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MK2304S-2LF

MK2304S-2LF

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC PLL ZD BUFFER LO SKEW 8-SOIC

  • 数据手册
  • 价格&库存
MK2304S-2LF 数据手册
DATASHEET MK2304-2 ZERO DELAY, LOW SKEW BUFFER Description Features The MK2304-2 is a low jitter, low skew, high performance Phase Lock Loop (PLL) based zero delay buffer for high speed applications. Based on IDT’s proprietary low jitter PLL techniques, the device provides four low skew outputs at speeds up to 133 MHz at 3.3 V. The MK2304-2 includes a bank of two outputs running at 1/2X. In the zero delay mode, the rising edge of the input clock is aligned with the rising edges of all 4 outputs. Compared to competitive CMOS devices, the MK2304-2 has the lowest jitter. • • • • • • • The MK2304-2 PLL enters a power-down state when there are no rising edges on the REF input. In this mode, all outputs are tri-stated and the PLL is turned off, resulting in leass than 25 µA of current draw. • Spread SmartTM technology works with spread spectrum Packaged in 8 pin SOIC Zero input-output delay Two 1X outputs plus two 1/2X outputs Output to output skew is less than 200 ps Output clocks up from 10 MHz to 133 MHz at 3.3 V Ability to generate 2X the input Full CMOS outputs with 8 mA output drive capability at TTL levels at 3.3 V clock generators • • • • • IDT manufactures the largest variety of clock generators and buffers and is the largest clock supplier in the world. Advanced, low power, sub micron CMOS process Operating voltage of 3.3 V Available in industial temperature operation Pb (lead) free package Low Standby Current Block Diagram VDD 1 FBIN CLKIN CLKA1 PLL CLKA2 BANK A CLKB1 /2 CLKB2 BANK B 1 GND IDT™ ZERO DELAY, LOW SKEW BUFFER 1 MK2304-2 REV G 051310 MK2304-2 ZERO DELAY, LOW SKEW BUFFER ZDB Pin Assignment Feedback Configuration Table REF 1 8 FBK CLKA1 2 7 VDD CLKA2 3 6 CLKB2 GND 4 5 CLKB1 Feedback From Bank A Bank B CLKA1:A2 CLKIN 2XCLKIN CLKB1:B2 CLKIN/2 CLKIN 8 Pi n ( 150 mi l ) SOI C Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1 REF Input 2 CLKA1 Output Clock A1 output. 3 CLKA2 Output Clock A2 output. 4 GND Power Connect to ground. 5 CLKB1 Output Clock B1 output. 6 CLKB1 Output Clock B2 output. 7 VDD Power 3.3V Power Supply. 8 FBK Input PLL feedback input Clock input. Connect to input clock source, 5 V tolerant input. External Components The Mk2304-2 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.1µF should be connected between VDD and GND, as close to the part as possible. A 33Ω series terminating resistor should be used on each clock output to reduce reflections. IDT™ ZERO DELAY, LOW SKEW BUFFER 2 MK2304-2 REV G 051310 MK2304-2 ZERO DELAY, LOW SKEW BUFFER ZDB Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the MK2304-2. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs, except CLKIN -0.5 V to VDD+0.5 V CLKIN -0.5 V to +5.5 V Ambient Operating Temperature (commercial) 0 to +70 ° C Ambient Operating Temperature (industrial) -40 to +85 ° C Storage Temperature -65 to +150 ° C Junction Temperature 125 ° C Soldering Temperature 260 ° C Recommended Operation Conditions Parameter Min. Max. Units 0 +70 °C Ambient Operating Temperature (industrial) -40 +85 °C Power Supply Voltage (measured in respect to GND) +3.0 +3.6 V Ambient Operating Temperature (commercial) Typ. DC Electrical Characteristics VDD=3.3 V ±10%, Amb temp -40° C to 85° C Parameter Symbol Conditions Min. Typ. Operating Voltage VDD 3.0 Input High Voltage VIH 2 Input Low Voltage VIL Output High Voltage VOH IOH = -8 mA Output Low Voltage VOL IOL = 8 mA Operating Supply Current 100 MHz, CLKIN IDD No Load 45 Stand by Supply Current 0 MHz, CLKIN IDD No Load 12 Short Circuit Current IOS Each output Input Capacitance CIN FBIN Units 3.6 V V 0.8 Power-up Time IDT™ ZERO DELAY, LOW SKEW BUFFER Max. 2.4 V 0.4 V mA 25 uA TBD mA 7 pF 50 3 V MK2304-2 ms REV G 051310 MK2304-2 ZERO DELAY, LOW SKEW BUFFER ZDB AC Electrical Characteristics VDD = 3.3V ±10%, Ambient Temperature -40° C to 85° C Parameter Symbol Conditions Min. Typ. Max. Units Output Frequency FBIN to CLKA1, 30 pF Load 10 100 MHz Output Frequency FBIN to CLKA1, 15 pf Load 10 133 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=30 pF 2.2 ns Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.5 ns Output Fall Time tOF 0.8 to 2.0 V, CL=30 pF 2.2 ns Output Fall Time tOF 0.8 to 2.0 V, CL=15 pF 1.5 ns Output Clock Duty Cycle At 1.4 V, CL=30 pf 40 50 60 % Output Clock Duty Cycle At 1.4 V, CL=15 pf 45 50 65 % Device-to-Device skew, equally loaded Rising edges at VDD/2 500 ps Output-to-Output skew, equally loaded, On same bank Rising edges at VDD/2 200 ps Skew from Output Bank A to Output Bank B All outputs equally loaded 400 ps Delay CLKIN Rising Edge to FBIN Rising Edge Measured at VDD/2 ±250 ps Cycle-to-Cycle Jitter 30 pF loads 66.67 MHz outputs 400 ps 15 pF loads 66.67 MHz outputs 375 ps 1 ms PLL Lock Time Stable power supply, valid clocks on CLKIN, FBIN tLOCK Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case IDT™ ZERO DELAY, LOW SKEW BUFFER Symbol Conditions Min. Typ. Max. Units θJA Still air 120 ° C/W θJA 1 m/s air flow 115 ° C/W θJA 3 m/s air flow 105 ° C/W 58 ° C/W θJC 4 MK2304-2 REV G 051310 MK2304-2 ZERO DELAY, LOW SKEW BUFFER ZDB Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 Symbol E A A1 B C D E e H h L α H INDEX AREA 1 2 D Min Max 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Inches* Min Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° *For reference only. Controlling dimensions are in mm. A h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature MK2304S-2LF 2304S02L Tubes 8-pin SOIC 0 to 70° C MK2304S-2LFTR 2304S02L Tape and Reel 8-pin SOIC 0 to 70° C MK2304S-2ILF 2304S2IL Tubes 8-pin SOIC -40° C to 85° C MK2304S-2ILFTR 2304S2IL Tape and Reel 8-pin SOIC -40° C to 85° C Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT™ ZERO DELAY, LOW SKEW BUFFER 5 MK2304-2 REV G 051310 MK2304-2 ZERO DELAY, LOW SKEW BUFFER ZDB Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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