NE3510M04-T2-A

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET HETERO JUNCTION FIELD EFFECT TRANSISTOR NE3510M04 L TO S BAND LOW NOISE AMPLIFIER N-CHANNEL HJ-FET FEATURES • Low noise figure and high associated gain NF = 0.45 dB TYP., Ga = 16 dB TYP. @ f = 4 GHz, VDS = 2 V, ID = 15 mA NF = 0.35 dB TYP., Ga = 19 dB TYP. @ f = 2 GHz, VDS = 2 V, ID = 10 mA (Reference only) • Flat-lead 4-pin thin-type super minimold (M04) package APPLICATIONS • Satellite radio (SDARS, DMB, etc.) antenna LNA • Low noise amplifier for microwave communication system ORDERING INFORMATION Part Number NE3510M04 NE3510M04-A NE3510M04-T2 Order Number NE3510M04-T2-A NE3510M04-T2B NE3510M04-T2B-A Package Flat-lead 4-pin thin-type super minimold (M04) (Pb-Free) Quantity 50 pcs (Non reel) Marking V81 Supplying Form • 8 mm wide embossed taping • Pin 1 (Source), Pin 2 (Drain) face 3 kpcs/reel the perforation side of the tape 15 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: NE3510M04 ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Symbol Ratings Unit Drain to Source Voltage VDS 4.0 V Gate to Source Voltage VGS −3.0 V Drain Current ID IDSS mA Gate Current IG 140 μA 125 mW Total Power Dissipation Ptot Note Channel Temperature Tch +150 °C Storage Temperature Tstg −65 to +150 °C Note Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10676EJ02V0DS (2nd edition) Date Published October 2008 NS Printed in Japan The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. 2007, 2008 NE3510M04 RECOMMENDED OPERATING CONDITIONS (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit VDS − 2 3 V Drain Current ID − 15 30 mA Input Power Pin − − 0 dBm Drain to Source Voltage ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Gate to Source Leak Current IGSO VGS = −3 V − 0.5 10 μA Saturated Drain Current IDSS VDS = 2 V, VGS = 0 V 42 70 97 mA VGS (off) VDS = 2 V, ID = 100 μA −0.35 −0.7 −1.10 V Transconductance gm VDS = 2 V, ID = 15 mA 70 − − mS Noise Figure NF VDS = 2 V, ID = 15 mA, f = 4 GHz − 0.45 0.65 dB Associated Gain Ga 14.5 16 − dB − +11 − dBm Gate to Source Cutoff Voltage Gain 1 dB Compression Output Power 2 PO (1 dB) VDS = 2 V, ID = 15 mA (Non-RF), f = 4 GHz Data Sheet PG10676EJ02V0DS NE3510M04 TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE 100 Mounted on Glass Epoxy PCB (1.08 cm2 × 1.0 mm (t) ) Drain Current ID (mA) 200 150 100 80 70 60 50 40 30 10 100 150 200 0 –1.0 250 –0.8 –0.6 –0.4 –0.2 Ambient Temperature TA (°C) Gate to Source Voltage VGS (V) MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. FREQUENCY DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE Ga 0.6 0.5 0.4 0.3 0.2 0.1 0.0 NFmin 0 5 10 24 VDS = 2 V 22 ID = 15 mA 20 18 16 14 12 10 8 6 4 2 0 15 100 90 Drain Current ID (mA) 1.2 1.1 1.0 0.9 0.8 0.7 0 VGS = 0 V 80 –0.1 V 70 –0.2 V 60 –0.3 V 50 40 –0.4 V 30 –0.5 V 20 –0.6 V 10 –0.7 V 0 0 1 2 3 4 5 Drain to Source Voltage VDS (V) MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. DRAIN CURRENT MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. DRAIN CURRENT 1.2 f = 2.0 GHz 1.1 VDS = 2 V 1.0 0.9 0.8 0.7 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 Ga NFmin 5 10 15 20 25 30 24 22 20 18 16 14 12 10 8 6 4 2 0 35 Minimum Noise Figure NFmin (dB) Frequency f (GHz) 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 Drain Current ID (mA) Ga NFmin 5 10 15 20 24 f = 4.0 GHz 22 VDS = 2 V 20 18 16 14 12 10 8 6 4 2 0 25 30 35 Associated Gain Ga (dB) 50 Associated Gain Ga (dB) Minimum Noise Figure NFmin (dB) VDS = 2 V 20 50 0 Minimum Noise Figure NFmin (dB) 90 Associated Gain Ga (dB) Total Power Dissipation Ptot (mW) 250 Drain Current ID (mA) Remark The graphs indicate nominal characteristics. Data Sheet PG10676EJ02V0DS 3 NE3510M04 OUTPUT POWER, GAIN, DRAIN CURRENT, GATE CURRENT vs. INPUT POWER 20 60 f = 4 GHz, VDS = 2 V ID = 15 mA set (Non-RF) Gain 50 Pout (1 tone) 10 40 5 30 0 20 ID –5 –10 –20 –15 –10 –5 10 IG 0 Drain Current ID (mA) Gate Current IG (mA) Output Power Pout (1 tone) (dBm) Gain (dB) 15 5 10 0 15 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3, DRAIN CURRENT vs. INPUT POWER 20 50 f = 4 GHz, VDS = 2 V ID = 15 mA set (Non-RF) OIP3 = +20 dBm 45 Pout 10 40 0 35 IIP3 = +4 dBm –10 30 IM3 (H) –20 25 IM3 (L) –30 20 –40 15 –50 ID –60 –70 –40 5 –30 –20 –10 Input Power Pin (1 tone) (dBm) Remark The graphs indicate nominal characteristics. 4 10 Data Sheet PG10676EJ02V0DS 0 0 10 Drain Current ID (mA) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 30 NE3510M04 S-PARAMETERS S-parameters and noise parameters are provided on our Web site in a format (S2P) that enables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. Click here to download S-parameters. [RF and Microwave] → [Device Parameters] URL http://www.necel.com/microwave/en/ Data Sheet PG10676EJ02V0DS 5 NE3510M04 PACKAGE DIMENSIONS FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04) (UNIT: mm) PIN CONNECTIONS 1. 2. 3. 4. 6 Source Drain Source Gate Data Sheet PG10676EJ02V0DS 2.0±0.1 2 1 1.25 3 4 1.30 0.65 1.30 3 4 0.30+0.1 –0.05 0.11+0.1 –0.05 1 0.30+0.1 –0.05 0.59±0.05 (1.05) 0.65 0.60 0.65 1.25 2 1.25±0.1 V81 2.0±0.1 (Bottom View) 0.30+0.1 –0.05 0.40+0.1 –0.05 2.05±0.1 NE3510M04 MOUNTING PAD DIMENSIONS (REFERENCE ONLY) FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04) (UNIT: mm) 3 4 0.5 1 1.3 1.25 0.6 2 1.6 0.6 Data Sheet PG10676EJ02V0DS 7 NE3510M04 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 8 Data Sheet PG10676EJ02V0DS IR260 HS350 NE3510M04 • The information in this document is current as of October, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PG10676EJ02V0DS 9 NE3510M04 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.