ISL4491EIBZ-T

DATASHEET ISL4489E, ISL4491E FN6074 Rev.4.00 Sep 17, 2018 ±15kV ESD Protected, 1/8 Unit Load, 5V, Low Power, High Speed and Slew Rate Limited, Full Duplex, RS-485/RS-422 Transceivers The ISL4489E and ISL4491E are ESD protected, “fractional” Unit Load (UL), BiCMOS, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output and receiver input is protected against ±15kV ESD strikes without latch-up. Unlike competitive versions, these devices are specified for 10% tolerance supplies (4.5V to 5.5V). Features • Pb-free (RoHS compliant) • RS-485 I/O pin ESD protection . . . . . . . . . . . ±15kV HBM - Class 3 ESD level on all other pins . . . . . . . >7kV HBM • 1/8 unit load allows up to 256 devices on the bus • High data rates (ISL4491E) . . . . . . . . . . . . up to 15Mbps The Rx inputs and Tx outputs present a 1/8 unit load to the RS-485 bus, which allows a total of 256 transmitters and receivers on the network for large node count systems. • Slew rate limited version for error free data transmission (ISL4489E) • Very low quiescent current: - 140µA (ISL4489E) - 370µA (ISL4491E) These devices are configured for full duplex (separate Rx input and Tx output pins) applications, so they are ideal for RS-422 networks requiring high ESD tolerance on the bus pins. • -7V to +12V common-mode input voltage range The ISL4489E uses a slew rate limited driver that reduces EMI and minimizes reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. • Tri-statable Rx and Tx outputs Data rates up to 15Mbps are achievable using the ISL4491E, which features higher slew rates. • Current limiting and thermal shutdown for driver overload protection The receiver (Rx) inputs feature a “fail-safe if open” design, which ensures a logic high Rx output if Rx inputs are floating. Applications The driver (Tx) outputs are short-circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. • Security networks Related Literature • Level translators (for example, RS-232 to RS-422) • Full duplex pinout • Operates from a single +5V supply (10% tolerance) • Factory automation • Building environmental control systems • Industrial/process control networks • RS-232 “extension cords” For a full list of related documents, visit our website: • ISL4489E, ISL4491E product pages TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FULL DUPLEX HIGH ESD? NO. OF DEVICES ALLOWED ON BUS DATA RATE (Mbps) ISL4489E Full Yes 256 0.25 Yes Yes 140 14 ISL4491E Full Yes 256 15 No Yes 370 14 FN6074 Rev.4.00 Sep 17, 2018 SLEW-RATE RECEIVER/ QUIESCENT PIN LIMITED? DRIVER ENABLE? ICC (µA) COUNT Page 1 of 14 ISL4489E, ISL4491E Ordering Information PART NUMBER (Notes 2, 3) PART MARKING TEMP. RANGE (°C) TAPE AND REEL (UNITS) (Note 1) PACKAGE (RoHS Compliant) PKG. DWG. # ISL4489EIBZ 4489EIBZ -40 to +85 - 14 Ld SOIC M14.15 ISL4489EIBZ-T 4489EIBZ -40 to +85 2.5k 14 Ld SOIC M14.15 ISL4491EIBZ 4491EIBZ -40 to +85 - 14 Ld SOIC M14.15 ISL4491EIBZ-T 4491EIBZ -40 to +85 2.5k 14 Ld SOIC M14.15 NOTES: 1. Refer to TB347 for details about reel specifications. 2. Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), see the ISL4489E and ISL4491E product information pages. For more information on MSL, see TB363. Pinout 14 LD SOIC TOP VIEW 14 VCC NC 1 RO 2 R RE 3 12 A 11 B DE 4 DI 5 13 NC D 10 Z GND 6 9 Y GND 7 8 NC Pin Descriptions PIN FUNCTION RO Receiver output.RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO = High if A and B are unconnected (floating). RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs Y and Z are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A ±15kV HBM ESD protected, noninverting receiver input. B ±15kV HBM ESD protected, inverting receiver input. Y ±15kV HBM ESD protected, noninverting driver output. Z ±15kV HBM ESD protected, inverting driver output. VCC System power supply input (4.5V to 5.5V). NC No connection. FN6074 Rev.4.00 Sep 17, 2018 Page 2 of 14 ISL4489E, ISL4491E Truth Tables TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS OUTPUT RE DE DI Z Y RE DE A-B RO X 1 1 0 1 0 X ≥ +0.2V 1 X 1 0 1 0 0 X ≤ -0.2V 0 X 0 X High-Z High-Z 0 X Inputs Open 1 1 X X High-Z Typical Operating Circuit ISL4489E, ISL4491E 5V 100nF 13,14 RPU 5V VCC 100nF RB RB A 12 2 RO 3 RE B 11 4 DE Z 10 9 Y 10 Z DE 4 RE 3 11 B RT Y 9 RPU DI 5 RT 5 DI GND 6,7 13,14 VCC RO 2 12 A GND RB RB 6,7 To calculate the resistor values, refer to TB509 FN6074 Rev.4.00 Sep 17, 2018 Page 3 of 14 ISL4489E, ISL4491E Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Input/Output Voltages A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Short-Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . See “ESD PERFORMANCE” on page 5 Thermal Resistance (Typical, Note 4) JA (°C/W) 14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 128 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can permanently damage the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details. Electrical Specifications Note 5 PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C, SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNIT Full - - VCC V DC CHARACTERISTICS Driver Differential VOUT (no load) VOD1 Driver Differential VOUT (with load) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States R = 50Ω (RS-422) (Figure 1) Full 2 3 - V R = 27Ω (RS-485) (Figure 1) Full 1.5 2.3 5 V VOD R = 27Ω or 50Ω (Figure 1) Full - 0.01 0.2 V VOC R = 27Ω or 50Ω (Figure 1) Full - - 3 V VOC R = 27Ω or 50Ω (Figure 1) Full - 0.01 0.2 V Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full 0.8 - - V Logic Input Current IIN1 DI Full -2 - 2 µA Input Current (A, B) (Note 8) IIN2 Full -40 - 40 µA VIN = 12V Full - - 130 µA VIN = -7V Full -100 - - µA DE, RE DE = 0V, VCC = 0V or 4.5 to 5.5V Driver Tri-State (High Impedance) Output Current (Y, Z) IOZD -7V ≤ VO ≤ 12V Full -100 - 100 µA Receiver Differential Threshold Voltage VTH -7V ≤ VCM ≤ 12V Full -0.2 - 0.2 V Receiver Input Hysteresis VTH VCM = 0V +25 - 70 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full 3.5 - - V Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - - 0.4 V Tri-State (high impedance) Receiver Output Current IOZR 0.4V ≤ VO ≤ 2.4V Full - - ±1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 92 120 - kΩ No-Load Supply Current (Note 6) ICC ISL4489E, DE, DI, RE = 0V or VCC Full - 140 190 µA ISL4491E, DE, DI, RE = 0V or VCC Full - 370 460 µA Driver Short-Circuit Current, VO = High or Low IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) Full 35 - 250 mA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full 7 - 85 mA FN6074 Rev.4.00 Sep 17, 2018 Page 4 of 14 ISL4489E, ISL4491E Electrical Specifications Note 5 (Continued) PARAMETER Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C, TEMP (°C) MIN TYP MAX UNIT tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full 250 400 2000 ns tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 160 800 ns tR, tF RDIFF = 54Ω, CL = 100pF (Figure 2) Full 250 600 2000 ns SYMBOL TEST CONDITIONS SWITCHING CHARACTERISTICS (ISL4489E) Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High tZH CL = 100pF, SW = GND (Figure 3) Full 250 1000 2000 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC (Figure 3) Full 250 860 2000 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 3) Full 300 660 3000 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 3) Full 300 640 3000 ns Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | tPLH, tPHL Figure 4 tSKD Full 250 500 2000 ns Figure 4 +25 - 60 - ns Receiver Enable to Output High tZH CL = 15pF, SW = GND (Figure 5) Full - 10 50 ns Receiver Enable to Output Low tZL CL = 15pF, SW = VCC (Figure 5) Full - 10 50 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 5) Full - 10 50 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 5) Full - 10 50 ns Full 250 - - kbps tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full 13 24 40 ns tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 3 10 ns tR, tF RDIFF = 54Ω, CL = 100pF (Figure 2) Full 5 12 20 ns Maximum Data Rate fMAX SWITCHING CHARACTERISTICS (ISL4491E) Driver Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High tZH CL = 100pF, SW = GND (Figure 3) Full - 14 70 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC (Figure 3) Full - 14 70 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 3) Full - 44 70 ns tLZ CL = 15pF, SW = VCC (Figure 3) Driver Disable from Output Low Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output High Full - 21 70 ns Full 30 90 150 ns (Figure 4) +25 - 5 - ns tZH CL = 15pF, SW = GND (Figure 5) Full - 9 50 ns tPLH, tPHL (Figure 4) tSKD Receiver Enable to Output Low tZL CL = 15pF, SW = VCC (Figure 5) Full - 9 50 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 5) Full - 9 50 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 5) Full - 9 50 ns Full 15 - - Mbps +25 - ±15 - kV +25 - >±7 - kV Maximum Data Rate fMAX ESD PERFORMANCE RS-485 Pins (A, B, Y, Z) Human Body Model All Other Pins NOTES: 5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 6. Supply current specification is valid for loaded drivers when DE = 0V. 7. Applies to peak current. See “Typical Performance Curves” on page 9 for more information. 8. Devices meeting these limits are denoted as “1/8 unit load (1/8 UL)” transceivers. The RS-485 standard allows up to 32 UL on the bus, so there can be 256 1/8 UL devices on a bus. FN6074 Rev.4.00 Sep 17, 2018 Page 5 of 14 ISL4489E, ISL4491E Test Circuits and Waveforms R VCC DE Z DI VOD D Y VOC R FIGURE 1. DRIVER VOD AND VOC 3V DI 1.5V 1.5V 0V tPLH VCC tPHL VOH CL = 100pF DE 50% OUT (Y) 50% VOL Z DI RDIFF D Y VOH OUT (Z) SIGNAL GENERATOR tPLH tPHL CL = 100pF 50% 50% VOL 90% DIFF OUT (Y - Z) 10% tR +VOD 90% 10% -VOD tF SKEW = |tPLH (Y or Z) - tPHL (Z or Y)| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES FN6074 Rev.4.00 Sep 17, 2018 Page 6 of 14 ISL4489E, ISL4491E Test Circuits and Waveforms (Continued) DE Z DI 500Ω D SIGNAL GENERATOR 3V VCC SW Y DE 1.5V 1.5V GND 0V CL tZH OUTPUT HIGH OUT (Y, Z) PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 15 tLZ Y/Z X 0/1 VCC 15 tZH Y/Z GND 100 X Y/Z tZL 1/0 X 0/1 VCC tHZ VOH - 0.5V VOH 2.3V 0V tZL tLZ VCC OUT (Y, Z) 2.3V OUTPUT LOW 100 FIGURE 3A. TEST CIRCUIT VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES RE +1.5V 3V 15pF B R A A 1.5V RO 1.5V 0V tPLH tPHL VCC SIGNAL GENERATOR 50% RO 50% 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4A. TEST CIRCUIT FIGURE 4. RECEIVER PROPAGATION DELAY RE 3V B R SIGNAL GENERATOR 1kΩ RO VCC SW A RE 1.5V 0V GND tZH 15pF OUTPUT HIGH RO PARAMETER DE A SW tHZ X +1.5V GND tLZ X -1.5V VCC tZH X +1.5V GND tZL X -1.5V VCC FIGURE 5A. TEST CIRCUIT 1.5V tHZ VOH - 0.5V VOH 1.5V 0V tZL tLZ VCC RO 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES FN6074 Rev.4.00 Sep 17, 2018 Page 7 of 14 ISL4489E, ISL4491E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard that allows only one driver and up to 10 receivers on each bus, assuming one unit load devices. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. An important advantage of RS-485 is the extended Common-Mode Range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000ft, so the wide CMR is necessary to handle ground potential differences and voltages induced in the cable by external fields. Receiver Features These devices use a differential input receiver for maximum noise immunity and common-mode rejection. Input sensitivity is ±200mV as required by the RS-422 and RS-485 specifications. The receiver input resistance of 120kΩ surpasses the RS-422 specification of 4kΩ, and is more than eight times the RS-485 “UL” requirement of 12kΩ. Thus, these products are known as “one-eighth UL” transceivers. There can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Receiver inputs function with common-mode voltages as great as ±7V outside the power supplies (such as +12V and -7V), making them ideal for long networks in which induced voltages are a realistic concern. All the receivers include a “fail-safe if open” function that ensures a high level receiver output if the receiver inputs are unconnected (floating). Receivers easily meet the data rate supported by the corresponding driver, and the receiver outputs are tri-statable using the active low RE input. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485) and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width and to minimize EMI. The driver outputs are tri-statable using the active high DE input. rate limited versions are a maximum of 250kbps. The ISL4491E driver outputs are not limited, so faster output transition times allow data rates of at least 15Mbps. Data Rate, Cables, and Terminations Twisted pair cable is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common-mode signals, which are effectively rejected by the differential receivers in these ICs. RS-485/422 are intended for network lengths up to 4000ft, but the maximum system data rate decreases as the transmission length increases. Devices operating at 15Mbps are limited to lengths of a few hundred feet, while the 250kbps versions can operate at full data rates with lengths in excess of 1000ft. Proper termination is imperative to minimize reflections when using the 15Mbps devices. Short networks using the 250kbps versions do not need to be terminated, but terminations are recommended unless power dissipation is an overriding concern. In point-to-point or point-to-multipoint (single driver on bus) networks, terminate the main cable in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, keep stubs connecting receivers to the main cable as short as possible. In multipoint (multi-driver) systems, terminate the main cable in its characteristic impedance at both ends. Keep stubs connecting a transceiver to the main cable as short as possible. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. The ISL44xxE devices meet this requirement through driver output short-circuit current limits and on-chip thermal shutdown circuitry. The driver output stages incorporate short-circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, even at the common-mode voltage range extremes. Additionally, these devices use a foldback circuit that reduces the short-circuit current, and thus the power dissipation, when the contending voltage exceeds either supply. In the event of a major short-circuit condition, the ISL44xxE devices’ thermal shutdown feature disables the drivers when the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 15°C. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. The ISL4489E driver outputs are slew rate limited to further reduce EMI and to minimize reflections in unterminated or improperly terminated networks. Data rates on these slew FN6074 Rev.4.00 Sep 17, 2018 Page 8 of 14 ISL4489E, ISL4491E ESD Protection All pins on these devices include Class 3 Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins or connecting a cable can VCC = 5V, TA = 25°C; Unless Otherwise Specified 90 3.6 80 3.4 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) Typical Performance Curves cause an ESD event that might destroy unprotected ICs. The ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and without degrading the RS-485 common-mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (for example, transient suppression diodes), and the associated undesirable capacitive load they present. 70 60 50 40 30 20 10 0 0 1 2 3 4 3.2 RDIFF = 100Ω 3 2.8 2.6 2.4 RDIFF = 54Ω 2.2 2 -40 5 -25 DIFFERENTIAL OUTPUT VOLTAGE (V) 50 25 75 FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 160 400 140 ISL4491E 120 350 Y OR Z = LOW 100 80 85 ISL4491E, DE = X, RE = X 300 ISL4489E 60 40 250 ICC (µA) OUTPUT CURRENT (mA) 0 TEMPERATURE (°C) 20 0 -20 Y OR Z = HIGH -40 -60 -7 -6 -4 ISL4489E, DE = X, RE = X 150 ISL4491E -80 ISL4489E -100 -120 200 100 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE FN6074 Rev.4.00 Sep 17, 2018 50 -40 -25 0 25 TEMPERATURE (°C) 50 75 FIGURE 9. SUPPLY CURRENT vs TEMPERATURE Page 9 of 14 85 ISL4489E, ISL4491E Typical Performance Curves VCC = 5V, TA = 25°C; Unless Otherwise Specified (Continued) 750 250 200 tPLHY tPLHZ 650 |tPLHY - tPHLZ| 150 600 SKEW (ns) tPHLY 550 tPHLZ |tPHLY - tPLHZ| 100 50 500 |CROSS PT. OF Y & Z - CROSS PT. OF Y & Z| 450 -40 -25 0 25 TEMPERATURE (°C) 50 0 -40 85 75 FIGURE 10. DRIVER PROPAGATION DELAY vs TEMPERATURE (ISL4489E) 85 75 4 |tPHLY - tPLHZ| 26 tPLHY 22 tPHLZ tPLHZ 20 3 SKEW (ns) 24 |tPLHY - tPHLZ| 2 1 18 |CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z| tPHLY 16 -40 -25 0 25 50 0 -40 85 75 -25 TEMPERATURE (°C) 5 0 5 RO 0 3 2 DRIVER OUTPUT (V) 4 Z Y 1 0 TIME (400ns/DIV) FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL4489E) FN6074 Rev.4.00 Sep 17, 2018 RECEIVER OUTPUT (V) DI 50 25 85 75 FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL4491E) DRIVER INPUT (V) RDIFF = 54Ω, CL = 100pF 0 TEMPERATURE (°C) FIGURE 12. DRIVER PROPAGATION DELAY vs TEMPERATURE (ISL4491E) RECEIVER OUTPUT (V) 50 5 28 DRIVER OUTPUT (V) 0 25 TEMPERATURE (°C) FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL4489E) 30 PROPAGATION DELAY (ns) -25 RDIFF = 54Ω, CL = 100pF 5 DI 0 5 RO 0 4 3 2 Y Z 1 0 TIME (400ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL4489E) Page 10 of 14 DRIVER INPUT (V) PROPAGATION DELAY (ns) 700 ISL4489E, ISL4491E 5 0 5 RO 0 4 3 2 Z Y 1 0 TIME (20ns/DIV) FIGURE 16. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL4491E) RDIFF = 54Ω, CL = 100pF DI 0 5 RO 0 4 3 2 Y Z 1 0 TIME (20ns/DIV) FIGURE 17. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL4491E) Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 518 PROCESS: Si Gate BiCMOS FN6074 Rev.4.00 Sep 17, 2018 5 Page 11 of 14 DRIVER INPUT (V) DI RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DRIVER INPUT (V) VCC = 5V, TA = 25°C; Unless Otherwise Specified (Continued) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves ISL4489E, ISL4491E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE Sep 14, 2018 FN6074.4 Added Related Literature section. Updated first features bullet. Updated Ordering Information table by removing retired parts, adding Notes 1 and 3, added tape and reel parts and column. Updated the Typical Operating Circuit diagram on page 3. Added Revision History section. Updated POD M14.15 to the latest revision. Changes are as follows: - Add land pattern and moved dimensions from table onto drawing FN6074 Rev.4.00 Sep 17, 2018 Page 12 of 14 ISL4489E, ISL4491E Package Outline Drawing For the most recent package outline drawing, see M14.15. M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.22±0.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45° 4° ± 4° 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 indentifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN FN6074 Rev.4.00 Sep 17, 2018 Page 13 of 14 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information. 2. 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The intended applications for each Renesas Electronics product depends on the you or third parties arising from such alteration, modification, copying or reverse engineering. product’s quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document. 6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. (Rev.4.0-1 November 2017) http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. California Eastern Laboratories, Inc. 4590 Patrick Henry Drive, Santa Clara, California 95054-1817, U.S.A. Tel: +1-408-919-2500, Fax: +1-408-988-0279 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82-2-558-5338 © 2018 Renesas Electronics Corporation. All rights reserved. Colophon 7.1