DATASHEET
HA-5002
FN2921
Rev 12.00
October 18, 2013
110MHz, High Slew Rate, High Output Current Buffer
The HA-5002 is a monolithic, wideband, high slew rate, high
output current, buffer amplifier.
Utilizing the advantages of the Intersil D.I. technologies, the
HA-5002 current buffer offers 1300V/s slew rate with
110MHz of bandwidth. The 200mA output current capability
is enhanced by a 3 output impedance.
Features
• Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.995
• High input impedance . . . . . . . . . . . . . . . . . . . . . .3000k
• Low output impedance . . . . . . . . . . . . . . . . . . . . . . . . . 3
• Very high slew rate. . . . . . . . . . . . . . . . . . . . . . . 1300V/s
The monolithic HA-5002 will replace the hybrid LH0002 with
corresponding performance increases. These characteristics
range from the 3000k input impedance to the increased
output voltage swing. Monolithic design technologies have
allowed a more precise buffer to be developed with more than
an order of magnitude smaller gain error.
• Very wide bandwidth . . . . . . . . . . . . . . . . . . . . . . 110MHz
The HA-5002 will provide many present hybrid users with a
higher degree of reliability and at the same time increase
overall circuit performance.
Applications
For the military grade product, refer to the HA-5002/883
datasheet.
• 110MHz buffer
• High output current 200mA
• Pulsed output current . . . . . . . . . . . . . . . . . . . . . . . 400mA
• Monolithic construction
• Pb-Free available (RoHS Compliant)
• Line driver
• Data acquisition
• Radar cable driver
• High power current booster
• High power current source
• Sample and holds
• Video products
Ordering Information
PART NUMBER
PART MARKING
TEMP.
RANGE (°C)
-55 to +125
PACKAGE
PKG.
DWG. #
HA2-5002-2
HA2- 5002-2
HA4P5002-5Z (Note 1)
HA4P 5002-5Z
HA9P5002-5Z (Note 1)
5002 5Z
0 to +75
8 Ld SOIC (Pb-free)
M8.15
HA9P5002-9Z (Note 1)
5002 9Z
-40 to +85
8 Ld SOIC (Pb-free)
M8.15
0 to +75
8 Pin Metal Can
T8.C
20 Ld PLCC (Pb-free)
N20.35
NOTE:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020.
FN2921 Rev 12.00
October 18, 2013
Page 1 of 12
HA-5002
Pinouts
6
NC
IN
4
5
V1-
NC
3
OUT
NC
2
1
20
19
8
V1+
NC 4
18 NC
V2- 5
17 V2+
NC 6
16 NC
NC 7
15 NC
NC 8
14 NC
9
10
11
12
13
NC
V2+
3
V1-
7
NC
2
IN
NC
V2-
V1+
OUT
NC
8
IN
1
NC
V1+
FN2921 Rev 12.00
October 18, 2013
HA-5002
(8 PIN METAL CAN)
TOP VIEW
HA-5002
(20 LD PLCC)
TOP VIEW
HA-5002
(8 LD SOIC)
TOP VIEW
V2+
1
7
2
NC
V1-
6
5
3
4
V2-
NC
OUT
NOTE: Case Voltage = Floating
Page 2 of 12
HA-5002
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 44V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V1+ to V1Output Current (Continuous) . . . . . . . . . . . . . . . . . . . . . . . . 200mA
Output Current (50ms On, 1s Off) . . . . . . . . . . . . . . . . . . . . 400mA
Thermal Resistance
JA (°C/W)
JC (°C/W)
Metal Can Package (Notes 3, 4) . . . . .
155
67
PLCC Package (Note 3). . . . . . . . . . . .
74
N/A
SOIC Package (Note 3) . . . . . . . . . . . .
157
N/A
Max Junction Temperature (Hermetic Packages, Note 2). . . . . +175°C
Max Junction Temperature (Plastic Packages, Note 2). . . . . . . +150°C
Max Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Max Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . +300°C
(PLCC and SOIC - Lead Tips Only)
Operating Conditions
Temperature Range
HA-5002-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
HA-5002-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +75°C
HA-5002-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
2. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below +175°C for the
can packages, and below +150°C for the plastic packages.
3. For JA is measured with the component mounted on an evaluation PC board in free air.
4. ForJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
VSUPPLY = 12V to 15V, RS = 50, RL = 1k CL = 10pF, Unless Otherwise Specified
TEST
CONDITIONS
HA-5002-2
TEMP
(°C)
MIN
TYP
HA-5002-5, -9
MAX
MIN
TYP
MAX
UNITS
mV
INPUT CHARACTERISTICS
Offset Voltage
Average Offset Voltage Drift
-
5
20
-
5
20
-
10
30
-
10
30
mV
Full
-
30
-
-
30
-
V/°C
25
-
2
7
-
2
7
A
Full
-
3.4
10
-
2.4
10
A
Full
1.5
3
-
1.5
3
-
M
10Hz-1MHz
25
-
18
-
-
18
-
VP-P
RL = 50
25
-
0.900
-
-
0.900
-
V/V
RL = 100
25
-
0.971
-
-
0.971
-
V/V
RL = 1k
25
-
0.995
-
-
0.995
-
V/V
RL = 1k
Full
0.980
-
-
0.980
-
-
V/V
VIN = 1VP-P
25
-
110
-
-
110
-
MHz
25
-
40
-
-
40
-
A/mA
Bias Current
Input Resistance
Input Noise Voltage
25
Full
TRANSFER CHARACTERISTICS
Voltage Gain
(VOUT = 10V)
-3dB Bandwidth
AC Current Gain
OUTPUT CHARACTERISTICS
RL = 100
25
10
10.7
-
10
11.2
-
V
RL = 1k, VS = 15V
Full
10
13.5
-
10
13.9
-
V
RL = 1k, VS = 12V
Full
10
10.5
-
10
10.5
-
V
VIN = 10V, RL = 40
25
-
220
-
-
220
-
mA
Full
-
3
10
-
3
10
25
-
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