DATASHEET
ISL8499
Ultra Low ON-Resistance, +1.65V to +4.5V, Single Supply, Quad SPDT (Dual
DPDT) Analog Switch
The Intersil ISL8499 device is a low ON-Resistance, low
voltage, bidirectional, Quad SPDT (Dual DPDT) analog
switch designed to operate from a single +1.65V to +4.5V
supply. Targeted applications include battery powered
equipment that benefit from low rON (0.24 and fast
switching speeds (tON = 15ns, tOFF = 13ns). The digital logic
input is 1.8V logic-compatible when using a single +3V supply.
With a supply voltage of 4.2V and logic high voltage of 2.85V
at both logic inputs, the part draws only 10µA max of ICC
current.
Cell phones, for example, often face ASIC functionality
limitations. The number of analog input or GPIO pins may be
limited and digital geometries are not well suited to analog
switch performance. This part may be used to “mux-in”
additional functionality while reducing ASIC design risk. The
ISL8499 is offered in small form factor packages, alleviating
board space limitations.
The ISL8499 consists of four SPDT switches. It is configured
as a dual double-pole/double-throw (DPDT) device with two
logic control inputs that control two SPDT switches each. The
configuration can be used as a dual differential 2-to-1
multiplexer/demultiplexer. The ISL8499 is pin compatible with
the STG3699 and DG2799.
TABLE 1. FEATURES AT A GLANCE
-
ISL8499
Number of Switches
4
SW
Quad SPDT (Dual DPDT)
4.3V rON
0.24
4.3V tON/tOFF
15ns/13ns
3.0V rON
0.26
3.0V tON/tOFF
21ns/17ns
1.8V rON
0.45
1.8V tON/tOFF
51ns/43ns
Packages
16 Ld 3x3 TQFN, 16 Ld 3x3 QFN,
16 Ld TSSOP
FN6111
Rev 3.00
February 5, 2008
Features
• Drop in Replacement for the STG3699 and DG2799
• ON-Resistance (rON)
- V+ = +4.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.24
- V+ = +3.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.26
- V+ = +1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.45
• rON Matching between Channels . . . . . . . . . . . . . . . . .0.04
• rON Flatness Across Signal Range . . . . . . . . . . . . . . . .0.05
• Single Supply Operation. . . . . . . . . . . . . . . . +1.65V to +4.5V
• Low Power Consumption (PD). . . . . . . . . . . . . . . . . . 9kV
HBM NOX, NCX, INX, V+, GND . . . . . . . . . . . . . . . . . . . . . . .>4kV
MM COMX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>500V
MM NOX, NCX, INX, V+, GND . . . . . . . . . . . . . . . . . . . . . . .>300V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Thermal Resistance (Typical, Note 3)
JA (°C/W)
JC (°C/W)
TQFN and QFN Package (Notes 4, 5) .
70
10
TSSOP Package (Note 3) . . . . . . . . . .
150
N/A
Maximum Junction Temperature (Plastic Package). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range
ISL8499IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 4.3V Supply
PARAMETER
Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.6V, VINL = 0.5V (Note 6),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 7, 8)
TYP
MAX
(Notes 7, 8) UNITS
Full
0
-
V+
V
25
-
0.25
-
Full
-
0.28
-
25
-
0.04
-
Full
-
0.05
-
25
-
0.05
-
Full
-
0.05
-
25
-50
-
50
nA
Full
-150
-
150
nA
25
-50
-
50
nA
Full
-150
-
150
nA
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-Resistance, rON
V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+,
(See Figure 5)
rON Matching Between Channels,
rON
V+ = 3.9V, ICOM = 100mA, VNO or VNC = Voltage at
max rON,(Note 11)
rON Flatness, RFLAT(ON)
V+ = 3.9V, ICOM = 100mA, VNO or VNC = 0V to V+,
(Note 9)
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 4.5V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V
COM ON Leakage Current,
ICOM(ON)
V = 4.5V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V,
3V, or Floating
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
V+ = 3.9V, VNO or VNC = 3.0V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
15
25
ns
Full
-
-
30
ns
V+ = 3.9V, VNO or VNC = 3.0V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
13
23
ns
Full
-
-
28
ns
Break-Before-Make Time Delay, tD
V+ = 4.5V, VNO or VNC = 3.0V, RL = 50,
CL = 35pF, (See Figure 3, Note 10)
Full
2
3
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0See Figure 2)
25
-
-120
-
pC
OFF Isolation
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 4)
25
-
68
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 6)
25
-
-98
-
dB
FN6111 Rev 3.00
February 5, 2008
Page 3 of 14
ISL8499
Electrical Specifications - 4.3V Supply
PARAMETER
Total Harmonic Distortion
Test Conditions: V+ = +3.9V to +4.5V, GND = 0V, VINH = 1.6V, VINL = 0.5V (Note 6),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
MIN
(Notes 7, 8)
TYP
MAX
(Notes 7, 8) UNITS
25
-
0.003
-
%
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
106
-
pF
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
212
-
pF
Full
1.65
-
4.5
V
25
-
-
0.09
A
Full
-
-
1.4
A
25
-
-
12
A
Input Voltage Low, VINL
Full
-
-
0.5
V
Input Voltage High, VINH
Full
1.6
-
-
V
Full
-0.5
-
0.5
A
COM ON Capacitance, CCOM(ON)
f = 20Hz to 20kHz, VCOM = 2VPP, RL = 600
TEMP
(°C)
POWER SUPPLY CHARACTERISTICS
Power Supply Range
Positive Supply Current, I+
Positive Supply Current, I+
V+ = +4.5V, VIN = 0V or V+
V+ = +4.2V, VIN = 2.85V
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
V+ = 4.5V, VIN = 0V or V+, (Note 10)
NOTES:
6. VIN = input voltage to perform proper function.
7. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
8. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
9. Flatness is defined as the difference between maximum and minimum value of ON-Resistance over the specified analog signal range.
10. Limits established by characterization and are not production tested.
11. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON
value, between NC1 and NC2, NC3 and NC4 or between NO1 and NO2, NO3 and NO4.
Electrical Specifications - 3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 6),
Unless Otherwise Specified
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 7, 8)
TYP
MAX
(Notes 7, 8) UNITS
Full
0
-
V+
V
25
-
0.3
0.45
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-Resistance, rON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+,
(See Figure 5)
rON Matching Between Channels,
rON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at
max rON, (Note 11)
rON Flatness, rFLAT(ON)
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+,
(Note 9)
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 3.3V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V
COM ON Leakage Current,
ICOM(ON)
V = 3.3V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V,
3V, or Floating
Full
-
-
0.6
25
-
0.04
0.08
Full
-
-
0.09
25
-
0.06
0.15
Full
-
-
0.15
25
-
1.2
-
nA
Full
-
13
-
nA
25
-
1
-
nA
Full
-
35
-
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
Break-Before-Make Time Delay, tD
FN6111 Rev 3.00
February 5, 2008
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
21
30
ns
Full
-
-
35
ns
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
17
27
ns
Full
-
-
32
ns
Full
2
3
-
ns
V+ = 3.3V, VNO or VNC = 1.5V, RL = 50,
CL = 35pF, (See Figure 3, Note 10)
Page 4 of 14
ISL8499
Electrical Specifications - 3V Supply
PARAMETER
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Note 6),
Unless Otherwise Specified (Continued)
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 7, 8)
TYP
MAX
(Notes 7, 8) UNITS
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2)
25
-
-82
-
pC
OFF Isolation
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 4)
25
-
68
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 6)
25
-
-98
-
dB
Total Harmonic Distortion
f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 600
25
-
0.003
-
%
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
106
-
pF
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
212
-
pF
25
-
0.025
-
A
Full
-
0.715
-
A
Input Voltage Low, VINL
Full
-
-
0.5
V
Input Voltage High, VINH
Full
1.4
-
-
V
Full
-0.5
-
0.5
A
COM ON Capacitance, CCOM(ON)
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+
V+ = 3.6V, VIN = 0V or V+
DIGITAL INPUT CHARACTERISTICS
Input Current, IINH, IINL
V+ = 3.6V, VIN = 0V or V+ (Note 10)
Electrical Specifications - 1.8V Supply
PARAMETER
Test Conditions: V+ = +1.65V to +2V, GND = 0V, VINH = 1.0V, VINL = 0.4V (Note 6), Unless
Otherwise Specified
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 7, 8)
TYP
MAX
(Notes 7, 8) UNITS
Full
0
-
V+
V
25
-
0.45
0.8
Full
-
-
0.85
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
ON-Resistance, rON
V+ = 1.8V, ICOM = 100mA, VNO or VNC = 0V to V+,
(See Figure 5)
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
Turn-OFF Time, tOFF
V+ = 1.65V, VNO or VNC = 1.0V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
51
65
ns
Full
-
-
70
ns
V+ = 1.65V, VNO or VNC = 1.0V, RL = 50,
CL = 35pF, (See Figure 1, Note 10)
25
-
43
58
ns
Full
-
-
65
ns
Break-Before-Make Time Delay, tD
V+ = 2.0V, VNO or VNC = 1.0V, RL = 50,
CL = 35pF, (See Figure 3, Note 10)
Full
3
8
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, See Figure 2
25
-
-44
-
pC
OFF Isolation
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 4)
25
-
68
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 6)
25
-
-98
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
106
-
pF
f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7)
25
-
212
-
pF
Full
-
-
0.4
V
COM ON Capacitance, CCOM(ON)
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, VINL
Input Voltage High, VINH
Input Current, IINH, IINL
FN6111 Rev 3.00
February 5, 2008
V+ = 2.0V, VIN = 0V or V+ (Note 10)
Full
1.0
-
-
V
Full
-0.5
-
0.5
A
Page 5 of 14
ISL8499
Test Circuits and Waveforms
V+
LOGIC
INPUT
V+
tr < 5ns
tf < 5ns
50%
0V
tOFF
SWITCH
INPUT VNO
SWITCH
INPUT
VOUT
VOUT
NO or NC
COM
IN
90%
SWITCH
OUTPUT
C
90%
LOGIC
INPUT
0V
CL
35pF
RL
50
GND
tON
Logic input waveform is inverted for switches that have the opposite
logic sense.
Repeat test for all switches. CL includes fixture and stray
capacitance.
RL
V OUT = V (NO or NC) ---------------------------R L + r ON
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
V+
SWITCH
OUTPUT
VOUT
RG
VOUT
V+
LOGIC
INPUT
ON
ON
OFF
C
VG
VOUT
COM
NO or NC
GND
IN
CL
0V
LOGIC
INPUT
Q = VOUT x CL
FIGURE 2B. TEST CIRCUIT
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2. CHARGE INJECTION
V+
V+
LOGIC
INPUT
VNX
C
NO
VOUT
COM
NC
0V
RL
50
IN
SWITCH
OUTPUT
VOUT
90%
0V
LOGIC
INPUT
CL
35pF
GND
tD
CL includes fixture and stray capacitance.
FIGURE 3A. MEASUREMENT POINTS
FIGURE 3B. TEST CIRCUIT
FIGURE 3. BREAK-BEFORE-MAKE TIME
FN6111 Rev 3.00
February 5, 2008
Page 6 of 14
ISL8499
Test Circuits and Waveforms (Continued)
V+
V+
C
C
rON = V1/100mA
SIGNAL
GENERATOR
NO or NC
NO or NC
VNX
IN
0V or V+
100mA
0V or V+
COM
COM
ANALYZER
IN
V1
GND
GND
RL
FIGURE 5. rON TEST CIRCUIT
FIGURE 4. OFF ISOLATION TEST CIRCUIT
V+
C
V+
C
SIGNAL
GENERATOR
NO or NC
COM
50
NO or NC
IN1
IN
0V or V+
COM
ANALYZER
0V or V+
IMPEDANCE
ANALYZER
NC or NO
GND
N.C.
COM
GND
RL
FIGURE 6. CROSSTALK TEST CIRCUIT
Detailed Description
The ISL8499 is a bidirectional, quad single pole/double throw
(SPDT) analog switch that offers precise switching capability
from a single 1.65V to 4.5V supply with low on-resistance
(0.24) and high speed operation (tON = 15ns, tOFF = 13ns).
The device is especially well suited for portable battery
powered equipment due to its low operating supply voltage
(1.65V), low power consumption (2.7µW max), low leakage
currents (150nA max), and the tiny TQFN, QFN and TSSOP
packages. The ultra low ON-Resistance and rON flatness
provide very low insertion loss and distortion to applications that
require signal reproduction.
Supply Sequencing and Overvoltage Protection
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and to GND (see
FN6111 Rev 3.00
February 5, 2008
FIGURE 7. CAPACITANCE TEST CIRCUIT
Figure 8). To prevent forward biasing these diodes, V+ must be
applied before any input signals, and the input signal voltages
must remain between V+ and GND. If these conditions cannot
be guaranteed, then one of the following two protection
methods should be employed.
Logic inputs can easily be protected by adding a 1k resistor
in series with the input (see Figure 8). The resistor limits the
input current below the threshold that produces permanent
damage, and the sub-microamp input current produces an
insignificant voltage drop during normal operation.
This method is not acceptable for the signal path inputs.
Adding a series resistor to the switch input defeats the purpose
of using a low rON switch, so two small signal diodes can be
added in series with the supply pins to provide overvoltage
protection for all pins (see Figure 8). These additional diodes
limit the analog signal from 1V below V+ to 1V above GND.
The low leakage current performance is unaffected by this
Page 7 of 14
ISL8499
approach, but the switch signal range is reduced and the
resistance may increase, especially at low supply voltages.
operating with a 4.2V supply the device draws only 6A of
current (see Figure 21 for VIN = 2.85V).
High-Frequency Performance
OPTIONAL PROTECTION
DIODE
V+
OPTIONAL
PROTECTION
RESISTOR
INX
VNO or NC
VCOM
GND
OPTIONAL PROTECTION
DIODE
FIGURE 8. OVERVOLTAGE PROTECTION
Power-Supply Considerations
The ISL8499 construction is typical of most single supply
CMOS analog switches, in that they have two supply pins: V+
and GND. V+ and GND drive the internal CMOS switches and
set their analog voltage limits. Unlike switches with a 4V
maximum supply voltage, the ISL8499 4.7V maximum supply
voltage provides plenty of room for the 10% tolerance of 4.3V
supplies, as well as room for overshoot and noise spikes.
The minimum recommended supply voltage is 1.65V but will
operate with a supply voltage below 1.5V. It is important to note
that the input signal range, switching times, and on-resistance
degrade at lower supply voltages. Refer to the “Electrical
Specification” tables starting on page 3 and “Typical
Performance” curves starting on page 6 for details.
V+ and GND also power the internal logic and level shiftiers.
The level shiftiers convert the input logic levels to switched V+
and GND signals to drive the analog switch gate terminals.
In 50 systems, the signal response is reasonably flat even
past 30MHz with a -3dB bandwidth of 104MHz (see Figure 17).
The frequency response is very consistent over a wide V+
range, and for varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output. Off Isolation is
the resistance to this feedthrough, while Crosstalk indicates the
amount of feedthrough from one switch to another. Figure 18
details the high Off Isolation and Crosstalk rejection provided
by this part. At 100kHz, Off Isolation is about 68dB in 50
systems, decreasing approximately 20dB per decade as
frequency increases. Higher load impedances decrease Off
Isolation and Crosstalk rejection due to the voltage divider
action of the switch OFF impedance and the load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected between
each analog-signal pin and both V+ and GND. One of these
diodes conducts if any analog signal exceeds V+ or GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced, they
are reverse biased differently. Each is biased by either V+ or
GND and the analog signal. This means their leakages will
vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch terminal. This is why both sides of a given switch
can show leakage currents of the same or opposite polarity.
There is no connection between the analog signal paths and
V+ or GND.
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes negative
in this configuration.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and 1.4V)
over a supply range of 2.7V to 4.5V (see Figure 14). At 2.7V
the VIL level is about 0.52V. This is still above the 1.8V CMOS
guaranteed low output maximum level of 0.5V, but noise
margin is reduced.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving the
digital input signals from GND to V+ with a fast transition time
minimizes power dissipation. The ISL8499 has been designed
to minimize the supply current whenever the digital input
voltage is not driven to the supply rails (0V to V+). For example
driving the device with 2.85V logic (0V to 2.85V) while
FN6111 Rev 3.00
February 5, 2008
Page 8 of 14
ISL8499
Typical Performance Curves TA = +25°C, Unless Otherwise Specified
0.45
0.28
V+ = 4.3V
ICOM = 100mA
ICOM = 100mA
0.26
0.40
V+ = 1.8V
0.24
rON ()
rON ()
0.35
0.30
V+ = 2.7V
0.25
+85°C
0.22
0.2
+25°C
0.18
V+ = 3V
0.20
V+ = 4.3V
0.16
V+ = 3.6V
0.15
0
1
2
-40°C
3
4
0.14
5
0
1
2
3
4
5
VCOM (V)
VCOM (V)
FIGURE 10. ON-RESISTANCE vs SWITCH VOLTAGE
FIGURE 9. ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
0.50
0.35
V+ = 2.7V
ICOM = 100mA
V+ = 1.8V
ICOM = 100mA
0.45
+85°C
0.30
0.40
rON ()
rON ()
+85°C
0.25
+25°C
0.35
0.30
0.20
+25°C
-40°C
-40°C
0.25
0.15
0
0.5
1.0
1.5
2.0
2.5
0.20
3.0
0
0.5
1.0
VCOM (V)
1.5
2.0
VCOM (V)
FIGURE 11. ON-RESISTANCE vs SWITCH VOLTAGE
FIGURE 12. ON-RESISTANCE vs SWITCH VOLTAGE
1.1
50
1.0
0.9
0
VINH
VINH AND VINL (V)
Q (pC)
V+ = 1.8V
V+ = 3V
-50
-100
0.8
0.7
VINL
0.6
0.5
0.4
-150
0
0.5
1.0
1.5
2.0
2.5
VCOM (V)
FIGURE 13. CHARGE INJECTION vs SWITCH VOLTAGE
FN6111 Rev 3.00
February 5, 2008
3.0
0.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
V+ (V)
FIGURE 14. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
Page 9 of 14
ISL8499
200
200
150
150
100
tOFF (ns)
tON (ns)
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
+85°C
+25°C
100
+85°C
+25°C
-40°C
50
50
1
1.5
2.0
2.5
3.0
V+ (V)
3.5
4.0
0
4.5
GAIN
-20
0
PHASE
20
60
80
RL = 50
VIN = 0.2VP-P to 2VP-P
PHASE (°)
40
3.0
3.5
4.0
4.5
10
V+ = 3V
-20
20
-30
30
-40
40
-50
50
-60
60
ISOLATION
-70
70
-80
80
CROSSTALK
-90
90
-100
100
10M
100M
FREQUENCY (Hz)
CROSSTALK (dB)
NORMALIZED GAIN (dB)
-10
100
-110
1k
600M
FIGURE 17. FREQUENCY RESPONSE
10k
100k
1M
10M
FREQUENCY (Hz)
110
100M 500M
FIGURE 18. CROSSTALK AND OFF ISOLATION
100
50
V+ = 4.5V
V+ = 4.5V
VCOM = 0.3V
50
0
0
IOFF (nA)
ION (nA)
2.5
FIGURE 16. TURN - OFF TIME vs SUPPLY VOLTAGE
V+ = 3V
1M
2.0
V+ (V)
FIGURE 15. TURN - ON TIME vs SUPPLY VOLTAGE
0
1.5
1
OFF ISOLATION (dB)
0
-40°C
+25°C
-50
+25°C
-50
+85°C
-100
+85°C
-100
0
1
2
3
VCOM/NX (V)
4
FIGURE 19. ON LEAKAGE vs SWITCH VOLTAGE
FN6111 Rev 3.00
February 5, 2008
5
-150
0
1
2
3
4
VNX (V)
FIGURE 20. OFF LEAKAGE vs SWITCH VOLTAGE
Page 10 of 14
5
ISL8499
Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued)
200
V+ = 4.2V
Sweeping Both Logic Inputs
ION (A)
150
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND (QFN Paddle Connection: To Ground or Float)
TRANSISTOR COUNT:
228
100
PROCESS:
Si Gate CMOS
50
0
1
2
3
4
5
VIN1-4 (V)
FIGURE 21. SUPPLY CURRENT vs VLOGIC
© Copyright Intersil Americas LLC 2005-2008. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6111 Rev 3.00
February 5, 2008
Page 11 of 14
ISL8499
Thin Shrink Small Outline Plastic Packages (TSSOP)
M16.173
N
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
B M
0.05(0.002)
-A-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.043
-
1.10
-
A1
3
L
A
D
-C-
e
A1
b
0.10(0.004) M
0.25
0.010
SEATING PLANE
c
0.10(0.004)
C A M
0.05
0.15
-
A2
0.033
0.037
0.85
0.95
-
b
0.0075
0.012
0.19
0.30
9
c
0.0035
0.008
0.09
0.20
-
B S
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
0.002
0.006
D
0.193
0.201
4.90
5.10
3
E1
0.169
0.177
4.30
4.50
4
e
A2
MILLIMETERS
0.026 BSC
E
0.246
L
0.020
N
a
0.65 BSC
0.256
6.25
0.028
0.50
16
0o
-
0.70
6
16
8o
0o
-
6.50
7
8o
Rev. 1 2/02
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm
(0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact. (Angles in degrees)
FN6111 Rev 3.00
February 5, 2008
Page 12 of 14
ISL8499
Package Outline Drawing
L16.3x3
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 4/07
4X 1.5
3.00
12X 0.50
A
B
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
13
1
3.00
12
1 .50 ± 0 . 15
9
4
0.15
(4X)
5
8
0.10 M C A B
+ 0.07
4 16X 0.23 - 0.05
TOP VIEW
16X 0.40 ± 0.10
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 90 ± 0.1
C
BASE PLANE
( 2. 80 TYP )
(
SEATING PLANE
0.08 C
1. 50 )
SIDE VIEW
( 12X 0 . 5 )
( 16X 0 . 23 )
C
( 16X 0 . 60)
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
FN6111 Rev 3.00
February 5, 2008
Page 13 of 14
ISL8499
Thin Quad Flat No-Lead Plastic Package (TQFN)
Thin Micro Lead Frame Plastic Package (TMLFP)
2X
L16.3x3A
0.15 C A
D
A
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
9
D/2
MILLIMETERS
D1
D1/2
2X
N
6
INDEX
AREA
0.15 C B
1
2
3
E1/2
E/2
E1
MAX
NOTES
0.75
0.80
-
A1
-
-
0.05
-
A2
-
-
0.80
9
0.30
5, 8
0.20 REF
0.18
D
B
TOP VIEW
A2
A
D2
/ / 0.10 C
0
C
A3
SIDE VIEW
9
5
NX b
4X P
E
3.00 BSC
-
2.75 BSC
9
1.35
7, 8, 10
-
k
0.20
-
-
-
L
0.30
0.40
0.50
8
8
Nd
4
3
Ne
4
3
1
2
3
6
INDEX
AREA
E2/2
NX L
N e
9
12
9
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
A1
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
5
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
SECTION "C-C"
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
C
L
L
e
0.60
-
2. N is the number of terminals.
NX b
10
-
-
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
8
BOTTOM VIEW
C
L
-
NOTES:
9
CORNER
OPTION 4X
(Nd-1)Xe
REF.
P
Rev. 0 6/04
(Ne-1)Xe
REF.
E2
7
FN6111 Rev 3.00
February 5, 2008
1.65
NX k
D2
2 N
FOR ODD TERMINAL/SIDE
1.50
0.50 BSC
2
(DATUM A)
C C
7, 8, 10
16
7
L1
9
1.65
N
4X P
8
1.50
0.10 M C A B
D2
(DATUM B)
A1
-
2.75 BSC
1.35
e
SEATING PLANE
9
E1
E2
0.08 C
0.23
3.00 BSC
D1
0.15 C B
4X
NOMINAL
0.70
b
9
0.15 C A
MIN
A
A3
E
2X
2X
SYMBOL
L1
10
L
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
9. Features and dimensions A2, A3, D1, E1, P & are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220WEED-2 Issue C, except for the E2
and D2 MAX dimension.
Page 14 of 14