DATASHEET
ISL3295E, ISL3298E
FN6544
Rev.4.00
Oct 9, 2019
±16.5kV ESD Protected, +125°C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low
Power, RS-485/RS-422 Transmitters
The ISL3295E and ISL3298E are ±16.5kV HBM ESD Protected
(7kV IEC61000 contact), 3.0V to 5.5V powered, single
transmitters for balanced communication using the RS-485
and RS-422 standards. These drivers have very low output
leakage current (±40µA), so they present less than a “1/8 unit
load” to the RS-485 bus. This allows more than 256
transmitters on the network without violating the RS-485
specification’s 32 unit load maximum, and without using
repeaters.
Features
Hot Plug circuitry ensures that the Tx outputs remain in a high
impedance state while the power supply stabilizes.
• Hot plug - Tx outputs remain three-state during power-up
Drivers on the ISL3295E and ISL3298E are not limited, so they
can achieve the 20Mbps data rate. They are offered in industrial
and extended industrial (-40°C to +125°C) temperature
ranges.
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
A 26% smaller footprint is available with the ISL3298E TDFN
package. This device also features a logic supply pin (VL) that
sets the switching points of the DE and DI inputs to be
compatible with a lower supply voltage in mixed voltage
systems.
• -7V to +12V common-mode output voltage range
(VCC ≤ 3.6V only)
For companion single RS-485 receivers in micro packages,
please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E,
ISL3284E datasheet.
• 5V tolerant logic inputs when VCC ≤5V
Related Literature
Applications
For a full list of related documents, visit our website
• Clock distribution
• ISL3295E and ISL3298E device pages
• High node count systems
• High ESD protection on RS-485 outputs . . . . ±16.5kV HBM
- IEC61000-4-2 contact test method . . . . . . . . . . . . . . . ±7kV
- Class 3 ESD level on all other pins. . . . . . . . . . . .>8kV HBM
• Specified for +125°C operation (VCC ≤ 3.6V only)
• Logic supply pin (VL) eases operation in mixed supply
systems (ISL3298E only)
• Low Tx leakage allows >256 devices on the bus
• Low quiescent supply current. . . . . . . . . . . . . . . 150µA (max)
- Very low shutdown supply current . . . . . . . . . . . 1µA (max)
• Current limiting and thermal shutdown for driver overload
protection (VCC ≤ 3.6V only)
• Tri-statable Tx outputs
• Pb-free (RoHS compliant)
• Space constrained systems
• Security camera networks
• Building environmental control/lighting systems
• Industrial/process control networks
TABLE 1. SUMMARY OF FEATURES
PART NUMBER
TX
MAXIMUM
DATA
RATE SLEW RATE HOT
VL ENABLE? QUIESCENT LOW POWER
ICC (µA)
SHUTDOWN?
FUNCTION (Mbps) LIMITED? PLUG? PIN? (Note 11)
PIN
COUNT
ISL3295E
1 Tx
20
NO
YES
NO
YES
150
YES
6 Ld SOT
ISL3298E
1 Tx
20
NO
YES
YES
YES
150
YES
8 Ld TDFN
FN6544 Rev.4.00
Oct 9, 2019
Page 1 of 17
ISL3295E, ISL3298E
Pin Configurations
ISL3298E
(8 LD TDFN)
TOP VIEW
ISL3295E
(6 LD SOT-23)
TOP VIEW
DI
1
VCC
2
DE
3
D
6
Y
VL
1
8
VCC
5
GND
DE
2
7
Z
4
Z
DI
3
6
Y
GND
4
5
GND
D
NOTE: BOTH GND PINS MUST BE CONNECTED
Truth Tables
Pin Descriptions
TRANSMITTING
INPUTS
PIN
NAME
OUTPUTS
DE (Note 11)
DI
Z
Y
1
1
0
1
1
0
1
0
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode
FN6544 Rev.4.00
Oct 9, 2019
FUNCTION
DE
Driver output enable. The driver outputs, Y and Z, are enabled by
bringing DE high, and are high impedance when DE is low. If the
driver enable function isn’t needed, connect DE to VCC (or VL)
through a 1kΩ to 3kΩ resistor.
DI
Driver input. A low on DI forces output Y low and output Z high.
Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection. This is also the potential of the TDFN
thermal pad.
Y
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, noninverting transmitter output.
Z
±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected
RS-485/422 level, inverting transmitter output.
VCC
System power supply input (3.0V to 5.5V). On devices with a VL
pin powered from a separate supply, power-up VCC first.
VL
Logic-level supply which sets the VIL/VIH levels for the DI and DE
pins (ISL3298E only). If VL and VCC are different supplies,
power-up this supply after VCC, and keep VL ≤ VCC.
Page 2 of 17
ISL3295E, ISL3298E
Ordering Information
PART NUMBER
(Notes 1, 3)
PART MARKING
(Note 4)
TEMP. RANGE
(°C)
TAPE AND REEL
(UNITS) (Note 2)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
ISL3295EFHZ-T
295F
-40 to +125
3k
6 Ld SOT-23
P6.064
ISL3295EFHZ-T7A
295F
-40 to +125
250
6 Ld SOT-23
P6.064
ISL3295EIHZ-T
295I
-40 to +85
3k
6 Ld SOT-23
P6.064
ISL3295EIHZ-T7A
295I
-40 to +85
250
6 Ld SOT-23
P6.064
ISL3298EFRTZ-T
98F
-40 to +125
6k
8 Ld TDFN
L8.2x3A
NOTES:
1. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate
plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J-STD-020.
2. See TB347 for details about reel specifications.
3. For Moisture Sensitivity Level (MSL), see the ISL3295E and ISL3298E device pages. For more information about MSL, see TB363.
4. SOT-23 “PART MARKING” is branded on the bottom side.
FN6544 Rev.4.00
Oct 9, 2019
Page 3 of 17
ISL3295E, ISL3298E
Typical Operating Circuits
+3.3V TO 5V
+3.3V
+
1
VCC
0.1µF
0.1µF
+
2
VCC
ISL3281E
3 RO
R
ISL329xE
A
6
B
4
RT
6
Y
4
Z
D
5 RE
DI 1
DE 3
GND
GND
2
5
FIGURE 1. NETWORK WITH ENABLES
+3.3V TO 5V
+3.3V
+
1
0.1µF
0.1µF
+
2
VCC
R
3
VCC
ISL3280E
3 RO
1kΩ TO 3kΩ Note 10
ISL329xE
A
5
B
4
RT
6
Y
4
Z
DE
D
GND
GND
2
5
DI 1
FIGURE 2. NETWORK WITHOUT ENABLE
2.5V
+3.3V TO 5V
+3.3V
+
4
VCC
6
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
VL
0.1µF
0.1µF
8
R
1
VL
VCC
ISL3282E
1 RO
1.8V
+
ISL3298E
A
5
B
8
RT
6
Y
7
Z
D
7 RE
DI 3
DE 2
GND
2
NOTE: IF POWERED FROM SEPARATE SUPPLIES,
POWER-UP VCC BEFORE VL
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
GND
4, 5
FIGURE 3. NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
FN6544 Rev.4.00
Oct 9, 2019
Page 4 of 17
ISL3295E, ISL3298E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
VL to GND (ISL3298E Only) . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input Voltages
DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V
Short-circuit Duration
Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Y, Z (VCC > 3.6V, (Note 13). . . . . . . . . . . . . . . . . . . . . . . . . 1s at 3.6V (Note 13)
Full
-
-
±450
mA
Full
-
160
-
°C
Full
-
120
150
µA
DE = 0V, DI = 0V or VCC
Full
-
0.01
1
µA
Human Body Model, from bus pins to GND
25
-
±16.5
-
kV
IEC61000 Contact, from bus pins to GND
25
-
±7
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±8
-
kV
Machine Model
25
-
±400
-
V
VOD = ±1.5V, CD = 360pF (Figure 7)
Full
20
-
-
Mbps
RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC
Full
15
29, 23
42
ns
VL ≥ 1.8V
25
-
32
-
ns
VL = 1.5V
25
-
36
-
ns
VL = 1.35V
25
-
40
-
ns
Driver Short-circuit Current,
VO = High or Low (Note 9)
Thermal Shutdown Threshold
IOSD1
TSD
SUPPLY CURRENT
No-load Supply Current
Shutdown Supply Current
ICC
ISHDN
DI = 0V or VCC
DE = VCC
ESD PERFORMANCE
RS-485 Pins (Y, Z)
All Pins
DRIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
Driver Single-ended Output
Delay
fMAX
tSD
Part-to-part Output Delay Skew
tSKPP
RDIFF = 54Ω, CD = 50pF (Figure 5, Note 10)
Full
-
-
25
ns
Driver Single-ended Output
Skew
tSSK
RDIFF = 54Ω,
CD = 50pF (Figure 5)
VL = VCC
Full
-
3
7
ns
VL ≥ 1.8V
25
-
3
-
ns
VL = 1.5V
25
-
4
-
ns
VL = 1.35V
25
-
5
-
ns
VL = VCC
Full
-
29, 22
42
ns
VL ≥ 1.8V
25
-
32
-
ns
VL = 1.5V
25
-
36
-
ns
VL = 1.35V
25
-
42
-
ns
Driver Differential Output Delay
FN6544 Rev.4.00
Oct 9, 2019
tDD
RDIFF = 54Ω,
CD = 50pF (Figure 5)
Page 6 of 17
ISL3295E, ISL3298E
Electrical Specifications
Test Conditions: VCC = 3.0V to 5.5V, VL = VCC (ISL3298E only), typicals are at TA = +25°C, unless otherwise
specified. (Note 8) (Continued)
PARAMETER
SYMBOL
Driver Differential Output Skew
tDSK
TEMP
(°C)
MIN
(Note 12)
TYP
(Note 14)
MAX
(Note 12)
UNIT
VL = VCC ≤ 3.6V
Full
-
0.5
3
ns
VL = VCC = 5V
25
-
2
-
ns
VL ≥ 1.8V
25
-
0.5, 1
-
ns
VL ≥ 1.5V
25
-
1, 2
-
ns
VL = 1.35V
25
-
2, 4
-
ns
VL = VCC
Full
-
9
15
ns
VL ≥ 1.35V
25
-
9
-
ns
TEST CONDITIONS
RDIFF = 54Ω,
CD = 50pF (Figure 5)
Driver Differential Rise or Fall
Time
tR, tF
Driver Enable to Output High
tZH
RL = 500Ω, CL = 50pF, SW = GND (Figure 6)
Full
-
100, 60
250
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
60, 35
250
ns
Driver Disable from Output High
tHZ
RL = 500Ω CL = 50pF, SW = GND (Figure 6)
Full
-
30, 22
60
ns
Driver Disable from Output Low
tLZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 6)
Full
-
25, 20
60
ns
RDIFF = 54Ω,
CD = 50pF (Figure 5)
NOTES:
8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
9. Applies to peak current. See “Typical Performance Curves” on page 11 for more information.
10. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (such as
VCC, temperature).
11. If the driver enable function is not needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor.
12. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
13. Due to the high short-circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent
excessive power dissipation that may damage the output, the short-circuit current should be limited to ≤300mA during testing. It is best to use an
external resistor for this purpose, because the current limiting on the VO supply may respond too slowly to protect the output.
14. Typicals are measured at VCC = 3.3V for parameters specified with 3V ≤ VCC ≤ 3.6V, and are measured at VCC = 5V for parameters specified with
4.5V ≤ VCC ≤ 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to
VCC = 3.3V and 5V, respectively.
Test Circuits and Waveforms
VCC OR VL
RL/2
DE
DI
VCC OR VL
Z
DI
VOD
D
Y
375Ω
DE
Z
VOD
D
Y
RL/2
FIGURE 4A. VOD AND VOC
VOC
RL = 60Ω
VCM
-7V TO +12V
375Ω
FIGURE 4B. VOD WITH COMMON-MODE LOAD
FIGURE 4. DC DRIVER TEST CIRCUITS
FN6544 Rev.4.00
Oct 9, 2019
Page 7 of 17
ISL3295E, ISL3298E
Test Circuits and Waveforms (Continued)
3V OR VL
DI
50%
50%
0V
VCC OR VL
tSD2
tSD1
DE
Z
DI
VOH
OUT (Z)
RDIFF
D
50%
CD
50%
VOL
OUT (Y)
Y
tDDLH
SIGNAL
GENERATOR
tDDHL
90%
50%
10%
DIFF OUT (Y - Z)
tR
-VOD
tF
tDSK = |tDDLH - tDDHL|
tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)|
FIGURE 5A. TEST CIRCUIT
+VOD
90%
50%
10%
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
500Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
3V OR VL
DE
50%
GND
50%
0V
50pF
tZH
OUTPUT HIGH
OUTPUT
DI
SW
tHZ
Y/Z
1/0
GND
tLZ
Y/Z
0/1
VCC
tZH
Y/Z
1/0
GND
tZL
Y/Z
0/1
VCC
VOH - 0.25V
50%
OUT (Y, Z)
PARAMETER
tHZ
VOH
0V
tZL
tLZ
VCC
OUT (Y, Z)
50%
OUTPUT LOW
FIGURE 6A. TEST CIRCUIT
VOL + 0.25V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER ENABLE AND DISABLE TIMES
VCC OR VL
DE
54Ω
D
3V OR VL
+
Z
DI
Y
SIGNAL
GENERATOR
CD
VOD
DI
0V
-
+VOD
DIFF OUT (Y - Z)
-VOD
0V
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7A. TEST CIRCUIT
FIGURE 7. DRIVER DATA RATE
FN6544 Rev.4.00
Oct 9, 2019
Page 8 of 17
ISL3295E, ISL3298E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transmitters and receivers are also RS-422 compliant. RS-422 is
a point-to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices) receivers on
each bus. RS-485 is a true multipoint standard, which allows up
to 32 one unit load devices (any combination of drivers and
receivers) on each bus. To allow for multipoint operation, the
RS-485 specification requires that drivers must handle bus
contention without sustaining any damage.
Another important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long as
4000’, so the wide CMR is necessary to handle ground potential
differences, as well as voltages induced in the cable by external
fields.
Driver Features
powered DI or DE input. Connecting the VL pin to the power
supply of the logic device (as shown in Figure 8) reduces the DI
and DE input switching points to values compatible with the logic
device’s output levels. Tailoring the logic pin input switching
points and output levels to the supply voltage of the UART, ASIC,
or µcontroller eliminates the need for a level shifter/translator
between the two ICs.
VCC = +3.3V
DI
DE
GND
The outputs of the ISL3295E and ISL3298E drivers are not slew
rate limited, so faster output transition times allow data rates of
at least 20Mbps.
Wide Supply Range
The ISL3295E and ISL3298E are optimized for 3.3V operation,
but can be operated with supply voltages as high as 5.5V. These
devices meet the RS-422 and RS-485 specifications for supply
voltages less than 4V, and are RS-422 and RS-485 compatible
for supplies greater than 4V. Operation at +125°C requires
VCC ≤ 3.6V, while 5V operation requires adding output current
limiting resistors (as described in the “Driver Overload
Protection” on page 10) if output short-circuits (for example,
from bus contention) are a possibility.
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD nor parasitic diodes to
VCC (nor to VL), so they withstand input voltages exceeding 5.5V
regardless of the VCC and VL voltages.
Logic Supply (VL Pin, ISL3298E)
Note: If powered from separate supplies, power-up VCC before
powering up the VL supply and keep VL ≤ VCC.
The ISL3298E includes a VL pin that powers the logic inputs (DI
and DE). This pin interfaces with “logic” devices such as UARTs,
ASICs, and µcontrollers, and today most of these devices use
power supplies significantly lower than 3.3V. Thus, the logic
device’s low VOH might not exceed the VIH of a 3.3V or 5V
FN6544 Rev.4.00
Oct 9, 2019
VIH ≥ 2V
TXD
VOH ≤ 2V
VIH ≥ 2V
VOH ≤ 2V
ISL3295E
DEN
GND
UART/PROCESSOR
VCC = +3.3V
These RS-485/RS-422 drivers are differential output devices that
delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V
across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width and to minimize
EMI.
All drivers are tri-statable via the active high DE input. If the Tx
enable function is not needed, tie DE to VCC (or VL) through a 1kΩ
to 3kΩ resistor.
VCC = +2V
VCC = +2V
VL
DI
DE
GND
VIH = 1.4V
TXD
VOH ≤ 2V
VIH = 1.4V
VOH ≤ 2V
ISL3298E
DEN
GND
UART/PROCESSOR
FIGURE 8. USING VL PIN TO ADJUST LOGIC LEVELS
VL can be anywhere from VCC down to 1.35V, but the input
switching points may not provide enough noise margin and
20Mbps data rates may not be achievable, when VL < 1.5V.
Table 2 indicates typical VIH and VIL values for various VL settings
so you can ascertain whether or not a particular VL voltage meets
his needs.
TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V
VL (V)
VIH (V)
VIL (V)
1.35
0.7
0.4
1.5
0.8
0.5
1.8
0.9
0.7
2.3
1.1
1.0
2.7
1.3
1.1
3.3
1.5
1.4
5.0 (i.e., VCC)
2.7
2.3
The VL supply current (IL) is typically much less than 20µA, as
shown in Figure 12 on page 11, when DE and DI are
above/below VIH/VIL.
Page 9 of 17
ISL3295E, ISL3298E
Hot Plug Function
Driver Overload Protection
When a piece of equipment powers up, there is a period of time
where the processor or ASIC driving the RS-485 control line (DE)
is unable to ensure that the RS-485 Tx outputs are kept disabled.
If the equipment is connected to the bus, a driver activating
prematurely during power-up can crash the bus. To avoid this
scenario, the ISL329xE family incorporates a “Hot Plug” function.
During power-up, circuitry monitoring VCC ensures that the Tx
outputs remain disabled for a period of time, regardless of the state
of DE. This gives the processor/ASIC a chance to stabilize and drive
the RS-485 control lines to the proper states.
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
drivers meet this requirement, for VCC ≤ 3.6V, via driver output
short-circuit current limits and on-chip thermal shutdown
circuitry.
ESD Protection
All pins on these devices include class 3 (8kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs) incorporate advanced structures allowing them
to survive ESD events in excess of ±16.5kV HBM and ±7kV to
the IEC61000 contact test method. The RS-485 pins are
particularly vulnerable to ESD damage because they typically
connect to an exposed port on the exterior of the finished
product. Simply touching the port pins, or connecting a cable,
can cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not it is
powered up and without degrading the RS-485 common-mode
range of -7V to +12V. This built-in ESD protection eliminates the
need for board level protection structures (such as transient
suppression diodes) and the associated, undesirable capacitive
load they present.
Data Rate, Cables and Terminations
The length of RS-485/RS-422 networks operating at 20Mbps is
limited to less than 100'. Twisted pair is the cable of choice for
RS-485/RS-422 networks. Twisted pair cables tend to pick up
noise and other electromagnetically induced voltages as
common-mode signals, which are effectively rejected by the
differential receivers in these ICs.
Proper termination is imperative to minimize reflections. In
point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multireceiver applications, stubs connecting
receivers to the main cable should be kept as short as possible.
Multipoint (multidriver) systems require that the main cable be
terminated in its characteristic impedance at both ends. Stubs
connecting a transmitter or receiver to the main cable should be
kept as short as possible.
FN6544 Rev.4.00
Oct 9, 2019
The driver output stages incorporate short-circuit current limiting
circuitry, which ensures that the output current never exceeds the
RS-485 specification, for VCC ≤ 3.6V, even at the common-mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short-circuit current and thus
the power dissipation, whenever the contending voltage exceeds
either VCC or GND.
In the event of a major short-circuit condition, devices also include
a thermal shutdown feature that disables the drivers whenever the
die temperature becomes excessive. This eliminates the power
dissipation, allowing the die to cool. The drivers automatically
reenable after the die temperature drops about +20°C. If the
contention persists, the thermal shutdown/reenable cycle repeats
until the fault is cleared.
At VCC > 3.6V, the instantaneous short-circuit current is high
enough that output stage damage can occur during short-circuit
conditions to voltages outside of GND to VCC, before the
short-circuit limiting and thermal shutdown activate. For
VCC = 5V operation, if output short-circuits are a possibility (for
example, due to bus contention), it is recommended that a 5Ω
resistor be inserted in series with each output. This resistor limits
the instantaneous current below levels that can cause damage.
The driver VOD at VCC = 5V is so large that this small added
resistance has little impact.
High Temperature Operation
Due to power dissipation and instantaneous output short-circuit
current levels at VCC = 5V, these transmitters may not be
operated at +125°C with VCC > 3.6V.
At VCC = 3.6V, even the SOT-23 versions may be operated at
+125°C, while driving a 100’, double terminated, CAT 5 cable at
20Mbps, without triggering the thermal SHDN circuit.
Low Power Shutdown Mode
These BiCMOS transmitters all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC to a
1µA trickle. These devices enter shutdown whenever the driver
disables (DE = GND).
Page 10 of 17
ISL3295E, ISL3298E
Typical Performance Curves
VCC = VL = 3.3V, TA = +25°C, unless otherwise specified.
DIFFERENTIAL OUTPUT VOLTAGE (V)
2.4
DRIVER OUTPUT CURRENT (mA)
240
220
200
VCC = 5V
180
160
140
120
100
VCC = 3.3V
80
60
40
20
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
RDIFF = 100Ω
2.2
2.1
2.0
RDIFF = 54Ω
1.9
1.8
1.7
1.6
1.5
-40
5.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
2.3
10
-15
60
35
TEMPERATURE (°C)
110 125
85
FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
40
100
VCC = 3.3V
35
90
VL = 3.3V
80
30
25
60
IL (µA)
ICC (µA)
70
50
40
20
15
30
VL = 2.5V
10
20
5
10
0
DE = VCC = VL
-40
-15
10
35
60
85
0
110 125
VL ≤ 2V
0
1
2
3
4
5
6
7 7.5
DI VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE
FIGURE 12. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE
50
4.5
4.0
40
VL = 1.35V, tDDLH
3.5
VL = 1.35V, tDDHL
3.0
VL = 1.5V, tDDLH, tDDHL
SKEW (ns)
PROPAGATION DELAY (ns)
45
35
30
VL = 1.8V, tDDLH, tDDHL
VL = 1.35V
2.5
2.0
1.5
VL = 1.5V
1.0
25
20
-40
VL = VCC, tDDLH, tDDHL
-15
10
0.5
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE
FN6544 Rev.4.00
Oct 9, 2019
0
-40
VL ≥ 1.8V
-15
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
Page 11 of 17
ISL3295E, ISL3298E
VCC = VL = 3.3V, TA = +25°C, unless otherwise specified. (Continued)
200
6
VL = 1.35V
150
VL = 1.5V
3
VL ≥ 1.8V
2
100
Y OR Z = LOW
50
0
-50
Y OR Z = HIGH
1
-100
-150
-15
10
35
60
85
110 125
-7 -6
-4
-2
TEMPERATURE (°C)
0
1.5
Z
Y
0
DRIVER OUTPUT (V)
3
2
1
Y-Z
0
DRIVER OUTPUT (V)
3
DRIVER INPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
3.0
-1
-2
-3
0
3.0
1.5
Y
Z
0
3
2
1
Y-Z
0
-1
-2
-3
TIME (10ns/DIV)
FIGURE 18. DRIVER WAVEFORMS, HIGH-TO-LOW
Z
Y
0
3
2
1
Y-Z
0
-1
-2
-3
TIME (10ns/DIV)
FIGURE 19. DRIVER WAVEFORMS, LOW-TO-HIGH
FN6544 Rev.4.00
Oct 9, 2019
DRIVER OUTPUT (V)
1.5
DRIVER OUTPUT (V)
3
DRIVER INPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RDIFF = 54Ω CD = 50pF
0
3.0
12
3
DI
TIME (10ns/DIV)
DI
10
RDIFF = 54Ω, CD = 50pF
FIGURE 17. DRIVER WAVEFORMS, LOW-TO-HIGH
VL = 1.35V
8
FIGURE 16. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT
VOLTAGE
FIGURE 15. DRIVER SINGLE-ENDED SKEW vs TEMPERATURE
DI
0
2
4
6
OUTPUT VOLTAGE (V)
DRIVER INPUT (V)
0
-40
RDIFF = 54Ω, CD = 50pF
VL = 1.35V
3
DI
0
3.0
1.5
Y
Z
0
3
2
1
0
-1
-2
-3
Y-Z
TIME (10ns/DIV)
FIGURE 20. DRIVER WAVEFORMS, HIGH-TO-LOW
Page 12 of 17
DRIVER INPUT (V)
SKEW (ns)
4
OUTPUT CURRENT (mA)
5
ISL3295E, ISL3298E
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
516
PROCESS:
Si Gate BiCMOS
FN6544 Rev.4.00
Oct 9, 2019
Page 13 of 17
ISL3295E, ISL3298E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
Oct 9, 2019
FN6544.4
Updated links throughout.
Removed ISL3293E, ISL3294E, ISL3296E, and ISL3297E information from document.
Updated Pin Configuration diagrams
Updated ordering information table by adding tape and reel quantity column and updating notes.
Updated Figure 9.
Removed About Intersil section
Updated Disclaimer.
Sep 25, 2015
FN6544.3
On page 1, table 1, for ISL3293E entry, added "Recommended replacement: ISL32613E" after "No longer
available or supported". For ISL3294E entry, added "Recommended replacement: ISL32614E" after "No
longer available or supported".
On page 3, "Ordering Information" table, for ISL3293E entries (rows 1 and 2), added "Recommended
replacement: ISL32613E" after "No longer available or supported". For ISL3294E entries (rows 3 and 4),
added "Recommended replacement: ISL32614E" after "No longer available or supported".
Jul 27, 2015
FN6544.2
Table 1 Summary of Features on page 1, added “No longer available or supported” to ISL3293E, ISL3294E,
ISL3296E, ISL3297E.
Ordering Information table on page 3, added “No longer available or supported” to the following parts:
ISL3293E and ISL3294E (1st 4 rows) and to ISL3296E and ISL3297E (rows 7-10).
Electrical Spec table, added “(Parts no longer available or supported)” to DRIVER SWITCHING
CHARACTERISTICS sections on page 6 (for parts ISL3293E, ISL3296E and ISL3294E, ISL3297E).
POD on page 16, updated from ref 1 to rev 2. Changes since rev 1:
Tiebar Note updated
From: Tiebar shown (if present) is a non-functional feature.
To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).
Dec 11, 2014
FN6544.1
Updated entire datasheet to Intersil new standard.
Added text in several places to clarify that VL can be connected to Vcc.
Updated PODs P6.064 and L8.2x3A to latest revisions with changes as follows:
Updated to new POD format by removing table listing dimensions and moving dimensions onto drawing.
Added Typical Recommended Land Pattern.
Sep 19, 2007
FN6544.0
Initial Release.
FN6544 Rev.4.00
Oct 9, 2019
Page 14 of 17
ISL3295E, ISL3298E
Package Outline Drawings
For the most recent package outline drawing, see P6.064.
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 4, 2/10
0-8°
1.90
0.95
0.08-0.22
D
A
6
5
4
2.80
PIN 1
INDEX AREA
1.60 +0.15/-0.10
3
3
(0.60)
1
2
3
0.20 C
2x
0.40 ±0.10
B
SEE DETAIL X
3
0.20 M C A-B D
END VIEW
TOP VIEW
10° TYP
(2 PLCS)
2.90 ±0.10
3
1.15 +0.15/-0.25
C
0.10 C
SEATING PLANE
0.00-0.15
SIDE VIEW
(0.25)
GAUGE
PLANE
1.45 MAX
DETAIL "X"
0.45±0.1
4
(0.95)
(0.60)
(1.20)
(2.40)
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
Package conforms to JEDEC MO-178AB.
TYPICAL RECOMMENDED LAND PATTERN
FN6544 Rev.4.00
Oct 9, 2019
Page 15 of 17
ISL3295E, ISL3298E
L8.2x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD
Rev 2, 05/15
0.25
0.50
2.20
6
PIN 1
INDEX AREA
(4X)
6
PIN #1 INDEX AREA
B
3.00
A
1.80 +0.1/ -0.15
2.00
For the most recent package outline drawing, see L8.2x3A.
0.15
(8x0.40)
1.65 +0.1/ -0.15
TOP VIEW
BOTTOM VIEW
(8x0.25)
PACKAGE
OUTLINE
(6x0.50)
0.75
SEE DETAIL "X"
SIDE VIEW
1.80
3.00
0.05
(8x0.40)
1.65
C
0.20 REF
C
BASE PLANE
SEATING PLANE
0.08 C
5
(8x0.20)
0.05
2.00
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.32mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
FN6544 Rev.4.00
Oct 9, 2019
Page 16 of 17
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