Datasheet
ICL3207E
±15kV ESD Protected, +3V to +5.5V, Low Power, 250kbps, RS-232
Transmitter/Receiver
The ICL3207E is a 3V to 5.5V powered RS-232
transmitter/receiver that meets ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. The
ICL3207E features five transmitters and
three receivers. It provides ±15kV ESD protection
(IEC61000-4-2 Air Gap) and ±15kV Human Body
Model protection on transmitter outputs and receiver
inputs (RS-232 pins). Targeted applications are ISDN
Terminal Adapters (TAs), PDAs, Palmtops,
peripherals, and notebook and laptop computers
where the low operational power consumption and
even lower standby power consumption is critical.
Small footprint packaging and the use of small, low
value capacitors ensure board space savings. Data
rates greater than 250kbps are ensured at worst case
load conditions. The ICL3207E is fully compatible with
3.3V only systems, mixed 3.3V and 5V systems, and
5V only systems. The ICL3207E is a lower power,
pin-for-pin replacement for the MAX207E, HIN207E,
and HIN237E.
Table 1 summarizes the features of the ICL3207E.
AN9863 summarizes the features of each device in
the ICL32xxE 3V family.
Related Literature
For a full list of related documents, visit our website:
• ICL3207E device page
Table 1.
Features
• Pb-free (RoHS compliant)
• ESD protection for RS-232 I/O pins to ±15kV
(IEC61000)
• 5V lower power replacement for MAX207E,
HIN207E, and HIN237E
• Meets EIA/TIA-232 and V.28/V.24 specifications
at 3V
• Latch-up free
• On-chip voltage converters require only four
external 0.1µF capacitors
• RS-232 compatible with VCC = 2.7V
• Receiver hysteresis for improved noise immunity
• Ensured minimum data rate: 250kbps
• Ensured minimum slew rate: 6V/µs
• Wide power supply range: Single +3V to +5.5V
Applications
• Battery powered, hand-held, and portable
equipment
• Laptop computers, notebooks, and Palmtops
• Modems, printers, and other peripherals
• ISDN Terminal Adapters (TAs) and set top boxes
Summary of Features
Part Number
ICL3207E
FN4914 Rev.7.00
May.20.19
No. of
Tx
No. of
Rx
No. of Monitor Rx
(ROUTB)
Data Rate
(kbps)
Rx Enable
Function?
Manual
Powerdown?
Automatic
Powerdown
Function?
5
3
0
250
No
No
No
Page 1 of 18
ICL3207E
Contents
1.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
1.3
1.4
2.
Typical Operating Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
4
4
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
2.2
2.3
2.4
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5
5
6
3.
Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.
Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
4.1.1
4.2
4.3
4.4
4.4.1
4.5
4.6
4.7
4.8
4.9
5.
Charge Pump. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Charge Pump Abs Max Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Transmitters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Low Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Low Power, Pin Compatible Replacement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power Supply Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operation Down to 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
High Data Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Interconnection with 3V and 5V Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
±15kV ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1
5.2
5.3
5.4
Human Body Model (HBM) Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IEC61000-4-2 Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air-Gap Discharge Test Method. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact Discharge Test Method. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13
13
13
6.
Die Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.
Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FN4914 Rev.7.00
May.20.19
Page 2 of 18
ICL3207E
1.1
Overview
Typical Operating Circuit
VCC †
C3 (Optional Connection)
+
0.1µF
C1 †
+
C2 †
+
T1IN
T2IN
T3IN
T4IN
TTL/CMOS
Logic Levels
T5IN
R1OUT
10
12
13
14
C1+
+
1.
1. Overview
9
VCC
V+
R3OUT
+
C1C2+
V-
C2-
7
15
+
T1
2
T2
3
18
T3
1
19
T4
24
21
T5
20
6
4
5
C3 †
C4 †
T1OUT
T2OUT
T3OUT
RS-232
Levels
T4OUT
T5OUT
R1IN
5kΩ
R1
R2OUT
11
22
23
R2
5kΩ
R3
5kΩ
17
16
R2IN
RS-232
Levels
R3IN
GND
† - For VCC = 3.3V, C1 - C4 = 0.1µF or 0.22µF
For VCC = 5V, C1 - C4 = 0.1µF or 1µF
1.2
8
Ordering Information
Part Number
(Notes 2, 3)
Part Marking
Temp.
Range (°C)
Tape and Reel
(Units) (Note 1)
Package (RoHS
Compliant)
Pkg.
Dwg. #
ICL3207ECAZ
ICL 3207ECAZ
0 to +70
-
24 Ld SSOP
M24.209
ICL3207ECAZ-T
ICL 3207ECAZ
0 to +70
1k
24 Ld SSOP
M24.209
ICL3207ECBZ
ICL3207ECBZ
0 to +70
-
24 Ld SOIC
M24.3
ICL3207ECBZ-T
ICL3207ECBZ
0 to +70
1k
24 Ld SOIC
M24.3
Notes:
1. See TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the ICL3207E device page. For more information about MSL, see TB363.
FN4914 Rev.7.00
May.20.19
Page 3 of 18
ICL3207E
1.3
1. Overview
Pinout
24 Ld SOIC, SSOP
Top View
T3OUT
1
24 T4OUT
T1OUT
2
23 R2IN
T2OUT
3
22 R2OUT
R1IN 4
R1OUT
5
20 T5OUT
T2IN 6
19 T4IN
T1IN 7
18 T3IN
GND
8
17 R3OUT
VCC
9
16 R3IN
C1+ 10
1.4
21 T5IN
15 V-
V+ 11
14 C2-
C1- 12
13 C2+
Pin Descriptions
Pin
Function
VCC
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
T1IN, T2IN, T3IN, T4IN, T5IN TTL/CMOS compatible transmitter inputs.
T1OUT, T2OUT, T3OUT,
T4OUT, T5OUT
R1IN, R2IN, R3IN
R1OUT, R2OUT, R3OUT
FN4914 Rev.7.00
May.20.19
±15kV ESD protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
Page 4 of 18
ICL3207E
2.
2. Specifications
Specifications
2.1
Absolute Maximum Ratings
Minimum
Maximum
Unit
VCC to GND
Parameter
-0.3
+6
V
V+ to GND
-0.3
+7
V
V- to GND
+0.3
-7
V
+14
V
+6
V
±25
V
±13.2
V
VCC + 0.3
V
V+ to VInput Voltages
-0.3
TIN
RIN
Output Voltages
TOUT
-0.3
ROUT
Short-Circuit Duration
Continuous
TOUT
See “ESD Performance” on page 6
ESD Rating
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely
impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
Thermal Resistance (Typical) (Note 4)
θJA (°C/W)
24 Ld SOIC Package
75
24 Ld SSOP Package
100
Note:
4. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details.
Parameter
Minimum
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
-65
Pb-Free Reflow Profile
2.3
Maximum
Unit
+150
°C
+150
°C
see TB493
Recommended Operating Conditions
Parameter
Minimum
Maximum
Unit
0
+70
°C
Temperature Range
ICL3207ECx
FN4914 Rev.7.00
May.20.19
Page 5 of 18
ICL3207E
2.4
2. Specifications
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at TA = 25°C
Parameter
Temp
(°C)
Min
Typ
Max
Unit
25
-
0.3
1.0
mA
Full
-
-
0.8
V
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
Test Conditions
DC Characteristics
Supply Current
All Outputs Unloaded
Transmitter Inputs and Receiver Outputs
Input Logic Threshold Low
TIN
Input Logic Threshold High
TIN
Input Leakage Current
TIN
Full
-
±0.01
±1.0
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
VCC - 0.6 VCC - 0.1
Receiver Inputs
Input Voltage Range
Full
-25
-
25
V
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
25
0.8
1.5
-
V
VCC = 3.3V
25
-
1.5
2.4
V
VCC = 5.0V
25
-
1.8
2.4
V
Input Hysteresis
25
-
0.3
-
V
Input Resistance
25
3
5
7
kΩ
Input Threshold Low
Input Threshold High
Transmitter Outputs
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
W
Full
-
±35
±60
mA
VCC = 3.15V, C1 - C4 = 0.1µF, RL = 3kΩCL = 1000pF
Full
250
500
-
kbps
VCC = 3.0V, C1 - C4 = 0.22µF, RL = 3kΩCL = 1000pF
Full
250
286
-
kbps
VCC ≥ 4.5V, C1 - C4 = 0.1µF, RL = 3kΩCL = 1000pF
Full
250
310
-
kbps
Receiver Input to Receiver
Output, CL = 150pF
tPHL
25
-
0.3
-
µs
tPLH
25
-
0.3
-
µs
Output Short-Circuit Current
Timing Characteristics
Maximum Data Rate
(One Transmitter Switching)
Receiver Propagation Delay
Transmitter Skew
tPHL - tPLH
Full
-
200
1000
ns
Receiver Skew
tPHL - tPLH
Full
-
100
500
ns
Transition Region Slew Rate
VCC = 3.3V, RL = 3kΩto 7kΩ
Measured From +3V to -3V or
-3V to +3V
CL = 200pF to 2500pF
25
4
15
30
V/µs
CL = 200pF to 1000pF
25
6
15
30
V/µs
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model
25
-
±15
-
kV
Human Body Model
25
-
±2
-
kV
ESD Performance
RS-232 Pins (TOUT, RIN)
All Other Pins
FN4914 Rev.7.00
May.20.19
Page 6 of 18
ICL3207E
3.
3. Typical Performance Curves
Typical Performance Curves
VCC = 3.3V, TA = 25°C
6.0
25
VOUT+
20
2.0
Slew Rate (V/µs)
Transmitter Output Voltage (V)
4.0
1 Transmitter at 250kbps
Other Transmitters at 30kbps
0
-2.0
15
+Slew
10
VOUT -
-4.0
-Slew
-Slew
-6.0
0
1000
2000
3000
4000
5
5000
0
1000
2000
3000
Figure 1. Transmitter Output Voltage vs Load
Capacitance
3.5
No Load
All Outputs Static
1 Transmitter Switching
3.0
250kbps
Supply Current (mA)
Supply Current (mA)
50
40
35
120kbps
30
25
5000
Figure 2. Slew Rate vs Load Capacitance
55
45
4000
Load Capacitance (pF)
Load Capacitance (pF)
20kbps
2.5
2.0
1.5
1.0
0.5
20
15
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Figure 3. Supply Current vs Load Capacitance When
Transmitting Data
FN4914 Rev.7.00
May.20.19
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Figure 4. Supply Current vs Supply Voltage
Page 7 of 18
ICL3207E
4.
4. Application Information
Application Information
The ICL3207E operates from a single +3V to +5.5V power supply, ensures a 250kbps minimum data rate,
requires only four small external 0.1µF capacitors, features low power consumption, and meets all ElA RS-232C
and V.28 specifications.
4.1
Charge Pump
The ICL3207E uses regulated on-chip dual charge pumps as voltage doublers. It uses voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as low as 3V. The charge pumps allow the ICL3207E to
maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient
on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter
functions at VCC = 3.3V. See “Capacitor Selection” on page 10 and Table 5 on page 10 for capacitor
recommendations for other operating conditions. The charge pumps operate discontinuously (turning off as soon
as the V+ and V- supplies are pumped up to the nominal values) and provide significant power savings.
4.1.1 Charge Pump Abs Max Ratings
The ICL3207E is fully characterized for 3.0V to 3.6V operation, and at critical points for 4.5V to 5.5V operation.
Furthermore, load conditions were favorable using static logic states only.
The specified maximum values for V+ and V- are +7V and -7V, respectively. These limits apply for VCC values set
to 3.0V and 3.6V (see Table 2). For VCC values set to 4.5V and 5.5V, the maximum values for V+ and V- can
approach +9V and -7V, respectively (Table 3 on page 9). The breakdown characteristics for V+ and V- were
measured with ±13V.
Table 2.
V+ and V- Values for VCC = 3.0V to 3.6V
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN
(Logic State)
0.1
0.1
Open
H
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
FN4914 Rev.7.00
May.20.19
V+ (V)
V- (V)
VCC = 3.0V
VCC = 3.6V
VCC = 3.0V
VCC = 3.6V
5.80
6.56
-5.60
-5.88
L
5.80
6.56
-5.60
-5.88
2.4kbps
5.80
6.56
-5.60
-5.88
H
5.88
6.60
-5.56
-5.92
L
5.76
6.36
-5.56
-5.76
2.4kbps
6.00
6.64
-5.64
-5.96
H
5.68
6.00
-5.60
-5.60
L
5.68
6.00
-5.60
-5.60
2.4kbps
5.68
6.00
-5.60
-5.60
H
5.76
6.08
-5.64
-5.64
L
5.68
6.04
-5.60
-5.60
2.4kbps
5.84
6.16
-5.64
-5.72
H
5.88
6.24
-5.60
-5.60
L
5.88
6.28
-5.60
-5.64
2.4kbps
5.80
6.20
-5.60
-5.60
H
5.88
6.44
-5.64
-5.72
L
5.88
6.04
-5.64
-5.64
2.4kbps
5.92
6.40
-5.64
-5.64
Page 8 of 18
ICL3207E
Table 3.
4. Application Information
V+ and V- Values for VCC = 4.5V to 5.5V
V+ (V)
V- (V)
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN
(Logic State)
0.1
0.1
Open
H
7.44
8.48
-6.16
-6.40
L
7.44
8.48
-6.16
-6.44
2.4kbps
7.44
8.48
-6.17
-6.44
H
7.76
8.88
-6.36
-6.72
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
VCC = 4.5V
VCC = 5.5V
VCC = 4.5V
VCC = 5.5V
L
7.08
8.00
-5.76
-5.76
2.4kbps
7.76
8.84
-6.40
-6.64
H
6.44
6.88
-5.80
-5.88
L
6.48
6.88
-5.84
-5.88
2.4kbps
6.44
6.88
-5.80
-5.88
H
6.64
7.28
-5.92
-6.04
L
6.24
6.60
-5.52
-5.52
2.4kbps
6.72
7.16
-5.92
-5.96
H
6.84
7.60
-5.76
-5.76
L
6.88
7.60
-5.76
-5.76
2.4kbps
6.92
7.56
-5.72
-5.76
H
7.28
8.16
-5.80
-5.92
L
6.44
6.84
-5.64
-6.84
2.4kbps
7.08
7.76
-5.80
-5.80
The resulting new maximum voltages at V+ and V- are listed in Table 4.
Table 4.
4.2
New Measured Withstanding Voltages
V+, V- to Ground
±13V
V+ to V-
20V
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. The transmitters are coupled with the on-chip ±5.5V supplies to deliver true RS-232 levels across a
wide range of single supply system voltages.
The ICL3207E ensures a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one
transmitter operating at full speed. Under more typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one
transmitter easily operates at 800kbps.
Transmitter inputs float if they are unconnected and can cause ICC increases. Connect unused inputs to GND for
the best performance.
FN4914 Rev.7.00
May.20.19
Page 9 of 18
ICL3207E
4.3
4. Application Information
Receivers
The ICL3207E has inverting receivers that convert RS-232 signals to CMOS output levels and accept inputs up to
±25V while presenting the required 3kΩ to 7kΩ input impedance (see Figure 5) even if the power is off
(VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease
errors due to slow input signal transitions.
Receivers on the ICL3207E are always active.
VCC
RXIN
-25V ≤ VRIN ≤ +25V
RXOUT
5kΩ
GND ≤ VROUT ≤ VCC
GND
Figure 5. Inverting Receiver Connections
4.4
Low Power Operation
The 3V ICL3207E requires a nominal supply current of 0.3mA, even at VCC = 5.5V, during normal operation. This
supply current is considerably less than the 11mA current required by comparable 5V RS-232 devices and allows
you to reduce system power by replacing the old style device with the ICL3207E.
4.4.1 Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (such as the MAX207E), coupled with the wide operating supply range,
makes the ICL3207E a potential lower power, higher performance drop-in replacement for existing
5V applications. As long as the ±5V RS-232 output swings are acceptable, the ICL3207E works in most
5V applications.
When replacing a device in an existing 5V application, it is acceptable to terminate C3 to VCC as shown in the
“Typical Operating Circuit” on page 3. Terminate C3 to GND if possible, as slightly better performance results from
this configuration.
4.5
Capacitor Selection
The charge pumps require 0.1µF or greater capacitors for 3.3V operation. With 0.1µF capacitors, 5% tolerance
supplies (3.14V minimum) deliver greater than ±5V transmitter swings at full data rate. 10% tolerance supplies
(2.97V minimum) deliver ±4.95V transmitter swings. If greater than ±5V transmitter swings are required with a
10% tolerance 3.3V supply, 0.22µF capacitors are recommended (see Table 5). Existing 5V applications typically
use either 0.1µF or 1µF capacitors, and the ICL3207E works well with either value. New 5V designs should use
0.22µF capacitors for the best results. For other supply voltages, see Table 5 for capacitor values. Do not use
values smaller than those listed in Table 5. Increasing the capacitor values (by a factor of two) reduces ripple on
the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without
increasing C1’s value; however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper
ratios (C1 to the other capacitors).
When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s Equivalent Series Resistance
(ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
Table 5.
Required Capacitor Values
VCC (V)
C1 (µF)
C2, C3, C4 (µF)
3.15 to 3.6
0.1
0.1
3.0 to 3.6
0.22
0.22
4.5 to 5.5
0.1 to 1.0
0.1 to 1.0
3.0 to 5.5
0.22
0.22
FN4914 Rev.7.00
May.20.19
Page 10 of 18
ICL3207E
4.6
4. Application Information
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a capacitor of the same value as the charge pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
4.7
Operation Down to 2.7V
The ICL3207E transmitter outputs meet RS-562 levels (±3.7V) with VCC as low as 2.7V. RS-562 levels typically
ensure interoperability with RS-232 devices.
4.8
High Data Rates
The ICL3207E maintains the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 6
shows a transmitter loopback test circuit, and Figure 7 shows the loopback test result at 120kbps. For this test, all
transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 8 shows the
loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters
were also loaded with an RS-232 receiver.
VCC
+
0.1µF
+
C1
C1+
VCC
V+
C1+
C2
ICL3207E
V-
C2+
C2TIN
ROUT
+
C3
C4
+
TOUT
RIN
1000pF
5k
Figure 6. Transmitter Loopback Test Circuit
5V/Div
5V/Div
T1IN
T1IN
T1OUT
T1OUT
R1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
VCC = +3.3V
C1 - C4 = 0.1µF
5µs/Div
Figure 7. Loopback Test at 120kbps
FN4914 Rev.7.00
May.20.19
2µs/Div
Figure 8. Loopback Test at 250kbps
Page 11 of 18
ICL3207E
4.9
4. Application Information
Interconnection with 3V and 5V Logic
The ICL3207E directly interfaces with 5V CMOS and TTL logic families. The AC, HC, and CD4000 outputs can
drive ICL3207E inputs with the ICL3207E at 3.3V and the logic supply at 5V, but the ICL3207E outputs do not
reach the minimum VIH for these logic families. See Table 6 for more information.
Table 6.
Logic Family Compatibility With Various Supply Voltages
System Power-Supply Voltage (V)
VCC Supply Voltage (V)
3.3
3.3
5
5
5
3.3
FN4914 Rev.7.00
May.20.19
Compatibility
Compatible with all CMOS families.
Compatible with all TTL and CMOS logic families.
Compatible with ACT and HCT CMOS, and with TTL. ICL3207E
outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
Page 12 of 18
ICL3207E
5.
5. ±15kV ESD Protection
±15kV ESD Protection
All pins on ICL32xx devices include ESD protection structures, but the ICL32x7E incorporate advanced structures
that allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the
exterior of the finished product. Touching the port pins or connecting a cable can cause an ESD event that might
destroy unprotected ICs. The ESD structures protect the device whether or not it is powered up, protect without
allowing any latchup mechanism to activate, and do not interfere with RS-232 signals as large as ±25V.
5.1
Human Body Model (HBM) Testing
The Human Body Model (HBM) test method emulates the ESD event delivered to an IC during human handling.
The tester delivers the charge through a 1.5kΩ current limiting resistor, so the test is less severe than the
IEC61000 test, which utilizes a 330Ω limiting resistor. The HBM method determines an IC’s ability to withstand the
ESD transients typically present during handling and manufacturing. Due to the random nature of these events,
each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD
events to ±15kV.
5.2
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most
likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and
the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin
combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that
is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the
design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232
port.
5.3
Air-Gap Discharge Test Method
For the air-gap discharge test method, a charged probe tip moves toward the IC pin until the voltage arcs to it.
The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is
difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges.
5.4
Contact Discharge Test Method
During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV
contact discharges on the RS-232 pins.
FN4914 Rev.7.00
May.20.19
Page 13 of 18
ICL3207E
6.
6. Die Characteristics
Die Characteristics
Substrate Potential (Powered Up)
GND
Transistor Count
469
Process
Si Gate CMOS
FN4914 Rev.7.00
May.20.19
Page 14 of 18
ICL3207E
7.
7. Revision History
Revision History
Revision
Date
FN4914.7
May.20.19
Removed information about the ICL3217E throughout the datasheet.
Updated related literature section on page 1.
Updated the ordering information table on page 3:
-Changed Note 1 and added Note 3
-Added tape and reel column
-Added ICL3207ECAZ-T and ICL3207ECBZ-T
-Removed the retired ICL3217ECAZ, ICL3217ECBZ, ICL3217EIAZ, and ICL3217EIBZ
Added Charge Pump Abs Max Ratings section starting on page 8.
Removed About Intersil section.
Applied new template.
Updated disclaimer.
FN4914.6
Aug.21.15
Updated Ordering Information table on page 2.
Added Revision History and About Intersil sections.
Updated Package Outline Drawing M24.3 to the latest revision updates are as follows:
-Revision 0 to Revision 1, Removed µ symbol which is overlapping the alpha symbol in the diagram.
-Revision 1 to Revision 2, Updated to new POD standard by removing table listing dimensions and
putting dimensions on drawing. Added Land Pattern.
FN4914 Rev.7.00
May.20.19
Description
Page 15 of 18
ICL3207E
8.
8. Package Outline Drawings
Package Outline Drawings
For the most recent package outline drawing, see M24.209.
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
N
INDEX
AREA
H
0.25(0.010) M
GAUGE
PLANE
-B1
2
3
0.25
0.010
SEATING PLANE
-A-
B M
E
A
D
-C-
e
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.312
0.334
7.90
8.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B
0.25(0.010) M
L
B S
NOTES:
5. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
-
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N
24
0o
24
8o
0o
7
8o
Rev. 1
3/95
6. Dimensioning and tolerancing per ANSI Y14.5M-1982.
7. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
8. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
9. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
10. “L” is the length of terminal for soldering to a substrate.
11. “N” is the number of terminal positions.
12. Terminal numbers are shown for reference only.
13. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
14. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN4914 Rev.7.00
May.20.19
Page 16 of 18
ICL3207E
8. Package Outline Drawings
For the most recent package outline drawing, see M24.3.
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 2, 3/11
24
INDEX
AREA
7.60 (0.299)
7.40 (0.291) 10.65 (0.419)
10.00 (0.394)
DETAIL "A"
1
2
3
TOP VIEW
1.27 (0.050)
0.40 (0.016)
SEATING PLANE
2.65 (0.104)
2.35 (0.093)
15.60 (0.614)
15.20 (0.598)
0.75 (0.029)
x 45°
0.25 (0.010)
0.30 (0.012)
0.10 (0.004)
1.27 (0.050)
0.51 (0.020)
0.33 (0.013)
8°
0°
0.32 (0.012)
0.23 (0.009)
SIDE VIEW “B”
SIDE VIEW “A”
1.981 (0.078)
9.373 (0.369)
1.27 (0.050)
NOTES:
15. Dimensioning and tolerancing per ANSI Y14.5M-1982.
16. Package length does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
17. Package width does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
18. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
19. Terminal numbers are shown for reference only.
20. The lead width as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
21. Controlling dimension: MILLIMETER. Converted inch dimensions in
( ) are not necessarily exact.
22. This outline conforms to JEDEC publication MS-013-AD ISSUE C.
0.533 (0.021)
TYPICAL RECOMMENDED LAND PATTERN
FN4914 Rev.7.00
May.20.19
Page 17 of 18
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