DATASHEET
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Large 3V Output Swing, 16.5kV ESD, Full Fail-Safe, 1/8 Unit Load,
RS-485/RS-422 Transceivers
The ISL315xE (ISL3150E, ISL3152E, ISL3153E,
ISL3155E, ISL3156E, and ISL3158E) family of 5V
powered RS-485/RS-422 transceivers features high
output drive and high ESD protection. The devices
withstand ±16.5kV IEC61000-4-2 ESD strikes without
latch-up. The large output voltage of 3.1V typical into a
54Ω load provides high noise immunity, and enables the
drive of up to 8000ft long bus segments, or eight 120Ω
terminations in a star topology.
These devices possess less than 125µA bus input
currents, thus constituting a true 1/8 unit load. The high
output drive combined with the low bus input currents
allows for connecting up to 512 transceivers on the same
bus.
The receiver inputs feature a full fail-safe design that
turns the receiver outputs high when the bus inputs are
open or shorted.
The ISL315xE family includes half and full-duplex
transceivers with active-high driver-enable pins and
active-low receiver enable pins. These transceivers
support data rates of 115kbps, 1Mbps, and 20Mbps.
Their performance is characterized from -40°C to +85°C.
FN6363
Rev.5.1
May 11, 2021
Features
• High VOD: 3.1V (Typ) into RD = 54Ω
• Low bus currents: 125µA constitutes a true 1/8 unit
load
• Allows for up to 512 transceivers on the bus
• ±16.5kV ESD protection on bus I/O pins
• High transient overvoltage tolerance of ±100V
• Full fail-safe outputs for open or shorted inputs
• Hot plug capability - driver and receiver outputs
remain high-impedance during power-up and
power-down
• Supported data rates: 115kbps, 1Mbps, 20Mbps
• Low supply current (driver disabled): 550µA
• Ultra-low shutdown current: 70nA
Applications
• Automated utility e-meter reading systems
• High node count systems
• PROFIBUS and Fieldbus systems in factory
automation
• Security camera networks
• Lighting, elevator, and HVAC control systems in
building automation
• Industrial process control networks
• Networks with star topology
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
3
6 x 120Ω
Terms
8 x 120Ω
Terms
ISL3158E
2
Driver Output Volta ge (V)
Driver Output Curre nt (mA)
• Long-haul networks in coal mines and oil rigs
2 x 120Ω
Terms
1 x 120Ω
Term
1
0
-1
Standard
Transceiver
-2
20Mbps, 150' UTP, Double 120Ω Termination
0
1
2
3
4
1.5
Diff ere ntial O utput Voltage (V)
5
-3
20ns/Div
Figure 1. Typical Driver Output Performance of ISL315xE Transceivers
FN6363 Rev.5.1
May 11, 2021
Page 1 of 32
© 2006 Renesas Electronics
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Contents
1.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
2.
Typical Operating Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
2.2
3.
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1
3.2
3.3
3.4
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6
6
7
4.
Test Circuits and Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.
Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.
Device Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1
6.2
6.3
6.4
7.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
17
17
18
Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.1
7.2
7.3
Network Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Transient Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9.
Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FN6363 Rev.5.1
May 11, 2021
Page 2 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
1.
1. Overview
Overview
1.1
Typical Operating Circuit
5V
5V
100n
100n
8
8
VCC
10k
RO
R
A/Y
RO
RE
RL78
MCU
RL78
MCU
RT
B/Z
10k
10k
R
A
B
RB
(optional)
RT
RE
DE
DI
VCC
10k
RB
(optional)
DE
Y
DI
D
GND
RB
(optional)
10k
10k
D
RB
(optional)
Z
GND
5
5
Figure 2. Typical Operating Circuits of Half-Duplex and Full-Duplex Transceivers
1.2
Ordering Information
Part Number (Notes 2, 3)
ISL3150EIBZ
Part Marking
3150EIBZ
Package Description
(RoHS Compliant)
Pkg. Dwg. #
Carrier Type
(Note 1)
Temp. Range
14 Ld SOIC
M14.15
Tube
-40 to +85°C
ISL3150EIBZ-T
Reel, 2.5k
ISL3150EIBZ-T7A
ISL3150EIUZ
Reel, 250
3150Z
10 Ld MSOP
M10.118
Tube
ISL3150EIUZ-T
Reel, 2.5k
ISL3150EIUZ-T7A
Reel, 250
ISL3152EIBZ
3152EIBZ
8 Ld SOIC
M8.15
Tube
ISL3152EIBZ-T
Reel, 2.5k
ISL3152EIBZ-T7
Reel, 1k
ISL3152EIBZ-T7A
ISL3152EIUZ
Reel, 250
3152Z
8 Ld MSOP
M8.118
Tube
ISL3152EIUZ-T
Reel, 2.5k
ISL3152EIUZ-T7A
Reel, 250
ISL3153EIBZ-T
3153EIBZ
14 Ld SOIC
M14.15
ISL3153EIUZ
3153Z
10 Ld MSOP
M10.118
Reel, 2.5k
Tube
ISL3153EIUZ-T
Reel, 2.5k
ISL3153EIUZ-T7A
Reel, 250
ISL3155EIBZ
3155EIBZ
8 Ld SOIC
M8.15
Tube
ISL3155EIBZ-T
Reel, 2.5k
ISL3155EIBZ-T7A
Reel, 250
ISL3155EIUZ
ISL3155EIUZ-T
FN6363 Rev.5.1
May 11, 2021
3155Z
8 Ld MSOP
M8.118
Tube
Reel, 2.5k
Page 3 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Part Number (Notes 2, 3)
ISL3156EIBZ
Part Marking
1. Overview
Package Description
(RoHS Compliant)
Pkg. Dwg. #
Carrier Type
(Note 1)
Temp. Range
14 Ld SOIC
M14.15
Tube
-40 to +85
3156EIBZ
ISL3156EIBZ-T
Reel, 2.5k
ISL3156EIBZ-T7A
Reel, 250
ISL3156EIUZ
3156Z
10 Ld MSOP
M10.118
Tube
ISL3156EIUZ-T
Reel, 2.5k
ISL3156EIUZ-T7A
Reel, 250
ISL3158EIBZ
3158EIBZ
8 Ld SOIC
M8.15
Tube
ISL3158EIBZ-T
Reel, 2.5k
ISL3158EIBZ-T7A
Reel, 250
ISL3158EIUZ
3158Z
8 Ld MSOP
M8.118
Tube
ISL3158EIUZ-T
Reel, 2.5k
ISL3158EIUZ-T7A
Reel, 250
Notes:
1. Refer to TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the product information pages for the ISL3150E, ISL3152E, ISL3153E, ISL3155E,
ISL3156E, and ISL3158E. For more information about MSL, see TB363.
Table 1. Key Differences of Device Features
Part Number
Duplex
Data Rate (Mbps)
Bus ESD (kV)
Pin Count
ISL3150E
Full
0.115
1100
12/4
±10
10, 14
ISL3152E
Half
0.115
1100
12/4
±16
8
ISL3153E
Full
1
150
3/4
±10
10, 14
ISL3155E
Half
1
150
3/4
±16
8
ISL3156E
Full
20
8
0.2/2.5
±10
10, 14
ISL3158E
Half
20
8
0.2/2.5
±16
8
FN6363 Rev.5.1
May 11, 2021
Rise/Fall Time (ns) Tx/Rx Skew (ns)
Page 4 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2.
2. Pin Information
Pin Information
2.1
Pin Assignments
ISL3152E, ISL3155E, ISL3158E
(8 Ld MSOP, 8 Ld SOIC)
Top View
RO 1
8 VCC
RO 1
RE 2
7 B/Z
RE 2
DE 3
6 A/Y
DE 3
5 GND
DI 4
DI
R
D
4
R
D
GND 5
2.2
ISL3150E, ISL3153E, ISL3156E
(14 Ld SOIC)
Top View
ISL3150E, ISL3153E, ISL3156E
(10 Ld MSOP)
Top View
10 VCC
NC 1
9 A
RO 2
8 B
RE 3
7 Z
DE 4
6 Y
DI 5
14 VCC
R
13 NC
12 A
11 B
D
10 Z
GND 6
9 Y
GND 7
8 NC
Pin Descriptions
8 Ld
SOIC
10 Ld
MSOP
14 Ld
SOIC
Pin
Name
1
1
2
RO
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low. RO is Fail-safe
High if A and B are unconnected (open) or shorted.
2
2
3
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is
high.
3
3
4
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They
are high impedance when DE is low.
4
4
5
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces
output Y high and output Z low.
5
5
6, 7
GND
6
–
–
A/Y
Non-inverting receiver input and non-inverting driver output. Pin is an input if DE = 0; pin is
an output if DE = 1.
7
–
–
B/Z
Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output
if DE = 1.
–
6
9
Y
Non-inverting driver output.
–
7
10
Z
Inverting driver output.
–
8
11
B
Inverting receiver input.
–
9
12
A
Non-inverting receiver input.
8
10
–
VCC
System power supply input (4.5V to 5.5V).
–
–
1, 8, 13
NC
No connection.
FN6363 Rev.5.1
May 11, 2021
Function
Ground connection.
Page 5 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3.
3. Specifications
Specifications
3.1
Absolute Maximum Ratings
Parameter (Note 4)
Minimum
Maximum
Unit
7
V
VCC + 0.3
V
VCC to Ground
-0.3
Input Voltages at DI, DE, RE
Bus I/O Voltages at A/Y, B/Z, A, B, Y, Z
-9
13
V
±100
V
VCC + 0.3
V
Transient Pulse Voltages through 100Ω at A/Y, B/Z, A, B, Y, Z (Note 5)
RO
-0.3
Short Circuit Duration at Y, Z
Continuous
ESD Rating
See “Electrical Specifications” on page 8.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can
adversely impact product reliability and result in failures not covered by warranty.
Notes:
4. Absolute Maximum ratings mean the device will not be damaged if operated under these conditions. It does not guarantee
performance.
5. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).
3.2
Thermal Information
Thermal Resistance (Typical, Note 6)
θJA (°C/W)
8 Ld SOIC
105
8 Ld MSOP
140
10 Ld MSOP
130
14 Ld SOIC
130
Note:
6. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
Parameter
Minimum
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
-65
Pb-Free Reflow Profile
3.3
Maximum
Unit
+150
°C
+150
°C
See TB493
Recommended Operating Conditions
Minimum
Maximum
Unit
Supply Voltage
Parameter
4.5
5.5
V
Temperature Range
-40
+85
°C
Bus Pin Common-Mode Voltage Range
-7
+12
V
FN6363 Rev.5.1
May 11, 2021
Page 6 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3.4
3. Specifications
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 7). Boldface limits
apply across the operating temperature range, -40°C to +85°C.
Temp
(°C)
Min
(Note 15)
Typ
Max (Note 15)
Unit
Full
-
-
VCC
V
RL = 100Ω (RS-422) (Figure 3)
Full
2.8
3.6
-
V
RL = 54Ω (RS-485) (Figure 3)
Full
2.4
3.1
VCC
V
RL = 15Ω (Eight 120Ω terminations)
(Note 16)
+25
-
1.65
-
V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4)
Full
2.4
3
-
V
ΔVOD
RL = 54Ω or 100Ω (Figure 3)
Full
-
0.01
0.2
V
Driver Common-Mode Output
Voltage
VOC
RL = 54Ω or 100Ω (Figure 3)
Full
-
-
3.15
V
Change in Magnitude of
Driver Common-Mode Output
Voltage
ΔVOC
RL = 54Ω or 100Ω (Figure 3)
Full
-
0.01
0.2
V
Parameter
Symbol
Test Conditions
DC Characteristics
Driver Differential Output
Voltage (No load)
VOD1
Driver Differential Output
Voltage (Loaded)
VOD2
Change in Magnitude of
Driver Differential Output
Voltage
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
+25
-
100
-
mV
Full
-2
-
2
µA
DI Input Hysteresis Voltage
VHYS
Logic Input Current
IIN1
DE, DI, RE
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V
or 5.5V
VIN = 12V
Full
-
70
125
µA
VIN = -7V
Full
-75
55
-
µA
RE = 0V, DE = 0V,
VCC = 0V or 5.5V
VIN = 12V
Full
-
1
40
µA
VIN = -7V
Full
-40
-9
-
µA
RE = VCC, DE = 0V, VIN = 12V
VCC = 0V or 5.5V
VIN = -7V
Full
-
1
20
µA
Full
-20
-9
-
µA
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 9)
Full
-
-
±250
mA
-7V ≤ VCM ≤ 12V
Full
-200
-90
-50
mV
Output Leakage Current
(Y, Z) (Full Duplex Versions
Only)
IIN3
Output Leakage Current
(Y, Z) in Shutdown Mode (Full
Duplex)
IIN4
Driver Short-Circuit Current,
VO = High or Low
IOSD1
Receiver Differential
Threshold Voltage
VTH
Receiver Input Hysteresis
ΔVTH
VCM = 0V
+25
-
20
-
mV
Receiver Output High Voltage
VOH
IO = -8mA, VID = -50mV
Full
VCC - 1.2
4.3
-
V
Receiver Output Low Voltage
VOL
IO = -8mA, VID = -200mV
Full
-
0.25
0.4
V
Receiver Output Low Current
IOL
VO = 1V, VID = -200mV
Full
20
28
-
mA
Three-State (High
Impedance) Receiver Output
Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-1
0.03
1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
96
160
-
kΩ
Receiver Short-Circuit
Current
IOSR
0V ≤ VO ≤ VCC
Full
±7
65
±85
mA
FN6363 Rev.5.1
May 11, 2021
Page 7 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 7). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Parameter
Temp
(°C)
Min
(Note 15)
Typ
Max (Note 15)
Unit
Half duplex versions, DE = VCC, RE = X,
DI = 0V or VCC
Full
-
650
800
µA
All versions, DE = 0V, RE = 0V, or full
duplex versions, DE = VCC, RE = X.
DI = 0V or VCC
Full
-
550
700
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.07
3
µA
Half duplex
+25
-
±16.5
-
kV
Full duplex
+25
-
±10
-
kV
IEC61000-4-2, Contact Discharge
Method
+25
-
±9
-
kV
Human Body Model, from bus pins to
GND
+25
-
±16.5
-
kV
Human Body Model, per MIL-STD-883
Method 3015
+25
-
±7
-
kV
Machine Model
+25
-
400
-
V
Full
500
970
1300
ns
Symbol
Test Conditions
ICC
Supply Current
No-Load Supply Current
(Note 8)
Shutdown Supply Current
ISHDN
ESD Performance
RS-485 Pins (A, Y, B, Z, A/Y,
B/Z)
IEC61000-4-2,
Air-Gap Discharge
Method
All Pins
Driver Switching Characteristics (115kbps Versions; ISL3150E, ISL3152E)
Driver Differential Output
Delay
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
-
12
50
ns
Driver Differential Rise or
Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
700
1100
1600
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 7, Note 17)
Full
115.2
2000
-
kbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 10)
Full
-
300
600
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 10)
Full
-
130
500
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF,
SW = GND (Figure 6)
Full
-
35
60
ns
(Note 12)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown
to Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Notes 12, 13)
Full
-
-
250
ns
Driver Enable from Shutdown
to Output Low
tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Notes 12, 13)
Full
-
-
250
ns
Full
150
270
400
ns
Full
-
3
10
ns
Driver Switching Characteristics (1Mbps Versions; ISL3153E, ISL3155E)
Driver Differential Output
Delay
Driver Differential Output
Skew
FN6363 Rev.5.1
May 11, 2021
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
Page 8 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 7). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Parameter
Symbol
Test Conditions
Temp
(°C)
Min
(Note 15)
Typ
Max (Note 15)
Unit
Driver Differential Rise or
Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
150
325
450
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 7, Note 17)
Full
1
8
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 10)
Full
-
110
200
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 10)
Full
-
60
200
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 6)
Full
-
35
60
ns
(Note 12)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown
to Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Notes 12, 13)
Full
-
-
250
ns
Driver Enable from Shutdown
to Output Low
tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Notes 12, 13)
Full
-
-
250
ns
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
-
21
30
ns
Driver Switching Characteristics (20Mbps Versions; ISL3156E, ISL3158E)
Driver Differential Output
Delay
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
-
0.2
3
ns
Driver Differential Rise or Fall
Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
-
12
16
ns
Maximum Data Rate
fMAX
CD = 470pF (Figure 7, Note 17)
Full
20
55
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 10)
Full
-
30
45
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 10)
Full
-
28
45
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 6)
Full
-
38
60
ns
(Note 12)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from Shutdown
to Output High
tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Notes 12, 13)
Full
-
-
200
ns
Driver Enable from Shutdown
to Output Low
tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Notes 12, 13)
Full
-
-
200
ns
Receiver Switching Characteristics (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)
Maximum Data Rate
fMAX
(Figure 8, Note 17)
Full
1
12
-
Mbps
Receiver Input to Output
Delay
tPLH,
tPHL
(Figure 8)
Full
-
100
150
ns
Receiver Skew | tPLH - tPHL |
tSKD
(Figure 8)
Full
-
4
10
ns
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Note 11)
Full
-
9
20
ns
Receiver Enable to Output
Low
FN6363 Rev.5.1
May 11, 2021
tZL
Page 9 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 7). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Parameter
Symbol
Test Conditions
Temp
(°C)
Min
(Note 15)
Typ
Max (Note 15)
Unit
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Note 11)
Full
-
7
20
ns
Receiver Disable from Output
Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9)
Full
-
8
15
ns
Receiver Disable from Output
High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9)
Full
-
8
15
ns
(Note 12)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from
Shutdown to Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Notes 12, 14)
Full
-
-
200
ns
Receiver Enable from
Shutdown to Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Notes 12, 14)
Full
-
-
200
ns
Receiver Switching Characteristics (20Mbps Versions; ISL3156E, ISL3158E)
Maximum Data Rate
fMAX
(Figure 8, Note 17)
Full
20
30
-
Mbps
Receiver Input to Output
Delay
tPLH,
tPHL
(Figure 8)
Full
-
33
45
ns
Receiver Skew | tPLH - tPHL |
tSKD
(Figure 8)
Full
-
2.5
5
ns
Receiver Enable to Output
Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Note 11)
Full
-
8
15
ns
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Note 11)
Full
-
7
15
ns
Receiver Disable from Output
Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9)
Full
-
8
15
ns
Receiver Disable from Output
High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9)
Full
-
8
15
ns
(Note 12)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from
Shutdown to Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9), (Notes 12, 14)
Full
-
-
200
ns
Receiver Enable from
Shutdown to Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9), (Notes 12, 14)
Full
-
-
200
ns
Notes:
7. All currents in to device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground
unless otherwise specified.
8. Supply current specification is valid for loaded drivers when DE = 0V.
9. Applies to peak current. See “Performance Curves” beginning on page 14 for more information.
10. Keep RE = 0 to prevent the device from entering SHDN.
11. The RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN.
14. Set the RE signal high time >600ns to ensure that the device enters SHDN.
15. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
16. See Figure 11 on page 14 for more information and for performance over temperature.
17. Limits established by characterization and are not production tested.
FN6363 Rev.5.1
May 11, 2021
Page 10 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4.
4. Test Circuits and Waveforms
Test Circuits and Waveforms
VCC
0V or 3V
DI
RL/2
Y
DE
VOD
D
Z
RL/2 V
OC
Y
VOH
Z
VOL
VOC
VOC
Figure 3. Measurement of Driver Differential Output Voltage with Differential Load
VCC
DE
DI
0V or 3V
375
Y
VOD
D
RL = 60
Z
VCM
-7V to +12V
375
Figure 4. Measurement of Driver Differential Output Voltage with Common-Mode Load
3V
DI
DE
DI
50%
CL = 100pF
VCC
tPLH
VOD
Z
1.5V
0V
Y
D
50%
tPHL
Z
VOH
Y
VOL
RDIFF
CL = 100pF
Skew = |tPLH - tPHL|
VOD
(Y - Z)
90%
+VOD
90%
10%
10%
tR
tF
-VOD
Figure 5. Measurement of Driver Propagation Delay and Differential Transition Times
FN6363 Rev.5.1
May 11, 2021
Page 11 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4. Test Circuits and Waveforms
VCC
Y
DI
500
D
SW
DE
3V
DE
CL
Z
1.5V
1.5V
0V
tZH(SHDN)
tHZ
tZH
VOH
Parameter
Output
RE
DI
SW
CL
(pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
tZH
Y/Z
0 (Note 10)
1/0
GND
100
tZL
Y/Z
0 (Note 10)
0/1
VCC
100
tZH(SHDN)
Y/Z
1 (Note 13)
1/0
GND
100
tZL(SHDN)
Y/Z
1 (Note 13)
0/1
VCC
100
VOH - 0.5V
Y, Z
2.3V
0V
tZL(SHDN)
tZL
tLZ
VCC
Y, Z
2.3V
VOL
VOL + 0.5V
Figure 6. Measurement of Driver Enable and Disable Times
VCC
3V
Y
DE
DI
DI
0V
VOD
D
60
CD
Z
Y, Z
+VOD
-VOD
0V
Figure 7. Measurement of Driver Data Rate
+1.5V
A
B
A
0V
0V
RO
R
-1.5V
tPHL
tPLH
15pF
RE
VCC
RO
1.5V
1.5V
0V
Figure 8. Measurement of Receiver Propagation Delay and Data Rate
FN6363 Rev.5.1
May 11, 2021
Page 12 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4. Test Circuits and Waveforms
VCC
A
B
1k
RO
R
SW
15pF
3V
RE
1.5V
1.5V
RE
0V
tZH(SHDN)
tZH
tHZ
VOH
VOH - 0.5V
RO
Parameter
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 11)
0
+1.5V
GND
tZL (Note 11)
0
-1.5V
VCC
tZH(SHDN) (Note 14)
0
+1.5V
GND
tZL(SHDN) (Note 14)
0
-1.5V
VCC
1.5V
0V
tZL(SHDN)
tZL
tLZ
VCC
RO
1.5V
VOL
VOL + 0.5V
Figure 9. Measurement of Receiver Enable and Disable Times
FN6363 Rev.5.1
May 11, 2021
Page 13 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
5.
5. Performance Curves
Performance Curves
4.5
VOH
4.0
3.5
3.0
2.5
2.0
VOL
1.5
1.0
0.5
0
0
20
40
60
80
100
120
Driver Output Current – IO (mA)
140
Driver Output Voltage – VA, VB (V)
Figure 10. Driver Output High and Low Voltages vs
Output Current
5.0
Figure
4 Test
Circuit
Fig. 4 Test
Circuit
4.5
VA
4.0
3.5
VOD
3.0
VOC
2.5
2.0
1.5
VB
1.0
0.5
0
-8
-6
-4 -2
0
2
4
6
8
10
Common-Mode Voltage – VCM (V)
12
Differential Output Voltage – VOD (V)
5.0
D, DE = VCC
RD==54Ω
54Ω
R
D
3.0
2.5
2.0
1.5
1.0
0.5
0
0
1
2
3
4
Supply Voltage – VCC (V)
5
Figure 14. Driver Output Voltage vs Supply Voltage
FN6363 Rev.5.1
May 11, 2021
54Ω
4.5
4.0
3.5
3.0
TA = 25oC
2.5
o
2.0
TA = +85 C
15Ω
1.5
1.0
0.5
0
0
20
40
60
80
100
120
Driver Output Current – IO (mA)
140
3.7
3.6
RDIFF = 100Ω
3.5
3.4
3.3
3.2
3.1
RDIFF = 54Ω
3.0
2.9
-40
-20
0
20
40
60
Temperature (oC)
80
100
Figure 13. Driver Differential Output Voltage vs
Temperature
Driver Output Current – IO (mA)
Differential Output Voltage – VOD (V)
Figure 12. Driver Output Voltages vs Common-Mode
Voltage
3.5
5.0
Figure 11. Driver Differential Output Voltage vs Output
Current
Differential Output Voltage – VOD (V)
Differential Output Voltage – VOD (V)
VCC = 5V, TA = +25°C; Unless otherwise specified
70
VOL,+25oC
60
50
VOL,+85oC
40
30
VOH,+25oC
20
VOH,+85oC
10
0
0
1
2
3
4
Supply Voltage – VCC (V)
5
Figure 15. Receiver Output Voltage vs Output Current
Page 14 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
5. Performance Curves
70
Data I/O (V)
RL = 54Ω, CL = 100pF
60
50
DE, RE = VCC
40
30
10
0
10 20 30 40 50 60 70 80 90 100 110 120
Data Rate (kbps)
5V/Div
B/Z
1V/Div
A/Y
Time: 1μs/Div
Figure 17. Waveforms (ISL3150E, ISL3152E)
80
Data I/O (V)
RL = 54Ω, CL = 100pF
70
60
50
DE, RE = VCC
DI
RO
5V/Div
R D = 54Ω
40
C L = 100 pF
30
Bus I/O (V)
Driver Output Current – IO (mA)
Figure 16. Supply Current vs Data Rate
(ISL3150E, ISL3152E)
20
10
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Data Rate (Mbps)
Figure 18. Supply Current vs Data Rate
(ISL3153E, ISL3155E)
B/Z
1V/Div
A/Y
Time: 400ns/Div
Figure 19. Waveforms (ISL3153E, ISL3155E)
100
RL = 54Ω, CL = 100pF
Data I/O (V)
90
80
70
60
RO
5V/Div
RD = 54Ω
40
CL = 100pF
30
20
10
0
DI
DE, RE = VCC
50
Bus I/O (V)
Driver Output Current – IO (mA)
RO
CL = 100pF
20
0
DI
RD = 54Ω
Bus I/O (V)
Driver Output Current – IO (mA)
VCC = 5V, TA = +25°C; Unless otherwise specified (Continued)
0
2
4
6
8
10 12 14
Data Rate (Mbps)
16
18
Figure 20. Supply Current vs Data Rate
(ISL3156E, ISL3158E)
FN6363 Rev.5.1
May 11, 2021
20
B/Z
1V/Div
A/Y
Time: 20ns/Div
Figure 21. Waveforms (ISL3156E, ISL3158E)
Page 15 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
5. Performance Curves
1010
12
1005
11
1000
10
995
Skew (ns)
Propagation Delay (ns)
VCC = 5V, TA = +25°C; Unless otherwise specified (Continued)
990
985
tPLH
980
975
-20
0
20
40
60
Temperature (oC)
80
4
-40
100
290
3.25
288
3.00
286
282
tPLH
280
278
tPHL
276
20
40
60
Temperature (oC)
80
100
2.50
2.25
2.00
1.75
274
1.50
272
-20
0
20
40
60
Temperature (oC)
80
1.25
-40
100
Figure 24. Differential Rise/Fall Times vs Temperature
(ISL3153E, ISL3155E)
0.26
22.5
0.24
22.0
Skew (ns)
21.0
tPHL
20.5
0
20
40
60
Temperature (oC)
80
100
0.22
tPLH
21.5
-20
Figure 25. Differential Propagation Delay vs
Temperature (ISL3153E, ISL3155E)
23.0
20.0
19.5
0.20
0.18
0.16
0.14
19.0
0.12
18.5
18.0
-40
0
2.75
284
270
-40
-20
Figure 23. Differential Propagation Delay vs
Temperature (ISL3150E, ISL3152E)
Skew (ns)
Propagation Delay (ns)
Figure 22. Differential Rise/Fall Times vs Temperature
(ISL3150E, ISL3152E)
Propagation Delay (ns)
7
5
965
960
-40
8
6
tPHL
970
9
-20
0
20
40
60
Temperature (oC)
80
100
Figure 26. Differential Rise/Fall Times vs Temperature
(ISL3156E, ISL3158E)
FN6363 Rev.5.1
May 11, 2021
0.10
-40
-20
0
20
40
60
Temperature (oC)
80
100
Figure 27. Differential Propagation Delay vs
Temperature (ISL3156E, ISL3158E)
Page 16 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
6.
6. Device Description
Device Description
6.1
Overview
The ISL3150E, ISL3153E, and ISL3156E are full-duplex RS-485 transceivers, and the ISL3152E, ISL3155E, and
ISL3158E are half-duplex RS-485 transceivers. All transceivers feature a large output signal swing that is 60%
higher than standard compliant transceivers. The devices are available in three speed grades suitable for data
transmission up to 115kbps, 1Mbps, and 20Mbps.
Each transceiver has an active-high driver enable and an active-low receiver enable function. A shutdown current
as low as 70nA can be accomplished by disabling both the driver and receiver for more than 600ns.
6.2
Functional Block Diagram
VCC
VCC
R
RO
RE
DE
D
DI
A
RO
B
Y
RE
B/Z
DE
A/Y
DI
D
Z
GND
GND
Figure 28. Block Diagram
ISL3150E, ISL3153E, ISL3156E
6.3
R
Figure 29. Block Diagram
ISL3152E, ISL3155E, ISL3158E
Operating Modes
6.3.1
Driver Operation
A logic high at the driver enable pin, DE, activates the driver and causes the differential driver outputs, Y and Z,
to follow the logic states at the data input, DI.
A logic high at DI causes Y to turn high and Z to turn low. In this case, the differential output voltage, defined
as VOD = VY – VZ, is positive. A logic low at DI reverses the output states reverse, turning Y low and Z high,
thus making VOD negative.
A logic low at DE disables the driver, making Y and Z high-impedance. In this condition the logic state at DI is
irrelevant. To ensure the driver remains disabled after device power-up, it is recommended to connect DE
through a 1kΩ to 10kΩ pull-down resistor to ground.
Table 2. Driver Truth Table
Inputs
Outputs
RE
DE
DI
Y
Z
X
H
H
H
L
Actively drives bus high
X
H
L
L
H
Actively drives bus low
L
L
X
Z
Z
Driver disabled, outputs high-impedance
H
L
X
Z*
Z*
Shutdown mode: driver and receiver disabled for
more than 600ns
Function
Note:* See Shutdown mode explanation in “Low Current Shutdown Mode” on page 20.
FN6363 Rev.5.1
May 11, 2021
Page 17 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
6.3.2
6. Device Description
Receiver Operation
A logic low at the receiver enable pin, RE, activates the receiver and causes its output, RO, to follow the bus
voltage at the differential receiver inputs, A and B. Here, the bus voltage is defined as VAB = VA - VB.
For VAB ≥ -0.05V, RO turns high, and for VAB ≤ -0.2V, RO turns low. For input voltages between -50mV and
-200mV, the state of RO is undetermined, and thus could be high or low.
A logic high at RE disables the receiver, making RO high-impedance. In this condition the polarity and
magnitude of the input voltage is irrelevant. To ensure the receiver output remains high when the receiver is
disabled, it is recommended to connect RO, using a 1kΩ to 10kΩ pull-up resistor to VCC.
To enable the receiver to immediately monitor the bus traffic after device power-up, connect RE through a 1kΩ
to 10kΩ pull-down resistor to ground.
Table 3. Receiver Truth Table
Inputs
Outputs
RE
DE
A–B
RO
L
X
VAB ≥ -0.05V
H
RO is data-driven high
L
X
-0.05V > VAB > -0.2V
Undetermined
Actively drives bus low
L
X
VAB ≤ -0.2V
L
RO is data-driven low
L
X
Inputs Open/Shorted
H
RO is failsafe-high
H
H
X
Z
Receiver disabled, RO is high-impedance
H
L
X
Z*
Shutdown mode: driver and receiver disabled for more than
600ns
Function
Note:* See Shutdown mode explanation in “Low Current Shutdown Mode” on page 20.
6.4
Device Features
6.4.1
Large Output Signal Swing
Driver Output Curre nt – IO (mA)
The ISL315xE family has a 60% larger differential output voltage swing than standard RS-485 transceivers. It
delivers a minimum VOD of 2.4V across a 54Ω differential load, or 1.65V across a 15Ω differential load.
Figure 30 shows that the VOD at 54Ω is more than 50% higher than that of a standard transceiver.
188Ω
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
TA = +25 oC
15Ω
Y
DI
375Ω
D
ISL315xE
3V
60Ω
375Ω
Z
54Ω
VCM -7V to +12V
Std.
XCVR
188Ω
0.84
0
1.65
3.1
1
2
3
4
Diff ere ntial O utput Voltage – VOD (V)
5
Figure 30. V-I Characteristic of ISL315xE vs Standard
RS-485 Transceiver
FN6363 Rev.5.1
May 11, 2021
Device
RCM
(Ω)
1UL
(Ω)
# UL
1/8UL
(Ω)
# Devices
on Bus
Std. RS-485
375
12k
32
96k
256
ISL315xE
188
12k
64
96k
512
Figure 31. Unit Load and Transceiver Drive of ISL315xE
vs Standard RS-485 Transceiver
Page 18 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
6. Device Description
Figure 31 compares the maximum number of unit loads and bus transceivers when choosing an ISL315xE over
a standard transceiver. The RS-485 standard specifies a minimum total common-mode load resistance of
RCM = 375Ω between each signal conductor and ground. Because one unit load (1UL) is equivalent to 12kΩ,
the total common-mode resistance of 375Ω yields 12kΩ/375Ω = 32 ULs.
For an ISL315xE transceiver however, RCM can be as small as 188Ω, resulting in a total common-mode load of
12kΩ/188Ω = 64 ULs. This means the driver of an ISL315xE transceiver can drive up to 64 x 1UL transceivers
or 512 x 1/8UL transceivers.
The advantages of such superior drive capability are:
• Up to 900mV higher noise immunity (2.4V vs 1.5V VOD)
• Up to twice the maximum cable length of standard transceivers (~8000ft vs 4000ft)
• The design of star configurations or other multi-terminated nonstandard network topologies
6.4.2
Driver Overload Protection
The RS-485 specification requires drivers to survive worst case bus contentions undamaged. The ISL315xE
transceivers meet this requirement through driver output short circuit current limits and on-chip thermal
shutdown circuitry.
The driver output stages incorporate short-circuit current limiters that ensure that the output current never
exceeds the RS-485 specification, even at the common-mode voltage range extremes.
In the event of a major short-circuit conditions, the devices also include a thermal shutdown feature that
disables the drivers whenever the temperature becomes excessive. This eliminates the power dissipation,
allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15°C. If the
contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. The receivers stay
operational during thermal shutdown.
6.4.3
Full-Failsafe Receiver
The differential receivers of the ISL315xE family are full-failsafe, meaning their outputs turn logic high when:
• The receiver inputs are open (floating) due to a faulty bus node connector
• The receiver inputs are shorted due to an insulation break of the bus cable
• The receiver input voltage is close to 0V due to a terminated bus not being actively driven
Full-failsafe switching is accomplished by offsetting the maximum receiver input threshold to -50mV.
Figure 32 shows that, in addition to the threshold offset, the receiver also has an input hysteresis, ΔVTH, of
20mV. The combination of offset and hysteresis allows the receiver to maintain its output high, even in the
presence of 140mVP-P differential noise, without the need for external failsafe biasing resistors.
+VAB
RO = High
0V
Vn-(P-P) = 140mV
-50mV
Undetermined
VNTH = 20mV
-200mV
RO = Low
-VAB
Figure 32. Full-Failsafe Performance with High Noise Immunity
FN6363 Rev.5.1
May 11, 2021
Page 19 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
6.4.4
6. Device Description
Low Current Shutdown Mode
The ISL315xE transceivers use a fraction of the power required by their bipolar counterparts, but also include a
shutdown feature that reduces the already low quiescent ICC to a 70nA trickle. These devices enter shutdown
whenever the receiver and the driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at
least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not
enter shutdown.
Note that driver and receiver enable times increase when the transceiver enables from shutdown. Refer to
Notes 9 to 13 at the end of “Electrical Specifications” on page 10.
6.4.5
Hot Plug Function
When the equipment powers up, there is a period of time where the controller driving the RS-485 enable lines is
unable to ensure that the driver and receiver outputs are kept disabled. If the equipment is connected to the bus,
a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL315xE
devices incorporate a Hot Plug function. During power-up and power-down, the Hot Plug function disables the
driver and receiver outputs regardless of the states of DE and RE. When VCC reaches ~3.4V, the enable pins are
released. This gives the controller the chance to stabilize and drive the RS-485 enable lines to the proper states.
6.4.6
High ESD Protection
The bus pins of the ISL315xE transceivers have on-chip ESD protection against ±16.5kV HBM, and ±9kV
contact and ±16.5kV air-discharge according to IEC61000-4-2. The difference between the HBM and IEC ESD
ratings lies in the test severity, as both standards aim for different application environments.
HBM ESD ratings are component level ratings, used in semiconductor manufacturing in which component
handling can cause ESD damage to a single device. Because component handling is performed in a controlled
ESD environment, the ESD stress upon a component is drastically reduced. These factors make the HBM test
the less severe ESD test.
IEC ESD ratings are system level ratings. These are required in the uncontrolled field environment, where for
example, a charged end user can subject handheld equipment to ESD levels of more than 40kV by touching
connector pins when plugging or unplugging cables.
The main differences between the HBM and the IEC 61000-4-2 standards are the number of strikes applied
during testing and the generator models (Figure 33), which create differences in the waveforms’ rise times and
peak currents (Figure 34).
1.5k
50M
330Ω
HV-DC
Generator
100pF
150pF
30
VTest = 8kV
25
DUT
IPK (A)
1M
IEC61000-4-2
20
15
10
HBM
5
Human-Body-Model
IEC61000-4-2 Model
Figure 33. Generator Models for HBM and IEC ESD Tests
0
0
50 100 150 200 250 300 350 400 450 500
Time (ns)
Figure 34. Difference in Rise-time and Charge Currents
between HBM and IEC ESD Transients
The IEC model has 50% higher charge capacitance (CS) and 78% lower discharge resistance (RD) than the
HBM model, thus producing shorter transient rise times and higher discharge currents. The ESD ratings of the
ISL315xE transceivers exceed test level 4 of the IEC61000-4-2 standard, which significantly increases
equipment robustness.
FN6363 Rev.5.1
May 11, 2021
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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7.
7. Application Information
Application Information
7.1
Network Design
Designing a reliable RS-485 network requires the consideration of a variety of factors that ultimately determine the
network performance. These include network topology, cable type, data rate and/or cable length, stub length,
distance between network nodes, and line termination.
The main difference between network designs is dictated by their modes of data exchange between bus nodes,
which can be half-duplex or full-duplex (Figures 35 and 36).
A
RO
R
RE
DE
DI
D
A/Y
A/Y
RT
RT
B/Z
B/Z
A/Y
B/Z
R
D
RO
RO
RE
RE
DE
DE
DI
DI
RT
R
D
RT
D
Z
Master
Slave
Y
D
A
Transmit
RT
Z
R
DI
DE
RE
RO
B
A
R
Y
Receive
B
B
R
Y
Z
Slave
D
RO RE DE DI
RO RE DE DI
Figure 35. Half-Duplex Bus
Figure 36. Full-Duplex Bus
Half-duplex networks use only a single signal-pair of cables between one master node and multiple slave nodes,
which allows the nodes to either transmit or receive data, but never both at the same time. Its reduced cabling effort
makes these networks well suited for covering long distances of up to several thousands of feet. To maintain high
signal integrity, the applied data rates range from as low as 9.6kbps up to 115kbps. This requires transceivers with
long driver output transition times, typically in the range of microseconds, to ensure low EMI in the presence of
large cable inductances.
To prevent signal reflections of the bus lines, each cable end must be terminated with a resistor, RT, whose value
should match the characteristic cable impedance, Z0.
Full-duplex networks, on the other hand, aim for high data throughput. These networks use two signal-pairs to
support the simultaneous transmitting and receiving of data. The signal pair denoted as the transmit path connects
the driver output of the master node to the receiver inputs of multiple slave nodes. The other pair connects the
driver outputs of the slave nodes with the receiver input of the master node.
Because the data flow in the transmit path is unidirectional, the transmit path requires only one termination at the
remote cable end, opposite the master node. Data flow in the receive path, however, is bidirectional, thus requiring
line termination at both cable ends. Commonly, high data throughput also calls for higher data rates in the 1Mbps to
10Mbps range. As cable losses increase with frequency, most full-duplex networks are limited to shorter bus cable
lengths of a few hundred feet to maintain signal integrity.
The following sections discuss the aforementioned parameters that impact network performance. This discussion
applies to both half-and full-duplex network designs.
7.1.1
Cable Type
RS-485 networks use differential signaling over Unshielded Twisted Pair (UTP) cable. The conductors of a
twisted pair are equally exposed to external noise. They pick up noise and other electromagnetically induced
voltages as common-mode signals, which are effectively rejected by the differential receivers.
For best performance use industrial RS-485 cables, which are of the sheathed, shielded, twisted pair type,
(STP), with a characteristic impedance of 120Ω and conductor sizes of 22 to 24 AWG (equivalent to diameters
of 0.65mm and 0.51mm, respectively). They are available in single, two, and four signal-pair versions to
FN6363 Rev.5.1
May 11, 2021
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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7. Application Information
accommodate the design of half- and full-duplex systems. Figure 37 shows the cross section and cable
parameters of a typical UTP cable.
PVC Jacket
Aluminum Foil
Polyester Tape
Foam High Density
Polyethylene
Cable: Belden 3105A
22 AWG
Tinned Copper
Type: 1-pair, 22AWG PLCT/CM
Impedance: 120Ω
DC Resistance: 14.7mΩ/ft
Tinned Copper
Braid
Capacitance: 11pF/ft
Velocity: 78% (1.3ns/ft)
22 AWG
Tinned Copper
Drain Wire
Figure 37. Single Pair STP Cable for RS-485 Applications
7.1.2
Cable Length vs Data Rate
RS-485 and RS-422 are intended for network lengths up to 4000ft, but the maximum system data rate decreases
as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100ft, while
the 115kbps versions can operate at full data rates with lengths of several 1000ft. Note that ISL315xE
transceivers can cover almost twice the distance of standard compliant RS-485 transceivers.
10000
ISL315xE
Transceivers
1000
Standard RS-485
Transceivers
100
10
10k 100k
1M
10M
100M
Data Rate (bps)
Cable Length (m)
Cable Length (ft)
10000
ISL315xE
Transceivers
1000
100
10
Standard RS-485
Transceivers
10k 100k
1M
10M
100M
Data Rate (bps)
Figure 38. Data Rate vs Cable Length Guidelines in Feet and Meters
7.1.3
Topologies and Stub Lengths
RS-485 recommends its nodes to be networked in daisy-chain or backbone topology. In these topologies the
participating drivers, receivers, and transceivers connect to a main cable trunk through “short” stubs. A stub
being the actual electrical link between transceiver and cable trunk.
FN6363 Rev.5.1
May 11, 2021
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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7. Application Information
D
D
D
R
R
D
R
A
B
R
A
B
Stub
A1
B1 B2
A2
Stub
A1
B1 B2
A2
Figure 39. Stub Lengths in Daisy Chain (left) and Backbone (right) Topologies
Because daisy chaining brings the cable trunk much closer to the transceiver bus terminals than a backbone
design, the stub lengths between the two topologies can differ significantly. To prevent the bus from being
overloaded by line terminations, stubs are never terminated. A stub therefore, represents a piece of
unterminated transmission line. To eliminate signal reflections on the stub line, a rule of thumb is to keep its
propagation delay below 1/5 of the driver output rise time, which leads to the maximum stub length of:
tr
L Stub = v c --5
(EQ. 1)
where
• c is the speed of light (m/s)
• v is the signal velocity in the cable, expressed as a factor of c
• tr is the rise time of the driver output (ns)
Applying Equation 1 to the ISL315xE transceivers assuming a velocity of 78%, results in the maximum stub
lengths associated with the corresponding transceivers, as shown in Table 4.
Table 4. Stub Length as Function of Driver Rise Time
Device
Data Rate (Mbps)
Rise Time (ns)
Maximum Stub Length
ISL3150E, ISL3152E
0.115
1100
168ft (51m)
ISL3153E, ISL3155E
1
150
23ft (7m)
ISL3156E, ISL3158E
20
8
1.2ft (0.36m)
Table 4 proves that transceivers with long driver rise times are well suited for applications requiring long stub
lengths and low radiated emission in the presence of increased stub inductance.
7.1.4
Minimum Distance between Nodes
The electrical characteristics of the RS-485 bus are primarily defined by the distributed inductance and
capacitance along the bus cable and printed circuit board traces. Adding capacitance to the bus in the form of
transceivers and connectors lowers the line impedance and causes impedance mismatches at the loaded bus
section.
Input signals arriving at these mismatches are partially reflected back to the signal source, distorting the driver
output signal. Ensuring a valid receiver input voltage during the first signal transition from a driver output
anywhere on the bus, requires the bus impedance at the mismatches to be Z load 0.4Z nom or
0.4 x 120Ω = 48Ω. This can be achieved by maintaining a minimum distance between bus nodes of:
FN6363 Rev.5.1
May 11, 2021
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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7. Application Information
CL
D min -----------------------5.25 C C
(EQ. 2)
where
• CL is the lumped load capacitance
• CC is the distributed cable or PCB trace capacitance per unit length.
Figure 40 shows the relationship for the minimum node spacing as a function of CC and CL graphically. Load
capacitance includes contributions from the line circuit bus pins, connector contacts, printed circuit board
traces, protection devices, and any other physical connections to the trunk line as long as the distance from the
bus to the transceiver, known as the stub, is electrically short.
Putting some values to the individual capacitance contributions: 5V transceivers typically possess a capacitance
of 7pF, while 3V transceivers have about twice that capacitance at 16pF. Board traces add about 1.3 to 2pF/in
depending upon their construction.
Connector and suppression device capacitance can vary widely. Media distributed capacitance ranges from
11pF/ft for low capacitance, unshielded, twisted-pair cable up to 22pF/ft for backplanes.
20
CL (pF)
100
60
40
20
10
Distance (in)
16
12
8
4
0
40
50
60
70
Distributed Cable Capacitance – CC (pF)
80
Figure 40. Minimum Distance between Bus Nodes as Function of Cable and Load Capacitance
7.1.5
Failsafe Biasing Termination
As mentioned in “Full-Failsafe Receiver” on page 19, the ISL315xE transceivers are full-failsafe and capable of
tolerating up to 140mVP-P of differential noise on a passive bus without needing external failsafe biasing.
However, in harsh industrial environments, such as the factor floors in industrial automation, the differential
noise can reach levels of more than 1VP-P. In this case external failsafe biasing at the network’s line
terminations is strongly recommended. Here the termination resistors RT connect through the biasing resistors
RB to the supply rails VCC and GND.
Short data links (100m) require two identical failsafe basing networks, one at each cable end, to minimize
the differential voltage drop along the bus (Figure 41, right circuit). Their resistor values are calculated using
Equations 6 and 7:
(EQ. 6)
2V S V AB + 1
R B = -----------------------------------0.036
(EQ. 7)
R B 120
R T = -------------------------R B – 60
Note that Equations 3 to 7 apply to the multi-driver applications of half- and full-duplex networks. For single
driver applications, the values of RB and RT are calculated using Equations 8 and 9.
VS
VS
DE
DI
RB
Z0
D
VAB
RT
RB
RO
R
R
RO
Figure 42. Failsafe Biasing of a Single-Driver Network
(EQ. 8)
VS
R B = 60 ----------V AB
(EQ. 9)
R B 120
R T = -------------------------R B – 60
For more details on failsafe biasing refer to TB509.
FN6363 Rev.5.1
May 11, 2021
Page 25 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7.2
7. Application Information
Transient Protection
Although the ISL315xE transceivers have on-chip transient protection circuitry against Electrostatic Discharge
(ESD), they are vulnerable to bursts of Electrical Fast Transients (EFT) and surge transients. Surge transients can
be caused by lightning strikes or the switching of power systems including load changes and short circuits. Their
energy content is up to 8 million times higher than that of ESD transients and thus, requires the addition of external
transient protection.
Because standard RS-485 transceivers have asymmetric stand-off voltages of -9V and +14V, external protection
requires a bidirectional Transient Voltage Suppressor (TVS) with asymmetric breakdown voltages. The only device
satisfying this requirement is the 400W TVS, SM712.
The SM712 operates across the asymmetrical common-mode voltage range from -7V to +12V. The device protects
transceivers against ESD, EFT, and surge transients up to the following levels:
• IEC61000-4-2 (ESD) +15kV (air), +8kV (contact)
• IEC61000-4-4 (EFT) 40A (5/50ns)
• IEC61000-4-5 (Lightning) 12A (8/20μs)
Because the transceiver’s ESD cells and the SM712 have a similar switching characteristics, series resistors (RS)
are used to prevent the two protection schemes from interacting with one another.
These resistors can be carbon composite or pulse-proof thick-film resistors which should be inserted between the
TVS and the transceiver bus terminals to limit the bus currents into the transceiver during a surge event. Their value
should be less than 20Ω to minimize the attenuation of the bus voltage during normal operation. Figure 43 shows
the schematic of a 1kV surge protection example for the ISL3152E and its bill of materials.
VS
100n
8
VCC
1 RO
B/Z 7
RS
A/Y 6
RS
B
2 RE
3 DE
4 DI
A
1
2
GND
5
XCVR
Name
Function
Order No.
Vendor
XCVR
5V, 115kbps transceiver
ISL3152EIBZ
Renesas
TVS
400W (8,20μs),
bidirectional TVS
SM712.TCT
Semtech
RS
10Ω, 0.2W, pulse-proof
thick-film resistor
CRCW0603-HP
e3 series
Vishay
TVS
3
Figure 43. IEC61000-4-5 Level 2 (1kV) Surge Protection and Associated Bill of Materials
For more information on transient protection, refer to AN1976, AN1977, AN1978, and AN1979.
7.3
Layout Guidelines
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3MHz to 3GHz,
high-frequency layout techniques must be applied during PCB design.
• For your PCB design to be successful, start with the design of the protection circuit in mind.
• Place the protection circuitry close to the bus connector to prevent noise transients from penetrating your board.
• Use VCC and ground planes to provide low-inductance. Note that high-frequency currents follow the path of least
inductance and not the path of least impedance.
• Design the protection components into the direction of the signal path. Do not force the transient currents to divert
from the signal path to reach the protection device.
FN6363 Rev.5.1
May 11, 2021
Page 26 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7. Application Information
• Apply 100nF to 220nF bypass capacitors as close as possible to the VCC pins of the transceiver, UART, and
controller ICs on the board.
• Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to minimize the
effective via-inductance.
• Use 1kΩ to 10kΩ pull-up/down resistors for the transceiver enable lines to limit noise currents into these lines
during transient events.
• Insert pulse-proof resistors into the A and B bus lines if the TVS clamping voltage is higher than the specified
maximum voltage of the transceiver bus terminals. These resistors limit the residual clamping current into the
transceiver and prevent it from latching up.
7.3.1
Layout Example
= VCC Vias
RPU
= Ground Vias
RPU
CB
ISL3152E
1
R
2
VCC
8
RE
B
7
3
DE
A
6
4
D
GND
5
RS
to Bus
Connector
MCU
RPD
RS
TVS
Figure 44. ISL3152E Layout Example
FN6363 Rev.5.1
May 11, 2021
Page 27 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8.
8. Revision History
Revision History
Date
Rev.
May 11, 2021
5.1
Updated Links throughout.
Removed obsolete PDIP part and applicable information throughout.
Updated Ordering Information table formatting.
Updated Figure 18.
Updated POD M8.15 to the latest revision, changes are as follows:
-Added the coplanarity spec into the drawing
Updated PODs M8.118 and M10.118 to the latest revisions, changes are as follows:
-Corrected typo in the side view 1 updating package thickness tolerance from ±010 to ±0.10.
Updated POD M14.15 to the latest revision, changes are as follows:
-In Side View B and Detail A added lead length dimension (1.27 – 0.40)
Changed angle of the lead to 0-8 degrees.
Jun 3, 2020
5.0
Changed minimum value for maximum data rate from 115kbps to 115.2kbps on page 8.
Apr 19, 2018
4.0
Updated to the latest Renesas formatting.
Updated title.
Updated Application and Features bullets.
Updated Table 1.
Updated Ordering Information table by adding all available parts, updating Note 1, and removing Notes 2
through 5.
Updated Pin Descriptions.
Updated Figures 1 through 9.
Updated Recommended Operating Conditions - Supply Voltage.
Added Device Description sections
Rewrote the Application Information sections.
Added the following Typical Performance curves:
-Driver Output High and Low Voltages vs Output Current
-Driver Output Voltages vs Common-Mode Voltage
-Driver Output Voltage vs Supply Voltage
-Supply Current vs Data Rate for all three data rate versions
Aug 23, 2017
3.0
Updated the Receiving Truth Table.
Updated header/footer.
Updated the POD M8.118 from revision 2 to revision 4. Changes since revision 2:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
-Corrected lead width dimension in side view 1 from “0.25 - 0.036” to “0.25 - 0.36”.
Updated the POD M10.118 from revision 0 to revision 1. Changes since revision 0:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
Updated the POD M14.15 from revision 0 to revision 1. Changes since revision 0:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
Updated the POD M8.15 from revision 1 to revision 4. Changes since revision 1:
-Changed Note 1 “1982” to “1994”
-In the Typical Recommended Land pattern, changed the following:
2.41 (0.095) to 2.20 (0.087)
0.76 (0.030) to 0.60 (0.023)
0.20 to 5.20 (0.205)
Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
Jun 30 2009
2.0
Converted to new Intersil template. Rev. 2 changes are as follows:
Page 1 – Introduction was reworded to fit graphs. Features section by listing only key features.
Added performance graphs.
Page – 2 Updated Ordering Information by numbering all notes and referencing them on each part.
Added MSL Note as new standard with linked parts to device info page. Updated Pinout name to Pin
Configurations with Pin Descriptions following on page 3.
Page 5 – Added Boldface limit verbiage in Electrical specifications table and added bold formatting for Min
and Max over-temperature limits.
Page 17 – Added Revision History and Products information with all links included.
Jan 17 2008
1.0
Added 8 Ld PDIP to ordering information, POD, and Thermal resistance. Applied Intersil Standards as
follows: Updated ordering information with Notes for tape and reel reference, Pb-free PDIP and lead finish.
Added Pb-free reflow link and Pb-free note to Thermal Information. Added E8.3 POD.
Dec 14, 2006
0.0
Initial release
FN6363 Rev.5.1
May 11, 2021
Description
Page 28 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
9.
Package Outline Drawings
9. Package Outline Drawings
For the most recent package outline drawing, see M8.15.
M8.15
8 Lead Narrow Body Small Outline Plastic Package
Rev 5, 4/2021
FN6363 Rev.5.1
May 11, 2021
Page 29 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
M8.118
8 Lead Mini Small Outline Plastic Package
Rev 5, 5/2021
3.0 ±0.05
9. Package Outline Drawings
For the most recent package outline drawing, see M8.118.
5
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9 ±0.15
3.0 ±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ±0.15
0.25
3°±3°
0.85 ±0.10
H
DETAIL “X”
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ±0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
FN6363 Rev.5.1
May 11, 2021
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane “H”.
6. Dimensions in ( ) are for reference only.
Page 30 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
M10.118
10 Lead Mini Small Outline Plastic Package
Rev 2, 5/2021
9. Package Outline Drawings
For the most recent package outline drawing, see M10.118.
5
3.0 ±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9 ±0.15
3.0 ±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
PLANE
TOP VIEW
0.55 ±0.15
0.25
3°±3°
0.85 ±0.10
H
DETAIL “X”
C
SEATING PLANE
0.18 - 0.27
0.08 M C A-B D
0.10 ±0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.50)
(0.29)
(1.40)
5. Dimensions are measured at Datum Plane “H”.
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN6363 Rev.5.1
May 11, 2021
Page 31 of 32
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
M14.15
14 Lead Narrow Body Small Outline Plastic Package
Rev 2, 6/20
FN6363 Rev.5.1
May 11, 2021
9. Package Outline Drawings
For the most recent package outline drawing, see M14.15.
Page 32 of 32
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(Rev.1.0 Mar 2020)
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