RJK6011DJE
Silicon N Channel MOS FET High Speed Power Switching
REJ03G1577-0300 Rev.3.00 Oct 03, 2008
Features
• Low on-resistance • Low drive current • High density mounting
Outline
RENESAS Package code: PRSS0003DC-A (Package name: TO-92 Mod)
D
G
1. Source 2. Drain 3. Gate
32
S
1
Absolute Maximum Ratings
(Ta = 25°C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Body-drain diode reverse drain peak current Channel dissipation Channel to ambient thermal impedance Channel temperature Storage temperature Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1% Symbol VDSS VGSS ID ID (pulse)Note1 IDR IDR (pulse)Note1 Pch θch-a Tch Tstg Ratings 600 ±30 0.1 0.4 0.1 0.4 0.9 139 150 –55 to +150 Unit V V A A A A W °C/W °C °C
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 1 of 6
RJK6011DJE
Electrical Characteristics
(Ta = 25°C)
Item Drain to source breakdown voltage Zero gate voltage drain current Gate to source leak current Gate to source cutoff voltage Static drain to source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate to source charge Gate to drain charge Body-drain diode forward voltage Symbol V(BR)DSS IDSS IGSS VGS(off) RDS(on) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd VDF Min 600 — — 3 — — — — — — — — — — — — Typ — — — — 35 25 4.7 0.9 33 16 54 300 3.7 0.4 2.7 0.80 Max — 1 ±0.1 5 52 — — — — — — — — — — 1.35 Unit V µA µA V Ω pF pF pF ns ns ns ns nC nC nC V Test conditions ID = 10 mA, VGS = 0 VDS = 600 V, VGS = 0 VGS = ±30 V, VDS = 0 VDS = 10 V, ID = 1 mA ID = 0.05 A, VGS = 10 V Note2 VDS = 25 V VGS = 0 f = 1 MHz ID = 0.05 A VGS = 10 V RL = 6000 Ω Rg = 10 Ω VDD = 480 V VGS = 10 V ID = 0.1 A IF = 0.1 A, VGS = 0 Note2
Notes: 2. Pulse test 3. Since this device is equipped with high voltage FET chip (VDSS ≥ 600 V), high voltage may be supplied. Therefore, please be sure to confirm about Electric discharge between Drain terminal and other terminal.
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 2 of 6
RJK6011DJE
Main Characteristics
Maximum Safe Operation Area
10 0.4 Pulse Test Ta = 25°C
5.8 V 6V 8V
Typical Output Characteristics
Drain Current ID (A)
Drain Current ID (A)
1
10 µs
0.3
VGS = 10 V 5.6 V
0.1
PW = 100 µs
0.2
5.4 V 5.2 V 5V
0.01
Operation in this area is limited by RDS(on)
0.1
0.001
0.0001 0.1
Ta = 25°C 1 shot 1 10 100 1000 0 4 8 12 16 20
Drain to Source Voltage VDS (V)
Drain to Source Voltage VDS (V) Static Drain to Source on State Resistance vs. Drain Current (Typical)
Drain to Source on State Resistance RDS(on) (Ω)
1 Pulse Test VGS = 10 V Ta = 25°C 50
Typical Transfer Characteristics
0.1 VDS = 10 V Pulse Test
Drain Current ID (A)
0.01
25°C 0.001 Tc = 75°C −25°C
20
0.0001 0 2 4 6 8 10
10 0.01
0.1
1
Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Temperature (Typical)
100 Pulse Test VGS = 10 V 0.05 A ID = 0.1 A 60 0.025 A 40 100
Drain Current ID (A)
Static Drain to Source on State Resistance RDS(on) (Ω)
Typical Capacitance vs. Drain to Source Voltage (Typical)
Capacitance C (pF)
80
Ciss 10 Coss 1 VGS = 0 f = 1 MHz Ta = 25°C 100 200 300 Crss
20
0 -25
0
25
50
75
100 125 150
0.1 0
Case Temperature Tc (°C)
Drain to Source Voltage VDS (V)
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 3 of 6
RJK6011DJE
Reverse Drain Current vs. Source to Drain Voltage (Typical)
Gate to Source Voltage VGS (V)
0.4
Dynamic Input Characteristics (Typical)
Drain to Source Voltage VDS (V)
800
Reverse Drain Current IDR (A)
=1
ID = 0.1 A Ta = 25 °C
VGS
0V
16
Pulse Test Ta = 25 °C
00
V
DD
V
30
VDS 400
480
V
600
12
0.3
8
0.2 5 V, 10 V 0.1 VGS = 0, −5 V 0
200
10 0 V
30
0
V
VDD = 480 V
4
0 0 0.8 1.6 2.4 3.2 4.0
0.4
0.8
1.2
1.6
2.0
Gate Charge Qg (nC)
Source to Drain Voltage VSD (V)
Gate to Source Cutoff Voltage VGS(off) (V)
Gate to Source Cutoff Voltage vs. Case Temperature (Typical)
6 VDS = 10 V ID = 10 mA 1 mA 4 0.1 mA
5
3
2
1 -25
0
25
50
75
100 125 150
Case Temperature
Tc (°C)
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 4 of 6
RJK6011DJE
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance γ s (t)
10
1
D=1 0.5
0.2
0.1
0.1
0.05
0.02
0.01 lse t pu sho 1
θch – a (t) = γ s (t) • θch – a θch – a = 139°C/W, Ta = 25°C PDM PW T 1m 10 m 100 m 1 10 100 1000 10000 D= PW T
0.01 10 µ
100 µ
Pulse Width PW (s)
Switching Time Test Circuit
Vin Monitor D.U.T. RL 10 Ω Vin 10 V VDD = 300 V Vin Vout 10% 10% Vout Monitor
Waveform
90%
10%
90% td(on) tr
90% td(off) tf
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 5 of 6
RJK6011DJE
Package Dimensions
Package Name TO-92 Mod JEITA Package Code SC-51 RENESAS Code PRSS0003DC-A Previous Code TO-92 Mod / TO-92 ModV MASS[Typ.] 0.35g
Unit: mm
4.8 ± 0.4
3.8 ± 0.4
0.65 ± 0.1 0.75 Max 0.55 Max 0.60 Max
2.3 Max 0.7
10.1 Min
8.0 ± 0.5
0.5 Max
1.27 2.54
Since RJK6011DJE is equipped with high voltage FET chip (VDSS ≥ 600 V), high voltage may be supplied. Therefore, please be sure to confirm about Electric discharge between Drain terminal and other terminal.
Ordering Information
Part No. RJK6011DJE-00-Z0 Quantity 2500 pcs Shipping Container Hold Box, Radial Taping
REJ03G1577-0300 Rev.3.00 Oct 03, 2008 Page 6 of 6
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