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April 1st, 2010
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Notice
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User’s Manual
SH7780
32
Hardware Manual
Renesas 32-Bit RISC Microcomputer
SuperHTM RISC Engine Family
SH7780 Series
R8A77800A
Rev.1.00 2005.12
Rev.1.00 Dec. 13, 2005 Page ii of l
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
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Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
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Rev.1.00 Dec. 13, 2005 Page iii of l
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system's
operation is not guaranteed if they are accessed.
5. Reading from/Writing Reserved Bit of Each Register
Note: Treat the reserved bit of register used in each module as follows except in cases where the
specifications for values which are read from or written to the bit are provided in the
description.
The bit is always read as 0. The write value should be 0 or one, which has been read
immediately before writing.
Writing the value, which has been read immediately before writing has the advantage of
preventing the bit from being affected on its extended function when the function is
assigned.
Rev.1.00 Dec. 13, 2005 Page iv of l
Configuration of This Manual
This manual comprises the following items:
1.
2.
3.
4.
5.
6.
General Precautions on Handling of Product
Configuration of This Manual
Preface
Contents
Overview
Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. Electrical Characteristics
8. Appendix
9. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
10. Index
Rev.1.00 Dec. 13, 2005 Page v of l
Preface
This LSI is a RISC (Reduced Instruction Set Computer) microcomputer which includes a Renesas
Technology-original RISC CPU as its core, and the peripheral functions required to configure a
system.
Target Users: This manual was written for users who will be using this LSI in the design of
application systems. Users of this manual are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of this LSI to the above users.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
Rules:
Bit order:
Number notation:
Signal notation:
Rev.1.00 Dec. 13, 2005 Page vi of l
The MSB is on the left and the LSB is on the right.
Binary is B'xxxx, hexadecimal is H'xxxx, decimal is xxxx.
An overbar is added to a low-active signal: xxxx
Abbreviations
ALU
Arithmetic Logic Unit
ASID
Address Space Identifier
BGA
Ball Grid Array
CMT
Compare Match Timer (Timer/Counter)
CPG
Clock Pulse Generator
CPU
Central Processing Unit
DDR
Double Data Rate
DDRIF
DDR-SDRAM Interface
DMA
Direct Memory Access
DMAC
Direct Memory Access Controller
FIFO
First-In First-Out
FLCTL
NAND Flash Memory Controller
FPU
Floating-point Unit
HAC
Audio Codec
HSPI
Serial Protocol Interface
H-UDI
User Debugging Interface
INTC
Interrupt Controller
JTAG
Joint Test Action Group
LBSC
Local Bus State Controller
LRAM
L Memory
LRU
Least Recently Used
LSB
Least Significant Bit
Rev.1.00 Dec. 13, 2005 Page vii of l
MMCIF
Multimedia Card Interface
MMU
Memory Management Unit
MSB
Most Significant Bit
PC
Program Counter
PCI
Peripheral Component Interconnect
PCIC
PCI (local bus) Controller
RISC
Reduced Instruction Set Computer
RTC
Realtime Clock
SCIF
Serial Communication Interface with FIFO
SIOF
Serial Interface with FIFO
SSI
Serial Sound Interface
TAP
Test Access Port
TLB
Translation Lookaside Buffer
TMU
Timer Unit
UART
Universal Asynchronous Receiver/Transmitter
UBC
User Break Controller
WDT
Watchdog Timer
Rev.1.00 Dec. 13, 2005 Page viii of l
Contents
Section 1 Overview................................................................................................1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
SH7780 Features.................................................................................................................... 1
Block Diagram ....................................................................................................................... 9
Pin Arrangement .................................................................................................................. 10
Pin Functions ....................................................................................................................... 11
Memory Address Map ......................................................................................................... 27
SuperHyway Bus ................................................................................................................. 30
SuperHyway Memory (SuperHyway RAM)........................................................................ 31
Section 2 Programming Model ............................................................................33
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Data Formats........................................................................................................................ 33
Register Descriptions ........................................................................................................... 34
2.2.1 Privileged Mode and Banks .................................................................................... 34
2.2.2 General Registers.................................................................................................... 37
2.2.3 Floating-Point Registers.......................................................................................... 38
2.2.4 Control Registers .................................................................................................... 40
2.2.5 System Registers..................................................................................................... 42
Memory-Mapped Registers.................................................................................................. 46
Data Formats in Registers .................................................................................................... 47
Data Formats in Memory ..................................................................................................... 48
Processing States.................................................................................................................. 49
Usage Note........................................................................................................................... 50
2.7.1 Notes on self-modified codes.................................................................................. 50
Section 3 Instruction Set ......................................................................................51
3.1
3.2
3.3
Execution Environment ....................................................................................................... 51
Addressing Modes ............................................................................................................... 53
Instruction Set ...................................................................................................................... 57
Section 4 Pipelining .............................................................................................73
4.1
4.2
4.3
Pipelines............................................................................................................................... 73
Parallel-Executability........................................................................................................... 84
Issue Rates and Execution Cycles........................................................................................ 87
Section 5 Exception Handling .............................................................................97
5.1
Summary of Exception Handling......................................................................................... 97
Rev.1.00 Dec. 13, 2005 Page ix of l
5.2
5.3
5.4
5.5
5.6
5.7
Register Descriptions........................................................................................................... 97
5.2.1 TRAPA Exception Register (TRA) ........................................................................ 98
5.2.2 Exception Event Register (EXPEVT)..................................................................... 99
5.2.3 Interrupt Event Register (INTEVT)...................................................................... 100
Exception Handling Functions........................................................................................... 101
5.3.1 Exception Handling Flow ..................................................................................... 101
5.3.2 Exception Handling Vector Addresses ................................................................. 101
Exception Types and Priorities .......................................................................................... 102
Exception Flow .................................................................................................................. 104
5.5.1 Exception Flow..................................................................................................... 104
5.5.2 Exception Source Acceptance............................................................................... 106
5.5.3 Exception Requests and BL Bit ............................................................................ 107
5.5.4 Return from Exception Handling.......................................................................... 107
Description of Exceptions.................................................................................................. 108
5.6.1 Resets.................................................................................................................... 108
5.6.2 General Exceptions............................................................................................... 110
5.6.3 Interrupts............................................................................................................... 124
5.6.4 Priority Order with Multiple Exceptions .............................................................. 125
Usage Notes ....................................................................................................................... 127
Section 6 Floating-Point Unit (FPU)................................................................. 129
6.1
6.2
6.3
6.4
6.5
6.6
Features.............................................................................................................................. 129
Data Formats...................................................................................................................... 130
6.2.1 Floating-Point Format........................................................................................... 130
6.2.2 Non-Numbers (NaN) ............................................................................................ 133
6.2.3 Denormalized Numbers ........................................................................................ 134
Register Descriptions......................................................................................................... 135
6.3.1 Floating-Point Registers ....................................................................................... 135
6.3.2 Floating-Point Status/Control Register (FPSCR) ................................................. 137
6.3.3 Floating-Point Communication Register (FPUL) ................................................. 140
Rounding............................................................................................................................ 141
Floating-Point Exceptions.................................................................................................. 142
6.5.1 General FPU Disable Exceptions and Slot FPU Disable Exceptions ................... 142
6.5.2 FPU Exception Sources ........................................................................................ 142
6.5.3 FPU Exception Handling ...................................................................................... 142
Graphics Support Functions............................................................................................... 144
6.6.1 Geometric Operation Instructions......................................................................... 144
6.6.2 Pair Single-Precision Data Transfer...................................................................... 145
Rev.1.00 Dec. 13, 2005 Page x of l
Section 7 Memory Management Unit (MMU) ..................................................147
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Overview of MMU ............................................................................................................ 147
7.1.1 Address Spaces ..................................................................................................... 149
Register Descriptions ......................................................................................................... 156
7.2.1 Page Table Entry High Register (PTEH) .............................................................. 157
7.2.2 Page Table Entry Low Register (PTEL) ............................................................... 158
7.2.3 Translation Table Base Register (TTB) ................................................................ 159
7.2.4 TLB Exception Address Register (TEA) .............................................................. 159
7.2.5 MMU Control Register (MMUCR) ...................................................................... 160
7.2.6 Physical Address Space Control Register (PASCR)............................................. 164
7.2.7 Instruction Re-Fetch Inhibit Control Register (IRMCR) ...................................... 165
TLB Functions ................................................................................................................... 167
7.3.1 Unified TLB (UTLB) Configuration .................................................................... 167
7.3.2 Instruction TLB (ITLB) Configuration................................................................. 170
7.3.3 Address Translation Method................................................................................. 171
MMU Functions................................................................................................................. 173
7.4.1 MMU Hardware Management .............................................................................. 173
7.4.2 MMU Software Management ............................................................................... 173
7.4.3 MMU Instruction (LDTLB).................................................................................. 174
7.4.4 Hardware ITLB Miss Handling ............................................................................ 175
7.4.5 Avoiding Synonym Problems ............................................................................... 176
MMU Exceptions............................................................................................................... 177
7.5.1 Instruction TLB Multiple Hit Exception............................................................... 177
7.5.2 Instruction TLB Miss Exception........................................................................... 178
7.5.3 Instruction TLB Protection Violation Exception .................................................. 179
7.5.4 Data TLB Multiple Hit Exception ........................................................................ 180
7.5.5 Data TLB Miss Exception .................................................................................... 180
7.5.6 Data TLB Protection Violation Exception............................................................ 181
7.5.7 Initial Page Write Exception................................................................................. 182
Memory-Mapped TLB Configuration................................................................................ 183
7.6.1 ITLB Address Array ............................................................................................. 184
7.6.2 ITLB Data Array................................................................................................... 185
7.6.3 UTLB Address Array............................................................................................ 186
7.6.4 UTLB Data Array ................................................................................................. 187
32-Bit Address Extended Mode ......................................................................................... 188
7.7.1 Overview of 32-Bit Address Extended Mode....................................................... 189
7.7.2 Transition to 32-Bit Address Extended Mode ...................................................... 189
7.7.3 Privileged Space Mapping Buffer (PMB) Configuration ..................................... 189
7.7.4 PMB Function....................................................................................................... 191
Rev.1.00 Dec. 13, 2005 Page xi of l
7.7.5
7.7.6
Memory-Mapped PMB Configuration.................................................................. 192
Notes on Using 32-Bit Address Extended Mode .................................................. 194
Section 8 Caches................................................................................................ 197
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
Features.............................................................................................................................. 197
Register Descriptions......................................................................................................... 200
8.2.1 Cache Control Register (CCR) ............................................................................. 201
8.2.2 Queue Address Control Register 0 (QACR0)....................................................... 203
8.2.3 Queue Address Control Register 1 (QACR1)....................................................... 204
8.2.4 On-Chip Memory Control Register (RAMCR) .................................................... 205
Operand Cache Operation.................................................................................................. 207
8.3.1 Read Operation ..................................................................................................... 207
8.3.2 Prefetch Operation ................................................................................................ 208
8.3.3 Write Operation .................................................................................................... 209
8.3.4 Write-Back Buffer ................................................................................................ 211
8.3.5 Write-Through Buffer........................................................................................... 211
8.3.6 OC Two-Way Mode ............................................................................................. 211
Instruction Cache Operation .............................................................................................. 212
8.4.1 Read Operation ..................................................................................................... 212
8.4.2 Prefetch Operation ................................................................................................ 213
8.4.3 IC Two-Way Mode............................................................................................... 213
Cache Operation Instruction .............................................................................................. 214
8.5.1 Coherency between Cache and External Memory ................................................ 214
8.5.2 Prefetch Operation ................................................................................................ 215
Memory-Mapped Cache Configuration ............................................................................. 216
8.6.1 IC Address Array.................................................................................................. 217
8.6.2 IC Data Array ....................................................................................................... 219
8.6.3 OC Address Array ................................................................................................ 220
8.6.4 OC Data Array...................................................................................................... 222
Store Queues ...................................................................................................................... 223
8.7.1 SQ Configuration.................................................................................................. 223
8.7.2 Writing to SQ........................................................................................................ 223
8.7.3 Transfer to External Memory ............................................................................... 224
8.7.4 Determination of SQ Access Exception................................................................ 225
8.7.5 Reading from SQ .................................................................................................. 225
Notes on Using 32-Bit Address Extended Mode ............................................................... 226
Section 9 L Memory.......................................................................................... 227
9.1
9.2
Features.............................................................................................................................. 227
Register Descriptions......................................................................................................... 228
Rev.1.00 Dec. 13, 2005 Page xii of l
9.3
9.4
9.5
9.6
9.2.1 On-Chip Memory Control Register (RAMCR) .................................................... 229
9.2.2 L Memory Transfer Source Address Register 0 (LSA0) ...................................... 230
9.2.3 L Memory Transfer Source Address Register 1 (LSA1) ...................................... 232
9.2.4 L Memory Transfer Destination Address Register 0 (LDA0) .............................. 234
9.2.5 L Memory Transfer Destination Address Register 1 (LDA1) .............................. 236
Operation ........................................................................................................................... 238
9.3.1 Access from the CPU and FPU............................................................................. 238
9.3.2 Access from the SuperHyway Bus Master Module .............................................. 238
9.3.3 Block Transfer ...................................................................................................... 238
L Memory Protective Functions ........................................................................................ 240
Usage Notes ....................................................................................................................... 241
9.5.1 Page Conflict ........................................................................................................ 241
9.5.2 L Memory Coherency ........................................................................................... 241
9.5.3 Sleep Mode ........................................................................................................... 241
Note on Using 32-Bit Address Extended Mode................................................................. 241
Section 10 Interrupt Controller (INTC) .............................................................243
10.1 Features.............................................................................................................................. 243
10.1.1 Interrupt Method ................................................................................................... 245
10.1.2 Interrupt Types in INTC ....................................................................................... 246
10.2 Input/Output Pins ............................................................................................................... 250
10.3 Register Descriptions ......................................................................................................... 251
10.3.1 Interrupt Control Register 0 (ICR0)...................................................................... 255
10.3.2 Interrupt Control Register 1 (ICR1)...................................................................... 258
10.3.3 Interrupt Priority Register (INTPRI)..................................................................... 259
10.3.4 Interrupt Source Register (INTREQ).................................................................... 260
10.3.5 Interrupt Mask Registers (INTMSK0 to INTMSK2)............................................ 261
10.3.6 Interrupt Mask Clear Registers (INTMSKCLR0 to INTMSKCLR2)................... 266
10.3.7 NMI Flag Control Register (NMIFCR) ................................................................ 271
10.3.8 User Interrupt Mask Level Register (USERIMASK) ........................................... 273
10.3.9 On-chip Module Interrupt Priority Registers (INT2PRI0 to INT2PRI7).............. 276
10.3.10 Interrupt Source Register (INT2A0: Not affected by Mask States) ...................... 277
10.3.11 Interrupt Source Register (INT2A1: Affected by Mask States)............................ 280
10.3.12 Interrupt Mask Register (INT2MSKR)................................................................. 282
10.3.13 Interrupt Mask Clear Register (INT2MSKCR)..................................................... 285
10.3.14 On-chip Module Interrupt Source Registers (INT2B0 to INT2B7) ...................... 287
10.3.15 GPIO Interrupt Set Register (INT2GPIC)............................................................. 294
10.4 Interrupt Sources................................................................................................................ 296
10.4.1 NMI Interrupt........................................................................................................ 296
10.4.2 IRQ Interrupts ....................................................................................................... 296
Rev.1.00 Dec. 13, 2005 Page xiii of l
10.4.3 IRL Interrupts ....................................................................................................... 297
10.4.4 On-chip Module Interrupts ................................................................................... 299
10.4.5 Interrupt Priority Levels of On-chip Module Interrupts ....................................... 300
10.4.6 Interrupt Exception Handling and Priority............................................................ 301
10.5 Operation ........................................................................................................................... 308
10.5.1 Interrupt Sequence ................................................................................................ 308
10.5.2 Multiple Interrupts ................................................................................................ 310
10.5.3 Interrupt Masking by MAI Bit.............................................................................. 310
10.6 Interrupt Response Time.................................................................................................... 311
10.7 Usage Notes ....................................................................................................................... 312
10.7.1 To Clear Interrupt Request When Holding Function Selected ............................. 312
10.7.2 Notes on Setting IRQ/IRL[7:0] Pin Function ....................................................... 313
10.7.3 To clear IRQ and IRL interrupt requests .............................................................. 313
Section 11 Local Bus State Controller (LBSC)................................................. 315
11.1 Features.............................................................................................................................. 315
11.2 Input/Output Pins............................................................................................................... 318
11.3 Area Overview................................................................................................................... 320
11.3.1 Space Divisions .................................................................................................... 320
11.3.2 Memory Bus Width .............................................................................................. 324
11.3.3 Data Alignment..................................................................................................... 325
11.3.4 PCMCIA Support ................................................................................................. 325
11.4 Register Descriptions......................................................................................................... 329
11.4.1 Memory Address Map Select Register (MMSELR)............................................. 331
11.4.2 Bus Control Register (BCR) ................................................................................. 333
11.4.3 CSn Bus Control Register (CSnBCR) .................................................................. 336
11.4.4 CSn Wait Control Register (CSnWCR)................................................................ 342
11.4.5 CSn PCMCIA Control Register (CSnPCR).......................................................... 347
11.5 Operation ........................................................................................................................... 352
11.5.1 Endian/Access Size and Data Alignment.............................................................. 352
11.5.2 Areas..................................................................................................................... 357
11.5.3 SRAM interface .................................................................................................... 361
11.5.4 Burst ROM (Clock Asynchronous) Interface ....................................................... 370
11.5.5 PCMCIA Interface................................................................................................ 372
11.5.6 MPX Interface ...................................................................................................... 383
11.5.7 Byte Control SRAM Interface .............................................................................. 389
11.5.8 Wait Cycles between Accesses............................................................................. 393
11.5.9 Bus Arbitration ..................................................................................................... 395
11.5.10 Bus Release and Acquire Sequence...................................................................... 397
11.5.11 Cooperation between Master and Slave................................................................ 399
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Section 12 DDR-SDRAM Interface (DDRIF)...................................................401
12.1 Features.............................................................................................................................. 401
12.2 Input/Output Pins ............................................................................................................... 403
12.3 Address Space, Bus Width, and Data Alignment............................................................... 404
12.3.1 Address Space of the DDRIF................................................................................ 404
12.3.2 Memory Data Bus Width ...................................................................................... 405
12.3.3 Data Alignment..................................................................................................... 406
12.4 Register Descriptions ......................................................................................................... 410
12.4.1 Memory Interface Mode Register (MIM) ............................................................. 412
12.4.2 SDRAM Control Register (SCR).......................................................................... 416
12.4.3 SDRAM Timing Register (STR) .......................................................................... 418
12.4.4 SDRAM Row Attribute Register (SDR)............................................................... 421
12.4.5 SDRAM Mode Register (SDMR)......................................................................... 422
12.4.6 DDR-SDRAM Back-up Register (DBK).............................................................. 424
12.5 Operation ........................................................................................................................... 425
12.5.1 DDR-SDRAM Access .......................................................................................... 425
12.5.2 DDR-SDRAM Initialization Sequence................................................................. 425
12.5.3 Supported SDRAM Commands............................................................................ 426
12.5.4 SDRAM Access Mode.......................................................................................... 427
12.5.5 Power-Down Modes ............................................................................................. 427
12.5.6 Address Multiplexing ........................................................................................... 429
12.6 DDR-SDRAM Basic Timing ............................................................................................. 430
12.7 Usage Notes ....................................................................................................................... 440
12.7.1 Operating Frequency............................................................................................. 440
12.7.2 Stopping Clock ..................................................................................................... 440
12.7.3 Using SCR to Issue REFA Command (Outside the Initialization Sequence) ....... 440
12.7.4 Timing of Connected SDRAM ............................................................................. 440
12.7.5 Setting Auto-Refresh Interval ............................................................................... 441
Section 13 PCI Controller (PCIC) .....................................................................443
13.1 Features.............................................................................................................................. 443
13.2 Input/Output Pins ............................................................................................................... 446
13.3 Register Descriptions ......................................................................................................... 449
13.3.1 PCIC Enable Control Register (PCIECR) ............................................................ 455
13.3.2 Configuration Registers ........................................................................................ 456
13.3.3 Local Register ....................................................................................................... 481
13.4 Operation ........................................................................................................................... 522
13.4.1 Supported PCI Commands.................................................................................... 522
13.4.2 PCIC Initialization ................................................................................................ 523
13.4.3 Master Access ....................................................................................................... 524
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13.4.4
13.4.5
13.4.6
13.4.7
13.4.8
Target Access........................................................................................................ 532
Host Bus Bridge Mode ......................................................................................... 541
Normal mode ........................................................................................................ 544
Power Management .............................................................................................. 544
PCI Local Bus Basic Interface.............................................................................. 545
Section 14 Direct Memory Access Controller (DMAC)................................... 557
14.1 Features.............................................................................................................................. 557
14.2 Input/Output Pins............................................................................................................... 559
14.3 Register Descriptions......................................................................................................... 561
14.3.1 DMA Source Address Registers 0 to 11 (SAR0 to SAR11) ................................. 567
14.3.2 DMA Source Address Registers B0 to B3, B6 to B9
(SARB0 to SARB3, SARB6 to SARB9) .............................................................. 568
14.3.3 DMA Destination Address Registers 0 to 11 (DAR0 to DAR11) ........................ 568
14.3.4 DMA Destination Address Registers B0 to B3, B6 to B9
(DARB0 to DARB3, DARB6 to DARB9) ........................................................... 569
14.3.5 DMA Transfer Count Registers 0 to 11 (TCR0 to TCR11).................................. 570
14.3.6 DMA Transfer Count Registers B0 to B3, B6 to B9
(TCRB0 to TCRB3, TCRB6 to TCRB9) .............................................................. 571
14.3.7 DMA Channel Control Registers 0 to 11 (CHCR0 to CHCR11) ......................... 572
14.3.8 DMA Operation Register 0, 1 (DMAOR0 and DMAOR1) .................................. 581
14.3.9 DMA Extended Resource Selectors (DMARS0 to DMARS2)............................. 584
14.4 Operation ........................................................................................................................... 588
14.4.1 DMA Transfer Requests ....................................................................................... 588
14.4.2 Channel Priority.................................................................................................... 592
14.4.3 DMA Transfer Types............................................................................................ 595
14.4.4 DMA Transfer Flow ............................................................................................. 602
14.4.5 Repeat Mode Transfer .......................................................................................... 604
14.4.6 Reload Mode Transfer .......................................................................................... 605
14.4.7 DREQ Pin Sampling Timing ................................................................................ 606
14.5 Usage Notes ....................................................................................................................... 608
14.5.1 Module Stop ......................................................................................................... 608
14.5.2 Address Error........................................................................................................ 608
14.5.3 Notes on Burst Mode Transfer.............................................................................. 608
14.5.4 DACK output division .......................................................................................... 609
14.5.5 Clear DMINT Interrupt......................................................................................... 609
14.5.6 CS Output Settings and Transfer Size Larger than External Bus Width............... 609
14.5.7 DACK Assertion and DREQ Sampling ................................................................ 609
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Section 15 Clock Pulse Generator (CPG)..........................................................613
15.1
15.2
15.3
15.4
Features.............................................................................................................................. 613
Input/Output Pins ............................................................................................................... 616
Clock Operating Modes ..................................................................................................... 617
Register Descriptions ......................................................................................................... 618
15.4.1 Frequency Control Register (FRQCR) ................................................................. 619
15.4.2 PLL Control Register (PLLCR)............................................................................ 621
15.5 Notes on Board Design ...................................................................................................... 622
Section 16 Watchdog Timer and Reset..............................................................625
16.1 Features.............................................................................................................................. 625
16.2 Input/Output Pins ............................................................................................................... 627
16.3 Register Descriptions ......................................................................................................... 628
16.3.1 Watchdog Timer Stop Time Register (WDTST) .................................................. 629
16.3.2 Watchdog Timer Control/Status Register (WDTCSR)......................................... 630
16.3.3 Watchdog timer Base Stop Time Register (WDTBST) ........................................ 631
16.3.4 Watchdog Timer Counter (WDTCNT)................................................................. 632
16.3.5 Watchdog Timer Base Counter (WDTBCNT) ..................................................... 632
16.4 Operation ........................................................................................................................... 633
16.4.1 Reset request......................................................................................................... 633
16.4.2 Using watchdog timer mode ................................................................................. 634
16.4.3 Using Interval timer mode .................................................................................... 634
16.4.4 Time for WDT Overflow ...................................................................................... 635
16.4.5 Clearing WDT Counter......................................................................................... 636
16.5 Status Pin Change Timing during Reset ............................................................................ 636
16.5.1 Power-On Reset by PRESET................................................................................ 636
16.5.2 Power-On Reset by Watchdog Timer Overflow................................................... 638
16.5.3 Manual Reset by Watchdog Timer Overflow ....................................................... 640
Section 17 Power-Down Mode..........................................................................643
17.1 Features.............................................................................................................................. 643
17.1.1 Types of Power-Down Modes .............................................................................. 643
17.2 Input/Output Pins ............................................................................................................... 645
17.3 Register Descriptions ......................................................................................................... 645
17.3.1 Standby Control Register (MSTPCR)................................................................... 646
17.4 Sleep Mode ........................................................................................................................ 648
17.4.1 Transition to Sleep mode ...................................................................................... 648
17.4.2 Cancellation of Sleep Mode.................................................................................. 648
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17.5 Module Standby State ........................................................................................................ 649
17.5.1 Transition to Module Standby Mode .................................................................... 649
17.5.2 Cancellation of Module Standby Mode and Resume............................................ 649
17.6 DDR-SDRAM Power Supply Backup............................................................................... 650
17.6.1 Self-Refresh and Initialization .............................................................................. 650
17.6.2 DDR-SDRAM Backup Sequence when Turning Off System Power Supply ....... 651
17.7 RTC Power Supply Backup ............................................................................................... 653
17.7.1 Transition to RTC Power Supply Backup............................................................. 653
17.7.2 Cancellation of RTC Power Supply Backup......................................................... 653
17.8 Mode Transitions ............................................................................................................... 655
17.9 STATUS Pin Change Timing ............................................................................................ 656
17.9.1 In Reset ................................................................................................................. 656
17.9.2 In Sleep ................................................................................................................. 656
Section 18 Timer Unit (TMU)........................................................................... 657
18.1 Features.............................................................................................................................. 657
18.2 Input/Output Pins............................................................................................................... 659
18.3 Register Descriptions......................................................................................................... 660
18.3.1 Timer Output Control Register (TOCR)............................................................... 662
18.3.2 Timer Start Register (TSTR0, TSTR1)................................................................. 663
18.3.3 Timer Constant Register (TCORn) (n = 0 to 5) .................................................... 665
18.3.4 Timer Counter (TCNTn) (n = 0 to 5).................................................................... 665
18.3.5 Timer Control Registers (TCRn) (n = 0 to 5) ....................................................... 666
18.3.6 Input Capture Register 2 (TCPR2) ....................................................................... 668
18.4 Operation ........................................................................................................................... 669
18.4.1 Counter Operation ................................................................................................ 669
18.4.2 Input Capture Function ......................................................................................... 673
18.5 Interrupts............................................................................................................................ 674
18.6 Usage Notes ....................................................................................................................... 675
18.6.1 Register Writes ..................................................................................................... 675
18.6.2 Reading from TCNT............................................................................................. 675
18.6.3 Reset RTC Frequency Divider Circuit.................................................................. 675
18.6.4 External Clock Frequency .................................................................................... 675
Section 19 Compare Match Timer (CMT) ........................................................ 677
19.1 Features.............................................................................................................................. 677
19.2 Input/Output Pins............................................................................................................... 679
19.3 Register Descriptions......................................................................................................... 679
19.3.1 Configuration Register (CMTCFG)...................................................................... 681
19.3.2 Free-Running Timer (CMTFRT).......................................................................... 684
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19.3.3 Control Register (CMTCTL) ................................................................................ 684
19.3.4 Interrupt Status Register (CMTIRQS) .................................................................. 688
19.3.5 Channels 0 to 3 Time Registers (CMTCH0T to CMTCH3T)............................... 689
19.3.6 Channels 0 to 1 Stop Time Registers (CMTCH0ST to CMTCH1ST).................. 689
19.3.7 Channels 0 to 3 Counters (CMTCH0C to CMTCH3C)........................................ 690
19.4 Operation ........................................................................................................................... 691
19.4.1 Edge Detection...................................................................................................... 691
19.4.2 32-Bit Timer: Input Capture ................................................................................. 692
19.4.3 32-Bit Timer: Output Compare............................................................................. 693
19.4.4 16-Bit Timer: Input Capture ................................................................................. 697
19.4.5 16-Bit Timer: Output Compare............................................................................. 699
19.4.6 Counter: Up-counter ............................................................................................. 701
19.4.7 Counter: Updown-counter .................................................................................... 703
19.4.8 Counter: Rotary Switch Operation of Updown-counter ....................................... 705
19.4.9 Interrupts............................................................................................................... 706
Section 20 Realtime Clock (RTC) .....................................................................707
20.1 Features.............................................................................................................................. 707
20.1.1 Block Diagram...................................................................................................... 708
20.2 Input/Output Pins ............................................................................................................... 709
20.3 Register Descriptions ......................................................................................................... 710
20.3.1 64 Hz Counter (R64CNT)..................................................................................... 712
20.3.2 Second Counter (RSECCNT) ............................................................................... 712
20.3.3 Minute Counter (RMINCNT) ............................................................................... 713
20.3.4 Hour Counter (RHRCNT)..................................................................................... 713
20.3.5 Day-of-Week Counter (RWKCNT)...................................................................... 714
20.3.6 Day Counter (RDAYCNT) ................................................................................... 715
20.3.7 Month Counter (RMONCNT) .............................................................................. 716
20.3.8 Year Counter (RYRCNT) ..................................................................................... 716
20.3.9 Second Alarm Register (RSECAR) ...................................................................... 717
20.3.10 Minute Alarm Register (RMINAR)...................................................................... 717
20.3.11 Hour Alarm Register (RHRAR) ........................................................................... 718
20.3.12 Day-of-Week Alarm Register (RWKAR)............................................................. 718
20.3.13 Day Alarm Register (RDAYAR).......................................................................... 719
20.3.14 Month Alarm Register (RMONAR) ..................................................................... 720
20.3.15 Year-Alarm Register (RYRAR)............................................................................ 720
20.3.16 RTC Control Register 1 (RCR1)........................................................................... 721
20.3.17 RTC Control Register 2 (RCR2)........................................................................... 723
20.3.18 RTC Control Register (RCR3).............................................................................. 726
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20.4 Operation ........................................................................................................................... 727
20.4.1 Time Setting Procedures....................................................................................... 727
20.4.2 Time Reading Procedures..................................................................................... 728
20.4.3 Alarm Function..................................................................................................... 729
20.5 Interrupts............................................................................................................................ 730
20.6 Usage Notes ....................................................................................................................... 730
20.6.1 Register Initialization............................................................................................ 730
20.6.2 Crystal Oscillator Circuit ...................................................................................... 730
20.6.3 Interrupt source and request generating order....................................................... 732
Section 21 Serial Communication Interface with FIFO (SCIF)........................ 733
21.1 Features.............................................................................................................................. 733
21.2 Input/Output Pins............................................................................................................... 739
21.3 Register Descriptions......................................................................................................... 740
21.3.1 Receive Shift Register (SCRSR) .......................................................................... 742
21.3.2 Receive FIFO Data Register (SCFRDR) .............................................................. 742
21.3.3 Transmit Shift Register (SCTSR) ......................................................................... 743
21.3.4 Transmit FIFO Data Register (SCFTDR)............................................................. 743
21.3.5 Serial Mode Register (SCSMR)............................................................................ 744
21.3.6 Serial Control Register (SCSCR).......................................................................... 747
21.3.7 Serial Status Register n (SCFSR) ......................................................................... 751
21.3.8 Bit Rate Register n (SCBRR) ............................................................................... 758
21.3.9 FIFO Control Register n (SCFCR) ....................................................................... 759
21.3.10 Transmit FIFO Data Count Register n (SCTFDR) ............................................... 762
21.3.11 Receive FIFO Data Count Register n (SCRFDR)................................................. 763
21.3.12 Serial Port Register n (SCSPTR) .......................................................................... 764
21.3.13 Line Status Register n (SCLSR) ........................................................................... 767
21.3.14 Serial Error Register n (SCRER) .......................................................................... 768
21.4 Operation ........................................................................................................................... 769
21.4.1 Overview .............................................................................................................. 769
21.4.2 Operation in Asynchronous Mode ........................................................................ 772
21.4.3 Operation in Clocked Synchronous Mode ............................................................ 783
21.5 SCIF Interrupt Sources and the DMAC ............................................................................. 792
21.6 Usage Notes ....................................................................................................................... 794
Section 22 Serial I/O with FIFO (SIOF) ........................................................... 797
22.1 Features.............................................................................................................................. 797
22.2 Input/Output Pins............................................................................................................... 799
22.3 Register Descriptions......................................................................................................... 800
22.3.1 Mode Register (SIMDR) ...................................................................................... 802
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22.3.2 Clock Select Register (SISCR) ............................................................................. 804
22.3.3 Control Register (SICTR) ..................................................................................... 806
22.3.4 Transmit Data Register (SITDR) .......................................................................... 809
22.3.5 Receive Data Register (SIRDR) ........................................................................... 810
22.3.6 Transmit Control Data Register (SITCR) ............................................................. 811
22.3.7 Receive Control Data Register (SIRCR) .............................................................. 812
22.3.8 Status Register (SISTR)........................................................................................ 813
22.3.9 Interrupt Enable Register (SIIER)......................................................................... 819
22.3.10 FIFO Control Register (SIFCTR) ......................................................................... 821
22.3.11 Transmit Data Assign Register (SITDAR) ........................................................... 823
22.3.12 Receive Data Assign Register (SIRDAR)............................................................. 824
22.3.13 Control Data Assign Register (SICDAR) ............................................................. 825
22.4 Operation ........................................................................................................................... 827
22.4.1 Serial Clocks ......................................................................................................... 827
22.4.2 Serial Timing ........................................................................................................ 829
22.4.3 Transfer Data Format............................................................................................ 830
22.4.4 Register Allocation of Transfer Data .................................................................... 832
22.4.5 Control Data Interface .......................................................................................... 834
22.4.6 FIFO...................................................................................................................... 836
22.4.7 Transmit and Receive Procedures......................................................................... 838
22.4.8 Interrupts............................................................................................................... 843
22.4.9 Transmit and Receive Timing............................................................................... 845
Section 23 Serial Protocol Interface (HSPI) ......................................................849
23.1 Features.............................................................................................................................. 849
23.2 Input/Output Pins ............................................................................................................... 851
23.3 Register Descriptions ......................................................................................................... 851
23.3.1 Control Register (SPCR)....................................................................................... 852
23.3.2 Status Register (SPSR) ......................................................................................... 854
23.3.3 System Control Register (SPSCR)........................................................................ 857
23.3.4 Transmit Buffer Register (SPTBR)....................................................................... 859
23.3.5 Receive Buffer Register (SPRBR)........................................................................ 860
23.4 Operation ........................................................................................................................... 861
23.4.1 Operation Overview without DMA (FIFO Mode Disabled)................................. 861
23.4.2 Operation Overview with DMA ........................................................................... 862
23.4.3 Operation with FIFO Mode Enabled .................................................................... 862
23.4.4 Timing Diagrams .................................................................................................. 863
23.4.5 HSPI Software Reset ............................................................................................ 864
23.4.6 Clock Polarity and Transmit Control .................................................................... 864
23.4.7 Transmit and Receive Routines ............................................................................ 864
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Section 24 Multimedia Card Interface (MMCIF) ............................................. 865
24.1 Features.............................................................................................................................. 865
24.2 Input/Output Pins............................................................................................................... 866
24.3 Register Descriptions......................................................................................................... 867
24.3.1 Command Registers 0 to 5 (CMDR0 to CMDR5)................................................ 871
24.3.2 Command Start Register (CMDSTRT) ................................................................ 872
24.3.3 Operation Control Register (OPCR)..................................................................... 873
24.3.4 Card Status Register (CSTR)................................................................................ 875
24.3.5 Interrupt Control Registers 0 to 2 (INTCR0 to INTCR2)..................................... 877
24.3.6 Interrupt Status Registers 0 to 2 (INTSTR0 to INTSTR2) ................................... 880
24.3.7 Transfer Clock Control Register (CLKON).......................................................... 885
24.3.8 Command Timeout Control Register (CTOCR) ................................................... 886
24.3.9 Transfer Byte Number Count Register (TBCR) ................................................... 887
24.3.10 Mode Register (MODER)..................................................................................... 888
24.3.11 Command Type Register (CMDTYR).................................................................. 889
24.3.12 Response Type Register (RSPTYR)..................................................................... 890
24.3.13 Transfer Block Number Counter (TBNCR).......................................................... 894
24.3.14 Response Registers 0 to 16, D (RSPR0 to RSPR16, RSPRD).............................. 895
24.3.15 Data Timeout Register (DTOUTR) ...................................................................... 897
24.3.16 Data Register (DR) ............................................................................................... 898
24.3.17 FIFO Pointer Clear Register (FIFOCLR) ............................................................. 899
24.3.18 DMA Control Register (DMACR) ....................................................................... 900
24.4 Operation ........................................................................................................................... 901
24.4.1 Operations in MMC Mode.................................................................................... 901
24.5 MMCIF Interrupt Sources.................................................................................................. 931
24.6 Operations when Using DMA ........................................................................................... 932
24.6.1 Operation in Read Sequence................................................................................. 932
24.6.2 Operation in Write Sequence ................................................................................ 942
24.7 Register Accesses with Little Endian Specification........................................................... 953
Section 25 Audio Codec Interface (HAC)......................................................... 955
25.1 Features.............................................................................................................................. 955
25.2 Input/Output Pins............................................................................................................... 956
25.3 Register Descriptions......................................................................................................... 957
25.3.1 Control and Status Register (HACCR) ................................................................. 958
25.3.2 Command/Status Address Register (HACCSAR) ................................................ 960
25.3.3 Command/Status Data Register (HACCSDR)...................................................... 962
25.3.4 PCM Left Channel Register (HACPCML)........................................................... 963
25.3.5 PCM Right Channel Register (HACPCMR) ........................................................ 965
25.3.6 TX Interrupt Enable Register (HACTIER)........................................................... 966
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25.3.7 TX Status Register (HACTSR)............................................................................. 967
25.3.8 RX Interrupt Enable Register (HACRIER)........................................................... 969
25.3.9 RX Status Register (HACRSR) ............................................................................ 970
25.3.10 HAC Control Register (HACACR) ...................................................................... 971
25.4 AC 97 Frame Slot Structure............................................................................................... 973
25.5 Operation ........................................................................................................................... 974
25.5.1 Receiver ................................................................................................................ 974
25.5.2 Transmitter............................................................................................................ 975
25.5.3 DMA ..................................................................................................................... 975
25.5.4 Interrupts............................................................................................................... 975
25.5.5 Initialization Sequence.......................................................................................... 976
25.5.6 Notes ..................................................................................................................... 981
25.5.7 Reference .............................................................................................................. 981
Section 26 Serial Sound Interface (SSI) Module...............................................983
26.1 Features.............................................................................................................................. 983
26.2 Input/Output Pins ............................................................................................................... 984
26.3 Register Descriptions ......................................................................................................... 985
26.3.1 Control Register (SSICR) ..................................................................................... 986
26.3.2 Status Register (SSISR) ........................................................................................ 992
26.3.3 Transmit Data Register (SSITDR)........................................................................ 997
26.3.4 Receive Data Register (SSIRDR) ......................................................................... 997
26.4 Operation ........................................................................................................................... 998
26.4.1 Bus Format............................................................................................................ 998
26.4.2 Non-Compressed Modes....................................................................................... 999
26.4.3 Compressed Modes............................................................................................. 1008
26.4.4 Operation Modes................................................................................................. 1011
26.4.5 Transmit Operation ............................................................................................. 1012
26.4.6 Receive Operation............................................................................................... 1015
26.4.7 Serial Clock Control ........................................................................................... 1018
26.5 Usage Note....................................................................................................................... 1019
26.5.1 Restrictions when an Overflow Occurs during Receive DMA Operation .......... 1019
Section 27 NAND Flash Memory Controller (FLCTL) ..................................1021
27.1 Features............................................................................................................................ 1021
27.2 Input/Output Pins ............................................................................................................. 1024
27.3 Register Descriptions ....................................................................................................... 1025
27.3.1 Common Control Register (FLCMNCR)............................................................ 1026
27.3.2 Command Control Register (FLCMDCR).......................................................... 1028
27.3.3 Command Code Register (FLCMCDR) ............................................................. 1030
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27.4
27.5
27.6
27.7
27.3.4 Address Register (FLADR) ................................................................................ 1030
27.3.5 Data Counter Register (FLDTCNTR) ................................................................ 1032
27.3.6 Data Register (FLDATAR) ................................................................................ 1033
27.3.7 Interrupt DMA Control Register (FLINTDMACR) ........................................... 1034
27.3.8 Ready Busy Timeout Setting Register (FLBSYTMR) ....................................... 1039
27.3.9 Ready Busy Timeout Counter (FLBSYCNT)..................................................... 1040
27.3.10 Data FIFO Register (FLDTFIFO)....................................................................... 1041
27.3.11 Control Code FIFO Register (FLECFIFO)......................................................... 1042
27.3.12 Transfer Control Register (FLTRCR)................................................................. 1043
Operation ......................................................................................................................... 1044
27.4.1 Operating Modes ................................................................................................ 1044
27.4.2 Command Access Mode ..................................................................................... 1044
27.4.3 Sector Access Mode ........................................................................................... 1046
27.4.4 ECC Error Correction ......................................................................................... 1048
27.4.5 Status Read ......................................................................................................... 1049
Example of Register Setting ............................................................................................ 1050
Interrupt Sources.............................................................................................................. 1053
DMA Transfer Specifications .......................................................................................... 1053
Section 28 General Purpose I/O (GPIO) ......................................................... 1055
28.1 Features............................................................................................................................ 1055
28.2 Register Descriptions....................................................................................................... 1060
28.2.1 Port A Control Register (PACR) ........................................................................ 1063
28.2.2 Port B Control Register (PBCR)......................................................................... 1064
28.2.3 Port C Control Register (PCCR)......................................................................... 1066
28.2.4 Port D Control Register (PDCR) ........................................................................ 1067
28.2.5 Port E Control Register (PECR) ......................................................................... 1069
28.2.6 Port F Control Register (PFCR).......................................................................... 1070
28.2.7 Port G Control Register (PGCR) ........................................................................ 1072
28.2.8 Port H Control Register (PHCR) ........................................................................ 1074
28.2.9 Port J Control Register (PJCR) ........................................................................... 1075
28.2.10 Port K Control Register (PKCR) ........................................................................ 1077
28.2.11 Port L Control Register (PLCR) ......................................................................... 1079
28.2.12 Port M Control Register (PMCR) ....................................................................... 1080
28.2.13 Port A Data Register (PADR)............................................................................. 1081
28.2.14 Port B Data Register (PBDR) ............................................................................. 1081
28.2.15 Port C Data Register (PCDR) ............................................................................. 1082
28.2.16 Port D Data Register (PDDR)............................................................................. 1082
28.2.17 Port E Data Register (PEDR).............................................................................. 1083
28.2.18 Port F Data Register (PFDR) .............................................................................. 1084
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28.2.19 Port G Data Register (PGDR)............................................................................. 1084
28.2.20 Port H Data Register (PHDR)............................................................................. 1085
28.2.21 Port J Data Register (PJDR) ............................................................................... 1085
28.2.22 Port K Data Register (PKDR)............................................................................. 1086
28.2.23 Port L Data Register (PLDR).............................................................................. 1086
28.2.24 Port M Data Register (PMDR) ........................................................................... 1087
28.2.25 Port E Pull-Up Control Register (PEPUPR) ....................................................... 1087
28.2.26 Port H Pull-Up Control Register (PHPUPR) ...................................................... 1088
28.2.27 Port J Pull-Up Control Register (PJPUPR)......................................................... 1089
28.2.28 Port K Pull-Up Control Register (PKPUPR) ...................................................... 1090
28.2.29 Port M Pull-Up Control Register (PMPUPR)..................................................... 1091
28.2.30 Input-Pin Pull-Up Control Register 1 (PPUPR1)................................................ 1092
28.2.31 Input-Pin Pull-Up Control Register 2 (PPUPR2)................................................ 1093
28.2.32 On-chip Module Select Register (OMSELR) ..................................................... 1094
28.3 Usage Example ................................................................................................................ 1097
28.3.1 Port Output Function .......................................................................................... 1097
28.3.2 Port Input function .............................................................................................. 1098
28.3.3 On-chip Module Function................................................................................... 1099
Section 29 User Break Controller (UBC) ........................................................1101
29.1 Features............................................................................................................................ 1101
29.2 Register Descriptions ....................................................................................................... 1103
29.2.1 Match Condition Setting Registers 0 and 1 (CBR0 and CBR1) ......................... 1105
29.2.2 Match Operation Setting Registers 0 and 1 (CRR0 and CRR1) ......................... 1111
29.2.3 Match Address Setting Registers 0 and 1 (CAR0 and CAR1)............................ 1113
29.2.4 Match Address Mask Setting Registers 0 and 1 (CAMR0 and CAMR1)........... 1114
29.2.5 Match Data Setting Register 1 (CDR1) .............................................................. 1115
29.2.6 Match Data Mask Setting Register 1 (CDMR1) ................................................. 1116
29.2.7 Execution Count Break Register 1 (CETR1) ...................................................... 1117
29.2.8 Channel Match Flag Register (CCMFR) ............................................................ 1118
29.2.9 Break Control Register (CBCR) ......................................................................... 1119
29.3 Operation Description ...................................................................................................... 1120
29.3.1 Definition of Words Related to Accesses ........................................................... 1120
29.3.2 User Break Operation Sequence ......................................................................... 1121
29.3.3 Instruction Fetch Cycle Break ............................................................................ 1122
29.3.4 Operand Access Cycle Break.............................................................................. 1123
29.3.5 Sequential Break ................................................................................................. 1124
29.3.6 Program Counter Value to be Saved................................................................... 1126
29.4 User Break Debugging Support Function ........................................................................ 1127
29.5 User Break Examples....................................................................................................... 1128
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29.6 Usage Notes ..................................................................................................................... 1132
Section 30 User Debugging Interface (H-UDI)............................................... 1135
30.1 Features............................................................................................................................ 1135
30.2 Input/Output Pins............................................................................................................. 1137
30.3 Boundary Scan TAP Controllers
(IDCODE, EXTEST, SAMPLE/PRELOAD, and BYPASS) .......................................... 1138
30.4 Register Descriptions....................................................................................................... 1140
30.4.1 Instruction Register (SDIR) ................................................................................ 1141
30.4.2 Interrupt Source Register (SDINT)..................................................................... 1142
30.4.3 Bypass Register (SDBPR) .................................................................................. 1142
30.4.4 Boundary Scan Register (SDBSR) ..................................................................... 1143
30.5 Operation ......................................................................................................................... 1152
30.5.1 TAP Control ....................................................................................................... 1152
30.5.2 H-UDI Reset ....................................................................................................... 1153
30.5.3 H-UDI Interrupt .................................................................................................. 1153
30.6 Usage Notes ..................................................................................................................... 1154
Section 31 Electrical Characteristics ............................................................... 1155
31.1 Absolute Maximum Ratings ............................................................................................ 1155
31.2 DC Characteristics ........................................................................................................... 1156
31.3 AC Characteristics ........................................................................................................... 1159
31.3.1 Clock and Control Signal Timing ....................................................................... 1160
31.3.2 Control Signal Timing ........................................................................................ 1163
31.3.3 Bus Timing ......................................................................................................... 1164
31.3.4 DDRIF Signal Timing ........................................................................................ 1182
31.3.5 INTC Module Signal Timing.............................................................................. 1186
31.3.6 PCIC Module Signal Timing .............................................................................. 1188
31.3.7 DMAC Module Signal Timing ........................................................................... 1190
31.3.8 TMU Module Signal Timing .............................................................................. 1191
31.3.9 CMT Module Signal Timing .............................................................................. 1192
31.3.10 SCIF Module Signal Timing............................................................................... 1193
31.3.11 SIOF Module Signal Timing .............................................................................. 1195
31.3.12 HSPI Module Signal Timing .............................................................................. 1199
31.3.13 MMCIF Module Signal Timing.......................................................................... 1201
31.3.14 HAC Interface Module Signal Timing ............................................................... 1203
31.3.15 SSI Interface Module Signal Timing .................................................................. 1205
31.3.16 FLCTL Module Signal Timing........................................................................... 1207
31.3.17 GPIO Signal Timing ........................................................................................... 1211
31.3.18 H-UDI Module Signal Timing............................................................................ 1212
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31.4 AC Characteristic Test Conditions................................................................................... 1214
31.5 Change in Delay Time Based on Load Capacitance ........................................................ 1215
Appendix ..........................................................................................................1217
A.
B.
C.
D.
E.
F.
G.
H.
I.
J.
CPU Operation Mode Register (CPUOPM) .................................................................... 1217
Instruction Prefetching and Its Side Effects..................................................................... 1219
Speculative Execution for Subroutine Return.................................................................. 1220
Register Address Map...................................................................................................... 1221
Package Dimensions ........................................................................................................ 1255
Mode Pin Settings ............................................................................................................ 1256
Pin Functions ................................................................................................................... 1258
G.1
Pin States ............................................................................................................ 1258
G.2
Handling of Unused Pins .................................................................................... 1267
Turning On and Off Power Supply .................................................................................. 1275
Version Registers (PVR, PRR) ........................................................................................ 1276
Part Number List.............................................................................................................. 1277
Index ................................................................................................................1279
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Rev.1.00 Dec. 13, 2005 Page xxviii of l
Figures
Section 1
Figure 1.1
Figure 1.2
Figure 1.3
Figure 1.4
Overview
SH7780 Block Diagram ................................................................................................ 9
SH7780 Pin Arrangement............................................................................................ 10
Physical Address Space of SH7780............................................................................. 28
Relationship between AREASEL Bits and Memory Address Map............................. 29
Section 2
Figure 2.1
Figure 2.2
Figure 2.3
Figure 2.4
Figure 2.5
Figure 2.6
Figure 2.7
Figure 2.8
Programming Model
Data Formats ............................................................................................................... 33
CPU Register Configuration in Each Processing Mode .............................................. 36
General Registers ........................................................................................................ 37
Floating-Point Registers .............................................................................................. 39
Relationship between SZ bit and Endian..................................................................... 45
Formats of Byte Data and Word Data in Register ....................................................... 47
Data Formats in Memory............................................................................................. 48
Processing State Transitions........................................................................................ 49
Section 4
Figure 4.1
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Figure 4.2
Pipelining
Basic Pipelines ............................................................................................................ 73
Instruction Execution Patterns (1) ............................................................................... 75
Instruction Execution Patterns (2) ............................................................................... 76
Instruction Execution Patterns (3) ............................................................................... 77
Instruction Execution Patterns (4) ............................................................................... 78
Instruction Execution Patterns (5) ............................................................................... 79
Instruction Execution Patterns (6) ............................................................................... 80
Instruction Execution Patterns (7) ............................................................................... 81
Instruction Execution Patterns (8) ............................................................................... 82
Instruction Execution Patterns (9) ............................................................................... 83
Section 5 Exception Handling
Figure 5.1 Instruction Execution and Exception Handling......................................................... 105
Figure 5.2 Example of General Exception Acceptance Order .................................................... 106
Section 6
Figure 6.1
Figure 6.2
Figure 6.3
Figure 6.4
Figure 6.5
Floating-Point Unit (FPU)
Format of Single-Precision Floating-Point Number.................................................. 130
Format of Double-Precision Floating-Point Number ................................................ 130
Single-Precision NaN Bit Pattern .............................................................................. 133
Floating-Point Registers ............................................................................................ 136
Relation between SZ Bit and Endian......................................................................... 139
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Section 7 Memory Management Unit (MMU)
Figure 7.1 Role of MMU............................................................................................................ 149
Figure 7.2 Virtual Address Space (AT in MMUCR = 0)............................................................ 150
Figure 7.3 Virtual Address Space (AT in MMUCR = 1)............................................................ 151
Figure 7.4 P4 Area...................................................................................................................... 153
Figure 7.5 Physical Address Space............................................................................................. 154
Figure 7.6 UTLB Configuration ................................................................................................. 167
Figure 7.7 Relationship between Page Size and Address Format............................................... 169
Figure 7.8 ITLB Configuration................................................................................................... 170
Figure 7.9 Flowchart of Memory Access Using UTLB.............................................................. 171
Figure 7.10 Flowchart of Memory Access Using ITLB ............................................................. 172
Figure 7.11 Operation of LDTLB Instruction............................................................................. 175
Figure 7.12 Memory-Mapped ITLB Address Array................................................................... 184
Figure 7.13 Memory-Mapped ITLB Data Array ........................................................................ 185
Figure 7.14 Memory-Mapped UTLB Address Array ................................................................. 187
Figure 7.15 Memory-Mapped UTLB Data Array....................................................................... 188
Figure 7.16 Physical Address Space (32-Bit Address Extended Mode)..................................... 188
Figure 7.17 PMB Configuration ................................................................................................. 190
Figure 7.18 Memory-Mapped PMB Address Array ................................................................... 193
Figure 7.19 Memory-Mapped PMB Data Array......................................................................... 193
Section 8
Figure 8.1
Figure 8.2
Figure 8.3
Figure 8.4
Figure 8.5
Figure 8.6
Figure 8.7
Figure 8.8
Figure 8.9
Caches
Configuration of Operand Cache (OC) ..................................................................... 198
Configuration of Instruction Cache (IC) ................................................................... 199
Configuration of Write-Back Buffer ......................................................................... 211
Configuration of Write-Through Buffer.................................................................... 211
Memory-Mapped IC Address Array ......................................................................... 218
Memory-Mapped IC Data Array ............................................................................... 219
Memory-Mapped OC Address Array........................................................................ 221
Memory-Mapped OC Data Array ............................................................................. 222
Store Queue Configuration........................................................................................ 223
Section 10
Figure 10.1
Figure 10.2
Figure 10.3
Figure 10.4
Figure 10.5
Interrupt Controller (INTC)
Block Diagram of INTC.......................................................................................... 244
Example of IRL Interrupt Connection..................................................................... 297
On-chip Module Interrupt Priority .......................................................................... 301
Interrupt Operation Flowchart................................................................................. 309
Example of Interrupt Handling Routine .................................................................. 312
Section 11 Local Bus State Controller (LBSC)
Figure 11.1 LBSC Block Diagram ............................................................................................. 317
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Figure 11.2 Correspondence between Virtual Address Space and External Memory
Space of LBSC........................................................................................................ 321
Figure 11.3 External Memory Space Allocation (29-bit address mode)..................................... 323
Figure 11.4 Basic Timing of SRAM Interface............................................................................ 362
Figure 11.5 Example of 32-Bit Data-Width SRAM Connection ................................................ 363
Figure 11.6 Example of 16-Bit Data-Width SRAM Connection ................................................ 364
Figure 11.7 Example of 8-Bit Data-Width SRAM Connection .................................................. 365
Figure 11.8 SRAM Interface Wait Timing (Software Wait Only) ............................................. 366
Figure 11.9 SRAM Interface Wait Timing
(Wait Cycle Insertion by RDY Signal, RDY Signal is synchronous input) ............ 367
Figure 11.10 SRAM Interface Wait Timing (Read-Strobe Negate Timing Setting) .................. 369
Figure 11.11 Burst ROM Basic Timing...................................................................................... 371
Figure 11.12 Burst ROM Wait Timing....................................................................................... 371
Figure 11.13 Burst ROM Wait Timing....................................................................................... 372
Figure 11.14 CExx and DACK Output of ATA Complement Mode in DMA Transfer............. 374
Figure 11.15 Example of PCMCIA Interface ............................................................................. 377
Figure 11.16 Basic Timing for PCMCIA Memory Card Interface ............................................. 378
Figure 11.17 Wait Timing for PCMCIA Memory Card Interface .............................................. 379
Figure 11.18 Basic Timing for PCMCIA I/O Card Interface ..................................................... 380
Figure 11.19 Wait Timing for PCMCIA I/O Card Interface ...................................................... 381
Figure 11.20 Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface ............................. 382
Figure 11.21 Example of 32-Bit Data Width MPX Connection ................................................. 384
Figure 11.22 MPX Interface Timing 1 (Single Read Cycle, IW = 0, No External Wait) ........... 384
Figure 11.23 MPX Interface Timing 2 (Single Read, IW = 0, One External Wait Inserted)...... 385
Figure 11.24 MPX Interface Timing 3 (Single Write Cycle, IW = 0, No External Wait) .......... 385
Figure 11.25 MPX Interface Timing 4
(Single Write Cycle, IW = 1, One External Wait Inserted).................................. 386
Figure 11.26 MPX Interface Timing 5
(Burst Read Cycle, IW = 0, No External Wait, 32-Byte Data Transfer) ............... 386
Figure 11.27 MPX Interface Timing 6
(Burst Read Cycle, IW = 0, External Wait Control, 32-Byte Data Transfer)........ 387
Figure 11.28 MPX Interface Timing 7
(Burst Write Cycle, IW = 0, No External Wait, 32-Byte Data Transfer) .............. 387
Figure 11.29 MPX Interface Timing 8
(Burst Write Cycle, IW = 1, External Wait Control, 32-Byte Data Transfer) ....... 388
Figure 11.30 Example of 32-Bit Data-Width Byte-Control SRAM ........................................... 389
Figure 11.31 Byte-Control SRAM Basic Read Cycle (No Wait) ............................................... 390
Figure 11.32 Byte-Control SRAM Basic Read Cycle (One Internal Wait Cycle)...................... 391
Figure 11.33 Byte-Control SRAM Basic Read Cycle
(One Internal Wait + One External Wait).............................................................. 392
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Figure 11.34 Wait Cycles between Access Cycles ..................................................................... 394
Figure 11.35 Arbitration Sequence............................................................................................. 396
Figure 11.36 Example of the Bus Release Restraint by the DMAC CHCR LCKN bit .............. 398
Section 12
Figure 12.1
Figure 12.2
Figure 12.3
Figure 12.4
DDR-SDRAM Interface (DDRIF)
DDRIF Block Diagram ........................................................................................... 402
Physical Address Space of This LSI ....................................................................... 405
Data Alignment in DDR-SDRAM and DDRIF....................................................... 409
Relationship between Write Values in SDMR and
Output Signals to Memory Pins .............................................................................. 423
Figure 12.5 DDRIF Basic Timing
(1-/2-/4-/8-Byte Single Burst Read without Auto Precharge) ................................. 430
Figure 12.6 DDRIF Basic Timing
(1-/2-/4-/8-Byte Single Burst Write without Auto Precharge) ................................ 431
Figure 12.7 DDRIF Basic Timing (1-/2-/4-/8-Byte Single Burst Read with Auto Precharge)... 432
Figure 12.8 DDRIF Basic Timing
(1-/2-/4-/8-Byte Single Burst Write with Auto Precharge) ..................................... 433
Figure 12.9 DDRIF Basic Timing (4 Burst Read: 32-byte without Auto Precharge)................. 434
Figure 12.10 DDRIF Basic Timing (4 Burst Write: 32-byte without Auto Precharge).............. 435
Figure 12.11 DDRIF Basic Timing (from Precharging All Banks to Bank Activation)............. 436
Figure 12.12 DDRIF Basic Timing (Mode Register Setting)..................................................... 437
Figure 12.13 DDRIF Basic Timing (Enter Auto-Refresh/Exit to Bank Activation)................... 438
Figure 12.14 DDRIF Basic Timing (Enter Self-Refresh/Exit to Command Issuing) ................. 439
Section 13
Figure 13.1
Figure 13.2
Figure 13.3
PCI Controller (PCIC)
PCIC Block Diagram .............................................................................................. 445
SuperHyway Bus to PCI Local Bus Access ............................................................ 525
SuperHyway Bus to PCI Local Bus Address Translation
(PCI Memory Space 0) ........................................................................................... 526
Figure 13.4 SuperHyway Bus to PCI Local Bus Address Translation
(PCI Memory Space 1) ........................................................................................... 527
Figure 13.5 SuperHyway Bus to PCI Local Bus Address Translation
(PCI Memory Space 2)............................................................................................ 527
Figure 13.6 SuperHyway Bus to PCI Local Bus Address Translation (PCI I/O) ....................... 528
Figure 13.7 Endian Conversion from SuperHyway Bus to PCI Local bus
(Non-Byte Swapping: TBS = 0) .............................................................................. 530
Figure 13.8 Endian Conversion from SuperHyway Bus to PCI Local bus
(Byte Swapping: TBS = 1)...................................................................................... 531
Figure 13.9 PCI local bus to SuperHyway bus Memory Map .................................................... 532
Figure 13.10 PCI Local Bus to SuperHyway Bus Address Translation
(Local Address Space 0/1)..................................................................................... 534
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Figure 13.11 PCI Local Bus to SuperHyway Bus Address Translation (PCIC I/O Space) ........ 535
Figure 13.12 Endian Conversion from PCI Local Bus to SuperHyway bus
(Non-Byte Swapping: TBS = 0) ............................................................................ 537
Figure 13.13 Endian Conversion from PCI Local Bus to SuperHyway bus
(Non-Byte Swapping: TBS = 1) ............................................................................ 538
Figure 13.14 Cache Flush/Purge Execution Flow for PCI local Bus to SuperHyway Bus......... 540
Figure 13.15 Address Generation for Type 0 Configuration Access.......................................... 542
Figure 13.16 PCI Local Bus Power Down State Transition ....................................................... 545
Figure 13.17 Master Write Cycle in Host Bus Bridge Mode (Single)........................................ 546
Figure 13.18 Master Read Cycle in Host Bus Bridge Mode (Single)......................................... 547
Figure 13.19 Master Write Cycle in Normal Mode (Burst)........................................................ 548
Figure 13.20 Master Read Cycle in Normal Mode (Burst)......................................................... 549
Figure 13.21 Target Read Cycle in Normal Mode (Single)........................................................ 551
Figure 13.22 Target Write Cycle in Normal Mode (Single)....................................................... 552
Figure 13.23 Target Memory Read Cycle in Host Bus Bridge Mode (Burst) ............................ 553
Figure 13.24 Target Memory Write Cycle in Host Bus Bridge Mode (Burst) ........................... 554
Figure 13.25 Master Write Cycle in Host Bus Bridge Mode (Burst, with stepping) .................. 555
Figure 13.26 Target Memory Read Cycle in Host Bus Bridge Mode (Burst, with stepping)..... 556
Section 14
Figure 14.1
Figure 14.2
Figure 14.3
Direct Memory Access Controller (DMAC)
Block Diagram of DMAC ....................................................................................... 558
Round-Robin Mode (example of channel 0 to 5) .................................................... 593
Changes in Channel Priority in Round-Robin Mode
(example of channel 0 to 5)..................................................................................... 594
Figure 14.4 Data Flow of Dual Address Mode........................................................................... 595
Figure 14.5 Example of DMA Transfer Timing in Dual Address Mode
(Source: Ordinary Memory, Destination: Ordinary Memory) ................................ 596
Figure 14.6 DMA Transfer Timing Example in Cycle-Steal Normal Mode 1
(DREQ Low Level Detection) ................................................................................ 597
Figure 14.7 DMA Transfer Timing Example in Cycle-Steal Normal Mode 2
(DREQ Low Level Detection) ................................................................................ 598
Figure 14.8 Example of DMA Transfer Timing in Cycle Steal Intermittent Mode
(DREQ Low Level Detection) ................................................................................ 598
Figure 14.9 DMA Transfer Timing Example in Burst Mode (DREQ Low Level Detection) .... 599
Figure 14.10 Bus State when Multiple Channels are Operating ................................................. 602
Figure 14.11 DMA Transfer Flowchart ...................................................................................... 603
Figure 14.12 Reload Mode Transfer........................................................................................... 605
Figure 14.13 Example of DREQ Input Detection in Cycle Steal Mode Edge Detection............ 606
Figure 14.14 Example of DREQ Input Detection in Cycle Steal Mode Level Detection........... 606
Figure 14.15 Example of DREQ Input Detection in Burst Mode Edge Detection ..................... 607
Figure 14.16 Example of DREQ Input Detection in Burst Mode Level Detection .................... 607
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Section 15
Figure 15.1
Figure 15.2
Figure 15.3
Clock Pulse Generator (CPG)
Block Diagram of CPG ........................................................................................... 614
Points for Attention when Using Crystal Resonator................................................ 622
Points for Attention when Using PLL and DLL Circuit.......................................... 623
Section 16
Figure 16.1
Figure 16.2
Figure 16.3
Figure 16.4
Figure 16.5
Figure 16.6
Watchdog Timer and Reset
Block Diagram of WDT .......................................................................................... 626
WDT Counting Up Operation ................................................................................. 635
STATUS Output during Power-on.......................................................................... 637
STATUS Output by Reset input during Normal Operation .................................... 637
STATUS Output by Reset input during Sleep Mode .............................................. 638
STATUS Output by Watchdog timer overflow Power-On Reset
during Normal Operation ........................................................................................ 639
Figure 16.7 STATUS Output by Watchdog timer overflow Power-On Reset
during Sleep Mode .................................................................................................. 639
Figure 16.8 STATUS Output by Watchdog timer overflow Manual Reset
during Normal Operation........................................................................................ 640
Figure 16.9 STATUS Output by Watchdog timer overflow Manual Reset
during Sleep Mode.................................................................................................. 641
Section 17 Power-Down Mode
Figure 17.1 DDR-SDRAM Interface Operation when
Turning System Power Supply On/Off ................................................................... 650
Figure 17.2 Sequence for Turning Off System Power Supply in Self-Refresh Mode ................ 652
Figure 17.3 Sequence for Turning System Power Supply On/Off.............................................. 654
Figure 17.4 Mode Transition Diagram ....................................................................................... 655
Figure 17.5 Status Pins Output from Sleep to Interrupt.............................................................. 656
Section 18
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
Figure 18.7
Timer Unit (TMU)
Block Diagram of TMU .......................................................................................... 658
Example of Count Operation Setting Procedure ..................................................... 670
TCNT Auto-Reload Operation ................................................................................ 671
Count Timing when Operating on Internal Clock ................................................... 671
Count Timing when Operating on External Clock .................................................. 672
Count Timing when Operating on on-chip RTC output Clock ............................... 672
Operation Timing when Using Input Capture Function .......................................... 673
Section 19
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Timer/Counter (CMT)
Block Diagram of CMT .......................................................................................... 678
Edge Detection (example of rising edge) ................................................................ 691
32-Bit Timer Mode: Input Capture (channel 1 and channel 0)................................ 692
32-bit Timer mode: Input Capture Operation Timing ............................................. 692
Rev.1.00 Dec. 13, 2005 Page xxxiv of l
Figure 19.5 CMT_CTRn Assert Timing (channel 0 and 1) ........................................................ 694
Figure 19.6 32-Bit Timer Mode: Output Compare (channel 1 and channel 0) ........................... 694
Figure 19.7 32-bit Timer Mode: Output Compare Operation Timing
(Example of High output in Active and Not Active by CMTCHnST).................... 695
Figure 19.8 32-bit Timer Mode: Output Compare Operation Timing
(Example of High output in Active and Not Active by CMTFRT)......................... 695
Figure 19.9 16-Bit Timer Mode: Input Capture (channel 1 and channel 0)................................ 697
Figure 19.10 16-Bit Timer Mode: Input Capture Operation Timing .......................................... 698
Figure 19.11 16-Bit Timer Mode: Output Compare
(CMT_CTR pins are available for channel 1 and channel 0) ................................ 699
Figure 19.12 16-Bit Timer Mode: Output Compare Operation Timing ..................................... 700
Figure 19.13 Up-Counter Mode (channel 1 and channel 0)........................................................ 701
Figure 19.14 Up-counter Mode Operation Timing..................................................................... 701
Figure 19.15 Updown-Counter Mode (only channel 0).............................................................. 703
Figure 19.16 Updown-Counter Mode: Countdown Operation Timing (only channel 0)............ 703
Figure 19.17 Rotary Switch Operation Count-Up Timing.......................................................... 705
Figure 19.18 Rotary Switch Operation Count-Down Timing..................................................... 705
Section 20
Figure 20.1
Figure 20.2
Figure 20.3
Figure 20.4
Figure 20.5
Figure 20.6
Realtime Clock (RTC)
Block Diagram of RTC ........................................................................................... 708
Examples of Time Setting Procedures..................................................................... 727
Examples of Time Reading Procedures................................................................... 728
Example of Use of Alarm Function......................................................................... 729
Example of Crystal Oscillator Circuit Connection .................................................. 731
Interrupt Request Signal Generation Timing of Complex Sources ......................... 732
Section 21
Figure 21.1
Figure 21.2
Figure 21.3
Figure 21.4
Figure 21.5
Figure 21.6
Figure 21.7
Serial Communication Interface with FIFO (SCIF)
Block Diagram of SCIF........................................................................................... 735
SCIF0_RTS Pin (Only in Channel 0) ...................................................................... 736
SCIF0_CTS Pin (Only in Channel 0) ...................................................................... 736
SCIFn_SCK Pin (n = 0, 1)....................................................................................... 737
SCIFn_TXD Pin (n = 0, 1) ...................................................................................... 737
SCIFn_RXD Pin (n = 0, 1)...................................................................................... 738
Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, and Two Stop Bits) ........................................... 772
Figure 21.8 Sample SCIF Initialization Flowchart ..................................................................... 775
Figure 21.9 Sample Serial Transmission Flowchart ................................................................... 776
Figure 21.10 Sample SCIF Transmission Operation
(Example with 8-Bit Data, Parity, One Stop Bit).................................................. 778
Figure 21.11 Sample Operation Using Modem Control (SCIF0_CTS) (Only in Channel 0) ..... 778
Figure 21.12 Sample Serial Reception Flowchart (1)................................................................. 779
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Figure 21.12 Sample Serial Reception Flowchart (2)................................................................. 780
Figure 21.13 Sample SCIF Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit) .................................................. 782
Figure 21.14 Sample Operation Using Modem Control (SCIF0_RTS) (Only in Channel 0)..... 782
Figure 21.15 Data Format in Clocked Synchronous Communication ........................................ 783
Figure 21.16 Sample SCIF Initialization Flowchart ................................................................... 785
Figure 21.17 Sample Serial Transmission Flowchart ................................................................. 786
Figure 21.18 Sample SCIF Transmission Operation in Clocked Synchronous Mode................ 787
Figure 21.19 Sample Serial Reception Flowchart (1)................................................................. 788
Figure 21.19 Sample Serial Reception Flowchart (2)................................................................. 789
Figure 21.20 Sample SCIF Reception Operation in Clocked Synchronous Mode ..................... 790
Figure 21.21 Sample Simultaneous Serial Transmission and Reception Flowchart................... 791
Figure 21.22 Receive Data Sampling Timing in Asynchronous Mode ...................................... 795
Figure 21.23 Example of Synchronization Clock Transfer by DMAC ...................................... 796
Section 22 Serial I/O with FIFO (SIOF)
Figure 22.1 Block Diagram of SIOF .......................................................................................... 798
Figure 22.2 Serial Clock Supply................................................................................................. 827
Figure 22.3 Serial Data Synchronization Timing ....................................................................... 829
Figure 22.4 SIOF Transmit/Receive Timing .............................................................................. 830
Figure 22.5 Transmit/Receive Data Bit Alignment .................................................................... 832
Figure 22.6 Control Data Bit Alignment .................................................................................... 833
Figure 22.7 Control Data Interface (Slot Position)..................................................................... 834
Figure 22.8 Control Data Interface (Secondary FS) ................................................................... 835
Figure 22.9 Example of Transmit Operation in Master Mode.................................................... 838
Figure 22.10 Example of Receive Operation in Master Mode ................................................... 839
Figure 22.11 Example of Transmit Operation in Slave Mode .................................................... 840
Figure 22.12 Example of Receive Operation in Slave Mode ..................................................... 841
Figure 22.13 Transmit and Receive Timing (8-Bit Monaural Data (1))..................................... 845
Figure 22.14 Transmit and Receive Timing (8-Bit Monaural Data (2))..................................... 845
Figure 22.15 Transmit and Receive Timing (16-Bit Monaural Data) ........................................ 846
Figure 22.16 Transmit and Receive Timing (16-Bit Stereo Data (1)) ........................................ 846
Figure 22.17 Transmit and Receive Timing (16-Bit Stereo Data (2)) ........................................ 847
Figure 22.18 Transmit and Receive Timing (16-Bit Stereo Data (3)) ........................................ 847
Figure 22.19 Transmit and Receive Timing (16-Bit Stereo Data (4)) ........................................ 848
Figure 22.20 Transmit and Receive Timing (16-Bit Stereo Data).............................................. 848
Section 23
Figure 23.1
Figure 23.2
Figure 23.3
Serial Protocol Interface (HSPI)
Block Diagram of HSPI .......................................................................................... 850
Operational Flowchart............................................................................................. 861
Timing Conditions when FBS = 0........................................................................... 863
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Figure 23.4 Timing Conditions when FBS = 1........................................................................... 864
Section 24
Figure 24.1
Figure 24.2
Figure 24.3
Multimedia Card Interface (MMCIF)
Block Diagram of MMCIF...................................................................................... 866
DR Access Example ................................................................................................ 899
Example of Command Sequence for Commands
Not Requiring Command Response ........................................................................ 903
Figure 24.4 Example of Operational Flow for Commands
Not Requiring Command Response ........................................................................ 904
Figure 24.5 Example of Command Sequence for Commands without Data Transfer
(No Data Busy State)............................................................................................... 905
Figure 24.6 Example of Command Sequence for Commands without Data Transfer
(with Data Busy State)............................................................................................. 906
Figure 24.7 Example of Operational Flow for Commands without Data Transfer..................... 907
Figure 24.8 Example of Command Sequence for Commands with Read Data
(Block Size ≤ FIFO Size) ........................................................................................ 909
Figure 24.9 Example of Command Sequence for Commands with Read Data
(Block Size > FIFO Size) ........................................................................................ 910
Figure 24.10 Example of Command Sequence for Commands with Read Data
(Multiple Block Transfer)...................................................................................... 911
Figure 24.11 Example of Command Sequence for Commands with Read Data
(Stream Transfer)................................................................................................... 912
Figure 24.12 Example of Operational Flow for Commands with Read Data
(Single Block Transfer) ......................................................................................... 913
Figure 24.13 Example of Operational Flow for Commands with Read Data (1)
(Open-ended Multiple Block Transfer) ................................................................. 914
Figure 24.13 Example of Operational Flow for Commands with Read Data (2)
(Open-ended Multiple Block Transfer).................................................................. 915
Figure 24.13 Example of Operational Flow for Commands with Read Data (3)
(Pre-defined Multiple Block Transfer) .................................................................. 916
Figure 24.13 Example of Operational Flow for Commands with Read Data (4)
(Pre-defined Multiple Block Transfer) .................................................................. 917
Figure 24.14 Example of Operational Flow for Commands with Read Data
(Stream Transfer) .................................................................................................. 918
Figure 24.15 Example of Command Sequence for Commands with Write Data
(Block Size ≤ FIFO Size) ...................................................................................... 921
Figure 24.16 Example of Command Sequence for Commands with Write Data
(Block Size > FIFO Size) ...................................................................................... 922
Figure 24.17 Example of Command Sequence for Commands with Write Data
(Multiple Block Transfer) ..................................................................................... 923
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Figure 24.18 Example of Command Sequence for Commands with Write Data
(Stream Transfer)................................................................................................... 924
Figure 24.19 Example of Operational Flow for Commands with Write Data
(Single Block Transfer) ......................................................................................... 925
Figure 24.20 Example of Operational Flow for Commands with Write Data (1)
(Open-ended Multiple Block Transfer) ................................................................. 926
Figure 24.20 Example of Operational Flow for Commands with Write Data (2)
(Open-ended Multiple Block Transfer) ................................................................. 927
Figure 24.20 Example of Operational Flow for Commands with Write Data (3)
(Pre-defined Multiple Block Transfer).................................................................. 928
Figure 24.20 Example of Operational Flow for Commands with Write Data (4)
(Pre-defined Multiple Block Transfer).................................................................. 929
Figure 24.21 Example of Operational Flow for Commands with Write Data
(Stream Transfer) .................................................................................................. 930
Figure 24.22 Example of Read Sequence Flow (Single Block Transfer) ................................... 934
Figure 24.23 Example of Read Sequence Flow (1) (Open-ended Multiple Block Transfer)...... 935
Figure 24.23 Example of Read Sequence Flow (2) (Open-ended Multiple Block Transfer)...... 936
Figure 24.23 Example of Read Sequence Flow (3) (Pre-defined Multiple Block Transfer) ...... 937
Figure 24.23 Example of Read Sequence Flow (4) (Pre-defined Multiple Block Transfer) ...... 938
Figure 24.24 Example of Operational Flow for Stream Read Transfer ...................................... 939
Figure 24.25 Example of Operational Flow for Auto-mode
Pre-defined Multiple Block Read Transfer (1)...................................................... 940
Figure 24.25 Example of Operational Flow for Auto-mode
Pre-defined Multiple Block Read Transfer (2) ...................................................... 941
Figure 24.26 Example of Write Sequence Flow (1) (Single Block Transfer)............................. 944
Figure 24.26 Example of Write Sequence Flow (2) (Single Block Transfer)............................. 945
Figure 24.27 Example of Write Sequence Flow (1) (Open-ended Multiple Block Transfer)..... 946
Figure 24.27 Example of Write Sequence Flow (2) (Open-ended Multiple Block Transfer)..... 947
Figure 24.27 Example of Write Sequence Flow (3) (Pre-defined Multiple Block Transfer)...... 948
Figure 24.27 Example of Write Sequence Flow (4) (Pre-defined Multiple Block Transfer)...... 949
Figure 24.28 Example of Operational Flow for Stream Write Transfer ..................................... 950
Figure 24.29 Example of Operational Flow for Auto-mode
Pre-defined Multiple Block Write Transfer (1)..................................................... 951
Figure 24.29 Example of Operational Flow for Auto-mode
Pre-defined Multiple Block Write Transfer (2)..................................................... 952
Section 25
Figure 25.1
Figure 25.2
Figure 25.3
Figure 25.4
Audio Codec Interface (HAC)
Block Diagram ........................................................................................................ 956
AC97 Frame Slot Structure ..................................................................................... 973
Initialization Sequence ............................................................................................ 976
Sample Flowchart for Off-Chip Codec Register Write ........................................... 977
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Figure 25.5 Sample Flowchart for Off-Chip Codec Register Read (1) ...................................... 978
Figure 25.6 Sample Flowchart for Off-Chip Codec Register Read (2) ...................................... 979
Figure 25.7 Sample Flowchart for Off-Chip Codec Register Read (3) ...................................... 980
Section 26
Figure 26.1
Figure 26.2
Figure 26.3
Figure 26.4
Figure 26.5
Figure 26.6
Figure 26.7
Figure 26.8
Serial Sound Interface (SSI) Module
Block Diagram of SSI Module ................................................................................ 984
Philips Format (with no Padding).......................................................................... 1000
Philips Format (with Padding)............................................................................... 1000
Sony Format (with Serial Data First, Followed by Padding Bits) ......................... 1001
Matsushita Format (with Padding Bits First, Followed by Serial Data)................ 1001
Multi-channel Format (4 Channels, No Padding).................................................. 1003
Multi-channel Format (6 Channels with High Padding) ....................................... 1003
Multi-channel Format (8 Channels, with Padding Bits First,
Followed by Serial Data, with Padding)................................................................ 1004
Figure 26.9 Basic Sample Format
(Transmit Mode with Example System/Data Word Length)................................. 1005
Figure 26.10 Inverted Clock ..................................................................................................... 1005
Figure 26.11 Inverted Word Select........................................................................................... 1006
Figure 26.12 Inverted Padding Polarity .................................................................................... 1006
Figure 26.13 Padding Bits First, Followed by Serial Data, with Delay.................................... 1006
Figure 26.14 Padding Bits First, Followed by Serial Data, without Delay............................... 1007
Figure 26.15 Serial Data First, Followed by Padding Bits, without Delay............................... 1007
Figure 26.16 Parallel Right Aligned with Delay....................................................................... 1007
Figure 26.17 Mute Enabled ...................................................................................................... 1008
Figure 26.18 Compressed Data Format, Slave Transmitter, Burst Mode Disabled .................. 1009
Figure 26.19 Compressed Data Format, Slave Transmitter, and Burst Mode Enabled ............ 1009
Figure 26.20 Transition Diagram between Operation Modes................................................... 1011
Figure 26.21 Transmission Using DMA Controller ................................................................. 1013
Figure 26.22 Transmission using Interrupt Data Flow Control ................................................ 1014
Figure 26.23 Reception using DMA Controller........................................................................ 1016
Figure 26.24 Reception using Interrupt Data Flow Control ..................................................... 1017
Section 27
Figure 27.1
Figure 27.2
Figure 27.3
Figure 27.4
Figure 27.5
NAND Flash Memory Controller (FLCTL)
FLCTL Block Diagram ......................................................................................... 1023
Read Operation Timing for NAND-Type Flash Memory (1)................................ 1044
Programming Operation Timing for NAND-Type Flash Memory (1) .................. 1045
Programming Operation Timing for NAND-Type Flash Memory (2) .................. 1045
Relationship between DMA Transfer and Sector (Data and Control Code),
and Memory and DMA Transfer........................................................................... 1046
Figure 27.6 Relationship between Sector Number and Address Expansion of
NAND-Type Flash Memory.................................................................................. 1047
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Figure 27.7 Sector Access when Unusable Sector Exists in Continuous Sectors..................... 1048
Figure 27.8 NAND Flash Command Access (Block Erase)..................................................... 1050
Figure 27.9 NAND Flash Sector Access (Flash Write) Using DMA ....................................... 1051
Figure 27.10 NAND Flash Command Access (Flash Read) .................................................... 1052
Section 28 General Purpose I/O (GPIO)
Figure 28.1 Port Data Output Timing (Example of Port A) ..................................................... 1097
Figure 28.2 Port Data input Timing (Example of Port A) ........................................................ 1098
Section 29 User Break Controller (UBC)
Figure 29.1 Block Diagram of UBC......................................................................................... 1102
Figure 29.2 Flowchart of User Break Debugging Support Function ........................................ 1127
Section 30
Figure 30.1
Figure 30.2
Figure 30.3
Figure 30.4
User Debugging Interface (H-UDI)
H-UDI Block Diagram .......................................................................................... 1136
Sequence for Switching from Boundary-Scan TAP Controller to H-UDI ............ 1139
TAP Controller State Transitions .......................................................................... 1152
H-UDI Reset.......................................................................................................... 1153
Section 31 Electrical Characteristics
Figure 31.1 EXTAL Clock Input Timing ................................................................................. 1161
Figure 31.2 CLKOUT Clock Output Timing (1)...................................................................... 1161
Figure 31.3 CLKOUT Clock Output Timing (2)...................................................................... 1161
Figure 31.4 Power-On Oscillation Settling Time ..................................................................... 1162
Figure 31.5 MODE pins Setup/Hold Timing............................................................................ 1162
Figure 31.6 PLL Synchronization Settling Time ...................................................................... 1163
Figure 31.7 Control Signal Timing........................................................................................... 1163
Figure 31.8 SRAM Bus Cycle: Basic Bus Cycle (No Wait) .................................................... 1165
Figure 31.9 SRAM Bus Cycle: Basic Bus Cycle (One Internal Wait) ..................................... 1166
Figure 31.10 SRAM Bus Cycle: Basic Bus Cycle
(One Internal Wait + One External Wait) ........................................................... 1167
Figure 31.11 SRAM Bus Cycle: Basic Bus Cycle (No Wait, No Address Setup/
Hold Time Insertion, RDS = 1, RDH = 0, WTS = 1, WTH = 1)......................... 1168
Figure 31.12 Burst ROM Bus Cycle (No Wait) ....................................................................... 1169
Figure 31.13 Burst ROM Bus Cycle (1st Data: One Internal Wait +
One External Wait ; 2nd/3rd/4th Data: One Internal Wait)................................. 1170
Figure 31.14 Burst ROM Bus Cycle (No Wait, No Address Setup/
Hold Time Insertion, RDS = 1, RDH = 0) .......................................................... 1171
Figure 31.15 Burst ROM Bus Cycle (One Internal Wait + One External Wait) ...................... 1172
Figure 31.16 PCMCIA Memory Bus Cycle ............................................................................. 1173
Figure 31.17 PCMCIA I/O Bus Cycle...................................................................................... 1174
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Figure 31.18 PCMCIA I/O Bus Cycle (TEDx = 1, THEx = 1,
IW/PCIW = 1, One Internal Wait, Dynamic Bus Sizing).................................... 1175
Figure 31.19 MPX Basic Bus Cycle: Read............................................................................... 1176
Figure 31.20 MPX Basic Bus Cycle: Write.............................................................................. 1177
Figure 31.21 MPX Bus Cycle: Burst Read............................................................................... 1178
Figure 31.22 MPX Bus Cycle: Burst Write .............................................................................. 1179
Figure 31.23 Byte Control SRAM Bus Cycle .......................................................................... 1180
Figure 31.24 Byte Control SRAM Bus Cycle: Basic Read Cycle
(No Wait, No Address Setup/Hold Time Insertion, RDS = 1, RDH = 0)............ 1181
Figure 31.25 MCLK Output Timing......................................................................................... 1183
Figure 31.26 Read Timing of DDR-SDRAM (2 Burst Read) ................................................. 1184
Figure 31.27 Write Timing of DDR-SDRAM (2 Burst Write)................................................. 1185
Figure 31.28 NMI Input Timing ............................................................................................... 1186
Figure 31.29 IRQ/IRL, GPIO Interrupt Input and IRQOUT Output Timing............................ 1187
Figure 31.30 PCI Clock Input Timing ...................................................................................... 1189
Figure 31.31 Output Signal Timing .......................................................................................... 1189
Figure 31.32 Input Signal Timing............................................................................................. 1189
Figure 31.33 DREQ and DRAK Timing .................................................................................. 1190
Figure 31.34 TCLK Input Timing ............................................................................................ 1191
Figure 31.35 CMT Timing (1).................................................................................................. 1192
Figure 31.36 CMT Timing (2).................................................................................................. 1192
Figure 31.37 SCIFn_SCK Input Clock Timing (n = 0, 1) ........................................................ 1193
Figure 31.38 SCIF Channel n I/O Synchronous Mode Clock Timing (n = 0, 1) ...................... 1194
Figure 31.39 SIOF_MCLK Input Timing................................................................................. 1195
Figure 31.40 SIOF Transmission/Reception Timing (Master Mode 1, Fall Sampling)............ 1196
Figure 31.41 SIOF Transmission/Reception Timing (Master Mode 1, Rise Sampling)........... 1196
Figure 31.42 SIOF Transmission/Reception Timing (Master Mode 2, Fall Sampling)............ 1197
Figure 31.43 SIOF Transmission/Reception Timing (Master Mode 2, Rise Sampling)........... 1197
Figure 31.44 SIOF Transmission/Reception Timing (Slave Mode 1, Slave Mode 2) .............. 1198
Figure 31.45 HSPI Data Output/Input Timing ......................................................................... 1200
Figure 31.46 MMCIF Transmit Timing.................................................................................... 1201
Figure 31.47 MMCIF Receive Timing ..................................................................................... 1202
Figure 31.48 HAC Cold Reset Timing ..................................................................................... 1203
Figure 31.49 HAC SYNC Output Timing ................................................................................ 1203
Figure 31.50 HAC Clock Input Timing.................................................................................... 1203
Figure 31.51 HAC Interface Module Signal Timing ................................................................ 1204
Figure 31.52 SSI Clock Input/Output Timing .......................................................................... 1205
Figure 31.53 SSI Transmit Timing (1) ..................................................................................... 1205
Figure 31.54 SSI Transmit Timing (2) ..................................................................................... 1206
Figure 31.55 SSI Receive Timing (1) ....................................................................................... 1206
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Figure 31.56
Figure 31.57
Figure 31.58
Figure 31.59
Figure 31.60
Figure 31.61
Figure 31.62
Figure 31.63
Figure 31.64
Figure 31.65
Figure 31.66
Figure 31.67
Figure 31.68
SSI Receive Timing (2)....................................................................................... 1206
Command Issue Timing of NAND-type Flash Memory ..................................... 1208
Address Issue Timing of NAND-type Flash Memory......................................... 1209
Data Read Timing of NAND-type Flash Memory .............................................. 1209
Data Write Timing of NAND-type Flash Memory ............................................. 1210
Status Read Timing of NAND-type Flash Memory ............................................ 1210
GPIO Timing....................................................................................................... 1211
TCK Input Timing............................................................................................... 1212
PRESET Hold Timing......................................................................................... 1213
H-UDI Data Transfer Timing.............................................................................. 1213
ASEBRK Pin Break Timing................................................................................ 1213
Output Load Circuit ............................................................................................ 1214
Load Capacitance-Delay Time ............................................................................ 1215
Appendix
Figure B.1 Instruction Prefetch................................................................................................. 1219
Figure E.1 Package Dimensions (449-Pin BGA) ..................................................................... 1255
Figure H.1 Sequence of Turning On and Off Power Supply .................................................... 1275
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Tables
Section 1 Overview
Table 1.1
SH7780 Features....................................................................................................... 2
Table 1.2
Pin Functions .......................................................................................................... 11
Section 2 Programming Model
Table 2.1
Initial Register Values............................................................................................. 35
Table 2.2
Bit Allocation for FPU Exception Handling........................................................... 45
Section 3 Instruction Set
Table 3.1
Execution Order of Delayed Branch Instructions ................................................... 51
Table 3.2
Addressing Modes and Effective Addresses........................................................... 53
Table 3.3
Notation Used in Instruction List............................................................................ 57
Table 3.4
Fixed-Point Transfer Instructions ........................................................................... 59
Table 3.5
Arithmetic Operation Instructions .......................................................................... 61
Table 3.6
Logic Operation Instructions .................................................................................. 63
Table 3.7
Shift Instructions..................................................................................................... 64
Table 3.8
Branch Instructions ................................................................................................. 65
Table 3.9
System Control Instructions.................................................................................... 66
Table 3.10
Floating-Point Single-Precision Instructions ...................................................... 69
Table 3.11
Floating-Point Double-Precision Instructions..................................................... 70
Table 3.12
Floating-Point Control Instructions .................................................................... 70
Table 3.13
Floating-Point Graphics Acceleration Instructions ............................................. 71
Section 4 Pipelining
Table 4.1
Representations of Instruction Execution Patterns.................................................. 74
Table 4.2
Instruction Groups .................................................................................................. 84
Table 4.3
Combination of Preceding and Following Instructions........................................... 86
Table 4.4
Issue Rates and Execution Cycles........................................................................... 88
Section 5 Exception Handling
Table 5.1
Register Configuration............................................................................................ 97
Table 5.2
States of Register in Each Operating Mode ............................................................ 97
Table 5.3
Exceptions............................................................................................................. 102
Section 6 Floating-Point Unit (FPU)
Table 6.1
Floating-Point Number Formats and Parameters .................................................. 131
Table 6.2
Floating-Point Ranges........................................................................................... 132
Table 6.3
Bit Allocation for FPU Exception Handling......................................................... 140
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Section 7 Memory Management Unit (MMU)
Table 7.1
Register Configuration.......................................................................................... 156
Table 7.2
Register States in Each Processing State .............................................................. 156
Section 8 Caches
Table 8.1
Cache Features...................................................................................................... 197
Table 8.2
Store Queue Features ............................................................................................ 197
Table 8.3
Register Configuration.......................................................................................... 200
Table 8.4
Register States in Each Processing State .............................................................. 200
Section 9 L Memory
Table 9.1
L Memory Addresses............................................................................................ 227
Table 9.2
Register Configuration.......................................................................................... 228
Table 9.3
Register Status in Each Processing State .............................................................. 228
Table 9.4
Protective Function Exceptions to Access L Memory.......................................... 240
Section 10 Interrupt Controller (INTC)
Table 10.1
Interrupt Types...................................................................................................... 246
Table 10.2
INTC Pin Configuration ....................................................................................... 250
Table 10.3
INTC Register Configuration ............................................................................... 251
Table 10.4
Register States in Each Operating Mode .............................................................. 253
Table 10.5
Interrupt Request Sources and INT2PRI0 to INT2PRI7....................................... 276
Table 10.6
Correspondence between Bits in INT2A0 and Sources ........................................ 277
Table 10.7
Correspondence between Bits in INT2A1 and Sources ........................................ 280
Table 10.8
Correspondence between Bits in INT2MSKR and Interrupt Masking ................. 283
Table 10.9
Correspondence between Bits in INT2MSKCR and Interrupt Mask Clearing ..... 285
Table 10.10
Correspondence between Interrupt Input Pins and Bits in INT2GPIC ............. 295
Table 10.11
IRL[3:0], IRL[7:4] Pins and Interrupt Levels ................................................... 298
Table 10.12
Interrupt Exception Handling and Priority........................................................ 302
Table 10.13
Interrupt Response Time................................................................................... 311
Table 10.14
Switching Sequence of IRQ/IRL[7:0] Pin Function ......................................... 313
Section 11 Local Bus State Controller (LBSC)
Table 11.1
Pin Configuration.................................................................................................. 318
Table 11.2
LBSC External Memory Space Map .................................................................... 322
Table 11.3
Correspondence Between External Pins (MODE4 and MODE3)......................... 324
Table 11.4
Correspondence Between External Pin (MODE5) and Endian ............................ 325
Table 11.5
PCMCIA Interface Features ................................................................................. 325
Table 11.6
PCMCIA Support Interface .................................................................................. 326
Table 11.7
Register Configuration.......................................................................................... 329
Table 11.8
Register State in Each Processing Mode............................................................... 330
Table 11.9
32-Bit External Device/Big-Endian Access and Data Alignment......................... 353
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Table 11.10
Table 11.11
Table 11.12
Table 11.13
Table 11.14
Table 11.15
Table 11.16
16-Bit External Device/Big-Endian Access and Data Alignment..................... 353
8-Bit External Device/Big-Endian Access and Data Alignment....................... 354
32-Bit External Device/Little-Endian Access and Data Alignment.................. 355
16-Bit External Device/Little-Endian Access and Data Alignment.................. 355
8-Bit External Device/Little-Endian Access and Data Alignment.................... 356
Relationship between Address and CE When Using PCMCIA Interface ......... 375
Relationship between D31 to D29 and Access Size in Address Phase ............. 383
Section 12 DDR-SDRAM Interface (DDRIF)
Table 12.1
Pin Configuration.................................................................................................. 403
Table 12.2
Access and Data Alignment in Little Endian Mode.............................................. 406
Table 12.3
Access and Data Alignment in Big Endian Mode................................................. 408
Table 12.4
Register Configuration.......................................................................................... 410
Table 12.5
Register States in Each Operating Mode .............................................................. 411
Table 12.6
SDRAM Commands Issuable by DDRIF ............................................................. 426
Table 12.7
Relationship between SPLIT Bits and Address Multiplexing............................... 429
Section 13 PCI Controller (PCIC)
Table 13.1
Input/Output Pins.................................................................................................. 446
Table 13.2
List of PCIC Registers .......................................................................................... 449
Table 13.3
Register States in Each Operating Mode .............................................................. 452
Table 13.4
Supported Bus Commands.................................................................................... 522
Table 13.5
PCIC Address Map ............................................................................................... 524
Table 13.6
Interrupt Priority ................................................................................................... 543
Section 14 Direct Memory Access Controller (DMAC)
Table 14.1
Pin Configuration.................................................................................................. 559
Table 14.2
Register Configuration of DMAC......................................................................... 561
Table 14.3
Register States in Each Processing Mode ............................................................. 564
Table 14.4
Transfer Request Sources ..................................................................................... 587
Table 14.5
Selecting External Request Detection with DL, DS Bits ...................................... 589
Table 14.6
Selecting External Request Detection with DO Bit .............................................. 589
Table 14.7
Peripheral Module Request Modes ....................................................................... 591
Table 14.8
DMA Transfer Matrix in Auto-Request Mode (all channels)............................... 599
Table 14.9
DMA Transfer Matrix in External Request Mode (only channels 0 to 3)............. 600
Table 14.10
DMA Transfer Matrix in Peripheral module Request Mode ............................ 601
Table 14.11
Register Settings for SRAM, Burst ROM, Byte Control SRAM Interface....... 611
Table 14.12
Register Settings for PCMCIA Interface .......................................................... 612
Table 14.13
Register Settings for MPX Interface (Read Access)......................................... 612
Table 14.14
Register Settings for MPX Interface (Write Access) ........................................ 612
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Section 15 Clock Pulse Generator (CPG)
Table 15.1
CPG Pin Configuration......................................................................................... 616
Table 15.2
Clock Operating Modes ........................................................................................ 617
Table 15.3
Register configuration........................................................................................... 618
Table 15.4
Register States of CPG in Each Processing Mode ................................................ 618
Section 16 Watchdog Timer and Reset
Table 16.1
Pin Configuration.................................................................................................. 627
Table 16.2
Register Configuration.......................................................................................... 628
Table 16.3
Register States in Each Processing Mode ............................................................. 628
Section 17 Power-Down Mode
Table 17.1
Power-Down Modes ............................................................................................. 644
Table 17.2
Pin Configuration.................................................................................................. 645
Table 17.3
Register configuration........................................................................................... 645
Table 17.4
Register States in Each Processing Mode ............................................................. 645
Table 17.5
Pin Configuration.................................................................................................. 653
Section 18 Timer Unit (TMU)
Table 18.1
Pin Configuration.................................................................................................. 659
Table 18.2
Register Configuration.......................................................................................... 660
Table 18.3
Register States in Each Processing Mode ............................................................. 661
Table 18.4
TMU Interrupt Sources......................................................................................... 674
Section 19 Timer/Counter (CMT)
Table 19.1
Pin Configuration.................................................................................................. 679
Table 19.2
Register Configuration.......................................................................................... 679
Table 19.3
Register States of CMT in Each Processing Mode ............................................... 680
Table 19.4
32-bit Timer Mode: Example of Input Capture Setting ........................................ 693
Table 19.5
32-bit Timer Mode: Example of Output Compare Setting ................................... 696
Table 19.6
16-bit Timer Mode: Example of Input Capture Setting ........................................ 698
Table 19.7
16-bit Timer Mode: Example of Output Compare Setting ................................... 700
Table 19.8
Setting Example of Up-counter Mode .................................................................. 702
Table 19.9
Setting Example of Updown-counter Mode ......................................................... 704
Table 19.10
Setting Example of Updown-counter Mode ..................................................... 706
Table 19.11
CMT Interrupt Setting ...................................................................................... 706
Section 20 Realtime Clock (RTC)
Table 20.1
RTC Pins............................................................................................................... 709
Table 20.2
RTC Registers....................................................................................................... 710
Table 20.3
Register States of RTC in Each Processing Mode ................................................ 711
Table 20.4
Crystal Oscillator Circuit Constants (Recommended Values).............................. 730
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Section 21 Serial Communication Interface with FIFO (SCIF)
Table 21.1
Pin Configuration.................................................................................................. 739
Table 21.2
Register Configuration.......................................................................................... 740
Table 21.3
Register States of SCIF in Each Processing Mode ............................................... 741
Table 21.4
SCSMR Settings ................................................................................................... 758
Table 21.5
SCSMR Settings for Serial Transfer Format Selection......................................... 770
Table 21.6
SCSMR and SCSCR Settings for SCIF Clock Source Selection.......................... 771
Table 21.7
Serial Transfer Formats (Asynchronous Mode).................................................... 773
Table 21.8
SCIF Interrupt Sources ......................................................................................... 793
Section 22 Serial I/O with FIFO (SIOF)
Table 22.1
Pin Configuration.................................................................................................. 799
Table 22.2
Register Configuration of SIOF............................................................................ 800
Table 22.3
Register States of SIOF in Each Processing Mode ............................................... 801
Table 22.4
Operation in Each Transfer Mode......................................................................... 804
Table 22.5
SIOF Serial Clock Frequency ............................................................................... 828
Table 22.6
Serial Transfer Modes........................................................................................... 830
Table 22.7
Frame Length........................................................................................................ 831
Table 22.8
Audio Mode Specification for Transmit Data....................................................... 833
Table 22.9
Audio Mode Specification for Receive Data ........................................................ 833
Table 22.10
Setting Number of Channels in Control Data ................................................... 834
Table 22.11
Conditions to Issue Transmit Request .............................................................. 836
Table 22.12
Conditions to Issue Receive Request ................................................................ 836
Table 22.13
Transmit and Receive Reset.............................................................................. 842
Table 22.14
SIOF Interrupt Sources ..................................................................................... 843
Section 23 Serial Protocol Interface (HSPI)
Table 23.1
Pin Configuration.................................................................................................. 851
Table 23.2
Register Configuration.......................................................................................... 851
Table 23.3
Register States of HSPI in Each Processing Mode ............................................... 851
Section 24 Multimedia Card Interface (MMCIF)
Table 24.1
Pin Configuration.................................................................................................. 866
Table 24.2
Register Configuration.......................................................................................... 867
Table 24.3
Register States of HSPI in Each Processing Mode ............................................... 869
Table 24.4
CMDR Configuration ........................................................................................... 871
Table 24.5
Correspondence between Commands and Settings of CMDTYR
and RSPTYR ........................................................................................................ 892
Table 24.6
Correspondence between Command Response Byte Number and RSPR............. 895
Table 24.7
MMCIF Interrupt Sources..................................................................................... 931
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Section 25 Audio Codec Interface (HAC)
Table 25.1
Pin Configuration.................................................................................................. 956
Table 25.2
Register Configuration.......................................................................................... 957
Table 25.3
Register States of HAC in Each Processing Mode ............................................... 957
Table 25.4
AC97 Transmit Frame Structure........................................................................... 973
Table 25.5
AC97 Receive Frame Structure ............................................................................ 974
Section 26 Serial Sound Interface (SSI) Module
Table 26.1
Pin Configuration.................................................................................................. 984
Table 26.2
Register Configuration.......................................................................................... 985
Table 26.3
Register States of SSI in Each Processing Mode .................................................. 985
Table 26.4
Bus Formats of SSI Module.................................................................................. 998
Table 26.5
Number of Padding Bits for Each Valid Configuration...................................... 1002
Section 27 NAND Flash Memory Controller (FLCTL)
Table 27.1
Pin Configuration................................................................................................ 1024
Table 27.2
Register Configuration of FLCTL ...................................................................... 1025
Table 27.3
Register States of FLCTL in Each Processing Mode.......................................... 1025
Table 27.4
Status Read of NAND-Type Flash Memory....................................................... 1049
Table 27.5
FLCTL Interrupt Requests.................................................................................. 1053
Table 27.6
DMA Transfer Specifications ............................................................................. 1053
Section 28 General Purpose I/O (GPIO)
Table 28.1
Multiplexed Pins Controlled by Port Control Registers ..................................... 1056
Table 28.2
Register Configuration........................................................................................ 1060
Table 28.3
Register States of GPIO in Each Processing Mode ............................................ 1062
Section 29 User Break Controller (UBC)
Table 29.1
Register Configuration........................................................................................ 1103
Table 29.2
Register Status in Each Processing State ............................................................ 1104
Table 29.3
Settings for Match Data Setting Register............................................................ 1116
Table 29.4
Relation between Operand Sizes and Address Bits to be Compared .................. 1123
Section 30 User Debugging Interface (H-UDI)
Table 30.1
Pin Configuration................................................................................................ 1137
Table 30.2
Commands Supported by Boundary-Scan TAP Controller ................................ 1139
Table 30.3
Register Configuration (1) .................................................................................. 1140
Table 30.4
Register Configuration (2) .................................................................................. 1140
Table 30.5
Register Status in Each Processing State ............................................................ 1140
Table 30.6
SDBSR Configuration ........................................................................................ 1143
Section 31 Electrical Characteristics
Table 31.1
Absolute Maximum Ratings ............................................................................... 1155
Rev.1.00 Dec. 13, 2005 Page xlviii of l
Table 31.2
Table 31.3
Table 31.4
Table 31.5
Table 31.6
Table 31.7
Table 31.8
Table 31.9
Table 31.10
Table 31.11
Table 31.12
Table 31.13
Table 31.14
Table 31.15
Table 31.16
Table 31.17
Table 31.18
Table 31.19
Table 31.20
Table 31.21
Table 31.22
DC Characteristics (Ta = −20 to 75°C / −40 to 85°C)......................................... 1156
Permissible Output Currents ............................................................................... 1159
Clock Timing ...................................................................................................... 1159
Clock and Control Signal Timing ....................................................................... 1160
Control Signal Timing ........................................................................................ 1163
Bus Timing ......................................................................................................... 1164
DDRIF Signal Timing ........................................................................................ 1182
INTC Module Signal Timing.............................................................................. 1186
PCIC Signal Timing (in PCIREQ/PCIGNT Non-Port Mode) (1)................... 1188
DMAC Module Signal Timing ....................................................................... 1190
TMU Module Signal Timing .......................................................................... 1191
CMT Module Signal Timing .......................................................................... 1192
SCIF Module Signal Timing........................................................................... 1193
SIOF Module Signal Timing .......................................................................... 1195
HSPI Module Signal Timing .......................................................................... 1199
MMCIF Module Signal Timing...................................................................... 1201
HAC Interface Module Signal Timing............................................................ 1203
SSI Interface Module Signal Timing .............................................................. 1205
FLCTL Module Signal Timing ....................................................................... 1207
GPIO Signal Timing ....................................................................................... 1211
H-UDI Module Signal Timing........................................................................ 1212
Appendix
Table F.1
Table F.2
Table F.3
Table F.4
Table F.5
Table F.6
Table G.1
Table G.2
Table I.1
Table J.1
Clock Operating Modes with External Pin Combination.................................... 1256
Area 0 Memory Map and Bus Width.................................................................. 1256
Endian ................................................................................................................. 1256
PCI Mode............................................................................................................ 1257
Clock Input ......................................................................................................... 1257
Mode Control...................................................................................................... 1257
Pin states in Reset, Power-Down State, and Bus-Released State........................ 1258
Treatment of Unused Pins................................................................................... 1267
Register Configuration........................................................................................ 1276
SH7780 Product Lineup...................................................................................... 1277
Rev.1.00 Dec. 13, 2005 Page xlix of l
Rev.1.00 Dec. 13, 2005 Page l of l
Section 1 Overview
Section 1 Overview
1.1
SH7780 Features
The SH7780 is an integrated system-on-a-chip microprocessor that is designed as a high
performance, embedded, stand-alone Host Processor aimed at the multimedia, infotainment and
consumer networking market. The SH7780 features a DDR-SDRAM interface that can be coupled
to the DDR320* or 266 SDRAM. Also, because of its built-in functions, such as a PCI bus
controller, a DMA controller, timers, and serial communications functions with an audio interface,
as required for multimedia, network, and OA equipment, use of the SH7780 enables a high
performance and high integrated system.
The SH7780 contains the new generation SH-4A 32-bit RISC (reduced instruction set computer)
microprocessor core which runs at 400 MHz (720 MIPS, 2.8 GFLOPS). The SH-4A is upwardly
compatible with the SH-1, SH-2, SH-3, and SH-4 microcomputers at the instruction set level. This
microprocessor core integrates a cache memory and the MMU.
Note: "DDR320" indicates the DDR-SDRAM bus interface which operates at a frequency of 160
MHz in this manual.
The features of the SH7780 are summarized in table 1.1.
Rev.1.00 Dec. 13, 2005 Page 1 of 1286
REJ09B0158-0100
Section 1 Overview
Table 1.1
SH7780 Features
Item
Features
LSI
•
Operating frequency: 400 MHz
•
Performance: 720MIPS, 2.8 GFLOPS
•
Voltage: 1.25 V (internal), 2.5 V (DDR-SDRAM interface), 3.3 V (I/O)
•
Superscalar architecture: Parallel execution of two instructions
•
Packages: 449-pin BGA (Size: 21 × 21 mm, pin pitch: 0.8 mm)
•
Local bus interface (External bus):
Separate 26-bit address and 32-bit data buses
External bus frequency: 100 MHz
•
DDR-SDRAM bus interface (External bus):
Separate 14-bit address and 32-bit data buses
External bus frequency: 133 M or 160 MHz (DDR266/320)
•
PCI bus interface (External bus):
32-bit address/data multiplexing
External bus frequency: 33M or 66 MHz
CPU
•
Renesas Technology original architecture
•
32-bit internal data bus
•
General-register files:
Sixteen 32-bit general registers (eight 32-bit shadow registers)
Seven 32-bit control registers
Four 32-bit system registers
•
RISC-type instruction set (upward compatible with the SH-1, SH-2, SH-3
and SH-4 microcomputers)
Instruction length: 16-bit fixed length for improved code efficiency
Load/store architecture
Delayed branch instructions
Instructions executed with conditions
Instruction set based on the C language
•
Super scalar which executes two instructions simultaneously including
the FPU
•
Instruction execution time: Two instructions per cycle (max)
•
Virtual address space: 4 Gbytes
•
Space identifier ASID: 8 bits, 256 virtual address spaces
•
On-chip multiplier
•
Seven-stage pipeline
Rev.1.00 Dec. 13, 2005 Page 2 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
FPU
•
On-chip floating-point coprocessor
•
Supports single-precision (32 bits) and double-precision (64 bits)
•
Supports IEEE754-compliant data types and exceptions
•
Two rounding modes: Round to Nearest and Round to Zero
•
Handling of denormalized numbers: Truncation to zero or interrupt
generation for IEEE754 compliance
•
Floating-point registers: 32 bits × 16 words × 2 banks
(single-precision × 16 words or double-precision × 8 words) × 2 banks
•
32-bit CPU-FPU floating-point communication register (FPUL)
•
Supports FMAC (multiply-and-accumulate) instruction
•
Supports FDIV (divide) and FSQRT (square root) instructions
•
Supports FLDI0/FLDI1 (load constant 0/1) instructions
•
Instruction execution times
Latency (FADD/FSUB): 3 cycles (single-precision), 5 cycles (doubleprecision)
Latency (FMAC/ FMUL): 5 cycles (single-precision), 7 cycles (doubleprecision)
Pitch (FADD/FSUB): 1 cycle (single-precision/double-precision)
Pitch (FMAC/FMUL): 1 cycle (single-precision), 3 cycles (doubleprecision)
Note:
•
FMAC is supported for single-precision only.
3-D graphics instructions (single-precision only):
4-dimensional vector conversion and matrix operations (FTRV): 4
cycles (pitch), 8 cycles (latency)
4-dimensional vector (FIPR) inner product: 1 cycle (pitch), 5 cycles
(latency)
•
Ten-stage pipeline
Rev.1.00 Dec. 13, 2005 Page 3 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
Memory
management
unit (MMU)
•
4 Gbytes of physical address space, 256 address space identifiers
(address space identifier ASID: 8 bits)
•
Supports single virtual memory mode and multiple virtual memory mode
•
Supports multiple page sizes: 1 Kbyte, 4 Kbytes, 64 Kbytes, or 1 Mbyte
•
4-entry full associative TLB for instructions
•
64-entry full associative TLB for instructions and operands
•
Supports software selection of replacement method and random-counter
replacement algorithms
•
Contents of TLB are directly accessible through address mapping
•
Instruction cache (IC)
Cache memory
32-Kbyte 4-way set associative
32-byte block length
•
Operand cache (OC)
32-Kbyte 4-way set associative
32-byte block length
Selectable write method (copy-back or write-through)
L memory
•
Storage queue (32 bytes × 2 entries)
•
Three independent read/write ports
Instruction fetch access by the CPU
8-/16-/32-/64-bit operand access by the CPU
8-/16-/32-/64-bit and 16-/32-byte access by the SuperHyway bus
master
SuperHyway
memory
•
16-Kbyte capacity
•
Supports memory protective functions during CPU accesses
•
8-/16-/32-/64-bit and 16-/32-byte access from the SuperHyway bus
master
•
32-Kbyte capacity
Rev.1.00 Dec. 13, 2005 Page 4 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
Interrupt controller
(INTC)
•
Nine independent external interrupts: NMI and IRQ7 to IRQ0
NMI: Fall/rise selectable
IRQ: Fall/rise/high level/low level selectable
•
•
User break
controller (UBC)
Local bus state
controller (LBSC)
15-level signed external interrupts: IRL3 to IRL0, or IRL7 to IRL4
On-chip module interrupts: Priority level can be set for each module
The following modules can issue on-chip module interrupts:
TMU, RTC, SCIF, WDT, H-UDI, DMAC, CMT, HAC, PCIC, SIOF, HSPI,
MMCIF, SSI, FLCTL, and GPIO
•
Supports debugging by means of user break interrupts
•
Two break channels
•
Address, data value, access type, and data size are available as break
condition settings
•
Supports sequential break functions
•
Supports external memory access
•
External memory space divided into seven areas, each of up to 64
Mbytes, with the following parameters settable for each area:
Bus size (8, 16, or 32 bits)
Number of wait cycles (hardware wait function also supported)
SRAM or burst ROM
Supports PCMCIA interface (only in little endian mode)
DDR-SDRAM
interface (DDRIF)
•
Big endian or little endian mode can be set
•
The data bus width of the DDRIF is 32 bits
•
Supports DDR-SDRAM self-refreshing
•
Supports the DDR320 or DDR266 SDRAM
•
Efficient data transfer is possible using the SuperHyway bus(Internal
bus)
•
Supports a 4-bank DDR-SDRAM
•
Supports a burst length of 2
•
Connectable memory size: 256-Mbit, 512-Mbit, 1-Gbit, and 2-Gbit
Rev.1.00 Dec. 13, 2005 Page 5 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
PCI bus controller
(PCIC)
•
PCI bus controller (subset of revision 2.2)
32-bit bus
33 MHz/66 MHz support
•
PCI master/target support
•
PCI host function support
Built-in bus arbiter
Direct memory
access controller
(DMAC)
•
Interrupt requests can be sent to CPU
•
Up to 512-Mbyte memory can be connected for PCI memory space
•
12-channel physical address DMA controller
•
4-channel supports external requests (channel 0 to 3)
•
Address space: 4 Gbytes on architecture
•
Transfer data size: 8, 16, or 32 bits; 16, or 32 bytes
•
Address modes:
2-bus-cycle dual address mode
Clock pulse
generator (CPG)
•
Transfer requests: External (channel 0 to 3), peripheral module (channel
0 to 5), or auto-requests
•
Choice of DACK or DRAK (four external pins)
•
Bus modes: Cycle-steal or burst mode
•
Main clock: 12 times XTAL clock
•
Clock modes:
CPU frequency: 1/1 time main clock
Local bus frequency: 1/4, 1/6, 1/8, or 1/12 times main clock
DDR-SDRAM frequency: 2/5 or 1/3 times main clock
(Supports DDR320 or DDR266 SDRAM devices)
Peripheral frequency: 1/8 or 1/12 times main clock
•
Power-down modes:
Sleep mode
Module standby mode
Watchdog timer
(WDT)
•
Single-channel watchdog timer
(watchdog timer mode or interval timer mode can be selectable)
•
Selectable reset function: Power-on reset or manual reset
Rev.1.00 Dec. 13, 2005 Page 6 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
Timer unit (TMU)
•
6-channel auto-reload 32-bit timer
•
Input-capture function (only channel 2)
•
Choice of seven types counter input clocks (external and peripheral
clocks)
•
4-channel auto-reload 32-bit timers
•
Choice of 16 or 32 bits
•
Choice of 1-shot or free-running operation
•
Choice of an interrupt source or DMA transfer request from compare
match or overflow
•
On-chip clock and calendar functions
•
Built-in 32 kHz crystal oscillator with maximum 1/256 second resolution
(cycle interrupts)
•
RTC power supply back-up function
•
Two full-duplex communications channels
•
On-chip 64-byte FIFOs for all channels
•
Choice of asynchronous mode or synchronous mode
•
Can select any bit rate generated by on-chip baud-rate generator
•
On-chip modem control function (SCIF0_RTS and SCIF0_CTS) for
channel 0
Compare Match
Timer (CMT)
Realtime clock
(RTC)
Serial
communication
interface
(SCIF)
Serial I/O with FIFO •
(SIOF)
•
Serial protocol
interface (HSPI)
Multimedia card
interface (MMCIF)
Internal 64-byte transmit/receive FIFOs
Supports 8-/16-bit data and 16-bit stereo audio input/output
•
Sampling rate clock input selectable from Pck and external pin
•
Maximum sampling rate: 48-kHz
•
Internal prescaler for Pck
•
1 channel
•
Master/slave mode
•
Selectable bit rate generated by on-chip baud-rate generator
•
Complies with the multimedia card system specification version 3.1
•
Supports MMC mode
•
Interface with MCCLK output for transfer clock output, MCCMD I/O for
command output/response input, MCDAT I/O (data I/O)
•
Four interrupt sources
Rev.1.00 Dec. 13, 2005 Page 7 of 1286
REJ09B0158-0100
Section 1 Overview
Item
Features
Audio codec
interface (HAC)
•
Digital interface for audio codec
•
Supports transfer for slot 1 to slot 4
•
Choice of 16- or 20-bit DMA transfer
•
Supports various sampling rates by adjusting slot data
•
Generates interrupt: data ready, data request, overflow, and underrun
•
1-channel bi-directional transfer
•
Support compressed-data and non-compressed-data transfer
Serial sound
interface (SSI)
The compressed mode is used for continuous bit stream transfer
The non-compressed mode supports all serial audio streams divided
into channels.
•
The SSI module is configured as any of a transmitter or receiver. The
serial bus format can be used in the compressed and non-compressed
mode.
•
Interface connectable to a NAND-type flash memory
•
Read or write in sector units (512 + 16 bytes)
•
Read or write in byte units
•
Supports up to 512-Mbit of flash memory
General purpose
I/O (GPIO)
•
83 general purpose I/O ports (75 for I/Os and 8 for outputs)
•
GPIO interrupts are supported
Debug interface
•
H-UDI (User Debugging Interface)
•
AUD (Advanced User Debugger)
NAND flash
memory
controller (FLCTL)
Rev.1.00 Dec. 13, 2005 Page 8 of 1286
REJ09B0158-0100
Section 1 Overview
Block Diagram
CPU
O-cache
SuperHyway bus
UBC
Operand bus
MMU
FPU
LBSC
(External bus)
DDRIF
(External bus)
PCIC
(External bus)
I-cache
Instruction bus
DMAC
TMU
SuperHyway
RAM
SCIF
channel 0
HPB
AUD
HSPI
LRAM
INTC
SuperHyway
router
[Legend]
AUD:
CMT:
CPG:
CPU:
DDRIF:
DMAC:
FLCTL:
FPU:
GPIO:
HAC:
HPB:
HSPI:
H-UDI:
I-Cache:
INTC:
LBSC:
LRAM:
MMCIF:
MMU:
O-Cache:
PCIC:
RTC:
Advanced user debugger
Timer/counter
Clock pulse generator
Central processing unit
DDR-SDRAM interface
Direct memory access controller
NAND flash memory controller
Floating-point unit
General purpose I/O
Audio codec
Peripheral bus bridge
Serial protocol interface
User debugging interface
Instruction cache
Interrupt controller
Local bus state controller
L memory
Multimedia card interface
Memory management unit
Operand (data) cache
PCI controller
Realtime clock
CPG
SCIF
channel 1
I/O
multiplexed
MMCIF
WDT
SIOF
RTC
HAC
CMT
SSI
H-UDI
GPIO
SCIF:
SIOF:
SSI:
SuperHyway RAM:
TMU:
UBC:
WDT:
I/O
multiplexed
FLCTL
SH-4A core
Peripheral bus
1.2
I/O
multiplexed
Serial communication interface with FIFO
Serial I/O with FIFO
Serial sound interface
SuperHyway memory
Timer unit
User break controller
Watchdog timer
Figure 1.1 SH7780 Block Diagram
Rev.1.00 Dec. 13, 2005 Page 9 of 1286
REJ09B0158-0100
BKPRST
REJ09B0158-0100
Rev.1.00 Dec. 13, 2005 Page 10 of 1286
MDA9
MDA10
MDA11
MDA13
MDA15
N
P
R
T
U
Figure 1.2 SH7780 Pin Arrangement
A22
A19
A16
A14
A13
VSSQ
Y
AB
AC
AD
AE
A25
AA
W
MDA14
MDA12
MDA30
MDA28
MDA26
MDA24
MDQM1
A12
VDDQ
A15
A17
A20
A23
MA9
MCS
MRAS
7
VSS-DLL2
VSS
VSS
VSS-DLL1
VDD
VSS
VCCQ-DDR VCCQ-DDR
VCCQ-DDR VCCQ-DDR
VSSQ-DDR VSSQ-DDR
VDD-DLL2
VDD
VDD
VDD-DLL1
VDD
VSS
VCCQ-DDR VSSQ-DDR
VSSQ-DDR VSSQ-DDR VSSQ-DDR
STATUS1/
A10
A11
VDDQ
A18
A21
A24
A7
A8
A9
VSSQ
VDDQ
VSS
VDD
A3
A4
A5
A6
VSSQ
VSS
VDD
D31
A0
A1
A2
VSS
D27
D28
D29
D30
VDD
VCCQ-DDR VSSQ-DDR VSSQ-DDR VCCQ-DDR
VSSQ-DDR VSSQ-DDR VCCQ-DDR
MDA31
MDA29
MDA27
MDA25
MDQM3
MDQS3
MDQM2
MDQS2
MDA22
MDA20
MDA18
CMT_CTR0 CMT_CTR1
STATUS0/
MA11
MCAS
MWE
6
MA8
BA1
BA0
8
MA7
MA0
MA10
9
MA6
MA2
MA1
10
MA5
MA4
MA3
11
IOWR
WE3/
D24
D25
D26
VDDQ
VDD
D20
D21
D22
D23
VSSQ
VSS
D17
D18
D19
VSSQ
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
IORD
WE2/
D16
D15
VDDQ
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSSQ-DDR VCCQ-DDR
VSSQ-DDR VCCQ-DDR VSSQ-DDR VSSQ-DDR VCCQ-DDR VCCQ-DDR VSSQ-DDR VSSQ-DDR VCCQ-DDR
MA12
MA13
MCLK
5
VCCQ-DDR VCCQ-DDR VCCQ-DDR VCCQ-DDR VCCQ-DDR
MDA8
M
V
MDQS1
L
MDQS0
MDA6
MDA7
MDQM0
J
K
MDA23
MDA21
MDA19
MDA5
MDA3
F
MDA17
H
MDA2
E
MDA16
MDA4
MDA1
D
CKE
MCLK
4
VCCQ-DDR VSSQ-DDR VCCQ-DDR
G
MDA0
C
VSSQ-DDR VCCQ-DDR
VSSQ-DDR VCCQ-DDR DDR-VREF
3
B
2
13
VDDQ
VDD
VDDQ
DREQ2/
INTB/
AUDATA0
DRAK3/
CE2B/
AUDSYNC
VDDQ
DREQ1
DREQ0
14
DRAK2/
CE2A/
AUDCK
MODE7
DRAK1/
D12
D13
D14
VDDQ
VDDQ
VSS
VSS
VSS-DDR
VSS-DDR
VSS-DDR
VSS
VSS
D9
D10
D11
VSSQ
VSSQ
VSS
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSS
WE1
D7
D8
VDDQ
VSSQ
VSS
VSS
VSS
VSS
VSS
VSS
VSS
(Top view)
VSSQ
VSSQ
MODE2
DRAK0/
VSS
PRESET
12
15
16
D4
D5
D6
VDDQ
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSSQ
MODE1
DACK1/
MODE0
DACK0/
D1
D2
D3
VSSQ
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSSQ
TMS
TCK
DACK3/
IRQOUT/
AUDATA3
DACK2/
DREQ3/
INTC/
MRESETOUT/
AUDATA1 AUDATA2
REG
WE0/
D0
BREQ
BACK
VDDQ
VSSQ
TRST
/BRKACK
ASEBRK
TDO
TDI
17
/FALE
R/W
RD/FRMAE
BS
CS4
VDDQ
VDDQ
21
EXTAL2
23
VDD-RTC
24
RDY
CS2
CS5
CS6
VSSQ
CLKOUT
CS0
CS1
VSS-PLL3
VSSQ
VDDQ
VDD-PLL2
VDD-PLL3
VSS-PLL2
VDD
VSSQ
VDDQ
VSS
VSS
VDD
VDD
VDDQ
VDD
VSS
VSS
VDDQ
*
VDD-PLL1
VSS-PLL1
VDD
VDDQ
NC
REQOUT
REQ0/
REQ2
AD31
AD27
CBE3
AD21
AD17
IRDY
LOCK
SERR
AD14
AD10
VDD
VDD
AD7
AD1
VDDQ
VSS
VSSQ
VDDQ
VDD
AD6
XTAL
VSSQ
VDDQ
VDDQ
*
NC
PCICLK
REQ1
REQ3
AD29
AD25
AD23
AD19
CBE2
DEVSEL
PERR
EXTAL
VDDQ
VDDQ
VSS
VSS
GNTIN
GNT0/
GNT2
AD30
AD26
IDSEL
AD20
AD16
TRDY
PAR
AD13
AD9
AD12
CBE1
AD2
AD5
IRQ/IRL0
AD8
AD3
IRQ/IRL1
IRQ/IRL3
VDDQ
VSSQ
IRQ/IRL6/
FD6/
MODE6
VDD
IRQ/IRL4/
FD4/
MODE3
SCIF0_CTS
/INTD
/FCLE
VDD
VDDQ
SIOF_RXD/
SCIF0_RXD
SCIF1_SCK
HAC_SDIN/
HSPI_RX/ TCLK/IOIS16 XRTCSTBI
/MCCMD
SSI_SCK
FRB
XTAL2
22
SIOF_SCK/
SIOF_TXD/ SCIF0_RTS SCIF0_TXD SCIF0_SCK/
HAC_BITCLK/ HAC_SDOUT/ /HSPI_CS
HSPI_TX
HSPI_CLK/
/FSE
SSI_CLK
SSI_SDATA
FWE/MODE8
FRE
FD0
20
SIOF_SYNC/ SCIF1_TXD
/MCCLK
HAC_SYNC/
/MODE5
SSI_WS
AUDATA2 SIOF_MCLK SCIF1_RXD
MCDAT
/FD2
/HAC_RES
/FD3
AUDATA3
AUDATA0/
FD1
AUDCK
/FCE
19
AUDATA1/
18
AUDSYNC
VSSQ
VSSQ
MPMD
VSS
INTA
PCIRESET
GNT1
GNT3
AD28
AD24
AD22
AD18
PCIFRAME
STOP
AD15
AD11
CBE0
AD4
AD0
NMI
IRQ/IRL2
IRQ/IRL5/
FD5/
MODE4
IRQ/IRL7/
FD7
VSSQ
VSS-RTC
25
1.3
A
1
Section 1 Overview
Pin Arrangement
Section 1 Overview
1.4
Pin Functions
Table 1.2 lists the pin functions of the SH7780. In the I/O column, I, O, and IO indicate input,
output, and input/output, respectively. In the GPIO column, for example, A0 indicates the port A0,
which also functions as a general I/O port (input/output).
Table 1.2
Pin Functions
No.
Pin
No.
Pin Name
I/O
Function
1
A1
VSSQ-DDR
—
DDR I/O GND
2
A2
VCCQ-DDR
—
DDR I/O VCC
3
A3
DDR-VREF
I
DDR VREF
4
A4
MCLK
O
DDR clock
5
A5
MCLK
O
DDR clock
6
A6
MWE
O
DDR write enable
7
A7
MRAS
O
DDR RAS
8
A8
BA0
O
DDR bank address 0
9
A9
MA10
O
DDR address
10
A10
MA1
O
DDR address
11
A11
MA3
O
DDR address
12
A12
PRESET
I
Power-on reset
13
A13
DRAK1/MODE7
O/I
DMA channel 1 transfer request
acknowledge/mode control 7
L0(O)
14
A14
DREQ0
I
DMA channel 0 request
K7
15
A15
DREQ3/INTC/AUDATA1
I/I/O
DMA channel 3 request/
PCI interrupt C/H-UDI emulator
K4*
16
A16
DACK2/MRESETOUT/AUDATA2
O/O/O
DMA channel 2 bus
acknowledgment/manual reset output/
H-UDI emulator
K3
17
A17
TDI
I
H-UDI data
18
A18
AUDSYNC/FCE
O/O
H-UDI emulator/NAND flash CE
19
A19
AUDATA1/FD1
O/IO
H-UDI emulator/NAND flash data
20
A20
SIOF_SYNC/HAC_SYNC/SSI_WS
IO/O/IO SIOF flame synchronous/
J3
HAC flame synchronous/SSI word select
GPIO*
Rev.1.00 Dec. 13, 2005 Page 11 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
GPIO*
21
A21
SCIF1_TXD/MCCLK/MODE5
O/O/I
SCIF 1 transmit data/
card clock output/mode control 5
H6(O)
22
A22
XTAL2
O
RTC clock
23
A23
EXTAL2
I
RTC crystal resonator
24
A24
VDD-RTC
—
RTC VDD
25
A25
VSS-RTC
—
RTC GND
26
B1
VSSQ-DDR
—
DDR I/O GND
27
B2
VCCQ-DDR
—
DDR I/O VCC
28
B3
BKPRST
I
Back-up reset
29
B4
CKE
O
DDR clock enable
30
B5
MA13
O
DDR address
31
B6
MCAS
O
DDR CAS
32
B7
MCS
O
DDR chip select
33
B8
BA1
O
DDR bank address 1
34
B9
MA0
O
DDR address
35
B10
MA2
O
DDR address
36
B11
MA4
O
DDR address
37
B12
VSS
—
Internal GND
38
B13
DRAK2/CE2A/AUDCK
O/O/O
DMA channel 2 transfer request
acknowledge/PCMCIA CE2/
H-UDI emulator
K1(O)
39
B14
DREQ1
I
DMA channel 1 request
K6
40
B15
DACK0/MODE0
O/I
DMA channel 0 bus
acknowledgement/mode control 0
L3(O)
41
B16
DACK3/IRQOUT/AUDATA3
O/O/O
DMA channel 3 bus acknowledgement/
interrupt request output/H-UDI emulator
K2
42
B17
TDO
O
H-UDI data
43
B18
AUDCK/FALE
O/O
H-UDI emulator/NAND flash ALE
44
B19
AUDATA0/FD0
O/IO
H-UDI emulator/NAND flash data
45
B20
SIOF_RXD/HAC_SDIN/SSI_SCK
I/I/IO
SIOF receive data/HAC serial data
J4
incoming to Rx frame/SSI serial bit clock
46
B21
SCIF1_SCK/MCCMD
IO/IO
SCIF1 serial clock/
MMCIF command response
Rev.1.00 Dec. 13, 2005 Page 12 of 1286
REJ09B0158-0100
H7
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
GPIO*
47
B22
SCIF0_RXD/HSPI_RX/FRB
I/I/I
SCIF receive data/HSPI receive data
input/NAND flash ready or busy
H2
48
B23
TCLK/IOIS16
IO/I
TMU clock/PCMCIA IOIS16
J0*
49
B24
XRTCSTBI
I
RTC standby
50
B25
VSSQ
—
I/O GND
51
C1
MDA0
IO
DDR data
52
C2
VCCQ-DDR
—
DDR I/O VCC
53
C3
VSSQ-DDR
—
DDR I/O GND
54
C4
VCCQ-DDR
—
DDR I/O VCC
55
C5
MA12
O
DDR address
56
C6
MA11
O
DDR address
57
C7
MA9
O
DDR address
58
C8
MA8
O
DDR address
59
C9
MA7
O
DDR address
60
C10
MA6
O
DDR address
61
C11
MA5
O
DDR address
62
C12
DRAK0/MODE2
O/I
DMA channel 0 transfer request
acknowledge/mode control 2
L1(O)
63
C13
DRAK3/CE2B/AUDSYNC
O/O/O
DMA channel 3 request
acknowledgment/PCMCIA CE2/
H-UDI emulator
K0(O)
64
C14
DREQ2/INTB/AUDATA0
I/I/O
DMA channel 2 request/PCI interrupt
B/H-UDI emulator
K5*
65
C15
DACK1/MODE1
O/I
DMA channel 1 bus
acknowledgement/mode control 1
L2(O)
66
C16
TCK
I
H-UDI clock
67
C17
ASEBRK/BRKACK
I/O
H-UDI emulator
68
C18
AUDATA3/FD3
O/IO
H-UDI emulator/NAND flash data
69
C19
SIOF_SCK/HAC_BITCLK/SSI_CLK
IO/I/IO
SIOF serial clock/HAC/SSI serial bit clock J1
70
C20
SIOF_TXD/HAC_SDOUT/
SSI_SDATA
O/O/IO
SIOF transmit data/HAC serial data/
SSI serial data
71
C21
SCIF0_RTS/HSPI_CS/FSE
IO/IO/O SCIF modem control/HSPI chip
H0*
selection/NAND flash spare area enable
J5
Rev.1.00 Dec. 13, 2005 Page 13 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
72
C22
SCIF0_TXD/HSPI_TX/FWE/MODE8 O/O/O/I SCIF0 transmit data/HSPI transmit
data/NAND flash write enable/
mode control 8
H3(O)
73
C23
SCIF0_SCK/HSPI_CLK/FRE
IO/IO/O SCIF0 serial clock/HSPI serial
clock/NAND flash read enable
H4
74
C24
VDDQ
—
I/O VDD
75
C25
IRQ/IRL7/FD7
I/IO
IRL IRQ interrupt request 7/
NAND flash data
76
D1
MDA1
IO
DDR data
77
D2
MDA16
IO
DDR data
78
D3
VSSQ-DDR
—
DDR I/O GND
79
D4
VCCQ-DDR
—
DDR I/O VCC
80
D5
VSSQ-DDR
—
DDR I/O GND
81
D6
VSSQ-DDR
—
DDR I/O GND
82
D7
VCCQ-DDR
—
DDR I/O VCC
83
D8
VCCQ-DDR
—
DDR I/O VCC
84
D9
VSSQ-DDR
—
DDR I/O GND
85
D10
VSSQ-DDR
—
DDR I/O GND
86
D11
VCCQ-DDR
—
DDR I/O VCC
87
D12
VSSQ
—
I/O GND
88
D13
VDDQ
—
I/O VDD
89
D14
VDDQ
—
I/O VDD
90
D15
VSSQ
—
I/O GND
91
D16
TMS
I
H-UDI emulator
92
D17
TRST
I
H-UDI emulator
93
D18
AUDATA2/FD2
O/IO
H-UDI emulator/NAND flash data
94
D19
SIOF_MCLK/HAC_RES
I/O
SIOF master clock/HAC reset
J2
95
D20
SCIF1_RXD/MCDAT
I/IO
SCIF1 receive data/MMCIF data
H5
96
D21
SCIF0_CTS/INTD/FCLE
IO/I/O
SCIF modem control/PCI interrupt D
/NAND flash command latch enable
H1*
97
D22
VDD
—
Internal VDD
Pin Name
Rev.1.00 Dec. 13, 2005 Page 14 of 1286
REJ09B0158-0100
I/O
Function
GPIO*
E6*
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
98
D23
VDD
—
Internal VDD
99
D24
IRQ/IRL6/FD6/MODE6
I/IO/I
IRL IRQ interrupt request 6/NAND flash
data/mode control 6
100
D25
IRQ/IRL5/FD5/MODE4
I/IO/I
IRL IRQ interrupt request 5/NAND flash
data/mode control 4
101
E1
MDA2
IO
DDR data
102
E2
MDA17
IO
DDR data
103
E3
MDA18
IO
DDR data
104
E4
VCCQ-DDR
—
DDR I/O VCC
105
E5
VSSQ-DDR
—
DDR I/O GND
106
E6
VSSQ-DDR
—
DDR I/O GND
107
E7
VCCQ-DDR
—
DDR I/O VCC
108
E8
VDD
—
Internal VDD
109
E9
VSS
—
Internal GND
110
E10
VSSQ-DDR
—
DDR I/O GND
111
E11
VCCQ-DDR
—
DDR I/O VCC
112
E12
VSSQ
—
I/O GND
113
E13
VDDQ
—
I/O VDD
114
E14
VDD
—
Internal VDD
115
E15
VSS
—
Internal GND
116
E16
VSSQ
—
I/O GND
117
E17
VSSQ
—
I/O GND
118
E18
VDDQ
—
I/O VDD
119
E19
VDDQ
—
I/O VDD
120
E20
VDDQ
—
I/O VDD
121
E21
VSSQ
—
I/O GND
122
E22
VDD
—
Internal VDD
123
E23
IRQ/IRL4/FD4/MODE3
I/IO/I
IRL IRQ interrupt request 4/
NAND flash data/mode control 3
124
E24
IRQ/IRL3
I
IRL IRQ interrupt request 3
125
E25
IRQ/IRL2
I
IRL IRQ interrupt request 2
GPIO*
Rev.1.00 Dec. 13, 2005 Page 15 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
126
F1
MDA3
IO
DDR data
127
F2
MDA19
IO
DDR data
128
F3
MDA20
IO
DDR data
129
F4
VCCQ-DDR
—
DDR I/O VCC
130
F5
VSSQ-DDR
—
DDR I/O GND
131
F21
VDDQ
—
I/O VDD
132
F22
VDDQ
—
I/O VDD
133
F23
IRQ/IRL1
I
IRL IRQ interrupt request 1
134
F24
IRQ/IRL0
I
IRL IRQ interrupt request 0
135
F25
NMI
I
Nonmaskable interrupt
136
G1
MDA4
IO
DDR data
137
G2
MDA21
IO
DDR data
138
G3
MDA22
IO
DDR data
139
G4
VSS
—
Internal GND
140
G5
VSS
—
Internal GND
141
G21
VSSQ
—
I/O GND
142
G22
AD1
IO
PCI address/data
D1
143
G23
AD3
IO
PCI address/data
D3
144
G24
AD5
IO
PCI address/data
D5
145
G25
AD0
IO
PCI address/data
D0
146
H1
MDA5
IO
DDR data
147
H2
MDA23
IO
DDR data
148
H3
MDQS2
IO
DDR data strobe
149
H4
VDD
—
Internal VDD
150
H5
VDD
—
Internal VDD
151
H21
VSS
—
Internal GND
152
H22
AD7
IO
PCI address/data
D7
153
H23
AD8
IO
PCI address/data
C0
154
H24
AD2
IO
PCI address/data
D2
155
H25
AD4
IO
PCI address/data
D4
Rev.1.00 Dec. 13, 2005 Page 16 of 1286
REJ09B0158-0100
GPIO*
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
156
J1
MDA7
IO
DDR data
157
J2
MDA6
IO
DDR data
158
J3
MDQM2
O
DDR data mask
159
J4
VDD-DLL1
—
DLL1 VDD
160
J5
VSS-DLL1
—
DLL1 GND
161
J21
VDD
—
Internal VDD
162
J22
AD10
IO
PCI address/data
C2
163
J23
AD12
IO
PCI address/data
C4
164
J24
AD6
IO
PCI address/data
D6
165
J25
CBE0
IO
PCI command/byte enable
166
K1
MDQM0
O
DDR data mask
167
K2
MDQS0
IO
DDR data strobe
168
K3
MDQS3
IO
DDR data strobe
169
K4
VDD
—
Internal VDD
170
K5
VSS
—
Internal GND
171
K10
VSS
—
Internal GND
172
K11
VSS
—
Internal GND
173
K12
VSS
—
Internal GND
174
K13
VSS
—
Internal GND
175
K14
VSS
—
Internal GND
176
K15
VSS
—
Internal GND
177
K16
VSS
—
Internal GND
178
K21
VDD
—
Internal VDD
179
K22
AD14
IO
PCI address/data
180
K23
CBE1
IO
PCI command/byte enable
181
K24
AD9
IO
PCI address/data
C1
182
K25
AD11
IO
PCI address/data
C3
183
L1
MDQS1
IO
DDR data strobe
184
L2
MDQM1
O
DDR data mask
GPIO*
C6
Rev.1.00 Dec. 13, 2005 Page 17 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
185
L3
MDQM3
O
DDR data mask
186
L4
VDD
—
Internal VDD
187
L5
VSS
—
Internal GND
188
L10
VSS
—
Internal GND
189
L11
VSS
—
Internal GND
190
L12
VSS
—
Internal GND
191
L13
VSSQ
—
I/O GND
192
L14
VSS
—
Internal GND
193
L15
VSS
—
Internal GND
194
L16
VSS
—
Internal GND
195
L21
VDDQ
—
I/O VDD
196
L22
SERR
IO
PCI system error
197
L23
PERR
IO
PCI parity error
198
L24
AD13
IO
PCI address/data
C5
199
L25
AD15
IO
PCI address/data
C7
200
M1
MDA8
IO
DDR data
201
M2
MDA24
IO
DDR data
202
M3
MDA25
IO
DDR data
203
M4
VDD-DLL2
—
DLL2 VDD
204
M5
VSS-DLL2
—
DLL2 GND
205
M10
VSS
—
Internal GND
206
M11
VSS
—
Internal GND
207
M12
VSSQ-DDR
—
DDR I/O GND
208
M13
VSSQ
—
I/O GND
209
M14
VSS
—
Internal GND
210
M15
VSS
—
Internal GND
211
M16
VSS
—
Internal GND
212
M21
VSS
—
Internal GND
213
M22
LOCK
IO
PCI lock
214
M23
DEVSEL
IO
PCI device select
Rev.1.00 Dec. 13, 2005 Page 18 of 1286
REJ09B0158-0100
GPIO*
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
215
M24
PAR
IO
PCI parity
216
M25
STOP
IO
PCI transaction stop
217
N1
MDA9
IO
DDR data
218
N2
MDA26
IO
DDR data
219
N3
MDA27
IO
DDR data
220
N4
VSSQ-DDR
—
DDR I/O GND
221
N5
VSSQ-DDR
—
DDR I/O GND
222
N10
VSS
—
Internal GND
223
N11
VSS
—
Internal GND
224
N12
VSSQ-DDR
—
DDR I/O GND
225
N13
VSSQ
—
I/O GND
226
N14
VSS
—
Internal GND
227
N15
VSS
—
Internal GND
228
N16
VSS
—
Internal GND
229
N21
VSS
—
Internal GND
230
N22
IRDY
IO
PCI initiator ready
231
N23
CBE2
IO
PCI command/byte enable
232
N24
TRDY
IO
PCI target ready
233
N25
PCIFRAME
IO
PCI cycle frame
234
P1
MDA10
IO
DDR data
235
P2
MDA28
IO
DDR data
236
P3
MDA29
IO
DDR data
237
P4
VCCQ-DDR
—
DDR I/O VCC
238
P5
VCCQ-DDR
—
DDR I/O VCC
239
P10
VSS
—
Internal GND
240
P11
VSS
—
Internal GND
241
P12
VSSQ-DDR
—
DDR I/O GND
242
P13
VSSQ
—
I/O GND
243
P14
VSS
—
Internal GND
244
P15
VSS
—
Internal GND
GPIO*
Rev.1.00 Dec. 13, 2005 Page 19 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
245
P16
VSS
—
Internal GND
246
P21
VDD
—
Internal VDD
247
P22
AD17
IO
PCI address/data
B1
248
P23
AD19
IO
PCI address/data
B3
249
P24
AD16
IO
PCI address/data
B0
250
P25
AD18
IO
PCI address/data
B2
251
R1
MDA11
IO
DDR data
252
R2
MDA30
IO
DDR data
253
R3
MDA31
IO
DDR data
254
R4
VCCQ-DDR
—
DDR I/O VCC
255
R5
VCCQ-DDR
—
DDR I/O VCC
256
R10
VSS
—
Internal GND
257
R11
VSS
—
Internal GND
258
R12
VSS
—
Internal GND
259
R13
VSSQ
—
I/O GND
260
R14
VSS
—
Internal GND
261
R15
VSS
—
Internal GND
262
R16
VSS
—
Internal GND
263
R21
VDDQ
—
I/O VDD
264
R22
AD21
IO
PCI address/data
B5
265
R23
AD23
IO
PCI address/data
B7
266
R24
AD20
IO
PCI address/data
B4
267
R25
AD22
IO
PCI address/data
B6
268
T1
MDA13
IO
DDR data
269
T2
MDA12
IO
DDR data
270
T3
VSSQ-DDR
—
DDR I/O GND
271
T4
VSSQ-DDR
—
DDR I/O GND
272
T5
VCCQ-DDR
—
DDR I/O VCC
273
T10
VSS
—
Internal GND
274
T11
VSS
—
Internal GND
Rev.1.00 Dec. 13, 2005 Page 20 of 1286
REJ09B0158-0100
GPIO*
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
275
T12
VSS
—
Internal GND
276
T13
VSS
—
Internal GND
277
T14
VSS
—
Internal GND
278
T15
VSS
—
Internal GND
279
T16
VSS
—
Internal GND
280
T21
VDD
—
Internal VDD
281
T22
CBE3
IO
PCI command/byte enable
282
T23
AD25
IO
PCI address/data
283
T24
IDSEL
I
PCI configuration device select
284
T25
AD24
IO
PCI address/data
285
U1
MDA15
IO
DDR data
286
U2
MDA14
IO
DDR data
287
U3
VSSQ-DDR
—
DDR I/O GND
288
U4
VSSQ-DDR
—
DDR I/O GND
289
U5
VSSQ-DDR
—
DDR I/O GND
290
U21
VDD
—
Internal VDD
291
U22
AD27
IO
PCI address/data
A3
292
U23
AD29
IO
PCI address/data
A5
293
U24
AD26
IO
PCI address/data
A2
294
U25
AD28
IO
PCI address/data
A4
295
V1
VCCQ-DDR
—
DDR I/O VCC
296
V2
VCCQ-DDR
—
DDR I/O VCC
297
V3
VCCQ-DDR
—
DDR I/O VCC
298
V4
VCCQ-DDR
—
DDR I/O VCC
299
V5
VCCQ-DDR
—
DDR I/O VCC
300
V21
VSS
—
Internal GND
301
V22
AD31
IO
PCI address/data
A7
302
V23
REQ3
I
Bus request (PCI host)
E3*
303
V24
AD30
IO
PCI address/data
A6
304
V25
GNT3
O
PCI bus grant
E0*
GPIO*
A1
A0
Rev.1.00 Dec. 13, 2005 Page 21 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
Pin Name
I/O
Function
305
W1
A25
O
Address bus
306
W2
STATUS0/CMT_CTR0
O/IO
Status0/CMT0 timer counter
307
W3
STATUS1/CMT_CTR1
O/IO
Status1/CMT1 timer counter
308
W4
VDD
—
Internal VDD
309
W5
VDD
—
Internal VDD
310
W21
VSS
—
Internal GND
311
W22
REQ2
I
Bus request (PCI host)
E4*
312
W23
REQ1
I
Bus request (PCI host)
E5*
313
W24
GNT2
O
PCI bus grant
E1*
314
W25
GNT1
O
PCI bus grant
E2*
315
Y1
A22
O
Address bus
316
Y2
A23
O
Address bus
317
Y3
A24
O
Address bus
318
Y4
VSS
—
Internal GND
319
Y5
VSS
—
Internal GND
320
Y21
VDDQ
—
I/O VDD
321
Y22
REQ0/REQOUT
I/O
Bus request (PCI host)/
bus request output
322
Y23
PCICLK
I
PCI input clock
323
Y24
GNT0/GNTIN
O/I
PCI bus grant
324
Y25
PCIRESET
O
PCI reset
325
AA1
A19
O
Address bus
326
AA2
A20
O
Address bus
327
AA3
A21
O
Address bus
328
AA4
VDDQ
—
I/O VDD
329
AA5
VSSQ
—
I/O GND
330
AA6
VSS
—
Internal GND
331
AA7
VDD
—
Internal VDD
332
AA8
VDDQ
—
I/O VDD
333
AA9
VSSQ
—
I/O GND
Rev.1.00 Dec. 13, 2005 Page 22 of 1286
REJ09B0158-0100
GPIO*
Section 1 Overview
No.
Pin
No.
334
Pin Name
I/O
Function
GPIO*
AA10 VSS
—
Internal GND
335
AA11 VDD
—
Internal VDD
336
AA12 VDDQ
—
I/O VDD
337
AA13 VSSQ
—
I/O GND
338
AA14 VSSQ
—
I/O GND
339
AA15 VDD
—
Internal VDD
340
AA16 VSS
—
Internal GND
341
AA17 VDDQ
—
I/O VDD
342
AA18 VDDQ
—
I/O VDD
343
AA19 VSSQ
—
I/O GND
344
AA20 VSSQ
—
I/O GND
345
AA21 VSSQ
—
I/O GND
346
AA22 NC
—
Open
347
AA23 NC
—
Open
348
AA24 VSS
—
Internal GND
349
AA25 INTA
IO
PCI interrupt A
350
AB1
A16
O
Address bus
351
AB2
A17
O
Address bus
352
AB3
A18
O
Address bus
353
AB4
VSSQ
—
I/O GND
354
AB5
A6
O
Address bus
355
AB6
A2
O
Address bus
356
AB7
D30
IO
Data bus
F6
357
AB8
D26
IO
Data bus
F2
358
AB9
D23
IO
Data bus
G7
359
AB10 VSSQ
—
I/O GND
360
AB11 VDDQ
—
I/O VDD
361
AB12 VDDQ
—
I/O VDD
362
AB13 VSSQ
—
I/O GND
363
AB14 VDDQ
—
I/O VDD
Rev.1.00 Dec. 13, 2005 Page 23 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
364
Pin Name
I/O
Function
AB15 VDDQ
—
I/O VDD
365
AB16 VSSQ
—
I/O GND
366
AB17 BACK
O
Bus acknowledgement
367
AB18 CS4
O
Chip select 4
368
AB19 CS6
O
Chip select 6
369
AB20 VSS-PLL3
—
PLL3 GND
370
AB21 VDD
—
Internal VDD
371
AB22 VDDQ
—
I/O VDD
372
AB23 VDDQ
—
I/O VDD
373
AB24 VSS
—
Internal GND
374
AB25 VSS
—
Internal GND
375
AC1
A14
O
Address bus
376
AC2
A15
O
Address bus
377
AC3
VDDQ
—
I/O VDD
378
AC4
A9
O
Address bus
379
AC5
A5
O
Address bus
380
AC6
A1
O
Address bus
381
AC7
D29
IO
Data bus
F5
382
AC8
D25
IO
Data bus
F1
383
AC9
D22
IO
Data bus
G6
384
AC10 D19
IO
Data bus
G3
385
AC11 D15
IO
Data bus
386
AC12 D14
IO
Data bus
387
AC13 D11
IO
Data bus
388
AC14 D8
IO
Data bus
389
AC15 D6
IO
Data bus
390
AC16 D3
IO
Data bus
391
AC17 BREQ
I
Bus request
392
AC18 BS
O
Bus start
393
AC19 CS5
O
Chip select 5
Rev.1.00 Dec. 13, 2005 Page 24 of 1286
REJ09B0158-0100
GPIO*
M0
M1
Section 1 Overview
No.
Pin
No.
394
Pin Name
I/O
Function
GPIO*
AC20 CS1
O
Chip select 1
395
AC21 VSS-PLL2
—
PLL2 GND
396
AC22 VDD
—
Internal VDD
397
AC23 VDDQ
—
I/O VDD
398
AC24 VDDQ
—
I/O VDD
399
AC25 MPMD
I
Mode control
400
AD1
A13
O
Address bus
401
AD2
VDDQ
—
I/O VDD
402
AD3
A11
O
Address bus
403
AD4
A8
O
Address bus
404
AD5
A4
O
Address bus
405
AD6
A0
O
Address bus
406
AD7
D28
IO
Data bus
F4
407
AD8
D24
IO
Data bus
F0
408
AD9
D21
IO
Data bus
G5
409
AD10 D18
IO
Data bus
G2
410
AD11 D16
IO
Data bus
G0
411
AD12 D13
IO
Data bus
412
AD13 D10
IO
Data bus
413
AD14 D7
IO
Data bus
414
AD15 D5
IO
Data bus
415
AD16 D2
IO
Data bus
416
AD17 D0
IO
Data bus
417
AD18 RD/FRAME
O
Read strobe/MPX interface cycle frame
418
AD19 CS2
O
Chip select 2
419
AD20 CS0
O
Chip select 0
420
AD21 VDD-PLL3
—
PLL3 VDD
421
AD22 VSS-PLL1
—
PLL1 GND
422
AD23 VSSQ
—
I/O GND
423
AD24 VDDQ
—
I/O VDD
Rev.1.00 Dec. 13, 2005 Page 25 of 1286
REJ09B0158-0100
Section 1 Overview
No.
Pin
No.
424
I/O
Function
AD25 VSSQ
—
I/O GND
425
AE1
VSSQ
—
I/O GND
426
AE2
A12
O
Address bus
427
AE3
A10
O
Address bus
428
AE4
A7
O
Address bus
429
AE5
A3
O
Address bus
430
AE6
D31
IO
Data bus
F7
431
AE7
D27
IO
Data bus
F3
432
AE8
WE3/IOWR
O/O
Selection signal for D31 to D24
433
AE9
D20
IO
Data bus
G4
434
AE10 D17
IO
Data bus
G1
435
AE11 WE2/IORD
O/O
Selection signal for D23 to D16/PCMCIA
IORD
436
AE12 D12
IO
Data bus
437
AE13 D9
IO
Data bus
438
AE14 WE1
O
Selection signal for D15 to D8
439
AE15 D4
IO
Data bus
440
AE16 D1
IO
Data bus
441
AE17 WE0/REG
O/O
Selection signal for D7 to D0/PCMCIA
REG
442
AE18 R/W
O
Read/write
443
AE19 RDY
I
Bus ready
444
AE20 CLKOUT
O
Clock output
445
AE21 VDD-PLL2
—
PLL2 VDD
446
AE22 VDD-PLL1
—
PLL1 VDD
447
AE23 XTAL
O
Crystal resonator
448
AE24 EXTAL
I
External input clock/crystal resonator
449
AE25 VSSQ
—
I/O GND
Note:
*
Pin Name
Can be used as a GPIO interrupt pin. (O) Only outputs.
Rev.1.00 Dec. 13, 2005 Page 26 of 1286
REJ09B0158-0100
GPIO*
Section 1 Overview
1.5
Memory Address Map
The SH7780 supports 32-bit virtual address space, and supports both 29-bit and 32-bit physical
address spaces (normal mode and extended mode). For details of mappings from the virtual
address space to the physical address spaces, see section 7, Memory Management Unit (MMU).
The external memory space of the SH7780 consists of the LBSC space, DDRIF space and PCIC
space. The LBSC has up to 384 Mbytes, the DDRIF has up to 256 Mbytes and the PCIC has up to
512 Mbytes external memory space individually and the SH7780 can control the external memory
space up to 1152 Mbytes totally. Areas 0, 1, and 6 are controlled by the LBSC. Areas 2, 4, and 5
are controlled by the LBSC, DDRIF or PCIC that depends on the setting of the memory address
map select register (MMSELR) of the LBSC. Note that area 3 is for the DDRIF. For details, see
section 11, Local Bus Sate Controller (LBSC), section 12, DDR-SDRAM Interface (DDRIF) or
section 13, PCI Controller (PCIC).
Figure 1.3 shows the physical address space of the SH7780. Figure 1.4 shows the relationship
between the AREASEL bits and the memory address map. The 32-bit physical address space
corresponds with the address space of the SuperHyway bus.
Rev.1.00 Dec. 13, 2005 Page 27 of 1286
REJ09B0158-0100
Section 1 Overview
H'0000 0000
Area 0 (LBSC)
H'0400 0000
Area 1 (LBSC)
H'0800 0000
Area 2 (LBSC/DDRIF)
H'0C00 0000
Area 3 (DDRIF)
H'1000 0000
Area 4 (LBSC/DDRIF/PCIC)
H'1400 0000
Area 5 (LBSC/DDRIF)
H'1800 0000
Area 6 (LBSC)
H'1C00 0000
Area 7 (Reserved)
H'2000 0000
29-bit physical address space
(Normal mode)
(Undefined)
32-bit physical address space
(Extended mode)
H'4000 0000
DDR-SDRAM (DDRIF)
H'E000 0000
Store queue area (64MB)*
H'E500 0000
On-chip memory area (16MB)*
H'F000 0000
Cache, TLB and PMB address
/data array area (128MB)*
Control register area (H'FC00 0000 to H'FFFF FFFF)
H'FC00 0000 H-UDI (8MB)
H'FC80 0000 DMAC (8MB)
H'FD00 0000 PCI memory (16MB)
H'FE00 0000 PCIC (4MB)
H'8000 0000
H'FE40 0000 SuperHyway RAM (4MB)
H'FE80 0000 DDRIF (8MB)
(Undefined)
H'C000 0000
PCI (PCIC)
H'E000 0000
(Internal resources)
H'FFFF FFFF
H'FF00 0000
CPU (4MB)
H'FF40 0000
SuperHyway router (4MB)
H'FF80 0000
LBSC (4MB)
H'FFC0 0000 Peripheral modules (4MB)
Note: For details of these areas, refer to section 7.1.1, Address Spaces.
Figure 1.3 Physical Address Space of SH7780
Rev.1.00 Dec. 13, 2005 Page 28 of 1286
REJ09B0158-0100
Section 1 Overview
MMSELR.AREASEL[2:0]*
B'000
B'001
B'010
B'011
B'100
Area 0 (LBSC)
LBSC
LBSC
LBSC
LBSC
LBSC
Area 1 (LBSC)
LBSC
LBSC
LBSC
LBSC
LBSC
Area 2 (LBSC/DDRIF)
LBSC
LBSC
DDRIF-0
DDRIF-0
DDRIF-0
Area 3 (DDRIF)
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
Area 4 (LBSC/DDRIF/PCIC)
LBSC
PCIC
LBSC
PCIC
DDRIF-2
Area 5 (LBSC/DDRIF)
LBSC
LBSC
LBSC
LBSC
DDRIF-3
Area 6 (LBSC)
LBSC
LBSC
LBSC
LBSC
LBSC
H'4000 0000
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
H'4400 0000
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
H'4800 0000
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
H'4C00 0000
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
H'5000 0000
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
H'5400 0000
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
H'5800 0000
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
DDRIF-2
H'6800 0000
DDRIF-3
DDRIF-0
DDRIF-3
DDRIF-0
DDRIF-3
DDRIF-0
DDRIF-3
DDRIF-0
DDRIF-3
DDRIF-0
H'6C00 0000
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-2
DDRIF-2
DDRIF-1
DDRIF-2
DDRIF-1
H'7000 0000
DDRIF-2
DDRIF-2
H'7400 0000
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-3
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-0
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
DDRIF-1
PCIC
PCIC
PCIC
PCIC
PCIC
H'0000 0000
H'0400 0000
H'0800 0000
H'0C00 0000
H'1000 0000
H'1400 0000
H'1800 0000
H'1C00 0000
29-bit physical
address space
(Normal mode)
Area 7 (Reserved area)
H'2000 0000
(Undefined)
H'5C00 0000
DDR-SDRAM (DDRIF)
H'6000 0000
H'6400 0000
: Shadow
H'7800 0000
H'7C00 0000
32-bit physical
address space
(Extended mode)
H'8000 0000
(Undefined)
H'C000 0000
PCI (PCIC)
H'E000 0000
H'FFFF FFFF
(Internal resources)
Note: Memory Address Map Select Register (MMSELR) Area Select Bit (AREASEL)
For details, refer to section 11.4.1, Memory Address Map Select Register (MMSELR).
Figure 1.4 Relationship between AREASEL Bits and Memory Address Map
Rev.1.00 Dec. 13, 2005 Page 29 of 1286
REJ09B0158-0100
Section 1 Overview
1.6
SuperHyway Bus
The SH7780 is implemented with the SuperHyway bus as the system bus.
The SuperHyway bus is a 32-bit-address, 64-bit-data internal bus capable of up to 200 MHz
operation that is connected to on-chip modules to allow high speed communication.
Each module that is connected to the SuperHyway bus operates as an initiator (i.e. , bus master)
that issues a transfer request or a target that replies with a response to the request. The transaction
is controlled by the dedicated SuperHyway router.
The CPU, PCIC, and DMAC modules can all operate as an initiator. The LRU method is used to
decide the request priority of the SuperHyway bus mastership. The initial request priority order is:
CPU > DMAC > PCIC. The response priority level is fixed: peripheral modules* > DMAC > CPU
> SuperHyway RAM > LBSC > PCIC > DDRIF. Note that when using debugging function (HUDI emulator), the debugging functional module has the highest priority.
The transfer data size varies with each module. For details, refer to the corresponding section for
each module.
An actual transaction on the SuperHyway bus is started from a request issued by the initiator
module according to a read/write command sent to the SuperHyway bus address (physical
address), and then the target module replies with a response to the request (LOAD/STORE
transaction). In addition, a transaction that controls the cache coherency occurs if necessary
(FLUSH/PURGE transaction). Note that these transactions are done automatically by the
SuperHyway modules, so they cannot be explicitly issued by software.
Note: "Peripheral modules" means modules that are connected to the peripheral bus (except for
the INTC and DMAC modules).
Rev.1.00 Dec. 13, 2005 Page 30 of 1286
REJ09B0158-0100
Section 1 Overview
1.7
SuperHyway Memory (SuperHyway RAM)
The SH7780 includes an on-chip SuperHyway memory which stores instructions or data. The
SuperHyway memory has the following features.
• Capacity
Total SuperHyway memory capacity is 32 Kbytes (512 words × 256 bits × 2 pages).
• Memory address map
The SuperHyway memory is allocated within the physical address H'FE41 0000 to H'FE41
3FFF and H'FE42 0000 to H'FE42 3FFF.
• Ports
Each page has one common read and write port, and is connected to the SuperHyway bus via a
4-stage buffer respectively. High-speed access to the SuperHyway memory is enabled by the
SuperHyway bus master.
• Access
The SuperHyway memory is always accessed by the SuperHyway bus master module,
including the CPU, via the SuperHyway bus which is a physical address bus.
1-/2-/4-/8-/16-/32-byte access is possible for both reading and writing
(with wraparound on 32-byte boundary data).
A 32-byte cache fill can be read out with one access
(an 8-byte × 4 transfer on the SuperHyway bus).
Note that the read/write operation on the SuperHyway bus is done with one clock. After that
the bus is released.
• Minimum access time
1-/2-/4-/8-byte read access: 14 clock cycles; 1-/2-/4-/8-byte write access: 12 clock cycles
16-/32-byte read access: 17 clock cycles; 16-/32-byte write access: 15 clock cycles
(The SuperHyway clock ≤ 200 MHz)
• Usage note
A SuperHyway bus master module, such as DMAC, can access the SuperHyway memory in
sleep mode.
Rev.1.00 Dec. 13, 2005 Page 31 of 1286
REJ09B0158-0100
Section 1 Overview
Rev.1.00 Dec. 13, 2005 Page 32 of 1286
REJ09B0158-0100
Section 2 Programming Model
Section 2 Programming Model
The programming model of this LSI is explained in this section. This LSI has registers and data
formats as shown below.
2.1
Data Formats
The data formats supported in this LSI are shown in figure 2.1.
7
0
Byte (8 bits)
15
0
Word (16 bits)
31
0
Longword (32 bits)
31 30
s
e
Single-precision floating-point (32 bits)
Double-precision floating-point (64 bits)
63 62
s
e
51
22
0
f
0
f
[Legend]
s: Sign field
e: Exponent field
f: Fraction field
Figure 2.1 Data Formats
Rev.1.00 Dec. 13, 2005 Page 33 of 1286
REJ09B0158-0100
Section 2 Programming Model
2.2
Register Descriptions
2.2.1
Privileged Mode and Banks
Processing Modes: This LSI has two processing modes, user mode and privileged mode. This
LSI normally operates in user mode, and switches to privileged mode when an exception occurs or
an interrupt is accepted. There are four kinds of registers—general registers, system registers,
control registers, and floating-point registers—and the registers that can be accessed differ in the
two processing modes.
General Registers: There are 16 general registers, designated R0 to R15. General registers R0 to
R7 are banked registers which are switched by a processing mode change.
• Privileged mode
In privileged mode, the register bank bit (RB) in the status register (SR) defines which banked
register set is accessed as general registers, and which set is accessed only through the load
control register (LDC) and store control register (STC) instructions.
When the RB bit is 1 (that is, when bank 1 is selected), the 16 registers comprising bank 1
general registers R0_BANK1 to R7_BANK1 and non-banked general registers R8 to R15 can
be accessed as general registers R0 to R15. In this case, the eight registers comprising bank 0
general registers R0_BANK0 to R7_BANK0 are accessed by the LDC/STC instructions.
When the RB bit is 0 (that is, when bank 0 is selected), the 16 registers comprising bank 0
general registers R0_BANK0 to R7_BANK0 and non-banked general registers R8 to R15 can
be accessed as general registers R0 to R15. In this case, the eight registers comprising bank 1
general registers R0_BANK1 to R7_BANK1 are accessed by the LDC/STC instructions.
• User mode
In user mode, the 16 registers comprising bank 0 general registers R0_BANK0 to R7_BANK0
and non-banked general registers R8 to R15 can be accessed as general registers R0 to R15.
The eight registers comprising bank 1 general registers R0_BANK1 to R7_BANK1 cannot be
accessed.
Control Registers: Control registers comprise the global base register (GBR) and status register
(SR), which can be accessed in both processing modes, and the saved status register (SSR), saved
program counter (SPC), vector base register (VBR), saved general register 15 (SGR), and debug
base register (DBR), which can only be accessed in privileged mode. Some bits of the status
register (such as the RB bit) can only be accessed in privileged mode.
System Registers: System registers comprise the multiply-and-accumulate registers
(MACH/MACL), the procedure register (PR), and the program counter (PC). Access to these
registers does not depend on the processing mode.
Rev.1.00 Dec. 13, 2005 Page 34 of 1286
REJ09B0158-0100
Section 2 Programming Model
Floating-Point Registers and System Registers Related to FPU: There are thirty-two floatingpoint registers, FR0–FR15 and XF0–XF15. FR0–FR15 and XF0–XF15 can be assigned to either
of two banks (FPR0_BANK0–FPR15_BANK0 or FPR0_BANK1–FPR15_BANK1).
FR0–FR15 can be used as the eight registers DR0/2/4/6/8/10/12/14 (double-precision floatingpoint registers, or pair registers) or the four registers FV0/4/8/12 (register vectors), while XF0–
XF15 can be used as the eight registers XD0/2/4/6/8/10/12/14 (register pairs) or register matrix
XMTRX.
System registers related to the FPU comprise the floating-point communication register (FPUL)
and the floating-point status/control register (FPSCR). These registers are used for communication
between the FPU and the CPU, and the exception handling setting.
Register values after a reset are shown in table 2.1.
Table 2.1
Initial Register Values
Type
Registers
Initial Value*
General registers R0_BANK0 to R7_BANK0,
R0_BANK1 to R7_BANK1,
R8 to R15
Undefined
Control registers SR
MD bit = 1, RB bit = 1, BL bit = 1, FD bit = 0,
IMASK = B'1111, reserved bits = 0,
others = undefined
GBR, SSR, SPC, SGR, DBR Undefined
VBR
System registers MACH, MACL, PR
Floating-point
registers
Note:
*
H'00000000
Undefined
PC
H'A0000000
FR0 to FR15, XF0 to XF15,
FPUL
Undefined
FPSCR
H'00040001
Initialized by a power-on reset and manual reset.
The CPU register configuration in each processing mode is shown in figure 2.2.
User mode and privileged mode are switched by the processing mode bit (MD) in the status
register.
Rev.1.00 Dec. 13, 2005 Page 35 of 1286
REJ09B0158-0100
Section 2 Programming Model
31
0
31
0
31
0
R0_BANK0*1,*2
R1_BANK0*2
R2_BANK0*2
R3_BANK0*2
R4_BANK0*2
R5_BANK0*2
R6_BANK0*2
R7_BANK0*2
R8
R9
R10
R11
R12
R13
R14
R15
R0_BANK1*1,*3
R1_BANK1*3
R2_BANK1*3
R3_BANK1*3
R4_BANK1*3
R5_BANK1*3
R6_BANK1*3
R7_BANK1*3
R8
R9
R10
R11
R12
R13
R14
R15
R0_BANK0*1,*4
R1_BANK0*4
R2_BANK0*4
R3_BANK0*4
R4_BANK0*4
R5_BANK0*4
R6_BANK0*4
R7_BANK0*4
R8
R9
R10
R11
R12
R13
R14
R15
SR
SR
SSR
SR
SSR
GBR
MACH
MACL
PR
GBR
MACH
MACL
PR
VBR
GBR
MACH
MACL
PR
VBR
PC
PC
SPC
PC
SPC
SGR
SGR
DBR
(a) Register configuration
in user mode
R0_BANK0*1,*4
R1_BANK0*4
R2_BANK0*4
R3_BANK0*4
R4_BANK0*4
R5_BANK0*4
R6_BANK0*4
R7_BANK0*4
(b) Register configuration in
privileged mode (RB = 1)
DBR
R0_BANK1*1,*3
R1_BANK1*3
R2_BANK1*3
R3_BANK1*3
R4_BANK1*3
R5_BANK1*3
R6_BANK1*3
R7_BANK1*3
(c) Register configuration in
privileged mode (RB = 0)
Notes: 1. R0 is used as the index register in indexed register-indirect addressing mode and
indexed GBR indirect addressing mode.
2. Banked registers
3. Banked registers
Accessed as general registers when the RB bit is set to 1 in SR. Accessed only by
LDC/STC instructions when the RB bit is cleared to 0.
4. Banked registers
Accessed as general registers when the RB bit is cleared to 0 in SR. Accessed only
by LDC/STC instructions when the RB bit is set to 1.
Figure 2.2 CPU Register Configuration in Each Processing Mode
Rev.1.00 Dec. 13, 2005 Page 36 of 1286
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Section 2 Programming Model
2.2.2
General Registers
Figure 2.3 shows the relationship between the processing modes and general registers. This LSI
has twenty-four 32-bit general registers (R0_BANK0 to R7_BANK0, R0_BANK1 to
R7_BANK1, and R8 to R15). However, only 16 of these can be accessed as general registers R0
to R15 in one processing mode. This LSI has two processing modes, user mode and privileged
mode.
• R0_BANK0 to R7_BANK0
Allocated to R0 to R7 in user mode (SR.MD = 0)
Allocated to R0 to R7 when SR.RB = 0 in privileged mode (SR.MD = 1).
• R0_BANK1 to R7_BANK1
Cannot be accessed in user mode.
Allocated to R0 to R7 when SR.RB = 1 in privileged mode.
SR.MD = 0 or
(SR.MD = 1, SR.RB = 0)
(SR.MD = 1, SR.RB = 1)
R0
R1
R2
R3
R4
R5
R6
R7
R0_BANK0
R1_BANK0
R2_BANK0
R3_BANK0
R4_BANK0
R5_BANK0
R6_BANK0
R7_BANK0
R0_BANK0
R1_BANK0
R2_BANK0
R3_BANK0
R4_BANK0
R5_BANK0
R6_BANK0
R7_BANK0
R0_BANK1
R1_BANK1
R2_BANK1
R3_BANK1
R4_BANK1
R5_BANK1
R6_BANK1
R7_BANK1
R0_BANK1
R1_BANK1
R2_BANK1
R3_BANK1
R4_BANK1
R5_BANK1
R6_BANK1
R7_BANK1
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R8
R9
R10
R11
R12
R13
R14
R15
R8
R9
R10
R11
R12
R13
R14
R15
Figure 2.3 General Registers
Rev.1.00 Dec. 13, 2005 Page 37 of 1286
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Section 2 Programming Model
Note on Programming:
2.2.3
As the user's R0 to R7 are assigned to R0_BANK0 to R7_BANK0, and
after an exception or interrupt R0 to R7 are assigned to R0_BANK1 to
R7_BANK1, it is not necessary for the interrupt handler to save and
restore the user's R0 to R7 (R0_BANK0 to R7_BANK0).
Floating-Point Registers
Figure 2.4 shows the floating-point register configuration. There are thirty-two 32-bit floatingpoint registers, FPR0_BANK0 to FPR15_BANK0, AND FPR0_BANK1 to FPR15_BANK1,
comprising two banks. These registers are referenced as FR0 to FR15, DR0/2/4/6/8/10/12/14,
FV0/4/8/12, XF0 to XF15, XD0/2/4/6/8/10/12/14, or XMTRX. Reference names of each register
are defined depending on the state of the FR bit in FPSCR (see figure 2.4).
1. Floating-point registers, FPRn_BANKi (32 registers)
FPR0_BANK0 to FPR15_BANK0
FPR0_BANK1 to FPR15_BANK1
2. Single-precision floating-point registers, FRi (16 registers)
When FPSCR.FR = 0, FR0 to FR15 are assigned to FPR0_BANK0 to FPR15_BANK0;
when FPSCR.FR = 1, FR0 to FR15 are assigned to FPR0_BANK1 to FPR15_BANK1.
3. Double-precision floating-point registers or single-precision floating-point registers, DRi (8
registers): A DR register comprises two FR registers.
DR0 = {FR0, FR1}, DR2 = {FR2, FR3}, DR4 = {FR4, FR5}, DR6 = {FR6, FR7},
DR8 = {FR8, FR9}, DR10 = {FR10, FR11}, DR12 = {FR12, FR13}, DR14 = {FR14, FR15}
4. Single-precision floating-point vector registers, FVi (4 registers): An FV register comprises
four FR registers.
FV0 = {FR0, FR1, FR2, FR3}, FV4 = {FR4, FR5, FR6, FR7},
FV8 = {FR8, FR9, FR10, FR11}, FV12 = {FR12, FR13, FR14, FR15}
5. Single-precision floating-point extended registers, XFi (16 registers)
When FPSCR.FR = 0, XF0 to XF15 are assigned to FPR0_BANK1 to FPR15_BANK1;
when FPSCR.FR = 1, XF0 to XF15 are assigned to FPR0_BANK0 to FPR15_BANK0.
6. Double-precision floating-point extended registers, XDi (8 registers): An XD register
comprises two XF registers.
XD0 = {XF0, XF1}, XD2 = {XF2, XF3}, XD4 = {XF4, XF5}, XD6 = {XF6, XF7},
XD8 = {XF8, XF9}, XD10 = {XF10, XF11}, XD12 = {XF12, XF13}, XD14 = {XF14, XF15}
Rev.1.00 Dec. 13, 2005 Page 38 of 1286
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Section 2 Programming Model
7. Single-precision floating-point extended register matrix, XMTRX: XMTRX comprises all 16
XF registers.
XMTRX =
XF0
XF1
XF2
XF3
XF4
XF5
XF6
XF7
XF8
XF9
XF10
XF11
XF12
XF13
XF14
XF15
FPSCR.FR=0
FV0
DR0
DR2
FV4
DR4
DR6
FV8
DR8
DR10
FV12
DR12
DR14
XMTRX
XD0
XD2
XD4
XD6
XD8
XD10
XD12
XD14
FPSCR.FR=1
FR0
FR1
FR2
FR3
FR4
FR5
FR6
FR7
FR8
FR9
FR10
FR11
FR12
FR13
FR14
FR15
FPR0_BANK0
FPR1_BANK0
FPR2_BANK0
FPR3_BANK0
FPR4_BANK0
FPR5_BANK0
FPR6_BANK0
FPR7_BANK0
FPR8_BANK0
FPR9_BANK0
FPR10_BANK0
FPR11_BANK0
FPR12_BANK0
FPR13_BANK0
FPR14_BANK0
FPR15_BANK0
XF0
XF1
XF2
XF3
XF4
XF5
XF6
XF7
XF8
XF9
XF10
XF11
XF12
XF13
XF14
XF15
XD0
XF0
XF1
XF2
XF3
XF4
XF5
XF6
XF7
XF8
XF9
XF10
XF11
XF12
XF13
XF14
XF15
FPR0_BANK1
FPR1_BANK1
FPR2_BANK1
FPR3_BANK1
FPR4_BANK1
FPR5_BANK1
FPR6_BANK1
FPR7_BANK1
FPR8_BANK1
FPR9_BANK1
FPR10_BANK1
FPR11_BANK1
FPR12_BANK1
FPR13_BANK1
FPR14_BANK1
FPR15_BANK1
FR0
FR1
FR2
FR3
FR4
FR5
FR6
FR7
FR8
FR9
FR10
FR11
FR12
FR13
FR14
FR15
DR0
XMTRX
XD2
XD4
XD6
XD8
XD10
XD12
XD14
FV0
DR2
DR4
FV4
DR6
DR8
FV8
DR10
DR12
FV12
DR14
Figure 2.4 Floating-Point Registers
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Section 2 Programming Model
2.2.4
Control Registers
Status Register (SR):
BIt:
31
30
29
28
MD
RB
BL
27
26
25
24
23
22
21
20
19
18
17
16
0
R
0
R
0
R
0
R
0
R
0
R
0
R
0
R
0
R
0
R
7
6
5
4
3
2
1
0
0
R
S
0
R/W
T
0
R/W
Initial value:
R/W:
0
R
1
R/W
1
R/W
1
R/W
0
R
0
R
BIt:
15
14
13
12
11
10
9
8
0
R
M
0
R/W
Q
0
R/W
FD
Initial value: 0
R/W: R/W
0
R
0
R
0
R
0
R
1
R/W
Bit
Bit Name
Initial
Value
R/W
Description
31
—
0
R
Reserved
IMASK
1
1
R/W R/W
1
R/W
0
R
For details on reading/writing this bit, see General
Precautions on Handling of Product.
30
MD
1
R/W
Processing Mode
Selects the processing mode.
0: User mode (Some instructions cannot be executed
and some resources cannot be accessed.)
1: Privileged mode
This bit is set to 1 by an exception or interrupt.
29
RB
1
R/W
Privileged Mode General Register Bank Specification
Bit
0: R0_BANK0 to R7_BANK0 are accessed as general
registers R0 to R7 and R0_BANK1 to R7_BANK1
can be accessed using LDC/STC instructions
1: R0_BANK1 to R7_BANK1 are accessed as general
registers R0 to R7 and R0_BANK0–R7_BANK0
can be accessed using LDC/STC instructions
This bit is set to 1 by an exception or interrupt.
28
BL
1
R/W
Exception/Interrupt Block Bit
This bit is set to 1 by a reset, an exception, or an
interrupt. While this bit is set to 1, an interrupt request
is masked. In this case, this processor enters the reset
state when a general exception other than a user
break occurs.
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Section 2 Programming Model
Bit
Bit Name
27 to 16 —
Initial
Value
R/W
Description
All 0
R
Reserved
For details on reading/writing this bit, see General
Precautions on Handling of Product.
15
FD
0
R/W
FPU Disable Bit
When this bit is set to 1 and an FPU instruction is not in
a delay slot, a general FPU disable exception occurs.
When this bit is set to 1 and an FPU instruction is in a
delay slot, a slot FPU disable exception occurs. (FPU
instructions: H'F*** instructions and LDS (.L)/STS(.L)
instructions using FPUL/FPSCR)
14 to 10 —
All 0
R
Reserved
For details on reading/writing this bit, see General
Precautions on Handling of Product.
9
M
0
R/W
M Bit
Used by the DIV0S, DIV0U, and DIV1 instructions.
8
Q
0
R/W
Q Bit
7 to 4
IMASK
All 1
R/W
Interrupt Mask Level Bits
Used by the DIV0S, DIV0U, and DIV1 instructions.
An interrupt whose priority is equal to or less than the
value of the IMASK bits is masked. It can be chosen by
CPU operation mode register (CPUOPM) whether the
level of IMASK is changed to accept an interrupt or not
when an interrupt is occurred. For details, see Appendix
A, CPU Operation Mode Register (CPUOPM).
3, 2
—
All 0
R
Reserved
For details on reading/writing this bit, see General
Precautions on Handling of Product.
1
S
0
R/W
S Bit
Used by the MAC instruction.
0
T
0
R/W
T Bit
Indicates true/false condition, carry/borrow, or
overflow/underflow.
For details, see section 3, Instruction Set.
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Section 2 Programming Model
Saved Status Register (SSR) (32 bits, Privileged Mode, Initial Value = Undefined): The
contents of SR are saved to SSR in the event of an exception or interrupt.
Saved Program Counter (SPC) (32 bits, Privileged Mode, Initial Value = Undefined): The
address of an instruction at which an interrupt or exception occurs is saved to SPC.
Global Base Register (GBR) (32 bits, Initial Value = Undefined): GBR is referenced as the
base address of addressing @(disp,GBR) and @(R0,GBR).
Vector Base Register (VBR) (32 bits, Privileged Mode, Initial Value = H'00000000): VBR is
referenced as the branch destination base address in the event of an exception or interrupt. For
details, see section 5, Exception Handling.
Saved General Register 15 (SGR) (32 bits, Privileged Mode, Initial Value = Undefined): The
contents of R15 are saved to SGR in the event of an exception or interrupt.
Debug Base Register (DBR) (32 bits, Privileged Mode, Initial Value = Undefined): When the
user break debugging function is enabled (CBCR.UBDE = 1), DBR is referenced as the branch
destination address of the user break handler instead of VBR.
2.2.5
System Registers
Multiply-and-Accumulate Registers (MACH and MACL) (32 bits, Initial Value =
Undefined): MACH and MACL are used for the added value in a MAC instruction, and to store
the operation result of a MAC or MUL instruction.
Procedure Register (PR) (32 bits, Initial Value = Undefined): The return address is stored in
PR in a subroutine call using a BSR, BSRF, or JSR instruction. PR is referenced by the subroutine
return instruction (RTS).
Program Counter (PC) (32 bits, Initial Value = H'A0000000): PC indicates the address of the
instruction currently being executed.
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Section 2 Programming Model
Floating-Point Status/Control Register (FPSCR)
BIt:
31
30
29
28
27
26
Initial value:
R/W:
0
R
0
R
0
R
0
R
0
R
0
R
BIt:
15
14
13
12
11
10
Cause
Initial value:
R/W:
Bit
0
R/W
0
R/W
Bit Name
31 to 22 —
0
R/W
25
24
23
22
21
20
19
18
FR
SZ
PR
DN
0
R/W
0
R/W
1
R/W
0
R/W
0
R/W
4
3
2
1
0
0
R
0
R
0
R
0
R
0
R/W
9
8
7
6
5
Enable (EN)
0
R/W
0
R/W
0
R/W
0
R/W
0
R/W
Initial
Value
R/W
Description
All 0
R
Reserved
17
Flag
0
R/W
0
R/W
0
R/W
0
R/W
16
Cause
RM
0
R/W
0
R/W
0
R/W
1
R/W
For details on reading/writing this bit, see General
Precautions on Handling of Product.
21
FR
0
R/W
Floating-Point Register Bank
0: FPR0_BANK0 to FPR15_BANK0 are assigned to
FR0 to FR15 and FPR0_BANK1 to FPR15_BANK1
are assigned to XF0 to XF15
1: FPR0_BANK0 to FPR15_BANK0 are assigned to
XF0 to XF15 and FPR0_BANK1 to FPR15_BANK1
are assigned to FR0 to FR15
20
SZ
0
R/W
Transfer Size Mode
0: Data size of FMOV instruction is 32-bits
1: Data size of FMOV instruction is a 32-bit register
pair (64 bits)
For relationship between the SZ bit, PR bit, and endian,
see figure 2.5.
19
PR
0
R/W
Precision Mode
0: Floating-point instructions are executed as
single-precision operations
1: Floating-point instructions are executed as
double-precision operations (graphics support
instructions are undefined)
For relationship between the SZ bit, PR bit, and endian,
see figure 2.5
18
DN
1
R/W
Denormalization Mode
0: Denormalized number is treated as such
1: Denormalized number is treated as zero
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Section 2 Programming Model
Initial
Value
R/W
Description
All 0
R/W
FPU Exception Cause Field
11 to 7
Enable (EN) All 0
R/W
FPU Exception Enable Field
6 to 2
Flag
R/W
FPU Exception Flag Field
Bit
Bit Name
17 to 12 Cause
All 0
Each time an FPU operation instruction is executed, the
FPU exception cause field is cleared to 0. When an FPU
exception occurs, the bits corresponding to FPU
exception cause field and flag field are set to 1. The
FPU exception flag field remains set to 1 until it is
cleared to 0 by software.
For bit allocations of each field, see table 2.2.
1, 0
RM
01
R/W
Rounding Mode
These bits select the rounding mode.
00: Round to Nearest
01: Round to Zero
10: Reserved
11: Reserved
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Section 2 Programming Model
63
0
Floating-point register
DR (2i)
63
0
FR (2i)
63
FR (2i+1)
32 31
0
Memory area
8n
8n+3
8n+4
8n+7
63
0
Floating-point register
63
0
DR (2i)
0
*2
63
FR (2i+1)
63
0
DR (2i)
*1, *2
63
FR (2i)
63
DR (2i)
32 31
0
FR (2i)
0
63
4m
8n+3
63
FR (2i+1)
32 31
0
FR (2i)
0
63
8n+4
8n+7
FR (2i+1)
32 31
0
8n+4 8n+3
8n
Memory area
4n+3
4n 4m+3
(1) SZ = 0
8n 8n+7
(2) SZ = 1, PR = 0
(3) SZ = 1, PR = 1
Notes: 1. In the case of SZ = 0 and PR = 0, DR register can not be used.
2. The bit-location of DR register is used for double precision format when PR = 1.
(In the case of (2), it is used when PR is changed from 0 to 1.)
Figure 2.5 Relationship between SZ bit and Endian
Table 2.2
Bit Allocation for FPU Exception Handling
Field Name
FPU
Error (E)
Invalid
Division
Operation (V) by Zero (Z)
Overflow Underflow Inexact
(O)
(U)
(I)
Cause
FPU exception
cause field
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Enable
FPU exception
enable field
None
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Flag
FPU exception flag None
field
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Floating-Point Communication Register (FPUL) (32 bits, Initial Value = Undefined):
Information is transferred between the FPU and CPU via FPUL.
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Section 2 Programming Model
2.3
Memory-Mapped Registers
Some control registers are mapped to the following memory areas. Each of the mapped registers
has two addresses.
H'1C00 0000 to H'1FFF FFFF
H'FC00 0000 to H'FFFF FFFF
These two areas are used as follows.
• H'1C00 0000 to H'1FFF FFFF
This area must be accessed using the address translation function of the MMU.
Setting the page number of this area to the corresponding field of the TLB enables access to a
memory-mapped register.
The operation of an access to this area without using the address translation function of the
MMU is not guaranteed.
• H'FC00 0000 to H'FFFF FFFF
Access to area H'FC00 0000 to H'FFFF FFFF in user mode will cause an address error.
Memory-mapped registers can be referenced in user mode by means of access that involves
address translation.
Note: Do not access addresses to which registers are not mapped in either area. The operation of
an access to an address with no register mapped is undefined. Also, memory-mapped
registers must be accessed using a fixed data size. The operation of an access using an
invalid data size is undefined.
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Section 2 Programming Model
2.4
Data Formats in Registers
Register operands are always longwords (32 bits). When a memory operand is only a byte (8 bits)
or a word (16 bits), it is sign-extended into a longword when loaded into a register.
7 6
0
S
31
S
7 6
S
15 14
0
0
S
31
S
15 14
S
0
Figure 2.6 Formats of Byte Data and Word Data in Register
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Section 2 Programming Model
2.5
Data Formats in Memory
Memory data formats are classified into bytes, words, and longwords. Memory can be accessed in
an 8-bit byte, 16-bit word, or 32-bit longword form. A memory operand less than 32 bits in length
is sign-extended before being loaded into a register.
A word operand must be accessed starting from a word boundary (even address of a 2-byte unit:
address 2n), and a longword operand starting from a longword boundary (even address of a 4-byte
unit: address 4n). An address error will result if this rule is not observed. A byte operand can be
accessed from any address.
Big endian or little endian byte order can be selected for the data format. The endian should be set
with the external pin after a power-on reset. The endian cannot be changed dynamically. Bit
positions are numbered left to right from most-significant to least-significant. Thus, in a 32-bit
longword, the leftmost bit, bit 31, is the most significant bit and the rightmost bit, bit 0, is the least
significant bit.
The data format in memory is shown in figure 2.7.
A
31
7
A+1
23
A+2
07
07
A + 11 A + 10 A + 9
A+3
15
7
0
31
07
0
7
0
15
Address A Byte 0 Byte 1 Byte 2 Byte 3
Address A + 4
Address A + 8
15
0 15
Word 0
31
Big endian
07
07
7
0
07
0
0 15
Word 1
0
A+8
15
Byte 3 Byte 2 Byte 1 Byte 0 Address A + 8
Word 1
Longword
23
31
0
Word 0
Longword
Little endian
Figure 2.7 Data Formats in Memory
For the 64-bit data format, see figure 2.5.
Rev.1.00 Dec. 13, 2005 Page 48 of 1286
REJ09B0158-0100
0
Address A + 4
Address A
Section 2 Programming Model
2.6
Processing States
This LSI has major three processing states: the reset state, instruction execution state, and powerdown state.
Reset State: In this state the CPU is reset. The reset state is divided into the power-on reset state
and the manual reset.
In the power-on reset state, the internal state of the CPU and the on-chip peripheral module
registers are initialized. In the manual reset state, the internal state of the CPU and some registers
of on-chip peripheral modules are initialized. For details, see register descriptions for each section.
Instruction Execution State: In this state, the CPU executes program instructions in sequence.
The Instruction execution state has the normal program execution state and the exception handling
state.
Power-Down State: In a power-down state, the CPU halts operation and power consumption is
reduced. The power-down state is entered by executing a SLEEP instruction. This LSI supports
sleep mode for the power-down state.
From any state
when reset/manual
reset input
Reset state
Reset/manual
reset clearance
Instruction execution state
Reset/manual
Reset/manual
reset input
reset input
Sleep instruction execution
Interrupt occurence
Power-down state
Figure 2.8 Processing State Transitions
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Section 2 Programming Model
2.7
Usage Note
2.7.1
Notes on self-modified codes*
This LSI prefetches instructions more drastically than conventional SH-4 to accelerate the
processing speed. Therefore if the instruction in the memory is modified and it is executed
immediately, then the pre-modified code that is prefetched are likely to be executed. In order to
execute the modified code definitely, one of the following sequences should be executed between
the execution of modifying codes and modified codes.
(1)
In case the modified codes are in non-cacheable area
SYNCO
ICBI @Rn
The target for the ICBI instruction can be any address within the range where no address error
exception occurs.
(2)
In case the modified codes are in cacheable area (write-through)
SYNCO
ICBI @Rn
The all instruction cache area corresponding to the modified codes should be invalidated by the
ICBI instruction. The ICBI instruction should be issued to each cache line. One cache line is 32
bytes.
(3)
In case the modified codes are in cacheable area (copy-back)
OCBP @Rm or OCBWB @Rm
SYNCO
ICBI @Rn
The all operand cache area corresponding to the modified codes should be written back to the
main memory by the OCBP or OCBWB instruction. Then the all instruction cache area
corresponding to the modified codes should be invalidated by the ICBI instruction. The OCBP,
OCBWB and ICBI instruction should be issued to each cache line. One cache line is 32 bytes.
Note: * Processes executed while changing the instructions on the memory dynamically.
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Section 3 Instruction Set
Section 3 Instruction Set
This LSI's instruction set is implemented with 16-bit fixed-length instructions. This LSI can use
byte (8-bit), word (16-bit), longword (32-bit), and quadword (64-bit) data sizes for memory
access. Single-precision floating-point data (32 bits) can be moved to and from memory using
longword or quadword size. Double-precision floating-point data (64 bits) can be moved to and
from memory using longword size. When this LSI moves byte-size or word-size data from
memory to a register, the data is sign-extended.
3.1
Execution Environment
PC: At the start of instruction execution, the PC indicates the address of the instruction itself.
Load-Store Architecture: This LSI has a load-store architecture in which operations are basically
executed using registers. Except for bit-manipulation operations such as logical AND that are
executed directly in memory, operands in an operation that requires memory access are loaded
into registers and the operation is executed between the registers.
Delayed Branches: Except for the two branch instructions BF and BT, this LSI's branch
instructions and RTE are delayed branches. In a delayed branch, the instruction following the
branch is executed before the branch destination instruction.
Delay Slot: This execution slot following a delayed branch is called a delay slot. For example, the
BRA execution sequence is as follows:
Table 3.1
Execution Order of Delayed Branch Instructions
Instructions
BRA
ADD
TARGET
Execution Order
(Delayed branch instruction)
BRA
(Delay slot)
↓
:
ADD
:
TARGET
target-inst
↓
(Branch destination instruction)
target-inst
A slot illegal instruction exception may occur when a specific instruction is executed in a delay
slot. For details, see section 5, Exception Handling. The instruction following BF/S or BT/S for
which the branch is not taken is also a delay slot instruction.
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REJ09B0158-0100
Section 3 Instruction Set
T Bit: The T bit in SR is used to show the result of a compare operation, and is referenced by a
conditional branch instruction. An example of the use of a conditional branch instruction is shown
below.
ADD
#1, R0
CMP/EQ R1, R0
BT
TARGET
; T bit is not changed by ADD operation
; If R0 = R1, T bit is set to 1
; Branches to TARGET if T bit = 1 (R0 = R1)
In an RTE delay slot, the SR bits are referenced as follows. In instruction access, the MD bit is
used before modification, and in data access, the MD bit is accessed after modification. The other
bits—S, T, M, Q, FD, BL, and RB—after modification are used for delay slot instruction
execution. The STC and STC.L SR instructions access all SR bits after modification.
Constant Values: An 8-bit constant value can be specified by the instruction code and an
immediate value. 16-bit and 32-bit constant values can be defined as literal constant values in
memory, and can be referenced by a PC-relative load instruction.
MOV.W @(disp, PC), Rn
MOV.L @(disp, PC), Rn
There are no PC-relative load instructions for floating-point operations. However, it is possible to
set 0.0 or 1.0 by using the FLDI0 or FLDI1 instruction on a single-precision floating-point
register.
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Section 3 Instruction Set
3.2
Addressing Modes
Addressing modes and effective address calculation methods are shown in table 3.2. When a
location in virtual memory space is accessed (AT in MMUCR = 1), the effective address is
translated into a physical memory address. If multiple virtual memory space systems are selected
(SV in MMUCR = 0), the least significant bit of PTEH is also referenced as the access ASID. For
details, see section 7, Memory Management Unit (MMU).
Table 3.2
Addressing Modes and Effective Addresses
Addressing Instruction
Mode
Format
Effective Address Calculation Method
Register
direct
Rn
Effective address is register Rn.
(Operand is register Rn contents.)
—
Register
indirect
@Rn
Effective address is register Rn contents.
Rn → EA
(EA: effective
address)
Register
indirect
with postincrement
@Rn+
Rn
Rn
Effective address is register Rn contents.
A constant is added to Rn after instruction
execution: 1 for a byte operand, 2 for a word
operand, 4 for a longword operand, 8 for a
quadword operand.
Rn
Rn + 1/2/4/8
Rn
+
@–Rn
Rn
1/2/4/8
Byte:
Rn + 1 → Rn
Word:
Rn + 2 → Rn
Quadword:
Rn + 8 → Rn
Effective address is register Rn contents,
decremented by a constant beforehand:
1 for a byte operand, 2 for a word operand,
4 for a longword operand, 8 for a quadword
operand.
Rn – 1/2/4/8
Rn → EA
After instruction
execution
Longword:
Rn + 4 → Rn
1/2/4/8
Register
indirect
with predecrement
Calculation
Formula
–
Rn – 1/2/4/8
Byte:
Rn – 1 → Rn
Word:
Rn – 2 → Rn
Longword:
Rn – 4 → Rn
Quadword:
Rn – 8 → Rn
Rn → EA
(Instruction
executed
with Rn after
calculation)
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REJ09B0158-0100
Section 3 Instruction Set
Addressing
Mode
Instruction
Format
Register
@(disp:4, Rn)
indirect with
displacement
Effective Address Calculation Method
Effective address is register Rn contents with
4-bit displacement disp added. After disp is
zero-extended, it is multiplied by 1 (byte), 2
(word), or 4 (longword), according to the operand
size.
Rn
disp
(zero-extended)
Rn + disp × 1/2/4
+
Calculation
Formula
Byte: Rn + disp
→ EA
Word: Rn +
disp × 2 → EA
Longword:
Rn + disp × 4
→ EA
×
1/2/4
Indexed
register
indirect
@(R0, Rn)
Effective address is sum of register Rn and R0
contents.
Rn + R0 → EA
Rn
+
Rn + R0
R0
GBR indirect @(disp:8, GBR) Effective address is register GBR contents with
with displace8-bit displacement disp added. After disp is
ment
zero-extended, it is multiplied by 1 (byte), 2
(word), or 4 (longword), according to the operand
size.
GBR
disp
(zero-extended)
+
GBR
+ disp × 1/2/4
Byte: GBR +
disp → EA
Word: GBR +
disp × 2 → EA
Longword:
GBR + disp × 4
→ EA
×
1/2/4
Indexed GBR @(R0, GBR)
indirect
Effective address is sum of register GBR and R0 GBR + R0 →
EA
contents.
GBR
+
R0
Rev.1.00 Dec. 13, 2005 Page 54 of 1286
REJ09B0158-0100
GBR + R0
Section 3 Instruction Set
Addressing
Mode
Instruction
Format
Calculation
Formula
Effective Address Calculation Method
PC-relative
@(disp:8, PC) Effective address is PC + 4 with 8-bit displacement
with
disp added. After disp is zero-extended, it is
displacement
multiplied by 2 (word), or 4 (longword), according
to the operand size. With a longword operand,
the lower 2 bits of PC are masked.
Word: PC + 4
+ disp × 2 →
EA
Longword:
PC & H'FFFF
FFFC + 4 +
disp × 4 → EA
PC
& *
+
H'FFFF FFFC
4
+
disp
(zero-extended)
PC + 4 + disp
×2
or PC &
H'FFFF FFFC
+ 4 + disp × 4
×
2/4
PC-relative
disp:8
* With longword operand
Effective address is PC + 4 with 8-bit displacement PC + 4 + disp
× 2 → Branchdisp added after being sign-extended and
Target
multiplied by 2.
PC
+
4
+
PC + 4 + disp × 2
disp
(sign-extended)
×
2
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REJ09B0158-0100
Section 3 Instruction Set
Addressing Instruction
Mode
Format
PC-relative
disp:12
Effective Address Calculation Method
Calculation
Formula
Effective address is PC + 4 with 12-bit
PC + 4 + disp
displacement disp added after being sign-extended × 2 → Branchand
Target
multiplied by 2.
PC
+
4
+
PC + 4 + disp × 2
disp
(sign-extended)
×
2
Rn
Effective address is sum of PC + 4 and Rn.
PC
PC + 4 + Rn →
Branch-Target
+
4
+
PC + 4 + Rn
Rn
Immediate
#imm:8
8-bit immediate data imm of TST, AND, OR, or
XOR instruction is zero-extended.
—
#imm:8
8-bit immediate data imm of MOV, ADD, or
CMP/EQ instruction is sign-extended.
—
#imm:8
8-bit immediate data imm of TRAPA instruction is
zero-extended and multiplied by 4.
—
Note: For the addressing modes below that use a displacement (disp), the assembler descriptions
in this manual show the value before scaling (×1, ×2, or ×4) is performed according to the
operand size. This is done to clarify the operation of the LSI. Refer to the relevant
assembler notation rules for the actual assembler descriptions.
@ (disp:4, Rn) ; Register indirect with displacement
@ (disp:8, GBR) ; GBR indirect with displacement
@ (disp:8, PC) ; PC-relative with displacement
disp:8, disp:12 ; PC-relative
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Section 3 Instruction Set
3.3
Instruction Set
Table 3.3 shows the notation used in the SH instruction lists shown in tables 3.4 to 3.13.
Table 3.3
Notation Used in Instruction List
Item
Format
Description
Instruction
mnemonic
OP.Sz SRC, DEST
OP:
Sz:
SRC:
DEST:
Rm:
Rn:
imm:
disp:
→, ←
(xx)
M/Q/T
&
|
Operation
notation
Instruction code
Operation code
Size
Source operand
Source and/or destination operand
Source register
Destination register
Immediate data
Displacement
Transfer direction
Memory operand
SR flag bits
Logical AND of individual bits
Logical OR of individual bits
∧
Logical exclusive-OR of individual bits
~
Logical NOT of individual bits
n n-bit shift
MSB ↔ LSB
mmmm:
nnnn:
0000:
0001:
:
1111:
mmm:
nnn:
000:
001:
:
111:
mm:
nn:
00:
01:
10:
11:
iiii:
dddd:
Register number (Rm, FRm)
Register number (Rn, FRn)
R0, FR0
R1, FR1
R15, FR15
Register number (DRm, XDm, Rm_BANK)
Register number (DRn, XDn, Rn_BANK)
DR0, XD0, R0_BANK
DR2, XD2, R1_BANK
DR14, XD14, R7_BANK
Register number (FVm)
Register number (FVn)
FV0
FV4
FV8
FV12
Immediate data
Displacement
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REJ09B0158-0100
Section 3 Instruction Set
Item
Format
Privileged mode
Description
"Privileged" means the instruction can only be executed
in privileged mode.
T bit
Value of T bit after
—: No change
instruction execution
New
"New" means the instruction which is newly added in this
LSI.
Note: Scaling (×1, ×2, ×4, or ×8) is executed according to the size of the instruction operand.
Rev.1.00 Dec. 13, 2005 Page 58 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Table 3.4
Fixed-Point Transfer Instructions
Instruction
Operation
Instruction Code
Privileged T Bit New
MOV
#imm,Rn
imm → sign extension → Rn
1110nnnniiiiiiii
—
—
—
MOV.W
@(disp*,PC),Rn
(disp × 2 + PC + 4) → sign
extension → Rn
1001nnnndddddddd
—
—
—
MOV.L
@(disp*,PC),Rn
(disp × 4 + PC & H'FFFF FFFC 1101nnnndddddddd
+ 4) → Rn
—
—
—
MOV
Rm,Rn
Rm → Rn
0110nnnnmmmm0011
—
—
—
MOV.B
Rm,@Rn
Rm → (Rn)
0010nnnnmmmm0000
—
—
—
MOV.W
Rm,@Rn
Rm → (Rn)
0010nnnnmmmm0001
—
—
—
MOV.L
Rm,@Rn
Rm → (Rn)
0010nnnnmmmm0010
—
—
—
MOV.B
@Rm,Rn
(Rm) → sign extension → Rn
0110nnnnmmmm0000
—
—
—
MOV.W
@Rm,Rn
(Rm) → sign extension → Rn
0110nnnnmmmm0001
—
—
—
MOV.L
@Rm,Rn
(Rm) → Rn
0110nnnnmmmm0010
—
—
—
MOV.B
Rm,@-Rn
Rn-1 → Rn, Rm → (Rn)
0010nnnnmmmm0100
—
—
—
MOV.W
Rm,@-Rn
Rn-2 → Rn, Rm → (Rn)
0010nnnnmmmm0101
—
—
—
MOV.L
Rm,@-Rn
Rn-4 → Rn, Rm → (Rn)
0010nnnnmmmm0110
—
—
—
MOV.B
@Rm+,Rn
(Rm)→ sign extension → Rn,
Rm + 1 → Rm
0110nnnnmmmm0100
—
—
—
MOV.W
@Rm+,Rn
(Rm) → sign extension → Rn,
Rm + 2 → Rm
0110nnnnmmmm0101
—
—
—
MOV.L
@Rm+,Rn
(Rm) → Rn, Rm + 4 → Rm
0110nnnnmmmm0110
—
—
—
MOV.B
R0,@(disp*,Rn)
R0 → (disp + Rn)
10000000nnnndddd
—
—
—
MOV.W
R0,@(disp*,Rn)
R0 → (disp × 2 + Rn)
10000001nnnndddd
—
—
—
MOV.L
Rm,@(disp*,Rn)
Rm → (disp × 4 + Rn)
0001nnnnmmmmdddd
—
—
—
MOV.B
@(disp*,Rm),R0
(disp + Rm) → sign extension
→ R0
10000100mmmmdddd
—
—
—
MOV.W
@(disp*,Rm),R0
(disp × 2 + Rm) → sign
extension → R0
10000101mmmmdddd
—
—
—
MOV.L
@(disp*,Rm),Rn
(disp × 4 + Rm) → Rn
0101nnnnmmmmdddd
—
—
—
MOV.B
Rm,@(R0,Rn)
Rm → (R0 + Rn)
0000nnnnmmmm0100
—
—
—
MOV.W
Rm,@(R0,Rn)
Rm → (R0 + Rn)
0000nnnnmmmm0101
—
—
—
MOV.L
Rm,@(R0,Rn)
Rm → (R0 + Rn)
0000nnnnmmmm0110
—
—
—
MOV.B
@(R0,Rm),Rn
(R0 + Rm) →
sign extension → Rn
0000nnnnmmmm1100
—
—
—
Rev.1.00 Dec. 13, 2005 Page 59 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Instruction
Operation
Instruction Code
Privileged T Bit New
MOV.W
@(R0,Rm),Rn
(R0 + Rm) →
sign extension → Rn
0000nnnnmmmm1101
—
—
—
MOV.L
@(R0,Rm),Rn
(R0 + Rm) → Rn
0000nnnnmmmm1110
—
—
—
MOV.B
R0,@(disp*,GBR)
R0 → (disp + GBR)
11000000dddddddd
—
—
—
MOV.W
R0,@(disp*,GBR)
R0 → (disp × 2 + GBR)
11000001dddddddd
—
—
—
MOV.L
R0,@(disp*,GBR)
R0 → (disp × 4 + GBR)
11000010dddddddd
—
—
—
MOV.B
@(disp*,GBR),R0
(disp + GBR) →
sign extension → R0
11000100dddddddd
—
—
—
MOV.W
@(disp*,GBR),R0
(disp × 2 + GBR) →
sign extension → R0
11000101dddddddd
—
—
—
MOV.L
@(disp*,GBR),R0
(disp × 4 + GBR) → R0
11000110dddddddd
—
—
—
MOVA
@(disp*,PC),R0 disp × 4 +
PC & H'FFFF FFFC
+ 4 → R0
11000111dddddddd
—
—
—
MOVCO.L R0,@Rn
LDST → T
If (T == 1) R0 → (Rn)
0 → LDST
0000nnnn01110011
LDST New
MOVLI.L
1 → LDST
(Rm) → R0
When interrupt/exception
occurred 0 → LDST
0000mmmm01100011
New
MOVUA.L @Rm,R0
0100mmmm10101001
(Rm) → R0
Load non-boundary alignment
data
New
MOVUA.L @Rm+,R0
(Rm) → R0, Rm + 4 → Rm
0100mmmm11101001
Load non-boundary alignment data
New
MOVT
Rn
T → Rn
0000nnnn00101001
—
—
—
SWAP.B
Rm,Rn
Rm → swap lower 2 bytes
→ Rn
0110nnnnmmmm1000
—
—
—
SWAP.W Rm,Rn
Rm → swap upper/lower
words → Rn
0110nnnnmmmm1001
—
—
—
XTRCT
Rm:Rn middle 32 bits → Rn
0010nnnnmmmm1101
—
—
—
Note:
@Rm,R0
Rm,Rn
*
The assembler of Renesas uses the value after scaling (×1, ×2, or ×4) as the
displacement (disp).
Rev.1.00 Dec. 13, 2005 Page 60 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Table 3.5
Arithmetic Operation Instructions
Instruction
Operation
Instruction Code
Privileged T Bit
New
ADD
Rm,Rn
Rn + Rm → Rn
0011nnnnmmmm1100
—
—
—
ADD
#imm,Rn Rn + imm → Rn
0111nnnniiiiiiii
—
—
—
ADDC
Rm,Rn
Rn + Rm + T → Rn,
carry → T
0011nnnnmmmm1110
—
Carry
—
ADDV
Rm,Rn
Rn + Rm → Rn,
overflow → T
0011nnnnmmmm1111
—
Overflow
—
CMP/EQ
#imm,R0 When R0 = imm, 1 → T
Otherwise, 0 → T
10001000iiiiiiii
—
Comparison —
result
CMP/EQ
Rm,Rn
When Rn = Rm, 1 → T
Otherwise, 0 → T
0011nnnnmmmm0000
—
Comparison —
result
CMP/HS
Rm,Rn
When Rn ≥ Rm (unsigned),
1→T
Otherwise, 0 → T
0011nnnnmmmm0010
—
Comparison —
result
CMP/GE
Rm,Rn
When Rn ≥ Rm (signed),
1→T
Otherwise, 0 → T
0011nnnnmmmm0011
—
Comparison —
result
CMP/HI
Rm,Rn
When Rn > Rm (unsigned),
1→T
Otherwise, 0 → T
0011nnnnmmmm0110
—
Comparison —
result
CMP/GT
Rm,Rn
When Rn > Rm (signed),
1→T
Otherwise, 0 → T
0011nnnnmmmm0111
—
Comparison —
result
CMP/PZ
Rn
When Rn ≥ 0, 1 → T
Otherwise, 0 → T
0100nnnn00010001
—
Comparison —
result
CMP/PL
Rn
When Rn > 0, 1 → T
Otherwise, 0 → T
0100nnnn00010101
—
Comparison —
result
CMP/STR
Rm,Rn
When any bytes are equal,
1→T
Otherwise, 0 → T
0010nnnnmmmm1100
—
Comparison —
result
DIV1
Rm,Rn
1-step division (Rn ÷ Rm)
0011nnnnmmmm0100
—
Calculation
result
—
DIV0S
Rm,Rn
MSB of Rn → Q,
MSB of Rm → M, M^Q → T
0010nnnnmmmm0111
—
Calculation
result
—
DIV0U
0 → M/Q/T
0000000000011001
—
0
—
DMULS.L Rm,Rn
Signed,
Rn × Rm → MAC,
32 × 32 → 64 bits
0011nnnnmmmm1101
—
—
—
Rev.1.00 Dec. 13, 2005 Page 61 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Instruction
Operation
Instruction Code
Privileged T Bit
New
DMULU.L Rm,Rn
Unsigned,
Rn × Rm → MAC,
32 × 32 → 64 bits
0011nnnnmmmm0101
—
—
—
DT
Rn
Rn – 1 → Rn;
when Rn = 0,
1→T
When Rn ≠ 0, 0 → T
0100nnnn00010000
—
Comparison —
result
EXTS.B
Rm,Rn
Rm sign-extended from
byte → Rn
0110nnnnmmmm1110
—
—
—
EXTS.W Rm,Rn
Rm sign-extended from
word → Rn
0110nnnnmmmm1111
—
—
—
EXTU.B
Rm,Rn
Rm zero-extended from
byte → Rn
0110nnnnmmmm1100
—
—
—
EXTU.W Rm,Rn
Rm zero-extended from
word → Rn
0110nnnnmmmm1101
—
—
—
0000nnnnmmmm1111
—
—
—
0100nnnnmmmm1111
—
—
—
MAC.L
@Rm+,@Rn+ Signed,
(Rn) × (Rm) + MAC → MAC
Rn + 4 → Rn, Rm + 4 → Rm
32 × 32 + 64 → 64 bits
MAC.W
@Rm+,@Rn+ Signed,
(Rn) × (Rm) + MAC → MAC
Rn + 2 → Rn,
Rm + 2 → Rm
16 × 16 + 64 → 64 bits
Rm,Rn
Rn × Rm → MACL
32 × 32 → 32 bits
0000nnnnmmmm0111
—
—
—
MULS.W Rm,Rn
Signed,
Rn × Rm → MACL
16 × 16 → 32 bits
0010nnnnmmmm1111
—
—
—
MULU.W Rm,Rn
Unsigned,
Rn × Rm → MACL
16 × 16 → 32 bits
0010nnnnmmmm1110
—
—
—
NEG
Rm,Rn
0 – Rm → Rn
0110nnnnmmmm1011
—
—
—
NEGC
Rm,Rn
0 – Rm – T → Rn,
borrow → T
0110nnnnmmmm1010
—
Borrow
—
SUB
Rm,Rn
Rn – Rm → Rn
0011nnnnmmmm1000
—
—
—
SUBC
Rm,Rn
Rn – Rm – T → Rn,
borrow → T
0011nnnnmmmm1010
—
Borrow
—
SUBV
Rm,Rn
Rn – Rm → Rn,
underflow → T
0011nnnnmmmm1011
—
Underflow
—
MUL.L
Rev.1.00 Dec. 13, 2005 Page 62 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Table 3.6
Logic Operation Instructions
Instruction
Operation
Instruction Code
Privileged T Bit
New
AND
Rm,Rn
Rn & Rm → Rn
0010nnnnmmmm1001
—
—
—
AND
#imm,R0
R0 & imm → R0
11001001iiiiiiii
—
—
—
11001101iiiiiiii
—
—
—
AND.B #imm,@(R0,GBR) (R0 + GBR) & imm
→ (R0 + GBR)
NOT
Rm,Rn
~Rm → Rn
0110nnnnmmmm0111
—
—
—
OR
Rm,Rn
Rn | Rm → Rn
0010nnnnmmmm1011
—
—
—
OR
#imm,R0
R0 | imm → R0
11001011iiiiiiii
—
—
—
OR.B
#imm,@(R0,GBR)
(R0 + GBR) | imm
→ (R0 + GBR)
11001111iiiiiiii
—
—
—
TAS.B @Rn
When (Rn) = 0, 1 → T
Otherwise, 0 → T
In both cases,
1 → MSB of (Rn)
0100nnnn00011011
—
Test
result
—
TST
Rm,Rn
Rn & Rm;
when result = 0, 1 → T
Otherwise, 0 → T
0010nnnnmmmm1000
—
Test
result
—
TST
#imm,R0
R0 & imm;
when result = 0, 1 → T
Otherwise, 0 → T
11001000iiiiiiii
—
Test
result
—
TST.B #imm,@(R0,GBR) (R0 + GBR) & imm;
when result = 0, 1 → T
Otherwise, 0 → T
11001100iiiiiiii
—
Test
result
—
XOR
Rm,Rn
Rn ∧ Rm → Rn
0010nnnnmmmm1010
—
—
—
XOR
#imm,R0
R0 ∧ imm → R0
11001010iiiiiiii
—
—
—
11001110iiiiiiii
—
—
—
XOR.B #imm,@(R0,GBR) (R0 + GBR) ∧ imm
→ (R0 + GBR)
Rev.1.00 Dec. 13, 2005 Page 63 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Table 3.7
Shift Instructions
Instruction
Operation
Instruction Code
ROTL
Rn
T ← Rn ← MSB
0100nnnn00000100 —
MSB
—
ROTR
Rn
LSB → Rn → T
0100nnnn00000101 —
LSB
—
ROTCL
Rn
T ← Rn ← T
0100nnnn00100100 —
MSB
—
ROTCR
Rn
T → Rn → T
0100nnnn00100101 —
LSB
—
SHAD
Rm,Rn
When Rm ≥ 0, Rn > Rm →
[MSB → Rn]
—
—
SHAL
Rn
T ← Rn ← 0
0100nnnn00100000 —
MSB
—
SHAR
Rn
MSB → Rn → T
0100nnnn00100001 —
LSB
—
SHLD
Rm,Rn
When Rm ≥ 0, Rn > Rm →
[0 → Rn]
—
—
SHLL
Rn
T ← Rn ← 0
0100nnnn00000000 —
MSB
—
SHLR
Rn
0 → Rn → T
0100nnnn00000001 —
LSB
—
SHLL2
Rn
Rn > 2 → Rn
0100nnnn00001001 —
—
—
SHLL8
Rn
Rn > 8 → Rn
0100nnnn00011001 —
—
—
SHLL16
Rn
Rn > 16 → Rn
0100nnnn00101001 —
—
—
Rev.1.00 Dec. 13, 2005 Page 64 of 1286
REJ09B0158-0100
Privileged T Bit
New
Section 3 Instruction Set
Table 3.8
Branch Instructions
Instruction
Operation
Instruction Code
Privileged
T Bit
New
BF
label
When T = 0, disp × 2 + PC +
4 → PC
When T = 1, nop
10001011dddddddd —
—
—
BF/S
label
Delayed branch; when T = 0,
disp × 2 + PC + 4 → PC
When T = 1, nop
10001111dddddddd —
—
—
BT
label
When T = 1, disp × 2 + PC +
4 → PC
When T = 0, nop
10001001dddddddd —
—
—
BT/S
label
Delayed branch; when T = 1,
disp × 2 + PC + 4 → PC
When T = 0, nop
10001101dddddddd —
—
—
BRA
label
Delayed branch, disp × 2 +
PC + 4 → PC
1010dddddddddddd —
—
—
BRAF
Rn
Delayed branch, Rn + PC + 4 → 0000nnnn00100011 —
PC
—
—
BSR
label
Delayed branch, PC + 4 → PR, 1011dddddddddddd —
disp × 2 + PC + 4 → PC
—
—
BSRF
Rn
Delayed branch, PC + 4 → PR, 0000nnnn00000011 —
Rn + PC + 4 → PC
—
—
JMP
@Rn
Delayed branch, Rn → PC
0100nnnn00101011 —
—
—
JSR
@Rn
Delayed branch, PC + 4 → PR, 0100nnnn00001011 —
Rn → PC
—
—
Delayed branch, PR → PC
—
—
RTS
0000000000001011 —
Rev.1.00 Dec. 13, 2005 Page 65 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Table 3.9
System Control Instructions
Instruction
Operation
Instruction Code
Privileged T Bit New
CLRMAC
0 → MACH, MACL
0000000000101000 —
—
CLRS
0→S
0000000001001000 —
—
—
CLRT
0→T
0000000000001000 —
0
—
New
—
ICBI
@Rn
Invalidates instruction cache
block indicated by virtual
address
0000nnnn11100011
LDC
Rm,SR
Rm → SR
0100mmmm00001110 Privileged LSB
—
LDC
Rm,GBR
Rm → GBR
0100mmmm00011110 —
—
LDC
Rm,VBR
Rm → VBR
0100mmmm00101110 Privileged —
—
LDC
Rm,SGR
Rm → SGR
0100mmmm00111010 Privileged —
New
LDC
Rm,SSR
Rm → SSR
0100mmmm00111110 Privileged —
—
LDC
Rm,SPC
Rm → SPC
0100mmmm01001110 Privileged —
—
LDC
Rm,DBR
Rm → DBR
0100mmmm11111010 Privileged —
—
—
LDC
Rm,Rn_BANK
Rm → Rn_BANK (n = 0 to 7)
0100mmmm1nnn1110 Privileged —
—
LDC.L
@Rm+,SR
(Rm) → SR, Rm + 4 → Rm
0100mmmm00000111 Privileged LSB
—
LDC.L
@Rm+,GBR
(Rm) → GBR, Rm + 4 → Rm
0100mmmm00010111 —
—
—
LDC.L
@Rm+,VBR
(Rm) → VBR, Rm + 4 → Rm
0100mmmm00100111 Privileged —
—
LDC.L
@Rm+,SGR
(Rm) → SGR, Rm + 4 → Rm
0100mmmm00110110 Privileged —
New
LDC.L
@Rm+,SSR
(Rm) → SSR, Rm + 4 → Rm
0100mmmm00110111 Privileged —
—
LDC.L
@Rm+,SPC
(Rm) → SPC, Rm + 4 → Rm
0100mmmm01000111 Privileged —
—
LDC.L
@Rm+,DBR
(Rm) → DBR, Rm + 4 → Rm
0100mmmm11110110 Privileged —
—
LDC.L
@Rm+,Rn_BANK (Rm) → Rn_BANK,
Rm + 4 → Rm
0100mmmm1nnn0111 Privileged —
—
LDS
Rm,MACH
Rm → MACH
0100mmmm00001010 —
—
—
LDS
Rm,MACL
Rm → MACL
0100mmmm00011010 —
—
—
LDS
Rm,PR
Rm → PR
0100mmmm00101010 —
—
—
LDS.L
@Rm+,MACH
(Rm) → MACH, Rm + 4 → Rm 0100mmmm00000110 —
—
—
LDS.L
@Rm+,MACL
(Rm) → MACL, Rm + 4 → Rm 0100mmmm00010110 —
—
—
LDS.L
@Rm+,PR
(Rm) → PR, Rm + 4 → Rm
0100mmmm00100110 —
—
—
LDTLB
PTEH/PTEL → TLB
0000000000111000 Privileged —
—
MOVCA.L R0,@Rn
R0 → (Rn) (without fetching
cache block)
0000nnnn11000011 —
—
Rev.1.00 Dec. 13, 2005 Page 66 of 1286
REJ09B0158-0100
—
Section 3 Instruction Set
Instruction
NOP
Operation
Instruction Code
Privileged T Bit
New
No operation
0000000000001001 —
—
—
OCBI
@Rn
Invalidates operand cache
block
0000nnnn10010011 —
—
—
OCBP
@Rn
Writes back and invalidates
operand cache block
0000nnnn10100011 —
—
—
OCBWB
@Rn
Writes back operand cache
block
0000nnnn10110011 —
—
—
PREF
@Rn
(Rn) → operand cache
0000nnnn10000011 —
—
—
PREFI
@Rn
Reads 32-byte instruction
block into instruction cache
0000nnnn11010011
New
Delayed branch, SSR/SPC → 0000000000101011 Privileged
SR/PC
—
—
SETS
1→S
0000000001011000 —
—
—
SETT
1→T
0000000000011000 —
1
—
RTE
SLEEP
Sleep
0000000000011011 Privileged
—
—
STC
SR,Rn
SR → Rn
0000nnnn00000010 Privileged
—
—
STC
GBR,Rn
GBR → Rn
0000nnnn00010010 —
—
—
STC
VBR,Rn
VBR → Rn
0000nnnn00100010 Privileged
—
—
STC
SSR,Rn
SSR → Rn
0000nnnn00110010 Privileged
—
—
STC
SPC,Rn
SPC → Rn
0000nnnn01000010 Privileged
—
—
STC
SGR,Rn
SGR → Rn
0000nnnn00111010 Privileged
—
—
STC
DBR,Rn
DBR → Rn
0000nnnn11111010 Privileged
—
—
STC
Rm_BANK,Rn
Rm_BANK → Rn
(m = 0 to 7)
0000nnnn1mmm0010 Privileged
—
—
STC.L
SR,@-Rn
Rn – 4 → Rn, SR → (Rn)
0100nnnn00000011 Privileged
—
—
STC.L
GBR,@-Rn
Rn – 4 → Rn, GBR → (Rn)
0100nnnn00010011 —
—
—
STC.L
VBR,@-Rn
Rn – 4 → Rn, VBR → (Rn)
0100nnnn00100011 Privileged
—
—
STC.L
SSR,@-Rn
Rn – 4 → Rn, SSR → (Rn)
0100nnnn00110011 Privileged
—
—
STC.L
SPC,@-Rn
Rn – 4 → Rn, SPC → (Rn)
0100nnnn01000011 Privileged
—
—
STC.L
SGR,@-Rn
Rn – 4 → Rn, SGR → (Rn)
0100nnnn00110010 Privileged
—
—
STC.L
DBR,@-Rn
Rn – 4 → Rn, DBR → (Rn)
0100nnnn11110010 Privileged
—
—
STC.L
Rm_BANK,@-Rn Rn – 4 → Rn,
Rm_BANK → (Rn)
(m = 0 to 7)
0100nnnn1mmm0011 Privileged
—
—
STS
MACH,Rn
MACH → Rn
0000nnnn00001010 —
—
—
STS
MACL,Rn
MACL → Rn
0000nnnn00011010 —
—
—
Rev.1.00 Dec. 13, 2005 Page 67 of 1286
REJ09B0158-0100
Section 3 Instruction Set
Instruction
Operation
Instruction Code
Privileged T Bit
New
STS
PR,Rn
PR → Rn
0000nnnn00101010
—
—
—
STS.L
MACH,@-Rn
Rn – 4 → Rn, MACH → (Rn) 0100nnnn00000010
—
—
—
STS.L
MACL,@-Rn
Rn – 4 → Rn, MACL → (Rn)
0100nnnn00010010
—
—
—
STS.L
PR,@-Rn
Rn – 4 → Rn, PR → (Rn)
0100nnnn00100010
—
—
—
SYNCO
Prevents the next instruction 0000000010101011
from being issued until
instructions issued before this
instruction have been
completed.
New
TRAPA #imm
PC + 2 → SPC, SR → SSR,
#imm