details, see the description of the FS bit in SAR. 15.2.4
Bit
I2C Bus Mode Register (ICMR)
: 7 MLS 0 R/W 6 WAIT 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W 3 CKS0 0 R/W 2 BC2 0 R/W 1 BC1 0 R/W 0 BC0 0 R/W
Initial value : R/W :
ICMR is an 8-bit readable/writable register that selects whether the MSB or LSB is transferred first, performs master mode wait control, and selects the master mode transfer clock frequency and the transfer bit count. ICMR is assigned to the same address as SAR. ICMR can be written and read only when the ICE bit is set to 1 in ICCR. ICMR is initialized to H'00 by a reset and in hardware standby mode. Bit 7—MSB-First/LSB-First Select (MLS): Selects whether data is transferred MSB-first or LSB-first. If the number of bits in a frame, excluding the acknowledge bit, is less than 8, transmit data and receive data are stored differently. Transmit data should be written justified toward the MSB side when MLS = 0, and toward the LSB side when MLS = 1. Receive data bits read from the LSB side should be treated as valid when MLS = 0, and bits read from the MSB side when MLS = 1. Do not set this bit to 1 when the I2C bus format is used.
Bit 7 MLS 0 1 Description MSB-first LSB-first (Initial value)
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Bit 6—Wait Insertion Bit (WAIT): Selects whether to insert a wait between the transfer of data and the acknowledge bit, in master mode with the I2C bus format. When WAIT is set to 1, after the fall of the clock for the final data bit, the IRIC flag is set to 1 in ICCR, and a wait state begins (with SCL at the low level). When the IRIC flag is cleared to 0 in ICCR, the wait ends and the acknowledge bit is transferred. If WAIT is cleared to 0, data and acknowledge bits are transferred consecutively with no wait inserted. The IRIC flag in ICCR is set to 1 on completion of the acknowledge bit transfer, regardless of the WAIT setting. The setting of this bit is invalid in slave mode.
Bit 6 WAIT 0 1 Description Data and acknowledge bits transferred consecutively Wait inserted between data and acknowledge bits (Initial value)
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Bits 5 to 3—Serial Clock Select (CKS2 to CKS0): These bits, together with the IICX1 (channel 1) or IICX0 (channel 0) bit in the SCRX register, select the serial clock frequency in master mode. They should be set according to the required transfer rate.
SCRX Bit 5 or 6 Bit 5 IICX 0 CKS2 0
Bit 4 CKS1 0 1
Bit 3 CKS0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 φ= Clock 5 MHz φ/28 φ/40 φ/48 φ/64 φ/80 φ/100 φ/112 φ/128 φ/56 φ/80 φ/96 φ/128 φ/160 φ/200 φ/224 φ/256 179 kHz 125 kHz 104 kHz 78.1 kHz 62.5 kHz 50.0 kHz 44.6 kHz 39.1 kHz 89.3 kHz 62.5 kHz 52.1 kHz 39.1 kHz 31.3 kHz 25.0 kHz 22.3 kHz 19.5 kHz φ= 8 MHz 286 kHz 200 kHz 167 kHz 125 kHz 100 kHz
Transfer Rate φ= 10 MHz 357 kHz 250 kHz 208 kHz 156 kHz 125 kHz 100 kHz 89.3 kHz 78.1 kHz 179 kHz 125 kHz 104 kHz 78.1 kHz 62.5 kHz 50.0 kHz 44.6 kHz 39.1 kHz φ= 16 MHz φ= 20 MHz
571 kHz* 714 kHz* 400 kHz 500 kHz* 333 kHz 250 kHz 200 kHz 160 kHz 143 kHz 125 kHz 286 kHz 200 kHz 167 kHz 125 kHz 100 kHz 80.0 kHz 71.4 kHz 62.5 kHz 417 kHz* 313 kHz 250 kHz 200 kHz 179 kHz 156 kHz 357 kHz 250 kHz 208 kHz 156 kHz 125 kHz 100 kHz 89.3 kHz 78.1 kHz
1
0 1
80.0 kHz 71.4 kHz 62.5 kHz 143 kHz 100 kHz 83.3 kHz 62.5 kHz 50.0 kHz 40.0 kHz 35.7 kHz 31.3 kHz
2
1
0
0 1
1
0 1
Note: * These rates are outside the ranges stipulated in the I C bus interface specifications (normal mode: max. 100 kHz, high-speed mode: max. 400 kHz).
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Bits 2 to 0—Bit Counter (BC2 to BC0): Bits BC2 to BC0 specify the number of bits to be transferred next. With the I2C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the data is transferred with one addition acknowledge bit. Bit BC2 to BC0 settings should be made during an interval between transfer frames. If bits BC2 to BC0 are set to a value other than 000, the setting should be made while the SCL line is low. The bit counter is initialized to 000 by a reset and when a start condition is detected. The value returns to 000 at the end of a data transfer, including the acknowledge bit.
Bit 2 BC2 0 Bit 1 BC1 0 1 1 0 1 Bit 0 BC0 0 1 0 1 0 1 0 1 Bits/Frame Synchronous Serial Format 8 1 2 3 4 5 6 7 I C Bus Format 9 2 3 4 5 6 7 8 (Initial value)
2
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15.2.5
Bit
I2C Bus Control Register (ICCR)
: 7 ICE 0 R/W 6 IEIC 0 R/W 5 MST 0 R/W 4 TRS 0 R/W 3 ACKE 0 R/W 2 BBSY 0 R/W 1 IRIC 0 R/(W)* 0 SCP 1 W
Initial value : R/W :
Note: * Only 0 can be written, for flag clearing.
ICCR is an 8-bit readable/writable register that enables or disables the I2C bus interface, enables or disables interrupts, selects master or slave mode and transmission or reception, enables or disables acknowledgement, confirms the I2C bus interface bus status, issues start/stop conditions, and performs interrupt flag confirmation. ICCR is initialized to H'01 by a reset and in hardware standby mode. Bit 7—I2C Bus Interface Enable (ICE): Selects whether or not the I2C bus interface is to be used. When ICE is set to 1, port pins function as SCL and SDA input/output pins and transfer operations are enabled. When ICE is cleared to 0, the I2C bus interface module is halted and its internal states are cleared. The SAR and SARX registers can be accessed when ICE is 0. The ICMR and ICDR registers can be accessed when ICE is 1.
Bit 7 ICE 0 Description I C bus interface module disabled, with SCL and SDA signal pins set to port function (Initial value) I C bus interface module internal states initialized SAR and SARX can be accessed 1 I C bus interface module enabled for transfer operations (pins SCL and SCA are driving the bus) ICMR and ICDR can be accessed
2 2 2
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Bit 6—I2C Bus Interface Interrupt Enable (IEIC): Enables or disables interrupts from the I2C bus interface to the CPU.
Bit 6 IEIC 0 1 Description Interrupts disabled Interrupts enabled (Initial value)
Bit 5—Master/Slave Select (MST) Bit 4—Transmit/Receive Select (TRS) MST selects whether the I2C bus interface operates in master mode or slave mode. TRS selects whether the I2C bus interface operates in transmit mode or receive mode. In master mode with the I2C bus format, when arbitration is lost, MST and TRS are both reset by hardware, causing a transition to slave receive mode. In slave receive mode with the addressing format (FS = 0 or FSX = 0), hardware automatically selects transmit or receive mode according to the R/W bit in the first frame after a start condition. Modification of the TRS bit during transfer is deferred until transfer of the frame containing the acknowledge bit is completed, and the changeover is made after completion of the transfer. MST and TRS select the operating mode as follows.
Bit 5 MST 0 1 Bit 4 TRS 0 1 0 1 Operating Mode Slave receive mode Slave transmit mode Master receive mode Master transmit mode (Initial value)
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Bit 5 MST 0 Description Slave mode [Clearing conditions] (1) When 0 is written by software (2) When bus arbitration is lost after transmission is started in I C bus format master mode 1 Master mode [Setting conditions] (1) When 1 is written by software (in cases other than clearing condition (2)) (2) When 1 is written in MST after reading MST = 0 (in case of clearing condition (2))
2
(Initial value)
Bit 4 TRS 0 Description Receive mode [Clearing conditions] (1) When 0 is written by software (in cases other than setting condition (3)) (2) When 0 is written in TRS after reading TRS = 1 (in case of clearing condition (3)) (3) When bus arbitration is lost after transmission is started in I C bus format master mode 1 Transmit mode [Setting conditions] (1) When 1 is written by software (in cases other than clearing conditions (3) and 4) (2) When 1 is written in TRS after reading TRS = 0 (in case of clearing conditions (3) and 4) (3) When a 1 is received as the R/W bit of the first frame in I C bus format slave mode
2 2
(Initial value)
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Bit 3—Acknowledge Bit Judgement Selection (ACKE): Specifies whether the value of the acknowledge bit returned from the receiving device when using the I2C bus format is to be ignored and continuous transfer is performed, or transfer is to be aborted and error handling, etc., performed if the acknowledge bit is 1. When the ACKE bit is 0, the value of the received acknowledge bit is not indicated by the ACKB bit, which is always 0. In this LSI, the DTC can be used to perform continuous transfer. The DTC is activated when the IRTR interrupt flag is set to 1 (IRTR is one of two interrupt flags, the other being IRIC). When the ACKE bit is 0, the TDRE, IRIC, and IRTR flags are set on completion of data transmission, regardless of the value of the acknowledge bit. When the ACKE bit is 1, the TDRE, IRIC, and IRTR flags are set on completion of data transmission when the acknowledge bit is 0, and the IRIC flag alone is set on completion of data transmission when the acknowledge bit is 1. When the DTC is activated, the TDRE, IRIC, and IRTR flags are cleared to 0 after the specified number of data transfers have been executed. Consequently, interrupts are not generated during continuous data transfer, but if data transmission is completed with a 1 acknowledge bit when the ACKE bit is set to 1, the DTC is not activated and an interrupt is generated, if enabled. Depending on the receiving device, the acknowledge bit may be significant, in indicating completion of processing of the received data, for instance, or may be fixed at 1 and have no significance.
Bit 3 ACKE 0 1 Description The value of the acknowledge bit is ignored, and continuous transfer is performed (Initial value) If the acknowledge bit is 1, continuous transfer is interrupted
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Bit 2—Bus Busy (BBSY): The BBSY flag can be read to check whether the I2C bus (SCL, SDA) is busy or free. In master mode, this bit is also used to issue start and stop conditions. A high-to-low transition of SDA while SCL is high is recognized as a start condition, setting BBSY to 1. A low-to-high transition of SDA while SCL is high is recognized as a stop condition, clearing BBSY to 0. To issue a start condition, use a MOV instruction to write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, use a MOV instruction to write 0 in BBSY and 0 in SCP. It is not possible to write to BBSY in slave mode; the I2C bus interface must be set to master transmit mode before issuing a start condition. MST and TRS should both be set to 1 before writing 1 in BBSY and 0 in SCP.
Bit 2 BBSY 0 Description Bus is free [Clearing condition] • 1 When a stop condition is detected Bus is busy [Setting condition] • When a start condition is detected (Initial value)
Bit 1—I2C Bus Interface Interrupt Request Flag (IRIC): Indicates that the I2C bus interface has issued an interrupt request to the CPU. IRIC is set to 1 at the end of a data transfer, when a slave address or general call address is detected in slave receive mode, when bus arbitration is lost in master transmit mode, and when a stop condition is detected. IRIC is set at different times depending on the FS bit in SAR and the WAIT bit in ICMR. See section 15.3.7, IRIC Setting Timing and SCL Control. The conditions under which IRIC is set also differ depending on the setting of the ACKE bit in ICCR. IRIC is cleared by reading IRIC after it has been set to 1, then writing 0 in IRIC. When the DTC is used, IRIC is cleared automatically and transfer can be performed continuously without CPU intervention.
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Bit 1 IRIC 0 Description Waiting for transfer, or transfer in progress (Initial value) [Clearing conditions] • When 0 is written in IRIC after reading IRIC = 1 • When ICDR is written or read by the DTC (When the TDRE or RDRF flag is cleared to 0) (This is not always a clearing condition; see the description of DTC operation for details) Interrupt requested [Setting conditions] 2 I C bus format master mode • • • When a start condition is detected in the bus line state after a start condition is issued (when the TDRE flag is set to 1 because of first frame transmission) When a wait is inserted between the data and acknowledge bit when WAIT = 1 At the end of data transfer (at the rise of the 9th transmit/receive clock pulse, or at the fall of the 8th transmit/receive clock pulse when using wait insertion) When a slave address is received after bus arbitration is lost (when the AL flag is set to 1)
1
• •
When 1 is received as the acknowledge bit when the ACKE bit is 1 (when the ACKB bit is set to 1) 2 I C bus format slave mode • • • When the slave address (SVA, SVAX) matches (when the AAS and AASX flags are set to 1) and at the end of data transfer up to the subsequent retransmission start condition or stop condition detection (when the TDRE or RDRF flag is set to 1) When the general call address is detected (when FS = 0 and the ADZ flag is set to 1) and at the end of data transfer up to the subsequent retransmission start condition or stop condition detection (when the TDRE or RDRF flag is set to 1) When 1 is received as the acknowledge bit when the ACKE bit is 1 (when the ACKB bit is set to 1)
•
• When a stop condition is detected (when the STOP or ESTP flag is set to 1) Synchronous serial format • At the end of data transfer (when the TDRE or RDRF flag is set to 1) • When a start condition is detected with serial format selected When any other condition arises in which the TDRE or RDRF flag is set to 1
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When, with the I2C bus format selected, IRIC is set to 1 and an interrupt is generated, other flags must be checked in order to identify the source that set IRIC to 1. Although each source has a corresponding flag, caution is needed at the end of a transfer. When the TDRE or RDRF internal flag is set, the readable IRTR flag may or may not be set. The IRTR flag (the DTC start request flag) is not set at the end of a data transfer up to detection of a retransmission start condition or stop condition after a slave address (SVA) or general call address match in I2C bus format slave mode. Even when the IRIC flag and IRTR flag are set, the TDRE or RDRF internal flag may not be set. The IRIC and IRTR flags are not cleared at the end of the specified number of transfers in continuous transfer using the DTC. The TDRE or RDRF flag is cleared, however, since the specified number of ICDR reads or writes have been completed. Table 15-3 shows the relationship between the flags and the transfer states.
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Table 15-3 Flags and Transfer States
MST TRS BBSY ESTP STOP IRTR 1/0 1 1 1 1 0 0 0 0 0 1/0 1 1 1/0 1/0 0 0 0 0 1/0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 AASX AL 0 0 0 0 0 1/0 0 0 1 0 0 0 0 0 0 1 0 0 0 0 AAS 0 0 0 0 0 1/0 1 1 0 0 ADZ 0 0 0 0 0 1/0 0 1 0 0 ACKB State 0 0 0 0/1 0/1 0 0 0 0 0/1 Idle state (flag clearing required) Start condition issuance Start condition established Master mode wait Master mode transmit/receive end Arbitration lost SAR match by first frame in slave mode General call address match SARX match Slave mode transmit/receive end (except after SARX match) Slave mode transmit/receive end (after SARX match) Stop condition detected
0 0 0
1/0 1 1/0
1 1 0
0 0 1/0
0 0 1/0
1 0 0
1 1 0
0 0 0
0 0 0
0 0 0
0 1 0/1
Bit 0—Start Condition/Stop Condition Prohibit (SCP): Controls the issuing of start and stop conditions in master mode. To issue a start condition, write 1 in BBSY and 0 in SCP. A retransmit start condition is issued in the same way. To issue a stop condition, write 0 in BBSY and 0 in SCP. This bit is always read as 1. If 1 is written, the data is not stored.
Bit 0 SCP 0 1 Description Writing 0 issues a start or stop condition, in combination with the BBSY flag Reading always returns a value of 1 Writing is ignored (Initial value)
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15.2.6
Bit
I2C Bus Status Register (ICSR)
: 7 ESTP 0 R/(W)* 6 STOP 0 R/(W)* 5 IRTR 0 R/(W)* 4 AASX 0 R/(W)* 3 AL 0 R/(W)* 2 AAS 0 R/(W)* 1 ADZ 0 R/(W)* 0 ACKB 0 R/W
Initial value : R/W :
Note: * Only 0 can be written, for flag clearing.
ICSR is an 8-bit readable/writable register that performs flag confirmation and acknowledge confirmation and control. ICSR is initialized to H'00 by a reset and in hardware standby mode. Bit 7—Error Stop Condition Detection Flag (ESTP): Indicates that a stop condition has been detected during frame transfer in I2C bus format slave mode.
Bit 7 ESTP 0 Description No error stop condition [Clearing conditions] • • 1 When 0 is written in ESTP after reading ESTP = 1 When the IRIC flag is cleared to 0
2
(Initial value)
In I C bus format slave mode Error stop condition detected [Setting condition] • When a stop condition is detected during frame transfer In other modes No meaning
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Bit 6—Normal Stop Condition Detection Flag (STOP): Indicates that a stop condition has been detected after completion of frame transfer in I2C bus format slave mode.
Bit 6 STOP 0 Description No normal stop condition [Clearing conditions] • • 1 When 0 is written in STOP after reading STOP = 1 When the IRIC flag is cleared to 0
2
(Initial value)
In I C bus format slave mode Normal stop condition detected [Setting condition] • When a stop condition is detected after completion of frame transfer In other modes No meaning
Bit 5—I2C Bus Interface Continuous Transmission/Reception Interrupt Request Flag (IRTR): Indicates that the I2C bus interface has issued an interrupt request to the CPU, and the source is completion of reception/transmission of one frame in continuous transmission/reception for which DTC activation is possible. When the IRTR flag is set to 1, the IRIC flag is also set to 1 at the same time. IRTR flag setting is performed when the TDRE or RDRF flag is set to 1. IRTR is cleared by reading IRTR after it has been set to 1, then writing 0 in IRTR. IRTR is also cleared automatically when the IRIC flag is cleared to 0.
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Bit 5 IRTR 0 Description Waiting for transfer, or transfer in progress [Clearing conditions] • • 1 When 0 is written in IRTR after reading IRTR = 1 When the IRIC flag is cleared to 0 (Initial value)
Continuous transfer state [Setting conditions] • • In I C bus interface slave mode When the TDRE or RDRF flag is set to 1 when AASX = 1 In other modes When the TDRE or RDRF flag is set to 1
2
Bit 4—Second Slave Address Recognition Flag (AASX): In I2C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVAX6 to SVAX0 in SARX. AASX is cleared by reading AASX after it has been set to 1, then writing 0 in AASX. AASX is also cleared automatically when a start condition is detected.
Bit 4 AASX 0 Description Second slave address not recognized [Clearing conditions] • • • 1 When 0 is written in AASX after reading AASX = 1 When a start condition is detected In master mode (Initial value)
Second slave address recognized [Setting condition] • When the second slave address is detected in slave receive mode and FSX = 0
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Bit 3—Arbitration Lost (AL): This flag indicates that arbitration was lost in master mode. The I2C bus interface monitors the bus. When two or more master devices attempt to seize the bus at nearly the same time, if the I2C bus interface detects data differing from the data it sent, it sets AL to 1 to indicate that the bus has been taken by another master. AL is cleared by reading AL after it has been set to 1, then writing 0 in AL. In addition, AL is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
Bit 3 AL 0 Description Bus arbitration won [Clearing conditions] • • 1 When ICDR data is written (transmit mode) or read (receive mode) When 0 is written in AL after reading AL = 1 (Initial value)
Arbitration lost [Setting conditions] • • If the internal SDA and SDA pin disagree at the rise of SCL in master transmit mode If the internal SCL line is high at the fall of SCL in master transmit mode
Bit 2—Slave Address Recognition Flag (AAS): In I2C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition matches bits SVA6 to SVA0 in SAR, or if the general call address (H'00) is detected. AAS is cleared by reading AAS after it has been set to 1, then writing 0 in AAS. In addition, AAS is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
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Bit 2 AAS 0 Description Slave address or general call address not recognized [Clearing conditions] • • • 1 When ICDR data is written (transmit mode) or read (receive mode) When 0 is written in AAS after reading AAS = 1 In master mode (Initial value)
Slave address or general call address recognized [Setting condition] • When the slave address or general call address is detected in slave receive mode and FS = 0
Bit 1—General Call Address Recognition Flag (ADZ): In I2C bus format slave receive mode, this flag is set to 1 if the first frame following a start condition is the general call address (H'00). ADZ is cleared by reading ADZ after it has been set to 1, then writing 0 in ADZ. In addition, ADZ is reset automatically by write access to ICDR in transmit mode, or read access to ICDR in receive mode.
Bit 1 ADZ 0 Description General call address not recognized [Clearing conditions] • • • 1 When ICDR data is written (transmit mode) or read (receive mode) When 0 is written in ADZ after reading ADZ = 1 In master mode (Initial value)
General call address recognized [Setting condition] • When the general call address is detected in slave receive mode and (FSX = 0 or FS = 0)
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Bit 0—Acknowledge Bit (ACKB): Stores acknowledge data. In transmit mode, after the receiving device receives data, it returns acknowledge data, and this data is loaded into ACKB. In receive mode, after data has been received, the acknowledge data set in this bit is sent to the transmitting device. When this bit is read, in transmission (when TRS = 1), the value loaded from the bus line (returned by the receiving device) is read. In reception (when TRS = 0), the value set by internal software is read. In addition, when this bit is written to in reception the transmission acknowledge data setting is overwritten regardless of the value of TRS. The value loaded from the reception device is maintained unchanged, so caution is necessary when using bit operation instructions to overwrite this register.
Bit 0 ACKB 0 Description Receive mode: 0 is output at acknowledge output timing (Initial value) Transmit mode: Indicates that the receiving device has acknowledged the data (signal is 0) 1 Receive mode: 1 is output at acknowledge output timing Transmit mode: Indicates that the receiving device has not acknowledged the data (signal is 1)
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15.2.7
Bit
Serial Control Register X (SCRX)
: 7 ⎯ 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W 3 ⎯ 1 R 2 ⎯ 0 R/W 1 ⎯ 0 R/W 0 ⎯ 0 R/W
Initial value : R/W :
SCRX is an 8-bit readable/writable register that controls register access, the I2C interface operating mode. If a module controlled by SCRX is not used, do not write 1 to the corresponding bit. SCRX is initialized to H'08 by a reset and in hardware standby mode. Bit 7—Reserved: Do not set 1. Bit 6—I2C Transfer Select 1 (IICX1): This bit, together with bits CKS2 to CKS0 in ICMR of IIC1, selects the transfer rate in master mode. For details, see section 15.2.4, I2C Bus Mode Register (ICMR). Bit 5—I2C Transfer Select 0 (IICX0): This bit, together with bits CKS2 to CKS0 in ICMR of IIC0, selects the transfer rate in master mode. For details, see section 15.2.4, I2C Bus Mode Register (ICMR). Bit 4—I2C Master Enable (IICE): Controls CPU access to the I2C bus interface data and control registers (ICCR, ICSR, ICDR/SARX, ICMR/SAR).
Bit 4 IICE 0 1 Description CPU access to I C bus interface data and control registers is disabled CPU access to I C bus interface data and control registers is enabled
2 2
(Initial value)
Bit 3— Reserved: Always returns a value of 1 if it is read. Bits 2 to 0—Reserved: Do not set 1.
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15.2.8
Bit
DDC Switch Register (DDCSWR)
: 7 ⎯ 0 R/(W)*1 6 ⎯ 0 R/(W)*1 5 ⎯ 0 R/(W)*1 4 ⎯ 0 R/(W)*1 3 CLR3 1 W*2 2 CLR2 1 W*2 1 CLR1 1 W*2 0 CLR0 1 W*2
Initial value : R/W :
Notes: 1. Should always be written with 0. 2. Always read as 1.
DDCSWR is an 8-bit readable/writable register that is used to initialize the IIC module. DDCSWR is initialized to H'0F by a reset and in hardware standby mode. Bits 7 to 4—Reserved: Should always be written with 0. Bits 3 to 0—IIC Clear 3 to 0 (CLR3 to CLR0): These bits control initialization of the internal state of IIC0 and IIC1. These bits can only be written to; if read they will always return a value of 1. When a write operation is performed on these bits, a clear signal is generated for the internal latch circuit of the corresponding module(s), and the internal state of the IIC module(s) is initialized. The write data for these bits is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written to simultaneously using an MOV instruction. Do not use a bit manipulation instruction such as BCLR. When clearing is required again, all the bits must be written to in accordance with the setting.
Bit 3 CLR3 0 Bit 2 CLR2 0 1 Bit 1 CLR1 — 0 1 1 — — Bit 0 CLR0 — 0 1 0 1 — Description Setting prohibited Setting prohibited IIC0 internal latch cleared IIC1 internal latch cleared IIC0 and IIC1 internal latches cleared Invalid setting
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15.2.9
Bit
Module Stop Control Register B (MSTPCRB)
: 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
MSTPB7 MSTPB6 MSTPB5 MSTPB4 MSTPB3 MSTPB2 MSTPB1 MSTPB0 Initial value : R/W :
MSTPCRB is an 8-bit readable/writable register that perform module stop mode control. When the MSTPB4 or MSTPB3 bit is set to 1, operation of the corresponding IIC channel is halted at the end of the bus cycle, and a transition is made to module stop mode. For details, see section 23A.5, 23B.5, Module Stop Mode. MSTPCRB is initialized to H'FF by a power-on reset and in hardware standby mode. It is not initialized in software standby mode. Bit 4—Module Stop (MSTPB4): Specifies IIC channel 0 module stop mode.
Bit 4 MSTPB4 0 1 Description IIC channel 0 module stop mode is cleared IIC channel 0 module stop mode is set (Initial value)
Bit 3—Module Stop (MSTPB3): Specifies IIC channel 1 module stop mode.
Bit 3 MSTPB3 0 1 Description IIC channel 1 module stop mode is cleared IIC channel 1 module stop mode is set (Initial value)
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15.3
15.3.1
Operation
I2C Bus Data Format
The I2C bus interface has serial and I2C bus formats. The I2C bus formats are addressing formats with an acknowledge bit. These are shown in figures 15-3 (a) and (b). The first frame following a start condition always consists of 8 bits. The serial format is a non-addressing format with no acknowledge bit. Although start and stop conditions must be issued, this format can be used as a synchronous serial format. This is shown in figure 15-4. Figure 15-5 shows the I2C bus timing. The symbols used in figures 15-3 to 15-5 are explained in table 15-4.
(a) I2C bus format (FS = 0 or FSX = 0) S 1 SLA 7 1 R/W 1 A 1 DATA n A 1 m A/A 1 P 1 n: transfer bit count (n = 1 to 8) m: transfer frame count (m ≥ 1)
(b) I2C bus format (start condition retransmission, FS = 0 or FSX = 0) S 1 SLA 7 1 R/W 1 A 1 DATA n1 m1 A/A 1 S 1 SLA 7 1 R/W 1 A 1 DATA n2 m2 A/A 1 P 1
n1 and n2: transfer bit count (n1 and n2 = 1 to 8) m1 and m2: transfer frame count (m1 and m2 ≥ 1)
Figure 15-3 I2C Bus Data Formats (I2C Bus Formats)
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FS = 1 and FSX = 1
S 1
DATA 8 1
DATA n m
P 1 n: transfer bit count (n = 1 to 8) m: transfer frame count (m ≥ 1)
Figure 15-4 I2C Bus Data Format (Serial Format)
SDA
SCL S
1-7 SLA
8 R/W
9 A
1-7 DATA
8
9 A
1-7 DATA
8
9 A/A P
Figure 15-5 I2C Bus Timing Table 15-4 I2C Bus Data Format Symbols
Legend S SLA R/W A DATA P Start condition. The master device drives SDA from high to low while SCL is high Slave address, by which the master device selects a slave device Indicates the direction of data transfer: from the slave device to the master device when R/W is 1, or from the master device to the slave device when R/W is 0 Acknowledge. The receiving device (the slave in master transmit mode, or the master in master receive mode) drives SDA low to acknowledge a transfer Transferred data. The bit length is set by bits BC2 to BC0 in ICMR. The MSB-first or LSB-first format is selected by bit MLS in ICMR Stop condition. The master device drives SDA from low to high while SCL is high
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15.3.2
Initial Setting
At startup the following procedure is used to initialize the IIC.
Start initialization Set MSTP4 = 0 (IIC0) MSTP3 = 0 (IIC1) (MSTPCRB) Set IICE = 1 (SCRX) Set ICE = 0 (ICCR) Set SAR and SARX Set ICE = 1 (ICCR) Set ICSR Set SCRX Set IMCR Set ICCR Transmit/receive start Clear module stop
Enable CPU access by IIC control register and data register Enable SAR and SARX access Set transfer format for 1st slave address, 2nd slave address, and IIC (SVA8−SVA0, FS, SVAX6−SVAX0, FSX) Enable IMCR and IMDR access. Use SCL and SDA pins is IIC port Set acknowledge bit (ACKB) Set transfer rate (IICX) Set transfer format, wait insertion, and transfer rate (MLS, WAIT, CKS2−CKS0) Set interrupt enable, transfer mode, and acknowledge judgment (IEIC, MST, TRS, ACKE)
Figure 15-6 Flowchart for IIC Initialization (Example) Note: The ICMR register should be written to only after transmit or receive operations have completed. Writing to the ICMR register while a transmit or receive operation is in progress could cause an erroneous value to be written to bit counter bits BC2 to BC0. This could result in improper operation. 15.3.3 Master Transmit Operation
In I2C bus format master transmit mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. Figure 15-7 is a flowchart showing an example of the master transmit mode.
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Start Initial settings [1] Initial settings
Read BBSY flag in ICCR [2] Determine status of SCL and SDA lines No BBSY = 0? Yes Set MST = 1 and TRS = 1 (ICCR) Write BBSY = 1 and SCP = 0 (ICCR)
[3] Set to master transmit mode
[4] Generate start condition
Read IRIC flag in ICCR [5] Wait for start condition to be met No IRIC = 1? Yes Write transmit data to ICDR Clear IRIC flag in ICCR
[6] Set 1st byte (slave address + R/W) transmit data (Perform ICDR write and IRIC flag clear operations continuously)
Read IRIC flag in ICCR [7] Wait for end of 1 byte transmission No IRIC = 1? Yes Read ACKB bit in ICSR ACKB = 0? Yes Transmit mode? Yes Write transmit data to ICDR Clear IRIC flag in ICCR [9] Set transmit data for 2nd byte onward (Perform ICDR write and IRIC flag clear operations continuously) No Master receive mode No
[8] Judge acknowledge signal from specified slave device
Read IRIC flag in ICCR [10] Wait for end of 1 byte transmission No IRIC = 1? Yes Read ACKB bit in ICSR [11] Judge end of transmission No Transmit complete? (ACKB = 1?) Yes Clear IRIC flag in ICCR [12] Generate stop condition. Write BBSY = 0 and SCP = 0 (ICCR) End
Figure 15-7 Flowchart for Master Transmit Mode (Example)
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The procedure for transmitting data sequentially, synchronized with ICDR (ICDRT) write operations, is described below. [1] Perform initial settings as described in section 15.3.2, Initial Setting. [2] Read the BBSY flag in ICCR to confirm that the bus is free. [3] Set bits MST and TSR in ICCR to 1 to switch to the master transmit mode. [4] Write 1 to BBSY and 0 to SCP in ICCR. This changes SDA from high to low when SCL is high, and generates the start condition. [5] The IRIC and IRTR flags are set to 1 when the start condition is generated. If the IEIC bit in ICCR has been set to 1, an interrupt request is sent to the CPU. [6] After the start condition is detected, write the data (slave address + R/W) to ICDR. With the I2C bus format (when the FS bit in SAR or the FSX bit in SARX is 0), the first frame data following the start condition indicates the 7-bit slave address and transmit/receive direction (R/W). Next, clear the IRIC flag to 0 to indicate the end of the transfer. Continue successively writing to ICDR and clearing the IRIC flag to ensure that processing of other interrupts does not intervene. If the time required to transmit one byte of data elapses by the time the IRIC flag is cleared, it will not be possible to determine the end of the transmission. The master device sequentially sends the transmit clock and the data written to ICDR. The selected slave device (i.e., the slave device with the matching slave address) drives SDA low at the 9th transmit clock pulse and returns an acknowledge signal. [7] When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in synchronization with the internal clock until the next transmit data is written. [8] Read the ACKB bit in ICSR to confirm that its value is 0. If the slave device has not returned an acknowledge signal and the value of ACKB is 1, perform the transmit end processing described in step [12] and then recommence the transmit operation from the beginning. [9] Write the transmit data to ICDR. Next, clear the IRIC flag to 0 to indicate the end of the transfer. Then continue successively writing to ICDR and clearing the IRIC flag as described in step [6]. Transmission of the next frame is synchronized with the internal clock. [10] When one frame of data has been transmitted, the IRIC flag is set to 1 at the rise of the 9th transmit clock pulse. After one frame has been transmitted, SCL is automatically fixed low in synchronization with the internal clock until the next transmit data is written. [11] Read the ACKB bit in ICSR to confirm that the slave device has returned an acknowledge signal and the value of ACKB is 0. If the slave device has not returned an acknowledge signal and the value of ACKB is 1, perform the transmit end processing described in step [12]. [12] Clear the IRIC flag to 0. Write 0 to the ACKE bit in ICCR and clear the received ACKB bit to 0.
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Write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high, and generates the stop condition.
Generate start condition SCL (Master output) SDA (Master output) SDA (Slave output) ICDRE IRIC IRTR ICDRT ICDRS Note: ICDR data setting timing Normal operation Improper operation will result User processing [4] Write BBSY = 1 and SCP = 0 (generate start condition) [6] ICDR write [6] IRIC clearance [9] ICDR write [9] IRIC clearance Address + R/W Address + R/W Data 1 Data 1 Interrupt request Interrupt request 1 Bit 7 2 Bit 6 3 Bit 5 4 Bit 4 5 Bit 3 6 Bit 2 7 Bit 1 8 Bit 0 R/W [7] A 9 1 Bit 7 2 Bit 6
Slave address [5]
Data 1
Figure 15-8 Example of Master Transmit Mode Operation Timing (MLS = WAIT = 0)
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Generate start condition SCL (Master output) SDA (Master output) 8 Bit 0 Data 1 SDA (Slave output) ICDRE IRIC IRTR ICDR Data 1 Data 2 [7] A 9 1 Bit 7 2 3 4 Bit 4 5 Bit 3 6 Bit 2 7 8 9
Bit 6 Bit 5
Bit 1 Bit 0 [10] A
Data 2
User processing
[9] ICDR write
[9] IRIC clearance
[11] ACKB read
[12] Write BBSY = 0 and SCP = 0 (generate stop condition) [12] IRIC clearance
Figure 15-9 Example of Master Transmit Mode Stop Condition Generation Timing (MLS = WAIT = 0) 15.3.4 Master Receive Operation
In I2C bus format master receive mode, the master device outputs the receive clock, receives data, and returns an acknowledge signal. The slave device transmits data. The master device transmits the data containing the slave address + R/W (0: read) in the 1st frame after a start condition is generated in the master transmit mode. After the slave device is selected the switch to receive operation takes place. (1) Receive Operation Using Wait States Figures 15-10 and 15-11 are flowcharts showing examples of the master receive mode (WAIT = 1).
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Master receive mode Set TRS = 0 (ICCR) Set ACKB = 0 (ICSR) Clear IRIC flag in ICCR Set WAIT = 1 (ICMR) Read ICDR [2] Receive start, dummy read [1] Set to receive mode
Read IRIC flag in ICCR No IRIC = 1? Yes No IRTR = 1? Yes Final receive? No Read ICDR Clear IRIC flag in ICCR Yes
[3] Receive wait state (IRIC set at falling edge of 8th clock cycle) or Wait for end of reception of 1 byte (IRIC set at rising edge of 9th clock cycle)
[4] Data receive completed judgment
[5] Read receive data
[6] Clear IRIC flag (cancel wait state)
Set ACKB = 1 (ICSR) 1 clock cycle wait state Set TRS = 1 (ICCR) Read ICDR Clear IRIC flag in ICCR
[7] Set acknowledge data for final receive [8] Wait time until TRS setting [9] Set TRS to generate stop condition [10] Read receive data [11] Clear IRIC flag (cancel wait state)
Read IRIC flag in ICCR No IRIC = 1? Yes IRTR = 1? No Clear IRIC flag in ICCR Yes
[12] Receive wait state (IRIC set at falling edge of 8th clock cycle) or Wait for end of reception of 1 byte (IRIC set at rising edge of 9th clock cycle)
[13] Data receive completed judgment
[14] Clear IRIC flag (cancel wait state)
Set WAIT = 0 (ICMR) Clear IRIC flag in ICCR Read ICDR Write BBSY = 0 and SCP = 0 (ICCR) End
[15] Cancel wait mode Clear IRIC flag (IRIC flag should be cleared when WAIT = 0)
[16] Read final receive data [17] Generate stop condition
Figure 15-10 Flowchart for Master Receive Mode (Receiving Multiple Bytes) (WAIT = 1) (Example)
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Master receive mode Set TRS = 0 (ICCR) Set ACKB = 0 (ICSR) [1] Clear IRIC flag in ICCR Set WAIT = 1 (ICMR) Read ICDR [2] Receive start, dummy read Set to receive mode
Read IRIC flag in ICCR No IRIC = 1? Yes Set ACKB = 1 (ICSR) Set TRS = 1 (ICCR) Clear IRIC flag in ICCR
[3]
Receive wait state (IRIC set at falling edge of 8th clock cycle) or Wait for end of reception of 1 byte (IRIC set at rising edge of 9th clock cycle)
[7] [9]
Set acknowledge data for final receive Set TRS to generate stop condition
[11] Clear IRIC flag (cancel wait state)
Read IRIC flag in ICCR No [12] Wait for end of reception of 1 byte (IRIC set at rising edge of 9th clock cycle) IRIC = 1? Yes Set WAIT = 0 (ICMR) Clear IRIC flag in ICCR Read ICDR Write BBSY = 0 and SCP = 0 (ICCR) End [15] Cancel wait mode Clear IRIC flag (IRIC flag should be cleared when WAIT = 0) [16] Read final receive data [17] Generate stop condition
Figure 15-11 Flowchart for Master Receive Mode (Receiving 1 Byte) (WAIT = 1) (Example) The procedure for receiving data sequentially, using the wait states (WAIT bit) for synchronization with ICDR (ICDRR) read operations, is described below. The procedure below describes the operation for receiving multiple bytes. Note that some of the steps are omitted when receiving only 1 byte. Refer to figure 15-11 for details.
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[1] Clear the TRS bit in ICCR to 0 to switch from transmit mode to receive mode. Clear the ACKB bit in ICSR to 0 (acknowledge data setting). Clear the IRIC flag to 0, then set the WAIT bit in ICMR to 1. [2] When ICDR is read (dummy data read), reception is started, and the receive clock is output, and data received, in synchronization with the internal clock. [3] The IRIC flag is set to 1 by the following two conditions. At that point, an interrupt request is issued to the CPU if the IEIC bit in ICCR is set to 1. 1. The flag is set at the falling edge of the 8th clock cycle of the receive clock for 1 frame. SCL is automatically held low, in synchronization with the internal clock, until the IRIC flag is cleared. 2. The flag is set at the rising edge of the 9th clock cycle of the receive clock for 1 frame. The IRIC flag and ICDRF flag are set to 1, indicating that reception of 1 frame of data has ended. The master device continues to output the receive clock for the receive data. [4] Read the IRTR flag in ICSR. If the IRTR flag value is 0, the wait state is cancelled by clearing the IRIC flag as described in step [6] below. If the IRTR flag value is 1 and the next receive data is the final receive data, perform the end processing described in step [7] below. [5] If the IRTR flag value is 1, read the ICDR receive data. [6] Clear the IRTR flag to 0. If condition [3]-1 is true, the master device drives SDA to low level and returns an acknowledge signal when the receive clock outputs the 9th clock cycle. Further data can be received by repeating steps [3] through [6]. [7] Set the ACKB bit in ICSR to 1 to set the acknowledge data for the final receive. [8] Wait for at least 1 clock cycle after the IRIC flag is set to 1 and then wait for the rising edge of the 1st clock cycle of the next receive data. [9] Set the TSR bit in ICCR to 1 to switch from the receive mode to the transmit mode. The TSR bit setting value at this point becomes valid when the rising edge of the next 9th clock cycle is input. [10] Read the ICDR receive data. [11] Clear the IRTR flag to 0. [12] The IRIC flag is set to 1 by the following two conditions. 1. The flag is set at the falling edge of the 8th clock cycle of the receive clock for 1 frame. SCL is automatically held low, in synchronization with the internal clock, until the IRIC flag is cleared. 2. The flag is set at the rising edge of the 9th clock cycle of the receive clock for 1 frame. The IRIC flag and ICDRF flag are set to 1, indicating that reception of 1 frame of data has ended. The master device continues to output the receive clock for the receive data. [13] Read the IRTR flag in ICSR. If the IRTR flag value is 0, the wait state is cancelled by clearing the IRIC flag as described in step [14] below. If the IRTR flag value is 1 and the
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receive operation has finished, perform the issue stop condition processing described in step [15] below. [14] If the IRTR flag value is 0, clear the IRIC flag to 0 to cancel the wait state. Return to reading the IRIC flag, as described in step [12], to detect the end of the receive operation. [15] Clear the WAIT bit in ICMR to 0 to cancel the wait mode. Then clear the IRIC flag to 0. The IRIC flag should be cleared when the value of WAIT is 0 (The stop condition may not be output properly when the issue stop condition instruction is executed if the WAIT bit was cleared to 0 after the IRIC flag is cleared to 0). [16] Read the final receive data in ICDR. [17] Write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high, and generates the stop condition.
Master transmit mode SCL (master output) SDA (slave output) Master receive mode
9 A
1
2
3
4
5
6
7
8
9
1
2
3
4
5
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Data 1
Bit 1 Bit 0 [3] A [3]
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Data 2
SDA (master output) IRIC IRTR ICDR
[4] IRTR = 0
[4] IRTR = 1
Data 1
User processing
[2] ICDR read (dummy read) [1] TRS cleared to 0 IRIC clearance
[6] IRIC clearance (cancel wait)
[5] ICDR read (data 1)
[6] IRIC clearance
Figure 15-12 Example of Master Receive Mode Operation Timing (MLS = ACKB = 0, WAIT = 1)
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[8] 1 clock cycle wait time SCL (master output)
Stop condition generated 4 5 6 7 8 9
8
9
1
2
3
SDA Bit 0 (slave output) Data 2 [3] SDA (master output) IRIC IRTR ICDR
[4] IRTR = 0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 [3] A Data 3
Bit 1 Bit 0 [12] A [12]
[4] IRTR = 1
[13] IRTR = 0
[13] IRTR = 1
Data 1
Data 2
Data 3
User processing
[6] IRIC clearance
[11] IRIC clearance [10] ICDR read (data 2) [9] TRS set to 1
[14] IRIC clearance [15] WAIT cleared to 0 IRIC clearance [17] Stop condition issued
[7] ACKB set to 1
[16] ICDR read (data 3)
Figure 15-13 Example of Master Receive Mode Stop Condition Generation Timing (MLS = ACKB = 0, WAIT = 1) 15.3.5 Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the slave device returns an acknowledge signal. The slave device compares its own address with the slave address in the first frame following the establishment of the start condition issued by the master device. If the addresses match, the slave device operates as the slave device designated by the master device. Figure 15-14 is a flowchart showing an example of slave receive mode operation.
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Start Initialize Set MST = 0 and TRS = 0 in ICCR Set ACKB = 0 in ICSR Read IRIC in ICCR No [2] IRIC = 1? Yes [1]
Read AAS and ADZ in ICSR AAS = 1 and ADZ = 0? Yes Read TRS in ICCR TRS = 0? Yes Last receive? No Read ICDR Clear IRIC in ICCR Yes No Slave transmit mode No General call address processing * Description omitted
[3] [1] Select slave receive mode [2] Wait for the first byte to be received (slave address) [3] Start receiving. The first read is a dummy read [4]
Read IRIC in ICCR No IRIC = 1? Yes
[4] Wait for the transfer to end [5] Set acknowledge data for the last receive [6] Start the last receive [7] Wait for the transfer to end
Set ACKB = 0 in ICSR Read ICDR Clear IRIC in ICCR
[5] [6]
[8] Read the last receive data
Read IRIC in ICCR No IRIC = 1? Yes Read ICDR Clear IRIC in ICCR End
[7]
[8]
Figure 15-14 Flowchart for Slave Transmit Mode (Example)
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The reception procedure and operations in slave receive mode are described below. [1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR according to the operating mode. [2] When the start condition output by the master device is detected, the BBSY flag in ICCR is set to 1. [3] When the slave address matches in the first frame following the start condition, the device operates as the slave device specified by the master device. If the 8th data bit (R/W) is 0, the TRS bit in ICCR remains cleared to 0, and slave receive operation is performed. [4] At the 9th clock pulse of the receive frame, the slave device drives SDA low and returns an acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in ICCR has been set to 1, an interrupt request is sent to the CPU. If the RDRF internal flag has been cleared to 0, it is set to 1, and the receive operation continues. If the RDRF internal flag has been set to 1, the slave device drives SCL low from the fall of the receive clock until data is read into ICDR. [5] Read ICDR and clear the IRIC flag in ICCR to 0. The RDRF flag is cleared to 0. Receive operations can be performed continuously by repeating steps [4] and [5]. When SDA is changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in ICCR is cleared to 0.
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Start condition issuance SCL (master output) SCL (slave output) SDA (master output) SDA (slave output)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6
1
2
3
4
5
6
7
8
9
1
2
Slave address
R/W
[4] A
Data 1
RDRF
IRIC
Interrupt request generation Address + R/W
ICDRS
ICDRR
Address + R/W
User processing
[5] ICDR read
[5] IRIC clearance
Figure 15-15 Example of Slave Receive Mode Operation Timing (1) (MLS = ACKB = 0)
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SCL (master output) SCL (slave output) SDA (master output)
7
8
9
1
2
3
4
5
6
7
8
9
Bit 1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Data 1 SDA (slave output)
[4]
Data 2
[4]
A
A
RDRF
IRIC
Interrupt request generation Data 1 Data 2
Interrupt request generation
ICDRS
ICDRR
Data 1
Data 2
User processing
[5] ICDR read [5] IRIC clearance
Figure 15-16 Example of Slave Receive Mode Operation Timing (2) (MLS = ACKB = 0)
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15.3.6
Slave Transmit Operation
In slave transmit operation, the slave device compares its own address with the slave address transmitted by the master device in the first frame (address receive frame) following detection of the start condition. If the addresses match and the 8th bit (R/W) is set to 1 (read), the TRS bit in ICCR is automatically set to 1 and slave transmit mode is activated. Figure 15-17 is a flowchart showing an example of slave transmit mode operation.
Slave transmit mode Clear IRIC in ICCR [1] Set transmit data for the second and subsequent bytes [1] [2] Wait for 1 byte to be transmitted [3] Test for end of transfer Clear IRIC in ICCR [4] Select slave receive mode [5] Dummy read (to release the SCL line) Read IRIC in ICCR No [2] IRIC = 1? Yes Read ACKB in ICSR End of transmission (ACKB = 1)? Yes Set TRS = 0 in ICCR Read ICDR Clear IRIC in ICCR [4] [3]
Write transmit data in ICDR
No
[5]
End
Figure 15-17 Flowchart for Slave Receive Mode (Example)
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In slave transmit mode, the slave device outputs the transmit data, while the master device outputs the receive clock and returns an acknowledge signal. The transmission procedure and operations in slave transmit mode are described below. [1] Set the ICE bit in ICCR to 1. Set the MLS bit in ICMR and the MST and TRS bits in ICCR according to the operating mode. [2] When the slave address matches in the first frame following detection of the start condition, the slave device drives SDA low at the 9th clock pulse and returns an acknowledge signal. At the same time, the IRIC flag in ICCR is set to 1. If the IEIC bit in ICCR has been set to 1, an interrupt request is sent to the CPU. If the 8th data bit (R/W) is 1, the TRS bit in ICCR is set to 1, and the mode changes to slave transmit mode automatically. The TDRF flag is set to 1. The slave device drives SCL low from the fall of the transmit clock until ICDR data is written. [3] After clearing the IRIC flag to 0, write data to ICDR. The TDRE internal flag is cleared to 0. The written data is transferred to ICDRS, and the TDRE internal flag and the IRIC and IRTR flags are set to 1 again. After clearing the IRIC flag to 0, write the next data to ICDR. The slave device sequentially sends the data written into ICDR in accordance with the clock output by the master device at the timing shown in figure 15-18. [4] When one frame of data has been transmitted, the IRIC flag in ICCR is set to 1 at the rise of the 9th transmit clock pulse. If the TDRE internal flag has been set to 1, this slave device drives SCL low from the fall of the transmit clock until data is written to ICDR. The master device drives SDA low at the 9th clock pulse, and returns an acknowledge signal. As this acknowledge signal is stored in the ACKB bit in ICSR, this bit can be used to determine whether the transfer operation was performed normally. When the TDRE internal flag is 0, the data written into ICDR is transferred to ICDRS, transmission is started, and the TDRE internal flag and the IRIC and IRTR flags are set to 1 again. [5] To continue transmission, clear the IRIC flag to 0, then write the next data to be transmitted into ICDR. The TDRE flag is cleared to 0. Transmit operations can be performed continuously by repeating steps [4] and [5]. To end transmission, write H'FF to ICDR to release SDA on the slave side. When SDA is changed from low to high when SCL is high, and the stop condition is detected, the BBSY flag in ICCR is cleared to 0.
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Slave receive mode SCL (master output) SDA (slave output)
Slave transmit mode
8
9
1
2
3
4
5
6
7
8
9
1
2
SDA (slave output) SDA (slave output) R/W
A [2]
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6
Data 1 A
Data 2
TDRE
[4]
IRIC
Interrupt request generation
Interrupt request generation
Interrupt request generation
ICDRT
Data 1
Data 2
ICDRS
Data 1
Data 2
User processing
[3] IRIC clearance
[3] ICDR write
[3] ICDR write
[5] IRIC clearance
[5] ICDR write
Figure 15-18 Example of Slave Transmit Mode Operation Timing (MLS = 0)
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15.3.7
IRIC Setting Timing and SCL Control
The interrupt request flag (IRIC) is set at different times depending on the WAIT bit in ICMR, the FS bit in SAR, and the FSX bit in SARX. If the TDRE or RDRF internal flag is set to 1, SCL is automatically held low after one frame has been transferred; this timing is synchronized with the internal clock. Figure 15-19 shows the IRIC set timing and SCL control.
(a) When WAIT = 0, and FS = 0 or FSX = 0 (I2C bus format, no wait) SCL 7 8 9 1
SDA IRIC
7
8
A
1
User processing
Clear IRIC
Write to ICDR (transmit) or read ICDR (receive)
(b) When WAIT = 1, and FS = 0 or FSX = 0 (I2C bus format, wait inserted) SCL 8 9 1
SDA IRIC
8
A
1
User processing
Clear IRIC
Clear Write to ICDR (transmit) IRIC or read ICDR (receive)
(c) When FS = 1 and FSX = 1 (synchronous serial format) SCL 7 8 1
SDA IRIC
7
8
1
User processing
Clear IRIC
Write to ICDR (transmit) or read ICDR (receive)
Figure 15-19 IRIC Setting Timing and SCL Control
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15.3.8
Operation Using the DTC
The I2C bus format provides for selection of the slave device and transfer direction by means of the slave address and the R/W bit, confirmation of reception with the acknowledge bit, indication of the last frame, and so on. Therefore, continuous data transfer using the DTC must be carried out in conjunction with CPU processing by means of interrupts. Table 15-5 shows some examples of processing using the DTC. These examples assume that the number of transfer data bytes is known in slave mode. Table 15-5 Examples of Operation Using the DTC
Item Master Transmit Mode Master Receive Mode Transmission by CPU (ICDR write) Slave Transmit Mode Reception by CPU (ICDR read) Slave Receive Mode Reception by CPU (ICDR read)
Slave address + Transmission by R/W bit DTC (ICDR write) transmission/ reception Dummy data read Actual data transmission/ reception Dummy data (H'FF) write Last frame processing Transfer request processing after last frame processing Setting of number of DTC transfer data frames — Transmission by DTC (ICDR write) — Not necessary 1st time: Clearing by CPU 2nd time: End condition issuance by CPU
Processing by CPU (ICDR read) Reception by DTC (ICDR read) — Reception by CPU (ICDR read) Not necessary
— Transmission by DTC (ICDR write) Processing by DTC (ICDR write) Not necessary
— Reception by DTC (ICDR read) — Reception by CPU (ICDR read)
Automatic clearing Not necessary on detection of end condition during transmission of dummy data (H'FF) Transmission: Reception: Actual Actual data count data count + 1 (+1 equivalent to dummy data (H'FF))
Transmission: Reception: Actual Actual data count data count + 1 (+1 equivalent to slave address + R/W bits)
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15.3.9
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched internally. Figure 15-20 shows a block diagram of the noise canceler circuit. The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA) input signal is sampled on the system clock, but is not passed forward to the next circuit unless the outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C SCL or SDA input signal D Latch Q D
C Q Latch Match detector Internal SCL or SDA signal
System clock period Sampling clock
Figure 15-20 Block Diagram of Noise Canceler 15.3.10 Initialization of Internal State The IIC has a function for forcible initialization of its internal state if a deadlock occurs during communication. Initialization is executed by (1) setting bits CLR3 to CLR0 in the DDCSWR register or (2) clearing the ICE bit. For details of settings for bits CLR3 to CLR0, see section 15.2.8, DDC Switch Register (DDCSWR). Scope of Initialization: The initialization executed by this function covers the following items: • TDRE and RDRF internal flags • Transmit/receive sequencer and internal operating clock counter • Internal latches for retaining the output state of the SCL and SDA pins (wait, clock, data output, etc.)
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The following items are not initialized: • Actual register values (ICDR, SAR, SARX, ICMR, ICCR, ICSR, DDCSWR, and STCR) • Internal latches used to retain register read information for setting/clearing flags in the ICMR, ICCR, ICSR, and DDCSWR registers • The value of the ICMR register bit counter (BC2 to BC0) • Generated interrupt sources (interrupt sources transferred to the interrupt controller) Notes on Initialization: • Interrupt flags and interrupt sources are not cleared, and so flag clearing measures must be taken as necessary. • Basically, other register flags are not cleared either, and so flag clearing measures must be taken as necessary. • When initialization is performed by means of the DDCSWR register, the write data for bits CLR3 to CLR0 is not retained. To perform IIC clearance, bits CLR3 to CLR0 must be written to simultaneously using an MOV instruction. Do not use a bit manipulation instruction such as BCLR. Similarly, when clearing is required again, all the bits must be written to simultaneously in accordance with the setting. • If a flag clearing setting is made during transmission/reception, the IIC module will stop transmitting/receiving at that point and the SCL and SDA pins will be released. When transmission/reception is started again, register initialization, etc., must be carried out as necessary to enable correct communication as a system. The value of the BBSY bit cannot be modified directly by this module clear function, but since the stop condition pin waveform is generated according to the state and release timing of the SCL and SDA pins, the BBSY bit may be cleared as a result. Similarly, state switching of other bits and flags may also have an effect. To prevent problems caused by these factors, the following procedure should be used when initializing the IIC state. 1. Execute initialization of the internal state according to the setting of bits CLR3 to CLR0, or according to the ICE bit. 2. Execute a stop condition issuance instruction (write 0 to BBSY and SCP) to clear the BBST bit to 0, and wait for two transfer rate clock cycles. 3. Re-execute initialization of the internal state according to the setting of bits CLR3 to CLR0, or according to the ICE bit. 4. Initialize (re-set) the IIC registers.
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15.4
Usage Notes
• In master mode, if an instruction to generate a start condition is immediately followed by an instruction to generate a stop condition, neither condition will be output correctly. To output consecutive start and stop conditions, after issuing the instruction that generates the start condition, read the relevant ports, check that SCL and SDA are both low, then issue the instruction that generates the stop condition. Note that SCL may not yet have gone low when BBSY is cleared to 0. • Either of the following two conditions will start the next transfer. Pay attention to these conditions when reading or writing to ICDR. ⎯ Write access to ICDR when ICE = 1 and TRS = 1 (including automatic transfer from ICDRT to ICDRS) ⎯ Read access to ICDR when ICE = 1 and TRS = 0 (including automatic transfer from ICDRS to ICDRR) • Table 15-6 shows the timing of SCL and SDA output in synchronization with the internal clock. Timings on the bus are determined by the rise and fall times of signals affected by the bus load capacitance, series resistance, and parallel resistance. Table 15-6 I2C Bus Timing (SCL and SDA Output)
Item SCL output cycle time SCL output high pulse width SCL output low pulse width SDA output bus free time Start condition output hold time Retransmission start condition output setup time Stop condition output setup time Data output setup time (master) Data output setup time (slave) Data output hold time tSDAHO Symbol tSCLO tSCLHO tSCLLO tBUFO tSTAHO tSTASO tSTOSO tSDASO Output Timing 28 tcyc to 256 tcyc 0.5 tSCLO 0.5 tSCLO 0.5 tSCLO – 1 tcyc 0.5 tSCLO – 1 tcyc 1 tSCLO 0.5 tSCLO + 2 tcyc 1 tSCLLO – 3 tcyc 1 tSCLL – 3 tcyc 3 tcyc ns Unit ns ns ns ns ns ns ns ns Notes Figure 24-28 (reference)
• SCL and SDA input is sampled in synchronization with the internal clock. The AC timing therefore depends on the system clock cycle tcyc, as shown in tables 24-19, 24-31, 24-43 in section 24, Electrical Characteristics. Note that the I2C bus interface AC timing specifications will not be met with a system clock frequency of less than 5 MHz.
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• The I2C bus interface specification for the SCL rise time tsr is under 1000 ns (300 ns for highspeed mode). In master mode, the I2C bus interface monitors the SCL line and synchronizes one bit at a time during communication. If tsr (the time for SCL to go from low to VIH) exceeds the time determined by the input clock of the I2C bus interface, the high period of SCL is extended. The SCL rise time is determined by the pull-up resistance and load capacitance of the SCL line. To insure proper operation at the set transfer rate, adjust the pull-up resistance and load capacitance so that the SCL rise time does not exceed the values given in the table 15-7. Table 15-7 Permissible SCL Rise Time (tSr) Values
Time Indication tcyc IICX Indication 0 7.5 tcyc Standard mode High-speed mode Standard mode High-speed mode I C Bus Specification φ = (Max.) 5 MHz 1000 ns 300 ns 1000 ns 300 ns 1000 ns 300 ns 1000 ns 300 ns
2
φ= 8 MHz 937 ns 300 ns 1000 ns 300 ns
φ= 10 MHz 750 ns 300 ns 1000 ns 300 ns
φ= φ= 16 MHz 20 MHz 468 ns 300 ns 375 ns 300 ns
1
17.5 tcyc
1000 ns 875 ns 300 ns 300 ns
• The I2C bus interface specifications for the SCL and SDA rise and fall times are under 1000 ns and 300 ns. The I2C bus interface SCL and SDA output timing is prescribed by tScyc and tcyc, as shown in table 15-6. However, because of the rise and fall times, the I2C bus interface specifications may not be satisfied at the maximum transfer rate. Table 15-8 shows output timing calculations for different operating frequencies, including the worst-case influence of rise and fall times. tBUFO fails to meet the I2C bus interface specifications at any frequency. The solution is either (a) to provide coding to secure the necessary interval (approximately 1 µs) between issuance of a stop condition and issuance of a start condition, or (b) to select devices whose input timing permits this output timing for use as slave devices connected to the I2C bus. tSCLLO in high-speed mode and tSTASO in standard mode fail to satisfy the I2C bus interface specifications for worst-case calculations of tSr/tSf. Possible solutions that should be investigated include (a) adjusting the rise and fall times by means of a pull-up resistor and capacitive load, (b) reducing the transfer rate to meet the specifications, or (c) selecting devices whose input timing permits this output timing for use as slave devices connected to the I2C bus.
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Table 15-8 I2C Bus Timing (with Maximum Influence of tSr/tSf)
Time Indication (at Maximum Transfer Rate) [ns] I2C Bus SpecifitSr/tSf Influence cation (Min.) (Max.) Standard mode –1000 4000 600 4700 1300 4700 1300 4000 600 4700 600 4000 600 250 100 250 100
Item tSCLHO
tcyc Indication 0.5 tSCLO (–tSr)
φ= 5 MHz 4000 950 4750 1000*1 3800*1 750*1 4550 800 9000 2200 4400 1350 3100 400 3100 400
φ= 8 MHz 4000 950 4750 1000*1 3875*1 825*1 4625 875 9000 2200 4250 1200 3325 625 3325 625
φ= 10 MHz 4000 950 4750 1000*1 3900*1 850*1 4650 900 9000 2200 4200 1150 3400 700 3400 700
φ= 16 MHz 4000 950 4750 1000*1 3938*1 888*1 4688 938 9000 2200 4125 1075 3513 813 3513 813
φ= 20 MHz 4000 950 4750 1000*1 3950*1 900*1 4700 950 9000 2200 4100 1050 3550 850 3550 850
High-speed –300 mode tSCLLO 0.5 tSCLO (–tSf ) Standard mode –250
High-speed –250 mode tBUFO 0.5 tSCLO – 1 tcyc ( –tSr ) Standard mode –1000
High-speed –300 mode Standard mode –250
tSTAHO
0.5 tSCLO – 1 tcyc (–tSf )
High-speed –250 mode Standard mode –1000
tSTASO
1 tSCLO (–tSr )
High-speed –300 mode tSTOSO 0.5 tSCLO + 2 tcyc (–tSr ) Standard mode –1000
High-speed –300 mode
tSDASO
(master) 3 tcyc
1 tSCLLO*2 – Standard –1000 mode (–tSr ) High-speed –300 mode Standard mode –1000
tSDASO
(slave)
1 tSCLL*2 – 3 tcyc*2 (–tSr )
High-speed –300 mode
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Time Indication (at Maximum Transfer Rate) [ns] tSr/tSf Influence (Max.) Standard mode 0 I2C Bus Specification (Min.) 0 0
Item tSDAHO
tcyc Indication 3 tcyc
φ= 5 MHz 600 600
φ= 8 MHz 375 375
φ= 10 MHz 300 300
φ= 16 MHz 188 188
φ= 20 MHz 150 150
High-speed 0 mode
2
Notes: 1. Does not meet the I C bus interface specification. Remedial action such as the following is necessary: (a) secure a start/stop condition issuance interval; (b) adjust the rise and fall times by means of a pull-up resistor and capacitive load; (c) reduce the transfer rate; (d) select slave devices whose input timing permits this output timing. The values in the above table will vary depending on the settings of the IICX bit and bits CKS0 to CKS2. Depending on the frequency it may not be possible to achieve the 2 maximum transfer rate; therefore, whether or not the I C bus interface specifications are met must be determined in accordance with the actual setting conditions. 2 2. Calculated using the I C bus specification values (standard mode: 4700 ns min.; highspeed mode: 1300 ns min.).
• Note on ICDR Read at End of Master Reception To halt reception at the end of a receive operation in master receive mode, set the TRS bit to 1 and write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high, and generates the stop condition. After this, receive data can be read by means of an ICDR read, but if data remains in the buffer the ICDRS receive data will not be transferred to ICDR, and so it will not be possible to read the second byte of data. If it is necessary to read the second byte of data, issue the stop condition in master receive mode (i.e. with the TRS bit cleared to 0). When reading the receive data, first confirm that the BBSY bit in the ICCR register is cleared to 0, the stop condition has been generated, and the bus has been released, then read the ICDR register with TRS cleared to 0. Note that if the receive data (ICDR data) is read in the interval between execution of the instruction for issuance of the stop condition (writing of 0 to BBSY and SCP in ICCR) and the actual generation of the stop condition, the clock may not be output correctly in subsequent master transmission. Clearing of the MST bit after completion of master transmission/reception, or other modifications of IIC control bits to change the transmit/receive operating mode or settings, must be carried out during interval (a) in figure 15-18 (after confirming that the BBSY bit has been cleared to 0 in the ICCR register).
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Stop condition (a) SDA SCL Internal clock BBSY bit Master receive mode ICDR reading prohibited Bit 0 8 A 9
Start condition
Execution of stop condition issuance instruction (0 written to BBSY and SCP)
Confirmation of stop condition generation (0 read from BBSY)
Start condition issuance
Figure 15-21 Points for Attention Concerning Reading of Master Receive Data
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• Notes on Start Condition Issuance for Retransmission Figure 15-22 shows the timing of start condition issuance for retransmission, and the timing for subsequently writing data to ICDR, together with the corresponding flowchart.
[1] Wait for end of 1-byte transfer IRIC = 1 ? Yes Clear IRIC in ICSR Start condition issuance? Yes Read SCL pin SCL = Low ? Yes Write BBSY = 1, SCP = 0 (ICSR) Read SCL pin SCL = High ? Yes Write transmit data to ICDR [5] No [4] [3] No [2] No Other processing [5] Set transmit data (slave address + R/W) Note: Program so that processing from [3] to [5] is executed continuously. No [1] [2] Determine whether SCL is low [3] Issue restart condition instruction for retransmission [4] Determine whether SCL is high
SCL
SDA
ACK Start condition (retransmission)
Bit 7
IRIC
[1] IRIC determination
[2] Determination of SCL = low
[4] Determination of SCL = high [5] ICDR write
[3] Start condition instruction issuance
Figure 15-22 Flowchart and Timing of Start Condition Instruction Issuance for Retransmission
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• Notes on I2C Bus Interface Stop Condition Instruction Issuance If the rise time of the 9th SCL acknowledge exceeds the specification because the bus load capacitance is large, or if there is a slave device of the type that drives SCL low to effect a wait, issue the stop condition instruction after reading SCL and determining it to be low, as shown below.
9th clock VIH High period secured
SCL
As waveform rise is late, SCL is detected as low SDA Stop condition IRIC [1] Determination of SCL = low [2] Stop condition instruction issuance
Figure 15-23 Timing of Stop Condition Issuance • Notes on IRIC Flag Clearance when Using Wait Function If the SCL rise time exceeds the designated duration or if the slave device is of the type that keeps SCL low and applies a wait state when the wait function is used in the master mode of the I2C bus interface, read SCL and clear the IRIC flag after determining that SCL has gone low, as shown below. Clearing the IRIC flag to 0 when WAIT is set to 1 and SCL is being held at high level can cause the SDA value to change before SCL goes low, resulting in a start condition or stop condition being generated erroneously.
SCL = high duration maintained
SCL
VIH
SCL = low detected SDA
IRIC
[1] Judgement that SCL = low [2] IRIC clearance
Figure 15-24 IRIC Flag Clearance in WAIT = 1 Status
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• Notes on ICDR Reads and ICCR Access in Slave Transmit Mode In a transmit operation in the slave mode of the I2C bus interface, do not read the ICDR register or read or write to the ICCR register during the period indicated by the shaded portion in figure 15-25. Normally, when interrupt processing is triggered in synchronization with the rising edge of the 9th clock cycle, the period in question has already elapsed when the transition to interrupt processing takes place, so there is no problem with reading the ICDR register or reading or writing to the ICCR register. To ensure that the interrupt processing is performed properly, one of the following two conditions should be applied. (1) Make sure that reading received data from the ICDR register, or reading or writing to the ICCR register, is completed before the next slave address receive operation starts. (2) Monitor the BC2 to BC0 counter in the ICMR register and, when the value of BC2 to BC0 is 000 (8th or 9th clock cycle), allow a waiting time of at least 2 transfer clock cycles in order to involve the problem period in question before reading from the ICDR register, or reading or writing to the ICCR register.
Waveforms if problem occurs SDA SCL TRS R/W 8 Address received Period when ICDR reads and ICCR reads and writes are prohibited (6 system clock cycles) A 9 Data transmission ICDR write Bit 7
Detection of 9th clock cycle rising edge
Figure 15-25 ICDR Read and ICCR Access Timing in Slave Transmit Mode
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2
• Notes on TRS Bit Setting in Slave Mode From the detection of the rising edge of the 9th clock cycle or of a stop condition to when the rising edge of the next SCL pin signal is detected (the period indicated as (a) in figure 15-26) in the slave mode of the I2C bus interface, the value set in the TRS bit in the ICCR register is effective immediately. However, at other times (indicated as (b) in figure 15-26) the value set in the TRS bit is put on hold until the next rising edge of the 9th clock cycle or stop condition is detected, rather than taking effect immediately. This results in the actual internal value of the TRS bit remaining 1 (transmit mode) and no acknowledge bit being sent at the 9th clock cycle address receive completion in the case of an address receive operation following a restart condition input with no stop condition intervening. When receiving an address in the slave mode, clear the TRS bit to 0 during the period indicated as (a) in figure 15-26. To cancel the holding of the SCL bit low by the wait function in the slave mode, clear the TRS bit to 0 and then perform a dummy read of the ICDR register.
Restart condition (a) SDA SCL TRS 8 9 1 2 3 4 5 6 7 8 (b) A 9
Data transmission
Address reception
TRS bit setting hold time ICDR dummy read TRS bit set Detection of 9th clock cycle rising edge Detection of 9th clock cycle rising edge
Figure 15-26 TRS Bit Setting Timing in Slave Mode
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• Notes on ICDR Reads in Transmit Mode and ICDR Writes in Receive Mode When attempting to read ICDR in the transmit mode (TRS = 1) or write to ICDR in the receive mode (TRS = 0) under certain conditions, the SCL pin may not be held low after the completion of the transmit or receive operation and a clock may not be output to the SCL bus line before the ICDR register access operation can take place properly. When accessing ICDR, always change the setting to the transmit mode before performing a read operation, and always change the setting to the receive mode before performing a write operation. • Notes on ACKE Bit and TRS Bit in Slave Mode When using the I2C bus interface, if an address is received in the slave mode immediately after 1 is received as an acknowledge bit (ACKB = 1) in the transmit mode (TRS = 1), an interrupt may be generated at the rising edge of the 9th clock cycle if the address does not match. When performing slave mode operations using the IIC bus interface module, make sure to do the following. (1) When a 1 is received as an acknowledge bit for the final transmit data after completing a series of transmit operations, clear the ACKE bit in the ICCR register to 0 to initialize the ACKB bit to 0. (2) In the slave mode, change the setting to the receive mode (TRS = 0) before the start condition is input. To ensure that the switch from the slave transmit mode to the slave receive mode is accomplished properly, end the transmission as described in figure 15-17. • Notes on Arbitration Lost in Master Mode The I2C bus interface recognizes the data in transmit/receive frame as an address when arbitration is lost in master mode and a transition to slave receive mode is automatically carried out. When arbitration is lost not in the first frame but in the second frame or subsequent frame, transmit/receive data that is not an address is compared with the value set in the SAR or SARX register as an address. If the receive data matches with the address in the SAR or SARX register, the I2C bus interface erroneously recognizes that the address call has occurred. (See figure 15-27.) In multi-master mode, a bus conflict could happen. When The I2C bus interface is operated in master mode, check the state of the AL bit in the ICSR register every time after one frame of data has been transmitted or received. When arbitration is lost during transmitting the second frame or subsequent frame, take avoidance measures.
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Section 15 I C Bus Interface [Option] (Only for the H8S/2638, H8S/2639, and H8S/2630)
2
• Arbitration is lost • The AL flag in ICSR is set to 1
bus interface (Master transmit mode)
I2C
S
SLA
R/W A
Transmit data match Transmit timing match
DATA1
Transmit data does not match
Other device (Master transmit mode)
S
SLA
R/W A
DATA2
A
DATA3
A
Data contention I2C bus interface (Slave receive mode) S SLA R/W A SLA R/W A DATA4 A
• Receive address is ignored
• Automatically transferred to slave receive mode • Receive data is recognized as an address • When the receive data matches to the address set in the SAR or SARX register, the I2C bus interface operates as a slave device.
Figure 15-27 Diagram of Erroneous Operation when Arbitration is Lost Though it is prohibited in the normal I2C protocol, the same problem may occur when the MST bit is erroneously set to 1 and a transition to master mode is occurred during data transmission or reception in slave mode. In multi-master mode, pay attention to the setting of the MST bit when a bus conflict may occur. In this case, the MST bit in the ICCR register should be set to 1 according to the order below. (a) Make sure that the BBSY flag in the ICCR register is 0 and the bus is free before setting the MST bit. (b) Set the MST bit to 1. (c) To confirm that the bus was not entered to the busy state while the MST bit is being set, check that the BBSY flag in the ICCR register is 0 immediately after the MST bit has been set. • Notes on Wait Operation in Master Mode During master mode operation using the wait function, when the interrupt flag IRIC bit is cleared from 1 to 0 between the falling edge of the 7th clock cycle and the falling edge of the 8th clock cycle, in some cases no wait is inserted after the falling edge of the 8th clock cycle and the clock pulse of the 9th clock cycle is output continuously. Observe the following with regard to clearing the IRIC flag while using the wait function. At the rising edge of the 9th clock cycle, set the IRIC flag to 1 and then clear it to zero before the rising edge of the 1st clock cycle (while the value of the BC2 to BC0 counter value is 2 or greater). If clearing of the IRIC flag is delayed by interrupt processing or the like and the BC counter value reaches 1 or 0, confirm that the SCL pin state is low-level after the BC2 to BC0 counter has reached 0 and then clear the IRIC flag. (See figure 15.28.)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
SDA
A
Transit/receive data
A
Transit/receive data
SCL
9
1
2
3
4
5
6
7
8 Confirm SCL pin
is low-level.
9
1
2
3
BC2 to BC0
0
7
6
5
4
3
2
1
Clear IRIC.
7
6
5
IRIC (operation example) IRIC flag can be cleared. IRIC flag can be cleared.
Clear IRIC when BC2 to BC0 ≥ 2.
IRIC flag cannot be cleared.
Figure 15-28 Timing of IRIC Flag Clearing During Wait Operation
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Section 16 Controller Area Network (HCAN)
Section 16 Controller Area Network (HCAN)
Notes: The H8S/2635 Group is not equipped with a DTC. Only a single HCAN channel, HCAN0, is implemented in the H8S/2635 Group.
16.1
Overview
The HCAN is a module for controlling a controller area network (CAN) for realtime communication in vehicular and industrial equipment systems, etc. The chip has a 2-channel onchip HCAN module. Reference: Bosch CAN Specification Version 2.0, 1991, Robert Bosch GmbH 16.1.1 Features
• CAN version: Bosch 2.0B active compatible ⎯ Communication systems: NRZ (Non-Return to Zero) system (with bit-stuffing function) Broadcast communication system ⎯ Transmission path: Bidirectional 2-wire serial communication ⎯ Communication speed: Max. 1 Mbps ⎯ Data length: 0 to 8 bytes • Number of channel: 2 (HCAN0, HCAN1) • Data buffers: 16 per channel (one receive-only buffer and 15 buffers settable for transmission/reception) • Data transmission: Choice of two methods: ⎯ Mailbox (buffer) number order (low-to-high) ⎯ Message priority (identifier) high-to-low order • Data reception: Two methods: ⎯ Message identifier match (transmit/receive-setting buffers) ⎯ Reception with message identifier masked (receive-only) • CPU interrupts: Two interrupt vectors for 12 interrupt causes per channel: ⎯ Error interrupt ⎯ Reset processing interrupt ⎯ Message reception interrupt (mailbox 1 to 15) ⎯ Message reception interrupt (mailbox 0) ⎯ Message transmission interrupt
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Section 16 Controller Area Network (HCAN)
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• HCAN operating modes: Support for various modes: ⎯ Hardware reset ⎯ Software reset ⎯ Normal status (error-active, error-passive) ⎯ Bus off status ⎯ HCAN configuration mode ⎯ HCAN sleep mode ⎯ HCAN halt mode • Other features: DTC can be activated by message reception mailbox (HCAN mailbox 0 only)
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Section 16 Controller Area Network (HCAN)
16.1.2
Block Diagram
Figure 16-1 shows a block diagram of the HCAN.
HCAN0 MBI Message buffer Mailboxes Message control Message data MC0 to MC15, MD0 to MD15 LAFM (CDLC) CAN Data Link Controller Bosch CAN 2.0B active HTxD0
Tx buffer
MPI Microprocessor interface
Peripheral address bus
Rx buffer
HRxD0
Peripheral data bus
CPU interface Control register Status register
HCAN1 MBI Message buffer Mailboxes Message control Message data MC0 to MC15, MD0 to MD15 (CDLC) CAN Data Link Controller Bosch CAN 2.0B active HTxD1
LAFM
Tx buffer
MPI Microprocessor interface CPU interface Control register Status register
Rx buffer
HRxD1
Figure 16-1 HCAN Block Diagram
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Message Buffer Interface (MBI): The MBI, consisting of mailboxes and a local acceptance filter mask (LAFM), stores CAN transmit/receive messages (identifiers, data, etc.). Transmit messages are written by the CPU. For receive messages, the data received by the CDLC is stored automatically. Microprocessor Interface (MPI): The MPI, consisting of a bus interface, control register, status register, etc., controls HCAN internal data, statuses, and so forth. CAN Data Link Controller (CDLC): The CDLC performs transmission and reception of messages conforming to the Bosch CAN Ver. 2.0B active standard (data frames, remote frames, error frames, overload frames, inter-frame spacing), as well as CRC checking, bus arbitration, and other functions. 16.1.3 Pin Configuration
Table 16-1 shows the HCAN’s pins. When using HCAN pins, settings must be made in the HCAN configuration mode (during initialization: MCR0 = 1 and GSR3 = 1). Table 16-1 HCAN Pins
Channel 0 Name HCAN transmit data pin 0 HCAN receive data pin 0 1* HCAN transmit data pin 1 HCAN receive data pin 1 Abbreviation HTxD0 HRxD0 HTxD1 HRxD1 Input/Output Output Input Output Input Function Channel 0 CAN bus transmission pin Channel 0 CAN bus reception pin Channel 1 CAN bus transmission pin Channel 1 CAN bus reception pin
Note: * The HCAN1 is not supported by the H8S/2635 Group.
A bus driver is necessary between the pins and the CAN bus. A HA13721 compatible model is recommended.
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Section 16 Controller Area Network (HCAN)
16.1.4
Register Configuration
Table 16-2 lists the HCAN’s registers. Table 16-2 HCAN Registers
Channel 0 Name Master control register General status register Bit configuration register Mailbox configuration register Transmit wait register Transmit wait cancel register Transmit acknowledge register Abort acknowledge register Receive complete register Remote request register Interrupt register Mailbox interrupt mask register Interrupt mask register Receive error counter Transmit error counter Unread message status register Local acceptance filter mask L Local acceptance filter mask H Abbreviation MCR GSR BCR MBCR TXPR TXCR TXACK ABACK RXPR RFPR IRR MBIMR IMR REC TEC UMSR LAFML LAFMH R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R R R/W R/W R/W Initial Value H'01 H'0C Address* H'F800 H'F801
1
Access Size 8 bits 16 bits 8 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8 bits 16 bits 8 bits 8/16 bits 8/16 bits 8/16 bits
H'0000 H'F802 H'0100 H'F804 H'0000 H'F806 H'0000 H'F808 H'0000 H'F80A H'0000 H'F80C H'0000 H'F80E H'0000 H'F810 H'0100 H'F812 H'FFFF H'F814 H'FEFF H'F816 H'00 H'00 H'F818 H'F819
H'0000 H'F81A H'0000 H'F81C H'0000 H'F81E
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Channel Name 0 Message control 0 [1:8] Message control 1 [1:8] Message control 2 [1:8] Message control 3 [1:8] Message control 4 [1:8] Message control 5 [1:8] Message control 6 [1:8] Message control 7 [1:8] Message control 8 [1:8] Message control 9 [1:8] Message control 10 [1:8] Message control 11 [1:8] Message control 12 [1:8] Message control 13 [1:8] Message control 14 [1:8] Message control 15 [1:8] Message data 0 [1:8] Message data 1 [1:8] Message data 2 [1:8] Message data 3 [1:8] Message data 4 [1:8] Message data 5 [1:8] Message data 6 [1:8] Message data 7 [1:8] Message data 8 [1:8] Message data 9 [1:8] Message data 10 [1:8] Message data 11 [1:8] Message data 12 [1:8] Message data 13 [1:8] Message data 14 [1:8] Message data 15 [1:8]
Abbreviation R/W MC0 [1:8] MC1 [1:8] MC2 [1:8] MC3 [1:8] MC4 [1:8] MC5 [1:8] MC6 [1:8] MC7 [1:8] MC8 [1:8] MC9 [1:8] MC10 [1:8] MC11 [1:8] MC12 [1:8] MC13 [1:8] MC14 [1:8] MC15 [1:8] MD0 [1:8] MD1 [1:8] MD2 [1:8] MD3 [1:8] MD4 [1:8] MD5 [1:8] MD6 [1:8] MD7 [1:8] MD8 [1:8] MD9 [1:8] MD10 [1:8] MD11 [1:8] MD12 [1:8] MD13 [1:8] MD14 [1:8] MD15 [1:8] R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Access 1 Address* Size H'F820 H'F828 H'F830 H'F838 H'F840 H'F848 H'F850 H'F858 H'F860 H'F868 H'F870 H'F878 H'F880 H'F888 H'F890 H'F898 H'F8B0 H'F8B8 H'F8C0 H'F8C8 H'F8D0 H'F8D8 H'F8E0 H'F8E8 H'F8F0 H'F8F8 H'F900 H'F908 H'F910 H'F918 H'F920 H'F928 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits
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Section 16 Controller Area Network (HCAN)
Channel
2 1*
Name Master control register General status register Bit configuration register Mailbox configuration register Transmit wait register Transmit wait cancel register Transmit acknowledge register Abort acknowledge register Receive complete register Remote request register Interrupt register Mailbox interrupt mask register Interrupt mask register Receive error counter Transmit error counter Unread message status register Local acceptance filter mask L Local acceptance filter mask H
Abbreviation MCR GSR BCR MBCR TXPR TXCR TXACK ABACK RXPR RFPR IRR MBIMR IMR REC TEC UMSR LAFML LAFMH
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R R R/W R/W R/W
Initial Value H'01 H'0C
Address* H'FA00 H'FA01
1
Access Size 8 bits 16 bits 8 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8 bits 16 bits 8 bits 8/16 bits 8/16 bits 8/16 bits
H'0000 H'FA02 H'0100 H'FA04 H'0000 H'FA06 H'0000 H'FA08 H'0000 H'FA0A H'0000 H'FA0C H'0000 H'FA0E H'0000 H'FA10 H'0100 H'FA12 H'FFFF H'FA14 H'FEFF H'FA16 H'00 H'00 H'FA18 H'FA19
H'0000 H'FA1A H'0000 H'FA1C H'0000 H'FA1E
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Channel Name 2 1* Message control 0 [1:8] Message control 1 [1:8] Message control 2 [1:8] Message control 3 [1:8] Message control 4 [1:8] Message control 5 [1:8] Message control 6 [1:8] Message control 7 [1:8] Message control 8 [1:8] Message control 9 [1:8] Message control 10 [1:8] Message control 11 [1:8] Message control 12 [1:8] Message control 13 [1:8] Message control 14 [1:8] Message control 15 [1:8] Message data 0 [1:8] Message data 1 [1:8] Message data 2 [1:8] Message data 3 [1:8] Message data 4 [1:8] Message data 5 [1:8] Message data 6 [1:8] Message data 7 [1:8] Message data 8 [1:8] Message data 9 [1:8] Message data 10 [1:8] Message data 11 [1:8] Message data 12 [1:8] Message data 13 [1:8] Message data 14 [1:8] Message data 15 [1:8] All Module stop control register C
Abbreviation R/W MC0 [1:8] MC1 [1:8] MC2 [1:8] MC3 [1:8] MC4 [1:8] MC5 [1:8] MC6 [1:8] MC7 [1:8] MC8 [1:8] MC9 [1:8] MC10 [1:8] MC11 [1:8] MC12 [1:8] MC13 [1:8] MC14 [1:8] MC15 [1:8] MD0 [1:8] MD1 [1:8] MD2 [1:8] MD3 [1:8] MD4 [1:8] MD5 [1:8] MD6 [1:8] MD7 [1:8] MD8 [1:8] MD9 [1:8] MD10 [1:8] MD11 [1:8] MD12 [1:8] MD13 [1:8] MD14 [1:8] MD15 [1:8] MSTPCRC R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined H'FF
Access 1 Address* Size H'FA20 H'FA28 H'FA30 H'FA38 H'FA40 H'FA48 H'FA50 H'FA58 H'FA60 H'FA68 H'FA70 H'FA78 H'FA80 H'FA88 H'FA90 H'FA98 H'FAB0 H'FAB8 H'FAC0 H'FAC8 H'FAD0 H'FAD8 H'FAE0 H'FAE8 H'FAF0 H'FAF8 H'FB00 H'FB08 H'FB10 H'FB18 H'FB20 H'FB28 H'FDEA 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits 8/16 bits
Notes: 1. Lower 16 bits of the address. 2. The HCAN1 is not supported by the H8S/2635 Group.
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Section 16 Controller Area Network (HCAN)
16.2
16.2.1
Register Descriptions
Master Control Register (MCR)
The master control register (MCR) is an 8-bit readable/writable register that controls the CAN interface.
MCR Bit: Initial value: R/W: 7 MCR7 0 R/W 6 — 0 R 5 MCR5 0 R/W 4 — 0 R 3 — 0 R 2 MCR2 0 R/W 1 MCR1 0 R/W 0 MCR0 1 R/W
Bit 7—HCAN Sleep Mode Release (MCR7): Enables or disables HCAN sleep mode release by bus operation.
Bit 7: MCR7 0 1 Description HCAN sleep mode release by CAN bus operation disabled HCAN sleep mode release by CAN bus operation enabled (Initial value)
Bit 6—Reserved: This bit always reads 0. The write value should always be 0. Bit 5—HCAN Sleep Mode (MCR5): Enables or disables HCAN sleep mode transition.
Bit 5: MCR5 0 1 Description HCAN sleep mode released Transition to HCAN sleep mode enabled (Initial value)
Bits 4 and 3—Reserved: These bits always read 0. The write value should always be 0. Bit 2—Message Transmission Method (MCR2): Selects the transmission method for transmit messages.
Bit 2: MCR2 0 1 Description Transmission order determined by message identifier priority (Initial value) Transmission order determined by mailbox (buffer) number priority (TXPR1 > TXPR15)
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Bit 1—Halt Request (MCR1): Controls halting of the HCAN module.
Bit 1: MCR1 0 1 Description HCAN normal operating mode HCAN halt mode transition request (Initial value)
Bit 0—Reset Request (MCR0): Controls resetting of the HCAN module.
Bit 0: MCR0 0 Description Normal operating mode (MCR0 = 0 and GSR3 = 0) [Setting condition] • 1 When 0 is written after an HCAN reset (Initial value) HCAN reset mode transition request
In order for GSR3 to change from 1 to 0 after 0 is written to MCR0, time is required before the HCAN is internally reset. There is consequently a delay before GSR3 is cleared to 0 after MCR0 is cleared to 0. 16.2.2 General Status Register (GSR)
The general status register (GSR) is an 8-bit readable register that indicates the status of the CAN bus.
GSR Bit: Initial value: R/W: 7 — 0 R 6 — 0 R 5 — 0 R 4 — 0 R 3 GSR3 1 R 2 GSR2 1 R 1 GSR1 0 R 0 GSR0 0 R
Bits 7 to 4—Reserved: These bits always read 0.
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Section 16 Controller Area Network (HCAN)
Bit 3—Reset Status Bit (GSR3): Indicates whether the HCAN module is in the normal operating state or the reset state. Writes are invalid.
Bit 3: MCR3 0 Description Normal operating state [Setting condition] • 1 After an HCAN internal reset Configuration mode [Reset condition] • MCR0 reset mode and sleep mode (Initial value)
Bit 2—Message Transmission Status Flag (GSR2): Flag that indicates whether the module is currently in the message transmission period. The “message transmission period” is the period from the start of message transmission (SOF) until the end of a 3-bit intermission interval after EOF (End of Frame). Writes are invalid.
Bit 2: GSR2 0 1 Description Message transmission period [Reset condition] • Idle period (Initial value)
Bit 1—Transmit/Receive Warning Flag (GSR1): Flag that indicates an error warning. Writes are invalid.
Bit 1: GSR1 0 1 Description [Reset condition] • When TEC < 96 and REC < 96 or TEC ≥ 256 (Initial value) When TEC ≥ 96 or REC ≥ 96
Bit 0—Bus Off Flag (GSR0): Flag that indicates the bus off state. Writes are invalid.
Bit 0: GSR0 0 1 Description [Reset condition] • Recovery from bus off state (Initial value) When TEC ≥ 256 (bus off state)
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16.2.3
Bit Configuration Register (BCR)
The bit configuration register (BCR) is a 16-bit readable/writable register that is used to set CAN bit timing parameters and the baud rate prescaler.
BCR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 BCR7 0 R/W 7 BCR15 0 R/W 14 BCR6 0 R/W 6 BCR14 0 R/W 13 BCR5 0 R/W 5 BCR13 0 R/W 12 BCR4 0 R/W 4 BCR12 0 R/W 11 BCR3 0 R/W 3 BCR11 0 R/W 10 BCR2 0 R/W 2 BCR10 0 R/W 9 BCR1 0 R/W 1 BCR9 0 R/W 8 BCR0 0 R/W 0 BCR8 0 R/W
Bits 15 and 14—Resynchronization Jump Width (SJW): These bits set the bit synchronization range.
Bit 15: BCR7 0 1 Bit 14: BCR6 0 1 0 1 Description Bit synchronization width = 1 time quantum Bit synchronization width = 2 time quanta Bit synchronization width = 3 time quanta Bit synchronization width = 4 time quanta (Initial value)
Bits 13 to 8—Baud Rate Prescaler (BRP): These bits are used to set the CAN bus baud rate.
Bit 13: BCR5 0 0 0 ⋅ ⋅ ⋅ 1 Bit 12: BCR4 0 0 0 ⋅ ⋅ ⋅ 1 Bit 11: BCR3 0 0 0 ⋅ ⋅ ⋅ 1 Bit 10: BCR2 0 0 0 ⋅ ⋅ ⋅ 1 Bit 9: BCR1 0 0 1 ⋅ ⋅ ⋅ 1 Bit 8: BCR0 0 1 0 ⋅ ⋅ ⋅ 1 Description 2 × system clock 4 × system clock 6 × system clock ⋅ ⋅ ⋅ 128 × system clock (Initial value)
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Section 16 Controller Area Network (HCAN)
Bit 7—Bit Sample Point (BSP): Sets the point at which data is sampled.
Bit 7: BCR15 0 1 Description Bit sampling at one point (end of time segment 1 (TSEG1)) (Initial value)
Bit sampling at three points (end of time segment 1 (TSEG1) and preceding and following time quanta)
Bits 6 to 4—Time Segment 2 (TSEG2): These bits are used to set the segment for correcting 1bit time error. A value from 2 to 8 can be set.
Bit 6: BCR14 0 Bit 5: BCR13 0 1 1 0 1 Bit 4: BCR12 0 1 0 1 0 1 0 1 Description Setting prohibited TSEG2 = 2 time quanta TSEG2 = 3 time quanta TSEG2 = 4 time quanta TSEG2 = 5 time quanta TSEG2 = 6 time quanta TSEG2 = 7 time quanta TSEG2 = 8 time quanta (Initial value)
Bits 3 to 0—Time Segment 1 (TSEG1): These bits are used to set the segment for absorbing output buffer, CAN bus, and input buffer delay. A value from 1 to 16 can be set.
Bit 3: BCR11 0 0 0 0 0 ⋅ ⋅ ⋅ 1 Bit 2: BCR10 0 0 0 0 1 ⋅ ⋅ ⋅ 1 Bit 1: BCR9 0 0 1 1 0 ⋅ ⋅ ⋅ 1 Bit 0: BCR8 0 1 0 1 0 ⋅ ⋅ ⋅ 1 Description Setting prohibited Setting prohibited Setting prohibited TSEG1 = 4 time quanta TSEG1 = 5 time quanta ⋅ ⋅ ⋅ TSEG1 = 16 time quanta (Initial value)
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.2.4
Mailbox Configuration Register (MBCR)
The mailbox configuration register (MBCR) is a 16-bit readable/writable register that is used to set mailbox (buffer) transmission/reception.
MBCR Bit: Initial value: R/W: Bit: Initial value: R/W: 15
MBCR7
14
MBCR6
13
MBCR5
12
MBCR4
11
MBCR3
10
MBCR2
9
MBCR1
8 — 1 R 0
MBCR8
0 R/W 7 0 R/W
0 R/W 6 0 R/W
0 R/W 5 0 R/W
0 R/W 4 0 R/W
0 R/W 3 0 R/W
0 R/W 2 0 R/W
0 R/W 1
MBCR9
MBCR15 MBCR14 MBCR13 MBCR12 MBCR11 MBCR10
0 R/W
0 R/W
Bits 15 to 9 and 7 to 0—Mailbox Setting Register (MBCR7 to MBCR1, MBCR15 to MBCR8): These bits set the polarity of the corresponding mailboxes.
Bit y: MBCRx 0 1 Description Corresponding mailbox is set for transmission Corresponding mailbox is set for reception (x = 15 to 1, y = 15 to 9 and 7 to 0) (Initial value)
Bit 8—Reserved: This bit always reads 1. The write value should always be 1.
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Section 16 Controller Area Network (HCAN)
16.2.5
Transmit Wait Register (TXPR)
The transmit wait register (TXPR) is a 16-bit readable/writable register that is used to set a transmit wait after a transmit message is stored in a mailbox (buffer) (CAN bus arbitration wait).
TXPR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 TXPR7 0 R/W 7 0 R/W 14 TXPR6 0 R/W 6 0 R/W 13 TXPR5 0 R/W 5 0 R/W 12 TXPR4 0 R/W 4 0 R/W 11 TXPR3 0 R/W 3 0 R/W 10 TXPR2 0 R/W 2 0 R/W 9 TXPR1 0 R/W 1 0 R/W 8 — 0 R 0 TXPR8 0 R/W
TXPR15 TXPR14 TXPR13 TXPR12 TXPR11 TXPR10 TXPR9
Bits 15 to 9 and 7 to 0—Transmit Wait Register (TXPR7 to TXPR1, TXPR15 to TXPR8): These bits set a transmit wait for the corresponding mailboxes.
Bit y: TXPRx 0 Description Transmit message idle state in corresponding mailbox [Clearing condition] • 1 Message transmission completion and cancellation completion Transmit message transmit wait in corresponding mailbox (CAN bus arbitration) (x = 15 to 1, y = 15 to 9 and 7 to 0) (Initial value)
Bit 8—Reserved: This bit always reads 0. The write value should always be 0.
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.2.6
Transmit Wait Cancel Register (TXCR)
The transmit wait cancel register (TXCR) is a 16-bit readable/writable register that controls cancellation of transmit wait messages in mailboxes (buffers).
TXCR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 TXCR7 0 R/W 7 0 R/W 14 TXCR6 0 R/W 6 0 R/W 13 TXCR5 0 R/W 5 0 R/W 12 TXCR4 0 R/W 4 0 R/W 11 TXCR3 0 R/W 3 0 R/W 10 TXCR2 0 R/W 2 0 R/W 9 TXCR1 0 R/W 1 0 R/W 8 — 0 R 0 TXCR8 0 R/W
TXCR15 TXCR14 TXCR13 TXCR12 TXCR11 TXCR10 TXCR9
(x = 15 to 9, 7 to 0)
Bits 15 to 9 and 7 to 0—Transmit Wait Cancel Register (TXCR7 to TXCR1, TXCR15 to TXCR8): These bits control cancellation of transmit wait messages in the corresponding HCAN mailboxes.
Bit y: TXCRx 0 Description Transmit message cancellation idle state in corresponding mailbox (Initial value) [Clearing condition] • 1 Completion of TXPR clearing (when transmit message is canceled normally) (x = 15 to 1, y = 15 to 9 and 7 to 0)
TXPR cleared for corresponding mailbox (transmit message cancellation)
Bit 8—Reserved: This bit always reads 0. The write value should always be 0.
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Section 16 Controller Area Network (HCAN)
16.2.7
Transmit Acknowledge Register (TXACK)
The transmit acknowledge register (TXACK) is a 16-bit readable/writable register containing status flags that indicate normal transmission of mailbox (buffer) transmit messages.
TXACK Bit: Initial value: R/W: Bit: Initial value: R/W: 15
TXACK7
14
TXACK6
13
TXACK5
12
TXACK4
11
TXACK3
10
TXACK2
9
TXACK1
8 — 0 R 0
TXACK8
0 R/(W)* 7 0 R/(W)*
0 R/(W)* 6 0 R/(W)*
0 R/(W)* 5 0 R/(W)*
0 R/(W)* 4 0 R/(W)*
0 R/(W)* 3 0 R/(W)*
0 R/(W)* 2 0 R/(W)*
0 R/(W)* 1 0 R/(W)*
TXACK15 TXACK14 TXACK13 TXACK12 TXACK11 TXACK10 TXACK9
0 R/(W)*
Note: * Only a write of 1 is permitted, to clear the flag.
Bits 15 to 9 and 7 to 0—Transmit Acknowledge Register (TXACK7 to TXACK1, TXACK15 to TXACK8): These bits indicate that a transmit message in the corresponding HCAN mailbox has been transmitted normally.
Bit y: TXACKx 0 1 Description [Clearing condition] • Writing 1 (Initial value) (x = 15 to 1, y = 15 to 9 and 7 to 0) Completion of message transmission for corresponding mailbox
Bit 8—Reserved: This bit always reads 0. The write value should always be 0.
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.2.8
Abort Acknowledge Register (ABACK)
The abort acknowledge register (ABACK) is a 16-bit readable/writable register containing status flags that indicate normal cancellation (aborting) of a mailbox (buffer) transmit messages.
ABACK Bit: Initial value: R/W: Bit: Initial value: R/W: 15 0 R/(W)* 7 0 R/(W)* 14 0 R/(W)* 6 0 R/(W)* 13 0 R/(W)* 5 0 R/(W)* 12 0 R/(W)* 4 0 R/(W)* 11 0 R/(W)* 3 0 R/(W)* 10 0 R/(W)* 2 0 R/(W)* 9 0 R/(W)* 1 0 R/(W)* 8 — 0 R 0 0 R/(W)*
ABACK7 ABACK6 ABACK5 ABACK4 ABACK3 ABACK2 ABACK1
ABACK15 ABACK14 ABACK13 ABACK12 ABACK11 ABACK10 ABACK9 ABACK8
Note: * Only a write of 1 is permitted, to clear the flag.
Bits 15 to 9 and 7 to 0—Abort Acknowledge Register (ABACK7 to ABACK1, ABACK15 to ABACK8): These bits indicate that a transmit message in the corresponding mailbox has been canceled (aborted) normally.
Bit y: ABACKx 0 1 Description [Clearing condition] • Writing 1 (Initial value) (x = 15 to 1, y = 15 to 9 and 7 to 0) Completion of transmit message cancellation for corresponding mailbox
Bit 8—Reserved: This bit always reads 0. The write value should always be 0.
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Section 16 Controller Area Network (HCAN)
16.2.9
Receive Complete Register (RXPR)
The receive complete register (RXPR) is a 16-bit readable/writable register containing status flags that indicate normal reception of messages (data frame or remote frame) in mailboxes (buffers). In the case of remote frame reception, the corresponding remote request register (RFPR) is also set simultaneously.
RXPR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 RXPR7 0 R/(W)* 7 0 R/(W)* 14 RXPR6 0 R/(W)* 6 0 R/(W)* 13 RXPR5 0 R/(W)* 5 0 R/(W)* 12 RXPR4 0 R/(W)* 4 0 R/(W)* 11 RXPR3 0 R/(W)* 3 0 R/(W)* 10 RXPR2 0 R/(W)* 2 0 R/(W)* 9 RXPR1 0 R/(W)* 1 0 R/(W)* 8 RXPR0 0 R/(W)* 0 RXPR8 0 R/(W)*
RXPR15 RXPR14 RXPR13 RXPR12 RXPR11 RXPR10 RXPR9
Note: * Only a write of 1 is permitted, to clear the flag.
Bits 15 to 0—Receive Complete Register (RXPR7 to RXPR0, RXPR15 to RXPR8): These bits indicate that a receive message has been received normally in the corresponding mailbox.
Bit x: RXPRx 0 1 Description [Clearing condition] • Writing 1 (Initial value) Completion of message (data frame or remote frame) reception in corresponding mailbox (x = 15 to 0)
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.2.10 Remote Request Register (RFPR) The remote request register (RFPR) is a 16-bit readable/writable register containing status flags that indicate normal reception of remote frames in mailboxes (buffers). When a bit in this register is set, the corresponding reception complete bit is set simultaneously.
RFPR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 RFPR7 0 R/(W)* 7 0 R/(W)* 14 RFPR6 0 R/(W)* 6 0 R/(W)* 13 RFPR5 0 R/(W)* 5 0 R/(W)* 12 RFPR4 0 R/(W)* 4 0 R/(W)* 11 RFPR3 0 R/(W)* 3 0 R/(W)* 10 RFPR2 0 R/(W)* 2 0 R/(W)* 9 RFPR1 0 R/(W)* 1 0 R/(W)* 8 RFPR0 0 R/(W)* 0 RFPR8 0 R/(W)*
RFPR15 RFPR14 RFPR13 RFPR12 RFPR11 RFPR10 RFPR9
Note: * Only a write of 1 is permitted, to clear the flag.
Bits 15 to 0—Remote Request Register (RFPR7 to RFPR0, RFPR15 to RFPR8): These bits indicate that a remote frame has been received normally in the corresponding mailbox.
Bit x: RFPRx 0 1 Description [Clearing condition] • Writing 1 (Initial value) (x = 15 to 0) Completion of remote frame reception in corresponding mailbox
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Section 16 Controller Area Network (HCAN)
16.2.11 Interrupt Register (IRR) The interrupt register (IRR) is a 16-bit readable/writable register containing status flags for the various interrupt sources.
IRR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 IRR7 0 R/(W)* 7 — 0 — 14 IRR6 0 R/(W)* 6 — 0 — 13 IRR5 0 R/(W)* 5 — 0 — 12 IRR4 0 R/(W)* 4 IRR12 0 R/(W)* 11 IRR3 0 R/(W)* 3 — 0 — 10 IRR2 0 R 2 — 0 — 9 IRR1 0 R 1 IRR9 0 R 8 IRR0 1 R/(W)* 0 IRR8 0 R/(W)*
Note: * Only a write of 1 is permitted, to clear the flag.
Bit 15—Overload Frame Interrupt Flag (IRR7): Status flag indicating that the HCAN has transmitted an overload frame.
Bit 15: IRR7 0 1 Description [Clearing condition] • Writing 1 (Initial value) Overload frame transmission [Setting condition] • When overload frame is transmitted
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Bit 14—Bus Off Interrupt Flag (IRR6): Status flag indicating the bus off state caused by the transmit error counter.
Bit 14: IRR6 0 1 Description [Clearing condition] • Writing 1 (Initial value) Bus off state caused by transmit error [Setting condition] • When TEC ≥ 256
Bit 13—Error Passive Interrupt Flag (IRR5): Status flag indicating the error passive state caused by the transmit/receive error counter.
Bit 13: IRR5 0 1 Description [Clearing condition] • Writing 1 (Initial value) Error passive state caused by transmit/receive error [Setting condition] • When TEC ≥ 128 or REC ≥ 128
Bit 12—Receive Overload Warning Interrupt Flag (IRR4): Status flag indicating the error warning state caused by the receive error counter.
Bit 12: IRR4 0 1 Description [Clearing condition] • Writing 1 (Initial value) Error warning state caused by receive error [Setting condition] • When REC ≥ 96
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Section 16 Controller Area Network (HCAN)
Bit 11—Transmit Overload Warning Interrupt Flag (IRR3): Status flag indicating the error warning state caused by the transmit error counter.
Bit 11: IRR3 0 1 Description [Clearing condition] • Writing 1 (Initial value) Error warning state caused by transmit error [Setting condition] • When TEC ≥ 96
Bit 10—Remote Frame Request Interrupt Flag (IRR2): Status flag indicating that a remote frame has been received in a mailbox (buffer).
Bit 10: IRR2 0 Description [Clearing condition] • 1 Clearing of all bits in RFPR (remote request register) of mailbox for which receive interrupt requests are enabled by MBIMR (Initial value)
Remote frame received and stored in mailbox [Setting condition] • When remote frame reception is completed, when corresponding MBIMR = 0
Bit 9—Receive Message Interrupt Flag (IRR1): Status flag indicating that a mailbox (buffer) receive message has been received normally.
Bit 9: IRR1 0 Description [Clearing condition] • 1 Clearing of all bits in RXPR (receive complete register) of mailbox for which receive interrupt requests are enabled by MBIMR (Initial value)
Data frame or remote frame received and stored in mailbox [Setting condition] • When data frame or remote frame reception is completed, when corresponding MBIMR = 0
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Bit 8—Reset Interrupt Flag (IRR0): Status flag indicating that the HCAN module has been reset. This bit cannot be masked in the interrupt mask register (IMR). If this bit is not cleared after reset input or recovery from software standby mode, interrupt handling will be performed as soon as interrupts are enabled by the interrupt controller.
Bit 8: IRR0 0 1 Description [Clearing condition] • Writing 1 (Initial value) Hardware reset (HCAN module stop*, software standby) [Setting condition] • When reset processing is completed after a hardware reset (HCAN module stop*, software standby)
Note: * After reset or hardware standby release, the module stop bit is initialized to 1, and so the HCAN enters the module stop state.
Bits 7 to 5, 3, and 2—Reserved: These bits always read 0. The write value should always be 0. Bit 4—Bus Operation Interrupt Flag (IRR12): Status flag indicating detection of a dominant bit due to bus operation when the HCAN module is in HCAN sleep mode.
Bit 4: IRR12 0 Description CAN bus idle state [Clearing condition] • 1 Writing 1 CAN bus operation in HCAN sleep mode [Setting condition] • Bus operation (dominant bit detection) in HCAN sleep mode (Initial value)
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Section 16 Controller Area Network (HCAN)
Bit 1—Unread Interrupt Flag (IRR9): Status flag indicating that a receive message has been overwritten while still unread.
Bit 1: IRR9 0 Description [Clearing condition] • 1 Clearing of all bits in UMSR (unread message status register) (Initial value)
Unread message overwrite [Setting condition] • When UMSR (unread message status register) is set
Bit 0—Mailbox Empty Interrupt Flag (IRR8): Status flag indicating that the next transmit message can be stored in the mailbox.
Bit 0: IRR8 0 1 Description [Clearing condition] • Writing 1 (Initial value) Transmit message has been transmitted or aborted, and new message can be stored [Setting condition] • When TXPR (transmit wait register) is cleared by completion of transmission or completion of transmission abort
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.2.12 Mailbox Interrupt Mask Register (MBIMR) The mailbox interrupt mask register (MBIMR) is a 16-bit readable/writable register containing flags that enable or disable individual mailbox (buffer) interrupt requests.
MBIMR Bit: Initial value: R/W: Bit: Initial value: R/W: 15
MBIMR7
14
MBIMR6
13
MBIMR5
12
MBIMR4
11
MBIMR3
10
MBIMR2
9
MBIMR1
8
MBIMR0
1 R/W 7 1 R/W
1 R/W 6 1 R/W
1 R/W 5 1 R/W
1 R/W 4 1 R/W
1 R/W 3 1 R/W
1 R/W 2 1 R/W
1 R/W 1 1 R/W
1 R/W 0
MBIMR8
MBIMR15 MBIMR14 MBIMR13 MBIMR12 MBIMR11 MBIMR10 MBIMR9
1 R/W
Bits 15 to 0—Mailbox Interrupt Mask (MBIMRx): Flags that enable or disable individual mailbox interrupt requests.
Bit x: MBIMRx 0 Description [Transmitting] • Interrupt request to CPU due to TXPR clearing [Receiving] • 1 Interrupt request to CPU due to RXPR setting (Initial value) (x = 15 to 0) Interrupt requests to CPU disabled
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Section 16 Controller Area Network (HCAN)
16.2.13 Interrupt Mask Register (IMR) The interrupt mask register (IMR) is a 16-bit readable/writable register containing flags that enable or disable requests by individual interrupt sources.
IMR Bit: Initial value: R/W: Bit: Initial value: R/W: 15 IMR7 1 R/W 7 — 1 R 14 IMR6 1 R/W 6 — 1 R 13 IMR5 1 R/W 5 — 1 R 12 IMR4 1 R/W 4 IMR12 1 R/W 11 IMR3 1 R/W 3 — 1 R 10 IMR2 1 R/W 2 — 1 R 9 IMR1 1 R/W 1 IMR9 1 R/W 8 — 0 R 0 IMR8 1 R/W
Bit 15—Overload Frame/Bus Off Recovery Interrupt Mask (IMR7): Enables or disables overload frame/bus off recovery interrupt requests.
Bit 15: IMR7 0 1 Description Overload frame/bus off recovery interrupt request (OVR0) to CPU by IRR7 enabled Overload frame/bus off recovery interrupt request (OVR0) to CPU by IRR7 disabled (Initial value)
Bit 14—Bus Off Interrupt Mask (IMR6): Enables or disables bus off interrupt requests caused by the transmit error counter.
Bit 14: IMR6 0 1 Description Bus off interrupt request (ERS0) to CPU by IRR6 enabled Bus off interrupt request (ERS0) to CPU by IRR6 disabled (Initial value)
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Bit 13—Error Passive Interrupt Mask (IMR5): Enables or disables error passive interrupt requests caused by the transmit/receive error counter.
Bit 13: IMR5 0 1 Description Error passive interrupt request (ERS0) to CPU by IRR5 enabled Error passive interrupt request (ERS0) to CPU by IRR5 disabled (Initial value)
Bit 12—Receive Overload Warning Interrupt Mask (IMR4): Enables or disables error warning interrupt requests caused by the receive error counter.
Bit 12: IMR4 0 1 Description REC error warning interrupt request (OVR0) to CPU by IRR4 enabled REC error warning interrupt request (OVR0) to CPU by IRR4 disabled (Initial value)
Bit 11—Transmit Overload Warning Interrupt Mask (IMR3): Enables or disables error warning interrupt requests caused by the transmit error counter.
Bit 11: IMR3 0 1 Description TEC error warning interrupt request (OVR0) to CPU by IRR3 enabled TEC error warning interrupt request (OVR0) to CPU by IRR3 disabled (Initial value)
Bit 10—Remote Frame Request Interrupt Mask (IMR2): Enables or disables remote frame reception interrupt requests.
Bit 10: IMR2 0 1 Description Remote frame reception interrupt request (OVR0) to CPU by IRR2 enabled Remote frame reception interrupt request (OVR0) to CPU by IRR2 disabled (Initial value)
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Section 16 Controller Area Network (HCAN)
Bit 9—Receive Message Interrupt Mask (IMR1): Enables or disables message reception interrupt requests.
Bit 9: IMR1 0 1 Description Message reception interrupt request (RM1) to CPU by IRR1 enabled Message reception interrupt request (RM1) to CPU by IRR1 disabled (Initial value)
Bit 8—Reserved: The reset flag cannot be masked. This bit always reads 0. The write value should always be 0. Bits 7 to 5, 3, and 2—Reserved: These bits always read 1. The write value should always be 1. Bit 4—Bus Operation Interrupt Mask (IMR12): Enables or disables interrupt requests due to bus operation in sleep mode.
Bit 4: IMR12 0 1 Description Bus operation interrupt request (OVR0) to CPU by IRR12 enabled Bus operation interrupt request (OVR0) to CPU by IRR12 disabled (Initial value)
Bit 1—Unread Interrupt Mask (IMR9): Enables or disables unread receive message overwrite interrupt requests.
Bit 1: IMR9 0 1 Description Unread message overwrite interrupt request (OVR0) to CPU by IRR9 enabled Unread message overwrite interrupt request (OVR0) to CPU by IRR9 disabled (Initial value)
Bit 0—Mailbox Empty Interrupt Mask (IMR8): Enables or disables mailbox empty interrupt requests.
Bit 0: IMR8 0 1 Description Mailbox empty interrupt request (SLE0) to CPU by IRR8 enabled Mailbox empty interrupt request (SLE0) to CPU by IRR8 disabled (Initial value)
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Section 16 Controller Area Network (HCAN)
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16.2.14 Receive Error Counter (REC) The receive error counter (REC) is an 8-bit read-only register that functions as a counter indicating the number of receive message errors on the CAN bus. The count value is stipulated in the CAN protocol.
REC Bit: Initial value: R/W: 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R 0 0 R
16.2.15 Transmit Error Counter (TEC) The transmit error counter (TEC) is an 8-bit read-only register that functions as a counter indicating the number of transmit message errors on the CAN bus. The count value is stipulated in the CAN protocol.
TEC Bit: Initial value: R/W: 7 0 R 6 0 R 5 0 R 4 0 R 3 0 R 2 0 R 1 0 R 0 0 R
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Section 16 Controller Area Network (HCAN)
16.2.16 Unread Message Status Register (UMSR) The unread message status register (UMSR) is a 16-bit readable/writable register containing status flags that indicate, for individual mailboxes (buffers), that a received message has been overwritten by a new receive message before being read. When a message is overwritten by a new receive message, the old data is lost.
UMSR Bit: Initial value: R/W: Bit: Initial value: R/W: 15
UMSR7
14
UMSR6
13
UMSR5
12
UMSR4
11
UMSR3
10
UMSR2
9
UMSR1
8
UMSR0
0 R/(W)* 7 0 R/(W)*
0 R/(W)* 6 0 R/(W)*
0 R/(W)* 5 0 R/(W)*
0 R/(W)* 4 0 R/(W)*
0 R/(W)* 3 0 R/(W)*
0 R/(W)* 2 0 R/(W)*
0 R/(W)* 1
UMSR9
0 R/(W)* 0
UMSR8
UMSR15 UMSR14 UMSR13 UMSR12 UMSR11 UMSR10
0 R/(W)*
0 R/(W)*
Note: * Only 1 can be written, to clear the flag to 0.
Bits 15 to 0—Unread Message Status Flags (UMSRx): Status flags indicating that an unread receive message has been overwritten.
Bit x: UMSRx 0 1 Description [Clearing condition] • Writing 1 (Initial value) Unread receive message is overwritten by a new message [Setting condition] • When a new message is received before RXPR is cleared (x = 15 to 0)
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Section 16 Controller Area Network (HCAN)
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16.2.17 Local Acceptance Filter Masks (LAFML, LAFMH) The local acceptance filter masks (LAFML, LAFMH) are 16-bit readable/writable registers that filter receive messages to be stored in the receive-only mailbox (MC0, MD0) according to the identifier. In these registers, consist of LAFMH15: MSB to LAFMH5: LSB are 11 standard/extended identifier bits, and LAFMH1: MSB to LAFML0: LSB are 18 extended identifier bits.
LAFML Bit: Initial value: R/W: Bit: Initial value: R/W: LAFMH Bit: Initial value: R/W: Bit: Initial value: R/W: 15 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 — 0 R 4 0 R/W 11 — 0 R 3 0 R/W 10 — 0 R 2 0 R/W 9 0 R/W 1 0 R/W 8 0 R/W 0 0 R/W 15
LAFML7
14
LAFML6
13
LAFML5
12
LAFML4
11
LAFML3
10
LAFML2
9
LAFML1
8
LAFML0
0 R/W 7 0 R/W
0 R/W 6 0 R/W
0 R/W 5 0 R/W
0 R/W 4 0 R/W
0 R/W 3 0 R/W
0 R/W 2 0 R/W
0 R/W 1 0 R/W
0 R/W 0
LAFML8
LAFML15 LAFML14 LAFML13 LAFML12 LAFML11 LAFML10 LAFML9
0 R/W
LAFMH7 LAFMH6 LAFMH5
LAFMH1 LAFMH0
LAFMH15 LAFMH14 LAFMH13 LAFMH12 LAFMH11 LAFMH10 LAFMH9 LAFMH8
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LAFMH Bits 7 to 0 and 15 to 13—11-Bit Identifier Filter (LAFMH7 to LAFMH5, LAFMH15 to LAFMH8): Filter mask bits for the first 11 bits of the receive message identifier (for both standard and extended identifiers).
Bit x: LAFMHx 0 Description Stored in MC0 and MD0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Initial value) Stored in MC0 and MD0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (x = 15 to 5)
1
LAFMH Bits 12 to 10—Reserved: These bits always read 0. The write value should always be 0. LAFMH Bits 9 and 8, LAFML Bits 15 to 0—18-Bit Identifier Filter (LAFMH1, LAFMH0, LAFML7 to LAFML0, LAFML15 to LAFML8): Filter mask bits for the 18 bits of the receive message identifier (extended).
Bit y: LAFMHx LAFMLy 0 1 Description Stored in MC0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Initial value) Stored in MC0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (x = 1 and 0, y = 15 to 0)
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16.2.18 Message Control (MC0 to MC15) The message control register sets (MC0 to MC15) consist of eight 8-bit readable/writable registers (MCx[1] to MCx[8]). The HCAN has 16 sets of these registers (MC0 to MC15). The initial value of these registers is undefined, so they must be initialized (by writing 0 or 1).
MCx [1] Bit: Initial value: R/W: MCx [2] Bit: Initial value: R/W: MCx [3] Bit: Initial value: R/W: MCx [4] Bit: Initial value: R/W: 7 — * R/W 6 — * R/W 5 — * R/W 4 — * R/W 3 — * R/W 2 — * R/W 1 — * R/W 0 — * R/W *:Undefined 7 — * R/W 6 — * R/W 5 — * R/W 4 — * R/W 3 — * R/W 2 — * R/W 1 — * R/W 0 — * R/W 7 — * R/W 6 — * R/W 5 — * R/W 4 — * R/W 3 — * R/W 2 — * R/W 1 — * R/W 0 — * R/W 7 — * R/W 6 — * R/W 5 — * R/W 4 — * R/W 3 DLC3 * R/W 2 DLC2 * R/W 1 DLC1 * R/W 0 DLC0 * R/W
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Section 16 Controller Area Network (HCAN)
MCx [5] Bit: Initial value: R/W: MCx [6] Bit: Initial value: R/W: MCx [7] Bit: Initial value: R/W: MCx [8] Bit: Initial value: R/W: 7 6 5 4 3 2 1 0 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4
RTR
3
IDE
2 — * R/W
1 * R/W
0 * R/W
STD_ID2 STD_ID1 STD_ID0
EXD_ID17 EXD_ID16
* R/W
* R/W
STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3
EXD_ID7 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W *:Undefined (x = 15 to 0)
MCx[1] Bits 7 to 4—Reserved: The initial value of these bits is undefined; they must be initialized (by writing 0 or 1).
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MCx[1] Bits 3 to 0—Data Length Code (DLC): These bits indicate the required length of data frames and remote frames.
Bit 3: DLC3 0 Bit 2: DLC2 0 Bit 1: DLC1 0 1 1 0 1 1 0/1 0/1 Bit 0: DLC0 0 1 0 1 0 1 0 1 0/1 Description Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes Data length = 8 bytes
MCx[2] Bits 7 to 0—Reserved: The initial value of these bits is undefined; they must be initialized (by writing 0 or 1). MCx[3] Bits 7 to 0—Reserved: The initial value of these bits is undefined; they must be initialized (by writing 0 or 1). MCx[4] Bits 7 to 0—Reserved: The initial value of these bits is undefined; they must be initialized (by writing 0 or 1). MCx[6] Bits 7 to 0—Standard Identifier (STD_ID10 to STD_ID3) MCx[5] Bits 7 to 5—Standard Identifier (STD_ID2 to STD_ID0) These bits set the identifier (standard identifier) of data frames and remote frames.
Standard identifier
SOF ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR IDE SRR
STD_IDxx
Figure 16-2 Standard identifier
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MCx[5] Bit 4—Remote Transmission Request (RTR): Used to distinguish between data frames and remote frames.
Bit 4: RTR 0 1 Description Data frame Remote frame
MCx[5] Bit 3—Identifier Extension (IDE): Used to distinguish between the standard format and extended format of data frames and remote frames.
Bit 3: IDE 0 1 Description Standard format Extended format
MCx[5] Bit 2—Reserved: The initial value of this bit is undefined; it must be initialized (by writing 0 or 1). MCx[5] Bits 1 and 0—Extended Identifier (EXD_ID17, EXD_ID16) MCx[8] Bits 7 to 0—Extended Identifier (EXD_ID15 to EXD_ID8) MCx[7] Bits 7 to 0—Extended Identifier (EXD_ID7 to EXD_ID0) These bits set the identifier (extended identifier) of data frames and remote frames.
Extended Identifier
IDE ID17 ID16 ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5
EXD_IDxx
ID4 ID3 ID2 ID1 ID0 RTR R1
EXD_IDxx
Figure 16-3 Extended identifier
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16.2.19 Message Data (MD0 to MD15) The message data register sets (MD0 to MD15) consist of eight 8-bit readable/writable registers (MDx[1] to MDx[8]). The HCAN has 16 sets of these registers (MD0 to MD15). The initial value of these registers is undefined, so they must be initialized (by writing 0 or 1).
MDx [1] Bit: Initial value: R/W: MDx [2] Bit: Initial value: R/W: MDx [3] Bit: Initial value: R/W: MDx [4] Bit: Initial value: R/W: 7 6 5 4 3 2 1 0 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
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MDx [5] Bit: Initial value: R/W: MDx [6] Bit: Initial value: R/W: MDx [7] Bit: Initial value: R/W: MDx [8] Bit: Initial value: R/W: 7 6 5 4 3 2 1 0 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W 7 * R/W 6 * R/W 5 * R/W 4 * R/W 3 * R/W 2 * R/W 1 * R/W 0 * R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W
* R/W *:Undefined (x = 0 to 15)
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16.2.20 Module Stop Control Register C (MSTPCRC)
Bit: Initial value: R/W: 7 6 5 4 3 2 1 0
MSTPC7 MSTPC6 MSTPC5 MSTPC4 MSTPC3 MSTPC2* MSTPC1 MSTPC0 1 1 1 1 1 1 1 1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * The MSTPC2 is not available and is reserved in the H8S/2635 Group.
MSTPCRC is an 8-bit readable/writable register that performs module stop mode control. When the MSTPC3 and MSTPC2 bits are set to 1, HCAN0 and 1 operation is stopped at the end of the bus cycle, and module stop mode is entered. Register read/write accesses are not possible in module stop mode. For details, see section 23A.5, 23B.5, Module Stop Mode. MSTPCRC is initialized to H'FF by a reset, and in hardware standby mode. It is not initialized in software standby mode. Bit 3—Module Stop (MSTPC3): Specifies the HCAN module stop mode.
Bit 3: MSTPC3 0 1 Description HCAN0 module stop mode is cleared HCAN0 module stop mode is set (Initial value)
Bit 2—Module Stop (MSTPC2)*: Specifies the HCAN module stop mode. Note: * The MSTPC2 is not available and is reserved in the H8S/2635 Group.
Bit 2: MSTPC2 0 1 Description HCAN1 module stop mode is cleared HCAN1 module stop mode is set (Initial value)
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Section 16 Controller Area Network (HCAN)
16.3
Operation
The device is equipped with a 1-channel HCAN module or with 2-channel HCAN modules, which are controlled independently. In the latter case, both modules have identical specifications, and they are controlled in the same manner. 16.3.1 Hardware and Software Resets
The HCAN can be reset by a hardware reset or software reset. Hardware Reset (HCAN Module Stop, Reset*, Hardware*/Software Standby): Initialization is performed by automatic setting of the MCR reset request bit (MCR0) in MCR and the reset state bit (GSR3) in GSR within the HCAN (hardware reset). At the same time, all internal registers are initialized. However mailbox contents are retained. A flowchart of this reset is shown in figure 16-4. Note: * In a reset and in hardware standby mode, the module stop bit is initialized to 1 and the HCAN enters the module stop state. Software Reset (Write to MCR0): In normal operation initialization is performed by setting the MCR reset request bit (MCR0) in MCR (Software reset). With this kind of reset, if the CAN controller is performing a communication operation (transmission or reception), the initialization state is not entered until the message has been completed. During initialization, the reset state bit (GSR3) in GSR is set. In this kind of initialization, the error counters (TEC and REC) are initialized but other registers and RAM (mailboxes) are not. A flowchart of this reset is shown in figure 16-5.
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Hardware reset
MCR0 = 1 (automatic)
IRR0 = 1 (automatic)*1 GSR3 = 1 (automatic)
Initialization of HCAN module Bit configuration mode Period in which BCR, MBCR, etc., are initialized
Clear IRR0 BCR setting MBCR setting Mailbox (RAM) initialization Message transmission method initialization
MCR0 = 0
GSR3 = 0? Yes IMR setting (interrupt mask setting) MBIMR setting (interrupt mask setting) MC[x] setting (receive identifier setting) LAFM setting (receive identifier mask setting)
No
GSR3 = 0 & 11 recessive bits received? Yes CAN bus communication enabled
No
: Settings by user : Processing by hardware
Notes: 1. When IRR0 is set to 1 (automatically) due to a hardware reset*2, a "hardware reset initiated reset processing" interrupt is generated. 2. In a reset and in hardware standby mode, the module stop bit is initialized to 1 and the HCAN enters the module stop state.
Figure 16-4 Hardware Reset Flowchart
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MCR0 = 1
Bus idle? Yes GSR3 = 1 (automatic)
No
Initialization of REC and TEC only
Correction BCR setting MBCR setting Mailbox (RAM) initialization Message transmission method initialization OK? Yes No
GSR3 = 1? Yes MCR0 = 0
No
GSR3 = 0? Yes
No
IMR setting MBIMR setting MC[x] setting LAFM setting OK? Yes
Correction No
GSR3 = 0 & 11 recessive bits received? Yes CAN bus communication enabled
No
: Settings by user : Processing by hardware
Figure 16-5 Software Reset Flowchart
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
16.3.2
Initialization after Hardware Reset
After a hardware reset, the following initialization processing should be carried out: • Clearing of IRR0 bit in interrupt register (IRR) • Bit rate setting • Mailbox transmit/receive settings • Mailbox (RAM) initialization • Message transmission method setting These initial settings must be made while the HCAN is in bit configuration mode. Configuration mode is a state in which the reset request bit (MCR0) in the master control register (MCR) is 1 and the reset status bit in the general status register (GSR) is also 1 (GSR3 = 1). Configuration mode is exited by clearing the reset request bit in MCR to 0; when MCR0 is cleared to 0, the HCAN automatically clears the reset state bit (GSR3) in the general status register (GSR). The power-up sequence then begins, and communication with the CAN bus is possible as soon as the sequence ends. The power-up sequence consists of the detection of 11 consecutive recessive bits. IRR0 Clearing: The reset interrupt flag (IRR0) is always set after a reset or recovery from software standby mode. As an HCAN interrupt is initiated immediately when interrupts are enabled, IRR0 should be cleared. Bit Rate and Bit Timing Settings: As bit rate settings, a baud rate setting and bit timing setting must be made each time a CAN node begins communication. The baud rate and bit timing settings are made in the bit configuration register (BCR). a. Note BCR can be written to at all times, but should only be modified in configuration mode. Settings should be made so that all CAN controllers connected to the CAN bus have the same baud rate and bit width. Limits for the settable variables (TSEG1, TSEG2, BRP, sample point, and SJW) are shown in table 16-3.
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Section 16 Controller Area Network (HCAN)
Table 16-3 BCR Register Value Setting Ranges
Name Time segment 1 Time segment 2 Baud rate prescaler Sample point Synchronization jump width Abbreviation TSEG1 TSEG2 BRP SAM SJW Min. Value B'0011 B'001 B'000000 B'0 B'00 Max. Value B'1111 B'111 B'111111 B'1 B'11
b. Value Setting Ranges • The minimum value of SJW is stipulated in the CAN specifications. 3 ≥ SJW ≥ 0 • The minimum value of TSEG1 is stipulated in the CAN specifications. TSEG1 > TSEG2 • The minimum value of TSEG2 is stipulated in the CAN specifications. TSEG2 ≥ SJW The following formula is used to calculate the baud rate.
fCLK Bit rate = 2 × (BRP + 1) × (3 + TSEG1 + TSEG2) [b/s]
Note: fCLK = φ (system clock) The BCR value are used for BRP, TSEG1, and TSEG2.
Example: With a 1 Mb/s baud rate and a 20 MHz input clock:
1 Mb/s = 20 MHz 2 × (0 + 1) × (3 + 4 + 3)
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Item fCLK BRP TSEG1 TSEG2
Set Values 20 MHz 0 (B'000000) 4 (B'0100) 3 (B'011)
Actual Values — System clock × 2 5TQ 4TQ
1-bit time
1-bit time (8 to 25 time quanta)
SYNC_SEG
PRSEG
PHSEG1
PHSEG2 Time segment 2 (TSEG2)* 2 to 8
1
Time segment 1 (TSEG1)* 4 to16
Quantum
Legend: SYNC_SEG: Segment for establishing synchronization of nodes on the CAN bus (Normal bit edge transitions occur in this segment). PRSEG: Segment for compensating for physical delay between networks. PHSEG1: Buffer segment for correcting phase drift (positive). (This segment is extended when synchronization (resynchronization) is established). PHSEG2: Buffer segment for correcting phase drift (negative). (This segment is shortened when synchronization (resynchronization) is established). Note: * The time quanta values of TSEG1 and TSEG2 become the value of TSEG + 1.
Figure 16-6 Detailed Description of One Bit HCAN bit rate calculation:
Bit rate = fCLK 2 × (BRP + 1) × (3 + TSEG1 + TSEG2)
fCLK: peripheral clock (φ)
Note: The BCR values are used for BRP, TSEG1, and TSEG2. BCR Setting Constraints
TSEG1 > TSEG2 ≥ SJW (SJW = 0 to 3)
These constraints allow the setting range shown in table 16-4 for TSEG1 and TSEG2 in BCR.
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Section 16 Controller Area Network (HCAN)
Table 16-4 Setting Range for TSEG1 and TSEG2 in BCR
TSEG2 (BCR [14:12]) 001 TSEG1 (BCR [11:8]) 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 No Yes* Yes* Yes* Yes* Yes* Yes* Yes* Yes* Yes* Yes* Yes* Yes* 010 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 011 No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 100 No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 101 No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes 110 No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes 111 No No No No No Yes Yes Yes Yes Yes Yes Yes Yes
Notes: The time quanta value for TSEG1 and TSEG2 is the TSEG value + 1. * Only a value other than BRP[13:8] = B'000000 can be set.
Mailbox Transmit/Receive Settings: HCAN0, 1 each have 16 mailboxes. Mailbox 0 is receiveonly, while mailboxes 1 to 15 can be set for transmission or reception. Mailboxes that can be set for transmission or reception must be designated either for transmission use or for reception use before communication begins. The Initial status of mailboxes 1 to 15 is for transmission (while mailbox 0 is for reception only). Mailbox transmit/receive settings are not initialized by a software reset. • Setting for transmission Transmit mailbox setting (mailboxes 1 to 15) Clearing a corresponding mailbox in the mailbox configuration register (MBCR) to 0 designates the specified mailbox for transmission use. After a reset, mailboxes are initialized for transmission use, so this setting is not necessary. • Setting for reception Transmit/receive mailbox setting (mailboxes 1 to 15)
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Setting a bit to 1 in the mailbox configuration register (MBCR) designates the corresponding mailbox for reception use. When setting mailboxes for reception, to improve message transmission efficiency, high-priority messages should be set in low-to-high mailbox order (priority order: mailbox 1 > mailbox 15). • Receive-only mailbox (mailbox 0) No setting is necessary, as this mailbox is always used for reception. Mailbox (Message Control/Data (MCx[x], MDx[x]) Initial Settings: After power is supplied, all registers and RAM (message control/data, control registers, status registers, etc.) are initialized. Message control/data (MCx[x], MDx[x]) only are in RAM, and so their values are undefined. Initial values must therefore be set in all the mailboxes (by writing 0s or 1s). Setting the Message Transmission Method: Either of the following message transmission methods can be selected with the message transmission method bit (MCR2) in the master control register (MCR): a. Transmission order determined by message identifier priority b. Transmission order determined by mailbox number priority When a is selected, if a number of messages are designated as waiting for transmission (TXPR = 1), the message with the highest priority set in the message identifier (MCx[5] to MCx[8]) is stored in the transmit buffer. CAN bus arbitration is then carried out for the message in the transmit buffer, and message transmission is performed when the transmission right is acquired. When the TXPR bit is set, internal arbitration is performed again, and the highest-priority message is found and stored in the transmit buffer. When b is selected, if a number of messages are designated as waiting for transmission (TXPR = 1), messages are stored in the transmit buffer in low-to-high mailbox order (priority order: mailbox 1 > mailbox 15). CAN bus arbitration is then carried out for the messages in the transmit buffer, and message transmission is performed when the bus is acquired.
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Section 16 Controller Area Network (HCAN)
16.3.3
Transmit Mode
Message transmission is performed using mailboxes 1 to 15. The transmission procedure is described below, and a transmission flowchart is shown in figure 16-6. Initialization (after hardware reset only) a. Clearing of IRR0 bit in interrupt register (IRR) b. Bit rate settings c. Mailbox transmit/receive settings d. Mailbox (RAM) initialization e. Message transmission method setting Interrupt and transmit data settings a. CPU interrupt source setting b. Arbitration field setting c. Control field setting d. Data field setting Message transmission and interrupts a. Message transmission wait b. Message transmission completion and interrupt c. Message transmission cancellation d. Message retransmission Initialization (After Hardware Reset Only): These settings should be made while the HCAN is in bit configuration mode. • IRR0 clearing The reset interrupt flag (IRR0) is always set after a reset or recovery from software standby mode. As an HCAN interrupt is initiated immediately when interrupts are enabled, IRR0 should be cleared. • Bit rate settings Set values relating to the CAN bus communication speed and resynchronization. Refer to Bit Rate and Bit Timing Settings in 16.3.2, Initialization after Hardware Reset, for details.
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• Mailbox transmit/receive settings Mailbox transmit/receive settings should be made in advance. A total of 30 mailbox can be set for transmission or reception (mailboxes 1 to 15 in HCAN0 and HCAN1). To set a mailbox for transmission, clear the corresponding bit to 0 in the mailbox configuration register (MBCR). Refer to Mailbox Transmit/Receive Settings in 16.3.2, Initialization after Hardware Reset, for details. • Mailbox (RAM) initialization As message control/data registers (MCx[x], MDx[x]) are configured in RAM, their initial values after powering on are undefined, and so bit initialization is necessary. Write 0s or 1s to the mailboxes. See Mailbox (Message Control/Data (MCx[x], MDx[x]) Initial Setting in 16.3.2, Initialization after a Hardware Reset, for details. • Message transmission method setting Set the transmission method for mailboxes designated for transmission. The following two transmission methods can be used. Refer to Message Transmission Method Setting in 16.3.2, Initialization after Hardware Reset, for details. a. Transmission order determined by message identifier priority b. Transmission order determined by mailbox number priority
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Initialization (after hardware reset only) IRR0 clearing BCR setting MBCR setting Mailbox (RAM) initialization Message transmission method setting
Interrupt settings
Transmit data setting Arbitration field setting Control field setting Data field setting Message transmission wait TXPR setting
Bus idle? Yes Message transmission GSR2 = 0 (during transmission only)
No
Transmission completed? Yes TXACK = 1 IRR8 = 1
No
IMR8 = 1? No Interrupt to CPU
Yes
Clear TXACK Clear IRR8 : Settings by user End of transmission : Processing by hardware
Figure 16-7 Transmission Flowchart
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Interrupt and Transmit Data Settings: When mailbox initialization is finished, CPU interrupt source settings and data settings must be made. Interrupt source settings are made in the mailbox interrupt register (MBIMR) and interrupt mask register (IMR), while transmit data settings are made by writing the necessary data from the arbitration field, control field, and data field, described below, in the corresponding message control (MCx[1] to MCx[8]) and message data (MDx[1] to MDx[8]). • CPU interrupt source setting Transmission acknowledge and transmission abort acknowledge interrupts can be masked for individual mailboxes in the mailbox interrupt mask register (MBIMR). Interrupt register (IRR) interrupts can be masked in the interrupt mask register (IMR). • Arbitration field setting In the arbitration field, the 11-bit identifier (STD_ID0 to STD_ID10) and RTR bit (standard format) or 29-bit identifier (STD_ID0 to STD_ID10, EXT_ID0 to EXT_ID17) and IDE, RTR bit (extended format) are set. The registers to be set are MCx[5] to MCx[8]. • Control field setting In the control field, the byte length of the data to be transmitted is set in DLC0 to DLC3. The register to be set is MCx[1]. • Data field setting In the data field, the data to be transmitted is set in byte units in the range of 0 to 8 bytes. The registers to be set are MDx[1] to MDx[8]. The number of bytes in the data actually transmitted depends on the data length code (DLC) in the control field. If a value exceeding the value set in DLC is set in the data field, only the number of bytes set in DLC will actually be transmitted. Message Transmission and Interrupts: • Message transmission wait If message transmission is to be performed after completion of the message control (MCx[1] to MCx[8]) and message data (MDx[1] to MDx[8]).settings, transmission is started by setting the corresponding mailbox transmit wait bit (TXPR1 to TXPR15) to 1 in the transmit wait register (TXPR). The following two transmission methods can be used: a. Transmission order determined by message identifier priority b. Transmission order determined by mailbox number priority
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Section 16 Controller Area Network (HCAN)
When a is selected, if a number of messages are designated as waiting for transmission (TXPR = 1), messages are stored in the transmit buffer in low-to-high mailbox order (priority order: mailbox 1 > mailbox 15). CAN bus arbitration is then carried out for the messages in the transmit buffer, and message transmission is performed when the bus is acquired. When b is selected, if a number of messages are designated as waiting for transmission (TXPR = 1), the message with the highest priority set in the message identifier (MCx[5] to MCx[8]) is stored in the transmit buffer. CAN bus arbitration is then carried out for the message in the transmit buffer, and message transmission is performed when the transmission right is acquired. When the TXPR bit is set, internal arbitration is performed again, the highest-priority message is found and stored in the transmit buffer, CAN bus arbitration is carried out in the same way, and message transmission is performed when the transmission right is acquired. • Message transmission completion and interrupt When a message is transmitted error-free using the above procedure, the corresponding acknowledge bit (TXACK1 to TXACK15) in the transmit acknowledge register (TXACK) and transmit wait bit (TXPR1 to TXPR15) in the transmit wait register (TXPR) are automatically initialized. Also, if the corresponding bit (MBIMR1 to MBIMR15) in the mailbox interrupt mask register (MBIMR) and the mailbox empty interrupt bit (IRR8) in the interrupt mask register (IMR) are set to the interrupt enable state at the same time, an interrupt can be sent to the CPU. • Message transmission cancellation Transmission cancellation can be specified for a message stored in a mailbox as a transmit wait message. A transmit wait message is canceled by setting the bit for the corresponding mailbox (TXCR1 to TXCR15) to 1 in the transmit cancel register (TXCR). When cancellation is executed, the transmit wait register (TXPR) is automatically reset, and the corresponding bit is set to 1 in the abort acknowledge register (ABACK). An interrupt can be requested. Also, if the mailbox empty interrupt (IRR8) is enabled for the bits (MBIMR1 to MBIMR15) corresponding to the mailbox interrupt mask register (MBIMR) and interrupt mask register (IMR), interrupts may be sent to the CPU. However, a transmit wait message cannot be canceled at the following times: a. During internal arbitration or CAN bus arbitration b. During data frame or remote frame transmission Also, transmission cannot be canceled by clearing the transmit wait register (TXPR). Figure 16-5 shows a flowchart of transmit message cancellation.
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• Message retransmission If transmission of a transmit message is aborted in the following cases, the message is retransmitted automatically: a. CAN bus arbitration failure (failure to acquire the bus) b. Error during transmission (bit error, stuff error, CRC error, frame error, ACK error)
Message transmit wait TXPR setting
Set TXCR bit corresponding to message to be canceled
Cancellation possible? Yes Message not sent Clear TXCR, TXPR ABACK = 1 IRR8 = 1
No
Completion of message transmission TXACK = 1 Clear TXCR, TXPR IRR8 = 1
IMR8 = 1? No Interrupt to CPU
Yes
Clear TXACK Clear ABACK Clear IRR8
: Settings by user End of transmission/transmission cancellation : Processing by hardware
Figure 16-8 Transmit Message Cancellation Flowchart
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Section 16 Controller Area Network (HCAN)
16.3.4
Receive Mode
Message reception is performed using mailboxes 0 and 1 to 15. The reception procedure is described below, and a reception flowchart is shown in figure 16-9. Initialization (after hardware reset only) a. Clearing of IRR0 bit in interrupt register (IRR) b. Bit rate settings c. Mailbox transmit/receive settings d. Mailbox (RAM) initialization Interrupt and receive message settings a. CPU interrupt source setting b. Arbitration field setting c. Local acceptance filter mask (LAFM) settings Message reception and interrupts a. Message reception CRC check b. Data frame reception c. Remote frame reception d. Unread message reception Initialization (After Hardware Reset Only): These settings should be made while the HCAN is in bit configuration mode. • IRR0 clearing The reset interrupt flag (IRR0) is always set after a reset or recovery from software standby mode. As an HCAN interrupt is initiated immediately when interrupts are enabled, IRR0 should be cleared. • Bit rate settings Set values relating to the CAN bus communication speed and resynchronization. Refer to Bit Rate and Bit Timing Settings in 16.3.2, Initialization after Hardware Reset, for details.
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• Mailbox transmit/receive settings Each channel has one receive-only mailbox (mailbox 0) plus 15 mailboxes that can be set for reception. Thus a total of 32 mailboxes can be used for reception. To set a mailbox for reception, set the corresponding bit to 1 in the mailbox configuration register (MBCR). The initial setting for mailboxes is 0, designating transmission use. Refer to Mailbox Transmit/Receive Settings in 16.3.2, Initialization after Hardware Reset, for details. • Mailbox (RAM) initialization As message control/data registers (MCx[x], MDx[x]) are configured in RAM, their initial values after powering on are undefined, and so bit initialization is necessary. Write 0s or 1s to the mailboxes. See Mailbox (Message Control/Data (MCx[x], MDx[x]) Initial Setting in 16.3.2, Initialization after a Hardware Reset, for details.
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Section 16 Controller Area Network (HCAN)
Initialization IRR0 clearing BCR setting MBCR setting Mailbox (RAM) initialization
: Settings by user : Processing by hardware
Interrupt settings
Receive data setting Arbitration field setting Local acceptance filter settings
Message reception (Match of identifier in mailbox?) Yes Same RXPR = 1? No Data frame? Yes RXPR IRR1 = 1
No
Yes
Unread message No
RXPR, RFPR = 1 IRR2 = 1, IRR1 = 1 Yes Yes
IMR1 = 1? No Interrupt to CPU
IMR2 = 1? No Interrupt to CPU
Message control read Message data read Clear all RXPRn bits of mailbox for which receive interrupt requests are enabled by MBIMR IRR1 = 0
Message control read Message data read Clear all RXPRn bits of mailbox for which receive interrupt requests are enabled by MBIMR IRR2 = 0, IRR1 = 0
Transmission of data frame corresponding to remote frame
End of reception
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Section 16 Controller Area Network (HCAN)
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Figure 16-9 Reception Flowchart Interrupt and Receive Message Settings: When mailbox initialization is finished, CPU interrupt source settings and receive message specifications must be made. Interrupt source settings are made in the mailbox interrupt register (MBIMR) and interrupt mask register (IMR). To receive a message, the identifier must be set in advance in the message control (MCx[1] to MCx[8]) for the receiving mailbox. When a message is received, all the bits in the receive message identifier are compared, and if a 100% match is found, the message is stored in the matching mailbox. Mailbox 0 (MB0) has a local acceptance filter mask (LAFM) that allows Don’t care settings to be made. • CPU interrupt source settings When transmitting, transmission acknowledge and transmission abort acknowledge interrupts can be masked for individual mailboxes in the mailbox interrupt mask register (MBIMR). When receiving, data frame and remote frame receive wait interrupts can be masked. Interrupt register (IRR) interrupts can be masked in the interrupt mask register (IMR). • Arbitration field setting In the arbitration field, the identifier (STD_ID0 to STD_ID10, EXT_ID0 to EXT_ID17) of the message to be received is set. If all the bits in the set identifier do not match, the message is not stored in a mailbox. Example: Mailbox 1 010_1010_1010 (standard identifier)
Only one kind of message identifier can be received by MB1 Identifier 1: 010_1010_1010
• Local acceptance filter mask (LAFM) setting The local acceptance filter mask is provided for mailbox 0 (MB0) only, enabling a Don’t care specification to be made for all bits in the received identifier. This allows various kinds of messages to be received. Example: Mailbox 0 LAFM 010_1010_1010 (standard identifier) 000_0000_0011 (0: Care, 1: Don’t care)
A total of four kinds of message identifiers can be received by MB0 Identifier 1: Identifier 2: Identifier 3: Identifier 4: 010_1010_1000 010_1010_1001 010_1010_1010 010_1010_1011
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Section 16 Controller Area Network (HCAN)
Message Reception and Interrupts: • Message reception CRC check When a message is received, a CRC check is performed automatically (by hardware). If the result of the CRC check is normal, ACK is transmitted in the ACK field irrespective of whether or not the message can be received. • Data frame reception If the received message is confirmed to be error-free by the CRC check, etc., the identifier in the mailbox (and also LAFM in the case of mailbox 0 only) and the identifier of the receive message are compared, and if a complete match is found, the message is stored in the mailbox. The message identifier comparison is carried out on each mailbox in turn, starting with mailbox 0 and ending with mailbox 15. If a complete match is found, the comparison ends at that point, the message is stored in the matching mailbox, and the corresponding receive complete bit (RXPR0 to RXPR15) is set in the receive complete register (RXPR). However, when a mailbox 0 LAFM comparison is carried out, even if the identifier matches, the mailbox comparison sequence does not end at that point, but continues with mailbox 1 and then the remaining mailboxes. It is therefore possible for a message matching mailbox 0 to be received by another mailbox (however, the same message cannot be stored in more than one of mailboxes 1 to 15). If the corresponding bit (MBIMR0 to MBIMR15) in the mailbox interrupt mask register (MBIMR) and the receive message interrupt mask (IMR1) in the interrupt mask register (IMR) are set to the interrupt enable value at this time, an interrupt can be sent to the CPU. • Remote frame reception Two kinds of messages—data frames and remote frames—can be stored in mailboxes. A remote frame differs from a data frame in that the remote reception request bit (RTR) in the message control register (MC[x]5) and the data field are 0 bytes. The data length to be returned in a data frame must be stored in the data length code (DLC) in the control field. When a remote frame (RTR = recessive) is received, the corresponding bit is set in the remote request wait register (RFPR). If the corresponding bit (MBIMR0 to MBIMR15) in the mailbox interrupt mask register (MBIMR) and the remote frame request interrupt mask (IRR2) in the interrupt mask register (IMR) are set to the interrupt enable value at this time, an interrupt can be sent to the CPU. • Unread message reception When a received message matches the identifier in a mailbox, the message is stored in the mailbox. If a message overwrite occurs before the CPU reads the message, the corresponding bit (UMSR0 to UMSR15) is set in the unread message register (UMSR). In overwriting of an unread message, when a new message is received before the corresponding bit in the receive
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
complete register (RXPR) has been cleared, the unread message register (UMSR) is set. If the unread interrupt flag (IRR9) in the interrupt mask register (IMR) is set to the interrupt enable value at this time, an interrupt can be sent to the CPU. Figure 16-10 shows a flowchart of unread message overwriting.
Unread message overwrite
UMSR = 1 IRR9 = 1
IMR9 = 1? No Interrupt to CPU
Yes
Clear IRR9 Message control/message data read : Settings by user End : Processing by hardware
Figure 16-10 Unread Message Overwrite Flowchart
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Section 16 Controller Area Network (HCAN)
16.3.5
HCAN Sleep Mode
The HCAN is provided with an HCAN sleep mode that places the HCAN module in the sleep state to reduce current dissipation. Figure 16-11 shows a flowchart of the HCAN sleep mode.
MCR5 = 1
: Settings by user : Processing by hardware
Bus idle?
No
Initialize TEC and REC
Bus operation? Yes IRR12 = 1
No
Do not access MB during these steps IMR12 = 1? No CPU interrupt Yes
Sleep mode clearing method MCR7 = 0? Yes (manual)
No (automatic)
Clear sleep mode? GSR3 = 1? No
No
Yes
MCR5 = 0 Yes
GSR3 = 1? Yes MCR5 = 0
No
11 recessive bits received? Yes CAN bus communication possible
No
Figure 16-11 HCAN Sleep Mode Flowchart
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
HCAN sleep mode is entered by setting the HCAN sleep mode bit (MCR5) to 1 in the master control register (MCR). If the CAN bus is operating, the transition to HCAN sleep mode is delayed until the bus becomes idle. Either of the following methods of clearing HCAN sleep mode can be selected by making a setting in the MCR7 bit. 1. Clearing by software 2. Clearing by CAN bus operation Eleven recessive bits must be received after HCAN sleep mode is cleared before CAN bus communication is enabled again. Clearing by software: HCAN sleep mode is cleared by writing a 0 to MCR5 from the CPU. Clearing by CAN bus operation: Clearing by CAN bus operation occurs automatically when the CAN bus performs an operation and this change is detected. In this case, the first message is not received in the mailbox, and normal reception starts from the next message. When a change is detected on the CAN bus in HCAN sleep mode, the bus operation interrupt flag (IRR12) is set in the interrupt register (IRR). If the bus interrupt mask (IMR12) in the interrupt mask register (IMR) is set to the interrupt enable value at this time, an interrupt can be sent to the CPU.
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Section 16 Controller Area Network (HCAN)
16.3.6
HCAN Halt Mode
The HCAN halt mode is provided to enable mailbox settings to be changed without performing an HCAN hardware or software reset. Figure 16-12 shows a flowchart of the HCAN halt mode.
MCR1 = 1
Bus idle? Yes MBCR setting
No
MCR1 = 0 : Settings by user CAN bus communication possible : Processing by hardware
Figure 16-12 HCAN Halt Mode Flowchart HCAN halt mode is entered by setting the halt request bit (MCR1) to 1 in the master control register (MCR). However, if the CAN bus is operating at the time of a transition, the transition to HCAN ALT mode is delayed until the bus becomes idle. HCAN halt mode is cleared by clearing MCR1 to 0. 16.3.7 Interrupt Interface
There are 12 HCAN interrupt sources, to which five independent interrupt vectors are assigned. Table 16-5 lists the HCAN interrupt sources. With the exception of the reset processing vector (IRR0), these sources can be masked. Masking is implemented using the mailbox interrupt mask register (MBIMR) and interrupt mask register (IMR).
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Table 16-5 HCAN Interrupt Sources
Channel HCAN0 IPR Bits IPRM (2 to 0) Vector ERS0 Vector Number IRR Bit 108 IRR5 IRR6 OVR0 108 IRR0 IRR2 IRR3 IRR4 IRR7 IRR9 IRR12 RM0 RM1 SLE0 HCAN1 IPRM (6 to 4) ERS0 109 108 108 106 IRR1 IRR1 IRR8 IRR5 IRR6 OVR0 106 IRR0 IRR2 IRR3 IRR4 IRR7 IRR9 IRR12 RM0 RM1 SLE0 107 106 106 IRR1 IRR1 IRR8 Description Error passive interrupt (TEC ≥ 128 or REC ≥ 128) Bus off interrupt (TEC ≥ 256) Hardware reset processing interrupt Remote frame reception interrupt Error warning interrupt (TEC ≥ 96) Error warning interrupt (REC ≥ 96) Overload frame transmission interrupt Unread message overwrite interrupt HCAN sleep mode CAN bus operation interrupt Mailbox 0 message reception interrupt Mailbox 1 to 15 message reception interrupt Message transmission/cancellation interrupt Error passive interrupt (TEC ≥ 128 or REC ≥ 128) Bus off interrupt (TEC ≥ 256) Hardware reset processing interrupt Remote frame reception interrupt Error warning interrupt (TEC ≥ 96) Error warning interrupt (REC ≥ 96) Overload frame transmission interrupt Unread message overwrite interrupt HCAN sleep mode CAN bus operation interrupt Mailbox 0 message reception interrupt Mailbox 1 to 15 message reception interrupt Message transmission/cancellation interrupt
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Section 16 Controller Area Network (HCAN)
16.3.8
DTC Interface*
Note: * The DTC is not implemented in the H8S/2635 Group. The DTC can be activated by reception of a message in the HCAN’s mailbox 0. When DTC transfer ends after DTC activation has been set, the RXPR0 and RFPR0 flags are acknowledge signal automatically. An interrupt request due to a receive interrupt from the HCAN cannot be sent to the CPU in this case. Figure 16-13 shows a DTC transfer flowchart.
DTC initialization DTC enable register setting DTC register information setting
Message reception in HCAN’s mailbox 0
DTC activation
End of DTC transfer? Yes RXPR and RFPR clearing
No
Transfer counter = 0 or DISEL = 1? Yes Interrupt to CPU
No
: Settings by user End : Processing by hardware
Figure 16-13 DTC Transfer Flowchart
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Section 16 Controller Area Network (HCAN)
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16.4
CAN Bus Interface
A bus transceiver IC is necessary to connect the chip to a CAN bus. A HA13721 transceiver IC, or compatible device, is recommended. Figure 16-14 shows a sample connection diagram.
Chip Vcc HA13721 Port HRxD HTxD NC MODE Vcc RxD CANH TxD CANL NC GND CAN bus 120 Ω
120 Ω Note: NC: No Connection
Figure 16-14 High-Speed Interface Using HA13721
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Section 16 Controller Area Network (HCAN)
16.5
Usage Notes
(1) Reset The HCAN is reset by a reset, and in hardware standby mode and software standby mode. All the registers are initialized in a reset, but mailboxes (message control (MCx[x])/message data (MDx[x]) are not. However, after powering on, mailboxes (message control (MCx[x])/message data (MDx[x]) are initialized, and their values are undefined. Therefore, mailbox initialization must always be carried out after a reset or a transition to hardware standby mode or software standby mode. Also, the reset interrupt flag (IRR0) is always set after reset input or recovery from software standby mode. As this bit cannot be masked in the interrupt mask register (IMR), if HCAN interrupts are set as enabled by the interrupt controller without this flag having been cleared, an HCAN interrupt will be initiated immediately. IRR0 must therefore be cleared during initialization. (2) HCAN sleep mode The bus operation interrupt flag (IRR12) in the interrupt register (IRR) is set by bus operation in HCAN sleep mode. Therefore, this flag is not used by the HCAN to indicate sleep mode release. Also note that the reset status bit (GSR3) in the general status register (GSR) is set in sleep mode. (3) Interrupts When the mailbox interrupt mask register (MBIMR) is set, the interrupt register (IRR8,2,1) is not set by reception completion, transmission completion, or transmission cancellation for the set mailboxes. (4) Error counters In the case of error active and error passive, REC and TEC normally count up and down. In the bus off state, 11-bit recessive sequences are counted (REC + 1) using REC. If REC reaches 96 during the count, IRR4 and GSR1 are set. (5) Register access Byte or word access can be used on all HCAN registers. Longword access cannot be used. (6) HCAN medium-speed mode HCAN registers cannot be read or written to in medium-speed mode.
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Section 16 Controller Area Network (HCAN)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
(7) Register retention during standby All HCAN registers are initialized in hardware standby mode and software standby mode. (8) Usage of bit manipulation instructions The HCAN status flags are cleared by writing 1, so do not use a bit manipulation instruction to clear a flag. When clearing a flag, use the MOV instruction to write 1 to only the bit that is to be cleared. (9) HCAN TXCR Operation 1. When the transmit wait cancel register (TXCR) is used to cancel transmission of the message in a mailbox waiting for transmission, the corresponding bit in TXCR and the transmit wait register (TXPR) may not be cleared even after the transmission is canceled. This occurs when the following conditions are all satisfied. [Conditions] ⎯ The HRxD pin is tied to "1" because of a CAN bus error, etc. ⎯ There is one or more mailboxes waiting for transmission or transmitting. ⎯ Ongoing message transmission from a mailbox is canceled by TXCR. If this occurs, the transmission is canceled but TXPR and TXCR continue to indicate a wrong status telling that a message is being cancelled. As a result, transmission cannot be restarted even after the HRxD pin is released from the tied state and the CAN bus has recovered. If there are two or more messages for transmission, a message which is not being transmitted is canceled and a message being transmitted retains its state. To avoid this, take either of the following countermeasures. [Countermeasures] ⎯ Do not cancel transmission by TXCR. Transmission will be completed after the CAN bus has recovered, then TXPR is cleared and the HCAN operates normally. ⎯ To cancel transmission, write 1 to the corresponding bit in TXCR repeatedly until the bit becomes 0. TXPR and TXCR are cleared, and the HCAN operates normally. 2. When the bus-off state is entered while any mailbox is waiting for transmission with TXPR set, transmission cannot be canceled even if TXCR is set because the internal state machine does not operate during the bus-off state. Because of this, on recovery from the bus-off state, one message will be transmitted or the message will be canceled with a transmission error. For message clearing on recovery from the bus-off state, take the following countermeasure.
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Section 16 Controller Area Network (HCAN)
[Countermeasure] ⎯ Reset the HCAN during the bus-off period to clear the messages in the mailboxes waiting for transmission. To reset the HCAN, set the module stop bit (MSTPC3 in MSTPCRC) to 1 and then clear it. In this case, the HCAN is entirely reset. Therefore the initial settings must be made again. (10) HCAN Transmit Procedure When transmission is set while the bus is in the idle state, if the next transmission is set or the set transmission is canceled under the following conditions within 50 μs, the transmit message ID of being set may be damaged. • When the second transmission has the message whose priority is higher than the first one • When the massage of the highest priority is canceled in the first transmission Make whichever setting shown below to avoid the message IDs from being damaged. • Set transmission in one TXPR. After transmission of all transmit messages is completed, set transmission again (mass transmission setting). The interval between transmission settings should be 50 μs or longer. • Make the transmission setting according to the priority of transmit messages. • Set the interval to be 50 μs or longer between TXPR and another TXPR or between TXPR and TXCR. Table 16-6 Interval Limitation between TXPR and TXPR or between TXPR and TXCR
Baud Rate (bps) 1M 500 k 250 k Set Interval (μs) 50 50 50
(11) Note on Releasing the HCAN Reset or HCAN Sleep Before releasing the HCAN reset or HCAN sleep (MCR0 = 0 or MCR5 = 0), confirm that the GSR3 bit (the reset status bit) is set to 1. (12) Note on Accessing Mailbox during the HCAN Sleep Do not access the mailbox during the HCAN sleep. If accessed, the CPU might halt. Accessing registers during the HCAN sleep does not cause the CPU halt, nor does accessing the mailbox in other than the HCAN sleep mode.
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Section 17 A/D Converter
Section 17 A/D Converter
Note: The H8S/2635 Group is not equipped with a DTC.
17.1
Overview
The chip incorporates a successive approximation type 10-bit A/D converter that allows up to twelve analog input channels to be selected. 17.1.1 Features
A/D converter features are listed below. • 10-bit resolution • Twelve input channels • Settable analog conversion voltage range ⎯ Conversion of analog voltages with the reference voltage pin (Vref) as the analog reference voltage • High-speed conversion ⎯ Minimum conversion time: 13.3 µs per channel (at 20-MHz operation) • Choice of single mode or scan mode ⎯ Single mode: Single-channel A/D conversion ⎯ Scan mode: Continuous A/D conversion on 1 to 4 channels • Four data registers ⎯ Conversion results are held in a 16-bit data register for each channel • Sample and hold function • Three kinds of conversion start ⎯ Choice of software or timer conversion start trigger (TPU), or ADTRG pin • A/D conversion end interrupt generation ⎯ A/D conversion end interrupt (ADI) request can be generated at the end of A/D conversion • Module stop mode can be set ⎯ As the initial setting, A/D converter operation is halted. Register access is enabled by exiting module stop mode.
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Section 17 A/D Converter
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
17.1.2
Block Diagram
Figure 17-1 shows a block diagram of the A/D converter.
Module data bus
Internal data bus
AVCC Vref AVSS 10-bit D/A
Successive approximations register
ADDRC
ADDRD
ADDRA
ADDRB
ADCSR
AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11
ADCR
Bus interface
+ φ/2 φ/4 Control circuit φ/8 φ/16 − ADI interrupt Conversion start trigger from TPU
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Multiplexer
Comparator Sample-andhold circuit
ADTRG Legend: ADCR: ADCSR: ADDRA: ADDRB: ADDRC: ADDRD:
A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D
Figure 17-1 Block Diagram of A/D Converter
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Section 17 A/D Converter
17.1.3
Pin Configuration
Table 17-1 summarizes the input pins used by the A/D converter. The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. The Vref pin is the A/D conversion reference voltage pin. The 12 analog input pins are divided into two channel sets and two groups, with analog input pins 0 to 7 (AN0 to AN7) comprising channel set 0, analog input pins 8 to 11 (AN8 to AN11) comprising channel set 1, analog input pins 0 to 3 and 8 to 11 (AN0 to AN3, AN8 to AN11) comprising group 0, and analog input pins 4 to 7 (AN4 to AN7) comprising group 1. Table 17-1 A/D Converter Pins
Pin Name Analog power supply pin Analog ground pin Reference voltage pin Analog input pin 0 Analog input pin 1 Analog input pin 2 Analog input pin 3 Analog input pin 4 Analog input pin 5 Analog input pin 6 Analog input pin 7 Analog input pin 8 Analog input pin 9 Analog input pin 10 Analog input pin 11 A/D external trigger input pin Symbol AVCC AVSS Vref AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 ADTRG I/O Input Input Input Input Input Input Input Input Input Input Input Input Input Input Input Input External trigger input for starting A/D conversion Channel set 1 (CH3 = 1) group 0 analog inputs Channel set 0 (CH3 = 0) group 1 analog inputs Function Analog block power supply Analog block ground and reference voltage A/D conversion reference voltage Channel set 0 (CH3 = 0) group 0 analog inputs
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17.1.4
Register Configuration
Table 17-2 summarizes the registers of the A/D converter. Table 17-2 A/D Converter Registers
Name A/D data register AH A/D data register AL A/D data register BH A/D data register BL A/D data register CH A/D data register CL A/D data register DH A/D data register DL A/D control/status register A/D control register Module stop control register A Abbreviation ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR MSTPCRA R/W R R R R R R R R R/(W) R/W R/W *2 Initial Value H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'33 H'3F Address* H'FF90 H'FF91 H'FF92 H'FF93 H'FF94 H'FF95 H'FF96 H'FF97 H'FF98 H'FF99 H'FDE8
1
Notes: 1. Lower 16 bits of the address. 2. Bit 7 can only be written with 0 for flag clearing.
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17.2
17.2.1
Bit
Register Descriptions
A/D Data Registers A to D (ADDRA to ADDRD)
: 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R 5 0 R 4 ⎯ 0 R 3 ⎯ 0 R 2 ⎯ 0 R 1 ⎯ 0 R 0 ⎯ 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 ⎯ Initial value : R/W :
There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of A/D conversion. The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected channel and stored there. The upper 8 bits of the converted data are transferred to the upper byte (bits 15 to 8) of ADDR, and the lower 2 bits are transferred to the lower byte (bits 7 and 6) and stored. Bits 5 to 0 are always read as 0. The correspondence between the analog input channels and ADDR registers is shown in table 17-3. ADDR can always be read by the CPU. The upper byte can be read directly, but for the lower byte, data transfer is performed via a temporary register (TEMP). For details, see section 17.3, Interface to Bus Master. The ADDR registers are initialized to H'0000 by a reset, and in standby mode or module stop mode. Table 17-3 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel Channel Set 0 (CH3 = 0) Group 0 AN0 AN1 AN2 AN3 Group 1 AN4 AN5 AN6 AN7 Channel Set 1 (CH3 = 1) Group 0 AN8 AN9 AN10 AN11 Group 1 Setting prohibited Setting prohibited Setting prohibited Setting prohibited A/D Data Register ADDRA ADDRB ADDRC ADDRD
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17.2.2
Bit
A/D Control/Status Register (ADCSR)
: 7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CH3 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W
Initial value : R/W :
Note: * Only 0 can be written to bit 7, to clear this flag.
ADCSR is an 8-bit readable/writable register that controls A/D conversion operations. ADCSR is initialized to H'00 by a reset, and in hardware standby mode or module stop mode. Bit 7—A/D End Flag (ADF): Status flag that indicates the end of A/D conversion.
Bit 7 ADF 0 Description [Clearing conditions] • • 1 • • When 0 is written to the ADF flag after reading ADF = 1 When the DTC is activated by an ADI interrupt and ADDR is read Single mode: When A/D conversion ends Scan mode: When A/D conversion ends on all specified channels (Initial value)
[Setting conditions]
Bit 6—A/D Interrupt Enable (ADIE): Selects enabling or disabling of interrupt (ADI) requests at the end of A/D conversion.
Bit 6 ADIE 0 1 Description A/D conversion end interrupt (ADI) request disabled A/D conversion end interrupt (ADI) request enabled (Initial value)
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Bit 5—A/D Start (ADST): Selects starting or stopping on A/D conversion. Holds a value of 1 during A/D conversion. The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external trigger input pin (ADTRG).
Bit 5 ADST 0 1 Description A/D conversion stopped (Initial value)
Single mode: A/D conversion is started. Cleared to 0 automatically when conversion on the specified channel ends Scan mode: A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or a transition to standby mode or module stop mode.
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating mode. See section 17.4, Operation, for single mode and scan mode operation. Only set the SCAN bit while conversion is stopped (ADST = 0).
Bit 4 SCAN 0 1 Description Single mode Scan mode (Initial value)
Bit 3—Channel Select 3 (CH3): Switches the analog input pins assigned to group 0 or group 1. Setting CH3 to 1 enables AN8 to AN11 to be used instead of AN0 to AN7.
Bit 3 CH3 1 0 Description AN8 to AN11 are group 0 analog input pins AN0 to AN3 are group 0 analog input pins, AN4 to AN7 are group 1 analog input pins (Initial value)
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Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): Together with the SCAN bit, these bits select the analog input channels. Only set the input channel while conversion is stopped (ADST = 0).
Channel Selection CH3 0 CH2 0 CH1 0 1 1 0 1 1 0 0 1 1 0 1 CH0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Single Mode (SCAN = 0) AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 Setting prohibited Setting prohibited Setting prohibited Setting prohibited (Initial value) Description Scan Mode (SCAN = 1) AN0 AN0, AN1 AN0 to AN2 AN0 to AN3 AN4 AN4, AN5 AN4 to AN6 AN4 to AN7 AN8 AN8, AN9 AN8 to AN10 AN8 to AN11 Setting prohibited Setting prohibited Setting prohibited Setting prohibited
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17.2.3
Bit
A/D Control Register (ADCR)
: 7 TRGS1 0 R/W 6 TRGS0 0 R/W 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ 3 CKS1 0 R/W 2 CKS0 0 R/W 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
Initial value : R/W :
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D conversion operations and sets the A/D conversion time. ADCR is initialized to H'33 by a reset, and in standby mode or module stop mode. Bits 7 and 6—Timer Trigger Select 1 and 0 (TRGS1, TRGS0): Select enabling or disabling of the start of A/D conversion by a trigger signal. Only set bits TRGS1 and TRGS0 while conversion is stopped (ADST = 0).
Bit 7 TRGS1 0 1 Bit 6 TRGS0 0 1 0 1 Description A/D conversion start by software is enabled Setting prohibited A/D conversion start by external trigger pin (ADTRG) is enabled (Initial value)
A/D conversion start by TPU conversion start trigger is enabled
Bits 5, 4, 1, and 0—Reserved: These bits are reserved; they are always read as 1 and cannot be modified. Bits 3 and 2—Clock Select 1 and 0 (CKS1, CKS0): These bits select the A/D conversion time. The conversion time should be changed only when ADST = 0. Set bits CKS1 and CKS0 to give a conversion time of at least 10 µs.
Bit 3 CKS1 0 1 Bit 2 CKS0 0 1 0 1 Description Conversion time = 530 states (max.) Conversion time = 266 states (max.) Conversion time = 134 states (max.) Conversion time = 68 states (max.) (Initial value)
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17.2.4
Bit
Module Stop Control Register A (MSTPCRA)
: 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
MSTPA7 MSTPA6 MSTPA5 MSTPA4 MSTPA3 MSTPA2 MSTPA1 MSTPA0 Initial value : R/W :
MSTPCR is an 8-bit readable/writable register that performs module stop mode control. When the MSTPA1 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to in module stop mode. For details, see section 23A.5, 23B.5, Module Stop Mode. MSTPCRA is initialized to H'3F by a reset and in hardware standby mode. It is not initialized by a reset and in software standby mode. Bit 1—Module Stop (MSTPA1): Specifies the A/D converter module stop mode.
Bit 1 MSTPA1 0 1 Description A/D converter module stop mode cleared A/D converter module stop mode set (Initial value)
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17.3
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers, and the data bus to the bus master is 8 bits wide. Therefore, in accesses by the bus master, the upper byte is accessed directly, but the lower byte is accessed via a temporary register (TEMP). A data read from ADDR is performed as follows. When the upper byte is read, the upper byte value is transferred to the CPU and the lower byte value is transferred to TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading ADDR, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 17-2 shows the data flow for ADDR access.
Upper byte read
Bus master (H'AA)
Bus interface
Module data bus
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40)
(n = A to D)
Lower byte read
Bus master (H'40)
Module data bus Bus interface
TEMP (H'40)
ADDRnH (H'AA)
ADDRnL (H'40)
(n = A to D)
Figure 17-2 ADDR Access Operation (Reading H'AA40)
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17.4
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two operating modes: single mode and scan mode. 17.4.1 Single Mode (SCAN = 0)
Single mode is selected when A/D conversion is to be performed on a single channel only. A/D conversion is started when the ADST bit is set to 1, according to the software or external trigger input. The ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when conversion ends. On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an ADI interrupt request is generated. The ADF flag is cleared by writing 0 after reading ADCSR. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 17-3 shows a timing diagram for this example. [1] Single mode is selected (SCAN = 0), input channel AN1 is selected (CH3 = 0, CH2 = 0, CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). [2] When A/D conversion is completed, the result is transferred to ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. [3] Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. [4] The A/D interrupt handling routine starts. [5] The routine reads ADCSR, then writes 0 to the ADF flag. [6] The routine reads and processes the connection result (ADDRB). [7] Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps [2] to [7] are repeated.
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Set* ADIE ADST ADF State of channel 0 (AN0) State of channel 1 (AN1) State of channel 2 (AN2) State of channel 3 (AN3) Idle Idle Idle Idle
A/D conversion 1
A/D conversion starts
Set* Clear*
Set* Clear*
Idle
A/D conversion 2
Idle
ADDRA ADDRB ADDRC ADDRD Read conversion result A/D conversion result 1 Read conversion result A/D conversion result 2
Note: * Vertical arrows ( ) indicate instructions executed by software.
Figure 17-3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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17.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by a software, timer or external trigger input, A/D conversion starts on the first channel in the group (AN0). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the ADDR registers corresponding to the channels. When the operating mode or analog input channel must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again from the first channel (AN0). The ADST bit can be set at the same time as the operating mode or input channel is changed. Typical operations when three channels (AN0 to AN2) are selected in scan mode are described next. Figure 17-4 shows a timing diagram for this example. [1] Scan mode is selected (SCAN = 1), channel set 0 is selected (CH3 = 0), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1) [2] When A/D conversion of the first channel (AN0) is completed, the result is transferred to ADDRA. Next, conversion of the second channel (AN1) starts automatically. [3] Conversion proceeds in the same way through the third channel (AN2). [4] When conversion of all the selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D conversion ends. [5] Steps [2] to [4] are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0).
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Continuous A/D conversion execution
Set*1 ADST ADF A/D conversion time State of channel 0 (AN0) State of channel 1 (AN1) State of channel 2 (AN2) State of channel 3 (AN3) Transfer ADDRA ADDRB ADDRC ADDRD Notes: 1. Vertical arrows ( ) indicate instructions executed by software. 2. Data currently being converted is ignored. A/D conversion result 1 A/D conversion result 4 A/D conversion result 2 A/D conversion result 3 Idle Idle Idle
A/D conversion 1
Clear*1 Clear*1
Idle
A/D conversion 2
A/D conversion 4 A/D conversion 5 *2
Idle Idle Idle
Idle
A/D conversion 3
Idle
Figure 17-4 Example of A/D Converter Operation (Scan Mode, 3 Channels AN0 to AN2 Selected)
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17.4.3
Input Sampling and A/D Conversion Time
The A/D converter has an on-chip sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 17-5 shows the A/D conversion timing. Table 17-4 indicates the A/D conversion time. As indicated in figure 17-5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 17-4. In scan mode, the values given in table 17-4 apply to the first conversion time. The values given in table 17-5 apply to the second and subsequent conversions. In both cases, set bits CKS1 and CKS0 in ADCR to give a conversion time of at least 10 µs.
(1) φ Address (2)
Write signal
Input sampling timing
ADF tD t SPL t CONV Legend: (1): ADCSR write cycle (2): ADCSR address A/D conversion start delay tD: tSPL: Input sampling time tCONV: A/D conversion time
Figure 17-5 A/D Conversion Timing
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Table 17-4 A/D Conversion Time (Single Mode)
CKS1 = 0 CKS0 = 0 Item CKS0 = 1 CKS1 = 0 CKS0 = 0 CKS0 = 1
Symbol Min Typ Max Min Typ Max Min Typ Max Min Typ Max 18 — — 33 10 — — 63 17 — 6 — — 31 9 — 4 — — 15 — 5 — 68
A/D conversion start delay tD Input sampling time A/D conversion time tSPL tCONV
127 —
515 —
530 259 —
266 131 —
134 67
Note: Values in the table are the number of states.
Table 17-5 A/D Conversion Time (Scan Mode)
CKS1 0 1 CKS0 0 1 0 1 Conversion Time (State) 512 (Fixed) 256 (Fixed) 128 (Fixed) 64 (Fixed)
17.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS1 and TRGS0 bits are set to 11 in ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as if the ADST bit has been set to 1 by software. Figure 17-6 shows the timing.
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φ
ADTRG
Internal trigger signal
ADST A/D conversion
Figure 17-6 External Trigger Input Timing
17.5
Interrupts
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion. ADI interrupt requests can be enabled or disabled by means of the ADIE bit in ADCSR. The DTC can be activated by an ADI interrupt. Having the converted data read by the DTC in response to an ADI interrupt enables continuous conversion to be achieved without imposing a load on software. The A/D converter interrupt source is shown in table 17-6. Table 17-6 A/D Converter Interrupt Source
Interrupt Source ADI Description Interrupt due to end of conversion DTC Activation Possible
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17.6
Usage Notes
The following points should be noted when using the A/D converter. Setting Range of Analog Power Supply and Other Pins: (1) Analog input voltage range The voltage applied to analog input pin ANn during A/D conversion should be in the range AVSS ≤ ANn ≤ Vref. (2) Relation between AVCC, AVSS and VCC, VSS As the relationship between AVSS and VSS, set AVSS = VSS. If the A/D converter is not used, set AVCC = VCC, and do not leave the AVCC and AVSS pins open or no account. (3) Vref input range The analog reference voltage input at the Vref pin set in the range Vref ≤ AVCC. If conditions (1), (2), and (3) above are not met, the reliability of the device may be adversely affected. Notes on Board Design: In board design, digital circuitry and analog circuitry should be as mutually isolated as possible, and layout in which digital circuit signal lines and analog circuit signal lines cross or are in close proximity should be avoided as far as possible. Failure to do so may result in incorrect operation of the analog circuitry due to inductance, adversely affecting A/D conversion values. Also, digital circuitry must be isolated from the analog input signals (AN0 to AN11), analog reference power supply (Vref), and analog power supply (AVCC) by the analog ground (AVSS). Also, the analog ground (AVSS) should be connected at one point to a stable digital ground (VSS) on the board. Notes on Noise Countermeasures: A protection circuit connected to prevent damage due to an abnormal voltage such as an excessive surge at the analog input pins (AN0 to AN11) and analog reference power supply (Vref) should be connected between AVCC and AVSS as shown in figure 17-7. Also, the bypass capacitors connected to AVCC and Vref and the filter capacitor connected to AN0 to AN11 must be connected to AVSS. If a filter capacitor is connected as shown in figure 17-7, the input currents at the analog input pins (AN0 to AN11) are averaged, and so an error may arise. Also, when A/D conversion is performed frequently, as in scan mode, if the current charged and discharged by the capacitance of the
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sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance (Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore required when deciding the circuit constants.
AVCC
Vref Rin* 2 *1 *1 0.1 μF 100Ω AN0 to AN11
AVSS
Notes:
Values are reference values. 1. 10 μF 0.01 μF
2. Rin: Input impedance
Figure 17-7 Example of Analog Input Protection Circuit Table 17-7 Analog Pin Specifications
Item Analog input capacitance Permissible signal source impedance Min — — Max 20 5 Unit pF kΩ
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10 kΩ AN0 to AN11 To A/D converter 20 pF
Note: Values are reference values.
Figure 17-8 Analog Input Pin Equivalent Circuit A/D Conversion Precision Definitions: The chip’s A/D conversion precision definitions are given below. • Resolution The number of A/D converter digital output codes • Offset error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from the minimum voltage value B'0000000000 (H'00) to B'0000000001 (H'01) (see figure 17-10). • Full-scale error The deviation of the analog input voltage value from the ideal A/D conversion characteristic when the digital output changes from B'1111111110 (H'3E) to B'1111111111 (H'3F) (see figure 17-10). • Quantization error The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 17-9). • Nonlinearity error The error with respect to the ideal A/D conversion characteristic between the zero voltage and the full-scale voltage. Does not include the offset error, full-scale error, or quantization error. • Absolute precision The deviation between the digital value and the analog input value. Includes the offset error, full-scale error, quantization error, and nonlinearity error.
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Digital output
111 110 101 100 011 010 001 000
Ideal A/D conversion characteristic
Quantization error
1 2 1024 1024
1022 1023 1024 1024
FS
Analog input voltage
Figure 17-9 A/D Conversion Precision Definitions (1)
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Digital output
Full-scale error
Ideal A/D conversion characteristic
Nonlinearity error
Actual A/D conversion characteristic FS Offset error Analog input voltage
Figure 17-10 A/D Conversion Precision Definitions (2) Permissible Signal Source Impedance: The chip's analog input is designed so that conversion precision is guaranteed for an input signal for which the signal source impedance is 10 kΩ or less. This specification is provided to enable the A/D converter’s sample-and-hold circuit input capacitance to be charged within the sampling time; if the sensor output impedance exceeds 10 kΩ, charging may be insufficient and it may not be possible to guarantee the A/D conversion precision. However, if a large capacitance is provided externally, the input load will essentially comprise only the internal input resistance of 10 kΩ, and the signal source impedance is ignored. However, since a low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with a large differential coefficient (e.g., 5 mV/µs or greater). When converting a high-speed analog signal, a low-impedance buffer should be inserted.
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Influences on Absolute Precision: Adding capacitance results in coupling with GND, and therefore noise in GND may adversely affect absolute precision. Be sure to make the connection to an electrically stable GND such as AVSS. Care is also required to insure that filter circuits do not communicate with digital signals on the mounting board, so acting as antennas. Figure 17-11 shows an example of analog input circuit.
Chip Sensor output impedance to 5 kΩ Sensor input Low-pass filter C to 0.1 μF Cin = 15 pF
A/D converter equivalent circuit 10 kΩ
20 pF
Figure 17-11 Example of Analog Input Circuit
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Section 18 D/A Converter
Section 18 D/A Converter
Note: The H8S/2635 Group is not equipped with a D/A converter.
18.1
Overview
The chip has an on-chip D/A converter module with two channels. 18.1.1 Features
Features of the D/A converter module are listed below. • Eight-bit resolution • Two-channel output • Maximum conversion time: 10 µs (with 20-pF load capacitance) • Output voltage: 0 V to Vref • D/A output retention in software standby mode • Possible to set module stop mode Operation of D/A converter is disenabled by initial values. It is possible to access the register by canceling module stop mode.
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Section 18 D/A Converter
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
18.1.2
Block Diagram
Figure 18-1 shows a block diagram of the D/A converter.
Module data bus
Bus interface
Internal data bus
Vref AVCC
DADR0
DADR1
DA1 DA0 AVSS
8-bit D/A
Control circuit Legend: DACR: DADR0, DADR1: D/A control register D/A data register 0, 1
Figure 18-1 Block Diagram of D/A Converter
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DACR
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Section 18 D/A Converter
18.1.3
Input and Output Pins
Table 18-1 lists the input and output pins used by the D/A converter module. Table 18-1 Input and Output Pins of D/A Converter Module
Name Analog supply voltage Analog ground Analog output 0 Analog output 1 Reference voltage Abbreviation AVCC AVSS DA0 DA1 Vref I/O Input Input Output Output Input Function Power supply for analog circuits Ground and reference voltage for analog circuits Analog output channel 0 Analog output channel 1 Reference voltage of analog section
18.1.4
Register Configuration
Table 18-2 lists the registers of the D/A converter module. Table 18-2 D/A Converter Registers
Channel 0, 1 Name D/A data register 0 D/A data register 1 D/A control register 01 All Module stop control register A Note: * Lower 16 bits of the address. Abbreviation DADR0 DADR1 DACR01 MSTPCRA R/W R/W R/W R/W R/W Initial Value H'00 H'00 H'1F H'3F Address* H'FFA4 H'FFA5 H'FFA6 H'FDF8
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Section 18 D/A Converter
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
18.2
18.2.1
Bit
Register Descriptions
D/A Data Registers 0, 1 (DADR0, DADR1)
7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Initial value Read/Write
D/A data registers 0, 1 (DADR0, DADR1) are 8-bit readable/writable registers that store data to be converted. When analog output is enabled, the value in the D/A data register is converted and output continuously at the analog output pin. The D/A data registers are initialized to H'00 by a reset and in hardware standby mode. 18.2.2
Bit Initial value Read/Write
D/A Control Register 01 (DACR01)
7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 — 1 — 3 — 1 — 2 — 1 — 1 — 1 — 0 — 1 —
DACR01 is an 8-bit readable/writable register that controls the operation of the D/A converter module. DACR01 is initialized to H'1F by a reset and in hardware standby mode. Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7 DAOE1 0 1 Description Analog output DA1 is disabled D/A conversion is enabled on channel 1. Analog output DA1 is enabled (Initial value)
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Section 18 D/A Converter
Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6 DAOE0 0 1 Description Analog output DA0 is disabled D/A conversion is enabled on channel 0. Analog output DA0 is enabled (Initial value)
Bit 5—D/A Enable (DAE): Controls D/A conversion, in combination with bits DAOE0 and DAOE1. D/A conversion is controlled independently on channels 0 and 1 when DAE = 0. Channels 0 and 1 are controlled together when DAE = 1. Output of the converted results is always controlled independently by DAOE0 and DAOE1.
Bit 7 DAOE1 0 Bit 6 DAOE0 0 1 Bit 5 DAE * 0 1 1 0 0 1 1 * D/A conversion Disabled on channels 0 and 1 Enabled on channel 0 Disabled on channel 1 Enabled on channels 0 and 1 Disabled on channel 0 Enabled on channel 1 Enabled on channels 0 and 1 Enabled on channels 0 and 1 *: Don’t care
If the chip enters software standby mode while D/A conversion is enabled, the D/A output is retained and the analog power supply current is the same as during D/A conversion. If it is necessary to reduce the analog power supply current in software standby mode, disable D/A output by clearing both the DAOE0 and DAOE1 bits to 0. Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
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Section 18 D/A Converter
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
18.2.3
Module Stop Control Register A (MSTPCRA)
MSTPCRA Bit : 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
MSTPA7 MSTPA6 MSTPA5 MSTPA4 MSTPA3 MSTPA2 MSTPA1 MSTPA0 Initial value : R/W :
MSTPCRA is an 8-bit readable/writable registers that performs module stop mode control. When the MSTPA2 is set to 1, the D/A converter halts and enters module stop mode at the end of the bus cycle. Register read/write is disenabled in module stop mode. See section 23A.5, 23B.5, Module Stop Mode, for details. MSTPCRA is initialized to H'3F by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 2—Module Stop (MSTPA2): Specifies D/A converter (channels 0 and 1) module stop mode.
Bit 2 MSTPA2 0 1 Description D/A converter (channels 0 and 1) module stop mode is cleared D/A converter (channels 0 and 1) module stop mode is set (Initial value)
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Section 18 D/A Converter
18.3
Operation
The D/A converter module has one on-chip D/A converter circuits that can operate independently. D/A conversion is performed continuously whenever enabled by the D/A control register (DACR). When a new value is written in DADR0 or DADR1, conversion of the new value begins immediately. The converted result is output by setting the DAOE0 or DAOE1 bit to 1. An example of conversion on channel 0 is given next. Figure 18-2 shows the timing. • Software writes the data to be converted in DADR0. • D/A conversion begins when the DAOE0 bit in DACR is set to 1. After the elapse of the conversion time, analog output appears at the DA0 pin. Contents of DADR / 256 × Vref This output continues until a new value is written in DADR0 or the DAOE0 bit is cleared to 0. • If a new value is written in DADR0, conversion begins immediately. Output of the converted result begins after the conversion time. • When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle
φ
Address
DADR0
Conversion data (1)
Conversion data (2)
DAOE0
DA0 High-impedance state t DCONV
Conversion result (1)
Conversion result (2) t DCONV
Legend: tDCONV: D/A conversion time
Figure 18-2 D/A Conversion (Example)
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Section 19 Motor Control PWM Timer
Section 19 Motor Control PWM Timer
Note: The H8S/2635 Group is not equipped with a DTC.
19.1
Overview
The chip has an on-chip motor control PWM (pulse width modulator) with a maximum capability of 16 pulse outputs. 19.1.1 Features
Features of the motor control PWM are given below. • Maximum of 16 pulse outputs ⎯ Two 10-bit PWM channels, each with eight outputs. ⎯ Each channel is provided with a 10-bit counter (PWCNT) and cycle register (PWCYR). ⎯ Duty and output polarity can be set for each output. • Buffered duty registers ⎯ Duty registers (PWDTR) are provided with buffer registers (PWBFR), with data transferred automatically every cycle. ⎯ Channel 1 has four duty registers and four buffer registers. ⎯ Channel 2 has eight duty registers and four buffer registers. • 0% to 100% duty ⎯ A duty cycle of 0% to 100% can be set by means of a duty register setting. • Five operating clocks ⎯ There is a choice of five operating clocks (φ, φ/2, φ/4, φ/8, φ/16). • High-speed access via internal 16-bit-bus ⎯ High-speed access is possible via a 16-bit bus interface. • Two interrupt sources ⎯ An interrupt can be requested independently for each channel by a cycle register compare match. • Automatic transfer of register data ⎯ Block transfer and one-word data transfer are possible by activating the data transfer controller (DTC). • Module stop mode ⎯ As the initial setting, PWM operation is halted. Register access is enabled by clearing module stop mode.
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.1.2
Block Diagram
Figure 19-1 shows a block diagram of PWM channel 1.
φ, φ/2, φ/4, φ/8, φ/16 Interrupt request PWCR1 Compare match PWCNT1 PWOCR1 Port control
PWCYR1
12 9 0
PWPR1
Bus interface
12 9
0
Internal data bus
PWBFR1A
PWDTR1A
P/N P/N P/N P/N P/N P/N P/N P/N
PWM1A PWM1B PWM1C PWM1D PWM1E PWM1F PWM1G PWM1H
PWBFR1C
PWDTR1C
PWBFR1E
PWDTR1E
PWBFR1G
PWDTR1G
Legend: PWCR1: PWOCR1: PWPR1: PWCNT1: PWCYR1: PWDTR1A, 1C, 1E, 1G: PWBFR1A, 1C, 1E, 1G:
PWM control register 1 PWM output control register 1 PWM polarity register 1 PWM counter 1 PWM cycle register 1 PWM duty registers 1A, 1C, 1E, 1G PWM buffer registers 1A, 1C, 1E, 1G
Figure 19-1 Block Diagram of PWM Channel 1
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Section 19 Motor Control PWM Timer
Figure 19-2 shows a block diagram of PWM channel 2.
φ, φ/2, φ/4, φ/8, φ/16 Interrupt request PWCR2 PWCNT2 PWOCR2 Port control
Compare match
PWCYR2
9 0
PWPR2
12 9
0
PWBFR2A
PWDTR2A
P/N
PWM2A
Internal data bus
Bus interface
PWBFR2B
PWDTR2B
P/N
PWM2B
PWBFR2C
PWDTR2C
P/N
PWM2C
PWBFR2D
PWDTR2D PWDTR2E PWDTR2F PWDTR2G PWDTR2H
P/N P/N P/N P/N P/N
PWM2D PWM2E PWM2F PWM2G PWM2H
Legend: PWCR2: PWOCR2: PWPR2: PWCNT2: PWCYR2: PWDTR2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H: PWBFR2A, 2B, 2C, 2D:
PWM control register 2 PWM output control register 2 PWM polarity register 2 PWM counter 2 PWM cycle register 2 PWM duty registers 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H PWM buffer registers 2A, 2B, 2C, 2D
Figure 19-2 Block Diagram of PWM Channel 2
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.1.3
Pin Configuration
Table 19-1 shows the PWM pin configuration. Table 19-1 PWM Pin Configuration
Name PWM output pin 1A PWM output pin 1B PWM output pin 1C PWM output pin 1D PWM output pin 1E PWM output pin 1F PWM output pin 1G PWM output pin 1H PWM output pin 2A PWM output pin 2B PWM output pin 2C PWM output pin 2D PWM output pin 2E PWM output pin 2F PWM output pin 2G PWM output pin 2H Abbrev. PWM1A PWM1B PWM1C PWM1D PWM1E PWM1F PWM1G PWM1H PWM2A PWM2B PWM2C PWM2D PWM2E PWM2F PWM2G PWM2H I/O Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Function Channel 1A PWM output Channel 1B PWM output Channel 1C PWM output Channel 1D PWM output Channel 1E PWM output Channel 1F PWM output Channel 1G PWM output Channel 1H PWM output Channel 2A PWM output Channel 2B PWM output Channel 2C PWM output Channel 2D PWM output Channel 2E PWM output Channel 2F PWM output Channel 2G PWM output Channel 2H PWM output
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Section 19 Motor Control PWM Timer
19.1.4
Register Configuration
Table 19-2 shows the register configuration of the PWM. Table 19-2 PWM Registers
Channel 1 Name PWM control register 1 PWM output control register 1 PWM polarity register 1 PWM cycle register 1 PWM buffer register 1A PWM buffer register 1C PWM buffer register 1E PWM buffer register 1G 2 PWM control register 2 PWM output control register 2 PWM polarity register 2 PWM cycle register 2 PWM buffer register 2A PWM buffer register 2B PWM buffer register 2C PWM buffer register 2D All Module stop control register D Abbrev. PWCR1 PWOCR1 PWPR1 PWCYR1 PWBFR1A PWBFR1C PWBFR1E PWBFR1G PWCR2 PWOCR2 PWPR2 PWCYR2 PWBFR2A PWBFR2B PWBFR2C PWBFR2D MSTPCRD R/W Initial Value Address* H'FC00 H'FC02 H'FC04 H'FC06 H'FC08 H'FC0A H'FC0C H'FC0E H'FC10 H'FC12 H'FC14 H'FC16 H'FC18 H'FC1A H'FC1C H'FC1E H'FC60
1
2 R/(W)* H'C0
R/W R/W R/W R/W R/W R/W R/W R/(W) R/W R/W R/W R/W R/W R/W R/W R/W *2
H'00 H'00 H'FFFF H'EC00 H'EC00 H'EC00 H'EC00 H'C0 H'00 H'00 H'FFFF H'EC00 H'EC00 H'EC00 H'EC00 B'11******
Notes: 1. Lower 16 bits of the address. 2. Only 0 may be written to bit 4, to clear the flag.
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.2
19.2.1
Bit
Register Descriptions
PWM Control Registers 1 and 2 (PWCR1, PWCR2)
7 — 1 — 6 — 1 — 5 IE 0 R/W 4 CMF 0 R/W * 3 CST 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Initial value Read/Write
Note: * Only 0 can be written, to clear the flag.
PWCR is an 8-bit read/write register that performs interrupt enabling, starting/stopping, and counter (PWCNT) clock selection. It also contains a flag that indicates a compare match with the cycle register (PWCYR). PWCR1 is the channel 1 register, and PWCR2 is the channel 2 register. PWCR is initialized to H'C0 upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions. Bits 7 and 6—Reserved: They are always read as 1 and cannot be modified. Bit 5—Interrupt Enable (IE): Bit 5 selects enabling or disabling of an interrupt in the event of a compare match with the PWCYR register for the corresponding channel.
Bit 5: IE 0 1 Description Interrupt disabled Interrupt enabled (Initial value)
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Section 19 Motor Control PWM Timer
Bit 4—Compare Match Flag (CMF): Bit 4 indicates the occurrence of a compare match with the PWCYR register for the corresponding channel.
Bit 4: CMF 0 Description [Clearing conditions] • • 1 When 0 is written to CMF after reading CMF = 1 When the DTC is activated by a compare match interrupt, and the DISEL bit in the DTC’s MRB register is 0 When PWCNT = PWCYR (Initial value)
[Setting condition] •
Bit 3—Counter Start (CST): Bit 3 selects starting or stopping of the PWCNT counter for the corresponding channel.
Bit 3: CST 0 1 Description PWCNT is stopped PWCNT is started (Initial value)
Bits 2 to 0—Clock Select (CKS): Bits 2 to 0 select the clock for the PWCNT counter in the corresponding channel.
Bit 2: CKS2 0 Bit 1: CKS1 0 1 1 * Bit 0: CKS0 0 1 0 1 * Description Internal clock: counts on φ/1 Internal clock: counts on φ/2 Internal clock: counts on φ/4 Internal clock: counts on φ/8 Internal clock: counts on φ/16 *: Don’t care (Initial value)
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.2.2
PWOCR1 Bit
PWM Output Control Registers 1 and 2 (PWOCR1, PWOCR2)
7 OE1H 0 R/W
6 OE1G 0 R/W
5 OE1F 0 R/W
4 OE1E 0 R/W
3 OE1D 0 R/W
2 OE1C 0 R/W
1 OE1B 0 R/W
0 OE1A 0 R/W
Initial value Read/Write PWOCR2 Bit Initial value Read/Write
7 OE2H 0 R/W
6 OE2G 0 R/W
5 OE2F 0 R/W
4 OE2E 0 R/W
3 OE2D 0 R/W
2 OE2C 0 R/W
1 OE2B 0 R/W
0 OE2A 0 R/W
PWOCR is an 8-bit read/write register that enables or disables PWM output. PWOCR1 controls outputs PWM1H to PWM1A, and PWOCR2 controls outputs PWM2H to PWM2A. PWOCR is initialized to H'00 upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Bits 7 to 0—Output Enable (OE): Each of these bits enables or disables the corresponding PWM output.
Bits 7 to 0: OE 0 1 Description PWM output is disabled PWM output is enabled (Initial value)
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Section 19 Motor Control PWM Timer
19.2.3
PWPR1 Bit
PWM Polarity Registers 1 and 2 (PWPR1, PWPR2)
7 OPS1H 0 R/W
6 OPS1G 0 R/W
5 OPS1F 0 R/W
4 OPS1E 0 R/W
3 OPS1D 0 R/W
2 OPS1C 0 R/W
1 OPS1B 0 R/W
0 OPS1A 0 R/W
Initial value Read/Write PWPR2 Bit Initial value Read/Write
7 OPS2H 0 R/W
6 OPS2G 0 R/W
5 OPS2F 0 R/W
4 OPS2E 0 R/W
3 OPS2D 0 R/W
2 OPS2C 0 R/W
1 OPS2B 0 R/W
0 OPS2A 0 R/W
PWPR is an 8-bit read/write register that selects the PWM output polarity. PWPR1 controls outputs PWM1H to PWM1A, and PWPR2 controls outputs PWM2H to PWM2A. PWPR is initialized to H'00 upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Bits 7 to 0—Output Polarity Select (OPS): Each of these bits selects the polarity of the corresponding PWM output.
Bits 7 to 0: OPS 0 1 Description PWM direct output PWM inverse output (Initial value)
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.2.4
Bit
PWM Counters 1 and 2 (PWCNT1, PWCNT2)
15 — 1 — 14 — 1 — 13 — 1 — 12 — 1 — 11 — 1 — 10 — 1 — 0 — 0 — 0 — 0 — 0 — 0 — 0 — 0 — 0 — 0 — 9 8 7 6 5 4 3 2 1 0
Initial value Read/Write
PWCNT is a 10-bit up-counter incremented by the input clock. The input clock is selected by clock select bits 2 to 0 (CKS2 to CKS0) in PWCR. PWCNT1 is used as the channel 1 time base, and PWCNT2 as the channel 2 time base. PWCNT is initialized to H'FC00 when the counter start bit (CST) in PWCR is cleared to 0, and also upon reset and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions.
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Section 19 Motor Control PWM Timer
19.2.5
Bit
PWM Cycle Registers 1 and 2 (PWCYR1, PWCYR2)
15 — 1 — 14 — 1 — 13 — 1 — 12 — 1 — 11 — 1 — 10 — 1 1 1 1 1 1 1 1 1 1 1 — R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 9 8 7 6 5 4 3 2 1 0
Initial value Read/Write
PWCYR is a 16-bit read/write register that sets the PWM conversion cycle. When a PWCYR compare match occurs, PWCNT is cleared and data is transferred from the buffer register (PWBFR) to the duty register (PWDTR). PWCYR1 is used for the channel 1 conversion cycle setting, and PWCYR2 for the channel 2 conversion cycle setting. PWCYR should be written to only while PWCNT is stopped. A value of H'FC00 must not be set. PWCYR is initialized to H'FFFF upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions.
Compare match PWCNT (lower 10 bits) PWCYR (lower 10 bits) 0 1 Compare match N−2 N−1 0 1
N
Figure 19-3 Cycle Register Compare Match
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
19.2.6
Bit
PWM Duty Registers 1A, 1C, 1E, 1G (PWDTR1A, 1C, 1E, 1G)
15 — 1 — 14 — 1 — 13 1 — 12 0 — 11 1 — 10 1 — 9 0 — 8 0 — 7 0 — 6 0 — 5 0 — 4 0 — 3 0 — 2 0 — 1 0 — 0 0 —
— OTS —
— DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0
Initial value Read/Write
There are four PWDTR1x registers (PWDTR1A, 1C, 1E, 1G). PWDTR1A is used for outputs PWM1A and PWM1B, PWDTR1C for outputs PWM1C and PWM1D, PWDTR1E for outputs PWM1E and PWM1F, and PWDTR1G for outputs PWM1G and PWM1H. PWDTR1 cannot be read or written to directly. When a PWCYR1 compare match occurs, data is transferred from buffer register 1 (PWBFR1) to PWDTR1. PWDTR1x is initialized to H'EC00 when the counter start bit (CST) in PWCR1 is cleared to 0, and also upon reset and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Bits 15 to 13—Reserved: These bits cannot be read from or written to.
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Section 19 Motor Control PWM Timer
Bit 12—Output Terminal Select (OTS): Bit 12 selects the pin used for PWM output according to the value in bit 12 in the buffer register that is transferred by a PWCYR1 compare match. Unselected pins output a low level (or a high level when the corresponding bit in PWPR1 is set to 1).
Register PWDTR1A PWDTR1C PWDTR1E PWDTR1G Bit 12: OTS 0 1 0 1 0 1 0 1 Description PWM1A output selected PWM1B output selected PWM1C output selected PWM1D output selected PWM1E output selected PWM1F output selected PWM1G output selected PWM1H output selected (Initial value) (Initial value) (Initial value) (Initial value)
Bits 11 and 10—Reserved: These bits cannot be read from or written to. Bits 9 to 0—Duty (DT): Bits 9 to 0 set the PWM output duty according to the values in bits 9 to 0 in the buffer register that is transferred by a PWCYR1 compare match. A high level (or a low level when the corresponding bit in PWPR1 is set to 1) is output from the time PWCNT1 is cleared by a PWCYR1 compare match until a PWDTR1 compare match occurs. When all the bits are 0, there is no high-level output period (no low-level output period when the corresponding bit in PWPR1 is set to 1).
Compare match PWCNT1 (lower 10 bits) PWCYR1 (lower 10 bits) PWDTR1 (lower 10 bits) PWM output on selected pin PWM output on unselected pin 0 1 M−2 M−1 M N−1 0
N
M
Figure 19-4 Duty Register Compare Match (OPS = 0 in PWPR1)
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PWCNT1 (lower 10 bits) PWCYR1 (lower 10 bits) PWDTR1 (lower 10 bits) PWM output (M = 0) PWM output (0 < M < N) PWM output (N ≤ M)
0
1
N−2
N−1
0
N
M
Figure 19-5 Differences in PWM Output According to Duty Register Set Value (OPS = 0 in PWPR1) 19.2.7
Bit Initial value Read/Write
PWM Buffer Registers 1A, 1C, 1E, 1G (PWBFR1A, 1C, 1E, 1G)
15 — 1 — 14 — 1 — 13 1 12 0 11 1 10 1 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0
— OTS — — R/W —
— DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0 — R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
There are four 16-bit read/write PWBFR1 registers (PWBFR1A, 1C, 1E, 1G). When a PWCYR1 compare match occurs, data is transferred from PWBFR1A to PWDTR1A, from PWBFR1C to PWDTR1C, from PWBFR1E to PWDTR1E, and from PWBFR1G to PWDTR1G. PWBFR1 is initialized to H'EC00 upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions.
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Section 19 Motor Control PWM Timer
Bits 15 to 13—Reserved: They are always read as 1 and cannot be modified. Bit 12—Output Terminal Select (OTS): Bit 12 is the data transferred to bit 12 of PWDTR1. Bits 11 and 10—Reserved: They are always read as 1 and cannot be modified. Bits 9 to 0—Duty (DT): Bits 9 to 0 comprise the data transferred to bits 9 to 0 in PWDTR1. 19.2.8
Bit Initial value Read/Write
PWM Duty Registers 2A to 2H (PWDTR2A to PWDTR2H)
15 — 1 — 14 — 1 — 13 — 1 — 12 — 0 — 11 — 1 — 10 1 — 9 0 — 8 0 — 7 0 — 6 0 — 5 0 — 4 0 — 3 0 — 2 0 — 1 0 — 0 0 —
— DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0
There are eight PWDTR2 registers (PWDTR2A to PWDTR2H). PWDTR2A is used for output PWM2A, PWDTR2B for output PWM2B, PWDTR2C for output PWM2C, PWDTR2D for output PWM2D, PWDTR2E for output PWM2E, PWDTR2F for output PWM2F, PWDTR2G for output PWM2G, and PWDTR2H for output PWM2H. PWDTR2 cannot be read or written to directly. When a PWCYR2 compare match occurs, data is transferred from buffer register 2 (PWBFR2) to PWDTR2. PWDTR2 is initialized to H'EC00 when the counter start bit (CST) in PWCR2 is cleared to 0, and also upon reset and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Bits 15 to 10—Reserved: These bits cannot be read from or written to.
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Bits 9 to 0—Duty (DT): Bits 9 to 0 set the PWM output duty according to the values in bits 9 to 0 in the buffer register that is transferred by a PWCYR2 compare match. A high level (or a low level when the corresponding bit in PWPR2 is set to 1) is output from the time PWCNT2 is cleared by a PWCYR2 compare match until a PWDTR2 compare match occurs. When all the bits are 0, there is no high-level output period (no low-level output period when the corresponding bit in PWPR2 is set to 1).
Compare match PWCNT2 (lower 10 bits) PWCYR2 (lower 10 bits) PWDTR2 (lower 10 bits) PWM output 0 1 M−2 M−1 M N−1 0
N
M
Figure 19-6 Duty Register Compare Match (OPS = 0 in PWPR2)
PWCNT2 (lower 10 bits) PWCYR2 (lower 10 bits) PWDTR2 (lower 10 bits) PWM output (M = 0) PWM output (0 < M < N) PWM output (N ≤ M)
0
1
N−2
N−1
0
N
M
Figure 19-7 Differences in PWM Output According to Duty Register Set Value (OPS = 0 in PWPR2)
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Section 19 Motor Control PWM Timer
19.2.9
Bit
PWM Buffer Registers 2A to 2D (PWBFR2A to PWBFR2D)
15 — 1 — 14 — 1 — 13 1 12 0 11 1 10 1 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0
— TDS — — R/W —
— DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0 — R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Initial value Read/Write
There are four 16-bit read/write PWBFR2 registers (PWBFR2A to PWBFR2D). When a PWCYR2 compare match occurs, data is transferred from PWBFR2A to PWDTR2A or PWDTR2E, from PWBFR2B to PWDTR2B or PWDTR2F, from PWBFR2C to PWDTR2C or PWDTR2G, and from PWBFR2D to PWDTR2D or PWDTR2H. The transfer destination is determined by the value of the TDS bit. PWBFR2 is initialized to H'EC00 upon reset, and in standby mode, watch mode*, subactive mode*, subsleep mode*, and module stop mode. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Bits 15 to 13—Reserved: They are always read as 1 and cannot be modified. Bit 12—Transfer Destination Select (TDS): Bit 12 selects the PWDTR2 register to which data is to be transferred.
Register PWBFR2A PWBFR2B PWBFR2C PWBFR2D Bit 12: TDS 0 1 0 1 0 1 0 1 Description PWDTR2A selected PWDTR2E selected PWDTR2B selected PWDTR2F selected PWDTR2C selected PWDTR2G selected PWDTR2D selected PWDTR2H selected (Initial value) (Initial value) (Initial value) (Initial value)
Bits 11 and 10—Reserved: They are always read as 1 and cannot be modified. Bits 9 to 0—Duty (DT): Bits 9 to 0 comprise the data transferred to bits 9 to 0 in PWDTR2.
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19.2.10 Module Stop Control Register D (MSTPCRD)
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 4 3 2 1 0
MSTPD7 MSTPD6 MSTPD5 MSTPD4 MSTPD3 MSTPD2 MSTPD1 MSTPD0 undefined undefined undefined undefined undefined undefined — — — — — —
MSTPCRD is an 8-bit read/write register that performs module stop mode control. When the MSTPD7 bit is set to 1, PWM timer operation is stopped at the end of the bus cycle, and module stop mode is entered. For details, see section 23A.5, 23B.5, Module Stop Mode. MSTPCRD is initialized by a reset and in hardware standby mode. It is not initialized by a manual reset or in software standby mode. Bit 7—Module Stop (MSTPD7): Bit 7 specifies the PWM module stop mode.
Bit 7: MSTPD7 0 1 Description PWM module stop mode is cleared PWM module stop mode is set (Initial value)
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Section 19 Motor Control PWM Timer
19.3
19.3.1
Bus Master Interface
16-Bit Data Registers
PWCYR1/2, PWBFR1A/C/E/G, and PWBFR2A/B/C/D are 16-bit registers. These registers are linked to the bus master by a 16-bit data bus, and can be read or written in 16-bit units. They cannot be read by 8-bit access; 16-bit access must always be used.
Internal data bus H Bus master L Bus interface Module data bus
PWCYR1
Figure 19-8 16-Bit Register Access Operation (Bus Master ↔ PWCYR1 (16 Bits)) 19.3.2 8-Bit Data Registers
PWCR1/2, PWOCR1/2, and PWPR1/2 are 8-bit registers that can be read and written to in 8-bit units. These registers are linked to the bus master by a 16-bit data bus, and can be read or written by 16-bit access; in this case, the lower 8 bits will always be read as H'FF.
Internal data bus H Bus master L Bus interface Module data bus
PWCR1
Figure 19-9 8-Bit Register Access Operation (Bus Master ↔ PWCR1 (Upper 8 Bits))
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19.4
19.4.1
Operation
PWM Channel 1 Operation
PWM waveforms are output from pins PWM1A to PWM1H as shown in figure 19-10. Initial Settings: Set the PWM output polarity in PWPR1; enable the pins for PWM output with PWOCR1; select the clock to be input to PWCNT1 with bits CKS2 to CKS0 in PWCR1; set the PWM conversion cycle in PWCYR1; and set the first frame of data in PWBFR1A, PWBFR1C, PWBFR1E, and PWBFR1G. Activation: When the CST bit in PWCR1 is set to 1, a compare match between PWCNT1 and PWCYR1 is generated. Data is transferred from PWBFR1A to PWDTR1A, from PWBFR1C to PWDTR1C, from PWBFR1E to PWDTR1E, and from PWBFR1G to PWDTR1G. PWCNT1 starts counting up. At the same time the CMF bit in PWCR1 is set, so that, if the IE bit in PWCR1 has been set, an interrupt can be requested or the DTC can be activated. Waveform Output: The PWM outputs selected by the OTS bits in PWDTR1A/C/E/G go high when a compare match occurs between PWCNT1 and PWCYR1. The PWM outputs not selected by the OTS bits are low. When a compare match occurs between PWCNT1 and PWDTR1A/C/E/G, the corresponding PWM output goes low. If the corresponding bit in PWPR1 is set to 1, the output is inverted.
PWCYR1
PWBFR1A PWDTR1A
OTS (PWDTR1A) = 0 OTS (PWDTR1A) = 1 OTS (PWDTR1A) = 0 OTS (PWDTR1A) = 1
PWM1A PWM1B
Figure 19-10 PWM Channel 1 Operation
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Section 19 Motor Control PWM Timer
Next Frame: When a compare match occurs between PWCNT1 and PWCYR1, data is transferred from PWBFR1A to PWDTR1A, from PWBFR1C to PWDTR1C, from PWBFR1E to PWDTR1E, and from PWBFR1G to PWDTR1G. PWCNT1 is reset and starts counting up from H'000. The CMF bit in PWCR1 is set, and if the IE bit in PWCR1 has been set, an interrupt can be requested or the DTC can be activated. Stopping: When the CST bit in PWCR1 is cleared to 0, PWCNT1 is reset and stops. All PWM outputs go low (or high if the corresponding bit in PWPR1 is set to 1). 19.4.2 PWM Channel 2 Operation
PWM waveforms are output from pins PWM2A to PWM2H as shown in figure 19-11. Initial Settings: Set the PWM output polarity in PWPR2; enable the pins for PWM output with PWOCR2; select the clock to be input to PWCNT2 with bits CKS2 to CKS0 in PWCR2; set the PWM conversion cycle in PWCYR2; and set the first frame of data in PWBFR2A, PWBFR2B, PWBFR2C, and PWBFR2D. Activation: When the CST bit in PWCR2 is set to 1, a compare match between PWCNT2 and PWCYR2 is generated. Data is transferred from PWBFR2A to PWDTR2A or PWDTR2E, from PWBFR2B to PWDTR2B or PWDTR2F, from PWBFR2C to PWDTR2C or PWDTR2G, and from PWBFR2D to PWDTR2D or PWDTR2H, according to the value of the TDS bit. PWCNT2 starts counting up. At the same time the CMF bit in PWCR2 is set, so that, if the IE bit in PWCR2 has been set, an interrupt can be requested or the DTC can be activated. Waveform Output: The PWM outputs go high when a compare match occurs between PWCNT2 and PWCYR2. When a compare match occurs between PWCNT2 and PWDTR2A to PWDTR2H, the corresponding PWM output goes low. If the corresponding bit in PWPR2 is set to 1, the output is inverted.
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Section 19 Motor Control PWM Timer
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PWCYR2
PWBFR2A PWDTR2A PWDTR2E
TDS (PWBFR2A) = 0 TDS (PWBFR2A) = 1 TDS (PWBFR2A) = 0
PWM2A PWM2B
Figure 19-11 PWM Channel 2 Operation Next Frame: When a compare match occurs between PWCNT2 and PWCYR2, data is transferred from PWBFR2A to PWDTR2A or PWDTR2E, from PWBFR2B to PWDTR2B or PWDTR2F, from PWBFR2C to PWDTR2C or PWDTR2G, and from PWBFR2D to PWDTR2D or PWDTR2H, according to the value of the TDS bit. PWCNT2 is reset and starts counting up from H'000. The CMF bit in PWCR2 is set, and if the IE bit in PWCR2 has been set, an interrupt can be requested or the DTC can be activated. Stopping: When the CST bit in PWCR2 is cleared to 0, PWCNT2 is reset and stops. PWDTR2A to PWDTR2H are reset. All PWM outputs go low (or high if the corresponding bit in PWPR2 is set to 1).
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Section 19 Motor Control PWM Timer
19.5
Usage Note
Contention between Buffer Register Write and Compare Match If a PWBFR write is performed in the state immediately after a cycle register compare match, the PWM output does not change, but as the duty register is also rewritten at the same time as the buffer register, normal PWM output will not be achieved. If a PWBFR write is performed in the state immediately after a cycle register compare match, the buffer register and duty register are overwritten. PWM output changed by the cycle register compare match is not changed in the overwrite of the duty register due to contention. This may result in unanticipated duty output. In the case of channel 2, the duty register used as the transfer destination is selected by the TDS bit of the buffer register when an overwrite of the duty register occurs due to contention. This can also result in an unintended overwrite of the duty register. Buffer register rewriting must be completed before automatic transfer by the DTC* (data transfer controller), exception handling due to a compare match interrupt, or the occurrence of a cycle register compare match on detection of the rise of CMF (compare match flag) in PWCR. Note: * The DTC is not implemented in the H8S/2635 and H8S/2634.
T1
φ Address Buffer register address
TW
TW
T2
Write signal PWCNT (lower 10 bits) PWBFR PWDTR PWM output CMF
Compare match 0 N M
N
M
Figure 19-12 PWM Channel 1 Operation
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Section 20 RAM
Section 20 RAM
Note: The H8S/2635 Group is not equipped with a DTC.
20.1
Overview
The H8S/2636 has 4 kbytes, and H8S/2638, H8S/2639, and H8S/2630 have 16 kbytes of on-chip high-speed static RAM. The H8S/2635 has 6 kbytes of on-chip RAM. The RAM is connected to the CPU by a 16-bit data bus, enabling one-state access by the CPU to both byte data and word data. This makes it possible to perform fast word data transfer. The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the system control register (SYSCR). 20.1.1 Block Diagram
Figure 20-1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFE000 H'FFE002 H'FFE004
H'FFE001 H'FFE003 H'FFE005
H'FFEFBE H'FFFFC0
H'FFEFBF H'FFFFC1
H'FFFFFE
H'FFFFFF
Figure 20-1 (a) Block Diagram of RAM (H8S/2636)
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Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFB000 H'FFB002 H'FFB004
H'FFB001 H'FFB003 H'FFB005
H'FFEFBE H'FFFFC0
H'FFEFBF H'FFFFC1
H'FFFFFE
H'FFFFFF
Figure 20-1 (b) Block Diagram of RAM (H8S/2638, H8S/2639, and H8S/2630)
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Section 20 RAM
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FFD800 H'FFD802 H'FFD804
H'FFD801 H'FFD803 H'FFD805
H'FFEFBE H'FFFFC0
H'FFEFBF H'FFFFC1
H'FFFFFE
H'FFFFFF
Figure 20-1 (c) Block Diagram of RAM (H8S/2635 Group) 20.1.2 Register Configuration
The on-chip RAM is controlled by SYSCR. Table 20-1 shows the address and initial value of SYSCR. Table 20-1 RAM Register
Name System control register Abbreviation SYSCR R/W R/W Initial Value H'01 Address* H'FDE5
Note: * Lower 16 bits of the address.
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Section 20 RAM
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20.2
20.2.1
Bit
Register Descriptions
System Control Register (SYSCR)
: 7 MACS 0 R/W 6 ⎯ 0 ⎯ 5 INTM1 0 R/W 4 INTM0 0 R/W 3 NMIEG 0 R/W 2 ⎯ 0 R/W 1 ⎯ 0 ⎯ 0 RAME 1 R/W
Initial value : R/W :
The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in SYSCR, see section 3.2.2, System Control Register (SYSCR). Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized when the reset state is released. It is not initialized in software standby mode.
Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value)
20.3
Operation
When the RAME bit is set to 1, accesses to addresses H'FFE000 to H'FFEFBF (for the H8S/2636), H'FFB000 to H'FFEFBF (for the H8S/2638, H8S/2639, and H8S/2630), H'FFD800 to H'FFEFBF (for the H8S/2635 Group), or H'FFFFC0 to H'FFFFFF in the chip are directed to the on-chip RAM. When the RAME bit is cleared to 0, the off-chip address space is accessed. Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written to and read in byte or word units. Each type of access can be performed in one state. Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start at an even address.
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Section 20 RAM
20.4
Usage Notes
When Using the DTC: DTC register information can be located in addresses H'FFEBC0 to H'FFEFBF. When the DTC is used, the RAME bit must not be cleared to 0. Reserved Areas: Addresses H'FFB000 to H'FFDFFF in the H8S/2636 and H'FFB000 to H'FFD7FF in the H8S/2635 Group are reserved areas that cannot be read or written to. When the RAME bit is cleared to 0, the off-chip address space is accessed.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
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Section 21A ROM (H8S/2636 Group)
Section 21A ROM (H8S/2636 Group)
21A.1 Overview
The H8S/2636 has 128 kbytes of on-chip flash memory, or 128 kbytes of on-chip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and processing speed increased. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0). The flash memory version can be erased and programmed on-board, as well as with a specialpurpose PROM programmer. 21A.1.1 Block Diagram Figure 21A-1 shows a block diagram of 128-kbyte ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000 H'000002
H'000001 H'000003
H'01FFFE
H'01FFFF
Figure 21A-1 Block Diagram of ROM (128 kbytes) 21A.1.2 Register Configuration The H8S/2636 operating mode is controlled by the mode pins and the MDCR register. The register configuration is shown in table 21A-1.
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Section 21A ROM (H8S/2636 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 21A-1 Register Configuration
Register Name Mode control register Abbreviation MDCR R/W R/W Initial Value Undefined Address* H'FDE7
Note: * Lower 16 bits of the address.
21A.2 Register Descriptions
21A.2.1 Mode Control Register (MDCR)
Bit: Initial value: R/W: 7 — 1 R/W 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 MDS2 —* R 1 MDS1 —* R 0 MDS0 —* R
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit register used to monitor the current H8S/2636 Group operating mode. Bit 7—Reserved: Only 1 should be written to these bits. Bits 6 to 3—Reserved: These bits are always read as 0 and cannot be modified. Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. MDS2 to MDS0 are read-only bits, and cannot be modified. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are canceled by a reset.
21A.3 Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can be accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address. The on-chip ROM is enabled and disabled by setting the mode pins (MD2, MD1, and MD0). These settings are shown in table 21A-2.
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Section 21A ROM (H8S/2636 Group)
Table 21A-2 Operating Modes and ROM (F-ZTAT Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Mode 8 Mode 9 Mode 10 Mode 11 Mode 12 Mode 13 Mode 14 User program mode (advanced expanded mode with on-chip ROM 1 enabled)* User program mode (advanced single2 chip mode)* 1 Boot mode (advanced expanded mode 1 with on-chip ROM enabled)* Boot mode (advanced single-chip 2 mode)* — 1 0 1 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode — 1 0 0 1 1 0 1 — FWE 0 MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Enabled (128 kbytes) Enabled (128 kbytes) Enabled (128 kbytes) Enabled (128 kbytes) — Enabled (128 kbytes) Enabled (128 kbytes) — Disabled On-Chip ROM —
Mode 15
1
Notes: 1. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced expanded mode with on-chip ROM enabled. 2. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced single-chip mode.
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Section 21A ROM (H8S/2636 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 21A-3 Operating Modes and ROM (Mask ROM Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 0 1 — MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 1 Enabled (128 kbytes) Enabled (128 kbytes) Disabled On-Chip ROM —
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Section 21A ROM (H8S/2636 Group)
21A.4 Flash Memory Overview
21A.4.1 Features The H8S/2636 has 128 kbytes of on-chip flash memory, or 128 kbytes of on-chip mask ROM. The features of the flash memory are summarized below. • Four flash memory operating modes ⎯ Program mode ⎯ Erase mode ⎯ Program-verify mode ⎯ Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Block erase (in single-block units) can be performed. To erase the entire flash memory, each block must be erased in turn. Blocks of 1 kbyte, 8 kbytes, 16 kbytes, 28 kbytes, and 32 kbytes can be erased as required. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.). • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: ⎯ Boot mode ⎯ User program mode • Automatic bit rate adjustment With data transfer in boot mode, the LSI’s bit rate can be automatically adjusted to match the transfer bit rate of the host. • Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. • Protect modes There are two protect modes, hardware and software, which allow protected status to be designated for flash memory program/erase/verify operations.
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• Programmer mode Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board programming mode. 21A.4.2 Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 FLMCR2 EBR1 EBR2 RAMER FLPWCR Bus interface/controller Operating mode FWE pin Mode pin
Flash memory (128 kbytes)
Legend: FLMCR1: FLMCR2: EBR1: EBR2: RAMER: FLPWCR:
Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Flash memory power control register
Figure 21A-2 Block Diagram of Flash Memory
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Section 21A ROM (H8S/2636 Group)
21A.4.3 Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the microcomputer enters an operating mode as shown in figure 21A-3. In user mode, flash memory can be read but not programmed or erased. The boot, user program and programmer modes are provided as modes to write and erase the flash memory.
MD1 = 1, MD2 = 1, FWE = 0 *1 User mode (on-chip ROM enabled) RES = 0 RES = 0 MD1 = 1, MD2 = 1, FWE = 1 RES = 0 MD2 = 0, MD1 = 1, FWE = 1 RES = 0 Programmer mode *2
Reset state
FWE = 1
FWE = 0
User program mode
*1
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. RAM emulation possible 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
Figure 21A-3 Flash Memory State Transitions
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21A.4.4 On-Board Programming Modes Boot Mode
1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host
Host Programming control program New application program
New application program
Chip
Boot program Flash memory RAM SCI
Chip
Boot program Flash memory RAM Boot program area SCI
Application program (old version)
Application program (old version)
Programming control program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks.
Host
4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory.
Host
New application program
Chip
Boot program Flash memory RAM Boot program area Flash memory preprogramming erase
Programming control program
Chip
SCI Boot program Flash memory RAM Boot program area New application program
Programming control program
SCI
Program execution state
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Section 21A ROM (H8S/2636 Group)
User Program Mode
1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program New application program
2. Programming/erase control program transfer When user program mode is entered, user software confirms this fact, executes transfer program in the flash memory, and transfers the programming/erase control program to RAM.
Host
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program
SCI RAM
Transfer program
Transfer program
Programming/ erase control program
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program Transfer program Programming/ erase control program Programming/ erase control program
SCI RAM
Transfer program
Flash memory erase
New application program
Program execution state
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21A.4.5 Flash Memory Emulation in RAM Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read.
SCI
Flash memory Emulation block
RAM Overlap RAM (emulation is performed on data written in RAM)
Application program Execution state
Figure 21A-4 Reading Overlap RAM Data in User Mode or User Program Mode When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
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Section 21A ROM (H8S/2636 Group)
SCI
Flash memory Programming data
RAM Overlap RAM (programming data) Programming control program execution state
Application program
Figure 21A-5 Writing Overlap RAM Data in User Program Mode 21A.4.6 Differences between Boot Mode and User Program Mode Table 21A-4 Differences between Boot Mode and User Program Mode
Boot Mode Total erase Block erase Programming control program* Yes No (2) User Program Mode Yes Yes (1) (2) (3)
(1) Erase/erase-verify (2) Program/program-verify (3) Emulation Note: * To be provided by the user, in accordance with the recommended algorithm.
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21A.4.7 Block Configuration The flash memory is divided into two 32 kbytes blocks, one 28 kbytes block, one 16 kbytes block, two 8 kbytes blocks, and four 1 kbyte blocks.
Address H'00000
1 kbyte × 4
28 kbytes
16 kbytes 8 kbytes 128 kbytes 8 kbytes
32 kbytes
32 kbytes
Address H'1FFFF
Figure 21A-6 Block Configuration
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Section 21A ROM (H8S/2636 Group)
21A.5 Pin Configuration
The flash memory is controlled by means of the pins shown in table 21A-5. Table 21A-5 Pin Configuration
Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Port F0 Port 16 Port 14 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 PF0 P16 P14 TxD1 RxD1 I/O Input Input Input Input Input Input Input Input Output Input Function Reset Flash program/erase protection by hardware Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Serial transmit data output Serial receive data input
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21A.6 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 21A-6. Table 21A-6 Register Configuration
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Abbreviation FLMCR1 * 4 FLMCR2 * EBR1 EBR2 *4 *4
4
R/W R/W R R/W R/W R/W R/W
Initial Value H'00* H'00 H'00 H'00 H'00
3 H'00* 2
Address* H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB H'FFAC
1
*3 *3
4 RAMER*
4 Flash memory power control register FLPWCR*
Notes: 1. Lower 16 bits of the address. 2. When a high level is input to the FWE pin, the initial value is H'80. 3. When a low level is input to the FWE pin, or if a high level is input and the SWE1 bit in FLMCR1 is not set, these registers are initialized to H'00. 4. FLMCR1, FLMCR2, EBR1, and EBR2, RAMER, and FLPWCR are 8-bit registers. Use byte access on these registers.
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Section 21A ROM (H8S/2636 Group)
21A.7 Register Descriptions
21A.7.1 Flash Memory Control Register 1 (FLMCR1) FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PV or EV bit. Program mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for onchip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are enabled only in the following cases: Writes to bit SWE of FLMCR1 enabled when FWE = 1, to bits ESU, PSU, EV, and PV when FWE = 1 and SWE = 1, to bit E when FWE = 1, SWE = 1 and ESU = 1, and to bit P when FWE = 1, SWE = 1, and PSU = 1.
Bit: Initial value: R/W: 7 FWE —* R 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Note: * Determined by the state of the FWE pin.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing.
Bit 7: FWE 0 1 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin
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Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming and erasing. Set this bit when setting bits 5 to 0, bits 7 to 0 of EBR1, and bits 1 and 0 of EBR2.
Bit 6: SWE 0 1 Description Writes disabled Writes enabled [Setting condition] • When FWE = 1 (Initial value)
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit in FLMCR1 to 1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 5: ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit in FLMCR1 to 1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 4: PSU 0 1 Description Program setup cleared Program setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3: EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
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Section 21A ROM (H8S/2636 Group)
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2: PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1: E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] • When FWE = 1, SWE = 1, and ESU = 1 (Initial value)
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
Bit 0: P 0 1 Description Program mode cleared Transition to program mode [Setting condition] • When FWE = 1, SWE = 1, and PSU = 1 (Initial value)
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21A.7.2 Flash Memory Control Register 2 (FLMCR2) FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00.
Bit: Initial value: R/W: 7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
Note: FLMCR2 is a read-only register, and should not be written to.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7: FLER 0 Description Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] • 1 Reset or hardware standby mode An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] • See section 21A.10.3, Error Protection
Bits 6 to 0—Reserved: These bits always read 0.
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Section 21A ROM (H8S/2636 Group)
21A.7.3 Erase Block Register 1 (EBR1) EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 21A-6.
Bit: Initial value: R/W: 7 EB7 0 R/W 6 EB6 0 R/W 5 EB5 0 R/W 4 EB4 0 R/W 3 EB3 0 R/W 2 EB2 0 R/W 1 EB1 0 R/W 0 EB0 0 R/W
21A.7.4 Erase Block Register 2 (EBR2) EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin. Bit 0 will be initialized to 0 if bit SWE of FLMCR1 is not set, even though a high level is input to pin FWE. When a bit in EBR2 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. Bits 7 to 2 are reserved and must only be written with 0. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory block configuration is shown in table 21A-7.
Bit: Initial value: R/W: 7 — 0 R/W 6 — 0 R/W 5 — 0 R/W 4 — 0 R/W 3 — 0 R/W 2 — 0 R/W 1 EB9 0 R/W 0 EB8 0 R/W
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Table 21A-7 Flash Memory Erase Blocks (H8S/2636)
Block (Size) EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) Addresses H'000000 to H'0003FF H'000400 to H'0007FF H'000800 to H'000BFF H'000C00 to H'000FFF H'001000 to H'007FFF H'008000 to H'00BFFF H'00C000 to H'00DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF
21A.7.5 RAM Emulation Register (RAMER) RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER initialized to H'00 by a reset and in hardware standby mode. It is not initialized by software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 21A-8. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed.
Bit: Initial value: R/W: 7 — 0 R 6 — 0 R 5 — 0 R/W 4 — 0 R/W 3 RAMS 0 R/W 2 RAM2 0 R/W 1 RAM1 0 R/W 0 RAM0 0 R/W
Bits 7 and 6—Reserved: These bits always read 0. Bits 5 and 4—Reserved: Only 0 may be written to these bits.
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Section 21A ROM (H8S/2636 Group)
Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory block are program/erase-protected.
Bit 3: RAMS 0 1 Description Emulation not selected Program/erase-protection of all flash memory blocks is disabled Emulation selected Program/erase-protection of all flash memory blocks is enabled (Initial value)
Bits 2, 1 and 0—Flash Memory Area Selection: These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM (See table 21A-7). Table 21A-8 Flash Memory Area Divisions (H8S/2636)
Addresses H'FFE000 to H'FFE3FF H'000000 to H'0003FF H'000400 to H'0007FF H'000800 to H'000BFF H'000C00 to H'000FFF *: Don't care Block Name RAM area 1 kbyte EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) RAMS 0 1 1 1 1 RAM2 * 0 0 1 1 RAM1 * 0 1 0 1 RAM0 * * * * *
21A.7.6 Flash Memory Power Control Register (FLPWCR)
Bit: Initial value: R/W: 7 PDWND 0 R/W 6 — 0 R 5 — 0 R 4 — 0 R 3 — 0 R 2 — 0 R 1 — 0 R 0 — 0 R
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode*. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask version only. These functions cannot be used with the other versions.
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Bit 7—Power-Down Disable (PDWND): Enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode. For details, see section 21A.14, Flash Memory and Power-Down States. The subactive mode can be used in the U-mask version only. When writing to this bit in other versions, be sure to write 0.
Bit 7: PDWND 0 1 Description Transition to flash memory power-down mode enabled Transition to flash memory power-down mode disabled (Initial value)
Bits 6 to 0—Reserved: These bits always read 0.
21A.8 On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is made to the on-board programming state in which program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 21A-9. For a diagram of the transitions to the various flash memory modes, see figure 21A-3. Table 21A-9 Setting On-Board Programming Modes
Mode Boot mode User program mode Expanded mode Single-chip mode Expanded mode Single-chip mode 1 FWE 1 MD2 0 0 1 1 MD1 1 1 1 1 MD0 0 1 0 1
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Section 21A ROM (H8S/2636 Group)
21A.8.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The SCI channel to be used is set to asynchronous mode. When a reset-start is executed after the LSI’s pins have been set to boot mode, the boot program built into the LSI is started and the programming control program prepared in the host is serially transmitted to the LSI via the SCI. In the LSI, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 21A-7, and the boot mode execution procedure in figure 21A-8.
LSI
Flash memory
Host
Write data reception Verify data transmission
RxD1 SCI1 TxD1 On-chip RAM
Figure 21A-7 System Configuration in Boot Mode
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Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, LSI transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM No Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM
n+1→n
n = N?
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted.
Figure 21A-8 Boot Mode Execution Procedure
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Section 21A ROM (H8S/2636 Group)
Automatic SCI Bit Rate Adjustment
Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
When boot mode is initiated, the LSI measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The LSI calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the LSI. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the LSI’s system clock frequency, there will be a discrepancy between the bit rates of the host and the LSI. Set the host transfer bit rate at 4,800, 9,600 or 19,200 bps to operate the SCI properly. Table 21A-10 shows host transfer bit rates and system clock frequencies for which automatic adjustment of the LSI bit rate is possible. The boot program should be executed within this system clock range. Table 21A-10 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is Possible
Host Bit Rate 4,800 bps 9,600 bps 19,200 bps System Clock Frequency for which Automatic Adjustment of LSI Bit Rate Is Possible 4 to 20 MHz 8 to 20 HHz 16 to 20 MHz
Note: The system clock frequency used in boot mode is generated by an external crystal oscillator element. PLL frequency multiplication is not used.
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Section 21A ROM (H8S/2636 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the programming control program is transferred via the SCI, as shown in figure 21A-9. The boot program area cannot be used until the execution state in boot mode switches to the programming control program transferred from the host.
H'FFE000 Boot program area (2 kbytes) H'FFE7FF H'FFE800 Programming control program area (1.9 kbytes) H'FFEFBF Note: The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note also that the boot program remains in this area of the on-chip RAM even after control branches to the programming control program.
Figure 21A-9 RAM Areas in Boot Mode Notes on Use of Boot Mode: • When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. • In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. • Interrupts cannot be used while the flash memory is being programmed or erased. • The RxD1 and TxD1 pins should be pulled up on the board.
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Section 21A ROM (H8S/2636 Group)
• Before branching to the programming control program (RAM area H'FFE800), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P33DDR = 1, P33DR = 1). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. The initial values of other on-chip registers are not changed. • Boot mode can be entered by making the pin settings shown in table 21A-9 and executing a reset-start. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the FWE pin and mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low*3 while the boot program is being executed or while flash memory is being programmed or erased. • If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer’s operating mode*2. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: 1. Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS = 4 states) with respect to the reset release timing. 2. See appendix D, Pin States. 3. For precautions on applying and disconnecting FWE, see section 21A.15, Flash Memory Programming and Erasing Precautions. 21A.8.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Figure 21A-10 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
Write the FWE assessment program and transfer program (and the program/erase control program if necessary) beforehand MD2, MD1, MD0 = 110, 111 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area FWE = high* Execute program/erase control program (flash memory rewriting) Clear FWE Branch to flash memory application program Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin only when the flash memory is programmed or erased. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. * For precautions on applying and disconnecting FWE, see section 21A.15, Flash Memory Programming and Erasing Precautions.
Figure 21A-10 User Program Mode Execution Procedure
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Section 21A ROM (H8S/2636 Group)
21A.9
Flash Memory Programming/Erasing
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes for on-chip flash memory are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Also ensure that the DTC is not activated before or after execution of the flash memory write instruction. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 24.1.7, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming must be executed in the erased state. Do not perform additional programming on addresses that have already been programmed.
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*3 E=1 Erase setup state E=0 Normal mode ESU = 1 ESU = 0 Erase-verify mode Erase mode
*1
FWE = 1
FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0
On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state
*4 P=1 Program setup state P=0 Program mode
PV = 1 PV = 0
Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state.
Figure 21A-11 FLMCR1 Bit Settings and State Transitions
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21A.9.1
Program Mode
When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 21A-12 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 24-10 in section 24.1.7, Flash Memory Characteristics. Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) µs. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see “Notes on Program/Program-Verify Procedure.”
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.9.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 21A-12) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE. Notes on Program/Program-Verify Procedure 1. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the chip, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the chip, the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N).
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b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 24.1.7, Flash Memory Characteristics.
Item Wait time after P bit setting Symbol tsp Item When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing* Symbol tsp30 tsp200 tsp10
Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6.
6. The program/program-verify flowchart for the H8S/2636 is shown in figure 21A-12. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reprogram Data Computation Table
Result of Verify-Read after Write Pulse Application (V) 0 1 0 1 (X) Result of Operation 1 0 1 1
(D) 0 0 1 1
Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed ⎯ Still in erased state: no action
Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed
Additional-Programming Data Computation Table
Result of Verify-Read after Write Pulse (X') Application (V) 0 0 (Y) Result of Operation 0
Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action
0
1
1
1 1
0 1
1 1
Legend: (Y): Data of bits on which additional programming is executed (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop
7. It is necessary to execute additional programming processing during the course of the chip program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished.
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Section 21A ROM (H8S/2636 Group)
Write pulse application subroutine
Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) μs
Store 128-byte program data in program data area and reprogram data area
Sub-Routine Write Pulse WDT enable Set PSU bit in FLMCR1 Wait (tspsu) μs Set P bit in FLMCR1 Wait (tsp) μs Clear P bit in FLMCR1 Wait (tcp) μs Clear PSU bit in FLMCR1 Wait (tcpsu) μs
Disable WDT
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
*7 *4
*7
Start of programming
n=1 m=0
*5*7
End of programming
Write 128-byte data in RAM reprogram data area consecutively to flash memory
*1
Sub-Routine-Call
*7
Write pulse
See Note 6 for pulse width
Set PV bit in FLMCR1 Wait (tspv) μs
H'FF dummy write to verify address
*7
*7
Wait (tspvr) μs End Sub
Increment address Note: 6 Write Pulse Width Number of Writes n Write Time (tsp) μsec Write data = verify data? Read verify data
*7 *2
No m=1 No
n←n+1
1 2 3 4 5 6 7 8 9 10 11 12 13
30 30 30 30 30 30 200 200 200 200 200 200 200
Yes 6≥n?
Yes Additional-programming data computation Transfer additional-programming data to additional-programming data area
Reprogram data computation
*4 *3 *4
Transfer reprogram data to reprogram data area 128-byte data verification completed?
No 998 999 1000 200 200 200
Yes Clear PV bit in FLMCR1 Reprogram Wait (tcpv) μs 6 ≥ n? No
Note: Use a 10 μs write pulse for additional programming.
*7
RAM
Program data storage area (128 bytes)
Yes Successively write 128-byte data from additional1 programming data area in RAM to flash memory * Sub-Routine-Call Write Pulse (Additional programming)
Reprogram data storage area (128 bytes)
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Additional-programming data storage area (128 bytes)
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
Notes: 1. 2. 3.
4. 5. 7.
Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Verify data is read in 16-bit (word) units. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. A write pulse of 30 μs or 200 μs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 μs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. The wait times and value of N are shown in section 24.1.7, Flash Memory Characteristics.
Reprogram Data Computation Table
Original Data Verify Data Reprogram Data
Additional-Programming Data Computation Table (X) 1 0 1 1
Still in erased state; no action Comments Programming completed Programming incomplete; reprogram
(D) 0 0 1 1
(V) 0 1 0 1
Reprogram Data (X') 0 0 1 1
Verify Data Additional(V) Programming Data (Y) 0 1 0 1 0 1 1 1
Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed
Figure 21A-12 Program/Program-Verify Flowchart
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.9.3
Erase Mode
When erasing flash memory, the single-block erase flowchart shown in figure 21A-13 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.1.7, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register 1 and 2 (EBR1, EBR2) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure.
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Section 21A ROM (H8S/2636 Group)
21A.9.4
Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) µs. If erasing multiple blocks, set a single bit in EBR1/EBR2 for the next block to be erased, and repeat the erase/erase-verify sequence as before.
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Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs NG
*4 *5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs End of erasing
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
Notes: 1. 2. 3. 4. 5.
Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block registers (EBR1 and EBR2). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 24.1.7, Flash Memory Characteristics.
Figure 21A-13 Erase/Erase-Verify Flowchart
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Section 21A ROM (H8S/2636 Group)
21A.10 Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 21A.10.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), erase block register 1 (EBR1), and erase block register 2 (EBR2). The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained in the error-protected state (See table 21A-11). Table 21A-11 Hardware Protection
Functions Item FWE pin protection Description • Program Erase Yes
Yes When a low level is input to the FWE pin, FLMCR1, FLMCR2, (except bit FLER) EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset (including a WDT reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. Yes
Reset/standby protection
•
Yes
•
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21A.10.2 Software Protection Software protection can be implemented by setting the SWE bit in FLMCR1, erase block register 1 (EBR1), erase block register 2 (EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1), does not cause a transition to program mode or erase mode (See table 21A-12). Table 21A-12 Software Protection
Functions Item SWE bit protection Description • Program Erase Yes
Setting bit SWE1 in FLMCR1 to 0 will place Yes area on-chip flash memory in the program/ erase-protected state (Execute the program in the on-chip RAM, external memory). Erase protection can be set for individual blocks by settings in erase block register 1 (EBR1) and erase block register 2 (EBR2). Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Yes Setting the RAMS bit to 1 in the RAM emulation register (RAMER) places all blocks in the program/erase-protected state. —
Block specification protection
•
Yes
• Emulation protection •
Yes
21A.10.3 Error Protection In error protection, an error is detected when chip runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the chip malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode.
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Section 21A ROM (H8S/2636 Group)
FLER bit setting conditions are as follows: 1. When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) 2. Immediately after exception handling (excluding a reset) during programming/erasing 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the CPU releases the bus to the DTC Error protection is released only by a reset and in hardware standby mode. Figure 21A-14 shows the flash memory state transition diagram.
Program mode Erase mode RD VF PR ER FLER = 0
RES = 0 or HSTBY = 0
Reset or standby (hardware protection) RD VF PR ER FLER = 0
Error occurrence (software standby) Error occurrence
RES = 0 or HSTBY = 0 RES = 0 or HSTBY = 0
FLMCR1, FLMCR2, EBR1, EBR2 initialization state
Error protection mode RD VF PR ER FLER = 1
Software standby mode Software standby mode release
Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2, (except bit FLER) EBR1, EBR2 initialization state
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible
Figure 21A-14 Flash Memory State Transitions
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.11 Flash Memory Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses cannot be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 21A-15 shows an example of emulation of real-time flash memory programming.
Start of emulation program
Set RAMER
Write tuning data to overlap RAM
Execute application program
No
Tuning OK? Yes Clear RAMER
Write to flash memory emulation block
End of emulation program
Figure 21A-15 Flowchart for Flash Memory Emulation in RAM
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Section 21A ROM (H8S/2636 Group)
This area can be accessed from both the RAM area and flash memory area H'000000 EB0 H'000400 EB1 H'000800 EB2 H'000C00 EB3 H'001000
Flash memory EB4 to EB9 H'FFE000 H'FFE3FF On-chip RAM H'FFEFBF H'01FFFF
Figure 21A-16 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB0 is Overlapped 1. Set bits RAMS, RAM2 to RAM0 in RAMER to 1, 0, 0, 0, to overlap part of RAM onto the area (EB0) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB0). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1), will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM.
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Section 21A ROM (H8S/2636 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.12 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI interrupt is disabled when flash memory is being programmed or erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All requests, including NMI interrupt, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly.
•
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Section 21A ROM (H8S/2636 Group)
21A.13 Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a socket adapter, just as for a discrete flash memory. Use a PROM programmer that supports the Renesas Electronics's 128-kbyte flash memory on-chip MCU device type (FZTAT128V5A). 21A.13.1 Socket Adapter and Memory Map In programmer mode in which the PROM writer is used, reading from memory (verification), writing, and initializing the flash memory (erasing all of its contents) are enabled. At this time, a dedicated conversion socket adapter must be used. Table 21A-13 shows the types of the socket adapters. For programmer mode on this LSI, one of the socket adapters listed in table 21A-13 should be used. Table 21A-13
Part No. HD64F2636UF HD64F2636F
Type of Socket Adapter
Package Type 128 pin QFP (FP-128B) Socket Adapter Type ME2636ESHF1H HF2636Q128D4001 Manufacturer Minato Electronics Inc. Data I/O Japan Corporation
The memory map of on-chip ROM is shown in figure 21A-17
Addresses in MCU mode H'000000 Addresses in programmer mode H'00000
On-chip ROM space (128 kbytes)
H'01FFFF
H'1FFFF
Figure 21A-17 On-Chip ROM Memory Map
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.14 Flash Memory and Power-Down States
In addition to its normal operating state, the flash memory has power-down states in which power consumption is reduced by halting part or all of the internal power supply circuitry. There are three flash memory operating states: (1) Normal operating mode: The flash memory can be read and written to. (2) Power-down mode: Part of the power supply circuitry is halted, and the flash memory can be read when the LSI is operating on the subclock*. (3) Standby mode: All flash memory circuits are halted, and the flash memory cannot be read or written to. States (2) and (3) are flash memory power-down states. Table 21A-14 shows the correspondence between the operating states of the LSI and the flash memory. Table 21A-14 Flash Memory Operating States
Flash Memory Operating State Normal mode (read/write)
LSI Operating State High-speed mode Medium-speed mode Sleep mode Subactive mode* Subsleep mode* Watch mode* Software standby mode Hardware standby mode
When PDWND = 0: Power-down mode (read-only) When PDWND = 1: Normal mode (read-only) Standby mode
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask version only. These functions cannot be used with the other versions.
21A.14.1 Notes on Power-Down States 1. When the flash memory is in a power-down state, part or all of the internal power supply circuitry is halted. Therefore, a power supply circuit stabilization period must be provided when returning to normal operation. When the flash memory returns to its normal operating state from a power-down state, bits STS2 to STS0 in SBYCR must be set to provide a wait time of at least 20 µs (power supply stabilization time), even if an oscillation stabilization period is not necessary.
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Section 21A ROM (H8S/2636 Group)
2. In a power-down state, FLMCR1, FLMCR2, EBR1, EBR2, RAMER, and FLPWCR cannot be read from or written to.
21A.15 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and programmer mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Renesas Electronics microcomputer device type with 128-kbyte on-chip flash memory. Only use the specified socket adapter. Failure to observe these points may result in damage to the device. 2. Powering on and off (see figures 21A-18 to 21A-20) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. 3. FWE application/disconnection (see figures 21A-18 to 21A-20) FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: • Apply FWE when the VCC voltage has stabilized within its rated voltage range. Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). • • In boot mode, apply and disconnect FWE during a reset. In user program mode, FWE can be switched between high and low level regardless of a reset state. FWE input can also be switched during execution of a program in flash memory. • Do not apply FWE if program runaway has occurred.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
•
Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when applying or disconnecting FWE.
4. Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin only when programming or erasing flash memory. A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Do not set or clear the SWE bit during execution of a program in flash memory. Wait for at least 100 µs after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1, flash memory can only be read in program-verify or erase-verify mode. Access flash memory only for verify operations (verification during programming/erasing). Do not clear the SWE bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations. 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. In programmer mode, also, perform only one programming operation on a 128-byte programming unit block. Further programming must only be executed after this programming unit block has been erased.
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Section 21A ROM (H8S/2636 Group)
9. Before programming, check that the chip is correctly mounted in the PROM programmer. Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors.
Programming/ erasing possible
Wait time: x
Wait time: 100 μs
φ tOSC1 VCC
Min. 0 μs
FWE
tMDS*3
Min. 0 μs
MD2 to MD0*1
tMDS*3
RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until poweroff by pulling the pins up or down. 2. See section 24.1.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21A-18 Power-On/Off Timing (Boot Mode)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Wait time: x
Programming/ erasing possible
Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs
FWE
MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until poweroff by pulling the pins up or down. 2. See section 24.1.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21A-19 Power-On/Off Timing (User Program Mode)
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Section 21A ROM (H8S/2636 Group)
Wait time: 100 μs
Wait time: x Programming/ erasing possible Wait time: 100 μs
Wait time: x Programming/ erasing possible Wait time: 100 μs
φ tOSC1
VCC
Min. 0μs
FWE tMDS
tMDS*2
MD2 to MD0
tMDS tRESW RES SWE set SWE bit Mode change*1 Boot mode SWE cleared
Mode User change*1 mode
User program mode
User mode
User program mode
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. 2. When making a transition from boot mode to another mode, a mode programming setup time, tMDS (min.), of 200 ns is necessary with respect to the RES clearance timing. 3. See section 24.1.7, Flash Memory Characteristics.
Figure 21A-20 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode)
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Wait time: 100 μs
Wait time: x Programming/ erasing possible
Programming/ erasing possible
Wait time: x
Section 21A ROM (H8S/2636 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21A.16 Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version does not have the internal registers for flash memory control that are provided in the F-ZTAT version. Table 21A-15 lists the registers that are present in the F-ZTAT version but not in the mask ROM version. If a register listed in table 21A-15 is read in the mask ROM version, an undefined value will be returned. Therefore, if application software developed on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure that the registers in table 21A-15 have no effect. Table 21A-15 Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Register Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 RAMER Address H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.1 Overview
The H8S/2638 and H8S/2639 have 256 kbytes of on-chip flash memory, or 256 kbytes or 384 kbytes of on-chip mask ROM. The H8S/2630 has 384 kbytes of on-chip flash memory, or 384 kbytes of on-chip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and processing speed increased. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0). The flash memory version can be erased and programmed on-board, as well as with a specialpurpose PROM programmer. 21B.1.1 Block Diagram Figure 21B-1 shows a block diagram of 256-kbyte and 384-kbyte ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000 H'000002
H'000001 H'000003
H'03FFFE (H'05FFFE)*
H'03FFFF (H'05FFFF)*
Note: * ROM addresses for the H8S/2638 and H8S/2639 extend from H'000000 to H'03FFFF (256 kbytes), and for the H8S/2630 from H'000000 to H'05FFFF (384 kbytes).
Figure 21B-1 Block Diagram of ROM 256 kbytes (384 kbytes)*
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.1.2 Register Configuration The H8S/2638 and H8S/2639 operating mode is controlled by the mode pins and the MDCR register. The register configuration is shown in table 21B-1. Table 21B-1 Register Configuration
Register Name Mode control register Abbreviation MDCR R/W R/W Initial Value Undefined Address* H'FDE7
Note: * Lower 16 bits of the address.
21B.2 Register Descriptions
21B.2.1 Mode Control Register (MDCR)
Bit: Initial value: R/W: 7 — 1 R/W 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 MDS2 —* R 1 MDS1 —* R 0 MDS0 —* R
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit register used to monitor the current H8S/2638 Group, H8S/2639 Group, and H8S/2630 Group operating mode. Bit 7—Reserved: Only 1 should be written to these bits. Bits 6 to 3—Reserved: These bits are always read as 0 and cannot be modified. Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. MDS2 to MDS0 are read-only bits, and cannot be modified. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are canceled by a reset.
21B.3 Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can be accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
The on-chip ROM is enabled and disabled by setting the mode pins (MD2, MD1, and MD0). These settings are shown in table 21B-2. Table 21B-2 Operating Modes and ROM (F-ZTAT Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 0 1 — FWE 0 MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 Enabled (256 kbytes/ 3 384 kbytes)* Enabled (256 kbytes/ 3 384 kbytes)* — Enabled (256 kbytes/ 3 384 kbytes)* Enabled (256 kbytes/ 3 384 kbytes)* — Enabled (256 kbytes/ 3 384 kbytes)* Enabled (256 kbytes/ 3 384 kbytes)* Disabled On-Chip ROM —
Mode 7
1
Mode 8 Mode 9 Mode 10
— Boot mode (advanced expanded mode 1 with on-chip ROM enabled)* Boot mode (advanced single-chip 2 mode)* — User program mode (advanced expanded mode with on-chip ROM 1 enabled)* User program mode (advanced single2 chip mode)*
1
0
0 1
0 1 0
Mode 11
1
Mode 12 Mode 13 Mode 14
1
0 1
0 1 0
Mode 15
1
Notes: 1. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced expanded mode with on-chip ROM enabled. 2. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced single-chip mode.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
3. The H8S/2638 and H8S/2639 have 256 kbytes of on-chip ROM. The H8S/2630 has 384 kbytes of on-chip ROM.
Table 21B-3 Operating Modes and ROM (Mask ROM Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 0 1 — MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 Enabled (256 kbytes/ 384 kbytes)* Enabled (256 kbytes/ 384 kbytes)* Disabled On-Chip ROM —
Mode 7
1
Note: * The H8S/2638 and H8S/2639 have 256 kbytes of on-chip ROM. The H8S/2630 has 384 kbytes of on-chip ROM.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.4 Flash Memory Overview
21B.4.1 Features The H8S/2638 and H8S/2639 have 256 kbytes of on-chip flash memory, or 256 kbytes of on-chip mask ROM. The H8S/2630 has 384 kbytes of on-chip flash memory, or 384 kbytes of on-chip mask ROM. The features of the flash memory are summarized below. • Four flash memory operating modes ⎯ Program mode ⎯ Erase mode ⎯ Program-verify mode ⎯ Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Block erase (in single-block units) can be performed. To erase the entire flash memory, each block must be erased in turn. Block erasing can be performed as required on 4 kbytes, 32 kbytes, and 64 kbytes blocks. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.). • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: ⎯ Boot mode ⎯ User program mode • Automatic bit rate adjustment With data transfer in boot mode, the LSI’s bit rate can be automatically adjusted to match the transfer bit rate of the host. • Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. • Protect modes There are three protect modes, hardware, software, and error protection, which allow protected status to be designated for flash memory program/erase/verify operations.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• Programmer mode Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board programming mode. 21B.4.2 Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 FLMCR2 EBR1 EBR2 RAMER FLPWCR Flash memory (256 kbytes/ 384 kbytes) Bus interface/controller Operating mode FWE pin Mode pin
Legend: FLMCR1: FLMCR2: EBR1: EBR2: RAMER: FLPWCR:
Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Flash memory power control register
Figure 21B-2 Block Diagram of Flash Memory
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.4.3 Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the microcomputer enters an operating mode as shown in figure 21B-3. In user mode, flash memory can be read but not programmed or erased. The boot, user program and programmer modes are provided as modes to write and erase the flash memory.
MD1 = 1, MD2 = 1, FWE = 0 *1 User mode (on-chip ROM enabled) RES = 0 RES = 0 MD1 = 1, MD2 = 1, FWE = 1 RES = 0 MD2 = 0, MD1 = 1, FWE = 1 RES = 0 Programmer mode *2
Reset state
FWE = 1
FWE = 0
*1 User program mode
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. RAM emulation possible 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
Figure 21B-3 Flash Memory State Transitions
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.4.4 On-Board Programming Modes Boot Mode
1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host
Host Programming control program New application program
New application program
Chip
Boot program Flash memory RAM SCI
Chip
Boot program Flash memory RAM Boot program area SCI
Application program (old version)
Application program (old version)
Programming control program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks.
Host
4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory.
Host
New application program
Chip
Boot program Flash memory RAM Boot program area Flash memory preprogramming erase
Programming control program
Chip
SCI Boot program Flash memory RAM Boot program area New application program
Programming control program
SCI
Program execution state
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
User Program Mode
1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program New application program
2. Programming/erase control program transfer When user program mode is entered, user software confirms this fact, executes transfer program in the flash memory, and transfers the programming/erase control program to RAM.
Host
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program
SCI RAM
Transfer program
Transfer program
Programming/ erase control program
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program Transfer program Programming/ erase control program Programming/ erase control program
SCI RAM
Transfer program
Flash memory erase
New application program
Program execution state
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.4.5 Flash Memory Emulation in RAM Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read.
SCI
Flash memory Emulation block
RAM
Overlap RAM (emulation is performed on data written in RAM) Application program Execution state
Figure 21B-4 Reading Overlap RAM Data in User Mode or User Program Mode When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
SCI
Flash memory Programming data
RAM
Application program
Overlap RAM (programming data) Programming control program execution state
Figure 21B-5 Writing Overlap RAM Data in User Program Mode 21B.4.6 Differences between Boot Mode and User Program Mode Table 21B-4 Differences between Boot Mode and User Program Mode
Boot Mode Total erase Block erase Programming control program* Yes No Program/program-verify User Program Mode Yes Yes Erase/erase-verify Program/program-verify Emulation Note: * To be provided by the user, in accordance with the recommended algorithm.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.4.7 Block Configuration The H8S/2638 and H8S/2639 have 256 kbytes of flash memory, which is divided into three 64kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks. The H8S/2630 has 384 kbytes of flash memory, which is divided into five 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks.
H8S/2638, H8S/2639 Address H'00000 4 kbytes × 8 32 kbytes H8S/2630 4 kbytes × 8 32 kbytes
64 kbytes 256 kbytes 64 kbytes 384 kbytes
64 kbytes
64 kbytes
64 kbytes Address H'3FFFF
64 kbytes
64 kbytes
64 kbytes Address H'5FFFF
Figure 21B-6 Flash Memory Block Configuration
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.5 Pin Configuration
The flash memory is controlled by means of the pins shown in table 21B-5. Table 21B-5 Pin Configuration
Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Port F0 Port 16 Port 14 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 PF0 P16 P14 TxD1 RxD1 I/O Input Input Input Input Input Input Input Input Output Input Function Reset Flash memory program/erase protection by hardware Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Serial transmit data output Serial receive data input
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.6 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 21B-6. Table 21B-6 Register Configuration
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Abbreviation FLMCR1 * 4 FLMCR2 *
4 EBR1* 4 EBR2* 4 RAMER* 4 4
R/W R/W R R/W R/W R/W R/W
Initial Value H'00* H'00
3 H'00* 3 H'00* 2
Address* H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB H'FFAC
1
H'00 H'00*
3
Flash memory power control register FLPWCR*
Notes: 1. Lower 16 bits of the address. 2. When a high level is input to the FWE pin, the initial value is H'80. 3. When a low level is input to the FWE pin, or if a high level is input and the SWE1 bit in FLMCR1 is not set, these registers are initialized to H'00. 4. FLMCR1, FLMCR2, EBR1, and EBR2, RAMER, and FLPWCR are 8-bit registers. Use byte access on these registers.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.7 Register Descriptions
21B.7.1 Flash Memory Control Register 1 (FLMCR1) FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PV or EV bit. Program mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for onchip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are enabled only in the following cases: Writes to bit SWE of FLMCR1 enabled when FWE = 1, to bits ESU, PSU, EV, and PV when FWE = 1 and SWE = 1, to bit E when FWE = 1, SWE = 1 and ESU = 1, and to bit P when FWE = 1, SWE = 1, and PSU = 1.
Bit: Initial value: R/W: 7 FWE —* R 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Note: * Determined by the state of the FWE pin.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing.
Bit 7 FWE 0 1 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 6—Software Write Enable Bit (SWE): This bit selects write and erase valid/invalid of the flash memory. Set it when setting bits 5 to 0, bits 7 to 0 of EBR1, and bits 5 to 0* of EBR2.
Bit 6 SWE 0 1 Description Writes disabled Writes enabled [Setting condition] • When FWE = 1 Note: * Bits 3 to 0 of EBR2 for the H8S/2638 and H8S/2639. (Initial value)
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit in FLMCR1 to 1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 5 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit in FLMCR1 to 1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 4 PSU 0 1 Description Program setup cleared Program setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] • When FWE = 1, SWE = 1, and ESU = 1 (Initial value)
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] • When FWE = 1, SWE = 1, and PSU = 1 (Initial value)
21B.7.2 Flash Memory Control Register 2 (FLMCR2) FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00.
Bit: Initial value: R/W: 7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
Note: FLMCR2 is a read-only register, and should not be written to.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7 FLER 0 Description Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] • 1 Reset or hardware standby mode An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] • See section 21B.10.3, Error Protection
Bits 6 to 0—Reserved: These bits always read 0.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.7.3 Erase Block Register 1 (EBR1) EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory erase block configuration is shown in table 21B-7.
Bit: Initial value: R/W: 7 EB7 0 R/W 6 EB6 0 R/W 5 EB5 0 R/W 4 EB4 0 R/W 3 EB3 0 R/W 2 EB2 0 R/W 1 EB1 0 R/W 0 EB0 0 R/W
21B.7.4 Erase Block Register 2 (EBR2) EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin. Bit 0 will be initialized to 0 if bit SWE of FLMCR1 is not set, even though a high level is input to pin FWE. When a bit in EBR2 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. On the H8S/2638 and H8S/2639 bits 7 to 4 are reserved, and on the H8S/2630 bits 7 and 6 are reserved. Only 0 may be written to these reserved bits. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory erase block configuration is shown in table 21B-7.
Bit: Initial value: R/W: 7 — 0 R/W 6 — 0 R/W 5 EB13* 0 R/W 4 EB12* 0 R/W 3 EB11 0 R/W 2 EB10 0 R/W 1 EB9 0 R/W 0 EB8 0 R/W
Note: * Valid on the H8S/2630. On the H8S/2638 and H8S/2639 these bits are reserved and only 0 may be written to them.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 21B-7 Flash Memory Erase Blocks
Block (Size) EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) EB8 (32 kbytes) EB9 (64 kbytes) EB10 (64 kbytes) EB11 (64 kbytes) EB12 (64 kbytes)* EB13 (64 kbytes))* Addresses H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF H'008000 to H'00FFFF H'010000 to H'01FFFF H'020000 to H'02FFFF H'030000 to H'03FFFF H'040000 to H'04FFFF H'050000 to H'05FFFF
Note: * This function is not available in the H8S/2638 and H8S/2639.
21B.7.5 RAM Emulation Register (RAMER) RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 21B-8. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed.
Bit: Initial value: R/W: 7 — 0 R 6 — 0 R 5 — 0 R/W 4 — 0 R/W 3 RAMS 0 R/W 2 RAM2 0 R/W 1 RAM1 0 R/W 0 RAM0 0 R/W
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Bits 7 and 6—Reserved: These bits always read 0. Bits 5 and 4—Reserved: Only 0 may be written to these bits. Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory block are program/erase-protected.
Bit 3 RAMS 0 1 Description Emulation not selected Program/erase-protection of all flash memory blocks is disabled Emulation selected Program/erase-protection of all flash memory blocks is enabled (Initial value)
Bits 2 to 0—Flash Memory Area Selection: These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM. (See table 21B-8.) Table 21B-8 Flash Memory Area Divisions
Addresses H'FFD000 to H'FFDFFF H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF Block Name RAM area 4 kbytes EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) RAMS 0 1 1 1 1 1 1 1 1 RAM1 * 0 0 0 0 1 1 1 1 RAM1 * 0 0 1 1 0 0 1 1 RAM0 * 0 1 0 1 0 1 0 1 *: Don't care
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.7.6 Flash Memory Power Control Register (FLPWCR)
Bit: Initial value: R/W: 7 PDWND 0 R/W 6 — 0 R 5 — 0 R 4 — 0 R 3 — 0 R 2 — 0 R 1 — 0 R 0 — 0 R
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode*. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions. Bit 7—Power-Down Disable (PDWND): The subactive mode is not available in versions other than the U-mask and W-mask versions. Only 0 should be written to this bit in the case of versions other than the U-mask and W-mask versions. See section 21.B.14, Flash Memory and Power-Down States, for more information.
Bit 7 PDWND 0 1 Description Transition to flash memory power-down mode enabled Transition to flash memory power-down mode disabled (Initial value)
Bits 6 to 0—Reserved: These bits always read 0.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.8 On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is made to the on-board programming state in which program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 21B-9. For a diagram of the transitions to the various flash memory modes, see figure 21B-3. Table 21B-9 Setting On-Board Programming Modes
Mode Boot mode User program mode Expanded mode Single-chip mode Expanded mode Single-chip mode 1 FWE 1 MD2 0 0 1 1 MD1 1 1 1 1 MD0 0 1 0 1
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.8.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The SCI channel to be used is set to asynchronous mode. When a reset-start is executed after the H8S/2638’, H8S/2639’, and H8S/2630’ pins have been set to boot mode, the boot program built into the H8S/2638, H8S/2639, and H8S/2630 are started and the programming control program prepared in the host is serially transmitted to the H8S/2638, H8S/2639, and H8S/2630 via the SCI. In the H8S/2638, H8S/2639, and H8S/2630, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 21B-7, and the boot mode execution procedure in figure 21B-8.
LSI
Flash memory
Host
Write data reception Verify data transmission
RxD1 SCI1 TxD1 On-chip RAM
Figure 21B-7 System Configuration in Boot Mode
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, LSI transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM No Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM
n+1→n
n = N?
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted.
Figure 21B-8 Boot Mode Execution Procedure
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Automatic SCI Bit Rate Adjustment
Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
When boot mode is initiated, the LSI measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The LSI calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the LSI. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the LSI’s system clock frequency, there will be a discrepancy between the bit rates of the host and the LSI. Set the host transfer bit rate at 4,800, 9,600 or 19,200 bps to operate the SCI properly. Table 21B-10 shows host transfer bit rates and system clock frequencies for which automatic adjustment of the LSI bit rate is possible. The boot program should be executed within this system clock range. Table 21B-10 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is Possible
Host Bit Rate 4,800 bps 9,600 bps 19,200 bps System Clock Frequency for which Automatic Adjustment of LSI Bit Rate Is Possible 4 to 20 MHz 8 to 20 MHz 16 to 20 MHz
Note: The system clock frequency used in boot mode is generated by an external crystal oscillator element. PLL frequency multiplication is not used.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the programming control program is transferred via the SCI, as shown in figure 21B-9. The boot program area cannot be used until the execution state in boot mode switches to the programming control program transferred from the host.
H'FFC000 Programming control program area (8 kbytes) H'FFDFFF H'FFE000 Boot program area (4 kbytes) H'FFEFBF Note: The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note also that the boot program remains in this area of the on-chip RAM even after control branches to the programming control program.
Figure 21B-9 RAM Areas in Boot Mode Notes on Use of Boot Mode: • When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. • In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. • Interrupts cannot be used while the flash memory is being programmed or erased. • The RxD1 and TxD1 pins should be pulled up on the board. • Before branching to the programming control program (RAM area H'FFC000), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P33DDR = 1, P33DR = 1). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. The initial values of other on-chip registers are not changed. • Boot mode can be entered by making the pin settings shown in table 21B-9 and executing a reset-start. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the FWE pin and mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low while the boot program is being executed or while flash memory is being programmed or erased*2. • If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer’s operating mode*3. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: 1. Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS = 4 states) with respect to the reset release timing. 2. For precautions on applying and disconnecting FWE, see section 21B.15, Flash Memory Programming and Erasing Precautions. 3. See appendix D, Pin States. 21B.8.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Figure 21B-10 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
Write the FWE assessment program and transfer program (and the program/erase control program if necessary) beforehand MD2, MD1, MD0 = 110, 111 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area FWE = high* Execute program/erase control program (flash memory rewriting) Clear FWE* Branch to flash memory application program Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin only when the flash memory is programmed or erased. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. * For further information on FWE application and disconnection, see section 21B.15, Flash Memory Programming and Erasing Precautions.
Figure 21B-10 User Program Mode Execution Procedure
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.9 Programming/Erasing Flash Memory
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1 for on-chip flash memory. The flash memory cannot be read while it is being written or erased. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Also ensure that the DTC is not activated before or after execution of the flash memory write instruction. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 24.2.7 and 24.3.7, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if bits SWE, ESU, PSU, EV, PV, E, and P of FLMCR1 are set/reset by a program in flash memory in the corresponding address areas. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming should be performed in the erased state. Do not perform additional programming on previously programmed addresses.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
*3 E=1 Erase setup state E=0 Normal mode ESU = 1 ESU = 0 Erase-verify mode Erase mode
*1
FWE = 1
FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0
On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state
*4 P=1 Program setup state P=0 Program mode
PV = 1 PV = 0
Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state.
Figure 21B-11 FLMCR1 Bit Settings and State Transitions
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.9.1
Program Mode
When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 21B-12 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) µs. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see “Notes on Program/Program-Verify Procedure.”
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.9.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 21B-12) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE. Notes on Program/Program-Verify Procedure 1. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the chip, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the chip, the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N).
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Item Wait time after P bit setting Symbol tsp Item When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing* Symbol tsp30 tsp200 tsp10
Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6.
6. The program/program-verify flowchart for the H8S/2638, H8S/2639, and H8S/2630 are shown in figure 21B-12. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Reprogram Data Computation Table
Result of Verify-Read after Write Pulse Application (V) 0 1 0 1 (X) Result of Operation 1 0 1 1
(D) 0 0 1 1
Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed ⎯ Still in erased state: no action
Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed
Additional-Programming Data Computation Table
Result of Verify-Read after Write Pulse (X') Application (V) 0 0 (Y) Result of Operation 0
Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action
0
1
1
1 1
0 1
1 1
Legend: (Y): Data of bits on which additional programming is executed (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop
7. It is necessary to execute additional programming processing during the course of the chip program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Write pulse application subroutine
Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) μs
Store 128-byte program data in program data area and reprogram data area
Sub-Routine Write Pulse WDT enable Set PSU bit in FLMCR1 Wait (tspsu) μs Set P bit in FLMCR1 Wait (tsp) μs Clear P bit in FLMCR1 Wait (tcp) μs Clear PSU bit in FLMCR1 Wait (tcpsu) μs
Disable WDT
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
*7 *4
*7
Start of programming
n=1 m=0
*5*7
End of programming
Write 128-byte data in RAM reprogram data area consecutively to flash memory
*1
Sub-Routine-Call
*7
Write pulse
See Note 6 for pulse width
Set PV bit in FLMCR1 Wait (tspv) μs
H'FF dummy write to verify address
*7
*7
Wait (tspvr) μs End Sub
Increment address Note: 6 Write Pulse Width Number of Writes n Write Time (tsp) μsec Write data = verify data? Read verify data
*7 *2
No m=1 No
n←n+1
1 2 3 4 5 6 7 8 9 10 11 12 13
30 30 30 30 30 30 200 200 200 200 200 200 200
Yes 6≥n?
Yes Additional-programming data computation Transfer additional-programming data to additional-programming data area
Reprogram data computation
*4 *3 *4
Transfer reprogram data to reprogram data area 128-byte data verification completed?
No 998 999 1000 200 200 200
Yes Clear PV bit in FLMCR1 Reprogram Wait (tcpv) μs 6 ≥ n? No
Note: Use a 10 μs write pulse for additional programming.
*7
RAM
Program data storage area (128 bytes)
Yes Successively write 128-byte data from additional1 programming data area in RAM to flash memory * Sub-Routine-Call Write Pulse (Additional programming)
Reprogram data storage area (128 bytes)
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Additional-programming data storage area (128 bytes)
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
Notes: 1. 2. 3.
4. 5. 7.
Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Verify data is read in 16-bit (word) units. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. A write pulse of 30 μs or 200 μs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 μs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. The wait times and value of N are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Reprogram Data Computation Table
Original Data Verify Data Reprogram Data
Additional-Programming Data Computation Table (X) 1 0 1 1
Still in erased state; no action Comments Programming completed Programming incomplete; reprogram
(D) 0 0 1 1
(V) 0 1 0 1
Reprogram Data (X') 0 0 1 1
Verify Data Additional(V) Programming Data (Y) 0 1 0 1 0 1 1 1
Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed
Figure 21B-12 Program/Program-Verify Flowchart
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.9.3
Erase Mode
When erasing flash memory, the single-block erase flowchart shown in figure 21B-13 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.2.7 and 24.3.7, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register 1 and 2 (EBR1, EBR2) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 21B.9.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) µs. If erasing multiple blocks, set a single bit in EBR1/EBR2 for the next block to be erased, and repeat the erase/erase-verify sequence as before.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs
NG
*4
*5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
Wait (tcswe) μs End of erasing
Notes: 1. 2. 3. 4. 5.
Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block registers (EBR1 and EBR2). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Figure 21B-13 Erase/Erase-Verify Flowchart
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.10 Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 21B.10.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), erase block register 1 (EBR1), and erase block register 2 (EBR2). The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained in the error-protected state (See table 21B-11). Table 21B-11 Hardware Protection
Functions Item FWE pin protection Description • Program Erase Yes
Yes When a low level is input to the FWE pin, FLMCR1, FLMCR2, (except bit FLER) EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset (including a WDT reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. Yes
Reset/standby protection
•
Yes
•
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.10.2 Software Protection Software protection can be implemented by setting the SWE bit in FLMCR1, erase block register 1 (EBR1), erase block register 2 (EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1), does not cause a transition to program mode or erase mode (See table 21B-12). Table 21B-12 Software Protection
Functions Item SWE bit protection Description • Program Erase Yes
Setting bit SWE in FLMCR1 to 0 will place Yes area on-chip flash memory in the program/ erase-protected state (Execute the program in the on-chip RAM, external memory). Erase protection can be set for individual blocks by settings in erase block register 1 (EBR1) and erase block register 2 (EBR2). Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Yes Setting the RAMS bit to 1 in the RAM emulation register (RAMER) places all blocks in the program/erase-protected state. —
Block specification protection
•
Yes
• Emulation protection •
Yes
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.10.3 Error Protection In error protection, an error is detected when chip runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the chip malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: 1. When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) 2. Immediately after exception handling (excluding a reset) during programming/erasing 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the CPU releases the bus to the DTC Error protection is released only by a reset and in hardware standby mode.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Figure 21B-14 shows the flash memory state transition diagram.
Program mode Erase mode RD VF PR ER FLER = 0
RES = 0 or HSTBY = 0
Reset or standby (hardware protection) RD VF PR ER FLER = 0
Error occurrence (software standby) Error occurrence
RES = 0 or HSTBY = 0 RES = 0 or HSTBY = 0
FLMCR1, FLMCR2, EBR1, EBR2 initialization state
Error protection mode RD VF PR ER FLER = 1
Software standby mode Software standby mode release
Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2, (except bit FLER) EBR1, EBR2 initialization state
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible
Figure 21B-14 Flash Memory State Transitions
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.11 Flash Memory Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses cannot be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 21B-15 shows an example of emulation of real-time flash memory programming.
Start of emulation program
Set RAMER
Write tuning data to overlap RAM
Execute application program
No
Tuning OK? Yes Clear RAMER
Write to flash memory emulation block
End of emulation program
Figure 21B-15 Flowchart for Flash Memory Emulation in RAM
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
This area can be accessed from both the RAM area and flash memory area H'00000 H'01000 H'02000 H'03000 H'04000 H'05000 H'06000 H'07000 H'08000 EB1 EB2 EB3 EB4 EB5 EB6 EB7 EB0 H'00000 H'01000 H'02000 H'03000 H'04000 H'05000 H'06000 H'07000 H'08000 H'FFD000 H'FFDFFF On-chip RAM H'FFEFBF H'3FFFF H'5FFFF EB1 EB2 EB3 EB4 EB5 EB6 EB7 EB0
This area can be accessed from both the RAM area and flash memory area
Flash memory EB8 to EB11
Flash memory EB8 to EB13 On-chip RAM
H'FFD000 H'FFDFFF
H'FFEFBF
H8S/2638, H8S/2639
H8S/2630
Figure 21B-16 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB0 is Overlapped 1. Set bits RAMS, RAM2 to RAM0 in RAMER to 1, 0, 0, 0, to overlap part of RAM onto the area (EB0) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB0). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1), will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.12 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI interrupt is disabled when flash memory is being programmed or erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All requests, including NMI interrupt, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly.
•
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.13 Programmer Mode
Programmer mode enables programming and erasing of the on-chip flash memory by using a PROM programmer via a socket adapter in the same manner as standalone flash memory. For the H8S/2638 Group and H8S/2639 Group, use a PROM programmer that supports Renesas MCU devices with 256 KB of on-chip flash memory (FZTAT256V5A). For the H8S/2630 Group, use a PROM programmer that supports Renesas MCU devices with 512 KB of on-chip flash memory (FZTAT512V5A). 21B.13.1 Socket Adapter and Memory Map In programmer mode in which the PROM writer is used, reading from memory (verification), writing, and initializing the flash memory (erasing all of its contents) are enabled. At this time, a dedicated conversion socket adapter must be attached to a general-purpose PROM writer. Table 21B-13 shows the types of the socket adapters. For programmer mode on this LSI, one of the socket adapters listed in table 21B-13 should be used. Table 21B-13
Part No. HD64F2638F HD64F2638UF HD64F2638WF HD64F2639UF HD64F2639WF HD64F2630F HD64F2630UF HD64F2630WF
Type of Socket Adapter
Package Type 128 pin QFP (FP-128B) Socket Adapter Type ME2636ESHF1H HF2636Q128D4001 Manufacturer Minato Electronics Inc. Data I/O Japan Corporation
Addresses in MCU mode H'000000
Addresses in programmer mode H'00000
Addresses in MCU mode H'000000
Addresses in programmer mode H'00000
On-chip ROM space 256 kbytes (H8S/2638, H8S/2639)
On-chip ROM space 384 kbytes (H8S/2630)
H'03FFFF
H'3FFFF
H'05FFFF
H'5FFFF
Figure 21B-17 On-Chip ROM Memory Map
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
21B.14 Flash Memory and Power-Down States
In addition to its normal operating state, the flash memory has power-down states in which power consumption is reduced by halting part or all of the internal power supply circuitry. There are three flash memory operating states: (1) Normal operating mode: The flash memory can be read and written to. (2) Power-down mode: Part of the power supply circuitry is halted, and the flash memory can be read when the LSI is operating on the subclock. (3) Standby mode: All flash memory circuits are halted, and the flash memory cannot be read or written to. States (2) and (3) are flash memory power-down states. Table 21B-14 shows the correspondence between the operating states of the LSI and the flash memory. Table 21B-14 Flash Memory Operating States
Flash Memory Operating State Normal mode (read/write)
LSI Operating State High-speed mode Medium-speed mode Sleep mode Subactive mode* Subsleep mode* Watch mode* Software standby mode Hardware standby mode
When PDWND = 0: Power-down mode (read-only) When PDWND = 1: Normal mode (read-only) Standby mode
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with other versions.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.14.1 Notes on Power-Down States 1. When the flash memory is in a power-down state, part or all of the internal power supply circuitry is halted. Therefore, a power supply circuit stabilization period must be provided when returning to normal operation. When the flash memory returns to its normal operating state from a power-down state, bits STS2 to STS0 in SBYCR must be set to provide a wait time of at least 20 µs (power supply stabilization time), even if an oscillation stabilization period is not necessary. 2. In a power-down state, FLMCR1, FLMCR2, EBR1, EBR2, RAMER, and FLPWCR cannot be read from or written to.
21B.15 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and programmer mode are summarized below. Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Renesas microcomputer device type* with 256-kbyte and 512-kbyte on-chip flash memory. Only use the specified socket adapter. Failure to observe these points may result in damage to the device. Note: * The H8S/2638 and H8S/2639 are Renesas Electronics microcomputer devices with 256 kbytes of on-chip flash memory. The H8S/2630 is a Renesas microcomputer device with 512 kbytes of on-chip flash memory (The H8S/2630 has 384 kbytes of PROM. The area from H'60000 to H'7FFFF should be programmed as H'FF). Powering on and off (see figures 21B-18 to 21B-20): Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
FWE application/disconnection (see figures 21B-18 to 21B-20): FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: • Apply FWE when the VCC voltage has stabilized within its rated voltage range. Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization time). • In boot mode, apply and disconnect FWE during a reset. • In user program mode, FWE can be switched between high and low level regardless of the reset state. FWE input can also be switched during execution of a program in flash memory. • Do not apply FWE if program runaway has occurred. • Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when applying or disconnecting FWE. Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only when programming or erasing flash memory. A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Do not set or clear the SWE bit during execution of a program in flash memory: Wait for at least 100 µs after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1, flash memory can only be read in program-verify or erase-verify mode. Access flash memory only for verify operations (verification during programming/erasing). Also, do not clear the SWE bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. Do not use interrupts while flash memory is being programmed or erased: All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit block. In programmer mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer: Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming: Touching either of these can cause contact faults and write errors.
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Wait time: x
Programming/ erasing possible Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs
FWE
tMDS*3
Min. 0 μs
MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21B-18 Power-On/Off Timing (Boot Mode)
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Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Wait time: x
Programming/ erasing possible Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs
FWE
MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21B-19 Power-On/Off Timing (User Program Mode)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
Wait time: x Programming/erasing possible
Wait time: x Programming/erasing possible Wait time: 100 μs
Wait time: x Programming/erasing possible Wait time: 100 μs
Programming/erasing possible
Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs FWE tMDS tMDS*2
MD2 to MD0 tMDS tRESW RES SWE set Mode change*1 Boot mode SWE cleared Mode User change*1 mode User program mode User mode User program mode
SWE bit
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. 2. When making a transition from boot mode to another mode, a mode programming setup time tMDS (min.) of 200 ns is necessary with respect to RES clearance timing. 3. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Figure 21B-20 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode)
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Wait time: x
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Wait time: 100 μs
Section 21B ROM (H8S/2638 Group, H8S/2639 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21B.16 Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version does not have the internal registers for flash memory control that are provided in the F-ZTAT version. Table 21B-15 lists the registers that are present in the F-ZTAT version but not in the mask ROM version. If a register listed in table 21B-15 is read in the mask ROM version, an undefined value will be returned. Therefore, if application software developed on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure that the registers in table 21B-15 have no effect. Table 21B-15
Register Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register
Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 RAMER Address H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 21C ROM (H8S/2635 Group)
Section 21C ROM (H8S/2635 Group)
21C.1 Overview
The H8S/2635 Group has 192 kbytes of on-chip flash memory, or 192 kbytes or 128 kbytes of onchip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and processing speed increased. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0). The flash memory version can be erased and programmed on-board, as well as with a specialpurpose PROM programmer. 21C.1.1 Block Diagram Figure 21C-1 shows a block diagram of 192-kbyte and 128-kbyte ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000 H'000002
H'000001 H'000003
H'02FFFE (H'01FFFE)*
H'02FFFF (H'01FFFF)*
Note: * ROM addresses for the H8S/2635 extend from H'000000 to H'02FFFF (192 kbytes), and for the H8S/2634 from H'000000 to H'01FFFF (128 kbytes).
Figure 21C-1 Block Diagram of ROM 192 kbytes (128 kbytes)*
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.1.2 Register Configuration The H8S/2638 and H8S/2639 operating mode is controlled by the mode pins and the MDCR register. The register configuration is shown in table 21C-1. Table 21C-1 Register Configuration
Register Name Mode control register Abbreviation MDCR R/W R/W Initial Value Undefined Address* H'FDE7
Note: * Lower 16 bits of the address.
21C.2 Register Descriptions
21C.2.1 Mode Control Register (MDCR)
Bit: Initial value: R/W: 7 — 1 R/W 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 MDS2 —* R 1 MDS1 —* R 0 MDS0 —* R
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit register used to monitor the current H8S/2638 Group, H8S/2639 Group, and H8S/2630 Group operating mode. Bit 7—Reserved: Only 1 should be written to these bits. Bits 6 to 3—Reserved: These bits are always read as 0 and cannot be modified. Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0. MDS2 to MDS0 are read-only bits, and cannot be modified. The mode pin (MD2 to MD0) input levels are latched into these bits when MDCR is read. These latches are canceled by a reset.
21C.3 Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can be accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to the lower 8 bits. Word data must start at an even address.
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Section 21C ROM (H8S/2635 Group)
The on-chip ROM is enabled and disabled by setting the mode pins (MD2, MD1, and MD0). These settings are shown in table 21C-2. Table 21C-2 Operating Modes and ROM (F-ZTAT Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 0 1 — FWE 0 MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 Enabled (192 kbytes/ 3 128 kbytes)* Enabled (192 kbytes/ 3 128 kbytes)* — Enabled (192 kbytes/ 3 128 kbytes)* Enabled (192 kbytes/ 3 128 kbytes)* — Enabled (192 kbytes/ 3 128 kbytes)* Enabled (192 kbytes/ 3 128 kbytes)* Disabled On-Chip ROM —
Mode 7
1
Mode 8 Mode 9 Mode 10
— Boot mode (advanced expanded mode 1 with on-chip ROM enabled)* Boot mode (advanced single-chip 2 mode)* — User program mode (advanced expanded mode with on-chip ROM 1 enabled)* User program mode (advanced single2 chip mode)*
1
0
0 1
0 1 0
Mode 11
1
Mode 12 Mode 13 Mode 14
1
0 1
0 1 0
Mode 15
1
Notes: 1. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced expanded mode with on-chip ROM enabled. 2. Apart from the fact that flash memory can be erased and programmed, operation is the same as in advanced single-chip mode.
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
3. The H8S/2635 has 192 kbytes of on-chip ROM. The H8S/2634 has 128 kbytes of onchip ROM.
Table 21C-3 Operating Modes and ROM (Mask ROM Version)
Mode Pins Operating Mode Mode 0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM disabled Advanced expanded mode with on-chip ROM enabled Advanced single-chip mode 1 1 0 1 — MD2 0 MD1 0 MD0 0 1 0 1 0 1 0 Enabled (192 kbytes/ 128 kbytes)* Enabled (192 kbytes/ 128 kbytes)* Disabled On-Chip ROM —
Mode 7
1
Note: * The H8S/2635 has 192 kbytes of on-chip ROM. The H8S/2634 has 128 kbytes of on-chip ROM.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 21C ROM (H8S/2635 Group)
21C.4 Flash Memory Overview
21C.4.1 Features The H8S/2635 has 192 kbytes of on-chip flash memory, or 192 kbytes or 128 kbytes of on-chip mask ROM. The features of the flash memory are summarized below. • Four flash memory operating modes ⎯ Program mode ⎯ Erase mode ⎯ Program-verify mode ⎯ Erase-verify mode • Programming/erase methods The flash memory is programmed 128 bytes at a time. Block erase (in single-block units) can be performed. To erase the entire flash memory, each block must be erased in turn. Block erasing can be performed as required on 4 kbytes, 32 kbytes, and 64 kbytes blocks. • Programming/erase times The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming, equivalent to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.). • Reprogramming capability The flash memory can be reprogrammed up to 100 times. • On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: ⎯ Boot mode ⎯ User program mode • Automatic bit rate adjustment With data transfer in boot mode, the LSI’s bit rate can be automatically adjusted to match the transfer bit rate of the host. • Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. • Protect modes There are three protect modes, hardware, software, and error protection, which allow protected status to be designated for flash memory program/erase/verify operations.
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• Programmer mode Flash memory can be programmed/erased in programmer mode, using a PROM programmer, as well as in on-board programming mode. 21C.4.2 Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1 FLMCR2 EBR1 EBR2 RAMER FLPWCR Bus interface/controller Operating mode FWE pin Mode pin
Flash memory (192 kbytes)
Legend: FLMCR1: FLMCR2: EBR1: EBR2: RAMER: FLPWCR:
Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Flash memory power control register
Figure 21C-2 Block Diagram of Flash Memory
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Section 21C ROM (H8S/2635 Group)
21C.4.3 Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the microcomputer enters an operating mode as shown in figure 21C-3. In user mode, flash memory can be read but not programmed or erased. The boot, user program and programmer modes are provided as modes to write and erase the flash memory.
MD1 = 1, MD2 = 1, FWE = 0 *1 User mode (on-chip ROM enabled) RES = 0 RES = 0 MD1 = 1, MD2 = 1, FWE = 1 RES = 0 MD2 = 0, MD1 = 1, FWE = 1 RES = 0 Programmer mode *2
Reset state
FWE = 1
FWE = 0
*1 User program mode
Boot mode On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. 1. RAM emulation possible 2. This LSI transits to programmer mode by using the dedicated PROM programmer.
Figure 21C-3 Flash Memory State Transitions
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.4.4 On-Board Programming Modes Boot Mode
1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the chip (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area.
Host
Host Programming control program New application program
New application program
Chip
Boot program Flash memory RAM SCI
Chip
Boot program Flash memory RAM Boot program area SCI
Application program (old version)
Application program (old version)
Programming control program
3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks.
Host
4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory.
Host
New application program
Chip
Boot program Flash memory RAM Boot program area Flash memory preprogramming erase
Programming control program
Chip
SCI Boot program Flash memory RAM Boot program area New application program
Programming control program
SCI
Program execution state
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Section 21C ROM (H8S/2635 Group)
User Program Mode
1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory.
Host Programming/ erase control program New application program New application program
2. Programming/erase control program transfer When user program mode is entered, user software confirms this fact, executes transfer program in the flash memory, and transfers the programming/erase control program to RAM.
Host
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program
SCI RAM
Transfer program
Transfer program
Programming/ erase control program
Application program (old version)
Application program (old version)
3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units.
Host
4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks.
Host
New application program
Chip
Boot program Flash memory
FWE assessment program
Chip
SCI RAM Boot program Flash memory
FWE assessment program Transfer program Programming/ erase control program Programming/ erase control program
SCI RAM
Transfer program
Flash memory erase
New application program
Program execution state
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.4.5 Flash Memory Emulation in RAM Emulation should be performed in user mode or user program mode. When the emulation block set in RAMER is accessed while the emulation function is being executed, data written in the overlap RAM is read.
SCI
Flash memory Emulation block
RAM
Overlap RAM (emulation is performed on data written in RAM) Application program Execution state
Figure 21C-4 Reading Overlap RAM Data in User Mode or User Program Mode When overlap RAM data is confirmed, the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the flash memory. When the programming control program is transferred to RAM, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
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Section 21C ROM (H8S/2635 Group)
SCI
Flash memory Programming data
RAM
Application program
Overlap RAM (programming data) Programming control program execution state
Figure 21C-5 Writing Overlap RAM Data in User Program Mode 21C.4.6 Differences between Boot Mode and User Program Mode Table 21C-4 Differences between Boot Mode and User Program Mode
Boot Mode Total erase Block erase Programming control program* Yes No Program/program-verify User Program Mode Yes Yes Erase/erase-verify Program/program-verify Emulation Note: * To be provided by the user, in accordance with the recommended algorithm.
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.4.7 Block Configuration The H8S/2635 has 192 kbytes of flash memory, which is divided into two 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks.
H8S/2635 Address H'00000 4 kbytes × 8 32 kbytes
192 kbytes
64 kbytes
64 kbytes Address H'2FFFF
Figure 21C-6 Flash Memory Block Configuration
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Section 21C ROM (H8S/2635 Group)
21C.5 Pin Configuration
The flash memory is controlled by means of the pins shown in table 21C-5. Table 21C-5 Pin Configuration
Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Port F0 Port 16 Port 14 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 PF0 P16 P14 TxD1 RxD1 I/O Input Input Input Input Input Input Input Input Output Input Function Reset Flash memory program/erase protection by hardware Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Sets MCU operating mode in programmer mode Serial transmit data output Serial receive data input
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.6 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 21C-6. Table 21C-6 Register Configuration
Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register Abbreviation FLMCR1 * 4 FLMCR2 *
4 EBR1* 4 EBR2* 4 RAMER* 4 4
R/W R/W R R/W R/W R/W R/W
Initial Value H'00* H'00
3 H'00* 3 H'00* 2
Address* H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB H'FFAC
1
H'00 H'00*
3
Flash memory power control register FLPWCR*
Notes: 1. Lower 16 bits of the address. 2. When a high level is input to the FWE pin, the initial value is H'80. 3. When a low level is input to the FWE pin, or if a high level is input and the SWE1 bit in FLMCR1 is not set, these registers are initialized to H'00. 4. FLMCR1, FLMCR2, EBR1, and EBR2, RAMER, and FLPWCR are 8-bit registers. Use byte access on these registers.
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Section 21C ROM (H8S/2635 Group)
21C.7 Register Descriptions
21C.7.1 Flash Memory Control Register 1 (FLMCR1) FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PV or EV bit. Program mode for on-chip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for onchip flash memory is entered by setting SWE bit to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. Writes are enabled only in the following cases: Writes to bit SWE of FLMCR1 enabled when FWE = 1, to bits ESU, PSU, EV, and PV when FWE = 1 and SWE = 1, to bit E when FWE = 1, SWE = 1 and ESU = 1, and to bit P when FWE = 1, SWE = 1, and PSU = 1.
Bit: Initial value: R/W: 7 FWE —* R 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W
Note: * Determined by the state of the FWE pin.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory programming/erasing.
Bit 7 FWE 0 1 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 6—Software Write Enable Bit (SWE): This bit selects write and erase valid/invalid of the flash memory. Set it when setting bits 5 to 0, bits 7 to 0 of EBR1, and bits 2 to 0 of EBR2.
Bit 6 SWE 0 1 Description Writes disabled Writes enabled [Setting condition] • When FWE = 1 (Initial value)
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit in FLMCR1 to 1. Do not set the SWE, PSU, EV, PV, E, or P bit at the same time.
Bit 5 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit in FLMCR1 to 1. Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 4 PSU 0 1 Description Program setup cleared Program setup [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
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Section 21C ROM (H8S/2635 Group)
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] • When FWE = 1 and SWE = 1 (Initial value)
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] • When FWE = 1, SWE = 1, and ESU = 1 (Initial value)
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] • When FWE = 1, SWE = 1, and PSU = 1 (Initial value)
21C.7.2 Flash Memory Control Register 2 (FLMCR2) FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When on-chip flash memory is disabled, a read will return H'00.
Bit: Initial value: R/W: 7 FLER 0 R 6 — 0 — 5 — 0 — 4 — 0 — 3 — 0 — 2 — 0 — 1 — 0 — 0 — 0 —
Note: FLMCR2 is a read-only register, and should not be written to.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7 FLER 0 Description Flash memory is operating normally (Initial value) Flash memory program/erase protection (error protection) is disabled [Clearing condition] • 1 Reset or hardware standby mode An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] • See section 21C.10.3, Error Protection
Bits 6 to 0—Reserved: These bits always read 0.
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Section 21C ROM (H8S/2635 Group)
21C.7.3 Erase Block Register 1 (EBR1) EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory erase block configuration is shown in table 21C-7.
Bit: Initial value: R/W: 7 EB7 0 R/W 6 EB6 0 R/W 5 EB5 0 R/W 4 EB4 0 R/W 3 EB3 0 R/W 2 EB2 0 R/W 1 EB1 0 R/W 0 EB0 0 R/W
21C.7.4 Erase Block Register 2 (EBR2) EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin. Bit 0 will be initialized to 0 if bit SWE of FLMCR1 is not set, even though a high level is input to pin FWE. When a bit in EBR2 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one of the bits of EBR1 and EBR2 combined can be set. Do not set more than one bit, as this will cause all the bits in both EBR1 and EBR2 to be automatically cleared to 0. On the H8S/2635 bits 7 to 3 are reserved. Only 0 may be written to these reserved bits. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. The flash memory erase block configuration is shown in table 21C-7.
Bit: Initial value: R/W: 7 — 0 R/W 6 — 0 R/W 5 — 0 R/W 4 — 0 R/W 3 — 0 R/W 2 EB10 0 R/W 1 EB9 0 R/W 0 EB8 0 R/W
Note: Bits 7 to 3 are reserved and only 0 may be written to them.
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 21C-7 Flash Memory Erase Blocks
Block (Size) EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) EB8 (32 kbytes) EB9 (64 kbytes) EB10 (64 kbytes) Addresses H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF H'008000 to H'00FFFF H'010000 to H'01FFFF H'020000 to H'02FFFF
21C.7.5 RAM Emulation Register (RAMER) RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating real-time flash memory programming. RAMER initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. RAMER settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 21C-8. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed.
Bit: Initial value: R/W: 7 — 0 R 6 — 0 R 5 — 0 R/W 4 — 0 R/W 3 RAMS 0 R/W 2 RAM2 0 R/W 1 RAM1 0 R/W 0 RAM0 0 R/W
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Section 21C ROM (H8S/2635 Group)
Bits 7 and 6—Reserved: These bits always read 0. Bits 5 and 4—Reserved: Only 0 may be written to these bits. Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory block are program/erase-protected.
Bit 3 RAMS 0 1 Description Emulation not selected Program/erase-protection of all flash memory blocks is disabled Emulation selected Program/erase-protection of all flash memory blocks is enabled (Initial value)
Bits 2 to 0—Flash Memory Area Selection: These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM. (See table 21C-8.) Table 21C-8 Flash Memory Area Divisions
Addresses H'FFD800 to H'FFE7FF H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF Block Name RAM area 4 kbytes EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) RAMS 0 1 1 1 1 1 1 1 1 RAM1 * 0 0 0 0 1 1 1 1 RAM1 * 0 0 1 1 0 0 1 1 RAM0 * 0 1 0 1 0 1 0 1 *: Don't care
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.7.6 Flash Memory Power Control Register (FLPWCR)
Bit: Initial value: R/W: 7 PDWND 0 R/W 6 — 0 R 5 — 0 R 4 — 0 R 3 — 0 R 2 — 0 R 1 — 0 R 0 — 0 R
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI switches to subactive mode. Bit 7—Power-Down Disable (PDWND): The subactive mode is not available in versions other than the U-mask and W-mask versions. Only 0 should be written to this bit in the case of versions other than the U-mask and W-mask versions. See section 21.B.14, Flash Memory and Power-Down States, for more information.
Bit 7 PDWND 0 1 Description Transition to flash memory power-down mode enabled Transition to flash memory power-down mode disabled (Initial value)
Bits 6 to 0—Reserved: These bits always read 0.
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Section 21C ROM (H8S/2635 Group)
21C.8 On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is made to the on-board programming state in which program/erase/verify operations can be performed on the on-chip flash memory. There are two on-board programming modes: boot mode and user program mode. The pin settings for transition to each of these modes are shown in table 21C-9. For a diagram of the transitions to the various flash memory modes, see figure 21C-3. Table 21C-9 Setting On-Board Programming Modes
Mode Boot mode User program mode Expanded mode Single-chip mode Expanded mode Single-chip mode 1 FWE 1 MD2 0 0 1 1 MD1 1 1 1 1 MD0 0 1 0 1
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.8.1 Boot Mode When boot mode is used, the flash memory programming control program must be prepared in the host beforehand. The SCI channel to be used is set to asynchronous mode. When a reset-start is executed after the H8S/2635 Group’s pins have been set to boot mode, the boot program built into the H8S/2635 Group are started and the programming control program prepared in the host is serially transmitted to the H8S/2635 Group via the SCI. In the H8S/2635 Group, the programming control program received via the SCI is written into the programming control program area in on-chip RAM. After the transfer is completed, control branches to the start address of the programming control program area and the programming control program execution state is entered (flash memory programming is performed). The transferred programming control program must therefore include coding that follows the programming algorithm given later. The system configuration in boot mode is shown in figure 21C-7, and the boot mode execution procedure in figure 21C-8.
LSI
Flash memory
Host
Write data reception Verify data transmission
RxD1 SCI1 TxD1 On-chip RAM
Figure 21C-7 System Configuration in Boot Mode
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Section 21C ROM (H8S/2635 Group)
Start Set pins to boot mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate Chip measures low period of H'00 data transmitted by host Chip calculates bit rate and sets value in bit rate register After bit rate adjustment, chip transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, LSI transmits one H'AA data byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte Chip transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units Chip transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM No Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, chip transmits one H'AA data byte to host Execute programming control program transferred to on-chip RAM
n+1→n
n = N?
Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error, and the erase operation and subsequent operations are halted.
Figure 21C-8 Boot Mode Execution Procedure
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Automatic SCI Bit Rate Adjustment
Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit
Low period (9 bits) measured (H'00 data)
High period (1 or more bits)
When boot mode is initiated, the LSI measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1 stop bit, no parity. The LSI calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the LSI. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host’s transmission bit rate and the LSI’s system clock frequency, there will be a discrepancy between the bit rates of the host and the LSI. Set the host transfer bit rate at 4,800, 9,600 or 19,200 bps to operate the SCI properly. Table 21C-10 shows host transfer bit rates and system clock frequencies for which automatic adjustment of the LSI bit rate is possible. The boot program should be executed within this system clock range. Table 21C-10 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is Possible
Host Bit Rate 4,800 bps 9,600 bps 19,200 bps System Clock Frequency for which Automatic Adjustment of LSI Bit Rate Is Possible 4 to 20 MHz 8 to 20 MHz 16 to 20 MHz
Note: The system clock frequency used in boot mode is generated by an external crystal oscillator element. PLL frequency multiplication is not used.
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Section 21C ROM (H8S/2635 Group)
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the programming control program is transferred via the SCI, as shown in figure 21C-9. The boot program area cannot be used until the execution state in boot mode switches to the programming control program transferred from the host.
H'FFE000 Programming control program area (2 kbytes) H'FFE7FF H'FFE800 Boot program area (1.9 kbytes) H'FFEFBF Note: The boot program area cannot be used until a transition is made to the execution state for the programming control program transferred to RAM. Note also that the boot program remains in this area of the on-chip RAM even after control branches to the programming control program.
Figure 21C-9 RAM Areas in Boot Mode Notes on Use of Boot Mode: • When the chip comes out of reset in boot mode, it measures the low-level period of the input at the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes approximately 100 states before the chip is ready to measure the low-level period of the RxD1 pin. • In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. • Interrupts cannot be used while the flash memory is being programmed or erased. • The RxD1 and TxD1 pins should be pulled up on the board.
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
• Before branching to the programming control program (RAM area H'FFE000), the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. The transmit data output pin, TxD1, goes to the high-level output state (P33DDR = 1, P33DR = 1). The contents of the CPU’s internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the programming control program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the programming control program. The initial values of other on-chip registers are not changed. • Boot mode can be entered by making the pin settings shown in table 21C-9 and executing a reset-start. Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting the FWE pin and mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT overflow reset. Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low while the boot program is being executed or while flash memory is being programmed or erased*2. • If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output pins (AS, RD, HWR) will change according to the change in the microcomputer’s operating mode*3. Therefore, care must be taken to make pin settings to prevent these pins from becoming output signal pins during a reset, or to prevent collision with signals outside the microcomputer. Notes: 1. Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS = 4 states) with respect to the reset release timing. 2. For precautions on applying and disconnecting FWE, see section 21C.15, Flash Memory Programming and Erasing Precautions. 3. See appendix D, Pin States. 21C.8.2 User Program Mode When set to user program mode, the chip can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary.
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Section 21C ROM (H8S/2635 Group)
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 6 and 7. The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or erasing, so the control program that performs programming and erasing should be run in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Figure 21C-10 shows the procedure for executing the program/erase control program when transferred to on-chip RAM.
Write the FWE assessment program and transfer program (and the program/erase control program if necessary) beforehand MD2, MD1, MD0 = 110, 111 Reset-start Transfer program/erase control program to RAM Branch to program/erase control program in RAM area FWE = high* Execute program/erase control program (flash memory rewriting) Clear FWE* Branch to flash memory application program Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin only when the flash memory is programmed or erased. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. * For further information on FWE application and disconnection, see section 21B.15, Flash Memory Programming and Erasing Precautions.
Figure 21C-10 User Program Mode Execution Procedure
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.9 Programming/Erasing Flash Memory
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1 for on-chip flash memory. The flash memory cannot be read while it is being written or erased. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. If the program is to be located in external memory, the instruction for writing to flash memory, and the following instruction, should be placed in on-chip RAM. Also ensure that the DTC is not activated before or after execution of the flash memory write instruction. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 24.2.7 and 24.3.7, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if bits SWE, ESU, PSU, EV, PV, E, and P of FLMCR1 are set/reset by a program in flash memory in the corresponding address areas. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming should be performed in the erased state. Do not perform additional programming on previously programmed addresses.
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Section 21C ROM (H8S/2635 Group)
*3 E=1 Erase setup state E=0 Normal mode ESU = 1 ESU = 0 Erase-verify mode Erase mode
*1
FWE = 1
FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0
On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state
*4 P=1 Program setup state P=0 Program mode
PV = 1 PV = 0
Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. 1. : Normal mode : On-board programming mode 2. Do not make a state transition by setting or clearing multiple bits simultaneously. 3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. 4. After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state.
Figure 21C-11 FLMCR1 Bit Settings and State Transitions
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.9.1
Program Mode
When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 21C-12 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) µs. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see “Notes on Program/Program-Verify Procedure.”
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Section 21C ROM (H8S/2635 Group)
21C.9.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 21C-12) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) µs, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE. Notes on Program/Program-Verify Procedure 1. In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the chip, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the chip, the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N).
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Item Wait time after P bit setting Symbol tsp Item When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing* Symbol tsp30 tsp200 tsp10
Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6.
6. The program/program-verify flowchart for the H8S/2638, H8S/2639, and H8S/2630 are shown in figure 21C-12. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM.
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Section 21C ROM (H8S/2635 Group)
Reprogram Data Computation Table
Result of Verify-Read after Write Pulse Application (V) 0 1 0 1 (X) Result of Operation 1 0 1 1
(D) 0 0 1 1
Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed ⎯ Still in erased state: no action
Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed
Additional-Programming Data Computation Table
Result of Verify-Read after Write Pulse (X') Application (V) 0 0 (Y) Result of Operation 0
Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action
0
1
1
1 1
0 1
1 1
Legend: (Y): Data of bits on which additional programming is executed (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop
7. It is necessary to execute additional programming processing during the course of the chip program/program-verify procedure. However, once 128-byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Write pulse application subroutine
Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) μs
Store 128-byte program data in program data area and reprogram data area
Sub-Routine Write Pulse WDT enable Set PSU bit in FLMCR1 Wait (tspsu) μs Set P bit in FLMCR1 Wait (tsp) μs Clear P bit in FLMCR1 Wait (tcp) μs Clear PSU bit in FLMCR1 Wait (tcpsu) μs
Disable WDT
Perform programming in the erased state. Do not perform additional programming on previously programmed addresses.
*7 *4
*7
Start of programming
n=1 m=0
*5*7
End of programming
Write 128-byte data in RAM reprogram data area consecutively to flash memory
*1
Sub-Routine-Call
*7
Write pulse
See Note 6 for pulse width
Set PV bit in FLMCR1 Wait (tspv) μs
H'FF dummy write to verify address
*7
*7
Wait (tspvr) μs End Sub
Increment address Note: 6 Write Pulse Width Number of Writes n Write Time (tsp) μsec Write data = verify data? Read verify data
*7 *2
No m=1 No
n←n+1
1 2 3 4 5 6 7 8 9 10 11 12 13
30 30 30 30 30 30 200 200 200 200 200 200 200
Yes 6≥n?
Yes Additional-programming data computation Transfer additional-programming data to additional-programming data area
Reprogram data computation
*4 *3 *4
Transfer reprogram data to reprogram data area 128-byte data verification completed?
No 998 999 1000 200 200 200
Yes Clear PV bit in FLMCR1 Reprogram Wait (tcpv) μs 6 ≥ n? No
Note: Use a 10 μs write pulse for additional programming.
*7
RAM
Program data storage area (128 bytes)
Yes Successively write 128-byte data from additional1 programming data area in RAM to flash memory * Sub-Routine-Call Write Pulse (Additional programming)
Reprogram data storage area (128 bytes)
m=0? Yes Clear SWE bit in FLMCR1 Wait (tcswe) μs
End of programming
No
n ≥ (N)?
*7
No
Additional-programming data storage area (128 bytes)
Yes Clear SWE bit in FLMCR1
*7
Wait (tcswe) μs
Programming failure
*7
Notes: 1. 2. 3.
4. 5. 7.
Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Verify data is read in 16-bit (word) units. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. A write pulse of 30 μs or 200 μs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 μs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. The wait times and value of N are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Reprogram Data Computation Table
Original Data Verify Data Reprogram Data
Additional-Programming Data Computation Table (X) 1 0 1 1
Still in erased state; no action Comments Programming completed Programming incomplete; reprogram
(D) 0 0 1 1
(V) 0 1 0 1
Reprogram Data (X') 0 0 1 1
Verify Data Additional(V) Programming Data (Y) 0 1 0 1 0 1 1 1
Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed
Figure 21C-12 Program/Program-Verify Flowchart
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Section 21C ROM (H8S/2635 Group)
21C.9.3
Erase Mode
When erasing flash memory, the single-block erase flowchart shown in figure 21C-13 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in section 24.2.7 and 24.3.7, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register 1 and 2 (EBR1, EBR2) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value of about 19.8 ms as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 21C.9.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) µs. If erasing multiple blocks, set a single bit in EBR1/EBR2 for the next block to be erased, and repeat the erase/erase-verify sequence as before.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Start
*1
Set SWE bit in FLMCR1 Wait (tsswe) μs n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) μs Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) μs Clear ESU bit in FLMCR1 Wait (tcesu) μs Disable WDT Set EV bit in FLMCR1 Wait (tsev) μs Set block start address as verify address
*5 *5 *5 *3 *4 *5
Start of erase
*5
Erase halted
*5
n←n+1
H'FF dummy write to verify address Wait (tsevr) μs Increment address Read verify data Verify data = all 1s? OK NG Last address of block? OK Clear EV bit in FLMCR1 Wait (tcev) μs
NG
*4
*5 *2
NG
*5
Clear EV bit in FLMCR1 Wait (tcev) μs
*5
*5
All erase block erased? OK Clear SWE bit in FLMCR1
*5
n ≥ (N)? OK Clear SWE bit in FLMCR1 Wait (tcswe) μs Erase failure
NG
*5
Wait (tcswe) μs End of erasing
Notes: 1. 2. 3. 4. 5.
Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block registers (EBR1 and EBR2). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Figure 21C-13 Erase/Erase-Verify Flowchart
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Section 21C ROM (H8S/2635 Group)
21C.10 Protection
There are three kinds of flash memory program/erase protection: hardware protection, software protection, and error protection. 21C.10.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2), erase block register 1 (EBR1), and erase block register 2 (EBR2). The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained in the error-protected state (See table 21C-11). Table 21C-11 Hardware Protection
Functions Item FWE pin protection Description • Program Erase Yes
Yes When a low level is input to the FWE pin, FLMCR1, FLMCR2, (except bit FLER) EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset (including a WDT reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section. Yes
Reset/standby protection
•
Yes
•
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.10.2 Software Protection Software protection can be implemented by setting the SWE bit in FLMCR1, erase block register 1 (EBR1), erase block register 2 (EBR2), and the RAMS bit in the RAM emulation register (RAMER). When software protection is in effect, setting the P or E bit in flash memory control register 1 (FLMCR1), does not cause a transition to program mode or erase mode (See table 21C-12). Table 21C-12 Software Protection
Functions Item SWE bit protection Description • Program Erase Yes
Setting bit SWE in FLMCR1 to 0 will place Yes area on-chip flash memory in the program/ erase-protected state (Execute the program in the on-chip RAM, external memory). Erase protection can be set for individual blocks by settings in erase block register 1 (EBR1) and erase block register 2 (EBR2). Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Yes Setting the RAMS bit to 1 in the RAM emulation register (RAMER) places all blocks in the program/erase-protected state. —
Block specification protection
•
Yes
• Emulation protection •
Yes
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Section 21C ROM (H8S/2635 Group)
21C.10.3 Error Protection In error protection, an error is detected when chip runaway occurs during flash memory programming/erasing, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the chip malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2 settings are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. FLER bit setting conditions are as follows: 1. When the flash memory of the relevant address area is read during programming/erasing (including vector read and instruction fetch) 2. Immediately after exception handling (excluding a reset) during programming/erasing 3. When a SLEEP instruction (including software standby) is executed during programming/erasing Error protection is released only by a reset and in hardware standby mode.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Figure 21C-14 shows the flash memory state transition diagram.
Program mode Erase mode RD VF PR ER FLER = 0
RES = 0 or HSTBY = 0
Reset or standby (hardware protection) RD VF PR ER FLER = 0
Error occurrence (software standby) Error occurrence
RES = 0 or HSTBY = 0 RES = 0 or HSTBY = 0
FLMCR1, FLMCR2, EBR1, EBR2 initialization state
Error protection mode RD VF PR ER FLER = 1
Software standby mode Software standby mode release
Error protection mode (software standby) RD VF PR ER FLER = 1 FLMCR1, FLMCR2, (except bit FLER) EBR1, EBR2 initialization state
Legend: RD: Memory read possible VF: Verify-read possible PR: Programming possible ER: Erasing possible
RD: VF: PR: ER:
Memory read not possible Verify-read not possible Programming not possible Erasing not possible
Figure 21C-14 Flash Memory State Transitions
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Section 21C ROM (H8S/2635 Group)
21C.11 Flash Memory Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMER setting has been made, accesses cannot be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 21C-15 shows an example of emulation of real-time flash memory programming.
Start of emulation program
Set RAMER
Write tuning data to overlap RAM
Execute application program
No
Tuning OK? Yes Clear RAMER
Write to flash memory emulation block
End of emulation program
Figure 21C-15 Flowchart for Flash Memory Emulation in RAM
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
This area can be accessed from both the RAM area and flash memory area H'00000 H'01000 H'02000 H'03000 H'04000 H'05000 H'06000 H'07000 H'08000 EB1 EB2 EB3 EB4 EB5 EB6 EB7 EB0
Flash memory EB8 to EB10 On-chip RAM
H'FFD800 H'FFE7FF
H'FFEFBF H'2FFFF
H8S/2635
Figure 21C-16 Example of RAM Overlap Operation Example in which Flash Memory Block Area EB0 is Overlapped 1. Set bits RAMS, RAM2 to RAM0 in RAMER to 1, 0, 0, 0, to overlap part of RAM onto the area (EB0) for which real-time programming is required. 2. Real-time programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB0). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in flash memory control register 1 (FLMCR1), will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM.
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Section 21C ROM (H8S/2635 Group)
21C.12 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI interrupt is disabled when flash memory is being programmed or erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. Interrupt during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the interrupt exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If interrupt occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling interrupt, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All requests, including NMI interrupt, must therefore be restricted inside and outside the MCU when programming or erasing flash memory. NMI interrupt is also disabled in the error-protection state while the P or E bit remains set in FLMCR1. Notes: 1. Interrupt requests must be disabled inside and outside the MCU until the programming control program has completed programming. 2. The vector may not be read correctly in this case for the following two reasons: • If flash memory is read while being programmed or erased (while the P or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). If the interrupt entry in the vector table has not been programmed yet, interrupt exception handling will not be executed correctly.
•
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Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.13 Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a socket adapter, just as for a discrete flash memory. Use a PROM programmer that supports the Renesas Electronics's 256-kbyte flash memory on-chip MCU device type (FZTAT256V5A). 21C.13.1 Socket Adapter and Memory Map In programmer mode in which the PROM writer is used, reading from memory (verification), writing, and initializing the flash memory (erasing all of its contents) are enabled. At this time, a dedicated conversion socket adapter must be attached to a general-purpose PROM writer. Table 21C-13 shows the types of the socket adapters. For programmer mode on this LSI, one of the socket adapters listed in table 21C-13 should be used. Table 21C-13
Part No. HD64F2635F
Type of Socket Adapter
Package Type 128 pin QFP (FP-128B) Socket Adapter Type ME2636ESHF1H HF2636Q128D4001 Manufacturer Minato Electronics Inc. Data I/O Japan Corporation
Addresses in MCU mode H'000000
Addresses in programmer mode H'00000
On-chip ROM space 192 kbytes (H8S/2635)
H'02FFFF
H'2FFFF
Figure 21C-17 On-Chip ROM Memory Map
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Section 21C ROM (H8S/2635 Group)
21C.14 Flash Memory and Power-Down States
In addition to its normal operating state, the flash memory has power-down states in which power consumption is reduced by halting part or all of the internal power supply circuitry. There are three flash memory operating states: (1) Normal operating mode: The flash memory can be read and written to. (2) Power-down mode: Part of the power supply circuitry is halted, and the flash memory can be read when the LSI is operating on the subclock. (3) Standby mode: All flash memory circuits are halted, and the flash memory cannot be read or written to. States (2) and (3) are flash memory power-down states. Table 21C-14 shows the correspondence between the operating states of the LSI and the flash memory. Table 21C-14 Flash Memory Operating States
Flash Memory Operating State Normal mode (read/write)
LSI Operating State High-speed mode Medium-speed mode Sleep mode Subactive mode Subsleep mode Watch mode Software standby mode Hardware standby mode
When PDWND = 0: Power-down mode (read-only) When PDWND = 1: Normal mode (read-only) Standby mode
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.14.1 Notes on Power-Down States 1. When the flash memory is in a power-down state, part or all of the internal power supply circuitry is halted. Therefore, a power supply circuit stabilization period must be provided when returning to normal operation. When the flash memory returns to its normal operating state from a power-down state, bits STS2 to STS0 in SBYCR must be set to provide a wait time of at least 20 µs (power supply stabilization time), even if an oscillation stabilization period is not necessary. 2. In a power-down state, FLMCR1, FLMCR2, EBR1, EBR2, RAMER, and FLPWCR cannot be read from or written to.
21C.15 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and programmer mode are summarized below. Use the specified voltages and timing for programming and erasing: Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Renesas microcomputer device type* with 256-kbyte on-chip flash memory. Only use the specified socket adapter. Failure to observe these points may result in damage to the device. Note: * The H8S/2635 is Renesas Electronics microcomputer devices with 256 kbytes of on-chip flash memory. (The H8S/2635 has 192 kbytes of PROM. The area from H'30000 to H'3FFFF should be programmed as H'FF.) Powering on and off (see figures 21C-18 to 21C-20): Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery.
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Section 21C ROM (H8S/2635 Group)
FWE application/disconnection (see figures 21C-18 to 21C-20): FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: • Apply FWE when the VCC voltage has stabilized within its rated voltage range. Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization time). • In boot mode, apply and disconnect FWE during a reset. • In user program mode, FWE can be switched between high and low level regardless of the reset state. FWE input can also be switched during execution of a program in flash memory. • Do not apply FWE if program runaway has occurred. • Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when applying or disconnecting FWE. Do not apply a constant high level to the FWE pin: Apply a high level to the FWE pin only when programming or erasing flash memory. A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. Use the recommended algorithm when programming and erasing flash memory: The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the P or E bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Do not set or clear the SWE bit during execution of a program in flash memory: Wait for at least 100 µs after clearing the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1, flash memory can only be read in program-verify or erase-verify mode. Access flash memory only for verify operations (verification during programming/erasing). Also, do not clear the SWE bit during programming, erasing, or verifying. Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. Do not use interrupts while flash memory is being programmed or erased: All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations. Do not perform additional programming. Erase the memory before reprogramming: In onboard programming, perform only one programming operation on a 128-byte programming unit block. In programmer mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. Before programming, check that the chip is correctly mounted in the PROM programmer: Overcurrent damage to the device can result if the index marks on the PROM programmer socket, socket adapter, and chip are not correctly aligned. Do not touch the socket adapter or chip during programming: Touching either of these can cause contact faults and write errors.
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Section 21C ROM (H8S/2635 Group)
Wait time: x
Programming/ erasing possible Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs
FWE
tMDS*3
Min. 0 μs
MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21C-18 Power-On/Off Timing (Boot Mode)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Wait time: x
Programming/ erasing possible Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs
FWE
MD2 to MD0*1 tMDS*3 RES SWE set SWE bit SWE cleared
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. 2. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics. 3. Mode programming setup time tMDS (min.) = 200 ns
Figure 21C-19 Power-On/Off Timing (User Program Mode)
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Section 21C ROM (H8S/2635 Group)
Wait time: x Programming/erasing possible
Wait time: x Programming/erasing possible Wait time: 100 μs
Wait time: x Programming/erasing possible Wait time: 100 μs
Programming/erasing possible
Wait time: 100 μs
φ tOSC1 VCC Min. 0 μs FWE tMDS tMDS*2
MD2 to MD0 tMDS tRESW RES SWE set Mode change*1 Boot mode SWE cleared Mode User change*1 mode User program mode User mode User program mode
SWE bit
Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. 2. When making a transition from boot mode to another mode, a mode programming setup time tMDS (min.) of 200 ns is necessary with respect to RES clearance timing. 3. See section 24.2.7, 24.3.7, and 24.4.7, Flash Memory Characteristics.
Figure 21C-20 Mode Transition Timing (Example: Boot Mode → User Mode ↔ User Program Mode)
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Wait time: x
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Wait time: 100 μs
Section 21C ROM (H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
21C.16 Note on Switching from F-ZTAT Version to Mask ROM Version
The mask ROM version does not have the internal registers for flash memory control that are provided in the F-ZTAT version. Table 21C-15 lists the registers that are present in the F-ZTAT version but not in the mask ROM version. If a register listed in table 21C-15 is read in the mask ROM version, an undefined value will be returned. Therefore, if application software developed on the F-ZTAT version is switched to a mask ROM version product, it must be modified to ensure that the registers in table 21C-15 have no effect. Table 21C-15
Register Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM emulation register
Registers Present in F-ZTAT Version but Absent in Mask ROM Version
Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 RAMER Address H'FFA8 H'FFA9 H'FFAA H'FFAB H'FEDB
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
22A.1 Overview
The chip has a built-in clock pulse generator (CPG) that generates the system clock (φ), the bus master clock, and internal clocks. The clock pulse generator consists of an oscillator, PLL (phase-locked loop) circuit, clock selection circuit, medium-speed clock divider, bus master clock selection circuit, subclock oscillator, and waveform shaping circuit. The frequency can be changed by means of the PLL circuit in the CPG. Frequency changes are performed by software by means of settings in the system clock control register (SCKCR) and low-power control register (LPWRCR). 22A.1.1 Block Diagram Figure 22A-1 shows a block diagram of the clock pulse generator.
LPWRCR STC1, STC0
SCKCR SCK2 to SCK0
EXTAL XTAL
System clock oscillator
PLL circuit (×1, ×2, ×4) Clock selection circuit φSUB
Mediumspeed clock divider
φ/2 to φ/32
Bus master clock selection circuit
φ
OSC1* OSC2*
Subclock oscillator
Waveform Generation Circuit
System clock Internal clock to to φ pin supporting modules
Bus master clock to CPU and DTC
WDT1 count clock Legend: LPWRCR: Low-power control register SCKCR: System clock control register Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2.
Figure 22A-1 Block Diagram of Clock Pulse Generator
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
22A.1.2 Register Configuration The clock pulse generator is controlled by SCKCR and LPWRCR. Table 22A-1 shows the register configuration. Table 22A-1 Clock Pulse Generator Register
Name System clock control register Low-power control register Abbreviation SCKCR LPWRCR R/W R/W R/W Initial Value H'00 H'00 Address* H'FDE6 H'FDEC
Note:* Lower 16 bits of the address.
22A.2 Register Descriptions
22A.2.1 System Clock Control Register (SCKCR)
Bit : 7 PSTOP Initial value: R/W : 0 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 STCS 0 R/W 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
SCKCR is an 8-bit readable/writable register that performs φ clock output control and mediumspeed mode control, selection of operation when the PLL circuit frequency multiplication factor is changed, and medium-speed mode control. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—φ Clock Output Disable (PSTOP): In combination with the DDR of the applicable port, this bit controls φ output. See section 23A.8, 23B.12, φ Clock Output Disable Function for details.
Description Bit 7 PSTOP 0 1 Normal Operating State φ output (initial value) Fixed high Software Standby Mode Fixed high Fixed high Hardware Standby Mode High impedance High impedance
Sleep Mode φ output Fixed high
Bits 6 to 4—Reserved: These bits are always read as 0 and cannot be modified.
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
Bit 3—Frequency Multiplication Factor Switching Mode Select (STCS): Selects the operation when the PLL circuit frequency multiplication factor is changed.
Bit 3 STCS 0 1 Description Specified multiplication factor is valid after transition to software standby mode, watch mode*, and subactive mode* (Initial value) Specified multiplication factor is valid immediately after STC bits are rewritten
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions.
Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): These bits select the bus master clock.
Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master is in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
22A.2.2 Low-Power Control Register (LPWRCR)
Bit Initial value Read/Write 7 DTON 0 R/W 6 LSON 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 ⎯ 0 R/W 1 STC1 0 R/W 0 STC0 0 R/W
NESEL SUBSTP RFCUT
LPWRCR is an 8-bit readable/writable register that performs power-down mode control. The following pertains to bits 1 and 0. For details of the other bits, see section 23A.2.3, 23B.2.3, Low Power Control Register (LPWRCR). LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bits 1 and 0—Frequency Multiplication Factor (STC1, STC0): The STC bits specify the frequency multiplication factor of the PLL circuit.
Bit 1 STC1 0 1 Bit 0 STC0 0 1 0 1 Description ×1 ×2 ×4 Setting prohibited (Initial value)
Note: The multiplication factor should be set so that the clock frequency following multiplication does not exceed the maximum operating frequency of the LSI. It is possible to reduce power consumption and noise by using a setting of PLL ×4 for this function and lowering the external clock frequency.
22A.3 Oscillator
Clock pulses may be supplied either by connecting a crystal oscillator or inputting an external clock. In the latter case, the input clock frequency should be between 4 MHz and 20 MHz. 22A.3.1 Connecting a Crystal Resonator Circuit Configuration: A crystal resonator can be connected as shown in the example in figure 22A-2. Select the damping resistance Rd according to table 22A-2. An AT-cut parallel-resonance crystal should be used.
CL1 EXTAL XTAL Rd CL2 CL1 = CL2 = 10 to 22pF
Figure 22A-2 Connection of Crystal Resonator (Example) Table 22A-2 Damping Resistance Value
Frequency (MHz) Rd (Ω) 4 500 8 200 12 0 16 0 20 0
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
Crystal Resonator: Figure 22A-3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has the characteristics shown in table 22A-3. The crystal resonator frequency should not exceed 20 MHz.
CL L XTAL Rs EXTAL AT-cut parallel-resonance type
C0
Figure 22A-3 Crystal Resonator Equivalent Circuit Table 22A-3 Crystal Resonator Parameters
Frequency (MHz) RS max (Ω) C0 max (pF) 4 120 7 8 80 7 12 60 7 16 50 7 20 40 7
Note on Board Design: When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 22A-4. When designing the board, place the crystal resonator and its load capacitors as close as possible to the XTAL and EXTAL pins.
Avoid CL2 XTAL EXTAL CL1 Signal A Signal B Chip
Figure 22A-4 Example of Incorrect Board Design
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
External circuitry such as that shown below is recommended around the PLL.
R1: 3 kΩ PLLCAP
C1: 470 pF
PLLVSS
VCC CB: 0.1 μF* VSS
(Values are preliminary recommended values.) Note: * CB is laminated ceramic capacitors.
Figure 22A-5 Points for Attention when Using PLL Oscillation Circuit Place oscillation stabilization capacitor C1 and resistor R1 close to the PLLCAP pin, and ensure that no other signal lines cross this line. Supply the C1 ground from PLLVSS. Separate PLLVSS from the other VCC and VSS lines at the board power supply source, and be sure to insert bypass capacitors CB close to the pins.
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
22A.3.2 External Clock Input Circuit Configuration An external clock signal can be input as shown in the examples in figure 22A-6. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF. In example (b), make sure that the external clock is held high in standby mode. In this case, the input clock frequency should be between 4 MHz and 20 MHz.
EXTAL XTAL Open
External clock input
(a) XTAL pin left open
EXTAL XTAL
External clock input
(b) Complementary clock input at XTAL pin
Figure 22A-6 External Clock Input (Examples)
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
External Clock Table 22A-4 and figure 22A-7 show the input conditions for the external clock. Table 22A-4 External Clock Input Conditions
VCC = 5.0 V ±10% Item External clock input low pulse width External clock input high pulse width External clock rise time External clock fall time Symbol tEXL tEXH tEXr tEXf Min. 15 15 — — Max. — — 5 5 Unit ns ns ns ns Test Conditions Figure 22A-7
tEXH
tEXL
EXTAL
VCC × 0.5
tEXr
tEXf
Figure 22A-7 External Clock Input Timing
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
22A.4 PLL Circuit
The PLL circuit has the function of multiplying the frequency of the clock from the oscillator by a factor of 1, 2, or 4. The multiplication factor is set with the STC bits in SCKCR. The phase of the rising edge of the internal clock is controlled so as to match that at the EXTAL pin. When the multiplication factor of the PLL circuit is changed, the operation varies according to the setting of the STCS bit in SCKCR. When STCS = 0 (initial value), the setting becomes valid after a transition to software standby mode, watch mode*, or subactive mode*. The transition time count is performed in accordance with the setting of bits STS2 to STS0 in SBYCR. [1] The initial PLL circuit multiplication factor is 1. [2] A value is set in bits STS2 to STS0 to give the specified transition time. [3] The target value is set in STC1 and STC0, and a transition is made to software standby mode, watch mode*, or subactive mode*. [4] The clock pulse generator stops and the value set in STC1 and STC0 becomes valid. [5] Software standby mode, watch mode*, or subactive mode* is cleared, and a transition time is secured in accordance with the setting in STS2 to STS0. [6] After the set transition time has elapsed, the LSI resumes operation using the target multiplication factor. If a PC break is set for the SLEEP instruction that causes a transition to software standby mode in [1], software standby mode is entered and break exception handling is executed after the oscillation stabilization time. In this case, the instruction following the SLEEP instruction is executed after execution of the RTE instruction. When STCS = 1, the LSI operates on the changed multiplication factor immediately after bits STC1 and STC0 are rewritten. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions.
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
22A.5 Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and φ/32.
22A.6 Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the system clock (φ) or one of the medium-speed clocks (φ/2, φ/4, or φ/8, φ/16, and φ/32) to be supplied to the bus master, according to the settings of the SCK2 to SCK0 bits in SCKCR.
22A.7 Subclock Oscillator
Connecting 32.768kHz Quartz Oscillator (U Mask, W Mask): To supply a clock to the subclock divider, connect a 32.768kHz quartz oscillator, as shown in figure 22A-8. See section 22A.3.1, “Notes on Board Design” for notes on connecting quartz oscillators.
C1 OSC1
C2 OSC2 C1=C2=15pF (typ)
Figure 22A-8 Example Connection of 32.768kHz Quartz Oscillator Figure 22A-9 shows the equivalence circuit for a 32.768kHz oscillator.
Ls Cs Rs
OSC1 Co
OSC2 Cs = 1.5 pF (typ.) Rs = 14 kΩ (typ.) fw = 32.768 kHz
Figure 22A-9 Equivalence Circuit for 32.768kHz Oscillator
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
Handling Pins when Subclock not Required: If no subclock is required, connect the OSC1 pin to VSS and leave OSC2 open, as shown in figure 22A-10.
OSC1
OSC2
Open
Figure 22A-10 Pin Handling when Subclock not Required
22A.8 Subclock Waveform Generation Circuit
To eliminate noise from the subclock input to OSCI, the subclock is sampled using the dividing clock φ. The sampling frequency is set using the NESEL bit of LPWRCR. For details, see section 23A.2.3, 23B.2.3, Low Power Control Register (LPWRCR). No sampling is performed in subactive mode*, subsleep mode*, or watch mode*. Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions only. These functions cannot be used with the other versions.
22A.9 Note on Crystal Resonator
Since various characteristics related to the crystal resonator are closely linked to the user’s board design, thorough evaluation is necessary on the user’s part, for both the mask versions and F-ZTAT versions, using the resonator connection examples shown in this section as a guide. As the resonator circuit ratings will depend on the floating capacitance of the resonator and the mounting circuit, the ratings should be determined in consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the maximum rating is not applied to the oscillator pin.
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Section 22A Clock Pulse Generator (H8S/2636 Group, H8S/2638 Group, H8S/2630 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
22B.1 Overview
The chip has a built-in clock pulse generator (CPG) that generates the system clock (φ), the bus master clock, and internal clocks. The clock pulse generator consists of an oscillator, PLL (phase-locked loop) circuit, system clock selection circuit, medium-speed clock divider, bus master clock selection circuit, and subclock divider. The frequency can be changed by means of the PLL circuit in the CPG. Frequency changes are performed by software by means of settings in the system clock control register (SCKCR) and low-power control register (LPWRCR). 22B.1.1 Block Diagram Figure 22B-1 shows a block diagram of the clock pulse generator.
LPWRCR STC1, STC0
SCKCR SCK2 to SCK0
EXTAL Clock oscillator XTAL
PLL circuit (×1, ×2, ×4) System clock selection circuit φSUB
Mediumspeed clock divider
φ/2 to φ/32
Bus master clock selection circuit
φ
Subclock divider (1/128) System clock Internal clock to to φ pin supporting modules Bus master clock to CPU and DTC
WDT1 count clock Legend: LPWRCR: Low-power control register SCKCR: System clock control register
Figure 22B-1 Block Diagram of Clock Pulse Generator
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
22B.1.2 Register Configuration The clock pulse generator is controlled by SCKCR and LPWRCR. Table 22B-1 shows the register configuration. Table 22B-1 Clock Pulse Generator Register
Name System clock control register Low-power control register Abbreviation SCKCR LPWRCR R/W R/W R/W Initial Value H'00 H'00 Address* H'FDE6 H'FDEC
Note:* Lower 16 bits of the address.
22B.2 Register Descriptions
22B.2.1 System Clock Control Register (SCKCR)
Bit : 7 PSTOP Initial value: R/W : 0 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 STCS 0 R/W 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
SCKCR is an 8-bit readable/writable register that performs φ clock output control and mediumspeed mode control, selection of operation when the PLL circuit frequency multiplication factor is changed, and medium-speed mode control. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—φ Clock Output Disable (PSTOP): In combination with the DDR of the applicable port, this bit controls φ output. See section 23B.12, φ Clock Output Disable Function for details.
Description Bit 7 PSTOP 0 1 Normal Operating State φ output (initial value) Fixed high Software Standby Mode Fixed high Fixed high Hardware Standby Mode High impedance High impedance
Sleep Mode φ output Fixed high
Bits 6 to 4—Reserved: These bits are always read as 0 and cannot be modified.
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
Bit 3—Frequency Multiplication Factor Switching Mode Select (STCS): Selects the operation when the PLL circuit frequency multiplication factor is changed.
Bit 3 STCS 0 1 Description Specified multiplication factor is valid after transition to software standby mode, watch mode, and subactive mode (Initial value) Specified multiplication factor is valid immediately after STC bits are rewritten
Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): These bits select the bus master clock.
Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master is in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
22B.2.2 Low-Power Control Register (LPWRCR)
Bit : 7 DTON Initial value : R/W : 0 R/W 6 LSON 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 ⎯ 0 R/W 1 STC1 0 R/W 0 STC0 0 R/W
NESEL SUBSTP RFCUT
LPWRCR is an 8-bit readable/writable register that performs power-down mode control. The following pertains to bits 1 and 0. For details of the other bits, see section 23B.2.3, Low Power Control Register (LPWRCR). LPWRCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bits 1 and 0—Frequency Multiplication Factor (STC1, STC0): The STC bits specify the frequency multiplication factor of the PLL circuit.
Bit 1 STC1 0 1 Bit 0 STC0 0 1 0 1 Description ×1 ×2 ×4 Setting prohibited (Initial value)
Note: A system clock frequency multiplied by the multiplication factor (STC1 and STC0) should not exceed the maximum operating frequency defined in section 24, Electrical Characteristics.
22B.3 Oscillator
Clock pulses may be supplied either by connecting a crystal oscillator or inputting an external clock. In the latter case, the input clock frequency should be between 4 MHz and 5 MHz. 22B.3.1 Connecting a Crystal Resonator Circuit Configuration: A crystal resonator can be connected as shown in the example in figure 22B-2. Select the damping resistance Rd according to table 22B-2. An AT-cut parallel-resonance crystal should be used.
CL1 EXTAL XTAL Rd CL2 CL1 = CL2 = 10 to 22pF
Figure 22B-2 Connection of Crystal Resonator (Example) Table 22B-2 Damping Resistance Value
Frequency (MHz) Rd (Ω) 4 500 5 200
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
Crystal Resonator: Figure 22B-3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has the characteristics shown in table 18-3. The crystal resonator frequency should not exceed 5 MHz.
CL L XTAL Rs EXTAL AT-cut parallel-resonance type
C0
Figure 22B-3 Crystal Resonator Equivalent Circuit Table 22B-3 Crystal Resonator Parameters
Frequency (MHz) RS max (Ω) C0 max (pF) 4 120 7 5 80 7
Note on Board Design: When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 22B-4. When designing the board, place the crystal resonator and its load capacitors as close as possible to the XTAL and EXTAL pins.
Avoid CL2 XTAL EXTAL CL1 Signal A Signal B Chip
Figure 22B-4 Example of Incorrect Board Design
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
External circuitry such as that shown below is recommended around the PLL.
R1: 3 kΩ PLLCAP
C1: 470 pF
PLLVSS
VCC CB: 0.1 μF* VSS
(Values are preliminary recommended values.) Note: * CB is laminated ceramic capacitors.
Figure 22B-5 Points for Attention when Using PLL Oscillation Circuit Place oscillation stabilization capacitor C1 and resistor R1 close to the PLLCAP pin, and ensure that no other signal lines cross this line. Supply the C1 ground from PLLVSS. Separate PLLVSS from the other VCC and VSS lines at the board power supply source, and be sure to insert bypass capacitors CB close to the pins.
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
22B.3.2 External Clock Input Circuit Configuration An external clock signal can be input as shown in the examples in figure 22B-6. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF. In example (b), make sure that the external clock is held high in standby mode. In this case, the input clock frequency should be between 4 MHz and 5 MHz.
EXTAL XTAL Open
External clock input
(a) XTAL pin left open
EXTAL XTAL
External clock input
(b) Complementary clock input at XTAL pin* Note: * In the case of the H8S/2635 Group, do not input a complementary clock to the XTAL pin.
Figure 22B-6 External Clock Input (Examples)
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
External Clock Table 22B-4 and figure 22B-7 show the input conditions for the external clock. Table 22B-4 External Clock Input Conditions
VCC = 5.0 V ±10% Item External clock input low pulse width External clock input high pulse width External clock rise time External clock fall time Symbol tEXL tEXH tEXr tEXf Min. 50 50 — — Max. — — 5 5 Unit ns ns ns ns Test Conditions Figure 22B-7
tEXH
tEXL
EXTAL
VCC × 0.5
tEXr
tEXf
Figure 22B-7 External Clock Input Timing
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
22B.4 PLL Circuit
The PLL circuit has the function of multiplying the frequency of the clock from the oscillator by a factor of 1, 2, or 4. The multiplication factor is set with the STC bits in SCKCR. The phase of the rising edge of the internal clock is controlled so as to match that at the EXTAL pin. When the multiplication factor of the PLL circuit is changed, the operation varies according to the setting of the STCS bit in SCKCR. When STCS = 0 (initial value), the setting becomes valid after a transition to software standby mode, watch mode, or subactive mode. The transition time count is performed in accordance with the setting of bits STS2 to STS0 in SBYCR. [1] The initial PLL circuit multiplication factor is 1. [2] A value is set in bits STS2 to STS0 to give the specified transition time. [3] The target value is set in STC1 and STC0, and a transition is made to software standby mode, watch mode, or subactive mode. [4] The clock pulse generator stops and the value set in STC1 and STC0 becomes valid. [5] Software standby mode, watch mode, or subactive mode is cleared, and a transition time is secured in accordance with the setting in STS2 to STS0. [6] After the set transition time has elapsed, the LSI resumes operation using the target multiplication factor. If a PC break is set for the SLEEP instruction that causes a transition to software standby mode in [1], software standby mode is entered and break exception handling is executed after the oscillation stabilization time. In this case, the instruction following the SLEEP instruction is executed after execution of the RTE instruction. When STCS = 1, the LSI operates on the changed multiplication factor immediately after bits STC1 and STC0 are rewritten.
22B.5 Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and φ/32.
22B.6 Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the system clock (φ) or one of the medium-speed clocks (φ/2, φ/4, or φ/8, φ/16, and φ/32) to be supplied to the bus master, according to the settings of the SCK2 to SCK0 bits in SCKCR.
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Section 22B Clock Pulse Generator (H8S/2639 Group, H8S/2635 Group)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
22B.7 Subclock Divider
The subclock divider divides the input clock into 1/128 to generate φSUB.
22B.8 Note on Resonator
Since various characteristics related to the resonator are closely linked to the user’s board design, thorough evaluation is necessary on the user’s part, for both the mask versions and F-ZTAT versions, using the resonator connection examples shown in this section as a guide. As the resonator circuit ratings will depend on the floating capacitance of the resonator and the mounting circuit, the ratings should be determined in consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the maximum rating is not applied to the oscillator pin.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Subclock functions are not available in the HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, and HD6432630F.
23A.1 Overview
In addition to the normal program execution state, the chip has nine power-down modes in which operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU, on-chip supporting modules, and so on. The chip operating modes are as follows: (1) High-speed mode (2) Medium-speed mode (3) Sleep mode (4) Module stop mode (5) Software standby mode (6) Hardware standby mode (2) to (6) are low power dissipation states. Sleep mode is CPU states, medium-speed mode is a CPU and bus master state, and module stop mode is an internal peripheral function (including bus masters other than the CPU) state. Some of these states can be combined. After a reset, the LSI is in high-speed mode with modules other than the DTC in module stop mode. Notes: 1. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group. These functions cannot be used with the other versions. 2. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2 when not used.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 23A-1 shows the internal state of the LSI in the respective modes. Table 23A-2 shows the conditions for shifting between the low power dissipation modes. Figure 23A-1 is a mode transition diagram. Table 23A-1 LSI Internal States in Each Mode
Function System clock pulse generator CPU Instructions Registers NMI IRQ0 to IRQ5 WDT1 W DT0 DTC PBC TPU PPG D/A0, 1 SCI0 SCI1 SCI2 PWM A/D RAM I/O HCAN Functioning Functioning Functioning Functioning Functioning Functioning Functioning (DTC) Functioning Functioning Functioning Functioning Halted (reset) Retained Retained Halted (reset) Retained High impedance Halted (reset) Functioning Functioning Functioning Halted (reset) Halted (reset) Halted (reset) Functioning Functioning Functioning Functioning Functioning Functioning Functioning Functioning Functioning ⎯ ⎯ Halted (retained) Halted (retained) Halted (retained) Halted (retained) Halted (retained) Halted (retained) Halted (retained) Halted (retained) Halted (reset) Halted (reset) Halted (reset) Halted (reset) Halted (reset) HighSpeed Functioning Functioning MediumSpeed Functioning Sleep Functioning Module Stop Functioning Software Standby Halted Hardware Standby Halted Halted (undefined) Halted
Medium-speed Halted operation (retained) Functioning Functioning
High/medium- Halted speed (retained) operation Functioning Functioning
External interrupts Peripheral functions
Functioning
Medium-speed Functioning operation Medium-speed Functioning operation Functioning Functioning
Note: “Halted (retained)” means that internal register values are retained. The internal state is “operation suspended.” “Halted (reset)” means that internal register values and internal states are initialized. In module stop mode, only modules for which a stop setting has been made are halted (reset or retained).
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Program-halted state STBY pin = Low Reset state Hardware standby mode
STBY pin = High RES pin = Low
RES pin = High Program execution state SLEEP command High-speed mode (main clock) All interrupt SCK2 to SCK0 = 0 SCK2 to SCK0 ≠ 0 SLEEP command SSBY = 1, PSS = 0, LSON = 0 Software standby mode SSBY = 0, LSON = 0 Sleep mode (main clock)
Medium-speed mode (main clock)
External interrupt *
: Transition after exception processing
: Low power dissipation mode
Note: When a transition is made between modes by means of an interrupt, the transition cannot be made on interrupt source generation alone. Ensure that interrupt handling is performed after accepting the interrupt request. From any state except hardware standby mode, a transition to the reset state occurs when RES is driven low. From any state, a transition to hardware standby mode occurs when STBY is driven low. * NMI and IRQ0 to IRQ5
Figure 23A-1 Mode Transition Diagram
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 23A.2 Low Power Dissipation Mode Transition Conditions
Status of Control Bit at Transition State after Transition Back from Low Power Mode Invoked by Interrupt High-speed/Mediumspeed — High-speed/Mediumspeed — — — — — — — — — High-speed — — —
Pre-Transition State SSBY PSS High-speed/ Medium-speed 0 0 1 1 1 1 1 1 Subactive 0 0 0 1 1 1 1 1 Legend: *: Don’t care —: Do not set * * 0 0 1 1 1 1 0 1 1 0 1 1 1 1
State after Transition Invoked by SLEEP LSON DTON Command 0 1 0 1 0 1 0 1 * 0 1 * 0 1 0 1 * * * * 0 0 1 1 * * * * 0 0 1 1 Sleep — Software standby — — — — — — — — — — — High-speed —
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
23A.1.1 Register Configuration Power-down modes are controlled by the SBYCR, SCKCR, LPWRCR, TCSR (WDT1), and MSTPCR registers. Table 23A-3 summarizes these registers. Table 23A-3 Power-Down Mode Registers
Name Standby control register System clock control register Low-power control register Timer control/status register Module stop control register A, B, C, D Abbreviation SBYCR SCKCR LPWRCR TCSR MSTPCRA MSTPCRB MSTPCRC MSTPCRD Note: 1. Lower 16 bits of the address. R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value H'58 H'00 H'00 H'00 H'3F H'FF H'FF B'11****** Address* H'FDE4 H'FDE6 H'FDEC H'FFA2 H'FDE8 H'FDE9 H'FDEA H'FC60
1
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.2 Register Descriptions
23A.2.1 Standby Control Register (SBYCR)
Bit : 7 SSBY Initial value : R/W : 0 R/W 6 STS2 1 R/W 5 STS1 0 R/W 4 STS0 1 R/W 3 OPE 1 R/W 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯ 0 ⎯ 0 ⎯
SBYCR is an 8-bit readable/writable register that performs power-down mode control. SBYCR is initialized to H'58 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Software Standby (SSBY): When making a low power dissipation mode transition by executing the SLEEP instruction, the operating mode is determined in combination with other control bits. Note that the value of the SSBY bit does not change even when shifting between modes using interrupts.
Bit 7 SSBY 0 1 Description Shifts to sleep mode when the SLEEP instruction is executed in high-speed mode or medium-speed mode. (Initial value) Shifts to software standby mode when the SLEEP instruction is executed in highspeed mode or medium-speed mode.
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the MCU wait time for clock stabilization when shifting to high-speed mode or medium-speed mode by using a specific interrupt or command to cancel software standby mode. With a quartz oscillator (Table 23A-5), select a wait time of 8ms (oscillation stabilization time) or more, depending on the operating frequency. With an external clock, select a standby time of 2 ms or more (PLL oscillator settling time), based on the operating frequency.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Bit 6 STS2 0
Bit 5 STS1 0 1
Bit 4 STS0 0 1 0 1 0 1 0 1 Description Standby time = 8192 states Standby time = 16384 states Standby time = 32768 states Standby time = 65536 states Standby time = 131072 states Standby time = 262144 states Reserved Standby time = 16 states (Setting prohibited) (Initial value)
1
0 1
Bit 3—Output Port Enable (OPE): This bit specifies whether the output of the address bus and bus control signals (AS, RD, HWR, LWR) is retained or set to high-impedance state in the software standby mode.
Bit 3 OPE 0 1 Description In software standby mode, address bus and bus control signals are high-impedance. In software standby mode, the output state of the address bus and bus control signals is retained. (Initial value)
Bits 2 to 0—Reserved: These bits always return 0 when read, and cannot be written to. 23A.2.2 System Clock Control Register (SCKCR)
Bit : 7 PSTOP Initial value : R/W : 0 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 STCS 0 R/W 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
SCKCR is an 8-bit readable/writable register that performs φ clock output control and mediumspeed mode control. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 7—φ Clock Output Disable (PSTOP): In combination with the DDR of the applicable port, this bit controls φ output. See section 23A.8, φ Clock Output Disable Function for details.
Description Bit 7 PSTOP 0 1 High-Speed Mode, Medium-Speed Mode φ output (initial value) Fixed high Software Standby Mode Fixed high Fixed high Hardware Standby Mode High impedance High impedance
Sleep Mode φ output Fixed high
Bits 6 to 4—Reserved: These bits are always read as 0 and cannot be modified. Bit 3—Frequency Multiplication Factor Switching Mode Select (STCS): Selects the operation when the PLL circuit frequency multiplication factor is changed.
Bit 3 STCS 0 1 Description Specified multiplication factor is valid after transition to software standby mode (Initial value) Specified multiplication factor is valid immediately after STC bits are rewritten
Bits 2 to 0—System Clock Select (SCK2 to SCK0): These bits select the bus master clock in high-speed mode, and medium-speed mode.
Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
23A.2.3 Low-Power Control Register (LPWRCR)
Bit : 7 DTON Initial value : R/W : 0 R/W 6 LSON 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 ⎯ 0 R/W 1 STC1 0 R/W 0 STC0 0 R/W
NESEL SUBSTP RFCUT
The LPWRCR is an 8-bit read/write register that controls the low power dissipation modes. The LPWRCR is initialized to H'00 at a reset and when in hardware standby mode. It is not initialized in software standby mode. The following describes bits 7 to 2. For details of other bits, see section 22A.2.2, Low-Power Control Register (LPWRCR). Bits 7 to 3—Reserved: Bits DTON, LSON, NESEL, SUBSTP and RFCUT must always be written with 0, as this version does not support subclock operation. Bit 2—Reserved: Only write 0 to this bit. 23A.2.4 Timer Control/Status Register (TCSR)
Bit : 7 OVF Initial value : R/W : 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 PSS 0 R/W 3 RST/NMI 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
Note: * Only write 0 to clear the flag.
TCSR is an 8-bit read/write register that selects the clock input to WDT1 TCNT and the mode. Here, we describe bit 4. For details of the other bits in this register, see section 12.2.2, Timer Control/Status Register (TCSR). The TCSR is initialized to H'00 at a reset and when in hardware standby mode. It is not initialized in software standby mode. Bit 4—Reserved: The PSS bit must always be written with 0 since no subclock functions are available in versions other than the U-mask and W-mask versions.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.2.5 Module Stop Control Register (MSTPCR)
MSTPCRA Bit : 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPA7 MSTPA6 MSTPA5 MSTPA4 MSTPA3 MSTPA2 MSTPA1 MSTPA0 Initial value : R/W MSTPCRB Bit : 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPB7 MSTPB6 MSTPB5 MSTPB4 MSTPB3 MSTPB2 MSTPB1 MSTPB0 Initial value : R/W MSTPCRC Bit : 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPC7 MSTPC6 MSTPC5 MSTPC4 MSTPC3 MSTPC2 MSTPC1 MSTPC0 Initial value : R/W : : :
MSTPCRD Bit : 7 1 R/W 6 1 R/W 5 4 3 2 1 0 MSTPD7 MSTPD6 MSTPD5 MSTPD4 MSTPD3 MSTPD2 MSTPD1 MSTPD0 Initial value : R/W :
Undefined Undefined Undefined Undefined Undefined Undefined
—
—
—
—
—
—
MSTPCR, comprising four 8-bit readable/writable registers, performs module stop mode control. MSTPCRA to MSTPCRC are initialized to H'3FFFFF by a reset and in hardware standby mode. MSTPCRD is initialized to B'11****** by a reset and in hardware standby mode. They are not initialized in software standby mode.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
MSTPCRA/MSTPCRB/MSTPCRC Bits 7 to 0, MSTPCRD Bits 7 and 6—Module Stop (MSTPA7 to MSTPA0, MSTPB7 to MSTPB0, MSTPC7 to MSTPC0, MSTPD7 and MSTPD6): These bits specify module stop mode. See table 23A-4 for the method of selecting the on-chip peripheral functions.
MSTPCRA/MSTPCRB/ MSTPCRC Bits 7 to 0, MSTPCRD Bits 7 and 6 MSTPA7 to MSTPA0, MSTPB7 to MSTPB0, MSTPC7 to MSTPC0, MSTPD7 and MSTPD6 Description 0 1 Module stop mode is cleared (initial value of MSTPA7 and MSTPA6) Module stop mode is set (initial value of MSTPA5–0, MSTPB7–0, MSTPC7–0, and MSTPC7, 6)
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.3 Medium-Speed Mode
In high-speed mode, when the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode changes to medium-speed mode as soon as the current bus cycle ends. In medium-speed mode, the CPU operates on the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0 bits. The bus masters other than the CPU (DTC) also operate in medium-speed mode. On-chip supporting modules other than the bus masters always operate on the high-speed clock (φ). In medium-speed mode, a bus access is executed in the specified number of states with respect to the bus master operating clock. For example, if φ/4 is selected as the operating clock, on-chip memory is accessed in 4 states, and internal I/O registers in 8 states. Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to high-speed mode and medium-speed mode is cleared at the end of the current bus cycle. If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, and LSON bit in LPWRCR is cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt, medium-speed mode is restored. When the SLEEP instruction is executed with the SSBY bit = 1, LPWRCR LSON bit = 0, and TCSR (WDT1) PSS bit = 0, operation shifts to the software standby mode. When software standby mode is cleared by an external interrupt, medium-speed mode is restored. When the RES pin is set low and medium-speed mode is cancelled, operation shifts to the reset state. The same applies in the case of a reset caused by overflow of the watchdog timer. When the STBY pin is driven low, a transition is made to hardware standby mode. Figure 23A-2 shows the timing for transition to and clearance of medium-speed mode.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Medium-speed mode φ, supporting module clock
Bus master clock
Internal address bus
SBYCR
SBYCR
Internal write signal
Figure 23A-2 Medium-Speed Mode Transition and Clearance Timing
23A.4 Sleep Mode
23A.4.1 Sleep Mode When the SLEEP instruction is executed when the SBYCR SSBY bit = 0 and the LPWRCR LSON bit = 0, the CPU enters the sleep mode. In sleep mode, CPU operation stops but the contents of the CPUís internal registers are retained. Other supporting modules do not stop. 23A.4.2 Exiting Sleep Mode Sleep mode is exited by any interrupt, or signals at the RES, or STBY pins. Exiting Sleep Mode by Interrupts: When an interrupt occurs, sleep mode is exited and interrupt exception processing starts. Sleep mode is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the CPU. Exiting Sleep Mode by RES pin: Setting the RES pin level Low selects the reset state. After the stipulated reset input duration, driving the RES pin High starts the CPU performing reset exception processing. Exiting Sleep Mode by STBY Pin: When the STBY pin level is driven Low, a transition is made to hardware standby mode.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.5 Module Stop Mode
23A.5.1 Module Stop Mode Module stop mode can be set for individual on-chip supporting modules. When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of the bus cycle and a transition is made to module stop mode. The CPU continues operating independently. Table 23A-4 shows MSTP bits and the corresponding on-chip supporting modules. When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module starts operating at the end of the bus cycle. In module stop mode, the internal states of modules other than the SCI, Motor control PWM, A/D converter and HCAN are retained. After reset clearance, all modules other than DTC are in module stop mode. When an on-chip supporting module is in module stop mode, read/write access to its registers is disabled.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
Table 23A-4 MSTP Bits and Corresponding On-Chip Supporting Modules
Register MSTPCRA Bit MSTPA6 MSTPA5 MSTPA3 MSTPA2 MSTPA1
1 MSTPA0 *
Module Data transfer controller (DTC) 16-bit timer pulse unit (TPU) Programmable pulse generator (PPG) D/A converter (channel 0, 1) A/D converter Serial communication interface 0 (SCI0) Serial communication interface 1 (SCI1) Serial communication interface 2 (SCI2)
MSTPCRB
MSTPB7 MSTPB6 MSTPB5
2 MSTPB4 * 2 MSTPB3 *
MSTPB0 * MSTPCRC MSTPC4 MSTPC3 MSTPC2
1
PC break controller (PBC) HCAN0 HCAN1
1 MSTPC1* 1 MSTPC0*
MSTPCRD
MSTPD7 MSTPD6 *1
Motor control PWM (PWM)
Notes: 1. MSTPA0, MSTPB0 and MSTPC1 to MSTPC0 and MSTPD6 are readable/writable bits with an initial value of 1. 2 2. The I C bus interface is available as an option in the H8S/2638 and H8S/2630. In the H8S/2636, MSTB4 and MSTB3 are readable and writable bits that have 1 as their initial value.
23A.5.2 Usage Notes DTC Module Stop: Depending on the operating status of the DTC, the MSTPA7 and MSTPA6 bits may not be set to 1. Setting of the DTC module stop mode should be carried out only when the respective module is not activated. For details, refer to section 8, Data Transfer Controller (DTC).
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
On-Chip Supporting Module Interrupt: Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt source or the DTC activation source. Interrupts should therefore be disabled before entering module stop mode. Writing to MSTPCR: MSTPCR should only be written to by the CPU.
23A.6 Software Standby Mode
23A.6.1 Software Standby Mode A transition is made to software standby mode when the SLEEP instruction is executed when the SBYCR SSBY bit = 1 and the LPWRCR LSON bit = 0, and the TCSR (WDT1) PSS bit = 0. In this mode, the CPU, on-chip supporting modules, and oscillator all stop. However, the contents of the CPU’s internal registers, RAM data, and the states of on-chip supporting modules other than the SCI, A/D converter, Motor control, PWM, HCAN and I/O ports, are retained. Whether the address bus and bus control signals are placed in the high-impedance state. In this mode the oscillator stops, and therefore power dissipation is significantly reduced. 23A.6.2 Clearing Software Standby Mode Software standby mode is cleared by an external interrupt (NMI pin, or pins IRQ0 to IRQ5), or by means of the RES pin or STBY pin. • Clearing with an interrupt When an NMI or IRQ0 to IRQ5 interrupt request signal is input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0 in SYSCR, stable clocks are supplied to the entire chip, software standby mode is cleared, and interrupt exception handling is started. When clearing software standby mode with an IRQ0 to IRQ5 interrupt, set the corresponding enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ5 is generated. Software standby mode cannot be cleared if the interrupt has been masked on the CPU side or has been designated as a DTC activation source. • Clearing with the RES pin When the RES pin is driven low, clock oscillation is started. At the same time as clock oscillation starts, clocks are supplied to the entire chip. Note that the RES pin must be held low until clock oscillation stabilizes. When the RES pin goes high, the CPU begins reset exception handling.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
• Clearing with the STBY pin When the STBY pin is driven low, a transition is made to hardware standby mode. 23A.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode Bits STS2 to STS0 in SBYCR should be set as described below. Using a Crystal Oscillator: Set bits STS2 to STS0 so that the standby time is at least 8 ms (the oscillation stabilization time). Table 23A-5 shows the standby times for different operating frequencies and settings of bits STS2 to STS0. Table 23A-5 Oscillation Stabilization Time Settings
STS2 STS1 STS0 Standby Time 0 0 0 1 1 0 1 1 0 1 0 1 0 1 8192 states 16384 states 32768 states 65536 states 131072 states 262144 states Reserved 16 states (Setting prohibited) 20 MHz 0.41 0.82 1.6 3.3 6.6 — 0.8 16 12 10 8 6 4 MHz MHz MHz MHz MHz MHz Unit 0.51 0.68 0.8 1.0 2.0 4.1 8.2 — 1.0 1.3 2.7 5.5 1.6 3.3 6.6 1.0 2.0 4.1 8.2 1.3 2.7 5.5 2.0 4.1 8.2 ms
10.9 16.4
10.9 13.1 16.4 21.8 32.8 — 1.3 — 1.6 — 2.0 — 2.6 — 4.0 µs
13.1 16.4 21.8 26.2 32.8 43.6 65.6
: Recommended time setting
Using a External Clock: The PLL circuit requires time to stabilize, so the standby time should be set to a value of 2 ms or more.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.6.4 Software Standby Mode Application Example Figure 23A-3 shows an example in which a transition is made to software standby mode at the falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI pin. In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set to 1, and a SLEEP instruction is executed, causing a transition to software standby mode. Software standby mode is then cleared at the rising edge on the NMI pin.
Oscillator
φ
NMI
NMIEG
SSBY
NMI exception Software standby mode handling (power-down mode) NMIEG=1 SSBY=1 SLEEP instruction
Oscillation stabilization time tOSC2
NMI exception handling
Figure 23A-3 Software Standby Mode Application Example
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
23A.6.5 Usage Notes I/O Port Status: In software standby mode, I/O port states are retained. If the OPE bit is set to 1, the address bus and bus control signal output is also retained. Therefore, there is no reduction in current dissipation for the output current when a high-level signal is output. Current Dissipation during Oscillation Stabilization Wait Period: Current dissipation increases during the oscillation stabilization wait period. Write Data Buffer Function: The write data buffer function and software standby mode cannot be used at the same time. When the write data buffer function is used, the WDBE bit in BCRL should be cleared to 0 to cancel the write data buffer function before entering software standby mode. Also check that external writes have finished, by reading external addresses, etc., before executing a SLEEP instruction to enter software standby mode. See section 7.7, Write Data Buffer Function, for details of the write data buffer function.
23A.7 Hardware Standby Mode
23A.7.1 Hardware Standby Mode When the STBY pin is driven low, a transition is made to hardware standby mode from any mode. In hardware standby mode, all functions enter the reset state and stop operation, resulting in a significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip RAM data is retained. I/O ports are set to the high-impedance state. In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before driving the STBY pin low. Do not change the state of the mode pins (MD2 to MD0) while the chip is in hardware standby mode. Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started. Ensure that the RES pin is held low until the clock oscillator stabilizes (at least 8 ms—the oscillation stabilization time—when using a crystal oscillator). When the RES pin is subsequently driven high, a transition is made to the program execution state via the reset exception handling state.
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23A.7.2 Hardware Standby Mode Timing Figure 23A-4 shows an example of hardware standby mode timing. When the STBY pin is driven low after the RES pin has been driven low, a transition is made to hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high, waiting for the oscillation stabilization time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation stabilization time
Reset exception handling
Figure 23A-4 Hardware Standby Mode Timing
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F, HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
23A.8 φ Clock Output Disabling Function
Output of the φ clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the corresponding port. When the PSTOP bit is set to 1, the φ clock stops at the end of the bus cycle, and φ output goes high. φ clock output is enabled when the PSTOP bit is cleared to 0. When DDR for the corresponding port is cleared to 0, φ clock output is disabled and input port mode is set. Table 23A-6 shows the state of the φ pin in each processing state. Using the on-chip PLL circuit to lower the oscillator frequency or prohibiting external φ clock output also have the effect of reducing unwanted electromagnetic interference*. Therefore, consideration should be given to these options when deciding on system board settings. Note: * Electromagnetic interference: EMI (Electro Magnetic Interference) Table 23A-6 φ Pin State in Each Processing State
DDR PSTOP Hardware standby mode Software standby Sleep mode High-speed mode, medium-speed mode 0 — High impedance High impedance High impedance High impedance 1 0 High impedance Fixed high φ output φ output 1 1 High impedance Fixed high Fixed high Fixed high
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Section 23A Power-Down Modes [HD64F2636F, HD64F2638F, HD6432636F,
HD6432638F, HD64F2630F, HD6432630F, HD64F2635F, HD6432635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Page 946 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Note: The DTC, PBC, PPB, and D/A converter are not implemented in the H8S/2635 Group.
23B.1 Overview
In addition to the normal program execution state, the chip has nine power-down modes in which operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power operation can be achieved by individually controlling the CPU, on-chip supporting modules, and so on. The chip operating modes are as follows: (1) High-speed mode (2) Medium-speed mode (3) Subactive mode* (U-mask, W-mask version, H8S/2635 Group only) (4) Sleep mode (5) Subsleep mode* (U-mask, W-mask version, H8S/2635 Group only) (6) Watch mode* (U-mask, W-mask version, H8S/2635 Group only) (7) Module stop mode (8) Software standby mode (9) Hardware standby mode (2) to (9) are low power dissipation states. Sleep mode and subsleep mode are CPU states, medium-speed mode is a CPU and bus master state, subactive mode is a CPU and bus master and internal peripheral function state, and module stop mode is an internal peripheral function (including bus masters other than the CPU) state. Some of these states can be combined. After a reset, the LSI is in high-speed mode with modules other than the DTC in module stop mode.
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 947 of 1458
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions. Tables 23B-1 and 23B-2 show the internal state of the LSI in the respective modes. Table 23B-3 shows the conditions for shifting between the low power dissipation modes. Figure 23B-1 is a mode transition diagram.
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Table 23B-1 LSI Internal States in Each Mode (H8S/2636, H8S/2638, H8S/2630)
Function System clock pulse generator Subclock pulse generator CPU HighSpeed MediumSpeed Sleep Module Stop Watch Subactive Halted Software Hardware Subsleep Standby Standby Halted Halted Halted
Function- Function- Function- Function- Halted ing ing ing ing
Function- Function- Function- Function- Function- Function- Function- Function- Halted ing*1 ing*1 ing*1 ing*1 ing*1 ing*1 ing*1 ing*1
Instructions Function- Medium- Halted High/ Halted Subclock Halted Halted Halted Registers ing (retained) medium- (retained) operation (retained) (retained) (undefined) speed operation speed operation Function- Function- Function- Function- Function- Function- Function- Function- Halted ing ing ing ing ing ing ing ing Function- Function- Function- ⎯ ing ing ing Function- Function- Function- ⎯ ing ing ing
External NMI interrupts IRQ0 to IRQ5 Peripheral WDT1 functions W DT0 DTC
Subclock Subclock Subclock Halted Halted operation operation operation (retained) (reset) Halted Subclock Subclock Halted Halted (retained) operation operation (retained) (reset)
Function- Medium- Function- Halted Halted Halted Halted Halted Halted ing speed ing (retained) (retained) (retained) (retained) (retained) (reset) operation Function- Medium- Function- Halted Halted Subclock Halted Halted Halted ing speed ing (retained) (retained) operation (retained) (retained) (reset) operation Function- Function- Function- Halted Halted Halted Halted Halted Halted ing ing ing (retained) (retained) (retained) (retained) (retained) (reset)
PBC
TPU IIC0
*2
IIC1*2 PPG D/A0, 1 SCI0 SCI1 SCI2 PWM A/D RAM I/O HCAN Function- Function- Function- Function- Retained Function- Retained ing ing ing (DTC) ing ing Function- Function- Function- Function- Retained Function- Retained ing ing ing ing ing Function- Function- Function- Halted ing ing ing (reset) Halted (reset) Halted (reset) Halted (reset) Retained Retained Retained High impedance Halted (reset) Halted (reset) Function- Function- Function- Halted ing ing ing (reset) Halted (reset) Halted (reset) Halted (reset) Halted (reset) Halted (reset)
Notes: “Halted (retained)” means that internal register values are retained. The internal state is “operation suspended.” “Halted (reset)” means that internal register values and internal states are initialized. In module stop mode, only modules for which a stop setting has been made are halted (reset or retained). 1. Halted if the SUBSTP bit in LPWRCR is set to 1. 2. The I2C bus interface is available as an option in the H8S/2638, H8S/2639, and H8S/2630. The product equipped with the I2C bus interface is the W-mask version.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 23B-2 LSI Internal States in Each Mode (H8S/2639 Group, H8S/2635 Group)
Function System clock (φ) Clock pulse generator Subclock (φSub) CPU HighSpeed MediumSpeed Sleep Module Stop Watch Subactive Halted Software Hardware Subsleep Standby Standby Halted Halted Halted
Function- Function- Function- Function- Halted ing ing ing ing
Function- Function- Function- Function- Function- Function- Function- Function- Halted ing ing ing ing ing*1 ing*1 ing*1 ing*1 Function- Function- Function- Function- Function- Function- Function- Function- Halted ing*1 ing*1 ing*1 ing*1 ing*1 ing*1 ing*1 ing*1
Instructions Function- Medium- Halted High/ Halted Subclock Halted Halted Halted Registers ing (retained) medium- (retained) operation (retained) (retained) (undefined) speed operation speed operation Function- Function- Function- Function- Function- Function- Function- Function- Halted ing ing ing ing ing ing ing ing Function- Function- Function- ⎯ ing ing ing Function- Function- Function- ⎯ ing ing ing
External NMI interrupts IRQ0 to IRQ5 Peripheral WDT1 functions W DT0 DTC*3
Subclock Subclock Subclock Halted Halted operation operation operation (retained) (reset) Halted Subclock Subclock Halted Halted (retained) operation operation (retained) (reset)
Function- Medium- Function- Halted Halted Halted Halted Halted Halted ing speed ing (retained) (retained) (retained) (retained) (retained) (reset) operation Function- Function- Function- Halted Halted Halted Halted Halted Halted ing ing ing (retained) (retained) (retained) (retained) (retained) (reset)
TPU IIC0*2 IIC1*2 PBC*3 PPG*3 D/A0, 1*3 SCI0 SCI1 SCI2 PWM A/D RAM I/O HCAN
Function- Function- Function- Halted ing ing ing (reset)
Halted (reset)
Halted (reset)
Halted (reset)
Halted (reset)
Halted (reset)
Function- Function- Function- Function- Retained Function- Retained ing ing ing (DTC) ing ing Function- Function- Function- Function- Retained Function- Retained ing ing ing ing ing Function- Function- Function- Halted ing ing ing (reset) Halted (reset) Halted (reset) Halted (reset)
Retained Retained Retained High impedance Halted (reset) Halted (reset)
Notes: “Halted (retained)” means that internal register values are retained. The internal state is “operation suspended.” “Halted (reset)” means that internal register values and internal states are initialized. In module stop mode, only modules for which a stop setting has been made are halted (reset or retained). 1. Halted if the SUBSTP bit in LPWRCR is set to 1. 2. The I2C bus interface is available as an option in the H8S/2638, H8S/2639, and H8S/2630. The product equipped with the I2C bus interface is the W-mask version. 3. The DTC, PBC, PPG, DA0, and DA1 are not implemented in the H8S/2635 Group.
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Program-halted state STBY pin = Low Reset state STBY pin = High RES pin = Low Hardware standby mode
RES pin = High Program execution state SLEEP command High-speed mode (main clock) All interrupt SCK2 to SCK0 = 0 SCK2 to SCK0 ≠ 0 SLEEP command SSBY = 1, PSS = 0, LSON = 0 Software standby mode SSBY = 0, LSON = 0 Sleep mode (main clock)
Medium-speed mode (main clock)
External interrupt *3 SLEEP command Interrupt *2 LSON bit = 0
SSBY = 1, PSS = 1, DTON = 0 Watch mode (subclock)
SLEEP command SSBY = 1, PSS = 1 DTON = 1, LSON = 0 After the oscillation stabilization time (STS2 to 0), clock switching exception processing
SLEEP command SSBY = 1, PSS = 1 DTON = 1, LSON = 1 Clock switching exception processing
SLEEP command
Interrupt *1 LSON bit = 1 SLEEP command Interrupt *2
SSBY = 0, PSS = 1, LSON = 1 Sub-sleep mode (subclock)
Sub-active mode (subclock)
: Transition after exception processing
: Low power dissipation mode
Notes: When a transition is made between modes by means of an interrupt, the transition cannot be made on interrupt source generation alone. Ensure that interrupt handling is performed after accepting the interrupt request. From any state except hardware standby mode, a transition to the reset state occurs when RES is driven Low. From any state, a transition to hardware standby mode occurs when STBY is driven low. Always select high-speed mode before making a transition to watch mode or subactive mode. 1. NMI, IRQ0 to IRQ5, and WDT1 interrupts 2. NMI, IRQ0 to IRQ5, IWDT0 interrupts, and WDT1 interrupt. 3. NMI and IRQ0 to IRQ5
Figure 23B-1 Mode Transition Diagram
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 23B.3 Low Power Dissipation Mode Transition Conditions
Status of Control Bit at Transition Pre-Transition SSBY PSS State High-speed/ Medium-speed 0 0 1 1 1 1 1 1 Subactive 0 0 0 1 1 1 1 1 Legend: *: Don’t care —: Do not set * * 0 0 1 1 1 1 0 1 1 0 1 1 1 1 State after Transition Invoked by SLEEP LSON DTON Command 0 1 0 1 0 1 0 1 * 0 1 * 0 1 0 1 * * * * 0 0 1 1 * * * * 0 0 1 1 Sleep — Software standby — Watch Watch — Subactive — — Subsleep — Watch Watch High-speed — State after Transition Back from Low Power Mode Invoked by Interrupt High-speed/Mediumspeed — High-speed/Mediumspeed — High-speed Subactive — — — — Subactive — High-speed Subactive — —
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.1.1 Register Configuration Power-down modes are controlled by the SBYCR, SCKCR, LPWRCR, TCSR (WDT1), and MSTPCR registers. Table 23B-4 summarizes these registers. Table 23B-4 Power-Down Mode Registers
Name Standby control register System clock control register Low-power control register Timer control/status register Module stop control register A, B, C, D Abbreviation SBYCR SCKCR LPWRCR TCSR MSTPCRA MSTPCRB MSTPCRC MSTPCRD Note: 1. Lower 16 bits of the address. R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value H'58 H'00 H'00 H'00 H'3F H'FF H'FF B'11****** Address* H'FDE4 H'FDE6 H'FDEC H'FFA2 H'FDE8 H'FDE9 H'FDEA H'FC60
1
23B.2 Register Descriptions
23B.2.1 Standby Control Register (SBYCR)
Bit : 7 SSBY Initial value : R/W : 0 R/W 6 STS2 1 R/W 5 STS1 0 R/W 4 STS0 1 R/W 3 OPE 1 R/W 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯ 0 ⎯ 0 ⎯
SBYCR is an 8-bit readable/writable register that performs power-down mode control. SBYCR is initialized to H'58 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—Software Standby (SSBY): When making a low power dissipation mode transition by executing the SLEEP instruction, the operating mode is determined in combination with other control bits. Note that the value of the SSBY bit does not change even when shifting between modes using interrupts.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 7 SSBY 0 Description Shifts to sleep mode when the SLEEP instruction is executed in high-speed mode or medium-speed mode. Shifts to subsleep mode when the SLEEP instruction is executed in subactive mode. (Initial value) Shifts to software standby mode, subactive mode, and watch mode when the SLEEP instruction is executed in high-speed mode or medium-speed mode. Shifts to watch mode or high-speed mode when the SLEEP instruction is executed in subactive mode.
1
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the MCU wait time for clock stabilization when shifting to high-speed mode or medium-speed mode by using a specific interrupt or command to cancel software standby mode, watch mode, or subactive mode. With a quartz oscillator (Table 23B-6), select a wait time of 8ms (oscillation stabilization time) or more, depending on the operating frequency. With an external clock, select a standby time of 2 ms or more (PLL oscillator settling time), based on the operating frequency.
Bit 6 STS2 0 Bit 5 STS1 0 1 1 0 1 Bit 4 STS0 0 1 0 1 0 1 0 1 Description Standby time = 8192 states Standby time = 16384 states Standby time = 32768 states Standby time = 65536 states Standby time = 131072 states Standby time = 262144 states Reserved Standby time = 16 states (Setting prohibited) (Initial value)
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Bit 3—Output Port Enable (OPE): This bit specifies whether the output of the address bus and bus control signals (AS, RD, HWR, LWR) is retained or set to high-impedance state in the software standby mode, watch mode, and when making a direct transition.
Bit 3 OPE 0 1 Description In software standby mode, watch mode, and when making a direct transition, address bus and bus control signals are high-impedance. In software standby mode, watch mode, and when making a direct transition, the output state of the address bus and bus control signals is retained. (Initial value)
Bits 2 to 0—Reserved: These bits always return 0 when read, and cannot be written to. 23B.2.2 System Clock Control Register (SCKCR)
Bit : 7 PSTOP Initial value : R/W : 0 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3 STCS 0 R/W 2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
SCKCR is an 8-bit readable/writable register that performs φ clock output control and mediumspeed mode control. SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7—φ Clock Output Disable (PSTOP): In combination with the DDR of the applicable port, this bit controls φ output. See section 23B.12, φ Clock Output Disable Function for details.
Description Bit 7 PSTOP 0 1 High-Speed Mode, Medium-Speed Mode, Sleep Mode, Subactive Mode Subsleep Mode φ output (initial value) Fixed high φ output Fixed high Software Standby Mode, Watch Mode, Hardware Standby Direct Transition Mode Fixed high Fixed high High impedance High impedance
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bits 6 to 4—Reserved: These bits are always read as 0 and cannot be modified. Bit 3—Frequency Multiplication Factor Switching Mode Select (STCS): Selects the operation when the PLL circuit frequency multiplication factor is changed.
Bit 3 STCS 0 1 Description Specified multiplication factor is valid after transition to software standby mode, watch mode, or subactive mode (Initial value) Specified multiplication factor is valid immediately after STC bits are rewritten
Bits 2 to 0—System Clock Select (SCK2 to SCK0): These bits select the bus master clock in high-speed mode, medium-speed mode, and subactive mode. Set SCK2 to SCK0 all to 0 when shifting to operation in watch mode or subactive mode.
Bit 2 SCK2 0 Bit 1 SCK1 0 1 1 0 1 Bit 0 SCK0 0 1 0 1 0 1 — Description Bus master in high-speed mode Medium-speed clock is φ/2 Medium-speed clock is φ/4 Medium-speed clock is φ/8 Medium-speed clock is φ/16 Medium-speed clock is φ/32 — (Initial value)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.2.3 Low-Power Control Register (LPWRCR)
Bit : 7 DTON* Initial value : R/W : 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 ⎯ 0 R/W 1 STC1 0 R/W 0 STC0 0 R/W
LSON* NESEL* SUBSTP* RFCUT*
Note: * Bits 7 to 3 in LPWRCR are valid in the U-mask and W-mask versions, and H8S/2635 Group; they are reserved bits in all other versions. See section 23A.2.3, Low-Power Control Register (LPWRCR), for more information.
The LPWRCR is an 8-bit read/write register that controls the low power dissipation modes. The LPWRCR is initialized to H'00 at a reset and when in hardware standby mode. It is not initialized in software standby mode. The following describes bits 7 to 2. For details of other bits, see sections 22A.2.2, 22B.2.2, Low-Power Control Register (LPWRCR). Bit 7—Direct Transition ON Flag (DTON): When shifting to low power dissipation mode by executing the SLEEP instruction, this bit specifies whether or not to make a direct transition between high-speed mode or medium-speed mode and the subactive modes. The selected operating mode after executing the SLEEP instruction is determined by the combination of other control bits.
Bit 7 DTON 0 Description • • 1 • When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts to sleep mode, software standby mode, or watch mode*. When the SLEEP instruction is executed in subactive mode, operation shifts to subsleep mode or watch mode. (Initial value) When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts directly to subactive mode*, or shifts to sleep mode or software standby mode. When the SLEEP instruction is executed in subactive mode, operation shifts directly to high-speed mode, or shifts to subsleep mode.
•
Note: * Always set high-speed mode when shifting to watch mode or subactive mode.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 6—Low-Speed ON Flag (LSON): When shifting to low power dissipation mode by executing the SLEEP instruction, this bit specifies the operating mode, in combination with other control bits. This bit also controls whether to shift to high-speed mode or subactive mode when watch mode is cancelled.
Bit 6 LSON 0 Description • • • 1 • • • When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts to sleep mode, software standby mode, or watch mode*. When the SLEEP instruction is executed in subactive mode, operation shifts to watch mode or shifts directly to high-speed mode. Operation shifts to high-speed mode when watch mode is cancelled. (Initial value) When the SLEEP instruction is executed in high-speed mode, operation shifts to watch mode or subactive mode. When the SLEEP instruction is executed in subactive mode, operation shifts to subsleep mode or watch mode. Operation shifts to subactive mode when watch mode is cancelled.
Note: * Always set high-speed mode when shifting to watch mode or subactive mode.
Bit 5—Noise Elimination Sampling Frequency Select (NESEL): This bit selects the sampling frequency of the subclock (φSUB) generated by the subclock oscillator is sampled by the clock (φ) generated by the system clock oscillator. Set this bit to 0 when φ=5MHz or more. This setting is disabled in subactive mode, subsleep mode, and watch mode.
Bit 5 NESEL 0 1 Description Sampling using 1/32 × φ Sampling using 1/4 × φ (Initial value)
Bit 4—Subclock Enable (SUBSTP): This bit enables/disables subclock generation.
Bit 4 SUBSTP Description 0 1 Enables subclock generation Disables subclock generation (Initial value)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Bit 3—Oscillation Circuit Feedback Resistance Control Bit (RFCUT): This bit turns the internal feedback resistance of the main clock oscillation circuit ON/OFF.
Bit 3 RFCUT 0 1 Description When the main clock is oscillating, sets the feedback resistance ON. When the main clock is stopped, sets the feedback resistance OFF. (Initial value) Sets the feedback resistance OFF.
Bit 2—Reserved: Only write 0 to this bit. 23B.2.4 Timer Control/Status Register (TCSR)
Bit : 7 OVF Initial value : R/W : 0 R/(W)*1 6 WT/IT 0 R/W 5 TME 0 R/W 4 0 R/W 3 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
PSS*2 RST/NMI
Notes: 1. Only write 0 to clear the flag. 2. Bit 4 (PSS) in TCSR of WDT1 is valid in the U-mask and W-mask versions, and H8S/2635 Group. In versions other than the U-mask and W-mask versions, and H8S/2635 Group, however, the PSS bit must always be written with 0 since no subclock functions are available.
TCSR is an 8-bit read/write register that selects the clock input to WDT1 TCNT and the mode. Here, we describe bit 4. For details of the other bits in this register, see section 12.2.2, Timer Control/Status Register (TCSR). The TCSR is initialized to H'00 at a reset and when in hardware standby mode. It is not initialized in software standby mode.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit 4—Prescaler Select (PSS): This bit selects the clock source input to WDT1 TCNT. It also controls operation when shifting low power dissipation modes. The operating mode selected after the SLEEP instruction is executed is determined in combination with other control bits. For details, see the description for clock selection in section 12.2.2, Timer Control/Status Register (TCSR), and this section.
Bit 4 PSS 0 Description • • 1 • • • TCNT counts the divided clock from the φ -based prescaler (PSM). When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts to sleep mode or software standby mode. (Initial value) TCNT counts the divided clock from the φsubclock-based prescaler (PSS). When the SLEEP instruction is executed in high-speed mode or medium-speed 12 12 mode, operation shifts to sleep mode, watch mode* * , or subactive mode* * . 2 When the SLEEP instruction is executed in subactive mode* , operation shifts to 2 2 subsleep mode* , watch mode* , or high-speed mode.
Notes: 1. Always set high-speed mode when shifting to watch mode or subactive mode. 2. Bit 4 (PSS) in TCSR of WDT1 is valid in the U-mask and W-mask versions, and H8S/2635 Group. In versions other than the U-mask and W-mask versions, and H8S/2635 Group, however, the PSS bit must always be written with 0 since no subclock functions are available.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.2.5 Module Stop Control Register (MSTPCR)
MSTPCRA Bit : 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPA7 MSTPA6 MSTPA5 MSTPA4 MSTPA3 MSTPA2 MSTPA1 MSTPA0 Initial value : R/W MSTPCRB Bit : 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPB7 MSTPB6 MSTPB5 MSTPB4 MSTPB3 MSTPB2 MSTPB1 MSTPB0 Initial value : R/W MSTPCRC Bit : 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W MSTPC7 MSTPC6 MSTPC5 MSTPC4 MSTPC3 MSTPC2 MSTPC1 MSTPC0 Initial value : R/W : : :
MSTPCRD Bit : 7 1 R/W 6 1 R/W 5 4 3 2 1 0 MSTPD7 MSTPD6 MSTPD5 MSTPD4 MSTPD3 MSTPD2 MSTPD1 MSTPD0 Initial value : R/W :
Undefined Undefined Undefined Undefined Undefined Undefined
—
—
—
—
—
—
MSTPCR, comprising four 8-bit readable/writable registers, performs module stop mode control. MSTPCRA to MSTPCRC are initialized to H'3FFFFF by a reset and in hardware standby mode. MSTPCRD is initialized to B'11****** by a reset and in hardware standby mode. They are not initialized in software standby mode.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MSTPCRA/MSTPCRB/MSTPCRC Bits 7 to 0, MSTPCRD Bits 7 and 6—Module Stop (MSTPA7 to MSTPA0, MSTPB7 to MSTPB0, MSTPC7 to MSTPC0, MSTPD7 and MSTPD6): These bits specify module stop mode. See table 23B-5 for the method of selecting the on-chip peripheral functions.
MSTPCRA/MSTPCRB/ MSTPCRC Bits 7 to 0, MSTPCRD Bits 7 and 6 MSTPA7 to MSTPA0, MSTPB7 to MSTPB0, MSTPC7 to MSTPC0, MSTPD7 and MSTPD6 Description 0 1 Module stop mode is cleared (initial value of MSTPA7 and MSTPA6) Module stop mode is set (initial value of MSTPA5–0, MSTPB7–0, MSTPC7–0, and MSTPC7, 6)
23B.3 Medium-Speed Mode
In high-speed mode, when the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode changes to medium-speed mode as soon as the current bus cycle ends. In medium-speed mode, the CPU operates on the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0 bits. The bus masters other than the CPU (DTC) also operate in medium-speed mode. On-chip supporting modules other than the bus masters always operate on the high-speed clock (φ). In medium-speed mode, a bus access is executed in the specified number of states with respect to the bus master operating clock. For example, if φ/4 is selected as the operating clock, on-chip memory is accessed in 4 states, and internal I/O registers in 8 states. Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to high-speed mode and medium-speed mode is cleared at the end of the current bus cycle. If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, and LSON bit in LPWRCR is cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt, medium-speed mode is restored. When the SLEEP instruction is executed with the SSBY bit = 1, LPWRCR LSON bit = 0, and TCSR (WDT1) PSS bit = 0, operation shifts to the software standby mode. When software standby mode is cleared by an external interrupt, medium-speed mode is restored. When the RES pin is set low and medium-speed mode is cancelled, operation shifts to the reset state. The same applies in the case of a reset caused by overflow of the watchdog timer.
Page 962 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
When the STBY pin is driven low, a transition is made to hardware standby mode. Figure 23B-2 shows the timing for transition to and clearance of medium-speed mode.
Medium-speed mode φ, supporting module clock
Bus master clock
Internal address bus
SBYCR
SBYCR
Internal write signal
Figure 23B-2 Medium-Speed Mode Transition and Clearance Timing
23B.4 Sleep Mode
23B.4.1 Sleep Mode When the SLEEP instruction is executed when the SBYCR SSBY bit = 0 and the LPWRCR LSON bit = 0, the CPU enters the sleep mode. In sleep mode, CPU operation stops but the contents of the CPUís internal registers are retained. Other supporting modules do not stop. 23B.4.2 Exiting Sleep Mode Sleep mode is exited by any interrupt, or signals at the RES, or STBY pins. Exiting Sleep Mode by Interrupts: When an interrupt occurs, sleep mode is exited and interrupt exception processing starts. Sleep mode is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the CPU. Exiting Sleep Mode by RES pin: Setting the RES pin level Low selects the reset state. After the stipulated reset input duration, driving the RES pin High starts the CPU performing reset exception processing. Exiting Sleep Mode by STBY Pin: When the STBY pin level is driven Low, a transition is made to hardware standby mode.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.5 Module Stop Mode
23B.5.1 Module Stop Mode Module stop mode can be set for individual on-chip supporting modules. When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of the bus cycle and a transition is made to module stop mode. The CPU continues operating independently. Table 23B-5 shows MSTP bits and the corresponding on-chip supporting modules. When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module starts operating at the end of the bus cycle. In module stop mode, the internal states of modules other than the SCI, Motor control PWM, A/D converter and HCAN are retained. After reset clearance, all modules other than DTC are in module stop mode. When an on-chip supporting module is in module stop mode, read/write access to its registers is disabled.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
Table 23B-5 MSTP Bits and Corresponding On-Chip Supporting Modules
Register MSTPCRA Bit MSTPA6 MSTPA5 MSTPA3 MSTPA2 MSTPA1
1 MSTPA0 *
Module Data transfer controller (DTC)* 16-bit timer pulse unit (TPU) Programmable pulse generator (PPG)* 3 D/A converter (channel 0, 1)* A/D converter Serial communication interface 0 (SCI0) Serial communication interface 1 (SCI1) Serial communication interface 2 (SCI2) 2 2 I C bus interface 0 (IIC0)* I C bus interface 1 (IIC1)* *1 PC break controller (PBC)* HCAN0 HCAN1*
1 3 3 2 2 3 3
MSTPCRB
MSTPB7 MSTPB6 MSTPB5 MSTPB4 MSTPB3 MSTPB0
MSTPCRC
MSTPC4 MSTPC3 MSTPC2 MSTPC1* 1 MSTPC0*
MSTPCRD
MSTPD7 MSTPD6 *1
Motor control PWM (PWM)
Notes: 1. MSTPA0, MSTPB0 and MSTPC1 to MSTPC0 and MSTPD6 are readable/writable bits with an initial value of 1. 2 2. The I C bus interface is available as an option in the H8S/2638, H8S/2639, and 2 H8S/2630. The product equipped with the I C bus interface is the W-mask version. When this optional feature is not used or in H8S/2636, MSTB4 and MSTB3 are readable and writable bits that have 1 as their initial value. 3. The DTC, PPG, D/A converter, PBC, and HCAN1 are not implemented in the H8S/2635 and H8S/2634. MSTPA6, MSTPA3, MSTPA2, MSTPC4, and MSTPC2 are readable/writable bits, but only 1 should be written to them.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.5.2 Usage Notes Note: The DTC is not implemented in the H8S/2635 Group. DTC Module Stop: Depending on the operating status of the DTC, the MSTPA7 and MSTPA6 bits may not be set to 1. Setting of the DTC module stop mode should be carried out only when the respective module is not activated. For details, refer to section 8, Data Transfer Controller (DTC). On-Chip Supporting Module Interrupt: Relevant interrupt operations cannot be performed in module stop mode. Consequently, if module stop mode is entered when an interrupt has been requested, it will not be possible to clear the CPU interrupt source or the DTC activation source. Interrupts should therefore be disabled before entering module stop mode. Writing to MSTPCR: MSTPCR should only be written to by the CPU.
23B.6 Software Standby Mode
23B.6.1 Software Standby Mode A transition is made to software standby mode when the SLEEP instruction is executed when the SBYCR SSBY bit = 1 and the LPWRCR LSON bit = 0, and the TCSR (WDT1) PSS bit = 0. In this mode, the CPU, on-chip supporting modules, and oscillator all stop*. However, the contents of the CPU’s internal registers, RAM data, and the states of on-chip supporting modules other than the SCI, A/D converter, Motor control PWM, HCAN and I/O ports, are retained. Whether the address bus and bus control signals are placed in the high-impedance state. In this mode the oscillator stops*, and therefore power dissipation is significantly reduced. Note: * The subclock (φSUB) operates if the SUBSTP bit in LPWRCR is set to 0.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.6.2 Clearing Software Standby Mode Software standby mode is cleared by an external interrupt (NMI pin, or pins IRQ0 to IRQ5), or by means of the RES pin or STBY pin. • Clearing with an interrupt When an NMI or IRQ0 to IRQ5 interrupt request signal is input, clock oscillation starts, and after the elapse of the time set in bits STS2 to STS0 in SYSCR, stable clocks are supplied to the entire chip, software standby mode is cleared, and interrupt exception handling is started. When clearing software standby mode with an IRQ0 to IRQ5 interrupt, set the corresponding enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ5 is generated. Software standby mode cannot be cleared if the interrupt has been masked on the CPU side or has been designated as a DTC activation source. • Clearing with the RES pin When the RES pin is driven Low, clock oscillation is started. At the same time as clock oscillation starts, clocks are supplied to the entire chip. Note that the RES pin must be held Low until clock oscillation stabilizes. When the RES pin goes high, the CPU begins reset exception handling. • Clearing with the STBY pin When the STBY pin is driven Low, a transition is made to hardware standby mode. 23B.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode Bits STS2 to STS0 in SBYCR should be set as described below. Using a Crystal Oscillator: 1. Setting for H8S/2636, H8S/2638, H8S/2639, H8S/2630 Set bits STS2 to STS0 so that the standby time is at least 8 ms (the oscillation stabilization time). Table 23B-6 shows the standby times for different operating frequencies and settings of bits STS2 to STS0.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 23B-6 Oscillation Stabilization Time Settings
STS2 0 STS1 0 STS0 0 1 1 0 1 1 0 0 1 1 0 1 Standby Time 8192 states 16384 states 32768 states 65536 states 131072 states 262144 states Reserved 20 MHz 0.41 0.82 1.6 3.3 6.6 16 MHz 0.51 1.0 2.0 4.1 8.2 12 MHz 0.68 1.3 2.7 5.5 10.9 21.8 — 1.3 10 MHz 0.8 1.6 3.3 6.6 8 MHz 1.0 2.0 4.1 8.2 6 MHz 1.3 2.7 5.5 10.9 21.8 43.6 — 2.6 5 MHz 1.6 3.2 6.5 4 MHz 2.0 4.1 8.2 Unit ms
13.1 16.4 26.2 52.4 — 3.2 32.8 65.6 — 4.0 µs
13.1 16.4 26.2 — 1.6 32.8 — 2.0
13.1 16.4 — — 1.0
16 states 0.8 (Setting prohibited)
: Recommended time setting
2. Setting for H8S/2635, H8S/2634 Set bits STS2 to STS0 so that the standby time is at least 12 ms (the oscillation stabilization time). Table 23B-7 shows the standby times for different operating frequencies and settings of bits STS2 to STS0. Table 23B-7 Oscillation Stabilization Time Settings
STS2 0 STS1 0 STS0 0 1 1 0 1 1 0 0 1 1 0 1 Standby Time 8192 states 16384 states 32768 states 65536 states 131072 states 262144 states Reserved 20 MHz 16 MHz 10 MHz 8 MHz 0.41 0.82 1.6 3.3 6.6 13.1 — 0.51 1.0 2.0 4.1 8.2 16.4 — 1.0 0.8 1.6 3.3 6.6 13.1 26.2 — 1.6 1.0 2.0 4.1 8.2 16.4 32.8 — 2.0 5 MHz 1.6 3.2 6.5 13.1 26.2 52.4 — 3.2 4 MHz 2.0 4.1 8.2 16.4 32.8 65.6 — 4.0 µs Unit ms
16 states 0.8 (Setting prohibited)
: Recommended time setting
Using an External Clock: The PLL circuit requires time to stabilize, so the standby time should be set to a value of 2 ms or more.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.6.4 Software Standby Mode Application Example Figure 23B-3 shows an example in which a transition is made to software standby mode at the falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI pin. In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set to 1, and a SLEEP instruction is executed, causing a transition to software standby mode. Software standby mode is then cleared at the rising edge on the NMI pin.
Oscillator
φ
NMI
NMIEG
SSBY
NMI exception Software standby mode handling (power-down mode) NMIEG=1 SSBY=1 SLEEP instruction
Oscillation stabilization time tOSC2
NMI exception handling
Figure 23B-3 Software Standby Mode Application Example
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.6.5 Usage Notes I/O Port Status: In software standby mode, I/O port states are retained. If the OPE bit is set to 1, the address bus and bus control signal output is also retained. Therefore, there is no reduction in current dissipation for the output current when a high-level signal is output. Current Dissipation during Oscillation Stabilization Wait Period: Current dissipation increases during the oscillation stabilization wait period. Write Data Buffer Function: The write data buffer function and software standby mode cannot be used at the same time. When the write data buffer function is used, the WDBE bit in BCRL should be cleared to 0 to cancel the write data buffer function before entering software standby mode. Also check that external writes have finished, by reading external addresses, etc., before executing a SLEEP instruction to enter software standby mode. See section 7.7, Write Data Buffer Function, for details of the write data buffer function.
23B.7 Hardware Standby Mode
23B.7.1 Hardware Standby Mode When the STBY pin is driven low, a transition is made to hardware standby mode from any mode. In hardware standby mode, all functions enter the reset state and stop operation, resulting in a significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip RAM data is retained. I/O ports are set to the high-impedance state. In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before driving the STBY pin low. Do not change the state of the mode pins (MD2 to MD0) while the chip is in hardware standby mode. Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started. Ensure that the RES pin is held low until the clock oscillator stabilizes (at least 8 ms—the oscillation stabilization time—when using a crystal oscillator). When the RES pin is subsequently driven high, a transition is made to the program execution state via the reset exception handling state.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.7.2 Hardware Standby Mode Timing Figure 23B-4 shows an example of hardware standby mode timing. When the STBY pin is driven low after the RES pin has been driven low, a transition is made to hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high, waiting for the oscillation stabilization time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation stabilization time
Reset exception handling
Figure 23B-4 Hardware Standby Mode Timing
23B.8 Watch Mode (U-Mask, W-Mask Version, H8S/2635 Group Only)
23B.8.1 Watch Mode CPU operation makes a transition to watch mode when the SLEEP instruction is executed in highspeed mode or subactive mode with SBYCR SSBY=1, LPWRCR DTON = 0, and TCSR (WDT1) PSS = 1. In watch mode, the CPU is stopped and supporting modules other than WDT1 are also stopped. The contents of the CPU’s internal registers, the data in internal RAM, and the statuses of the internal supporting modules (excluding the SCI, ADC, HCAN, and Motor control PWM) and I/O ports are retained.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.8.2 Exiting Watch Mode Watch mode is exited by any interrupt (WOVI interrupt, NMI pin, or IRQ0 to IRQ5), or signals at the RES, or STBY pins. (1) Exiting Watch Mode by Interrupts When an interrupt occurs, watch mode is exited and a transition is made to high-speed mode or medium-speed mode when the LPWRCR LSON bit = 0 or to subactive mode when the LSON bit = 1. When a transition is made to high-speed mode, a stable clock is supplied to all LSI circuits and interrupt exception processing starts after the time set in SBYCR STS2 to STS0 has elapsed. In the case of IRQ0 to IRQ5 interrupts, no transition is made from watch mode if the corresponding enable bit has been cleared to 0, and, in the case of interrupts from the internal supporting modules, the interrupt enable register has been set to disable the reception of that interrupt, or is masked by the CPU. See section 23B.6.3, Setting Oscillation Stabilization Time after Clearing Software Standby Mode for how to set the oscillation stabilization time when making a transition from watch mode to high-speed mode. (2) Exiting Watch Mode by RES pins For exiting watch mode by the RES pins, see, Clearing with the RES pins in section 23B.6.2, Clearing Software Standby Mode. (3) Exiting Watch Mode by STBY pin When the STBY pin level is driven Low, a transition is made to hardware standby mode. 23B.8.3 Notes (1) I/O Port Status The status of the I/O ports is retained in watch mode. Also, when the OPE bit is set to 1, the address bus and bus control signals continue to be output. Therefore, when a High level is output, the current consumption is not diminished by the amount of current to support the High level output. (2) Current Consumption when Waiting for Oscillation Stabilization The current consumption increases during stabilization of oscillation.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.9 Subsleep Mode (U-Mask, W-Mask Version, H8S/2635 Group Only)
23B.9.1 Subsleep Mode When the SLEEP instruction is executed with the SBYCR SSBY bit = 0, LPWRCR LSON bit = 1, and TCSR (WDT1) PSS bit = 1, CPU operation shifts to subsleep mode. In subsleep mode, the CPU is stopped. Supporting modules other than WDT0, and WDT1 are also stopped. The contents of the CPU’s internal registers, the data in internal RAM, and the statuses of the internal supporting modules (excluding the SCI, ADC, HCAN, and Motor control PWM) and I/O ports are retained. 23B.9.2 Exiting Subsleep Mode Subsleep mode is exited by an interrupt (interrupts from internal supporting modules, NMI pin, or IRQ0 to IRQ5), or signals at the RES or STBY pins. (1) Exiting Subsleep Mode by Interrupts When an interrupt occurs, subsleep mode is exited and interrupt exception processing starts. In the case of IRQ0 to IRQ5 interrupts, subsleep mode is not cancelled if the corresponding enable bit has been cleared to 0, and, in the case of interrupts from the internal supporting modules, the interrupt enable register has been set to disable the reception of that interrupt, or is masked by the CPU. (2) Exiting Subsleep Mode by RES For exiting subsleep mode by the RES pins, see, Clearing with the RES pins in section 23B.6.2, Clearing Software Standby Mode. (3) Exiting Subsleep Mode by STBY Pin When the STBY pin level is driven Low, a transition is made to hardware standby mode.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.10 Subactive Mode (U-Mask, W-Mask Version, H8S/2635 Group Only)
23B.10.1 Subactive Mode When the SLEEP instruction is executed in high-speed mode with the SBYCR SSBY bit = 1, LPWRCR DTON bit = 1, LSON bit = 1, and TCSR (WDT1) PSS bit = 1, CPU operation shifts to subactive mode. When an interrupt occurs in watch mode, and if the LSON bit of LPWRCR is 1, a transition is made to subactive mode. And if an interrupt occurs in subsleep mode, a transition is made to subactive mode. In subactive mode, the CPU operates at low speed on the subclock, and the program is executed step by step. Supporting modules other than WDT0, and WDT1 are also stopped. When operating the CPU in subactive mode, the SCKCR SCK2 to SCK0 bits must be set to 0. 23B.10.2 Exiting Subactive Mode Subactive mode is exited by the SLEEP instruction or the RES or STBY pins. (1) Exiting Subactive Mode by SLEEP Instruction When the SLEEP instruction is executed with the SBYCR SSBY bit = 1, LPWRCR DTON bit = 0, and TCSR (WDT1) PSS bit = 1, the CPU exits subactive mode and a transition is made to watch mode. When the SLEEP instruction is executed with the SBYCR SSBY bit = 0, LPWRCR LSON bit = 1, and TCSR (WDT1) PSS bit = 1, a transition is made to subsleep mode. Finally, when the SLEEP instruction is executed with the SBYCR SSBY bit = 1, LPWRCR DTON bit = 1, LSON bit = 0, and TCSR (WDT1) PSS bit = 1, a direct transition is made to high-speed mode (SCK0 to SCK2 all 0). See section 23B.11, Direct Transitions for details of direct transitions. (2) Exiting Subactive Mode by RES Pins For exiting subactive mode by the RES pins, see, Claering with the RES pins in section 23B.6.2, Clearing Software Standby Mode. (3) Exiting Subactive Mode by STBY Pin When the STBY pin level is driven Low, a transition is made to hardware standby mode.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.11 Direct Transitions (U-Mask, W-Mask Version, H8S/2635 Group Only)
23B.11.1 Overview of Direct Transitions There are three modes, high-speed, medium-speed, and subactive, in which the CPU executes programs. When a direct transition is made, there is no interruption of program execution when shifting between high-speed and subactive modes. Direct transitions are enabled by setting the LPWRCR DTON bit to 1, then executing the SLEEP instruction. After a transition, direct transition interrupt exception processing starts. (1) Direct Transitions from High-Speed Mode to Subactive Mode Execute the SLEEP instruction in high-speed mode when the SBYCR SSBY bit = 1, LPWRCR LSON bit = 1, and DTON bit = 1, and TSCR (WDT1) PSS bit = 1 to make a transition to subactive mode. (2) Direct Transitions from Subactive Mode to High-Speed Mode Execute the SLEEP instruction in subactive mode when the SBYCR SSBY bit = 1, LPWRCR LSON bit = 0, and DTON bit = 1, and TSCR (WDT1) PSS bit = 1 to make a direct transition to high-speed mode after the time set in SBYCR STS2 to STS0 has elapsed.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
23B.12 φ Clock Output Disabling Function
Output of the φ clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the corresponding port. When the PSTOP bit is set to 1, the φ clock stops at the end of the bus cycle, and φ output goes high. φ clock output is enabled when the PSTOP bit is cleared to 0. When DDR for the corresponding port is cleared to 0, φ clock output is disabled and input port mode is set. Table 23B-8 shows the state of the φ pin in each processing state. Using the on-chip PLL circuit to lower the oscillator frequency or prohibiting external φ clock output also have the effect of reducing unwanted electromagnetic interference*. Therefore, consideration should be given to these options when deciding on system board settings. Note: * Electromagnetic interference: EMI (Electro Magnetic Interference) Table 23B-8 φ Pin State in Each Processing State
DDR PSTOP Hardware standby mode Software standby mode, watch mode*, and direct transition Sleep mode and subsleep mode* High-speed mode, medium-speed mode, and subactive mode* Subactive mode 0 — High impedance High impedance High impedance High impedance High impedance 1 0 High impedance Fixed high φ output φ output φ SUB output 1 1 High impedance Fixed high Fixed high Fixed high Fixed high
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
23B.13 Usage Notes
1. When making a transition to subactive mode or watch mode, set the DTC to enter module stop mode (write 1 to the relevant bits in MSTPCR), and then read the relevant bits to confirm that they are set to 1 before mode transition. Do not clear module stop mode (write 0 to the relevant bits in MSTPCR) until a transition from subactive mode to high-speed mode or medium-speed mode has been performed. If a DTC activation source occurs in subactive mode, the DTC will be activated only after module stop mode has been cleared and high-speed mode or medium-speed mode has been entered. 2. The on-chip peripheral modules (DTC and TPU) which halt operation in subactive mode cannot clear an interrupt in subactive mode. Therefore, if a transition is made to subactive mode while an interrupt is requested, the CPU interrupt source cannot be cleared. Disable the interrupts of each on-chip peripheral module before executing a SLEEP instruction to enter subactive mode or watch mode. 3. A 1 is always returned when an attempt is made to read the pin status of I/O ports 1, 4, 9, or F during operation in subactive mode. (In the case of port 1, pins 13 to 10 are readable.) In addition, the ports may be used as output ports (except for ports 4 and 9). The procedure for determining the pin status during operation in subactive mode is as follows. [1] Use ports 3, A, B, C, D, E, H, and J as input ports. [2] Use external interrupt inputs (IRQ0 to IRQ5). (If the level sense setting has been selected for the IRQ pins, an interrupt request is generated by a low-level input.) 4. Operation cannot be guaranteed if a transition is made to the subactive mode, subsleep mode, or watch mode when the SUBSTP bit in LPWRCR is set to 1 (subclock generation prohibited). To prevent problems, it should be confirmed that the SUBSTP bit has been cleared to 0 before transitioning to the subactive mode, subsleep mode, or watch mode. 5. (H8S/2639 Group, H8S/2635 Group only) The subclock (φSUB) is frequency divided internally, so the clock oscillator does not halt even if a transition to the software standby mode occurs when the SUBSTP bit in LPWRCR is cleared to 0. The SUBSTP bit in LPWRCR should be set to 1 before transitioning to the software standby mode.
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Section 23B Power-Down Modes [HD64F2636UF, HD6432636UF, HD64F2638UF, HD6432638UF, HD64F2638WF, HD6432638WF, HD64F2639UF, HD6432639UF, HD64F2639WF, HD6432639WF, HD64F2630UF, HD6432630UF, HD64F2630WF, HD6432630WF, HD6432635F, HD64F2635F, HD6432634F]
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
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Section 24 Electrical Characteristics
Section 24 Electrical Characteristics
24.1
24.1.1
H8S/2636 Group Electrical Characteristics
Absolute Maximum Ratings
Table 24-1 lists the absolute maximum ratings. Table 24-1 Absolute Maximum Ratings
Item Power supply voltage Input voltage (OSC1, OSC2) Input voltage (XTAL, EXTAL) Input voltage (ports 4 and 9) Input voltage (ports H and J) Symbol VCC Vin Vin Vin Vin Value –0.3 to +7.0 –0.3 +4.3 –0.3 to VCC +0.3 –0.3 to AVCC +0.3 –0.3 to PWMVCC +0.3 –0.3 to VCC +0.3 Unit V V V V V V
Input voltage (except XTAL, Vin EXTAL, OSC1, OSC2, ports 4, 9, H and J) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature Vref AVCC VAN Topr Tstg
–0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 –55 to +125
V V V °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded.
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.1.2
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 24-1.
Operating range of high-speed, medium-speed and sleep modes 24 20
Frequency (MHz)
16 12 8 4 0 3 3.5 4 4.5 5 5.5 6
Power supply voltage (V)
Operating range of watch*, sub-active* and sub-sleep* modes
32.768
Frequency (MHz)
0
3
3.5
4
4.5
5
5.5
6
Power supply voltage (V)
Note: * The watch, subactive, and subsleep modes are available in the U-mask version only.
Figure 24-1 Power Supply Voltage and Operating Ranges
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Section 24 Electrical Characteristics
24.1.3
DC Characteristics
Table 24-2 lists the DC characteristics. Table 24-3 lists the permissible output currents. Table 24-2 DC Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)*1 *6
Item Schmitt trigger input voltage Input high voltage Symbol IRQ0 to IRQ5 VT VT RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4 and 9 Input low voltage RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4, 9 VIL
– + + –
Min. 1.0 — 0.4 VCC – 0.7
Typ. — — — —
Max. — VCC × 0.7 — VCC + 0.3
Unit V
Test Conditions
VT – VT VIH
V
VCC × 0.7 2.2 VCC × 0.8
— — —
VCC + 0.3 VCC + 0.3 VCC + 0.3 PWMVCC + 0.3 VCC + 0.3 AVCC + 0.3 0.5 V
PWMVCC × — 0.8 2.2 —
AVCC × 0.7 — –0.3 —
–0.3 –0.3 –0.3 –0.3 –0.3 –0.3
— — — — — —
0.8 0.8 VCC × 0.2 PWMVCC × 0.2 VCC × 0.2 AVCC × 0.2
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Item Output high voltage Ports 1, 3, A to F, H,J HTxD0, HTxD1 PWM1A to PWM1H, PWM2A to PWM2H Output low voltage
Symbol VOH
Min. VCC – 0.5 3.5 PWMVCC – 0.5
Typ. — —
Max. — — —
Unit V
Test Conditions IOH = –200 µA IOH = –1 mA IOH = –15 mA
All output pins VOL except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
—
—
0.4
V
IOL = 1.6 mA
—
—
0.5
V
IOL = 15 mA
Input leakage current
RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9
| Iin |
— — — —
— — — —
1.0 1.0 1.0 1.0 1.0
μA
Vin = 0.5 V to VCC – 0.5 V
Vin = 0.5 V to AVCC – 0.5 V μA Vin = 0.5 V to VCC – 0.5 V
Three-state leakage current (off state)
Ports 1, 3, A to F, H, J HTxD0, HTxD1
⏐ITSI⏐
—
MOS input Ports A to E pull-up current Input capacitance RES NMI All input pins except RES and NMI
–IP Cin
50 — — — — — —
300 30 30 15
μA pF
Vin = 0 V Vin = 0 V f = 1 MHz Ta = 25°C
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Section 24 Electrical Characteristics
Item Current Normal 2 dissipation* operation Sleep mode All modules stopped Mediumspeed mode (φ/32) Subactive 5 mode* Subsleep 5 mode* Watch 5 mode* Standby 3 mode* During A/D Analog power supply and D/A conversion current Idle Reference current During A/D and D/A conversion Idle RAM standby voltage
Symbol Min. ICC *4 — — — —
Typ. 75 65 57 49
Max. 90 80 — —
Unit mA
Test Conditions f = 20 MHz
mA
f = 20 MHz (reference value)
— — — — — AlCC —
130 80 30 2.0 — 1.0
220 160 60 5.0 20 2.0
µA
Using 32.768 kHz crystal resonator
µA mA
Ta ≤ 50°C 50°C < Ta AVCC = 5.0 V
— AlCC —
0.1 4.0
5.0 5.0
µA mA Vref = 5.0 V
— VRAM 2.0
0.1 —
5.0 —
µA V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref , and AVSS pins open. Apply a voltage between 4.5 V and 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC. 2. Current dissipation values are for VIH (min.) = VCC – 0.5 V, VIL (max.) = 0.5 V with all output pins unloaded and the on-chip pull-up resistors in the off state. 3. The values are for VRAM ≤ VCC < 3.0 V, VIH (min.) = VCC × 0.9, and VIL (max.) = 0.3 V. 4. ICC depends on VCC and f as follows: ICC (max.) = 30 (mA) + 0.54 (mA/(MHz × V)) × VCC × f (normal operation) ICC (max.) = 30 (mA) + 0.45 (mA/(MHz × V)) × VCC × f (sleep mode) 5. The watch, subactive, and subsleep modes are available in the U-mask version only. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 6. If the motor-control PWM timer is not used, do not leave the PMWVCC, or PMWVSS pins open. If the motor-control PWM timer is not used, apply a voltage of between 4.5 and 5.5 V to the PWMVCC pin, for instance, by connecting it to VCC.
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 24-3 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Permissible output low current (per pin) All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H Symbol IOL Min. — Typ. — Max. 10 Unit mA Test condition
IOL
— — —
— — — —
25 30 40 80
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output low excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
∑ IOL
—
Total of PWM1A to PWM1H, ∑ IOL and PWM2A to PWM2H
— — — —
— — — —
150 180 220 2.0
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible output high current (per pin)
All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
–IOH
–IOH
— — —
— — — —
25 30 40 40
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output high excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
∑ –IOH
—
Total of PWM1A to PWM1H, ∑ –IOH and PWM2A to PWM2H
— — —
— — —
150 180 220
mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Note: To protect chip reliability, do not exceed the output current values in table 24-3.
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Section 24 Electrical Characteristics
24.1.4
AC Characteristics
Figure 24-2 show, the test conditions for the AC characteristics.
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
Figure 24-2 Output Load Circuit
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
(1) Clock Timing Table 24-4 lists the clock timing Table 24-4 Clock Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition 20MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) External clock output stabilization delay time 32-kHz clock oscillation settling time Subclock oscillator frequency Subclock (φSUB) cycle time Symbol tcyc tCH tCL tCr tCf tOSC1 tOSC2 tDEXT tOSC3 fSUB tSUB Min. 50 15 15 — — 20 8 2 — 32.768 30.5 Max. 250 — — 10 10 — — — 2 Unit ns ns ns ns ns ms ms ms s kHz μs Figure 24-10 Figure 23A-3 Figure 23B-3 Figure 24-10 Test Conditions Figure 24-9
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Section 24 Electrical Characteristics
(2) Control Signal Timing Table 24-5 lists the control signal timing. Table 24-5 Control Signal Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item RES setup time RES pulse width NMI setup time NMI hold time NMI pulse width (exiting software standby mode) IRQ setup time IRQ hold time IRQ pulse width (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW tIRQS tIRQH tIRQW Min. 200 20 150 10 200 150 10 200 Max. — — — — — — — — ns ns ns ns Unit ns tcyc ns Figure 24-12 Test Conditions Figure 24-11
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
(3) Bus Timing Table 24-6 lists the bus timing. Table 24-6 Bus Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Address delay time Address setup time Address hold time AS delay time RD delay time 1 RD delay time 2 Read data setup time Read data hold time Read data access time1 Read data access time2 Read data access time3 Read data access time 4 Read data access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 Write data delay time Write data setup time Write data hold time Symbol tAD tAS tAH tASD tRSD1 tRSD2 tRDS tRDH tACC1 tACC2 tACC3 tACC4 tACC5 tWRD1 tWRD2 tWSW1 tWSW2 tWDD tWDS tWDH Min. — 0.5 × tcyc – 20 0.5 × tcyc – 15 — — — 20 0 — — — — — — — 1.0 × tcyc – 20 1.5 × tcyc – 20 — 0.5 × tcyc – 20 0.5 × tcyc – 10 Max. 35 — — 20 20 20 — — 1.0 × tcyc – 48 1.5 × tcyc – 45 2.0 × tcyc – 45 2.5 × tcyc – 45 3.0 × tcyc – 50 20 20 — — 30 — — Unit Test Conditions ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Figure 24-13 to Figure 24-17
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Section 24 Electrical Characteristics
(4) Timing of On-Chip Supporting Modules Table 24-7 lists the timing of on-chip supporting modules. Table 24-7 Timing of On-Chip Supporting Modules Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item I/O port Output data delay time Output data delay time 2 Input data setup time Input data hold time PPG TPU Pulse output delay time Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width PWM SCI Single edge Both edges Asynchronous Synchronous tSCKW tSCKr tSCKf tTXD tRXS tRXH tTRGS Symbol tPWD tPWD2 tPRS tPRH tPOD tTOCD tTICS tTCKS tTCKWH tTCKWL tMPWMOD tScyc Min. — — 30 30 — — 30 30 1.5 2.5 — 4 6 0.4 — — — 50 50 50 Max. 50 50 — — 50 50 — — — — 50 — — 0.6 1.5 1.5 50 — — — ns Figure 24-26 ns Figure 24-25 tScyc tcyc ns tcyc Figure 24-23 Figure 24-24 ns tcyc Figure 24-22 ns ns Figure 24-20 Figure 24-21 Unit ns Test Conditions Figure 24-18 Figure 24-19
Pulse output delay time Input clock cycle
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) A/D Trigger input setup time converter
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Condition Item HCAN* Transmit data delay time Receive data setup time Receive data hold time Symbol tHTXD tHRXS tHRXH Min. — 100 100 Max. 100 — — Unit ns Test Conditions Figure 24-27
Note: * The HCAN input signal is asynchronous. However, its state is judged to have changed at the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27. The HCAN output signal is also asynchronous. Its state changes based on the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27.
24.1.5
A/D Conversion Characteristics
Table 24-8 lists the A/D conversion characteristics. Table 24-8 A/D Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization Absolute accuracy Min. 10 10 — — — — — — — Typ. 10 — — — — — — ±0.5 — Max. 10 — 20 5 ±3.5 ±3.5 ±3.5 — ±4.0 Unit bits µs pF kΩ LSB LSB LSB LSB LSB
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Section 24 Electrical Characteristics
24.1.6
D/A Conversion Characteristics
Table 24-9 shows the D/A conversion characteristics. Table 24-9 D/A Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Absolute accuracy Min. 8 — — — Typ. 8 — ± 1.5 — Max. 8 10 ± 2.0 ± 1.5 Unit bits µs LSB LSB 20-pF capacitive load 2-MΩ resistive load 4-MΩ resistive load Test Conditions
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.1.7
Flash Memory Characteristics
Table 24-10 shows the flash memory characteristics. Table 24-10 Flash Memory Characteristics Conditions: VCC =4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS, AVSS = 0 V Ta = 0 to +75°C (Programming/erasing operating temperature range: regular specification)
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting*1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min. — — — 1 50 28 198 8 Typ. 10 100 — 1 50 30 200 10 Max. 200 1200 100 — — 32 202 12 Unit ms/ 128 bytes ms/block Times µs µs µs µs µs Programming time wait Programming time wait Additionalprogramming time wait Test Condition
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear*1 Wait time after SWE bit clear*1 Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1
tcp tcpsu tspv tspvr tcpv tcswe
5 5 4 2 2 100 — 1 100 10 10 10 20
5 5 4 2 2 100 — 1 100 10 10 10 20
— — — — — — 1000 — — 100 — — —
µs µs µs µs µs µs Times µs µs ms µs µs µs Erase time wait
Maximum programming count*1 *4 N Erase tsswe tsesu tse tce tcesu tsev
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Section 24 Electrical Characteristics
Item Erase Wait time after H'FF dummy write*1 Wait time after EV bit clear*1 Wait time after SWE bit clear*1 Maximum erase count*1 *5
Symbol tsevr tcev tcswe N
Min. 2 4 100 12
Typ. 2 4 100 —
Max. — — — 120
Unit µs µs µs Times
Test Condition
Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time) 4. To specify the maximum programming time value (tP (max.)) in the 128-byte programming algorithm, set the max. value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 µs Programming counter (n) = 7 to 1000: tsp200 = 200 µs [In additional programming] Programming counter (n)= 1 to 6: tsp10 = 10 µs 5. For the maximum erase time (tE (max.), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE (max.) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of (tse) and (N) should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times
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24.2
24.2.1
H8S/2638 Group Electrical Characteristics
Absolute Maximum Ratings
Table 24-11 lists the absolute maximum ratings. Table 24-11 Absolute Maximum Ratings
Item Power supply voltage Input voltage (OSC1, OSC2) Input voltage (XTAL, EXTAL) Input voltage (ports 4 and 9) Input voltage (ports H and J) Symbol VCC Vin Vin Vin Vin Value –0.3 to +7.0 –0.3 +4.3 –0.3 to VCC +0.3 –0.3 to AVCC +0.3 –0.3 to PWMVCC +0.3 –0.3 to VCC +0.3 Unit V V V V V V
Input voltage (except XTAL, Vin EXTAL, OSC1, OSC2, ports 4, 9, H and J) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature Vref AVCC VAN Topr Tstg
–0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 –55 to +125
V V V °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded.
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Section 24 Electrical Characteristics
24.2.2
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 24-3.
Operating range of high-speed, medium-speed and sleep modes 24 20
Frequency (MHz)
16 12 8 4 0 3 3.5 4 4.5 5 5.5 6
Power supply voltage (V)
Operating range of watch*, sub-active* and sub-sleep* modes
32.768
Frequency (MHz)
0
3
3.5
4
4.5
5
5.5
6
Power supply voltage (V)
Note: * The watch, subactive, and subsleep modes are available in the U-mask and W-mask versions only.
Figure 24-3 Power Supply Voltage and Operating Ranges
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24.2.3
DC Characteristics
Table 24-12 lists the DC characteristics. Table 24-13 lists the permissible output currents. Table 24-12 DC Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)*1 *6
Item Schmitt trigger input voltage Input high voltage Symbol IRQ0 to IRQ5 VT VT RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4 and 9 Input low voltage RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4, 9 VIL
– + + –
Min. 1.0 — 0.4 VCC – 0.7
Typ. — — — —
Max. — VCC × 0.7 — VCC + 0.3
Unit V
Test Conditions
VT – VT VIH
V
VCC × 0.7 2.2 VCC × 0.8
— — —
VCC + 0.3 VCC + 0.3 VCC + 0.3 PWMVCC + 0.3 VCC + 0.3 AVCC + 0.3 0.5 V
PWMVCC × — 0.8 2.2 —
AVCC × 0.7 — –0.3 —
–0.3 –0.3 –0.3 –0.3 –0.3 –0.3
— — — — — —
0.8 0.8 VCC × 0.2 PWMVCC × 0.2 VCC × 0.2 AVCC × 0.2
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Section 24 Electrical Characteristics
Item Output high voltage
Symbol Ports 1, 3, VOH A to F, H,J HTxD0, HTxD1 (excluding P34 7 and P35* ) 7 P34, P35* Ports 1, 3, A to F, H, J HTxD0, HTxD1 (excluding P34 7 and P35* ) PWM1A to PWM1H, PWM2A to PWM2H
Min. VCC – 0.5
Typ. —
Max. —
Unit V
Test Conditions IOH = –200 µA
VCC – 2.5 3.5
— —
— —
IOH = –100 µA IOH = –1 mA
PWMVCC – 0.5
—
IOH = –15 mA
Output low voltage
All output pins VOL except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
—
—
0.4
V
IOL = 1.6 mA
—
—
0.5
V
IOL = 15 mA
Input leakage current
RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9
| Iin |
— — — —
— — — —
1.0 1.0 1.0 1.0 1.0
μA
Vin = 0.5 V to VCC – 0.5 V
Vin = 0.5 V to AVCC – 0.5 V μA Vin = 0.5 V to VCC – 0.5 V
Three-state leakage current (off state)
Ports 1, 3, A to F, H, J HTxD0, HTxD1
⏐ITSI⏐
—
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Item MOS input Ports A to E pull-up current Input capacitance RES NMI All input pins except RES and NMI Current 2 dissipation* Normal operation Sleep mode All modules stopped Medium-speed mode (φ/32) Subactive 5 mode* Subsleep 5 mode* Watch mode* Standby 3 mode* Analog power supply current Reference current During A/D and D/A conversion Idle During A/D and D/A conversion Idle RAM standby voltage
5
Symbol –IP Cin
Min. 50 — — —
Typ.
Max. 300
Unit μA pF
Test Conditions Vin = 0 V Vin = 0 V f = 1 MHz Ta = 25°C
— — —
30 30 15
ICC*
4
— — — — —
75 65 57 49 130
90 80 — — 220
mA
f = 20 MHz
mA
f = 20 MHz (reference value)
µA
Using 32.768 kHz crystal resonator
— — — — AlCC —
80 30 2.0 — 1.0
160 60 5.0 20 2.0 mA µA Ta ≤ 50°C 50°C < Ta AVCC = 5.0 V
— AlCC —
0.1 4.0
5.0 5.0
µA mA Vref = 5.0 V
— VRAM 2.0
0.1 —
5.0 —
µA V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref , and AVSS pins open. Apply a voltage between 4.5 V and 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC. 2. Current dissipation values are for VIH (min.) = VCC – 0.5 V, VIL (max.) = 0.5 V with all output pins unloaded and the on-chip pull-up resistors in the off state. 3. The values are for VRAM ≤ VCC < 3.0 V, VIH (min.) = VCC × 0.9, and VIL (max.) = 0.3 V.
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Section 24 Electrical Characteristics
4. ICC depends on VCC and f as follows: ICC (max.) = 30 (mA) + 0.54 (mA/(MHz × V)) × VCC × f (normal operation) ICC (max.) = 30 (mA) + 0.45 (mA/(MHz × V)) × VCC × f (sleep mode) 5. The watch, subactive, and subsleep modes are available in the U-mask and W-mask versions only. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 6. If the motor-control PWM timer is not used, do not leave the PMWVCC, or PMWVSS pins open. If the motor-control PWM timer is not used, apply a voltage of between 4.5 and 5.5 V to the PWMVCC pin, for instance, by connecting it to VCC. 7. The characteristics of pins 34 and 35 apply to the W-mask version.
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Table 24-13 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Permissible output low current (per pin) All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H Symbol IOL Min. — Typ. — Max. 10 Unit mA Test condition
IOL
— — —
— — — —
25 30 40 80
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output low excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
∑ IOL
—
Total of PWM1A to PWM1H, ∑ IOL and PWM2A to PWM2H
— — — —
— — — —
150 180 220 2.0
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible output high current (per pin)
All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
–IOH
–IOH
— — —
— — — —
25 30 40 40
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output high excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
–∑ IOH
—
Total of PWM1A to PWM1H, –∑ IOH and PWM2A to PWM2H
— — —
— — —
150 180 220
mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Note: To protect chip reliability, do not exceed the output current values in table 24-13.
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Section 24 Electrical Characteristics
Table 24-14 Bus Drive Characteristics [Option]* Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Applicable Pins: SCL1-0, SDA1-0
Item Schmitt trigger input voltage Symbol VT VT
– + + –
Min. 1.0 — 0.4 VCC × 0.7 – 0.5 — — —
Typ. — — — — — — — — — — —
Max. — VCC × 0.7 — VCC + 0.5 VCC × 0.3 0.7 0.4 0.4 20 1.0 250
Unit V
Test Conditions
VT – VT Input high voltage Input low voltage Output low voltage VIH VIL VOL
VCC = 4.5 V to 5.5 V V V V IOL = 8 mA, VCC = 4.5 V to 5.5 V IOL = 3 mA, VCC = 4.5 V to 5.5 V IOL = 1.6 mA, VCC = 3.3 V to 5.5 V pF μA ns Vin = 0 V, f = 1 MHz, Ta = 25 °C Vin = 0.5 V to VCC – 5.5 V
Input capacitance Three-state leakage current (off state) SCL, SDA, output fall time
Cin ⏐ITSI⏐ tof
2
— — 20 + 0.1Cb
Note: * Available when using I C bus interface (the W-mask version only).
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24.2.4
AC Characteristics
Figure 24-4 show, the test conditions for the AC characteristics.
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
Figure 24-4 Output Load Circuit
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Section 24 Electrical Characteristics
(1) Clock Timing Table 24-15 lists the clock timing Table 24-15 Clock Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition 20MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) External clock output stabilization delay time 32-kHz clock oscillation settling time Subclock oscillator frequency Subclock (φSUB) cycle time Symbol tcyc tCH tCL tCr tCf tOSC1 tOSC2 tDEXT tOSC3 fSUB tSUB Min. 50 15 15 — — 20 8 2 — 32.768 30.5 Max. 250 — — 10 10 — — — 2 Unit ns ns ns ns ns ms ms ms s kHz μs Figure 24-10 Figure 23A-3 Figure 23B-3 Figure 24-10 Test Conditions Figure 24-9
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(2) Control Signal Timing Table 24-16 lists the control signal timing. Table 24-16 Control Signal Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item RES setup time RES pulse width NMI setup time NMI hold time NMI pulse width (exiting software standby mode) IRQ setup time IRQ hold time IRQ pulse width (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW tIRQS tIRQH tIRQW Min. 200 20 150 10 200 150 10 200 Max. — — — — — — — — ns ns ns ns Unit ns tcyc ns Figure 24-12 Test Conditions Figure 24-11
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Section 24 Electrical Characteristics
(3) Bus Timing Table 24-17 lists the bus timing. Table 24-17 Bus Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Address delay time Address setup time Address hold time AS delay time RD delay time 1 RD delay time 2 Read data setup time Read data hold time Read data access time1 Read data access time2 Read data access time3 Read data access time 4 Read data access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 Write data delay time Write data setup time Write data hold time Symbol tAD tAS tAH tASD tRSD1 tRSD2 tRDS tRDH tACC1 tACC2 tACC3 tACC4 tACC5 tWRD1 tWRD2 tWSW1 tWSW2 tWDD tWDS tWDH Min. — 0.5 × tcyc – 20 0.5 × tcyc – 15 — — — 20 0 — — — — — — — 1.0 × tcyc – 20 1.5 × tcyc – 20 — 0.5 × tcyc – 20 0.5 × tcyc – 10 Max. 35 — — 20 20 20 — — 1.0 × tcyc – 48 1.5 × tcyc – 45 2.0 × tcyc – 45 2.5 × tcyc – 45 3.0 × tcyc – 50 20 20 — — 30 — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 24-13 to Figure 24-17
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(4) Timing of On-Chip Supporting Modules Table 24-18 lists the timing of on-chip supporting modules. Table 24-18 Timing of On-Chip Supporting Modules Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item I/O port Output data delay time Output data delay time 2 Input data setup time Input data hold time PPG TPU Pulse output delay time Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width PWM SCI Single edge Both edges Symbol tPWD tPWD2 tPRS tPRH tPOD tTOCD tTICS tTCKS tTCKWH tTCKWL tMPWMOD Min. — — 30 30 — — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD tRXS tRXH tTRGS 0.4 — — — 50 50 50 Max. 50 50 — — 50 50 — — — — 50 — — 0.6 1.5 1.5 50 — — — ns Figure 24-26 ns Figure 24-25 tScyc tcyc ns tcyc Figure 24-23 Figure 24-24 ns tcyc Figure 24-22 ns ns Figure 24-20 Figure 24-21 Unit ns Test Conditions Figure 24-18 Figure 24-19
Pulse output delay time Input clock cycle Synchronous
Asynchronous tScyc
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) A/D Trigger input setup time converter
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Section 24 Electrical Characteristics
Condition Item HCAN* Transmit data delay time Receive data setup time Receive data hold time Symbol tHTXD tHRXS tHRXH Min. — 100 100 Max. 100 — — Unit ns Test Conditions Figure 24-27
Note: * The HCAN input signal is asynchronous. However, its state is judged to have changed at the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27. The HCAN output signal is also asynchronous. Its state changes based on the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27.
Table 24-19 I2C Bus Timing [Option]*1 Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, φ = 5 MHz to maximum operating frequency, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load
2
Symbol tSCL tSCLH tSCLL tSr tSf tSP tBUF tSTAH tSTAS tSTOS tSDAS tSDAH Cb
Min. 12 tcyc 3 tcyc 5 tcyc — — — 5 tcyc 3 tcyc 3 tcyc 3 tcyc 0.5 tcyc 0 —
Typ. — — — — — — — — — — — — —
Max. — — — 7.5 tcyc 300 1 tcyc — — — — — — 400 *2
Unit ns ns ns ns ns ns ns ns ns ns ns ns pF
Notes Figure 24-28
Notes: 1. Available when using I C bus interface (the W-mask version only). 2 2. 17.5 tcyc can be set according to the clock selected for use by the I C module. For details, see section 15.4, Usage Notes.
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24.2.5
A/D Conversion Characteristics
Table 24-20 lists the A/D conversion characteristics. Table 24-20 A/D Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization Absolute accuracy Min. 10 10 — — — — — — — Typ. 10 — — — — — — ±0.5 — Max. 10 — 20 5 ±3.5 ±3.5 ±3.5 — ±4.0 Unit bits µs pF kΩ LSB LSB LSB LSB LSB
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Section 24 Electrical Characteristics
24.2.6
D/A Conversion Characteristics
Table 24-21 shows the D/A conversion characteristics. Table 24-21 D/A Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Absolute accuracy Min. 8 — — — Typ. 8 — ± 1.5 — Max. 8 10 ± 2.0 ± 1.5 Unit bits µs LSB LSB 20-pF capacitive load 2-MΩ resistive load 4-MΩ resistive load Test Conditions
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24.2.7
Flash Memory Characteristics
Table 24-22 shows the flash memory characteristics. Table 24-22 Flash Memory Characteristics Conditions: VCC =4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS, AVSS = 0 V Ta = 0 to +75°C (Programming/erasing operating temperature range: regular specification)
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting*1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min. — — — 1 50 28 198 8 Typ. 10 100 — 1 50 30 200 10 Max. 200 1200 100 — — 32 202 12 Unit ms/ 128 bytes ms/block Times µs µs µs µs µs Programming time wait Programming time wait Additionalprogramming time wait Test Condition
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear*1 Wait time after SWE bit clear*1 Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1
tcp tcpsu tspv tspvr tcpv tcswe
5 5 4 2 2 100 — 1 100 10 10 10 20
5 5 4 2 2 100 — 1 100 10 10 10 20
— — — — — — 1000 — — 100 — — —
µs µs µs µs µs µs Times µs µs ms µs µs µs Erase time wait
Maximum programming count*1 *4 N Erase tsswe tsesu tse tce tcesu tsev
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Section 24 Electrical Characteristics
Item Erase Wait time after H'FF dummy write*1 Wait time after EV bit clear*1 Wait time after SWE bit clear*1 Maximum erase count*1 *5
Symbol tsevr tcev tcswe N
Min. 2 4 100 12
Typ. 2 4 100 —
Max. — — — 120
Unit µs µs µs Times
Test Condition
Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time) 4. To specify the maximum programming time value (tP (max.)) in the 128-byte programming algorithm, set the max. value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 µs Programming counter (n) = 7 to 1000: tsp200 = 200 µs [In additional programming] Programming counter (n)= 1 to 6: tsp10 = 10 µs 5. For the maximum erase time (tE (max.)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE (max.) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of (tse) and (N) should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.3
24.3.1
H8S/2639 Group, H8S/2635 Group Electrical Characteristics
Absolute Maximum Ratings
Table 24-23 lists the absolute maximum ratings. Table 24-23 Absolute Maximum Ratings
Item Power supply voltage Input voltage (XTAL*, EXTAL) Input voltage (ports 4 and 9) Input voltage (ports H and J) Input voltage (except XTAL, EXTAL, ports 4, 9, H and J) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature Symbol VCC Vin Vin Vin Vin Vref AVCC VAN Topr Tstg Value –0.3 to +7.0 –0.3 to VCC +0.3 –0.3 to AVCC +0.3 –0.3 to PWMVCC +0.3 –0.3 to VCC +0.3 –0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 –55 to +125 Unit V V V V V V V V °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded. Note: * In the case of the H8S/2635 Group, do not input a signal to the XTAL pin.
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Section 24 Electrical Characteristics
24.3.2
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 24-5.
Operating range of high-speed, medium-speed and sleep modes 24 20
Frequency (MHz)*1
16 12 8 4 0 3 3.5 4 4.5 5 5.5 6
Power supply voltage (V)
Operating range of watch, sub-active and sub-sleep modes
φSUB
Frequency (MHz)*2
0
3
3.5
4
4.5
5
5.5
6
Power supply voltage (V)
Notes: 1. An input clock frequency of 4 to 5 MHz should be used. For operation at 20 MHz, input a 5 MHz clock and use the PLL to multiply it (×4). 2. The maximum internal φSUB frequency is 39.06 kHz (5 MHz/128).
Figure 24-5 Power Supply Voltage and Operating Ranges
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.3.3
DC Characteristics
Table 24-24 lists the DC characteristics. Table 24-25 lists the permissible output currents. Table 24-24 DC Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)*1 *5
Item Schmitt trigger input voltage Input high voltage Symbol IRQ0 to IRQ5 VT VT RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, 7 HRxD1* Ports 4 and 9 Input low voltage RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, 7 HRxD1* Ports 4, 9 VIL
– + + –
Min. 1.0 — 0.4 VCC – 0.7
Typ. — — — —
Max. — VCC × 0.7 — VCC + 0.3
Unit V
Test Conditions
VT – VT VIH
V
VCC × 0.7 2.2 VCC × 0.8
— — —
VCC + 0.3 VCC + 0.3 VCC + 0.3 PWMVCC + 0.3 VCC + 0.3 AVCC + 0.3 0.5 V
PWMVCC × — 0.8 2.2 —
AVCC × 0.7 — –0.3 —
–0.3 –0.3 –0.3 –0.3 –0.3 –0.3
— — — — — —
0.8 0.8 VCC × 0.2 PWMVCC × 0.2 VCC × 0.2 AVCC × 0.2
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Section 24 Electrical Characteristics
Item Output high voltage
Symbol Ports 1, 3, VOH A to F, H,J HTxD0, 7 HTxD1* (excluding P34 6 and P35* ) 6 P34, P35* Ports 1, 3, A to F, H, J HTxD0, 7 HTxD1* (excluding P34 6 and P35* ) PWM1A to PWM1H, PWM2A to PWM2H
Min. VCC – 0.5
Typ. —
Max. —
Unit V
Test Conditions IOH = –200 µA
VCC – 2.5 3.5
— —
— —
IOH = –100 µA IOH = –1 mA
PWMVCC – — 0.5
—
IOH = –15 mA
Output low voltage
All output pins VOL except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
—
—
0.4
V
IOL = 1.6 mA
—
—
0.5
V
IOL = 15 mA
Input leakage current
RES STBY, NMI, MD2 to MD0 HRxD0, 7 HRxD1* , FWE Ports 4, 9
| Iin |
— — —
— — —
1.0 1.0 1.0
μA
Vin = 0.5 V to VCC – 0.5 V
— ⏐ITSI⏐ —
— —
1.0 1.0 μA
Vin = 0.5 V to AVCC – 0.5 V Vin =0.5 V to VCC – 0.5 V
Three-state leakage current (off state)
Ports 1, 3, A to F, H, J HTxD0, 7 HTxD1*
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Item MOS input Ports A to E pull-up current Input capacitance RES NMI All input pins except RES and NMI Current 2 dissipation* (H8S/2639 Group) Normal operation Sleep mode All modules stopped Medium-speed mode (φ/32) Subactive mode Subsleep mode Watch mode Standby 3 mode* Current 2 dissipation* (H8S/2635 Group) Normal operation Sleep mode All modules stopped Mediumspeed mode (φ/32) Subactive mode Subsleep mode Watch mode Standby mode
Symbol –IP Cin
Min. 50 — — —
Typ. — — — —
Max. 300 30 30 15
Unit μA pF
Test Conditions Vin = 0 V Vin = 0 V f = 1 MHz Ta = 25°C
ICC*
4
— — — — — — — — —
75 65 57 49 0.7 0.7 0.6 2.0 — 60 50 40 45
90 80 — — 1.0 1.0 1.0 5.0 20 65 55 — —
mA
f = 20 MHz
mA
f = 20 MHz (reference value)
mA
Subclock (using 4.19 MHz crystal oscillator)
µA mA
Ta ≤ 50°C 50°C < Ta f = 20 MHz
8 ICC*
— — — —
mA
f = 20 MHz (reference value)
— — — — —
0.35 0.3 0.25 2.0 —
0.4 0.35 0.3 5.0 20
mA
Subclock (using 5.0 MHz crystal oscillator)
µA
Ta ≤ 50°C 50°C < Ta
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Section 24 Electrical Characteristics
Item Analog power supply current Reference current During A/D 7 and D/A* conversion Idle During A/D 7 and D/A* conversion Idle RAM standby voltage
Symbol AlCC
Min. —
Typ. 1.0
Max. 2.0
Unit mA
Test Conditions AVCC = 5.0 V
— AlCC —
0.1 4.0
5.0 5.0
µA mA Vref = 5.0 V
— VRAM 2.0
0.1 —
5.0 —
µA V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref , and AVSS pins open. Apply a voltage between 4.5 V and 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC. 2. Current dissipation values are for VIH (min.) = VCC – 0.5 V, VIL (max.) = 0.5 V with all output pins unloaded and the on-chip pull-up resistors in the off state. 3. The values are for VRAM ≤ VCC < 3.0 V, VIH (min.) = VCC × 0.9, and VIL (max.) = 0.3 V. 4. ICC depends on VCC and f as follows: ICC (max.) = 30 (mA) + 0.54 (mA/(MHz × V)) × VCC × f (normal operation) ICC (max.) = 30 (mA) + 0.45 (mA/(MHz × V)) × VCC × f (sleep mode) 5. If the motor-control PWM timer is not used, do not leave the PMWVCC, or PMWVSS pins open. If the motor-control PWM timer is not used, apply a voltage of between 4.5 and 5.5 V to the PWMVCC pin, for instance, by connecting it to VCC. 6. The characteristics of pins 34 and 35 apply to the W-mask version. 7. The HTxD1, HRxD1 pins, and D/A converter are not available in the H8S/2635 Group. 8. ICC depends on VCC and f as follows: ICC (max.) = 17 (mA) + 0.43 (mA/(MHz × V)) × VCC × f (normal operation) ICC (max.) = 17 (mA) + 0.34 (mA/(MHz × V)) × VCC × f (sleep mode)
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table 24-25 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Permissible output low current (per pin) All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H Symbol IOL Min. — Typ. — Max. 10 Unit mA Test condition
IOL
— — —
— — — —
25 30 40 80
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins excepting PWM1A to output low current (total) PWM1H, and PWM2A to PWM2H
∑ IOL
—
Total of PWM1A to PWM1H, ∑ IOL and PWM2A to PWM2H
— — — —
— — — —
150 180 220 2.0
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible output high current (per pin)
All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
–IOH
–IOH
— — —
— — — —
25 30 40 40
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins excepting PWM1A to output high current (total) PWM1H, and PWM2A to PWM2H
–∑ IOH
—
Total of PWM1A to PWM1H, –∑ IOH and PWM2A to PWM2H
— — —
— — —
150 180 220
mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Note: To protect chip reliability, do not exceed the output current values in table 24-25.
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Section 24 Electrical Characteristics
Table 24-26 Bus Drive Characteristics [Option]* Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Applicable Pins: SCL1 to 0, SDA1 to 0
Item Schmitt trigger input voltage Input high voltage Input low voltage Output low voltage Symbol VT + VT + – VT – VT VIH VIL VOL
–
Min. 1.0 — 0.4 VCC × 0.7 – 0.5 — — —
Typ. — — — — — — — — — — —
Max. — VCC × 0.7 — VCC + 0.5 VCC × 0.3 0.7 0.4 0.4 20 1.0 250
Unit V
Test Conditions
VCC = 4.5 V to 5.5 V V V V
Input capacitance Three-state leakage current (off state) SCL, SDA, output fall time
Cin ⏐ITSI⏐ tof
2
— — 20 + 0.1Cb
pF μA ns
IOL = 8 mA, VCC = 4.5 V to 5.5 V IOL = 3 mA, VCC = 4.5 V to 5.5 V IOL = 1.6 mA, VCC = 3.3 V to 5.5 V Vin = 0 V, f = 1MHz, Ta = 25 °C Vin = 0.5 V to VCC – 5.5 V
Note: * Available when using the I C bus interface (the W-mask version only).
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.3.4
AC Characteristics
Figure 24-6 show, the test conditions for the AC characteristics.
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
Figure 24-6 Output Load Circuit
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Section 24 Electrical Characteristics
(1) Clock Timing Table 24-27 lists the clock timing Table 24-27 Clock Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition 20MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) (H8S/2639 Group) Clock oscillator settling time in software standby (crystal) (H8S/2635 Group) External clock output stabilization delay time Subclock oscillator frequency Subclock (φSUB) cycle time tDEXT fSUB tSUB Symbol tcyc tCH tCL tCr tCf tOSC1 tOSC2 Min. 50 15 15 — — 20 8 Max. 250 — — 10 10 — — Unit ns ns ns ns ns ms ms Figure 24-10 Figure 23A-3 Figure 23B-3 Test Conditions Figure 24-9
12
—
2 31.25 25.6
— 39.6 32.0
ms kHz μs
Figure 24-10
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
(2) Control Signal Timing Table 24-28 lists the control signal timing. Table 24-28 Control Signal Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item RES setup time RES pulse width NMI setup time NMI hold time NMI pulse width (exiting software standby mode) IRQ setup time IRQ hold time IRQ pulse width (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW tIRQS tIRQH tIRQW Min. 200 20 150 10 200 150 10 200 Max. — — — — — — — — ns ns ns ns Unit ns tcyc ns Figure 24-12 Test Conditions Figure 24-11
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Section 24 Electrical Characteristics
(3) Bus Timing Table 24-29 lists the bus timing. Table 24-29 Bus Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Address delay time Address setup time Address hold time AS delay time RD delay time 1 RD delay time 2 Read data setup time Read data hold time Read data access time1 Read data access time2 Read data access time3 Read data access time 4 Read data access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 Write data delay time Write data setup time Write data hold time Symbol tAD tAS tAH tASD tRSD1 tRSD2 tRDS tRDH tACC1 tACC2 tACC3 tACC4 tACC5 tWRD1 tWRD2 tWSW1 tWSW2 tWDD tWDS tWDH Min. — 0.5 × tcyc – 20 0.5 × tcyc – 15 — — — 20 0 — — — — — — — 1.0 × tcyc – 20 1.5 × tcyc – 20 — 0.5 × tcyc – 20 0.5 × tcyc – 10 Max. 35 — — 20 20 20 — — 1.0 × tcyc – 48 1.5 × tcyc – 45 2.0 × tcyc – 45 2.5 × tcyc – 45 3.0 × tcyc – 50 20 20 — — 30 — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 24-13 to Figure 24-17
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
(4) Timing of On-Chip Supporting Modules Table 24-30 lists the timing of on-chip supporting modules. Table 24-30 Timing of On-Chip Supporting Modules Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item I/O port Output data delay time Output data delay time 2 Input data setup time Input data hold time
1 PPG*
Symbol tPWD tPWD2 tPRS tPRH tPOD tTOCD tTICS tTCKS tTCKWH tTCKWL tMPWMOD tScyc tSCKW tSCKr tSCKf tTXD tRXS tRXH tTRGS
Min. — — 30 30 — — 30 30 1.5 2.5 — 4 6 0.4 — — — 50 50 50
Max. 50 50 — — 50 50 — — — — 50 — — 0.6 1.5 1.5 50 — — —
Unit ns
Test Conditions Figure 24-18 Figure 24-19
Pulse output delay time Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges Asynchronous Synchronous
ns ns ns tcyc ns tcyc tScyc tcyc ns
Figure 24-20 Figure 24-21 Figure 24-22
TPU
PWM SCI
Pulse output delay time Input clock cycle
Figure 24-23 Figure 24-24
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) A/D Trigger input setup time converter
Figure 24-25
ns
Figure 24-26
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Section 24 Electrical Characteristics
Condition Item HCAN *2 Transmit data delay time Receive data setup time Receive data hold time Symbol tHTXD tHRXS tHRXH Min. — 100 100 Max. 100 — — Unit ns Test Conditions Figure 24-27
Notes: 1. The PPG output is not available in the H8S2635 Group. 2. The HCAN input signal is asynchronous. However, its state is judged to have changed at the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27. The HCAN output signal is also asynchronous. Its state changes based on the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27.
Table 24-31 I2C Bus Timing [Option]*1 Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, φ = 5 MHz to maximum operating frequency, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load
2
Symbol tSCL tSCLH tSCLL tSr tSf tSP tBUF tSTAH tSTAS tSTOS tSDAS tSDAH Cb
Min. 12 tcyc 3 tcyc 5 tcyc — — — 5 tcyc 3 tcyc 3 tcyc 3 tcyc 0.5 tcyc 0 —
Typ. — — — — — — — — — — — — —
Max. — — —
Unit ns ns ns
Notes Figure 24-28
2 7.5 tcyc* ns
300 1 tcyc — — — — — — 400
ns ns ns ns ns ns ns ns pF
Notes: 1. Available when using I C bus interface (the W-mask version only). 2 2. 17.5 tcyc can be set according to the clock selected for use by the I C module. For details, see section 15.4, Usage Notes.
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.3.5
A/D Conversion Characteristics
Table 24-32 lists the A/D conversion characteristics. Table 24-32 A/D Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization Absolute accuracy Min. 10 10 — — — — — — — Typ. 10 — — — — — — ±0.5 — Max. 10 — 20 5 ±3.5 ±3.5 ±3.5 — ±4.0 Unit bits µs pF kΩ LSB LSB LSB LSB LSB
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Section 24 Electrical Characteristics
24.3.6
D/A Conversion Characteristics*
Table 24-33 shows the D/A conversion characteristics. Note: * The D/A conversion is not implemented in the H8S/2635 and H8S/2634. Table 24-33 D/A Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Absolute accuracy Min. 8 — — — Typ. 8 — ± 1.5 — Max. 8 10 ± 2.0 ± 1.5 Unit bits µs LSB LSB 20-pF capacitive load 2-MΩ resistive load 4-MΩ resistive load Test Conditions
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.3.7
Flash Memory Characteristics
Table 24-34 shows the flash memory characteristics. Table 24-34 Flash Memory Characteristics Conditions: VCC =4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS, AVSS = 0 V Ta = 0 to +75°C (Programming/erasing operating temperature range: regular specification)
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting*1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min. — — — 1 50 28 198 8 Typ. 10 100 — 1 50 30 200 10 Max. 200 1200 100 — — 32 202 12 Unit ms/ 128 bytes ms/block Times µs µs µs µs µs Programming time wait Programming time wait Additionalprogramming time wait Test Condition
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear*1 Wait time after SWE bit clear*1 Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1
tcp tcpsu tspv tspvr tcpv tcswe
5 5 4 2 2 100 — 1 100 10 10 10 20
5 5 4 2 2 100 — 1 100 10 10 10 20
— — — — — — 1000 — — 100 — — —
µs µs µs µs µs µs Times µs µs ms µs µs µs Erase time wait
Maximum programming count*1 *4 N Erase tsswe tsesu tse tce tcesu tsev
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Section 24 Electrical Characteristics
Item Erase Wait time after H'FF dummy write*1 Wait time after EV bit clear*1 Wait time after SWE bit clear*1 Maximum erase count*1 *5
Symbol tsevr tcev tcswe N
Min. 2 4 100 12
Typ. 2 4 100 —
Max. — — — 120
Unit µs µs µs Times
Test Condition
Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time) 4. To specify the maximum programming time value (tP (max.)) in the 128-byte programming algorithm, set the max. value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 µs Programming counter (n) = 7 to 1000: tsp200 = 200 µs [In additional programming] Programming counter (n)= 1 to 6: tsp10 = 10 µs 5. For the maximum erase time (tE (max.)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE (max.) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of (tse) and (N) should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times
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Section 24 Electrical Characteristics
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24.4
24.4.1
H8S/2630 Group Electrical Characteristics
Absolute Maximum Ratings
Table 24-35 lists the absolute maximum ratings. Table 24-35 Absolute Maximum Ratings
Item Power supply voltage Input voltage (OSC1, OSC2) Input voltage (XTAL, EXTAL) Input voltage (ports 4 and 9) Input voltage (ports H and J) Symbol VCC Vin Vin Vin Vin Value –0.3 to +7.0 –0.3 +4.3 –0.3 to VCC +0.3 –0.3 to AVCC +0.3 –0.3 to PWMVCC +0.3 –0.3 to VCC +0.3 Unit V V V V V V
Input voltage (except XTAL, Vin EXTAL, OSC1, OSC2, ports 4, 9, H and J) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature Vref AVCC VAN Topr Tstg
–0.3 to AVCC +0.3 –0.3 to +7.0 –0.3 to AVCC +0.3 Regular specifications: –20 to +75 Wide-range specifications: –40 to +85 –55 to +125
V V V °C °C °C
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded.
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Section 24 Electrical Characteristics
24.4.2
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 24-7.
Operating range of high-speed, medium-speed and sleep modes 24 20
Frequency (MHz)
16 12 8 4 0 3 3.5 4 4.5 5 5.5 6
Power supply voltage (V)
Operating range of watch*, sub-active* and sub-sleep* modes
32.768
Frequency (MHz)
0
3
3.5
4
4.5
5
5.5
6
Power supply voltage (V)
Note: * The watch, subactive, and subsleep modes are available in the U-mask and W-mask versions only.
Figure 24-7 Power Supply Voltage and Operating Ranges
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24.4.3
DC Characteristics
Table 24-36 lists the DC characteristics. Table 24-36 lists the permissible output currents. Table 24-36 DC Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)*1 *6
Item Schmitt trigger input voltage Input high voltage Symbol IRQ0 to IRQ5 VT VT RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4 and 9 Input low voltage RES, STBY, NMI, FWE, MD2 to MD0 EXTAL Ports 1, 3, F Ports A to E Ports H, J HRxD0, HRxD1 Ports 4, 9 VIL
– + + –
Min. 1.0 — 0.4 VCC – 0.7
Typ. — — — —
Max. — VCC × 0.7 — VCC + 0.3
Unit V
Test Conditions
VT – VT VIH
V
VCC × 0.7 2.2 VCC × 0.8
— — —
VCC + 0.3 VCC + 0.3 VCC + 0.3 PWMVCC + 0.3 VCC + 0.3 AVCC + 0.3 0.5 V
PWMVCC × — 0.8 2.2 —
AVCC × 0.7 — –0.3 —
–0.3 –0.3 –0.3 –0.3 –0.3 –0.3
— — — — — —
0.8 0.8 VCC × 0.2 PWMVCC × 0.2 VCC × 0.2 AVCC × 0.2
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Section 24 Electrical Characteristics
Item Output high voltage
Symbol Ports 1, 3, VOH A to F, H,J HTxD0, HTxD1 (excluding P34 7 and P35* ) 7 P34, P35* Ports 1, 3, A to F, H, J HTxD0, HTxD1 (excluding P34 7 and P35* ) PWM1A to PWM1H, PWM2A to PWM2H
Min. VCC – 0.5
Typ. —
Max. —
Unit V
Test Conditions IOH = –200 µA
VCC – 2.5 3.5
— —
— —
IOH = –100 µA IOH = –1 mA
PWMVCC – — 0.5
—
IOH = –15 mA
Output low voltage
All output pins VOL except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
—
—
0.4
V
IOL = 1.6 mA
—
—
0.5
V
IOL = 15 mA
Input leakage current
RES STBY, NMI, MD2 to MD0 HRxD0, HRxD1, FWE Ports 4, 9
| Iin |
— — — —
— — — — —
1.0 1.0 1.0 1.0 1.0
μA
Vin = 0.5 V to VCC – 0.5 V
Vin = 0.5 V to AVCC – 0.5 V μA Vin = 0.5 V to VCC – 0.5 V
Three-state leakage current (off state)
Ports 1, 3, A to F, H, J HTxD0, HTxD1
⏐ITSI⏐
—
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Item MOS input Ports A to E pull-up current Input capacitance RES NMI All input pins except RES and NMI Current 2 dissipation* Normal operation Sleep mode All modules stopped Medium-speed mode (φ/32) Subactive 5 mode* Subsleep 5 mode* Watch mode* Standby 3 mode* Analog power supply current Reference current During A/D and D/A conversion Idle During A/D and D/A conversion Idle RAM standby voltage
5
Symbol –IP Cin
Min. 50 — — —
Typ. — — — —
Max. 300 30 30 15
Unit μA pF
Test Conditions Vin = 0 V Vin = 0 V f = 1 MHz Ta = 25°C
ICC*
4
— — — — —
75 65 57 49 130
90 80 — — 220
mA
f = 20 MHz
mA
f = 20 MHz (reference value)
µA
Using 32.768 kHz crystal resonator
— — — — AlCC —
80 30 2.0 — 1.0
160 60 5.0 20 2.0 mA µA Ta ≤ 50°C 50°C < Ta AVCC = 5.0 V
— AlCC —
0.1 4.0
5.0 5.0
µA mA Vref = 5.0 V
— VRAM 2.0
0.1 —
5.0 —
µA V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref , and AVSS pins open. Apply a voltage between 4.5 V and 5.5 V to the AVCC and Vref pins by connecting them to VCC, for instance. Set Vref ≤ AVCC. 2. Current dissipation values are for VIH (min.) = VCC – 0.5 V, VIL (max.) = 0.5 V with all output pins unloaded and the on-chip pull-up resistors in the off state. 3. The values are for VRAM ≤ VCC < 3.0 V, VIH (min.) = VCC × 0.9, and VIL (max.) = 0.3 V.
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Section 24 Electrical Characteristics
4. ICC depends on VCC and f as follows: ICC (max.) = 30 (mA) + 0.54 (mA/(MHz × V)) × VCC × f (normal operation) ICC (max.) = 30 (mA) + 0.45 (mA/(MHz × V)) × VCC × f (sleep mode) 5. The watch, subactive, and subsleep modes are available in the U-mask and W-mask versions only. See section 22A.7, Subclock Oscillator, for the method of fixing pins OSC1 and OSC2. 6. If the motor-control PWM timer is not used, do not leave the PMWVCC, or PMWVSS pins open. If the motor-control PWM timer is not used, apply a voltage of between 4.5 and 5.5 V to the PWMVCC pin, for instance, by connecting it to VCC. 7. The characteristics of pins 34 and 35 apply to the W-mask version.
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Table 24-37 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Item Permissible output low current (per pin) All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H Symbol IOL Min. — Typ. — Max. 10 Unit mA Test condition
IOL
— — —
— — — —
25 30 40 80
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output low excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
∑ IOL
—
Total of PWM1A to PWM1H, ∑ IOL and PWM2A to PWM2H
— — — —
— — — —
150 180 220 2.0
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible output high current (per pin)
All output pins except PWM1A to PWM1H, PWM2A to PWM2H PWM1A to PWM1H, PWM2A to PWM2H
–IOH
–IOH
— — —
— — — —
25 30 40 40
mA mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Permissible Total of all output pins output high excepting PWM1A to current (total) PWM1H, and PWM2A to PWM2H
–∑ IOH
—
Total of PWM1A to PWM1H, –∑ IOH and PWM2A to PWM2H
— — —
— — —
150 180 220
mA mA mA
Ta = 85°C Ta = 25°C Ta = –40°C
Note: To protect chip reliability, do not exceed the output current values in table 24-37.
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Section 24 Electrical Characteristics
Table 24-38 Bus Drive Characteristics [Option]* Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications) Applicable Pins: SCL1-0, SDA1-0
Item Schmitt trigger input voltage Symbol VT VT
– + + –
Min. 1.0 — 0.4 VCC × 0.7 – 0.5 — — —
Typ. — — — — — — — — — — —
Max. — VCC × 0.7 — VCC + 0.5 VCC × 0.3 0.7 0.4 0.4 20 1.0 250
Unit V
Test Conditions
VT – VT Input high voltage Input low voltage Output low voltage VIH VIL VOL
VCC = 4.5 V to 5.5 V V V V IOL = 8 mA, VCC = 4.5 V to 5.5 V IOL = 3 mA, VCC = 4.5 V to 5.5 V IOL = 1.6 mA, VCC = 3.3 V to 5.5 V pF μA ns Vin = 0 V, f = 1 MHz, Ta = 25 °C Vin = 0.5 V to VCC – 5.5 V
Input capacitance Three-state leakage current (off state) SCL, SDA, output fall time
Cin ⏐ITSI⏐ tof
2
— — 20 + 0.1Cb
Note: * Available when using I C bus interface (the W-mask version only).
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24.4.4
AC Characteristics
Figure 24-8 show, the test conditions for the AC characteristics.
5V
RL LSI output pin C RH
C = 50 pF: Ports 10 to 13, A to F (In case of expansion bus control signal output pin setting) C = 30 pF: All ports except ports 10 to 13, A to F RL = 2.4 kΩ RH = 12 kΩ Input/output timing measurement levels • Low level: 0.8 V • High level: 2.0 V
Figure 24-8 Output Load Circuit
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Section 24 Electrical Characteristics
(1) Clock Timing Table 24-39 lists the clock timing Table 24-39 Clock Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition 20MHz Item Clock cycle time Clock high pulse width Clock low pulse width Clock rise time Clock fall time Clock oscillator settling time at reset (crystal) Clock oscillator settling time in software standby (crystal) External clock output stabilization delay time 32-kHz clock oscillation settling time Subclock oscillator frequency Subclock (φSUB) cycle time Symbol tcyc tCH tCL tCr tCf tOSC1 tOSC2 tDEXT tOSC3 fSUB tSUB Min. 50 15 15 — — 20 8 2 — 32.768 30.5 Max. 250 — — 10 10 — — — 2 Unit ns ns ns ns ns ms ms ms s kHz μs Figure 24-10 Figure 23A-3 Figure 23B-3 Figure 24-10 Test Conditions Figure 24-9
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(2) Control Signal Timing Table 24-40 lists the control signal timing. Table 24-40 Control Signal Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item RES setup time RES pulse width NMI setup time NMI hold time NMI pulse width (exiting software standby mode) IRQ setup time IRQ hold time IRQ pulse width (exiting software standby mode) Symbol tRESS tRESW tNMIS tNMIH tNMIW tIRQS tIRQH tIRQW Min. 200 20 150 10 200 150 10 200 Max. — — — — — — — — ns ns ns ns Unit ns tcyc ns Figure 24-12 Test Conditions Figure 24-11
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Section 24 Electrical Characteristics
(3) Bus Timing Table 24-41 lists the bus timing. Table 24-41 Bus Timing Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Address delay time Address setup time Address hold time AS delay time RD delay time 1 RD delay time 2 Read data setup time Read data hold time Read data access time1 Read data access time2 Read data access time3 Read data access time 4 Read data access time 5 WR delay time 1 WR delay time 2 WR pulse width 1 WR pulse width 2 Write data delay time Write data setup time Write data hold time Symbol tAD tAS tAH tASD tRSD1 tRSD2 tRDS tRDH tACC1 tACC2 tACC3 tACC4 tACC5 tWRD1 tWRD2 tWSW1 tWSW2 tWDD tWDS tWDH Min. — 0.5 × tcyc – 20 0.5 × tcyc – 15 — — — 20 0 — — — — — — — 1.0 × tcyc – 20 1.5 × tcyc – 20 — 0.5 × tcyc – 20 0.5 × tcyc – 10 Max. 35 — — 20 20 20 — — 1.0 × tcyc – 48 1.5 × tcyc – 45 2.0 × tcyc – 45 2.5 × tcyc – 45 3.0 × tcyc – 50 20 20 — — 30 — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 24-13 to Figure 24-17
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(4) Timing of On-Chip Supporting Modules Table 24-42 lists the timing of on-chip supporting modules. Table 24-42 Timing of On-Chip Supporting Modules Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item I/O port Output data delay time Output data delay time 2 Input data setup time Input data hold time PPG TPU Pulse output delay time Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width PWM SCI Single edge Both edges Symbol tPWD tPWD2 tPRS tPRH tPOD tTOCD tTICS tTCKS tTCKWH tTCKWL tMPWMOD Min. — — 30 30 — — 30 30 1.5 2.5 — 4 6 tSCKW tSCKr tSCKf tTXD tRXS tRXH tTRGS 0.4 — — — 50 50 50 Max. 50 50 — — 50 50 — — — — 50 — — 0.6 1.5 1.5 50 — — — ns Figure 24-26 ns Figure 24-25 tScyc tcyc ns tcyc Figure 24-23 Figure 24-24 ns tcyc Figure 24-22 ns ns Figure 24-20 Figure 24-21 Unit ns Test Conditions Figure 24-18 Figure 24-19
Pulse output delay time Input clock cycle Synchronous
Asynchronous tScyc
Input clock pulse width Input clock rise time Input clock fall time Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) A/D Trigger input setup time converter
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Section 24 Electrical Characteristics
Condition Item HCAN* Transmit data delay time Receive data setup time Receive data hold time Symbol tHTXD tHRXS tHRXH Min. — 100 100 Max. 100 — — Unit ns Test Conditions Figure 24-27
Note: * The HCAN input signal is asynchronous. However, its state is judged to have changed at the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27. The HCAN output signal is also asynchronous. Its state changes based on the leading edge (two clock cycles) of the CK clock signal shown in figure 24-27.
Table 24-43 I2C Bus Timing [Option]*1 Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, φ = 5 MHz to maximum operating frequency, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item SCL input cycle time SCL input high pulse width SCL input low pulse width SCL, SDA input rise time SCL, SDA input fall time SCL, SDA input spike pulse elimination time SDA input bus free time Start condition input hold time Retransmission start condition input setup time Stop condition input setup time Data input setup time Data input hold time SCL, SDA capacitive load
2
Symbol tSCL tSCLH tSCLL tSr tSf tSP tBUF tSTAH tSTAS tSTOS tSDAS tSDAH Cb
Min. 12 tcyc 3 tcyc 5 tcyc — — — 5 tcyc 3 tcyc 3 tcyc 3 tcyc 0.5 tcyc 0 —
Typ. — — — — — — — — — — — — —
Max. — — — 300 1 tcyc — — — — — — 400
Unit ns ns ns ns ns ns ns ns ns ns ns pF
Notes Figure 24-28
2 7.5 tcyc* ns
Notes: 1. Available when using I C bus interface (the W-mask version only). 2 2. 17.5 tcyc can be set according to the clock selected for use by the I C module. For details, see section 15.4, Usage Notes.
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24.4.5
A/D Conversion Characteristics
Table 24-44 lists the A/D conversion characteristics. Table 24-44 A/D Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Analog input capacitance Permissible signal-source impedance Nonlinearity error Offset error Full-scale error Quantization Absolute accuracy Min. 10 10 — — — — — — — Typ. 10 — — — — — — ±0.5 — Max. 10 — 20 5 ±3.5 ±3.5 ±3.5 — ±4.0 Unit bits µs pF kΩ LSB LSB LSB LSB LSB
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Section 24 Electrical Characteristics
24.4.6
D/A Conversion Characteristics
Table 24-45 shows the D/A conversion characteristics. Table 24-45 D/A Conversion Characteristics Conditions: VCC = 4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition Item Resolution Conversion time Absolute accuracy Min. 8 — — — Typ. 8 — ± 1.5 — Max. 8 10 ± 2.0 ± 1.5 Unit bits µs LSB LSB 20-pF capacitive load 2-MΩ resistive load 4-MΩ resistive load Test Conditions
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24.4.7
Flash Memory Characteristics
Table 24-46 shows the flash memory characteristics. Table 24-46 Flash Memory Characteristics Conditions: VCC =4.5 V to 5.5 V, PWMVCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, Vref = 4.5 V to AVCC, VSS = PWMVSS = PLLVSS, AVSS = 0 V Ta = 0 to +75°C (Programming/erasing operating temperature range: regular specification)
Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting*1 Wait time after P bit setting*1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min. — — — 1 50 28 198 8 Typ. 10 100 — 1 50 30 200 10 Max. 200 1200 100 — — 32 202 12 Unit ms/ 128 bytes ms/block Times µs µs µs µs µs Programming time wait Programming time wait Additionalprogramming time wait Test Condition
Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear*1 Wait time after SWE bit clear*1 Wait time after SWE bit setting*1 Wait time after ESU bit setting*1 Wait time after E bit setting*1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1
tcp tcpsu tspv tspvr tcpv tcswe
5 5 4 2 2 100 — 1 100 10 10 10 20
5 5 4 2 2 100 — 1 100 10 10 10 20
— — — — — — 1000 — — 100 — — —
µs µs µs µs µs µs Times µs µs ms µs µs µs Erase time wait
Maximum programming count*1 *4 N Erase tsswe tsesu tse tce tcesu tsev
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Section 24 Electrical Characteristics
Item Erase Wait time after H'FF dummy write*1 Wait time after EV bit clear*1 Wait time after SWE bit clear*1 Maximum erase count*1 *5
Symbol tsevr tcev tcswe N
Min. 2 4 100 12
Typ. 2 4 100 —
Max. — — — 120
Unit µs µs µs Times
Test Condition
Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. 2. Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time) 3. Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time) 4. To specify the maximum programming time value (tP (max.)) in the 128-byte programming algorithm, set the max. value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6: tsp30 = 30 µs Programming counter (n) = 7 to 1000: tsp200 = 200 µs [In additional programming] Programming counter (n)= 1 to 6: tsp10 = 10 µs 5. For the maximum erase time (tE (max.)), the following relationship applies between the wait time after E bit setting (tse) and the maximum erase count (N): tE (max.) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of (tse) and (N) should be set so as to satisfy the above formula. Examples: When tse = 100 [ms], N = 12 times When tse = 10 [ms], N = 120 times
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Page 1047 of 1458
Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.5
Operation Timing
The operation timing is shown below. 24.5.1 Clock Timing
The clock timing is shown below.
tcyc tCH φ tCL tCr tCf
Figure 24-9 System Clock Timing
EXTAL tDEXT VCC tDEXT
STBY tOSC1 RES tOSC1
φ
Figure 24-10 Oscillator Settling Timing
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Section 24 Electrical Characteristics
24.5.2
Control Signal Timing
The control signal timing is shown below.
φ
tRESS RES tRESW
tRESS
Figure 24-11 Reset Input Timing
φ tNMIS NMI tNMIW tNMIH
IRQ tIRQW tIRQS IRQ Edge input tIRQS IRQ Level input tIRQH
Figure 24-12 Interrupt Input Timing
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
24.5.3
Bus Timing
The bus timing is shown below.
T1 T2
φ tAD A23 to A0 tAS AS tRSD2 tASD tASD tAH
tRSD1 RD (read)
tACC2
tACC3 D15 to D0 (read)
tRDS tRDH
tWRD2 HWR, LWR (write) tWDD D15 to D0 (write) tWSW1
tWRD2
tWDH
Figure 24-13 Basic Bus Timing (Two-State Access)
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Section 24 Electrical Characteristics
T1
T2
T3
φ
tAD A23 to A0 tAS AS tAH
tASD
tASD
tRSD1 RD (read)
tACC4
tRSD2
tACC5 D15 to D0 (read)
tRDS tRDH
tWRD1 HWR, LWR (write) tWDD tWDS D15 to D0 (write) tWSW2
tWRD2
tWDH
Figure 24-14 Basic Bus Timing (Three-State Access)
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
T1 φ tAD A23 to A0 tAS AS tRSD1 RD (read) D15 to D0 (read) tASD
T2
Tw
T3
tASD
tAH
tRSD2 tRDS tRDH
tWRD1 HWR, LWR (write) D15 to D0 (write)
tWRD2
tWDD
tWDS
tWDH
Figure 24-15 Basic Bus Timing (Three-State Access with One Wait State)
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Section 24 Electrical Characteristics
T1
T2 or T3
T1
T2
φ
tAD A23 to A0 tAS tAH
tASD
tASD
AS
tRSD2 RD (read) tACC3 D15 to D0 (read) tRDS tRDH
Figure 24-16 Burst ROM Access Timing (Two-State Access)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1053 of 1458
Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
T1 φ
T2 or T3
T1
tAD A23 to A0
AS
tRSD2 RD (read) tACC1 D15 to D0 (read) tRDS tRDH
Figure 24-17 Burst ROM Access Timing (One-State Access) 24.5.4 On-Chip Supporting Module Timing
The on-chip supporting module timing is shown below.
T1 φ tPRS Ports 1, 3, 4, 9 A to F (read) tPWD Ports 1, 3, A to F (write) tPRH T2
Figure 24-18 I/O Port Input/Output Timing (Ports 1, 3, 4, 9, A to F)
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Section 24 Electrical Characteristics
Bus cycle T1 φ tPRS Ports H, J (read) tPWD2 Ports H, J (write) tPRH T2 T3 T4
Figure 24-19
φ
I/O Port (Ports H and J) Input/Output Timing
tPOD PO15 to PO8
Figure 24-20 PPG Output Timing* Note: * The PPG output is not implemented in the H8S/2635 Group.
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
φ tTOCD Output compare output* tTICS Input capture input*
Note: * TIOCA0 to TIOCA5, TIOCB0 to TIOCB5, TIOCC0, TIOCC3, TIOCD0, TIOCD3
Figure 24-21 TPU Input/Output Timing
φ tTCKS TCLKA to TCLKD tTCKWL tTCKWH tTCKS
Figure 24-22 TPU Clock Input Timing
φ tMPWMOD PWM1A to PWM1H, PWM2A to PWM2H
Figure 24-23 Motor Control PWM Output Timing
tSCKW SCK0 to SCK2 tScyc tSCKr tSCKf
Figure 24-24 SCK Clock Input Timing
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Section 24 Electrical Characteristics
SCK0 to SCK2 tTXD TxD0 to TxD2 (transit data) tRXS RxD0 to RxD2 (receive data) tRXH
Figure 24-25 SCI Input/Output Timing (Clock Synchronous Mode)
φ tTRGS ADTRG
Figure 24-26 A/D Converter External Trigger Input Timing
CK
tHTXD HTxD0, HTxD1 (transmit data) tHRXS tHRXH HRxD0, HRxD1 (receive data)
Figure 24-27 HCAN Input/Output Timing
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Section 24 Electrical Characteristics
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
VIH SDA0 to SDA1 tBUF tSTAH VIL
tSCLH
tSTAS
tSP
tSTOS
SCL0 to SCL1
P*
S* tSf
tSCLL tSCL
Sr* tSr tSDAH tSDAS
Note: * S, P, and Sr indicate the following conditions. S: Start condition P: Stop condition Sr : Retransmission start condition
Figure 24-28 I2C Bus Interface Input/Output Timing (Option)* Note: * I2C bus interface is available a an option in the H8S/2638, H8S/2639, and H8S/2630 only.
24.6
Usage Note
Although both the F-ZTAT and mask ROM versions fully meet the electrical specifications listed in this manual, there may be differences in the actual values of the electrical characteristics, operating margins, noise margins, and so forth, due to differences in the fabrication process, the on-chip ROM, and the layout patterns. Therefore, if a system is evaluated using the F-ZTAT version, a similar evaluation should also be performed using the mask ROM version.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix A Instruction Set
Appendix A Instruction Set
A.1 Instruction List
Operand Notation
Rd Rs Rn ERn MAC (EAd) (EAs) EXR CCR N Z V C PC SP #IMM disp + – × ÷ ∧ ∨ ⊕ → ¬ ( ) :8/:16/:24/:32 General register (destination)* General register (source)* General register* General register (32-bit register) Multiply-and-accumulate register (32-bit register) Destination operand Source operand Extended control register Condition-code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Program counter Stack pointer Immediate data Displacement Add Subtract Multiply Divide Logical AND Logical OR Logical exclusive OR Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right Logical NOT (logical complement) Contents of operand 8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Condition Code Notation
Symbol Changes according to the result of instruction * 0 1 — Undetermined (no guaranteed value) Always cleared to 0 Always set to 1 Not affected by execution of the instruction
Page 1060 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Table A-1
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation #xx:8→Rd8 ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ #xx:16→Rd16 ⎯⎯ Rs16→Rd16 ⎯⎯ @ERs→Rd16 ⎯⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ IHNZVC
No. of States*1 Advanced 1 1 2 3 5 3 2 3 4 2 3 5 3 2 3 4 2 1
Mnemonic MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd W 2 W 2 W4 B 6 B 4 B 2 B 2 Rs8→@aa:8 Rs8→@aa:16 Rs8→@aa:32 B 8 B 4 Rs8→@(d:16,ERd) Rs8→@(d:32,ERd) ERd32-1→ERd32,Rs8→@ERd B 2 Rs8→@ERd B 6 @aa:32→Rd8 B 4 @aa:16→Rd8 B 2 @aa:8→Rd8 B 2 @ERs→Rd8,ERs32+1→ERs32 B 8 @(d:32,ERs)→Rd8 B 4 @(d:16,ERs)→Rd8 B 2 @ERs→Rd8 B 2 Rs8→Rd8 B2
Instruction Set
(1) Data Transfer Instructions
MOV
Appendix A Instruction Set
2
Page 1061 of 1458
Operand Size #xx Rn @ERn @(d,ERn)
@−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Page 1062 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation @(d:16,ERs)→Rd16 @(d:32,ERs)→Rd16 ⎯⎯ ⎯⎯ IHNZVC 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0⎯ 0⎯ 0⎯ 0⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ @ERs→ERd32 ⎯⎯ @(d:16,ERs)→ERd32 @(d:32,ERs)→ERd32 ⎯⎯ ⎯⎯ @ERs→ERd32,ERs32+4→ERs32 ⎯ ⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯
No. of States*1 Advanced 3 5 3 3 4 2 3 5 3 3 4 3 1 4 5 7 5
Appendix A Instruction Set
Mnemonic MOV MOV.W @(d:32,ERs),Rd MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16,ERd MOV.L @aa:32,ERd L L L 4 6 8 L 10 L 6 L 4 L 2 L6 W 6 W 4 Rs16→@aa:16 Rs16→@aa:32 #xx:32→ERd32 ERs32→ERd32 W 2 W 8 Rs16→@(d:32,ERd) W 4 Rs16→@(d:16,ERd) W 2 Rs16→@ERd W 6 @aa:32→Rd16 W 4 @aa:16→Rd16 ⎯⎯ ⎯⎯ W 2 @ERs→Rd16,ERs32+2→ERs32 ⎯ ⎯ W 8 MOV.W @(d:16,ERs),Rd W 4
ERd32-2→ERd32,Rs16→@ERd ⎯ ⎯
@aa:16→ERd32 @aa:32→ERd32
⎯⎯ ⎯⎯
0⎯ 0⎯
5 6
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation ERs32→@ERd ⎯⎯ ⎯⎯ ⎯⎯ IHNZVC 0⎯ 0⎯ 0⎯ 0⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ ⎯⎯⎯⎯⎯⎯
No. of States*1 Advanced 4 5 7 5 5 6 3 5 3 5 7/9/11 [1]
Mnemonic MOV MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) L MOV.L ERs,@(d:32,ERd) L MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 POP POP.L ERn PUSH PUSH.L ERn LDM*4 LDM @SP+,(ERm-ERn) L 4 L 4 PUSH.W Rn W 2 L 4 POP.W Rn W 2 @SP→Rn16,SP+2→SP @SP→ERn32,SP+4→SP SP-2→SP,Rn16→@SP SP-4→SP,ERn32→@SP (@SP→ERn32,SP+4→SP) Repeated for each register restored STM*4 STM (ERm-ERn),@-SP L 4 (SP-4→SP,ERn32→@SP) Repeated for each register saved MOVFPE MOVTPE MOVTPE Rs,@aa:16 MOVFPE @aa:16,Rd Cannot be used in this LSI Cannot be used in this LSI L 8 ERs32→@aa:32 L 6 ERs32→@aa:16 L 4 10 ERs32→@(d:32,ERd) ERd32-4→ERd32,ERs32→@ERd ⎯ ⎯ 6 ERs32→@(d:16,ERd) L 4
⎯⎯⎯⎯⎯⎯
7/9/11 [1]
[2] [2]
Appendix A Instruction Set
Page 1063 of 1458
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔ ↔ ↔ ↔
↔↔ ↔ ↔↔↔↔↔↔↔ ↔↔↔↔↔ ↔↔↔↔↔↔↔
ADDX Rs,Rd ADDS ADDS #2,ERd ADDS #4,ERd INC INC.W #1,Rd INC.W #2,Rd INC.L #1,ERd INC.L #2,ERd DAA SUB SUB.W #xx:16,Rd W4 SUB.B Rs,Rd B 2 DAA Rd B 2 L 2 L 2 W 2 W 2 INC.B Rd B 2 Rd8+1→Rd8 Rd16+1→Rd16 Rd16+2→Rd16 ERd32+1→ERd32 ERd32+2→ERd32 Rd8 decimal adjust→Rd8 Rd8-Rs8→Rd8 Rd16-#xx:16→Rd16 L 2 L 2 ERd32+2→ERd32 ERd32+4→ERd32 ADDS #1,ERd L 2 ERd32+1→ERd32
B
2
Rd8+Rs8+C→Rd8
⎯
[5]
↔↔↔↔↔↔↔↔
↔ ↔↔↔↔↔↔↔ ↔↔↔↔↔↔↔ ↔ ↔↔↔↔↔ ↔↔
↔ ↔ ↔ ↔
Page 1064 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation Rd8+#xx:8→Rd8 ⎯ ⎯ ⎯ [3] ⎯ [3] ⎯ [4] IHNZVC
No. of States*1 Advanced 1 1 2 1 3 1
Appendix A Instruction Set
Mnemonic ADD ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDX ADDX #xx:8,Rd B2 Rd8+#xx:8+C→Rd8 L 2 ERd32+ERs32→ERd32 ⎯ L6 ERd32+#xx:32→ERd32 ⎯ [4] W 2 Rd16+Rs16→Rd16 W4 Rd16+#xx:16→Rd16 B 2 Rd8+Rs8→Rd8 ADD.B #xx:8,Rd B2
(2) Arithmetic Instructions
[5]
1 1 ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ ⎯⎯ ⎯ 1 1 1 1 1 ⎯⎯ ⎯ 1 ⎯⎯ ⎯ 1 ⎯⎯ ⎯ ⎯ 1 ⎯* * 1 1 ⎯ [3] 2
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
Operand Size #xx Rn @ERn
⎯
↔↔ ↔↔↔↔↔ ↔↔↔
SUBX Rs,Rd SUBS SUBS #2,ERd SUBS #4,ERd DEC 2 2 2 2 2 2 2 2 DEC.W #1,Rd DEC.W #2,Rd DEC.L #1,ERd DEC.L #2,ERd DAS DAS Rd MULXU.B Rs,Rd MULXU.W Rs,ERd W B B MULXU L L W W DEC.B Rd B Rd8-1→Rd8 Rd16-1→Rd16 Rd16-2→Rd16 ERd32-1→ERd32 ERd32-2→ERd32 Rd8 decimal adjust→Rd8 Rd16×Rs16→ERd32 (unsigned multiplication) L 2 ERd32-4→ERd32 L 2 ERd32-2→ERd32 SUBS #1,ERd L 2 ERd32-1→ERd32
B
2
Rd8-Rs8-C→Rd8
⎯
[5]
↔↔↔↔↔ ↔↔↔↔↔
↔↔↔↔↔↔ ↔↔↔↔↔↔ ↔↔↔↔↔
↔↔ ↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation Rd16-Rs16→Rd16 ERd32-#xx:32→ERd32 ⎯ [4] ⎯ [4] ⎯ ⎯ [3] IHNZVC
No. of States*1 Advanced 1 3 1
Mnemonic SUB SUB.L #xx:32,ERd SUB.L ERs,ERd SUBX SUBX #xx:8,Rd B2 Rd8-#xx:8-C→Rd8 L 2 ERd32-ERs32→ERd32 L6 SUB.W Rs,Rd W 2
[5]
1 1 ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯* ⎯ ⎯ ⎯ ⎯ ⎯ *⎯ 1 1 1 1 1 1 1 1 1
Rd8×Rs8→Rd16 (unsigned multiplication) ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯⎯⎯⎯⎯⎯
12 20
MULXS MULXS.W Rs,ERd 4 W
MULXS.B Rs,Rd
B
4
Rd8×Rs8→Rd16 (signed multiplication) Rd16×Rs16→ERd32 (signed multiplication)
⎯⎯ ⎯⎯
⎯⎯ ⎯⎯
13
Appendix A Instruction Set
21
Page 1065 of 1458
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔↔↔↔ ↔↔↔↔↔↔↔↔↔
↔↔↔ ↔↔ ↔↔↔↔↔↔↔↔↔ ↔↔↔↔↔↔↔↔↔↔↔
Page 1066 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation IHNZVC
No. of States*1 Advanced 12
Appendix A Instruction Set
Mnemonic DIVXU RdL: quotient) (unsigned division) DIVXU.W Rs,ERd Rd: quotient) (unsigned division) DIVXS RdL: quotient) (signed division) DIVXS.W Rs,ERd Rd8-#xx:8 2 Rd16-Rs16 ERd32-#xx:32 2 2 2 2 2 2 ERd32-ERs32 0-Rd8→Rd8 0-Rd16→Rd16 0-ERd32→ERd32 0→( of Rd16) 0→( of ERd32) Rd8-Rs8 Rd16-#xx:16 2 W 4 divxs.B Rs,Rd B 4 W 2 DIVXU.B Rs,Rd B 2
Rd16÷Rs8→Rd16 (RdH: remainder, ⎯ ⎯ [6] [7] ⎯ ⎯ ERd32÷Rs16→ERd32 (Ed: remainder, ⎯ ⎯ [6] [7] ⎯ ⎯ Rd16÷Rs8→Rd16 (RdH: remainder, ⎯ ⎯ [8] [7] ⎯ ⎯ ERd32÷Rs16→ERd32 (Ed: remainder, ⎯ ⎯ [8] [7] ⎯ ⎯ Rd: quotient) (signed division)
20
13
21
CMP CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd NEG NEG.W Rd NEG.L ERd EXTU EXTU.L ERd L EXTU.W Rd W L W NEG.B Rd B L L6 W W4 B
CMP.B #xx:8,Rd
B2
⎯ ⎯
1 1 ⎯ [3] 2 ⎯ [3] 1 ⎯ [4] ⎯ ⎯ ⎯ 3 ⎯ [4] 1 1 1 1 ⎯⎯ 0 0⎯ ⎯⎯ 0 0⎯ 1 1
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
↔ ↔
( of ERd32) TAS B ( of @ERd) MAC MAC @ERn+,@ERm+ (signed multiplication) ERn+2→ERn,ERm+2→ERm CLRMAC LDMAC LDMAC ERs,MACL STMAC STMAC MACL,ERd L 2 STMAC MACH,ERd L 2 L 2 LDMAC ERs,MACH L 2 CLRMAC — 2 0→MACH,MACL ERs→MACH ERs→MACL MACH→ERd MACL→ERd ⎯ ⎯⎯ ⎯ ⎯ ⎯ ⎯ ⎯⎯ ⎯ ⎯ ⎯ ⎯ ⎯⎯ ⎯ ⎯ ⎯ ⎯⎯ ⎯⎯ ⎯ 2 [11] 2 [11] 2 [11] 1 [11] ⎯ 1 [11] — 4 @ERn×@ERm+MAC→MAC ⎯ ⎯⎯ ⎯ ⎯ ⎯ [10] [10] [10] 4 4 TAS @ERd *3 @ERd-0→CCR set, (1)→ ⎯⎯
↔ ↔
↔ ↔
↔↔ ↔↔ ↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation ( of Rd16)→ ( of Rd16) ⎯⎯ IHNZVC 0⎯
No. of States*1 Advanced 1
Mnemonic EXTS EXTS.W Rd W 2
EXTS.L ERd
L
2
( of ERd32)→
⎯⎯
0⎯ 0⎯
1
4
Appendix A Instruction Set
Page 1067 of 1458
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Page 1068 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation IHNZVC ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ Rd16⊕#xx:16→Rd16 ⎯⎯ Rd16⊕Rs16→Rd16 ERd32⊕#xx:32→ERd32 ⎯⎯ ⎯⎯ ERd32⊕ERs32→ERd32 ¬ Rd8→Rd8 ¬ Rd16→Rd16 ¬ ERd32→ERd32 ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ 0⎯ Rd8∧#xx:8→Rd8
No. of States*1 Advanced 1 1 2 1 3 2 1 1 2 1 3 2 1 1 2 1 3 2 1 1 1
Appendix A Instruction Set
Mnemonic AND AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd OR OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd XOR XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd NOT NOT.B Rd NOT.W Rd NOT.L ERd L 2 W 2 B 2 L 4 L6 W 2 W4 B 2 B2 L 4 L6 W 2 Rd16∨Rs16→Rd16 ERd32∨#xx:32→ERd32 ERd32∨ERs32→ERd32 Rd8⊕#xx:8→Rd8 Rd8⊕Rs8→Rd8 W4 Rd16∨#xx:16→Rd16 B 2 Rd8∨Rs8→Rd8 B2 Rd8∨#xx:8→Rd8 L 4 ERd32∧ERs32→ERd32 L6 ERd32∧#xx:32→ERd32 W 2 Rd16∧Rs16→Rd16 W4 Rd16∧#xx:16→Rd16 B 2 Rd8∧Rs8→Rd8 B2
(3) Logical Instructions
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔ ↔↔↔↔↔↔
SHLL.L #2,ERd
L
2
⎯⎯
0
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation ⎯⎯ ⎯⎯ 0 ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ MSB LSB C ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0 C MSB LSB ⎯⎯ ⎯⎯ ⎯⎯ C MSB LSB IHNZVC
No. of States*1 Advanced 1 1 1 1 1 1
(4) Shift Instructions
Mnemonic SHAL SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd SHLL SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd L 2 W 2 W 2 B 2 B 2 L 2 L 2 W 2 W 2 B 2 B 2 L 2 L 2 W 2 W 2 B 2 B 2
0
1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1
Appendix A Instruction Set
Page 1069 of 1458
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
↔↔↔↔↔↔↔↔↔↔↔↔ ↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ROTXR.L #2,ERd
L
2
—
⎯⎯
0
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Page 1070 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation — — — 0 — — — — — — — C — — — — — — MSB — LSB C MSB LSB MSB LSB C ⎯⎯ 0 ⎯⎯ 0 ⎯⎯ 0 0 0 0 0 ⎯⎯ 0 0 ⎯⎯ 0 ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0 0 0 0 0 0 0 0 0 0 0 0 IHNZVC
No. of States*1 Advanced 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Appendix A Instruction Set
Mnemonic SHLR SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd ROTXL ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd ROTXR ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd L 2 W 2 W 2 B 2 B 2 L 2 L 2 W 2 W 2 B 2 B 2 L 2 L 2 W 2 W 2 ⎯⎯ 0 B 2 B 2
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔
ROTR.L #2,ERd
L
2
1
⎯⎯
0
↔↔↔↔↔↔↔↔↔↔↔↔
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation ⎯⎯ ⎯⎯ ⎯⎯ C MSB LSB ⎯⎯ ⎯⎯ ⎯⎯ — — — MSB — LSB C ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ 0 0 0 0 0 0 0 0 0 0 0 IHNZVC
No. of States*1 Advanced 1 1 1 1 1 1 1 1 1 1 1 1
Mnemonic ROTL ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd ROTR ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd L 2 W 2 W 2 B 2 B 2 L 2 L 2 W 2 W 2 B 2 B 2
Appendix A Instruction Set
Page 1071 of 1458
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
Page 1072 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation (#xx:3 of Rd8)←1 ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ (#xx:3 of @aa:32)←0 (Rn8 of Rd8)←0 ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ (Rn8 of @ERd)←0 ⎯⎯⎯⎯⎯⎯ (Rn8 of @aa:8)←0 ⎯⎯⎯⎯⎯⎯ IHNZVC
No. of States*1 Advanced 1 4 4 5 6 1 4 4 5 6 1 4 4 5 6 1 4 4
Appendix A Instruction Set
Mnemonic BSET BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BCLR BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 B B 4 6 B 4 B 2 B 8 B 6 B 4 B 4 BCLR #xx:3,Rd B 2 (#xx:3 of Rd8)←0 (#xx:3 of @ERd)←0 (#xx:3 of @aa:8)←0 (#xx:3 of @aa:16)←0 B 8 (Rn8 of @aa:32)←1 B 6 (Rn8 of @aa:16)←1 B 4 (Rn8 of @aa:8)←1 B 4 (Rn8 of @ERd)←1 B 2 (Rn8 of Rd8)←1 B 8 (#xx:3 of @aa:32)←1 B 6 (#xx:3 of @aa:16)←1 B 4 (#xx:3 of @aa:8)←1 B 4 (#xx:3 of @ERd)←1 BSET #xx:3,Rd B 2
(5) Bit-Manipulation Instructions
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
(Rn8 of @aa:16)←0
⎯⎯⎯⎯⎯⎯
5
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
Appendix A Instruction Set
Page 1073 of 1458
BTST #xx:3,@aa:16
B
6
¬ (#xx:3 of @aa:16)→Z
⎯⎯⎯
↔↔↔↔
REJ09B0103-0800 Rev. 8.00
Mnemonic Operation (Rn8 of @aa:32)←0 BCLR BCLR Rn,@aa:32 BNOT #xx:3,Rd BNOT #xx:3,@ERd [¬ (#xx:3 of @ERd)] BNOT #xx:3,@aa:8 [¬ (#xx:3 of @aa:8)] BNOT #xx:3,@aa:16 [¬ (#xx:3 of @aa:16)] BNOT #xx:3,@aa:32 B 8 (#xx:3 of @aa:32)← [¬ (#xx:3 of @aa:32)] BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 B 6 B 4 B 4 B 2 (Rn8 of Rd8)←[¬ (Rn8 of Rd8)] B 6 (#xx:3 of @aa:16)← B 4 (#xx:3 of @aa:8)← B 4 (#xx:3 of @ERd)← B 2 B 8 BNOT
⎯
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code IHNZVC ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
No. of States*1 Advanced 6 1 4
(#xx:3 of Rd8)←[¬ (#xx:3 of Rd8)] ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
4
5
6
1 4 4
(Rn8 of @ERd)←[¬ (Rn8 of @ERd)] ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ (Rn8 of @aa:8)←[¬ (Rn8 of @aa:8)] ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ (Rn8 of @aa:16)← [¬ (Rn8 of @aa:16)] ⎯⎯⎯⎯⎯⎯
5
BNOT Rn,@aa:32
B
8
(Rn8 of @aa:32)← [¬ (Rn8 of @aa:32)]
⎯⎯⎯⎯⎯⎯
6
BTST BTST #xx:3,@ERd BTST #xx:3,@aa:8 B B 4
BTST #xx:3,Rd
B
2
¬ (#xx:3 of Rd8)→Z ¬ (#xx:3 of @ERd)→Z 4 ¬ (#xx:3 of @aa:8)→Z
⎯⎯⎯ ⎯⎯⎯ ⎯⎯⎯
⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯
1 3 3 4
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔
Page 1074 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation ¬ (#xx:3 of @aa:32)→Z ¬ (Rn8 of Rd8)→Z ⎯⎯⎯ ⎯⎯⎯ ⎯⎯⎯ ⎯⎯⎯ ⎯⎯⎯ ⎯⎯⎯ IHNZVC ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ¬ (#xx:3 of @aa:8)→C ¬ (#xx:3 of @aa:16)→C ¬ (#xx:3 of @aa:32)→C C→(#xx:3 of Rd8) ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯
No. of States*1 Advanced 5 1 3 3 4 5 1 3 3 4 5 1 3 3 4 5
Appendix A Instruction Set
Mnemonic BTST BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BLD BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BILD BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BST BST #xx:3,@ERd BST #xx:3,@aa:8 B B 4 4 BST #xx:3,Rd B 2 B 8 B 6 B 4 B 4 BILD #xx:3,Rd B 2 B 8 B 6 B 4 B 4 (#xx:3 of @ERd)→C (#xx:3 of @aa:8)→C (#xx:3 of @aa:16)→C (#xx:3 of @aa:32)→C ¬ (#xx:3 of Rd8)→C ¬ (#xx:3 of @ERd)→C BLD #xx:3,Rd B 2 (#xx:3 of Rd8)→C B 8 ¬ (Rn8 of @aa:32)→Z B 6 ¬ (Rn8 of @aa:16)→Z B 4 ¬ (Rn8 of @aa:8)→Z B 4 ¬ (Rn8 of @ERd)→Z B 2 B 8
⎯⎯⎯⎯⎯⎯ C→(#xx:3 of @ERd24) C→(#xx:3 of @aa:8) ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
1 4 4
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn
↔↔↔↔↔↔↔↔↔↔↔↔
REJ09B0103-0800 Rev. 8.00
Mnemonic Operation C→(#xx:3 of @aa:16) C→(#xx:3 of @aa:32) ¬ C→(#xx:3 of Rd8) 4 4 6 8 2 4 4 6 8 2 4 4 6 8 2 4 C∧(#xx:3 of Rd8)→C C∧(#xx:3 of @ERd24)→C C∧(#xx:3 of @aa:8)→C C∧(#xx:3 of @aa:16)→C C∧(#xx:3 of @aa:32)→C C∧[¬ (#xx:3 of Rd8)]→C C∧[¬ (#xx:3 of @ERd24)]→C C∧[¬ (#xx:3 of @aa:8)]→C C∧[¬ (#xx:3 of @aa:16)]→C C∧[¬ (#xx:3 of @aa:32)]→C C∨(#xx:3 of Rd8)→C C∨(#xx:3 of @ERd24)→C ¬ C→(#xx:3 of @aa:32) ¬ C→(#xx:3 of @aa:16) ¬ C→(#xx:3 of @aa:8) ¬ C→(#xx:3 of @ERd24) BST BST #xx:3,@aa:32 BIST BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BAND BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 BIAND BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BOR BOR #xx:3,@ERd B BOR #xx:3,Rd B B B B B BIAND #xx:3,Rd B B B B B BAND #xx:3,Rd B B B B B BIST #xx:3,Rd B 2 B 8 BST #xx:3,@aa:16 B 6
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code IHNZVC ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯
No. of States*1 Advanced 5 6 1 4 4 5 6 1 3 3 4 5 1 3 3 4 5 1
Appendix A Instruction Set
3
Page 1075 of 1458
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Page 1076 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation C∨(#xx:3 of @aa:8)→C C∨(#xx:3 of @aa:16)→C C∨(#xx:3 of @aa:32)→C C∨[¬ (#xx:3 of Rd8)]→C ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯ C⊕[¬ (#xx:3 of Rd8)]→C ⎯⎯⎯⎯⎯ C⊕[¬ (#xx:3 of @ERd24)]→C ⎯⎯⎯⎯⎯ C⊕[¬ (#xx:3 of @aa:8)]→C ⎯⎯⎯⎯⎯ IHNZVC
No. of States*1 Advanced 3 4 5 1 3 3 4 5 1 3 3 4 5 1 3 3
Appendix A Instruction Set
Mnemonic BOR BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BIOR BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 BXOR BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 BIXOR BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 B B 6 8 B 4 B 4 BIXOR #xx:3,Rd B 2 B 8 B 6 B 4 B 4 BXOR #xx:3,Rd B 2 B 8 C⊕(#xx:3 of Rd8)→C C⊕(#xx:3 of @ERd24)→C C⊕(#xx:3 of @aa:8)→C C⊕(#xx:3 of @aa:16)→C C⊕(#xx:3 of @aa:32)→C B 6 C∨[¬ (#xx:3 of @aa:16)]→C C∨[¬ (#xx:3 of @aa:32)]→C B 4 C∨[¬ (#xx:3 of @aa:8)]→C B 4 C∨[¬ (#xx:3 of @ERd24)]→C BIOR #xx:3,Rd B 2 B 8 B 6 BOR #xx:3,@aa:8 B 4
C⊕[¬ (#xx:3 of @aa:16)]→C C⊕[¬ (#xx:3 of @aa:32)]→C
⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯
4 5
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
REJ09B0103-0800 Rev. 8.00
Mnemonic Bcc BRA d:8(BT d:8) BRA d:16(BT d:16) BRN d:8(BF d:8) BRN d:16(BF d:16) BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:B(BHS d:8) BCC d:16(BHS d:16) BCS d:8(BLO d:8) BCS d:16(BLO d:16) BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 ⎯ ⎯ 2 4 ⎯ 4 V=0 ⎯ 2 ⎯ 4 Z=1 ⎯ 2 ⎯ 4 Z=0 ⎯ 2 ⎯ 4 C=1 ⎯ 2 ⎯ 4 C=0 ⎯ 2 C∨Z=1 ⎯ 4 ⎯ 2 C∨Z=0 ⎯ 4 ⎯ 2 else next; Never ⎯ 4 PC←PC+d 2 ⎯ if condition is true then Always ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
⎯
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Operation Condition Code
Branching Condition
No. of States*1 Advanced 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3 2 3
(6) Branch Instructions
IHNZVC
Appendix A Instruction Set
Page 1077 of 1458
Addressing Mode/ Instruction Length (Bytes)
Appendix A Instruction Set
Mnemonic Bcc BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 4 2 4 BLE d:8 BLE d:16 ⎯ ⎯ ⎯ ⎯ 2 ⎯ 4 ⎯ 2 ⎯ 4 N⊕V=1 ⎯ 2 ⎯ 4 N⊕V=0 ⎯ 2 N=1 ⎯ 4 ⎯ 2 else next; N=0 ⎯ 4 PC←PC+d 2 ⎯ if condition is true then V=1
Operand Size #xx Rn
@ERn @(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
Page 1078 of 1458
Operation Condition Code
Branching Condition
No. of States*1 Advanced 2 3 2 3
IHNZVC ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
2 3 2 3 2 3
Z∨(N⊕V)=0 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯⎯⎯⎯⎯⎯ Z∨(N⊕V)=1 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯⎯⎯⎯⎯⎯
2 3 2 3
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
⎯
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation PC←ERn IHNZVC ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
No. of States*1 Advanced 2 3 5 4 5 4 5 6 5
Mnemonic JMP JMP @aa:24 JMP @@aa:8 BSR BSR d:16 JSR JSR @aa:24 JSR @@aa:8 RTS RTS ⎯ 2 PC←@SP+ ⎯ 2 ⎯ 4 PC→@-SP,PC←aa:24 PC→@-SP,PC←@aa:8 JSR @ERn ⎯ 2 PC→@-SP,PC←ERn ⎯ 4 PC→@-SP,PC←PC+d:16 BSR d:8 ⎯ 2 PC→@-SP,PC←PC+d:8 ⎯ 2 PC←@aa:8 ⎯ 4 PC←aa:24 JMP @ERn ⎯ 2
Appendix A Instruction Set
Page 1079 of 1458
@aa @(d,PC) @@aa
Rn @ERn
Operand Size #xx
@(d,ERn) @−ERn/@ERn+
⎯
↔
↔
↔ ↔
⎯ PC←@SP+ ⎯ Transition to power-down state
(7) System Control Instructions
EXR←@SP+,CCR←@SP+,
↔
↔
↔
↔
↔ ↔
LDC LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR W W W W W W W W W W 6 6 8 8 4 4 10 10 6 6 LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR W 4 @ERs→EXR @(d:16,ERs)→CCR @(d:16,ERs)→EXR @(d:32,ERs)→CCR @(d:32,ERs)→EXR @ERs→CCR,ERs32+2→ERs32 @ERs→EXR,ERs32+2→ERs32 @aa:16→CCR @aa:16→EXR @aa:32→CCR @aa:32→EXR W 4 @ERs→CCR B 2 Rs8→EXR B 2 Rs8→CCR B4 #xx:8→EXR
LDC #xx:8,CCR
B2
#xx:8→CCR
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
↔
↔
↔ ↔
↔
↔
Page 1080 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code Operation PC→@-SP,CCR→@-SP, EXR→@-SP,→PC 1 ⎯⎯⎯⎯⎯ IHNZVC
No. of States*1 Advanced 8 [9]
Appendix A Instruction Set
Mnemonic TRAPA TRAPA #xx:2 ⎯
RTE
RTE
5 [9]
SLEEP
SLEEP
⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
2 1 2 1 1 3 3 4 4 6 6 4 4 4 4 5 5
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Operand Size #xx Rn @ERn
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa
↔ ↔ ↔ ↔ ↔
↔
↔ ↔ ↔ ↔ ↔
↔
↔ ↔ ↔ ↔ ↔
↔
REJ09B0103-0800 Rev. 8.00
Mnemonic Operation CCR→Rd8 EXR→Rd8 4 4 6 6 10 10 4 4 6 6 8 8 EXR→@(d:32,ERd) CCR→@(d:32,ERd) EXR→@(d:16,ERd) CCR→@(d:16,ERd) EXR→@ERd CCR→@ERd STC STC EXR,Rd STC CCR,@ERd STC EXR,@ERd STC CCR,@(d:16,ERd) STC EXR,@(d:16,ERd) STC CCR,@(d:32,ERd) STC EXR,@(d:32,ERd) STC CCR,@-ERd STC EXR,@-ERd STC CCR,@aa:16 STC EXR,@aa:16 STC CCR,@aa:32 STC EXR,@aa:32 ANDC ANDC #xx:8,EXR ORC ORC #xx:8,EXR XORC XORC #xx:8,EXR NOP NOP ⎯ B4 XORC #xx:8,CCR B2 B4 ORC #xx:8,CCR B2 B4 ANDC #xx:8,CCR B2 W W W W W W W W W W W W B 2 STC CCR,Rd B 2
⎯
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Addressing Mode/ Instruction Length (Bytes)
Condition Code IHNZVC ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ EXR→@aa:32 CCR∧#xx:8→CCR EXR∧#xx:8→EXR CCR∨#xx:8→CCR EXR∨#xx:8→EXR CCR⊕#xx:8→CCR EXR⊕#xx:8→EXR 2 PC←PC+2 ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯ ⎯⎯⎯⎯⎯⎯
No. of States*1 Advanced 1 1 3 3 4 4 6 6 4 4 4 4 5 5 1 2 1 2 1 2 1
ERd32-2→ERd32,CCR→@ERd ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ERd32-2→ERd32,EXR→@ERd CCR→@aa:16 EXR→@aa:16 CCR→@aa:32
Appendix A Instruction Set
Page 1081 of 1458
Operand Size #xx Rn @ERn
Appendix A Instruction Set
Mnemonic Operation IHNZVC EEPMOV EEPMOV.B ⎯ 4 if R4L≠0 Repeat @ER5→@ER6 ER5+1→ER5 ER6+1→ER6 R4L-1→R4L Until R4L=0 else next; 4 if R4≠0 Repeat @ER5→@ER6 ER5+1→ER5 ER6+1→ER6 R4-1→R4 Until R4=0 else next;
@(d,ERn) @−ERn/@ERn+ @aa @(d,PC) @@aa ⎯
Page 1082 of 1458
Addressing Mode/ Instruction Length (Bytes)
Condition Code
No. of States*1 Advanced
(8) Block Transfer Instructions
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 4+2n *2
EEPMOV.W
⎯
⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 4+2n *2
Notes:
1. The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. 2. n is the initial value of R4L or R4. 3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 4. Only register ER0 to ER6 should be used when using the STM/LDM instruction. [1] Seven states for saving or restoring two registers, nine states for three registers, or eleven states for four registers. [2] Cannot be used in this LSI. [3] Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. [4] Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. [5] Retains its previous value when the result is zero; otherwise cleared to 0. [6] Set to 1 when the divisor is negative; otherwise cleared to 0. [7] Set to 1 when the divisor is zero; otherwise cleared to 0. [8] Set to 1 when the quotient is negative; otherwise cleared to 0. [9] One additional state is required for execution when EXR is valid. [10] MAC instruction results are indicated in the flags when the STMAC instruction is executed. [11] A maximum of three additional states are required for execution of one of these instructions within three states after execution of a MAC instruction. For example, if there is a one-state instruction (such as NOP) between a MAC instruction and one of these instructions, that instruction will be two states longer.
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix A Instruction Set
A.2
Instruction Codes
Table A-2 shows the instruction codes.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1083 of 1458
Table A-2 Instruction Codes
Mnemonic Size 1st byte 8 rd 8 rd rd rd 0 erd IMM IMM 9 9 A A B B B rd E rd IMM rs rd rd rd 0 erd 0 IMM 4 1 IMM rd 0 7 0 0 disp 0 disp 1 0 disp 0 disp 6 7 6 0 IMM 0 IMM abs abs 0 0 7 6 0 IMM 0 7 6 0 IMM 0 0 6 0 IMM 0 erd abs 1 3 6 6 0 ers 0 erd IMM IMM 6 rs 6 F rd 6 9 6 A 1 6 1 6 C E A A 0 8 1 8 rs IMM 9 0 erd 8 0 erd 0 0 erd 1 ers 0 erd 1 rs 1 rs 0 7 0 7 0 0 0 0 9 0 E 1 7 6 7 0 0 0 7 7 7 6 6 4 5 4 5 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B W W L L L L L B B B B W W L L B B B B B B B ⎯ ⎯ ⎯ ⎯ ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDS #1,ERd ADDS #2,ERd ADDS #4,ERd ADDX #xx:8,Rd ADDX Rs,Rd AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd ANDC #xx:8,CCR ANDC #xx:8,EXR BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 BRA d:8 (BT d:8) BRA d:16 (BT d:16) BRN d:8 (BF d:8) BRN d:16 (BF d:16) Instruction Format 10th byte
Instruction
Page 1084 of 1458
Appendix A Instruction Set
ADD
ADDS
ADDX
AND
ANDC
BAND
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
Bcc
May 28, 2010
Instruction Mnemonic Size 1st byte 4 2 8 2 disp 3 disp 4 disp 5 disp 6 disp 7 disp 8 disp 9 disp A disp B disp C disp D disp E disp F 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 0 disp 3 8 4 8 5 8 6 8 7 8 8 8 9 8 A 8 B 8 C 8 D 8 E 8 F 8 0 disp 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 4 5 disp 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:8 (BHS d:8) BCC d:16 (BHS d:16) BCS d:8 (BLO d:8) BCS d:16 (BLO d:16) BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 BLE d:8 BLE d:16
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Bcc
Appendix A Instruction Set
Page 1085 of 1458
Instruction Mnemonic Size 1st byte 7 2 rd 0 7 2 0 0 7 2 7 2 0 0 IMM 0 abs 0 IMM 2 abs 0 IMM 7 8 8 rd 0 6 2 rn 0 0 6 2 rn 6 2 0 rn 0 abs rn abs 2 6 8 8 rd 0 7 6 0 0 7 6 abs 1 IMM 0 7 6 1 IMM 0 6 abs 1 IMM 7 0 0 rd 0 7 7 0 0 7 abs 7 1 IMM 0 7 7 1 IMM 0 7 abs 1 IMM 7 0 0 rd 0 7 4 4 7 0 0 1 IMM 1 IMM abs abs 0 0 7 4 1 IMM 0 7 4 1 IMM 0 1 IMM 1 IMM 0 IMM D F A 1 3 rn 0 erd abs 1 3 1 IMM 0 erd abs 1 3 1 IMM 0 erd abs 1 3 1 IMM 0 erd abs 1 3 A 2 D F A A 6 C E A A 7 C E A A 4 C E A A abs 0 erd 7 7 6 6 6 7 7 6 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 6 0 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B B B B B B B B B B B B B B B B B B B B B B B B BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR #xx:3,Rd BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 10th byte
Instruction Format
Page 1086 of 1458
Appendix A Instruction Set
BCLR
BIAND
BILD
BIOR
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Mnemonic Size 1st byte 6 7 rd 0 6 7 0 0 6 7 0 6 7 0 1 IMM abs 1 IMM 7 abs 1 IMM 6 8 8 rd 0 7 5 0 0 7 5 0 7 5 1 IMM 0 abs 1 IMM 5 abs 1 IMM 7 0 0 rd 0 7 7 7 abs 7 7 abs 0 IMM 0 IMM 0 0 7 7 0 IMM 0 7 0 0 rd 0 7 1 1 abs abs 7 0 IMM 0 1 0 IMM 0 7 1 0 IMM 0 7 8 8 rd 0 6 1 1 abs abs 6 8 8 rn rn 0 0 6 1 rn 0 6 1 rn 0 0 IMM 0 0 IMM 0 1 IMM 1 IMM D F A 1 3 1 IMM 0 erd abs 1 3 0 IMM 0 erd abs 1 3 0 IMM 0 erd abs 1 3 rn 0 erd abs 1 3 A 5 C E A A 7 C E A A 1 D F A A 1 D F A A abs 0 erd 7 7 6 6 7 7 7 6 6 7 7 7 6 6 7 7 7 6 6 6 7 7 6 6 1 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B B B B B B B B B B B B B B B B B B B B B B B B BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT #xx:3,Rd BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
BIST
BIXOR
BLD
BNOT
Appendix A Instruction Set
Page 1087 of 1458
Instruction Mnemonic Size 1st byte 7 4 rd 0 7 7 0 0 rd 0 7 7 8 8 rd 0 6 6 8 8 disp 0 0 rd 0 6 6 7 0 6 abs 7 0 IMM 0 6 7 0 IMM 0 abs 0 IMM 8 8 rd 0 7 0 0 rd 0 6 3 rn 0 7 3 3 0 IMM 0 IMM abs abs 0 0 7 3 0 IMM 0 7 3 0 IMM 0 7 0 0 IMM 0 IMM 0 erd abs 1 3 0 IMM 0 erd abs 1 3 rn 0 erd disp abs abs 6 0 rn 0 6 0 rn 0 0 rn 0 0 rn 0 abs 7 0 abs 7 0 0 0 IMM 0 0 IMM 0 0 0 IMM 0 0 0 IMM abs 7 4 0 0 IMM abs 7 4 0 0 IMM 4 0 0 IMM 4 0 0 IMM C E A 1 3 0 IMM 0 erd abs 1 3 rn 0 erd abs 1 3 A 0 D F A A 0 D F A A 5 C 7 D F A A 3 C E A A 3 C abs 0 erd 7 7 6 6 7 7 7 6 6 6 7 7 6 6 5 5 6 7 7 6 6 7 7 7 6 6 6 7 0 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B B B B B B B B B B B B B B ⎯ ⎯ B B B B B B B B B B B B BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BSR d:8 BSR d:16 BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 BTST #xx:3,Rd BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd 10th byte
Instruction Format
Page 1088 of 1458
Appendix A Instruction Set
BOR
BSET
BSR
BST
BTST
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Mnemonic Size 1st byte 7 E 6 3 rn 0 6 abs 6 3 rn 0 3 rn 0 abs 0 0 rd 0 7 5 0 0 7 abs 7 5 0 IMM 5 0 IMM 0 0 5 abs 0 IMM 7 0 0 0 IMM rs rd rd rd 0 erd IMM IMM 2 rs 2 1 ers 0 erd 0 rd rd rd rd rd 0 erd 0 erd 0 5 1 3 5 0 rd 0 erd C 4 5 5 9 9 8 8 F F rs rs rd 0 erd 0 0 5 D 7 F D D rs rs 5 D 0 IMM A 1 3 0 IMM 0 erd abs 1 3 A A 5 C E A A 1 rd C 9 D A F F F A B B B B 1 1 1 3 B B abs 6 6 7 7 7 6 6 0 A 1 7 1 7 1 0 1 1 1 1 1 1 0 0 5 5 7 7 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B B B B B B B ⎯ B B W W L L B B B W W L L B W B W ⎯ ⎯ BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA Rd DAS Rd DEC.B Rd DEC.W #1,Rd DEC.W #2,Rd DEC.L #1,ERd DEC.L #2,ERd DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU.B Rs,Rd DIVXU.W Rs,ERd EEPMOV.W
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
BTST
BXOR
CLRMAC CLRMAC
CMP
DAA
DAS
DEC
DIVXS
DIVXU
Appendix A Instruction Set
EEPMOV EEPMOV.B
Page 1089 of 1458
Instruction Mnemonic Size 1st byte 1 7 D rd 0 erd rd 0 erd rd rd rd 0 erd 0 erd 0 abs abs 0 ern 0 abs abs IMM 4 1 0 7 rs rs 0 6 9 0 0 0 0 0 ers 8 8 D 6 6 1 6 D B B 0 ers 0 ers 6 0 ers 0 0 0 0 0 0 0 0 abs 0 abs 4 6 6 B B disp disp 2 2 0 0 disp disp 9 F F 0 ers 0 ers 0 ers 6 6 6 7 7 1 0 1 0 1 0 1 0 ers 0 1 4 4 4 4 4 4 4 4 4 IMM F 5 7 0 5 D 7 F 0 ern 7 7 7 A B B B B 9 A B D E F 7 1 3 3 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 5 5 5 5 5 5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte W L W L B W W L L ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ B B B B W W W W W W W W W W EXTS.W Rd EXTS.L ERd EXTU.W Rd EXTU.L ERd INC.B Rd INC.W #1,Rd INC.W #2,Rd INC.L #1,ERd INC.L #2,ERd JMP @ERn JMP @aa:24 JMP @@aa:8 JSR @ERn JSR @aa:24 JSR @@aa:8 LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR 10th byte
Instruction Format
EXTS
Page 1090 of 1458
EXTU
Appendix A Instruction Set
INC
JMP
JSR
LDC
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Mnemonic Size 1st byte 0 1 4 0 6 B 2 2 7 7 7 0 ern+3 0 ern+2 0 ern+1 0 abs B D D D 6 6 6 6 1 0 0 0 0 ers 0 ers 0 6 D IMM rs rd rd rd 0 6 A 2 rd rd disp disp 0 ers 0 ers 0 ers 0 ers abs 0 rd rd rs rs 0 6 A A rs rs disp disp abs 2 1 erd 1 erd 0 erd 1 erd abs 8 rs rs rd rd rd rd 0 6 B disp 2 rd disp IMM A 0 rs 0 ers 0 ers 0 ers abs abs abs 0 ern 0 erm 4 1 2 3 2 3 6 1 1 1 1 3 3 1 rd C 8 E 8 C rd A A 8 E 8 C rs A A 9 D 9 F 8 0 0 0 0 0 0 0 F 0 6 6 7 6 2 6 6 6 6 7 6 3 6 6 7 0 6 6 7 0 abs 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte W W L L L L L ⎯ B B B B B B B B B B B B B B B B W W W W W 10th byte LDC @aa:32,CCR LDC @aa:32,EXR LDM.L @SP+, (ERn-ERn+1) LDM.L @SP+, (ERn-ERn+2) LDM.L @SP+, (ERn-ERn+3) LDMAC ERs,MACH LDMAC ERs,MACL MAC @ERn+,@ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa :16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd
Instruction Format
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
LDC
LDM*3
LDMAC
MAC
MOV
Appendix A Instruction Set
Page 1091 of 1458
Instruction Mnemonic Size 1st byte 6 D rd rd rd rs rs 0 6 B A rs rs rs rs 0 erd IMM abs abs disp disp abs abs B 0 2 1 erd 1 erd 0 erd 1 erd 8 A 0 1 ers 0 erd 0 0 6 9 F 8 0 6 B 2 D B 0 2 1 erd 0 ers 1 erd 0 ers 0 erd 0 6 B disp A 0 ers disp 0 erd B 9 F 8 D B 8 A B 0 erd abs abs 0 ers 0 erd 0 ers 0 ers 0 erd disp 0 erd disp 6 7 6 6 6 6 6 7 6 6 6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ers 0 erd B 9 F 8 D B B A F 1 1 1 1 1 1 1 1 1 1 1 1 6 6 6 6 7 6 6 6 7 0 0 0 0 0 0 0 0 0 0 0 0 0 Cannot be used in this LSI 0 ers 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte W W W W W W W W W L L L L L L L L L L MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,Rd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16 ,ERd MOV.L @aa:32 ,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd)*1 L MOV.L ERs,@-ERd L L L B B B 0 1 C 0 0 rd 0 erd rs C rs 1 0 2 0 5 5 W B W 5 5 0 2 rs rs rd 0 erd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 1 erd 0 ers 0 ers 0 ers abs abs 10th byte
Instruction Format
Page 1092 of 1458
MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU.B Rs,Rd MULXU.W Rs,ERd
Appendix A Instruction Set
MOV
MOVFPE MOVFPE @aa:16,Rd
MOVTPE MOVTPE Rs,@aa:16
MULXS
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
MULXU
May 28, 2010
Instruction Mnemonic Size 1st byte 1 7 8 rd rd 0 erd 0 rd rd 0 erd IMM rs rd rd rd 0 erd 0 IMM 4 1 rn 0 rn 0 rd rd rd rd 0 erd 0 erd 6 D F 0 ern 6 D 7 0 ern 7 0 F 0 8 C 9 D B F 0 4 IMM 6 4 0 ers 0 erd IMM IMM 4 rs 4 F 9 B 0 0 1 3 7 7 0 7 7 7 rd 4 9 4 A 1 4 1 D 1 D 1 2 2 2 2 2 2 1 1 0 1 1 1 C 1 7 6 7 0 0 0 6 0 6 0 1 1 1 1 1 1 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B W L ⎯ B W L B B W W L L B B W L W L B B W W L L NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT.B Rd NOT.W Rd NOT.L ERd OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC #xx:8,CCR ORC #xx:8,EXR POP.W Rn POP.L ERn PUSH.W Rn PUSH.L ERn ROTL.B Rd ROTL.B #2, Rd ROTL.W Rd ROTL.W #2, Rd ROTL.L ERd ROTL.L #2, ERd
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
NEG
NOP
NOT
OR
ORC
POP
PUSH
ROTL
Appendix A Instruction Set
Page 1093 of 1458
Instruction Mnemonic Size 1st byte 1 3 8 rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd 0 0 rd rd rd rd 0 erd 0 erd C 9 D B F 0 4 1 5 3 7 0 4 1 5 3 7 7 7 8 C 9 D B F 3 3 3 3 3 2 2 2 2 2 2 3 3 3 3 3 3 6 4 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 5 5 1 1 1 1 1 1 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B W W L L B B W W L L B B W W L L ⎯ ⎯ B B W W L L ROTR.B Rd ROTR.B #2, Rd ROTR.W Rd ROTR.W #2, Rd ROTR.L ERd ROTR.L #2, ERd ROTXL.B Rd ROTXL.B #2, Rd ROTXL.W Rd ROTXL.W #2, Rd ROTXL.L ERd ROTXL.L #2, ERd ROTXR.B Rd ROTXR.B #2, Rd ROTXR.W Rd ROTXR.W #2, Rd ROTXR.L ERd ROTXR.L #2, ERd RTE RTS SHAL.B Rd SHAL.B #2, Rd SHAL.W Rd SHAL.W #2, Rd SHAL.L ERd SHAL.L #2, ERd 10th byte
Instruction Format
Page 1094 of 1458
Appendix A Instruction Set
ROTR
ROTXL
ROTXR
RTE
RTS
SHAL
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Mnemonic Size 1st byte 1 1 8 rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd rd rd rd rd 0 erd 0 erd 0 rd rd 0 1 0 1 0 1 0 1 7 7 6 6 4 6 6 F F 8 8 D D 6 9 6 9 1 erd 1 erd 1 erd 1 erd 0 erd 0 erd 1 erd 1 erd 0 0 0 0 0 0 0 0 6 6 B B disp disp A A 0 0 disp disp C 9 D B F 0 4 1 5 3 7 0 4 1 5 3 7 8 0 1 4 4 4 4 4 4 4 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B W W L L B B W W L L B B W W L L ⎯ B B W W SHAR.B Rd SHAR.B #2, Rd SHAR.W Rd SHAR.W #2, Rd SHAR.L ERd SHAR.L #2, ERd SHLL.B Rd SHLL.B #2, Rd SHLL.W Rd SHLL.W #2, Rd SHLL.L ERd SHLL.L #2, ERd SHLR.B Rd SHLR.B #2, Rd SHLR.W Rd SHLR.W #2, Rd SHLR.L ERd SHLR.L #2, ERd SLEEP STC.B CCR,Rd STC.B EXR,Rd STC.W CCR,@ERd STC.W EXR,@ERd STC.W CCR,@(d:16,ERd) W STC.W EXR,@(d:16,ERd) W STC.W CCR,@(d:32,ERd) W STC.W EXR,@(d:32,ERd) W STC.W CCR,@-ERd W W STC.W EXR,@-ERd
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
SHAR
SHLL
SHLR
SLEEP
STC
Appendix A Instruction Set
Page 1095 of 1458
Instruction Mnemonic Size 1st byte 0 1 4 0 6 B 8 0 0 0 0 0 ern 0 ern 0 ern abs abs abs 8 A A F F F B B B D D D 6 6 6 6 6 6 1 0 1 0 0 0 0 ers 0 ers rd rd rd 0 erd IMM IMM 4 4 4 1 2 3 2 3 rs 3 rs 3 1 ers 0 erd 0 8 9 IMM rs rd 0 7 B C 0 0 erd E 00 IMM IMM rs rd rd rd 0 erd 0 6 5 IMM 0 ers 0 erd IMM 5 rs 5 F 0 erd 0 erd 0 erd 1 1 1 1 1 1 2 2 8 9 9 A A B B B rd E 1 7 rd 5 9 5 A 1 0 0 0 0 0 0 0 0 1 7 1 7 1 1 1 1 B 1 0 5 D 1 7 6 7 0 abs 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte W W W W L L L L L B W W L L L L L B B B ⎯ B B W W L L STC.W CCR,@aa:16 STC.W EXR,@aa:16 STC.W CCR,@aa:32 STC.W EXR,@aa:32 STM.L(ERn-ERn+1), @-SP STM.L (ERn-ERn+2), @-SP STM.L (ERn-ERn+3), @-SP STMAC MACH,ERd STMAC MACL,ERd SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd SUBS #1,ERd SUBS #2,ERd SUBS #4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS @ERd*2 TRAPA #x:2 XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd 10th byte
Instruction Format
Page 1096 of 1458
STC
Appendix A Instruction Set
STM*3
STMAC
SUB
SUBS
SUBX
TAS
TRAPA
XOR
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Mnemonic Size 1st byte 0 0 1 4 1 0 5 IMM 5 IMM 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte B B XORC #xx:8,CCR XORC #xx:8,EXR
Instruction Format 10th byte
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
XORC
Notes: 1. Bit 7 of the 4th byte of the MOV.L ERs, @(d:32,ERd) instruction can be either 1 or 0. 2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 3. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
Legend: IMM: abs: disp: rs, rd, rn: ers, erd, ern, erm:
Immediate data (2, 3, 8, 16, or 32 bits) Absolute address (8, 16, 24, or 32 bits) Displacement (8, 16, or 32 bits) Register field (4 bits specifying an 8-bit or 16-bit register. The symbols rs, rd, and rn correspond to operand symbols Rs, Rd,and Rn) Register field (3 bits specifying an address register or 32-bit register. The symbols ers, erd, ern, and erm correspond to operand symbols ERs, ERd, ERn, and ERm)
The register fields specify general registers as follows. 16-Bit Register Register Field 0000 0001 · · · 0111 1000 1001 · · · 1111 R0 R1 · · · R7 E0 E1 · · · E7 0000 0001 · · · 0111 1000 1001 · · · 1111 General Register Register Field General Register R0H R1H · · · R7H R0L R1L · · · R7L 8-Bit Register
Address Register 32-Bit Register General Register ER0 ER1 · · · ER7
Register Field
000 001 · · · 111
Appendix A Instruction Set
Page 1097 of 1458
A.3
Page 1098 of 1458
Instruction when most significant bit of BH is 0. 1st byte AH AL BH BL Instruction when most significant bit of BH is 1. 2nd byte AL 0 1 ORC XORC ADD SUB XOR MOV.B 3 4 BRA BRN DIVXU OR MOV MOV Table A.3(2) XOR AND BST BNOT BCLR BTST MULXU DIVXU RTS BSR RTE TRAPA Table A.3(2) JMP BHI BLS BCS BNE MULXU BSET 7 8 ADD ADDX CMP SUBX OR XOR AND MOV 9 A B C D E F BCC BEQ BVC BVS BPL 5 6 BIST BLD BXOR BAND BOR BIXOR BIAND BILD BIOR BMI BGE BSR MOV EEPMOV Table A.3(3) BLT BGT JSR BLE AND Table A.3(2) ANDC OR LDC MOV CMP 2 3 5 6 C B NOP Table A.3(2) 4 7 8 9 A D 0 1 2 E ADDX SUBX
Table A-3 Operation Code Map (1)
Appendix A Instruction Set
Instruction code
Operation Code Map
AH LDC Table STC A.3(2) STMAC LDMAC Table Table Table A.3(2) A.3(2) A.3(2) Table A.3(2) Table A.3(2) Table A.3(2) Table A.3(2)
F Table A.3(2) Table A.3(2)
Table A-3 shows the operation code map.
Table A.3(2) Table A.3(2)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
REJ09B0103-0800 Rev. 8.00
1st byte AH AL BH BL 2nd byte BH 0 1 LDM STM STC MAC SLEEP CLRMAC LDC 2 3 4 MOV INC ADDS DAA SHLL SHLR ROTXL ROTXR NOT DEC SUBS DAS BRA BRN Table A.3(4) MOV CMP CMP SUB OR SUB OR ADD ADD Table * A.3(4) MOVFPE XOR XOR AND AND BHI BCC BLS MOV MOV MOV BCS BNE BEQ BVC MOV BVS BPL MOV BMI DEC DEC SUBS CMP BGE MOVTPE* BLT BGT BLE NOT EXTU EXTU ROTXR ROTXR ROTXL ROTXL ROTL ROTR NEG NEG SUB DEC DEC SHLR SHLR SHAR SHLL SHLL SHAL INC INC ADDS MOV SHAL SHAR ROTL ROTR EXTS SHAL SHAR ROTL ROTR EXTS 5 7 8 9 A B 6 01 0A 0B 0F 10 11 12 13 17 1A 1B 1F 58 6A 79 7A C Table A.3(3) ADD INC INC D Table A.3(3) E TAS F Table A.3(3)
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Table A-3 Operation Code Map (2)
Instruction code
AH AL
Appendix A Instruction Set
Page 1099 of 1458
Note: * Cannot be used in this LSI.
Page 1100 of 1458
1st byte AH AL BH BL CH CL DH DL 2nd byte 3rd byte 4th byte Instruction when most significant bit of DH is 0. Instruction when most significant bit of DH is 1. CL 0 1 3 4 5 6 7 8 9 A MULXS DIVXS DIVXS OR BTST BTST BSET BCLR BCLR BTST BTST BSET BCLR BCLR BSET BNOT BNOT BSET BNOT BNOT XOR AND 2 MULXS B C D E F *1 BXOR BAND BLD BOR BIXOR BIAND BILD BIOR BST BIST BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
Appendix A Instruction Set
Table A-3 Operation Code Map (3)
Instruction code
AH AL BH BL CH
01C05
01D05
01F06
7Cr06 *1
7Cr07
7Dr06 *1
7Dr07 *1
7Eaa6 *2
7Eaa7 *2
7Faa6 *2
7Faa7 *2
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
Notes: 1. r is the register specification field. 2. aa is the absolute address specification.
May 28, 2010
REJ09B0103-0800 Rev. 8.00
1st byte AH AL BH BL CH CL DH DL EH EL FH FL 2nd byte 3rd byte 4th byte 5th byte 6th byte EL 0 4 5 6 7 8 9 A B BTST BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST 1 2 3 C D E F BSET BNOT BCLR 1st byte AH AL BH BL CH CL DH DL EH 2nd byte 3rd byte 4th byte 5th byte EL 6th byte FH FL 7th byte GH GL 8th byte HH HL GL 0 BTST 1 2 3 4 5 6 7 8 9 A B C D E F BSET BNOT BCLR BOR BXOR BAND BLD BIOR BIXOR BIAND BILD BST BIST
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Table A-3 Operation Code Map (4)
Instruction code
Instruction when most significant bit of FH is 0. Instruction when most significant bit of FH is 1.
AHALBHBLCHCLDHDLEH
6A10aaaa6*
6A10aaaa7*
6A18aaaa6*
6A18aaaa7*
Instruction code
Instruction when most significant bit of HH is 0. Instruction when most significant bit of HH is 1.
AHALBHBL ... FHFLGH
6A30aaaaaaaa6*
6A30aaaaaaaa7*
6A38aaaaaaaa6*
6A38aaaaaaaa7*
Appendix A Instruction Set
Page 1101 of 1458
Note: * aa is the absolute address specification.
Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
A.4
Number of States Required for Instruction Execution
The tables in this section can be used to calculate the number of states required for instruction execution by the CPU. Table A-5 indicates the number of instruction fetch, data read/write, and other cycles occurring in each instruction. Table A-4 indicates the number of states required for each cycle. The number of states required for execution of an instruction can be calculated from these two tables as follows: Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN Examples: Advanced mode, program code and stack located in external memory, on-chip supporting modules accessed in two states with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. 1. BSET #0, @FFFFC7:8 From table A-5: I = L = 2, J = K = M = N = 0 From table A-4: SI = 4, SL = 2 Number of states required for execution = 2 × 4 + 2 × 2 = 12 2. JSR @@30 From table A-5: I = J = K = 2, L = M = N = 0 From table A-4: SI = SJ = SK = 4 Number of states required for execution = 2 × 4 + 2 × 4 + 2 × 4 = 24
Page 1102 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix A Instruction Set
Table A-4
Number of States per Cycle
Access Conditions On-Chip Supporting Module External Device 8-Bit Bus 16-Bit Bus
Cycle Instruction fetch Stack operation Byte data access Word data access Internal operation SI SK SL SM SN
On-Chip 8-Bit Memory Bus 1 4
16-Bit Bus 2
2-State 3-State 2-State 3-State Access Access Access Access 4 6 + 2m 2 3+m
Branch address read SJ 2 4 1 1 1 2 4 1 3+m 6 + 2m 1 1 1
Legend: m: Number of wait states inserted into external device access
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Table A-5
Number of Cycles in Instruction Execution
Branch Instruction Address Fetch Read Byte Stack Data Operation Access K L Word Data Access M Internal Operation N
Instruction ADD
Mnemonic ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd
I 1 1 2 1 3 1 1 1 1 1 1 2 1 3 2 1 2 1 2 2 3 4 2 2 2 2 2 2 2 2 2
J
ADDS ADDX
ADDS #1/2/4,ERd ADDX #xx:8,Rd ADDX Rs,Rd
AND
AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd
ANDC
ANDC #xx:8,CCR ANDC #xx:8,EXR
BAND
BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32
1 1 1 1
Bcc
BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction Bcc Mnemonic BVS d:8 BPL d:8 BMI d:8 BGE d:8 BLT d:8 BGT d:8 BLE d:8 BRA d:16 (BT d:16) BRN d:16 (BF d:16) BHI d:16 BLS d:16 BCC d:16 (BHS d:16) BCS d:16 (BLO d:16) BNE d:16 BEQ d:16 BVC d:16 BVS d:16 BPL d:16 BMI d:16 BGE d:16 BLT d:16 BGT d:16 BLE d:16 BCLR BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16 BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 I 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 2 2 3 4 1 2 2 3 4 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
2 2 2 2
2 2 2 2
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Branch Instruction Address Fetch Read Instruction BIAND Mnemonic BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR BIOR #xx:8,Rd BIOR #xx:8,@ERd BIOR #xx:8,@aa:8 BIOR #xx:8,@aa:16 BIOR #xx:8,@aa:32 BIST BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 I 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
1 1 1 1
1 1 1 1
1 1 1 1
2 2 2 2
1 1 1 1
1 1 1 1
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction BNOT Mnemonic BNOT #xx:3,Rd BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 BOR BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BSR BSR d:8 BSR d:16 BST BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 I 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 2 2 1 2 2 3 4 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
2 2 2 2
2 2 2 2
1 1 1 1
2 2 2 2
2 2 2 2 2 2 1
2 2 2 2
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Branch Instruction Address Fetch Read Instruction BTST Mnemonic BTST #xx:3,Rd BTST #xx:3,@ERd BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 CLRMAC CMP CLRMAC CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA DAS DEC DAA Rd DAS Rd DEC.B Rd DEC.W #1/2,Rd DEC.L #1/2,ERd DIVXS DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU DIVXU.B Rs,Rd DIVXU.W Rs,ERd I 1 2 2 3 4 1 2 2 3 4 1 2 2 3 4 1 1 1 2 1 3 1 1 1 1 1 1 2 2 1 1 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
1 1 1 1
1 1 1 1
1 1 1 1 1*3
11 19 11 19
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction EEPMOV Mnemonic EEPMOV.B EEPMOV.W EXTS EXTS.W Rd EXTS.L ERd EXTU EXTU.W Rd EXTU.L ERd INC INC.B Rd INC.W #1/2,Rd INC.L #1/2,ERd JMP JMP @ERn JMP @aa:24 JMP @@aa:8 JSR JSR @ERn JSR @aa:24 JSR @@aa:8 LDC LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR LDC @ERs+,EXR LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR I 2 2 1 1 1 1 1 1 1 2 2 2 2 2 2 1 2 1 1 2 2 3 3 5 5 2 2 3 3 4 4 2 2 J
Byte Stack Data Operation Access K L 2n+2*2 2n+2*2
Word Data Access M
Internal Operation N
1 1 2 2 2 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Branch Instruction Address Fetch Read Instruction LDM Mnemonic LDM.L @SP+, (ERn-ERn+1) LDM.L @SP+, (ERn-ERn+2) LDM.L @SP+, (ERn-ERn+3) LDMAC LDMAC ERs,MACH LDMAC ERs,MACL MAC MOV MAC @ERn+,@ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@-ERd MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+,Rd MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd I 2 2 2 1 1 2 1 1 1 2 4 1 1 2 3 1 2 4 1 1 2 3 2 1 1 2 4 1 2 3 1 J
Byte Stack Data Operation Access K 4 6 8 L
Word Data Access M
Internal Operation N 1 1 1 1*3 1*3
2
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction MOV Mnemonic MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@-ERd MOV.W Rs,@aa:16 MOV.W Rs,@aa:32 MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd MOV.L @aa:16,ERd MOV.L @aa:32,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd) MOV.L ERs,@-ERd MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 MOVFPE MOVTPE MULXS MOVFPE @:aa:16,Rd MOVTPE Rs,@:aa:16 MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU MULXU.B Rs,Rd MULXU.W Rs,ERd NEG NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT NOP NOT.B Rd NOT.W Rd NOT.L ERd 2 2 1 1 1 1 1 1 1 1 1 I 2 4 1 2 3 3 1 2 3 5 2 3 4 2 3 5 2 3 4 J
Byte Stack Data Operation Access K L
Word Data Access M 1 1 1 1
Internal Operation N
2 2 2 2 2 2 2 2 2 2 2 2 1 1
Can not be used in this LSI
2 3 2 3
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Branch Instruction Address Fetch Read Instruction OR Mnemonic OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC ORC #xx:8,CCR ORC #xx:8,EXR POP POP.W Rn POP.L ERn PUSH PUSH.W Rn PUSH.L ERn ROTL ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd ROTR ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd ROTXL ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd I 1 1 2 1 3 2 1 2 1 2 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
1 2 1 2
1 1 1 1
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction ROTXR Mnemonic ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd RTE RTS SHAL RTE RTS SHAL.B Rd SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd SHLL SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd SHLR SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd SLEEP SLEEP I 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
2/3*1 2
1 1
1
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Branch Instruction Address Fetch Read Instruction STC Mnemonic STC.B CCR,Rd STC.B EXR,Rd STC.W CCR,@ERd STC.W EXR,@ERd I 1 1 2 2 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
1 1 1 1 1 1 1 1 1 1 1 1 4 6 8 1 1 1 0*3 0*3 1 1
STC.W CCR,@(d:16,ERd) 3 STC.W EXR,@(d:16,ERd) 3 STC.W CCR,@(d:32,ERd) 5 STC.W EXR,@(d:32,ERd) 5 STC.W CCR,@-ERd STC.W EXR,@-ERd STC.W CCR,@aa:16 STC.W EXR,@aa:16 STC.W CCR,@aa:32 STC.W EXR,@aa:32 STM STM.L (ERn-ERn+1), @-SP STM.L (ERn-ERn+2), @-SP STM.L (ERn-ERn+3), @-SP STMAC STMAC MACH,ERd STMAC MACL,ERd SUB SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd SUBS SUBX TAS*4 TRAPA SUBS #1/2/4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS @ERd TRAPA #x:2 2 2 3 3 4 4 2 2 2 1 1 1 2 1 3 1 1 1 1 2 2 2 2/3*1 2
2
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Appendix A Instruction Set
Branch Instruction Address Fetch Read Instruction XOR Mnemonic XOR.B #xx:8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd XORC XORC #xx:8,CCR XORC #xx:8,EXR I 1 1 2 1 3 2 1 2 J
Byte Stack Data Operation Access K L
Word Data Access M
Internal Operation N
Notes: 1. 2 when EXR is invalid, 3 when EXR is valid. 2. When n bytes of data are transferred. 3. An internal operation may require between 0 and 3 additional states, depending on the preceding instruction. 4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
A.5
Bus States during Instruction Execution
Table A-6 indicates the types of cycles that occur during instruction execution by the CPU. See table A-4 for the number of states per cycle. How to Read the Table:
Order of execution Instruction
JMP@aa:24
1
R:W 2nd
2
3
4
5
6
7
8
Internal operation, R:W EA 1 state
End of instruction Read effective address (word-size read) No read or write Read 2nd word of current instruction (word-size read)
Legend R:B R:W W:B W:W :M 2nd 3rd 4th 5th NEXT EA VEC Byte-size read Word-size read Byte-size write Word-size write Transfer of the bus is not performed immediately after this cycle Address of 2nd word (3rd and 4th bytes) Address of 3rd word (5th and 6th bytes) Address of 4th word (7th and 8th bytes) Address of 5th word (9th and 10th bytes) Address of next instruction Effective address Vector address
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Appendix A Instruction Set
Figure A-1 shows timing waveforms for the address bus and the RD, HWR, and LWR signals during execution of the above instruction with an 8-bit bus, using three-state access with no wait states.
φ Address bus RD HWR, LWR
High level
R:W 2nd Fetching 3rd byte of instruction Fetching 4th byte of instruction
Internal operation
R:W EA Fetching 1nd byte of instruction at jump address Fetching 2nd byte of instruction at jump address
Figure A-1 Address Bus, RD, HWR, and LWR Timing (8-Bit Bus, Three-State Access, No Wait States)
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Table A-6 Instruction Execution Cycles
2 3 4 5 6 7 8 9
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R:W NEXT R:W 3rd R:W NEXT
Appendix A Instruction Set
R:W NEXT R:W 3rd R:W NEXT R:W NEXT R:B EA R:B EA R:W 3rd R:W 3rd R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W NEXT
Instruction ADD.B #xx:8,Rd ADD.B Rs,Rd ADD.W #xx:16,Rd ADD.W Rs,Rd ADD.L #xx:32,ERd ADD.L ERs,ERd ADDS #1/2/4,ERd ADDX #xx:8,Rd ADDX Rs,Rd AND.B #xx:8,Rd AND.B Rs,Rd AND.W #xx:16,Rd AND.W Rs,Rd AND.L #xx:32,ERd AND.L ERs,ERd ANDC #xx:8,CCR ANDC #xx:8,EXR BAND #xx:3,Rd BAND #xx:3,@ERd BAND #xx:3,@aa:8 BAND #xx:3,@aa:16 BAND #xx:3,@aa:32 BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 BMI d:8 BGE d:8 BLT d:8 BGT d:8
1 R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
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3 R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA R:W EA
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May 28, 2010
Instruction BLE d:8 BRA d:16 (BT d:16) R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:B:M EA R:B:M EA R:W 3rd
1 R:W NEXT R:W 2nd
4
5
6
7
8
9
BRN d:16 (BF d:16)
BHI d:16
BLS d:16
BCC d:16 (BHS d:16)
BCS d:16 (BLO d:16)
BNE d:16
BEQ d:16
BVC d:16
BVS d:16
BPL d:16
BMI d:16
BGE d:16
BLT d:16
BGT d:16
BLE d:16
2 R:W EA Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state Internal operation, 1 state R:W:M NEXT W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA
Appendix A Instruction Set
BCLR #xx:3,Rd BCLR #xx:3,@ERd BCLR #xx:3,@aa:8 BCLR #xx:3,@aa:16
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2 R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA
Appendix A Instruction Set
3 R:W 4th
4 R:B:M EA
5 6 R:W:M NEXT W:B EA
7
8
9
R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT
Instruction BCLR #xx:3,@aa:32 BCLR Rn,Rd BCLR Rn,@ERd BCLR Rn,@aa:8 BCLR Rn,@aa:16 BCLR Rn,@aa:32 BIAND #xx:3,Rd BIAND #xx:3,@ERd BIAND #xx:3,@aa:8 BIAND #xx:3,@aa:16 BIAND #xx:3,@aa:32 BILD #xx:3,Rd BILD #xx:3,@ERd BILD #xx:3,@aa:8 BILD #xx:3,@aa:16 BILD #xx:3,@aa:32 BIOR #xx:3,Rd BIOR #xx:3,@ERd BIOR #xx:3,@aa:8 BIOR #xx:3,@aa:16 BIOR #xx:3,@aa:32 BIST #xx:3,Rd BIST #xx:3,@ERd BIST #xx:3,@aa:8 BIST #xx:3,@aa:16 BIST #xx:3,@aa:32 BIXOR #xx:3,Rd BIXOR #xx:3,@ERd BIXOR #xx:3,@aa:8 BIXOR #xx:3,@aa:16 BIXOR #xx:3,@aa:32 BLD #xx:3,Rd BLD #xx:3,@ERd BLD #xx:3,@aa:8 BLD #xx:3,@aa:16 BLD #xx:3,@aa:32 BNOT #xx:3,Rd
1 R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
2 R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:W EA Internal operation, 1 state R:B:M EA R:B:M EA R:W 3rd R:W 3rd R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th W:W:M stack (H) R:W EA W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA W:W stack (L) W:W:M stack (H) W:W stack (L) R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA
Instruction BNOT #xx:3,@ERd BNOT #xx:3,@aa:8 BNOT #xx:3,@aa:16 BNOT #xx:3,@aa:32 BNOT Rn,Rd BNOT Rn,@ERd BNOT Rn,@aa:8 BNOT Rn,@aa:16 BNOT Rn,@aa:32 BOR #xx:3,Rd BOR #xx:3,@ERd BOR #xx:3,@aa:8 BOR #xx:3,@aa:16 BOR #xx:3,@aa:32 BSET #xx:3,Rd BSET #xx:3,@ERd BSET #xx:3,@aa:8 BSET #xx:3,@aa:16 BSET #xx:3,@aa:32 BSET Rn,Rd BSET Rn,@ERd BSET Rn,@aa:8 BSET Rn,@aa:16 BSET Rn,@aa:32 BSR d:8 BSR d:16
1 R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd
3 R:W:M NEXT R:W:M NEXT R:B:M EA R:W 4th
4 5 6 W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA
7
8
9
BST #xx:3,Rd BST #xx:3,@ERd BST #xx:3,@aa:8 BST #xx:3,@aa:16 BST #xx:3,@aa:32 BTST #xx:3,Rd BTST #xx:3,@ERd
R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd
W:B EA W:B EA R:W:M NEXT W:B EA R:B:M EA R:W:M NEXT W:B EA
Appendix A Instruction Set
Page 1121 of 1458
Page 1122 of 1458
2 R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd R:B EA R:B EA R:W 3rd R:W 3rd Internal operation, 1 state R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT R:W:M NEXT R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT
Appendix A Instruction Set
Instruction BTST #xx:3,@aa:8 BTST #xx:3,@aa:16 BTST #xx:3,@aa:32 BTST Rn,Rd BTST Rn,@ERd BTST Rn,@aa:8 BTST Rn,@aa:16 BTST Rn,@aa:32 BXOR #xx:3,Rd BXOR #xx:3,@ERd BXOR #xx:3,@aa:8 BXOR #xx:3,@aa:16 BXOR #xx:3,@aa:32 CLRMAC
1 R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W NEXT
3 4 5 R:W:M NEXT R:B EA R:W:M NEXT R:W 4th R:B EA R:W:M NEXT
6
7
8
9
R:W NEXT R:W 3rd R:W NEXT
CMP.B #xx:8,Rd CMP.B Rs,Rd CMP.W #xx:16,Rd CMP.W Rs,Rd CMP.L #xx:32,ERd CMP.L ERs,ERd DAA Rd DAS Rd DEC.B Rd DEC.W #1/2,Rd DEC.L #1/2,ERd DIVXS.B Rs,Rd DIVXS.W Rs,ERd DIVXU.B Rs,Rd DIVXU.W Rs,ERd EEPMOV.B EEPMOV.W EXTS.W Rd EXTS.L ERd EXTU.W Rd EXTU.L ERd INC.B Rd R:W NEXT Internal operation, 11 states R:W NEXT Internal operation, 19 states Internal operation, 11 states Internal operation, 19 states R:B EAd*1 R:B EAs*2 W:B EAd*2 R:B EAs*1 R:B EAd*1 R:B EAs*2 W:B EAd*2 R:B EAs*1 ← Repeated n times*2 → R:W NEXT R:W NEXT
R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Instruction INC.W #1/2,Rd INC.L #1/2,ERd JMP @ERn JMP @aa:24 R:W NEXT R:W NEXT R:W 2nd R:W EA R:W EA Internal operation, R:W EA 1 state R:W:M aa:8 R:W aa:8
1 R:W NEXT R:W NEXT R:W NEXT R:W 2nd
2
3
4
5
6
7
8
9
JMP @@aa:8
JSR @ERn JSR @aa:24
Internal operation, R:W EA 1 state R:W EA W:W:M stack (H) W:W stack (L) Internal operation, R:W EA W:W:M stack (H) W:W stack (L) 1 state R:W:M aa:8 R:W aa:8 W:W:M stack (H) W:W stack (L) R:W NEXT
JSR @@aa:8 LDC #xx:8,CCR LDC #xx:8,EXR LDC Rs,CCR LDC Rs,EXR LDC @ERs,CCR LDC @ERs,EXR LDC @(d:16,ERs),CCR LDC @(d:16,ERs),EXR LDC @(d:32,ERs),CCR LDC @(d:32,ERs),EXR LDC @ERs+,CCR R:W NEXT R:W NEXT R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W NEXT R:W EA R:W EA R:W 5th R:W 5th R:W EA R:W NEXT R:W NEXT R:W EA R:W EA R:W EA R:W NEXT R:W EA R:W NEXT R:W EA R:W:M stack (H)*3 R:W stack (L)*3 R:W:M stack (H)*3 R:W stack (L)*3 R:W:M stack (H)*3 R:W stack (L)*3 ←Repeated n times *3→ R:W EA R:W EA R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd
R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd
LDC @ERs+,EXR
LDC @aa:16,CCR LDC @aa:16,EXR LDC @aa:32,CCR LDC @aa:32,EXR LDM.L @SP+, (ERn–ERn+1)*9 LDM.L @SP+,(ERn–ERn+2)*9
LDM.L @SP+,(ERn–ERn+3)*9 R:W 2nd R:W NEXT
Appendix A Instruction Set
Page 1123 of 1458
LDMAC ERs,MACH
R:W EA R:W EA R:W NEXT R:W NEXT R:W 4th R:W 4th Internal operation, 1 state R:W NEXT Internal operation, 1 state R:W 3rd R:W NEXT R:W 3rd R:W NEXT R:W 3rd R:W 4th R:W 3rd R:W 4th R:W:M NEXT Internal operation, 1 state R:W NEXT Internal operation, 1 state R:W NEXT Internal operation, 1 state Internal operation, 1 state
Instruction LDMAC ERs,MACL R:W EAm
Page 1124 of 1458
1 R:W NEXT
2 3 Internal operation, 1 state R:W NEXT R:W EAh
4
5
6
7
8
9
Appendix A Instruction Set
MAC @ERn+,@ERm+ MOV.B #xx:8,Rd MOV.B Rs,Rd MOV.B @ERs,Rd MOV.B @(d:16,ERs),Rd MOV.B @(d:32,ERs),Rd MOV.B @ERs+,Rd R:B EA R:W 4th R:B EA R:W NEXT R:B EA
R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT
R:B EA R:W NEXT R:B EA
MOV.B @aa:8,Rd MOV.B @aa:16,Rd MOV.B @aa:32,Rd MOV.B Rs,@ERd MOV.B Rs,@(d:16,ERd) MOV.B Rs,@(d:32,ERd) MOV.B Rs,@−ERd W:B EA R:W 4th W:B EA R:W NEXT W:B EA
R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT
R:B EA R:W NEXT R:W 3rd Internal operation, 1 state R:B EA R:W NEXT R:W 3rd W:B EA R:W NEXT R:W 3rd Internal operation, 1 state W:B EA R:W NEXT R:W 3rd R:W NEXT W:B EA R:W NEXT W:B EA
MOV.B Rs,@aa:8 MOV.B Rs,@aa:16 MOV.B Rs,@aa:32 MOV.W #xx:16,Rd MOV.W Rs,Rd MOV.W @ERs,Rd MOV.W @(d:16,ERs),Rd MOV.W @(d:32,ERs),Rd MOV.W @ERs+, Rd R:W EA R:W 4th R:W EA R:W NEXT R:W EA R:W NEXT R:W EA
R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W NEXT
R:B EA
MOV.W @aa:16,Rd MOV.W @aa:32,Rd MOV.W Rs,@ERd MOV.W Rs,@(d:16,ERd) MOV.W Rs,@(d:32,ERd) MOV.W Rs,@−ERd W:W EA R:E 4th W:W EA W:W EA R:W NEXT R:W 2nd R:W 2nd
R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT
R:W NEXT
W:W EA
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
MOV.W Rs,@aa:16 MOV.W Rs,@aa:32
R:W EA R:W NEXT R:W 3rd Internal operation, 1 state R:W NEXT R:W 3rd W:W EA R:W NEXT R:W 3rd Internal operation, 1 state R:W NEXT R:W 3rd W:W EA
May 28, 2010
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
2 R:W 3rd
3 R:W NEXT
4
5
6
7
8
9
Instruction MOV.L #xx:32,ERd MOV.L ERs,ERd MOV.L @ERs,ERd MOV.L @(d:16,ERs),ERd MOV.L @(d:32,ERs),ERd MOV.L @ERs+,ERd R:W:M NEXT R:W:M 3rd R:W:M 3rd R:W:M NEXT R:W EA+2 R:W NEXT R:W EA+2 R:W:M EA R:W EA+2 R:W EA+2 R:W:M EA R:W EA+2 R:W EA+2 R:W:M EA R:W 5th R:W:M EA
1 R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd
MOV.L @aa:16,ERd MOV.L @aa:32,ERd MOV.L ERs,@ERd MOV.L ERs,@(d:16,ERd) MOV.L ERs,@(d:32,ERd) MOV.L ERs,@–ERd W:W EA+2 R:W NEXT W:W EA+2 W:W:M EA W:W EA+2 W:W:M EA W:W EA+2 W:W EA+2 W:W:M EA R:W NEXT
R:W:M EA R:W NEXT R:W:M 4th Internal operation, 1 state R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W 4th R:W 2nd R:W:M NEXT W:W:M EA R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W:M 4th R:W 2nd R:W:M NEXT Internal operation, 1 state R:W 2nd R:W:M 3rd R:W NEXT R:W 2nd R:W:M 3rd R:W 4th Cannot be used in this LSI R:W:M EA R:W NEXT W:W EA+2 W:W:M EA R:W 5th W:W:M EA R:W NEXT Internal operation, 2 states R:W NEXT Internal operation, 3 states Internal operation, 2 states Internal operation, 3 states
R:W NEXT R:W 3rd R:W NEXT R:W NEXT
Appendix A Instruction Set
MOV.L ERs,@aa:16 MOV.L ERs,@aa:32 MOVFPE @aa:16,Rd MOVTPE Rs,@aa:16 MULXS.B Rs,Rd MULXS.W Rs,ERd MULXU.B Rs,Rd MULXU.W Rs,ERd NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT.B Rd NOT.W Rd NOT.L ERd OR.B #xx:8,Rd OR.B Rs,Rd OR.W #xx:16,Rd OR.W Rs,Rd OR.L #xx:32,ERd OR.L ERs,ERd ORC #xx:8,CCR ORC #xx:8,EXR R:W 2nd R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd R:W NEXT
Page 1125 of 1458
Instruction POP.W Rn R:W 2nd R:W NEXT R:W 2nd W:W EA+2 R:W EA+2
1 R:W NEXT
5
6
7
8
9
POP.L ERn
Page 1126 of 1458
PUSH.W Rn
Appendix A Instruction Set
PUSH.L ERn
2 3 4 Internal operation, R:W EA 1 state R:W:M NEXT Internal operation, R:W:M EA 1 state Internal operation, W:W EA 1 state R:W:M NEXT Internal operation, W:W:M EA 1 state
ROTL.B Rd ROTL.B #2,Rd ROTL.W Rd ROTL.W #2,Rd ROTL.L ERd ROTL.L #2,ERd ROTR.B Rd ROTR.B #2,Rd ROTR.W Rd ROTR.W #2,Rd ROTR.L ERd ROTR.L #2,ERd ROTXL.B Rd ROTXL.B #2,Rd ROTXL.W Rd ROTXL.W #2,Rd ROTXL.L ERd ROTXL.L #2,ERd ROTXR.B Rd ROTXR.B #2,Rd ROTXR.W Rd ROTXR.W #2,Rd ROTXR.L ERd ROTXR.L #2,ERd RTE
R:W stack (EXR) R:W:M stack (H) R:W stack (H) R:W stack (L) 1 state R:W stack (L) R:W NEXT R:W NEXT Internal operation, R:W*4 1 state Internal operation, R:W*4
R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT
RTS
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
SHAL.B Rd
May 28, 2010
REJ09B0103-0800 Rev. 8.00
2 3 4 5 6 7 8 9 Internal operation:M Instruction SHAL.B #2,Rd SHAL.W Rd SHAL.W #2,Rd SHAL.L ERd SHAL.L #2,ERd SHAR.B Rd SHAR.B #2,Rd SHAR.W Rd SHAR.W #2,Rd SHAR.L ERd SHAR.L #2,ERd SHLL.B Rd SHLL.B #2,Rd SHLL.W Rd SHLL.W #2,Rd SHLL.L ERd SHLL.L #2,ERd SHLR.B Rd SHLR.B #2,Rd SHLR.W Rd SHLR.W #2,Rd SHLR.L ERd SHLR.L #2,ERd SLEEP STC CCR,Rd STC EXR,Rd STC CCR,@ERd STC EXR,@ERd STC CCR,@(d:16,ERd) STC EXR,@(d:16,ERd) STC CCR,@(d:32,ERd) STC EXR,@(d:32,ERd) STC CCR,@−ERd R:W NEXT R:W NEXT R:W 3rd R:W 3rd R:W 3rd R:W 3rd R:W NEXT W:W EA W:W EA R:W 5th R:W 5th W:W EA 1 R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd R:W 2nd
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
R:W NEXT R:W NEXT
W:W EA W:W EA
STC EXR,@−ERd R:W 2nd R:W 2nd R:W 2nd R:W 3rd R:W 3rd R:W NEXT STC CCR,@aa:16 STC EXR,@aa:16
W:W EA W:W EA R:W NEXT R:W NEXT R:W 4th R:W 4th Internal operation, 1 state Internal operation, 1 state R:W NEXT R:W NEXT
W:W EA W:W EA W:W EA
Appendix A Instruction Set
Page 1127 of 1458
1 Instruction STC CCR,@aa:32 R:W 2nd STC EXR,@aa:32 R:W 2nd STM.L(ERn–ERn+1),@−SP*9 R:W 2nd W:W:M stack (H)*3 W:W stack (L)*3 W:W:M stack (H)*3 W:W stack (L)*3
4 5 R:W NEXT W:W EA R:W NEXT W:W EA W:W:M stack (H)*3 W:W stack (L)*3
6
7
8
9
Page 1128 of 1458
STM.L(ERn–ERn+2),@−SP*9 R:W 2nd
Appendix A Instruction Set
STM.L(ERn–ERn+3),@−SP*9 R:W 2nd
2 3 R:W 3rd R:W 4th R:W 3rd R:W 4th R:W:M NEXT Internal operation, 1 state R:W:M NEXT Internal operation, 1 state R:W:M NEXT Internal operation, 1 state
R:W NEXT R:W 3rd R:W NEXT
STMAC MACH,ERd STMAC MACL,ERd SUB.B Rs,Rd SUB.W #xx:16,Rd SUB.W Rs,Rd SUB.L #xx:32,ERd SUB.L ERs,ERd SUBS #1/2/4,ERd SUBX #xx:8,Rd SUBX Rs,Rd TAS @ERd*8 TRAPA #x:2 R:W NEXT R:B:M EA Internal operation, W:W stack (L) 1 state W:B EA W:W stack (H) W:W stack (EXR) R:W:M VEC R:W VEC+2
R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W NEXT R:W NEXT R:W NEXT R:W NEXT R:W 2nd R:W NEXT
Internal operation, R:W*7 1 state
R:W NEXT R:W 3rd R:W NEXT R:W NEXT
XOR.B #xx8,Rd XOR.B Rs,Rd XOR.W #xx:16,Rd XOR.W Rs,Rd XOR.L #xx:32,ERd XOR.L ERs,ERd XORC #xx:8,CCR XORC #xx:8,EXR
R:W NEXT R:W NEXT R:W 2nd R:W NEXT R:W 2nd R:W 2nd R:W NEXT R:W 2nd
R:W NEXT
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Instruction Reset exception handling W:W stack (EXR) R:W:M VEC R:W VEC+2 Internal operation, R:W*7 1 state
1 R:W VEC
2 R:W VEC+2
5
6
7
8
9
REJ09B0103-0800 Rev. 8.00
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
May 28, 2010
Interrupt exception handling R:W*6
3 4 Internal operation, R:W*5 1 state Internal operation, W:W stack (L) W:W stack (H) 1 state
Notes: 1. EAs is the contents of ER5. EAd is the contents of ER6. 2. EAs is the contents of ER5. EAd is the contents of ER6. Both registers are incremented by 1 after execution of the instruction. n is the initial value of R4L or R4. If n = 0, these bus cycles are not executed. 3. Repeated two times to save or restore two registers, three times for three registers, or four times for four registers. 4. Start address after return. 5. Start address of the program. 6. Prefetch address, equal to two plus the PC value pushed onto the stack. In recovery from sleep mode or software standby mode the read operation is replaced by an internal operation. 7. Start address of the interrupt-handling routine. 8. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. 9. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
Appendix A Instruction Set
Page 1129 of 1458
Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
A.6
Condition Code Modification
This section indicates the effect of each CPU instruction on the condition code. The notation used in the table is defined below. m= 31 for longword operands 15 for word operands 7 for byte operands Si Di Ri Dn — The i-th bit of the source operand The i-th bit of the destination operand The i-th bit of the result The specified bit in the destination operand Not affected Modified according to the result of the instruction (see definition) 0 1 * Z' C' Always cleared to 0 Always set to 1 Undetermined (no guaranteed value) Z flag before instruction execution C flag before instruction execution
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Appendix A Instruction Set
Table A-7
Instruction ADD
Condition Code Modification
H N Z V C Definition H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4 N = Rm Z = Rm · Rm–1 · ...... · R0 V = Sm · Dm · Rm + Sm · Dm · Rm C = Sm · Dm + Dm · Rm + Sm · Rm
ADDS ADDX
————— H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4 N = Rm Z = Z' · Rm · ...... · R0 V = Sm · Dm · Rm + Sm · Dm · Rm C = Sm · Dm + Dm · Rm + Sm · Rm
AND ANDC BAND Bcc BCLR BIAND BILD BIOR BIST BIXOR BLD BNOT BOR BSET BSR BST BTST BXOR
—
0
—
N = Rm Z = Rm · Rm–1 · ...... · R0 Stores the corresponding bits of the result. No flags change when the operand is EXR.
———— ————— ————— ———— ———— ———— ————— ———— ———— ————— ———— ————— ————— ————— —— ——
C = C' · Dn
C = C' · Dn C = Dn C = C' + Dn C = C' · Dn + C' · Dn C = Dn C = C' + Dn
Z = Dn C = C' · Dn + C' · Dn
————
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Instruction CLRMAC CMP
H
N
Z
V
C
Definition H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4 N = Rm Z = Rm · Rm–1 · ...... · R0 V = Sm · Dm · Rm + Sm · Dm · Rm C = Sm · Dm + Dm · Rm + Sm · Rm
—————
DAA
*
*
N = Rm Z = Rm · Rm–1 · ...... · R0 C: decimal arithmetic carry
DAS
*
*
N = Rm Z = Rm · Rm–1 · ...... · R0 C: decimal arithmetic borrow
DEC
—
—
N = Rm Z = Rm · Rm–1 · ...... · R0 V = Dm · Rm
DIVXS DIVXU EEPMOV EXTS EXTU INC
— —
—— ——
N = Sm · Dm + Sm · Dm Z = Sm · Sm–1 · ...... · S0 N = Sm Z = Sm · Sm–1 · ...... · S0
————— — —0 — 0 0 — — — N = Rm Z = Rm · Rm–1 · ...... · R0 Z = Rm · Rm–1 · ...... · R0 N = Rm Z = Rm · Rm–1 · ...... · R0 V = Dm · Rm
JMP JSR LDC LDM LDMAC MAC
————— ————— Stores the corresponding bits of the result. No flags change when the operand is EXR. ————— ————— —————
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Appendix A Instruction Set
Instruction MOV MOVFPE MOVTPE MULXS MULXU NEG
H —
N
Z
V 0
C —
Definition N = Rm Z = Rm · Rm–1 · ...... · R0 Can not be used in this LSI.
—
——
N = R2m Z = R2m · R2m–1 · ...... · R0
————— H = Dm–4 + Rm–4 N = Rm Z = Rm · Rm–1 · ...... · R0 V = Dm · Rm C = Dm + Rm
NOP NOT OR ORC POP PUSH ROTL
————— — — 0 0 — — N = Rm Z = Rm · Rm–1 · ...... · R0 N = Rm Z = Rm · Rm–1 · ...... · R0 Stores the corresponding bits of the result. No flags change when the operand is EXR. — — — 0 0 0 — — N = Rm Z = Rm · Rm–1 · ...... · R0 N = Rm Z = Rm · Rm–1 · ...... · R0 N = Rm Z = Rm · Rm–1 · ...... · R0 C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
ROTR
—
0
N = Rm Z = Rm · Rm–1 · ...... · R0 C = D0 (1-bit shift) or C = D1 (2-bit shift)
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Appendix A Instruction Set
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Instruction ROTXL
H —
N
Z
V 0
C
Definition N = Rm Z = Rm · Rm–1 · ...... · R0 C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
ROTXR
—
0
N = Rm Z = Rm · Rm–1 · ...... · R0 C = D0 (1-bit shift) or C = D1 (2-bit shift)
RTE RTS SHAL ————— —
Stores the corresponding bits of the result. N = Rm Z = Rm · Rm–1 · ...... · R0 V = Dm · Dm–1 + Dm · Dm–1 (1-bit shift) V = Dm · Dm–1 · Dm–2 · Dm · Dm–1 · Dm–2 (2-bit shift) C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
SHAR
—
0
N = Rm Z = Rm · Rm–1 · ...... · R0 C = D0 (1-bit shift) or C = D1 (2-bit shift)
SHLL
—
0
N = Rm Z = Rm · Rm–1 · ...... · R0 C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
SHLR
—0
0
N = Rm Z = Rm · Rm–1 · ...... · R0 C = D0 (1-bit shift) or C = D1 (2-bit shift)
SLEEP STC STM STMAC
————— ————— ————— — — N = 1 if MAC instruction resulted in negative value in MAC register Z = 1 if MAC instruction resulted in zero value in MAC register V = 1 if MAC instruction resulted in overflow
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Appendix A Instruction Set
Instruction SUB
H
N
Z
V
C
Definition H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4 N = Rm Z = Rm · Rm–1 · ...... · R0 V = Sm · Dm · Rm + Sm · Dm · Rm C = Sm · Dm + Dm · Rm + Sm · Rm
SUBS SUBX
————— H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4 N = Rm Z = Z' · Rm · ...... · R0 V = Sm · Dm · Rm + Sm · Dm · Rm C = Sm · Dm + Dm · Rm + Sm · Rm
TAS TRAPA XOR XORC
—
0
—
N = Dm Z = Dm · Dm–1 · ...... · D0
————— — 0 — N = Rm Z = Rm · Rm–1 · ...... · R0 Stores the corresponding bits of the result. No flags change when the operand is EXR.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
B.1
Address
Address
Register Name Bit 7 SM1 CHNE Bit 6 SM0 DISEL Bit 5 DM1 — Bit 4 DM0 — Bit 3 MD1 — Bit 2 MD0 — Bit 1 DTS — Bit 0 Sz — Module Name DTC*7 Data Bus Width 8/16/32
H'EBC0 to MRA H'EFBF MRB SAR
DAR
CRA
CRB
H'F800 H'F801 H'F802 H'F803 H'F804 H'F805 H'F806 H'F807 H'F808 H'F809 H'F80A H'F80B H'F80C H'F80D H'F80E H'F80F H'F810 H'F811 H'F812 H'F813 H'F814 H'F815 H'F816 H'F817 H'F818 H'F819
MCR0 GSR0 BCR0
MCR7 — BCR7 BCR15
— — BCR6 BCR14 MBCR6 MBCR14 TXPR6 TXPR14 TXCR6 TXCR14 TXACK6 TXACK14 ABACK6 ABACK14 RXPR6 RXPR14 RFPR6 RFPR14 IRR6 — MBIMR6 MBIMR14 IMR6 —
MCR5 — BCR5 BCR13 MBCR5 MBCR13 TXPR5 TXPR13 TXCR5 TXCR13 TXACK5 TXACK13 ABACK5 ABACK13 RXPR5 RXPR13 RFPR5 RFPR13 IRR5 — MBIMR5 MBIMR13 IMR5 —
— — BCR4 BCR12 MBCR4 MBCR12 TXPR4 TXPR12 TXCR4 TXCR12 TXACK4 TXACK12 ABACK4 ABACK12 RXPR4 RXPR12 RFPR4 RFPR12 IRR4 IRR12 MBIMR4 MBIMR12 IMR4 IMR12
— GSR3 BCR3 BCR11 MBCR3 MBCR11 TXPR3 TXPR11 TXCR3 TXCR11 TXACK3 TXACK11 ABACK3 ABACK11 RXPR3 RXPR11 RFPR3 RFPR11 IRR3 — MBIMR3 MBIMR11 IMR3 —
MCR2 GSR2 BCR2 BCR10 MBCR2 MBCR10 TXPR2 TXPR10 TXCR2 TXCR10 TXACK2 TXACK10 ABACK2 ABACK10 RXPR2 RXPR10 RFPR2 RFPR10 IRR2 — MBIMR2 MBIMR10 IMR2 —
MCR1 GSR1 BCR1 BCR9 MBCR1 MBCR9 TXPR1 TXPR9 TXCR1 TXCR9 TXACK1 TXACK9 ABACK1 ABACK9 RXPR1 RXPR9 RFPR1 RFPR9 IRR1 IRR9 MBIMR1 MBIMR9 IMR1 IMR9
MCR0 GSR0 BCR0 BCR8 — MBCR8 — TXPR8 — TXCR8 — TXACK8 — ABACK8 RXPR0 RXPR8 RFPR0 RFPR8 IRR0 IRR8 MBIMR0 MBIMR8 — IMR8
HCAN0
8/16
MBCR
MBCR7 MBCR15
TXPR
TXPR7 TXPR15
TXCR
TXCR7 TXCR15
TXACK
TXACK7 TXACK15
ABACK
ABACK7 ABACK15
RXPR
RXPR7 RXPR15
RFPR
RFPR7 RFPR15
HCAN0
8/16
IRR
IRR7 —
MBIMR
MBIMR7 MBIMR15
IMR
IMR7 —
REC TEC
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Appendix B Internal I/O Register
Address H'F81A H'F81B H'F81C H'F81D H'F81E H'F81F H'F820 H'F821 H'F822 H'F823 H'F824 H'F825 H'F826 H'F827 H'F828 H'F829 H'F82A H'F82B H'F82C H'F82D H'F82E H'F82F H'F830 H'F831 H'F832 H'F833 H'F834 H'F835 H'F836 H'F837 H'F838 H'F839 H'F83A H'F83B H'F83C H'F83D H'F83E H'F83F
Register Name UMSR
Bit 7 UMSR7 UMSR15
Bit 6 UMSR6 UMSR14 LAFML6 LAFML14 LAFMH6 LAFMH14 — — — — STD_ID1
Bit 5 UMSR5 UMSR13 LAFML5 LAFML13 LAFMH5 LAFMH13 — — — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 UMSR4 UMSR12 LAFML4 LAFML12 — LAFMH12 — — — — RTR STD_ID7 EXD_ID4
Bit 3 UMSR3 UMSR11 LAFML3 LAFML11 — LAFMH11 DLC3 — — — IDE STD_ID6 EXD_ID3
Bit 2 UMSR2 UMSR10 LAFML2 LAFML10 — LAFMH10 DLC2 — — — — STD_ID5 EXD_ID2
Bit 1 UMSR1 UMSR9 LAFML1 LAFML9 LAFMH1 LAFMH9 DLC1 — — —
Bit 0 UMSR0 UMSR8 LAFML0 LAFML8 LAFMH0 LAFMH8 DLC0 — — —
Module Name HCAN0
Data Bus Width 8/16
LAFML
LAFML7 LAFML15
LAFMH
LAFMH7 LAFMH15
MC0[1] MC0[2] MC0[3] MC0[4] MC0[5] MC0[6] MC0[7] MC0[8] MC1[1] MC1[2] MC1[3] MC1[4] MC1[5] MC1[6] MC1[7] MC1[8] MC2[1] MC2[2] MC2[3] MC2[4] MC2[5] MC2[6] MC2[7] MC2[8] MC3[1] MC3[2] MC3[3] MC3[4] MC3[5] MC3[6] MC3[7] MC3[8]
— — — — STD_ID2
HCAN0
8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'F840 H'F841 H'F842 H'F843 H'F844 H'F845 H'F846 H'F847 H'F848 H'F849 H'F84A H'F84B H'F84C H'F84D H'F84E H'F84F H'F850 H'F851 H'F852 H'F853 H'F854 H'F855 H'F856 H'F857 H'F858 H'F859 H'F85A H'F85B H'F85C H'F85D H'F85E H'F85F H'F860 H'F861 H'F862 H'F863 H'F864 H'F865 H'F866 H'F867
Register Name MC4[1] MC4[2] MC4[3] MC4[4] MC4[5] MC4[6] MC4[7] MC4[8] MC5[1] MC5[2] MC5[3] MC5[4] MC5[5] MC5[6] MC5[7] MC5[8] MC6[1] MC6[2] MC6[3] MC6[4] MC6[5] MC6[6] MC6[7] MC6[8] MC7[1] MC7[2] MC7[3] MC7[4] MC7[5] MC7[6] MC7[7] MC7[8] MC8[1] MC8[2] MC8[3] MC8[4] MC8[5] MC8[6] MC8[7] MC8[8]
Bit 7 — — — — STD_ID2
Bit 6 — — — — STD_ID1
Bit 5 — — — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — — — RTR STD_ID7 EXD_ID4
Bit 3 DLC3 — — — IDE STD_ID6 EXD_ID3
Bit 2 DLC2 — — — — STD_ID5 EXD_ID2
Bit 1 DLC1 — — —
Bit 0 DLC0 — — —
Module Name HCAN0
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
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Appendix B Internal I/O Register
Address H'F868 H'F869 H'F86A H'F86B H'F86C H'F86D H'F86E H'F86F H'F870 H'F871 H'F872 H'F873 H'F874 H'F875 H'F876 H'F877 H'F878 H'F879 H'F87A H'F87B H'F87C H'F87D H'F87E H'F87F H'F880 H'F881 H'F882 H'F883 H'F884 H'F885 H'F886 H'F887 H'F888 H'F889 H'F88A H'F88B H'F88C H'F88D H'F88E H'F88F
Register Name MC9[1] MC9[2] MC9[3] MC9[4] MC9[5] MC9[6] MC9[7] MC9[8] MC10[1] MC10[2] MC10[3] MC10[4] MC10[5] MC10[6] MC10[7] MC10[8] MC11[1] MC11[2] MC11[3] MC11[4] MC11[5] MC11[6] MC11[7] MC11[8] MC12[1] MC12[2] MC12[3] MC12[4] MC12[5] MC12[6] MC12[7] MC12[8] MC13[1] MC13[2] MC13[3] MC13[4] MC13[5] MC13[6] MC13[7] MC13[8]
Bit 7 — — — — STD_ID2
Bit 6 — — — — STD_ID1
Bit 5 — — — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — — — RTR STD_ID7 EXD_ID4
Bit 3 DLC3 — — — IDE STD_ID6 EXD_ID3
Bit 2 DLC2 — — — — STD_ID5 EXD_ID2
Bit 1 DLC1 — — —
Bit 0 DLC0 — — —
Module Name HCAN0
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'F890 H'F891 H'F892 H'F893 H'F894 H'F895 H'F896 H'F897 H'F898 H'F899 H'F89A H'F89B H'F89C H'F89D H'F89E H'F89F H'F8B0 H'F8B1 H'F8B2 H'F8B3 H'F8B4 H'F8B5 H'F8B6 H'F8B7 H'F8B8 H'F8B9 H'F8BA H'F8BB H'F8BC H'F8BD H'F8BE H'F8BF H'F8C0 H'F8C1 H'F8C2 H'F8C3 H'F8C4 H'F8C5 H'F8C6 H'F8C7
Register Name MC14[1] MC14[2] MC14[3] MC14[4] MC14[5] MC14[6] MC14[7] MC14[8] MC15[1] MC15[2] MC15[3] MC15[4] MC15[5] MC15[6] MC15[7] MC15[8] MD01 MD02 MD03 MD04 MD05 MD06 MD07 MD08 MD11 MD12 MD13 MD14 MD15 MD16 MD17 MD18 MD21 MD22 MD23 MD24 MD25 MD26 MD27 MD28
Bit 7 — — — — STD_ID2
Bit 6 — — — — STD_ID1
Bit 5 — — — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — — — RTR STD_ID7 EXD_ID4
Bit 3 DLC3 — — — IDE STD_ID6 EXD_ID3
Bit 2 DLC2 — — — — STD_ID5 EXD_ID2
Bit 1 DLC1 — — —
Bit 0 DLC0 — — —
Module Name HCAN0
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 HCAN0 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
HCAN0
8/16
HCAN0
8/16
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'F8C8 H'F8C9 H'F8CA H'F8CB H'F8CC H'F8CD H'F8CE H'F8CF H'F8D0 H'F8D1 H'F8D2 H'F8D3 H'F8D4 H'F8D5 H'F8D6 H'F8D7 H'F8D8 H'F8D9 H'F8DA H'F8DB H'F8DC H'F8DD H'F8DE H'F8DF H'F8E0 H'F8E1 H'F8E2 H'F8E3 H'F8E4 H'F8E5 H'F8E6 H'F8E7 H'F8E8 H'F8E9 H'F8EA H'F8EB H'F8EC H'F8ED H'F8EE H'F8EF
Register Name MD31 MD32 MD33 MD34 MD35 MD36 MD37 MD38 MD41 MD42 MD43 MD44 MD45 MD46 MD47 MD48 MD51 MD52 MD53 MD54 MD55 MD56 MD57 MD58 MD61 MD62 MD63 MD64 MD65 MD66 MD67 MD68 MD71 MD72 MD73 MD74 MD75 MD76 MD77 MD78
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN0
Data Bus Width 8/16
HCAN0
8/16
HCAN0
8/16
HCAN0
8/16
HCAN0
8/16
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1141 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'F8F0 H'F8F1 H'F8F2 H'F8F3 H'F8F4 H'F8F5 H'F8F6 H'F8F7 H'F8F8 H'F8F9 H'F8FA H'F8FB H'F8FC H'F8FD H'F8FE H'F8FF H'F900 H'F901 H'F902 H'F903 H'F904 H'F905 H'F906 H'F907 H'F908 H'F909 H'F90A H'F90B H'F90C H'F90D H'F90E H'F90F H'F910 H'F911 H'F912 H'F913 H'F914 H'F915 H'F916 H'F917
Register Name MD81 MD82 MD83 MD84 MD85 MD86 MD87 MD88 MD91 MD92 MD93 MD94 MD95 MD96 MD97 MD98 MD101 MD102 MD103 MD104 MD105 MD106 MD107 MD108 MD111 MD112 MD113 MD114 MD115 MD116 MD117 MD118 MD121 MD122 MD123 MD124 MD125 MD126 MD127 MD128
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN0
Data Bus Width 8/16
HCAN0
8/16
HCAN0
8/16
HCAN0
8/16
HCAN0
8/16
Page 1142 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'F918 H'F919 H'F91A H'F91B H'F91C H'F91D H'F91E H'F91F H'F920 H'F921 H'F922 H'F923 H'F924 H'F925 H'F926 H'F927 H'F928 H'F929 H'F92A H'F92B H'F92C H'F92D H'F92E H'F92F H'FA00 H'FA01 H'FA02 H'FA03 H'FA04 H'FA05 H'FA06 H'FA07 H'FA08 H'FA09 H'FA0A H'FA0B H'FA0C H'FA0D H'FA0E H'FA0F
Register Name MD131 MD132 MD133 MD134 MD135 MD136 MD137 MD138 MD141 MD142 MD143 MD144 MD145 MD146 MD147 MD148 MD151 MD152 MD153 MD154 MD155 MD156 MD157 MD158 MCR GSR BCR
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN0
Data Bus Width 8/16
HCAN0
8/16
MCR7 — BCR7 BCR15
— — BCR6 BCR14 MBCR6 MBCR14 TXPR6 TXPR14 TXCR6 TXCR14 TXACK6 TXACK14 ABACK6 ABACK14 RXPR6 RXPR14
MCR5 — BCR5 BCR13 MBCR5 MBCR13 TXPR5 TXPR13 TXCR5 TXCR13 TXACK5 TXACK13 ABACK5 ABACK13 RXPR5 RXPR13
— — BCR4 BCR12 MBCR4 MBCR12 TXPR4 TXPR12 TXCR4 TXCR12 TXACK4 TXACK12 ABACK4 ABACK12 RXPR4 RXPR12
— GSR3 BCR3 BCR11 MBCR3 MBCR11 TXPR3 TXPR11 TXCR3 TXCR11 TXACK3 TXACK11 ABACK3 ABACK11 RXPR3 RXPR11
MCR2 GSR2 BCR2 BCR10 MBCR2 MBCR10 TXPR2 TXPR10 TXCR2 TXCR10 TXACK2 TXACK10 ABACK2 ABACK10 RXPR2 RXPR10
MCR1 GSR1 BCR1 BCR9 MBCR1 MBCR9 TXPR1 TXPR9 TXCR1 TXCR9 TXACK1 TXACK9 ABACK1 ABACK9 RXPR1 RXPR9
MCR0 GSR0 BCR0 BCR8 — MBCR8 — TXPR8 — TXCR8 — TXACK8 — ABACK8 RXPR0 RXPR8
HCAN1*7
8/16
MBCR
MBCR7 MBCR15
TXPR
TXPR7 TXPR15
TXCR
TXCR7 TXCR15
TXACK
TXACK7 TXACK15
ABACK
ABACK7 ABACK15
RXPR
RXPR7 RXPR15
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1143 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FA10 H'FA11 H'FA12 H'FA13 H'FA14 H'FA15 H'FA16 H'FA17 H'FA18 H'FA19 H'FA1A H'FA1B H'FA1C H'FA1D H'FA1E H'FA1F H'FA20 H'FA21 H'FA22 H'FA23 H'FA24 H'FA25 H'FA26 H'FA27 H'FA28 H'FA29 H'FA2A H'FA2B H'FA2C H'FA2D H'FA2E H'FA2F H'FA30 H'FA31 H'FA32 H'FA33 H'FA34 H'FA35 H'FA36 H'FA37 H'FA38 H'FA39
Register Name RFPR
Bit 7 RFPR7 RFPR15
Bit 6 RFPR6 RFPR14 IRR6 — MBIMR6 MBIMR14 IMR6 —
Bit 5 RFPR5 RFPR13 IRR5 — MBIMR5 MBIMR13 IMR5 —
Bit 4 RFPR4 RFPR12 IRR4 IRR12 MBIMR4 MBIMR12 IMR4 IMR12
Bit 3 RFPR3 RFPR11 IRR3 — MBIMR3 MBIMR11 IMR3 —
Bit 2 RFPR2 RFPR10 IRR2 — MBIMR2 MBIMR10 IMR2 —
Bit 1 RFPR1 RFPR9 IRR1 IRR9 MBIMR1 MBIMR9 IMR1 IMR9
Bit 0 RFPR0 RFPR8 IRR0 IRR8 MBIMR0 MBIMR8 IMR0 IMR8
Module Name HCAN1*7
Data Bus Width 8/16
IRR
IRR7 —
MBIMR
MBIMR7 MBIMR15
IMR
IMR7 —
REC TEC UMSR UMSR7 UMSR15 LAFML LAFML7 LAFML15 LAFMH LAFMH7 LAFMH15 MC0[1] MC0[2] MC0[3] MC0[4] MC0[5] MC0[6] MC0[7] MC0[8] MC1[1] MC1[2] MC1[3] MC1[4] MC1[5] MC1[6] MC1[7] MC1[8] MC2[1] MC2[2] MC2[3] MC2[4] MC2[5] MC2[6] MC2[7] MC2[8] MC3[1] MC3[2] — — — — STD_ID2 UMSR6 UMSR14 LAFML6 LAFML14 LAFMH6 LAFMH14 — — — — STD_ID1 UMSR5 UMSR13 LAFML5 LAFML13 LAFMH5 LAFMH13 — — — — STD_ID0 STD_ID8 EXD_ID5 UMSR4 UMSR12 LAFML4 LAFML12 — LAFMH12 — — — — RTR STD_ID7 EXD_ID4 UMSR3 UMSR11 LAFML3 LAFML11 — LAFMH11 DLC3 — — — IDE STD_ID6 EXD_ID3 UMSR2 UMSR10 LAFML2 LAFML10 — LAFMH10 DLC2 — — — — STD_ID5 EXD_ID2 UMSR1 UMSR9 LAFML1 LAFML9 LAFMH1 LAFMH9 DLC1 — — — UMSR0 UMSR8 LAFML0 LAFML8 LAFMH0 LAFMH8 DLC0 — — — HCAN1*7 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — — — — — DLC3 — DLC2 — DLC1 —
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FA3A H'FA3B H'FA3C H'FA3D H'FA3E H'FA3F H'FA40 H'FA41 H'FA42 H'FA43 H'FA44 H'FA45 H'FA46 H'FA47 H'FA48 H'FA49 H'FA4A H'FA4B H'FA4C H'FA4D H'FA4E H'FA4F H'FA50 H'FA51 H'FA52 H'FA53 H'FA54 H'FA55 H'FA56 H'FA57 H'FA58 H'FA59 H'FA5A H'FA5B H'FA5C H'FA5D H'FA5E H'FA5F
Register Name MC3[3] MC3[4] MC3[5] MC3[6] MC3[7] MC3[8] MC4[1] MC4[2] MC4[3] MC4[4] MC4[5] MC4[6] MC4[7] MC4[8] MC5[1] MC5[2] MC5[3] MC5[4] MC5[5] MC5[6] MC5[7] MC5[8] MC6[1] MC6[2] MC6[3] MC6[4] MC6[5] MC6[6] MC6[7] MC6[8] MC7[1] MC7[2] MC7[3] MC7[4] MC7[5] MC7[6] MC7[7] MC7[8]
Bit 7 — — STD_ID2
Bit 6 — — STD_ID1
Bit 5 — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — RTR STD_ID7 EXD_ID4
Bit 3 — — IDE STD_ID6 EXD_ID3
Bit 2 — — — STD_ID5 EXD_ID2
Bit 1 — —
Bit 0 — —
Module Name HCAN1*7
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
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Page 1145 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FA60 H'FA61 H'FA62 H'FA63 H'FA64 H'FA65 H'FA66 H'FA67 H'FA68 H'FA69 H'FA6A H'FA6B H'FA6C H'FA6D H'FA6E H'FA6F H'FA70 H'FA71 H'FA72 H'FA73 H'FA74 H'FA75 H'FA76 H'FA77 H'FA78 H'FA79 H'FA7A H'FA7B H'FA7C H'FA7D H'FA7E H'FA7F H'FA80 H'FA81 H'FA82 H'FA83 H'FA84 H'FA85 H'FA86 H'FA87 H'FA88 H'FA89
Register Name MC8[1] MC8[2] MC8[3] MC8[4] MC8[5] MC8[6] MC8[7] MC8[8] MC9[1] MC9[2] MC9[3] MC9[4] MC9[5] MC9[6] MC9[7] MC9[8] MC10[1] MC10[2] MC10[3] MC10[4] MC10[5] MC10[6] MC10[7] MC10[8] MC11[1] MC11[2] MC11[3] MC11[4] MC11[5] MC11[6] MC11[7] MC11[8] MC12[1] MC12[2] MC12[3] MC12[4] MC12[5] MC12[6] MC12[7] MC12[8] MC13[1] MC13[2]
Bit 7 — — — — STD_ID2
Bit 6 — — — — STD_ID1
Bit 5 — — — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — — — RTR STD_ID7 EXD_ID4
Bit 3 DLC3 — — — IDE STD_ID6 EXD_ID3
Bit 2 DLC2 — — — — STD_ID5 EXD_ID2
Bit 1 DLC1 — — —
Bit 0 DLC0 — — —
Module Name HCAN1*7
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — — — — — DLC3 — DLC2 — DLC1 —
Page 1146 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FA8A H'FA8B H'FA8C H'FA8D H'FA8E H'FA8F H'FA90 H'FA91 H'FA92 H'FA93 H'FA94 H'FA95 H'FA96 H'FA97 H'FA98 H'FA99 H'FA9A H'FA9B H'FA9C H'FA9D H'FA9E H'FA9F H'FAB0 H'FAB1 H'FAB2 H'FAB3 H'FAB4 H'FAB5 H'FAB6 H'FAB7 H'FAB8 H'FAB9 H'FABA H'FABB H'FABC H'FABD H'FABE H'FABF
Register Name MC13[3] MC13[4] MC13[5] MC13[6] MC13[7] MC13[8] MC14[1] MC14[2] MC14[3] MC14[4] MC14[5] MC14[6] MC14[7] MC14[8] MC15[1] MC15[2] MC15[3] MC15[4] MC15[5] MC15[6] MC15[7] MC15[8] MD01 MD02 MD03 MD04 MD05 MD06 MD07 MD08 MD11 MD12 MD13 MD14 MD15 MD16 MD17 MD18
Bit 7 — — STD_ID2
Bit 6 — — STD_ID1
Bit 5 — — STD_ID0 STD_ID8 EXD_ID5
Bit 4 — — RTR STD_ID7 EXD_ID4
Bit 3 — — IDE STD_ID6 EXD_ID3
Bit 2 — — — STD_ID5 EXD_ID2
Bit 1 — —
Bit 0 — —
Module Name HCAN1*7
Data Bus Width 8/16
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — — HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 DLC0 — — —
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 — — — — STD_ID2 — — — — STD_ID1 — — — — STD_ID0 STD_ID8 EXD_ID5 — — — — RTR STD_ID7 EXD_ID4 DLC3 — — — IDE STD_ID6 EXD_ID3 DLC2 — — — — STD_ID5 EXD_ID2 DLC1 — — —
EXD_ID17 EXD_ID16 STD_ID4 EXD_ID1 STD_ID3 EXD_ID0 EXD_ID8 HCAN1*7 8/16
STD_ID10 STD_ID9 EXD_ID7 EXD_ID6
EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1147 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FAC0 H'FAC1 H'FAC2 H'FAC3 H'FAC4 H'FAC5 H'FAC6 H'FAC7 H'FAC8 H'FAC9 H'FACA H'FACB H'FACC H'FACD H'FACE H'FACF H'FAD0 H'FAD1 H'FAD2 H'FAD3 H'FAD4 H'FAD5 H'FAD6 H'FAD7 H'FAD8 H'FAD9 H'FADA H'FADB H'FADC H'FADD H'FADE H'FADF H'FAE0 H'FAE1 H'FAE2 H'FAE3 H'FAE4 H'FAE5 H'FAE6 H'FAE7 H'FAE8 H'FAE9
Register Name MD21 MD22 MD23 MD24 MD25 MD26 MD27 MD28 MD31 MD32 MD33 MD34 MD35 MD36 MD37 MD38 MD41 MD42 MD43 MD44 MD45 MD46 MD47 MD48 MD51 MD52 MD53 MD54 MD55 MD56 MD57 MD58 MD61 MD62 MD63 MD64 MD65 MD66 MD67 MD68 MD71 MD72
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN1*7
Data Bus Width 8/16
HCAN1*7
8/16
HCAN1*7
8/16
Page 1148 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FAEA H'FAEB H'FAEC H'FAED H'FAEE H'FAEF H'FAF0 H'FAF1 H'FAF2 H'FAF3 H'FAF4 H'FAF5 H'FAF6 H'FAF7 H'FAF8 H'FAF9 H'FAFA H'FAFB H'FAFC H'FAFD H'FAFE H'FAFF H'FB00 H'FB01 H'FB02 H'FB03 H'FB04 H'FB05 H'FB06 H'FB07 H'FB08 H'FB09 H'FB0A H'FB0B H'FB0C H'FB0D H'FB0E H'FB0F
Register Name MD73 MD74 MD75 MD76 MD77 MD78 MD81 MD82 MD83 MD84 MD85 MD86 MD87 MD88 MD91 MD92 MD93 MD94 MD95 MD96 MD97 MD98 MD101 MD102 MD103 MD104 MD105 MD106 MD107 MD108 MD111 MD112 MD113 MD114 MD115 MD116 MD117 MD118
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN1*7
Data Bus Width 8/16
HCAN1*7
8/16
HCAN1*7
8/16
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1149 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FB10 H'FB11 H'FB12 H'FB13 H'FB14 H'FB15 H'FB16 H'FB17 H'FB18 H'FB19 H'FB1A H'FB1B H'FB1C H'FB1D H'FB1E H'FB1F H'FB20 H'FB21 H'FB22 H'FB23 H'FB24 H'FB25 H'FB26 H'FB27 H'FB28 H'FB29 H'FB2A H'FB2B H'FB2C H'FB2D H'FB2E H'FB2F
Register Name MD121 MD122 MD123 MD124 MD125 MD126 MD127 MD128 MD131 MD132 MD133 MD134 MD135 MD136 MD137 MD138 MD141 MD142 MD143 MD144 MD145 MD146 MD147 MD148 MD151 MD152 MD153 MD154 MD155 MD156 MD157 MD158
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name HCAN1*7
Data Bus Width 8/16
HCAN1*7
8/16
Page 1150 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FC00 H'FC02 H'FC04 H'FC06
Register Name PWCR1 PWOCR1 PWPR1 PWCYR1
Bit 7 — OE1H OPS1H —
Bit 6 — OE1G OPS1G —
Bit 5 IE OE1F OPS1F —
Bit 4 CMF OE1E OPS1E —
Bit 3 CST OE1D OPS1D —
Bit 2 CKS2 OE1C OPS1C —
Bit 1 CKS1 OE1B OPS1B
Bit 0 CKS0 OE1A OPS1A
Module Name
Data Bus Width
Motor 16 control PWM timer 1
H'FC08
PWBFR1A — DT7
— DT6 — DT6 — DT6 — DT6 — OE2G OPS2G —
— DT5 — DT5 — DT5 — DT5 IE OE2F OPS2F —
OTS DT4 OTS DT4 OTS DT4 OTS DT4 CMF OE2E OPS2E —
— DT3 — DT3 — DT3 — DT3 CST OE2D OPS2D —
— DT2 — DT2 — DT2 — DT2 CKS2 OE2C OPS2C —
DT9 DT1 DT9 DT1 DT9 DT1 DT9 DT1 CKS1 OE2B OPS2B
DT8 DT0 DT8 DT0 DT8 DT0 DT8 DT0 CKS0 OE2A OPS2A Motor 16 control PWM timer 2
H'FC0A
PWBFR1C — DT7
H'FC0C
PWBFR1E — DT7
H'FC0E
PWBFR1G — DT7
H'FC10 H'FC12 H'FC14 H'FC16
PWCR2 PWOCR2 PWPR2 PWCYR2
— OE2H OPS2H —
H'FC18
PWBFR2A — DT7
— DT6 — DT6 — DT6 — DT6 PH6DDR PJ6DDR PH6DR PJ6DR PH6 PJ6
— DT5 — DT5 — DT5 — DT5 PH5DDR PJ5DDR PH5DR PJ5DR PH5 PJ5
TDS DT4 TDS DT4 TDS DT4 TDS DT4 PH4DDR PJ4DDR PH4DR PJ4DR PH4 PJ4
— DT3 — DT3 — DT3 — DT3 PH3DDR PJ3DDR PH3DR PJ3DR PH3 PJ3
— DT2 — DT2 — DT2 — DT2 PH2DDR PJ2DDR PH2DR PJ2DR PH2 PJ2
DT9 DT1 DT9 DT1 DT9 DT1 DT9 DT1 PH1DDR PJ1DDR PH1DR PJ1DR PH1 PJ1
DT8 DT0 DT8 DT0 DT8 DT0 DT8 DT0 PH0DDR PJ0DDR PH0DR PJ0DR PH0 PJ0 PORT 16
H'FC1A
PWBFR2B — DT7
H'FC1C
PWBFR2C — DT7
H'FC1E
PWBFR2D — DT7
H'FC20 H'FC21 H'FC24 H'FC25 H'FC28 H'FC29
PHDDR PJDDR PHDR PJDR PORTH PORTJ
PH7DDR PJ7DDR PH7DR PJ7DR PH7 PJ7
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1151 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FC60 H'FDB4 H'FDB5 H'FDE4 H'FDE5 H'FDE6 H'FDE7 H'FDE8 H'FDE9 H'FDEA H'FDEB H'FDEC H'FE00 H'FE01 H'FE02 H'FE03 H'FE04 H'FE05 H'FE06 H'FE07 H'FE08 H'FE09 H'FE12 H'FE13 H'FE14 H'FE15 H'FE16 H'FE17 H'FE18 H'FE19 H'FE1A H'FE1B H'FE1C H'FE1F H'FE26 H'FE27 H'FE28 H'FE29 H'FE2A H'FE2B H'FE2C H'FE2D
Register Name
Bit 7
Bit 6 — IICX1 — STS2 — — — MSTPA6 MSTPB6 MSTPC6 — LSON*3 — BAA22 BAA14 BAA6 — BAA22 BAA14 BAA6 CDA CDA — IRQ3SCA — — DTCEA6 DTCEB6 DTCEC6 DTCED6 DTCEE6 DTCEF6 DTCEG6 DTVEC6 G3CMS0 G2INV NDER14 NDER6 POD14 POD6 NDR14 NDR6
Bit 5 — IICX0 — STS1 INTM1 — — MSTPA5 MSTPB5 MSTPC5 — NESEL*3 — BAA21 BAA13 BAA5 — BAA21 BAA13 BAA5 BAMRA2 BAMRA2 — IRQ2SCB IRQ5E IRQ5F DTCEA5 DTCEB5 DTCEC5 DTCED5 DTCEE5 DTCEF5 DTCEG5 DTVEC5 G2CMS1 G1INV NDER13 NDER5 POD13 POD5 NDR13 NDR5
Bit 4 — IICE — STS0 INTM0 — — MSTPA4 MSTPB4 MSTPC4 —
Bit 3 — — CLR3 OPE NMIEG STCS — MSTPA3 MSTPB3 MSTPC3 AE3
Bit 2 — — CLR2 — — SCK2 MDS2 MSTPA2 MSTPB2 MSTPC2 AE2 — — BAA18 BAA10 BAA2 — BAA18 BAA10 BAA2 CSELA1 CSELA1 IRQ5SCA IRQ1SCA IRQ2E IRQ2F DTCEA2 DTCEB2 DTCEC2 DTCED2 DTCEE2 DTCEF2 DTCEG2 DTVEC2 G1CMS0 G2NOV NDER10 NDER2 POD10 POD2 NDR10 NDR2
Bit 1 — — CLR1 — — SCK1 MDS1 MSTPA1 MSTPB1 MSTPC1 AE1 STC1 — BAA17 BAA9 BAA1 — BAA17 BAA9 BAA1 CSELA0 CSELA0 IRQ4SCB IRQ0SCB IRQ1E IRQ1F DTCEA1 DTCEB1 DTCEC1 DTCED1 DTCEE1 DTCEF1 DTCEG1 DTVEC1 G0CMS1 G1NOV NDER9 NDER1 POD9 POD1 NDR9 NDR1
Bit 0 — — CLR0 — RAME SCK0 MDS1 MSTPA0 MSTPB0 MSTPC0 AE0 STC0 — BAA16 BAA8 BAA0 — BAA16 BAA8 BAA0 BIEA BIEA IRQ4SCA IRQ0SCA IRQ0E IRQ0F DTCEA0 DTCEB0 DTCEC0 DTCED0 DTCEE0 DTCEF0 DTCEG0 DTVEC0 G0CMS0 G0NOV NDER8 NDER0 POD8 POD0 NDR8 NDR0
Module Name SYSTEM IIC*4
Data Bus Width 8 8
MSTPCRD MSTPD7 SCRX —
DDCSWR*4 — SBYCR SYSCR SCKCR MDCR SSBY MACS PSTOP —
SYSTEM
8
MSTPCRA MSTPA7 MSTPCRB MSTPB7 MSTPCRC MSTPC7 PFCR LPWRCR BARA — DTON*3 — BAA23 BAA15 BAA7 BARB — BAA23 BAA15 BAA7 BCRA BCRB ISCRH ISCRL IER ISR DTCERA DTCERB DTCERC DTCERD DTCERE DTCERF DTCERG DTVECR PCR PMR NDERH NDERL PODRH PODRL NDRH NDRL CMFA CMFA — IRQ3SCB — — DTCEA7 DTCEB7 DTCEC7 DTCED7 DTCEE7 DTCEF7 DTCEG7 SWDTE G3CMS1 G3INV NDER15 NDER7 POD15 POD7 NDR15 NDR7
SUBSTP*3 RFCUT*3 — BAA20 BAA12 BAA4 — BAA20 BAA12 BAA4 BAMRA1 BAMRA1 — IRQ2SCA IRQ4E IRQ4F DTCEA4 DTCEB4 DTCEC4 DTCED4 DTCEE4 DTCEF4 DTCEG4 DTVEC4 G2CMS0 G0INV NDER12 NDER4 POD12 POD4 NDR12 NDR4 — BAA19 BAA11 BAA3 — BAA19 BAA11 BAA3 BAMRA0 BAMRA0 IRQ5SCB IRQ1SCB IRQ3E IRQ3F DTCEA3 DTCEB3 DTCEC3 DTCED3 DTCEE3 DTCEF3 DTCEG3 DTVEC3 G1CMS1 G3NOV NDER11 NDER3 POD11 POD3 NDR11 NDR3
PBC*7
8
INT
8
DTC*7
8
PPG*7
8
Page 1152 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FE2E H'FE2F H'FE30 H'FE32 H'FE39 H'FE3A H'FE3B H'FE3C H'FE3D H'FE3E H'FE40 H'FE41 H'FE42 H'FE43 H'FE44 H'FE46 H'FE47 H'FE48 H'FE49 H'FE80 H'FE81 H'FE82 H'FE83 H'FE84 H'FE85 H'FE86 H'FE87 H'FE88 H'FE89 H'FE8A H'FE8B H'FE8C H'FE8D H'FE8E H'FE8F H'FE90 H'FE91 H'FE92 H'FE94 H'FE95
Register Name NDRH NDRL P1DDR P3DDR PADDR PBDDR PCDDR PDDDR PEDDR PFDDR PAPCR PBPCR PCPCR PDPCR PEPCR P3ODR PAODR PBODR PCODR TCR3 TMDR3 TIOR3H TIOR3L TIER3 TSR3 TCNT3
Bit 7 — — P17DDR — — PB7DDR PC7DDR PD7DDR PE7DDR PF7DDR — PB7PCR PC7PCR PD7PCR PE7PCR — — PB7ODR PC7ODR CCLR2 — IOB3 IOD3 TTGE —
Bit 6 — — P16DDR — — PB6DDR PC6DDR PD6DDR PE6DDR PF6DDR — PB6PCR PC6PCR PD6PCR PE6PCR — — PB6ODR PC6ODR CCLR1 — IOB2 IOD2 — —
Bit 5 — — P15DDR P35DDR — PB5DDR PC5DDR PD5DDR PE5DDR PF5DDR — PB5PCR PC5PCR PD5PCR PE5PCR P35ODR — PB5ODR PC5ODR CCLR0 BFB IOB1 IOD1 — —
Bit 4 — — P14DDR P34DDR — PB4DDR PC4DDR PD4DDR PE4DDR PF4DDR — PB4PCR PC4PCR PD4PCR PE4PCR P34ODR — PB4ODR PC4ODR CKEG1 BFA IOB0 IOD0 TCIEV TCFV
Bit 3 NDR11 NDR3 P13DDR P33DDR PA3DDR PB3DDR PC3DDR PD3DDR PE3DDR PF3DDR PA3PCR PB3PCR PC3PCR PD3PCR PE3PCR P33ODR PA3ODR PB3ODR PC3ODR CKEG0 MD3 IOA3 IOC3 TGIED TGFD
Bit 2 NDR10 NDR2 P12DDR P32DDR PA2DDR PB2DDR PC2DDR PD2DDR PE2DDR — PA2PCR PB2PCR PC2PCR PD2PCR PE2PCR P32ODR PA2ODR PB2ODR PC2ODR TPSC2 MD2 IOA2 IOC2 TGIEC TGFC
Bit 1 NDR9 NDR1 P11DDR P31DDR PA1DDR PB1DDR PC1DDR PD1DDR PE1DDR — PA1PCR PB1PCR PC1PCR PD1PCR PE1PCR P31ODR PA1ODR PB1ODR PC1ODR TPSC1 MD1 IOA1 IOC1 TGIEB TGFB
Bit 0 NDR8 NDR0 P10DDR P30DDR PA0DDR PB0DDR PC0DDR PD0DDR PE0DDR PF0DDR PA0PCR PB0PCR PC0PCR PD0PCR PE0PCR P30ODR PA0ODR PB0ODR PC0ODR TPSC0 MD0 IOA0 IOC0 TGIEA TGFA
Module Name PPG*7
Data Bus Width 8
PORT
8
PORT
8
TPU3
8/16
TGR3A
TGR3B
TGR3C
TGR3D
TCR4 TMDR4 TIOR4 TIER4 TSR4
— — IOB3 TTGE TCFD
CCLR1 — IOB2 — —
CCLR0 — IOB1 TCIEU TCFU
CKEG1 — IOB0 TCIEV TCFV
CKEG0 MD3 IOA3 — —
TPSC2 MD2 IOA2 — —
TPSC1 MD1 IOA1 TGIEB TGFB
TPSC0 MD0 IOA0 TGIEA TGFA
TPU4
8/16
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1153 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address H'FE96 H'FE97 H'FE98 H'FE99 H'FE9A H'FE9B H'FEA0 H'FEA1 H'FEA2 H'FEA4 H'FEA5 H'FEA6 H'FEA7 H'FEA8 H'FEA9 H'FEAA H'FEAB H'FEB0 H'FEB1 H'FEC0 H'FEC1 H'FEC2 H'FEC3 H'FEC4 H'FEC5 H'FEC6 H'FEC7 H'FEC9 H'FECA H'FECC H'FECE H'FED0 H'FED1 H'FED2 H'FED3 H'FED4 H'FED5 H'FEDB H'FF00 H'FF02 H'FF09
Register Name TCNT4
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module Name TPU4
Data Bus Width 8/16
TGR4A
TGR4B
TCR5 TMDR5 TIOR5 TIER5 TSR5 TCNT5
— — IOB3 TTGE TCFD
CCLR1 — IOB2 — —
CCLR0 — IOB1 TCIEU TCFU
CKEG1 — IOB0 TCIEV TCFV
CKEG0 MD3 IOA3 — —
TPSC2 MD2 IOA2 — —
TPSC1 MD1 IOA1 TGIEB TGFB
TPSC0 MD0 IOA0 TGIEA TGFA
TPU5
8/16
TGR5A
TGR5B
TSTR TSYR IPRA IPRB IPRC IPRD IPRE IPRF IPRG IPRH IPRJ IPRK IPRM Reserved ABWCR ASTCR WCRH WCRL BCRH BCRL RAMER P1DR P3DR PADR
— — — — — — — — — — — — —
— — IPR6 IPR6 — IPR6 IPR6*7 IPR6 IPR6 IPR6 — IPR6 IPR6
CST5 SYNC5 IPR5 IPR5 — IPR5 IPR5*7 IPR5 IPR5 IPR5 — IPR5 IPR5
CST4 SYNC4 IPR4 IPR4 — IPR4 IPR4*7 IPR4 IPR4 IPR4 — IPR4 IPR4
CST3 SYNC3 — — — — — — — — — — —
CST2 SYNC2 IPR2 IPR2 IPR2*7 — IPR2 IPR2 IPR2 IPR2 IPR2 IPR2 IPR2
CST1 SYNC1 IPR1 IPR1 IPR1*7 — IPR1 IPR1 IPR1 IPR1 IPR1 IPR1 IPR1
CST0 SYNC0 IPR0 IPR0 IPR0*7 — IPR0 IPR0 IPR0 IPR0 IPR0 IPR0 IPR0
TPU All
8
INT
8
ABW7 AST7 W71 W31 ICIS1 — — P17DR — —
ABW6 AST6 W70 W30 ICIS0 — — P16DR — —
ABW5 AST5 W61 W21 BRSTRM — — P15DR P35DR —
ABW4 AST4 W60 W20 BRSTS1 — — P14DR P34DR —
ABW3 AST3 W51 W11 BRSTS0 — RAMS P13DR P33DR PA3DR
ABW2 AST2 W50 W10 — — RAM2 P12DR P32DR PA2DR
ABW1 AST1 W41 W01 — WDBE RAM1 P11DR P31DR PA1DR
ABW0 AST0 W40 W00 — — RAM0 P10DR P30DR PA0DR
Bus controller
8
ROM PORT
8 8
Page 1154 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FF0A H'FF0B H'FF0C H'FF0D H'FF0E H'FF10 H'FF11 H'FF12 H'FF13 H'FF14 H'FF15 H'FF16 H'FF17 H'FF18 H'FF19 H'FF1A H'FF1B H'FF1C H'FF1D H'FF1E H'FF1F H'FF20 H'FF21 H'FF22 H'FF24 H'FF25 H'FF26 H'FF27 H'FF28 H'FF29 H'FF2A H'FF2B H'FF30 H'FF31 H'FF32 H'FF34 H'FF35 H'FF36 H'FF37 H'FF38 H'FF39 H'FF3A H'FF3B
Register Name PBDR PCDR PDDR PEDR PFDR TCR0 TMDR0 TIOR0H TIOR0L TIER0 TSR0 TNCT0
Bit 7 PB7DR PC7DR PD7DR PE7DR PF7DR CCLR2 — IOB3 IOD3 TTGE —
Bit 6 PB6DR PC6DR PD6DR PE6DR PF6DR CCLR1 — IOB2 IOD2 — —
Bit 5 PB5DR PC5DR PD5DR PE5DR PF5DR CCLR0 BFB IOB1 IOD1 — —
Bit 4 PB4DR PC4DR PD4DR PE4DR PF4DR CKEG1 BFA IOB0 IOD0 TCIEV TCFV
Bit 3 PB3DR PC3DR PD3DR PE3DR PF3DR CKEG0 MD3 IOA3 IOC3 TGIED TGFD
Bit 2 PB2DR PC2DR PD2DR PE2DR — TPSC2 MD2 IOA2 IOC2 TGIEC TGFC
Bit 1 PB1DR PC1DR PD1DR PE1DR — TPSC1 MD1 IOA1 IOC1 TGIEB TGFB
Bit 0 PB0DR PC0DR PD0DR PE0DR PF0DR TPSC0 MD0 IOA0 IOC0 TGIEA TGFA
Module Name PORT
Data Bus Width 8
TPU0
8/16
TGR0A
TGR0B
TGR0C
TGR0D
TCR1 TMDR1 TIOR1 TIER1 TSR1 TNCT1
— — IOB3 TTGE TCFD
CCLR1 — IOB2 — —
CCLR0 — IOB1 TCIEU TCFU
CKEG1 — IOB0 TCIEV TCFV
CKEG0 MD3 IOA3 — —
TPSC2 MD2 IOA2 — —
TPSC1 MD1 IOA1 TGIEB TGFB
TPSC0 MD0 IOA0 TGIEA TGFA
TPU1
8/16
TGR1A
TGR1B
TCR2 TMDR2 TIOR2 TIER2 TSR2 TNCT2
— — IOB3 TTGE TCFD
CCLR1 — IOB2 — —
CCLR0 — IOB1 TCIEU TCFU
CKEG1 — IOB0 TCIEV TCFV
CKEG0 MD3 IOA3 — —
TPSC2 MD2 IOA2 — —
TPSC1 MD1 IOA1 TGIEB TGFB
TPSC0 MD0 IOA0 TGIEA TGFA
TPU2
8/16
TGR2A
TGR2B
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1155 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Address
Register Name
Bit 7 OVF
Bit 6 WT/IT
Bit 5 TME
Bit 4 —
Bit 3 —
Bit 2 CKS2
Bit 1 CKS1
Bit 0 CKS0
Module Name WDT0
Data Bus Width 8
H'FF74 TCSR0 (read/write) H'FF75 (read) H'FF76 H'FF77 (read) H'FF78 TCNT0 —
—
— RSTE CHR BLK IEIC
— — PE PE MST
— — O/E O/E TRS
— — STOP BCP1 ACKE
— — MP BCP0 BBSY
— — CKS1 CKS1 IRIC
— — CKS0 CKS0 SCP SCI0, 8 IIC0*4, Smart card interface 0
RSTCSR0 WOVF SMR0 SMR0 ICCR0*
4
C/A GM ICE
H'FF79
BRR0 ICSR0*4 ESTP TIE STOP RIE IRTR TE AASX RE AL MPIE AAS TEIE ADZ CKE1 ACKB CKE0
H'FF7A H'FF7B H'FF7C
SCR0 TDR0 SSR0 SSR0
TDRE TDRE
RDRF RDRF
ORER ORER
FER ERS
PER PER
TEND TEND
MPB MPB
MPBT MPBT
H'FF7D H'FF7E
RDR0 SCMR0 ICDR0/ SARX0*4 — ICDR7/ SVAX6 MLS/ SVA6 C/A GM ICE — ICDR6/ SVAX5 WAIT/ SVA5 CHR BLK IEIC — ICDR5/ SVAX4 CKS2/ SVA4 PE PE MST — ICDR4/ SVAX3 CKS1/ SVA3 O/E O/E TRS SDIR ICDR3/ SVAX2 CKS0/ SVA2 STOP BCP1 ACKE SINV ICDR2/ SVAX1 BC2/ SVA1 MP BCP0 BBSY — ICDR1/ SVAX0 BC1/ SVA0 CKS1 CKS1 IRIC SMIF ICDR0/FSX BC0/FS CKS0 CKS0 SCP IIC0*4 8 SCI1, IIC1*4, Smart card interface 1
H'FF7F H'FF80
ICMR0/ SAR0 SMR1 SMR1 ICCR1*4
H'FF81
BRR1 ICSR1*4 ESTP TIE STOP RIE IRTR TE AASX RE AL MPIE AAS TEIE ADZ CKE1 ACKB CKE0
H'FF82 H'FF83 H'FF84
SCR1 TDR1 SSR1 SSR1
TDRE TDRE
RDRF RDRF
ORER ORER
FER ERS
PER PER
TEND TEND
MPB MPB
MPBT MPBT
H'FF85 H'FF86
RDR1 SCMR1 ICDR1/ SARX1*4 — ICDR7/ SVARX6 MLS/ SVA6 C/A GM — ICDR6/ SVARX5 WAIT/ SVA5 CHR BLK — ICDR5/ SVARX4 CKS2/ SVA4 PE PE — ICDR4/ SVARX3 CKS1/ SVA3 O/E O/E SDIR ICDR3/ SVARX2 CKS0/ SVA2 STOP BCP1 SINV ICDR2/ SVARX1 BC2/ SVA1 MP BCP0 — ICDR1/ SVARX0 BC1/ SVA0 CKS1 CKS1 SMIF ICDR0/FSX BC0/FS CKS0 CKS0 IIC1*
4
H'FF87 H'FF88
ICMR1/ SAR1*4 SMR2 SMR2
SCI2, 8 Smart card interface 2
H'FF89 H'FF8A H'FF8B H'FF8C
BRR2 SCR2 TDR2 SSR2 SSR2 TDRE TDRE RDRF RDRF ORER ORER FER ERS PER PER TEND TEND MPB MPB MPBT MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0
H'FF8D H'FF8E
RDR2 SCMR2 — — — — SDIR SINV — SMIF
Page 1156 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
Address H'FF90 H'FF91 H'FF92 H'FF93 H'FF94 H'FF95 H'FF96 H'FF97 H'FF98 H'FF99
Register Name ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR
Bit 7 AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGS1 OVF
Bit 6 AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE TRGS0 WT/IT
Bit 5 AD7 — AD7 — AD7 — AD7 — ADST — TME
Bit 4 AD6 — AD6 — AD6 — AD6 — SCAN — PSS*1
Bit 3 AD5 — AD5 — AD5 — AD5 — CH3 CKS1 RST/NMI
Bit 2 AD4 — AD4 — AD4 — AD4 — CH2 CKS0 CKS2
Bit 1 AD3 — AD3 — AD3 — AD3 — CH1 — CKS1
Bit 0 AD2 — AD2 — AD2 — AD2 — CH0 — CKS0
Module Name A/D
Data Bus Width 8
H'FFA2 TCSR1 (read/write) H'FFA3 (read) H'FFA4 H'FFA5 H'FFA6 H'FFA8 H'FFA9 H'FFAA H'FFAB H'FFAC H'FFB0 H'FFB2 H'FFB3 H'FFB8 H'FFB9 H'FFBA H'FFBB H'FFBC H'FFBD H'FFBE TCNT1 DADR0 DADR1 DACR01 FLMCR1 FLMCR2 EBR1 EBR2 FLPWCR PORT1 PORT3 PORT4 PORT9 PORTA PORTB PORTC PORTD PORTE PORTF
WDT1
16
D/A0, 1
8
DAOE1 FWE FLER EB7 —
DAOE0 SWE — EB6 —
DAE ESU — EB5 EB13*8 — P15 P35 P45 — — PB5 PC5 PD5 PE5 PF5
— PSU — EB4 EB12*8 — P14 P34 P44 — — PB4 PC4 PD4 PE4 PF4
— EV — EB3 EB11*6 — P13 P33 P43 P93 PA3 PB3 PC3 PD3 PE3 PF3
— PV — EB2 EB10*5 — P12 P32 P42 P92 PA2 PB2 PC2 PD2 PE2 —
— E — EB1 EB9 — P11 P31 P41 P91 PA1 PB1 PC1 PD1 PE1 —
— P — EB0 EB8 — P10 P30 P40 P90 PA0 PB0 PC0 PD0 PE0 PF0 PORT 8 FLASH 8
PDWND*2 — P17 — P47 — — PB7 PC7 PD7 PE7 PF7 P16 — P46 — — PB6 PC6 PD6 PE6 PF6
Notes: 1. Bit 4 (PSS) in TCSR of WDT1 is valid in the U-mask and W-mask versions, and H8S/2635 Group. In versions other than the U-mask and W-mask versions, and H8S/2635 Group, however, the PSS bit must always be written with 0 since no subclock functions are available. 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are not available in versions other than the U-mask and W-mask versions, and H8S/2635 Group. Subclock functions may be used with the U-mask and W-mask versions, and H8S/2635 Group. 3. Bits DTON, LSON, NESEL, and SUBSTP in LPWRCR are valid in the U-mask and W-mask versions, and H8S/2635 Group. In versions other than the U-mask and W-mask versions, and H8S/2635 Group, however, these bits must always be written with 0 since no subclock functions are available. 4. An I2C bus interface can only be added to the H8S/2638, H8S/2639, and H8S/2630. Therefore, IIC related registers are valid only in the H8S/2638, H8S/2639, and H8S/2630. 5. This bit is reserved in the H8S/2636. 6. This bit is reserved in the H8S/2636 and H8S/2635. 7. These bits are not available in the H8S/2635 Group. 8. These bits are reserved in the H8S/2636, H8S/2638, H8S/2639, and H8S/2635. These bits are valid in the H8S/2630 only.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
B.2
Functions
Register name Address to which the register is mapped Name of on-chip supporting module
D/A Converter
Register acronym
Bit numbers Initial bit values
DACR⎯D/A Control Register
H'FFFA
Bit Initial value Read/Write
7 DAOE1 0 R/W
6 DAOE0 0 R/W
5 DAE 0 R/W
4 ⎯ 1 ⎯
3 ⎯ 1 ⎯
2 ⎯ 1 ⎯
1 ⎯ 1 ⎯
0 ⎯ 1 ⎯
Names of the bits. Dashes (⎯) indicate reserved bits.
D/A Enabled
DAOE1 DAOE0 DAE * 0 1 1 0 0 1 1 * Conversion result Channel 0 and 1 D/A conversion disabled Channel 0 D/A conversion enabled Channel 1 D/A conversion disabled Channel 0 and 1 D/A conversion enabled Channel 0 D/A conversion disabled Channel 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled Channel 0 and 1 D/A conversion enabled
Possible types of access R W Read only Write only
0
0 1
Full name of bit
R/W Read and write
Descriptions of bit settings
D/A Output Enable 0 0 1 Analog output DA0 disabled Channel 0 D/A conversion enabled. Analog output DA0 enabled
D/A Output Enable 1 0 1 Analog output DA1 disabled Channel 1 D/A conversion enabled. Analog output DA1 enabled
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MRA—DTC Mode Register A
Bit Initial value Read/Write 7 SM1 ⎯ 6 SM0 ⎯ 5 DM1 ⎯ 4 DM0 ⎯
H'EBC0 to H'EFBF
3 MD1 ⎯ 2 MD0 ⎯ 1 DTS ⎯ 0 Sz ⎯
DTC*
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
DTC Data Transfer Size 0 Byte-size transfer 1 Word-size transfer DTC Transfer Mode Select 0 Destination side is repeat area or block area 1 Source side is repeat area or block area DTC Mode 0 1 0 Normal mode 1 Repeat mode 0 Block transfer mode 1⎯ Destination Address Mode 0 ⎯ DAR is fixed 1 0 DAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 DAR is decremented after a transfer (by −1 when Sz = 0; by −2 when Sz = 1) Source Address Mode 0 ⎯ SAR is fixed 1 0 SAR is incremented after a transfer (by +1 when Sz = 0; by +2 when Sz = 1) 1 SAR is decremented after a transfer (by −1 when Sz = 0; by −2 when Sz = 1)
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MRB—DTC Mode Register B
Bit Initial value Read/Write 7 CHNE ⎯ 6 DISEL ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'EBC0 to H'EFBF
3 ⎯ ⎯ 2 ⎯ ⎯ 1 ⎯ ⎯ 0 ⎯ ⎯
DTC*
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
DTC Interrupt Select 0 After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is 0 1 After a data transfer ends, the CPU interrupt is enabled DTC Chain Transfer Enable 0 End of DTC data transfer 1 DTC chain transfer
Note: * This register is not available in the H8S/2635 Group.
SAR—DTC Source Address Register
Bit Initial value Read/Write 23 22 21 20 19
H'EBC0 to H'EFBF
--------4 3 2 1 0
DTC*
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Specify DTC transfer data source address
Note: * This register is not available in the H8S/2635 Group.
DAR—DTC Destination Address Register
Bit Initial value Read/Write 23 22 21 20 19
H'EBC0 to H'EFBF
--------4 3 2 1 0
DTC*
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
Unde- Unde- Unde- Unde- Undefined fined fined fined fined
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Specify DTC transfer data destination address
Note: * This register is not available in the H8S/2635 Group.
Page 1160 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
CRA—DTC Transfer Count Register A
Bit Initial value Read/Write 15 14 13 12 11 10 9 8
H'EBC0 to H'EFBF
7 6 5 4 3 2 1
DTC*
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
CRAH
CRAL
Specify the number of DTC data transfers
Note: * This register is not available in the H8S/2635 Group.
CRB—DTC Transfer Count Register B
Bit Initial value Read/Write 15 14 13 12 11 10 9 8
H'EBC0 to H'EFBF
7 6 5 4 3 2 1
DTC*
0
Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Unde- Undefined fined fined fined fined fined fined fined fined fined fined fined fined fined fined fined
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Specify the number of DTC block data transfers
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MCR0—Master Control Register MCR1—Master Control Register
Bit Initial value Read/Write 7 MCR7 0 R/W 6 ⎯ 0 R 5 MCR5 0 R/W 4 ⎯ 0 R
H'F800 H'FA00
3 ⎯ 0 R 2 MCR2 0 R/W 1 MCR1 0 R/W
HCAN0 HCAN1*
0 MCR0 1 R/W
Reset Request 0 Normal operating mode (MCR0 = 0 and GSR3 = 0) [Setting condition] • When 0 is written after an HCAN reset 1 HCAN reset mode transition request Halt Request 0 HCAN normal operating mode 1 HCAN halt mode transition request Message Transmission Method 0 Transmission order determined by message identifier priority 1 Transmission order determined by mailbox (buffer) number priority (TXPR1 > TXPR15) HCAN Sleep Mode 0 HCAN sleep mode released 1 Transition to HCAN sleep mode enabled HCAN Sleep Mode Release 0 HCAN sleep mode release by CAN bus operation disabled 1 HCAN sleep mode release by CAN bus operation enabled
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
GSR0—General Status Register GSR1—General Status Register
Bit Initial value Read/Write 7 ⎯ 0 R 6 ⎯ 0 R 5 ⎯ 0 R 4 ⎯ 0 R
H'F801 H'FA01
3 GSR3 1 R 2 GSR2 1 R 1 GSR1 0 R
HCAN0 HCAN1*
0 GSR0 0 R
Bus Off Flag 0 [Reset condition] • Recovery from bus off state 1 When TEC ≥ 256 (bus off state) Transmit/Receive Warning Flag 0 [Reset condition] • When TEC < 96 and REC < 96 or TEC ≥ 256 1 When TEC ≥ 96 or REC ≥ 96 Message Transmission Status Flag 0 Message transmission period 1 [Reset condition] • Idle state Reset Status Bit 0 Normal operating state [Setting condition] • After an HCAN internal reset 1 Configuration mode [Reset condition] • MCR0 reset mode and sleep mode
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
BCR0—Bit Configuration Register BCR1—Bit Configuration Register
Bit Initial value Read/Write 15 BCR7 0 R/W 14 BCR6 0 R/W 13 BCR5 0 R/W 12 BCR4 0 R/W
H'F802 H'FA02
11 BCR3 0 R/W 10 BCR2 0 R/W 9 BCR1 0 R/W
HCAN0 HCAN1*
8 BCR0 0 R/W
Resynchronization Jump Width 0 1 0 Bit synchronization width = 1 time quantum 1 Bit synchronization width = 2 time quanta 0 Bit synchronization width = 3 time quanta 1 Bit synchronization width = 4 time quanta
Baud Rate Prescaler 0 0 0 . . 1 0 0 0 . . 1 0 0 0 . . 1 0 0 0 . . 1 0 0 1 . . 1 0 2 × system clock 1 4 × system clock 0 6 × system clock . . . . 1 128 × system clock
Bit Initial value Read/Write
7 BCR15 0 R/W
6 BCR14 0 R/W
5 BCR13 0 R/W
4 BCR12 0 R/W
3 BCR11 0 R/W
2 BCR10 0 R/W
1 BCR9 0 R/W
0 BCR8 0 R/W
Time Segment 2 0 0 1 1 0 1 0 Setting prohibited 1 TSEG2 = 2 time quanta 0 TSEG2 = 3 time quanta 1 TSEG2 = 4 time quanta 0 TSEG2 = 5 time quanta 1 TSEG2 = 6 time quanta 0 TSEG2 = 7 time quanta 1 TSEG2 = 8 time quanta Bit Sample Point
Time Segment 1 0 0 0 0 0 . . 1 0 0 0 0 1 . . 1 0 0 1 1 0 . . 1 0 Setting prohibited 1 Setting prohibited 0 Setting prohibited 1 TSEG1 = 4 time quanta 0 TSEG1 = 5 time quanta . . . . 1 TSEG1 = 16 time quanta
0 Bit sampling at one point (end of time segment 1 (TSEG1)) 1 Bit sampling at three points (end of time segment 1 (TSEG1) and preceding and following time quanta)
Note: * This register is not available in the H8S/2635 Group.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MBCR0—Mailbox Configuration Register MBCR1—Mailbox Configuration Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 MBCR7 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 0 R/W 4 0 R/W
H'F804 H'FA04
11 0 R/W 3 0 R/W 10 0 R/W 2 0 R/W 9 MBCR1 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 ⎯ 1 R 0 0 R/W
MBCR6 MBCR5 MBCR4 MBCR3 MBCR2
MBCR15 MBCR14 MBCR13 MBCR12 MBCR11 MBCR10 MBCR9 MBCR8
Mailbox Setting Register 0 1 Corresponding mailbox is set for transmission Corresponding mailbox is set for reception
Note: * This register is not available in the H8S/2635 Group.
TXPR0—Transmit Wait Register TXPR1—Transmit Wait Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 TXPR7 0 R/W 7 0 R/W 14 TXPR6 0 R/W 6 0 R/W 13 TXPR5 0 R/W 5 0 R/W 12 TXPR4 0 R/W 4 0 R/W
H'F806 H'FA06
11 TXPR3 0 R/W 3 0 R/W 10 TXPR2 0 R/W 2 0 R/W 9 TXPR1 0 R/W 1 TXPR9 0 R/W
HCAN0 HCAN1*
8 ⎯ 0 R 0 TXPR8 0 R/W
TXPR15 TXPR14 TXPR13 TXPR12 TXPR11 TXPR10
Transmit Wait Register 0 Transmit message idle state in corresponding mailbox [Clearing condition] • Message transmission completion and cancellation completion Transmit message transmit wait in corresponding mailbox (CAN bus arbitration)
1
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TXCR0—Transmit Wait Cancel Register TXCR1—Transmit Wait Cancel Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 TXCR7 0 R/W 7 0 R/W 14 TXCR6 0 R/W 6 0 R/W 13 TXCR5 0 R/W 5 0 R/W 12 TXCR4 0 R/W 4 0 R/W
H'F808 H'FA08
11 TXCR3 0 R/W 3 0 R/W 10 TXCR2 0 R/W 2 0 R/W 9 TXCR1 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 ⎯ 0 R 0 TXCR8 0 R/W
TXCR15 TXCR14 TXCR13 TXCR12 TXCR11 TXCR10 TXCR9
Transmit Wait Cancel Register 0 Transmit message cancellation idle state in corresponding mailbox [Clearing condition] • Completion of TXPR clearing (when transmit message is canceled normally) TXPR cleared for corresponding mailbox (transmit message cancellation)
1
Note: * This register is not available in the H8S/2635 Group.
TXACK0—Transmit Acknowledge Register TXACK1—Transmit Acknowledge Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 0 R/W 4 0 R/W
H'F80A H'FA04
11 0 R/W 3 0 R/W 10 0 R/W 2 0 R/W 9 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 ⎯ 0 R 0 0 R/W
TXACK7 TXACK6 TXACK5 TXACK4 TXACK3 TXACK2 TXACK1
TXACK15 TXACK14 TXACK13 TXACK12 TXACK11 TXACK10 TXACK9 TXACK8
Transmit Acknowledge Register 0 1 [Clearing condition] • Writing 1 Completion of message transmission for corresponding mailbox
Note: * This register is not available in the H8S/2635 Group.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
ABACK0—Abort Acknowledge Register ABACK1—Abort Acknowledge Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 ABACK7 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 0 R/W 4 0 R/W
H'F80C H'FA0C
11 0 R/W 3 0 R/W 10 0 R/W 2 0 R/W 9 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 ⎯ 0 R 0 0 R/W
ABACK6 ABACK5 ABACK4 ABACK3 ABACK2 ABACK1
ABACK15 ABACK14 ABACK13 ABACK12 ABACK11 ABACK10 ABACK9 ABACK8
Abort Acknowledge Register 0 1 [Clearing condition] • Writing 1 Completion of transmit message cancellation for corresponding mailbox
Note: * This register is not available in the H8S/2635 Group.
RXPR0—Receive Complete Register RXPR1—Receive Complete Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 RXPR7 0 R/W 7 0 R/W 14 RXPR6 0 R/W 6 0 R/W 13 RXPR5 0 R/W 5 0 R/W 12 RXPR4 0 R/W 4 0 R/W
H'F80E H'FA0E
11 RXPR3 0 R/W 3 0 R/W 10 RXPR2 0 R/W 2 0 R/W 9 RXPR1 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 RXPR0 0 R/W 0 RXPR8 0 R/W
RXPR15 RXPR14 RXPR13 RXPR12 RXPR11 RXPR10 RXPR9
Receive Complete Register 0 1 [Clearing condition] • Writing 1 Completion of message (data frame or remote frame) reception in corresponding mailbox
Note: * This register is not available in the H8S/2635 Group.
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 1167 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
RFPR0—Remote Request Register RFPR1—Remote Request Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 RFPR7 0 R/W 7 0 R/W 14 RFPR6 0 R/W 6 0 R/W 13 RFPR5 0 R/W 5 0 R/W 12 RFPR4 0 R/W 4 0 R/W
H'F810 H'FA10
11 RFPR3 0 R/W 3 0 R/W 10 RFPR2 0 R/W 2 0 R/W 9 RFPR1 0 R/W 1 0 R/W
HCAN0 HCAN1*
8 RFPR0 0 R/W 0 RFPR8 0 R/W
RFPR15 RFPR14 RFPR13 RFPR12 RFPR11 RFPR10 RFPR9
Remote Request Register 0 1 [Clearing condition] • Writing 1 Completion of remote frame reception in corresponding mailbox
Note: * This register is not available in the H8S/2635 Group.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
IRR0—Interrupt Register IRR1—Interrupt Register
H'F812 H'FA12
HCAN0 HCAN1*
Note: * This register is not available in the H8S/2635 Group.
Bit Initial value Read/Write 15 IRR7 0 R/W 14 IRR6 0 R/W 13 IRR5 0 R/W 12 IRR4 0 R/W 11 IRR3 0 R/W 10 IRR2 0 R 9 IRR1 0 R 8 IRR0 1 R/W
Reset Interrupt Flag 0 1 [Clearing condition] • Writing 1 Hardware reset (HCAN module stop*, software standby) [Setting condition] • When reset processing is completed after a hardware reset (HCAN module stop*, software standby)
Note: * After reset or hardware standby release, the module stop bit is initialized to 1, and so the HCAN enters the module stop state. Receive Message Interrupt Flag 0 [Clearing condition] • Clearing of all bits in RXPR (receive complete register) of mailbox for which receive interrupt requests are enabled by MBIMR Data frame or remote frame received and stored in mailbox [Setting condition] • When data frame or remote frame reception is completed, when corresponding MBIMR = 0
1
Remote Frame Request Interrupt Flag 0 [Clearing condition] • Clearing of all bits in RFPR (remote request register) of mailbox for which receive interrupt requests are enabled by MBIMR Remote frame received and stored in mailbox [Setting condition] • When remote frame reception is completed, when corresponding MBIMR = 0
1
Transmit Overload Warning Interrupt Flag 0 [Clearing condition] • Writing 1 1 Error warning state caused by transmit error [Setting condition] • When TEC ≥ 96
Receive Overload Warning Interrupt Flag 0 [Clearing condition] • Writing 1 1 Error warning state caused by receive error [Setting condition] • When REC ≥ 96
Error Passive Interrupt Flag 0 [Clearing condition] • Writing 1 1 Error passive state caused by transmit/receive error [Setting condition] • When TEC ≥ 128 or REC ≥ 128
Bus Off Interrupt Flag 0 1 [Clearing condition] • Writing 1 Bus off state caused by transmit error [Setting condition] • When TEC ≥ 256
Overload Frame Interrupt Flag 0 [Clearing condition] • Writing 1 1 Overload frame transmission [Setting condition] • Overload frame is transmitted
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Bit Initial value Read/Write
7 ⎯ 0 ⎯
6 ⎯ 0 ⎯
5 ⎯ 0 ⎯
4 IRR12 0 R/W
3 ⎯ 0 ⎯
2 ⎯ 0 ⎯
1 IRR9 0 R
0 IRR8 0 R/W
Mailbox Empty Interrupt Flag 0 [Clearing condition] • Writing 1 1 Transmit message has been transmitted or aborted, and new message can be stored [Setting condition] • When TXPR (transmit wait register) is cleared by completion of transmission or completion of transmission abort Unread Interrupt Flag 0 [Clearing condition] • Clearing of all bits in UMSR (unread message status register) 1 Unread message overwrite [Setting condition] • When UMSR (unread message status register) is set Bus Operation Interrupt Flag 0 CAN bus idle state [Clearing condition] • Writing 1 1 CAN bus operation in HCAN sleep mode [Setting condition] • Bus operation (dominant bit detection) in HCAN sleep mode
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MBIMR0—Mailbox Interrupt Mask Register MBIMR1—Mailbox Interrupt Mask Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 1 R/W 7 1 R/W 14 1 R/W 6 1 R/W 13 1 R/W 5 1 R/W 12 1 R/W 4 1 R/W
H'F814 H'FA14
11 1 R/W 3 1 R/W 10 1 R/W 2 1 R/W 9 1 R/W 1 1 R/W
HCAN0 HCAN1*
8 1 R/W 0 1 R/W
MBIMR7 MBIMR6 MBIMR5 MBIMR4 MBIMR3 MBIMR2 MBIMR1 MBIMR0
MBIMR15 MBIMR14 MBIMR13 MBIMR12 MBIMR11 MBIMR10 MBIMR9 MBIMR8
Mailbox Interrupt Mask 0 [Transmitting] • Interrupt request to CPU due to TXPR clearing [Receiving] • Interrupt request to CPU due to RXPR setting Interrupt requests to CPU disabled
1
Note: * This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
IMR0—Interrupt Mask Register IMR1—Interrupt Mask Register
H'F816 H'FA16
HCAN0 HCAN1*
Note: * This register is not available in the H8S/2635 Group.
Bit Initial value Read/Write 15 IMR7 1 R/W 14 IMR6 1 R/W 13 IMR5 1 R/W 12 IMR4 1 R/W 11 IMR3 1 R/W 10 IMR2 1 R/W 9 IMR1 1 R/W 8 ⎯ 0 R
Receive Message Interrupt Mask 0 1 Message reception interrupt request (RM1) to CPU by IRR1 enabled Message reception interrupt request (RM1) to CPU by IRR1 disabled
Remote Frame Request Interrupt Mask 0 1 Remote frame reception interrupt request (OVR0) to CPU by IRR2 enabled Remote frame reception interrupt request (OVR0) to CPU by IRR2 disabled
Transmit Overload Warning Interrupt Mask 0 1 TEC error warning interrupt request (OVR0) to CPU by IRR3 enabled TEC error warning interrupt request (OVR0) to CPU by IRR3 disabled
Receive Overload Warning Interrupt Mask 0 1 REC error warning interrupt request (OVR0) to CPU by IRR4 enabled REC error warning interrupt request (OVR0) to CPU by IRR4 disabled
Error Passive Interrupt Mask 0 1 Error passive interrupt request to CPU by IRR5 enabled Error passive interrupt request to CPU by IRR5 disabled
Bus Off Interrupt Mask 0 1 Bus off interrupt request to CPU by IRR6 enabled Bus off interrupt request to CPU by IRR6 disabled
Overload Frame/Bus Off Recovery Interrupt Mask 0 1 Overload frame/bus off recovery interrupt request to CPU by IRR7 enabled Overload frame/bus off recovery interrupt request to CPU by IRR7 disabled
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Appendix B Internal I/O Register
Bit Initial value Read/Write
7 ⎯ 1 R
6 ⎯ 1 R
5 ⎯ 1 R
4 IMR12 1 R/W
3 ⎯ 1 R
2 ⎯ 1 R
1 IMR9 1 R/W
0 IMR8 1 R/W
Mailbox Empty Interrupt Mask 0 1 Mailbox empty interrupt request (SLE0) to CPU by IRR8 enabled Mailbox empty interrupt request (SLE0) to CPU by IRR8 disabled
Unread Interrupt Mask 0 1 Unread message overwrite interrupt request (OVR0) to CPU by IRR9 enabled Unread message overwrite interrupt request (OVR0) to CPU by IRR9 disabled
Bus Operation Interrupt Mask 0 1 Bus operation interrupt request (OVR0) to CPU by IRR12 enabled Bus operation interrupt request (OVR0) to CPU by IRR12 disabled
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
REC0—Receive Error Counter REC1—Receive Error Counter
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R
H'F818 H'FA18
3 0 R 2 0 R 1 0 R
HCAN0 HCAN1*
0 0 R
Note: * This register is not available in the H8S/2635 Group.
TEC0—Transmit Error Counter TEC1—Transmit Error Counter
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R 4 0 R
H'F819 H'FA19
3 0 R 2 0 R 1 0 R
HCAN0 HCAN1*
0 0 R
Note: * This register is not available in the H8S/2635 Group.
UMSR0—Unread Message Status Register UMSR1—Unread Message Status Register
Bit Initial value Read/Write Bit Initial value Read/Write 15 UMSR7 0 R/(W)*2 7 0 14 0 13 0 12 0
H'F81A H'FA1A
11 0 10 0 9 0
HCAN0 HCAN1*1
8 0
UMSR6 UMSR5 UMSR4 UMSR3 UMSR2
UMSR1 UMSR0
R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 6 5 4 3 2 1 0
UMSR15 UMSR14 UMSR13 UMSR12 UMSR11 UMSR10 UMSR9 UMSR8 0 0 0 0 0 0 0 *2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W)*2 R/(W) Unread Message Status Flags 0 1 [Clearing condition] • Writing 1 Unread receive message is overwritten by a new message [Setting condition] • When a new message is received before RXPR is cleared
Notes: 1. This register is not available in the H8S/2635 Group. 2. Only 1 can be written, to clear the flag to 0.
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Appendix B Internal I/O Register
LAFML0—Local Acceptance Filter Masks L LAFMH0—Local Acceptance Filter Masks H LAFML1—Local Acceptance Filter Masks L LAFMH1—Local Acceptance Filter Masks H
Bit Initial value Read/Write Bit Initial value Read/Write LAFMH Bit Initial value Read/Write Bit Initial value Read/Write 15 LAFMH7 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 ⎯ 0 R 4 0 R/W 15 LAFML7 0 R/W 7 0 R/W 14 0 R/W 6 0 R/W 13 0 R/W 5 0 R/W 12 0 R/W 4 0 R/W
H'F81C H'F81E H'FA1C H'FA1E
11 0 R/W 3 0 R/W 10 LAFML2 0 R/W 2 0 R/W 9 0 R/W 1 0 R/W
HCAN0 HCAN0 HCAN1 * HCAN1*
8 0 R/W 0 0 R/W
LAFML6 LAFML5
LAFML4 LAFML3
LAFML1 LAFML0
LAFML15 LAFML14 LAFML13 LAFML12 LAFML11 LAFML10 LAFML9 LAFML8
11 ⎯ 0 R 3 0 R/W
10 ⎯ 0 R 2 0 R/W
9 0 R/W 1 0 R/W
8 0 R/W 0 0 R/W
LAFMH6 LAFMH5
LAFMH1 LAFMH0
LAFMH15 LAFMH14 LAFMH13 LAFMH12 LAFMH11 LAFMH10 LAFMH9 LAFMH8
LAFMH Bits 7 to 0 and 15 to 13—11-Bit Identifier Filter 0 1 Stored in MC0 and MD0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Care) Stored in MC0 and MD0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (Don't Care)
LAFMH Bits 9 and 8, LAFML bits 15 to 0—18-Bit Identifier Filter 0 1 Stored in MC0 (receive-only mailbox) depending on bit match between MC0 message identifier and receive message identifier (Care) Stored in MC0 (receive-only mailbox) regardless of bit match between MC0 message identifier and receive message identifier (Don't Care)
Note: * These registers are not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC0[1]—Message Control 0[1] MC0[2]—Message Control 0[2] MC0[3]—Message Control 0[3] MC0[4]—Message Control 0[4] MC0[5]—Message Control 0[5] MC0[6]—Message Control 0[6] MC0[7]—Message Control 0[7] MC0[8]—Message Control 0[8]
MC0[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F820 H'F821 H'F822 H'F823 H'F824 H'F825 H'F826 H'F827
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC0[2] Bit Initial value Read/Write MC0[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC0[4] Bit Initial value Read/Write MC0[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC0[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC0[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC0[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC1[1]—Message Control 1[1] MC1[2]—Message Control 1[2] MC1[3]—Message Control 1[3] MC1[4]—Message Control 1[4] MC1[5]—Message Control 1[5] MC1[6]—Message Control 1[6] MC1[7]—Message Control 1[7] MC1[8]—Message Control 1[8]
MC1[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F828 H'F829 H'F82A H'F82B H'F82C H'F82D H'F82E H'F82F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC1[2] Bit Initial value Read/Write MC1[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC1[4] Bit Initial value Read/Write MC1[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC1[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC1[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC1[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC2[1]—Message Control 2[1] MC2[2]—Message Control 2[2] MC2[3]—Message Control 2[3] MC2[4]—Message Control 2[4] MC2[5]—Message Control 2[5] MC2[6]—Message Control 2[6] MC2[7]—Message Control 2[7] MC2[8]—Message Control 2[8]
MC2[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F830 H'F831 H'F832 H'F833 H'F834 H'F835 H'F836 H'F837
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC2[2] Bit Initial value Read/Write MC2[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC2[4] Bit Initial value Read/Write MC2[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC2[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC2[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC2[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC3[1]—Message Control 3[1] MC3[2]—Message Control 3[2] MC3[3]—Message Control 3[3] MC3[4]—Message Control 3[4] MC3[5]—Message Control 3[5] MC3[6]—Message Control 3[6] MC3[7]—Message Control 3[7] MC3[8]—Message Control 3[8]
MC3[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F838 H'F839 H'F83A H'F83B H'F83C H'F83D H'F83E H'F83F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC3[2] Bit Initial value Read/Write MC3[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC3[4] Bit Initial value Read/Write MC3[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC3[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC3[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC3[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC4[1]—Message Control 4[1] MC4[2]—Message Control 4[2] MC4[3]—Message Control 4[3] MC4[4]—Message Control 4[4] MC4[5]—Message Control 4[5] MC4[6]—Message Control 4[6] MC4[7]—Message Control 4[7] MC4[8]—Message Control 4[8]
MC4[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F840 H'F841 H'F842 H'F843 H'F844 H'F845 H'F846 H'F847
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC4[2] Bit Initial value Read/Write MC4[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC4[4] Bit Initial value Read/Write MC4[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC4[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC4[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC4[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC5[1]—Message Control 5[1] MC5[2]—Message Control 5[2] MC5[3]—Message Control 5[3] MC5[4]—Message Control 5[4] MC5[5]—Message Control 5[5] MC5[6]—Message Control 5[6] MC5[7]—Message Control 5[7] MC5[8]—Message Control 5[8]
MC5[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F848 H'F849 H'F84A H'F84B H'F84C H'F84D H'F84E H'F84F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC5[2] Bit Initial value Read/Write MC5[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC5[4] Bit Initial value Read/Write MC5[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC5[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC5[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC5[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC6[1]—Message Control 6[1] MC6[2]—Message Control 6[2] MC6[3]—Message Control 6[3] MC6[4]—Message Control 6[4] MC6[5]—Message Control 6[5] MC6[6]—Message Control 6[6] MC6[7]—Message Control 6[7] MC6[8]—Message Control 6[8]
MC6[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F850 H'F851 H'F852 H'F853 H'F854 H'F855 H'F856 H'F857
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC6[2] Bit Initial value Read/Write MC6[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC6[4] Bit Initial value Read/Write MC6[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC6[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC6[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC6[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC7[1]—Message Control 7[1] MC7[2]—Message Control 7[2] MC7[3]—Message Control 7[3] MC7[4]—Message Control 7[4] MC7[5]—Message Control 7[5] MC7[6]—Message Control 7[6] MC7[7]—Message Control 7[7] MC7[8]—Message Control 7[8]
MC7[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F858 H'F859 H'F85A H'F85B H'F85C H'F85D H'F85E H'F85F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC7[2] Bit Initial value Read/Write MC7[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC7[4] Bit Initial value Read/Write MC7[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC7[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC7[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC7[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC8[1]—Message Control 8[1] MC8[2]—Message Control 8[2] MC8[3]—Message Control 8[3] MC8[4]—Message Control 8[4] MC8[5]—Message Control 8[5] MC8[6]—Message Control 8[6] MC8[7]—Message Control 8[7] MC8[8]—Message Control 8[8]
MC8[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F860 H'F861 H'F862 H'F863 H'F864 H'F865 H'F866 H'F867
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC8[2] Bit Initial value Read/Write MC8[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC8[4] Bit Initial value Read/Write MC8[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC8[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC8[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC8[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC9[1]—Message Control 9[1] MC9[2]—Message Control 9[2] MC9[3]—Message Control 9[3] MC9[4]—Message Control 9[4] MC9[5]—Message Control 9[5] MC9[6]—Message Control 9[6] MC9[7]—Message Control 9[7] MC9[8]—Message Control 9[8]
MC9[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F868 H'F869 H'F86A H'F86B H'F86C H'F86D H'F86E H'F86F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC9[2] Bit Initial value Read/Write MC9[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC9[4] Bit Initial value Read/Write MC9[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC9[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC9[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC9[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC10[1]—Message Control 10[1] MC10[2]—Message Control 10[2] MC10[3]—Message Control 10[3] MC10[4]—Message Control 10[4] MC10[5]—Message Control 10[5] MC10[6]—Message Control 10[6] MC10[7]—Message Control 10[7] MC10[8]—Message Control 10[8]
MC10[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F870 H'F871 H'F872 H'F873 H'F874 H'F875 H'F876 H'F877
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC10[2] Bit Initial value Read/Write MC10[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC10[4] Bit Initial value Read/Write MC10[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC10[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC10[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC10[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC11[1]—Message Control 11[1] MC11[2]—Message Control 11[2] MC11[3]—Message Control 11[3] MC11[4]—Message Control 11[4] MC11[5]—Message Control 11[5] MC11[6]—Message Control 11[6] MC11[7]—Message Control 11[7] MC11[8]—Message Control 11[8]
MC11[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F878 H'F879 H'F87A H'F87B H'F87C H'F87D H'F87E H'F87F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC11[2] Bit Initial value Read/Write MC11[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC11[4] Bit Initial value Read/Write MC11[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC11[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC11[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC11[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC12[1]—Message Control 12[1] MC12[2]—Message Control 12[2] MC12[3]—Message Control 12[3] MC12[4]—Message Control 12[4] MC12[5]—Message Control 12[5] MC12[6]—Message Control 12[6] MC12[7]—Message Control 12[7] MC12[8]—Message Control 12[8]
MC12[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F880 H'F881 H'F882 H'F883 H'F884 H'F885 H'F886 H'F887
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC12[2] Bit Initial value Read/Write MC12[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC12[4] Bit Initial value Read/Write MC12[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC12[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC12[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC12[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC13[1]—Message Control 13[1] MC13[2]—Message Control 13[2] MC13[3]—Message Control 13[3] MC13[4]—Message Control 13[4] MC13[5]—Message Control 13[5] MC13[6]—Message Control 13[6] MC13[7]—Message Control 13[7] MC13[8]—Message Control 13[8]
MC13[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F888 H'F889 H'F88A H'F88B H'F88C H'F88D H'F88E H'F88F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC13[2] Bit Initial value Read/Write MC13[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC13[4] Bit Initial value Read/Write MC13[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC13[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC13[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC13[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC14[1]—Message Control 14[1] MC14[2]—Message Control 14[2] MC14[3]—Message Control 14[3] MC14[4]—Message Control 14[4] MC14[5]—Message Control 14[5] MC14[6]—Message Control 14[6] MC14[7]—Message Control 14[7] MC14[8]—Message Control 14[8]
MC14[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F890 H'F891 H'F892 H'F893 H'F894 H'F895 H'F896 H'F897
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC14[2] Bit Initial value Read/Write MC14[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC14[4] Bit Initial value Read/Write MC14[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC14[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC14[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC14[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC15[1]—Message Control 15[1] MC15[2]—Message Control 15[2] MC15[3]—Message Control 15[3] MC15[4]—Message Control 15[4] MC15[5]—Message Control 15[5] MC15[6]—Message Control 15[6] MC15[7]—Message Control 15[7] MC15[8]—Message Control 15[8]
MC15[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W
H'F898 H'F899 H'F89A H'F89B H'F89C H'F89D H'F89E H'F89F
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
3 DLC3 R/W
2 DLC2 R/W
1 DLC1 R/W
0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC15[2] Bit Initial value Read/Write MC15[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC15[4] Bit Initial value Read/Write MC15[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC15[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC15[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC15[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD0[1]—Message Data 0[1] MD0[2]—Message Data 0[2] MD0[3]—Message Data 0[3] MD0[4]—Message Data 0[4] MD0[5]—Message Data 0[5] MD0[6]—Message Data 0[6] MD0[7]—Message Data 0[7] MD0[8]—Message Data 0[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8B0 H'F8B1 H'F8B2 H'F8B3 H'F8B4 H'F8B5 H'F8B6 H'F8B7
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD1[1]—Message Data 1[1] MD1[2]—Message Data 1[2] MD1[3]—Message Data 1[3] MD1[4]—Message Data 1[4] MD1[5]—Message Data 1[5] MD1[6]—Message Data 1[6] MD1[7]—Message Data 1[7] MD1[8]—Message Data 1[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8B8 H'F8B9 H'F8BA H'F8BB H'F8BC H'F8BD H'F8BE H'F8BF
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD2[1]—Message Data 2[1] MD2[2]—Message Data 2[2] MD2[3]—Message Data 2[3] MD2[4]—Message Data 2[4] MD2[5]—Message Data 2[5] MD2[6]—Message Data 2[6] MD2[7]—Message Data 2[7] MD2[8]—Message Data 2[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8C0 H'F8C1 H'F8C2 H'F8C3 H'F8C4 H'F8C5 H'F8C6 H'F8C7
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD3[1]—Message Data 3[1] MD3[2]—Message Data 3[2] MD3[3]—Message Data 3[3] MD3[4]—Message Data 3[4] MD3[5]—Message Data 3[5] MD3[6]—Message Data 3[6] MD3[7]—Message Data 3[7] MD3[8]—Message Data 3[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8C8 H'F8C9 H'F8CA H'F8CB H'F8CC H'F8CD H'F8CE H'F8CF
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD4[1]—Message Data 4[1] MD4[2]—Message Data 4[2] MD4[3]—Message Data 4[3] MD4[4]—Message Data 4[4] MD4[5]—Message Data 4[5] MD4[6]—Message Data 4[6] MD4[7]—Message Data 4[7] MD4[8]—Message Data 4[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8D0 H'F8D1 H'F8D2 H'F8D3 H'F8D4 H'F8D5 H'F8D6 H'F8D7
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD5[1]—Message Data 5[1] MD5[2]—Message Data 5[2] MD5[3]—Message Data 5[3] MD5[4]—Message Data 5[4] MD5[5]—Message Data 5[5] MD5[6]—Message Data 5[6] MD5[7]—Message Data 5[7] MD5[8]—Message Data 5[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8D8 H'F8D9 H'F8DA H'F8DB H'F8DC H'F8DD H'F8DE H'F8DF
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD6[1]—Message Data 6[1] MD6[2]—Message Data 6[2] MD6[3]—Message Data 6[3] MD6[4]—Message Data 6[4] MD6[5]—Message Data 6[5] MD6[6]—Message Data 6[6] MD6[7]—Message Data 6[7] MD6[8]—Message Data 6[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8E0 H'F8E1 H'F8E2 H'F8E3 H'F8E4 H'F8E5 H'F8E6 H'F8E7
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD7[1]—Message Data 7[1] MD7[2]—Message Data 7[2] MD7[3]—Message Data 7[3] MD7[4]—Message Data 7[4] MD7[5]—Message Data 7[5] MD7[6]—Message Data 7[6] MD7[7]—Message Data 7[7] MD7[8]—Message Data 7[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8E8 H'F8E9 H'F8EA H'F8EB H'F8EC H'F8ED H'F8EE H'F8EF
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD8[1]—Message Data 8[1] MD8[2]—Message Data 8[2] MD8[3]—Message Data 8[3] MD8[4]—Message Data 8[4] MD8[5]—Message Data 8[5] MD8[6]—Message Data 8[6] MD8[7]—Message Data 8[7] MD8[8]—Message Data 8[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8F0 H'F8F1 H'F8F2 H'F8F3 H'F8F4 H'F8F5 H'F8F6 H'F8F7
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD9[1]—Message Data 9[1] MD9[2]—Message Data 9[2] MD9[3]—Message Data 9[3] MD9[4]—Message Data 9[4] MD9[5]—Message Data 9[5] MD9[6]—Message Data 9[6] MD9[7]—Message Data 9[7] MD9[8]—Message Data 9[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F8F8 H'F8F9 H'F8FA H'F8FB H'F8FC H'F8FD H'F8FE H'F8FF
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD10[1]—Message Data 10[1] MD10[2]—Message Data 10[2] MD10[3]—Message Data 10[3] MD10[4]—Message Data 10[4] MD10[5]—Message Data 10[5] MD10[6]—Message Data 10[6] MD10[7]—Message Data 10[7] MD10[8]—Message Data 10[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F900 H'F901 H'F902 H'F903 H'F904 H'F905 H'F906 H'F907
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD11[1]—Message Data 11[1] MD11[2]—Message Data 11[2] MD11[3]—Message Data 11[3] MD11[4]—Message Data 11[4] MD11[5]—Message Data 11[5] MD11[6]—Message Data 11[6] MD11[7]—Message Data 11[7] MD11[8]—Message Data 11[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F908 H'F909 H'F90A H'F90B H'F90C H'F90D H'F90E H'F90F
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD12[1]—Message Data 12[1] MD12[2]—Message Data 12[2] MD12[3]—Message Data 12[3] MD12[4]—Message Data 12[4] MD12[5]—Message Data 12[5] MD12[6]—Message Data 12[6] MD12[7]—Message Data 12[7] MD12[8]—Message Data 12[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F910 H'F911 H'F912 H'F913 H'F914 H'F915 H'F916 H'F917
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD13[1]—Message Data 13[1] MD13[2]—Message Data 13[2] MD13[3]—Message Data 13[3] MD13[4]—Message Data 13[4] MD13[5]—Message Data 13[5] MD13[6]—Message Data 13[6] MD13[7]—Message Data 13[7] MD13[8]—Message Data 13[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F918 H'F919 H'F91A H'F91B H'F91C H'F91D H'F91E H'F91F
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD14[1]—Message Data 14[1] MD14[2]—Message Data 14[2] MD14[3]—Message Data 14[3] MD14[4]—Message Data 14[4] MD14[5]—Message Data 14[5] MD14[6]—Message Data 14[6] MD14[7]—Message Data 14[7] MD14[8]—Message Data 14[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F920 H'F921 H'F922 H'F923 H'F924 H'F925 H'F926 H'F927
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
MD15[1]—Message Data 15[1] MD15[2]—Message Data 15[2] MD15[3]—Message Data 15[3] MD15[4]—Message Data 15[4] MD15[5]—Message Data 15[5] MD15[6]—Message Data 15[6] MD15[7]—Message Data 15[7] MD15[8]—Message Data 15[8]
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W
H'F928 H'F929 H'F92A H'F92B H'F92C H'F92D H'F92E H'F92F
3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0 HCAN0
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC0[1]—Message Control 0[1] MC0[2]—Message Control 0[2] MC0[3]—Message Control 0[3] MC0[4]—Message Control 0[4] MC0[5]—Message Control 0[5] MC0[6]—Message Control 0[6] MC0[7]—Message Control 0[7] MC0[8]—Message Control 0[8]
H'FA20 H'FA21 H'FA22 H'FA23 H'FA24 H'FA25 H'FA26 H'FA27
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC0[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC0[2] Bit Initial value Read/Write MC0[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC0[4] Bit Initial value Read/Write MC0[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC0[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC0[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC0[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC1[1]—Message Control 1[1] MC1[2]—Message Control 1[2] MC1[3]—Message Control 1[3] MC1[4]—Message Control 1[4] MC1[5]—Message Control 1[5] MC1[6]—Message Control 1[6] MC1[7]—Message Control 1[7] MC1[8]—Message Control 1[8]
H'FA28 H'FA29 H'FA2A H'FA2B H'FA2C H'FA2D H'FA2E H'FA2F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC1[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC1[2] Bit Initial value Read/Write MC1[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC1[4] Bit Initial value Read/Write MC1[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC1[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC1[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC1[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC2[1]—Message Control 2[1] MC2[2]—Message Control 2[2] MC2[3]—Message Control 2[3] MC2[4]—Message Control 2[4] MC2[5]—Message Control 2[5] MC2[6]—Message Control 2[6] MC2[7]—Message Control 2[7] MC2[8]—Message Control 2[8]
H'FA30 H'FA31 H'FA32 H'FA33 H'FA34 H'FA35 H'FA36 H'FA37
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC2[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC2[2] Bit Initial value Read/Write MC2[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC2[4] Bit Initial value Read/Write MC2[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC2[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC2[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC2[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC3[1]—Message Control 3[1] MC3[2]—Message Control 3[2] MC3[3]—Message Control 3[3] MC3[4]—Message Control 3[4] MC3[5]—Message Control 3[5] MC3[6]—Message Control 3[6] MC3[7]—Message Control 3[7] MC3[8]—Message Control 3[8]
H'FA38 H'FA39 H'FA3A H'FA3B H'FA3C H'FA3D H'FA3E H'FA3F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC3[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC3[2] Bit Initial value Read/Write MC3[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC3[4] Bit Initial value Read/Write MC3[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC3[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC3[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC3[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC4[1]—Message Control 4[1] MC4[2]—Message Control 4[2] MC4[3]—Message Control 4[3] MC4[4]—Message Control 4[4] MC4[5]—Message Control 4[5] MC4[6]—Message Control 4[6] MC4[7]—Message Control 4[7] MC4[8]—Message Control 4[8]
H'FA40 H'FA41 H'FA42 H'FA43 H'FA44 H'FA45 H'FA46 H'FA47
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC4[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC4[2] Bit Initial value Read/Write MC4[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC4[4] Bit Initial value Read/Write MC4[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC4[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC4[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC4[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC5[1]—Message Control 5[1] MC5[2]—Message Control 5[2] MC5[3]—Message Control 5[3] MC5[4]—Message Control 5[4] MC5[5]—Message Control 5[5] MC5[6]—Message Control 5[6] MC5[7]—Message Control 5[7] MC5[8]—Message Control 5[8]
H'FA48 H'FA49 H'FA4A H'FA4B H'FA4C H'FA4D H'FA4E H'FA4F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC5[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC5[2] Bit Initial value Read/Write MC5[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC5[4] Bit Initial value Read/Write MC5[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC5[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC5[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC5[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC6[1]—Message Control 6[1] MC6[2]—Message Control 6[2] MC6[3]—Message Control 6[3] MC6[4]—Message Control 6[4] MC6[5]—Message Control 6[5] MC6[6]—Message Control 6[6] MC6[7]—Message Control 6[7] MC6[8]—Message Control 6[8]
H'FA50 H'FA51 H'FA52 H'FA53 H'FA54 H'FA55 H'FA56 H'FA57
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC6[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC6[2] Bit Initial value Read/Write MC6[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC6[4] Bit Initial value Read/Write MC6[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC6[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC6[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC6[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC7[1]—Message Control 7[1] MC7[2]—Message Control 7[2] MC7[3]—Message Control 7[3] MC7[4]—Message Control 7[4] MC7[5]—Message Control 7[5] MC7[6]—Message Control 7[6] MC7[7]—Message Control 7[7] MC7[8]—Message Control 7[8]
H'FA58 H'FA59 H'FA5A H'FA5B H'FA5C H'FA5D H'FA5E H'FA5F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC7[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC7[2] Bit Initial value Read/Write MC7[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC7[4] Bit Initial value Read/Write MC7[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC7[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC7[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC7[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC8[1]—Message Control 8[1] MC8[2]—Message Control 8[2] MC8[3]—Message Control 8[3] MC8[4]—Message Control 8[4] MC8[5]—Message Control 8[5] MC8[6]—Message Control 8[6] MC8[7]—Message Control 8[7] MC8[8]—Message Control 8[8]
H'FA60 H'FA61 H'FA62 H'FA63 H'FA64 H'FA65 H'FA66 H'FA67
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC8[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC8[2] Bit Initial value Read/Write MC8[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC8[4] Bit Initial value Read/Write MC8[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC8[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC8[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC8[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC9[1]—Message Control 9[1] MC9[2]—Message Control 9[2] MC9[3]—Message Control 9[3] MC9[4]—Message Control 9[4] MC9[5]—Message Control 9[5] MC9[6]—Message Control 9[6] MC9[7]—Message Control 9[7] MC9[8]—Message Control 9[8]
H'FA68 H'FA69 H'FA6A H'FA6B H'FA6C H'FA6D H'FA6E H'FA6F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC9[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC9[2] Bit Initial value Read/Write MC9[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC9[4] Bit Initial value Read/Write MC9[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC9[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC9[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC9[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC10[1]—Message Control 10[1] MC10[2]—Message Control 10[2] MC10[3]—Message Control 10[3] MC10[4]—Message Control 10[4] MC10[5]—Message Control 10[5] MC10[6]—Message Control 10[6] MC10[7]—Message Control 10[7] MC10[8]—Message Control 10[8]
H'FA70 H'FA71 H'FA72 H'FA73 H'FA74 H'FA75 H'FA76 H'FA77
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC10[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC10[2] Bit Initial value Read/Write MC10[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC10[4] Bit Initial value Read/Write MC10[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC10[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC10[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC10[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
MC11[1]—Message Control 11[1] MC11[2]—Message Control 11[2] MC11[3]—Message Control 11[3] MC11[4]—Message Control 11[4] MC11[5]—Message Control 11[5] MC11[6]—Message Control 11[6] MC11[7]—Message Control 11[7] MC11[8]—Message Control 11[8]
H'FA78 H'FA79 H'FA7A H'FA7B H'FA7C H'FA7D H'FA7E H'FA7F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC11[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC11[2] Bit Initial value Read/Write MC11[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC11[4] Bit Initial value Read/Write MC11[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC11[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC11[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC11[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC12[1]—Message Control 12[1] MC12[2]—Message Control 12[2] MC12[3]—Message Control 12[3] MC12[4]—Message Control 12[4] MC12[5]—Message Control 12[5] MC12[6]—Message Control 12[6] MC12[7]—Message Control 12[7] MC12[8]—Message Control 12[8]
H'FA80 H'FA81 H'FA82 H'FA83 H'FA84 H'FA85 H'FA86 H'FA87
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC12[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC12[2] Bit Initial value Read/Write MC12[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC12[4] Bit Initial value Read/Write MC12[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC12[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC12[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC12[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC13[1]—Message Control 13[1] MC13[2]—Message Control 13[2] MC13[3]—Message Control 13[3] MC13[4]—Message Control 13[4] MC13[5]—Message Control 13[5] MC13[6]—Message Control 13[6] MC13[7]—Message Control 13[7] MC13[8]—Message Control 13[8]
H'FA88 H'FA89 H'FA8A H'FA8B H'FA8C H'FA8D H'FA8E H'FA8F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC13[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC13[2] Bit Initial value Read/Write MC13[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC13[4] Bit Initial value Read/Write MC13[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC13[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
Page 1280 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC13[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC13[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC14[1]—Message Control 14[1] MC14[2]—Message Control 14[2] MC14[3]—Message Control 14[3] MC14[4]—Message Control 14[4] MC14[5]—Message Control 14[5] MC14[6]—Message Control 14[6] MC14[7]—Message Control 14[7] MC14[8]—Message Control 14[8]
H'FA90 H'FA91 H'FA92 H'FA93 H'FA94 H'FA95 H'FA96 H'FA97
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC14[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC14[2] Bit Initial value Read/Write MC14[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
MC14[4] Bit Initial value Read/Write MC14[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC14[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC14[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC14[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Page 1284 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC15[1]—Message Control 15[1] MC15[2]—Message Control 15[2] MC15[3]—Message Control 15[3] MC15[4]—Message Control 15[4] MC15[5]—Message Control 15[5] MC15[6]—Message Control 15[6] MC15[7]—Message Control 15[7] MC15[8]—Message Control 15[8]
H'FA98 H'FA99 H'FA9A H'FA9B H'FA9C H'FA9D H'FA9E H'FA9F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MC15[1] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 DLC3 R/W 2 DLC2 R/W 1 DLC1 R/W 0 DLC0 R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Data Length Code 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Data length = 0 bytes Data length = 1 byte Data length = 2 bytes Data length = 3 bytes Data length = 4 bytes Data length = 5 bytes Data length = 6 bytes Data length = 7 bytes
1 0/1 0/1 0/1 Data length = 8 bytes MC15[2] Bit Initial value Read/Write MC15[3] Bit Initial value Read/Write 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MC15[4] Bit Initial value Read/Write MC15[5] Bit Initial value Read/Write 7 6 5 4 RTR R/W 3 IDE R/W 2 ⎯ R/W 1 0 STD_ID2 STD_ID1 STD_ID0 R/W R/W R/W EXD_ID17 EXD_ID16 R/W R/W 7 ⎯ R/W 6 ⎯ R/W 5 ⎯ R/W 4 ⎯ R/W 3 ⎯ R/W 2 ⎯ R/W 1 ⎯ R/W 0 ⎯ R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Identifier Extension 0 Standard format 1 Extended format Remote Transmission Request 0 Data frame 1 Remote frame
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames MC15[6] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 STD_ID10 STD_ID9 STD_ID8 STD_ID7 STD_ID6 STD_ID5 STD_ID4 STD_ID3 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Standard Identifier Set the identifier (standard identifier) of data frames and remote frames
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REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MC15[7] Bit Initial value Read/Write 7 EXD_ID7 R/W 6 5 4 3 2 1 0 EXD_ID6 EXD_ID5 EXD_ID4 EXD_ID3 EXD_ID2 EXD_ID1 EXD_ID0 R/W R/W R/W R/W R/W R/W R/W
Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames MC15[8] Bit Initial value Read/Write 7 6 5 4 3 2 1 0 EXD_ID15 EXD_ID14 EXD_ID13 EXD_ID12 EXD_ID11 EXD_ID10 EXD_ID9 EXD_ID8 Undefined Undefined Undefined Undefined Undefined Undefined Undefined Undefined R/W R/W R/W R/W R/W R/W R/W R/W
Extended Identifier Set the identifier (extended identifier) of data frames and remote frames
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD0[1]—Message Data 0[1] MD0[2]—Message Data 0[2] MD0[3]—Message Data 0[3] MD0[4]—Message Data 0[4] MD0[5]—Message Data 0[5] MD0[6]—Message Data 0[6] MD0[7]—Message Data 0[7] MD0[8]—Message Data 0[8]
H'FAB0 H'FAB1 H'FAB2 H'FAB3 H'FAB4 H'FAB5 H'FAB6 H'FAB7
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD1[1]—Message Data 1[1] MD1[2]—Message Data 1[2] MD1[3]—Message Data 1[3] MD1[4]—Message Data 1[4] MD1[5]—Message Data 1[5] MD1[6]—Message Data 1[6] MD1[7]—Message Data 1[7] MD1[8]—Message Data 1[8]
H'FAB8 H'FAB9 H'FABA H'FABB H'FABC H'FABD H'FABE H'FABF
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD2[1]—Message Data 2[1] MD2[2]—Message Data 2[2] MD2[3]—Message Data 2[3] MD2[4]—Message Data 2[4] MD2[5]—Message Data 2[5] MD2[6]—Message Data 2[6] MD2[7]—Message Data 2[7] MD2[8]—Message Data 2[8]
H'FAC0 H'FAC1 H'FAC2 H'FAC3 H'FAC4 H'FAC5 H'FAC6 H'FAC7
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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Appendix B Internal I/O Register
MD3[1]—Message Data 3[1] MD3[2]—Message Data 3[2] MD3[3]—Message Data 3[3] MD3[4]—Message Data 3[4] MD3[5]—Message Data 3[5] MD3[6]—Message Data 3[6] MD3[7]—Message Data 3[7] MD3[8]—Message Data 3[8]
H'FAC8 H'FAC9 H'FACA H'FACB H'FACC H'FACD H'FACE H'FACF
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD4[1]—Message Data 4[1] MD4[2]—Message Data 4[2] MD4[3]—Message Data 4[3] MD4[4]—Message Data 4[4] MD4[5]—Message Data 4[5] MD4[6]—Message Data 4[6] MD4[7]—Message Data 4[7] MD4[8]—Message Data 4[8]
H'FAD0 H'FAD1 H'FAD2 H'FAD3 H'FAD4 H'FAD5 H'FAD6 H'FAD7
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1292 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD5[1]—Message Data 5[1] MD5[2]—Message Data 5[2] MD5[3]—Message Data 5[3] MD5[4]—Message Data 5[4] MD5[5]—Message Data 5[5] MD5[6]—Message Data 5[6] MD5[7]—Message Data 5[7] MD5[8]—Message Data 5[8]
H'FAD8 H'FAD9 H'FADA H'FADB H'FADC H'FADD H'FADE H'FADF
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD6[1]—Message Data 6[1] MD6[2]—Message Data 6[2] MD6[3]—Message Data 6[3] MD6[4]—Message Data 6[4] MD6[5]—Message Data 6[5] MD6[6]—Message Data 6[6] MD6[7]—Message Data 6[7] MD6[8]—Message Data 6[8]
H'FAE0 H'FAE1 H'FAE2 H'FAE3 H'FAE4 H'FAE5 H'FAE6 H'FAE7
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1294 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD7[1]—Message Data 7[1] MD7[2]—Message Data 7[2] MD7[3]—Message Data 7[3] MD7[4]—Message Data 7[4] MD7[5]—Message Data 7[5] MD7[6]—Message Data 7[6] MD7[7]—Message Data 7[7] MD7[8]—Message Data 7[8]
H'FAE8 H'FAE9 H'FAEA H'FAEB H'FAEC H'FAED H'FAEE H'FAEF
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD8[1]—Message Data 8[1] MD8[2]—Message Data 8[2] MD8[3]—Message Data 8[3] MD8[4]—Message Data 8[4] MD8[5]—Message Data 8[5] MD8[6]—Message Data 8[6] MD8[7]—Message Data 8[7] MD8[8]—Message Data 8[8]
H'FAF0 H'FAF1 H'FAF2 H'FAF3 H'FAF4 H'FAF5 H'FAF6 H'FAF7
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1296 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD9[1]—Message Data 9[1] MD9[2]—Message Data 9[2] MD9[3]—Message Data 9[3] MD9[4]—Message Data 9[4] MD9[5]—Message Data 9[5] MD9[6]—Message Data 9[6] MD9[7]—Message Data 9[7] MD9[8]—Message Data 9[8]
H'FAF8 H'FAF9 H'FAFA H'FAFB H'FAFC H'FAFD H'FAFE H'FAFF
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD10[1]—Message Data 10[1] MD10[2]—Message Data 10[2] MD10[3]—Message Data 10[3] MD10[4]—Message Data 10[4] MD10[5]—Message Data 10[5] MD10[6]—Message Data 10[6] MD10[7]—Message Data 10[7] MD10[8]—Message Data 10[8]
H'FB00 H'FB01 H'FB02 H'FB03 H'FB04 H'FB05 H'FB06 H'FB07
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1298 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD11[1]—Message Data 11[1] MD11[2]—Message Data 11[2] MD11[3]—Message Data 11[3] MD11[4]—Message Data 11[4] MD11[5]—Message Data 11[5] MD11[6]—Message Data 11[6] MD11[7]—Message Data 11[7] MD11[8]—Message Data 11[8]
H'FB08 H'FB09 H'FB0A H'FB0B H'FB0C H'FB0D H'FB0E H'FB0F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1299 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD12[1]—Message Data 12[1] MD12[2]—Message Data 12[2] MD12[3]—Message Data 12[3] MD12[4]—Message Data 12[4] MD12[5]—Message Data 12[5] MD12[6]—Message Data 12[6] MD12[7]—Message Data 12[7] MD12[8]—Message Data 12[8]
H'FB10 H'FB11 H'FB12 H'FB13 H'FB14 H'FB15 H'FB16 H'FB17
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1300 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD13[1]—Message Data 13[1] MD13[2]—Message Data 13[2] MD13[3]—Message Data 13[3] MD13[4]—Message Data 13[4] MD13[5]—Message Data 13[5] MD13[6]—Message Data 13[6] MD13[7]—Message Data 13[7] MD13[8]—Message Data 13[8]
H'FB18 H'FB19 H'FB1A H'FB1B H'FB1C H'FB1D H'FB1E H'FB1F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1301 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MD14[1]—Message Data 14[1] MD14[2]—Message Data 14[2] MD14[3]—Message Data 14[3] MD14[4]—Message Data 14[4] MD14[5]—Message Data 14[5] MD14[6]—Message Data 14[6] MD14[7]—Message Data 14[7] MD14[8]—Message Data 14[8]
H'FB20 H'FB21 H'FB22 H'FB23 H'FB24 H'FB25 H'FB26 H'FB27
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
Page 1302 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MD15[1]—Message Data 15[1] MD15[2]—Message Data 15[2] MD15[3]—Message Data 15[3] MD15[4]—Message Data 15[4] MD15[5]—Message Data 15[5] MD15[6]—Message Data 15[6] MD15[7]—Message Data 15[7] MD15[8]—Message Data 15[8]
H'FB28 H'FB29 H'FB2A H'FB2B H'FB2C H'FB2D H'FB2E H'FB2F
HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1 HCAN1
Note: These registers are not available in the H8S/2635 Group.
MDx[1] Bit Initial value Read/Write MDx[2] Bit Initial value Read/Write MDx[3] Bit Initial value Read/Write MDx[4] Bit Initial value Read/Write MDx[5] Bit Initial value Read/Write MDx[6] Bit Initial value Read/Write MDx[7] Bit Initial value Read/Write MDx[8] Bit Initial value Read/Write 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 7 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 6 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 5 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 4 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 3 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 2 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 1 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W 0 * R/W *: Undefined x = 0 to 15
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PWCR1—PWM Control Register 1
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 IE 0 R/W 4 CMF 0 R/(W)*
H'FC00
3 CST 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0
PWM1
CKS0 0 R/W
Clock Select 0 0 1 1 * 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/2 0 Internal clock: counts on φ/4 1 Internal clock: counts on φ/8 * Internal clock: counts on φ/16 *: Don't care
Counter Start 0 1 Compare Match Flag 0 PWCNT is stopped PWCNT is started
[Clearing conditions] • When 0 is written to CMF after reading CMF = 1 • When the DTC is activated by a compare match interrupt, and the DISEL bit in the DTC’s MRB register is 0 [Setting condition] • When PWCNT = PWCYR
1
Interrupt Enable 0 1 Interrupt disabled Interrupt enabled
Note: * Only 0 can be written, to clear the flag.
Page 1304 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PWOCR1—PWM Output Control Register 1
Bit Initial value Read/Write 7 OE1H 0 R/W 6 OE1G 0 R/W 5 OE1F 0 R/W 4 OE1E 0 R/W
H'FC02
3 OE1D 0 R/W 2 OE1C 0 R/W 1 OE1B 0 R/W
PWM1
0 OE1A 0 R/W
Output Enable 0 1 PWM output is disabled PWM output is enabled
PWPR1—PWM Polarity Register 1
Bit Initial value Read/Write 7 OPS1H 0 R/W 6 OPS1G 0 R/W 5 OPS1F 0 R/W 4 OPS1E 0 R/W
H'FC04
3 OPS1D 0 R/W 2 OPS1C 0 R/W 1 OPS1B 0 R/W
PWM1
0 OPS1A 0 R/W
Output Polarity Select 0 1 PWM direct output PWM inverse output
PWCYR1—PWM Cycle Register 1
Bit Initial value Read/Write 15 ⎯ 1 ⎯ 14 ⎯ 1 ⎯ 13 ⎯ 1 ⎯ 12 ⎯ 1 ⎯ 11 ⎯ 1 ⎯ 10 ⎯ 1 1 1 9 8
H'FC06
7 1 6 1 5 1 4 1 3 1 2 1 1 1
PWM1
0 1
⎯ R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Set the PWM conversion cycle
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PWBFR1A—PWM Buffer Register 1A PWBFR1C—PWM Buffer Register 1C PWBFR1E—PWM Buffer Register 1E PWBFR1G—PWM Buffer Register 1G
Bit Initial value Read/Write 15 ⎯ 1 ⎯ 14 ⎯ 1 ⎯ 13 1 12 0 11 1 10 1 9 0 8 0
H'FC08 H'FC0A H'FC0C H'FC0E
7 0 6 0 5 0 4 0 3 0 2 0 1 0
PWM1 PWM1 PWM1 PWM1
0 0
⎯ OTS ⎯ ⎯ R/W ⎯
⎯ DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0 ⎯ R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Duty Bits 9 to 0 comprise the data transferred to bits 9 to 0 in PWDTR1 Description PWM1A output selected PWM1B output selected PWM1C output selected PWM1D output selected PWM1E output selected PWM1F output selected PWM1G output selected PWM1H output selected
Output Terminal Select Bit 12 is the data transferred to bit 12 of PWDTR1 Register PWDTR1A PWDTR1C PWDTR1E PWDTR1G OTS 0 1 0 1 0 1 0 1
Note: When a PWCYR1 compare match occurs, data is transferred from PWBFR1A to PWDTR1A, from PWBFR1C to PWDTR1C, from PWBFR1E to PWDTR1E, and from PWBFR1G to PWDTR1G.
Page 1306 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PWCR2—PWM Control Register 2
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 IE 0 R/W 4 CMF 0 R/(W)*
H'FC10
3 CST 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0
PWM2
CKS0 0 R/W
Clock Select 0 0 1 1 * 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/2 0 Internal clock: counts on φ/4 1 Internal clock: counts on φ/8 * Internal clock: counts on φ/16 *: Don't care
Counter Start 0 1 Compare Match Flag 0 PWCNT is stopped PWCNT is started
[Clearing conditions] • When 0 is written to CMF after reading CMF = 1 • When the DTC is activated by a compare match interrupt, and the DISEL bit in the DTC’s MRB register is 0 [Setting condition] • When PWCNT = PWCYR
1
Interrupt Enable 0 1 Interrupt disabled Interrupt enabled
Note: * Only 0 can be written, to clear the flag.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PWOCR2—PWM Output Control Register 2
Bit Initial value Read/Write 7 OE2H 0 R/W 6 OE2G 0 R/W 5 OE2F 0 R/W 4 OE2E 0 R/W
H'FC12
3 OE2D 0 R/W 2 OE2C 0 R/W 1 OE2B 0 R/W
PWM2
0 OE2A 0 R/W
Output Enable 0 1 PWM output is disabled PWM output is enabled
PWPR2—PWM Polarity Register 2
Bit Initial value Read/Write 7 OPS2H 0 R/W 6 OPS2G 0 R/W 5 OPS2F 0 R/W 4 OPS2E 0 R/W
H'FC14
3 OPS2D 0 R/W 2 OPS2C 0 R/W 1 OPS2B 0 R/W
PWM2
0 OPS2A 0 R/W
Output Polarity Select 0 1 PWM direct output PWM inverse output
PWCYR2—PWM Cycle Register 2
Bit Initial value Read/Write 15 ⎯ 1 ⎯ 14 ⎯ 1 ⎯ 13 ⎯ 1 ⎯ 12 ⎯ 1 ⎯ 11 ⎯ 1 ⎯ 10 ⎯ 1 1 1 9 8
H'FC16
7 1 6 1 5 1 4 1 3 1 2 1 1 1
PWM2
0 1
⎯ R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Set the PWM conversion cycle
Page 1308 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PWBFR2A—PWM Buffer Register 2A PWBFR2B—PWM Buffer Register 2B PWBFR2C—PWM Buffer Register 2C PWBFR2D—PWM Buffer Register 2D
Bit Initial value Read/Write 15 ⎯ 1 ⎯ 14 ⎯ 1 ⎯ 13 1 12 0 11 1 10 1 9 0 8 0 7 0
H'FC18 H'FC1A H'FC1C H'FC1E
6 0 5 0 4 0 3 0 2 0 1 0
PWM2 PWM2 PWM2 PWM2
0 0
⎯ TDS ⎯ ⎯ R/W ⎯
⎯ DT9 DT8 DT7 DT6 DT5 DT4 DT3 DT2 DT1 DT0 ⎯ R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Duty Bits 9 to 0 compromise the data transferred to bits 9 to 0 in PWDTR2
Transfer Destination Select Selects the PWDTR2 register to which data is to be transferred Register PWBFR2A PWBFR2B PWBFR2C PWBFR2D TDS 0 1 0 1 0 1 0 1 Description PWDTR2A selected PWDTR2E selected PWDTR2B selected PWDTR2F selected PWDTR2C selected PWDTR2G selected PWDTR2D selected PWDTR2H selected
Note: When a PWCYR2 compare match occurs, data is transferred from PWBFR2A to PWDTR2A or PWDTR2E, from PWBFR2B to PWDTR2B or PWDTR2F, from PWBFR2C to PWDTR2C or PWDTR2G, and from PWBFR2D to PWDTR2D or PWDTR2H.
PHDDR—Port H Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FC20
3 0 W 2 0 W 1 0 W 0 0 W
Port
PH7DDR PH6DDR PH5DDR PH4DDR PH3DDR PH2DDR PH1DDR PH0DDR
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PJDDR—Port J Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FC21
3 0 W 2 0 W 1 0 W 0 0 W
Port
PJ7DDR PJ6DDR PJ5DDR PJ4DDR PJ3DDR PJ2DDR PJ1DDR PJ0DDR
PHDR—Port H Data Register
Bit Initial value Read/Write 7 PH7DR 0 R/W 6 PH6DR 0 R/W 5 PH5DR 0 R/W 4 PH4DR 0 R/W
H'FC24
3 PH3DR 0 R/W 2 PH2DR 0 R/W 1 PH1DR 0 R/W 0
Port
PH0DR 0 R/W
PJDR—Port J Data Register
Bit Initial value Read/Write 7 PJ7DR 0 R/W 6 PJ6DR 0 R/W 5 PJ5DR 0 R/W 4 PJ4DR 0 R/W
H'FC25
3 PJ3DR 0 R/W 2 PJ2DR 0 R/W 1 PJ1DR 0 R/W 0
Port
PJ0DR 0 R/W
PORTH—Port H Register
Bit Initial value Read/Write 7 PH7 ⎯* R 6 PH6 ⎯* R 5 PH5 ⎯* R 4 PH4 ⎯* R
H'FC28
3 PH3 ⎯* R 2 PH2 ⎯* R 1 PH1 ⎯* R 0 PH0 ⎯* R
Port
Note: * Determined by the state of PH7 to PH0.
PORTJ—Port J Register
Bit Initial value Read/Write 7 PJ7 ⎯* R 6 PJ6 ⎯* R 5 PJ5 ⎯* R 4 PJ4 ⎯* R
H'FC29
3 PJ3 ⎯* R 2 PJ2 ⎯* R 1 PJ1 ⎯* R 0 PJ0 ⎯* R
Port
Note: * Determined by the state of PJ7 to PJ0.
Page 1310 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MSTPCRD—Module Stop Control Register D
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 4
H'FC60
3 2 1
System
0
MSTPD7 MSTPD6 MSTPD5 MSTPD4 MSTPD3 MSTPD2 MSTPD1 MSTPD0 Undefined Undefined Undefined Undefined Undefined Undefined ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
Module Stop 0 PWM module stop mode is cleared 1 PWM module stop mode is set
SCRX—Serial Control Register X
Bit : 7 ⎯ Initial value : R/W : 0 R/W 6 IICX1 0 R/W 5 IICX0 0 R/W 4 IICE 0 R/W
H'FDB4
3 ⎯ 1 ⎯ 2 ⎯ 0 R/W 1 ⎯ 0 R/W 0 ⎯ 0 R/W
IIC
I2C master enable 0 Disables CPU access of I2C bus interface data register and control register 1 Enables CPU access of I2C bus interface data register and control register
I2C transfer rate select 1, 0 Note: This register is valid only when an I2C bus interface has been added as an H8S/2638, H8S/2639, and H8S/2630 option.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
DDCSWR—DDC Switch Register
Bit : 7 ⎯ Initial value : R/W : 0 R/(W)*1 6 ⎯ 0 5 ⎯ 0 4 ⎯ 0
H'FDB5
3 CLR3 1 W*2 2 CLR2 1 W*2 1 CLR1 1 W*2 0 CLR0 1 W*2
IIC
R/(W)*1 R/(W)*1 R/(W)*1 Reserved bit
IIC clear 3 to 0 CLR3 CLR2 CLR1 CLR0 0 0 ⎯ ⎯ Setting prohibited 1 0 0 Setting prohibited 1 IIC0 internal latch cleared 1 0 IIC1 internal latch cleared IIC0 and IIC1 internal latches cleared 1 Invalid setting 1 ⎯ ⎯ ⎯
Notes: This register is valid only when an I2C bus interface has been added as an H8S/2638, H8S/2639, and H8S/2630 option. 1. Should always be written with 0. 2. Always read as 1.
Page 1312 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
SBYCR—Standby Control Register
Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 1 R/W 5 STS1 0 R/W 4 STS0 1 R/W
H'FDE4
3 OPE 1 R/W 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯
System
0 ⎯ 0 ⎯
Output Port Enable 0 1 In software standby mode, watch mode, and when making a direct transition, address bus and bus control signals are high-impedance In software standby mode, watch mode, and when making a direct transition, the output state of the address bus and bus control signals is retained
Standby Timer Select 2 to 0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Software Standby 0 • Shifts to sleep mode when the SLEEP instruction is executed in high-speed mode or medium-speed mode • Shifts to sub-sleep mode when the SLEEP instruction is executed in sub-active mode • Shifts to software standby mode, sub-active mode, and watch mode when the SLEEP instruction is executed in high-speed mode or medium-speed mode • Shifts to watch mode or high-speed mode when the SLEEP instruction is executed in sub-active mode Standby time = 8192 states Standby time = 16384 states Standby time = 32768 states Standby time = 65536 states Standby time = 131072 states Standby time = 262144 states Reserved Standby time = 16 states (Setting prohibited)
1
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Page 1313 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
SYSCR—System Control Register
Bit Initial value Read/Write 7 MACS 0 R/W 6 ⎯ 0 ⎯ 5 INTM1 0 R/W 4 INTM0 0 R/W
H'FDE5
3 NMIEG 0 R/W 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯
System
0 RAME 1 R/W
RAM Enable 0 On-chip RAM is disabled 1 On-chip RAM is enabled NMI Edge Select 0 An interrupt is requested at the falling edge of NMI input 1 An interrupt is requested at the rising edge of NMI input Interrupt Control Mode 1 and 0 INTM1 INTM0 0 1 0 1 0 1 MAC Saturation 0 Non-saturating calculation for MAC instruction 1 Saturating calculation for MAC instruction Interrupt Control Mode 0 ⎯ 2 ⎯ Description Control of interrupts by I bit Setting prohibited Control of interrupts by I2 to I0 bits and IPR Setting prohibited
Page 1314 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
SCKCR—System Clock Control Register
Bit Initial value Read/Write 7 PSTOP 0 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯ 3
H'FDE6
2 SCK2 0 R/W 1 SCK1 0 R/W 0 SCK0 0 R/W
System
STCS 0 R/W
System Clock Select 0 0 1 1 0 0 Bus master in high-speed mode 1 Medium-speed clock is φ/2 0 Medium-speed clock is φ/4 1 Medium-speed clock is φ/8 0 Medium-speed clock is φ/16 1 Medium-speed clock is φ/32 1 ⎯⎯ Frequency Multiplication Factor Switching Mode Select 0 Specified multiplication factor is valid after transition to software standby mode, watch mode*, or subactive mode* 1 Specified multiplication factor is valid immediately after STC bits are rewritten φ Clock Output Disable DDR PSTOP Hardware standby mode Software standby mode, watch mode*, and direct transition Sleep mode and subsleep mode* High-speed mode, medium-speed mode, and subactive mode* 0 ⎯ High impedance High impedance 1 0 High impedance Fixed high 1 1 High impedance Fixed high Fixed high Fixed high
High impedance φ output High impedance φ output
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask and W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1315 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MDCR—Mode Control Register
Bit Initial value Read/Write 7 ⎯ 1 R/W 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FDE7
3 ⎯ 0 ⎯ 2 MDS2 ⎯* R 1 MDS1 ⎯* R
System
0 MDS0 ⎯* R
Note: * Determined by pins MD2 to MD0.
Mode Select 2 to 0 Indicate the input levels at pins MD2 to MD0
MSTPCRA—Module Stop Control Register A
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 1 R/W 4 1 R/W
H'FDE8
3 1 R/W 2 1 R/W 1 1 R/W
System
0 1 R/W
MSTPA7 MSTPA6 MSTPA5 MSTPA4 MSTPA3 MSTPA2 MSTPA1 MSTPA0
Module Stop 0 1 Module stop mode is cleared Module stop mode is set
MSTPCRB—Module Stop Control Register B
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W
H'FDE9
3 1 R/W 2 1 R/W 1 1 R/W
System
0 1 R/W
MSTPB7 MSTPB6 MSTPB5 MSTPB4 MSTPB3 MSTPB2 MSTPB1 MSTPB0
Module Stop 0 1 Module stop mode is cleared Module stop mode is set
Page 1316 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
MSTPCRC—Module Stop Control Register C
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W
H'FDEA
3 1 R/W 2 1 R/W 1 1 R/W
System
0 1 R/W
MSTPC7 MSTPC6 MSTPC5 MSTPC4 MSTPC3 MSTPC2 MSTPC1 MSTPC0
Module Stop 0 1 Module stop mode is cleared Module stop mode is set
PFCR—Pin Function Control Register
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FDEB
3 AE3 1/0 R/W 2 AE2 1/0 R/W 1 AE1 1 R/W 0
System
AE0 1/0 R/W
Address Output Enable 3 to 0 0 0 0 1 1 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 A8 to A23 address output disabled (Initial value*) A8 address output enabled; A9 to A23 address output disabled A8, A9 address output enabled; A10 to A23 address output disabled A8 to A10 address output enabled; A11 to A23 address output disabled A8 to A11 address output enabled; A12 to A23 address output disabled A8 to A12 address output enabled; A13 to A23 address output disabled A8 to A13 address output enabled; A14 to A23 address output disabled A8 to A14 address output enabled; A15 to A23 address output disabled A8 to A15 address output enabled; A16 to A23 address output disabled A8 to A16 address output enabled; A17 to A23 address output disabled A8 to A17 address output enabled; A18 to A23 address output disabled A8 to A18 address output enabled; A19 to A23 address output disabled A8 to A19 address output enabled; A20 to A23 address output disabled A8 to A20 address output enabled; A21 to A23 address output disabled (Initial value*) A8 to A21 address output enabled; A22, A23 address output disabled A8 to A23 address output enabled
Note: * In on-chip ROM-enabled expansion mode, bits AE3 to AE0 are initialized to B'0000. In on-chip ROM-disabled expansion mode, bits AE3 to AE0 are initialized to B'1101. Address pins A0 to A7 are made address outputs by setting the corresponding DDR bits to 1.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1317 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
LPWRCR—Low-Power Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FDEC
3 0 R/W 2 ⎯ 0 R/W 1 STC1 0 R/W
×1 ×2 ×4 Setting prohibited
System
0 STC0 0 R/W
DTON*1 LSON*1 NESEL*1 SUBSTP*1 RFCUT*1
Frequency Multiplication Factor 0 1 0 1 0 1
Oscillation Circuit Feedback Resistance Control Bit 0 When the main clock is oscillating, sets the feedback resistance ON. When the main clock is stopped, sets the feedback resistance OFF Sets the feedback resistance OFF
1
Subclock Enable 0 1 Enables subclock generation Disables subclock generation
Noise Elimination Sampling Frequency Select 0 1 Low-Speed ON Flag 0 • When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts to sleep mode, software standby mode, or watch mode* • When the SLEEP instruction is executed in sub-active mode, operation shifts to watch mode or shifts directly to high-speed mode • Operation shifts to high-speed mode when watch mode is cancelled • When the SLEEP instruction is executed in high-speed mode, operation shifts to watch mode or sub-active mode • When the SLEEP instruction is executed in sub-active mode, operation shifts to subsleep mode or watch mode • Operation shifts to sub-active mode when watch mode is cancelled Sampling using 1/32 × φ Sampling using 1/4 × φ
1
Note: * Always set high-speed mode when shifting to watch mode or sub-active mode. Direct Transition ON Flag 0 • When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts to sleep mode, software standby mode, or watch mode* • When the SLEEP instruction is executed in sub-active mode, operation shifts to sub-sleep mode or watch mode
• When the SLEEP instruction is executed in high-speed mode or medium-speed mode, operation shifts directly to sub-active mode*, or shifts to sleep mode or software standby mode • When the SLEEP instruction is executed in sub-active mode, operation shifts directly to high-speed mode, or shifts to sub-sleep mode Note: * Always set high-speed mode when shifting to watch mode or sub-active mode. 1 Note: 1. Bits 7 to 3 in LPWRCR are valid in the U-mask and W-mask versions, and H8S/2635 Group; they are reserved bits in all other versions. See sections 23A.2.3, 23B.2.3, Low-Power Control Register (LPWRCR), for more information.
Page 1318 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
BARA—Break Address Register A BARB—Break Address Register B
Bit 31 ⎯ ... ... 24 ⎯ 23 22 21 20 19 18 17
H'FE00 H'FE04
16 ... 7 6 5 4 3 2 1
PBC PBC
0
BAA BAA BAA BAA BAA BAA BAA BAA . . . BAA BAA BAA BAA BAA BAA BAA BAA 7 6 5 4 3 2 1 0 23 22 21 20 19 18 17 16
Read/Write
Initial value Unde- . . . Unde- 0 ... 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 fined fined ⎯ . . . ⎯ R/W R/W R/W R/W R/W R/W R/W R/W . . . R/W R/W R/W R/W R/W R/W R/W R/W
Break Address 23 to 0 Specify the channel A or B break address
Notes: 1. The bit configuration of BARB is the same as for BARA. 2. These registers are not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
BCRA—Break Control Register A BCRB—Break Control Register B
Bit Initial value Read/Write 7 CMFA 0 R/(W)* 6 CDA 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W
H'FE08 H'FE09
2 0 R/W 1 0 R/W 0 BIEA 0 R/W
PBC PBC
BAMRA2 BAMRA1 BAMRA0 CSELA1 CSELA0
Break Interrupt Enable 0 PC break interrupts are disabled 1 PC break interrupts are enabled Break Condition Select 0 1 0 Instruction fetch is used as break condition 1 Data read cycle is used as break condition 0 Data write cycle is used as break condition 1 Data read/write cycle is used as break condition Break Address Mask Register 0 0 1 1 0 1 0 All BARA bits are unmasked and included in break conditions 1 BAA0 (lowest bit) is masked, and not included in break conditions 0 BAA1, BAA0 (lower 2 bits) are masked, and not included in break conditions 1 BAA2 to BAA0 (lower 3 bits) are masked, and not included in break conditions 0 BAA3 to BAA0 (lower 4 bits) are masked, and not included in break conditions 1 BAA7 to BAA0 (lower 8 bits) are masked, and not included in break conditions 0 BAA11 to BAA0 (lower 12 bits) are masked, and not included in break conditions 1 BAA15 to BAA0 (lower 16 bits) are masked, and not included in break conditions CPU Cycle/DTC Cycle Select A 0 PC break is performed when CPU is bus master 1 PC break is performed when CPU or DTC is bus master Condition Match Flag A 0 [Clearing condition] • When 0 is written to CMFA after reading CMFA = 1 1 [Setting condition] • When a condition set for channel A is satisfied
Notes: 1. The bit configuration of BCRB is the same as for BCRA. 2. These registers are not available in the H8S/2635 Group. * Only a 0 may be written to this bit to clear the flag.
Page 1320 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
ISCRH—IRQ Sence Control Register H ISCRL—IRQ Sence Control Register L
ISCRH Bit Initial value Read/Write 15 ⎯ 0 R/W 14 ⎯ 0 R/W 13 ⎯ 0 R/W 12 ⎯ 0 R/W
H'FE12 H'FE13
Interrupt Controller Interrupt Controller
11 0 R/W
10 0 R/W
9 0 R/W
8 0 R/W
IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
ISCRL Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
IRQ5 to IRQ0 sense control A and B
IRQ5SCB to IRQ0SCB 0
IRQ5SCA to IRQ0SCA 0 1
Description Interrupt request generated at IRQ5 to IRQ0 input at low level Interrupt request generated at falling edge of IRQ5 to IRQ0 input Interrupt request generated at rising edge of IRQ5 to IRQ0 input Interrupt request generated at both falling and rising edges of IRQ5 to IRQ0 input
1
0 1
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
IER—IRQ Enable Register
Bit Initial value Read/Write 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W
H'FE14
3 IRQ3E 0 R/W 2 IRQ2E 0 R/W
Interrupt Controller
1 IRQ1E 0 R/W 0 IRQ0E 0 R/W
IRQ5 to IRQ0 Enable 0 1 IRQn interrupts disabled IRQn interrupts enabled (n = 5 to 0)
ISR—IRQ Status Register
Bit Initial value Read/Write 7 ⎯ 0 R/(W)* 6 ⎯ 0 R/(W)* 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)*
H'FE15
3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)*
Interrupt Controller
1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)*
IRQ5 to IRQ0 Flags 0 [Clearing conditions] • Cleared by reading IRQnF when set to 1, then writing 0 in IRQnF • When interrupt exception handling is executed while low-level detection is set (IRQnSCB = IRQnSCA = 0) and IRQn input is high • When IRQn interrupt exception handling is executed while falling, rising, or both-edge detection is set (IRQnSCB = 1 or IRQnSCA = 1) • When the DTC is activated by an IRQn interrupt, and the DISEL bit in MRB of the DTC is cleared to 0 [Setting conditions] • When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA = 0) • When a falling edge occurs in IRQn input while falling edge detection is set (IRQnSCB = 0, IRQnSCA = 1) • When a rising edge occurs in IRQn input while rising edge detection is set (IRQnSCB = 1, IRQnSCA = 0) • When a falling or rising edge occurs in IRQn input while both-edge detection is set (IRQnSCB = IRQnSCA = 1) (n = 5 to 0) Note: * Only 0 can be written, to clear the flag.
1
Page 1322 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
DTCERA—DTC Enable Register A DTCERB—DTC Enable Register B DTCERC—DTC Enable Register C DTCERD—DTC Enable Register D DTCERE—DTC Enable Register E DTCERF—DTC Enable Register F DTCERG—DTC Enable Register G
H'FE16 H'FE17 H'FE18 H'FE19 H'FE1A H'FE1B H'FE1C
DTC DTC DTC DTC DTC DTC DTC
Note: These registers are not available in the H8S/2635 Group.
Bit Initial value Read/Write 7 DTCE7 0 R/W 6 DTCE6 0 R/W 5 DTCE5 0 R/W 4 DTCE4 0 R/W 3 DTCE3 0 R/W 2 DTCE2 0 R/W 1 DTCE1 0 R/W 0 DTCE0 0 R/W
DTC Activation Enable 0 DTC activation by interrupt is disabled [Clearing conditions] • When data transfer ends with the DISEL bit set to 1 • When the specified number of transfers end DTC activation by interrupt is enabled [Holding condition] • When the DISEL bit is 0 and the specified number of transfers have not ended
1
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
DTVECR—DTC Vector Register
Bit Initial value Read/Write 7 0 R/(W)*1 6 0 R/W*2 5 0 R/W*2 4 0
H'FE1F
3 0 R/W*2 2 0 R/W*2 1 0 R/W*2 0 0
DTC
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0 R/W*2 R/W*2
Set vector number for DTC software activation DTC Software Activation Enable 0 DTC software activation is disabled [Clearing conditions] • When the DISEL bit is 0 and the specified number of transfers have not ended • When 0 is written to DISEL bit after a software-activated data transfer end interrupt (SWDTEND) request has been sent to the CPU. DTC software activation is enabled [Holding conditions] • When data transfer ends with the DISEL bit set to 1 • When the specified number of transfers end • During software-activated deta transfer
1
Notes: This register is not available in the H8S/2635 Group. 1. Only 1 can be written to the SWDTE bit. 2. Bits DTVEC6 to DTVEC0 can be written to when SWDTE = 0.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PCR—PPG Output Control Register
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1
H'FE26
3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W
PPG
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 R/W
Group 0 Compare Match Select 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Group 1 Compare Match Select 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Group 2 Compare Match Select 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3 Group 3 Compare Match Select 0 1 0 Compare match in TPU channel 0 1 Compare match in TPU channel 1 0 Compare match in TPU channel 2 1 Compare match in TPU channel 3
Note: This register is not available in the H8S/2635 Group.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PMR—PPG Output Mode Register
Bit Initial value Read/Write 7 G3INV 1 R/W 6 G2INV 1 R/W 5 G1INV 1 R/W 4
H'FE27
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
PPG
G0INV 1 R/W
G3NOV G2NOV
G1NOV G0NOV
Group 0 Non-Overlap 0 Normal operation in pulse output group 0 (output values updated at compare match A in the selected TPU channel) Non-overlapping operation in pulse output group 0 (independent 1 and 0 output at compare match A or B in the selected TPU channel)
1
Group 1 Non-Overlap 0 Normal operation in pulse output group 1 (output values updated at compare match A in the selected TPU channel) Non-overlapping operation in pulse output group 1 (independent 1 and 0 output at compare match A or B in the selected TPU channel)
1
Group 2 Non-Overlap 0 Normal operation in pulse output group 2 (output values updated at compare match A in the selected TPU channel) Non-overlapping operation in pulse output group 2 (independent 1 and 0 output at compare match A or B in the selected TPU channel)
1
Group 3 Non-Overlap 0 Normal operation in pulse output group 3 (output values updated at compare match A in the selected TPU channel) Non-overlapping operation in pulse output group 3 (independent 1 and 0 output at compare match A or B in the selected TPU channel)
1
Group 0 Inversion 0 1 Inverted output for pulse output group 0 (low-level output at pin for a 1 in PODRL) Direct output for pulse output group 0 (high-level output at pin for a 1 in PODRL)
Group 1 Inversion 0 1 Inverted output for pulse output group 1 (low-level output at pin for a 1 in PODRL) Direct output for pulse output group 1 (high-level output at pin for a 1 in PODRL)
Group 2 Inversion 0 1 Inverted output for pulse output group 2 (low-level output at pin for a 1 in PODRH) Direct output for pulse output group 2 (high-level output at pin for a 1 in PODRH)
Group 3 Inversion 0 1 Inverted output for pulse output group 3 (low-level output at pin for a 1 in PODRH) Direct output for pulse output group 3 (high-level output at pin for a 1 in PODRH)
Note: This register is not available in the H8S/2635 Group.
Page 1326 of 1458 REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
NDERH—Next Data Enable Register H
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE28
3 0 R/W 2 0 R/W 1 0 R/W 0 NDER8 0 R/W
PPG
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9
Next Data Enable 0 1 Pulse outputs PO15 to PO8 are disabled (NDR15 to NDR8 are not transferred to POD15 to POD8) Pulse outputs PO15 to PO8 are enabled (NDR15 to NDR8 are transferred to POD15 to POD8)
Note: This register is not available in the H8S/2635 Group.
NDERL—Next Data Enable Register L
Bit Initial value Read/Write 7 NDER7 0 R/W 6 NDER6 0 R/W 5 NDER5 0 R/W 4 NDER4 0 R/W
H'FE29
3 NDER3 0 R/W 2 NDER2 0 R/W 1 NDER1 0 R/W 0 NDER0 0 R/W
PPG
Next Data Enable 0 1 Pulse outputs PO7 to PO0 are disabled (NDR7 to NDR0 are not transferred to POD7 to POD0 Pulse outputs PO7 to PO0 are enabled (NDR7 to NDR0 are transferred to POD7 to POD0)
Note: This register is not available in the H8S/2635 Group.
PODRH—Output Data Register H
Bit Initial value Read/Write 7 POD15 0 R/(W)* 6 POD14 0 R/(W)* 5 POD13 0 R/(W)* 4 POD12 0 R/(W)*
H'FE2A
3 POD11 0 R/(W)* 2 POD10 0 R/(W)* 1 POD9 0 R/(W)* 0 POD8 0 R/(W)*
PPG
Notes: This register is not available in the H8S/2635 Group. * A bit that has been set for pulse output by NDER is read-only.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PODRL—Output Data Register L
Bit Initial value Read/Write 7 POD7 0 R/(W)* 6 POD6 0 R/(W)* 5 POD5 0 R/(W)* 4 POD4 0 R/(W)*
H'FE2B
3 POD3 0 R/(W)* 2 POD2 0 R/(W)* 1 POD1 0 R/(W)* 0 POD0 0 R/(W)*
PPG
Notes: This register is not available in the H8S/2635 Group. * A bit that has been set for pulse output by NDER is read-only.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
NDRH—Next Data Register H
Same Trigger for Pulse Output Groups Address H'FE2C Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4
H'FE2C, H'FE2E
PPG
3 NDR11 0 R/W
2 NDR10 0 R/W
1 NDR9 0 R/W
0 NDR8 0 R/W
NDR12 0 R/W
Address H'FE2E Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ 3 ⎯ 1 ⎯ 2 ⎯ 1 ⎯ 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
Different Triggers for Pulse Output Groups Address H'FE2C Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 ⎯ 1 ⎯ 2 ⎯ 1 ⎯ 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
Address H'FE2E Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W
Notes: 1. For details, see section 11.2.4, Notes on NDR Access. 2. This register is not available in the H8S/2635 Group.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1329 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
NDRL—Next Data Register L
Same Trigger for Pulse Output Groups Address H'FE2D Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4
H'FE2D, H'FE2F
PPG
3 NDR3 0 R/W
2 NDR2 0 R/W
1 NDR1 0 R/W
0 NDR0 0 R/W
NDR4 0 R/W
Address H'FE2F Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ 3 ⎯ 1 ⎯ 2 ⎯ 1 ⎯ 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
Different Triggers for Pulse Output Groups Address H'FE2D Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 ⎯ 1 ⎯ 2 ⎯ 1 ⎯ 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
Address H'FE2F Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W
Notes: 1. For details, see section 11.2.4, Notes on NDR Access. 2. This register is not available in the H8S/2635 Group.
Page 1330 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
P1DDR—Port 1 Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FE30
3 0 W 2 0 W 1 0 W 0 0 W
Port
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Specify input or output for each of the pins in port 1
P3DDR—Port 3 Data Direction Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 0 W 4 0 W
H'FE32
3 0 W 2 0 W 1 0 W 0 0 W
Port
P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
Undefined Undefined
Specify input or output for each of the pins in port 3
PADDR—Port A Data Direction Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FE39
3 0 W 2 0 W 1 0 W 0 0 W
Port
PA3DDR PA2DDR PA1DDR PA0DDR
Undefined Undefined Undefined Undefined
Specify input or output for each of the pins in port A
PBDDR—Port B Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FE3A
3 0 W 2 0 W 1 0 W 0 0 W
Port
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
Specify input or output for each of the pins in port B
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1331 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PCDDR—Port C Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FE3B
3 0 W 2 0 W 1 0 W 0 0 W
Port
PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR
Specify input or output for each of the pins in port C
PDDDR—Port D Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FE3C
3 0 W 2 0 W 1 0 W 0 0 W
Port
PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR
Specify input or output for each of the pins in port D
PEDDR—Port E Data Direction Register
Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W
H'FE3D
3 0 W 2 0 W 1 0 W 0 0 W
Port
PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR
Specify input or output for each of the pins in port E
Page 1332 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PFDDR—Port F Data Direction Register
Bit Modes 4, 5, 6 Initial value Read/Write Mode 7 Initial value Read/Write 0 W 0 W 0 W 0 W 1 W 0 W 0 W 0 W 7 6 5 4
H'FE3E
3 2 ⎯ 1 ⎯ 0
Port
PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR 0 W 0 W
PF0DDR 0 W 0 W
Undefined Undefined ⎯ ⎯
Undefined Undefined ⎯ ⎯
Specify input or output for each of the pins in port F
PAPCR—Port A MOS Pull-Up Control Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FE40
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PA3PCR PA2PCR PA1PCR PA0PCR
Undefined Undefined Undefined Undefined
Control the MOS input pull-up function incorporated into port A
PBPCR—Port B MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE41
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
Control the MOS input pull-up function incorporated into port B
PCPCR—Port C MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE42
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
Control the MOS input pull-up function incorporated into port C
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 1333 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PDPCR—Port D MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE43
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
Control the MOS input pull-up function incorporated into port D
PEPCR—Port E MOS Pull-Up Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE44
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
Control the MOS input pull-up function incorporated into port E
P3ODR—Port 3 Open Drain Control Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 0 R/W 4 0 R/W
H'FE46
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR
Undefined Undefined
PAODR—Port A Open Drain Control Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FE47
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PA3ODR PA2ODR PA1ODR PA0ODR
Undefined Undefined Undefined Undefined
Page 1334 of 1458
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
PBODR—Port B Open Drain Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE48
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PB7ODR PB6ODR PB5ODR PB4ODR PB3ODR PB2ODR PB1ODR PB0ODR
PCODR—Port C Open Drain Control Register
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FE49
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
Port
PC7ODR PC6ODR PC5ODR PC4ODR PC3ODR PC2ODR PC1ODR PC0ODR
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCR3—Timer Control Register 3
Bit Initial value Read/Write 7 CCLR2 0 R/W 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FE80
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0 TPSC0 0 R/W
TPU3
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 Internal clock: counts on φ/1024 0 Internal clock: counts on φ/256 1 Internal clock: counts on φ/4096 Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 ⎯ Count at both edges Note: Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 1 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRC compare match/input capture*2 0 TCNT cleared by TGRD compare match/input capture*2 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. 2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has priority, and compare match/input capture does not occur.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TMDR3—Timer Mode Register 3
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 BFB 0 R/W 4 BFA 0 R/W
H'FE81
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU3
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Notes: 1. MD3 is a reserved bit. In a write, it should always be written with 0. 2. Phase counting mode cannot be set for channel 3. In this case, 0 should always be written to MD2. Buffer Operation A 0 1 TGRA operates normally TGRA and TGRC used together for buffer operation
Buffer Operation 0 1 TGRB operates normally TGRB and TGRD used together for buffer operation
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1337 of 1458
Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIOR3H—Timer I/O Control Register 3H
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FE82
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU3
IOA0 0 R/W
TGR3A I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR3A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR3A is 1 input capture * register * Capture input source is TIOCA3 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT4 count-up/ source is channel count-down 4/count clock *: Don't care
TGR3B I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR3B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR3B is 1 input capture * register * Capture input source is TIOCB3 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT4 count-up/ source is channel count-down*1 4/count clock *: Don't care
Note: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and φ/1 is used as the TCNT4 count clock, this setting is invalid and input capture is not generated.
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Appendix B Internal I/O Register
TIOR3L—Timer I/O Control Register 3L
Bit Initial value Read/Write 7 IOD3 0 R/W 6 IOD2 0 R/W 5 IOD1 0 R/W 4 IOD0 0 R/W
H'FE83
3 IOC3 0 R/W 2 IOC2 0 R/W 1 IOC1 0 R/W 0 IOC0 0 R/W
TPU3
TGR3C I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR3C is Output disabled 1 output Initial output is 0 compare 0 register*1 output 1 0 1 0 1 0 TGR3C is 1 input capture * register*1 * Capture input source is TIOCC3 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT4 count-up/ source is channel count-down 4/count clock *: Don't care
Note: 1. When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer register, this setting is invalid and input capture/output compare is not generated. TGR3D I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR3D is Output disabled 1 output Initial output is 0 compare 0 register*2 output 1 0 1 0 1 0 TGR3D is 1 input capture * register*2 * Capture input source is TIOCD3 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT4 count-up/ source is channel count-down*1 4/count clock *: Don't care
Notes: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and φ/1 is used as the TCNT4 count clock, this setting is invalid and input capture is not generated. 2. When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIER3—Timer Interrupt Enable Register 3
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 TCIEV 0 R/W
H'FE84
3 TGIED 0 R/W 2 TGIEC 0 R/W 1 TGIEB 0 R/W 0
TPU3
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
TGR Interrupt Enable C 0 1 Interrupt requests (TGIC) by TGFC bit disabled Interrupt requests (TGIC) by TGFC bit enabled
TGR Interrupt Enable D 0 1 Interrupt requests (TGID) by TGFD bit disabled Interrupt requests (TGID) by TGFD bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TSR3—Timer Status Register 3
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 TCFV 0 R/(W)*
H'FE85
3 TGFD 0 R/(W)* 2 TGFC 0 R/(W)* 1 TGFB 0 R/(W)* 0 TGFA 0 R/(W)*
TPU3
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Input Capture/Output Compare Flag C 0 [Clearing conditions] • When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFC after reading TGFC = 1 [Setting conditions] • When TCNT = TGRC while TGRC is functioning as output compare register • When TCNT value is transferred to TGRC by input capture signal while TGRC is functioning as input capture register
1
Input Capture/Output Compare Flag D 0 [Clearing conditions] • When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFD after reading TGFD = 1 [Setting conditions] • When TCNT = TGRD while TGRD is functioning as output compare register • When TCNT value is transferred to TGRD by input capture signal while TGRD is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Note: * Can only be written with 0 for flag clearing.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCNT3—Timer Counter 3
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FE86
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU3
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Up-counter
TGR3A—Timer General Register 3A TGR3B—Timer General Register 3B TGR3C—Timer General Register 3C TGR3D—Timer General Register 3D
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FE88 H'FE8A H'FE8C H'FE8E
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU3 TPU3 TPU3 TPU3
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TCR4—Timer Control Register 4
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FE90
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0
TPU4
TPSC0 0 R/W
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on φ/1024 1 Counts on TCNT5 overflow/underflow Note: This setting is ignored when channel 4 is in phase counting mode. Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 ⎯ Count at both edges Note: This setting is ignored when channel 4 is in phase counting mode. Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TMDR4—Timer Mode Register 4
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯
H'FE91
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU4
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Note: MD3 is a reserved bit. In a write, it should always be written with 0.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TIOR4—Timer I/O Control Register 4
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FE92
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU4
IOA0 0 R/W
TGR4A I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR4A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR4A is 1 input capture * register * Capture input source is TIOCA4 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at generation of TGR3A source is TGR3A compare match/input capture compare match/ input capture *: Don't care
TGR4B I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR4B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR4B is 1 input capture * register * Capture input source is TIOCB4 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at generation of TGR3C source is TGR3C compare match/input capture compare match/ input capture *: Don't care
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIER4—Timer Interrupt Enable Register 4
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 TCIEU 0 R/W 4 TCIEV 0 R/W
H'FE94
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGIEB 0 R/W 0
TPU4
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
Underflow Interrupt Enable 0 1 Interrupt requests (TCIU) by TCFU disabled Interrupt requests (TCIU) by TCFU enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TSR4—Timer Status Register 4
Bit Initial value Read/Write 7 TCFD 1 R 6 ⎯ 1 ⎯ 5 TCFU 0 R/(W)* 4 TCFV 0 R/(W)*
H'FE95
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGFB 0 R/(W)* 0
TPU4
TGFA 0 R/(W)*
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Underflow Flag 0 1 [Clearing condition] • When 0 is written to TCFU after reading TCFU = 1 [Setting condition] • When the TCNT value underflows (changes from H'0000 to H'FFFF)
Count Direction Flag 0 1 TCNT counts down TCNT counts up
Note: * Can only be written with 0 for flag clearing.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCNT4—Timer Counter 4
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FE96
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU4
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * These counters can be used as up/down-counters only in phase counting mode or when counting overflow/underflow on another channel. In other cases they function as up-counters.
TGR4A—Timer General Register 4A TGR4B—Timer General Register 4B
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FE98 H'FE9A
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU4 TPU4
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TCR5—Timer Control Register 5
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FEA0
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0
TPU5
TPSC0 0 R/W
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKC pin input 0 Internal clock: counts on φ/256 1 External clock: counts on TCLKD pin input Note: This setting is ignored when channel 5 is in phase counting mode. Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 — Count at both edges Note: This setting is ignored when channel 5 is in phase counting mode. Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TMDR5—Timer Mode Register 5
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FEA1
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU5
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Note: MD3 is a reserved bit. In a write, it should always be written with 0.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TIOR5—Timer I/O Control Register 5
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FEA2
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU5
IOA0 0 R/W
TGR5A I/O Control 0 0 0 1 1 0 1 1 * 0 1 0 TGR5A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR5A is Capture input source is 1 input capture TIOCA5 pin * register Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care TGR5B I/O Control 0 0 0 1 1 0 1 1 * 0 1 0 TGR5B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR5B is Capture input source is 1 input capture TIOCB5 pin * register Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care 0 output at compare match 1 output at compare match Toggle output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIER5—Timer Interrupt Enable Register 5
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 TCIEU 0 R/W 4 TCIEV 0 R/W
H'FEA4
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGIEB 0 R/W 0
TPU5
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
Underflow Interrupt Enable 0 1 Interrupt requests (TCIU) by TCFU disabled Interrupt requests (TCIU) by TCFU enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
Page 1352 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TSR5—Timer Status Register 5
Bit Initial value Read/Write 7 TCFD 1 R 6 ⎯ 1 ⎯ 5 TCFU 0 R/(W)* 4 TCFV 0 R/(W)*
H'FEA5
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGFB 0 R/(W)* 0
TPU5
TGFA 0 R/(W)*
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Underflow Flag 0 1 [Clearing condition] • When 0 is written to TCFU after reading TCFU = 1 [Setting condition] • When the TCNT value underflows (changes from H'0000 to H'FFFF)
Count Direction Flag 0 1 TCNT counts down TCNT counts up
Note: * Can only be written with 0 for flag clearing.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCNT5—Timer Counter 5
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FEA6
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU5
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * These counters can be used as up/down-counters only in phase counting mode or when counting overflow/underflow on another channel. In other cases they function as up-counters.
TGR5A—Timer General Register 5A TGR5B—Timer General Register 5B
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FEA8 H'FEAA
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU5 TPU5
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TSTR—Timer Start Register
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 ⎯ 0 ⎯ 5 CST5 0 R/W 4 CST4 0 R/W
H'FEB0
3 CST3 0 R/W 2 CST2 0 R/W 1 CST1 0 R/W 0
TPU
CST0 0 R/W
Counter Start 0 1 TCNTn count operation is stopped TCNTn performs count operation (n = 5 to 0) Note: If 0 is written to the CST bit during operation with the TIOC pin designated for output, the counter stops but the TIOC pin output compare output level is retained. If TIOR is written to when the CST bit is cleared to 0, the pin output level will be changed to the set initial output value.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TSYR—Timer Synchro Register
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 ⎯ 0 ⎯ 5 SYNC5 0 R/W 4 SYNC4 0 R/W
H'FEB1
3 SYNC3 0 R/W 2 SYNC2 0 R/W 1 SYNC1 0 R/W 0
TPU
SYNC0 0 R/W
Timer Synchro 0 1 TCNTn operates independently (TCNT presetting/ clearing is unrelated to other channels) TCNTn performs synchronous operation TCNT synchronous presetting/synchronous clearing is possible (n = 5 to 0) Notes: 1. To set synchronous operation, the SYNC bits for at least two channels must be set to 1. 2. To set synchronous clearing, in addition to the SYNC bit , the TCNT clearing source must also be set by means of bits CCLR2 to CCLR0 in TCR.
REJ09B0103-0800 Rev. 8.00 May 28, 2010
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
IPRA—Interrupt Priority Register A IPRB—Interrupt Priority Register B IPRC—Interrupt Priority Register C IPRD—Interrupt Priority Register D IPRE—Interrupt Priority Register E IPRF—Interrupt Priority Register F IPRG—Interrupt Priority Register G IPRH—Interrupt Priority Register H IPRJ—Interrupt Priority Register J IPRK—Interrupt Priority Register K IPRL—Interrupt Priority Register L IPRM—Interrupt Priority Register M
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 IPR6 1 R/W 5 IPR5 1 R/W 4 IPR4 1 R/W
H'FEC0 H'FEC1 H'FEC2 H'FEC3 H'FEC4 H'FEC5 H'FEC6 H'FEC7 H'FEC9 H'FECA H'FECB H'FECC
3 ⎯ 0 ⎯ 2 IPR2 1 R/W 1 IPR1 1 R/W 0 IPR0 1 R/W
INT INT INT INT INT INT INT INT INT INT INT INT
Correspondence between Interrupt Sources and IPR Settings Register 6 to 4 IPRA IPRB IPRC IPRD IPRE IPRF IPRG IPRH IPRJ IPRK IPRL IPRM IRQ0 IRQ2 IRQ3 ⎯*1 Watchdog timer 0 PC break*3 TPU channel 0 TPU channel 2 TPU channel 4 ⎯*1 SCI channel 1 ⎯*1 PWM channel 1, 2, HCAN channel 1*3 Notes: 1. Reserved. Read-only bits, always read as 1. 2. I2C bus interface is available as an option in the H8S/2638, H8S/2639, H8S/2630. The IIC bit becomes reserved bit when this optional feature is not used. 3. The DTC, PC break, and HCAN1 are not implemented in the H8S/2635 Group.
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Bits 2 to 0 IRQ1 IRQ4 IRQ5 DTC*3 ⎯*1 A/D converter, watchdog timer 1 TPU channel 1 TPU channel 3 TPU channel 5 SCI channel 0 SCI channel 2 IIC (Option)*2 HCAN channel 0
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
ABWCR—Bus Width Control Register
Bit Modes 5 to 7 Initial value Read/Write Mode 4 Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 1 R/W 1 R/W 1 R/W 1 R/W 7 ABW7 6 ABW6 5 ABW5 4 ABW4
H'FED0
3 ABW3 1 R/W 0 R/W 2 ABW2 1 R/W 0 R/W 1
Bus Controller
0 ABW0 1 R/W 0 R/W
ABW1 1 R/W 0 R/W
Area 7 to 0 Bus Width Control 0 1 Area n is designated for 16-bit access Area n is designated for 8-bit access (n = 7 to 0)
ASTCR—Access State Control Register
Bit Initial value Read/Write 7 AST7 1 R/W 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W
H'FED1
3 AST3 1 R/W 2 AST2 1 R/W 1
Bus Controller
0 AST0 1 R/W
AST1 1 R/W
Area 7 to 0 Access State Control 0 1 Area n is designated for 2-state access Wait state insertion in area n external space is disabled Area n is designated for 3-state access Wait state insertion in area n external space is enabled (n = 7 to 0)
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
WCRH—Wait Control Register H
Bit Initial value Read/Write 7 W71 1 R/W 6 W70 1 R/W 5 W61 1 R/W 4 W60 1 R/W
H'FED2
3 W51 1 R/W 2 W50 1 R/W 1 W41 1 R/W
Bus Controller
0 W40 1 R/W
Area 4 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 4 is accessed 1 1 program wait state inserted when external space area 4 is accessed 1 0 2 program wait states inserted when external space area 4 is accessed 1 3 program wait states inserted when external space area 4 is accessed Area 5 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 5 is accessed 1 1 program wait state inserted when external space area 5 is accessed 1 0 2 program wait states inserted when external space area 5 is accessed 1 3 program wait states inserted when external space area 5 is accessed
Area 6 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 6 is accessed 1 1 program wait state inserted when external space area 6 is accessed 1 0 2 program wait states inserted when external space area 6 is accessed 1 3 program wait states inserted when external space area 6 is accessed Area 7 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 7 is accessed 1 1 program wait state inserted when external space area 7 is accessed 1 0 2 program wait states inserted when external space area 7 is accessed 1 3 program wait states inserted when external space area 7 is accessed
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Appendix B Internal I/O Register
WCRL—Wait Control Register L
Bit Initial value Read/Write 7 W31 1 R/W 6 W30 1 R/W 5 W21 1 R/W 4 W20 1 R/W
H'FED3
3 W11 1 R/W 2 W10 1 R/W 1 W01 1 R/W
Bus Controller
0 W00 1 R/W
Area 0 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 0 is accessed 1 1 program wait state inserted when external space area 0 is accessed 1 0 2 program wait states inserted when external space area 0 is accessed 1 3 program wait states inserted when external space area 0 is accessed Area 1 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 1 is accessed 1 1 program wait state inserted when external space area 1 is accessed 1 0 2 program wait states inserted when external space area 1 is accessed 1 3 program wait states inserted when external space area 1 is accessed
Area 2 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 2 is accessed 1 1 program wait state inserted when external space area 2 is accessed 1 0 2 program wait states inserted when external space area 2 is accessed 1 3 program wait states inserted when external space area 2 is accessed Area 3 Wait Control 1 and 0 0 0 Program wait not inserted when external space area 3 is accessed 1 1 program wait state inserted when external space area 3 is accessed 1 0 2 program wait states inserted when external space area 3 is accessed 1 3 program wait states inserted when external space area 3 is accessed
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
BCRH—Bus Control Register H
Bit Initial value Read/Write 7 ICIS1 1 R/W 6 ICIS0 1 R/W 5 0 R/W 4 1 R/W
H'FED4
3 0 R/W 2 ⎯ 0 R/W 1 ⎯ 0
Bus Controller
0 ⎯ 0 R/W
BRSTRM BRSTS1 BRSTS0
R/W
Burst Cycle Select 0 0 1 Max. 4 words in burst access Max. 8 words in burst access
Burst Cycle Select 1 0 1 Burst cycle comprises 1 state Burst cycle comprises 2 states
Burst ROM Enable 0 1 Area 0 is basic bus interface Area 0 is burst ROM interface
Idle Cycle Insert 0 0 1 Idle cycle not inserted in case of successive external read and external write cycles Idle cycle inserted in case of successive external read and external write cycles
Idle Cycle Insert 1 0 1 Idle cycle not inserted in case of successive external read cycles in different areas Idle cycle inserted in case of successive external read cycles in different areas
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Appendix B Internal I/O Register
BCRL—Bus Control Register L
Bit Initial value Read/Write 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 ⎯ 0 ⎯ 4 ⎯ 0 R/W
H'FED5
3 ⎯ 1 R/W 2 ⎯ 0 R/W 1
Bus Controller
0 ⎯ 0 R/W
WDBE 0 R/W
Write Data Buffer Enable 0 1 Write data buffer function not used Write data buffer function used
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
RAMER—RAM Emulation Register
Bit Initial value Read/Write 7 ⎯ 0 R 6 ⎯ 0 R 5 ⎯ 0 R/W 4 ⎯ 0 R/W
H'FEDB
3 RAMS 0 R/W 2 RAM2 0 R/W 1 RAM1 0 R/W
Flash Memory
0 RAM0 0 R/W
Flash Memory Area Selection • H8S/2636 Addresses H'FFE000−H'FFE3FF H'000000−H'0003FF H'000400−H'0007FF H'000800−H'000BFF H'000C00−H'000FFF RAMS RAM2 RAM1 RAM0 Block Name * 0 * * RAM area 1 kB 0 1 0 EB0 (1 kB) 1 EB1 (1 kB) 1 0 EB2 (1 kB) 1 EB3 (1 kB) *: Don't care • H8S/2638, H8S/2639, H8S/2630 Addresses H'FFD000−H'FFDFFF H'000000−H'000FFF H'001000−H'001FFF H'002000−H'002FFF H'003000−H'003FFF H'004000−H'004FFF H'005000−H'005FFF H'006000−H'006FFF H'007000−H'007FFF • H8S/2635 Addresses H'FFD800−H'FFE7FF H'000000−H'000FFF H'001000−H'001FFF H'002000−H'002FFF H'003000−H'003FFF H'004000−H'004FFF H'005000−H'005FFF H'006000−H'006FFF H'007000−H'007FFF RAM Select 0 1 Emulation not selected Program/erase-protection of all flash memory blocks is disabled Emulation selected Program/erase-protection of all flash memory blocks is enabled Block Name RAM area 4 kB EB0 (4 kB) EB1 (4 kB) EB2 (4 kB) EB3 (4 kB) EB4 (4 kB) EB5 (4 kB) EB6 (4 kB) EB7 (4 kB) RAMS RAM2 RAM1 RAM0 0 * * * 1 0 0 0 1 1 0 1 1 0 0 1 1 0 1 *: Don't care Block Name RAM area 4 kB EB0 (4 kB) EB1 (4 kB) EB2 (4 kB) EB3 (4 kB) EB4 (4 kB) EB5 (4 kB) EB6 (4 kB) EB7 (4 kB) RAMS RAM2 RAM1 RAM0 0 * * * 1 0 0 0 1 1 0 1 1 0 0 1 1 0 1 *: Don't care
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Appendix B Internal I/O Register
P1DR—Port 1 Data Register
Bit Initial value Read/Write 7 P17DR 0 R/W 6 P16DR 0 R/W 5 P15DR 0 R/W 4 P14DR 0 R/W
H'FF00
3 P13DR 0 R/W 2 P12DR 0 R/W 1 P11DR 0 R/W 0
Port
P10DR 0 R/W
P3DR—Port 3 Data Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 P35DR 0 R/W 4 P34DR 0 R/W
H'FF02
3 P33DR 0 R/W 2 P32DR 0 R/W 1 P31DR 0 R/W 0
Port
P30DR 0 R/W
Undefined Undefined
PADR—Port A Data Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FF09
3 PA3DR 0 R/W 2 PA2DR 0 R/W 1 PA1DR 0 R/W 0
Port
PA0DR 0 R/W
Undefined Undefined Undefined Undefined
PBDR—Port B Data Register
Bit Initial value Read/Write 7 PB7DR 0 R/W 6 PB6DR 0 R/W 5 PB5DR 0 R/W 4 PB4DR 0 R/W
H'FF0A
3 PB3DR 0 R/W 2 PB2DR 0 R/W 1 PB1DR 0 R/W 0
Port
PB0DR 0 R/W
PCDR—Port C Data Register
Bit Initial value Read/Write 7 PC7DR 0 R/W 6 PC6DR 0 R/W 5 PC5DR 0 R/W 4 PC4DR 0 R/W
H'FF0B
3 PC3DR 0 R/W 2 PC2DR 0 R/W 1 PC1DR 0 R/W 0
Port
PC0DR 0 R/W
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PDDR—Port D Data Register
Bit Initial value Read/Write 7 PD7DR 0 R/W 6 PD6DR 0 R/W 5 PD5DR 0 R/W 4 PD4DR 0 R/W
H'FF0C
3 PD3DR 0 R/W 2 PD2DR 0 R/W 1 PD1DR 0 R/W 0
Port
PD0DR 0 R/W
PEDR—Port E Data Register
Bit Initial value Read/Write 7 PE7DR 0 R/W 6 PE6DR 0 R/W 5 PE5DR 0 R/W 4 PE4DR 0 R/W
H'FF0D
3 PE3DR 0 R/W 2 PE2DR 0 R/W 1 PE1DR 0 R/W 0
Port
PE0DR 0 R/W
PFDR—Port F Data Register
Bit Initial value Read/Write 7 PF7DR 0 R/W 6 PF6DR 0 R/W 5 PF5DR 0 R/W 4 PF4DR 0 R/W
H'FF0E
3 PF3DR 0 R/W 2 ⎯ ⎯ 1 ⎯ ⎯ 0
Port
PF0DR 0 R/W
Undefined Undefined
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Appendix B Internal I/O Register
TCR0—Timer Control Register 0
Bit Initial value Read/Write 7 CCLR2 0 R/W 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FF10
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0 TPSC0 0 R/W
TPU0
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 External clock: counts on TCLKD pin input Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 ⎯ Count at both edges Note: Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 1 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRC compare match/input capture*2 0 TCNT cleared by TGRD compare match/input capture*2 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation*1 Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1. 2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the buffer register setting has priority, and compare match/input capture does not occur.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TMDR0—Timer Mode Register 0
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 BFB 0 R/W 4 BFA 0 R/W
H'FF11
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU0
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Notes: 1. MD3 is a reserved bit. In a write, it should always be written with 0. 2. Phase counting mode cannot be set for channel 0. In this case, 0 should always be written to MD2. Buffer Operation A 0 1 TGRA operates normally TGRA and TGRC used together for buffer operation
Buffer Operation 0 1 TGRB operates normally TGRB and TGRD used together for buffer operation
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TIOR0H—Timer I/O Control Register 0H
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FF12
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU0
IOA0 0 R/W
TGR0A I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR0A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR0A is 1 input capture * register * Capture input source is TIOCA0 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT1 count-up/ source is channel count-down 1/count clock *: Don't care
TGR0B I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR0B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR0B is 1 input capture * register * Capture input source is TIOCB0 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT1 count-up/ source is channel count-down*1 1/count clock *: Don't care
Note: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and φ/1 is used as the TCNT1 count clock, this setting is invalid and input capture is not generated.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIOR0L—Timer I/O Control Register 0L
Bit Initial value Read/Write 7 IOD3 0 R/W 6 IOD2 0 R/W 5 IOD1 0 R/W 4 IOD0 0 R/W
H'FF13
3 IOC3 0 R/W 2 IOC2 0 R/W 1 IOC1 0 R/W 0 IOC0 0 R/W
TPU0
TGR0C I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR0C is Output disabled 1 output Initial output is 0 compare 0 register*1 output 1 0 1 0 1 0 TGR0C is 1 input capture * register*1 * Capture input source is TIOCC0 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT1 count-up/ source is channel count-down 1/count clock *: Don't care
Note: 1. When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer register, this setting is invalid and input capture/output compare is not generated. TGR0D I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR0D is Output disabled 1 output Initial output is 0 compare 0 register*2 output 1 0 1 0 1 0 TGR0D is 1 input capture * register*2 * Capture input source is TIOCD0 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at TCNT1 count-up/ source is channel count-down*1 1/count clock *: Don't care
Notes: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and φ/1 is used as the TCNT1 count clock, this setting is invalid and input capture is not generated. 2. When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer register, this setting is invalid and input capture/output compare is not generated. Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TIER0—Timer Interrupt Enable Register 0
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 TCIEV 0 R/W
H'FF14
3 TGIED 0 R/W 2 TGIEC 0 R/W 1 TGIEB 0 R/W 0
TPU0
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
TGR Interrupt Enable C 0 1 Interrupt requests (TGIC) by TGFC bit disabled Interrupt requests (TGIC) by TGFC bit enabled
TGR Interrupt Enable D 0 1 Interrupt requests (TGID) by TGFD bit disabled Interrupt requests (TGID) by TGFD bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TSR0—Timer Status Register 0
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 TCFV 0 R/(W)*
H'FF15
3 TGFD 0 R/(W)* 2 TGFC 0 R/(W)* 1 TGFB 0 R/(W)* 0 TGFA 0 R/(W)*
TPU0
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Input Capture/Output Compare Flag C 0 [Clearing conditions] • When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFC after reading TGFC = 1 [Setting conditions] • When TCNT = TGRC while TGRC is functioning as output compare register • When TCNT value is transferred to TGRC by input capture signal while TGRC is functioning as input capture register
1
Input Capture/Output Compare Flag D 0 [Clearing conditions] • When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFD after reading TGFD = 1 [Setting conditions] • When TCNT = TGRD while TGRD is functioning as output compare register • When TCNT value is transferred to TGRD by input capture signal while TGRD is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Note: * Can only be written with 0 for flag clearing.
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Appendix B Internal I/O Register
TCNT0—Timer Counter 0
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FF16
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU0
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Up-counter
TGR0A—Timer General Register 0A TGR0B—Timer General Register 0B TGR0C—Timer General Register 0C TGR0D—Timer General Register 0D
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FF18 H'FF1A H'FF1C H'FF1E
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU0 TPU0 TPU0 TPU0
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCR1—Timer Control Register 1
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FF20
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0
TPU1
TPSC0 0 R/W
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 Internal clock: counts on φ/256 1 Counts on TCNT2 overflow/underflow Note: This setting is ignored when channel 1 is in phase counting mode. Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 ⎯ Count at both edges Note: This setting is ignored when channel 1 is in phase counting mode. Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
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Appendix B Internal I/O Register
TMDR1—Timer Mode Register 1
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FF21
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU1
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Note: MD3 is a reserved bit. In a write, it should always be written with 0.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIOR1—Timer I/O Control Register 1
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FF22
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU1
IOA0 0 R/W
TGR1A I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR1A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR1A is 1 input capture * register * Capture input source is TIOCA1 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at generation of source is TGR0A channel 0/TGR0A compare match/ compare match/ input capture input capture *: Don't care
TGR1B I/O Control 0 0 0 1 1 0 1 1 0 0 1 1 * 0 TGR1B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR1B is 1 input capture * register * Capture input source is TIOCB1 pin Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges 0 output at compare match 1 output at compare match Toggle output at compare match
Capture input Input capture at generation of TGR0C source is TGR0C compare match/input capture compare match/ input capture *: Don't care
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
TIER1—Timer Interrupt Enable Register 1
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 TCIEU 0 R/W 4 TCIEV 0 R/W
H'FF24
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGIEB 0 R/W 0
TPU1
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
Underflow Interrupt Enable 0 1 Interrupt requests (TCIU) by TCFU disabled Interrupt requests (TCIU) by TCFU enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TSR1—Timer Status Register 1
Bit Initial value Read/Write 7 TCFD 1 R 6 ⎯ 1 ⎯ 5 TCFU 0 R/(W)* 4 TCFV 0 R/(W)*
H'FF25
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGFB 0 R/(W)* 0
TPU1
TGFA 0 R/(W)*
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Underflow Flag 0 1 [Clearing condition] • When 0 is written to TCFU after reading TCFU = 1 [Setting condition] • When the TCNT value underflows (changes from H'0000 to H'FFFF)
Count Direction Flag 0 1 TCNT counts down TCNT counts up
Note: * Can only be written with 0 for flag clearing.
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Appendix B Internal I/O Register
TCNT1—Timer Counter 1
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FF26
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU1
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * These counters can be used as up/down-counters only in phase counting mode or when counting overflow/underflow on another channel. In other cases they function as up-counters.
TGR1A—Timer General Register 1A TGR1B—Timer General Register 1B
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FF28 H'FF2A
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU1 TPU1
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCR2—Timer Control Register 2
Bit Initial value Read/Write 7 ⎯ 0 ⎯ 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W
H'FF30
3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0
TPU2
TPSC0 0 R/W
Time Prescaler 0 0 1 1 0 1 0 Internal clock: counts on φ/1 1 Internal clock: counts on φ/4 0 Internal clock: counts on φ/16 1 Internal clock: counts on φ/64 0 External clock: counts on TCLKA pin input 1 External clock: counts on TCLKB pin input 0 External clock: counts on TCLKC pin input 1 Internal clock: counts on φ/1024 Note: This setting is ignored when channel 2 is in phase counting mode. Clock Edge 0 0 Count at rising edge 1 Count at falling edge 1 ⎯ Count at both edges Note: This setting is ignored when channel 2 is in phase counting mode. Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is ignored if the input clock is φ/1, or when overflow/underflow of another channel is selected. Counter Clear 0 1 0 TCNT clearing disabled 1 TCNT cleared by TGRA compare match/input capture 0 TCNT cleared by TGRB compare match/input capture 1 TCNT cleared by counter clearing for another channel performing synchronous clearing/synchronous operation* Note: * Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
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Appendix B Internal I/O Register
TMDR2—Timer Mode Register 2
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FF31
3 MD3 0 R/W Mode 0 0 0 1 1 0 1 1 * * 0 1 0 1 0 1 0 1 * Normal operation Reserved PWM mode 1 PWM mode 2 2 MD2 0 R/W 1 MD1 0 R/W 0 MD0 0 R/W
TPU2
Phase counting mode 1 Phase counting mode 2 Phase counting mode 3 Phase counting mode 4 ⎯
*: Don't care Note: MD3 is a reserved bit. In a write, it should always be written with 0.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TIOR2—Timer I/O Control Register 2
Bit Initial value Read/Write 7 IOB3 0 R/W 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W
H'FF32
3 IOA3 0 R/W 2 IOA2 0 R/W 1 IOA1 0 R/W 0
TPU2
IOA0 0 R/W
TGR2A I/O Control 0 0 0 1 1 0 1 1 * 0 1 0 TGR2A is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR2A is Capture input source is 1 input capture TIOCA2 pin * register Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care TGR2B I/O Control 0 0 0 1 1 0 1 1 * 0 1 0 TGR2B is Output disabled 1 output Initial output is 0 compare output 0 register 1 0 1 0 1 0 TGR2B is Capture input source is 1 input capture TIOCB2 pin * register Output disabled Initial output is 1 output 0 output at compare match 1 output at compare match Toggle output at compare match Input capture at rising edge Input capture at falling edge Input capture at both edges *: Don't care 0 output at compare match 1 output at compare match Toggle output at compare match 0 output at compare match 1 output at compare match Toggle output at compare match
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Appendix B Internal I/O Register
TIER2—Timer Interrupt Enable Register 2
Bit Initial value Read/Write 7 TTGE 0 R/W 6 ⎯ 1 ⎯ 5 TCIEU 0 R/W 4 TCIEV 0 R/W
H'FF34
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGIEB 0 R/W 0
TPU2
TGIEA 0 R/W
TGR Interrupt Enable A 0 1 Interrupt requests (TGIA) by TGFA bit disabled Interrupt requests (TGIA) by TGFA bit enabled
TGR Interrupt Enable B 0 1 Interrupt requests (TGIB) by TGFB bit disabled Interrupt requests (TGIB) by TGFB bit enabled
Overflow Interrupt Enable 0 1 Interrupt requests (TCIV) by TCFV disabled Interrupt requests (TCIV) by TCFV enabled
Underflow Interrupt Enable 0 1 Interrupt requests (TCIU) by TCFU disabled Interrupt requests (TCIU) by TCFU enabled
A/D Conversion Start Request Enable 0 1 A/D conversion start request generation disabled A/D conversion start request generation enabled
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TSR2—Timer Status Register 2
Bit Initial value Read/Write 7 TCFD 1 R 6 ⎯ 1 ⎯ 5 TCFU 0 R/(W)* 4 TCFV 0 R/(W)*
H'FF35
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 TGFB 0 R/(W)* 0
TPU2
TGFA 0 R/(W)*
Input Capture/Output Compare Flag A 0 [Clearing conditions] • When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFA after reading TGFA = 1 [Setting conditions] • When TCNT = TGRA while TGRA is functioning as output compare register • When TCNT value is transferred to TGRA by input capture signal while TGRA is functioning as input capture register
1
Input Capture/Output Compare Flag B 0 [Clearing conditions] • When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0 • When 0 is written to TGFB after reading TGFB = 1 [Setting conditions] • When TCNT = TGRB while TGRB is functioning as output compare register • When TCNT value is transferred to TGRB by input capture signal while TGRB is functioning as input capture register
1
Overflow Flag 0 1 [Clearing condition] • When 0 is written to TCFV after reading TCFV = 1 [Setting condition] • When the TCNT value overflows (changes from H'FFFF to H'0000)
Underflow Flag 0 1 [Clearing condition] • When 0 is written to TCFU after reading TCFU = 1 [Setting condition] • When the TCNT value underflows (changes from H'0000 to H'FFFF)
Count Direction Flag 0 1 TCNT counts down TCNT counts up
Note: * Can only be written with 0 for flag clearing.
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Appendix B Internal I/O Register
TCNT2—Timer Counter 2
Bit Initial value 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0
H'FF36
7 0 6 0 5 0 4 0 3 0 2 0 1 0
TPU2
0 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up/down-counter* Note: * These counters can be used as up/down-counters only in phase counting mode or when counting overflow/underflow on another channel. In other cases they function as up-counters.
TGR2A—Timer General Register 2A TGR2B—Timer General Register 2B
Bit Initial value 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1
H'FF38 H'FF3A
7 1 6 1 5 1 4 1 3 1 2 1 1 1
TPU2 TPU2
0 1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCSR0—Timer Control/Status Register 0
Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 ⎯ 1 ⎯
H'FF74(W), H'FF74(R)
3 ⎯ 1 ⎯ 2 CKS2 0 R/W 1 CKS1 0 R/W 0
WDT0
CKS0 0 R/W
Clock Select 2 to 0 CKS2 CKS1 CKS0 0 0 1 1 0 1 0 1 0 1 0 1 0 1 Clock φ/2 φ/64 φ/128 φ/512 φ/2048 φ/8192 φ/32768 φ/131072 Overflow Period* (where φ = 20 MHz) 25.6 μs 819.2 μs 1.6 ms 6.6 ms 26.2 ms 104.9 ms 419.4 ms 1.68 s
Note: * An overflow period is the time interval between the start of counting up from H'00 on the TCNT and the occurrence of a TCNT overflow. Timer Enable 0 1 TCNT is initialized to H'00 and halted TCNT counts
Timer Mode Select 0 1 Interval timer mode: WDT0 requests an interval timer interrupt (WOVI) from the CPU when the TCNT overflows Watchdog timer mode: A reset is issued when the TCNT overflows if the RSTE bit of RSTCSR is set to 1*
Note: * For details see section 12.2.3, Reset Control/Status Register (RSTCSR). Overflow Flag 0 [Clearing conditions] • Write 0 in the TME bit (Only applies to WDT1) • Read TCSR* when OVF = 1, then write 0 in OVF [Setting condition] • When TCNT overflows (changes from H'FF to H'00) (When internal reset request generation is selected in watchdog timer mode, OVF is cleared automatically by the internal reset)
1
Note: * When interval timer interrupts are disabled and OVF is polled, read the OVF = 1 state at least twice. Notes: TCSR0 register differs from other registers in being more difficult to write to. For details see section 12.2.4, Notes on Register Access. * Only 0 can be written, to clear the flag.
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Appendix B Internal I/O Register
TCNT0—Timer Counter 0
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FF74(W), H'FF75(R)
3 0 R/W 2 0 R/W 1 0 R/W 0 0
WDT0
R/W
Up-counter Note: TCNT0 register differs from other registers in being more difficult to write to. For details see section 12.2.4, Notes on Register Access.
RSTCSR—Reset Control/Status Register
Bit Initial value Read/Write 7 WOVF 0 R/(W)* 6 RSTE 0 R/W 5 RSTS 0 R/W 4 ⎯ 0 ⎯
H'FF76(W), H'FF77(R)
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1 ⎯ 0 ⎯ 0
WDT0
⎯ 0 ⎯
Reset Select 0 1 Reset Enable 0 1 Reset signal is not generated if TCNT overflows* Reset signal is generated if TCNT overflows Reset Do not set
Note: * The modules within the H8S/2646 are not reset, but TCNT and TCSR within the WDT are reset. Watchdog Overflow Flag 0 1 [Clearing condition] • Cleared by reading RSTCSR when WOVF = 1, then writing 0 to WOVF [Setting condition] • Set when TCNT overflows (changed from H'FF to H'00) during watchdog timer operation
Notes: RSTCSR register differs from other registers in being more difficult to write to. For details see section 12.2.4, Notes on Register Access. * Can only be written with 0 for flag clearing.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
SMR0—Serial Mode Register 0 SMR1—Serial Mode Register 1 SMR2—Serial Mode Register 2
Bit Initial value Read/Write 7 C/A 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W
H'FF78 H'FF80 H'FF88
3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
SCI0 SCI1 SCI2
Clock Select 1 and 0 0 1 0 1 0 1 Multiprocessor Mode 0 1 Multiprocessor function disabled Multiprocessor format selected φ clock φ/4 clock φ/16 clock φ/64 clock
Stop Bit Length 0 1 stop bit: In transmission, a single 1 bit (stop bit) is added to the end of a transmit character before it is sent. 2 stop bits: In transmission, two 1 bits (stop bits) are added to the end of a transmit character before it is sent.
1
Parity Mode 0 1 Parity Enable 0 1 Parity bit addition and checking disabled Parity bit addition and checking enabled*2 Even parity*3 Odd parity*4
Character Length 0 1 8-bit data 7-bit data*1
Communication Mode 0 1 Asynchronous mode Synchronous mode
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Appendix B Internal I/O Register
Notes: 1. When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted, and it is not possible to choose between LSB-first or MSB-first transfer. 2. When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is added to transmit data before transmission. In reception, the parity bit is checked for the parity (even or odd) specified by the O/E bit. 3. When even parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is even. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is even. 4. When odd parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is odd. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is odd.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ICCR0—I2C Bus Control Register ICCR1—I2C Bus Control Register
Bit : 7 ICE Initial value : R/W : 0 R/W 6 IEIC 0 R/W 5 MST 0 R/W 4 TRS 0 R/W 3
H'FF78 H'FF80
2 BBSY 0 R/W 1 IRIC 0 R/(W)* 0 SCP 0 R/W
IIC0 IIC1
ACKE 0 R/W
Start condition/stop condition prohibit 0 Writing 0 issues a start or stop condition, in combination with the BBSY flag 1 Reading always returns a value of 1 Writing is ignored
I2C Bus interface interrupt request flag 0 1 Waiting for transfer, or transfer in progress Interrupt requested
Note: * For details see section 15.2.5, I2C Bus Control Register. Bus busy 0 Bus is free [Clearing condition] • When a stop condition is detected Bus is free [Clearing condition] • When a stop condition is detected
1
Acknowledge bit judgement selection 0 1 The value of the acknowledge bit is ignored, and continuous transfer is performed If the acknowledge bit is 1, continuous transfer is interrupted
Master/slave select, transmit/receive select 0 1 0 1 0 1 Slave receive mode Slave transmit mode Master receive mode Master transmit mode
Note: * For details see section 15.2.5, I2C Bus Control Register. I2C Bus Interface Interrupt Enable 0 1 Interrupts disabled Interrupts enabled
I2C Bus Interface Enable 0 1 I2C bus interface module disabled, with SCL and SDA signal pins set to port function I2C bus interface module internal states initialized SAR and SARX can be accessed I2C bus interface module enabled for transfer operations (pins SCL and SCA are driving the bus) ICMR and ICDR can be accessed
Notes: This register is valid only on the H8S/2638, H8S/2639, or H8S/2630 with the I2C bus interface option added. * Only 0 can be written, for flag clearing.
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Appendix B Internal I/O Register
SMR0—Serial Mode Register 0 SMR1—Serial Mode Register 1 SMR2—Serial Mode Register 2
Bit Initial value Read/Write 7 GM 0 R/W 6 BLK 0 R/W 5 PE 0 R/W 4 O/E 0 R/W
H'FF78 H'FF80 H'FF88
3 BCP1 0 R/W 2 BCP0 0 R/W
Smart Card Interface 0 Smart Card Interface 1 Smart Card Interface 2
1 CKS1 0 R/W 0 CKS0 0 R/W
Clock Select 1 and 0 0 1 0 1 0 1 φ clock φ/4 clock φ/16 clock φ/64 clock
Basic Clock Pulse 0 1 0 1 0 1 Parity Mode 0 1 Parity Enable 0 1 Block Transfer Mode 0 Normal Smart Card interface mode operation • Error signal transmission/detection and automatic data retransmission performed • TXI interrupt generated by TEND flag • TEND flag set 12.5 etu after start of transmission (11.0 etu in GSM mode) Block transfer mode operation • Error signal transmission/detection and automatic data retransmission not performed • TXI interrupt generated by TDRE flag • TEND flag set 11.5 etu after start of transmission (11.0 etu in GSM mode) Parity bit addition and checking disabled Parity bit addition and checking enabled*1 Even parity*2 Odd parity*3 32 clock periods 64 clock periods 372 clock periods 256 clock periods
1
Note: etu: Elementary time unit (time for transfer of 1 bit) GSM Mode 0 Normal smart card interface mode operation • TEND flag generation 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit • Clock output ON/OFF control only GSM mode smart card interface mode operation • TEND flag generation 11.0 etu after beginning of start bit • High/Low fixing control possible in addition to clock output ON/OFF control (set by SCR)
1
Note: etu: Elementary time unit (time for transfer of 1 bit)
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Notes: When the smart card interface is used, be sure to make the 1 setting shown for bit 5. 1. When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is added to transmit data before transmission. In reception, the parity bit is checked for the parity (even or odd) specified by the O/E bit. 2. When even parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is even. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is even. 3. When odd parity is set, parity bit addition is performed in transmission so that the total number of 1 bits in the transmit character plus the parity bit is odd. In reception, a check is performed to see if the total number of 1 bits in the receive character plus the parity bit is odd.
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Appendix B Internal I/O Register
BRR0—Bit Rate Register 0
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF79
4 1 R/W 3 1 R/W
SCI0, Smart Card Interface 0
2 1 R/W 1 1 R/W 0 1 R/W
Set the serial transmit/receive bit rate Note: For details see section 13.2.8, Bit Rate Register (BRR).
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ICSR0—I2C Bus Status Register ICSR1—I2C Bus Status Register
Bit : 7 ESTP Initial value : R/W : 0 R/(W)* 6 STOP 0 R/(W)* 5 IRTR 0 R/(W)* 4 AASX 0 R/(W)* 3 AL 0 R/(W)* 2 AAS 0 R/(W)* 1 ADZ 0
H'FF79 H'FF81
0 ACKB 0 R/W
IIC0 IIC1
R/(W)*
Acknowledge bit 0 When receiving, 0 is output at acknowledge output timing. When transmitting, this bit shows that an acknowledge (0) has not been sent from the receiving device. When receiving, 1 is output at acknowledge output timing. When transmitting, this bit shows that an acknowledge (1) has been sent from the receiving device.
1
General call address confirmation flag 0 General call address not confirmed [Clearings] (1) When data is written to ICDR (when sending), or when data is read from ICDR (when receiving); (2) When 0 is written after reading ADZ=1; (3) In master mode. General call address confirmation [Setting] • When general call address is detected is in slave receive mode and FSX = 0 or FS = 0).
1
Slave address confirmation flag 0 Slave address or general call address not confirmed [Clearings] (1) When data is written to ICDR (when sending), or when data is read from ICDR (when receiving); (2) When 0 is written after reading AAS=1; (3) In master mode. Slave address or general call address confirmed [Setting] • When slave address or general call address is detected in slave receive mode and FS = 0.
1
Arbitration lost flag 0 Secure bus. [Clearings] (1) When data is written to ICDR (when sending), or when data is read (when receiving); (2) When 0 is written after reading AL=1. Bus arbitration lost [Settings] (1) When there is a mismatch between internal SDA and SDA pin at rise in SCL in master transmit mode; (2) When the internal SCL level is HIGH at the fall in SCL in master transmit mode.
1
2nd slave address confirmation flag 0 2nd slave address not confirmed [Clearings] (1) When 0 is written after reading AASX=1; (2) When start conditions are detected; (3) In master mode. 2nd slave address confirmed [Setting] • When 2nd slave address is detected in slave receive mode and FSX = 0.
1
I2C bus interface continuous transmit and receive interrupt request flag 0 Transmit wait state, or transmitting [Clearings] (1) When 0 written after reading IRTR=1; (2) When IRIC flag is cleared to 0. Continuous transmit state [Settings] • In I2C bus interface slave mode When 1 is set in TDRE or RDRF flag when AASX=1. • In other than I2C bus interface slave mode When TDRE or RDRF flag is set to 1.
1
Normal end condition detection flag 0 No normal end condition [Clearings] (1) When 0 is written after reading STOP=1; (2) When IRIC flag is cleared to 0. Normal end condition detected in slave mode in I2C bus format [Setting] On detection of stop condition on completion of sending frame. • No meaning when in other than slave mode in I2C bus format
1
Error stop condition detection flag 0 No error stop condition [Clearings] (1) When 0 written after reading ESTP=1; (2) When IRIC flag is cleared to 0. • Error stop condition detected in slave mode in I2C bus format [Setting] On detection of stop condition while sending frame. • No meaning when in other than slave mode in I2C bus format
1
Notes: This register is valid only on the H8S/2638, H8S/2639, or H8S/2630 with the I2C bus interface option added. * Only 0 can be written to these bits (to clear these flags).
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Appendix B Internal I/O Register
SCR0—Serial Control Register 0 SCR1—Serial Control Register 1 SCR2—Serial Control Register 2
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W
H'FF7A H'FF82 H'FF8A
3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W
SCI0 SCI1 SCI2
Clock Enable 1 and 0 0 0 Asynchronous mode Internal clock/SCK pin functions as I/O port
Clocked Internal clock/SCK pin synchronous mode functions as serial clock output 1 Asynchronous mode Internal clock/SCK pin functions as clock output*9
Clocked Internal clock/SCK pin synchronous mode functions as serial clock output 1 0 Asynchronous mode External clock/SCK pin functions as clock input*10
Clocked External clock/SCK pin synchronous mode functions as serial clock input 1 Asynchronous mode External clock/SCK pin functions as clock input*10
Clocked External clock/SCK pin synchronous mode functions as serial clock input Transmit End Interrupt Enable 0 1 Transmit-end interrupt (TEI) request disabled*8 Transmit-end interrupt (TEI) request enabled*8
Multiprocessor Interrupt Enable 0 Transmit Interrupt Enable 0 1 Transmit-data-empty interrupt (TXI) request disabled*1 Transmit-data-empty interrupt (TXI) request enabled 1 Multiprocessor interrupts disabled (normal reception mode) [Clearing conditions] • When the MPIE bit is cleared to 0 • When data with MPB = 1 is received Multiprocessor interrupts enabled*7 Receive interrupt (RXI) requests, receive-error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received
Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled*2 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled
Receive Enable 0 1 Reception disabled*5 Reception enabled*6
1
Transmit Enable 0 1 Transmission disabled*3 Transmission enabled*4
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Notes: 1. TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then clearing it to 0, or clearing the TIE bit to 0. 2. RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF flag, or the FER, PER, or ORER flag, then clearing the flag to 0, or clearing the RIE bit to 0. 3. The TDRE flag in SSR is fixed at 1. 4. In this state, serial transmission is started when transmit data is written to TDR and the TDRE flag in SSR is cleared to 0. SMR setting must be performed to decide the transfer format before setting the TE bit to 1. 5. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which retain their states. 6. Serial reception is started in this state when a start bit is detected in asynchronous mode or serial clock input is detected in clocked synchronous mode. SMR setting must be performed to decide the transfer format before setting the RE bit to 1. 7. When receive data including MPB = 0 is received, receive data transfer from RSR to RDR, receive error detection, and setting of the RDRF, FER, and ORER flags in SSR , is not performed. When receive data including MPB = 1 is received, the MPB bit in SSR is set to 1, the MPIE bit is cleared to 0 automatically, and generation of RXI and ERI interrupts (when the TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled. 8. TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it to 0 and clearing the TEND flag to 0, or clearing the TEIE bit to 0. 9. Outputs a clock of the same frequency as the bit rate. 10. Inputs a clock with a frequency 16 times the bit rate.
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Appendix B Internal I/O Register
SCR0—Serial Control Register 0 SCR1—Serial Control Register 1 SCR2—Serial Control Register 2
Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0
H'FF7A H'FF82 H'FF8A
3 MPIE 0 R/W 2 TEIE 0 R/W
Smart Card Interface 0 Smart Card Interface 1 Smart Card Interface 2
1 CKE1 0 R/W 0 CKE0 0 R/W
R/W
Clock Enable 1 and 0 SCMR SMR SCR Setting CKE0 See the SCI 0 0 0 1 1 0 1 1 1 0 Operates as port I/O pin Outputs clock as SCK output pin Operates as SCK output pin, with output fixed low Outputs clock as SCK output pin Operates as SCK output pin, with output fixed high Outputs clock as SCK output pin SCK Pin Function SMIF C/A, GM CKE1 0 1
Transmit End Interrupt Enable 0 1 Transmit-end interrupt (TEI) request disabled*8 Transmit-end interrupt (TEI) request enabled*8
Multiprocessor Interrupt Enable 0 Transmit Interrupt Enable 0 1 Transmit-data-empty interrupt (TXI) request disabled*1 Transmit-data-empty interrupt (TXI) request enabled 1 Multiprocessor interrupts disabled (normal reception mode) [Clearing conditions] • When the MPIE bit is cleared to 0 • When data with MPB = 1 is received Multiprocessor interrupts enabled*7 Receive interrupt (RXI) requests, receive-error interrupt (ERI) requests, and setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the multiprocessor bit set to 1 is received
Receive Interrupt Enable 0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request disabled*2 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request enabled
Receive Enable 0 1 Reception disabled*5 Reception enabled*6
1
Transmit Enable 0 1 Transmission disabled*3 Transmission enabled*4
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Notes: 1. TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then clearing it to 0, or clearing the TIE bit to 0. 2. RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF flag, or the FER, PER, or ORER flag, then clearing the flag to 0, or clearing the RIE bit to 0. 3. The TDRE flag in SSR is fixed at 1. 4. In this state, serial transmission is started when transmit data is written to TDR and the TDRE flag in SSR is cleared to 0. SMR setting must be performed to decide the transfer format before setting the TE bit to 1. 5. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which retain their states. 6. Serial reception is started in this state when a start bit is detected in asynchronous mode or serial clock input is detected in clocked synchronous mode. SMR setting must be performed to decide the transfer format before setting the RE bit to 1. 7. When receive data including MPB = 0 is received, receive data transfer from RSR to RDR, receive error detection, and setting of the RDRF, FER, and ORER flags in SSR , is not performed. When receive data including MPB = 1 is received, the MPB bit in SSR is set to 1, the MPIE bit is cleared to 0 automatically, and generation of RXI and ERI interrupts (when the TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled. 8. TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it to 0 and clearing the TEND flag to 0, or clearing the TEIE bit to 0.
TDR0—Transmit Data Register 0
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF7B
4 1 R/W 3 1 R/W
SCI0, Smart Card Interface 0
2 1 R/W 1 1 R/W 0 1 R/W
Store serial transmit data
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Appendix B Internal I/O Register
SSR0—Serial Status Register 0 SSR1—Serial Status Register 1 SSR2—Serial Status Register 2
Bit Initial value Read/Write
H'FF7C H'FF84 H'FF8C
5 ORER 0 R/(W)* 4 FER 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R
0 1
SCI0 SCI1 SCI2
1 MPB 0 R 0 MPBT 0 R/W
7 TDRE 1 R/(W)*
6 RDRF 0 R/(W)*
Multiprocessor Bit Transfer Data with a 0 multi-processor bit is transmitted Data with a 1 multi-processor bit is transmitted
Multiprocessor Bit 0 [Clearing condition] • When data with a 0 multiprocessor bit is received*7 [Setting condition] • When data with a 1 multiprocessor bit is received
1
Transmit End 0 [Clearing conditions] • When 0 is written in TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and writes data to TDR [Setting conditions] • When the TE bit in SCR is 0 • When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character
1
Parity Error 0 1 [Clearing condition] • When 0 is written in PER after reading PER = 1*5 [Setting condition] • When, in reception, the number of 1 bits in the receive data plus the parity bit does not match the parity setting (even or odd) specified by the O/E bit in SMR*6
Framing Error 0 1 [Clearing condition] • When 0 is written in FER after reading FER = 1*3 [Setting condition] • When the SCI checks the stop bit at the end of the receive data when reception ends, and the stop bit is 0*4
Overrun Error 0 1 [Clearing condition] • When 0 is written in ORER after reading ORER = 1*1 [Setting condition] • When the next serial reception is completed while RDRF = 1*2
Receive Data Register Full 0 [Clearing conditions] • When 0 is written in RDRF after reading RDRF = 1 • When the DTC is activated by an RXI interrupt and reads data from RDR [Setting condition] • When serial reception ends normally and receive data is transferred from RSR to RDR
1
Note: RDR and the RDRF flag are not affected and retain their previous values when an error is detected during reception or when the RE bit in SCR is cleared to 0. If reception of the next data is completed while the RDRF flag is still set to 1, an overrun error will occur and the receive data will be lost. Transmit Data Register Empty 0 [Clearing conditions] • When 0 is written in TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and writes data to TDR [Setting conditions] • When the TE bit in SCR is 0 • When data is transferred from TDR to TSR and data can be written in TDR
1
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Notes: 1. The ORER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. 2. The receive data prior to the overrun error is retained in RDR, and the data received subsequently is lost. Also, subsequent serial reception cannot be continued while the ORER flag is set to 1. In clocked synchronous mode, serial transmission cannot be continued, either. 3. The FER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. 4. In 2-stop-bit mode, only the first stop bit is checked for a value of 0; the second stop bit is not checked. If a framing error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent serial reception cannot be continued while the FER flag is set to 1. In clocked synchronous mode, serial transmission cannot be continued, either. 5. The PER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. 6. If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent serial reception cannot be continued while the PER flag is set to 1. In clocked synchronous mode, serial transmission cannot be continued, either. 7. Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor format. * Only 0 can be written, to clear the flag.
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Appendix B Internal I/O Register
SSR0—Serial Status Register 0 SSR1—Serial Status Register 1 SSR2—Serial Status Register 2
Bit Initial value Read/Write
H'FF7C H'FF84 H'FF8C
5 ORER 0 R/(W)* 4 ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R
Smart Card Interface 0 Smart Card Interface 1 Smart Card Interface 2
1 MPB 0 R 0 MPBT 0 R/W
7 TDRE 1 R/(W)*
6 RDRF 0 R/(W)*
Multiprocessor Bit Transfer 0 Transmit End 0 Transmission is in progress [Clearing conditions] • When 0 is written to TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and write data to TDR Transmission has ended [Setting conditions] • Upon reset, and in standby mode or module stop mode • When the TE bit in SCR is 0 and the ERS bit is also 0 • When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 0 • When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a 1-byte serial character when GM = 0 and BLK = 1 • When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 0 • When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a 1-byte serial character when GM = 1 and BLK = 1 1 Data with a 0 multi-processor bit is transmitted Data with a 1 multi-processor bit is transmitted
Multiprocessor Bit 0 [Clearing condition] • When data with a 0 multiprocessor bit is received*5 [Setting condition] • When data with a 1 multiprocessor bit is received
1
1
Note: etu: Elementary time unit (time for transfer of 1 bit) Parity Error 0 1 [Clearing condition] • When 0 is written in PER after reading PER = 1*3 [Setting condition] • When, in reception, the number of 1 bits in the receive data plus the parity bit *4 does not match the parity setting (even or odd) specified by the O/E bit in SMR
Error Signal Status 0 Normal reception, with no error signal [Clearing conditions] • Upon reset, and in standby mode or module stop mode • When 0 is written to ERS after reading ERS = 1 Error signal sent from receiver indicating detection of parity error [Setting condition] • When the low level of the error signal is sampled
1
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its previous state. Overrun Error 0 1 [Clearing condition] • When 0 is written in ORER after reading ORER = 1*1 [Setting condition] • When the next serial reception is completed while RDRF = 1*2
Receive Data Register Full 0 [Clearing conditions] • When 0 is written in RDRF after reading RDRF = 1 • When the DTC is activated by an RXI interrupt and reads data from RDR [Setting condition] • When serial reception ends normally and receive data is transferred from RSR to RDR
1
Note: RDR and the RDRF flag are not affected and retain their previous values when an error is detected during reception or when the RE bit in SCR is cleared to 0. If reception of the next data is completed while the RDRF flag is still set to 1, an overrun error will occur and the receive data will be lost. Transmit Data Register Empty 0 [Clearing conditions] • When 0 is written in TDRE after reading TDRE = 1 • When the DTC is activated by a TXI interrupt and writes data to TDR [Setting conditions] • When the TE bit in SCR is 0 • When data is transferred from TDR to TSR and data can be written in TDR
1
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Notes: 1. The ORER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. 2. The receive data prior to the overrun error is retained in RDR, and the data received subsequently is lost. Also, subsequent serial reception cannot be continued while the ORER flag is set to 1. In clocked synchronous mode, serial transmission cannot be continued, either. 3. The PER flag is not affected and retains its previous state when the RE bit in SCR is cleared to 0. 4. If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not set. Also, subsequent serial reception cannot be continued while the PER flag is set to 1. In clocked synchronous mode, serial transmission cannot be continued, either. 5. Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor format. * Only 0 can be written, to clear the flag.
RDR0—Receive Data Register 0
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R
H'FF7D
4 0 R 3 0 R
SCI0, Smart Card Interface 0
2 0 R 1 0 R 0 0 R
Store serial receive data
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
SCMR0—Smart Card Mode Register 0
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯
H'FF7E
4 ⎯ 1 ⎯ 3 SDIR 0 R/W
SCI0, Smart Card Interface 0
2 SINV 0 R/W 1 ⎯ 1 ⎯ 0 SMIF 0 R/W
Smart Card Interface Mode Select 0 1 Operates as normal SCI (smart card interface function disabled) Smart card interface function enabled
Smart Card Interface Data Invert 0 1 TDR contents are transmitted without modification Receive data is stored in RDR without modification TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form
Smart Card Interface Data Transfer Direction 0 1 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ICDR0—I2C Bus Data Register ICDR1—I2C Bus Data Register
Bit : 7 ICDR7 Initial value : R/W ICDRR Bit : 7 ⎯ R 6 ⎯ R 5 ⎯ R 4 ⎯ R 3 : ⎯ R/W 6 ICDR6 ⎯ R/W 5 ICDR5 ⎯ R/W 4 ICDR4 ⎯ R/W 3
H'FF7E H'FF86
2 ICDR2 ⎯ R/W 1 ICDR1 ⎯ R/W 0 ICDR0 ⎯ R/W
IIC0 IIC1
ICDR3 ⎯ R/W
2 ⎯ R
1 ⎯ R
0 ⎯ R
ICDRR7 ICDRR6 ICDRR5 ICDRR4 ICDRR3 ICDRR2 ICDRR1 ICDRR0 Initial value : R/W ICDRS Bit : 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯ 3 ⎯ ⎯ 2 ⎯ ⎯ 1 ⎯ ⎯ 0 ⎯ ⎯ ICDRS7 ICDRS6 ICDRS5 ICDRS4 ICDRS3 ICDRS2 ICDRS1 ICDRS0 Initial value : R/W ICDRT Bit : 7 ⎯ W 6 ⎯ W 5 ⎯ W 4 ⎯ W 3 ⎯ W 2 ⎯ W 1 ⎯ W 0 ⎯ W ICDRT7 ICDRT6 ICDRT5 ICDRT4 ICDRT3 ICDRT2 ICDRT1 ICDRT0 Initial value : R/W : : : ⎯ R
TDRE, RDRF (internal flag) Bit : ⎯ TDRE Initial value : R/W : 0 ⎯ ⎯ RDRF 0 ⎯
Note: This register is valid only on the H8S/2638, H8S/2639, or H8S/2630 with the I2C bus interface option added.
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Appendix B Internal I/O Register
SARX0—2nd Slave Address Register SARX1—2nd Slave Address Register
Bit : 7 SVAX6 Initial value : R/W : 0 R/W 6 SVAX5 0 R/W 5 SVAX4 0 R/W 4 SVAX3 0 R/W
2nd slave address
H'FF7E H'FF86
3 SVAX2 0 R/W 2 SVAX1 0 R/W 1 SVAX0 0 R/W 0 FSX 1 R/W
IIC0 IIC1
Format select X
Note: This register is valid only on the H8S/2638, H8S/2639, or H8S/2630 with the I2C bus interface option added.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ICMR0—I2C Bus Mode Register ICMR1—I2C Bus Mode Register
Bit : 7 MLS Initial value : R/W : 0 R/W 6 WAIT 0 R/W 5 CKS2 0 R/W 4 CKS1 0 R/W 3 CKS0 0 R/W
H'FF7F H'FF87
2 BC2 0 R/W 1 BC1 0 R/W 0 BC0 0 R/W
IIC0 IIC1
Bit counter Bit 2 BC2 0 Bit 1 BC1 0 1 1 0 1 Bit 0 BC0 0 1 0 1 0 1 0 1 Bit/frame Clock sync serial format 8 1 2 3 4 5 6 7 PC bus format 9 2 3 4 5 6 7 8
Transmit clock select
SCRX Bit 5 bit 5, 6 IICX CKS2 0 0 Bit 4 Bit 3 Clock Transfer rate
CKS1 0 1
1
0 1
1
0
0 1
1
0 1
CKS0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
φ/28 φ/40 φ/48 φ/64 φ/80 φ/100 φ/112 φ/128 φ/56 φ/80 φ/96 φ/128 φ/160 φ/200 φ/224 φ/256
φ = 5 MHz 179kHz 125kHz 104kHz 78.1kHz 62.5kHz 50.0kHz 44.6kHz 39.1kHz 89.3kHz 62.5kHz 52.1kHz 39.1kHz 31.3kHz 25.0kHz 22.3kHz 19.5kHz
φ = 8 MHz φ = 10 MHz φ = 16 MHz φ = 20 MHz 286 kHz 357 kHz 571 kHz* 714 kHz* 200 kHz 250 kHz 400 kHz 500 kHz* 167 kHz 208 kHz 333 kHz 417 kHz* 125 kHz 156 kHz 250 kHz 313 kHz 100 kHz 125 kHz 200 kHz 250 kHz 80.0 kHz 100 kHz 160 kHz 200 kHz 71.4 kHz 89.3 kHz 143 kHz 179 kHz 62.5 kHz 78.1 kHz 125 kHz 156 kHz 143 kHz 179 kHz 286 kHz 357 kHz 100 kHz 125 kHz 200 kHz 250 kHz 83.3 kHz 104 kHz 167 kHz 208 kHz 62.5 kHz 78.1 kHz 125 kHz 156 kHz 50.0 kHz 62.5 kHz 100 kHz 125 kHz 40.0 kHz 50.0 kHz 80.0 kHz 100 kHz 35.7 kHz 44.6 kHz 71.4 kHz 89.3 kHz 31.3 kHz 39.1 kHz 62.5 kHz 78.1 kHz
Note: * These rates are outside the ranges stipulated in the I2C bus interface specifications (normal mode: max. 100 kHz, high-speed mode: max. 400 kHz).
Wait insert bit 0 1 Send data followed by acknowledge bit. Insert wait between data and acknowledge bit.
MSB-first/LSB-first select 0 1 MSB first LSB first
Note: This register is valid only on the H8S/2638, H8S/2639, or H8S/2630 with the I2C bus interface option added.
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Appendix B Internal I/O Register
SAR0—Slave Address Register SAR1—Slave Address Register
Bit : 7 SVA6 Initial value : R/W : 0 R/W 6 SVA5 0 R/W 5 SVA4 0 R/W 4 SVA3 0 R/W
Slave address Format select DDCSWR bit 6 SW 0 SAR bit 0 FS 0 SARX bit 0 FSX 0 1
H'FF7F H'FF87
3 SVA2 0 R/W 2 SVA1 0 R/W 1 SVA0 0 R/W 0 FS 0 R/W
IIC0 IIC1
Operating mode I2C bus format • SAR and SARX slave addresses recognized (initial value) I2C bus format • SAR slave address recognized • SARX slave address ignored I2C bus format • SAR slave address ignored • SARX slave address recognized Synchronous serial format • SAR and SARX slave addresses ignored • Must not be set.
1
0
1 1 ⎯ ⎯
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
BRR1—Bit Rate Register 1
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF81
4 1 R/W 3 1 R/W
SCI1, Smart Card Interface 1
2 1 R/W 1 1 R/W 0 1 R/W
Set the serial transmit/receive bit rate Note: For details see section 13.2.8, Bit Rate Register (BRR).
TDR1—Transmit Data Register 1
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF83
4 1 R/W 3 1 R/W
SCI1, Smart Card Interface 1
2 1 R/W 1 1 R/W 0 1 R/W
Store serial transmit data
RDR1—Receive Data Register 1
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R
H'FF85
4 0 R 3 0 R
SCI1, Smart Card Interface 1
2 0 R 1 0 R 0 0 R
Store serial receive data
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
SCMR1—Smart Card Mode Register 1
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯
H'FF86
4 ⎯ 1 ⎯ 3 SDIR 0 R/W
SCI1, Smart Card Interface 1
2 SINV 0 R/W 1 ⎯ 1 ⎯ 0 SMIF 0 R/W
Smart Card Interface Mode Select 0 1 Operates as normal SCI (smart card interface function disabled) Smart card interface function enabled
Smart Card Interface Data Invert 0 1 TDR contents are transmitted without modification Receive data is stored in RDR without modification TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form
Smart Card Data Interface Transfer Direction 0 1 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first
BRR2—Bit Rate Register 2
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF89
4 1 R/W 3 1 R/W
SCI2, Smart Card Interface 2
2 1 R/W 1 1 R/W 0 1 R/W
Set the serial transmit/receive bit rate Note: For details see section 13.2.8, Bit Rate Register (BRR).
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TDR2—Transmit Data Register 2
Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W
H'FF8B
4 1 R/W 3 1 R/W
SCI2, Smart Card Interface 2
2 1 R/W 1 1 R/W 0 1 R/W
Store serial transmit data
RDR2—Receive Data Register 2
Bit Initial value Read/Write 7 0 R 6 0 R 5 0 R
H'FF8D
4 0 R 3 0 R
SCI2, Smart Card Interface 2
2 0 R 1 0 R 0 0 R
Store serial receive data
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Appendix B Internal I/O Register
SCMR2—Smart Card Mode Register 2
Bit Initial value Read/Write 7 ⎯ 1 ⎯ 6 ⎯ 1 ⎯ 5 ⎯ 1 ⎯
H'FF8E
4 ⎯ 1 ⎯ 3 SDIR 0 R/W
SCI2, Smart Card Interface 2
2 SINV 0 R/W 1 ⎯ 1 ⎯ 0 SMIF 0 R/W
Smart Card Interface Mode Select 0 1 Operates as normal SCI (smart card interface function disabled) Smart card interface function enabled
Smart Card Interface Data Invert 0 1 TDR contents are transmitted without modification Receive data is stored in RDR without modification TDR contents are inverted before being transmitted Receive data is stored in RDR in inverted form
Smart Card Interface Data Transfer Direction 0 1 TDR contents are transmitted LSB-first Receive data is stored in RDR LSB-first TDR contents are transmitted MSB-first Receive data is stored in RDR MSB-first
ADDRA—A/D Data Register A ADDRB—A/D Data Register B ADDRC—A/D Data Register C ADDRD—A/D Data Register D
Bit Initial value Read/Write 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R
H'FF90 H'FF92 H'FF94 H'FF96
7 0 R 6 0 R 5 0 R 4 ⎯ 0 R 3 ⎯ 0 R
A/D Converter A/D Converter A/D Converter A/D Converter
2 ⎯ 0 R 1 ⎯ 0 R 0 ⎯ 0 R
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 ⎯
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
ADCSR—A/D Control/Status Register
Bit Initial value Read/Write 7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W
H'FF98
3 CH3 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0
A/D Converter
CH0 0 R/W
Channel Select 2 to 0 CH3 0 CH2 0 CH1 0 1 1 0 1 1 0 0 1 1 0 1 CH0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Single Mode (SCAN = 0) AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 Setting prohibited Setting prohibited Setting prohibited Setting prohibited Scan Mode (SCAN = 1) AN0 AN0, AN1 AN0 to AN2 AN0 to AN3 AN4 AN4, AN5 AN4 to AN6 AN4 to AN7 AN8 AN8, AN9 AN8 to AN10 AN8 to AN11 Setting prohibited Setting prohibited Setting prohibited Setting prohibited
Channel Select 3 0 1 Scan Mode 0 1 A/D Start 0 1 A/D conversion stopped • Single mode: A/D conversion is started. Cleared to 0 automatically when conversion on the specified channel ends • Scan mode: A/D conversion is started. Conversion continues sequentially on the selected channels until ADST is cleared to 0 by software, a reset, or a transition to standby mode or module stop mode Single mode Scan mode AN8 to AN11 are group 0 analog input pins AN0 to AN3 are group 0 analog input pins, AN4 to AN7 are group 1 analog input pins
A/D Interrupt Enable 0 1 A/D End Flag 0 [Clearing conditions] • When 0 is written in the to ADF flag after reading ADF = 1 • When the DTC is activated by an ADI interrupt, and ADDR is read [Setting conditions] • Single mode: When A/D conversion ends • Scan mode: When A/D conversion ends on all specified channels A/D conversion end interrupt (ADI) request disabled A/D conversion end interrupt (ADI) request enabled
1
Note: * Only 0 can be written, to clear the flag.
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix B Internal I/O Register
ADCR—A/D Control Register
Bit Initial value Read/Write 7 TRGS1 0 R/W 6 TRGS0 0 R/W 5 ⎯ 1 ⎯ 4 ⎯ 1 ⎯ Clock Select 0 1 0 1 0 1 Timer Trigger Select 0 1 0 1 0 1
H'FF99
3 CKS1 0 R/W 2 CKS0 0 R/W 1 ⎯ 1 ⎯
A/D Converter
0 ⎯ 1 ⎯
Conversion time = 530 states (max.) Conversion time = 266 states (max.) Conversion time = 134 states (max.) Conversion time = 68 states (max.)
A/D conversion start by software is enabled A/D conversion start by TPU conversion start trigger is enabled Setting prohibited A/D conversion start by external trigger pin (ADTRG) is enabled
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
TCSR1—Timer Control/Status Register 1
Bit Initial value Read/Write 7 OVF 0 R/(W)*1 6 WT/IT 0 R/W 5 TME 0 R/W 4 0 R/W 3 0 R/W
H'FFA2(W), H'FFA2(R)
2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W
WDT1
PSS*2 RST/NMI
Clock Select 2 to 0 PSS CKS2 CKS1 CKS0 0 0 0 1 1 0 1 1 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Clock φ/2 φ/64 φ/128 φ/512 φ/2048 φ/8192 φ/32768 φ/131072 φSUB/2*2 φSUB/4*2 φSUB/8*2 φSUB/16*2 φSUB/32*2 φSUB/64*2 φSUB/128*2 φSUB/256*2 Overflow Period*1 (where φ = 20 MHz) (where φSUB*2 = 32.768 kHz) 25.6 μs 819.2 μs 1.6 ms 6.6 ms 26.2 ms 104.9 ms 419.4 ms 1.68 s 15.6 ms 31.3 ms 62.5 ms 125 ms 250 ms 500 ms 1s 2s
0 1
1 0
Notes: 1. An overflow period is the time interval between the start of counting up from H'00 on the TCNT and the occurrence of a TCNT overflow. 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask, W-mask versions, and H8S/2635 Group only, but are not available in the other versions. Reset or NMI 0 1 NMI request Internal reset request
Prescaler Select 0 1 The TCNT counts frequency-division clock pulses of the φ based prescaler (PSM) The TCNT counts frequency-division clock pulses of the φ SUB*-based prescaler (PSS)
Note: * Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask, W-mask versions, and H8S/2635 Group only. These functions cannot be used with the other versions, and in them the PSS bit is reserved. Only 0 should be written to this bit. Timer Enable 0 1 TCNT is initialized to H'00 and halted TCNT counts
Timer Mode Select 0 1 Overflow Flag 0 [Clearing conditions] • Write 0 in the TME bit (Only applies to WDT1) • Read TCSR* when OVF = 1, then write 0 in OVF [Setting condition] • When TCNT overflows (changes from H'FF to H'00) (When internal reset request generation is selected in watchdog timer mode, OVF is cleared automatically by the internal reset) Interval timer mode: WDT1 requests an interval timer interrupt (WOVI) from the CPU when the TCNT overflows Watchdog timer mode: WDT1 requests a reset or an NMI interrupt from the CPU when the TCNT overflows
1
Note: * When interval timer interrupts are disabled and OVF is polled, read the OVF = 1 state at least twice. Notes: TCSR1 register differs from other registers in being more difficult to write to. For details see section 12.2.4, Notes on Register Access. 1. Only 0 can be written, to clear the flag. 2. Subclock functions (subactive mode, subsleep mode, and watch mode) are available in the U-mask, W-mask versions, and H8S/2635 Group only.
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Appendix B Internal I/O Register
TCNT1—Timer Counter 1
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFA2(W), H'FFA3(R)
3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W
WDT1
Up-counter Note: TCNT1 register differs from other registers in being more difficult to write to. For details see section 12.2.4, Notes on Register Access.
DADR0— D/A Data Register 0 DADR1— D/A Data Register 1
Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W
H'FFA4 H'FFA5
3 0 R/W 2 0 R/W 1 0 R/W 0 0
D/A0, 1 D/A0, 1
R/W
Store data to be converted
Note: These registers are not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
DACR01— D/A Control Register 01
Bit Initial value Read/Write 7 DAOE1 0 R/(W)* 6 DAOE0 0 R/W 5 DAE 0 R/W 4 ⎯ 1 ⎯
H'FFA6
3 ⎯ 1 ⎯ 2 ⎯ 1 ⎯ 1 ⎯ 1 ⎯ 0 ⎯ 1 ⎯
D/A0, 1
D/A Enable 0 0 1 1 0 1 * 0 1 0 1 * Disabled on channels 0 and 1 Enabled on channel 0 Disabled on channel 1 Enabled on channels 0 and 1 Disabled on channel 0Enabled on channel 1 Enabled on channels 0 and 1 Enabled on channels 0 and 1 *: Don’t care D/A Output Enable 0 0 1 Analog output DA0 is disabled D/A conversion is enabled on channel 0. Analog output DA0 is enabled
D/A Output Enable 1 0 1 Analog output DA1 is disabled D/A conversion is enabled on channel 1. Analog output DA1 is enabled
Note:
*
This register is not available in the H8S/2635 Group.
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Appendix B Internal I/O Register
FLMCR1—Flash Memory Control Register 1
Bit Initial value Read/Write 7 FWE ⎯* R 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W
H'FFA8
3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W
Flash Memory
0 P 0 R/W
Erase 0 1 Erase mode cleared Transition to erase mode [Setting condition] • When FWE = 1, SWE = 1, and ESU = 1
Program 0 1 Program mode cleared Transition to program mode [Setting condition] • When FWE = 1, SWE = 1, and PSU = 1
Program-Verify 0 1 Program-verify mode cleared Transition to program-verify mode [Setting condition] • When FWE = 1 and SWE = 1
Erase-Verify 0 Erase-verify mode cleared 1 Transition to erase-verify mode [Setting condition] • When FWE = 1 and SWE = 1 Program Setup 0 1 Program setup cleared Program setup [Setting condition] • When FWE = 1 and SWE = 1
Erase Setup 0 1 Erase setup cleared Erase setup [Setting condition] • When FWE = 1 and SWE = 1
Software Write Enable Bit 0 1 Writes disabled Writes enabled [Setting condition] • When FWE = 1
Flash Write Enable Bit 0 1 When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin
Note: * Determined by the state of the FWE pin.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
FLMCR2—Flash Memory Control Register 2
Bit Initial value Read/Write 7 FLER 0 R 6 ⎯ 0 ⎯ 5 ⎯ 0 ⎯ 4 ⎯ 0 ⎯
H'FFA9
3 ⎯ 0 ⎯ 2 ⎯ 0 ⎯ 1
Flash Memory
0 ⎯ 0 ⎯
⎯ 0 ⎯
Flash Memory Error 0 Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] • Power-on reset or hardware standby mode An error has occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting condition] • See section 21A.10.3, 21B.10.3, Error Protection
1
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Appendix B Internal I/O Register
EBR1—Erase Block Register 1 EBR2—Erase Block Register 2
EBR1 Bit Initial value Read/Write EBR2 Bit Initial value Read/Write 7 ⎯ 0 R/W 6 ⎯ 0 R/W 5 EB13*3 0 R/W 4 EB12*3 0 R/W 15 EB7 0 R/W 14 EB6 0 R/W 13 EB5 0 R/W 12 EB4 0 R/W
H'FFAA H'FFAB
Flash Memory Flash Memory
11 EB3 0 R/W
10 EB2 0 R/W
9 EB1 0 R/W
8 EB0 0 R/W
3 EB11*2 0 R/W
2 EB10*1 0 R/W
1 EB9 0 R/W
0 EB8 0 R/W
Specify the flash memory erase area • H8S/2636 Block (Size) EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (16 kbytes) EB6 (8 kbytes) EB7 (8 kbytes) EB8 (32 kbytes) EB9 (32 kbytes) Addresses H'000000 to H'0003FF H'000400 to H'0007FF H'000800 to H'000BFF H'000C00 to H'000FFF H'001000 to H'007FFF H'008000 to H'00BFFF H'00C000 to H'00DFFF H'00E000 to H'00FFFF H'010000 to H'017FFF H'018000 to H'01FFFF • H8S/2638, H8S/2639 Block (Size) Addresses EB0 (4 kbytes) H'000000 to H'000FFF EB1 (4 kbytes) H'001000 to H'001FFF EB2 (4 kbytes) H'002000 to H'002FFF EB3 (4 kbytes) H'003000 to H'003FFF EB4 (4 kbytes) H'004000 to H'004FFF EB5 (4 kbytes) H'005000 to H'005FFF EB6 (4 kbytes) H'006000 to H'006FFF EB7 (4 kbytes) H'007000 to H'007FFF EB8 (32 kbytes) H'008000 to H'00FFFF EB9 (64 kbytes) H'010000 to H'01FFFF EB10 (64 kbytes) H'020000 to H'02FFFF EB11 (64 kbytes) H'030000 to H'03FFFF • H8S/2630 Block (Size) EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) EB8 (32 kbytes) EB9 (64 kbytes) EB10 (64 kbytes) EB11 (64 kbytes) EB12 (64 kbytes) EB13 (64 kbytes)
• H8S/2635 Block (Size) EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) EB8 (32 kbytes) EB9 (64 kbytes) EB10 (64 kbytes)
Addresses H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF H'008000 to H'00FFFF H'010000 to H'01FFFF H'020000 to H'02FFFF
Addresses H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF H'008000 to H'00FFFF H'010000 to H'01FFFF H'020000 to H'02FFFF H'030000 to H'03FFFF H'040000 to H'04FFFF H'050000 to H'05FFFF
Notes: 1. On the H8S/2636, these bits are reserved. 2. Reserved in the H8S/2636 and H8S/2635. 3. Reserved in the H8S/2638, H8S/2639, and H8S/2635.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
FLPWCR—Flash Memory Power Control Register H'FFAC
Bit Initial value Read/Write 7 PDWND 0 R/W 6 ⎯ 0 R 5 ⎯ 0 R 4 ⎯ 0 R 3 ⎯ 0 R 2 ⎯ 0 R 1
Flash Memory
0 ⎯ 0 R
⎯ 0 R
Power-Down Disable 0 1 Transition to flash memory power-down mode enabled Transition to flash memory power-down mode disabled
PORT1—Port 1 Register
Bit Initial value Read/Write 7 P17 ⎯* R 6 P16 ⎯* R 5 P15 ⎯* R 4 P14 ⎯* R
H'FFB0
3 P13 ⎯* R 2 P12 ⎯* R 1 P11 ⎯* R 0 P10 ⎯* R
Port
State of the port 1 pins Note: * Determined by state of pins P17 to P10.
PORT3—Port 3 Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 P35 ⎯* R 4 P34 ⎯* R
H'FFB2
3 P33 ⎯* R 2 P32 ⎯* R 1 P31 ⎯* R 0 P30 ⎯* R
Port
Undefined Undefined
State of the port 3 pins Note: * Determined by state of pins P35 to P30.
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Appendix B Internal I/O Register
PORT4—Port 4 Register
Bit Initial value Read/Write 7 P47 ⎯* R 6 P46 ⎯* R 5 P45 ⎯* R 4 P44 ⎯* R
H'FFB3
3 P43 ⎯* R 2 P42 ⎯* R 1 P41 ⎯* R 0 P40 ⎯* R
Port
State of the port 4 pins Note: * Determined by state of pins P47 to P40.
PORT9—Port 9 Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FFB8
3 P93 ⎯* R 2 P92 ⎯* R 1 P91 ⎯* R 0 P90 ⎯* R
Port
Undefined Undefined Undefined Undefined
State of the port 9 pins Note: * Determined by state of pins P93 to P90.
PORTA—Port A Register
Bit Initial value Read/Write 7 ⎯ ⎯ 6 ⎯ ⎯ 5 ⎯ ⎯ 4 ⎯ ⎯
H'FFB9
3 PA3 ⎯* R 2 PA2 ⎯* R 1 PA1 ⎯* R 0 PA0 ⎯* R
Port
Undefined Undefined Undefined Undefined
State of the port A pins Note: * Determined by state of pins PA3 to PA0.
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Appendix B Internal I/O Register
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
PORTB—Port B Register
Bit Initial value Read/Write 7 PB7 ⎯* R 6 PB6 ⎯* R 5 PB5 ⎯* R 4 PB4 ⎯* R
H'FFBA
3 PB3 ⎯* R 2 PB2 ⎯* R 1 PB1 ⎯* R 0 PB0 ⎯* R
Port
State of the port B pins Note: * Determined by state of pins PB7 to PB0.
PORTC—Port C Register
Bit Initial value Read/Write 7 PC7 ⎯* R 6 PC6 ⎯* R 5 PC5 ⎯* R 4 PC4 ⎯* R
H'FFBB
3 PC3 ⎯* R 2 PC2 ⎯* R 1 PC1 ⎯* R 0 PC0 ⎯* R
Port
State of the port C pins Note: * Determined by state of pins PC7 to PC0.
PORTD—Port D Register
Bit Initial value Read/Write 7 PD7 ⎯* R 6 PD6 ⎯* R 5 PD5 ⎯* R 4 PD4 ⎯* R
H'FFBC
3 PD3 ⎯* R 2 PD2 ⎯* R 1 PD1 ⎯* R 0 PD0 ⎯* R
Port
State of the port D pins Note: * Determined by state of pins PD7 to PD0.
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Appendix B Internal I/O Register
PORTE—Port E Register
Bit Initial value Read/Write 7 PE7 ⎯* R 6 PE6 ⎯* R 5 PE5 ⎯* R 4 PE4 ⎯* R
H'FFBD
3 PE3 ⎯* R 2 PE2 ⎯* R 1 PE1 ⎯* R 0 PE0 ⎯* R
Port
State of the port E pins Note: * Determined by state of pins PE7 to PE0.
PORTF—Port F Register
Bit Initial value Read/Write 7 PF7 ⎯* R 6 PF6 ⎯* R 5 PF5 ⎯* R 4 PF4 ⎯* R
H'FFBE
3 PF3 ⎯* R 2 ⎯ ⎯ 1 ⎯ ⎯ 0 PF0 ⎯* R
Port
Undefined Undefined
State of the port F pins Note: * Determined by state of pins PF7 to PF3, PF0.
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Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
C.1 Port 1 Block Diagrams
Reset
Internal data bus
R Q D P1nDDR C WDDR1 Reset R Q D P1nDR C P1n *1
From internal address bus
Internal address bus
System controller Address output enable PPG module*2 Pulse output enable Pulse output
WDR1
TPU module Output compare Output/PWM output enable Output compare output/ PWM output RDR1
RPOR1
Input capture input
Legend: WDDR1: Write to P1DDR WDR1: Write to P1DR RDR1: Read P1DR RPOR1: Read port 1 n = 0 or 1 Notes: 1. Priority order: Address output > output compare output/PWM output > pulse output > DR output 2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (a) Port 1 Block Diagram (Pins P10 and P11)
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Appendix C I/O Port Block Diagrams
Reset
Internal address bus
WDDR1 Reset R Q D P1nDR C *1 WDR1
Internal data bus
R Q D P1nDDR C
P1n
System controller Address output enable PPG module*2 Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output
RDR1
RPOR1
Input capture input External clock input Legend: WDDR1: WDR1: RDR1: RPOR1: n = 2 or 3
Write to P1DDR Write to P1DR Read P1DR Read port 1
Notes: 1. Priority order: Address output > output compare output/PWM output > pulse output > DR output 2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (b) Port 1 Block Diagram (Pins P12 and P13)
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Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D P14DDR C WDDR1 Reset R Q D P14DR C WDR1
P14 *1
RDR1
RPOR1
Internal data bus
PPG module*2 Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output
Input capture input Interrupt controller IRQ0 interrupt input
Legend: WDDR1: WDR1: RDR1: RPOR1:
Write to P1DDR Write to P1DR Read P1DR Read port 1
Notes: 1. Priority order: output compare output/PWM output > pulse output > DR output 2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (c) Port 1 Block Diagram (Pin P14)
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Appendix C I/O Port Block Diagrams
Reset R Q D P15DDR C WDDR1 Reset R Q D P15DR C WDR1 PPG module*2 Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output RDR1
P15 *1
RPOR1
Internal data bus
Input capture input External clock input Legend: WDDR1: WDR1: RDR1: RPOR1:
Write to P1DDR Write to P1DR Read P1DR Read port 1
Notes: 1. Priority order: output compare output/PWM output > pulse output > DR output 2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (d) Port 1 Block Diagram (Pin P15)
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Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D P16DDR C WDDR1 Reset R Q D P16DR C
*1
P16
WDR1
Internal data bus
PPG module*2 Pulse output enable Pulse output TPU module Output compare Output/PWM output enable Output compare output/ PWM output
RDR1
RPOR1
Input capture input Input controller IRQ1 interrupt input Legend: WDDR1: WDR1: RDR1: RPOR1:
Write to P1DDR Write to P1DR Read P1DR Read port 1
Notes: 1. Priority order: output compare output/PWM output > pulse output > DR output
2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (e) Port 1 Block Diagram (Pin P16)
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H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D P17DDR C WDDR1 Reset R Q D P17DR C
*1
P17
WDR1
Internal data bus
PPG module*2 Pulse output enable Pulse output TPU module Output compare output/ PWM output enable Output compare output/ PWM output Input capture input External clock input
RDR1
RPOR1
Legend: WDDR1: WDR1: RDR1: RPOR1:
Write to P1DDR Write to P1DR Read P1DR Read port 1
Notes: 1. Priority order: output compare output/PWM output > pulse output > DR output
2. The PPG module is not implemented in the H8S/2635 Group.
Figure C-1 (f) Port 1 Block Diagram (Pin P17)
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Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.2
Port 3 Block Diagrams
Reset R Q D P30DDR C *1 WDDR3 REset R Q D P30DR C WDR3 *2 Reset R Q D P30ODR C WODR3 RODR3 SCI module
Serial transmit enable Serial transmit data
P30
Internal data bus
TxD0 RDR3
RPOR3
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-2 (a) Port 3 Block Diagram (Pin P30)
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Appendix C I/O Port Block Diagrams
Reset R Q D P31DDR C *1 WDDR3
Internal data bus
Reset P31 R Q D P31DR C *2 WDR3 Reset R Q D P31ODR C WODR3 RODR3
SCI module RDR3
Serial receive data enable
RPOR3
Serial receive data RxD0
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-2 (b) Port 3 Block Diagram (Pin P31)
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Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset
Internal data bus
4 IIC1 module*
R Q D P32DDR C *2 WDDR3 Reset R Q D P32DR C WDR3 *3 Reset R Q D P32ODR C WODR3 RODR3
P32 *1
SDA1 output IIC1 output enable SDA1 input
SCI module
Serial clock output enable Serial clock output Serial clock input enable
RDR3
RPOR3
Serial clock input
Interrupt controller
IRQ4 interrupt input
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. 2. 3. 4.
Priority order: IIC output > Serial clock output > DR output Output enable signal Open drain control signal The IIC1 module is available as an option in the H8S/2638, H8S/2639, H8S/2630.
Figure C-2 (c) Port 3 Block Diagram (Pin P32)
Page 1430 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D P33DDR C *1 WDDR3 Reset R Q D P33DR C WDR3 *2 Reset R Q D P33ODR C WODR3 RODR3 SCI module
Serial transmit enable Serial transmit data TxD1
P33
RDR3
RPOR3 IIC1 module*3
SCL1 output IIC1 output enable SCL1 input
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. Output enable signal 2. Open drain control signal 3. The IIC1 module is available as an option in the H8S/2638, H8S/2639, H8S/2630.
Figure C-2 (d) Port 3 Block Diagram (Pin P33)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal data bus
Page 1431 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D P34DDR C *1 *3 WDDR3
Internal data bus
Reset P34 R Q D P34DR C WDR3 Reset R Q D P34ODR C WODR3 RODR3
*2
SCI module RDR3
Serial receive data enable
RPOR3
Serial receive data RxD1
IIC0 module*4 SDA0 output IIC0 output enable SDA0 Input
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. 2. 3. 4.
Output enable signal Open drain control signal Priority order: IIC output > DR output The IIC0 module is available as an option in the H8S/2638, H8S/2639, H8S/2630.
Figure C-2 (e) Port 3 Block Diagram (Pin P34)
Page 1432 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D P35DDR C *2 WDDR3
P35 *1 *3
R Q D P35DR C WDR3 Reset R Q D P35ODR C WODR3 RODR3
Internal data bus
SCI module
Serial clock output enable Serial clock output Serial clock input enable Serial clock input
Reset
RDR3
RPOR3
IIC0 module*4 SCL0 output IIC0 output enable SCL0 input Interrupt controller IRQ5 interrupt input
Legend: WDDR3: WDR3: WODR3: RDR3: RPOR3: RODR3:
Write to P3DDR Write to P3DR Write to P3ODR Read P3DR Read port 3 Read P3ODR
Notes: 1. Priority order: IIC output > Serial clock output > DR output 2. Output enable signal 3. Open drain control signal
4. The IIC0 module is available as an option in the H8S/2638, H8S/2639, H8S/2630.
Figure C-2 (f) Port 3 Block Diagram (Pin P35)
REJ09B0103-0800 Rev. 8.00 May 28, 2010 Page 1433 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.3
Port 4 Block Diagram
Internal data bus
A/D converter module
Analog input
RPOR4 P4n
Legend: RPOR4: Read port 4 n = 0 to 5
Figure C-3 (a) Port 4 Block Diagram (Pins P40 to P45)
Internal data bus
A/D converter module
Analog input
RPOR4 P4n
D/A converter module*
Output enable Analog output
Legend: RPOR4: Read port 4 Notes: * The D/A converter is not implemented in the H8S/2635 Group. n = 6, 7
Figure C-3 (b) Port 4 Block Diagram (Pins P46, P47)
Page 1434 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
C.4
Port 9 Block Diagram
Internal data bus
A/D converter module
Analog input
RPOR9 P9n
Legend: RPOR9: Read port 9 n = 0 to 3
Figure C-4 Port 9 Block Diagram (Pins P90 to P93)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1435 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.5
Port A Block Diagram
Reset R Q D PA0PCR C WPCRA RPCRA
Reset R Q D PA0DDR C *1 WDDRA Reset R Q D PA0DR C WDRA Reset R Q D PA0ODR C WODRA RODRA
PA0
Modes 4/5/6 Address enable *2
RDRA
RPORA
Legend: WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA:
Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-5 (a) Port A Block Diagram (Pin PA0)
Page 1436 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
Internal data bus
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D PA1PCR C WPCRA RPCRA
Smart card mode signal TxD output TxD output enable Reset R Q D PA1DDR C WDDRA Reset R Q D PA1DR C WDRA Reset R Q D PA1ODR C WODRA RODRA
*1
PA1
Modes 4/5/6 Address enable *2
RDRA
RPORA
Legend: WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA:
Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-5 (b) Port A Block Diagram (Pin PA1)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
Internal data bus
Page 1437 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D PA2PCR C
RPCRA
RxD input enable Reset R Q D PA2DDR C *1 WDDRA Reset R Q D PA2DR C WDRA Reset R Q D PA2ODR C WODRA RODRA
PA2
Modes 4/5/6 Address enable *2
RDRA
RxD input
RPORA
Legend: WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA:
Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-5 (c) Port A Block Diagram (Pin PA2)
Page 1438 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
WPCRA
Internal data bus
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D PA3PCR C WPCRA RPCRA
SCK input enable
SCK output SCK output enable Reset R Q D PA3DDR C WDDRA Reset R Q D PA3DR C WDRA Reset R Q D PA3ODR C WODRA RODRA
*1
PA3
Modes 4/5/6 Address enable *2
RDRA
SCK input
RPORA
Legend: WDDRA: WDRA: WODRA: WPCRA: RDRA: RPORA: RODRA: RPCRA:
Write to PADDR Write to PADR Write to PAODR Write to PAPCR Read PADR Read port A Read PAODR Read PAPCR
Notes: 1. Output enable signal 2. Open drain control signal
Figure C-5 (d) Port A Block Diagram (Pin PA3)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
Internal data bus
Page 1439 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.6
Port B Block Diagram
Reset R Q D PBnPCR C WPCRB RPCRB
(Output compare) TPU output
TPU output enable
Reset R Q D PBnDDR C WDDRB Reset R Q D PBnDR C WDRB Reset R Q D PBnODR C WODRB RODRB
*1
PBn
Modes 4/5/6 Address enable *2
RDRB
TPU input (Input capture)
RPORB
Legend: Notes: 1. Output enable signal 2. Open drain control signal WDDRB: Write to PBDDR WDRB: Write to PBDR WODRB: Write to PBODR WPCRB: Write to PBPCR RDRB: Read PBDR RPORB: Read port B RODRB: Read PBODR RPCRB: Read PBPCR n = 0 to 7
Figure C-6 Port B Block Diagram (Pins PB0 to PB7)
Page 1440 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
Internal data bus
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
C.7
Port C Block Diagram
Reset R Q D PCnPCR C WPCRC RPCRC
Reset R Q D PCnDDR C *1 WDDRA Reset R Q D PCnDR C WDRA *2 Reset R Q D PCnODR C WODRC RODRC
PCn
Modes 4/5 Mode 6
RDRC
RPORC
Legend: Notes: 1. Output enable signal 2. Open drain control signal WDDRA: Write to PCDDR WDRA: Write to PCDR WODRA: Write to PCODR WPCRA: Write to PCPCR RDRA: Read PCDR RPORA: Read port A RODRA: Read PCODR RPCRA: Read PCPCR n = 0 to 7
Figure C-7 Port C Block Diagram (Pins PC0 to PC7)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal address bus
Internal data bus
Page 1441 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.8
Port D Block Diagram
Reset
WPCRD RPCRD
Reset R Q D PDnDDR C WDDRD Reset R Q D PDnDR C WDRD
External address write
PDn
Mode 7 Modes 4/5/6
External address upper write
RDRD
RPORD
External address upper read
Legend: WDDRD: WDRD: WPCRD: RDRD: RPORD: RPCRD: n = 0 to 7
Write to PDDDR Write to PDDR Write to PDPCR Read PDDR Read port D Read PDPCR
Figure C-8 Port D Block Diagram (Pins PD0 to PD7)
Page 1442 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal upper data bus
R Q D PDnPCR C
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
C.9
Port E Block Diagram
Reset
Internal upper data bus
WPCRE RPCRE
Reset R Q D PEnDDR C WDDRE Reset R Q D PEnDR C WDRE
External address write
PEn
Mode 7 Modes 4/5/6
RDRE
RPORE
External addres lower read
Legend: WDDRE: WDRE: WPCRE: RDRE: RPORE: RPCRE: n = 0 to 7
Write to PEDDR Write to PEDR Write to PEPCR Read PEDR Read port E Read PEPCR
Figure C-9 Port E Block Diagram (Pins PE0 to PE7)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Internal lower data bus
Page 1443 of 1458
R Q D PEnPCR C
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.10
Port F Block Diagrams
Reset R Q D PF0DDR C WDDRF
Reset PF0 R Q D PF0DR C WDRF
RDRF
RPORF
Internal data bus
IRQ interrupt input
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Legend: WDDRF: WDRF: RDRF: RPORF:
Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (a) Port F Block Diagram (Pin PF0)
Page 1444 of 1458
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D PF3DDR C WDDRF Reset R Q D PF3DR C WDRF
PF3
Modes 4/5/6
Internal data bus
Bus controller
LWR output
RDRF
RPORF
ADTRG input IRQ3 interrupt input Legend: WDDRF: WDRF: RDRF: RPORF: Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (b) Port F Block Diagram (Pin PF3)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1445 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D PF4DDR C WDDRF Reset R Q D PF4DR C WDRF
PF4 Modes 4/5/6
Internal data bus
Bus controller HWR output RDRF
RPORF
Legend: WDDRF: WDRF: RDRF: RPORF:
Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (c) Port F Block Diagram (Pin PF4)
Page 1446 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Reset R Q D PF5DDR C WDDRF Reset R Q D PF5DR C WDRF
PF5 Modes 4/5/6
Internal data bus
Bus controller RD output RDRF
RPORF
Legend: WDDRF: WDRF: RDRF: RPORF:
Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (d) Port F Block Diagram (Pin PF5)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1447 of 1458
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Reset R Q D PF6DDR C WDDRF Reset R Q D PF6DR C WDRF
PF6 Modes 4/5/6
Internal data bus
Bus controller AS output RDRF
RPORF
Legend: WDDRF: WDRF: RDRF: RPORF:
Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (e) Port F Block Diagram (Pin PF6)
Page 1448 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
Modes 4/5/6 Reset S* R Q D D PF7DDR C WDDRF Reset R Q D PF7DR C WDRF
PF7
Internal data bus
φ
Page 1449 of 1458
RDRF
RPORF
Legend: WDDRF: WDRF: RDRF: RPORF:
Note: * Set priority Write to PFDDR Write to PFDR Read PFDR Read port F
Figure C-10 (f) Port F Block Diagram (Pin PF7)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Appendix C I/O Port Block Diagrams
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
C.11
Port H Block Diagram
Reset R Q D PHnDDR C WDDRH Reset R Q D PHnDR C WDRH
PHn
Internal data bus
PWM module PWM output enable PWM output
REJ09B0103-0800 Rev. 8.00 May 28, 2010
RDRH
RPORH
Legend: WDDRH: WDRH: RDRH: RPORH: n = 0 to 7
Write to PHDDR Write to PHDR Read PHDR Read port H
Figure C-11 Port H Block Diagram (Pins PH0 to PH7)
Page 1450 of 1458
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix C I/O Port Block Diagrams
C.12
Port J Block Diagram
Reset R Q D PJnDDR C WDDRJ Reset R Q D PJnDR C WDRJ
PJn
Internal data bus
PWM module PWM output enable PWM output
RDRJ
RPORJ
Legend: WDDRJ: Write to PJDDR WDRJ: Write to PJDR RDRJ: Read PJDR RPORJ: Read port J n = 0 to 7
Figure C-12 Port J Block Diagram (Pins PJ0 to PJ7)
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1451 of 1458
Appendix D Pin States
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix D Pin States
D.1 Port States in Each Mode
Table D-1 I/O Port States in Each Processing State
MCU Port Name Operating Pin Name Mode Port 1 4, 5 6 Hardware Standby Mode T Program Execution State Sleep Mode P10 to P13 [Address output] A20 to A23 [Otherwise] I/O port
Reset T
Software Standby Mode P10 to P13 [Address output, OPE = 0] T [Address output, OPE = 1] kept [Otherwise] kept P14 to P17 kept
P14 to P17 I/O port P10 to P17 I/O port I/O port Input port Input port [Address output] A19 to A17 [Otherwise] I/O port
7 Port 3 Port 4 Port 9 Port A 4 to 7 4 to 7 4 to 7 4, 5 6 T T T L T T T T T T
kept kept T T [Address output, OPE = 0] T [Address output, OPE = 1] kept [Otherwise] kept kept [Address output, OPE = 0] T [Address output, OPE = 1] kept [Otherwise] kept kept
7 Port B 4, 5 6
T L T
T T T
I/O port [Address output] A15 to A8 [Otherwise] I/O port
7
T
T
I/O port
Page 1452 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix D Pin States
MCU Port Name Operating Pin Name Mode Port C 4, 5
Reset L
Hardware Standby Mode T
Software Standby Mode [OPE = 0] T [OPE = 1] kept [DDR = 1, OPE = 0] T [DDR = 1, OPE = 1] kept [DDR = 0] kept kept T kept kept T kept [DDR = 0] T [DDR = 1] H [DDR = 0] T [DDR = 1] H [OPE = 0] T [OPE = 1] H kept [OPE = 0] T [OPE = 1] H kept
Program Execution State Sleep Mode A7 to A0
6
T
T
[DDR = 1] A7 to A0 [DDR = 0] I/O port
7 Port D 4 to 6 7 Port E 4 to 6 8 bit bus
T T T T
T T T T T T T
I/O port Data bus I/O port I/O port Data bus I/O port [DDR = 0] T [DDR = 1] Clock output [DDR = 0] T [DDR = 1] Clock output AS
16 bit T bus 7 PF7/φ 4 to 6 T Clock output
7
T
T
PF6/AS
4 to 6
H
T
7 PF5/RD PF4/HWR 4 to 6
T H
T T
I/O port RD, HWR
7
T
T
I/O port
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1453 of 1458
Appendix D Pin States
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
MCU Port Name Operating Pin Name Mode PF3/LWR 4 5 to 6
Reset H T
Hardware Standby Mode T
Software Standby Mode [OPE = 0] T [OPE = 1] H
Program Execution State Sleep Mode LWR [16 Bit bus mode] LWR [Otherwise] I/O port I/O port I/O port I/O port I/O port Tx output Rx output
7 PF0 Port H Port J HTxD0, HTxD1 HRxD0, HRxD1 4 to 7 4 to 7 4 to 7 4 to 7 4 to 7
T T T T H Input
T T T T T T
kept kept kept kept H T
Legend: H: High level L: Low level T: High impedance kept: Input port becomes high-impedance, output port retains state DDR: Data direction register OPE: Output port enable
Page 1454 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Timing of Transition to Hardware Standby Mode (1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low at least 10 states before the STBY signal goes low, as shown below. RES must remain low until STBY signal goes low (delay from STBY low to RES high: 0 ns or more).
STBY t1 ≥ 10 tcyc RES t2 ≥ 0 ns
Figure E-1 Timing of Transition to Hardware Standby Mode (2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do not need to be retained, RES does not have to be driven low as in (1). Timing of Recovery from Hardware Standby Mode Drive the RES signal low and the NMI signal high approximately 100 ns or more before STBY goes high to execute a reset.
STBY t ≥ 100 ns RES tOSC tNMIRH
NMI
Figure E-2 Timing of Recovery from Hardware Standby Mode
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1455 of 1458
Appendix F Product Code Lineup
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix F Product Code Lineup
Table F-1 H8S/2636, H8S/2638, H8S/2639, and H8S/2630 Product Code Lineup
Part No. HD64F2636 Mark Code HD64F2636F HD64F2636UF Mask ROM HD6432636 version HD6432636F HD6432636UF H8S/2638 F-ZTAT version HD64F2638 HD64F2638F HD64F2638UF Functions No subclock function Subclock function No subclock function Subclock function No subclock function 2 or I C bus interface Subclock function, 2 no I C bus interface Packages 128-pin QFP (FP-128B) 128-pin QFP (FP-128B) 128-pin QFP (FP-128B) 128-pin QFP (FP-128B) 128-pin QFP (FP-128B) 128-pin QFP (FP-128B)
Product Type H8S/2636 F-ZTAT version
HD64F2638WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B) Mask ROM HD6432638 version HD6432638F HD6432638UF No subclock function 2 or I C bus interface Subclock function, 2 no I C bus interface 128-pin QFP (FP-128B) 128-pin QFP (FP-128B)
HD6432638WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B) H8S/2639 F-ZTAT version HD64F2639 HD64F2639UF Subclock function, 2 no I C bus interface 128-pin QFP (FP-128B)
HD64F2639WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B) Mask ROM HD6432639 version HD6432639UF Subclock function, 2 no I C bus interface 128-pin QFP (FP-128B)
HD6432639WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B)
Page 1456 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix F Product Code Lineup
Product Type H8S/2630 F-ZTAT version
Part No. HD64F2630
Mark Code HD64F2630F HD64F2630UF
Functions No subclock function 2 or I C bus interface Subclock function, 2 no I C bus interface
Packages 128-pin QFP (FP-128B) 128-pin QFP (FP-128B)
HD64F2630WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B) Mask ROM HD6432630 version HD6432630F HD6432630UF No subclock function 2 or I C bus interface Subclock function, 2 no I C bus interface 128-pin QFP (FP-128B) 128-pin QFP (FP-128B)
HD6432630WF Subclock function and 128-pin QFP 2 I C bus interface (FP-128B) H8S/2635 F-ZTAT version HD64F2635 HD64F2635F HD6432635F HD6432634F Subclock function, 2 no I C bus interface Subclock function, 2 no I C bus interface Subclock function, 2 no I C bus interface 128-pin QFP (FP-128B) 128-pin QFP (FP-128B) 128-pin QFP (FP-128B)
Mask ROM HD6432635 version HD6432634
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Page 1457 of 1458
Appendix G Package Dimensions
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Appendix G Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has Priority. Figure G-1 shows the package dimensions of the H8S/2636, H8S/2638, H8S/2639, H8S/2630, H8S/2635, and H8S/2634.
JEITA Package Code P-QFP128-14x20-0.50 RENESAS Code PRQP0128KB-A Previous Code FP-128B/FP-128BV MASS[Typ.] 1.7g
HD
*1
D 65 64
102 103
NOTE) 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
b1
Reference Symbol
Dimension in Millimeters Min Nom 20 14 2.70 21.8 15.8 22.0 16.0 22.2 16.2 3.15 0.00 0.17 0.10 0.22 0.20 0.12 0.17 0.15 0° 0.5 8° 0.22 0.25 0.27 Max
*2
c1
c
D E A2
128 1 ZD Index mark 38
39
ZE
Terminal cross section
HD HE A A1 bp
F
b1 c
A
A2
c
c1
θ
A1
L L1 e
*3
θ
y
bp
x y ZD ZE L L1 0.3 0.75 0.75 0.5 1.0
0.10 0.10
M
x
Detail F
0.7
Figure G-1 FP-128B Package Dimensions
Page 1458 of 1458
REJ09B0103-0800 Rev. 8.00 May 28, 2010
Renesas 16-Bit Single-Chip Microcomputer Hardware Manual H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group
Publication Date: 1st Edition, December 1999 Rev.8.00, May 28, 2010 Published by: Renesas Electronics Corporation 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 Japan
© 2010 Renesas Electronics Corporation. All rights reserved.
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© 2010 Renesas Electronics Corporation. All rights reserved. Colophon 1.0
H8S/2639, H8S/2638, H8S/2636, H8S/2630, H8S/2635 Group Hardware Manual
REJ09B0103-0800
