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PS8802-1-F3-AX

PS8802-1-F3-AX

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    PS8802-1-F3-AX

  • 数据手册
  • 价格&库存
PS8802-1-F3-AX 数据手册
Data Sheet PS8802-1,-2 R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 1 Mbps HIGH CMR ANALOG OUTPUT TYPE 8-PIN SSOP (SO-8) HIGH-SPEED PHOTOCOUPLER DESCRIPTION The PS8802-1, -2 are optically coupled isolators containing an AlGaAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. The PS8802-1, -2 are designed specifically for high common mode transient immunity (CMR), the PS8802-2 is suitable for high density applications. . FEATURES • • • • • • 40% reduction of mounting area (5-pin SOP × 2) High common mode transient immunity (CMH, CML = ±15 kV/µs MIN.) High supply voltage (VCC = 35 V) High isolation voltage (BV = 2 500 Vr.m.s.) High-speed response (tPHL = 0.8 µs MAX., tPLH = 1.2 µs MAX.) Ordering number of tape product: PS8802-1-F3 : 1 500 pcs/reel : PS8802-2-F3 : 1 500 pcs/reel • Pb-Free product • Safety standards • UL :UL1577, Single protection • CSA :CAN/CSA-C22.2 No.62368-1, Basic insulation • VDE :DIN EN 60747-5-5 (Option) PIN CONNECTION (Top View) 8 7 1 2 PS8802−1 5 1. NC 2. Anode 3. Cathode 4. NC 5. GND 6. VO 7. NC 8. VCC 3 4 8 7 6 1 2 APPLICATIONS • • • • Computer and peripheral manufactures General purpose inverter Substitutions for relays and pulse transformers Power supply 6 PS8802−2 5 1. Anode1 2. Cathode1 3. Cathode2 4. Anode2 5. GND 6. VO2 7. VO1 8. VCC 3 4 Start of mass production Nov.2003 R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 1 of 13 PS8802-1,-2 Data Sheet PACKAGE DIMENSIONS (UNIT: mm) 5.21±0.25 6.0±0.2 +0.10 0.1±0.1 0.15−0.05 3.27±0.2 3.95±0.1 0.5±0.3 1.27 0.4+0.10 −0.05 0.10 S 0.25 M Weight: 0.14g (typ.) PHOTOCOUPLER CONSTRUCTION Parameter Air Distance Outer Creepage Distance Unit (MIN.) 4 mm 4 mm 0.2 mm Isolation Distance MARKING EXAMPLE Ni/Pd/Au PLATING PS8802−1 8802−1 NT831 PS8802−2 8802−2 NT831 Type Number Assembly Lot Type Number Assembly Lot R R N T 8 31 Week Assembled Year Assembled (Last 1 Digit) No. 1 pin Mark Initial of Renesas (Engraved mark) In-house Code Rank Code R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 N T 8 31 No. 1 pin Mark Initial of Renesas (Engraved mark) Week Assembled Year Assembled (Last 1 Digit) In-house Code Rank Code Page 2 of 13 PS8802-1,-2 Data Sheet ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Approval Part Number*1 Specification PS8802-1 PS8802-1-AX Pb-Free (Ni/Pd/Au) Standard products 20 pcs (Tape 20 pcs cut) PS8802-1-F3 PS8802-1-F3-AX Embossed Tape 1 500 pcs/reel PS8802-2 PS8802-2-AX 20 pcs (Tape 20 pcs cut) PS8802-2-F3 PS8802-2-F3-AX Embossed Tape 1 500 pcs/reel PS8802-1-V PS8802-1-V-AX 20 pcs (Tape 20 pcs cut) PS8802-1 (UL, CSA approved) PS8802-2 UL, CSA, PS8802-1-V-F3 PS8802-1-V-F3-AX Embossed Tape 1 500 pcs/reel PS8802-2-V PS8802-2-V-AX 20 pcs (Tape 20 pcs cut) PS8802-2-V-F3 PS8802-2-V-F3-AX Embossed Tape 1 500 pcs/reel PS8802-1 DIN EN 60747-5-5 approved PS8802-2 Notes*: 1. For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified) Diode Detector Parameter Forward Current Symbol IF Ratings 25 Reverse Voltage VR 5.0 V/ch Power Dissipation*1 Supply Voltage PD VCC 45 35 mW/ch V Output Voltage VO 35 V/ch Output Current Unit mA/ch IO 8.0 mA/ch Power Dissipation *2 Isolation Voltage *3 PC BV 100 2 500 mW/ch Vr.m.s. Operating Ambient Temperature Storage Temperature TA Tstg − 55 to + 100 − 55 to + 125 °C °C Notes*: 1. Reduced to 0.45 mW/°C at TA = 25 °C or more. 2. Reduced to 1.00 mW/°C at TA = 25 °C or more. 3. AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output. Pins 1-4 shorted together, 5-8 shorted together. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 3 of 13 PS8802-1,-2 Data Sheet ELECTRICAL CHARACTERISTICS (TA = 25 °C) Parameter Diode Conditions Forward Voltage VF IF = 16 mA Reverse Current IR VR = 3 V Forward Voltage Temperature Coefficient Terminal Capacitance Detector Symbol ∆VF/∆TA Ct MIN. TYP. MAX. Unit 1.7 2.2 V 10 µA −2.1 mV/°C V = 0 V, f = 1 MHz 30 pF 10 IF = 16 mA High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IOL = 1.2 mA High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 500 nA 100 µA 0.1 0.4 V 0.1 2 µA 0.2 4 (PS8802-1) High Level Supply Current (PS8802-2) Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 100 (PS8802-1) Low Level Supply Current (PS8802-2) Coupled Current Transfer Ratio 200 CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 15 25 45 Input-Output Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60 % 10 Insulation Resistance (Input-Input), (PS8802-2) RI-I VI-I = 1 kVDC, RH = 40 to 60 % 1010 Input-Output CI-O V = 0 V, f = 1 MHz % Ω 11 0.6 pF Isolation Capacitance Insulation Capacitance (Input-Input), (PS8802-2) CI-I Propagation Delay Time (H → L)*1 tPHL Propagation Delay Time (L → H)*1 tPLH Common Mode Transient Immunity at High Level Output*2 CMH IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,, VCM = 1.5 kV 15 Common Mode Transient Immunity at Low Level Output*2 CML IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,, VCM = 1.5 kV −15 R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 0.3 IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ, CL = 15 pF 0.3 0.8 0.6 1.2 µs kV/µs Page 4 of 13 PS8802-1,-2 Data Sheet Notes*: 1. Test circuit for propagation delay time VCC = 5 V PS8802−1 Pulse Input (IF) (PW = 1 μs, Duty cycle = 1/10) 0.1 μF VO CL = 15 pF IF Monitor 47 Ω VCC = 5 V PS8802−2 Pulse Input (IF) (PW = 1 μs, Duty cycle = 1/10) RL = 2.2 kΩ (IF = 16 mA) 50% IF VO tPHL 1.5 V VOL tPLH RL = 2.2 kΩ VO IF Monitor 0.1 μF CL = 15 pF 47 Ω Remark: CL includes probe and stray wiring capacitance. 2. Test circuit for common mode transient immunity PS8802−1 VCC = 5 V RL = 4.1 kΩ 0.1 μF VO CL = 15 pF 1.5 kV VCM 90% IF 10% VCM 0V tr PS8802−2 SW IF VCC = 5 V RL = 4.1 kΩ 0.1 μF VO CL = 15 pF VO (IF = 0 mA) VO (IF = 16 mA) tf VOH 2V 0.8 V VOL VCM Remark: CL includes probe and stray wiring capacitance. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 µF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity. 4. Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents. 5. Do not use fixing agents or coatings containing halogen-based substances. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 5 of 13 PS8802-1,-2 Data Sheet TYPICAL CHARACTERISTICS (TA = 25 °C unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) 40 30 20 10 25 0 50 75 20 10 000 High Level Output Current IOH (nA) Forward Current IF (mA) 40 25 50 75 100 HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE TA = +100°C +50°C +25°C 0°C −25°C 1.2 1.4 1.6 1.8 2.0 2.2 IF = 0 mA 1 000 100 10 1 0.1 −25 2.4 VCC = VO = 30 V VCC = VO = 5.5 V 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (°C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 80 Current Transfer Ratio CTR (%) 60 FORWARD CURRENT vs. FORWARD VOLTAGE 0.1 VCC = 4.5 V, VO = 0.4 V 70 60 50 40 30 20 10 0 0.5 80 Ambient Temperature TA (°C) 1 0.01 1.0 100 Ambient Temperature TA (°C) 100 10 120 0 100 1 5 10 50 Forward Current IF (mA) Normalized Current Transfer Raio CTR Diode Power Dissipation PD (mW) 50 1.6 Normalized to 1.0 at TA = 25°C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 −50 −25 0 25 50 75 100 Ambient Temperature TA (°C) Remark The graphs indicate nominal characteristics. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 6 of 13 PS8802-1,-2 Data Sheet OUTPUT VOLTAGE vs. FORWARD CURRENT OUTPUT CURRENT vs. OUTPUT VOLTAGE 10 6 25 mA 5 Output Voltage VO (V) Output Current IO (mA) 20 mA 8 15 mA 6 10 mA 4 IF = 5 mA 2 4 RL = 2.2 kΩ 3 2 1 5.6 kΩ 2 4 6 8 10 12 14 16 6 8 10 12 14 16 18 20 PROPAGATION DELAY TIME vs. FORWARD CURRENT PROPAGATION DELAY TIME vs. LOAD RESISTANCE VCC = 5 V, RL = 2.2 kΩ, CTR : 25% tPHL tPLH 5 10 15 20 25 Forward Current IF (mA) Normalized Propagation Delay Time tPHL, tPLH 4 Forward Current IF (mA) 2.0 0 2 Output Voltage VO (V) 3.0 1.0 0 18 20 Propagation Delay Time tPHL, tPLH (μs) Propagation Delay Time tPHL, tPLH (μs) 0 10 VCC = 5 V, IF = 16 mA, CTR : 25% tPLH 1 tPHL 0.1 1k 10 k 100 k Load Resistance RL (Ω) NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 Normalized to 1.0 at TA = 25°C, IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ 4 3 2 tPLH tPHL 1 0 −50 −25 0 25 50 75 100 Ambient Temperature TA (°C) Remark The graphs indicate nominal characteristics. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 7 of 13 PS8802-1,-2 Data Sheet TAPING SPECIFICATIONS (UNIT: mm) Taping Direction 8-pin SOP (F3) ⌀1.7±0.1 5.56±0.1 5.5±0.1 ⌀1.5+0.1 −0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.05 MAX. 3.6±0.1 6.4±0.1 0.3±0.05 8.0±0.1 Outline and Dimensions (Reel) 2.0±0.5 ⌀21.0±0.8 ⌀100±1.0 R1.0 ⌀330±2.0 2.0±0.5 ⌀13.0±0.2 13.5±1.0 17.5±1.0 Packing: 1 500 pcs/reel R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 8 of 13 PS8802-1,-2 Data Sheet RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 1.27 0.8 1.45 5.25 Remark All dimensions in this figure must be evaluated before use. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 9 of 13 PS8802-1,-2 Data Sheet NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220 °C • Time to preheat temperature from 120 to 180 °C • Number of reflows • Flux 260 °C or below (package surface temperature) 10 seconds or less 60 seconds or less 120 ± 30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (°C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260°C MAX. 220°C to 60 s 180°C 120°C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature • Time • Preheating conditions • Number of times • Flux 260 °C or below (molten solder temperature) 10 seconds or less 120 °C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron • Peak Temperature (lead part temperature) 350 °C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100 °C (4) Cautions • Flux Cleaning Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents. • Do not use fixing agents or coatings containing halogen-based substances. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 10 of 13 PS8802-1,-2 Data Sheet SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Climatic test class (IEC 60068-1/DIN EN 60068-1) Rating Unit 55/100/21 Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 × UIORM., Pd < 5 pC UIORM Upr 566 905 Vpeak Vpeak Upr 1 061 Vpeak UIOTM 4 000 Vpeak Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 × UIORM., Pd < 5 pC Highest permissible overvoltage Degree of pollution (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1)) 2 Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303-11)) CTI Material group (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1)) 175 III a Storage temperature range Tstg − 55 to +125 °C Operating temperature range TA − 55 to +100 °C Ris MIN. Ris MIN. 1012 1011 Ω Ω Tsi Isi Psi 150 150 600 °C mA mW Ris MIN. 109 Ω Isolation resistance, minimum value VIO = 500 V dc at TA = 25 °C VIO = 500 V dc at TA MAX. at least 100 °C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi Dependence of maximum safety ratings with package temperature Total Power Dissipation Psi (mW) Input Current Isi (mA) 1000 900 800 700 600 Psi: Total Power Dissipation 500 400 300 200 100 Isi: Input Current 0 0 25 50 75 100 125 150 175 200 Package temp Tsi (°C) R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 11 of 13 PS8802-1,-2 Data Sheet Method a) Destructive Test, Type and Sample Test UIOTM = 4000 V V Upr = 905 V UIORM = 566 V t3 t1 tini t2 tm t4 t ttest t1, t2 = 1 to 10 sec t3, t4 = 1 sec tm(PARTIAL DISCHARGE) = 10 sec ttest = 12 sec tini = 60 sec Method b) Non-destructive Test, 100% Production Test Upr = 1061 V V UIORM = 566 V ttest t3 tm t t4 t3, t4 = 0.1 sec tm(PARTIAL DISCHARGE) = 1.0 sec ttest = 1.2 sec R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 12 of 13 PS8802-1,-2 Data Sheet Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or i any way allow it to enter the mouth. All trademarks and registered trademarks are the property of their respective owners. R08DS0258EJ0100 Rev.1.00 Dec 9, 2021 Page 13 of 13 Notice 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, or information. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples. 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