ISL6700IBZ-T

DATASHEET ISL6700 FN9077 Rev.6.00 December 29, 2004 80V/1.25A Peak, Medium Frequency, Low Cost, Half-Bridge Driver The ISL6700 is an 80V/1.25A peak, medium frequency, low cost, half-bridge driver IC available in 8-lead SOIC and 12-lead QFN plastic packages. The low-side and high-side gate drivers are independently controlled and matched to 25ns. This gives the user maximum flexibility in dead-time selection and driver protocol. Undervoltage protection on both the low-side and high-side supplies force the outputs low. Non-latching, level-shift translation is used to control the upper drive circuit. Unlike some competitors, the high-side output returns to its correct state after a momentary undervoltage of the high-side supply. TEMP. RANGE (°C) • Drives 2 N-Channel MOSFETs in Half-Bridge Configuration • Space Saving SO8 and Low RC-S QFN Packages • Phase Supply Max Voltage to 80VDC • Bootstrap Supply Max Voltage to 96VDC • Drives 1000pF Load with Rise and Fall Times Typ. 15ns • TTL/CMOS Compatible Input Thresholds • Independent Inputs for Non-Half-Bridge Topologies Ordering Information PART NUMBER Features • No Start-Up Problems PACKAGE PKG. DWG. # • Low Power Consumption ISL6700IB -40 to 125 8 Ld SOIC M8.15 • Wide Supply Range ISL6700IBZ (See Note) -40 to 125 8 Ld SOIC (Pb-free) M8.15 • Supply Undervoltage Protection ISL6700IR -40 to 125 12 Ld 4x4 QFN L12.4x4 ISL6700IRZ (See Note) -40 to 125 12 Ld 4x4 QFN (Pb-free) L12.4x4 • QFN Package - Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline • Pb-Free Available (RoHS Compliant) Add “-T” suffix to part number for tape and reel packaging. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Applications • Telecom/Datacom Power Supplies • Half-Bridge Converters • Two-Switch Forward Converters • Active Clamp Forward Converters Pinouts VDD 1 8 HB NC HB ISL6700IR (QFN) TOP VIEW VDD ISL6700IB (SOIC) TOP VIEW HI 2 7 HO 12 11 10 LI 3 6 HS VSS 4 5 LO 2 LI 3 EPAD 8 NC 7 HS 4 5 6 LO NC 9 HO NC 1 VSS HI NOTE: EPAD = Exposed PAD. FN9077 Rev.6.00 December 29, 2004 Page 1 of 8 ISL6700 Application Block Diagram +12V +48V VDD DRIVE HI PWM CONTROLLER LI CONTROL HI SECONDARY CIRCUIT HB HO HS DRIVE LO LO REFERENCE AND ISOLATION ISL6700 VSS Functional Block Diagram HB U/V LEVEL SHIFT HO HS HI TURN-ON DELAY LI VDD LO DETECTOR UNDERVOLTAGE VSS EPAD (QFN PACKAGE ONLY) FN9077 Rev.6.00 December 29, 2004 Page 2 of 8 ISL6700 +48V +12V PWM SECONDARY CIRCUIT ISL6700 ISOLATION FIGURE 1. TWO-SWITCH FORWARD CONVERTER +48V SECONDARY CIRCUIT +12V PWM ISL6700 ISOLATION FIGURE 2. FORWARD CONVERTER WITH AN ACTIVE CLAMP FN9077 Rev.6.00 December 29, 2004 Page 3 of 8 ISL6700 Absolute Maximum Ratings Thermal Information Supply Voltage, VDD (Note 1) . . . . . . . . . . . . . . . . . . . -0.3V to 16V LI and HI Voltages (Note 1) . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V Voltage on HS (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 80V Voltage on HB (Note 1) . . . . . . . . . . . . . . . . VHS-0.3V to VHS+VDD Voltage on LO (Note 1) . . . . . . . . . . . . . . . . . VSS-0.3 to VDD+0.3V Voltage on HO (Note 1) . . . . . . . . . . . . . . . . VHS-0.3V to VHB+0.3V Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns Thermal Resistance (Typical) Maximum Recommended Operating Conditions Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9V to 15V Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 75V Voltage on HS (Note 2) . . . . . . . . . .(Repetitive Transient) -1V to 80V Voltage on HB . . . . . . . . . . . . . . . . . . . . . . . . . . VHS +7.5V to VHS +VDD JA (°C/W) JC (°C/W) SOIC (Note 3) . . . . . . . . . . . . . . . . . . . 95 N/A QFN (Note 4) . . . . . . . . . . . . . . . . . . . . 49 7 Max Power Dissipation at 25°C in Free Air (SOIC, Note 3). 1.316W Max Power Dissipation at 25°C in Free Air (QFN, Note 4) . .2.976W Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Maximum Junction Temperature Range . . . . . . . . .-40°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (SOIC - Lead Tips Only) For Recommended soldering conditions see Tech Brief TB389. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied. NOTES: 1. All voltages referenced to VSS unless otherwise specified. 2. Based on VDD=15V. The magnitude of the allowable negative transient on the HS pin is a function of the VDD supply voltage. VHS