DATASHEET
X5163, X5165
FN8128
Rev 4.00
August 13, 2015
CPU Supervisor with 16Kbit SPI EEPROM
Description
Features
These devices combine four popular functions, Power-on
Reset Control, Watchdog Timer, Supply Voltage Supervision,
and Block Lock Protect Serial EEPROM Memory in one
package. This combination lowers system cost, reduces
board space requirements, and increases reliability.
• Selectable watchdog timer
Applying power to the device activates the power-on reset
circuit which holds RESET/RESET active for a period of
time. This allows the power supply and oscillator to stabilize
before the processor can execute code.
The Watchdog Timer provides an independent protection
mechanism for microcontrollers. When the microcontroller
fails to restart a timer within a selectable time out interval, the
device activates the RESET/RESET signal. The user selects
the interval from three preset values. Once selected, the
interval does not change, even after cycling the power.
The device’s low VCC detection circuitry protects the user’s
system from low voltage conditions, resetting the system when
VCC falls below the minimum VCC trip point. RESET/RESET is
asserted until VCC returns to proper operating level and
stabilizes. Five industry standard VTRIP thresholds are
available, however, Intersil’s unique circuits allow the
threshold to be reprogrammed to meet custom requirements
or to fine-tune the threshold for applications requiring higher
precision.
• Low VCC detection and reset assertion
- Five standard reset threshold voltages
- Re-program low VCC reset threshold voltage using
special programming sequence
- Reset signal valid to VCC = 1V
• Determine watchdog or low voltage reset with a volatile
flag bit
• Long battery life with low power consumption
- 3.3V, IOL = 2.1mA
0.4
V
VOL2
Output LOW Voltage
2V < VCC 3.3V, IOL = 1mA
0.4
V
VOL3
Output LOW Voltage
VCC 2V, IOL = 0.5mA
0.4
V
VOH1
Output HIGH Voltage
VCC > 3.3V, IOH = –1.0mA
VCC - 0.8
V
VOH2
Output HIGH Voltage
2V < VCC 3.3V, IOH = –0.4mA
VCC - 0.4
V
VOH3
Output HIGH Voltage
VCC 2V, IOH = –0.25mA
VCC - 0.2
V
VOLS
Reset Output LOW Voltage
IOL = 1mA
0.4
Capacitance TA = +25°C, f = 1MHz, VCC = 5V
SYMBOL
COUT
CIN
(2)
(2)
TEST
MAX.
UNIT
CONDITIONS
Output Capacitance (SO, RESET, RESET)
8
pF
VOUT = 0V
Input Capacitance (SCK, SI, CS, WP)
6
pF
VIN = 0V
NOTES:
1. VIL min. and VIH max. are for reference only and are not tested.
2. This parameter is periodically sampled and not 100% tested.
FN8128 Rev 4.00
August 13, 2015
Page 12 of 22
V
X5163, X5165
5V
A.C. Test Conditions
5V
3.3k
1.64k
OUTPUT
RESET/RESET
1.64k
Input pulse levels
VCC x 0.1 to VCC x 0.9
Input rise and fall times
10ns
Input and output timing level
VCC x0.5
30pF
100pF
FIGURE 10. EQUIVALENT A.C. LOAD CIRCUIT AT 5V VCC
AC Electrical Specifications
Serial Input Timing (Over operating conditions unless otherwise specified.)
2.7-5.5V
SYMBOL
PARAMETER
MIN
MAX
UNIT
0
2
MHz
fSCK
Clock Frequency
tCYC
Cycle Time
500
ns
tLEAD
CS Lead Time
250
ns
tLAG
CS Lag Time
250
ns
tWH
Clock HIGH Time
200
ns
tWL
Clock LOW Time
200
ns
tSU
Data Setup Time
50
ns
tH
Data Hold Time
50
ns
(3)
Input Rise Time
100
ns
(3)
Input Fall Time
100
ns
tRI
tFI
tCS
tWC
(4)
CS Deselect Time
500
ns
Write Cycle Time
10
ms
tCS
CS
tLEAD
tLAG
SCK
tSU
SI
SO
tH
tRI
MSB IN
tFI
LSB IN
HIGH IMPEDANCE
FIGURE 11. SERIAL INPUT TIMING
FN8128 Rev 4.00
August 13, 2015
Page 13 of 22
X5163, X5165
AC Electrical Specifications
Serial Output Timing(Over operating conditions unless otherwise specified.)
2.7-5.5V
SYMBOL
PARAMETER
MIN
MAX
UNIT
0
2
MHz
fSCK
Clock Frequency
tDIS
Output Disable Time
250
ns
Output Valid from Clock Low
200
ns
tV
tHO
0
ns
Output Rise Time
100
ns
(3)
Output Fall Time
100
ns
tRO
tFO
Output Hold Time
(3)
NOTES:
3. This parameter is periodically sampled and not 100% tested.
4. tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile write cycle.
CS
tCYC
tWH
tLAG
SCK
tV
SO
SI
tHO
MSB OUT
tWL
MSB–1 OUT
tDIS
LSB OUT
ADDR
LSB IN
TABLE 3. SERIAL OUTPUT TIMING
VTRIP
VTRIP
VCC
tPURST
0 Volts
tPURST
tR
tF
tRPD
RESET (X5163)
RESET (X5165)
TABLE 4. POWER-UP AND POWER-DOWN TIMING
FN8128 Rev 4.00
August 13, 2015
Page 14 of 22
X5163, X5165
RESET Output Timing
SYMBOL
VTRIP
VTH
tPURST
tRPD
tF
(5)
PARAMETER
Reset Trip Point Voltage, X5163-4.5A, X5163-4.5A
Reset Trip Point Voltage, X5163, X5165
Reset Trip Point Voltage, X5163-2.7A, X5165-2.7A
Reset Trip Point Voltage, X5163-2.7, X5165-2.7
MIN
TYP
MAX
UNIT
4.5
4.25
2.85
2.55
4.63
4.38
2.92
2.63
4.75
4.5
3.0
2.7
V
VTRIP Hysteresis (HIGH to LOW vs. LOW to HIGH VTRIP voltage)
20
Power-up Reset Time Out
100
200
VCC Detect to Reset/Output
mV
280
ms
500
ns
(5)
VCC Fall Time
100
µs
(5)
VCC Rise Time
100
µs
Reset Valid VCC
1
V
tR
VRVALID
NOTES:
5. This parameter is periodically sampled and not 100% tested.
6. Typical values not tested.
CS/WDI
tCST
RESET
tWDO
tWDO
tRST
tRST
RESET
FIGURE 12. CS/WDI VS. RESET/RESET TIMING
RESET/RESET Output Timing
SYMBOL
PARAMETER
MIN
TYP
MAX
UNIT
200
600
1.4
300
800
2
ms
ms
sec
tWDO
Watchdog Time Out Period,
WD1 = 1, WD0 = 0
WD1 = 0, WD0 = 1
WD1 = 0, WD0 = 0
100
450
1
tCST
CS Pulse Width to Reset the Watchdog
400
tRST
Reset Time Out
100
FN8128 Rev 4.00
August 13, 2015
ns
200
300
ms
Page 15 of 22
X5163, X5165
tTHD
VCC
VTRIP
tTSU
tVPS
CS
tRP
tP
tVPH
tVPH
tVPS
tVPO
VP
SCK
VP
tVPO
SI
FIGURE 13. VTRIP SET CONDITIONS
tTHD
VCC
VTRIP
tTSU
tVPS
CS
SCK
tVPS
tRP
tP
tVP1
tVPH
tVPO
VCC
VP
tVPO
SI
FIGURE 14. VTRIP RESET CONDITIONS
FN8128 Rev 4.00
August 13, 2015
Page 16 of 22
X5163, X5165
VTRIP Programming Specifications: VCC = 1.7-5.5V; Temperature = 0°C to 70°C
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
tVPS
SCK VTRIP Program Voltage Setup time
1
µs
tVPH
SCK VTRIP Program Voltage Hold time
1
µs
VTRIP Program Pulse Width
1
µs
tTSU
VTRIP Level Setup time
10
µs
tTHD
VTRIP Level Hold (stable) time
10
ms
tWC
VTRIP Write Cycle Time
tRP
VTRIP Program Cycle Recovery Period (Between successive programming cycles)
10
ms
tVPO
SCK VTRIP Program Voltage Off time before next cycle
0
ms
Programming Voltage
15
18
V
VTRIP Programed Voltage Range
1.7
5.0
V
Vta1
Initial VTRIP Program Voltage accuracy (VCC applied-VTRIP) (Programmed at 25°C.)
-0.1
+0.4
V
Vta2
Subsequent VTRIP Program Voltage accuracy [(VCC applied-Vta1)-VTRIP] (Programmed at 25°C.)
-25
+25
mV
Vtr
VTRIP Program Voltage repeatability (Successive program operations.) (Programmed at 25°C.)
-25
+25
mV
Vtv
VTRIP Program variation after programming (0-75°C). (Programmed at 25°C.)
-25
+25
mV
tP
VP
VTRAN
10
ms
VTRIP programming parameters are periodically sampled and are not 100% tested.
FN8128 Rev 4.00
August 13, 2015
Page 17 of 22
X5163, X5165
18
1.9
WATCHDOG TIMER ON (VCC = 5V)
16
1.8
14
RESET (SECONDS)
1.7
ISB (µA)
12
WATCHDOG TIMER ON (VCC = 5V)
10
8
6
4
WATCHDOG TIMER OFF (VCC = 3V, 5V)
2
25
TEMP (°C)
90°C
1.4
1.3
1.2
1
90
1.7
2.4
3.1
4.5
5.2
FIGURE 16. tWDO VS. VOLTAGE/TEMPERATURE (WD1, 0 = 1, 1)
5.025
0.8
VTRIP = 5V
5.000
0.75
RESET (SECONDS)
4.975
3.525
VTRIP = 3.5V
3.500
3.475
2.525
-40°C
0.7
25°C
0.65
90°C
0.6
0.55
0.5
VTRIP = 2.5V
2.500
0.45
2.475
0
25
1.7
85
2.4
3.1
FIGURE 17. VTRIP vs. Temperature (programmed at 25°C)
200
195
195
RESET (SECONDS)
205
200
190
185
180
175
170
175
170
160
FIGURE 19. tPURST VS. TEMPERATURE
FN8128 Rev 4.00
August 13, 2015
90°C
180
160
90
-40°C
185
165
25
5.2
25°C
190
165
DEGREES °C
4.5
FIGURE 18. tWDO VS. VOLTAGE/TEMPERATURE (WD1, 0 = 1, 0)
205
-40
3.8
VOLTAGE
TEMPERATURE
TIME (MS)
3.8
VOLTAGE
FIGURE 15. VCC SUPPLY CURRENT VS. TEMPERATURE (ISB)
VOLTAGE
25°C
1.5
1.1
0
-40
-40°C
1.6
1.7
2.4
3.1
3.8
4.5
5.2
VOLTAGE
FIGURE 20. tWDO VS. VOLTAGE/TEMPERATURE (WD1, 0 0 = 0, 1)
Page 18 of 22
X5163, X5165
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
August 13, 2015
FN8128.4
CHANGE
- Ordering Information Table on page 2.
- Added Revision History beginning with Rev 1.
- Added About Intersil Verbiage.
- Updated POD MDP0027 to latest revision changes are as follow:
Added dimensions (INCHES) to table.
- Updated POD MDP0031 to latest revision changes are as follow:
Added dimensions (INCHES) to table.
- Updated POD M14.173 to most current version changes are as follow:
Updated drawing to remove table and added land pattern.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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Reliability reports are also available from our website at www.intersil.com/support
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All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8128 Rev 4.00
August 13, 2015
Page 19 of 22
X5163, X5165
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
NOTES:
Rev. M 2/07
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
FN8128 Rev 4.00
August 13, 2015
Page 20 of 22
X5163, X5165
Plastic Dual-In-Line Packages (PDIP)
E
D
A2
SEATING
PLANE
L
N
A
PIN #1
INDEX
E1
c
e
b
A1
NOTE 5
1
eA
eB
2
N/2
b2
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
INCHES
SYMBOL
PDIP8
PDIP14
PDIP16
PDIP18
PDIP20
TOLERANCE
A
0.210
0.210
0.210
0.210
0.210
MAX
A1
0.015
0.015
0.015
0.015
0.015
MIN
A2
0.130
0.130
0.130
0.130
0.130
±0.005
b
0.018
0.018
0.018
0.018
0.018
±0.002
b2
0.060
0.060
0.060
0.060
0.060
+0.010/-0.015
c
0.010
0.010
0.010
0.010
0.010
+0.004/-0.002
D
0.375
0.750
0.750
0.890
1.020
±0.010
E
0.310
0.310
0.310
0.310
0.310
+0.015/-0.010
E1
0.250
0.250
0.250
0.250
0.250
±0.005
e
0.100
0.100
0.100
0.100
0.100
Basic
eA
0.300
0.300
0.300
0.300
0.300
Basic
eB
0.345
0.345
0.345
0.345
0.345
±0.025
L
0.125
0.125
0.125
0.125
0.125
±0.010
N
8
14
16
18
20
Reference
NOTES
1
2
Rev. C 2/07
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
FN8128 Rev 4.00
August 13, 2015
Page 21 of 22
X5163, X5165
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
1
3
5.00 ±0.10
SEE
DETAIL "X"
8
14
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3
1
0.20 C B A
7
B
0.65
0.09-0.20
TOP VIEW
END VIEW
1.00 REF
0.05
H
C
0.90 +0.15/-0.10
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06
0.10 C
0.10
GAUGE
PLANE
0.25
5
0°-8°
0.05 MIN
0.15 MAX
CBA
SIDE VIEW
0.60 ±0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
FN8128 Rev 4.00
August 13, 2015
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
Page 22 of 22