SLG5NT1464V

SLG5NT1464V Ultra-small 40 mΩ 1.0 A GreenFET 3 Load Switch with Discharge General Description Pin Configuration ON 1 The product is packaged in an ultra-small 1.0 x 1.0 mm package. D 2 SLG5NT1464V The SLG5NT1464V is designed for load switching applications. The part comes with one 40 mΩ 1.0 A rated MOSFET controlled by a single ON control pin. The MOSFET’s ramp rate is adjustable depending on the input current level of the ON pin. 4 GND 3 S Features • • • • • • • 4-pin STDFN (Top View) One 40 mΩ 1.0 A MOSFET One integrated VGS Charge Pump User selectable ramp rate with external resistor Integrated Discharge Resistor Over Temperature Protection Pb-Free / Halogen-Free / RoHS compliant STDFN 4L, 1.0 x 1.0 x 0.55 mm Block Diagram S D 1.0 A Charge Pump Out Current Detect Slew Rate Control ON Silego Technology, Inc. 000-005NT1464-101 CMOS Input Rev 1.01 Revised December 11, 2013 SLG5NT1464V Pin Description Pin # Pin Name Type Pin Description 1 ON Input Turns on MOSFET. Configurable slew rate control depending on input current. 2 D MOSFET Drain of Power MOSFET 3 S MOSFET Source of Power MOSFET 4 GND GND Ground Ordering Information Part Number Type Production Flow SLG5NT1464V STDFN 4L Extended Commercial, -20 °C to 70 °C SLG5NT1464VTR STDFN 4L (Tape and Reel) Extended Commercial, -20 °C to 70 °C Application Diagram Current Controls Ramp Rate ON 3.3 V R1 SLG5NT1464V Control IC D GND S Adjustable Ramp Rate vs. ON Pin Current (5.5 V, 25 °C) I_ON TSLEW (typ) 20 μA 0.56 V/ms 50 μA 1.34 V/ms 100 μA 2.53 V/ms 150 μA 3.71 V/ms 200 μA 4.68 V/ms 250 μA 5.63 V/ms Adjustable Slew Rate (ON Pin 2) SLG5NT1464V has a built in configurable slew control feature. The configurable slew control uses current detection method on Pin 2. When ON voltage rise above ON_VIH_INI (1.2 V typical), the slew control circuit will measure the current flowing into Pin 2. Based on the current flowing into pin 2, different slew rates will be selected by the internal control circuit. See I_ON vs. Tslew table on page 2. The slew rate is configurable by selecting a different R1 resistor value as shown on application diagram on page 2. Calculating the R1 value depends on both the desired slew rate, and the VOH level of the device driving the ON Pin 2. ON_Current = (GPIO_VOH – ON_VREF (1.05 V typical)) / R1 000-005NT1464-101 Page 2 of 8 SLG5NT1464V Absolute Maximum Ratings Parameter Description VD Power Supply TS Storage Temperature ESDHBM WDIS ESD Protection Conditions Human Body Model Min. Typ. Max. Unit -- -- 6 V -65 -- 150 °C 2000 -- -- V -- -- 0.5 W -- -- 1.5 A Package Power Dissipation MOSFET IDSPK Peak Current from Drain to Source For no more than 1 ms with 1% duty cycle Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Electrical Characteristics TA = -20 to 70 °C (unless otherwise stated) Parameter VD IDD Description Conditions Min. Power Supply Voltage -20 to 70°C when OFF Power Supply Current (PIN 2) Typ. Max. Unit 2.5 -- 5.5 V -- 0.1 1 μA when ON, No load -- 18 30 μA Static Drain to Source ON Resistance TA 25°C MOSFET -- 40 50 mΩ TA 70°C MOSFET -- 50 55 mΩ IDS Operating Current VD = 2.5 V to 5.5 V -- -- 1.0 A TDelay_ON ON pin Delay Time 50% ON to Ramp Begin Input Current (PIN 1) = 20 μA, VD = 5 V, Source_Cap = 10 μF, RL = 20 Ω 0 2.4 4.0 ms RDSON Configurable 1 50% ON to 90% VS TTotal_ON Total Turn On Time Example: Input Current (PIN 1) = 20 μA, VD = 5 V, Source_Cap = 10 μF, RL = 20 Ω -- TSLEWRATE RDIS ON_VREF Slew Rate -- Configurable 1 10% VS to 90% VS Example: Input Current (PIN 1) = 20 μA, VD = 5 V, Source_Cap = 10 μF, RL = 20 Ω 11.7 ms -- 0.56 ms V/ms -- V/ms Discharge Resistance 100 150 300 Ω ON Pin Reference Voltage2 0.99 1.05 1.10 V Internal Charge Pump ON 1.2 -- VDD V Internal Charge Pump OFF -0.3 0 0.3 V ON_VIH_INI Initial Turn On Voltage ON_VIL Low Input Voltage on ON pin ON_R Input Impedance on ON pin 100 -- -- MΩ Thermal shutoff turn-on temperature -- 120 -- °C THERMOFF Thermal shutoff turn-off temperature -- 100 -- °C THERMTIME Thermal shutoff time -- -- 1 ms THERMON TDelay_OFF TFALL OFF Delay Time 50% ON to VS Fall, VD = 5 V, RL = 20 Ω -- 6.5 20 μs VS Fall Time 90% VS to 10% VS, VD = 5 V, RL = 20 Ω -- 1.2 2 μs Notes: 1. Refer to table for configuration details. 2. Voltage before ON pin resistor needs to be higher than 1.2 V to generate required ION 000-005NT1464-101 Page 3 of 8 SLG5NT1464V Slew Rate vs. ON Current Slew Rate (V/ms) Vs. ON Current, T = 25C 10%VS to 90%VS, RL = 20 ohm, CL = 10uF 7.00 6.00 V/ms 5.00 VD = 2.5V 4.00 VD = 3.3V 3.00 VD = 5V VD = 5.25V 2.00 VD = 5.5V 1.00 0.00 0 50 100 150 200 250 ON Current (uA) TTotal_ON vs. On Current Ttotal_on vs ON Current. 50%ON to 90%VS, T = 25C, RL = 20 ohm, CL = 10uF 14.00 12.00 Ttota al_on (ms) 10.00 VD = 2.5V 8.00 VD = 3.3V 6.00 VD = 5V VD = 5.25V 4.00 VD = 5.5V 2.00 0.00 0 50 100 150 200 250 ON Current (uA) 000-005NT1464-101 Page 4 of 8 SLG5NT1464V TTotal_ON, TON_Delay and Slew Rate Measurement ON 50% ON 50% ON TOFF_DELAY 90% VS VS 90% VS TON_DELAY 10% VS 10% VS Slew Rate (V/ms) TFALL TTotal_ON SLG5NT1464V Layout Suggestion 800 Recommended Land Pattern 210 Unit: μm 410 810 190 Exposed Pad 200 1800 000-005NT1464-101 Page 5 of 8 SLG5NT1464V Package Top Marking System Definition Pin 1 Identifier 000-005NT1464-101 XX Serial Number Page 6 of 8 SLG5NT1464V Package Drawing and Dimensions 4 Lead STDFN Package 1.0 x 1.0 mm 000-005NT1464-101 Page 7 of 8 SLG5NT1464V Tape and Reel Specifications Max Units Leader (min) Nominal Reel & Package # of Package Size Hub Size Length Type Pins per Reel per Box Pockets [mm] [mm] [mm] STDFN 4L Green 4 1.0 x 1.0 x 0.55 8000 8000 178 / 60 200 400 Trailer (min) Pockets Length [mm] Tape Width [mm] 200 400 8 Part Pitch [mm] 2 Carrier Tape Drawing and Dimensions Pocket BTM Pocket BTM Package Length Width Type STDFN 4L Green Pocket Depth Index Hole Pitch Pocket Pitch Index Hole Diameter Index Hole Index Hole to Tape to Pocket Tape Width Edge Center A0 B0 K0 P0 P1 D0 E F W 1.16 1.16 0.63 4 2 1.5 1.75 3.5 8 Refer to EIA-481 specification Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.55 mm3 (nominal). More information can be found at www.jedec.org. 000-005NT1464-101 Page 8 of 8