DATASHEET
MK2058-01
COMMUNICATIONS CLOCK JITTER ATTENUATOR
Description
Features
The MK2058-01 is a VCXO (Voltage Controlled Crystal
Oscillator) based clock jitter attenuator designed for system
clock distribution applications. This monolithic IC, combined
with an external inexpensive quartz crystal, can be used to
replace a more costly hybrid VCXO retiming module. The
device accepts and outputs the same clock frequency in
selectable ranges covering 4 kHz to 27 MHz. A dual input
mux is also provided.
• Excellent jitter attenuation for telecom clocks
• Also serves as a general purpose clock jitter attenuator
for distributed system clocks and recovered data or video
clocks
• 2:1 Input MUX for input reference clocks
• No switching glitches on output
• VCXO-based clock generation offers very low jitter and
phase noise generation
By controlling the VCXO frequency within a phase-locked
loop (PLL), the output clock is phase and frequency locked
to the input clock. Through selection of external loop filter
components, the PLL loop bandwidth and damping factor
can be tailored to meet system clock requirements. A loop
bandwidth down to the Hz range is possible.
• Output clock is phase and frequency locked to the
selected input reference clock
• Fixed input to output phase relationship
• +115ppm minimum crystal frequency pullability range,
using recommended crystal
•
•
•
•
•
Industrial temperature range
Low power CMOS technology
20-pin SOIC package
Pb (lead) free package
Single 3.3 V power supply
Block Diagram
Pullable Crystal
ISET
Input Clock ICLK2
Input Clock ICLK1
1
0
Phase
Detector
VDD
X2
VCXO
3
Selectable
Divider
CLK
Charge
Pump
ISEL
SEL2:0
X1
VDD
3
VIN
CHGP
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
1
GND
4
MK2058-01
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
Pin Assignment
X1
VDD
VDD
VDD
VIN
GND
GND
GND
CHGP
ISET
Output Clock Selection Table
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
SEL2 SEL1 SEL0
X2
GND
ISEL
ICLK1
ICLK2
SEL0
CLK
NC
SEL1
SEL2
0
0
0
0
M
M
M
M
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
Input / Output
Range
3.3 to 8.7 kHz
0.64 to 1.68 MHz
1 to 2.7 MHz
1.7 to 4.5 MHz
5 to 13 kHz
6 to 15.75 kHz
26 to 70 kHz
70 to 210 kHz
2.5 to 6.75 MHz
3.4 to 9 MHz
5 to 13.5 MHz
10 to 27 MHz
Crystal
Frequency
3072 x ICLK
16 x ICLK
10 x ICLK
6 x ICLK
2048 x ICLK
1716 x ICLK
384 x ICLK
128 x ICLK
4 x ICLK
3 x ICLK
2 x ICLK
1 x ICLK
Note: For SEL input pin programming:
0 = GND, 1 = VDD, M = Floating
20-pin 300 mil SOIC
Pin Descriptions
Pin
Number
Pin
Name
Pin
Type
Pin Description
1
2
3
4
5
X1
VDD
VDD
VDD
VIN
—
Power
Power
Power
Input
6
7
8
9
GND
GND
GND
CHGP
Power
Power
Power
Output
10
11
ISET
SEL2
—
Input
12
SEL1
Input
13
14
15
NC
CLK
SEL0
Input
Output
Input
16
ICLK2
Input
17
ICLK1
Input
18
ISEL
Input
19
20
GND
X2
Power
—
Crystal Input. Connect this pin to the specified crystal.
Power Supply. Connect to +3.3 V.
Power Supply. Connect to +3.3 V.
Power Supply. Connect to +3.3 V.
VCXO Control Voltage Input. Connect this pin to CHGP pin and the external
loop filter as shown in this data sheet.
Connect to ground.
Connect to ground.
Connect to ground.
Charge Pump Output. Connect this pin to the external loop filter and to pin
VIN.
Charge pump current setting node, connection for setting resistor.
Output Frequency Selection Pin 2. Determines output frequency as per table
above. Internally biased to VDD/2.
Output Frequency Selection Pin 1. Determines output frequency as per table
above. Internal pull-up resistor.
No Internal Connection.
Clock Output.
Output Frequency Selection Pin 0. Determines output frequency as per table
above. Internal pull-up resistor.
Input Clock Connection 2. Connect an input reference clock to this pin. If
unused, connect to ground.
Input Clock Connection 1. Connect an input reference clock to this pin. If
unused, connect to ground.
Input Selection. Used to select which reference input clock is active. Low input
level selects ICLK1, high input level selects ICLK2. Internal pull-up resistor.
Connect to ground.
Crystal Output. Connect this pin to the specified crystal.
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
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Functional Description
of the newly selected input at a controlled phase slope (rate
of phase change) as influenced by the PLL loop
characteristics.
The MK2058-01 is a clock generator IC that generates an
output clock directly from an internal VCXO circuit which
works in conjunction with an external quartz crystal. The
VCXO is controlled by an internal PLL (Phase-Locked Loop)
circuit, enabling the device to perform clock regeneration
from an input reference clock. The MK2058-01 is configured
to provide an output clock that is the same frequency as the
input clock. There are 12 selectable input / output frequency
ranges, each of which is a submultiple of the supported
quartz crystal frequency range. Please refer to the Output
Clock Selection Table on Page 2.
Quartz Crystal
It is important that the correct type of quartz crystal is used
with the MK2058-01. Failure to do so may result in reduced
frequency pullability range, inability of the loop to lock, or
excessive output phase jitter.
The MK2058-01 operates by phase-locking the VCXO
circuit to the input signal of the selected ICLK input. The
VCXO consists of the external crystal and the integrated
VCXO oscillator circuit. To achieve the best performance
and reliability, a crystal device with the recommended
parameters (shown below) must be used, and the layout
guidelines discussed in the PCB Layout Recommendations
section must be followed.
Most typical PLL clock devices use an internal VCO (Voltage
Controlled Oscillator) for output clock generation. By using
a VCXO with an external crystal, the MK2058-01 is able to
generate a low jitter, low phase-noise output clock within a
low bandwidth PLL. This serves to provide input clock jitter
attenuation and enables stable operation with a
low-frequency reference clock.
The frequency of oscillation of a quartz crystal is determined
by its cut and by the external load capacitance. The
MK2058-01 incorporates variable load capacitors on-chip
which “pull”, or change, the frequency of the crystal. The
crystals specified for use with the MK2058-01 are designed
to have zero frequency error when the total of on-chip +
stray capacitance is 14 pF. To achieve this, the layout should
use short traces between the MK2058-01 and the crystal.
The VCXO circuit requires an external pullable crystal for
operation. External loop filter components enable a PLL
configuration with low loop bandwidth.
Application Information
A complete description of the recommended crystal
parameters is in application note MAN05.
Input / Output Frequency Configuration
The MK2058-01 is configured to generate an output
frequency that is equal to the input reference frequency.
Clock frequencies that are supported are those which fall
into the ranges listed in the Output Clock Selection Table on
Page 2. Input bits SEL2:0 are set according to this table, as
is the external crystal frequency. The nominal (center)
frequency of the external crystal will be an integer multiple
of the input / output clock as specified. Please refer to the
Quartz Crystal section on this page regarding external
crystal requirements.
A list of approved crystals is located on the IDT web site.
PLL Loop Filter Components
All analog PLL circuits use a loop filter to establish operating
stability. The MK2058-01 uses external loop filter
components for the following reasons:
1) Larger loop filter capacitor values can be used, allowing
a lower loop bandwidth. This enables the use of lower input
clock reference frequencies and also input clock jitter
attenuation capabilities. Larger loop filter capacitors also
allow higher loop damping factors when less passband
peaking is desired.
Input Mux
The Input Mux serves to select between two alternate input
reference clocks. Upon reselection of the input clock, clock
glitches on the output clock will not be generated due to the
“fly-wheel” effect of the VCXO (the quartz crystal is a high-Q
tuned circuit). When the input clocks are not phase aligned,
the phase of the output clock will change to reflect the phase
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
2) The loop filter values can be user selected to optimize
loop response characteristics for a given application.
Referencing the External Component Schematic on this
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VCXO AND SYNTHESIZER
External Component Schematic
page, the external loop filter is made up of the components
RZ, C1 and C2. RSET establishes PLL charge pump current
and therefore influences loop filter characteristics.
CL
CL
(Refer to Crystal
Tuning section)
Crystal
X1
1
2
3
4
5
6
7
8
9
10
VDD
VDD
VDD
VIN
RS
CP
CS
GND
GND
GND
CHGP
ISET
20
19
18
17
16
15
14
13
12
11
X2
GND
ISEL
ICLK1
ICLK2
SEL0
CLK
NC
SEL1
SEL2
RSET
Recommended Loop Filter Values Vs. Output Frequency Range Selection
Crystal
SEL2 SEL1 SEL0 Multiplier
0
0
0
0
M
M
M
M
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
(N)
3072
16
10
6
2048
1716
384
128
4
3
2
1
RSET
RS
CS
CP
120 kΩ
1.4 MΩ
1.4 MΩ
1.4 MΩ
540 kΩ
540 kΩ
1.4 MΩ
1.4 MΩ
1.4 MΩ
1.4 MΩ
1.4 MΩ
1.4 MΩ
750 kΩ
160 kΩ
130 kΩ
100 kΩ
1.2 MΩ
1.1 MΩ
820 kΩ
470 kΩ
82 kΩ
68 kΩ
56 kΩ
39 kΩ
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
4.7 nF
Loop
Bandwidth
Damping
Factor
(-3dB point)
14 Hz
60 Hz
75 Hz
95 Hz
8.5 Hz
9 Hz
12 Hz
20 Hz
120 Hz
130 Hz
160 Hz
225 Hz
1
1
1
1
1
1
1
1
1
1
1
1
Note: For SEL input pin programming: 0 = GND, 1 = VDD, M = Floating
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
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VCXO AND SYNTHESIZER
A “normalized” PLL loop bandwidth may be calculated as
follows:
Special considerations must be made in choosing loop
components CS and CP. These recommendations can be
found in the design aid tools section of www.idt.com
R S × I CP × 575
NBW = ----------------------------------------N
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50Ω trace (a commonly
used trace impedance), place a 33Ω resistor in series with
the clock line, as close to the clock output pin as possible.
The nominal impedance of the clock output is 20Ω. (The
optional series termination resistor is not shown in the
External Component Schematic.)
The “normalized” bandwidth equation above does not take
into account the effects of damping factor or the second
pole. However, it does provide a useful approximation of
filter performance.
The loop damping factor is calculated as follows:
Damping Factor = R S ×
Decoupling Capacitors
As with any high-performance mixed-signal IC, the
MK2058-01 must be isolated from system power supply
noise to perform optimally.
625 × I CP × C S
------------------------------------------N
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane. To further
guard against interfering system supply noise, the
MK2058-01 should use one common connection to the PCB
power plane as shown in the diagram on the next page. The
ferrite bead and bulk capacitor help reduce lower frequency
noise in the supply that can lead to output clock phase
modulation.
Where:
RS = Value of resistor in loop filter (Ohms)
ICP = Charge pump current (amps)
(refer to Charge Pump Current Table, below)
N = Crystal multiplier shown in the above table
CS = Value of capacitor C1 in loop filter (Farads)
Recommended Power Supply Connection for
Optimal Device Performance
As a general rule, the following relationship should be
maintained between components C1 and C2 in the loop
filter:
V D D P in
C onnection to 3.3V
P ow er P lane
Ferrite
Bead
V D D P in
C
CP
= -----S-
B ulk D ecoupling C apacitor
(such as 1 F Tantalum )
20
Charge Pump Current Table
RSET
1.4 MΩ
680 kΩ
540 kΩ
120 kΩ
0.01
Charge Pump Current
(ICP)
10 µA
20 µA
25 µA
100 µA
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
V D D P in
F D ecoupling C apacitors
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to ground,
shown as CL in the External Component Schematic. These
capacitors are used to adjust the stray capacitance of the
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
plane layer used by the device.
board to match the nominally required crystal load
capacitance. Because load capacitance can only be
increased in this trimming process, it is important to keep
stray capacitance to a minimum by using very short PCB
traces (and no via’s) been the crystal and device.
The IDT Applications Note MAN05 may also be referenced
for additional suggestions on layout of the crystal section.
In most cases the load capacitors will not be required. They
should not be stuffed on the prototype evaluation board as
the indiscriminate use of these trim capacitors will typically
cause more crystal centering error than their absence. If the
need for the load capacitors is later determined, the values
will fall within the 1-4 pf range. The need for, and value of,
these trim capacitors can only be determined at prototype
evaluation. Please refer to MAN05 for the procedure to
determine the component values.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed. Please
also refer to the Recommended PCB Layout drawing on
page 7.
1) Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be kept as short as possible, as should the PCB trace to the
ground via. Distance of the ferrite bead and bulk decoupling
from the device is less critical.
2) The loop filter components must also be placed close to
the CHGP and VIN pins. CP should be closest to the device.
Coupling of noise from other system signal traces should be
minimized by keeping traces short and away from active
signal traces. Use of vias should be avoided.
3) The external crystal should be mounted just next to the
device with short traces. The X1 and X2 traces should not
be routed next to each other with minimum spaces, instead
they should be separated and away from other traces.
4) To minimize EMI, the 33Ω series termination resistor (if
needed) should be placed close to the clock output.
5) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (the ferrite bead and bulk decoupling capacitor can be
mounted on the back). Other signal traces should be routed
away from the MK2058-01. This includes signal traces just
underneath the device, or on layers adjacent to the ground
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
Recommended PCB Layout
For m inim um output clock jitter,
rem ove ground and pow er plane
w ithin this entire area. A lso route
all other traces aw ay from this area.
G
For m inim um output clock jitter,
device V D D connections should
be m ade to com m on bulk
decoupling device (see text).
G
G
G
G
1
2
3
4
5
6
7
8
9
10
G
G
G
G
20
19
18
17
16
15
14
13
12
11
NC
Legend:
G
G
= G round
C onnection
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the MK2058-01. These ratings, which are
standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDD
7V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature
-40 to +85° C
Storage Temperature
-65 to +150° C
Junction Temperature
125° C
Soldering Temperature
260° C
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
Recommended Operation Conditions
Parameter
Min.
Ambient Operating Temperature
Typ.
Max.
Units
+85
°C
+3.45
V
-40
Power Supply Voltage (measured in respect to GND)
+3.15
+3.3
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
3.15
3.3
3.45
V
10
15
mA
Operating Voltage
VDD
Supply Current
IDD
Input High Voltage, SEL2
VIH
Input Low Voltage, SEL2
VIL
Input High Voltage, ISEL,
SEL1:0
VIH
Input Low Voltage, ISEL,
SEL1:0
VIL
Input High Voltage, ICLK1, 2
VIH
Input Low Voltage, ICLK1, 2
VIL
Input High Current
IIH
VIH = VDD
Input Low Current
IIL
VIL = 0
Input Capacitance, except X1
CIN
Output High Voltage (CMOS
Level)
VOH
IOH = -4 mA
VDD-0.4
V
Output High Voltage
VOH
IOH = -8 mA
2.4
V
Output Low Voltage
VOL
IOL = 8 mA
Short Circuit Current
IOS
VIN, VCXO Control Voltage
VXC
Nominal Output Impedance
ZOUT
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
Clock outputs
unloaded, VDD = 3.3 V
VDD-0.5
V
0.5
2
V
0.8
V
V
VDD/2+1
VDD/2-1
V
-10
+10
µA
-10
+10
µA
7
pF
0.4
±50
0
V
mA
VDD
V
Ω
20
8
V
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
AC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C
Parameter
Symbol
VCXO Crystal Pull Range
fXP
VCXO Crystal Nominal
Frequency
fX
Input Jitter Tolerance
tji
Input pulse width (1)
tpi
Output Frequency Error
Conditions
Using recommended
crystal
Min.
Typ. Max. Units
-115
+115
ppm
8.5
27
MHz
0.4
UI
10
FOUT
ICLK = 0 ppm error
0
Output Duty Cycle
(% high time)
tOD
Measured at VDD/2,
CL=15 pF
40
Output Rise Time
tOR
Output Fall Time
ns
0
0
ppm
60
%
0.8 to 2.0V , CL=15 pF
1.5
ns
tOF
2.0 to 0.8 V, CL=15 pF
1.5
ns
Skew, Input to Output Clock
tIO
Rising edges, CL=15 pF
+5
ns
Cycle Jitter (short term jitter)
tja
Timing Jitter, Filtered
500 Hz-1.3 MHz (OC-3)
tjf
Timing Jitter, Filtered
65 kHz-1.3 MHz (OC-3)
tjf
-5
150
ps p-p
Referenced to
Mitel/Zarlink MT9045,
Note 2
210
ps p-p
Referenced to
Mitel/Zarlink MT9045,
Note 2
150
ps p-p
Note 1: Minimum high or low time of input clock.
Note 2: Input reference is the 19.44 MHz output from a Mitel/Zarlink MT9045 device in freerun mode
(SEL2:0 = 111, 19.44 MHz external crystal).
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
Symbol
Conditions
Min.
Typ.
Max. Units
θ JA
Still air
83
° C/W
θ JA
1 m/s air flow
71
° C/W
θ JA
3 m/s air flow
58
° C/W
46
° C/W
θ JC
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VCXO AND SYNTHESIZER
Package Outline and Package Dimensions (20-pin SOIC, 300 Mil. Wide Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Symbol
A
A1
A2
B
C
D
E
e
H
h
L
α
In d e x
A re a
E
H
1
2
h x 45o
D
Min
Max
-2.65
1.10
-2.05
2.55
0.33
0.51
0.18
0.32
12.60
13.00
7.40
7.60
1.27 Basic
10.00
10.65
0.25
0.75
0.40
1.27
0°
8°
Min
Max
-0.104
0.0040
-0.081
0.100
0.013
0.020
0.007
0.013
0.496
0.512
0.291
0.299
0.050 Basic
0.394
0.419
0.010
0.029
0.016
0.050
0°
8°
*For reference only . Controlling dimensions in mm.
A2
A1
Inches*
A
e
L C
B
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
MK2058-01SILF
MK2058-01SILF
Tubes
20-pin SOIC
-40 to +85° C
MK2058-01SILFTR
MK2058-01SILF
Tape and Reel
20-pin SOIC
-40 to +85° C
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ COMMUNICATIONS CLOCK JITTER ATTENUATOR
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COMMUNICATIONS CLOCK JITTER ATTENUATOR
VCXO AND SYNTHESIZER
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