TSI721A1-16GILV

Titl ® Tsi721™ Datasheet April 4, 2016 Co Table of Contents About this Document......................................................................................................................6 Overview.................................................................................................................................................................................................... 6 Document Conventions.............................................................................................................................................................................. 6 Revision History......................................................................................................................................................................................... 7 1. Device Overview............................................................................................................................ 8 1.1 Overview.................................................................................................................................................................................................... 8 1.2 Features..................................................................................................................................................................................................... 8 1.2.1 PCIe Features ............................................................................................................................................................................ 8 1.2.2 S-RIO Features .......................................................................................................................................................................... 9 1.2.3 Bridging Features ....................................................................................................................................................................... 9 1.2.4 Messaging Features ................................................................................................................................................................. 10 1.2.5 Block DMA Engine Features .................................................................................................................................................... 10 1.2.6 Miscellaneous Features.............................................................................................................................................................11 1.3 Block Diagram.......................................................................................................................................................................................... 12 1.3.1 PCIe Interface........................................................................................................................................................................... 12 1.3.2 S-RIO Interface......................................................................................................................................................................... 12 1.3.3 Messaging Engine.................................................................................................................................................................... 12 1.3.4 Mapping Engine........................................................................................................................................................................ 12 1.3.5 Block DMA Engine.................................................................................................................................................................... 12 1.4 Typical Applications ................................................................................................................................................................................. 13 1.4.1 Defense/Aerospace Application ............................................................................................................................................... 13 1.4.2 Video and Imaging Application ................................................................................................................................................. 15 1.4.3 Wireless Application ................................................................................................................................................................. 15 2. Signals ......................................................................................................................................... 17 2.1 Overview.................................................................................................................................................................................................. 17 2.2 Ballmap.................................................................................................................................................................................................... 18 2.3 Pinlist ....................................................................................................................................................................................................... 19 2.4 PCIe Signals ............................................................................................................................................................................................ 19 2.5 S-RIO Signals .......................................................................................................................................................................................... 20 2.6 General Signals ....................................................................................................................................................................................... 20 2.7 I2C Signals .............................................................................................................................................................................................. 21 2.8 JTAG and Test Interface Signals.............................................................................................................................................................. 21 2.9 GPIO Signals ........................................................................................................................................................................................... 22 2.10 Power-up Signals..................................................................................................................................................................................... 23 2.11 Power Supply Signals.............................................................................................................................................................................. 26 3. Electrical Characteristics ........................................................................................................... 27 3.1 Absolute Maximum Ratings ..................................................................................................................................................................... 27 3.2 Recommended Operating Conditions...................................................................................................................................................... 28 3.3 Power Consumption................................................................................................................................................................................. 28 Tsi721 Datasheet Integrated Device Technology 2 April 4, 2016 3.4 3.5 3.6 3.7 Power Supply Sequencing....................................................................................................................................................................... 29 3.4.1 Power-Up Sequencing.............................................................................................................................................................. 29 3.4.2 Power-Down Sequencing ......................................................................................................................................................... 29 DC Operating Characteristics .................................................................................................................................................................. 30 Decoupling Recommendation.................................................................................................................................................................. 31 AC Timing Specifications ......................................................................................................................................................................... 31 3.7.1 PCIe Differential Receiver Specifications ................................................................................................................................. 31 3.7.2 PCIe Differential Transmitter Specifications ............................................................................................................................. 34 3.7.3 RapidIO SerDes Characteristics............................................................................................................................................... 38 3.7.4 Level I Long Run Transmitter Specifications ............................................................................................................................ 43 3.7.5 Reference Clocks – PCCLKP/N and REFCLKP/N ................................................................................................................... 57 3.7.6 JTAG and Test Interface Signal Timings .................................................................................................................................. 59 3.7.7 I2C Interface Signal Timings .................................................................................................................................................... 60 3.7.8 GPIO Interface Signal Timings ................................................................................................................................................. 61 3.7.9 RSTn Signal Timings................................................................................................................................................................ 61 4. Package Specifications............................................................................................................... 62 4.1 Package Dimensions ............................................................................................................................................................................... 62 4.2 Package Diagrams................................................................................................................................................................................... 63 4.3 Thermal Characteristics........................................................................................................................................................................... 64 4.4 Moisture Sensitivity.................................................................................................................................................................................. 64 5. Ordering Information ................................................................................................................... 65 Tsi721 Datasheet Integrated Device Technology 3 April 4, 2016 List of Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Block Diagram............................................................................................................................................................................................. 12 Defense/Aerospace Application ................................................................................................................................................................ 14 Video and Imaging Application ................................................................................................................................................................. 15 Wireless Application .................................................................................................................................................................................. 16 Ballmap ....................................................................................................................................................................................................... 18 S-RIO Definition of Transmitter Amplitude and Swing ................................................................................................................................ 39 S-RIO Transition Symbol Transmit Eye Mask............................................................................................................................................. 44 S-RIO Single Frequency Sinusoidal Jitter Limits ........................................................................................................................................ 46 S-RIO Level I Receiver Input Mask............................................................................................................................................................. 47 Transition and Steady State Symbol Eye Mask .......................................................................................................................................... 51 Level II Receiver Input Compliance Mask................................................................................................................................................... 56 HCSL to REFCLKP/N / PCCLKP/N ............................................................................................................................................................ 58 LVDS to REFCLKP/N / PCCLKP/N............................................................................................................................................................. 58 LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 58 LVPECL to REFCLKP/N / PCCLKP/N ........................................................................................................................................................ 59 I2C Interface Signal Timings....................................................................................................................................................................... 60 Package Diagrams...................................................................................................................................................................................... 63 Tsi721 Datasheet Integrated Device Technology 4 April 4, 2016 List of Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Table 34: Table 35: Table 36: Table 37: Table 38: Table 39: Signal Types ............................................................................................................................................................................................... 17 PCIe Signals ............................................................................................................................................................................................... 19 S-RIO Signals ............................................................................................................................................................................................. 20 General Signals .......................................................................................................................................................................................... 20 I2C Signals.................................................................................................................................................................................................. 21 JTAG Interface Signals ............................................................................................................................................................................... 21 GPIO Signals .............................................................................................................................................................................................. 22 GPIO Mapping to Power-up Signals ........................................................................................................................................................... 22 Power-Up Signals ....................................................................................................................................................................................... 23 Power Supply Signals ................................................................................................................................................................................. 26 Absolute Maximum Ratings ........................................................................................................................................................................ 27 Recommended Operating Conditions......................................................................................................................................................... 28 Power Consumption.................................................................................................................................................................................... 28 Power Supply Sequencing Ramp Times .................................................................................................................................................... 29 3.3V LVTTL DC Operating Characteristics at Recommended Operating Condition of 3.3V ...................................................................... 30 2.5V LVTTL DC Operating Characteristics at Recommended Operating Condition of 2.5V ...................................................................... 30 Decoupling Recommendation..................................................................................................................................................................... 31 PCIe Differential Receiver Specifications ................................................................................................................................................... 31 PCIe Differential Transmitter Specifications................................................................................................................................................ 34 Level I Short Run Transmitter AC Timing Specifications ............................................................................................................................ 42 Level I Long Run Transmitter AC Timing Specifications............................................................................................................................. 43 Level I Near-End (Tx) Template Intervals ................................................................................................................................................... 44 Level I Receiver Electrical Input Specifications .......................................................................................................................................... 45 Level I Receiver Input Jitter Tolerance Specifications................................................................................................................................. 46 Level I Far-End (Rx) Template Intervals ..................................................................................................................................................... 47 Level II Short Run Transmitter Output Electrical Specifications.................................................................................................................. 49 Level II Medium Run Transmitter Output Electrical Specifications ............................................................................................................. 50 Level II Medium Run Near-End (Tx) Template Intervals ............................................................................................................................. 52 Level II Short Run Receiver Electrical Input Specifications ........................................................................................................................ 53 Level II MR Receiver Electrical Input Specifications................................................................................................................................... 55 Level II Far-End (Rx) Template Intervals .................................................................................................................................................... 56 PCCLKP/N and REFCLKP/NClock Electrical Characteristics .................................................................................................................... 57 JTAG and Test Interface AC Specifications ................................................................................................................................................ 59 I2C Interface AC Specifications .................................................................................................................................................................. 60 GPIO Interface AC Specifications............................................................................................................................................................... 61 RSTn Signal AC Specifications................................................................................................................................................................... 61 Package Dimensions .................................................................................................................................................................................. 62 Junction to Ambient Characteristics – Theta JB/JC.................................................................................................................................... 64 Junction to Ambient Characteristics – Theta JA ......................................................................................................................................... 64 Tsi721 Datasheet Integrated Device Technology 5 April 4, 2016 About this Document Topics discussed include the following: • Overview • Document Conventions • Revision History Overview The Tsi721 Datasheet provides signal, electrical, and packaging information about the Tsi721. It is intended for hardware engineers who are designing system interconnect applications with the device. Document Conventions This document uses the following conventions. Non-differential Signal Notation Non-differential signals are either active-low or active-high. An active-low signal has an active state of logic 0 (or the lower voltage level), and is denoted by a lowercase “n”. An active-high signal has an active state of logic 1 (or the higher voltage level), and is not denoted by a special character. The following table illustrates the non-differential signal naming convention. State Single-line signal Multi-line signal Active low NAMEn NAMEn[3] Active high NAME NAME[3] Differential Signal Notation Differential signals consist of pairs of complement positive and negative signals that are measured at the same time to determine a signal’s active or inactive state (they are denoted by “_p” and “_n”, respectively). The following table illustrates the differential signal naming convention. State Single-line signal Multi-line signal Inactive NAME_p = 0 NAME_n = 1 NAME_p[3] = 0 NAME_n[3] = 1 Active NAME_p = 1 NAME_n = 0 NAME_p[3] is 1 NAME_n[3] is 0 Tsi721 Datasheet Integrated Device Technology 6 April 4, 2016 Object Size Notation • A byte is an 8-bit object. • A PCIe word is a 16-bit object. • A PCIe doubleword (DW) is a 32-bit object. • An S-RIO word is a 32-bit object. • An S-RIO doubleword (Dword) is a 64-bit object. Numeric Notation • Hexadecimal numbers are denoted by the prefix 0x (for example, 0x04). • Binary numbers are denoted by the prefix 0b (for example, 0b010). • Registers that have multiple iterations are denoted by {x..y} in their names; where x is first register and address, and y is the last register and address. For example, REG{0..1} indicates there are two versions of the register at different addresses: REG0 and REG1. Symbols This symbol indicates important configuration information or suggestions. This symbol indicates procedures or operating levels that may result in misuse or damage to the device. Revision History April 4, 2016 • Added GCLV, GILH, and GILV part numbers to Ordering Information May 5, 2014 • Updated the description of the VIN_DIFF parameter in Table 32 December 3, 2012 • Updated Ordering Information with production ordering numbers February 28, 2012 • Added a footnote to Absolute Maximum Ratings, and removed the minimum rating for TJN from the same section • Added TJN and a footnote to Recommended Operating Conditions December 16, 2011 • Updated the minimum and maximum values for AVDD10 in Recommended Operating Conditions • Added Power Consumption data • Changed the Moisture Sensitivity Level to 4 Tsi721 Datasheet Integrated Device Technology 7 April 4, 2016 1. Device Overview Topics discussed include the following: • Overview • Features • Block Diagram • Typical Applications 1.1 Overview IDT is the leading supplier of RapidIO® and PCI Express Interconnect solutions, providing a broad portfolio of switches, bridges, IP, and development platforms for defense aerospace, video, imaging, and wireless markets. The Tsi721 is IDT's solution for hardware-based PCIe Gen2 to RapidIO Gen2 protocol conversion in a bridging device. The Tsi721 converts transactions from PCIe to RapidIO, and vice versa, and provides full line rate bridging at 20 Gbaud. Using the Tsi721, designers can develop heterogeneous systems that leverage the peer-to-peer networking performance of RapidIO while using multiprocessor clusters that may be only PCIe enabled. In addition, applications that require large amounts of data transferred efficiently without processor involvement can be executed using the full line rate of the Tsi721’s Block DMA Engine and Messaging Engine. Key to the Tsi721 is the hardware bridging functionality that converts PCIe transactions to RapidIO, and vice versa. The Tsi721 supports PCIe non-transparent bridging for transaction mapping. The device has both RapidIO and PCIe endpoints embedded in the bridge, and each of its Block DMA/Messaging DMA channels can buffer up to 8 KB of data on the PCIe side. 1.2 Features The Tsi721 supports the following features. 1.2.1 PCIe Features • PCIe 2.1 standard compliant • 5/2.5 Gbaud link speed • x4/x2/x1 link width • 128- and 256-byte maximum payload • Advanced error reporting • Internal error reporting • Lane reversal • Automatic polarity inversion • Dynamic port width: x4 drops to x1 • ECRC support • INTx, MSI, and MSI-X support Tsi721 Datasheet Integrated Device Technology 8 April 4, 2016 • Single virtual channel, VC0 • Single traffic class, TC0 — Generates only PCIe posted/non-posted TLPs with TC0 — Generates only PCIe Cpl/CplD TLPs with TC matching their requests — Accepts PCIe TLPs with any TC • Four BARs — Prefetchable BAR with 32- or 64-bit addressing for PCIe-to-S-RIO bridging — Non-prefetchable BAR with 32- or 64-bit addressing for PCIe-to-S-RIO bridging — Non-prefetchable BAR with 32-bit addressing for PCIe MWr to S-RIO doorbell bridging — Non-prefetchable BAR with 32-bit addressing for Tsi721 internal register access • Initial credit advertisement programmable through EEPROM • Dynamic control of credits through registers • Starvation prevention based on flow control credit updates • Large buffers — 12 KB/2 KB/12 KB input buffers for up to 127 posted/non-posted/completion TLPs — 12 KB/2 KB/12 KB output buffers for up to 128 posted/non-posted/completion TLPs • Debug features — Slave analog loopback through a control register — Slave loopback using TS1/TS2 ordered sets — Master loopback — Internal error reporting — ECC protection on internal memories 1.2.2 S-RIO Features • S-RIO 2.1 standard compliant • 5/3.125/2.5/1.25 Gbaud link speed • x4/x2/x1 link width • 34-, 50-, and 66-bit addressing • 16 destID filters • 8 S-RIO flows • 9-KB ingress buffer (32 x 288) • 9-KB egress buffer (32 x 288) • Lane reversal • Lane polarity inversion 1.2.3 Bridging Features • Store and forward from PCIe to S-RIO • Store and forward from S-RIO to PCIe • Line rate support for 64 byte and larger packets • 32 outstanding PCIe requests to root complex Tsi721 Datasheet Integrated Device Technology 9 April 4, 2016 • 32 outstanding S-RIO NREAD/maintenance read requests to S-RIO network • 32 outstanding S-RIO NWRITE_R/maintenance write/doorbell requests to S-RIO network • 12-KB completion reassembly buffer • 8 windows from PCIe to S-RIO with 8 zones (sub windows) per window • 8 windows from S-RIO to PCIe • Initiates and receives the following S-RIO transactions: — NREAD — SWRITE/NWRITE/NWRITE_R — Maintenance read and write — Port-write — Doorbell — Type 8 response — Type 13 response • Initiates and receives the following PCIe transactions: — MWr — MRd — Cpl — CplD • Round-robin scheduling between Mapping Engine, Block DMA Engine, and Messaging traffic to the S-RIO link • Round-robin scheduling between Mapping Engine, Block DMA Engine, and Messaging traffic to the PCIe link • Forward bridge — Connects PCIe root complex to S-RIO network — PCIe Type 0 configuration header 1.2.4 Messaging Features • 8 Tx queues with one dedicated messaging DMA engine per Tx queue • 8 Rx queues with one dedicated messaging DMA engine per Rx queue • Descriptor prefetch per Tx queue • 32 outstanding PCIe requests to root complex • 8-KB message segment reassembly buffer per Tx queue • Round-robin scheduling among Tx queues • One outstanding message per Tx queue • 16 receive contexts per Rx queue 1.2.5 Block DMA Engine Features • 8 DMA channels • Each DMA channel can perform DMA writes from root complex to S-RIO network, or DMA reads from S-RIO network to root complex — DMA from PCIe port to PCIe port is not supported — DMA from S-RIO port to S-RIO port is not supported Tsi721 Datasheet Integrated Device Technology 10 April 4, 2016 • Round-robin scheduling among DMA channels • DMA descriptors for all channels reside on PCIe side • Scatter-and-gather with descriptor list • Supports DMA strides • Supports up to 64 MB data for a single descriptor • Supports both read and write descriptors per DMA channel • Dynamic descriptor chaining • Flexible addressing modes — Linear addressing — Constant addressing • Descriptor prefetch • 32 outstanding PCIe requests to root complex • 64 outstanding S-RIO NREAD/maintenance read requests to S-RIO network • 64 outstanding S-RIO NWRITE_R/maintenance write requests to S-RIO network • Supports the following S-RIO transactions: — NREAD — NWRITE — SWRITE — NWRITE_R — Maintenance read — Maintenance write 1.2.6 Miscellaneous Features • I2C interface supports the following: — As a slave, being read/written by an external master during normal operations — As a master, reading external EEPROM during boot load — As a master, reading/writing other external devices during normal operations • JTAG 1149.1, 1149.6 (AC JTAG) • 16 GPIO pins Tsi721 Datasheet Integrated Device Technology 11 April 4, 2016 1.3 Block Diagram The Tsi721 block diagram is displayed in the following figure. The five main functions of the device are briefly described below. Figure 1: Block Diagram Messaging Engine (SMSG) Mapping Engine PCIe Gen2 Interface (x4, x2, x1) PCIe to S-RIO (PC2SR) S-RIO Gen2 Interface (x4, x2, x1) S-RIO to PCIe (SR2PC) Block DMA Engine (BDMA) JTAG 1.3.1 I2C GPIO Clock Reset PCIe Interface The PCIe Interface performs all the physical, data link, and transport layer protocols associated with PCIe. 1.3.2 S-RIO Interface The S-RIO Interface performs all the physical and transport layer protocols associated with S-RIO. 1.3.3 Messaging Engine The Messaging Engine uses S-RIO messaging logical layer functions with dedicated messaging DMA channels per Tx queue and per Rx queue. 1.3.4 Mapping Engine The Mapping Engine maps between PCIe and S-RIO transactions, including segmentation and reassembly as required. 1.3.5 Block DMA Engine The Block DMA Engine uses 8 DMA channels, where descriptors of each DMA channel can perform read or write. Tsi721 Datasheet Integrated Device Technology 12 April 4, 2016 1.4 Typical Applications The Tsi721 supports the following typical applications: • Defense and aerospace — Radar — Sonar — Navigations systems • Medical imaging — CT scanners — MRIs • Video — Teleconferencing — Head end • Wireless — Baseband cards with x86 Three of Tsi721’s typical applications – defense/aerospace, video/imaging, and wireless – are discussed in the following sections. 1.4.1 Defense/Aerospace Application In defense applications, the Tsi721 supports the use of PCIe enabled x86 processors to RapidIO backplanes. This provides system designers with the best of both worlds: the floating point and MIPs horsepower of the latest generation of x86 solutions, with the superior peer-to-peer networking performance of RapidIO architectures. By using the Tsi721 combined with IDT’s RapidIO Gen2 switches, payload processor cards with x86 processors can be used with existing RapidIO 1.3 backplanes operating at up to 3.125 Gbaud, or the same card can be used with RapidIO Gen2 compatible backplanes operating at 5 Gbaud. Tsi721 Datasheet Integrated Device Technology 13 April 4, 2016 Figure 2: Defense/Aerospace Application x86 CPU x86 CPU x86 CPU PCIe Payload Card with RapidIO Bridge x86 CPU x86 CPU x86 CPU x86 CPU x86 CPU RapidIO Switch Card with up to 24 x4 S-RIO Tsi721 Datasheet Integrated Device Technology Tsi721 PCIeTsi721 to SRIO PCIe to S-RIO Tsi721 PCIeTsi721 to SRIO PCIe to S-RIO Tsi721 PCIeTsi721 to SRIO PCIe to S-RIO Tsi721 PCIeTsi721 to SRIO PCIe to S-RIO CPS-1848 CPS-1848 18 x1, 18 CPS-1848 18 x1, 18 CPS-1848 x2, 12 18 x4 x1, 18 x2, 12 x4 18 x2,18 12x1, x4 x2, 12 x4 14 CPS-1848 18 CPS-1848 x1, 18 x2, 18 12 x1, x4 18 x2, 12 x4 IDT Clock 156.25 MHz 4 x4 S-RIO to Backplane IDT Clock 156.25 MHz April 4, 2016 1.4.2 Video and Imaging Application In video and imaging applications, system designers need to cluster large numbers of DSPs or FPGAs to perform encoding/decoding/trans coding, or do FFTs (Fast Fourier Transform) on large arrays of data. The RapidIO protocol is optimal for this DSP/FPGA cluster requirement. However, the analog front-end to the system is usually a sensor with streaming data terminated in an FPGA (for example, a camera subsystem). This is usually in an PCIe network, often with a PC back-end. In these applications the designer needs to bridge between a PCIe network and the RapidIO DSP/FPGA cluster. The Tsi721 is ideal for this application. Figure 3: Video and Imaging Application x4 PCIe Tsi721 PCIe to S-RIO x4 S-RIO x4 S-RIO RapidIO Switch (CPS-1848, CPS-1616, Tsi578) x4 S-RIO x4 S-RIO IDT Clock 156.25 MHz 1.4.3 x4 S-RIO DSP/FPGA S-RIO DSP/FPGA S-RIO DSP/FPGA S-RIO DSP/FPGA S-RIO Wireless Application In wireless base stations, the incumbent interconnect technology in the baseband processing cards – LTE, WiMAX, WCDMA, and TD-SCDMA – is RapidIO. RapidIO connects a cluster of DSPs, processor, and FPGA, locally on the baseband processor for MAC and PHY layer processing. However, the LTE standard pushes the performance available in existing RapidIO enabled microprocessors. The Tsi721 provides wireless OEMs with an additional option to use an x86 processor with superior MIPs in a baseband card that is predominantly RapidIO. In these card designs, RapidIO is the interconnect between devices and functions as the backplane interconnect. x86 processors can now be used with other RapidIO devices on the baseband card and leverage the messaging performance of RapidIO for this peer-to-peer multiprocessor network. Tsi721 Datasheet Integrated Device Technology 15 April 4, 2016 Figure 4: Wireless Application x4 S-RIO Backplane Tsi721 PCIe to S-RIO x4 PCIe Antenna Interface CPRI/CBSAI FPGA S-RIO x4 S-RIO x4 S-RIO IDT Clock 156.25 MHz RapidIO Switch (CPS-1848, x4 S-RIO CPS-1616, Tsi578) DSP S-RIO DSP S-RIO x4 S-RIO x86 CPU DSP S-RIO x4 S-RIO Tsi721 Datasheet Integrated Device Technology 16 April 4, 2016 2. Signals Topics discussed include the following: • Overview • Ballmap • Pinlist • PCIe Signals • S-RIO Signals • General Signals • I2C Signals • JTAG and Test Interface Signals • GPIO Signals • Power-up Signals • Power Supply Signals 2.1 Overview The following conventions are used in this chapter: • Signals with the suffix “P” are the positive half of a differential pair. • Signals with the suffix “N” are the negative half of a differential pair. • Signals with the suffix “n” are active low. Signals are classified according to the types defined in the following table. Table 1: Signal Types Pin Type Definition I 3.3/2.5V LVTTL Input O 3.3/2.5V LVTTL Output IO 3.3/2.5V LVTTL Bidirectional IO-OD 3.3/2.5V LVTTL Bidirectional Open Drain OD 3.3/2.5V LVTTL Open Drain I-PU 3.3/2.5V LVTTL Input with Pull-up I-PD 3.3/2.5V LVTTL Input with Pull-down Tsi721 Datasheet Integrated Device Technology 17 April 4, 2016 Table 1: Signal Types (Continued) Pin Type 2.2 Definition IO-PD 3.3/2.5V LVTTL Bidirectional with Pull-down IO-PU 3.3/2.5V LVTTL Bidirectional with Pull-up PCIE_O Differential CML PCIe output PCIE_I Differential CML PCIe input SRIO_O Differential CML S-RIO output SRIO_I Differential CML S-RIO input DIFF_I Differential CML input PWR Power GND Ground Ballmap Figure 5: Ballmap 1 2 3 4 5 6 7 8 9 10 11 12 A NO_BALL GPIO[9] VSS PCRP[0] PCTP[0] PCTP[1] PCRP[1] PCRP[2] PCTP[2] PCTP[3] PCRP[3] PCCLKP B GPIO[0] GPIO[10] VSS PCRN[0] PCTN[0] PCTN[1] PCRN[1] PCRN[2] PCTN[2] PCTN[3] PCRN[3] PCCLKN C GPIO[1] GPIO[11] VSS VSS AVDD25 AVDD25 AVDD25 AVDD25 VSS VSS VSS PCBIAS D GPIO[2] GPIO[12] VDDIO AVTT AVTT VSS VSS AVDD10 AVDD10 VSS TDO PCRSTOn E GPIO[3] GPIO[13] VDDIO AVTT VDD VSS VSS VDD AVDD10 VDDIO TCK TEST_BCE F GPIO[4] GPIO[14] VDDIO AVTT VSS VDD VDD VSS AVDD10 VDDIO TDI TEST_ON G GPIO[5] GPIO[15] VDDIO AVTT VSS VDD VDD VSS AVDD10 VDDIO VSS TEST_BIDIR_CT L H GPIO[6] STRAP_RATE[0] VDDIO AVTT VDD VSS VSS VDD AVDD10 VDDIO TMS RSTn J GPIO[7] STRAP_RATE[1] VDDIO AVTT AVTT VSS VSS AVDD10 AVDD10 VSS TRSTn SRRSTOn K GPIO[8] STRAP_RATE[2] VSS VSS AVDD25 AVDD25 AVDD25 AVDD25 VSS VSS VSS SRBIAS L I2C_SCL CLKMOD VSS SRRN[0] SRTN[0] SRTN[1] SRRN[1] SRRN[2] SRTN[2] SRTN[3] SRRN[3] REFCLKN M I2C_SDA MECS SR_BOOT SRRP[0] SRTP[0] SRTP[1] SRRP[1] SRRP[2] SRTP[2] SRTP[3] SRRP[3] REFCLKP Tsi721 Datasheet Integrated Device Technology 18 April 4, 2016 2.3 Pinlist For a list-based version of Tsi721’s pin to signal mapping, see the Tsi721 Ballmap and Pinlist. 2.4 PCIe Signals Table 2: PCIe Signals Name Pin Type PCTP[3:0] PCTN[3:0] PCIE_O Differential transmit data for the PCIe port. PCRP[3:0] PCRN[3:0] PCIE_I Differential receive data for the PCIe port. PCCLKP PCCLKN DIFF_I PCIe reference clock input. When in PCIe common clock mode (CLKMOD pin is high, see the “Clocking” chapter in the Tsi721 User Manual), PCCLKP/N requires a clock frequency of 100 MHz. When in PCIe non-common clock mode (CLKMOD pin is low), PCCLKP/N requires a clock frequency as selected by CLKSEL[1:0], and must have the same clock frequency as REFCLKP/N. PCRSTOn IO It is an output for normal operation and an input during scan test mode. As an asynchronous active-low reset output, this pin is low when the following occurs: • The PCIe port detects hot reset • The PCIe port is DL_DOWN Tsi721 Datasheet Integrated Device Technology Description 19 April 4, 2016 2.5 S-RIO Signals Table 3: S-RIO Signals Descriptiona Name Pin Type SRTP[3:0] SRTN[3:0] SRIO_O Differential transmit data for the S-RIO port. SRRP[3:0] SRRN[3:0] SRIO_I Differential receive data for the S-RIO port. SRRSTOn IO It is an output for normal operation and an input during scan test mode. As an asynchronous active-low reset output, this pin is low when four consecutive S-RIO reset symbols are received, and SELF_RST is set to 1 in the RapidIO PLM Port Implementation Specific Control Register MECS IO-PD Asynchronous S-RIO Multicast Event Control Symbol (MECS). Its direction is controlled by the MECS_O bit in the Device Control Register. As an input, a rising or falling edge triggers an S-RIO MECS to be sent on the S-RIO link. Use the RIO_PLM_SP0_MECS_FWD.SUBSCRIPTION/MULT_CS and RIO_EM_MECS_TRIG_EN.CMD_EN to select the CMD field that should be set with the MECS. Multiple MECSs with different CMD fields can be generated by setting these fields appropriately. As an output, this signal is toggled when an S-RIO MECS is received. Only a single MECS CMD value should be selected to toggle the MECS input. Set the RIO_EM_MECS_CAP_EN.CMD_EN to select the CMD value to be propagated to the MECS pin. Note: Only 1 bit should be enabled in CMD_EN. a. For information on S-RIO signals that are used for power-up purposes only, see Power-up Signals. 2.6 General Signals Table 4: General Signals Name Pin Type RSTn I-PU Fundamental reset (device reset).Assertion of this signal resets all logic inside the Tsi721. REFCLKP REFCLKN DIFF_I S-RIO reference clock input. REFCLK requires a clock frequency as selected by CLKSEL[1:0]. Tsi721 Datasheet Integrated Device Technology Description 20 April 4, 2016 2.7 I2C Signals The I2C Interface is used for the following: • As a master, downloading configuration from EEPROM • As a master, allowing the PCIe root complex or the S-RIO host to configure other I2C expansion devices • As a slave, exposing internal register space to an I2C master (Note: To be used for lab debug or another master-driven initialization). Table 5: I2C Signals Descriptiona Name Pin Type I2C_SCL IO-OD Serial clock for the I2C Interface with a maximum frequency of 100 kHz. I2C_SDA IO-OD Serial data for the I2C Interface. a. For information on I2C signals that are used for power-up purposes only, see Power-up Signals. 2.8 JTAG and Test Interface Signals Table 6: JTAG Interface Signals Name Pin Type TCK I-PD IEEE 1149.1/1149.6 test access port. Clock input. TDI I-PU IEEE 1149.1/1149.6 test access port. Serial data input TDO O IEEE 1149.1/1149.6 test access port. Serial data output TMS I-PU IEEE 1149.1/1149.6 test access port. Test mode select TRSTn I-PU IEEE 1149.1/1149.6 test access port. Reset input. This input must be asserted during the assertion of RSTn. Thereafter, it can be left in either state. TEST_ON I-PD Test mode pin. Tie low or NC for normal operation. TEST_BCE I-PU Boundary scan compatibility enabled pin. This input aids 1149.6 testing. It must be tied to VDDIO (or NC as there is internal pull up in pad) during normal operation of the device. 0 = JTAG chain includes SerDes registers. SerDes registers are accessible to external JTAG pins. Used during ATE and lab debug of SerDes registers through an external JTAG Controller. 1 = JTAG chain does not include SerDes registers. SerDes register are accessible through the internal register bus for BAR 0 access. TEST_BIDIR_CTL I-PU Test mode pin. Tie high or NC for normal operation. Tsi721 Datasheet Integrated Device Technology Description 21 April 4, 2016 2.9 GPIO Signals Table 7: GPIO Signals Name Pin Type Description GPIO[15:0] IO Asynchronous general purpose I/O. • Each GPIO pin can be configured as a general purpose I/O pin. • Each pin can be configured as either an input or an output • When configured as an output, GPIO[0] is asserted high when BDMA/SMSG/PC2SR/SR2PC has an uncorrectable ECC error or S-RIO MAC has a non-data memory uncorrectable ECC error • When configured as an output, GPIO[1] is asserted high when Tsi721 PCIe port is not in the data link active state • When configured as an output, GPIO[2] is asserted high when Tsi721 has an active interrupt (for more information, see Figure 18 and Figure 19) • When configured as an output, GPIO[15:3] can be programmed through software GPIO[12:0] are used as power-up pins as displayed in Table 8. These signals must remain stable for 4000 REFCLKP/REFCLKN cycles after RSTn is de-asserted. They are ignored after reset. Table 8: GPIO Mapping to Power-up Signals GPIO Pin Name (Primary Function) Power-up Pin Namea (Secondary Function) GPIO[3:0] I2C_SA[3:0] GPIO[4] I2C_DISABLE GPIO[5] I2C_SEL GPIO[6] I2C_MA GPIO[7] SP_SWAP_RX GPIO[8] SP_SWAP_TX GPIO[9] SP_HOST GPIO[10] SP_DEVID GPIO[12:11] CLKSEL[1:0] a. For more information about these signals, see Power-up Signals. Tsi721 Datasheet Integrated Device Technology 22 April 4, 2016 2.10 Power-up Signals Table 9: Power-Up Signals Name Pin Type Description CLKMOD I-PU Clock mode. When high, Tsi721 uses “PCIe common clocked mode.” When low, it uses “PCIe non-common clocked mode.” It is a static signal. CLKSEL[1:0] IO REFCLKP/REFCLKN clock frequency select; PCCLKP/PCCLKN clock frequency select when in PCIe non-common clock mode. • 0b11 = 125 MHz • 0b10 = 100 MHz • 0b01 = 156.25 MHz • Others = Reserved When a 100-MHz clock is used, S-RIO SerDes rates of 1.25/2.5/5 Gbaud are supported. When a 125/156.25-MHz clock is used, S-RIO SerDes rates of 1.25/2.5/3.125/5 Gbaud are supported. When either a 100/125/156.25-MHz clock is used, PCIe SerDes rates of 2.5/5 Gbaud are supported. These power-up signals are multiplexed with GPIO[12:11]. It is a static signal. I2C_DISABLE IO Disable I2C register loading after reset. When asserted, Tsi721 does not attempt to load register values from an EEPROM over the I2C bus. 0 = Enable boot load from EEPROM 1 = Disable boot load from EEPROM This power-up signal is multiplexed with GPIO[4]. It is a static signal. I2C_MA IO I2C multi-byte address mode. If I2C_DISABLE == 0 (that is, download registers from EEPROM) then: 0 = Tsi721 uses 1-byte addressing for EEPROM 1 = Tsi721 uses 2-byte addressing for EEPROM Else I2C_DISABLE == 1 (do not download from EEPROM) • 0 = Tsi721 is boot loaded by the PCIe root complex after reset • 1 = Tsi721 is boot loaded by an external I2C master after reset This power-up signal is multiplexed with GPIO[6]. It is a static signal. I2C_SA[3:0] IO I2C slave address. The values on these pins represent the values for the 7-bit address of the Tsi721 when acting as an I2C slave. These signals, in combination with the I2C_SEL signal, determine the address of the EEPROM to boot from (see I2C_SEL pin description). The values on these pins can be overridden after a reset by writing to the I2C Slave Configuration Register. These power-up signals are multiplexed with GPIO[3:0]. It is a static signal. Tsi721 Datasheet Integrated Device Technology 23 April 4, 2016 Table 9: Power-Up Signals (Continued) Name Pin Type Description I2C_SEL IO I2C pin select. Combined with the I2C_SA[1,0] pins, Tsi721 will determine the lower 2 bits of the 7-bit address of the EEPROM address it boots from. When asserted, the I2C_SA[1:0] pins represent the two LSBs of the 7-bit EEPROM slave address when Tsi721 acts as a I2C master downloading from an EEPROM. The EEPROM slave address is as follows: A6 = 1 A5 = 0 A4 = 1 A3 = 0 A2 = 0 A1 = I2C_SA[1] A0 = I2C_SA[0] When de-asserted, the I2C_SA[1:0] pins are ignored and the lower two bits of the EEPROM address default to 00. The values of the EEPROM address can be overridden by software after initialization. This power-up signal is multiplexed with GPIO[5]. It is a static signal. SP_DEVID IO S-RIO base deviceID control When the SP_HOST pin is high, it configures the reset value of the RapidIO Base deviceID CSR: the LSB of the CSR’s BASE_ID and LAR_BASE_ID fields are set to SP_DEVID, while other bits of these fields are set to 0. When the SP_HOST pin is low and SP_DEVID is high, it configures the reset value of the RapidIO Base deviceID CSR: the CSR’s BASE_ID and LAR_BASE_ID fields are set to all ones. When the SP_HOST pin is low and SP_DEVID is low, it configures the reset value of the RapidIO Base deviceID CSR: the CSR’s BASE_ID field is set to 0xFE and the CSR’s LAR_BASE_ID field are set to 0x00FE. This signal is multiplexed with GPIO[10]. It is a static signal. SP_HOST IO S-RIO host / slave control. This signal sets the reset value of the HOST bit of the RapidIO Port General Control CSR. 0 = Tsi721 is an S-RIO slave. 1 = Tsi721 is an S-RIO host. This signal is multiplexed with GPIO[9]. It is a static signal. SP_SWAP_RX IO S-RIO receive lane swap. This signal sets the reset value of the SWAP_RX[1:0] bits of RapidIO PLM Port Implementation Specific Control Register. 0 = Disable S-RIO port receive lane swap; that is, set the SWAP_RX[1:0] register bits to 0b00. 1 = Enable S-RIO port receive 4x lane swap; that is, set the SWAP_RX[1:0] register bits to 0b10. This signal is multiplexed with GPIO[7]. Tsi721 Datasheet Integrated Device Technology 24 April 4, 2016 Table 9: Power-Up Signals (Continued) Name Pin Type Description SP_SWAP_TX IO S-RIO transmit lane swap. This signal sets the reset value of the SWAP_TX bit of RapidIO PLM Port Implementation Specific Control Register. 0 = Disable S-RIO port transmit lane swap. 1 = Enable S-RIO port transmit lane swap. This signal is multiplexed with GPIO[8]. It is a static signal. SR_BOOT I-PD Boot from S-RIO. It can be asserted high only when I2C_DISABLE is also high. 1 = The Tsi721 S-RIO link can start training immediately after a fundamental reset and Tsi721 automatically sets the SRBOOT_CMPL bit of Device Control Register. 0 = The Tsi721 S-RIO link can start training only after software sets the SRBOOT_CMPL bit. It is a static signal. STRAP_RATE[2:0] I-PU S-RIO link rate. These signals control the reset value of the BAUD_SEL field of the RapidIO Port Control 2 CSR . Note that the BAUD_SEL encoding is different than that of STRAP_RATE. • 0b111 = 5 Gbaud • 0b110 = 2.5 Gbaud • 0b101 = 1.25 Gbaud • 0b010 = 3.125 Gbaud • Others: Reserved It is a static signal. Tsi721 Datasheet Integrated Device Technology 25 April 4, 2016 2.11 Power Supply Signals Table 10: Power Supply Signals Name Pin Type VDD PWR 1.0V core power VDDIO PWR 3.3/2.5V power for LVTTL IO AVDD10 PWR 1.0V PCIe and S-RIO SerDes analog power supply AVDD25 PWR 2.5V PCIe and S-RIO SerDes analog power supply AVTT PWR 1.5V PCIe and S-RIO SerDes transmitter analog voltage VSS GND Shared digital and analog ground PCBIAS IO Reference for the corresponding PCIe SerDes bias currents and PLL calibration circuitry. A 200 Ohm 1% 100ppm/C precision resistor should be connected from this pin to ground and isolated from any source of noise injection. SRBIAS IO Reference for the corresponding S-RIO SerDes bias currents and PLL calibration circuitry. A 200 Ohm 1% 100ppm/C precision resistor should be connected from this pin to ground and isolated from any source of noise injection. Tsi721 Datasheet Integrated Device Technology Description 26 April 4, 2016 3. Electrical Characteristics Topics discussed include the following: • Absolute Maximum Ratings • Recommended Operating Conditions • Power Consumption • Power Supply Sequencing • DC Operating Characteristics • Decoupling Recommendation • AC Timing Specifications 3.1 Absolute Maximum Ratings Table 11: Absolute Maximum Ratingsa Symbol Parameter Minimum Maximum Units VDDIO 3.3/2.5V I/O voltage with respect to VSS -0.5 3.6 V VDD 1.0V core voltage with respect to VSS -0.5 1.10 V AVDD10 1.0V analog voltage with respect to AVSS -0.5 1.10 V AVDD25 2.5V analog voltage with respect to AVSS -0.5 2.75 V AVTT 1.5V analog voltage for SerDes transmitter with respect to AVSS -0.5 2.75 V TBIAS Temperature under bias -40 125 C TSTG Storage temperature -65 150 C TJN Junction temperature - 125 C IOUT (for VDDIO = 3.3/2.5V) DC output current - 30 mA a. Stresses outside the absolute ratings can cause permanent damage to the device and affect its functional performance. Exposure to absolute rating conditions for extended periods can affect reliability. Tsi721 Datasheet Integrated Device Technology 27 April 4, 2016 3.2 Recommended Operating Conditions Table 12: Recommended Operating Conditionsa Symbol Parameter TA Minimum Maximum Units 0 70 C -40 85 C - 110 C Ambient temperature – Commercial Ambient temperature – Industrial TJN Junction temperature VDDIO 3.3V LVTTL I/O supply voltage 3.14 3.47 V 2.5V LVTTL I/O supply voltage 2.4 2.6 V VDD 1.0V Core supply voltage 0.95 1.05 V AVDD10 1.0V SerDes analog supply voltage 0.95 1.05 V AVDD25 2.5V SerDes analog supply voltage 2.25 2.75 V AVTT 1.5V SerDes transmitter analog supply voltage 1.4 1.7 V a. Exposure to conditions outside the recommended operating conditions can affect the operation and/or reliability of the device. 3.3 Power Consumption Table 13 lists the current draw for each supply group for different environmental conditions. Test characteristics were are follows: • RapidIO and PCIe links configured at operated at 5 Gbps in x4 mode • Traffic passed through the Tsi721 with a high incidence of 0/1 toggling • Power measurements are based on worst case fast silicon processing. A “Total Power” reduction in excess of 5% can be expected for nominal/typical silicon. Table 13: Power Consumption VDD AVDD10 AVDD25 AVTT VDDIO Junction Temp (0C) Voltage Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Total Power (W) 125 Max. 1.05 3000 1.05 330 2.75 165 1.70 350 3.47 20 4.61 Typ. 1.00 2722 1.00 281 2.50 153 1.50 335 3.30 18 3.95 Min. 0.95 2458 0.95 242 2.25 144 1.40 320 3.14 17 3.39 Max. 1.05 1110 1.05 214 2.75 161 1.70 350 3.47 20 2.50 Typ. 1.00 1003 1.00 190 2.50 151 1.50 335 3.30 18 2.13 Min. 0.95 909 0.95 170 2.25 142 1.40 320 3.14 17 1.85 25 Tsi721 Datasheet Integrated Device Technology 28 April 4, 2016 Table 13: Power Consumption (Continued) VDD AVDD10 AVDD25 AVTT VDDIO Junction Temp (0C) Voltage Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Voltage (V) Current [mA] Total Power (W) -40 Max. 1.05 829 1.05 192 2.75 159 1.70 350 3.47 20 2.17 Typ. 1.00 765 1.00 175 2.50 149 1.50 335 3.30 18 1.87 Min. 0.95 707 0.95 159 2.25 141 1.40 320 3.14 17 1.64 3.4 Power Supply Sequencing This section contains power-up and power-down supply sequencing for the Tsi721. 3.4.1 Power-Up Sequencing The Tsi721 must have its supplies powered up as follows: 1. VDD and AVDD10 (1.0V) must be powered up together. To achieve this requirement AVDD10 can be supplied from the same regulator as VDD, but must be isolated on the board through a ferrite bead. 2. VDDIO, AVDD25, AVTT, and the 1.0V supplies (VDD and AVDD10) can be powered up in any order. 3. The voltages on any input or I/O pin cannot exceed its corresponding supply voltage during power supply ramp up. 4. The power supply ramp rates must be kept between 10 V/s and 0.5x10E6 V/s to minimize power current spikes during power up. This leads to the ramp times specified in the following table. Table 14: Power Supply Sequencing Ramp Times V/s 3.4.2 V 10 5.00E+05 3.3 330000 us 6.6 us 2.5 250000 us 5 us 1.5 150000 us 3 us 1 100000 us 2 us Power-Down Sequencing The Tsi721 must have its supplies powered down as follows: 1. VDD and AVDD10 (1.0V) must be powered down together. To achieve this requirement AVDD10 can be supplied from the same regulator as VDD, but must be isolated on the board through a ferrite bead. 2. VDDIO, AVDD25, AVTT, and the 1.0V supplies (VDD and AVDD10) can be powered down in any order. Tsi721 Datasheet Integrated Device Technology 29 April 4, 2016 3.5 DC Operating Characteristics The following table lists the DC operating characteristics for 3.3V LVTTL of the Tsi721. Table 15: 3.3V LVTTL DC Operating Characteristics at Recommended Operating Condition of 3.3V Symbol Parameter Minimum Maximum Units VIH LVTTL input high voltage 2.0 3.6 V VIL LVTTL input low voltage -0.3 0.8 V VOH LVTTL output high voltage 2.4 - V VOL LVTTL output low voltage - 0.4 V R pull-up Resistor pull-up 26K 64K Ohm R pull-down Resistor pull-down 29K 79K Ohm CPAD LVTTL pad capacitance - 4 pF The following table lists the DC operating characteristics for 2.5V LVTTL of the Tsi721. Table 16: 2.5V LVTTL DC Operating Characteristics at Recommended Operating Condition of 2.5V Symbol Parameter Minimum Maximum Units VIH LVTTL input high voltage 1.7 3.6 V VIL LVTTL input low voltage -0.3 0.7 V VOH LVTTL output high voltage 1.7 - V VOL LVTTL output low voltage - 0.7 V R pull-up Resistor pull-up 33K 93K Ohm R pull-down Resistor pull-down 34K 108K Ohm CPAD LVTTL pad capacitance - 4 pF Tsi721 Datasheet Integrated Device Technology 30 April 4, 2016 3.6 Decoupling Recommendation Table 17 provides the recommended decoupling for the Tsi721. Use low ESR, low lead inductance ceramic capacitors with X7R or X5R rating. Table 17: Decoupling Recommendation 3.7 Rail Decoupling VDDIO 5x 0.1uF and 1x 10uF AVTT 5x 0.1uF and 1x 10uF VDD 5x 0.1uF and 1x 10uF AVDD10 5x 0.1uF and 1x 10uF AVDD25 5x 0.1uF and 1x10uF AC Timing Specifications This section describes the AC timing specifications and electrical characteristics for the Tsi721. 3.7.1 PCIe Differential Receiver Specifications Table 18 lists the electrical characteristics for the PCIe differential receivers in the Tsi721. Parameters are defined separately for 2.5 Gbps and 5.0 Gbps implementations. Table 18 is duplicated from the PCI Express Base Specification (Rev. 2.1) Section 4.3.3.4 Table 4-12 on page 270. Table 18: PCIe Differential Receiver Specifications 2.5 Gbps Symbol Parameter 5.0 Gbps Min. Max. Min. Max. Unit Notes UI Unit interval 399.88 400.12 199.94 200.06 ps UI does not account for SSC caused variations VRX-DIFF-PP-CC Differential Rx peak-peak voltage 0.175 1.2 0.120 1.2 V See section 4.3.7.2.2 of the PCI Express Base Specification (Rev. 2.1) VRX-DIFF-PP-DC Differential Rx peak-peak voltage for data clocked Rx architecture 0.175 1.2 0.100 1.2 V See section 4.3.7.2.2 of the PCI Express Base Specification (Rev. 2.1) TRX-EYE Receiver eye time opening 0.40 - N/A - UI Minimum eye time at Rx pins to produce a 10-12 BER. See Note 1. TRX-TJ-CC Maximum Rx inherent timing error N/A - - 0.40 UI Maximum Rx inherent total timing error for common Refclk Rx architecture. See Note 2. TRX-TJ-DC Maximum Rx inherent timing error N/A - - 0.34 UI Maximum Rx inherent total timing error for data clocked Rx architecture. See Note 2. Tsi721 Datasheet Integrated Device Technology 31 April 4, 2016 Table 18: PCIe Differential Receiver Specifications (Continued) 2.5 Gbps Symbol 5.0 Gbps Parameter Min. Max. Min. Max. Unit TRX-DJ-DD-CC Maximum Rx inherent deterministic timing error N/A - - 0.30 UI Maximum Rx inherent deterministic timing error for common Refclk Rx architecture. See Note 2. TRX-DJ-DD-DC Maximum Rx inherent deterministic timing error N/A - - 0.24 UI Maximum Rx inherent deterministic timing error for data clocked Rx architecture. See Note 2. - 0.3 Not specified UI Only specified for 2.5 Gbps Not specified 0.6 - UI Measured to account for worst Tj at 10-12 BER. See Figure 4-29 of PCI Express Base Specification (Rev. 2.1) Not specified - 5 -- Rx eye must simultaneously meet VRX-EYE limits. TRX-EYE-MEDIAN Maximum time delta between median and -to-MAX-JITTER deviation from median TRX-MIN-PULSE Minimum width pulse at Rx VRX-MAX-MIN-RA Minimum/Maximum pulse voltage on consecutive UI TIO - 22 - 16 MHz Second order PLL jitter transfer bounding function. See Note 3. BWRX-PLL-LO-3D Minimum Rx PLL BW for 3 dB peaking B 1.5 - 8 - MHz Second order PLL jitter transfer bounding function. See Note 3. BWRX-PLL-LO-1D Minimum Rx PLL BW for 1dB peaking B Not specified 5 - MHz Second order PLL jitter transfer bounding function. See Note 3. PKGRX-PLL1 Rx PLL peaking with 8Mhz minimum BW Not specified 3.0 - dB Second order PLL jitter transfer bounding function. See Note 3. PKGRX-PLL2 Rx PLL peaking with 5MHz minimum BW Not specified 1.0 - dB Second order PLL jitter transfer bounding function. See Note 3. RLRX-DIFF Rx package plus Si differential return loss 10 - 10 for 0.05-1.25 GHz 8 for 1.25-2.5 GHz - dB See Figure 4-39 of PCI Express Base Specification (Rev. 2.1) and Note 4. RLRX-CM Common mode Rx return loss 6 - 6 (min.) - dB See Figure 4-39 of PCI Express Base Specification (Rev. 2.1) and Note 4. ZRX-DC Receiver DC common mode impedance 40 60 40 60 W DC impedance limits are needed to guarantee Receiver detect. See Note 5. ZRX-DIFF-DC DC differential impedance 80 120 Not specified W For 5.0 Gbps covered under RLRX-DIFF parameter. See Note 5. VRX-CM-AC-P Rx AC common mode voltage - 150 mVP Measured at Rx pins into a pair of 50 termination into ground. See Note 6. BWRX-PLL-HI Maximum Rx PLL bandwidth Notes Tsi721 Datasheet Integrated Device Technology - 32 150 April 4, 2016 Table 18: PCIe Differential Receiver Specifications (Continued) 2.5 Gbps 5.0 Gbps Symbol Parameter Min. Max. Min. Max. Unit Notes ZRX-HIGH-IMP-D DC input CM input impedance for V>0 during reset or power down 50 k - 50 k - W Rx DC CM impedance with the Rx terminations not powered, measured over the range 0 - 200 mV with respect to ground. See Note 7. DC input CM input impedance for V= 8MHz, then up to 3.0 dB of peaking is permitted. If the PLL’s minimum BW is relaxed to >= 5.0 MHz, then a tighter peaking value of 1.0 dB must be met. Note: A PLL BW extends from zero up to the value(s) defined as the minimum or maximum in the table. For 2.5 Gbps a single PLL bandwidth and peaking value of 1.5-22 MHz and 3.0 dB are defined. 4. Measurements must be made for both common mode and differential return loss. In both cases the DUT must be powered up and DC isolated, and its D+/D- inputs must be in the low-Z state. 5. The Rx DC Common Mode Impedance must be present when the Receiver terminations are first enabled to ensure that the Receiver Detect occurs properly. Compensation of this impedance can start immediately and the Rx Common Mode Impedance (constrained by RLRX-CM to 50 W +/-20%) must be within the specified range by the time Detect is entered. 6. Common mode peak voltage is defined by the expression: maximum{|(Vd+ - Vd-) - VCMDC|}. Tsi721 Datasheet Integrated Device Technology 33 April 4, 2016 7. ZRX-HIGH-IMP-DC-NEG and ZRX-HIGH-IMP-DC-POS are defined respectively for negative and positive voltages at the input of the Receiver. Transmitter designers need to comprehend the large difference between >0 and 1.5 MHz Not specified - 0.15 UI Deterministic jitter only. See Notes 2 and 10. TTX-LF-RMS TX RMS jitter < 1.5 MHz Not specified 3.0 - ps RMS Total energy measured over a 10 kHz 1.5 MHz range TTX-RISE-FALL Transmitter rise and fall time 0.15 - UI Measured differentially from 20% to 80% of swing. See Note 2 and Figure 4-28 of PCI Express Base Specification (Rev. 2.1) TRF-MISMATCH Tx rise/fall mismatch - 0.1 UI Measured from 20% to 80% differentially. See Note 2. BWTX-PLL Maximum Tx PLL bandwidth 0.125 - Not specified - 22 - 16 MHz Second order PLL jitter transfer bounding function. See Note 6. BWTX-PLL-LO-3DB Minimum Tx PLL BW for 1.5 - 8 - MHz Second order PLL jitter transfer bounding function. See Notes 6 and 8. BWTX-PLL-LO-1DB Minimum Tx PLL BW for Not specified 5 - MHz Second order PLL jitter transfer bounding function. See Notes 6 and 8. PKGTX-PLL1 Tx PLL peaking with 8 MHz BW Not specified - 3.0 dB See Note 8. PKGTX-PLL2 Tx PLL peaking with 5 MHz BW Not specified - 1.0 dB See Note 8. RLTX-DIFF Tx package plus Si differential return loss 10 - 10 for 0.05-1.25 GHz 8 for 1.25-2.5 GHz - dB For more information, refer to Figure 4-34 of PCI Express Base Specification (Rev. 2.1) RLTX-CM Tx package plus Si common mode return loss 6 - 6 - dB Measured over 0.05 - 1.25 GHz range for 2.5 Gbps and 0.05 - 2.5 GHz range for 5.0 Gbps (S11 parameter) ZTX-DIFF-DC DC differential Tx impedance 80 120 - 120 W Low impedance defined during signaling. Parameter is captured for 5.0 GHz by RLTX-DIFF. VTX-CM-AC-PP Tx AC common mode voltage (5.0 Gbps) Not specified - 100 mV See Note 5. VTX-CM-AC-P TX AC common mode voltage (2.5 Gbps) 20 Not specified mV See Note 5. 3dB peaking 1dB peaking Tsi721 Datasheet Integrated Device Technology - 35 April 4, 2016 Table 19: PCIe Differential Transmitter Specifications (Continued) 2.5 Gbps Symbol Parameter 5.0 Gbps Min. Max. Min. Max. Unit Notes ITX-SHORT Transmitter short-circuit current limit - 90 - 90 mA The total current transmitter can supply when shorted to ground. VTX-DC-CM Transmitter DC common-mode voltage 0 3.6 0 3.6 V The allowed DC common-mode voltage at the Transmitter pins under any condition. VTX-CM-DC-ATIV Absolute delta of DC common-mode voltage during L0 and Electrical Idle 0 100 0 100 mV |VTX-CM-DC[during L0] VTX-CM-Idle-DC[during Electrical Idle]| = 5.0 MHz, then a tighter peaking value of 1.0 dB must be met. In both cases, the maximum PLL BW is 16 MHz. 9. Low swing output, defined by VTX-DIFF-PP-LOW must be implemented as displayed in Figure 4-27 of the PCI Express Base Specification (Rev. 2.1) with no de-emphasis. 10.For 5.0 Gbps, de-emphasis timing jitter must be removed. An additional HPF function must be applied as displayed in Figure 4-21 of PCI Express Base Specification (Rev. 2.1). This parameter is measured by accumulating a record of 106 UI while the DUT outputs a compliance pattern. TMIN-PULSE is defined to be nominally 1 UI wide and is bordered on both sides by pulses of the opposite polarity. Refer to Figure 4-29 of PCI Express Base Specification (Rev. 2.1). 11. Root complex Tx de-emphasis is configured from Upstream controller. Downstream Tx de-emphasis is set through a command, issues at 2.5 Gbps. For information, refer to the appropriate location in Section 4.2 of PCI Express Base Specification (Rev. 2.1). 3.7.3 RapidIO SerDes Characteristics 3.7.3.1 Overview The Tsi721’s SerDes are in full compliance to the RapidIO AC specifications for the LP-Serial physical layer [5]. This section provides those specifications for reference only; the user should see the specification for complete requirements. Chapter 9 of the specification, “1.25 Gbaud, 2.5 Gbaud, and 3.125 Gbaud LP-Serial Links” defines Level I links compatible with the 1.3 version of the Physical Layer Specification, that supports throughput rates of 1.25, 2.5, and 3.125 Gbps. Chapter 10 of the specification, “5 Gbaud and 6.25 Gbaud LP-Serial Links” defines Level II links that support throughput rates of 5 and 6.25 Gbps. A Level I link should: • Allow 1.25, 2.5, or 3.125 Gbps rates • Support AC coupling • Support hot plug • Support short run (SR) and long run (LR) links achieved with two transmitters • Support single receiver specification that will accept signals from both the short run and long run transmitter specifications • Achieve Bit Error Ratio of lower than 10-12 per lane A Level II link should: • Allow 5 Gbps baud rates • Support AC coupling and optional DC coupling • Support hot plug • Support short run (SR), and medium run (MR) links achieved with two transmitters and two receivers • Achieve Bit Error Ratio of lower than 10-15 per lane but test requirements will be verified to 10-12 per lane Together, these specifications allow for solutions ranging from simple chip-to-chip interconnect to board-to-board interconnect driving two connectors across a backplane. The faster and wider electrical interfaces specified here are required to provide higher density and/or lower cost interfaces. The short run defines a transmitter and a receiver that should be used mainly for chip-to-chip connections on either the same printed circuit board or across a single connector. This covers the case where connections are made to a mezzanine (daughter) card. The smaller swings of the short run specification reduces the overall power used by the transceivers. Tsi721 Datasheet Integrated Device Technology 38 April 4, 2016 The Level I long run defines a transmitter and receiver that use larger voltage swings and channel equalization that allows a user to drive signals across two connectors and backplanes. The two transmitter specifications allows for a medium run specification that also uses larger voltage swings that can drive signals across a backplane but simplifies the receiver requirements to minimize power and complexity. This option has been included to allow the system integrator to deploy links that take advantage of either channel materials and/or construction techniques that reduce channel loss to achieve lower power systems. All unit intervals are specified with a tolerance of ±100 ppm. The worst case frequency difference between any transmit and receive clock is 200 ppm. The electrical specifications are based on loss, jitter, and channel cross-talk budgets and defines the characteristics required to communicate between a transmitter and a receiver using nominally 100 Ohm differential copper signal traces on a printed circuit board. Rather than specifying materials, channel components, or configurations, this specification focuses on effective channel characteristics. Therefore, a short length of poorer material should be equivalent to a longer length of premium material. A 'length' is effectively defined in terms of its attenuation rather than physical distance. 3.7.3.2 Definition of Amplitude and Swing LP-Serial links use differential signaling. This section defines the terms used in the description and specification of these differential signals. Figure 6 shows how these signals are defined and sets out the relationship between absolute and differential voltage amplitude. The figure shows waveforms for either the transmitter output (TD and TD_N) or a receiver input (RD and RD_N). Figure 6: S-RIO Definition of Transmitter Amplitude and Swing Tsi721 Datasheet Integrated Device Technology 39 April 4, 2016 Each signal swings between the voltages VHIGH and VLOW where: VHIGH > VLOW The differential voltage, VDIFF is defined as: VDIFF = VD+ - VDwhere VD+ is the voltage on the positive conductor and VD- is the voltage on the negative conductor of a differential transmission line. VDIFF represents either the differential output signal of the transmitter, VOD, or the differential input signal of the receiver, VID where: VOD = VTD - VTD and VID = VRD - VRD The common mode voltage, VCM, is defined as the average or mean voltage present on the same differential pair. Therefore: VCM = | VD+ + VD- | / 2 The maximum value, or the peak-to-peak differential voltage, is calculated on a per unit interval and is defined as: VDIFFp-p = 2 x max | VD+ - VD- | because the differential signal ranges from VD+ - VD- to -(VD+ - VD-) To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic) transmitter and each of its outputs, TD and TD_N, has a swing that goes between VHIGH = 2.5V and VLOW = 2.0V, inclusive. Using these values the common mode voltage is calculated to be 2.25 V and the single-ended peak voltage swing of the signals TD and TD_N is 500 mVpp. The differential output signal ranges between 500 mV and -500 mV, inclusive. therefore the peak-to-peak differential voltage is 1000 mVppd. Tsi721 Datasheet Integrated Device Technology 40 April 4, 2016 3.7.3.3 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps LP-Serial Links This section explains the requirements for Level I RapidIO LP-Serial short and long run electrical interfaces of nominal baud rates of 1.25, 2.5, and 3.125 Gbps using NRZ coding (thus, 1 bit per symbol at the electrical level). The Tsi721’s SerDes meet all of the requirements listed below. The electrical interface is based on a high speed, low voltage logic with a nominal differential impedance of 100 Ohm. Connections are point-to-point balanced differential pair and signaling is unidirectional. The level of links defined in this section are identical to those defined in the RapidIO Interconnect Specification (Revision 2.1), 1x/4x LP-Serial Electrical Specification. 3.7.3.4 Equalization With the use of high speed serial links, the interconnect media will cause degradation of the signal at the receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification. To negate a portion of these effects, equalization can be used in the transmitter and/or receiver, but it is not required at baud rates less than 3.125 Gbps. 3.7.3.5 Explanatory Note on Level I Transmitter and Receiver Specifications AC electrical specifications are provided for the transmitter and receiver. Long run and short run interfaces at three baud rates are described. The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified in Clause 47 of IEEE 802.3ae-2002.[1] The goal of this standard is that electrical designs for Level I electrical designs can reuse XAUI, suitably modified for applications at the baud intervals and runs described herein. 3.7.3.6 Level I Electrical Specification 3.7.3.6.1 Level I Transmitter Characteristics Level I LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section. The differential return loss, S11, of the transmitter in each case must be better than: • -10 dB for (Baud Frequency) / 10 < Freq(f) < 625 MHz, and • -10 dB + 10log(f/625 MHz) dB for 625 MHz 4 SMO - - - 2UI + 1000 ps UI - 80 - 800 ps Unit Interval 1. For all Load Types: R_Rdin = 100 Ohm +/- 20 Ohm. 2. Load Type 0 with min. T_Vdiff, AC-coupling or floating load. 3. It is suggested that T_SCC22 be -6 dB to be compatible with Level II transmitter requirements. 4. It is suggested that T_Ncm be limited to 5% of T_Vdiff to be compatible with Level II transmitter requirements. For each baud rate at which the LP-Serial transmitter is specified to operate, the output eye pattern of the transmitter falls entirely within the unshaded portion of the Transmitter Output Compliance Mask displayed in Figure 7 when measured at the output pins of the device and the device is driving a 100 Ohm + 5% differential resistive load. The specification allows the output eye pattern of a LP-Serial transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol interference) to only comply with the Transmitter Output Compliance Mask when pre-emphasis is disabled or minimized. Tsi721 Datasheet Integrated Device Technology 43 April 4, 2016 Figure 7: S-RIO Transition Symbol Transmit Eye Mask Table 22: Level I Near-End (Tx) Template Intervals Symbol Near-End SR Value Near-End LR Value Units Eye mask T_X1 0.17 0.17 UI Eye mask T_X2 0.39 0.39 UI Eye mask T_Y1 250 400 mV Eye mask T_Y2 500 800 mV Eye mask T_Y3 N/A N/A mV T_UBHPJ 0.17 0.17 UIpp T_DCD 0.05 0.05 UIpp T_TJ 0.35 0.35 UIpp Characteristic Uncorrelated bounded high probability jitter Duty cycle distortion Total jitter Tsi721 Datasheet Integrated Device Technology 44 April 4, 2016 3.7.4.0.1 Level I Receiver Specifications Level I LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section. Table 23: Level I Receiver Electrical Input Specifications Characteristic Symbol Reference Minimum Typical Maximum Units R_Baud - - 1.250 - Gbps Rx baud rate (2.5 Gbps) - - 2.500 - Gbps Rx baud rate (3.125 Gbps) - - 3.125 - Gbps Rx baud rate (1.25 Gbps) Absolute input voltage R_Vin Section 9.4.3.4 - - - - Input differential voltage R_Vdiff Section 9.4.3.3 200 - 1600 mVppd Differential resistance R_Rdin Section 9.4.3.7 80 100 120 Ohm R_SDD11 Section 9.4.3.7 - - - dB - - - - - - - dB Differential input return loss (100 MHz < f < R_Baud/2) Differential input return loss (R_Baud/2 < f < R_Baud) Common mode input return loss (625 MHz < f < T_baud) Termination voltage1,2 Input common mode voltage1,2 Wander divider R_SCC11 Section 9.4.3.7 R_Vtt R_Vtt floating4 R_Vrcm R_Vtt floating3,4 -0.05 - 1.85 V n - - 10 - - Not specified V 1. Input common mode voltage for AC-coupled or floating load input with min. T_Vdiff. 2. Receiver is required to implement at least one of the specified nominal R_Vtt values, and usually implements only one of these values. Receiver is only required to meet R_Vrcm parameter values that correspond to R_Vtt values supported. 3. Input common mode voltage for AC-coupled or floating load input with min. T_Vdiff. 4. For floating load, input resistance must be > 1K Ohm. Tsi721 Datasheet Integrated Device Technology 45 April 4, 2016 Table 24: Level I Receiver Input Jitter Tolerance Specifications Characteristic Symbol Reference Minimum Typical Maximum Units BER - - - 10-12 - R_BHPJ Section 9.4.3.8 - - 0.37 UIpp R_SJ-max Section 9.4.3.8 - - 8.5 UIpp R_SJ-hf Section 9.4.3.8 - - 0.1 UIpp Total Jitter (Does not include sinusoidal jitter) R_TJ Section 9.4.3.8 - - 0.55 UIpp Total jitter tolerance1 R_JT - - - 0.65 UIpp Eye mask R_X1 Section 9.4.3.8 - - 0.275 UI Eye mask R_Y1 Section 9.4.3.8 - - 100 mV Eye mask R_Y2 Section 9.4.3.8 - - 800 mV Bit error ratio Bounded high probability jitter Sinusoidal jitter, maximum Sinusoidal jitter, high frequency 1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The sinusoidal jitter can have any amplitude and frequency in the unshaded region of the following figure. The sinusoidal jitter component is included to ensure margin for the low frequency jitter, wander, noise, crosstalk and other variable system effects. Figure 8: S-RIO Single Frequency Sinusoidal Jitter Limits Tsi721 Datasheet Integrated Device Technology 46 April 4, 2016 3.7.4.0.2 Level I Receiver Eye Diagram For each baud rate at which the a LP-Serial receiver is specified to operate, the receiver meets the corresponding Bit Error Ratio specification in Table 25 when the eye pattern of the receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the Receiver Input Compliance Mask displayed in Figure 9. The eye pattern of the receiver test signal is measured at the input pins of the receiving device with the device replaced with a 100 Ohm + 5% differential resistive load. Figure 9: S-RIO Level I Receiver Input Mask Table 25: Level I Far-End (Rx) Template Intervals Symbol Far-End Value Units Eye mask R_X1 0.275 UI Eye mask R_Y1 100 mV Eye mask R_Y2 800 mV High probability jitter R_HPJ 0.37 UIpp R_TJ 0.55 UIpp Characteristic Total Jitter (Does not include sinusoidal jitter) 3.7.4.1 5 Gbps LP-Serial Links This chapter describes the requirements for Level II RapidIO LP-Serial short and medium electrical interfaces of nominal baud rates of 5.0. Gbps using NRZ coding (thus, 1 bit per symbol at the electrical level). A compliant device must meet all of the requirements listed below. The electrical interface is based on a high speed low voltage logic with a nominal differential impedance of 100 Ohm. Connections are point-to-point balanced differential pair and signaling is unidirectional. Tsi721 Datasheet Integrated Device Technology 47 April 4, 2016 3.7.4.2 Explanatory Note on Level II Transmitter and Receiver Specifications AC electrical specifications are provided for transmitters and receivers. The parameters for the AC electrical specifications are guided by the OIF CEI Electrical and Jitter Inter-operability agreement for CEI-6G-SR and CEI-6G-LR. OIF CEI-6G-SR and CEI-6G-LR have similar application goals to S-RIO, as described in Section 10.1, “Level II Application Goals.” The goal of this standard is that electrical designs for S-RIO can reuse electrical designs for OIF CEI-6G, suitably modified for applications at the baud intervals and runs described herein. 3.7.4.3 Level II Electrical Specifications The electrical interface is based on high speed, low voltage logic with nominal differential impedance of 100 Ohm. Connections are point-to-point balanced differential pair and signaling is unidirectional. 3.7.4.3.1 Level II Transmitter Characteristics Level II LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section. The differential return loss must be better than A0 from f0 to f1 and better than A0 + Slope*log10(f/f1) Where f is the frequency from f1 to f2 (see section 8.5.11, Figure 8-12 of the RapidIO Specification (Rev. 2.1). Differential return loss is measured at compliance points T and R. If AC coupling is used, then all components (internal or external) are to be included in this requirement. The reference impedance for the differential return loss measurements is 100 Ohm. Common mode return loss measurement must be better than -6dB between a minimum frequency of 100 MHz and a maximum frequency of 0.75 times the baud rate. The reference impedance for the common mode return loss is 25 Ohm. The Tsi721 satisfies the specification requirement that the 20%-80% rise/fall time of the transmitter, as measured at the transmitter output, in each case has a minimum value 30 ps. Similarly, the timing skew at the output of an LP-Serial transmitter between the two signals that comprise a differential pair does not exceed 10 ps at 5.0. Tsi721 Datasheet Integrated Device Technology 48 April 4, 2016 3.7.4.3.2 Level II Short Run Transmitter Specifications Table 26: Level II Short Run Transmitter Output Electrical Specifications Characteristic Symbol Reference Minimum Typical Maximum Units T_Baud Section 10.3.2.1.2 5.00 -0.01% 5.00 5.00 +0.01% Gbps VO Section 10.3.2.1.3 -0.40 - 2.30 Volts Output differential voltage (into floating load Rload = 100 Ohm) T_Vdiff Section 10.3.2.1.3 400 - 750 mVppd Differential resistance T_Rd Section 10.3.2.1.6 80 100 120 Ohm Recommended output rise and fall times (20% to 80%) T_tr, T_tf Section 10.3.2.1.4 30 - - ps Differential output return loss (100 MHz to 0.5 *T_Baud) T_SDD22 Section 10.3.2.1.6 - - -8 dB - - - dB Baud rate (5 Gbps) Absolute output voltage Differential output return loss (0.5*T_Baud to T_Baud) Common mode return loss (100 MHz to 0.75 *T_Baud) T_TCC22 Section 10.3.2.1.6 - - -6 dB Transmitter common mode noise T_Ncm - - - 5% of T_Vdiff mVppd Output common mode voltage T_Vcm Load Type 01,2,3,4 Section 8.5.3 0.0 - 1.8 V Load Type 11,3,4,6 Section 8.5.3 735 - 1135 mV Load Type 21,3,4 Section 8.5.3 550 - 1060 mV Load Type 31,3,4,5 Section 8.5.3 490 - 850 mV 1. For all Load Types: R_Rdin = 100 Ohm + 20 Ohm. For Vcm definition, see Figure 6. Tsi721 Datasheet Integrated Device Technology 49 April 4, 2016 2. Load Type 0 with min T_Vdiff, AC-Coupling or floating load. 3. For load Type 1 through 3: R_Zvtt < 30 Ohm; Vtt is defined for each load type as follows: Load Type 1 R_Vtt = 1.2V +5% / 8%; Load Type 2 R_Vtt = 1.0V +5% / -8%; Load Type 3 R_Vtt = 0.8V +5% / -8%. 4. DC Coupling compliance is optional (Type 1 through 3). Only Transmitters that support DC coupling are required to meet this parameter. It is acceptable for a transmitter to restrict the range of T_Vdiff in order to comply with the specified T_Vcm range. For a transmitter which supports multiple T_Vdiff levels, it is acceptable for a transmitter to claim DC Coupling Compliance if it meets the T_Vcm ranges for at least one of its T_Vdiff setting as long as those setting(s) that are compliant are indicated. 5. Simple CML transmitters designed using VDD > 1.2V can still claim DC compliance if this parameter is not met. 6. Simple CML transmitters designed using VDD < 0.8V can still claim DC compliance if this parameter is not met. 1. The transmitter must be able to produce a minimum T_Vdiff greater than or equal to 800mVppd. In applications where the channel is better than the worst case allowed, a Transmitter device can be provisioned to produce T_Vdiff less than this minimum value, but greater than or equal to 400mVppd, and is still compliant with this specification. 2. Load Type 0 with min T_Vdiff, AC-Coupling or floating load. 3. For load Type 1: R_Zvtt < 30 Ohm; T_Vtt and R_Vtt = 1.2V +5% / - 8%. 4. DC coupling compliance is optional (Load Type 1). Only Transmitters that support DC coupling are required to meet this parameter. 3.7.4.3.3 Level II Medium Transmitter Specifications Table 27: Level II Medium Run Transmitter Output Electrical Specifications Characteristic Symbol Reference Minimum Typical Maximum Units T_Baud Section 10.4.2.1.2 5.00 -0.01% 5.00 5.00 +0.01% Gbps VO Section 10.4.2.1.3 -0.40 - 2.30 Volts Output differential voltage (into floating load Rload = 100 Ohm) T_Vdiff Section 104.2.1.31 800 - 1200 mVppd Differential resistance T_Rd Section 10.4.2.1.6 80 100 120 Ohm Recommended output rise and fall times (20% to 80%) T_tr, T_tf Section 10.4.2.1.4 30 - - ps Differential output return loss (100 MHz to 0.5 *T_Baud) T_SDD22 Section 10.4.2.1.6 - - -8 dB - - - dB Baud rate (5 Gbps) Absolute output voltage Differential output return loss (0.5*T_Baud to T_Baud) Common mode return loss (100 MHz to 0.75 *T_Baud) Transmitter common mode noise Tsi721 Datasheet Integrated Device Technology T_TCC22 Section 10.4.2.1.6 - - -6 dB T_Ncm - - - 5% of T_Vdiff mVppd 50 April 4, 2016 Table 27: Level II Medium Run Transmitter Output Electrical Specifications (Continued) Characteristic Output common mode voltage Symbol Reference Minimum Typical Maximum Units T_Vcm Load Type 02 Section 8.5.3 100 - 1700 mV Load Type 13,4 Section 8.5.3 630 - 1100 mV 1. The transmitter must be able to produce a minimum T_Vdiff greater than or equal to 800mVppd. In applications where the channel is better than the worst case allowed, a Transmitter device can be provisioned to produce T_Vdiff less than this minimum value, but greater than or equal to 400mVppd, and is still compliant with this specification. 2. Load Type 0 with min T_Vdiff, AC-Coupling or floating load. 3. For load Type 1: R_Zvtt < 30 Ohm; T_Vtt and R_Vtt = 1.2V +5% / - 8%. 4. DC coupling compliance is optional (Load Type 1). Only Transmitters that support DC coupling are required to meet this parameter. For 5 Gbps links, the Transmitters eye mask will also be evaluated during the steady-state where there are no symbol transitions – for example, a 1 followed by a 1 or a 0 followed by a 0 – and the signal has been de-emphasized. This additional transmitter eye mask constraint is displayed in the following figure. Figure 10: Transition and Steady State Symbol Eye Mask Tsi721 Datasheet Integrated Device Technology 51 April 4, 2016 During the steady-state, the eye mask prevents the transmitter from de-emphasizing the low frequency content of the data too much and limiting the available signal-to-noise at the receiver. The de-emphasis introduces a jitter artifact that is not accounted for in this eye mask. This additional jitter is caused by the finite rise/fall time of the transmitter and the non-uniform voltage swing between the transitions. This additional deterministic jitter must be accounted for as part of the high probability jitter and is specified in the following table. Table 28: Level II Medium Run Near-End (Tx) Template Intervals Characteristic Symbol Near-End MRValue Comments Units Eye mask T_X1 0.15 - UI Eye mask T_X2 0.40 - UI Eye mask T_Y1 200 For connection to short run Rx mV 400 For connection to long run Rx 375 For connection to short run Rx 600 For connection to long run Rx T_Y3 N/A - mV T_UBHPJ 0.15 - UIpp T_DCD 0.05 - UIpp T_TJ 0.30 - UIpp Eye mask Eye mask Uncorrelated bounded high probability jitter Duty cycle distortion Total jitter Tsi721 Datasheet Integrated Device Technology T_Y2 52 mV April 4, 2016 3.7.4.3.4 Level II Short Run Receiver Specifications Table 29: Level II Short Run Receiver Electrical Input Specifications Characteristic Symbol Reference Minimal Typical Maximum Units Rx baud rate (5 Gbps) R_Baud Section 10.3.2.2.1 5.00 -0.01% 5.00 5.00 +0.01% Gbps Absolute input voltage R_Vin Section 10.3.2.2.3 - - - - Input differential voltage R_Vdiff Section 10.3.2.2.3 125 - 750 mVppd Differential resistance R_Rdin Section 10.3.2.2.7 80 100 120 Ohm Bias voltage source impedance1 (load types 1 to 3) R_Zvtt - - - 30 Ohm Differential input return loss (100 MHz to 0.5*R_Baud) R_SDD11 Section 10.3.2.2.7 - - -8 dB Differential input return loss (0.5*R_Baud to R_Baud) - - - - - - R_SCC11 Section 10.3.2.2.7 - - -6 dB R_Vtt R_Vtt floating4 Common mode input return loss (100 MHz to 0.5*R_Baud) Termination voltage1,2 Tsi721 Datasheet Integrated Device Technology 53 Not specified V R_Vtt = 1.2V Nominal 1.2 -8% - 1.2 +5% R_Vtt = 1.0V Nominal 1.0 -8% - 1.0 +5% R_Vtt = 0.8V Nominal 0.8 -8% - 0.8 +5% April 4, 2016 Table 29: Level II Short Run Receiver Electrical Input Specifications (Continued) Characteristic Input common mode voltage1,2 Wander divider Symbol Reference Minimal Typical Maximum Units R_Vrcm R_Vtt floating3,4 -0.05 - 1.85 V R_Vtt = 1.2V Nominal 720 R_Vtt - 10 mV R_Vtt = 1.0V Nominal 535 R_Vtt + 125 mV R_Vtt =0.8V Nominal 475 R_Vtt + 105 mV Section 8.4.5, 8.4.6 - - - n 10 1. DC Coupling compliance is optional. For Vcm definition, see Figure 6. 2. Receiver is required to implement at least one of the specified nominal R_Vtt values, and usually implements only one of these values. Receiver is only required to meet R_Vrcm parameter values that correspond to R_Vtt values supported. 3. Input common mode voltage for AC-coupled or floating load input with min. T_Vdiff. 4. For floating load, input resistance must be > 1K Ohm. Tsi721 Datasheet Integrated Device Technology 54 April 4, 2016 3.7.4.3.5 Level II Medium Run Receiver Specifications Table 30: Level II MR Receiver Electrical Input Specifications Characteristic Symbol Reference Minimum Typical Maximum Units Rx baud rate (5 Gbps) R_Baud Section 10.5.2.2.1 5.00 -0.01% 5.00 5.00 +0.01% Gbps Absolute input voltage R_Vin Section 10.5.2.2.3 - - - - Input differential voltage R_Vdiff Section 10.5.2.2.3 - - 1200 mVppd Differential resistance R_Rdin Section 10.5.2.2.7 80 100 120 Ohm Bias voltage source impedance (load type 1)1 R_Zvtt - - - 30 Ohm R_SDD11 Section 10.5.2.2.7 - - -8 dB - - - - Differential input return loss (100MHz to 0.5*R_Baud) Differential input return loss (0.5*R_Baud to R_Baud) Common mode input return loss (100MHz to 0.5*R_Baud) R_SCC11 Section 10.5.2.2.7 - - -6 dB Input common mode voltage1,2 R_Vfcm Load Type 02 0 - 1800 mV Load Type 11,3 595 - R_Vtt - 60 mV Section 8.4.5, 8.4.6 - 10 - - Wander divider n 1. DC coupling compliance is optional (Load Type 1). Only receivers that support DC coupling are required to meet this parameter. 2. Load Type 0 with min T_Vdiff, AC-Coupling or floating load. For floating load, input resistance must be > 1K Ohm. 3. For Load Type 1: T_Vtt and R_Vtt = 1.2V +5% / -8%. Tsi721 Datasheet Integrated Device Technology 55 April 4, 2016 3.7.4.3.6 Level II Receiver Eye Diagram For a Level II link the receiver mask it is defined as displayed in the following figure. Specific parameter values for both masks are called out in the following table. Figure 11: Level II Receiver Input Compliance Mask Table 31 defines the parameters for receivers that have an open eye at the far-end. The termination conditions used to measure the received eye are defined in the above Level II Receiver Specification tables. Table 31: Level II Far-End (Rx) Template Intervals Symbol Far-End Value Units Eye mask R_X1 0.30 UI Eye mask R_Y1 62.5 mV Eye mask R_Y2 375 mV Uncorrelated bounded high probability jitter R_UBHPJ 0.15 UIpp Correlated bounded high probability jitter R_CBHPJ 0.30 UIpp R_TJ 0.60 UIpp Characteristic Total jitter (Does not include sinusoidal jitter) Tsi721 Datasheet Integrated Device Technology 56 April 4, 2016 3.7.5 Reference Clocks – PCCLKP/N and REFCLKP/N Table 32 lists the PCCLKP/N and REFCLKP/N clock electrical characteristics of the Tsi721. The clock source that drives the PCCLK inputs must meet all requirements for the common clock architecture defined for the reference clock in the PCI Express Base Specification (Rev. 2.1). Table 32: PCCLKP/N and REFCLKP/NClock Electrical Characteristics Symbol Parameter Minimum Typical Maximum Unit VIN_DIFF Differential input voltage (single-ended peak to peak) 0.3 - 1.0 V VDC Input level 0 - 2.5 V VCMa Common-mode input level 0.15 - 2.0 V FREFCLK REFCLK clock frequency 100 - 156.25 MHz SREFCLK REFCLK stability -100 - +100 ppm TJREFCLK REFCLK total phase jitter (1 MHz–20 MHz) - - 1 ps (rms) FPCCLK PCCLK clock frequency 100 - 156.25 MHz SPCCLK PCCLK average frequency accuracy -300 - 300 ppm CCJPCCLK PCCLK cycle-to-cycle jitter - - 150 ps FDUTY Clock duty cycle 40 - 60 % TER-RISE Rising edge rate 0.6 - - V/ns TER-FALL Falling edge rate 0.6 - - V/ns Zinb Clock input impedance - High - Ohm a. Common-mode voltage must be supplied by the clock source circuit. b. Clock termination must be implemented on the circuit board. PCCLKP/N and REFCLKP/N require a terminated, DC biased, differential clock source. This type of reference clock is usually used in PCIe systems but not in S-RIO systems. Different clock technologies can be used with the Tsi721 provided that proper termination is used. The following diagrams provide examples of commonly used clock technologies connected to PCCPLKP/N and REFCLKP/N. Tsi721 Datasheet Integrated Device Technology 57 April 4, 2016 Figure 12: HCSL to REFCLKP/N / PCCLKP/N Clock source Tsi7xx 33 ohms PCCLK/REFCLK HCSL 33 ohms 50 ohms 50 ohms Figure 13: LVDS to REFCLKP/N / PCCLKP/N Clock source Tsi7xx 100 Ohms LVDS PCCLK/REFCLK Figure 14: LVPECL to REFCLKP/N / PCCLKP/N Clock source Tsi7xx 100 Ohms LVPECL 150 ohms Tsi721 Datasheet Integrated Device Technology PCCLK/REFCLK 150 ohms 58 April 4, 2016 Figure 15: LVPECL to REFCLKP/N / PCCLKP/N 3.3V 3.3V 124 ohms 124 ohms Clock source Tsi7xx 0.1uf LVPECL PCCLK/REFCLK 0.1uf 150 ohms 3.7.6 150 ohms 82 ohms 82 ohms JTAG and Test Interface Signal Timings The following table lists the AC specifications for Tsi721’s JTAG and test interface. Table 33: JTAG and Test Interface AC Specifications Symbol Parameter Minimum Maximum Units Notes - TBSF TCK frequency 0 25 MHz TBSCH TCK high time 50 - ns Measured at 1.5V TBSCL TCK low time 50 - ns Measured at 1.5V TBSCR TCK rise time - 25 ns 0.8V to 2.0V TBSCF TCK fall time - 25 ns 2.0V to 0.8V TBSIS1 Input setup to TCK 10 - ns - TBSIH1 Input hold from TCK 10 - ns - TBSOV1 TDO output valid delay from falling edge of TCK.a - 15 ns - TOF1 TDO output float delay from falling edge of TCK - 15 ns - TBSTRST1 TRSTn release before RSTn release - 10 ns TBSTRST2 TRSTn release before TMS or TDI activity 1 - ns TRSTn must become asserted while RSTn is asserted during device power-up - a. Outputs precharged to VDD. Tsi721 Datasheet Integrated Device Technology 59 April 4, 2016 3.7.7 I2C Interface Signal Timings The following table lists the AC specifications for the I2C Interface of the Tsi721. Table 34: I2C Interface AC Specifications Symbol Parameter Minimum Maximum Units Notes - FSCL I2C_SCLK clock frequency 0 100 kHz TLOW I2C_SCLK clock low time 4.7 - us See Notes 1 and 2. THIGH I2C_SCLK clock high time 4.0 - us See Notes 1 and 2. THDDAT Data hold time 0 3.45 us See Note 2. TSUDAT Data setup time 250 - ns See Note 2. TSR Rise time of I2C_SCLK and I2C_SD - 1000 ns See Note 2. TSF Fall time of I2C_SCLK and I2C_SD - 300 ns See Note 2. TBUF Bus free time between STOP and START condition 4.7 - us See Note 2. THDSTA Hold Time (repeated) START condition 4.0 - us See Notes 2 and 3. TSUSTA Setup time for repeated START condition 4.7 - us See Note 2. TSUSTO Setup time for STOP condition 4.0 - us See Note 2. 1. Not tested. 2. See timing diagram displayed in Figure 16. 3. After this period, the first clock pulse is generated. Figure 16: I2C Interface Signal Timings SDA TBUF TLOW TSR TSF THDSTA TSP SCL THDSTA Stop Tsi721 Datasheet Integrated Device Technology THDDAT THIGH TSUDAT TSUSTA Start Repeated Start 60 TSUSTO Stop April 4, 2016 3.7.8 GPIO Interface Signal Timings The following table lists the AC specifications for the GPIO Interface of the Tsi721. Table 35: GPIO Interface AC Specifications Symbol 3.7.9 Parameter Minimum Maximum Units Notes TMIN-HIGH Minimum signal high time 50 - ns - TMIN-LOW Minimum signal low time 50 - ns - RSTn Signal Timings The following table lists the RSTn signal timing for the Tsi721 (see PCIe spec 2.1 section 6.6.1 and CEM 2.0 table 2.6.2). Table 36: RSTn Signal AC Specifications Symbol Parameter Minimum Maximum Tperst When asserted, RSTn must remain asserted at least this long Tfail When power become invalid, RSTn must be asserted within this time Tperst-clk RSTn must remain asserted after any supplied reference clock (REFCLK and PCCLK) is stable Tsi721 Datasheet Integrated Device Technology 61 Units Notes 100 - us - - 500 ns - 100 - us - April 4, 2016 4. Package Specifications Topics discussed include the following: • Package Dimensions • Package Diagrams • Thermal Characteristics • Moisture Sensitivity 4.1 Package Dimensions Table 37: Package Dimensions Specification Description Package type FCBGA Package size 13 x 13 mm Ball pitch 1 mm Ball count 143 Tsi721 Datasheet Integrated Device Technology 62 April 4, 2016 4.2 Package Diagrams Figure 17: Package Diagrams Tsi721 Datasheet Integrated Device Technology 63 April 4, 2016 4.3 Thermal Characteristics Heat generated by the packaged silicon must be removed from the package to ensure the silicon is maintained within its functional and maximum design temperature limits. If heat buildup becomes excessive, the silicon temperature may exceed the temperature limits. A consequence of this is that the silicon may fail to meet the performance specifications and the reliability objectives may be affected. Failure mechanisms and failure rate of a device has an exponential dependence on the silicon operating temperatures. Therefore, the control of the package, and by extension the junction temperature, is essential to ensure product reliability. The Tsi721 is specified safe for operation when the junction temperature is within the recommended limits as displayed in Table 12. Table 38 shows the simulated thermal characteristic (Theta JB and Theta JC) of the Tsi721 package. Table 38: Junction to Ambient Characteristics – Theta JB/JC Interface Results (C/W) Theta JB 8.78 Theta JC 0.11 Table 39 shows the simulated junction to ambient characteristics of the Tsi721. The thermal resistance Theta JA characteristics of a package depends on multiple variables other than just the package. In a typical application, designers must consider various system-level and environmental characteristics, such as: • Package mounting (vertical/horizontal) • System airflow conditions (laminar/turbulent) • Heat sink design and thermal characteristics • Heat sink attachment method • PWB size, layer count, and conductor thickness • Influence of the heat dissipating components assembled on the PWB (neighboring effects) Table 39: Junction to Ambient Characteristics – Theta JA Theta JA (C/W) Device 0 m/s 1 m/s 2 m/s Tsi721 13.1 12.06 11.4 The results in Table 39 are based on a JEDEC Thermal Test Board configuration (JESD51-9), and do not factor in the system-level characteristics described above. As such, these values are for reference only. 4.4 Moisture Sensitivity The moisture sensitivity level (MSL) for the Tsi721 is 4. Tsi721 Datasheet Integrated Device Technology 64 April 4, 2016 5. Ordering Information Part Number Temperature Grade Package Type Pb (Lead) Free Tsi721A1-16GCLY Commercial FCBGA No; RoHS Compliant (5of6) Tsi721A1-16GCLV Commercial FCBGA Yes Tsi721A1-16GIL Industrial FCBGA No; Leaded Balls and Bumps Tsi721A1-16GILH Industrial FCBGA No; Leaded Balls Tsi721A1-16GILY Industrial FCBGA No; RoHS Compliant (5of6) Tsi721A1-16GILV Industrial FCBGA Yes Tsi721 Datasheet Integrated Device Technology 65 April 4, 2016 Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.IDT.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales www.idt.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology. All rights reserved. Tsi721 Datasheet Integrated Device Technology 66 April 4, 2016 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.