NE5500234-T1-AZ

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(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET SILICON POWER MOS FET NE5500234 N-CHANNEL SILICON POWER MOS FET POWER AMPLIFIER FOR DCS1800/PCS1900 HANDSETS DESCRIPTION The NE5500234 is an N-channel silicon power MOS FET specially designed as the transmission power amplifier for DCS1800 and PCS1900 handsets. Dies are manufactured using our NEWMOS technology (our 0.6 μm WSi gate lateral MOS FET), housed in a surface mount 3-pin power Minimold (34 PKG) (SOT-89 type) package. The device can deliver 32.5 dBm output power with 50% power added efficiency at 1.9 GHz under the 4.8 V supply voltage. FEATURES • High output power : Pout = 32.5 dBm TYP. (VDS = 4.8 V, IDset = 400 mA, f = 1.9 GHz, Pin = 25 dBm) • High power added efficiency : ηadd = 50% TYP. (VDS = 4.8 V, IDset = 400 mA, f = 1.9 GHz, Pin = 25 dBm) • High linear gain : GL = 11 dB TYP. (VDS = 4.8 V, IDset = 400 mA, f = 1.9 GHz) • Surface mount package : 3-pin power Minimold (34 PKG) (SOT-89 type) • Single supply : VDS = 3.0 to 6.0 V APPLICATIONS • Digital cellular phones : DCS1800/PCS1900 handsets • Handheld transceiver : FRS (Family Radio Service), GMRS (General Mobile Radio Service) • Others : General purpose amplifiers for various applications ORDERING INFORMATION Part Number NE5500234 Order Number NE5500234-AZ Package Marking 3-pin power minimold V2 (SOT-89, Our code: 34) Supplying Form • Magazine case • Qty 25 pcs/case (Pb-Free : External solder plating) NE5500234-T1 NE5500234-T1-AZ 3-pin power minimold (SOT-89, Our code: 34) (Pb-Free : External • 12 mm wide embossed taping • Source pin face the perforation side of the tape • Qty 1 kpcs/reel solder plating) Remarks 1. To order evaluation samples, contact your nearby sales office. Part number for sample order: NE5500234 2. This product is containing Pb-material inside. Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10405EJ02V0DS (2nd edition) Date Published August 2007 NS Printed in Japan The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. 2004, 2007 NE5500234 ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Operation in excess of any one of these parameters may result in permanent damage. Parameter Symbol Ratings Unit Drain to Source Voltage VDS 20 V Gate to Source Voltage VGS 6.0 V ID 1.0 A Total Power Dissipation Ptot 10 W Channel Temperature Tch 125 °C Storage Temperature Tstg −65 to +125 °C Test Conditions MIN. TYP. MAX. Unit Drain Current RECOMMENDED OPERATING CONDITIONS Parameter Symbol Drain to Source Voltage VDS 3.0 4.8 6.0 V Gate to Source Voltage VGS 0 2.0 3.5 V Drain Current ID Duty Cycle ≤ 50%, Ton ≤ 1 s − 0.75 1.0 A Input Power Pin f = 1.9 GHz, VDS = 4.8 V − − 27 dBm MIN. TYP. MAX. Unit ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified, using our standard test fixture.) Parameter Symbol Test Conditions Gate to Source Leakage Current IGSO VGS = 6.0 V − − 100 nA Drain to Source Leakage Current (Zero Gate Voltage Drain Current) IDSS VDS = 8.5 V − − 100 nA Gate Threshold Voltage Vth VDS = 4.8 V, IDS = 1 mA 1.0 1.4 2.0 V Thermal Resistance Rth Channel to Case − 10 − °C/W Transconductance gm VDS = 4.8 V, IDS = 500 mA − 840 − mS IDSS = 10 μA 20 24 − V 31.5 32.5 − dBm − 610 − mA 43 50 − % − 11.0 − dB Drain to Source Breakdown Voltage Output Power Drain Current Power Added Efficiency Linear Gain Note BVDSS Pout ID ηadd f = 1.9 GHz, VDS = 4.8 V, Pin = 25 dBm, IDset = 400 mA (RF OFF) GL Note Pin = 10 dBm DC performance is 100% testing. RF performance is testing several samples per wafer. Wafer rejection criteria for standard devices is 1 reject for several samples. 2 Data Sheet PU10405EJ02V0DS NE5500234 TYPICAL CHARACTERISTICS (TA = +25°C) SET DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE Drain Current ID (A) 6 10 000 VGS = 10 V MAX. Step = 1.0 V VDS = 3.5 V VGS = 10 V 9V 8V 7V 5 Set Drain Current IDset (mA) 7 6V 4 5V 3 4V 2 3V 1 1 000 100 10 2V 6 8 10 12 14 1 000 f = 460 MHz f = 460 MHz VDS = 6.0 V Pout 100 50 5 10 15 20 Drain Current ID (mA) VDS = 6.0 V 4.8 V 3.8 V 800 4.8 V 3.8 V 600 400 200 0 30 25 0 0 5 10 15 20 25 30 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER, EFFICIENCY vs. INPUT POWER DRAIN CURRENT vs. INPUT POWER 1 200 f = 915 MHz VDS = 6.0 V 4.8 V 3.8 V f = 915 MHz 100 80 25 20 60 15 40 η 10 20 5 10 VDS = 6.0 V 1 000 Pout 5 0 3.0 DRAIN CURRENT vs. INPUT POWER η 30 2.5 OUTPUT POWER, EFFICIENCY vs. INPUT POWER 20 35 2.0 Gate to Source Voltage VGS (V) 25 40 1.5 Drain to Source Voltage VDS (V) 30 15 0 1 1.0 16 15 20 25 0 30 Drain Current ID (mA) 35 4 Efficiency η (%) Output Power Pout (dBm) 40 2 Efficiency η (%) 0 0 Output Power Pout (dBm) 4.8 V 800 3.8 V 600 400 200 0 0 5 10 15 20 25 30 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10405EJ02V0DS 3 NE5500234 OUTPUT POWER vs. INPUT POWER 30 800 f = 1.9 GHz VDS = 4.8 V IDset = 400 mA Drain Current ID (mA) Output Power Pout (dBm) 35 VDS = 3.8 V IDset = 200 mA 25 20 15 10 5 DRAIN CURRENT vs. INPUT POWER 10 15 20 25 30 600 VDS = 4.8 V IDset = 400 mA 400 VDS = 3.8 V IDset = 200 mA 200 0 5 POWER ADDED EFFICIENCY vs. INPUT POWER Power Added Efficiency ηadd (%) f = 1.9 GHz 80 60 40 VDS = 3.8 V IDset = 200 mA 20 0 5 VDS = 4.8 V IDset = 400 mA 10 15 20 25 30 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 4 10 15 20 Input Power Pin (dBm) Input Power Pin (dBm) 100 f = 1.9 GHz Data Sheet PU10405EJ02V0DS 25 30 NE5500234 PACKAGE DIMENSIONS 3-PIN POWER MINIMOLD (34 PKG) (UNIT: mm) (Bottom View) (Side View) (Top View) 4.5±0.1 1.5±0.1 1.6±0.2 0.8 MIN. 3 0.42±0.06 4.0±0.25 2 1 2.5±0.1 V2 2 3 2 0.42±0.06 0.41+0.03 –0.06 1 0.47±0.06 1.5 3.0 PIN CONNECTIONS 1. Drain 2. Source 3. Gate Data Sheet PU10405EJ02V0DS 5 NE5500234 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Caution 6 Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Do not use different soldering methods together (except for partial heating). Data Sheet PU10405EJ02V0DS HS350 NE5500234 • The information in this document is current as of August, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1