DATASHEET
ISL8274M
FN8931
Rev.1.00
Jan 4, 2018
30A/30A Dual-Channel Digital PMBus Step-Down Power Module
The ISL8274M is a complete PMBus enabled DC/DC,
dual-channel, step-down advance power supply, capable
of delivering up to 30A per channel and optimized for
high power density applications.
Operating across an input voltage range of 4.5V to 14V,
the ISL8274M offers adjustable output voltages down to
0.6V and achieves up to 95.5% conversion efficiencies. A
unique ChargeMode™ control architecture provides a
single clock cycle response to an output load step and can
support switching frequencies up to 1.06MHz. The power
module integrates all power and most passive components
and requires only a few external components to operate. A
set of optional external resistors allows the user to easily
configure the device for standard operation. For advanced
configurations, a standard PMBus interface addresses
tasks such as sequencing and fault management, as well as
real-time full telemetry and point-of-load monitoring.
Additionally, the nonvolatile memory can store the desired
custom configuration and settings.
A fully customizable voltage, current, and temperature
protection scheme ensures safe operation for the ISL8274M
under abnormal operating conditions. The device is also
supported by the PowerNavigator™ software, a full digital
power train development environment.
The ISL8274M is available in a low profile, compact
18mmx23mmx7.5mm fully encapsulated, thermally
enhanced HDA package.
Applications
Features
• Complete digital power supply
• 30A/30A dual-channel output current
• 4.5V to 14V single rail input voltage
• Up to 95.5% efficiency
• Programmable output voltage
• 0.6V to 5V output voltage settings
• ±1.2% accuracy over line/load/temperature
• ChargeMode control loop architecture
• 296kHz to 1.06MHz fixed switching frequency
operations
• No compensation required
• Fast single clock cycle transient response
• PMBus interface and/or pin-strap mode
• Fully programmable through PMBus
• Pin-strap mode for standard settings
• Real-time telemetry for VIN, VOUT, IOUT,
temperature, duty cycle, and fSW
• Advanced soft-start/stop, sequencing, and tracking
• Internal nonvolatile memory
• Complete over/undervoltage, current, and
temperature protections with fault logging
• Server, telecom, storage, and datacom
• PowerNavigator supported
• Industrial/ATE and networking equipment
• Thermally enhanced 18mmx23mmx7.5mm HDA
package
• General purpose power for ASIC, FPGA, DSP, and
memory
Related Literature
• For a full list of related documents, visit our website
• ISL8274M product page
FN8931 Rev.1.00
Jan 4, 2018
Page 1 of 81
ISL8274M
VIN
VOUT1
VIN
CIN
VSENP1
VDD
VSENN1
ENABLE1
COUT1
EN1
EN2
ENABLE2
10µF
VOUT1
10µF
VR5
VOUT2
VR6
VSENP2
ISL8274M
VDRV
VSENN2
VOUT2
COUT2
VCC
SCL
VDRV1
100k
SDA
2x10µF
SALRT
VMON
6.65k
PMBUS
INTERFACE
VR VR55
SGND
SA
PGND
Note: This figure represents a typical implementation of the ISL8274M. For
PMBus operation, it is recommended to tie the enable pin (EN) to SGND.
Figure 1. Application Circuit
m
23
m
m
1 8m
7.5mm
Figure 2. Small Package for High Power Density
FN8931 Rev.1.00
Jan 4, 2018
Page 2 of 81
ISL8274M
Contents
1.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
1.2
1.3
1.4
1.5
2.
Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ISL8274M Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
6
7
8
9
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.1
2.2
2.3
2.4
3.
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
12
12
13
Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1
3.2
3.3
3.4
4.
Efficiency Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Startup and Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Derating Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transient Response Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
17
18
20
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
4.17
4.18
4.19
5.
SMBus Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soft-Start, Stop Delay, and Ramp Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Tracking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Good. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switching Frequency and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Overcurrent Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Loop Compensation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SMBus Module Address Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Prebias Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Overload Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital-DC Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Spreading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fault Spreading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Monitoring Using SMBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Snapshot Parameter Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Nonvolatile Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21
22
24
25
25
27
27
28
29
29
30
31
31
31
31
32
32
32
Layout Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1
5.2
Thermal Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
FN8931 Rev.1.00
Jan 4, 2018
Page 3 of 81
ISL8274M
5.3
5.4
5.5
5.6
6.
PCB Layout Pattern Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Vias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stencil Pattern Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reflow Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
34
34
34
35
PMBus Command Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.1
6.2
6.3
PMBus Data Formats. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
PMBus Use Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.
PMBus Commands Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.
Firmware Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
9.
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
10.
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
FN8931 Rev.1.00
Jan 4, 2018
Page 4 of 81
Overview
Typical Application Circuits
EN1
EN2
(Note 2)
SCL
SDA
SDA
SALRT
VIN
4.5V to 14V
12x100µF
CERAMIC
8x22µF + 4x47µF
Ceramic
C2
C8
VIN
C3
ISL8274M
VR5
10µF
10µF
C4
C5
C6
VSENP1
VR6
10µF
12x100µF
CERAMIC
C7
1x470µF
POSCAP
VOUT2
VCC
VOUT2
1.5V 30A
VDRV1
C9
VSENN2
VSENP2
PGND
VR
VR55
SW2
SWD2
SWD1
SW1
SGND
C8
VMON
R6
6.65k
C9
VSENN1
VDRV
R5
100k
VOUT1
1.5V 30A
VDD
10µF
VCC 10µF
1x470µF
POSCAP
VOUT1
SALRT
2x470µF
Bulk
C1
ASCR2
DDC
SCL
R 13
ASCR1
DDC
R 11 R12
SYNC/OCP
R4
R10
SS/TRACK
R3
VSET2
R2
R9
VSET1
R1
R8
SA/CFG
R7
PG1
PG2
VTRKP
VTRKN
(Note 1)
VAUX or VCC 3.3V to 5V
(Note 3)
Should be active before enable 10k
10k 10k 10k
PG1
PG2
VTRKP
VTRKN
Pin Strap Resistors
(Optional)
EN1
EN2
1.1
ISL8274M
FN8931 Rev.1.00
Jan 4, 2018
1.
Figure 3. ISL8274M Digital PMBus Module Dual 30A/30A Application with Pinstrap Settings
1. Overview
Page 5 of 81
Notes:
1. R2 and R3 are not required if the PMBus host already has I2C pull-up resistors.
2. Only one R4 per DDC bus is required when multiple modules share the same DDC bus.
3. R7 through R13 can be selected according to the tables for the pin-strap resistor setting in this document.
If the PMBus configuration is chosen to overwrite the pin-strap configuration, R8 through R13 can be non-populated.
4. V25, VR, and VR55 do not need external capacitors. V25 can be no connection.
ISL8274M
VDRV1
VDRV
VCC
VIN
VR
VR55
V25
VR5
VR6
ISL8274M Internal Block Diagram
VDD
1.2
1. Overview
LDO
Logic
LDOs
VOUT2
VDRV1
OV/UV
Current Share
Interleave
OT/UT
OC/UC
Power Management
Sequence
Fault Spreading
Margining
PGND
SS
SNAPSHOT
SWD2
SW2
0.19µH
ASCR1/2
VSET1/2
SS/TRACK
EN1/2
DDC
PG1/2
VDRV
VIN
Filter
SYNC
OUT
SYNC/
OCP
PWM2
PLL
D-PWM
PWM1
ChargeMode
Control
Supervisor
VIN
VDRV
NVM
SWD1
SW1
ADC
0.19µH
CSA
VDRV1
ADC
Logic
Protection
VOUT1
CSA
PGND
ADC
VDD VSA1/2
ADC
Internal Temp
Sensor
SCL
SDA
SALRT
PMBus/I2C
Interface
VSEN1/2P
VSA
SA/CFG
VSEN1/2N
SGND
100 :
100 :
PGND
SGND
VMON
VTRKN
VTRKP
Digital Controller
VOUT1/2
Figure 4. Internal Block Diagram
FN8931 Rev.1.00
Jan 4, 2018
Page 6 of 81
ISL8274M
1.3
1. Overview
Ordering Information
Part Number
(Notes 5, 6, 7)
Part
Marking
ISL8274MAIRZ
ISL8274MA
ISL8274MEVAL1Z
Evaluation Board
Temp Range
(°C)
Package
(RoHS Compliant)
-40 to +85
Pkg.
Dwg. #
58 LD 18x23 HDA Module
Y58.18x23
Notes:
5. Add “-T” suffix for 100 unit tape and reel option. Refer to TB347 for details on reel specifications.
6. These Pb-free plastic packaged products are RoHS compliant by EU exemption 7C-I and 7A. They employ special Pb-free
material sets; molding compounds/die attach materials and NiPdAu plate-e4 termination finish, which is compatible with both
SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020.
7. For Moisture Sensitivity Level (MSL), see the product information page for the ISL8274M. For more information on MSL, see
TB363.
ISL
xxxxM
F
T
R
Z
S
INTERSIL DEVICE DESIGNATOR
SHIPPING OPTION
BLANK: BULK
-T: TAPE AND REEL
BASE PART NUMBER
ROHS
Z: ROHS COMPLIANT
FIRMWARE REVISION
A: G0100
OPERATING TEMPERATURE
I: INDUSTRIAL (-40°C TO +85°C)
PACKAGE DESIGNATOR
R: HIGH DENSITY ARRAY (HDA)
Table 1. Key Differences Between Family of Parts
Part
Description
VIN Range (V)
VOUT Range (V)
IOUT (A)
ISL8274M
Digital DC/DC PMBus Dual Channel 30A/30A Module
4.5 - 14
0.6 - 5.0
30/30
ISL8272M
Digital DC/DC PMBus Single Channel 50A Module
4.5 - 14
0.6 - 5.0
50
ISL8273M
Digital DC/DC PMBus Single Channel 80A Module
4.5 - 14
0.6 - 2.5
80
ZL9024M
Digital DC/DC PMBus Single Channel 33A Module
2.75-4
0.6 - 1.5
33
FN8931 Rev.1.00
Jan 4, 2018
Page 7 of 81
ISL8274M
1.4
1. Overview
Pin Configuration
ISL8274M
(58 Ld HDA)
Top View
1
2
3
4
A
VSET2
C
PGND
PGND
8
VSET1
10
11
12
VOUT2
ASCR1
VMON
U
17
18
EN2
VSEN2P
SYNC/OCP
EN1
VTRKP
PGND
VSEN2N
PAD6
PG2
PGND
PAD7
PAD5
T
16
V25
SGND
VDD
SGND
PGND
VR5
VR SWD1
M
R
15
PAD2
SALRT SDA
PG1
DDC
VSEN1N VSEN1P
L
P
14
SA/CFG
K
N
13
SCL
ASCR2
VTRKN
J
9
VOUT1
SS/TRACK
E
H
7
PAD4
PAD3
D
G
6
PAD1
B
F
5
PGND
VCC
VR6 SGND
VR55
PAD8
PGND VDRV
VDRV
SWD2
VDRV1
VDRV1
VIN
PAD9
VIN
PAD10
PGND
PAD12
PAD11
VIN
PGND
V
W
PGND
SW1
PGND
SW2
Y
AA
PAD15
PAD13
AB
AC
FN8931 Rev.1.00
Jan 4, 2018
PAD14
PAD16
Page 8 of 81
ISL8274M
1.5
1. Overview
Pin Descriptions
Pin
Number
Pin
Name
PAD1
VOUT1
PWR Power supply output voltage. Channel 1 provides an output voltage from 0.6V to 5V. Refer to the
“Functional Description” on page 21 to set the maximum output current from these pads.
PAD2
VOUT2
PWR Power supply output voltage. Channel 2 provides an output voltage from 0.6V to 5V. Refer to the
“Functional Description” on page 21 to set the maximum output current from these pads.
PAD3, PAD4,
PAD5, PAD7,
PAD10, PAD12,
PAD13, PAD15
PGND
PWR Power ground. Refer to the “Layout Guide” on page 33 for the PGND pad connections and I/O
capacitor placement.
PWR Signal ground. Refer to “Layout Guide” on page 33 for the SGND pad connections.
Type
Description
PAD6
SGND
PAD8, PAD9,
PAD11
VIN
PWR Input power supply voltage to power the module. Input voltage ranges from 4.5V to 14V.
PAD14
SW1
PWR Switching node pads for Channel 1. The SW1 pad is used to dissipate the heat and provide the
good thermal performance. Refer to “Layout Guide” on page 33 for the SW1 pad connections.
PAD16
SW2
PWR Switching node pads for Channel 2. The SW2 pad is used to dissipate the heat and provide the
good thermal performance. Refer to “Layout Guide” on page 33 for the SW2 pad connections.
C5
VSET2
I
Output voltage selection pin for Channel 2. Used to set VOUT2 set point and VOUT2 max.
C6
VSET1
I
Output voltage selection pin for Channel 1. Used to set VOUT1 set point and VOUT1 max.
C7
ASCR2
I
ChargeMode control ASCR parameters selection pin for Channel 2. Used to set ASCR gain and
residual values.
C8
ASCR1
I
ChargeMode control ASCR parameters selection pin for Channel 1. Used to set ASCR gain and
residual values.
C9
VMON
I
Driver voltage monitoring. Use this pin to monitor VDRV through an external 16:1 resistor divider.
C10
SA/CFG
I
Serial address selection pin. Used to assign unique address for each individual device or to
enable certain management features. This pin also sets the UVLO level.
C11
SALRT
O
Serial alert. Connect to external host if desired. SALRT is asserted low upon a warning or a fault
event and deasserted when warning or fault is cleared. A pull-up resistor is required.
C12
SDA
I/O
Serial data. Connect to external host and/or to other Digital-DC™ devices. A pull-up resistor is
required.
C13
SCL
I/O
Serial clock. Connect to external host and/or to other Digital-DC devices. A pull-up resistor is required.
D4
SS/
TRACK
I
Soft-start/stop selection pin. Used to set turn on/off delay and ramp time as well as tracking
configuration.
D5
PG1
O
Power-good output for Channel 1. Power-good output can be an open drain that requires a pull-up
resistor or push-pull output that can drive a logic input.
D13
SYNC/
OCP
I/O
Clock synchronization input and OCP setting pin. Used to set the frequency of the internal switch
clock, to sync to an external clock or to output internal clock. If external synchronization is used,
the external clock must be active before enable. Different OCP level can be set with this pin.
D14
EN2
I
Enable pin for Channel 2. Logic high to enable the module output.
E14
EN1
I
Enable pin for Channel 1. Logic high to enable the module output.
E4
DDC
I/O
E15
VSEN2P
I
Differential output voltage sense feedback for Channel 2. Connect to positive output regulation
point.
F4
VTRKP
I
Tracking sense positive input. Used to track an external voltage source.
F15
VSEN2N
I
Differential output voltage sense feedback for Channel 2. Connect to negative output regulation
point.
FN8931 Rev.1.00
Jan 4, 2018
A Digital-DC bus. This dedicated bus provides the communication between devices for features
such as sequencing, fault spreading and current sharing. The DDC pin on all Digital-DC devices
should be connected together. A pull-up resistor is required.
Page 9 of 81
ISL8274M
1. Overview
Pin
Number
Pin
Name
Type
G4
VTRKN
I
Tracking sense negative input (return).
G14
PG2
O
Power-good output for Channel 2. Power-good output can be an open drain that requires a pull-up
resistor or push-pull output that can drive a logic input.
G15
V25
H3
VSEN1N
I
Differential output voltage sense feedback for Channel 1. Connect to a negative output regulation
point.
H4
VSEN1P
I
Differential output voltage sense feedback for Channel 1. Connect to a positive output regulation
point.
H16, J16, K16,
M14
SGND
K14
VDD
L2
VR
PWR Internal LDO bias pin. Tie VR to VR55 directly with a short loop trace. Not recommended to power
external circuits.
L3
SWD1
PWR Switching node driving pins for Channel 1. Directly connect to the SW1 pad with short loop wires.
P11
SWD2
PWR Switching node driving pins for Channel 2. Directly connect to the SW2 pad with short loop wires.
L14
VR5
PWR Internal 5V reference used to power internal circuitry. Place a 10µF decoupling capacitor for this
pin. Maximum external loading current is 5mA.
M1
VCC
PWR Internal LDO output. Connect VCC to VDRV for internal LDO driving.
M5, M17, N5
PGND
PWR Power grounds. Using multiple vias to connect the PGND pins to the internal PGND layer.
M10
VR55
PWR Internal 5.5V bias voltage for internal LDO use only. Tie VR55 pin directly to the VR pin. Not
recommended to power external circuit.
M13
VR6
PWR Internal 6V reference used to power internal circuitry. Place a 10µF decoupling capacitor for this
pin. Not recommended to power external circuit.
N6, N16
VDRV
PWR Power supply for internal FET drivers. Connect a 10μF bypass capacitor to each of these pins.
These pins can be driven by the internal LDO through VCC pin or by the external power supply
directly. Keep the driving voltage between 4.5V and 5.5V. For 5V input application, use external
supply or connect this pin to VIN.
R8, R17
VDRV1
Description
PWR Internal 2.5V reference used to power internal circuitry. No external capacitor required for this pin.
Not recommended to power external circuits.
PWR Signal grounds. Use multiple vias to connect the SGND pins to the internal SGND layer.
PWR Input supply voltage for controller. Connect VDD pad to VIN supply.
I
Bias pin of the internal FET drivers. Always tie to VDRV.
Table 2. ISL8274M Design Guide Matrix and Output Voltage Response
VOUT
(V)
IOUT
(A)
Avg OCP
(A)
COUT_Bulk
(µF)
COUT_Ceramic
(µF)
ASCR
Gain
ASCR
Residual
Peak-to-Peak
(mV)
Frequency
(kHz)
5
25
30
1*470
6*100
275
100
170
1067
5
20
25
1*470
6*100
175
80
150
615
3.3
25
30
1*470
8*100
300
90
150
800
3.3
20
25
1*470
8*100
175
80
140
571
2.5
30
35
1*470
9*100
600
100
110
1067
2.5
25
30
1*470
9*100
350
100
120
615
2.5
20
25
1*470
9*100
175
90
100
471
1.8
30
35
1*470
12*100
600
100
90
889
1.8
25
30
1*470
12*100
250
100
100
421
1.8
20
25
1*470
12*100
200
100
100
364
1.5
30
35
1*470
12*100
525
90
90
889
1.5
25
30
1*470
12*100
250
100
90
421
FN8931 Rev.1.00
Jan 4, 2018
Page 10 of 81
ISL8274M
1. Overview
Table 2. ISL8274M Design Guide Matrix and Output Voltage Response (Continued)
VOUT
(V)
IOUT
(A)
Avg OCP
(A)
COUT_Bulk
(µF)
COUT_Ceramic
(µF)
ASCR
Gain
ASCR
Residual
Peak-to-Peak
(mV)
Frequency
(kHz)
1.5
20
25
1*470
12*100
140
90
100
320
1.2
30
35
1*470
12*100
600
110
70
727
1.2
25
30
4*470
12*100
250
80
60
296
1
30
35
1*470
12*100
450
110
80
615
1
25
30
5*470
12*100
250
80
50
296
0.6
30
35
7*470
12*100
300
90
50
296
Notes:
8. 2x470µF (EEE-1EA471P) and 12x22µF (GRM32ER71E226KE15L) are used for all conditions in the evaluation board.
9. 100µF (GRM31CD80J107ME39L) ceramic and 470µF (6TPF470MAH) are selected for output capacitor in the evaluation board.
10. Peak-to-peak VOUT deviation is measured under 50%-100% load transient while 12V input applied.
11. ASCR gain and residual was designed to achieve 50° phase margin over temperature. (Ambient temperature from -40°C to
+85°C).
12. Frequency is selected to achieve the highest efficiency at full load as well as avoid saturation of the inductor. For instance,
select 615kHz instead of 296kHz if 1V, 26A is required to avoid inductor saturation. Although better efficiency is obtained at
296kHz supporting 1V, 25A, higher frequency can be selected because less output capacitance is required to meet the transient
response specification.
FN8931 Rev.1.00
Jan 4, 2018
Page 11 of 81
ISL8274M
2.
2. Specifications
Specifications
2.1
Absolute Maximum Ratings
Minimum
Maximum
Input Supply Voltage, VIN Pin
Parameter
-0.3
17
Unit
V
Input Supply Voltage for Controller, VDD Pin
-0.3
17
V
MOSFET Switch Node Voltage, SW1/2, SWD1/2 (Note 13)
-0.3
25
V
MOSFET Driver Supply Voltage, VDRV, VDRV1 Pin
-0.3
6.0
V
Output Voltage, VOUT1/2 Pin
-0.3
6.0
V
Internal Reference Supply Voltage
VR6 Pin
-0.3
6.6
V
VR, VR5, VR55 Pin
-0.3
6.5
V
V25 Pin
-0.3
3
V
Logic I/O Voltage for DDC, EN1/2, PG1/2, ASCR1/2, SA/CFG, SCL,
SDA, SALRT, SYNC/OCP, SS/TRACK, VMON, VSET1/2
-0.3
6.0
V
Analog Input Voltages
VSEN1P, VSEN2P, VTRKP
-0.3
6.0
V
VSEN1N, VSEN2N, VTRKN
-0.3
0.3
V
ESD Rating
Human Body Model (Tested per JS-001-2014)
Value
Unit
2
kV
Machine Model (Tested per JESD22-A115C)
200
V
Charged Device Model (Tested per JS-002-2014)
750
V
Latch-Up (Tested per JESD78E; Class 2, Level A)
100
mA
Note:
13. Do not apply DC voltage higher than 17V to the pins.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may
adversely impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
Thermal Resistance (Typical)
58 Ld HDA Package (Notes 14, 15)
JA (°C/W)
JC (°C/W)
5.3
1.1
Notes:
14. JA is defined by simulation in free air with the module mounted on an 8-layer evaluation board 4.7x4.8inch in size with 2oz Cu
on all layers.
15. For JC, the “case temp” location is the center of the package underside.
Parameter
Minimum
Maximum Junction Temperature (Plastic Package)
Storage Temperature Range
-55
Pb-Free Reflow Profile
2.3
Maximum
Unit
+125
°C
+150
°C
see Figure 33
Recommended Operation Conditions
Minimum
Maximum
Unit
Input Supply Voltage Range, VIN
Parameter
4.5
14
V
Input Supply Voltage Range for Controller, VDD
4.5
14
V
Output Voltage Range, VOUT
0.6
5
V
0
30
A
-40
+125
°C
Output Current Range, IOUT(DC) Per Channel (Note 18)
Operating Junction Temperature Range, TJ
FN8931 Rev.1.00
Jan 4, 2018
Page 12 of 81
ISL8274M
2.4
2. Specifications
Electrical Specifications
VIN = VDD = 12V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply across the
operating temperature range, -40°C to +85°C.
Parameter
Symbol
Test Conditions
Min
(Note 16)
Typ
Max
(Note 16)
Unit
40
50
mA
5.5
6.1
6.6
V
4.5
5.2
5.5
V
2.25
2.5
2.75
V
Input and Supply Characteristics
Input Supply Current for
Controller
IDD
6V Internal Reference Supply
Voltage
VR6
5V Internal Reference Supply
VR5
2.5V Internal Reference Supply
V25
Internal LDO Output Voltage
VCC
Internal LDO Output Current
IVCC
Input Supply Voltage for
Controller Read Back
Resolution
VDD_READ_RES
Input Supply Voltage for
Controller Read Back Total Error
(Note 19)
VDD_READ_ERR
VIN = VDD = 12V, VOUT = 0V,
module not enabled
IVR5 < 5mA
5.3
VIN = VDD = 12V, VCC connected
to VDRV, module enabled
V
50
PMBus Read
mA
±20
mV
±2
% FS
Output Characteristics
Output Voltage Adjustment
Range
VOUT_RANGE
0.54
Output Voltage Set-Point
Resolution
VOUT_RES
Configured using PMBus
Output Voltage Set-Point
Accuracy (Notes 17, 19)
VOUT_ACCY
Includes line, load, and
temperature
(-20°C ≤ TA ≤ +85°C)
Output Voltage Read Back
Resolution
VOUT_READ_RES
Output Voltage Read Back Total
Error (Note 19)
VOUT_READ_ERR
Output Ripple Voltage
Output Current Read Back
Resolution
5.5
±0.025
-1.2
%VOUT
1.2
±0.15
PMBus read
-2
V
%
% FS
2
% FS
VOUT_RIPPLE
VOUT = 1.5V, COUT = 1 x 470µF
POSCAP + 12 x 100µF ceramic
1
%
IOUT_READ_RES
ISENSE_CONFIG default setting
0.2
A
Output Current Range (Note 18)
IOUT_RANGE
Per channel
30
Output Current Read Back Total
Error
IOUT_READ_ERR
PMBus read at max load
VOUT = 1.5V
tON_DELAY
Configured using PMBus
2
Configured using PMBus
0.5
A
±3
A
Soft-Start and Sequencing
Delay Time from Enable to VOUT
Rise
tON_DELAY Accuracy
tON_DELAY_ACCY
Output Voltage Ramp-Up Time
tON_RISE
Output Voltage Ramp-Up Time
Accuracy
tON_RISE_ACCY
Delay Time from Disable to
VOUT Fall
tOFF_DELAY Accuracy
FN8931 Rev.1.00
Jan 4, 2018
tOFF_DELAY
tOFF_DELAY_ACCY
300
ms
120
ms
±2
ms
±250
Configured using PMBus
2
µs
300
±2
ms
ms
Page 13 of 81
ISL8274M
2. Specifications
VIN = VDD = 12V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply across the
operating temperature range, -40°C to +85°C. (Continued)
Parameter
Symbol
Output Voltage Fall Time
tOFF_FALL
Output Voltage Fall Time
Accuracy
tON_FALL_ACCY
Test Conditions
Configured using PMBus
Min
(Note 16)
Typ
0.5
Max
(Note 16)
Unit
120
ms
±250
µs
Power-Good
Power-Good Delay
VPG_DELAY
Configured using PMBus
0
5000
ms
Temperature Sense
Temperature Sense Range
TSENSE_RANGE
Configurable using PMBus
-50
150
C
Internal Temperature Sensor
Accuracy
INT_TEMPACCY
Tested at +100°C
-5
5
C
4.18
16
V
Fault Protection
VDD Undervoltage Threshold
Range
VDD_UVLO_RANGE
VDD Undervoltage Threshold
Accuracy (Note 19)
VDD_UVLO_ACCY
±2
%FS
VDD Undervoltage Response
Time
VDD_UVLO_DELAY
10
µs
VOUT Overvoltage Threshold
Range
VOUT_OV_RANGE
VOUT Undervoltage Threshold
Range
VOUT_UV_RANGE
Factory default
Configured using PMBus
VOUT_OV/UV_ACCY
VOUT OV/UV Response Time
VOUT_OV/UV_DELAY
Output Current Limit Set-Point
Accuracy (Note 19)
ILIMIT_ACCY
Over-temperature Protection
Threshold
(Controller Junction
Temperature)
TJUNCTION
1.15VOUT
1.05VOUT
Factory default
Configured using PMBus
VOUT OV/UV Threshold
Accuracy (Note 17)
Thermal Protection Hysteresis
Measured internally
0.85VOUT
V
V
0
0.95VOUT
V
-2
2
%
Tested at
IOUT_AVG_OC_FAULT_LIMIT =
35A
Factory default
Configured using PMBus
V
VOUT_MAX
10
µs
±10
% FS
C
115
-40
115
C
15
TJUNCTION_HYS
C
Oscillator and Switching Characteristics
Switching Frequency Range
fSW_RANGE
296
1067
kHz
Switching Frequency Set-Point
Accuracy
fSW_ACCY
-5
5
%
Minimum Pulse Width Required
from External SYNC Clock
EXT_SYNCPW
Drift Tolerance for External
SYNC Clock
FN8931 Rev.1.00
Jan 4, 2018
EXT_SYNCDRIFT
Measured at 50% amplitude
150
External SYNC clock equal to
500kHz is not supported
-10
ns
10
%
Page 14 of 81
ISL8274M
2. Specifications
VIN = VDD = 12V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply across the
operating temperature range, -40°C to +85°C. (Continued)
Parameter
Symbol
Test Conditions
ILOGIC_BIAS
DDC, EN1/2, PG1/2, SA/CFG,
SCL, SDA, ASCR1/2, SS/TRACK,
SALRT, SYNC/OCP, VMON,
VSET1/2
Min
(Note 16)
Typ
Max
(Note 16)
Unit
+100
nA
0.8
V
Logic Input/Output Characteristics
Bias Current at the Logic Input
Pins
Logic Input Low Threshold
Voltage
VLOGIC_IN_LOW
Logic Input High Threshold
Voltage
VLOGIC_IN_HIGH
Logic Output Low Threshold
Voltage
VLOGIC_OUT_LOW
2mA sinking
Logic Output High Threshold
Voltage
VLOGIC_OUT_HIGH
2mA sourcing
-100
2.0
V
0.5
2.25
V
V
PMBus Interface Timing Characteristic
PMBus Operating Frequency
fSMB
100
400
kHz
Notes:
16. Compliance to datasheet limits is assured by one or more methods: Production test, characterization, and/or design. Controller
is independently tested before module assembly.
17. VOUT measured at the termination of the VSEN1/2P and VSEN1/2N sense points.
18. The MAX load current is determined by the thermal “Derating Curves” on page 20.
19. “FS” stands for full scale of recommended maximum operation range.
FN8931 Rev.1.00
Jan 4, 2018
Page 15 of 81
ISL8274M
3.
3. Typical Performance Curves
Typical Performance Curves
3.1
Efficiency Performance
Operating condition: TA = +25°C, no air flow. COUT = 1 x 470µF POSCAP + 12 x 100µF Ceramic. Typical values are used unless otherwise
noted. The efficiency curves were measured on the evaluation board. For test conditions, refer to Table 2 on page 10.
95
95
12VIN
90
90
85
85
Efficiency (%)
Efficiency (%)
12VIN
80
75
70
0.6V_296kHz
1V_615kHz
1.2V_727kHz
1.5V_889kHz
1.8V_889kHz
2.5V_1067kHz
80
75
70
1V_296kHz
1.2V_296kHz
1.5V_421kHz
1.8V_421kHz
2.5V_615kHz
3.3V_800kHz
5V_1067kHz
65
65
0
5
10
15
20
25
0
30
5
10
Figure 5. Single Channel Efficiency vs Output Current
25
95
5VIN
12VIN
95
90
90
Efficiency (%)
Efficiency (%)
20
Figure 6. Single Channel Efficiency vs Output Current
100
85
80
75
1.5V_320kHz
85
80
75
1.8V_364kHz
2.5V_471kHz
70
3.3V_571kHz
70
5V_615kHz
0.6V_296kHz
1V_615kHz
1.2V_727kHz
1.5V_889kHz
1.8V_889kHz
2.5V_1067kHz
65
65
0
5
10
15
0
20
5
10
15
20
25
30
Load Current (A)
Load Current (A)
Figure 7. Single Channel Efficiency vs Output Current
Figure 8. Single Channel Efficiency vs Output Current
95
100
5VIN
5VIN
95
90
85
Efficiency (%)
Efficiency (%)
15
Load Current (A)
Load Current (A)
80
75
70
1V_296kHz
1.2V_296kHz
1.5V_421kHz
1.8V_421kHz
2.5V_615kHz
3.3V_800kHz
90
85
80
75
1.5V_320kHz
1.8V_364kHz
70
2.5V_471kHz
3.3V_571kHz
65
65
0
5
10
15
20
25
Load Current (A)
Figure 9. Single Channel Efficiency vs Output Current
FN8931 Rev.1.00
Jan 4, 2018
0
5
10
15
20
Load Current (A)
Figure 10. Single Channel Efficiency vs Output Current
Page 16 of 81
ISL8274M
3.2
3. Typical Performance Curves
Startup and Shutdown
Operating condition: TA = +25°C, no air flow. COUT = 1 x 470µF POSCAP + 12 x 100µF Ceramic. Typical values are used unless otherwise
noted.
SW (10V/Div)
SW (10V/Div)
IOUT (20A/Div)
IOUT (20A/Div)
VOUT (750mV/Div)
VOUT (750mV/Div)
PG (5V/Div)
PG (5V/Div)
2ms/Div
2ms/Div
Figure 11. Single Channel Startup 12VIN, 1.5VOUT, 30A
Figure 12. Single Channel Startup 12VIN, 1.5VOUT, 0A
SW (10V/Div)
SW (10V/Div)
IOUT (20A/Div)
IOUT (20A/Div)
VOUT (750mV/Div)
VOUT (750mV/Div)
PG (5V/Div)
PG (5V/Div)
100µs/Div
1s/Div
Figure 13. Single Channel Shutdown 12VIN, 1.5VOUT, 30A
Figure 14. Single Channel Shutdown 12VIN, 1.5VOUT, 0A
FN8931 Rev.1.00
Jan 4, 2018
Page 17 of 81
ISL8274M
3.3
3. Typical Performance Curves
Derating Curves
All of the following curves were plotted at TJ = +125°C. The derating curves were measured on the evaluation board. For test conditions,
refer to Table 2 on page 10. Load current is applied per channel, two channels are operating at the same time.
35
35
fSW = 615kHz
30
Load Current (A)
Load Current (A)
25
20
15
0LFM
10
200LFM
25
20
15
0LFM
10
200LFM
400LFM
5
fSW = 615kHz
30
5
400LFM
0
0
25
45
65
85
105
25
125
45
65
85
30
30
fSW = 296kHz
fSW = 296kHz
25
25
Load Current (A)
Load Current (A)
125
Figure 16. 5VIN to 1VOUT
Figure 15. 12VIN to 1VOUT
20
15
10
0LFM
200LFM
5
20
15
10
0LFM
200LFM
5
400LFM
400LFM
0
0
25
45
65
85
105
125
25
45
Ambient Temperature (oC)
65
85
105
125
Ambient Temperature (oC)
Figure 18. 5VIN to 1VOUT
Figure 17. 12VIN to 1VOUT
35
35
fSW = 889kHz
fSW = 889kHz
30
30
25
Load Current (A)
Load Current (A)
105
Ambient Temperature (oC)
Ambient Temperature (oC)
20
15
10
0LFM
20
15
0LFM
10
200LFM
200LFM
5
25
5
400LFM
400LFM
0
0
25
45
65
85
Ambient Temperature (oC)
Figure 19. 12VIN to 1.5VOUT
FN8931 Rev.1.00
Jan 4, 2018
105
125
25
45
65
85
105
125
Ambient Temperature (oC)
Figure 20. 5VIN to 1.5VOUT
Page 18 of 81
ISL8274M
3. Typical Performance Curves
All of the following curves were plotted at TJ = +125°C. The derating curves were measured on the evaluation board. For test conditions,
refer to Table 2 on page 10. Load current is applied per channel, two channels are operating at the same time. (Continued)
30
35
30
25
Load Current (A)
Load Current (A)
fSW = 889kHz
fSW = 1067kHz
25
20
15
10
0LFM
200LFM
5
20
15
10
0LFM
200LFM
5
400LFM
400LFM
0
0
25
45
65
85
105
125
25
45
65
85
105
125
Ambient Temperature (oC)
Ambient Temperature (oC)
Figure 21. 12VIN to 2.5VOUT
Figure 22. 5VIN to 2.5VOUT
30
fSW = 1067kHz
Load Current (A)
25
20
15
10
0LFM
200LFM
5
400LFM
0
25
45
65
85
105
125
Ambient Temperature (oC)
Figure 23. 12VIN to 5VOUT
FN8931 Rev.1.00
Jan 4, 2018
Page 19 of 81
ISL8274M
3.4
3. Typical Performance Curves
Transient Response Performance
Operating condition: TA = +25°C, no air flow. Refer to Table 2 on page 10 for output capacitor and ASCR settings. Typical values are used
unless otherwise noted.
IOUT (5A/Div)
IOUT (5A/Div)
VOUT (50mV/Div)
VOUT (50mV/Div)
50µs/Div
Figure 24. 0A-15A, >10A/µs, 12VIN,1VOUT, 615kHz
50µs/Div
Figure 25. 0A-15A, >10A/µs, 12VIN,1.5VOUT, 889kHz
IOUT (5A/Div)
IOUT (5A/Div)
VOUT (50mV/Div)
VOUT (50mV/Div)
50µs/Div
50µs/Div
Figure 26. 0A-15A, >10A/µs, 12VIN,1.8VOUT, 889kHz
Figure 27. 0A-15A, >10A/µs, 12VIN, 2.5VOUT, 1067kHz
IOUT (5A/Div)
IOUT (5A/Div)
VOUT (50mV/Div)
VOUT (50mV/Div)
50µs/Div
50µs/Div
Figure 28. 0A-12.5A, >10A/µs, 12VIN, 3.3VOUT, 800kHz
Figure 29. 0A-12.5A, >10A/µs, 12VIN, 5VOUT, 1067kHz
FN8931 Rev.1.00
Jan 4, 2018
Page 20 of 81
ISL8274M
4.
4. Functional Description
Functional Description
4.1
SMBus Communications
The ISL8274M provides a PMBus digital interface that enables the user to configure all aspects of the module
operation as well as monitor the input and output parameters. The ISL8274M can be used with any SMBus host
device. In addition, the module is compatible with PMBus Power System Management Protocol Specification Parts
I and II version 1.2. The ISL8274M accepts most standard PMBus commands. When configuring the device using
PMBus commands, it is recommended that the enable pin is tied to SGND.
The SMBus device address is the only parameter that must be set by the external pins. All other device parameters
can be set using PMBus commands.
The ISL8274M can operate without the PMBus in pin-strap mode with configurations programmed by pin-strap
resistors, such as output voltage, ASCR setting, switching frequency, OCP limit, device SMBus address, input
UVLO, soft-start/stop, and tracking.
4.2
Output Voltage Selection
The output voltages of both channels may be set to a voltage between 0.6V and 5V if the input voltage is higher
than the desired output voltage by an amount sufficient to maintain regulation.
The VSET1/2 pins are used to set the output voltage VOUT1/2 to levels as shown in Table 3. The RSET1/2 resistor
is placed between the VSET1/2 pins and SGND. A standard 1% resistor is required.
Table 3. Output Voltage Resistor Settings
FN8931 Rev.1.00
Jan 4, 2018
VOUT1/2 (V)
RSET1/2 (kΩ)
1
LOW
1.5
OPEN
3.3
HIGH
0.6
10
0.675
11
0.7
12.1
0.72
13.3
0.75
14.7
0.8
16.2
0.85
17.8
0.9
19.6
0.93
21.5
0.95
23.7
0.98
26.1
1.03
28.7
1.05
31.6
1.1
34.8
1.12
38.3
1.15
42.2
1.2
46.4
1.25
51.1
1.3
56.2
1.35
61.9
Page 21 of 81
ISL8274M
4. Functional Description
Table 3. Output Voltage Resistor Settings (Continued)
VOUT1/2 (V)
RSET1/2 (kΩ)
1.4
68.1
1.65
75
1.8
82.5
1.85
90.9
2
100
2.4
110
2.5
121
2.8
133
3
147
3.6
162
5
178
The output voltage may also be set to any value between 0.6V and 5V using the PMBus command
VOUT_COMMAND. This device supports dynamic voltage scaling by allowing change to the output voltage set
point during regulation. The voltage transition rate is specified by the PMBus command
VOUT_TRANSITION_RATE.
By default, VOUT_MAX is set to 110% of VOUT set by the pin-strap resistor, which can be changed to any value up
to 5.5V by the PMBus Command VOUT_MAX.
4.3
Soft-Start, Stop Delay, and Ramp Times
The ISL8274M follows an internal start-up procedure after power is applied to the VDD pin. The module requires
approximately 60ms to 70ms to check for specific values stored in its internal memory and programmed by
pin-strap resistors. Once this process is completed, the device is ready to accept commands through the PMBus
interface and the module is ready to be enabled. If the module is to be synchronized to an external clock source, the
clock frequency must be stable before asserting the EN pin.
It may be necessary to set a delay from when an enable signal is received until the output voltage starts to ramp to
its target value. In addition, the designer may wish to precisely set the time required for VOUT to ramp to its target
value after the delay period has expired. These features can be used as part of an overall inrush current management
strategy or to precisely control how fast a load IC is turned on. The ISL8274M gives the system designer several
options for precisely and independently controlling both the delay and ramp time periods. The soft-start delay
period begins when the EN pin is asserted and ends when the delay time expires.
The soft-start delay and ramp-up time can be programmed to custom values using the PMBus commands
TON_DELAY and TON_RISE. When the delay time is set to 0ms, the device begins its ramp-up after the internal
circuitry has initialized (approximately 2ms). When the soft-start ramp period is set to 0ms, the output ramps up as
quickly as the output load capacitance and loop settings allow. It is generally recommended to set the soft-start
ramp to a value greater than 2ms to prevent inadvertent fault conditions due to excessive inrush current.
Similar to the soft-start delay and ramp-up time, the delay and ramp down time for soft-stop/off can be
programmed using the PMBus commands TOFF_DELAY and TOFF_FALL. In addition, the module can be
configured as “immediate off” using the command ON_OFF_CONFIG, so that the internal MOSFETs are turned
off immediately after the delay time expires.
The SS/TRACK pin can be used to program the soft-start/stop delay time and ramp time to some typical values as
well as enable/disable the tracking function shown in Table 4 on page 23.
FN8931 Rev.1.00
Jan 4, 2018
Page 22 of 81
ISL8274M
4. Functional Description
Table 4. Soft-Start/Stop and Tracking Resistor Settings
TON_DELAY
TOFF_DELAY (ms)
TON_RISE
TOFF_FALL (ms)
Tracking
Ch1
Ch2
Ch1
Ch2
Ch1
Ch2
R (kΩ)
5
5
2
2
No
No
LOW
5
5
2
5
No
No
OPEN
5
5
5
2
No
No
HIGH
5
5
5
5
No
No
10
5
10
2
2
No
No
11
5
10
2
5
No
No
12.1
5
10
5
2
No
No
13.3
5
10
5
5
No
No
14.7
10
5
2
2
No
No
16.2
10
5
2
5
No
No
17.8
10
5
5
2
No
No
19.6
10
5
5
5
No
No
21.5
20
5
2
2
No
No
23.7
20
5
5
5
No
No
26.1
5
20
2
2
No
No
28.7
5
20
2
5
No
No
31.6
5
20
5
2
No
No
34.8
5
20
5
5
No
No
38.3
5
N/A
2
N/A
No
Track 100%
42.2
5
N/A
2
N/A
No
Track 50%
46.4
5
N/A
5
N/A
No
Track 100%
51.1
5
N/A
5
N/A
No
Track 50%
56.2
10
N/A
2
N/A
No
Track 100%
61.9
10
N/A
2
N/A
No
Track 50%
68.1
10
N/A
5
N/A
No
Track 100%
75
10
N/A
5
N/A
No
Track 50%
82.5
N/A
5
N/A
2
Track 100%
No
90.9
N/A
5
N/A
2
Track 50%
No
100
N/A
5
N/A
5
Track 100%
No
110
N/A
5
N/A
5
Track 50%
No
121
N/A
10
N/A
2
Track 100%
No
133
N/A
10
N/A
2
Track 50%
No
147
N/A
10
N/A
5
Track 100%
No
162
N/A
10
N/A
5
Track 50%
No
178
FN8931 Rev.1.00
Jan 4, 2018
Page 23 of 81
ISL8274M
4.4
4. Functional Description
Voltage Tracking
Numerous high performance systems place stringent demands on the order in which the power supply voltages are
turned on. This is particularly true when powering FPGAs, ASICs, and other advanced processor devices that
require multiple supply voltages to power a single die. In most cases, the I/O interface operates at a higher voltage
than the core and therefore, the core supply voltage must not exceed the I/O supply voltage according to the
manufacturers' specifications.
The ISL8274M integrates a tracking scheme that allows one of its outputs (Channel 1 or Channel 2) to track a
voltage that is applied to the VTRKP and VTRKN pins with no external components required. The VTRKP and
VTRKN pins are analog inputs that, when the tracking mode is enabled, configure the voltage applied to the
VTRKP and VTRKN pins to act as a reference for the device's output regulation.
Figure 30 illustrates the typical connection and the two tracking modes:
• Coincident - This mode configures the ISL8274M to ramp its output voltage at the same rate as the voltage
applied to the VTRK pin until it reaches its desired output voltage. The device that is tracking another output
voltage (slave) must be set to its desired steady-state output voltage.
• Ratio-metric - This mode configures the ISL8274M to ramp its output voltage at a rate that is a percentage of the
voltage applied to the VTRKP and VTRKN pins. The default setting is 50%, but an external resistor string can be
used to configure a different tracking ratio. The device that is tracking another output voltage (slave) must be set
to its desired steady-state output voltage.
VIN
VTRKN
VTRKP
ISL8274M
Q1
L1
Q2
Vo2
C1
Vo1
VOUT
Vo1
Vo2
TIME
COINCIDENT
V OUT
Vo1
Vo2
TIME
RATIOMETRIC
Figure 30. Tracking Modes
FN8931 Rev.1.00
Jan 4, 2018
Page 24 of 81
ISL8274M
4. Functional Description
The master ISL8274M device in a tracking group is defined as the device that has the highest target output voltage
within the group. This master device will control the ramp rate of all tracking devices and is not configured for
tracking mode. The maximum tracking rise time is 1V/ms. The slave device must be enabled before the master.
Any device that is configured for tracking mode will ignore its TON_DELAY and TON_RISE settings and its
output will take on the turn-on/turn-off characteristics of the reference voltage present at the VTRKP and VTRKN
pins. Tracking mode can be configured by using the TRACK_CONFIG command.
The VOUT_COMMAND needs to be set the same as the target tracking voltage when tracking is enabled. For
example, the VOUT_COMMAND of the Page1 (VOUT2 which enables the tracking) needs to set to 1V if tracking
100% is selected and a ramp of 1V is applied to VTRKP and VTRKN. The VOUT_COMMAND of Page 1
(VOUT2 which enables the tracking) needs to set to 1V if tracking 50% is selected and a ramp of 2V is applied to
VTRKP and VTRKN. In Tracking mode, the minimum voltage that can be tracked is ~200mV.
4.5
Power-Good
The ISL8274M provides a Power-Good (PG) signal that indicates the output voltage is within a specified tolerance
of its target level and no fault condition exists. By default, the PG pin asserts if the output is within 10% of the
target voltage. This limit may be changed using the PMBus command POWER_GOOD_ON.
A PG delay period is defined as the time from when all conditions within the ISL8274M for asserting PG are met to
when the PG pin is actually asserted. This feature is commonly used instead of using an external reset controller to
control external digital logic. A PG delay can be programmed using the PMBus command
POWER_GOOD_DELAY.
4.6
Switching Frequency and PLL
The device’s switching frequency is set from 296kHz to 1067kHz using the pin-strap method (combined with the
average OCP limit setting) as shown in Table 5, or by using the PMBus command FREQUENCY_SWITCH. The
ISL8274M incorporates an internal Phase-Locked Loop (PLL) to clock the internal circuitry. The PLL can be
driven by an external clock source connected to the SYNC pin. It is recommended that when using an external
clock, the same frequency should be set in the FREQUENCY_SWITCH command. If the external clock is lost, the
module will automatically switch to the internal clock. When using the internal oscillator, the SYNC pin can be
configured as a clock source and as an external sync to other modules. Refer to “SYNC_CONFIG (E9h)” on
page 67 for more information.
Table 5. Switching Frequency and OCP Limit Resistor Setting
SYNC/OCP
OCP Avg
R (kΩ)
Fsw (KHz)
Ch1 (A)
Ch2 (A)
LOW
296
35
35
OPEN
889
35
35
HIGH
1067
35
35
10
296
30
35
11
296
30
30
12.1
296
25
35
13.3
296
25
30
14.7
296
25
25
16.2
320
25
35
17.8
320
25
30
19.6
320
25
25
21.5
320
20
30
23.7
320
20
25
26.1
364
25
35
FN8931 Rev.1.00
Jan 4, 2018
Page 25 of 81
ISL8274M
4. Functional Description
Table 5. Switching Frequency and OCP Limit Resistor Setting (Continued)
SYNC/OCP
OCP Avg
R (kΩ)
Fsw (KHz)
Ch1 (A)
Ch2 (A)
28.7
364
25
30
31.6
364
20
30
34.8
421
30
35
38.3
421
30
30
42.2
471
25
35
46.4
471
25
30
51.1
471
20
35
56.2
571
25
35
61.9
571
25
30
68.1
571
20
35
75
571
20
30
82.5
615
35
35
90.9
615
35
30
100
615
30
30
110
615
25
35
121
615
25
30
133
615
25
25
147
727
35
35
162
800
30
35
178
800
30
30
FN8931 Rev.1.00
Jan 4, 2018
Page 26 of 81
ISL8274M
4.7
4. Functional Description
Output Overcurrent Protection
The ISL8274M is protected from damage if the output is shorted to ground or if an overload condition is imposed
on the output. Average output overcurrent fault threshold can be programmed by the PMBus command
IOUT_AVG_OC_FAULT_LIMIT while the peak output overcurrent fault threshold can be programmed by the
PMBus command IOUT_OC_FAULT_LIMIT. The default response from an average overcurrent fault is an
immediate shutdown without retry. A continuous retry can be enabled using the PMBus command
MFR_IOUT_OC_FAULT_RESPONSE. A hard bound of 50A is applied to the peak overcurrent limit.
The average OCP limit can be set by the SYNC/OCP pin strap as well. Refer to Table 5 on page 25 for more
information.
4.8
Loop Compensation
The module loop response is programmable through the PMBus command ASCR_CONFIG or by using the
pin-strap method (ASCR1/2 pins) according to Table 6. The ISL8274M uses the ChargeMode control algorithm
that responds to the output current changes within a single PWM switching cycle, achieving a smaller total output
voltage variation with less output capacitance than traditional PWM controllers.
Table 6. ASCR Resistor Setting
ASCR Gain
ASCR Residual
R (kΩ)
350
110
LOW
525
90
OPEN
475
80
HIGH
100
90
10
100
100
11
120
90
12.1
120
100
13.3
140
90
14.7
140
100
16.2
140
110
17.8
150
90
19.6
150
100
21.5
160
70
23.7
160
90
26.1
175
80
28.7
175
90
31.6
200
90
34.8
200
100
38.3
200
110
42.2
225
80
46.4
225
90
51.1
250
80
56.2
250
100
61.9
275
90
68.1
275
100
75
300
70
82.5
300
90
90.9
FN8931 Rev.1.00
Jan 4, 2018
Page 27 of 81
ISL8274M
4. Functional Description
Table 6. ASCR Resistor Setting (Continued)
4.9
ASCR Gain
ASCR Residual
R (kΩ)
350
100
100
450
100
110
450
110
121
500
70
133
500
90
147
600
100
162
600
110
178
SMBus Module Address Selection
Each module must have its own unique serial address to distinguish between other devices on the bus. The module
address is set by connecting a resistor between pins SA/CFG and SGND. The SA/CFG pin also defines the input
undervoltage lockout limit. The input Undervoltge Lockout (UVLO) prevents the ISL8274M from operating when
the input falls below a preset threshold, indicating the input supply is out of its specified range. The UVLO
threshold (VUVLO) can be set between 4.18V and 16V by using the PMBus command VIN_UV_FAULT_LIMIT.
Table 7 lists the available module addresses.
A fault response to an input undervoltage fault can be programmed by the PMBus command
VIN_UV_FAULT_RESPONSE. If the input undervoltage fault retry is enabled, the module will shut down immediately
once the input voltage falls below VUVLO and then continuously checks the input voltage after a retry delay time, which
can be configured from 35ms to 280ms. If the input voltage rises above the input undervoltage warning level, the module
will restart. The input undervoltage warning is 1.05*VUVLO by default and can be programmed by the PMBus command
VIN_UV_WARN_LIMIT.
Table 7. SMBus Address and UVLO Resistor Setting
FN8931 Rev.1.00
Jan 4, 2018
PMBus Address
UVLO (V)
R (kΩ)
26h
4.5
LOW
28h
4.5
OPEN
19h
10.8
10
1Ah
4.5
11
1Bh
10.8
12.1
1Ch
4.5
13.3
1Dh
10.8
14.7
1Eh
4.5
16.2
1Fh
10.8
17.8
20h
4.5
19.6
21h
10.8
21.5
22h
4.5
23.7
23h
10.8
26.1
24h
4.5
28.7
25h
10.8
31.6
26h
4.5
34.8
27h
10.8
38.3
28h
4.5
42.2
29h
10.8
46.4
Page 28 of 81
ISL8274M
4. Functional Description
Table 7. SMBus Address and UVLO Resistor Setting (Continued)
4.10
PMBus Address
UVLO (V)
R (kΩ)
2Ah
4.5
51.1
2Bh
10.8
56.2
2Ch
4.5
61.9
2Dh
10.8
68.1
2Eh
4.5
75
2Fh
10.8
82.5
30h
4.5
90.9
31h
10.8
100
32h
4.5
110
33h
10.8
121
Output Overvoltage Protection
The ISL8274M offers an internal output overvoltage protection circuit that can be used to protect sensitive load
circuitry from being subjected to a voltage higher than its prescribed limits. A hardware comparator compares the
actual output voltage (seen at pins VSEN1/2P, VSEN1/2N) to a threshold set to 15% higher than the target output
voltage (default setting). The fault threshold can be programmed to a desired level by the PMBus command
VOUT_OV_FAULT_LIMIT. If the VSEN1/2P, VSEN1/2N voltage exceeds this threshold, the module will initiate
an immediate shutdown without retry. Continuous retry can be enabled using the PMBus command
VOUT_OV_FAULT_RESPONSE. The retry delay time can be configured from 35ms to 280ms.
Internal to the module, two 100Ω resistors are populated from VOUT to VSEN1/2P and SGND to VSEN1/2N to
protect the module from overvoltage conditions in case of open at the voltage sensing pins and differential remote
sense traces due to assembly error. As long as differential remote sense traces have low resistance, VOUT regulation
accuracy is not compromised.
4.11
Output Prebias Protection
An output prebias condition exists when an externally applied voltage is present on a power supply’s output before
the power supply’s control IC is enabled. Certain applications require that the converter not be allowed to sink
current during start-up if a prebias condition exists at the output. The ISL8274M provides prebias protection by
sampling the output voltage before initiating an output ramp.
If a prebias voltage lower than the target voltage exists after the preconfigured delay period has expired, the target
voltage is set to match the existing prebias voltage and both drivers are enabled. The output voltage is then ramped
to the final regulation value at the preconfigured ramp rate.
The actual time the output takes to ramp from the prebias voltage to the target voltage varies, depending on the
prebias voltage. However, the total time elapsed from when the delay period expires to when the output reaches its
target value will match the preconfigured ramp time (see Figure 31 on page 30).
FN8931 Rev.1.00
Jan 4, 2018
Page 29 of 81
ISL8274M
4. Functional Description
VOUT
DESIRED OUTPUT
VOLTAGE
PREBIAS
VOLTAGE
TIME
TONDELAY
TONRISE
VPREBIAS < VTARGET
VOUT
PREBIAS
VOLTAGE
DESIRED OUTPUT
VOLTAGE
TIME
TONDELAY
TONRISE
VPREBIAS > VTARGET
Figure 31. Output Responses to Prebias Voltages
If a prebias voltage is higher than the target voltage after the preconfigured delay period has expired, the target
voltage is set to match the existing prebias voltage. Thus, both drivers are enabled with a PWM duty cycle that
would ideally create the prebias voltage.
Once the preconfigured soft-start ramp period has expired, the PG pin is asserted (assuming the prebias voltage is
not higher than the overvoltage limit). The PWM then adjusts its duty cycle to match the original target voltage and
the output ramps down to the preconfigured output voltage.
If a prebias voltage is higher than the overvoltage limit, the device does not initiate a turn-on sequence and declares
an overvoltage fault condition. The device then responds based on the output overvoltage fault response setting
programmed by the PMBus command VOUT_OV_FAULT_RESPONSE.
4.12
Thermal Overload Protection
The ISL8274M includes a thermal sensor that continuously measures the internal temperature of the module and
shuts down the controller when the temperature exceeds the preset limit. The factory default temperature limit is set
to +115°C, and can be changed using the PMBus command OT_FAULT_LIMIT. Note that the temperature reading
from the PMBus command is the temperature of the internal controller, which is lower than the junction
temperature of the module.
The default response from an over-temperature fault is an immediate shutdown without retry. Retry settings can be
programmed using the PMBus command OT_FAULT_RESPONSE. Hysteresis is implemented with the
over-temperature fault retry. If a retry is enabled, the module will shut down immediately upon an over-temperature
fault event and then continuously check the temperature after a retry delay time, which can be configured from
35ms to 280ms. If the temperature falls below the over-temperature warning level, the module will restart. The
over-temperature warning is +105°C by default and programmable using the PMBus command
OT_WARN_LIMIT.
FN8931 Rev.1.00
Jan 4, 2018
Page 30 of 81
ISL8274M
4.13
4. Functional Description
Digital-DC Bus
The Digital-DC Communications (DDC) bus is used to communicate between the Renesas digital power modules
and digital controllers. The DDC bus provides the communication channel between devices for features such as
current sharing, sequencing and fault spreading. The DDC pin on all Digital-DC devices in an application should
be connected together. A pull-up resistor is required on the DDC bus in order to guarantee the rise time as shown in
(EQ. 1):
(EQ. 1)
Rise Time = R PU C LOAD 1s
where RPU is the DDC bus pull-up resistance and CLOAD is the bus loading. The pull-up resistor may be tied to an
external 3.3V or 5V supply as long as this voltage is present before or during the device power-up. In principle,
each device connected to the DDC bus represents approximately 10pF of capacitive loading, and each inch of FR4
PCB trace introduces approximately 2pF. The ideal design uses a central pull-up resistor that is well-matched to the
total load capacitance.
4.14
Phase Spreading
When multiple point-of-load converters share a common DC input supply, it is desirable to adjust the clock phase
offset of each device, such that not all devices start to switch simultaneously. Setting each converter to start its
switching cycle at a different point in time can dramatically reduce input capacitance requirements and efficiency
losses. Because the peak current drawn from the input supply is effectively spread out over a period of time, the
peak current drawn at any given moment is reduced, and the power losses proportional to the IRMS2 are reduced
dramatically.
To enable phase spreading, all converters must be synchronized to the same switching clock. The phase offset of
each device may also be set to any value between 0° and 360° in 22.5° increments with the PMBus command
INTERLEAVE. The internal two phases of the module always maintain a phase difference of 180°.
4.15
Fault Spreading
Digital-DC modules and devices can be configured to broadcast a fault event over the DDC bus to the other devices
in the group using the PMBus command DDC_GROUP. When a nondestructive fault occurs, the device shuts down
and broadcasts the fault event over the DDC bus. The other devices on the DDC bus shut down simultaneously, if
configured to do so.
Note that fault retry is not supported in multiple modules with fault spreading enabled.
4.16
Output Sequencing
A group of Digital-DC modules or devices can be configured to power up in a predetermined sequence. This
feature is especially useful when powering advanced processors (FPGAs and ASICs) that require one supply to
reach its operating voltage before another supply reaching it in order to avoid latch-up. Multidevice sequencing can
be achieved by configuring each device with the PMBus command SEQUENCE. Multiple device sequencing is
configured by issuing PMBus commands to assign the preceding device in the sequencing chain as well as the
device that follows the sequence.
The Enable pins of all devices in a sequencing group must be tied together and driven high to initiate a sequenced
turn-on of the group. The enable must be driven low to initiate a sequenced turnoff of the group. It is recommended
to enable fault spreading with the PMBus command DDC_GROUP within a sequencing group.
FN8931 Rev.1.00
Jan 4, 2018
Page 31 of 81
ISL8274M
4.17
4. Functional Description
Monitoring Using SMBus
The ISL8274M can monitor a wide variety of different system parameters using the PMBus commands:
• READ_VIN
• READ_VOUT
• READ_IOUT
• READ_INTERNAL_TEMP
• READ_DUTY_CYCLE
• READ_FREQEUNCY
• READ_VMON
4.18
Snapshot Parameter Capture
The ISL8274M offers a special feature to capture parametric data and fault status following a fault. A detailed
description is provided in the “PMBus Commands Description” on page 42 under PMBus the commands
SNAPSHOT and SNAPSHOT_CONTROL.
4.19
Nonvolatile Memory
The ISL8274M stores user configurations in internal nonvolatile memory. Integrated security measures ensure that
the user can only restore the module to a level that has been made available to them. During the initialization
process, the ISL8274M checks for stored values contained in its internal nonvolatile memory.
Modules are shipped with factory defaults configuration and most settings can be overwritten by PMBus
commands and can be stored in nonvolatile memory by the PMBus command STORE_USER_ALL.
FN8931 Rev.1.00
Jan 4, 2018
Page 32 of 81
ISL8274M
5.
5. Layout Guide
Layout Guide
To achieve stable operation, low losses, and good thermal performance, some layout considerations are necessary
(Figure 32). Refer to the ISL8274MEVAL1Z layout design.
• Establish separate SGND plane and PGND planes, then connect SGND to PGND plane on a middle layer and
underneath PAD6 with a single point connection. For SGND and PGND pin connections, such as small pins H16,
J16, M5 and M17..., use multiple vias for each pin to connect to inner SGND or PGND layers.
• Place enough ceramic capacitors between VIN and PGND, VOUT and PGND and bypass capacitors between VDD,
VDRV and the ground plane, as close to the module as possible to minimize high frequency noise. It is very critical to
place the output ceramic capacitors close to the VOUT pads and in the direction of the load current path in order to
create a low impedance path for the high frequency inductor ripple current.
• Use large copper areas for power paths (VIN, PGND, VOUT) to minimize conduction loss and thermal stress. Also,
use multiple vias to connect the power planes in different layers. It is recommended to enlarge PAD11 and PAD9 to
place more vias on them. The ceramic capacitors CIN can be placed on the bottom layer under these two pads.
• Connect remote sensing traces to the regulation point to achieve a tight output voltage regulation and place the two
traces in parallel. Route a trace from VSEN1/2N and VSEN1/2P to the point of load where the tight output voltage is
desired. Avoid routing any sensitive signal traces, such as the VSENN, VSENP sensing lines near the SW pins.
• PAD14 and 16 (SW1 and SW2) are noisy pads, but they are beneficial for thermal dissipation. If the noise issue is
critical for the applications, it is recommended to use only the top layer for the SW pads. For better thermal
performance, use multiple vias on these pads to connect into the SW inner and bottom layers. However, use caution
when placing a limited area of SW planes in any layer. The SW planes should avoid the sensing signals and should be
surrounded by the PGND layer to avoid noise coupling.
• For pins SWD1 (L3) and SWD2 (P10), it is recommended to connect to the related SW1 and SW2 pads with short
loop traces. The trace width should be more than 20 mils.
VOUT1
COUT1
PGND
COUT2
SGND
PGND
VOUT2
PGND
VSEN1N VSEN1P
Kelvin Connections for
Both Ch1 and Ch2
VIN
VIN
CIN
CIN
PGND
Figure 32. Recommended Layout
FN8931 Rev.1.00
Jan 4, 2018
Page 33 of 81
ISL8274M
5.1
5. Layout Guide
Thermal Considerations
Experimental power loss curves along with θJA from thermal modeling analysis can be used to evaluate the thermal
consideration for the module. The derating curves are derived from the maximum power allowed while
maintaining the temperature below the maximum junction temperature of +125°C. The derating curves are derived
based on tests of the ISL8274MEVAL1Z evaluation board, which is an 8-layer board 4.5x4inch in size with 2oz Cu
on the top and bottom layers, 1oz Cu on the inner layers, and multiple via interconnects. In the actual application,
other heat sources and design margins should be considered.
5.2
Package Description
The structure of the ISL8274M belongs to the High Density Array (HDA) no-lead package. This kind of package
has advantages, such as good thermal and electrical conductivity, low weight, and small size. The HDA package is
applicable for surface mounting technology and is being more readily used in the industry. The ISL8274M contains
several types of devices, including resistors, capacitors, inductors, and control ICs. The ISL8274M is a copper
leadframe based package with exposed copper thermal pads, which have good electrical and thermal conductivity.
The copper leadframe and multicomponent assembly is overmolded with a polymer mold compound to protect
these devices.
The package outline and typical PCB layout pattern design and typical stencil pattern design are shown on pages 73
through page 79. The module has a small size of 18mmx 23mmx7.5mm.
5.3
PCB Layout Pattern Design
The bottom of ISL8274M is a leadframe footprint, which is attached to the PCB by the surface mounting process.
The PCB layout pattern is shown on pages 77 through 79. The PCB layout pattern is an array of solder mask
defined PCB lands which align with the perimeters of the HDA exposed pads and I/O termination dimensions. The
thermal lands on the PCB layout also feature an array of solder mask defined lands and should match 1:1 with the
package exposed die pads.
5.4
Thermal Vias
A grid of 1.0mm to 1.2mm pitch thermal vias, which drops down and connects to buried copper plane(s), should be
placed under the thermal land. The vias should be about 0.3mm to 0.33mm in diameter with the barrel plated to
about 1.0 oz. of copper. Although adding more vias (by decreasing via pitch) will improve the thermal
performance, diminishing returns will be seen as the number of vias is increased. Simply use as many vias as
practical for the thermal land size and your board design rules will allow. All vias should be capped and filled to
avoid scavenging solder from the I/O solder joints and creating voids.
5.5
Stencil Pattern Design
Reflowed solder joints on the perimeter I/O lands should have about a 50µm to 75µm (2 mil to 3 mil) standoff
height. The solder paste stencil design is the first step in developing optimized, reliable solder joins. Stencil
aperture size to solder mask defined PCB land size ratio should typically be 1:1. The aperture width may be
reduced slightly to help prevent solder bridging between adjacent I/O lands. To reduce solder paste volume on the
larger thermal lands, it is recommended that an array of smaller apertures be used instead of one large aperture. It is
recommended that the stencil printing area cover 50% to 80% of the PCB layout pattern. A typical solder stencil
pattern is shown on pages 71 through 77. The gap width between pads is 0.6mm. The user should consider the
symmetry of the whole stencil pattern when designing its pads. A laser cut, stainless steel stencil with
electropolished trapezoidal walls is recommended. Electropolishing “smooths” the aperture walls resulting in
reduced surface friction and better paste release, which reduces voids. Using a Trapezoidal Section Aperture (TSA)
also promotes paste release and forms a “brick like” paste deposit that assists in firm component placement. A
0.1mm to 0.15mm stencil thickness is recommended for this large pitch (1.3mm) HDA.
FN8931 Rev.1.00
Jan 4, 2018
Page 34 of 81
ISL8274M
5.6
5. Layout Guide
Reflow Parameters
Due to the low mount height of the HDA, “No-Clean” Type 3 solder paste per ANSI/J-STD-005 is recommended.
A nitrogen purge is also recommended during reflow. A system board reflow profile depends on the thermal mass
of the entire populated board, so it is not practical to define a specific soldering profile just for the HDA. The
profile given in Figure 33 is provided as a guideline, which can be customized for varying manufacturing practices
and applications.
300
Peak Temperature ~+245°C;
Typically 60s-150s Above +217°C
Keep Less than 30s within 5°C of Peak Temp.
Temperature (°C)
250
200
Slow Ramp (3°C/s Max)
and Soak From +150°C
to +200°C for 60s~180s
150
100
Ramp Rate 1.5°C from +70°C to +90°C
50
0
0
100
150
200
250
300
350
Duration (s)
Figure 33. Typical Reflow Profile
FN8931 Rev.1.00
Jan 4, 2018
Page 35 of 81
ISL8274M
6.
6. PMBus Command Summary
PMBus Command Summary
Command
Code
Command
Name
Description
Type
Data
Format
Default
Value
00h
Default
Setting
Page
00h
PAGE
Selects Controller 0,
1, or both.
R/W
Byte
BIT
Channel 1
page 42
01h
OPERATION
Sets Enable, Disable,
and VOUT Margin
modes.
R/W
Byte
BIT
02h
ON_OFF_CONFIG
Configures the EN
pin and PMBus
commands to turn
the unit ON/OFF.
R/W
Byte
BIT
03h
CLEAR_FAULTS
Clears fault
indications.
SEND
Byte
page 43
15h
STORE_USER_ALL
Stores all PMBus
values written since
last restore at user
level.
SEND
Byte
page 43
16h
RESTORE_USER_ALL
Restores PMBus
settings that were
stored using
STORE_USER_ALL.
SEND
Byte
page 43
20h
VOUT_MODE
Preset to defined
data format of VOUT
commands.
READ
Byte
BIT
21h
VOUT_COMMAND
Sets the nominal
value of the output
voltage.
R/W
Word
L16u
23h
VOUT_CAL_OFFSET
Applies a fixed offset
voltage to the
VOUT_COMMAND.
R/W
Word
L16s
24h
VOUT_MAX
Sets the maximum
possible value of
VOUT. 110% of
pin-strap VOUT.
R/W
Word
25h
VOUT_MARGIN_HIGH
Sets the value of the
VOUT during a margin
high.
26h
VOUT_MARGIN_LOW
27h
page 42
17h
page 42
Linear Mode,
Exponent = -13
page 43
Pin-strap
page 44
0V
page 44
L16u
1.1*VOUT
Pin-strap
page 44
R/W
Word
L16u
1.05*VOUT
Pin-strap
page 44
Sets the value of the
VOUT during a margin
low.
R/W
Word
L16u
0.95*VOUT
Pin-strap
page 45
VOUT_TRANSITION_RATE
Sets the transition
rate during margin or
other change of
VOUT.
R/W
Word
L11
BA00h
1V/ms
page 45
28h
VOUT_DROOP
Sets the loadline (V/I
Slope) resistance for
the rail.
R/W
Word
L11
0000h
0mV/A
page 45
33h
FREQUENCY_SWITCH
Sets the switching
frequency.
R/W
Word
L11
Pin-strap
page 45
37h
INTERLEAVE
Configures a phase
offset between
devices sharing a
SYNC clock.
R/W
Word
BIT
0021h(Ch1) 180° phase shift
/0022(Ch2) between Ch1/Ch2
page 46
38h
IOUT_CAL_GAIN
Sense resistance for
inductor DCR current
sensing.
R/W
Word
L11
B2C3(Ch1)/ 0.69mΩ (Ch1)/
B2D7(Ch2) 0.7mΩ (Ch2)
page 46
39h
IOUT_CAL_OFFSET
Sets the
current-sense offset.
R/W
Word
L11
B529(Ch1)/ -0.71A(Ch1)/
BDDC(Ch2) -1.07A(Ch2)
page 46
FN8931 Rev.1.00
Jan 4, 2018
13h
Hardware Pin
Enable, immediate
off
0000h
Page 36 of 81
ISL8274M
6. PMBus Command Summary
Command
Code
Command
Name
Description
Type
Data
Format
40h
VOUT_OV_FAULT_LIMIT
Sets the VOUT
overvoltage fault
threshold.
R/W
Word
L16u
41h
VOUT_OV_FAULT_RESPONSE
Configures the VOUT
overvoltage fault
response.
R/W
Byte
BIT
42h
VOUT_OV_WARN_LIMIT
Sets the VOUT
overvoltage warn
threshold.
R/W
Word
43h
VOUT_UV_WARN_LIMIT
Sets the VOUT
undervoltage warn
threshold.
44h
VOUT_UV_FAULT_LIMIT
45h
Default
Value
Default
Setting
Page
1.15*VOUT
Pin-strap
page 46
Disable and
No Retry
page 47
L16u
1.10*VOUT
Pin-strap
page 47
R/W
Word
L16u
0.9*VOUT
Pin-strap
page 47
Sets the VOUT
undervoltage fault
threshold.
R/W
Word
L16u
0.85*VOUT
Pin-strap
page 48
VOUT_UV_FAULT_RESPONSE
Configures the VOUT
undervoltage fault
response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 48
46h
IOUT_OC_FAULT_LIMIT
Sets the IOUT peak
overcurrent fault
threshold.
R/W
Word
L11
E320h
50A
page 48
4Ah
IOUT_OC_WARN_LIMIT
Sets the IOUT
average overcurrent
warning threshold.
R/W
Word
L11
4Bh
IOUT_UC_FAULT_LIMIT
Sets the IOUT valley
undercurrent
fault threshold.
R/W
Word
L11
E4E0h
-50A
page 49
4Fh
OT_FAULT_LIMIT
Sets the
over-temperature
fault threshold.
R/W
Word
L11
EB98h
+115°C
page 49
50h
OT_FAULT_RESPONSE
Configures the
over-temperature
fault response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 50
51h
OT_WARN_LIMIT
Sets the
over-temperature
warning limit.
R/W
Word
L11
EB48h
+105°C
page 50
52h
UT_WARN_LIMIT
Sets the
under-temperature
warning limit.
R/W
WORD
L11
DC40h
-30°C
page 50
53h
UT_FAULT_LIMIT
Sets the
under-temperature
fault threshold.
R/W
Word
L11
E530h
-45°C
page 51
54h
UT_FAULT_RESPONSE
Configures the
under-temperature
fault response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 51
55h
VIN_OV_FAULT_LIMIT
Sets the VIN
overvoltage fault
threshold.
R/W
Word
L11
D3A0
14.5V
page 51
56h
VIN_OV_FAULT_RESPONSE
Configures the VIN
overvoltage fault
response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 52
57h
VIN_OV_WARN_LIMIT
Sets the input
overvoltage warning
limit.
R/W
Word
L11
D353h
13.3V
page 52
58h
VIN_UV_WARN_LIMIT
Sets the input
undervoltage warning
limit.
R/W
Word
L11
1.03*VIN
UV Fault Limit
page 52
FN8931 Rev.1.00
Jan 4, 2018
80h
0.9*IOUT_AVG_OC page 49
_FAULT_LIMIT
Page 37 of 81
ISL8274M
6. PMBus Command Summary
Command
Code
Command
Name
Description
Type
Data
Format
59h
VIN_UV_FAULT_LIMIT
Sets the VIN
undervoltage fault
threshold.
R/W
Word
L11
5Ah
VIN_UV_FAULT_RESPONSE
Configures the VIN
undervoltage fault
response.
R/W
Byte
BIT
5Eh
POWER_GOOD_ON
Sets the voltage
threshold for
power-good
indication.
R/W
Word
60h
TON_DELAY
Sets the delay time
from ENABLE to start
of VOUT rise.
61h
TON_RISE
64h
Default
Value
Default
Setting
Page
Pin-strap
page 53
Disable and
No Retry
page 53
L16u
0.9*VOUT
Pin-strap
page 53
R/W
Word
L11
Pin-strap
page 54
Sets the rise time of
VOUT after ENABLE
and TON_DELAY.
R/W
Word
L11
Pin-strap
page 54
TOFF_DELAY
Sets the delay time
from DISABLE to
start of VOUT fall.
R/W
Word
L11
Pin-strap
page 54
65h
TOFF_FALL
Sets the fall time for
VOUT after DISABLE
and TOFF_DELAY.
R/W
Word
L11
Pin-strap
page 54
78h
STATUS_BYTE
Returns an
abbreviated status for
fast reads.
Read
Byte
BIT
00h
No Faults
page 55
79h
STATUS_WORD
Returns information
with a summary of
the units's fault
condition.
Read
Word
BIT
0000h
No Faults
page 56
7Ah
STATUS_VOUT
Returns the VOUT
specific status.
Read
Byte
BIT
00h
No Faults
page 56
7Bh
STATUS_IOUT
Returns the IOUT
specific status.
Read
Byte
BIT
00h
No Faults
page 57
7Ch
STATUS_INPUT
Returns specific
status specific to the
input.
Read
Byte
BIT
00h
No Faults
page 57
7Dh
STATUS_TEMP
Returns the
temperature specific
status.
Read
Byte
BIT
00h
No Faults
page 57
7Eh
STATUS_CML
Returns the
communication, logic
and memory specific
status.
Read
Byte
BIT
00h
No Faults
page 58
80h
STATUS_MFR_SPECIFIC
Returns the VMON
and external sync
clock specific status.
Read
Byte
BIT
00h
No Faults
page 58
88h
READ_VIN
Returns the input
voltage reading.
Read
Word
L11
page 58
8Bh
READ_VOUT
Returns the output
voltage reading.
Read
Word
L16u
page 59
8Ch
READ_IOUT
Returns the output
current reading.
Read
Word
L11
page 59
8Dh
READ_INTERNAL_TEMP
Returns the
temperature reading
internal to the device.
Read
Word
L11
page 59
94h
READ_DUTY_CYCLE
Returns the duty
cycle reading during
the ENABLE state.
Read
Word
L11
page 59
FN8931 Rev.1.00
Jan 4, 2018
80h
Page 38 of 81
ISL8274M
6. PMBus Command Summary
Command
Code
Command
Name
Description
Type
Data
Format
Default
Value
Default
Setting
Page
95h
READ_FREQUENCY
Returns the
measured operating
switch frequency.
Read
Word
L11
99h
MFR_ID
Sets a user defined
identification.
R/W
Block
ASC
Null
page 60
9Ah
MFR_MODEL
Sets a user defined
model.
R/W
Block
ASC
Null
page 60
9Bh
MFR_REVISION
Sets a user defined
revision.
R/W
Block
ASC
Null
page 60
9Ch
MFR_LOCATION
Sets a user defined
location identifier.
R/W
Block
ASC
Null
page 60
9Dh
MFR_DATE
Sets a user defined
date.
R/W
Block
ASC
Null
page 61
9Eh
MFR_SERIAL
Sets a user defined
serialized identifier.
R/W
Block
ASC
Null
page 61
A8h
LEGACY_FAULT_GROUP
Sets rail IDs of legacy
devices for fault
spreading
R/W
Block
BIT
B0h
USER_DATA_00
Sets a user defined
data.
R/W
Block
ASC
D0h
ISENSE_CONFIG
Configures ISENSE
related features.
R/W
Byte
BIT
D1h
USER_CONFIG
Configures several
user-level features.
R/W
Byte
BIT
D3h
DDC_CONFIG
Configures the DDC
bus.
R/W
Word
BIT
D4h
POWER_GOOD_DELAY
Sets the delay
between VOUT > PG
threshold and
asserting the PG pin.
R/W
Word
L11
DFh
ASCR_CONFIG
Configures ASCR
control loop.
R/W
Block
CUS
E0h
SEQUENCE
Identifies the Rail
DDC ID to perform
multi-rail sequencing.
R/W
Word
BIT
E1h
TRACK_CONFIG
Configures voltage
tracking modes
R/W
Byte
BIT
Pin-strap setting
page 66
E2h
DDC_GROUP
Sets rail DDC IDs to
obey faults and
margining spreading
information.
R/W
Block
BIT
Ignore Broadcast
VOUT_COMMAND,
OPERATION
page 66
E4h
DEVICE_ID
Returns the 16-byte
(character) device
identifier string.
Read
Block
ASC
Reads Device
Version
page 67
E5h
MFR_IOUT_OC_FAULT_
RESPONSE
Configures the IOUT
overcurrent fault
response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 67
E6h
MFR_IOUT_UC_FAULT_
RESPONSE
Configures the IOUT
undercurrent fault
response.
R/W
Byte
BIT
80h
Disable and
No Retry
page 67
E7h
IOUT_AVG_OC_FAULT_LIMIT
Sets the IOUT
average overcurrent
fault threshold.
R/W
L11
Set by SYNC/OCP
pin-strap
page 68
FN8931 Rev.1.00
Jan 4, 2018
page 59
00000000h No rail ID specified
page 61
Null
page 62
06h
256ns Blanking
Time, High Range
page 62
84h
Minimum duty
control, PG open
drain
page 63
Pin-strap (Rail ID
set based on
PMBus address.
Phase ID = 0;
Phases in Rail = 1
page 63
3ms
page 64
Pin-strap
page 64
C300h
0000h
Prequel and Sequel page 65
Disabled
Page 39 of 81
ISL8274M
6. PMBus Command Summary
Command
Code
Command
Name
Description
Type
Data
Format
Default
Value
Default
Setting
Page
E8h
IOUT_AVG_UC_FAULT_LIMIT
Sets the IOUT
average undercurrent
fault threshold.
R/W
L11
DC40h
E9h
SYNC_CONFIG
Configures the SYNC
pin.
R/W
Byte
BIT
00h
EAh
SNAPSHOT
Returns 32-byte
read-back of
parametric and status
values.
Read
Block
BIT
EBh
BLANK_PARAMS
Returns recently
changed parameter
values.
Read
Block
BIT
F3h
SNAPSHOT_CONTROL
Snapshot feature
control command.
R/W
Byte
BIT
F4h
RESTORE_FACTORY
Restores device to
the factory default
values.
Send
Byte
F5h
MFR_VMON_OV_FAULT_LIMIT
Returns the VMON
overvoltage
threshold.
Read
Word
L11
CB00h
6V
page 70
F6h
MFR_VMON_UV_FAULT_LIMIT
Returns the VMON
undervoltage
threshold.
Read
Word
L11
CA00h
4V
page 71
F7h
MFR_READ_VMON
Returns the VMON
voltage reading.
Read
Word
L11
F8h
VMON_OV_FAULT_RESPONSE
Returns the VMON
overvoltage
response.
Read
Byte
BIT
80h
Disable and
No Retry
page 71
F9h
VMON_UV_FAULT_RESPONSE
Returns the VMON
undervoltage
response.
Read
Byte
BIT
80h
Disable and No
Retry
page 71
FN8931 Rev.1.00
Jan 4, 2018
-30A
page 68
Pin-strap (set
based on
SYNC/OCP)
page 69
page 69
FF...FFh
page 70
page 70
page 70
page 71
Page 40 of 81
ISL8274M
6.1
6. PMBus Command Summary
PMBus Data Formats
Linear-11 (L11)
L11 data format uses 5-bit two’s complement exponent (N) and 11-bit two’s complement mantissa (Y) to represent
real world decimal value (X).
Data Byte High
Data Byte Low
7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0
Exponent (N)
Mantissa (Y)
Relation between real world decimal value (X), N, and Y is: X = Y·2N
Linear-16 Unsigned (L16u)
L16u data format uses a fixed exponent (hard-coded to N = -13h) and a 16-bit unsigned integer mantissa (Y) to
represent real world decimal value (X). Relation between real world decimal value (X), N and Y is: X = Y·2-13
Linear-16 Signed (L16s)
L16s data format uses a fixed exponent (hard-coded to N = -13h) and a 16-bit two’s complement mantissa (Y) to
represent real world decimal value (X).
Relation between real world decimal value (X), N and Y is: X = Y·2-13
Bit Field (BIT)
An explanation of the Bit Field for each command is provided in “PMBus Commands Description” on page 41.
Custom (CUS)
An explanation of the Custom data format for each command is provided in “PMBus Commands Description” on
page 41. A combination of Bit Field and integer is a common type of Custom data format.
ASCII (ASC)
A variable length string of text characters uses ASCII data format.
6.2
PMBus Use Guidelines
The PMBus is a powerful tool that allows the user to optimize circuit performance by configuring devices for their
application. When configuring a device in a circuit, the device should be disabled whenever most settings are
changed with PMBus commands. Some exceptions to this recommendation are OPERATION, ON_OFF_CONFIG,
CLEAR_FAULTS, VOUT_COMMAND, VOUT_MARGIN_HIGH, VOUT_MARGIN_LOW, and
ASCCR_CONFIG. While the device is enabled any command can be read. Many commands do not take effect until
after the device has been re-enabled, hence the recommendation that commands that change device settings are
written while the device is disabled.
When sending the STORE_USER_ALL and RESTORE_USER_ALL commands, it is recommended that no other
commands are sent to the device for 100ms after sending STORE or RESTORE commands.
In addition, there should be a 2ms delay between repeated READ commands sent to the same device. When
sending any other command, a 5ms delay is recommended between repeated commands sent to the same device.
6.3
Summary
All commands can be read at any time.
Always disable the device when writing commands that change device settings. Exceptions to this rule are
commands intended to be written while the device is enabled, for example, VOUT_MARGIN_HIGH.
To be sure a change to a device setting has taken effect, write the STORE_USER_ALL command, then cycle input
power and re-enable.
FN8931 Rev.1.00
Jan 4, 2018
Page 41 of 81
ISL8274M
7.
7. PMBus Commands Description
PMBus Commands Description
PAGE(00h)
Definition: Select Channel 1, Channel 2 or both channels to receive commands. All commands following this
command will be received and acted on by the selected channel or channels.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 00h (Page 0)
Units: N/A
Bits 7:4
Bits 3:0
Page
0000
0000
0
0000
0001
1
1111
1111
Both
OPERATION (01h)
Definition: Sets Enable, Disable and VOUT Margin settings.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value:
Units: N/A
Settings
Actions
00h
Immediate off (no sequencing)
40h
Soft off (with sequencing)
80h
On - Nominal
90h
On - Margin low
A0h
On - Margin high
ON_OFF_CONFIG (02h)
Definition: Configures the interpretation and coordination of the OPERATION command and the ENABLE pin (EN).
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 17h (Device starts from ENABLE pin with soft-off)
Units: N/A
Settings
FN8931 Rev.1.00
Jan 4, 2018
Actions
16h
Device starts from ENABLE pin with soft off.
17h
Device starts from ENABLE pin with immediate off.
1Ah
Device starts from OPERATION command with soft off.
1Bh
Device starts from OPERATION command with immediate off.
Page 42 of 81
ISL8274M
7. PMBus Commands Description
CLEAR_FAULTS (03h)
Definition: Clears all fault bits in all registers and releases the SALRT pin (if asserted) simultaneously. If a fault
condition still exists, the bit will reassert immediately. This command will not restart a device if it has shut down, it
will only clear the faults.
Data Length in Bytes: 0 Byte
Data Format: N/A
Type: Send byte
Default Value: N/A
Units: N/A
Reference: N/A
STORE_USER_ALL (15h)
Definition: Stores all PMBus settings from the operating memory to the nonvolatile USER store memory. To clear the
USER store, perform a RESTORE_FACTORY then STORE_USER_ALL. To add to the USER store, perform a
RESTORE_USER_ALL, write commands to be added, then STORE_USER_ALL. This command can be used during
device operation, but the device will be unresponsive for 20ms while storing values.
Data Length in Bytes: 0
Data Format: N/A
Type: Send byte
Default Value: N/A
Units: N/A
RESTORE_USER_ALL (16h)
Definition: Restores all PMBus settings from the USER store memory to the operating memory. Command performed
at power-up. Security level is changed to Level 1 following this command. This command can be used during device
operation, but the device will be unresponsive for 20ms while storing values.
Data Length in Bytes: 0
Data Format: N/A
Type: Send byte
Default Value: N/A
Units: N/A
VOUT_MODE (20h)
Definition: Reports the VOUT mode and provides the exponent used in calculating several VOUT settings. Fixed with
linear mode with default exponent (N) = -13
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 13h (Linear Mode, N = -13)
Units: N/A
FN8931 Rev.1.00
Jan 4, 2018
Page 43 of 81
ISL8274M
7. PMBus Commands Description
VOUT_COMMAND (21h)
Definition: Sets or reports the target output voltage. This command cannot set a value higher than VOUT_MAX.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: Pin-strap setting
Units: Volts
Range: 0V to VOUT_MAX
VOUT_CAL_OFFSET (23h)
Definition: Applies a fixed offset voltage to the output voltage command value. This command is typically used by the
user to calibrate a device in the application circuit.
Data Length in Bytes: 2
Data Format: L16s
Type: R/W
Default Value: 0000h
Units: Volts
VOUT_MAX (24h)
Definition: Sets an upper limit on the output voltage the unit can command regardless of any other commands or
combinations. The intent of this command is to provide a safeguard against a user accidentally setting the output
voltage to a possibly destructive level rather than to be the primary output overprotection. Default value can be
changed using PMBus.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 1.10xVOUT_COMMAND pin-strap setting
Units: Volts
Range: 0V to 5.5V
VOUT_MARGIN_HIGH (25h)
Definition: Sets the value of the VOUT during a margin high. This VOUT_MARGIN_HIGH command loads the unit
with the voltage to which the output is to be changed when the OPERATION command is set to “Margin High”.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 1.05 x VOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
FN8931 Rev.1.00
Jan 4, 2018
Page 44 of 81
ISL8274M
7. PMBus Commands Description
VOUT_MARGIN_LOW (26h)
Definition: Sets the value of the VOUT during a margin low. This VOUT_MARGIN_LOW command loads the unit
with the voltage to which the output is to be changed when the OPERATION command is set to “Margin Low”.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 0.95 x VOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
VOUT_TRANSITION_RATE (27h)
Definition: Sets the rate at which the output should change voltage when the device receives the VOUT_COMMAND
or an OPERATION command (Margin High, Margin Low) that causes the output voltage to change. The maximum
possible positive value of the two data bytes indicates that the device should make the transition as quickly as possible.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: BA00h (1V/ms)
Units: V/ms
Range: 0.1V/ms to 4V/ms
VOUT_DROOP (28h)
Definition: Sets the effective load line (V/I slope) for the rail in which the device is used. It is the rate, in mV/A, at
which the output voltage decreases (or increases) with increasing (or decreasing) output current for use with adaptive
voltage positioning schemes or multi-module current sharing. In current sharing configuration, VOUT_DROOP set in
each module stands for the droop seen by the load.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: mV/A
Range: 0mV/A to 40mV/A
FREQUENCY_SWITCH (33h)
Definition: Sets the switching frequency of the device. Initial default value is defined by a pin-strap and this value can
be overridden by writing this command through the PMBus. If an external SYNC is utilized, this value should be set as
close as possible to the external clock value. The output must be disabled when writing this command.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: kHz
Range: 296kHz to 1066kHz
FN8931 Rev.1.00
Jan 4, 2018
Page 45 of 81
ISL8274M
7. PMBus Commands Description
INTERLEAVE (37h)
Definition: Configures the phase offset of a device that is sharing a common SYNC clock with other devices. The
phase offset of each device can be set to any value between 0° and 360° in 22.5° increments. The internal two phases of
the module always maintain a phase difference of 180°.
Data Length in Bytes: 2
Data Format: BIT
Type: R/W
Default Value: 0021h (Page0), 0022h (Page1)
Units: N/A
Bits
Purpose
Value
15:4
Reserved
0
3:0
Position in Group
0 to 15
Description
Reserved
Sets position of the device's rail within the group.
IOUT_CAL_GAIN (38h)
Definition: Sets the effective impedance across the current sense circuit for use in calculating output current at +25°C.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Ch1: B2C3(0.69mΩ); Ch2: B2D7(0.7mΩ)
Units: mΩ
IOUT_CAL_OFFSET (39h)
Definition: Nulls out any offsets in the output current sensing circuit for each phase, and compensates for delayed
measurements of current ramp due to ISENSE blanking time.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Ch1: B529(-0.71A); Ch2: BDDC(-1.07A)
Units: A
VOUT_OV_FAULT_LIMIT (40h)
Definition: Sets the VOUT overvoltage fault threshold.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 1.15xVOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
FN8931 Rev.1.00
Jan 4, 2018
Page 46 of 81
ISL8274M
7. PMBus Commands Description
VOUT_OV_FAULT_RESPONSE (41h)
Definition: Configures the VOUT overvoltage fault response. Note that the device cannot be set to ignore this fault
mode.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1) * 35ms. Sets the time between retries in 35ms
VOUT_OV_WARN_LIMIT (42h)
Definition: Sets the VOUT overvoltage warning threshold. The power-good signal is pulled low when the output
voltage goes higher than this threshold.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 1.10xVOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
VOUT_UV_WARN_LIMIT (43h)
Definition: Sets the VOUT undervoltage warning threshold. The power-good signal is pulled low when the output
voltage goes lower than this threshold.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 0.90 x VOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
FN8931 Rev.1.00
Jan 4, 2018
Page 47 of 81
ISL8274M
7. PMBus Commands Description
VOUT_UV_FAULT_LIMIT (44h)
Definition: Sets the VOUT undervoltage fault threshold. This fault is masked during ramp or when disabled.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 0.85 x VOUT_COMMAND pin-strap setting
Units: V
Range: 0V to VOUT_MAX
VOUT_UV_FAULT_RESPONSE (45h)
Definition: Configures the VOUT undervoltage fault response.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable, no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1) * 35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
IOUT_OC_FAULT_LIMIT (46h)
Definition: Sets the IOUT peak overcurrent fault threshold. This limit is applied to current measurement samples taken
after the Current Sense Blanking Time has expired. A fault occurs after this limit is exceeded. The recommended peak
OCP limit is determined by (EQ. 2).
(EQ. 2)
IOUT_OC_FAULT_LIMIT = IOUT_AVG_OC_FAULT_LIMIT + 0.5 IRIPPLE P – P 130%
A hard bound of 50A is applied to the command value. This feature shares the OC fault bit operation (in
STATUS_IOUT) and OC fault response with the IOUT_AVG_OC_FAULT_LIMIT.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: E320h (50A)
Units: A
Range: -100A to 100A
FN8931 Rev.1.00
Jan 4, 2018
Page 48 of 81
ISL8274M
7. PMBus Commands Description
IOUT_OC_WARN_LIMIT (4Ah)
Definition: Sets the IOUT average overcurrent warning threshold.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: IOUT_AVG_OC_FAULT_LIMIT x 0.9
Units: A
Range: -100A to 100A
IOUT_UC_FAULT_LIMIT (4Bh)
Definition: Sets the IOUT valley undercurrent fault threshold. This limit is applied to current measurement samples
taken after the Current Sense Blanking Time has expired. A fault occurs after this limit is exceeded. The recommended
valley UCP limit is determined by (EQ. 3):
(EQ. 3)
IOUT_UC_FAULT_LIMIT = IOUT_AVG_UC_FAULT_LIMIT – 0.5 IRIPPLE P – P 130%
A hard bound of -50A is applied to the command value. This feature shares the UC fault bit operation (in
STATUS_IOUT) and UC fault response with IOUT_AVG_UC_FAULT_LIMIT.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: E4E0 (-50A)
Units: A
Range: -100A to 100A
OT_FAULT_LIMIT (4Fh)
Definition: Sets the temperature at which the device should indicate an over-temperature fault. Note that the
temperature must drop below OT_WARN_LIMIT to clear this fault.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: EB98 (+115°C)
Units: °C
Range: 0°C to +175°C
FN8931 Rev.1.00
Jan 4, 2018
Page 49 of 81
ISL8274M
7. PMBus Commands Description
OT_FAULT_RESPONSE (50h)
Definition: Instructs the device on what action to take in response to an over-temperature fault.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Fault Value: 80h (Disable and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1)*35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
OT_WARN_LIMIT (51h)
Definition: Sets the temperature at which the device should indicate an over-temperature warning alarm. In response
to the OT_WARN_LIMIT being exceeded, the device sets the TEMPERATURE bit in STATUS_WORD, sets the
OT_WARNING bit in STATUS_TEMPERATURE, and notifies the host.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: EB48h (+105°C)
Units: °C
Range: 0°C to +175°C
UT_WARN_LIMIT (52h)
Definition: Sets the temperature at which the device should indicate an under-temperature warning alarm. In response
to the UT_WARN_LIMIT being exceeded, the device sets the TEMPERATURE bit in STATUS_WORD, sets the
UT_WARNING bit in STATUS_TEMPERATURE, and notifies the host.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: DC40h (-30°C)
Units: °C
Range: -55°C to +25°C
FN8931 Rev.1.00
Jan 4, 2018
Page 50 of 81
ISL8274M
7. PMBus Commands Description
UT_FAULT_LIMIT (53h)
Definition: Sets the temperature, in degrees Celsius, of the unit where it should indicate an under-temperature fault.
Note that the temperature must rise above UT_WARN_LIMIT to clear this fault.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: E530h (-45°C)
Units: °C
Range: -55°C to +25°C
UT_FAULT_RESPONSE (54h)
Definition: Configures the under-temperature fault response as defined by the following table. The delay time is the
time between restart attempts.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable, no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1) * 35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
VIN_OV_FAULT_LIMIT (55h)
Definition: Sets the VIN overvoltage fault threshold.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: D3A0 (14.5V)
Units: V
Range: 0V to 16V
FN8931 Rev.1.00
Jan 4, 2018
Page 51 of 81
ISL8274M
7. PMBus Commands Description
VIN_OV_FAULT_RESPONSE (56h)
Definition: Configures the VIN overvoltage fault response as defined by the following table. The delay time is the time
between restart attempts.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1) * 35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
VIN_OV_WARN_LIMIT (57h)
Definition: Sets the VIN overvoltage warning threshold. In response to the OV_WARN_LIMIT being exceeded, the
device sets the NONE OF THE ABOVE and INPUT bits in STATUS_WORD, sets the VIN_OV_WARNING bit in
STATUS_INPUT, and notifies the host.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Protectable: Yes
Default Value: D353h (13.3V)
Units: V
Range: 0V to 16V
VIN_UV_WARN_LIMIT (58h)
Definition: Sets the VIN undervoltage warning threshold. If a VIN_UV_FAULT occurs, the input voltage must rise
above VIN_UV_WARN_LIMIT to clear the fault, which provides hysteresis to the fault threshold. In response to the
UV_WARN_LIMIT being exceeded, the device sets the NONE OF THE ABOVE and INPUT bits in
STATUS_WORD, sets the VIN_UV_WARNING bit in STATUS_INPUT, and notifies the host.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: 1.03 x VIN_UV_FAULT_LIMIT pin-strap setting
Units: V
Range: 0V to 12V
FN8931 Rev.1.00
Jan 4, 2018
Page 52 of 81
ISL8274M
7. PMBus Commands Description
VIN_UV_FAULT_LIMIT (59h)
Definition: Sets the VIN undervoltage fault threshold.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: V
Range: 0V to 12V
VIN_UV_FAULT_RESPONSE (5Ah)
Definition: Configures the VIN undervoltage fault response as defined by the following table. The delay time is the
time between restart attempts.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1)*35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
POWER_GOOD_ON (5Eh)
Definition: Sets the voltage threshold for power-good indication. Power-good asserts with a delay specified in
POWER_GOOD_DELAY after the output voltage exceeds POWER_GOOD_ON and deasserts when the output
voltage is less than VOUT_UV_WARN_LIMIT. It is recommended to set POWER_GOOD_ON higher than
VOUT_UV_FAULT_LIMIT.
Data Length in Bytes: 2
Data Format: L16u
Type: R/W
Default Value: 0.9xVOUT_COMMAND pin-strap setting
Units: V
FN8931 Rev.1.00
Jan 4, 2018
Page 53 of 81
ISL8274M
7. PMBus Commands Description
TON_DELAY (60h)
Definition: Sets the delay time from when the device is enabled to the start of VOUT rise.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: ms
Range: 2ms to 256ms
TON_RISE (61h)
Definition: Sets the rise time of VOUT after ENABLE and TON_DELAY. In multi-module current sharing
configuration where ASCR is disabled for start up, the rise time of VOUT can be approximately calculated by (EQ. 1).
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: ms
Range: 0ms to 100ms
TOFF_DELAY (64h)
Definition: Sets the delay time from DISABLE to start of VOUT fall.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: ms
Range: 0ms to 256ms
TOFF_FALL (65h)
Definition: Sets the soft-off fall time for VOUT after DISABLE and TOFF_DELAY.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: Pin-strap setting
Units: ms
Range: 0ms to 100ms
FN8931 Rev.1.00
Jan 4, 2018
Page 54 of 81
ISL8274M
7. PMBus Commands Description
STATUS_BYTE (78h)
Definition: Returns one byte of information with a summary of the most critical faults.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Status Bit Name
7
BUSY
A fault was declared because the device was busy and unable to
respond.
6
OFF
This bit is asserted if the unit is not providing power to the output,
regardless of the reason, including simply not being enabled.
5
VOUT_OV_FAULT
4
IOUT_OC_FAULT
An output overcurrent fault has occurred.
3
VIN_UV_FAULT
An input undervoltage fault has occurred.
2
TEMPERATURE
A temperature fault or warning has occurred.
1
CML
0
NONE OF THE ABOVE
FN8931 Rev.1.00
Jan 4, 2018
Meaning
An output overvoltage fault has occurred.
A communications, memory, or logic fault has occurred.
A fault or warning not listed in Bits 7:1 has occurred.
Page 55 of 81
ISL8274M
7. PMBus Commands Description
STATUS_WORD (79h)
Definition: Returns two bytes of information with a summary of the unit's fault condition. Based on the information in
these bytes, the host can get more information by reading the appropriate status registers. The low byte of the
STATUS_WORD is the same register as the STATUS_BYTE (78h) command.
Data Length in Bytes: 2
Data Format: BIT
Type: Read Only
Default Value: 0000h
Units: N/A
Bit Number
Status Bit Name
15
VOUT
Meaning
14
IOUT/POUT
13
INPUT
12
MFG_SPECIFIC
A manufacturer specific fault or warning has occurred.
11
POWER_GOOD#
The POWER_GOOD signal, if present, is negated.
An output voltage fault or warning has occurred.
An output current or output power fault or warning has occurred.
An input voltage, input current, or input power fault or warning has
occurred.
10
FANS
9
OTHER
A fan or airflow fault or warning has occurred.
8
UNKNOWN
7
BUSY
A fault was declared because the device was busy and unable to
respond.
6
OFF
This bit is asserted if the unit is not providing power to the output,
regardless of the reason, including simply not being enabled.
5
VOUT_OV_FAULT
4
IOUT_OC_FAULT
An output overcurrent fault has occurred.
3
VIN_UV_FAULT
An input undervoltage fault has occurred.
2
TEMPERATURE
A temperature fault or warning has occurred.
1
CML
0
NONE OF THE ABOVE
A bit in STATUS_OTHER is set.
A fault type not given in Bits 15:1 of the STATUS_WORD has been
detected.
An output overvoltage fault has occurred.
A communications, memory, or logic fault has occurred.
A fault or warning not listed in Bits 7:1 has occurred.
STATUS_VOUT (7Ah)
Definition: Returns one data byte with the status of the output voltage.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Status Bit Name
Meaning
7
VOUT_OV_FAULT
6
VOUT_OV_WARNING
Indicates an output overvoltage warning.
5
VOUT_UV_WARNING
Indicates an output undervoltage warning.
4
VOUT_UV_FAULT
3:0
N/A
FN8931 Rev.1.00
Jan 4, 2018
Indicates an output overvoltage fault.
Indicates an output undervoltage fault.
These bits are not used.
Page 56 of 81
ISL8274M
7. PMBus Commands Description
STATUS_IOUT (7Bh)
Definition: Returns one data byte with the status of the output current.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Status Bit Name
7
IOUT_OC_FAULT
Meaning
6
IOUT_OC_LV_FAULT
An output overcurrent and low voltage fault has occurred.
5
IOUT_OC_WARNING
An output overcurrent warning has occurred.
4
IOUT_UC_FAULT
3:0
N/A
An output overcurrent fault has occurred.
An output undercurrent fault has occurred.
These bits are not used.
STATUS_INPUT (7Ch)
Definition: Returns the input voltage and input current status information.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Status Bit Name
Meaning
7
VIN_OV_FAULT
An input overvoltage fault has occurred.
6
VIN_OV_WARNING
An input overvoltage warning has occurred.
5
VIN_UV_WARNING
An input undervoltage warning has occurred.
4
VIN_UV_FAULT
3:0
N/A
An input undervoltage fault has occurred.
These bits are not used.
STATUS_TEMP (7Dh)
Definition: Returns one byte of information with a summary of any temperature related faults or warnings.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Status Bit Name
7
OT_FAULT
6
OT_WARNING
An over-temperature warning has occurred.
5
UT_WARNING
An under-temperature warning has occurred.
4
UT_FAULT
3:0
N/A
FN8931 Rev.1.00
Jan 4, 2018
Meaning
An over-temperature fault has occurred.
An under-temperature fault has occurred.
These bits are not used.
Page 57 of 81
ISL8274M
7. PMBus Commands Description
STATUS_CML (7Eh)
Definition: Returns one byte of information with a summary of any communications, logic, and/or memory errors.
Data Length in Bytes: 1
Data Format: BIT
Type: Read Only
Default Value: 00h
Units: N/A
Bit Number
Meaning
7
Invalid or unsupported PMBus command was received.
6
The PMBus command was sent with invalid or unsupported data.
5
Packet error was detected in the PMBus command.
4:2
Not used
1
A PMBus command tried to write to a read-only or protected command, or a communication fault other than the
ones listed in this table has occurred.
0
Not used
STATUS_MFR_SPECIFIC (80h)
Definition: Returns one byte of information providing the status of the device's voltage monitoring and clock
synchronization faults. VMON OV/UV warnings are set at ±10% of the VMON_FAULT commands.
Data Length in Bytes: 1
Data Format: BIT
Type: Read only
Default value: 00h
Units: N/A
Bit Number
7:6
Field Name
Meaning
Reserved
5
VMON UV Warning
The voltage on the VMON pin has dropped 10% below the level set by
VMON_UV_FAULT_LIMIT.
4
VMON OV Warning
The voltage on the VMON pin has risen 10% above the level set by
VMON_OV_FAULT_LIMIT.
3
External Switching Period Fault
Loss of external clock synchronization has occurred.
2
Reserved
1
VMON UV Fault
The voltage on the VMON pin has dropped below the level set by
VMON_UV_FAULT_LIMIT.
0
VMON OV Fault
The voltage on the VMON pin has risen above the level set by
VMON_OV_FAULT_LIMIT.
READ_VIN (88h)
Definition: Returns the input voltage reading.
Data Length in Bytes: 2
Data Format: L11
Type: Read Only
Units: V
FN8931 Rev.1.00
Jan 4, 2018
Page 58 of 81
ISL8274M
7. PMBus Commands Description
READ_VOUT (8Bh)
Definition: Returns the output voltage reading.
Data Length in Bytes: 2
Data Format: L16u
Type: Read Only
Units: V
READ_IOUT (8Ch)
Definition: Returns the output current reading.
Data Length in Bytes: 2
Data Format: L11
Type: Read Only
Default Value: N/A
Units: A
READ_INTERNAL_TEMP (8Dh)
Definition: Returns the controller junction temperature reading from the internal temperature sensor.
Data Length in Bytes: 2
Data Format: L11
Type: Read Only
Units: °C
READ_DUTY_CYCLE (94h)
Definition: Reports the actual duty cycle of the converter during the enable state.
Data Length in Bytes: 2
Data Format: L11
Type: Read only
Units: %
READ_FREQUENCY (95h)
Definition: Reports the actual switching frequency of the converter during the enable state.
Data Length in Bytes: 2
Data Format: L11
Type: Read only
Units: kHz
FN8931 Rev.1.00
Jan 4, 2018
Page 59 of 81
ISL8274M
7. PMBus Commands Description
MFR_ID (99h)
Definition: Sets user defined identification. The sum total of characters in MFR_ID, MFR_MODEL,
MFR_REVISION, MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per
command cannot exceed 128 characters. This limitation includes multiple writes of this command before a STORE
command. To clear multiple writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
MFR_MODEL (9Ah)
Definition: Sets a user defined model. The sum total of characters in MFR_ID, MFR_MODEL, MFR_REVISION,
MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per command cannot exceed
128 characters. This limitation includes multiple writes of this command before a STORE command. To clear multiple
writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
MFR_REVISION (9Bh)
Definition: Sets a user defined revision. The sum total of characters in MFR_ID, MFR_MODEL, MFR_REVISION,
MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per command cannot exceed
128 characters. This limitation includes multiple writes of this command before a STORE command. To clear multiple
writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
MFR_LOCATION (9Ch)
Definition: Sets a user defined location identifier. The sum total of characters in MFR_ID, MFR_MODEL,
MFR_REVISION, MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per
command cannot exceed 128 characters. This limitation includes multiple writes of this command before a STORE
command. To clear multiple writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
FN8931 Rev.1.00
Jan 4, 2018
Page 60 of 81
ISL8274M
7. PMBus Commands Description
MFR_DATE (9Dh)
Definition: Sets a user defined date. The sum total of characters in MFR_ID, MFR_MODEL, MFR_REVISION,
MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per command cannot exceed
128 characters. This limitation includes multiple writes of this command before a STORE command. To clear multiple
writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
Reference: N/A
MFR_SERIAL (9Eh)
Definition: Sets a user defined serialized identifier. The sum total of characters in MFR_ID, MFR_MODEL,
MFR_REVISION, MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per
command cannot exceed 128 characters. This limitation includes multiple writes of this command before a STORE
command. To clear multiple writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
LEGACY_FAULT_GROUP (A8h)
Definition: Sets which rail DDC IDs should be listened to for fault spreading with legacy devices. The data sent is a
4-byte, 32-bit, bit vector where every bit represents a rail’s DDC ID. A bit set to 1 indicates a device DDC ID to which
the configured device will respond upon receiving a fault spreading event. In this vector, Bit 0 of byte 0 corresponds to
the rail with DDC ID 0. Following through, Bit 7 of byte 3 corresponds to the rail with DDC ID 31.
Data Length in Bytes: 4
Data Format: BIT
Type: Block R/W
Default Value: 00000000h (No rail ID specified)
FN8931 Rev.1.00
Jan 4, 2018
Page 61 of 81
ISL8274M
7. PMBus Commands Description
USER_DATA_00 (B0h)
Definition: Sets user defined data. The sum total of characters in MFR_ID, MFR_MODEL, MFR_REVISION,
MFR_LOCATION, MFR_DATE, MFR_SERIAL, and USER_DATA_00 plus one byte per command cannot exceed
128 characters. This limitation includes multiple writes of this command before a STORE command. To clear multiple
writes, perform a RESTORE, write this command then perform a STORE/RESTORE.
Data Length in Bytes: User defined
Data Format: ASC
Type: Block R/W
Default Value: Null
Units: N/A
ISENSE_CONFIG (D0h)
Definition: Configures current sense circuitry.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 06h (256ns current sense blanking time, current sense high range)
Units: N/A
Bit
Field Name
7:4
Reserved
3:2
Current Sense
Blanking Time
1:0
Current Sense
Range
FN8931 Rev.1.00
Jan 4, 2018
Value
Setting
Description
0000
00
192ns
01
256ns
10
412ns
Sets the blanking time current sense blanking time.
11
640ns
00
Low Range
±25mV
01
Mid Range
±35mV
10
High Range
±50mV
11
Not Used
Page 62 of 81
ISL8274M
7. PMBus Commands Description
USER_CONFIG (D1h)
Definition: Configures several user-level features. This command overrides the pin-strap settings.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 84h (Pin-strap setting for ASCR on Start up; ramp-up and ramp-down minimum duty cycle 0.39%;
minimum duty cycle control enabled; PG is an open-drain output.)
Units: N/A
Bit
7
Field Name
ASCR on for Start
up
Value
Setting
Description
0
Disabled
ASCR is disabled for start up. Use this for Current Sharing
mode.
1
Enabled
ASCR is enabled for start up. Use this for Stand Alone
mode.
6:5
Reserved
00
4:3
Ramp-up and
Ramp-down
Minimum Duty
Cycle
00
0.39%
01
0.78%
10
1.17%
11
1.56%
Minimum Duty
Cycle Control
0
Disable
1
Enable
Power-good Pin
Configuration
0
Open Drain
1
Push-Pull
Reserved
0
2
1
0
Reserved
Sets the minimum duty-cycle during start-up and shutdown
ramp.
Control for minimum duty cycle.
0 = PG is an open-drain output.
1 = PG is a push-pull output.
DDC_CONFIG (D3h)
Definition: Configures DDC addressing and current sharing. The DDC rail ID is set according to the SMBus address.
For current sharing applications, the DDC Phase ID is set according to the number of phases. The device position and
number of devices in the rail can be programmed as needed.
Data Length in Bytes: 2
Data Format: BIT
Type: R/W
Default Value: Pin-strap setting for Rail ID. Phase ID = 0; Phases in rail = 1
Units: N/A
Bit
Field Name
15:13
Phase ID
12:8
Rail ID
7:3
Reserved
2:0
Phases in Rail
FN8931 Rev.1.00
Jan 4, 2018
Value
Setting
0 to 7
Sets the phase ID in a current sharing rail.
0 to 31 (00 to 1Fh)
0
0 to 7
Description
Configures DDC rail ID
Reserved
Reserved
Identifies the number of phases on the same rail (+1).
Page 63 of 81
ISL8274M
7. PMBus Commands Description
POWER_GOOD_DELAY (D4h)
Definition: Sets the delay applied between the output exceeding the PG threshold (POWER_GOOD_ON) and
asserting the PG pin. The delay time can range from 0ms up to 500s, in steps of 125ns. A 1ms minimum configured
value is recommended to apply proper debounce to this signal.
Data Length in Bytes: 2
Data Format: L11
Type: R/W
Default Value: C300h, 3ms
Units: ms
Range: 0ms to 5s
ASCR_CONFIG (DFh)
Definition: Allows user configuration of ASCR settings. ASCR gain is analogous to bandwidth, ASCR residual is
analogous to damping. To improve load transient response performance, increase ASCR gain. To lower transient
response overshoot, increase ASCR residual. Increasing ASCR gain can result in increased PWM jitter and should be
evaluated in the application circuit. Excessive ASCR gain can lead to excessive output voltage ripple. Increasing
ASCR residual to improve transient response damping can result in slower recovery times, but will not affect the peak
output voltage deviation. Typical ASCR gain settings range from 50 to 1000, and ASCR residual settings range from
10 to 100.
Data Length in Bytes: 4
Data Format: CUS
Type: R/W
Default Value: Pin-strap setting
Bit
31:25
24
Purpose
Data Format
Unused
ASCR Enable
BIT
Value
Description
0000000h
Unused
1
Enable
0
Disable
23:16
ASCR Residual Setting
Integer
ASCR residual
15:0
ASCR Gain Setting
Integer
ASCR gain
FN8931 Rev.1.00
Jan 4, 2018
Page 64 of 81
ISL8274M
7. PMBus Commands Description
SEQUENCE (E0h)
Definition: Identifies the Rail DDC ID of the prequel and sequel rails when performing multi-rail sequencing. The
device will enable its output when its EN or OPERATION enable states, as defined by ON_OFF_CONFIG, is set and
the prequel device has issued a power-good event on the DDC bus. The device will disable its output (using the
programmed delay values) when the sequel device has issued a power-down event on the DDC bus.
The data field is a two-byte value. The most significant byte contains the 5-bit Rail DDC ID of the prequel device. The
Least Significant Byte (LSB) contains the 5-bit Rail DDC ID of the sequel device. The Most Significant Bit (MSB) of
each byte contains the enable of the prequel or sequel mode. This command overrides the corresponding sequence
configuration set by the CONFIG pin settings.
Data Length in Bytes: 2
Data Format: BIT
Type: R/W
Default Value: 0000h (Prequel and Sequel disabled)
Bit
Value
Setting
0
Disable
Disable, no prequel preceding this rail.
1
Enable
Enable, prequel to this rail is defined by Bits 12:8.
0
Reserved
0-31
DDC ID
Set to the DDC ID of the prequel rail.
Sequel Enable
0
Disable
Disable, no sequel following this rail.
1
Enable
Enable, sequel to this rail is defined by Bits 4:0.
6:5
Reserved
0
Reserved
4:0
Sequel Rail DDC ID
0-31
DDC ID
15
Field Name
Prequel Enable
14:13
Reserved
12:8
Prequel Rail DDC
ID
7
FN8931 Rev.1.00
Jan 4, 2018
Description
Reserved
Reserved
Set to the DDC ID of the sequel rail.
Page 65 of 81
ISL8274M
7. PMBus Commands Description
TRACK_CONFIG (E1h)
Definition: Configures the voltage tracking modes of the device. Only one channel can be configured to track:
Channel 1 or Channel 2.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: Pin-strap setting based on SS/TRACK
Bit
7
6:3
Field Name
Value
Setting
0
Disable
Tracking is disabled
1
Enable
Tracking is enabled
Voltage Tracking
Control
0000
Reserved
Tracking Ratio
Control
0
100%
Output tracks at 100% ratio of VTRK input
1
50%
Output tracks at 50% ratio of VTRK input
1
Tracking Upper
Limit
0
Target Voltage
Output voltage is limited by target voltage
1
VTRK Voltage
Output voltage is limited by VTRK voltage
0
Ramp-Up Behavior
0
Track after PG
The output is not allowed to track VTRK down before
power-good.
1
Track always
2
Reserved
Description
Reserved
The output is allowed to track VTRK down before
power-good.
DDC_GROUP (E2h)
Definition: Configures fault spreading group ID and enable, broadcast OPERATION group ID and enable, and
Broadcast VOUT_COMMAND group ID and enable.
Data Length in Bytes: 3
Data Format: BIT
Type: Block R/W
Default Value: Ignore Broadcast VOUT_COMMAND, OPERATION.
Bits
23:22
Purpose
Value
Description
Reserved
0
Reserved
BROADCAST_VOUT_COMMAND
Response
1
Responds to BROADCAST_VOUT_COMMAND with same Group ID.
0
Ignores BROADCAST_VOUT_COMMAND.
20:16
BROADCAST_VOUT_COMMAND
Group ID
0-31d
15:14
Reserved
0
Reserved
BROADCAST_OPERATION
Response
1
Responds to BROADCAST_OPERATION with same Group ID.
0
Ignores BROADCAST_OPERATION.
21
13
12:8
BROADCAST_OPERATION Group ID
7:6
Reserved
0
Reserved
POWER_FAIL Response
1
Responds to POWER_FAIL events with same Group ID by shutting
down immediately.
0
Responds to POWER_FAIL events with same Group ID with sequenced
shutdown.
5
4:0
POWER_FAIL group ID
FN8931 Rev.1.00
Jan 4, 2018
0-31d
Group ID sent as data for broadcast BROADCAST_VOUT_COMMAND
events.
0-31d
Group ID sent as data for broadcast BROADCAST_OPERATION events.
Group ID sent as data for broadcast POWER_FAIL events.
Page 66 of 81
ISL8274M
7. PMBus Commands Description
DEVICE_ID (E4h)
Definition: Returns the 16-byte (character) device identifier string.
Data Length in Bytes: 16
Data Format: ASC
Type: Block Read
Default Value: Part number/Die revision/Firmware revision
MFR_IOUT_OC_FAULT_RESPONSE (E5h)
Definition: Configures the IOUT overcurrent fault response as defined by the following table. The command format is
the same as the PMBus standard fault responses except that it sets the overcurrent status bit in STATUS_IOUT.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable, and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1)*35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
MFR_IOUT_UC_FAULT_RESPONSE (E6h)
Definition: Configures the IOUT undercurrent fault response as defined by the following table. The command format is
the same as the PMBus standard fault responses except that it sets the undercurrent status bit in STATUS_IOUT.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: 80h (Disable and no retry)
Units: N/A
Bit
Field Name
Value
7:6
Reserved
10
5:3
Retry Setting
000
001-110
111
2:0
Retry Delay
FN8931 Rev.1.00
Jan 4, 2018
000-111
Description
No retry. The output remains disabled until the fault is cleared.
Not used.
Attempts to restart continuously, without checking if the fault is still present, until it
is commanded OFF (by the CONTROL pin or OPERATION command), bias
power is removed, or another fault condition causes the unit to shut down.
Retry delay time = (Value + 1)*35ms. Sets the time between retries in 35ms
increments. Range is 35ms to 280ms.
Page 67 of 81
ISL8274M
7. PMBus Commands Description
IOUT_AVG_OC_FAULT_LIMIT (E7h)
Definition: Sets the IOUT average overcurrent fault threshold. For down-slope sensing, this corresponds to the average
of all the current samples taken during the (1-D) time interval, excluding the current sense blanking time (which occurs
at the beginning of the 1-D interval). For up-slope sensing, this corresponds to the average of all the current samples
taken during the D time interval, excluding the current sense blanking time (which occurs at the beginning of the D
interval). This feature shares the OC fault bit operation (in STATUS_IOUT) and OC fault response with
IOUT_OC_FAULT_LIMIT.
Paged or Global: Paged
Data Length in Bytes: 2
Data Format: Linear-11
Type: R/W
Protectable: Yes
Default Value: SYNC/OCP pin-strap setting
Units: A
Equation: IOUT_AVG_OC_FAULT_LIMIT = Y×2N
Range: -100A to 100A
IOUT_AVG_UC_FAULT_LIMIT (E8h)
Definition: Sets the IOUT average undercurrent fault threshold. For down-slope sensing, this corresponds to the
average of all the current samples taken during the (1-D) time interval, excluding the current sense blanking time
(which occurs at the beginning of the 1-D interval). For up-slope sensing, this corresponds to the average of all the
current samples taken during the D time interval, excluding the current sense blanking time (which occurs at the
beginning of the D interval). This feature shares the UC fault bit operation (in STATUS_IOUT) and UC fault response
with IOUT_ UC_FAULT_LIMIT.
Paged or Global: Paged
Data Length in Bytes: 2
Data Format: Linear-11
Type: R/W
Protectable: Yes
Default Value: DC40h (-30A)
Units: A
Equation: IOUT_AVG_UC_FAULT_LIMIT = Y×2N
Range: -100A to 100A
FN8931 Rev.1.00
Jan 4, 2018
Page 68 of 81
ISL8274M
7. PMBus Commands Description
SYNC_CONFIG (E9h)
Definition: Used to set options for SYNC output configurations.
Data Length in Bytes: 1
Data Format: BIT
Type: R/W
Default Value: Pin-strap setting
Settings
Actions
00h
Use internal clock. Clock frequency is set by pin-strap or PMBus command.
02h
Use internal clock and output internal clock.
04h
Use external clock.
SNAPSHOT (EAh)
Definition: A 32-byte read-back of parametric and status values. It allows monitoring and status data to be stored to
flash following a fault condition. In case of a fault, last updated values are stored to the flash memory. When the
SNAPSHOT STATUS bit is set stored, device will no longer automatically capture parametric and status values
following fault till stored data are erased. Use the SNAPSHOT_CONTROL command to erase store data and clear the
status bit before next ramp up. Data erased is not allowed when module is enabled.
Data Length in Bytes: 32
Data Format: Bit field
Type: Block Read
Byte Number
31:23
22
Value
PMBus Command
Format
Reserved
Reserved
00h
Flash Memory Status Byte
FF - Not Stored
00 - Stored
N/A
BIT
21
Manufacturer Specific Status Byte
STATUS_MFR_SPECIFIC (80h)
Byte
20
CML Status Byte
STATUS_CML (7Eh)
Byte
19
Temperature Status Byte
STATUS_TEMPERATURE (7Dh)
Byte
18
Input Status Byte
STATUS_INPUT (7Ch)
Byte
17
IOUT Status Byte
STATUS_IOUT (7Bh)
Byte
16
VOUT Status Byte
STATUS_VOUT (7Ah)
Byte
15:14
Switching Frequency
READ_FREQUENCY (95h)
L11
13:12
Reserved
Reserved
00h
11:10
Internal Temperature
READ_INTERNAL_TEMP (8Dh)
L11
9:8
Duty Cycle
READ_DUTY_CYCLE (94h)
L11
7:6
Highest Measured Output Current
N/A
L11
5:4
Output Current
READ_IOUT (8Ch)
L11
3:2
Output Voltage
READ_VOUT (8Bh)
L16u
1:0
Input Voltage
READ_VIN (88h)
FN8931 Rev.1.00
Jan 4, 2018
L11
Page 69 of 81
ISL8274M
7. PMBus Commands Description
BLANK_PARAMS (EBh)
Definition: Returns a 16-byte string indicating which parameter values were either retrieved by the last RESTORE
operation or have been written since that time. Reading BLANK_PARAMS immediately after a restore operation
allows the user to determine which parameters are stored in that store. A “1” indicates the parameter is not present in
the store and has not been written since the RESTORE operation.
Data Length in Bytes: 16
Data Format: BIT
Type: Block Read
Default Value: FF…FFh
SNAPSHOT_CONTROL (F3h)
Definition: Writing a 01h will cause the device to copy the current Snapshot values from NVRAM to the 32-byte
Snapshot command parameter. Writing a 02h will cause the device to write the current Snapshot values to NVRAM.
Writing a 03h will erase all Snapshot values from NVRAM. Write (02h) and Erase (03h) may only be used when the
device is disabled. All other values will be ignored.
Data Length in Bytes: 1
Data Format: Bit field
Type: R/W byte
Value
Description
01h
Read Snapshot values from NV RAM
02h
Write Snapshot values to NV RAM
03h
Erase Snapshot values stored in NV RAM.
RESTORE_FACTORY (F4h)
Definition: Restores the device to the hard coded factory default values and pin-strap definitions. The device retains
the DEFAULT and USER stores for restoring. Security level is changed to Level 1 following this command.
Data Length in Bytes: 0
Data Format: N/A
Type: Send byte
Default Value: N/A
Units: N/A
MFR_VMON_OV_FAULT_LIMIT (F5h)
Definition: Reads the VMON OV fault threshold.
Data Length in Bytes: 2
Data Format: L11
Type: Read only
Default Value: CB00h (6V)
Units: V
Range: 4V to 6V
FN8931 Rev.1.00
Jan 4, 2018
Page 70 of 81
ISL8274M
7. PMBus Commands Description
MFR_VMON_UV_FAULT_LIMIT (F6h)
Definition: Reads the VMON UV fault threshold.
Data Length in Bytes: 2
Data Format: L11
Type: Read only
Default Value: CA00h (4V)
Units: V
Range: 4V to 6V
MFR_READ_VMON (F7h)
Definition: Reads the VMON voltage.
Data Length in Bytes: 2
Data Format: L11
Type: Read only
Default Value: N/A
Units: V
Range: 4V to 6V
VMON_OV_FAULT_RESPONSE (F8h)
Definition: Reads the VMON OV fault response.
Data Length in Bytes: 1
Data Format: BIT
Type: Read only
Default Value: 80h (Disable and no retry)
Units: N/A
VMON_UV_FAULT_RESPONSE (F9h)
Definition: Reads the VMON UV fault response, which is a direct copy of VIN_UV_FAULT_RESPONSE.
Data Length in Bytes: 1
Data Format: BIT
Type: Read only
Default Value: 80h (Disable and no retry)
Units: V
FN8931 Rev.1.00
Jan 4, 2018
Page 71 of 81
ISL8274M
8.
8. Firmware Revision History
Firmware Revision History
Table 8. ISL8274M Nomenclature Guide
Firmware Revision Code
ISL8274M-0-G0100
FN8931 Rev.1.00
Jan 4, 2018
Change Description
Note
Initial Release
Page 72 of 81
FN8931 Rev.1.00
Jan 4, 2018
All dimensions are in millimeters.
Represents the basic land grid pitch.
These 42 I/Os are centered in a fixed row and column matrix
at 1.0mm pitch BSC.
Dimensioning and tolerancing per ASME Y14.5-2009.
Tolerance for exposed PAD edge location dimension on
page 3 is ±0.1mm.
2.
3.
4.
5.
SIDE VIEW
1.
NOTES:
MAX 0.025
0.08 C
7.50 MAX
C
SEATING
PLANE
2
1.00
0.10 M C A B
0.05 M C
0.100 R REF
TERMINAL TIP
3
42 x 0.60 ± 0.05
3
42 x 0.60 ± 0.05
0.40 REF
0.10 M C A B
22.60 ± 0.15
12.00
DETAIL A
BOTTOM VIEW
0.10 M C A B
17.20
16.00
18 17 16 151413 12 11 10 9 8 7 6 5 4 3 2 1
DATUM A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
1.00
2
0.20 REF
0.20 REF
DATUM B
PIN A1 INDICATOR
C = 0.35
SEE DETAIL A
Package Outline Drawing
0.10 C
TOP VIEW
0.10 C 2X
B
23.00
A
9.
0.10 C 2X
TERMINAL #A1
INDEX AREA
(9x11.5)
18.00
ISL8274M
9. Package Outline Drawing
For the most recent package outline drawing, see Y58.18x23.
Y58.18x23
58 I/O 18mmx23mmx7.5mm CUSTOM HDA MODULE
Rev 3, 12/16
Page 73 of 81
2.60
1.60 (2X)
5.30 (2X)
2.10 (2X)
1.10 (2X)
1.60 (2X)
1.00 (2X)
3.50 (2X)
4.80 (2X)
6.40
0.60
5.60
6.20
4.00 (2X)
4.20
3.40
SIZE DETAILS FOR THE 16 EXPOSED PADS
7.40
5.60
1.40 (2X)
4.40
3.60
BOTTOM VIEW
Pad Details
2.20
2.20
5.00 (2X)
2.00 (2X)
0.80 (2X)
1.10
1.30
2.30
4.60
4.40
1.60 (2X)
11.30
9.30
8.10
6.00
2.70
3.30
4.00
1.70
0.70
0.30
9.70
2.90
2.30
1.30
0.30
0.70
2.30
1.70
2.00
1.30
3.30
7.70
6.70
6.30
5.70
5.30
4.30
3.70
2.70
5.50
4.70
6.50
7.30
8.70
9.70
9.30
9.10
11.30
0.80
4.20
5.80
5.40
8.80
8.60
7.80
7.20
7.20
5.20
4.80
4.60
2.80
2.20
TERMINAL AND PAD EDGE DETAILS
3.80
6.20
6.60
7.00
1.00 (2X)
0.00
1.20
0.20
0.40
3.80
3.20
3.00
2.60
0.80
0.20
1.80
1.20
0.50
0.20
0.80
1.80
3.20
3.80
3.60
0.50
1.20
1.80
2.20
2.80
2.40
2.00
1.00 (2X)
4.40
4.20
4.80
5.20
5.20
8.20
7.20
7.80
5.80
6.20
6.80
6.00
6.50
8.30 (2X)
8.80
8.60
FN8931 Rev.1.00
Jan 4, 2018
6.40
9.30
11.30
9.30
8.10
6.00
4.00
2.30
0.00
1.30
4.30
3.70
9.70
8.50
6.30
5.10
2.90
1.00
0.70
2.00
7.70
7.30
6.70
6.30 6.50
5.70
5.50
5.30
4.70
9.10
9.70
11.30
ISL8274M
9. Package Outline Drawing
Page 74 of 81
7.510
7.830
8.640
8.960
9.730
9.770
10.090
11.270
11.500
6.330
0.000
2.030
3.910
3.590
5.470
6.530
8.130
7.810
1.390
1.710
2.500
2.820
3.895
4.215
5.290
5.610
6.400
6.720
7.510
7.830
8.770
9.000
9.000
8.770
8.450
7.830
7.510
6.720
6.400
5.610
5.290
4.215
3.895
2.820
2.500
1.710
1.390
0.530
0.000
0.530
0.000
0.230
0.770
1.230
1.910
2.230
2.910
3.230
3.910
4.230
4.910
5.230
5.910
6.230
6.910
7.660
7.340
6.430
5.970
5.240
4.920
4.190
3.870
3.140
2.820
2.090
STENCIL OPENING EDGE POSITION - 1
9.000
11.500
2.715
3.285
1.285
0.715
0.285
0.000
0.285
0.715
1.285
9.285
8.715
8.285
7.715
7.285
6.715
6.285
5.715
5.285
4.715
4.285
3.715
11.500
Stencil Potition 1 and 2
9.490
9.730
9.810
11.270
11.500
7.790
8.110
6.330
0.000
2.030
3.910
3.590
5.470
6.530
8.130
7.810
9.730
9.410
11.500
11.270
7.785
7.215
6.785
6.215
5.785
5.215
4.785
4.215
3.785
3.215
2.785
2.215
1.785
1.215
0.785
0.215
0.000
0.215
0.785
1.215
1.785
2.215
2.785
3.215
3.785
4.215
4.785
5.215
5.785
6.215
6.785
6.215
6.785
7.215
7.785
1.215
1.785
1.785
1.215
0.000
4.785
4.215
3.785
3.215
STENCIL OPENING EDGE POSITION - 2
9.000
9.000
9.000
9.000
8.785
8.215
9.000
8.570
FN8931 Rev.1.00
Jan 4, 2018
9.730
9.410
11.500
11.270
11.500
9.285
8.715
8.285
7.715
7.285
6.715
6.285
5.715
5.285
4.715
4.285
3.715
3.285
2.715
2.285
1.715
1.285
0.715
0.285
0.000
0.285
0.715
1.285
1.715
2.285
2.715
3.285
11.500
ISL8274M
9. Package Outline Drawing
Page 75 of 81
11.500
6.030
6.890
7.210
8.070
0.000
6.670
5.825
5.505
4.660
4.340
3.495
3.175
2.330
4.890
5.570
5.890
2.770
1.875
1.555
0.660
0.340
0.000
0.555
0.875
1.770
0.000
1.160
1.670
1.990
2.570
2.890
3.570
3.890
4.570
5.970
5.240
4.920
4.430
4.190
3.870
3.140
2.820
2.090
STENCIL OPENING EDGE POSITION - 3
9.000
9.000
11.500
11.500
Stencil Position 3 and 4
8.530
9.270
4.160
5.070
2.930
3.840
0.000
7.640
6.530
7.960
9.070
11.500
7.640
7.960
8.530
9.270
6.330
0.000
11.500
6.230
3.770
4.090
4.570
5.430
1.840
2.160
0.000
0.000
0.230
3.430
3.110
2.430
6.230
7.170
7.060
6.740
6.110
5.430
5.230
5.110
4.430
4.110
STENCIL OPENING EDGE POSITION - 4
9.000
8.570
9.000
7.170
6.970
7.230
9.000
8.570
9.000
9.000
FN8931 Rev.1.00
Jan 4, 2018
9.000
11.500
8.020
7.025
9.280
9.600
10.275
10.595
11.270
11.500
7.700
6.030
6.705
2.930
3.840
4.030
4.160
5.070
0.000
7.640
6.530
7.960
9.070
11.500
ISL8274M
9. Package Outline Drawing
Page 76 of 81
6.570
9.280
9.600
10.275
10.595
11.270
11.500
6.030
6.705
7.025
7.700
8.020
5.070
4.030
2.270
1.030
3.760
4.080
4.810
5.130
5.860
6.180
6.910
3.030
0.000
2.030
1.770
0.430
0.000
4.910
4.430
3.570
STENCIL OPENING EDGE POSITION - 5
9.000
9.000
7.540
7.800
8.670
8.930
9.700
9.800
10.060
11.300
11.500
6.300
0.000
2.000
3.880
3.620
5.500
6.500
8.100
7.840
9.700
9.440
11.500
10.950
Stencil Position5 land pattern 1
11.500
6.030
6.890
7.210
8.070
0.000
11.500
5.320
5.580
6.430
6.690
7.540
7.800
8.800
9.000
3.925
4.185
4.185
3.925
2.790
2.530
1.680
1.420
0.500
0.000
0.500
1.420
1.680
2.530
2.790
0.000
0.200
0.800
1.200
1.940
2.200
2.940
3.200
3.940
4.200
4.940
5.200
5.940
6.200
6.940
9.000
8.800
8.450
7.800
7.540
6.690
6.430
5.580
5.320
7.630
7.370
6.400
6.000
5.210
4.950
4.160
3.900
3.110
2.850
2.060
PCB LAND PATTERN - 1 (FOR REFERENCE)
9.000
9.000
8.600
9.000
7.810
7.490
9.000
8.770
FN8931 Rev.1.00
Jan 4, 2018
0.000
11.500
11.300
11.500
7.820
8.080
9.520
9.700
9.780
6.300
0.000
2.000
3.880
3.620
5.500
6.500
8.100
7.840
9.700
9.440
11.500
11.300
ISL8274M
9. Package Outline Drawing
Page 77 of 81
6.530
11.500
2.700
3.300
1.300
0.700
0.300
0.000
0.300
0.700
1.300
9.000
9.000
Land Pateer - 2 and 3
11.500
6.000
6.920
7.180
8.100
0.000
6.700
5.795
5.535
4.630
4.370
3.465
3.205
2.300
11.500
2.800
1.845
1.585
0.630
0.370
0.000
0.585
0.845
1.800
0.000
6.000
5.210
4.950
4.160
3.900
3.110
2.850
2.060
PCB LAND PATTERN - 3 (FOR REFERENCE)
1.060
1.700
1.960
2.600
2.860
3.600
3.860
4.600
4.860
5.600
5.860
6.600
9.000
9.000
3.200
3.800
4.200
4.800
1.800
1.200
0.000
4.800
4.200
3.800
3.200
0.000
0.200
0.800
1.200
1.800
9.000
8.800
8.200
7.800
7.200
9.000
6.800
6.200
5.800
5.200
4.800
4.200
3.800
3.200
2.800
2.200
1.800
1.200
0.800
0.200
0.200
0.800
1.200
1.800
2.200
2.800
3.200
3.800
4.200
4.800
5.200
5.800
6.200
6.800
6.200
6.800
7.200
7.800
PCB LAND PATTERN - 2 (FOR REFERENCE)
11.500
9.300
8.700
8.300
7.700
7.300
6.700
6.300
5.700
5.300
4.700
4.300
3.700
3.300
2.700
2.300
1.700
1.300
0.700
0.300
0.000
0.300
0.700
1.300
1.700
2.300
2.700
3.300
11.500
9.000
9.000
FN8931 Rev.1.00
Jan 4, 2018
9.300
8.700
8.300
7.700
7.300
6.700
6.300
5.700
5.300
4.700
4.300
3.700
11.500
11.500
9.300
7.670
7.930
8.500
6.300
0.000
11.500
ISL8274M
9. Package Outline Drawing
Page 78 of 81
11.500
9.300
8.500
3.870
4.130
5.100
2.900
0.000
6.500
7.930
7.670
3.800
4.060
4.600
5.400
6.200
1.870
2.130
0.000
0.000
0.200
6.200
7.200
7.030
6.770
6.140
5.400
5.200
5.140
4.400
4.140
3.400
3.140
2.400
9.000
9.000
8.600
PCB LAND PATTERN - 4 (FOR REFERENCE)
9.000
8.600
9.000
7.200
7.000
7.200
9.310
9.570
10.305
10.565
11.300
11.500
9.310
9.570
10.305
10.565
11.300
11.500
Land Pateer - 4 and 5
6.000
6.735
6.995
7.730
7.990
5.100
4.000
2.300
1.000
0.000
11.500
6.000
6.735
6.995
7.730
7.990
2.900
3.870
4.000
4.130
5.100
0.000
6.500
7.930
7.670
9.100
11.500
3.000
3.790
4.050
4.840
5.100
5.890
6.150
6.940
0.000
0.400
0.000
2.000
1.800
3.600
4.940
4.400
6.500
PCB LAND PATTERN - 5 (FOR REFERENCE)
9.000
9.000
FN8931 Rev.1.00
Jan 4, 2018
9.100
11.500
11.500
8.100
6.000
6.920
7.180
0.000
11.500
ISL8274M
9. Package Outline Drawing
Page 79 of 81
9.000
8.800
7.780
7.520
ISL8274M
10. Revision History
10. Revision History
Rev.
Date
1.00
Jan 4, 2018
0.00
Nov 28, 2017
FN8931 Rev.1.00
Jan 4, 2018
Description
Fixed the note numbering for Table 2 on page 11.
Added “ISENSE_CONFIG default setting” to test conditions and updated typical from 0.1 to 0.2 for the
Output Current Read Back Resolution specification on page 13.
Removed About Intersil section and updated disclaimer.
Initial release
Page 80 of 81
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2.
Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4.
You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
you or third parties arising from such alteration, modification, copying or reverse engineering.
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6.
When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2)
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
Colophon 7.0