X60003BIG3-41

DATASHEET X60003 FN8137 Rev 5.00 September 1, 2015 Precision SOT-23 FGA™ Voltage References The X60003 FGA™ voltage references is a very high precision analog voltage reference fabricated in Intersil’s proprietary Floating Gate Analog technology, which achieves superior levels of performance when compared to conventional band gap, buried zener, or XFET™ technologies. Features FGA™ voltage references feature very high initial accuracy, very low temperature coefficient, excellent long term stability, low noise and excellent line and load regulation, at the lowest power consumption currently available. These voltage references enable advanced applications for precision industrial and portable systems operating at significantly higher accuracy and lower power levels than can be achieved with conventional technologies. • Low temperature coefficient (B grade) . . . . . . . . . 10ppm/°C Applications • 5kV ESD (human body model) • Reference output voltage . . . . . . . . . . . . . . . . 4.096V, 5.000V • Initial accuracy . . . . . . . . . . . . . . . . . . . . . . . ±1.0mV (B grade) • Ultra low power supply current . . . . . . . . . . . . . . . . . . . . 500nA • 10mA source and sink current capability • Very low dropout voltage. . . . . . . . . . . . . . 100mV at No Load • Input voltage range - X60003-41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 9.0V - X60003-50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1V to 9.0V • Standard package . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ld SOT-23 • High resolution A/Ds and D/As • Temp range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C • Digital meters Related Literature • Calibration systems • V-F converters • Precision current sources • See AN1494, “Reflow and PC Board Assembly Effects on Intersil FGA References” • Precision regulators • See AN1533, “X-Ray Effects on Intersil FGA References” • Precision oscillators • Smart sensors • Strain gage bridges • Threshold detectors • Battery management systems • Servo systems 800 HIGH 700 IN (nA) 600 TYP 500 400 LOW 300 200 4.0 5.0 6.0 7.0 8.0 9.0 VIN (V) FIGURE 1. IIN vs VIN (3 UNITS) FN8137 Rev 5.00 September 1, 2015 Page 1 of 17 X60003 Available Options Pin Configuration VOUT OPTION (V) INITIAL ACCURACY (mV) TEMPCO. (ppm/°C) X60003BIG3Z-41T1 4.096 ±1.0 10 X60003CIG3Z-41T1 4.096 ±2.5 20 X60003DIG3Z-41T1 (No longer available or supported) 4.096 ±5.0 20 X60003BIG3Z-50T1 5.000 ±1.0 10 X60003CIG3Z-50T1 5.000 ±2.5 20 X60003DIG3Z-50T1 5.000 ±5.0 20 PART NUMBER X60003 (3 LD SOT-23) TOP VIEW VIN 1 3 GND VOUT 2 Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 1 VIN 2 VOUT Voltage Reference Output Connection 3 GND Ground Connection Power Supply Input Connection Typical Application Circuit VIN = +5.0V 0.1µF VIN 10µF VOUT 0.001µF X60003 GND REF IN SERIAL BUS ENABLE SCK SDAT 16 TO 24-BIT A/D CONVERTER FIGURE 2. TYPICAL APPLICATION PRECISION 16 TO 24-BIT A/D CONVERTER FN8137 Rev 5.00 September 1, 2015 Page 2 of 17 X60003 Ordering Information PART NUMBER (Notes 2, 3) PART MARKING (Note 4) VOUT (V) GRADE (°C) TEMP. RANGE (°C) 4.096 ±1.0mV, 10ppm -40 to +85 3 Ld SOT-23 P3.064 PACKAGE (RoHS Compliant) PKG. DWG # X60003BIG3Z-41T1 (Note 1) APF X60003CIG3Z-41T1 (Note 1) APH ±2.5mV, 20ppm -40 to +85 3 Ld SOT-23 P3.064 X60003DIG3Z-41 (No longer available, recommended replacement: X60003BIG3Z-41T1) APJ ±5.0mV, 20ppm -40 to +85 3 Ld SOT-23 P3.064 X60003DIG3Z-41T1 (Note 1) (No longer available, recommended replacement: X60003BIG3Z-41T1) APJ ±5.0mV, 20ppm -40 to +85 3 Ld SOT-23 P3.064 X60003BIG3Z-50T1 (Note 1) APG ±1.0mV, 10ppm -40 to +85 3 Ld SOT-23 P3.064 X60003CIG3Z-50T1 (Note 1) API ±2.5mV, 20ppm -40 to +85 3 Ld SOT-23 P3.064 X60003DIG3Z-50T1 (Note 1) APK ±5.0mV, 20ppm -40 to +85 3 Ld SOT-23 P3.064 X60003-EVALZ Evaluation Board 5.00 NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for X60003. For more information on MSL please see techbrief TB363. 4. The part marking is located on the bottom of the part FN8137 Rev 5.00 September 1, 2015 Page 3 of 17 X60003 Absolute Voltage Ratings Thermal Information Max Voltage Applied VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +10V VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +5.1V ESD Ratings Human Body Model (Tested to JESD22-A114) . . . . . . . . . . . . . . . . . . 5kV Machine Model (Tested to JESD22-A115) . . . . . . . . . . . . . . . . . . . . . 500V Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA JC (°C/W) Thermal Resistance (Typical) JA (°C/W) 3 Lead SOT-23 (Notes 6, 7) . . . . . . . . . . . . . . 275 110 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+107°C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Environmental Operating Conditions Temperature Range (Industrial) . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Recommended Operating Conditions X-Ray Exposure (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mRem CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA NOTES: 5. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 12. 6. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. For JC, the “case temp” location is taken at the package top center. 8. Post-reflow drift for the X60003 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards. The design engineer must take this into account when considering the reference voltage after assembly. Electrical Specifications Operating Conditions: IOUT = 0mA, COUT = 0.001µF, TA = -40 to +85°C. Boldface limits apply over the operating temperature range, -40°C to +85°C. SYMBOL VOA IIN TC VOUT PARAMETER CONDITIONS VOUT Accuracy @ TA = +25°C MIN (Note 12) TYP -1.0 +1.0 mV X60003C -2.5 +2.5 mV X60003D -5.0 +5.0 mV 900 nA X60003B 10 ppm/°C X60003C 20 ppm/°C X60003D 20 ppm/°C 500 VN Output Voltage Noise 0.1Hz to 10Hz 30 ISC Short Circuit Current TA = +25°C 50 Electrical Specifications (X60003-41) the operating temperature range, -40°C to +85°C. SYMBOL VIN UNITS X60003B Supply Current Output Voltage Temperature Coefficient (Note 9) MAX (Note 12) µVP-P 80 mA VIN = 5.0, TA = -40°C to +85°C, unless otherwise specified. Boldface limits apply over PARAMETER CONDITIONS Input Voltage Range MIN (Note 12) TYP 4.5 VOUT Output Voltage VOUT/VIN Line Regulation +4.5V  VIN  +8.0V VOUT/IOUT Load Regulation Sourcing: 0mA  ISOURCE  10mA MAX (Note 12) UNITS 9.0 V 4.096 V 150 µV/V 10 50 µV/mA Sinking: -10mA  ISINK  0mA 20 100 µV/mA VOUT/TA Thermal Hysteresis (Note 10) T = -40°C to +85°C 150 ppm VOUT/t Long Term Stability (Note 11) TA = +25°C 50 ppm FN8137 Rev 5.00 September 1, 2015 Page 4 of 17 X60003 Electrical Specifications (X60003-50) the operating temperature range, -40°C to +85°C. SYMBOL VIN VIN = 6.5V, TA = -40°C to +85°C, unless otherwise specified. Boldface limits apply over PARAMETER CONDITIONS Input Voltage Range MIN (Note 12) TYP 5.1 MAX (Note 12) UNITS 9.0 V VOUT Output Voltage 5.000 V VOUT/VIN Line Regulation +5.5V  VIN  +8.0V VOUT/IOUT Load Regulation Sourcing: 0mA ISOURCE  10mA Sinking: -10mA  ISINK  0mA VDO Dropout Voltage IOUT = 5mA, VOUT = -0.01% VOUT/TA Thermal Hysteresis (Note 10) T = -40°C to +85°C 100 ppm VOUT/t Long Term Stability (Note 11) TA = +25°C 45 ppm 150 µV/V 50 µV/mA 20 100 µV/mA 150 300 mV 10 NOTES: 9. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40°C to +85°C = +125°C. 10. Thermal Hysteresis is the change of VOUT measured at TA = +25°C after temperature cycling over a specified range, TA. VOUT is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For  TA = +125°C, the device under test is cycled from +25°C to +85°C to -40°C to +85°C. 11. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/sqrt(1kHrs). 12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. FN8137 Rev 5.00 September 1, 2015 Page 5 of 17 X60003 Typical Performance Curves (X60003-41) VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified. 800 600 HIGH 700 550 TYP IN (nA) IN (nA) 600 500 500 +85°C 450 +25°C 400 LOW 200 4.0 5.0 6.0 7.0 8.0 -40°C 400 300 350 9.0 4.0 5.0 6.0 VIN (V) VOUT (V) (NORMALIZED TO 4.096V AT VOUT) LOW 4.0970 VOUT (V) 4.0965 4.0960 4.0955 HIGH 4.0950 4.0945 4.0940 -40 TYP -15 8.0 9.0 FIGURE 4. IIN vs VIN FIGURE 3. IIN vs VIN (3 UNITS) 4.0975 7.0 VIN (V) 10 35 TEMPERATURE (°C) 4.0967 UNIT 2 4.0965 UNIT 1 4.0963 4.0961 UNIT 3 4.0959 4.0957 4.0955 4.5 85 60 4.0969 FIGURE 5. VOUT vs TEMPERATURE NORMALIZED TO +25°C (3 UNITS) 5.0 5.5 6.0 6.5 7.0 VIN (V) 7.5 8.0 8.5 FIGURE 6. LINE REGULATION (3 UNITS)  VOUT (µV) (NORMALIZED TO VIN = 5.0V) 350 300 -40°C 250 +25°C 200 150 100 +85°C 50 0 -50 -100 4.5 5.0 5.5 6.0 6.5 7.0 VIN (V) 7.5 8.0 8.5 9.0 FIGURE 7. LINE REGULATION OVER-TEMPERATURE FN8137 Rev 5.00 September 1, 2015 Page 6 of 17 9.0 X60003 Typical Performance Curves (X60003-41) VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued) CL = 0nF 200mV/DIV 200mV/DIV CL = 1nF  VIN = -500mV  VIN = 500mV  VIN = -500mV 500µsec/DIV 500µsec/DIV FIGURE 8. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD FIGURE 9. LINE TRANSIENT RESPONSE, 0.001µF LOAD CAPACITANCE 0 0.30 +85°C NO LOAD -10 0.20 -20 -40°C 1nF LOAD -40 10nF LOAD -50 -60  VOUT (mV) -30 PSRR (dB)  VIN = 500mV -70 -80 100nF LOAD 0.10 0.00 +25°C -0.10 -0.20 -90 -100 1 10 100 1k 10k 100k -0.30 -20 1M -15 FIGURE 10. PSRR vs CAP LOAD 0 5 10 15 CL = 1nF IL = -50µA IL = 50µA 100µsec/DIV FIGURE 12. LOAD TRANSIENT RESPONSE 200mV/DIV 50mV/DIV -5 FIGURE 11. LOAD REGULATION CL = 1nF FN8137 Rev 5.00 September 1, 2015 -10 OUTPUT CURRENT (mA) SINKING SOURCING FREQUENCY (Hz) IL = -10mA IL = 10mA 500µsec/DIV FIGURE 13. LOAD TRANSIENT RESPONSE Page 7 of 17 20 X60003 Typical Performance Curves (X60003-41) VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued) 200 6 5 4 1nF LOAD 150 VOUT ZOUT () VIN AND VOUT (V) NO LOAD VIN 3 10nF LOAD 100 2 50 100nF LOAD 1 0 -1 1 3 5 TIME (ms) 7 9 0 11 1 10 100 1k 10k 100k FREQUENCY (Hz) FIGURE 15. ZOUT vs FREQUENCY FIGURE 14. TURN-ON TIME (+25°C) 10µV/DIV 0.1Hz TO 10Hz VOUT NOISE 10s/DIV FIGURE 16. BAND PASS FILTER WITH ZERO AT 0.1Hz AND 2 POLES AT 10Hz FN8137 Rev 5.00 September 1, 2015 Page 8 of 17 X60003 Typical Performance Curves (X60003-50) (VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified) 5.0003 125 100 50 +85°C +25°C 25  DVOUT (V) 75 0 -40°C -25 -50 6 5 7 VIN (V) 8 (NORMAILIZED TO 5V AT VIN = 6.5V  VOUT (V) (NORMAILIZED TO VIN = 6.5V) 150 5.0002 5.0001 UNIT 1 5.0000 UNIT 2 4.9999 4.9998 4.9997 9 UNIT 3 5.0 5.5 6.0 6.5 7.0 VIN (V) 7.5 8.0 8.5 9.0 FIGURE 18. LINE REGULATION (3 UNITS) FIGURE 17. LINE REGULATION 0.1Hz TO 10Hz VOUT NOISE 1.40 1.20 +85°C 0.80 0.60 0.40 +25°C 10µV/DIV VOUT (mV) 1.00 -40°C 0.20 0.00 -0.20 -0.40 -20 -15 SINKING -10 -5 0 5 10 15 20 OUTPUT CURRENT (mA) SOURCING FIGURE 19. LOAD REGULATION OVER TEMPERATURE 1s/DIV FIGURE 20. BAND PASS FILTER WITH ZERO AT 0.1Hz AND 2 POLES AT 10Hz 0 5.0025 UNIT 1 5.0020 5.0015 -20 UNIT 3 PSRR (dB) VOUT (V) UNIT 2 5.0000 4.9995 -40 10nF LOAD -50 -60 -70 4.9990 -80 4.9985 -90 4.9980 1nF LOAD -30 5.0010 5.0005 NO LOAD -10 -40 -15 10 35 60 TEMPERATURE (°C) FIGURE 21. VOUT vs TEMPERATURE (3 UNITS) FN8137 Rev 5.00 September 1, 2015 85 -100 100nF LOAD 1 10 100 1k 10k 10k FREQUENCY (Hz) FIGURE 22. PSSR vs CAP LOAD Page 9 of 17 1M X60003 Typical Performance Curves (X60003-50) (VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified) (Continued) CL = 0.001µF IIN = -10mA IIN = -50µA 100mV/DIV 500mV/DIV CL = 0.001µF IIN = +10mA IIN = +50µA 2ms/DIV 500µs/DIV FIGURE 23. 10mA LOAD TRANSIENT RESPONSE FIGURE 24. 50µA LOAD TRANSIENT RESPONSE CL = 0 200mV/DIV 200mV/DIV CL = 0.001µF VIN = -500mV VIN = 500mV VIN = -500mV 500µsec/DIV 500µsec/DIV FIGURE 26. LINE TRANSIENT RESPONSE FIGURE 25. LINE TRANSIENT RESPONSE 0.45 VIN TO VOUT DIFFERENTIAL (V) VIN = 500mV +85°C 0.40 0.35 +25°C 0.30 0.25 0.20 -40°C 0.15 0.10 0.05 0 0 2 4 6 8 10 OUTPUT CURRENT (SOURCING mA) FIGURE 27. MINIMUM VIN TO VOUT DIFFERENTIAL vs OUTPUT CURRENT FN8137 Rev 5.00 September 1, 2015 Page 10 of 17 X60003 Typical Performance Curves (X60003-50) (VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified) (Continued) 180 1nF LOAD 160 800 NO LOAD 140 10nF LOAD 100 80 600 +25°C +85°C 400 300 60 40 200 100nF LOAD 100 20 0 -40°C 500 IIN (nA) ZOUT (Ω) 120 700 1 10 100 1k 10k 0 100k 5.0 5.5 6.0 6.5 FREQUENCY (Hz) 900 8.5 9.0 9.5 6 LOW 800 VOUT = 5.0V 5 700 600 4 TYP VOUT (V) IIN (nA) 8.0 FIGURE 29. IIN vs VIN FIGURE 28. ZOUT vs FREQUENCY 500 HIGH 400 300 3 2 200 1 100 0 7.0 7.5 VIN (V) 5 6 7 8 9 0 0 10 4 2 VIN (V) 6 8 10 TIME (ms) FIGURE 30. IIN vs VIN (3 UNITS) FIGURE 31. TURN-ON TIME 7 6 UNIT 2 VOUT (V) 5 UNIT 3 4 UNIT 1 3 2 1 0 0 2 4 6 TIME (ms) 8 10 12 FIGURE 32. X60003 TURN-ON TIME (+25°C), 3 UNITS FN8137 Rev 5.00 September 1, 2015 Page 11 of 17 12 X60003 Applications Information FGA Technology The X60003 voltage references use the floating gate technology to create references with very low drift and supply current. Essentially the charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy, there are limitations in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. Handling and Board Mounting FGA references provide excellent initial accuracy and low temperature drift at the expense of very little power drain. There are some precautions to take to insure this accuracy is not compromised. Excessive heat during solder reflow can cause excessive initial accuracy drift, so the recommended +260°C max temperature profile should not be exceeded. Expect up to 1mV drift from the solder reflow process. FGA references are susceptible to excessive X-radiation like that used in PC board manufacturing. Initial accuracy can change 10mV or more under extreme radiation. If an assembled board needs to be X-rayed, care should be taken to shield the FGA reference device. Nanopower Operation Reference devices achieve their highest accuracy when powered up continuously, and after initial stabilization has taken place. The X60003 is the first high precision voltage reference with ultra low power consumption that makes it practical to leave power-on continuously in battery operated circuits. The X60003 consume extremely low supply current due to the proprietary FGA technology. Supply current at room temperature is typically 500nA which is 1 to 2 orders of magnitude lower than competitive devices. Application circuits using battery power will benefit greatly from having an accurate, stable reference which essentially presents no load to the battery. capacity. Absolute accuracy will suffer as the device is biased and requires time to settle to its final value, or, may not actually settle to a final value as power-on time may be short. VIN = +6V TO 9V 10µF VIN 0.01µF VOUT X60003 GND 0.001µF REF IN ENABLE SERIAL BUS SCK SDAT 12 TO 24-bit A/D CONVERTER FIGURE 33. BATTERY-POWERED DATA CONVERTER CIRCUITS Board Mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Obviously mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. Board Assembly Considerations FGA references provide high accuracy and low temperature drift but some PC board assembly precautions are necessary. Normal Output voltage shifts of 100µV to 1mV can be expected with Pb-free reflow profiles or wave solder on multi-layer FR4 PC boards. Precautions should be taken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. If x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. If large amounts of shift are observed, it is best to add an X-ray shield consisting of thin zinc (300µm) sheeting to allow clear imaging, yet block x-ray energy that affects the FGA reference. In particular, battery-powered data converter circuits that would normally require the entire circuit to be disabled when not in use can remain powered-up between conversions as shown in Figure 33. Data acquisition circuits providing 12 to 24-bits of accuracy can operate with the reference device continuously biased with no power penalty, providing the highest accuracy and lowest possible long term drift. Other reference devices consuming higher supply currents will need to be disabled in between conversions to conserve battery FN8137 Rev 5.00 September 1, 2015 Page 12 of 17 X60003 Special Applications Considerations If a device is expected to pass through luggage X-ray machines numerous times, it is advised to mount a 2-layer (minimum) PC board on the top, and along with a ground plane underneath will effectively shield it from 50 to 100 passes through the machine. Since these machines vary in X-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. Noise Performance and Reduction The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 30µVP-P. This is shown in the plot in the “Typical Performance Curves” on page 8 and 9. The noise measurement is made with a bandpass filter made of a 1-pole high-pass filter with a corner frequency at 0.1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz bandwidth is approximately 400µVP-P with no capacitance on the output, as shown in Figure 34. These noise measurements are made with a 2 decade bandpass filter made of a 1-pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10x the center frequency. Figure 34 also shows the noise in the 10kHz to 1MHz band can be reduced to about 50µVP-P using a 0.001µF capacitor on the output. Noise in the 1kHz to 100kHz band can be further reduced using a 0.1µF capacitor on the output, but noise in the 1Hz to 100Hz band increases due to instability of the very low power amplifier with a 0.1µF capacitance load. For load capacitances above 0.001µF, the noise reduction network shown in Figure 35 is recommended. This network reduces noise significantly over the full bandwidth. Figure 35 shows that noise is reduced to less than 40µVP-P from 1Hz to 1MHz using this network with a 0.01µF capacitor and a 2k resistor in series with a 10µF capacitor. FN8137 Rev 5.00 September 1, 2015 400 350 NOISE VOLTAGE (µVP-P) In addition to post-assembly examination, there are also other Xray sources that may affect the FGA reference long term accuracy. Airport screening machines contain X-rays and will have a cumulative effect on the voltage reference output accuracy. Carry-on luggage screening uses low level X-rays and is not a major source of output voltage shift, although if a product is expected to pass through that type of screening over 100 times it may need to consider shielding with copper or aluminum. Checked luggage X-rays are higher intensity and can cause output voltage shift in much fewer passes, so devices expected to go through those machines should definitely consider shielding. Note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. The leadframe for the device which is on the bottom also provides similar shielding. CL = 0 300 250 200 150 CL = 0.001µF 100 CL = 0.1µF 50 0 CL = 0.01µF AND 10µF + 2k 1 10 100 1k 10k 100k FIGURE 34. X60003 NOISE REDUCTION VIN = 6.5V 10µF VIN VO X60003 0.1µF GND 2k 0.01µF 10µF FIGURE 35. NOISE REDUCTION NETWORK Turn-On Time The X60003 device has ultra-low supply current and thus the time to bias-up internal circuitry to final values will be longer than with higher power references. Normal turn-on time is typically 7ms. This is shown in the graph, Figure 32. Since devices can vary in supply current down to 300nA, turn-on time can last up to about 12ms. Care should be taken in system design to include this delay before measurements or conversions are started. Temperature Coefficient The limits stated for temperature coefficient (tempco) are governed by the method of measurement. The overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures, take the total variation (VHIGH- VLOW), and divide by the temperature extremes of measurement (THIGH - TLOW). The result is divided by the nominal reference voltage (at T = +25°C) and multiplied by 106 to yield ppm/°C. This is the “Box” method for determining temperature coefficient. Page 13 of 17 X60003 Typical Application Circuits 6.0V TO 9.0V R = 200 2N2905 VIN VOUT 5.0V/50mA X60003 0.001µF GND FIGURE 36. PRECISION 5V, 50mA REFERENCE 5.5V TO 9.0V 0.1µF VIN 5.0V VOUT X60003 0.001µF GND VIN R1 = 5.0V - | VIN | VOUT -(IOUT) ; IOUT £ 10mA X60003-41 0.001µF GND VIN = -5.5V TO -9.0V -5.0V R1 FIGURE 37. ±5.0V DUAL OUTPUT, HIGH ACCURACY REFERENCE 5.5V TO 9.0V 0.1µF VIN VOUT X60003 + VOUT SENSE – LOAD GND FIGURE 38. KELVIN SENSED LOAD FN8137 Rev 5.00 September 1, 2015 Page 14 of 17 X60003 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE September 1, 2015 FN8137.5 Updated Ordering Information table on page 3. June 23, 2014 FN8137.4 Updated POD with following changes: In Detail A, changed lead width dimension from 0.13+/-0.05 to 0.085-0.19 Changed dimension of foot of lead from 0.31+/-0.10 to 0.38+/-0.10 In Land Pattern, added 0.4 Rad Typ dimension In Side View, changed height of package from 0.91+/-0.03 to 0.95+/-0.07 March 31, 2010 FN8137.3 Throughout- Converted to new format. Changes made as follows: Moved “Available Options”, “Pin Configuration” and “Pin Descriptions” to page 2 Added “Related Literature” on page 1 Added key selling feature graphic Figure 1 to page 1 Added MSL note to “Ordering Information” table on page 3 Added "Boldface limits apply..." note to common conditions of Electrical Specifications tables on page 4 and page 5. Bolded applicable specs. Added Note 12 to MIN MAX columns of all Electrical Specifications tables. Added Latch Up to “Absolute Voltage Ratings” on page 4 Added Junction Temperature to “Thermal Information” on page 4 Added JEDEC standards used at the time of testing for “ESD Ratings” on page 4 Added “Revision History” on page 15 and “About Intersil” on page 16 Updated package outline drawing on page 17 to new format by adding land pattern and moving dimensions from table onto drawing Removed retired devices from “Ordering Information” table on page 3 and “Available Options” on page 2 as follows: X60003BIG3-41T1 X60003CIG3-41T1 X60003DIG3-41T1 X60003BIG3-50T1 X60003CIG3-50T1 X60003DIG3-50T1 Added the following to page 4: "Environmental Operating Conditions X-Ray Exposure (Note 4)..........10mRem Note 4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 10. “Thermal Information” on page 4: Changed Theta JA from 202.70 to 375. Added Theta JC of 110 and applicable note (measured at top of package). In Figures 1, 3, 5 and 30, changed the color to Dark Blue (Unit 3), Black (Unit 2), and Dark Green (Unit 1). Changed name of Unit 3 to High, Unit 2 to Typ and Unit 1 to Low. Figure 4. Changed the colors to Dark Blue (85), Black (25), and Dark Green (-40). Figure 29. Increased the Y-axis to 800nA. Added “Handling and Board Mounting” on page 12 FN8137 Rev 5.00 September 1, 2015 Page 15 of 17 X60003 About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. © Copyright Intersil Americas LLC 2005-2017. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN8137 Rev 5.00 September 1, 2015 Page 16 of 17 X60003 Package Outline Drawing P3.064 3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE (SOT23-3) Rev 3, 3/12 2.92±0.12 4 DETAIL "A" C L 0.085 - 0.19 2.37±0.27 1.30±0.10 4 C L 0.950 0.435±0.065 0 - 8 deg. 0.20 M C TOP VIEW 10° TYP (2 plcs) 0.25 0.95±0.07 GAUGE PLANE 1.00±0.12 SEATING PLANE C SEATING PLANE 0.10 C 0.38±0.10 5 0.013(MIN) 0.100(MAX) SIDE VIEW DETAIL "A" (0.60) NOTES: (2.15) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Reference JEDEC TO-236. 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. Footlength is measured at reference to gauge plane. (1.25) (0.4 RAD TYP.) (0.95 typ.) TYPICAL RECOMMENDED LAND PATTERN FN8137 Rev 5.00 September 1, 2015 Page 17 of 17