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ISL81802FRTZ-T7A

ISL81802FRTZ-T7A

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    WFQFN32

  • 描述:

    80V DUAL SYNC BUCK CONTROLLER 32

  • 数据手册
  • 价格&库存
ISL81802FRTZ-T7A 数据手册
Datasheet ISL81802 80V Dual Synchronous Buck Controller The ISL81802 is a dual synchronous buck controller that generates two independent outputs or one output with two interleaved phases for a wide variety of applications in industrial and general purpose segments. With a wide input and output voltage ranges, the controller is suitable for telecommunication, data center, and computing applications. The ISL81802 uses peak current mode control with phase interleaving for the two outputs. Each output has a voltage regulator, current monitor, and average current regulator to provide independent average voltage and current control. The internal Phase-Locked Loop (PLL) oscillator assures an accurate frequency setting from 100kHz to 1MHz, and the oscillator can be synchronized to an external clock signal for frequency synchronization and phase interleave paralleling applications. This PLL circuit can output a phase-shift-programmable clock signal that is expanded to three, four, and six phases with required interleaving phase shift. The ISL81802 features programmable soft-start and accurate threshold enable functions along with a power-good indicator to simplify power supply rail sequencing. It also provides full protection features such as OVP, UVP, OTP, and average and peak current limit on both outputs to ensure high reliability. Features • Wide input voltage range: 4.5V to 80V • Wide output voltage range: 0.8V to 76V • Four MOSFET drivers with adaptive shoot-through protection • Constant output voltage and output current feedback loop control • Light-load efficiency enhancement ○ Low ripple diode emulation and burst mode operation • Programmable soft-start • Supports startup into pre-biased rails • Programmable frequency: 100kHz to 1MHz • Supports current sharing with cascade phase interleaving • External clock sync • Clock out with accurate phase angle controlled by PLL or frequency dithering • PGOOD indicator • Output current monitor • Selectable mode between PWM/DE/Burst • Accurate EN/UVLO threshold: ±2% The IC is packaged in a spac- conscious 32 Ld 5mmx5mm TQFN or an easy to assemble 4.4mmx9.7mm 38 Ld HTSSOP package. Both packages use an EPAD to improve thermal performance and noise immunity. The full feature design with low pin count makes the ISL81802 an ideal solution for quick time to market simple power supply designs. • Low shut down current: 5µA Related Literature • Server and data center For a full list of related documents, visit our website: • ISL81802 device page R16DS0033EU0101 Rev.1.01 Oct.15.20 • Complete protection: OCP (pulse by pulse and optional hiccup or constant current mode), OVP, OTP, and UVP Applications • Telecommunication • Automotive electronics • Industrial equipment • Power system Page 1 of 44 ISL81802 PGND SGND CS1+ CS1- VDD VIN EN/UVLO2 EN/UVLO1 VIN ISL81802 TQFN VCC5V VDD BOOT1 UG1 PLL_COMP VOUT CLKOUT/DITHER PHASE1 RT/SYNC LG1/PWM_MODE FB1 EPAD VDD COMP1 BOOT2 SS/TRK1 UG2 SS/TRK2/OV PHASE2 COMP2/CLKEN EXTBIAS CS2+ LG2/OC_MODE CS2- PGOOD IMON2 IMON1 FB2/PFMEN Figure 1. Typical Application Diagram 100 98 Efficiency (%) 96 94 92 90 88 86 Vin = 18V Vin = 36V Vin = 60V 84 82 Vin = 24V Vin = 48V Vin = 80V 80 0 5 10 15 20 Output Current (A) Figure 2. Efficiency (VOUT = 12V, CC Mode) R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 2 of 44 ISL81802 Contents 1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 1.2 1.3 1.4 1.5 2. Typical Application Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 7 7 8 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1 2.2 2.3 2.4 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3. Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 4.11 4.12 4.13 5. General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal 8V Linear Regulator (VDD), External Bias Supply (EXTBIAS), and 5V Linear Regulator (VCC5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Enable (EN/UVLO) and Soft-Start Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tracking Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Control Loops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Light-Load Efficiency Enhancement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prebiased Power-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frequency Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Phase Lock Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frequency Synchronization, Multi-Phase Operation and Dithering . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Operation Current Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate Drivers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-Good Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 24 26 26 28 30 30 30 31 32 33 34 Protection Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.1 5.2 5.3 5.4 5.5 6. Input Undervoltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC5V Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overcurrent Protection (OCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overvoltage Protection (OVP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Over-Temperature Protection (OTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 35 35 36 36 Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 6.1 6.2 7. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 General EPAD Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Component Selection Guideline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.1 7.2 7.3 7.4 MOSFET Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inductor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Capacitor Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 39 39 41 8. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 9. Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 3 of 44 Overview 1.1 ISL81802 Typical Application Schematics 9,1 N 5 N   Q & X & Q 5 N & S 4 1026  8* (;7%,$6   9,1  &6 (189/2 ,021     )% &203 X+ 3+$6( 6675. %227    9&&9 /*3:0B02'( 8 1& 3*1' ,6/ 576 8.6V, EXTBIAS = 0V, IL = 75mA 7.30 7.8 V VIN = 4.5V, EXTBIAS > 9.0V, IL = 75mA (Note 10) 7.30 7.8 V VVDD = 0V, EXTBIAS = 0V, VIN = 12V 120 mA VVDD = 4.5V, EXTBIAS = 12V, VIN = 4.5V 140 mA EXTBIAS Supply Switch Over Threshold Voltage, Rising VEXT_THR EXTBIAS voltage 7.10 7.38 7.55 V Switch Over Threshold Voltage, Falling VEXT_THF EXTBIAS voltage 6.60 6.85 7.10 V VIN UVLO VIN Rising UVLO Threshold VUVLOTHR VIN Falling UVLO Threshold VUVLOTHF VIN voltage, 0mA on VCC5V and VDD VCC5V Rising POR Threshold VPORTHR VCC5V voltage, 0mA on VCC5V and VDD 3.7 4.0 4.3 V VCC5V Falling POR Threshold VPORTHF VCC5V voltage, 0mA on VCC5V and VDD 3.30 3.55 3.75 V 3.5 V 3.3 V VCC5V Power-On Reset EN/UVLO Threshold EN1 Rise Threshold VEN1SS_THR VIN > 5.6V 0.75 1.05 1.30 V EN1 Fall Threshold VEN1SS_THF VIN > 5.6V 0.60 0.90 1.10 V EN1 Hysteresis VEN1SS_HYST VIN > 5.6V 70 150 300 mV R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 12 of 44 ISL81802 2. Specifications Recommended operating conditions unless otherwise noted. See the Block Diagram and Typical Application Schematics. VIN = 4.5V to 80V, or VDD = 8V ±10%, C_VCC5V = 4.7µF, TA = -40°C to +125°C, Typical values are at TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) Parameter Symbol Test Conditions Min (Note 6) Typ Max (Note 6) Unit UVLO1 Rise Threshold VUVLO1_THR VIN > 5.6V 1.77 1.80 1.83 V UVLO1 Hysteresis Current IUVLO1_HYST VIN = 12V, EN/UVLO = 1.815V 2.5 4.4 6.0 µA EN2 Rise Threshold VEN2SS_THR VIN > 5.6V 0.75 1.05 1.30 V EN2 Fall Threshold VEN2SS_THF VIN > 5.6V 0.60 0.90 1.10 V EN2 Hysteresis VEN2SS_HYST VIN > 5.6V 70 150 300 mV UVLO2 Rise Threshold VUVLO2_THR VIN > 5.6V 1.77 1.80 1.83 V UVLO2 Hysteresis Current IUVLO2_HYST VIN = 12V, EN/UVLO = 1.815V 2.5 4.4 6.0 µA Soft-Start Current SS/TRK1 Soft-Start Charge Current ISS1 SS/TRK = 0V 2.00 µA SS/TRK2 Soft-Start Charge Current ISS2 SS/TRK = 0V 2.00 µA Default Internal Output Ramping Time1 tSS1_MIN SS/TRK open 1.7 ms Default Internal Output Ramping Time2 tSS2_MIN SS/TRK open 1.7 ms Default Internal Minimum Soft-Starting Power-Good Monitors PGOOD Upper Threshold VPGOV 107 109 112 % PGOOD Lower Threshold VPGUV 87 90 92 % 0.35 V 0 150 nA 5 ms PGOOD Low Level Voltage PGOOD Leakage Current VPGLOW I_SINK = 2mA IPGLKG PGOOD = 5V PGOOD Timing VOUT Rising Threshold to PGOOD Rising (Note 9) tPGR 1.1 VOUT Falling Threshold to PGOOD Falling tPGF 80 µs VREFV 0.800 V Reference Section Internal Voltage Loop Reference Voltage Reference Voltage Accuracy Internal Current Loop Reference Voltage TA = 0°C to +85°C -0.75 +0.75 % TA = -40°C to +125°C -1.00 +1.00 % VREFI Reference Voltage Accuracy 1.200 V TA = 0°C to +85°C -0.75 +0.75 % TA = -40°C to +125°C -1.00 +1.00 % +50 nA PWM Controller Error Amplifiers FB_1 Pin Bias Current IFBOUTLKG1 -50 0 FB_1 Error Amp GM Gm1 1.75 mS FB_1 Error Amp Voltage Gain AV1 82 dB GBW1 8 MHz 300 µA FB_1 Error Amp Gain-BW Product FB_1 Error Amp Output Current Capability FB_2 Pin Bias Current FB_2 Error Amp GM R16DS0033EU0101 Rev.1.01 Oct.15.20 IFBOUTLKG2 Gm2 -50 0 1.75 +50 nA mS Page 13 of 44 ISL81802 2. Specifications Recommended operating conditions unless otherwise noted. See the Block Diagram and Typical Application Schematics. VIN = 4.5V to 80V, or VDD = 8V ±10%, C_VCC5V = 4.7µF, TA = -40°C to +125°C, Typical values are at TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) Parameter FB_2 Error Amp Voltage Gain FB_2 Error Amp Gain-BW Product Symbol Test Conditions Min (Note 6) Typ Max (Note 6) Unit AV2 82 dB GBW2 8 MHz 300 µA FB_2 Error Amp Output Current Capability COMP1 Max High Voltage VCOMP1_HIGH FB_OUT = 0V 4.7 V COMP1 Min Low Voltage VCOMP1_LOW FB_OUT = 1V 0.01 V COMP2 Max High Voltage VCOMP2_HIGH FB_OUT = 0V 4.7 V COMP2 Min Low Voltage VCOMP2_LOW FB_OUT = 1V 0.01 V PWM Regulator PWM1 Minimum Off-Time tOFF_MIN1 220 ns PWM1 Minimum On-Time tON_MIN1 100 ns PWM2 Minimum Off-Time tOFF_MIN2 220 ns PWM2 Minimum On-Time tON_MIN2 100 ns PMW1 Peak-to-Peak Sawtooth Amplitude DVRAMP1 VIN = VOUT = 12V, fSW = 300kHz 1.0 V PMW2 Peak-to-Peak Sawtooth Amplitude DVRAMP2 VIN = VOUT = 12V, fSW = 300kHz 1.0 V PMW1 Ramp Offset VROFFSET1 0.9 1.1 1.25 V PMW2 Ramp Offset VROFFSET2 0.9 1.1 1.25 V Current Sense, Current Monitors, and Average Current Loop Current Sense1 Differential Voltage Range Current Sense1 Common-Mode Voltage Range VCS1+ - VCS1- -80 +150 mV CMIRCS1 0 80 V CS1+ Bias Current CS1+ = CS1- = 12V 3 µA CS1- Bias Current CS1+ = CS1- = 12V 400 µA IMON1 Offset Current Current Sense1 Voltage to IMON1 Current Source Gain ICS1OFFSET GmCS1 CS1+ = CS1- = 12V 17.0 19.5 21.5 µA 12V common-mode voltage applied to CS1± pins, 0 to 40mV differential voltage 165 200 235 µS IMON1 Error Amp GM Gm3 12 µS IMON1 Error Amp Voltage Gain AV3 72 dB IMON1 Active Range (Note 10) VIMON1_ACT VCC5V = 5V VIMON1_H VCC5V = 5V IMON1 Logic High Threshold (Note 10) 0 4.3 V 4.7 V IMON1 Error Amp Gain-BW Product GBW3 Current Sense2 Differential Voltage Range VCS2+ - VCS2- -80 +150 mV CMIRCS2 0 80 V Current Sense2 Common-Mode Voltage Range 5 MHz CS2+ Bias Current CS2+ = CS2- = 12V 3 µA CS2- Bias Current CS2+ = CS2- = 12V 400 µA IMON2 Offset Current IMON2 Current R16DS0033EU0101 Rev.1.01 Oct.15.20 ICS2OFFSET CS2+ = CS2- = 12V CS2+ = 12V. CS2- = 11.96V 17.0 19 21 µA 25 27.5 28.5 µA Page 14 of 44 ISL81802 2. Specifications Recommended operating conditions unless otherwise noted. See the Block Diagram and Typical Application Schematics. VIN = 4.5V to 80V, or VDD = 8V ±10%, C_VCC5V = 4.7µF, TA = -40°C to +125°C, Typical values are at TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) Parameter Symbol Current Sense2 Voltage to IMON2 Current Source Gain GmCS2 Test Conditions 12V common-mode voltage applied to CS2± pins, 0mV to 40mV differential voltage Min (Note 6) Typ 165 205 Max (Note 6) Unit 235 µS IMON2 Error Amp GM Gm4 12 µS IMON2 Error Amp Voltage Gain AV4 72 dB GBW4 5 MHz IMON2 Error Amp Gain-BW Product Switching Frequency and Synchronization Switching Frequency RT Voltage SYNC Synchronization Range fSW VRT RT = 144kΩ 220 245 265 kHz RT = 72kΩ 420 450 485 kHz RT Open or to VCC5V 90 120 145 kHz RT = 0V 470 575 650 kHz RT = 72kΩ fSYNC 560 140 SYNC Input Logic High VSYNCH (Note 10) SYNC Input Logic Low VSYNCL (Note 10) CLKOUT Output High VCLKH ISOURCE = 1mA, VCC5V = 5V CLKOUT Output Low VCLKL ISINK = 1mA CLKOUT Frequency fCLK mV 1000 3.2 kHz V 0.5 V Clock Output and Frequency Dither Dither Mode Setting Current Source IDITHER_MODE_SO Dither Mode Setting Threshold Low VDITHER_MODE_L Dither Mode Setting Threshold High VDITHER_MODE_H RT = 72kΩ 4.55 420 V 450 0.3 V 485 kHz 12 µA 0.26 V 0.34 V Dither Source Current IDITHERSO 8 µA Dither Sink Current IDITHERSI 10 µA Dither High Threshold Voltage VDITHERH 2.2 V Dither Low Threshold Voltage VDITHERL 1.05 V Diode Emulation Mode Detection LG1/PWM_MODE Current Source IMODELG1 7.5 LG1/PWM_MODE Threshold Low VMODETHL 0.26 LG1/PWM_MODE Threshold High VMODETHH 10 13.0 µA V 0.34 V PWM1 Diode Emulation Phase Threshold (Note 11) VCROSS1 VIN = 12V 0 mV PWM2 Diode Emulation Phase Threshold (Note 12) VCROSS2 VIN = 12V 0 mV Diode Emulation Burst Mode PWM1 Burst Mode Enter Threshold VIMON1BSTEN IMON1 pin voltage 0.808 0.835 0.860 V PWM1 Burst Mode Exit Threshold VMON1BSTEX IMON1 pin voltage 0.83 0.88 0.92 V PWM1 Burst Mode Peak Current Limit Input Shunt Set Point VBST-CS1 PWM1 Burst Mode Peak FB1 Voltage Limit Set Point VBST-VFB1-UTH R16DS0033EU0101 Rev.1.01 Oct.15.20 VCS1+ - VCS1- , 12V common-mode voltage applied to CS± pins 27 mV 0.81 V Page 15 of 44 ISL81802 2. Specifications Recommended operating conditions unless otherwise noted. See the Block Diagram and Typical Application Schematics. VIN = 4.5V to 80V, or VDD = 8V ±10%, C_VCC5V = 4.7µF, TA = -40°C to +125°C, Typical values are at TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) Parameter Symbol Test Conditions Min (Note 6) Typ Max (Note 6) Unit PWM1 Burst Mode Exit FB1 Voltage Set Point VBST-VFB1-LTH 0.78 PWM2 Burst Mode Enter Threshold VIMON2BSTEN IMON2 pin voltage 0.808 0.835 0.860 V PWM2 Burst Mode Exit Threshold VMON2BSTEX IMON2 pin voltage 0.83 0.88 0.92 V 27 mV VBST-VFB2-UTH 0.81 V VBST-VFB2-LTH 0.78 V PWM2 Burst Mode Peak Current Limit Input Shunt Set Point VBST-CS1 PWM2 Burst Mode Peak FB1 Voltage Limit Set Point PWM2 Burst Mode Exit FB1 Voltage Set Point VCS2+ - VCS2- , 12V common-mode voltage applied to CS± pins V BSTEN Output Logic High VBSTEN-OH No load, VCC5V = 5V 4.9 V BSTEN Output Logic Low VBSTEN-OL Pull-up resistance 100kΩ 0.07 V BSTEN Input Logic High VBSTEN-IH (Note 10) BSTEN Input Logic Low VBSTEN-IL (Note 10) CLKEN Output Logic High VCLKEN-OH No load, VCC5V = 5V 4.9 V CLKEN Output Logic Low VCLKEN-OL Pull-up resistance 100kΩ 0.07 V CLKEN Input Logic High VCLKEN-IH (Note 10) CLKEN Input Logic Low VCLKEN-IL (Note 10) 3.2 V 1 3.2 V V 1 V 6.6 V PWM Gate Drivers Driver 1, 2 BOOT Refresh Trip Voltage VBOOTRF1,2 BOOT voltage - PHASE voltage 5.2 5.85 Driver 1, 2 Source and Upper Sink Current IGSRC1,2 2000 mA Driver 1, 2 Lower Sink Current IGSNK1,2 3000 mA Driver 1, 2 Upper Drive Pull-Up RUG_UP1,2 2.2 Ω Driver 1, 2 Upper Drive Pull-Down RUG_DN1,2 1.7 Ω Driver 1, 2 Lower Drive Pull-Up RLG_UP1,2 3 Ω Driver 1, 2 Lower Drive Pull-Down RLG_DN 2 Ω Driver 1, 2 Upper Drive Rise Time tGR_UP COUT = 1000pF 10 ns Driver 1, 2 Upper Drive Fall Time tGF_UP COUT = 1000pF 10 ns Driver 1, 2 Lower Drive Rise Time tGR_DN COUT = 1000pF 10 ns Driver 1, 2 Lower Drive Fall Time tGF_DN COUT = 1000pF 10 ns Driver 1, 2 Dead Time tD_LU COUT = 1000pF, LG falling edge 1V to UG rising edge 1V 25 ns Driver1, 2 Dead Time tD_UL COUT = 1000pF, UG falling edge 1V to LG rising edge 1V 23 ns Overvoltage Protection Output OVP Threshold VOVTH_OUT 112 OV Pin Output Logic High VOV-OH Load resistance 100k, VCC5V = 5V OV Pin Output Logic Low VOV-OL No load OV Pin Input Logic High VOV-IH (Note 10) OV Pin Input Logic Low VOV-IL (Note 10) R16DS0033EU0101 Rev.1.01 Oct.15.20 114 116 % 4.9 V 0 V 3.2 V 1 V Page 16 of 44 ISL81802 2. Specifications Recommended operating conditions unless otherwise noted. See the Block Diagram and Typical Application Schematics. VIN = 4.5V to 80V, or VDD = 8V ±10%, C_VCC5V = 4.7µF, TA = -40°C to +125°C, Typical values are at TA = +25°C, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) Parameter Symbol Test Conditions Min (Note 6) Typ 10.5 Max (Note 6) Unit Overcurrent Protection LG2/OC_MODE Current Source IMODELG2 7.5 LG2/OC_MODE Threshold Low VMODETHLOC 0.26 LG2/OC_MODE Threshold High VMODETHHOC Pulse-by-Pulse Peak Current Limit Input Shunt Set Point1 VOCSET-CS1 Hiccup Peak Current Limit Input Shunt Set Point1 VOCSET-CS1-HIC Pulse-by-Pulse Negative Peak Current Limit Output Shunt Set Point1 VOCSET-CS1 Output Constant and Hiccup Current Limit Set Point1 VIMON1CC Output Constant and Hiccup Current Limit Set Point at CS1± Input VAVOCP_CS1 Pulse-by-Pulse Peak Current Limit Input Shunt Set Point2 VOCSET-CS2 Hiccup Peak Current Limit Input Shunt Set Point2 VOCSET-CS2-HIC Pulse-by-Pulse Negative Peak Current Limit Output Shunt Set Point2 VOCSET-CS2 Output Constant and Hiccup Current Limit Set Point2 VIMON2CC Output Constant and Hiccup Current Limit Set Point at CS2± Input VAVOCP_CS2 Hiccup OCP Off-Time VCS1+ - VCS1-, 12V common-mode voltage applied to CS± pins 68 13.0 µA V 82 0.34 V 96 mV VCS1+ - VCS-1 98 mV VCS1+ - VCS1-, 12V common-mode voltage applied to ISEN± pins -60 mV IMON1 Pin Voltage 1.18 1.2 1.22 V VCS1+ - VCS1-, 12V common-mode applied to CS± pins, RIMON1 = 40.2k, TJ = -40°C to +125°C 43 51 63 mV VCS1+ - VCS1-, 12V common-mode applied to CS± pins, RIMON1 = 40.2k, TJ = -40°C to +85°C 43 51 65 mV VCS2+ - VCS2-, 12V common-mode voltage applied to CS± pins 68 82 96 mV VCS2+ - VCS2- 98 mV VCS2+ - VCS2-, 12V common-mode voltage applied to ISEN± pins -60 mV IMON2 pin voltage 1.18 1.2 1.22 V VCS2+ - VCS2-, 12V common-mode applied to CS± pins, RIMON2 = 40.2k, TJ = -40°C to +125°C 44 51 65 mV VCS2+ - VCS2-, 12V common-mode applied to CS± pins, RIMON2 = 40.2k, TJ = -40°C to +85°C 44 51 60 mV tHICC_OFF 55 ms Over-Temperature Shutdown TOT-TH 160 °C Over-Temperature Hysteresis TOT-HYS 15 °C Over-Temperature Notes: 6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 7. This is the total shutdown current with VIN = 5.6V and 80V. 8. Operating current is the supply current consumed when the device is active but not switching. It does not include gate drive current. 9. When soft-start time is less than 4.5ms, tPGR increases. With internal soft-start (the fastest soft-start time), tPGR increases close to its max limit 5ms. 10. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design. 11. Threshold voltage at the PHASE1 pin for turning off the buck bottom MOSFET during DE mode. 12. Threshold voltage at the PHASE2 pin for turning off the buck bottom MOSFET during DE mode. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 17 of 44 ISL81802 3. 3. Typical Performance Curves Typical Performance Curves 6 6 5 5 Quiescent Current (mA) Shutdown Current (µA) Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, 4 3 2 1 4 3 2 1 0 0 -50 0 50 100 -50 150 0 Figure 6. Shutdown Current vs Temperature 100 150 Figure 7. Quiescent Current vs Temperature 8.00 9 7.95 8 7.90 7 7.85 6 7.80 VDD (V) VDD (V) 50 Temperature (°) Temperature (°) 7.75 7.70 5 4 3 7.65 2 7.60 Vin = 12V, Vextbias = 0V Vin = 4.5V, Vextbias = 12V 7.55 1 0 20 40 60 Vdd vs Vin Vdd vs Extbias 0 7.50 80 100 0 120 20 IOUT (mA) 40 60 80 100 VIN, Vextbias (V) Figure 8. VDD Load Regulation at 12V Input Figure 9. VDD Line Regulation at 20mA Load 5.20 5.08 5.07 5.15 VCC5V (V) VCC5V (V) 5.06 5.05 5.04 5.03 5.10 5.05 5.02 5.00 5.01 0 20 40 60 80 100 120 IOUT (mA) Figure 10. VCC5V Load Regulation at 12VIN R16DS0033EU0101 Rev.1.01 Oct.15.20 140 0 20 40 60 80 100 VIN (V) Figure 11. VCC5V Line Regulation at 20mA Load Page 18 of 44 ISL81802 3. Typical Performance Curves 500 210 450 208 Frequency (kHz) Switching Frequency (kHz) Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, (Continued) 400 350 Rt = 144k Rt = 72k 300 250 206 204 202 200 200 198 -50 0 50 100 150 0 20 40 Temperature (˚C) 60 80 100 VIN (V) Figure 12. Switching Frequency vs Temperature Figure 13. Switching Frequency vs VIN, RT = 169k 0.810 1.205 1.2V Reference Voltage (V) 0.8V Reference Voltage (V) 1.204 0.805 0.800 0.795 0.790 1.203 1.202 1.201 1.200 1.199 1.198 1.197 1.196 1.195 -50 0 50 100 150 -50 0 Temperature (°) Figure 14. 0.8V Reference Voltage vs Temperature 100 150 Figure 15. 1.2V Reference Voltage vs Temperature 120 1.2 100 1.1 80 1.0 IMON1 (V) Normalized Output Voltage (%) 50 Temperature (°) 60 0.9 40 0.8 20 0.7 0.6 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Soft-Start Pin Voltage (V) Figure 16. Normalized Output Voltage vs Voltage on Soft-Start Pin R16DS0033EU0101 Rev.1.01 Oct.15.20 0 5 10 15 20 IOUT (A) Figure 17. Dual-Phase Output Current IOUT (DC) vs IMON1 Pin Voltage, RS_out = 4mΩ, RIMON1 = 20k Page 19 of 44 ISL81802 3. Typical Performance Curves Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, (Continued) 1.2 100 98 1.1 Efficiency (%) 96 IMON (V) 1.0 0.9 0.8 94 92 90 88 86 Vin = 18V Vin = 36V Vin = 60V 84 0.7 IMON1 82 IMON2 0.6 Vin = 24V Vin = 48V Vin = 80V 80 0 2 4 6 8 12 10 0 5 IOUT (A) 10 15 20 Output Current (A) Figure 18. Output Current IOUT (DC) vs IMON Pin Voltage, RS_OUT = 4mΩ, RIMON = 40.2k Figure 19. CCM Mode Efficiency 11.970 11.946 Vin = 18V Vin = 36V Vin = 60V 11.965 Vin = 24V Vin = 48V Vin = 80V 11.944 11.942 11.955 11.940 VOUT (V) 11.960 11.950 11.945 11.938 11.936 11.940 11.934 11.935 11.932 11.930 11.930 0 5 10 15 20 25 0 20 40 60 80 100 VIN (V) Figure 20. CCM Load Regulation at +25°C Phase 1 20V Figure 21. CCM Line Regulation at 20A Load +25°C Phase 1 20V Phase 2 20V Phase 2 20V IL1 5A IL1 5A IL2 5A IL2 5A 2µs/Div 2µs/Div Figure 22. Dual-Phase Waveforms, VIN = 48V, IOUT = 0A, CCM Mode Figure 23. Dual-Phase Waveforms, VIN = 48V, IOUT = 20A, CCM Mode R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 20 of 44 ISL81802 3. Typical Performance Curves Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, (Continued) VOUT 100mV VOUT 1V IL1 10A IL1 10A IL2 10A IL2 10A 2ms/Div Figure 24. Dual-Phase Waveforms, VIN = 48V, IOUT = 0-20A Dynamic, CCM Mode 20ms/Div Figure 25. Dual-Phase Waveforms, Burst Mode Waveforms, VIN = 48V, IOUT = 0.1A VOUT 5V VOUT 5V IL1 5A IL1 10A IL2 5A IL2 10A 4ms/Div Figure 26. Dual-Phase Waveforms, Start-Up Waveform, VIN = 48V IO = 0A, CCM 4ms/Div Figure 27. Dual-Phase Waveforms, Start-Up Waveform, VIN = 48V IO = 20A, CCM Phase 1 50V VOUT 10mV Phase 2 50V IL1 5A IL1 10A IL2 10A IL2 5A 400µs/Div 2µs/Div Figure 28. Dual-Phase Burst Mode VIN = 48V, IOUT = 0A R16DS0033EU0101 Rev.1.01 Oct.15.20 Figure 29. Dual-Output Waveform, VIN = 48V, VOUT1 = 12V, VOUT2 = 5V, IOUT1 = 0A, IOUT2 = 0A CCM Page 21 of 44 ISL81802 3. Typical Performance Curves Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, (Continued) VOUT1 200mV Phase 1 50V VOUT2 100mV Phase 2 50V IL1 10A IL1 10A IL2 10A IL2 10A 2µs/Div Figure 30. Dual Output Waveform, VIN = 48V, VOUT1 = 12V, VOUT2 = 5V, IOUT1 = 10A, IOUT2 = 10A CCM 2ms/Div Figure 31. Dual Output Waveform, VIN = 48V, VOUT1 = 12V, VOUT2 = 5V, IOUT1 = 0-10A, IOUT2 = 0-10A, Dynamic, CCM VOUT1 200mV VOUT1 200mV VOUT2 100mV VOUT2 100mV IL1 10A IL1 10A IL2 10A IL2 10A 1ms/Div Figure 32. Dual Output Waveforms, Burst Mode Waveforms, VIN = 48V, IOUT1 = 0.1A, IOUT2 = 0.1A R16DS0033EU0101 Rev.1.01 Oct.15.20 1ms/Div Figure 33. Dual Output Waveforms, Start-Up Waveform, VIN = 48V, VOUT1 = 12V, VOUT2 = 5V, IOUT1 = 0A, IOUT2 = 0A, CCM Page 22 of 44 ISL81802 3. Typical Performance Curves Oscilloscope plots are taken using the ISL81802EVAL1Z and ISL81802EVAL2Z evaluation boards, (Continued) Phase 1 20V VOUT1 200mV VOUT2 100mV Phase 2 20V IL1 20A IL1 10A IL2 20A IL2 10A 1ms/Div 40ms/Div Figure 34. Dual Output Waveforms, Start-Up Waveform, VIN = 48V, VOUT1 = 12V, VOUT2 = 5V, IOUT1 = 0A, IOUT2 = 0A, CCM Figure 35. Dual-Phase OCP Response, HICCUP Mode, VIN = 48V, VOUT = 12V 14 12 VOUT (V) 10 8 6 4 2 0 0 5 10 15 20 25 30 IOUT (A) Figure 36. Constant Voltage (CV) and Constant Current (CC) Operation R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 23 of 44 ISL81802 4. 4.1 4. Functional Description Functional Description General Description The ISL81802 implements dual-buck, dual-phase, and multi-phase controls with a PWM controller, internal drivers, references, protection circuits, current and voltage control inputs, PLL clock and sync control logic, and current monitor outputs. See Figure 5. The ISL81802 is a peak-current mode controller. The two channels can independently control their outputs and maintain 180° phase shift between in the two PWM outputs. The controller integrates two control loops to regulate VOUT and average maximum IOUT in each buck channel. The driver and protection circuits are also integrated in each buck channel to simplify the end design. The part has an independent enable/disable pins for each buck channel, which provides a flexible power-up sequencing and a simple VIN UVP implementation. Each buck channel has its own soft-start control. The soft-start time is programmable by adjusting the soft-start capacitor on the SS/TRK pin. 4.2 Internal 8V Linear Regulator (VDD), External Bias Supply (EXTBIAS), and 5V Linear Regulator (VCC5V) The ISL81802 provides two input pins, VIN and EXTBIAS, and two internal LDOs for the VDD gate driver supply. A third LDO generates VCC5V from VDD. VCC5V provides power to all internal functional circuits other than the gate drivers. Bypass the linear regulator’s outputs (VDD) with a 10µF capacitor to the power ground. Also, bypass the third linear regulator output (VCC5V) with a 10µF capacitor to the signal ground. VCC5V is monitored by a power-on-reset circuit, which disables all regulators when VCC5V falls below 3.5V. Both LDOs from VIN and EXTBIAS can source over 75mA for VDD to power the gate drivers. When driving large FETs at a high switching frequency, little or no regulator current may be available for external loads. The LDO from VDD to VCC5V can also source over 75mA to supply the IC internal circuit. Although the current consumed by the internal circuit is low, the current supplied by VCC5V to the external loads is limited by VDD. For example, a single large FET with 15nC total gate charge requires 15nC x 300kHz = 4.5mA (15nC x 600kHz = 9mA). Also, at higher input voltages with larger FETs, the power dissipation across the internal 8V LDO increases. Excessive power dissipation across this regulator must be avoided to prevent junction temperature rise. Thermal protection if triggered if the die temperature increases above +160°C due to excessive power dissipation. When large MOSFETs or high input voltages are used, an external 8V bias voltage can be applied to the EXTBIAS pin to alleviate excessive power dissipation. When the voltage at the EXTBIAS pin is higher than typical 7.38V, the LDO from EXTBIAS activates and the LDO from VIN is disconnected. The recommended maximum voltage at the EXTBIAS pin is 36V. For applications with VOUT significantly lower than VIN, EXTBIAS is usually back biased by VOUT to reduce the LDO power loss. An external UVLO circuit might be necessary to ensure smooth soft-starting. Renesas recommends adding a 10µF capacitor on the EXTBIAS pin and using a diode to connect the EXTBIAS pin to VOUT to prevent the EXTBIAS pin voltage from being pulled low due to a VOUT short-circuit condition. The two VDD LDOs have an overcurrent limit for short-circuit protection. The VIN to VDD LDO current limit is set to typical 120mA. The EXTBIAS to VDD LDO current limit is set to a typical 140mA. 4.3 Enable (EN/UVLO) and Soft-Start Operation ISL81802 provides an enable pin to each of the two buck channels, EN/UVLO1 and EN/UVLO2. Pulling the pin high or low can enable or disable the corresponding output. When the voltage of either of the two pins is higher than 1.3V, the three LDOs are enabled. After the VCC5V reaches the POR threshold, the controller is powered up to initialize its internal circuit. When EN/UVLO1 or EN/UVLO2 is higher than the 1.8V accurate Undervoltage Lockout (UVLO) threshold, the soft-start circuitry of the corresponding channel becomes active. An internal 2µA current source begins charging up the soft-start capacitor connected from the corresponding soft-start pin SS/TRK1 or SS/TRK2/OV to GND. The voltage error amplifier reference voltage is clamped to the voltage on the SS/TRK1 or SS/TRK2/OV pin. Therefore, the corresponding output voltage rises from 0V to regulation as the R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 24 of 44 ISL81802 4. Functional Description soft-start pin rises from 0V to 0.8V. Charging of the soft-start capacitor continues until the voltage on the soft-start pin reaches 3V. The soft-start pin can also be used for tracking. The soft-start time is set by the value of the soft-start capacitor connected from the soft-start pin to GND. Inrush current during start-up is alleviated by adjusting the soft-start time. The typical soft-start time is set according to Equation 2: (EQ. 2) C SS t SS = 0.8V  -----------  2A When the soft-start time set by external CSS or tracking is less than 1.7ms, an internal soft-start circuit of 1.7ms takes over the soft-start. In dual-phase applications, the internal SS/TRK2 signal is disconnected from SS/TRK2/OV pin and internally connected to SS/TRK1 pin. The VOUT soft-start is controlled by SS/TRK1 pin with a doubled charge current 4µA. So the external CSS capacitor needs to be doubled to achieve the same soft-start time. PGOOD toggles high when the Channel 1 output voltage is in regulation. Pulling both EN/UVLO1 and EN/UVLO2 pins lower than the EN falling threshold VENSS_THF typical 0.9V, disables the PWM output and internal LDOs to achieve low standby current. The SS/TRK1 and SS/TRK2/OV are also discharged to GND by an internal MOSFET with 70Ω rDS(ON) in each of the buck channels. For applications with more than 1µF capacitor on the soft-start pin, Renesas recommends adding a 100Ω to 1kΩ resistor in series with the capacitor to share the power loss during the discharge. With the use of the accurate UVLO threshold, an accurate VIN Undervoltage Protection (UVP) feature is implemented by feeding the VIN into the EN/UVLO pin using a voltage divider, RUV1 and RUV2, shown in Figure 37. VIN RUV1 ISL81802 EN/UVLO RUV2 Figure 37. VIN Undervoltage Protection The VIN UVP rising threshold is calculated using Equation 3. (EQ. 3) V UVLO _ THR  R UV1 + R UV2  – 1.4x10 – 6 R UV1 R UV2 V UVRISE = -------------------------------------------------------------------------------------------------------------------------------------------R UV2 where VUVLO_THR is the EN/UVLO pin UVLO rising threshold, typically 1.8V. The VIN UVP falling threshold is calculated using Equation 4: (EQ. 4) V UVLO _ THR  R UV1 + R UV2  – I UVLO _ HYST R UV1 R UV2 V UVFALL = ------------------------------------------------------------------------------------------------------------------------------------------------------R UV2 where IUVLO_HYST is the UVLO hysteresis current, typically 3.4µA. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 25 of 44 ISL81802 4.4 4. Functional Description Tracking Operation Each of the two ISL81802 buck outputs can track an external supply. To implement tracking, connect a resistive divider between the external supply output and ground. Connect the center point of the divider to the SS/TRK (SS/TRK1 for Channel 1 and dual-phase or SS/TRK2/OV for Channel 2) pin of the corresponding buck channel. The resistive divider ratio sets the ramping ratio between the two voltage rails. To implement coincident tracking, set the tracking resistive divider ratio the same as the output-resistive divider given by Equation 5. Make sure that the voltage at SS/TRK is greater than 0.8V when the master rail reaches regulation. To minimize the impact of the 2µA soft-start current on the tracking function, Renesas recommends using resistors less than 10kΩ for the tracking resistive divider. When the SS/TRK pin voltage is pulled down to less than 0.3V by the external tracking source, the prebias startup DE mode function is enabled again. The output voltage may not be able to be pulled down if the load current is not high enough. When Overcurrent Protection (OCP) is triggered, the internal minimum soft-start circuit determines the 55ms OCP soft-start hiccup off-time. 4.5 Control Loops The ISL81802 integrates two identical buck controllers that provide two output voltages below the input voltage or one output voltage using two phases. Peak current mode PWM control algorithm is used in the two controllers. The Renesas proprietary control architecture uses a current sense resistor in series with the inductor to sense the inductor current (see Figure 1 and Figure 5). By using an RC network, the inductor current signal can also be derived from the inductor voltage using DCR sensing. The inductor current is controlled by the voltage on the COMP pin, which is the lowest output of the error amplifiers Gm1 and Gm3 for Channel 1 or Gm2 and Gm4 for Channel 2. As the simplest example, when the output is regulated to a constant voltage, the FB1 or FB2 pin receives the output feedback signal, which is compared to the internal reference by Gm1 or Gm2. Lower output voltage creates higher COMP voltage which leads to a higher PWM duty cycle to deliver more current to the output. Conversely, higher output voltage creates lower COMP voltage, which leads to a lower PWM duty cycle to reduce the current delivered to the output. The ISL81802 has four error amplifiers (Gm1-4), which can control Channel 1 output voltage (Gm1) and current (Gm3), and Channel 2 output voltage (Gm2) and current (Gm4). In this architecture, both channels can provide constant voltage and constant current output. 4.5.1 Output Voltage Regulation Loop The ISL81802 provides a precision 0.8V internal reference voltage to set the output voltage. Based on this internal reference, the output voltage is set from 0.8V up to a level determined by the feedback voltage divider, as shown in Figure 38. A resistive divider from the output to ground sets the output voltage. Connect the center point of the divider to the FB_OUT pin. The output voltage value is determined by Equation 5. (EQ. 5)  R FBO1 + R FBO2 V OUT = 0.8V  --------------------------------------------- R FBO2   where RFBO1 is the top resistor of the feedback divider network and RFBO2 is the bottom resistor connected from FB_OUT to ground, shown in Figure 38. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 26 of 44 ISL81802 4. Functional Description VOUT RFBO1 FB_OUT _ + + 0.8V _ REF RFBO2 COMP Gm1 RCOMP CCOMP2 CCOMP1 Figure 38. Output Voltage Regulator As shown in Figure 38, the RCOMP, CCOMP1, and CCOMP2 network connected on the Gm1 regulator output COMP pin is needed to compensate the loop for stable operation. The loop stability can be affected by many different factors such as VIN, VOUT, load current, switching frequency, inductor value, output capacitance, and the compensation network on COMP pin. For most applications 22nF is a good value for CCOMP1. A larger CCOMP1 makes the loop more stable by giving a larger phase margin, but the loop bandwidth is lower. CCOMP2 is typically 1/10th to 1/30th of CCOMP1 to filter high frequency noise. A good starting value for RCOMP is 10k. Lower RCOMP improves stability but slows the loop response. Optimize the final compensation network with a bench test. 4.5.2 Output Average Current Monitoring and Regulation Loops The ISL81802 has two current sense amplifiers, A1 and A2, which monitor the output current of both channels. Figure 39 A shows the ISL81802 Channel 1 current shunt sense and monitor circuit which is identical to Channel 2. The voltage signal on the current sense resistor RS_OUT1 is sent to the differential input of CS1+/CS1-, after the RC filters RS1/CS1 and RS2/CS2. It is recommended to use a 1Ω value for RS1 and RS2, and a 10nF value for CS1, and CS2 to effectively damp the switching noise without significantly delaying the current signal or introducing too much error by the op amp bias current. The A1 amplifier converts the current sense voltage signal to current signal ICS1. (EQ. 6) I CS1 =   I OUT1 R S_OUT1 + V CS1OFFSET Gm CS1 where • IOUT1 is the Channel 1 inductor current • VCS1OFFSET is the A1 input offset voltage • GmCS1 is the gain of A1, typical 200µS • VCS1OFFSET GmCS1 = ICS1OFFSET. The typical value of ICS1OFFSET is 20µA. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 27 of 44 ISL81802 4. Functional Description VIN VIN UG1 UG1 Q1 Rs_out L VOUT PH1 LG1 Q2 Rs1 LG1 Rs2 Q1 Rdcr L VOUT PH1 Q2 Rs1 Cs1 Cs1 Cs2 CS1+ CS1+ CS1- Vcs1_offset A1 A1 Ics1 Ics1 GM3 GM3 + 1.2V _ + 1.2V _ IMON_OUT1 COMP1 Rim CS1- Vcs1_offset Rim1 Cim2 Cim1 A. IOUT Average Current Loop with Shunt Sense IMON_OUT1 COMP1 Rim Rim1 Cim2 Cim1 B. IOUT Average Current Loop with DCR Sense Figure 39. Output Average Current Monitoring and Regulation Loops By connecting resistor RIM on the IMON1 pin, the ICS1 current signal is transferred to a voltage signal. The RC network on the IMON1 pin RIM1/CIM1/CIM2 are needed to remove the AC content in the ICS1 signal and ensure stable loop operation. The average voltages at the IMON1 pin is regulated to 1.2V by Gm3 for constant current control. In dual-phase application, the internal IMON2 signal is disconnected from IMON2 pin and internally connected to IMON1 pin. The ICS1OFFSET is a doubled current 40µA. The output constant current loop set point IOUTCC1 is calculated by Equation 7. See VAVOCP_CS1 on page 17 in the Electrical Specifications table to estimate the set point tolerance. (EQ. 7) 1.2 – I CS1OFFSET xR IM I OUTCC1 = ---------------------------------------------------------------R IM xR xGm S_OUT1 CS1 Similar to the voltage control loop, the average current loop stability can be affected by many different factors such as VIN, VOUT, switching frequency, inductor value, output and input capacitance, and the RC network on the IMON1 pin. Due to the AC content in ICS1, a larger CIM1 is needed. Larger CIM1 can also make the loop more stable by giving a larger phase margin, but the loop bandwidth is lower. For most applications, 47nF is a good value for CIM1. CIM2 is typically 1/10th to 1/30th of CIM1 to filter high frequency noise. RIM1 is needed to boost the phase margin. A good starting value for RIM1 is 5k. Optimize the final compensation network with iSim simulation and bench testing. Figure 39 B shows the ISL81802 Channel 1 inductor DCR current sense and monitor circuit. Rdcr1 plays the same role as RS_OUT1 in the shunt current sense circuit. Renesas recommends keeping Rs1 x Cs1 = L1/Rdcr1. To minimize the error caused by the A1 input bias current, Renesas recommends keeping Rs1 less than 10k. 4.6 Light-Load Efficiency Enhancement Set each function of the two ISL81802 channels to DE and Burst mode to improve light-load efficiency. The LG1/PWM_MODE pin sets the DE or PWM mode operation in the initialization period before soft-start. During the initialization period, a typical 10µA current source IMODELG1 from the LG1/PWM_MODE pin creates a voltage drop on the resistor RLG1 connected between the LG1/PWM_MODE pin and GND. When the voltage is lower than the typical 0.3V, PWM mode is set; otherwise, DE mode is set. Note: DE or PWM mode can only be selected during the initialization period and cannot be changed after initialization is complete. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 28 of 44 ISL81802 4. Functional Description To set for DE mode operation, select RLG1 to meet: (EQ. 8) R LG1 xI MODELG1  0.34V When DE mode is set, the Channel 1 and 2 buck sync FET driven by LG1 and LG2 are all running in DE mode. The inductor current is not allowed to reverse (discontinuous operation) depending on the zero cross detection reference level VCROSS1 for Channel 1 and VCROSS2 for Channel 2 sync FET. At light load conditions, the converter goes into diode emulation. When the load current is less than the level set by VIMON1BSTEN or VIMON2BSTEN typical 0.85V on the IMON1 or IMON2 pin, the Channel 1 or 2 enters Burst mode. Equation 9 sets the Burst mode operation enter condition for Channel 1 as an example (see Figure 39). Same equation also applies to Channel 2. (EQ. 9) R IM x  I CS1OFFSET + I OUT1 xR S_OUT1 xGm CS1   V IMON1BSTEN where: • ICSOFFSET is the output current sense op amp internal offset current, typical 20µA • GmCS is the output current sense op amp Gm, typical 200µS. The part exits Burst mode when the output current increases to higher than the level set by VIMON1BSTEX or VIMON2BSTEX typical 0.88V on the IMON1 or IMON2 pin. Equation 10 sets the Burst mode operation exit condition for Channel 1 as en example. Equation 10 also applies to Channel 2. (EQ. 10) R IM x  I CS1OFFSET + I OUT1 xR S_OUT1 xGm CS1   v IMON1BSTEX When the part enters Burst mode, the BSTEN pin goes low. To fully avoid any enter/exit chattering, add a 4-10MΩ resistor between the BSTEN and IMON_OUT pins to further expand the hysteresis. In Burst mode, an internal window comparator takes control of the output voltage. The comparator monitors the FB1 or FB2 pin voltage for Channel 1 or 2. When the FB1 or FB2 pin voltage is higher than 0.81V, the Channel 1 or 2 enters Low Power Off mode. Some unneeded internal circuits are powered off to further reduce power dissipation. When the FB1 or FB2 pin voltage drops to 0.8V, the Channel 1 or 2 wakes up and runs in a fixed level peak current mode. The fixed level peak current is set by the level that the input current sense amplifier input voltage reaches VBST-CS1 or VBST-CS2 for Channel 1 or 2, typical 27mV. The output voltage increases in the wake-up period. When the output reaches 0.82V again, the controller enters into Low Power Off mode again. When the load current increases, the Low Power Off mode period decreases. When the off mode period disappears and the load current further increases but still does not meet the Equation 10 exit condition, the output voltage drops. When the FB1 or FB2 pin voltage drops to 0.78V, Channel 1 or 2 exits Burst mode and runs in normal DE PWM mode. The voltage error amplifier takes control of the output voltage regulation. In Low Power Off mode, the CLKEN pin goes low. The DE and Burst mode operations also apply to dual-phase and multi-phase applications. By connecting the BSTEN and CLKEN pins in a multiple chip parallel system, the Burst mode enter/exit and burst on/off control are all synchronized. Because VOUT is controlled by a window comparator in Burst mode, higher than normal low-frequency voltage ripple appears on VOUT, which can generate audible noise if the inductor and output capacitors are not chosen properly. To avoid these drawbacks, disable the Burst mode by choosing a bigger RIM to set the IMON1 pin voltage higher than 0.88V at no load condition, shown in Equation 11 for Channel 1. Channel 1 runs in DE mode only. Pulse Skipping mode can also be implemented to lower the light-load power loss with much lower output voltage ripple as VOUT1 is always controlled by the regulator Gm1. The same approach also applies to Channel 2 and dual-phase operation. (EQ. 11) R IM xI CS1OFFSET  v IMON1BSTEX R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 29 of 44 ISL81802 4.7 4. Functional Description Prebiased Power-Up Each of the two ISL81802 channels can soft-start with a prebiased output by running in forced DE mode during soft-start. The output voltage is not pulled down during prebiased start-up. The PWM mode is not active until the soft-start ramp reaches 90% of the output voltage set point times the feedback resistive divider ratio. Forced DE mode is set again when the SS/TRK pin voltage is pulled to less than 0.3V by either an internal or external circuit. The overvoltage protection function is still operating during soft-start in DE mode. 4.8 Frequency Selection Switching frequency selection is a trade-off between efficiency and component size. Low switching frequency improves efficiency by reducing MOSFET switching loss. To meet the output ripple and load transient requirements, operation at a low switching frequency requires larger inductance and output capacitance. The switching frequency of the ISL81802 is set by a resistor connected from the RT/SYNC pin to GND according to Equation 1. The frequency setting curve shown in Figure 40 assists in selecting the correct value for RT. 3,000 2,500 fSW (kHz) 2,000 1,500 1,000 500 0 0 50 100 150 200 250 RT (k:) Figure 40. RT vs Switching Frequency fSW 4.9 Phase Lock Loop (PLL) The ISL81802 integrates a high-performance PLL. The PLL ensures a wide range of accurate clock frequency and phase setting. It also makes the internal clock easily synchronized to an external clock with the frequency either lower or higher than the internal setting. As shown in Figure 41, an external compensation network of RPLL, CPLL1, and CPLL2 is needed to connect to the PLL_COMP pin to ensure PLL stable operation. Renesas recommends choosing 2.7kΩ for RPLL, 10nF for CPLL1, and 820pF for CPLL2. With the recommended compensation network, the PLL stability is ensured in the full clock frequency range of 100kHz to 1MHz. ISL81802 PLL_COMP RPLL CPLL2 CPLL1 Figure 41. PLL Compensation Network R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 30 of 44 ISL81802 4.10 4. Functional Description Frequency Synchronization, Multi-Phase Operation and Dithering The RT/SYNC pin can synchronize the ISL81802 to an external clock or the CLKOUT/DITHER pin of another ISL81802. When the RT/SYNC pin is connected to the CLKOUT/DITHER pin of another ISL81802, the two controllers operate in cascade synchronization with phase interleaving. When the RT/SYNC pin is connected to an external clock, the ISL81802 synchronizes to this external clock frequency. The frequency set by the RT resistor can be either lower or higher than, or equal to the external clock frequency. The CLKOUT/DITHER pin outputs a clock signal with approximately 300ns pulse width. The signal frequency is the same as the frequency set by the resistor from the RT pin to ground or the external sync clock. The signal rising edge phase angle to the rising edge of the internal clock or the external clock to the RT/SYNC pin can be set by the EN/UVLO2 pin connection and the voltage applied to the IMON2 pin. The phase interleaving can be implemented by the cascade connecting of the upstream chip CLKOUT/DITHER pin to the downstream chip RT/SYNC pin in a parallel system. Table 1 shows the CLKOUT/DITHER phase settings with a different EN/UVLO2 pin connection and IMON2 pin voltage. Table 1. CLKOUT and Channel 2 Phase Shift vs EN/UVLO2 and IMON2 Voltage CLKOUT Phase Shift (°) Channel 2 Phase Shift (°) IMON2 Voltage (V) EN/UVLO2 90° 180° 0-4.3 Tie to EN/UVLO1 60° 180° 4.7-5 Tie to EN/UVLO1 240° 120° 3-5 Tie to SGND Notes: 13. CLKOUT Phase Shift: CLKOUT rising edge delay after UG1 rising edge. 14. Channel 2 Phase Shift: UG2 rising edge delay after UG1 rising edge. When IMON2 pin is actively used as Channel 2 current monitor, the pin max voltage is 1.2V. The ISL81802 is running in dual-output application. When IMON2 pin is tied to 5V or externally forced to higher than 3V, the ISL81802 is configured for a dual-phase application. The IMON2 pin internal Channel 2 current signal is connected to IMON1 pin. IMON1 pin monitors the sum of the Channel 1 and 2 current. The internal current sharing circuit is also enabled. Meanwhile, SS/TRK2/OV pin internal SS/TRK2 signal is disconnected from the SS/TRK2/OV pin and connected to the SS/TRK1 pin. The SS/TRK2/OV pin is connected to OVP signal, which is pulled high by a MOSFET with about 4.5k rDS(ON) when output over voltage fault is triggered. The COMP2/CLKEN pin internal COMP2 signal is disconnected from the COMP2/CLKEN pin and connected to the COMP1 pin. The COMP2/CLKEN pin is connected to the CLKEN signal, which is pulled low by a MOSFET with about 4.5k rDS(ON) during burst mode off time. The FB2/BSTEN pin internal FB2 signal is disconnected from the FB2/BSTEN pin and connected to the FB1 pin. The FB2/BSTEN pin is connected to BSTEN signal, which is pulled low by a MOSFET with about 4.5k rDS(ON) when the controller enters into burst mode. In multi-chip cascade parallel operation, the CLKOUT/DITHER pin of the upstream chip is connected to the RT/SYNC pin of the downstream chip. The FB1, COMP1, IMON1, EN/UVLO1, SS/TRK1, FB2/BSTEN, COMP2/CLKEN, and SS/TRK2/OV pins of all the paralleled chips are tied together to implement current sharing, synchronized start up, burst mode operation, and OVP protection. The CLKOUT/DITHER pin provides a dual-function option. When a capacitor CDITHER is connected on the CLKOUT/DITHER pin, the internal circuit disables the CLKOUT function and enables the DITHER function. When the CLKOUT/DITHER pin voltage is lower than 1.05V, a typical 8µA current source IDITHERSO charges the capacitor on the pin. When the capacitor voltage is charged to more than 2.2V, a typical 10µA current source IDITHERSI discharges the capacitor on the pin. A sawtooth voltage waveform shown in Figure 42 is generated on the CLKOUT/DITHER pin. The internal clock frequency is modulated by the sawtooth voltage on the CLKOUT/DITHER pin. The clock frequency dither range is set to typically ±15% of the frequency set by the resistor on the RT/SYNC pin. The dither function is lost when the chip is synchronized to an external clock. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 31 of 44 ISL81802 4. Functional Description ISL81802 CLKOUT/ DITHER CDITHER a. Frequency Dithering Operation 1 FDITHER 2.2V 1.05V b. CLKOUT/DITHER Pin Voltage Waveform in Dither Operation Figure 42. Frequency Dithering Operation The dither frequency FDITHER is calculated using Equation 12. Renesas recommends setting CDITHER between 10nF and 1µF. With CDITHER too low, the part may not be able to set to Dither mode. With a higher CDITHER, the discharge power loss at disable or power off is higher, leading to a higher thermal stress to the internal discharge circuit. To avoid low frequency ripple, lower the dither frequency to less than 1/10 of the loop bandwidth. (EQ. 12) 4.11 3.865x10e  – 6  F DITHER = ----------------------------------------C DITHER Parallel Operation Current Sharing When ISL81802 is set to dual-phase application, the internal Renesas proprietary instant active current sharing circuit assures the accurate current sharing between the two phases in steady state and start-up or load transient conditions. Because the current signal from IMON1 is the sum of the two phases, reduce the resistor between the IMON1 pin and GND to half of the value in a single-phase application. To assure proper parallel operation, Renesas recommends selecting between 17k and 23k resistance for the resistor between the IMON1 pin and GND. The RC network is added on the IMON1 pin to filter the ripple noise in the inductor currents and improve the control loop stability. Multiple ISL81802 controlled buck converters can be paralleled to each other in cascade as described in Frequency Synchronization, Multi-Phase Operation and Dithering. The currents in the paralleled converters can be shared by connecting the IMON1 pin of each controller together to enable the internal Renesas proprietary instant active current sharing circuit. The 4-phase ISL81802 controlled buck converter is shown in Figure 43. To minimize the input current and output voltage ripple, the CLKOUT phase delay of the first ISL81802 controller is programmed to 90° for a perfect phase interleaving. R16DS0033EU0101 Rev.1.01 Oct.15.20 Page 32 of 44 ISL81802 4. Functional Description 9,1 & ,021 5 & (1 (;7%,$6  66  / / 8* 9,1 (;7%,$6 &6      ,021 (189/2 &203 & &6   )%  (3$' & &203 & 3+$6( &  ' &  6675. %227  4 4 9&&9     &/. 3*1' ,6/ 576
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