Datasheet
ISL83220E
±15kV ESD Protected, +3V to +5.5V, 1µA, 250kbps, RS-232
Transmitters/Receivers
The ISL83220E is a 3.0V to 5.5V powered RS-232
transmitter/receiver that meets ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. It
provides 15kV ESD protection (IEC61000-4-2 Air
Gap and Human Body Model) on transmitter outputs
and receiver inputs (RS-232 pins). Targeted
applications are PDAs, Palmtops, and notebook and
laptop computers in which the low operational power
consumption and even lower standby power
consumption is critical. Efficient on-chip charge
pumps, coupled with a manual powerdown function,
reduce the standby supply current to a 1µA trickle.
Small footprint packaging and the use of small, low
value capacitors ensure board space savings. Data
rates greater than 250kbps are ensured at worst case
load conditions. The ISL83220E is fully compatible
with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
Features
Table 1 summarizes the features of the ISL83320E,
and Application Note AN9863 summarizes the
features of each device in the ICL32xxE 3V family.
• Ensured minimum data rate: 250kbps
Related Literature
• Low supply current in powerdown state: 1µA
For a full list of related documents, visit our website:
• ISL83220E device page
• Pb-free (RoHS compliant)
• ESD protection for RS-232 I/O pins to 15kV
(IEC61000)
• Drop-in replacement for SP3220E
• Meets EIA/TIA-232 and V.28/V.24 specifications
at 3V
• RS-232 compatible outputs at 2.7V
• Latch-up free
• On-chip voltage converters require only four
external 0.1µF capacitors
• Manual powerdown feature with receivers active
• Separate receiver enable pin
• RX and TX hysteresis for improved noise immunity
• Ensured minimum slew rate: 6V/µs
• Wide power supply range: Single +3V to +5.5V
Applications
• Any system requiring RS-232 communication ports
○ Battery powered, hand-held, and portable
equipment
○ Laptop computers, notebooks, and Palmtops
○ Modems, printers and other peripherals
○ Digital cameras
○ Cellular and mobile phones
Table 1.
Summary of Features
Part Number
No. of
Tx.
No. of
Rx.
No. of Monitor
Rx. (ROUTB)
Data Rate
(kbps)
Rx. Enable
Function?
Ready
Output?
Manual
Power- Down?
Automatic
Powerdown
Function?
ISL83220E
1
1
0
250
Yes
No
Yes
No
FN6011 Rev 6.00
Apr.26.19
Page 1 of 17
ISL83220E
1.
1.1
1. Overview
Overview
Typical Operating Circuit
ISL83220E
+3.3V
C1
0.1µF
C2
0.1µF
T1IN
TTL/CMOS
Logic Levels
R1OUT
+
0.1µF
15
2
+ C1+
4
C15
+ C2+
6
C2-
VCC
V+
3
+ C3
0.1µF
V- 7
T1
11
13
9
8
C4
+ 0.1µF
T1OUT
R1IN
RS-232
Levels
5kΩ
R1
1 EN
GND
SHDN
16
VCC
14
1.2
Ordering Information
Part Number
(Notes 2, 3)
Part Marking
Temp. Range (°C)
Tape and Reel
(Units) (Note 1)
Package (RoHS Compliant)
Pkg.
Dwg. #
ISL83220ECVZ
83220ECVZ
0 to +70
-
16 Ld TSSOP
M16.173
ISL83220ECVZ-T
83220ECVZ
0 to +70
2.5k
16 Ld TSSOP
M16.173
ISL83220EIVZ
83220EIVZ
-40 to +85
-
16 Ld TSSOP
M16.173
ISL83220EIVZ-T
83220EIVZ
-40 to +85
2.5k
16 Ld TSSOP
M16.173
Notes:
1. See TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J-STD-020.
3. For Moisture Sensitivity Level (MSL), see the ISL83220E device page. For more information about MSL, see TB363.
1.3
Pin Configuration
16 Ld TSSOP
Top View
EN 1
C1+ 2
V+ 3
15 VCC
14 GND
C1- 4
13 T1OUT
C2+ 5
12 NC
C2- 6
11 T1IN
V- 7
R1IN 8
FN6011 Rev 6.00
Apr.26.19
16 SHDN
10 NC
9 R1OUT
Page 2 of 17
ISL83220E
1.4
1. Overview
Pin Descriptions
Pin
Function
VCC
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
T1IN
TTL/CMOS compatible transmitter inputs.
T1OUT
R1IN
R1OUT
EN
SHDN
NC
15kV ESD protected, RS-232 level (nominally 5.5V) transmitter outputs.
15kV ESD protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
Active low receiver enable control; does not disable ROUTB outputs.
Active low input that shuts down transmitters and on-board power supply to place the device in low power mode.
No internal connection.
FN6011 Rev 6.00
Apr.26.19
Page 3 of 17
ISL83220E
2.
2. Specifications
Specifications
2.1
Absolute Maximum Ratings
Minimum
Maximum
Unit
VCC to GND
Parameter
-0.3
6
V
V+ to GND
-0.3
7
V
V- to GND
+0.3
-7
V
14
V
6
V
±25
V
±13.2
V
VCC + 0.3
V
V+ to VInput Voltages
TIN, EN, SHDN
-0.3
RIN
Output Voltages
TOUT
-0.3
ROUT
Short-Circuit Duration
Continuous
TOUT
ESD Rating
See ESD Performance
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely
impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
Thermal Resistance (Typical) Note 4
θJA (°C/W)
16 Ld TSSOP Package
145
Note:
4. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details.
Parameter
Minimum
Maximum
+150
°C
-65
+150
°C
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
Pb-Free Reflow Profile
2.3
see TB493
Recommended Operating Conditions
Parameter
Temperature Range
2.4
Unit
Minimum
Maximum
Unit
0°
+70
°C
Electrical Specifications
Test conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at TA = 25°C
Parameter
Test Conditions
Temp (°C)
Min
Typ
Max
Unit
25
-
0.3
1.0
mA
25
-
1.0
10
µA
Full
-
-
0.8
V
DC Characteristics
Supply Current
All Outputs Unloaded,
SHDN = VCC
Supply Current, Powerdown
SHDN = GND
VCC = 3.15V
Logic and Transmitter Inputs and Receiver Outputs
Input Logic Threshold Low
FN6011 Rev 6.00
Apr.26.19
TIN, EN, SHDN
Page 4 of 17
ISL83220E
2. Specifications
Test conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at TA = 25°C (Continued)
Parameter
Input Logic Threshold High
Test Conditions
TIN, EN, SHDN
Temp (°C)
Min
Typ
Max
Unit
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
Transmitter Input Hysteresis
25
-
0.3
Input Leakage Current
TIN, EN, SHDN
Full
-
0.01
1.0
µA
Output Leakage Current
EN = VCC
Full
-
0.05
10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
5.0
5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = 2V
Full
300
10M
-
Ω
Output Short-Circuit Current
VOUT = 0V
Full
-
35
60
mA
Output Leakage Current
VOUT =12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
25
µA
Full
-25
-
25
V
VCC = 3.3V
Full
0.6
1.2
-
V
VCC = 5.0V
Full
0.8
1.5
-
V
VCC = 3.3V
Full
-
1.5
2.4
V
VCC = 5.0V
Full
-
1.8
2.4
V
VCC -0.6 VCC -0.1
V
Transmitter Outputs
Receiver Inputs
Input Voltage Range
Input Threshold Low
Input Threshold High
Input Hysteresis
25
-
0.3
-
V
Input Resistance
Full
3
5
7
kΩ
Full
250
500
-
kbps
Timing Characteristics
Maximum Data Rate
RL = 3kΩCL = 1000pF, One Transmitter Switching
Transmitter Propagation Delay
Transmitter Input to
Transmitter Output,
RL = 3kΩCL = 1000pF
Receiver Propagation Delay
Receiver Input to
Receiver Output,
CL = 150pF
tPHL
25
-
1.0
-
µs
tPLH
25
-
1.0
-
µs
tPHL
25
-
0.20
-
µs
tPLH
25
-
0.30
-
µs
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH (Note 5)
25
-
100
500
ns
Receiver Skew
tPHL - tPLH
Full
-
100
1000
ns
Transition Region Slew Rate
VCC = 3.3V,
RL = 3kΩto 7kΩ
Measured From 3V to
-3V or -3V to 3V
CL = 150pF to 2500pF
25
4
-
30
V/µs
CL = 150pF to 1000pF
25
6
-
30
V/µs
Human Body Model
25
-
15
-
kV
IEC61000-4-2 Contact Discharge
25
-
8
-
kV
IEC61000-4-2 Air Gap Discharge
25
-
15
-
kV
Human Body Model
25
-
3
-
kV
ESD Performance
RS-232 Pins (T1OUT, R1IN)
All Other Pins
Note:
5. Transmitter skew is measured at the transmitter zero crossing points.
FN6011 Rev 6.00
Apr.26.19
Page 5 of 17
ISL83220E
3.
3. Typical Performance Curves
Typical Performance Curves
VCC = 3.3V, TA = 25°C
25
VOUT+
4
20
2
Slew Rate (V/µs)
Transmitter Output Voltage (V)
6
Transmitter at 250kbps
0
-2
15
-Slew
+Slew
10
VOUT -
-4
-6
0
1000
2000
3000
4000
5
5000
0
1000
Figure 1. Transmitter Output Voltage vs Load
Capacitance
3.5
40
Supply Current (mA)
250kbps
30
25
20
120kbps
15
10
4000
5000
No Load
All Outputs Static
3.0
35
Supply Current (mA)
3000
Figure 2. Slew Rate vs Load Capacitance
45
2.5
2.0
1.5
1.0
20kbps
0.5
5
0
2000
Load Capacitance (pF)
Load Capacitance (pF)
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Figure 3. Supply Current vs Load Capacitance when
Transmitting Data
FN6011 Rev 6.00
Apr.26.19
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Figure 4. Supply Current vs Supply Voltage
Page 6 of 17
ISL83220E
4.
4. Application Information
Application Information
The ISL83220E operates from a single +3V to +5.5V supply, ensures a 250kbps minimum data rate, requires only
four small external 0.1µF capacitors, features low power consumption, and meets all ElA RS-232C and V.28
specifications.
4.1
Charge Pump
The 3.3V ISL83220E uses regulated on-chip dual charge pumps as voltage doublers and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. The charge pumps allow these devices to
maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient
on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter
functions, even at VCC = 3.3V. The charge pumps operate discontinuously (turning off as soon as the V+ and Vsupplies are pumped up to the nominal values) and provide significant power savings.
4.1.1 Charge-Pump Abs Max Ratings
These 3V to 5V RS-232 transceivers have been fully characterized for 3.0V to 3.6V operation, and at critical
points for 4.5V to 5.5V operation. Furthermore, load conditions were favorable using static logic states only.
The specified maximum values for V+ and V- are +7V and -7V, respectively. These limits apply for VCC values set
to 3.0V and 3.6V (see Table 2). For VCC values set to 4.5V and 5.5V, the maximum values for V+ and V- can
approach +9V and -7V, respectively (Table 3 on page 8). The breakdown characteristics for V+ and V- were
measured with ±13V.
Table 2.
V+ and V- Values for VCC = 3.0V to 3.6V
V+ (V)
V- (V)
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN
(Logic State)
0.1
0.1
Open
H
5.80
6.56
-5.60
-5.88
L
5.80
6.56
-5.60
-5.88
2.4kbps
5.80
6.56
-5.60
-5.88
H
5.88
6.60
-5.56
-5.92
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
FN6011 Rev 6.00
Apr.26.19
VCC = 3.0V
VCC = 3.6V
VCC = 3.0V
VCC = 3.6V
L
5.76
6.36
-5.56
-5.76
2.4kbps
6.00
6.64
-5.64
-5.96
H
5.68
6.00
-5.60
-5.60
L
5.68
6.00
-5.60
-5.60
2.4kbps
5.68
6.00
-5.60
-5.60
H
5.76
6.08
-5.64
-5.64
L
5.68
6.04
-5.60
-5.60
2.4kbps
5.84
6.16
-5.64
-5.72
H
5.88
6.24
-5.60
-5.60
L
5.88
6.28
-5.60
-5.64
2.4kbps
5.80
6.20
-5.60
-5.60
H
5.88
6.44
-5.64
-5.72
L
5.88
6.04
-5.64
-5.64
2.4kbps
5.92
6.40
-5.64
-5.64
Page 7 of 17
ISL83220E
Table 3.
4. Application Information
V+ and V- Values for VCC = 4.5V to 5.5V
V+ (V)
V- (V)
C1 (μF)
C2, C3, C4 (μF)
Load
T1IN
(Logic State)
0.1
0.1
Open
H
7.44
8.48
-6.16
-6.40
L
7.44
8.48
-6.16
-6.44
2.4kbps
7.44
8.48
-6.17
-6.44
H
7.76
8.88
-6.36
-6.72
3kΩ // 1000pF
0.047
0.33
Open
3kΩ // 1000pF
1
1
Open
3kΩ // 1000pF
VCC = 4.5V
VCC = 5.5V
VCC = 4.5V
VCC = 5.5V
L
7.08
8.00
-5.76
-5.76
2.4kbps
7.76
8.84
-6.40
-6.64
H
6.44
6.88
-5.80
-5.88
L
6.48
6.88
-5.84
-5.88
2.4kbps
6.44
6.88
-5.80
-5.88
H
6.64
7.28
-5.92
-6.04
L
6.24
6.60
-5.52
-5.52
2.4kbps
6.72
7.16
-5.92
-5.96
H
6.84
7.60
-5.76
-5.76
L
6.88
7.60
-5.76
-5.76
2.4kbps
6.92
7.56
-5.72
-5.76
H
7.28
8.16
-5.80
-5.92
L
6.44
6.84
-5.64
-6.84
2.4kbps
7.08
7.76
-5.80
-5.80
The resulting new maximum voltages at V+ and V- are listed in Table 4.
Table 4.
4.2
New Measured Withstanding Voltages
V+, V- to Ground
±13V
V+ to V-
20V
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. The transmitters are coupled with the on-chip ±5.5V supplies to deliver true RS-232 levels across a
wide range of single supply system voltages.
The transmitter output disables and assumes a high impedance state when the device enters the powerdown
mode (see Table 5 on page 9). The output can be driven to ±12V when disabled.
All devices ensure a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V. Under more typical
conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, the ISL83220E easily operates at 900kbps.
Note: Transmitter inputs float if they remain unconnected and can increase ICC.
4.3
Receivers
The ISL83220E contains a standard inverting receiver that tri-states from the EN control line. Receivers convert
RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 5 on page 9) even if the power is off (VCC = 0V). The receiver’s Schmitt trigger input
stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions.
The ISL83220E receiver disables only when EN is driven high (see Table 5 on page 9). This feature allows the
receiver to monitor external devices such as a modem even when the ISL83220E is in its 1µA powerdown state.
FN6011 Rev 6.00
Apr.26.19
Page 8 of 17
ISL83220E
4. Application Information
Standard receivers driving powered down peripherals must be disabled to prevent current flow through the
peripheral’s protection diodes (see Figure 6 on page 10). The receivers cannot be used for wake up functions
when they are disabled.
VCC
R1OUT
R1IN
-25V ≤ VRIN ≤ +25V
5kΩ
GND ≤ VROUT ≤ VCC
GND
Figure 5. Inverting Receiver Connections
4.4
Operation Down to 2.7V
The ISL83220E transmitter outputs meet RS-562 levels (±3.7V) at the full data rate with VCC as low as 2.7V.
RS-562 levels typically ensure interoperability with RS-232 devices.
4.5
Powerdown Functionality
This 3V ISL83220E requires a nominal supply current of 0.3mA during normal operation (not in powerdown
mode), which is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low
current requirement drops significantly when the device enters powerdown mode. In powerdown, the supply
current drops to 1µA because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and
the transmitter outputs tri-state. This micro-power mode makes these devices ideal for battery powered and
portable applications.
4.5.1 Software Controlled (Manual) Powerdown
The ISL83220E’s powerdown control is a simple shutdown (SHDN) pin. Driving this pin high enables normal
operation. Driving the pin low forces the IC into its powerdown state. Connect SHDN to VCC if the powerdown
function is not needed. Note: The receiver output remains enabled during shutdown (see Table 5). For the lowest
power consumption during powerdown, disable the receiver by driving the EN input high (see Receiver ENABLE
Control). The time to recover from manual powerdown mode is typically 100µs.
Table 5.
4.6
Powerdown and Enable Logic Truth Table
SHDN
Input
EN
Input
Transmitter
Output
Receiver
Output
L
L
High-Z
Active
Mode of Operation
Manual Powerdown
L
H
High-Z
High-Z
Manual Powerdown with Receiver Disabled
H
L
Active
Active
Normal Operation
H
H
Active
High-Z
Normal Operation with Receiver Disabled
Receiver ENABLE Control
The ISL83220E’s EN input controls the receiver output. Driving EN high disables the receiver output and places it
in a high impedance state. Disabling the receiver output is useful for eliminating the supply current, due to a
receiver output forward biasing the protection diode when driving the input of a powered down (VCC = GND)
peripheral (see Figure 6 on page 10).
FN6011 Rev 6.00
Apr.26.19
Page 9 of 17
ISL83220E
4. Application Information
VCC
VCC
Current
Flow
VCC
Rx
Powered
Down
UART
VOUT = VCC
Tx
SHDN = GND
GND
Old
RS-232 Chip
Figure 6. Power Drain Through Powered Down Peripheral
4.7
Capacitor Selection
The charge pumps require 0.1µF capacitors for 3.3V operation. Do not use values smaller than 0.1µF. Increasing
the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power
consumption. When using minimum required capacitor values, make sure that capacitor values do not degrade
excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s Equivalent
Series Resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
4.8
Power Supply Decoupling
In most circumstances, a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
4.9
Transmitter Output when Exiting Powerdown
Figure 7 shows the response of the transmitter output when exiting powerdown mode. As the transmitter output
activates, it properly goes to RS-232 levels with no glitching, ringing, or undesirable transients. The transmitter is
loaded with 3kΩin parallel with 2500pF. Note: The transmitter enables only when the magnitude of the supplies
exceed approximately 3V.
5V/Div
SHDN
TIN = LOW
2V/Div
TIN = HIGH
VCC = +3.3V
C1 - C4 = 0.1µF
Time (20µs/Div)
Figure 7. Transmitter Output when Exiting Powerdown
FN6011 Rev 6.00
Apr.26.19
Page 10 of 17
ISL83220E
4.10
4. Application Information
High Data Rates
The ISL83220E maintains the RS-232 ±5V minimum transmitter output voltages, even at high data rates. Figure 8
shows a transmitter loopback test circuit. Figure 9 shows the loopback test result at 120kbps. For this test, the
transmitter is driving an RS-232 load in parallel with 1000pF at 120kbps. Figure 10 shows the loopback results for
the transmitter driving 1000pF and an RS-232 load at 250kbps.
VCC
+
0.1µF
+
C1
C1+
VCC
V+
C1+
C2
ISL83220E
V-
C2+
C2TIN
VCC
+
C3
C4
+
TOUT
ROUT
RIN
EN
5k
1000pF
SHDN
Figure 8. Transmitter Loopback Test Circuit
5V/Div
5V/Div
T1IN
T1IN
T1OUT
T1OUT
R1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
VCC = +3.3V
C1 - C4 = 0.1µF
5µs/Div
Figure 9. Loopback Test at 120kbps
FN6011 Rev 6.00
Apr.26.19
2µs/Div
Figure 10. Loopback Test at 250kbps
Page 11 of 17
ISL83220E
4.11
4. Application Information
Interconnection with 3V and 5V Logic
The ISL83220E directly interfaces with 5V CMOS and TTL logic families. AC, HC, and CD4000 outputs can drive
ISL83220E inputs with the device at 3.3V and the logic supply at 5V, but ISL83220E outputs do not reach the
minimum VIH for these logic families. See Table 6 for more information.
Table 6.
Logic Family Compatibility with Various Supply Voltages
System Power-Supply Voltage (V)
VCC Supply Voltage (V)
3.3
3.3
5
5
5
3.3
FN6011 Rev 6.00
Apr.26.19
Compatibility
Compatible with all CMOS families.
Compatible with all TTL and CMOS logic families.
Compatible with ACT and HCT CMOS, and with TTL. ISL83220E
outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
Page 12 of 17
ISL83220E
5.
5. ±15kV ESD Protection
±15kV ESD Protection
All pins on the ISL8xxx devices include ESD protection structures, but the ISL8xxxE family incorporates advanced
structures that allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV.
The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on
the exterior of the finished product.Touching the port pins or connecting a cable can cause an ESD event that
might destroy unprotected ICs. The ESD structures protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and do not interfere with RS-232 signals as large as ±25V.
5.1
Human Body Model (HBM) Testing
The Human Body Model (HBM) test method emulates the ESD event delivered to an IC during human handling.
The tester delivers the charge through a 1.5kΩ current limiting resistor and makes the test less severe than the
IEC61000 test, which uses a 330Ω limiting resistor. The HBM method determines an IC’s ability to withstand the
ESD transients typically present during handling and manufacturing. Due to the random nature of these events,
each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD
events to ±15kV.
5.2
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment rather than to an individual IC. Therefore, the pins most
likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and
the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin
combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that
is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the
design of equipment that meets level 4 criteria without the need for additional board level protection on the
RS-232 port.
5.3
Air-Gap Discharge Test Method
For the air-gap discharge test method, a charged probe tip moves toward the IC pin until the voltage arcs to it.
The current waveform delivered to the IC pin depends on factors such as approach speed, humidity, temperature,
so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges.
5.4
Contact Discharge Test Method
During the contact discharge test, the probe contacts the tested pin before the probe tip is energized and
eliminates the variables associated with the air-gap discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV
contact discharges on the RS-232 pins.
FN6011 Rev 6.00
Apr.26.19
Page 13 of 17
ISL83220E
6.
6. Die Characteristics
Die Characteristics
Substrate Potential (Powered Up)
GND
Transistor Count
286
Process
Si Gate CMOS
FN6011 Rev 6.00
Apr.26.19
Page 14 of 17
ISL83220E
7.
7. Revision History
Revision History
Rev.
Date
6.00
Apr.26.19
FN6011 Rev 6.00
Apr.26.19
Description
Updated Related Literature section.
Ordering Informationon page 2:
Added Tape and Reel column
Removed obsolete parts
Added notes 1-3.
Added Charge Pump Abs Max Ratings section starting on page 7.
Updated package outline drawing to version 2.
Convert to new POD format by moving dimensions from table onto drawing and adding land pattern. No
dimension changes.
Applied new template.
Page 15 of 17
ISL83220E
8.
8. Package Outline Drawing
Package Outline Drawing
For the most recent package outline drawing, see M16.173.
M16.173
16 Lead Thin Shrink Small Outline Package (TSSOP)
Rev 2, 5/10
A
1
3
5.00 ±0.10
SEE DETAIL "X"
9
16
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3
0.20 C B A
1
8
B
0.65
0.09-0.20
END VIEW
TOP VIEW
H
1.00 REF
- 0.05
C
1.20 MAX
SEATING
PLANE
0.90 +0.15/-0.10
GAUGE
PLANE
0.25 +0.05/-0.06 5
0.10 M C B A
0.10 C
0°-8°
0.05 MIN
0.15 MAX
SIDE VIEW
0.25
0.60 ±0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN6011 Rev 6.00
Apr.26.19
Page 16 of 17
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