ISL4485EIB-T

DATASHEET ISL4485E FN6049 Rev 4.00 Oct 8, 2018 ±15kV ESD Protected, 20Mbps, 5V, Low Power, RS-485/RS-422 Transceiver Features The ISL4485E is a high speed, BiCMOS 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. Each driver output/receiver input is protected against ±15kV ESD strikes without latch-up. Unlike competitive devices, this device is specified for 10% tolerance supplies (4.5V to 5.5V). • Pb-free available (RoHS compliant) • High data rates . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • RS-485 I/O pin ESD protection . . . . . . . . . . . 15kV HBM - Class 3 ESD level on all other pins . . . . . . . >7kV HBM The excellent differential output voltage coupled with high drive-current output stages allow 20Mbps operation over twisted pair networks up to 450ft in length. The 25kΩ receiver input resistance presents a single unit load to the RS-485 bus, allowing up to 32 transceivers on the network. • Operates from a single +5V supply (10% tolerance) • 1 unit load allows up to 32 devices on the bus • Low quiescent current . . . . . . . . . . . . . . . . . . . . . . 700µA • -7V to +12V common-mode input voltage range The receiver (Rx) inputs feature a “fail-safe if open” design, which ensures a logic high Rx output if the Rx inputs are floating. • Three state Rx and Tx outputs • 30ns propagation delays, 2ns skew The driver (Tx) outputs are short-circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. • Current limiting and thermal shutdown for driver overload protection Applications The half duplex configuration multiplexes the Rx inputs and Tx outputs to allow transceivers with Rx and Tx disable functions in 8 Ld packages. • SCSI “fast 20” drivers and receivers Related Literature • Building environmental control systems For a full list of related documents, visit our website: • Industrial/process control networks • ISL4485E product page • Level translators • Data loggers • Security networks Typical Operating Circuit ISL4485E 5V 8 R PU 5V 100nF V CC 100nF RB 1 RO 8 R PU V CC RO 1 A/Y 6 6 A/Y 2 RE RE 2 R T2 3 DE V FS R T1 B/Z 7 DE 3 7 B/Z 4 DI DI 4 RB GND GND 5 5 To calculate the resistor values, refer to TB509. FN6049 Rev 4.00 Oct 8, 2018 Page 1 of 13 ISL4485E Ordering Information PART NUMBER (Notes 2, 3) PART MARKING TEMP. RANGE (°C) TAPE AND REEL (UNITS) (Note 1) ISL4485EIBZ 4485EIBZ -40 to +85 - ISL4485EIBZ-T 4485EIBZ -40 to +85 2.5k PACKAGE (RoHS COMPLIANT) PKG. DWG. # 8 Ld SOIC (Pb-free) M8.15 8 Ld SOIC Tape & Reel (Pb-free) M8.15 NOTE: 1. Refer to TB347 for details about reel specifications. 2. These Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), refer to the ISL4485E product information page. For more information, refer to TB363. Truth Tables RECEIVING TRANSMITTING INPUTS INPUTS OUTPUTS OUTPUT RE DE DI B/Z A/Y RE DE A-B RO X 1 1 0 1 0 0 ≥ +0.2V 1 X 1 0 1 0 0 0 ≤ -0.2V 0 X 0 X High-Z High-Z 0 0 Inputs Open 1 1 X X High-Z Pinout TOP VIEW RO 1 R RE 2 DE 3 DI 4 D 8 VCC 7 B/Z 6 A/Y 5 GND Pin Descriptions PIN FUNCTION RO Receiver output: RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO = high if A and B are unconnected (floating). RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±15kV HBM ESD protected, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1. B/Z ±15kV HBM ESD protected, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1. VCC System power supply input (4.5V to 5.5V). FN6049 Rev 4.00 Oct 8, 2018 Page 2 of 13 ISL4485E Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Input / Output Voltages A / Y, B / Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Short-Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . See “Electrical Specifications” Thermal Resistance (Typical, Note 4) JA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 Maximum Junction Temperature (Plastic Package) . . . . . . . . . 150 Maximum Storage Temperature Range . . . . . . . . . . . . -65°C to +150 Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . 300 (Lead Tips Only) Operating Conditions Temperature Range ISL4485EIBZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can permanently damage the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details. Electrical Specifications PARAMETER Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA = +25°C, Note 5 SYMBOL TEST CONDITIONS TEMP (oC) MIN TYP MAX UNIT DC CHARACTERISTICS Driver Differential VOUT (no load) VOD1 Driver Differential VOUT (with load) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Full - - VCC V R = 50Ω (RS-422), (Figure 1) Full 2 3 - V R = 27Ω (RS-485), (Figure 1) Full 1.5 2.3 5 V VOD R = 27Ω or 50Ω, (Figure 1) Full - 0.01 0.2 V VOC R = 27Ω or 50Ω, (Figure 1) Full - - 3 V VOC R = 27Ω or 50Ω, (Figure 1) Full - 0.01 0.2 V Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V Logic Input Current IIN1 DE, DI, RE Input Current (A, B), (Note 8) IIN2 DE = 0V, VCC = 0V or 4.5V to 5.5V Receiver Differential Threshold Voltage VTH Full -25 - 25 µA VIN = 12V Full - - 1 mA VIN = -7V Full - - -0.8 mA -7V ≤ VCM ≤ 12V Full -0.2 - 0.2 V Receiver Input Hysteresis VTH VCM = 0V 25 - 70 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full 3.5 4 - V Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - 0.1 0.4 V Three-State (High Impedance) Receiver Output Current IOZR 0.4V ≤ VO ≤ 2.4V Full - - 1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V No-Load Supply Current, (Note 6) ICC DI, RE = 0V or VCC Driver Short-Circuit Current, VO = High or Low FN6049 Rev 4.00 Oct 8, 2018 IOSD1 Full 12 25 - kΩ DE = VCC Full - 700 900 µA DE = 0V Full - 500 565 µA Full 35 - 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V, (Note 7) Page 3 of 13 ISL4485E Electrical Specifications PARAMETER Receiver Short-Circuit Current Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA = +25°C, Note 5 (Continued) TEMP (oC) MIN TYP MAX UNIT Full 7 - 85 mA tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 15 30 50 ns tSKEW RDIFF = 54Ω, CL = 100pF, (Figure 2) Full - 1.3 5 ns tR, tF RDIFF = 54Ω, CL = 100pF, (Figure 2) Full 3 11 25 ns SYMBOL IOSR TEST CONDITIONS 0V ≤ VO ≤ VCC SWITCHING CHARACTERISTICS Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High tZH CL = 100pF, SW = GND, (Figure 3) Full - 17 30 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure 3) Full - 14 30 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 3) Full - 19 30 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 3) Full - 13 30 ns fMAXD VOD ≥ 1.5V, (Figure 4, Note 9) Full 20 - - Mbps Full 20 40 70 ns Figure 5 Full - 3 10 ns tZH CL = 15pF, SW = GND, (Figure 6) Full - 9 25 ns Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure 6) Full - 9 25 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure 6) Full - 9 25 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure 6) Full - 9 25 ns CL = 15pF, VID ≥ 1.5V (Note 9) Full 20 - - Mbps Human Body Model 25 - ±15 - kV 25 - >±7 - kV Driver Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output High Receiver Maximum Data Rate tPLH, tPHL Figure 5 tSKD fMAXR ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) All Other Pins NOTE: 5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 6. Supply current specification is valid for loaded drivers when DE = 0V. 7. Applies to peak current. See “Typical Performance Curves” for more information. 8. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 unit loads on the bus. 9. Guaranteed by characterization, but not tested. Test Circuits and Waveforms VCC R DE DI Z VOD D Y R VOC FIGURE 1. DRIVER VOD AND VOC FN6049 Rev 4.00 Oct 8, 2018 Page 4 of 13 ISL4485E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH tPHL VOH VCC CL = 100pF DE 50% OUT (Y) 50% VOL Z DI tPHL RDIFF D Y tPLH VOH CL = 100pF OUT (Z) SIGNAL GENERATOR 50% 50% VOL 90% DIFF OUT (Y - Z) +VOD 90% 10% 10% tR -VOD tF SKEW = |CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z FIGURE 2B. MEASUREMENT POINTS FIGURE 2A. TEST CIRCUIT FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES 3V DE DI SIGNAL GENERATOR Z 500Ω VCC D SW Y DE 1.5V 1.5V 0V GND tZH CL OUTPUT HIGH tHZ VOH - 0.5V OUT (Y, Z) VOH 2.3V 0V PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 15 tLZ Y/Z X 0/1 VCC 15 tZH Y/Z X 1/0 GND 100 tZL Y/Z X 0/1 VCC 100 FIGURE 3A. TEST CIRCUIT tZL tLZ VCC OUT (Y, Z) 2.3V OUTPUT LOW VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES FN6049 Rev 4.00 Oct 8, 2018 Page 5 of 13 ISL4485E Test Circuits and Waveforms (Continued) 3V DI VCC DE 0V + Z DI CD = 200pF 60Ω D VOD Y - +VOD DIFF OUT (Y - Z) -VOD 0V SIGNAL GENERATOR FIGURE 4B. MEASUREMENT POINTS FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE 3V RE 15pF B +1.5V R A A 1.5V RO 1.5V 0V tPLH tPHL VCC SIGNAL GENERATOR 50% RO 50% 0V FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. RECEIVER PROPAGATION DELAY RE B R SIGNAL GENERATOR 1kΩ RO VCC SW A 3V RE 1.5V 1.5V GND 0V 15pF tZH OUTPUT HIGH VOH - 0.5V RO PARAMETER DE A SW tHZ 0 +1.5V GND tLZ 0 -1.5V VCC tZH 0 +1.5V GND tZL 0 -1.5V VCC tHZ 0V tZL tLZ VCC RO 1.5V OUTPUT LOW FIGURE 6A. TEST CIRCUIT VOH 1.5V VOL + 0.5V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES FN6049 Rev 4.00 Oct 8, 2018 Page 6 of 13 ISL4485E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard that allows only one driver and up to 10 receivers on each bus (assuming one unit load devices). RS-485 is a true multipoint standard that allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. An important advantage of RS-485 is the extended Common-Mode Range (CMR). The CMR specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000ft, so the wide CMR is necessary to handle ground potential differences and voltages induced in the cable by external fields. Receiver Features The ISL4485E uses a differential input receiver for maximum noise immunity and common-mode rejection. Input sensitivity is 200mV, as required by the RS-422 and RS-485 specifications. Receiver input impedance surpasses the RS-422 specification of 4kΩ and meets the RS-485 unit load requirement of 12kΩ minimum. Receiver inputs function with common-mode voltages as great as 7V outside the power supplies (+12V and -7V), making them ideal for long networks in which induced voltages are a realistic concern. The receiver includes a “fail-safe if open” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating). The output is three-statable using the active low RE input, and the receiver meets the 20Mbps data rate. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The ISL4485E driver features low propagation delay skew to maximize bit width and to minimize EMI, and the outputs are three-statable using the active high DE input. The ISL4485E driver outputs are not slew rate limited, so faster output transition times allow data rates up to 20Mbps. Data Rate, Cables, and Terminations Twisted pair cable is the cable of choice for RS-485/422 networks. Twisted pair cables pick up noise and other electromagnetically induced voltages as common-mode signals that are effectively rejected by the differential receivers in these ICs. FN6049 Rev 4.00 Oct 8, 2018 RS-485/422 are intended for network lengths up to 4000ft, but the maximum transmission length decreases as the data rate increases. According to guidelines in the RS-422 specification, a 20Mbps network should be limited to less than 50ft of 24 AWG twisted pair. However, the ISL4485E's large differential voltage swing, fast transition times, and high drive-current output stages allow operation at 20Mbps in RS-485/422 networks as long as 450ft. Figure 7 on page 8 details ISL4485E operation at 20Mbps driving 300ft of CAT 5 cable terminated in 120Ω at the driver and the receiver (that is, double terminated). The acceptance criteria for this test was the ability of the driver to deliver a 1.5V differential signal to the receiver at the end of the cable (|A-B| ≥ 1.5V). If a more liberal acceptance criteria is used, the distance can be further extended. For example, Figure 8 on page 8 illustrates the performance in the same configuration but with a cable length of 450ft and an acceptance criteria of no more than 6dB attenuation across the cable (|A-B| = |Y-Z|/2). Driver differential output voltage decreases with increasing differential load capacitance, so maintaining a 1.5V differential output requires a data rate reduction as shown in Figure 9 on page 8. To minimize reflections, proper termination is imperative when using this 20Mbps device. In point-to-point or point-to-multipoint (single driver on bus) networks, terminate the main cable in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, keep stubs connecting receivers to the main cable as short as possible (preferably less than 12in). Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Keep stubs connecting a transceiver to the main cable as short as possible. Built-In Driver Overload Protection The RS-485 specification requires that drivers survive worst case bus contentions undamaged. The ISL4485E device meets this requirement with driver output short-circuit current limits and on-chip thermal shutdown circuitry. The driver output stages incorporate short-circuit current limiting circuitry, ensuring that the output current never exceeds the RS-485 specification even at the common-mode voltage range extremes. These devices also use a foldback circuit that reduces the short-circuit current (and the power dissipation) when the contending voltage exceeds either supply. In the event of a major short-circuit condition, this device’s thermal shutdown feature disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 15°C. If the condition persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Page 7 of 13 ISL4485E ESD Protection All pins on these interface devices include class 3 Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of 15kV HBM. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins or connecting a cable can cause an ESD event that destroys unprotected ICs. The ISL4485E ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and without degrading the RS-485 CMR of -7V to +12V. This built-in ESD protection eliminates the need for board level (~450ns) 1.5 0 A-B -1.5 -3 DI 5 0 5 RO 0 DRIVER+CABLE DELAY 3 DRIVER INPUT (V) RO DRIVER+CABLE DELAY The RS-485 pin survivability on this high ESD device has been characterized to be in excess of 15kV, for discharges to GND. RECEIVER OUTPUT (V) 5 DRIVER INPUT (V) 5 0 3 This test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge stored on a 100pF capacitor through a 1.5kΩ current limiting resistor into the pin under test. The HBM method determines an IC’s ability to withstand the ESD events typically present during handling and manufacturing. VCC = 5V, TA = 25oC, Unless Otherwise Specified DI 0 Human Body Model Testing RECEIVER INPUT (V) RECEIVER INPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves protection structures (for example, transient suppression diodes) and the associated undesirable capacitive load that they cause. (~650ns) 1.5 0 A-B -1.5 -3 TIME (20ns/DIV) TIME (20ns/DIV) FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING 300FT OF CABLE (DOUBLE TERMINATED) FIGURE 8. DRIVER AND RECEIVER WAVEFORMS DRIVING 450FT OF CABLE (DOUBLE TERMINATED) 750 30 RDIFF = 54Ω 700 25 20 ICC (A) DATA RATE (Mbps) DE = VCC, RE = X 650 15 600 550 10 500 DE = GND, RE = X 5 450 0 500 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 DIFFERENTIAL CAPACITANCE (pF) FIGURE 9. DATA RATE vs DIFFERENTIAL CAPACITANCE FN6049 Rev 4.00 Oct 8, 2018 400 -40 -25 0 25 50 75 TEMPERATURE (°C) FIGURE 10. SUPPLY CURRENT vs TEMPERATURE Page 8 of 13 85 ISL4485E (Continued) VCC = 5V, TA = 25oC, Unless Otherwise Specified 90 3.6 80 3.4 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) Typical Performance Curves 70 60 50 40 30 20 10 0 0 1 2 3 4 3.2 RDIFF = 100Ω 3 2.8 2.6 2.4 RDIFF = 54Ω 2.2 2 -40 5 -25 DIFFERENTIAL OUTPUT VOLTAGE (V) 25 50 75 85 TEMPERATURE (°C) FIGURE 11. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 12. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 40 3 35 2.5 tPHLY - tPLHZ tPHLY 30 tPHLZ tPLHZ SKEW (ns) PROPAGATION DELAY (ns) 0 tPLHY 25 tPLHY - tPHLZ 2 1.5 CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z 25 -40 -25 0 25 50 TEMPERATURE (°C) FIGURE 13. DRIVER PROPAGATION DELAY vs TEMPERATURE FN6049 Rev 4.00 Oct 8, 2018 75 85 1 -40 -25 0 25 50 75 TEMPERATURE (°C) FIGURE 14. DRIVER SKEW vs TEMPERATURE Page 9 of 13 85 ISL4485E DI 0 5 RO 0 4 3 2 B/Z A/Y 1 0 RDIFF = 54Ω, CL = 100pF DI 5 0 RO 0 4 3 A/Y 2 B/Z 1 0 TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH FIGURE 16. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW 160 140 120 Y OR Z = LOW OUTPUT CURRENT (mA) 100 80 60 40 20 0 -20 Y OR Z = HIGH -40 -60 -80 -100 -120 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 518 PROCESS: Si Gate CMOS FN6049 Rev 4.00 Oct 8, 2018 5 Page 10 of 13 DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DRIVER INPUT (V) (Continued) VCC = 5V, TA = 25oC, Unless Otherwise Specified DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves ISL4485E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE Oct 8, 2018 FN6049.4 Updated typical operating circuit on page 1. Added Related Literature section to page 1. Removed ISL4485EIB and ISL4485EIB-T from ordering information table on page 2. Added Tape and Reel column and Notes 1, 2, and 3 to ordering information table on page 2. Removed Intersil copyright information and added Renesas disclaimer. Added Revision History to page 11. Updated package outline drawing from revision 0 to revision 4. Changes between revisions: -Revision 1: Initial revision -Revision 1 to revision 2: Updated to new package outline drawing format by removing table, moving dimensions onto drawing, and adding land pattern -Revision 2 to revision 3: Changed the following values in Typical Recommended Landing Pattern: 2.41(0.095) to 2.20 (0.087) 0.76(0.030) to 0.60(0.023) 0.200 to 5.20(0.205) -Revision 3 to revision 4: Changed text in Note 1 from “1982” to “1994” FN6049 Rev 4.00 Oct 8, 2018 Page 11 of 13 ISL4485E Package Outline Drawing M8.15 For the most recent package outline drawing, see M8.15. 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 10. Dimensioning and tolerancing per ANSI Y14.5M-1994. 11. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 12. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 13. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 14. Terminal numbers are shown for reference only. 15. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 16. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6049 Rev 4.00 Oct 8, 2018 Page 12 of 13 Notice 1. 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"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document. 6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. (Rev.4.0-1 November 2017) http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics Corporation TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan Renesas Electronics America Inc. 1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A. Tel: +1-408-432-8888, Fax: +1-408-434-5351 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82-2-558-5338 © 2018 Renesas Electronics Corporation. All rights reserved. Colophon 7.2