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UPC29M33AT-E1-AY

UPC29M33AT-E1-AY

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    TO252

  • 描述:

    IC REG LINEAR 3.3V 500MA TO252

  • 数据手册
  • 价格&库存
UPC29M33AT-E1-AY 数据手册
To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µ PC29Mxx Series THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR The µPC29Mxx series of low dropout voltage three terminal positive regulators is constructed with PNP output transistor. The µPC29Mxx series feature the ability to source 0.5 A of output current with a low dropout voltage of typically 0.5 V. The power dissipation of the µPC29Mxx series can be drastically reduced compared with the conventional three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to the low voltage output (3.0 V, 3.3 V) which is not in the conventional low dropout regulators (µPC24MxxA series). FEATURES • Output current in excess of 0.5 A • Low dropout voltage VDIF = 0.5 V TYP. (IO = 0.5 A) • On-chip over-current and thermal protection circuit • On-chip output transistor safe operating area protection circuit PIN CONFIGURATIONS (Marking Side) µ PC29MxxHF Series: Isolated TO-220 (MP-45G) µ PC29MxxHB Series: SC-64 (MP-3) µ PC29MxxT Series: SC-63 (MP-3Z) 4 1 2 3 1: INPUT 2: GND 3: OUTPUT 1 2 3 4 1: INPUT Note1 2: GND 3: OUTPUT 4: GND (Fin) 1 2 3 1: INPUT 2: GNDNote2 3: OUTPUT 4: GND (Fin) Notes 1. No.2 pin and No.4 fin are common GND. 2. No.2 pin is cut. No.2 pin and No.4 fin are common GND. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G10027EJ4V0DS00 (4th edition) Date Published September 2007 N Printed in Japan The mark shows major revised points. The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what." field. µ PC29Mxx Series BLOCK DIAGRAM INPUT Safe operating area protection Start-up circuit Reference voltage Error Amp. Saturation protection Drive circuit OUTPUT Thermal shut down Over-current protection GND 2 Data Sheet G10027EJ4V0DS µ PC29Mxx Series ORDERING INFORMATION Part Number µPC29M03HF Package Output Voltage Marking Isolated TO-220 (MP-45G) 3.0 V 29M03 µPC29M03HB SC-64 (MP-3) 3.0 V 29M03 µPC29M03T SC-63 (MP-3Z) 3.0 V 29M03 µPC29M33HF Isolated TO-220 (MP-45G) 3.3 V 29M33 µPC29M33HB SC-64 (MP-3) 3.3 V 29M33 µPC29M33T SC-63 (MP-3Z) 3.3 V 29M33 µPC29M05HF Isolated TO-220 (MP-45G) 5.0 V 29M05 µPC29M05HB SC-64 (MP-3) 5.0 V 29M05 µPC29M05T SC-63 (MP-3Z) 5.0 V 29M05 µPC29M06HF Isolated TO-220 (MP-45G) 6.0 V 29M06 µPC29M06HB SC-64 (MP-3) 6.0 V 29M06 µPC29M06T SC-63 (MP-3Z) 6.0 V 29M06 µPC29M07HF Isolated TO-220 (MP-45G) 7.0 V 29M07 µPC29M07HB SC-64 (MP-3) 7.0 V 29M07 µPC29M07T SC-63 (MP-3Z) 7.0 V 29M07 µPC29M08HF Isolated TO-220 (MP-45G) 8.0 V 29M08 µPC29M08HB SC-64 (MP-3) 8.0 V 29M08 µPC29M08T SC-63 (MP-3Z) 8.0 V 29M08 µPC29M09HF Isolated TO-220 (MP-45G) 9.0 V 29M09 µPC29M09HB SC-64 (MP-3) 9.0 V 29M09 µPC29M09T SC-63 (MP-3Z) 9.0 V 29M09 µPC29M10HF Isolated TO-220 (MP-45G) 10.0 V 29M10 µPC29M10HB SC-64 (MP-3) 10.0 V 29M10 µPC29M10T SC-63 (MP-3Z) 10.0 V 29M10 µPC29M12HF Isolated TO-220 (MP-45G) 12.0 V 29M12 µPC29M12HB SC-64 (MP-3) 12.0 V 29M12 µPC29M12T SC-63 (MP-3Z) 12.0 V 29M12 Remark Tape-packaged products have the symbol -E1, or -E2 suffixed to the part number. Pb-free products have the symbol -AZ, or -AY suffixed to the part number. Refer to the following table for details. Data Sheet G10027EJ4V0DS 3 µ PC29Mxx Series Part Number Note1 Package µPC29MxxHF µPC29MxxHF-AZ Note2 Packege Type Isolated TO-220 (MP-45G) • Packed in envelop Isolated TO-220 (MP-45G) • Packed in envelop SC-64 (MP-3) • Packed in envelop µPC29MxxHB-AZ Note2 SC-64 (MP-3) • Packed in envelop µPC29MxxHB-AY Note3 SC-64 (MP-3) • Packed in envelop SC-63 (MP-3Z) • 16 mm wide embossed taping µPC29MxxHB µPC29MxxT-E1 • Pin 1 on draw-out side • 2000 pcs/reel µPC29MxxT-E1-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2000 pcs/reel µPC29MxxT-E1-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 on draw-out side • 2000 pcs/reel µPC29MxxT-E2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel µPC29MxxT-E2-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel µPC29MxxT-E2-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping • Pin 1 at take-up side • 2000 pcs/reel Notes 1. xx stands for symbols that indicate the output voltage. 2. Pb-free (This product does not contain Pb in the external electrode.) 3. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) 4 Data Sheet G10027EJ4V0DS µ PC29Mxx Series ABSOLUTE MAXIMUM RATINGS (TA = 25°C, Unless otherwise specified.) Rating Parameter Symbol Input Voltage µPC29MxxHF µPC29MxxHB, µPC29MxxT VIN Internal Power Dissipation (TC = 25°C) Note 20 PT Unit V 15 10 W Operating Ambient Temperature TA –30 to +85 °C Operating Junction Temperature TJ –30 to +150 °C Storage Temperature Tstg –55 to +150 °C Thermal Resistance (Junction to Case) Rth (J-C) 7 12.5 °C/W Thermal Resistance (Junction to Ambient) Rth (J-A) 65 125 °C/W Note Internally limited. When the operating junction temperature rises above 150°C, the internal circuit shuts down the output voltage. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. TYPICAL CONNECTION D1 µ PC29Mxx INPUT OUTPUT + CIN CIN COUT D2 : 0.1 µF or higher. Be sure to connect CIN to prevent parasitic oscillation. Set this value according to the length of the line between the regulator and the INPUT pin. Use of a film capacitor or other capacitor with first-rate voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 µF or higher for the voltage and temperature range to be used. COUT : 47 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 1 to 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D1 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2 : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external. Data Sheet G10027EJ4V0DS 5 µ PC29Mxx Series RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Type Number MIN. TYP. MAX. µPC29M03 4 16 µPC29M33 4.3 16 µPC29M05 6 16 µPC29M06 7 16 µPC29M07 8 16 µPC29M08 9 18 µPC29M09 10 18 µPC29M10 11 18 µPC29M12 13 18 Unit V Output Current IO all 0 0.5 A Operating Ambient Temperature TA all –30 +85 °C Operating Junction Temperature TJ all –30 +125 °C ELECTRICAL CHARACTERISTICS µ PC29M03 (TJ = 25°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 4.0 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 2.88 3.0 3.12 2.85 3.15 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 4.0 V ≤ VIN ≤ 16 V 7 30 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 8 30 mV Quiescent Current IBIAS IO = 0 A 1.8 4.0 IO = 0.5 A 17 30 VIN = 2.95 V, IO = 0 A 7 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 2.95 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 4.0 V ≤ VIN ≤ 16 V 3.2 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 51 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 4.0 V ≤ VIN ≤ 16 V 64 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A Short Circuit Current IO short VIN = 4.5 V 48 0.65 20 0.5 1.0 1.0 1.5 mA V A VIN = 16 V Peak Output Current IO peak 0.6 VIN = 4.5 V 0.7 1.0 1.5 VIN = 16 V 0.6 0.9 1.5 A Temperature Coefficient of Output Voltage 6 ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS –0.3 mV/°C µ PC29Mxx Series µ PC29M33 (TJ = 25°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 3.17 3.3 3.43 3.14 3.46 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 4.3 V ≤ VIN ≤ 16 V 8 33 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 10 33 mV Quiescent Current IBIAS IO = 0 A 1.8 4.0 IO = 0.5 A 15 30 VIN = 3.1 V, IO = 0 A 9 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 3.1 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V 2.9 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 56 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 4.3 V ≤ VIN ≤ 16 V 64 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A Short Circuit Current IO short VIN = 4.5 V 48 0.7 20 0.5 1.0 1.1 1.5 mA V A VIN = 16 V Peak Output Current IO peak 0.6 VIN = 4.5 V 0.7 1.2 1.5 VIN = 16 V 0.6 1.0 1.5 A Temperature Coefficient of Output Voltage ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS –0.4 mV/°C 7 µ PC29Mxx Series µ PC29M05 (TJ = 25°C, VIN = 8 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 4.8 5.0 5.2 4.75 5.25 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 6 V ≤ VIN ≤ 16 V 26 50 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 17 50 mV Quiescent Current IBIAS IO = 0 A 1.9 4.0 IO = 0.5 A 16 30 VIN = 4.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 4.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V 2.4 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 87 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 6 V ≤ VIN ≤ 16 V 60 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A Short Circuit Current IO short VIN = 6.5 V 46 0.65 20 0.5 1.0 1.1 1.5 mA V A VIN = 16 V Peak Output Current IO peak 0.6 VIN = 6.5 V 0.7 1.2 1.5 VIN = 16 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage 8 ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.7 mV/°C µ PC29Mxx Series µ PC29M06 (TJ = 25°C, VIN = 9 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 7 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 5.76 6.0 6.24 5.70 6.30 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 7 V ≤ VIN ≤ 16 V 30 60 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 30 60 mV Quiescent Current IBIAS IO = 0 A 2.0 4.0 IO = 0.5 A 16 30 VIN = 5.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 5.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 7 V ≤ VIN ≤ 16 V 2.5 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 126 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 7 V ≤ VIN ≤ 16 V 58 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A Short Circuit Current IO short VIN = 7.5 V 42 0.7 20 0.5 1.0 1.1 1.5 mA V A VIN = 16 V Peak Output Current IO peak 0.6 VIN = 7.5 V 0.7 1.1 1.5 VIN = 16 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.44 mV/°C 9 µ PC29Mxx Series µ PC29M07 (TJ = 25°C, VIN = 10 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 8 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 6.72 7.0 7.28 6.65 7.35 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 8 V ≤ VIN ≤ 16 V 35 70 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 35 70 mV Quiescent Current IBIAS IO = 0 A 2.0 4.0 IO = 0.5 A 16 30 VIN = 6.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 6.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 8 V ≤ VIN ≤ 16 V 2.6 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 147 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 8 V ≤ VIN ≤ 16 V 56 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A Short Circuit Current IO short VIN = 8.5 V 40 0.7 20 0.5 1.0 1.1 1.5 mA V A VIN = 16 V Peak Output Current IO peak 0.6 VIN = 8.5 V 0.7 1.2 1.5 VIN = 16 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage 10 ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.7 mV/°C µ PC29Mxx Series µ PC29M08 (TJ = 25°C, VIN = 11 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 9 V ≤ VIN ≤ 18 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 7.68 8.0 8.32 7.6 8.4 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 9 V ≤ VIN ≤ 18 V 40 80 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 40 80 mV Quiescent Current IBIAS IO = 0 A 2.0 4.0 IO = 0.5 A 15 30 VIN = 7.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 7.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 9 V ≤ VIN ≤ 18 V 3.0 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 150 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 9 V ≤ VIN ≤ 18 V 58 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 Short Circuit Current IO short VIN = 9.5 V 1.0 VIN = 18 V 0.55 42 20 1.0 mA V A Peak Output Current IO peak VIN = 9.5 V 0.7 1.2 1.5 VIN = 18 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.7 mV/°C 11 µ PC29Mxx Series µ PC29M09 (TJ = 25°C, VIN = 12 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 10 V ≤ VIN ≤ 18 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 8.64 9.0 9.36 8.55 9.45 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 10 V ≤ VIN ≤ 18 V 45 90 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 45 90 mV Quiescent Current IBIAS IO = 0 A 2.0 4.0 IO = 0.5 A 15 30 VIN = 8.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 8.5 V, IO = 0.5 A 80 20 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 10 V ≤ VIN ≤ 18 V Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz Ripple Rejection R·R f = 120 Hz, 10 V ≤ VIN ≤ 18 V Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 Short Circuit Current IO short VIN = 10.5 V 1.0 VIN = 18 V 0.55 41 mA 170 µVr.m.s. 57 dB 1.0 V A Peak Output Current IO peak VIN = 10.5 V 0.7 1.2 1.5 VIN = 18 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage 12 ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.8 mV/°C µ PC29Mxx Series µ PC29M10 (TJ = 25°C, VIN = 13 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 11 V ≤ VIN ≤ 18 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 9.6 10.0 10.4 9.5 10.5 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 11 V ≤ VIN ≤ 18 V 34 100 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 10 100 mV Quiescent Current IBIAS IO = 0 A 2.1 4.0 IO = 0.5 A 16 30 VIN = 9.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 9.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 11 V ≤ VIN ≤ 18 V 1.9 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 180 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 11 V ≤ VIN ≤ 18 V 53 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 Short Circuit Current IO short VIN = 11.5 V 0.9 VIN = 18 V 0.5 40 20 1.0 mA V A Peak Output Current IO peak VIN = 11.5 V 0.7 1.2 1.5 VIN = 18 V 0.6 1.2 1.5 A Temperature Coefficient of Output Voltage ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 0.9 mV/°C 13 µ PC29Mxx Series µ PC29M12 (TJ = 25°C, VIN = 15 V, IO = 350 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified.) Parameters Output Voltage Symbol Conditions VO 0°C ≤ TJ ≤ 125°C, 13 V ≤ VIN ≤ 18 V, 0 A ≤ IO ≤ 350 mA MIN. TYP. MAX. 11.52 12 12.48 11.4 12.6 Unit V 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A Line Regulation REGIN 13 V ≤ VIN ≤ 18 V 25 120 mV Load Regulation REGL 0 A ≤ IO ≤ 0.5 A 13 120 mV Quiescent Current IBIAS IO = 0 A 2.1 4.0 IO = 0.5 A 14 30 VIN = 11.5 V, IO = 0 A 10 30 mA Startup Quiescent Current IBIAS (s) mA VIN = 11.5 V, IO = 0.5 A 80 Quiescent Current Change ∆IBIAS 0°C ≤ TJ ≤ 125°C, 13 V ≤ VIN ≤ 18 V 1.7 Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz 210 µVr.m.s. Ripple Rejection R·R f = 120 Hz, 13 V ≤ VIN ≤ 18 V 53 dB Dropout Voltage VDIF 0°C ≤ TJ ≤ 125°C, IO = 0.5 A 0.5 Short Circuit Current IO short VIN = 14 V 0.7 VIN = 18 V 0.5 40 20 1.0 mA V A Peak Output Current IO peak VIN = 14 V 0.7 1.2 1.5 VIN = 18 V 0.6 1.1 1.5 A Temperature Coefficient of Output Voltage 14 ∆VO/∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G10027EJ4V0DS 1.2 mV/°C µ PC29Mxx Series TYPICAL CHARACTERISTICS ∆VO vs TJ Pd vs TA 150 Solid line: µ PC29MxxHF Series Broken line: µ PC29MxxHB Series µ PC29MxxT Series 15 ∆VO - Output Voltage Change - mV Pd - Total Power Dissipation - W 20 With infinite heatsink 10 100 50 µ PC29M03 µ PC29M05 0 –50 µ PC29M12 –100 5 Without heatsink –150 1.92 1.0 0 IO = 5 mA 0 50 85 100 –200 –50 150 TA - Operating Ambient Temperature - ˚C 0 50 100 150 TJ - Operating Junction Temperature - ˚C VO vs VIN ( µ PC29M33) IBIAS (IBIAS (s) ) vs VIN ( µ PC29M33) 4.0 50 TJ = 25˚C TJ = 25˚C 3.5 IBIAS - Quiescent Current - mA VO - Output Voltage - V IO = 0.5 A 3.0 IO = 0.35 A 2.5 IO = 5 mA 2.0 1.5 1.0 40 30 20 IO = 0.5 A IO = 0.35 A 10 0.5 IO = 0 A 0 1 2 3 4 5 6 7 0 8 2 4 6 VIN - Input Voltage - V 10 12 14 16 18 20 VIN - Input Voltage - V IO peak vs VDIF ( µPC29M03) VDIF vs TJ 1.5 IO peak - Peak Output Current - A 1.0 0.8 VDIF - Dropout Voltage - V 8 µ PC29M03 0.6 µ PC29M33 0.4 µ PC29M12 0.2 TJ = 25˚C TJ = 0˚C 1.0 TJ = 125˚C 0.5 IO = 0.5 A 0 –25 0 +25 +50 +75 +100 +125 +150 TJ - Operating Junction Temperature - ˚C Data Sheet G10027EJ4V0DS 0 5 10 15 20 VDIF - Dropout Voltage - V 15 µ PC29Mxx Series IO peak vs VDIF ( µPC29M05) R·R vs f 80 R·R - Ripple Rejection - dB IO peak - Peak Output Current - A 1.5 TJ = 0˚C 1.0 TJ = 25˚C 0.5 TJ = 125˚C TJ = 25˚C IO = 0.5 A 70 µ PC29M03 60 µ PC29M12 50 40 30 20 0 5 10 15 0 10 20 100 70 TJ = 25˚C VDIF - Dropout Voltage - V R·R - Ripple Rejection - dB TJ = 25˚C 4.3 V ≤ VIN ≤ 16 V f = 120 Hz µ PC29M03 60 µ PC29M12 50 40 0.8 0.6 0.4 0.2 0 0 0.1 0.2 0.3 0.4 0.5 0 IO - Output Current - A VO vs IO ( µPC29M03) TJ = 25˚C 5 4 3 VIN = 16 V VIN = 4 V 2 1 0.2 0.4 0.6 0.8 0.1 0.2 0.3 IO - Output Current - A 6 VO - Output Voltage - V 100 k 1.0 30 1.0 1.2 IO - Output Current - A 16 10 k VDIF vs IO ( µ PC29M03) R·R vs IO 80 0 1k f - Frequency - Hz VDIF - Dropout Voltage - V Data Sheet G10027EJ4V0DS 0.4 0.5 µ PC29Mxx Series PACKAGE DRAWINGS µPC29MxxHF Series 3PIN PLASTIC SIP (MP-45G) A N E P B I L M D 1 2 3 K Y V J H U Z C F G M NOTE ITEM Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 10.0±0.2 B 7.0±0.2 C 1.50±0.2 D E 17.0±0.3 φ 3.3±0.2 F 0.75±0.10 G 0.25 H I 2.54 (T.P.) 5.0±0.3 J K 2.46±0.2 5.0±0.2 L M 8.5±0.2 8.5±0.2 N 4.5±0.2 P U V 2.8±0.2 2.4±0.5 0.65±0.10 Y Z 8.9±0.7 1.30±0.2 P3HF-254B-4 Data Sheet G10027EJ4V0DS 17 µ PC29Mxx Series µPC29MxxHB Series SC-64 (MP-3) (Unit: mm) 2.3±0.2 1.5 +0.2 –0.1 6.5±0.2 5.0±0.2 0.5±0.1 2 3 7.0 MIN. 1 13.7 MIN. 1.6±0.2 5.5±0.2 4 1.1±0.1 0.5 +0.2 –0.1 2.3 0.75 2.3 0.5 +0.2 –0.1 µPC29MxxT Series SC-63 (MP-3Z) (Unit: mm) 6.5±0.2 2.3±0.2 4.4±0.2 1.5 −0.1 +0.2 5.0±0.2 Note 0.5±0.1 3 2.5±0.5 1.0±0.5 0.4 MIN. 0.5 TYP. 2 9.5±0.5 5.5±0.2 1 5.6±0.3 Note 4 0.5±0.1 0.5±0.1 2.3±0.3 2.3±0.3 0.15±0.15 Note The depth of notch at the top of the fin is from 0 to 0.2 mm. 18 Data Sheet G10027EJ4V0DS µ PC29Mxx Series RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our sales offices. For more details, refer to the Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Surface mount devices µPC29MxxT Series: SC-63 (MP-3Z) Process Infrared ray reflow Conditions Symbol Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), IR35-00-3 Maximum number of reflow processes: 3 times or less. VPS Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 times or less. Partial heating method Pin temperature: 350°C or below, Heat time: 3 seconds or less (Per each side of the device). VP15-00-3 P350 Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended. µPC29MxxT-AZ Series Note1, µPC29MxxT-AY Series Process Note2: SC-63 (MP-3Z) Conditions Symbol Infrared ray reflow Peak temperature: 260°C or below (Package surface temperature), Reflow time: 60 seconds or less (at 220°C or higher), Maximum number of reflow processes: 3 times or less. IR60-00-3 Partial heating method Pin temperature: 350°C or below, P350 Heat time: 3 seconds or less (Per each side of the device). Notes 1. Pb-free (This product does not contain Pb in the external electrode.) 2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Remark Flux: Rosin-based flux sith low chlorine content (chlorine 0.2 Wt% or below) is recommended. Data Sheet G10027EJ4V0DS 19 µ PC29Mxx Series Through-hole devices µPC29MxxHF Series, µPC29MxxHF-AZ Series Note1: Isolated TO-220 (MP-45G) µPC29MxxHB Series, µPC29MxxHB-AZ Series Note1, µPC29MxxHB-AY Series Process Note2: SC-64 (MP-3) Conditions Wave soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less. Partial heating method Pin temperature: 350°C or below, Heat time: 3 seconds or less (Per each pin). Symbol WS60-00-1 P350 Notes 1. Pb-free (This product does not contain Pb in the external electrode.) 2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. CAUTION ON USE When using the µPC29Mxx series at the input voltage which is lower than in the recommended operating condition, the high quiescent current flows through devices because the transistor of the output paragraph is saturated (Refer to “IBIAS (IBIAS (s)) vs VIN curves in TYPICAL CHARACTERISTICS”). The µPC29Mxx series have saturation protection circuits, but they sometimes need about 80 mA current. Therefore the power supply on the input needs the enough current capacity to pass this quiescent current when the devices startup. REFERENCE DOCUMENTS USER'S MANUAL USAGE OF THREE TERMINAL REGULATORS Document No.G12702E REVIEW OF QUALITY AND RELIABILITY HANDBOOK Document No.C12769E INFORMATION VOLTAGE REGULATOR OF SMD Document No.G11872E SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html 20 Data Sheet G10027EJ4V0DS µ PC29Mxx Series • The information in this document is current as of September, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1
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