DATASHEET
ISL8485, ISL8490, ISL8491
FN6046
Rev 10.01
Oct 14, 2021
5V, Low Power, High Speed, RS-485/RS-422 Transceivers
The ISL8485, ISL8490, and ISL8491 RS-485/RS-422
devices are BiCMOS 5V powered, single transceivers that
meet both the RS-485 and RS-422 standards for balanced
communication. Unlike competitive devices, this family is
specified for 10% tolerance supplies (4.5V to 5.5V).
Features
• Specified for 10% tolerance supplies
• Class 3 ESD protection (HBM) on all pins: 7kV
• High data rates: up to 5Mbps
The ISL8485, ISL8490, and ISL8491 feature data rates up to
5Mbps.
• Single unit load allows up to 32 devices on the bus
All devices present a single unit load to the RS-485 bus,
which allows up to 32 transceivers on the network.
• -7V to +12V common-mode input voltage range
The receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output if the Rx inputs are
floating.
The driver (Tx) outputs are short-circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
The ISL8490 and ISL8491 are configured for full duplex
(separate Rx input and Tx output pins) applications. Half
duplex configurations (ISL8485) multiplex the Rx inputs and
Tx outputs to allow transceivers with Rx and Tx disable
functions in 8 Ld packages.
• Low quiescent current: 500µA
• Three state Rx and Tx outputs (except ISL8490)
• 30ns propagation delays, 5ns skew
• Full duplex and half duplex pinouts
• Operation from a single +5V supply (10% tolerance)
• Current limiting and thermal shutdown for driver overload
protection
• Pb-free plus anneal (RoHS compliant)
Applications
• Factory automation
• Security networks
• Building environmental control systems
• Industrial/process control networks
• Level translators (for example, RS-232 to RS-422)
• RS-232 “extension cords”
FN6046 Rev 10.01
Oct 14, 2021
Page 1 of 15
© 2003 Renesas Electronics
ISL8485, ISL8490, ISL8491
Typical Operating Circuits
ISL8485
5V
8
RPU
5V
100nF
VCC
100nF
RPU
VCC
RB
1 RO
8
RO 1
A/Y 6
6 A/Y
2 RE
RE 2
RT2
3 DE
VFS
RT1
B/Z 7
DE 3
7 B/Z
4 DI
DI 4
RB
GND
GND
5
5
ISL8490
5V
1
VCC
5V
100nF
100nF
A 8
2 RO
5 Y
1
VCC
DI
RT
B 7
6 Z
Z 6
7 B
3 DI
RO 2
RT
Y 5
3
8 A
GND
GND
4
4
ISL8491
5V
100nF
13,14
R PU
5V
VCC
RB
RB
A 12
100nF
9
Y
2
RO
3
RE
B 11
10 Z
4
DE
Z 10
11 B
5
DI
13,14
R PU
VCC
DI 5
RT
RT
Y
GND
6,7
9
DE
4
RE
3
RO
2
12 A
RB
RB
GND
6,7
To calculate the resistor values, refer to TB509.
FN6046 Rev 10.01
Oct 14, 2021
Page 2 of 15
ISL8485, ISL8490, ISL8491
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL NO. OF DEVICES
DUPLEX
ALLOWED ON BUS
DATA
RATE
(Mbps)
SLEW-RATE
LIMITED?
RECEIVER/
DRIVER
ENABLE?
QUIESCENT
ICC (µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL8485
Half
32
5
No
Yes
500
No
8
ISL8490
Full
32
5
No
No
500
No
8
ISL8491
Full
32
5
No
Yes
500
No
14
Ordering Information
PART NUMBER (Notes 2, 3)
ISL8485CBZ
ISL8485CBZ-T
PART MARKING
8485
CBZ
PACKAGE DESCRIPTION
(RoHS COMPLIANT)
8 Ld SOIC
PKG. DWG. #
M8.15
Carrier Type
(Note 1)
TEMP. RANGE
Tube
0 to +70°C
Reel, 2.5k
ISL8485CPZ (No longer available, ISL
8485CPZ
recommended replacement:
ISL8485ECBZ-T)
8 Ld PDIP (Note 4)
E8.3
Tube
ISL8485IBZ
8 Ld SOIC
M8.15
Tube
ISL8485IPZ (No longer available, ISL
8485IPZ
recommended replacement:
ISL8485EIBZ-T)
8 Ld PDIP (Note 4)
E8.3
ISL8490IBZ
8490
IBZ
8 Ld SOIC
M8.15
8491IBZ
14 Ld SOIC
ISL8485IBZ-T
ISL8490IBZ-T
ISL8491IBZ
8485
IBZ
-40 to +85°C
Reel, 2.5k
Tube
Tube
Reel, 2.5k
M14.15
Tube
NOTE:
1. See TB347 for details about reel specifications.
2. Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the ISL8485, ISL8490, and ISL8491 product information pages. For more information about MSL, see
TB363.
4. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications
FN6046 Rev 10.01
Oct 14, 2021
Page 3 of 15
ISL8485, ISL8490, ISL8491
Pinouts
ISL8485 (PDIP, SOIC)
TOP VIEW
RO 1
8
R
ISL8490 (SOIC)
TOP VIEW
VCC 1
VCC
R
ISL8491 (SOIC)
TOP VIEW
8
A
NC 1
14 VCC
RE 2
7
B/Z
RO 2
7
B
RO 2
DE 3
6
A/Y
DI 3
6
Z
RE 3
12 A
5
GND
5
Y
DE 4
11 B
D
DI 4
GND 4
D
DI 5
13 NC
R
D
10 Z
GND 6
9 Y
GND 7
8 NC
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO = high if A and B are unconnected (floating).
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs Y and Z are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
Noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1.
B/Z
Inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1.
A
Noninverting receiver input.
B
Inverting receiver input.
Y
Noninverting driver output.
Z
Inverting driver output.
VCC
System power supply input (4.5V to 5.5V).
NC
No connection.
Truth Tables
RECEIVING
TRANSMITTING
INPUTS
INPUTS
OUTPUTS
RE
DE
DI
Z
Y
X
1
1
0
1
X
1
0
1
0
0
0
X
High-Z
High-Z
FN6046 Rev 10.01
Oct 14, 2021
RE
OUTPUT
DE
DE
Half Duplex Full Duplex
A-B
RO
0
0
X
≥ +0.2V
1
0
0
X
≤ -0.2V
0
0
0
X
Inputs Open
1
1
1
1
X
High-Z
Page 4 of 15
ISL8485, ISL8490, ISL8491
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating
HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV
Thermal Resistance (Typical, Note 5)
JA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
140
8 Ld PDIP Package (Note 6) . . . . . . . . . . . . . . . . . .
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
120
Moisture Sensitivity (see TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile (SOIC only). . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range
ISL84XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL84XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stresses above those listed in Absolute Maximum Ratings can permanently damage the device. This is a stress only rating.Operation of the device at these
or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
5. JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details.
6. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
Electrical Specifications
TA = +25°C, Note 7
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
UNIT
Full
-
-
VCC
V
DC CHARACTERISTICS
Driver Differential VOUT (No Load)
VOD1
Driver Differential VOUT (with
Load)
VOD2
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
R = 50Ω (RS-422), Figure 1
Full
2
3
-
V
R = 27Ω (RS-485), Figure 1
Full
1.5
2.3
5
V
VOD
R = 27Ω or 50Ω, Figure 1
Full
-
0.01
0.2
V
VOC
R = 27Ω or 50Ω, Figure 1
Full
-
-
3
V
VOC
R = 27Ω or 50Ω, Figure 1
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DI (ISL8485, ISL8490, ISL8491)
Full
-2
-
2
µA
IIN1
DE, RE (ISL8485, ISL8491)
Full
-25
-
25
µA
IIN2
DE = 0V, VCC = 0V or
4.5 to 5.5V
VIN = 12V
Full
-
-
1
mA
VIN = -7V
Full
-
-
-0.8
mA
-7V ≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Input Current (A, B), Note 10
Receiver Differential Threshold
Voltage
VTH
Receiver Input Hysteresis
VTH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-
-
1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
12
-
-
kΩ
FN6046 Rev 10.01
Oct 14, 2021
Page 5 of 15
ISL8485, ISL8490, ISL8491
Electrical Specifications
TA = +25°C, Note 7 (Continued)
PARAMETER
No-Load Supply Current, Note 8
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,
TEMP
(°C)
MIN
TYP
MAX
UNIT
ISL8490, ISL8491, DE, DI, RE = 0V or VCC
Full
-
500
565
µA
ISL8485, DI, RE = 0V or DE = VCC
VCC
DE = 0V
Full
-
700
900
µA
Full
-
500
565
µA
SYMBOL
TEST CONDITIONS
ICC
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V ≤ VY or VZ ≤ 12V, Note 9
Full
35
-
250
mA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
7
-
85
mA
Full
18
30
50
ns
SWITCHING CHARACTERISTICS (ISL8485, ISL8490, ISL8491)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
tPLH, tPHL RDIFF = 54Ω, CL = 100pF, Figure 2
tSKEW
RDIFF = 54Ω, CL = 100pF, Figure 2
Full
-
2
10
ns
tR, tF
RDIFF = 54Ω, CL = 100pF, Figure 2
Full
3
11
25
ns
Driver Enable to Output High
tZH
CL = 100pF, SW = GND, Figure 3
Full
-
17
70
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC, Figure 3
Full
-
14
70
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND, Figure 3
Full
-
19
70
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, Figure 3
Full
-
13
70
ns
Full
30
40
150
ns
Figure 4
25
-
5
-
ns
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
tPLH, tPHL Figure 4
tSKD
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND, Figure 5
Full
-
9
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC, Figure 5
Full
-
9
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND, Figure 5
Full
-
9
50
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, Figure 5
Full
-
9
50
ns
Note 11
Full
5
-
-
Mbps
Maximum Data Rate
fMAX
NOTES:
7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
8. Supply current specification is valid for loaded drivers when DE = 0V.
9. Applies to peak current. See “Typical Performance Curves” on page 10 for more information.
10. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 unit loads on the bus.
11. Ensured by characterization, but not tested.
FN6046 Rev 10.01
Oct 14, 2021
Page 6 of 15
ISL8485, ISL8490, ISL8491
Test Circuits and Waveforms
R
VCC
DE
Z
DI
VOD
D
Y
VOC
R
FIGURE 1. DRIVER VOD AND VOC
3V
DI
1.5V
1.5V
0V
tPLH
VCC
CL = 100pF
DE
tPHL
VOH
50%
OUT (Y)
50%
VOL
Z
DI
RDIFF
D
Y
VOH
OUT (Z)
SIGNAL
GENERATOR
tPLH
tPHL
CL = 100pF
50%
50%
VOL
90%
DIFF OUT (Y - Z)
10%
tR
+VOD
90%
10%
-VOD
tF
SKEW = |tPLH (Y or Z) - tPHL (Z or Y)|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FN6046 Rev 10.01
Oct 14, 2021
Page 7 of 15
ISL8485, ISL8490, ISL8491
Test Circuits and Waveforms (Continued)
DE
Z
DI
500Ω
SIGNAL
GENERATOR
3V
VCC
D
SW
Y
DE
GND
1.5V
1.5V
0V
CL
OUTPUT HIGH
OUT (Y, Z)
PARAMETER OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
tZH
Y/Z
0
1/0
GND
100
tZL
Y/Z
0
0/1
VCC
100
tHZ
VOH - 0.5V VOH
2.3V
0V
tLZ
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCLUDING ISL8490)
RE
+1.5V
3V
15pF
B
R
A
A
1.5V
RO
1.5V
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. RECEIVER PROPAGATION DELAY
RE
B
R
SIGNAL
GENERATOR
1kΩ
RO
VCC
SW
A
GND
3V
RE
1.5V
1.5V
0V
15pF
OUTPUT HIGH
RO
PARAMETER
DE
AΩ
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH
0
+1.5V
GND
tZL
0
-1.5V
VCC
FIGURE 5A. TEST CIRCUIT
tHZ
VOH - 0.5V VOH
1.5V
0V
tLZ
VCC
RO
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES (EXCLUDING ISL8490)
FN6046 Rev 10.01
Oct 14, 2021
Page 8 of 15
ISL8485, ISL8490, ISL8491
Application Information
Data Rate, Cables, and Terminations
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a point-tomultipoint (multidrop) standard, which allows only one driver
and up to 10 receivers on each bus, assuming one unit load
devices. RS-485 is a true multipoint standard, which allows up
to 32 one unit load devices (any combination of drivers and
receivers) on each bus. To allow multipoint operation, the RS485 specification requires that drivers must handle bus
contention without sustaining any damage.
RS-485/RS-422 are intended for network lengths up to 4000ft,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 5Mbps are
limited to lengths less than 100ft.
An important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long
as 4000ft, so the wide CMR is necessary to handle ground
potential differences, as well as voltages induced in the cable
by external fields.
In point-to-point networks or point-to-multipoint (single driver
on bus) networks, terminate the main cable in its characteristic
impedance (typically 120Ω) at the end farthest from the driver.
In multi-receiver applications, stubs connecting receivers to the
main cable should be kept as short as possible. In multipoint
(multi-driver) systems, terminate the main cable in its
characteristic impedance at both ends. Keep stubs connecting
a transceiver to the main cable as short as possible.
Receiver Features
These devices use a differential input receiver for maximum
noise immunity and common-mode rejection. Input sensitivity is
200mV, as required by the RS-422 and RS-485 specifications.
Receiver input impedance surpasses the RS-422 specification
of 4kΩ, and meets the RS-485 unit load requirement of 12kΩ
minimum.
Receiver inputs function with common-mode voltages as great
as 7V outside the power supplies (+12V and -7V), making
them ideal for long networks in which induced voltages are a
realistic concern.
All the receivers include a “fail-safe if open” function that
ensures a high level receiver output if the receiver inputs are
unconnected (floating).
Receivers easily meet the data rates supported by the
corresponding driver.
The ISL8485 and ISL8491 receiver outputs are three-statable
using the active low RE input.
Twisted pair cable is the cable of choice for RS-485/422
networks. Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common-mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative to minimize reflections when
using the 5Mbps devices.
Built-In Driver Overload Protection
The RS-485 specification requires that drivers survive worst
case bus contentions undamaged. The ISL84XX devices meet
this requirement using driver output short circuit current limits
and on-chip thermal shutdown circuitry.
The driver output stages incorporate short-circuit current
limiting circuitry that ensures the output current never exceeds
the RS-485 specification, even at the common-mode voltage
range extremes. These devices also use a foldback circuit that
reduces the short-circuit current, and thus the power
dissipation, whenever the contending voltage exceeds either
supply.
In the event of a major short-circuit condition, the ISL84XX
devices’ thermal shutdown feature disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature drops
about 15°C. If the condition persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay
operational during thermal shutdown.
Driver Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at least
2V across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit width and to minimize
EMI.
The ISL8485 and ISL8491 drivers are three-statable using the
active high DE input.
The ISL8485 and ISL8491 driver outputs are not limited, so
faster output transition times allow data rates of at least
5Mbps.
FN6046 Rev 10.01
Oct 14, 2021
Page 9 of 15
ISL8485, ISL8490, ISL8491
Typical Performance Curves
VCC = 5V, TA = 25°C, ISL8485, ISL8490, ISL8491; unless otherwise specified
90
DIFFERENTIAL OUTPUT VOLTAGE (V)
3.6
DRIVER OUTPUT CURRENT (mA)
80
70
60
50
40
30
20
10
0
0
1
2
3
4
3.4
3.2
RDIFF = 100Ω
3
2.8
2.6
2.4
RDIFF = 54Ω
2.2
2
-40
5
700
140
ISL8485: DE = VCC, RE = X
650
120
Y OR Z = LOW
100
600
80
550
60
500
40
ICC (A)
OUTPUT CURRENT (mA)
85
75
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
160
20
0
-20
ISL8485: DE = GND, RE = X,
ISL8490/ISL8491:
DE =
RE
ISL8485, DE = GND,
RE
==
XX
450
400
350
Y OR Z = HIGH
-40
300
-60
250
-80
-100
200
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
150
-40
-25
0
50
25
75
85
TEMPERATURE (°C)
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 9. SUPPLY CURRENT vs TEMPERATURE
40
3
35
2.5
|tPHLY - tPLHZ|
tPHLY
30
tPHLZ
SKEW (ns)
PROPAGATION DELAY (ns)
50
25
TEMPERATURE (°C)
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
-120
0
-25
DIFFERENTIAL OUTPUT VOLTAGE (V)
tPLHZ
tPLHY
25
2
|tPLHY - tPHLZ|
1.5
|CROSSING PT. OF Y and Z - CROSSING PT. OF
Y and Z
20
-40
-25
0
25
50
TEMPERATURE (°C)
FIGURE 10. DRIVER PROPAGATION DELAY vs
TEMPERATURE
FN6046 Rev 10.01
Oct 14, 2021
75
85
1
-40
-25
0
50
25
75
TEMPERATURE (°C)
FIGURE 11. DRIVER SKEW vs TEMPERATURE
Page 10 of 15
85
ISL8485, ISL8490, ISL8491
0
5
RO
0
4
3
2
B/Z
A/Y
1
0
TIME (10ns/DIV)
FIGURE 12. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
RDIFF = 54Ω, CL = 100pF
DI
5
5
0
RO
0
4
3
A/Y
2
B/Z
1
0
TIME (10ns/DIV)
FIGURE 13. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate CMOS
FN6046 Rev 10.01
Oct 14, 2021
Page 11 of 15
DRIVER INPUT (V)
DI
5
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CL = 100pF
DRIVER INPUT (V)
VCC = 5V, TA = 25°C, ISL8485, ISL8490, ISL8491; unless otherwise specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
ISL8485, ISL8490, ISL8491
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit out website to make
sure that you have the latest revision.
DATE
REVISION
CHANGE
Oct 14, 2021
10.01
Fixed the formatting on Ordering table.
Removed Related Literature section.
Updated POD M8.15 to the latest version, changes are as follows:
-Added the coplanarity spec into the drawing.
Updated POD M14.15 to the latest version, changes are as follows:
-Added lead length dimension (1.27 – 0.40)
-Changed angle of the lead to 0-8 degrees.
Oct 18, 2018
10.00
Removed ISL8483, ISL8488, and ISL8489 information from the datasheet.
Updated Typical Operating Circuits on page 2.
Updated Features bullets on page 1.
Added Related Literature section to page 1.
Updated Ordering Information table on page 3:
-Added Tape and Reel column.
-Added information about replacements for the ISL8485CPZ and ISL8485IPZ.
Removed About Intersil section and updated Renesas disclaimer.
Feb 16, 2016
9.00
Added Rev History and About Intersil verbiage.
Updated “Ordering Information” table on page 3.
Updated following PODs to current revisions listing POD updates:
POD M8.15:
Updated to new POD format by removing table and moving dimensions
onto drawing and adding land pattern
Changed in Typical Recommended Land Pattern the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
Changed Note 1 "1982" to "1994
POD M14.15
Added land pattern and moved dimensions from table onto drawing
FN6046 Rev 10.01
Oct 14, 2021
Page 12 of 15
ISL8485, ISL8490, ISL8491
Package Outline Drawings
For the most recent package outline drawing, see E8.3.
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE (PDIP)
N
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
B
0.010 (0.25) M
C
L
eA
A1
eC
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
A
-
0.210
-
MAX
5.33
A1
0.015
-
0.39
A2
0.115
0.195
2.93
4.95
-
NOTES
4
4
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
D
0.355
0.400
9.01
D1
0.005
-
0.13
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
eB
-
L
0.115
N
0.430
0.150
8
0.355
10.16
-
2.54 BSC
7.62 BSC
2.93
8
5
5
6
10.92
7
3.81
4
9
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
FN6046 Rev 10.01
Oct 14, 2021
Page 13 of 15
ISL8485, ISL8490, ISL8491
For the most recent package outline drawing, see M8.15.
M8.15
8 Lead Narrow Body Small Outline Plastic Package
Rev 5, 4/2021
FN6046 Rev 10.01
Oct 14, 2021
Page 14 of 15
ISL8485, ISL8490, ISL8491
For the most recent package outline drawing, see M14.15.
M14.15
14 Lead Narrow Body Small Outline Plastic Package
Rev 2, 6/20
FN6046 Rev 10.01
Oct 14, 2021
Page 15 of 15
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INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
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(Rev.1.0 Mar 2020)
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