UPC2905BHF-AZ

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT μ PC29xxB Series THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR (OUTPUT CURRENT: 1.0 A) DESCRIPTION The μ PC29xxB series is a series of three-terminal low dropout voltage regulators with 1.0 A output current. This series is suitable for low voltage operated IC and has 4 output voltage types, 1.8 V, 2.5 V, 3.3 V and 5.0 V. Compared with the μ PC29xx and μ PC29xxA series, this series has improved output voltage tolerance (VO ± 2%), quiescent current (1.8 mA TYP. (IO = 0 A)), and short-circuit current. FEATURES • Output current capacity: 1.0 A • Output voltage tolerance: VO ± 2% (TA = 25°C) • Low quiescent current: 1.8 mA TYP. (IO = 0 A) • Low short-circuit current: 0.3 A TYP. (μ PC2918B), 0.6 A TYP. (μ PC2925B, μ PC2933B), 0.65 A TYP. (μ PC2905B) • Low dropout voltage: VDIF = 0.6 V MAX. (IO = 0.5 A) • On-chip inrush current protection circuit at the time of input voltage rising (when input voltage is low) • On-chip over-current limiter • On-chip thermal shut down circuit APPLICATIONS Digital TV, DVD, LCD Monitors, Printers, Audio, Air Conditioners, and other applications. PIN CONFIGURATIONS (Marking Side) Isolated TO-220 (MP-45G) SC-64 (MP-3) 4 1 1 2 3 1: INPUT 2: GND 3: OUTPUT 2 TO-252 (MP-3ZK) SC-63 (MP-3Z) 4 4 3 1 2 1: INPUT Note1 2: GND 3: OUTPUT 4: GND (Fin) 1 3 1: INPUT 2: GND Note2 3: OUTPUT 4: GND (Fin) 2 3 1: INPUT 2: GND Note2 3: OUTPUT 4: GND (Fin) Notes 1. No.2 pin and No.4 fin are common GND. 2. No.2 pin is cut. No.2 pin and No.4 fin are common GND. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G17567EJ4V0DS00 (4th edition) Date Published August 2007 NS Printed in Japan 2005, 2007 The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. μ PC29xxB Series BLOCK DIAGRAM OUTPUT Saturation protection − Overcurrent protection Error Amp. Drive circuit Reference voltage + Thermal shut down Startup circuit INPUT GND ORDERING INFORMATION Part Number Package Output Voltage Marking μ PC2918BHF Isolated TO-220 (MP-45G) 1.8 V 2918B μ PC2918BHB SC-64 (MP-3) 1.8 V 2918B μ PC2918BT SC-63 (MP-3Z) 1.8 V 2918B μ PC2918BT1D TO-252 (MP-3ZK) 1.8 V 2918BD μ PC2925BHF Isolated TO-220 (MP-45G) 2.5 V 2925B μ PC2925BHB SC-64 (MP-3) 2.5 V 2925B μ PC2925BT SC-63 (MP-3Z) 2.5 V 2925B μ PC2925BT1D TO-252 (MP-3ZK) 2.5 V 2925BD μ PC2933BHF Isolated TO-220 (MP-45G) 3.3 V 2933B μ PC2933BHB SC-64 (MP-3) 3.3 V 2933B μ PC2933BT SC-63 (MP-3Z) 3.3 V 2933B μ PC2933BT1D TO-252 (MP-3ZK) 3.3 V 2933BD μ PC2905BHF Isolated TO-220 (MP-45G) 5.0 V 2905B μ PC2905BHB SC-64 (MP-3) 5.0 V 2905B μ PC2905BT SC-63 (MP-3Z) 5.0 V 2905B μ PC2905BT1D TO-252 (MP-3ZK) 5.0 V 2905BD Remark Tape-packaged products have the symbol -E1, or -E2 suffixed to the part number. In Pb-free products, any of -AT, -AZ or -AY is added to the end of their part number. Refer to the following table for details. 2 Data Sheet G17567EJ4V0DS μ PC29xxB Series Part Number Note1 μ PC29xxBHF μ PC29xxBHF-AZ Note2 μ PC29xxBHB Package Package Type Isolated TO-220 (MP-45G) • Packed in envelop Isolated TO-220 (MP-45G) • Packed in envelop SC-64 (MP-3) • Packed in envelop μ PC29xxBHB-AZ Note2 SC-64 (MP-3) • Packed in envelop μ PC29xxBHB-AY Note3 SC-64 (MP-3) • Packed in envelop SC-63 (MP-3Z) • Packed in envelop SC-63 (MP-3Z) • Packed in envelop SC-63 (MP-3Z) • 16 mm wide embossed taping μ PC29xxBT μ PC29xxBT-AZ Note2 μ PC29xxBT-E1 • Pin 1 on draw-out side • 2000 pcs/reel μ PC29xxBT-E1-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2000 pcs/reel μ PC29xxBT-E1-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2000 pcs/reel μ PC29xxBT-E2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel μ PC29xxBT-E2-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel μ PC29xxBT-E2-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel μ PC29xxBT1D-E1 TO-252 (MP-3ZK) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2500 pcs/reel μ PC29xxBT1D-E1-AT Note4 TO-252 (MP-3ZK) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2500 pcs/reel μ PC29xxBT1D-E2 TO-252 (MP-3ZK) • 16 mm wide embossed taping • Pin 1 at take-up side • 2500 pcs/reel μ PC29xxBT1D-E2-AT Note4 TO-252 (MP-3ZK) • 16 mm wide embossed taping • Pin 1 at take-up side • 2500 pcs/reel Notes 1. xx stands for symbols that indicate the output voltage. 2. Pb-free (This product does not contain Pb in the external electrode.) 3. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) 4. Pb-free (This product does not contain Pb in the external electrode and other parts.) Data Sheet G17567EJ4V0DS 3 μ PC29xxB Series ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Rating μ PC29xxBHF Unit μ PC29xxBHB, μ PC29xxBT, μ PC29xxBT1D Input Voltage −0.3 to +16.0 VIN Internal Power Dissipation (TC = 25°C) Note PT 15 V 10 W Operating Ambient Temperature TA −40 to +85 °C Operating Junction Temperature TJ −40 to +150 °C Storage Temperature Tstg −55 to +150 °C Thermal Resistance (junction to case) Rth(J-C) 7 12.5 °C/W Thermal Resistance (junction to ambient) Rth(J-A) 65 125 °C/W Note Internally limited. When the operating junction temperature rises above 150°C, the internal circuit shuts down the output voltage. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. TYPICAL CONNECTION D1 μ PC29xxB INPUT OUTPUT + CIN COUT D2 CIN : 0.1 μ F or higher. Be sure to connect CIN to prevent parasitic oscillation. Set this value according to the length of the line between the regulator and the INPUT pin. Use of a film capacitor or other capacitor with first-rate voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 μ F or higher for the voltage and temperature range to be used. COUT: 10 μ F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 1 to 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D1 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2 : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external. 4 Data Sheet G17567EJ4V0DS μ PC29xxB Series RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Output Current Symbol Type Number VIN MIN. TYP. MAX. Unit μ PC2918B 2.8 12.0 V μ PC2925B 3.5 12.0 V μ PC2933B 4.3 12.0 V μ PC2905B 6.0 12.0 V IO All 0 1.0 A Operating Ambient Temperature TA All − 40 + 85 °C Operating Junction Temperature TJ All − 40 + 125 °C Caution Use of conditions exceeding the above-listed recommended operating conditions is not a problem as long as the absolute maximum ratings are not exceeded. However, since the use of such conditions diminishes the margin of safety, careful evaluation is required before such conditions are used. ELECTRICAL CHARACTERISTICS μ PC2918B (TJ = 25°C, VIN = 2.8 V, IO = 0.5 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Output Voltage Symbol Conditions VO1 VO2 2.8 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A MIN. TYP. MAX. Unit 1.764 1.8 1.836 V (1.746) − (1.854) V Line Regulation REGIN 2.8 V ≤ VIN ≤ 12 V − 4.0 25.0 mV Load Regulation REGL 0 A ≤ IO ≤ 1 A − 3.5 30.0 mV Quiescent Current IBIAS IO = 0 A − 1.8 4.0 mA IO = 0.5 A − 18.0 (30.0) mA Startup Quiescent Current IBIAS(S) VIN = 1.7 V, IO = 0 A − 1.0 30.0 mA VIN = 2.4 V, IO = 1 A − − (80.0) mA Quiescent Current Change ΔIBIAS 2.8 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 50.0 − μ Vr.m.s. Ripple Rejection R•R f = 120 Hz, 2.8 V ≤ VIN ≤ 3.8 V, IO = 0.3 A − 62 − dB Dropout Voltage VDIF IO = 0.5 A − 0.3 0.6 V IO = 1 A − (0.7) − V (0.1) 0.3 (0.8) A VIN = 12 V − (0.4) − A VIN = 2.8 V 1.0 1.3 (1.6) A VIN = 12 V − (1.1) − A − 0.1 − mV/°C Short Circuit Current IOshort Peak Output Current IOpeak Temperature Coefficient of Output Voltage ΔVO/ΔT VIN = 2.8 V 0°C ≤ TJ ≤ 125°C, IO = 5 mA Remark Values in parentheses are product design values, and are thus provided as reference values. Data Sheet G17567EJ4V0DS 5 μ PC29xxB Series μ PC2925B (TJ = 25°C, VIN = 3.5 V, IO = 0.5 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit 2.45 2.5 2.55 V (2.425) − (2.575) V − 5.5 25.0 mV 0 A ≤ IO ≤ 1 A − 3.5 40.0 mV Output Voltage VO1 VO2 3.5 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A Line Regulation REGIN 3.5 V ≤ VIN ≤ 12 V Load Regulation REGL Quiescent Current IBIAS IO = 0 A − 1.8 4.0 mA IO = 0.5 A − 18.0 (30.0) mA VIN = 2.4 V, IO = 0 A − 11.0 30.0 mA mA Startup Quiescent Current IBIAS(S) VIN = 3.1 V, IO = 1 A − − (80.0) Quiescent Current Change ΔIBIAS 3.5 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 62.0 − μ Vr.m.s. Ripple Rejection R•R f = 120 Hz, 3.5 V ≤ VIN ≤ 4.5 V, IO = 0.3 A − 60 − dB Dropout Voltage VDIF IO = 0.5 A − 0.36 0.6 V IO = 1 A − (0.7) − V A Short Circuit Current IOshort Peak Output Current IOpeak Temperature Coefficient of Output Voltage ΔVO/ΔT VIN = 3.5 V (0.1) 0.6 (0.8) VIN = 12 V − (0.4) − A VIN = 3.5 V 1.0 1.3 (1.6) A VIN = 12 V − (1.1) − A − 0.2 − mV/°C 0°C ≤ TJ ≤ 125°C, IO = 5 mA Remark Values in parentheses are product design values, and are thus provided as reference values. μ PC2933B (TJ = 25°C, VIN = 5.0 V, IO = 0.5 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Output Voltage Symbol Conditions VO1 TYP. MAX. Unit V 3.234 3.3 3.366 (3.201) − (3.399) V 4.3 V ≤ VIN ≤ 12 V − 6.0 25.0 mV REGL 0 A ≤ IO ≤ 1 A − 4.2 50.0 mV IBIAS IO = 0 A − 1.8 4.0 mA IO = 0.5 A − 18.0 (30.0) mA VIN = 3.1 V, IO = 0 A − 11.0 30.0 mA VIN = 3.7 V, IO = 1 A − − (80.0) mA VO2 4.3 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A Line Regulation REGIN Load Regulation Quiescent Current Startup Quiescent Current MIN. IBIAS(S) Quiescent Current Change ΔIBIAS 4.3 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 82.0 − μ Vr.m.s. Ripple Rejection R•R f = 120 Hz, 4.3 V ≤ VIN ≤ 5.3 V, IO = 0.3 A − 58 − dB Dropout Voltage VDIF IO = 0.5 A − 0.36 0.6 V IO = 1 A − (0.7) − V (0.1) 0.6 (0.8) A VIN = 12 V − (0.4) − A VIN = 5.0 V 1.0 1.5 (1.6) A VIN = 12 V − (1.1) − A − 0.4 − mV/°C Short Circuit Current IOshort Peak Output Current IOpeak Temperature Coefficient of Output Voltage ΔVO/ΔT VIN = 5.0 V 0°C ≤ TJ ≤ 125°C, IO = 5 mA Remark Values in parentheses are product design values, and are thus provided as reference values. 6 Data Sheet G17567EJ4V0DS μ PC29xxB Series μ PC2905B (TJ = 25°C, VIN = 6.0 V, IO = 0.5 A, CIN = 0.1 μ F, COUT = 10 μ F, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. MAX. Unit 4.90 5.0 5.10 V (4.85) − (5.15) V − 6.5 25.0 mV 0 A ≤ IO ≤ 1 A − 5.0 80.0 mV Output Voltage VO1 VO2 6.0 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A Line Regulation REGIN 6.0 V ≤ VIN ≤ 12 V Load Regulation REGL Quiescent Current IBIAS IO = 0 A − 1.8 4.0 mA IO = 0.5 A − 18.0 (30.0) mA VIN = 4.8 V, IO = 0 A − 11.0 30.0 mA mA Startup Quiescent Current IBIAS(S) VIN = 5.5 V, IO = 1 A − − (80.0) Quiescent Current Change ΔIBIAS 6.0 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 122.0 − μ Vr.m.s. Ripple Rejection R•R f = 120 Hz, 6.0 V ≤ VIN ≤ 7 V, IO = 0.3 A − 57 − dB Dropout Voltage VDIF IO = 0.5 A − 0.38 0.6 V IO = 1 A − (0.7) − V A Short Circuit Current IOshort Peak Output Current IOpeak Temperature Coefficient of Output Voltage ΔVO/ΔT VIN = 6.5 V (0.1) 0.65 (0.8) VIN = 12 V − (0.4) − A VIN = 6.5 V 1.0 1.5 (1.6) A VIN = 12 V − (1.1) − A − 0.6 − mV/°C 0°C ≤ TJ ≤ 125°C, IO = 5 mA Remark Values in parentheses are product design values, and are thus provided as reference values. Data Sheet G17567EJ4V0DS 7 μ PC29xxB Series TYPICAL CHARACTERISTICS (TA = 25°C) Δ VO vs.TJ Pd vs. TA Solid line: m PC29xxBHF Broken line: m PC29xxBT1D, m PC29xxBT, m PC29xxBHB W ith in fin ite he at sin k 15 10 Δ VO - Output Voltage Change - mV Pd - Total Power Dissipation - W 20 100 5 Without he atsink 1.92 1.0 0 IO = 5 mA 80 60 40 20 0 -20 μ PC2918B (VIN = 2.8 V) μ PC2925B (VIN = 3.5 V) μ PC2933B (VIN = 5.0 V) μ PC2905B (VIN = 6.0 V) -40 -60 -80 -100 50 0 85 100 150 -50 -25 0 25 50 75 TJ - Operating Junction Temperature - °C TA - Operating Ambient Temperature - °C VO vs. VIN (μ PC2918B) VO vs. VIN (μ PC2925B) 2.5 3 TJ = 25°C 2.5 2 VO - Output Voltage - V VO - Output Voltage - V TJ = 25°C 1.5 IO = 5 mA IO = 0.5 A IO = 1 A 1 0.5 1.5 1 0.5 0 0 2 4 6 8 0 2 4 6 VIN - Input Voltage - V VIN - Input Voltage - V VO vs. VIN (μ PC2933B) VO vs. VIN (μ PC2905B) 8 6 4 TJ = 25°C 3.5 TJ = 25°C 5 VO - Output Voltage - V VO - Output Voltage - V IO = 5 mA IO = 0.5 A IO = 1 A 2 0 3 IO = 5 mA IO = 0.5 A IO = 1 A 2.5 2 1.5 1 0.5 4 IO = 5 mA IO = 0.5 A IO = 1 A 3 2 1 0 0 0 2 4 6 8 0 2 4 6 VIN - Input Voltage - V VIN - Input Voltage - V 8 100 125 Data Sheet G17567EJ4V0DS 8 μ PC29xxB Series IBIAS (IBIAS(s)) vs. VIN (μ PC2925B) 80 80 70 70 IBIAS - Quiescent Current - mA IBIAS - Quiescent Current - mA IBIAS (IBIAS(s)) vs. VIN (μ PC2918B) 60 50 40 IO = 1 A 30 20 IO = 0.5 A 10 IO = 5 mA 60 50 40 IO = 1 A 30 20 IO = 0.5 A 10 IO = 5 mA 0 0 0 2 4 6 8 10 12 14 0 16 2 4 80 80 70 70 60 50 IO = 1 A 30 IO = 0.5 A IO = 5 mA 10 12 14 16 60 50 IO = 1 A 40 30 IO = 0.5 A 20 IO = 5 mA 10 0 0 0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 12 VIN - Input Voltage - V VIN - Input Voltage - V VDIF vs. TJ IOpeak vs. VDIF 1 14 16 2 IOpeak - Peak Output Current - A IO = 0.5 A 0.9 VDIF - Dropout Voltage - V 10 IBIAS (IBIAS(s)) vs. VIN (μ PC2905B) IBIAS - Quiescent Current - mA IBIAS - Quiescent Current - mA IBIAS (IBIAS(s)) vs. VIN (μ PC2933B) 20 8 VIN - Input Voltage - V VIN - Input Voltage - V 40 6 0.8 μ PC2933B 0.7 0.6 μ PC2905B 0.5 0.4 0.3 μ PC2925B 0.2 μ PC2918B 0.1 μ PC2925B μ PC2905B 1.5 1 μ PC2933B μ PC2918B 0.5 TJ = 25°C 0 0 -50 -25 0 25 50 75 100 125 150 TJ - Operating Junction Temperature - °C Data Sheet G17567EJ4V0DS 0 3 6 9 12 15 VDIF - Dropout Voltage - V 9 μ PC29xxB Series R•R vs. f (μ PC2918B) 70 R•R - Ripple Rejection - dB 80 IO = 5 mA 60 IO = 0.3 A IO = 0.5 A 50 IO = 1 A 40 30 20 TJ = 25°C VIN = 2.8 V 10 R•R - Ripple Rejection - dB 80 R•R vs. f (μ PC2925B) 0 100 1000 10000 50 30 20 10 1000 10000 100000 80 IO = 5 mA IO = 1 A 30 20 TJ = 25°C VIN = 5.0 V R•R - Ripple Rejection - dB IO = 0.5 A 10 IO = 5 mA 70 IO = 0.3 A 0 IO = 0.3 A 60 50 40 IO = 0.5 A IO = 1 A 30 20 TJ = 25°C VIN = 6.0 V 10 0 10 100 1000 10000 100000 10 100 1000 10000 100000 f - Frequency - Hz f - Frequency - Hz VO vs. IO (μ PC2918B) VDIF vs. IO 1 3.0 TJ = 25°C 0.9 VIN = 2.8 V 2.5 μ PC2933B VO - Output Voltage - V VDIF - Dropout Voltage - V 100 R•R vs. f (μ PC2905B) 40 μ PC2925B μ PC2905B 0.4 0.3 0.2 TJ = 25°C VIN = 3.5 V 10 R•R vs. f (μ PC2933B) 50 0.5 IO = 1 A f - Frequency - Hz 60 0.6 IO = 0.5 A 40 f - Frequency - Hz 70 R•R - Ripple Rejection - dB 60 100000 80 0.7 IO = 0.3 A 0 10 0.8 IO = 5 mA 70 μ PC2918B 2.0 1.5 1.0 0.5 0.1 0 0 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IO - Output Current - A IO - Output Current - A Data Sheet G17567EJ4V0DS μ PC29xxB Series VO vs. IO (μ PC2925B) VO vs. IO (μ PC2933B) 3.0 5.0 VIN = 3.5 V VIN = 5.0 V 4.0 VO - Output Voltage - V VO - Output Voltage - V 2.5 2.0 1.5 1.0 0.5 0 3.0 2.0 1.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IO - Output Current - A 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IO - Output Current - A VO vs. IO (μ PC2905B) 6.0 VIN = 6.5 V VO - Output Voltage - V 5.0 4.0 3.0 2.0 1.0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IO - Output Current - A Data Sheet G17567EJ4V0DS 11 μ PC29xxB Series PACKAGE DRAWINGS (Unit: mm) μ PC2918BHF, μ PC2925BHF, μ PC2933BHF, μ PC2905BHF 3PIN PLASTIC SIP (MP-45G) A N E P B I L M D 1 2 3 K Y V J H U Z C F G M NOTE ITEM Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 10.0±0.2 B 7.0±0.2 C 1.50±0.2 D E 17.0±0.3 φ 3.3±0.2 F 0.75±0.10 G 0.25 H 2.54 (T.P.) I 5.0±0.3 J K 2.46±0.2 5.0±0.2 L 8.5±0.2 M 8.5±0.2 N 4.5±0.2 P U V 2.8±0.2 2.4±0.5 0.65±0.10 Y Z 8.9±0.7 1.30±0.2 P3HF-254B-4 12 Data Sheet G17567EJ4V0DS μ PC29xxB Series μ PC2918BHB, μ PC2925BHB, μ PC2933BHB, μ PC2905BHB SC-64 (MP-3) 2.3±0.2 1.5 +0.2 −0.1 6.5±0.2 5.0±0.2 0.5±0.1 2 3 7.0 MIN. 1 13.7 MIN. 1.6±0.2 5.5±0.2 4 1.1±0.1 0.5 +0.2 −0.1 2.3 0.75 2.3 0.5 +0.2 −0.1 μ PC2918BT, μ PC2925BT, μ PC2933BT, μ PC2905BT SC-63 (MP-3Z) (Unit: mm) 6.5±0.2 2.3±0.2 4.4±0.2 1.5 −0.1 +0.2 5.0±0.2 Note 0.5±0.1 2 3 2.5±0.5 1.0±0.5 0.4 MIN. 0.5 TYP. 1 9.5±0.5 4 5.6±0.3 Note 5.5±0.2 0.5±0.1 0.5±0.1 2.3±0.3 2.3±0.3 0.15±0.15 Note The depth of notch at the top of the fin is from 0 to 0.2 mm. Data Sheet G17567EJ4V0DS 13 μ PC29xxB Series μ PC2918BT1D, μ PC2925BT1D, μ PC2933BT1D, μ PC2905BT1D TO-252 (MP-3ZK) 1.0 TYP. 6.5±0.2 5.1 TYP. 4.3 MIN. 2.3±0.1 0.5±0.1 1.14 MAX. 3 0.51 MIN. 2 0.8 1 6.1±0.2 10.4 MAX. (9.8 TYP.) 4.0 MIN. 4 0 to 0.25 0.5±0.1 0.76±0.12 2.3 2.3 1.0 14 Data Sheet G17567EJ4V0DS μ PC29xxB Series RECOMMENDED MOUNTING CONDITIONS The μ PC29xxB Series should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Surface Mount Device μ PC29xxBT Series: SC-63 (MP-3Z) μ PC29xxBT1D Series: TO-252 (MP-3ZK) Process Infrared Ray Reflow Conditions Peak temperature: 260°C or below (Package surface temperature), Symbol IR60-00-3 Reflow time: 60 seconds or less (at 220°C or higher), Maximum number of reflow processes: 3 times or less. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-3 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 times or less. Partial Heating Method Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (Per each side of the device). Note1 μ PC29xxBT-AZ Series , μ PC29xxBT-AY Series Note3 μ PC29xxBT1D-AT Series : TO-252 (MP-3ZK) Note2 Process Infrared Ray Reflow : SC-63 (MP-3Z) Conditions Peak temperature: 260°C or below (package surface temperature), Symbol IR60-00-3 Reflow time: 60 seconds or less (at 220°C or higher), Maximum number of reflows processes: 3 times or less. Partial Heating Method Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (per each side of the device). Notes 1. Pb-free (This product does not contain Pb in the external electrode.) 2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) 3. Pb-free (This product does not contain Pb in the external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended. Data Sheet G17567EJ4V0DS 15 μ PC29xxB Series Type of Through-hole Device Note1 μ PC29xxBHF Series, μ PC29xxBHF-AZ Series : Isolated TO-220 (MP-45G) Note1 Note2 μ PC29xxBHB Series, μ PC29xxBHB-AZ Series , μ PC29xxBHB-AY Series : SC-64 (MP-3) Process Wave Soldering Conditions Symbol Solder temperature: 260°C or below, Flow time: 10 seconds or less WS60-00-1 (only to leads) Partial Heating Method Pin temperature: 350°C or below, Heat time: 3 seconds or less (per each pin). P350 Notes 1. Pb-free (This product does not contain Pb in the external electrode.) 2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. REFERENCE DOCUMENTS USER’S MANUAL USAGE OF THREE TERMINAL REGULATORS Document No.G12702E REVIEW OF QUALITY AND RELIABILITY HANDBOOK Document No.C12769E INFORMATION VOLTAGE REGULATOR OF SMD Document No.G11872E SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html 16 Data Sheet G17567EJ4V0DS μ PC29xxB Series • The information in this document is current as of August, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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