DATASHEET
ISL84514, ISL84515
FN6025
Rev 5.00
June 9, 2014
Low-Voltage, Single Supply, SPST, Analog Switches
The Intersil ISL84514 and ISL84515 devices are precision,
analog switches designed to operate from a single +2.4V to
+12V supply. Targeted applications include battery powered
equipment that benefit from the devices’ low power
consumption (5µW), and low leakage currents (1nA). Low rON
and fast switching speeds over a wide operating supply range
make these switches ideal for use in industrial equipment,
portable instruments, and as input signal multiplexers for new
generation, low supply voltage data converters. Some of the
smallest packages available alleviate board space limitations,
and make Intersil’s newest line of low-voltage switches an
ideal solution for space constrained products.
The ISL8451x are single-pole/single-throw (SPST) switches,
with the ISL84514 being normally open (NO), and the
ISL84515 being normally closed (NC).
Table 1 summarizes the performance of this family. For higher
performance, pin compatible versions, see the ISL43110,
ISL43111 data sheet. For ±5V supply versions, see the
ISL84516, ISL84517 data sheet.
TABLE 1. FEATURES AT A GLANCE
DESCRIPTION
ISL84514
ISL84515
1
1
Configuration
NO
NC
3.3V rON
20
20
60ns/30ns
60ns/30ns
12
12
45ns/25ns
45ns/25ns
8
8
40ns/25ns
40ns/25ns
Number of Switches
3.3V tON/tOFF
5V rON
5V tON/tOFF
12V rON
12V tON/tOFF
Packages
8 Ld SOIC, 5 Ld SOT-23
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
10 (V+ = 12V)
• rON flatness (max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
• Charge injection (max) . . . . . . . . . . . . . . . . . . . . . . . . . . 10pC
• Low power consumption (PD) . . . . . . . . . . . . . . . . . . . .90
-
dB
+25
-
14
-
pF
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
FN6025 Rev 5.00
June 9, 2014
Page 3 of 12
ISL84514, ISL84515
Electrical Specifications Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 8),
unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +85°C. (Continued)
MAX
(Notes 9, 11) UNITS
TEMP
(°C)
MIN
(Notes 9, 11)
TYP
f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
+25
-
14
-
pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
+25
-
30
-
pF
+25
-1
0.0001
1
µA
Full
-10
-
10
µA
PARAMETER
COM OFF Capacitance,
CCOM(OFF)
TEST CONDITIONS
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 5.5V, VIN = 0V or V+, Switch On or Off
Electrical Specifications - 12V Supply
Test Conditions: V+ = +10.8V to +13.2V, GND = 0V, VINH = 5V, VINL = 0.8V (Note 8),
unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 9, 11)
TYP
Full
0
-
V+
V
+25
-
-
10
Full
-
-
15
MAX
(Notes 9, 11) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-resistance, rON
rON Flatness, RFLAT(ON)
V+ = 10.8V, ICOM = 1.0mA, VCOM = 10V
V+ = 12V, ICOM = 1.0mA, VCOM = 3V, 6V, 9V
+25
-
-
3
Full
-
-
5
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 13.2V, VCOM = 1V, 10V, VNO or VNC = 10V,
1V, (Note 10)
+25
-2
-
2
nA
Full
-50
-
50
nA
COM OFF Leakage Current,
ICOM(OFF)
V+ = 13.2V, VCOM = 10V, 1V, VNO or VNC = 1V,
10V, (Note 10)
+25
-2
-
2
nA
Full
-50
-
50
nA
COM ON Leakage Current,
ICOM(ON)
V+ = 13.2V, VCOM = 1V, 10V, or VNO or VNC = 1V,
10V, (Note 10)
+25
-4
-
4
nA
Full
-100
-
100
nA
Full
5
3
V+
V
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH
Full
0
-
0.8
V
V+ = 13.2V, VIN = 0V or V+
Full
-1
-
1
µA
Turn-ON Time, tON
VNO or VNC = 10V, RL = 300, CL = 35pF,
VIN = 0 to 5V, (see Figure 1)
+25
-
-
150
ns
Full
-
-
240
ns
Turn-OFF Time, tOFF
VNO or VNC = 10V, RL = 300, CL = 35pF,
VIN = 0 to 5V, (see Figure 1)
+25
-
-
100
ns
Full
-
-
150
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, (see Figure 2)
+25
-
8
20
pC
OFF-isolation
RL = 50, CL = 15pF, f = 100kHz, (see Figure 3)
+25
-
>90
-
dB
NO or NC OFF Capacitance,
COFF
f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
+25
-
14
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
+25
-
14
-
pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V,
(see Figure 5)
+25
-
30
-
pF
Input Voltage Low, VINL
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
FN6025 Rev 5.00
June 9, 2014
V+ = 13.2V, VIN = 0V or V+, Switch On or Off
+25
-2
-
2
µA
Full
-20
-
20
µA
Page 4 of 12
ISL84514, ISL84515
Electrical Specifications - 3.3V Supply
Test Conditions: V+ = +3.0V to +3.6V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 8),
Unless Otherwise Specified. Boldface limits apply across the operating temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 9, 11)
TYP
Full
0
-
V+
V
+25
-
-
50
Full
-
-
75
+25
-
-
5.5
Full
-
-
7.0
MAX
(Notes 9, 11) UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-resistance, rON
rON Flatness, RFLAT(ON)
V+ = 3V, ICOM = 1.0mA, VCOM = 1.5V
ICOM = 1.0mA, VCOM = 0.5V, 1V, 1.5V
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 3.6V, VCOM = 3V, 1V, VNO or VNC = 1V, 3V,
(Note 10)
+25
-1
0.01
1
nA
Full
-20
-
20
nA
COM OFF Leakage Current,
ICOM(OFF)
V+ = 3.6V, VCOM = 3V, 1V, VNO or VNC = 1V, 3V,
(Note 10)
+25
-1
0.01
1
nA
Full
-20
-
20
nA
COM ON Leakage Current,
ICOM(ON)
V+ = 3.6V, VCOM = 1V, 3V, or VNO or VNC = 1V,
3V, (Note 10)
+25
-2
0.01
2
nA
Full
-40
-
40
nA
Input Voltage High, VINH
Full
2.4
-
V+
V
Input Voltage Low, VINL
Full
0
-
0.8
V
V+ = 3.6V, VIN = 0V or V+
Full
-1
-
1
µA
VNO or VNC = 1.5V, RL = 300, CL = 35pF,
VIN = 0 to 3V
+25
-
-
150
ns
Full
-
-
240
ns
VNO or VNC = 1.5V, RL = 300, CL = 35pF,
VIN = 0 to 3V
+25
-
-
100
ns
Full
-
-
150
ns
CL = 1.0nF, VG = 0V, RG = 0
+25
-
4
10
pC
+25
-1
-
1
µA
Full
-10
-
10
µA
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
Charge Injection, Q
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 3.6V, VIN = 0V or V+, Switch On or Off
NOTES:
8. VIN = input voltage to perform proper function.
9. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
10. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at +25°C.
11. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
FN6025 Rev 5.00
June 9, 2014
Page 5 of 12
ISL84514, ISL84515
Test Circuits and Waveforms
3V or 5V
LOGIC
INPUT
V+
tr < 20ns
tf < 20ns
50%
C
0V
tOFF
SWITCH
INPUT
SWITCH
INPUT
VOUT
COM
IN
90%
SWITCH
OUTPUT
VOUT
NO or NC
90%
0V
LOGIC
INPUT
CL
35pF
RL
300
GND
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
CL includes fixture and stray capacitance.
V OUT = V
FIGURE 1A. MEASUREMENT POINTS
RL
----------------------(NO or NC) R + r
L
ON
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
V+
SWITCH
OUTPUT
VOUT
VOUT
RG
ON
ON
LOGIC
INPUT
NO OR NC
VG
OFF
C
GND
VOUT
COM
IN
CL
LOGIC
INPUT
Q = VOUT x CL
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
V+
V+
C
C
rON = V1/1mA
SIGNAL
GENERATOR
COM
NO OR NC
VCOM
IN
0V OR V+
1mA
IN
V1
0.8V OR VINH
COM
ANALYZER
GND
NO OR NC GND
RL
FIGURE 3. OFF-ISOLATION TEST CIRCUIT
FN6025 Rev 5.00
June 9, 2014
FIGURE 4. rON TEST CIRCUIT
Page 6 of 12
ISL84514, ISL84515
Test Circuits and Waveforms (Continued)
V+
C
NO OR NC
IN
IMPEDANCE
ANALYZER
0V OR V+
COM
GND
FIGURE 5. CAPACITANCE TEST CIRCUIT
Detailed Description
The ISL84514 and ISL84515 analog switches offer precise
switching capability from a single 2.4V to 12V supply with
low ON-resistance, and high-speed operation. The devices
are especially well suited to portable battery powered
equipment thanks to the low operating supply voltage (2.4V),
low power consumption (5µW), low leakage currents (2nA
max), and the tiny SOT-23 packaging. High frequency
applications also benefit from the wide bandwidth, and the
very high off-isolation.
OPTIONAL PROTECTION
DIODE
V+
OPTIONAL
PROTECTION
RESISTOR
IN
VNO OR NC
VCOM
GND
Supply Sequencing and Overvoltage Protection
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents,
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and to GND (see
Figure 6). To prevent forward biasing these diodes, V+ must
be applied before any input signals, and input signal
voltages must remain between V+ and GND. If these
conditions cannot be guaranteed, then one of the following
two protection methods should be employed.
Logic inputs can easily be protected by adding a 1k
resistor in series with the input (see Figure 6). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
Adding a series resistor to the switch input defeats the
purpose of using a low rON switch, so two small signal
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (see Figure 6). These
additional diodes limit the analog signal from 1V below V+ to
1V above GND. The low leakage current performance is
unaffected by this approach, but the switch resistance may
increase, especially at low supply voltages
FN6025 Rev 5.00
June 9, 2014
OPTIONAL PROTECTION
DIODE
FIGURE 6. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL8451x construction is typical of most CMOS analog
switches, except that there are only two supply pins: V+ and
GND. Unlike switches with a 13V maximum supply voltage,
the ISL8451x 15V maximum supply voltage provides plenty
of room for the 10% tolerance of 12V supplies, as well as
margin for overshoot and noise spikes.
The minimum recommended supply voltage is 2.4V. It is
important to note that the input signal range, switching times,
and ON-resistance degrade at lower supply voltages. Refer
to the “Electrical Specifications” tables beginning on page 3
and “Typical Performance Curves” beginning on page 9 for
details.
V+ and GND power the internal CMOS switches and set
their analog voltage limits. These supplies also power the
internal logic and level shifters. The level shifters convert the
input logic levels to switched V+ and GND signals to drive
the analog switch gate terminals.
Page 7 of 12
ISL84514, ISL84515
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes
negative in this configuration. For a ±5V single SPST switch,
see the ISL84516, ISL84517 data sheet.
Logic-Level Thresholds
This switch family is TTL compatible (0.8V and 2.4V) over a
supply range of 3V to 11V, and the full temperature range
(see Figure 10). At 12V the low temperature VIH level is
about 2.5V. This is still below the TTL guaranteed high
output minimum level of 2.8V, but noise margin is reduced.
For best results with a 12V supply, use a logic family that
provides a VOH greater than 3V.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipation.
High-Frequency Performance
In 50systems, signal response is reasonably flat to
20MHz, with a -3dB bandwidth exceeding 200MHz (see
Figure 13). Figure 13 also illustrates that the frequency
response is very consistent over a wide V+ range, and for
varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feed-through from a switch’s input to its output. Off-isolation
FN6025 Rev 5.00
June 9, 2014
is the resistance to this feed-through. Figure 14 details the
high off-isolation provided by this family. At 10MHz, offisolation is about 50dB in 50systems, decreasing
approximately 20dB per decade as frequency increases.
Higher load impedances decrease off-isolation due to the
voltage divider action of the switch OFF impedance and the
load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND.
One of these diodes conducts if any analog signal exceeds
V+ or GND.
Virtually, all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the
analog-signal-path leakage current. All analog leakage
current flows between each pin and one of the supply
terminals, not to the other switch terminal. This is why both
sides of a given switch can show leakage currents of the
same or opposite polarity. There is no connection between
the analog-signal paths and V+ or GND.
Page 8 of 12
ISL84514, ISL84515
Typical Performance Curves TA = +25°C, Unless Otherwise Specified
25
25
VCOM = (V+) - 1V
rON ()
15
+85°C
-40°C
10
5
3
+25°C
4
5
6
7
8
9
10
11
12
13
+25°C
10
19
17
15
13
11
9
7
14
+85°C
12
10
8 -40°C
6
4
0
2
-40°C
V+ = 5V
+85°C
+25°C
-40°C
V+ = 12V
+25°C
4
6
8
10
12
VCOM (V)
V+ (V)
FIGURE 7. ON-RESISTANCE vs SUPPLY VOLTAGE
FIGURE 8. ON-RESISTANCE vs SWITCH VOLTAGE
50
3.0
40
2.5
-40°C
VINH
VINH AND VINL (V)
V+ = 5V
30
Q (pC)
V+ = 3.3V
+85°C
15
20
rON ()
ICOM = 1mA
20
ICOM = 1mA
20
2.0
+25°C
-40°C
VINL
1.5
+25°C
+85°C
1.0
10
+85°C
V+ = 3.3V
0
0
1
2
3
4
0.5
5
2
3
4
5
6
7
VCOM (V)
8
9
10
11
12
13
V+ (V)
FIGURE 10. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
FIGURE 9. CHARGE INJECTION vs SWITCH VOLTAGE
60
140
VCOM = (V+) - 1V
VCOM = (V+) - 1V
130
RL = 300
120
RL = 300
50
110
tOFF (ns)
tON (ns)
100
90
+85°C
80
70
40
+85°C
30
+25°C
+25°C
60
20
50
30
-40°C
-40°C
40
10
2
3
4
5
6
7
V+ (V)
8
9
10
11
FIGURE 11. TURN-ON TIME vs SUPPLY VOLTAGE
FN6025 Rev 5.00
June 9, 2014
12
2
3
4
5
6
7
V+ (V)
8
9
10
11
FIGURE 12. TURN-OFF TIME vs SUPPLY VOLTAGE
Page 9 of 12
12
ISL84514, ISL84515
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
10
0
V+ = 3V to 13V
20 RL = 50
GAIN
V+ = 3.3V
30
-6
0
PHASE
V+ = 12V
20
40
V+ = 3.3V
RL = 50
VIN = 0.2VP-P to 2.5VP-P (V+ = 3.3V)
VIN = 0.2VP-P to 5VP-P (V+ = 12V)
1
10
100
60
OFF-ISOLATION (dB)
V+ = 12V
PHASE (°)
NORMALIZED GAIN (dB)
-3
40
50
60
70
80
80
90
100
100
600
110
1k
10k
100k
FREQUENCY (MHz)
FIGURE 13. FREQUENCY RESPONSE
10M
100M
500M
FIGURE 14. OFF-ISOLATION
TRANSISTOR COUNT:
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
1M
FREQUENCY (Hz)
ISL84514: 40
ISL84515: 40
PROCESS:
Si Gate CMOS
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All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6025 Rev 5.00
June 9, 2014
Page 10 of 12
ISL84514, ISL84515
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6025 Rev 5.00
June 9, 2014
Page 11 of 12
ISL84514, ISL84515
Package Outline Drawing
P5.064
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 3, 4/11
8°
0°
3.00 3
2.80
(1.90)
5
0.22
0.08 5
4
3.00
2.60
1.70
1.50
3
2
(0.95)
SEE DETAIL X
0.50
0.30
0.20 (0.008) M C
TOP VIEW
END VIEW
0.25
0.10
0.10 MIN
1.30
0.90
1.45 SEATING
0.90 PLANE
C
GAUGE PLANE
SEATING
PLANE
4
0.55
0.35
C
0.15
0.00
0.10 (0.004) C
(0.60)
SIDE VIEW
8°
0°
(0.25)
DETAIL "X"
5x (0.60)
5x (1.2)
5
4
(2.4)
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
3
2. Package conforms to EIAJ SC-74 and JEDEC MO178AA.
3. Package length and width are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength measured at reference to gauge plane.
5. Lead thickness applies to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
(2x 0.95)
6. Controlling dimension: MILLIMETER.
Dimensions in ( ) for reference only.
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
FN6025 Rev 5.00
June 9, 2014
Page 12 of 12