Data Sheet
PS8302L, PS8302L2
R08DS0253EJ0100
Rev.1.00
Nov 4, 2021
1 Mbps, HIGH CMR, ANALOG OUTPUT TYPE
8 mm CREEPAGE 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS8302L and PS8302L2 are optical coupled isolators containing an AlGaAs LED on the input side and a
PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
The PS8302L and PS8302L2 are designed specifically for high supply voltage and high common mode
transient immunity (CMR).
The PS8302L and PS8302L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS8302L2 has
8 mm creepage distance and is half size of 8-pin DIP.
The PS8302L is lead bending type (Gull-wing) for surface mounting.
The PS8302L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
High common mode transient immunity (CMH, CML = ±15 kV/μs MIN.)
Half size of 8-pin DIP
Long creepage distance (8 mm MIN. : PS8302L2)
High supply voltage (VCC = 35 V)
High isolation voltage (BV = 5 000 Vr.m.s.)
High-speed response (tPHL = 0.8 μs MAX., tPLH = 0.8 μs MAX.)
Pb-Free product
Safety standards
- UL approved: UL1577, Double protection
- CSA approved: CAN/CSA-C22.2 No.62368-1, Reinforced insulation
- VDE approved: DIN EN 60747-5-5 (Option)
PIN CONNECTION
(Top View)
6
5
4
SHIELD
•
•
•
•
•
•
•
•
•
•
•
1
2
1. Anode
2. NC
3. Cathode
4. GND
5. VO
6. VCC
3
APPLICATIONS
•
•
•
•
Computer and peripheral manufactures
General purpose inverter
Substitutions for relays and pulse transformers
Power supply
Start of mass production
Mar.2008
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 1 of 15
PS8302L,PS8302L2 Data Sheet
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PSx3xxL
4.58±0.3
6.8±0.25
(0.82)
9.7±0.3
0.25±0.15
3.5±0.2
3.7±0.25
7.62
1.27
0.4±0.1
0.8±0.25
0.25 M
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PSx3xxL2
4.58±0.3
6.8±0.25
(0.82)
11.5±0.3
0.25±0.15
3.5±0.2
3.7±0.25
7.62
1.27
0.4±0.1
0.75±0.25
0.25 M
Weight: 0.27g (typ.)
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 2 of 15
PS8302L,PS8302L2 Data Sheet
MARKING EXAMPLE
R
8302
N131
No. 1 pin Mark
N
Company Initial
Type Number
Assembly Lot
1 31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
Creepage Distance (MIN.)
Isolation Distance (MIN.)
PS8302L
PS8302L2
7 mm
7 mm
8 mm
8 mm
0.4 mm
0.4 mm
ORDERING INFORMATION
Part Number
PS8302L
Order Number
PS8302L-AX
Solder Plating
Specification
Pb-Free
(Ni/Pd/Au)
Packing Style
20 pcs (Tape 20 pcs cut)
PS8302L-E3
PS8302L-E3-AX
Embossed Tape 2 000 pcs/reel
PS8302L2
PS8302L2-AX
20 pcs (Tape 20 pcs cut)
PS8302L2-E3
PS8302L2-E3-AX
Embossed Tape 2 000 pcs/reel
PS8302L-V
PS8302L-V-AX
20 pcs (Tape 20 pcs cut)
PS8302L-V-E3
PS8302L-V-E3-AX
Embossed Tape 2 000 pcs/reel
PS8302L2-V
PS8302L2-V-AX
20 pcs (Tape 20 pcs cut)
PS8302L2-V-E3
PS8302L2-V-E3-AX
Embossed Tape 2 000 pcs/reel
Safety Standard
Approval
Standard products
Application Part
Number*1
PS8302L
(UL, CSA approved)
PS8302L2
UL, CSA,
DIN EN60747-5-5
approved
PS8302L
PS8302L2
Notes*: 1. For the application of the Safety Standard, following part number should be used.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 3 of 15
PS8302L,PS8302L2 Data Sheet
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Diode
Detector
Parameter
Forward Current *1
Symbol
IF
Ratings
25
Unit
mA
Reverse Voltage
VR
5
V
Supply Voltage
VCC
35
V
Output Voltage
VO
35
V
Output Current
IO
8
mA
Power Dissipation *2
PC
100
mW
Isolation Voltage *3
Operating Ambient Temperature
BV
TA
5 000
− 55 to +110
Vr.m.s.
°C
Storage Temperature
Tstg
− 55 to +125
°C
Notes*: 1. Reduced to 0.3 mA/°C at TA = 70 °C or more.
2. Reduced to 2.0 mW/°C at TA = 75 °C or more
3. AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 4 of 15
PS8302L,PS8302L2 Data Sheet
ELECTRICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
Parameter
Diode
VF
IF = 16 mA
Reverse Current
IR
VR = 3 V
Terminal Capacitance
Coupled
Conditions
Forward Voltage
Forward Voltage
Temperature Coefficient
Detector
Symbol
∆VF/∆TA
Ct
MIN.
TYP.*1
MAX.
Unit
1.6
2.0
V
10
μA
− 2.1
mV/°C
V = 0 V, f = 1 MHz
30
pF
3
IF = 16 mA
High Level Output Current
IOH (1)
IF = 0 mA, VCC = VO = 5.5 V
500
nA
High Level Output Current
IOH (2)
IF = 0 mA, VCC = VO = 35 V
100
μA
Low Level Output Voltage
VOL
IF = 16 mA, VCC = 4.5 V, IO = 2.4 mA
0.15
0.4
V
High Level Supply Current
ICCH
IF = 0 mA, VO = open, VCC = 35 V
0.01
1
μA
Low Level Supply Current
ICCL
IF = 16 mA, VO = open, VCC = 35 V
150
Current Transfer Ratio
CTR
IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
15
%
Input-Output
Isolation Resistance
RI-O
VI-O = 1 kVDC
Input-Output
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.7
Propagation Delay Time
(H → L)*2
tPHL
IF = 16 mA, VCC = 5 V, RL = 1.9 kΩ
0.3
0.8
Propagation Delay Time
(L → H) *2
tPLH
0.33
0.8
Common Mode
Transient Immunity at
High Level Output*3
CMH
IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
15
Common Mode
Transient Immunity at
Low Level Output*3
CML
IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
− 15
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Ω
11
10
pF
μs
kV/µs
Page 5 of 15
PS8302L,PS8302L2 Data Sheet
Notes*: 1. Typical values at TA = 25 °C.
2. Test circuit for propagation delay time
VCC = 5 V
IF
Pulse Input
PW = 100 μs
( Duty Cycle = 1/10 )
IF Monitor
1
6
2
5
3
4
SHIELD
IF
50%
RL = 1.9 kΩ
0.1 μF
VO
5V
VO
1.5 V
VOL
51 Ω
tPHL
tPLH
3. Test circuit for common mode transient immunity
VCM = 1.5 kV
VCC = 5 V
IF
SW
A
B
1
6
RL = 4.1 kΩ
2
5
VO
3
SHIELD
+
4
0.1 μF
90%
VCM
10%
tr
VOH
SW: B (IF = 0 mA)
VCM
−
VOL
SW: A (IF = 16 mA)
90%
10%
0V
tf
CM H
2V
0.8 V
CM L
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against
static electricity when handling.
2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because
this may degrade the internal noise environment of the device.
*1 NC: Not connected (No connection)
4. Avoid storage at a high temperature and high humidity.
5. Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
6. Do not use fixing agents or coatings containing halogen-based substances.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 6 of 15
PS8302L,PS8302L2 Data Sheet
TYPICAL CHARACTERISTICS (TA = 25 °C unless otherwise specified)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
120
Detector Power Dissipation PC (mW)
Maximum Forward Current IF (mA)
30
25
20
15
10
5
0
25
50
100 110
75
100
80
60
40
20
0
125
25
50
100 110 125
75
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
12
100
IF = 25 mA
Output Current IO (mA)
Forward Current IF (mA)
10
10
TA = +110°C
+100°C
+85°C
+50°C
+25°C
0°C
−40°C
1.0
0.1
0.01
1.0
1.2
1.4
1.6
1.8
2.0
20 mA
8
15 mA
6
10 mA
4
5 mA
2
2.2
2.4
0
2
Forward Voltage VF (V)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
VCC = 4.5 V,
VO = 0.4 V
40
30
20
10
10
8
10 12
14 16
18 20
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
50
1
6
Output Voltage VO (V)
CURRENT TRANSFER RATIO
vs. FORWARD CURRENT
0
0.1
4
100
Forward Current IF (mA)
2
Normalized to 1.0
at TA = 25°C,
IF = 16 mA, VCC= 4.5 V,
VO = 0.4 V
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
−75 −50
−25
0
25
50
75
100 125
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 7 of 15
PS8302L,PS8302L2 Data Sheet
OUTPUT VOLTAGE vs.
FORWARD CURRENT
6
Output Voltage VO (V)
1 000
VCC = 5 V
IF
VCC
RL
5
4
3
RL = 1.9 kΩ
2
5.5 kΩ
1
12 kΩ
0
2
4
6
8
10
12
14
16
18
High Level Output Current IOH (nA)
7
HIGH LEVEL OUTPUT CURRENT
vs. AMBIENT TEMPERATURE
IF = 0 mA
100
VCC = VO = 35 V
VCC = VO = 5.5 V
10
1
0.1
−25
20
0
Forward Current IF (mA)
100
3
VCC = 5 V,
IF = 16 mA
Propagation Delay Time tPHL, tPLH (μs)
Propagation Delay Time tPHL, tPLH (μs)
75
PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
tPLH
1
tPHL
0.1
1
50
Ambient Temperature TA (°C)
PROPAGATION DELAY TIME
vs. LORD RESISTANCE
10
25
10
100
Load Resistance RL (kΩ)
VCC = 5 V,
2.5 IF = 16 mA,
RL = 1.9 kΩ
2
1.5
1
tPLH
0.5
tPHL
0
−50
−25
0
25
50
75
100
125
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 8 of 15
PS8302L,PS8302L2 Data Sheet
TAPING SPECIFICATIONS (UNIT: mm)
Tape Direction
PSx3xxL-E3
7.5±0.1
8.0±0.1
4.5 MAX.
10.2±0.1
⌀1.5+− 00. 1
4.0±0.1
16.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
⌀1.5+− 00. 1
0.35
4.05±0.1
5.08±0.1
Outline and Dimensions (Reel)
R1.0
⌀21.0±0.8
⌀100±1.0
2.0±0.5
⌀13.0±0.2
⌀330±2.0
2.0±0.5
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 9 of 15
PS8302L,PS8302L2 Data Sheet
Tape Direction
PSx3xxL2-E3
11.5±0.1
8.0±0.1
4.5 MAX.
12.0±0.1
⌀1.5+− 00. 1
4.0±0.1
24.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
⌀2.0+− 00. 1
0.35
4.05±0.1
5.08±0.1
Outline and Dimensions (Reel)
R1.0
⌀21.0±0.8
⌀100±1.0
2.0±0.5
⌀13.0±0.2
⌀330±2.0
2.0±0.5
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 10 of 15
PS8302L,PS8302L2 Data Sheet
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Lead Bending
A
B
C
D
PSx3xxL
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
PSx3xxL2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
1.27
0.8
2.2
Part Number
Remark
All dimensions in this figure must be evaluated before use.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 11 of 15
PS8302L,PS8302L2 Data Sheet
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220 °C
• Time to preheat temperature from 120 to 180 °C
• Number of reflows
• Flux
260 °C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of
0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260 °C or below (molten solder temperature)
10 seconds or less
120 °C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum
chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350 °C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100 °C
(4) Cautions
• Flux Cleaning
Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
• Do not use fixing agents or coatings containing halogen-based substances.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the
absolute maximum ratings.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 12 of 15
PS8302L,PS8302L2 Data Sheet
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Rating
Unit
55/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM., Pd < 5 pC
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Upr
2 119
Vpeak
UIOTM
8 000
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM., Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1))
2
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303-11))
CTI
Material group (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1))
175
III a
Storage temperature range
Tstg
− 55 to +125
°C
Operating temperature range
TA
− 55 to +110
°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Tsi
Isi
Psi
175
400
700
°C
mA
mW
Ris MIN.
109
Ω
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 °C
VIO = 500 V dc at TA MAX. at least 100 °C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Total Power Dissipation Psi (mW)
Input Current Isi (mA)
Dependence of maximum safety ratings with package temperature
1000
900
800
700
600
Psi: Total Power Dissipation
500
400
300
Isi: Input Current
200
100
0
0
25
50
75
100
125
150
175
200
Package temp Tsi (°C)
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 13 of 15
PS8302L,PS8302L2 Data Sheet
Method a) Destructive Test, Type and Sample Test
UIOTM = 8000 V
V
Upr = 1808 V
UIORM = 1130 V
t3
t1
tini
t2
tm
t4
t
ttest
t1, t2 = 1 to 10 sec
t3, t4 = 1 sec
tm ( PARTIAL DISCHARGE) = 10 sec
ttest = 12 sec
tini = 60 sec
Method b) Non-destructive Test, 100% Production Test
Upr = 2119 V
V
UIORM = 1130 V
ttest
t3
tm
t
t4
t3, t4 = 0.1 sec
tm ( PARTIAL DISCHARGE) = 1.0 sec
ttest = 1.2 sec
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 14 of 15
PS8302L,PS8302L2 Data Sheet
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or i any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
R08DS0253EJ0100 Rev.1.00
Nov 4, 2021
Page 15 of 15
Notice
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
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Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics
products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily
injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as
safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for
aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these
applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance
with applicable laws and regulations.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or
transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)
(Note2)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled
subsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)
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