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RAA230221GSB#HA0

RAA230221GSB#HA0

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    TSSOP20

  • 描述:

    IC REG BUCK ADJ/3.3V DL 20HTSSOP

  • 数据手册
  • 价格&库存
RAA230221GSB#HA0 数据手册
RAA23022x RAA23023x Datasheet RAA23022x RAA23023x 16V Input, 3A, Dual Step-Down DC/DC Converter + Battery Backup R18DS0017EJ0100 REV.1.00 Apr.21.2015 Description The RAA23022x and RAA23023x are dual step-down DC/DC converter, 4.5V to 16V input voltage rage and 3A output current. Auto PFM mode makes devices low power operation at light load, so it makes a system lower power. The RAA23022x is suitable for battery backup system using lithium primary cell with built-in battery backup circuit. Features z DC/DC Input voltage range 4.5V to 16V Shutdown current 1uA (typ.) Auto PFM mode Maximum output current 3A Synchronous rectification type step-down DC/DC Integrated power MOSFETs Switching frequency 1.1MHz (fixed) Output voltage range 0.8V to 6V Internal phase compensator Soft start 2ms (fixed) Discharge circuit Power Good Battery backup circuit (RAA23022x) z Protection circuit Short circuit protection (latch type) Thermal shutdown circuit 165°C (typ.) Under voltage lockout circuit (recovery type) z Package 20-pin HTSSOP Application Communication (Router, Home Gate Way, Radio, etc.) Industrial (Surveillance camera, Various controller, etc.) Building (Security device, Emergency device, Various controller, etc.) OA (Printer, Plane paper copier, etc.) Smart meter Smart home appliances And, usable various application Note: The information contained in this document is being issued in advance of the production cycle for the product. The parameters for the product may change before final production, or Renesas Electronics Corporation, at its own discretion, may withdraw the product prior to its production. A quality grade of these ICs is “Standard”. Recommended applications are indicated below. Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment, and industrial robots, etc. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 1 of 30 RAA23022x RAA23023x Product Lineup Table Part number Output Type VIN range RAA230221 2 Step-down + BB*1 4.5 to 16V RAA230222 2 Step-down + BB*1 4.5 to 16V RAA230223 2 Step-down + BB*1 4.5 to 16V RAA230231 2 Step-down 4.5 to 16V RAA230232 2 Step-down 4.5 to 16V RAA230233 2 Step-down 4.5 to 16V Note VOUT CH1 3.3V (fixed) CH2 0.8V to 6.0V*2 CH1 3.3V (fixed) CH2 5.0V (fixed) CH1 and CH2 0.8V to 6.0V*2 CH1 3.3V (fixed) CH2 0.8V to 6.0V*2 CH1 3.3V (fixed) CH2 5.0V (fixed) CH1 and CH2 0.8V to 6.0V*2 IOUT (max.) Switching frequency 3A 1.1MHz 3A 1.1MHz 3A 1.1MHz 3A 1.1MHz 3A 1.1MHz 3A 1.1MHz *1 BB : Battery Backup *2 Adjustable by external resistors R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 2 of 30 RAA23022x RAA23023x Circuit example RAA23022x (2CH DCDC + Battery Backup, VOUT set by external resistors) 0.47uF RAA23023x (2CH DCDC, VOUT set by external resistors) R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 3 of 30 RAA23022x RAA23023x Block Diagram RAA23022x (2CH DCDC + Battery backup, VOUT set by external resistors) R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 4 of 30 RAA23022x RAA23023x RAA23023x (2CH DCDC, VOUT set by external resistors) R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 5 of 30 RAA23022x RAA23023x Pin Function RAA23022x (2CH DCDC + Battery backup) Pin No. 1 2 3 Symbol PGND1 LX1 Boost1 VIN1 I/O I/O O I 4 5 6 7 I VOUT1 FB1 GND I I I/O 8 VREG O 9 PGOOD O 10 x_AutoPFM I 11 12 VBB_IN VBB_OUT I O 13 EN1 I 14 EN2 I 15 16 17 FB2 VOUT2 VIN2 I I I Boost2 I LX2 PGND2 O I/O 18 19 20 R18DS0017EJ0100 REV.1.00 Apr.21.2015 Function CH1 Power Ground CH1 Inductor connection CH1 Boot strap input (Connect 0.1uF capacitor between LX1 and Boost1) CH1 Power supply CH1 VOUT feedback CH1 Feedback resistor connection Analog Ground Internal power supply output (Connect 1uF capacitor between VREG and AGND) Power good output (open drain) CH1 and CH2 stop :L CH1 or CH2 operation : HiZ Auto PFM mode ON/OFF x_AutoPFM=”L” : Auto PFM mode (change automatically) PFM mode at light load PWM mode at heavy load x_AutoPFM=“H” : PWM mode (fixed) Battery connection Backup voltage output CH1 enable EN1=“L” : CH1 Stop EN1=”H” : CH1 Operation CH2 enable EN2=“L” : CH2 Stop EN2=”H” : CH2 Operation CH2 Feedback resistor connection CH2 VOUT feedback CH2 Power supply CH2 Boot strap input (Connect 0.1uF capacitor between LX2 and Boost2) CH2 Inductor connection CH2 Power Ground Page 6 of 30 RAA23022x RAA23023x RAA23023x (2CH DCDC) Pin No. 1 2 3 Symbol PGND1 LX1 Boost1 4 5 6 7 VOUT1 FB1 GND I I I/O 8 VREG O 9 PGOOD O 10 x_AutoPFM I 11 12 GND GND I/O I/O 13 EN1 I 14 EN2 I 15 16 17 FB2 VOUT2 VIN2 I I I Boost2 I LX2 PGND2 O I/O 18 19 20 VIN1 I/O I/O O I R18DS0017EJ0100 REV.1.00 Apr.21.2015 I Function CH1 Power Ground CH1 Inductor connection CH1 Boot strap input (Connect 0.1uF capacitor between LX1 and Boost1) CH1 Power supply CH1 VOUT feedback CH1 Feedback resistor connection Analog Ground Internal power supply output (Connect 1uF capacitor between VREG and AGND) Power good output (open drain) CH1 and CH2 stop :L CH1 or CH2 operation : HiZ Auto PFM mode ON/OFF x_AutoPFM=”L” : Auto PFM mode (change automatically) PFM mode at light load PWM mode at heavy load x_AutoPFM=“H” : PWM mode (fixed) Analog Ground Analog Ground CH1 enable EN1=“L” : CH1 Stop EN1=”H” : CH1 Operation CH2 enable EN2=“L” : CH2 Stop EN2=”H” : CH2 Operation CH2 Feedback resistor connection CH2 VOUT feedback CH2 Power supply CH2 Boot strap input (Connect 0.1uF capacitor between LX2 and Boost2) CH2 Inductor connection CH2 Power Ground Page 7 of 30 RAA23022x RAA23023x Absolute Maximum Ratings (Unless otherwise specified, TA = 25°C,) Parameter VIN applied voltage EN applied voltage x_AutoPFM applied voltage PGOOD voltage FB applied voltage VOUT applied voltage VBB_IN applied voltage (RAA23022x) Symbol Ratings Unit Condition VIN -0.3 to +17.6 V VIN1, VIN2 EN -0.3 to +17.6 V EN1, EN2 x_AutoPFM -0.3 to +17.6 V x_AutoPFM PGOOD -0.3 to +6.5 V PGOOD FB -0.3 to +6.5 V FB1, FB2 VOUT -0.3 to +6.5 V VOUT1, VOUT2 VBB_IN -0.3 to +6.5 V VBB_IN VIN input current(peak) IVIN(peak)- 4.2 A VIN1, VIN2 LX output current(peak) ILX(peak)+ 4.2 A LX1, LX2 VOUT sink current (DC) IVOUT(DC)- 100 mA When discharge circuit GND -0.3 to +0.3 V PGND1, PGND2, GND Total power dissipation PT 3400*1 mW TA≦+25℃ Operating ambient temperature TA -40 to +85 °C Operation junction temperature TJ -40 to +125 °C Tstg -55 to +150 °C VOUT1, VOUT2 operation GND voltage Storage temperature Note: *1 This is the value at TA < +25°C. At TA > +25°C, the total power dissipation decrease with −34 mW/°C. Board specification : 4 layers glass epoxy board, 76.2mm x 114.3mm x 1.664mm. Copper coverage area: 50%, 0.070mm thickness (top and bottom layers) 95%, 0.035mm thickness ( layers 2 and 3) Connecting exposed pad Caution: Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 8 of 30 RAA23022x RAA23023x Recommended Operating Condition (Unless otherwise specified, TA = 25°C) Parameter Symbol MIN. VIN applied voltage VIN EN applied voltage EN x_AutoPFM applied voltage TYP. MAX. Unit 4.5 16.0 V VIN1, VIN2 0 16.0 V EN1, EN2 *1 x_AutoPFM 0 16.0 V x_AutoPFM 6.0 V PGOOD FB1, FB2 At external resistor setting PGOOD 0 FB applied voltage FB 0 6.0 V VOUT setting range Vdcdc_ext *2 6.0 V PGOOD voltage Condition *1 About rising time (tr) and falling time (tf) of input signal to EN1 and EN2 pin, when EN1 and EN2 pin are not connected to power supply pin (VIN1, VIN2), set tr and tf less than 100ms. When EN1, EN2 pin are connected to VIN1, VIN2 pin, there are no restriction. VIN1, 2 90% EN1, 2 90% 10% 10% *2 Output voltage (minimum value) 7.0 1.5 1.4 6.0 1.3 Vout [V] Vout [V] 5.0 Output voltage area 4.0 3.0 1.2 1.1 1.0 0.9 2.0 0.8 1.0 9V 0.7 0.0 0.6 4.0 8.0 12.0 VIN [V] R18DS0017EJ0100 REV.1.00 Apr.21.2015 16.0 4.0 8.0 12.0 16.0 VIN [V] Page 9 of 30 RAA23022x RAA23023x Electrical Characteristics (Unless otherwise specified, TA = 25°C, VIN1 = VIN2 = 12V) Parameter Total Symbol Shutdown current Under voltage lock out circuit (UVLO) Internal power supply (VREG) MIN. IDD(SHDN) TYP. MAX. Unit 1 10 uA Condition EN1 = EN2 = GND VIN1 and VIN2 rising are detected VIN1 and VIN2 falling are detected Operating start voltage Vrls(vin) 3.6 3.9 4.2 V Operating stop voltage Vdet(vin) 3.4 3.7 4.0 V Internal power supply voltage VREG 4.7 5.0 5.3 V Ireg = 0mA, VIN1 = 6V to 16V E/A feedback voltage vref07 0.693 0.700 0.707 V Include input offset at external resistor setting +2.5 % Fixed VOUT products Output Output voltage accuracy (PWM mode) High side FET on-resistance Vacc Ronh 180 mΩ Io=100mA Low side FET on-resistance Ronl 130 mΩ Io=-100mA Discharge circuit On-resistance Rondc — 100 200 Ω Soft start Soft start time *1 tss 1.2 2 3.5 ms Thermal shutdown circuit Logic input Detect temperature *2 Hysteresis temperature *2 165 °C 20 °C CH1, CH2, Io=15mA High level threshold voltage VIH 1.3 VIN+0.3 V EN1, EN2, x_AutoPFM Low level threshold voltage VIL -0.3 0.4 V EN1, EN2, x_AutoPFM Input current IEN uA EN1 = 3.3V, EN2 = 3.3V x_AutoPFM = 3.3V VBB_IN input voltage range VBB On-resistance between Battery VBB_IN and VBB_OUT backup On-resistance between (RAA23022x) VOUT1 and VBB_OUT VBB leak current *1 Note: -2.5 1 2.7 3.0 3.7 V Ron_vbat 400 Ω VBB_OUT = VBB_IN, Io=0.5mA Ron_vout1 100 Ω VBB_OUT = VOUT1, Io=0.5mA IL_BB 0.5 uA VBB_OUT = VBB_IN = 3.0V, No load *1 Reference value *2 Not production tested. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 10 of 30 RAA23022x RAA23023x Typical Performance Characteristics (Unless otherwise specified, TA = 25°C) Efficiency vs. Output Current CH1 Vout=3.3V, Auto PFM mode VIN=8V CH2 Vout=5.0V, Auto PFM mode VIN=8V VIN=12V VIN=12V VIN=16V VIN=16V Output voltage vs. Output Current CH1 Vout=3.3V, CH2 Vout=5.0V, Auto PFM mode Auto PFM mode Start-up and Shutdown Waveforms 12.0V 12.0V EN1/EN2 (5.0V/Div) VOUT2 (1.0V/Div) 5.0V 5.0V 3.3V 3.3V VOUT1 (1.0V/Div) 2ms/Div R18DS0017EJ0100 REV.1.00 Apr.21.2015 2ms/Div Page 11 of 30 RAA23022x RAA23023x Operation Waveforms CH1 VIN=12V, Vout=3.3V, Iout=3.0A Auto_PFM mode VOUT1 (AC 20mV/Div) CH2 VIN=12V, Vout=5.0V, Iout=3.0A Auto PFM mode VOUT2 (AC 20mV/Div) LX2 (10.0V/Div) LX1 (10.0V/Div) 1us/Div 1us/Div CH1 VIN=12V, Vout=3.3V, Iout=0.01A Auto_PFM mode CH2 VIN=12V, Vout=5.0V, Iout=0.01A Auto PFM mode VOUT2 (AC 20mV/Div) VOUT1 (AC 20mV/Div) LX2 (10.0V/Div) LX1 (10.0V/Div) 10us/Div R18DS0017EJ0100 REV.1.00 Apr.21.2015 20us/Div Page 12 of 30 RAA23022x RAA23023x Load Step Transient Waveforms CH1 VIN=12V, Vout=3.3V, Iout=0.01A-1.0A Auto_PFM mode CH2 VIN=12V, Vout=5.0V, Iout=0.01A-1.0A Auto PFM mode VOUT1 (AC 100mV/Div) VOUT2 (AC 100mV/Div) IOUT1 (1.0A/Div) IOUT2 (1.0A/Div) 200us/Div CH1 VIN=12V, Vout=3.3V, Iout=0.01A-2.0A PWM mode 200us/Div CH2 VIN=12V, Vout=5.0V, Iout=0.01A-2.0A PWM mode VOUT1 (AC 100mV/Div) VOUT2 (AC 100mV/Div) IOUT1 (1.0A/Div) IOUT2 (1.0A/Div) 200us/Div R18DS0017EJ0100 REV.1.00 Apr.21.2015 200us/Div Page 13 of 30 RAA23022x RAA23023x Battery Backup circuit : VBB_OUT changing Waveform (RAA23022x) VIN=8.0V, VOUT1=3.3V, VBB_OUT output current =10uA, VBB_OUT capacitor = 0.47uF (1) Battery Voltage (VBB_IN pin)=3.0V、VOUT1=3.3V VBB_OUT (0.2V/Div) 3.3V 3.3V VIN (2V/Div) VOUT1 (2V/Div) 3.0V 3.0V 8.0V 8.0V 3.3V 3.3V 0V 0V 20ms/Div 20ms/Div (2) Battery Voltage(VBB_IN pin) = 3.6V、VOUT1=3.3V VBB_OUT (0.2V/Div) 3.3V VIN (2V/Div) 8.0V 3.6V 3.6V 3.3V 8.0V 3.3V 3.3V VOUT1 (2V/Div) 0V 0V 20ms/Div 20ms/Div Temperature Derating Curve 4000 3500 Pr (mW) 3000 2500 2000 1500 1000 500 0 0 25 50 75 100 125 TA(℃) R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 14 of 30 RAA23022x RAA23023x Detailed Description Control Block EN1, EN2 : ON/OFF setting EN1 L EN2 L State VREG Shutdown 0V (CH1 and CH2 stop) L CH1 Operation 5.0V H CH2 Stop H H CH1 and CH2 Operation 5.0V H Ch1 Stop 5.0V L CH2 Operation Note: L: Low level, H: High level There is no pull-down resistor within EN1 and EN2 pin because of reducing power consumption at light load. Fix EN1 and EN2 pin to high level or low. x_autoPFM : AutoPFM mode/ PWM mode setting x_autoPFM L Operation Auto PFM mode (change automatically) PFM mode at light load PWM mode at heavy load H PWM mode (fixed) Note: L: Low level, H: High level There is no pull-down resistor within x_autoPFM pin because of reducing power consumption at light load. Fix x_autoPFM pin to high level or low. PGOOD : Power Good output State PGOOD CH1 and CH2 stop L CH1 or CH2 operation HiZ Note: L: Low level, H: High level When using this function, connect PGOOD pin to VREG, VOUT1, VOUT2, etc. When VREG voltage falls under 3.7V, PGOOD pin becomes high impedance though CH1 and CH2 stop. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 15 of 30 RAA23022x RAA23023x Auto PFM mode RAA23022x and RAA23023x have Auto PFM mode to achieve high efficiency over a wide load current range. The devices operate with PFM (Pulse Frequency Modulation) mode at light load current, and PWM (Pulse Width Modulation) mode at heavy load current. An operation mode is automatically switched depending on load current. When a bottom of inductor ripple current is under 0A, reverse current flow at low-side N-channel MOSFET of output block. The devices operate with PFM mode during detecting this current. A current of switching PFM / PWM mode (Ichange) is calculated by an equation below. L : inductance, fSW : 1.1MHz Switching voltage RAA23022x RAA23023x Reverse current detect Reverse current Inductor current Reverse current flow when a bottom of inductor ripple current is under 0A. RAA23022x and RAA23023x have x_autoPFM pin. When Low level, the devices operate Auto PFM mode (PFM mode / PWM mode changed automatically). When High level, the devices operate PWM mode, then not change into Auto PFM mode. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 16 of 30 RAA23022x RAA23023x Soft Start To limit the startup inrush current and output voltage overshoot, a soft start circuit is used to ramp up the reference voltage from 0 V to its final value linearly. When EN pin is set from low level to high level, the device starts operation and output voltage rises with soft start. Both CH1 and CH2 soft start time are fixed at 2ms(Typ.) and no additional components are needed. Soft start feature gradually increases the error amplifier (E/A) input threshold voltage by using the voltage that is generated by the digital soft start (DSS) circuit. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 17 of 30 RAA23022x RAA23023x Discharge Circuit The device has discharge circuit in both CH1 and CH2. This enables a rapid discharge without an external MOSFET. When an EN pin is changed from high level to low, each discharge switch in VOUT pin is turned on and all capacitors which are connected to each output are rapidly discharged through VOUT pin. When VIN pin voltage becomes low level, discharge switches become off because there are no voltage to keep them on. The control voltage of discharge switches is VREG, and the discharge time of VREG capacitor is over 100ms when VIN voltage falls down, so even if EN pin is connected to VIN pin, an output voltage can be discharged because VREG voltage level can keep the discharge switches on. Discharge time can be calculated by an equation below. Vdc is a voltage after tdc(s). CALL is sum of all capacitance which are connected to CH1 or CH2 output (output capacitor, bypass capacitor around MCU, etc.). Rondc is on resistance of discharge circuit. VIN CH1 Output Control VREG VIN1 Device A LX1 Device B PGND1 Device C VOUT1 Discharge Control CH2 Output Control VIN2 Device D LX2 Device E PGND2 Device F Discharge Control VOUT2 Note : These dashed arrows are discharge line. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 18 of 30 RAA23022x RAA23023x Power Good Power Good is an open-drain output that requires a pull − up resistor (Recommended value = 100kΩ). PGOOD pin becomes high impedance (HiZ) when either CH1 or CH2 FB pin voltage and thus its output voltage rises above 80% of nominal regulation point. If it is pulled-up, PGOOD output high level. PGOOD pin goes low when both CH1 or CH2 output voltage falls below 80% of the regulation point. When both EN1 and EN2 pin goes low level, PGOOD pin becomes HiZ because VREG is used for power good control and it fall down at this time. So, if PGOOD pin is connected to VIN, its status becomes high level even if CH1 and CH2 stop. PGOOD pin must be pulled up to CH1 output, CH2 output or VREG when using this function. CH1 and CH2 can be started in order by connecting PGOOD pin to EN1 or EN2. This function can be also used for sequence signal for other devices. Circuit example when CH2 is started after CH1 EN1 CH1 EN2 CH2 PGOOD 100kΩ Power good control VREG VREG 1uF EN1 VREG VOUT1 2ms (1ms) PGOOD EN2 VOUT2 2ms R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 19 of 30 RAA23022x RAA23023x Battery Backup (RAA23022x) RAA23022x has a battery backup circuit which is used to operate some devices at system power-off. The circuit can be easily designed by RAA23022x without two diodes. When CH1 operates, VBB_OUT = VOUT1. When CH1 stops and VOUT1 pin voltage is higher than VBB_IN pin, VBB_OUT = VOUT1 pin. When CH1 stops and VOUT1 pin voltage is lower than VBB_IN pin, VBB_OUT = VBB_IN pin. VBB_OUT voltage value is dependent on on-resistance between VBB_IN and VBB_OUT, On-resistance between VOUT1 and VBB_OUT and VBB_OUT output current. VBB_OUT can be calculated by equations below. 1. Normal operation mode (VBB_OUT = VOUT1) 2. Battery backup mode (VBB_OUT = VBB_IN) VBB_OUT : VBB_OUT voltage (V) VOUT1 : VOUT1 voltage = CH1 output voltage (V) VBB_IN : VBB_IN voltage = Battery voltage (V) IBB_OUT : VBB_OUT output current (A) Ron_vout1 : On resistance between VOUT1 and VBB_OUT 100Ω (Typ.) Ron_vbat : On resistance between VBB_IN and VBB_OUT 400Ω (Typ.) Note : 2.7V ≤ VBB_OUT ≤ 3.7V Connect over 0.47uF capacitor to VBB_OUT pin. Note : POK1 is an IC internal signal which identifies CH1 operating status. It cannot be seen from IC outside. VBB_OUT pin output status CH1 Operation (POK1 = H) VOUT1, VBB_IN VOUT1 ≥ VBB_IN or VOUT1 < VBB_IN VBB_OUT VOUT1 Stop (POK1 = L) VOUT1 ≥ VBB_IN VOUT1 < VBB_IN VOUT1 VBB_IN Note : L: Low level, H: High level R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 20 of 30 RAA23022x RAA23023x Timing chart of battery backup 1. With 3.0V battery 2. With 3.6V battery R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 21 of 30 RAA23022x RAA23023x Protection Circuit View Protection circuit Short circuit protection (SCP) Function Detect output voltage dropping because of short circuit, etc. (Latch type) Detect rise up of IC internal Thermal temperature shutdown (Over 165˚C) circuit (Auto recovery type) (TSD) Under voltage Detect dropping of VIN lockout circuit (Auto recovery type) (UVLO) Note SCP : Short Circuit Protection TSD : Thermal Shutdown Circuit UVLO : Under Voltage Lockout Circuit Operation status Common circuit CH1, CH2 (VREG, etc.) Output Reset Turn EN1 and EN2 pin from high level to low level or Drop VIN1 and VIN2 pin voltage under operation stop voltage of UVLO Operation Latched to off Operation Stop The temperature falls Operation Stop Up VIN1 and VIN2 over operating start voltage (3.9V) Short Circuit Protection (Latch type) When CH1 or CH2 output voltage drops, each FB pin input voltage also drops. If this voltage falls below the input detection voltage (0.35V(typ.)) of the short circuit protection, the outputs both CH1 and CH2 are stopped (latched to OFF). At this time, common circuits (such as VREG, etc.) continue operating. When the protection is operating, to reset the latch, either turn the EN1 pin and EN2 pin from high to low or drop the VIN1 pin and VIN2 voltage under operation stop voltage of UVLO. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 22 of 30 RAA23022x RAA23023x Thermal Shutdown Circuit (Auto Recovery Type) When overheating has been detected (detect temperature: 165°C ), the outputs both CH1 and CH2 is stopped. Then, power MOSFET of output both high side and low side are turned off. Common circuits (such as VREG, etc.) continue operating. If the device temperature falls and becomes under detect temperature, the protection is canceled and output automatically resumes. Under Voltage Lockout Circuit (Auto Recovery Type) (1) Under voltage lockout operation When the power supply voltage (VIN1 and VIN2) falls to the operation stop voltage (3.7V), output from all channels stops. Common circuits (such as VREG, etc.) continue operating. (2) Restoring output Once VIN1 and VIN2 is restored to the Operating start voltage (3.9V), the under voltage lockout operation is canceled and output automatically resumes. The output voltage cannot be restored while the under voltage lockout circuit is operating, not even by manipulating the EN pin. Current Limiting If an overcurrent occurs, an output current is limited on a pulse-by-pulse basis. If the current sensor detects an overcurrent, the current is limited and the switching operation of the Power MOSFET in the output stage stops until the next cycle. When an output current is limited, the output voltage drops. If a FB pin voltage falls below the input detection voltage, the short-circuit protection circuit starts operating. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 23 of 30 RAA23022x RAA23023x Guide for Circuit Design Setting Output Voltage (When the output voltage is set by external resistor) The output voltage can be calculated by an equation below. VOUT = 0.7 x (1 + R1 / R2) VOUT R1 - R2 + 0.7V Examples of R1 and R2 selection Vout 0.9V 1.0V 1.05V 1.1V 1.18V 1.2V 1.5V 1.8V 2.5V 3.3V 5.0V R1 110k 100k 100k 91k 110k 130k 150k 130k 100k 100k 110k R2 390k 240k 200k 160k 160k 180k 130k 82k 39k 27k 18k Output voltage accuracy (When the output voltage is set by external resistor) Output voltage accuracy can be calculated by an equation below. VOUTACC is the output voltage accuracy (%). VITHACC is the E/A input threshold voltage accuracy (%). VOUT is the output voltage (V). RACC is the external resistor accuracy (%). So, an output voltage accuracy of the device is below. Note : These equation don’t include Vout fluctuation by load step transient. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 24 of 30 RAA23022x RAA23023x Inductor selection An inductor target is that ripple current (∆IL) of inductor becomes 10 to 40 % of Iout(max). When ∆IL increases, inductor current peak raises, so ripple of Vout gets larger and power loss increases. But, large size inductor is required to lower ∆IL. ∆IL can be calculated by an equation below. fsw is 1.1MHz. Peak current of inductor (ILpeak) can be calculated by an equation below. Choose a inductor which saturation current is higher than ILpeak . Inductor Example Inductance (uH) Inductor Manufacturer ITEMP (A) ISAT (A) Size (LxWxT, mm) 2.2 NRS5024T2R2NMGJ TAIYO YUDEN 3.1 4.1 4.9x4.9x2.4 2.2 744778002 WURTH 4.0 4.8 7.3x7.3x3.2 3.3 NRS5030T3R3MMGJ TAIYO YUDEN 3.0 3.6 4.9x4.9x3.1 3.3 7447789003 WURTH 3.4 4.2 7.3x7.3x3.2 4.7 NRS5040T4R7NMGK TAIYO YUDEN 3.1 3.3 4.9x4.9x4.1 4.7 744777004 WURTH 4.0 4.0 7.3x7.3x4.3 Note ITEMP : Rated current by temperature rising ISAT : Rated current by inductance loss These inductors are examples. About inductor detail, contact each manufacturer R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 25 of 30 RAA23022x RAA23023x Output capacitor selection RAA23022x and RAA23023x have a phase compensation circuit which is optimized to DC/DC operation. In order to operate stably with the phase compensation, connect the output capacitor which is over 22 uF. Ceramic capacitor can be used for output capacitor. It has low ESR, so VOUT ripple is decreased. VOUT ripple (∆Vrpl) can be calculated by an equation below. ESR : Equivalent Series Resistance Input capacitor selection Connect an input capacitor which is over 10 uF between each VIN pin and power ground. It should be placed close to the device as possible. VREG capacitor Connect 1uF ceramic capacitor to VREG pin. Bootstrap capacitor Connect 0.1uF ceramic capacitor between LX pin and Boost pin. R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 26 of 30 RAA23022x RAA23023x Feedback capacitor When PFM operation at Auto PFM mode, feedback capacitor can be connected in parallel to high side output voltage setting resistor to adjust phase characteristic. If connected, there are possibility that operation in large current (at PWM operation) is not stable. Confirm the operation with system status. VOUT VOUT Feedback Capacitor R1 FB R2 When using feedback capacitor with an output voltage fixed product, connect feedback capacitor between VOUT pin and FB pin. Connect FB capacitor between VOUT pin and FB pin Example of RAA230232 When not using feedback capacitor with an output voltage fixed product, keep FB pin open. Keep FB pin open Example of RAA230232 R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 27 of 30 RAA23022x RAA23023x Components example VIN (V) 12 5 VOUT (V) L (uH) Cout (uF) 5V 3.3V 1.2V 3.3 1.2 3.3 3.3 3.3 2.2 2.2 22 to 44 22 to 44 22 to 44 22 22 R18DS0017EJ0100 REV.1.00 Apr.21.2015 CFB (pF) Auto PFM mode 0 to 100 0 to 100 0 to 100 0 to 100 0 to 100 PWM mode No need No need No need No need No need Page 28 of 30 RAA23022x RAA23023x Notes on Use VIN Applied Voltage Be sure to apply the same voltage toVIN1 pin and VIN2 pin. Pattern Wiring To actually perform pattern wiring, separate a ground of control signal from a ground of a power line, so that these grounds do not have a common impedance as much as possible. Connection of Exposed PAD HTSSOP package has an Exposed PAD on the bottom to improve radiation performance. On the mounting board, connect this Exposed PAD to PGND or GND. Fixed Usage of Control Input Pin When EN pin and x_AutoPFM pin are fixed, connect to a pin listed below. Input Pin EN1 EN2 x_AutoPFM R18DS0017EJ0100 REV.1.00 Apr.21.2015 Connect Pin Fixed to Low Level Fixed to High Level GND VIN GND VIN GND VIN Page 29 of 30 RAA23022x RAA23023x Package Dimensions 20pin HTSSOP Renesas code : PTSP0020JF-A R18DS0017EJ0100 REV.1.00 Apr.21.2015 Page 30 of 30 Revision History Rev. 1.00 Date Apr.21. 2015 RAA23022x, RAA23023x Datasheet Page - Description Summary First Edition issued All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. 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