M37641F8E8-XXXFP

7641 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER REJ03B0191-0400 Rev.4.00 Aug 28, 2006 DESCRIPTION The 7641 group is the 8-bit microcomputer based on the 7600 series core (740 family core compatible) technology. The 7641 group is designed for PC peripheral devices, including the USB, DMAC, Serial I/O, UART, Timer, Master CPU bus interface and so on. q Power source voltage At 24 MHz oscillation frequency, φ = 12 MHz ......... 4.15 to 5.25 V At 24 MHz oscillation frequency, φ = 6 MHz ........... 3.00 to 3.60 V q Program/Erase voltage .................................. VCC = 4.50 V to 5.25 V, or 3.00 V to 3.60 V .................................................................. VPP = 4.50 V to 5.25 V At 24 MHz oscillation frequency, φ = 6 MHz (See Table 25.) q Memory size Flash ROM .................................................................... 32 Kbytes RAM ............................................................................. 2.5 Kbytes qFlash memory mode ....................................................... 3 modes Parallel I/O mode Standard serial I/O mode CPU rewrite mode q Programming method ....................... Programming in unit of byte q Erasing method Batch erasing Block erasing q Program/Erase control by software command qCommand number ................................................... 6 commands q Number of times for programming/erasing ............................. 100 qROM code protection Available in parallel I/O mode and standard serial I/O mode q Operating temperature range (at programming/erasing) .............. ...................................................................... Normal temperature FEATURES (a half of IN FIFO), this condition never occurs. When IN_PKT_RDY = “1” and TX_NOT_EPT = “1”, IN FIFO holds two packets in double buffer mode and one packet in single packet mode. In single packet mode, when the IN_PKT_RDY bit is set to “1” by software, the TX_NOT_EPT flag is set to “1” as well. During double buffer mode, if you want to load two packets sequentially, you must set the IN_PKT_RDY bit to “1” each time a packet is loaded. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 44 of 135 7641 Group USB Reception Endpoint 0 to Endpoint 4 have OUT (receive) FIFOs individually. Each endpoint’s FIFO is configured in following way: Endpoint 0: 16-byte Endpoint 1: Mode 0: 800-byte Mode 1: 1024-byte Mode 2: 2048-byte Mode 3: 0-byte Mode 4: 1280-byte Mode 5: 1168-byte Endpoint 2: Mode 0: 32-byte Mode 1: 128-byte Endpoint 3: 16-byte Endpoint 4: 16-byte When Endpoint 1 or Endpoint 2 is used for data receive, the OUT FIFO size can be selected. Endpoint 1 and Endpoint 2 have programmable IN-FIFOs size; 6 modes for Endpoint 1, and 2 modes for Endpoint 2. Each mode can be selected by the USB endpoint FIFO mode selection register (address 005F16). Data transmitted from the host-PC is stored in Endpoint x FIFO (006016 to 006416). Every time the data is stored in the FIFO, the internal OUT FIFO write pointer is increased by 1. When one complete data packet is stored, the OUT_PKT_RDY flag is set to “1” and the number of received data packets is stored in USB Endpoint x OUT write count registers (Low and High). When the AUTO_CLR bit is “1” and the received data is read out from the OUT FIFO, the OUT_PKT_RDY flag is cleared to “0”. When the AUTO_CLR bit is “1”, the OUT_PKT_RDY flag will not be cleared automatically by the FIFO read; it must be cleared by software. (The AUTO-CLR bit function is not applicable in Endpoint 0.) When MAXP size ≤ (a half of OUT FIFO size), the OUT_FIFO can receive 2 packets (double buffer). At this time, the OUT_ FIFO status can be checked by the OUT_PKT_RDY flag. When the FIFO holds two packets and one packet is read from the FIFO, the OUT_PKT_RDY flag is not cleared even if it is set to “0”. (The flag returns from “0” to “1” in one φ cycle after the read-out). During double buffer mode, the USB Endpoint x OUT write count registers (Low and High) holds the number of previously received packets. This count register is updated after reading out one of packets in the OUT FIFO and clearing the OUT_PKT_RDY flag to “0”. TOGGLE Initialization In order to initialize the data toggle sequence bit of the endpoint, in other words, resetting the next data packet to DATA0; set the ISO/TOGGLE_INT bit to “1” and then clear back to “0”. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 45 of 135 7641 Group USB Interrupts The USB FCU has two interrupts, USB Function Interrupt and USB SOF (Start Of Frame) Interrupt. qUSB Function Interrupt (USBF-INT) The USBF-INT is usable for the USB data flow control and power management. The USBF-INT request occurs at data transmit/receive completion, overrun/underrun, reset, or receiving suspend/ resume signal. To enable this interrupt, the USB function interrupt enable bit in the interrupt control register A (address 000516) and the respective bit in the USB interrupt enable registers 1 and 2 (addresses 0005416 and 0005516) must be set to “1”. When setting bit 7 in USB interrupt enable register 2 to “1”, the suspend interrupt and the resume interrupt are enabled. Endpoint x (x = 0 to 4) IN interrupt request occurs when the USB Endpoint x IN interrupt status flag (INTST 0, 2, 4, 6, 8) of USB interrupt status registers 1 and 2 (addresses 005216 and 005316) is “1”. The USB Endpoint x IN interrupt status flag is set to “1” when the respective endpoint IN_PKT_RDY bit is “1”. Endpoint x (x = 0 to 4) OUT interrupt request occurs when the USB endpoint x OUT interrupt status flag (INTST3, 5, 7, 9) in USB interrupt status registers 1 and 2 is set to “1”. The USB Endpoint x OUT interrupt status flag is set to “1” when the respective endpoint OUT_PKT_RDY flag is “1”. The overrun/underrun interrupt request occurs when the USB overrun/underrun interrupt status flag (INTST12) in USB interrupt status register 2 is set to “1”. This flag is set to “1” when the FIFO data overruns or underruns in isochronous transfer mode. The USB reset interrupt request occurs when the USB reset interrupt status flag (INTST13) in USB interrupt status register 2 is set to “1”. This flag is set when the SE0 is detected on the D+/D- line for at least 2.5 µs. When this situation happens, all USB internal registers (addresses 005016 to 005F16), except this flag, are initialized to the default state at reset. The USB reset interrupt is always enabled. The suspend/resume interrupt request occurs when either the USB resume signal interrupt status flag (INTST14) or the USB suspend signal interrupt status flag (INTST15) in USB interrupt status register 2 is set to “1”. The bits in both interrupt status registers 1 and 2 can be cleared by writing “1” to each bit. qUSB SOF interrupt The USB SOF interrupt is usable in isochronous transfers. This interrupt request occurs when an SOF packet is received. To enable a USB SOF interrupt, set the USB SOF interrupt enable bit of interrupt control register A to “1”. Suspend/Resume Functions If no bus activity is detected on the D+/D- line for at least 3 ms, the USB suspend signal detect flag (SUSPEND) of the USB power control register (address 005116) and the USB suspend signal interrupt status flag of USB interrupt status register 2 are set to “1” and the suspend interrupt request occurs. The following procedure must be executed after pushing the internal registers (A, X, Y ) to memories during the suspend interrupt process routine. (1) Clear all bits of USB interrupt status register 1 (address 005216) and USB interrupt status register 2 (address 005316) to “0”. (2) Set the USB clock enable bit to “0”. (After disabling the USB clock, do not write to any of the USB internal registers (addresses 005016 to 006416), except for the USB control register (address 001316), clock control register (address 001F16), and frequency synthesizer control register (address 006C16). (3) Set the frequency synthesizer enable bit to “0”. (4) Set the USB line driver current control bit to “1”. (Always keep the USB line driver current control bit set to “0” during USB function operations. When operating at Vcc = 3.3 V, this bit does not need to be set.) (5) Keep total drive current at 500 µA or less. (6) Disable the timer 1 interrupt. (7) Disable the timer 2 interrupt. (Disable all the other external interrupts.) (8) Set the timer 1 interrupt request bit to “0”. (9) Set the timer 2 interrupt request bit to “0”. (10) Set the interrupt disable flag (I) to “0”. (11) Execute the STP instruction. At this point, the MCU will be in stop mode (suspend mode). Before executing the STP instruction, make sure to set the USB function interrupt request bit (bit 0 at address 000216) to “0” and the USB function interrupt enable bit (bit 0 at address 000516) to “1”. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 46 of 135 7641 Group The USB suspend detect signal flag goes to “0” when the USB resume signal detect flag (RESUME) is set to “1”. During suspend mode, if the clock operation is started up with a process (remote wake-up) other than the resume interrupt process (for example; reset or timer), make sure to clear the USB suspend detect signal flag to “0” when you set the USB remote wake-up bit to “1”. When the USB FCU is in suspend mode and detects a non-idle signal on the D+/D- line, the USB resume detect flag and the USB resume signal interrupt status flag both go to “1” and a resume interrupt request occurs. At this point, pull the internal registers (A, X, Y) in this interrupt process routine. Take the following procedure in the USB resume interrupt process. (1) Set the USB line driver current control bit to “0”. (When operating at Vcc = 3.3 V, this bit does not need to be set.) (2) Set the frequency synthesizer enable bit to “1” and set a 2 ms to 5 ms wait. (3) Check the frequency synthesizer lock status bit. If “0”, it must be checked again after a 0.1 ms wait. (4) Enable the USB clock. Set the USB resume signal interrupt status flag to “0” after the wake-up sequence process. The USB resume detect flag goes to “0” at the same time. When the clock operation is started up with a remote wake-up, set the USB remote wake-up bit to “1” after the wake-up sequence process. (keep it set to “1” for a minimum of 10 ms and maximum of 15 ms). By doing this, the MCU will send a resume signal to the host CPU and let it know that the suspend state has been released. After that, set the USB remote wake-up bit and the USB suspend detection flag to “0”, because the USB suspend detection flag is not automatically cleared to “0” with a remote wake-up. [USB Control Register] USBC When using the USB function, the USB enable bit must be set to “1”. The USB line driver supply bit must be set to “0” (DC-DC converter is disabled) when operating at Vcc = 3.3V. In this condition, the setting of the USB line driver current control bit has no effect on USB operations. When the USB artificial SOF enable bit is set to “ 1 ” , the MCU judges that a SOF packet is received within 250 ns from a frame starting if an SOF packet is destroyed owing to some cause. b7 b0 0 USB control register (address 001316) USBC Reserved bit (“0” at read/write) USB default state selection bit (USBC1) 0: In default state after power-on/reset 1: In default state after USB reset signal received USB artificial SOF enable bit (USBC2) 0: Artificial SOF disabled 1: Artificial SOF enabled USB line driver current control bit (USBC3) 0: High current mode 1: Low current mode USB line driver supply enable bit (USBC4) (Note 1) 0: Line driver disabled 1: Line driver enabled USB clock enable bit (USBC5) 0: 48 MHz clock to the USB block disabled 1: 48 MHz clock to the USB block enabled USB SOF port select bit (USBC6) 0: SOF output disabled 1: SOF output enabled USB enable bit (USBC7) 0: USB block disabled (Note 2) 1: USB block enabled Notes 1: When using the MCU in Vcc = 3.3 V, set this bit to “0” and disable the built-in DC-DC converter 2: Setting this bit to 0” causes the contents of all USB registers to have the values at reset. Fig. 37 Structure of USB control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 47 of 135 7641 Group [USB Address Register] USBA The USB address register maintains the USB function control unit address assigned by the host computer. When receiving the SET_ADDRESS, keep it in this register. The values of this register are “0” when the device is not yet configured. The values of this register are also set to “0” when the USB block is disabled (bit 7 of USB control register is set to “ 0 ” ). In addition, no matter what value is written to this register, it will have no effect on the set value. b7 b0 0 USB address register (address 005016) USBA Programmable function address (FUNAD0 to 6)) This register maintains the 7-bit USB function control unit address assigned by the host CPU. Reserved bit (“0” at read/write) Fig. 38 Structure of USB address register [USB Power Management Register] USBPM The USB power management register is used for power management in the USB FCU. This register needs to be set only when using the remote wake-up to resume the MCU from suspend mode. b7 b0 00000 USB power management register (address 005116) USBPM USB suspend detection flag (SUSPEND) (Read only) 0: No USB suspend detected 1: USB suspend detected USB resume detection flag (RESUME) (Read only) 0: No USB resume signa detected 1: USB resume signal detected USB remote wake-up bit (WAKEUP) 0: End of remote resume signal 1: Transmitting of remote resume signal (only when SUSPEND = “1”) Reserved bit (“0” at read/write) Fig. 39 Structure of USB power management register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 48 of 135 7641 Group [USB Interrupt Status Registers 1 and 2] USBIS1, USBIS2 The USB interrupt status registers are used to indicate the condition that caused a USB function interrupt to be generated. Each status flag and bit can be cleared to “0” by writing “1” to the corresponding bit. Make sure to write to/read from the USB interrupt status register 1 first and then USB interrupt status register 2. When an IN token is received during an isochronous transfer, and the IN FIFO is empty, an underrun error occurs and INTST12 and IN_CSR2 are set to “1”. When an OUT token is received and the OUT FIFO is full, an overrun error occurs and INTST12 and OUT_CSR2 are set to “1”. Underruns and overruns are not detected by the CPU in bulk transfers and normal interrupt transfers, however in this case, the MCU will send a NAK signal to the host CPU. b7 b0 0 USB interrupt status register 1 (address 005216) USBIS1 USB endpoint 0 interrupt status flag (INTST0) 0: Except the following conditions 1: Set at any one of the following conditions: • A packet data of endpoint 0 is successfully received • A packet data of endpoint 0 is successfully sent • DATA_END bit of endpoint 0 is cleared to “0” • FORCE_STALL bit of endpoint 0 is set to “1” • SETUP_END bit of endpoint 0 is set to “1”. Reserved bit (“0” at read/write) USB endpoint 1 IN interrupt status flag (INTST2) 0: Except the following conditions 1: Set at which of the following conditions: • A packet data of endpoint 1 is successfully sent • UNDER_RUN bit of endpoint 1 is set to “1”. USB endpoint 1 OUT interrupt status flag (INTST3) 0: Except the following conditions 1: Set at any one of the following conditions: • A packet data of endpoint 1 is successfully received • OVER_RUN bit of endpoint 1 is set to “1” • FORCE_STALL bit of endpoint 1 is set to “1”. USB endpoint 2 IN interrupt status flag (INTST4) 0: Except the following conditions 1: Set at which of the following conditions: • A packet data of endpoint 2 is successfully sent • UNDER_RUN bit of endpoint 2 is set to “1”. USB endpoint 2 OUT interrupt status flag (INTST5) 0: Except the following conditions 1: Set at any one of the following conditions: • A packet data of endpoint 2 is successfully received • OVER_RUN bit of endpoint 2 is set to “1” • FORCE_STALL bit of endpoint 2 is set to “1”. USB endpoint 3 IN interrupt status flag (INTST6) 0: Except the following conditions 1: Set at which of the following conditions: • A packet data of endpoint 3 is successfully sent • UNDER_RUN bit of endpoint 3 is set to “1”. USB endpoint 3 OUT interrupt status flag (INTST7) 0: Except the following conditions 1: Set at any one of the following conditions: • A packet data of endpoint 3 is successfully received • OVER_RUN bit of endpoint 3 is set to “1” • FORCE_STALL bit of endpoint 3 is set to “1”. Fig. 40 Structure of USB interrupt status register 1 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 49 of 135 7641 Group b7 b0 00 USB interrupt status register 2 (address 005316) USBIS2 USB endpoint 4 IN interrupt status flag (INTST8) 0: Except the following conditions 1: Set at which of the following conditions: • A packet data of endpoint 4 is successfully sent • UNDER_RUN bit of endpoint 4 is set to “1”. USB endpoint 4 OUT interrupt status flag (INTST9) 0: Except the following conditions 1: Set at any one of the following conditions: • A packet data of endpoint 4 is successfully received • OVER_RUN bit of endpoint 4 is set to “1” • FORCE_STALL bit of endpoint 4 is set to “1”. Reserved bit (“0” at read/write) USB overrun/underrun interrupt status flag (INTST12) 0: Except the following condition 1: Set at an occurrence of overrun/underrun (for isochronous data transfer) USB reset interrupt status flag (INTST13) 0: Except the following condition 1: Set at receiving of USB reset signal USB resume signal interrupt status flag (INTST14) 0: Except the following condition 1: Set at receiving of resume signal USB suspend signal interrupt status flag (INTST15) 0: Except the following condition 1: Set at receiving of suspend signal Fig. 41 Structure of USB interrupt status register 2 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 50 of 135 7641 Group [USB Interrupt Enable Registers 1 and 2] USBIE1, USBIE2 The USB interrupt enable registers are used to enable the USB function interrupt. Upon reset, all USB interrupts except the USB suspend and USB resume interrupts are enabled. b7 b0 0 USB interrupt enable register 1 (address 005416) USBIE1 USB endpoint 0 interrupt enable bit (INTEN0) 0: Disabled 1: Enabled Reserved bit (“0” at read/write) USB endpoint 1 IN interrupt enable bit (INTEN2) 0: Disabled 1: Enabled USB endpoint 1 OUT interrupt enable bit (INTEN3) 0: Disabled 1: Enabled USB endpoint 2 IN interrupt enable bit (INTEN4) 0: Disabled 1: Enabled USB endpoint 2 OUT interrupt enable bit (INTEN5) 0: Disabled 1: Enabled USB endpoint 3 IN interrupt enable bit (INTEN6) 0: Disabled 1: Enabled USB endpoint 3 OUT interrupt enable bit (INTEN7) 0: Disabled 1: Enabled Fig. 42 Structure of USB interrupt enable register 1 b7 b0 01 00 USB interrupt enable register 2 (address 005516) USBIE2 USB endpoint 4 IN interrupt enable bit (INTEN8) 0: Disabled 1: Enabled USB endpoint 4 OUT interrupt enable bit (INTEN9) 0: Disabled 1: Enabled Reserved bit (“0” at read/write) USB overrun/underrun interrupt enable bit (INTEN12) 0: Disabled 1: Enabled Reserved bit (“1” at read/write) Reserved bit (“0” at read/write) USB suspend/resume interrupt enable bit (INTEN15) 0: Disabled 1: Enabled Fig. 43 Structure of USB interrupt enable register 2 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 51 of 135 7641 Group [USB Frame Number Registers Low and High ] USBSOFL, USBFOFH These 11-bit registers contain the frame number of the SOF token received from the host computer. These are read-only registers. [USB Endpoint Index Register] USBINDEX This register specifies the accessible endpoint. It serves as an index to endpoint-specific USB Endpoint x IN Control Register, USB Endpoint x OUT Control Register, USB Endpoint x IN Max. Packet Size Register, USB Endpoint x OUT Max. Packet Size Register, USB Endpoint x OUT Write Count Register, and USB FIFO Mode Selection Register (x = 0 to 4). b7 b0 USB frame number register Low (address 005616) USBSOFL Low-order 8 bits of SOF token b7 b0 USB frame number register High (address 005716) USBSOFH High-order 3 bits of SOF token Reserved bit (“0” at read) Fig. 44 Structure of USB frame number registers b7 b0 000 USB endpoint index register (address 005816) USBINDEX Endpoint index bit (EPINDEX) b2b1b0 0 0 0: Endpoint 0 0 0 1: Endpoint 1 0 1 0: Endpoint 2 0 1 1: Endpoint 3 1 0 0: Endpoint 4 1 0 1: Not used 1 1 0: Not used 1 1 1: Not used Reserved bit (“0” at read/write) AUTO_FLUSH bit (AUTO_FL) 0: Auto FIFO flush disabled 1: Auto FIFO flush enabled ISO_UPDATE bit (ISO_UPD) 0: ISO_UPDATE disabled 1: ISO_UPDATE enabled Fig. 45 Structure of USB frame number registers Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 52 of 135 7641 Group [USB Endpoint 0 IN Control Register ] IN_CSR This register contains the control and status information of the endpoint 0. This USB FCU sets the OUT_PKT_RDY flag to “1” upon having received a data packet in the OUT FIFO. When reading its one data packet from the OUT FIFO, be sure to set this flag to “0”. After a SETUP token is received, the MCU is in the “decode wait state ” u ntil the OUT_PKT_RDY flag is cleared. If the OUT_PKT_RDY flag is not cleared (indicating that the host request has not been successfully decoded), the USB FCU keep returning a NAK to the host for all IN/OUT tokens. Set the IN_PKT_RDY bit to “ 1 ” a fter the data packet has been written to the IN FIFO. If this bit is set to “1” even though nothing has been written to the IN FIFO, a “0” length data (NULL packet) is sent to the host. The SEND_STALL bit is for sending a STALL to the host if an unsupported request is received by the USB FCU. This bit must be set to “1”. When the OUT_PKT_RDY flag is set to “0” for request reception, the USB FCU transmits a STALL signal to the Host CPU. Perform the following three processes simultaneously: • Set SEND_STALL bit to “1” • Set DATA_END bit to “1” • Set OUT_PKT_RDY flag to “0” by setting SERVICED_OUT _PKT_RDY bit to “1”. Note that if “ 0 ” i s written to the SEND_STALL bit before the CLEAR_FEATURE (endpoint STALL) request has been received, the next STALL will not be generated. The DATA_END bit informs the USB FCU of the completion of the process indicated in the SETUP packet. Set this bit to “1” when the process requested in the SETUP packet is completed. (Control Read Transfer: set this bit after writing all of the requested data to the FIFO; Control Write Transfer: set this bit to “1” after reading all of the requested data from the FIFO.) When this bit is “1”, the host request is ignored and a STALL is returned. After the status phase process is completed, the USB FCU automatically clears it to “0”. b7 b0 USB endpoint 0 IN control register (address 005916) IN_CSR OUT_PKT_RDY flag (IN0CSR0) 0: Except the following condition (Cleared to “0” by writing “1” into SERVICED_OUT_PKT_RDY bit) 1: End of a data packet reception IN_PKT_RDY bit (IN0CSR1) 0: End of a data packet transmission 1: Write “1” at completion of writing a data packet into IN FIFO. SEND_STALL bit (IN0CSR2) 0: Except the following condition 1: Transmitting STALL handshake signal DATA_END bit (IN0CSR3) 0: Except the following condition (Cleared to “0” after completion of status phase) 1: Write “1” at completion of writing or reading the last data packet to/from FIFO. FORCE_STALL flag (IN0CSR4) 0: Except the following condition 1: Protocol error detected SETUP_END flag (IN0CSR5) (Note ) 0: Except the following condition (Cleared to “0” by writing “1” into SERVICED_SETUP_END bit) 1: Control transfer ends before the specific length of data is transferred during the data phase. SERVICED_OUT_PKT_RDY bit (IN0CSR6) Writing “1” to this bit clears OUT_PKT_RDY flag to “0”. SERVICED_SETUP_END bit (IN0CSR7) Writing “1” to this bit clears SETUP_END flag to “0”. Note: If this bit is set to “0”, stop accessing the FIFO to serve the previous setup transaction. Fig. 46 Structure of USB endpoint 0 IN control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 53 of 135 7641 Group [USB Endpoint x (x = 1 to 4) IN Control Register] IN_CSR This register contains the control and status information of the respective IN Endpoints 1 to 4. Set the IN_PKT_RDY bit to “1” after the data packet has been written to the IN FIFO. This bit is cleared to “0” when the data transfer is completed. In a bulk IN transfer, this bit is cleared when an ACK signal is received from the host. If an ACK signal is not received, this bit (and the TX_NOT_EMPTY bit) remains as “1”. This same data packet is sent after the next IN token is received. The FLUSH bit is for flushing the data in the IN FIFO. b7 b0 USB endpoint x IN control register (address 005916) IN_CSR INT_PKT_RDY bit (INXCSR0) 0: End of a data packet transmission (Note 1) 1: Write “1” at completion of writing a data packet into IN FIFO. (Note 3) UNDER_RUN flag (INXCSR1) (In isochronous data transfer) 0: No FIFO underrun (Note 2) 1: FIFO underrun occurred (Note 1) (USB overrun/underrun interrupt status flag is set to “0”.) SEND_STALL bit (INXCSR2) (Note 2) 0: Except the following condition 1: Transmitting STALL handshake signal ISO/TOGGLE_INIT bit (INXCSR3) (Note 2) 0: Except the following condition 1: Initializing to endpoint used for isochronous transfer; Initializing the data toggle sequence bit INTPT bit (INXCSR4) (Note 2) 0: Except the following condition 1: Initializing to endpoint used for interrupt transfer, rate feedback TX_NOT_EPT flag (INXCSR5) (Note 1) 0: Empty in IN FIFO 1: Full in IN FIFO FLUSH bit (INXCSR6) 0: Except the following condition (Note 1) 1: Flush FIFO. (Note 2) AUTO_SET bit (INXCSR7) (Note 2) 0: AUTO_SET disabled 1: AUTO_SET enabled (Note 4) Notes 1: This bit is automatically set to “1” or cleared to “0”. 2: The user must program to “1” or “0”. 3: When AUTO_SET bit is “0”, the user must set to “1”. When AUTO_SET bit is “1”, this bit is automatically set to “1”. 4: To use the AUTO_SET function for an IN transfer when the AUTO_SET bit is set to “1”, set the FIFO to single buffer mode. Fig. 47 Structure of USB endpoint x (x = 1 to 4) IN control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 54 of 135 7641 Group [USB Endpoint x (x = 1 to 4) OUT Control Register] OUT_CSR This register contains the information and status of the respective OUT endpoints 1 to 4. In the endpoint 0, all bits are reserved and cannot be used (they will all be read out as “0”). The USB FCU sets the OUT_PKT_RDY flag to “1” after a data packet has been received into the OUT FIFO. After reading the data packet in the OUT FIFO, clear this flag to “0”. However, if there is still data in the OUT FIFO, the flag cannot be cleared even by writing “0” by software. b7 b0 USB endpoint x OUT control register (address 005A16) OUT_CSR OUT_PKT_RDY flag (OUTXCSR0) 0: Except the following condition (Note 3) 1: End of a data packet reception (Note 2) OVER RUN flag (OUTXCSR1) (In isochronous data transfer) 0: No FIFO overrun (Note 2) 1: FIFO overrun occurred (Note 1) SEND_STALL bit (OUTXCSR2) (Note 2) 0: Except the following condition 1: Transmitting STALL handshake signal ISO/TOGGLE_INIT bit (OUTXCSR3) (Note 2) 0: Except the following condition 1: Initializing to endpoint used for isochronous transfer; Enabling reception of DATA0 and DATA1 as PID (Initializing the toggle) FORCE_STALL flag (OUTXCSR4) 0: Except the following condition (Note 2) 1: Protocol error detected (Note 1) DATA_ERR flag (OUTXCSR5) 0: Except the following condition (Note 2) 1: CRC or bit stuffing error detected in transferring isochronous data (Note 1) FLUSH bit (OUTXCSR6) 0: Except the following condition (Note 1) 1: Flush FIFO. (Note 2) AUTO_CLR bit (OUTXCSR7) (Note 2) 0: AUTO_CLR disabled 1: AUTO_CLR enabled Notes 1: This bit is automatically set to “1” or cleared to “0”. 2: The user must program to “1” or “0”. 3: When AUTO_CLR bit is “0”, the user must clear to “0”. When AUTO_CLR bit is “1”, this bit is automatically cleared to “0”. Fig. 48 Structure of USB endpoint x (x = 1 to 4) OUT control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 55 of 135 7641 Group [USB Endpoint x (x = 0 to 4) IN Max. Packet Size Register] IN_MAXP This register specifies the maximum packet size (MAXP) of an endpoint x IN packet. The value set for endpoint 1 is the number of transmitted bytes divided by 8, and the value set for endpoints 0, 2, 3, and 4 is the actual number of transmitted bytes. The CPU can change these values using the SET_DESCRIPTOR command. The initial value for endpoints 0, 2, 3 and 4 is 8, and the initial value for endpoint 1 is 1. [USB Endpoint x (x = 0 to 4) OUT Max. Packet Size Register] OUT_MAXP This register specifies the maximum packet size (MAXP) of an Endpoint x OUT packet. The value set for endpoint 1 is the number of received bytes divided by 8, and the value set for endpoints 0, 2, 3, and 4 is the actual number of received bytes. The CPU can change these values using the SET_DESCRIPTOR command. The initial value for endpoints 0, 2, 3, and 4 is 8, and the initial value for endpoint 1 is 1. When using the endpoint 0, both USB endpoint x IN max. packet size register (IN _MAXP) and USB endpoint x OUT max. packet size register (OUT_MAXP) are set to the same value. Changing one register ’s value effectively changes the value of the other register as well. b7 b0 USB endpoint x IN max. packet size register (address 005B16) IN_MAXP The maximum packet size (MAXP) of endpoint x IN is contained. MAXP = n for endpoints 0, 2, 3, 4 MAXP = n ✕ 8 for endpoint 1 “n” is a written value into this register. Fig. 49 Structure of USB endpoint x IN max. packet size register b7 b0 USB endpoint x OUT max. packet size register (address 005C16) OUT_MAXP The maximum packet size (MAXP) of endpoint x OUT is contained. MAXP = n for endpoints 0, 2, 3, 4 MAXP = n ✕ 8 for endpoint 1 “n” is a written value into this register. Fig. 50 Structure of USB endpoint x OUT max. packet size register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 56 of 135 7641 Group [USB endpoint x (x = 0 to 4) OUT Write Count Registers (Low and High)] WRT_CNTRL, WRT_CNTH These registers contain the number of bytes in the endpoint x OUT FIFO. These are read-only registers. These two registers must be read after the USB FCU has received a packet of data from the host. When reading these registers, the lower byte must be read first, then the higher byte. When the OUT FIF0 is in double buffer mode, the CPU first reads the received number of bytes of the former data packet. The next CPU read can obtain that of the new data packet. b7 b0 USB endpoint x OUT write count register Low (address 005D16) WRT_CNTL Low-order 8 bits of the number of bytes in endpoint x OUT FIFO b7 b0 USB endpoint x OUT write count register High (address 005E16) WRT_CNTH High-order 2 bits of the number of bytes in endpoint x OUT FIFO Not used (“0” at read) Fig. 51 Structure of USB endpoint x (x = 0 to 4) OUT write count registers [USB Endpoint x (x = 0 to 4) FIFO Register] USBFIFOx These registers are the USB IN (transmit) and OUT (receive) FIFO data registers. Write data to the corresponding register, and read data from the corresponding register. When the maximum packet size is equal to or less than half the FIFO size, these registers function in double buffer mode and can hold two packets of data. When the IN_PKT_RDY bit is “0” and the TX_NOT_EMPTY bit is “1”, these bits indicate that one packet of data is stored in the IN FIFO. When the OUT FIFO is in double buffer mode, the OUT_PKT_RDY flag remains as “1” after the first packet of data is read out (it actually goes to “0” and returns to “1” after one φ cycle). b7 b0 USB endpoint x FIFO register (addresses 006016, 006116, 006216, 006316, 006416,) USBFIFOx Endpoint x IN/OUT FIFO Fig. 52 Structure of USB endpoint x (x = 0 to 4) FIFO register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 57 of 135 7641 Group [USB Endpoint FIFO Mode Selection Register] USBFIFOMR This register determines IN/OUT FIFO size mode for endpoint 1 or endpoint 2. This register is invalid when using endpoint 0, 3, or 4. b7 b0 0000 USB endpoint FIFO mode register (address 005F16) USBFIFOMR FIFO size selection bit (Note) For endpoint 1 b3b2b1b0 0 0 0: IN 512-byte, OUT 800-byte 0 0 1: IN 1024-byte, OUT 1024-byte X 0 1 0: IN 0-byte, OUT 2048-byte X 0 1 1: IN 2048-byte, OUT 0-byte X 1 0 0: IN 768-byte, OUT 1280-byte X 1 0 1: IN 880-byte, OUT 1168-byte X X For endpoint 2 0 X X X : IN 32-byte, OUT 32-byte 1 X X X : IN 128-byte, OUT 128-byte Reserved bit (“0” at read/write) Note: The value set into “x” is invalid. Fig. 53 Structure of USB endpoint FIFO mode register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 58 of 135 7641 Group MASTER CPU BUS INTERFACE The 7641 group internally has a 2-byte bus interface which control signals from the host CPU side can operate (slave mode). This bus interface allows the 7641 group to be directly connected with a R/W type of CPU bus or a RD and WR separated type of CPU bus. Figure 56 shows the block diagram of master CPU bus interface function. The data bus buffer function I/O pins (P52 – P57 , P6, P72–P74 ) also function as the normal I/O ports. When the Master CPU Bus Interface Enable bit of Data Bus Buffer Control Register (bit 6 of address 004A16) is “0”, these pins become the normal I/O ports. When it is “1”, these pins become the master CPU bus interface function pins. Additionally, when using the master CPU bus interface function, set port P6 to input mode by setting “0016” into its port direction register (address 001516). The selection of either the single data bus buffer mode, which uses 1 byte: data bus buffer 0 only, or the double data bus buffer mode, which uses 2 bytes: data bus buffer 0 and data bus buffer 1, is performed by the Data Bus Buffer Function Select Bit of Data Bus Buffer Control Register 1 (bit 7 of address 004E16). Port P72 becomes S1 input pin in the double data bus buffer mode. When data is written from the host CPU side, an input buffer full interrupt occurs. When data is read from the host CPU, an output buffer empty interrupt occurs. The 7641 group shares two input buffer full interrupt requests and two output buffer empty interrupt requests as shown in Figure 54, respectively. The 7641 group can also operate the master CPU bus interface connecting with the Built-in DMAC. This could transfer a large amount of data fast. An input signal level of data bus buffer function input pins can be selected between a CMOS level and a TTL level. Set it using the Master CPU Bus Input Level Select Bit of Port Control Register (address 001016) . Input buffer full flag 0 IBF0 Rising edge detection circuit Rising edge detection circuit One-shot pulse generating circuit One-shot pulse generating circuit Input buffer full interrupt request signal IBF Input buffer full flag 1 IBF1 Output buffer full flag 0 OBF0 Output buffer full flag 1 OBF1 OBE0 Rising edge detection circuit Rising edge detection circuit One-shot pulse generating circuit One-shot pulse generating circuit Output buffer empty interrupt request signal OBE OBE1 IBF0 IBF1 IBF Interrupt request is set at this rising edge OBF0 (OBE0) OBF1 (OBE1) OBE Interrupt request is set at this rising edge Fig. 54 Interrupt request circuit of data bus buffer Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 59 of 135 7641 Group b7 b0 b7 b0 Data bus buffer status register 0 (address 004916) DBBS0 Output buffer full flag (OBF0) 0: Buffer empty 1: Buffer full Input buffer full flag (IBF0) 0: Buffer empty 1: Buffer full User definable flag (U2) This flag can be defined by user freely. A0 flag (A00) This flag indicates the condition of A0 status when the IBF0 flag is set. User definable flag (U4–U7) This flag can be defined by user freely. 0 Data bus buffer control register 0 (address 004A16) DBBC0 OBF0 output enable bit 0: P52 functions as I/O port. 1: P52 functions as OBF0 output pin. IBF0 output enable bit 0: P53 functions as I/O port. 1: P53 functions as IBF0 output pin. IBF0 interrupt select bit 0: Occurrence due to data write (A0 = “0”) or command write (A0 = “1”) 1: Occurrence due to command write (A0 = “1”) Output buffer 0 empty interrupt disable bit 0: Enabled 1: Disabled Input buffer 0 full interrupt disable bit 0: Enabled 1: Disabled Reserved bit (“0” at read/write) Master CPU bus interface enable bit 0: P54 to P57, P60 to P67 function as I/O ports. 1: P54 to P57, P60 to P67 function as master CPU bus interface function pins. Bus interface type select bit 0: RD, WR separate type bus 1: R/W type bus b7 b0 b7 b0 Data bus buffer status register 1 (address 004D16) DBBS1 Output buffer full flag (OBF1) 0: Buffer empty 1: Buffer full Input buffer full flag (IBF1) 0: Buffer empty 1: Buffer full User definable flag (U2) This flag can be defined by user freely. A0 flag (A01) This flag indicates the condition of A0 status when the IBF1 flag is set. User definable flag (U4–U7) This flag can be defined by user freely. 00 Data bus buffer control register 1 (address 004E16) DBBC1 OBF1 output enable bit 0: P74 functions as I/O port. 1: P74 functions as OBF1 output pin. IBF1 output enable bit 0: P73 functions as port I/O pin. 1: P73 functions as IBF1 output pin. IBF1 interrupt select bit 0: Occurrence due to data write (A0 = “0”) or command write (A0 = “1”) 1: Occurrence due to command write (A0 = “1”) Output buffer 1 empty interrupt disable bit 0: Enabled 1: Disabled Input buffer 1 full interrupt disable bit 0: Enabled 1: Disabled Reserved bit (“0” at read/write) Data bus buffer function select bit 0 : Single data bus buffer mode (P72 functions as I/O port.) 1 : Double data bus buffer mode (P72 functions as S1 input pin.) Fig. 55 Structure of master CPU bus interface related registers Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 60 of 135 7641 Group Data bus buffer control register 1 b7 (address 004E16) b6 b5 b4 b3 b2 b1 b0 P74/OBF1 P73/IBF1 P55/A0 P72/S1 P56/R P57/W U7 U6 U5 U4 A01 U2 IBF1 OBF1 P60/DQ0 Output data bus buffer register 1 (address 004C16) P61/DQ1 P62/DQ2 P63/DQ3 System bus Input data bus buffer register 1 (address 004C16) RD DBBSTS1 D B B1 P64/DQ4 RD DBB0 Input data bus buffer register 0 P65/DQ5 (address 004816) WR DBBSTS0 P66/DQ6 Output data bus buffer register 0 (address 004816) U7 P57/W P56/R P54/S0 P55/A0 P53/IBF0 P52/OBF0 U6 U5 U4 A00 U2 IBF0 OBF0 P67/DQ7 Data bus buffer control register 0 b7 (address 004A16) b6 b5 b4 b3 b2 b1 b0 Fig. 56 Master CPU bus interface block diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 61 of 135 Internal data bus WR 7641 Group [Data Bus Buffer Status Register 0, 1 (DBBS0, DBBS1)] 004916, 004D16 The data bus buffer status registers 0, 1 consist of eight bits each. Bits 0, 1, and 3 are read-only bits and indicate the status of the data bus buffer. Bits 2, 4, 5, 6, and 7 are user definable flags which can be programed, and can be read/written. The host CPU can only read this register when the A0 pin is set to “H”. •Bit 0: Output buffer full flag OBF0, OBF1 When writing data to the output data bus buffer, this flag is set to “1”. When reading the output data bus buffer from the host CPU, this flag is cleared to “0”. •Bit 1: Input buffer full flag IBF0, IBF1 When writing data from the host CPU to the input data bus buffer, this flag is set to “1”. When reading the input data bus buffer from the slave CPU side, this flag is are cleared to “0”. •Bit 3: A0 flag A00, A01 When writing data from the host CPU to the input data bus buffer, the level of the A0 pin is latched. [Input Data Bus Buffer Registers 0, 1 (DBBIN 0 , DBBIN 1 )] 004816, 004C16 Data on the data bus is latched to DBBIN0 or DBBIN1 by writing request from the host CPU. Data of DBBINs can be read from the Data Bus Buffer Registers (address 0048 16 o r 004C16) on the SFR area. [Output Data Bus Buffer Registers 0, 1 (DBBOUT 0 , DBBOUT1)] 004816, 004C16 When writing data to the Data Bus Buffer Registers (address 004816 or 004C16) on the SFR area, data is set to DBBOUT0 or DBBOUT1. Data of DBBOUTs is output onto the data bus by performing the reading request from the host CPU when the A0 pin is set to “L”. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 62 of 135 7641 Group Table 8 Function description of control I/O pins of master CPU bus interface OBF0 output enable bit 1 0 — IBF0 output enable bit 0 1 — OBF1 output enable bit 0 0 — IBF1 output enable bit 0 0 — Input/ Output Pin Name Functions P52/OBF0 P53/IBF0 P54/S0 OBF0 IBF0 S0 Output Output Input Status output signal. OBF0 signal is output. Status output signal. IBF0 signal is output. Chip select input. This is used for selecting the data bus buffer, which is selected at “L” level. Address input. This is used for selecting DBBSTS and DBBOUT when the host CPU reads. This is used for distinguishing command from data when the host CPU writes. This is a timing signal for reading data from the data bus buffer to the host CPU. This is a timing signal for writing data to the data bus buffer by the host CPU. Chip select input. This is used for selecting the data bus buffer, which is selected at “L” level. Status output signal. IBF1 signal is output. Status output signal. OBF1 signal is output. P55/A0 A0 — — — — Input P56/R (E) P57/W (R/W) P72/S1 R (E) W (R/W) S1 — — — — — — — — — — — — Input Input Input P73/IBF1/HLDA P74/OBF1 IBF1 OBF1 0 0 0 0 0 1 1 0 Output Output Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 63 of 135 7641 Group COUNT SOURCE GENERATOR The 7641 Group has a built-in special count source generator, SCSG. This generator consists of two 8-bit timers: SCSG1 and SCSG2. The output of the special count source generator can be used as a clock source for the timer X, serial I/O and two UARTs. The SCSG output is Clock SCSGCLK. The frequency is calculated as follows: SCSGCLK = φ ✕ {n1 / (n1+1)} ✕ {1 / (n2+1)} n1: value set to SCSG1 n2: value set to SCSG2 If the SCSG1 Count Stop Bit (SCSGM1) is set to “ 1 ” , or Timer SCSG1 is set to “0”, the SCSG1 count stops. When this happens, the count source for Timer SCSG2 becomes φ. SCSG Operation Timers SCSG1 and SCSG2 are both down count timers. When the count reaches “0”, an underflow occurs at the next count source rising edge and the contents of the corresponding timer latch are loaded to the timer. The division ratio of each SCSG-x timer is given by 1 / (n+1), where “n” is the value set to the SCSG-x timer. The output of Timer SCSG1 is ANDed with the original clock (φ) to make a count source for Timer SCSG2. Data Write Control When the SCSG1 Data Write Control Bit or SCSG2 Data Write Control Bit is set to “0”, and data is written to the SCSG-x timer; the data is written to the corresponding latch and timer at the same time. When that bit is set to “1”, the data is only written to the latch. SCSG1 count stop bit SCSGCLK output control bit SCSG1 Timer Reload Latch φ SCSG1 Timer (8) SCSG1 data write control bit SCSG1 count stop bit SCSG1 count stop bit SCSG2 data write control bit SCSGCLK output control bit SCSG2 Timer Reload Latch SCSG2 Timer (8) SCSGCLK output control bit SCSGCLK Fig. 57 Special count source generator block diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 64 of 135 7641 Group b7 b0 0000 Special count source mode register (address 002F16) SCSGM SCSG1 data write control bit 0: Writing data into both Timer latch and Timer simultaneously 1: Writing data into only Timer latch SCSG1 count stop bit 0: Count start 1: Count stop SCSG2 data write control bit 0: Writing data into both Timer latch and Timer simultaneously 1: Writing data into only Timer latch SCSGCLK output control bit 0: SCSGCLK output disabled (SCSG1 and SCSG2 counts stop) 1: SCSGCLK output enabled Reserved bits (“0” at read/write) Fig. 58 Structure of special count source generator mode register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 65 of 135 7641 Group FREQUENCY SYNTHESIZER (PLL) The frequency synthesizer generates the 48 MHz clock required by fUSB and fSYN, which are multiples of the external input reference f(XIN). Figure 59 shows the block diagram for the frequency synthesizer circuit. The Frequency Synthesizer Input Bit selects either f(X IN ) or f(XCIN) as an input clock fIN for the frequency synthesizer. The Frequency Synthesizer Multiply Register 2 (FSM2: address 006E16) divides fIN to generate fPIN, where fPIN = fIN / 2(n + 1), n: value set to FSM2. When the value of Frequency Synthesizer Multiply Register 2 is set to 255, the division is not performed and fPIN will equal fIN. fVCO is generated according to the contents of Frequency Synthesizer Multiply Register 1 (FSM1: address 006D16), where fVCO = fPIN ✕ {2(n + 1)}, n: value set to FSM1. Set the value of FSM1 so that the value of fVCO is 48 MHz. fSYN is generated according to the contents of the Frequency Synthesizer Divide Register (FSD: address 006F16), where fSYN = fVCO / 2(m + 1), m: value set to FSD. When the value of the Frequency Synthesizer Divide Register is set to 255, the division is not performed and fSYN becomes invalid. [Frequency Synthesizer Control Register] FSC Setting the Frequency Synthesizer Enable Bit (FSE) to “1” enables the frequency synthesizer. When the Frequency Synthesizer Lock Status Bit (LS) is “1” in the frequency synthesizer enabled, this indicates that fSYN and fVCO have correct frequencies. sNotes Make sure to connect a low-pulse filter to the LPF pin when using the frequency synthesizer. In addition, please refer to “Programming Notes: Frequency Synthesizer ” w hen recovering from a Hardware Reset. fVCO fIN Prescaler fPIN Frequency Multiplier Frequency synthesizer lock status bit Frequency Divider fSYN fUSB FSM2 (address 006E16) FSM1 (address 006D16) FSC (address 006C16) FSD (address 006F16) Data Bus Fig. 59 Frequency synthesizer block diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 66 of 135 7641 Group b7 b0 0 00 Frequency synthesizer control register (address 006C16) FSC Frequency synthesizer enable bit (FSE) 0: Disabled 1: Enabled Fix to “00”. Frequency synthesizer input bit (FIN) 0: f(XIN) 1: f(XCIN) Reserved bit (“0” at read/write) LPF current control (CHG1, CHG0) (Note) b6b5 0 0: Not available 0 1: Low current 1 0: Intermediate current (recommended) 1 1: High current Frequency synthesizer lock status bit 0: Unlocked 1: Locked Note: Bits 6 and 5 are set to (bit 6, bit 5) = (1, 1) at reset. When using the frequency synthesizer, we recommend to set to (bit 6, bit 5) = (1, 0) after locking the frequency synthesizer. Fig. 60 Structure of frequency synthesizer control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 67 of 135 7641 Group RESET CIRCUIT To reset the microcomputer, RESET pin should be held at an “L” level for 20 cycles or more of φ. Then the RESET pin is returned to an “H” level, and reset is released. They must be performed when the power source voltages are between 3.00 V and 3.60 V or 4.15 V and 5.25 V. After the reset is completed, the program starts from the address contained in address FFFA 16 ( high-order byte) and address FFFB16 (low-order byte). After oscillation has restarted, the timers 1 and 2 secures waiting time for the internal clock φ oscillation stabilized automatically by setting the timer 1 to “FF 16” and timer 2 to “01 16”. The internal clock φ retains “H” level until Timer 2’s underflow and it cannot be supplied until the underflow. The pins state during reset are follows: •When CNVss = “H” : Outputting Ports P0, P1, P33 to P37 Pins other than above mentioned ports : Inputting •When CNVss = “L” All pins : Inputting. Poweron RESET VCC Power source voltage 0V Reset input voltage 0V (Note) 0.2VCC Note : Reset release voltage ; Vcc = 3.00 or 4.15 V RESET VCC Power source voltage detection circuit Fig. 61 Reset circuit example φ RESET Internal reset Address ? ? ? ? FFFA FFFB ADH,L Reset address from the vector table. Data ? ? ? ? ADL ADH SYNC XIN: 512 clock cycles Notes: The question marks (?) indicate an undefined state that depends on the previous state. Fig. 62 Reset sequence Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 68 of 135 7641 Group Address Register contents (1) (2) (3) (4) (5) (6) (7) (8) (9) CPU mode register A (CPUA) CPU mode register B (CPUB) Interrupt request register A (IREQA) Interrupt request register B (IREQB) Interrupt request register C (IREQC) Interrupt control register A (ICONA) Interrupt control register B (ICONB) Interrupt control register C (ICONC) Address Register contents (48) UART1 status register (U1STS) (49) UART1 control register (U1CON) (50) UART1 RTS control register (U1RTSC) (51) UART2 mode register (U2MOD) (52) UART2 status register (U2STS) (53) UART2 control register (U2CON) (54) UART2 RTS control register (U2RTSC) (55) DMAC index and status register (DMAIS) (56) DMAC channel x mode register 1 (DMAx1) (57) DMAC channel x mode register 2 (DMAx2) (58) DMAC channel x source register Low (DMAxSL) (59) DMAC channel x source register High (DMAxSH) (60) DMAC channel x destination register Low (DMAxDL) (61) DMAC channel x destination register High (DMAxDH) 003216 0 0 0 0 0 0 1 1 003316 0016 000016 0 0 0 0 1 1 0 0 000116 1 0 0 0 0 0 1 1 000216 000316 000416 000516 000616 000716 000816 000916 000A16 000B16 000C16 000D16 000E16 000F16 001016 001116 001216 001316 001416 001516 001616 001716 001816 001916 001A16 001B16 001C16 001D16 001F16 002016 002116 002216 002316 002416 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 FF16 FF16 FF16 FF16 FF16 003616 1 0 0 0 0 0 0 0 003816 0016 003A16 0 0 0 0 0 0 1 1 003B16 0016 003E16 1 0 0 0 0 0 0 0 003F16 004016 004116 004216 004316 004416 004516 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 0016 FF16 Port P0 (P0) (10) Port P0 direction register (P0D) (11) Port P1 (P1) (12) Port P1 direction register (P1D) (13) Port P2 (P2) (14) Port P2 direction register (P2D) (15) Port P3 (P3) (16) Port P3 direction register (P3D) (17) Port control register (PTC) (18) Interrupt polarity select register (IPOL) (19) Port P2 pull-up control register (PUP2) (20) USB control register (USBC) (21) Port P6 (P6) (22) Port P6 direction register (P6D) (23) Port P5 (P5) (24) Port P5 direction register (P5D) (25) Port P4 (P4) (26) Port P4 direction register (P4D) (27) Port P7 (P7) (28) Port P7 direction register (P7D) (29) Port P8 (P8) (30) Port P8 direction register (P8D) (31) Clock control register (CCR) (32) Timer XL (TXL) (33) Timer XH (TXH) (34) Timer YL (TYL) (35) Timer YH (TYH) (36) Timer 1 (T1) (37) Timer 2 (T2) (38) Timer 3 (T3) (39) Timer X mode register (TXM) (40) Timer Y mode register (TYM) (41) Timer 123 mode register (T123M) (42) Serial I/O control register 1 (SIOCON1) (43) Serial I/O control register 2 (SIOCON2) (62) DMAC channel x transfer count register Low (DMAxCL) 004616 (63) DMAC channel x transfer count register High (DMAxCH) 004716 (64) Data bus buffer register 0 (DBB0) (65) Data bus buffer status register 0 (DBBS0) (66) Data bus buffer control register 0 (DBBC0) (67) Data bus buffer register 1 (DBB1) (68) Data bus buffer status register 1 (DBBS1) (69) Data bus buffer control register 1 (DBBC1) (70) USB address register (USBA) 004816 004916 004A16 004C16 004D16 004E16 005016 (71) USB power management register (USBPM) 005116 (72) USB interrupt status register 1 (USBIS1) (73) USB interrupt status register 2 (USBIS2) (74) USB interrupt enable register 1 (USBIE1) (75) USB interrupt enable register 2 (USBIE2) (76) USB frame number register Low (USBSOFL) (77) USB frame number register High (USBSOFH) (78) USB endpoint index register (USBINDEX) 005216 005316 005416 005516 0 0 1 1 0 0 1 1 005616 005716 005816 0016 0016 0016 0016 0016 (79) USB endpoint x IN control register (IN_CSR) 005916 (80) USB endpoint x OUT control register (OUT_CSR) 005A16 (81) USB endpoint x IN max. packet size register (IN_MAXP) 005B16 0 0 0 0 1 0 0 0 (Note 1) (82) USB endpoint x OUT max. packet size register (OUT_MAXP) 005C16 0 0 0 0 1 0 0 0 (Note 1) (83) USB endpoint x OUT write count register Low (WRT_CNTL) 005D16 0016 0016 0016 002516 0 0 0 0 0 0 0 1 002616 002716 002816 002916 FF16 0016 0016 0016 (84) USB endpoint x OUT write count register High (WRT_CNTH) 005E16 (85) USB endpoint FIFO mode register (USBFIFOMR) (86) Flash memory control register (FMCR) (Note 3) 005F16 006A16 0 0 0 0 0 0 0 1 006C16 0 1 1 0 0 0 0 0 006D16 006E16 006F16 FFC916 (PS) (PCH) (PCL) FF16 FF16 FF16 FF16 ✕✕✕✕✕ 1 ✕✕ FFFB16 contents FFFA16 contents (87) Frequency synthesizer control register (FSC) (88) Frequency synthesizer multiply register 1 (FSM1) (89) Frequency synthesizer multiply register 2 (FSM2) (90) Frequency synthesizer divide register (FSM2) (91) ROM code protect control register (ROMCP) (Note 3) 002B16 0 1 0 0 0 0 0 0 002C16 0 0 0 1 1 0 0 0 FF16 FF16 0016 0016 (44) Special count source generator 1 (SCSG1) 002D16 (45) Special count source generator 2 (SCSG2) 002E16 (46) Special count source mode register (SCSGM) 002F16 (47) UART1 mode register (U1MOD) 003016 (92) Processor status register (93) Program counter X : Not fixed Notes 1: When using the endpoint 1, this contents are “0116”. 2: Since the initial values for other than above mentioned registers and RAM contents are indefinite at reset, they must be set. 3: The flash memory control register and the ROM code protect control register exists in the flash memory version only. Fig. 63 Internal status at reset Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 69 of 135 7641 Group CLOCK GENERATING CIRCUIT The 7641 group has two built-in oscillation circuits. An oscillation circuit can be formed by connecting a resonator between XIN and XOUT (XCIN and XCOUT). Use the circuit constants in accordance with the resonator manufacturer ’s recommended values. No external resistor is needed between XIN and XOUT since a feed-back resistor exists on-chip. (An external feed-back resistor may be needed depending on conditions.) However, an external feed-back resistor is needed between XCIN and XCOUT. When using an external clock, input the clocks to the XIN or XCIN pin and leave the XOUT or XCOUT pin open. Immediately after power on, only the XIN oscillation circuit starts oscillating, and XCIN and XCOUT pins function as I/O ports. XCIN Rf XCOUT Rd CCOUT XIN XOUT Rd (Note) CCIN CI N COUT Frequency Control The internal system clock can be selected among f SYN, f(XIN), f(XIN)/2, and f(XCIN). The internal clock φ is half the frequency of internal system clock. (1) fSYN clock This is made by the frequency synthesizer. f(XIN) or f(XCIN) can be selected as its input clock. See also section “FREQUENCY SYNTHESIZER”. Notes : Insert a damping resistor if required. The resistance will vary depending on the oscillator and the oscillation drive capacity setting. Use the value recommended by the maker of the oscillator. Also, if the oscillator manufacturer's data sheet specifies that a feedback resistor be added external to the chip though a feedback resistor exists on-chip, insert a feedback resistor between XIN and XOUT following the instruction. (2) f(XIN) clock The frequency of internal system clock is the frequency of XIN pin. Fig. 64 Ceramic resonator or quartz-crystal oscillator external circuit (3) f(XIN)/2 clock The frequency of internal system clock is half the frequency of XIN pin. (4) f(XCIN) clock The frequency of internal system clock is the frequency of XCIN pin. XCIN XCOUT Open XIN XOUT Open sNote If you switch the oscillation between XIN - XOUT and XCIN - XCOUT, stabilize both XIN and XCIN oscillations. The sufficient time is required for the XCIN oscillation to stabilize, especially immediately after power on and at returning from the stop mode. External oscillation circuit VCC VSS External oscillation circuit VCC VSS Fig. 65 External clock input circuit Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 70 of 135 7641 Group (5) Low power dissipation mode • The low power dissipation operation can be realized by stopping the main clock XIN w hen using f(X CIN) as the internal system clock. To stop the main clock, set the Main Clock (X IN-X OUT) Stop Bit of the CPU mode register A to “1”. • The low power dissipation operation can be realized by disabling the reversed amplifier when inputting external clocks to the XIN pin or XCIN pin. To disable the reversed amplifier, set the XCOUT Oscillation Drive Disable Bit (CCR5) or XOUT Oscillation Drive Disable Bit (CCR6) of the clock control register to “1”. (2) Wait mode If the WIT instruction is executed, the internal clock φ stops at “H” level, but the oscillator does not stop. The internal clock φ restarts at reset or when an interrupt is received. Since the oscillator does not stop, normal operation can be started immediately after the internal clock φ is restarted. Set the Interrupt Enable Bit to be used to release the wait mode to enabled (“1”) and the Interrupt Disable Flag (I) to “0”. Oscillation Control (1) Stop mode If the STP instruction is executed, the internal clock φ stops at “H” level, and XIN and XCIN oscillators stop. Then the timer 1 is set to “FF16” and the internal clock φ divided by 8 is automatically selected as its count source. Additionally, the timer 2 is set to “0116” and the timer 1 ’s output is automatically selected as its count source. Set the Timer 1 and Timer 2 Interrupt Enable Bits to disabled (“0”) before executing the STP instruction. When using an external interrupt to release the stop mode, set the Interrupt Enable Bit to be used to enabled (“1”) and the Interrupt Disable Flag (I) to “0”. Oscillator restarts at reset or when an external interrupt including USB resume interrupts is received, but the internal clock φ r emains at “H” until the timer 2 underflows. The internal clock φ is supplied for the first time when the timer 2 underflows. Therefore make sure not to set the Timer 1 Interrupt Request Bit and Timer 2 Interrupt Request Bit to “1” before the STP instruction stops the oscillator. b7 b0 00000 Clock control register (address 001F16) CCR Reserved bits (“0” at read/write) Fix to “0”. XCOUT oscillation drive disable bit (CCR5) 0: XCOUT oscillation drive is enabled. (When XCIN oscillation is enabled.) 1: XCOUT oscillation drive is disabled. XOUT oscillation drive disable bit (CCR6) 0: XOUT oscillation drive is enabled. (When XIN oscillation is enabled.) 1: XOUT oscillation drive is disabled. XIN divider select bit (CCR7) Valid when CPMA6, CPMA7 = “00” 0: f(XIN)/2 is used for the system clock. 1: f(XIN) is used for the system clock. Fig. 66 Structure of clock control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 71 of 135 7641 Group P1HATRSTB P2LATRSTB DQ PIN1 DQ PIN2 DQ PIN1 DQ P2+ RQ S PIN1 DQ T DQ RESET T R TR T R TR RESET P2+ STP instruction P2LATRSTB P2 peripheral P1 peripheral P2 peripheral T Oscillator count-down timer 1 to 2 STP instruction RQ RQ STP instruction DQ T S S P1HATRSTB P1 peripheral RQ WI T instruction PIN2 DQ T P2 out SQ R Internal clock φ Interrupt request Interrupt disable flag l RESET S P1 out S Delay R QB P2+ P2LATRSTB STP instruction DQ T P2 OSCSTP XOSCSTP Main clock (XIN-XOUT) stop bit P1 P1HATRSTB XCOSCSTP XOD Sub-clock (XCIN-XCOUT) stop bit PIN1, PIN2 XCOD Slow memory wait select bit Slow memory wait mode select bit RDY XIN drive select bit External clock select bit f(XIN) f(XCIN) XDOSCSTP XCDOSCSTP Slow memory wait P1+, P2+ LPF XOSCSTP 1/2 LPF XCOSCSTP fEXT Frequency synthesizer input bit fIN fSYN Internal system clock select bit Main clock (XIN-XOUT) stop bit Sub-clock (XCIN-XCOUT) stop bit 1/2 USB 48 MHz clock output Frequency synthesizer Frequency synthesizer LPF enable bit XIN XOUT XCIN XCOUT Fig. 67 Clock generating circuit block diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 72 of 135 7641 Group Reset (Note 2) φ = f(XIN/4) (Note 3) XIN clock oscillating, XCIN clock stopped, Frequency synthesizer clock stopped, CPMA = 0C, FSC = 60 φ = f(XIN/4) (Note 3) φ = f(PLL)/2 STOP WAIT FSC0 “0”←→“1” XIN clock oscillating, XCIN clock stopped, Frequency synthesizer clock oscillating, (Note 4) CPMA = 0C, FSC = 41 CPMA6 “0”←→“1” XIN clock oscillating, XCIN clock stopped, Frequency synthesizer clock oscillating, CPMA = 4C, FSC = 41 WAIT CPMA4 “1”←→“0” φ = f(XIN/4) (Note 3) XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock stopped, CPMA = 1C, FSC = 60 (Note 2) STOP WAIT FSC0 “0”←→“1” φ = f(XIN/4) (Note 3) XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock oscillating, (Note 4) CPMA = 1C, FSC = 41 CPMA6 “0”←→“1” φ = f(PLL)/2 XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock oscillating, CPMA = 5C, FSC = 41 WAIT CPMA7 “1”←→“0” φ = f(XCIN/2) XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock stopped, CPMA = 9C, FSC = 60 (Note 2) STOP WAIT FSC0 “0”←→“1” φ = f(XCIN/2) XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock oscillating, (Note 4) CPMA = 9C, FSC = 41 CPMA6 “0”←→“1” φ = f(PLL)/2 XIN clock oscillating, XCIN clock oscillating, Frequency synthesizer clock oscillating, CPMA = DC, FSC = 41 WAIT CPMA5 “1”←→“0” φ = f(XCIN/2) (Note 5) (Note 2) STOP WAIT XIN clock stopped, XCIN clock oscillating, Frequency synthesizer clock stopped, CPMA = BC, FSC = 68 FSC0 “0”←→“1” φ = f(XCIN/2) XIN clock stopped, XCIN clock oscillating, Frequency synthesizer clock oscillating, (Note 4) CPMA = BC, FSC = 49 CPMA6 “0”←→“1” φ = f(PLL)/2 XIN clock stopped, XCIN clock oscillating, Frequency synthesizer clock oscillating, CPMA = FC, FSC = 49 WAIT Notes 1 : Switch the mode by the allows shown between the mode blocks. (Do not switch between the modes directly without an allow.) 2 : In Stop mode, though the frequency synthesizer is not automatically disabled, the oscillator which sends clocks to the frequency synthesizer stops. Set the system clock and disable the frequency synthesizer before execution of the STP instruction. 3 : φ = f(XIN)/2 can be also used by setting the XIN divider select bit (CCR7) to “1”. Then this diagram also applies to that case. 4 : The frequency synthesizer’s input can be selected between XIN input and XCIN input regardless of the system clock. This diagram assumes the frequency synthesizer’s input to be the system clock. Enable the oscillator to be used for the frequency synthesizer’s input before enabling the frequency synthesizer. 5 : Select the XCIN input as the frequency synthesizer’s input by setting the frequency synthesizer input bit (FSC3) to “1” before stopping XIN oscillation. Remarks : This diagram assumes that: •Stack page is page 1 •In single-chip mode (Depending on the CPU mode register A) •φ expresses the internal clock. Fig. 68 State transitions of clock Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 73 of 135 7641 Group PROCESSOR MODE Single-chip mode, memory expansion mode, and microprocessor mode which is only in the mask ROM version can be selected by using the Processor Mode Bits of CPU mode register A (bits 0 and 1 of address 000016). In the memory expansion mode and microprocessor mode, a memory can be expanded externally via ports P0 to P3. In these modes, ports P0 to P3 lose their I/O port functions and become bus pins. The port direction registers corresponding to those ports become external memory areas. M37641M8 000016 000816 001016 007016 Internal RAM SFR area 000016 000816 001016 007016 SFR area SFR area SFR area Internal RAM Table 9 Port functions in memory expansion mode and microprocessor mode Port Name Port P0 Port P1 Port P2 Port P3 Function Outputs low-order 8 bits of address. Outputs high-order 8 bits of address. Operates as I/O pins for data D7 to D0 (including instruction code). P30 is the RDY input pin. P31 and P32 function only as output pins P33 is the DMAOUT output pin. P34 is the φOUT output pin. P35 is the SYNCOUT output pin. P36 is the WR output pin, and P37 is the RD output pin. P40 is the EDMA pin. 047016 047016 800016 Internal ROM FFFF16 FFFF16 Memory expansion mode Microprocessor mode The shaded areas are external areas. Port P4 (1) Single-chip mode Select this mode by resetting the MCU with CNVSS connected to VSS. M37641F8 000016 SFR area (2) Memory expansion mode Select this mode by setting the Processor Mode Bits (b1, b0) to “01” in software with CNVSS connected to VSS. This mode enables external memory expansion while maintaining the validity of the internal ROM. 000816 001016 007016 Internal RAM SFR area (3) Microprocessor mode Select this mode by resetting the MCU with CNVSS connected to VCC, or by setting the Processor Mode Bits (b1, b0) to “10” in software with CNVSS connected to VSS. In the microprocessor mode, the internal ROM is no longer valid and an external memory must be used. Do not set this mode in the flash memory version. 0A7016 100016 Reserved area 800016 Internal ROM FFFF16 Memory expansion mode The shaded areas are external areas. Fig. 69 Memory maps in processor modes other than singlechip mode Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 74 of 135 7641 Group b7 b0 1 CPU mode register A (address 000016) CPMA Processor mode bits b1b0 0 0: Single-chip mode 0 1: Memory expansion mode 1 0: Microprocessor mode (Note 1) 1 1: Not available Stack page select bit 0: Page 0 1: Page 1 Fix to “1”. Sub-clock (XCIN-XCOUT) control bit 0: Stopped 1: Oscillating Main clock (XIN-XOUT) control bit 0: Oscillating 1: Stopped Internal system clock select bit (Note 2) 0: External clock (XIN-XOUT or XCIN-XCOUT) 1: fSYN External clock select bit 0: XIN-XOUT 1: XCIN-XCOUT Notes 1: This is not available in the flash memory version. 2: When (CPMA 6, 7) = (0, 0), the internal system clock can be selected between f(XIN) or f(XIN)/2 by CCR7. The internal clock φ is the internal system clock divided by 2. Fig. 70 Structure of CPU mode register A b7 b0 10 CPU mode register B (address 000116) CPMB Slow memory wait select bits b1b0 0 0: No wait 0 1: One-time wait 1 0: Two-time wait 1 1: Three-time wait Slow memory wait mode select bits b3b2 0 0: Software wait 0 1: Not available 1 0: RDY wait 1 1: Software wait plus RDY input anytime wait Expanded data memory access bit 0: EDMA output disabled 1: EDMA output enabled HOLD function enable bit 0: HOLD function disabled 1: HOLD function enabled Resereved bit (“0” at read/write) Fix to “1”. Fig. 71 Structure of CPU mode register B Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 75 of 135 7641 Group Slow Memory Wait The 7641 Group is equipped with the slow memory wait function (Software wait, RDY wait, and Extended RDY wait: software wait plus RDY input anytime wait) for easier interfacing with external devices that have long access times. The slow memory wait function can be enabled in the memory expansion mode and microprocessor mode. The appropriate wait mode is selected by setting bits 0 to 3 of CPU mode register B (address 000116). This function can extend the read cycle or write cycle only for access to an external memory. However, this wait function cannot be enabled for access to addresses 000816 to 000F16. (2) RDY wait RDY Wait is selected by setting “ 10 ” t o the Slow Memory Wait Mode Select Bits of CPU mode register B (address 000116). When a fixed time of “L” is input to the RDY pin at the beginning of a read/write cycle (before φ cycle falls), the MCU goes to the RDY state. The read/write cycle can then be extended by one to three φ cycles. The number of φ cycles to be added can be selected by the Slow Memory Wait Bits. (3) Software wait + Extended RDY wait Extended RDY Wait is selected by setting “ 11 ” t o the Slow Memory Wait Mode Select Bits of CPU mode register B (address 000116). The read/write cycle can be extended when a fixed time of “L” is input to the RDY pin at the beginning of a read/write cycle (before φ cycle falls). The RDY pin state is checked continually at each fall of φ cycle until the RDY pin goes to “H”. When “H” is input to the RDY pin, the wait is released within 1, 2, or 3 φ cycles (as selected with the Slow Memory Wait Bits). (1) Software wait The software wait is selected by setting “00” to the Slow Memory Wait Mode Select Bits of CPU mode register B (address 000116). Read/write cycles (“L” width of RD pin/WR pin) can be extended by one to three φ cycles. The number of cycles to be extended can be selected with the Slow Memory Wait Select Bits. When the software wait function is selected, the RDY pin status becomes invalid. XIN φ OUT ADOUT RD WR No wait CPMB = 0016 1-cycle software wait CPMB = 0116 2-cycle software wait CPMB = 0216 3-cycle software wait CPMB = 0316 Note: This diagram assumes φ = XIN/2. Fig. 72 Software wait timing diagram XIN φ OUT ADOUT RD WR RDY No wait CPMB = 0816 1-cycle RDY wait CPMB = 0916 2-cycle RDY wait CPMB = 0A16 3-cycle RDY wait CPMB = 0B16 tsu tsu tsu tsu tsu tsu Note: This diagram assumes φ = XIN/2. Fig. 73 RDY wait timing diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 76 of 135 7641 Group XIN φOUT ADOUT RD WR tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu RDY No wait CPMB = 0C16 1-cycle extended RDY wait CPMB = 0D16 2-cycle extended RDY wait CPMB = 0E16 XIN φOUT ADOUT RD WR tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu tsu RDY 2-cycle extended RDY wait CPMB = 0E16 3-cycle extended RDY wait CPMB = 0F16 Note: This diagram assumes φ = XIN/2. Fig. 74 Extended RDY wait (software wait plus RDY input anytime wait) timing diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 77 of 135 7641 Group HOLD Function The HOLD function is used for systems that consist of external circuits that access MCU buses without use of the CPU (Central Processing Unit). The HOLD function is used to generate the timing in which the MCU will relinquish the bus from the CPU to the external circuits. To use the HOLD function, set the HOLD function Enable Bit of CPU mode register B (address 000116) to “1”. This function can be used with both the HOLD pin and the HLDA pin. The HOLD signal is a signal from an external circuit requesting the MCU to relinquish use of the bus. When “L” level is input, the MCU goes to the HOLD state and remains so while the pin is at “L”. The oscillator does not stop oscillating during the HOLD state, therefore allowing the internal peripheral functions to operate during this time. When the MCU relinquishes use of the bus, “L” level is output from the HLDA pin. The MCU makes ports P0 and P1 (address buses) and port P2 (data bus) tri-state outputs and holds port P37 (RD pin) and port P36 (WR pin) “H” level. Port P34 (φ OUT pin) continues to oscillate. This function is not valid when the MCU is using the IBF1 function with the HLDA pin. Expanded Data Memory Access In Expanded Data Memory Access Mode, the MCU can access a data area larger than 64 Kbytes with the LDA ($zz), Y (indirect Y) instruction and the STA ($zz), Y (indirect Y) instruction. To use this mode, set the Expanded Data Memory Access Bit of CPU mode register B (address 000116) to “1”. In this case, port P40 (EDMA pin) goes “L” level during the read/write cycle of the LDA or STA instruction. The determination of which bank to access is done by using an I/ O port to represent expanded addresses exceeding address bus AB15. For example, when accessing 4 banks, use two I/O ports to represent address buses AB16 and AB17. XIN φ OUT RD, W R ADDROUT DATAIN/OUT tsu(HOLD-φ) HOLD HLDA td(φ-HLDAL) td(φ-HLDAH) th(φ-HOLD) Note: This diagram assumes φ = XIN/2. Fig. 75 Hold function timing diagram Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 78 of 135 7641 Group φ SYNCOUT RD WR Address Data EDMA PC PC +1 Op code BAL, 00 BAL BAL+1, 00 ADL + Y, ADH ADL + Y, ADH + C PC + 2 Next Op code ADL ADH Invalid Data Fig. 76 STA ($ zz), Y instruction sequence when EDMA enabled φ SYNCOUT RD WR Address Data EDMA PC PC +1 Op code BAL, 00 BAL BAL+1, 00 ADL + Y, ADH ADL + Y, ADH + C PC + 2 Next Op code ADL ADH Invalid Data Fig. 77 LDA ($ zz), Y instruction sequence when EDMA enabled and T flag = “0” φ SYNCOUT RD WR Address Data EDMA Fig. 78 LDA ($ zz), Y instruction sequence when EDMA enabled and T flag = “1” PC PC +1 Op code BAL, 00 BAL BAL+1, 00 ADL + Y, ADH ADL + Y, ADH + C X, 00 Invalid PC + 2 Data Next Op code ADL ADH Invalid Data Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 79 of 135 7641 Group ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Table 10 Absolute maximum ratings Parameter Symbol Power source voltage VCC Analog power source voltage AVcc, Ext.Cap AVCC Input voltage P00–P07, P10–P17, P20–P27, VI P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 Input voltage RESET, XIN, XCIN VI Input voltage CNVSS Mask ROM version VI Flash memory version Input voltage USB D+, USB D– VI Output voltage P00–P07, P10–P17, P20–P27, VO P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87, XOUT, XCOUT, LPF Output voltage USB D+, USB D–, Ext. Cap VO Power dissipation (Note) Pd Operating temperature Topr Storage temperature Tstg Conditions All voltages are based on Vss. Output transistors are cut off. Ratings –0.3 to 6.5 –0.3 to VCC+0.3 –0.3 to VCC+0.3 Unit V V V –0.3 to VCC+0.3 –0.3 to Vcc + 0.3 –0.3 to 6.5 –0.5 to 3.8 –0.3 to VCC+0.3 V V V V V Ta = 25°C –0.5 to 3.8 750 –20 to 70 –40 to 125 V mW °C °C Note: The maximum power dissipation depends on the MCU’s power dissipation and the specific heat consumption of the package. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 80 of 135 7641 Group Recommended Operating Conditions In Vcc = 5 V Table 11 Recommended operating conditions (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Limits Symbol Parameter Min. Typ. Max. VCC Power source voltage 4.15 5.0 5.25 AVcc Analog reference voltage 4.15 5.0 VCC VSS Power source voltage 0 AVSS Analog reference voltage 0 VIH “H” input voltage P00–P07, P10–P17, P20–P27, VCC 0.8VCC P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 VIH “H” input voltage (Selecting VIHL level input) P20–P27 VCC 0.5VCC VIH “H” input voltage (Selecting TTL level input for MBI input) VCC 2.0 P54–P57, P60–P67, P72 0.8VCC VCC VIH “H” input voltage RESET, XIN, XCIN, CNVss 2.0 3.8 VIH “H” input voltage USB D+, USB D– 0 0.2VCC VIL “L” input voltage P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 VIL “L” input voltage (Selecting VIHL level input) P20–P27 0.16VCC 0 VIL “L” input voltage (Selecting TTL level input for MBI input) 0.8 0 P54–P57, P60–P67, P72 0.2VCC 0 VIL “L” input voltage RESET, XIN, XCIN, CNVss 0.8 VIL “L” input voltage USB D+, USB D– –80 ΣIOH(peak) “H” total peak output current P00–P07, P10–P17, P20–P27, (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 80 ΣIOL(peak) “L” total peak output current P00–P07, P10–P17, P20–P27, (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 ΣIOH(avg) “H” total average output current P00–P07, P10–P17, P20–P27, –40 (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 40 ΣIOL(avg) “L” total average output current P00–P07, P10–P17, P20–P27, (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOH(peak) “H” peak output current P00–P07, P10–P17, P20–P27, –10 (Note 2) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOL(peak) “L” peak output current P00–P07, P10–P17, P20–P27, 10 (Note 2) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOH(avg) “H” average output current P00–P07, P10–P17, P20–P27, –5.0 (Note 3) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOL(avg) “L” average output current P00–P07, P10–P17, P20–P27, 5.0 (Note 3) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 f(CNTR0) Timer X input frequency (Note 4) 5.0 f(CNTR1) Timer Y input frequency (Note 4) 5.0 f(XIN) Main clock input frequency (Notes 4, 5) 24 1 f(XCIN) Sub-clock input frequency (Notes 4, 6) 50/5.0 32.768 Unit V V V V V V V V V V V V V V mA mA mA mA mA mA mA mA MHz MHz MHz kHz/MHz Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 81 of 135 7641 Group Notes 1: The total peak output current is the peak value of the peak currents flowing through all the applicable ports. The total average output current is the average value measured over 100 ms flowing through all the applicable ports. 2: The peak output current is the peak current flowing in each port. 3: The average output current is an average value measured over 100 ms. 4: The duty of oscillation frequency is 50 %. 5: Connect a ceramic resonator or a quartz-crystal oscillator between the XIN and XOUT pins. Its maximum oscillation frequency must be 24 MHz. However, make sure to set φ to 12 MHz or slower. More faster clocks are required as the f(XIN) when using the frequency synthesizer as possible. 6: Connect a ceramic resonator or a quartz-crystal oscillator between the XCIN and XCOUT pins. Its maximum oscillation frequency must be 50 kHz. Input an external clock having 5 MHz frequency (max.) from the XCIN pin. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 82 of 135 7641 Group Electrical Characteristics In Vcc = 5 V Table 12 Electrical characteristics (1) (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol VOH Parameter “H” output voltage P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “H” output voltage USB D+, USB DTest conditions IOH = –10 mA Min. VCC–2.0 Limits Typ. Max. Unit V VOH VOL “L” output voltage P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “L” output voltage USB D+, USB D- USB+, and USB- pins pull-down via a resistor of 15 kΩ ± 5 % USB+ pin pull-up to Ext. Cap. pin via a resistor of 1.5 kΩ ± 5 % IOL = 10 mA 2.8 3.6 V 2.0 V VOL USB+, and USB- pins pull-down via a resistor of 15 kΩ ± 5 % USB+ pin pull-up to Ext. Cap. pin via a resistor of 1.5 kΩ ± 5 % 0.5 0.3 V VT+–VT- VT+–VT- VT+–VTIIH IIH IIH IIH IIL IIL IIL IIL IIL IIL Hysteresis CNTR0, CNTR1, INT0, INT1, RDY, HOLD, P20–P27 Hysteresis URXD1, URXD2 (SCLK), CTS2 (SRXD), SRDY, CTS1 Hysteresis RESET “H” input current P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “H” input current RESET, CNVSS “H” input current XIN “H” input current XCIN “L” input current P00–P07, P10–P17, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “L” input current RESET “L” input current CNVSS “L” input current XIN “L” input current XCIN “L” input current P20–P27 V 0.5 V 0.5 VI = VCC 5.0 V µA 9.0 VI = VSS 5.0 20 5.0 –5.0 µA µA µA µA –9.0 VI = VSS Pull-ups “off” VCC = 5.0 V, VI = VSS Pull-ups “on” When clock is stopped –5.0 –20 –20 –5.0 –5.0 –140 5.25 µA µA µA µA µA µA V –30 2.0 –65 VRAM Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 83 of 135 7641 Group In Vcc = 5 V Table 13 Electrical characteristics (2) (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol ICC Parameter Power source current (Output transistor is isolated.) Test conditions Normal mode (Note 1) f(XIN) = 24 MHz, φ = 12 MHz USB operating Frequency synthesizer ON Wait mode (Note 2) f(XIN) = 24 MHz, φ = 12 MHz USB block enabled, USB clock stopped, Frequency synthesizer ON Wait mode (Note 3) f(XCIN) = 32 kHz, φ = 16 kHz USB block disabled Frequency synthesizer OFF USB transceiver DC-DC converter OFF Stop mode USB transceiver DC-DC converter ON Low current mode (USBC3 = “1”) Stop mode USB transceiver DC-DC converter OFF Ta = 25 °C Stop mode USB transceiver DC-DC converter OFF Ta = 70 °C Min. Limits Typ. 40 Max. 90 Unit mA 5.0 11 mA 10 µA 100 250 µA 1.0 µA µA 10 Notes 1: Operating in single-chip mode Clock input from XIN pin (XOUT oscillator stopped) USB operating with USB transceiver DC-DC converter enabled Operating functions: Frequency synthesizer, CPU, two UARTs, DMAC, Timers and Count source generator Disabled functions: Master CPU bus interface and Serial I/O 2: Operating in single-chip mode with Wait mode Clock input from XIN pin (XOUT oscillator stopped) USB suspended due to USB clock stopped with USB transceiver DC-DC converter enabled Operating functions: Frequency synthesizer, Timers and Count source generator Disabled functions: CPU, two UARTs, DMAC, Master CPU bus interface and Serial I/O 3: Operating in single-chip mode with Wait mode XIN - XOUT oscillator stopped Clock input from XCIN pin (XCOUT oscillator stopped) USB stopped, USB clock stopped and USB transceiver DC-DC converter disabled Operating functions: Timers and Count source generator Disabled functions: Frequency synthesizer, CPU, two UARTs, DMAC, Master CPU bus interface and Serial I/O Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 84 of 135 7641 Group Timing Requirements In Vcc = 5 V Table 14 Timing requirements (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tW(RESET) tC(XIN) tWH(XIN) tWL(XIN) tC(XCIN) tWH(XCIN) tWL(XCIN) tC(INT) tWH(INT) tWL(INT) tC(CNTRI) tWH(CNTRI) tWL(CNTRI) td(φ -TOUT) td(φ -CNTR0) tC(CNTRE0) tWH(CNTRE0) tWL(CNTRE0) td(φ -CNTR1) tC(CNTRE1) tWH(CNTRE1) tWL(CNTRE1) tC(SCLKE) tWH(SCLKE) tWL(SCLKE) tsu(SRXD-SCLKE) th(SCLKE-SRXD) td(SCLKE-STXD) tv(SCLKE-SRDY) tc(SCLKI) tWH(SCLKI) tWL(SCLKI) tsu(SRXD-SCLKI) th(SCLKI-SRXD) td(SCLKI-STXD) Parameter Reset input “L” pulse width Main clock input cycle time (Note) Main clock input “H” pulse width Main clock input “L” pulse width Sub-clock input cycle time Sub-clock input “H” pulse width Sub-clock input “L” pulse width INT0, INT1 input cycle time INT0, INT1 input “H” pulse width INT0, INT1 input “L” pulse width CNTR0, CNTR1 input cycle time CNTR0, CNTR1 input “H” pulse width CNTR0, CNTR1 input “L” pulse width Timer TOUT delay time Timer CNTR0 delay time (Pulse output mode) Timer CNTR0 input cycle time (Event counter mode) Timer CNTR0 input “H” pulse width (Event counter mode) Timer CNTR0 input “L” pulse width (Event counter mode) Timer CNTR1 delay time (Pulse output mode) Timer CNTR1 input cycle time (Event counter mode) Timer CNTR1 input “H” pulse width (Event counter mode) Timer CNTR1 input “L” pulse width (Event counter mode) Serial I/O external clock input cycle time Serial I/O external clock input “H” pulse width Serial I/O external clock input “L” pulse width Serial I/O input setup time (external clock) Serial I/O input hold time (external clock) Serial I/O output delay time (external clock) Serial I/O SRDY valid time (external clock) Serial I/O internal clock output cycle time Serial I/O internal clock output “H” pulse width Serial I/O internal clock output “L” pulse width Serial I/O input setup time (internal clock) Serial I/O input hold time (internal clock) Serial I/O output delay time (internal clock) Min. 2 41.66 0.4•tc(XIN) 0.4•tc(XIN) 200 0.4•tc(XCIN) 0.4•tc(XCIN) 200 90 90 200 80 80 Limits Typ. Max. Unit µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 15 15 200 0.4•tc(CNTRE0) 0.4•tc(CNTRE0) 15 200 0.4•tc(CNTRE1) 0.4•tc(CNTRE1) 400 190 180 15 10 25 26 166.66 0.5•tc(SCLKI) – 5 0.5•tc(SCLKI) – 5 20 5 5 Note: Make sure not to exceed 12 MHz of φ, in other words, tc(φ) ≥ 83.33 ns). For example, set bit 7 of the clock control register (CCR) to “0” in the case of tc(XIN) < 41.66 ns. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 85 of 135 7641 Group In Vcc = 5 V Table 15 Master CPU bus interface (MBI; RD, WR separate type) (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tsu(S-R) tsu(S-W) th(R-S) th(W-S) tsu(A-R) tsu(A-W) th(R-A) th(W-A) tw(R) tw(W) tsu(D-W) th(W-D) ta(R-D) tv(R-D) tv(R-OBF) td(W-IBF) Parameter S0, S1 setup time for read S0, S1 setup time for write S0, S1 hold time for read S0, S1 hold time for write A0 setup time for read A0 setup time for write A0 hold time for read A0 hold time for write Read pulse width Write pulse width Data input setup time before write Data input hold time after write Data output enable time after read Data output disable time after read OBF output transmission time after read IBF output transmission time after write Min. 0 0 0 0 10 10 0 0 50 50 25 0 10 40 40 Limits Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 40 In Vcc = 5 V Table 16 Master CPU bus interface (MBI; R/W type) (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tsu(S-E) th(E-S) tsu(A-E) th(E-A) tsu(RW-E) th(E-RW) tw(E) tw(E-E) tsu(D-E) th(E-D) ta(E-D) tv(E-D) tv(E-OBF) td(E-IBF) Parameter S0, S1 setup time S0, S1 hold time A0 setup time A0 hold time R/W setup time R/W hold time Enable pulse width Enable pulse interval Data input setup time before write Data input hold time after write Data output enable time after read Data output disable time after read OBF output transmission time after E inactive IBF output transmission time after E inactive Min. 0 0 10 0 10 10 50 50 25 0 10 40 40 Limits Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns 40 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 86 of 135 7641 Group In Vcc = 5 V Table 17 Timing requirements and switching characteristics in memory expansion and microprocessor modes (Vcc = 4.15 to 5.25 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tC(φ) tWH(φ) tWL(φ) td(φ -AH) tv(φ -AH) td(φ -AL) tv(φ -AL) td(φ -WR) tv(φ -WR) td(φ -RD) tv(φ -RD) td(φ -SYNC) tv(φ -SYNC) td(φ -DMA) tv(φ -DMA) tsu(RDY- φ) th(φ -RDY) tsu(HOLD- φ) th(φ -HOLD) td(φ -HLDAL) td(φ -HLDAH) tsu(DB- φ) th(φ -DB) td(φ -DB) tV(φ -DB) td(φ -EDMA) tv(φ -EDMA) tWL(WR) (Note 2) tWL(RD) (Note 2) td(AH-WR) td(AL-WR) tv(WR-AH) tv(WR-AL) td(AH-RD) td(AL-RD) tv(RD-AH) tv(RD-AL) tsu(RDY-WR) th(WR-RDY) tsu(RDY-RD) th(RD-RDY) tsu(DB-RD) th(RD-DB) td(WR-DB) tv(WR-DB) tv(WR-EDMA) tv(RD-EDMA) tr(D+), tr(D-) tf(D+), tf(D-) Parameter φ clock cycle time φ clock “H” pulse width φ clock “L” pulse width AB15–AB8 delay time AB15–AB8 valid time AB7–AB0 delay time AB7–AB0 valid time WR delay time WR valid time RD delay time RD valid time SYNCOUT delay time SYNCOUT valid time DMAOUT delay time DMAOUT valid time RDY setup time RDY hold time HOLD setup time HOLD hold time HOLD “L” delay time HOLD “H” delay time Data bus setup time Data bus hold time Data bus delay time Data bus valid time (Note 1) EDMA delay time EDMA valid time WR pulse width RD pulse width AB15–AB8 valid time before WR AB7–AB0 valid time before WR AB15–AB8 valid time after WR AB7–AB0 valid time after WR AB15–AB8 valid time before RD AB7–AB0 valid time before RD AB15–AB8 valid time after RD AB7–AB0 valid time after RD RDY setup time before WR RDY hold time after WR RDY setup time before RD RDY hold time after RD Data bus setup time before RD Data bus hold time after RD Data bus delay time before WR Data bus valid time after WR (Note 1) EDMA delay time after WR EDMA valid time after RD USB output rise time, CL = 50 pF USB output fall time, CL = 50 pF Min. 83.33 0.5•tc(φ) – 5 0.5•tc(φ) – 5 5 33 5 6 3 6 3 6 4 25 5 21 0 21 0 25 25 7 0 22 13 9 4 0.5•tc(φ) – 5 0.5•tc(φ) – 5 0.5•tc(φ) – 28 0.5•tc(φ) – 30 0 0 0.5•tc(φ) – 28 0.5•tc(φ) – 30 0 0 27 0 27 0 13 0 20 10 2 2 4 4 Limits Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 31 20 20 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 87 of 135 7641 Group Notes 1: Test conditions: IOHL = ± 5mA, CL = 50 pF 2: twL(RD) = ((n + 0.5) • tc(PHI)) – 5 ns (n = wait number) twL(WR) = ((n + 0.5) • tc(PHI)) – 5 ns (n = wait number) For example, two software waits, PHI = 12 MHz operating twL(RD) = 2.5 • tc(PHI) – 5 ns = 203.33 ns Recommended Operating Conditions In Vcc = 3 V Table 18 Recommended operating conditions (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Limits Symbol Parameter Min. Max. Typ. VCC Power source voltage 3.0 3.6 3.3 AVcc Analog reference voltage 3.0 VCC 3.3 VSS Power source voltage 0 AVSS Analog reference voltage 0 Ext. Cap. DC-DC converter voltage 3.6 3.0 3.3 VIH “H” input voltage P00–P07, P10–P17, P20–P27, 0.8VCC VCC P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 VIH “H” input voltage (Selecting VIHL level input) P20–P27 VCC 0.5VCC VIH “H” input voltage RESET, XIN, XCIN, CNVss VCC 0.8VCC VIH “H” input voltage USB D+, USB D– 2.0 VIL “L” input voltage P00–P07, P10–P17, P20–P27, 0.2VCC 0 P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 VIL “L” input voltage (Selecting VIHL level input) P20–P27 0 0.16VCC VIL “L” input voltage RESET, XIN, XCIN, CNVss 0 0.2VCC VIL “L” input voltage USB D+, USB D– 0.8 ΣIOH(peak) “H” total peak output current P00–P07, P10–P17, P20–P27, –80 (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 ΣIOL(peak) “L” total peak output current P00–P07, P10–P17, P20–P27, 80 (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 ΣIOH(avg) “H” total average output current P00–P07, P10–P17, P20–P27, –40 (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 ΣIOL(avg) “L” total average output current P00–P07, P10–P17, P20–P27, 40 (Note 1) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOH(peak) “H” peak output current P00–P07, P10–P17, P20–P27, –10 (Note 2) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOL(peak) “L” peak output current P00–P07, P10–P17, P20–P27, 10 (Note 2) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 IOH(avg) “H” average output current P00–P07, P10–P17, P20–P27, –5.0 (Note 3) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 5.0 IOL(avg) “L” average output current P00–P07, P10–P17, P20–P27, (Note 3) P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 f(CNTR0) Timer X input frequency (Note 4) 5.0 f(CNTR1) Timer Y input frequency (Note 4) 5.0 f(XIN) Main clock input frequency (Notes 4, 5) 24 1 f(XCIN) Sub-clock input frequency (Notes 4, 6) 50/5.0 32.768 Unit V V V V V V V V V V V V V mA mA mA mA mA mA mA mA mA MHz MHz MHz kHz/MHz Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 88 of 135 7641 Group Notes 1: The total peak output current is the peak value of the peak currents flowing through all the applicable ports. The total average output current is the average value measured over 100 ms flowing through all the applicable ports. 2: The peak output current is the peak current flowing in each port. 3: The average output current is an average value measured over 100 ms. 4: The duty of oscillation frequency is 50 %. 5: Connect a ceramic resonator or a quartz-crystal oscillator between the XIN and XOUT pins. Its maximum oscillation frequency must be 24 MHz. However, make sure to set φ to 6 MHz or slower. More faster clocks are required as the f(XIN) when using the frequency synthesizer as possible. 6: Connect a ceramic resonator or a quartz-crystal oscillator between the XCIN and XCOUT pins. Its maximum oscillation frequency must be 50 kHz. Input an external clock having 5 MHz (max.) frequency from the XCIN pin. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 89 of 135 7641 Group Electrical Characteristics In Vcc = 3 V Table 19 Electrical characteristics (1) (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol VOH Parameter “H” output voltage P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “H” output voltage USB D+, USB DTest conditions IOH = –1 mA Min. VCC–1.0 Limits Typ. Max. Unit V VOH VOL VOL “L” output voltage P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “L” output voltage USB D+, USB D- USB+, and USB- pins pull-down via a resistor of 15 kΩ ± 5 % USB+ pin pull-up to Ext. Cap. pin via a resistor of 1.5 kΩ ± 5 % IOL = 1 mA 2.8 3.6 V 1.0 V USB+, and USB- pins pull-down via a resistor of 15 kΩ ± 5 % USB+ pin pull-up to Ext. Cap. pin via a resistor of 1.5 kΩ ± 5 % 0 0.3 V VT+–VT- VT+–VT- VT+–VTIIH IIH IIH IIH IIL IIL IIL IIL IIL IIL Hysteresis CNTR0, CNTR1, INT0, INT1, RDY, HOLD, P20–P27 Hysteresis URXD1, URXD2 (SCLK), CTS2 (SRXD), SRDY, CTS1 Hysteresis RESET “H” input current P00–P07, P10–P17, P20–P27, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “H” input current RESET, CNVSS “H” input current XIN “H” input current XCIN “L” input current P00–P07, P10–P17, P30–P37, P40–P44, P50–P57, P60–P67, P70–P74, P80–P87 “L” input current RESET “L” input current CNVSS “L” input current XIN “L” input current XCIN “L” input current P20–P27 0.3 V 0.3 V 0.3 VI = VCC 5.0 V µA 9.0 VI = VSS 5.0 20 5.0 –5.0 µA µA µA µA –9.0 VI = VSS Pull-ups “off” VCC = 3.0 V, VI = VSS Pull-ups “on” When clock is stopped –5.0 –20 –20 –5.0 –5.0 –50 µA µA µA µA µA µA V –10 2.0 –20 VRAM Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 90 of 135 7641 Group In Vcc = 3 V Table 20 Electrical characteristics (2) (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Limits Symbol Parameter Test conditions Min. Typ. Normal mode (Note 1) ICC Power source current 25 f(XIN) = 24 MHz, φ = 6 MHz (Output transistor is USB operating isolated.) Frequency synthesizer ON Wait mode (Note 2) 2.5 f(XIN) = 24 MHz, φ = 6 MHz USB block enabled, USB clock stopped, Frequency synthesizer ON Wait mode (Note 3) f(XCIN) = 32 kHz, φ = 16 kHz USB block disabled Frequency synthesizer OFF USB transceiver DC-DC converter OFF Stop mode USB transceiver DC-DC converter OFF Ta = 25 °C Stop mode USB transceiver DC-DC converter OFF Ta = 70 °C Notes 1: Operating in single-chip mode Clock input from XIN pin (XOUT oscillator stopped) USB operating with USB transceiver DC-DC converter enabled Operating functions: Frequency synthesizer, CPU, two UARTs, DMAC, Timers and Count source generator Disabled functions: Master CPU bus interface and Serial I/O 2: Operating in single-chip mode with Wait mode Clock input from XIN pin (XOUT oscillator stopped) USB suspended due to USB clock stopped with USB transceiver DC-DC converter enabled Operating functions: Frequency synthesizer, Timers and Count source generator Disabled functions: CPU, two UARTs, DMAC, Master CPU bus interface and Serial I/O 3: Operating in single-chip mode with Wait mode XIN - XOUT oscillator stopped Clock input from XCIN pin (XCOUT oscillator stopped) USB stopped, USB clock stopped and USB transceiver DC-DC converter disabled Operating functions: Timers and Count source generator Disabled functions: Frequency synthesizer, CPU, two UARTs, DMAC, Master CPU bus interface and Serial I/O Max. 45 Unit mA 6 mA 6 µA 1.0 µA 10 µA Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 91 of 135 7641 Group Timing Requirements In Vcc = 3 V Table 21 Timing requirements (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tW(RESET) tC(XIN) tWH(XIN) tWL(XIN) tC(XCIN) tWH(XCIN) tWL(XCIN) tC(INT) tWH(INT) tWL(INT) tC(CNTRI) tWH(CNTRI) tWL(CNTRI) td(φ -TOUT) td(φ -CNTR0) tC(CNTRE0) tWH(CNTRE0) tWL(CNTRE0) td(φ -CNTR1) tC(CNTRE1) tWH(CNTRE1) tWL(CNTRE1) tC(SCLKE) tWH(SCLKE) tWL(SCLKE) tsu(SRXD-SCLKE) th(SCLKE-SRXD) td(SCLKE-STXD) tv(SCLKE-SRDY) tc(SCLKI) tWH(SCLKI) tWL(SCLKI) tsu(SRXD-SCLKI) th(SCLKI-SRXD) td(SCLKI-STXD) Parameter Reset input “L” pulse width Main clock input cycle time (Note) Main clock input “H” pulse width Main clock input “L” pulse width Sub-clock input cycle time Sub-clock input “H” pulse width Sub-clock input “L” pulse width INT0, INT1 input cycle time INT0, INT1 input “H” pulse width INT0, INT1 input “L” pulse width CNTR0, CNTR1 input cycle time CNTR0, CNTR1 input “H” pulse width CNTR0, CNTR1 input “L” pulse width Timer TOUT delay time Timer CNTR0 delay time (Pulse output mode) Timer CNTR0 input cycle time (Event counter mode) Timer CNTR0 input “H” pulse width (Event counter mode) Timer CNTR0 input “L” pulse width (Event counter mode) Timer CNTR1 delay time (Pulse output mode) Timer CNTR1 input cycle time (Event counter mode) Timer CNTR1 input “H” pulse width (Event counter mode) Timer CNTR1 input “L” pulse width (Event counter mode) Serial I/O external clock input cycle time Serial I/O external clock input “H” pulse width Serial I/O external clock input “L” pulse width Serial I/O input setup time (external clock) Serial I/O input hold time (external clock) Serial I/O output delay time (external clock) Serial I/O SRDY valid time (external clock) Serial I/O internal clock output cycle time Serial I/O internal clock output “H” pulse width Serial I/O internal clock output “L” pulse width Serial I/O input setup time (internal clock) Serial I/O input hold time (internal clock) Serial I/O output delay time (internal clock) Min. 2 41.66 0.4•tc(XIN) 0.4•tc(XIN) 200 0.4•tc(XCIN) 0.4•tc(XCIN) 250 110 110 250 110 110 Limits Typ. Max. Unit µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 17 16 250 0.4•tc(CNTRE0) 0.4•tc(CNTRE0) 15 250 0.4•tc(CNTRE1) 0.4•tc(CNTRE1) 450 220 190 20 15 34 35 300 0.5•tc(SCLKI) – 5 0.5•tc(SCLKI) – 5 20 5 5 Note: Make sure not to exceed 6 MHz of φ, in other words, tc(φ) ≥ 166.66 ns). Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 92 of 135 7641 Group In Vcc = 3 V Table 22 Master CPU bus interface (MBI; RD, WR separate type) (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tsu(S-R) tsu(S-W) th(R-S) th(W-S) tsu(A-R) tsu(A-W) th(R-A) th(W-A) tw(R) tw(W) tsu(D-W) th(W-D) ta(R-D) tv(R-D) tv(R-OBF) td(W-IBF) Parameter S0, S1 setup time for read S0, S1 setup time for write S0, S1 hold time for read S0, S1 hold time for write A0 setup time for read A0 setup time for write A0 hold time for read A0 hold time for write Read pulse width Write pulse width Data input setup time before write Data input hold time after write Data output enable time after read Data output disable time after read OBF output transmission time after read IBF output transmission time after write Min. 0 0 0 0 10 10 0 0 80 80 35 0 10 50 50 Limits Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 65 In Vcc = 3 V Table 23 Master CPU bus interface (MBI; R/W type) (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tsu(S-E) th(E-S) tsu(A-E) th(E-A) tsu(RW-E) th(E-RW) tw(E) tw(E-E) tsu(D-E) th(E-D) ta(E-D) tv(E-D) tv(E-OBF) td(E-IBF) Parameter S0, S1 setup time S0, S1 hold time A0 setup time A0 hold time R/W setup time R/W hold time Enable pulse width Enable pulse interval Data input setup time before write Data input hold time after write Data output enable time after read Data output disable time after read OBF output transmission time after E inactive IBF output transmission time after E inactive Min. 0 0 10 0 10 10 80 80 35 0 10 50 50 Limits Typ. Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns 65 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 93 of 135 7641 Group In Vcc = 3 V Table 24 Timing requirements and switching characteristics in memory expansion and microprocessor modes (Vcc = 3.0 to 3.6 V, Vss = 0 V, Ta = –20 to 70°C, unless otherwise noted) Symbol tC(φ) tWH(φ) tWL(φ) td(φ -AH) tv(φ -AH) td(φ -AL) tv(φ -AL) td(φ -WR) tv(φ -WR) td(φ -RD) tv(φ -RD) td(φ -SYNC) tv(φ -SYNC) td(φ -DMA) tv(φ -DMA) tsu(RDY- φ) th(φ -RDY) tsu(HOLD- φ) th(φ -HOLD) td(φ -HLDAL) td(φ -HLDAH) tsu(DB- φ) th(φ -DB) td(φ -DB) tV(φ -DB) td(φ -EDMA) tv(φ -EDMA) tWL(WR) (Note 2) tWL(RD) (Note 2) td(AH-WR) td(AL-WR) tv(WR-AH) tv(WR-AL) td(AH-RD) td(AL-RD) tv(RD-AH) tv(RD-AL) tsu(RDY-WR) th(WR-RDY) tsu(RDY-RD) th(RD-RDY) tsu(DB-RD) th(RD-DB) td(WR-DB) tv(WR-DB) tv(WR-EDMA) tv(RD-EDMA) tr(D+), tr(D-) tf(D+), tf(D-) Parameter φ clock cycle time φ clock “H” pulse width φ clock “L” pulse width AB15–AB8 delay time AB15–AB8 valid time AB7–AB0 delay time AB7–AB0 valid time WR delay time WR valid time RD delay time RD valid time SYNCOUT delay time SYNCOUT valid time DMAOUT delay time DMAOUT valid time RDY setup time RDY hold time HOLD setup time HOLD hold time HOLD “L” delay time HOLD “H” delay time Data bus setup time Data bus hold time Data bus delay time Data bus valid time (Note 1) EDMA delay time EDMA valid time WR pulse width RD pulse width AB15–AB8 valid time before WR AB7–AB0 valid time before WR AB15–AB8 valid time after WR AB7–AB0 valid time after WR AB15–AB8 valid time before RD AB7–AB0 valid time before RD AB15–AB8 valid time after RD AB7–AB0 valid time after RD RDY setup time before WR RDY hold time after WR RDY setup time before RD RDY hold time after RD Data bus setup time before RD Data bus hold time after RD Data bus delay time after WR Data bus valid time after WR (Note 1) EDMA delay time after WR EDMA valid time after RD USB output rise time, CL = 50 pF USB output fall time, CL = 50 pF Min. 166.66 0.5•tc(φ) – 5 0.5•tc(φ) – 5 7 47 7 8 4 8 3 11 4 26 9 35 0 21 0 30 30 9 0 30 15 12 8 0.5•tc(φ) – 6 0.5•tc(φ) – 6 0.5•tc(φ) – 33 0.5•tc(φ) – 35 0 0 0.5•tc(φ) – 33 0.5•tc(φ) – 35 0 0 45 0 45 0 18 0 28 12 3 3 4 4 Limits Typ. Max. Unit µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 45 20 20 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 94 of 135 7641 Group Notes 1: Test conditions: IOHL = ± 5mA, CL = 50 pF 2: twL(RD) = ((n + 0.5) • tc(PHI)) – 5 ns (n = wait number) twL(WR) = ((n + 0.5) • tc(PHI)) – 5 ns (n = wait number) For example, two software waits, PHI = 12 MHz operating twL(RD) = 2.5 • tc(PHI) – 5 ns = 203.33 ns Measurement output pin 100 pF 1 kΩ Measurement output pin CMOS output 100 pF Fig. 79 Circuit for measuring output switching characteristics (1) N-channel open-drain output (Note) Note: This diagram applies when bit 7 of the serial I/O control register 1 is “1”. Fig. 80 Circuit for measuring output switching characteristics (2) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 95 of 135 7641 Group q Timing diagram [Interrupt] tC(CNTRI) tWH(CNTRI) tWL(CNTRI) 0.2VCC CNTR0, CNTR1 0.8VCC tC(INT) tWH(INT) tWL(INT) 0.2VCC INT0, INT1 [Input] RESET 0.8VCC tW(RESET) 0.2VCC 0.8VCC tC(XIN) tWH(XIN) tWL(XIN) 0.2VCC XIN 0.8VCC tC(XCIN) tWH(XCIN) tWL(XCIN) 0.2VCC XCIN 0.8VCC [Timer] φ 0.5VCC td(φ – TOUT) TOUT 0.5VCC td(φ – CNTR0,1) CNTR0, CNTR1 0.5VCC tC(CNTRE0,1) tWH(CNTRE0,1) tWL(CNTRE0,1) 0.2VCC CNTR0, CNTR1 0.8VCC Fig. 81 Timing diagram (1) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 96 of 135 7641 Group q Timing diagram [Serial I/O] tC(SCLKE,I) tWL(SCLKE, I) tWH(SCLKE,I) 0.8VCC SCLK 0.2VCC tsu(SRXD – SCLKE, I) th(SCLKE, I – SRXD) SRXD td(SCLKE, I – STXD) 0.8VCC 0.2VCC STXD 0.5VCC tv(SCLKE – SRDY) SRDY 0.8VCC Fig. 82 Timing diagram (2) tf(D+) tf(D-) tr(D+) tr(D-) 0.9VOH USBD+, USBD- 0.1VOH Fig. 83 Timing diagram (3) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 97 of 135 7641 Group q Timing diagram [Master CPU bus interface: R/W separate mode] tsu(A-R) th(R-A) A0 0.8VCC(2.0V) 0.2VCC(0.8V) tsu(S-R) th(R-S) S0, S1 0.2VCC(0.8V) tw(R) 0.8VCC(2.0V) 0.2VCC(0.8V) R DQ0 to DQ7 0.8VCC 0.2VCC ta(R-D) 0.8VCC 0.2VCC tv(R-D) tv(R-OBF) OBF 0.2VCC tsu(A-W) th(W-A) A0 0.8VCC(2.0V) 0.2VCC(0.8V) tsu(S-W) th(W-S) S0, S1 0.2VCC(0.8V) tw(W) 0.8VCC(2.0V) 0.2VCC(0.8V) W tsu(D-W) th(W-D) 0.8VCC 0.2VCC DQ0 to DQ7 0.8VCC 0.2VCC td(W-IBF) IBF 0.2VCC Note: This timing applies in the case of the master bus input level select bit (PTC7) = “1” (TTL level input) Fig. 84 Timing diagram (4) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 98 of 135 7641 Group q Timing diagram [Master CPU bus interface: R/W mode] tw(E-E) tw(E) 0.8VCC(2.0V) 0.2VCC(0.8V) E 0.2VCC(0.8V) A0 R/W tsu(A-E) 0.8VCC(2.0V) 0.2VCC(0.8V) th(E-A) tsu(S-E) th(E-S) S0, S1 0.2VCC(0.8V) DQ0 to DQ7 DQ0 to DQ7 0.8VCC 0.2VCC ta(E-D) tsu(D-E) 0.8VCC 0.2VCC 0.8VCC 0.2VCC tv(E-D) 0.8VCC 0.2VCC th(E-D) tv(E-OBF) td(E-IBF) OBF, IBF 0.2VCC Note: This timing applies in the case of the master bus input level select bit (PTC7) = “1” (TTL level input) Fig. 85 Timing diagram (5) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 99 of 135 7641 Group tC(φ) tWH(φ) tWL(φ) φ 0.5VCC td(φ-AH) tv(φ-AH) 0.5VCC td(φ-AL) tv(φ-AL) 0.5VCC td(φ-SYNC) tv(φ-SYNC) AB15 to AB8 AB7 to AB0 SYNCOUT 0.5VCC td(φ-WR) td(φ-RD) 0.5VCC td(φ-DMA) tv(φ-WR) tv(φ-RD) RD,WR tv(φ-DMA) n cycles of φ tsu(RDY-φ) th(φ-RDY) DMAOUT 0.5VCC RDY 0.8VCC 0.2VCC tsu(HOLD-φ) th(φ-HOLD) HOLD (at entering) 0.8VCC 0.2VCC td(φ-HLDAL) HLDA tsu(HOLD-φ) th(φ-HOLD) 0.5VCC HOLD (at releasing) 0.8VCC 0.2VCC td(φ-HLDAH) HLDA tsu(DB-φ) 0.5VCC th(φ-DB) DB0 to DB7 td(φ-DB) 0.8VCC 0.2VCC tv(φ-DB) 0.5VCC td(φ-EDMA) tv(φ-EDMA) 0.5VCC DB0 to DB7 0.5VCC EDMA Fig. 86 Timing diagram (6); Memory expansion and microprocessor modes Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 100 of 135 7641 Group tWL(RD) tWL(WR) RD,WR td(AH-RD) td(AH-WR) 0.5VCC tv(RD-AH) tv(WR-AH) AB15 to AB8 0.5VCC td(AL-RD) td(AL-WR) tv(RD-AL) tv(WR-AL) AB7 to AB0 0.5VCC tsu(RDY-WR) th(WR-RDY) tsu(RDY-RD) th(RD-RDY) RDY 0.8VCC 0.2VCC DB0 to DB7 tSU(DB-RD) 0.8VCC 0.2VCC th(RD-DB) DB0 to DB7 td(WR-DB) 0.5VCC tv(WR-DB) tv(WR-EDMA) tv(RD-EDMA) EDMA 0.5VCC Fig. 87 Timing diagram (7); Memory expansion and microprocessor modes Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 101 of 135 7641 Group FLASH MEMORY MODE The M37641F8FP/HP (flash memory version) has an internal new DINOR (DIvided bit line NOR) flash memory that can be rewritten with a single power source when VCC is 5 V, and 2 power sources when VPP is 5 V and VCC is 3.3 V in the CPU rewrite and standard serial I/O modes. For this flash memory, three flash memory modes are available in which to read, program, and erase: the parallel I/O and standard serial I/O modes in which the flash memory can be manipulated using a programmer and the CPU rewrite mode in which the flash memory can be manipulated by the Central Processing Unit (CPU). Summary Table 25 lists the summary of the M37641F8 (flash memory version). This flash memory version has some blocks on the flash memory as shown in Figure 88 and each block can be erased. The flash memory is divided into User ROM area and Boot ROM area. In addition to the ordinary User ROM area to store the MCU operation control program, the flash memory has a Boot ROM area that is used to store a program to control rewriting in CPU rewrite and standard serial I/O modes. This Boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the factory. However, the user can write a rewrite control program in this area that suits the user ’s application system. This Boot ROM area can be rewritten in only parallel I/O mode. Table 25 Summary of M37641F8 (flash memory version) Item Power source voltage (For Program/Erase) VPP voltage (For Program/Erase) Flash memory mode Specifications Vcc = 3.00 – 3.60 V, 4.50 – 5.25 V (f(XIN) = 24 MHz, φ = 6 MHz) (Note 1) VPP = 4.50 – 5.25 V 3 modes; Flash memory can be manipulated as follows: (1) CPU rewrite mode: Manipulated by the Central Processing Unit (CPU) (2) Parallel I/O mode: Manipulated using an external programmer (Note 2) (3) Standard serial I/O mode: Manipulated using an external programmer (Note 2). Erase block division User ROM area Boot ROM area See Figure 79. 1 block (4 Kbytes) (Note 3) Byte program Batch erasing/Block erasing Program/Erase control by software command 6 commands 100 times Available in parallel I/O mode and standard serial I/O mode Program method Erase method Program/Erase control method Number of commands Number of program/Erase times ROM code protection Notes 1: After programming/erasing at Vcc = 3.0 to 3.6 V, the MCU can operate only at Vcc = 3.0 to 3.6 V. After programming/erasing at Vcc = 4.5 to 5.25 V or programming/erasing with the exclusive external equipment flash programmer, the MCU can operate at both Vcc = 3.0 to 3.6 V and 4.15 to 5.25 V. 2: In the parallel I/O mode or the standard serial I/O mode, use the exclusive external equipment flash programmer which supports the 7641 Group (flash memory version). 3: The Boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the factory. This Boot ROM area can be rewritten in only parallel I/O mode. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 102 of 135 7641 Group (1) CPU Rewrite Mode In CPU rewrite mode, the internal flash memory can be operated on (read, program, or erase) under control of the Central Processing Unit (CPU). In CPU rewrite mode, only the User ROM area shown in Figure 88 can be rewritten; the Boot ROM area cannot be rewritten. Make sure the program and block erase commands are issued for only the User ROM area and each block area. The control program for CPU rewrite mode can be stored in either User ROM or Boot ROM area. In the CPU rewrite mode, because the flash memory cannot be read from the CPU, the rewrite control program must be transferred to internal RAM area to be executed before it can be executed. Microcomputer Mode and Boot Mode The control program for CPU rewrite mode must be written into the User ROM or Boot ROM area in parallel I/O mode beforehand. (If the control program is written into the Boot ROM area, the standard serial I/O mode becomes unusable.) See Figure 88 for details about the Boot ROM area. Normal microcomputer mode is entered when the microcomputer is reset with pulling CNV SS pin low. In this case, the CPU starts operating using the control program in the User ROM area. When the microcomputer is reset by pulling the P36 (CE) pin high, the P81 (SCLK) pin high, the CNVSS pin high, the CPU starts operating using the control program in the Boot ROM area. This mode is called the “Boot” mode. Block Address Block addresses refer to the maximum address of each block. These addresses are used in the block erase command. Parallel I/O mode User ROM area 800016 Block 2 : 16 Kbytes C00016 E00016 FFFF16 Block 1 : 8 Kbytes Block 0 : 8 Kbytes BSEL = “L” F00016 FFFF16 Boot ROM area 4 Kbytes BSEL = “H” CPU rewrite mode, standard serial I/O mode User ROM area 800016 Block 2 : 16 Kbytes C00016 E00016 FFFF16 Block 1 : 8 Kbytes Block 0 : 8 Kbytes F00016 FFFF16 Boot ROM area 4 Kbytes User area / Boot area select bit = “0” User area / Boot area select bit = “1” Notes 1: The Boot ROM area can be rewritten in only parallel I/O mode. (Access to any other areas is inhibited.) 2: To specify a block, use the maximum address in the block. Fig. 88 Block diagram of built-in flash memory Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 103 of 135 7641 Group Outline Performance (CPU Rewrite Mode) CPU rewrite mode is usable in the single-chip, memory expansion or Boot mode. The only User ROM area can be rewritten in CPU rewrite mode. In CPU rewrite mode, the CPU erases, programs and reads the internal flash memory by executing software commands. This rewrite control program must be transferred to a memory such as the internal RAM before it can be executed. The MCU enters CPU rewrite mode by applying 4.50 V to 5.25 V to the CNVSS pin and setting “1” to the CPU Rewrite Mode Select Bit (bit 1 of address 006A16). Software commands are accepted once the mode is entered. Use software commands to control program and erase operations. Whether a program or erase operation has terminated normally or in error can be verified by reading the status register. Figure 89 shows the flash memory control register. Bit 0 is the RY/BY status flag used exclusively to read the operating status of the flash memory. During programming and erase operations, it is “0” (busy). Otherwise, it is “1” (ready). Bit 1 is the CPU Rewrite Mode Select Bit. When this bit is set to “1”, the MCU enters CPU rewrite mode. Software commands are accepted once the mode is entered. In CPU rewrite mode, the CPU becomes unable to access the internal flash memory directly. Therefore, use the control program in a memory other than internal flash memory for write to bit 1. To set this bit to “ 1 ” , it is necessary to write “0” and then write “1” in succession. The bit can be set to “0” by only writing “0”. Bit 2 is the CPU Rewrite Mode Entry Flag. This flag indicates “1” in CPU rewrite mode, so that reading this flag can check whether CPU rewrite mode has been entered or not. Bit 3 is the flash memory reset bit used to reset the control circuit of internal flash memory. This bit is used when exiting CPU rewrite mode and when flash memory access has failed. When the CPU Rewrite Mode Select Bit is “1”, setting “1” for this bit resets the control circuit. To set this bit to “1”, it is necessary to write “0” and then write “1” in succession. To release the reset, it is necessary to set this bit to “0”. Bit 4 is the User Area/Boot Area Select Bit. When this bit is set to “1”, Boot ROM area is accessed, and CPU rewrite mode in Boot ROM area is available. In Boot mode, this bit is set to “1” automatically. Reprogramming of this bit must be in a memory other than internal flash memory. Figure 90 shows a flowchart for setting/releasing CPU rewrite mode. b7 b0 Flash memory control register (address 006A16) FMCR RY/BY status flag 0: Busy (being programmed or erased) 1: Ready CPU rewrite mode select bit (Note 2) 0: Normal mode (Software commands invalid) 1: CPU rewrite mode (Software commands acceptable) CPU rewrite mode entry flag 0: Normal mode 1: CPU rewrite mode Flash memory reset bit (Note 3) 0: Normal operation 1: Reset User ROM area / Boot ROM area select bit (Note 4) 0: User ROM area accessed 1: Boot ROM area accessed Reserved bits (Indefinite at read/ “0” at write) Notes 1: The contents of flash memory control register are “XXX00001” just after reset release. 2: For this bit to be set to “1”, the user needs to write “0” and then “1” to it in succession. If it is not this procedure, this bit will not be set to ”1”. Additionally, it is required to ensure that no interrupt will be generated during that interval. Use the control program in the area except the built-in flash memory for write to this bit. 3: This bit is valid when the CPU rewrite mode select bit is “1”. Set this bit 3 to “0” subsequently after setting bit 3 to “1”. 4: Use the control program in the area except the built-in flash memory for write to this bit. Fig. 89 Structure of flash memory control register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 104 of 135 7641 Group Start Single-chip mode, Memory expansion mode or Boot mode Set CPU mode registers A, B (Note 2) Transfer CPU rewrite mode control program to memory other than internal flash memory Jump to control program transferred in memory other than internal flash memory (Subsequent operations are executed by control program in this memory) Setting Set CPU rewrite mode select bit to “1” (by writing “0” and then “1” in succession) Check CPU rewrite mode entry flag Using software command execute erase, program, or other operation Execute read array command or reset flash memory by setting flash memory reset bit (by writing “1” and then “0” in succession) (Note 3) Released Write “0” to CPU rewrite mode select bit End Notes 1: When starting the MCU in the single-chip mode or memory expansion mode, supply 4.5 V to 5.25 V to the CNVss pin until checking the CPU rewrite mode entry flag. 2: Set the main clock as follows depending on the XIN divider select bit of clock control register (bit 7 of address 001F16): When XIN divider select bit = “0” (φ = f(XIN)/4), the main clock is 24 MHz or less When XIN divider select bit = “1” (φ = f(XIN)/2), the main clock is 12 MHz or less. 3: Before exiting the CPU rewrite mode after completing erase or program operation, always be sure to execute the read array command or reset the flash memory. Fig. 90 CPU rewrite mode set/release flowchart Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 105 of 135 7641 Group Notes on CPU Rewrite Mode The below notes applies when rewriting the flash memory in CPU rewrite mode. qOperation speed During CPU rewrite mode, set the internal clock φ to 6 MHz or less using the XIN Divider Select Bit (bit 7 of address 001F16). qInstructions inhibited against use The instructions which refer to the internal data of the flash memory cannot be used during CPU rewrite mode . qInterrupts inhibited against use The interrupts cannot be used during CPU rewrite mode because they refer to the internal data of the flash memory. qReset Reset is always valid. When CNVSS is “H” at reset release, the program starts from the address stored in addresses FFFA16 and FFFB16 of the boot ROM area in order that CPU may start in boot mode. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 106 of 135 7641 Group Software Commands (CPU Rewrite Mode) Table 26 lists the software commands. After setting the CPU Rewrite Mode Select Bit of the flash memory control register to “1”, execute a software command to specify an erase or program operation. Each software command is explained below. qRead Array Command (FF16) The read array mode is entered by writing the command code “FF16” in the first bus cycle. When an address to be read is input in one of the bus cycles that follow, the contents of the specified address are read out at the data bus (DB0 to DB7). The read array mode is retained intact until another command is written. qRead Status Register Command (7016) The read status register mode is entered by writing the command code “7016” in the first bus cycle. The contents of the status register are read out at the data bus (DB0 t o DB7 ) by a read in the second bus cycle. The status register is explained in the next section. qClear Status Register Command (5016) This command is used to clear the bits SR4 and SR5 of the status register after they have been set. These bits indicate that operation has ended in an error. To use this command, write the command code “5016” in the first bus cycle. qProgram Command (4016) Program operation starts when the command code “4016” is written in the first bus cycle. Then, if the address and data to program are written in the 2nd bus cycle, program operation (data programming and verification) will start. Whether the write operation is completed can be confirmed by _____ reading the status register or the RY/BY Status Flag of the flash memory control register. When the program starts, the read status register mode is entered automatically and the contents of the status register is read at the data bus (DB 0 t o DB 7 ). The status register bit 7 (SR7) is set to “0” at the same time the write operation starts and is returned to “ 1 ” u pon completion of the write operation. In this case, the read status register mode remains active until the next command is written. ____ The RY/BY Status Flag is “0” (busy) during write operation and “1” (ready) when the write operation is completed as is the status register bit 7. At program end, program results can be checked by reading bit 4 (SR4) of the status register. Start Write 4016 Write Write address Write data Status register read SR7 = 1 ? or RY/BY = 1 ? YES NO SR4 = 0 ? YES Program completed NO Program error Fig. 91 Program flowchart Table 26 List of software commands (CPU rewrite mode) Command Read array Read status register Clear status register Program Erase all blocks Block erase Cycle number 1 2 1 2 2 2 Mode Write Write Write Write Write Write First bus cycle Data Address (DB0 to DB7) X (Note 4) Second bus cycle Data Mode Address (DB0 to DB7) FF16 7016 5016 4016 2016 2016 Write Write Write BA WA (Note 2) X (Note 3) X X X X X Read X SRD (Note 1) WD (Note 2) 2016 D016 Notes 1: SRD = Status Register Data 2: WA = Write Address, WD = Write Data 3: BA = Block Address to be erased (Input the maximum address of each block.) 4: X denotes a given address in the User ROM area . Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 107 of 135 7641 Group qErase All Blocks Command (2016/2016) By writing the command code “2016” in the first bus cycle and the confirmation command code “2016” in the second bus cycle that follows, the operation of erase all blocks (erase and erase verify) starts. Whether the erase all blocks command is terminated can be con____ firmed by reading the status register or the RY/BY Status Flag of flash memory control register. When the erase all blocks operation starts, the read status register mode is entered automatically and the contents of the status register can be read out at the data bus (DB0 to DB7). The status register bit 7 (SR7) is set to “0” at the same time the erase operation starts and is returned to “1” upon completion of the erase operation. In this case, the read status register mode remains active until another command is written. ____ The RY/BY Status Flag is “0” during erase operation and “1” when the erase operation is completed as is the status register bit 7 (SR7). After the erase all blocks end, erase results can be checked by reading bit 5 (SRS) of the status register. For details, refer to the section where the status register is detailed. qBlock Erase Command (2016/D016) By writing the command code “2016” in the first bus cycle and the confirmation command code “D016” and the blobk address in the second bus cycle that follows, the block erase (erase and erase verify) operation starts for the block address of the flash memory to be specified. Whether the block erase operation is completed can be confirmed ____ by reading the status register or the RY/BY Status Flag of flash memory control register. At the same time the block erase operation starts, the read status register mode is automatically entered, so that the contents of the status register can be read out. The status register bit 7 (SR7) is set to “0” at the same time the block erase operation starts and is returned to “1” upon completion of the block erase operation. In this case, the read status register mode remains active until the read array command (FF16) is written. ____ The RY/BY Status Flag is “0” during block erase operation and “1” when the block erase operation is completed as is the status register bit 7. After the block erase ends, erase results can be checked by reading bit 5 (SRS) of the status register. For details, refer to the section where the status register is detailed. Start Write 2016 Write 2016/D016 Block address 2016:Erase all blocks command D016:Block erase command Status register read SR7 = 1 ? or RY/BY = 1 ? NO YES NO SR5 = 0 ? Erase error YES Erase completed Fig. 92 Erase flowchart Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 108 of 135 7641 Group Status Register (SRD) The status register shows the operating status of the flash memory and whether erase operations and programs ended successfully or in error. It can be read in the following ways: (1) By reading an arbitrary address from the User ROM area after writing the read status register command (7016) (2) By reading an arbitrary address from the User ROM area in the period from when the program starts or erase operation starts to when the read array command (FF16) is input. Also, the status register can be cleared by writing the clear status register command (5016). After reset, the status register is set to “8016”. Table 27 shows the status register. Each bit in this register is explained below. •Sequencer status (SR7) The sequencer status indicates the operating status of the flash memory. This bit is set to “0” (busy) during write or erase operation and is set to “1” when these operations ends. After power-on, the sequencer status is set to “1” (ready). •Erase status (SR5) The erase status indicates the operating status of erase operation. If an erase error occurs, it is set to “1”. When the erase status is cleared, it is set to “0”. •Program status (SR4) The program status indicates the operating status of write operation. When a write error occurs, it is set to “1”. The program status is set to “0” when it is cleared. If “ 1 ” i s written for any of the SR5 and SR4 bits, the program, erase all blocks, and block erase commands are not accepted. Before executing these commands, execute the clear status register command (5016) and clear the status register. Also, if any commands are not correct, both SR5 and SR4 are set to “1”. Table 27 Definition of each bit in status register (SRD) Symbol SR7 (bit7) SR6 (bit6) SR5 (bit5) SR4 (bit4) SR3 (bit3) SR2 (bit2) SR1 (bit1) SR0 (bit0) Status name Sequencer status Reserved Erase status Program status Reserved Reserved Reserved Reserved Definition “1” Ready Terminated in error Terminated in error - “0” Busy Terminated normally Terminated normally - Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 109 of 135 7641 Group Full Status Check By performing full status check, it is possible to know the execution results of erase and program operations. Figure 93 shows a full status check flowchart and the action to be taken when each error occurs. Read status register SR4 = 1 and SR5 = 1 ? NO SR5 = 0 ? YES SR4 = 0 ? YES YES Command sequence error Execute the clear status register command (5016) to clear the status register. Try performing the operation one more time after confirming that the command is entered correctly. Should an erase error occur, the block in error cannot be used. NO Erase error NO Program error Should a program error occur, the block in error cannot be used. End (erase, program) Note: When one of SR5 and SR4 is set to “1”, none of the read aray, the program, erase all blocks, and block erase commands is accepted. Execute the clear status register command (5016) before executing these commands. Fig. 93 Full status check flowchart and remedial procedure for errors Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 110 of 135 7641 Group Functions To Inhibit Rewriting Flash Memory Version To prevent the contents of internal flash memory from being read out or rewritten easily, this MCU incorporates a ROM code protect function for use in parallel I/O mode and an ID code check function for use in standard serial I/O mode. qROM Code Protect Function (in Pararell I/O Mode) The ROM code protect function is the function to inhibit reading out or modifying the contents of internal flash memory by using the ROM code protect control (address FFC916 ) in parallel I/O mode. Figure 94 shows the ROM code protect control (address FFC916). (This address exists in the User ROM area.) If one or both of the pair of ROM Code Protect Bits is set to “0”, the ROM code protect is turned on, so that the contents of internal flash memory are protected against readout and modification. The ROM code protect is implemented in two levels. If level 2 is selected, the flash memory is protected even against readout by a shipment inspection LSI tester, etc. When an attempt is made to select both level 1 and level 2, level 2 is selected by default. If both of the two ROM Code Protect Reset Bits are set to “00”, the ROM code protect is turned off, so that the contents of internal flash memory can be read out or modified. Once the ROM code protect is turned on, the contents of the ROM Code Protect Reset Bits cannot be modified in parallel I/O mode. Use the serial I/O or CPU rewrite mode to rewrite the contents of the ROM Code Protect Reset Bits. b7 b0 1 1 ROM code protect control (address FFC916) (Note 1) ROMCP Reserved bits (“1” at read/write) ROM code protect level 2 set bits (ROMCP2) (Notes 2, 3) b3b2 0 0: Protect enabled 0 1: Protect enabled 1 0: Protect enabled 1 1: Protect disabled ROM code protect reset bits (Note 4) b5b4 0 0: Protect removed 0 1: Protect set bits effective 1 0: Protect set bits effective 1 1: Protect set bits effective ROM code protect level 1 set bits (ROMCP1) (Note 2) b7b6 0 0: Protect enabled 0 1: Protect enabled 1 0: Protect enabled 1 1: Protect disabled Notes 1: This area is on the ROM in the mask ROM version. 2: When ROM code protect is turned on, the internal flash memory is protected against readout or modification in parallel I/O mode. 3: When ROM code protect level 2 is turned on, ROM code readout by a shipment inspection LSI tester, etc. also is inhibited. 4: The ROM code protect reset bits can be used to turn off ROM code protect level 1 and ROM code protect level 2. However, since these bits cannot be modified in parallel I/O mode, they need to be rewritten in standard serial I/O mode or CPU rewrite mode. Fig. 94 Structure of ROM code protect control Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 111 of 135 7641 Group ID Code Check Function (in Standard serial I/O mode) Use this function in standard serial I/O mode. When the contents of the flash memory are not blank, the ID code sent from the programmer is compared with the ID code written in the flash memory to see if they match. If the ID codes do not match, the commands sent from the programmer are not accepted. The ID code consists of 8-bit data, and its areas are FFC216 to FFC816. Write a program which has had the ID code preset at these addresses to the flash memory. Address FFC216 FFC316 FFC416 FFC516 FFC616 FFC716 FFC816 FFC916 ID1 ID2 ID3 ID4 ID5 ID6 ID7 ROM code protect control Interrupt vector area Fig. 95 ID code store addresses Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 112 of 135 7641 Group (2) Parallel I/O Mode Parallel I/O mode is the mode which parallel output and input software command, address, and data required for the operations (read, program, erase, etc.) to a built-in flash memory. Use the exclusive external equipment flash programmer which supports the 7641 Group (flash memory version). Refer to each programmer maker ’s handling manual for the details of the usage. User ROM and Boot ROM Areas In parallel I/O mode, the user ROM and boot ROM areas shown in Figure 88 can be rewritten. Both areas of flash memory can be operated on in the same way. Program and block erase operations can be performed in the user ROM area. The user ROM area and its block is shown in Figure 88. The boot ROM area is 4 Kbytes in size. It is located at addresses F00016 through FFFF16. Make sure program and block erase operations are always performed within this address range. (Access to any location outside this address range is prohibited.) In the Boot ROM area, an erase block operation is applied to only one 4 Kbyte block. The boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the Mitsubishi factory. Therefore, using the device in standard serial I/O mode, you do not need to write to the boot ROM area. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 113 of 135 7641 Group (3) Standard serial I/O Mode The standard serial I/O mode inputs and outputs the software commands, addresses and data needed to operate (read, program, erase, etc.) the internal flash memory. This I/O is clock synchronized serial. This mode requires the exclusive external equipment (flash programmer). The standard serial I/O mode is different from the parallel I/O mode in that the CPU controls flash memory rewrite (uses the CPU rewrite mode), rewrite data input and so forth. The standard serial I/O mode is started by connecting “H” to the P36 (CE) pin and “H” to the P81 (SCLK) pin and “H” to the CNVSS pin (apply 4.5 V to 5.25 V to Vpp from an external source), and releasing the reset operation. (In the ordinary microcomputer mode, set CNVss pin to “L” level.) This control program is written in the Boot ROM area when the product is shipped from Mitsubishi. Accordingly, make note of the fact that the standard serial I/O mode cannot be used if the Boot ROM area is rewritten in parallel I/O mode. Figures 96 and 97 show the pin connections for the standard serial I/O mode. In standard serial I/O mode, serial data I/O uses the four serial I/O pins SCLK, SRXD, STXD and SRDY (BUSY). The SCLK pin is the transfer clock input pin through which an external transfer clock is input. The STXD pin is for CMOS output. The SRDY (BUSY) pin outputs “L” level when ready for reception and “H” level when reception starts. Serial data I/O is transferred serially in 8-bit units. In standard serial I/O mode, only the User ROM area shown in Figure 88 can be rewritten. The Boot ROM area cannot. In standard serial I/O mode, a 7-byte ID code is used. When there is data in the flash memory, commands sent from the peripheral unit (programmer) are not accepted unless the ID code matches. Outline Performance (Standard Serial I/O Mode) In standard serial I/O mode, software commands, addresses and data are input and output between the MCU and peripheral units (flash programer, etc.) using 4-wire clock-synchronized serial I/O. In reception, software commands, addresses and program data are synchronized with the rise of the transfer clock that is input to the SCLK pin, and are then input to the MCU via the SRXD pin. In transmission, the read data and status are synchronized with the fall of the transfer clock, and output from the STXD pin. The STXD pin is for CMOS output. Transfer is in 8-bit units with LSB first. When busy, such as during transmission, reception, erasing or program execution, the SRDY (BUSY) pin is “H” level. Accordingly, always start the next transfer after the SRDY (BUSY) pin is “L” level. Also, data and status registers in a memory can be read after inputting software commands. Status, such as the operating state of the flash memory or whether a program or erase operation ended successfully or not, can be checked by reading the status register. Here following explains software commands, status registers, etc. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 114 of 135 7641 Group Table 28 Description of pin function (Standard Serial I/O Mode) Pin name VCC,VSS CNVSS RESET X IN XOUT AVCC, AVSS LPF Ext.Cap Signal name Power supply input CNVSS Reset input Clock input Clock output Analog power supply input LPF 3.3 V line power supply input I/O Function Apply 4.50 V – 5.25 V for 5 V version or 3.00 V – 3.60 V for 3 V version to the VCC pin. Apply 0 V to the Vss pin. I I This controls the MCU operating mode. Connect this pin to VPP (= 4.50 V – 5.25 V To reset, input “L” level for 20 cycles or longer clocks of φ. Connect a ceramic or crystal resonator between the XIN and XOUT pins. When inputting an externally derived clock, input it from XIN and leave XOUT open. Apply 4.50 V – 5.25 V for 5 V version or 3.00 V – 3.60 V for 3 V version to the AVCC pin. Apply 0 V to the AVss pin. O I Loop filter for the frequency synthesizer. When this pin is not used, leave this open. Power supply input pin for 3.3 V USB line driver. When this pin is not used, input “H” level. USB D+ signal port. When this pin is not used, input “H” level. USB D- signal port. When this pin is not used, input “L” level. When these ports are not used, input “L” or “H” level, or leave them open in output mode. USB D+ USB D- USB D+ USB D- I/O I/O I/O I/O I/O I/O I I/O I/O I/O I/O O I I O I/O P00 to P07 P10 to P17 P20 to P27 I/O port P0 I/O port P1 I/O port P2 P30 to P35, P37 I/O port P3 P36 P40 to P44 P50 to P57 P60 to P67 P70 to P74 P80 P81 P 82 P83 P84 to P87 CE input I/O port P4 I/O port P5 I/O port P6 I/O port P7 BUSY output SCLK input SRXD input STXDoutput I/O port P8 Input “H” level. When these ports are not used, input “L” or “H” level, or leave them open in output mode. This is a BUSY output pin. This is a serial clock input pin. This is a serial data input pin. This is a serial data output pin. When these ports are not used, input “L” or “H” level, or leave them open in output mode. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 115 of 135 7641 Group 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P20/DB0{DB0} P21/DB1{DB1} P22/DB2{DB2} P23/DB3{DB3} P24/DB4{DB4} P25/DB5{DB5} P26/DB6{DB6} P27/DB7{DB7} P00/AB0{AB0} P01/AB1{AB1} P02/AB2{AB2} P03/AB3{AB3} P04/AB4{AB4} P05/AB5{AB5} P06/AB6{AB6} P07/AB7{AB7} P10/AB8{AB8} P11/AB9{AB9} P12/AB10{AB10} P13/AB11{AB11} P14/AB12{AB12} P15/AB13{AB13} P16/AB14{AB14} P17/AB15{AB15} 40 39 38 37 36 35 34 P74/OBF1 P73/IBF1/HLDA P72/S1 P71/HOLD P70/SOF USB D+ USB DExt.Cap VSS VCC P67/DQ7 P66/DQ6 P65/DQ5 P64/DQ4 P63/DQ3 P62/DQ2 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 19 20 21 22 23 8 9 10 11 12 13 14 15 16 17 18 24 1 2 3 4 5 6 7 M37641F8FP 33 32 31 30 29 28 27 26 25 P30/RDY P31 P32 P33/DMAOUT P34/φOUT P35/SYNCOUT P36/WR P37/RD P80/UTXD2/SRDY P81/URXD2/SCLK P82/CTS2/SRXD P83/RTS2/STXD P84/UTXD1 P85/URXD1 P86/CTS1 P87/RTS1 CE BUSY SCLK SRXD STXD VSS P61/DQ1 P60/DQ0 P57/W/(R/W) P56/R(E) P55/A0 P54/S0 P53/IBF0 P52/OBF0 CNVSS RESET P51/TOUT/XCOUT P50/XCIN VSS XIN XOUT VCC AVCC LPF AVSS P44/CNTR1 P43/CNTR0 P42/INT1 P41/INT0 P40/EDMA VCC Note: It is necessary to apply Vcc only when reset is released. RESET Mode setup method Signal Value 4.5 to 5.25 V CNVSS VCC (Note) SCLK VSS → VCC RESET VCC CE Connect to oscillator circuit. VPP Package outline: PRQP0080GB-A Fig. 96 Pin connection diagram in standard serial I/O mode (1) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 116 of 135 7641 Group 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 P21/DB1 P20/DB0 P74/OBF1 P73/IBF1/HLDA P72/S1 P71/HOLD P70/SOF USB D+ USB DExt.Cap VSS VCC P67/DQ7 P66/DQ6 P65/DQ5 P64/DQ4 P63/DQ3 P62/DQ2 P61/DQ1 P60/DQ0 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 44 43 42 41 P22/DB2{DB2} P23/DB3{DB3} P24/DB4{DB4} P25/DB5{DB5} P26/DB6{DB6} P27/DB7{DB7} P00/AB0{AB0} P01/AB1{AB1} P02/AB2{AB2} P03/AB3{AB3} P04/AB4{AB4} P05/AB5{AB5} P06/AB6{AB6} P07/AB7{AB7} P10/AB8{AB8} P11/AB9{AB9} P12/AB10{AB10} P13/AB11{AB11} P14/AB12{AB12} P15/AB13{AB13} 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 M37641F8HP P16/AB14{AD14} P17/AB15{AD15} P30/RDY P31 P32 P33/DMAOUT P34/φOUT P35/SYNCOUT P36/WR P37/RD P80/UTXD2/SRDY P81/URXD2/SCLK P82/CTS2/SRXD P83/RTS2/STXD P84/UTXD1 P85/URXD1 P86/CTS1 P87/RTS1 P40/EDMA P41/INT0 CE BUSY SCLK SRXD STXD 8 9 10 11 12 13 14 15 16 17 P57/W/(R/W) P56/R(E) P55/A0 P54/S0 P53/IBF0 P52/OBF0 CNVSS RESET P51/TOUT/XCOUT P50/XCIN VSS XIN XOUT VCC AVCC LPF AVSS P44/CNTR1 P43/CNTR0 P42/INT1 18 19 20 1 2 3 4 5 6 7 VSS VCC RESET CE VSS → VCC VCC RESET VP P Mode setup method Signal Value 4.5 to 5.25 V CNVSS VCC (Note) SCLK Connect to oscillator circuit. Note: It is necessary to apply Vcc only when reset is released. Package outline: PLQP0080KB-A Fig. 97 Pin connection diagram in standard serial I/O mode (2) Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 117 of 135 7641 Group Software Commands (Standard Serial I/O Mode) Table 29 lists software commands. In standard serial I/O mode, erase, program and read are controlled by transferring software Table 29 Software commands (Standard serial I/O mode) Control command 1st byte transfer FF16 1 Page read 4116 2 3 4 5 6 7 Page program Block erase Erase all blocks Read status register Clear status register ID code check 2016 A716 7016 5016 F516 FA16 8 Download function Address (low) Size (low) Address (middle) Size (high) 2nd byte Address (middle) Address (middle) Address (middle) D016 SRD output SRD1 output 3rd byte Address (high) Address (high) Address (high) commands via the SRXD pin. Software commands are explained here below. 4th byte Data output Data input D016 5th byte Data output Data input 6th byte Data output Data input ..... Data output to 259th byte Data input to 259th byte When ID is not verified Not acceptable Not acceptable Not acceptable Not acceptable Acceptable Not acceptable Address (high) Checksum ID size Data input ID1 To required number of times Version data output Data output To ID7 Acceptable Not acceptable FB16 9 10 Version data output function Boot ROM area output function FC16 Version data output Address (middle) Version data output Address (high) Version data output Data output Version data output Data output Version data output to 9th byte Data output to 259th byte Acceptable Not acceptable Notes1: Shading indicates transfer from the internal flash memory microcomputer to a programmer. All other data is transferred from an external equipment (programmer) to the internal flash memory microcomputer. 2: SRD refers to status register data. SRD1 refers to status register 1 data. 3: All commands can be accepted for the products of which boot ROM area is totally blank. 4: Address low is AB0 to AB7; Address middle is AB8 to AB15; Address high is AB16 to AB23. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 118 of 135 7641 Group qPage Read Command This command reads the specified page (256 bytes) in the flash memory sequentially one byte at a time. Execute the page read command as explained here following. (1) Transfer the “FF16” command code with the 1st byte. (2) Transfer addresses AB8 to AB15 and AB16 to AB23 with the 2nd and 3rd bytes respectively. (3) From the 4th byte onward, data (DB0 to DB7) for the page (256 bytes) specified with addresses AB8 to AB23 will be output sequentially from the smallest address first synchronized with the fall of the clock. SCLK SRXD FF16 AB8 to AB16 to AB15 AB23 STXD data0 data255 SRDY (BUSY) Fig. 98 Timing for page read qRead Status Register Command This command reads status information. When the “70 16” command code is transferred with the 1st byte, the contents of the status register (SRD) with the 2nd byte and the contents of status register 1 (SRD1) with the 3rd byte are read. SCLK SRXD 7016 STXD SRD output SRD1 output SRDY (BUSY) Fig. 99 Timing for reading status register Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 119 of 135 7641 Group qClear Status Register Command This command clears the bits (SR3 to SR5) which are set when the status register operation ends in error. When the “5016” command code is sent with the 1st byte, the aforementioned bits are cleared. When the clear status register operation ends, the SRDY (BUSY) signal changes from “H” to “L” level. SCLK SRXD 5016 STXD SRDY (BUSY) Fig. 100 Timing for clear status register qPage Program Command This command writes the specified page (256 bytes) in the flash memory sequentially one byte at a time. Execute the page program command as explained here following. (1) Transfer the “4116” command code with the 1st byte. (2) Transfer addresses AB8 to AB15 and AB16 to AB23 with the 2nd and 3rd bytes respectively. (3) From the 4th byte onward, as write data (DB0 to DB7) for the page (256 bytes) specified with addresses A8 to A23 is input sequentially from the smallest address first, that page is automatically written. When reception setup for the next 256 bytes ends, the SRDY (BUSY) signal changes from “ H ” t o “ L ” l evel. The result of the page program can be known by reading the status register. For more information, see the section on the status register. SCLK SRXD 4116 AB8 to AB16 to data0 AB15 AB23 data255 STXD SRDY (BUSY) Fig. 101 Timing for page program Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 120 of 135 7641 Group qBlock Erase Command This command erases the contents of the specifided block. Execute the block erase command as explained here following. (1) Transfer the “2016” command code with the 1st byte. (2) Transfer addresses AB8 to AB15 and AB16 to AB23 with the 2nd and 3rd bytes respectively. (3) Transfer the verify command code “D0 16” with the 4th byte. With the verify command code, the erase operation will start for the specifided block in the flash memory. Set the addresses AB8 to AB23 to the maximum address of the specified block. When block erasing ends, the SRDY (BUSY) signal changes from “H” to “L” level. The result of the erase operation can be known by reading the status register. For more information, see the section on the status register. SCLK SRXD 2016 AB8 to AB15 AB16 to AB23 D016 STXD SRDY(BUSY) Fig. 102 Timing for block erasing qErase All Blocks Command This command erases the contents of all blocks. Execute the erase all blocks command as explained here following. (1) Transfer the “A716” command code with the 1st byte. (2) Transfer the verify command code “D0 16” with the 2nd byte. With the verify command code, the erase operation will start and continue for all blocks in the flash memory. When erase all blocks end, the SRDY (BUSY) signal changes from “ H ” t o “ L ” l evel. The result of the erase operation can be known by reading the status register. SCLK SRXD A716 D016 STXD SRDY (BUSY) Fig. 103 Timing for erase all blocks Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 121 of 135 7641 Group qDownload Command This command downloads a program to the RAM for execution. Execute the download command as explained here following. (1) Transfer the “FA16” command code with the 1st byte. (2) Transfer the program size with the 2nd and 3rd bytes. (3) Transfer the check sum with the 4th byte. The check sum is added to all data sent with the 5th byte onward. (4) The program to execute is sent with the 5th byte onward. When all data has been transmitted, if the check sum matches, the downloaded program is executed. The size of the program will vary according to the internal RAM. SCLK SRXD FA16 Data size Data size (low) (high) Check su m Program data STXD Program data SRDY (BUSY) Fig. 104 Timing for download Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 122 of 135 7641 Group qVersion Information Output Command This command outputs the version information of the control program stored in the Boot ROM area. Execute the version information output command as explained here following. (1) Transfer the “FB16” command code with the 1st byte. (2) The version information will be output from the 2nd byte onward. This data is composed of 8 ASCII code characters. SCLK SRXD FB16 STXD ‘V ’ ‘E’ ‘R’ ‘X’ SRDY (BUSY) Fig. 105 Timing for version information output qBoot ROM Area Output Command This command reads the control program stored in the Boot ROM area in page (256 bytes) unit. Execute the Boot ROM area output command as explained here following. (1) Transfer the “FC16” command code with the 1st byte. (2) Transfer addresses AB8 to AB15 and AB16 to AB23 with the 2nd and 3rd bytes respectively. (3) From the 4th byte onward, data (DB0 to DB7) for the page (256 bytes) specified with addresses AB8 to AB23 will be output sequentially from the smallest address first synchronized with the fall of the clock. SCLK SRXD FC16 A B 8 to A B 15 AB 1 6 to A B 23 STXD data0 data255 SRDY(BUSY) Fig. 106 Timing for Boot ROM area output Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 123 of 135 7641 Group qID Code Check This command checks the ID code. Execute the boot ID check command as explained here following. (1) Transfer the “F516” command code with the 1st byte. (2) Transfer addresses AB0 to AB7, AB8 to AB15 and AB16 to AB23 (“0016”) of the 1st byte of the ID code with the 2nd and 3rd respectively. (3) Transfer the number of data sets of the ID code with the 5th byte. (4) Transfer the ID code with the 6th byte onward, starting with the 1st byte of the code. SCLK SRXD F516 C216 FF16 0016 ID size ID1 ID7 STXD SRDY (BUSY) Fig. 107 Timing for ID check qID Code When the flash memory is not blank, the ID code sent from the serial programmer and the ID code written in the flash memory are compared to see if they match. If the codes do not match, the command sent from the serial programmer is not accepted. An ID code contains 8 bits of data. Area is, from the 1st byte, addresses FFC216 to FFC816. Write a program into the flash memory, which already has the ID code set for these addresses. Address FFC216 FFC316 FFC416 FFC516 FFC616 FFC716 FFC816 FFC916 ID1 ID2 ID3 ID4 ID5 ID6 ID7 ROM code protect control Interrupt vector area Fig. 108 ID code storage addresses Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 124 of 135 7641 Group qStatus Register (SRD) The status register indicates operating status of the flash memory and status such as whether an erase operation or a program ended successfully or in error. It can be read by writing the read status register command (70 16 ). Also, the status register is cleared by writing the clear status register command (5016). Table 30 lists the definition of each status register bit. After releasing the reset, the status register becomes “8016”. •Sequencer status (SR7) The sequencer status indicates the operating status of the the flash memory. After power-on and recover from deep power down mode, the sequencer status is set to “1” (ready). This status bit is set to “0” (busy) during write or erase operation and is set to “1” upon completion of these operations. •Erase status (SR5) The erase status indicates the operating status of erase operation. If an erase error occurs, it is set to “1”. When the erase status is cleared, it is set to “0”. •Program status (SR4) The program status indicates the operating status of write operation. If a program error occurs, it is set to “1”. When the program status is cleared, it is set to “0”. Table 30 Definition of each bit of status register (SRD) Definition SRD0 bits SR7 (bit7) SR6 (bit6) SR5 (bit5) SR4 (bit4) SR3 (bit3) SR2 (bit2) SR1 (bit1) SR0 (bit0) Status name Sequencer status Reserved Erase status Program status Reserved Reserved Reserved Reserved “1” Ready Terminated in error Terminated in error - “0” Busy Terminated normally Terminated normally - Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 125 of 135 7641 Group qStatus Register 1 (SRD1) The status register 1 indicates the status of serial communications, results from ID checks and results from check sum comparisons. It can be read after the status register (SRD) by writing the read status register command (7016). Also, status register 1 is cleared by writing the clear status register command (5016). Table 31 lists the definition of each status register 1 bit. This register becomes “0016” when power is turned on and the flag status is maintained even after the reset. •Boot update completed bit (SR15) This flag indicates whether the control program was downloaded to the RAM or not, using the download function. •Check sum consistency bit (SR12) This flag indicates whether the check sum matches or not when a program, is downloaded for execution using the download function. •ID code check completed bits (SR11 and SR10) These flags indicate the result of ID code checks. Some commands cannot be accepted without an ID code check. •Data reception time out (SR9) This flag indicates when a time out error is generated during data reception. If this flag is attached during data reception, the received data is discarded and the MCU returns to the command wait state. Table 31 Definition of each bit of status register 1 (SRD1) SRD1 bits SR15 (bit7) SR14 (bit6) SR13 (bit5) SR12 (bit4) SR11 (bit3) SR10 (bit2) Status name Boot update completed bit Reserved Reserved Checksum match bit ID code check completed bits Definition “1” Update completed Match 00 01 10 11 “0” Not Update Mismatch Not verified Verification mismatch Reserved Verified Normal operation - SR9 (bit1) SR8 (bit0) Data reception time out Reserved Time out - Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 126 of 135 7641 Group Full Status Check Results from executed erase and program operations can be known by running a full status check. Figure 109 shows a flowchart of the full status check and explains how to remedy errors which occur. Read status register SR4 = 1 and SR5 = 1 ? NO SR5 = 0 ? YES SR4 = 0 ? YES YES Command sequence error Execute the clear status register command (5016) to clear the status register. Try performing the operation one more time after confirming that the command is entered correctly. Should an erase error occur, the block in error cannot be used. NO Erase error NO Program error Should a program error occur, the block in error cannot be used. End (Erase, program) Note: When one of SR5 to SR4 is set to “1” , none of the page read, program, erase all blocks, and block erase commands is accepted. Execute the clear status register command (5016) before executing these commands. Fig. 109 Full status check flowchart and remedial procedure for errors Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 127 of 135 7641 Group Example Circuit Application for Standard Serial I/O Mode Figure 110 shows a circuit application for the standard serial I/O mode. Control pins will vary according to a programmer, therefore see a programmer manual for more information. Clock input BUSY output Data input Data output SCLK SRDY (BUSY) SRXD STXD P36/WR (CE) M37641F8 VPP power source input CNVss Notes 1: Control pins and external circuitry will vary according to a programmer. For more information, see the programmer manual. 2: In this example, the Vpp power supply is supplied from an external source (programmer). To use the user’s power source, connect to 4.5 V to 5.25 V. Fig. 110 Example circuit application for standard serial I/O mode Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 128 of 135 7641 Group NOTES ON PROGRAMMING Processor Status Register •The contents of the processor status register (PS) after a reset are undefined, except for the interrupt disable flag (I) which is “1”. After a reset, initialize flags which affect program execution. In particular, it is essential to initialize the index X mode (T) and the decimal mode (D) flags because of their effect on calculations. •To reference the contents of the processor status register (PS), execute the P HP i nstruction once then read the contents of (S+1). If necessary, execute the PLP instruction to return the PS to its original status. A NOP instruction must be executed after every PLP instruction. •A SEI instruction must be executed before every PLP instruction. A NOP instruction must be executed before every CLI instruction. Ports •When the data register (port latch) of an I/O port is modified with the bit managing instruction (SEB, CLB instructions) the value of the unspecified bit may be changed. •In standby state (the stop mode by executing the STP instruction, and the wait mode by executing the W IT i nstruction) for lowpower dissipation, do not make input levels of an I/O port “undefined”, especially for I/O ports of the P-channel and the Nchannel open-drain. Pull-up (connect the port to Vcc) or pull-down (connect the port to Vss) these ports through a resistor. When determining a resistance value, note the following points: (1) External circuit (2) Variation of output levels during the ordinary operation When using built-in pull-up or pull-down resistor, note on varied current values. (1) When setting as an input port : Fix its input level (2) When setting as an output port : Prevent current from flowing out to external BRK Instruction It can be detected that the BRK instruction interrupt event or the least priority interrupt event by referring the stored B flag state. Refer to the stored B flag state in the interrupt routine. Decimal Calculations When decimal mode is selected, the values of the V flags are invalid. The carry flag (C) is set to “1” if a carry is generated as a result of the calculation, or is cleared to “0” if a borrow is generated. To determine whether a calculation has generated a carry, the C flag must be initialized to “0” before each calculation. To check for a borrow, the C flag must be initialized to “1” before each calculation. Serial I/O Do not write to the serial I/O shift register during a transfer when in SPI compatible mode. UART •The all error flags PER, FER, OER and SER are cleared to “0” when the UARTx status register is read, at the hardware reset or initialization by setting the Transmit Initialization Bit. These flags are also cleared to “0” by execution of bit test instructions such as BBC and BCS. •The transmission interrupt request bit is set and the interrupt request is generated by setting the transmit enable bit to “1” even when selecting timing that either of the following flags is set to “1” as timing where the transmission interrupt is generated: (1) Transmit buffer empty flag is set to “1” (2) Transmit complete flag is set to “1”. Therefore, when the transmit interrupt is used, set the transmit interrupt enable bit to transmit enabled as the following sequence: (1) Transmit enable bit is set to “1” (2) Transmit interrupt request bit is set to “0” (3) Transmit interrupt enable bit is set to “1”. •Do not update a value of UARTx baud rate generator in the condition of transmission enabled or reception enabled. Disable transmission and reception before updating the value. If the former data remains in the UARTx transmit buffer registers 1 and 2 when transmission is enabled, an undefined data might be output. •The receive buffer full interrupt request is not generated if receive errors are detected at receiving. Multiplication and Division Instructions •The index X mode (T) and the decimal mode (D) flags do not affect the MUL and DIV instruction. Instruction Execution Time The instruction execution time is obtained by multiplying the frequency of the internal clock φ by the number of cycles needed to execute an instruction. The number of cycles required to execute an instruction is shown in the list of machine instructions. Timers •If a value n (between 0 and 255) is written to a timer latch, the frequency division ratio is 1/(n+1). •P51/XCOUT/TOUT pin cannot function as an I/O port when XCIN XCOUT is oscillating. When XCIN - XCOUT oscillation is not used or XCOUT oscillation drive is disabled, this pin can function as the TOUT output pin of the timer 1 or 2. When using the TOUT output function and f(XCIN) divided by 2 is used as the timer 1 count source (bit 2 of T123M = “1”), disable XCOUT oscillation drive (bit 5 of CCR = “1”). Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 129 of 135 7641 Group •If a character bit length is 7 bits, bit 7 of the UARTx transmit/receive buffer register 1 and bits 0 to 7 of the UARTx transmit/ receive buffer register 2 are ignored at transmitting; they are invalid at receiving. If a character bit length is 8 bits, bits 0 to 7 of the UARTx transmit/ receive buffer register 2 are ignored at transmitting; they are invalid at receiving. If a character bit length is 9 bits, bits 1 to 7 of the UARTx transmit/ receive buffer register 2 are ignored at transmitting; they are “0” at receiving. •The IN_PKT_RDY Bit can be set by software even when using the AUTO_SET function. •When writing to USB-related registers, set the USB Clock Enable Bit to “1”, then perform the write after four φ cycle waits. •When using the MCU at Vcc = 3.3V, set the USB Line Driver Supply Enable Bit to “0” (line driver disable). Note that setting the USB Line Driver Current Control Bit (USBC3) doesn’t affect the USB operation. •Read one packet data from the OUT FIFO before clearing the OUT_PKT_RDY Flag. If the OUT_PKT_RDY Flag is cleared while one packet data is being read, the internal read pointer cannot operate normally. •Use the AUTO_FLUSH Bit (bit 6 of address 005816 ) in double buffer mode. •Use the transfer instructions such as LDA and STA to set the registers: USB interrupt status registers 1, 2 (addresses 005216, 005316); USB endpoint 0 IN control register (address 0059 16 ); USB endpoint x IN control register (address 005916); USB endpoint x OUT control register (address 005A16). Do not use the read-modify-write instructions such as the SEB or the CLB instruction. When writing to bits shown by Table 32 using the transfer instruction such as LDA or STA, a value which never affect its bit state is required. Take the following sequence to change these bits contents: (1) Store the register contents onto a variable or a data register. (2) Change the target bit on the variable or the data register. Simultaneously mask the bit so that its bit state cannot be changed. (See to Table 39.) (3) Write the value from the variable or the data register to the register using the transfer instruction such as LDA or STA. •To use the AUTO_SET function for an IN transfer when the AUTO_SET bit is set to 1, set the FIFO to single buffer mode. USB •When the USB Reset Interrupt Status Flag is kept at “1”, all other flags in the USB internal registers (addresses 005016 to 005F16) will return to their reset status. However, the following registers are not affected by the USB reset: USB control register (address 0013 16 ), Frequency synthesizer control register (address 006C16), Clock control register (address 001F16), and USB endpoint-x FIFO register (addresses 006016 to 006416). •When not using the USB function, set the USB Line Driver Supply Enable Bit of the USB control register (address 001316) to “1” for power supply to the internal circuits (at Vcc = 5V). •When using an isochronous transfer, set the FLUSH Bit (bit 6 of address 005916 and bit 6 of address 005A16) as follows: IN FIFO: use AUTO_FLUSH Bit (bit 6 of address 005816) OUT FIFO: when OUT_PKT_RDY Bit is “1”, set FLUSH Bit to “1” •When the USB SOF Port Select Bit is “1”, the reference pulse of 83.3 ns (φ = 12 MHz) is output from the P70 /SOF pin and synchronized with the SOF packet. Table 32 Bits of which state might be changed owing to software write Bit name Register name IN_PKT_RDY (b1) USB endpoint 0 IN control register DATA_END (b3) FORCE_STALL (b4) USB endpoint x (x = 1 to 4) IN control register IN_PKT_RDY (b0) UNDER_RUN (b1) USB endpoint x (x = 1 to 4) OUT control register OUT_PKT_RDY (b0) OVER_RUN (b1) FORCE_STALL (b4) DATA_ERR (b5) Value not affecting state (Note) “0” “0” “1” “0” “1” “1” “1” “1” “1” Note: Writing this value will not change the bit state, because this value cannot be written to the bit by software. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 130 of 135 7641 Group Frequency Synthesizer •The frequency synthesizer and DC-DC converter must be set up as follows when recovering from a Hardware Reset: (1) Enable the frequency synthesizer after setting the frequency synthesizer related registers (addresses 006C16 to 006F16). Then wait for 2 ms. (2) Check the Frequency Synthesizer Lock Status Bit. If “0”, wait for 0.1 ms and then recheck. (3) When using the USB built-in DC-DC converter, set the USB Line Driver Supply Enable Bit of the USB control register to “1”. This setting must be done 2 ms or more after the setup described in step (1). The USB Line Driver Current Control Bit must be set to “0” at this time. (When Vcc = 3.3V, the setting explained in this step is not necessary.) (4) After waiting for (C + 1) ms so that the external capacitance pin (Ext. Cap. pin) can reach approximately 3.3 V, set the USB Clock Enable Bit to “1”. At this time, “C” equals the capacitance ( µ F) of the capacitor connected to the Ext. Cap. pin. For example, if 2.2 µF and 0.1 µF capacitors are connected to the Ext. Cap. in parallel, the required wait will be (2.3 + 1) ms. (5) After enabling the USB clock, wait for 4 or more φ cycles, and then set the USB Enable Bit to “1”. •Bits 6 and 5 of the frequency synthesizer control register (address 006C16) are initialized to “ 11 ” a fter reset release. Make sure to set bits 6 and 5 to “10” after the Frequency Synthesizer Lock Status Bit goes to “1”. •When using the frequency synthesized clock function, we recommend using the fastest frequency possible of f(XIN) or f(XCIN) as an input clock for the PLL. Owing to the PLL mechanism, the PLL controls the speed of multiplied clocks from the source clock. As a result, when the source clock input is lower, the generated clock becomes less stable. This is because more multipliers are needed and the speed control is very rough. Higher source clock input generates a stabler clock, as less multipliers are needed and the speed control is more accurate. However, if the input clock frequency is relatively high, the PLL clock generator can quickly lock-up the output clock to the source and make the output clock very stable. •Set the value of frequency synthesizer multiply register 2 (FSM2) so that the fPIN is 1 MHZ or higher. •When setting the DMAC channel x enable bit (bit 7 of address 004116) to “1”, be sure simultaneously to set the DMAC channel x transfer initiation source capture register reset bit (bit 6 of address 004116) to “1”. If this is not performed, an incorrect data will be transferred at the same time when the DMAC is enabled. Memory Expansion Mode & Microprocessor Mode •In both memory expansion mode and microprocessor mode, use the LDM instruction or STA instruction to write to port P3 (address 000E16). When using the Read-Modify-Write instruction (SEB instruction, CLB instruction) you will need to map a memory that the CPU can read from and write to. • In the memory expansion mode, if the internal and external memory areas overlap, the internal memory becomes the valid memory for the overlapping area. When the CPU performs a read or a write operation on this overlapped area, the following things happen: (1) Read The CPU reads out the data in the internal memory instead of in the external memory. Note that, since the CPU will output a proper read signal, address signal, etc., the memory data at the respective address will appear on the external data bus. (2) Write The CPU writes data to both the internal and external memories. •The wait function is serviceable at accessing an external memory. Stop Mode •When the STP instruction is executed, bit 7 of the clock control register (address 001F16) goes to “0”. To return from stop mode, reset CCR7 to “1”. •When using fSYN (set Internal System Clock Select Bit (CPMA6) to “1”) as the internal system clock, switch CPMA6 to “0” before executing the STP instruction. Reset CPMA6 after the system returns from Stop Mode and the frequency synthesizer has stabilized. CPMA6 does not need to be switched to “0” when using the WIT instruction. •When the STP instruction is being executed, all bits except bit 4 of the timer 123 mode register (address 002916) are initialized to “0”. It is not necessary to set T123M1 (Timer 1 Count Stop Bit) to “0” before executing the STP instruction. After returning from Stop Mode, reset the timer 1 (address 0024 16 ), timer 2 (address 002516), and the timer 123 mode register (address 002916). DMA •In the memory expansion mode and microprocessor mode, the DMAOUT pin outputs “H” during a DMA transfer. • Do not access the DMAC-related registers by using a DMAC transfer. The destination address data and the source address data will collide in the DMAC internal bus. •When using the USB FIFO as the DMA transfer source, make sure that, if you use the AUTO_SET function, short packet data does not get mixed in with the transfer data. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 131 of 135 7641 Group USAGE NOTES Oscillator Connection Notice The built-in feedback register (1 MΩ) and the dumping resistor (400 Ω) is internally connected between pins XIN and XOUT. AVss and AVcc Pin Treatment Notice (Noise Elimination) An insulation connector (Ferrite Beads) must be connected between AVss and Vss pins and between AVcc and Vcc pins. Power Source Voltage When the power source voltage value of a microcomputer is less than the value which is indicated as the recommended operating conditions, the microcomputer does not operate normally and may perform unstable operation. In a system where the power source voltage drops slowly when the power source voltage drops or the power supply is turned off, reset a microcomputer when the power source voltage is less than the recommended operating conditions and design a system not to cause errors to the system by this unstable operation. U S B Tr a n s c e i v e r Tr e a t m e n t ( N o i s e Elimination) •The Full-Speed USB2.0 specification requires a driver -impedance 28 to 44 Ω. (Refer to Clause 7.1.1.1 Full-speed (12 Mb/s) Driver Characteristics in the USB specification.) In order to meet the USB specification impedance requirements, connect a resistor (27 Ω to 33 Ω recommended) in series to the USB D+ pin and the USB D- pin. In addition, in order to reduce the ringing and control the falling/ rising timing of USB D+/D- and a crossover point, connect a capacitor between the USB D+/D- pins and the Vss pin if necessary. The values and structure of those peripheral elements depend on the impedance characteristics and the layout of the printed circuit board. Accordingly, evaluate your system and observe waveforms before actual use and decide use of elements and the values of resistors and capacitors. •Connect a capacitor between the Ext. Cap. pin and the Vss pin. The capacitor should have a 2.2 µF capacitor (Tantalum capacitor) and a 0.1 µ F capacitor (ceramic capacitor) connected in parallel. Figure 112 for the proper positions of the peripheral components. Power Supply Pins Treatment Notice Please connect 0.1 µF and 4.7 µF capacitors in parallel between pins Vcc and Vss, and pins AVss and AVcc. These capacitors must be connected as close as possible between the DC supply and GND pins, and also the analog supply pin and corresponding GND pin. Wiring patterns for these supply and GND pins must be wider than other signal patterns. These filter capacitors should not be placed near the LPF pins as they will cause noise problems R e s e t P i n Tr e a t m e n t N o t i c e ( N o i s e Elimination) If the reset input signal rises very slowly, we recommend attaching a capacitor, such as a 1000 pF ceramic capacitor with excellent high frequency characteristics, between the RESET pin and the Vss pin. Please note the following two issues for this capacitor connection. (1) Capacitor wiring pattern must be as short as possible (within 20 mm). (2) The user must perform an application level operation test. XIN Frequency Synthesizer USBC5 enable DC-DC converter current mode enable lock LS enable FSE Note 1 Ext. Cap. USBC4 USBC3 2.2 µF 0.1 µF USB Clock (48 MHz) USB FCU enable USB transceiver enable D+ USBC7 USBC7 Note 2 D- LPF Pin Treatment Notice All passive components must be located as close as possible to the LPF pin. Notes 1: In Vcc = 3.3 V, connect to Vcc. In Vcc =5 V, do not connect the external DC-DC converter to the Ext. Cap pin. 2: The resistors values depend on the layout of the printed circuit board. Fig.112 Peripheral circuit •In Vcc = 3.3 V operation, connect the Ext. Cap. pin directly to the Vcc pin in order to supply power to the USB transceiver. In addition, you will need to disable the DC-DC converter in this operation (set bit 4 of the USB control register to “0”.) If you are using the bus powered supply in Vcc = 3.3 V operation, the DCDC converter must be placed outside the MCU. •In Vcc = 5 V operation, do not connect the external DC-DC converter to the Ext. Cap. pin. Use the built-in DC-DC converter by enabling the USB line driver. •Make sure the USB D+/D- lines do not cross any other wires. Keep a large GND area to protect the USB lines. Also, make sure you use a USB specification compliant connecter for the connection. LPF pin 1 kΩ 680 pF 0.1 µF AVSS pin Fig. 111 Passive components near LPF pin Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 132 of 135 1.5 kΩ 7641 Group USB Communication In applications requiring high-reliability, we recommend providing the system with protective measures such as USB function initialization by software or USB reset by the host to prevent USB communication from being terminated unexpectedly, for example due to external causes such as noise. • Since the direction register setup may be changed because of a program runaway or noise, set direction registers by program periodically to increase the reliability of program. • At the termination of unused pins, perform wiring at the shortest possible distance (20 mm or less) from microcomputer pins. Clock Input/Output Pin Wiring (Noise Elimination) (1) Make the wiring for the input/output pins as short as possible. (2) Make the wiring across the grounding lead of the capacitor which is connected to an oscillator and the Vss pin of the MCU as short as possible (within 20 mm) (3) Make sure to isolate the oscillation Vss pattern from other patterns for oscillation circuit-use only. Electric Characteristic Differences Between Mask ROM and Flash Memory Version MCUs There are differences in electric characteristics, operation margin, noise immunity, and noise radiation between Mask ROM and Flash Memory version MCUs due to the difference in the manufacturing processes. When manufacturing an application system with the Flash Memory version and then switching to use of the Mask ROM version, please perform sufficient evaluations for the commercial samples of the Mask ROM version. Oscillator Wiring (Noise Elimination) (1) Keeping oscillator away from large current signal lines Install a microcomputer (and especially an oscillator) as far as possible from signal lines, including USB signal lines, where a current larger than the tolerance of current value flows. When a large current flows through those signal lines, strong noise occurs because of mutual inductance. (2) Installing oscillator away from signal lines where potential levels change frequently Install an oscillator and a connecting pattern of an oscillator away from signal lines where potential levels change frequently. Also, do not cross such signal lines over the clock lines or the signal lines which are sensitive to noise. DATA REQUIRED FOR MASK ORDERS The following are necessary when ordering a mask ROM production: 1. Mask ROM Order Confirmation Form 2. Mark Specification Form 3. Data to be written to ROM, in EPROM form (three identical copies) or one floppy disk. For the mask ROM confirmation and the mark specifications, refer to the “Renesas Technology Corp.” Homepage (http://www.renesas.com). Terminate Unused Pins (1) Output ports : Open (2) Input ports : Connect each pin to Vcc or Vss through each resistor of 1 kΩ to 10 kΩ. Ports that permit the selecting of a built-in pull-up or pull-down resistor can also use this resistor. As for pins whose potential affects to operation modes such as pins CNVss, INT or others, select the Vcc pin or the Vss pin according to their operation mode. (3) I/O ports : • Set the I/O ports for the input mode and connect them to Vcc or Vss through each resistor of 1 kΩ to 10 kΩ. Ports that permit the selecting of a built-in pull-up or pull-down resistor can also use this resistor. Set the I/O ports for the output mode and open them at “L” or “H”. • When opening them in the output mode, the input mode of the initial status remains until the mode of the ports is switched over to the output mode by the program after reset. Thus, the potential at these pins is undefined and the power source current may increase in the input mode. With regard to an effects on the system, thoroughly perform system evaluation on the user side. Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 133 of 135 7641 Group PACKAGE OUTLINE PRQP0080GB-A JEITA Package Code P-QFP80-14x20-0.80 RENESAS Code PRQP0080GB-A Previous Code 80P6N-A MASS[Typ.] 1.6g HD *1 D 41 64 65 NOTE) 1. HE E * *2" ZE *2 * INCLUDE TRIM OFFSET. 80 25 Dimension in Millimeters Symbol 1 ZD 24 Index mark F c D E A2 D HE A A1 bp c L Detail F Min Nom 19.8 13.8 14.0 2.8 22.5 22.8 16.5 16.8 0.1 0 0.3 0.35 0.13 0.15 0° 0.65 0.8 0.8 1.0 0.6 Max 14.2 23.1 17.1 3.05 0.2 0.2 10 ° 0.10 A *3 A1 e y bp A2 y ZD ZE L 0.4 0.8 Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 134 of 135 7641 Group PLQP0080KB-A JEITA Package Code P-LQFP80-12x12-0.50 RENESAS Code PLQP0080KB-A Previous Code 80P6Q-A MASS[Typ.] 0.5g HD *1 D 41 NOTE) 1. DIMENSIONS "*1" AND "*2" 0 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 1 *2 HE E c1 Reference Symbol Dimension in Millimeters Terminal cross section ZE D E A HD E 20 F A1 p b1 c c1 e x y ZD ZE L L1 L L1 Detail F Min Nom Max 11.9 12.0 12.1 11.9 12.0 12.1 1.4 13.8 14.0 14.2 13.8 14.0 14.2 1.7 0.1 0.2 0 0.15 0.20 0.25 0.18 0.09 0.145 0.20 0.125 0° 10 ° 0.5 0.08 0.08 1.25 1.25 0.3 0.5 0.7 1.0 A2 A Rev.4.00 Aug 28, 2006 REJ03B0191-0400 page 135 of 135 A1 c REVISION HISTORY Rev. 1.0 2.0 Date Page 04/06/2001 05/17/2001 Page 1 Page 104 Page 105 Page 145 First edition 7641 GROUP DATA SHEET Description Summary Notes 2 are added. Fig.89 is revised: Explanation of bits 5 to 7 and Notes. Fig.90 is revised: Explanation of flow chart. “USB Transceiver Treatment” Line 9 is revised: “between the USB D+ pin and USB D- pin, or” is deleted. Page 146 URL of Mitsubishi MCU Technical Information Homepage is revised: http://www.infomicom.maec.co.jp Operating temperature range is added. Table 1 is revised: Ext. Cap. function’s explanation is revised. Fig.4 is revised: “A-” is eliminated. Fig.8 is revised: Bit 4 explanation of CPMA is revised. Fig.17 is revised: The symbol of Interrupt control register C is corrected. The pin name SRD is corrected to SRDY. Fig.31 is revised: Serial I/O as interrupt is eliminated. Fig.32 is revised: Bit 5 explanation of DMAxM1 is revised. The flag name in section Priority is corrected to the DMAC Channel x (x =0, 1) Suspend Flag (DxSFI). Page 44 The explanation of section “Interrupt transfer mode” is revised. Page 45 Some explanations of section “USB Reception” is eliminated. Page 46 The all USB internal registers addresses in section USB Function Interrupt is corrected to “005F16”. Page 53 The explanation of section “IN_CSR” is revised. Page 55 Fig.48 is revised: Bits 0 and 3 name of OUT_CSR is corrected. Page 75 Fig.70 is revised: Bit 4 explanation of CPMA is revised. Page 80 Table 10 is revised: AVcc and Ext. Cap. as a parameter is added. Page 88 Table 18 is revised: Ext. Cap. limits are added. Page 91 Table 20 is revised: Test conditions to be determined are eliminated. Page 94 Table 24 is revised: The parameter of td(WR-DB) is revised. Pages 102 The explanation of section “FLASH MEMORY MODE” is revised. to 128 Page 130 The all USB internal registers addresses in section USB Function Interrupt is corrected to “005F16”. The explanation of IN_PKT_RDY is revised. Page 131 The explanation of section “DMA” is revised. Page 132 The explanation of section “USB Transceiver Treatment” is added: In Vcc = 5 V. Power source voltage and Program/Erase voltage of Flash memory mode in FEATURES are updated. Page 7 Fig. 5 is revised: “M37641F8” is in Mass-production status. Page 102 Table 25 is revised. Page 115 Table 28 is revised. Page 133 One usage note is added: Electric Characteristic Differences Between Mask ROM and Flash Memory Version MCUs 3.0 12/27/2001 Page 1 Page 4 Page 6 Page 11 Page 22 Page 31 Page 38 Page 39 Page 42 3.1 3/26/2002 Page 1 4.0 8/28/2006 All pages Package names “80P6N-A” → “PRQP0080GB-A” revised Package names “80P6Q-A” → “PLQP0080KB-A” revised All pages “USB std. spec. ver.1.1” → “Full-Speed USB2.0 specification” 38 DMAC; “(DxCEN)” → “(DxHR)” (1/2) REVISION HISTORY Rev. 4.0 Date Page 8/28/2006 54 70 7641 GROUP DATA SHEET Description Summary 129 130 132 133 134 Fig. 47 “4: To use the AUTO_SET function .... to single buffer mode.” added CLOCK GENERATING CIRCUIT; “No external resistor is needed .... resistor exists on-chip.” → “No external resistor is needed .... depending on conditions.) Fig. 64; Pulled up added, NOTE added UART; “•Do not update .... data might be output.” added USB; “•Use the AUTO_FLUSH Bit .... buffer mode.”, “•To use the AUTO_SET function .... to single buffer mode.” added Oscillator Connection Notice; “The built-in feedback register (400 ) .... pins X IN and XOUT.” → “The built-in feedback register (1 M ) .... pins X IN and XOUT.” Power Source Voltage added USB Communication added “For the mask ROM confirmation .... http://www.infomicom.maec.co.jp/indexe.htm” → “For the mask ROM confirmation .... (http://www.renesas.com).” Package outline revised (2/2) Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. 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