128K X 36, 3.3V Synchronous
SRAM with ZBT™ Feature, Burst
Counter and Flow-Through Outputs
Features
◆
◆
◆
◆
◆
128K x 36 memory configuration, flow-through outputs
Supports high performance system speed - 95 MHz
(8ns Clock-to-Data Access)
ZBTTM Feature - No dead cycles between write and read
cycles
Internally synchronized signal eliminates the need to
control OE
◆
◆
◆
◆
◆
71V547S
Single R/W (READ/WRITE) control pin
4-word burst capability (Interleaved or linear)
Individual byte write (BW1 - BW4) control (May tie active)
Three chip enables for simple depth expansion
Single 3.3V power supply (±5%)
Packaged in a JEDEC standard 100-pin TQFP package
Functional Block Diagram
128K x 36 BIT
MEMORY ARRAY
LBO
Address A [0:16]
D
Q
Address
D
Q
Control
CE1, CE2, CE2
R/W
Input Register
CEN
ADV/LD
BWx
D
DI
DO
Control Logic
Q
Clk
Mux
Clock
Sel
Gate
OE
,
Data I/O [0:31], I/O P[1:4]
3822 drw 01
ZBT and Zero Bus Turnaround are trademarks of Renesas and the architecture is supported by Micron Technology and Motorola Inc.
1
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
There are three chip enable pins (CE1, CE2, CE2) that allow the user
to deselect the device when desired. If any one of these three is not active
when ADV/LD is low, no new memory operation can be initiated and any
burst in progress is stopped. However, any pending data transfers (reads
or writes) will be completed. The data bus will tri-state one cycle after the
chip was deselected or write initiated.
The IDT71V547 has an on-chip burst counter. In the burst mode, the
IDT71V547 can provide four cycles of data for a single address presented
to the SRAM. The order of the burst sequence is defined by the LBO input
pin. The LBO pin selects between linear and interleaved burst sequence.
The ADV/LD signal is used to load a new external address (ADV/LD =
LOW) or increment the internal burst counter (ADV/LD = HIGH).
The IDT71V547 SRAM utilizes a high-performance, high-volume
3.3V CMOS process, and is packaged in a JEDEC Standard 14mm x
20mm 100-pin thin plastic quad flatpack (TQFP) for high board density.
Description
The IDT71V547 is a 3.3V high-speed 4,718,592-bit (4.5 Megabit)
synchronous SRAM organized as 128K x 36 bits. It is designed to eliminate
dead bus cycles when turning the bus around between reads and writes,
or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus
Turn-around.
Address and control signals are applied to the SRAM during one clock
cycle, and on the next clock cycle, its associated data cycle occurs, be it
read or write.
The IDT71V547 contains address, data-in and control signal registers. The outputs are flow-through (no output data register). Output enable
is the only asynchronous signal and can be used to disable the outputs at
any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V547 to
be suspended as long as necessary. All synchronous inputs are
ignored when CEN is high and the internal device registers will hold
their previous values.
Pin Description Summary
A0 - A16
Address Inputs
Input
Synchronous
Three Chip Enables
Input
Synchronous
OE
Output Enable
Input
Asynchronous
R/W
Read/Write Signal
Input
Synchronous
CEN
Clock Enable
Input
Synchronous
Individual Byte Write Selects
Input
Synchronous
Clock
Input
N/A
Advance Burst Address / Load New Address
Input
Synchronous
Linear / Interleaved Burst Order
Input
Static
I/O
Synchronous
CE1, CE2, CE2
BW1, BW2, BW3, BW4
CLK
ADV/LD
LBO
I/O0 - I/O31, I/OP1 - I/OP4
Data Input/Output
VDD
3.3V Power
Supply
Static
VSS
Ground
Supply
Static
3822 tbl 01
2
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Pin Definitions(1)
Symbol
Pin Function
I/O
Active
Description
A0 - A16
Address Inputs
I
N/A
ADV/LD
Address/Load
I
N/A
ADV/LD is a synchronous input that is used to load the internal registers with new
address and control when it is sampled low at the rising edge of clock with the
chip selected. When ADV/LD is low with the chip deselected, any burst in
progress is terminated. When ADV/LD is sampled high then the internal burst
counter is advanced for any burst that was in progress. The external addresses
are ignored when ADV/LD is sampled high.
R/W
Read/Write
I
N/A
R/W signal is a synchronous input that identifies whether the current load cycle
initiated is a Read or Write access to the memory array. The data bus activity for
the current cycle takes place one clock cycle later.
CEN
Clock Enable
I
LOW
Synchronous Clock Enable Input. When CEN is sampled high, all other
synchronous inputs, including clock are ignored and outputs remain unchanged.
The effect of CEN sampled high on the device outputs is as if the low to high
clock transition did not occur. For normal operation, CEN must be sampled low at
rising edge of clock.
BW1 - BW4
Individual Byte
Write Enables
I
LOW
Synchronous byte write enables. Enable 9-bit byte has its own active low byte
write enable. On load write cycles (When R/W and ADV/LD are sampled low) the
appropriate byte write signal (BW1 - BW4) must be valid. The byte write signal
must also be valid on each cycle of a burst write. Byte Write signals are ignored
when R/W is sampled high. The appropriate byte(s) of data are written into the
device one cycle later. BW1 - BW4 can all be tied low if always doing write to the
entire 36-bit word.
CE1, CE2
Chip Enables
I
LOW
Synchronous active low chip enable. CE1 and CE2 are used with CE2 to
enable the IDT71V547. (CE1 or CE2 sampled high or CE2 sampled low) and
ADV/LD low at the rising edge of clock, initiates a deselect cycle. This device has
a one cycle deselect, i.e., the data bus will tri-state one clock cycle after deselect
is initiated.
CE2
Chip Enable
I
HIGH
Synchronout active high chip enable. CE2 is used with CE1 and CE2 to enable
the chip. CE2 has inverted polarity but otherwise identical to CE1 and CE2.
CLK
Clock
I
N/A
This is the clock input to the IDT71V547. Except for OE, all timing references for
the device are made with respect to the rising edge of CLK.
I/O0 - I/O31
I/OP1 - I/OP4
Data Input/Output
I/O
N/A
Data input/output (I/O) pins. The data input path is registered, triggered by the
rising edge of CLK. The data output path is flow-through (no output register).
LBO
Linear Burst
Order
I
LOW
Burst order selection input. When LBO is high the Interleaved burst sequence is
selected. When LBO is low the Linear burst sequence is selected. LBO is a static
DC input.
OE
Output Enable
I
LOW
Asynchronous output enable. OE must be low to read data from the 71V547.
When OE is high the I/O pins are in a high-impedance state. OE does not need
to be actively controlled for read and write cycles. In normal operation, OE can be
tied low.
VDD
Power Supply
N/A
N/A
3.3V power supply input.
VSS
Ground
N/A
N/A
Ground pin.
Synchronous Address inputs. The address register is triggered by a combination
of the rising edge of CLK, ADV/LD Low, CEN Low and true chip enables.
NOTE:
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
3
6.42
Apr.24.20
3822 tbl 02
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Recommended DC Operating
Conditions
Recommended Operating
Temperature and Supply Voltage
Grade
Temperature
Commercial
0 C to +70 C
Industrial
-40OC to +85OC
O
O
VDD
Symbol
0V
3.3V±5%
VDD
Supply Voltage
0V
3.3V±5%
VSS
Ground
VIH
VIH
VSS
3822 tbl 03
VIL
Parameter
Min.
Typ.
Max.
Unit
3.135
3.3
3.465
V
0
0
0
V
Input High Voltage - Inputs
2.0
____
4.6
Input High Voltage - I/O
2.0
____
Input Low Voltage
(1)
-0.5
____
V
(2)
VDD+0.3
V
0.8
V
3822 tbl 04
NOTES:
1. VIL (min.) = –1.0V for pulse width less than tCYC/2, once per cycle.
2. VIH (max.) = +6.0V for pulse width less than tCYC/2, once per cycle.
Capacitance
(TA = +25°C, f = 1.0MHz, TQFP package)
Symbol
Parameter(1)
CIN
Input Capacitance
CI/O
I/O Capacitance
Conditions
Max.
Unit
VIN = 3dV
5
pF
VOUT = 3dV
7
pF
3822 tbl 06
NOTE:
1. This parameter is guaranteed by device characterization, but not production tested.
Absolute Maximum Ratings(1)
Symbol
Rating
Value
Unit
VTERM(2)
Terminal Voltage
with Respect to GND
-0.5 to +4.6
V
VTERM(3)
Terminal Voltage
with Respect to GND
-0.5 to VDD+0.5
V
Commercial
Operating Ambient
Temperature
0 to +70
o
C
Operating Ambient
Temperature
-40 to +85
o
C
TBIAS
Temperature Under Bias
-55 to +125
o
C
TSTG
Storage Temperature
-55 to +125
o
C
PT
Power Dissipation
2.0
W
IOUT
DC Output Current
50
mA
TA
Industrial
3822 tbl 05
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
2. VDD and Input terminals only.
3. I/O terminals.
4
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
BW2
BW1
CE2
VDD
VSS
CLK
R/W
CEN
OE
ADV/LD
NC
NC
A8
A9
A6
A7
CE1
CE2
BW4
BW3
Pin Configuration
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
I/OP3
I/O16
I/O17
VDD
VSS
I/O18
I/O19
I/O20
I/O21
VSS
VDD
I/O22
I/O23
VSS(1)
VDD
VDD
VSS
I/O24
I/O25
VDD
VSS
I/O26
I/O27
I/O28
I/O29
VSS
VDD
I/O30
I/O31
I/OP4
1
80
2
79
3
78
77
4
5
6
76
75
7
74
8
73
9
10
11
12
13
71V547
PKG100(2)
72
71
70
69
68
14
67
15
66
16
65
64
17
18
19
63
62
20
61
21
60
22
59
23
24
58
57
25
56
26
55
27
54
53
28
29
52
51
30
I/OP2
I/O15
I/O14
VDD
VSS
I/O13
I/O12
I/O11
I/O10
VSS
VDD
I/O9
I/O8
VSS
VSS
VDD
VSS
I/O7
I/O6
VDD
VSS
I/O5
I/O4
I/O3
I/O2
VSS
VDD
I/O1
I/O0
I/OP1
LBO
A5
A4
A3
A2
A1
A0
NC
NC
VSS
VDD
NC
NC
A10
A11
A12
A13
A14
A15
A16
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Top View
TQFP
3822 drw 02
NOTES:
1. Pin 14 does not have to be connected directly to VSS as long as the input voltage is < VIL.
2. This text does not indicate orientation of actual part-marking.
.
5
6.42
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Synchronous Truth Table(1)
CEN
R/W
Chip(5)
Enable
ADV/LD
BWx
ADDRESS
USED
PREVIOUIS CYCLE
CURRENT CYCLE
I/O
(1 cycle later)
L
L
Select
L
Valid
External
X
LOAD WRITE
D(7)
L
H
Select
L
X
External
X
LOAD READ
Q(7)
L
X
X
H
Valid
Internal
LOAD WRITE/
BURST WRITE
BURST WRITE
(Advance Burst Counter)(2)
D(7)
L
X
X
H
X
Internal
LOAD READ/
BURST READ
BURST READ
(Advance Burst Counter)(2)
Q(7)
L
X
Deselect
L
X
X
X
DESELECT or STOP(3)
HiZ
L
X
X
H
X
X
DESELECT / NOOP
NOOP
HiZ
H
X
X
X
X
X
X
SUSPEND
(4)
Previous Value
3822 tbl 07
NOTES:
1. L = VIL, H = VIH, X = Don’t Care.
2. When ADV/LD signal is sampled high, the internal burst counter is incremented. The R/W signal is ignored when the counter is advanced. Therefore the nature
of the burst cycle (Read or Write) is determined by the status of the R/W signal when the first address is loaded at the beginning of the burst cycle.
3. Deselect cycle is initiated when either (CE1, or CE2 is sampled high or CE2 is sampled low) and ADV/LD is sampled low at rising edge of clock. The data bus
will tri-state one cycle after deselect is initiated.
4. When CEN is sampled high at the rising edge of clock, that clock edge is blocked from propagating through the part. The state of all the internal registers and the
I/Os remains unchanged.
5. To select the chip requires CE1 = L, CE2 = L and CE2 = H on these chip enable pins. The chip is deselected if either one of the chip enable is false.
6. Device Outputs are ensured to be in High-Z during device power-up.
7. Q - data read from the device, D - data written to the device.
Partial Truth Table for Writes(1)
Operation
R/W
BW1
BW2
BW3
BW4
READ
H
X
X
X
X
L
L
L
L
L
L
L
H
H
H
L
H
L
H
H
WRITE BYTE 3 (I/O [16:23], I/O P3)(2)
L
H
H
L
H
(2)
L
H
H
H
L
L
H
H
H
H
WRITE ALL BYTES
(2)
WRITE BYTE 1 (I/O [0:7], I/O P1)
(2)
WRITE BYTE 2 (I/O [8:15], I/O P2)
WRITE BYTE 4 (I/O [24:31], I/O P4)
NO WRITE
3822 tbl 08
NOTES:
1. L = VIL, H = VIH, X = Don’t Care.
2. Multiple bytes may be selected during the same cycle.
6
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Interleaved Burst Sequence Table (LBO=VDD)
Sequence 1
Sequence 2
Sequence 3
Sequence 4
A1
A0
A1
A0
A1
A0
A1
A0
First Address
0
0
0
1
1
0
1
1
Second Address
0
1
0
0
1
1
1
0
Third Address
1
0
1
1
0
0
0
1
Fourth Address (1)
1
1
1
0
0
1
0
0
3822 tbl 09
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Linear Burst Sequence Table (LBO=VSS)
Sequence 1
Sequence 2
Sequence 3
Sequence 4
A1
A0
A1
A0
A1
A0
A1
A0
First Address
0
0
0
1
1
0
1
1
Second Address
0
1
1
0
1
1
0
0
Third Address
1
0
1
1
0
0
0
1
Fourth Address (1)
1
1
0
0
0
1
1
0
3822 tbl 10
NOTE:
1. Upon completion of the Burst sequence the counter wraps around to its initial state and continues counting.
Functional Timing Diagram(1)
n+29
n+30
n+31
n+32
n+33
n+34
n+35
n+36
n+37
A29
A30
A31
A32
A33
A34
A35
A36
A37
(2)
CONTROL
(R/W, ADV/LD, BWx)
C29
C30
C31
C32
C33
C34
C35
C36
C37
(2)
DATA
I/O [0:31], I/O P[1:4]
D/Q28
D/Q29
D/Q30
D/Q31
D/Q32
D/Q33
D/Q34
D/Q35
D/Q36
CYCLE
CLOCK
ADDRESS
(A0 - A16)
(2)
3822 drw 03
.,
NOTES:
1. This assumes CEN, CE1, CE2 and CE2 are all true.
2. All Address, Control and Data_In are only required to meet set-up and hold time with respect to the rising edge of clock. Data_Out is valid after a clock-to-data
delay from the rising edge of clock.
7
6.42
Apr.24.20
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Device Operation - Showing Mixed Load, Burst,
Deselect and NOOP Cycles(2)
Cycle
Address
R/W
ADV/LD
CE(1)
CEN
BWx
OE
I/O
n
A0
H
L
L
L
X
X
D1
Load read
n+1
X
X
H
X
L
X
L
Q0
Burst read
n+2
A1
H
L
L
L
X
L
Q0+1
Load read
n+3
X
X
L
H
L
X
L
Q1
Deselect or STOP
n+4
X
X
H
X
L
X
X
Z
NOOP
n+5
A2
H
L
L
L
X
X
Z
Load read
n+6
X
X
H
X
L
X
L
Q2
Burst read
n+7
X
X
L
H
L
X
L
Q2+1
Deselect or STOP
n+8
A3
L
L
L
L
L
X
Z
Load write
n+9
X
X
H
X
L
L
X
D3
Burst write
n+10
A4
L
L
L
L
L
X
D3+1
Load write
n+11
X
X
L
H
L
X
X
D4
Deselect or STOP
n+12
X
X
H
X
L
X
X
Z
NOOP
n+13
A5
L
L
L
L
L
X
Z
Load write
n+14
A6
H
L
L
L
X
X
D5
Load read
n+15
A7
L
L
L
L
L
L
Q6
Load write
n+16
X
X
H
X
L
L
X
D7
Burst write
n+17
A8
H
L
L
L
X
X
D7+1
Load read
n+18
X
X
H
X
L
X
L
Q8
Burst read
n+19
A9
L
L
L
L
L
L
Q8+1
Load write
Comments
NOTES:
1. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
2. H = High; L = Low; X = Don't Care; Z = High Impedance.
8
Apr.24.20
3822 tbl 11
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Read Operation(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
H
L
L
L
X
X
X
Address and Control meet setup
n+1
X
X
X
X
X
X
L
Q0
Co ntents of Address A0 Read Out
Comments
3822 tbl 12
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
Burst Read Operation(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
H
L
L
L
X
X
X
Address and Control meet setup
n+1
X
X
H
X
L
X
L
Q0
Address A0 Read Out, Inc. Count
n+2
X
X
H
X
L
X
L
Q0+1
Address A0+1 Read Out, Inc. Count
n+3
X
X
H
X
L
X
L
Q0+2
Address A0+2 Read Out, Inc. Count
n+4
X
X
H
X
L
X
L
Q0+3
Address A0+3 Read Out, Load A1
n+5
A1
H
L
L
L
X
L
Q0
Address A0 Read Out, Inc. Count
n+6
X
X
H
X
L
X
L
Q1
Address A1 Read Out, Inc. Count
n+7
A2
H
L
L
L
X
L
Q1+1
Address A1+1 Read Out, Load A2
Comments
3822 tbl 13
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
Write Operation(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
L
L
L
L
L
X
X
Address and Control meet setup
n+1
X
X
X
X
L
X
X
D0
Write to Address A0
Comments
3822 tbl 14
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
Burst Write Operation(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
L
L
L
L
L
X
X
Address and Control meet setup
n+1
X
X
H
X
L
L
X
D0
Address A0 Write, Inc. Count
n+2
X
X
H
X
L
L
X
D0+1
Address A0+1 Write, Inc. Count
n+3
X
X
H
X
L
L
X
D0+2
Address A0+2 Write, Inc. Count
n+4
X
X
H
X
L
L
X
D0+3
Address A0+3 Write, Load A1
n+5
A1
L
L
L
L
L
X
D0
Address A0 Write, Inc. Count
n+6
X
X
H
X
L
L
X
D1
Address A1 Write, Inc. Count
n+7
A2
L
L
L
L
L
X
D1+1
Address A1+1 Write, Load A2
Comments
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
9
6.42
Apr.24.20
3822 tbl 15
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Read Operation With Clock Enable Used(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
H
L
L
L
X
X
X
Address and Control meet setup
n+1
X
X
X
X
H
X
X
X
Clock n+1 Ignored
n+2
A1
H
L
L
L
X
L
Q0
Address A0 Read out, Load A1
n+3
X
X
X
X
H
X
L
Q0
Clock Ignored. Data Q0 is on the bus
n+4
X
X
X
X
H
X
L
Q0
Clock Ignored. Data Q0 is on the bus
n+5
A2
H
L
L
L
X
L
Q1
Address A1 Read out, Load A2
n+6
A3
H
L
L
L
X
L
Q2
Address A2 Read out, Load A3
n+7
A4
H
L
L
L
X
L
Q3
Address A3 Read out, Load A4
Comments
3822 tbl 16
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
Write Operation With Clock Enable Used(1)
Cycle
Address
R/W
ADV/LD
CE(2)
CEN
BWx
OE
I/O
n
A0
L
L
L
L
L
X
X
Address and Control meet setup
n+1
X
X
X
X
H
X
X
X
Clock n+1 Ignored
n+2
A1
L
L
L
L
L
X
D0
Write data D0, Load A1
n+3
X
X
X
X
H
X
X
X
Clock Ignored
n+4
X
X
X
X
H
X
X
X
Clock Ignored
n+5
A2
L
L
L
L
L
X
D1
Write data D1, Load A2
n+6
A3
L
L
L
L
L
X
D2
Write data D2, Load A3
n+7
A4
L
L
L
L
L
X
D3
Write data D3, Load A4
Comments
NOTES:
1. H = High; L = Low; X = Don’t Care; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
10
Apr.24.20
3822 tbl 17
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Read Operation with Chip Enable Used(1)
Cycle
Address
R/W
ADV/LD
CE(1)
CEN
BWx
OE
I/O(3)
n
X
X
L
H
L
X
X
?
Deselected
n+1
X
X
L
H
L
X
X
Z
Deselected
n+2
A0
H
L
L
L
X
X
Z
Address A0 and Control meet setup
n+3
X
X
L
H
L
X
L
Q0
Address A0 read out. Deselected
n+4
A1
H
L
L
L
X
X
Z
Address A1 and Control meet setup
n+5
X
X
L
H
L
X
L
Q1
Address A1 Read out. Deselected
n+6
X
X
L
H
L
X
X
Z
Deselected
n+7
A2
H
L
L
L
X
X
Z
Address A2 and Control meet setup
n+8
X
X
L
H
L
X
L
Q2
Address A2 read out. Deselected
n+9
X
X
L
H
L
X
X
Z
Deselected
Comments
3822 tbl 18
NOTES:
1. H = High; L = Low; X = Don’t Care; ? = Don't Know; Z = High Impedance.
2. CE2 timing transition is identical to CE1 signal. CE2 timing transition is identical but inverted to the CE1 and CE2 signals.
3. Device outputs are ensured to be in High-Z during device power-up.
Write Operation with Chip Enable Used(1)
Cycle
Address
R/W
ADV/LD
CE(1)
CEN
BWx
OE
I/O
n
X
X
L
H
L
X
X
?
Deselected
n+1
X
X
L
H
L
X
X
Z
Deselected
n+2
A0
L
L
L
L
L
X
Z
Address A0 and Control meet setup
n+3
X
X
L
H
L
X
X
D0
Address D0 Write In. Deselected
n+4
A1
L
L
L
L
L
X
Z
Address A1 and Control meet setup
n+5
X
X
L
H
L
X
X
D1
Address D1 Write In. Deselected
n+6
X
X
L
H
L
X
X
Z
Deselected
n+7
A2
L
L
L
L
L
X
Z
Address A2 and Control meet setup
n+8
X
X
L
H
L
X
X
D2
Address D2 Write In. Deselected
n+9
X
X
L
H
L
X
X
Z
Deselected
NOTES:
1. H = High; L = Low; X = Don’t Care; ? = Don't Know; Z = High Impedance.
2. CE = L is defined as CE1 = L, CE2 = L and CE2 = H. CE = H is defined as CE1 = H, CE2 = H or CE2 = L.
11
6.42
Apr.24.20
Comments
3822 tbl 19
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature and
Supply Voltage Range (VDD = 3.3V +/-5%)
Symbol
|ILI|
Parameter
Test Conditions
Input Leakage Current
(1)
Min.
Max.
Unit
VDD = Max., VIN = 0V to VDD
___
5
µA
30
µA
|ILI|
LBO Input Leakage Current
VDD = Max., VIN = 0V to VDD
___
|ILO|
Output Leakage Current
CE > VIH or OE > VIH, VOUT = 0V toVDD, VDD = Max.
___
5
µA
VOL
Output Low Voltage
IOL = 5mA, VDD = Min.
___
0.4
V
VOH
Output High Voltage
IOH = -5mA, VDD = Min.
2.4
___
V
3822 tbl 20
NOTE:
1. The LBO pin will be internally pulled to VDD if it is not actively driven in the application.
DC Electrical Characteristics Over the Operating Temperature
and Supply Voltage Range(1) (VDD = 3.3V +/-5%, VHD = VDD–0.2V, VLD = 0.2V)
S80
Symbol
Parameter
S85
S90
S100
Test Conditions
Com'l
Ind
Com'l
Ind
Com'l
Ind
Com'l
Ind
Unit
Device Selected, Outputs Open, ADV/LD = X,
VDD = Max., VIN > VIH or < VIL, f = fMAX(2)
250
260
225
235
225
235
200
210
mA
IDD
Operating Power
Supply Current
ISB1
CMOS Standby Power Device Deselected, Outputs Open,
Supply Current
VDD = Max., VIN > VHD or < VLD, f = 0(2)
40
45
40
45
40
45
40
45
mA
ISB2
Clock Running Power
Supply Current
Device Deselected, Outputs Open,
VDD = Max., VIN > VHD or < VLD, f = fMAX(2)
100
110
95
105
95
105
90
100
mA
ISB3
Idle Power
Supply Current
Device Selected, Outputs Open, CEN > VIH
VDD = Max., VIN > VHD or < VLD, f = fMAX(2)
40
45
40
45
40
45
40
45
mA
3822 tbl 21
NOTES:
1. All values are maximum guaranteed values.
2. At f = fMAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC; f=0 means no input lines are changing.
AC Test Loads
AC Test Conditions
+1.5V
Input Pulse Levels
50Ω
I/O
Z0 = 50Ω
3822 drw 04
,
Input Rise/Fall Times
2ns
Input Timing Reference Levels
1.5V
Output Timing Reference Levels
1.5V
AC Test Load
Figure 1. AC Test Load
5
4
ΔtCD 3
(Typical, ns)
2
1
80 100
Capacitance (pF)
200
.
3822 drw 05
Figure 2. Lumped Capacitive Load, Typical Derating
12
Apr.24.20
See Figure 1
3822 tbl 22
6
20 30 50
0 to 3V
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V +/-5%, Commercial and Industrial Temperature Ranges)
71V547S80
Symbol
Parameter
71V547S85
71V547S90
71V547S100
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
10.5
____
11
____
12
____
15
____
ns
ns
Clock Parameters
tCYC
Clock Cycle Time
(2)
Clock High Pulse Width
3
____
3.9
____
4
____
5
____
(2)
Clock Low Pulse Width
3
____
3.9
____
4
____
5
____
ns
____
8
____
8.5
____
9
____
10
ns
ns
tCH
tCL
Output Parameters
tCD
Clock High to Valid Data
tCDC
Clock High to Data Change
2
____
2
____
2
____
2
____
(3,4,5)
Clock High to Output Active
4
____
4
____
4
____
4
____
ns
(3,4,5)
tCHZ
Clock High to Data High-Z
____
5
____
5
____
5
____
5
ns
tOE
Output Enable Access Time
____
5
____
5
____
5
____
5
ns
0
____
0
____
0
____
0
____
ns
5
____
5
____
5
____
5
ns
tCLZ
(3,4)
Output Enable Low to Data Active
(3.4)
Output Enable High to Data High-Z
____
tSE
Clock Enable Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSA
Address Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSD
Data in Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSW
Read/Write (R/W) Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSADV
Advance/Load (ADV/LD) Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSC
Chip Enable/Select Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tSB
Byte Write Enable (BWx) Setup Time
2.0
____
2.0
____
2.0
____
2.5
____
ns
tHE
Clock Enable Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHA
Address Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHD
Data in Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHW
Read/Write (R/W) Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHADV
Advance/Load (ADV/LD) Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHC
Chip Enable/Select Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tHB
Byte Write Enable (BWx) Hold Time
0.5
____
0.5
____
0.5
____
0.5
____
ns
tOLZ
tOHZ
Setup Times
Hold Times
3822 tbl 23
NOTES:
1. Measured as HIGH above 2.0V and LOW below 0.8V.
2. Transition is measured ±200mV from steady-state.
3. These parameters are guaranteed with the AC load (Figure 1) by device characterization. They are not production tested.
4. To avoid bus contention, the output buffers are designed such that tCHZ (device turn-off) is about 2 ns faster than tCLZ (device turn-on) at a given temperature and voltage.
The specs as shown do not imply bus contention because tCLZ is a Min. parameter that is worse case at totally different test conditions (0 deg. C, 3.465V) than tCHZ,
which is a Max. parameter (worse case at 70 deg. C, 3.135V). .
13
6.42
Apr.24.20
Apr.24.20
14
tCLZ
A1
tHA
tHW
tHE
tSC
tCD
tHC
A2
tSA
tSW
Q(A1)
Read
tSADV
tSE
Read
Q(A2)
tCDC
tHADV
tCH
Q(A2+1)
tCL
tCD
Burst Read
Q(A2+2)
Q(A2+3)
(CEN high, eliminates
current L-H clock edge)
tCDC
Q(A2+3)
Q(A2)
(Burst Wraps around
to initial state)
tCHZ
NOTES:
1. Q (A1) represents the first output from the external address A1. Q (A2) represents the first output from the external address A2; Q (A2+1) represents the next output data in the
burst sequence of the base address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input.
2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH.
3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW.
4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address
and control are loaded into the SRAM.
DATA Out
OE
BW1 - BW4
CE1, CE2(2)
ADDRESS
R/W
ADV/LD
CEN
CLK
tCYC
3822 drw 06
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of Read Cycle(1, 2, 3, 4)
,
Apr.24.20
15
6.42
B(A1)
A1
Write
tSADV
tHA
tHW
tHE
tHB
tHC
tHD
D(A1)
tSD
B(A2)
tSB
tSC
A2
tSA
tSW
tSE
Write
D(A2)
B(A2+1)
tHADV
tCH
tHD
D(A2+1)
tSD
B(A2+2)
tCL
(CEN high, eliminates
current L-H clock edge)
Burst Write
D(A2+2)
B(A2+3)
D(A2+3)
(Burst Wraps around
to initial state)
B(A2)
D(A2)
.
3822 drw 07
NOTES:
1. D (A1) represents the first input to the external address A1. D (A2) represents the first input to the external address A2; D (A2+1) represents the next input data in the burst sequence of the base
address A2, etc. where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the LBO input.
2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH.
3. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW.
4. R/W is don't care when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the R/W signal when new address and control are
loaded into the SRAM.
5. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information
comes in one cycle before the actual data is presented to the SRAM.
DATA In
OE
BW1 - BW4
CE1, CE2(2)
ADDRESS
R/W
ADV/LD
CEN
CLK
tCYC
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of Write Cycles(1,2,3,4,5)
Apr.24.20
16
A1
tCD
tHA
tHW
tHE
tHC
tCLZ
D(A2)
tSD tHD
A3
tCH
tHADV
Write
tCHZ
tHB
B(A2)
tSB
tSC
A2
tSA
tSW
Q(A1)
Read
tSADV
tSE
Read
Q(A3)
tCDC
B(A4)
A4
tCL
Write
D(A4)
B(A5)
A5
Write
D(A5)
A6
Read
Q(A6)
A7
Read
Q(A7)
B(A8)
A8
,
Write
3822 drw 08
NOTES:
1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2.
2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH.
3. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information
comes in one cycle before the actual data is presented to the SRAM.
DATA Out
DATA In
OE
BW1 - BW4
CE1, CE2(2)
ADDRESS
R/W
ADV/LD
CEN
CLK
tCYC
D(A8)
A9
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of Combined Read and Write Cycles(1,2,3)
Apr.24.20
17
6.42
tCD
tCLZ
A1
Q(A1)
tSE
tSADV
tHE
tHA
tHW
tHB
tHC
Q(A1)
tCDC
tCHZ
B(A2)
tSB
tSC
A2
tSA
tSW
tCH
tHADV
tCL
tCD
D(A2)
tSD tHD
A3
Q(A3)
tCDC
A4
,
Q(A4)
A5
NOTES:
3822 drw 09
1. Q (A1) represents the first output from the external address A1. D (A2) represents the input data to the SRAM corresponding to address A2.
2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH..
3. CEN when sampled high on the rising edge of clock will block that L-H transition of the clock from propagating into the SRAM. The part will behave as if the L-H clock transition
did not occur. All internal registers in the SRAM will retain their previous state.
4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information
comes in one cycle before the actual data is presented to the SRAM.
DATA Out
DATA In
OE
BW1 - BW4
CE1, CE2(2)
ADDRESS
R/W
ADV/LD
CEN
CLK
tCYC
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of CEN Operation(1,2,3,4)
Apr.24.20
18
tCD
tCLZ
A1
tSADV
tSC
Q(A1)
tHA
tHW
tHE
tHC
A2
tSA
tSW
tSE
tCHZ
tCDC
Q(A2)
tHADV
tCH
tHB
B(A3)
tSB
A3
tCL
D(A3)
tSD tHD
A4
Q(A4)
A5
NOTES:
1. Q (A1) represents the first output from the external address A1. D (A3) represents the input data to the SRAM corresponding to address A3 etc.
2. CE2 timing transitions are identical but inverted to the CE1 and CE2 signals. For example, when CE1 and CE2 are LOW on this waveform, CE2 is HIGH.
3. When either one of the Chip enables (CE1, CE2, CE2) is sampled inactive at the rising clock edge, a deselect cycle is initiated. The data-bus tri-states one cycle after the initiation
of the deselect cycle. This allows for any pending data transfers (reads or writes) to be completed.
4. Individual Byte Write signals (BWx) must be valid on all write and burst-write cycles. A write cycle is initiated when R/W signal is sampled LOW. The byte write information
comes in one cycle before the actual data is presented to the SRAM.
DATA Out
DATA In
OE
BW1 - BW4
CE1, CE2(2)
ADDRESS
R/W
ADV/LD
CEN
CLK
tCYC
3822 drw 10
Q(A4)
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of CS Operation(1,2,3,4)
.
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Timing Waveform of OE Operation(1)
OE
tOE
tOHZ
DATA Out
tOLZ
Q
Q
3822 drw 11
NOTE:
1. A read operation is assumed to be in progress.
Ordering Information
71V547
S
XX
PF
Device
Type
Power
Speed
Package
X
X
X
Process/
Temperature
Range
Blank
8
Tray
Tape and Reel
Blank
I(1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
G
Green
PF
Plastic Thin Quad Flatpack, 100 pin (PKG100)
80
100
Access time (tCD) in tenths of nanoseconds
NOTE:
1. Contact your local sales office for industrial temp range for other speeds, packages and powers.
PART NUMBER
tCD PARAMETER
SPEED IN MEGAHERTZ CLOCK CYCLE TIME
71V547S80PF
8 ns
95 MHz
10.5 ns
71V547S100PF
10 ns
66 MHz
15 ns
3822 drw 12
19
6.42
Apr.24.20
.
71V547, 128K x 36, 3.3V Synchronous SRAM with
™ Feature, Burst Counter and Flow-Through Outputs
ZBT™
Commercial and Industrial Temperature Ranges
Orderable Part Information
Speed
(ns)
80
100
Pkg.
Code
Pkg.
Type
Temp.
Grade
71V547S80PFGI8
PKG100
TQFP
I
71V547S80PFGI
PKG100
TQFP
I
71V547S80PFG8
PKG100
TQFP
C
71V547S80PFG
PKG100
TQFP
C
71V547S100PFGI8
PKG100
TQFP
I
Orderable Part ID
71V547S100PFGI
PKG100
TQFP
I
71V547S100PFG8
PKG100
TQFP
C
71V547S100PFG
PKG100
TQFP
C
Datasheet Document History
6/15/99
9/13/99
12/31/99
02/27/07
10/16/08
05/27/10
02/23/15
Pg. 11
Pg. 19
Pp. 3, 11, 12, 18
Pg.18
Pg. 18
Pg. 17
Pg. 1-3
Pg. 5 &19
Pg. 19
04/24/20
Pg. 1 - 21
Pg. 2
Pg. 4
Pg. 5
Pg. 19
Pg. 20
Updated to new format
Corrected ISB3 conditions
Added Datasheet Document History
Added Industrial Temperature range offerings
Added X generation die step to data sheet ordering information
Removed "IDT" from orderable part number
Added "Restricted hazardous substance device" to the ordering information
Re-ordered the FBD, Pin Descriptions and Pin Definitions to make the reading flow better match
the reading flow of our other datasheets
PK100-1 changed to PK100 to match our package codes
RoHS updated to Green, added Tape and Reel and removed die stepping from the Ordering
Information
Rebranded as Renesas datasheet
Corrected typo
Updated Absolute Maximum table
Updated package code
Updated Ordering Information
Added Orderable Part Information table
20
Apr.24.20
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