DATASHEET
HIP4081A
FN3659
Rev 8.00
September 15, 2015
80V/2.5A Peak, High Frequency Full Bridge FET Driver
The HIP4081A is a high frequency, medium voltage Full
Bridge N-Channel FET driver IC, available in 20 lead plastic
SOIC and DIP packages. The HIP4081A can drive every
possible switch combination except those which would
cause a shoot-through condition. The HIP4081A can switch
at frequencies up to 1MHz and is well suited to driving Voice
Coil Motors, high-frequency switching power amplifiers, and
power supplies.
For example, the HIP4081A can drive medium voltage brush
motors, and two HIP4081As can be used to drive high
performance stepper motors, since the short minimum
“on-time” can provide fine micro-stepping capability.
Short propagation delays of approximately 55ns maximizes
control loop crossover frequencies and dead-times which
can be adjusted to near zero to minimize distortion, resulting
in rapid, precise control of the driven load.
A similar part, the HIP4080A, includes an on-chip input
comparator to create a PWM signal from an external triangle
wave and to facilitate “hysteresis mode” switching.
The Application Note for the HIP4081A is the AN9405.
Ordering Information
PART
NUMBER
TEMP
RANGE
(°C)
• Independently Drives 4 N-Channel FET in Half Bridge or
Full Bridge Configurations
• Bootstrap Supply Max Voltage to 95VDC
• Drives 1000pF Load at 1MHz in Free Air at 50°C with Rise
and Fall Times of Typically 10ns
• User-Programmable Dead Time
• On-Chip Charge-Pump and Bootstrap Upper Bias
Supplies
• DIS (Disable) Overrides Input Control
• Input Logic Thresholds Compatible with 5V to 15V Logic
Levels
• Very Low Power Consumption
• Undervoltage Protection
• Pb-free Available
Applications
• Medium/Large Voice Coil Motors
• Full Bridge Power Supplies
PACKAGE
PKG.
DWG. #
HIP4081AIP (No longer
available, recommended
replacement: HIP4081AIPZ)
-40 to 85 20 Ld PDIP
HIP4081AIPZ (Note)
-40 to 85 20 Ld PDIP
(Pb-free)
HIP4081AIB
-40 to 85 20 Ld SOIC (W) M20.3
HIP4081AIBZ (Note)
-40 to 85 20 Ld SOIC (W) M20.3
(Pb-free)
E20.3
• Switching Power Amplifiers
• High Performance Motor Controls
• Noise Cancellation Systems
• Battery Powered Vehicles
E20.3
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
FN3659 Rev 8.00
September 15, 2015
Features
• Peripherals
• U.P.S.
Pinout
HIP4081A
(PDIP, SOIC)
TOP VIEW
BHB
1
BHI
2
19
BHS
DIS
3
18
BLO
VSS
4
17
BLS
BLI
5
16
VDD
ALI
6
15
VCC
AHI
7
14
ALS
HDEL
8
13
ALO
LDEL
9
12
AHS
AHB 10
11
AHO
20
BHO
Page 1 of 17
HIP4081A
Application Block Diagram
80V
12V
BHO
BHS
BHI
LOAD
BLO
BLI
HIP4081A
ALI
ALO
AHS
AHI
AHO
GND
Functional Block Diagram
GND
(1/2 HIP4081A)
HIGH VOLTAGE BUS 80VDC
AHB
10
UNDERVOLTAGE
CHARGE
PUMP
LEVEL SHIFT
AND LATCH
DRIVER
11
7
DIS
3
CBS
AHS
VDD 16
AHI
AHO
12
TURN-ON
DELAY
DBS
15
DRIVER
ALI
6
TURN-ON
DELAY
TO VDD (PIN 16)
VCC
ALO
13
ALS
CBF
+12VDC
BIAS
SUPPLY
14
HDEL
8
LDEL
9
VSS
4
FN3659 Rev 8.00
September 15, 2015
Page 2 of 17
HIP4081A
Typical Application
(PWM Mode Switching)
80V
BHO 20
2 BHI
BHS 19
DIS
3 DIS
4 VSS
PWM
INPUT
5 BLI
6 ALI
7 AHI
HIP4081/HIP4081A
1 BHB
12V
8 HDEL
LOAD
BLO 18
BLS 17
VDD 16
VCC 15
12V
ALS 14
ALO 13
9 LDEL
AHS 12
10 AHB
AHO 11
GND
-
TO OPTIONAL
CURRENT CONTROLLER
+
6V
GND
FN3659 Rev 8.00
September 15, 2015
Page 3 of 17
HIP4081A
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V
Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25°C to 125°C)
Voltage on AHS, BHS . . . -6.0V (Transient) to 70V (-55°C to 125°C)
Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient)
Voltage on AHB, BHB . . . . . . . . VAHS, BHS -0.3V to VAHS, BHS +VDD
Voltage on ALO, BLO . . . . . . . . . . . . .VALS, BLS -0.3V to VCC +0.3V
Voltage on AHO, BHO . . . . . . . VAHS, BHS -0.3V to VAHB, BHB +0.3V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
NOTE: All Voltages relative to VSS, unless otherwise specified.
Thermal Resistance (Typical, Note 1)
JA (°C/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
85
DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
Storage Temperature Range . . . . . . . . . . . . . . . . . . . -65°C to 150°C
Operating Max. Junction Temperature . . . . . . . . . . . . . . . . . . 125°C
Lead Temperature (Soldering 10s)). . . . . . . . . . . . . . . . . . . . . 300°C
(For SOIC - Lead Tips Only
Operating Conditions
Supply Voltage, VDD and VCC . . . . . . . . . . . . . . . . . . +9.5V to +15V
Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . . . VAHS, BHS +5V to VAHS, BHS +15V
Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500A to -50A
Operating Ambient Temperature Range . . . . . . . . . . .-40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and
TA = 25°C, Unless Otherwise Specified
TJS = -40°C TO
125°C
TJ = 25°C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
All inputs = 0V
8.5
10.5
14.5
7.5
14.5
mA
Outputs switching f = 500kHz
SUPPLY CURRENTS AND CHARGE PUMPS
VDD Quiescent Current
IDD
VDD Operating Current
IDDO
VCC Quiescent Current
ICC
VCC Operating Current
ICCO
AHB, BHB Quiescent Current Qpump Output Current
AHB, BHB Operating Current
AHS, BHS, AHB, BHB Leakage
Current
AHB-AHS, BHB-BHS Qpump
Output Voltage
9.5
12.5
15.5
8.5
15.5
mA
All Inputs = 0V, IALO = IBLO = 0
-
0.1
10
-
20
A
f = 500kHz, No Load
1
1.25
2.0
0.8
3
mA
All Inputs = 0V, IAHO = IBHO = 0
VDD = VCC = VAHB = VBHB = 10V
-50
-30
-11
-60
-10
A
IAHBO, IBHBO
f = 500kHz, No Load
0.6
1.2
1.5
0.5
1.9
mA
IHLK
VBHS = VAHS = 80V,
VAHB = VBHB = 93V
-
0.02
1.0
-
10
A
IAHB = IAHB = 0, No Load
11.5
12.6
14.0
10.5
14.5
V
IAHB, IBHB
VAHB-VAHS
VBHB-VBHS
INPUT PINS: ALI, BLI, AHI, BHI, AND DIS
Low Level Input Voltage
VIL
Full Operating Conditions
-
-
1.0
-
0.8
V
High Level Input Voltage
VIH
Full Operating Conditions
2.5
-
-
2.7
-
V
-
35
-
-
-
mV
Low Level Input Current
IIL
VIN = 0V, Full Operating Conditions
-130
-100
-75
-135
-65
A
High Level Input Current
IIH
VIN = 5V, Full Operating Conditions
-1
-
+1
-10
+10
A
IHDEL = ILDEL = -100A
4.9
5.1
5.3
4.8
5.4
V
Input Voltage Hysteresis
TURN-ON DELAY PINS: LDEL AND HDEL
LDEL, HDEL Voltage
VHDEL, VLDEL
GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO
Low Level Output Voltage
VOL
IOUT = 100mA
0.7
0.85
1.0
0.5
1.1
V
High Level Output Voltage
VCC-VOH
IOUT = -100mA
0.8
0.95
1.1
0.5
1.2
V
VOUT = 0V
1.7
2.6
3.8
1.4
4.1
A
Peak Pullup Current
FN3659 Rev 8.00
September 15, 2015
IO +
Page 4 of 17
HIP4081A
Electrical Specifications
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K and
TA = 25°C, Unless Otherwise Specified (Continued)
TJS = -40°C TO
125°C
TJ = 25°C
PARAMETER
SYMBOL
Peak Pulldown Current
IO -
TEST CONDITIONS
MIN
MAX
MIN
MAX
UNITS
1.7
2.4
3.3
1.3
3.6
A
Undervoltage, Rising Threshold
UV+
8.1
8.8
9.4
8.0
9.5
V
Undervoltage, Falling Threshold
UV-
7.6
8.3
8.9
7.5
9.0
V
Undervoltage, Hysteresis
HYS
0.25
0.4
0.65
0.2
0.7
V
Switching Specifications
VO UT = 12V
TYP
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K,
CL = 1000pF.
TJS = -40°C
TO 125°C
TJ = 25°C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
Lower Turn-off Propagation Delay
(ALI-ALO, BLI-BLO)
TLPHL
-
30
60
-
80
ns
Upper Turn-off Propagation Delay
(AHI-AHO, BHI-BHO)
THPHL
-
35
70
-
90
ns
Lower Turn-on Propagation Delay
(ALI-ALO, BLI-BLO)
TLPLH
RHDEL = RLDEL = 10K
-
45
70
-
90
ns
Upper Turn-on Propagation Delay
(AHI-AHO, BHI-BHO)
THPLH
RHDEL = RLDEL = 10K
-
60
90
-
110
ns
Rise Time
TR
-
10
25
-
35
ns
Fall Time
TF
-
10
25
-
35
ns
TPWIN-ON
RHDEL = RLDEL = 10K
50
-
-
50
-
ns
Turn-off Input Pulse Width
TPWIN-OFF
RHDEL = RLDEL = 10K
40
-
-
40
-
ns
Turn-on Output Pulse Width
TPWOUT-ON
RHDEL = RLDEL = 10K
40
-
-
40
-
ns
Turn-off Output Pulse Width
TPWOUT-OFF
RHDEL = RLDEL = 10K
30
-
-
30
-
ns
Turn-on Input Pulse Width
Disable Turn-off Propagation Delay
(DIS - Lower Outputs)
TDISLOW
-
45
75
-
95
ns
Disable Turn-off Propagation Delay
(DIS - Upper Outputs)
TDISHIGH
-
55
85
-
105
ns
Disable to Lower Turn-on Propagation Delay
(DIS - ALO and BLO)
TDLPLH
-
40
70
-
90
ns
Refresh Pulse Width (ALO and BLO)
TREF-PW
240
410
550
200
600
ns
TUEN
-
450
620
-
690
ns
Disable to Upper Enable (DIS - AHO and BHO)
TRUTH TABLE
INPUT
NOTE:
OUTPUT
ALI, BLI
AHI, BHI
U/V
DIS
ALO, BLO
AHO, BHO
X
X
X
1
0
0
1
X
0
0
1
0
0
1
0
0
0
1
0
0
0
0
0
0
X
X
1
X
0
0
X signifies that input can be either a “1” or “0”.
FN3659 Rev 8.00
September 15, 2015
Page 5 of 17
HIP4081A
Pin Descriptions
PIN
NUMBER
SYMBOL
DESCRIPTION
1
BHB
B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30A out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.
2
BHI
B High-side Input. Logic level input that controls BHO driver (Pin 20). BLI (Pin 5) high level input overrides BHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides BHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
3
DIS
DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs.
When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to
15V (no greater than VDD).
4
VSS
Chip negative supply, generally will be ground.
5
BLI
B Low-side Input. Logic level input that controls BLO driver (Pin 18). If BHI (Pin 2) is driven high or not connected
externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than VDD).
6
ALI
A Low-side Input. Logic level input that controls ALO driver (Pin 13). If AHI (Pin 7) is driven high or not connected
externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than VDD).
7
AHI
A High-side Input. Logic level input that controls AHO driver (Pin 11). ALI (Pin 6) high level input overrides AHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides AHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than VDD).
8
HDEL
High-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both high-side drivers. The low-side drivers turn-off with no adjustable delay, so the HDEL resistor guarantees no
shoot-through by delaying the turn-on of the high-side drivers. HDEL reference voltage is approximately 5.1V.
9
LDEL
Low-side turn-on DELay. Connect resistor from this pin to VSS to set timing current that defines the turn-on delay of
both low-side drivers. The high-side drivers turn-off with no adjustable delay, so the LDEL resistor guarantees no
shoot-through by delaying the turn-on of the low-side drivers. LDEL reference voltage is approximately 5.1V.
10
AHB
A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30A out of this pin to
maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.
11
AHO
A High-side Output. Connect to gate of A High-side power MOSFET.
12
AHS
A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.
13
ALO
A Low-side Output. Connect to gate of A Low-side power MOSFET.
14
ALS
A Low-side Source connection. Connect to source of A Low-side power MOSFET.
15
VCC
Positive supply to gate drivers. Must be same potential as VDD (Pin 16). Connect to anodes of two bootstrap diodes.
16
VDD
Positive supply to lower gate drivers. Must be same potential as VCC (Pin 15). De-couple this pin to VSS (Pin 4).
17
BLS
B Low-side Source connection. Connect to source of B Low-side power MOSFET.
18
BLO
B Low-side Output. Connect to gate of B Low-side power MOSFET.
19
BHS
B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.
20
BHO
B High-side Output. Connect to gate of B High-side power MOSFET.
FN3659 Rev 8.00
September 15, 2015
Page 6 of 17
HIP4081A
Timing Diagrams
X = A OR B, A AND B HALVES OF BRIDGE CONTROLLER ARE INDEPENDENT
TLPHL
THPHL
U/V = DIS = 0
XLI
XHI
XLO
XHO
THPLH
TLPLH
TR
(10% - 90%)
TF
(10% - 90%)
(10% - 90%)
(10% - 90%)
FIGURE 1. INDEPENDENT MODE
U/V = DIS = 0
XLI
XHI = HI OR NOT CONNECTED
XLO
XHO
FIGURE 2. BISTATE MODE
TDLPLH
TDIS
U/V OR DIS
TREF-PW
XLI
XHI
XLO
XHO
TUEN
FIGURE 3. DISABLE FUNCTION
FN3659 Rev 8.00
September 15, 2015
Page 7 of 17
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 100K
and TA = 25°C, Unless Otherwise Specified
11.0
IDD SUPPLY CURRENT (mA)
IDD SUPPLY CURRENT (mA)
14.0
12.0
10.0
8.0
6.0
4.0
10.0
9.5
9.0
8.5
8.0
2.0
6
8
10
12
VDD SUPPLY VOLTAGE (V)
0
14
100
200
300
400
500
600
700
800
900 1000
SWITCHING FREQUENCY (kHz)
FIGURE 4. QUIESCENT IDD SUPPLY CURRENT vs VDD SUPPLY
VOLTAGE
FIGURE 5. IDDO, NO-LOAD IDD SUPPLY CURRENT vs
FREQUENCY (kHz)
5.0
30.0
125°C
25.0
ICC SUPPLY CURRENT (mA)
FLOATING SUPPLY BIAS CURRENT (mA)
10.5
20.0
15.0
10.0
5.0
0.0
0
100
200 300
400
500
600
700
800
0°C
3.0
-40°C
2.0
1.0
0
100
200
300
400
500
600
700
800
900 1000
SWITCHING FREQUENCY (kHz)
FIGURE 6. SIDE A, B FLOATING SUPPLY BIAS CURRENT vs
FREQUENCY (LOAD = 1000pF)
FIGURE 7. ICCO, NO-LOAD ICC SUPPLY CURRENT vs
FREQUENCY (kHz) TEMPERATURE
-90
LOW LEVEL INPUT CURRENT (A)
2.5
FLOATING SUPPLY BIAS CURRENT (mA)
25°C
0.0
900 1000
SWITCHING FREQUENCY (kHz)
2
1.5
1
0.5
0
75°C
4.0
200
600
800
400
SWITCHING FREQUENCY (kHz)
1000
FIGURE 8. IAHB, IBHB, NO-LOAD FLOATING SUPPLY BIAS
CURRENT vs FREQUENCY
FN3659 Rev 8.00
September 15, 2015
-100
-110
-120
-50
-25
0
25
50
75
JUNCTION TEMPERATURE (°C)
100
125
FIGURE 9. ALI, BLI, AHI, BHI LOW LEVEL INPUT CURRENT IIL
vs TEMPERATURE
Page 8 of 17
HIP4081A
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K
and TA = 25°C, Unless Otherwise Specified
80
15.0
14.0
PROPAGATION DELAY (ns)
NO-LOAD FLOATING CHARGE PUMP VOLTAGE (V)
Typical Performance Curves
13.0
12.0
11.0
10.0
-40
-20
0
20
40
60
80
100
70
60
50
40
30
-40
120
-20
0
JUNCTION TEMPERATURE (°C)
FIGURE 10. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP
VOLTAGE vs TEMPERATURE
60
80
100
120
80
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
40
FIGURE 11. UPPER DISABLE TURN-OFF PROPAGATION
DELAY TDISHIGH vs TEMPERATURE
525
500
475
450
425
-50
20
JUNCTION TEMPERATURE (°C)
-25
0
25
50
75
100
70
60
50
40
30
125 150
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
FIGURE 12. DISABLE TO UPPER ENABLE, TUEN,
PROPAGATION DELAY vs TEMPERATURE
FIGURE 13. LOWER DISABLE TURN-OFF PROPAGATION
DELAY TDISLOW vs TEMPERATURE
80
450
PROPAGATION DELAY (ns)
REFRESH PULSE WIDTH (ns)
70
425
400
375
350
-50
-25
0
25
50
75
100
JUNCTION TEMPERATURE (°C)
FIGURE 14. TREF-PW REFRESH PULSE WIDTH vs
TEMPERATURE
FN3659 Rev 8.00
September 15, 2015
125 150
60
50
40
30
20
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
FIGURE 15. DISABLE TO LOWER ENABLE TDLPLH
PROPAGATION DELAY vs TEMPERATURE
Page 9 of 17
HIP4081A
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL = 10K
and TA = 25°C, Unless Otherwise Specified (Continued)
80
80
70
70
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
Typical Performance Curves
60
50
40
30
50
40
30
20
-40
-20
0
20
40
60
80
100
20
-40
120
JUNCTION TEMPERATURE (°C)
-20
20
40
60
80
100
120
FIGURE 17. UPPER TURN-ON PROPAGATION DELAY THPLH vs
TEMPERATURE
80
70
70
PROPAGATION DELAY (ns)
80
60
50
40
60
50
40
30
30
20
20
-40
-20
0
20
40
60
80
100
-40
120
-20
FIGURE 18. LOWER TURN-OFF PROPAGATION DELAY TLPHL
vs TEMPERATURE
12.5
12.5
TURN-ON RISE TIME (ns)
13.5
11.5
10.5
9.5
-20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
120
FIGURE 20. GATE DRIVE FALL TIME TF vs TEMPERATURE
FN3659 Rev 8.00
September 15, 2015
20
40
60
80
100
120
FIGURE 19. LOWER TURN-ON PROPAGATION DELAY TLPLH vs
TEMPERATURE
13.5
8.5
-40
0
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
GATE DRIVE FALL TIME (ns)
0
JUNCTION TEMPERATURE (°C)
FIGURE 16. UPPER TURN-OFF PROPAGATION DELAY THPHL vs
TEMPERATURE
PROPAGATION DELAY (ns)
60
11.5
10.5
9.5
8.5
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE (°C)
FIGURE 21. GATE DRIVE RISE TIME TR vs TEMPERATURE
Page 10 of 17
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K and TA = 25°C, Unless Otherwise Specified
1500
1250
5.5
VCC - VOH (mV)
HDEL, LDEL INPUT VOLTAGE (V)
6.0
5.0
-40°C
0°C
500
25°C
250
-20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
75°C
125°C
0
10
120
FIGURE 22. VLDEL, VHDEL VOLTAGE vs TEMPERATURE
12
14
BIAS SUPPLY VOLTAGE (V)
FIGURE 23. HIGH LEVEL OUTPUT VOLTAGE VCC - VOH vs BIAS
SUPPLY AND TEMPERATURE AT 100mA
3.5
1500
GATE DRIVE SINK CURRENT (A)
1250
1000
VOL (mV)
750
4.5
4.0
-40
750
-40°C
500
0°C
25°C
250
75°C
3.0
2.5
2.0
1.5
1.0
0.5
125°C
0
10
0.0
6
12
14
BIAS SUPPLY VOLTAGE (V)
7
8
9
10
11
12
13
VDD , VCC, VAHB , VBHB (V)
14
15
16
FIGURE 25. PEAK PULLDOWN CURRENT IO vs BIAS SUPPLY
VOLTAGE
FIGURE 24. LOW LEVEL OUTPUT VOLTAGE VOL vs BIAS
SUPPLY AND TEMPERATURE AT 100mA
3.5
500
LOW VOLTAGE BIAS CURRENT (mA)
GATE DRIVE SINK CURRENT (A)
1000
3.0
2.5
2.0
1.5
1.0
0.5
0.0
6
7
8
9
10
11
12
13
14
15
VDD, VCC, VAHB, VBHB (V)
FIGURE 26. PEAK PULLUP CURRENT IO+ vs BIAS SUPPLY
VOLTAGE
FN3659 Rev 8.00
September 15, 2015
16
10,000pF
200
100
3,000pF
50
1,000pF
20
100pF
10
5
2
1
0.5
0.2
0.1
1
2
5
10
20
50
100
200
500 1000
SWITCHING FREQUENCY (kHz)
FIGURE 27. LOW VOLTAGE BIAS CURRENT IDD (LESS
QUIESCENT COMPONENT) vs FREQUENCY AND
GATE LOAD CAPACITANCE
Page 11 of 17
HIP4081A
Typical Performance Curves
VDD = VCC = VAHB = VBHB = 12V, VSS = VALS = VBLS = VAHS = VBHS = 0V, RHDEL = RLDEL =
100K and TA = 25°C, Unless Otherwise Specified (Continued)
1000
LEVEL-SHIFT CURRENT (A)
500
200
100
50
20
10
10
20
50
100
200
500
1000
SWITCHING FREQUENCY (kHz)
FIGURE 28. HIGH VOLTAGE LEVEL-SHIFT CURRENT vs FREQUENCY AND BUS VOLTAGE
150
UV+
120
8.8
DEAD-TIME (ns)
BIAS SUPPLY VOLTAGE, VDD (V)
9.0
8.6
UV-
90
60
8.4
30
8.2
50
25
0
25
50
75
100
125
150
TEMPERATURE (°C)
FIGURE 29. UNDERVOLTAGE LOCKOUT vs TEMPERATURE
FN3659 Rev 8.00
September 15, 2015
0
10
50
100
150
200
HDEL/LDEL RESISTANCE (k)
250
FIGURE 30. MINIMUM DEAD-TIME vs DEL RESISTANCE
Page 12 of 17
IN1
POWER SECTION
+12V
B+
Q1
CONTROL LOGIC
SECTION
1
JMPR1
2
U2
+
C6
JMPR5
R29
JMPR2
12
U2
IN+/ALI
JMPR3
HEN/BHI
6
U2
CD4069UB
11
10
U2
R34
R33
JMPR4
CW
CD4069UB
1
6 IN+/ALI
7 IN-/AHI
VCC 15
ALS 14
8 HDEL
9 LDEL
ALO 13
AHS 12
DD
R22
3
L1
Q2
+12V
R23
CW
1
AO
2
L2
C1
1
Q4
R24
AHO 11
BO
C2
3
2
1
3
CR1
2
2
BLS 17
16
V
2
1
3
3
IN-/AHI
4 V
SS
5 OUT/BLI
10 AHB
Q3
3
U1
C4
1 BHB
BHO 20
2 HEN/BHI BHS 19
3 DIS
BLO 18
OUT/BLI
CD4069UB
5
CR2
C8
1
HIP4080A/81A
CD4069UB
13
R21
DRIVER SECTION
2
C3
CX
CY
R30
R31
C5
ENABLE IN
I
R32
3
U2
4
COM
O
ALS
BLS
NOTES:
CD4069UB
1. DEVICE CD4069UB PIN 7 = COM, PIN 14 = +12V.
9
U2
8
CD4069UB
O
2. COMPONENTS L1, L2, C1, C2, CX, CY, R30, R31, NOT SUPPLIED.
REFER TO APPLICATION NOTE FOR DESCRIPTION OF INPUT
LOGIC OPERATION TO DETERMINE JUMPER LOCATIONS FOR
JMPR1 - JMPR4.
FIGURE 31. HIP4081A EVALUATION PC BOARD SCHEMATIC
HIP4081A
FN3659 Rev 8.00
September 15, 2015
IN2
Page 13 of 17
HIP4081A
FN3659 Rev 8.00
September 15, 2015
C1
R26
COM
C8
C6
R28
R27
B+
+
CR2
R32
+
JMPR5
+12V
C7
R29
GND
AO
Q1
C4
BHO
U1
Q3
1
R22
1
JMPR1
JMPR2
JMPR3
JMPR4
I
O
IN2
ALS
ALO
C2
Q2
R23
Q4
1
1
R21
CY
CX
FIGURE 32. HIP4081A EVALUATION BOARD SILKSCREEN
R31
R34
R30
CR1
R33
BLS
C3
C5
ALS
AHO
LDEL
HDEL
O
L2
BLO
BLS
L1
IN1
HIP4080/81
R24
DIS
U2
BO
Page 14 of 17
HIP4081A
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
September 15, 2015
REVISION
CHANGE
FN3659.8 Updated Ordering Information Table on page 1.
Added Revision History and About Intersil sections.
Updated POD M20.3 from rev 1 to rev 3. Changes since rev 1:
Top View:
Corrected "7.50 BSC" to "7.60/7.40" (no change from rev 2; error was introduced in conversion)
Changed "10.30 BSC" to "10.65/10.00" (no change from rev 2; error was introduced in conversion)
Side View:
Changed "12.80 BSC" to "13.00/12.60" (no change from rev 2; error was introduced in conversion)
Changed "2.65 max" to "2.65/2.35" (no change from rev 2; error was introduced in conversion)
Changed Note 1 from "ANSI Y14.5M-1982." to "ASME Y14.5M-1994"
Updated to new POD format by moving dimensions from table onto drawing and adding land pattern
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
FN3659 Rev 8.00
September 15, 2015
Page 15 of 17
HIP4081A
Dual-In-Line Plastic Packages (PDIP)
E20.3 (JEDEC MS-001-AD ISSUE D)
N
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.55
1.77
8
eA
C
0.008
0.014
C
D
0.980
1.060
eB
NOTES:
0.355
-
26.9
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
0.204
24.89
0.100 BSC
eA
0.300 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eB
-
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
L
0.115
N
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
20
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
20
6
10.92
7
3.81
4
9
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
© Copyright Intersil Americas LLC 2003-2015. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN3659 Rev 8.00
September 15, 2015
Page 16 of 17
HIP4081A
Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11
20
INDEX
AREA
7.60
7.40
1
2
10.65
10.00
0.25 (0.10) M B M
3
3
TOP VIEW
13.00
12.60
SEATING PLANE
2
2.65
2.35
5
0.75
1.27
BSC
0.49
0.35
7
0.25 (0.10) M
0.25
0.30
MAX
C A M B S
1.27
0.40
x 45°
8°
MAX
0.10 (0.004)
SIDE VIEW
0.32
0.23
DETAIL "X"
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
(0.60)
1.27 BSC
2. Dimension does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
20
(2.00)
3. Dimension does not include interlead lash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
(9.40mm)
5. Dimension is the length of terminal for soldering to a substrate.
6. Terminal numbers are shown for reference only.
7. The lead width as measured 0.36mm (0.14 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
8. Controlling dimension: MILLIMETER.
1
2
3
TYPICAL RECOMMENDED LAND PATTERN
FN3659 Rev 8.00
September 15, 2015
9. Dimensions in ( ) for reference only.
10. JEDEC reference drawing number: MS-013-AC.
Page 17 of 17
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