ISL3159EFRZ-T

DATASHEET ISL3159E FN6364 Rev.3.00 Aug 28, 2017 ±15kV ESD Protected, +125°C, 40Mbps, 5V, PROFIBUS, Full Fail-Safe, RS-485/RS-422 Transceiver The ISL3159E is a ±15kV IEC61000 ESD protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. It also features the larger output voltage and higher data rate (up to 40Mbps) required by high speed PROFIBUS applications, and is offered in industrial and extended Industrial (-40°C to +125°C) temperature ranges. The low bus currents (+220µA/-150µA) present a 1/5 unit load to the RS-485 bus. This allows up to 160 transceivers on the network without violating the RS-485 specification’s load limit and without using repeaters. Features This transceiver requires a 5V ±10% tolerance supply, and delivers at least a 2.1V differential output voltage over this supply range. This translates into better noise immunity (data integrity), longer reach, or the ability to drive up to six 120Ω terminations in “star” or other nonstandard bus topologies, at the exceptional 40Mbps data rate. • 1/5 unit load allows up to 160 devices on the bus SCSI applications benefit from the ISL3159E’s low receiver and transmitter part-to-part skews. The ISL3159E is perfect for high speed parallel applications requiring simultaneous capture of large numbers of bits. The low bit-to-bit skew eases the timing constraints on the data latching signal. • IEC61000 ESD protection on RS-485 I/O pins . . . . . . ±15kV - Class 3 HBM ESD level on all other pins . . . . . . . . . . . >9kV • Large differential VOUT . . . . . . . . . . . . . . . . . . . 2.8V into 54Ω Better noise immunity, or drive up to 6 terminations • High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 40Mbps • Specified for +125°C operation • 11/13ns (maximum) Tx/Rx propagation delays; 1.5ns (maximum) skew • Full fail-safe (open, shorted, terminated/undriven) receiver • High Rx IOL to drive optocouplers for isolated applications • Hot plug - Tx and Rx outputs remain three-state during power-up • Low quiescent supply current. . . . . . . . . . . . . . . . . . . . . . 4mA • Low current shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 1µA • -7V to +12V common-mode input voltage range • Three-state Rx and Tx outputs • Operates from a single +5V supply (10% tolerance) Receiver (Rx) inputs feature a “full fail-safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. Rx outputs feature high drive levels (typically >30mA at VOL = 1V) to ease the design of optically isolated interfaces. • Current limiting and thermal shutdown for driver overload protection Hot plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. • PROFIBUS DP and FMS networks Driver (Tx) outputs are short-circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. • Motor controller/position encoder systems Related Literature • Security networks • For a full list of related documents, refer to our website • Industrial/process control networks • Pb-free (RoHS compliant) Applications • SCSI “fast 40” drivers and receivers • Factory automation • Field bus networks • Building environmental control systems - ISL3159E product page +5V 8 VCC 1 RO 0.1µF 0.1µF + 8 VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI +5V SOIC AND MSOP PIN NUMBERS SHOWN + RT RT 7 B/Z DE 3 6 A/Y RE 2 R D GND 5 DI 4 RO 1 GND 5 FIGURE 1. TYPICAL OPERATING CIRCUIT FN6364 Rev.3.00 Aug 28, 2017 Page 1 of 17 ISL3159E Ordering Information PART NUMBER (Notes 3, 4) TEMP. RANGE (°C) PART MARKING PACKAGE (RoHS Compliant) PKG. DWG. # ISL3159EIBZ (Note 1) 3159 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3159EIUZ (Note 1) 3159Z -40 to +85 8 Ld MSOP M8.118 ISL3159EIRZ (Note 2) 159Z -40 to +85 10 Ld DFN L10.3x3C ISL3159EFBZ (Note 1) 3159 EFBZ -40 to +125 8 Ld SOIC M8.15 ISL3159EFUZ (Note 1) 159FZ -40 to +125 8 Ld MSOP M8.118 ISL3159EFRZ (Note 2) 59FZ -40 to +125 10 Ld DFN L10.3x3C NOTES: 1. Add “-T” suffix for 2.5k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications. 2. Add “-T” suffix for 6k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications. 3. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), refer to the product information page for the ISL3159E. For more information on MSL, refer to TB363. TABLE 1. KEY DIFFERENCES BETWEEN HIGH-SPEED INTERFACE FAMILY OF PARTS PART NUMBER FULL/HALF DUPLEX VCC (V) VOD (V) DATA RATE (Mbps) ISL3179E Half 3.3 1.5 40 ISL3180E Full 3.3 1.5 40 ISL3159E Half 5 2.1 40 ISL3259E Half 5 2.1 100 Pin Configurations ISL3159E (10 LD DFN) TOP VIEW ISL3159E (8 LD SOIC, MSOP) TOP VIEW RO 1 R RE 2 DE 3 DI 4 D 8 VCC RO 1 10 VCC 7 B/Z RE 2 9 NC 6 A/Y DE 3 5 GND DI 4 7 A/Y NC 5 6 GND Truth Table 8 B/Z EP Truth Table TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS DE DI B/Z A/Y X 1 1 0 1 0 0 VAB ≥-0.05V 1 X 1 0 1 0 0 0 -0.05V >VAB >-0.2V Undetermined RE DE OUTPUT RE A-B RO 0 0 X High-Z High-Z 0 0 VAB ≤ -0.2V 0 1 0 X High-Z * High-Z * 0 0 Inputs Open/Shorted 1 1 1 X High-Z 1 0 X High-Z* NOTE: *Shutdown mode NOTE: *Shutdown mode FN6364 Rev.3.00 Aug 28, 2017 Page 2 of 17 ISL3159E Pin Descriptions PIN FUNCTION RO Receiver output. If A-B ≥ -50mV, RO is high. If A-B ≤ -200mV, RO is low. If A and B are unconnected (floating) or shorted, or connected to a terminated bus that is undriven, RO is high. RE Receiver output enable. RO is enabled when RE is low. RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC through a 1kΩ or greater resistor. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. This is also the potential of the DFN’s exposed metal pad. A/Y ±15kV IEC61000 ESD protected RS-485/422 level, noninverting receiver input and noninverting driver output. This pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1. B/Z ±15kV IEC61000 ESD protected RS-485/422 level, inverting receiver input and inverting driver output. This pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1. VCC System power supply input (4.5V to 5.5V). NC No internal connection. EP The exposed metal pad on the bottom of the DFN; connect to GND. Typical Operating Circuit +5V +5V SOIC AND MSOP PIN NUMBERS SHOWN + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT DI 4 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 RO 1 FIGURE 2. TYPICAL OPERATING CIRCUIT FN6364 Rev.3.00 Aug 28, 2017 Page 3 of 17 ISL3159E Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short-circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . Refer to “Electrical Specifications” Thermal Resistance (Typical) JA (°C/W) JC (°C/W) 8 Ld SOIC Package (Notes 5, 7) . . . . . . . . . 105 60 8 Ld MSOP Package (Notes 5, 7) . . . . . . . . 140 55 10 Ld DFN Package (Notes 6, 8) . . . . . . . . 46 3.5 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to TB493 Operating Conditions Temperature Range ISL3159EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C ISL3159EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. Refer to TB379 for details. 6. JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features. Refer to TB379. 7. For JC, the “case temp” location is taken at the package top center. 8. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C, (Note 9) PARAMETER TEMP (°C) MIN (Note 19) TYP MAX (Note 19) No Load Full - - VCC RL = 100Ω (RS-422) (Figure 3A) Full 2.6 3.4 - V RL = 54Ω (RS-485) (Figure 3A) I Suffix Full 2.1 2.8 VCC V F Suffix, (Note 18) SYMBOL TEST CONDITIONS UNIT DC CHARACTERISTICS Driver Differential VOUT Change in Magnitude of Driver Differential VOUT for Complementary Output States VOD VOD Full 2.1 2.8 VCC V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, Note 18) Full 1.9 2.7 - V RL = 54Ω or 100Ω (Figure 3A) Full - 0.01 0.2 V Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω (Figure 3A, Note 18) Full - 2 3 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States VOC RL = 54Ω or 100Ω (Figure 3A) Full - 0.01 0.2 V Logic Input High Voltage VIH DI, DE, RE Full 2 - - V Logic Input Low Voltage VIL DI, DE, RE Full - - 0.8 V Logic Input Current IIN1 DI = DE = RE = 0V or VCC Full -2 - 2 µA Input Current (A/Y, B/Z) IIN2 DE = 0V, VCC = 0V or 5.5V VIN = 12V Full - - 220 µA Full -160 - - µA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 11) Full - - ±250 mA VIN = -7V Driver Short-Circuit Current, VO = High or Low IOSD1 Differential Capacitance CD A/Y to B/Z 25 - 9 - pF Receiver Differential Threshold Voltage V TH -7V ≤ VCM ≤ 12V Full -200 - -50 mV FN6364 Rev.3.00 Aug 28, 2017 Page 4 of 17 ISL3159E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C, (Note 9) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 19) TYP MAX (Note 19) UNIT Receiver Input Hysteresis V TH VCM = 0V 25 - 28 - mV Receiver Output High Voltage VOH IO = -8mA, VID = -50mV Full VCC - 0.5 - - V Receiver Output Low Voltage VOL IO = +10mA, VID = -200mV Full - - 0.4 V Receiver Output Low Current IOL VOL = 1V, VID = -200mV Full 25 40 - mA Three-state (high impedance) Receiver Output Current IOZR 0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 54 80 - kΩ Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full ±20 - ±110 mA DI = DE = 0V or VCC Full - 2.6 4 mA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.05 1 µA IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8 - kV Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV HBM, per MIL-STD-883 Method 3015 25 - > ±9 - kV Machine Model 25 - > ±400 - V VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 6) Full 40 - - Mbps SUPPLY CURRENT No-Load Supply Current (Note 10) Shutdown Supply Current ICC ISHDN ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) All Pins DRIVER SWITCHING CHARACTERISTICS Maximum Data Rate fMAX Driver Differential Output Delay tDD RD = 54Ω, CD = 50pF (Figure 4) Full - 8 12 ns Driver Differential Output Skew tSKEW RD = 54Ω, CD = 50pF (Figure 4) Full - 0.5 1.5 ns Prop Delay Part-to-Part Skew tSKP-P RD = 54Ω, CD = 50pF (Figure 4, Note 17) Full - - 4 ns Driver Differential Rise or Fall Time tR, tF RD = 54Ω, CD = 50pF (Figure 4) Full 2 5 8 ns Driver Enable to Output High tZH RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Note 12) Full - 13 20 ns Driver Enable to Output Low tZL RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Note 12) Full - 11 20 ns |tZH (Y or Z) - tZL (Z or Y)| Full - 2.5 - ns Driver Enable Time Skew tENSKEW Driver Disable from Output High tHZ RL = 110Ω, CL = 50pF, SW = GND (Figure 5) Full - 14 20 ns Driver Disable from Output Low tLZ RL = 110Ω, CL = 50pF, SW = VCC (Figure 5) Full - 12 20 ns |tHZ (Y or Z) - tLZ (Z or Y)| Full - 3 - ns (Note 14) Full 60 - 600 ns Full - - 1000 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Notes 14, 15) Full - - 1000 ns VID = ±1.5V Full 40 - - Mbps Full - 9 13 ns (Figure 7) Full - 0 1.5 ns (Figure 7, Note 17) Full - - 4 ns Driver Disable Time Skew Time to Shutdown tDISSKEW tSHDN Driver Enable from Shutdown to Output High tZH(SHDN) RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Notes 14, 15) Driver Enable from Shutdown to Output Low tZL(SHDN) RECEIVER SWITCHING CHARACTERISTICS Maximum Data Rate Receiver Input to Output Delay fMAX tPLH, tPHL (Figure 7) Receiver Skew | tPLH - tPHL | tSKD Prop Delay Part-to-Part Skew tSKP-P FN6364 Rev.3.00 Aug 28, 2017 Page 5 of 17 ISL3159E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C, (Note 9) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 19) TYP MAX (Note 19) UNIT Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Note 13) Full - - 12 ns Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Note 13) Full - - 12 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) Full - - 12 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Full - - 12 ns (Note 14) Full 60 - 600 ns Full - - 1000 ns Full - - 1000 ns Time to Shutdown tSHDN Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Notes 14, 16) Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Notes 14, 16) NOTES: 9. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 10. Supply current specification is valid for loaded drivers when DE = 0V. 11. Applies to peak current. Refer to “Typical Performance Curves” on page 8 for more information. 12. Because of the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 13. Because of the shutdown feature, the RE signal high time must be short enough (typically 700ns to ensure that the device enters SHDN. 16. Set the RE signal high time >700ns to ensure that the device enters SHDN. 17. This is the part-to-part skew between any two units tested with identical test conditions (temperature, VCC, etc.). 18. VCC = 5V ±5% 19. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z Z DI VOD D 375Ω DE Y Y RL/2 FIGURE 3A. VOD AND VOC VOD D VOC RL = 60Ω VCM -7V TO +12V 375Ω FIGURE 3B. VOD WITH COMMON-MODE LOAD FIGURE 3. DC DRIVER TEST CIRCUITS FN6364 Rev.3.00 Aug 28, 2017 Page 6 of 17 ISL3159E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V VCC tPHL tPLH DE Z DI RD D OUT (Z) VOH OUT (Y) VOL CD Y SIGNAL GENERATOR 90% DIFF OUT (Y - Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |tPLH - tPHL| FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 110Ω VCC D SIGNAL GENERATOR SW Y GND 3V 50pF PARAMETER OUTPUT RE DE DI SW (Note 14) tZH, tZH(SHDN) (Note 14) 1.5V 1.5V 0V OUTPUT HIGH tHZ VOH - 0.5V 50% OUT (Y, Z) tHZ Y/Z X 1/0 GND tLZ Y/Z X 0/1 VCC tZH Y/Z 0 (Note 12) 1/0 GND tZL, tZL(SHDN) (Note 14) tZL Y/Z 0 (Note 12) 0/1 VCC OUT (Y, Z) tHZ(SHDN) Y/Z 1 (Note 15) 1/0 GND tLZ(SHDN) Y/Z 1 (Note 15) 0/1 VCC VOH 0V tLZ VCC 50% OUTPUT LOW VOL + 0.5V V OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. DRIVER ENABLE AND DISABLE TIMES VCC DE + Z DI 54Ω D Y SIGNAL GENERATOR VOD CL 3V DI 0V - CL +VOD DIFF OUT (Y - Z) -VOD FIGURE 6A. TEST CIRCUIT 0V FIGURE 6B. MEASUREMENT POINTS FIGURE 6. DRIVER DATA RATE FN6364 Rev.3.00 Aug 28, 2017 Page 7 of 17 ISL3159E Test Circuits and Waveforms (Continued) +3V RE +1.5V A 15pF B R A 1.5V 1.5V RO 0V tPLH tPHL VCC SIGNAL GENERATOR 1.7V RO 1.7V 0V FIGURE 7B. MEASUREMENT POINTS FIGURE 7A. TEST CIRCUIT FIGURE 7. RECEIVER PROPAGATION DELAY RE GND B A 1kΩ RO R VCC SW SIGNAL GENERATOR GND (Note 14) 15pF 3V RE 1.5V 1.5V 0V PARAMETER DE A tZH, tZH(SHDN) SW tHZ 0 tLZ 0 -1.5V VCC tZH (Note 13) 0 +1.5V GND tZL (Note 13) 0 -1.5V VCC tHZ(SHDN) (Note 16) 0 +1.5V GND tLZ(SHDN) (Note 16) 0 -1.5V VCC +1.5V OUTPUT HIGH (Note 14) GND tHZ VOH - 0.5V 1.5V RO VOH 0V tZL, tZL(SHDN) tLZ (Note 14) VCC RO 1.5V OUTPUT LOW FIGURE 8A. TEST CIRCUIT VOL + 0.5V V OL FIGURE 8B. MEASUREMENT POINTS FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified DRIVER OUTPUT CURRENT (mA) +85°C 90 RD = 30Ω 80 70 3.5 RD = 20Ω +25°C DIFFERENTIAL OUTPUT VOLTAGE (V) 110 100 +125°C RD = 54Ω 60 50 40 RD = 100Ω 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 4.5 5.0 FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FN6364 Rev.3.00 Aug 28, 2017 3.4 RD = 100Ω 3.3 3.2 3.1 3.0 2.9 2.8 2.7 RD = 54Ω 2.6 2.5 -40 -15 10 35 60 85 110 TEMPERATURE (°C) FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE Page 8 of 17 125 ISL3159E Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified (Continued) 2.55 200 150 2.50 Y OR Z = LOW ICC (mA) OUTPUT CURRENT (mA) 100 50 0 2.45 2.40 -50 Y OR Z = HIGH 2.35 -100 -150 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 2.30 -40 12 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 11. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FIGURE 12. SUPPLY CURRENT vs TEMPERATURE 9.0 0.9 |tPLH - tPHL| 8.8 0.8 8.6 8.4 0.7 tPHL SKEW (ns) PROPAGATION DELAY (ns) DE = VCC, RE = X OR DE = GND, RE = GND -15 8.2 8.0 7.8 0.6 0.5 7.6 tPLH 7.4 0.4 7.2 -15 10 35 60 85 0.3 -40 110 125 -15 10 0 5 RO 0 3 2 1 0 -1 Y-Z -2 -3 TIME (5ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS FN6364 Rev.3.00 Aug 28, 2017 RECEIVER OUTPUT (V) 5 DRIVER INPUT (V) DI 60 85 110 125 FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE RDIFF = 54Ω, CD = 50pF 35 TEMPERATURE (°C) TEMPERATURE (°C) RDIFF = 54Ω, CD = 50pF DI 5 0 5 RO 0 3 2 1 0 -1 Y-Z -2 -3 TIME (5ns/DIV) FIGURE 16. DRIVER AND RECEIVER WAVEFORMS Page 9 of 17 DRIVER INPUT (V) 7.0 -40 ISL3159E 0 5.0 RO 0 DRIVER+CABLE DELAY 3.0 (~156ns) 1.5 A-B 0 -1.5 -3.0 DI = 40Mbps 0 5.0 RO 0 3.0 DRIVER+CABLE DELAY 1.5 -1.5 -3.0 RECEIVER OUTPUT CURRENT (mA) FIGURE 18. DRIVER AND RECEIVER WAVEFORMS DRIVING 350 FEET (107 METERS) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120Ω) Die Characteristics VOL, +25°C SUBSTRATE AND DFN THERMAL PAD POTENTIAL (POWERED UP) VOL, +85°C 50 A-B TIME (10ns/DIV) 70 VOH, +25°C (~480ns) 0 TIME (10ns/DIV) FIGURE 17. DRIVER AND RECEIVER WAVEFORMS DRIVING 100 FEET (31 METERS) OF CAT5 CABLE (DOUBLE TERMINATED WITH 120Ω) 60 5 VOL, +125°C GND 40 PROCESS 30 VOH, +85°C Si Gate BiCMOS VOH, +125°C 20 10 0 0 1 2 3 4 5 RECEIVER OUTPUT VOLTAGE (V) FIGURE 19. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE FN6364 Rev.3.00 Aug 28, 2017 Page 10 of 17 DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) DRIVER INPUT (V) DI = 40Mbps RECEIVER INPUT (V) RECEIVER INPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves VCC = 5V, TA = +25°C; unless otherwise specified (Continued) ISL3159E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 receivers on each bus, assuming one unit load devices. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any mix of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. For parallel applications, bit-to-bit skews between any two ISL3159E transmitter and receiver pairs are guaranteed to be no worse than 8ns (4ns max for any two Tx, 4ns max for any two Rx). High VOD Improves Noise Immunity and Flexibility The ISL3159E driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum ±2.1V VOD guarantees at least ±600mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another important advantage of RS-485 is the extended Common-Mode Range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for cable lengths as long as 4000ft (~1200m), so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows use of the ISL3159E in “star” and other multiterminated, nonstandard network topologies. Figure 9 on page 8 details the transmitter’s VOD vs IOUT characteristic, and includes load lines for four (30Ω) and six (20Ω) 120Ω terminations. Figure 9 shows that the driver typically delivers 1.9/1.5V into 4/6 terminations, even at +85°C. The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL3159E typically delivers RS-485 voltage levels with 2x to 3x the number of terminations. Receiver (Rx) Features ESD Protection This transceiver utilizes a differential input receiver for maximum noise immunity and common-mode rejection. Input sensitivity is ±200mV, as required by the RS422 and RS-485 specifications. Receiver inputs function with common-mode voltages as great as 7V outside the power supplies (that is, +12V and -7V), making them ideal for long networks, or industrial environments, where induced voltages are a realistic concern. All pins on the ISL3159E include Class 3 (>9kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±15kV IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that can destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up and without degrading the RS-485 common-mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (for example, transient suppression diodes) and the associated, undesirable capacitive load they present. The receiver input resistance of 50kΩ surpasses the RS-422 specification of 4kΩ, and is five times the RS-485 “Unit Load” (UL) requirement of 12kΩ minimum. Thus, the ISL3159E is known as a “one-fifth UL” transceiver, and there can be up to 160 devices on the RS-485 bus while still complying with the RS-485 loading specification. The receiver is a “full fail-safe” version that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled (terminated/undriven). Rx outputs deliver large low state currents (typically >30mA) at VOL = 1V (to ease the design of optically coupled isolated networks). Receivers easily meet the 40Mbps data rate supported by the driver, and the receiver output is tri-statable using the active low RE input. Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.1V across a 54Ω load (RS-485/ PROFIBUS), and at least 2.6V across a 100Ω load (RS-422) even with VCC = 4.5V. The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. Driver outputs are not slew rate limited, so faster output transition times allow data rates of at least 40Mbps. Driver outputs are tri-statable using the active high DE input. FN6364 Rev.3.00 Aug 28, 2017 IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard’s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting Level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is more difficult to obtain repeatable results. The ISL3159E RS-485 pins withstand ±15kV air-gap discharges. Page 11 of 17 ISL3159E CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±9kV. The RS-485 pins of the ISL3159E survive ±8kV contact discharges. Hot Plug Function When a piece of equipment powers up, a period of time occurs in which the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL3159E incorporates a “hot plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.2V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. RE = GND 3.3V 3.1V 2.5 VCC 0 5.0 RL = 1kΩ 2.5 0 A/Y ISL3159E RL = 1kΩ RO ISL3159E 5.0 2.5 0 RECEIVER OUTPUT (V) DRIVER Y OUTPUT (V) 5.0 VCC (V) DE, DI = VCC TIME (40µs/DIV) FIGURE 20. HOT PLUG PERFORMANCE (ISL3159E) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY Data Rate, Cables and Terminations Twisted pair is the cable of choice for RS-485, RS-422 and PROFIBUS networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common-mode signals, which are effectively rejected by the differential receivers in these ICs. According to guidelines in the RS-422 and PROFIBUS specifications, networks operating at data rates in excess of 3Mbps should be limited to cable lengths of 100m (328ft) or less, and the PROFIBUS specification recommends that the more expensive “Type A” (22AWG) cable be used. The ISL3159E’s large differential output swing, fast transition times, and high drivecurrent output stages allow operation even at 40Mbps over standard “CAT5” cables in excess of 100m (328ft). Figure 18 on page 10 details the ISL3159E performance at this condition, with a 120Ω termination resistor at both the driver and the receiver ends. Note that the differential signal delivered to the receiver at the end of the cable (A-B) still exceeds 1V, so even longer cables could be driven if lower noise margins are FN6364 Rev.3.00 Aug 28, 2017 acceptable. Of course, jitter or some other criteria may limit the network to shorter cable lengths than those discussed here. If more noise margin is desired, shorter cables produce a larger receiver input signal as illustrated in Figure 17 on page 10. Performance should be even better if using the “Type A” cable. The ISL3159E may also be used at slower data rates over longer cables, but some limitations apply. The Rx is optimized for high speed operation, so its output may glitch if the Rx input differential transition times are too slow. Keeping the transition times below 500ns, (which equates to the Tx driving a 1000ft (305m) CAT 5 cable) yields excellent performance across the full operating temperature range. To minimize reflections, proper termination is imperative when using this high data rate transceiver. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω for “CAT5” and 220Ω for “Type A”) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Built-in Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These transmitters meet this requirement using driver output short-circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short-circuit current limiting circuitry, which ensures that the output current never exceeds the RS-485 specification, even at the common-mode voltage range extremes. In the event of a major short-circuit condition, the device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 15 °. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode This BiCMOS transceiver uses a fraction of the power required by its bipolar counterparts, but it also includes a shutdown feature that reduces the already low quiescent ICC to a 50nA trickle. It enters shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 12, 13, 14, 15, and 16 on page 6 for more information. Page 12 of 17 ISL3159E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE August 28, 2017 FM6364.3 Added Related Literature section. Added VAB information to Receiving Truth Table on page 2. Applied Intersil A Renesas Company template. August 25, 2015 FN6364.2 Added Key Differences table to page 2. July 29, 2015 FN6364.1 Reformatted datasheet to newest template and standards. Ordering Information table - added MSL note 3. Added in “Thermal Information” on page 4 Tjc for packages plus corresponding notes and changed Tja from 75 to 46 for DFN package. Pin Description on page 3 - Added row for EP and added to description of GND. Updated note references on Figures 5B and 8B. Die Characteristics section on page 10: removed Transistor Count Added Revision History table and About Intersil section. Updated POD M8.118 from rev 2 to rev 4. Changes since rev 2: - Updated to new intersil format by adding land pattern and moving dimensions from table onto drawing - Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36" Updated POD L10.3x3C from rev 1 to rev 4. Changes since rev 1: - Updated Format to new standard - Removed package outline and included center to center distance between lands on recommended land pattern. - Removed Note 4 "Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip." since it is not applicable to this package. Renumbered notes accordingly. - Tiebar Note 4 updated From: Tiebar shown (if present) is a non-functional feature. To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). Updated POD M8.15 from rev 1 to rev 4. Changes since rev 1: - Updated to new POD format by removing table and moving dimensions onto drawing and adding land pattern - Changed in Typical Recommended Land Pattern the following: 2.41(0.095) to 2.20(0.087) 0.76 (0.030) to 0.60(0.023) 0.200 to 5.20(0.205) - Changed Note 1 "1982" to "1994" FN6364 Rev.3.00 Aug 28, 2017 Page 13 of 17 ISL3159E About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information page found at www.intersil.com. For a listing of definitions and abbreviations of common terms used in our documents, visit www.intersil.com/glossary. You can report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. © Copyright Intersil Americas LLC 2007-2017. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6364 Rev.3.00 Aug 28, 2017 Page 14 of 17 ISL3159E Package Outline Drawing For the most recent package outline drawing, see M8.118. M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 4, 7/11 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.36 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN FN6364 Rev.3.00 Aug 28, 2017 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. Page 15 of 17 ISL3159E Package Outline Drawing For the most recent package outline drawing, see L10.3x3C. L10.3x3C 10 LEAD DUAL FLAT PACKAGE (DFN) Rev 4, 3/15 3.00 5 PIN #1 INDEX AREA A B 10 5 PIN 1 INDEX AREA 1 2.38 3.00 0.50 2 10 x 0.25 6 (4X) 0.10 C B 1.64 TOP VIEW 10x 0.40 BOTTOM VIEW (4X) 0.10 M C B SEE DETAIL "X" (10 x 0.60) (10x 0.25) 0.90 MAX 0.10 C BASE PLANE 2.38 0.20 C SEATING PLANE 0.08 C SIDE VIEW (8x 0.50) 1.64 2.80 TYP C TYPICAL RECOMMENDED LAND PATTERN 0.20 REF 4 0.05 DETAIL "X" NOTES: FN6364 Rev.3.00 Aug 28, 2017 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 6. Compliant to JEDEC MO-229-WEED-3 except for E-PAD dimensions. Page 16 of 17 ISL3159E Package Outline Drawing For the most recent package outline drawing, see M8.15. M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6364 Rev.3.00 Aug 28, 2017 Page 17 of 17