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ISL6208CHRZ-T

ISL6208CHRZ-T

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFDFN8

  • 描述:

    IC GATE DRVR HALF-BRIDGE 8DFN

  • 数据手册
  • 价格&库存
ISL6208CHRZ-T 数据手册
DATASHEET ISL6208C FN8395 Rev 1.00 Jun 1, 2016 High Voltage Synchronous Rectified Buck MOSFET Drivers The ISL6208C is a high frequency, dual MOSFET driver, optimized to drive two N-channel power MOSFETs in a synchronous-rectified buck converter topology. It is especially suited for mobile computing applications that require high efficiency and excellent thermal performance. The driver, combined with an Intersil multiphase buck PWM controller, forms a complete single-stage core-voltage regulator solution for advanced mobile microprocessors. The ISL6208C features 4A typical sinking current for the lower gate driver. This current is capable of holding the lower MOSFET gate off during the rising edge of the phase node. This prevents shoot-through power loss caused by the high dv/dt of phase voltages. The operating voltage matches the 30V breakdown voltage of the MOSFETs commonly used in mobile computer power supplies. Features • Dual MOSFET drives for synchronous rectified bridge • Adaptive shoot-through protection • 0.5Ω ON-resistance and 4A sink current capability • Supports high switching frequency up to 2MHz - Fast output rise and fall time - Low propagation delay • Three-state PWM input for power stage shutdown • Internal bootstrap Schottky diode • Low bias supply current (5V, 80µA) • Diode emulation for enhanced light load efficiency and prebiased start-up applications The ISL6208C also features a three-state PWM input that, working together with Intersil’s multiphase PWM controllers, will prevent negative voltage output during CPU shutdown. This feature eliminates a protective Schottky diode usually seen in microprocessor power systems. • VCC POR (Power-On-Reset) feature integrated MOSFET gates can be efficiently switched up to 2MHz using the ISL6208C. Each driver is capable of driving a 3000pF load with propagation delays of 8ns and transition times under 10ns. Bootstrapping is implemented with an internal Schottky diode. This reduces system cost and complexity, while allowing the use of higher performance MOSFETs. Adaptive shoot-through protection is integrated to prevent both MOSFETs from conducting simultaneously. • Pb-free (RoHS compliant) A diode emulation feature is integrated in the ISL6208C to enhance converter efficiency at light load conditions. This feature also allows for monotonic start-up into prebiased outputs. When diode emulation is enabled, the driver will allow discontinuous conduction mode by detecting when the inductor current reaches zero and subsequently turning off the low-side MOSFET gate. • High input voltage DC/DC converters • Low three-state shutdown holdoff time (typical 160ns) • Pin-to-pin compatible with ISL6207 • DFN package Applications • Core voltage supplies for Intel™ and AMD™ mobile microprocessors • High frequency low profile DC/DC converters • High current low output voltage DC/DC converters Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” • Technical Brief TB389 “PCB Land Pattern Design and Surface Mount Guidelines for MLFP Packages” • Technical Brief TB447 “Guidelines for Preventing Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs” FN8395 Rev 1.00 Jun 1, 2016 Page 1 of 12 ISL6208C Table of Contents Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Typical Application with 2-Phase Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical Performance Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Diode Emulation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Three-State PWM Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Adaptive Shoot-Through Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Reducing Phase Ring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 FN8395 Rev 1.00 Jun 1, 2016 Page 2 of 12 ISL6208C Block Diagram VCC BOOT FCCM UGATE PHASE SHOOTTHROUGH PROTECTION CONTROL LOGIC PWM VCC LGATE 10kΩ GND THERMAL PAD FIGURE 1. BLOCK DIAGRAM Typical Application with 2-Phase Converter +5V VBAT +5V +5V VCC FB VSEN PWM1 PWM PWM2 PGOOD UGATE FCCM VCC PHASE DRIVE ISL6208C THERMAL PAD FCCM MAIN CONTROL +VCORE BOOT COMP LGATE ISEN1 VID ISEN2 +5V VBAT VCC BOOT FS DACOUT GND FCCM PWM UGATE DRIVE ISL6208C PHASE THERMAL LGATE PAD FIGURE 2. TYPICAL APPLICATION WITH 2-PHASE CONVERTER FN8395 Rev 1.00 Jun 1, 2016 Page 3 of 12 ISL6208C Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (°C) TAPE AND REEL (UNITS) PACKAGE (RoHS Compliant) PKG. DWG. # ISL6208CHRZ-T 8CH -10 to +100 6k 8 Ld 2x2 DFN L8.2x2D ISL6208CIRZ-T 8CI -40 to +100 6k 8 Ld 2x2 DFN L8.2x2D NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6208C. For more information on MSL please see techbrief TB363. Pin Configuration ISL6208C (8 LD 2x2 DFN) TOP VIEW UGATE 1 86 PHASE BOOT 2 7 FCCM PWM 3 66 VCC GND 4 5 LGATE Pin Description PIN SYMBOL 1 UGATE The UGATE pin is the upper gate drive output. Connect to gate of the high-side power N-channel MOSFET. 2 BOOT BOOT is the floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Internal Bootstrap Diode” on page 9 for guidance in choosing the appropriate capacitor value. 3 PWM The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation. See “Three-State PWM Input” on page 9 for further details. Connect this pin to the PWM output of the controller. 4 GND GND is the ground pin for the IC. 5 LGATE 6 VCC 7 FCCM The FCCM pin enables or disables Diode Emulation. When FCCM is LOW, diode emulation is allowed. Otherwise, continuous conduction mode is forced. See “Diode Emulation” on page 9 for more detail. 8 PHASE Connect the PHASE pin to the source of the upper MOSFET and the drain of the lower MOSFET. This pin provides a return path for the upper gate driver. FN8395 Rev 1.00 Jun 1, 2016 DESCRIPTION LGATE is the lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET. Connect the VCC pin to a +5V bias supply. Place a high quality bypass capacitor from this pin to GND. The VCC pin of the driver(s) and related VCC or +5V bias supply pin of the Intersil controller must share a common +5V supply. Page 4 of 12 ISL6208C Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input Voltage (VFCCM, VPWM) . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V BOOT Voltage (VBOOT-GND) . . . . . . . . . . . -0.3V to 33V (DC) or 36V (
ISL6208CHRZ-T 价格&库存

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