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ISL28214FBZ-T7

ISL28214FBZ-T7

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC OPAMP GP 2 CIRCUIT 8SOIC

  • 数据手册
  • 价格&库存
ISL28214FBZ-T7 数据手册
DATASHEET ISL28114, ISL28214, ISL28414 Single, Dual, Quad General Purpose Micropower, RRIO Operational Amplifiers FN6800 Rev 10.00 December 8, 2016 The ISL28114, ISL28214, and ISL28414 are single, dual, and quad channel general purpose micropower, rail-to-rail input and output operational amplifiers with supply voltage range of 1.8V to 5.5V. Key features are a low supply current of 390µA maximum per channel at room temperature, a low bias current, and a wide input voltage range, which enables the ISL28x14 devices to be excellent general purpose op amps for a wide range of applications. Features The ISL28114 is available in the SC70-5 and SOT23-5 packages, the ISL28214 is in the MSOP8, SO8, and SOT23-8 packages, and the ISL28414 is in the TSSOP14 and SOIC14 packages. All devices operate across the extended temperature range of -40°C to +125°C. • Packages - ISL28114 (single). . . . . . . . . . . . . . . . . . . . SC70-5, SOT23-5 - ISL28214 (dual) . . . . . . . . . . . . . . . . MSOP8, SO8, SOT23-8 - ISL28414 (quad) . . . . . . . . . . . . . . . . . . . SOIC14, TSSOP14 Related Literature Applications • For a full list of related documents, visit our website - ISL28114, ISL28214 and ISL28414 product pages • Process control • Low current consumption . . . . . . . . . . . . . . . . . . . . . . . . 390µA • Wide supply range . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V • Gain-bandwidth product . . . . . . . . . . . . . . . . . . . . . . . . . . 5MHz • Input bias current. . . . . . . . . . . . . . . . . . . . . . . . . . . 20pA, Max. • Operating temperature range. . . . . . . . . . . .-40°C to +125°C • Power supply control/regulation • Signal gain/buffers • Active filters • Current shunt sensing • Transimpedance amp RF 100kΩ LOAD RINRSENSE IN- 10kΩ RIN+ IN+ +5V - VOUT V+ ISL28x14 V- + 10kΩ GAIN = 10 RREF+ 100kΩ VREF SINGLE-SUPPLY, LOW-SIDE CURRENT SENSE AMPLIFIER FIGURE 1. TYPICAL APPLICATION FN6800 Rev 10.00 December 8, 2016 Page 1 of 23 ISL28114, ISL28214, ISL28414 Ordering Information PART NUMBER (Note 4) PART MARKING TAPE AND REEL (UNITS) PACKAGE (RoHS COMPLIANT) PKG. DWG. # ISL28114FEZ-T7 (Notes 1, 2) BKA (Note 5) 3k 5 Ld SC-70 P5.049 ISL28114FEZ-T7A (Notes 1, 2) BKA (Note 5) 250 5 Ld SC-70 P5.049 ISL28114FHZ-T7 (Notes 1, 2) BDBA (Note 5) 3k 5 Ld SOT-23 P5.064A ISL28114FHZ-T7A (Notes 1, 2) BDBA (Note 5) 250 5 Ld SOT-23 P5.064A ISL28214FUZ (Note 2) 8214Z - 8 Ld MSOP M8.118A ISL28214FUZ-T7 (Notes 1, 2) 8214Z 1.5k 8 Ld MSOP M8.118A ISL28214FBZ (Note 2) 28214 FBZ - 8 Ld SOIC M8.15E ISL28214FBZ-T7 (Notes 1, 2) 28214 FBZ 1k 8 Ld SOIC M8.15E ISL28214FBZ-T13 (Notes 1, 2) 28214 FBZ 2.5k 8 Ld SOIC M8.15E ISL28214FHZ-T7 (Notes 1, 3) BELA (Note 5) 3k 8 Ld SOT-23 P8.064 ISL28214FHZ-T7A (Notes 1, 3) BELA (Note 5) 250 8 Ld SOT-23 P8.064 ISL28414FVZ (Note 2) 28414 FVZ - 14 Ld TSSOP MDP0044 ISL28414FVZ-T7 (Notes 1, 2) 28414 FVZ 1k 14 Ld TSSOP MDP0044 ISL28414FVZ-T13 (Notes 1, 2) 28414 FVZ 2.5k 14 Ld TSSOP MDP0044 ISL28414FBZ (Note 2) 28414 FBZ - 14 Ld SOIC MDP0027 ISL28414FBZ-T7 (Notes 1, 2) 28414 FBZ 1k 14 Ld SOIC MDP0027 ISL28414FBZ-T13 (Notes 1, 2) 28414 FBZ 2.5k 14 Ld SOIC MDP0027 ISL28114SOT23EVAL1Z Evaluation Board ISL28214MSOPEVAL2Z Evaluation Board ISL28214SOICEVAL2Z Evaluation Board ISL28414TSSOPEVAL1Z Evaluation Board NOTES: 1. Refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and NiPdAu plate-e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), see device information page for ISL28114, ISL28214, ISL28414. For more information on MSL, see Tech Brief TB363. 5. The part marking is located on the bottom of the part. FN6800 Rev 10.00 December 8, 2016 Page 2 of 23 ISL28114, ISL28214, ISL28414 Pin Configurations IN+ 1 VS- 2 IN- 3 ISL28214 (8 LD MSOP, 8 LD SOIC, 8 LD SOT-23) TOP VIEW ISL28114 (5 LD SOT-23) TOP VIEW ISL28114FEZ (5 LD SC-70) TOP VIEW VS+ 5 OUT 4 OUT 1 VS- 2 IN+ 3 5 4 VS+ IN- OUT_A 1 8 VS+ IN-_A 2 7 OUT_B IN+_A 3 6 IN-_B VS- 4 5 IN+_B ISL28414 (14 LD TSSOP, 14 LD SOIC) TOP VIEW OUT_A 1 14 OUT_D IN-_A 2 13 IN-_D IN+_A 3 12 IN+_D VS+ 4 11 VS- IN+_B 5 10 IN+_C IN-_B 6 9 IN-_C 8 OUT_C OUT_B 7 Pin Descriptions PIN NUMBER PIN NAME 5 Ld SC-70 OUT OUT_A OUT_B OUT_C OUT_D 4 5 Ld SOT-23 8 Ld MSOP, 8 Ld SOIC, 8 Ld SOT-23 14 Ld TSSOP, 14 LD SOIC DESCRIPTION CIRCUITS Output 1 1 7 V+ 1 7 8 14 OUT VCIRCUIT 1 VS- 2 2 4 11 Negative supply voltage V+ CAPACITIVELY TRIGGERED ESD CLAMP VCIRCUIT 2 IN+ IN+_A IN+_B IN+_C IN+_D 1 ININ-_A IN-_B IN-_C IN-_D 3 VS+ 5 Positive Input 3 3 5 2 6 FN6800 Rev 10.00 December 8, 2016 IN- IN+ Negative Input 4 5 V+ 3 5 10 12 8 2 6 9 13 4 VCIRCUIT 3 Positive supply voltage See “CIRCUIT 2” Page 3 of 23 ISL28114, ISL28214, ISL28414 Absolute Maximum Ratings (TA = +25°C) Thermal Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6.5V Supply Turn-on Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/µs Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .V- - 0.5V to V+ + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V- - 0.5V to V+ + 0.5V ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV Machine Model (ISL28114, ISL28214) . . . . . . . . . . . . . . . . . . . . . . . 350V Machine Model (ISL28414). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 5 Ld SC-70 (Notes 6) . . . . . . . . . . . . . . . . . . 250 N/A 5 Ld SOT-23 (Notes 6) . . . . . . . . . . . . . . . . . 225 N/A 8 Ld MSOP (Notes 6, 7) . . . . . . . . . . . . . . . . 180 100 8 Ld SOIC Package (Notes 6, 7) . . . . . . . . . 126 90 8 Ld SOT-23 Package (Notes 6, 7) . . . . . . . 240 168 14 Ld TSSOP Package (Notes 6, 7) . . . . . . 120 40 14 Ld SOIC Package (Notes 6, 7) . . . . . . . . 90 50 Ambient Operating Temperature Range . . . . . . . . . . . . . .-40°C to +125°C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. For JC, the “case temp” location is taken at the package top center. Electrical Specifications VS+ = 5V, VS- = 0V, RL = Open, VCM = VS/2, TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C, unless otherwise specified. PARAMETER DESCRIPTION TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNIT -4 0.5 4 mV 5 mV DC SPECIFICATIONS VOS Input Offset Voltage -40°C to +125°C TCVOS Input Offset Voltage Temperature Coefficient IOS Input Offset Current IB Input Bias Current -5 -40°C to +125°C ISL28114 5 1 30 pA 3 20 pA 100 pA 20 pA -50 50 pA - 0.1 5.1 V -20 -100 ISL28214, ISL28414 Common-Mode Input Voltage Range CMRR PSRR VOH Common-Mode Rejection Ratio Power Supply Rejection Ratio Output Voltage Swing, High µV/°C -20 3 VCM = -0.1V to 5.1V 72 dB -40°C to +125°C 70 dB VS = 1.8V to 5.5V 71 dB -40°C to +125°C 70 dB 4.993 V RL = 10kΩ 4.985 4.98 VOL Output Voltage Swing, Low V+ Supply Voltage IS Supply Current per Amplifier RL = 10kΩ V 13 1.8 RL = OPEN 300 15 mV 20 mV 5.5 V 390 µA 475 µA ISC+ Output Source Short-Circuit Current RL = 10Ω to V- -31 mA ISC- Output Sink Short-Circuit Current 26 mA FN6800 Rev 10.00 December 8, 2016 RL = 10Ω to V+ Page 4 of 23 ISL28114, ISL28214, ISL28414 Electrical Specifications VS+ = 5V, VS- = 0V, RL = Open, VCM = VS/2, TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C, unless otherwise specified. (Continued) PARAMETER DESCRIPTION TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNIT AC SPECIFICATIONS GBWP Gain-Bandwidth Product VS = ±2.5V AV = 100, RF = 100kΩ, RG = 1kΩ, RL = 10kΩ to VCM eN VP-P Peak-to-Peak Input Noise Voltage eN Input Noise Voltage Density iN Input Noise Current Density ZIN Input Impedance Cin Differential Input Capacitance Common-Mode Input Capacitance 5 MHz VS = ±2.5V f = 0.1Hz to 10Hz 12 µVP-P VS = ±2.5V f = 1kHz 40 nV/√(Hz) VS = ±2.5V f = 10kHz 16 nV/√(Hz) VS = ±2.5V f = 1kHz 8 fA/√(Hz) 1012 Ω 1.0 pF 1.3 pF VS = ±2.5V f = 1MHz TRANSIENT RESPONSE SR Slew Rate VOUT = 0.5V to 4.5V 2.5 V/µs tr, tf, Small Signal Rise Time, tr 10% to 90% VS = ±2.5V AV = +1, VOUT = 0.05VP-P RF = 0Ω, RL = 10kΩCL = 15pF 37 ns 42 ns 5.6 µs Fall Time, tf 10% to 90% ts Settling Time to 0.1%, 4VP-P Step VS = ±2.5V AV = +1, RF = 0ΩRL = 10kΩ CL = 1.2pF NOTE: 8. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design. FN6800 Rev 10.00 December 8, 2016 Page 5 of 23 ISL28114, ISL28214, ISL28414 Typical Performance Curves VS = ±2.5V, VCM = 0V, RL = Open, unless otherwise specified. 50 INPUT NOISE VOLTAGE (nV/Hz) 10,000 40 30 10 0 -10 -20 -30 -40 SIMULATION -50 -40 -20 0 20 40 60 80 100 120 1000 100 10 140 1 10 TEMPERATURE (°C) 1k 10k 100k FIGURE 3. INPUT NOISE VOLTAGE SPECTRAL DENSITY FIGURE 2. INPUT BIAS CURRENT vs TEMPERATURE 20 120 20 100 0 100 0 80 -20 GAIN 60 -40 40 -60 20 -80 0 -100 -20 V+ = ±0.9V RL = 100k -40 CL = 10pF -60 SIMULATION -80 0.1 1 10 -120 PHASE -140 -160 100 1k 10k 100k FREQUENCY (Hz) 1M -180 10M 100M 80 -60 20 -80 0 -100 -20 V+ = ±0.9V RL = 100k -40 CL = 10pF -60 SIMULATION -80 0.1 70 80 60 70 30 0 0.01 10 -140 -160 100 1k 10k 100k FREQUENCY (Hz) 1M -180 10M 100M PSRR+ VS = ±0.9V PSRR+ VS = ±2.5V PSRR- VS = ±2.5V 60 50 40 PSRR- VS = ±0.9V 30 RL = INF 20 C = 4pF L 10 AV = +1 20 10 1 -120 PHASE FIGURE 5. OPEN-LOOP GAIN, PHASE vs FREQUENCY, RL = 100kΩ, CL = 10pF, VS = ±2.5V 90 40 -40 40 80 50 -20 GAIN 60 PSRR (dB) CMRR (dB) FIGURE 4. OPEN-LOOP GAIN, PHASE vs FREQUENCY, RL = 100kΩ, CL = 10pF, VS = ±0.9V OPEN-LOOP GAIN (dB) 120 PHASE (°) OPEN-LOOP GAIN (dB) 100 FREQUENCY (Hz) SIMULATION 0.1 1 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100M FIGURE 6. CMRR vs FREQUENCY (SIMULATED DATA) FN6800 Rev 10.00 December 8, 2016 PHASE (°) IBIAS (pA) 20 V+ = ±2.5V AV = 1 VCM = 100mVP-P 0 100 1k 10k 100k FREQUENCY (Hz) 1M 10M FIGURE 7. PSRR vs FREQUENCY, VS = ±0.9V, ±2.5V Page 6 of 23 ISL28114, ISL28214, ISL28414 Typical Performance Curves 70 GAIN (dB) AV = 100 V+ = ±2.5V CL = 4pF RL = 10k VOUT = 50mVP-P 30 20 AV = 10 Rg = 10k, Rf = 100k 10 0 0 Rg = 1k, Rf = 100k 50 40 1 Rg = 100, Rf = 100k AV = 1000 AV = 1 -10 10 NORMALIZED GAIN (dB) 60 VS = ±2.5V, VCM = 0V, RL = Open, unless otherwise specified. (Continued) Rg = OPEN, Rf = 0 10k 1k 100 100k 1M 10M 100M -1 -2 -3 -4 VOUT = 10mVP-P -5 VOUT = 50mVP-P -6 VS = ±2.5V VOUT = 100mVP-P -7 CL = 4pF A = +1 -8 V RL = 10k -9 100 1k VOUT = 200mVP-P VOUT = 500mVP-P VOUT = 1VP-P 10k 0 -1 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) 10M 100M 14 1 -2 -3 -4 RL = 4.99k -5 RL = 1k -6 V+ = ±2.5V -7 CL = 4pF AV = +1 -8 VOUT = 50mVP-P -9 100 1k 10k RL = 499 1M CL = 1004pF CL = 474pF 6 CL = 224pF 4 CL = 104pF 2 0 CL = 26pF -2 RL = 100 100k VS = ±2.5V 12 RL = 10k AV = +1 10 VOUT = 50mVP-P 8 10M CL = 4pF -4 1k 100M 10k FREQUENCY (Hz) 100k 1M 10M FREQUENCY (Hz) FIGURE 11. GAIN vs FREQUENCY vs CL FIGURE 10. GAIN vs FREQUENCY vs RL 140 1 0 120 -1 CL = 4pF RL = 10k -2 AV = +1 -3 VOUT = 50mVP-P CROSSTALK (dB) NORMALIZED GAIN (dB) 1M FIGURE 9. FREQUENCY RESPONSE vs VOUT FIGURE 8. FREQUENCY RESPONSE vs CLOSED-LOOP GAIN -4 -5 VS = ±2.5V -6 VS = ±1.75V -7 VS = ±1.25V -8 -9 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) 1M 10M 100M FREQUENCY (Hz) FIGURE 12. GAIN vs FREQUENCY vs SUPPLY VOLTAGE FN6800 Rev 10.00 December 8, 2016 80 60 40 20 VS = ±0.9V 100k 100 0 10 VS = ±2.5V RL-DRIVER = INF RL-RECEIVER = 10k CL = 4pF AV = +1 VSOURCE = 1VP-P 100 1k 10k 100k 1M 10M FREQUENCY (Hz) FIGURE 13. CROSSTALK, VS = ±2.5V Page 7 of 23 ISL28114, ISL28214, ISL28414 VS = ±2.5V, VCM = 0V, RL = Open, unless otherwise specified. (Continued) 30 3 20 2 10 LARGE SIGNAL (V) VS = ±2.5V RL = 10k CL = 15pF AV = +1 VOUT = 50mVP-P 0 -10 -20 1 VS = ±0.9V 0 RL = 10k CL = 15pF AV = +1 VOUT = RAIL -1 -2 -30 -40 VS = ±2.5V 0 80 160 240 320 400 480 560 640 720 -3 800 0 1 2 3 4 TIME (ns) 0.5 RL = INF CL = 15pF AV =10 Rf = 9.09k, Rg = 1k INPUT (V) -0.1 -0.2 -0.3 OUTPUT AT VS = ±2.5V 0 0.4 0.8 1.2 1.6 2.0 2.4 TIME (ms) 2.8 3.3 -0.5 0.4 -1.5 -0.5 -0.6 0.5 -1.0 OUTPUT AT VS = ±0.9V -0.4 0 3.6 INPUT (V) 0 8 9 10 3.0 0.6 OUTPUT (V) INPUT 7 FIGURE 15. LARGE SIGNAL TRANSIENT RESPONSE vs RL, VS = ±0.9V, ±2.5V FIGURE 14. SMALL SIGNAL TRANSIENT RESPONSE, VS = ±2.5V 0.1 5 6 TIME (µs) OUTPUT AT VS = ±2.5V -2.5 0 -3.0 4.0 -0.1 1.5 RL = INF CL = 15pF AV = 10 Rf = 9.09k, Rg = 1k 0.2 0.1 2.0 OUTPUT AT VS = ±0.9V 0.3 -2.0 2.5 1.0 0.5 0 INPUT 0 0.4 0.8 1.2 1.6 2.0 2.4 TIME (ms) 2.8 3.3 3.6 -0.5 4.0 FIGURE 17. POSITIVE OUTPUT OVERLOAD RESPONSE TIME, VS = ±0.9V, ±2.5V FIGURE 16. NEGATIVE OUTPUT OVERLOAD RESPONSE TIME, VS = ±0.9V, ±2.5V 100 + O T T - SH O O O VE 60 O VE R 50 SH 70 O OVERSHOOT (%) 80 VS = ±2.5V RL = 10k AV = 1 VOUT = 50mVP-P R 90 40 30 20 10 0 1 10 100 CAPACITANCE (pF) 1k 10k FIGURE 18. % OVERSHOOT vs LOAD CAPACITANCE, VS = ±2.5V FN6800 Rev 10.00 December 8, 2016 Page 8 of 23 OUTPUT (V) SMALL SIGNAL (mV) Typical Performance Curves ISL28114, ISL28214, ISL28414 Applications Information Power Dissipation Functional Description It is possible to exceed the +125°C maximum junction temperatures under certain load, power supply conditions, and ambient temperature conditions. It is therefore important to calculate the maximum junction temperature (TJMAX) for all applications to determine if power supply voltages, load conditions, or package types need to be modified to remain in the safe operating area. These parameters are related using Equation 1: The ISL28114, ISL28214 and ISL28414 are single, dual, and quad, CMOS rail-to-rail input, output (RRIO) micropower operational amplifiers. They are designed to operate from single supply (1.8V to 5.5V) or dual supply (±0.9V to ±2.75V). The parts have an input common-mode range that extends 100mV above and below the power supply voltage rails. The output stage can swing to within 15mV of the supply rails with a 10kΩ load. Input ESD Diode Protection All input terminals have internal ESD protection diodes to both positive and negative supply rails, limiting the input voltage to within one diode beyond the supply rails. For applications where the input differential voltage is expected to exceed 0.5V, an external series resistor must be used to ensure the input currents never exceed 20mA (see Figure 19). (EQ. 1) T JMAX = T MAX +  JA xPD MAXTOTAL where: • PDMAXTOTAL is the sum of the maximum power dissipation of each amplifier in the package (PDMAX) • PDMAX for each amplifier can be calculated using Equation 2: V OUTMAX PD MAX = V S  I qMAX +  V S - V OUTMAX   -----------------------R L (EQ. 2) where: V+ VIN- RIN- - RIN+ + RF • TMAX = Maximum ambient temperature • JA = Thermal resistance of the package • PDMAX = Maximum power dissipation of 1 amplifier RL • VS = Total supply voltage • IqMAX = Maximum quiescent supply current of 1 amplifier RG V- • VOUTMAX = Maximum output voltage swing of the application • RL = Load resistance FIGURE 19. INPUT ESD DIODE CURRENT LIMITING Output Phase Reversal Output phase reversal is a change of polarity in the amplifier transfer function when the input voltage exceeds the supply voltage. The ISL28114, ISL28214, and ISL28414 are immune to output phase reversal, even when the input voltage is 1V beyond the supplies. Unused Channels If the application requires less than all amplifiers on one channel, the user must configure the unused channel(s) to prevent oscillation. The unused channel(s) will oscillate if the input and output pins are floating. This will result in higher than expected supply currents and possible noise injection into the channel being used. The proper way to prevent this oscillation is to short the output to the inverting input and ground the positive input (as shown in Figure 20). ISL28114, ISL28214, and ISL28414 SPICE Model Figure 21 on page 11 shows the SPICE model schematic and Figure 22 on page 12 shows the net list for the SPICE model. The model is a simplified version of the actual device and simulates important AC and DC parameters. AC parameters incorporated into the model are: 1/f and flatband noise, Slew Rate, CMRR, Gain, and Phase. The DC parameters are IOS, total supply current, and output voltage swing. The model uses typical parameters given in the “Electrical Specifications” Table beginning on page 4. The AVOL is adjusted for 90dB with the dominate pole at 125Hz. The CMRR is set 72dB, f = 80kHz. The input stage models the actual device to present an accurate AC representation. The model is configured for ambient temperature of +25°C. Figures 23 through 30 show the characterization vs simulation results for the Noise Voltage, Closed Loop Gain vs Frequency, Large Signal 5V Step Response, and CMRR and Open-Loop Gain Phase. + FIGURE 20. PREVENTING OSCILLATIONS IN UNUSED CHANNELS FN6800 Rev 10.00 December 8, 2016 Page 9 of 23 ISL28114, ISL28214, ISL28414 LICENSE STATEMENT The information in this SPICE model is protected under the United States copyright laws. Intersil Corporation hereby grants users of this macro-model hereto referred to as “Licensee”, a nonexclusive, nontransferable license to use this model as long as the Licensee abides by the terms of this agreement. Before using this macro-model, the Licensee should read this license. If the Licensee does not accept these terms, permission to use the model is not granted. The Licensee may not sell, loan, rent, or license the macro-model, in whole, in part, or in modified form, to anyone outside the Licensee’s company. The Licensee may modify the macro-model to suit his/her specific applications, and the Licensee may make copies of this macro-model for use within their company only. This macro-model is provided “AS IS, WHERE IS, AND WITH NO WARRANTY OF ANY KIND EITHER EXPRESSED OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.” In no event will Intersil be liable for special, collateral, incidental, or consequential damages in connection with or arising out of the use of this macro-model. Intersil reserves the right to make changes to the product and the macro-model without prior notice. FN6800 Rev 10.00 December 8, 2016 Page 10 of 23 1e-6 2 R1 4.0004 En 1 IN+ 3 En GAIN = 1 R5 4 M15 NCHANNELMOSFET 9 10 IN- NCHANNELMOSFET DN R22 5e11 D13 + - R23 5e11 29 DX V3 100 16 D2 10 + - CinDif 1.02E-12 0 V9 10 17 .61 EOS GAIN = 1e-3 0 14 R6 1 15 5 6 11 12 IOS1 25e-12 Vcm .61 R24 0.425 7 10 Vin- 10 RA2 G2A 13 G2 1 GAIN = 351 V2 I1 5e-3 Voltage Noise Stage V4 R8 4 R7 4 R25 18 R12 1 GAIN = 334.753e-3 DX 28 8 R11 GAIN = 334.753e-3 R9 PMOSISIL M16 PMOSISIL M17 M14 30 + - RA1 + - + - GAIN = 351 G1 + - R21 + - DX + - Vin+ R2 4.0004 D3 R10 1e9 D1 G1A I2 5e-3 1e-6 D4 Cin2 1.26e-12 Cin1 1.26e-12 Input Stage 1st Gain Stage V+ E2 + - + - GAIN = 1 0 V++ G11 .604 636.6588k 21 V5 Vg 50 D7 DX 23 26 Vmid 300e-6 E4 R14 636.6588k + - D6 Page 11 of 23 C3 2E-9 + - DX G6 GAIN = 24.89e-3 GAIN = 2.5118E-08 G8 22 Gain Stage C5 1591.596 L2 10e-12 G9 D11 15.9159E-3 + - GAIN = 0.02 G10 + - G12 D12 GAIN = 0.02 GAIN = 0.02 V-- VMid Supply ref V R18 GAIN = 6.283e-4 Correction Current E3 + - Common Mode 2nd Gain Stage V8 25 .08 R16 10e3 + - 20 27 + - DY + - G4 DX V6 VOUT ISY D8 .604 V7 24 .08 Vc R19 GAIN = 0.02 10e-12 GAIN = 6.283e-4 R15 10e3 GAIN = 2.5118E-08 D10 DY GAIN = 24.89e-3 + - R13 C4 + - GAIN = 1 Sources Pole Stage with Zero 0 FIGURE 21. SPICE SCHEMATIC + - 19 R17 1591.596 + - DX + - D9 G7 15.9159E-3 G5 DX C2 2E-9 + - DX L1 D5 G3 Output Stage R20 50 ISL28114, ISL28214, ISL28414 V1 DX FN6800 Rev 10.00 December 8, 2016 . ISL28114, ISL28214, ISL28414 *ISL28114 Macromodel - covers following *products *ISL28114 *ISL28214 *ISL28414 ** *Revision History: *Revision C, LaFontaine October 20th 2011 *Model for Noise to match measured part, * quiescent supply currents, *CMRR 72dB *fcm=100kHz, AVOL 90dB f=125Hz, SR = *2.5V/us, GBWP 5MHz, 2nd pole 10Mhz output voltage clamp and short ckt current *limit. ** *Copyright 2011 by Intersil Corporation *Refer to data sheet "LICENSE *STATEMENT" Use of this model indicates *your acceptance with the terms and *provisions in the License Statement. * *Intended use: *This Pspice Macromodel is intended to give *typical DC and AC performance *characteristics under a wide range of *external circuit configurations using *compatible simulation platforms - such as *iSim PE. * *Device performance features supported by *this model: *Typical, room temp., nominal power supply *voltages used to produce the following *characteristics: *Open and closed loop I/O impedances *Open loop gain and phase *Closed loop bandwidth and frequency *response *Loading effects on closed loop frequency *response *Input noise terms including 1/f effects *Slew rate *Input and Output Headroom limits to I/O *voltage swing *Supply current at nominal specified supply *voltages ** *Device performance features NOT *supported by this model *Harmonic distortion effects *Disable operation (if any) *Thermal effects and/or over temperature *parameter variation *Limited performance variation vs. supply *voltage is modeled *Part to part performance variation due to *normal process parameter spread *Any performance difference arising from *different packaging * source * Connections: +input * | -input * | | +Vsupply * | | | -Vsupply * | | | | output * | | | | | .subckt ISL28114 Vin+ Vin- V+ V- VOUT * source ISL28114_DS rev2 * *Voltage Noise E_En VIN+ EN 28 0 1 D_D13 29 28 DN V_V9 29 0 0.425 R_R21 28 0 30 * *Input Stage M_M14 3 1 5 5 NCHANNELMOSFET M_M15 4 VIN- 6 6 NCHANNELMOSFET M_M16 11 VIN- 9 9 PMOSISIL M_M17 12 1 10 10 PMOSISIL I_I1 7 V-- DC 5e-3 I_I2 V++ 8 DC 5e-3 I_IOS VIN- 1 DC 25e-12 G_G1A V++ 14 4 3 351 G_G2A V-- 14 11 12 351 V_V1 V++ 2 1e-6 V_V2 13 V-- 1e-6 R_R1 3 2 4.0004 R_R2 4 2 4.0004 R_R3 5 7 10 R_R4 7 6 10 R_R5 9 8 10 R_R6 8 10 10 R_R7 13 11 4 R_R8 13 12 4 R_RA1 14 V++ 1 R_RA2 V-- 14 1 C_CinDif VIN- EN 1.02E-12 C_Cin1 V-- EN 1.26e-12 C_Cin2 V-- VIN- 1.26e-12 * *1st Gain Stage G_G1 V++ 16 15 VMID 334.753e-3 G_G2 V-- 16 15 VMID 334.753e-3 V_V3 17 16 .61 V_V4 16 18 .61 D_D1 15 VMID DX D_D2 VMID 15 DX D_D3 17 V++ DX D_D4 V-- 18 DX R_R9 15 14 100 R_R10 15 VMID 1e9 R_R11 16 V++ 1 R_R12 V-- 16 1 * *2nd Gain Stage G_G3 V++ VG 16 VMID 24.893e-3 G_G4 V-- VG 16 VMID 24.893e-3 V_V5 19 VG .604 V_V6 VG 20 .604 D_D5 19 V++ DX D_D6 V-- 20 DX R_R13 VG V++ 636.658e3 R_R14 V-- VG 636.658e3 C_C2 VG V++ 2E-09 C_C3 V-- VG 2E-09 * *Mid supply Ref E_E4 VMID V-- V++ V-- 0.5 E_E2 V++ 0 V+ 0 1 E_E3 V-- 0 V- 0 1 I_ISY V+ V- DC 300e-6 * *Common Mode Gain Stage with Zero G_G5 V++ VC VCM VMID 2.5118E-8 G_G6 V-- VC VCM VMID 2.5118E-8 E_EOS 1 EN VC VMID 1e-3 R_R15 VC 21 10e3 R_R16 22 VC 10e3 R_R22 EN VCM 5e11 R_R23 VCM VIN- 5e11 L_L1 21 V++ 15.9159e-3 L_L2 22 V-- 15.9159e-3 * *Pole Stage G_G7 V++ 23 VG VMID 6.283e-4 G_G8 V-- 23 VG VMID 6.283e-4 R_R17 23 V++ 1591.596 R_R18 V-- 23 1591.596 C_C4 23 V++ 10e-12 C_C5 V-- 23 10e-12 * *Output Stage with Correction Current Sources G_G9 26 V-- VOUT 23 0.02 G_G10 27 V-- 23 VOUT 0.02 G_G11 VOUT V++ V++ 23 0.02 G_G12 V-- VOUT 23 V-- 0.02 V_V7 24 VOUT .08 V_V8 VOUT 25 .08 D_D7 23 24 DX D_D8 25 23 DX D_D9 V++ 26 DX D_D10 V++ 27 DX D_D11 V-- 26 DY D_D12 V-- 27 DY R_R19 VOUT V++ 50 R_R20 V-- VOUT 50 .model pmosisil pmos (kp=16e-3 vto=-0.6) .model NCHANNELMOSFET nmos (kp=3e-3 vto=0.6) .model DN D(KF=6.69e-9 AF=1) .MODEL DX D(IS=1E-12 Rs=0.1) .MODEL DY D(IS=1E-15 BV=50 Rs=1) .ends ISL28114 FIGURE 22. SPICE NET LIST FN6800 Rev 10.00 December 8, 2016 Page 12 of 23 ISL28114, ISL28214, ISL28414 Characterization vs Simulation Results 10,000 V+ = ±2.5V AV = 1 1000 100 10 1 V+ = ±2.5V AV = 1 INPUT NOISE VOLTAGE (nV/Hz) INPUT NOISE VOLTAGE (nV/Hz) 10,000 10 100 1k FREQUENCY (Hz) 10k 1000 100 10 100k FIGURE 23. CHARACTERIZED INPUT NOISE VOLTAGE 70 GAIN (dB) 30 20 AV = 10 0 Rg = 10k, Rf = 100k 0 Rg = OPEN, Rf = 0 100 1k Rg = 100k, Rf = 100k -10 10k 100k 1M FREQUENCY (Hz) 10M 100M FIGURE 25. CHARACTERIZED CLOSED-LOOP GAIN vs FREQUENCY 10 100 LARGE SIGNAL (V) 1 VS = ±0.9V 0 RL = 10k CL = 15pF AV = +1 VOUT = RAIL -2 0 1 2 3 4 5 6 TIME (µs) 8 9 FIGURE 27. CHARACTERIZED LARGE SIGNAL TRANSIENT RESPONSE vs RL, VS = ±0.9V, ±2.5V FN6800 Rev 10.00 December 8, 2016 10 100M 1 VIN V(VIN+)/VOUT) -0 -1 RL = 10k CL = 15pF AV = +10 VOUT = RAIL -2 7 10M VS = ±2.5V VOUT 2 VS = ±2.5V -1 10k 100k 1.0M FREQUENCY (Hz) (A) AC sims.dat (active) 3 2 1k FIGURE 26. SIMULATED CLOSED-LOOP GAIN vs FREQUENCY 3 LARGE SIGNAL (V) AV = 10 20 AV = 1 -10 10 -3 AV = 100 40 Rg = 10k, Rf = 100k 10 100k Rg = 1k, Rf = 100k V+ = ±2.5V CL = 4pF RL = 10k VOUT = 50mVP-P AV = 100 10k Rg = 100, Rf = 100k AV = 1000 60 Rg = 1k, Rf = 100k 50 40 100 1k FREQUENCY (Hz) (A) AC sims.dat (active) 70 Rg = 100, Rf = 100k AV = 1000 10 FIGURE 24. SIMULATED INPUT NOISE VOLTAGE GAIN (dB) 60 1 -3 0 5 10 15 TIME (µs) 20 25 30 FIGURE 28. SIMULATED LARGE SIGNAL TRANSIENT RESPONSE vs RL, VS = ±0.9V, ±2.5V Page 13 of 23 ISL28114, ISL28214, ISL28414 20 100 0 80 -20 GAIN 60 -40 40 -60 20 -80 0 -100 -20 V+ = ±0.9V RL = 100k -40 CL = 10pF -60 SIMULATION -80 0.1 1 10 -120 PHASE -140 -160 100 1k 10k 100k FREQUENCY (Hz) 1M -180 10M 100M 120 80 GAIN RL = 10k 40 CL = 10pF MODEL VOS SET TO ZERO 0 FOR THIS TEST 80 70 70 60 60 50 50 30 1.0 10 100 1.0k 10k 100k 1M 10M 100M FREQUENCY (Hz) (A) AC sims.dat (active) 40 30 20 20 10 0.1 FIGURE 30. SIMULATED (SPICE) OPEN-LOOP GAIN, PHASE vs FREQUENCY 80 40 PHASE 160 0.01 CMRR (dB) CMRR (dB) FIGURE 29. SIMULATED (DESIGN) OPEN-LOOP GAIN, PHASE vs FREQUENCY (A) AC2.dat (active) 200 OPEN-LOOP GAIN (dB)/PHASE (°) 120 PHASE (°) OPEN-LOOP GAIN (dB) Characterization vs Simulation Results (Continued) 10 SIMULATION 0 0.01 0.1 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M FIGURE 31. SIMULATED (DESIGN) CMRR FN6800 Rev 10.00 December 8, 2016 0 0.01 0.1 1 10 100 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) FIGURE 32. SIMULATED (SPICE) CMRR Page 14 of 23 ISL28114, ISL28214, ISL28414 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION December 8, 2016 FN6800.10 Updated Related Literature section. Updated third Applications bullet. Updated Ordering Information table on page 2. June 11, 2015 FN6800.9 Electrical Spec table, page 5 - Input Noise Voltage Density (eN) added a spec at 10kHz (typical spec). October 26, 2012 FN6800.8 Added SOT23-8 package on page 1 to description and features. Ordering Information on page 2 - Added ISL28214FHZ parts and Note 5 reference. Added Lead Finish Note to Ordering information for 8 LD SOT-23 parts. Thermal Information on page 4 - Added 8 LD SOT-23 package with Tja and Tjc Added P8.064 POD on page 23. April 13, 2012 FN6800.7 Changed the low supply current in “Features” and description on page 1 from 360µA to 390µA. Removed ISL28114FEV1Z-T7 Coming Soon parts from “Ordering Information” on page 2. Removed applicable pinout from page 3. On page 4, changed MIN/MAX limits for “VOS” at 25°C from -5/5mV to -4/4mV. On page 4, changed MIN/MAX limits for “VOS” at -40°C to 125°C from -6/6mV to -5/5mV. On page 4, changed “TCVOS” TYP from 2µV/°C to 5µV/°C. On page 4, changed MAX limit for “IS” MAX at 25°C from 360µA to 390µA. On page 4, changed MAX limit for “IS” MAX at -40°C to 125°C from 400µA to 475µA. Revised Figure 8 on page 7. Revised Figure 11 on page 7. Revised Figure 18 on page 8. January 3, 2012 FN6800.6 Revised “SPICE SCHEMATIC” on page 11 and “SPICE NET LIST” on page 12. May 18, 2011 FN6800.5 - On page 3, Pin Descriptions: Circuit 3 diagram, removed anti-parallel diodes from the IN+ to INterminals. - On page 4, Absolute Maximum Ratings: changed Differential Input Voltage from "0.5V" to "V- 0.5V to V+ + 0.5V" - On page 4, updated CMRR and PSRR parameters in Electrical Specifications table with test condition specifying -40°C to 125°C typical parameter. - On page 5, updated Note 8, referenced in MIN and MAX column headings of Electrical Specifications table, from "Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested." to new standard "Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design." - On page 9, under “Input ESD Diode Protection,” removed “They also contain back to-back diodes across the input terminals.” Removed “Although the amplifier is fully protected, high input slew rates that exceed the amplifier slew rate (±2.5V/µs) may cause output distortion.” - On page 9, Figure 19: updated circuit schematic by removing back-to-back input protection diodes. - On page 11 replaced SPICE schematic (Figure 21) - On page 12 replaced SPICE Netlist (Figure 22) - On page 13 replaced Figure 24 - On page 14 replaced Figure 32 FN6800 Rev 10.00 December 8, 2016 CHANGE Page 15 of 23 ISL28114, ISL28214, ISL28414 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. (Continued) DATE REVISION CHANGE September 23, 2010 FN6800.4 Added new SC70 pinout package extension as follows: Added to Related Literature on page 1 “See AN1547 for “ISL28414TSSOPEVAL1Z Evaluation Board User’s Guide”. Added to ordering information ISL28114FEV1Z-T7 and ISL28114FEV1Z-T7A and Evaluation boards. Added to Pin Configurations new pinout for ISL28114FEV1Z. Added in Pin Descriptions ISL28114FEV1Z SC70 pin description column. Changed Note 7 on page page 4 from “For JC, the “case temp” location is the center of the exposed metal pad on the package underside.” to “For JC, the “case temp” location is taken at the package top center.” Added “Related Literature” on page 1. Changed package outline drawing from MDP0038 to P5.064A on page 2 and page 18. MDP0038 package contained 2 packages for both the 5 and 6 Ld SOT-23. MDP0038 was obsoleted and the packages were separated and made into 2 separate package outline drawings; P5.064A and P6.064A. Changes to the 5 Ld SOT-23 were to move dimensions from table onto drawing, add land pattern and add JEDEC reference number. Added Note 5 to “Ordering Information” on page 2. December 16, 2009 FN6800.3 Removed “Coming Soon” from MSOP package options in the “Ordering Information” on page 2. Updated the Theta JA for the MSOP package option from 170°C/W to 180°C/W on page 4. November 17, 2009 FN6800.2 Removed “Coming Soon” from SC70 and SOT-23 package options in the “Ordering Information” on page 2. November 12, 2009 FN6800.1 Changed theta Ja to 250 from 300. Added license statement (page 10) and reference in spice model (page 12). October 23, 2009 FN6800.0 Initial Release About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. FN6800 Rev 10.00 December 8, 2016 Page 16 of 23 ISL28114, ISL28214, ISL28414 Small Outline Transistor Plastic Packages (SC70-5) P5.049 D VIEW C e1 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES 5 SYMBOL 4 E CL 1 2 CL 3 e E1 b CL 0.20 (0.008) M C C CL A A2 SEATING PLANE A1 -C- PLATING b1 0.043 0.80 1.10 - 0.004 0.00 0.10 - A2 0.031 0.039 0.80 1.00 - b 0.006 0.012 0.15 0.30 - b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 D 0.073 0.085 1.85 2.15 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 e 0.0256 Ref 0.65 Ref - e1 0.0512 Ref 1.30 Ref - L2 c1 NOTES 0.031 0.010 0.018 0.017 Ref. 0.26 0.46 4 0.420 Ref. 0.006 BSC 0o N c MAX 0.000  WITH MIN A L b MILLIMETERS MAX A1 L1 0.10 (0.004) C MIN - 0.15 BSC 8o 0o 5 8o - 5 5 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 Rev. 3 7/07 NOTES: BASE METAL 1. Dimensioning and tolerances per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC70 and JEDEC MO-203AA. 4X 1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1  L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 4X 1 VIEW C 0.4mm 0.75mm For the most recent package outline drawing, see P5.049. 2.1mm 0.65mm TYPICAL RECOMMENDED LAND PATTERN FN6800 Rev 10.00 December 8, 2016 Page 17 of 23 ISL28114, ISL28214, ISL28414 Package Outline Drawing For the most recent package outline drawing, see P5.064A. P5.064A 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 0, 2/10 1.90 0-3° D A 0.08-0.20 5 4 PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 2 5 (0.60) 0.20 C 2x 0.95 SEE DETAIL X B 0.40 ±0.05 3 END VIEW 0.20 M C A-B D TOP VIEW 10° TYP (2 PLCS) 2.90 5 H 0.15 C A-B 2x C 1.45 MAX 1.14 ±0.15 0.10 C SIDE VIEW SEATING PLANE (0.25) GAUGE PLANE 0.45±0.1 0.05-0.15 4 DETAIL "X" (0.60) (1.20) NOTES: (2.40) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. This dimension is measured at Datum “H”. 6. Package conforms to JEDEC MO-178AA. (0.95) (1.90) TYPICAL RECOMMENDED LAND PATTERN FN6800 Rev 10.00 December 8, 2016 Page 18 of 23 ISL28114, ISL28214, ISL28414 Package Outline Drawing For the most recent package outline drawing, see M8.118A. M8.118A 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP) Rev 0, 9/09 3.0±0.1 8 A 0.25 CAB 3.0±0.1 4.9±0.15 DETAIL "X" 1.10 Max PIN# 1 ID B SIDE VIEW 2 1 0.18 ± 0.05 2 0.65 BSC TOP VIEW 0.95 BSC 0.86±0.09 H GAUGE PLANE C 0.25 SEATING PLANE 0.33 +0.07/ -0.08 0.08 C A B 0.10 ± 0.05 3°±3° 0.10 C 0.55 ± 0.15 DETAIL "X" SIDE VIEW 1 5.80 NOTES: 4.40 3.00 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSE Y14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.25mm max per side are not included. 5. Dimensions “D” and “E1” are measured at Datum Plane “H”. 6. This replaces existing drawing # MDP0043 MSOP 8L. 0.65 0.40 1.40 TYPICAL RECOMMENDED LAND PATTERN FN6800 Rev 10.00 December 8, 2016 Page 19 of 23 ISL28114, ISL28214, ISL28414 Package Outline Drawing For the most recent package outline drawing, see M8.15E. M8.15E 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 0, 08/09 4 4.90 ± 0.10 A DETAIL "A" 0.22 ± 0.03 B 6.0 ± 0.20 3.90 ± 0.10 4 PIN NO.1 ID MARK 5 (0.35) x 45° 4° ± 4° 0.43 ± 0.076 1.27 0.25 M C A B SIDE VIEW “B” TOP VIEW 1.75 MAX 1.45 ± 0.1 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.175 ± 0.075 SIDE VIEW “A 0.63 ±0.23 DETAIL "A" (1.27) (0.60) NOTES: (1.50) (5.40) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 identifier may be either a mold or mark feature. 6. Reference to JEDEC MS-012. TYPICAL RECOMMENDED LAND PATTERN FN6800 Rev 10.00 December 8, 2016 Page 20 of 23 ISL28114, ISL28214, ISL28414 Small Outline Package Family (SO) For the most recent package outline drawing, see MDP0027. A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) INCHES SYMBOL SO-14 SO16 (0.300”) (SOL-16) SO20 (SOL-20) SO24 (SOL-24) SO28 (SOL-28) TOLERANCE NOTES A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX - A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 0.003 - A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 0.001 - D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 0.008 - E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic - L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 0.009 - L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference - 16 20 24 28 Reference - N SO-8 SO16 (0.150”) 8 14 16 NOTES: Rev. M 2/07 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994 FN6800 Rev 10.00 December 8, 2016 Page 21 of 23 ISL28114, ISL28214, ISL28414 Thin Shrink Small Outline Package Family (TSSOP) 0.25 M C A B D MDP0044 A THIN SHRINK SMALL OUTLINE PACKAGE FAMILY (N/2)+1 N MILLIMETERS SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE PIN #1 I.D. E E1 1 (N/2) B 0.20 C B A 2X N/2 LEAD TIPS TOP VIEW 0.05 e C SEATING PLANE 0.10 M C A B b 0.10 C N LEADS H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 ±0.05 A2 0.90 0.90 0.90 0.90 0.90 ±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 ±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. F 2/07 NOTES: 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. SIDE VIEW 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. SEE DETAIL “X” 3. Dimensions “D” and “E1” are measured at dAtum Plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. c END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 For the most recent package outline drawing, see MDP0044. 0° - 8° DETAIL X FN6800 Rev 10.00 December 8, 2016 Page 22 of 23 ISL28114, ISL28214, ISL28414 Small Outline Transistor Plastic Packages (SOT23-8) 0.20 (0.008) M CL C P8.064 VIEW C 8 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE e b INCHES SYMBOL 8 7 6 5 CL CL E 1 2 3 E1 4 e1 C D CL A A2 SEATING PLANE A1 -C- MILLIMETERS MAX MIN MAX NOTES A 0.036 0.057 0.90 1.45 - A1 0.000 0.0059 0.00 0.15 - A2 0.036 0.051 0.90 1.30 - b 0.009 0.015 0.22 0.38 - b1 0.009 0.013 0.22 0.33 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.008 0.08 0.20 6 D 0.111 0.118 2.80 3.00 3 E 0.103 0.118 2.60 3.00 - E1 0.060 0.067 1.50 1.70 3 e 0.0256 Ref 0.65 Ref - e1 0.0768 Ref 1.95 Ref - L 0.10 (0.004) C MIN 0.014 0.022 0.35 0.55 L1 0.024 Ref. 0.60 Ref. L2 0.010 Ref. 0.25 Ref. N 8 8 5 WITH b R 0.004 - 0.10 - PLATING b1 R1 0.004 0.010 0.10 0.25  0o 8o 0o 8o c c1 4 Rev. 2 9/03 NOTES: BASE METAL 1. Dimensioning and tolerance per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 and JEDEC MO178BA. 4X 1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1 4X 1  6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only L2 For the most recent package outline drawing, see P8.064. VIEW C © Copyright Intersil Americas LLC 2009-2016. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6800 Rev 10.00 December 8, 2016 Page 23 of 23
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