0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
R5F212BCSNFP

R5F212BCSNFP

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

  • 描述:

    R5F212BCSNFP - RENESAS MCU - Renesas Technology Corp

  • 数据手册
  • 价格&库存
R5F212BCSNFP 数据手册
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”: 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. R8C/2A Group, R8C/2B Group RENESAS MCU REJ03B0182-0210 Rev.2.10 Nov 26, 2007 1. 1.1 Overview Features The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs also use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. Furthermore, the R8C/2B Group has on-chip data flash (1 KB × 2 blocks). The difference between the R8C/2A Group and R8C/2B Group is only the presence or absence of data flash. Their peripheral functions are the same. 1.1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer equipment, etc. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 1 of 60 R8C/2A Group, R8C/2B Group 1. Overview 1.1.2 Specifications Tables 1.1 and 1.2 outlines the Specifications for R 8C/2A Group and Tables 1.3 and 1.4 outlines the Specifications for R8C/2B Group. Table 1.1 Item CPU Specifications for R8C/2A Group (1) Function Central processing unit Specification R8C/Tiny series core • Number of fundamental instructions: 89 • Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) 200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) • Multiplier: 16 bits × 16 bits → 32 bits • Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits • Operation mode: Single-chip mode (address space: 1 Mbyte) Refer to Table 1.5 Product List for R8C/2A Group. • Power-on reset • Voltage detection 2 • Input-only: 2 pins • CMOS I/O ports: 55, selectable pull-up resistor • High current drive ports: 8 3 circuits: XIN clock oscillation circuit (with on-chip feedback resistor), On-chip oscillator (high-speed, low-speed) (high-speed on-chip oscillator has a frequency adjustment function), XCIN clock oscillation circuit (32 kHz) • Oscillation stop detection: XIN clock oscillation stop detection function • Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16 • Low power consumption modes: Standard operating mode (high-speed clock, low-speed clock, high-speed on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode Real-time clock (timer RE) • External: 5 sources, Internal: 23 sources, Software: 4 sources • Priority levels: 7 levels 15 bits × 1 (with prescaler), reset start selectable 8 bits × 1 (with 8-bit prescaler) Timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode 8 bits × 1 (with 8-bit prescaler) Timer mode (period timer), programmable waveform generation mode (PWM output), programmable one-shot generation mode, programmable wait oneshot generation mode 16 bits × 1 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 3 pins), PWM2 mode (PWM output pin) 16 bits × 2 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 6 pins), reset synchronous PWM mode (output three-phase waveforms (6 pins), sawtooth wave modulation), complementary PWM mode (output three-phase waveforms (6 pins), triangular wave modulation), PWM3 mode (PWM output 2 pins with fixed period) 8 bits × 1 Real-time clock mode (count seconds, minutes, hours, days of week), output compare mode 16 bits × 1 (with capture/compare register pin and compare register pin) Input capture mode, output compare mode Memory Power Supply Voltage Detection I/O Ports ROM, RAM Voltage detection circuit Programmable I/O ports Clock generation circuits Clock Interrupts Watchdog Timer Timer Timer RA Timer RB Timer RC Timer RD Timer RE Timer RF Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 2 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.2 Specifications for R8C/2A Group (2) Specification Clock synchronous serial I/O/UART × 3 1 (shared with I2C-bus) 1 (shared with SSU) Hardware LIN: 1 (timer RA, UART0) 10-bit resolution × 12 channels, includes sample and hold function 8-bit resolution × 2 circuits • Programming and erasure voltage: VCC = 2.7 to 5.5 V • Programming and erasure endurance: 100 times • Program security: ROM code protect, ID code check • Debug functions: On-chip debug, on-board flash rewrite function f(XIN) = 20 MHz (VCC = 3.0 to 5.5 V) f(XIN) = 10 MHz (VCC = 2.7 to 5.5 V) f(XIN) = 5 MHz (VCC = 2.2 to 5.5 V) 12 mA (VCC = 5.0 V, f(XIN) = 20 MHz) 5.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz) 2.1 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)) 0.65 µA (VCC = 3.0 V, stop mode) -20 to 85°C (N version) -40 to 85°C (D version)(2) -20 to 105°C (Y version)(3) 64-pin LQFP • Package code: PLQP0064KB-A (previous code: 64P6Q-A) • Package code: PLQP0064GA-A (previous code: 64P6U-A) 64-pin FLGA • Package code: PTLG0064JA-A (previous code: 64F0G) Item Function Serial UART0, UART1, Interface UART2 Clock Synchronous Serial I/O with Chip Select (SSU) I2C bus(1) LIN Module A/D Converter D/A Converter Flash Memory Operating Frequency/Supply Voltage Current consumption Operating Ambient Temperature Package NOTES: 1. I2C bus is a trademark of Koninklijke Philips Electronics N. V. 2. Specify the D version if D version functions are to be used. 3. Please contact Renesas Technology sales offices for the Y version. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 3 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.3 Item CPU Specifications for R8C/2B Group (1) Function Central processing unit Specification R8C/Tiny series core • Number of fundamental instructions: 89 • Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) 200 ns (f(XIN) = 5 MHz, VCC = 2.2 to 5.5 V) • Multiplier: 16 bits × 16 bits → 32 bits • Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits • Operation mode: Single-chip mode (address space: 1 Mbyte) Refer to Table 1.6 Product List for R8C/2B Group. • Power-on reset • Voltage detection 2 • Input-only: 2 pins • CMOS I/O ports: 55, selectable pull-up resistor • High current drive ports: 8 3 circuits: XIN clock oscillation circuit (with on-chip feedback resistor), On-chip oscillator (high-speed, low-speed) (high-speed on-chip oscillator has a frequency adjustment function), XCIN clock oscillation circuit (32 kHz) • Oscillation stop detection: XIN clock oscillation stop detection function • Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16 • Low power consumption modes: Standard operating mode (high-speed clock, low-speed clock, high-speed on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode Real-time clock (timer RE) • External: 5 sources, Internal: 23 sources, Software: 4 sources • Priority levels: 7 levels 15 bits × 1 (with prescaler), reset start selectable 8 bits × 1 (with 8-bit prescaler) Timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode 8 bits × 1 (with 8-bit prescaler) Timer mode (period timer), programmable waveform generation mode (PWM output), programmable one-shot generation mode, programmable wait oneshot generation mode 16 bits × 1 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 3 pins), PWM2 mode (PWM output pin) 16 bits × 2 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 6 pins), reset synchronous PWM mode (output three-phase waveforms (6 pins), sawtooth wave modulation), complementary PWM mode (output three-phase waveforms (6 pins), triangular wave modulation), PWM3 mode (PWM output 2 pins with fixed period) 8 bits × 1 Real-time clock mode (count seconds, minutes, hours, days of week), output compare mode 16 bits × 1 (with capture/compare register pin and compare register pin) Input capture mode, output compare mode Memory Power Supply Voltage Detection I/O Ports ROM, RAM Voltage detection circuit Programmable I/O ports Clock generation circuits Clock Interrupts Watchdog Timer Timer Timer RA Timer RB Timer RC Timer RD Timer RE Timer RF Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 4 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.4 Specifications for R8C/2B Group (2) Specification Clock synchronous serial I/O/UART × 3 1 (shared with I2C-bus) 1 (shared with SSU) Hardware LIN: 1 (timer RA, UART0) 10-bit resolution × 12 channels, includes sample and hold function 8-bit resolution × 2 circuits • Programming and erasure voltage: VCC = 2.7 to 5.5 V • Programming and erasure endurance: 10,000 times (data flash) 1,000 times (program ROM) • Program security: ROM code protect, ID code check • Debug functions: On-chip debug, on-board flash rewrite function f(XIN) = 20 MHz (VCC = 3.0 to 5.5 V) f(XIN) = 10 MHz (VCC = 2.7 to 5.5 V) f(XIN) = 5 MHz (VCC = 2.2 to 5.5 V) 12 mA (VCC = 5.0 V, f(XIN) = 20 MHz) 5.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz) 2.1 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz)) 0.65 µA (VCC = 3.0 V, stop mode) -20 to 85°C (N version) -40 to 85°C (D version)(2) -20 to 105°C (Y version)(3) 64-pin LQFP • Package code: PLQP0064KB-A (previous code: 64P6Q-A) • Package code: PLQP0064GA-A (previous code: 64P6U-A) 64-pin FLGA • Package code: PTLG0064JA-A (previous code: 64F0G) Item Function Serial UART0, UART1, Interface UART2 Clock Synchronous Serial I/O with Chip Select (SSU) I2C bus(1) LIN Module A/D Converter D/A Converter Flash Memory Operating Frequency/Supply Voltage Current consumption Operating Ambient Temperature Package NOTES: 1. I2C bus is a trademark of Koninklijke Philips Electronics N. V. 2. Specify the D version if D version functions are to be used. 3. Please contact Renesas Technology sales offices for the Y version. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 5 of 60 R8C/2A Group, R8C/2B Group 1. Overview 1.2 Product List Table 1.5 lists Product List for R8C/2A Group, Figure 1.1 shows a Part Number, Memory Size, and Package of R8C/2A Group, Table 1.6 lists Product List for R8C/2B Group, and Figure 1.2 shows a Part Number, Memory Size, and Package of R8C/2B Group. Table 1.5 Product List for R8C/2A Group ROM Capacity 48 Kbytes 48 Kbytes 48 Kbytes 64 Kbytes 64 Kbytes 64 Kbytes 96 Kbytes 96 Kbytes 96 Kbytes 128 Kbytes 128 Kbytes 128 Kbytes 48 Kbytes 48 Kbytes 64 Kbytes 64 Kbytes 96 Kbytes 96 Kbytes 128 Kbytes 128 Kbytes 48 Kbytes 48 Kbytes 48 Kbytes 64 Kbytes 64 Kbytes 64 Kbytes 96 Kbytes 96 Kbytes 96 Kbytes 128 Kbytes 128 Kbytes 128 Kbytes 48 Kbytes 48 Kbytes 64 Kbytes 64 Kbytes 96 Kbytes 96 Kbytes 128 Kbytes 128 Kbytes RAM Capacity 2.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes Package Type PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLTG0064JA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A Current of Nov. 2007 Remarks N version Part No. R5F212A7SNFP R5F212A7SNFA R5F212A7SNLG R5F212A8SNFP R5F212A8SNFA R5F212A8SNLG R5F212AASNFP R5F212AASNFA R5F212AASNLG R5F212ACSNFP R5F212ACSNFA R5F212ACSNLG R5F212A7SDFP R5F212A7SDFA R5F212A8SDFP R5F212A8SDFA R5F212AASDFP R5F212AASDFA R5F212ACSDFP R5F212ACSDFA R5F212A7SNXXXFP R5F212A7SNXXXFA R5F212A7SNXXXLG R5F212A8SNXXXFP R5F212A8SNXXXFA R5F212A8SNXXXLG R5F212AASNXXXFP R5F212AASNXXXFA R5F212AASNXXXLG R5F212ACSNXXXFP R5F212ACSNXXXFA R5F212ACSNXXXLG R5F212A7SDXXXFP R5F212A7SDXXXFA R5F212A8SDXXXFP R5F212A8SDXXXFA R5F212AASDXXXFP R5F212AASDXXXFA R5F212ACSDXXXFP R5F212ACSDXXXFA D version N version Factory programming product(1) D version NOTE: 1. The user ROM is programmed before shipment. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 6 of 60 R8C/2A Group, R8C/2B Group 1. Overview Part No. R 5 F 21 2A 7 S N XXX FP Package type: FP: PLQP0064KB-A (0.5 mm pin-pitch, 10 mm square body) FA: PLQP0064GA-A (0.8 mm pin-pitch, 14 mm square body) LG: PTLG0064JA-A (0.65 mm pin-pitch, 6 mm square body) ROM number Classification N: Operating ambient temperature -20°C to 85°C D: Operating ambient temperature -40°C to 85°C Y: Operating ambient temperature -20°C to 105°C (1) S: Low-voltage version ROM capacity 7: 48 KB 8: 64 KB A: 96 KB C: 128 KB R8C/2A Group R8C/Tiny Series Memory type F: Flash memory Renesas MCU Renesas semiconductor NOTE: 1: Please contact Renesas Technology sales offices for the Y version. Figure 1.1 Part Number, Memory Size, and Package of R8C/2A Group Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 7 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.6 Product List for R8C/2B Group ROM Capacity Program ROM Data flash 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 48 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 64 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 96 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 128 Kbytes 1 Kbyte × 2 RAM Capacity 2.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes 7.5 Kbytes 2.5 Kbytes 2.5 Kbytes 3 Kbytes 3 Kbytes 7 Kbytes 7 Kbytes 7.5 Kbytes 7.5 Kbytes Package Type PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PTLG0064JA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A PLQP0064KB-A PLQP0064GA-A Current of Nov. 2007 Remarks N version Part No. R5F212B7SNFP R5F212B7SNFA R5F212B7SNLG R5F212B8SNFP R5F212B8SNFA R5F212B8SNLG R5F212BASNFP R5F212BASNFA R5F212BASNLG R5F212BCSNFP R5F212BCSNFA R5F212BCSNLG R5F212B7SDFP R5F212B7SDFA R5F212B8SDFP R5F212B8SDFA R5F212BASDFP R5F212BASDFA R5F212BCSDFP R5F212BCSDFA R5F212B7SNXXXFP R5F212B7SNXXXFA R5F212B7SNXXXLG R5F212B8SNXXXFP R5F212B8SNXXXFA R5F212B8SNXXXLG R5F212BASNXXXFP R5F212BASNXXXFA R5F212BASNXXXLG R5F212BCSNXXXFP R5F212BCSNXXXFA R5F212BCSNXXXLG R5F212B7SDXXXFP R5F212B7SDXXXFA R5F212B8SDXXXFP R5F212B8SDXXXFA R5F212BASDXXXFP R5F212BASDXXXFA R5F212BCSDXXXFP R5F212BCSDXXXFA D version N version Factory programming product(1) D version NOTE: 1. The user ROM is programmed before shipment. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 8 of 60 R8C/2A Group, R8C/2B Group 1. Overview Part No. R 5 F 21 2B 7 S N XXX FP Package type: FP: PLQP0064KB-A (0.5 mm pin-pitch, 10 mm square body) FA: PLQP0064GA-A (0.8 mm pin-pitch, 14 mm square body) LG: PTLG0064JA-A (0.65 mm pin-pitch, 6 mm square body) ROM number Classification N: Operating ambient temperature -20°C to 85°C D: Operating ambient temperature -40°C to 85°C Y: Operating ambient temperature -20°C to 105°C (1) S: Low-voltage version ROM capacity 7: 48 KB 8: 64 KB A: 96 KB C: 128 KB R8C/2B Group R8C/Tiny Series Memory type F: Flash memory Renesas MCU Renesas semiconductor NOTE: 1: Please contact Renesas Technology sales offices for the Y version. Figure 1.2 Part Number, Memory Size, and Package of R8C/2B Group Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 9 of 60 R8C/2A Group, R8C/2B Group 1. Overview 1.3 Block Diagram Figure 1.3 shows a Block Diagram. 8 8 8 8 3 2 5 I/O ports Peripheral functions Timers Timer RA (8 bits × 1) Timer RB (8 bits × 1) Timer RC (16 bits × 1) Timer RD (16 bits × 2) Timer RE (8 bits × 1) Timer RF (16 bits × 1) Port P0 Port P1 Port P2 Port P3 Port P4 Port P5 Port P6 UART or clock synchronous serial I/O (8 bits × 3) I2C bus or SSU (8 bits × 1) System clock generation circuit XIN-XOUT High-speed on-chip oscillator Low-speed on-chip oscillator XCIN-XCOUT 8 Port P8 7 LIN module Watchdog timer (15 bits) A/D converter (10 bits × 12 channels) D/A converter (8 bits × 2) R8C/Tiny Series CPU core R0H R1H R2 R3 A0 A1 FB R0L R1L SB USP ISP INTB PC FLG Memory ROM(1) RAM(2) Multiplier NOTES: 1. ROM size varies with MCU type. 2. RAM size varies with MCU type. Figure 1.3 Block Diagram Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 10 of 60 R8C/2A Group, R8C/2B Group 1. Overview 1.4 Pin Assignment Figure 1.4 shows 64-pin LQFP Package Pin Assignment (Top View). Figure 1.5 shows 64-pin FLGA Package Pin Assignment (Top Perspective View). Tables 1.7 and 1.8 outlines the Pin Name Information by Pin Number. P6_5/(CLK1)/CLK2 (2) P6_7/INT3/RXD1 P6_6/INT2/TXD1 P1_2/Kl2/AN10 P1_3/Kl3/AN11 P8_0/TRFO00 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P1_0/Kl0/AN8 P0_0/AN7 P0_1/AN6 P0_2/AN5 P0_3/AN4 P0_4/AN3 P6_2 P6_1 P0_5/AN2/CLK1 P0_6/AN1/DA0 VSS/AVSS P0_7/AN0/DA1 VREF VCC/AVCC P3_7/SSO P3_5/SCL/SSCK P8_1/TRFO01 P1_1/Kl1/AN9 P3_2/(INT2)(2) P3_6/(INT1)(2) P3_0/TRAO P3_1/TRBO P6_0/TREO P6_4/RXD2 P6_3/TXD2 P4_5/INT0 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 R8C/2A Group R8C/2B Group PLQP0064KB-A(64P6Q-A) PLQP0064GA-A(64P6U-A) (top view) 26 25 24 23 22 21 20 19 18 17 P8_2/TRFO02 P8_3/TRFO10/TRFI P8_4/TRFO11 P8_5/TRFO12 P8_6 P1_4/TXD0 P1_5/RXD0/(TRAIO)/(INT1)(2) P1_6/CLK0 P1_7/TRAIO/INT1 P2_0/TRDIOA0/TRDCLK P2_1/TRDIOB0 P2_2/TRDIOC0 P2_3/TRDIOD0 P2_4/TRDIOA1 P2_5/TRDIOB1 P2_6/TRDIOC1 P3_3/SSI P4_7/XOUT (1) P3_4/SDA/SCS NOTES: 1. P4_7/XOUT are an input-only port. 2. Can be assigned to the pin in parentheses by a program. 3. Confirm the pin 1 position on the package by referring to the package dimensions. Figure 1.4 64-pin LQFP Package Pin Assignment (Top View) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 11 of 60 P5_1/TRCIOA/TRCTRG P2_7/TRDIOD1 VSS/AVSS P5_2/TRCIOB MODE P5_0/TRCCLK RESET P4_4/XCOUT P4_6/XIN P5_4/TRCIOD P5_3/TRCIOC P4_3/XCIN VCC/AVCC R8C/2A Group, R8C/2B Group 1. Overview A B C D E F G H 8 P3_3/SSI P0_1/AN6 P5_0/ TRCCLK P0_6/AN1/ P6_0/TREO DA0 P0_3/AN4 P0_2/AN5 P1_0/KI0/ AN8 8 7 P3_4/SDA/ SCS P0_0/AN7 P5_2/ TRCIOB P0_7/AN0/ DA1 VREF P3_0/TRAO P6_5/CLK2/ (CLK1)(2) P1_1/KI1/ AN9 7 6 P5_3/ TRCIOC MODE P3_7/SSO P0_4/AN3 P6_1 P0_5/AN2/ CLK1 P3_6/ (INT1)(2) P3_1/TRBO 6 5 P4_4/XCOUT P2_5/ TRDIOB1 P4_3/XCIN P3_5/SCL/ SSCK P6_2 P3_2/ (INT2)(2) P6_3/TXD2 P1_3/KI3/ AN11 5 4 P5_4/ TRCIOD VCC/AVCC VCC/AVCC P4_7/ XOUT(1) RESET P8_3/ P6_4/RXD2 TRFO10/TRFI P1_2/KI2/ AN10 4 3 VSS/AVSS VSS/AVSS P1_5/RXD0/ P2_4/ P2_1/ TRDIOA1 TRDIOB0 (TRAIO)/(INT1)(2) P8_4/ TRFO11 P8_2/ TRFO02 P8_1/ TRFO01 3 2 P5_1/TRCIOA/ P4_6/XIN TRCTRG P2_2/ P2_0/TRDIOA0/ P8_6 TRDIOC0 TRDCLK P1_4/TXD0 P6_6/INT2/ TXD1 P8_0/ TRFO00 2 1 P2_7/ TRDIOD1 P2_6/ TRDIOC1 P2_3/ P1_7/TRAIO/ P1_6/CLK0 TRDIOD0 INT P8_5/ TRFO12 P4_5/INT0 P6_7/INT3/ RXD1 1 A B C D E F G H Package: PTLG0064JA-A (64F0G) NOTES: 1. P4_7 is an input-only port. 2. Can be assigned to the pin in parentheses by a program. R5F212A7 SNLG JAPAN Pin assignments (top view) Figure 1.5 64-pin FLGA Package Pin Assignment (Top Perspective View) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 12 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.7 Pin Name Information by Pin Number (1) Port P3_3 P3_4 MODE XCIN XCOUT RESET XOUT VSS/AVSS XIN VCC/AVCC P4_3 P4_4 P4_7 P4_6 P5_4 P5_3 P5_2 P5_1 P5_0 P2_7 P2_6 P2_5 P2_4 P2_3 P2_2 P2_1 P2_0 P1_7 P1_6 P1_5 P1_4 P8_6 P8_5 P8_4 P8_3 P8_2 P8_1 P8_0 P6_0 P4_5 P6_6 P6_7 P6_5 P6_4 P6_3 P3_1 P3_0 P3_6 P3_2 TRCIOD TRCIOC TRCIOB TRCIOA/TRCTRG TRCCLK TRDIOD1 TRDIOC1 TRDIOB1 TRDIOA1 TRDIOD0 TRDIOC0 TRDIOB0 TRDIOA0/TRDCLK TRAIO (TRAIO)(1) CLK0 RXD0 TXD0 TRFO12 TRFO11 TRFO10/TRFI TRFO02 TRFO01 TRFO00 TREO INT0 TXD1 RXD1 (CLK1)(1)/ CLK2 RXD2 TXD2 TRBO TRAO (INT1)(1) (INT2)(1) I/O Pin Functions for of Peripheral Modules Serial Timer SSU I2C bus Interface SSI SCS SDA A/D Converter, D/A Converter Pin Control Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 Interrupt INT1 (INT1)(1) INT0 INT2 INT3 NOTE: 1. Can be assigned to the pin in parentheses by a program. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 13 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.8 Pin Name Information by Pin Number (2) Port P1_3 P1_2 P1_1 P1_0 P0_0 P0_1 P0_2 P0_3 P0_4 P6_2 P6_1 P0_5 P0_6 VSS/AVSS P0_7 VREF VCC/AVCC P3_7 P3_5 SSO SSCK SCL AN0/DA1 I/O Pin Functions for of Peripheral Modules Serial Timer SSU I2C bus Interface A/D Converter, D/A Converter AN11 AN10 AN9 AN8 AN7 AN6 AN5 AN4 AN3 Pin Control Pin Number 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Interrupt Kl3 KI2 KI1 KI0 CLK1 AN2 AN1/DA0 Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 14 of 60 R8C/2A Group, R8C/2B Group 1. Overview 1.5 Pin Functions Tables 1.9 and 1.10 list Pin Functions. Table 1.9 Item Power supply input Analog power supply input Reset input MODE XIN clock input XIN clock output XCIN clock input XCIN clock output INT interrupt input Key input interrupt Timer RA Timer RB Timer RC Pin Functions (1) Pin Name VCC, VSS AVCC, AVSS RESET MODE XIN XOUT XCIN XCOUT INT0 to INT3 KI0 to KI3 TRAIO TRAO TRBO TRCCLK TRCTRG TRCIOA, TRCIOB, TRCIOC, TRCIOD I/O Type − − I I I O I O I I I/O O O I I I/O I/O Description Apply 2.2 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin. Power supply for the A/D converter. Connect a capacitor between AVCC and AVSS. Input “L” on this pin resets the MCU. Connect this pin to VCC via a resistor. These pins are provided for XIN clock generation circuit I/O. Connect a ceramic resonator or a crystal oscillator between the XIN and XOUT pins(1). To use an external clock, input it to the XIN pin and leave the XOUT pin open. These pins are provided for XCIN clock generation circuit I/O. Connect a crystal oscillator between the XCIN and XCOUT pins(1). To use an external clock, input it to the XCIN pin and leave the XCOUT pin open. INT interrupt input pins. INT0 is timer RD input pin. INT1 is timer RA input pin. Key input interrupt input pins Timer RA I/O pin Timer RA output pin Timer RB output pin External clock input pin External trigger input pin Timer RC I/O pins Timer RD I/O pins Timer RD TRDIOA0, TRDIOA1, TRDIOB0, TRDIOB1, TRDIOC0, TRDIOC1, TRDIOD0, TRDIOD1 TRDCLK TREO TRFI TRFO00 to TRFO02, TRFO10 to TRFO12 I O I O I/O I O I/O I/O I/O I/O I/O I/O I External clock input pin Divided clock output pin Timer RF input pin Timer RF output pins Transfer clock I/O pins Serial data input pins Serial data output pins Clock I/O pin Data I/O pin Data I/O pin Chip-select signal I/O pin Clock I/O pin Data I/O pin Reference voltage input pin to A/D converter and D/A converter Timer RE Timer RF Serial interface CLK0, CLK1, CLK2 RXD0, RXD1, RXD2 TXD0, TXD1, TXD2 I2C bus SSU SCL SDA SSI SCS SSCK SSO Reference voltage input VREF I: Input O: Output I/O: Input and output NOTE: 1. Refer to the oscillator manufacturer for oscillation characteristics. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 15 of 60 R8C/2A Group, R8C/2B Group 1. Overview Table 1.10 Item A/D converter D/A converter I/O port Pin Functions (2) Pin Name AN0 to AN11 DA0 to DA1 P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_3 to P4_5, P5_0 to P5_4, P6_0 to P6_7, P8_0 to P8_6 P4_6, P4_7 O: Output I/O Type I O I/O Description Analog input pins to A/D converter D/A converter output pins CMOS I/O ports. Each port h as an I/O select direction register, allowing each pin in the port to be directed for input or output individually. Any port set to input can be set to use a pull-up resistor or not by a program. P2_0 to P2_7 also function as LED drive ports. Input port I: Input I Input-only ports I/O: Input and output Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 16 of 60 R8C/2A Group, R8C/2B Group 2. Central Processing Unit (CPU) 2. Central Processing Unit (CPU) Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a register bank. There are two sets of register bank. b31 b15 b8b7 b0 R2 R3 R0H (high-order of R0) R0L (low-order of R0) R1H (high-order of R1) R1L (low-order of R1) Data registers(1) R2 R3 A0 A1 FB b19 b15 b0 Address registers(1) Frame base register(1) INTBH INTBL Interrupt table register The 4 high order bits of INTB are INTBH and the 16 low order bits of INTB are INTBL. b19 b0 PC Program counter b15 b0 USP ISP SB b15 b0 User stack pointer Interrupt stack pointer Static base register FLG b15 b8 b7 b0 Flag register IPL U I OBSZDC Carry flag Debug flag Zero flag Sign flag Register bank select flag Overflow flag Interrupt enable flag Stack pointer select flag Reserved bit Processor interrupt priority level Reserved bit NOTE: 1. These registers comprise a register bank. There are two register banks. Figure 2.1 CPU Registers Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 17 of 60 R8C/2A Group, R8C/2B Group 2. Central Processing Unit (CPU) 2.1 Data Registers (R0, R1, R2, and R3) R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is analogous to R2R0. 2.2 Address Registers (A0 and A1) A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 and as a 32bit address register (A1A0). 2.3 Frame Base Register (FB) FB is a 16-bit register for FB relative addressing. 2.4 Interrupt Table Register (INTB) INTB is a 20-bit register that indicates the start address of an interrupt vector table. 2.5 Program Counter (PC) PC is 20 bits wide and indicates the address of the next instruction to be executed. 2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP) The stack pointers (SP), USP, and ISP, are each 16 bits wide. The U flag of FLG is used to switch between USP and ISP. 2.7 Static Base Register (SB) SB is a 16-bit register for SB relative addressing. 2.8 Flag Register (FLG) FLG is an 11-bit register indicating the CPU state. 2.8.1 Carry Flag (C) The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit. 2.8.2 Debug Flag (D) The D flag is for debugging only. Set it to 0. 2.8.3 Zero Flag (Z) The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0. 2.8.4 Sign Flag (S) The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0. 2.8.5 Register Bank Select Flag (B) Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1. 2.8.6 Overflow Flag (O) The O flag is set to 1 when an operation results in an overflow; otherwise to 0. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 18 of 60 R8C/2A Group, R8C/2B Group 2. Central Processing Unit (CPU) 2.8.7 Interrupt Enable Flag (I) The I flag enables maskable interrupts. Interrupt are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0 when an interrupt request is acknowledged. 2.8.8 Stack Pointer Select Flag (U) ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1. The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software interrupt numbers 0 to 31 is executed. 2.8.9 Processor Interrupt Priority Level (IPL) IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7. If a requested interrupt has higher priority than IPL, the interrupt is enabled. 2.8.10 Reserved Bit If necessary, set to 0. When read, the content is undefined. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 19 of 60 R8C/2A Group, R8C/2B Group 3. Memory 3. 3.1 Memory R8C/2A Group Figure 3.1 is a Memory Map of R8C/2A Group. The R8C/2A group has 1 Mbyte of address space from addresses 00000h to FFFFFh. The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 48-Kbyte internal ROM area is allocated addresses 04000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine. The internal RAM is allocated higher addresses, beginning with address 00400h. For example, a 2.5-Kbyte internal RAM area is allocated addresses 00400h to 00DFFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged. Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users. 00000h SFR (Refer to 4. Special Function Registers (SFRs)) 002FFh 00400h Internal RAM 0XXXXh 03000h Internal RAM 0WWWWh 0FFDCh Undefined instruction Overflow BRK instruction Address match Single step Watchdog timer, oscillation stop detection, voltage monitor 0YYYYh Internal ROM (program ROM) 0FFFFh ZZZZZh FFFFFh Internal ROM (program ROM) Expanded area 0FFFFh (Reserved) (Reserved) Reset NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Internal ROM Size 48 Kbytes 64 Kbytes 96 Kbytes 128 Kbytes Address 0YYYYh 04000h 04000h 04000h 04000h Address ZZZZZh − 13FFFh 1BFFFh 23FFFh Size 2.5 Kbytes 3 Kbytes 7 Kbytes 7.5 Kbytes Internal RAM Address 0XXXXh 00DFFh 00FFFh 011FFh 011FFh Address 0WWWWh − − 03DFFh 03FFFh Figure 3.1 Memory Map of R8C/2A Group Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 20 of 60 R8C/2A Group, R8C/2B Group 3. Memory 3.2 R8C/2B Group Figure 3.2 is a Memory Map of R8C/2B Group. The R8C/2B group has 1 Mbyte of address space from addresses 00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a 48-Kbyte internal ROM area is allocated addresses 04000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine. The internal ROM (data flash) is allocated addresses 02400h to 02BFFh. The internal RAM area is allocated higher addresses, beginning with address 00400h. For example, a 2.5-Kbyte internal RAM is allocated addresses 00400h to 00DFFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged. Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users. 00000h SFR (Refer to 4. Special Function Registers (SFRs)) 002FFh 00400h Internal RAM 0XXXXh 02400h 02BFFh 03000h Internal ROM (data flash)(1) 0FFDCh Internal RAM 0WWWWh 0YYYYh Undefined instruction Overflow BRK instruction Address match Single step Watchdog timer, oscillation stop detection, voltage monitor Internal ROM (program ROM) 0FFFFh ZZZZZh FFFFFh Internal ROM (program ROM) Expanded area 0FFFFh (Reserved) (Reserved) Reset NOTES: 1. Data flash block A (1 Kbyte) and B (1 Kbyte) are shown. 2. The blank regions are reserved. Do not access locations in these regions. Internal ROM Size 48 Kbytes 64 Kbytes 96 Kbytes 128 Kbytes Address 0YYYYh 04000h 04000h 04000h 04000h Address ZZZZZh − 13FFFh 1BFFFh 23FFFh Size 2.5 Kbytes 3 Kbytes 7 Kbytes 7.5 Kbytes Internal RAM Address 0XXXXh 00DFFh 00FFFh 011FFh 011FFh Address 0WWWWh − − 03DFFh 03FFFh Figure 3.2 Memory Map of R8C/2B Group Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 21 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) 4. Special Function Registers (SFRs) An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.12 list the special function registers. Table 4.1 Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h 0007h 0008h 0009h 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h 0014h 0015h 0016h 0017h 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh 001Fh 0020h 0021h 0022h 0023h 0024h 0025h 0026h 0027h 0028h 0029h 002Ah 002Bh 002Ch 0030h 0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Eh 003Fh X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect this register. 3. The LVD0ON bit in the OFS register is set to 1 and hardware reset. 4. Power-on reset, voltage monitor 0 reset, or the LVD0ON bit in the OFS register is set to 0 and hardware reset. 5. Software reset, watchdog timer reset, voltage monitor 1 reset, or voltage monitor 2 reset do not affect b2 and b3. 6. The CSPROINI bit in the OFS register is set to 0. SFR Information (1)(1) Register Symbol After reset Processor Mode Register 0 Processor Mode Register 1 System Clock Control Register 0 System Clock Control Register 1 Module Operation Enable Register Protect Register Oscillation Stop Detection Register Watchdog Timer Reset Register Watchdog Timer Start Register Watchdog Timer Control Register Address Match Interrupt Register 0 PM0 PM1 CM0 CM1 MSTCR PRCR OCD WDTR WDTS WDC RMAD0 00h 00h 01101000b 00100000b 00h 00h 00000100b XXh XXh 00X11111b 00h 00h 00h 00h 00h 00h 00h Address Match Interrupt Enable Register Address Match Interrupt Register 1 AIER RMAD1 Count Source Protection Mode Register CSPR 00h 10000000b(6) High-Speed On-Chip Oscillator Control Register 0 High-Speed On-Chip Oscillator Control Register 1 High-Speed On-Chip Oscillator Control Register 2 FRA0 FRA1 FRA2 00h When shipping 00h Clock Prescaler Reset Flag CPSRF 00h High-Speed On-Chip Oscillator Control Register 6 High-Speed On-Chip Oscillator Control Register 7 FRA6 FRA7 When Shipping When Shipping Voltage Detection Register 1(2) Voltage Detection Register 2(2) VCA1 VCA2 00001000b 00h(3) 00100000b(4) Voltage Monitor 1 Circuit Control Register(5) Voltage Monitor 2 Circuit Control Register(5) Voltage Monitor 0 Circuit Control Register(2) VW1C VW2C VW0C 00001000b 00h 0000X000b(3) 0100X001b(4) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 22 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.2 Address 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh 0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h 0058h 0059h 005Ah 005Bh 005Ch 005Dh 005Eh 005Fh 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006Ah 006Bh 006Ch 006Dh 006Eh 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh SFR Information (2)(1) Register Symbol After reset Timer RC Interrupt Control Register Timer RD0 Interrupt Control Register Timer RD1 Interrupt Control Register Timer RE Interrupt Control Register UART2 Transmit Interrupt Control Register UART2 Receive Interrupt Control Register Key Input Interrupt Control Register SSU/IIC Interrupt Control Register(2) Compare 1 Interrupt Control Register UART0 Transmit Interrupt Control Register UART0 Receive Interrupt Control Register UART1 Transmit Interrupt Control Register UART1 Receive Interrupt Control Register INT2 Interrupt Control Register Timer RA Interrupt Control Register Timer RB Interrupt Control Register INT1 Interrupt Control Register INT3 Interrupt Control Register Timer RF Interrupt Control Register Compare 0 Interrupt Control Register INT0 Interrupt Control Register A/D Conversion Interrupt Control Register Capture Interrupt Control Register TRCIC TRD0IC TRD1IC TREIC S2TIC S2RIC KUPIC SSUIC / IICIC CMP1IC S0TIC S0RIC S1TIC S1RIC INT2IC TRAIC TRBIC INT1IC INT3IC TRFIC CMP0IC INT0IC ADIC CAPIC XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XXXXX000b XX00X000b XXXXX000b XXXXX000b XX00X000b XX00X000b XXXXX000b XXXXX000b XX00X000b XXXXX000b XXXXX000b X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. Selected by the IICSEL bit in the PMR register. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 23 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.3 Address 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h 0088h 0089h 008Ah 008Bh 008Ch 008Dh 008Eh 008Fh 0090h 0091h 0092h 0093h 0094h 0095h 0096h 0097h 0098h 0099h 009Ah 009Bh 009Ch 009Dh 009Eh 009Fh 00A0h 00A1h 00A2h 00A3h 00A4h 00A5h 00A6h 00A7h 00A8h 00A9h 00AAh 00ABh 00ACh 00ADh 00AEh 00AFh 00B0h 00B1h 00B2h 00B3h 00B4h 00B5h 00B6h 00B7h 00B8h 00B9h 00BAh 00BBh 00BCh 00BDh 00BEh 00BFh SFR Information (3)(1) Register Symbol After reset UART0 Transmit/Receive Mode Register UART0 Bit Rate Register UART0 Transmit Buffer Register UART0 Transmit/Receive Control Register 0 UART0 Transmit/Receive Control Register 1 UART0 Receive Buffer Register UART1 Transmit/Receive Mode Register UART1 Bit Rate Register UART1 Transmit Buffer Register UART1 Transmit/Receive Control Register 0 UART1 Transmit/Receive Control Register 1 UART1 Receive Buffer Register U0MR U0BRG U0TB U0C0 U0C1 U0RB U1MR U1BRG U1TB U1C0 U1C1 U1RB 00h XXh XXh XXh 00001000b 00000010b XXh XXh 00h XXh XXh XXh 00001000b 00000010b XXh XXh SS Control Register H / IIC bus Control Register 1(2) SS Control Register L / IIC bus Control Register 2(2) SS Mode Register / IIC bus Mode Register(2) SS Enable Register / IIC bus Interrupt Enable Register(2) SS Status Register / IIC bus Status Register(2) SS Mode Register 2 / Slave Address Register(2) SS Transmit Data Register / IIC bus Transmit Data Register(2) SS Receive Data Register / IIC bus Receive Data Register(2) SSCRH / ICCR1 SSCRL / ICCR2 SSMR / ICMR SSER / ICIER SSSR / ICSR SSMR2 / SAR SSTDR / ICDRT SSRDR / ICDRR 00h 01111101b 00011000b 00h 00h / 0000X000b 00h FFh FFh X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. Selected by the IICSEL bit in the PMR register. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 24 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.4 Address 00C0h 00C1h 00C2h 00C3h 00C4h 00C5h 00C6h 00C7h 00C8h 00C9h 00CAh 00CBh 00CCh 00CDh 00CEh 00CFh 00D0h 00D1h 00D2h 00D3h 00D4h 00D5h 00D6h 00D7h 00D8h 00D9h 00DAh 00DBh 00DCh 00DDh 00DEh 00DFh 00E0h 00E1h 00E2h 00E3h 00E4h 00E5h 00E6h 00E7h 00E8h 00E9h 00EAh 00EBh 00ECh 00EDh 00EEh 00EFh 00F0h 00F1h 00F2h 00F3h 00F4h 00F5h 00F6h 00F7h 00F8h 00F9h 00FAh 00FBh 00FCh 00FDh 00FEh 00FFh SFR Information (4)(1) Register Symbol After reset D/A Register 0 D/A Register 1 D/A Control Register DA0 DA1 DACON 00h 00h 00h Port P0 Register Port P1 Register Port P0 Direction Register Port P1 Direction Register Port P2 Register Port P3 Register Port P2 Direction Register Port P3 Direction Register Port P4 Register Port P5 Register Port P4 Direction Register Port P5 Direction Register Port P6 Register Port P6 Direction Register P0 P1 PD0 PD1 P2 P3 PD2 PD3 P4 P5 PD4 PD5 P6 PD6 XXh XXh 00h 00h XXh XXh 00h 00h XXh XXh 00h 00h XXh 00h Port P2 Drive Capacity Control Register UART1 Function Select Register P2DRR U1SR 00h 000000XXb Port Mode Register External Input Enable Register INT Input Filter Select Register Key Input Enable Register Pull-Up Control Register 0 Pull-Up Control Register 1 PMR INTEN INTF KIEN PUR0 PUR1 00h 00h 00h 00h 00h XX000000b X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 25 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.5 Address 0100h 0101h 0102h 0103h 0104h 0105h 0106h 0107h 0108h 0109h 010Ah 010Bh 010Ch 010Dh 010Eh 010Fh 0110h 0111h 0112h 0113h 0114h 0115h 0116h 0117h 0118h 0119h 011Ah 011Bh 011Ch 011Dh 011Eh 011Fh 0120h 0121h 0122h 0123h 0124h 0125h 0126h 0127h 0128h 0129h 012Ah 012Bh 012Ch 012Dh 012Eh 012Fh 0130h 0131h 0132h 0133h 0134h 0135h 0136h 0137h 0138h 0139h 013Ah 013Bh 013Ch 013Dh 013Eh 013Fh NOTE: 1. SFR Information (5)(1) Register Timer RA Control Register Timer RA I/O Control Register Timer RA Mode Register Timer RA Prescaler Register Timer RA Register LIN Control Register 2 LIN Control Register LIN Status Register Timer RB Control Register Timer RB One-Shot Control Register Timer RB I/O Control Register Timer RB Mode Register Timer RB Prescaler Register Timer RB Secondary Register Timer RB Primary Register Symbol TRACR TRAIOC TRAMR TRAPRE TRA LINCR2 LINCR LINST TRBCR TRBOCR TRBIOC TRBMR TRBPRE TRBSC TRBPR After reset 00h 00h 00h FFh FFh 00h 00h 00h 00h 00h 00h 00h FFh FFh FFh Timer RE Second Data Register / Counter Data Register Timer RE Minute Data Register / Compare Data Register Timer RE Hour Data Register Timer RE Day of Week Data Register Timer RE Control Register 1 Timer RE Control Register 2 Timer RE Clock Source Select Register Timer RC Mode Register Timer RC Control Register 1 Timer RC Interrupt Enable Register Timer RC Status Register Timer RC I/O Control Register 0 Timer RC I/O Control Register 1 Timer RC Counter Timer RC General Register A Timer RC General Register B Timer RC General Register C Timer RC General Register D Timer RC Control Register 2 Timer RC Digital Filter Function Select Register Timer RC Output Master Enable Register TRESEC TREMIN TREHR TREWK TRECR1 TRECR2 TRECSR TRCMR TRCCR1 TRCIER TRCSR TRCIOR0 TRCIOR1 TRC TRCGRA TRCGRB TRCGRC TRCGRD TRCCR2 TRCDF TRCOER 00h 00h 00h 00h 00h 00h 00001000b 01001000b 00h 01110000b 01110000b 10001000b 10001000b 00h 00h FFh FFh FFh FFh FFh FFh FFh FFh 00011111b 00h 01111111b Timer RD Start Register Timer RD Mode Register Timer RD PWM Mode Register Timer RD Function Control Register Timer RD Output Master Enable Register 1 Timer RD Output Master Enable Register 2 Timer RD Output Control Register Timer RD Digital Filter Function Select Register 0 Timer RD Digital Filter Function Select Register 1 TRDSTR TRDMR TRDPMR TRDFCR TRDOER1 TRDOER2 TRDOCR TRDDF0 TRDDF1 11111100b 00001110b 10001000b 10000000b FFh 01111111b 00h 00h 00h The blank regions are reserved. Do not access locations in these regions Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 26 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.6 Address 0140h 0141h 0142h 0143h 0144h 0145h 0146h 0147h 0148h 0149h 014Ah 014Bh 014Ch 014Dh 014Eh 014Fh 0150h 0151h 0152h 0153h 0154h 0155h 0156h 0157h 0158h 0159h 015Ah 015Bh 015Ch 015Dh 015Eh 015Fh 0160h 0161h 0162h 0163h 0164h 0165h 0166h 0167h 0168h 0169h 016Ah 016Bh 016Ch 016Dh 016Eh 016Fh 0170h 0171h 0172h 0173h 0174h 0175h 0176h 0177h 0178h 0179h 017Ah 017Bh 017Ch 017Dh 017Eh 017Fh SFR Information (6)(1) Register Timer RD Control Register 0 Timer RD I/O Control Register A0 Timer RD I/O Control Register C0 Timer RD Status Register 0 Timer RD Interrupt Enable Register 0 Timer RD PWM Mode Output Level Control Register 0 Timer RD Counter 0 Timer RD General Register A0 Timer RD General Register B0 Timer RD General Register C0 Timer RD General Register D0 Timer RD Control Register 1 Timer RD I/O Control Register A1 Timer RD I/O Control Register C1 Timer RD Status Register 1 Timer RD Interrupt Enable Register 1 Timer RD PWM Mode Output Level Control Register 1 Timer RD Counter 1 Timer RD General Register A1 Timer RD General Register B1 Timer RD General Register C1 Timer RD General Register D1 UART2 Transmit/Receive Mode Register UART2 Bit Rate Register UART2 Transmit Buffer Register UART2 Transmit/Receive Control Register 0 UART2 Transmit/Receive Control Register 1 UART2 Receive Buffer Register Symbol TRDCR0 TRDIORA0 TRDIORC0 TRDSR0 TRDIER0 TRDPOCR0 TRD0 TRDGRA0 TRDGRB0 TRDGRC0 TRDGRD0 TRDCR1 TRDIORA1 TRDIORC1 TRDSR1 TRDIER1 TRDPOCR1 TRD1 TRDGRA1 TRDGRB1 TRDGRC1 TRDGRD1 U2MR U2BRG U2TB U2C0 U2C1 U2RB After reset 00h 10001000b 10001000b 11000000b 11100000b 11111000b 00h 00h FFh FFh FFh FFh FFh FFh FFh FFh 00h 10001000b 10001000b 11000000b 11100000b 11111000b 00h 00h FFh FFh FFh FFh FFh FFh FFh FFh 00h XXh XXh XXh 00001000b 00000010b XXh XXh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 27 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.7 Address 0180h 0181h 0182h 0183h 0184h 0185h 0186h 0187h 0188h 0189h 018Ah 018Bh 018Ch 018Dh 018Eh 018Fh 0190h 0191h 0192h 0193h 0194h 0195h 0196h 0197h 0198h 0199h 019Ah 019Bh 019Ch 019Dh 019Eh 019Fh 01A0h 01A1h 01A2h 01A3h 01A4h 01A5h 01A6h 01A7h 01A8h 01A9h 01AAh 01ABh 01ACh 01ADh 01AEh 01AFh 01B0h 01B1h 01B2h 01B3h 01B4h 01B5h 01B6h 01B7h 01B8h 01B9h 01BAh 01BBh 01BCh 01BDh 01BEh 01BFh SFR Information (7)(1) Register Symbol After reset Flash Memory Control Register 4 Flash Memory Control Register 1 Flash Memory Control Register 0 FMR4 FMR1 FMR0 01000000b 1000000Xb 00000001b X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 28 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.8 Address 01C0h 01C1h 01C2h 01C3h 01C4h 01C5h 01C6h 01C7h 01C8h 01C9h 01CAh 01CBh 01CCh 01CDh 01CEh 01CFh 01D0h 01D1h 01D2h 01D3h 01D4h 01D5h 01D6h 01D7h 01D8h 01D9h 01DAh 01DBh 01DCh 01DDh 01DEh 01DFh 01E0h 01E1h 01E2h 01E3h 01E4h 01E5h 01E6h 01E7h 01E8h 01E9h 01EAh 01EBh 01ECh 01EDh 01EEh 01EFh 01F0h 01F1h 01F2h 01F3h 01F4h 01F5h 01F6h 01F7h 01F8h 01F9h 01FAh 01FBh 01FCh 01FDh 01FEh 01FFh NOTE: 1. SFR Information (8)(1) Register Symbol After reset The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 29 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.9 Address 0200h 0201h 0202h 0203h 0204h 0205h 0206h 0207h 0208h 0209h 020Ah 020Bh 020Ch 020Dh 020Eh 020Fh 0210h 0211h 0212h 0213h 0214h 0215h 0216h 0217h 0218h 0219h 021Ah 021Bh 021Ch 021Dh 021Eh 021Fh 0220h 0221h 0222h 0223h 0224h 0225h 0226h 0227h 0228h 0229h 022Ah 022Bh 022Ch 022Dh 022Eh 022Fh 0230h 0231h 0232h 0233h 0234h 0235h 0236h 0237h 0238h 0239h 023Ah 023Bh 023Ch 023Dh 023Eh 023Fh NOTE: 1. SFR Information (9)(1) Register Symbol After reset The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 30 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.10 Address 0240h 0241h 0242h 0243h 0244h 0245h 0246h 0247h 0248h 0249h 024Ah 024Bh 024Ch 024Dh 024Eh 024Fh 0250h 0251h 0252h 0253h 0254h 0255h 0256h 0257h 0258h 0259h 025Ah 025Bh 025Ch 025Dh 025Eh 025Fh 0260h 0261h 0262h 0263h 0264h 0265h 0266h 0267h 0268h 0269h 026Ah 026Bh 026Ch 026Dh 026Eh 026Fh 0270h 0271h 0272h 0273h 0274h 0275h 0276h 0277h 0278h 0279h 027Ah 027Bh 027Ch 027Dh 027Eh 027Fh NOTE: 1. SFR Information (10)(1) Register Symbol After reset The blank regions are reserved. Do not access locations in these regions. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 31 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.11 Address 0280h 0281h 0282h 0283h 0284h 0285h 0286h 0287h 0288h 0289h 028Ah 028Bh 028Ch 028Dh 028Eh 028Fh 0290h 0291h 0292h 0293h 0294h 0295h 0296h 0297h 0298h 0299h 029Ah 029Bh 029Ch 029Dh 029Eh 029Fh 02A0h 02A1h 02A2h 02A3h 02A4h 02A5h 02A6h 02A7h 02A8h 02A9h 02AAh 02ABh 02ACh 02ADh 02AEh 02AFh 02B0h 02B1h 02B2h 02B3h 02B4h 02B5h 02B6h 02B7h 02B8h 02B9h 02BAh 02BBh 02BCh 02BDh 02BEh 02BFh SFR Information (11)(1) Register Symbol After reset Timer RF Register TRF 00h 00h Timer RF Control Register 0 Timer RF Control Register 1 Capture / Compare 0 Register Compare 1 Register TRFCR0 TRFCR1 TRFM0 TRFM1 00h 00h 0000h(2) FFFFh(3) FFh FFh NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. After input capture mode. 3. After output compare mode. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 32 of 60 R8C/2A Group, R8C/2B Group 4. Special Function Registers (SFRs) Table 4.12 Address 02C0h 02C1h 02C2h 02C3h 02C4h 02C5h 02C6h 02C7h 02C8h 02C9h 02CAh 02CBh 02CCh 02CDh 02CEh 02CFh 02D0h 02D1h 02D2h 02D3h 02D4h 02D5h 02D6h 02D7h 02D8h 02D9h 02DAh 02DBh 02DCh 02DDh 02DEh 02DFh 02E0h 02E1h 02E2h 02E3h 02E4h 02E5h 02E6h 02E7h 02E8h 02E9h 02EAh 02EBh 02ECh 02EDh 02EEh 02EFh 02F0h 02F1h 02F2h 02F3h 02F4h 02F5h 02F6h 02F7h 02F8h 02F9h 02FAh 02FBh 02FCh 02FDh 02FEh 02FFh FFFFh SFR Information (12)(1) Register A/D Register 0 AD0 Symbol XXh XXh After reset A/D Control Register 2 A/D Control Register 0 A/D Control Register 1 ADCON2 ADCON0 ADCON1 00001000b 00000011b 00h Port P8 Direction Register Port P8 Register PD8 P8 00h XXh Pull-Up Control Register 2 PUR2 XXX00000b Timer RF Output Control Register Option Function Select Register TRFOUT OFS 00h (Note 2) X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. The OFS register cannot be changed by a program. Use a flash programmer to write to it. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 33 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics 5. Electrical Characteristics The electrical characteristics of N version (Topr = –20°C to 85°C) and D version (Topr = –40°C to 85°C) are listed below. Please contact Renesas Technology sales offices for the electrical characteristics in the Y version (Topr = –20°C to 105°C). Table 5.1 Symbol VCC/AVCC VI VO Pd Topr Tstg Supply voltage Input voltage Output voltage Power dissipation Operating ambient temperature Storage temperature Topr = 25°C Absolute Maximum Ratings Parameter Condition Rated Value -0.3 to 6.5 -0.3 to VCC + 0.3 -0.3 to VCC + 0.3 700 -20 to 85 (N version) / -40 to 85 (D version) -65 to 150 Unit V V V mW °C °C Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 34 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.2 Symbol VCC/AVCC VSS/AVSS VIH VIL IOH(sum) IOH(sum) IOH(peak) IOH(avg) IOL(sum) IOL(sum) IOL(peak) IOL(avg) f(XIN) Recommended Operating Conditions Parameter Supply voltage Supply voltage Input “H” voltage Input “L” voltage Peak sum output “H” current Average sum output “H” current Peak output “H” current Average output “H” current Peak sum output “L” current Average sum output “L” current Peak output “L” current Average output “L” current Sum of all pins IOH(peak) Sum of all pins IOH(avg) Except P2_0 to P2_7 P2_0 to P2_7 Except P2_0 to P2_7 P2_0 to P2_7 Sum of all pins IOL(peak) Sum of all pins IOL(avg) Except P2_0 to P2_7 P2_0 to P2_7 Except P2_0 to P2_7 P2_0 to P2_7 3.0 V ≤ VCC ≤ 5.5 V 2.7 V ≤ VCC < 3.0 V 2.2 V ≤ VCC < 2.7 V Conditions Standard Min. 2.2 − 0.8 VCC 0 − − − − − − − − − − − − 0 0 0 0 0 0 0 − Typ. − 0 − − − − − − − − − − − − − − − − − − − − − 125 Max. 5.5 − VCC 0.2 VCC −240 −120 -10 -40 -5 -20 240 120 10 40 5 20 20 10 5 70 20 10 5 − Unit V V V V mA mA mA mA mA mA mA mA mA mA mA mA MHz MHz MHz kHz MHz MHz MHz kHz XIN clock input oscillation frequency f(XCIN) − XCIN clock input oscillation frequency System clock OCD2 = 0 XlN clock selected OCD2 = 1 On-chip oscillator clock selected 2.2 V ≤ VCC ≤ 5.5 V 3.0 V ≤ VCC ≤ 5.5 V 2.7 V ≤ VCC < 3.0 V 2.2 V ≤ VCC < 2.7 V FRA01 = 0 Low-speed on-chip oscillator clock selected FRA01 = 1 High-speed on-chip oscillator clock selected 3.0 V ≤ VCC ≤ 5.5 V FRA01 = 1 High-speed on-chip oscillator clock selected 2.7 V ≤ VCC ≤ 5.5 V FRA01 = 1 High-speed on-chip oscillator clock selected 2.2 V ≤ VCC ≤ 5.5 V − − 20 MHz − − 10 MHz − − 5 MHz NOTES: 1. VCC = 2.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. The average output current indicates the average value of current measured during 100 ms. P0 P1 P2 P3 P4 P5 P6 P8 30pF Figure 5.1 Ports P0 to P6, P8 Timing Measurement Circuit Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 35 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.3 Symbol − − A/D Converter Characteristics(1) Parameter Resolution Absolute accuracy 10-bit mode 8-bit mode 10-bit mode 8-bit mode 10-bit mode 8-bit mode Vref = AVCC φAD = 10 MHz, Vref = AVCC = 5.0 V φAD = 10 MHz, Vref = AVCC = 5.0 V φAD = 10 MHz, Vref = AVCC = 3.3 V φAD = 10 MHz, Vref = AVCC = 3.3 V φAD = 5 MHz, Vref = AVCC = 2.2 V φAD = 5 MHz, Vref = AVCC = 2.2 V Vref = AVCC φAD = 10 MHz, Vref = AVCC = 5.0 V φAD = 10 MHz, Vref = AVCC = 5.0 V 8-bit mode Conditions Standard Min. − − − − − − − 10 3.3 2.8 2.2 0 Vref = AVCC = 2.7 to 5.5 V Vref = AVCC = 2.7 to 5.5 V Vref = AVCC = 2.2 to 5.5 V Vref = AVCC = 2.2 to 5.5 V 0.25 1 0.25 1 Without sample and hold With sample and hold Without sample and hold With sample and hold Typ. − − − − − − − − − − − − − − − − Max. 10 ±3 ±2 ±5 ±2 ±5 ±2 40 − − AVCC AVCC 10 10 5 5 Unit Bit LSB LSB LSB LSB LSB LSB kΩ µs µs V V MHz MHz MHz MHz Rladder tconv Vref VIA − Resistor ladder Conversion time 10-bit mode Reference voltage Analog input voltage(2) A/D operating clock frequency NOTES: 1. VCC/AVCC = Vref = 2.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in 8-bit mode. Table 5.4 Symbol − − tsu RO IVref D/A Converter Characteristics(1) Parameter Resolution Absolute accuracy Setup time Output resistor Reference power input current (NOTE 2) Conditions Standard Min. − − − 4 − Typ. − − − 10 − Max. 8 1.0 3 20 1.5 Unit Bit % µs kΩ mA NOTES: 1. VCC/AVCC = Vref = 2.7 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. This applies when one D/A converter is used and the value of the DAi register (i = 0 or 1) for the unused D/A converter is 00h. The resistor ladder of the A/D converter is not included. Also, even if the VCUT bit in the ADCON1 register is set to 0 (VREF not connected), IVref flows into the D/A converters. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 36 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.5 Symbol − − − td(SR-SUS) − − − − − − − Flash Memory (Program ROM) Electrical Characteristics Parameter Program/erase endurance(2) Byte program time Block erase time Time delay from suspend request until suspend Interval from erase start/restart until following suspend request Interval from program start/restart until following suspend request Time from suspend until program/erase restart Program, erase voltage Read voltage Program, erase temperature Data hold time(7) Ambient temperature = 55°C Conditions R8C/2A Group R8C/2B Group Standard Min. 100(3) 1,000(3) − − − 650 0 − 2.7 2.2 0 20 Typ. − − 50 0.4 − − − − − − − − Max. − − 400 9 97+CPU clock × 6 cycles − − 3+CPU clock × 4 cycles 5.5 5.5 60 − Unit times times µs s µs µs ns µs V V °C year NOTES: 1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified. 2. Definition of programming/erasure endurance The programming and erasure endurance is defined on a per-block basis. If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024 1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance still stands at one. However, the same address must not be programmed more than once per erase operation (overwriting prohibited). 3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the number of erase operations to a certain number. 5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative. 7. The data hold time includes time that the power supply is off or the clock is not supplied. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 37 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.6 Symbol − − − − − td(SR-SUS) − − − − − − − Flash Memory (Data flash Block A, Block B) Electrical Characteristics(4) Parameter Program/erase endurance(2) Byte program time (program/erase endurance ≤ 1,000 times) Byte program time (program/erase endurance > 1,000 times) Block erase time (program/erase endurance ≤ 1,000 times) Block erase time (program/erase endurance > 1,000 times) Time delay from suspend request until suspend Interval from erase start/restart until following suspend request Interval from program start/restart until following suspend request Time from suspend until program/erase restart Program, erase voltage Read voltage Program, erase temperature Data hold time(9) Ambient temperature = 55 °C Conditions Standard Min. 10,000(3) − − − − − 650 0 − 2.7 2.2 -20(8) 20 Typ. − 50 65 0.2 0.3 − − − − − − − − Max. − 400 − 9 − 97+CPU clock × 6 cycles − − 3+CPU clock × 4 cycles 5.5 5.5 85 − Unit times µs µs s s µs µs ns µs V V °C year NOTES: 1. VCC = 2.7 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. Definition of programming/erasure endurance The programming and erasure endurance is defined on a per-block basis. If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024 1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance still stands at one. However, the same address must not be programmed more than once per erase operation (overwriting prohibited). 3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 4. Standard of block A and block B when program and erase endurance exceeds 1,000 times. Byte program time to 1,000 times is the same as that in program ROM. 5. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the number of erase operations to a certain number. 6. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 7. Customers desiring program/erase failure rate information should contact their Renesas technical support representative. 8. -40°C for D version. 9. The data hold time includes time that the power supply is off or the clock is not supplied. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 38 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Suspend request (maskable interrupt request) FMR46 Fixed time Clock-dependent time Access restart td(SR-SUS) Figure 5.2 Time delay until Suspend Table 5.7 Symbol Vdet0 − td(E-A) Vccmin Voltage Detection 0 Circuit Electrical Characteristics Parameter Voltage detection level Voltage detection circuit self power consumption Waiting time until voltage detection circuit operation starts(2) MCU operating voltage minimum value VCA25 = 1, VCC = 5.0 V Condition Standard Min. 2.2 − − 2.2 Typ. 2.3 0.9 − − Max. 2.4 − 300 − Unit V µA µs V NOTES: 1. The measurement condition is VCC = 2.2 V to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version). 2. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2 register to 0. Table 5.8 Symbol Vdet1 − − td(E-A) Voltage Detection 1 Circuit Electrical Characteristics Parameter Voltage detection level Voltage monitor 1 interrupt request generation time(2) Voltage detection circuit self power consumption Waiting time until voltage detection circuit operation starts(3) VCA26 = 1, VCC = 5.0 V Condition Standard Min. 2.70 − − − Typ. 2.85 40 0.6 − Max. 3.00 − − 100 Unit V µs µA µs NOTES: 1. The measurement condition is VCC = 2.2 V to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version). 2. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1. 3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2 register to 0. Table 5.9 Symbol Vdet2 − − td(E-A) Voltage Detection 2 Circuit Electrical Characteristics Parameter Voltage detection level Voltage monitor 2 interrupt request generation time(2) VCA27 = 1, VCC = 5.0 V Voltage detection circuit self power consumption Waiting time until voltage detection circuit operation starts(3) Condition Standard Min. 3.3 − − − Typ. 3.6 40 0.6 − Max. 3.9 − − 100 Unit V µs µA µs NOTES: 1. The measurement condition is VCC = 2.2 V to 5.5 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version). 2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2. 3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2 register to 0. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 39 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.10 Symbol Vpor1 Vpor2 trth Power-on Reset Circuit, Voltage Monitor 0 Reset Electrical Characteristics(3) Parameter Power-on reset valid voltage(4) Power-on reset or voltage monitor 0 reset valid voltage External power VCC rise gradient(2) Condition Standard Min. − 0 20 Typ. − − − Max. 0.1 Vdet0 − Unit V V mV/msec NOTES: 1. The measurement condition is Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. This condition (external power VCC rise gradient) does not apply if VCC ≥ 1.0 V. 3. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVD0ON bit in the OFS register to 0, the VW0C0 and VW0C6 bits in the VW0C register to 1 respectively, and the VCA25 bit in the VCA2 register to 1. 4. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if −20°C ≤ Topr ≤ 85°C, maintain tw(por1) for 3,000 s or more if −40°C ≤ Topr < −20°C. Vdet0(3) 2.2V External Power VCC Vpor1 tw(por1) Sampling time(1, 2) trth Vpor2 trth Vdet0(3) Internal reset signal (“L” valid) 1 × 32 fOCO-S 1 × 32 fOCO-S NOTES: 1. When using the voltage monitor 0 digital filter, ensure that the voltage is within the MCU operation voltage range (2.2 V or above) during the sampling time. 2. The sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details. 3. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection Circuit of Hardware Manual for details. Figure 5.3 Power-on Reset Circuit Electrical Characteristics Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 40 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.11 Symbol fOCO40M High-speed On-Chip Oscillator Circuit Electrical Characteristics Parameter High-speed on-chip oscillator frequency temperature • supply voltage dependence Condition VCC = 2.7 V to 5.5 V −20°C ≤ Topr ≤ 85°C(2) VCC = 2.7 V to 5.5 V −40°C ≤ Topr ≤ 85°C(2) VCC = 2.2 V to 5.5 V −20°C ≤ Topr ≤ 85°C(3) VCC = 2.2 V to 5.5 V −40°C ≤ Topr ≤ 85°C(3) High-speed on-chip oscillator frequency when correction value in FRA7 register is written to FRA1 register VCC = 5.0 V, Topr = 25°C VCC = 2.7 V to 5.5 V −20°C ≤ Topr ≤ 85°C Adjust FRA1 register (value after reset) to -1 VCC = 5.0 V, Topr = 25°C VCC = 5.0 V, Topr = 25°C Standard Min. 39.2 39.0 35.2 34.0 − −3% 08h − − − Typ. 40 40 40 40 36.864 − − +0.3 10 550 Max. 40.8 41.0 44.8 46.0 − 3% F7h − 100 − Unit MHz MHz MHz MHz MHz % − MHz µs µA − − − − Value in FRA1 register after reset Oscillation frequency adjustment unit of highspeed on-chip oscillator Oscillation stability time Self power consumption at oscillation NOTES: 1. VCC = 2.2 to 5.5 V, Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. These standard values show when the FRA1 register value after reset is assumed. 3. These standard values show when the correction value in the FRA6 register is written to the FRA1 register. Table 5.12 Symbol fOCO-S − − Low-speed On-Chip Oscillator Circuit Electrical Characteristics Parameter Low-speed on-chip oscillator frequency Oscillation stability time Self power consumption at oscillation VCC = 5.0 V, Topr = 25°C VCC = 5.0 V, Topr = 25°C Condition Standard Min. 30 − − Typ. 125 10 15 Max. 250 100 − Unit kHz µs µA NOTE: 1. VCC = 2.2 to 5.5 V, Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. Table 5.13 Symbol td(P-R) td(R-S) Power Supply Circuit Timing Characteristics Parameter Time for internal power supply stabilization during power-on(2) STOP exit time(3) Condition Standard Min. 1 − Typ. − − Max. 2000 150 Unit µs µs NOTES: 1. The measurement condition is VCC = 2.2 to 5.5 V and Topr = 25°C. 2. Waiting time until the internal power supply generation circuit stabilizes during power-on. 3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 41 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.14 Symbol tSUCYC tHI tLO tRISE tFALL tSU tH tLEAD tLAG tOD tSA tOR Timing Requirements of Clock Synchronous Serial I/O with Chip Select(1) Parameter SSCK clock cycle time SSCK clock “H” width SSCK clock “L” width SSCK clock rising time SSCK clock falling time Master Slave Master Slave Conditions Standard Min. 4 0.4 0.4 − − − − 100 1 1tCYC + 50 1tCYC + 50 − 2.7 V ≤ VCC ≤ 5.5 V 2.2 V ≤ VCC < 2.7 V SSI slave out open time 2.7 V ≤ VCC ≤ 5.5 V 2.2 V ≤ VCC < 2.7 V − − − − Typ. − − − − − − − − − − − − − − − − Max. − 0.6 0.6 1 1 1 1 − − − − 1 1.5tCYC + 100 1.5tCYC + 200 1.5tCYC + 100 1.5tCYC + 200 Unit tCYC(2) tSUCYC tSUCYC tCYC(2) µs tCYC(2) µs ns tCYC(2) ns ns tCYC(2) ns ns ns ns SSO, SSI data input setup time SSO, SSI data input hold time SCS setup time SCS hold time SSI slave access time Slave Slave SSO, SSI data output delay time NOTES: 1. VCC = 2.2 to 5.5 V, VSS = 0 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. 1tCYC = 1/f1(s) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 42 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics 4-Wire Bus Communication Mode, Master, CPHS = 1 VIH or VOH SCS (output) VIH or VOH tHI tFALL tRISE SSCK (output) (CPOS = 1) tLO tHI SSCK (output) (CPOS = 0) tLO tSUCYC SSO (output) tOD SSI (input) tSU tH 4-Wire Bus Communication Mode, Master, CPHS = 0 VIH or VOH SCS (output) VIH or VOH tHI tFALL tRISE SSCK (output) (CPOS = 1) tLO tHI SSCK (output) (CPOS = 0) tLO tSUCYC SSO (output) tOD SSI (input) tSU tH CPHS, CPOS: Bits in SSMR register Figure 5.4 I/O Timing of Clock Synchronous Serial I/O with Chip Select (Master) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 43 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics 4-Wire Bus Communication Mode, Slave, CPHS = 1 VIH or VOH SCS (input) VIH or VOH tLEAD tHI tFALL tRISE tLAG SSCK (input) (CPOS = 1) tLO tHI SSCK (input) (CPOS = 0) tLO tSUCYC SSO (input) tSU tH SSI (output) tSA tOD tOR 4-Wire Bus Communication Mode, Slave, CPHS = 0 SCS (input) VIH or VOH VIH or VOH tLEAD tHI tFALL tRISE tLAG SSCK (input) (CPOS = 1) tLO tHI SSCK (input) (CPOS = 0) tLO tSUCYC SSO (input) tSU tH SSI (output) tSA tOD tOR CPHS, CPOS: Bits in SSMR register Figure 5.5 I/O Timing of Clock Synchronous Serial I/O with Chip Select (Slave) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 44 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics tHI VIH or VOH SSCK VIH or VOH tLO tSUCYC SSO (output) tOD SSI (input) tSU tH Figure 5.6 I/O Timing of Clock Synchronous Serial I/O with Chip Select (Clock Synchronous Communication Mode) Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 45 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.15 Symbol tSCL tSCLH tSCLL tsf tSP tBUF tSTAH tSTAS tSTOP tSDAS tSDAH Timing Requirements of I2C bus Interface (1) Parameter SCL input cycle time SCL input “H” width SCL input “L” width SCL, SDA input fall time SCL, SDA input spike pulse rejection time SDA input bus-free time Start condition input hold time Retransmit start condition input setup time Stop condition input setup time Data input setup time Data input hold time Condition Standard Typ. (2) − 12tCYC + 600 (2) − 3tCYC + 300 Min. 5tCYC + 500(2) − − 5tCYC(2) 3tCYC(2) 3tCYC(2) 3tCYC(2) 1tCYC + 20(2) 0 − − − − − − − − − Max. − − − Unit ns ns ns ns ns ns ns ns ns ns ns 300 1tCYC(2) − − − − − − NOTES: 1. VCC = 2.2 to 5.5 V, VSS = 0 V and Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified. 2. 1tCYC = 1/f1(s) VIH SDA VIL tBUF tSTAH tSCLH tSTAS tSP tSTOP SCL P(2) S(1) tsf tSCLL tSCL Sr(3) tsr tSDAH tSDAS P(2) NOTES: 1. Start condition 2. Stop condition 3. Retransmit start condition Figure 5.7 I/O Timing of I2C bus Interface Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 46 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.16 Symbol VOH Electrical Characteristics (1) [VCC = 5 V] Parameter Condition IOH = -5 mA IOH = -200 µA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW IOL = 5 mA IOL = 200 µA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW Standard Min. Typ. VCC − 2.0 − VCC − 0.5 − VCC − 2.0 − VCC − 2.0 − VCC − 2.0 − VCC − 2.0 − − − − − − − − − − − − − 0.1 0.5 Max. VCC VCC VCC VCC VCC VCC 2.0 0.45 2.0 2.0 2.0 2.0 − Unit V V V V V V V V V V V V V Output “H” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 XOUT IOH = -20 mA IOH = -5 mA IOH = -1 mA IOH = -500 µA VOL Output “L” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 XOUT IOL = 20 mA IOL = 5 mA IOL = 1 mA IOL = 500 µA VT+-VT- Hysteresis INT0, INT1, INT2, INT3, KI0, KI1, KI2, KI3, TRAIO, TRFI, RXD0, RXD1, CLK0, CLK1, CLK2, SSI, SCL, SDA, SSO RESET VI = 5 V VI = 0 V VI = 0 V XIN XCIN During stop mode 0.1 − − 30 − − 1.0 − − 50 1.0 − V µA µA kΩ MΩ IIH IIL RPULLUP RfXIN RfXCIN VRAM Input “H” current Input “L” current Pull-up resistance Feedback resistance Feedback resistance RAM hold voltage 5.0 -5.0 167 − − − 18 − MΩ V 1.8 NOTE: 1. VCC = 4.2 to 5.5 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 20 MHz, unless otherwise specified. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 47 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.17 Symbol ICC Electrical Characteristics (2) [Vcc = 5 V] (Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.) Parameter Condition XIN = 20 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division XIN = 16 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division XIN = 20 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN = 16 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz No division XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8, FMR47 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz FMR47 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz Program operation on RAM Flash memory off, FMSTP = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock operation VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock off VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (high drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (low drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off, Topr = 25°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 XIN clock off, Topr = 85°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 Power supply High-speed current clock mode (VCC = 3.3 to 5.5 V) Single-chip mode, output pins are open, other pins are VSS Min. − − − − − − − − − Standard Typ. Max. 12 20 Unit mA 10 16 − − − − mA 7 mA 5.5 mA 4.5 mA 3 mA High-speed on-chip oscillator mode 6 12 − mA 2.5 mA µA Low-speed on-chip oscillator mode Low-speed clock mode 150 400 − 150 400 µA − 35 − µA Wait mode − 30 90 µA − 18 55 µA − 3.5 − µA − 2.3 − µA Stop mode − 0.7 3.0 µA − 1.7 − µA Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 48 of 60 R8C/2A Group, R8C/2B Group Timing Requirements (Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C) [VCC = 5 V] Table 5.18 Symbol tc(XIN) tWH(XIN) tWL(XIN) tc(XCIN) tWH(XCIN) tWL(XCIN) XIN input cycle time XIN input “H” width XIN input “L” width XCIN input cycle time XCIN input “H” width XCIN input “L” width 5. Electrical Characteristics XIN Input, XCIN Input Parameter Standard Min. Max. 50 − 25 − 25 − 14 − 7 − 7 − Unit ns ns ns µs µs µs tC(XIN) tWH(XIN) VCC = 5 V XIN input tWL(XIN) Figure 5.8 Table 5.19 Symbol tc(TRAIO) tWH(TRAIO) tWL(TRAIO) XIN Input and XCIN Input Timing Diagram when VCC = 5 V TRAIO Input, INT1 Input Parameter TRAIO input cycle time TRAIO input “H” width TRAIO input “L” width Standard Min. Max. 100 − 40 − 40 − Unit ns ns ns tC(TRAIO) tWH(TRAIO) VCC = 5 V TRAIO input tWL(TRAIO) Figure 5.9 Table 5.20 Symbol tc(TRFI) tWH(TRFI) tWL(TRFI) TRAIO Input and INT1 Input Timing Diagram when VCC = 5 V TRFI Input Parameter TRFI input cycle time TRFI input “H” width TRFI input “L” width Standard Min. Max. − 400(1) 200(2) 200(2) − − Unit ns ns ns NOTES: 1. When using timer RF input capture mode, adjust the cycle time to (1/timer RF count source frequency × 3) or above. 2. When using timer RF input capture mode, adjust the pulse width to (1/timer RF count source frequency × 1.5) or above. tc(TRFI) tWH(TRFI) TRFI input tWL(TRFI) VCC = 5 V Figure 5.10 TRFI Input Timing Diagram when VCC = 5 V Page 49 of 60 Rev.2.10 Nov 26, 2007 REJ03B0182-0210 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.21 Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) i = 0 to 2 Serial Interface Parameter CLKi input cycle time CLKi input “H” width CLKi input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Standard Min. Max. 200 − 100 − 100 − − 50 0 − 50 − 90 − Unit ns ns ns ns ns ns ns tC(CK) tW(CKH) VCC = 5 V CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0 to 2 Figure 5.11 Serial Interface Timing Diagram when VCC = 5 V Table 5.22 Symbol tW(INH) tW(INL) External Interrupt INTi (i = 0, 2, 3) Input Parameter INT0 input “H” width INT0 input “L” width Standard Min. Max. − 250(1) 250(2) − Unit ns ns NOTES: 1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. 2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. VCC = 5 V tW(INL) INTi input tW(INH) i = 0, 2, 3 Figure 5.12 External Interrupt INTi Input Timing Diagram when VCC = 5 V Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 50 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.23 Symbol VOH Electrical Characteristics (3) [VCC = 3 V] Parameter Condition IOH = -1 mA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW IOL = 1 mA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW IOH = -5 mA IOH = -1 mA IOH = -0.1 mA IOH = -50 µA Standard Min. Typ. VCC − 0.5 − VCC − 0.5 VCC − 0.5 VCC − 0.5 VCC − 0.5 − − − − − − − − − − Output “H” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 Max. VCC VCC VCC VCC VCC 0.5 0.5 0.5 0.5 0.5 − Unit V V V V V V V V V V V XOUT VOL Output “L” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 IOL = 5 mA IOL = 1 mA IOL = 0.1 mA IOL = 50 µA − − − − XOUT VT+-VT- Hysteresis INT0, INT1, INT2, INT3, KI0, KI1, KI2, KI3, TRAIO, TRFI, RXD0, RXD1, CLK0, CLK1, CLK2, SSI, SCL, SDA, SSO RESET VI = 3 V VI = 0 V VI = 0 V XIN XCIN During stop mode 0.1 0.3 0.1 − − 66 − − 1.8 0.4 − − 160 3.0 18 − − V µA µA kΩ MΩ MΩ V IIH IIL RPULLUP RfXIN RfXCIN VRAM Input “H” current Input “L” current Pull-up resistance Feedback resistance Feedback resistance RAM hold voltage 4.0 -4.0 500 − − − NOTE: 1. VCC =2.7 to 3.3 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 10 MHz, unless otherwise specified. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 51 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.24 Electrical Characteristics (4) [Vcc = 3 V] (Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.) Parameter Condition XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz No division XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8, FMR47 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz FMR47 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz Program operation on RAM Flash memory off, FMSTP = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock operation VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock off VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (high drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (low drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off, Topr = 25°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 XIN clock off, Topr = 85°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 Min. − Standard Typ. Max. 5.5 − Unit mA Symbol ICC Power supply current High-speed (VCC = 2.7 to 3.3 V) clock mode Single-chip mode, output pins are open, other pins are VSS − 2 − mA High-speed on-chip oscillator mode − 5.5 11 mA − 2.2 − mA Low-speed on-chip oscillator mode Low-speed clock mode − 145 400 µA − 145 400 µA − 30 − µA Wait mode − 28 85 µA − 17 50 µA − 3.3 − µA − 2.1 − µA Stop mode − 0.65 3.0 µA − 1.65 − µA Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 52 of 60 R8C/2A Group, R8C/2B Group Timing requirements (Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C) [VCC = 3 V] Table 5.25 Symbol tc(XIN) tWH(XIN) tWL(XIN) tc(XCIN) tWH(XCIN) tWL(XCIN) XIN input cycle time XIN input “H” width XIN input “L” width XCIN input cycle time XCIN input “H” width XCIN input “L” width 5. Electrical Characteristics XIN Input, XCIN Input Parameter Standard Min. Max. 100 − 40 − 40 − 14 − 7 − 7 − Unit ns ns ns µs µs µs tC(XIN) tWH(XIN) VCC = 3 V XIN input tWL(XIN) Figure 5.13 Table 5.26 Symbol tc(TRAIO) tWH(TRAIO) tWL(TRAIO) XIN Input and XCIN Input Timing Diagram when VCC = 3 V TRAIO Input, INT1 Input Parameter TRAIO input cycle time TRAIO input “H” width TRAIO input “L” width Standard Min. Max. 300 − 120 − 120 − Unit ns ns ns tC(TRAIO) tWH(TRAIO) VCC = 3 V TRAIO input tWL(TRAIO) Figure 5.14 Table 5.27 Symbol tc(TRFI) tWH(TRFI) tWL(TRFI) TRAIO Input and INT1 Input Timing Diagram when VCC = 3 V TRFI Input Parameter TRFI input cycle time TRFI input “H” width TRFI input “L” width Standard Min. Max. − 1200(1) 600(2) 600(2) − − Unit ns ns ns NOTES: 1. When using timer RF input capture mode, adjust the cycle time to (1/timer RF count source frequency × 3) or above. 2. When using timer RF input capture mode, adjust the pulse width to (1/timer RF count source frequency × 1.5) or above. tc(TRFI) tWH(TRFI) TRFI input tWL(TRFI) VCC = 3 V Figure 5.15 TRFI Input Timing Diagram when VCC = 3 V Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 53 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.28 Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) i = 0 to 2 Serial Interface Parameter CLKi input cycle time CLKi input “H” width CLKi Input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Standard Min. Max. 300 − 150 − 150 − − 80 0 − 70 − 90 − Unit ns ns ns ns ns ns ns tC(CK) tW(CKH) VCC = 3 V CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0 to 2 Figure 5.16 Serial Interface Timing Diagram when VCC = 3 V Table 5.29 Symbol tW(INH) tW(INL) External Interrupt INTi (i = 0, 2, 3) Input Parameter INT0 input “H” width INT0 input “L” width Standard Min. Max. − 380(1) 380(2) − Unit ns ns NOTES: 1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. 2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. VCC = 3 V tW(INL) INTi input tW(INH) i = 0, 2, 3 Figure 5.17 External Interrupt INTi Input Timing Diagram when VCC = 3 V Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 54 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.30 Symbol VOH Electrical Characteristics (5) [VCC = 2.2 V] Parameter Condition IOH = -1 mA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW IOL = 1 mA Drive capacity HIGH Drive capacity LOW Drive capacity HIGH Drive capacity LOW IOH = -2 mA IOH = -1 mA IOH = -0.1 mA IOH = -50 µA Min. VCC - 0.5 VCC - 0.5 VCC - 0.5 VCC - 0.5 VCC - 0.5 − Output “H” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 Standard Typ. − − − − − − − − − − Max. VCC VCC VCC VCC VCC 0.5 0.5 0.5 0.5 0.5 − Unit V V V V V V V V V V V XOUT VOL Output “L” voltage Except P2_0 to P2_7, XOUT P2_0 to P2_7 IOL = 2 mA IOL = 1 mA IOL = 0.1 mA IOL = 50 µA − − − − XOUT VT+-VT- Hysteresis INT0, INT1, INT2, INT3, KI0, KI1, KI2, KI3, TRAIO, TRFI, RXD0, RXD1, CLK0, CLK1, CLK2, SSI, SCL, SDA, SSO RESET VI = 2.2 V VI = 0 V VI = 0 V XIN XCIN During stop mode 0.05 0.3 0.05 − − 100 − − 1.8 0.15 − − 200 5 35 − − V µA µA kΩ MΩ MΩ V IIH IIL RPULLUP RfXIN RfXCIN VRAM Input “H” current Input “L” current Pull-up resistance Feedback resistance Feedback resistance RAM hold voltage 4.0 -4.0 600 − − − NOTE: 1. VCC = 2.2 V at Topr = -20 to 85°C (N version) / -40 to 85°C (D version), f(XIN) = 5 MHz, unless otherwise specified. Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 55 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.31 Electrical Characteristics (6) [Vcc = 2.2 V] (Topr = -20 to 85°C (N version) / -40 to 85°C (D version), unless otherwise specified.) Parameter Condition XIN = 5 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division XIN = 5 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 High-speed XIN clock off High-speed on-chip oscillator on fOCO = 5 MHz on-chip Low-speed on-chip oscillator on = 125 kHz oscillator No division mode XIN clock off High-speed on-chip oscillator on fOCO = 5 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 Low-speed on- XIN clock off chip oscillator High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz mode Divide-by-8, FMR47 = 1 Low-speed XIN clock off High-speed on-chip oscillator off clock mode Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz FMR47 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz Program operation on RAM Flash memory off, FMSTP = 1 Wait mode XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock operation VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock off VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (high drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator off XCIN clock oscillator on = 32 kHz (low drive) While a WAIT instruction is executed VCA27 = VCA26 = VCA25 = 0 VCA20 = 1 Stop mode XIN clock off, Topr = 25°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 XIN clock off, Topr = 85°C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = VCA25 = 0 Min. − Standard Typ. Max. 2.5 − Unit mA Symbol ICC Power supply current High-speed (VCC = 2.2 to 2.7 V) clock mode Single-chip mode, output pins are open, other pins are VSS − 1 − mA − 4 − mA − 1.7 − mA − 110 300 µA − 125 350 µA − 27 − µA − 20 60 µA − 12 40 µA − 2.8 − µA − 1.9 − µA − 0.6 3.0 µA − 1.60 − µA Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 56 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Timing requirements (Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C) [VCC = 2.2 V] Table 5.32 Symbol tc(XIN) tWH(XIN) tWL(XIN) tc(XCIN) tWH(XCIN) tWL(XCIN) XIN input cycle time XIN input “H” width XIN input “L” width XCIN input cycle time XCIN input “H” width XCIN input “L” width XIN Input, XCIN Input Parameter Standard Min. Max. 200 − 90 − 90 − 14 − 7 − 7 − Unit ns ns ns µs µs µs tC(XIN) tWH(XIN) VCC = 2.2 V XIN input tWL(XIN) Figure 5.18 Table 5.33 Symbol tc(TRAIO) tWH(TRAIO) tWL(TRAIO) XIN Input and XCIN Input Timing Diagram when VCC = 2.2 V TRAIO Input, INT1 Input Parameter TRAIO input cycle time TRAIO input “H” width TRAIO input “L” width Standard Min. Max. TBD − TBD − TBD − Unit ns ns ns tC(TRAIO) tWH(TRAIO) VCC = 2.2 V TRAIO input tWL(TRAIO) Figure 5.19 Table 5.34 Symbol tc(TRFI) tWH(TRFI) tWL(TRFI) TRAIO Input and INT1 Input Timing Diagram when VCC = 2.2 V TRFI Input Parameter TRFI input cycle time TRFI input “H” width TRFI input “L” width Standard Min. Max. − 2000(1) 1000(2) 1000(2) − − Unit ns ns ns NOTES: 1. When using timer RF input capture mode, adjust the cycle time to (1/timer RF count source frequency × 3) or above. 2. When using timer RF input capture mode, adjust the pulse width to (1/timer RF count source frequency × 1.5) or above. tc(TRFI) tWH(TRFI) TRFI input tWL(TRFI) VCC = 2.2 V Figure 5.20 TRFI Input Timing Diagram when VCC = 2.2 V Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 57 of 60 R8C/2A Group, R8C/2B Group 5. Electrical Characteristics Table 5.35 Symbol tc(CK) tW(CKH) tW(CKL) td(C-Q) th(C-Q) tsu(D-C) th(C-D) i = 0 to 2 Serial Interface Parameter CLKi input cycle time CLKi input “H” width CLKi input “L” width TXDi output delay time TXDi hold time RXDi input setup time RXDi input hold time Standard Min. Max. 800 − 400 − 400 − − 200 0 − 150 − 90 − Unit ns ns ns ns ns ns ns tC(CK) tW(CKH) VCC = 2.2 V CLKi tW(CKL) th(C-Q) TXDi td(C-Q) tsu(D-C) th(C-D) RXDi i = 0 to 2 Figure 5.21 Serial Interface Timing Diagram when VCC = 2.2 V Table 5.36 Symbol tW(INH) tW(INL) External Interrupt INTi (i = 0, 2, 3) Input Parameter INT0 input “H” width INT0 input “L” width Standard Min. Max. − 1000(1) 1000(2) − Unit ns ns NOTES: 1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. 2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock frequency × 3) or the minimum value of standard, whichever is greater. VCC = 2.2 V tW(INL) INTi input tW(INH) i = 0, 2, 3 Figure 5.22 External Interrupt INTi Input Timing Diagram when VCC = 2.2 V Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 58 of 60 R8C/2A Group, R8C/2B Group Package Dimensions Package Dimensions Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of the Renesas Technology website. JEITA Package Code P-LQFP64-10x10-0.50 RENESAS Code PLQP0064KB-A Previous Code 64P6Q-A / FP-64K / FP-64KV MASS[Typ.] 0.3g HD *1 48 D 33 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. bp b1 49 32 HE E Reference Symbol *2 c1 Dimension in Millimeters c 64 1 Index mark ZD 16 ZE 17 Terminal cross section F D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1 e *3 A1 y bp L L1 Detail F x Min Nom Max 9.9 10.0 10.1 9.9 10.0 10.1 1.4 11.8 12.0 12.2 11.8 12.0 12.2 1.7 0.05 0.1 0.15 0.15 0.20 0.25 0.18 0.09 0.145 0.20 0.125 0° 8° 0.5 0.08 0.08 1.25 1.25 0.35 0.5 0.65 1.0 A2 JEITA Package Code P-LQFP64-14x14-0.80 RENESAS Code PLQP0064GA-A Previous Code 64P6U-A MASS[Typ.] 0.7g HD *1 D 48 33 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 49 32 bp b1 A c c1 HE E c Reference Symbol *2 Dimension in Millimeters Terminal cross section 64 17 1 ZD Index mark 16 F L L1 D E A2 HD HE A A1 bp b1 c c1 e x y ZD ZE L L1 y e *3 bp x Detail F Min Nom Max 13.9 14.0 14.1 13.9 14.0 14.1 1.4 15.8 16.0 16.2 15.8 16.0 16.2 1.7 0.1 0.2 0 0.32 0.37 0.42 0.35 0.09 0.145 0.20 0.125 0° 8° 0.8 0.20 0.10 1.0 1.0 0.3 0.5 0.7 1.0 ZE A A2 Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 59 of 60 A1 c R8C/2A Group, R8C/2B Group Package Dimensions JEITA Package Code P-TFLGA64-6x6-0.65 RENESAS Code PTLG0064JA-A Previous Code 64F0G MASS[Typ.] 0.07g b1 S b AB S AB wSB D wSA A e H G F E E D C B A Reference Symbol e Dimension in Millimeters x4 v Index mark (Laser mark) yS 1 2 3 4 5 6 7 8 Index mark D E v w A e b b1 x y Nom Max 6.0 6.0 0.15 0.20 1.05 0.65 0.31 0.35 0.39 0.39 0.43 0.47 0.08 0.10 Min Rev.2.10 Nov 26, 2007 REJ03B0182-0210 Page 60 of 60 REVISION HISTORY REVISION HISTORY R8C/2A Group, R8C/2B Group Datasheet R8C/2A Group, R8C/2B Group Datasheet Description Rev. 0.01 0.10 Date Apr 03, 2006 Jun 26, 2006 Page − Summary First Edition issued All pages Pin name revised CMP0_0 → TRFO00, CMP0_1 → TRFO01, CMP0_2 → TRFO02, CMP1_0 → TRFO10, CMP1_1 → TRFO11, CMP1_2 → TRFO12, TRFIN → TRFI 2, 4 Table 1.1 Specifications for R8C/2A Group (1) and Table 1.3 Specifications for R8C/2B Group (1); I/O Ports: • Input-only: 3 pins → 2 pins revised Interrupts: • Internal: 17 sources → 23 sources revised Table 1.2 Specifications for R8C/2A Group (2) and Table 1.4 Specifications for R8C/2B Group (2); ROM Correction Function deleted Figure 1.3 Block Diagram revised Figure 1.4 Pin Assignment (Top View) revised Table 1.7 Pin Name Information by Pin Number (1) and Table 1.8 Pin Name Information by Pin Number (2) revised Table 1.9 Pin Functions (1) and Table 1.10 Pin Functions (2) revised Table 4.1 SFR Information (1); • 0008h: Module Standby Control Register, MSTCR, 00h added • 001Ch: “00h” → “00h, 10000000b” revised • NOTE6 added Table 4.2 SFR Information (2); • 005Fh: Capture Interrupt Control Register, CAPIC, XXXXX000b added Table 4.4 SFR Information (4); • 00DCh: “00DDh” → “00DCh” revised • 00F5h: “XXXX00XXb” → “00h” revised Table 4.5 SFR Information (5); • 0105h: LIN Special Function Register, LINCR2, 00h added Table 4.12 SFR Information (12); • 02C2h, 02C3h: A/D Register 1, AD1, XXh deleted • 02C4h, 02C5h: A/D Register 2, AD2, XXh deleted • 02C6h, 02C7h: A/D Register 3, AD3, XXh deleted Package Dimensions; “Diagrams showing the latest package dimensions... in the “Packages” section of the Renesas Technology website.” added Table 1.5 and Figure 1.1 revised Table 1.6 and Figure 1.2 revised Figure 3.1 revised Figure 3.2 revised 3, 5 8 9 10, 11 12, 13 19 20 22 23 30 31 0.20 0.30 Sep 15, 2006 Dec 22, 2006 31 to 54 5. Electrical Characteristics added 6 7 17 18 A-1 REVISION HISTORY R8C/2A Group, R8C/2B Group Datasheet Description Rev. 0.30 Date Dec 22, 2006 Page 19 Summary Table 4.1; • 000Ah: “00XXX000b” → “00h” revised • 0008h: “Module Standby Control Register” → “Module Operation Enable Register” revised • 000Fh: “00011111b” → “00X11111b” revised Table 5.11 revised Table 1.2 revised Table 1.4 revised Table 1.5 and Figure 1.1 revised Table 1.6 and Figure 1.2 revised Figure 3.1 revised Figure 3.2 revised Table 4.1; • 0008h: “Module Standby Control Register” → “Module Operation Enable Register” revised • 000Ah: “00XXX000b” → “00h” revised • 000Fh: “00011111b” → “00X11111b” revised • 002Bh: “High-Speed On-Chip Oscillator Control Register 6” added Table 4.5; 0105h: “LIN Control Register 2” register name revised Table 5.2 revised Table 5.3 and Table 5.4; NOTE1 revised Table 5.11 revised Table 5.17 revised Table 5.21 and Figure 5.11; “i = 0 to 2” revised Table 5.24 revised Table 5.28 revised, Figure 5.16 “i = 0 to 2” revised Table 5.31 revised Table 5.34 revised Table 5.35 and Figure 5.21; “i = 0 to 2” revised Table 1.2 and Table 1.4; • Operating Ambient Temperature: Y version added • Package: 64-pin FLGA added Table 1.5 and Figure 1.1 revised Table 1.6 and Figure 1.2 revised Figure 1.4 “64-pin LQFP Package” added Figure 1.5 added Table 4.4; 00F5h: “00h” → “000000XXb” revised 37 1.00 Feb 09, 2007 3 5 6 7 17 18 19 All pages “Preliminary” deleted 23 31 32 37 44 46 48 50 52 53 54 2.00 Oct 17, 2007 3, 5 All pages “PTLG0064JA-A (64F0G) package” added 6 to 7 8 10 11 24 19 to 20 Figure 3.1 and Figure 3.2 revised A-2 REVISION HISTORY R8C/2A Group, R8C/2B Group Datasheet Description Rev. 2.00 Date Oct 17, 2007 Page 33 59 Summary Table 5.1; Pd: Rated Value “TBD” → “700” revised, “NOTE1” added Package Dimensions “PTLG0064JA-A (64F0G) package” added Table 1.1, Table 1.3 Clock: “Real-time clock (timer RE)” added Table 1.5 and Figure 1.1 revised Table 1.6 and Figure 1.2 revised Figure 3.1 and Figure 3.2 revised Table 4.1 002Ch: High-Speed On-Chip Oscillator Control Register 7 added Table 5.2 NOTE2 revised Table 5.11 revised 2.10 Nov 26, 2007 2, 4 6, 7 8, 9 20, 21 22 35 41 All trademarks and registered trademarks are the property of their respective owners. A-3 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: (1628) 585-100, Fax: (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: (21) 5877-1818, Fax: (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: 2265-6688, Fax: 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: (2) 2715-2888, Fax: (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: 6213-0200, Fax: 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: (2) 796-3115, Fax: (2) 796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: 7955-9390, Fax: 7955-9510 © 2007. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .7.2
R5F212BCSNFP 价格&库存

很抱歉,暂时无法提供与“R5F212BCSNFP”相匹配的价格&库存,您可以联系我们找货

免费人工找货