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ISL6729IB

ISL6729IB

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC REG CTRLR MULT TOPOLOGY 8SOIC

  • 数据手册
  • 价格&库存
ISL6729IB 数据手册
DATASHEET ISL6729 Low-Cost, Single-Ended, Current-Mode PWM for Microcontroller Based Power Converters The ISL6729 pulse width modulating (PWM) current mode controller is designed for power conversion applications that are based on a microcontroller, or other device, which can generate a digital clock signal at the desired switching frequency. Similar to the ISL684x family of products, the ISL6729 provides the basic current mode PWM control features, but eliminates the error amplifier, the oscillator, and the reference. An external clock signal applied to the oscillator input provides the time base and sets the maximum duty cycle. The reduced feature set is ideal for those applications where a microcontroller is available to provide the monitor and control functions. The analog PWM provides the cycle-by-cycle peak-current mode control, leaving the monitor and control overhead to the microcontroller. FN9152 Rev 3.00 December 21, 2016 Features • 5V operation • 1A MOSFET gate driver • 400µA startup current • 30ns propagation delay current sense to output • Fast transient response with peak-current mode control • Switching frequency to 2MHz • 20ns rise and fall times with 1nF output load • Maximum duty cycle determined by clock input duty cycle • Tight tolerance current limit threshold • Pb-free (RoHS compliant) PART NUMBER ISL6729 RISING UVLO 4.75V MAX. DUTY CYCLE 100% Applications • Telecom and datacom power Related Literature • Wireless base station power • For a full list of related documents, visit our website - ISL6729 product page • File server power Pin Configuration • PC power supplies • Industrial power systems • Isolated buck and flyback regulators ISL6729 (8 LD SOIC, MSOP) TOP VIEW COMP 1 8 N/C N/C 2 7 VDD CS 3 6 OUT CLKS 4 5 GND • Boost regulators Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (RoHS COMPLIANT) PKG. DWG. # ISL6729IBZ 6729IBZ -40 to +105 8 Ld SOIC M8.15 ISL6729IUZ (No longer available or supported) 6729Z -40 to +105 8 Ld MSOP M8.118 NOTES: 1. Add -T suffix for 2.5k unit tape and reel option. Refer to TB347 for details on reel specifications. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), see product information page for ISL6729. For more information on MSL, see tech brief TB363. FN9152 Rev 3.00 December 21, 2016 Page 1 of 8 ISL6729 FN9152 Rev 3.00 December 21, 2016 Functional Block Diagram VDD START/STOP UV COMPARATOR VDDOK + BG + - GND + - + - CS 100mV PWM COMPARATOR OUT 2R 1.1V CLAMP COMP R CLK S Q R Q FIGURE 1. FUNCTIONAL BLOCK DIAGRAM Page 2 of 8 VOLTAGE FEEDBACK ERROR AMPLIFIER 5V 1 COMP CLOCK 1 ISOLATION 8 2 VDD 7 3 CS OUT 6 POWER STAGE VOUT 4 CLK GND 5 ISL6729 CURRENT FEEDBACK 1 COMP CLOCK 2 MICROCONTROLLER 8 2 VDD 7 3 CS OUT 6 POWER STAGE 4 CLK GND 5 ISL6729 CURRENT FEEDBACK 1 COMP 2 8 VDD 7 POWER STAGE 3 CS OUT 6 CLOCK 3 ISL6729 FN9152 Rev 3.00 December 21, 2016 Typical Application - Interleaved Multiphase Isolated Converter 4 CLK GND 5 ISL6729 CURRENT FEEDBACK FIGURE 2. TYPICAL APPLICATION - INTERLEAVED MULTIPHASE ISOLATED CONVERTER Page 3 of 8 ISL6729 Absolute Maximum Ratings Thermal Information Supply Voltage, VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to +6.5V OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(GND - 0.3V) to VDD + 0.3V Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to 6.5V Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A ESD Classification Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . . . . . . . 2kV Charged Device Model (Per EOS/ESD DS5.3, 4/14/93). . . . . . . . . . 1kV Thermal Resistance (Typical, Note 4) JA (°C/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . .-55°C to +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Operating Conditions Temperature Range ISL6729Ix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C Supply Voltage Range (Typical) ISL6729 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.75V to 5.25V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 4. JA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. All voltages are with respect to GND. Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Figure 1 on page 2 and Figure 2 on page 3. VDD = 5V, CLK = 50kHz, TA = -40 to +105°C (Note 6), Typical values are at TA = +25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT START Threshold 4.15 4.50 4.75 V STOP Threshold 4.00 4.30 4.60 V UNDERVOLTAGE LOCKOUT Hysteresis - 0.2 - V Start-Up Current, IDD VDD < START threshold - 0.4 12 mA Operating Current, IDD (Note 7) - 3.3 5.5 mA Operating Supply Current, ID Includes 1nF GATE loading - 4.1 6.0 mA -1.0 - 1.0 µA CURRENT SENSE Input Bias Current VCS = 1V CS Offset Voltage VCS = 0V (Note 8) 95 100 105 mV COMP to PWM Comparator Offset Voltage VCS = 0V (Note 8) 0.80 1.15 1.30 V 0.91 0.97 1.03 V 2.5 3.0 3.5 V/V - 25 40 ns Input High Voltage Level, VIH - 2.8 - V Input Low Voltage Level, VIL - 2.7 - V (Note 8) 2 - - MHz Gate VOH VDD - OUT, IOUT = -200mA - 1.0 2.0 V Gate VOL OUT - GND, IOUT = 200mA - 1.0 2.0 V Peak Output Current COUT = 1nF (Note 8) 1.0 - - A Rise Time COUT = 1nF (Note 8) - 20 40 ns Fall Time COUT = 1nF (Note 8) - 20 40 ns CS Input Signal, Maximum Gain, ACS = VCOMP/VCS 0 < VCS < 910mV, VFB = 0V. (Note 8) CS to OUT Delay (Note 8) CLOCK Maximum Clock Rate OUTPUT FN9152 Rev 3.00 December 21, 2016 Page 4 of 8 ISL6729 Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Figure 1 on page 2 and Figure 2 on page 3. VDD = 5V, CLK = 50kHz, TA = -40 to +105°C (Note 6), Typical values are at TA = +25°C (Continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Maximum Duty Cycle - 99 - % Minimum Duty Cycle - - 0 % PWM NOTES: 6. Specifications at -40°C are established by design, not production tested. 7. This is the VDD current consumed when the device is active but not switching. Does not include gate drive current. 8. Established by design, not 100% tested in production. Pin Descriptions Applications Information CLK - This is the oscillator timing control pin. The operational frequency and maximum duty cycle are set by applying a 5V amplitude clock signal to CLK. The logic high duration defines the maximum ON time for the output. A maximum clock rate up to 2.0MHz is possible. Microcontrollers are becoming more popular for monitoring and supervisory functions in power converters due to their flexibility, capability, and declining prices. Many applications would like to take advantage of this flexibility and use them to perform the control loop function as well. There are many examples of voltage mode control using digital signal processing techniques. However, microcontrollers available today do not have the execution speed required for peak current mode control at the operational frequencies of modern switch-mode power supplies. As such, they are unable to detect the peak current and terminate the switching cycle within the few nanosecond window required. The ISL6729 provides the analog circuitry required to perform peak current control, but delegates the oscillator function to the microcontroller. This arrangement allows the microcontroller to control soft-start, maximum duty cycle, and operational frequency of the power converter, as well as performing the traditional overhead functions such as fault monitoring and system interface. COMP - COMP is the input to the PWM comparator and is typically controlled through an external error amplifier. CS - This is the current sense input to the PWM comparator. The range of the input signal is nominally 0 to 1.0V and has an internal offset of 100mV. GND - GND is the power and small signal reference ground for all functions. OUT - This is the drive output to the power switching device. It is a high current output capable of driving the gate of a power MOSFET with peak currents of 1.0A. This GATE output is actively held low when VDD is below the UVLO threshold. VDD - VDD is the 5V power connection for the IC. The IC will operate from 4.75V to 5.25V. However, the accuracy of the voltage clamp on the COMP signal, which determines the overcurrent threshold, is dependent on the accuracy of VDD. A tight tolerance on VDD will result in a tight overcurrent threshold. The total supply current will depend on the load applied to OUT. Total IDD current is the sum of the operating current and the average output current. Knowing the operating frequency, f, and the MOSFET gate charge, Qg, the average output current can be calculated from: I OUT = Qg  f (EQ. 1) To optimize noise immunity, bypass VDD to GND with a ceramic capacitor as close to the VDD and GND pins as possible. Ground Plane Requirements Careful layout is essential for satisfactory operation of the device. A good ground plane must be employed. A unique section of the ground plane must be designated for high di/dt currents associated with the output stage. VDD should be bypassed directly to GND with good high frequency capacitors. FN9152 Rev 3.00 December 21, 2016 Application of the ISL6729 is similar to the ISL684x family of PWM converters except that the input bias voltage has been changed to 5V and the oscillator, reference, and error amplifier functions have been removed. An external digital clock signal, such as the PWM output of a microcontroller, must be supplied to control the frequency and maximum duty cycle. The frequency of the applied clock signal and the frequency of operation of the PWM are identical. The duty cycle of the clock is the maximum duty cycle of the PWM. Soft-start may be accomplished by incrementing the duty cycle of the applied clock signal from zero to the maximum desired value in a time frame appropriate for the application. Figure 2 on page 3 illustrates how the ISL6729 may be used for an interleaved power converter. In this example, three clock signals of equal duty cycle, but phased 120° apart, are applied to separate power stages. Each phase shares a common voltage feedback signal, but uses separate current feedback signals from each power stage for regulation. Excellent current sharing behavior is assured since each phase must produce the same peak current. Accuracy is determined by the variation of the output inductor value and the feedback components. Multiple output power supplies can be created in a similar fashion. Only one clock signal is required if in-phase operation is desired. Each stage may be independently controlled using separate voltage and current feedback loops. Page 5 of 8 ISL6729 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE December 21, 2016 FN9152.3 Updated entire datasheet with new formatting. Updated Notes 1 and 2. Added Note 3. Updated Ordering Information table. Added Related Literature, Revision History, and About Intersil sections. Updated POD M8.15 to the latest revision. Changes are as follows: -Updated to new POD format by removing table and moving dimensions onto drawing and adding land pattern. - Changed in Typical Recommended Land Pattern the following: 2.41(0.095) to 2.20(0.087) 0.76 (0.030) to 0.60(0.023) 0.200 to 5.20(0.205) -Changed Note 1 “1982” to “1994”. Updated POD M8.118 to the latest revision. Changes are as follows: -Updated to new Intersil format by adding land pattern and moving dimensions from table onto drawing. -Corrected lead width dimension in side view 1 from “0.25 - 0.036” to “0.25 - 0.36”. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing, and high-end consumer markets. For the most updated datasheet, application notes, related documentation, and related parts, see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. © Copyright Intersil Americas LLC 2004-2016. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN9152 Rev 3.00 December 21, 2016 Page 6 of 8 ISL6729 Package Outline Drawing For the most recent package outline drawing, see M8.15. M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN9152 Rev 3.00 December 21, 2016 Page 7 of 8 ISL6729 Package Outline Drawing For the most recent package outline drawing, see M8.118. M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 4, 7/11 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.36 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN FN9152 Rev 3.00 December 21, 2016 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. Page 8 of 8
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