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NP35N055YUK-E1-AY

NP35N055YUK-E1-AY

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SMD8_EP

  • 描述:

    MOSFET N-CH 55V 35A 8HSON

  • 数据手册
  • 价格&库存
NP35N055YUK-E1-AY 数据手册
Preliminary Data Sheet NP35N055YUK R07DS1002EJ0200 Rev.2.00 May 24, 2018 55 V – 35 A – N-channel Power MOS FET Application: Automotive Description The NP35N055YUK is N-channel MOS Field Effect Transistors designed for high current switching applications. Features  Super low on-state resistance RDS(on) = 6.7 m MAX. (VGS = 10 V, ID = 18 A)  Non logic level drive type  Designed for automotive application and AEC-Q101 qualified Ordering Information Part No. NP35N055YUK-E1-AY *1 NP35N055YUK-E2-AY *1 Note: Lead Plating Pure Sn (Tin) Tape 2500 p/reel Packing Taping (E1 type) Taping (E2 type) Package 8-pin HSON *1 Pb-free (This product does not contain Pb in the external electrode) Absolute Maximum Ratings (TA = 25°C) Item Drain to Source Voltage (VGS = 0 V) Gate to Source Voltage (VDS = 0 V) Drain Current (DC) (TC = 25°C) Drain Current (pulse) *1, 4 Total Power Dissipation (TC = 25°C) Total Power Dissipation (TA = 25°C) *2 Channel Temperature Storage Temperature Repetitive Avalanche Current *3, 4 Repetitive Avalanche Energy *3, 4 Symbol VDSS VGSS ID(DC) ID(pulse) PT1 PT2 Tch Tstg IAR EAR Ratings 55 20 35 140 97 1.0 175 –55 to +175 24 58 Unit V V A A W W °C °C A mJ Thermal Resistance Channel to Case Thermal Resistance Channel to Ambient Thermal Resistance Notes: *1 *2 *3 *4. Rth(ch-C)*4 Rth(ch-A) *4 1.55 150 °C/W °C/W TC = 25°C, PW  10 s, Duty Cycle  1% Mounted on glass epoxy substrate of 40 mm  40 mm  1.6 mmt with 4% Copper area (35 m) RG = 25 , VGS = 20 V  0 V Not subject of production test. Verified by design/characterization. R07DS1002EJ0200 Rev.2.00 May 24, 2018 Page 1 of 6 NP35N055YUK Preliminary Electrical Characteristics (TA = 25°C) Item Zero Gate Voltage Drain Current Gate Leakage Current Gate to Source Threshold Voltage Forward Transfer Admittance *1 Drain to Source On-state Resistance *1 Input Capacitance *2 Output Capacitance *2 Reverse Transfer Capacitance *2 Turn-on Delay Time *2 Rise Time *2 Turn-off Delay Time *2 Fall Time *2 Total Gate Charge *2 Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage *1 Reverse Recovery Time Reverse Recovery Charge Symbol IDSS IGSS VGS(th) | yfs | RDS(on) Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr MIN. — — 2.0 18 — — — — — — — — — — — — — — TYP. — — 3.0 36 5.3 2240 230 95 19 9 47 4 38 10 10 0.9 35 41 MAX. 1 100 4.0 — 6.7 3360 350 180 38 22 94 10 57 — — 1.5 — — Unit A nA V S m pF pF pF ns ns ns ns nC nC nC V ns nC Test Conditions VDS = 55 V, VGS = 0 V VGS = 20 V, VDS = 0 V VDS = VGS, ID = 250 A VDS = 5 V, ID = 18 A VGS = 10 V, ID = 18 A VDS = 25 V VGS = 0 V f = 1 MHz VDD = 28 V, ID = 18 A VGS = 10 V RG = 0  VDD = 44 V VGS = 10 V ID = 35 A IF = 35 A, VGS = 0 V IF = 35 A, VGS = 0 V di/dt = 100 A/s Note: *1 Pulsed test Note: *2 Not subject of production test. Verified by design/characterization. TEST CIRCUIT 1 AVALANCHE CAPABILITY D.U.T. RG = 25 Ω PG. VGS = 20 → 0 V TEST CIRCUIT 2 SWITCHING TIME D.U.T. L 50 Ω RL Wave Form RG PG. VDD VGS VGS VDD 0 VGS 10% 90% VDS 90% ID IAS 90% VDS VGS 0 BVDSS VDS 10% 0 10% Wave Form VDS VDD Starting Tch τ τ = 1 μs Duty Cycle ≤ 1% td(on) tr ton td(off) tf toff TEST CIRCUIT 3 GATE CHARGE PG. D.U.T. IG = 2 mA RL 50 Ω VDD R07DS1002EJ0200 Rev.2.00 May 24, 2018 Page 2 of 6 NP35N055YUK Preliminary Typical Characteristics (TA = 25°C) TOTAL POWER DISSIPATION vs. CASE TEMPERATURE 120 120 PT - Total Power Disslpation - W dT - Percentage of Rated Power - % DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 100 80 60 40 20 0 0 25 50 75 100 125 150 100 80 60 40 20 0 175 0 25 TC - Case Temperature - °C 50 75 100 125 150 175 TC - Case Temperature - °C FORWARD BIAS SAFE OPERATING AREA ID(Pulse) = 140 A RDS(ON) Limited 100 (V =10 V) GS PW = ID(DC) = 35 A 0 μs Power Dissipation Limited PW 10 10 =1 ms 1 Secondary Breakdown Limited =1 s 0m DC TC = 25°C Single Pulse 0.1 0.1 PW ID - Drain Current - A 1000 1 10 100 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH Rth(t) - Transient Thermal Resistance - °C/W 1000 Rth(ch-A) = 150°C/W 100 10 Rth(ch-C) = 1.55°C/W 1 0.1 Single pulse Mounted on glass epoxy substrate of 40 mm × 40 mm × 1.6 mmt with 4% copper area (35 μm) 0.01 100 μ 1m 10 m 100 m 1 10 100 1000 PW - Pulse Width - s R07DS1002EJ0200 Rev.2.00 May 24, 2018 Page 3 of 6 NP35N055YUK Preliminary DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE FORWARD TRANSFER CHARACTERISTICS 160 100 ID - Drain Curent - A 100 80 60 40 0.2 0.4 0.6 0.8 1.0 0.1 0.001 1.2 VDS = 10 V Pulsed 0 1 2 3 4 5 6 VDS - Drain to Source Voltage - V VGS - Gate to Source Voltage - V GATE TO SOURCE THRESHOLD VOLTAGE vs. CHANNEL TEMPERATURE FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 4 |yfs| - Forward Transfer Admittance - S VGS(th) - Gate to Source Threshold Voltage - V RDS(on) - Drain to Source On-State Resistance - mΩ 0 1 0.01 VGS = 10 V Pulsed 20 0 TA = –55°C 25°C 75°C 125°C 175°C 10 120 3 2 1 VDS = VGS ID = 250 μA 0 –100 –50 0 50 100 150 200 100 TA = –55°C 25°C 75°C 125°C 175°C 10 VDS = 5 V Pulsed 1 0.1 1 10 100 Tch - Channel Temperature - °C ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 12 10 8 6 4 2 0 VGS = 10 V Pulsed 1 10 100 ID - Drain Current - A R07DS1002EJ0200 Rev.2.00 May 24, 2018 1000 RDS(on) - Drain to Source On-State Resistance - mΩ ID - Drain Current - A 140 12 10 8 6 4 2 0 ID = 18 A Pulsed 0 5 10 15 20 VGS - Gate to Source Voltage - V Page 4 of 6 Preliminary DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 12 10 8 6 4 VGS = 10 V ID = 18 A Pulsed 2 0 –100 –50 0 50 100 150 1000 Coss 100 Crss VGS = 0 V f = 1 MHz 10 0.1 200 1 10 100 Tch - Channel Temperature - °C VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS 1000 50 VDD = 28 V VGS = 10 V RG = 0 Ω 100 td(off) td(on) 10 tr tf 1 0.1 1 10 10 45 9 VDD = 44 V 28 V 11 V 40 8 35 7 30 6 VGS 25 5 20 4 15 3 10 2 5 0 100 VDS 0 5 10 15 20 ID = 35 A 25 30 35 ID - Drain Current - A QG- Gate Charge - nC SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs. DRAIN CURRENT trr - Reverse Recovery Time - ns VGS = 10 V VGS = 0 V 100 10 1 Pulsed 0.1 1 0 40 100 1000 IF - Diode Forward Current - A Ciss VGS - Gate to Source Voltage - V Ciss, Coss, Crss - Capacitance -pF 10000 VDS - Drain to Source Voltage - V td(on), tr, td(off), tf - Switching Time - ns RDS(on) - Drain to Source On-State Resistance - mΩ NP35N055YUK 0 0.2 0.4 0.6 0.8 1.0 VF(S-D) - Source to Drain Voltage - V R07DS1002EJ0200 Rev.2.00 May 24, 2018 1.2 10 di/dt = 100 A/μs VGS = 0 V 1 0.1 1 10 100 IF - Drain Current - A Page 5 of 6 NP35N055YUK Preliminary Package Drawing (Unit: mm) 8-pin HSON (Mass: 0.128 g TYP.) 1, 2, 3 : Source 4 : Gate 5, 6, 7, 8 : Drain Equivalent Circuit Drain Body Diode Gate Source Remark: Strong electric field, when exposed to this device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. R07DS1002EJ0200 Rev.2.00 May 24, 2018 Page 6 of 6 Revision History Rev. 1.00 2.00 Date Feb 08, 2013 May 24 ,2018 NP35N055YUK Data Sheet Page — 1 2 Description Summary First Edition Issued Note 4 was added Note 2 was added All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information. 2. 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NP35N055YUK-E1-AY 价格&库存

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NP35N055YUK-E1-AY

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