UPD70F3382M2GJA-GAE-AX

UPD70F3382M2GJA-GAE-AX

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    LQFP-144

  • 描述:

    UPD70F3382M2GJA GAE AX

  • 数据手册
  • 价格&库存
UPD70F3382M2GJA-GAE-AX 数据手册
Data Sheet V850ES/FE3 32-bit Single-Chip Microcontroller Hardware µPD70F3370A(A) µPD70F3371(A) µPD70F3370A(A1) µPD70F3371(A1) µPD70F3370A(A2) µPD70F3371(A2) Document No. U18564EE1V2DS00 Date Published March 2008 © NEC Electronics 2008 Printed in Germany V850ES/FE3 Notes for CMOS Devices 1. Precaution against ESD for semiconductors Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2. Handling of unused input pins for CMOS No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3. Status before initialization of MOS devices Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. 2 Data Sheet U18564EE1V2DS00 V850ES/FE3 Legal Notes • The information in this document is current as of January 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such NEC Electronics products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: “Standard”, “Special” and “Specific”. The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated “quality assurance program” for a specific application. The recommended applications of NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is “Standard” unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact NEC Electronics sales representative in advance to determine NEC Electronics 's willingness to support a given application. Notes: 1. "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. 2. "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). 3. SuperFlash® is a registered trademark of Silicon Storage Technology, Inc. in several countries including the United States and Japan. This product uses SuperFlash® technology licensed from Silicon Storage Technology, Inc. Data Sheet U18564EE1V2DS00 3 V850ES/FE3 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, please contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) • Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. 4 Data Sheet U18564EE1V2DS00 V850ES/FE3 For further information, please contact: NEC Electronics Corporation 1753, Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan Tel: 044-435-5111 http://www.necel.com/ [America] [Europe] [Asia & Oceania] NEC Electronics America, Inc. 2880 Scott Blvd. Santa Clara, CA 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 http://www.am.necel.com/ NEC Electronics (Europe) GmbH Arcadiastrasse 10 40472 Düsseldorf, Germany Tel: 0211-65030 http://www.eu.necel.com/ NEC Electronics (China) Co., Ltd 7th Floor, Quantum Plaza, No. 27 ZhiChunLu Haidian District, Beijing 100083, P.R.China TEL: 010-8235-1155 http://www.cn.necel.com/ Hanover Office Podbielski Strasse 166 B 30177 Hanover Tel: 0 511 33 40 2-0 NEC Electronics Shanghai Ltd. Room 2509-2510, Bank of China Tower, 200 Yincheng Road Central, Pudong New Area, Shanghai P.R. China P.C:200120 Tel: 021-5888-5400 http://www.cn.necel.com/ Munich Office Werner-Eckert-Strasse 9 81829 München Tel: 0 89 92 10 03-0 Stuttgart Office Industriestrasse 3 70565 Stuttgart Tel: 0 711 99 01 0-0 United Kingdom Branch Cygnus House, Sunrise Parkway Linford Wood, Milton Keynes MK14 6NP, U.K. Tel: 01908-691-133 Succursale Française 9, rue Paul Dautier, B.P. 52180 78142 Velizy-Villacoublay Cédex France Tel: 01-3067-5800 Sucursal en España Juan Esplandiu, 15 28007 Madrid, Spain Tel: 091-504-2787 NEC Electronics Hong Kong Ltd. 12/F., Cityplaza 4, 12 Taikoo Wan Road, Hong Kong Tel: 2886-9318 http://www.hk.necel.com/ Seoul Branch 11F., Samik Lavied’or Bldg., 720-2, Yeoksam-Dong, Kangnam-Ku, Seoul, 135-080, Korea Tel: 02-558-3737 NEC Electronics Taiwan Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan, R. O. C. Tel: 02-8175-9600 NEC Electronics Singapore Pte. Ltd. 238A Thomson Road, #12-08 Novena Square, Singapore 307684 Tel: 6253-8311 http://www.sg.necel.com/ Tyskland Filial Täby Centrum Entrance S (7th floor) 18322 Täby, Sweden Tel: 08 638 72 00 Filiale Italiana Via Fabio Filzi, 25/A 20124 Milano, Italy Tel: 02-667541 Branch The Netherlands Steijgerweg 6 5616 HS Eindhoven The Netherlands Tel: 040 265 40 10 G06.6-1A Data Sheet U18564EE1V2DS00 5 V850ES/FE3 Table of Contents 1. Pin Group Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 2. Device package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Groups 1x: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Groups 2x: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Groups 3x: Pins supplied by BVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Groups 4: Pins supplied by AVREF0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Groups 5: Pins supplied by AVREF1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Groups 6: Pins supplied by EVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Groups 7: Pins supplied by VRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Specifications of (A)-Grade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1 2.2 2.3 2.4 2.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Operating condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Voltage Regulator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Clock Generator Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5.1 Main System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13 2.5.2 Sub System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.3 Internal-OSC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.4 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5.5 SSCG Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.6.1 Input/Output Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.6.2 PIN leakage current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.6.3 Power supply current (A-grade). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.6.3.1 FE3 128KB mPD70F3370A, FE3 256KB mPD70F3371 . . . . . . . . . . . . . . . . . . . . . . 18 2.7 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.7.1 CLKOUT Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.7.2 RESET, Interrupt, ADTRG Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.7.3 Key Return Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.7.4 Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.7.5 CSI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.7.6 UART Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.7.7 IIC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.7.8 CAN Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.8 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.9 POC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.10 LVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2.11 RAM Retention Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2.12 Data Retention Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.13 Flash Memory Programming Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3. Electrical Specifications of (A1)-Grade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 3.1 3.2 3.3 3.4 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 6 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Operating condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Voltage Regulator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Clock Generator Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Main System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32 Sub System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 33 Internal-OSC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 SSCG Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Data Sheet U18564EE1V2DS00 V850ES/FE3 Table of Contents 3.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.6.1 Input/Output Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.6.2 PIN leakage current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 3.6.3 Power supply current (A1-grade) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 3.6.3.1 FE3 128KB mPD70F3370A, FE3 256KB mPD70F3371 . . . . . . . . . . . . . . . . . . . . . . 36 3.7 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.1 CLKOUT Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.2 RESET, Interrupt, ADTRG Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.3 Key Return Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.4 Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.5 CSI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.6 UART Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.7 IIC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.7.8 CAN Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.8 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.9 POC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.10 LVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.11 RAM Retention Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.12 Data Retention Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 3.13 Flash Memory Programming Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4. Electrical Specifications of (A2)-Grade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.1 4.2 4.3 4.4 4.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Operating condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Voltage Regulator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Clock Generator Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 4.5.1 Main System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42 4.5.2 Sub System Clock Oscillation Circuit Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.5.3 Internal-OSC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.5.4 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.5.5 SSCG Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 4.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.6.1 Input/Output Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.6.2 PIN leakage current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.6.3 Power supply current (A2-grade) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.6.3.1 FE3 128KB mPD70F3370A, FE3 256KB mPD70F3371 . . . . . . . . . . . . . . . . . . . . . . 45 4.7 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.1 CLKOUT Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.2 RESET, Interrupt, ADTRG Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.3 Key Return Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.4 Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.5 CSI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.6 UART Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.7 IIC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.7.8 CAN Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 4.8 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.9 POC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.10 LVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.11 RAM Retention Flag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.12 Data Retention Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 4.13 Flash Memory Programming Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Data Sheet U18564EE1V2DS00 7 V850ES/FE3 Table of Contents 5. Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 5.1 5.2 6. 8 Package Dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Product Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.2.1 Marking of pin 1 at a QFP (Quad Flat Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 5.2.2 Identification of Lead-Free Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Change History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Data Sheet U18564EE1V2DS00 V850ES/FE3 1. Pin Group Information 1.1 Device package information The V850ES/Fx3 device series comprises several members. An overview with the pin and package information is given in the following table: Series Member μPD70F3370A μPD70F3371 μPD70F3372 μPD70F3373 μPD70F3374 μPD70F3375 μPD70F3376A μPD70F3377A μPD70F3378 μPD70F3379 μPD70F3380 μPD70F3381 μPD70F3382 μPD70F3383 μPD70F3384 μPD70F3385 # Pins Device package information 64 FE3 80 FF3 100 FG3 144 FJ3 176 FK3 This document describes the specification for the V850ES/FE3. 1.2 Pin Groups 1x: Pins supplied by EVDD 1B: (SHMT1) - P04, P30-31, P34; P40, P91, P913-915 (FE3) - P04, P30-31, P34; P38-39, P40, P91, P913-915 (FF3) - P04, P30-31, P34; P36-39, P40, P91, P911, P913-915 (FG3) - P04, P30-31, P34; P36-39, P40, P63-69, P614-615, P80-81, P91, P911, P913-915 (FJ3) - P04, P30-31, P34; P36-39, P40, P63-69, P614-615, P80-81, P91, P911, P913-915, P156-157 (FK3) 1D: (SHMT3) - P00-03, P05-P06, P32-33, P35, P41-42, P50-55, P90, P96-99 (FE3) - P00-03, P05-P06, P32-33, P35, P41-42, P50-55, P90, P96-99 (FF3) - P00-03, P05-P06, P10-11, P32-33, P35, P41-42, P50-55, P90, P92-910, P912 (FG3) - P00-03, P05-P06, P10-11, P32-33, P35, P41-42, P50-55, P60-62, P610-613, P90, P92-910, P912 (FJ3) - P00-03, P05-P06, P10-11, P32-33, P35, P41-42, P50-55, P60-62, P610-613, P90, P92-910, P912, P150-155 (FK3) 1.3 Pin Groups 2x: Pins supplied by EVDD 2A: (CMOS) - PCM0-1 (FE3) - PCM0-3, PCS0-1, PCT0-1, PCT4, PCT6 (FF3) 2D: (SHMT3) - PDL0-7 (FE3) - PDL0-11 (FF3) Data Sheet U18564EE1V2DS00 9 V850ES/FE3 1.4 Pin Groups 3x: Pins supplied by BVDD 3A: (CMOS) - PCM0-3, PCS0-1, PCT0-1, PCT4, PCT6 (FG3) - PCD0-3, PCM0-5, PCS0-7, PCT0-7 (FJ3 + FK3) 3D: (SHMT3) - PDL0-13 (FG3) - PDL0-15 (FJ3 + FK3) 1.5 Pin Groups 4: Pins supplied by AVREF0 4: (CMOS) - P70-79 (FE3) - P70-711 (FF3) - P70-715 (FG3) - P70-715, P120-127 (FJ3 + FK3) 1.6 Pin Groups 5: Pins supplied by AVREF1 - P20-P215 (FK3) (CMOS) 1.7 Pin Groups 6: Pins supplied by EVDD - RESET (SHMT2) - IC, FLMD0 1.8 Pin Groups 7: Pins supplied by VRO - X1, X2, XT1, XT2 10 Data Sheet U18564EE1V2DS00 V850ES/FE3 2. Electrical Specifications of (A)-Grade This product has to be used only under the conditions of VDD=EVDD. Operation is not ensured at the time of using this product except this condition. 2.1 Absolute Maximum Ratings Absolute Maximum Ratings (Ta=25°C) Parameter Supply voltage Symbol VDD EVDD AVREF0 VSS EVSS AVSS Input voltage Analog input voltage High level output current Conditions VDD=EVDD, VDD=EVDD VSS=EVSS=AVSS VSS=EVSS=AVSS VSS=EVSS=AVSS VI1 Pin Group 1x, 2x, 6 VI3 Pin Group 7 -0.5 to VRO+0.5 VIAN Pin Group 4 -0.5 to AVREF0+0.5 Note1 Pin Group 1x, 2x IOH Pin Group 4 IOL Pin Group 4 Operating ambient temperature Storage temperature Note1 Note1 Pin Group 1x, 2x Low level output current Rating -0.5 to +6.5 -0.5 to +6.5 -0.5 to +6.5 -0.5 to +0.5 -0.5 to +0.5 -0.5 to +0.5 -0.5 to EVDD+0.5 1 pin Total 1 pin Total 1 pin Total 1 pin Total -4 -50 -4 -20Note2 4 50 4 20Note2 -40 to +85 -40 to +85 -40 to +125 Normal operating mode Flash programming mode Ta Tstg Unit V V V V V V V V V mA mA mA mA mA mA mA mA °C °C Remarks: 1. The characteristics of the dual-function pins are the same as those of the port pins unless otherwise specified Notes: 1. Be sure not to exceed the absolute maximum ratings (Max. value) of each supply voltage. 2. Excluding ADC IAREF0 current. 2.2 Capacities (Ta = 25°C, VDD = EVDD = AVREF0 = VSS = EVSS = AVSS = 0V) Parameter Input/output capacitance Symbol CIO Conditions f=1MHz, Not measured pins is 0V. Data Sheet U18564EE1V2DS00 MIN. TYP. MAX. 10 Unit pF 11 V850ES/FE3 2.3 Operating condition (Ta = -40 to +85°C, C=4.7uF, VDD = EVDD = 3.3 to 5.5V, AVREF0 = 3.3 to 5.5V, VSS = EVSS = AVSS = 0V) Internal System clock frequency (fVBCLK) Supply voltage 4.0V≤VDD≤5.5VNote2 3.5V≤VDD
UPD70F3382M2GJA-GAE-AX 价格&库存

很抱歉,暂时无法提供与“UPD70F3382M2GJA-GAE-AX”相匹配的价格&库存,您可以联系我们找货

免费人工找货