PS2802-1-F3-A

DATA SHEET PHOTOCOUPLER PS2802-1,PS2802-4 HIGH ISOLATION VOLTAGE DARLINGTON TRANSISTOR TYPE SSOP PHOTOCOUPLER −NEPOC Series− DESCRIPTION The PS2802-1 and PS2802-4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington-connected photo transistor in a plastic SSOP for high density applications. This package has shield effect to cut off ambient light. FEATURES • High isolation voltage (BV = 2 500 Vr.m.s.) • Small and thin package (4,16-pin SSOP, Pin pitch 1.27 mm) • High current transfer ratio (CTR = 2 000% TYP. @ IF = 1 mA, VCE = 2 V) • Ordering number of tape product: PS2802-1-F3, F4, PS2802-4-F3, F4 • Safety standards: PS2802-1, -4 • UL approved: File No. E72422 • BSI approved: No. 8188, 8189 • CSA approved: File No. CA 101391 • DIN EN60747-5-2 (VDE0884 Part2) approved (Option) APPLICATIONS • Programmable logic controllers • Measuring instruments • Hybrid IC The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10252EJ02V0DS (2nd edition) Date Published March 2006 CP(K) Printed in Japan The mark  shows major revised points.  NEC Compound Semiconductor Devices, Ltd. 1995, 2006 PS2802-1,PS2802-4 PACKAGE DIMENSIONS (UNIT: mm) PS2802-1 PS2802-4 TOP VIEW 2.7±0.3 16 15 14 13 12 11 10 9 10.3±0.3 TOP VIEW 4 3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 3 4 5 6 7 8 1. 3. 5. 7. 2. 4. 6. 8. 9. 11. 13. 15. 10. 12. 14. 16. Anode Cathode Emitter Collector 7.0±0.3 4.4 4.4 0.15+0.10 –0.05 7.0±0.3 0.5±0.3 1.27 0.4±0.1 0.12 M 0.1±0.1 2.0+0.3 –0.2 2.0±0.1 0.1±0.1 0.15+0.10 –0.05 1 2 0.40+0.10 –0.05 0.12 M 0.5±0.3 1.27 MARKING EXAMPLE PS2802-4 PS2802-1 2 003 *1 PS2802-4 NL003 Assembly Lot Last number of type No. : 2 No. 1 pin Mark N L 0 03 0 03 Week Assembled Year Assembled (Last 1 Digit) *1 2 Country Assembled Type Number Assembly Lot Week Assembled Year Assembled (Last 1 Digit) In-house Code (L: Pb-Free) : Pb-Free Rank Code Data Sheet PN10252EJ02V0DS PS2802-1,PS2802-4 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Specification Pb-Free Safety Standard Approval PS2802-1 PS2802-1-A 50 pcs (Tape 50 pcs cut) Standard products PS2802-1-F3 PS2802-1-F3-A Embossed Tape 3 500 pcs/reel (UL, BSI, CSA PS2802-1-F4 PS2802-1-F4-A PS2802-1-V PS2802-1-V-A 50 pcs (Tape 50 pcs cut) DIN EN60747-5-2 PS2802-1-V-F3 PS2802-1-V-F3-A Embossed Tape 3 500 pcs/reel (VDE0884 Part2) PS2802-1-V-F4 PS2802-1-V-F4-A PS2802-4 PS2802-4-A Magazine Case 45 pcs Standard products PS2802-4-F3 PS2802-4-F3-A Embossed Tape 2 500 pcs/reel (UL, BSI, CSA PS2802-4-F4 PS2802-4-F4-A PS2802-4-V PS2802-4-V-A Magazine Case 45 pcs DIN EN60747-5-2 PS2802-4-V-F3 PS2802-4-V-F3-A Embossed Tape 2 500 pcs/reel (VDE0884 Part2) PS2802-4-V-F4 PS2802-4-V-F4-A Application *1 Part Number PS2802-1 approved) Approved (Option) PS2802-4 approved) Approved (Option) *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings PS2802-1 Diode PS2802-4 Forward Current (DC) IF 50 mA/ch Reverse Voltage VR 6 V Power Dissipation Derating Power Dissipation Peak Forward Current Transistor Unit *1 ∆PD/°C 0.6 0.8 mW/°C PD 60 80 mW/ch IFP 1 A/ch Collector to Emitter Voltage VCEO 40 V Emitter to Collector Voltage VECO 6 V Collector Current IC 90 100 mA/ch ∆PC/°C 1.2 mW/°C PC 120 mW/ch BV 2 500 Vr.m.s. Operating Ambient Temperature TA −55 to +100 °C Storage Temperature Tstg −55 to +150 °C Power Dissipation Derating Power Dissipation Isolation Voltage *2 *1 PW = 100 µs, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together (PS2802-1). Pins 1-8 shorted together, 9-16 shorted together (PS2802-4). Data Sheet PN10252EJ02V0DS 3 PS2802-1,PS2802-4 ELECTRICAL CHARACTERISTICS (TA = 25 °C) Parameter Diode Symbol Conditions Forward Voltage VF IF = 5 mA Reverse Current IR VR = 5 V Terminal Capacitance Ct V = 0 V, f = 1.0 MHz MIN. TYP. MAX. Unit 1.1 1.4 V 5 µA 15 pF Transistor Collector to Emitter Dark Current ICEO VCE = 40 V, IF = 0 mA Coupled Current Transfer Ratio *1 (IC/IF) CTR IF = 1 mA, VCE = 2 V Collector Saturation Voltage VCE(sat) IF = 1 mA, IC = 2 mA Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.4 pF *2 tr VCC = 5 V, IC = 2 mA, RL = 100 Ω 200 µs Rise Time Fall Time *2 tf K : 2 000 to (%) L : 700 to 3 400 (%) M : 200 to 1 000 (%) N : 200 to (%) *2 Test circuit for switching time VCC Pulse Input PW = 1 ms Duty Cycle = 1/10 4 Vout 50 Ω 200 2 000 10 RL = 100 Ω Data Sheet PN10252EJ02V0DS nA % 1.0 V Ω 11 200 *1 CTR rank (PS2802-1 only) IF 400 PS2802-1,PS2802-4 TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE PS2802-4 0.8 mW/˚C 60 PS2802-1 40 0.6 mW/˚C 20 0 100 50 Forward Current IF (mA) Transistor Power Dissipation PC (mW) 80 25 75 50 80 PS2802-1 PS2802-4 60 1.2 mW/˚C 40 20 25 75 50 100 Ambient Temperature TA (˚C) FORWARD CURRENT vs. FORWARD VOLTAGE COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE 160 TA = +100 ˚C +60 ˚C +25 ˚C 140 5 0 ˚C –25 ˚C –50 ˚C 1 0.5 120 5 mA 100 80 2 mA 60 40 1 mA 20 0.1 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 IF = 0.5 mA 2 4 6 10 8 Forward Voltage VF (V) Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 200 10 000 VCE = 2 V 5V 10 V 24 V 40 V 1 000 100 10 1 –50 IF = 10 mA 100 Collector Current IC (mA) Collector to Emitter Dark Current ICEO (nA) 100 Ambient Temperature TA (˚C) 10 0.7 120 0 100 Collector Current IC (mA) Diode Power Dissipation PD (mW) 100 5 mA 1 mA 50 0.5 mA 10 5 0.2 mA 1 0.1 mA 0.5 0.2 –25 0 25 50 75 100 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Collector Saturation Voltage VCE(sat) (V) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet PN10252EJ02V0DS 5 ; ;;; PS2802-1,PS2802-4 CURRENT TRANSFER RATIO vs. FORWARD CURRENT 1.4 8 000 Current Transfer Ratio CTR (%) Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 1.2 1.0 0.8 0.6 0.4 Normalized to 1.0 at TA = 25 ˚C, IF = 1 mA, VCE = 2 V 0.2 –50 –25 25 0 50 75 Sample A B C D 5 000 4 000 3 000 2 000 1 000 0.5 0 0.1 1 5 Forward Current IF (mA) SWITCHING TIME vs. LOAD RESISTANCE CURRENT TRANSFER RATIO vs. FORWARD CURRENT Current Transfer Ratio CTR (%) 1 000 tf tr 100 ts td 10 0.5 0.1 VCE = 2 V 2 500 2 000 1 000 500 0 5.0 1.0 Sample A B C D 1 500 10 50 Forward Current IF (µA) SWITCHING TIME vs. LOAD RESISTANCE FREQUENCY RESPONSE tf 0 Normalized Gain Gv 1 000 ts 100 tr 10 td 1 0.1 500 100 Load Resistance RL (kΩ) VCC = 5 V, IF = 1 mA, CTR = 1 910 % Switching Time t (µs) 30 3 000 10 000 1.0 10 IF = 1 mA, VCE = 2 V –5 –10 –15 RL = 100 Ω –20 100 0.2 0.5 1 2 5 10 20 Frequency f (kHz) Load Resistance RL (kΩ) Remark The graphs indicate nominal characteristics. 6 10 Ambient Temperature TA (˚C) VCC = 5 V, IC = 2 mA, CTR = 1 910 % Switching Time t (µ s) 6 000 100 10 000 1 VCE = 2 V 7 000 Data Sheet PN10252EJ02V0DS 50 100 200 PS2802-1,PS2802-4 LONG TERM CTR DEGRADATION 1.2 IF = 1 mA TA = 25 ˚C CTR (Relative Value) 1.0 0.8 60 ˚C 0.6 0.4 0.2 0.0 10 102 103 104 105 106 Time (Hr) Remark The graph indicates nominal characteristics. Data Sheet PN10252EJ02V0DS 7 PS2802-1,PS2802-4 TAPING SPECIFICATIONS (UNIT: mm) φ 1.5+0.1 –0 7.5±0.1 4.0±0.1 16.0±0.3 2.0±0.1 7.55±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.8 MAX. 0.3 1.55±0.1 2.3±0.1 2.85±0.1 4.0±0.1 Tape Direction 2003 2003 2003 2003 2003 2003 2003 2003 2003 PS2802-1-F4 2003 PS2802-1-F3 Outline and Dimensions (Reel) R 1.0 φ 21.0±0.8 φ 100±1.0 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 17.5±1.0 21.5±1.0 Packing: 3 500 pcs/reel 8 Data Sheet PN10252EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2802-1,PS2802-4 2.8 MAX. 10.7±0.1 7.5±0.1 φ 1.5+0.1 –0 16.0±0.3 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 0.3 2.3±0.1 8.3±0.1 1.55±0.1 12.0±0.1 Tape Direction PS2802-4-F3 PS2802-4-F4 Outline and Dimensions (Reel) R 1.0 φ 21.0±0.8 φ 100±1.0 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 17.5±1.0 21.5±1.0 Packing: 2 500 pcs/reel Data Sheet PN10252EJ02V0DS 15.9 to 19.4 Outer edge of flange 9 PS2802-1,PS2802-4 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. 10 Data Sheet PN10252EJ02V0DS PS2802-1,PS2802-4 (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10252EJ02V0DS 11 PS2802-1,PS2802-4 PROGRAMMABLE LOGIC CONTROLLERS EXAMPLE Purpose: In-out interface Ya Xaxis xis Servo Motor Servo Motor Sensor Controller Amplifier Motor Controller Heater Controller Pulse Generator COM PS2802–1 PS2802–4 PD4050 AC.DC Servo Motor Driver Unit M TG PG Pulse Motor Driver Unit CRT Computer Terminal Terminal Printer Printer Power Supply PC FDD Controller Memory Cassette 12 M Data Sheet PN10252EJ02V0DS Programmable Logic Controller PS2802-1,PS2802-4 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PN10252EJ02V0DS 13 PS2802-1,PS2802-4 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504 To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.