0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
R1LV0108ESA-5SR#B0

R1LV0108ESA-5SR#B0

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    TFSOP-32

  • 描述:

    IC SRAM 1MBIT PARALLEL 32STSOP

  • 数据手册
  • 价格&库存
R1LV0108ESA-5SR#B0 数据手册
R1LV0108E Series 1Mb Advanced LPSRAM (128k word x 8bit) R10DS0152EJ0100 Rev.1.00 2013.6.21 Description The R1LV0108E Series is a family of low voltage 1-Mbit static RAMs organized as 131,072-word by 8-bit, fabricated by Renesas’s high-performance 0.15um CMOS and TFT technologies. The R1LV0108E Series has realized higher density, higher performance and low power consumption. The R1LV0108E Series is suitable for memory applications where a simple interfacing, battery operating and battery backup are the important design objectives. It has been packaged in 32-pin SOP,32-pin TSOP and 32-pin sTSOP. Features         Single 2.7~3.6V power supply Small stand-by current: 0.6µA (3.0V, typical) No clocks, No refresh All inputs and outputs are TTL compatible. Easy memory expansion by CS1# and CS2 Common Data I/O Three-state outputs: OR-tie Capability OE# prevents data contention on the I/O bus R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 1 of 12 R1LV0108E Series Ordering Information Orderable Part Name R1LV0108ESN-5SR#B* R1LV0108ESN-5SI#B* R1LV0108ESN-7SR#B* R1LV0108ESN-7SI#B* R1LV0108ESN-5SR#S* R1LV0108ESN-5SI#S* R1LV0108ESN-7SR#S* R1LV0108ESN-7SI#S* R1LV0108ESA-5SR#B* R1LV0108ESA-5SI#B* R1LV0108ESA-7SR#B* R1LV0108ESA-7SI#B* R1LV0108ESA-5SR#S* R1LV0108ESA-5SI#S* R1LV0108ESA-7SR#S* R1LV0108ESA-7SI#S* R1LV0108ESF-5SR#B* R1LV0108ESF-5SI#B* R1LV0108ESF-7SR#B* R1LV0108ESF-7SI#B* R1LV0108ESF-5SR#S* R1LV0108ESF-5SI#S* R1LV0108ESF-7SR#S* R1LV0108ESF-7SI#S* Access time 55 ns 70 ns 55 ns 70 ns 55 ns 70 ns 55 ns 70 ns 55 ns 70 ns 55 ns 70 ns R10DS0152EJ0100 Rev.1.00 2013.6.21 Temperature Range Package Shipping Container Quantity Tube Max. 25pcs/Tube Max. 225pcs/Inner Bag Max. 900pcs/Inner Box Embossed tape 1000pcs/Reel Tray Max. 234pcs/Tray Max. 1872pcs/Inner Box Embossed tape 1000pcs/Reel Tray Max. 156pcs/Tray Max. 1248pcs/Inner Box Embossed tape 1000pcs/Reel 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 525-mil 32-pin plastic SOP PRSP0032DF-A (32P2S-A) 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 8mm×13.4mm 32-pin plastic sTSOP (normal-bend type) 0 ~ +70°C -40 ~ +85°C PTSA0032KB-A (32P3K-B) 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C -40 ~ +85°C 8mm×20mm 32-pin plastic TSOP (normal-bend type) 0 ~ +70°C -40 ~ +85°C 0 ~ +70°C PTSA0032KA-A (32P3H-E) -40 ~ +85°C Page 2 of 12 R1LV0108E Series Pin Arrangement NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND R10DS0152EJ0100 Rev.1.00 2013.6.21 1 32 Vcc 2 31 A15 3 30 CS2 4 29 WE# 5 28 A13 6 27 A8 7 26 A9 25 A11 9 24 OE# 10 23 A10 11 22 CS1# 12 21 DQ7 13 20 DQ6 14 19 DQ5 15 18 DQ4 16 17 DQ3 8 32-pin SOP A11 1 32 OE# A9 2 31 A10 A8 3 30 CS1# A13 4 29 DQ7 WE# 5 28 DQ6 CS2 6 27 DQ5 A15 7 26 DQ4 Vcc 8 25 DQ3 NC 9 24 GND A16 10 23 DQ2 A14 11 22 DQ1 A12 12 21 DQ0 A7 13 20 A0 A6 14 19 A1 A5 15 18 A2 A4 16 17 A3 A11 1 32 OE# A9 2 31 A10 A8 3 30 CS1# A13 4 29 DQ7 WE# 5 28 DQ6 CS2 6 27 DQ5 A15 7 26 DQ4 Vcc 8 25 DQ3 NC 9 24 GND A16 10 23 DQ2 A14 11 22 DQ1 A12 12 21 DQ0 A7 13 20 A0 A6 14 19 A1 A5 15 18 A2 A4 16 17 A3 32-pin sTSOP 32-pin TSOP (normal-bend) Page 3 of 12 R1LV0108E Series Pin Description Pin name Function Vcc Power supply Vss A0 to A16 DQ0 to DQ7 CS1# CS2 WE# OE# NC Ground Address input Data input/output Chip select 1 Chip select 2 Write enable Output enable Non connection Block Diagram A0 A1 ADDRESS ROW MEMORY ARRAY BUFFER DECODER 128k-word x8-bit A16 DQ0 DQ DQ1 BUFFER SENSE / WRITE AMPLIFIER DQ7 COLUMN DECODER CLOCK GENERATOR WE# Vcc Vss CS1# CS2 OE# R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 4 of 12 R1LV0108E Series Operation Table CS1# CS2 WE# OE# DQ0~7 Operation X L X X High-Z Stand-by H X X X High-Z Stand-by L H L X Din Write L H H L Dout Read L H H H High-Z Output disable Note 1. H: VIH L:VIL X: VIH or VIL Absolute Maximum Parameter Power supply voltage relative to Vss Terminal voltage on any pin relative to Vss Power dissipation Operation temperature Storage temperature range Storage temperature range under bias Note Symbol Vcc VT PT Topr*3 Value -0.3 to +4.6 -0.3*1 to Vcc+0.3*2 0.7 R Ver. I Ver. Tstg Tbias*3 0 to +70 -40 to +85 -65 to 150 R Ver. I Ver. unit V V W °C °C 0 to +70 -40 to +85 °C 1. –3.0V for pulse ≤ 30ns (full width at half maximum) 2. Maximum voltage is +4.6V. 3. Ambient temperature range depends on R/I-version. Please see table on page 1. R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 5 of 12 R1LV0108E Series DC Operating Conditions Parameter Symbol Min. Typ. Max. Unit Vcc 2.7 3.0 3.6 V Supply voltage Note Vss 0 0 0 V Input high voltage VIH 2.0 - Vcc+0.3 V Input low voltage VIL -0.3 - 0.6 V 1 0 - +70 °C 2 -40 - +85 °C 2 Ambient temperature range Note R Ver. Ta I Ver. 1. –3.0V for pulse ≤ 30ns (full width at half maximum) 2. Ambient temperature range depends on R/I-version. Please see table on page 1. DC Characteristics Parameter Input leakage current Output leakage current Average operating current Symbol Min. Typ. Max. Unit | ILI | - - 1 A | ILO | - - 1 A ICC1 - 15 25 mA ICC2 - 2 5 mA ISB - - 0.33 mA - 0.6*1 2 A ~+25°C - - 3 A ~+40°C - - 8 A ~+70°C - - 10 A ~+85°C VOH 2.4 - - V IOH = -0.5mA VOH2 Vcc - 0.5 - - V IOH = -0.05mA VOL - - 0.4 V IOL = 2mA Standby current Standby current Test conditions Vin = Vss to Vcc CS1# =VIH or CS2 =VIL or OE# =VIH, VI/O =Vss to Vcc Min. cycle, duty =100%, II/O = 0mA CS1# =VIL, CS2 =VIH, Others = VIH/VIL Cycle =1s, duty =100%, II/O = 0mA CS1# ≤ 0.2V, CS2 ≥ Vcc-0.2V, VIH ≥ Vcc-0.2V, VIL ≤ 0.2V “CS2 =VIL“ or “CS2 = VIH and CS1# =VIH”, Others = Vss to Vcc ISB1 Output high voltage Output low voltage Note Vin = Vss to Vcc (1) CS2 ≤ 0.2V or (2) CS1# ≥ Vcc-0.2V, CS2 ≥ Vcc-0.2V 1. Typical parameter indicates the value for the center of distribution at 3.0V (Ta= 25ºC), and not 100% tested. Capacitance (Vcc = 2.7V ~ 3.6V, f = 1MHz, Ta = 0 ~ +70°C / -40 ~ +85°C*2) Parameter Symbol Min. Typ. Max. Unit Test conditions Input capacitance C in 8 pF Vin =0V Input / output capacitance C I/O 10 pF VI/O =0V Note 1. This parameter is sampled and not 100% tested. 2. Ambient temperature range depends on R/I-version. Please see table on page 1. R10DS0152EJ0100 Rev.1.00 2013.6.21 Note 1 1 Page 6 of 12 R1LV0108E Series AC Characteristics Test Conditions (Vcc = 2.7V ~ 3.6V, Ta = 0 ~ +70°C / -40 ~ +85°C*1)     Input pulse levels: VIL = 0.4V, VIH = 2.2V Input rise and fall time: 5ns Input and output timing reference level: 1.5V Output load: See figures (Including scope and jig) 1.5V RL = 500 ohm DQ CL = 30 pF Note 1. Ambient temperature range depends on R/I-version. Please see table on page 1. R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 7 of 12 R1LV0108E Series Read Cycle Parameter Read cycle time Address access time Chip select access time Output enable to output valid Output hold from address change Chip select to output in low-Z Output enable to output in low-Z Chip deselect to output in high-Z Output disable to output in high-Z Symbol tRC tAA tACS1 tACS2 tOE tOH tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ R1LV0108E**-5** R1LV0108E**-7** Min. 55 5 5 5 5 0 0 0 Min. 70 10 10 10 5 0 0 0 Max. 55 55 55 30 20 20 20 Max. 70 70 70 35 25 25 25 Unit Note ns ns ns ns ns ns ns ns ns ns ns ns 2,3 2,3 2,3 1,2,3 1,2,3 1,2,3 Write Cycle Parameter Write cycle time Address valid to end of write Chip select to end of write Write pulse width Address setup time Write recovery time Data to write time overlap Data hold from write time Output enable from end of write Output disable to output in high-Z Write to output in high-Z Note Symbol tWC tAW tCW tWP tAS tWR tDW tDH tOW tOHZ tWHZ R1LV0108E**-5** R1LV0108E**-7** Min. 55 50 50 45 0 0 25 0 5 0 0 Min. 70 55 55 50 0 0 30 0 5 0 0 Max. 20 20 Max. 25 25 Unit ns ns ns ns ns ns ns ns ns ns ns Note 5 4 6 7 2 1,2 1,2 1. tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referred to output voltage levels. 2. This parameter is sampled and not 100% tested. 3. At any given temperature and voltage condition, tHZ max is less than tLZ min both for a given device and from device to device. 4. A write occurs during the overlap of a low CS1#, a high CS2, a low WE#. A write begins at the latest transition among CS1# going low, CS2 going high and WE# going low. A write ends at the earliest transition among CS1# going high, CS2 going low and WE# going high. tWP is measured from the beginning of write to the end of write. 5. tCW is measured from the later of CS1# going low or CS2 going high to end of write. 6. tAS is measured the address valid to the beginning of write. 7. tWR is measured from the earliest of CS1# or WE# going high or CS2 going low to the end of write cycle. 8. Don’t apply inverted phase signal externally when DQ pin is output mode. R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 8 of 12 R1LV0108E Series Timing Waveforms Read Cycle tRC A0~16 tOH tAA tACS1 CS1# tCLZ1 CS2 tCHZ1 tACS2 tCLZ2 WE# tCHZ2 VIH WE# = “H” level tOE OE# tOLZ tOHZ High impedance DQ0~7 R10DS0152EJ0100 Rev.1.00 2013.6.21 Valid Data Page 9 of 12 R1LV0108E Series Write Cycle (1) (WE# CLOCK) tWC A0~16 tCW CS1# tCW CS2 tAW tAS tWP tWR WE# OE# tWHZ tOLZ tOHZ DQ0~7 tOW Valid Data tDW R10DS0152EJ0100 Rev.1.00 2013.6.21 tDH Page 10 of 12 R1LV0108E Series Write Cycle (2) (CS1#, CS2 CLOCK) tWC A0~16 tAW tAS tCW tWR tAS tCW tWR CS1# CS2 tWP WE# OE# VIH OE# = “H” level tDW DQ0~7 R10DS0152EJ0100 Rev.1.00 2013.6.21 tDH Valid Data Page 11 of 12 R1LV0108E Series Low Vcc Data Retention Characteristics Parameter Symbol VCC for data retention VDR Min. Typ. Max. Test conditions*2 Unit 2.0 - 3.6 V Vin ≥ 0V (1) 0V ≤ CS2 ≤ 0.2V or (2) CS1# ≥ Vcc-0.2V, CS2 ≥ Vcc-0.2V - 0.6*1 2 A ~+25°C Vcc=3.0V, Vin ≥ 0V Data retention current - - 3 A ~+40°C - - 8 A ~+70°C - - 10 A ~+85°C ICCDR (1) 0V ≤ CS2 ≤ 0.2V or (2) CS1# ≥ Vcc-0.2V, CS2 ≥ Vcc-0.2V Chip deselect to data retention time tCDR 0 ns See retention waveform. Operation recovery time tR 5 ms Note 1. Typical parameter indicates the value for the center of distribution at 3.0V (Ta= 25ºC), and not 100% tested. 2. CS2 controls address buffer, WE# buffer, CS1# buffer, OE# buffer and Din buffer. If CS2 controls data retention mode, Vin levels (address, WE#, CS1#, OE#, DQ) can be in the high impedance state. If CS1# controls data retention mode, CS2 must be CS2 ≥ Vcc-0.2V or 0V ≤ CS2 ≤ 0.2V. The other input levels (address, WE# ,OE#, DQ) can be in the high impedance state. Low Vcc Data Retention Timing Waveforms (1) CS1# Controlled Vcc tCDR 2.7V 2.7V tR VDR 2.2V 2.2V CS1# ≥ Vcc - 0.2V CS1# (2) CS2 Controlled Vcc tCDR CS2 2.7V 2.7V tR VDR 0.2V 0.2V 0V ≤ CS2 ≤ 0.2V R10DS0152EJ0100 Rev.1.00 2013.6.21 Page 12 of 12 Revision History R1LV0108E Series Data Sheet Description Rev. Date 1.00 2013.6.21 Page - Summary First Edition issued All trademarks and registered trademarks are the property of their respective owners. Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics 3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or 5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product. the product's quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics. 6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics products. 11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada Tel: +1-905-898-5441, Fax: +1-905-898-3220 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700, Fax: +44-1628-651-804 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-65030, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. 7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898 Renesas Electronics Hong Kong Limited Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2886-9318, Fax: +852 2886-9022/9044 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics Korea Co., Ltd. 11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141 © 2013 Renesas Electronics Corporation. All rights reserved. Colophon 2.2
R1LV0108ESA-5SR#B0 价格&库存

很抱歉,暂时无法提供与“R1LV0108ESA-5SR#B0”相匹配的价格&库存,您可以联系我们找货

免费人工找货