DATASHEET
±16.5kV ESD Protected, +125°C, 3.0V to 5.5V,
SOT-23/TDFN Packaged, Low Power, RS-485/RS-422
Transmitters
ISL3293E, ISL3294E, ISL3295E
ISL3296E, ISL3297E, ISL3298E
The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E,
ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV
IEC61000 contact), 3.0V to 5.5V powered, single transmitters
for balanced communication using the RS-485 and RS-422
standards. These drivers have very low bus currents (±40mA),
so they present less than a “1/8 unit load” to the RS-485 bus.
This allows more than 256 transmitters on the network without
violating the RS-485 specification’s 32 unit load maximum, and
without using repeaters.
Hot Plug circuitry ensures that the Tx outputs remain in a high
impedance state while the power supply stabilizes.
The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew rate
limited drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or from unterminated
stubs in multidrop and multipoint applications. Drivers on the
ISL3295E and ISL3298E are not limited, so they can achieve the
20Mbps data rate. All versions are offered in Industrial and
Extended Industrial (-40°C to +125°C) temperature ranges.
A 26% smaller footprint is available with the ISL3296E,
ISL3297E, ISL3298E’s TDFN package. These devices also
feature a logic supply pin (VL) that sets the switching points of
the DE and DI inputs to be compatible with a lower supply
voltage in mixed voltage systems.
For companion single RS-485 receivers in micro packages,
please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E,
ISL3284E data sheet.
Features
• High ESD protection on RS-485 outputs ±16.5kV HBM
- IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV
- Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM
• Specified for +125°C operation (VCC ≤ 3.6V only)
• Logic supply pin (VL) eases operation in mixed supply
systems (ISL3296E through ISL3298E only)
• Hot plug - Tx outputs remain three-state during power-up
• Low Tx leakage allows >256 devices on the bus
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• Low quiescent supply current. . . . . . . . . . . . . . . .150µA (Max)
- Very low shutdown supply current . . . . . . . . . . . 1µA (Max)
• -7V to +12V common mode output voltage range
(VCC ≤ 3.6V only)
• Current limiting and thermal shutdown for driver overload
protection (VCC ≤ 3.6V only)
• Tri-statable Tx outputs
• 5V tolerant logic inputs when VCC ≤5V
• Pb-free (RoHS compliant)
Applications
• Clock distribution
• High node count systems
• Space constrained systems
• Security camera networks
• Building environmental control/lighting systems
• Industrial/process control networks
TABLE 1. SUMMARY OF FEATURES
VL PIN?
TX
ENABLE?
(Note 11)
MAXIMUM
QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
YES
NO
YES
150
YES
6 Ld SOT
YES
YES
NO
YES
150
YES
6 Ld SOT
20
NO
YES
NO
YES
150
YES
6 Ld SOT
1 Tx
0.25
YES
YES
YES
YES
150
YES
8 Ld TDFN
ISL3297E
1 Tx
0.5
YES
YES
YES
YES
150
YES
8 Ld TDFN
ISL3298E
1 Tx
20
NO
YES
YES
YES
150
YES
8 Ld TDFN
PART
NUMBER
FUNCTION
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
ISL3293E
1 Tx
0.25
YES
ISL3294E
1 Tx
0.5
ISL3295E
1 Tx
ISL3296E
December 11, 2014
FN6544.1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2007, 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Pin Configurations
ISL3296E, ISL3297E, ISL3298E
(8 LD TDFN)
TOP VIEW
ISL3293E, ISL3294E, ISL3295E
(6 LD SOT-23)
TOP VIEW
DI 1
VCC
D
2
DE 3
6
Y
5
GND
4
Z
8
VCC
7
Z
3
6
Y
4
5
GND
VL
1
DE
2
DI
GND
D
NOTE: BOTH GND PINS MUST BE CONNECTED
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP.
(Note 4) RANGE (°C)
Truth Tables
PACKAGE
Tape and Reel
(RoHS
Compliant)
TRANSMITTING
PKG.
DWG. #
ISL3293EFHZ-T
293F
-40 to +125 6 Ld SOT-23
P6.064
ISL3293EIHZ-T
293I
-40 to +85 6 Ld SOT-23
P6.064
ISL3294EFHZ-T
294F
-40 to +125 6 Ld SOT-23
P6.064
ISL3294EIHZ-T
294I
-40 to +85 6 Ld SOT-23
P6.064
ISL3295EFHZ-T
295F
-40 to +125 6 Ld SOT-23
P6.064
ISL3295EIHZ-T
295I
-40 to +85 6 Ld SOT-23
P6.064
ISL3296EFRTZ-T
96F
-40 to +125 8 Ld TDFN
L8.2x3A
ISL3296EIRTZ-T
96I
-40 to +85 8 Ld TDFN
L8.2x3A
ISL3297EFRTZ-T
97F
-40 to +125 8 Ld TDFN
L8.2x3A
ISL3297EIRTZ-T
97I
-40 to +85 8 Ld TDFN
L8.2x3A
ISL3298EFRTZ-T
98F
-40 to +125 8 Ld TDFN
L8.2x3A
ISL3298EIRTZ-T
98I
-40 to +85 8 Ld TDFN
L8.2x3A
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pbfree material sets, molding compounds/die attach materials, and
100% matte tin plate plus anneal (e3 termination finish, which is
RoHS compliant and compatible with both SnPb and Pb-free soldering
operations). Intersil Pb-free products are MSL classified at Pb-free
peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see product information
page for ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E,
ISL3298E. For more information on MSL, please see tech brief TB363.
4. SOT-23 “PART MARKING” is branded on the bottom side.
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2
INPUTS
OUTPUTS
DE (Note 11)
DI
Z
Y
1
1
0
1
1
0
1
0
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode
Pin Descriptions
PIN
NAME
FUNCTION
DE
Driver output enable. The driver outputs, Y and Z, are enabled by
bringing DE high, and are high impedance when DE is low. If the
driver enable function isn’t needed, connect DE to VCC (or VL)
through a 1kΩ to 3kΩ resistor.
DI
Driver input. A low on DI forces output Y low and output Z high.
Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection. This is also the potential of the TDFN
thermal pad.
Y
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, noninverting transmitter output.
Z
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, inverting transmitter output.
VCC
System power supply input (3.0V to 5.5V). On devices with a VL
pin powered from a separate supply, power-up VCC first.
VL
Logic-Level supply which sets the VIL/VIH levels for the DI and DE
pins (ISL3296E, ISL3297E, ISL3298E only). If VL and VCC are
different supplies, power-up this supply after VCC, and keep
VL ≤ VCC.
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Typical Operating Circuits
NETWORK WITH ENABLES
+3.3V TO 5V
+3.3V
+
1
0.1µF
0.1µF
+
2
VCC
VCC
ISL3281E
3 RO
R
ISL329xE
A
6
B
4
RT
6
Y
4
Z
D
5 RE
DI 1
DE 3
GND
GND
2
5
NETWORK WITHOUT ENABLE
+3.3V TO 5V
+3.3V
+
1
VCC
0.1µF
0.1µF
+
2
R
3
VCC
ISL3280E
3 RO
1k TO 3kΩ Note 10
ISL329xE
A
5
B
4
RT
6
Y
4
Z
DE
D
GND
GND
2
5
DI 1
NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
2.5V
+3.3V TO 5V
+3.3V
+
4
VCC
6
VL
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
0.1µF
0.1µF
8
R
1
VL
VCC
ISL3282E
1 RO
1.8V
+
ISL3298E
A
5
B
8
RT
6
Y
7
Z
D
7 RE
DE 2
GND
2
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DI 3
3
NOTE: IF POWERED FROM SEPARATE SUPPLIES,
POWER-UP VCC BEFORE VL
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
GND
4, 5
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
VL to GND (ISL3296E thru ISL3298E Only) . . . . . . . . -0.3V to (VCC + 0.3V)
Input Voltages
DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V
Short Circuit Duration
Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Y, Z (VCC > 3.6V, Note 13) . . . . . . . . . . . . . . . . . . . . . . . . . 1s at 3.6V (Note 13)
Full
-
-
±450
mA
Full
-
160
-
°C
Full
-
120
150
µA
DE = 0V, DI = 0V or VCC
Full
-
0.01
1
µA
Human Body Model, from bus pins to GND
25
-
±16.5
-
kV
IEC61000 Contact, from bus pins to GND
25
-
±7
-
kV
Driver Short-Circuit Current,
VO = High or Low (Note 9)
IOSD1
Thermal Shutdown Threshold
TSD
SUPPLY CURRENT
No-Load Supply Current
ICC
Shutdown Supply Current
ISHDN
DI = 0V or VCC
DE = VCC
ESD PERFORMANCE
RS-485 Pins (Y, Z)
All Pins
HBM, per MIL-STD-883 Method 3015
25
-
±8
-
kV
Machine Model
25
-
±400
-
V
DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps)
Maximum Data Rate
Driver Single-ended Output
Delay
fMAX
VOD = ±1.5V, CD = 820pF (Figure 4)
Full
250
-
-
kbps
tSD
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
400
1350
1700
ns
Part-to-Part Output Delay Skew
tSKPP
RDIFF = 54Ω, CD = 50pF (Figure 2, Note 10)
Full
-
-
900
ns
Driver Single-ended Output
Skew
tSSK
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
-
600
750
ns
Driver Differential Output Delay
tDD
RDIFF = 54Ω CD = 50pF (Figure 2)
Full
400
1100
1500
ns
Driver Differential Output Skew
tDSK
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
-
4, 1
30
ns
Driver Differential Rise or Fall
Time
tR, tF
RDIFF = 54Ω,
CD = 50pF (Figure 2)
Full
400
960
1500
ns
25
-
1300
-
ns
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
100, 60
250
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
60, 35
250
ns
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
30, 22
60
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
25, 20
60
ns
VCC ≤ 3.6V
VCC = 5V
DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps)
Maximum Data Rate
Driver Single Ended Output
Delay
fMAX
VOD = ±1.5V, CD = 820pF (Figure 4)
Full
500
-
-
kbps
tSD
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
200
340
500
ns
-
-
300
ns
Part-to-Part Output Delay Skew
tSKPP
RDIFF = 54Ω, CD = 50pF (Figure 2, Note 10)
Full
Driver Single Ended Output Skew
tSSK
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
-
30, 80
150
ns
Driver Differential Output Delay
tDD
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
200
345
500
ns
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5
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Electrical SpecificationsTest Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C;
Unless Otherwise Specified. (Note 8) (Continued)
TEMP
(°C)
MIN
(Note 12)
TYP
(Note 14)
MAX
(Note 12)
UNITS
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
-
2
30
ns
RDIFF = 54Ω, CD = 50pF (Figure 2)
Full
200
350
800
ns
RL = 500Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
100, 60
250
ns
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
60, 35
250
ns
PARAMETER
SYMBOL
TEST CONDITIONS
Driver Differential Output Skew
tDSK
Driver Differential Rise or Fall
Time
tR, tF
Driver Enable to Output High
tZH
Driver Enable to Output Low
tZL
Driver Disable from Output High
tHZ
RL = 500Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
30, 22
60
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
25, 20
60
ns
VOD = ±1.5V, CD = 360pF (Figure 4)
Full
20
-
-
Mbps
RDIFF = 54Ω,
CD = 50pF (Figure 2)
VL = VCC
Full
15
29, 23
42
ns
VL ≥ 1.8V
25
-
32
-
ns
DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps)
Maximum Data Rate
fMAX
Driver Single Ended Output
Delay
tSD
VL = 1.5V
25
-
36
-
ns
VL = 1.35V
25
-
40
-
ns
Part-to-Part Output Delay Skew
tSKPP
RDIFF = 54Ω, CD = 50pF (Figure 2, Note 10)
Full
-
-
25
ns
Driver Single Ended Output Skew
tSSK
RDIFF = 54Ω,
CD = 50pF (Figure 2)
Full
-
3
7
ns
VL ≥ 1.8V
25
-
3
-
ns
VL = 1.5V
25
-
4
-
ns
VL = 1.35V
25
-
5
-
ns
VL = VCC
Full
-
29, 22
42
ns
VL ≥ 1.8V
25
-
32
-
ns
VL = 1.5V
25
-
36
-
ns
VL = 1.35V
25
-
42
-
ns
VL = VCC≤ 3.6V
Full
-
0.5
3
ns
VL = VCC= 5V
25
-
2
-
ns
VL ≥ 1.8V
25
-
0.5, 1
-
ns
VL ≥ 1.5V
25
-
1, 2
-
ns
VL = 1.35V
25
-
2, 4
-
ns
VL = VCC
Full
-
9
15
ns
VL ≥ 1.35V
25
-
9
-
ns
Driver Differential Output Delay
tDD
Driver Differential Output Skew
tDSK
RDIFF = 54Ω,
CD = 50pF (Figure 2)
RDIFF = 54Ω,
CD = 50pF (Figure 2)
RDIFF = 54Ω,
CD = 50pF (Figure 2)
VL = VCC
Driver Differential Rise or Fall
Time
tR, tF
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND (Figure 3)
Full
-
100, 60
250
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
60, 35
250
ns
Driver Disable from Output High
tHZ
RL = 500Ω CL = 50pF, SW = GND (Figure 3)
Full
-
30, 22
60
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3)
Full
-
25, 20
60
ns
NOTES:
8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
9. Applies to peak current. See “Typical Performance Curves” on page 11 for more information.
10. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.).
11. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor.
12. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
13. Due to the high short circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent
excessive power dissipation that may damage the output, the short circuit current should be limited to ≤ 300mA during testing. It is best to use an
external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output.
14. Typicals are measured at VCC = 3.3V for parameters specified with 3V ≤ VCC ≤3.6V, and are measured at VCC = 5V for parameters specified with 4.5V
≤ VCC ≤ 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to
VCC = 3.3V and 5V, respectively.
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FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Test Circuits and Waveforms
VCC OR VL
RL/2
DE
DI
Z
DI
VOD
D
375Ω
DE
VCC OR VL
Z
Y
VCM
RL = 60Ω
VOD
D
-7V TO +12V
Y
VOC
RL/2
375Ω
FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1A. VOD AND VOC
FIGURE 1. DC DRIVER TEST CIRCUITS
3V OR VL
DI
50%
50%
0V
VCC OR VL
tSD2
tSD1
DE
VOH
OUT (Z)
Z
DI
RDIFF
D
50%
CD
50%
VOL
OUT (Y)
Y
tDDLH
SIGNAL
GENERATOR
DIFF OUT (Y - Z)
tDDHL
90%
50%
10%
tR
-VOD
tF
tDSK = |tDDLH - tDDHL|
tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)|
FIGURE 2A. TEST CIRCUIT
+VOD
90%
50%
10%
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
DI
SIGNAL
GENERATOR
Z
500
VCC
D
SW
Y
3V OR VL
DE
50%
GND
50%
0V
50pF
tZH
OUTPUT HIGH
OUTPUT
DI
SW
tHZ
Y/Z
1/0
GND
tLZ
Y/Z
0/1
VCC
tZH
Y/Z
1/0
GND
tZL
Y/Z
0/1
VCC
VOH - 0.25V
50%
OUT (Y, Z)
PARAMETER
tHZ
0V
tZL
tLZ
VCC
OUT (Y, Z)
50%
OUTPUT LOW
FIGURE 3A. TEST CIRCUIT
VOH
VOL + 0.25V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
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7
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Test Circuits and Waveforms (Continued)
VCC OR VL
3V OR VL
DE
+
Z
DI
54
D
Y
CD
DI
0V
VOD
-
SIGNAL
GENERATOR
+VOD
DIFF OUT (Y - Z)
-VOD
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. DRIVER DATA RATE
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8
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transmitters and receivers are also RS-422 compliant. RS-422
is a point-to-multipoint (multidrop) standard, which allows only
one driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any combination
of drivers and receivers) on each bus. To allow for multipoint
operation, the RS-485 specification requires that drivers must
handle bus contention without sustaining any damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long
as 4000’, so the wide CMR is necessary to handle ground
potential differences, as well as voltages induced in the cable
by external fields.
VCC = +3.3V
DI
DE
GND
The 250kbps and 500kbps driver outputs are slew rate limited
to minimize EMI, and to reduce reflections in unterminated or
improperly terminated networks. Outputs of the ISL3295E and
ISL3298E drivers are not limited, so faster output transition
times allow data rates of at least 20Mbps.
Wide Supply Range
The ISL3293E through ISL3298E are optimized for 3.3V
operation, but can be operated with supply voltages as high
as 5.5V. These devices meet the RS-422 and RS-485
specifications for supply voltages less than 4V, and are
RS-422 and RS-485 compatible for supplies greater than 4V.
Operation at +125°C requires VCC ≤ 3.6V, while 5V operation
requires adding output current limiting resistors (as
described in the “Driver Overload Protection” on page 10) if
output short circuits (e.g., from bus contention) are a
possibility.
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD nor parasitic diodes to
VCC (nor to VL), so they withstand input voltages exceeding
5.5V regardless of the VCC and VL voltages.
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9
VOH 2V
VIH 2V
VOH 2V
TXD
DEN
GND
UART/PROCESSOR
VCC = +3.3V
VCC = +2V
VL
DI
DE
All drivers are tri-statable via the active high DE input. If the Tx
enable function isn’t needed, tie DE to VCC (or VL) through a
1kΩ to 3kΩ resistor.
VIH 2V
ISL3293E
Driver Features
These RS-485/RS-422 drivers are differential output devices
that delivers at least 1.5V across a 54Ω load (RS-485), and at
least 2V across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width, and to
minimize EMI.
VCC = +2V
GND
ISL3296E
VIH = 1.4V
TXD
VOH 2V
VIH = 1.4V
VOH 2V
DEN
GND
UART/PROCESSOR
FIGURE 5. USING VL PIN TO ADJUST LOGIC LEVELS
Logic Supply (VL Pin, ISL3296E through
ISL3298E)
Note: If powered from separate supplies, power-up VCC before
powering up the VL supply, and keep VL ≤ VCC.
The ISL3296E through ISL3298E include a VL pin that powers
the logic inputs (DI and DE). These pins interface with “logic”
devices such as UARTs, ASICs, and µcontrollers, and today
most of these devices use power supplies significantly lower
than 3.3V. Thus, the logic device’s low VOH might not exceed
the VIH of a 3.3V or 5V powered DI or DE input. Connecting the
VL pin to the power supply of the logic device (as shown in
Figure 5) reduces the DI and DE input switching points to
values compatible with the logic device’s output levels.
Tailoring the logic pin input switching points and output levels
to the supply voltage of the UART, ASIC, or µcontroller
eliminates the need for a level shifter/translator between the
two ICs.
VL can be anywhere from VCC down to 1.35V, but the input
switching points may not provide enough noise margin, and
20Mbps data rates may not be achievable, when VL < 1.5V.
Table 2 indicates typical VIH and VIL values for various VL
settings so the user can ascertain whether or not a particular
VL voltage meets his needs.
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V
VL (V)
VIH (V)
VIL (V)
1.35
0.7
0.4
1.5
0.8
0.5
1.8
0.9
0.7
2.3
1.1
1.0
2.7
1.3
1.1
3.3
1.5
1.4
5.0 (i.e., VCC)
2.7
2.3
The VL supply current (IL) is typically much less than 20µA, as
shown in Figure 9, when DE and DI are above/below VIH/VIL.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
line (DE) is unable to ensure that the RS-485 Tx outputs are
kept disabled. If the equipment is connected to the bus, a
driver activating prematurely during power-up may crash the
bus. To avoid this scenario, the ISL329xE family incorporates a
“Hot Plug” function. During power-up, circuitry monitoring VCC
ensures that the Tx outputs remain disabled for a period of time,
regardless of the state of DE. This gives the processor/ASIC a
chance to stabilize and drive the RS-485 control lines to the
proper states.
ESD Protection
All pins on these devices include class 3 (8kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs) incorporate advanced structures allowing
them to survive ESD events in excess of ±16.5kV HBM and
±7kV to the IEC61000 contact test method. The RS-485 pins
are particularly vulnerable to ESD damage because they
typically connect to an exposed port on the exterior of the
finished product. Simply touching the port pins, or connecting
a cable, can cause an ESD event that might destroy
unprotected ICs. These new ESD structures protect the device
whether or not it is powered up and without degrading the
RS-485 common mode range of -7V to +12V. This built-in
ESD protection eliminates the need for board level protection
structures (e.g., transient suppression diodes) and the
associated, undesirable capacitive load they present.
Data Rate, Cables and Terminations
RS-485/RS-422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
versions can operate at full data rates with lengths of several
1000’.
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
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10
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi receiver applications, stubs
connecting receivers to the main cable should be kept as short
as possible. Multipoint (multi driver) systems require that the
main cable be terminated in its characteristic impedance at
both ends. Stubs connecting a transmitter or receiver to the
main cable should be kept as short as possible.
Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
drivers meet this requirement, for VCC ≤ 3.6V, via driver output
short circuit current limits, and on-chip thermal shutdown
circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 specification, for VCC ≤ 3.6V, even at the
common mode voltage range extremes. Additionally, these
devices utilize a foldback circuit which reduces the short circuit
current, and thus the power dissipation, whenever the
contending voltage exceeds either VCC or GND.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature drops
about +20°C. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
At VCC > 3.6V, the instantaneous short circuit current is high
enough that output stage damage may occur during short
circuit conditions to voltages outside of GND to VCC, before the
short circuit limiting and thermal shutdown activate. For
VCC = 5V operation, if output short circuits are a possibility
(e.g., due to bus contention), it is recommended that a 5Ω
resistor be inserted in series with each output. This resistor
limits the instantaneous current below levels that can cause
damage. The driver VOD at VCC = 5V is so large that this small
added resistance has little impact.
High Temperature Operation
Due to power dissipation and instantaneous output short
circuit current levels at VCC = 5V, these transmitters may not
be operated at +125°C with VCC > 3.6V.
At VCC = 3.6V, even the SOT-23 versions may be operated at
+125°C, while driving a 100’, double terminated, CAT 5 cable
at 20Mbps, without triggering the thermal SHDN circuit.
Low Power Shutdown Mode
These BiCMOS transmitters all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC to
a 1µA trickle. These devices enter shutdown whenever the
driver disables (DE = GND).
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves
VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified
2.4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
110
100
90 +85°C
80
+25°C
70
+125°C
60
50
40
30
20
10
0
+25°C
0
0.5
1.0
1.5
2.0
2.5
3.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.3
RDIFF = 100Ω
2.2
2.1
2.0
RDIFF = 54Ω
1.9
1.8
1.7
1.6
1.5
-40
3.5
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
10
-15
60
35
TEMPERATURE (°C)
110 125
85
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
100
40
90
35
VCC = 3.3V
VL = 3.3V
80
30
25
60
IL (µA)
ICC (µA)
70
50
40
20
15
VL = 2.5V
30
10
20
5
10
0
VL 2V
DE = VCC = VL
-40
-15
10
35
60
85
TEMPERATURE (°C)
FIGURE 8. SUPPLY CURRENT vs TEMPERATURE
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110 125
0
0
1
2
3
4
5
6
7 7.5
DI VOLTAGE (V)
FIGURE 9. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves
VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
1250
700
VL = 1.35V TO VCC
tDDLH
600
tSSK
1200
500
tDDHL
1175
SKEW (ns)
PROPAGATION DELAY (ns)
1225
1150
1125
400
VL = 1.35V TO VCC
300
200
1100
100
1075
tDSK
1050
-40
10
-15
35
60
85
0
110 125
-40
-15
10
TEMPERATURE (°C)
FIGURE 10. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3293E, ISL3296E)
60
85
110 125
FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL3293E,
ISL3296E)
60
390
VL = 1.35V to VCC
VL = 1.35V TO VCC
380
50
370
40
SKEW (ns)
PROPAGATION DELAY (ns)
35
TEMPERATURE (°C)
360
tSSK
30
20
350
tDDHL
340
10
tDDLH
330
-40
-15
tDSK
10
35
60
85
0
-40
110 125
-15
10
35
60
85
110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3294E, ISL3297E)
FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL3294E,
ISL3297E)
4.5
50
4.0
40
VL = 1.35V, tDDLH
3.5
VL = 1.35V, tDDHL
3.0
VL = 1.5V, tDDLH, tDDHL
SKEW (ns)
PROPAGATION DELAY (ns)
45
35
30
VL = 1.8V, tDDLH, tDDHL
VL = 1.35V
2.5
2.0
1.5
VL = 1.5V
1.0
25
20
-40
VL = VCC, tDDLH, tDDHL
-15
10
0.5
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL3295E, ISL3298E)
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12
0
-40
VL 1.8V
-15
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL3295E, ISL3298E)
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Typical Performance Curves
VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
200
6
ISL3295E/ISL3298E
VL = 1.35V
150
5
OTHER ISL329xE
OUTPUT CURRENT (mA)
VL = 1.5V
3
VL 1.8V
2
1
Y OR Z = LOW
50
0
-50
Y OR Z = HIGH
-100
-150
-15
10
35
60
85
110 125
ISL329xE
-7 -6
-4
-2
TEMPERATURE (°C)
0
3.0
1.5
Z
Y
0
DRIVER OUTPUT (V)
3
2
1
Y-Z
0
DRIVER OUTPUT (V)
DI
DRIVER INPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
3
-1
-2
-3
Z
0
DRIVER OUTPUT (V)
3
2
1
0
DRIVER OUTPUT (V)
0
DRIVER INPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
3
Y
Y-Z
-1
-2
-3
TIME (200ns/DIV)
FIGURE 20. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3294E, ISL3297E)
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3
DI
0
3.0
1.5
Y
Z
0
3
2
1
0
Y-Z
-1
-2
-3
FIGURE 19. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3293E, ISL3296E)
RDIFF = 54Ω, CD = 50pF
1.5
12
TIME (400ns/DIV)
FIGURE 18. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3293E, ISL3296E)
3.0
10
RDIFF = 54Ω, CD = 50pF
TIME (400ns/DIV)
DI
8
FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 16. DRIVER SINGLE ENDED SKEW vs TEMPERATURE
(ISL3295E, ISL3298E)
RDIFF = 54Ω, CD = 50pF
0
2
4
6
OUTPUT VOLTAGE (V)
DRIVER INPUT (V)
0
-40
RDIFF = 54Ω, CD = 50pF
3
DI
0
3.0
1.5
Y
Z
DRIVER INPUT (V)
SKEW (ns)
4
100
0
3
2
1
0
-1
-2
-3
Y-Z
TIME (200ns/DIV)
FIGURE 21. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3294E, ISL3297E)
FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
0
3.0
1.5
Z
Y
0
3
2
1
Y-Z
0
-1
-2
-3
0
3.0
1.5
Y
Z
0
3
2
1
Y-Z
0
-1
-2
-3
TIME (10ns/DIV)
TIME (10ns/DIV)
DI
0
3.0
1.5
Z
Y
0
3
2
1
0
Y-Z
-1
-2
-3
TIME (10ns/DIV)
FIGURE 24. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3295E, ISL3298E)
DRIVER OUTPUT (V)
3
DRIVER INPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RDIFF = 54Ω CD = 50pF
DRIVER OUTPUT (V)
FIGURE 23. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3295E, ISL3298E)
FIGURE 22. DRIVER WAVEFORMS, LOW-TO-HIGH
(ISL3295E, ISL3298E)
VL = 1.35V
3
DI
RDIFF = 54Ω, CD = 50pF
VL = 1.35V
3
DI
0
3.0
1.5
Y
Z
DRIVER INPUT (V)
DI
RDIFF = 54Ω, CD = 50pF
DRIVER INPUT (V)
3
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
DRIVER INPUT (V)
VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
Typical Performance Curves
0
3
2
1
0
-1
-2
-3
Y-Z
TIME (10ns/DIV)
FIGURE 25. DRIVER WAVEFORMS, HIGH-TO-LOW
(ISL3295E, ISL3298E)
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
516
PROCESS:
Si Gate BiCMOS
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FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
December 11, 2014
FN6544.1
Updated entire datasheet to Intersil new standard.
Added text in several places to clarify that VL can be connected to Vcc.
Updated PODs P6.064 and L8.2x3A to latest revisions with changes as follows:
Updated to new POD format by removing table listing dimensions and moving dimensions onto drawing.
Added Typical Recommended Land Pattern.
September 19, 2007
FN6544.0
Initial Release
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Package Outline Drawing
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 4, 2/10
0-8°
1.90
0.95
0.08-0.22
D
A
6
5
4
2.80
PIN 1
INDEX AREA
1.60 +0.15/-0.10
3
3
(0.60)
1
2
3
0.20 C
2x
0.40 ±0.10
B
SEE DETAIL X
3
0.20 M C A-B D
END VIEW
TOP VIEW
10° TYP
(2 PLCS)
2.90 ±0.10
3
1.15 +0.15/-0.25
C
0.10 C
SEATING PLANE
0.00-0.15
SIDE VIEW
(0.25)
GAUGE
PLANE
1.45 MAX
DETAIL "X"
0.45±0.1
4
(0.95)
(0.60)
(1.20)
(2.40)
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
Package conforms to JEDEC MO-178AB.
TYPICAL RECOMMENDED LAND PATTERN
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FN6544.1
December 11, 2014
ISL3293E, ISL3294E, ISL3295E ISL3296E, ISL3297E, ISL3298E
Package Outline Drawing
L8.2x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD
Rev 1, 06/09
0.25
B
0.50
2.20
6
PIN 1
INDEX AREA
(4X)
6
PIN #1 INDEX AREA
3.00
A
1.80 +0.1/ -0.15
2.00
0.15
(8x0.40)
1.65 +0.1/ -0.15
TOP VIEW
BOTTOM VIEW
(8x0.25)
PACKAGE
OUTLINE
(6x0.50)
0.75
SEE DETAIL "X"
SIDE VIEW
1.80
3.00
0.05
(8x0.40)
1.65
C
0.20 REF
C
BASE PLANE
SEATING PLANE
0.08 C
5
(8x0.20)
0.05
2.00
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.32mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
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FN6544.1
December 11, 2014
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