ISL3158AEMBZ-T7A

DATASHEET T E P R OD U C OB S O L E T OD U C T R P E T U UBSTIT S E L IB S S PO ISL3158E ISL3158AE FN6886 Rev 1.00 October 15, 2013 ±16.5kV ESD (IEC61000-4-2) Protected, Large Output Swing, 5V, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceiver The ISL3158AE is a BiCMOS, IEC61000 ESD protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. Each driver output and receiver input is protected against ±16.5kV ESD strikes without latch-up. The ISL3158AE transmitter delivers exceptional differential output voltages (2.4V min), into the RS-485 required 54 load, for better noise immunity or to allow up to eight 120 terminations in “star” or other non-standard bus topologies. This device has very low bus currents (+125µA/-75µA), so it presents a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven bus. Rx outputs feature high drive levels - typically 28mA @ VOL = 1V (to ease the design of optocoupled isolated interfaces). Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state until the power supply has stabilized, and the Tx outputs are fully short circuit protected. The ISL3158AE is a half duplex version. It multiplexes the Rx inputs and Tx outputs to allow transceivers with output disable functions in an 8 Ld package. Features • High Driver VOD . . . . . . . . . . . . . . 2.4V (Min) @ RD = 54 - Better Noise Immunity, or Drive Up to 8 Terminations • IEC61000 ESD Protection on RS-485 I/O Pins . . ±16.5kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Full Fail-safe (Open, Short, Terminated and Undriven) Receivers • High Rx IOL to Drive Opto-Couplers for Isolated Applications • Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State During Power-up/Power-down • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Specified for Single 5V, 10% Tolerance, Supplies • High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 10Mbps • Low Quiescent Supply Current . . . . . . . . . . . . . . . . 600µA Ultra Low Shutdown Supply Current . . . . . . . . . . . . .70nA • -7V to +12V Common Mode Input Voltage Range • Half Duplex Pinouts • Pb-free (RoHS compliant) • Three-State Rx and Tx Outputs • Current Limiting for Driver Overload Protection Applications • Utility Meters and Automated Meter Reading Systems • High Node Count Systems • PROFIBUS® and Field Bus Networks, and Factory Automation • Security Camera Networks • Building Lighting and Environmental Control Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FUL L DUPLEX DATA RATE (Mbps) ISL3158AEM Half 10 No Yes ISL3158AEMW Half 10 No Yes FN6886 Rev 1.00 October 15, 2013 SLEW-RATE # DEVICES LIMITED? HOT PLUG ON BUS Rx/Tx ENABLE? QUIESCENT ICC (µA) 256 Yes 600 Yes 8 256 Yes 600 Yes N/A LOW POWER PIN SHUTDOWN? COUNT Page 1 of 16 ISL3158AE Pinout ISL3158AE (8 LD SOIC) TOP VIEW RO 1 R RE 2 DE 3 DI 4 D 8 VCC 7 B/Z 6 A/Y 5 GND Ordering Information PART NUMBER (Notes 2, 3) ISL3158AEMBZ (Note 1) ISL3158AEMW PART MARKING 3158A EMBZ TEMP. RANGE (°C) -55 to +125 -55 to +125 PACKAGE (Pb-Free) 8 Ld SOIC PKG. DWG. # M8.15 Wafer NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL3158AE. For more information on MSL, please see tech brief TB363. FN6886 Rev 1.00 October 15, 2013 Page 2 of 16 ISL3158AE Truth Tables RECEIVING TRANSMITTING INPUTS INPUTS OUTPUTS RE RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z High-Z 1 0 X High-Z* High-Z* NOTE: *Shutdown Mode (See Note 10). OUTPUT DE DE Half Duplex Full Duplex A-B RO 0 0 X  -0.05V 1 0 0 X  -0.2V 0 0 0 X Inputs Open/Shorted 1 1 0 0 X High-Z* 1 1 1 X High-Z NOTE: *Shutdown Mode (See Note 10). Pin Descriptions PIN FUNCTION RO Receiver output: If A-B  -50mV, RO is high; If A-B  -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. VCC System power supply input (4.5V to 5.5V). FN6886 Rev 1.00 October 15, 2013 Page 3 of 16 ISL3158AE Typical Operating Circuit ISL3158AE +5V +5V + 8 0.1µF 0.1µF + 8 VCC 1 RO R D 2 RE B/Z A/Y 3 DE 4 DI FN6886 Rev 1.00 October 15, 2013 VCC 7 6 RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 RO 1 Page 4 of 16 ISL3158AE Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V A/Y, B/Z (Transient Pulse Through 100) . . . . . . . . . . . . . . ±25V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . See Specifications Table Thermal Resistance (Typical, Note 4) JA (°C/W) 8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 5). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. TEMP (°C) MIN TYP MAX UNITS Full - - VCC V RL = 100 (RS-422) (Figure 1A) Full 2.8 3.6 - V RL = 54 (RS-485) (Figure 1A) Full 2.4 3.1 VCC V RL = 15 (Eight 120 terminations) (Note 13) 25 - 1.65 - V RL = 60, -7V  VCM  12V (Figure 1B) Full 2.4 3 - V VOD RL = 54 or 100 (Figure 1A) Full - 0.01 0.2 V VOC RL = 54 or 100 (Figure 1A) Full - - 3.15 V VOC RL = 54 or 100 (Figure 1A) Full - 0.01 0.2 V SYMBOL TEST CONDITIONS DC CHARACTERISTICS Driver Differential VOUT (No load) VOD1 Driver Differential VOUT (Loaded) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V 25 - 100 - mV DI Input Hysteresis Voltage VHYS Logic Input Current IIN1 DE, DI, RE Full -2 - 2 µA Input Current (A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or 5.5V VIN = 12V Full - 70 125 µA VIN = -7V Full -75 55 - µA DE = VCC, -7V  VY or VZ  12V (Note 7) Full - - ±250 mA -7V  VCM  12V (Note 15) Full -200 -90 -50 mV Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage IOSD1 VTH Receiver Input Hysteresis VTH VCM = 0V 25 - 20 - mV Receiver Output High Voltage VOH IO = -8mA, VID = -50mV Full VCC - 1.2 4.3 - V Receiver Output Low Voltage VOL IO = -8mA, VID = -200mV Full - 0.25 0.5 V Receiver Output Low Current IOL VO = 1V, VID = -200mV Full 15 28 - mA FN6886 Rev 1.00 October 15, 2013 Page 5 of 16 ISL3158AE Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 5). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS Three-State (High Impedance) Receiver Output Current IOZR 0.4V  VO  2.4V Full -1 0.03 1 µA Receiver Input Resistance RIN -7V  VCM  12V Full 96 160 - k 0V  VO  VCC Full ±7 65 ±85 mA Half Duplex Versions, DE = VCC, RE = X, DI = 0V or VCC Full - 650 800 µA All Versions, DE = 0V, RE = 0V, or Full Duplex Versions, DE = VCC, RE = X. DI = 0V or VCC Full - 550 700 µA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.07 3 µA IEC61000-4-2, Air-Gap Discharge Method 25 - ±16.5 - kV IEC61000-4-2, Contact Discharge Method 25 - ±9 - kV Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV Human Body Model, per MIL-STD-883 Method 3015 25 - ±7 - kV Machine Model 25 - 400 - V Receiver Short-Circuit Current IOSR SUPPLY CURRENT No-Load Supply Current (Note 6) Shutdown Supply Current ICC ISHDN ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) All Pins 1/2 Duplex DRIVER SWITCHING CHARACTERISTICS (ISL3158AE) Driver Differential Output Delay tPLH, tPHL RDIFF = 54, CL = 100pF (Figure 2) Full - 21 30 ns Driver Differential Output Skew tSKEW RDIFF = 54, CL = 100pF (Figure 2) Full - 0.2 3 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54, CL = 100pF (Figure 2) Full - 12 16 ns Maximum Data Rate fMAX CD = 470pF (Figure 4), (Note 15) Full - 10 - Mbps Driver Enable to Output High tZH RL = 500, CL = 100pF, SW = GND (Figure 3), (Note 8) Full - 30 45 ns Driver Enable to Output Low tZL RL = 500, CL = 100pF, SW = VCC (Figure 3), (Note 8) Full - 28 45 ns Driver Disable from Output Low tLZ RL = 500, CL = 15pF, SW = VCC (Figure 3) Full - 50 65 ns Driver Disable from Output High tHZ RL = 500, CL = 15pF, SW = GND (Figure 3) Full - 38 65 ns (Notes 10, 15) Full - 160 - ns Time to Shutdown tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500, CL = 100pF, SW = GND (Figure 3), (Notes 10, 11) Full - - 200 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500, CL = 100pF, SW = VCC (Figure 3), (Notes 10, 11) Full - - 200 ns Full - 10 - Mbps Full - 33 50 ns (Figure 5) Full - 2.5 5 ns RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Note 9) Full - 8 15 ns RECEIVER SWITCHING CHARACTERISTICS (ISL3158AE) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low FN6886 Rev 1.00 October 15, 2013 fMAX (Figure 5) (Note 15) tPLH, tPHL (Figure 5) tSKD tZL Page 6 of 16 ISL3158AE Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 5). Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS Receiver Enable to Output High tZH RL = 1k, CL = 15pF, SW = GND (Figure 6), (Note 9) Full - 7 15 ns Receiver Disable from Output Low tLZ RL = 1k, CL = 15pF, SW = VCC (Figure 6) Full - 8 15 ns Receiver Disable from Output High tHZ RL = 1k, CL = 15pF, SW = GND (Figure 6) Full - 8 15 ns (Notes 10, 15) Full 60 160 600 ns Time to Shutdown tSHDN Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Notes 10, 12) Full - - 200 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Notes 10, 12) Full - - 200 ns NOTES: 5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 6. Supply current specification is valid for loaded drivers when DE = 0V. 7. Applies to peak current. See “Typical Performance Curves” beginning on page 12 for more information. 8. Keep RE = 0 to prevent the device from entering SHDN. 9. The RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 12. Set the RE signal high time >600ns to ensure that the device enters SHDN. 13. See Figure 8 for more information, and for performance over-temperature. 14. For wafer sale, the switching test limits are established by characterization. 15. Limits established by characterization and are not production tested. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z DI VOD D 375 DE Z VOD D Y Y RL/2 FIGURE 1A. VOD AND VOC RL = 60 VCM -7V TO +12V 375 VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS FN6886 Rev 1.00 October 15, 2013 Page 7 of 16 ISL3158AE Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPHL tPLH VCC OUT (Z) VOH OUT (Y) VOL CL = 100pF DE Z DI RDIFF D Y CL = 100pF 90% DIFF OUT (Y - Z) 10% SIGNAL GENERATOR +VOD 90% 10% tR -VOD tF SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 500 VCC D SIGNAL GENERATOR SW Y GND CL 3V DE PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 15 tLZ Y/Z X 0/1 VCC 15 tZH Y/Z 0 (Note 8) 1/0 GND 100 tZL Y/Z 0 (Note 8) 0/1 VCC 100 tZH(SHDN) Y/Z 1 (Note 11) 1/0 GND 100 tZL(SHDN) Y/Z 1 (Note 11) 0/1 VCC 100 NOTE 7 1.5V 1.5V 0V tZH, tZH(SHDN) OUTPUT HIGH NOTE 7 tHZ VOH - 0.5V 2.3V OUT (Y, Z) VOH 0V tZL, tZL(SHDN) tLZ NOTE 7 VCC OUT (Y, Z) 2.3V OUTPUT LOW FIGURE 3A. TEST CIRCUIT VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC DE + Z DI 60 D CD Y SIGNAL GENERATOR VOD 3V DI 0V - +VOD DIFF OUT (Y - Z) -VOD FIGURE 4A. TEST CIRCUIT 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER DATA RATE FN6886 Rev 1.00 October 15, 2013 Page 8 of 16 ISL3158AE Test Circuits and Waveforms (Continued) +1.5V RE 0V 15pF B R A A 0V RO 0V -1.5V tPHL tPLH VCC SIGNAL GENERATOR 1.5V RO 1.5V 0V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE RE GND B A R 1k RO SIGNAL GENERATOR 15pF VCC SW NOTE 7 GND RE 3V 1.5V 1.5V 0V PARAMETER DE A +1.5V SW tHZ 0 tLZ 0 -1.5V VCC tZH (Note 9) 0 +1.5V GND tZL (Note 9) 0 -1.5V VCC tZH(SHDN) (Note 12) 0 +1.5V GND tZL(SHDN) (Note 12) 0 -1.5V VCC FIGURE 6A. TEST CIRCUIT GND tZH, tZH(SHDN) NOTE 7 OUTPUT HIGH tHZ VOH - 0.5V 1.5V RO VOH 0V tZL, tZL(SHDN) tLZ NOTE 7 VCC RO 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES FN6886 Rev 1.00 October 15, 2013 Page 9 of 16 ISL3158AE Receiver (Rx) Features This device utilizes a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than 200mV, as required by the RS-422 and RS-485 specifications. Rx outputs feature high drive levels (typically 28mA @ VOL = 1V to ease the design of optically coupled isolated interfaces). Receiver input resistance of 96k surpasses the RS-422 specification of 4k, and is eight times the RS-485 “Unit Load (UL)” requirement of 12k minimum. Thus, this product is known as a “one-eighth UL” transceiver, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Rx inputs function with common mode voltages as great as ±7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input. The ISL3158AE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum ±2.4V VOD guarantees at least ±900mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL3158AE in “star” and other multi-terminated, “non-standard” network topologies. Figure 8, details the transmitter’s VOD vs IOUT characteristic, and includes load lines for six (20) and eight (15) 120 terminations. The figure shows that the driver typically delivers 1.65/1.5V into 6/8 terminations, even at the worst case temperature of +85°C.The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3158AE delivers RS-485 voltage levels with 3x to 4x the number of terminations. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3158AE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.4V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. DE, DI = VCC RE = GND 5.0 3.5V VCC (V) Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for long runs, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. High VOD Improves Noise Immunity and Flexibility 3.3V 2.5 VCC 0 5.0 RL = 1k 2.5 0 A/Y ISL3158AE RL = 1k RO ISL3158AE 5.0 2.5 0 Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.4V across a 54 load (RS-485), and at least 2.8V across a 100 load (RS-422). The driver features low propagation delay skew to maximize bit width, and to minimize EMI, and all drivers are three-stateable via the active high DE input. FN6886 Rev 1.00 October 15, 2013 RECEIVER OUTPUT (V) RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-tomultipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Outputs of the ISL3158AE driver is not limited, so faster output transition times allow data rates of at least 10Mbps DRIVER Y OUTPUT (V) Application Information TIME (40µs/DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL3158AE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY ESD Protection All pins on this device includes class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced Page 10 of 16 ISL3158AE structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard’s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The ISL3158AE 1/2 duplex RS-485 pins withstand ±16.5kV airgap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±9kV. The RS485 pins of all the ISL3158AE versions survive ±9kV contact discharges. Proper termination is imperative, when using the 10Mbps devices, to minimize reflections. Terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limit circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes. Low Power Shutdown Mode This CMOS transceiver uses a fraction of the power required by it’s bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 70nA trickle. This device enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 8, 9, 10, 11 and 12, at the end of the “Electrical Specification” table on page 6, for more information. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 10Mbps are limited to lengths of less than 100’. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. FN6886 Rev 1.00 October 15, 2013 Page 11 of 16 ISL3158AE Typical Performance Curves VCC = 5V, TA = +25°C; Unless Otherwise Specified. 140 3.8 +25°C DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 130 120 +85°C 110 100 90 80 70 60 RD = 54 RD = 15 RD = 20 50 40 RD = 100 30 20 10 0 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) 3.6 3.5 3.4 3.3 3.2 FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE RDIFF = 54 3.1 3.0 2.9 2.8 -60 5 RDIFF = 100 3.7 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 700 200 150 650 100 600 50 550 ICC (µA) OUTPUT CURRENT (mA) Y OR Z = LOW 0 -50 ICC DE-VCC 500 450 ICC DE-GND 400 -100 Y OR Z = HIGH -150 -200 -7 350 -6 -4 -2 0 2 4 6 8 10 300 -60 12 -40 -20 0 OUTPUT VOLTAGE (V) 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 0.9 0.8 29 0.7 27 0.6 SKEW (ns) PROPOGATION DELAY (ns) 31 25 TPHL 23 0.5 0.4 0.3 21 0.2 TPLH 19 17 -60 -45 -30 -15 0.1 0 15 30 45 60 75 90 105 120 TEMPERATURE (°C) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3158AE) FN6886 Rev 1.00 October 15, 2013 SKEW 0 -60 -45 -30 -15 0 15 30 45 60 TEMPERATURE (°C) 75 90 105 120 FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3158AE) Page 12 of 16 ISL3158AE RDIFF = 54, CL = 100pF DI 5 0 5 RO 0 5 4 B/Z 3 2 A/Y 60 VOL, +25°C 50 VOL, +85°C 40 30 VOH, +25°C 20 TIME (20ns/DIV) FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, (ISL3158AE) VOH, +85°C 10 0 1 FN6886 Rev 1.00 October 15, 2013 DRIVER INPUT (V) VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) RECEIVER OUTPUT CURRENT (mA) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves 0 1 2 3 4 RECEIVER OUTPUT VOLTAGE (V) FIGURE 15. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE Page 13 of 16 5 ISL3158AE Die Characteristics DIE DIMENSIONS INCLUDING 50ΜM SCRIBE Thickness: 14 mils 1400µm x 1530µm Interface Materials GLASSIVATION Sandwich TEOS and Nitride TOP METALLIZATION Type: Al with 0.5% Cu Thickness: 28kÅ SUBSTRATE N/A BACKSIDE FINISH Silicon/Polysilicon/Oxide Assembly Related Information TABLE 2. BOND PAD FUNCTION AND COORDINATES PAD # FUNCTION X (µm) Y (µm) 1 RO 99.5 1308 2 RE 99.5 1014.35 3 DE 99.5 498.3 4 DI 99.5 286.75 5 GND2 574.3 104.7 6 GND1 684.3 104.7 7 Y 1054 250.6 8 A (half duplex) 1054 540.45 9 Z 1054 831.1 10 B 1054 1004.65 11 A (full duplex) 1054 1256.45 12 VCC 562.55 1385.35 SUBSTRATE POTENTIAL GND (powered up) Additional Information WORST CASE CURRENT DENSITY N/A PROCESS Si GateBiCMOS, IBM P6 TRANSISTOR COUNT 530 PAD OPENING SIZE: 90µm x 90µm WAFER SIZE: 200mm (~8 inch) FN6886 Rev 1.00 October 15, 2013 Page 14 of 16 ISL3158AE Metallization Mask Layout ISL3158AE VCC RO A RE B Z A DE DI Y G2 G1 © Copyright Intersil Americas LLC 2009-2013. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6886 Rev 1.00 October 15, 2013 Page 15 of 16 ISL3158AE Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6886 Rev 1.00 October 15, 2013 Page 16 of 16