DATASHEET
ISL21007
FN6326
Rev.12.00
Jun 9, 2017
Precision, Low Noise FGA Voltage References
The ISL21007 FGA™ voltage references are extremely low
power, high precision, and low noise voltage references
fabricated on Intersil’s proprietary Floating Gate Analog (FGA)
technology. The ISL21007 features very low noise (4.5µVP-P for
0.1Hz to 10Hz) and very low operating current (150µA, Max). In
addition, the ISL21007 family features guaranteed initial
accuracy as low as ±0.5mV.
Features
This combination of high initial accuracy, low drift, and low
output noise performance of the ISL21007 enables versatile
high performance control and data acquisition applications
with low power consumption.
• Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 150µA (Max)
Applications
• Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC
• Reference Output Voltage . . . .1.250V, 2.048V, 2.500V, 3.000V
• Input Voltage Range
ISL21007-12, 20, 25. . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
ISL21007-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2V to 5.5V
• Low Output Voltage Noise . . . . . . . . 4.5µVP-P (0.1Hz to 10Hz)
• Temperature Coefficient . . . . . . . . . . . . . . 3ppm/°C (B grade)
• Operating Temperature Range. . . . . . . . . . .-40°C to +125°C
• Pb-Free (RoHS Compliant)
• High Resolution A/Ds and D/As
Related Literature
• Digital Meters
• Bar Code Scanners
• For a full list of related documents, visit our website
- ISL21007 product pages
• Base Stations
• Battery Management/Monitoring
• Industrial/Instrumentation Equipment
TABLE 1. AVAILABLE OPTIONS
PART
NUMBER
VOUT OPTION
(V)
INITIAL ACCURACY
(mV)
TEMPCO.
(ppm/°C)
ISL21007BFB812Z
(Obsolete. Recommended replacement part ISL21007CFB812Z)
1.250
±0.5
3
ISL21007CFB812Z
1.250
±1.0
5
ISL21007DFB812Z
1.250
±2.0
10
ISL21007BFB820Z
(Obsolete. Recommended replacement part ISL21007CFB820Z)
2.048
±0.5
3
ISL21007CFB820Z
2.048
±1.0
5
ISL21007DFB820Z
(Obsolete. Recommended replacement ISL21007CFB820Z)
2.048
±2.0
10
ISL21007BFB825Z
(Obsolete. Recommended replacement part ISL21007CFB825Z)
2.500
±0.5
3
ISL21007CFB825Z
2.500
±1.0
5
ISL21007DFB825Z
2.500
±2.0
10
ISL21007BFB830Z
(Obsolete. Recommended replacement ISL21007CFB825Z-TK)
3.000
±0.5
3
ISL21007CFB830Z
(Obsolete. Recommended replacement ISL21007CFB825Z-TK)
3.000
±1.0
5
ISL21007DFB830Z
(Obsolete. Recommended replacement ISL21007CFB825Z-TK)
3.000
±2.0
10
FN6326 Rev.12.00
Jun 9, 2017
Page 1 of 20
ISL21007
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
VOUT OPTION
(V)
GRADE
TEMP. RANGE
(°C)
PACKAGE
(RoHS COMPLIANT) PKG. DWG. #
ISL21007CFB812Z
21007CF Z12
1.250
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB812Z
21007DF Z12
1.250
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB820Z
21007CF Z20
2.048
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB820Z (Obsolete
recommended replacement
ISL21007CFB820Z)
21007DF Z20
2.048
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB825Z
21007CF Z25
2.500
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB825Z
21007DF Z25
2.500
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB830Z (Obsolete,
recommended replacement
ISL21007CFB825Z-TK)
21007CF Z30
3.000
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB830Z (Obsolete,
recommended replacement
ISL21007CFB825Z-TK)
21007DF Z30
3.000
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-TK” suffix for 1k unit tape and reel option. Refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), see device information pages for ISL21007CFB812, ISL21007CFB820, ISL21007CFB825, ISL21007CFB830,
ISL21007DFB812, ISL21007DFB820, ISL21007DFB825, ISL21007DFB830. For more information on MSL, see techbrief TB363.
Pin Configuration
ISL21007
(8 LD SOIC)
TOP VIEW
GND or NC
1
8
DNC
VIN
2
7
DNC
DNC
3
6
VOUT
GND
4
5
TRIM
Pin Descriptions
PIN NUMBER
PIN NAME
1
GND or NC
2
VIN
Power Supply Input Connection
4
GND
Ground
5
TRIM
Allows User Trim VOUT ±2.5%
6
VOUT
Voltage Reference Output Connection
3, 7, 8
DNC
Do Not Connect; Internal Connection - Must Be Left Floating
FN6326 Rev.12.00
Jun 9, 2017
DESCRIPTION
Ground or No Connection
Page 2 of 20
ISL21007
Typical Application Circuit
1 GND
+3V
C1
10µF
2 VIN
3 NC
4 GND
NC 8
NC 7
VOUT 6
TRIM 5
ISL21007-12, 20, 25, 30
SPI BUS
X79000
1 SCK
2 A0
CS 20
CLR 19
3 A1
4 A2
VCC 18
5 SI
6 SO
VL 16
VREF 15
7 RDY
8 UP
VOUT 13
9 DOWN
10 OE
VH 17
C1
0.001µF
VSS 14
VBUF 12
LOW NOISE DAC OUTPUT
VFB 11
FIGURE 1. TYPICAL APPLICATION PRECISION 12-BIT SUBRANGING DAC
FN6326 Rev.12.00
Jun 9, 2017
Page 3 of 20
ISL21007
Absolute Voltage Ratings
Thermal Information
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
Max Voltage VOUT to GND (10s) . . . . . . . . . . . . . . . . . . . . . -0.5V to VOUT + 1
Voltage on “DNC” pins . . . . . . . . . No connections permitted to these pins.
ESD Rating
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Thermal Resistance (Typical, Note 5)
JA (°C/W)
8 Ld SOIC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
113.12
Continuous Power Dissipation (Note 5) . . . . . . . . . . . . . . . . . . . .TA = +70°C
8 Ld SOIC Derate 5.88mW/°C above +70°C. . . . . . . . . . . . . . . . . . 471mW
Pb-Free Reflow Profile (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
Temperature Range (Full Range Industrial) . . . . . . . . . . .-40°C to +125°C
Environmental Operating Conditions
X-Ray Exposure (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mRem
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted,
all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES:
4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be
analyzed for Output Voltage drift effects. See “Applications Information” on page 16.
5. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See tech brief TB379 for details.
6. Post-reflow drift for the ISL21007 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards.
The design engineer must take this into account when considering the reference voltage after assembly.
Common Electrical Specifications (ISL21007-12, -20, -25, -30)
specified. Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
VOUT Accuracy at TA = +25°C
Output Voltage Temperature
Coefficient (Note 7)
SYMBOL
VOA
TC VOUT
CONDITIONS
TA = -40°C to +125°C, unless otherwise
MAX
MIN
(Note 10) TYP (Note 10)
-0.5
+0.5
mV
ISL21007C
-1.0
+1.0
mV
ISL21007D
-2.0
+2.0
mV
ISL21007B
3
ppm/°C
ISL21007C
5
ppm/°C
10
ppm/°C
150
µA
ISL21007D
Supply Current
IIN
75
Trim Range
Turn-On Settling Time
±2.0
tR
Ripple Rejection
Output Voltage Noise
eN
Broadband Voltage Noise
VN
Noise Density
FN6326 Rev.12.00
Jun 9, 2017
UNIT
ISL21007B
VOUT = ±0.1%
±2.5
%
120
µs
f = 10kHz
60
dB
0.1Hz ≤ f ≤10Hz
4.5
µVP-P
10Hz ≤ f ≤1kHz
2.2
µVRMS
f = 1kHz
60
nV/Hz
Page 4 of 20
ISL21007
Electrical Specifications (ISL21007-12, VOUT = 1.250V)
specified. Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
Input Voltage Range
SYMBOL
CONDITIONS
VIN
VIN = 3.0V, TA = -40°C to +125°C, unless otherwise
MIN
(Note 10)
TYP
2.7
MAX
(Note 10)
UNIT
5.5
V
Output Voltage
VOUT
Line Regulation
VOUT /VIN
2.7V ≤ VIN ≤ 5.5V
100
700
µV/V
Load Regulation
VOUT/IOUT
Sourcing: 0mA ≤ IOUT ≤ 7mA
10
100
µV/mA
Sinking: -7mA ≤ IOUT≤ 0mA
20
150
µV/mA
TA = +25°C, VOUT tied to GND
40
mA
Short-Circuit Current
ISC
1.250
V
Thermal Hysteresis (Note 8)
VOUT/TA
TA = +165°C
50
ppm
Long Term Stability (Note 9)
VOUT/t
TA = +25°C
100
ppm
Electrical Specifications (ISL21007-20, VOUT = 2.048V)
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
Input Voltage Range
SYMBOL
CONDITIONS
VIN
VIN = 3.0V, TA = -40°C to +125°C, unless otherwise specified.
MIN
(Note 10)
TYP
2.7
MAX
(Note 10)
UNIT
5.5
V
Output Voltage
VOUT
Line Regulation
VOUT /VIN
2.7V ≤ VIN ≤ 5.5V
50
200
µV/V
Load Regulation
VOUT/IOUT
Sourcing: 0mA ≤ IOUT ≤ 7mA
10
100
µV/mA
Sinking: -7mA ≤ IOUT≤ 0mA
20
150
µV/mA
TA = +25°C, VOUT tied to GND
50
mA
Short-Circuit Current
ISC
2.048
V
Thermal Hysteresis (Note 8)
VOUT/TA
TA = +165°C
50
ppm
Long Term Stability (Note 9)
VOUT/t
TA = +25°C
75
ppm
Electrical Specifications (ISL21007-25, VOUT = 2.500V)
Boldface limits apply across the operating temperature range, -40°C to +125°C.
PARAMETER
Input Voltage Range
SYMBOL
CONDITIONS
VIN
VIN = 3.0V, TA = -40°C to +125°C, unless otherwise specified.
MIN
(Note 10)
TYP
2.7
MAX
(Note 10)
UNIT
5.5
V
Output Voltage
VOUT
Line Regulation
VOUT /VIN
2.7V ≤ VIN ≤ 5.5V
50
200
µV/V
Load Regulation
VOUT/IOUT
Sourcing: 0mA ≤ IOUT ≤ 5mA
10
100
µV/mA
Sinking: -5mA ≤ IOUT≤ 0mA
20
150
µV/mA
TA = +25°C, VOUT tied to GND
50
mA
Short-Circuit Current
ISC
2.500
V
Thermal Hysteresis (Note 8)
VOUT/TA
TA = +165°C
50
ppm
Long Term Stability (Note 9)
VOUT/t
TA = +25°C
50
ppm
FN6326 Rev.12.00
Jun 9, 2017
Page 5 of 20
ISL21007
Electrical Specifications (ISL21007-30, VOUT = 3.000V)
VIN = 5.0V, TA = -40°C to +125°C, unless otherwise specified.
Boldface limits apply over the operating temperature range, -40°C to +125°C.
PARAMETER
SYMBOL
Input Voltage Range
MIN
(Note 10)
CONDITIONS
VIN
TYP
MAX
(Note 10)
UNIT
5.5
V
3.2
Output Voltage
VOUT
Line Regulation
VOUT /VIN
3.2V ≤ VIN ≤ 5.5V
50
200
µV/V
Load Regulation
VOUT/IOUT
Sourcing: 0mA ≤ IOUT ≤ 7mA
10
100
µV/mA
Sinking: -7mA ≤ IOUT≤ 0mA
20
150
µV/mA
TA = +25°C, VOUT tied to GND
50
mA
Short-Circuit Current
3.000
ISC
V
Thermal Hysteresis (Note 8)
VOUT/TA
TA = +165°C
50
ppm
Long Term Stability (Note 9)
VOUT/t
TA = +25°C
50
ppm
NOTES:
7. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the
temperature range; in this case, -40°C to +125°C = +165°C.
8. Thermal Hysteresis is the change of VOUT measured at TA = +25°C after temperature cycling over a specified range, TA. VOUT is read initially at
TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between
the initial VOUT reading and the second VOUT reading is then expressed in ppm. For TA = +165°C, the device under test is cycled from +25°C to
+125°C to -40°C to +25°C.
9. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/(1kHrs).
10. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
Typical Performance Curves (ISL21007-12)
120
(REXT = 100kΩ)
95
UNIT 3
90
100
IIN (µA)
IIN (µA)
UNIT 2
60
UNIT 1
40
80
+25°C
75
70
20
0
2.5
+125°C
85
80
-40°C
65
3.0
3.5
4.0
4.5
VIN (V)
5.0
5.5
6.0
60
2.5
1.25015
4.0
VIN (V)
4.5
5.0
5.5
150
1.25010
UNIT 3
1.25005
1.25000
UNIT 2
1.24995
1.24990
UNIT 1
1.24985
1.24980
3.5
FIGURE 3. IIN vs VIN OVER TEMPERATURE
VO (µV)
(NORMALIZED TO VIN = 3.0V)
VOUT (V)
(NORMALIZED TO 1.250V AT VIN = 3.0V)
FIGURE 2. IIN vs VIN (3 UNITS)
3.0
2.5
3.0
3.5
4.0
VIN (V)
4.5
FIGURE 4. LINE REGULATION (3 UNITS)
FN6326 Rev.12.00
Jun 9, 2017
5.0
5.5
100
50
+125°C
0
+25°C
-50
-40°C
-100
-150
-200
-250
-300
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
FIGURE 5. LINE REGULATION OVER TEMPERATURE
Page 6 of 20
6.0
ISL21007
Typical Performance Curves (ISL21007-12)
(REXT = 100kΩ) (Continued)
0.15
+25°C
1.25010
+125°C
0.00
VOUT (V)
VOUT (mV)
1.25000
0.05
-40°C
-0.05
1.24995
UNIT 2
1.24990
UNIT 3
1.24985
-0.10
-0.15
UNIT 1
1.25005
0.10
1.24980
-7
-6 -5 -4
SINKING
-3 -2 -1 0 1 2 3
OUTPUT CURRENT (mA)
4 5 6 7
SOURCING
FIGURE 6. LOAD REGULATION OVER TEMPERATURE
1.24975
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 7. VOUT vs TEMPERATURE (3 UNITS)
X: 200mV/DIV
Y: 10µs/DIV
0
10nF LOAD
100nF LOAD
PSRR (dB)
-20
VIN = +0.3V
-40
-60
VIN = -0.3V
1µF LOAD
-80
1nF LOAD
NO LOAD
-100
1.00E+00
1.00E+02
1.00E+04
1.00E+0
FREQUENCY (Hz)
FIGURE 8. PSRR vs CAPACITIVE LOADS
X: 20µs/DIV
Y: 1V/DIV
X: 200mV/DIV
Y: 10µs/DIV
VIN = +0.3V
VIN = -0.3V
FIGURE 10. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FN6326 Rev.12.00
Jun 9, 2017
FIGURE 9. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD
VIN
VOUT = 1.25V
FIGURE 11. TURN-ON TIME
Page 7 of 20
140
ISL21007
Typical Performance Curves (ISL21007-12)
(REXT = 100kΩ) (Continued)
GAIN IS x1000,
NOISE IS 4.5µVP-P
140
1nF
10nF
120
100nF
2mV/DIV
ZOUT ()
100
NO LOAD
80
60
40
20
0
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
1.00E+05
1.00E+06
FREQUENCY (Hz)
FIGURE 13. VOUT NOISE, 0.1Hz TO 10Hz
FIGURE 12. ZOUT vs FREQUENCY
NO OUTPUT CAPACITANCE
X: 50µs/DIV
Y: 1V/DIV
+7mA
-7mA
FIGURE 14. LOAD TRANSIENT RESPONSE
FN6326 Rev.12.00
Jun 9, 2017
Page 8 of 20
ISL21007
Typical Performance Curves (ISL21007-20)
(REXT = 100kΩ)
95
95
90
90
UNIT 2
80
IIN (uA)
85
IIN (µA)
+125°C
85
80
UNIT 1
75
75
70
-40°C
65
+25°C
60
70
UNIT 3
65
2.7
3.1
55
3.5
3.9
4.3
4.7
5.1
50
2.7
5.5
3.1
3.5
3.9
2.04815
UNIT 2
2.04810
2.04805
UNIT 1
UNIT 3
2.04795
2.04790
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.04815
2.04810
2.04805
+125°C
+25°C
2.04800
2.04795
2.5
3.0
3.5
4.0
0.0
0.4
-40°C
0.0
+25°C
-0.8
-6
-5
-4
-3
-2
-1
0
1
2
3
OUTPUT CURRENT (mA)
FIGURE 19. LOAD REGULATION OVER TEMPERATURE
FN6326 Rev.12.00
Jun 9, 2017
4
5
6
SOURCING
7
VOUT(V) NORMALIZED TO 2.048V AT +25°C
VOUT (mV) NORMALIZED TO 0mA
+125°C
SINKING
4.5
5.0
5.5
FIGURE 18. LINE REGULATION OVER TEMPERATURE
1.6
-1.2
-7
5.5
VIN(V)
FIGURE 17. LINE REGULATION (3 UNITS)
-0.4
5.1
-40°C
VIN(V)
1.2
4.7
FIGURE 16. IIN vs VIN OVER TEMPERATURE
VOUT (V)
(NORMALIZED TO 2.048V AT VIN = 3V)
VOUT (V) NORMALIZED TO 2.048V AT
VIN = 3.0V
FIGURE 15. IIN vs VIN (3 UNITS)
2.04800
4.3
VIN (V)
VIN (V)
2.0496
2.0492
2.0488
UNIT 2
2.0484
UNIT 1
2.0480
2.0476
UNIT 3
2.0472
-40
-25
-10
5
20
35
50
65
80
95
110 125
TEMPERATURE (°C)
FIGURE 20. VOUT vs TEMPERATURE (3 UNITS)
Page 9 of 20
ISL21007
Typical Performance Curves (ISL21007-20)
(REXT = 100kΩ) (Continued)
X: 200mV/DIV
Y: 10µs/DIV
0
10nF LOAD
100nF LOAD
-20
PSRR (dB)
VIN = +0.3V
-40
1µF LOAD
-60
-80
VIN = -0.3V
NO LOAD
-100
1.0E+01
1.0E+03
1.0E+05
FREQUENCY (Hz)
FIGURE 22. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD
FIGURE 21. PSRR vs CAPACITIVE LOADS
X: 100µs/DIV
Y: 2V/DIV
X: 200mV/DIV
Y: 10µs/DIV
VIN = +0.3V
VIN
VOUT = 2.048V
VIN = -0.3V
FIGURE 23. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FIGURE 24. TURN-ON TIME
GAIN IS x1000,
NOISE IS 4.5µVP-P
140
1nF
10nF
120
100nF
2mV/DIV
ZOUT ()
100
NO LOAD
80
60
40
20
0
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
1.00E+05
1.00E+06
FREQUENCY (Hz)
FIGURE 25. ZOUT VS FREQUENCY
FN6326 Rev.12.00
Jun 9, 2017
FIGURE 26. VOUT NOISE, 0.1Hz TO 10Hz
Page 10 of 20
ISL21007
Typical Performance Curves (ISL21007-20)
(REXT = 100kΩ) (Continued)
X: 20µs/DIV
Y: 200mV/DIV
X: 20µs/DIV
Y: 200mV/DIV
+7mA
+7mA
-7mA
-7mA
FIGURE 27. LOAD TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FIGURE 28. LOAD TRANSIENT RESPONSE, NO CAPACITIVE LOAD
Typical Performance Curves (ISL21007-25)
(REXT = 100kΩ)
100
120
UNIT 3
95
100
IIN (µA)
IIN (µA)
85
UNIT 1
60
40
80
+25°C
-40°C
75
70
20
0
+125°C
90
UNIT 2
80
65
60
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
6.0
3.0
4.0
3.5
UNIT 1
2.5000
UNIT 2
UNIT 3
2.4998
2.4997
2.4996
2.5
5.5
100
VO (µV)
(NORMALIZED TO VIN = 3.0V)
VOUT (V)
(NORMALIZED TO 2.500V AT VIN = 3V)
2.5002
2.4999
5.0
FIGURE 30. IIN vs VIN OVER TEMPERATURE
FIGURE 29. IIN vs VIN (3 UNITS)
2.5001
4.5
VIN (V)
VIN (V)
3.0
3.5
4.0
4.5
5.0
VIN (V)
FIGURE 31. LINE REGULATION (3 UNITS)
FN6326 Rev.12.00
Jun 9, 2017
5.5
50
0
-50
-100
+25°C
-150
+125°C
-200
-250
-300
-40°C
-350
-400
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VIN (V)
FIGURE 32. LINE REGULATION OVER TEMPERATURE
Page 11 of 20
ISL21007
Typical Performance Curves (ISL21007-25)
0.6
(REXT = 100kΩ) (Continued)
2.5003
+125°C
2.5000
+25°C
VOUT (V)
VOUT (mV)
2.5001
-40°C
0.2
0
UNIT 2
2.5002
0.4
-0.2
-0.4
UNIT 1
2.4999
2.4998
2.4997
2.4996
-0.6
2.4995
-0.8
2.4994
-1.0
-7 -6 -5 -4
2.4993
-40
SINKING
-3 -2 -1
0
1
2
3
4
OUTPUT CURRENT (mA)
5
6
7
UNIT 3
-20
0
FIGURE 33. LOAD REGULATION OVER TEMPERATURE
20
40
60
80
100
120
140
TEMPERATURE (°C)
SOURCING
FIGURE 34. VOUT vs TEMPERATURE (3 UNITS)
X: 200mV/DIV
Y: 10µs/DIV
10
NO LOAD
1nF
10nF
100nF
0
-10
PSRR (dB)
-20
-30
VIN = +0.3V
1µF
-40
-50
-60
VIN = -0.3V
-70
-80
-90
-100
1.E+00
1.E+02
1.E+04
1.E+06
FREQUENCY (Hz)
FIGURE 35. PSRR vs CAPACITIVE LOADS
X: 200mV/DIV
Y: 10µs/DIV
FIGURE 36. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD
X: 20µs/DIV
Y: 1V/DIV
VIN = +0.3V
VIN
VIN = -0.3V
FIGURE 37. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FN6326 Rev.12.00
Jun 9, 2017
VOUT = 2.5V
FIGURE 38. TURN-ON TIME
Page 12 of 20
ISL21007
Typical Performance Curves (ISL21007-25)
(REXT = 100kΩ) (Continued)
GAIN IS x1000,
NOISE IS 4.5µVP-P
140
1nF
10nF
120
100nF
2mV/DIV
ZOUT ()
100
NO LOAD
80
60
40
20
0
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
1.00E+05
1.00E+06
FREQUENCY (Hz)
FIGURE 39. ZOUT vs FREQUENCY
FIGURE 40. VOUT NOISE, 0.1Hz TO 10Hz
NO OUTPUT CAPACITANCE
X: 50µs/DIV
Y: 500mV/DIV
+5mA
-5mA
FIGURE 41. LOAD TRANSIENT RESPONSE
Typical Performance Curves (ISL21007-30)
(REXT = 100kΩ)
120
120
UNIT 2
100
80
IIN (µA)
IIN (µA)
80
UNIT 1
60
60
40
40
20
20
0
3.2
+125°C
100
UNIT 3
3.7
4.2
4.7
VIN (V)
FIGURE 42. IIN vs VIN (3 UNITS)
FN6326 Rev.12.00
Jun 9, 2017
5.2
+25°C
0
3.2
3.7
-40°C
4.2
4.7
5.2
VIN (V)
FIGURE 43. IIN vs VIN OVER TEMPERATURE
Page 13 of 20
ISL21007
3.0005
(REXT = 100kΩ) (Continued)
UNIT 1
2.9995
UNIT 2
UNIT 3
2.9985
2.9975
2.9965
2.9955
3.2
3.6
4.0
4.4
4.8
5.2
5.6
VOUT (V) NORMALIZED TO 3.0V AT
5.0VIN
VOUT(V) NORMALIZED TO 3.0V AT
5.0VIN
Typical Performance Curves (ISL21007-30)
3.001
3.000
2.999
+125°C
+25°C
2.998
2.997
-40°C
2.996
2.995
2.994
3.2
3.6
4.0
VIN (V)
0.05
-40°C
+25°C
-0.05
-0.10
+125°C
-0.15
-0.20
SINKING
0
1
2
LOAD (mA)
3
4
5
6
7
VOUT (V) NORMALIZED TO 3.0V AT +25°C
VOUT (mV) NORMALIZED TO
0mA
0.10
-0.25
-7 -6 -5 -4 -3 -2 -1
4.8
5.2
5.6
FIGURE 45. LINE REGULATION OVER TEMPERATURE
FIGURE 44. LINE REGULATION (3 UNITS)
0.00
4.4
VIN (V)
3.0006
3.0004
3.0002
UNIT 3
3.0000
2.9998
UNIT 2
2.9996
2.9992
2.9990
-40 -25 -10
5
20
35
50
65
80
95 110 125
TEMPERATURE (°C)
SOURCING
FIGURE 46. LOAD REGULATION OVER TEMPERATURE
UNIT 1
2.9994
FIGURE 47. VOUT vs TEMPERATURE (3 UNITS)
PSRR (dB)
X: 200mV/DIV
Y: 10µs/DIV
10
0 VIN (DC) = 5.0V
-10 VIN (AC) = 50mVP-P
-20
-30
-40
-50
-60
-70
-80
-90
-100
1.E+00
1.E+02
NO LOAD
1nF
10nF
100nF
VIN = +0.5V
1µF
VIN = -0.5V
1.E+04
1.E+06
FREQUENCY (Hz)
FIGURE 48. PSRR vs CAPACITIVE LOADS
FN6326 Rev.12.00
Jun 9, 2017
FIGURE 49. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD
Page 14 of 20
ISL21007
Typical Performance Curves (ISL21007-30)
(REXT = 100kΩ) (Continued)
X: 200mV/DIV
Y: 10µs/DIV
VIN = 5.0V
VIN = +0.5V
1V/DIV
VOUT = 3.0V
VIN = -0.5V
20µs/DIV
FIGURE 50. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
FIGURE 51. TURN-ON TIME
GAIN IS x1000,
NOISE IS 4.5µVP-P
140
1nF
10nF
120
100nF
2mV/DIV
ZOUT ()
100
NO LOAD
80
60
40
20
0
1.00E+00
1.00E+01
1.00E+02
1.00E+03
1.00E+04
1.00E+05
1.00E+06
FREQUENCY (Hz)
FIGURE 52. ZOUT vs FREQUENCY
FIGURE 53. VOUT NOISE, 0.1Hz TO 10Hz
200mV/DIV
+7mA
-7mA
100µs/DIV
FIGURE 54. LOAD TRANSIENT RESPONSE
FN6326 Rev.12.00
Jun 9, 2017
Page 15 of 20
ISL21007
Applications Information
FGA Technology
The ISL21007 voltage reference uses floating gate technology to
create references with very low drift and supply current.
Essentially, the charge stored on a floating gate cell is set
precisely in manufacturing. The reference voltage output itself is
a buffered version of the floating gate voltage. The resulting
reference device has excellent characteristics that are unique in
the industry: very low temperature drift, high initial accuracy, and
almost zero supply current. Also, the reference voltage itself is
not limited by voltage bandgaps or zener settings, so a wide
range of reference voltages can be programmed (standard
voltage settings are provided, but customer-specific voltages are
available).
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output transistor circuitry. While providing
excellent accuracy, there are limitations in output noise level and
load regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Micropower Operation
The ISL21007 consumes extremely low supply current due to the
proprietary FGA technology. Low noise performance is achieved
using optimized biasing techniques. Supply current is typically
75µA and noise is 4.5µVP-P benefitting precision, low noise
portable applications such as handheld meters and instruments.
Data Converters in particular can use the ISL21007 as an
external voltage reference. Low power DAC and ADC circuits will
realize maximum resolution with lowest noise.
Handling and Board Mounting
FGA references provide excellent initial accuracy and low
temperature drift at the expense of very little power drain. There
are some precautions to take to ensure this accuracy is not
compromised. Excessive heat during solder reflow can cause
excessive initial accuracy drift, so the recommended +260°C
max temperature profile should not be exceeded. Expect up to
1mV drift from the solder reflow process.
Board Assembly Considerations
FGA references provide high accuracy and low temperature drift
but some PC board assembly precautions are necessary. Normal
Output voltage shifts of 100µV to 1mV can be expected with
Pb-free reflow profiles or wave solder on multi-layer FR4 PC
boards. Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder temperatures,
this may reduce device initial accuracy.
Post-assembly X-ray inspection may also lead to permanent
changes in device output voltage and should be minimized or
avoided. If X-ray inspection is required, it is advisable to monitor
the reference output voltage to verify excessive shift has not
occurred. If large amounts of shift are observed, it is best to add
an X-ray shield consisting of thin zinc (300µm) sheeting to allow
clear imaging, yet block X-ray energy that affects the FGA
reference.
Special Applications Considerations
In addition to post-assembly examination, there are also other
X-ray sources that may affect the FGA reference long term
accuracy. Airport screening machines contain X-rays and will
have a cumulative effect on the voltage reference output
accuracy. Carry-on luggage screening uses low level X-rays and is
not a major source of output voltage shift, however, if a product is
expected to pass through that type of screening over 100 times,
it may need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can cause
output voltage shift in much fewer passes, thus devices expected
to go through those machines should definitely consider
shielding. Note that just two layers of 1/2 ounce copper planes
will reduce the received dose by over 90%. The leadframe for the
device which is on the bottom also provides similar shielding.
If a device is expected to pass through luggage X-ray machines
numerous times, it is advised to mount a 2-layer (minimum) PC
board on the top, along with a ground plane underneath, which will
effectively shield it from 50 to 100 passes through the machine.
Because these machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
FGA references are susceptible to excessive X-radiation like that
used in PC board manufacturing. Initial accuracy can change
10mV or more under extreme radiation. If an assembled board
needs to be X-rayed, care should be taken to shield the FGA
reference device.
Board Mounting Considerations
For applications requiring the highest accuracy, board mounting
location should be reviewed. Placing the device in areas subject
to slight twisting can cause degradation of the accuracy of the
reference voltage due to die stresses. It is normally best to place
the device near the edge of a board, or the shortest side, as the
axis of bending is most limited at that location. Obviously,
mounting the device on flexprint or extremely thin PC material
will likewise cause loss of reference accuracy.
FN6326 Rev.12.00
Jun 9, 2017
Page 16 of 20
ISL21007
Noise Performance and Reduction
Temperature Coefficient
The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically
4.5µVP-P. The noise measurement is made with a bandpass filter
made of a 1-pole high-pass filter with a corner frequency at 0.1Hz
and a 2-pole low-pass filter with a corner frequency at 12.6Hz to
create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz
bandwidth is approximately 40µVP-P with no capacitance on the
output. This noise measurement is made with a 2 decade
bandpass filter made of a 1-pole high-pass filter with a corner
frequency at 1/10 of the center frequency and 1-pole low-pass
filter with a corner frequency at 10 times the center frequency.
Load capacitance up to 1000pF can be added but will result in
only marginal improvements in output noise and transient
response. The output stage of the ISL21007 is not designed to
drive heavily capacitive loads, so for load capacitances above
0.001µF, the noise reduction network shown in Figure 55 on
page 17 is recommended. This network reduces noise significantly
over the full bandwidth. Noise is reduced to less than 20µVP-P from
1Hz to 1MHz using this network with a 0.01µF capacitor and a 2kΩ
resistor in series with a 10µF capacitor. Also, transient response is
improved with higher value output capacitor. The 0.01µF value can
be increased for better load transient response with little sacrifice
in output stability.
The limits stated for temperature coefficient (tempco) are governed
by the method of measurement. The overwhelming standard for
specifying the temperature drift of a reference is to measure the
reference voltage at two temperatures, take the total variation,
(VHIGH – VLOW), and divide by the temperature extremes of
measurement (THIGH – TLOW). The result is divided by the nominal
reference voltage (at T = +25°C) and multiplied by 106 to yield
ppm/°C. This is the “Box” method for specifying temperature
coefficient.
Output Voltage Adjustment
The output voltage can be adjusted up or down by 2.5% by placing a
potentiometer from VOUT to ground, and connecting the wiper to the
TRIM pin. The TRIM input is high impedance, so no series resistance
is needed. The resistor in the potentiometer should be a low tempco
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