X4163/5
16K
2K x 8 Bit
CPU Supervisor with 16K EEPROM
FEATURES
DESCRIPTION
• Selectable watchdog timer
• Low VCC detection and reset assertion
—Four standard reset threshold voltages
—Adjust low VCC reset threshold voltage using
special programming sequence
—Reset signal valid to VCC = 1V
• Low power CMOS
—tWDO
tRST
tRST
SCL
SDA
RESET
Note: All inputs are ignored during the active reset period (tRST).
REV 1.32 5/27/04
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Characteristics subject to change without notice.
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X4163/5
RESET Output Timing
Symbol
tWDO
tRST
Parameter
Min.
Typ.
Max.
Units
Watchdog Time Out Period,
WD1 = 1, WD0 = 1 (factory setting)
WD1 = 1, WD0 = 0
WD1 = 0, WD0 = 1
WD1 = 0, WD0 = 0
100
450
1
OFF
250
650
1.5
400
850
2
ms
ms
sec
Reset Time Out
100
250
400
ms
VTRIP Programming Timing Diagram (WEL = 1)
VCC
(VTRIP)
VTRIP
tTSU
tTHD
VP
WP
tVPH
tVPS
tVPO
SCL
tRP
SDA
A0h
01h or 03h
00h
00h
VTRIP Programming Parameters
Parameter
Description
Min.
Max. Unit
tVPS
VTRIP Program Enable Voltage Setup time
1
µs
tVPH
VTRIP Program Enable Voltage Hold time
1
µs
tTSU
VTRIP Setup time
1
µs
tTHD
VTRIP Hold (stable) time
10
tWC
VTRIP Write Cycle Time
tVPO
VTRIP Program Enable Voltage Off time (Between successive adjustments)
0
µs
tRP
VTRIP Program Recovery Period (Between successive adjustments)
10
ms
VP
Programming Voltage
15
18
V
VTRIP Programmed Voltage Range
2.55
4.75
V
Vta1
Initial VTRIP Program Voltage accuracy (VCC applied–VTRIP) (Programmed at 25°C.)
-0.1
+0.4
V
Vta2
Subsequent VTRIP Program Voltage accuracy [(VCC applied–Vta1)—VTRIP.
Programmed at 25°C.)
-25
+25
mV
Vtr
VTRIP Program Voltage repeatability (Successive program operations.
Programmed at 25°C.)
-25
+25
mV
Vtv
VTRIP Program variation after programming (0–75°C). (Programmed at 25°C.)
-25
+25
mV
VTRAN
ms
10
ms
VTRIP programming parameters are periodically sampled and are not 100% tested.
REV 1.32 5/27/04
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Characteristics subject to change without notice.
18 of 22
X4163/5
PACKAGING INFORMATION
8-Lead Plastic Small Outline Gull Wing Package Type S
0.150 (3.80) 0.228 (5.80)
0.158 (4.00) 0.244 (6.20)
Pin 1 Index
Pin 1
0.014 (0.35)
0.019 (0.49)
0.188 (4.78)
0.197 (5.00)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.19)
0.010 (0.25)
0.050 (1.27)
0.010 (0.25)
X 45°
0.020 (0.50)
0.050"Typical
0.050"
Typical
0° - 8°
0.0075 (0.19)
0.010 (0.25)
0.250"
0.016 (0.410)
0.037 (0.937)
0.030"
Typical
8 Places
FOOTPRINT
NOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS)
REV 1.32 5/27/04
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Characteristics subject to change without notice.
19 of 22
X4163/5
PACKAGING INFORMATION
8-Lead Plastic, TSSOP, Package Type V
.025 (.65) BSC
.169 (4.3)
.252 (6.4) BSC
.177 (4.5)
.114 (2.9)
.122 (3.1)
.047 (1.20)
.0075 (.19)
.0118 (.30)
.002 (.05)
.006 (.15)
.010 (.25)
Gage Plane
0° – 8°
Seating Plane
.019 (.50)
.029 (.75)
(4.16) (7.72)
Detail A (20X)
(1.78)
.031 (.80)
.041 (1.05)
(0.42)
(0.65)
All Measurements Are Typical
See Detail “A”
NOTE: ALL DIMENSIONS IN INCHES (IN P ARENTHESES IN MILLIMETERS)
REV 1.32 5/27/04
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Characteristics subject to change without notice.
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X4163/5
Ordering Information
VCC
Range
VTRIP
Range
Package
4.5-5.5V
4.5-4.75
8L SOIC
8L TSSOP
4.5-5.5V
4.25-4.5
8L SOIC
8L TSSOP
2.7-5.5V
2.85-3.0
8L SOIC
8LTSSOP
2.7-5.5V
2.55-2.7
8L SOIC
8L TSSOP
Operating
Temperature Range
Part Number RESET
(Active LOW)
Part Number RESET
(Active HIGH)
0°C–70°C
X4163S8–4.5A
X4165S8–4.5A
-40°C–85°C
X4163S8I–4.5A
X4165S8I–4.5A
0°C–70°C
X4163V8–4.5A
X4165V8–4.5A
-40°C–85°C
X4163V8I–4.5A
X4165V8I–4.5A
0°C–70°C
X4163S8
X4165S8
-40°C–85°C
X4163S8I
X4165S8I
0°C–70°C
X4163V8
X4165V8
-40°C–85°C
X4163V8I
X4165V8I
0°C–70°C
X4163S8–2.7A
X4165S8–2.7A
-40°C–85°C
X4163S8I–2.7A
X4165S8I–2.7A
0°C–70°C
X4163V8–2.7A
X4165V8–2.7A
-40°C–85°C
X4163V8I–2.7A
X4165V8I–2.7A
0°C–70°C
X4163S8–2.7
X4165S8–2.7
-40°C–85°C
X4163S8I–2.7
X4165S8I–2.7
0°C–70°C
X4163V8–2.7
X4165V8–2.7
-40°C–85°C
X4163V8I–2.7
X4165V8I–2.7
Part Mark Information
8-Lead SOIC
8-Lead TSSOP
EYWW
XXXXX
X4163/5 X
XX
ADB/ADK = –4.5A (0 to +70°C)
ADD/ADM = No Suffix (0 to +70°C)
ADF/ADO = –2.7A (0 to +70°C)
ADH/ADQ= –2.7 (0 to +70°C)
AL = –4.5A (0 to +70°C)
AM = –4.5A (-40 to +85°C)
Blank = No Suffix (0 to +70°C)
I = No Suffix (-40 to +85°C)
AN = –2.7A (0 to +70°C)
AP = –2.7A (-40 to +85°C)
F = –2.7 (0 to +70°C)
G = –2.7 (-40 to +85°C)
4163/4165
REV 1.32 5/27/04
Blank = 8-Lead SOIC
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Characteristics subject to change without notice.
21 of 22
X4163/5
LIMITED WARRANTY
©Xicor, Inc. 2004 Patents Pending
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices
at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.
TRADEMARK DISCLAIMER:
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All
others belong to their respective owners.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
REV 1.32 5/27/04
www.xicor.com
Characteristics subject to change without notice.
22 of 22