UPC4560C-A

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(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC4560 HIGH PERFORMANCE DUAL OPERATIONAL AMPLIFIER DESCRIPTION The µPC4560 is a dual operational amplifier which features more improved slew rate and G.B. products than that of µPC4559 with unity gain frequency compensation. Also very low input noise and high output current drive capability make this device the optimum choice for audio applications and active filters. FEATURES • Internal frequency compensation • Gain bandwidth products: 10 MHz TYP. • Low noise: 6 µVp-p TYP. • High output current ORDERING INFORMATION Part Number Package µPC4560C 8-pin plastic DIP (7.62 mm (300)) µPC4560G2 8-pin plastic SOP (5.72 mm (225)) EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Top View) + V µ PC4560C, 4560G2 R1 Q7 Q5 OUT1 Q13 II1 Q15 Q1 II R7 R5 Q3 IN1 3 6 II2 – 4 5 IN2 R8 V C2 Q12 Q4 7 OUT2 2 + – Q9 IN 2 R6 Q2 + 1 – + Q11 Q8 8 V 1 Q14 OUT Q10 D R2 C1 R3 R4 R9 V– The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. G15805EJ4V0DS00 (4th edition) Date Published March 2004 N CP(K) Printed in Japan The mark shows major revised points. 1987 µPC4560 ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter + Voltage between V and V Symbol – Note 1 + V -V Differential Input Voltage Input Voltage Note 2 Output Voltage Note 3 Power Dissipation C Package Note 4 G2 Package Output Short Circuit Duration – Ratings Unit –0.3 to +36 V VID ±30 VI V –0.3 to V +0.3 VO PT V – + V V –0.3 to V +0.3 – + V 700 mW 440 mW 0 sec Note 5 Note 6 Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to +125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is –7.0 mW/°C when operating ambient temperature is higher than 25°C. 5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25°C. 6. Must not short to GND, V+, V–, and other Voltage source. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage 2 Symbol V ± MIN. ±4 Data Sheet G15805EJ4V0DS TYP. MAX. Unit ±16 V µPC4560 ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V) Parameter Input Offset Voltage Input Offset Current Input Bias Current Symbol TYP. MAX. Unit ±0.5 ±6.0 mV IIO ±5 ±200 nA IB 60 500 nA 170 mW VIO Note Note Conditions MIN. RS ≤ 10 Ω RL ≥ 2 kΩ , VO = ±10 V Large Signal Voltage Gain AV Power Consumption Pd IO = 0 A Common Mode Rejection Ratio CMR RS ≤ 10 kΩ Source Variation Rejection Ratio SVR RS ≤ 10 kΩ Output Voltage Swing Vom RL ≥ 2 kΩ Common Mode Input Voltage Range VICM Slew Rate SR AV = 1 Input Equivalent Noise Voltage Vn RS = 1 kΩ, f = 1 Hz to 1 kHz IO = ±25 mA 20,000 180,000 120 70 100 10 ±12 ±14 dB 150 µV/V V ±10 ±13 V ±12 ±14 V 2.8 V/µs 6 µVp-p 105 dB (Figure1) Channel Separation f = 1 kHz (Figure2) Note Input bias currents flow out from IC, because each currents are base current of PNP-transistor on input stage. Data Sheet G15805EJ4V0DS 3 µPC4560 MEASUREMENT CIRCUIT Figure1 Noise Measurement Circuit +15 V 100 kΩ 1 kΩ − VO + 50 Ω Vn = 1 kΩ VO 2000 −15 V Figure2 Channel Separation Measurement Circuit 50 kΩ − 50 Ω VO2 + 10 kΩ 10 kΩ Channel separation VO2 1 = 20 log ( 1000 ) VO1 − VO1 + 4 Data Sheet G15805EJ4V0DS µPC4560 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 800 µ PC4560C 600 µ PC4560G2 400 200 0 20 +15 V V +_ = _ AV - Open Loop Voltage Gain - dB PT - Total Power Dissipation -mW 120 40 60 80 100 80 60 40 20 0 100 1 TA - Operating Ambient Temperature - ˚C VO - Output Voltage - V 24 20 16 12 8 10 k 100 k ± V = ±15 V ±15 VO+ , IO SOURCE ±10 ± Vom - Output Voltage Swing - Vp-p OUTPUT CURRENT LIMIT 28 1k 1M VO−, IO SINK ±5 0 20 f - Frequency - Hz ICC - Supply Current - mA IB - Input Bias Current - nA 80 60 40 20 40 80 SUPPLY CURRENT +15 V V +_ = _ 20 60 6 100 0 40 IO - Output Current - mA INPUT BIAS CURRENT 0 −20 1 k 10 k 100 k 1 M 10 M ±20 +15 V V +_ = _ 4 0 100 100 f- Frequency - Hz LARGE SIGNAL FREQUENCY RESPONSE 32 10 60 80 TA - Operating Ambient Temperature - ˚C Data Sheet G15805EJ4V0DS 5 4 3 2 1 0 _+10 0 _+20 + _ V - Supply Voltage - V 5 µPC4560 VOLTAGE FOLLOWER PULSE RESPONSE 20 10 10 5 _15 V V +_ = + Av = 1 VO - Output Voltage - V VICM - Common Mode Input Voltage Range -V COMMON MODE INPUT VOLTAGE RANGE 0 −10 −20 + _ 20 + _10 0 0 −5 −10 ± INPUT EQUIVALENT NOISE VOLTAGE DENSITY RS = 100 Ω ∆f = 1 HZ en - Input Equivalent Noise Voltage Density - nV/ Hz 30 10 0 1 10 100 1k f - Frequency - Hz 6 10 20 t - Time - µ s V - Supply Voltage - V 100 0 Data Sheet G15805EJ4V0DS 30 40 µPC4560 APPLICATION CIRCUITS Head Phone Amp +20 V 51 kΩ C2 + 10 µF R1 10 kΩ − 51 kΩ R5 R2 − − + + 0.47µF 100 kΩ 180 Ω µ PC4560 C1 R3 R6 R4 10 kΩ + 100 µ F + − C4 100 Ω R7 HEAD PHONE 8Ω 2.5 mW TYP. Maximum Power C3 − 4.7µF RIAA Amp TOTAL HARMONIC DISTORTION C3 C4 +15 V 0.0022 µ F 0.01 µ F R1 C5 µ PC4560 − 33 µ F + + 2.2 kΩ + C2 R2 56 kΩ − 47 µF R3 1 kΩ 100µF − 390 kΩ − C1 33 µF − + R5 −15 V − C7 + 100 µF R6 10 kΩ THD - Total Harmonic Distortion - % R4 36 kΩ 1.0 + C6 f = 1kHZ 0.1 0.01 0.001 0.01 0.1 1.0 1 VO - Output Voltage - Vr.m.s. Data Sheet G15805EJ4V0DS 7 µPC4560 PACKAGE DRAWINGS (Unit : mm) 8-PIN PLASTIC DIP (7.62mm(300)) 8 5 1 4 A K J L P I C H G B M R F D N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B 10.16 MAX. 1.27 MAX. C 2.54 (T.P.) D 0.50±0.10 F 1.4 MIN. G H 3.2±0.3 0.51 MIN. I J 4.31 MAX. 5.08 MAX. K 7.62 (T.P.) L 6.4 M 0.25 +0.10 −0.05 N 0.25 P 0.9 MIN. R 0∼15° P8C-100-300B,C-2 8 Data Sheet G15805EJ4V0DS µPC4560 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-6 Data Sheet G15805EJ4V0DS 9 µPC4560 RECOMMENDED SOLDERING CONDITIONS The µPC4560 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µPC4560G2: 8-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230°C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC4560C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering Solder temperature: 260°C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 10 Data Sheet G15805EJ4V0DS µPC4560 • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1