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R2J20601NP

R2J20601NP

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

  • 描述:

    R2J20601NP - Driver - MOS FET Integrated SiP (DrMOS) - Renesas Technology Corp

  • 数据手册
  • 价格&库存
R2J20601NP 数据手册
R2J20601NP Driver – MOS FET Integrated SiP (DrMOS) REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Description The R2J20601NP multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver in a single QFN package. The on and off timing of the power MOS FET is optimized by the built-in driver, making this device suitable for large-current buck converters. The chip also incorporates a high-side bootstrap Schottky barrier diode (SBD), eliminating the need for an external SBD for this purpose. Integrating a driver and both high-side and low-side power MOS FETs, the new device is also compliant with the package standard “Driver – MOS FET integrated SiP (DrMOS)” proposed by Intel Corporation. Features • • • • • • • • • • • • Built-in power MOS FET suitable for applications with 12 V input and low output voltage Built-in driver circuit which matches the power MOS FET Built-in tri-state input function which can support a number of PWM controllers VIN operating-voltage range: 16 V max High-frequency operation (above 1 MHz) possible Large average output current (35 A) Achieve low power dissipation (About 5.6 W at 1 MHz, 25 A) Controllable driver: Remote on/off Built-in Schottky diode for bootstrapping Low-side drive voltage can be independently set Small package: QFN56 (8 mm × 8 mm × 0.8 mm) Pb-free Outline VCIN BOOT GH VIN 56 Reg5V Driver Tab High-side MOS Tab 1 14 15 DISBL# MOS FET Driver VSWH Low-side MOS Tab PWM 43 CGND VLDRV GL PGND 42 28 29 (Bottom view) QFN56 package 8 mm × 8 mm REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 1 of 13 R2J20601NP Block Diagram VCIN Reg5V BOOT GH Driver chip UVL DISBL# 2 µA CGND 5 V Gen. SBD VIN High-side MOS FET Level shifter VSWH VCIN PWM Input logic (TTL level) (3 state in) Overlap protection Low-side MOS FET PGND CGND VLDRV GL Notes: 1. Truth table for the DISBL# pin. DISBL# Input “L” “Open” “H” Driver Chip Status Shutdown (GL, GH = “L”) Shutdown (GL, GH = “L”) Enable (GL, GH = “Active”) 2. Output signal from the UVL block "H" UVL Output Logic Level "L" VL VH VCIN For activation For shutdown REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 2 of 13 R2J20601NP Pin Arrangement VLDRV 3 CGND 14 13 12 11 10 9 8 7 6 5 4 2 VIN VIN VIN VIN VIN VIN VSWH PGND PGND PGND PGND PGND PGND PGND CGND 1 56 55 BOOT VCIN VIN VIN VIN VIN VIN VIN VIN GH NC 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 PWM DISBL# Reg5V NC GL CGND VSWH VSWH VSWH VSWH VSWH VSWH VSWH VSWH VIN CGND 54 53 52 51 50 49 48 VSWH 47 46 45 44 43 VSWH VSWH (Top view) Note: All die-pads (three pads in total) should be soldered to PCB. Pin Description Pin Name CGND NC VLDRV VCIN BOOT GH VIN VSWH PGND GL Reg5V DISBL# PWM Pin No. 1, 6, 51, Tab 2, 53 3 4 5 7 8 to 20, Tab 21, 40 to 50, Tab 22 to 39 52 54 55 56 Description Control signal ground No connect Low side gate supply voltage Control input voltage (+12 V input) Bootstrap voltage pin High side gate signal Input voltage Phase output/Switch output Power ground Low side gate signal +5 V logic power supply output Signal disable PWM drive logic input Remarks Should be connected to PGND externally For 5 V to 12 V gate drive voltage for Low side gate driver Driver Vcc input To be supplied +5 V through internal SBD Pin for Monitor Pin for Monitor Disabled when DISBL# is “L” REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 3 of 13 VSWH PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND PGND R2J20601NP Absolute Maximum Ratings (Ta = 25°C) Item Power dissipation Average output current Input voltage Supply voltage Low side driver voltage Switch node voltage BOOT voltage DISBL# voltage PWM voltage Reg5V current Operating junction temperature Storage temperature Notes: 1. 2. 3. 4. 5. 6. Symbol Pt(25) Pt(110) Iout VIN (DC) VIN (AC) VCIN (DC) VCIN (AC) VLDRV (DC) VLDRV (AC) VSWH (DC) VSWH (AC) VBOOT Vdisble Vpwm Ireg5V Tj-opr Tstg Rating 25 8 35 –0.3 to +16 20 –0.3 to +16 20 –0.3 to +16 20 16 20 22 –0.3 to VCIN –0.3 to +5.3 –0.3 to +0.3 –10 to +0.1 –40 to +150 –55 to +150 Units W W A V V V V V V V V mA °C °C Notes 1 1 2 2, 6 2 2, 6 2 2, 6 2 2, 6 2 2 2, 4 2, 5 3 Pt(25) represents a PCB temperature of 25°C, and Pt(100) represents 100°C. Rated voltages are relative to voltages on the CGND and PGND pins. For rated current, (+) indicates inflow to the chip and (–) indicates outflow. This rating is when UVL (Under Voltage Lock out) is ineffective (normal operation mode). This rating is when UVL (Under Voltage Lock out) is effective (lock out mode). The specification values indicated “AC” are limited within 100 ns. Safe Operating Area 40 35 Condition VOUT = 1.3 V VIN = 12 V VLDRV = 5 V VCIN = 12 V L = 0.45 µH fPWM = 1 MHz Average Output Current (A) 30 25 20 15 10 5 0 0 25 50 75 100 125 150 175 PCB Temperature (°C) REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 4 of 13 R2J20601NP Electrical Characteristics (Ta = 25°C, VCIN = 12 V, VLDRV = 5 V, VSWH = 0 V, unless otherwise specified) Supply Item VCIN start threshold VCIN shutdown threshold UVLO hysteresis VCIN bias current VLDRV bias current PWM Input PWM rising threshold PWM falling threshold PWM input resistance Tri-state shutdown window Shutdown hold-off time Output voltage Line regulation Load regulation Disable threshold Enable threshold Input current Note: Symbol VH VL dUVL ICIN ILDRV VH-PWM VL-PWM RIN-PWM VIN-SD tHOLD-OFF Vreg Vreg-line Vreg-load VDISBL VENBL IDISBL Min 8.1 6.5 — 10.5 31.5 3.5 0.9 30 VL-PWM — 4.75 –10 –10 0.9 1.9 0.5 Typ 9.0 7.2 1.8 *1 14.0 40.7 3.8 1.2 50 — 240 *1 5.0 0 0 1.2 2.4 2.0 Max 9.9 7.9 — 18.5 46.5 4.1 1.5 70 VH-PWM — 5.25 10 10 1.5 2.9 5.0 Units V V V mA mA V V kΩ V ns V mV mV V V µA Test Conditions VH – VL fPWM = 1 MHz, ton-PWM = 125 ns fPWM = 1 MHz, ton-PWM = 125 ns PWM = 1 V 5V Regulator DISBL# Input VCIN = 12 V to 16 V Ireg = 0 to 10 mA DISBL# = 1 V 1. Reference values for design. Not 100% tested in production. REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 5 of 13 R2J20601NP Typical Application +12 V +5 V to 12 V +12 V VCIN VLDRV BOOT DISBL# VIN Reg5V VSWH R2J20601NP PWM CGND GH PGND GL VCIN VLDRV BOOT DISBL# VIN Reg5V VSWH R2J20601NP PWM PWM1 CGND GH PGND GL PWM PWM2 control circuit PWM3 PWM4 VCIN VLDRV BOOT DISBL# VIN +1.3 V Reg5V VSWH Signal Power GND GND R2J20601NP PWM CGND GH PGND GL VCIN VLDRV BOOT DISBL# VIN Reg5V VSWH R2J20601NP PWM CGND GH PGND GL REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 6 of 13 R2J20601NP Test Circuit VB VLDRV VCIN A A A IIN ILDRV ICIN V VIN VCIN VLDRV BOOT DISBL# VIN Reg5V VSWH R2J20601NP 5 V pulse PWM CGND GH PGND GL Electric load IO Averaging Average Output Voltage V VO circuit Note: PIN = IIN × VIN + ILDRV × VLDRV + ICIN × VCIN POUT = IO × VO Efficiency = POUT / PIN PLOSS(DrMOS) = PIN – POUT REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 7 of 13 R2J20601NP Typical Data Power Loss vs. Output Current 9 VIN = 12 V VLDRV = 5 V Power Loss vs. Input Voltage 10 VCIN = 12 V VLDRV = 5 V 9 VOUT = 1.3 V fPWM = 1 MHz L = 0.45 µH 8 VCIN = 12 V Power Loss (W) 7 VOUT = 1.3 V 6 L = 0.45 µH 5 4 3 2 Power Loss (W) fPWM = 1 MHz 8 7 6 5 1 0 0 5 10 15 20 25 30 4 5 6 7 8 Iout = 25 A Iout = 30 A 9 10 11 12 13 14 15 16 Output Current (A) Input Voltage Vin (V) Power Loss vs. Output Voltage 10 9 Power Loss (W) Power Loss vs. Switching Frequency 11 VIN = 12 V VLDRV = 5 V VOUT = 1.3 V 10 VCIN = 12 V Power Loss (W) Iout = 25 A Iout = 30 A 9 L = 0.45 µH 8 7 6 5 8 VIN = 12 V VCIN = 12 V 7 VLDRV = 5 V fPWM = 1 MHz L = 0.45 µH 6 5 4 3 250 500 750 1000 4 0.8 Iout = 25 A Iout = 30 A 1.2 1.6 2.0 2.4 2.8 3.2 3.6 1250 1500 Output Voltage Vout (V) Switching Frequency (kHz) REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 8 of 13 R2J20601NP Typical Data (cont.) Power Loss vs. Output Inductance 10 9 Power Loss (W) Power Loss vs. VLDRV 10 VIN = 12 V VCIN = 12 V 9 VOUT = 1.3 V fPWM = 1 MHz L = 0.45 µH 8 Power Loss (W) Iout = 25 A Iout = 30 A VIN = 12 V VCIN = 12 V 7 VLDRV = 5 V VOUT = 1.3 V fPWM = 1 MHz 8 7 6 5 4 Iout = 25 A Iout = 30 A 6 5 4 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Output Inductance (µH) 5 6 7 8 9 10 11 12 13 14 15 16 VLDRV (V) Average ILDRV vs. Switching Frequency 200 VIN = 12 V VCIN = 12 V VOUT = 1.3 V 160 IOUT = 0 L = 0.45 µH Average ICIN vs. Switching Frequency 25 VIN = 12 V VCIN = 12 V VOUT = 1.3 V 20 IOUT = 0 L = 0.45 µH Average ILDRV (mA) 120 Average ICIN (mA) VLDRV = 5 V VLDRV = 12 V VLDRV = 16 V 15 80 10 40 5 0 250 500 750 1000 1250 1500 0 250 VLDRV = 5 V VLDRV = 12 V VLDRV = 16 V 500 750 1000 1250 1500 Switching Frequency (kHz) Switching Frequency (kHz) REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 9 of 13 R2J20601NP Description of Operation The DrMOS multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver in a single QFN package. Since the parasitic inductance between each chip is extremely small, the module is highly suitable for use in buck converters to be operated at high frequencies. The control timing between the high-side MOS FET, low-side MOS FET, and driver is optimized so that high efficiency can be obtained at low output-voltage. Driver The driver has two types of power-supply voltage input pin, VCIN and VLDRV. VCIN supplies the operating voltage to the internal logic circuit. The low-side driving voltage is applied to VLDRV, so setting of the gate-driving voltage for the low-side MOS FET is independent of the voltage on VCIN. The VLDRV setting voltage is from 5 V to 16 V. The VCIN pin is connected to the UVL (under-voltage lockout) module, so that the driver is disabled as long as VCIN is 9 V or less. On cancellation of UVL, the driver remains enabled until the UVL input is driven to 7.2 V or less. The signal on pin DISBL# also enables or disables the circuit. When UVL disables the circuit , the built-in 5 V regulator does not operate, but when the signal on DISBL# disables the circuit, only output-pulse generation is terminated, and the 5 V regulator is not disabled. VCIN L H H H VLDRV >5 V >5 V >5 V >5 V DISBL# ∗ L H Open Reg5V 0 5V 5V 5V Driver state Disable (GL, GH = L) Disable (GL, GH = L) Active Disable (GL, GH = L) Voltages from –0.3 V to VCIN can be applied to the DISBL# pin, so on/off control by a logic IC or the use of a resistor, etc., to pull the DISBL# line up to VCIN are both possible. The built-in 5 V regulator is a series regulator with temperature compensation. The voltage output by this regulator determines the operating voltage of the internal logic and gate-voltage swing for the high-side MOS FET. A ceramic capacitor with a value of 0.1 µF or more must be connected between the CGND plane and the Reg5V pin. The PWM pin is the signal input pin for the driver chip. The input-voltage range is –0.3 V to (Reg5V + 3 V). When the PWM input is high, the gate of the high-side MOS FET (GH) is high and the gate of the low-side MOS FET (GL) is low. PWM L H GH L H GL H L REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 10 of 13 R2J20601NP The PWM input is TTL level and has hysteresis. When the PWM input signal is abnormal, e.g., when the signal route from the control IC is abnormal, the tri-state function turns off the high- and low-side MOS FETs. This function operates when the PWM input signal stays in the input hysteresis window for 240 ns (typ.). After the tri-state mode has been entered and GH and GL have become low, a PWM input voltage of 3.8 V or more is required to make the circuit return to normal operation. 240 ns(tHOLD-OFF) 240 ns(tHOLD-OFF) PWM 3.8 V 1.2 V GH GL 240 ns(tHOLD-OFF) 240 ns(tHOLD-OFF) PWM 3.8 V 1.2 V GH GL Figure 1 REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 11 of 13 R2J20601NP The equivalent circuit for the PWM-pin input is shown in the next figure. M1 is in the ON state during normal operation; after the PWM input signal has stayed in the hysteresis window for 240 ns (typ.) and the tri-state detection signal has been driven high, the transistor M1 is turned off. From this circuit configuration, we can see that the voltage on the PWM pin when open-circuit will be about 2.5 V, so the tri-state protection function will operate. Reg5V M1 50 k PWM pin Input logic 50 k To internal control Tri-state detection signal Figure 2 Equivalent Circuit for the PWM-pin Input For the high-side driver, the BOOT pin is the power-supply voltage pin and voltage VSWH provides a standard for operation of the high-side driving circuit. Consequently, the difference between the voltage on the BOOT and VSWH pins becomes the gate swing for the high-side MOS FET. Connect a bootstrap capacitor between the BOOT pin and the VSWH pin. Since the Schottky barrier diode (SBD) is connected between the BOOT and Reg5V pins, this bootstrap capacitor is charged up to 5 V. When the high-side MOS FET is turned on, voltage VSWH becomes equal to VIN, so VBOOT is boosted to VSWH + 5 V. The GH and GL pins are the gate-monitor pins for each MOS FET. MOS FETs The MOS FETs incorporated in R2J20601NP are highly suitable for synchronous-rectification buck conversion. For the high-side MOS FET, the drain is connected to the VIN pin and the source is connected to the VSWH pin. For the low-side MOS FET, the drain is connected to the VSWH pin and the source is connected to the PGND pin. REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 12 of 13 R2J20601NP Package Dimensions JEITA Package Code P-HWQFN56-8x8-0.50 RENESAS Code PWQN0056KA-A Previous Code TNP-56TV MASS[Typ.] 0.17g B 42 43 D 29 28 A 0.85 29 28 3.55 0.55 2.20 0.85 42 43 0.85 3.50 e Reference Symbol Dimension in Millimeters Min 7.90 7.90 Nom 8.00 8.00 Max 8.10 8.10 E 0.55 D E A2 A A1 2.25 C 4 0. 0.80 0 0.18 0.23 0.05 0.28 0.85 56 1 t C 14 15 15 14 b 1 56 Lp b b1 e Lp ×M C A B 0.50 0.30 0.40 0.50 0.10 0.08 0.10 0.15 y1 C C A x y y1 t y C A1 HD c ( Ni/Pd/Au plating ) HE ZD ZE c c1 0.20 REJ03G0237-0700 Rev.7.00 Jun 30, 2008 Page 13 of 13 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: (1628) 585-100, Fax: (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: (21) 5877-1818, Fax: (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: 2265-6688, Fax: 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: (2) 2715-2888, Fax: (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: 6213-0200, Fax: 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: (2) 796-3115, Fax: (2) 796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: 7955-9390, Fax: 7955-9510 © 2008. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .7.2
R2J20601NP 价格&库存

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