USER’S MANUAL
ISL8117DEMO1Z
UG031
Rev 0.00
May 22, 2015
Demonstration Board User Guide
Description
Key Features
The ISL8117DEMO1Z demonstration board (shown in Figure 1)
features the ISL8117. The ISL8117 is a 60V high voltage
synchronous buck controller that offers external soft-start,
independent enable functions and integrates UV/OV/OC/OT
protection. Its current mode control architecture and internal
compensation network keep peripheral component count
minimal. Programmable switching frequency ranging from
100kHz to 2MHz helps to optimize inductor size while the
strong gate driver delivers up to 30A for the buck output.
• Small, compact design
Specifications
• PGOOD indicator
The ISL8117DEMO1Z demonstration board is designed for
high current applications. The current rating of the
ISL8117DEMO1Z is limited by the FETs and inductor selected.
The electrical ratings of ISL8117DEMO1Z are shown in
Table 1.
TABLE 1. ELECTRICAL RATINGS
PARAMETER
Input Voltage
RATING
4.5V to 60V
Switching Frequency 600kHz
Output Voltage
3.3V
Output Current
6A
OCP Set Point
Minimum 8A at ambient room temperature
• Wide input range: 4.5V to 60V
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/CCM operation
• Supports prebias output with SR soft-start
• External frequency sync
• OCP, OVP, OTP, UVP protection
References
• ISL8117 datasheet
Ordering Information
PART NUMBER
ISL8117DEMO1Z
DESCRIPTION
High Voltage PWM Step-Down
Synchronous Buck Controller
Recommended Testing
Equipment
The following materials are recommended to perform testing:
• 0V to 60V power supply with at least 10A source current
capability
• Electronic loads capable of sinking current up to 10A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
FIGURE 1. ISL8117DEMO1Z DEMONSTRATION BOARD TOP
UG031 Rev 0.00
May 22, 2015
FIGURE 2. ISL8117DEMO1Z DEMONSTRATION BOARD BOTTOM
Page 1 of 12
ISL8117DEMO1Z
Quick Test Guide
Operating Range
1. Ensure that the circuit is correctly connected to the supply and
electronic loads prior to applying any power. Please refer to
Figure 4 for proper setup.
The input voltage range is from 4.5V to 60V for an output voltage
of 3.3V. The rated load current is 6A with the OCP point set at
minimum 8A at room temperature ambient conditions.
2. Turn on the power supply.
The temperature operating range of ISL8117 is -40°C to +125°C.
Please note that airflow is needed for higher temperature
ambient conditions.
3. Adjust input voltage VIN within the specified range and
observe output voltage. The output voltage variation should
be within 3%.
4. Adjust load current within the specified range and observe
output voltage. The output voltage variation should be
within 3%.
5. Use an oscilloscope to observe output voltage ripple and
phase node ringing. For accurate measurement, please refer
to Figure 3 for proper test setup.
OUTPUT
CAP
OUTPUT
OUTPUT
CAP
CAP
OR
ORMOSFET
MOSFET
FIGURE 3. PROPER PROBE SETUP TO MEASURE OUTPUT RIPPLE
AND PHASE NODE RINGING
Functional Description
The ISL8117DEMO1Z is a compact design with high efficiency
and high power density.
As shown in Figure 4 on page 3, 4.5V to 60V VIN is supplied to J1
(+) and J2 (-). The regulated 3.3V output on J3 (+) and J5 (-) can
supply up to 6A to the load.
UG031 Rev 0.00
May 22, 2015
Layout Guidelines
Careful attention to layout requirements is necessary for
successful implementation of an ISL8117 based DC/DC
converter. The ISL8117 switches at a very high frequency and
therefore the switching times are very short. At these switching
frequencies, even the shortest trace has significant impedance.
Also, the peak gate drive current rises significantly in an
extremely short time. Transition speed of the current from one
device to another causes voltage spikes across the
interconnecting impedances and parasitic circuit elements.
These voltage spikes can degrade efficiency, generate EMI and
increase device overvoltage stress and ringing. Careful
component selection and proper PC board layout minimizes the
magnitude of these voltage spikes.
There are three sets of critical components in a DC/DC converter
using the ISL8117: the controller, the switching power
components and the small signal components. The switching
power components are the most critical from a layout point of
view because they switch a large amount of energy which tends
to generate a large amount of noise. The critical small signal
components are those connected to sensitive nodes or those
supplying critical bias currents. A multilayer printed circuit board
is recommended.
Page 2 of 12
ISL8117DEMO1Z
Layout Considerations
1. The input capacitors, upper FET, lower FET, inductor and
output capacitor should be placed first. Isolate these power
components on dedicated areas of the board with their
ground terminals adjacent to one another. Place the input
high frequency decoupling ceramic capacitors very close to
the MOSFETs.
2. If signal components and the IC are placed in a separate area
to the power train, it is recommend to use full ground planes
in the internal layers with shared SGND and PGND to simplify
the layout design. Otherwise, use separate ground planes for
power ground and small signal ground. Connect the SGND
and PGND together close to the IC. DO NOT connect them
together anywhere else.
3. The loop formed by the input capacitor, the top FET and the
bottom FET must be kept as small as possible.
4. Ensure the current paths from the input capacitor to the
MOSFET, to the output inductor and the output capacitor are
as short as possible with maximum allowable trace widths.
5. Place the PWM controller IC close to the lower FET. The LGATE
connection should be short and wide. The IC can be best
placed over a quiet ground area. Avoid switching ground loop
currents in this area.
6. Place VCC5V bypass capacitor very close to the VCC5V pin of
the IC and connect its ground to the PGND plane.
A
8. The output capacitors should be placed as close to the load as
possible. Use short wide copper regions to connect output
capacitors to load to avoid inductance and resistances.
9. Use copper filled polygons or wide but short trace to connect
the junction of upper FET, lower FET and output inductor. Also
keep the PHASE node connection to the IC short. DO NOT
unnecessarily oversize the copper islands for the PHASE
node. Since the phase nodes are subjected to very high dv/dt
voltages, the stray capacitor formed between these islands
and the surrounding circuitry will tend to couple switching
noise.
10. Route all high speed switching nodes away from the control
circuitry.
11. Create a separate small analog ground plane near the IC.
Connect the SGND pin to this plane. All small signal grounding
paths including feedback resistors, current limit setting
resistor, soft-starting capacitor and EN pull-down resistor
should be connected to this SGND plane.
12. Separate the current sensing trace from the PHASE node
connection.
13. Ensure the feedback connection to the output capacitor is
short and direct.
-
VO
+
-
+
VIN
LOAD
+
7. Place the gate drive components (optional BOOT diode and
BOOT capacitors) together near the controller IC.
V
+
-
A
-
FIGURE 4. PROPER TEST SETUP
UG031 Rev 0.00
May 22, 2015
Page 3 of 12
ISL8117DEMO1Z
Typical Demonstration Board Performance Curves
VIN = 24V, VOUT = 3.3V, unless
100
3.45
90
3.43
80
3.41
70
60
VIN = 60V
VIN = 24V
VIN = 12V
50
VIN = 6V
40
3.33
20
3.29
10
3.27
1
2
3
4
5
3.25
6
VIN = 12V
0
1
2
3
IOUT (A)
3.45
90
3.43
VIN = 12V
VIN = 6V
VOUT (V)
EFFICIENCY (%)
VIN = 48V
40
VIN = 60V
3.29
10
3.27
2
3
4
5
6
VIN = 6V
3.33
20
1
3.25
IOUT (A)
VIN = 12V
0
1
2
3
4
VIN = 60V
5
6
IOUT (A)
FIGURE 7. DEM EFFICIENCY vs LOAD
FIGURE 8. DEM LOAD REGULATION
PHASE 20V/DIV
LGATE 5V/DIV
CLKOUT 5V/DIV
IL 5A/DIV
1µs/DIV
FIGURE 9. PHASE, LGATE, CLKOUT AND INDUCTOR CURRENT WAVEFORMS, VIN = 24V, IO = 6A
UG031 Rev 0.00
May 22, 2015
7
3.35
3.31
0
VIN = 48V
3.37
30
0
VIN = 24V
3.39
50
6
3.41
VIN = 24V
60
5
FIGURE 6. CCM LOAD REGULATION
100
70
4
VIN = 60V
IOUT (A)
FIGURE 5. CCM EFFICIENCY vs LOAD
80
VIN = 6V
3.35
3.31
0
VIN = 48V
3.37
30
0
VIN = 24V
3.39
VIN = 48V
VOUT (V)
EFFICIENCY (%)
otherwise noted.
Page 4 of 12
7
ISL8117DEMO1Z
Typical Demonstration Board Performance Curves
VIN = 24V, VOUT = 3.3V, unless
otherwise noted. (Continued)
VOUT 10mV/DIV, VIN = 24V, IO = 0A
VOUT 10mV/DIV, VIN = 24V, IO = 0A
2ms/DIV
VOUT 10mV/DIV, VIN = 24V, IO = 6A
VOUT 10mV/DIV, VIN = 24V, IO = 6A
4µs/DIV
2µs/DIV
FIGURE 10. OUTPUT RIPPLE, CCM MODE
VOUT 2V/DIV
FIGURE 11. OUTPUT RIPPLE, DEM MODE
VOUT 2V/DIV
LGATE 5V/DIV
LGATE 5V/DIV
CLKOUT 5V/DIV
CLKOUT 5V/DIV
IL 1A/DIV
IL 2A/DIV
4ms/DIV
4ms/DIV
FIGURE 12. CCM START-UP WAVEFORMS: VIN = 24V, IO = 0A
FIGURE 13. DEM START-UP WAVEFORMS: VIN = 24V, IO = 0A
VOUT 2V/DIV
VOUT 2V/DIV
SS 2V/DIV
SS 2V/DIV
EN 5V/DIV
EN 5V/DIV
PGOOD 5V/DIV
PGOOD 5V/DIV
10ms/DIV
10ms/DIV
FIGURE 14. CCM START-UP WAVEFORMS: VIN = 24V, IO = 0A
FIGURE 15. DEM START-UP WAVEFORMS: VIN = 24V, IO = 0A
UG031 Rev 0.00
May 22, 2015
Page 5 of 12
ISL8117DEMO1Z
Typical Demonstration Board Performance Curves
VIN = 24V, VOUT = 3.3V, unless
otherwise noted. (Continued)
LGATE 5V/DIV
SS 1V/DIV
VOUT 5V/DIV
PGOOD 5V/DIV
4ms/DIV
FIGURE 16. TRACKING WAVEFORMS, VIN = 24V, IO = 0A
VOUT 100mV/DIV
CLKOUT 5V/DIV
SYNC 5V/DIV
IL 1A/DIV
1µs/DIV
FIGURE 17. FREQUENCY SYNCHRONIZATION WAVEFORMS,
VIN = 24V, IO = 0A
VOUT 2V/DIV
SS 2V/DIV
PGOOD 5V/DIV
IOUT 5A/DIV
IL 10A/DIV
400µs/DIV
FIGURE 18. LOAD TRANSIENT; VIN = 24V, IO = 0A TO 6A, 1A/µs,
CCM MODE
UG031 Rev 0.00
May 22, 2015
200ms/DIV
FIGURE 19. SHORT-CIRCUIT WAVEFORMS, VIN = 24V
Page 6 of 12
ISL8117DEMO1Z
UG031 Rev 0.00
May 22, 2015
Schematic
Page 7 of 12
FIGURE 20. ISL8117DEMO1Z SCHEMATIC
ISL8117DEMO1Z
ISL8117DEMO1Z Bill of Materials
PART NUMBER
REFERENCE
DESIGNATOR
QTY UNITS
DESCRIPTION
MANUFACTURER
MANUFACTURER PART
PWB-PCB, ISL8117DEMO1Z,
REVB, ROHS
ISL8117DEMO1ZREVAPCB
SHENZHEN
MULTILAYER PCB
TECHNOLOGY CO., LTD
C10, C11
CAP, SMD, 1210, 100µF, 6.3V,
20%, X7S, ROHS
MURATA
GRM32EC70J107ME15L
ea
C4, C22
CAP, SMD, 0603, 0.1µF, 100V,
10%, X7R, ROHS
VENKEL
C0603X7R101-104KNE
1
ea
C25
CAP, SMD, 0603, 0.1µF, 25V, 10%, MURATA
X7R, ROHS
GRM39X7R104K025AD
H1045-00105-6R3V10-T
4
ea
C8, C9, C38, C39
CAP, SMD, 0603, 1µF, 6.3V, 10%, PANASONIC
X5R, ROHS
ECJ1VB0J105K
H1045-00121-50V5-T
1
ea
C6
CAP, SMD, 0603, 120pF, 50V, 5%, TDK
C0G, ROHS
C1608C0G1H121J080AA
H1045-00224-25V10-T
1
ea
C2
CAP, SMD, 0603, 0.22µF, 25V,
10%, X7R, ROHS
TDK
C1608X7R1E224K
H1045-00471-100V10-T
1
ea
C7
CAP, SMD, 0603, 470pF, 100V,
10%, X7R, ROHS
VISHAY
VJ0603Y471KXBA
H1045-00473-25V10-T
1
ea
C3
CAP, SMD, 0603, 0.047µF, 25V,
10%, X7R, ROHS
MURATA
GRM188R71E473KA01D
H1046-00475-10V20-T
1
ea
C1
CAP, SMD, 0805, 4.7µF, 10V, 20%, AVX
X5R, ROHS
0805ZD475MAT2A
H1065-00105-100V10-T
2
ea
C23, C24
CAP, SMD, 1206, 1µF, 100V, 10%, VENKEL
X7R, ROHS
C1206X7R101-105KNE
H1082-00475-100V10-T
8
ea
C13, C21, C28, C29, CAP, SMD, 1210, 4.7µF, 100V,
C33, C34, C35, C36 10%, X7S, ROHS
H1082-DNP
0
ea
C37
CAP, SMD, 1210, DNP-PLACE
HOLDER, ROHS
7443340330
1
ea
L1
COIL-PWR INDUCTOR, SMD,
Wurth Electronics
8.4x7.9, 3.3µH, 20%, 14A, ROHS
7443340330
1514-2
4
ea
J1, J2, J3, J5
CONN-TURRET, TERMINAL POST,
TH, ROHS
1514-2
ISL8117FVEZ
1
ea
U1
IC-55V SWITCHING CONTROLLER, INTERSIL
16P, HTSSOP, ROHS
BUK9K17-60EX-T
1
ea
Q1
TRANSIST-MOS, DUAL
N-CHANNEL, SMD, 8P, 56LFPAK,
60V, 26A, ROHS
NXP SEMICONDUCTOR BUK9K17-60EX
H2511-00100-1/10W1-T
1
ea
R21
RES, SMD, 0603, 10Ω, 1/10W,
1%, TF, ROHS
KOA
RK73H1JT10R0F
H2511-002R2-1/10W1-T
2
ea
R8, R9
RES, SMD, 0603, 2.2Ω, 1/10W,
1%, TF, ROHS
PANASONIC
ERJ-3RQF2R2V
H2511-005R1-1/10W1-T
1
ea
R26
RES, SMD, 0603, 5.1Ω, 1/10W,
1%, TF, ROHS
VENKEL
CR0603-10W-05R1FT
H2511-00R00-1/10W-T
3
ea
R22, R25, R28
RES, SMD, 0603, 0Ω, 1/10W, TF, VENKEL
ROHS
CR0603-10W-000T
H2511-01003-1/10W1-T
1
ea
R16
RES, SMD, 0603, 100k, 1/10W,
1%, TF, ROHS
VENKEL
CR0603-10W-1003FT
H2511-01102-1/10W1-T
1
ea
R2
RESISTOR, SMD, 0603, 11k,
1/10W, 1%, TF, ROHS
PANASONIC
ERJ-3EKF1102V
ISL8117DEMO1ZREVAPCB
1
ea
GRM32EC70J107ME15L-T
2
ea
H1045-00104-100V10-T
2
H1045-00104-25V10-T
UG031 Rev 0.00
May 22, 2015
TDK
KEYSTONE
CGA6M3X7S2A475K200AB
ISL8117FVEZ
Page 8 of 12
ISL8117DEMO1Z
ISL8117DEMO1Z Bill of Materials
PART NUMBER
REFERENCE
DESIGNATOR
QTY UNITS
(Continued)
DESCRIPTION
MANUFACTURER
MANUFACTURER PART
H2511-03001-1/10W1-T
1
ea
R7
RES, SMD, 0603, 3k, 1/10W, 1%, YAGEO
TF, ROHS
RC0603FR-073KL
H2511-04992-1/10W1-T
1
ea
R1
RES, SMD, 0603, 49.9k, 1/10W,
1%, TF, ROHS
CR0603-10W-4992FT
H2511-DNP
0
ea
R4, R5, R6, R27
RES, SMD, 0603, DNP-PLACE
HOLDER, ROHS
RC0603FR-0713KL
1
R3
RES SMD 13kΩ 1% 1/10W 0603
DNP
0
C40
DO NOT POPULATE OR PURCHASE
UG031 Rev 0.00
May 22, 2015
ea
VENKEL
RC0603FR-0713KL
Page 9 of 12
ISL8117DEMO1Z
UG031 Rev 0.00
May 22, 2015
ISL8117DEMO1Z PCB Layout
Page 10 of 12
FIGURE 21. TOP LAYER
FIGURE 22. SECOND LAYER (SOLID GROUND)
FIGURE 23. THIRD LAYER
FIGURE 24. BOTTOM LAYER
ISL8117DEMO1Z
UG031 Rev 0.00
May 22, 2015
ISL8117DEMO1Z PCB Layout
(Continued)
FIGURE 25. SILKSCREEN TOP
FIGURE 26. SILKSCREEN BOTTOM
Page 11 of 12
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2.
Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4.
You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
you or third parties arising from such alteration, modification, copying or reverse engineering.
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6.
When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2)
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
Colophon 7.0